Solventless one liquid type cyanate ester-epoxy composite resin composition

The present invention is a solventless one liquid type cyanate ester-epoxy resin composition having high thermal resistance as well as excellent storage stability and curing properties, which contains (A) cyanate ester, (B) epoxy resin, (C) guanidine compounds and (D) at least one kind of phenol compounds selected from a group consisting of phenol compounds represented by the following general formulae. In the general formulae, 1 is an integer selected from 0 to 4, R 1 represents an unsubstituted or fluorine-substituted monovalent hydrocarbon group. General formula:

Controlled lowering of a polymers glass transition temperature

Processes for lowering the glass transition temperature of a polymeric compound relative to the glass transition temperature of a control polymeric compound are disclosed. The methods include the formation of a precursor composition comprising precursor compounds to the polymeric compound dispersed or dissolved in a solvent system. The compounds are partially or fully cured in the presence of the solvent system, which is then substantially removed. After further curing, where necessary, the resulting cured polymeric compound is essentially free of plasticizers, but still has a decreased glass transition temperature relative to the glass transition temperature of a control polymeric compound. Articles of manufacture comprising such polymeric compounds are also disclosed.

CURING AGENT FOR LOW-EMISSION EPOXY RESIN COMPOSITIONS

A curing agent for epoxy resins, containing at least one amine adduct of formula (I) which can be obtained as an addition product of a mixture of a primary diamine, a monoalkylated other diamine and a polyepoxide. The curing agent makes it possible to produce low-odor, low-emission epoxy resin products, in particular coatings, which have a surprisingly low viscosity, a high curing rate, a high final hardness, and a surprisingly appealing surface. 2. The curing agent as claimed in claim 1 , wherein Ais selected from the group consisting of 2-methyl-1 claim 1 ,5-pentylene claim 1 , 1 claim 1 ,6-hexylene claim 1 , 2 claim 1 ,2(4) claim 1 ,4-trimethyl-1 claim 1 ,6-hexamethylene claim 1 , 1 claim 1 ,3-cyclohexylenebis(methylene) claim 1 , 1 claim 1 ,4-cyclohexylenebis(methylene) claim 1 , 1 claim 1 ,3-phenylenebis(methylene) claim 1 , 1 claim 1 ,4-phenylenebis(methylene) claim 1 , 1 claim 1 ,2-cyclohexylene claim 1 , 1 claim 1 ,3-cyclohexylene claim 1 , 1 claim 1 ,4-cyclohexylene claim 1 , (1 claim 1 ,5 claim 1 ,5-trimethylcyclohexan-1-yl)methane-1 claim 1 ,3 claim 1 , 4(2)-methyl-1 claim 1 ,3-cyclohexylene claim 1 , 3-aza-1 claim 1 ,5-pentylene claim 1 , 3 claim 1 ,6-diaza-1 claim 1 ,8-octylene claim 1 , 3 claim 1 ,6 claim 1 ,9-triaza-1 claim 1 ,11-undecylene claim 1 , 3 claim 1 ,6 claim 1 ,9 claim 1 ,12-tetraaza-1 claim 1 ,14-tetradecylene claim 1 , 3 claim 1 ,6 claim 1 ,9 claim 1 ,12 claim 1 ,15-pentaaza-1 claim 1 ,17-heptadecylene claim 1 , 4-aza-2 claim 1 ,6-heptylene claim 1 , 4-aza-1 claim 1 ,7-heptylene claim 1 , 4 claim 1 ,7-diaza-1 claim 1 ,10-decylene and 7-aza-1 claim 1 ,13-tridecylene.3. The curing agent as claimed in claim 1 , wherein Ais an alkylene radical having 2 to 6 carbon atoms.4. The curing agent as claimed in claim 1 , wherein Ais 1 claim 1 ,2-propylene and Ais selected from the group consisting of 2-methyl-1 claim 1 ,5-pentylene claim 1 , 1 claim 1 ,6-hexylene claim 1 , 2 claim 1 ,2(4) claim 1 ,4-trimethyl-1 claim 1 ,6-hexamethylene claim 1 , 1 ...

Aminic hardeners with improved chemical resistance

A hardener composition comprising: a) an epoxy-amine adduct of i) a novolac epoxy resin; and ii) a first amine and b) a modifier wherein the hardener has a viscosity in the range of from 50 to 20,000 mPa·s and wherein a cured epoxy thermoset comprising the hardener exhibits no more than 1% weight loss or gain after immersion in concentrated mineral acid for 7 days at a temperature in the range of from 25° C. to 130° C., is disclosed. The hardener composition can be used with an epoxy resin to form a curable composition.

Use of salts as accelerators in an epoxy resin compound for chemical fastening

A method includes using at least one salt (S) selected from the salts of nitric acid, salts of nitrous acid, salts of halogens or salts of trifluoromethanesulfonic acid as an accelerator in a multi-component epoxy resin compound for the chemical fastening of construction elements and/or anchoring means. Another method includes the chemical fastening of construction elements and anchoring elements, such as anchor rods, anchor bolts, rods, sleeves, reinforcing bars, screws and the like in boreholes in various substrates. 1: A method , comprising:accelerating an epoxy resin compound with at least one salt (S) selected from the group consisting of salts of nitric acid, salts of nitrous acid, salts of halogens, salts of trifluoromethanesulfonic acid and combinations thereof.2: The method according to claim 1 , wherein the epoxy resin compound is a multi-component epoxy resin compound.3: The method according to claim 2 , wherein the multi-component epoxy resin compound comprises an epoxy resin component (A) which contains at least one curable epoxy resin claim 2 , and a curing agent component (B) which contains at least one amine which is reactive to epoxy groups claim 2 , andwherein the epoxy resin component (A) and the curing agent component (B) are separate from one another so as to prevent a reaction.4: The method Use according to claim 3 , wherein the multi-component epoxy resin compound is present in cartridges or film pouches which comprise two or more separate chambers in which the epoxy resin component (A) and the curing agent component (B) are separately arranged so as to prevent a reaction.5: The method Use according to further comprising:chemical fastening with the epoxy resin compound of construction element or anchoring means in a borehole.6: The method according to wherein the at least one salt (S) is selected from the group consisting of nitrate (NO) claim 1 , iodide (I) claim 1 , triflate (CFSO) and mixtures thereof.7: The method according to claim 1 , ...

FIBER-REINFORCED COMPOSITE SHEET AND INTEGRATED MOLDING

The present invention provides a light-weight fiber-reinforced composite material that has excellent flame retardance and mechanical properties and never emits a halogen gas. The present invention also provides a prepreg and en epoxy resin composition suited to obtain the above described fiber-reinforced composite material. The present invention also provides an integrated molding which is produced using the above described fiber-reinforced composite material, thereby suitable for use in electric/electronic casings. The epoxy resin composition is such that it contains the following components [A], [B] and [C]: 1. A carbon-fiber-reinforced composite sheet , characterized in that the thickness of the sheet is 0.05 to 2.0 mm , the flame retardance is UL-94 V-1 or V-0 , and the phosphorus atom concentration in the entire composite material is 0.03 to 12% by weight.2. An integrated molding , in which a member (I) , which comprises a fiber-reinforced composite sheet comprising (a) continuous reinforcing fiber , (b) a matrix resin comprising a thermosetting resin as a major component and (c) a flame-retardant , is joined with another member (II) , characterized in that the flame retardance in accordance with UL-94 of the member (I) is V-1 or V-0 for test pieces having a substantial thickness of the member (I).3. The integrated molding according to claim 2 , wherein the glass transition temperature Tg of (b) the matrix resin comprising a thermosetting resin as a major component satisfies the following equation: Tmax−Tg≦50.4. The integrated molding according to claim 3 , characterized in that (c) the flame-retardant comprises one or more flame-retardants selected from the group consisting of phosphorus claim 3 , nitrogen and silicon flame-retardants.5. The integrated molding according to claim 2 , characterized in that (c) the flame-retardant is a phosphorus flame-retardant that comprises phosphorus or a phosphorus compound at a concentration of 0.03 to 12% by weight in ...

Epoxy Resin Material, Preparation Method Therefor And Application Thereof

The present invention provides an epoxy resin material, a preparation method therefor and an application thereof. The present method for preparing an epoxy resin material comprises: heating a mixture of an epoxy resin main agent and a curing agent that are placed at room temperature to 40-85° C. for reaction and curing. The curing agent contains an adduct of an olefinic nitrile compound and an amine compound. The present method for preparing an epoxy resin material has the characteristics of low mixing viscosity, long operation time, and low amount of heat released during preparation.

COMPOSITE PANEL MATERIAL

A curable resin composition containing: (a) at least one resin; and (b) curative selected from the group consisting of (i) a mixture of at least one low temperature curative and at least one high temperature curative or (ii) a curative that has a low temperature curative part and a high temperature curative part wherein the amount of the low temperature curative is sufficient to cause enough resin-curative addition reaction to effect B-staging in the full resin-curative formulation, the amount of the high temperature curative is sufficient to cause the resin to cure catalytically but insufficient to cause resin-curative addition reaction in the final cure, and the ratio of the resin (a) to the curative (b) is greater than or equal to about 5. The present composition may be used to make prepregs for automotive or aerospace application. 121-. (canceled)22. A method for making a composite material , comprising:applying a curable resin composition to one or more continuous fibre tow(s) to impregnate the fiber tow(s), each fibre tow comprising a plurality of fibre filaments;winding the impregnated fiber tow(s) around a mandrel in a filament winding process to form a woven structure;removing the woven structure from the mandrel to form a blank;B-staging the blank whereby the curable resin composition is partially cured to an isolatable intermediate state such that the resin can still be stimulated by heat or radiation to achieve a maximum cured state;moulding said blank or a plurality of said blank in a mould; andcuring the moulded blank(s) in a final cure cycle to form a fully cured moulded article,wherein the curable resin composition comprising: (a) at least one thermosettable resin; and (b) a curative selected from the group consisting of (i) a mixture of at least one low temperature curative and at least one high temperature curative or (ii) a curative that has a low temperature curative part and a high temperature curative part.23. The method of claim 22 , wherein ...

POLARIZING FILM AND METHOD FOR MANUFACTURING SAME, OPTICAL FILM, AND IMAGE DISPLAY DEVICE

A polarizing film comprising a polarizer and a cured resin layer formed on at least one surface of the polarizer by curing a curable resin composition, wherein 3. The polarizing film according to claim 1 , wherein the compound represented by formula (1) has hydrogen atoms for both Rand R.4. The polarizing film according to claim 1 , wherein the reactive group of the compound represented by formula (1) is at least one reactive group selected from the group consisting of a vinyl group claim 1 , a (meth)acrylic group claim 1 , a styryl group claim 1 , a (meth)acrylamide group claim 1 , a vinyl ether group claim 1 , an epoxy group claim 1 , an oxetane group claim 1 , and a mercapto group.6. The polarizing film according to claim 1 , further comprising a transparent protective film claim 1 , wherein the cured resin layer is an adhesive layer claim 1 , and the transparent protective film is provided on at least one surface of the polarizer with the adhesive layer interposed between the polarizer and the transparent protective film.7. An optical film comprising a laminate comprising at least one piece of the polarizing film according to .8. An image display device comprising the polarizing film according to .11. The method according to claim 9 , wherein the cured resin layer is an adhesive layer and the polarizing film further comprises a transparent protective film provided on at least one surface of the polarizer with the adhesive layer interposed between the polarizer and the transparent protective film claim 9 , the method comprising the steps of:applying the curable resin composition to a surface of at least one of the polarizer and the transparent protective film;laminating the polarizer and the transparent protective film; andbonding the polarizer and the transparent protective film together with an adhesive layer formed therebetween by curing the curable resin composition with active energy rays applied from a polarizer surface side or a transparent protective film ...

RAPID CURING EPOXY-RESIN COMPOSITION FOR FIBER-MATRIX SEMIFINISHED PRODUCTS

The present invention relates to an epoxy-resin composition as matrix component for sheet molding compounds (SMC) and/or bulk molding compounds (BMC), comprising a resin component comprising at least one epoxy resin and a hardener component comprising at least one aminoalkylimidazole compound, at least one diazabicycloalkylen compound and at least one latent hardener. In said epoxy-resin composition, the amount of the aminoalkylimidazole compounds used is in the range from 0.007 to 0.025 mol per mole of epoxy groups of the entire composition. The invention also relates to a fiber-matrix-semifinished-product composition (SMC composition or BMC composition) with, as matrix component, the epoxy-resin composition mentioned, and with, suspended therein, short reinforcement fibers with an average length of from 0.3 to 5.0 cm. The invention also relates to the corresponding semisolid fiber-matrix composite, in particular to the semisolid SMC and to the corresponding cured fiber-matrix semifinished product, in particular the cured SMC. 2. The epoxy-resin composition according to claim 1 , where the epoxy resin (A1) is a diglycidyl ether of monomeric or oligomeric diol claim 1 , where the diol is one selected from the group consisting of bisphenol A or bisphenol F claim 1 , or hydrogenated bisphenol A or bisphenol F.4. The epoxy-resin composition according to claim 3 , whereR1 is a hydrogen atom, an alkyl group having from 1 to 4 carbon atoms, an aryl group having from 3 to 7 carbon atoms, or an arylalkyl group having from 4 to 10 carbon atoms,R2 and R3 are respectively mutually independently a hydrogen atom or an alkyl group having from 1 to 4 carbon atoms, andR4 is an aminoalkyl group having from 2 to 4 carbon atoms.5. The epoxy-resin composition according to claim 1 , where the latent hardener (B2) is dicyandiamide.6. The epoxy-resin composition according to claim 1 , where the amount of the diazabicycloalkylen compounds of the general formula I (B3) used is in the range ...

ETHERAMINES BASED ON 1,3-DIALCOHOLS

An etheramine mixture comprising of at least one amine selected from the group consisting of amine of Formula (I) and amine of Formula (II) wherein R-Rare independently selected from H, alkyl, cycloalkyi, aryl, alkylaryl, or arylalkyi, wherein at least one of R-Rand at least one of R-Ris different from H, and wherein Z-Zare linear CHCHCHNH. 2. The etheramine mixture according to claim 1 , wherein the etheramine mixture comprises at least 90% by weight claim 1 , based on a total weight of the etheramine mixture claim 1 , of an amine of Formula (I) and/or (II).3. The etheramine mixture according to claim 1 , wherein in said amine of Formula (I) or Formula (II) claim 1 , R claim 1 , R claim 1 , R claim 1 , R claim 1 , R claim 1 , R claim 1 , R claim 1 , and Rare H and R claim 1 , R claim 1 , R claim 1 , and Rare independently selected from C1-16 alkyl or aryl.4. The etheramine mixture according to claim 1 , wherein in said amine of Formula (I) or Formula (II) claim 1 , R claim 1 , R claim 1 , R claim 1 , R claim 1 , R claim 1 , R claim 1 , R claim 1 , and Rare H and R claim 1 , R claim 1 , R claim 1 , and Rare independently selected from a butyl group claim 1 , an ethyl group claim 1 , a methyl group claim 1 , a propyl group claim 1 , or a phenyl group.5. The etheramine mixture according to claim 1 , wherein in said amine Formula (I) or Formula (II) claim 1 , Rand Rare each an ethyl group claim 1 , R claim 1 , R claim 1 , RR claim 1 , R claim 1 , R claim 1 , R claim 1 , Rare each H claim 1 , Rand Rare each a butyl group.6. The etheramine mixture according to claim 1 , wherein the amine of Formula (I) or Formula (II) has a weight average molecular weight of about 150 to about 1000 grams/mol.7. The etheramine mixture according to claim 1 , wherein the amine of Formula (I) or Formula (II) is reacted with an acid.8. A method of using the etheramine mixture of claim 1 , the method comprising using said etheramine mixture in personal care.9. A method of using the etheramine ...

AN EPOXY RESIN SYSTEM FOR STRUCTURAL COMPOSITES

A slow reacting epoxy resin system is disclosed. The slow reacting epoxy resin system comprises a high purity epoxy resin component selected from the group comprising of a high purity Bisphenol A(BPA), a high purity Bisphenol F (BPF), and a combination thereof, and an amine curing agent. The initial viscosity after mixing the high purity epoxy resin component and the amine curing agent is less than 350 mPa·s at 25° C. 2. A slow reacting epoxy resin system as claimed in claim 1 , wherein the high purity epoxy resin component comprises 60 to 90 wt. % of the high purity Bisphenol A (BPA) and 10 to 40 wt. % of the high purity Bisphenol F (BPF) claim 1 , of the total weight of the high purity epoxy resin component.3. A slow reacting epoxy resin system as claimed in claim 1 , wherein the high purity epoxy resin component comprises 70 to 80 wt. % of the high purity Bisphenol A (BPA) and 20 to 30 wt. % of the high purity Bisphenol F (BPF) of the total weight of the high purity epoxy resin component.4. A slow reacting epoxy resin system as claimed in claim 1 , wherein the high purity Bisphenol A (BPA) has an epoxy equivalent weight (EEW) in a range of 171 to 183 gm/eq.5. A slow reacting epoxy resin system as claimed in claim 1 , wherein the high purity Bisphenol F (BPF) has an epoxy equivalent weight (EEW) in a range of 155 to 165 gm/eq.6. A slow reacting epoxy resin system as claimed in claim 1 , wherein the high purity Bisphenol A (BPA) has a monomer content in a range of 85% to 99.9%.7. A slow reacting epoxy resin system as claimed in claim 1 , wherein the high purity epoxy resin component has by-products and impurities less than 5000 ppm.8. A slow reacting epoxy resin system as claimed in claim 1 , wherein the amine curing agent is selected from a group comprising modified aliphatic amines claim 1 , cycloaliphatic amines claim 1 , polyether amine claim 1 , aromatic amines and unmodified aliphatic amines claim 1 , cycloaliphatic amines claim 1 , polyether amine claim 1 , ...

POLYETHER AMINES USEFUL AS ACCELERANTS IN EPOXY SYSTEMS

The present invention relates to the speeded curing of a composition comprising an epoxy compound, an amino or anhydride hardener and a high-branched polyether amine accelerant. The high-branched polyether amine may have terminal hydroxyl groups (polyol) and/or amino groups (amino modified). The amino-modified high-branched polyether amines are obtainable by subsequently modifying the terminal hydroxyl groups of high-branched polyether amine polyols. 1. A curable composition comprising at least one epoxy compound , at least one amino or anhydride hardener and at least one high-branched polyether amine , wherein the epoxy compounds has 2 to 10 epoxy groups.2. The curable composition according to claim 1 , wherein the hardener is an amino hardener having at least one primary or two secondary amino groups.3. The curable composition according to claim 1 , wherein the hardener is an anhydride hardener having at least one intramolecular carboxylic anhydride group.4. The curable composition according to claim 1 , wherein the high-branched polyether amine is a high-branched polyether amine polyol having at least 3 terminal hydroxyl groups.5. The curable composition according claim 1 , wherein the high-branched polyether amine is an amino-modified high-branched polyether amine having at least three terminal hydroxyl groups coupled with on average at least 1% of the reagent having at least one primary or secondary amino group.6. The curable composition according to claim 5 , wherein the reagent is a mono- or polyhydric aminoalcohol.7. The curable composition according to claim 1 , wherein the high-branched polyether amine comprises triethanolamine claim 1 , tripropanolamine claim 1 , triisopropanolamine or tributanolamine as monomer unit claim 1 , the monomer units in the polyether amine being linked to each other via their hydroxyl groups to form ether bridges.8. The curable composition according to claim 1 , wherein the high-branched polyether amine has a weight average ...

PROCESS FOR PRODUCING AN INSULATOR LAYER, PROCESS FOR PRODUCING AN ORGANIC OPTOELECTRONIC COMPONENT COMPRISING AN INSULATOR LAYER AND ORGANIC OPTOELECTRONIC COMPONENT COMPRISING AN INSULATOR LAYER

A method is specified for production of an insulator layer. This method comprises the following process steps: A) Providing a precursor comprising a mixture of a first, a second and a third component where—the first component comprises a compound of the general formula IA where R1 and R2 are each independently selected from a group comprising hydrogen and alkyl radicals and n=1 to 10 000; the second component comprises a compound of the general formula ILA where R3 is an alkyl radical, and the third component comprises at least one amine compound; B) applying the precursor to a substrate; C) curing the precursor to form the insulator layer. 2. Method according to claim 1 , wherein the first component contains 45 to 65 weight percent of the compound of formula IA with respect to the total weight of the first component.5. Method according to claim 3 , wherein the first component comprises two claim 3 , three or four different compounds of the general formula IB.9. Method according to claim 1 , wherein the precursor consists of the first claim 1 , the second and the third component and the first component is present at a concentration of 70 to 80 weight percent with respect to the total weight of the precursor.10. Method according to claim 1 , wherein the precursor consists of the first claim 1 , the second and the third component and the first component is present at a concentration of 70 to 80 weight percent claim 1 , the second component is present at a concentration of 5 to 15 weight percent and the third component is present at a concentration of 10 to 20 weight percent with respect to the total weight of the precursor.11. Method for producing an organic claim 1 , optoelectronic component comprising the method steps:a) providing a substrate,b) applying a first electrode to the substrate,c) applying a light-emitting layer to the first electrode,{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'd) producing at least a first insulator layer according to ,'}e) ...

EPOXY RESIN, PRODUCTION METHOD, AND EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF

It is an issue to provide an epoxy resin that has excellent fluidity and curability, that provides a cured product with favorable moisture resistance and mechanical strength, and that is suitable for use in a semiconductor sealing material, a circuit board, and the like, to provide a method for producing the epoxy resin, and to provide an epoxy resin composition containing the epoxy resin and a cured product of the epoxy resin composition. Specifically, an epoxy resin that is epoxy resin (A) primarily containing epoxidized dihydroxybenzene in which an alkyl group having a carbon number of 1 to 8 may be included as a substituent on an aromatic ring, wherein the area ratio of the maximum peak in GPC measurement is 90% or more, a method for producing the epoxy resin, an epoxy resin composition containing the epoxy resin, and a cured product of the epoxy resin composition are provided. 2. (canceled)3. The epoxy resin according to claim 1 , wherein the total chlorine content in the epoxy resin (A) is 2 claim 1 ,000 ppm or less.4. The epoxy resin according to claim 1 , wherein the epoxy equivalent is within the range of 190 to 205 g/eq.5. (canceled)6. The epoxy resin according to claim 1 , wherein the viscosity at 25° C. of the epoxy resin (A) is within the range of 400 to 1 claim 1 ,000 mPa·s.7. The epoxy resin according to claim 1 , wherein the butyl group is a t-butyl group.8. An epoxy resin composition comprising the epoxy resin according to and a curing agent as indispensable components.9. A cured product of the epoxy resin composition according to .1017-. (canceled)18. An epoxy resin composition comprising the epoxy resin according to and a curing agent as indispensable components.19. An epoxy resin composition comprising the epoxy resin according to and a curing agent as indispensable components.20. An epoxy resin composition comprising the epoxy resin according to and a curing agent as indispensable components.21. An epoxy resin composition comprising the epoxy ...

Molding material and fiber-reinforced composite material

A molding material that enables acquirement of a fiber-reinforced composite material which has excellent demoldability from a mold and excellent surface appearance, which contaminates a mold surface after molding less, and which has excellent mechanical properties and heat resistance; and a fiber-reinforced composite material which has excellent demoldability from a mold and surface appearance, which contaminates a mold surface after molding less, and which has excellent mechanical properties and heat resistance, are provided. A molding material of the present invention includes a component (A): an epoxy resin; a component (B): an epoxy resin curing agent; a component (C): a compound that has a solubility parameter of 11.2 or less and a melting point of 115° C. or lower; and a reinforcement fiber.

OPTICAL FIBRE HAVING A CROSSLINKED SECONDARY COATING

An optical fibre comprising: an optical waveguide comprising a glass core surrounded by a glass cladding; a primary coating surrounding the optical waveguide; a secondary coating, surrounding the primary coating, comprising a cured polymer material obtained by curing a curable coating composition comprising: (a) a polyester obtained by esterification of a reactant A selected from carboxylic acids, triglycerides, and mixtures thereof, having a C-Caliphatic chain comprising at least two double bonds spaced by one carbon atom at most, with a reactant B selected from polyols having at least 3 hydroxyl groups, the polyols being thermally stable up to 300° C.; (b) an aromatic glycidyl epoxy resin; (c) an aliphatic polyether hardener containing from 8 to 64 hydroxy groups and/or from 2 to 4 epoxy groups; and (d) a secondary amine compound as curing agent. Preferably, the step of curing is a thermal curing, preferably up to 300° C. When cured by heat, the coating material can be applied during the drawing process of the fibre so as to exploit the heat of the just drawn glass fibre as heat source for curing. 1. An optical fibre comprising:an optical waveguide comprising a glass core surrounded by a glass cladding;a primary coating surrounding the optical waveguide;a secondary coating, surrounding the primary coating, comprising a cured polymer material obtained by curing a curable coating composition comprising:{'sub': 16', '24, '(a) a polyester obtained by esterification of a reactant A selected from carboxylic acids, triglycerides, and mixtures thereof, having a C-Caliphatic chain comprising at least two double bonds spaced by one carbon atom at most, with a reactant B selected from polyols having at least 3 hydroxyl groups, the polyols being thermally stable up to 300° C.;'}(b) an aromatic glycidyl epoxy resin;(c) an aliphatic polyether hardener containing from 8 to 64 hydroxy groups and/or from 2 to 4 epoxy groups; and(d) a secondary amine compound as curing agent.2. The ...

EPOXY RESIN-BASED FIBRE MATRIX COMPOSITIONS CONTAINING ALKYL-SUBSTITUTED ETHYLENE AMINES

Epoxy resin-based fibre matrix compositions contain alkyl substituted ethylene amines such as dimethyldiethylenetriamine (DMDETA, also dimethyl-1,4,7-triazaheptane), as a curing agent. These curing agents are characterized by a short curing time for a comparatively long processing time, and make it possible to obtain cured epoxy resins that exhibit low brittleness and high tensile strength and have a high glass transition temperature; as a result of which the fibre matrix composition is suitable particularly for use in pultrusion and winding processes. 1: A fiber-matrix composition , comprising:a fiber component consisting of reinforcing fibers, and {'br': None, 'sub': 2', 'n', '2, 'HN-A-(NH-A-)NH\u2003\u2003(I)'}, 'a matrix component comprising epoxy resin and curing agent, wherein the curing agent comprises at least one alkyl-substituted ethyleneamine of the formula (I)'}{'sub': 2', '2', '2', '2, 'wherein A is independently an ethylene group of the formula —CHR—CH— or CH—CHR—, with R=H, ethyl or methyl, but at least one A of the at least one alkyl-substituted ethyleneamine of the formula (I) is an alkylethylene group of the formula —CHR—CH— or —CH—CHR—, with R=ethyl or methyl, and'}wherein n=1 to 4.2: The fiber-matrix composition according to claim 1 ,{'sub': 3', '2', '2', '3, 'wherein A is independently a methylethylene group of the formula —CH(CH)—CH— or CH—CH(CH)—, and'}wherein n=1 to 4.3: The fiber-matrix composition according to claim 1 , wherein the at least one alkyl-substituted ethyleneamine is a dimethyldiethylenetriamine of the formula (II){'br': None, 'sub': 2', '2, 'HN-A-NH-A-NH\u2003\u2003(II)'}{'sub': 3', '2', '2', '3, 'wherein A is independently a methylethylene group of the formula —CH(CH)—CH— or —CH—CH(CH)—.'}4: The fiber-matrix composition according to claim 1 , wherein the at least one alkyl-substituted ethyleneamine accounts for at least 50% by weight claim 1 , based on a total amount of curing agents in the fiber-matrix composition.5: The ...

CURABLE COMPOSITION

A multi-part curable composition includes an A part including a polyoxyalkylene polymer (A) having a reactive silicon group, a (meth)acrylic ester polymer (B) having a reactive silicon group, an epoxy resin curing agent (D) having a tertiary amine moiety, an alicyclic structure-containing amine (E1), and a B part including an epoxy resin (C). Each of the reactive silicon groups of the polymer (A) and polymer (B) are represented by —SiRX. Ris a substituted or unsubstituted hydrocarbon group having 1 to 20 carbon atoms, X is a hydroxy group or a hydrolyzable group, and c is 0 or 1. A multi-part curable composition includes an A part including the polymer (A), polymer(B), and an epoxy resin curing agent (D) having a tertiary amine moiety, and a B part including an epoxy resin (C), where either or both of the A and B parts include an amino alcohol compound (E2). 1. A multi-part curable composition comprising:{'sup': 5', '5, 'sub': c', '3-c, 'an A part including a polyoxyalkylene polymer (A) having a reactive silicon group, a (meth)acrylic ester polymer (B) having a reactive silicon group, an epoxy resin curing agent (D) having a tertiary amine moiety and being other than alicyclic structure-containing amines, and an alicyclic structure-containing amine (E1), each of the reactive silicon groups of the polyoxyalkylene polymer (A) and the (meth)acrylic ester polymer (B) being represented by the following formula (1): —SiRX(1), wherein Ris a substituted or unsubstituted hydrocarbon group having 1 to 20 carbon atoms, X is a hydroxy group or a hydrolyzable group, and c is 0 or 1; and'}a B part including an epoxy resin (C).2. The multi-part curable composition according to claim 1 , wherein the alicyclic structure-containing amine (E1) is a compound having an amino group bonded directly to an alicyclic skeleton.3. A multi-part curable composition comprising:{'sup': 5', '5, 'sub': c', '3-c, 'an A part including a polyoxyalkylene polymer (A) having a reactive silicon group, a ( ...

EPOXY RESIN WAVE-ABSORBING COMPOSITE MATERIAL AND PREPARATION METHOD THEREOF

The present disclosure provides an epoxy resin wave-absorbing composite material and a preparation method thereof. The method includes: heating an epoxy resin to 50° C.˜70° C., and adding carbon black, to obtain a mixture of the epoxy resin and the carbon black; heating the mixture of the epoxy resin and the carbon black to 100° C.˜120° C., adding a curing agent, and stirring and dissolving them to obtain a mixture of the epoxy resin, the carbon black, and the curing agent; and adding surface-treated hollow glass microbeads into the mixture of the epoxy resin, the carbon black, and the curing agent, and curing them to obtain the epoxy resin wave-absorbing composite material. 1. A preparation method of an epoxy resin wave-absorbing composite material , comprising:{'b': '1', 'heating an epoxy resin to temperature T and adding carbon black to obtain a mixture of the epoxy resin and the carbon black;'}{'b': '2', 'heating the mixture of the epoxy resin and the carbon black to temperature T, adding a curing agent, and stirring and dissolving them to obtain a mixture of the epoxy resin, the carbon black, and the curing agent; and'}adding surface-treated hollow glass microbeads into the mixture of the epoxy resin, the carbon black, and the curing agent, and curing them to obtain the epoxy resin wave-absorbing composite material.2. The preparation method according to claim 1 , wherein the preparation method further comprises: adding glacial acetic acid into an ethanol-water mixed solution to adjust pH claim 1 , then adding a silane coupling agent into them to obtain a silane coupling agent solution; and further adding hollow glass microbeads into the silane coupling agent solution to obtain a hollow glass microbeads solution; heating the hollow glass microbeads solution to 80° C.˜100° C. claim 1 , stirring claim 1 , filtering claim 1 , washing claim 1 , and then drying the hollow glass microbeads solution in the vacuum circumstance to obtain the surface-treated hollow glass ...

Blend For Curing Epoxy Resin Composistions

The present disclosure provides a curable composition that includes an epoxy resin and a curing component comprising a blend of at least two amines. The curable composition may be combined with reinforced fibers and cured to form a composite article which can be used in various applications, such as in wind turbine blades.

Glycerol-based epoxy resins

An aliphatic epoxy resin precursor composition containing an epoxy component and, optionally, a reactive component, the composition containing no phenols, wherein the epoxy component is a glycerol-based ether, and wherein the precursor composition contains greater than about 60% (w/w) of the epoxy component and between 0% and 30% (w/w) of the reactive component. A cured aliphatic epoxy resin containing a precursor composition and a curing component, the precursor composition including an epoxy component and, optionally, a reactive component, and the cured resin containing no phenols, wherein the epoxy component is a glycerol-based ether, and wherein the precursor composition contains greater than about 60% (w/w) of the epoxy component and between 0% and 30% (w/w) of the reactive component.

Curable compositions, articles therefrom, and methods of making and using same

A curable composition includes a polyamide composition that includes a first polyamide. The first polyamide includes a tertiary amide in the backbone thereof and is amine terminated. The curable composition further includes an amino functional compound comprising from 2 to 20 carbon atoms, a multifunctional (meth)acrylate, an epoxy resin, and an inorganic filler. The inorganic filler is present an amount of at least 25 wt. %, based on the total weight of the curable composition.

LATENT HARDENER WITH IMPROVED STORAGE STABILITY THROUGH A DRY SURFACE TREATMENT PROCESS, ONE-COMPONENT EPOXY ADHESIVE FORMULATION COMPRISING THE SAME, AND FABRICATION METHOD THEREOF

The present specification discloses a latent hardener in which only the surface of the hardener is selectively deactivated under a carbon dioxide or inert gas atmosphere, a one-component epoxy adhesive including the same, and a preparation method thereof. 1. A method for preparing a latent hardener , the method comprising:introducing a hardener into a dry high energy-type mixer;injecting carbon dioxide gas or an inert gas into the dry high energy-type mixer; andmechanochemically deactivating only a surface of the hardener using the dry high energy-type mixer.2. The method of claim 1 , wherein the hardener is one or more selected from the group consisting of an amine-based adduct claim 1 , an imidazole-based adduct claim 1 , dicyandiamide claim 1 , a dihydride-based compound claim 1 , and a dichlorophenyl dimethylurea compound.3. The method of claim 1 , wherein the inert gas is one or more selected from the group consisting of helium claim 1 , nitrogen claim 1 , argon claim 1 , neon claim 1 , and krypton.4. The method of claim 1 , wherein the carbon dioxide or inert gas is injected into the dry high energy-type mixer at a flow rate of 0.1 to 10 L/min claim 1 , andthe deactivating of only the surface of the hardener is performed for 1 to 240 minutes.5111121131141. The method of claim 1 , wherein the dry high energy-type mixer comprises a vessel capable of adjusting temperature claim 1 , a rotating inner vessel claim 1 , a pressure-applying arm claim 1 , and a scraper claim 1 , and{'b': 121', '121', '131, 'the method is performed by adjusting one or more conditions selected from the group consisting of a rotation speed of the inner vessel , a gap between the inner vessel and the pressure-applying arm , a type of gas, a gas inflow amount, and temperature.'}6121121131. The method of claim 5 , wherein the rotation speed of the inner vessel is 20 to 15 claim 5 ,000 rpm claim 5 , the gap between the inner vessel and the pressure-applying arm is 0.2 to 10 mm claim 5 , and ...

Super Elastic Epoxy Hydrogel

Described is a super elastic epoxy hydrogel that is easy to manufacture and can be engineered for various performance enhancements of the polymer. Also described are methods of enhancing the performance of this hydrogel and other hydrogels. Various polymer hydrogel composites, structures and their uses are included. 1. An electro—or light—activated volume changing polymer gel comprising an elastic epoxy hydrogel polymer composition comprising the reaction product of a polyether amine selected from the group consisting of polyoxyalkyleneamine , and a (poly)alkylene glycol having amino or alkylamino termini selected from the group consisting of polyethylene glycol amine , di-(3-aminopropyl) diethylene glycol , polyetherdiamine , polyoxyethylenediamine , triethyleneglycol diamine and polyglycidyl ether , and wherein at least one metal oxide is included in the composition to control swelling characteristics of the composition and at least one of a density , porosity , electrical conductivity , photo-responsiveness , photo-sensitivity , or a combination thereof , of the composition , and wherein the composition further includes at least one further substance selected from the group consisting of a metal , a carbon , a mineral , an acid , a salt , and a combination thereof , in a form of nanopowders.2. The composition of claim 1 , wherein the polyetheramine comprises a polyether backbone with primary amino groups attached to its terminus claim 1 , and wherein the polyether backbone is selected from the group consisting of propylene oxide claim 1 , ethylene oxide claim 1 , mixed ethylene oxide/propylene oxide claim 1 , another backbone segment of varied reactivity provided by hindering the primary amine or through secondary amine functionality claim 1 , and a mixture thereof.3. The composition of claim 1 , wherein said polyether amine has a molecular weight of 5 claim 1 ,000 or less and is selected from the group consisting of a monoamine claim 1 , a diamine claim 1 , a ...

EPOXY RESIN COMPOSITION, FIBER REINFORCED MATERIAL, MOLDED ARTICLE, AND PRESSURE VESSEL

An epoxy resin composition comprises components [A] to [C]. The component [C] is a component [c1] or [c2] and the rubbery state elastic modulus of a cured article produced by curing the epoxy resin composition in a dynamic viscoelasticity evaluation is 10 MPa or less. Component[A] is a phenyl glycidyl ether substituted by a tert-butyl group, a sec-butyl group, an isopropyl group or a phenyl group. Component [B] is a bifunctional or higher aromatic epoxy resin. Component [C] is a curing agent selected from component [c1], which is an acid anhydride-type curing agent and component [c2], which is an aliphatic amine-type curing agent. 1. An epoxy resin composition comprising the following constituent elements [A] to [C] , wherein the constituent element [C] is the following constituent element [c1] or [c2] , and a cured product of the epoxy resin composition has a rubbery state elastic modulus in a dynamic viscoelasticity evaluation of 10 MPa or less:[A] a phenyl glycidyl ether substituted with a tert-butyl group, a sec-butyl group, an isopropyl group, or a phenyl group;[B] a bifunctional or higher functional aromatic epoxy resin; and [c1] an acid anhydride hardener; or', '[c2] an aliphatic amine hardener., '[C] a hardener2. The epoxy resin composition according to claim 1 , wherein the constituent element [B] is the following constituent element [b1] or [b2] claim 1 , and the epoxy resin composition has a cure shrinkage rate of 3.5 to 7.0%:[b1] an optionally substituted diglycidyl aniline; or[b2] tetraglycidyl diaminodiphenylmethane.3. The epoxy resin composition according to claim 2 , comprising 15 to 50 parts by mass of the constituent element [A] in 100 parts by mass of total epoxy resins.4. The epoxy resin composition according to claim 1 , wherein the constituent element [B] is the following constituent element [b1] or [b2] claim 1 , and a cured product of the epoxy resin composition has a tensile elongation of 3.5% or less:[b1] an optionally substituted ...

Multi-component epoxy resin compound with leakage indicator, and curing component for the epoxy resin compound

A curing composition is useful for a multi-component epoxy resin compound and includes at least one first poly amine, at least one second polyamine, and at least one polyphenol from the group of bisphenols and novolac resins as an accelerator. Upon contact with atmospheric oxygen, the curing composition discolors within a few days and therefore leakages can be visually identified. 2: The curing composition according to claim 1 , wherein the at least one first polyamine is selected from the group consisting of 1 claim 1 ,2-diaminocyclohexane claim 1 , 1 claim 1 ,2-diaminocyclohexene claim 1 , diethylenetriamine claim 1 , triethylenetetramine claim 1 , and mixtures thereof.3: The curing composition according to claim 1 , wherein the at least one second polyamine is selected from the group consisting of 1 claim 1 ,3-bis(aminomethyl)cyclohexane claim 1 , aminoethylpiperazine claim 1 , and mixtures thereof.4: The curing composition according to claim 1 , wherein the at least one first poly amine is present in a proportion of from 1 to 50 wt. % claim 1 , based on the weight of organic parts of the curing composition.5: The curing composition according to claim 1 , wherein the at least one second polyamine is present in a proportion of from 1 to 50 wt. % claim 1 , based on the weight of organic parts of the curing composition.6: The curing composition according to claim 1 , wherein the at least one polyphenol is present in a proportion of from 1 to 40 wt. % claim 1 , based on the weight of organic parts of the curing composition.9: The curing composition according to claim 1 , wherein the at least one polyphenol comprises a bisphenol from the group consisting of bisphenol A claim 1 , bisphenol F claim 1 , and mixtures thereof.10: The curing composition according to claim 1 , wherein the curing composition further comprises;additional monoamines and/or polyamines, and/ora curing agent for epoxy resins selected from the group consisting of Mannich bases, polyamidoamines, ...

STRUCTURAL ADHESIVE COMPOSITIONS

Disclosed herein are compositions including (a) a first component comprising (1) an epoxy-adduct that is the reaction product of reactants comprising a first epoxy compound, a polyol, and an anhydride and/or a diacid and (2) a second epoxy compound; (b) rubber particles having a core/shell structure and/or graphenic carbon particles; and (c) a second component that chemically reacts with the first component at ambient or slightly thermal conditions. Also disclosed herein are compositions including (a) an epoxy-capped flexibilizer; (b) a heat-activated latent curing agent; and optionally (c) rubber particles having a core/shell structure and/or graphenic carbon particles; (d) an epoxy/CTBN adduct; and/or (e) an epoxy/dimer acid adduct. The heat-activated latent curing agent may include at least one reaction product of reactants including an epoxy compound and an amine and/or an alkaloid. 1. A one-component composition comprising:(a) 2% by weight to 40% by weight based on total weight of the one-component composition of an epoxy-capped flexibilizer;(b) 3% by weight to 25% by weight based on total weight of the one-component composition of a heat-activated latent curing agent comprising dicyandiamide having a D98 maximum of 6 mm and a reaction product of reactants comprising an epoxy compound comprising a polyepoxide and an imidazole;(c) 5% by weight to 60% by weight based on total weight of the one-component composition of rubber particles having a core/shell structure; and(d) 1% by weight to 15% by weight based on total weight of the one-component composition a dimer acid adduct.2. The one-component composition of claim 1 , wherein the epoxy-capped flexibilizer comprises a reaction product of reactants comprising (i) an epoxy compound claim 1 , (ii) a polyol comprising a polytetrahydrofuran; and (iii) an anhydride and/or a diacid.3. The one-component composition of claim 2 , wherein the epoxy compound comprises Bisphenol A diglycidyl ether claim 2 , phenyl diglycidyl ...

WATER SOLUBLE POLYMERS AND POLYMER ADDUCTS ALONG WITH AQUEOUS SOLUTIONS THEREOF

A water soluble polymer or polymeric adduct has a backbone comprising a plurality of segments with amine functional groups and hydroxyl functional groups with a number average molecular weight in the range of about 500 to about 1,000,000 Daltons. The polymeric adduct may be formed as an addition product by reacting at least one multifunctional amine compound reacted with a one or more polyfunctional epoxy compounds and/or one or more monofunctional epoxy compounds, such that there N are 1.3 to 3.8 reactive amine functional groups per reactive epoxy functional group. An aqueous solution of the polymer or polymeric adduct has a viscosity in the range of about 100 centipoise to about 100,000 centipoise and a pH value of about 8 to about 12 when the solution comprises 70 wt. % of the polymer or polymeric adduct dissolved in water. The polymeric adducts are useful fast setting additives for an emulsion product due to excellent stability when blended with an anionically stabilized latex. 2. The polymer according to claim 1 , wherein the polymer comprises 1.3 to 3.8 amine functional groups per hydroxyl functional group.3. The polymer according to claim 1 , wherein the polymer is water soluble and has a number average molecular weight in the range of about 500 to about 1 claim 1 ,000 claim 1 ,000 unified Daltons.5. An addition product of at least one multifunctional amine compound reacted with one or more polyfunctional epoxy compounds claim 1 , one or more monofunctional epoxy compounds claim 1 , or a combination thereof;wherein the amine compound and the one or more epoxy compounds provide 1.3 to 3.8 amine functional groups per epoxy functional group;wherein the addition product is water soluble, has a number average molecular weight in the range of about 500 to about 1,000,000 Daltons, and comprises a nitrogen atom percentage of 5 to about 35%.6. The addition product according to claim 5 , wherein the polyfunctional epoxy compounds comprise epoxides of unsaturated ...

Mechanophore-grafted polymers to form stress-responsive thermoset network

Compositions including a thermosetting polymer network and a mechanophore covalently bonded to the thermosetting polymer network are provided. Substrates including the compositions are provided. In addition, methods of making the compositions and methods of monitoring stress on a substrate comprising the compositions are provided.

COMPOSITION FOR RECOVERING HYDROCARBON FLUIDS FROM A SUBTERRANEAN RESERVOIR

Disclosed is a composition and use thereof for the recovery of hydrocarbon fluids from a subterranean reservoir. More particularly, this invention concerns sulfonated epoxy resin polymers comprising an epoxide-containing compound, a primary amino sulfonate, and optionally one or more of a primary monoamine alkylene oxide oligomer, that modify the permeability of subterranean formations and increase the mobilization and/or recovery rate of hydrocarbon fluids present in the formations. 1. A composition comprising a the reaction products of:(i) epoxide-containing compound having an average of more than one epoxide group per molecule,(ii) a primary amino sulfonate,(iii) optionally a primary monoamine alkylene oxide oligomer,and(iv) optionally a primary monoamine, a secondary diamine, a monohydroxyalkyl primary monoamine, a dihydroxyalkyl primary monoamine, a trihydroxyalkyl primary monoamine, a mono hydroxycycloalkyl primary monoamine, a dihydroxycycloalkyl primary monoamine, or a trihydroxycycloalkyl primary monoamine3. The composition of wherein the molar ratio of the epoxide-containing compound (i) to the primary amino sulfonate (ii) is 5:1 to 1:5.4. The reaction product of having an average molecular weight of from 300 to 100 claim 1 ,000.5. The composition of wherein the primary monoamine alkylene oxide oligomer is present in an amount of from 1 to 15 percent claim 1 , of the the amine hydrogen equivalents for reaction with the epoxide equivalents of component (i) claim 1 , the epoxide-containing compound.6. The composition of wherein the epoxide-containing compound is selected from diglycidyl ether of 4 claim 1 ,4′-isopropylidenediphenol (bisphenol A); cis-1 claim 1 ,3-cyclohexanedimethanol; trans-1 claim 1 ,3-cyclohexanedimethanol; cis-1 claim 1 ,4-cyclohexanedimethanol;or trans-1,4-cyclohexanedimethanol.7. The composition of wherein the primary amino sulfonate is selected from sulfanilic acid claim 1 , sodium salt; sulfanilic acid claim 1 , potassium salt; ...

METHOD OF PREPARATION OF CATIONIC POLYMERS WITH REDUCED HALIDES CONTENT

The present invention relates to a polymer preparation method for preparing water-soluble cationic polymers P1 wherein the halides content is reduced, as well as to the use of these polymers as additives in compositions that are based on inorganic mineral binders or in the treatment of aqueous open, semi-closed, or closed circuits. 1. A polymer preparation method for preparing an aqueous solution of water-soluble cationic polymers P1 wherein the halides content is lower than 10% by weight of the polymer , the viscosity at 25° C. is lower than 200 cps , said viscosity being determined for an aqueous solution of polymers P1 concentrated at 50% by weight , and the cationic charge density is greater than or equal to 4 meq.g , characterized in that it comprises the following successive steps:{'sup': −1', '1', '−', '+, 'sub': '1', 'claim-text': [{'sup': '1', 'Rrepresents a hydrogen atom or a saturated alkyl chain, either linear or branched, comprising from 1 to 8 carbon atoms, that may contain at least one nitrogen atom and/or oxygen atom, said chain may be substituted by 1 to 4 carboxylate functional groups of formula —COR;'}, {'sub': 1', '3, 'sup': +', '2', '+', '3', '+', '4', '5', '6, 'Y represents an alkali metal cation, an ammonium ion of formula R—NH or a quaternary ammonium of formula R—N(R)(R)(R);'}, {'sup': −', '+, 'sub': '2', 'R represents an OH group or a group OY;'}, {'sub': 2', '3, 'sup': +', '2', '+, 'Y represents an alkali metal cation or an ammonium ion of formula R—NH;'}, {'sup': '2', 'Rrepresents a hydrogen atom or a saturated alkyl chain, either linear or branched, comprising from 1 to 4 carbon atoms ; and'}, {'sup': 3', '4', '5', '6, 'R, R, Rand Rrepresent, independently of each other, a saturated alkyl chain, either linear or branched, comprising from 1 to 4 carbon atoms;'}], 'a) adding, at a temperature comprised between 0° C. and 120° C., of at least one compound of formula (I) to an aqueous solution of at least one water soluble cationic polymer P2 ...

HARDENER FOR EPOXY RESINS

A curing agent for epoxy resins has N-benzylethane-1,2-diamine and N,N′-dibenzylethane-1,2-diamine in a weight ratio in the range from 65/35 to 95/5. The curing agent is easy to prepare, thins epoxy resins particularly well, and enables low-emission epoxy resin products that have good workability and a long pot-life, cure reliably and surprisingly fast and can be walked on after a short time, in particular even in cold conditions. Coatings of particularly high mechanical grade, with a high surface quality and a minimal tendency to yellowing, can thus be produced. Epoxy resins of this type are particularly suitable for coating floors. 1. A curing agent for epoxy resins comprising N-benzylethane-1 ,2-diamine and N ,N′-dibenzylethane-1 ,2-diamine in a weight ratio in the range from 65/35 to 95/5.2. The curing agent as claimed in claim 1 , wherein the weight ratio is in the range from 70/30 to 90/10.3. The curing agent as claimed in claim 1 , wherein it comprises a reaction mixture obtained from the reductive alkylation of ethane-1 claim 1 ,2-diamine with benzaldehyde and hydrogen.4. The curing agent as claimed in claim 1 , wherein it comprises at least one further amine.5. The curing agent as claimed in claim 4 , wherein the further amine is selected from the group consisting of 2 claim 4 ,2(4) claim 4 ,4-trimethylhexane-1 claim 4 ,6-diamine claim 4 , 1 claim 4 ,2- claim 4 , 1 claim 4 ,3- or 1 claim 4 ,4-diaminocyclohexane claim 4 , 1 claim 4 ,3-bis(aminomethyl)cyclohexane claim 4 , 1 claim 4 ,4-bis(aminomethyl)cyclohexane claim 4 , bis(4-aminocyclohexyl)methane claim 4 , 1-amino-3-aminomethyl-3 claim 4 ,5 claim 4 ,5-trimethylcyclohexane claim 4 , 2(4)-methyl-1 claim 4 ,3-diaminocyclohexane claim 4 , 1 claim 4 ,3-bis(aminomethyl)benzene claim 4 , polyoxypropylenediamines having an average molecular weight Min the range from 200 to 500 g/mol claim 4 , 3-(3-(dimethylamino)-propylamino)propylamine claim 4 , bis(6-aminohexyl)amine claim 4 , diethylenetriamine claim 4 , ...

Epoxy systems for composites

Compositions and methods for forming epoxy resin systems are provided. In one embodiment, a composition is provided for an epoxy resin system including a reaction product of an epoxy resin component and a curing agent component comprising a first amine compound having the formula R1R2R3N, wherein R1 and R2 are independently an aliphatic or alicyclic organic functional group and R3 is an alkyl group, having a backbone of 2-18 carbon atoms, and a second amine compound having one or more primary or secondary amine groups, with the stoichiometic ratio of —NH bonds of the second amine compound to the epoxy groups of the epoxy resin component being from 1:20 to about 21:20. The composition may be used to form composites, such as used in commercial wind turbine blade manufacturing.

MECHANOPHORE-GRAFTED POLYMERS TO FORM STRESS-RESPONSIVE THERMOSET NETWORK

Compositions including a thermosetting polymer network and a mechanophore covalently bonded to the thermosetting polymer network are provided. Substrates including the compositions are provided. In addition, methods of making the compositions and methods of monitoring stress on a substrate comprising the compositions are provided. 1. A method of making a composition , the method comprising: 'wherein the mechanophore precursor comprises cinnamamide;', 'preparing a mixture comprising a thermosetting polymer network precursor, a mechanophore precursor, and a solvent,'}reacting the mixture to provide an intermediate composition;removing the solvent from the intermediate composition; andadding a polyfunctional hardener comprising 2 to 5 functional groups that are reactive with an epoxide to the intermediate composition to provide a composition comprising a thermosetting polymer network and a mechanophore covalently bonded to the thermosetting polymer network.2. The method of claim 1 , wherein the thermosetting polymer network precursor comprises an epoxide functional group.3. The method of claim 1 , wherein reacting the mixture is performed at about 20° C. to about 60° C. for about 1 h to about 10 h.4. The method of claim 1 , wherein the intermediate composition comprises the mechanophore precursor claim 1 , the mechanophore claim 1 , or a combination thereof covalently bonded to the thermosetting polymer network precursor.5. The method of claim 1 , wherein the polyfunctional hardener is selected from the group consisting of a polyfunctional amine claim 1 , cyclic anhydride claim 1 , polyphenol claim 1 , polyfunctional alcohol claim 1 , and polyfunctional thiol.6. The method of claim 5 , wherein the polyfunctional amine is diethylenetriamine.7. The method of claim 1 , wherein the epoxide is diglycidyl ether of bisphenol F.8. The method of claim 1 , wherein the mixture is further cured with UV-365 nm light.9. A method of monitoring stress on a substrate claim 1 , the ...

RESIN COMPOSITION FOR FIBER-REINFORCED COMPOSITE MATERIAL AND FIBER-REINFORCED COMPOSITE MATERIAL OBTAINED USING SAME

The resin composition is a resin composition for a fiber-reinforced composite material including: a main agent containing an epoxy resin (A) and an acrylate compound (B) having 4 or more acryloyl groups in a molecule thereof; and a curing agent containing an amine compound (C) represented by the following general formula (1), the resin composition being a two-component curable resin composition including the main agent and the curing agent at a mass ratio in the range of from 90:10 to 65:35, wherein the main agent has a viscosity at 25° C. measured with an E-type viscometer of 20,000 mPa·s or less, and wherein the curing agent has a viscosity at 25° C. measured with the E-type viscometer of 800 mPa·s or less: 2. The resin composition for a fiber-reinforced composite material according to claim 1 , wherein X in the general formula (1) represents an n-valent hydrocarbon group having an alicyclic structure having 6 or more carbon atoms claim 1 , and the alicyclic structure may have a secondary amine structure therein.4. The resin composition for a fiber-reinforced composite material according to claim 1 , wherein the acrylate compound (B) is at least one kind selected from ditrimethylolpropane tetraacrylate claim 1 , pentaerythritol tetraacrylate claim 1 , dipentaerythritol pentaacrylate claim 1 , and dipentaerythritol hexaacrylate.5. The resin composition for a fiber-reinforced composite material according to claim 1 , wherein the main agent shows a viscosity increase ratio of 16% or less after a lapse of 24 hr at a degree of vacuum of 1.0 kPa and 80° C.6. The resin composition for a fiber-reinforced composite material according to claim 1 , wherein a cured product obtained by thermally treating the resin composition for a fiber-reinforced composite material at 130° C. for 5 min to cure the resin composition shows a glass transition temperature of 110° C. or more.7. A fiber-reinforced composite material claim 1 , which is obtained by blending the resin composition for ...

COATING COMPOSITION

A water-based coating composition containing two parts (Parts A and B), (A) binder component containing a waterborne epoxy dispersion and dispersed inorganic particles with a polymeric dispersant and (B) hardener component. The polymeric dispersant contains anti-agglomerating functional groups that are unreactive with oxirane groups of the epoxy dispersion. 1. A coating composition comprising components (A) and (B); (a) from 10 to 75% of a waterborne epoxy dispersion,', '(b) from 0.01 to 5% of a polymeric dispersant and', '(c) from 20 to 85% of inorganic particles, and, '(A) based on the total dry weight of the component (A),'}(B) a curing agent,in which the ratio of the component (A) and the component (B) is 90:1 to 2:1, and the polymeric dispersant is a polymer comprising an anti-agglomerating functional group.2. The coating composition of claim 1 , wherein the polymeric dispersant is formed from a monomer composition comprising: i) a monomer containing an anti-agglomerating functional group claim 1 , ii) optionally an α claim 1 ,β-ethylenically unsaturated carboxylic acid monomer and iii) an α claim 1 ,β-ethylenically unsaturated nonionic monomer.3. The coating composition of claim 2 , wherein the monomer containing an anti-agglomerating functional group is selected from the group consisting of acrylamide claim 2 , phosphoethyl methacrylate claim 2 , sodium styrene sulfonate and acrylamide-methyl-propane sulfonate.4. The coating composition of claim 2 , wherein the monomer composition comprises claim 2 , based on the dry weight of the polymeric dispersant: i) from 5 to 80% by weight of a monomer containing an anti-agglomerating functional group claim 2 , ii) from 0 to 10% by weight of an α claim 2 ,β-ethylenically unsaturated carboxylic acid monomer and iii) from 10 to 95% by weight of an α claim 2 ,β-ethylenically unsaturated nonionic monomer.5. The coating composition of claim 1 , wherein the polymeric dispersant has a weight average molecular weight of from ...

AQUEOUS DISPERSIONS OF A MULTIFUNCTIONAL PRIMARY AMINE, PROCESS FOR ITS PREPARATION, AND USE THEROF

The invention relates to a curing agent for epoxy resins which is an aqueous dispersion of a multifunctional amine AC having more than one primary amino group per molecule, and at least one moiety per molecule derived from the reaction of a compound C containing at least one reactive group which is preferably an epoxide group, with a molecule having at least one blocked primary amino group and at least one group which is reactive towards the at least one reactive group of compound C, which is selected from the group consisting of secondary amino groups >NH, of hydroxyl groups —OH, of mercaptan groups —SH, of amide groups —CO—NHR, where R can be hydrogen or an alkyl group having from one to twelve carbon atoms, of hydroxyester groups, and of acid groups, particularly of carboxyl groups —COOH, sulphonic acid groups —SOH, and phosphonic acid groups —POH, and preferably, also moieties which are compatible with an epoxy resin, as well as a process for its preparation, and a method of use thereof. 1. A curing agent for epoxy resins which is an aqueous dispersion of at least one multifunctional amine AC having more than one primary amino group per molecule , and at least one moiety per molecule derived from the reaction of a compound C containing at least one reactive group which is preferably an epoxide group , with a compound having at least one blocked primary amino group and at least one group which is reactive towards the at least one reactive group of compound C , which is selected from the group consisting of secondary amino groups >NH , of hydroxyl groups —OH , of mercaptan groups —SH , of amide groups —CO—NHR , where R can be hydrogen or an alkyl group having from one to twelve carbon atoms , of hydroxyester groups , and of acid groups , particularly of carboxyl groups —COOH , sulphonic acid groups —SOH , and phosphonic acid groups —POH , characterised in that the mass fraction of oxyethylene and of oxypropylene moieties in compound C is below 5% ,and wherein the ...

FAST-CURE PRE-PREG

A laminar pre-preg of fibre-reinforced curable composite material. The pre-preg includes at least one layer of reinforcing fibres impregnated with a curable resin containing one or more curable thermosetting resin(s) and at least one liquid curative, wherein the curable resin exhibits a cure conversion of at least 95% when cured at a cure temperature in the range of from about 100° C. to about 160° C. and the cure cycle has a duration of no more than 10 minutes, and the glass transition temperature (Tg) of the curable resin when cured is in the range of from about 130° C. to about 165° C. 1. A laminar pre-preg of fibre-reinforced curable composite material , wherein said pre-preg comprises at least one layer of reinforcing fibres impregnated with a curable resin comprising one or more curable thermosetting resin(s) , wherein:(i) the curable resin comprises at least one liquid curative;(ii) the curable resin exhibits a cure conversion of at least 95% when cured at a cure temperature in the range of from about 100° C. to about 160° C. wherein the cure cycle has a duration of no more than 10 minutes; and(iii) the glass transition temperature (Tg) of the curable resin when cured is in the range of from about 130° C. to about 165° C.2. (canceled)3. (canceled)4. (canceled)5. (canceled)6. A pre-preg according to claim 1 , wherein the glass transition temperature (Tg) of the curable resin when cured is in the range of from about 130 to about 160° C.7. A pre-preg according to claim 1 , wherein said liquid curative is selected from substituted imidazoles claim 1 , preferably wherein the substituent groups of said substituted imidazoles are or comprise alkyl and/or aryl substituent groups claim 1 , and preferably the liquid curative is selected from 1-cyanoethyl-2-ethyl-4-methylimidazole claim 1 , 2-ethyl-4-methylimidazole claim 1 , 1-cyanoethyl-2-methylimidazole claim 1 , 1-methyl imidazole claim 1 , 4-methyl imidazole claim 1 , 1-benzyl-2-phenylimidazole claim 1 , 1-benzyl-2 ...

EPOXY RESIN COMPOSITION, EPOXY RESIN CURED PRODUCT, PREPREG AND FIBER-REINFORCED COMPOSITE MATERIAL

An epoxy resin composition produces a cured product having improved elastic modulus and improved nominal strain at compressive fracture. The epoxy resin composition is a fiber-reinforced composite material having excellent compression strength and interlayer toughness. The epoxy resin composition contains at least the following constituent components [A], [B] and [C]. [A] A specific ortho type epoxy resin. [B] At least one component selected from the group consisting of: thermoplastic resins that are compatible with the epoxy resin [A]; and core-shell type polymers. [C] An amine curing agent. 113-. (canceled)15. The epoxy resin composition as set forth in claim 14 , wherein component [A] is an epoxy resin as represented by Formula (2) and the epoxy resin as represented by Formula (2) accounts for 5 parts by mass or more and less than 30 parts by mass relative to the total epoxy resin quantity which accounts for 100 parts by mass.16. The epoxy resin composition as set forth in claim 14 , wherein the amine curing agent [C] is diaminodiphenyl sulfone claim 14 , or a derivative or isomer thereof.17. The epoxy resin composition as set forth in claim 14 , wherein a polyfunctional amine type epoxy [D] other than the epoxy resin [A] as represented by Formula (2) accounts for 20 to 70 parts by mass relative to the total epoxy resin quantity which accounts for 100 parts by mass.18. The epoxy resin composition as set forth in claim 14 , wherein the thermoplastic resin [B] that is compatible with the epoxy resin [A] has a glass transition temperature of 150° C. or more.19. The epoxy resin composition as set forth in claim 14 , further comprising thermoplastic resin particles [E] that are insoluble in epoxy resin [A] and of at least one material selected from the group consisting of polyamide claim 14 , polyimide claim 14 , polyamide-imide claim 14 , polycarbonate claim 14 , and polyphenylene sulfide.20. The epoxy resin composition as set forth in claim 14 , wherein the amine ...

OXIRANE-CONTAINING BISANHYDROHEXITOL DERIVATIVES AND USES THEREOF

Epoxy compounds that are bisanhydrohexitol derivatives (i.e., isosorbide derivatives, isomannide derivatives, isoidide derivatives, or mixtures thereof) having two terminal oxirane groups are provided. Additionally, curable compositions that include these epoxy compounds, cured compositions prepared from the curable compositions, and articles containing the cured compositions are described. The cured compositions can be used, for example, as a structural adhesive or as a coating. 3. The compound of claim 1 , wherein L has 1 to 30 carbon atoms.4. The compound of claim 1 , wherein L has 4 to 20 carbon atoms.7. The curable composition of claim 5 , wherein the curing agent comprises (a) an amine compound having at least one primary amino group or at least one secondary amino group claim 5 , (b) an imidazole claim 5 , imidazoline claim 5 , or salt thereof claim 5 , (c) a phenol substituted with at least one group selected from a tertiary amino claim 5 , secondary or tertiary alkyl claim 5 , nitro claim 5 , halo claim 5 , hydroxyl claim 5 , or combination thereof claim 5 , (d) a bisphenol claim 5 , (e) an anhydride claim 5 , (f) a carboxylic acid claim 5 , (g) a mercaptan claim 5 , or (h) a mixture thereof.8. The curable composition of claim 5 , further comprising a second epoxy compound that is not of Formula (I).9. The curable composition of claim 8 , wherein the second epoxy compound is a plant-based epoxy compound.10. The curable composition of claim 8 , wherein the second epoxy compound is a diglycidyl ether derivative of bisphenol A or a diglycidyl ether derivative of bisphenol F.13. The article of claim 11 , wherein the curing agent comprises (a) an amine compound having at least one primary amino group or at least one secondary amino group claim 11 , (b) an imidazole claim 11 , imidazoline claim 11 , or salt thereof claim 11 , (c) a phenol substituted with at least one group selected from a tertiary amino claim 11 , secondary or tertiary alkyl claim 11 , nitro ...

HIGH CHEMICAL RESISTANT COATING AS PROTECTION AGAINST AGGRESSIVE ENVIRONMENT

A curable coating composition precursor comprising a first part (A) and a second part (B). The first part (A) comprises at least one first epoxy curing agent selected from aliphatic and cycloaliphatic amines and any combinations and mixtures thereof. The second part (B) comprises at least epoxy compound selected from bisphenol A and bisphenol F diglycidylether resins, and any combinations and mixtures thereof; at least one polyfunctional epoxy resin; at least one novolac epoxy resin; and optionally, at least one reactive diluent, Part (A) and/or part (B) comprise at least one inorganic phosphate compound. 1. A curable coating composition precursor , comprising: 'i. at least one first epoxy curing agent selected from aliphatic and cycloaliphatic amines and any combinations and mixtures thereof;', '(a) a first part (A) comprising'} i. at least one epoxy compound selected from bisphenol A and bisphenol F diglycidylether resins, and any combinations and mixtures thereof;', 'ii. at least one polyfunctional epoxy resin;', 'iii. at least one novolac epoxy resin;', 'iv. optionally, at least one reactive diluent;, '(b) a second part (B) comprising'}wherein part (A) and/or part (B) comprise at least one inorganic phosphate compound; andwherein the at least one inorganic phosphate compound is selected from orthophosphate, bisphosphate, (hydroxy)-phosphate salts of calcium, magnesium, strontium, sodium, lithium, potassium, aluminium and ammonium, and any combinations and mixtures thereof.2. The curable coating composition precursor according to claim 1 , wherein part (A) and part (B) comprise the at least one inorganic phosphate compound.3. The curable coating composition precursor according to claim 1 , wherein the at least one inorganic phosphate compound is a mixture comprising calciumhydroxidtrisphosphate and at least one orthophosphate.4. The curable coating composition precursor according to claim 1 , wherein the at least one inorganic phosphate compound is contained in ...

Liquid discharge head, method for producing the same, liquid discharge apparatus, and image forming apparatus

A liquid discharge head including: a flow path formation part in which pressure generation chambers are arranged; and a pressure generation unit configured to apply pressure to the pressure generation chambers, wherein the pressure generation unit is formed by joining a vibration unit to the flow path formation part with a resin layer, and wherein the resin layer includes a curable resin composition including (A) an epoxy resin, (B) a polythiol compound, (C) at least one adhesiveness-imparting agent selected from the group consisting of a compound represented by General Formula (1), a titanium compound represented by General Formula (2-1), and a titanium compound represented by General Formula (2-2), and (D) a curing accelerator.

Epoxy composition

An epoxy composition that includes an epoxy-terminated prepolymer, an alkanolamine hardener having at least one hydroxyl group and an organometallic compound, where amine groups of the alkanolamine hardener react with epoxy groups of the epoxy-terminated prepolymer in a stoichiometric ratio to form a cured epoxy composition. The epoxy-terminated prepolymer is formed from a reaction product of an amine terminated polymeric polyol and a molar excess of epoxy groups in an epoxy monomer, relative to a molar amount of amine groups in the amine terminated polymeric polyol.

Epoxy-functionalized polyorganosiloxane toughener

An epoxy-functionalized polyorganosiloxane toughener providing toughening properties for thermosetting resins is described. The epoxy-functionalized polyorganosiloxane toughener is an epoxy-functionalized siloxane polyether with a siloxane backbone, at least one epoxy-containing alkyl chain, and at least one alkoxyl polyether chain, each said at least one epoxy-containing alkyl chain and at least one alkoxyl polyether chain grafted to the siloxane backbone. Also disclosed is a thermosetting resin-based composition comprising the epoxy-functionalized polyorganosiloxane toughener of claim 1 and at least one of an epoxy resin, a hardener, and an accelerator.

CURING COMPOSITIONS

Epoxy compositions include a cucurbituril in complex with a curative, and methods for curing the epoxy composition. The curative is reactive with an epoxy compound, and the curative may be a cure accelerator or a cure hardener. Cured resins are obtained or obtainable from the epoxy compositions. Complexes of a cucurbituril have a curative. 2. The composition according to claim 1 , wherein the cucurbituril compound is selected from the group consisting of CB[5] claim 1 , CB[6] claim 1 , CB[7] claim 1 , CB[8] claim 1 , CB[10] and CB [n].3. The composition according to claim 2 , wherein the cucurbituril compound is CB[8] claim 2 , CB[7] claim 2 , or CB[6].4. The composition according to claim 1 , wherein the curative is a cure accelerator or a cure hardener.5. The composition according to claim 4 , wherein the composition comprises a cure accelerator and a cure hardener claim 4 , wherein one or both of the cure accelerator and cure hardener is provided in complex with the cucurbituril claim 4 , either within the same complex or in separate complexes.6. The composition according to claim 1 , wherein the curative is a compound having amino functionality claim 1 , optionally wherein the curative is selected from the group consisting of imidazoles (imidazole-containing compound) claim 1 , primary aliphatic amines claim 1 , aromatic amines claim 1 , anilines claim 1 , cycloaliphatic amines claim 1 , benzylic amines claim 1 , triazoles claim 1 , phenols claim 1 , amidoamines and polyamides.7. The composition according to claim 1 , wherein the epoxy compound is a monomeric epoxy compound or a polymeric epoxy compound claim 1 , optionally wherein the epoxy compound is an aromatic glycidyl ether or a hydrogenated aromatic glycidyl ether.8. The composition according to claim 1 , wherein the composition additionally comprises the curative in uncomplexed form.9. The composition according to claim 8 , wherein the mole amount of curative in complexed form is at least 50 mole % or at ...

EPOXY SYSTEMS FOR COMPOSITES

Compositions and methods for forming epoxy resin systems are provided. In one embodiment, a composition is provided for an epoxy resin system including a reaction product of an epoxy resin component and a curing agent component comprising a first amine compound having the formula R1R2R3N, wherein R1 and R2 are independently an aliphatic or alicyclic organic functional group and R3 is an alkyl group, having a backbone of 2-18 carbon atoms, and a second amine compound having one or more primary or secondary amine groups, with the stoichiometic ratio of —NH bonds of the second amine compound to the epoxy groups of the epoxy resin component being from 1:20 to about 21:20. The composition may be used to form composites, such as used in commercial wind turbine blade manufacturing. 2. The composition of claim 1 , wherein the second amine compound comprises one or more amine compounds selected from the group consisting of a polyether diamine claim 1 , a saturated aliphatic ring diamine claim 1 , a linear aliphatic amine claim 1 , and combinations thereof.3. The composition of claim 1 , wherein the stoichiometric ratio of the —NH bonds of the second amine compound to the epoxy groups of the epoxy resin component is up to 1:1.4. The composition of claim 2 , wherein claim 2 , the polyether diamine has the formula: HNCH(CH)CH[OCHCH(CH)]NH claim 2 , and x is from 2 to 70.5. The composition of claim 1 , wherein the R3 comprises an 8-12 carbon atom alkyl group selected from the group consisting of a linear alkyl group claim 1 , a branched alkyl group claim 1 , a cyclic alkyl group claim 1 , and combinations thereof.6. The composition of claim 1 , wherein R1 and R2 each comprise a functional group selected from the group consisting of a methyl group claim 1 , an ethyl group claim 1 , a propyl group claim 1 , a C5-C6 carbocyclic aliphatic ring claim 1 , a C5-C6 heterocyclic aliphatic ring claim 1 , a C5-C6 saturated aliphatic ring claim 1 , a C5-C6 unsaturated aliphatic ring claim 1 ...

Base generator, reagent, organic salt, composition, method for manufacturing device, cured film and device

A curing agent or a curing accelerator which is easy to synthesize and may cure an epoxy resin and the like, or may accelerate the curing is provided. A curing agent or a curing accelerator according to some embodiments of the present invention has a highly-coordinated silicon structure.

Method for coating boron

The present application relates to a method for coating boron, to a boron-containing resin solution, to a boron-coated thermal neutron converter obtained by the method for coating boron, and further to a thermal neutron detector comprising the boron-coated thermal neutron converter. The method for coating boron as provided in the application is applicable for various substrates and has small restrictions on substrate shapes, particularly for substrates having complex surface structures and high aspect ratios.

QUANTUM DOT COMPOSITION, QUANTUM DOT LUMINESCENT MATERIAL, PREPARATION METHOD THEREOF AND LIGHT-EMITTING DEVICE CONTAINING THE SAME

The disclosure provides a quantum dot composition, a quantum dot luminescent material, a preparation method thereof and a light-emitting device containing the same. The quantum dot composition includes a microemulsion, a polymer precursor dispersing the microemulsion, wherein the microemulsion includes quantum dots, a dissolution medium dissolving the quantum dots, and an emulsifier encapsulating the dissolution medium. 1. A quantum dot composition , comprising: a microemulsion and a polymer precursor dispersing said microemulsion , wherein said microemulsion comprises quantum dots , a dissolution medium dissolving said quantum dots , and an emulsifier encapsulating said dissolution medium.2. The quantum dot composition according to claim 1 , wherein said dissolution medium is a solvent or a reactive monomer.3. The quantum dot composition according to claim 2 , wherein said dissolution medium is the solvent claim 2 , said quantum dots are oil-soluble quantum dots claim 2 , said solvent is a non-polar organic solvent claim 2 , said emulsifier is an oil-in-water emulsifier claim 2 , and said polymer precursor is a water-soluble polymer precursor.4. The quantum dot composition according to claim 2 , wherein said dissolution medium is the solvent claim 2 , said quantum dots are water-soluble quantum dots claim 2 , said solvent is a polar organic solvent claim 2 , said emulsifier is a water-in-oil emulsifier claim 2 , and said polymer precursor is an oil-soluble polymer precursor.5. The quantum dot composition according to claim 2 , wherein said dissolution medium is the reactive monomer claim 2 , said quantum dots are oil-soluble quantum dots claim 2 , said reactive monomer is an oil-soluble monomer claim 2 , said microemulsion further comprises an optional first curing agent claim 2 , said emulsifier is an oil-in-water emulsifier claim 2 , and said polymer precursor is a water-soluble polymer precursor.6. The quantum dot composition according to claim 2 , wherein said ...

MOLDING COMPOUND HAVING RANDOMLY ORIENTED FILAMENTS AND METHODS FOR MAKING AND USING SAME

A molding compound is made by heat-softening, fusing and compressing strips of unidirectionally aligned filaments embedded in a thermosetting resin. The thermosetting resin is non-tacky at room temperature, which allows for easy handling, elimination of cold storage and the use of robotic manufacturing methods. Composites made by molding the molding compound have excellent, highly isotropic tensile properties. 1. A method for manufacturing a molding compound , comprising the steps of:A) forming a bed of unidirectionally aligned multifilament tows, the bed having a weight of 80 to 400 grams per square meter;B) impregnating the bed with the curable resin composition by applying the curable resin composition to at least one major surface of the bed, heating the curable resin composition to a temperature of at least 40° C. and applying pressure to the bed and the heated curable resin composition to form an impregnated multifilament bed having a filament content of 20 to 80% by weight and cooling the impregnated multifilament bed to below 40° C., wherein the curable resin composition:i) contains at least one epoxy resin, at least one curing agent for the epoxy resin, at least one catalyst for the reaction of the epoxy resin with the curing agent, and an internal mold release agent;ii) has a glass transition temperature of 0 to 40° C. as measured by differential scanning calorimetry;iii) is heat-softenable;iv) has a curing temperature of at least 100° C. andv) cures to form a thermoset polymer;C) cutting the impregnated multifilament bed into strips of unidirectionally aligned filaments embedded in a curable resin composition, said strips having (i) a longest dimension parallel to a direction of alignment of the filaments, said longest dimension being 25 to 100 mm, (ii) a length to width ratio of 16 to 150 and (iii) a length to thickness ratio of 50 to 1000;D) depositing said strips to form a mat having an areal weight of 700 to 5000 grams per square meter, wherein said ...

LOW-EMISSION LIQUID FILM FOR SEALING BUILDINGS

A composition, including at least one silane group-containing polymer that is liquid at room temperature, at least one epoxide liquid resin, and at least one aliphatic polyamine having a molecular weight of at least 115 g/mol and having at least three amine hydrogens reactive toward epoxide groups. The composition is a liquid that is configured to form a sealing membrane after curing. The sealing film applied in liquid form is isocyanate-free, low-odor, and easy to process because of the low viscosity and the long open time. The sealing film cures quickly and forms a high-quality elastic material having good mechanical properties and good weather resistance. 1. A composition comprising:at least one polymer which is liquid at room temperature and contains silane groups,at least one liquid epoxy resin,at least one aliphatic polyamine having a molecular weight of at least 115 g/mol and containing at least three amine hydrogens that are reactive toward epoxide groups,wherein:the at least one aliphatic polyamine includes at least one polyamine selected from the group consisting of triethylenetetramine, tetraethylenepentamine, pentaethylenehexamine, 1-amino-3-aminomethyl-3,5,5-trimethylcyclohexane and N,N′-bis(3-aminopropyl)ethylenediamine, andthe composition is a liquid that is configured to form a sealing membrane after curing, andthe composition in the cured state at room temperature has an elongation at break of at least 70%.2. The composition as claimed in claim 1 , wherein the polymer containing silane groups is a polyether containing silane groups.3. The composition as claimed in claim 2 , wherein the polyether containing silane groups further contains urethane groups and/or urea groups.4. The composition as claimed in claim 1 , wherein a weight ratio between the polymer containing silane groups and the liquid epoxy resin is in the range from 70/30 to 40/60.5. The composition as claimed in claim 1 , wherein the at least one aliphatic polyamine further includes a ...

SHAPE MEMORY-BASED SELF-HEALING POLYMER COMPOSITE REINFORCED WITH GRAPHENE FOAM

A shape-memory epoxy polymer graphene foam composite (SMEP-GrF) is formed from an open cell graphene foam (GrF) surrounded by and infiltrated with a shape-memory epoxy polymer (SMEP) matrix, with the GrF being an intra-connected framework within the SMEP matrix. The SMEP-GrF provides self-healing properties to a device fabricated from the SMEP-GrF. The SMEP-GrF is formed by infusion of an epoxy resin and hardener in an open cell GrF and curing the infused GrF. 1. A shape-memory epoxy polymer graphene foam composite (SMEP-GrF) , comprising:an open cell graphene foam (GrF) surrounded by and infiltrated with a shape-memory epoxy polymer (SMEP) matrix,the GrF being an intra-connected framework within at least a portion of the SMEP matrix,the SMEP-GrF being self-healing,the self-healing of the SMEP-GrF being thermally actuated and accelerated,-andthe SMEP-GrF being configured such that the self-healing is triggered by electrical actuation,the SMEP comprising an epoxy resin, andthe epoxy resin comprising: diglycidyl ethers of: resorcinol, hydroquinone: 4,4′-isopropylidene bisphenol (bisphenol A); bis(4-hydroxyphenyl)-2,2-dichloroethylene (bisphenol C); bis(4-hydroxy-phenyl)methane (bisphenol F); 4,4′-sulfonyldiphenol (bisphenol S); 4,4′-dihydroxybiphenyl, 4,4′-dihydroxybenzophenone (bisphenol K); 4,4′-(9-fluorenylidene)-diphenol; 9,9-bis[4-(2-hydroxyethoxy)phenyl]fluorene; 4,4′-dihydroxydiphenylethylmethane; 3,3′-dihydroxydiphenyldiethyl-methane; 3,4′-di-hydroxydiphenylmethylpropylmethane; 4,4′-dihydroxydiphenyloxide; 4,4′-dihydroxy-diphenyl-cyanomethane; 4,4′-dihydroxydiphenyl sulfide; 2,6-dihydroxynaphthalene; 1,3-dihydroxynaphthalene; 1,5-dihydroxynaphthalene; 1,6-dihydroxynaphthalene; 1,7-dihydroxynaphthalene; 2,7-dihydroxynaphthalene; catechol; 1,4-butanediol; 1,4-cyclohexanedimethanol; 1,2-cyclohexanedimethanol; 1,6-hexanediol; neopentylglycol; ethylene glycol; or combinations thereof.2. The SMEP-GrF according to claim 1 , the GrF being from 0.1 to 1 wt % of the ...

Process for producing an insulator layer, process for producing an organic optoelectronic component comprising an insulator layer and organic optoelectronic component comprising an insulator layer

A method is specified for production of an insulator layer. This method comprises the following process steps: A) providing a precursor comprising a mixture of a first, a second and a third component where—the first component comprises a compound of the general where R1 and R2 are each independently selected from a group comprising hydrogen and alkyl radicals and n=1 to 10 000; the second component comprises a compound of the general where R3 is an alkyl radical, and the third component comprises at least one amine compound; B) applying the precursor to a substrate; C) curing the precursor to form the insulator layer. The first compound comprises an epoxy group and a hydroxyl group. The second compound comprises an ester group. The curing takes place at room temperature or at temperatures between 50° C. and 260° C.

Polyetheramines used as accelerating agents in epoxy systems

The invention relates to the acceleration of the hardening of compositions of epoxy compounds and amino or anhydrid hardeners by adding highly-branched polyetheramines. Said highly branched polyetheramines can comprise terminal hydroxy groups (polyols) and/or amino groups (amino-modified). Said amino-modified highly branched polyetheramines can be obtained by subsequent modification of the terminal hydroxy groups of highly branched polyetheramine polyols.

Adducts and curable compositions using same

The present invention relates to novel adducts useful for improving the toughness and curable compositions using such toughening adducts. In a particular aspect, the present invention relates to novel toughening adducts and thermosetting resin formulations having improved fracture toughness using those toughening adducts.

CURING COMPOSITIONS

改进损伤容限的聚烯烃分散体和环氧树脂分散体掺合物

本发明提供用于制备耐损伤涂层的水性组合物，其包含以下物质的掺合物：(i)以所述组合物中的固体总重量计为2至30重量％的具有0.2至5微米的平均粒径的酸或酸酐官能化的聚烯烃分散体，和(ii)一种或多种环氧树脂的成膜分散体，所述环氧树脂选自具有150至4,000的环氧当量(EEW)和0.2至1.0微米的平均粒径的环氧树脂，其中所述聚烯烃分散体用以所述组合物中固体总重量计为2至8重量％的一种或多种阴离子表面活性剂例如含硫酸盐的表面活性剂稳定，并且，进一步其中，所述组合物具有3至8的pH值。

Polyolefin dispersion and epoxy dispersion blend for improved damage resistance

본 발명은 (i) 조성물 내의 고체의 전체 중량을 기준으로, 2 내지 30중량%의, 0.2 내지 5마이크론의 평균 입자 크기를 갖는 산 또는 무수물 작용기화된 폴리올레핀 분산액 및 (ii) 0.2 내지 1.0마이크론의 평균 입자 크기를 갖는 150 내지 4,000의 에폭시 등가 중량(EEW)을 갖는 에폭시 수지로부터 선택된 1종 이상의 에폭시 수지의 필름 형성 분산액의 블렌드를 포함하는 손상 내성 코팅을 제조하기 위한 수성 조성물을 제공하고, 여기서 폴리올레핀 분산액은, 조성물 내의 고체의 전체 중량을 기준으로, 2 내지 8중량%의 1종 이상의 음이온성 계면활성제, 예컨대 황산염 함유 계면활성제에 의해 안정화되고, 추가로 조성물은 3 내지 8의 pH를 갖는다. The present invention relates to (i) 2 to 30 weight percent of an acid or anhydride functionalized polyolefin dispersion having an average particle size of 0.2 to 5 microns, and (ii) 0.2 to 1.0 microns by weight, based on the total weight of solids in the composition. An aqueous composition is provided for preparing a damage resistant coating comprising a blend of a film forming dispersion of at least one epoxy resin selected from an epoxy resin having an epoxy equivalent weight (EEW) of 150 to 4,000 having an average particle size, wherein the polyolefin The dispersion is stabilized by 2 to 8% by weight, based on the total weight of solids in the composition, of at least one anionic surfactant, such as a sulfate containing surfactant, wherein the composition further has a pH of 3 to 8.

可固化组合物、由其制得的制品，及其制造和使用方法

本发明提供了一种可固化组合物，该可固化组合物包含含有第一聚酰胺的聚酰胺组合物。该第一聚酰胺在其主链中包含叔酰胺并且是胺封端的。该可固化组合物还包含含有2至20个碳原子的氨基官能化合物、多官能(甲基)丙烯酸酯、环氧树脂和无机填料。该无机填料以基于可固化组合物的总重量计至少25重量％的量存在。

多官能化伯胺的含水分散体，它的制备方法及其用途

本发明涉及一种用于环氧树脂的固化剂，以及它的制备方法，及其使用方法，该固化剂是多官能化胺AC的含水分散体，该胺AC具有每分子大于一个伯氨基和每分子至少一个部分，该至少一个部分得自含有至少一种反应性基团(其优选是环氧化物基团)的化合物C与这样的分子的反应，该分子具有至少一个封闭的伯氨基和至少一个基团，该至少一个基团对于化合物C的至少一个反应性基团是反应性的，该反应性基团选自仲氨基>NH、羟基‑OH、硫醇基团‑SH、酰胺基团‑CO‑NHR(其中R可以是氢或者具有1‑12个碳原子的烷基)、羟基酯基团和酸基团，特别是羧基‑COOH，磺酸基团‑SO 3 H和膦酸基团‑PO 3 H 2 ，并且还优选与环氧树脂相容的部分。

Resin composition and organic-electrolyte battery

FIELD: chemistry. SUBSTANCE: resin composition contains: (A) an epoxy resin containing (E1) an epoxy resin having an aromatic ring and an alicyclic skeleton, and (E2) an epoxy resin modified by a rubber-like core/shell polymer; and (B) a latent curing agent. EFFECT: obtaining a resin composition for use as a sealant, having excellent adhesive power with respect to metal and having high resistance to organic solvents. 22 cl, 4 tbl, 3 dwg, 30 ex РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) (13) 2 532 162 C2 (51) МПК C08L 63/00 (2006.01) C08G 59/24 (2006.01) C08G 59/50 (2006.01) H01M 2/06 (2006.01) H01M 2/08 (2006.01) H01M 2/30 (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА H01M 4/66 (2006.01) ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ H01M 10/0566 (2010.01) H01M 10/0585 (2010.01) (12) ОПИСАНИЕ (21)(22) Заявка: ИЗОБРЕТЕНИЯ К ПАТЕНТУ 2012101470/04, 14.06.2010 (24) Дата начала отсчета срока действия патента: 14.06.2010 15.06.2009 JP 2009-142774 (43) Дата публикации заявки: 27.07.2013 Бюл. № 21 117052 A 28.05.2009. JP 2008-166256 A 17.07.2008. JP 2007-095653 A 12.04.2007. JP 2004-315572 A 11.11.2004. JP 2004-075914 A 11.03.2004. JP 2000-345010 A 12.12.2000. JP 2007-106852 A 26.04.2007. JP 2008-528769 A 31.07.2008. SU 1641832 A1 15.04.1991. SU 516721 A1 05.06.1976 C 2 C 2 (56) Список документов, цитированных в отчете о поиске: JP 2004-238555 A 26.08.2004. JP2009- (85) Дата начала рассмотрения заявки PCT на национальной фазе: 16.01.2012 2 5 3 2 1 6 2 (86) Заявка PCT: R U 2 5 3 2 1 6 2 (45) Опубликовано: 27.10.2014 Бюл. № 30 (73) Патентообладатель(и): АДЗИНОМОТО КО., ИНК. (JP), НИССАН МОТОР КО., ЛТД. (JP) R U Приоритет(ы): (30) Конвенционный приоритет: (72) Автор(ы): АМАНО Хироси (JP), ОГИНО Кейдзи (JP), ХОСАКА Кендзи (JP), СЕНБОКУЯ Рюити (JP), СИМОИДА Есио (JP), ХОРИЕ Хидеаки (JP) JP 2010/060013 (14.06.2010) (87) Публикация заявки PCT: WO 2010/147070 (23.12.2010) Адрес для переписки: 129090, Москва, ул. Большая Спасская, 25, стр. 3, ООО "Юридическая фирма "Городисский и Партнеры" (54) КОМПОЗИЦИЯ СМОЛЫ И БАТАРЕЯ ...

Curing agent for epoxy resin coating

Benzylated triaminononane and uses thereof

본 발명은 벤질화 트리아미노노난 화합물, 벤질화 트리아미노노난 화합물을 포함하는 에폭시 경화제 조성물 및 이러한 조성물의 제조 방법을 제공한다. 아민-에폭시 조성물 및 이러한 아민-에폭시 조성물로부터 제조된 물품이 또한 개시된다. The present invention provides a benzylated triaminononane compound, an epoxy curing agent composition comprising the benzylated triaminononane compound, and a method for preparing the composition. Amine-epoxy compositions and articles made from such amine-epoxy compositions are also disclosed.

열경화성 수지 조성물

본 발명은 (a) 하나 이상의 열경화성 수지, (b) 하나 이상의 경화제 및 (c) 임의로, 하나 이상의 촉매를 포함하는 반응성 열경화성 수지 조성물로서, 상기 경화제(b)는 반응성 무기 클러스터를 포함하고, 상기 클러스터는 반응성 관능 그룹, 예를 들면, 아미노 그룹을 갖는 저장-안정성 무기 클러스터인, 반응성 열경화성 수지 조성물; 및 상기 열경화성 조성물로부터 열경화 생성물을 제조하는 방법에 관한 것이다. 경화제로서 반응성 클러스터 및 열경화성 수지의 조성물을 사용하여 개선된 열-기계적 거동의 열경화 생성물을 제조할 수 있다.

用于纤维缠绕成型的次中温固化环氧树脂组合物

本发明公开了一种用于纤维缠绕成型的次中温固化环氧树脂组合物，由以下重量份的原料组成：环氧树脂80～120份，胺类固化剂20～50份，具有环氧基团的低分子稀释剂0.5～10份，促进剂0.1～3份。本发明制备的环氧树脂组合物室温下操作时间不小于3小时，粘度小于700cP，组合物经适当的固化制度固化后，浇注体冲击强度可达到60KJ/m 2 ，可以使用耐温性差的塑料、橡胶作为内胆或内衬材料，开发适应不同需求的新产品。

一种高防腐环保型的水性环氧固化剂及其制备方法

本发明公开了一种高防腐环保型的水性环氧固化剂及其制备方法，所述水性环氧固化剂的组分按质量百分比计为：双酚A环氧树脂5～15％、醇醚类溶剂3％～8％、聚乙二醇35～45％、催化剂0.002～0.01％、复配交联剂28～32％和活性稀释剂11～18％,所述复配交联剂包括质量比为2～6.5:1的异佛尔酮二胺和二乙烯三胺。本发明提供的水性环氧固化剂，能够有效提高涂料的耐腐蚀性。

Thermosetting resin composition for aircraft parts having improved impact resistance

The present invention relates to a thermosetting resin composition for aircraft parts with improved impact resistance. More specifically, the present invention relates to a thermosetting resin composition for aircraft parts, the composition consisting of an epoxy resin and a curing agent. As PES (PES-NH2) introduced with an amine group is used as a material for providing impact resistance, the amine group improves dispersibility in the thermosetting resin and serves as a crosslinking agent. Accordingly, the thermosetting resin composition can satisfy mechanical strength, flame retardancy, impact resistance, and the like.

一种高韧性高模量聚合物及其制备方法

本发明公开了一种高韧性高模量聚合物，属于聚合物制备领域。本发明的一种高韧性高模量聚合物，是由芳香族环氧树脂、带脂肪链的多胺交联剂和第三单体反应构筑，且聚合物含有由共价键和阳离子增强的π‑π堆积形成的交联网络。通过在聚合物内形成共价键和相互作用强度呈现多分散性的阳离子增强的“面对面”π‑π堆积双重交联网络，克服高模量聚合物的刚性骨架对弱的非共价相互作用的限制。动态的、强度随机变化的π‑π堆积及时、连续的断裂和重组过程使聚合物网络能够及时有效地对外界刺激做出相应，同时聚合物网络中的化学交联使得聚合物结构不被破坏的作用，赋予目标刚性聚合物同时提高了拉伸强度和延伸性，实现了显著的增韧效果。

用于灌封胶的添加剂组合物及其应用

本发明涉及环氧树脂灌封胶相关技术领域，更具体地，本发明提供一种防沉降低粘度的环氧灌封胶及其制备方法。本发明第一方面提供一种用于环氧树脂灌封胶的添加剂组合物，按重量份计，制备原料包括1～100份填料、50～200份固化剂；和/或0～10份有机膨润土；和/或0～10份气相二氧化硅；和/或0～25份有机助剂；有机膨润土与气相二氧化硅不同时为0。本发明提供的防沉降低粘度的环氧灌封胶在环氧树脂体系中采用有机膨润土与减粘剂相结合的特征，在提高预加填料的树脂部分的抗沉降性能的同时，大幅降低了混合后的粘度，此外，在加入固化剂进行混合时，利用减粘剂对有机膨润土的作用，降低产品粘度，从而保证灌封系统优异的流动性。

복합 패널 물질

(a) 적어도 하나의 수지; 및 (b) (i) 적어도 하나의 저온 경화제와 적어도 하나의 고온 경화제의 혼합물 또는 (ii) 저온 경화제 부분 및 고온 경화제 부분을 갖는 경화제로 구성된 군으로부터 선택된 경화제를 함유하며, 여기서 저온 경화제의 양은 충분한 수지-경화제 첨가 반응에 의해 전체 수지-경화제 배합물에서 B-스테이징을 수행하기에 충분하고, 고온 경화제의 양은 수지를 촉매적으로 경화시키기에는 충분하지만 최종 경화에서 수지-경화제 첨가 반응을 일으키기에는 불충분하며, 수지(a) 대 경화제(b)의 비율은 약 5 이상인, 경화성 수지 조성물. 본 발명의 조성물은 자동차 또는 항공우주 용품을 위한 프리프레그를 제조하는 데 사용될 수 있다.

包含烷基取代的亚乙基胺的环氧树脂基纤维基体组合物

本发明涉及环氧树脂基纤维基体组合物，其包含烷基取代的亚乙基胺如二甲基二亚乙基三胺(DMDETA，以及二甲基‑1,4,7‑三氮杂庚烷)作为固化剂。这些固化剂的特征在于，在相对长的加工时间内的短固化时间，并且使得可以获得固化的环氧树脂，该固化的环氧树脂显示出低脆性和高拉伸强度并且具有高玻璃化转变温度，因此所要求保护的纤维基体组合物特别适于拉挤成型和缠绕方法。

一种温敏性固体胺固化剂及其制备方法

本发明涉及一种温敏性固体胺固化剂的制备方法：1）将酮醛树脂和酸酐混合后，于90~120℃恒温反应3~6h，待反应结束后得到酸酐封端改性的酮醛树脂；2）取上述酸酐封端改性的酮醛树脂并溶解，然后在搅拌条件下加入胺类单体溶液中和，除去溶剂、干燥，得到温敏性固体胺固化剂。本发明温敏性固体胺固化剂可以实现低温固化，所制得的粉末涂料具有较好的储存稳定性，固化后涂层各项性能优越，拥有较好的装饰性以及防护性能。

一种环氧固化剂及其制备方法、环氧树脂组合物及其制备方法和应用

本发明属于环氧树脂技术领域，尤其涉及一种环氧固化剂及其制备方法、环氧树脂组合物及其制备方法和应用；以各组分的总量为100重量份计，环氧固化剂包括如下各组分的原料：10～20份哌嗪衍生物，10～20份氨丙基哌嗪，10～20份聚醚胺，10～20份HMDA，20～30份促进剂，20～30份稀释剂。本发明所得固化剂在室温条件下与环氧树脂主剂混合后可达到快速表干和铲胶效果，所得树脂固化剂具有较高韧性、硬度和耐候性。

Epoxy curing agent, composition and use thereof

本発明は、ポリアルキレンポリエーテル変性ポリエポキシド樹脂とポリアミン成分との反応から得られるエポキシ硬化剤に関する。前記ポリアミン成分は、３〜１０個の窒素原子を有するポリエチレンポリアミン、たとえばジエチレントリアミン（ＤＥＴＡ）と、１〜８個の炭素原子を有する少なくとも１種のアルデヒド、たとえばホルムアルデヒドとの反応生成物である。前記エポキシ硬化剤は、液体または予備分散された硬化性エポキシ樹脂の硬化における２成分コーティングシステムの一部として使用することができる。

Branch-type amine-based curing agent, epoxy resin composition using the same and cured product thereof

The present invention relates to an epoxy resin composition comprising a branch-type amine-based curing agent and an epoxy resin, and a cured product thereof, wherein the branch-type amine-based curing agent is represented by chemical formula 1. The epoxy resin composition has excellent impact resistance.

Ethyleneamine epoxy hardener

A curable composition comprising a blend of: a) an epoxy resin; and b) a hardener comprising a polyfunctional amine is disclosed. The curable composition can be used in a variety of applications including, but not limited to coatings, civil engineering, flooring, composites, adhesives, and electrical laminates.

Method for synthesizing epoxy resin condensate capable of being hydrolyzed under weak alkaline

本发明公开了一种可在弱碱性下水解的环氧树脂固化物的合成方法，该方法为：在反应器中依次加入含1摩尔份环氧基团的环氧树脂、1.05～1.2摩尔份的卤代乙酸，100～180℃高速搅拌反应1～30小时。反应结束后，经沉淀、收集、干燥得到卤代乙酸改性的环氧树脂，将所得产物与含0.8～1.2摩尔份二甲氨基的多叔胺混合均匀，放入模具，0～100℃固化2分钟～2小时，即得到最终产物。本发明得到的环氧树脂制备过程简单、固化快速、产物有一定的抗菌性，所含甜菜碱酯键可在弱碱性下较快水解，有利于该热固性塑料的破解、回收，可用于塑料、胶黏剂、涂料等领域，特别适用于海洋高分子材料的环保处理。

COMPOSITION FOR PRODUCING HYDROCARBON FLUIDS FROM UNDERGROUND DEPOSIT

РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) (13) 2018 146 437 A (51) МПК C09K 8/50 (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ЗАЯВКА НА ИЗОБРЕТЕНИЕ (21)(22) Заявка: 2018146437, 07.06.2017 (71) Заявитель(и): ДАУ ГЛОУБЛ ТЕКНОЛОДЖИЗ ЛЛК (US) Приоритет(ы): (30) Конвенционный приоритет: 21.06.2016 US 62/352,758 (85) Дата начала рассмотрения заявки PCT на национальной фазе: 26.12.2018 (86) Заявка PCT: (87) Публикация заявки PCT: WO 2017/222814 (28.12.2017) R U (54) КОМПОЗИЦИЯ ДЛЯ ДОБЫЧИ УГЛЕВОДОРОДНЫХ ФЛЮИДОВ ИЗ ПОДЗЕМНОГО МЕСТОРОЖДЕНИЯ (57) Формула изобретения 1. Композиция, содержащая продукты реакции: (i) эпоксидсодержащего соединения, имеющего в среднем более одной эпоксидной группы на молекулу, (ii) первичного аминосульфоната, (iii) необязательно олигомера первичного моноаминалкиленоксида, и (iv) необязательно первичного моноамина, вторичного диамина, моногидроксиалкила первичного моноамина, дигидроксиалкила первичного моноамина, тригидроксиалкила первичного моноамина, моногидроксициклоалкила первичного моноамина, дигидроксициклоалкила первичного моноамина или тригидроксициклоалкила первичного моноамина. 2. Композиция по п. 1, отличающаяся тем, что (i) эпоксидсодержащее соединение представлено формулой: , где Q выбран из двухвалентной ароматической группы -Ar-; Ar-L-Ar, где L выбран Стр.: 1 A 2 0 1 8 1 4 6 4 3 7 A Адрес для переписки: 105082, Москва, Спартаковский пер., 2, стр. 1, секция 1, этаж 3, "ЕВРОМАРКПАТ" 2 0 1 8 1 4 6 4 3 7 US 2017/036273 (07.06.2017) R U (43) Дата публикации заявки: 26.06.2020 Бюл. № 18 (72) Автор(ы): ХЕФНЕР-младший Роберт И. (US), АББАС Саид (US), ХОЙЛС Стивен М. (US), МЭЙНАРД Шон Дж. (US), МЕЦА Сезар И. (US) из прямой связи, C1-С8 алкилена, -SO2-, -S-, >С=0 или -О-; двухвалентной циклоалифатической группы K, содержащей от 4 до 8 атомов углерода, или -R1-K-R2-, где R1 и R2 независимо представляют собой C1-С3 алкиленовую группу; (ii) первичный аминосульфонат представлен формулой: , где Z представляет собой алифатическую, ...

Aqueous solution of water-soluble epoxide resin, solid prepared therefrom, and method of preparation thereof

FIELD: polymer materials. SUBSTANCE: invention relates to epoxide resin-based solids or powders finding use as sealing materials, adhesives, and coating compositions. Aqueous solution of resin is prepared by mixing, at 10 to 40 C, epoxide compound or its solution in organic solvent with amine compound of general formula NH 2 N(R 1 )(R 2 ), or its aqueous solution, or its solution in organic solvent or in mixture of water in organic solvent at epoxide-to-amine equivalent ratio (0.5-2.0):1 to give epoxide resin solution, which is supplemented by water and heated to remove organic solvent, concentration of epoxide compound in organic solvent varying between 5 and 100% and that of amine compound (in water, organic solvent, or their mixture) between 10 to 100%. Aqueous solution of epoxide resin is dried to give solid, which is then ground into powder. EFFECT: simplified technology due preparation of modified water-soluble epoxide resins that do not require additional protonation. 7 cl, 4 ex соч бгс пы сэ (19) РОССИЙСКОЕ АГЕНТСТВО ПО ПАТЕНТАМ И ТОВАРНЫМ ЗНАКАМ ВО 2 193 573. 57 МК С 08 © 59/14, С 081 63/00 13) С2 12) ОПИСАНИЕ ИЗОБРЕТЕНИЯ К ПАТЕНТУ РОССИЙСКОЙ ФЕДЕРАЦИИ (21), (22) Заявка: 2000116018/04, 21.09.1999 (24) Дата начала действия патента: 21.09.1999 (30) Приоритет: 22.09.1998 /Р 10/285932 04.08.1999 УР 11/220856 (43) Дата публикации заявки: 10.05.2002 (46) Дата публикации: 27.11.2002 (56) Ссылки: Ц$ 4871808 А, 03.10.1989. ОЕ 3122641 А2, 23.12.1982. Ц$ 5688905 А, 18.11.1997. $4 1358787 АЗ, 07.12.1987. (85) Дата перевода заявки РСТ на национальную фазу: 22.06.2000 (86) Заявка РСТ: УР 9905128 (21.09.1999) (87) Публикация РСТ: М/О 00/17252 (30.03.2000) (98) Адрес для переписки: 129010, Москва, ул. Б.Спасская, 25, стр.3, ООО "Юридическая фирма Городисский и Партнеры", Е_.В.Томской (71) Заявитель: . ОЦУКА КАГАКУ КАБУСИКИ КАИСЯ (+Р) (72) Изобретатель: ТОМОТАКИ Йосихиса (/Р), КИТАДЗИМА Такаси (Р), ИСИКАВА Кеиитиро (УР), НАБЕСИМА Акихиро (.Р), ФУРУИТИ Томохиро (Р) (73) ...

Triple-crosslinked high-performance polymer and preparation method thereof

本发明公开了一种三重交联高性能聚合物及其制备方法，所述聚合物由双环氧单体、交联单体和功能单体固化交联形成，且含有由共价键和两种不同强度多层次氢键形成的交联网络结构，所述共价键与两种所述氢键的作用强度呈梯度递减，通过在聚合物内形成共价键和不同强度的多层次氢键的三重交联网络，克服高性能聚合物的强度‑延展性权衡的困境，动态的、层次化的氢键的及时、连续的断裂和充足过程使聚合物网络在保护结构完整性的同时，能够快速响应外界环境的传递和耗散，从而使得到的刚性聚合物不仅具有高拉伸强度和还具有很好的延伸性。

Super-smooth energy-saving coating material for water pump and preparation method thereof

本发明公开了一种用于水泵的超滑节能涂层材料及其制备方法，包括底层涂料和面层涂料，按照重量份数计，所述底层涂料包括环氧丙烯酸酯树脂35～60份、聚二甲基硅氧烷15～30份、聚氨酯10～20份、六方氮化硼2～10份、固化剂2～6份、消泡剂0.5～2份、偶联剂3～10份；所述面层涂料包括环氧树脂40～70份、聚酰胺酰亚胺5～15份、聚四氟乙烯2～10份、氮化钛2～6份、碳化硅1～5份、固化剂2～6份、偶联剂3～10份，本发明属于涂层技术领域。该用于水泵的超滑节能涂层材料强度高，耐磨性和耐腐蚀性较强，粘结性能优良。

Super elastic epoxy hydrogel

Described is a super elastic epoxy hydrogel that is easy to manufacture and can be engineered for various performance enhancements of the polymer. Also described are methods of enhancing the performance of this hydrogel and other hydrogels. Various polymer hydrogel composites, structures, and their uses are included, such as the actuator element comprising the hydrogel of the invention depicted in FIG. 2.

epoxy resin composition

본 발명은 경화 속도가 신속하고 착색이 작은 경화물이 얻어지는 에폭시 수지 조성물을 제공하는 것을 과제로 한다. 그리고, 본 발명은 1분자 중에 에폭시기를 2개 이상 갖는 에폭시 수지와, 1분자 중에 티올기를 2개 이상 갖는 티올 화합물과, 아민 화합물을 함유하는 착색이 적거나 무색인 에폭시 수지 조성물이다.

Latent epoxy resin formulations for liquid impregnation processes for production of fibre composite materials

본 발명은 적어도 하나의 수지 성분 및 적어도 하나의 경화제 성분으로 이루어지는 에폭시 조성물을 제공하며, 상기 조성물은 반-완성된 섬유 매트릭스 제품 및 경화된 섬유 매트릭스 라미네이트를 생산하기 위한 열경화성 매트릭스로서 적합하다.

The preparation method of epoxy resin for prepreg system and the preparation method of prepreg

本发明提供一种预浸料用环氧树脂体系的制备方法，包括以下步骤：将环氧树脂基体在50℃~100℃搅拌，形成组分A；将室温反应性固化剂和潜伏性固化剂混合，形成组分B；及将组分A和组分B以100:10~20的质量比混合反应，得到预浸料用环氧树脂体系。本发明还提供一种预浸料的制备方法。上述预浸料用环氧树脂体系在制备成胶膜时粘度较低，能够保证浸润增强纤维或织物的每根单丝，且由于柔性链段的室温反应性固化剂的加入，使得后续放置时，环氧树脂体系可继续反应，从而提高环氧树脂体系的粘度，降低预浸料的树脂流动度，同时，柔性链段对复合材料具有增韧效果。

A kind of core-shell nano with epoxy resin as template and preparation method and application

本发明公开了一种以环氧树脂为模板的核壳纳米粒子及其制备方法与应用。该核壳纳米粒子以阳离子型或阳‑非离子型的环氧树脂纳米粒子为有机核，金属或类金属氧化物为无机壳。本发明的核壳纳米粒子耐酸性非常好，可通过调整环氧树脂制备原料的类型来调整核材料的软化点，甚至采用E20为原材料时，常温下可得到接近球形的核壳纳米粒子，使核壳纳米粒子作为致孔剂时可得到比较完美的球形孔。本发明制备方法简便，制得的核壳纳米粒子十分稳定，可制备水性分散液，还能蒸除其中水分，转化为分散于其他溶剂中的纳米粒子，扩宽其适用范围。

Resin composition for filling the temperature sensor

PURPOSE: A resin composition for filling a temperature sensor is provided to have excellent adhesion with inorganic and organic materials, high thermal impact resistance, and improved flexibility. CONSTITUTION: A resin composition for filling a temperature sensor comprises 100.0 parts by weight of an epoxy mixed resin and 15-40 parts by weight of a mixed hardener. The epoxy mixed resin comprises 30-50 weight% of an alkoxysilane-modified epoxy resin which has an alkoxysilane group represented by chemical formula 1; 15-25 wt% of a rubber-modified epoxy resin; and 34-45 wt% of alumina. The mixed curing agent comprises 20-30 wt% of a modified aliphatic amine and 70-80 wt% of polyoxypropylenediamine. In the chemical formula, R^1 is a C1-20 alkyl group; and R^2 is a C1-4 substituted group which has an organic functional group selected from a vinyl group, a glycidoxy group, an acryl group, and a mercapto groups.

Epoxy resin composition for carbon-fiber-reinforced composite material, prepreg, integrated molding, fiber-reinforced composite material sheet, and casing for electric/electronic equipment

【課題】優れた難燃性および力学特性を有し、かつ燃焼時にハロゲンガスを発することのない軽量な繊維強化複合材料を提供する。また、かかる繊維強化複合材料を得るのに好適なプリプレグ、およびエポキシ樹脂組成物を提供する。更に、上記繊維強化複合材料を用いた、電気・電子機器筐体に好適な一体化成形体を提供する。 【解決手段】下記成分［Ａ］、［Ｂ］、［Ｃ］を含み、かつ成分［Ｃ］がリン原子濃度にして０．２〜１５重量％含まれる、炭素繊維強化複合材料用エポキシ樹脂組成物。 ［Ａ］エポキシ樹脂 ［Ｂ］アミン系硬化剤 ［Ｃ］リン化合物 【選択図】なし

Method of obtaining chemically stable press-moulds and instruments

FIELD: chemistry. SUBSTANCE: claimed invention relates to method of obtaining press-moulds, two-component hardening composition, applied in said method, and to application of said hardening composition for manufacturing seamless press-moulds and instruments. Technical result is achieved by method of obtaining instrument or press-mould, which includes application of seamless modelling paste, containing polymer system (a) and hardening system (b) on substrate with formation of continuous film of hardening substance, hardening of seamless modelling paste at temperature 20-60°C to realise complete reaction, mechanical processing of hardened seamless modelling paste with obtaining instrument or press-mould. Polymer system (a) contains epoxy resin (a1), which has average quantity of epoxy functional groups ≥3, selected from polyfunctional glycidylamines, and hardening system (b), containing amine compound (b1), which has average quantity of amine functional groups ≥4, selected from polyalkylenepolyamines. EFFECT: increase of chemical resistance of press-forms to low-molecular monomers, reduction of shrinkage and value of exothermal effect of hardening. 11 cl, 3 tbl, 3 ex РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) (51) МПК B29C 33/40 (13) 2 543 871 C2 (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ОПИСАНИЕ (21)(22) Заявка: ИЗОБРЕТЕНИЯ К ПАТЕНТУ 2011147731/05, 24.02.2010 (24) Дата начала отсчета срока действия патента: 24.02.2010 (72) Автор(ы): ХАУЛЭНД Дункан (FR) (73) Патентообладатель(и): ХАНТСМАН ЭДВАНСТ МАТИРИАЛЗ (СВИТЗЕЛЕНД) ГМБХ (CH) Приоритет(ы): (30) Конвенционный приоритет: (43) Дата публикации заявки: 27.05.2013 Бюл. № 15 R U 24.04.2009 EP 09158740.2 (45) Опубликовано: 10.03.2015 Бюл. № 7 2008100730 А1, 21.08.2008. SU 1512780 A1, 07.10.1989. RU 2327564 C2, 27.06.2008. RU 2046714 C1, 27.10.1995 (85) Дата начала рассмотрения заявки PCT на национальной фазе: 24.11.2011 2 5 4 3 8 7 1 (56) Список документов, цитированных в отчете о поиске: WO 2006024676 А2, ...

Epoxy/amine adducts for dispersing solids

본 발명은 일반 화학식 (I)의 적어도 하나의 디글리시딜 에테르(A), 일반 화학식 R t -[OEt] n [OPr] m [OBu] s -NH 2 의 적어도 하나의 폴리에테르 모노아민(B), 일반 화학식 Z-R 1 -NH 2 의 적어도 하나의 아민(C), 및 1차 아미노기가 없고 일반 화학식 NHTV를 갖는 적어도 하나의 2차 아민(D)(선택적)으로부터 제조될 수 있는 빗형 공중합체에 관한 것이며, 여기서, R은 지방족 잔기, 방향족 잔기 및 방향지방족 잔기로부터 선택되는 에폭시기가 없는 잔기를 나타내고; R t 는 1 내지 6개의 탄소 원자를 갖는 알킬 잔기로부터 선택되는 잔기를 나타내고; OEt는 에틸렌 옥사이드 잔기를 나타내고, OPr은 프로필렌 옥사이드 잔기를 나타내고, OBu는 부틸렌 옥사이드 잔기를 나타내고; n은 0 내지 100의 수를 나타내고, m은 3 내지 50의 수를 나타내고, s는 0 내지 20의 수를 나타내고, n+m+s는 3 내지 103이고; R 1 은 1 내지 12개의 탄소 원자를 갖는 지방족, 방향족 또는 방향지방족 탄화수소 잔기를 나타내고; Z는 1차 및 2차 아미노기가 없고 적어도 하나의 염기성 질소 원자를 갖는 잔기를 나타내고, T 및 V는 2차 아미노기를 전혀 함유하지 않고, 서로 독립적으로, 1 내지 12개의 탄소 원자를 갖는 지방족 잔기, 6 내지 12개의 탄소 원자를 갖는 방향족 잔기, 또는 7 내지 12개의 탄소 원자를 갖는 방향지방족 잔기를 나타내고, 이때, 폴리에테르 모노아민(B)의 1차 아미노기와 아민(C)의 1차 아미노기의 몰 수의 합을 디글리시딜 에테르(A)의 에폭시기의 몰 수로 나눈 값은 1/3 내지 3/4이다. 본 발명은 또한, 빗형 공중합체의 제조, 빗형 공중합체를 함유하는 분산액, 미립자 제제, 습윤제 및 분산제, 빗형 공중합체로 코팅된 입자, 및 특히 흑색도를 증가시키기 위한, 습윤제 및 분산제로서 빗형 공중합체의 용도에 관한 것이다. [화학식 I]

A kind of Graphene epoxy resin composite material and preparation method thereof

本发明提供一种石墨烯/环氧树脂复合材料及制备方法，涉及功能高分子材料领域，包括石墨烯、环氧树脂、固化剂和促进剂，所述的石墨烯/环氧树脂复合材料导电性在10 2 S/cm以上，所述石墨烯采用鳞片石墨、高锰酸钾、浓硫酸、磷酸和抗坏血酸通过氧化‑还原反应，并经冷冻干燥、高温热处理得到。本发明提供的石墨烯/环氧树脂复合材料，具有相容性好、分散均匀且高导电性能的有益效果。

Double purposes of (3 aminopropyl) methylamine as the curing agent of epoxy resin of oligomeric N, N

本发明涉及低聚‑N,N‑双(3‑氨丙基)甲胺作为环氧树脂的硬化剂的用途，以及相应可固化组合物，其固化和可由其得到的固化环氧树脂。

Anticorrosion coating method for galvanized steel structures

Water-based epoxy paint and preparation method thereof

本发明公开了一种水性环氧漆，包括A组分及B组分，所述A组分及B组分的质量比为(80‑90)：(10‑20)，其中所述A组分包括如下重量百分比的组分：固体环氧树脂分散体：36‑40％；自乳化液体环氧树脂：3‑7％；水性酚醛环氧树脂：3‑7％；防腐颜料：6‑10％；填料：11‑17％；助剂：1.75‑2.85％；水：19‑25％；所述B组分包括如下重量百分比的组分：环氧固化剂：42‑48％；抗闪锈剂：3‑5％；水：47‑55％。该水性环氧漆兼顾环保、高性能、易施工、耐腐蚀性强的特点，能满足各类机床表面的涂装要求。

High-toughness epoxy resin grouting material for quickly repairing concrete structure joint

一种用于混凝土结构接缝快速修复的高韧性环氧树脂注浆材料，它由A、B两部分原料组成：A组份包括缩水甘油醚类环氧树脂、缩水甘油醚类环氧树脂、增柔改性环氧树脂、端环氧基液体丁腈橡胶、活性稀释剂；B组份包括改性胺类固化剂、聚硫醇、叔胺促进剂、端氨基液体丁腈橡胶、有机硅类消泡剂、防老剂，A、B组份质量比为1∶0.2～1。该环氧树脂注浆材料粘度低，便于灌注施工，对潮湿基面的适用性好，硬化速度快，早期力学强度和粘结强度高，柔韧性极佳，耐湿热老化性能耐疲劳性能优异，可在不影响正常交通的情况下对混凝土结构接缝进行快速修复及补强加固。

Flexible polyepoxide resin containing poly-N-methylated secondary amine

Epoxy resin electromagnetic wave absorption composite material and its manufacturing method

Multifunctional epoxy resin-based water-soluble sizing agent containing graphene oxide and preparation method thereof

本发明涉及一种含氧化石墨烯的多官能团环氧树脂基水溶性上浆剂及其制备方法，步骤如下：1)水溶性多官能团环氧树脂制备；2)多官能团环氧树脂基水溶性上浆剂制备。本发明具有以下优点：上浆剂所用主体树脂为多官能团树脂，具有高的交联密度，高的玻璃化转变温度，好的耐热性和热稳定性，有利于在碳纤维表面形成具有好的热稳定性的树脂膜，且改善碳纤维和基体树脂之间的粘结强度；制备工艺简单，便于规模化大批量生产，也有利于石墨烯及其衍生物的工业化应用。经本发明的上浆剂上浆处理的碳纤维的集束性、耐磨性等生产工艺性得到改善，碳纤维的单丝断裂强度及其复合材料的热性能、力学性能均得到提高。

Composition of Room Temperature Rapid Hardening Epoxy Crack Injection Materials Including Inorganic Fillers Modified Rapid Hardening Silane Coupling Agents

본 발명은 콘크리트로 축조된 구조물의 균열 보수에 사용되는 상온 속경형 에폭시 균열주입제 조성물에 관한 것으로서, 콘크리트 도로, 교량의 신축이음장치 및 교량받침의 제조에 사용되는 콘크리트 및 터널 등과 같이 차량통행이 빈번한 콘크리트 구조물에 발생된 균열을 신속하게 보수하기 위해 에폭시 균열주입제의 젖음성을 개선하여 침투성이 우수하고, 속경형으로 개선하여 경화시간이 40±10분으로 조기에 강도를 발현하는 특성을 가지면서, 높은 접착강도와 인장강도 및 낮은 경화수축률과 신장률을 갖는 상온 속경형 에폭시계 균열주입제 조성물을 제공한다. The present invention relates to a room-temperature fast-diameter epoxy cracking injection composition used for repairing cracks in structures built with concrete, wherein vehicle traffic such as concrete and tunnels used in the manufacture of concrete roads, expansion joints of bridges and bridge bearings In order to quickly repair cracks that occur in frequent concrete structures, the wettability of the epoxy crack injection agent is improved so that the permeability is excellent. , It provides a room temperature fast-setting epoxy-based crack injection composition having high adhesive strength and tensile strength, and low curing shrinkage and elongation.