СПОСОБ ИЗГОТОВЛЕНИЯ КОМПОНЕНТА УСТРОЙСТВА ОСАЖДЕНИЯ КАПЕЛЬ (ВАРИАНТЫ)

Изобретение относится к компоненту устройства осаждения капель и к пластине с соплами устройства осаждения капель. Способ формирования компонента пластины содержит операции: формирование тела из первого материала, причем указанное тело имеет периферию, формирование покрытия из второго материала вокруг указанного тела, так что покрытие простирается по меньшей мере на части периферии указанного тела, и формирование сопла, которое проходит сквозь указанное тело. Способ формирования пластины, при котором пластина с соплами ограничивается плоскостью пластины с соплами и содержит пластину, имеющую по меньшей мере один слой пластины с соплами и множество сопел, причем каждое сопло проходит сквозь пластмассу, помещенную внутри отверстия в пластине с соплами, содержит операции образования множества отдельных тел из полимерного материала, распределенных по плоскости пластины с соплами, и формирования по меньшей мере одного металлического слоя пластины с соплами путем нанесения методом гальванопластики ...

Farbstrahldruckkopf, Farbstrahldruckkopfpatrone, Farbstrahlauszeichnungsapparat und Verfahren zum Herstellen des Kopfes

Tintenstrahldruckkopf mit wirksamer Leiterweglenkung

SPRITZKOPF FUER EINEN TINTENSTRAHLDRUCKER MIT MEHREREN DUESEN

Verfahren zur Herstellung eines Farbstrahlaufzeichnungskopfes

Verfahren zum Haften einer Düsenplatte an einen Tintenstrahlkopf

Herstellungsverfahren für dreidimensionale Düsenplatten

Head chip method of manufacturing head chip liquid jet head and liquid jet apparatus

Method of forming ink jet nozzles

INK JET NOZZLE MANUFACTURE

A method of making an inkjet printhead

Method of manufacturing a component for droplet deposition apparatus

Ink jet head nozzle plate manufacturing method,ink jet head nozzle plate manufacuturing apparatus,ink jet head nozzle plate,ink jet head,and ink jet recording

Method of forming ink jet nozzles

Precision orifice nozzle devices for ink jet printing apparati and the process for their manufacture

A single or multi-orifice metal nozzle structure suitable for use in an ink jet printing system. The metallic nozzle member has at least one orifice extending therethrough, the orifice including a cylindrical portion, adjacent the outlet face of said nozzle, having a height ranging from 0.25 to 5 times its diameter and at least one frustoconical section divergent toward the face opposite the outlet face and communicating with the cylindrical portion. Where the metal nozzle is a multi-orifice metal nozzle, each frustoconical section communicates with a groove disposed in the face opposite the outlet face. The multi-orifice metal nozzle is prepared by grooving a metal plate with at least one groove, punching a plurality of frustoconical sections into the groove member and then forming a cylindrical portion into each frustoconical section and through the plate member.

Improvements in or relating to orifice plates for jet drop recorders

An orifice plate for a jet drop recorder is fabricated by plating techniques. It is formed throughout of a single, homogeneous material, such as nickel, for compatibility with the recorder ink, and is of sufficient thickness to provide adequate strength. The orifices are open on both sides for easy cleaning.

HEAD ELEMENT AND PROCEDURE FOR THE INK-REJECTING TREATMENT

LASER MILLING PROCEDURE AND SYSTEM

INK RADIATION PRINT HEAD MANUFACTURING PROCESS

PROCEDURE FOR THE PRODUCTION OF AN INJECTOR PLATE OF AN INK JET PRINTER

MORE HYDROPHOBIER AND INJECTOR PLATE OLEOPHOBIERFILMBEDECKTE

INJECTOR PLATE MANUFACTURING PROCESS FOR AN INK RADIATION PRINT HEAD OF HIGH ONES DENSITY

PROCEDURE FOR THE PRODUCTION OF CONICAL LINEAR OPENINGS IN COMPLETELY ASSEMBLING INK RADIATION PRINT HEADS.

MANUFACTURING PROCESS OF A COLOR RADIATION RECORDING HEAD AND COLOR RADIATION RECORDING HEAD

PROCEDURE FOR THE PRODUCTION OF AN INK RADIATION RECORDING HEAD

DROPLET PRODUCER FOR AN INK RADIATION PRINT HEAD WITH CONTINUOUS CURRENT

INK JET HEAD AND ITS MANUFACTURE METHOD

Improved aperture plate and methods for its construction and use

MAKING ORIFICE PLATES

SOLID METAL ORIFICE PLATE FOR A JET DROP RECORDER

SOLID METAL ORIFICE PLATE FOR A JET DROP RECORDER An orifice plate for a jet drop recorder is fabricated by plating techniques. It is formed throughout of a single, homogeneous material, such as nickel, for compatibility with the recorder ink, and is of sufficient thickness to provide adequate strength. The orifices are open on both sides for easy cleaning.

NOZZLE PLATE GEOMETRY FOR INK JET PENS AND METHOD OF MANUFACTURE

A nozzle plate suitable for use in an ink jet printer and method of manufacturing this plate, which includes forming a plurality of grooves or serrations in the interior orifice bore surfaces of the plate. These grooves or serrations may advantageously be electroformed replications of a sculptured photoresist mask used in the electroforming process, and they serve to maximize the interior surface area of the orifice bores. This feature in turn serves to maximize frequency response, wettability, fluid flow rate, damping factor and capillarity of the nozzle plate relative to these parameters of a smooth surface orifice bore.

SEAL GLASS FOR NOZZLE ASSEMBLIES OF AN INK JET PRINTER

SEAL GLASS FOR NOZZLE ASSEMBLIES OF AN INK JET PRINTER A seal glass for unitizing an array of glass nozzles of an ink jet printer. The seal glasses are corrosion resistant to alkaline and acidic inks, and have low softening points, medium high expansivities and anneal points and are compatible with the nozzle glasses. FI9-78-064 ...

MOLDED ORIFICE PLATE ASSEMBLY FOR AN INK JET RECORDER AND METHOD OF MANUFACTURE

BFN 6828 MOLDED ORIFICE PLATE ASSEMBLY FOR AN INK JET RECORDER AND METHOD OF MANUFACTURE An orifice plate (10) for use in an ink jet recorder is integrally cast with an orifice plate holder(12), The orifice plate is formed having a flat, tapered bottom portion containing at least one row of orifices and has sidewalls extending outwardly from the bottom portion at acute angles from horizontal. The orifice plate holder (12) is formed from a castable plastic material which serves as a damping material. The holder is cast over and around the sidewalls (11) of the orifice plate to define, with the bottom portion of the orifice plate, a portion of an ink supply manifold. The damping action of the holder isolates the orifice plate (10) from spurious vibrations which could adversely affect the quality of printing from the ink jet recorder. Only the desired vibration from the stimulation transducer reaches the orifice plate. The mass and rigidity of the holder confines the traveling wave induced ...

INK JET NOZZLE STRUCTURE AND METHOD OF MAKING

INK JET NOZZLE STRUCTURE AND METHOD OF MAKING A nozzle array structure for pressurized fluid jets includes a uniform deposited membrane having an array of uniform small orifices therein overlaying a planar substrate having an array of larger aperture openings therethrough with approximately the same central axes as the orifice array. The method of making includes forming a substrate of a planar single crystal material oriented with the (100) planes parallel to the surface. A membrane comprising a uniform coating of an inorganic material is applied to the planar surface of the substrate. The substrate is preferentially etched from the rear surface to form an array of openings therein extending therethrough to the membrane. The membrane is then selectively eroded to form an array of uniform small orifices therein.

INK JET PRINTING HEAD, NOZZLE PLATE, AND MANUFACTURING METHOD THEREOF

... ▓▓▓ A nozzle plate of an ink jet printing head is formed so that its▓surface facing toward the ink drop discharge direction will have▓protruding parts around each of its nozzle holes. Each protruding part is▓formed in the shape of a circle that is concentric with a corresponding▓nozzle hole, and the outer edge of the protruding part is formed so as to▓have an appropriate slope. Due to the configuration of the nozzle plate,▓a wiper blade can make good contact with the surface (protruding parts)▓of the nozzle plate around the nozzle holes and ink around the nozzle▓holes can be cleaned successfully in wiping operation, thereby the ink▓drop discharge properties of the ink jet printing head can be stabilized▓and improved. Such a configuration of the nozzle plate is realized by▓electrodeposition without using a photoresist. Therefore, the shape of▓the nozzle hole is not affected by the coating status of the photoresist, the▓precision of a patterning image which is used for the exposure and▓development ...

METHOD OF FORMING VIADUCTS IN SEMICONDUCTOR MATERIAL

SOLID METAL ORIFICE PLATE FOR A JET DROP RECORDER

DISPENSING NOZZLE

Dispensing nozzle (15), comprising an essentially flat base member (17) having two essentially parallel surfaces. At least one fluid channel (16) is provided therein with an inlet opening and an outlet opening. The channel is oriented substantially perpendicularly in relation to the general extension of the base member (15). A surface surrounding at least one of said openings has a high wetting angle for the fluid to be dispensed.

METHOD OF MANUFACTURING A COMPONENT FOR DROPLET DEPOSITION APPARATUS

A nozzle plate component is manufactured by forming a layer of photoresist on a substrate and selectively exposing and removing material to define an array of distinct bodies. Nickel is then electroformed around the bodies to form a plate, with nozzles subsequently formed by ablation through the photoresist. The process can essentially be repeated to form a guard structure around each nozzle.

NOZZLE MEMBER INCLUDING INK FLOW CHANNELS

In one of the preferred embodiments, an inkjet printhead includes a nozzle member formed of a polymer material that has been laser-ablated to form inkjet orifices, ink channels, and vaporization chambers in the unitary nozzle member. The nozzle member is then mounted to a substrate containing heating elements associated with each orifice. In a preferred method, the orifices, ink channels, and vaporization chambers are formed using an Excimer laser.

A METHOD FOR MANUFACTURING AN ORIFICE PLATE FOR USE OF A LIQUID DISCHARGE, AN ORIFICE PLATE, A LIQUID DISCHARGE PROVIDED WITH SUCH ORIFICE PLATE, AND A METHOD FOR MANUFACTURING SUCH LIQUID DISCHARGE

A method for manufacturing an orifice plate used for a liquid discharge provided with discharge port for discharging liquid comprises the steps of preparing a non-conductive plate having recessed portion formed on the circumference of the flat portion corresponding to the discharge port, forming a first conductive material peelable from the non-conductive plate only in the recessed portion of the non-conductive plate, forming a plate member by plating the first conductive material with a second conductive material by electroforming method after the formation of the first conductive material, and obtaining the orifice plate having the discharge port by peeling off the plate member from the non-conductive plate. With the method thus arranged, it is possible to materialize the same precision as in the glass mask used for photolithography, and make the variation of orifice areas smaller for the formation of highly densified orifices.

Micromechanically manufactured nozzle for the production of reproducible droplets.

Nozzle plate, method for manufacturing nozzle plate, droplet discharge head, and droplet discharge apparatus

The present invention provides a nozzle plate, including: a first silicon layer; a glass layer; a second silicon layer provided between the first silicon layer and the glass layer, the second silicon layer being bonded to the glass layer; and a silicon oxide layer provided between the first silicon layer and the second silicon layer. A nozzle hole passing through the first silicon layer and discharging a droplet is formed. A channel passing through the silicon oxide layer and the second silicon layer and communicating with the nozzle hole is formed. A liquid chamber formed in the glass layer and communicating with the channel is formed.

LIQUID EJECTING HEAD AND METHOD OF MANUFACTURING LIQUID EJECTING HEAD

The ink-jet head of the ink jet head and method of manufacturing

Precision liquid dispenser e.g. for ink-jet printer has ejector plate and moulded polymer one-piece plate and spacer

La présente invention concerne un dispositif dispensateur de fluide comprenant une plaque d'éjection de fluide présentant au moins un orifice de sortie (112) du fluide et des moyens de commande de l'éjection de fluide reliés à la plaque par au moins un espaceur pour ménager un canal d'adduction du fluide vers l'orifice, caractérisé en ce qu'il comprend une pièce moulée (110) formant d'un seul tenant la plaque et l'espaceur. Application à aux imprimantes.

PROCESS AND APPARATUS OF MANUFACTURE Of a WHOLE OF TUBES FOR the Ink jet printers Of INK

COMPOSITION DE VERRE ET APPLICATION D'UN TEL MATERIAU A LA FABRICATION DE BUSES POUR IMPRIMANTE A PROJECTION D'ENCRE

Verre destiné à résister à la corrosion d'un fluide acide ou alcalin. La composition, en poids, de ce verre est formée d'au moins : SiO2 : 40-60 %; ZrO2 : 8-22,5 %; Na2 O : 6-17%; K2 O : :0-2,3 %; MgO : 0-6 %. La résistance à la corrosion de fluides alcalins est accrue par adjonction de B2 O3 , Al2 O3 , BaO, CaO, Li2 O et Cu2 O, celle vis-à-vis des fluides acides par adjonction de Al2 O3 , CaO et As2 O3 . Utilisable dans la formation des buses pour imprimantes à jet d'encre et des plaques destinées au support de telles buses.

Nozzle plate for inkjet head and method for producing the same, and treating fluid for inkjet head

METHOD FOR MANUFACTURING ELECTROSTATIC ATTRACTION TYPE LIQUID DISCHARGE HEAD, METHOD FOR MANUFACTURING NOZZLE PLATE, METHOD FOR DRIVING ELECTROSTATIC ATTRACTION TYPE LIQUID DISCHARGE HEAD, ELECTROSTATIC ATTRACTION TYPE LIQUID DISCHARGING APPARATUS, AND LIQUID DISCHARGING APPARATUS

Method of Manufacturing Microstructure, Method of Manufacturing Liquid Discharge Head, and Liquid Discharge Head

PROCESS FOR FABRICATING MICROSTRUCTURE, PROCESS FOR MANUFACTURING LIQUID EJECTION HEAD, AND LIQUID EJECTION HEAD

PURPOSE: To provide a costless, highly reliable and precise liquid ejection head and its manufacturing process. CONSTITUTION: A thermally crosslinked positive photosensitive material layer(first positive photosensitive material layer) and a second positive photosensitive material layer are formed on a substrate and then the second positive photosensitive material layer is patterned followed by patterning of the first positive photosensitive material layer. Subsequently, a negative resin for forming a channel wall is applied thereon and an ejection hole is made in the negative resin layer before the positive photosensitive material layer is removed. The first positive photosensitive material is an ionizing radiation decomposing positive resist of a methacryl-based copolymer composition containing methacrylic acid having methacrylic acid unit of 2-30 wt% and molecular weight of 5,000-50,000, and the second positive photosensitive material is an ionizing radiation decomposing positive resist ...

METHODS OF FABRICATING NOZZLE PLATES

A method of making flow feature structures for a micro-fluid ejection head. The method includes the steps of laser ablating a nozzle plate material to provide an elongate fluid chamber and fluid supply channel therein for connecting the fluid chamber with a fluid supply. The fluid chamber has a first length and a first width. An elongate nozzle hole is laser ablated in the nozzle plate material co-axial with the fluid chamber. The nozzle hole has entrance dimensions having a longitudinal axis dimension and a transverse axis dimension such that the longitudinal axis dimension is from about 1.1 to about 4.0 times the transverse axis dimension.

A PRINTHEAD AND METHOD OF FORMING SAME

A printhead and a method of manufacturing a printhead are provided. The printhead includes a polymeric substrate including a surface. Portions of the polymeric substrate define a liquid chamber. A material layer is disposed on the surface of the polymeric substrate. Portions bf the material layer define a nozzle bore. The nozzle bore is in fluid communication with the liquid chamber. Etching is performed. A mask (34) on a carrier (32) is laminated and delaminated after etching. Double etching is performed (fig 3).

METHOD FOR MANUFACTURING NOZZLE TIPS

The present invention is a method for manufacturing nozzle tips having a step in which discharge port lines are formed by emitting light beams by using a mask having a pattern that forms a discharge port line pattern for one nozzle tip by connecting discharge port line patterns with a connection part. The method for manufacturing nozzle tips is characterized in that the mask is configured such that the absolute value of the off-axis degree of telecentricity of the light beams emitted by the discharge ports closest to the connection part is smaller than that of the discharge ports furthest from the connection part in the array direction of the discharge ports of the discharge port lines.

INKJET RECORDING METHOD, INKJET RECORDING MEDIUM, AND AQUEOUS INK

An inkjet recording method including printing an image on a recording medium using an aqueous ink, wherein the recording medium includes a support containing a cellulose pulp, and a coat layer containing a pigment and a binder, and optionally containing a cationic additive in an amount of 0.1% or less in the total amount of the coat layer, which is formed in one or more layers on at least one surface of the support, wherein the recording medium has an outermost layer of the coat layer having a gloss at an angle of 60 degrees in accordance with JIS-ZS-8741 of 13 or less, and a centerline average roughness Ra of 0.2 µm to 2.5 µm at a cut-off value of 0.8 µm, and the aqueous ink contains coloring particles, a resin emulsion, water, and a wetting agent, the aqueous ink has a solid content of 3% by mass or more.

LASER PROCESSING METHOD AND LASER PROCESSING APPARATUS

An ultra-short pulse laser beam (107) output from a laser (105) is diffracted into a plurality of laser beams, and a nozzle plate (155) is scanned with the laser beams at a scanning speed of 40μm/s to 300μm/s. A placement position z of the nozzle plate with respect to a direction of an optical path of each laser beam is set to be -20 μm to +25μm, where z is 0 at a reference position at which a hole diameter of the nozzle is minimum, and z increases as the placement position is moved closer to a source of the laser beam and decreases as the placement position is moved away from the source of the laser beam.

METHOD FOR MAKING NOZZLE ARRAY FOR PRINTHEAD

A method for making a nozzle plate for an inkjet printer by laser ablating a nozzle plate material. The method includes the steps of determining a plurality of desired nozzle hole locations, ablating the area of the nozzle plate material surrounding the desired locations of the holes to a predetermined depth to provide a plurality of flow paths, ablating a nozzle through the full thickness of the nozzle plate material at each desired nozzle hole location, wherein unablated material surrounds each nozzle hole to provide a chamber, and ablating a throat region through a portion of the unablated material surrounding each nozzle hole so that each chamber is in flow communication with at least one flow path outside of the chamber.

PZT PRECURSOR SOLUTION, METHOD FOR PRODUCING PZT PRECURSOR SOLUTION, METHOD FOR PRODUCING PZT FILM, METHOD FOR PRODUCING ELECTROMECHANICAL TRANSDUCER ELEMENT, AND METHOD FOR PRODUCING LIQUID DISCHARGE HEAD

A PZT precursor solution is used for forming a PZT film by a sol-gel method. The PZT precursor solution includes a solvent; a component that forms a crystal of PZT by crystallization, the component being dissolved in the solvent; and an element that inhibits crystal growth of PZT, the element being dissolved in the solvent.

Nozzle plate, method of manufacturing nozzle plate, and image forming apparatus

The nozzle plate has a nozzle hole formed therethrough, the nozzle hole being defined in the nozzle plate with an inner surface including a first liquid-philic portion, a liquid-phobic portion and a second liquid-philic portion that are arranged in this order from a side near the nozzle mouth, the first and second liquid-philic portions having liquid-philicity, the liquid-phobic portion having liquid-phoblicity.

Liquid discharging head, liquid discharging unit, and device to discharge liquid

A liquid discharging head includes a nozzle plate including a nozzle substrate having a plurality of nozzle holes to discharge a liquid therethrough and a plurality of dimples on the discharging surface of the nozzle substrate to hold a liquid repellent material inside the plurality of dimples in a flowable manner and a liquid repellency film formed by the liquid repellent material on the discharging surface of the nozzle substrate.

Method for manufacturing a nozzle and an associated funnel in a single plate

A method for manufacturing a nozzle and an associated funnel in a single plate comprises providing the single plate, the plate being etchable; providing an etch resistant mask on the plate, the mask having a pattern, wherein the pattern comprises a first pattern part for etching the nozzle and a second pattern part for etching the funnel; covering one of the first pattern part and the second pattern part using a first cover; etching one of the nozzle and funnel corresponding to the pattern part not covered in step (c); removing the first cover; etching the other one of the nozzle and funnel; and removing the etch resistant mask.

MOLDED FLUID FLOW STRUCTURE WITH SAW CUT CHANNEL

In an embodiment, a fluid flow structure includes a micro device embedded in a molding. A fluid feed hole is formed through the micro device, and a saw defined fluid channel is cut through the molding to fluidically couple the fluid feed hole with the channel.

MICROFLUIDIC DEVICE HAVING IMPROVED EPOXY LAYER ADHESION

A microfluidic device includes a substrate; at least one inorganic layer provided on the substrate; a patterned epoxy layer formed over the at least one inorganic layer, the patterned epoxy layer including a wall that defines a location for a fluid in the microfluidic device; and an alkoxysilane material containing a primary or secondary amine for promoting adhesion between the at least one inorganic layer and the patterned epoxy layer.

Nozzle for inkjet printer head and method of manufacturing thereof

A nozzle of an inkjet printer which can improve straightness of an ink, and a method of manufacturing the same. Initially, a seed metal layer can be formed on a nozzle having an ink path and a liquid photocurable resin is filled therein. The photocurable resin is hardened by emitting a light including ultraviolet rays to a nozzle plate. Next, the seed metal layer is partially exposed in the path of the nozzle by partially etching the hardened photocurable resin, and a waterproof layer is formed on the seed metal layer. Also, the photocurable resin is put into a solvent and removed. Since the waterproof layer is evenly formed in the path of the nozzle to a predetermined depth, an ink can evenly fill therein. Accordingly, it is possible to improve straightness of the ink, thereby enabling accurate printing.

Self-aligned fabrication process for a nozzle plate of an inkjet print head

A self-aligned fabrication process for a nozzle plate of an inkjet print head. A substrate is provided with an activated device and a first film is formed on the substrate. Then, a second film is formed on the first film. Next, the second film is defined to form a convex portion corresponding to the activated device, exposing a part of the surface of the first film. Next, a third film is formed on the exposed surface of the first film, covering the convex portion. The third film on the convex portion is then removed. Next, the convex portion and the first film under the convex portion are etched to form a via.

Ejection device, inkjet head, method of forming nozzle for ejection device and method of manufacturing inkjet head

When a nozzle 21 with a stepwise cross-section, which is provided with a small cross-sectional nozzle portion 21a formed on the front side thereof and with a large cross-sectional nozzle portion 21b formed on the rear side thereof in a discharge direction, respectively, is formed by applying etching to a silicon wafer 200 for forming a nozzle plate 2, a resist film 210 is formed on a surface 200a of the silicon wafer 200, and patterning by half-etching and patterning by full-etching is applied to the resist film 210. Next, anisotropic-dry-etching is applied to the silicon wafer 200 by ICP discharge, thereby forming grooves at the full-etched portions. Next, the resist film at the half-etched portions is removed and anisotropic-dry-etching is applied to the portions from which the resist film is removed by ICP discharge. As a result, there can be simply formed on a monocrystalline silicon substrate an ink nozzle having a stepwise cross-section and further having an action, which is larger ...

Corrision resistant hydrophobic liquid level control plate for printhead of ink jet printer and process

Process for producing a corrosion-resistant liquid level control plate for the printhead of an aqueous ink jet printing machine. A corrosion-resistant metal alloy base is used, having an undersurface and an upper surface and having closely-spaced ink jet nozzles therethrough. Each of the nozzles has a micro-orifice at the undersurface surrounded by a lip area at the bottom of upwardly and outwardly tapered walls opening at the upper surface. The present process comprises forming the lip areas of metallic gold, encapsulating the upper surface of the metal alloy base including the gold lip areas and the tapered walls with metallic gold to form a corrosion-resistant, hydrophobic surface layer thereover. Thereafter the undersurface is coated with metallic chromium to render it hydrophilic. The gold coating preferably is reacted with a self assembled monolayer (SAM) of an organic sulfur compound such as hexadecylthiol or, more preferably, a cross-linkable SAM which is then cross-linked in situ ...

Method of manufacturing nozzle member, and work apparatus

The invention relates to a method of manufacturing a nozzle member, having the step of splitting light from a light source by amplitude splitting to form a plurality of illumination beams, and the step of illuminating a plurality of mask patterns formed on a mask with the corresponding split illumination beams so as to expose a workpiece via the mask patterns, and a work apparatus using the method.

Method for manufacturing orifice plate and liquid discharge head

A method for manufacturing an orifice plate with a plate material having a through hole arranged to become an orifice for discharging liquid comprises the steps of arranging a resin layer in a position corresponding to the through hole on the surface of a conductive substrate in a configuration corresponding to the through hole in a thickness corresponding at least to the lenght of the through hole, forming a metallic layer by means of electro-forming on the exposed surface of a portion of the conductive substrated corresponding to the plate material in a thickness corresponding to the thickness of the plate material in order to obtain the metallic layer in a state where the resin layer is filled in the through hole portion, applying water repellent resin to the surface of the metallic layer having the resin layer filled therein, peeling off the metallic layer from the conductive substrate together with the resin layer to obtain the plate material in a state where the through hole portion ...

Method of making an ink jet head involving in-situ formation of an orifice plate

A method of making an ink jet head with an orifice plate having an orifice extending therethrough for ink ejection involves the steps of adhering a photosensitive plate to the ink jet head to cover the outlet of a liquid passageway in the head, aligning a pattern mask with the ink passageway, exposing the photosensitive plate in-situ to radiation through the pattern mask, and removing portions of the photosensitive plate in accordance with the radiation pattern to form in the photosensitive plate an orifice aligned with the outlet.

LIQUID EJECTING HEAD AND LIQUID EJECTING APPARATUS

A liquid ejecting head includes: a nozzle plate provided with nozzle openings; an actuator unit including a flow channel formation substrate in which pressure generation chambers are provided and piezoelectric actuators that cause a change in the pressure of the liquid within respective pressure generation chambers; a communication substrate in which communication channels that communicate between the pressure generation chambers and corresponding nozzle openings are provided; a first case member that is a frame member affixed to the communication substrate so that the actuator unit is disposed within the first case member and that, along with the actuator unit, forms a manifold that holds the liquid to be supplied to the pressure generation chambers; and a second case member that is affixed to the first case member and in which is formed an introduction channel that sends the liquid from the exterior to the manifold.

LIQUID DISCHARGING HEAD, LIQUID DISCHARGING UNIT, AND DEVICE TO DISCHARGE LIQUID

A liquid discharging head includes a nozzle plate including a nozzle substrate having a plurality of nozzle holes to discharge a liquid therethrough and a plurality of dimples on the discharging surface of the nozzle substrate to hold a liquid repellent material inside the plurality of dimples in a flowable manner and a liquid repellency film formed by the liquid repellent material on the discharging surface of the nozzle substrate.

Print head with liquid channels having movable valves

In the prior art, ejection openings are formed of different materials having respective wettability levels Thus, ink may disadvantageously be drawn toward a more wettable material and ejected obliquely. Further, if ejection is carried out with a horizontally dripping liquid adhering to ejection opening edges and an edge of a roof plate forming a part of each ejection opening, the ink droplets may disadvantageously be ejected obliquely to the direction in which they are originally ejected. According to the present invention, the ejection openings are formed of the same material to prevent the ejecting direction from being affected by the difference in wettability. Further, a resin is raised from the ejection opening portion to prevent the horizontally dripping liquid adhering to an ejection opening periphery from contacting ejected ink droplets during ejection. As a result, the ejected ink droplets are not affected by the horizontally dripping liquid during ejection.

Method of manufacturing nozzle plate, method of manufacturing liquid ejection head, and matrix structure for manufacturing nozzle plate

The method manufactures a nozzle plate, and comprises: a patterned resist formation step of forming a patterned resist on a flat surface of a matrix substrate, the patterned resist having a shape corresponding to a diameter of nozzle holes in a nozzle plate to be formed, the patterned resist having a thickness corresponding to a length of the nozzle holes; a nozzle length regulating member placement step of placing the nozzle length regulating member having a flat surface onto the patterned resist in such a manner that the flat surface of the nozzle length regulating member faces the flat surface of the matrix substrate across the patterned resist; and a nozzle plate formation step of forming the nozzle plate by plating with the patterned resist between the flat surface of the matrix substrate and the flat surface of the nozzle length regulating member.

LIQUID EJECTION HEAD, RECORDING DEVICE, AND METHOD MANUFACTURING LIQUID EJECTION HEAD

A first channel member of a liquid ejection head includes a plurality of plates stacked through an adhesive. A first plate includes a second groove configuring the second common channel, and a plurality of first grooves which are communicated with the second groove from a wall surface of the second groove and individually configure a plurality of third individual channels. A second plate is bonded to a top surface of the first plate and configures an upper surface of the second common channel. The first plate includes an extension part which extends outward from the wall surface of the second groove between an end part position of one end of the second groove and a connection position closest to the end part position among connection positions of the plurality of first grooves with respect to the wall surface of the second groove.

THERMALLY STABLE OLEOPHOBIC LOW ADHESION COATING FOR INKJET PRINTHEAD FRONT FACE

A coating for an ink jet printhead front face, wherein the coating comprises a oleophobic low adhesion coating. When the oleophobic low adhesion coating is disposed on an ink jet printhead front face surface, jetted drops of ultra-violet gel ink or jetted drops of solid ink exhibit a contact angle greater than 45° and a low sliding angle of less than about 30°. In embodiments, the oleophobic low adhesion coating is thermally stable wherein the surface contact angle and sliding angle show little degradation after the coating is subjected to high temperatures in a range between 180° and 320° or thereabout and high pressures in a range between 100 psi and 400 psi or thereabout during printhead fabrication and manufacturing.

NOZZLE PLATE MANUFACTURING METHOD, NOZZLE PLATE, DROPLET DISCHARGE HEAD MANUFACTURING METHOD, DROPLET DISCHARGE HEAD, AND PRINTER

A nozzle plate manufacturing method that offers excellent protection against discharge liquid and that enables a nozzle plate having high nozzle-hole accuracy to be manufactured with good yield. The invention also provides a nozzle plate, a droplet discharge head manufacturing method, and a droplet discharge head. 111-. (canceled)12. A method for manufacturing a plate , the method comprising:forming a first etching mask on a first surface of a silicon substrate;forming a first depression in the first surface of the silicon substrate by a first etching;removing the first etching mask;forming a first liquid-resistant protective film on the silicon substrate, the first liquid-resistant protective film having liquid resistance;bonding a support substrate to the first surface of the silicon substrate, the support substrate supporting the silicon substrate;reducing the silicon substrate to a desired thickness from a second surface side opposite to the first surface;forming a second etching mask on the second surface of the silicon substrate;forming a second depression in the second surface of the silicon substrate by a second etching; anddetaching the support substrate from the silicon substrate.13. The method according to claim 12 , further comprising:forming a liquid repellent layer on the first liquid-resistant protective film, the liquid repellent layer having liquid repellency, andremoving a part of the first liquid-resistant protective film and a part of the liquid repellent layer.14. The method according to claim 13 , further comprising:forming a second liquid-resistant protective film on the silicon substrate, the second liquid-resistant protective film having liquid resistance.15. The method according to claim 12 , whereina thickness of the silicon substrate is reduced by grinding.16. The method according to claim 12 , whereinthe first depression and the second depression are formed by dry etching.17. The method according to claim 12 , whereinthe second ...

METHOD FOR MANUFACTURING LIQUID EJECTION HEAD

A method for manufacturing a liquid ejection head including providing a negative first photosensitive resin layer on the substrate, forming a pattern of the flow path by selectively exposing the first photosensitive resin layer, providing a negative second photosensitive resin layer on the first photosensitive resin layer, providing a negative third photosensitive resin layer on the second photosensitive resin layer, forming a pattern of the ejection port by selectively exposing the second and third photosensitive resin layers, developing the first, second, and third photosensitive resin layers, irradiating an activation energy line on at least the third photosensitive resin layer after the developing, and heat curing the first, second, and third photosensitive resin layers after the irradiating of the activation energy line.

LIQUID DISCHARGE HEAD, MANUFACTURING METHOD THEREFOR, AND RECORDING METHOD

A liquid discharge head comprising a silicon substrate; an insulating layer A formed on a first surface of the silicon substrate, a protective layer A that includes metal oxide and is formed on the insulating layer A, the structure that is formed on the protective layer A by direct contact with the protective layer A, includes organic resin, and forms a part of a flow path for liquid, and an element that is formed on a second surface of the silicon substrate on a side opposite to the first surface, and is configured to generate energy used for discharging the liquid.

Method of manufacturing a microscale nozzle

Method of manufacturing a microscale nozzle, comprising the steps of forming a microscale channel in the top surface of a substrate, said microscale channel comprising an inlet end and a nozzle-end, depositing a nozzle-forming layer in a section of the microscale channel, and removing material from the substrate at the nozzle-end of the microscale channel to expose at least a portion of said nozzle-forming layer. The manufactured microscale nozzle may be used for transferring a liquid sample form a microchip fluidic system into an external analytical device.

ELEMENT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

An element substrate includes a substrate including a supply port configured to supply liquid, and a discharge port forming member including a discharge port configured to discharge the liquid supplied from the supply port. The discharge port forming member includes a liquid flow path communicating between the discharge port and the supply port on a surface opposed to a surface where the discharge port is provided. The discharge port forming member includes thick film portions and thin film portions in a region where the liquid flow path is formed. The thick film portions are lined up in a first direction so as to sandwich the discharge port therebetween and thicker than an adjacent portion adjacent to the discharge port. The thin film portions are lined up in a second direction intersecting with the first direction so as to sandwich the discharge port therebetween and thinner than the adjacent portion.

Molded nozzle plate with alignment features for simplified assembly

An ink jet print head includes a molded nozzle plate, the molded nozzle plate further including molded die alignment features. The molded die alignment features can be registered to the apertures of the print head die.

Method to taylor mechanical properties on MEMS devices and nano-devices with multiple layer photoimageable dry film

A three-dimensional (“3D”) structure for handling fluids, a fluid handling device containing the 3D structure, and a method of making the 3D structure. The method includes providing a composite photoresist material that includes: (a) a first photoresist layer derived from a photoresist resin having a first chemical property selected from the group consisting of epoxide equivalent weight, aromatic content, and crosslink density and (b) at least a second photoresist layer derived from a photoresist resin having a second chemical property selected from the group consisting of epoxide equivalent weight, aromatic content, and crosslink density different from the first chemical property. The composite photoresist material is devoid of an adhesion promotion layer between layers of the composite photoresist material and the composite photoresist material has varying mechanical and/or physical properties through a thickness of the 3D structure.

Liquid ejection head

An ejection port includes a first ejection port that is an opening portion formed on an outer surface side of a recessed portion formed in an outer surface of a nozzle plate, a second ejection port positioned on a bottom surface side of the recessed portion, the second ejection port including an opening portion that is smaller than the first ejection port, and a plurality of protrusions that extend from an outer edge portion of the first ejection port towards a center portion of the second ejection port through the second ejection port, in which a distance between tip portions of the plurality of protrusions and the substrate is larger than a distance between an outer edge portion of the second ejection port and the substrate.

Nоzzlе plаtе, mеthоd оf mаnufасturing nоzzlе plаtе, аnd imаgе fоrming аppаrаtus

Тhе nоzzlе plаtе hаs а nоzzlе hоlе fоrmеd thеrеthrоugh, thе nоzzlе hоlе bеing dеfinеd in thе nоzzlе plаtе with аn innеr surfасе inсluding а first liquid-philiс pоrtiоn, а liquid-phоbiс pоrtiоn аnd а sесоnd liquid-philiс pоrtiоn thаt аrе аrrаngеd in this оrdеr frоm а sidе nеаr thе nоzzlе mоuth, thе first аnd sесоnd liquid-philiс pоrtiоns hаving liquid-philiсitу, thе liquid-phоbiс pоrtiоn hаving liquid-phоbliсitу.

Nоzzlе plаtе, mеthоd оf mаnufасturing nоzzlе plаtе, аnd imаgе fоrming аppаrаtus

Тhе nоzzlе plаtе hаs а nоzzlе hоlе fоrmеd thеrеthrоugh, thе nоzzlе hоlе bеing dеfinеd in thе nоzzlе plаtе with аn innеr surfасе inсluding а first liquid-philiс pоrtiоn, а liquid-phоbiс pоrtiоn аnd а sесоnd liquid-philiс pоrtiоn thаt аrе аrrаngеd in this оrdеr frоm а sidе nеаr thе nоzzlе mоuth, thе first аnd sесоnd liquid-philiс pоrtiоns hаving liquid-philiсitу, thе liquid-phоbiс pоrtiоn hаving liquid-phоbliсitу.

LIQUID JET HEAD, METHOD OF MANUFACTURING THE LIQUID JET HEAD AND IMAGE FORMING DEVICE

Laser ablated nozzle member for inkjet printhead

An inkjet printhead includes a nozzle member (16) formed of a polymer material that has been laser-ablated to form tapered inkjet orifices (17). The nozzle member (16) is then mounted to a substrate (28) containing heating elements (70), each associated with a single orifice (17). Vaporisation chambers and ink channels, providing fluid communication between an ink reservoir (12) and the orifices (17), are also formed by laser ablation. ...

LIQUID JET STRUCTURE, INK JET TYPE RECORDING HEAD AND PRINTER

An acoustic ink print head includes an array of individual emitters. Each of the emitters have a corresponding transducer with a lower electrode (18), a separate layer of a piezo-electric material (16) located on the lower electrode, and a separate upper (14) electrode provided on the upper surface of the piezo-electric layer. The upper and lower electrodes are connected to a source of conventionally modulated RF power. A dielectric layer is deposited on top of this structure and lenses (22) are etched into the top of the dielectric layer. The lenses focus energy generated by the transducer to a region of the upper surface (28) of a body of liquid located above the transducer. The lenses concentrate sound waves from the transducers thereby disturbing the surface and causing droplets (32) to be emitted. The print head is formed as an array of individual emitters. The upper electrodes (14) of the individual emitter array have varying surface areas dependent upon their location within a row ...

PERFORATED DISC, ESPECIALLY FOR INJECTION VALVES

MANUFACTURE OF MULTINOZZLE HEAD

PURPOSE: To obtain the captioned head by a method wherein wires are wound round a specific supporting member and, after being put together with a metal mold and hardened by the injection of resin, various kinds of specific treatment such as oxygen plasma etching processing are applied thereto, thereby minute orifices being formed with high accuracy on even a thick plate. CONSTITUTION: Wires 7 are continuously wound round the supporting member 1 through an intermediary of its guide part 2 and an injection metal mold 8 is laid on the member 1. Next, in both space parts 6 and 12 of 1 and 8 a substrate material 13 such as resin is filled up and hardened, being pulled out as a substrate material 14 with wires. Then, a ground surface 16 is formed by grinding one surface perpendicular to the wires 7 and etching is applied in an oxygen plasma environment to the surface 16, thereby the wires 7 being exposed as projections. Next, conductivity treatment is applied to the surface 17 of the substrate ...

COATING FOR INKJET PRINTHEAD FRONT FACE, INKJET PRINTHEAD AND PRINTER

PROBLEM TO BE SOLVED: To provide a coating for an inkjet printhead front face which reduces wetting and drooling of a UV or solid ink over the entire inkjet printhead front face. SOLUTION: The coating for the front face of the inkjet printhead consists of a low adhesion coating, wherein when the low adhesion coating is disposed on an inkjet printhead front surface, jetted liquid droplets of ultra-violet gel ink or jetted liquid droplets of solid ink exhibit a low sliding angle about 30° or less to a surface of the printhead front face. The low adhesion coating contains: a polymer or oligomer containing isocyanate functional group; a polymer or oligomer containing a hydroxyl functional group; a hydroxyl functionalized polymer or oligomer containing at least one polysiloxane unit; and optionally, a hydroxyl functionalized fluoro-crosslinking agent. COPYRIGHT: (C)2011,JPO&INPIT ...

孔付円板、特に噴射弁のための孔付円板並びに孔付円板を製造する方法

... 本発明による孔付円板は、流体、特に燃料のための完全な軸方向の貫通部が形成されていて、該貫通部が流入開口(36)と流出開口(38)と両開口の間に位置する少なくとも1つの通路(42)とから成っている、ことによって特徴付けられている。流入開口(36)と流出開口(38)とは、1平面への投影図で見て互いにいかなる箇所においても重ならないように、孔付円板(23)に配置されている。流入開口(36)に対する流出開口(38)のこのようなずれによて、媒体のS字形の流れ経過が生ぜしめられ、これによって媒体には、霧化を促進する乱流が印加される。孔付円板は特に、燃料噴射装置、ラッカノズル又はフリーズドライ法における噴射弁において使用するために適している。 ...

INK JET HEAD

PROBLEM TO BE SOLVED: To enhance durability by forming a coat layer on the circumferential fringe part of a nozzle hole on the surface of a metallic nozzle plate having a nozzle hole by thermal CVD using an organic metal gas containing a halogen element thereby suppressing the problem of thinning or choking of nozzle at the time of forming the coat layer. SOLUTION: A coat layer 350 is formed on the circumferential fringe part of a nozzle hole on the surface of a metallic nozzle plate 303 having a nozzle hole by thermal CVD using an organic metal gas containing a halogen element. The organic metal gas containing a halogen element being used for forming the coat layer 350 includes vinyl fluoride, vinylidene fluoride, tetrafluoro ethylene, fluorostyrene, fluoroalkyl acrylate, fluoroalkyl methacrylate, etc. According to the arrangement, the problem of thinning or choking of nozzle is suppressed at the time of forming the coat layer while stabilizing ink jet and enhancing durability. COPYRIGHT ...

ГОЛОВКА ДЛЯ СТРУЙНОЙ ПЕЧАТИ И СПОСОБ ЕЕ ИЗГОТОВЛЕНИЯ

В изобретении разработана головка для струйной печати, включающая элемент, снабженный эжекторным отверстием для выброса чернил, причем упомянутая головка для струйной печати дополнительно включает в себя водоотталкивающий слой, содержащий отвержденный продукт конденсированного продукта, полученного конденсацией гидролизуемого соединения силана, содержащего эпоксигруппу, и гидролизуемого соединения силана, содержащего перфторполиэфирную группу, на поверхности упомянутого элемента с той стороны, на которую выходит эжекторное отверстие. 3 н. и 13 з.п. ф-лы, 8 ил., 1 табл.

Method of manufacturing nozzle plate, liquid ejection head and image forming apparatus

The method of manufacturing a nozzle plate which includes a nozzle having a tapered section and a linear section includes the steps of: forming an etching stopper layer for stopping dry etching of a silicon substrate, on a first surface of the silicon substrate; forming a mask layer on a second surface of the silicon substrate reverse to the first surface; performing a first patterning process with respect to the mask layer so that an opening section is formed in the mask layer; carrying out the dry etching of the silicon substrate through the opening section in the mask layer so that the tapered section of the nozzle is formed in the silicon substrate; carrying out dry etching of the etching stopper layer through the opening section in the mask layer so that at least a part of the linear section of the nozzle is formed in the etching stopper layer; and removing the mask layer.

Ink ejection nozzle with thermal actuator coil

A printhead for an inkjet printer is disclosed. The printhead has ink nozzles formed on a print face of the printhead. Each ink nozzle has an ink chamber with an ink ejection port and an ink inlet port. A paddle device is arranged inside each chamber. Each ink nozzle further has a bi-layer thermal actuator coil with a fee end connected to the paddle device. Heating of the thermal actuator coil displaces the paddle device, causing ejection of an ink droplet through the ink ejection port.

Liquid ejecting head and liquid ejecting apparatus

A liquid ejecting head comprising: a pressure chamber substrate where pressure chambers that communicates with nozzle holes are provided, and a piezoelectric element including a first conductive layer, a piezoelectric material layer, and a second conductive layer, wherein the piezoelectric element has an overlap area that overlaps the pressure chamber, the first conductive layer, the piezoelectric material layer, and the second conductive layer, wherein the second conductive layers overlap a plurality of the pressure chambers continuously, wherein, the first conductive layer is provided in each of the overlap areas and has an end portion area at one end side of the overlap area in the longitudinal direction, and wherein a width of the end portion area gets narrow in the lateral direction as the end portion area directs to the end of the longitudinal direction.

Inkjet print head and method for manufacturing the same

An inkjet print head and a method for manufacturing the same are provided. The inkjet print head includes: an upper board having a pressure chamber; and a lower board including an upper silicon layer, an insulating layer, and a lower silicon layer, wherein the lower board includes a projection formed of the upper silicon layer and protruded into the interior of the pressure chamber in order to reduce the space of the pressure chamber, and a lower surface of the upper board and an upper surface of the lower silicon layer are fixed.

Inkjet recording method, and printed material

An inkjet recording method is provided that includes an image formation step of forming an image on a recording medium by discharging an ink composition containing a polymerizable compound and a polymerization initiator and having a surface tension at 25° C. in a range of 34.0 to 40.0 mN/m using an inkjet head having a nozzle plate with a face on the ink discharge side treated so as to have affinity for an ink, and a curing step of curing the ink composition by irradiating the discharged ink composition with actinic radiation. There is also provided a printed material recorded by the inkjet recording method.

Liquid ejection head and method for producing the same

A liquid ejection head includes a substrate having an energy-generating device configured to generate energy used for ejecting a liquid from an orifice; a transparent channel wall member forming an inner wall of a channel leading to the orifice; and an intermediate layer disposed between and in contact with a surface of the substrate and the channel wall member and having a refractive index different from a refractive index of the channel wall member. The intermediate layer has a first outer end surface forming contours of a symbol as viewed in a direction from the orifice toward the substrate and making a first angle with the surface of the substrate and a second outer end surface facing the channel and making a second angle with the surface of the substrate. The first angle is an obtuse angle. The second angle is smaller than the first angle.

Method for producing liquid ejecting recording head

A liquid ejecting recording head using a flow duct material which includes an oxetane resin composition that contains, as necessary components, an oxetane compound having at least one oxetanyl group in a molecule, and a cationic photopolymerization initiator.

Printhead assembly incorporating ink distribution assembly

A printhead assembly includes an ink distribution assembly including an ink distribution molding, the ink distribution molding including a plurality of first ducts; at least one printhead integrated circuit in fluid communication with the ink distribution assembly; and a rotary platen having at least three surface, each surface for providing one of a platen surface, capping portion, and a blotting portion. The ink distribution assembly further includes a plurality of second ducts acutely angled with respect to the plurality of first ducts, a plurality of transfer ports facilitating fluid communication between the plurality of first ducts and the plurality of second ducts, and a plurality of ink inlet ports facilitating fluid communication between an ink cassette and the plurality of first ducts.

Piezoelectric inkjet head structure

A piezoelectric inkjet head structure includes an upper cover plate, a lower cover plate, a piezoelectric actuating module, a nozzle plate and a seal layer. The piezoelectric actuating module includes an upper piezoelectric chip, a lower piezoelectric chip, a first electrode, a second electrode, a conductive layer and a plurality of flow channels. The entrances of the flow channels of the upper piezoelectric chip and the lower piezoelectric chip are separated from each other by the same spacing interval. The entrances of the flow channels of the upper piezoelectric chip and the entrances of the flow channels of the lower piezoelectric chip are arranged in a staggered form. During operation of the piezoelectric actuating module, ink liquid is introduced into the flow channels of the piezoelectric actuating module from the upper cover plate and the lower cover plate, and then ejected out of the nozzles.

Liquid discharge head and manufacturing method of the same

A liquid discharge head comprises: a liquid discharge head substrate including an element row in which a plurality of energy generating elements for generating thermal energy for use in discharging liquid are arranged; and a discharge port member corresponding to each of the plurality of energy generating elements, the discharge port members including a plurality of walls in contact with the liquid discharge head substrate to form a plurality of liquid chambers for storing liquid and a plurality of discharge ports which communicate with each of the plurality of the liquid chambers to discharge liquid with the thermal energy generated by the energy generating element; and a plurality of heat dissipating members corresponding to each of the plurality of the liquid chambers and having a first portion exposed to the liquid chamber and a second portion exposed to the atmosphere.

Method for forming an aperture and actuator layer for an inkjet printhead

A method enables multiple inkjet printhead dies to be manufactured by bonding a single wafer to a single polymer layer. Multiple die sites on the single wafer are arranged in a predetermined pattern that corresponds to the pattern in which a plurality of aperture arrays are arranged in the polymer layer. The die sites on the wafer and the aperture arrays in polymer layer are aligned, the wafer and polymer layer are bonded, and the bonded wafer and polymer layer are cut to form a plurality of inkjet printhead dies.

Method of compensating for dead nozzles in stationary pagewidth printhead

A method of compensating for a dead nozzle in a stationary pagewidth printhead. The method includes the steps of: (i) identifying the dead nozzle; (ii) selecting a functioning nozzle in a same nozzle row as the dead nozzle; and firing ink droplets from the selected functioning nozzle at a primary dot position associated with the dead nozzle.

Printhead integrated circuit with printable zone longer than nozzle row

A printhead integrated circuit (IC) for a stationary pagewidth printhead, includes nozzle rows extending along a longitudinal axis thereof. A length of a printable zone corresponding to the nozzle row is longer than a length of the nozzle row.

Printhead integrated circuit having common conductive track fused to nozzle plate

An inkjet printhead integrated circuit (IC) includes: a substrate having a drive circuitry layer; a plurality of nozzle assemblies disposed on an upper surface of the substrate and arranged in one or more nozzle rows extending longitudinally along the printhead IC; a nozzle plate extending across the printhead IC; and a conductive track fused to the nozzle plate which extends longitudinally along the printhead IC and parallel with the nozzle rows. The conductive track is connected to a common reference plane in the drive circuitry layer via a plurality of conductor posts extending between the drive circuitry layer and the conductive track.

Ink jet recording head and method of producing ink jet recording head

Provided is an ink jet recording head, including multiple ejection orifices for ejecting droplets to a recording medium, in which a normal of a plane formed of the following straight lines is tilted with respect to an axis line of each of the ejection orifices: a straight line obtained by connecting points, which are positioned on peripheries of the respective ejection orifices and are at shortest distances from a face plane, in a longitudinal direction of an ejection orifice array; and a straight line obtained by connecting points, which are positioned on the peripheries of the respective ejection orifices and are at longest distances from the face plane, in the longitudinal direction of the ejection orifice array.

Liquid ejection head and method of manufacturing the same

A liquid ejection head, wherein recessed portions are formed in an ejection face such that, where, in the one direction, a distance D 1 is a distance between (i) a one-side portion of an opening end of one recessed portion and (ii) an other-side portion of an opening end of another recessed portion adjacent to the one recessed portion on one side thereof and where a distance D 2 is a distance between (i) an other-side portion of the opening end of the one recessed portion and (ii) a one-side portion of an opening end of another recessed portion adjacent to the one recessed portion on the other side thereof, a large-and-small relationship of an average value of the distances D 1 , D 2 of a second recessed portion with respect to that of a first recessed portion is the same as a large-and-small relationship of a cross-sectional area of the first recessed portion with respect to that of the second recessed portion.

Nozzle plate holding device and method for manufacturing inkjet head

A nozzle plate holding device having a holding section which holds a nozzle plate arranged with a plurality of nozzles, and the nozzle plate holding device being used for bonding the nozzle plate, while the holding section holds the nozzle plate, onto a head chip arranged with a plurality of channels, wherein the holding section is configured to be capable of causing a distortion deformation of the nozzle plate in a direction that is parallel to a surface of the nozzle plate and crosses a length direction of the nozzle plate.

Protective coating for print head feed slots

A method of method of making a corrosion resistant print head die comprises creating a self-ionized plasma (SIP) of a coating material; establishing a bias on a print head die comprising a plurality of feed slots ( 40 ), each feed slot ( 40 ) comprising side wall surfaces ( 61 ); and causing the coating material plasma to be deposited on the surfaces to form a protective coating, wherein at least a portion of the coating material is deposited on at least a portion of the surfaces by resputtering. In some cases, the feed slots have an aspect ratio greater than 2. In some cases, the feed slot comprises at least one rib ( 41 ), each rib ( 41 ) comprising a top surface ( 68 ), two side surfaces ( 66 ), and an under surface ( 69 ), and the formed protective coating is deposited on the top surface ( 68 ), two side surfaces ( 66 ), and under surface ( 69 ) of each rib ( 41 ).

Micro-fluid ejection device and method for assembling a micro-fluid ejection device by a wafer-to-wafer bonding

A micro-fluid ejection device is assembled by wafer-to-wafer bonding at a temperature below about 150° C. a first silicon oxide layer of a first wafer, having flow features patterned in the first silicon oxide layer on an actuator chip in a first silicon substrate of the first wafer, to a second silicon oxide layer of a second wafer, defining a nozzle plate on a second silicon substrate of the second wafer. Nozzle holes are formed in the nozzle plate in alignment with actuator elements of the actuator chip of the first wafer either before or after bonding the first and second wafers together. The second silicon substrate of the second wafer is used as a handle and then removed from the silicon oxide layer of the second wafer after bonding the first and second wafers together.

Method for connecting two objects electrically

A groove, and a recess which communicates with the groove, are formed in a substrate. Next, a through hole which communicates with the groove is formed. Thereafter, a wire is formed on an upper surface of the substrate, and an individual electrode is arranged on a lower surface of the substrate. Further, a droplet of an electroconductive liquid is made to land on the recess, and the liquid is filled in the through hole via the groove. Next, the liquid filled in the groove, the recess, and the through hole is heated to harden. Further, the recess and the groove of the substrate are removed by cutting up to an area near the through hole. Accordingly, it is possible to connect electrically the connecting bodies arranged on both surfaces of the substrate by filling an electroconductive material in the through holes easily.

Printheads and method for assembling printheads

Disclosed is a printhead for a printer that includes a plurality of ejection chip units. Each ejection chip unit of the plurality of ejection chip units is configured to eject at least one fluid. The printhead further includes a plurality of supporting units. Each supporting unit of the plurality of supporting units is fluidly coupled with a corresponding ejection chip unit. The each supporting unit includes a plurality of trenches adapted to receive an adhesive to facilitate attachment of the each supporting unit with the corresponding ejection chip unit. Furthermore, the printhead includes a base unit fluidly coupled with the each supporting unit of the plurality of supporting units. The base unit is adapted to provide the at least one fluid to the each ejection chip unit through a corresponding to supporting unit. Further disclosed is a method for assembling the printhead.

Method of manufacturing a liquid jet head

Provided is a method of manufacturing a liquid jet head ( 1 ), the method including: a laminated substrate forming step (S 1 ) of forming a laminated substrate ( 4 ) by bonding a plurality of piezoelectric substrates ( 2 ), which are made of a high dielectric material and have side surfaces joined to each other, onto a base substrate ( 3 ) made of a low dielectric material; a groove forming step (S 3 ) of forming, in a top surface of the laminated substrate ( 4 ), a plurality of grooves ( 7 ) having a depth reaching to the base substrate ( 3 ) and arranged in parallel to a longitudinal direction of the joined side surfaces of the plurality of piezoelectric substrates ( 2 ), and removing the joined side surfaces when the plurality of grooves ( 7 ) are formed; and an electrode forming step (S 4 ) of forming drive electrodes ( 13 ) on side surfaces of the plurality of grooves ( 7 ).

Piezoelectric element, liquid ejecting head, and liquid ejecting apparatus

A piezoelectric element comprises a first electrode including platinum, a piezoelectric layer disposed above the first electrode, made of a complex oxide having a perovskite structure containing at least bismuth, and a second electrode disposed above the piezoelectric layer. An oxide containing bismuth and platinum is disposed at the interface of the piezoelectric layer with the first electrode.

Method for fabricating fluid ejection device

Disclosed is a method for fabricating a fluid ejection device. The method includes forming a drive circuitry layer on a substrate. The method further includes fabricating at least one fluid ejection element on the substrate. Furthermore, the method includes forming at least one slot within a top portion of the substrate, and forming at least one fluid feed trench within a bottom portion of the substrate. Each fluid feed trench of the at least one fluid feed trench is in fluid communication with one or more slots of the at least one slot. Additionally, the method includes laminating a flow feature layer and a nozzle plate over the substrate having the at least one slot and the at least one fluid feed trench formed therewithin. Further disclosed is a fluid ejection device fabricated using the aforementioned to method.

Ejection devices for inkjet printers and method for fabricating ejection devices

Disclosed is an ejection device for an inkjet printer that includes an ejection chip having a substrate and at least one fluid ejecting element. The ejection device further includes a fluidic structure configured over the ejection chip. The fluidic structure includes a nozzle plate composed of an organic material and includes a plurality of nozzles. The fluidic structure further includes a flow feature layer configured in between the ejection chip and the nozzle plate. The flow feature layer is composed of an organic material and includes a plurality of flow features. Furthermore, the fluidic structure includes a liner layer encapsulating the nozzle plate. The liner layer further at least partially encapsulates each flow feature of the plurality of flow features. The liner layer is composed of an inorganic material. Further disclosed is a method for fabricating the ejection device.

Ink-jet recording head, recording element substrate, method for manufacturing ink-jet recording head, and method for manufacturing recording element substrate

An ink-jet recording head includes a plurality of recording element substrates each having an ejection pressure generating element configured to generate pressure for ejecting ink from an ink discharge port. The plurality of recording element substrates each include a first surface on which the corresponding ejection pressure generating element is disposed and a second surface, serving as an end surface intersecting with the first surface, being at least partially formed by etching.

Handheld imaging device with image processor provided with multiple parallel processing units

A handheld imaging device includes an image sensor for sensing an image; a micro-controller integrating therein a dedicated image processor for processing the sensed image, a bus interface, and an image sensor interface; and a plurality of processing units connected in parallel by a crossbar switch, the plurality of processing units provided within the micro-controller to form a multi-core processing unit for the processor. The image sensor interface provides communication between the micro-controller and the image sensor. The bus interface provides communication between the micro-controller and devices external to the micro-controller other than the image sensor.

Handheld imaging device with multi-core image processor integrating image sensor interface

A handheld imaging device includes an image sensor for sensing an image; a processor for processing the sensed image; a multi-core processing unit provided in the processor, the multi-core processing unit having a plurality of processing units connected in parallel by a crossbar switch; and an image sensor interface for converting signals from the image sensor to a format readable by the multi-core processing unit, the image sensor interface sharing a wafer substrate with the processor. A transfer of data from the image sensor interface to the plurality of processing units is conducted entirely on the shared wafer substrate.

Handheld imaging device with vliw image processor

A handheld imaging device includes an image sensor for sensing an image: a Very Long Instruction Word (VLIW) processor for processing the sensed image; a plurality of processing units provided in the VLIW processor, the plurality of processing units connected in parallel by a crossbar switch to form a multi-core processing unit for the VLIW processor; and an image sensor interface for receiving signals from the image sensor and converting the signals to a format readable by the VLIW processor, the image sensor interface sharing a wafer substrate with the VLIW processor. A transfer of data from the image sensor interface to the VLIW processor is conducted entirely on the shared wafer substrate.

Substrate structure for ejection chip and method for fabricating substrate structure

Disclosed is a substrate structure for an ejection chip that includes a first substrate layer, a second substrate layer disposed beneath the first substrate layer, and an intermediate layer configured between the first substrate layer and the second substrate layer. The substrate structure also includes a plurality of fluid channels configured within the second substrate layer. Further, the substrate structure includes a plurality of fluid ports configured within the first substrate layer. At least one fluid port of the plurality of fluid ports is configured in alignment with a corresponding fluid channel of the plurality of fluid channels. Furthermore, the substrate structure includes a plurality of slots configured within the intermediate layer such that the at least one fluid port is in fluid communication with the to corresponding fluid channel. Further disclosed is a method for fabricating the substrate structure and an ejection chip employing the substrate structure.

Camera system with color display and processor for reed-solomon decoding

A camera system including: a substrate having a coding pattern printed thereon and a handheld digital camera device. The camera device includes: a digital camera unit having a first image sensor for capturing images and a color display for displaying captured images to a user; an integral processor configured for: controlling operation of the first image sensor and color display; decoding an imaged coding pattern printed on a substrate, the printed coding pattern employing Reed-Solomon encoding; and performing an action in the handheld digital camera device based on the decoded coding pattern. The decoding includes the steps of: detecting target structures defining the extent of the data area; determining the data area using the detected target structures; and Reed-Solomon decoding the coding pattern contained in the determined data area.

Method of manufacturing liquid ejection head substrate

A liquid ejection head substrate including a silicon substrate having a liquid supply port as hollow and slots as through holes connecting the hollow and a liquid channel arranged opposite sides of the substrate. The method includes etching the substrate to form the hollow; forming a first resist on the hollow; etching the first resist on the bottom of the hollow under conditions of securing an equal etching rate to both the silicon substrate and the first resist; forming a second resist on the hollow; patterning the second resist into an etching mask; and etching the substrate using the etching mask to form the through holes.

Process and structure for inkjet printhead including a coverlay

A method and structure for an ink jet printhead aperture plate assembly which can be part of an ink jet printhead and an ink jet printer. The present teachings can include the use of a protective coverlay interposed between a press plate of a press and an anti-wetting coating on a polyimide layer which forms part of the aperture plate assembly. The coverlay can include a base material which has an elastic modulus which is at least a specified value. An embodiment of the present teachings can form an aperture plate assembly and an ink jet printhead having reduced dimpling and deformation around a nozzle opening in the aperture plate assembly.

Liquid discharge head and method of manufacturing the same

Provided is a method of manufacturing a liquid discharge head including: forming a first pattern for forming the flow path on the substrate; forming a first coating layer which covers the first pattern; forming a hole in the first coating layer, through which the first pattern is exposed; forming a second pattern for forming the flow path on the first coating layer, such that the second pattern contacts with the first pattern through the hole; forming a second coating layer for covering the second pattern; forming the discharge port in the second coating layer; and removing the first pattern and the second pattern to form the flow path.

Electromechanical transducer

An electromechanical transducer ( 1 ) has a pressurizing chamber ( 21 ) and a side-chamber ( 23 ) formed in a plate ( 11 ). On a driven film ( 13 ) forming the upper wall surface ( 21 a ) of the pressurizing chamber ( 21 ) and the side-chamber ( 23 ), a lower electrode ( 33 ), a driving member, and an upper electrode ( 35 ) are formed in this order. The driving member is composed of an operation section ( 31 p ) located over the pressurizing chamber ( 21 ), and an extended section ( 31 a ) extending from the operation section ( 31 p ) to over the side-chamber ( 23 ). The side-chamber ( 23 ) has a smaller width than the pressurizing chamber ( 21 ) in a second direction perpendicular to a first direction in which the side-chamber ( 23 ) is located beside the pressurizing chamber ( 21 ). The extended section ( 31 a ) of the driving member has a smaller width than the side-chamber ( 23 ) in the second direction.

Planar heater structures for ejection devices

Disclosed is a method for fabricating a planar heater structure for an ejection device. The method includes providing a substrate wafer having a plurality of plugs configured therewithin. The method also includes depositing and patterning a layer of a second metallic material over the substrate wafer, providing a layer of a dielectric material of a predetermined thickness over the patterned layer of the second metallic material, and conducting chemical mechanical polishing of the layer of the dielectric material to form a planarized top surface while exposing the patterned layer of the second metallic material. The method further includes cleaning the planarized top surface, depositing and patterning a resistor film over the planarized top surface, depositing one or more blanket films over the patterned resistor film, and patterning and etching the one or more blanket films. Further disclosed are planar heater structures and additional methods for fabricating the planar heater structures.

Methods for fabricating planar heater structures for ejection devices

Methods and apparatus teach a substrate wafer having a plurality of plugs configured there within. The method also includes depositing and patterning a layer of a second metallic material over the substrate wafer, providing a layer of a dielectric material of a predetermined thickness over the patterned layer of the second metallic material, and conducting chemical mechanical polishing of the layer of the dielectric material to form a planarized top surface while exposing the patterned layer of the second metallic material. The method further includes cleaning the planarized top surface, depositing and patterning a resistor film over the planarized top surface, depositing one or more blanket films over the patterned resistor film, and patterning and etching the one or more blanket films. Further disclosed are planar heater structures and additional methods for fabricating the planar heater structures.

Epoxy resin composition

An epoxy resin contains at least a bisphenol-F-type epoxy resin, a latent hardener, and a thixotropic agent. When the amount of the bisphenol-F-type epoxy resin is 100 parts by mass, the amount of the thixotropic agent is in the range of 3.0 parts by mass to 5.0 parts by mass.

Self cleaning printhead

A printhead has a nozzle plate, having an array of nozzles through which ink is expelled, a low adhesion, oleophobic polymer coating on a front face of the nozzle plate. A printer has a source of solid ink, a heater arranged to-heat the solid ink and convert it to liquid ink, and a printhead, the printhead having a nozzle plate, having an of nozzles through which ink is expelled, a low adhesion, oleophobic polymer coating on a front face of the nozzle plate, the coating selected to dispel the liquid ink prior to the liquid ink returning to solid form, and a wiper positioned to wipe the front face of the nozzle plate.

Method of fabricating an integrated orifice plate and cap structure

In an embodiment, a method of fabricating an integrated orifice plate and cap structure includes forming an orifice bore on the front side of a product wafer, coating side walls of the orifice bore with a protective material, grinding the product wafer from its back side to a final thickness, forming a first hardmask for subsequent cavity formation, forming a second hardmask over the first hardmask for subsequent descender formation, forming a softmask over the second hardmask for subsequent convergent bore formation, etching a latent convergent bore using the softmask as an etch delineation feature, etching a descender using the second hardmask as an etch delineation feature, and anisotropic etching of convergent bore walls and cavities using the first hardmask as an etch delineation feature.

Fluorinated Poly(amide-imide) Copolymer Printhead Coatings

Disclosed is an ink jet printhead comprising a plurality of channels, wherein the channels are capable of being filled with ink from an ink supply and wherein the channels terminate in nozzles on one surface of the printhead, the surface being coated with a coating composition comprising a fluorinated poly(amide-imide) copolymer.

Multi-film adhesive design for interfacial bonding printhead structures

In accordance with aspects of the present disclosure, a printhead assembly arranged to dispense ultraviolet curable ink or gel ink and method thereof is disclosed. The printhead assembly includes a plurality of functional plates stacked together; a first adhesive layer arranged between adjacent functional plates to provide bonding between the plates; and a second adhesive layer arranged between adjacent function plates to provide chemical resistance to the ultraviolet curable ink or the gel ink.

INKJET RECORDING HEAD AND METHOD OF MANUFACTURING INKJET RECORDING HEAD

An inkjet recording head includes: plural element substrates from which ink is ejected; and a flexible wiring substrate which includes a first wiring area, a second wiring area and a bending portion, the first wiring area including plural openings in which the element substrates are placed and which includes, in the periphery thereof, electrode terminals electrically connected to the element substrates, and the bending portion being bent between the first wiring area and the second wiring area. The flexible wiring substrate includes a slit which extends between the plural openings and reaches the bending portion or a position further than the bending portion from an end portion of the flexible wiring substrate on the side on which the first wiring area is provided, at a position opposite to the bending portion. 1. An inkjet recording head , comprising:plural element substrates from which ink is ejected; anda flexible wiring substrate which includes a first wiring area, a second wiring area and a bending portion, the first wiring area including plural openings in which the element substrates are placed, and which includes, in a periphery thereof, electrode terminals electrically connected to the element substrates, and the bending portion being bent between the first wiring area and the second wiring area,wherein the flexible wiring substrate includes a slit provided between the plural openings and extending to the bending portion, or a position further than the bending portion, from an end portion of the flexible wiring substrate on the side on which the first wiring area is provided, at a position opposite to the bending portion.2. The inkjet recording head according to claim 1 , further comprising a fixing member to which the plural element substrates and the first wiring area are fixed.3. The inkjet recording head according to claim 1 , wherein the slit formed in the first wiring area extends in a direction in which plural ejection ports provided on the element ...

MANUFACTURING METHOD OF LIQUID DISCHARGE HEAD

This invention is a manufacturing method of a liquid discharge head that includes a substrate having a plurality of discharge energy generating elements that generate energy that is utilized for discharging a liquid, and a discharge port forming member that constitutes a discharge port group including a plurality of discharge ports that discharge the liquid and flow paths that communicate with the discharge port group. The manufacturing method includes (1) disposing a photosensitive resin as material of the discharge port forming member on or above the substrate, and (2) forming an exposure pattern of the discharge port group using ultraviolet light in the photosensitive resin. In the aforementioned (2), the discharge port group is divided in a longitudinal direction and exposed, and the exposures are respectively performed so that regions in which there is a high degree of telecentricity face each other. 1. A manufacturing method of a liquid discharge head that includes a substrate having a plurality of discharge energy generating elements that generate energy that is utilized for discharging a liquid , and a discharge port forming member that comprises a discharge port group comprising a plurality of discharge ports that discharge the liquid and flow paths that communicate with the discharge port group , the method including:(1) disposing a photosensitive resin as a material of the discharge port forming member on or above the substrate; and(2) forming an exposure pattern of the discharge port group in the photosensitive resin using ultraviolet light;wherein, in the forming of (2), the discharge port group is divided in a longitudinal direction and exposed, and the exposures are respectively performed so that regions in which there is a high degree of telecentricity face each other.2. The manufacturing method of a liquid discharge head according to claim 1 , wherein claim 1 , in the forming of (2) claim 1 , the exposure pattern of the discharge port group is ...

LIQUID EJECTION HEAD AND PROCESS FOR PRODUCING THE SAME

A process for producing a liquid ejection head including a recording element substrate, an electrical wiring substrate provided with plural lead terminals, a support member provided with a concavity and a joining surface, and a sealant control wall arranged between a side surface of the recording element substrate and a side surface of the support member, the process including preparing a liquid ejection head in which the concavity and recording element substrate are mutually fixed, the joining surface and electrical wiring substrate are mutually fixed, and the lead terminals and connection terminal are mutually connected, and filling the sealant between the side surface of the recording element substrate and the side surface of the sealant control wall on the side of the recording element substrate followed by filling the sealant between a side surface of the sealant control wall on the side of the lead terminals and the lead terminals. 1. A process for producing a liquid ejection head that comprises a recording element substrate for discharging a liquid , an electrical wiring substrate connected to a connection terminal of the recording element substrate and provided with a plurality of lead terminals for transmitting a signal for ejecting the liquid , a support member provided with a concavity for supporting the recording element substrate and with a joining surface that is provided in an outer edge portion of the concavity and joined to the electrical wiring substrate , and a sealant control wall that is arranged between a side surface on a side on which the connection terminal of the recording element substrate is provided and a side surface of the support member extending crosswise from an end portion on a side of the joining surface on which side the lead terminals are arranged and extends along an arrangement direction of the plurality of lead terminals , the process comprising:preparing the liquid ejection head in which the concavity and the recording ...

Liquid ejecting head, liquid ejecting apparatus, and piezoelectric element

A liquid ejecting head contains a piezoelectric element having a piezoelectric layer and an electrode disposed on the piezoelectric layer, in which the piezoelectric layer contains a complex oxide containing bismuth, iron, barium, and titanium and having a perovskite structure, has a yield stress of 5.66 GPa or more, and has a Young's modulus of 114 GPa or more.

Fluid nozzle array

A method for fabricating a fluid nozzle array includes forming a circuitry layer onto a substrate, the substrate comprising a stopping layer disposed between a membrane layer and a handle layer, forming a fluid feedhole extending from a surface of the membrane layer to the stopping layer, and forming a fluid supply trench extending from a surface of the handle layer to the stopping layer. A fluid nozzle array includes a substrate including a membrane layer, a stopping layer adjacent to the membrane layer, a handle layer adjacent to the stopping layer, and a set of fluid chambers disposed on a surface of the membrane layer above and along a width of a fluid supply trench extending from a surface of the handle layer to the stopping layer.

MANUFACTURING METHOD OF INKJET HEAD

According to one embodiment, forming an electrode part, in which after an electrode is formed on an inner surface of a groove part formed in a substrate of the inkjet head, a smoothed film made of an inorganic material and having an average surface roughness of 0.6 μm or less is formed on a surface of the electrode, and then, an electrode protection film having a thickness of 1.0 μm or more is formed on a surface of the smoothed film; bonding a nozzle plate to an opening end face of a pressure chamber in the groove part by an adhesive after the electrode part is formed; and forming, in the nozzle plate, a nozzle communicating with the pressure chamber by laser machining after the nozzle plate is bonded. 1. A manufacturing method of an inkjet head , comprising:forming an electrode part, in which after an electrode is formed on an inner surface of a groove part formed in a substrate of the inkjet head, a smoothed film made of an inorganic material and having an average surface roughness of 0.6 μm or less is formed on a surface of the electrode, and then, an electrode protection film having a thickness of 1.0 μm or more is formed on a surface of the smoothed film;bonding a nozzle plate to an opening end face of a pressure chamber in the groove part by an adhesive after the electrode part is formed; andforming, in the nozzle plate, a nozzle communicating with the pressure chamber by laser machining after the nozzle plate is bonded.2. A manufacturing method of an inkjet head , comprising:forming an electrode part, in which an electrode having an average surface roughness of 0.6 μm or less is formed on an inner surface of a groove part formed in a substrate of the inkjet head, a smoothed film made of an inorganic material and having an average surface roughness of 0.6 μm or less is formed on a surface of the electrode, and then, an electrode protection film having a thickness of 1.0 μm or more is formed on a surface of the smoothed film;bonding a nozzle plate to an ...

LIQUID EJECTION HEAD AND METHOD OF MANUFACTURING SAME

A method of manufacturing a liquid ejection head includes the steps of () forming a recess in a second surface of a substrate to form a common supply port, () forming an etching mask, which specifies opening positions of independent supply ports, on a bottom surface of the common supply port, and () performing ion etching using plasma with the etching mask employed as a mask, thereby forming the independent supply ports. The etching mask has an opening pattern formed therein such that respective distances from an ejection energy generation element to openings of two independent supply ports adjacent to the ejection energy generation element on the first surface side of the substrate are equal to each other. 1. A method of manufacturing a liquid ejection head comprising a substrate including , in a first surface thereof , a plurality of ejection energy generation elements configured to generate energy for ejecting a liquid , and an orifice plate disposed on a first surface side of the substrate to form ejection orifice through which the liquid is ejected , and to define liquid flow passages communicating with the ejection orifices ,the substrate including a recess-shaped common supply port formed in a second surface thereof on an opposite side to the first surface, and a plurality of independent supply ports penetrating from a bottom surface of the common supply port to the first surface and communicating with the liquid flow passages,the ejection orifices being disposed above the ejection energy generation elements,two of the independent supply ports being disposed adjacent to each of the ejection energy generation elements for supply of the liquid to the relevant ejection energy generation element with the relevant ejection energy generation element disposed between the two independent supply ports,the method comprising the steps of:(1) forming a recess in the second surface of the substrate to form the common supply port,(2) forming an etching mask, which ...

METHOD OF FORMING INKJET NOZZLE CHAMBER

A method of forming an inkjet nozzle chamber includes the steps of: (a) depositing a layer of chamber material onto a substrate, the layer of chamber material defining a depth of the nozzle chamber; (b) removing a predetermined region of the layer of chamber material to define sidewalls of the nozzle chamber and an internal volume of the nozzle chamber; (c) depositing a sacrificial material to fill the internal volume contained within the sidewalls; (d) depositing a roof layer onto the sacrificial material and the sidewalls; (e) etching the roof layer to define a nozzle opening therein; and (f) removing the sacrificial material contained in the internal volume so as to form the nozzle chamber. 114-. (canceled)15. A method of forming an inkjet nozzle chamber , the method comprising the steps of:(a) depositing a layer of chamber material onto a substrate, the layer of chamber material defining a depth of the nozzle chamber;(b) removing a predetermined region from the layer of chamber material to define sidewalls of the nozzle chamber and an internal volume of the nozzle chamber;(c) depositing a sacrificial material to fill the internal volume contained within the sidewalls;(d) depositing a roof layer onto the sacrificial material and the sidewalls;(e) etching the roof layer to define a nozzle opening therein; and(f) removing the sacrificial material contained in the internal volume so as to form the nozzle chamber.16. The method of claim 15 , wherein the substrate is comprised of a silicon substrate having a layer of drive circuitry.17. The method of claim 15 , wherein the chamber material is comprised of silicon dioxide.18. The method of claim 17 , wherein the predetermined region of the layer of chamber material is removing by etching.19. The method of claim 15 , wherein the layer of chamber material has a depth of 4 to 20 microns.20. The method of claim 15 , wherein the layer of chamber material has a depth of 6 to 12 microns.21. The method of claim 15 , wherein ...

LIQUID EJECTION HEAD AND METHOD OF MANUFACTURING THE SAME

Provided is a liquid ejection head formed by performing bonding and fixing operations speedily and highly accurately when a recording element board is bonded to a supporting member, the liquid ejection head having a high liquid-landing accuracy and achieving a high printing quality. A method of manufacturing the liquid ejection head is also provided. 1. A method of manufacturing a liquid ejection head including a recording element board and a supporting member that supports the recording element board , the recording element board including an orifice through which a liquid is ejected and an energy generating element , which generates energy for ejecting the liquid , the method comprising the steps of:moving the recording element board supported by a holding member to a position above the supporting member to which a thermosetting adhesive has been applied; andconducting heat from the holding member to the supporting member and bringing the recording element board and the adhesive into contact with each other, while the recording element board is supported by the holding member, by bringing the recording element board and the supporting member closer to each other and bringing the holding member and the supporting member into contact with each other with a connection portion interposed therebetween.2. The method according to claim 1 , wherein after the recording element board and the adhesive are brought into contact with each other claim 1 , the holding member and the supporting member are brought into contact with each other with the connection portion interposed therebetween.3. The method according to claim 1 , wherein the holding member includes heat generating means and heat generated by the heat generating means is conducted to the adhesive through the connection portion and the supporting member.4. The method according to claim 1 , wherein the connection portion is a protrusion formed on the holding member.5. The method according to claim 4 , wherein the heat ...

Liquid ejection head and liquid ejection apparatus

A liquid ejection head includes a substrate in which a pressure generating chamber that communicates with a nozzle opening is formed; and a piezoelectric element having a piezoelectric layer, a first electrode that is formed on a surface of the piezoelectric layer on a side of the substrate so as to correspond to the pressure generating chamber, and a second electrode that is formed on a surface of the piezoelectric layer opposite to the side on which the first electrode is formed so as to extend over a plurality of the pressure generating chambers, wherein the second electrode is formed to extend to an outside of the pressure generating chamber in a longitudinal direction of the pressure generating chamber.

MANIFOLD ASSEMBLY FOR FLUID-EJECTION DEVICE

A manifold assembly for a fluid-ejection device having multiple-fluid type fluid-ejection printheads organized in a page-wide array includes a lower-most deck and an upper-most deck. The lower-most deck is to supply a first type of fluid and a second type of fluid to the fluid-ejection printheads. The first type of fluid and the second type of fluid are exterior-most fluids ejected by the fluid-ejection printheads in relation to a direction of media movement through the fluid-ejection device. The upper-most deck is to supply a third type of fluid and a fourth type of fluid to the fluid-ejection printheads. The third type of fluid and the fourth type of fluid are interior-most fluids ejected by the fluid-ejection printheads in relation to the direction of media movement through the fluid ejection device. 1. A manifold assembly for a fluid-ejection device having a plurality of multiple-fluid type fluid-ejection printheads organized in a page-wide array , comprising:a lower-most deck to supply a first type of fluid and a second type of fluid to the fluid-ejection printheads, the first type of fluid and the second type of fluid being exterior-most fluids ejected by the fluid-ejection printheads in relation to a direction of media movement through the fluid-ejection device; and,an upper-most deck to supply at least one of a third type of fluid and a fourth type of fluid to the fluid-ejection printheads, the third type of fluid and the fourth type of fluid being interior-most fluids ejected by the fluid-ejection printheads in relation to the direction of media movement through the fluid ejection device.2. The manifold assembly of claim 1 , wherein the lower-most deck and the upper-most deck are logically divisible into a plurality of modules organized along a direction perpendicular to the direction of media movement through the fluid-ejection device claim 1 ,each module to supply the first type of fluid, the second type of fluid, the third type of fluid, and the fourth ...

Method of manufacturing liquid ejection head and method of processing substrate

A liquid ejection head includes a substrate having an ejection energy generating element formed at a first surface side thereof, a common liquid chamber formed at a second surface of the substrate, and a liquid supply port extending from the bottom of the common liquid chamber to the first surface. The liquid ejection head is manufactured by preparing a substrate having the common liquid chamber formed at the second surface side, then arranging a material to be filled in the common liquid chamber, subsequently forming an aperture in the filled material as corresponding to the liquid supply port to be formed, and thereafter forming the liquid supply port by reactive ion etching, using at least the filled material as a mask.

INKJET HEAD AND METHODS OF MANUFACTURING THE INKJET HEAD

An inkjet head comprises a pressure chamber, piezoelectric elements, and pressure chamber electrodes disposed on an interior side of the pressure chamber, the pressure chamber electrodes being configured to apply a driving voltage to the piezoelectric elements. The inkjet head also includes a nozzle plate adhered to the frame body with the resin film. The nozzle plate includes an ink discharge hole configured to discharge ink. The inkjet head includes a frame body including an attaching part to which a mask that surrounds the outer perimeter of the inkjet head is to be attached. The inkjet head also includes a resin film that coats the pressure chamber electrodes and that includes an end portion that extends to and covers the attaching part. The inkjet head also includes a layer that coats the end portion of the resin film and by which the mask is to be adhered to the frame. 1. An inkjet head comprising:a substrate;side walls that are formed pectinately;a pressure chamber defined by the side walls;piezoelectric elements;pressure chamber electrodes disposed on an interior side of the pressure chamber;substrate electrodes disposed on the substrate and connected to the pressure chamber electrodes;a frame body including an attaching part to which a mask that surrounds the outer perimeter of the inkjet head is to be attached;a resin film that coats the pressure chamber electrodes and the substrate electrodes, and that includes an end portion that extends to and covers the attaching part;a nozzle plate adhered to the frame body with the resin film, the nozzle plate including an ink discharge hole configured to discharge ink; anda layer that coats the end portion of the resin film and by which the mask is to be adhered to the frame.2. The inkjet head according to claim 1 , whereinthe end portion of the resin film extends from an interior side of the frame body to an inner edge of the attaching part.4. The inkjet head according to claim 3 , wherein the drive circuit ...

Inkjet head and method of manufacturing inkjet head

An inkjet head including a substrate configured to discharge ink including a supporting surface formed of a resin material and configured to support the substrate, the supporting substrate including a portion continuing to a surface intersecting the supporting surface and forming a corner portion, the portion forming the corner portion including a non surface treated area which is not surface treated, the supporting surface including a portion adjacent to the non surface treated area being surface treated areas which is surface treated, wherein the substrate and the supporting surface are bonded via an adhesive agent disposed in the non surface treated area and the surface treated area.

Method of manufacturing liquid ejecting head, liquid ejecting apparatus, and method of manufacturing piezoelectric element

Provided is a method of manufacturing a liquid ejecting head including a pressure generating chamber communicating with a nozzle opening and a piezoelectric element including a piezoelectric layer and an electrode, the method including: forming a first piezoelectric precursor film containing Bi and Fe, or Ba and Ti; forming a first piezoelectric layer by heating and crystallizing the first piezoelectric precursor film; forming a second piezoelectric precursor film further containing at least one selected from Li, B, and Cu on the first piezoelectric layer, in addition to Bi and Fe, or Ba and Ti contained in the first piezoelectric precursor film; and forming the piezoelectric layer by heating and crystallizing the first piezoelectric layer and the second piezoelectric precursor film.

Using saturated mesh to control adhesive bond line quality

In some aspects of the present application, a printhead assembly is disclosed that comprise a plurality of functional plates stacked together; an adhesive confinement structure comprising an adhesive-coated mesh substrate arranged between adjacent functional plates to provide bonding between the plates.

INKJET HEAD AND METHOD FOR PRODUCING INKJET HEAD

An inkjet head and a production method wherein the inkjet head is produced by forming a film on a head chip having a channel member with an ink channel formed thereon and joining an end surface of the head chip coated with the film to a nozzle plate. The method includes a step of applying an adhesive containing spherical particles, whose volume average particle diameter is in the range of 0.95*Rz (MV) to 2.0*Rz (MV), in the range of 0.1 volume % to 10.0 volume % to at least one of the end surface of the head chip and a joint surface of the nozzle plate and then joining the nozzle plate. 1. A method for producing an inkjet head that is produced by forming a film on a head chip having a channel member with an ink channel formed thereon and joining an end surface of the head chip coated with the film to a nozzle plate , the method comprising a step of applying an adhesive containing spherical particles , whose volume average particle diameter is in the range of 0.95*Rz (MV) to 2.0*Rz (MV) , in the range of 0.1 volume % to 10.0 volume % to at least one of the end surface of the head chip and a joint surface of the nozzle plate and then joining the nozzle plate ,wherein Rz is one of surface roughness indexes specified by JIS B0601:2001 and is a maximum height of the end surface of the head chip coated with the film when a reference length of the surface jointed to the nozzle plate is 2.5 mm, and Rz (MV) is an average value of Rz obtained by measuring five positions.2. The method for producing an inkjet head according to claim 1 ,wherein the film contains polyparaxylylene or a polyparaxylylene derivative.3. The method for producing an inkjet head according to claim 1 ,wherein the film is formed by a vapor phase method.4. The method for producing an inkjet head according to claim 1 ,wherein the film is a protective film.5. The method for producing an inkjet head according to claim 1 ,wherein the adhesive is applied to the end surface of the head chip.6. The method for ...

PROCESS FOR PRODUCING LIQUID EJECTION HEAD AND LIQUID EJECTION HEAD

A process for producing a liquid ejection head including a recording element substrate having a principal surface and a support member having a color separation wall for ink flow paths and an outer wall, the substrate being narrower than the support member, a plane formed by conducting translation of a lower side of a substrate outer surface perpendicularly to the principal surface having an intersection with an outer wall top surface at a position distant from an inner edge of the outer wall top surface by a outward distance, including applying an adhesive onto top surfaces of the outer and color separation walls such that a surface height of the adhesive at the intersection is higher than that at a position distant from an inner edge of the color separation wall top surface by the outward distance, and bonding and fixing the substrate to the support member with the adhesive. 1. A process for producing a liquid ejection head comprising a recording element substrate having a principal surface provided with an ejection orifice for an ink and a support member having a plurality of flow paths for supplying the ink to the recording element substrate , the support member having a color separation wall and an outer wall , the recording element substrate having a width narrower than the support member , a plane formed by subjecting a lower side of an outer lateral surface of the recording element substrate to parallel translation in a direction perpendicular to the principal surface having an intersection line with a top surface of the outer wall at a position distant from an inner edge of the top surface of the outer wall by a predetermined outward distance , the process comprising an adhesive application step of applying an adhesive on to the top surfaces of the outer wall and the color separation wall in such a manner that a surface height of the adhesive at the intersection line is higher than a surface height of the adhesive at a position distant from an inner edge of ...

Process for production of functional device, process for production of ferroelectric material layer, process for production of field effect transistor, thin film transistor, field effect transistor, and piezoelectric inkjet head

A method of producing a functional device according to the present invention includes, in this order: the functional solid material precursor layer formation step of applying a functional liquid material onto a base material to form a precursor layer of a functional solid material; the drying step of heating the precursor layer to a first temperature in a range from 80° C. to 250° C. to preliminarily decrease fluidity of the precursor layer; the imprinting step of imprinting the precursor layer that is heated to a second temperature in a range from 80° C. to 300° C. to form an imprinted structure on the precursor layer; and the functional solid material layer formation step of heat treating the precursor layer at a third temperature higher than the second temperature to transform the precursor layer into a functional solid material layer.

Process for manufacturing a nozzle plate and fluid-ejection device provided with the nozzle plate

A nozzle plate for a fluid-ejection device, comprising: a first substrate made of semiconductor material, having a first side and a second side; a structural layer extending on the first side of the first substrate, the structural layer having a first side and a second side, the second side of the structural layer facing the first side of the first substrate; at least one first through hole, having an inner surface, extending through the structural layer, the first through hole having an inlet section corresponding to the first side of the structural layer and an outlet section corresponding to the second side of the structural layer; a narrowing element adjacent to the surface of the first through hole, and including a tapered portion such that the inlet section of the first through hole has an area larger than a respective area of the outlet section of the first through hole.

LIQUID DROP EJECTING HEAD, IMAGE FORMING DEVICE, AND METHOD OF MANUFACTURING LIQUID DROP EJECTING HEAD

In a liquid drop ejecting head including a diaphragm, a channel member, and a nozzle plate which are laminated in this order, interface surfaces of the channel member and the diaphragm are bonded by an adhesive. The diaphragm is formed to have a laminated structure in which the number of lamination layers is varied at different locations. The diaphragm includes an opening and a filter part, the filter part having plural filtering holes formed in the opening for supplying a liquid to pressurizing liquid chambers of the channel member. A side wall of the channel member disposed to contact or located in a vicinity of the filter part, and a thick-walled portion containing the largest number of lamination layers in the diaphragm do not overlap with each other in a laminating direction. 1. A liquid drop ejecting head comprising:a nozzle plate that forms nozzles to eject liquid drops;a channel member that forms pressurizing liquid chambers which communicate with the nozzles, respectively; anda diaphragm that forms a bottom surface of each of the pressurizing liquid chambers, the diaphragm, the channel member and the nozzle plate being laminated on top of each other, wherein:interface surfaces of the channel member and the diaphragm are bonded by an adhesive;the diaphragm is formed to have a laminated structure in which the number of lamination layers is varied at different locations of the diaphragm;the diaphragm includes an opening and a filter part, the filter part having plural filtering holes formed in the opening for supplying a liquid to the pressurizing liquid chambers; anda side wall of the channel member is disposed to contact or located in a vicinity of the filter part, and the side wall and a thick-walled portion containing the largest number of lamination layers in the diaphragm do not overlap with each other in a laminating direction.2. The liquid drop ejecting head according to claim 1 , wherein the thick-walled portion is formed in the diaphragm and located ...

Heater chips with silicon die bonded on silicon substrate, including offset wire bonding

A heater chip has a substrate and at least one die, made of silicon, and a bond non-adhesively attaching them. The substrate, thick enough to resist bowing, has ink supply vias from back to front surfaces. The die has ink flow vias from back to front surfaces and circuitry including heater elements adjacent the front surface interspersed with ink flow vias. A metal through the die connects a conductor on a front of the substrate to a heater element on a front of the die. A wire bond connects to the front of the substrate, but is offset from die.

Piezoelectric thin film element and method of manufacturing the same, droplet discharge head and inkjet recording device using the piezoelectric thin film element

A piezoelectric thin film element includes a vibration plate, a lower electrode provided on the vibration plate and made of a conductive oxide, a piezoelectric thin film provided on the lower electrode and made of a polycrystalline substance, and an upper electrode provided on the piezoelectric thin film, wherein the lower electrode includes a titanium oxide film formed on the vibration plate, a platinum film formed on the titanium oxide film, and a conductive oxide film formed on the platinum film and, the platinum film and the conductive oxide film being a solid film with no holes.

Liquid ejecting head, liquid ejecting apparatus and piezoelectric element

A liquid ejecting head which discharges a liquid from a nozzle opening including a piezoelectric body layer and a piezoelectric element possessing an electrode which is arranged on the piezoelectric body layer, wherein the piezoelectric body layer consists of a complex oxide having a perovskite structure, and when 2θ is fixed within the range of 21.9° to 22.7° to scan in the direction of the χ-axis, the piezoelectric body layer has a peak in the range of 4.75° to 28.3° and when 2θ is fixed within the range of 31.1° to 32.6° to scan in the direction of the χ-axis, the piezoelectric body layer has a peak in the range of 24.8° to 40.75°.

METHOD OF FORMING SUBSTRATE FOR FLUID EJECTION DEVICE

A method of forming a substrate for a fluid ejection device includes forming an opening in the substrate from a second side of the substrate toward a first side of the substrate, further forming the opening in the substrate to the first side of the substrate, anisotropically wet etching the substrate, including increasing the opening at the second side of the substrate and forming the opening with converging sidewalls from the second side to the first side, and after anisotropically wet etching the substrate, isotropically etching the substrate. 1. A method of forming a substrate for a fluid ejection device , the substrate having a first side and a second side opposite the first side , the method comprising:forming an opening in the substrate from the second side toward the first side;further forming the opening in the substrate to the first side;anisotropically wet etching the substrate, including increasing the opening at the second side of the substrate and forming the opening with converging sidewalls from the second side to the first side; andafter anisotropically wet etching the substrate, isotropically etching the substrate.2. The method of claim 1 , wherein forming an opening in the substrate from the second side toward the first side comprises laser machining the substrate from the second side toward the first side.3. The method of claim 1 , wherein further forming the opening in the substrate to the first side comprises dry etching the substrate through the opening.4. The method of claim 1 , wherein anisotropically wet etching the substrate comprises anisotropically wet etching the substrate with at least one of tetra-methyl-ammonium hydroxide and potassium hydroxide.5. The method of claim 1 , wherein isotropically etching the substrate comprises isotropically etching the substrate with xenon difluoride.6. A method of forming an opening through a substrate having a first side and a second side opposite the first side claim 1 , the method comprising:forming ...

LIQUID EJECTING HEAD AND METHOD FOR PRODUCING THE SAME

A method for producing a liquid ejecting head of the present invention includes the steps of: forming an etching stop layer on a portion corresponding to a region in which an independent supply port is formed, on a first face of a substrate; conducting dry etching treatment for the substrate from a second face side until the etched portion reaches the etching stop layer; and removing the etching stop layer by isotropic etching to form the independent supply port, after having conducted the dry etching treatment, wherein the isotropic etching is conducted in such a state that a side etching stopper portion having etching resistance to the isotropic etching is formed in the side face perimeter of the etching stop layer. 1. A method for producing a liquid ejecting head comprising a substrate which has an ejection energy generating element that generates energy for ejecting a liquid , on its first face , and an independent supply port that reaches the first face from a side of a second face which is opposite to the first face , comprising:(1) a step of forming an etching stop layer on a portion corresponding to a region in which the independent supply port is formed, on the first face;(2) a step of conducting dry etching treatment for the substrate from the second face side until the etched portion reaches the etching stop layer; and(3) a step of removing the etching stop layer by isotropic etching to form the independent supply port, after having conducted the dry etching treatment, whereinthe isotropic etching is conducted in such a state that a side etching stopper portion having etching resistance to the isotropic etching is formed in the side face perimeter of the etching stop layer.2. The method for producing a liquid ejecting head according to claim 1 , wherein the isotropic etching is wet etching treatment.3. The method for producing a liquid ejecting head according to claim 1 , wherein the dimension of an aperture on the first face side of the independent ...

Liquid droplet discharge head, method of manufacturing liquid droplet discharge head, and liquid droplet discharge device

In a liquid droplet discharge head, a first groove-shaped cavity is formed on a cavity plate, a second groove-shaped cavity is formed on a nozzle plate in addition to nozzle holes, when bonding the cavity plate and the nozzle plate to each other, the first groove-shaped cavity and the second groove-shaped cavity overlap to form a pressure chamber.

EJECTION DEVICES FOR INKJET PRINTERS AND METHOD FOR FABRICATING EJECTION DEVICES

Disclosed is an ejection device for an inkjet printer that includes an ejection chip having a substrate and at least one fluid ejecting element. The ejection device further includes a fluidic structure configured over the ejection chip. The fluidic structure includes a nozzle plate composed of an organic material and includes a plurality of nozzles. The fluidic structure further includes a flow feature layer configured in between the ejection chip and the nozzle plate. The flow feature layer is composed of an organic material and includes a plurality of flow features. Furthermore, the fluidic structure includes a liner layer encapsulating the nozzle plate. The liner layer further at least partially encapsulates each flow feature of the plurality of flow features. The liner layer is composed of an inorganic material. Further disclosed is a method for fabricating the ejection device. 112.-. (canceled)13. A method for fabricating an ejection device for an inkjet printer , the method comprising:depositing a first layer of an organic material on an ejection chip, the ejection chip comprising a substrate and at least one fluid ejecting element carried by the substrate;patterning the first layer of the organic material to configure a flow feature layer over the ejection chip;depositing a first layer of an inorganic material over the first layer of the organic material;patterning the first layer of the inorganic material to configure a plurality of openings therewithin;depositing a second layer of an organic material over the first layer of the inorganic material to configure a nozzle plate of the ejection device;processing the second layer of the organic material by one of patterning and planarization;depositing a second layer of one of an inorganic material and a hydrophobic material over the second layer of the organic material; patterning the second layer of the one of the inorganic material and the hydrophobic material to configure a plurality of openings corresponding ...

LIQUID DISCHARGE HEAD AND METHOD OF MANUFACTURING THE SAME

Provided is a liquid discharge head including: a discharge port that serves to discharge a liquid; a discharge energy generating element that generates energy used to discharge the liquid; a foam chamber that houses the discharge energy generating element and is communicated with the discharge port; and a flow channel that is communicated with the foam chamber and serves to supply the liquid to the foam chamber. An inclined surface is formed between: a side wall of the foam chamber on a side opposite to the flow channel; and a surface of the foam chamber on which the discharge port is formed, and the inclined surface is inclined to a plane on which the discharge energy generating element is formed. 1. A liquid discharge head comprising:a discharge port that serves to discharge a liquid;a discharge energy generating element that generates energy used to discharge the liquid;a foam chamber that houses the discharge energy generating element and is communicated with the discharge port; anda flow channel that is communicated with the foam chamber and serves to supply the liquid to the foam chamber,wherein an inclined surface is formed between: a side wall of the foam chamber on a side opposite to the flow channel; and a surface of the foam chamber on which the discharge port is formed, andthe inclined surface is inclined to a plane on which the discharge energy generating element is formed.2. The liquid discharge head according to claim 1 , wherein the inclined surface is a curved surface that protrudes toward an inside of the foam chamber.3. The liquid discharge head according to claim 1 ,wherein the discharge energy generating element is provided on a substrate,the flow channel is defined by a flow channel forming member in which the discharge port is formed, andthe substrate and the flow channel forming member are jointed to each other.4. The liquid discharge head according to claim 3 , wherein a concave part is formed along the discharge port on one surface of the ...

Fluid Ejection Assembly and Related Methods

In one embodiment, a fluid ejection device includes a substrate with a fluid slot and a membrane adhered to the substrate that spans the fluid slot. A resistor is disposed on top of the membrane over the fluid slot, and a fluid feed hole next to the resistor extends through the membrane to the slot. A shelf extends from the edge of the resistor to the edge of the feed hole, and a passivation layer covers the resistor and part the shelf. An etch-resistant layer is formed partly on the shelf and in between the fluid feed hole and the resistor. 1. A fluid ejection device comprising:a substrate with a fluid slot formed therein;a membrane adhered to the substrate and spanning the fluid slot;a resistor disposed on top of the membrane over the fluid slot;a fluid feed hole next to the resistor that extends down through the membrane to the fluid slot;a shelf extending from an edge of the resistor to the fluid feed hole;a passivation layer formed over the resistor and the shelf; andan etch-resistant layer formed partly on the shelf and in between the fluid feed hole and the resistor.2. A fluid ejection device as in claim 1 , wherein the passivation layer covers part of the shelf and ends prior to reaching the fluid feed hole claim 1 , and wherein the etch-resistant layer caps the end of the passivation layer and extends along the shelf to the fluid feed hole.3. A fluid ejection device as in claim 1 , wherein the etch-resistant layer fills in an etched-out strip of the passivation layer on the shelf.4. A fluid ejection device as in claim 1 , wherein the etch-resistant layer fills in a ring surrounding the fluid feed hole where the passivation layer has been etched out.5. A fluid ejection device as in claim 1 , further comprising:a fluid chamber formed on top of the membrane and surrounding the resistor; anda nozzle layer over the chamber and having a nozzle that corresponds with the resistor and the chamber.6. A fluid ejection device as in claim 1 , wherein the passivation ...

PRINTHEAD

A printhead is disclosed herein. The printhead includes a die substrate having a surface. A trench is defined in the die substrate surface, and a support is positioned in the trench. A compliant membrane is attached to the die substrate surface, and a gap is defined between a distal end of the support and the compliant membrane. 1. A printhead , comprising:a die substrate having a surface;a trench defined in the die substrate surface;a support positioned in the trench;a compliant membrane attached to the die substrate surface; anda gap defined between a distal end of the support and the compliant membrane.2. The printhead as defined in wherein the trench includes a trench surface that defines:a depression having a depth measured from the die substrate surface;a first shoulder adjacent to the depression and having a depth measured from the die substrate surface that is less than the depression depth; anda second shoulder adjacent to the depression and having a depth measured from the die substrate surface that is less than the first shoulder depth.3. The printhead as defined in wherein the support is positioned on a portion of the trench surface that defines the depression claim 2 , and wherein the printhead further comprises a second support having two ends claim 2 , one of the two ends being in contact with a portion of the trench surface that defines the first shoulder and an other of the two ends being in contact with the compliant membrane.4. The printhead as defined in wherein the gap ranges from about 0.5 microns to about 15 microns.5. The printhead as defined in wherein the die substrate has a second die substrate surface opposed to the die substrate surface claim 1 , and wherein the printhead further comprises:a second trench defined in the second die substrate surface;a second support positioned in the second trench;a second compliant membrane attached to the second surface; anda gap defined between a distal end of the second support and the second ...

LIQUID DISCHARGE HEAD AND METHOD FOR MANUFACTURING THE SAME

A liquid discharge head includes a recording element substrate including an energy generation element for generating energy used to discharge a liquid and a terminal electrically connected to the energy generation element, and an electric wiring board including an electrode electrically connected to the terminal via a wire to transmit an electric signal supplied from outside to the energy generation element, wherein the terminal has an area twice or more larger than a contact area between the terminal and the wire and the electrode has an area twice or more larger than a contact area between the electrode and the wire. 1. A method for manufacturing a liquid discharge head , comprising:a step for preparing a recording element substrate including an energy generation element for generating energy used to discharge a liquid and a terminal electrically connected to the energy generation element and an electric wiring board including an electric wiring and an electrode connected to the electric wiring;a first connection step for connecting a first region of the terminal and a second region of the electrode by a first wire;an inspection step for checking electric conduction of portions connected by the first wire;a removal step for removing the first wire determined to be defective in the inspection step; anda second connection step for connecting a third region that is different from the first region in the terminal from which the wire has been removed and a fourth region that is different from the second region in the terminal from which the wire has been removed.2. The method for manufacturing the liquid discharge head according to claim 1 , wherein the first region is a region on aside of the electric wiring board from a center of the terminal in a longitudinal direction of the terminal claim 1 , the second region is a region on a side opposite to a side of the recording element substrate from a center of the electrode in a longitudinal direction of the electrode ...

LIQUID DROPLET EJECTION HEAD AND LIQUID DROPLET EJECTION APPARATUS

An ink jet type recording head includes a substrate, a nozzle plate having nozzles, and a sealing sheet, and the substrate and the nozzle plate are bonded to each other through a bonding film, and the substrate and the sealing sheet are bonded to each other through a bonding film. These bonding films are each obtained by drying and/or curing a liquid material containing an epoxy-modified silicone material. Further, by applying energy to each bonding film, the surface thereof is activated, and therefore, each bonding film exhibits a bonding property. By this bonding property, the substrate is bonded to the nozzle plate and to the sealing sheet. 1. A liquid droplet ejection head , comprising:a substrate having a first surface and a second surface,a nozzle plate positioned relative to the first surface of the substrate, the nozzle plate having nozzles through which an ejection liquid is ejected in the form of liquid droplets, and a sealing plate;a sealing plate positioned relative to the second surface of the substrate; anda bonding film disposed on one of the substrate, the nozzle plate, and the sealing plate,wherein the bonding film has a bonding property exhibited in a coating film containing an epoxy-modified silicone material through the application of energy to the coating film, the epoxy-modified silicone material is obtained by an addition reaction between a silicone material and an epoxy resin, and the epoxy resin has a phenylene group in each molecule.2. The liquid droplet ejection head according to claim 1 , wherein the silicone material is composed of polydimethylsiloxane as a main backbone claim 1 , and the main backbone is branched.3. The liquid droplet ejection head according to claim 2 , wherein claim 2 , in the silicone material claim 2 , at least one methyl group of the polydimethylsiloxane has been substituted by a phenyl group.4. The liquid droplet ejection head according to claim 1 , wherein the silicone material has a plurality of silanol groups.5 ...

THERMAL PRINTHEAD AND METHOD OF MANUFACTURING THE SAME

A thermal printhead includes a substrate, a resistor layer formed on the substrate, an electrode layer formed on the substrate and electrically connected to the resistor layer, and an insulating layer. The electrode layer includes a first electrically conductive portion and a second electrically conductive portion spaced apart from each other. The resistor layer includes a heater portion that bridges the first electrically conductive portion and the second electrically conductive portion as viewed in the thickness direction of the substrate. The insulating layer includes a portion positioned between the electrode layer and the heater portion. This arrangement reduces formation of a eutectic region between the heater portion and the electrode layer. 1. A thermal printhead comprising:a substrate;a resistor layer formed on the substrate;an electrode layer formed on the substrate and electrically connected to the resistor layer; andan insulating layer;wherein the electrode layer includes a first electrically conductive portion and a second electrically conductive portion spaced apart from each other,the resistor layer includes a heater portion that bridges the first electrically conductive portion and the second electrically conductive portion as viewed in a thickness direction of the substrate, andthe insulating layer includes a portion positioned between the electrode layer and the heater portion.2. The thermal printhead according to claim 1 , wherein the insulating layer includes a first interposing portion and a second interposing portion claim 1 ,the first interposing portion is positioned between the first electrically conductive portion and the heater portion, andthe second interposing portion is positioned between the second electrically conductive portion and the heater portion.3. The thermal printhead according to claim 2 , wherein the insulating layer includes an intermediate portion sandwiched between the first interposing portion and the second interposing ...

Method of processing inkjet head substrate

A method of processing an inkjet head substrate includes, in series, a step of forming a barrier layer on a substrate and forming a seed layer on the barrier layer, a step of forming a resist film on the seed layer and patterning the resist film such that the resist film has an opening corresponding to a wiring section configured to drive ink discharge energy-generating elements, a step of forming the wiring section in the opening of the patterned resist film, a step of removing the resist film, a step of laser-processing a surface of the substrate, a step of forming an ink supply port by anisotropically etching the substrate, and a step of removing the barrier layer and the seed layer.

REDUCTION OF ARC-TRACKING IN CHIP ON FLEXIBLE CIRCUIT SUBSTRATES

A method of manufacturing a flexible circuit, including forming a first set of traces, forming a second set of traces, and cutting a gap between the first and second set of traces. 1. A method of manufacturing a flexible circuit , comprising:forming a first set of traces;forming a second set of traces; andcutting a gap between the first and second set of traces.2. The method of claim 1 , wherein cutting the gap comprises using a laser to cut the gap.3. The method of claim 1 , wherein cutting the gap comprises cutting the gap when the circuit substrate is cut from a larger piece of material.4. The method of claim 1 , wherein cutting the gap comprises forming the gap during formation of the flexible circuit.5. The method of claim 1 , wherein forming a first set of traces comprises forming a first set of traces and connecting the first set of traces to a negative voltage supply.6. The method of claim 1 , wherein forming a second set of traces comprises forming a second set of traces and connecting the second set of traces to a positive voltage supply.7. The method of claim 1 , further comprising forming a second gap between the gap and at least one of the sets of traces.8. A method of manufacturing a flexible circuit claim 1 , comprising:forming the flexible circuit having at least one region with an arc-break in the flexible circuit;forming a first set of traces adjacent the gap on a first side of the arc-break; andforming a second set of traces adjacent the gap on a side of the arc-break opposite the first side.9. The method of manufacturing of claim 8 , wherein forming the flexible circuit having at least one region with an arc-break comprises forming the flexible circuit with thermal control material to form the arc-break.10. The method of manufacturing of claim 8 , wherein forming the flexible circuit having at least one region with an arc-break comprises forming the flexible circuit by removing material to form the arc-break.11. A method of forming a print head ...

Laser welded bonding pads for piezoelectric print heads

An ink jet print head can be formed using a laser to melt a plating layer interposed between a piezoelectric actuator and a circuit layer bump. The plating layer can be formed on the circuit layer bump, the piezoelectric actuator, or both, and a laser beam output by the laser is used to melt the plating layer to provide a laser weld. In another embodiment, the circuit layer bump or the trace itself functions as the plating layer, which is melted using a laser to provide the laser weld.

Shear mode physical deformation of piezoelectric mechanism

A piezoelectric mechanism includes first and second electrodes and a thin film sheet of piezoelectric material. The second electrode is interdigitated in relation to the first electrode. The first and the second electrodes are embedded within the thin film sheet. The thin film sheet is polarized in a direction at least substantially perpendicular to a surface of the thin film sheet. The thin film sheet is to physically deform in a shear mode due to polarization of the thin film sheet at least substantially perpendicular to the surface of the thin film sheet, responsive to an electric field induced within the thin film sheet at least substantially parallel to the sheet via application of a voltage across the first and the second electrodes.

Process for producing liquid ejection head

A process for producing a liquid ejection head having a piezoelectric body provided with an ejection orifice for ejecting liquid and a pressure chamber communicating therewith for retaining the liquid, wherein an electrode is formed on an inner wall surface of the pressure chamber to deform the pressure chamber by piezoelectric action caused by applying voltage to the electrode to eject the liquid, comprising providing the piezoelectric body in which a surface thereof having the ejection orifice has an arithmetic mean roughness of 0.1-1 μm, forming a dry film resist pattern on the surface of the piezoelectric body so as to expose the ejection orifice and a linear region connected thereto, and forming a metal thin film pattern being connected to the electrode on the inner wall surface and continuously extending from the inner wall surface to the linear region by using the dry film resist pattern as a mask.

INK-JET HEAD AND METHOD OF MANUFACTURING THE SAME

According to one embodiment, an ink-jet head includes a piezoelectric member which forms an ink pressure chamber, an electrode disposed on a side surface of the piezoelectric member, a nozzle plate attached to the piezoelectric member and including a nozzle hole communicating with the ink pressure chamber, a surface of the nozzle plate including a top surface of the nozzle plate, and a protection film which covers the surface of the nozzle plate, a peripheral portion of an adhesion part between the piezoelectric member and the nozzle plate, and the electrode. A recess is formed in a part of the protection film covering the top surface of the nozzle plate. The part of the protection film corresponds to a peripheral area of the nozzle hole. 1. A method of manufacturing an ink-jet head , comprising:forming a piezoelectric member which forms an ink pressure chamber, and an electrode disposed on a side surface of the piezoelectric member;attaching the piezoelectric member and a nozzle plate; forming a protection film which covers a surface of the nozzle plate, a peripheral portion of an adhesion part between the piezoelectric member and the nozzle plate, and the electrode; andremoving at least a part of the protection film covering a top surface of the nozzle plate by radiating a laser beam at a peripheral area of a nozzle hole.2. The method of claim 1 , wherein the protection film is formed of an electrically insulative organic material.3. The method of claim 1 , wherein the protection film is formed by vapor-deposition polymerization.4. The method of claim 1 , wherein the nozzle plate is formed of a resin claim 1 , and an amount of radiation of the laser beam for removing at least the part of the protection film is set in condition that the laser beam does not penetrate the nozzle plate from the top surface thereof to a back surface thereof.5. The method of claim 1 , wherein the nozzle plate is formed of a resin claim 1 , and a laser beam is radiated on the nozzle ...

METHOD FOR MANUFACTURING LIQUID DISCHARGE HEAD

A method for manufacturing a liquid discharge head includes a step of preparing a first substrate having an energy generating element at a front surface side thereof; a step of forming a wall member, which is to become a wall for a liquid flow passage, at the front surface side of the first substrate; a step of forming a mask having an opening on the wall member and forming a second substrate, which is composed of silicon and is to become an orifice plate, on the mask; and a step of forming a liquid supply port in the first substrate and a liquid discharge port in the second substrate by supplying an etchant from a back surface side of the first substrate, the back surface being a surface opposite the front surface. 1. A method for manufacturing a liquid discharge head including a substrate having a liquid supply port; an energy generating element; and an orifice plate having a liquid discharge port , the method comprising:a step of preparing a first substrate having the energy generating element at a front surface side thereof;a step of forming a wall member, which is to become a wall for a liquid flow passage, at the front surface side of the first substrate;a step of forming a mask having an opening on the wall member and forming a second substrate, which is composed of silicon and is to become the orifice plate, on the mask; anda step of forming the liquid supply port in the first substrate and the liquid discharge port in the second substrate by supplying an etchant from a back surface side of the first substrate, the back surface being a surface opposite the front surface.2. The method according to claim 1 , wherein the first substrate is composed of silicon.3. The method according to claim 1 , wherein the liquid supply port is formed in the first substrate and the liquid discharge port is formed in the second substrate by performing anisotropic etching using the etchant.4. The method according to claim 1 , wherein a surface of the second substrate provided ...

INKJET PRINT HEAD AND METHOD FOR MANUFACTURING THE SAME

An inkjet print head includes a jet assembly, a printed-circuit board and a barrier coating film. The jet assembly includes a nozzle plate including a jet orifice in a lower surface of the nozzle plate and through which ink is discharged, and an ink transfer pathway inside nozzle plate. The printed-circuit board is combined with the jet assembly. The printed-circuit board includes an integrated circuit and a connection electrode. The barrier coating film includes organic material, a flexible layer and a hydrophobic layer. The barrier coating film covers an inner and an outer surface of the jet assembly, and an outer surface of the printed-circuit board. The barrier coating film exposes the lower surface of the nozzle plate and an outer surface of the connection electrode. 1. An inkjet print head comprising: a jet orifice on a lower surface of the nozzle plate and through which an ink is discharged from the nozzle plate, and', 'an ink transfer pathway inside the nozzle plate;, 'a nozzle plate comprising, 'a jet assembly comprisinga printed-circuit board which is combined with the jet assembly, the printed-circuit board comprising an integrated circuit and a connection electrode; anda first barrier coating film comprising an organic material, a flexible layer and a hydrophobic layer,wherein the first barrier coating film covers an inner surface and an outer surface of the jet assembly, and an outer surface of a portion of the printed-circuit board, andthe first barrier coating film exposes the lower surface of the nozzle plate and an outer surface of the connection electrode of the printed-circuit board.2. The inkjet print head of claim 1 , wherein the flexible layer of the first barrier coating film comprises a parylene film.3. The inkjet print head of claim 2 , wherein the parylene film comprises at least one selected from parylene C claim 2 , parylene N claim 2 , parylene D and parylene HF.4. The inkjet print head of claim 1 , wherein a thickness of the flexible ...

LIQUID EJECTION HEAD AND METHOD OF MANUFACTURING LIQUID EJECTION HEAD

Provided is a liquid ejection head, including: multiple ejection orifices for ejecting liquid; multiple pressure chambers that communicate with the respective ejection orifices, and are arranged in a first direction and a second direction that intersect each other, the multiple pressure chambers including first electrodes formed on inner walls of the multiple pressure chambers; a piezoelectric block including the multiple pressure chambers and multiple air chambers, the multiple air chambers being arranged in the first direction and the second direction alternately with the multiple pressure chambers, the inner walls of the respective pressure chambers being deformable by application of voltage between the first electrodes and the second electrodes to cause liquid to flow out of open ends of the respective pressure chambers; an orifice plate in which the multiple ejection orifices are arranged; and a plate-like member that is interposed between the piezoelectric block. 1. A liquid ejection head , comprising:multiple ejection orifices for ejecting liquid;multiple pressure chambers that communicate with the respective ejection orifices, and are arranged in a first direction and a second direction that intersect each other, the multiple pressure chambers comprising first electrodes formed on inner walls of the multiple pressure chambers;a piezoelectric block comprising the multiple pressure chambers and multiple air chambers, the multiple air chambers being arranged in the first direction and the second direction alternately with the multiple pressure chambers, the multiple air chambers comprising second electrodes formed on inner walls of the multiple air chambers, the inner walls of the respective pressure chambers being deformable by application of voltage between the first electrodes and the second electrodes to cause liquid to flow out of open ends of the respective pressure chambers;an orifice plate in which the multiple ejection orifices are arranged; anda plate ...

LIQUID EJECTION HEAD AND METHOD OF MANUFACTURING THE SAME

A liquid ejection head has a plurality of pressure chambers each communicating with an ejection port at one end and with an ink supply port at the other end. Each of the pressure chamber has lateral walls formed by piezoelectric elements and configured so as to eject ink from the corresponding ejection port as a result of a capacity change of the pressure chamber due to an expansion or contraction of the piezoelectric elements. The liquid ejection head is constituted by a plate-shaped piezoelectric portion and a plurality of column-shaped piezoelectric portions arranged thereon. The plate-shaped piezoelectric portion has a plurality of holes and a plurality of through holes located around the holes. Each of the column-shaped piezoelectric portions has a hollow section. Each hole of the plate-shaped piezoelectric portion and the hollow section of the corresponding column-shaped piezoelectric portion form a pressure chamber. 1. A liquid ejection head having a plurality of pressure chambers with lateral walls formed by using piezoelectric elements , an end of each of the pressure chambers being held in communication with an ejection port for ejecting ink , the opposite end being held in communication with a supply port for supplying ink to the pressure chamber , the liquid ejection head being so configured as to eject ink from each of the ejection ports as a result of a capacity change of each of the pressure chambers due to an expansion or contraction of the piezoelectric elements ,the liquid ejection head comprising a piezoelectric element substrate formed by using piezoelectric elements and having:a plate-shaped piezoelectric portion having a plurality of holes running through the plate-shaped piezoelectric portion from a surface thereof to the opposite surface and a plurality of through holes located around the holes; anda plurality of column-shaped piezoelectric portions arranged on one of the surfaces of the plate-shaped piezoelectric portion at positions ...

Printhead and method of making the printhead

A printhead assembly comprises a plurality of plates stacked together. The plates form a flow path having an inlet and a nozzle. An ejection chamber is in fluid connection with the flow path. A diaphragm is in operable connection with the ejection chamber. A micro actuator is in operable connection with the diaphragm, the micro actuator being configured to actuate the diaphragm. An adhesive layer bonds at least two of the plurality of plates together. The adhesive comprises silicone.

DRY ETCHING METHOD

According to one aspect of the present invention, there is provided a dry etching method which carries out patterning of a resin film provided on a substrate, by reactive ion etching using a resist mask, wherein a gas mixture containing CFgas with a percentage flow rate of 1.0 to 5.0% is used as an etching gas; and pressure in an etching reaction chamber in an apparatus used for the reactive ion etching is 1.0 Pa or more. 1. A dry etching method which carries out patterning of a resin film provided on a substrate , by reactive ion etching using a resist mask , wherein a gas mixture containing CFgas with a percentage flow rate of 1.0 to 5.0% is used as an etching gas; and pressure in an etching reaction chamber in an apparatus used for the reactive ion etching is 1.0 Pa or more.2. The dry etching method according to claim 1 , wherein the reactive ion etching includes a first stage in which 5 to 95% of a thickness of the resin film is removed beginning with a start of etching claim 1 , and a second stage in which etching is performed after the first stage; and high-frequency antenna power in the second stage is higher than high-frequency antenna power in the first stage.3. The dry etching method according to claim 2 , wherein the high-frequency antenna power in the second stage is higher than the high-frequency antenna power in the first stage by 1000 w or more.4. The dry etching method according to claim 3 , wherein the high-frequency antenna power in the first stage is 1000 to 3000 w and the high-frequency antenna power in the second stage is 2000 to 4000 w.5. The dry etching method according to claim 2 , wherein high-frequency bias power in the first stage is 450 to 1050 w and high-frequency bias power in the second stage is 30 to 70 w.6. The dry etching method according to claim 1 , wherein the resin film is made of any one of a polyamide resin claim 1 , an epoxy resin or a light-curing acrylate resin.7. The dry etching method according to claim 1 , wherein the ...

METHOD OF FORMING A NOZZLE OF A FLUID EJECTION DEVICE

A method of forming a nozzle of a fluid ejection device, the nozzle having a straight mouth portion and a cavity portion, wherein the mouth portion is formed in a bottom surface of the substrate, and, after passivating the walls of the mouth portion, a wet etch process is applied from the bottom surface of the substrate for forming a part of the cavity portion with walls that diverge from the mouth portion, characterized in that a wet etch process is also applied from a top surface of the substrate for forming a part of the cavity portion which diverges towards the bottom surface and merges with the part that is etched from the bottom surface. 1. A method of forming a nozzle of a fluid ejection device , the nozzle having a straight mouth portion and a cavity portion , wherein the mouth portion is formed in a bottom surface of a substrate , and , after passivating the walls of the mouth portion , a wet etch process is applied from the bottom surface of the substrate for forming a part of the cavity portion with walls that diverge from the mouth portion , wherein a wet etch process is also applied from a top surface of the substrate for forming a part of the cavity portion which diverges towards the bottom surface and wherein the part that is etched from the bottom surface and the part that is etched from the top surface merge.2. The method according to claim 1 , wherein the substrate is immersed in an etching solution for performing the wet etch process from the top side and the bottom side of the substrate simultaneously.3. The method according to claim 1 , comprising the steps of:forming a top part of the cavity portion in the form of a straight channel that extends from a top surface of the substrate,passivating the walls of the top part with an etch mask layer,removing the part of the etch mask layer that covers the bottom end face of the channel, andapplying the wet etch process from the top surface of the substrate.4. The method according to claim 1 , wherein ...

LIQUID EJECTION HEAD AND METHOD OF MANUFACTURING THE SAME

A liquid ejection head includes two or more substrates disposed side by side, each having energy generating elements and primary terminals electrically connected to the respective energy generating elements, and an electrical wiring member having primary flying leads electrically connected to the respective primary terminals by means of gang bonding. Each of the substrates has an auxiliary terminal located adjacent to the primary terminals and the auxiliary terminals of the two or more substrates are disposed adjacent to each other. The electrical wiring member has an auxiliary flying lead connected to the auxiliary terminals of the substrates by means of a gang bonding system. 1. A liquid ejection head comprising:a first substrate and a second substrate disposed side by side, each having energy generating elements and primary terminals electrically connected to the respective energy generating elements; andan electrical wiring member having primary flying leads electrically connected to the respective primary terminals by means of a gang bonding system, the electrical wiring member being arranged adjacent to the first and second substrates;each of the first and second substrates having an auxiliary terminal located adjacent to the respective primary terminals, the auxiliary terminals of the substrates being disposed adjacent to each other, the electrical wiring member having an auxiliary flying lead connected to or a pair of auxiliary flying leads respectively connected to the auxiliary terminals of the first and second substrates by means of a gang bonding system.2. The liquid ejection head according to claim 1 , whereinthe auxiliary flying lead has a connecting section that extends so as to ride on the auxiliary terminals of the first and second substrates and is connected to the auxiliary terminals of the first and second substrates.3. The liquid ejection head according to claim 1 , whereinthe auxiliary terminal of at least either of the substrates is realized ...

PROCESSES FOR PRODUCING SUBSTRATE WITH PIERCING APERTURE, SUBSTRATE FOR LIQUID EJECTION HEAD AND LIQUID EJECTION HEAD

The invention provides a process for producing a substrate with a piercing aperture, the piercing aperture being formed by conducting dry etching from the side of a second surface opposite to a first surface of a substrate to the first surface, the process comprising, in the following order, the steps of (a) forming a groove around a region where the piercing aperture is formed in the first surface of the substrate, (b) forming an etch-stop layer in the region where the piercing aperture is formed in the first surface of the substrate and in the interior of the groove, and (c) forming the piercing aperture by conducting the dry etching from the side of the second surface. 1. A process for producing a substrate with a piercing aperture , the piercing aperture being formed by conducting dry etching from the side of a second surface opposite to a first surface of a substrate to the first surface , the process comprising , in the following order , the steps of:(a) forming a groove around a region where the piercing aperture is formed in the first surface of the substrate;(b) forming an etch-stop layer in the region where the piercing aperture is formed in the first surface of the substrate and in the interior of the groove; and(c) forming the piercing aperture by conducting the dry etching from the side of the second surface.2. The process according to claim 1 , wherein in the step (c) claim 1 , over etching is conducted after the dry etching reaches the etch-stop layer claim 1 , thereby spreading an opening portion of the piercing aperture on the side of the first surface up to the groove.3. The process according to claim 1 , which further comprises a step of removing at least a portion of the etch-stop layer claim 1 , the portion corresponding to the first surface side opening portion of the piercing aperture claim 1 , after the step (c).4. The process according to claim 1 , wherein a Bosch process is applied for the dry etching.5. A process for producing a substrate ...

Liquid ejection head and method for manufacturing liquid ejection head

A liquid ejection head includes a print element board and an electric wiring board electrically connected to a bump of the print element board using an interconnecting wire. The bump has a first surface and a second surface. The height of the second surface from a surface of a base plate is higher than that of the first surface. The first surface has a protrusion formed therein, and the bump is connected to the interconnecting wire in the second surface.

PRINTHEAD DIE

A printhead die is provided that includes a substrate and a slot extending through the substrate, the slot including a first slot segment and a discrete second slot segment, the second slot segment being offset from the first slot segment along a major axis and along an orthogonal minor axis. 1. A printhead die , comprising:a substrate; anda slot extending through the substrate, the slot including a first slot segment and a discrete second slot segment, the second slot segment being offset from the first slot segment along a major axis and along an orthogonal minor axis.2. The printhead die of claim 1 , wherein the first slot segment and the second slot segment have adjacent ends along a same minor axis.3. The printhead die of claim 1 , wherein offset of the first slot segment and the second slot segment defines a pathway between the first slot segment and the second slot segment.4. The printhead die of claim 3 , further comprising an electrical trace routed across the substrate through the pathway.5. The printhead die of claim 1 , wherein the first slot segment is in a first column and the second slot segment is in a second column parallel to the first column.6. The printhead die of claim 1 , wherein the slot further includes a third slot segment claim 1 , consecutive slot segments along the major axis alternating between a first column and a second column.7. The printhead die of claim 6 , wherein each slot segment in a given column is aligned with all other slot segments in the given column.8. A printhead die claim 6 , comprising:a substrate;a first full-length slot segmented into a plurality of discrete slot segments to deliver a first liquid through the substrate, the first full-length slot having pathways defined between adjacent slot segments of the first full-length slot;a second full-length slot segmented into a plurality of discrete slot segments to deliver a different second liquid through the substrate, the second full-length slot having pathways defined ...

Inkjet head and method of manufacturing inkjet head

An inkjet head including: a head chip having; driving walls composed of piezoelectric element, wherein shear deformation is caused by applying voltage so as to jet ink, channels arranged alongside the driving walls alternatively to contain ink, outlet and inlet ports respectively provided on a front and rear surface of the head chip for each channel, driving electrodes formed on surfaces of the driving walls to apply voltage to the driving walls, and connection electrodes formed on the rear surface of the head chip to connect the driving electrodes electrically; a wiring substrate, wherein wiring electrodes are formed to apply voltage to the driving electrode through the connection electrode, bonded on the rear surface of the head chip to protrude from the head chip in a direction perpendicular to a direction of a channel array so that all the channels are exposed at the rear surface of the head chip.

NOZZLE PLATE FABRICATION

There is provided a method of improving the yield of a nozzle plate fabrication process, the method comprising determining a variation in the size of nozzles in a nozzle plate from a predetermined size or range of sizes for the nozzles, the nozzles in the nozzle plate having been fabricated using a plurality of mandrels, each mandrel defining a respective nozzle in the nozzle plate and determining modifications to the size of one or more mandrels in the plurality of mandrels to compensate for the determined variation in the size of nozzles in the nozzle plate. Also provided is a method of fabricating a nozzle plate, the method comprising fabricating a nozzle plate having a plurality of nozzles using a plurality of mandrels on a substrate, each mandrel defining a respective nozzle in the nozzle plate, the mandrels in the plurality of mandrels having varying sizes in order to compensate for local variations in the fabrication process that would result in local variations in the size of nozzles in the nozzle plate from a predetermined size or range of sizes. 1. A method of improving the yield of a nozzle plate fabrication process , the method comprising:determining a variation in the size of nozzles in a nozzle plate from a predetermined size or range of sizes for the nozzles, the nozzles in the nozzle plate having been fabricated using a plurality of mandrels, each mandrel defining a respective nozzle in the nozzle plate; anddetermining modifications to the size of one or more mandrels in the plurality of mandrels to compensate for the determined variation in the size of nozzles in the nozzle plate.2. A method as claimed in claim 1 , wherein the step of determining modifications comprises increasing the size of mandrels that define nozzles having a size below the predetermined size or range of sizes and decreasing the size of mandrels that define nozzles having a size above the predetermined size or range of sizes.3. A method as claimed in claim 1 , wherein the step ...

METHOD FOR MANUFACTURING LIQUID EJECTION HEAD

A method for manufacturing a liquid ejection head includes the steps of: disposing an etching mask layer on a substrate having a first face and a second face that is on an opposite side of the first face, the etching mask layer being disposed on the second face; forming a concave line pattern at a region of the etching mask layer other than a region where an opening for the support port is to be formed; providing an etching opening at the etching mask layer; performing anisotropic etching from a side of the second face using the etching mask layer provided with the etching opening as a mask, thus forming the supply port at the substrate; comparing the line pattern with a recess generated at the substrate, thus selecting a device chip for liquid ejection; and connecting the selected device chip to a liquid supply part. 1. A method for manufacturing a liquid ejection head including: a device chip for liquid ejection including an ejection energy generating element and a supply port; and a liquid supply part that supplies liquid to the supply port , the method comprising the steps of:disposing an etching mask layer on a substrate having a first face, on which the ejection energy generating element is provided, and a second face that is on an opposite side of the first face, the etching mask layer being disposed on the second face;forming a concave line pattern at a region of the etching mask layer other than a region where an opening for the supply port is to be formed;providing an etching opening at the etching mask layer;performing anisotropic etching from a side of the second face using the etching mask layer provided with the etching opening as a mask, thus forming the supply port at the substrate;comparing the line pattern with a recess generated at the substrate, thus selecting the device chip for liquid ejection; andconnecting the selected device chip for liquid ejection to the liquid supply part.2. The method for manufacturing a liquid ejection head according to ...

INK JET HEAD

An ink jet head according to an embodiment comprises a substrate including a mounting surface and a pressure chamber, a vibration plate including a first surface fixed to the mounting surface and covering the pressure chamber, and a second surface opposite the first surface. The ink jet head further comprises a first electrode on the second surface, a piezoelectric body overlapping the first electrode, a second electrode overlapping the piezoelectric body, and a protective film provided on the second surface. The inkjet head further comprises a nozzle in communication with the pressure chamber and configured to discharge ink, and a drive circuit provided on the mounting surface of the substrate and configured to apply a drive voltage to the first electrode or the second electrode to deform the piezoelectric body and to change a volume of the pressure chamber. 1. An ink jet head comprising:a substrate including amounting surface and a pressure chamber open to the mounting surface;a vibration plate including a first surface fixed to the mounting surface of the substrate and covering the pressure chamber, and a second surface opposite the first surface;a first electrode formed on the second surface of the vibration plate;a piezoelectric body overlapping the first electrode;a second electrode overlapping the piezoelectric body;a protective film provided on the second surface of the vibration plate and covering the first electrode, the piezoelectric body and the second electrode;a nozzle in communication with the pressure chamber, formed on at least one of the vibration plate and the protective film, and configured to discharge ink, anda drive circuit provided on the mounting surface of the substrate and configured to apply a drive voltage to the first electrode or the second electrode to deform the piezoelectric body and to change a volume of the pressure chamber.2. The ink jet head of claim 1 ,wherein the drive circuit includes a plurality of semiconductor devices ...

ACTIVE CLICHE FOR LARGE-AREA PRINTING, MANUFACTURING METHOD OF THE SAME, AND PRINTING METHOD USING THE SAME

Provided are a large-area nano-scale active printing device, a fabricating method of the same, and a printing method using the same. The printing device may include a substrate, first interconnection lines extending along a first direction, on the substrate, an interlayered dielectric layer provided on the first interconnection lines to have holes partially exposing the first interconnection lines, second interconnection lines provided adjacent to the holes in the interlayered dielectric layer to cross the first interconnection lines, and wedge-shaped electrodes provided at intersections with the first and second interconnection lines and connected to the first interconnection lines. The wedge-shaped electrodes protrude upward at centers of the holes. 1. A nano-scale printing device , comprising:a substrate;first interconnection lines extending along a first direction, on the substrate;an interlayered dielectric layer provided on the first interconnection lines to have holes partially exposing the first interconnection lines;second interconnection lines provided adjacent to the holes in the interlayered dielectric layer to cross the first interconnection lines; andwedge-shaped electrodes provided at intersections with the first and second interconnection lines and connected to the first interconnection lines, wherein the wedge-shaped electrodes protrude upward at centers of the holes.2. The device of claim 1 , wherein the wedge-shaped electrodes are shaped like a cone.3. The device of claim 2 , further comprising a tip provided at an end portion of the cone-shaped wedge-shaped electrode.4. The device of claim 3 , wherein the tip comprises a carbon nanotube.5. The device of claim 1 , wherein the wedge-shaped electrode comprises molybdenum.6. The device of claim 1 , wherein at least one of the second interconnection lines comprises a ring-shaped electrode surrounding the hole.7. The device of claim 6 , wherein the ring-shaped electrode has an internal diameter that is ...

LIQUID JETTING APPARATUS, ACTUATOR DEVICE, AND METHOD FOR PRODUCING LIQUID JETTING APPARATUS

A liquid jetting apparatus includes: a channel unit formed with a plurality of nozzles and a plurality of liquid channels communicating with the nozzles; an actuator including a plurality of drive sections, which are provided to correspond to the nozzles, include a plurality of connecting terminals, and are configured to apply jetting energy to a liquid in the liquid channels; and a flexible wiring member including a plurality of connecting portions joined to the plurality of connecting terminals of the actuator and a plurality of wires connected to the connecting portions. The wiring member includes a protrusion formed by bending a portion, different from a portion formed with the connecting portions, at which at least a part of the wires are formed, to project toward a side opposite to a connecting surface for connecting with the actuator. 1. A liquid jetting apparatus , comprising:a channel unit formed with a plurality of nozzles and a plurality of liquid channels communicating with the nozzles;an actuator including a plurality of drive sections, which are provided to correspond to the nozzles respectively, include a plurality of connecting terminals, and are configured to apply jetting energy to a liquid in the liquid channels; anda flexible wiring member including a plurality of connecting portions joined to the plurality of connecting terminals of the actuator respectively and a plurality of wires connected to the connecting portions respectively,wherein the wiring member includes a protrusion formed by bending a portion of the wiring member, which is different from a portion formed with the connecting portions and at which at least a part of the wires are formed, to project toward a side opposite to a connecting surface, of the wiring member, for connecting with the actuator.2. The liquid jetting apparatus according to claim 1 ,wherein the nozzles form a nozzle array extending in a predetermined first direction parallel to a connecting surface, of the ...