10-03-2022 дата публикации
Номер: US20220073246A1
Принадлежит:
A laminate has a substrate layer, an intermediate layer, and a fluorine-based resin layer in this order, and has a total film thickness of 400 μm or less, in which a thickness of the intermediate layer is 5 μm or more and 50 μm or less, and an upper yield point stress of the laminate is 1,500 N/cmor more. 1. A laminate comprising a substrate layer , an intermediate layer , and a fluorine-based resin layer in this order , and having a total film thickness of 400 μm or less ,whereina thickness of said intermediate layer is 5 μm or more and 50 μm or less,{'sup': '2', 'an upper yield point stress of said laminate is 1.5100 N/cmor more, and'}said substrate layer is any one of a polyethylene resin, a polypropylene resin, a polymethylpentene resin, a polyester-based resin, or a vinyl-based resin.2. The laminate according to claim 1 , wherein said fluorine-based resin layer contains polychlorotrifluoroethylene.3. The laminate according to claim 1 , wherein said intermediate layer consists of a polyethylene resin and a modified polyethylene resin.4. The laminate according to claim 1 , wherein the thickness of said intermediate layer is 10 μm or more and 30 μm or less.5. The laminate according to claim 1 , wherein a water vapor permeability of said laminate is 0.5 g/m/24 hours or less.6. A blister container comprising the laminate according to .7. A press-through package comprising the laminate according to . This application is a continuation of U.S. application Ser. No. 16/493,757 filed on Sep. 13, 2019, which is the National Phase of PCT/IB2018/000231 filed on Mar. 12, 2018, which, in turn, claimed the priority of Japanese Patent Application No. 2017-053663 which was filed on Mar. 17, 2017, the contents of which applications are incorporated herein by reference.The present invention relates to a laminate, a blister container, and a press-through package.A film laminate having high barrier properties is used in packaging materials for foods, medicines, and the like. In the ...
Подробнее