Micro scratch drive actuator

Nanopore array with electrode connectors protected from electrostatic discharge

A component (8) adapted to engage with a receiver (6) has an array of contact pads (16) to removably connect with a corresponding array of connectors (18) on the receiver (6). Each contact pad (16) of the array is electrically connected to the electrode (26) of a corresponding recess or well (28) that is part of a sensor, wherein a membrane is formable across each recess. A conductive grid (102) is configured between the contact pads (16) of the array, to inhibit an electrostatic discharge (BSD) conducting across the recesses or wells and/or direct an BSD away from the recesses or wells.

Isotachophoresis for purification of nucleic acids

The present disclosure relates to fluidic systems and devices for processing, extracting, or purifying one or more analytes. These systems and devices can be used for processing samples and extracting nucleic acids, for example by isotachophoresis. In particular, the systems and related methods can allow for extraction of nucleic acids, including non-crosslinked nucleic acids, from samples such as tissue or cells. The systems and devices can also be used for multiplex parallel sample processing.

SURFACE TREATMENT OF DEVICES MICROFLUIDIQUES

L'invention a pour objet un procédé de traitement de surface destiné à traiter les parois internes d'un microcanal formé dans un matériau polymère au moins partiellement photo-durci ou thermo-durci. Ce traitement est fait par irradiation sous oxygène à une longueur d'onde inférieure ou égale à 300 nm. L'invention a également pour objet un procédé de fabrication d'un dispositif microfluidique comprenant une telle étape de traitement de surface, et l'utilisation de ce procédé pour rendre au moins localement hydrophiles les parois d'un microcanal.

MICRO-MATERIAL ARRAY MANUFACTURING DEVICE USING SONIC WAVE VIBRATION AND MANUFACTURING METHOD THEREOF

The present invention provides a micro-material array using sonic wave vibration and a manufacturing method thereof. According to an embodiment, the micro-material array using sonic wave vibration comprises: a substrate; and a micro-material formed on the substrate in accordance with a micro-pattern structure having a two-dimensional stationary wave shape caused by sonic wave vibration. COPYRIGHT KIPO 2018 ...

Substrate device and sticking method

A substrate device includes a first substrate, a second substrate stacked on the first substrate, and a sticking piece. The first substrate contains a surface-modified area. The second substrate cooperates with the first substrate to define a space and contains a surface-modified area bound to the surface-modified area of the first substrate. The sticking piece is disposed into the space and is used to bind the first substrate to the second substrate. The substrate device in this invention has advantages of preventing separation of the first substrate and the second substrate due to external force and preventing entrance of moisture via an interface between the first substrate and the second substrate. The invention also provides a sticking method adapted for making the same.

Method to taylor mechanical properties on MEMS devices and nano-devices with multiple layer photoimageable dry film

A three-dimensional (“3D”) structure for handling fluids, a fluid handling device containing the 3D structure, and a method of making the 3D structure. The method includes providing a composite photoresist material that includes: (a) a first photoresist layer derived from a photoresist resin having a first chemical property selected from the group consisting of epoxide equivalent weight, aromatic content, and crosslink density and (b) at least a second photoresist layer derived from a photoresist resin having a second chemical property selected from the group consisting of epoxide equivalent weight, aromatic content, and crosslink density different from the first chemical property. The composite photoresist material is devoid of an adhesion promotion layer between layers of the composite photoresist material and the composite photoresist material has varying mechanical and/or physical properties through a thickness of the 3D structure.

NANOPORE ARRAY WITH ELECTRODE CONNECTORS PROTECTED FROM ELECTROSTATIC DISCHARGE

A component (8) adapted to engage with a receiver (6) has an array of contact pads (16) to removably connect with a corresponding array of connectors (18) on the receiver (6). Each contact pad (16) of the array is electrically connected to the electrode (26) of a corresponding recess or well (28) that is part of a sensor, wherein a membrane is formable across each recess. A conductive grid (102) is configured between the contact pads (16) of the array, to inhibit an electrostatic discharge (BSD) conducting across the recesses or wells and/or direct an BSD away from the recesses or wells.

SURFACE TREATMENT OF MICROFLUIDIC DEVICES

L'invention a pour objet un procédé de traitement de surface destiné à traiter les parois internes d'un microcanal formé dans un matériau polymère au moins partiellement photo-durci ou thermo-durci. Ce traitement est fait par irradiation sous air à une longueur d'onde inférieure ou égale à 300 nm. L'invention a également pour objet un procédé de fabrication d'un dispositif microfluidique comprenant une telle étape de traitement de surface.

Method and apparatus for energy conversion by liquid flows in polyelectrolyte-coated microchannels

METHOD FOR MANUFACTURING MEMS DEVICES AND NANO DEVICES WITH VARYING DEGREES OF HYDROPHOBICITY AND HYDROPHILICITY IN A COMPOSITE PHOTOIMAGEABLE DRY FILM

A three-dimensional (“3D”) structure for handling fluids, a fluid handling device containing the 3D structure, and a method of making the 3D structure. The method includes providing a composite photoresist material that includes: (a) a first layer devoid of a hydrophobicity agent and (b) at least a second layer comprising the hydrophobicity agent. The composite photoresist material is devoid of an adhesion promotion layer between layers of the composite photoresist material.

Substrate assembly and method of bonding substrates

A substrate assembly includes a first substrate, a second substrate and a bonding member. The first substrate includes a first surface-modified region having a functionality different from that of a remainder region of the first substrate. The second substrate includes a second surface-modified region connected to the first surface-modified region through a physical interaction and having a functionality different from that of a remainder region of the second substrate. The first and second substrates cooperatively define a space therebetween. The bonding member is disposed within said space to bond said first and second substrates together. A method for bonding substrates is also disclosed.

A low driving-voltage micro scratch drive actuator

AEROGEL-BASED MOLD FOR MEMS FABRICATION AND FORMATION, CAPABLE OF REDUCING TIME TO MANUFACTURE A MICRO ELECTRIC MACHINE CHARACTERISTIC PART

PURPOSE: An aerogel-based mold for MEMS fabrication and formation is provided to reduce time to manufacture a micro electric machine characteristic part by reducing time to form a patterned material layer. CONSTITUTION: An aerogel-based mold for MEMS fabrication and formation comprises an aerogel layer(11). The aerogel layer approximately has the thickness of 10 nm ~ 1 mm. The aerogel layer has a structural characteristic part having the same surface contour with a partial surface contour of a micro electric machine characteristic part and is evaporated on a substrate. © KIPO 2009 ...

Isotachophoresis for purification of nucleic acids

The present disclosure relates to fluidic systems and devices for processing, extracting, or purifying one or more analytes. These systems and devices can be used for processing samples and extracting nucleic acids, for example by isotachophoresis. In particular, the systems and related methods can allow for extraction of nucleic acids, including non-crosslinked nucleic acids, from samples such as tissue or cells. The systems and devices can also be used for multiplex parallel sample processing.

Method of fabricating micro scratch drive actuator

A method to decrease the driving voltage of a micro scratch drive actuator (SDA) includes using an ultra-low resistivity silicon wafer (0.001-0.004 L .cm) as substrate. The SDA fabricated on the ultra-low resistivity silicon wafer has a lower driving voltage of 4-12 Vo-p. A conventional SDA using normal silicon wafer needs higher driving voltage (30-75 Vo-p), thus has lower probability for commercial applications. The method further comprises reducing the line width of a bushing 32 and supporting beam of the SDA to further reduce the driving voltage. The method includes depositing an extra sacrificial layer 26 in order to reduce the line width of the bushing 32 and supporting beam from 2 žm to 1.5 žm.

ISOTACHOPHORESIS FOR PURIFICATION OF NUCLEIC ACIDS

The present disclosure relates to fluidic systems and devices for processing, extracting, or purifying one or more analytes. These systems and devices can be used for processing samples and extracting nucleic acids, for example by isotachophoresis. In particular, the systems and related methods can allow for extraction of nucleic acids, including non-crosslinked nucleic acids, from samples such as tissue or cells. The systems and devices can also be used for multiplex parallel sample processing.

INTEGRATED SENSOR TO MONITOR FLUID DELIVERY

A sensor for use in a fluid flow application is provided. The sensor includes an inlet chamber configured to receive a fluid flow from a first conduit, an outlet chamber configured to provide the fluid flow to a second conduit, and a membrane separating the inlet chamber from the outlet chamber, the membrane including a fluid passage to allow the fluid flow from the inlet chamber to the outlet chamber. The sensor also includes a circuit component disposed on the membrane, having an electrical property configured to change according to a deformation of the membrane, and a conductor formed on a substrate and coupled with the circuit component, to provide an electrical signal based on a change in the electrical property of the circuit component. The membrane includes an epitaxial layer formed on the substrate. Methods for fabricating and using the above sensor are also presented.

MEMS TRANSDUCER PACKAGE AND MEMS DEVICE COMPRISING SAME

A MEMS device according to the present technology comprises: a first substrate; a MEMS transducer package which comprises a MEMS transducer for outputting an electrical signal corresponding to the movement of a fluid and is mounted on the first substrate; and a semiconductor chip which is mounted on the first substrate and is for processing the electrical signal transmitted from the MEMS transducer. COPYRIGHT KIPO 2019 ...

MEMS PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREFOR

A micro-electro-mechanical system (MEMS) package structure and a method of fabricating the MEMS package structure. The MEMS package structure includes a MEMS die () and a device wafer (). A control unit and an interconnection structure () are formed in the device wafer (), and a first contact pad () is formed on a first surface () of the device wafer. The MEMS die () includes a micro-cavity (), a second contact pad () configured to be coupled to an external electrical signal, and a bonding surface (). The micro-cavity () of the MEMS die () is provided with a through hole () in communication with the exterior of the die. The MEMS die () is bonded to the first surface () by a bonding layer (), in which an opening () is formed. The first contact pad () is electrically connected to the second contact pad (), and a rewiring layer () is arranged on a second surface () opposing the first surface (). The MEMS package structure allows electrical interconnection between the MEMS die and the device wafer with a reduced package size, compared to those produced by existing integration techniques. In addition, a plurality of MEMS dies of the same or different structures and functions are allowed to be integrated on the same device wafer.

METHODS AND APPARATUS FOR CELL CULTURE ARRAY

Method and systems that provide improved handling and/or culturing and/or assaying of cells, chemically active beads, or similar materials in microfluidic systems and microfluidic culture arrays.

Microfluidic devices

SUBSTRATES COMPRISING NANO-PATTERNING SURFACES AND METHODS OF PREPARING THEREOF

Substrates comprising a functionalizable layer, a polymer layer comprising a plurality of micro-scale or nano-scale patterns, or combinations thereof, and a backing layer and the preparation thereof by using room-temperature UV nano-embossing processes are disclosed. The substrates can be prepared by a roll-to-roll continuous process. The substrates can be used as flow cells, nanofluidic or microfluidic devices for biological molecules analysis.

Substrate assembly and related methods

Example sensor apparatus for microfluidic devices and related methods are disclosed. In examples disclosed herein, a method of fabricating a sensor apparatus for a microfluidic device includes etching a portion of an intermediate layer to form a sensor chamber in a substrate assembly, where the substrate assembly has a base layer and the intermediate layer, and where the base layer comprises a first material and the intermediate layer comprises a second material different than the first material. The method includes forming a first electrode and a second electrode in the sensor chamber. The method also includes forming a fluidic transport channel in fluid communication with the sensor chamber, where the fluidic transport channel comprises a third material different than the first material and the second material.

THERMOFORMED, INJECTION MOLDED, AND/OR OVERMOLDED MICROFLUIDIC STRUCTURES AND TECHNIQUES FOR MAKING THE SAME

Static expansion method

A static expansion method is performed by expanding a volume of a testing gas from V0 to V0+V1 between a second chamber of the volume V1 which is connected to an upstream side of a measurement chamber and a first chamber of the volume V0 which is connected to an upstream side of the second chamber, wherein the first camber is in communication with the second chamber via a first valve, wherein the second chamber is in communication with the measurement chamber via each of a second valve and an orifice or porous plug, respectively. When the first valve is opened and the second valve is closed, the testing gas flows from the first chamber via the second chamber into the measurement chamber only through the orifice or porous plug.

Improved device, and components thereof

A component 8 for nanopore sensing, which may be disposed of after a single use, is removably connectable to a receiver (6, Fig. 7), which may be re-used. The component 8 comprises an array of electrodes 100 connected to recesses 28. The recesses are suitable in use for being filled with a fluid 32 such that a membrane with nanopores may form over the recesses, e.g. for DNA sequencing. A conductive structure 102 is provided across the electrodes 100 for minimizing the impact of electrostatic discharge (ESD) on the recesses. The conductive structure 102, e.g. a grid, does not obstruct an electrical connection between electrodes 100 on the component and corresponding connectors on the receiver. A finger 106 may provide an ESD. The conductive structure may alternatively be formed on top of raised walls extending between electrodes 100 (Fig. 16). The conductive structure may have rounded corners for minimising inductance.

SURFACE TREATMENT OF MICROFLUIDIC DEVICES

L'invention a pour objet un procédé de traitement de surface destiné à traiter les parois internes d'un microcanal formé dans un matériau polymère au moins partiellement photo-durci ou thermo-durci. Ce traitement est fait par irradiation sous air à une longueur d'onde inférieure ou égale à 300 nm. L'invention a également pour objet un procédé de fabrication d'un dispositif microfluidique comprenant une telle étape de traitement de surface.

SURFACE TREATMENT OF MICROFLUIDIC DEVICES

Micro-pump fluidic strategy for fabricating perovskite microwire array-based devices on semiconductor platforms and method

A method for making ion-crystal semiconductor material based micro- and/or nanowires, MNWs, embedded into a semiconductor substrate, includes forming a structure into the semiconductor substrate, wherein the structure has each of a width and a depth less than 10 μm; pumping an ion-crystal semiconductor material as an ion solution into the structure, wherein the pumping is achieved exclusively due to capillary forces; flowing the ion solution through the structure to fill the structure; crystallizing the ion-crystal semiconductor material inside the structure to form the MNWs; and adding electrodes to ends of the MNWs.

Microfluidic devices

A layer-by-layer deposition method for forming multiple layers of material onto the walls of a channel of a microfluidic device is disclosed. The method comprises: loading a tube with a series of segments of solution, a segment of solution bearing a material to be deposited; coupling the tube to the microfluidic device channel; and injecting the segments of solution into the microfluidic device using a syringe such that the segments of solution pass, in turn, through the channel depositing successive layers of material to perform layer-by-layer deposition onto the walls of the channel. The segments may be separated by water for rinsing the channel after deposition or air. Embodiments of the methods are particularly useful for automated surface modification of plastic, for example PDMS (Poly(dimethylsiloxane)), microchannels. Applications including inkjet printing, chemical or biochemical sensors, and lab-on-chip devices are disclosed.

Improved device and components thereof

Panel bonding method in microfluidic chip using release film

Aerogel-based mold for MEMS fabrication and formation thereof

The invention is directed to a patterned aerogel-based layer that serves as a mold for at least part of a microelectromechanical feature. The density of an aerogel is less than that of typical materials used in MEMS fabrication, such as poly-silicon, silicon oxide, single-crystal silicon, metals, metal alloys, and the like. Therefore, one may form structural features in an aerogel-based layer at rates significantly higher than the rates at which structural features can be formed in denser materials. The invention further includes a method of patterning an aerogel-based layer to produce such an aerogel-based mold. The invention further includes a method of fabricating a microelectromechanical feature using an aerogel-based mold. This method includes depositing a dense material layer directly onto the outline of at least part of a microelectromechanical feature that has been formed in the aerogel-based layer.

FLUID EJECTION DEVICE

The present disclosure is directed to a microfluidic die that includes ejection circuitry and one time programmable memory with a minimal number of contact pads to external devices. The die includes a relatively large number of nozzles and a relatively small number of contact pads. The die includes decoding circuitry that utilizes the small number of contact pads to control the drive and ejection of the nozzles and the reading/writing of the memory with the same contact pads.

Substrates comprising nano-patterning surfaces and methods of preparing thereof

Substrates comprising a functionalizable layer, a polymer layer comprising a plurality of micro-scale or nano-scale patterns, or combinations thereof, and a backing layer and the preparation thereof by using room-temperature UV nano-embossing processes are disclosed. The substrates can be prepared by a roll-to-roll continuous process. The substrates can be used as flow cells, nanofluidic or microfluidic devices for biological molecules analysis.

FLUIDIC SENSING ASSEMBLY WITH FLEXIBLE SUBSTRATE

A sensor assembly may include an integrated circuit die. A sensor assembly may include an interconnect connected to the integrated circuit die. A sensor assembly may include an interposer mounted over and connected to the interconnect. A sensor assembly may include a heating element disposed in or on the interposer. A sensor assembly may include a sensor configured to transduce a property of one or more sample fluids. A sensor assembly may include a thermal pathway between the sensor and the heating element.

Wafer-Level-Packaging von Festkörper-Biosensoren, Mikrofluidik und Silizium-Durchkontaktierung

Ein Biosensorsystem-Package umfasst: eine Transistorstruktur in einer Halbleiterschicht mit einer Vorderseite und einer Rückseite, wobei die Transistorstruktur eine Kanalregion umfasst; eine Mehrschichten-Interconnect-Struktur (MLI-Struktur) an der Vorderseite der Halbleiterschicht, wobei die Transistorstruktur elektrisch mit der MLI-Struktur verbunden ist; ein Trägersubstrat auf der MLI-Struktur; eine erste Substratdurchkontaktierungsstruktur (TSV-Struktur), die sich durch das Trägersubstrat erstreckt und konfiguriert ist, um eine elektrische Verbindung zwischen der MLI-Struktur und einem separaten Die bereitzustellen; eine vergrabene Oxidschicht (BOX-Schicht) an der Rückseite der Halbleiterschicht, wobei die vergrabene Oxidschicht eine Öffnung an der Rückseite der Kanalregion aufweist und eine Grenzflächenschicht die Rückseite über der Kanalregion bedeckt; und eine mikrofluidische Kanalkappenstruktur, die an der vergrabenen Oxidschicht angebracht ist.

Nanopore sensor component with electrostatic discharge protection

A low driving-voltage micro scratch drive actuator

SURFACE TREATMENT OF MICROFLUIDIC DEVICES

The invention relates to a surface treatment method for treating the inner walls of a microchannel made from a polymeric material that is at least partially photocured or thermoset. Said treatment is carried out via irradiation in the air at a wavelength of less than or equal to 300 nm. The invention also relates to a method for manufacturing a microfluidic device including such a surface treatment step.

Microfluidic devices

3D SCAFFOLD CONSISTING OF A BIOCOMPATIBLE POLYMER WITH A COLONISATION VOLUME OPEN AT THE TOP FOR BIOLOGICAL CELLS, AND WITH A CANAL-TYPE VESSEL SURROUNDING THE COLONISATION VOLUME

MICROFLUIDIC FUEL CELL HAVING MULTIPLE CHANNELS AND METHOD FOR IMPROVING THE PERFORMANCE OF THE SAME

Method for fabricating micro scratch drive actuator having low driving voltage using silicon substrate with ultra-low resistance

The present invention relates to a method for fabricating micro scratch drive actuator having low driving voltage using silicon substrate with ultra-low resistance. The method includes the following steps: adopting a silicon substrate with ultra-low resistance to substantially reduce the driving voltage of the micro scratch drive actuator. When the driving voltage of the conventional scratch drive actuator (SDA) is 30-75Vo-p, the present invention only needs 4-12Vo-p. In addition, the present invention provides a complete and stable component fabrication step and method, and uses precise fabrication parameters to overcome the 2 m line width limitation of the conventional lithography equipment so that the minimum line width of its component structure can achieve 1.5 m, thereby further reducing its driving voltage.

SURFACE TREATMENT OF MICROFLUIDIC DEVICES

Micro scratch drive actuator

To improve the yield, lifetime and driving voltage of the micro scratch drive actuator (SDA), there is disclosed a layout design including etch holes 1 and flange structure 3 designs. With etch holes 1 added to the layout of a conventional SDA plate, release of the structure layer can be accelerated and the accumulated residual charges in a front end of the SDA plate are reduced. A longer lifetime and lower driving voltage of the SDA device can be achieved. In addition, adding the flange structure 3 in a corner of the beam-to-plate conjunction can improve the flexural rigidity of the narrow polysilicon supporting beam 4 which further enhances yield of the SDA device and reduces crack failure under an actuating situation.

Substrates comprising nano-patterning surfaces and methods of preparing thereof

Substrates comprising a functionalizable layer, a polymer layer comprising a plurality of micro-scale or nano-scale patterns, or combinations thereof, and a backing layer and the preparation thereof by using room-temperature UV nano-embossing processes are disclosed. The substrates can be prepared by a roll-to-roll continuous process. The substrates can be used as flow cells, nanofluidic or microfluidic devices for biological molecules analysis.

미세 유체 필름 및 그 미세 유체 필름 제작방법

... 본 발명은 베이스 필름, 상기 베이스 필름 상에 형성되어 있으며, 유체가 유동되는 미세 채널 및 상기 베이스 필름을 관통하도록 형성되어 있으며, 상기 베이스 필름의 상부 또는 하부에 적층되는 베이스 필름과 유체가 연통되기 위한 관통 유로를 포함하는, 미세 유체 필름을 제공한다. 따라서 베이스 필름에 미세 채널 및 베이스 필름의 상부 또는 하부에 적층되는 다른 베이스 필름과 유체가 연통되기 위한 관통 유로가 모두 형성되어 있어서 적층되는 베이스 필름 간의 유체 이동이 가능한 장점이 있다.

POLYMERIC DEVICE FOR ELECTROPHYSIOLOGICAL RECORDINGS

The invention provides a microfluidic chip, suitable for recording ion-currents across the cell membrane of a living biological cell. The microfluidic chip is formed of a thermoplastic polymer. A method for the fabrication of such a chip via injection-moulding is also provided, as well as a microfluidic device comprising said microfluidic chip.

MICRO-PUMP FLUIDIC STRATEGY FOR FABRICATING PEROVSKITE MICROWIRE ARRAY-BASED DEVICES ON SEMICONDUCTOR PLATFORMS AND METHOD

A method for making ion-crystal semiconductor material based micro- and/or nanowires, MNWs, embedded into a semiconductor substrate, includes forming a structure into the semiconductor substrate, wherein the structure has each of a width and a depth less than 10 μm; pumping an ion-crystal semiconductor material as an ion solution into the structure, wherein the pumping is achieved exclusively due to capillary forces; flowing the ion solution through the structure to fill the structure; crystallizing the ion-crystal semiconductor material inside the structure to form the MNWs; and adding electrodes to ends of the MNWs.

Integrated sensor to monitor fluid delivery

A sensor for use in a fluid flow application is provided. The sensor includes an inlet chamber configured to receive a fluid flow from a first conduit, an outlet chamber configured to provide the fluid flow to a second conduit, and a membrane separating the inlet chamber from the outlet chamber, the membrane including a fluid passage to allow the fluid flow from the inlet chamber to the outlet chamber. The sensor also includes a circuit component disposed on the membrane, having an electrical property configured to change according to a deformation of the membrane, and a conductor formed on a substrate and coupled with the circuit component, to provide an electrical signal based on a change in the electrical property of the circuit component. The membrane includes an epitaxial layer formed on the substrate. Methods for fabricating and using the above sensor are also presented.

METHOD FOR MANUFACTURING PAPER-BASED DIGITAL MICROFLUIDICS PLATFORM

Aerogel-bases mold for MEMS fabrication and formation thereof

The invention is directed to a patterned aerogel-based layer that serves as a mold for at least part of a microelectromechanical feature. The density of an aerogel is less than that of typical materials used in MEMS fabrication, such as poly-silicon, silicon oxide, single-crystal silicon, metals, metal alloys, and the like. Therefore, one may form structural features in an aerogel-based layer at rates significantly higher than the rates at which structural features can be formed in denser materials. The invention further includes a method of patterning an aerogel-based layer to produce such an aerogel-based mold. The invention further includes a method of fabricating a microelectromechanical feature using an aerogel-based mold. This method includes depositing a dense material layer directly onto the outline of at least part of a microelectromechanical feature that has been formed in the aerogel-based layer.

SUBSTRATE ASSEMBLY AND RELATED METHODS

A method of micro patterning using continuous wave laser beam

AEROGEL-BASED MOLD FOR MEMS FABRICATION AND FORMATION THEREOF

The invention is directed to a patterned aerogel-based layer that serves as a mold for at least part of a microelectromechanical feature. The density of an aerogel is less than that of typical materials used in MEMS fabrication, such as poly-silicon, silicon oxide, single-crystal silicon, metals, metal alloys, and the like. Therefore, one may form structural features in an aerogel-based layer at rates significantly higher than the rates at which structural features can be formed in denser materials. The invention further includes a method of patterning an aerogel-based layer to produce such an aerogel-based mold. The invention further includes a method of fabricating a microelectromechanical feature using an aerogel-based mold. This method includes depositing a dense material layer directly onto the outline of at least part of a microelectromechanical feature that has been formed in the aerogel-based layer.

Isotachophoresis for purification of nucleic acids

The present disclosure relates to fluidic systems and devices for processing, extracting, or purifying one or more analytes. These systems and devices can be used for processing samples and extracting nucleic acids, for example by isotachophoresis. In particular, the systems and related methods can allow for extraction of nucleic acids, including non-crosslinked nucleic acids, from samples such as tissue or cells. The systems and devices can also be used for multiplex parallel sample processing.

A MICROFLUIDIC SENSOR

A microfluidic sensor comprising: a first substrate; a second substrate; a cavity formed between the first substrate and the second substrate, the cavity comprising a reservoir portion and a channel portion extending from the reservoir portion; a capacitive element disposed between the first substrate and the second substrate, the capacitive element being at least partially disposed in the channel portion of the cavity; and a dielectric sensing liquid provided in the reservoir portion. Upon application of a force to the first substrate adjacent the reservoir portion, the reservoir portion is configured to deform and displace the sensing liquid along the channel portion, so as to change the capacitance of the capacitive element within the channel portion.

SYSTEMS AND METHODS FOR FABRICATING 3D SOFT MICROSTRUCTURES

Systems and methods for fabricating 3D soft microstructures. The system comprises injecting a pressurized, curable liquid into certain structural layers induces folding and allows the 2D structures to reconfigure into a 3D form In addition to the injection of a curable liquid that permanently reconfigures the structure of the system, in an embodiment this method also allows for the injection of other liquids into certain actuator layers that enable motion in certain portions of the system Furthermore, the system allows for handling of colored fluids that are passed to visualization layers. The method of creating such a system depends on taking advantage of laser machining of the individual layers to influence the behavior of how different portions bend and move. 1. A soft microstructure , comprising: at least one structural actuator configured to accept a phase-changing material to convert the structural actuator into a permanent structural element by self-folding a portion of the microstructure to form a three dimensional structure from a two dimensional structure, and', 'at least one functional actuator configured to accept an inert working fluid to allow for motion of the 3D structure formed by the at least one structural actuator., 'a plurality of elastomeric layers with fluidic networks formed between at least two of the elastomeric layers, at least one of the elastomeric layers comprising2. The soft microstructure of claim 1 , wherein any of the plurality of elastomeric layers contains at least one structural actuator or at least one functional actuator or both at least one structural actuator and the at least one functional actuator.3. The soft microstructure of claim 1 , wherein the phase-changing material is a curable material that is configured to cause self-folding into a three dimensional structure as the curable material cures.4. The soft microstructure of claim 1 , wherein the phase-changing material is a functional material such that the three ...

Integrated sensor to monitor fluid delivery

A sensor for use in a fluid flow application is provided. The sensor includes an inlet chamber configured to receive a fluid flow from a first conduit, an outlet chamber configured to provide the fluid flow to a second conduit, and a membrane separating the inlet chamber from the outlet chamber, the membrane including a fluid passage to allow the fluid flow from the inlet chamber to the outlet chamber. The sensor also includes a circuit component disposed on the membrane, having an electrical property configured to change according to a deformation of the membrane, and a conductor formed on a substrate and coupled with the circuit component, to provide an electrical signal based on a change in the electrical property of the circuit component. The membrane includes an epitaxial layer formed on the substrate. Methods for fabricating and using the above sensor are also presented.

CHIP FOR MICROFLUIDIC DEVICE, MICROFLUIDIC DEVICE USING THE SAME AND METHOD FOR MANUFACTURING MICROFLUIDIC DEVICE AND MICROFLUIDIC DEVICE USING THE SAME

IMPLANTABLE LEAD FOR COMPLEX INNERVATION AND METHOD OF MANUFACTURING SAME

The present invention relates to an implantable lead for complex innervation and a method for manufacturing the implantable lead for complex innervations that is combined as a composite body of a flexible pipe into which a micro channel for chemical injection is inserted and a micro thin film electrode (or micro electrode thin film bundle) manufactured through a microelectromechanical system (MEMS) manufacturing process. According to the present invention, chemical injection and electrical stimulation can be performed at the same time with the single lead. The present invention includes: the pipe that has the micro channel for chemical injection; a line electrode fixed to and fusion-packaged on the outside of the pipe and electrically stimulating a selected part of a living body; and a plurality of electrode terminals provided at a predetermined distance in an end portion of the pipe. According to the present invention, bio-signal measurement and electrical stimulation with respect to various ...

ISOTACHOPHORESIS FOR PURIFICATION OF NUCLEIC ACIDS

Fluid ejection device

Fluid ejection device is disclosed here. The utility model relates to a fluid ejection device includes: the nude film, the nude film includes: a plurality of cavitys, a plurality of nozzles, multipleheaters, multiple heaters with a plurality of cavitys are in relevancy, a plurality of drive circuit, every drive circuit coupling extremely among the multiple heaters at least two, and a plurality ofdisposable programmable memory positions, every memory position is in relevancy with every drive circuit.

Integrated sensor to monitor fluid delivery

A sensor for use in a fluid flow application is provided. The sensor includes an inlet chamber configured to receive a fluid flow from a first conduit, an outlet chamber configured to provide the fluid flow to a second conduit, and a membrane separating the inlet chamber from the outlet chamber, the membrane including a fluid passage to allow the fluid flow from the inlet chamber to the outlet chamber. The sensor also includes a circuit component disposed on the membrane, having an electrical property configured to change according to a deformation of the membrane, and a conductor formed on a substrate and coupled with the circuit component, to provide an electrical signal based on a change in the electrical property of the circuit component. The membrane includes an epitaxial layer formed on the substrate. Methods for fabricating and using the above sensor are also presented.

Aerogel-Based Mold for MEMS Fabrication and Formation Thereof

The invention is directed to a patterned aerogel-based layer that serves as a mold for at least part of a microelectromechanical feature. The density of an aerogel is less than that of typical materials used in MEMS fabrication, such as poly-silicon, silicon oxide, single-crystal silicon, metals, metal alloys, and the like. Therefore, one may form structural features in an aerogel-based layer at rates significantly higher than the rates at which structural features can be formed in denser materials. The invention further includes a method of patterning an aerogel-based layer to produce such an aerogel-based mold. The invention further includes a method of fabricating a microelectromechanical feature using an aerogel-based mold. This method includes depositing a dense material layer directly onto the outline of at least part of a microelectromechanical feature that has been formed in the aerogel-based layer.

복합신경 자극용 이식형 리드 및 그 제조방법

... 본 발명은 미소 박막 전극을 멤스(MEMS)공정을 기반으로 제작하는 단계;액상의 생체적합성 폴리머를 이용하여 내부에 약물 주입용 미소 채널을 가지는 관을 제작하는 단계; 및 상기 미소 박막 전극을 상기 관 외부에 고정시킨 후 고정 융합시켜 패키징화하는 단계; 를 포함하고, 상기 미소 박막 전극이 부착된 미소 채널을 가지는 관을 몰드에 삽입시킨 후 액상의 생체적합성 폴리머를 주입시켜 몰딩되도록 하는 단계를 더 포함하는 것을 특징으로 한다.

APPARATUS FOR MEASURING FLOW RATE

LAB ON A CHIP HAVING MICRO INJECTOR AND PRODUCT METHOD THEREOF AND USING METHOD THEREOF

LAB ON A CHIP HAVING MICRO INJECTOR AND PRODUCT METHOD THEREOF AND USING METHOD THEREOF

SUBSTRATES COMPRISING NANO-PATTERNING SURFACES AND METHODS OF PREPARING THEREOF

Substrates comprising a functionalizable layer, a polymer layer comprising a plurality of micro-scale or nano-scale patterns, or combinations thereof, and a backing layer and the preparation thereof by using room-temperature UV nano-embossing processes are disclosed. The substrates can be prepared by a roll-to-roll continuous process. The substrates can be used as flow cells, nanofluidic or microfluidic devices for biological molecules analysis.

MICROFLUIDIC CHANNELS IN A SUBSTRATE WITH A SURFACE COVERED BY A LAYER STACK

Structures for a microfluidic channel and methods of forming a structure for a microfluidic channel. The structure comprises a semiconductor substrate including a trench and a layer stack on the semiconductor substrate. The layer stack includes a first layer, a second layer between the first layer and the semiconductor substrate, and an opening penetrating through the first layer and the second layer to the trench. The structure further comprises a third layer inside the opening in the layer stack. The third layer, which comprises a semiconductor material, obstructs the opening to define a cavity inside the trench.

CHIP FOR MICROFLUIDIC DEVICE, MICROFLUIDIC DEVICE USING THE SAME AND METHOD FOR MANUFACTURING MICROFLUIDIC DEVICE AND MICROFLUIDIC DEVICE USING THE SAME

SURFACE TREATMENT OF MICROFLUIDIC DEVICES

The invention relates to a surface treatment method for treating the inner walls of a microchannel made from a polymeric material that is at least partially photocured or thermoset. Said treatment is carried out via irradiation in the air at a wavelength of less than or equal to 300 nm. The invention also relates to a method for manufacturing a microfluidic device including such a surface treatment step.

Substrate assembly and related methods

Example sensor apparatus for microfluidic devices and related methods are disclosed. In examples disclosed herein, a method of fabricating a sensor apparatus for a microfluidic device includes etching a portion of an intermediate layer to form a sensor chamber in a substrate assembly, where the substrate assembly has a base layer and the intermediate layer, and where the base layer comprises a first material and the intermediate layer comprises a second material different than the first material. The method includes forming a first electrode and a second electrode in the sensor chamber. The method also includes forming a fluidic transport channel in fluid communication with the sensor chamber, where the fluidic transport channel comprises a third material different than the first material and the second material.

Fluid ejection device

The present disclosure is directed to a microfluidic die that includes ejection circuitry and one time programmable memory with a minimal number of contact pads to external devices. The die includes a relatively large number of nozzles and a relatively small number of contact pads. The die includes decoding circuitry that utilizes the small number of contact pads to control the drive and ejection of the nozzles and the reading/writing of the memory with the same contact pads.

Connected field effect transistors

Examples include a fluidic die. The fluidic die comprises an array of field effect transistors including field effect transistors of a first size and field effect transistors of a second size. At least one connecting member interconnects at least some of the field effect transistors of the array of field effect transistors. The fluidic die further comprises a first fluid actuator connected to a first set of field effect transistors having at least one field effect transistor of the first size. The die includes a second fluid actuator connected to a second respective set of field effect transistors having a first respective field effect transistor of the second size interconnected to at least one other field effect transistor of the array.

미세 유체 농도장 생성 장치, 그 미세 유체 농도장 생성 장치 제작방법 및 유체 유동 장치

... 본 발명은 기판, 상기 기판 상에 배치되는 베이스 필름, 상기 기판과 상기 베이스 필름 사이 공간에 형성되어 있으며, 유체가 유동되는 미세 채널, 상기 미세 채널과 연통되어 있고, 상기 베이스 필름을 관통하도록 형성되어 있는 관통 유로 및 상기 미세 채널과 상기 관통 유로가 연통되는 부분에 형성되되, 상기 미세 채널 및 상기 관통 유로를 따라 유동하는 유체 또는 상기 유체와 함께 유동하는 물질을 선택적으로 통과할 수 있도록 하는 멤브레인을 포함하고, 상기 멤브레인에 의하여 상기 관통 유로의 유체와 상기 미세 채널의 유체 사이에 농도장이 형성되는, 미세 유체 농도장 생성 장치를 제공한다. 따라서 미세 채널과 관통 유로가 연통되는 부분에 형성되는 멤브레인에 의해 픽셀화된 농도장 생성이 가능한 장점이 있다.

INTEGRATED SENSOR TO MONITOR FLUID DELIVERY

A sensor for use in a fluid flow application is provided. The sensor includes an inlet chamber configured to receive a fluid flow from a first conduit, an outlet chamber configured to provide the fluid flow to a second conduit, and a membrane separating the inlet chamber from the outlet chamber, the membrane including a fluid passage to allow the fluid flow from the inlet chamber to the outlet chamber. The sensor also includes a circuit component disposed on the membrane, having an electrical property configured to change according to a deformation of the membrane, and a conductor formed on a substrate and coupled with the circuit component, to provide an electrical signal based on a change in the electrical property of the circuit component. The membrane includes an epitaxial layer formed on the substrate. Methods for fabricating and using the above sensor are also presented.

PRODUCT METHOD OF LAB ON A CHIP

ISOTACHOPHORESIS FOR PURIFICATION OF NUCLEIC ACIDS

The present disclosure relates to fluidic systems and devices for processing, extracting, or purifying one or more analytes. These systems and devices can be used for processing samples and extracting nucleic acids, for example by isotachophoresis. In particular, the systems and related methods can allow for extraction of nucleic acids, including non-crosslinked nucleic acids, from samples such as tissue or cells. The systems and devices can also be used for multiplex parallel sample processing.

CONNECTED FIELD EFFECT TRANSISTORS

Examples include a fluidic die. The fluidic die comprises an array of field effect transistors including field effect transistors of a first size and field effect transistors of a second size. At least one connecting member interconnects at least some of the field effect transistors of the array of field effect transistors. The fluidic die further comprises a first fluid actuator connected to a first set of field effect transistors having at least one field effect transistor of the first size. The die includes a second fluid actuator connected to a second respective set of field effect transistors having a first respective field effect transistor of the second size interconnected to at least one other field effect transistor of the array.

3D-Gerüst aus biokompatiblem Polymer mit einem nach oben offenen Besiedlungsraum für biologische Zellen und mit einem den Besiedlungsraum umgebenden kanalförmigen Gefäß

Die Erfindung betrifft ein 3D-Gerüst (3-dimensionales Gerüst) aus biokompatiblem Polymer, das Folgendes aufweist: eine zur Oberseite des 3D-Gerüsts hin offene Vertiefung als Besiedlungsraum für biologische Zellen, ein kanalförmiges Gefäß im Inneren des 3D-Gerüsts, das den Besiedlungsraum zumindest teilweise umgibt, eine Einfüllöffnung für das kanalförmige Gefäß und eine Auslassöffnung für das kanalförmige Gefäß. Weiterhin betrifft die vorliegende Erfindung die Herstellung des erfindungsgemäßen 3D-Gerüsts sowie dessen Verwendung zum Besiedeln des Besiedlungsraums mit biologischen Zellen.

BIOSENSORSYSTEM MIT INTEGRIERTER MIKRONADEL

Ein Biosensorsystem-Package weist auf: eine Transistorstruktur in einer Halbleiterschicht mit einer Vorderseite und einer Rückseite, wobei die Transistorstruktur einen Kanalbereich aufweist; eine vergrabene Oxidschicht (BOX-Schicht) auf der Rückseite der Halbleiterschicht, wobei die vergrabene Oxidschicht eine Öffnung an der Rückseite des Kanalbereichs aufweist und eine Grenzflächenschicht die Rückseite über dem Kanalbereich bedeckt; eine mehrschichtige Interconnect-Struktur (MLI-Struktur) auf der Vorderseite der Halbleiterschicht, wobei die Transistorstruktur mit der MLI-Struktur elektrisch verbunden ist; und eine Kappenstruktur angebracht an der vergrabenen Oxidschicht, wobei die Kappenstruktur eine Mikronadel aufweist.

NANOPORE ARRAY WITH ELECTRODE CONNECTORS PROTECTED FROM ELECTROSTATIC DISCHARGE

A component (8) adapted to engage with a receiver (6) has an array of contact pads (16) to removeably connect with a corresponding array of connectors (18) on the receiver (6). Each contact pad (16) of the array is electrically connected to the electrode (26) of a corresponding recess or well (28) that is part of a sensor, wherein a membrane is formable across each recess. A conductive grid (102) is configured between the contact pads (16) of the array, to inhibit an electrostatic discharge (ESD) conducting across the recesses or wells and/or direct an ESD away from the recesses or wells.

Mikro-Scratch-Antrieb-Aktuator mit niedriger Betriebsspannung

Auf der Basis der Spannungsteilungstheorie wird mit der Erfindung ein neues Verfahren vorgeschlagen, um die Betriebsspannung eines Mikro-Scratch-Antrieb-Aktuators (SDA) zu verringern, indem ein Silizium-Wafer mit sehr niedrigem spezifischen Widerstand als Substrat verwendet wird. Es wurden zwei SDA-Aktuatoren mit dem gleichen Layout und den gleichen Herstellungsprozessen verglichen, die jedoch unterschiedliche spezifische Widerstände des Substrates aufwiesen. Die SDA-Anordnung mit einem Silizium-Wafer mit sehr niedrigem spezifischen Widerstand zeigte hierbei eine niedrigere Betriebsspannung bei lediglich um 4 bis 12 V_o-p. Eine konventionelle SDA-Anordnung mit einem üblichen Silizium-Wafer benötigt eine höhere Betriebsspannung (30 bis 75 V_o-p), sodass hier eine geringere Wahrscheinlichkeit für kommerzielle Anwendungen vorliegt. Zusätzlich wird mit der Erfindung ein neues SDA-Verfahren angegeben, um die inhärente Länge/Breite-Beschränkung von 2 µm von konventionellen ...

미세 유체 모듈 및 그 미세 유체 모듈 제작방법

... 본 발명은 제1베이스 필름, 상기 제1베이스 필름 상에 형성되어 있으며, 유체가 유동되는 제1미세 채널, 상기 제1베이스 필름을 관통하도록 형성되어 있는 제1관통 유로를 포함하는 제1미세 유체 필름 및 상기 제1베이스 필름 상에 적층되는 제2베이스 필름, 및 상기 제2베이스 필름을 관통하도록 형성되어 있으며, 상기 제1관통 유로와 연통되는 제2관통 유로를 포함하는 제2미세 유체 필름을 포함하는, 미세 유체 모듈을 제공한다. 따라서 베이스 필름에 미세 채널 및 베이스 필름의 상부 또는 하부에 적층되는 다른 베이스 필름과 유체가 연통되기 위한 관통 유로가 모두 형성되어 있어서 적층되는 베이스 필름 간의 유체 이동이 가능한 장점이 있다.

ISOTACHOPHORESIS FOR PURIFICATION OF NUCLEIC ACIDS

The present disclosure relates to fluidic systems and devices for processing, extracting, or purifying one or more analytes. These systems and devices can be used for processing samples and extracting nucleic acids, for example by isotachophoresis. In particular, the systems and related methods can allow for extraction of nucleic acids, including non-crosslinked nucleic acids, from samples such as tissue or cells. The systems and devices can also be used for multiplex parallel sample processing.

ISOTACHOPHORESIS FOR PURIFICATION OF NUCLEIC ACIDS

The present disclosure relates to fluidic systems and devices for processing, extracting, or purifying one or more analytes. These systems and devices can be used for processing samples and extracting nucleic acids, for example by isotachophoresis. In particular, the systems and related methods can allow for extraction of nucleic acids, including non-crosslinked nucleic acids, from samples such as tissue or cells. The systems and devices can also be used for multiplex parallel sample processing.

MEMS package

A package includes a support structure having an electrically insulating material, a microelectromechanical system (MEMS) component, a cover structure having an electrically insulating material and mounted on the support structure for at least partially covering the MEMS component, and an electronic component embedded in one of the support structure and the cover structure. At least one of the support structure and the cover structure has or provides an electrically conductive contact structure.

SUBSTRATE ASSEMBLY AND METHOD OF BONDING SUBSTRATES

A substrate assembly includes a first substrate, a second substrate and a bonding member. The first substrate includes a first surface-modified region having a functionality different from that of a remainder region of the first substrate. The second substrate includes a second surface-modified region connected to the first surface-modified region through a physical interaction and having a functionality different from that of a remainder region of the second substrate. The first and second substrates cooperatively define a space therebetween. The bonding member is disposed within said space to bond said first and second substrates together. A method for bonding substrates is also disclosed. 1. A substrate assembly , comprising:a first substrate including a first surface-modified region, which has a functionality different from that of a remainder region of said first substrate,a second substrate including a second surface-modified region connected to said first surface-modified region through a physical interaction, and having a functionality different from that of a remainder region of said second substrate, said first and second substrates cooperatively defining a space therebetween; anda bonding member disposed within said space to bond said first and second substrates together.2. The substrate assembly as claimed in claim 1 , wherein:said second substrate is formed with a recess, said recess being defined by a recess-defining surface that has a second connecting surface and a surrounding surface extending upwardly from said second connecting surface, said second connecting surface having said second surface-modified region; andsaid first substrate is disposed within said recess and further includes a first connecting surface and a first peripheral surface connected to and angularly extending from said first connecting surface, said first connecting surface having said first surface-modified region, said first peripheral surface and said recess-defining surface ...

Aerogel-based mold for MEMS fabrication and formation thereof

The invention is directed to a patterned aerogel-based layer that serves as a mold for at least part of a microelectromechanical feature. The density of an aerogel is less than that of typical materials used in MEMS fabrication, such as poly-silicon, silicon oxide, single-crystal silicon, metals, metal alloys, and the like. Therefore, one may form structural features in an aerogel-based layer at rates significantly higher than the rates at which structural features can be formed in denser materials. The invention further includes a method of patterning an aerogel-based layer to produce such an aerogel-based mold. The invention further includes a method of fabricating a microelectromechanical feature using an aerogel-based mold. This method includes depositing a dense material layer directly onto the outline of at least part of a microelectromechanical feature that has been formed in the aerogel-based layer.

MICROFLUIDIC DEVICES

We describe a method of layer-by-layer deposition of a plurality of layers of material onto the wall or walls of a channel of a microfluidic device, the method comprising: loading a tube with a series of segments of solution, a said segment of solution bearing a material to be deposited; coupling said tube to said microfluidic device; and injecting said segments of solution into said microfluidic device such that said segments of solution pass, in turn, through said channel depositing successive layers of material to perform said layer-by-layer deposition onto said wall or walls of said channel. Embodiments of the methods are particularly useful for automated surface modification of plastic, for example PDMS (Poly(dimethylsiloxane)), microchannels. We also describe methods and apparatus for forming double-emulsions.

VERBUNDFEDERSTRUKTUR ZUR ERHÖHUNG VON MECHANISCHER BELASTBARKEIT EINER MEMS-VORRICHTUNG

Verschiedene Ausführungsformen der vorliegenden Offenbarung betreffen eine Mikroelektromechanische-Systeme-Struktur (MEMS-Struktur), die eine Verbundfeder aufweist. Ein erstes Substrat liegt unter einem zweiten Substrat. Ein drittes Substrat liegt über dem zweiten Substrat. Das erste, zweite und dritte Substrat definieren mindestens teilweise einen Hohlraum. Das zweite Substrat umfasst eine bewegliche Masse in dem Hohlraum und zwischen dem ersten und dem dritten Substrat. Die Verbundfeder erstreckt sich von einer Randregion des zweiten Substrats bis zu der beweglichen Masse. Die Verbundfeder ist so konfiguriert, dass sie die bewegliche Masse in dem Hohlraum aufhängt. Die Verbundfeder umfasst eine erste Federschicht, die eine erste Kristallorientierung aufweist, und eine zweite Federschicht, die eine zweite Kristallorientierung aufweist, die sich von der ersten Kristallorientierung unterscheidet.

FLUID EJECTION DEVICE

The present disclosure is directed to a microfluidic die that includes ejection circuitry and one time programmable memory with a minimal number of contact pads to external devices. The die includes a relatively large number of nozzles and a relatively small number of contact pads. The die includes decoding circuitry that utilizes the small number of contact pads to control the drive and ejection of the nozzles and the reading/writing of the memory with the same contact pads. 1. A device , comprising: a plurality of chambers;', 'a plurality of nozzles;', 'a plurality of heaters that, in operation, heats the plurality of chambers;', 'a plurality of driving circuits, each driving circuit electrically coupled to at least two of the plurality of heaters, each driving circuit, in operation, provides a driving signal to the at least two of the plurality of heaters; and', 'a plurality of one time programmable memory bits, each memory bit associated with each driving circuit., 'a die that includes2. The device of claim 1 , further comprising a plurality of contact pads that include a first plurality of selection contact pads and a second plurality of selection contact pads.3. The device of wherein a ratio of a number of driving circuits to a number of first plurality of selection contact pads is in a range of 20:3 and 10:1.4. The device of wherein each driving circuit includes:a first transistor coupled to the first plurality of selection contact pads;a second transistor coupled to the first plurality of selection contact pads;a third transistor coupled to the first plurality of selection contact pads;a fourth transistor coupled between the first transistor and ground;a fifth transistor coupled between the second transistor and ground; anda sixth transistor coupled between the third transistor and ground.5. The device of wherein a gate of the first transistor is coupled to the first plurality of selection contact pads claim 4 , a first terminal of the first transistor is ...

DETECTION SYSTEM AND METHOD FOR PRODUCING SAME

A method for producing a detection system for biomolecules in a medium involves providing a first detector section having a first channel region and a second detector section having a second channel region. A membrane having at least one pore is provided and the first detector section and the second detector section are arranged on opposite sides of the membrane, such that at least part of the first channel region and the second channel region are separated by the membrane and the first channel region and the second channel region are connected to each another to form a channel system, in order to form a flow path for the medium through the at least one pore of the membrane. Along the flow path, through the membrane, bioreceptors are bound and/or coupled to the membrane in order to determine a concentration of the biomolecules in the medium by means of a measurement of the flow along the flow path.

Method for producing a stamp for hot embossing

The present invention provides a process for producing a stamp for hot embossing (HE). The stamp can be constructed from any photo-resist epoxy that is stable at temperatures equal to the glass transition temperature (T g ) of the material to be stamped. The stamp can be used repeatedly without significant distortion of features. The stamp benefits from low relative cost, high fidelity of features in all three-dimensions and fast construction. The process for producing a stamp for hot embossing from a resist, comprising the steps of producing a seed layer L 1 from a selected photoresist polymer material, soft baking the seed layer L 1 , exposing said seed layer L 1 to initiate cross-linking and then post-exposure bake L 1 to fully cross-link it, coating the cross-linked seed layer L 1 with a second photoresist polymer layer L 2 ; soft baking the second photoresist polymer layer L 2 ; applying a mask to the top surface of the soft baked layer L 2 and illuminating the unmasked portions of the soft baked layer L 2 with UV radiation through the mask, wherein the exposed areas form the pattern of the embossing features, washing away un-exposed regions of the photoresist with a developer to leave behind a relief pattern formed in the second photoresist polymer layer L 2 , which relief pattern corresponds to a pattern in the mask.

Bonded Microelectromechanical Assemblies

A MEMS device is described that has a body with a component bonded to the body. The body has a main surface and a side surface adjacent to the main surface and smaller than the main surface. The body is formed of a material and the side surface is formed of the material and the body is in a crystalline structure different from the side surface. The body includes an outlet in the side surface and the component includes an aperture in fluid connection with the outlet.

Channel and method of forming channels

A device is made by forming sacrificial fibers on a substrate mold. The fibers and mold are covered with a first material. The substrate mold is removed, and the covered fibers are then removed to form channels in the first material.

Resin bonding method by photoirradiation, method for producing resin article, resin article produced by the same method, method for producing microchip, and microchip produced by the same method

A resin bonding method according to the present invention is a resin bonding method for bonding a first resin and a second resin including (I) a step of irradiating spaces containing oxygen molecules with vacuum ultraviolet light having a wavelength of 175 nm or less, the spaces being in contact with surfaces of the first and second resins; and (II) a step of, after the irradiation, subjecting the surfaces to temperature rise while the surfaces are in contact with each other, to bond the first resin and the second resin together with the surfaces serving as bonding surfaces. In the step (I), the surfaces of the first and second resins may be further irradiated with the vacuum ultraviolet light. In this case, a light amount of the vacuum ultraviolet light having reached the surfaces is preferably, for example, 0.1 J/cm 2 or more and 10 J/cm 2 or less.

Polyhedral oligomeric silsesquioxane compositions, methods of using these compositions, and structures including these compositions

Embodiments of the present disclosure include functionalized polyhedral oligomeric silsesquioxane compositions or mixtures, methods of using functionalized polyhedral oligomeric silsesquioxane compositions, structures including functionalized polyhedral oligomeric silsesquioxane, and the like.

Microfabricated elastomeric valve and pump systems

A method of fabricating an elastomeric structure, comprising: forming a first elastomeric layer on top of a first micromachined mold, the first micromachined mold having a first raised protrusion which forms a first recess extending along a bottom surface of the first elastomeric layer; forming a second elastomeric layer on top of a second micromachined mold, the second micromachined mold having a second raised protrusion which forms a second recess extending along a bottom surface of the second elastomeric layer; bonding the bottom surface of the second elastomeric layer onto a top surface of the first elastomeric layer such that a control channel forms in the second recess between the first and second elastomeric layers; and positioning the first elastomeric layer on top of a planar substrate such that a flow channel forms in the first recess between the first elastomeric layer and the planar substrate.

Method of manufacturing liquid ejection head substrate

A liquid ejection head substrate including a silicon substrate having a liquid supply port as hollow and slots as through holes connecting the hollow and a liquid channel arranged opposite sides of the substrate. The method includes etching the substrate to form the hollow; forming a first resist on the hollow; etching the first resist on the bottom of the hollow under conditions of securing an equal etching rate to both the silicon substrate and the first resist; forming a second resist on the hollow; patterning the second resist into an etching mask; and etching the substrate using the etching mask to form the through holes.

Method for fabricating a microarray of soft materials

A method for fabricating a microarray of plural soft materials includes: vapor-depositing a first layer poly(para-xylylene) resin on a substrate, forming a first micro pattern in the poly(para-xylylene) resin; obtaining a substrate including a first microarray formed by pouring a first soft material solution, freeze-drying the first soft material to obtain a micro-arrayed substrate of the freeze-dried first soft material; vapor-depositing a second layer poly(para-xylylene) resin on the micro-arrayed substrate of the freeze-dried first soft material, forming a second micro pattern placed differently from the first micro pattern by penetrating the poly(para-xylylene) resin of the first and second layers, forming a second microarray on the substrate by pouring a second soft material solution; and forming a microarray of the first and second soft materials on the substrate by peeling off the poly(para-xylylene) resin of the first and second layers.

Device and method for manufacturing the same

It is an object of this invention to prevent a resistor material and an electrode material from diffusing and suppress variation in electric resistance. In a device including a plurality of metal layers of different compositions on a substrate and a second structure made of a material, such as glass paste, requiring a firing process at the time of formation, an intermediate layer is formed between a first metal layer and a second metal layer forming the first structure. The intermediate layer is of an intermetallic compound including one or more metallic elements in the first metal layer and one or more metallic elements in the second metal layer. The melting point of the intermetallic compound is higher than a firing temperature when the second structure is formed, and the intermetallic compound is produced at a temperature higher than the firing temperature for forming the second structure.

Microfluidic device with a chamber for storing a liquid

A microfluidic device has a chamber for storing a liquid. The chamber includes at least in part a hydrophobic surface on an internal wall.

Microfluid control device and method of manufacturing the same

Provided are a plastic microfluid control device having a multi-step microchannel and a method of manufacturing the same. The device includes a lower substrate, and a fluid channel substrate contacting the lower substrate and having a multi-step microchannel having at least two depths in a side coupling to the lower substrate. Thus, the device can precisely control the fluid flow by controlling capillary force in a depth direction of the channel by controlling the fluid using the multi-step microchannel having various channel depths. A multi-step micropattern is formed by repeating photolithography and transferred, thereby easily forming the multi-step microchannel having an even surface and a precisely controlled height.

Three-dimensional digital microfluidic system

A three-dimensional digital microfluidic system comprises a first plate with a first electrode, a second plate with a second electrode, and a microfluidic drop in between the first and the second electrode. The electrodes are able to be actuated in sequence such that the microfluidic drop is able to be transported. A bridge plate is able to be included.

Nanoporous to Solid Tailoring of Materials via Polymer CVD into Nanostructured Scaffolds

Method for tailoring permeability of materials. The method establishes a pattern of vertically aligned nanowires on a substrate and a physical shadow mask is provided to protect selected features of the pattern. A polymer is selectively infiltrated, using chemical vapor disposition, into interstices in the vertically aligned carbon nanotubes to establish a selected permeability. A cover over the infiltrated vertically aligned nanowires is provided.

Microfluidic component, reactor comprising a plurality of such components, and method for producing same

A microfluidic component made of a metal sheet having a structure which includes a closed fluid line and which is formed of a structured surface of a first section of the metal sheet and an adjoining structured or unstructured surface of a second section of the metal sheet, wherein the metal sheet is folded such that the sections integrally connected to each other are located on top of each other in a surface-parallel manner. The metal sheet further includes at least one third section having a contoured edge and is moreover folded such that the third section is also supported in a surface-parallel manner and the contoured edge forms a first wall section and the adjoining structured or unstructured surface of the first or second section forms a second wall section of an open fluid line. A microfluidic reactor comprising a plurality of such microfluidic components and a method for producing such components.

MICROSTRUCTURE FOR TRANSDERMAL ABSORPTION AND METHOD FOR MANUFACTURING SAME

The present invention relates to a microstructure including a biocompatible polymer or an adhesive and to a method for manufacturing the same. The present inventors optimized the aspect ratio according to the type of each microstructure, thereby ensuring the optimal tip angle and the diameter range for skin penetration. Especially, the B-type to D-type microstructures of the present invention minimize the penetration resistance due to skin elasticity at the time of skin attachment, thereby increasing the penetration rate of the structures (60% or higher) and the absorption rate of useful ingredients into the skin. In addition, the D-type microstructure of the present invention maximizes the mechanical strength of the structure by applying a triple structure, and thus can easily penetrate the skin. When the plurality of microstructures are arranged in a hexagonal arrangement type, a uniform pressure can be transmitted to the whole microstructures on the skin. 1. A microstructure comprising a biocompatible polymer or an adhesive , wherein the aspect ratio (w:h) , configured of the diameter (w) of the bottom surface of the microstructure and the height (h) of the microstructure , is 1:5 to 1:1.5 , and the angle of a distal tip is 10° to 40°.2. The microstructure of claim 1 , wherein the biocompatible polymer is at least one polymer selected from the group consisting of hyaluronic acid (HA) claim 1 , carboxymethyl cellulose (CMC) claim 1 , alginic acid claim 1 , pectin claim 1 , carrageenan claim 1 , chondroitin (sulfate) claim 1 , dextran (sulfate) claim 1 , chitosan claim 1 , polylysine claim 1 , collagen claim 1 , gelatin claim 1 , carboxymethyl chitin claim 1 , fibrin claim 1 , agarose claim 1 , pullulan polylactide claim 1 , polyglycolide (PGA) claim 1 , polylactide-glycolide copolymer (PLGA) claim 1 , pullulan polyanhydride claim 1 , polyorthoester claim 1 , polyetherester claim 1 , polycaprolactone claim 1 , polyesteramide claim 1 , poly(butyric acid) claim 1 , ...

MULTILAYER FLUIDIC DEVICES AND METHODS FOR THEIR FABRICATION

A method of making a flowcell includes bonding a first surface of an organic solid support to a surface of a first inorganic solid support via a first bonding layer, wherein the organic solid support includes a plurality of elongated cutouts. The method further includes bonding a surface of a second inorganic solid support to a second surface of the organic solid support via a second bonding layer, so as to form the flowcell. The formed flowcell includes a plurality of channels defined by the surface of the first inorganic solid support, the surface of the second inorganic solid support, and walls of the elongated cutouts. 138-. (canceled)39. A method of making a flowcell , the method comprising:bonding a first surface of an organic solid support to a surface of a first inorganic solid support via a first bonding layer, wherein the organic solid support includes a plurality of elongated cutouts;bonding a surface of a second inorganic solid support to a second surface of the organic solid support via a second bonding layer, so as to form the flowcell;wherein the formed flowcell comprises a plurality of channels defined by the surface of the first inorganic solid support, the surface of the second inorganic solid support, and walls of the elongated cutouts.40. The method of claim 39 , further comprising:before bonding the first surface of the organic solid support to the surface of the first inorganic solid, forming the first bonding layer on an entirety of the surface of the first inorganic solid support; andbefore bonding the surface of the second inorganic solid support to the second surface of the organic solid support, forming the second bonding layer on an entirety of the surface of the first inorganic solid support.41. The method of claim 39 , wherein:each of the first and second bonding layers is formed of a radiation-absorbing material;bonding the first surface of the organic solid support to the surface of the first inorganic solid comprises irradiating the ...

MEMS DEVICE, HEAD AND LIQUID JET DEVICE

Provided are an MEMS device, a head, and a liquid jet device in which substrates are inhibited from warping, so that a primary electrode and a secondary electrode can be reliably connected to each other. Included are a primary substrate provided with a bump including a primary electrode and a secondary substrate provided with a secondary electrode on a bottom surface of a recessed portion formed by an adhesive layer The primary substrate and the secondary substrate are joined together with the adhesive layer the primary electrode is electrically connected to the secondary electrode with the bump inserted into the recessed portion and part of the bump and the adhesive layer forming the recessed portion overlap each other in a direction in which the bump is inserted into the recessed portion 1. An MEMS device comprising:a primary substrate provided with a bump including a primary electrode; anda secondary substrate provided with a secondary electrode on a bottom surface of a recessed portion formed by an adhesive layer, wherein the primary substrate and the secondary substrate are joined together with the adhesive layer,the primary electrode is electrically connected to the secondary electrode with the bump inserted into the recessed portion, andpart of the bump and the adhesive layer forming the recessed portion overlap each other in a direction in which the bump is inserted into the recessed portion.2. The MEMS device according to claim 1 , wherein the bump includes an elastic core portion claim 1 , and a metal film provided on a surface of the core portion.3. The MEMS device according to claim 2 , wherein the primary substrate is provided with a plurality of the primary electrodes claim 2 ,the core portion of the bump is provided independently for each of the primary electrodes, andthe adhesive layer is provided between each pair of the core portions adjacent to each other.4. The MEMS device according to any one of to claim 2 , wherein the adhesive layer is made of ...

LIQUID HANDLING DEVICE

This liquid handling device includes: a first flow passage through which a first liquid can flow; a second flow passage through which a second liquid can move; a third flow passage through which the second liquid can move; and a droplet generating unit, which is a merging portion of the second flow passage and the third flow passage with respect to the first flow passage, and which is configured in such a way that the first liquid flowing through the first flow passage is divided in the form of droplets by means of the second liquid flowing through the second flow passage and the third flow passage. 1. A liquid handling device comprising:a first channel that allows a first liquid to flow through;a second channel that allows a second liquid to move through, the second channel joining the first channel;a third channel that allows the second liquid to move through, the third channel joining the first channel; anda droplet generator configured such that the second liquid flowing in the second channel and the third channel divides the first liquid flowing in the first channel into droplets, the droplet generator being a junction of the second channel and the third channel with the first channel,whereinthe second channel and the third channel each include a main channel and a sub channel on a downstream side,an opening of the main channel of the second channel with respect to the first channel is disposed to face an opening of the main channel of the third channel with respect to the first channel, andan opening of the sub channel of the second channel with respect to the first channel is disposed to face an opening of the sub channel of the third channel with respect to the first channel.2. The liquid handling device according to claim 1 , wherein:in the droplet generator, the openings of the main channels of the second channel and the third channel are disposed in the first channel upstream from the openings of the sub channels of the second channel and the third ...

Method for producing at least one recess in a material by means of electromagnetic radiation and subsequent etching process

A method for creating at least one recess, in particular an aperture, in a transparent or transmissive material, includes: selectively modifying the material along a beam axis by electromagnetic radiation; and creating the at least one recess by one or more etching steps, using different etching rates in a modified region and in non-modified regions. The electromagnetic radiation produces modifications having different characteristics in the material along the beam axis such that the etching process in the material is heterogeneous and the etching rates differ from one another in regions modified with different characteristics under unchanged etching conditions.

INERTIAL PUMPS

The present disclosure is drawn to inertial pumps. An inertial pump can include a microfluidic channel, a fluid actuator located in the microfluidic channel, and a check valve located in the microfluidic channel. The check valve can include a moveable valve element, a narrowed channel segment located upstream of the moveable valve element, and a blocking element formed in the microfluidic channel downstream of the moveable valve element. The narrowed channel segment can have a width less than a width of the moveable valve element so that the moveable valve element can block fluid flow through the check valve when the moveable valve element is positioned in the narrowed channel segment. The blocking element can be configured such that the blocking element constrains the moveable valve element within the check valve while also allowing fluid flow when the moveable valve element is positioned against the blocking element. 1. An inertial pump , comprising:a microfluidic channel;a fluid actuator located in the microfluidic channel; and a moveable valve element,', 'a narrowed channel segment located upstream of the moveable valve element, the narrowed channel segment having a width less than a width of the moveable valve element such that the moveable valve element blocks fluid flow through the check valve when the moveable valve element is positioned in the narrowed channel segment, and', 'a blocking element formed in the microfluidic channel downstream of the moveable valve element and configured such that the blocking element constrains the moveable valve element within the check valve while also allowing fluid flow when the moveable valve element is positioned against the blocking element., 'a check valve located in the microfluidic channel, the check valve comprising2. The inertial pump of claim 1 , wherein the fluid actuator is a resistor configured to generate vapor bubbles to displace fluid in the microfluidic channel.3. The inertial pump of claim 1 , wherein the ...

SAMPLE LOADING CARTRIDGE

A sample loading cartridge () for a microfluidic device comprises a cartridge body () with a sample reservoir () configured to house a volume of a liquid sample () and a sample port () in connection with the sample reservoir (). The cartridge () also comprises an output channel () extending from the sample reservoir () and a feedback channel () connected to the sample reservoir () and to the sample port (). The cartridge body () comprises a detection portion () aligned with the feedback channel () to enable detection of any sample () in the feedback channel (). The flow resistance of the feedback channel () is lower than the flow resistance of the output channel () to cause liquid sample () received in the sample port () to enter the feedback channel () with substantially no liquid sample () entering the output channel (). 118.-. (canceled)19. A sample loading cartridge for a microfluidic device , the sample loading cartridge comprising:a cartridge body comprising a sample reservoir configured to house a volume of a liquid sample;a sample port in connection with the sample reservoir and configured to receive the liquid sample;an output channel connected to and extending from the sample reservoir; anda feedback channel connected to the sample reservoir and to the sample port, whereinthe cartridge body comprises a detection portion aligned with at least a portion of the feedback channel to enable detection of presence of liquid sample in the feedback channel; anda flow resistance of the feedback channel is lower than a flow resistance of the output channel to cause liquid sample received in the sample port to enter the feedback channel with substantially no liquid sample entering the output channel.20. The sample loading cartridge according to claim 19 , wherein the detection portion is a window aligned with the at least a portion of the feedback channel to provide visual access to the feedback channel.21. The sample loading cartridge according to claim 19 , wherein ...

SPACER FOR SIDE LOADED EWOD DEVICE

An EWOD device includes a first and second substrate assemblies, and a spacer that spaces apart the first substrate assembly from the second substrate assembly to define a channel between them. The spacer defines fluid input ports that are in fluid communication with the channel, and the spacer is configured for directing fluid from the fluid input ports into the channel. The spacer has a combed spacer configuration to define the fluid input ports, including alternating teeth that extend into the channel from a base region, and the teeth isolate adjacent fluid input ports from each other. The spacer may contact only a portion of the first and second substrate assemblies to form a spacerless region within the EWOD device, and the spacer includes regions that are in contact with both the first and second substrate assemblies and extend into the channel to define a cell-gap of the channel. 2. The EWOD device of claim 1 , wherein the spacer has a combed spacer configuration to define the plurality of fluid input ports claim 1 , the combed spacer configuration including alternating teeth that extend into the channel from a base region.3. The EWOD device of claim 2 , wherein externally from the channel the teeth isolate adjacent fluid input ports from each other.4. The EWOD device of claim 1 , wherein the spacer contacts only a portion of the first and second substrate assemblies to form a spacerless region within the EWOD device.5. The EWOD device of claim 4 , wherein the spacer includes regions that are in contact with both the first and second substrate assemblies and extend into the channel so as to define a uniform cell-gap of the channel.6. The EWOD device of claim 1 , further comprising an exit port configured as an extension of the spacer that forms a fluid passage into the channel.7. The EWOD device of claim 1 , wherein a portion of the spacer opposite of the channel that defines the fluid input ports is rounded in shape.8. The EWOD device of claim 1 , wherein: ...

SYSTEM AND METHOD FOR MINIATURIZATION OF SYNTHETIC JETS

A micro-electromechanical (MEM) synthetic jet actuator includes a semiconductor substrate having a cavity extending therethrough, such that a first opening is formed in a first surface of the semiconductor substrate and such that a second opening is formed in a second surface of the semiconductor substrate. A first flexible membrane is formed on at least a portion of the front surface of the semiconductor substrate and extends over the first opening. The first flexible membrane also includes an orifice formed therein aligned with the first opening. The MEM synthetic jet actuator also includes a second flexible membrane that is formed on at least a portion of the second surface of the semiconductor substrate and that extends over the second opening, and a pair of actuator elements coupled to the flexible membranes and aligned with the cavity to selectively cause displacement of the first and second flexible membranes. 1. A micro-electromechanical (MEM) synthetic jet actuator comprising:a semiconductor substrate having a cavity extending therethrough such that a first opening is formed in a first surface of the semiconductor substrate and such that a second opening is formed in a second surface of the semiconductor substrate;a first flexible membrane formed on at least a portion of the front surface of the semiconductor substrate and extending over the first opening, wherein the first flexible membrane comprises an orifice formed therein and aligned with the first opening;a second flexible membrane formed on at least a portion of the second surface of the semiconductor substrate and extending over the second opening; anda pair of actuator elements, each actuator element coupled to a respective flexible membrane and aligned with the cavity to selectively cause displacement of the first and second flexible membranes;wherein vibration of the first and second flexible membranes causes a change in cavity volume such that an ambient fluid is drawn into the cavity through ...

SYSTEM AND METHOD FOR MINIATURIZATION OF SYNTHETIC JETS

A micro-electromechanical (MEM) synthetic jet actuator includes a semiconductor substrate having a cavity extending therethrough, such that a first opening is formed in a first surface of the semiconductor substrate and such that a second opening is formed in a second surface of the semiconductor substrate. A first flexible membrane is formed on at least a portion of the front surface of the semiconductor substrate and extends over the first opening. The first flexible membrane also includes an orifice formed therein aligned with the first opening. The MEM synthetic jet actuator also includes a second flexible membrane that is formed on at least a portion of the second surface of the semiconductor substrate and that extends over the second opening, and a pair of actuator elements coupled to the flexible membranes and aligned with the cavity to selectively cause displacement of the first and second flexible membranes. 1. A micro-electromechanical (MEM) synthetic jet actuator comprising:a semiconductor substrate having a cavity extending therethrough such that a first opening is formed in a first surface of the semiconductor substrate and such that a second opening is formed in a second surface of the semiconductor substrate;a first flexible membrane formed on at least a portion of the front surface of the semiconductor substrate and extending over the first opening, wherein the first flexible membrane comprises an orifice formed therein and aligned with the first opening;a second flexible membrane formed on at least a portion of the second surface of the semiconductor substrate and extending over the second opening; anda pair of actuator elements, each actuator element coupled to a respective flexible membrane to selectively cause displacement of the first and second flexible membranes;wherein vibration of the first and second flexible membranes causes a change in cavity volume such that an ambient fluid is drawn into the cavity through the orifice when the cavity ...

Chemical synthesis device

An aspect of a chemical synthesis device according to the invention includes a substrate in which a channel for chemically synthesizing a plurality of fluids with each other is formed, and a wiring portion that is provided in the substrate, in which an electric resistance value of the wiring portion changes due to the wiring portion coming into contact with the fluids.

Direct Bond Transfer Layers for Manufacturable Sealing of Microfluidic Chips

Techniques for use of wafer bonding techniques for sealing of microfluidic chips are provided. In one aspect, a wafer bonding sealing method includes the steps of: forming a first oxide layer coating surfaces of a first wafer, the first wafer having at least one fluidic chip; forming a second oxide layer on a second wafer; and bonding the first wafer to the second wafer via an oxide-to-oxide bond between the first oxide layer and the second oxide layer to form a bonded wafer pair, wherein the second oxide layer seals the at least one fluidic chip on the first wafer. The second wafer can be at least partially removed after performing the bonding, and fluidic ports may be formed in the second oxide layer. A fluidic chip device is also provided. 1. A device , comprising:a first oxide layer coating surfaces of a first wafer, the first wafer comprising at least one fluidic chip; anda second oxide layer bonded to the first oxide layer via an oxide-to-oxide bond, wherein the second oxide layer seals the at least one fluidic chip on the first wafer.2. The device of claim 1 , wherein the at least one fluidic chip includes fluidic channels joined by nanochannel structures.3. The device of claim 2 , wherein each of the nanochannel structures comprises a pillar array for particle sorting.4. The device of claim 3 , wherein the pillar array comprises a plurality of pillars patterned in the first wafer.5. The device of claim 4 , wherein the first oxide layer is a thin conformal oxide layer covering a top and sidewall surfaces of the pillars.6. The device of claim 5 , wherein the second oxide layer is bonded to the pillar array via the thin conformal oxide layer.7. The device of claim 5 , wherein the second oxide layer is bonded to the thin conformal oxide layer at the top surface of the pillars.8. The device of claim 2 , wherein the fluidic channels comprise microchannels.9. The device of claim 8 , further comprising:fluidic ports formed in the second oxide layer at opposite ends ...

ADDRESSABLE VERTICAL NANOWIRE PROBE ARRAYS AND FABRICATION METHODS

A nanowire probe sensor array including a substrate with a metal pattern thereon. An array of semiconductor vertical nanowire probes extends away from the substrate, and at least some of probes, and preferably all, are individually electrically addressed through the metal pattern. The metal pattern is insulated with dielectric, and base and stem portions of the nanowires are also preferably insulated. A fabrication process patterns metal connections on a substrate. A semiconductor substrate is bonded to the metal pattern. The semiconductor substrate is etched to form the neural nanowire probes that are bonded to the metal pattern. Dielectric is then deposited to insulate the metal pattern. 1. A neural probe sensor array comprising a substrate with a metal pattern thereon , and an array of semiconductor vertical nanowire probes extending away from said substrate , at least some of which are individually electrically addressed through said metal pattern.2. The sensor array of claim 1 , wherein said vertical nanowire probes each have a diameter of ˜10 nm-200 nm claim 1 , and a height of ˜5 μm-10 μm.3. The sensor array of claim 1 , further comprising dielectric coating at least said metal pattern.4. The sensor array of claim 3 , wherein said dielectric further coats a base and stem portions of said vertical nanowire probes leaving tip portions of said vertical nanowire probes exposed.5. The sensor array of claim 1 , comprising a metal tip on each of said vertical nanowire probes.6. The sensor array of claim 1 , comprising a semiconductor-metal alloy interfacing said vertical nanowire probes to said metal pattern.7. The sensor array of claim 1 , wherein said metal pattern comprises individual electrically isolated metal contacts to individual ones of said vertical nanowire probes claim 1 , corresponding metal leads extending from the metal contacts claim 1 , and corresponding peripheral metal pads for connection to a measurement circuit.8. The sensor array of any of ...

SILICON CARBIDE NANONEEDLES AND FABRICATION THEREOF

A product includes an elongated carbon-containing pillar having a bottom and a tip opposite the bottom. The width of the pillar measured 1 nm below the tip is less than 700 nm. A method includes masking a carbon-containing single crystal for defining masked regions and unmasked regions on the single crystal. The method also includes performing a plasma etch for removing portions of the unmasked regions of the single crystal, thereby defining a pillar in each unmasked region, and performing a chemical etch on the pillars at a temperature between 1200° C. and 1600° C. for selectively reducing a width of each pillar. 1. A product , comprising:an elongated carbon-containing pillar having a bottom and a tip opposite the bottom, wherein the width of the pillar measured 1 nm below the tip is less than 700 nm.2. The product as recited in claim 1 , wherein the tip is rounded.3. The product as recited in claim 1 , wherein the pillar extends from a single crystal substrate having a bulk composition that is the same as the bulk composition of the pillar.4. The product as recited in claim 3 , wherein the pillar has no higher concentration of defects per unit volume than the single crystal substrate.5. The product as recited in claim 1 , wherein the pillar has a faceted peripheral outer surface.6. The product as recited in claim 1 , wherein the pillar has a rounded peripheral outer surface.7. The product as recited in claim 6 , wherein the peripheral outer surface of the pillar is rounded therealong from the bottom to the tip of the pillar.8. The product as recited in claim 1 , wherein the pillar has no oxidation on an outer surface thereof.9. The product as recited in claim 1 , wherein the pillar is SiC.10. The product as recited in claim 1 , wherein the pillar is diamond.11. The product as recited in claim 1 , wherein the pillar has an inner channel extending along a longitudinal axis thereof.12. The product as recited in claim 11 , wherein the pillar extends from a single ...

SUBSTRATE ASSEMBLY AND METHOD OF BONDING SUBSTRATES

A substrate assembly includes a first substrate, a second substrate and a bonding member. The first substrate includes a first surface-modified region having a functionality different from that of a remainder region of the first substrate. The second substrate includes a second surface-modified region connected to the first surface-modified region through a physical interaction and having a functionality different from that of a remainder region of the second substrate. The first and second substrates cooperatively define a space therebetween. The bonding member is disposed within said space to bond said first and second substrates together. A method for bonding substrates is also disclosed. 1. A substrate assembly , comprising:a first substrate including a first connecting surface, a first non-connecting surface opposite to said first connecting surface, a first peripheral surface interconnecting said first connecting surface to said first non-connecting surface, and a first surface-modified region which is formed on said first connecting surface, and which has a functionality different from those of said first non-connecting surface and said first peripheral surface,a second substrate including a second connecting surface, a second peripheral surface extending from said second connecting surface, and a second surface-modified region that is formed on said second connecting surface, and that is directly connected to said first surface-modified region through a physical interaction, said second surface-modified region having a functionality different from that of said second peripheral surface; anda bonding member bonding said first and second substrates together, said bonding member being filled in a space which is formed between said first substrate and said second substrate, and which steers clear of an interface between said first surface-modified region and said second surface-modified region.2. The substrate assembly as claimed in claim 1 , wherein:said second ...

A CORROSION TOLERANT MICRO-ELECTROMECHANICAL FLUID EJECTION DEVICE

A microfluidic device including a fluid ejection channel defined by a fluid barrier and an orifice, or nozzle, for containing and/or passing fluids, and further including micro-electromechanical systems (MEMS) and/or electronic circuitry may be fabricated on a silicon substrate and included in a fluid ejection system. Various microfabrication techniques used for fabricating semiconductor devices may be used to manufacture such microfluidic devices. 1. An apparatus comprising: a thermal oxide layer on a silicon substrate;', 'a dielectric layer over the thermal oxide layer, the dielectric layer including the doped dielectric film; and, 'a circuit region with logical circuits thereon and including a doped dielectric film, the circuit region including an aperture in the dielectric layer, wherein the aperture is defined by a dielectric wall which forms part of the dielectric layer; and', 'a sealing film over the dielectric wall that prevents the doped dielectric film from contacting fluid contained in the fluid port., 'a fluidic region including a fluid port formed through a surface of the apparatus, the fluidic region including2. The apparatus of claim 1 , wherein the sealing film includes an un-doped dielectric film over the dielectric wall.3. The apparatus of claim 1 , wherein the sealing film is an electrically insulating and corrosion resistant barrier to the doped dielectric film.4. The apparatus of claim 1 , wherein a portion of the aperture terminates at a termination point in the thermal oxide layer.5. The apparatus of claim 1 , wherein a portion of the aperture terminates at a termination point in the substrate.6. The apparatus of claim 1 , wherein a portion of the aperture terminates at the thermal oxide layer.7. The apparatus of claim 1 , wherein a portion of the aperture terminates at the silicon substrate.8. An apparatus to receive a fluid having corrosive attributes claim 1 , the apparatus comprising: a thermal oxide layer on a substrate;', 'a doped ...

METHOD OF PRODUCING MICRONEEDLE ARRAY UNIT

Provided is a method of producing a microneedle array unit which is capable of suppressing damage to a microneedle array. The method of producing a microneedle array unit, including an array preparing step of preparing a microneedle array which includes a sheet and a plurality of needles arranged on one surface of the sheet; a container preparing step of preparing a container which includes an accommodating portion defining an opening and a space for accommodating the microneedle array, and a deformable portion disposed on a side opposite to the opening and integrated with the accommodating portion; an accommodating step of accommodating the microneedle array in the accommodating portion of the container by allowing the other surface of the sheet of the microneedle array and the deformable portion of the container to oppose each other; and a deforming step of deforming an outer surface of the accommodating portion inward, which is positioned between the one surface of the sheet of the microneedle array and the opening of the accommodating portion, to form a protrusion that reduces an area of the opening. 1. A method of producing a microneedle array unit , comprising:an array preparing step of preparing a microneedle array which includes a sheet and a plurality of needles arranged on one surface of the sheet;a container preparing step of preparing a container which includes an accommodating portion defining an opening and a space for accommodating the microneedle array, and a deformable portion disposed on a side opposite to the opening and integrated with the accommodating portion;an accommodating step of accommodating the microneedle array in the accommodating portion of the container by allowing the other surface of the sheet of the microneedle array and the deformable portion of the container to oppose each other; anda deforming step of deforming an outer surface of the accommodating portion inward, which is positioned between the one surface of the sheet of the ...

FABRICATION OF 3D MICROELECTRODES AND USE THEREOF IN MULTI-FUNCTIONAL BIOSYSTEMS

Disclosed herein is a microelectrode platform that may be used for multiple biosystem applications including cell culturing techniques and biosensing. Also disclosed are microfabrication techniques for inexpensively producing microelectrode platforms. 1. A method of fabricating micromilled microneedles from a planar substrate , the method comprising micromilling a plurality of cut-outs onto the planar substrate; and transitioning material at the plurality of the cut-outs such that the 5 material extends orthogonal to the planar sheet.2. The method of claim 1 , wherein the planar substrate is metal.3. The method of claim 2 , wherein the metal is stainless steel.4. The method of claim 1 , further comprising subjecting the substrate and microneedles to an acid and sonication to remove debris caused by the micromilling.5. The method of any of claims 1 , wherein the microneedles are at a greater than 60 claims 1 , 70 or 80 degree angle respective to the planar substrate.6. (canceled)7. The method of any of claims 1 , wherein the transitioning step comprises aligning an array of transition-effecting structures with the planar substrate such that individual transition-effecting structures are oriented with the plurality of cut-outs; inserting the array of transition-effecting structures through the planar substrate to transition material at the cut-outs to be out of plane with the planar substrate.8. The method of claim 7 , wherein the transition-effecting structures are hypodermic needles or dispensing needles.9. A substrate comprising a plurality of microneedles produced by the method of .10. A hollow needle array comprisinga base;a plurality of hollow needles secured to the base and extending orthogonally from the base.11. The hollow microneedle array of claim 10 , wherein the base is produced by 3-D printing.12. A system comprising the hollow needle array of claim 11 , wherein the base comprises one or more apertures; and a 3D printed release press comprising one or ...

FLUIDIC CHIP

A fluidic chip comprising: a sealing layer having an upper surface and a lower surface; and a formed part comprising a generally planar body having a lower surface sealed with the upper surface of the sealing layer, the generally planar body having a number of through holes and a number of wells in fluid communication with the number of through holes, wherein together with the upper surface of the sealing layer, the number of through holes and the number of wells respectively define a number of fluid inlets and a number of fluid chambers in fluid connection with each other in the fluidic chip. 1. A fluidic chip comprising:a sealing layer having an upper surface and a lower surface; anda formed part comprising a generally planar body having a lower surface sealed with the upper surface of the sealing layer, the generally planar body having a number of through holes and a number of wells in fluid communication with the number of through holes,wherein together with the upper surface of the sealing layer, the number of through holes and the number of wells respectively define a number of fluid inlets and a number of fluid chambers in fluid connection with each other in the fluidic chip;wherein each of the number of wells comprises a well bottom connected to and spaced apart from an upper surface of the planar body by a well wall encircling the well bottom.2. The fluidic chip of claim 1 , wherein the lower surface of the sealing layer is electrically non-conductive and provided with a dc heater having a discrete heating area made of a heat conductive material disposed on the lower surface of the sealing layer and a conductive trace configured to be supplied with a dc voltage and to heat the discrete heating area to a uniform temperature when supplied with the dc voltage claim 1 , the conductive trace disposed in an undulating configuration on the lower surface of the sealing layer at least partially around the discrete heating area claim 1 , the discrete heating area ...

Microfluidic Products with Controlled Fluid Flow

A microfluidic product utilizing gradient surface energy coatings for fluid control comprising a plurality of fluid passages wherein at least one fluid passage comprises a coating configured to control liquid flow wherein the coating configured to control liquid flow comprises a gradient surface energy coating from a proximal location to a distal location on a surface of the fluid passage. The product can include uniform regions and surface gradient regions in the same passage. Coating compositions and product dimensions can be selected to provide control over different flow properties including fluid velocity, reduction and acceleration of fluid flow, and starting and stopping fluid flow. 1) A microfluidic product comprising an inlet port , a first detection region positioned downstream of a first fluid passage , and a second detection region positioned downstream of a second fluid passage , the first and second fluid passages each having a top surface and a bottom surface , wherein the first and second fluid passages each comprise a coating configured to control liquid flow on the top surface or the bottom surface wherein the coating configured to control liquid flow comprises a gradient surface energy coating from a proximal location on the top or bottom surface to a distal location on the top or bottom surface of the first and second fluid passages , whereinthe inlet port is in fluid communication with the first and second detection regions, andthe gradient surface energy coating of the first and second fluid passages comprises species X1-J1-M1 and species X2-J2-M2 wherein X1, X2, M1, and M2 represent separate functional groups where M1 and M2 have different surface energies and J1 and J2 represents spacer moieties, and the molar concentration of the species X2-J2-M2 increases relative to the molar concentration of the species X1-J1-M1 in the gradient surface energy coating from the proximal location to the distal location.2) The microfluidic product of wherein ...

FLUID HANDLING DEVICE AND FLUID HANDLING SYSTEM

This fluid handling device has a rotary member that is rotatable around the central axis. In the rotary member, a first protruding part for pressing and closing a valve of a flow channel chip and a recessed part for opening the valve without pressing the valve are disposed on the circumference of a first circle around the central axis. The rotary member further has a second protruding part for, when the recessed part is located at the valve in a state where the rotary member is rotated, pressing the valve so as not to open the valve. 1. A fluid handling device configured to control fluid in a channel of a channel chip , a plurality of introduction channels;', 'a common channel connected to the plurality of introduction channels; and', 'a plurality of valves disposed for the plurality of introduction channels, each of the plurality of valves being disposed in each of the plurality of introduction channels or at a connecting portion between each of the introduction channel and the common channel; and, 'wherein the channel chip includes a first protrusion configured to close the plurality of valves by pressing a diaphragm of each of the plurality of valves;', 'a recess configured to open the plurality of valves without pressing the diaphragm of each of the plurality of valves, the first protrusion and the recess being disposed on a circumference of a first circle around the central axis; and', 'a second protrusion configured to close a valve of the plurality of valves that is opposite to the recess by pressing a diaphragm of the valve of the plurality of valves when the recess is located over the valve of the plurality of valves in a state where the rotary member is rotated., 'wherein the fluid handling device includes a rotary member rotatable around a central axis, the rotary member including2. The fluid handling device according to claim 1 , wherein the second protrusion is disposed on a circumference of a second circle disposed around the central axis claim 1 , the ...

DIGITAL PCR DEVICE

A digital PCR device comprising: a discrete heating area made of a heat conductive material disposed on a surface that is electrically non-conductive, the discrete heating area comprising a plurality of integral wells configured to contain and partition a DNA sample therein; and at least one conductive trace configured to be connected to a dc voltage source and to heat the plurality of integral wells to a uniform temperature when connected to the dc voltage source, the at least one conductive trace disposed on the surface in an undulating configuration at least partially around the discrete heating area. 1. A digital PCR device comprising:a discrete heating area made of a heat conductive material disposed on a surface that is electrically non-conductive, the discrete heating area comprising a plurality of integral wells configured to contain and partition a DNA sample therein; andat least one conductive trace configured to be connected to a dc voltage source and to heat the plurality of integral wells to a uniform temperature when connected to the dc voltage source, the at least one conductive trace disposed on the surface in an undulating configuration at least partially around the discrete heating area, wherein each of the plurality of integral wells is defined by well walls comprising a thickness of the discrete heating area.2. The digital PCR device of claim 1 , wherein the plurality of integral wells are provided as a regular array in the discrete heating area and wherein wells in a same row of the array are in fluid communication with each other via openings in the well walls.3. The digital PCR device of claim 2 , wherein the openings are collinear along each row of wells.4. The digital PCR device of claim 1 , further comprising a top layer provided over the surface claim 1 , over the discrete heating area comprising the plurality of integral wells claim 1 , and over the at least one conductive trace.5. The digital PCR device of claim 1 , wherein the surface ...

METHOD OF FORMING SPACE FOR USE IN ANALYSIS DEVICES

A method of forming a space includes a step of tenting, on a substrate having a recessed portion, a dry film including a dry film material that is to be a top plate on the recessed portion. The step of tenting the dry film includes a press period and a release period and performs a press-release cycle of the press period and the release period a plurality of times, a pressed state in which the dry film is pressed against the substrate by using a pressing member is maintained during the press period, and a released state in which the pressed state is released is maintained during the release period. 1. A method of forming a space , comprising:a step of tenting, on a substrate having a recessed portion, a dry film including a dry film material that is to be a top plate on the recessed portion,wherein the step of tenting the dry film includes a press period and a release period and performs a press-release cycle of the press period and the release period a plurality of times, a pressed state in which the dry film is pressed against the substrate by using a pressing member is maintained during the press period, and a released state in which the pressed state is released is maintained during the release period.2. The method of forming a space according to claim 1 ,wherein the pressing member has a flat shape.3. The method of forming a space according to claim 1 ,wherein a duration of the press-release cycle is within a range of a duration for which a loss tangent that the dry film material has is 1.0 or less.4. The method of forming a space according to claim 1 ,wherein a process temperature in the step of tenting the dry film is equal to or more than a glass-transition temperature of the dry film material.5. The method of forming a space according to claim 1 ,wherein the release period is longer than the press period in the step of tenting the dry film.6. The method of forming a space according to claim 1 ,wherein the step of tenting the dry film includes starting the ...

Static expansion method

A static expansion method is performed by expanding a volume of a testing gas from V 0 to V 0 +V 1 between a second chamber of the volume V 1 which is connected to an upstream side of a measurement chamber and a first chamber of the volume V 0 which is connected to an upstream side of the second chamber, wherein the first camber is in communication with the second chamber via a first valve, wherein the second chamber is in communication with the measurement chamber via each of a second valve and an orifice or porous plug, respectively. When the first valve is opened and the second valve is closed, the testing gas flows from the first chamber via the second chamber into the measurement chamber only through the orifice or porous plug.

Microstructured nozzle and production thereof

The invention relates to a nozzle for use in a device for administering a liquid medical formulation, to a method for producing the nozzle in the form of a microfluidic component and to a tool for producing microstructures of the microfluidic component. The nozzle is formed by a plastics plate with groove-like microstructures which are covered by a plastics cover on the longitudinal side in a fixed manner. The production method includes a moulding process in which a moulding tool is used, which moulding tool has complementary metal microstructures which have been produced from a semiconductor material in an electrodeposition process by means of a master component.

A MICROFLUIDIC ANALYTICAL PLATFORM FOR AUTONOMOUS IMMUNOASSAYS

It is provided a microfluidic analytical device and platform for autonomous immunoassays such as ELISA comprising a porous layer having at least one slot therein and a porous arm extending from the porous layer and pivotable about the arm's root, the porous arm being pivotable between an off position wherein the porous arm is spaced away from the slot and an on position wherein the porous arm is disposed in the slot and the hydrophilic element spans the slot to define a fluid flow path across the slot; a heat-responsive shaped memory polymer (SMP) disposed underneath the porous layer, the SMP being elastically deformable in response to being heated to move the porous arm between the on and off positions; and a heat source in heat-conducting contact with the SMP to elastically deform the SMP. 1. A microfluidic analytical device , comprising:a porous layer having at least one slot therein and a porous arm extending from the porous layer and pivotable about the arm's root, a distal end of the porous arm having a hydrophilic element, the porous arm being pivotable between an off position wherein the porous arm is spaced away from the slot and an on position wherein the porous arm is disposed in the slot and the hydrophilic element spans the slot to define a fluid flow path across the slot;a heat-responsive shaped memory polymer (SMP) disposed underneath the porous layer and abutting against the porous arm, the SMP being elastically deformable in response to being heated to move the porous arm between the on and off positions; anda heat source in heat-conducting contact with the SMP to elastically deform the SMP.2. The microfluidic analytical device of claim 1 , wherein the porous layer is selected from the group consisting of porous cellulose paper claim 1 , porous hydrophilic fabrics claim 1 , porous nitrocellulose paper and membrane claim 1 , porous glass microfiber membrane claim 1 , and porous carbon nanofiber membrane.3. The microfluidic analytical device of claim ...

LOCALIZED FUNCTIONALIZATION OF NANOTEXTURED SURFACES

A material with a nanotexture comprising structures extending from a substrate. The structures are modified by coating the nanotexture with a protective coating and partially removing the coating, exposing a portion of the structure for functionalization. 1. A method for functionalizing a nanotextured material comprising:forming a nanotextured material having a plurality of structures extending in a first dimension and each of the plurality of structures having a distal portion;forming a resist coating on the nanotextured material, wherein at least some of the distal portions of the plurality of structures are exposed beyond the resist coating;modifying the exposed distal portions with a first functional group; andremoving the resist coating.2. The method of claim 1 , wherein forming the resist coating comprises applying the resist coating comprises spin coating the nanotextured material.3. The method of claim 2 , wherein applying the resist coating comprises fully covering plurality of structures.4. The method of claim 3 , wherein forming the resist coating further comprises removing a portion of the resist coating to expose the exposed distal portions.5. The method of claim 2 , wherein applying the resist coating leaves an uncoated portion of the plurality of structures.6. The method of claim 2 , wherein the uncoated portion of the plurality of structures are the exposed distal portions.7. The method of claim 2 , wherein the resist coating fills space between each of the plurality of structures.8. The method of claim 2 , wherein the exposed distal portions are functionalized with the first function group and remaining portions of the plurality of structures are not functionalized with the first functional group.9. The method of claim 1 , further comprising:prior to applying the resist coating, the nanotextured material is washed with tolulene; andmodifying the exposed distal portions comprises silanization, wherein the silanization comprises application of a ...

COMBINED-BLADE-TYPE OPEN FLOW PATH DEVICE AND JOINED BODY THEREOF

A combined-blade-type open flow path device being a fluid flow path device where a plurality of flow paths are adjacent to each other, the combined-blade-type open flow path device comprising: a substrate configured to constitute a bottom portion of the flow paths; and a plurality of blades erected on a surface of the substrate, the plurality of blades configured to constitute side walls of the flow paths, wherein the plurality of blades are erected in a plurality of numbers at a space in a direction from an upstream side to a downstream side of a flow of the fluid, and conduction of the fluid between the flow paths adjacent at the space is made possible, and wherein the flow of the fluid is made possible by one end of the flow path being in contact with the fluid. 1. A combined-blade-type open flow path device being a fluid flow path device where a plurality of flow paths are adjacent to each other , the combined-blade-type open flow path device comprising:a substrate configured to constitute a bottom portion of the flow paths; anda plurality of blades erected on a surface of the substrate, the plurality of blades configured to constitute side walls of the flow paths,wherein the plurality of blades are erected in a plurality of numbers at a space in a direction from an upstream side to a downstream side of a flow of the fluid, and conduction of the fluid between the flow paths adjacent at the space is made possible, andwherein the flow of the fluid is made possible by one end of the flow path being in contact with the fluid.2. The combined-blade-type open flow path device according to claim 1 , wherein the flow of the fluid is a flow in a horizontal direction where a gravity force is not involved claim 1 , or is a flow in a direction against a gravity force.3. The combined-blade-type open flow path device according to claim 1 , wherein the space of the blades in a direction from the upstream side to the downstream side of the flow of the fluid is within a range ...

MANUFACTURING METHOD OF JOINED BODY, MANUFACTURING METHOD OF MEMS DEVICE, MANUFACTURING METHOD OF LIQUID EJECTING HEAD, AND MANUFACTURING DEVICE OF JOINED BODY

A manufacturing method of a joined body in which a plurality of structures are joined to each other, the method including forming of an adhesive layer on one face of a medium; adjusting of viscosity of the adhesive layer formed in the forming of the adhesive layer; transcribing the adhesive layer of which viscosity is adjusted in the adjusting of viscosity to the structure; and measuring of surface roughness of the adhesive layer on a transcribing film in a stage before the transcribing. 1. A manufacturing method of a joined body in which a plurality of structures are joined to each other using an adhesive in a state of being stacked , the method comprising:forming an adhesive layer on one face of a medium;adjusting viscosity of the adhesive layer formed in the forming of the adhesive layer;transcribing the adhesive layer of which viscosity is adjusted in the adjusting of viscosity to the structure; andmeasuring surface roughness of the adhesive layer on the medium in a stage before the transcribing.2. The manufacturing method of a joined body according to claim 1 ,wherein, in the measuring of surface roughness, the surface roughness on the adhesive layer formed on the medium is measured in a non-contact manner.3. The manufacturing method of a joined body according to claim 1 ,wherein, in the transcribing, the transcribing is performed in a case in which the surface roughness of the adhesive layer is smaller than a predetermined value which is set in advance, in the measuring of surface roughness.4. The manufacturing method of a joined body according to claim 1 ,wherein, in the transcribing, transcribing is performed in a case in which light receiving intensity of reflected light when radiating light toward the adhesive layer is larger than a predetermined value which is set in advance, in the measuring of surface roughness.5. The manufacturing method of a joined body according to claim 1 ,wherein the measuring of surface roughness is performed between the forming ...

MICROVALVE HAVING A REDUCED SIZE AND IMPROVED ELECTRICAL PERFORMANCE

A plate is adapted for use in a microvalve and includes a displaceable member configured for movement between a closed position, wherein the displaceable member prevents fluid communication through the microvalve, and an opened position, wherein the displaceable member does not prevent fluid communication through the microvalve. The displaceable member includes an elongated arm portion, a plurality of actuator ribs connected through a central spine to the elongated arm portion, and a hinge portion. The actuator ribs have a first portion and a second portion, the first portion having a first end and a second end, the second end of the first portion connected to the central spine, the second portion having a first end and a second end, the second end of the second portion connected to the central spine. A channel is formed in the plate. A plurality of elongated openings are formed in the plate and define the actuator ribs, each elongated opening having longitudinally extending side edges. One of the elongated openings separates each rib in the second portion of ribs from an adjacent rib or the plate. The channel and a longitudinally extending side edge of one of the elongated openings separate the second portion of the actuator ribs from the plate and define an electrical isolation region. 1. A plate adapted for use in a microvalve , the plate comprising:a displaceable member configured for movement between a closed position, wherein the displaceable member prevents fluid communication through the microvalve, and an opened position, wherein the displaceable member does not prevent fluid communication through the microvalve, the displaceable member including an elongated arm portion, a plurality of actuator ribs connected through a central spine to the elongated arm portion, and a hinge portion, the actuator ribs having a first portion and a second portion, the first portion having a first end and a second end, the second end of the first portion connected to the ...

PROCESS FOR MANUFACTURING A MICRO-FLUIDIC DEVICE AND DEVICE MANUFACTURED USING SAID PROCESS

A process for manufacturing a micro-fluidic device, the device including a substrate made of thermoplastic polymer having a face called the upper face and a first micro-fluidic circuit that includes at least one aperture that opens onto the upper face, and a component bearing pads arranged to become anchored in the substrate on the periphery of the aperture, the process including the following steps: heating so that the anchoring pads of the component reach a temperature at least equal to the glass-transition temperature of the substrate; fastening the component to the substrate by embedding then anchoring its pads in the substrate. 1. A process for manufacturing a micro-fluidic device , said device comprising a substrate made of thermoplastic polymer having a face called the upper face and a first micro-fluidic circuit that comprises at least one aperture that opens onto said upper face , and a component bearing pads arranged to become anchored in said substrate on the periphery of said aperture , said process being wherein said process includes the following steps:heating so that the anchoring pads of the component reach a temperature at least equal to the glass-transition temperature of the substrate;fastening the component to the substrate by embedding then anchoring its pads in the substrate.2. The process according to claim 1 , wherein said process includes a prior step of creating holes in the substrate claim 1 , these holes each being configured to receive one separate anchoring pad of the component claim 1 , with a view to facilitating the embedment of each anchoring pad of the component in the fastening step.3. A micro-fluidic device comprising a substrate made of thermoplastic polymer having a face called the upper face and a first micro-fluidic circuit that comprises at least one aperture that opens onto said upper face claim 1 , and a component bearing pads arranged to become anchored in said substrate on the periphery of said aperture claim 1 , wherein ...

Droplet operations device

The invention provides droplet actuators with droplet operations surfaces for manipulating droplets, e.g., by conducting droplet operations. The droplet operations surfaces are typically exposed to a droplet operations gap. One or more regions of a droplet operation surface may include patterned topographic features. The invention also provides a droplet actuator in which one or both gap-facing droplet operations surfaces is formed using a removable film. The removable film may, in various embodiments, also include other components ordinarily associated with the droplet actuator substrate, such as the dielectric layer and the electrodes. Further, the invention provides droplet actuator devices and methods for coupling and/or sealing substrates of a droplet actuator, such as techniques for self-aligning assembly of droplet actuator substrates. The invention provides droplet actuators and methods of disassembling the droplet actuator in order to provide access for cleaning and/or recycling of droplet actuator surfaces.

Nanochannel Arrays and Their Preparation and Use for High Throughput Macromolecular Analysis

Nanochannel arrays that enable high-throughput macromolecular analysis are disclosed. Also disclosed are methods of preparing nanochannel arrays and nanofluidic chips. Methods of analyzing macromolecules, such as entire strands of genomic DNA, are also disclosed, as well as systems for carrying out these methods.

High aspect ratio shadow mask and a method of making and using the same

A high aspect ratio shadow mask and a method of making and using the high aspect ratio shadow mask can provide multiple conductive trace pathways along high aspect ratio electrodes. The high aspect ratio shadow mask can include a substantially planar base layer and a plurality of hollow high aspect ratio projections extending from the substantially planar base layer. The high aspect ratio shadow mask can further include a plurality of openings along the hollow projections which define trace deposition patterns.

PACKAGING A SEALED CAVITY IN AN ELECTRONIC DEVICE

An electronic device includes a package substrate, a circuit assembly, and a housing. The circuit assembly is mounted on the package substrate. The circuit assembly includes a first sealed cavity formed in a device substrate. The housing is mounted on the package substrate to form a second sealed cavity about the circuit assembly. 1. An electronic device , comprising:a package substrate;a circuit assembly mounted on the package substrate, the circuit assembly comprising a first sealed cavity formed in a device substrate; anda housing mounted on the package substrate to form a second sealed cavity about the circuit assembly.2. The electronic device of claim 1 , wherein the first sealed cavity comprises a channel formed in the device substrate and a sealing plate bonded to the device substrate.3. The electronic device of claim 2 , further comprising a pressure sensor coupled to the sealing plate and configured to measure pressure within the first sealed cavity as a function of displacement of the sealing plate.4. The electronic device of claim 2 , wherein the sealing plate comprises a dielectric membrane.5. The electronic device of claim 2 , further comprising:an acoustic sensor coupled to the sealing plate and configured to measure vibration of the sealing plate; andcontrol circuitry coupled to the acoustic sensor, the control circuitry configured to determine pressure within the first sealed cavity as a function of the mechanical harmonic signature of the sealing plate.6. The electronic device of claim 1 , further comprising a pressure sensor coupled to the housing and configured to measure pressure within the second sealed cavity as a function of displacement of the housing.7. The electronic device of claim 1 , further comprising:an acoustic sensor coupled to the housing and configured to measure vibration of the housing; andcontrol circuitry coupled to the acoustic sensor, the control circuitry configured to determine pressure within the second sealed cavity as a ...

METHOD TO CREATE MULTILAYER MICROFLUIDIC CHIPS USING SPIN-ON CARBON AS GAP FILLING MATERIALS

A microfluidic chip with high volumetric flow rate is provided that includes at least two vertically stacked microfluidic channel layers, each microfluidic channel layer including an array of spaced apart pillars. Each microfluidic channel layer is interconnected by an inlet/outlet opening that extends through the microfluidic chip. The microfluidic chip is created without wafer to wafer bonding thus circumventing the cost and yield issues associated with microfluidic chips that are created by wafer bonding. 1. A method of forming a microfluidic chip , the method comprising:forming a multilayered material stack including at least a first pillar forming material layer over a substrate;forming a first array of first pillars in the first pillar forming material layer of the multilayered material stack;filling gaps present between each first pillar of the first array with a first sacrificial gap filling material;forming a first microfluidic channel separating material layer over the first array of first pillars and the first sacrificial gap filling material;forming a first inlet/outlet opening and a second inlet/outlet opening in the first microfluidic channel separating material layer, wherein the first and second inlet/outlet openings contact the first sacrificial gap filling material;forming a second sacrificial gap filling material in the first and second inlet/outlet openings and contacting the first sacrificial gap filling material;forming a second pillar forming material layer on the second sacrificial gap filling material and the a first microfluidic channel separating material layer;forming a second array of second pillars in the second pillar forming material layer;filling gaps present between each second pillar of the second array with a third sacrificial gap filling material;forming a second microfluidic channel separating material layer over the second array of second pillars and the third sacrificial gap filling material;forming a first upper inlet/outlet ...

Drive component of a micro-needle system and method for driving the same, micro-needle system and method for fabricating the same

The disclosure discloses a drive component of a micro-needle system, a method for driving the same, a micro-needle system and a method for fabricating the same; wherein the drive component includes a substrate with a groove; a bottom electrode in the groove; an electro-active polymer layer, covering the bottom electrode, in the groove; and an upper flexible electrode covering the electro-active polymer layer; wherein the upper flexible electrode and the bottom electrode are configured to generate a voltage, and the electro-active polymer layer is configured to generate a strain under the voltage.

Valve configurations facilitating clearing, cleaning, drying, and burst formation for microfluidic devices, fluidic arrangements, and other systems

A software-controlled triangle-topology valve-cluster for use at taps or conduit junction points that facilitate fluid-based clearing, gas-based clearing, solvent-based cleaning, gas drying, small-volume burst formation, abandoned-material return, and other valuable operations is disclosed. The invention provides better contamination performance than simple passive or valve-chaperoned “T”-topology junctions. The valve-cluster arrangement can be implemented or approximated in various ways. For faster performance, simplified programming, or other reasons “macro” controllability can be provided for operating groups of valves in one or more of simultaneous operation, time-defined sequenced operation, or conditional operation, and such macros can further provide for conditional inputs or parameters. Such “macro,” “conditional-macro,” and “parameterized-macro” control could be implemented in software, firmware, and/or hard-wired logic. The invention can be used in reusable or reconfigurable microfluidic systems, facilitate decontaminated and green disposal and recycling of microfluidics, and other fluidic applications. Features of the invention can also be extended to gas transport.

Mems device, liquid ejecting head, and liquid ejecting apparatus

There is provided a MEMS device which includes a second substrate which is disposed with an interval from a first substrate, and an interposed member which is interposed between the first substrate and the second substrate, and which has space which is defined by the first substrate, the second substrate, and the interposed member, in which the first substrate includes a wiring which extends from a first surface side which is a surface on a side opposite to the second substrate toward a second surface side which is a surface of the second substrate side and is made of a conductor, in which an end portion of the first surface side of the wiring is covered by a first protective film provided on the first surface side, and in which an end portion of the second surface side of the wiring faces the space.

RECONFIGURABLE MICROFLUIDIC DEVICE AND METHOD OF MANUFACTURING THE SAME

A microfluidic device, including a substrate including a microchannel, an activation setup disposed in the microchannel, and a matrix array of controllable shape-changing micropillars connected to the activation setup. A shape of the controllable shape-changing micropillars changes based on an activation of the activation setup. 1. A microfluidic device , comprising:a substrate including a microchannel;an activation setup disposed in the microchannel; anda matrix array of controllable shape-changing micropillars connected to the activation setup,wherein a shape of the controllable shape-changing micropillars changes based on an activation of the activation setup.2. The microfluidic device of claim 1 , wherein the microchannel is configured such that a fluid flows through the microchannel between the controllable shape-changing micropillars.3. The microfluidic device of claim 1 , wherein the activation setup comprises an electrode array including:a row selection metal line;a column selection metal line; anda plurality of electrodes, each electrode of the plurality of electrodes corresponding to each of the controllable shape-changing micropillars.4. The microfluidic device of claim 1 , wherein the activation setup comprises an electrode array including:a row selection metal line;a column selection metal line; anda plurality of electrodes, each electrode of the plurality of electrodes corresponding to a group of the controllable shape-changing micropillars.5. The microfluidic device of claim 1 , wherein the activation setup comprises an electrode array including a plurality of electrodes claim 1 , each electrode of the plurality of electrodes corresponding to a group of the controllable shape-changing micropillars.6. The microfluidic device of claim 1 , wherein the activation setup comprises an electrode array including a plurality of electrodes claim 1 , each electrode of the plurality of electrodes corresponding to each of the controllable shape-changing ...

MICROFLUIDIC DEVICES WITH ELECTRODES FORMED AS PHYSICALLY SEPARATED SECTIONS OF MICROCHANNEL SIDE WALLS

A device includes a first layer of an electrically insulating material and a second layer of a non-electrically insulating material (e.g., semiconductor or electrically conductive) extending on the first layer. The second layer is structured so as to define opposite, lateral walls of a microchannel, a bottom wall of which is defined by an exposed surface of the first layer. The second layer is further structured to form one or more electrical insulation barriers; each barrier includes a line of through holes, each surrounded by an oxidized region of the material of the second layer. The through holes alternate with oxidized portions of the oxidized region along the line. Each barrier extends, as a whole, laterally across the second layer up to one of the lateral walls and delimits two sections of the second layer on each side of the barrier and on a same side of the microchannel.

PASSIVE MICROFLUIDIC VALVES

A passive microfluidic valve includes a first manifold portion having a first chamber; a first inlet fluidly coupled to the first chamber; and a second inlet. The valve also includes a second manifold portion in fluid communication with the first chamber via a channel. The second manifold portion includes a second chamber fluidly coupled to the first chamber and the second inlet. The valve further includes a flexible membrane disposed between the first manifold portion and the second manifold portion and separating the first chamber and the second chamber, the flexible membrane configured to modulate a flow rate of a media flowing between the first inlet and the second inlet in either direction in response to pressure of the media flow.

MEMS DEVICE, LIQUID EJECTING HEAD, LIQUID EJECTING APPARATUS, METHOD FOR MANUFACTURING MEMS DEVICE

There is provided a MEMS device including: a substrate having a resin portion that protrudes from one surface thereof and is made of a resin, in which the first wiring extends along a first direction on the one surface from a position overlapping the resin portion to a position deviating from the resin portion, and in which a width of the resin portion is equal to or larger than a width of the first wiring covering the resin portion in a second direction intersecting the first direction. 1. A MEMS device comprising:a substrate having a resin portion that protrudes from one surface thereof and is made of a resin and a first wiring that covers at least a portion of a surface of the resin portion,wherein the first wiring extends along a first direction on the one surface from a position overlapping the resin portion to a position deviating from the resin portion, andwherein a width of the resin portion is equal to or larger than a width of the first wiring covering the resin portion in a second direction intersecting the first direction.2. The MEMS device according to claim 1 ,wherein the resin portion includes a first portion and a second portion that is adjacent to the first portion along the second direction and of which a height from the one surface is lower than that of the first portion,wherein the first wiring is provided at a position overlapping the first portion, andwherein a width of the first portion is equal to or larger than the width of the first wiring covering the first portion in the second direction.3. The MEMS device according to claim 2 , further comprising:a second wiring between the first portion and the first wiring,wherein a width of the second wiring is equal or larger than the width of the first wiring covering the first portion in the second direction.4. The MEMS device according to claim 3 ,wherein the width of the second wiring is larger than the width of the first portion in the second direction.5. The MEMS device according to claim 3 , ...

DROPLET CONTROL AND DETECTION DEVICE, OPERATING METHOD THEREOF, AND MICROFLUIDIC DEVICE

A droplet control and detection device and an operating method thereof are provided. The droplet control and detection device includes: a light source; a first electrode; a second electrode; a droplet arranged on a light-exiting side of the light source, where the droplet is movable under the effect of an electric field formed between the first electrode and the second electrode; a photoelectric detection structure configured to detect light emitted by the light source and reflected by the droplet; and a processing circuit configured to obtain droplet information according to a detection result of the photoelectric detection structure and control an electrical signal applied on the first electrode and the second electrode according to the droplet information. 1. A droplet control and detection device , comprising:a light source;a first electrode;a second electrode;a droplet arranged on a light-exiting side of the light source, wherein the droplet is movable under the effect of an electric field formed between the first electrode and the second electrode;a photoelectric detection structure, configured to detect light emitted by the light source and reflected by the droplet; anda processing circuit, configured to obtain droplet information according to a detection result of the photoelectric detection structure and control an electrical signal applied on the first electrode and the second electrode according to the droplet information.2. The droplet control and detection device according to claim 1 , wherein the droplet information comprises at least one of a position parameter claim 1 , an appearance parameter and a component parameter of the droplet.3. The droplet control and detection device according to claim 1 , further comprising:a first hydrophobic layer and a second hydrophobic layer oppositely arranged and on the light-exiting side of the light source, wherein the first hydrophobic layer and the second hydrophobic layer are spaced by a predetermined distance, ...

Substrate plate for mems devices

A substrate plate is provided for at least one MEMS device to be mounted thereon. The MEMS device has a certain footprint on the substrate plate, and the substrate plate has a pattern of electrically conductive leads to be connected to electric components of the MEMS device. The pattern forms contact pads within the footprint of the MEMS device and includes at least one lead structure that extends on the substrate plate outside of the footprint of the MEMS device and connects a number of the contact pads to an extra contact pad. The lead structure is a shunt bar that interconnects a plurality of contact pads of the MEMS device and is arranged to be removed by means of a dicing cut separating the substrate plate into a plurality of chip-sized units. At least a major part of the extra contact pad is formed within the footprint of one of the MEMS devices.

MICROFLUIDIC SYSTEM AND METHOD FOR DRIVING THE SAME

A microfluidic system includes a liquid drop accommodation space, an array of photosensitivity detection circuits and an array of driving circuits between an upper substrate and a lower substrate. Each photosensitivity detection circuit includes a photosensitive transistor and a first gating transistor. The photosensitive transistor has a gate electrode coupled to a first scan signal line, a source electrode coupled to a first power supply voltage signal line, and a drain electrode coupled to a source electrode of the first gating transistor. The first gating transistor has a gate electrode coupled to a second scan signal line, and a drain electrode coupled to a read signal line. Each driving circuit includes a driving transistor and a driving electrode. The driving transistor has a gate electrode coupled to a third scan signal line, a source electrode coupled to a data signal line, and a drain electrode coupled to the driving electrode. 1. A microfluidic system comprising:an upper substrate;a lower substrate that is opposite to the upper substrate;a liquid drop accommodation space between the upper substrate and the lower substrate;a first hydrophobic layer at an outermost surface of the upper substrate, and the outermost surface of the upper substrate facing the liquid drop accommodation space;a second hydrophobic layer at an outermost surface of the lower substrate, and the outermost surface of the lower substrate facing the liquid drop accommodation space;a common electrode layer between the upper substrate and the lower substrate;an array of photosensitivity detection circuits between the lower substrate and the second hydrophobic layer; andan array of driving circuits between the lower substrate and the second hydrophobic layer;wherein each photosensitivity detection circuit includes a photosensitive transistor and a first gating transistor;wherein a gate electrode of the photosensitive transistor is coupled to a first scan signal line, a source electrode of ...

INTEGRATED ANALYSIS DEVICES AND RELATED FABRICATION METHODS AND ANALYSIS TECHNIQUES

Provided are integrated analysis devices having features of macroscale and nanoscale dimensions, and devices that have reduced background signals and that reduce quenching of fluorophores disposed within the devices. Related methods of manufacturing these devices and of using these devices are also provided 1100.-. (canceled)101. A method of analysis , comprising:translocating a DNA molecule through a primary fluidic channel and two or more additional fluidic channels in fluid communication with the primary fluidic channel and of successively decreasing width such that at least a portion of the DNA molecule is elongated while disposed in a nanochannel analysis region of the two or more additional fluidic channels, wherein the total widths of the narrowest additional fluidic channels are approximately equal to the width of the primary fluidic channel;detecting a signal arising from the elongated DNA molecule or portion thereof within the nanochannel analysis region; andcorrelating the signal to a property of the DNA molecule.102. The method of claim 101 , wherein the primary fluidic channel has a width in the range of from about 10 nm to less than about 10000 nm.103. The method of claim 101 , wherein the primary fluidic channel has a width in the range of from about 100 nm to less than about 1000 nm.104. The method of claim 101 , wherein the primary fluidic channel has a depth in the range of from about 10 nm to less than about 10000 nm.105. The method of claim 101 , wherein the primary fluidic channel has a depth in the range of from about 100 nm to less than about 1000 nm.106. The method of claim 101 , wherein the ratio of the widths of the primary fluidic channel and each of the narrowest additional fluidic channels is in the range of from about 100 to about 10000.107. The method of claim 101 , wherein the translocating is accomplished by application of an electrical gradient claim 101 , a pressure gradient claim 101 , a magnetic field claim 101 , a thermal ...

CONTROLLED CHEMICAL SYNTHESIS USING POLYMER SUBSTRATES AND NANOFLUIDIC SEPARATION SYSTEMS

Methods of liquid-phase synthesis of polymers using polymer substrates and systems for facilitating such methods allow gating of a synthetic reaction into a binary (reacted or unreacted) readout. Polymer substrates are used as carriers for molecular reagents and act as separation tags that allow them to be purified using nanoscale deterministic lateral displacement. Two polymer substrates are linked together by a bond-forming reaction to form a longer polymer that includes a synthetic product. The synthetic product can be purified away from unreacted polymers/reagents using strand-length dependent lateral displacement. 1. A method of synthesizing molecules , comprising:providing a first mixture of core polymers and carrier polymers, the core polymers and the carrier polymers including tether bonds and reagents;forming linking bonds between the core polymers and the carrier polymers, thereby obtaining a second mixture comprising link species including the linking bonds; and flowing the second mixture through a first nanoDLD array configured to separate the link species from the core polymers and the carrier polymers; and', 'diverting the link species away from the core polymers and the carrier polymers in the first nanoDLD array; and, 'separating the link species from the core polymers and the carrier polymers remaining within the second mixture, includingfragmenting the link species.2. The method of claim 1 , wherein the first nanDLD array has a cut-off length configured for displacing the link species with respect to the core polymers and the carrier polymers as a B-mode fraction.3. The method of claim 1 , wherein fragmenting the link species forms a third mixture including core plus residue polymers claim 1 , spent carrier polymers and unfragmented link species; and further including:separating the unfragmented link species from the core plus residue polymers and the spent carrier polymers, including flowing the third mixture through a second nanoDLD array ...

MEMS CRYOCOOLER SYSTEMS AND METHODS

Techniques are disclosed for systems and methods using microelectromechanical systems MEMS techniques to provide cryogenic and/or general cooling of a device or sensor system. In one embodiment, a system includes a compressor assembly and MEMS expander assembly in fluid communication with the compressor assembly via a gas transfer line configured to physically separate and thermally decouple the MEMS expander assembly from the compressor assembly. The MEMS expander assembly includes a plurality of expander cells each including a MEMS displacer, a cell regenerator, and an expansion volume disposed between the MEMS displacer and the cell regenerator, and the plurality of cell regenerators are configured to combine to form a contiguous shared regenerator for the MEMS expander assembly. 1. A system comprising:a compressor assembly; and the MEMS expander assembly comprises a plurality of expander cells each comprising a MEMS displacer, a cell regenerator, and an expansion volume disposed between the MEMS displacer and the cell regenerator, and', 'the plurality of cell regenerators are configured to combine to form a contiguous shared regenerator for the MEMS expander assembly., 'a microelectromechanical systems (MEMS) expander assembly in fluid communication with the compressor assembly via a gas transfer line configured to physically separate and thermally decouple the MEMS expander assembly from the compressor assembly, wherein2. The system of claim 1 , wherein:at least one of the plurality of expander cells comprises an expander buffer volume assembly; andthe expander buffer volume assembly comprises an expander cell buffer volume, a buffer volume valve disposed between the expander cell buffer volume and the expansion volume of the at least one expander cell, and an expander valve disposed between the expansion volume and the cell regenerator of the at least one expander cell.3. The system of claim 2 , wherein:the expander cell buffer volume is disposed within the ...

EPITAXIAL-SILICON WAFER WITH A BURIED OXIDE LAYER

Examples of an epitaxial-silicon wafer with a buried oxide layer are described herein. Examples of methods to manufacture an epitaxial-silicon wafer with a buried oxide layer are also described herein. In some examples, material may be removed from an epitaxial-silicon wafer at a surface opposite an epitaxial surface layer until the epitaxial-silicon wafer is a specified thickness. The thinned epitaxial-silicon wafer may be bonded to an oxidized-silicon wafer at an oxidized surface forming a buried oxide layer. 1. A method , comprising:removing material from an epitaxial-silicon wafer at a surface opposite an epitaxial surface layer until the epitaxial-silicon wafer is a specified thickness; andbonding the thinned epitaxial-silicon wafer to an oxidized-silicon wafer at an oxidized surface forming a buried oxide layer.2. The method of claim 1 , wherein removing the material from the epitaxial-silicon wafer comprises grinding the surface opposite the epitaxial surface layer until the epitaxial-silicon wafer is the specified thickness.3. The method of claim 1 , wherein bonding the thinned epitaxial-silicon wafer to the oxidized-silicon wafer comprises a low-temperature bond.4. The method of claim 3 , wherein the low-temperature bond comprises an adhesive bond.5. The method of claim 1 , wherein the epitaxial-silicon wafer comprises a heavily doped silicon substrate and a lightly doped epitaxial surface layer.6. The method of claim 1 , wherein the oxidized-silicon wafer comprises a lightly doped silicon substrate with the oxidized surface.7. A method claim 1 , comprising:attaching an epitaxial surface layer of a epitaxial-silicon wafer to a handle wafer;grinding a surface opposite the epitaxial surface layer until the epitaxial-silicon wafer is a specified thickness;polishing the surface opposite the epitaxial surface layer;removing the thinned epitaxial-silicon wafer from the handle wafer; andbonding the thinned epitaxial-silicon wafer to an oxidized-silicon wafer at an ...

FLUIDIC DEVICE, SYSTEM, METHOD OF DETECTING SAMPLE MATERIAL AND METHOD OF PURIFYING SAMPLE MATERIAL

A fluidic device includes a first circulation flow path and a second circulation flow path which circulate a solution containing a sample material, the first circulation flow path and the second circulation flow path share at least a part of the flow path, and at least one selected from the group consisting of a capture unit which captures the sample material, a detection unit which detects the sample material, a valve, and a pump is provided on the shared flow path. 1. A fluidic device , comprising:a first circulation flow path and a second circulation flow path which circulate a solution containing a sample material,wherein the first circulation flow path and the second circulation flow path comprise a shared flow path which is at least a part of the first and second circulation flow paths shared by the first and second flow paths,wherein the first circulation flow path consists of the shared flow path that is shared by the second circulation flow path and a non-shared flow path having a shorter flow path length than the shared flow path, and a first valve is provided in the non-shared flow path,wherein the second circulation flow path consists of the shared flow path, a pair of connecting portions that are connected to the shared flow path, and a bypass flow path, andwherein the pair of connecting portions are provided at a position adjacent to the first valve, and each of the pair of connection portions has each of second and third valves.2. The fluidic device according to claim 1 ,wherein at least one selected from the group consisting of a capture unit which captures the sample material, a detection unit which detects the sample material, a valve, and a pump is provided on the shared flow path.3. (canceled)4. (canceled)5. The fluidic device according to claim 2 ,wherein the detection unit detects a sample material bound to a detection auxiliary material, andan auxiliary material detection unit which detects the detection auxiliary material is provided on the ...

NOZZLE SUBSTRATE, INK-JET PRINT HEAD, AND METHOD FOR PRODUCING NOZZLE SUBSTRATE

There is provided a nozzle substrate including a nozzle hole penetrating in a thickness direction. The nozzle substrate includes a main substrate including a first surface and a second surface, an oxidation film formed on the second surface of the main substrate, and a water repellent film formed on a surface at an opposite side to the main substrate side of the oxidation film. The nozzle hole includes a first through hole penetrating the main substrate in a thickness direction, a second through hole penetrating the oxidation film and being connected to the first through hole, and a third through hole penetrating the water repellent film and being connected to the second through hole. An inner circumference surface of the second through hole and an inner circumference surface of the third through hole are approximately flush. 1. A nozzle substrate including a nozzle hole penetrating in a thickness direction , the nozzle substrate comprising:a main substrate including a first surface and a second surface;an oxidation film formed on the second surface of the main substrate; anda water repellent film formed on a surface at an opposite side to the main substrate side of the oxidation film,wherein the nozzle hole includes a first through hole penetrating the main substrate in a thickness direction, a second through hole penetrating the oxidation film and being connected to the first through hole, and a third through hole penetrating the water repellent film and being connected to the second through hole, andan inner circumference surface of the second through hole and an inner circumference surface of the third through hole are approximately flush.2. The nozzle substrate according to claim 1 ,wherein transverse sections of the second through hole and the third through hole are circular, and{'b': 2', '1', '1', '1', '2', '1, 'percentage of a ratio (D−D)/D of a value, in which a diameter D of the second through hole is subtracted from a diameter D of the third through hole, ...

AMORPHOUS THIN METAL FILM

An amorphous thin film stack can include a first layer including a combination metals or metalloids including: 5 at % to in 90 at % of a metalloid; 5 at % to 90 at % of a first metal and a second metal independently selected from titanium, vanadium, chromium, iron, cobalt, nickel, niobium, molybdenum, ruthenium, rhodium, palladium, tantalum, tungsten, osmium, iridium, or platinum. The three elements may account for at least 70 at % of the amorphous thin film stack. The stack can further include a second layer formed on a surface of the first layer. The second layer can be an oxide layer, a nitride layer, or a combination thereof. The second layer can have an average thickness of 10 angstroms to 200 microns and a thickness variance no greater than 15% of the average thickness of the second layer. 1. An amorphous thin film stack , comprising: 5 at % to 90 at % of a metalloid, wherein the metalloid is carbon, silicon, or boron,', '5 at % to 90 at % of a first metal, wherein the first metal is titanium, vanadium, chromium, iron, cobalt, nickel, niobium, molybdenum, ruthenium, rhodium, palladium, tantalum, tungsten, osmium, iridium, or platinum, and', '5 at % to 90 at % of a second metal, wherein the second metal is titanium, vanadium, chromium, iron, cobalt, nickel, niobium, molybdenum, ruthenium, rhodium, palladium, tantalum, tungsten, osmium, iridium, or platinum, wherein the second metal is different than the first metal,', 'wherein the metalloid, the first metal, and the second metal account for at least 70 at % of the amorphous thin metal film; and, 'a first layer of an amorphous thin metal film, comprisinga second layer formed on a surface of the first layer, the second layer being an oxide layer, a nitride layer, or a combination thereof, and the second layer having an average thickness of 10 angstroms to 200 microns and having a thickness variance no greater than 15% of the average thickness of the second layer.2. The amorphous thin film stack of claim 1 , ...

MICROELECTROMECHANICAL SYSTEM (MEMS) DEVICES

One example provides a microelectromechanical systems (MEMS) device that includes a number of silicon die over-molded with an overmold material, a number of active areas formed on the silicon die, the active areas including at least one sensor to sense a number of attributes of a fluid introduced to the at least one sensor, and a fan-out layer coupled to the silicon die, the fan-out layer including a number of fluid channels formed therein that interface with active areas of the silicon die and allow the fluid to flow to the at least one sensor. 1. A microelectromechanical systems (MEMS) device comprising:a number of silicon dies overmolded with an overmold material;a number of active areas formed on the silicon dies, the active areas comprising at least one sensor to sense a number of attributes of a fluid introduced to the at least one sensor; anda fan-out layer coupled to the silicon dies, the fan-out layer comprising a number of fluid channels formed therein that interface with the active areas of the silicon dies and allow the fluid to flow to the at least one sensor.2. The MEMS device of claim 1 , further comprising a number of fluid input/output ports defined in the fan-out layer coupling the fluid channels to an exterior environment.3. The MEMS device of claim 1 , wherein the active areas further comprise a number of actuators to cause the fluid introduced into the fluid channels to interact with the sensors.4. The MEMS device of claim 1 , wherein the active areas comprise a reagent storage to store a number of reagents to react with the fluid introduced into the fluid channels.5. The MEMS device of claim 1 , wherein the MEMS device comprises a surface area comprising at least a majority of the overmold material relative to silicon of the silicon dies.6. The MEMS device of claim 1 , wherein the overmold material is an epoxy mold compound (EMC).7. A method of forming a microelectromechanical systems (MEMS) device comprising:overmolding a number of dies with ...

DIGITAL MICROFLUIDIC SYSTEMS AND METHODS FOR DROPLET MANIPULATION

The present disclosure relates to digital microfluidic systems. Particularly, aspects are directed to a digital microfluidic system that includes a droplet chip having a substrate, a plurality of electrodes and corresponding plurality of conducting vias or embedded conductive posts formed in the substrate, and a dielectric layer formed over the plurality of electrodes; and a control chip having a substrate, a plurality of transistors and corresponding wiring layers formed in the substrate, and a plurality of contacts formed over the plurality of transistors. Each of the plurality of contacts is electrically connected to a corresponding transistor of the plurality of transistors, and one or more of the plurality of contacts is removably connected to one or more of the plurality of conducting vias or embedded conductive posts such that one or more of the plurality of transistors are electrically connected to one or more of the plurality of electrodes. 1. A digital microfluidic system comprising:a droplet chip comprising a first substrate, a plurality of electrodes and corresponding plurality of conducting vias or embedded conductive posts formed in the substrate, and a dielectric layer formed over the plurality of electrodes; anda control chip comprising a second substrate, a plurality of transistors and corresponding wiring layers formed in the second substrate, and a plurality of contacts formed over the plurality of transistors,wherein each of the plurality of contacts is electrically connected to a terminal of a corresponding transistor of the plurality of transistors, and one or more of the plurality of contacts is removably connected to one or more of the plurality of conducting vias or embedded conductive posts such that one or more of the plurality of transistors are electrically connected to one or more of the plurality of electrodes.2. The digital microfluidic system of claim 1 , wherein:the first substrate, the plurality of electrodes and the corresponding ...

Substrate assembly and related methods

Example sensor apparatus for microfluidic devices and related methods are disclosed. In examples disclosed herein, a method of fabricating a sensor apparatus for a microfluidic device includes etching a portion of an intermediate layer to form a sensor chamber in a substrate assembly, where the substrate assembly has a base layer and the intermediate layer, and where the base layer comprises a first material and the intermediate layer comprises a second material different than the first material. The method includes forming a first electrode and a second electrode in the sensor chamber. The method also includes forming a fluidic transport channel in fluid communication with the sensor chamber, where the fluidic transport channel comprises a third material different than the first material and the second material.

A MICROFLUIDIC DEVICE WITH INTEGRATED MICRO-STRUCTURED ELECTRODES AND METHODS THEREOF

The present disclosure provides a microfluidic device comprising a set of micro-structured electrodes. The electrodes are made of a fusible alloy such as Field's Metal and are patterned on a layer of PDMS. The molten fusible alloy is poured over the patterned PDMA layer and a suction force is applied to ensure uniformity of flow of the molten metal. A second layer comprising a flow channel orthogonal to the direction of the micro-structured electrodes is disposed under the first layer to form the microfluidic device. The device shows enhanced sensitivity to RBC detection at high frequencies that are also bio-compatible (above 2 MHz). Multiple layers of the micro-structures electrodes can be sandwiched between layers of flow channels to provide a 3D microfluidic device. 1. A method for fabricating a microfluidic device , said method comprising the steps of:coating a negative photoresist on a substrate;casting of an elastomeric polymer to form microchannels;introducing a molten fusible alloy (FA) into a first layer made of a polymer material and comprising one or more parallel independent channels for corresponding one or more electrodes, wherein the one or more independent channels converge at a detection point;placing the first layer from over a second layer made of the polymer material, wherein the second electrode layer is un-patterned and is a sacrificial layer;fusing the first layer and the second layer with heat such that there are no air bubbles between the first electrode layer and second electrode layer; andplacing a third layer comprising a flow channel under the first layer such that the flow channel runs orthogonal to the one or more independent channels on the first electrode layer,wherein an object of interest present in a fluid medium passes through the flow channel by itself or to be dispersed as droplets at the point of detection, andwherein the device detects presence of the object of interest based on change in impedance between the one or more ...

Method and device for thermocompression bonding

There are provided a method and device for thermocompression bonding of possibly preventing any warping of a resin member to be caused by thermocompression bonding, and of possibly reducing the time to be taken for processing. The method for thermocompression bonding, includes: preheating a resin member using an infrared radiation section; and subjecting the resin member to thermocompression bonding using a heating section and a pressurization section.

Actuation of microchannels for optimized acoustophoresis

The systems and methods of the present disclosure provide techniques for the design and use of an intermediate or transitional plate or block designed to couple acoustic energy at a given frequency from a transducer, such as a piezoelectric transducer, to one or more acoustophoretic devices, such as microfluidic channels, such that driving the chip occurs with a controlled wavelength and symmetry. Such techniques provide improved efficiency when driving a single acoustophoretic device, or for multiple acoustophoretic devices to be operated in concert from a single transducer, and therefore without complex electronics. Additionally, the techniques described herein allow for relaxed design constraints when considering transducer selection and fabrication, instead transferring design constraints to the more easily customized actuation plate.

DEEP REACTIVE ION ETCHING PROCESS FOR FLUID EJECTION HEADS

An ejection head chip and method for a fluid ejection device and a method for reducing a silicon shelf width between a fluid supply via and a fluid ejector stack. The ejection head chip includes a silicon substrate and a fluid ejector stack deposited on the silicon substrate, wherein at least one metal layer of the fluid ejector stack is isolated from a fluid supply via etched in the ejection head chip by an encapsulating material. 1. An ejection head chip for a fluid ejection device comprising , a silicon substrate and a fluid ejector stack deposited on the silicon substrate , wherein at least one metal layer of the fluid ejector stack is isolated from a fluid supply via etched in the ejection head chip by an encapsulating material.2. The ejection head chip of claim 1 , wherein a silicon shelf width between the fluid supply via and the fluid ejector stack ranges from about 0 to about 20 microns.3. The ejection head chip of claim 1 , wherein the at least one metal layer comprises tantalum.4. The ejection head chip of claim 1 , wherein the fluid supply via is etched in the silicon substrate from a fluid ejector stack side of the substrate using a deep reactive ion etch (DRIE) process.5. The ejection head chip of claim 1 , wherein the fluid supply via has a minimum width ranging from about 60 to about 520 microns.6. The ejection head chip of claim 1 , wherein the encapsulating material comprises silicon oxide or silicon dioxide derived from a chemical vapor deposition of an organic silicon compound as a protective overcoat layer.7. The ejection head chip of claim 6 , wherein the encapsulating material further comprises an inter-metal dielectric layer.8. The ejection head chip of claim 7 , wherein the inter-metal dielectric layer comprises a doped or undoped diamond-like-carbon material.9. The ejection head chip of claim 6 , wherein the encapsulating material further comprises a silicon nitride layer.10. The ejection head chip of claim 1 , wherein the at least one ...

Method for Making Microneedles Using a High Viscosity Composition

The present invention provides a novel method for manufacturing a microstructure via the use of a viscous polymer, particularly microstructures that may be found on medical devices, such as transdermal patches, for either cosmetic or medicinal purposes. 1. A method for manufacturing a microstructure , the method comprising the step of applying a microstructure composition to a perforated template comprising through-holes , wherein the microstructure composition passes through a through-hole and is deposited on a substrate , thereby forming a microstructure , characterised in that the microstructure composition has a viscosity of at least 10 ,000 cps.2. The method of claim 1 , further comprising the step of exposing the microstructure composition deposited on the substrate to a curing agent claim 1 , preferably wherein the curing agent is ultraviolet light.3. The method of claim 1 , wherein the method further comprises one or more further steps comprising repeating application of the microstructure composition claim 1 , optionally wherein the perforated template is moved away from the substrate and re-positioned and aligned claim 1 , such that the through hole aligns with the microstructure claim 1 , between each application of the microstructure composition.4. The method of claim 3 , wherein the template is re-positioned using an alignment system of positional markings incorporated on a surface of the perforated template claim 3 , and corresponding markers incorporated on the substrate onto which the microstructure composition is deposited.5. The method of claim 1 , wherein the microstructure composition has a viscosity of 10 claim 1 ,000 to 250 claim 1 ,000 cps.6. The method of claim 1 , wherein the microstructure composition comprises a polymer claim 1 , preferably wherein the polymer comprises a UV-curable polymer.7. The microstructure composition of claim 6 , wherein the UV-curable polymer comprises acrylate and/or methacrylate.8. The method of claim 1 , wherein ...

COMPOSITE WAFERS

A composite wafer includes a first silicon die with a first top surface; and a polymer substrate with a top surface and a bottom surface. The silicon die is embedded in the polymer substrate such that the top surface of the substrate and the first top surface of the first silicon die are coplanar and the bottom surface of the polymer substrate is planar. 1. A composite wafer , the wafer comprising:a first silicon die with a top surface; anda polymer substrate with a top surface and a bottom surface, the silicon die embedded in the polymer substrate such that the top surface of the substrate and the first top surface of the first silicon die are coplanar and the bottom surface of the polymer substrate is planar.2. The wafer of claim 1 , further comprising a layer of photosensitive polymer applied over the top surface of the silicon die and the top surface of the polymer substrate.3. The wafer of claim 2 , wherein the layer of photosensitive polymer is patterned.4. The wafer of claim 1 , wherein the first silicon die comprises a component of a microfluidics device.5. The wafer of claim 1 , further comprising a second die with a top surface.6. The wafer of claim 5 , wherein the top surface of the second die is coplanar with the top surface of the first silicon die.7. The wafer of claim 5 , wherein the top surface of the second die is coplanar with the bottom surface of the polymer substrate.8. The wafer of claim 5 , further comprising an electrical connection between the first silicon die and the second die through the polymer substrate.9. The wafer of claim 5 , wherein the first silicon die and the second die have different thicknesses.10. A method of forming a composite die claim 5 , the method comprising:applying a tape to a first surface of a silicon die;forming a polymer substrate around the silicon die, the polymer substrate have a first surface coplanar with the first surface of the silicon die; andremoving the tape from the first surface of the silicon die.11. ...

PILLAR ARRAY STRUCTURE WITH UNIFORM AND HIGH ASPECT RATIO NANOMETER GAPS

A technique related to sorting entities is provided. An inlet is configured to receive a fluid, and an outlet is configured to exit the fluid. A nanopillar array, connected to the inlet and the outlet, is configured to allow the fluid to flow from the inlet to the outlet. The nanopillar array includes nanopillars arranged to separate entities by size. The nanopillars are arranged to have a gap separating one nanopillar from another nanopillar. The gap is constructed to be in a nanoscale range. 1. An apparatus comprising:an inlet configured to receive a fluid;an outlet configured to exit the fluid; anda nanopillar array connected to the inlet and the outlet, the nanopillar array configured to allow the fluid to flow from the inlet to the outlet;wherein the nanopillar array includes nanopillars arranged to separate entities by size;wherein the nanopillars are arranged to have a gap separating one nanopillar from another nanopillar; andwherein the gap is constructed to be in a nanoscale range.2. The apparatus of claim 1 , wherein the one nanopillar is to a side of the another nanopillar claim 1 , such that the gap is in between.3. The apparatus of claim 1 , wherein the gap between the one nanopillar and the another nanopillar is uniform along a vertical axis of the one nanopillar and the another nanopillar.4. The apparatus of claim 1 , wherein the nanopillar array comprises an oxide layer applied on the nanopillars claim 1 , the oxide layer causing the gap to be uniform along a vertical axis of the one nanopillar and the another nanopillar.5. The apparatus of claim 4 , wherein the oxide layer causes a size of the gap to be as small as about 20 nanometers while the gap remains uniform.6. The apparatus of claim 4 , wherein the oxide layer causes unevenness in a diameter of the nanopillars to be uniform claim 4 , resulting in the gap being uniform along the vertical axis of the one nanopillar and the another nanopillar.7. The apparatus of claim 4 , wherein an increase in ...

Direct Bond Transfer Layers for Manufacturable Sealing of Microfluidic Chips

Techniques for use of wafer bonding techniques for sealing of microfluidic chips are provided. In one aspect, a wafer bonding sealing method includes the steps of: forming a first oxide layer coating surfaces of a first wafer, the first wafer having at least one fluidic chip; forming a second oxide layer on a second wafer; and bonding the first wafer to the second wafer via an oxide-to-oxide bond between the first oxide layer and the second oxide layer to form a bonded wafer pair, wherein the second oxide layer seals the at least one fluidic chip on the first wafer. The second wafer can be at least partially removed after performing the bonding, and fluidic ports may be formed in the second oxide layer. A fluidic chip device is also provided. 1. A wafer bonding sealing method , comprising the steps of:forming a first oxide layer coating surfaces of a first wafer, the first wafer comprising at least one fluidic chip;forming a second oxide layer on a second wafer; andbonding the first wafer to the second wafer via an oxide-to-oxide bond between the first oxide layer and the second oxide layer to form a bonded wafer pair, wherein the second oxide layer seals the at least one fluidic chip on the first wafer.2. The method of claim 1 , wherein the at least one fluidic chip includes fluidic channels joined by nanochannel structures.3. The method of claim 2 , wherein each of the nanochannel structures comprises a pillar arrangement for particle sorting.4. The method of claim 1 , wherein the first oxide layer has a thickness of from about 5 nm to about 50 nm claim 1 , and ranges therebetween.5. The method of claim 1 , wherein the second oxide layer has a thickness of from about 0.5 μm to about 2 μm claim 1 , and ranges therebetween.6. The method of claim 1 , further comprising the step of:at least partially removing the second wafer after performing the bonding.7. The method of claim 1 , further comprising the step of:fully removing the second wafer after performing the ...

PROCESSES FOR RAPID MICROFABRICATION USING THERMOPLASTICS AND DEVICES THEREOF

A method is provided to prepare one or more microfluidic channels on a receptive material by applying an image-forming material to a heat sensitive thermoplastic receptive material in a designed pattern and heating the material under conditions that reduce the size of the thermoplastic receptive material by at least about 60%. In an alternative aspect, the microfluidic channels on receptive material are prepared by etching a designed pattern into a heat sensitive thermoplastic material support and then heating the material under conditions that reduce the size of the thermoplastic receptive material by at least about 60%. 157.-. (canceled)58. A device comprising a heat-shrunk thermoplastic base having a textured metal surface , wherein the textured metal surface has an average height from about 100 nanometers to about 5 micrometers.59. The device of claim 58 , wherein the textured metal surface comprises at least one metal selected from the group consisting of silver claim 58 , gold and copper.60. A method to prepare one or more microfluidic channels on a receptive material claim 58 , comprising the steps of:a) applying an image-forming material to a heat sensitive thermoplastic receptive material in a designed pattern;b) heating said material under conditions that reduce the size of the thermoplastic receptive material by at least about 60%; andc) preparing the microfluidic channels via lithography.61. The method according to claim 60 , wherein the image-forming material is a liquid containing one or more of the group of pigment claim 60 , dye claim 60 , or combination thereof.62. The method according to claim 60 , wherein the image-forming material is one or more of the group of an ink claim 60 , a protein claim 60 , a colloid claim 60 , a dielectric material claim 60 , a paste claim 60 , or a combination thereof.63. The method according to claim 60 , wherein the image-forming material is a metal.64. The method according to claim 63 , wherein the metal is one or ...

WIRING STRUCTURE, MEMS DEVICE, LIQUID EJECTING HEAD, LIQUID EJECTING APPARATUS, METHOD FOR MANUFACTURING MEMS DEVICE, METHOD FOR MANUFACTURING LIQUID EJECTING HEAD AND METHOD FOR MANUFACTURING LIQUID EJECTING APPARATUS

A wiring structure includes a connecting terminal array formed on a first substrate and a connected terminal array formed on a second substrate, which are electrically connected, wherein a dummy terminal that is not used for transmission and reception of an electrical signal is provided on at least one end of the connecting terminal array in a terminal arrangement direction, and an anisotropic conductive film containing a conductive particle which is disposed between the first substrate and the second substrate extends to the dummy terminal such that an end of the anisotropic conductive film is located on a surface of the dummy terminal. 1. A wiring structure comprising: a connecting terminal array formed on a first substrate; and a connected terminal array formed on a second substrate , which are electrically connected , whereina dummy terminal that is not used for transmission and reception of an electrical signal is provided on at least one end of the connecting terminal array in a terminal arrangement direction, andan anisotropic conductive film containing a conductive particle which is disposed between the first substrate and the second substrate extends to the dummy terminal such that an end of the anisotropic conductive film is located on a surface of the dummy terminal.2. The wiring structure according to claim 1 , wherein a width of the anisotropic conductive film is smaller than a width of the dummy terminal in a direction vertical to the terminal arrangement direction and at least one end of the anisotropic conductive film is located on a surface of the dummy terminal.3. The wiring structure according to claim 1 , wherein an area of the dummy terminal is the same as an area of a largest connecting terminal among a plurality of connecting terminals that form the connecting terminal array.4. A MEMS device comprising: a first substrate; and a second substrate claim 1 , which are electrically connected by the wiring structure according to .5. A MEMS device ...

MEMS DEVICE, LIQUID EJECTING HEAD, AND LIQUID EJECTING APPARATUS

A MEMS device includes a drive region having a stacked structural body in which a first electrode layer, a first dielectric layer, and a second electrode layer are stacked in that order. The stacked structural body extends from the drive region to a non-drive region that is outer than the drive region and, in an extending direction of the stacked structural body, the first electrode layer and the first dielectric layer extend farther outward than the second electrode layer. A second dielectric layer covering an end of the second electrode layer in the extending direction is stacked on the second electrode layer in the non-drive region and the first dielectric layer that is formed outer in the extending direction than the second electrode layer. A third electrode layer electrically connected to the second electrode layer is stacked on the second dielectric layer and on the second electrode layer in a region outside the second dielectric layer. In the extending direction, the end of the second electrode layer is formed more to a drive region side than a second dielectric layer-side end of the third electrode layer. 1. A MEMS device comprisinga drive region having a stacked structural body in which a first electrode layer, a first dielectric layer, and a second electrode layer are stacked in that order,wherein the stacked structural body extends from the drive region to a non-drive region that is outer than the drive region and, in an extending direction of the stacked structural body, the first electrode layer and the first dielectric layer extend farther outward than the second electrode layer, andwherein a second dielectric layer covering an end of the second electrode layer in the extending direction is stacked on the second electrode layer in the non-drive region and the first dielectric layer that is formed outer in the extending direction than the second electrode layer, andwherein a third electrode layer electrically connected to the second electrode layer is ...

FABRICATION OF MICROFLUIDIC CHIPS HAVING ELECTRODES LEVEL WITH MICROCHANNEL WALLS

The present invention is notably directed to method of fabrication of a microfluidic chip, comprising: providing a substrate, a face of which is covered by an electrically insulating layer; obtaining a resist layer covering one or more selected portions of the electrically insulating layer, at least a remaining portion of said electrically insulating layer not being covered by the resist layer; partially etching with a wet etchant a surface of the remaining portion of the electrically insulating layer to create a recess and/or an undercut under the resist layer; depositing the electrically conductive layer on the etched surface, such that the electrically conductive layer reaches the created recess and/or undercut; and removing the resist layer to expose a portion of the electrically insulating layer adjoining a contiguous portion of the electrically conductive layer. The present invention is further directed to microfluidic chips obtainable by such methods. 24013v. The microfluidic chip according to , wherein the electrically conductive layer abuts a contiguous portion of the electrically insulating layer , subject to a residual void () due to a recess and/or an undercut created during the fabrication of the chip according to the method of any one of to . The invention relates in general to the field of methods of fabrication of microfluidic chips. It is in particular directed to wafer-based fabrication of microfluidic chips and to the fabrication of chips having electrodes extending through microstructures and microchannels thereof.Microfluidics generally refers to microfabricated devices, which are used for pumping, sampling, mixing, analyzing and dosing liquids. Prominent features thereof originate from the peculiar behavior that liquids exhibit at the micrometer length scale. Flow of liquids in microfluidics is typically laminar. Volumes well below one nanoliter can be reached by fabricating structures with lateral dimensions in the micrometer range. Reactions ...

MEMS DEVICE, LIQUID EJECTING HEAD, AND LIQUID EJECTING APPARATUS

In an MEMS device, in a Z direction that is a direction in which a first core portion, a plurality of first bump wiring, and a plurality of first individual wiring are laminated, a width between the first core portion and a wiring substrate is wider than a maximum particle diameter of solid particles contained in an adhesive, and a width between a first wiring and a second wiring and a width between a third wiring and a fourth wiring are wider than the maximum particle diameter of the solid particles. 1. An MEMS device comprising:a first substrate;a resin formed on the first substrate;a plurality of wirings including a first wiring and a second wiring formed on the resin;a second substrate bonded to the plurality of wirings; anda plurality of wirings including a third wiring and a fourth wiring formed on the second substrate,wherein the first substrate and the second substrate are bonded to each other via an adhesive,wherein the first substrate and the second substrate are electrically connected to each other via the first wiring and the third wiring,wherein the first substrate and the second substrate are electrically connected to each other via the second wiring and the fourth wiring,wherein the adhesive contains solid particles,wherein, in a first direction that is a direction in which the resin and the plurality of wirings are laminated, a width between the resin and the second substrate is wider than a maximum particle diameter of the solid particles, andwherein a width between the first wiring and the second wiring or a width between the third wiring and the fourth wiring is wider than the maximum particle diameter of the solid particles.2. The MEMS device according to claim 1 ,wherein, in a cross-sectional view in the first direction, a film thickness of the resin in a region between the first wiring and the second wiring is thinner than the film thickness of the resin in a region where the first wiring or the second wiring is formed.3. The MEMS device ...

MICROFLUIDIC DEVICE WITH MANIFOLD

A device includes: a die including a microfluidic device; a polymer substrate formed around the die; and a separate fluid manifold attached to the polymer substrate over the die and on a same side of the substrate as the die, the manifold to deliver fluid to the die. 1. A device comprising:a die comprising a microfluidic device;a polymer substrate formed around the die; anda separate fluid manifold attached to the polymer substrate over the die and on a same side of the substrate as the die, the manifold to deliver fluid to the die.2. The device of claim 1 , wherein the die comprises micron-scale fluid passageways formed over thin film circuitry claim 1 , the fluid passageways to communicate fluid from the manifold to components of the microfluidic device.3. The device of claim 1 , wherein the polymer substrate is formed around the die with no gap.4. The device of claim 1 , wherein a top surface of the die is coplanar with a top surface of the substrate.5. The device of claim 1 , wherein the manifold is formed of molded plastic.6. The device of claim 1 , wherein the manifold comprises a tube formed of a metal claim 1 , plastic claim 1 , or ceramic.7. The device of claim 1 , further comprising a microfluidic routing layer of lithographically patterned material between the die and the manifold to route fluid from the manifold to corresponding portions of the microfluidic device in the die.8. The device of claim 1 , wherein at least a portion of the manifold is attached to the substrate away from the die such that a fluid pathway from the manifold to the die includes a portion of a top surface of the substrate as part of a fluidic interface between the manifold and die.9. A method of forming a device claim 1 , the method comprising:forming a microfluidic device in a semiconductor die;forming a polymer substrate around the die; andattaching a separate manifold to the substrate over the die, the manifold providing channels for conducting fluid to the microfluidic device ...

MICROCHEMICAL SYSTEM APPARATUS AND RELATED METHODS OF FABRICATION

The disclosure relates to microchemical (or microfluidic) apparatus as well as related methods for making the same. The methods generally include partial sintering of sintering powder (e.g., binderless or otherwise free-flowing sintering powder) that encloses a fugitive phase material having a shape corresponding to a desired cavity structure in the formed apparatus. Partial sintering removes the fugitive phase and produces a porous compact, which can then be machined if desired and then further fully sintered to form the final apparatus. The process can produce apparatus with small, controllable cavities shaped as desired for various microchemical or microfluidic unit operations, with a generally smooth interior cavity finish, and with materials (e.g., ceramics) able to withstand harsh environments for such unit operations. 120-. (canceled)21. A microchemical apparatus comprising:a fully sintered metal oxide body comprising an interior cavity within the body; the interior cavity has a minimum dimension in a range from 1 μm to 1000 μm; and', 'the interior cavity has a surface roughness of 20 μm or less., 'wherein22. The microchemical apparatus of claim 21 , wherein the fully sintered metal oxide body has a density of at least 80% relative to the theoretical density of the metal oxide.23. The microchemical apparatus of claim 21 , wherein the interior cavity is fully enclosed by the fully sintered metal oxide body.24. The microchemical apparatus of claim 21 , wherein the interior cavity is partially enclosed by the fully sintered metal oxide body. Priority is claimed to U.S. Provisional Application No. 62/378,932 filed Aug. 24, 2016, which is incorporated herein by reference in its entirety.None.The disclosure relates to relates to microchemical (or microfluidic) apparatus as well as related methods for making the same. The methods generally include partial sintering of sintering powder, removal of a fugitive phase material within the powder to create internal ...

METHOD FOR FORMING FILM AND METHOD FOR MANUFACTURING INKJET PRINT HEAD

A method for forming a film that covers a side wall of a through hole in a substrate having the through hole, the method including, in the following order, the steps of providing a substrate having a through hole that passes therethrough from a first surface to a second surface, which is a surface opposite to the first surface, forming, on the first surface, a lid member that blocks an opening of the through hole open on the first surface, recessing, in a direction away from the first surface, a surface of the lid member that blocks the opening by removing part of the lid member through the opening, and forming a film that covers the side wall of the through hole. 1. A method for forming a film that covers a side wall of a through hole in a substrate having the through hole , the method comprising , in order , the steps of:providing a substrate having a through hole that passes therethrough from a first surface to a second surface, the second surface being a surface opposite to the first surface;forming, on the first surface, a lid member that blocks an opening of the through hole open on the first surface;recessing, in a direction away from the first surface, a surface of the lid member that blocks the opening by removing part of the lid member through the opening; andforming a film that covers the side wall of the through hole.2. The method for forming a film according to claim 1 , wherein the lid member is removed from the substrate after the film that covers the side wall of the through hole is formed.3. The method for forming a film according to claim 2 , wherein a space is located inside the lid member in the recessing claim 2 , in a direction away from the first surface claim 2 , of a surface of the lid member that blocks the opening.4. The method for forming a film according to claim 2 , wherein a through hole is formed in the lid member in the recessing claim 2 , in a direction away from the first surface claim 2 , of a surface of the lid member that blocks ...

Microfluidic mixing

A microfluidic device (100) for mixing a liquid L is provided. The microfluidic device (100) comprises a microfluidic chamber (20), having an inlet (30), and arranged to receive the liquid L therein. In use, the microfluidic device (100) is arranged to control translation through the liquid L of a body B introduced therein, wherein the translation of the body B is due to a potential field acting on the body. In this way, the controlled translation of the body B mixes the liquid L in the microfluidic chamber (20).

FENCE STRUCTURE TO PREVENT STICTION IN A MEMS MOTION SENSOR

The present disclosure relates to a microelectromechanical systems (MEMS) package featuring a flat plate having a raised edge around its perimeter serving as an anti-stiction device, and an associated method of formation. A CMOS IC is provided having a dielectric structure surrounding a plurality of conductive interconnect layers disposed over a CMOS substrate. A MEMS IC is bonded to the dielectric structure such that it forms a cavity with a lowered central portion the dielectric structure, and the MEMS IC includes a movable mass that is arranged within the cavity. The CMOS IC includes an anti-stiction plate disposed under the movable mass. The anti-stiction plate is made of a conductive material and has a raised edge surrounding at least a part of a perimeter of a substantially planar upper surface. 1. A method of fabricating an integrated chip structure , comprising:forming a plurality of metal layers within a dielectric structure over a substrate;forming an upper metal layer over the dielectric structure;forming a masking layer over the upper metal layer;selectively etching the upper metal layer to remove metal exposed by the masking layer and to redeposit the removed metal onto sidewalls of the masking layer to define an anti-stiction plate; andbonding a microelectromechanical system (MEMS) substrate to the dielectric structure, wherein the MEMS substrate comprises a movable mass.2. The method of claim 1 , wherein the anti-stiction plate comprises a same metal as one or more of the plurality of metal layers.3. The method of claim 1 , wherein the upper metal layer is selectively etched by bombarding the upper metal layer with high energy particles or gas ions.4. The method of claim 1 , further comprising:forming bond pads along an uppermost surface of the dielectric structure; andforming the masking layer to completely cover the bond pads while selective etching the upper metal layer.5. The method of claim 1 , wherein selectively etching the upper metal layer ...

Microfluidic pump and valve structures and fabrication methods

Plastic microfluidic structures having a substantially rigid diaphragm that actuates between a relaxed state wherein the diaphragm sits against the surface of a substrate and an actuated state wherein the diaphragm is moved away from the substrate. As will be seen from the following description, the microfluidic structures formed with this diaphragm provide easy to manufacture and robust systems, as well readily made components such as valves and pumps.

VIRTUAL VALVE IN A MEMS-BASED COOLING SYSTEM

An active cooling system is described. The active cooling system includes at least one cooling element that has a vent therein and is in communication with a fluid. The cooling element(s) are actuated to vibrate to drive the fluid toward a heat-generating structure and to alternately open and close at least one virtual valve corresponding to the vent. The virtual valve is open for a low flow resistance and closed for a high flow resistance. The vent remains physically open for the virtual valve being closed. 1. An active cooling system , comprising:at least one cooling element having a vent therein and being in communication with a fluid, the at least one cooling element being actuated to vibrate to drive the fluid toward a heat-generating structure and to alternately open and close at least one virtual valve corresponding to the vent, the virtual valve being open for a low flow resistance and closed for a high flow resistance, the vent remaining physically open for the virtual valve being closed.2. The active cooling of system claim 1 , wherein the at least one cooling element includes a first cooling element and a second cooling element claim 1 , the first cooling element having a passive vent therein claim 1 , the first cooling element being in communication with the fluid claim 1 , the second cooling element being between the first cooling element and the heat-generating structure claim 1 , the second cooling element having an active vent therein claim 1 , the at least one virtual valve including a passive virtual valve corresponding to the passive vent and an active virtual valve corresponding to the active vent claim 1 , the passive virtual valve being open in a suction arrangement and closed in an expulsion arrangement claim 1 , the active virtual valve being closed in the suction arrangement and open in the expulsion arrangement claim 1 , at least one of the first cooling element and the second cooling element using vibrational motion to provide the suction ...

Metal-based microchannel heat exchangers made by molding replication and assembly

Compression molding of metals is used to make microchannel heat exchangers. Heat transfer can be improved by employing controlled microchannel surface roughness. Flux-free bonding is achieved using a eutectic thin-film intermediate layer. Seals are leak-tight, mechanically strong, and uniform across multiple contact areas. The metal heat exchangers may be mass-produced inexpensively, and are useful for applications including the cooling of computer chips and other high-power electronic devices, air conditioning, refrigeration, condenser plates, radiators, fuel cell heat management, and instant water heating.

MICROFLUIDIC CHIP, MANUFACTURING METHOD THEREFOR AND ANALYSIS DEVICE USING SAME

According to embodiments of the present invention, a microfluidic chip, a manufacturing method therefor and an analysis device using the same are provided. The microfluidic chip comprises: a substrate comprising an inflow part through which a fluid flows in, a fluid channel through which the fluid moves and an outflow part through which the fluid flows out; and a film attached to the substrate to protect at least one of the inflow part, the outflow part and the fluid channel from the outside, wherein the inflow part and the outflow part are implemented by penetrating through the surface of the substrate, and the fluid channel can be implemented by being sunk from the surface of the substrate. 119-. (canceled)20. A microfluidic chip comprising: an inflow part penetrating the substrate in a thickness direction,', 'an outflow part penetrating the substrate in the thickness direction, and', 'a fluid channel defined to connect the inflow part and the outflow part and extending in a first direction within the substrate, wherein the thickness direction and the first direction are different from one another; and, 'a substrate comprising,'}at least one film attached to the substrate and covering at least a portion of at least one of the inflow part, the outflow part, and the fluid channel,wherein a thickness of the at least one film is smaller than a thickness of the substrate.21. The microfluidic chip of claim 20 , wherein the fluid channel comprising:a first fluid channel defined on a first surface of the substrate;a second fluid channel defined on a second surface of the substrate; anda third fluid channel penetrating the substrate and connecting the first fluid channel and the second fluid channel.22. The microfluidic chip of claim 21 , wherein the third fluid channel is a chamber.23. The microfluidic chip of claim 21 , wherein the third fluid channel has a first via-hole and a second via-hole claim 21 , and wherein a width of the first via-hole is greater than a width ...

Device for Mechanical and Hydrodynamic Microfluidic Transfection

Methods for introducing exogenous material into a cell are provided, which include exposing the cell to a transient decrease in pressure in the presence of the exogenous material. Also provided are devices for performing the method of the invention. 1. A device for use in a method for introducing exogenous material into a cell in a liquid , comprising:an at least partially enclosed channel with dimensions configured to allow a flow of the cell and exogenous material suspended in a liquid therethrough; andone or more flow diverters within the channel;wherein the flow diverter results in at least one region of decreased pressure and unsteady flow immediately downstream of the flow diverter.2. The device of claim 1 , wherein the device is a microfluidic device.3. The device of claim 1 , wherein the flow diverter is an obstacle placed within the channel.4. The device of claim 3 , wherein the obstacle is a post.5. The device of claim 4 , wherein the post is cylindrical.6. The device of claim 1 , wherein the one or more flow diverters are configured in an array of one or more columns and one or more rows such that the diameter of the flow diverter is equal to a gap between each flow diverter claim 1 , and the flow diverter in each column is shifted a distance to bifurcate flow from the previous gap claim 1 , where the shift distance is equal to half of the row pitch and the column pitch is equal to the row pitch.7. The device of claim 1 , wherein the one or more flow diverters are configured in an array of one or more columns and one or more rows such that the diameter of the flow diverter is greater than a gap between each flow diverter claim 1 , and the flow diverter in each column is shifted a distance to bifurcate flow from the previous gap claim 1 , where the shift distance is equal to half of the row pitch and the column pitch is equal to the row pitch.8. The device of claim 1 , wherein the one or more flow diverters are configured in an array of one or more columns ...

Microfluidic device, method of using microfluidic device and micro total analysis system

A microfluidic device, a method of using a microfluidic device and a micro total analysis system are provided. The microfluidic device includes a first substrate, and the first substrate includes a base substrate and a pixel array. The pixel array includes a plurality of pixels and is on the base substrate, and each of the plurality of pixels includes a driving electrode. Driving electrodes of two adjacent pixels are in different layers.

SCALABLE SYSTEMS AND METHODS FOR AUTOMATED BIOSYSTEM ENGINEERING

An integrated package comprising a lab-on-chip (LOC) is disclosed. The LOC includes at least one integrated device having a membrane portion having a membrane opening; the membrane portion having a first side and a second side, the first side opposite the second side, a MEMS portion disposed on the first side of the membrane portion, the MEMS portion having a sharp member disposed on an actuator stage within a MEMS cavity, and a fluidic portion disposed on the second side of the membrane portion, the fluidic portion having a fluidic cavity for flowing a fluid medium within the fluidic portion; and a fluidic cap forming a surface of the fluidic portion of the LOC, the fluidic cap having a fluidic inlet and a fluidic outlet. The method of operating the LOC includes power to the at least one integrated device to capture one or more particles for interrogation. 1. An integrated device comprising:a membrane portion having a membrane opening; the membrane portion having a first side and a second side, the first side opposite the second side;a MEMS portion disposed on the first side of the membrane portion, the MEMS portion having a sharp member disposed on an actuator stage within a MEMS cavity, the sharp member having a distal (or base) portion attached substantially perpendicular to the actuator stage; and wherein the membrane opening provides access between the MEMS portion and the fluidic portion and is substantially aligned with a proximal portion of the sharp member, and', 'in operation, the proximal portion of the sharp member moves across the membrane opening and into at least a portion of the fluidic cavity., 'a fluidic portion disposed on the second side of the membrane portion, the fluidic portion having a fluidic cavity for flowing a fluid medium within the fluidic portion,'}2. The integrated device of claim 1 , wherein the first side of the membrane portion comprises one or more pull-toward electrodes disposed on a first surface of the membrane portion and ...