17-01-2019 дата публикации
Номер: US20190016634A1
Hydrophobic shaped silica bodies having low density and low thermal conductivity are produced by forming a dispersion of silica in a solution of binder and organic solvent, and removing the solvent and shaping to form a shaped body. The shaped bodies retain their hydrophobicity, are stable with regards to shape, and are useful in acoustic and thermal insulation. 17.-. (canceled)8. A process for producing shaped silica bodies having a C content of less than 8% by weight ,{'sup': '3', 'a density, determined by Hg porosimetry, of less than 0.30 g/cm,'}{'sup': '3', 'a pore volume for pores smaller than 4 μm, determined by Hg porosimetry, of more than 2.0 cm/g,'}a proportion of the pores smaller than 4 μm, based on the total pore volume, of at least 60% anda thermal conductivity, determined by a non-steady-state method, of less than 30 mW/K*m, i) producing a dispersion containing silica, at least one binder and an organic solvent, and', 'ii) evaporating the solvent from the dispersion, and shaping to form the shaped silica bodies., 'comprising9. The process of claim 8 , wherein hydrophilic silica or a mixture of hydrophilic silica and partially hydrophobic silica is as the silica.10. The process of claim 8 , wherein silanes containing a C-C-alkyl group claim 8 , Calkenyl group claim 8 , methoxy group claim 8 , ethoxy group claim 8 , or a mixture thereof are used as a binder.11. The process of claim 8 , wherein at least one solvent is selected from the group consisting of alkanes claim 8 , ethers claim 8 , alcohols claim 8 , and mixtures thereof.12. A shaped silica body produced by the process of .13. Acoustic or thermal insulation comprising shaped silica bodies of . This application is the U.S. National Phase of PCT Appln. No. PCT/EP2016/078739 filed Nov. 24, 2016, which claims priority to PCT Application No. PCT/EP2015/077854 filed Nov. 26, 2015, the disclosures of which are incorporated in their entirety by reference herein.The invention relates to high-viscosity ...
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