ПНЕВМАТИЧЕСКИЙ ОБЪЕКТ, СНАБЖЕННЫЙ ГАЗОНЕПРОНИЦАЕМЫМ СЛОЕМ НА ОСНОВЕ СТИРОЛЬНОГО ТЕРМОЭЛАСТОПЛАСТА И ПРОСТОГО ПОЛИФЕНИЛЕНОВОГО ЭФИРА

Настоящее изобретение относится к пневматическому объекту. Описан пневматический объект, снабженный эластомерным слоем, непроницаемым для надувного газа, причем указанный непроницаемый эластомерный слой содержит по меньшей мере один термопластичный стирольный эластомер с блоком полиизобутилена, отличающийся тем, что указанный непроницаемый эластомерный слой дополнительно содержит пластифицирующее масло в количестве от более 5 до менее 150 phr (весовых частей на 100 частей эластомера) и простой полифениленовый эфир ("РРЕ"), где простой полифениленовый эфир выбран из группы, состоящей из поли(2,6-диметил-1,4-фениленового эфира), поли(2,6-диметил-cо-2,3,6-триметил-1,4-фениленового эфира), поли-(2,3,6-триметил-1,4-фениленового эфира), поли(2,6-диэтил-1,4-фениленового эфира), поли(2-метил-6-этил-1,4-фениленового эфира), поли(2-метил-6-пропил-1,4-фениленового эфира), поли(2,6-дипропил-1,4-фениленового эфира), поли(2-этил-6-пропил-1,4-фениленового эфира), поли(2,6-дилаурил-1,4-фениленового эфира ...

ДВУХКОМПОНЕНТНАЯ КОМПОЗИЦИЯ НА ОСНОВЕ СОЕДИНЕНИЙ, ПО МЕНЬШЕЙ МЕРЕ, С ДВУМЯ ЭКЗО-ВИНИЛЕНОВЫМИ ЦИКЛИЧЕСКИМИ КАРБОНАТНЫМИ ЗВЕНЬЯМИ

ПНЕВМАТИЧЕСКИЙ ОБЪЕКТ, СНАБЖЕННЫЙ ГАЗОНЕПРОНИЦАЕМЫМ СЛОЕМ НА ОСНОВЕ СТИРАЛЬНОГО ТЕРМОЭЛАСТОПЛАСТА И ПРОСТОГО ПОЛИФЕНИЛЕНОВОГО ЭФИРА

... 1. Пневматический объект, снабженный эластомерным слоем, непроницаемым для надувного газа, причем указанный непроницаемый эластомерный слой содержит по меньшей мере один термопластичный стирольный эластомер с блоком полиизобутилена, отличающийся тем,что указанный непроницаемый эластомерный слой дополнительно содержит простой полифениленовый эфир ("PPE").2. Пневматический объект по п.1, где полифениленовый эфир имеет температуру стеклования выше 150°C, предпочтительно выше 180°C.3. Пневматический объект по п.2, где полифениленовый эфир выбран из группы, состоящей из поли(2,6-диметил-1,4-фениленового эфира), поли(2,6-диметил-ко-2,3,6-триметил-1,4-фениленового эфира), поли-(2,3,6-триметил-1,4-фениленового эфира), поли(2,6-диэтил-1,4-фениленового эфира), поли(2-метил-6-этил-1,4-фениленового эфира), поли(2-метил-6-пропил-1,4-фениленового эфира), поли(2,6-дипропил-1,4-фениленового эфира), поли(2-этил-6-пропил-1,4-фениленового эфира), поли(2,6-дилаурил-1,4-фениленового эфира), поли(2,6-дифенил ...

СШИТЫЕ ПОЛИМЕРНЫЕ КОМПОЗИЦИИ, ГАЗОРАЗДЕЛИТЕЛЬНЫЕ МЕМБРАНЫ ИЗ ТАКИХ СШИТЫХ ПОЛИМЕРНЫХ КОМПОЗИЦИЙ, СПОСОБЫ ИЗГОТОВЛЕНИЯ ТАКИХ МЕМБРАН И СПОСОБЫ РАЗДЕЛЕНИЯ ГАЗОВ ПРИ ИСПОЛЬЗОВАНИИ ТАКИХ МЕМБРАН

УЛУЧШЕННАЯ СМЕСЬ ПОЛИАРИЛЕНЭФИРОВ И ПОЛИАРИЛЕНСУЛЬФИДОВ

... 1. Термопластичные формовочные композиции, содержащие следующие компоненты:A) от 15 до 80 мас.%, по меньшей мере, одного полиариленэфира,B) от 5 до 70 мас.%, по меньшей мере, одного полиариленсульфида,C) от 0 до 15 мас.%, по меньшей мере, одного функционального полиариленэфира, содержащего карбоксильные группы,(D) от 15 до 70 мас.%, по меньшей мере, одного волокнистого или гранульного наполнителя и(Е) от 0 до 40 мас.% других примесей и/или технологических добавок,причем отношение видимой вязкости компонента (А) к видимой вязкости компонента (В) составляет от 2,5 до 3,7, причем видимую вязкость определяют при 350°С и скорости сдвига 1150 скапиллярным вискозиметром с круговым каналом длиной 30 мм, радиусом 0,5 мм, углом раствора диффузора 180°С, диаметром емкости резервуара плавления 12 мм и со временем предварительного разогрева 5 минут, и сумма мас.% компонентов (А)-(Е) составляет 100 мас.%.2. Термопластичная формовочная композиция по п.1, причем отношение видимой вязкости компонента (А ...

Термопластичная формовочная композиция

New thermoplastic compositions.

PROCEDURE FOR THE PRODUCTION OF A POLYPHENYLENETHERHARZZUSAMMENSETZUNG

HALOGEN-FREE FLAME-ADVERSE THERMOPLASTIC RESIN COMPOSITION

FLAME-ADVERSE RESIN COMPOSITION

OLIGOMERE CHAIN-LONGER FOR THE TREATMENT AND SUBSEQUENT TREATMENT AS WELL AS THE RECYCLING OF CONDENSATION POLYMERS, WHEREUPON BASED COMPOSITIONS AND APPLICATIONS THE SAME

FLAME-ADVERSE RESIN COMPOSITION WITH SYNDIOTAKTI POLYSTYRENE

PROCEDURE FOR THE PRODUCTION OF A LEADING CONCENTRATE

HARDEN-CASH COMPOSITION AND OF IT MAKING MULTILEVEL SUBSTRATE

MULTILEVEL NON-ADHESIVE COATING SYSTEM AND COATED ARTICLES IN SUCH A WAY

SCHWARZFARBENE POLY (OF ARYLENETHER) POLYSTYRENE COMPOSITION, ARTICLE FROM IT AND PROCEDURES

THERMOPLASTIC RESIN COMPOSITION

PRESSURE-SENSITIVE ADHESIVE COMPOSITION

THERMOPLASTISCHER FASERVERSTAERKTER VERBUNDWERKSTOFF MIT EINEM GEHALT AN POLYAMIDEN, VERFAHREN ZU SEINER HERSTELLUNG UND SEINE VERWENDUNG

FLAME-ADVERSE RESIN COMPOSITION

POLYPHASE POLYMER MIXTURES

RADIATION-HARDENABLE GLOSS ARMS OF POWDER COATINGS

FLAME-ADVERSE, AROMATIC POLYCARBONATE RESIN CONTAINING COMPOSITION

RADIATION-HARDENABLE GLOSS ARMS OF POWDER COATINGS

DYNAMIC NETWORKING PROCEDURE OF ELASTOMERS WITH IN-SITU-POLYMERIZATION

THERMOPLASTIC FLAME-ADVERSE RESIN COMPOSITIONS

FLAME-ADVERSE POLYESTER COMPOSITION

THERMOPLASTIC MOLDING MATERIALS.

FLAMING CELEBRATIONS RESIN COMPOSITION

HALF TRANSPARENCY MIXTURES OUT POLYPHENYLENETHERN, STYRENE RESINS AND ELASTOMERI BLOCK COPOLYMERS

FLAME RETARDING RESIN COMPOSITION

FLAME-ADVERSE RESIN COMPOSITION

HALOGEN-FREE FLAME-ADVERSE THERMOPLASTIC RESIN COMPOSITION

HALOGEN-FREE FLAME-ADVERSE THERMOPLASTIC RESIN COMPOSITION

HALOGEN-FREE FLAME-ADVERSE THERMOPLASTIC RESIN COMPOSITION

HALOGEN-FREE FLAME-ADVERSE THERMOPLASTIC RESIN COMPOSITION

FLAME-ADVERSE RESIN COMPOSITION

HALOGEN-FREE FLAME-ADVERSE THERMOPLASTIC RESIN COMPOSITION

FLAME-ADVERSE RESIN COMPOSITION

FLAME-ADVERSE RESIN COMPOSITION

FLAME-ADVERSE RESIN COMPOSITION

HALOGEN-FREE FLAME-ADVERSE THERMOPLASTIC RESIN COMPOSITION

HALOGEN-FREE FLAME-ADVERSE THERMOPLASTIC RESIN COMPOSITION

FLAME-ADVERSE RESIN COMPOSITION

FLAME-ADVERSE RESIN COMPOSITION

FLAME-ADVERSE RESIN COMPOSITION

HALOGEN-FREE FLAME-ADVERSE THERMOPLASTIC RESIN COMPOSITION

FLAME-ADVERSE RESIN COMPOSITION

HALOGEN-FREE FLAME-ADVERSE THERMOPLASTIC RESIN COMPOSITION

FLAME-ADVERSE RESIN COMPOSITION

HALOGEN-FREE FLAME-ADVERSE THERMOPLASTIC RESIN COMPOSITION

POLYPHENYLENE ETHER-POLYAMIDE COMPOSITION

Elastomeric laminates and composites

Impact resistant thermoplastic molding materials comprised of syndiotactic polystyrene, glass fibers and thermoplastic elastomer (tpe) impact modifiers

FLAME RETARDANT, NON-DRIPPING COMPOSITION OF POLYPHENYLENE ETHER AND ACRYLONITRILE - BUTADIENE-STYRENE

CONDUCTIVE PASTE

Thermoset resin composition, and prepreg and laminated board made of same

The present invention relates to a thermoset resin composition and prepreg made of the same and laminated board. The thermoset resin composition comprises the following constituents in parts by weight: 50-150 parts of cyanate; 30-120 parts of epoxy resin; 20-70 parts of allyl benzene maleic anhydride; 20-100 parts of polyphenyl ether; 30-100 parts of halogen-free flame retardant; 0.05-5 parts of curing accelerant; 50-200 parts of filler. The prepreg and the laminated board made of the thermoset resin composition have comprehensive performance such as low dielectric constant, low dielectric loss, superior flame retardancy, thermal resistance and wet resistance etc., and is suitable for use in a halogen-free high-frequency multilayer circuit board.

IMPROVEMENTS IN OR RELATING TO THERMOPLASTIC MOULDING COMPOSITIONS

POLYPHENYLENE ETHER RESIN COMPOSITION

Gas separations utilizing glassy polymer membranes at sub-ambient temperatures

Graft copolymer of functionalized polypropylene polymer and novolak polymer

FLAME RETARDANT COMPOSITION OF POLYPHENYLENE ETHER, STYRENE RESIN AND CYCLIC PHOSPHONATE

Abrasion-resistant polytetrafluoroethylene tape

POLYMER BLENDS CONTAINING IONOMERIC ELASTOMERS

POLYETHER BLENDS

POLYPHENYLENE OXIDE COMPOSITION

POLYMER ELECTROLYTE COMPOSITION CONTAINING AROMATIC HYDROCARBON-BASED RESIN

A polyelectrolyte composition having high durability even under high- temperature low-level-humidification conditions (e.g., operating temperature of 100~C and 50~C humidification (corresponding to a humidity of 12 RH)); and a proton-exchange membrane comprising this polyelectrolyte composition. The polyelectrolyte composition comprises a polymer (A) having an ion-exchange group, a polyphenylene sulfide resin (B), and a polyphenylene ether resin (C) and/or a polysulfone resin (D).

MOLDED ELECTRICAL DEVICE AND COMPOSITION THEREFORE

MOLDED ELECTRICAL DEVICE AND COMPOSITION THEREFORE This invention is directed to a molded electrical device comprising an electrically conductive pathway and an insulating material, and capable of interconnecting with external circuitry said insulating material comprising a blend of a particular amorphous polymer and a particular crystalline thermoplastic polymer. Also, this invention is directed to a composition suitable for use as an insulating material in an electrical device comprising from about 35 to about 65 weight percent of an amorphous polymer selected from a polyarylethersulfone resin, a polyarylether resin, a polyetherimide or a polyarylate, and from about 65 to about 35 weight percent of a crystalline polymer selected from a poly(arylene sulfide), a polyester or a polyamide. S P E C I F I C A T I O N ...

COMPOSITION OF A POLYPHENYLENE ETHER, A STYRENE RESIN, A PRECOMPOUNDED POLYMER SYSTEM AND A BLOCK COPOLYMER OF A VINYL AROMATIC COMPOUND AND AN OLEFINIC ELASTOMER

There are provided compositions comprising (a) a polyphenylene ether; (b) a polystyrene resin; (c) a precompounded polymer system comprising an olefinic resin and an elastomeric block copolymer alone, or in further combination with a dispersing agent; and (d) an elastomeric block copolymer resin. The use of (c) and (d) together provides, surprisingly; higher impact strength over the entire composition range of (a) to (b), with lower amounts of (c) and (d), based on the total resinous components of the system, being required.

POLYPHENYLENE ETHER RESIN COMPOSITION

A novel polyphenylene ether resin composition which possesses outstanding impact resistance and weatherability and retains the advantageous properties inherent in polyphenylene ether is disclosed, which comprises: (A) 10 to 90 parts by weight of a polyphenylene ether resin, (B) 0 to 88 parts by weight of a polystyrene-type resin, and (C) 1 to 25 parts by weight of an alkyl acrylate-type core-shell graft copolymer comprising (1) 50 to 80% by weight of a cross-linked elastic copolymer formed by copolymerizing an alkyl acrylate having 2 to 12 carbon atoms in the alkyl group thereof and a conjugate diene as main comonomers and (2) 50 to 20% by weight of a shell of hard resin formed by graft polymerizing an aromatic monovinyl compound and methyl methacrylate as main comonomers in a plurality of steps on the aforementioned elastic core.

POLYPHENYLENE ETHER RESIN COMPOSITION

A polyphenylene ether resin composition comprising (A) a polyphenylene ether resin, (B) a polystyrene resin, (C) an acrylonitrile/conjugated diene elastomeric copolymer, (D) a graft copolymer obtained by reacting butyl rubber and an unsaturated polyolefin in a bifunctional phenol as a reaction medium, and (E) an aromatic phosphate.

FORMABLE COATINGS

A coating composition capable of substantial deformation without loss of continuity, adhesion, or protective properties. The coating composition comprises a phenoxy resin mixed with a relatively soft modifier resin having certain specific properties. In a preferred embodiment, a particulate material, such as a zinc pigment, may also be included. A crosslinker may also be included.

MOLDING MATERIALS BASED ON POLYVINYL CHLORIDE

The invention relates to thermoplastic molding materials, of high heat distortion point, comprising polyvinyl chloride or copolymers of vinyl chloride with other vinyl compounds, and polyphenylene oxides. The molding materials according to the invention comprises a blend consisting of a) 30 - 90 % by weight of polyvinyl chloride or of co polymers of vinyl chloride with up to about 30 % by weight based on the weight of the copolymer of one or more other vinyl compounds which are copolymerizable with vinyl chloride, andb) about 10 - 70 % by weight of a polyphenylene oxide. Particularly preferred molding materials comprise a blend consisting of a) 30 - 70 % by weight of polyvinyl chloride or of its co polymers with up to about 30 % by weight based on the weight of the copolymer of copolymerizable vinyl compounds, andb) about 70- 30 % by weight of a polyphenylene oxide.

BLENDS OF A POLYPHENYLENE ETHER RESIN AND ALKENYL AROMATIC RESINS MODIFIED WITH EPDM RUBBER

Blends of polyphenylene ethers comprising 35-80% of a rubber modified alkenyl aromatic resin such as EPDM-styrene graft polymer have increased thermal distortion temperature and thermal oxidative stability in comparison to similar blends with lesser amounts of the rubber modified polymer. The blends may additionally comprise flame retardants and reinforcement agents, and are particularly suited for thermoplastic molding.

COMPATIBILIZED POLYPHENYLENE ETHER-POLYAMIDE COMPOSITIONS AND METHOD OF PREPARATION

COMPATIBILIZED POLYPHENYLENE ETHER-POLYAMIDE COMPOSITIONS AND METHOD OF PREPARATION Polyphenylene ether-polyamide compositions which are compatibilized and have high impact strength and solvent resistance are prepared by melt blending a carboxy-function-alized polyphenylene ether with a polyamide. The carboxyfunctionalized polyphenylene ethers contain at most one carbon atom separating the carboxy group from the aromatic ring and may be prepared by such reactions as metalationcarbonation or redistribution (equilibration).

THERMOPLASTIC RESIN COMPOSITION AND METHOD FOR PREPARING THE SAME

There is here provided a thermoplastic resin composition which comprises (I) 99 to 1% by weight of a polyamide resin, (II) 1 to 99% by weight of at least one kind of resin selected from the group consisting of a polyphenylene ether resin, a mixture of the polyphenylene ether resin and a styrene polymer, and a polycarbonate resin, (III) 0.1 to 100 parts by weight, based on 100 parts by weight of the aforesaid resins (I) + (II), of a multi-phase structure thermoplastic resin which is composed of 5 to 95% by weight of an epoxy group-containing olefin copolymer and 95 to 5% by weight of a vinyl polymer or copolymer obtained from at least one kind of vinyl monomer, either of both the components being formed with a dispersion phase having a particle diameter of 0.001 to 10 .mu.m. A method for preparing the above-mentioned thermoplastic resin composition is also provided here.

CURED POLYPHENYLENE ETHER RESIN AND A CURABLE POLYPHENYLENE ETHER RESIN

A novel cured polyphenylene ether resin is disclosed comprising a chloroform nonextractable polyphenylene ether and a chloroform extractable polyphenylene ether. By subjecting the resin to pyrolysis gas chromatography, the resin is decomposed to form 3,5-dimethylphenol specifically. The chloroform extractable polyphenylene ether is contained in the resin in an amount of 0.01 to 20 % by weight and comprises polyphenylene ether units substituted by an alkenyl group and/or an alkynyl group. The novel cured polyphenylene ether resin has excellent mechanical properties, electrical properties, heat resistance and chemical resistance. The cured polyphexylene ether resin is prepared by curing a novel curable polyphenylene ether resin comprising polyphenylene ether units substituted with an alkenyl groups and/or an alkynyl groups at a specific average substitution degree. The novel curable polyphenylene ether resin has not only excellent mechanical properties and desired electrical properties such ...

POLYEPOXIDE AND POLYPHENYLENE ETHER-POLYEPOXIDE COMPOSITIONS USEFUL IN PRINTED CIRCUIT BOARD PRODUCTION

Upstaged compositions are prepared by the reaction in the presence of a triarylphosphine catalyst between at least one bisphenol polyglycidyl ether, at least one epoxidized novolak and at least one brominated bisphenol. They may be used for the preparation of resinous blends with polyphenylene ethers, which, in combination with further components, may be used in the preparation of laminates useful as printed circuit boards and having excellent physical and electrical properties.

ULTRASONICALLY BONDABLE POLYPHENYLENE ETHER COMPOSITIONS

MOLDED ELECTRICAL DEVICE AND COMPOSITION THEREFORE

CROSSLINKABLE AROMATIC POLYMER COMPOSITIONS FOR USE IN ADDITIVE MANUFACTURING PROCESSES AND METHODS FOR FORMING THE SAME

The present invention discloses crosslinkable polymer compositions and additive manufacturing compositions incorporating such crosslinkable polymer compositions for use in additive manufacturing methods to prepare articles. The polymer compositions include at least one aromatic polymer and at least one crosslinking compound that is capable of crosslinking the at least one aromatic polymer.

POLYELECTROLYTE COMPOSITION CONTAINING AROMATIC HYDROCARBON RESIN

A polyelectrolyte composition having high durability even under high- temperature low-level-humidification conditions (e.g., operating temperature of 100~C and 50~C humidification (corresponding to a humidity of 12 RH)); and a proton-exchange membrane comprising this polyelectrolyte composition. The polyelectrolyte composition comprises a polymer (A) having an ion-exchange group, a polyphenylene sulfide resin (B), and a polyphenylene ether resin (C) and/or a polysulfone resin (D).

THERMOPLASTIC COMPOSITE, METHOD FOR PREPARING THERMOPLASTIC COMPOSITE, AND INJECTION-MOLDED PRODUCT

Provided is a thermoplastic composite, a method for preparing a thermoplastic composite, and an injection- molded product. The thermoplastic composite comprises 35-75% by weight of a thermoplastic resin, 5-45% by weight of a non-cellulosic organic fiber, and 5-20%) by weight of hollow glass microspheres, based on 100% by weight of the total weight of the thermoplastic composite.

EPOXY RESIN COMPOSITION FOR FIBER-REINFORCED COMPOSITE MATERIAL, METHOD FOR PRODUCING EPOXY RESIN COMPOSITION FOR FIBER-REINFORCED COMPOSITE MATERIAL, PREPREG, AND HONEYCOMB PANEL

The present technology provides an epoxy resin composition for a fiber-reinforced composite material, a method for producing an epoxy resin composition for a fiber-reinforced composite material, a prepreg, and a honeycomb panel. The epoxy resin composition for a fiber-reinforced composite material of the present technology contains: a reaction product obtained by reacting 100 parts by mass of a phosphorus-containing epoxy resin containing a phosphorus atom in the backbone thereof, and not less than 5 parts by mass and not greater than 20 parts by mass of an amino-terminated butadiene-acrylonitrile rubber; an epoxy resin other than the phosphorus-containing epoxy resin; a curing agent; and a curing accelerator.

POLYMER ELECTROLYTE COMPOSITION AND POLYMER ELECTROLYTE MEMBRANE, POLYMER ELECTROLYTE MEMBRANE WITH CATALYST LAYER, MEMBRANE ELECTRODE ASSEMBLY, AND POLYMER ELECTROLYTE FUEL CELL EACH USING THE SAME

To provide a practically excellent polymer electrolyte composition having excellent chemical stability of being resistant to strong oxidizing atmosphere during operation of fuel cell, and achieving excellent proton conductivity under low-humidification conditions, excellent mechanical strength and physical durability; a polymer electrolyte membrane, a membrane electrode assembly, and a polymer electrolyte fuel cell each using the same. A polymer electrolyte composition containing an ionic group-containing polymer (A), a phosphorus-containing additive (B), and a nitrogen-containing aromatic additive (C), the phosphorus-containing additive (B) and the nitrogen-containing aromatic additive (C) being a compound represented by specific structural formulae.

POLYMERIC COMPOSITIONS COMPRISING PER(PHENYLETHYNYL) ARENE DERIVATIVES

A polymeric composition comprising a first polymer chosen from a poly(arylene ether) polymer including polymer repeat units of the following structure: -(O - Ar1 - O- Ar2 - O-)m - (- O- Ar3 - O- Ar4 - O)n - where Ar1, Ar2, Ar3, and Ar4 are identical or different aryl radicals, m is 0 to 1, n is 1 m,; a polysulfone, a polyimide, a poly(etherketone), a polyurea, a polyurethane, and combinations thereof and a second polymer comprising a per(phenylethynyl) arene polymer derivative. Cured films containing the polymer can exhibit at least one of the following properties: Tg from 160°C to 180°C, a dielectric constant below 2.7 with frequency independence, and a maximum moisture absorption of less than 0.17 wt%. Accordingly, the polymer is especially useful, for example, in interlayer dielectrics and in die-attach adhesives.

SELF-REINFORCED COMPOSITE AND PROCESS FOR PREPARING SAME

... 2128613 9315144 PCTABS00024 A self-reinforced polymer composite in the form of a non-laminated shaped article is prepared by (a) melt blending (1) a matrix polymer which is a melt processable flexible chain polymer or first liquid crystal polymer (LCP) and (2) a fiber forming melt processable second LCP under high strain mixing conditions inducing fiber formation, cooling and stretching the resulting blend, and (b) shaping the resulting blend by injection molding or extrusion at a temperature which is above the minimum melt processing temperature of the matrix polymer but below that of the fiber forming second LCP. By shaping at a temperature below the minimum processing temperature of the fiber-forming LCP, the fiber structure formed during cooling is preserved. The resulting shaped articles have outstanding mechanical properties, e.g., tensile strength, modulus and impact strength.

USING A SOLVENT FOR IN-SITU FORMATION OF FIBERS IN AN ELASTOMER

USING A SOLVENT FOR IN-SITU FORMATION OF FIBERS IN AN ELASTOMER A method of preparing a fiber reinforced elastomer by forming fibers therein in-situ and an elastomer made thereby are provided. In the method, a fiber forming material, preferably a high performance polymer, is dissolved in a compatible solvent to form a solvent/polymer mixture, and the mixture is added to the elastomer during compounding or mixing. The polymer is quickly dispersed into the elastomer, and the solvent rapidly evaporates. The shear of the mixer causes elongation of the polymer into fibers. The fibers may also be oriented by the shear of the mixer.

POLYPHENYLENE ETHER MOLDING COMPOSITION

HOE 89/F 225 of the disclosure Polyphenylene ether molding composition In the case of polyphenylene ethers, in particular polyphenylene sulfide, the addition of a small amount of an organic phosphorus compound of the formulae II, III or IV inhibits crystallization and depresses the crystallization temperature in the melt. (II) (III) (IV) ...

TOUGHENED THERMOPLASTIC COMPOSITIONS BASED ON POLYPHENYLENE ETHER AND POLYAMIDE

CASE EC 4205 TOUGHENED THERMOPLASTIC COMPOSITIONS BASED ON POLYPHENYLENE ETHER AND POLYAMIDE. Toughened thermoplastic compositions are described having a good balance of mechanical, thermal and process properties, comprising: - at least a polyphenylene ether, - at least a polyamide, - an elastomeric copolymer containing a vinyl aromatic polymer grafted on an olefinic elastomer, and - an organic diisocyanate.

THERMOPLASTIC RESIN COMPOSITION

There is disclosed a thermoplastic resin composition comprising as principal components a ¢A! thermoplastic resin having a functional group reactive with an amino group, a ¢B! olefinic polymer and/or styrenic polymer, the subtotal of the above ¢A!+¢B! being 100 parts by weight, and 0.05 to 20 parts by weight of a ¢C! copolymer having in a molecule thereof a formamide group and/or an amino group or a salt thereof, said copolymer having the repeating unit 1, II, III or IV represented by the general formula (1), (II), (III) or (IV), respectively, ... (I) ... (II) ... (III) ... (IV) wherein Y is a group selected from the groups of the general formula . (V) ... (VI) ... (VII) ... (VIII) and other symbols are as defined in the specification. The above composition is excellent in impact characteristics, especially surface impact characteristics and appearance, minimized in coloration and free from delamination and peeling.

POLYMERIC MATERIALS

Polymeric monoliths having high stiffness and strength can be produced by heating an assembly of polymer fibres under a contact pressure to a temperature at which a proportion of the fibre is selectively melted and then compressing the assembly. Preferably at last 5 % of the polymer is melted so that on compression the molten materials fill the voids within the assembly. The use of polyolefin fibres especially melt spun polyethylene fibres is preferred. The products are useful e.g. as orthodontic brackets, bone prostheses and in body armour.

POLYPHENYLENE ETHER/POLYEPOXIDE RESIN SYSTEM FOR ELECTRICAL LAMINATES

POLYPHENYLENE ETHER/POLYEPOXIDE RESIN SYSTEM FOR ELECTRICAL LAMINATES The compositions of the present invention consist essentially of: (A) at least one polyphenylene ether having a number average molecular weight of at least about 12,000; (B) an epoxy material selected from the group consisting of (B-l) at least one polyglycidyl ether of a bisphenolic compound, said polyglycidyl ether having an average of at most one aliphatic hydroxy group per molecule and combinations of a major amount of said polyglycidyl ether with a minor amount of at least one of (B-2) aryl monoglycidyl ethers and (B-3) non-bisphenolic polyepoxy compounds; wherein the composition comprises up to about 90% by weight of component A, based on components A and B; (C) an effective amount of a curing catalyst comprising an aluminum or zinc salt; and (D) an effective amount of an imide curing co-catalyst. Cured compositions prepared in such fashion are homogeneous resins having high physical strength, excellent electrical ...

Aufzeichnungs- oder Speichermittel

POLYMER MIXTURE

THERMOPLASTIC ELASTOMER COMPOSITION, COVER FOR MEDICAL CONTAINER AND MEDICAL CONTAINER

MPPO material and preparation method thereof

Thermoplastic resin composition

A thermoplastic resin composition comprising 30 to 80 parts by mass of polyamide (A) and 20 to 70 parts by mass of polyphenylene ether (B) and further, per 100 parts by mass of the sum thereof, 0 to 40 parts by mass of rubbery polymer (C) and 10 to 50 parts by mass of plate inorganic filler (D) of 9 to 20 [mu]m average particle diameter wherein the ratio between, counted from smaller particle diameter, the diameter of 25% particles (d25%) and the diameter of 75% particles (d75%), d75%/d25%, is in the range of 1.0 to 2.5.

Thermoplastic polymer composition and molded product

A thermoplastic polymer composition capable of exhibiting excellent impact resistance, durability and destaticizing property containing (A) 50 to 95% by mass of an aliphatic polyester-based resin and (B) 5 to 50% by mass of a block copolymer of (B1) a hard segment block with at least one of a polyamide, polyester, polyolefin or polyurethane, and (B2) a soft segment block having an ether bond.

Process for preparing a polymer polyol

The invention relates to a process for preparing a polymer polyol, comprising mixing in a reactor vessel, a base polyol, one or more ethylenically unsaturated monomers, a polymerization initiator, optionally a macromer, and optionally a chain transfer agent, and polymerizing the mixture thus obtained at a temperature of 50 to 200° C., wherein after discharging the reactor vessel content, the interior surface of the reactor vessel walls and/or any internals present in the reactor vessel are blasted with round media.

Farnesene interpolymers

Farnesene interpolymer comprises units derived from a farnesene (e.g., α-farnesene or β-farnesene) and units derived from at least one vinyl monomer. The farnesene interpolymer can be prepared by copolymerizing the farnesene and at least one vinyl monomer in the presence of a catalyst. In some embodiments, the farnesene is prepared from a sugar by using a microorganism. In other embodiments, the at least one vinyl monomer is ethylene, an α-olefin, or a substituted or unsubstituted vinyl halide, vinyl ether, acrylonitrile, acrylic ester, methacrylic ester, acrylamide or methacrylamide, or a combination thereof.

Plastic pressure vessel for biopharmaceutical applications and methods thereof

Described herein is a molded plastic pressure vessel for biopharmaceutical applications and methods thereof. The molded plastic pressure vessel has a surface area of at least 500 inches2 and comprises a polyphenylene oxide polymer; and at least one antioxidant.

Blends of polyarylene ethers and polyarylene sulfides

The present invention relates to thermoplastic molding materials comprising the following components: (A) at least one polyarylene ether, (B) at least one polyarylene sulfide, (C) at least one functionalized polyarylene ether comprising carboxyl groups having a viscosity number according to DIN EN ISO 1628-1 of 45 to 65 ml/g measured in 1% strength by weight solution in N-methyl-2-pyrrolidone at 25° C., (D) at least one fibrous or particulate filler and (E) optionally further additives and/or processing assistants. In addition, the present invention relates to a process for the preparation of the thermoplastic molding materials according to the invention, the use thereof for the production of shaped articles and the use of functionalized polyarylene ethers comprising carboxyl groups having a viscosity number according to DIN EN ISO 1628-1 of 45 to 65 ml/g measured in 1% strength by weight solution in N-methyl-2-pyrrolidone at 25° C. for increasing the elongation at break and for improving the impact strength.

Method of separating a poly(arylene ether) composition from a solvent, and poly(arylene ether) composition prepared thereby

A method of separating a poly(arylene ether) from a solvent includes treating a poly(arylene ether)-containing solution with a devolatilizing extruder to form an extruded composition, and cooling the extruded composition with a cooling device that does not immerse the extruded composition in water. The composition may be used to isolate a poly(arylene ether) from the solvent-containing reaction mixture in which it is prepared, or to remove solvent from a multi-component poly(arylene ether)-containing thermoplastic composition.

Blends of polyarylene ethers and polyarylene sulfides

The present invention relates to thermoplastic molding materials comprising the following components: (A) at least one polyarylene ether, (B) at least one polyarylene sulfide, (C) optionally at least one functionalized polyarylene ether comprising carboxyl groups, (D) at least one fibrous or particulate filler and (E) optionally further additives and/or processing assistants, the ratio of the apparent viscosity of the component (A) to that of the component (B), determined at 350° C. and a shear rate of 1150 s −1 , being from 2.5 to 3.7.

Electrical conductor coated in a bonding layer, and a method of manufacturing such an electrical conductor

The invention relates to an electrical conductor coated in an insulating layer itself coated in a bonding layer, the conductor being characterized in that said bonding layer is obtained from a composition comprising a thermoplastics polymer and a settable resin. The invention also applies to a method of manufacturing such an electrical conductor coated in a bonding layer, the method being characterized in that it comprises applying said composition on said electrical conductor coated in said insulating layer, and applying treatment to cause said settable resin to be cured at least in part.

Poly(arylene ether) composition, method, and article

A composition includes specific amounts of a virgin poly(arylene ether) resin and a rubber-modified polystyrene that is preferably derived from post-consumer recycling. The composition includes about 0.2 to about 1.5 weight percent of polymerized acrylonitrile residue that can originate as a contaminant in the recycled rubber-modified polystyrene. The composition avoids the need for compatibilizing agents required by related compositions.

Polymer compositions based on pxe

New polymer compositions based on poly(2,6-dimethyl-1,4-phenylene oxide) and other high-softening-temperature polymers are disclosed. These materials have a microphase domain structure that has an ionically-conductive phase and a phase with good mechanical strength and a high softening temperature. In one arrangement, the structural block has a softening temperature of about 210° C. These materials can be made with either homopolymers or with block copolymers.

POLY(PHENYLENE ETHER) ARTICLES AND COMPOSITIONS

A composition useful for the injection molding of fluid engineering parts includes specific amounts of a high molecular weight poly(phenylene ether), a polystyrene, and glass fibers. The composition provides improved hydrostability and reduces or eliminates the butadiene monomer that is present in comparative compositions containing rubber-modified polystyrene. Fluid engineering articles prepared from the composition are described. 1. A fluid engineering article comprising a composition comprising:about 25 to about 50 weight percent of a poly(phenylene ether);about 25 to about 55 weight percent of a polystyrene; andabout 5 to about 35 weight percent of glass fibers;wherein the poly(phenylene ether) has a weight average molecular weight of at least 70,000 atomic mass units after being compounded with the polystyrene and the glass fibers;wherein the composition comprises less than or equal to 1 milligram butadiene per kilogram of composition; andwherein all weight percents are based on the total weight of the composition, unless a different weight basis is specified.2. The fluid engineering article of claim 1 , selected from the group consisting of pipes claim 1 , pipe liners claim 1 , pipe junctions claim 1 , hot and cold water device components claim 1 , boiler components claim 1 , central heating device components claim 1 , combined hot water and central heating device components claim 1 , heat exchanger components claim 1 , heat pump housings claim 1 , water pump housings claim 1 , filter housings claim 1 , water meter housings claim 1 , water valves claim 1 , impellers claim 1 , and faucet spouts.3. The fluid engineering article of claim 1 , wherein the poly(phenylene ether) has a weight average molecular weight of 70 claim 1 ,000 to about 110 claim 1 ,000 atomic mass units after being compounded with the polystyrene and the glass fibers.4. The fluid engineering article of claim 1 , wherein the poly(phenylene ether) has a weight average molecular weight of about ...

Biphenyl Polyphosphonate, Method for Preparing the Same and Thermoplastic Resin Composition Including the Same

Disclosed herein is a biphenyl polyphosphonate. The biphenyl polyphosphonate is represented by Formula 1: wherein R is hydrogen, substituted or unsubstituted C 1 -C 5 alkyl, substituted or unsubstituted C 2 -C 5 alkenyl, substituted or unsubstituted C 5 -C 6 cycloalkyl, substituted or unsubstituted C 5 -C 6 cycloalkenyl, substituted or unsubstituted C 6 -C 20 aryl, or substituted or unsubstituted C 6 -C 20 aryloxy, R 1 and R 2 are the same or different and are each independently substituted or unsubstituted C 1 -C 6 alkyl, substituted or unsubstituted C 5 -C 6 cycloalkyl, substituted or unsubstituted C 6 -C 12 aryl, or halogen, a and b are the same or different and are each independently an integer from about 0 to about 4, and n is an integer from about 4 to about 500.

MODIFIED HYDROCARBYLPHENOL-ALDEHYDE RESINS FOR USE AS TACKIFIERS AND RUBBER COMPOSITIONS CONTAINING THEM

The invention relates to a modified hydrocarbylphenol-aldehyde resin prepared by reacting a hydrocarbylphenol-aldehyde resin with a primary or secondary amine and further with an epoxide. The invention also provides a process for preparing a modified, hydrocarbylphenol-aldehyde resin and a rubber composition containing such resin. 2. The modified claim 1 , hydrocarbylphenol-aldehyde resin of claim 1 , wherein said resin is prepared by reacting about 1 to about 25 weight percent the epoxide with the resin of Formula (I).3. The modified claim 1 , hydrocarbylphenol-aldehyde resin of claim 1 , wherein Ris morpholinyl.4. The modified claim 1 , hydrocarbylphenol-aldehyde resin of claim 1 , wherein Ris a straight or branched C-Calkyl.5. The modified claim 4 , hydrocarbylphenol-aldehyde resin of claim 4 , wherein Ris tertiary butyl or tertiary octyl.7. The process for preparing a modified claim 6 , hydrocarbylphenol-aldehyde resin according to claim 6 , wherein step (a) comprises reacting about 1 to about 25 weight percent of the epoxide.8. The process for preparing a modified claim 6 , hydrocarbylphenol-aldehyde resin of claim 6 , wherein Ris morpholinyl.9. The process for preparing a modified claim 6 , hydrocarbylphenol-aldehyde resin of claim 6 , wherein Ris a straight or branched C-Calkyl.10. The process for preparing a modified claim 9 , hydrocarbylphenol-aldehyde resin of claim 9 , wherein Ris tertiary butyl or tertiary octyl.11. A rubber composition having improved tack claim 9 , comprisinga rubber or mixtures of rubbers, and{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, '0.5 to 7 phr of a modified, hydrocarbylphenol-aldehyde resin of .'}12. The rubber composition of claim 11 , wherein Ris morpholinyl.13. The rubber composition of claim 11 , wherein Ris a straight or branched C-Calkyl.14. The rubber composition of claim 13 , wherein Ris tertiary butyl or tertiary octyl.15. The rubber composition of claim 11 , wherein said rubber composition is a 30/70 natural ...

Poly(arylene ether) - polyolefin composition and its use in wire and cable insulation and sheathing

A composition includes specific amounts of a poly(arylene ether), an unfunctionalized hydrogenated triblock copolymer, an unfunctionalized polyolefin, and magnesium dihydroxide. The composition is useful for forming insulation and sheath layers of wire and cable.

AUTOMOTIVE LAMP EXTENSION MOLDING

[Problem to be Solved] The present invention has an object to provide an automotive lamp extension molding comprising a resin composition having a low specific gravity, being excellent in the balance of heat resistance and fluidity, and being excellent in gloss and brightness feeling of the surface of the molded article. 1. An automotive lamp extension molding , comprising a resin composition comprising 50 to 95 mass % of a polyphenylene ether (A) , and having a specific gravity in the range of 1.00 to 1.12.2. The automotive lamp extension molding according to claim 1 , wherein the (A) component has a reduced viscosity (measured at 30° C. using a chloroform solvent) of 0.25 to 0.45 dl/g.3. The automotive lamp extension molding according to claim 1 , wherein the (A) component has a reduced viscosity (measured at 30° C. using a chloroform solvent) of 0.25 to 0.38 dl/g.4. The automotive lamp extension molding according to claim 1 , wherein the resin composition further comprises 5 to 50 mass % of at least one resin component (B) selected from the group consisting of a non-rubber-reinforced styrene-based resin (B1) claim 1 , a styrene-based thermoplastic elastomer (B2) and a polycarbonate resin (B3).5. The automotive lamp extension molding according to claim 4 , wherein the (B1) component is a styrene-acrylonitrile (AS) resin having an acrylonitrile (AN) unit content of 5 to 15 mass %.6. The automotive lamp extension molding according to claim 4 , wherein the (B2) component is a hydrogenated substance of a styrene-conjugated diene compound block copolymer.7. The automotive lamp extension molding according to claim 4 , wherein the (B2) component comprises a hydrogenated substance (B2-1) of a styrene-conjugated diene compound block copolymer having bound styrene content of 45 to 80 mass % and a hydrogenated substance (B2-2) of a styrene-conjugated diene compound block copolymer having bound styrene content of 20 to 40 mass % claim 4 , at a mass ratio of (B2-1)/(B2-2)=4/1 ...

PROCESS FOR PRODUCING HIGH-PERFORMANCE THERMOPLASTICS WITH IMPROVED INTRINSIC COLOR

The present invention relates to a process for the work-up of polymer solutions comprising N-methyl-2-pyrrolidone and a polymer where the polymer solution is hydrogenated with hydrogen in the presence of a hydrogenation catalyst. 111-. (canceled)12. A process for the work-up of a polymer solution comprising hydrogenating the polymer solution with hydrogen in the presence of a hydrogenation catalyst , wherein the polymer solution comprises N-Methyl-2-pyrrolidone and a polymer.13. The process according to claim 12 , wherein the polymer is a polyarylene ether.14. The process according to claim 12 , wherein the hydrogenation catalyst is a heterogeneous hydrogenation catalyst comprising (i) from 10 to 99.999% by weight of aluminum oxide and/or of zinc oxide and (ii) from 0.001 to 90% by weight of cobalt claim 12 , nickel claim 12 , copper claim 12 , palladium claim 12 , or a mixture of these claim 12 , where the total of the % by weight values is based on the total of (i) and (ii) and does not exceed 100% by weight.15. The process according to claim 13 , wherein the hydrogenation catalyst is a heterogeneous hydrogenation catalyst comprising (i) from 10 to 99.999% by weight of aluminum oxide and/or of zinc oxide and (ii) from 0.001 to 90% by weight of cobalt claim 13 , nickel claim 13 , copper claim 13 , palladium claim 13 , or a mixture of these claim 13 , where the total of the % by weight values is based on the total of (i) and (ii) and does not exceed 100% by weight.16. The process according to claim 12 , wherein the process is carried out at a pressure of from 1 bar to 320 bar.17. The process according to claim 15 , wherein the process is carried out at a pressure of from 1 bar to 320 bar.18. The process according to claim 12 , wherein the process is carried out at a temperature of from 20 to 250° C.19. The process according to claim 17 , wherein the process is carried out at a temperature of from 20 to 250° C.20. The process according to claim 12 , wherein the ...

Method for producing polymer fine particle

A fine polymer particle production method includes producing an emulsion in a liquid prepared by dissolving and mixing a polymer A and a polymer B in organic solvents in which a solution phase composed primarily of the polymer A and a solution phase composed primarily of the polymer B are formed as separate phases, and bringing it into contact with a poor solvent for the polymer A to precipitate the polymer A. This method serves for easy synthesis of fine polymer particles with a narrow particle size distribution and the method can be effectively applied to production of highly heat-resistant polymers that have been difficult to produce with the conventional methods.

LOW DIELECTRIC RESIN COMPOSITION, APPLICABLE COPPER-CLAD LAMINATE AND PRINTED CIRCUIT BOARD

A resin composition includes (A) 100 parts by weight of poly(phenylene oxide) resin with styrene end group; (B) 5 to 75 parts by weight of olefin copolymer; and (C) 1 to 150 parts by weight of cyanate resin with poly(phenylene oxide) functional group. The resin composition is characterized by specific composition and proportion conducive to achieving a low dielectric constant, a low dielectric loss, and a high thermal tolerance and preparing a prepreg or a resin film, thereby being applicable to copper-clad laminates and printed circuit boards. 1. A resin composition for copper clad laminate , comprising:(A) 100 parts by weight of poly (phenylene oxide) resin with styrene end group;(B) 5 to 75 parts by weight of olefin copolymer; and(C) 1 to 150 parts by weight of cyanate resin with poly (phenylene oxide) functional group.2. The resin composition of claim 1 , wherein the olefin copolymer is methyl styrene copolymer or cyclic olefin copolymer.3. The resin composition of claim 1 , further comprising benzoxazine resin.4. The resin composition of claim 3 , further comprising 5 to 50 parts by weight of benzoxazine resin.5. The resin composition of claim 1 , further comprising at least one selected from the group consisting of epoxy resin claim 1 , cyanate resin claim 1 , phenol resin claim 1 , novolac resin claim 1 , amine cross-linking agent claim 1 , phenoxy resin claim 1 , benzoxazine resin claim 1 , styrene resin claim 1 , polybutadiene resin claim 1 , polyamide resin claim 1 , polyimide resin claim 1 , and polyester resin.6. The resin composition of claim 1 , further comprising an inorganic filler claim 1 , the inorganic filler being at least one selected from the group consisting of silicon dioxide claim 1 , aluminum oxide claim 1 , aluminum hydroxide claim 1 , magnesium oxide claim 1 , magnesium hydroxide claim 1 , calcium carbonate claim 1 , aluminum nitride claim 1 , boron nitride claim 1 , aluminum silicon carbide claim 1 , silicon carbide claim 1 , sodium ...

RUBBER COMPOSITION, METHOD FOR ITS FORMATION, AND AUTOMOTIVE TIRE CONTAINING THE COMPOSITION

A rubber composition with disperse phase particles containing poly(phenylene ether) can be formed by a method that includes melt blending an uncured rubber with a poly(phenylene ether) composition containing a poly(phenylene ether) and an oil to form an uncured rubber composition, then curing the uncured rubber composition. Before being blended with the rubber, the poly(phenylene ether) composition exhibits a glass transition temperature of about 40 to about 140° C., and during blending with the rubber, the oil component of poly(phenylene ether) composition migrates from the poly(phenylene ether) composition to the rubber, leaving a poly(phenylene ether)-containing disperse phase that gives rise to a second hysteresis peak temperature of about 160 to about 220° C. as measured by dynamic mechanical analysis of the cured rubber composition. Also described are the poly(phenylene ether) composition used in the method, a cured rubber composition formed by the method, and a tire containing the cured rubber composition. 1. A cured rubber composition , comprising:a continuous phase comprising a rubber, anda disperse phase comprising a poly(phenylene ether); [ a rubber comprising ethylenic unsaturation, and', 'a poly(phenylene ether) composition exhibiting a glass transition temperature of about 40 to about 140° C. and comprising a poly(phenylene ether) and an oil, 'melt blending'}, 'to form an uncured rubber composition comprising a continuous phase comprising the rubber containing ethylenic unsaturation and the oil, and a disperse phase comprising the poly(phenylene ether); and', 'curing the uncured rubber composition to form the cured rubber composition;, 'wherein the composition is prepared by a method comprising'}wherein the rubber composition exhibits, by dynamic mechanical analysis, a second hysteresis peak temperature of about 160 to about 220° C.; andwherein the rubber composition exhibits a Graves tear strength value, determined according to ASTM D624-00 (2012) at ...

POLYPHENYLENE ETHER RESIN COMPOSITION, AND A PREPREG AND A COPPER CLAD LAMINATE MADE THEREFROM

The present invention relates to a polyphenylene ether resin composition, and a prepreg and a copper dad laminate made therefrom. The polyphenylene ether resin composition comprises: (A) functionalized polyphenylene ether resin, (B) crosslinking agent, and (C) initiator; the component (A) functionalized polyphenylene ether resin is polyphenylene ether resin that has a number average molecular weight of 500-5000 and unsaturated double bonds at the molecule terminal; the component (B) crosslinking agent is olefin resin with a number average molecular weight of 500-10000, of which styrene structure comprises 10-50 wt %, and of which the molecule comprises 1,2-addition butadiene structure. The polyphenylene ether resin composition of the present invention is a composition of functionalized polyphenylene ether resin with a low molecular weight. The prepreg and copper clad laminate made from the polyphenylene ether resin composition have good dielectric properties and heat resistance. 2. The polyphenylene ether resin composition of claim 1 , wherein the usage amount of the component (A) functionalized polyphenylene ether resin comprises 20-90 wt % of the total amount of the component (A) and component (B) claim 1 , and the usage amount of the component (B) crosslinking agent comprises 10-80 wt % of the total amount of the component (A) and component (B); the content of 1 claim 1 ,2-addition butadiene in the molecule of the olefin resin of the component (B) is not less than 20 wt %; taking the total amount of the component (A) and component (B) as 100 parts by weight claim 1 , the usage amount of the component (C) initiator is 1-5 parts by weight.3. The polyphenylene ether resin composition of claim 2 , wherein the content of 1 claim 2 ,2-addition butadienyl in the molecule of the olefin resin of the component (B) is preferred to be not less than 30 wt % claim 2 , and is further preferred to be not less than 70 wt %.4. The polyphenylene ether resin composition of claim 1 , ...

Phenolic resin molding compound

A phenolic resin molding compound includes (A) a novolac-type phenolic resin including an alkylbenzene-modified novolac-type phenolic resin, (B) a resol-type phenolic resin, (C) hexamethylenetetramine, (D) graphite, and (E) fiber-shaped filler, wherein in regard to the content of each component on the basis of the entirety of the molding compound, a total content of the components (A) to (C) is 30 to 40% by weight, a content of the component (D) is 30 to 50% by weight, and a content of the component (E) is 5 to 20% by weight.

POLY(PHENYLENE ETHER) COMPOSITION AND ARTICLE

A composition includes specific amounts of a poly(phenylene ether), a radial block copolymer, a polystyrene-poly(ethylene-butylene) polystyrene triblock copolymer, an organophosphate ester, a hydrocarbon resin, and benzoin. The composition exhibits a desirable balance of multiaxial impact strength, light transmittance, and optical clarity, and it can be used to mold a variety of articles including animal cages, ink cartridges, tubes, pipes, and pipe fittings. 1. A composition comprising:30 to 60 weight percent of a poly(phenylene ether);10 to 40 weight percent of a radial block copolymer of an alkenyl aromatic monomer comprising styrene and a conjugated diene comprising butadiene; wherein the radial block copolymer comprises 60 to 70 weight percent of poly(alkenyl aromatic) content and has a number average molecular weight of 50,000 to 70,000 atomic mass units;5 to 20 weight percent of a polystyrene-poly(ethylene-butylene)-polystyrene triblock copolymer having a polystyrene content based on the weight of the triblock copolymer of 55 to 80 weight percent;5 to 20 weight percent of an organophosphate ester selected from the group consisting of resorcinol bis(diphenyl phosphate), triphenyl phosphate, alkylated triphenyl phosphate, and combinations thereof;a hydrocarbon resin selected from the group consisting of hydrogenated alicyclic hydrocarbon resins, hydrogenated terpene resins, and combinations thereof; wherein the hydrocarbon resin has a softening point of 120 to 180° C. measured according to ASTM E28; wherein the hydrocarbon resin is present in an amount effective to provide the composition with a multiaxial impact strength of at least 25 joules, measured at 23° C. according to ASTM D3763-08a; and0.05 to 2 weight percent of benzoin;wherein the composition comprises less than 0.5 weight percent tridecyl phosphite;wherein the composition comprises less than or equal to 1 weight percent of fillers; andwherein all weight percents are based on the total weight of the ...

Flame-retardant polymer composition and article

A composition is prepared by melt blending specific amounts of polyamide, acid-functionalized poly(phenylene ether), polyimide-polysiloxane block copolymer, and metal dialkylphosphinate. The composition, which exhibits improved flame retardancy and tensile modulus relative to known blends of poly(phenylene ether), polyamide, and polyimide, is useful for forming electrical components, such as photovoltaic junction boxes and connectors, inverter housings, automotive electrical connectors, electrical relays, and charge couplers.

Phosphorus-containing compound, phosphorus-containing flame retardant, preparation method thereof, and article made therefrom

A phosphorus-containing compound, a phosphorus-containing flame retardant, and a preparation method thereof are provided. Also provided is a resin composition which comprises the phosphorus-containing flame retardant and an unsaturated bond-containing resin. The resin composition may be used to make various articles, such as a prepreg, a resin film, a resin-coated copper, a laminate or a printed circuit board, and achieves improvement in at least one, more or all properties including resin filling property of prepreg, flame retardancy, alkali resistance, glass transition temperature, thermal dimensional stability (ratio of dimensional change under heat), thermal resistance after moisture absorption, peeling strength, dielectric constant and dissipation factor.

STYRYL SILOXY POLYPHENYLENE ETHER RESIN, PREPARATION METHOD THEREFOR AND APPLICATION THEREOF

A styryl siloxy polyphenylene ether resin, a preparation method therefor and an application thereof. The styryl siloxy polyphenylene ether resin is obtained by introducing styryl groups and siloxy groups into polyphenylene end groups by means of a simple synthesis method. The resin combines low dielectric property of curing of styryl groups and heat resistance, weather resistance, flame retardancy, dielectric property, and low water absorption of siloxy groups, thereby making better use of the application advantages of polyphenylene ether resins in copper clad laminates and providing excellent dielectric property, moist-heat resistance and heat resistance required by a high-frequency and high-speed copper clad laminate. 110-. (canceled)15. The preparation method claimed in claim 14 , wherein the dichlorosilane monomer as shown in Formula II and the polyphenylene ether resin as shown in Formula III have a phenol hydroxyl molar ratio of (1-1.5):1.16. The preparation method claimed in claim 14 , wherein the reaction temperature in step (1) ranges from 0° C. to 60° C.;the reaction time in step (1) ranges from 2 h to 24 h.17. The preparation method claimed in claim 14 , wherein in step (1) claim 14 , the dichlorosilane monomer as shown in Formula II is added dropwise into the reaction system comprising the polyphenylene ether resin as shown in Formula III;the temperature of the dropwise addition ranges from 0° C. to 20° C.;the following is to react for 5-10 h at 0-20° C. after dropwise addition of the dichlorosilane monomer as shown in Formula II, and then to heat to 40-60° C. and to react for 1-5 h.18. The preparation method claimed in claim 14 , wherein in step (2) claim 14 , the phenolic monomer with vinyl group as shown in Formula V and Cl group in the modified polyphenylene ether resin as shown in Formula IV have a molar ratio of (0.65-1):1.19. The preparation method claimed in claim 14 , wherein the reaction temperature in step (2) ranges from 0° C. to 60° C.;the ...

PAEK/PPSU/PES Compositions

A composition [composition (C)] comprising from 1 to 90% by weight (wt. %) of at least one poly(aryl ether ketone) [(PAEK) polymer], from 1 to 25 wt. % of at least one polyphenylsulfone polymer [(PPSU) polymer], from 1 to 90 wt. % of at least one polyethersulfone polymer [(PES)polymer], and from 0.1 to 50 wt. % of at least one reinforcing filler, where all wt. % are based on the total weight of the composition (C) and the (PES) polymer has as melt flow rate(MFR) at a temperature of 380° C. and under a load of 2.16 kg according to ASTM D1238 of greater than 35 g/10 min. 115-. (canceled)18. The composition (C) of claim 16 , wherein the (PAEK) polymer is present in an amount ranging from 35 to 75 wt. % claim 16 , based on the total weight of the composition (C).19. The composition (C) of claim 16 , wherein the (PPSU) polymer is present in an amount ranging from 4 to 10 wt. % claim 16 , based on the total weight of the composition (C).21. The composition (C) of claim 16 , wherein the PES polymer is present in an amount ranging from 25 to 70 wt. % claim 16 , based on the total weight of the composition (C).22. The composition (C) of claim 16 , wherein the reinforcing filler is a glass fiber and is present in an amount less than or equal to 40 wt. % claim 16 , based on the total weight of the composition (C).23. The composition of claim 22 , wherein the glass fiber has a circular cross section and an elastic modulus of at least 76 GPa as measured according to ASTM C1557-03.24. The composition of claim 22 , wherein the glass fiber has a non-circular cross section and an elastic modulus of at least 76 GPa as measured according to ASTM C1557-03.25. The composition of claim 16 , wherein the (PAEK) polymer is polyetheretherketone (PEEK).26. The composition of claim 16 , wherein the PES polymer has a melt flow rate (MFR) at a temperature of 380° C. and under a load of 2.16 kg according to ASTM D1238 of greater than or equal to 55 g/10 min.27. The composition of claim 16 , ...

RESIN COMPOSITION, PREPREG, RESIN-INCLUDING FILM, RESIN-INCLUDING METAL FOIL, METAL-CLAD LAMINATE, AND WIRING BOARD

A resin composition is used which contains a maleimide compound represented by the following Formula (1), a modified polyphenylene ether compound of which a terminal is modified with a substituent having a carbon-carbon unsaturated double bond, and a crosslinking agent containing an allyl compound. 2. The resin composition according to claim 1 , wherein the crosslinking agent further includes at least one of a polyfunctional acrylate compound having two or more acryloyl groups in a molecule and a polyfunctional methacrylate compound having two or more methacryloyl groups in a molecule.3. The resin composition according to claim 2 , wherein the polyfunctional methacrylate compound includes a dimethacrylate compound.4. The resin composition according to claim 1 , wherein the allyl compound includes at least one of triallyl isocyanurate and diallyl bisphenol.5. The resin composition according to claim 1 , wherein a content of the maleimide compound is 10 to 60 parts by mass with respect to 100 parts by mass of a total mass of the maleimide compound claim 1 , the modified polyphenylene ether compound claim 1 , and the crosslinking agent.6. The resin composition according to claim 1 , wherein a content of the modified polyphenylene ether compound is 10 to 75 parts by mass with respect to 100 parts by mass of a total mass of the maleimide compound claim 1 , the modified polyphenylene ether compound claim 1 , and the crosslinking agent.7. The resin composition according to claim 1 , further comprising an inorganic filler treated in advance with a silane coupling agent.8. A prepreg comprising:{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'the resin composition according to or a semi-cured product of the resin composition; and'}a fibrous base material.9. A film with resin comprising:{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'a resin layer containing the resin composition according to or a semi-cured product of the resin composition; and'}a support film.10. A ...

Method of forming high molecular weight poly(phenylene ether), poly(phenylene ether) formed thereby, and fiber and article comprising the poly(phenylene ether)

A poly(phenylene ether) can be prepared by a method that includes reacting 2,6-dimethylphenol in the presence of toluene, oxygen, copper ion, bromide ion, and N,N′-di-tert-butylethylenediamine to form a poly(phenylene ether). The mole ratio of 2,6-dimethylphenol to copper ion is 160:1 to 300:1, the mole ratio of N,N′-di-tert-butylethylenediamine to copper ion is 1.5:1 to 3:1, and the mole ratio of atomic oxygen to 2,6-dimethylphenol is 0.9:1 to 1.5:1. The process can produce poly(phenylene ether) having a high molecular weight and a high incorporated amine content.

POLYPHENYL ETHER RESIN COMPOSITION AND PREPREG, LAMINATED BOARD AND PRINTED CIRCUIT BOARD CONTAINING SAME

Provided are a polyphenyl ether resin composition and a prepreg and a laminated board containing same. The polyphenyl ether resin composition comprises the following components: (1) a tetrafunctional or higher multifunctional acrylate-modified thermosetting polyphenyl ether resin; and (2) a vinyl eresin cross-linking agent, the weight of the vinyl resin cross-linking agent being 40-100 parts by weight based on 100 parts by weight of the tetrafunctional or higher multifunctional acrylate-modified thermosetting polyphenyl ether resin. The modified thermosetting polyphenyl ether resin, due to containing a tetrafunctional or higher multifunctional acrylate active group, can cross-link more vinyl resin cross-linking agents. Not only the prepared high-speed electronic circuit substrate has low dielectric constant and dielectric loss, but also double bonds in side chains of the vinyl resin cross-linking agent are reacted completely in a resin curing system, so that the high-speed electronic circuit substrate has a better thermo-oxidative aging resistance. 12. The polyphenyl ether resin composition according to claim 11 , wherein b is an integer from 4 to 6.13. The polyphenyl ether resin composition according to claim 11 , wherein the weight of the vinyl resin crosslinking agent is 50 to 80 parts by weight claim 11 , based on 100 parts by weight of the tetrafunctional or higher multifunctional acrylate group-modified thermosetting polyphenyl ether resin.14. The polyphenyl ether resin composition according to claim 11 , wherein the number average molecular weight of the tetrafunctional or higher multifunctional acrylate group-modified thermosetting polyphenyl ether resin is 500 to 10000 g/mol.15. The polyphenyl ether resin composition according to claim 14 , the vinyl resin crosslinking agent is at least one member selected from a group consisting of a styrene-butadiene copolymer claim 14 , a polybutadiene and a styrene-butadiene-divinylbenzene copolymer.16. The polyphenyl ...

FLAME RETARDANT COMPOUND, METHOD OF MAKING THE SAME, RESIN COMPOSITION AND ARTICLE MADE THEREFROM

A compound has a structure of Formula (I) below, wherein E represents a 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide functional group or a diphenylphosphine oxide functional group. Moreover, a method of making the compound of Formula (I), a resin composition including the compound of Formula (I) and a resin additive and an article made from the resin composition are described. The article includes a prepreg, a resin film, a laminate or a printed circuit board, wherein one or more properties including copper foil peeling strength, Z-axis ratio of thermal expansion, glass transition temperature, flame retardancy, thermal resistance after moisture absorption, dielectric constant, and dissipation factor may be improved. 3. A method of making the compound of claim 1 , comprising: reacting a diphenyldivinylsilane with a 9 claim 1 ,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide or a diphenylphosphine oxide compound.4. The method of claim 3 , wherein a molar ratio of a reactive functional group of the diphenyldivinylsilane to a reactive functional group of the 9 claim 3 ,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide or a reactive functional group of the diphenylphosphine oxide compound is between 1:1 and 1:6.5. A resin composition comprising the compound of Formula (I) as claimed in and a resin additive.6. The resin composition of claim 5 , wherein the resin additive comprises a vinyl-containing resin claim 5 , a styrene maleic anhydride resin claim 5 , an epoxy resin claim 5 , a phenolic resin claim 5 , a benzoxazine resin claim 5 , a cyanate ester resin claim 5 , a polyester resin claim 5 , a polyamide resin claim 5 , a polyimide resin or a combination thereof.7. The resin composition of claim 6 , wherein the vinyl-containing resin comprises a vinyl-containing polyphenylene ether resin claim 6 , a maleimide resin claim 6 , a maleimide triazine resin claim 6 , a polyolefin resin claim 6 , styrene claim 6 , divinylbenzene claim 6 , bis(vinylbenzyl) ether claim 6 ...

THERMALLY CONDUCTIVE THERMOPLASTIC COMPOSITIONS WITH GOOD DIELECTRIC PROPERTY AND THE SHAPED ARTICLE THEREFORE

A polymer composition includes: from about 20 wt. % to about 80 wt. % of a polymer base resin; from about 10 wt. % to about 60 wt. % of a thermally conductive filler; and from about 5 wt. % to about 60 wt. % of a dielectric ceramic filler having a Dk of at least 20 when measured at 1.1 GHz or greater. The polymer composition exhibits a dielectric constant greater than 3.0 at 1.1 GHz when tested using a split post dielectric resonator and network analyzer on a sample size of 120 mm by 120 mm and 6 mm thickness according to ASTM D150. The polymer composition exhibits a dissipation factor of less than 0.002 at 1.1 GHz when tested using a split post dielectric resonator and network analyzer on a sample size of 120 mm by 120 mm and 6 mm thickness according to ASTM D150. 1. A polymer composition comprising:from about 20 wt. % to about 80 wt. % of a polymer base resin;from about 10 wt. % to about 60 wt. % of a thermally conductive filler; andfrom about 5 wt. % to about 60 wt. % of a dielectric ceramic filler having a Dk of at least 20 when measured at 1.1 GHz or greater,wherein the polymer composition exhibits a dielectric constant greater than 3.0 at 1.1 GHz when tested using a split post dielectric resonator and network analyzer on a sample size of 120 mm by 120 mm and 6 mm thickness according to ASTM D150,wherein the polymer composition exhibits a dissipation factor of less than 0.002 at 1.1 GHz when tested using a split post dielectric resonator and network analyzer on a sample size of 120 mm by 120 mm and 6 mm thickness according to ASTM D150, andwherein the combined weight percent value of all components does not exceed about 100 wt. %, and all weight percent values are based on the total weight of the composition.2. The polymer composition of claim 1 , wherein the polymer base resin comprises a polyarylene ether claim 1 , a polypropylene claim 1 , a polystyrene or a combination thereof.3. A polymer composition comprising:from about 20 wt. % to about 80 wt. % of a ...

THERMOPLASTIC COMPOSITIONS HAVING GOOD DIELECTRIC AND DUCTILITY PROPERTIES

A thermoplastic composition includes from 29.9 wt % to 84.9 wt % of a base resin including poly(p-phenylene oxide) (PPO), polystyrene (PS) and an impact modifier; from 15 wt % to 70 wt % of a dielectric filler; and from 0.1 wt % to 10 wt % of an impact promoter including a polycarbonate-siloxane copolymer, a polyolefin-siloxane copolymer, or a combination thereof. The thermoplastic composition has a dielectric constant (Dk) of from 3.0-8.0 between 1 and 5 gigahertz (GHz) and a dissipation factor (Df) of less than 0.003 between 1 and 5 GHz. Articles including the thermoplastic composition, and in particular telecommunications devices, are also described. 2. The thermoplastic composition according to claim 1 , wherein the base resin comprises from 20 wt % to 85 wt % PPO claim 1 , from 10 wt % to 50 wt % PS and from 5 wt % to 30 wt % impact modifier.3. The thermoplastic composition according to claim 1 , wherein the PS comprises general purpose PS claim 1 , high impact PS or a combination thereof.4. The thermoplastic composition according to claim 1 , wherein the impact modifier comprises styrene-ethylene/butylene-styrene (SEBS) claim 1 , syndiotactic polystyrene (SPS) claim 1 , styrene-ethylene-propylene-styrene (SEPS) claim 1 , or a combination thereof.5. The thermoplastic composition according to claim 1 , wherein the dielectric filler comprises a ceramic filler.6. The thermoplastic composition according to claim 5 , wherein the ceramic filler comprises TiO claim 5 , BaTiO claim 5 , or a combination thereof.7. The thermoplastic composition according to claim 1 , wherein the thermoplastic composition comprises from 0.5 wt % to 5 wt % of the impact promoter.8. The thermoplastic composition according to claim 1 , wherein the impact promoter comprises from 40 wt % to 80 wt % siloxane units.9. The thermoplastic composition according to claim 1 , wherein the thermoplastic composition has an improved ductility as compared to that of a substantially identical reference ...

ACRYLIC COMPOSITION FOR ENCAPSULATION, SHEET MATERIAL, LAMINATED SHEET, CURED OBJECT, SEMICONDUCTOR DEVICE, AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE

The acrylic composition for sealing contains an acrylic compound, a polyphenylene ether resin including a radical-polymerizable substituent at a terminal, an inorganic filler, and a thermal radical polymerization initiator. 1. An acrylic composition for sealing , the acrylic composition comprising:an acrylic compound;a polyphenylene ether resin including a radical-polymerizable substituent at a terminal;an inorganic filler; anda thermal radical polymerization initiator.2. The acrylic composition for sealing according to claim 1 , further comprising a nitroxide compound.3. The acrylic composition for sealing according to claim 1 , wherein the radical-polymerizable substituent includes a carbon-carbon double bond.5. A sheet material that is a dried product or a half-cured product of the acrylic composition for sealing according to .6. The sheet material according to claim 5 , having a minimum melt viscosity less than or equal to 200 Pa·s.7. A multilayer sheet comprising:{'claim-ref': {'@idref': 'CLM-00005', 'claim 5'}, 'the sheet material according to ; and'}a support sheet that supports the sheet material.8. A cured product that is a thermally cured product of the acrylic composition for sealing according to .9. The cured product according to claim 8 , having a glass transition temperature more than or equal to 170° C.10. A semiconductor device comprising:a substrate;a semiconductor chip mounted face-down on the substrate; anda sealing material that seals a gap between the substrate and the semiconductor chip,wherein the sealing material is made of the cured product according to claim11. A method for manufacturing a semiconductor device claim 8 , the method comprising:{'claim-ref': {'@idref': 'CLM-00005', 'claim 5'}, 'overlaying the sheet material according to on a surface of a semiconductor wafer including a bump electrode, the surface including the bump electrode;'}cutting the semiconductor wafer together with the sheet material to produce a member, the member ...

RESIN COMPOSITION FOR HIGH FREQUENCY SUBSTRATE AND METAL CLAD LAMINATE

A resin composition for a high frequency substrate and a metal clad laminate are provided. Based on a total weight of the resin composition for the high frequency substrate being 100 phr, the resin composition for the high frequency substrate includes: 20 phr to 70 phr of a polyphenylene ether resin, 5 phr to 40 phr of a polybutadiene resin, 5 phr to 30 phr of a bismaleimide resin, and 20 phr to 45 phr of a crosslinker. A glass transition temperature of the resin composition for the high frequency substrate is higher than or equal to 230° C. The metal clad laminate includes a substrate and a metal layer disposed on the substrate. The substrate is formed from the resin composition for the high frequency substrate. 1. A resin composition for a high frequency substrate , the resin composition , based on a total weight thereof being 100 phr , comprising:20 phr to 70 phr of a polyphenylene ether resin;5 phr to 40 phr of a polybutadiene resin;5 phr to 30 phr of a bismaleimide resin; and20 phr to 45 phr of a crosslinker;wherein a glass transition temperature of the resin composition is higher than or equal to 230° C.2. The resin composition according to claim 1 , wherein claim 1 , based on the total weight of the resin composition being 100 wt % claim 1 , an amount of the polybutadiene resin is smaller than or equal to 25 wt %.3. The resin composition according to claim 1 , wherein the polyphenylene ether resin has at least one modified group claim 1 , and the at least one modified group is selected from the group consisting of: a hydroxyl group claim 1 , an amino group claim 1 , a vinyl group claim 1 , a styryl group claim 1 , a methacrylate group claim 1 , and an epoxy group.4. The resin composition according to claim 1 , wherein the polyphenylene ether resin contains a first polyphenylene ether and a second polyphenylene ether claim 1 , at least one modified group is provided at a molecular end of each of the first polyphenylene ether and the second polyphenylene ether ...

RESIN COMPOSITION, PREPREG, RESIN SHEET, AND METAL FOIL-CLAD LAMINATE

A resin composition has high flame retardancy and excellent heat resistance, peel strength with copper foil, thermal expansion coefficient, heat resistance property upon moisture absorption, and electrical properties, a prepreg and single-layer or laminated sheet, a metal foil-clad laminate using the prepreg, and the like. The resin composition has polyphenylene ether (A) having a number average molecular weight of 500 to 5000, a phosphorus-containing cyanate ester compound (B) represented by formula (13), a cyclophosphazene compound (C), a halogen-free epoxy resin (D), a cyanate ester compound (E) other than the phosphorus-containing cyanate ester compound (B), an oligomer (F) of styrene and/or substituted styrene, and a filler (G), wherein a content of the phosphorus-containing cyanate ester compound (B) is 1 to 10 parts by mass based on 100 parts by mass of a total of the (A) to (F) components. 3. The resin composition according to claim 1 , wherein a content of the cyclophosphazene compound (C) is 10 to 25 parts by mass based on 100 parts by mass of the total of the (A) to (F) components.5. The resin composition according to claim 1 , wherein a content of the polyphenylene ether (A) is 40 to 80 parts by mass based on 100 parts by mass of the total of the (A) to (F) components.6. The resin composition according to claim 1 , wherein the halogen-free epoxy resin (D) is one or more selected from the group consisting of a naphthalene-modified epoxy resin claim 1 , a cresol novolac-based epoxy resin claim 1 , and a bisphenol A-based epoxy resin.7. The resin composition according to claim 1 , wherein a content of the halogen-free epoxy resin (D) is 3 to 20 parts by mass based on 100 parts by mass of the total of the (A) to (F) components.8. The resin composition according to claim 1 , wherein the cyanate ester compound (E) other than the phosphorus-containing cyanate ester compound (B) is one or more selected from the group consisting of a bisphenol A-based cyanate ...

Polyolefin-Arylene-Ether Nanoplatelet Composites

Disclosed is a graft copolymer comprising an arylene-ether oligomer group having at least one polyolefin moiety bound thereto, wherein the arylene-ether oligomer has a number average molecular weight of less than 5,000 g/mole and the polyolefin has Mw of less than 10,000 g/mole. Also disclosed is a method to prepare a graft copolymer comprising reacting a neat or diluted arylene-ether oligomer with a vinyl or vinylidene-terminated polyolefin at a temperature of at least 80 or 100 or 120° C. to form heated reaction components; further reacting a Brφnsted acid or Lewis acid with the heated reaction components to form a polyolefin-arylene-ether oligomer. 1. A graft copolymer (PPE-g-PO) comprising an arylene-ether oligomer group having at least one polyolefin moiety bound thereto , wherein the arylene-ether oligomer has a number average molecular weight (Mn) of less than 5 ,000 g/mole and the polyolefin has Mn of less than 10 ,000 g/mole.2. The graft copolymer of claim 1 , wherein the polyolefin group is a polyolefin selected from the group consisting of polyethylene claim 1 , polypropylene claim 1 , ethylene-propylene copolymer claim 1 , hexene-ethylene copolymer claim 1 , octene-ethylene copolymer claim 1 , and combinations thereof.3. The graft copolymer of claim 1 , wherein the arylene-ether oligomer group has an Mn within a range of from 100 g/mole to 5 claim 1 ,000 g/mole.4. The graft copolymer of claim 1 , wherein the arylene monomer units are linked to one another in the meta position through an oxygen atom.5. The graft copolymer of claim 1 , wherein the polyolefin group has an Mn within a range of from 200 g/mole to 10 claim 1 ,000 g/mole.6. The graft copolymer of claim 1 , further comprising graphite nanoplatelets.7. The graft copolymer of claim 6 , wherein the graphite nanoplatelets have a density within a range from 1 g/cmto 4 g/cmdensity.8. The graft copolymer of claim 6 , wherein the graphite nanoplatelets have an average thickness within a range from 2 to ...

Polyamide/Polyphenylene Ether Resin Composition, and Vehicle Molded Product Prepared Therefrom

The present invention relates to a polyamide/polyphenylene ether resin composition containing: a base resin comprising polyphenylene ether, a polyamide and an impact modifier; a compatibilizer; and a polyamine, and to: a polyamide/polyphenylene ether resin composition having a notched Izod impact strength of about 12 kJ/mor more when measured at 23° C. according to the ISO 180 standard, and a number of checkerboard lattices, in which peeling off occurs, being about 5% or less of the total number of checkerboard lattices in a 1 mm-gap checkerboard pattern test for testing adhesion to acrylic paints and a melamine-based paints according to the JIS K5600-5-6 standard; and a preparation method therefor. 1. A polyamide/polyphenylene ether resin composition comprising: a base resin comprising a polyphenylene ether , a polyamide and an impact modifier; a compatibilizer; and a polyamine ,{'sup': '2', 'the polyamide/polyphenylene ether resin composition having a notched Izod impact strength of about 12 kJ/mor more, as measured at 23° C. in accordance with ISO 180, and allowing about 5% or less of the total number of checkerboard lattices to be peeled off in a 1 mm-gap checkerboard pattern test for testing adhesion to acrylic paints and melamine paints in accordance with JIS K5600-5-6.'}2. The polyamide/polyphenylene ether resin composition according to claim 1 , wherein the polyamide/polyphenylene ether resin composition has a notched Izod impact strength of about 16 kJ/mto about 30 kJ/m claim 1 , as measured at 23° C. in accordance with ISO 180.3. The polyamide/polyphenylene ether resin composition according to claim 1 , wherein the polyamine is present in an amount of about 0.3 parts by weight to about 5 parts by weight relative to 100 parts by weight of the base resin.4. The polyamide/polyphenylene ether resin composition according to claim 1 , wherein the compatibilizer is present in an amount of about 0.1 parts by weight to about 5 parts by weight relative to 100 parts ...

FIRE RETARDANT THERMOPLASTIC RESIN COMPOSITION AND ELECTRIC WIRE COMPRISING THE SAME (As Amended)

Disclosed are a fire retardant thermoplastic resin composition suitable for preparing an electric wire, etc. by enhancing extrudability of a resin composition without hindering fire retardancy of the resin composition, and an electric wire comprising the same. The fire retardant thermoplastic resin composition comprises a matrix resin that comprises 20 to 35% by weight of a poly arylene ether resin, 20 to 35% by weight of a vinyl aromatic resin and 5 to 20% by weight of an olefin-based resin comprising a rubber ingredient, 1 to 10% by weight of a room-temperature liquid-type fire retardant, and 8 to 20% by weight of an ancillary fire retardant, based on 100% by weight of a mixture of a poly arylene ether resin, a vinyl aromatic resin, an olefin-based resin, a room-temperature liquid-type fire retardant and an ancillary fire retardant.

POLYMERIC MATERIALS

A polymeric material has a repeat unit of formula —O-Ph-O-Ph-CO-Ph- I and a repeat unit of formula —O-Ph-Ph-O-Ph-CO-Ph- II wherein Ph represents a phenylene moiety; wherein the repeat units I and II are in the relative molar properties I:II of from 65:35 to 95:5; wherein log(X %)>1.50-0.26 MV; wherein X % refers to the % crystallinity measured as described in Example 31 and MV refers to the melt viscosity measured as described in Example 30. A process for making the polymeric material comprises polycondensing a mixture of at least one dihydroxybenzene compound and at least one dihydroxybiphenyl compound in the molar proportions 65:35 to 95:5 with at least one dihalobenzophenone in the presence of sodium carbonate and potassium carbonate wherein: (i) the mole % of said potassium carbonate is at least 2.5 and/or (ii) the following relationship applies (formula III). 1. A polymeric material having a repeat unit of formula{'br': None, '—O-Ph-O-Ph-CO-Ph-\u2003\u2003I'} {'br': None, '—O-Ph-Ph-O-Ph-CO-Ph-\u2003\u2003II'}, 'and a repeat unit of formula'}wherein Ph represents a phenylene moiety;wherein the repeat units I and II are in the relative molar properties I:II of from 65:35 to 95:5;{'sub': '10', 'wherein log(X %)>1.50−0.26 MV;'}wherein X % refers to the % crystallinity measured as described in Example 31 and MV refers to the melt viscosity measured as described in Example 30.2. A material according to claim 1 , wherein at least 95% of the number of phenylene moieties (Ph) in the repeat unit of formula I have 1 claim 1 ,4-linkages to moieties to which they are bonded; and at least 95% of the number of phenylene moieties (Ph) in the repeat unit of formula II have 1 claim 1 ,4-linkages to moieties to which they are bonded.3. A material according to or claim 1 , wherein log(X %)>1.50−0.23 MV.4. A polymeric material according to any preceding claim claim 1 , wherein log(X %)>1.50−0.28 MV+0.06 MV.5. A material according to any preceding claim claim 1 , which includes 68 ...

Polymers and process for their manufacture

There is disclosed polymers, a process for manufacturing polymers and uses of the polymers. The polymers are polyaryl ether ketones and the process includes a nucleophilic polycondensation of a bisphenol with an organic dihalide compound in a reaction mixture comprising sodium carbonate and potassium carbonate, in an aromatic sulfone solvent, at a reaction temperature rising to a temperature from 290° C. to 320° C. immediately prior to the addition of a salt to the reaction mixture, wherein the molar ratio of the salt to potassium carbonate is from 6.0 to 10.0. Further organic dihalide compound is added to the reaction mixture wherein the molar ratio of further organic dihalide compound to bisphenol is from 0.009 to 0.035. The resulting reaction mixture is maintained at a temperature at from 290° C. to 320° C. for from 20 to 180 minutes and then the resulting reaction mixture is cooled and the PAEK recovered.

METHOD FOR PREPARING Y-BRANCHED HYDROPHILIC POLYMER CARBOXYLIC ACID DERIVATIVE

Disclosed in the present invention is a method for preparing a Y-branched hydrophilic polymer carboxylic acid derivative, in particular a method for preparing a Y-branched polyethylene glycol carboxylic acid derivative having a high purity and high molecular weight. The preparation steps are simple, the product of the reaction is easy to be separated, the cost for separation is low, and the purity and yield of the product are high, facilitating the subsequent preparation of other derivatives and medicament conjugates based on the preparation of the carboxylic acid derivative, which is advantageous for industrial scale-up and commercial applications. The prepared Y-branched hydrophilic polymer carboxylic acid derivative (in particular the Y-branched polyethylene glycol carboxylic acid derivative having a high molecular weight) product has a high purity and high commercial application value, in particular in the use of the preparation of medicaments for preventing and/or treating diseases. 3. The preparation method according to claim 1 , wherein the Y-branched hydrophilic polymer carboxylic acid derivative has a molecular weight of 15 to 50 KDa; and/or{'sub': 'a', 'Pis a residue of one or more copolymers selected from the group consisting of: polyethylene glycol, polypropylene glycol, polyvinyl alcohol, polytetrahydrofuran, polypropylene oxide, polybutylene oxide, polyoxetane and polypropylene morpholine; and/or'}{'sub': 'a', 'Phas a molecular weight of 7.5 to 25 KDa; and/or'}{'sub': 'b', 'Pis a residue of one or more copolymers selected from the group consisting of polyethylene glycol, polypropylene glycol, polyvinyl alcohol, polytetrahydrofuran, polypropylene oxide, polybutylene oxide, polyoxetane and polypropylene morpholine; and/or'}{'sub': 'b', 'Phas a molecular weight of 7.5 to 25 KDa.'}4. The preparation method according to claim 3 , wherein Pis a polyethylene glycol residue having a structure of R—O—(CHCHO)— claim 3 , wherein Ris selected from the group ...

LASER PLATABLE THERMOPLASTIC COMPOSITIONS WITH GOOD FLAME RETARDANCY, HIGH HEAT PROPERTY AND GOOD DUCTILITY AND SHAPED ARTICLES MADE THEREFROM

A thermoplastic composition includes a polyarylene ether component, a flame retardant additive, an impact modifier, and a laser direct structuring additive. The laser platable thermoplastic composition is capable of being plated after being activated using a laser, exhibits a plating index of greater than 0.8 when tested using X-ray fluorescence, and exhibits a heat deflection temperature of greater than 150° C. at 0.45 MPa/3.2 mm when tested in accordance with ASTM D648. In further aspects, the thermoplastic composition may further comprise a laser direct structuring additive synergist comprising a polysiloxane, a polysilane, or a silane. 1. A laser platable thermoplastic composition comprising:a polyarylene ether component;a laser direct structuring additive;a flame retardant additive comprising bisphenol A bis(diphenyl phosphate) (BPADP) or phenoxyphosphazene (PPZ); andan impact modifier comprising a styrene-based copolymer selected from the group consisting of styrene ethylene butylene styrene copolymer (SEBS), styrene butadiene styrene (SBS), styrene ethylene propylene styrene (SEPS) and combinations thereof;wherein the laser platable thermoplastic composition is capable of being plated after being activated using a laser,wherein the laser platable thermoplastic composition exhibits a plating index of greater than 0.8 when tested using X-ray fluorescence, andwherein the laser platable thermoplastic composition exhibits a heat deflection temperature of greater than 150° C. at 0.45 MPa/3.2 mm when tested in accordance with ASTM D648.2. The laser platable thermoplastic composition of claim 1 , further comprising a laser direct structuring synergist.3. The laser platable thermoplastic composition of claim 2 , wherein the laser direct structuring synergist comprises an inorganic filler or a siloxane-based polymer.4. The laser platable thermoplastic composition of claim 1 , wherein the polyarylene ether component comprises a polyarylene ether claim 1 , a polyarylene ...

Thermosetting resin composition, and resin varnish, metal foil with resin, resin film, metal-clad laminate, and printed wiring board using the same

There is provided a thermosetting resin composition including: (A) a modified polyphenylene ether compound which is terminal-modified by using a substituent having a carbon-carbon unsaturated double bond at a molecular terminal; (B) a styrene-butadiene copolymer having a number average molecular weight less than 10,000 and including 1,2 vinyl having cross-linking properties in molecules; (C) a hardening accelerator; and (D) an inorganic filler, in which a compound ratio of (A) component:(B) component is in a range of 80:20 to 20:80.

RESIN COMPOSITION AND USES OF THE SAME

A resin composition is provided. The resin composition comprises the following components: 2. The resin composition of claim 1 , wherein the amount of the organic compound (b) is 10 wt % to 25 wt % based on the total weight of the resin system (a) and the organic compound (b).3. The resin composition of claim 1 , wherein M1 is substituted or unsubstituted methylene claim 1 , 4 claim 1 ,4′-diphenylmethane claim 1 , m-phenylene claim 1 , bisphenol A diphenyl ether claim 1 , 3 claim 1 ,3′-dimethyl-5 claim 1 ,5′-diethyl-4 claim 1 ,4′-diphenyl methane claim 1 , 4-methyl-1 claim 1 ,3-phenylene claim 1 , or (2 claim 1 ,2 claim 1 ,4-trimethyl)hexane.5. The resin composition of claim 1 , wherein the organic compound (b) has an average particle size (D50) ranging from 0.1 μm to 20 μm.6. The resin composition of claim 1 , wherein the resin system (a) further comprises thermal-curable resin(s) selected from the group consisting of polyphenylene ether derivative resins claim 1 , isocyanurates containing vinyl or allyl claim 1 , elastomers containing butadiene and/or styrene and having a functional group claim 1 , epoxy resins claim 1 , and combinations thereof.7. The resin composition of claim 2 , wherein the resin system (a) further comprises thermal-curable resin(s) selected from the group consisting of polyphenylene ether derivative resins claim 2 , isocyanurates containing vinyl or allyl claim 2 , elastomers containing butadiene and/or styrene and having a functional group claim 2 , epoxy resins claim 2 , and combinations thereof.8. The resin composition of claim 3 , wherein the resin system (a) further comprises thermal-curable resin(s) selected from the group consisting of polyphenylene ether derivative resins claim 3 , isocyanurates containing vinyl or allyl claim 3 , elastomers containing butadiene and/or styrene and having a functional group claim 3 , epoxy resins claim 3 , and combinations thereof.9. The resin composition of claim 4 , wherein the resin system (a) ...

POLYPHENYLENE ETHER RESIN, RESIN COMPOSITION INCLUDING THE SAME AND ARTICLE MADE THEREFROM

A polyphenylene ether resin of Formula (1) and a resin composition including the polyphenylene ether resin of Formula (1) are provided. The resin composition is useful for making different articles, including a prepreg, a resin film, a laminate or a printed circuit board, which may achieve excellent multi-layer board thermal resistance and excellent height of impact whitening, in addition to the desirable properties such as fully dissolvable varnish, absence of branch-like pattern or dry board on laminate appearance, high glass transition temperature, low dissipation factor, low Z-axis ratio of thermal expansion and high copper foil peeling strength. 4. The method of claim 3 , wherein:in step 1), a molar ratio of the styrene and/or the styrene derivative to the methyl styrene halide is 20:1 to 1:1;the molar ratio of the bishydroxyl-terminated polyphenylene ether resin in step 2) to the methyl styrene halide in step 1) is 0.5:1 to 5:1; andthe molar ratio of the vinyl-containing halide in step 3) to the bishydroxyl-terminated polyphenylene ether resin in step 2) is 5:1 to 1:1.5. The method of claim 3 , wherein:an initiator, a molecular weight regulator and a solvent are added in step 1);a phase transfer catalyst, a solvent and an alkaline solution are added in step 2);an antioxidant and an alkaline solution are added in step 3); anda reaction temperature of the method is 50-100° C., a reaction time of step 1) is 2-12 hours, and a reaction time of step 2) and step 3) is independently 1-8 hours.6. A resin composition claim 1 , comprising 100 parts by weight of the polyphenylene ether resin of and 10-40 parts by weight of a crosslinking agent.7. The resin composition of claim 6 , wherein the crosslinking agent comprises 1 claim 6 ,2-bis(vinylphenyl)ethane claim 6 , bis(vinylbenzyl)ether claim 6 , divinylbenzene claim 6 , divinylnaphthalene claim 6 , divinylbiphenyl claim 6 , t-butyl styrene claim 6 , triallyl isocyanurate claim 6 , triallyl cyanurate claim 6 , 1 claim 6 ...

PHENYLENE ETHER COPOLYMER AND COMPOSITIONS COMPRISING SAME

A copolymer having the structure (I) wherein Q, Q, Q, Q, m, and n are defined herein. The copolymer can be formed by oxidative copolymerization of 2,4,6-trimethyIresorcinoI with a monohydric phenol. Also describes are a composition comprising the copolymer and a solvent, and a composition comprising the copolymer and a thermosetting resin. 2. The copolymer of claim 1 , wherein the sum of m and n is 3 to 15.3. The polymer of claim 1 , wherein each occurrence of Qand Qis independently hydrogen claim 1 , methyl claim 1 , N claim 1 ,N-diethylaminomethyl claim 1 , N-ethylaminomethyl claim 1 , and phenyl claim 1 , provided that at least one of Qand Qis not hydrogen; each occurrence of Qis hydrogen; and each occurrence of Qis hydrogen claim 1 , methyl claim 1 , or phenyl.4. The copolymer of claim 1 , wherein each occurrence of Qand Qis independently methyl or N claim 1 ,N-diethylaminomethyl or N-ethylaminomethyl; and each occurrence of Qand Qis hydrogen.5. The copolymer of claim 1 , wherein m and n are each claim 1 , on average claim 1 , greater than zero.6. The copolymer of claim 1 , whereinthe sum of m and n is 3 to 15;{'sup': 1', '2, 'each occurrence of Qand Qis methyl or N,N-diethylaminomethyl or N-ethylaminomethyl; and'}{'sup': 3', '4, 'each occurrence of Qand Qis hydrogen.'}7. A composition comprising:{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'the copolymer of ; and'}{'sub': 3', '8', '3', '8', '4', '16', '6', '12', '1', '3', '3', '6', '2', '6', '2', '6, 'a solvent selected from the group consisting of C-Cketones, C-CN,N-dialkylamides, C-Cdialkyl ethers, C-Caromatic hydrocarbons, C-Cchlorinated hydrocarbons, C-Calkyl alkanoates, C-Calkyl cyanides, C-Cdialkyl sulfoxides, and mixtures thereof.'}8. The composition of comprising claim 7 , based on the total weight of the composition claim 7 ,10 to 50 weight percent of the copolymer; and50 to 90 weight percent of the solvent.9. The composition of comprising claim 7 , based on the total weight of the composition ...

BLENDS OF AROMATIC POLYMERS AND ADDUCTS OBTAINED THEREFROM

The present invention relates to polymers and blends of polymers comprising anthracene moieties able to undergo a cycloaddition reaction under certain stimuli, thereby forming polymer adducts endowed with improved or additional properties with respect to those of the starting polymers. 3. The blend of claim 2 , wherein T is selected from the group consisting of a bond claim 2 , —SO— and —C(CH)—.4. The blend of any one of - claim 2 , wherein at least one of the PAES polymers (P1) and/or (P2) comprises at least 50 mol. % (based on the total number of moles in the PAES polymer) of recurring units (R) of formula (L).6. The blend of claim 1 , comprising at least one polymer (P1) and at least one polymer (P2).8. A polymer adduct obtained by heating at a temperature ranging from 60° C. to 250° C. claim 1 , preferably from 65° C. to 200° C. claim 1 , the blend of any one of to .12. A method for recycling a coating or a formed article claim 7 , comprising the polymer adduct of claim 7 , by submitting the coating or formed article to heating at a temperature ranging from 100° C. to 500° C.13. A recycled material obtainable by the method of or . This application claims priority to U.S. provisional application No. 62/468,187—filed on Mar. 7, 2017, and to European application No. 17165733.1—filed on Apr. 10, 2017, the whole content of each of these applications being incorporated herein by reference for all purposes.The present invention relates to polymers and blends of polymers comprising anthracene moieties able to undergo a cycloaddition reaction under certain stimuli, thereby forming polymer adducts endowed with improved or additional properties with respect to those of the starting polymers.Stimuli-responsive polymers, also called smart polymers, are defined as polymers which can change their properties under specific conditions, for example humidity, pH, UV light or heat. Stimuli-responsive polymers are for example used in drug delivery. As an example, conformational ...

MAGNETIC COMPOUND, ANTENNA, AND ELECTRONIC DEVICE

An object of the present invention is to provide a magnetic compound excellent in high-frequency property and excellent in mechanical strength and related materials thereof by using at least one of resins selected from syndiotactic polystyrene (SPS) resin and modified polyphenylene ether (m-PPE) resin, including at least one of resins selected from syndiotactic polystyrene (SPS) resin and modified polyphenylene ether (m-PPE) resin, wherein content of the resin is 21 mass % or more. 1. A magnetic compound , comprising:a metal magnetic powder; andone or more resins selected from syndiotactic polystyrene (SPS) resin and modified polyphenylene ether (m-PPE) resin,wherein the metal magnetic powder is coated with one or more coating substances selected from dicarboxylic acid, dicarboxylic acid anhydride and a derivative thereof so that a part or the whole part of a surface of the metal magnetic powder is coated, andcontent of the resin is 21 mass % or more.2. A magnetic compound , comprising:a metal magnetic powder; anda resin,wherein the resin is one or more resins selected from syndiotactic polystyrene (SPS) resin and modified polyphenylene ether (m-PPE) resin, andthe metal magnetic powder is coated with one or more coating substances selected from dicarboxylic acid, dicarboxylic acid anhydride and a derivative thereof so that a part or the whole part of a surface of the metal magnetic powder is coated.3. A magnetic compound , comprising:a metal magnetic powder; andone or more resins selected from syndiotactic polystyrene (SPS) resin and modified polyphenylene ether (m-PPE) resin,wherein the metal magnetic powder is coated with one or more coating substances selected from dicarboxylic acid, dicarboxylic acid anhydride and a derivative thereof in a coating step, andcontent of the resin is 21 mass % or more.4. A magnetic compound , comprising:a metal magnetic powder; anda resin,wherein the resin is one or more resins selected from syndiotactic polystyrene (SPS) resin and ...

Resin composition, and prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board each obtained using said resin composition

A resin composition is provided and contains (A) a thermosetting compound having a styrene structure or a (meth)acrylate structure, and (B) a maleimide compound represented by the following formula (1) (in the formula, p represents an integer of 1 to 10), in which the content ratio of the component (A) to the component (B) is (A):(B)=20:80 to 90:10 in mass ratio.

Resin composition, prepreg including the same, laminated plate including the same, resin-coated metal foil including the same

The present invention relates to a resin composition including a binder resin and an organic-inorganic composite filler, a prepreg including the same, a laminated plate including the same, and a resin-coated metal foil including the same.

RESIN COMPOSITION AND ARTICLE MADE THEREFROM

A resin composition comprises: an unsaturated bond-containing polyphenylene ether resin; a maleimide resin of Formula (1); and a compound of Formula (2) or Formula (3). The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following improvements can be achieved, including prepreg viscosity variation ratio, stickiness resistance, amount of void after lamination, multi-layer board thermal resistance, glass transition temperature, ratio of thermal expansion, copper foil peeling strength and dissipation factor. 2. The resin composition of claim 1 , comprising:20 to 150 parts by weight of the unsaturated bond-containing polyphenylene ether resin;5 to 40 parts by weight of the maleimide resin of Formula (1); and0.001 to 5 parts by weight of the compound of Formula (2) or Formula (3).3. The resin composition of claim 1 , wherein the unsaturated bond-containing polyphenylene ether resin comprises a vinylbenzyl-containing polyphenylene ether resin claim 1 , a methacrylate-containing polyphenylene ether resin claim 1 , an allyl-containing polyphenylene ether resin claim 1 , a vinylbenzyl-modified bisphenol A polyphenylene ether resin claim 1 , a chain-extended vinyl-containing polyphenylene ether resin or a combination thereof.7. The resin composition of claim 1 , further comprising: an epoxy resin claim 1 , a cyanate ester resin claim 1 , a small molecule vinyl compound claim 1 , an acrylate claim 1 , a phenolic resin claim 1 , a benzoxazine resin claim 1 , a styrene maleic anhydride claim 1 , a polyolefin claim 1 , a polyester resin claim 1 , an amine curing agent claim 1 , a polyamide resin claim 1 , a polyimide resin or a combination thereof.8. The resin composition of claim 1 , further comprising: flame retardant claim 1 , inorganic filler claim 1 , curing accelerator claim 1 , solvent claim 1 , silane coupling agent claim 1 , coloring agent claim 1 , toughening agent or ...

RESIN COMPOSITION, KIT, METHOD FOR MANUFACTURING RESIN COMPOSITION, METHOD FOR MANUFACTURING FORMED ARTICLE, AND FORMED ARTICLE

To provide a resin composition having large light transmittance and capable of providing a molded article which is highly laser-weldable to an absorbing resin member, as well as a kit, a method for manufacturing the resin composition, a method for manufacturing a formed article, and a formed article. The resin composition contains a polyamide resin, a maleic anhydride-modified polyphenylene ether-based resin, a phosphazene-based flame retardant, a zinc metal oxide, and a light transmitting dye. 113.-. (canceled)14. A resin composition comprising a polyamide resin , a maleic anhydride-modified polyphenylene ether-based resin , a phosphazene-based flame retardant , a zinc metal oxide , and a light transmitting dye.15. The resin composition of claim 14 , demonstrating a transmittance of 40% or larger claim 14 , when formed into a 1-mm thick specimen and measured at a wavelength of 1070 nm in compliance with ISO 13468-2.16. The resin composition of claim 14 , wherein the polyamide resin contains a semi-aromatic polyamide resin.17. The resin composition of claim 14 , wherein the polyamide resin contains a polyamide resin contains a structural unit derive from a diamine and a structural unit derive from a dicarboxylic acid claim 14 , 50 mol % or more of the structural unit derive from a diamine being derived from xylylenediamine claim 14 , and 50 mol % or more of the structural unit derive from a dicarboxylic acid being derived from a straight-chain aliphatic α claim 14 ,ω-dicarboxylic acid having 4 to 20 carbon atoms.18. The resin composition of claim 14 , wherein the zinc metal oxide contains zinc borate.19. The resin composition of claim 14 , further comprising a glass fiber.20. The resin composition of claim 15 , wherein the polyamide resin contains a polyamide resin contains a structural unit derive from a diamine and a structural unit derive from a dicarboxylic acid claim 15 , 50 mol % or more of the structural unit derive from a diamine being derived from ...

FLEXIBLE WHITE REFLECTIVE DIELECTRIC FOR ELECTRONIC CIRCUITS

This invention is directed to a polymer thick film white reflective flexible dielectric composition comprising urethane resin, thermoplastic phenoxy resin, and white reflective powder. Dielectrics made from the composition can be used in various electronic applications to protect electrical elements and particularly to reflect light in 3D circuits containing LED's. 2. The polymer thick film white reflective flexible dielectric composition of claim 1 , wherein said urethane resin is a urethane elastomer or a polyester-based copolymer.3. The polymer thick film white reflective flexible dielectric composition of claim 2 , wherein said urethane resin is a polyester-based copolymer.4. The polymer thick film white reflective flexible dielectric composition of claim 1 , wherein said white reflective powder is selected from the group consisting of titanium dioxide claim 1 , barium titanate claim 1 , alumina claim 1 , or mixtures thereof.5. The polymer thick film white reflective flexible dielectric composition of claim 4 , wherein said white reflective powder is titanium dioxide.7. A polymer thick film white reflective flexible dielectric composition comprising:(a) urethane resin;(b) thermoplastic phenoxy resin; and(c) white reflective powder.8. The polymer thick film white reflective flexible dielectric composition of claim 7 , wherein said thermoplastic urethane resin is a urethane elastomer or a polyester-based copolymer.9. The polymer thick film white reflective flexible dielectric composition of claim 8 , wherein said thermoplastic urethane resin is a polyester-based copolymer.10. A circuit comprising a substrate and a polymer thick film white reflective flexible dielectric formed from the polymer thick film white reflective flexible dielectric composition of claim 1 , wherein said circuit is fabricated on a polyimide-based substrate and wherein said urethane resin and said thermoplastic phenoxy resin remain as an integral part of said polymer thick film white ...

AMPHIPHILIC BLOCK COPOLYMER; COMPOSITION, MEMBRANE, AND SEPARATION MODULE THEREOF; AND METHODS OF MAKING SAME

An amphiphilic block copolymer comprises a poly(phenylene ether) block or a poly(phenylene ether) copolymer block and a hydrophilic block or graft. A method of making the amphiphilic block copolymer comprises polymerization of a hydrophilic ethylenically unsaturated monomer in the presence of poly(phenylene ether) or a poly(phenylene ether) copolymer to make the amphiphilic block copolymer. A porous asymmetric membrane comprises a poly(phenylene ether) or poly(phenylene ether) copolymer, and the amphiphilic block copolymer comprising a poly(phenylene ether) block or a poly(phenylene ether) copolymer block, and a hydrophilic block or graft. The porous asymmetric membrane is made by phase-inversion of a dope solution of the poly(phenylene ether) or poly(phenylene ether) copolymer and the amphiphilic block copolymer in a coagulation bath. 1. An amphiphilic block copolymer , comprisinga hydrophobic block comprising, consisting essentially of, or consisting of a poly(phenylene ether) block or a poly(phenylene ether) copolymer block; anda hydrophilic block or graft.2. The amphiphilic block copolymer of claim 1 , comprising 20 to 50 weight percent of the hydrophobic block and 50 to 80 weight percent of the hydrophilic block or graft.5. The amphiphilic block copolymer of claim 1 , wherein the hydrophobic block of the amphiphilic copolymer comprises a poly(phenylene ether) copolymer comprising:80 to 20 mole percent repeat units derived from 2,6-dimethylphenol; and20 to 80 mole percent repeat units derived from the second monohydric phenol.6. The amphiphilic block copolymer of claim 5 , wherein the second monohydric phenol comprises 2-methyl-6-phenylphenol.7. The amphiphilic block copolymer of claim 1 , wherein the hydrophilic block or graft comprises a polymerized hydrophilic ethylenically unsaturated monomer.8. The amphiphilic block copolymer of claim 7 , wherein the hydrophilic ethylenically unsaturated monomer comprises methoxy-capped poly(ethylene oxide) methacrylate ...

RESIN COMPOSITION AND PRE-PREG AND LAMINATE USING THE COMPOSITION

Provided in the present invention are a resin composition and a pre-preg and a laminate using the composition. The resin composition comprises: (A) a prepolymer of a polyolefin resin and a bifunctional maleimide or a multifunctional maleimide; and, (B) vinyl thermosetting polyphenylene ether, where with the weight of the prepolymer of the polyolefin resin and the bifunctional maleimide or the multifunctional maleimide being 100 parts by weight, the weight of the vinyl thermosetting polyphenylene ether is 200 to 1000 parts by weight. The present invention, by employing the prepolymer of the polyolefin resin and the bifunctional maleimide or the multifunctional maleimide, solves the problem of incompatibility of the bifunctional maleimide or the multifunctional maleimide with the polyolefin resin and vinyl thermosetting polyphenylene ether. An aqueous glue solution so mixed is uniform and consistent, the pre-preg has a uniform expression, and a substrate resin area is free of a phase-separation problem. 110.-. (canceled)11. A resin composition , comprising:(A) a prepolymer of polyolefin resin and bifunctional maleimide or polyfunctional maleimide; and(B) a vinyl thermosetting polyphenylene ether;wherein, based on 100 parts by weight of the prepolymer of polyolefin resin and bifunctional maleimide or polyfunctional maleimide, the weight of the vinyl thermosetting polyphenylene ether is 200 to 1000 parts by weight.12. The resin composition of claim 11 , wherein the polyolefin resin comprises at least one member selected from the group consisting of a styrene-butadiene copolymer claim 11 , a polybutadiene copolymer claim 11 , and styrene-butadiene-divinylbenzene copolymer.13. The resin composition of claim 11 , wherein the polyolefin resin comprises at least one member selected from the group consisting of amino-modified claim 11 , maleic anhydride-modified claim 11 , epoxy-modified claim 11 , acrylate-modified claim 11 , hydroxy-modified or carboxy-modified styrene- ...

RESIN COMPOSITION AND PRE-PREG AND LAMINATE USING THE COMPOSITION

The present invention relates to the technical field of copper clad laminates and relates to a resin composition and a pre-preg and a laminate using the composition. The resin composition comprises: (A) a prepolymer of vinyl thermosetting polyphenylene ether and a bifunctional maleimide or a multifunctional maleimide; and, (B) a polyolefin resin. The present invention, by employing the prepolymer of vinyl thermosetting polyphenylene ether and the bifunctional maleimide or the multifunctional maleimide, solves the problem of incompatibility of the bifunctional maleimide or the multifunctional maleimide with the vinyl thermosetting polyphenylene ether and the polyolefin resin. An aqueous glue solution so mixed is uniform and consistent, the prepreg has a uniform expression, and a substrate resin area is free of a phase-separation problem. In addition, the maleimide employed is either the bifunctional maleimide or the multifunctional maleimide, relative to a monofunctional maleimide, a substrate so prepared is provided with increased heat resistance, a reduced thermal expansion coefficient, extended thermal stratification time, and increased thermal decomposition temperature. 110.-. (canceled)11. A resin composition , comprising:(A) a prepolymer of vinyl thermosetting polyphenylene ether and bifunctional maleimide or polyfunctional maleimide; and(B) a polyolefin resin.12. The resin composition of claim 11 , wherein the weight of the bifunctional maleimide or polyfunctional maleimide is 5 to 20 parts by weight claim 11 , based on 100 parts by weight of the vinyl thermosetting polyphenylene ether.13. The resin composition of claim 11 , wherein the weight of the polyolefin resin is 5 to 100 parts by weight claim 11 , based on 100 parts by weight of the prepolymer of vinyl thermosetting polyphenylene ether and bifunctional maleimide or polyfunctional maleimide.15. The resin composition of claim 11 , wherein the vinyl thermosetting polyphenylene ether has a number average ...

Prepreg and laminated board

To provide a prepreg that achieves a low dielectric loss tangent, despite the use of a polar solvent. A prepreg produced by impregnating or coating a base material with a varnish comprising an inorganic filler, a polar solvent, and a resin composition principally comprising polyphenylene ether, and subjecting the base material treated to a drying step, wherein the polar solvent content of the prepreg is 3 mass % or less, and a dielectric loss tangent at 10 GHz of a laminated board produced using this prepreg is 0.001-0.007.

GLASS FLAKES AND RESIN COMPOSITION

Glass flakes of the present invention include glass flake substrates and a coating covering at least a portion of the surface of each of the glass flake substrates and composed of a binder. The binder includes a lubricant other than silicone, or a lubricant and an aminosilane. The proportion of the lubricant in the binder is 30 mass % or less. 1. Glass flakes comprising:glass flake substrates; anda coating covering at least a portion of the surface of each of the glass flake substrates and composed of a binder, whereinthe binder comprises a lubricant other than silicone, or a lubricant and an aminosilane, andthe proportion of the lubricant in the binder is 30 mass % or less.2. The glass flakes according to claim 1 , whereinthe binder comprises the lubricant other than silicone, andthe lubricant comprises at least one selected from the group consisting of a fatty acid-polyethylene polyamine condensate, polyethyleneimine polyamide, and paraffin.3. The glass flakes according to claim 1 , whereinthe binder comprises the lubricant and the aminosilane, andthe lubricant comprises at least one selected from the group consisting of a fatty acid-polyethylene polyamine condensate, polyethyleneimine polyamide, paraffin, and silicone.4. The glass flakes according to claim 1 , wherein the proportion of the lubricant in the binder is 1 mass % or more and 30 mass % or less.5. The glass flakes according to claim 1 , wherein the glass flake substrates have an average thickness of 0.1 to 7 μm and an average particle diameter of 10 to 2000 μm.6. The glass flakes according to claim 5 , wherein the glass flake substrates have an average thickness of 0.1 to 2 μm and an average particle diameter of 10 to 2000 μm.7. A resin composition comprising:{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'the glass flakes according to ; and'}a matrix resin.8. The resin composition according to claim 7 , wherein the matrix resin comprises a polyamide.9. The resin composition according to claim 8 , ...

ELECTROPHOTOGRAPHIC MEMBER, ELECTROPHOTOGRAPHIC PROCESS CARTRIDGE, AND ELECTROPHOTOGRAPHIC IMAGE FORMING APPARATUS

Provided is an electrophotographic member in which density unevenness of an image is less likely to occur even in the case of outputting an image after standing in a high-temperature and high-humidity environment for a long period of time. The electrophotographic member includes: an electroconductive substrate; an electroconductive elastic layer on or above the substrate; and an insulating portion on the elastic layer, an outer surface of the electrophotographic member being composed of an outer surface of the insulating portion and an outer surface of the elastic layer that is not covered with the insulating portion, wherein the elastic layer contains a urethane resin as a first resin, and the elastic layer has a region from the outer surface of the elastic layer constituting the outer surface of the electrophotographic member to a depth of 1 μm, the region further containing a second resin. 1. An electrophotographic member comprising:an electroconductive substrate;an electroconductive elastic layer on or above the substrate; andan insulating portion on the elastic layer,an outer surface of the electrophotographic member being composed of an outer surface of the insulating portion and an outer surface of the elastic layer that is not covered with the insulating portion, whereinthe elastic layer contains a urethane resin as a first resin, andthe elastic layer has a region from the outer surface of the elastic layer constituting the outer surface of the electrophotographic member to a depth of 1 μm, the region further containing a second resin selected from the group consisting of a polyallyl resin, a vinyl resin, an acrylic resin, and a methacrylic resin.2. The electrophotographic member according to claim 1 , wherein the elastic layer further contains the second resin in a region from the outer surface of the elastic layer covered with the insulating portion to the depth of 1 μm.5. The electrophotographic member according to claim 4 , wherein the linking group R22 ...

FLAME-RETARDANT POLYPHENYLENE ETHER RESIN COMPOSITION HAVING HIGH RIGIDITY AND HIGH IMPACT STRENGTH

Disclosed is a flame-retardant polyphenylene ether resin composition having high rigidity and high impact strength. More particularly, disclosed is a flame-retardant polyphenylene ether resin composition having high rigidity and high impact strength which enhances environmental stress cracking resistance and impact resistance, compared to general materials, while exhibiting superior mechanical strength such as flame retardancy, tensile strength, flexural strength, flexural modulus, etc. through addition of particularly glass fiber, maleic anhydride-grafted polyphenylene ether, a thermoplastic styrenic elastomer, an ethylene terpolymer and an epoxy resin to a polyphenylene ether resin, and thus, may be used as a material of automobile battery cell modules or electric/electronic components. 1. A flame-retardant polyphenylene ether resin composition comprising:20 to 50% by weight of polyphenylene ether;4 to10% by weight of maleic anhydride-grafted polyphenylene ether;10 to 40% by weight of a rubber-modified polystyrene resin;1 to 5% by weight of a thermoplastic styrenic elastomer;1 to 5% by weight of an ethylene terpolymer in which ethylene, methyl acrylate and glycidyl methacrylate are copolymerized; and5 to 20% by weight of glass fiber.2. The flame-retardant polyphenylene ether resin composition according to claim 1 , wherein the maleic anhydride-grafted polyphenylene ether is grafted with 0.3 to 1% by weight of maleic anhydride.3. The flame-retardant polyphenylene ether resin composition according to claim 1 , wherein the rubber-modified polystyrene resin is a copolymer of a monomer copolymerizable with a styrene-based monomer and the styrene-based monomer or a styrene-based graft copolymer.4. The flame-retardant polyphenylene ether resin composition according to claim 3 , wherein the styrene-based monomer is one or more selected from the group consisting of styrene claim 3 , α-methylstyrene and p-methylstyrene claim 3 , and a monomer copolymerizable with the ...

Graft Copolymers for Dispersing Graphene and Graphite

Disclosed herein are graft copolymer nanofiller dispersants comprising a polyaromatic hydrocarbon backbone and polyaliphatic hydrocarbon comb arms and methods for making same. Also disclosed are elastomeric nanocomposite compositions comprising a halobutyl rubber matrix nanoparticles of graphite or graphene, and the graft copolymer nanofiller dispersant. Such elastomeric nanocomposite compositions are useful tire innerliners or innertubes.

Prepreg comprising polyphenylene ether particles

Provided is a prepreg suffering little resin particle fall-off and little resin peeling during prepreg production and during handling in order to have excellent dielectric properties for PPE and favorable adhesiveness. A PPE-containing prepreg constituted of a base material and a curable resin composition including PPE particles, wherein the prepreg is characterized in that (1) PPE extracted from the prepreg using a mixed solvent of toluene and methanol in a mass ratio of 95:5 includes PPE particles (A) insoluble in the mixed solvent, (2) the amount of PPE contained in the PPE particles (A) is 70 mass % or higher, and (3) the number-average molecular weight of the PPE contained in the PPE particles (A) is 8,000-40,000.

RESIN COMPOSITION AND MOLDED ARTICLE

A resin composition contains: 60 to 95% by mass of polyphenylene ether (A); 35 to 0% by mass of styrene-based resin (B); and 15 to 5% by mass of elastomer component (C). The component (C) is present as dispersion particles in the resin composition. The dispersion particles have a number average particle size of 0.04 to 0.25 μm. 1. (canceled)2. A resin composition comprising:60 to 95% by mass of polyphenylene ether (A);35 to 0% by mass of styrene-based resin (B); and15 to 5% by mass of elastomer component (C),wherein the elastomer component (C) is present as dispersion particles in the resin composition; and{'sup': '2', 'the dispersion particles have a number average particle size of 0.04 to 0.25 μm; and the dispersion particles having a particle size of greater than 1.0 μm are not present and the number of the dispersion particles having a particle size of 0.5 to 1.0 μm is 3 or less in an area corresponding to 396 μmas measured by transmission electron microscopy.'}3. The resin composition according to claim 2 , wherein the elastomer component (C) comprises an oil-extended styrene block-hydrogenated conjugated diene compound block copolymer.4. The resin composition according to claim 2 , wherein the elastomer component (C) comprises an oil-extended styrene block-hydrogenated conjugated diene compound block copolymer having an oil-extended amount of 20 to 50% by mass.5. The resin composition according to claim 3 , wherein the elastomer component (C) comprises the oil-extended styrene block-hydrogenated conjugated diene compound block copolymer having an oil-extended amount of 20 to 50% by mass and an olefin-based elastomer in a mass ratio of (the oil-extended styrene block-hydrogenated conjugated diene compound block copolymer having an oil-extended amount of 20 to 50% by mass:the olefin-based elastomer)=9:1 to 3:7.6. The resin composition according to claim 3 , wherein the resin composition comprises 15 to 100 parts by mass of an oil based on 100 parts by mass of ...

Resin composition, and prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board each obtained using said resin composition

One aspect of the present invention relates to a resin composition containing (A) a thermosetting compound having a styrene structure or a (meth)acrylate structure, and (B) at least one of maleimide compounds represented by the formulas (1) to (3).

Silane-modified polyphenylene ether resin and preparation method thereof

A silane-modified polyphenylene ether resin and a preparation method thereof are provided. A polyphenylene ether resin having hydroxyl groups at both ends is reacted with a silane having at least one alkoxy group and at least one vinyl group at the end, so as to obtain the silane-modified polyphenylene ether resin with a vinyl group at the end.

RESIN COMPOSITION, PREPREG, METAL-CLAD LAMINATED PLATE, AND WIRING BOARD

A resin composition of the present disclosure contains an ingredient (A) that is a polyphenylene ether whose hydroxyl group bonded to a terminal of a main chain is modified with an ethylenically unsaturated compound, an ingredient (B) that is an olefin resin containing a hydroxyl group or carboxyl group, an ingredient (C) that is at least one kind selected from among triallyl isocyanurate and triallyl cyanurate, and an ingredient (D) that is an organic peroxide. 1. A resin composition comprising:an ingredient (A) that is a polyphenylene ether whose hydroxyl group bonded to a terminal of a main chain is modified with an ethylenically unsaturated compound;an ingredient (B) that is an olefin resin having a hydroxyl group or a carboxyl group;an ingredient (C) that is at least one kind of triallyl isocyanurate and triallyl cyanurate; andan ingredient (D) that is an organic peroxide.2. The resin composition according to claim 1 , wherein the ingredient (B) is contained in an amount of 2.0-20% by mass when a total amount of the ingredient (A) claim 1 , the ingredient (B) claim 1 , the ingredient (C) claim 1 , and the ingredient (D) ((A)+(B)+(C)+(D)) is 100% by mass.3. The resin composition according to claim 1 , wherein the ingredient (A) is contained in an amount of 19.9-88% by mass when a total amount of the ingredient (A) claim 1 , the ingredient (B) claim 1 , the ingredient (C) claim 1 , and the ingredient (D) ((A)+(B)+(C)+(D)) is 100% by mass.4. The resin composition according to claim 1 , further comprising silica.5. A prepreg comprising:{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'a resin composition according to ; and'}a base material.6. A metal-clad laminated plate comprising a conductive metal foil on a surface of a prepreg according to .7. The metal-clad laminated plate according to claim 6 , wherein a resin composition in the prepreg comprises a crosslinked product of the ingredient (A) claim 6 , the ingredient (B) claim 6 , the ingredient (C) claim 6 , ...

POLYPHENYLENE ETHER DERIVATIVE HAVING N-SUBSTITUTED MALEIMIDE GROUP, AND HEAT CURABLE RESIN COMPOSITION, RESIN VARNISH, PREPREG, METAL-CLAD LAMINATE, AND MULTILAYER PRINTED WIRING BOARD USING SAME

A polyphenylene ether derivative having at least one N-substituted maleimide group represented by the following general formula (I) in a molecule, and a heat curable resin composition, a prepreg, a metal-clad laminate, and a multilayer printed wiring board, each of which uses the polyphenylene ether derivative: 3. A heat curable resin composition comprising the polyphenylene ether derivative (A) according to and a thermosetting resin (B).4. The heat curable resin composition according to claim 3 , wherein the polyphenylene ether derivative (A) has a number average molecular weight of 5 claim 3 ,000 to 12 claim 3 ,000.5. The heat curable resin composition according to claim 3 , wherein the thermosetting resin (B) is at least one selected from the group consisting of an epoxy resin claim 3 , a cyanate ester resin claim 3 , and a maleimide compound.7. The heat curable resin composition according to claim 3 , wherein the ratio of the polyphenylene ether derivative (A) and thermosetting resin (B) contained is in the range of: (A):(B)=(5 to 80% by mass):(95 to 20% by mass).8. The heat curable resin composition according to claim 3 , which further comprises an inorganic filler (C).9. The heat curable resin composition according to claim 3 , which further comprises a flame retardant (D).10. The heat curable resin composition according to claim 3 , which further comprises a curing accelerator (E).11. The heat curable resin composition according to claim 3 , which further comprises a phenolic antioxidant (F).12. The heat curable resin composition according to claim 3 , wherein the resin composition after being cured has a glass transition temperature of 200° C. or higher.13. A resin varnish obtained using the heat curable resin composition according to and an organic solvent.14. A prepreg obtained using the resin varnish according to .15. A laminate obtained using the prepreg according to .16. A multilayer printed wiring board formed using the prepreg according to . The ...

POLYMER COMPOSITE MATERIAL COMPRISING ARAMID NANOFIBER, AND METHOD FOR PREPARING SAME

The present invention relates to a polymer composite material comprising an aramid nanofiber (ANF), and a method for preparing same. More specifically, the present invention relates to an arylene ether-based polymer or arylene ether imide-based polymer composite material which is obtained by mixing an arylene ether-based polymer or an arylene ether imide-based polymer with aramid nanofibers dispersed in a polar aprotic solution or by adding and polymerizing monomers in the dispersion of aramid nanofibers. 1. A method of producing a polymer composite material selected from:a solution blending method including adding an arylene ether-based polymer or an arylene ether imide-based polymer to a nanofiber dispersion in which an aramid nanofiber is dispersed in a polar aprotic solvent and dissolving the polymer therein; oran in-situ method including mixing a monomer for preparing an arylene ether-based polymer or an arylene ether imide-based polymer with a nanofiber dispersion in which an aramid nanofiber is dispersed in a polar aprotic solvent and performing polymerization.5. The method of producing a polymer composite material of claim 1 , wherein the polar aprotic solvent is any one or a mixture of two or more selected from the group consisting of dimethyl sulfoxide claim 1 , dimethylacetamide claim 1 , dimethylformamide claim 1 , methylpyrrolidone claim 1 , sulfolane claim 1 , and N-cyclohexyl-2-pyrrolidone.6. The method of producing a polymer composite material of claim 1 , wherein the aramid nanofiber has an average diameter of 3 to 100 nm and an average length of 0.1 to 100 μm.7. The method of producing a polymer composite material of claim 1 , wherein the aramid nanofiber is included at 0.01 to 2 parts by weight with respect to 100 parts by weight of a polymer forming the composite material.8. The method of producing a polymer composite material of claim 1 , wherein the nanofiber dispersion is prepared by including performing stirring so that a nanofiber is derived ...

LINED PIPES AND FITTINGS, ASSOCIATED FORMING METHOD, AND METHOD OF IMPROVING THE CHLORINE RESISTANCE OF HIGH DENSITY POLYETHYLENE PIPES

A lined pipe or fitting includes an outer layer containing high density polyethylene, and an inner layer containing a blend of poly(phenylene ether), polystyrene, and, optionally, a hydrogenated block copolymer. Relative to corresponding pipes and fittings made from high density polyethylene alone, the lined pipes and fittings exhibit improved resistance to chlorine and chlorine derivatives. 2. The lined pipe or fitting of claim 1 , wherein the lined pipe or fitting is used for potable water claim 1 , and the inner layer composition comprises less than 1 part per million by weight of free butadiene.3. The lined pipe or fitting of claim 2 , wherein the inner layer composition excludes rubber-modified polystyrene.4. The lined pipe or fitting of claim 1 , wherein the polystyrene is selected from the group consisting of atactic homopolystyrenes claim 1 , syndiotactic homopolystyrenes claim 1 , isotactic homopolystyrenes claim 1 , and combinations thereof.5. The lined pipe or fitting of claim 1 , wherein the polystyrene comprises an atactic homopolystyrene having a having a melt flow index of 1.5 to 5 grams per 10 minutes measured according to ISO 1133-4 (2011) at 200° C. and 5 kilogram load.6. The lined pipe or fitting of claim 1 , wherein the inner layer composition comprises 5 to 15 parts by weight of the hydrogenated block copolymer.7. The lined pipe or fitting of claim 6 , wherein the hydrogenated block copolymer comprises a polystyrene-poly(ethylene-butylene)-polystyrene triblock copolymer having a weight average molecular weight of 200 claim 6 ,000 to 400 claim 6 ,000 daltons.8. The lined pipe or fitting of claim 1 , wherein the inner layer composition excludes glass fibers.9. The lined pipe or fitting of claim 1 , wherein the inner layer composition excludes polyamides.10. The lined pipe or fitting of claim 1 , wherein the inner layer composition comprises 0 to 2 parts by weight of polyolefins.11. The lined pipe or fitting of claim 1 , wherein the outer layer has ...

POLYPHENYLENE ETHER RESIN COMPOSITION AND VEHICLE LIGHTING FIXTURE BEZEL

Provided are a polyphenylene ether resin composition having excellent fluidity and heat resistance, and a vehicle lighting fixture bezel formed of this resin composition and having light weight, excellent external appearance, and low water absorbency. The resin composition contains: (A) 42-57 mass % of a polyphenylene ether resin having a reduced viscosity of 0.39-0.43 dL/g (in chloroform solvent at 30° C.); (B) 11-26 mass % of a polyphenylene ether resin having a reduced viscosity of 0.31-0.34 dL/g (in chloroform solvent at 30° C.); (C) 9-15 mass % of a block copolymer including a vinyl aromatic hydrocarbon polymer block (c1) and a hydrogenated conjugated diene polymer block (c2); and (D) 15-23 mass % of a homopolymer of a vinyl aromatic hydrocarbon. The (C) block copolymer includes 62-70 mass % of vinyl aromatic hydrocarbon-derived monomer units, has a weight-average molecular weight Mw of 50,000-70,000, and has a molecular weight distribution Mw/Mn (Mn is number-average molecular weight) of 1.00-1.30. 1. A resin composition comprising:(A) 42 mass % to 57 mass % of a polyphenylene ether resin having a reduced viscosity of 0.39 dL/g to 0.43 dL/g as measured in chloroform solvent at 30° C.;(B) 11 mass % to 26 mass % of a polyphenylene ether resin having a reduced viscosity of 0.31 dL/g to 0.34 dL/g as measured in chloroform solvent at 30° C.;{'b': 1', '2, '(C) 9 mass % to 15 mass % of a block copolymer including a vinyl aromatic hydrocarbon polymer block (c) and a hydrogenated conjugated diene polymer block (c); and'}(D) 15 mass % to 23 mass % of a homopolymer of a vinyl aromatic hydrocarbon, whereinthe (C) block copolymer includes 62 mass % to 70 mass % of vinyl aromatic hydrocarbon-derived monomer units, has a weight-average molecular weight Mw of 50,000 to 70,000, and has a molecular weight distribution Mw/Mn of 1.00 to 1.30, where Mn is number-average molecular weight.2121. The resin composition according to claim 1 , wherein the (C) component is a c-c-c block ...

POLYPHENYLENE ETHER RESIN COMPOSITION, PREPREG USING SAME, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATE AND WIRING BOARD

One aspect of the present application relates to a polyphenylene ether resin composition including a modified polyphenylene ether compound (A) that is terminally modified with a substituent having a carbon-carbon unsaturated double bond, and a crosslinking-type curing agent (B) having two or more carbon-carbon unsaturated double bonds in each molecule, the modified polyphenylene ether compound (A) including a modified polyphenylene ether compound (A-1) having a specific structure, and a modified polyphenylene ether compound (A-2) having a specific structure. 4. The polyphenylene ether resin composition according to claim 1 , wherein the crosslinking-type curing agent (B) contains at least one selected from the group consisting of a trialkenylisocyanurate compound claim 1 , a multifunctional acrylate compound having two or more acryl groups in each molecule claim 1 , a multifunctional methacrylate compound having two or more methacryl groups in each molecule claim 1 , and a multifunctional vinyl compound having two or more vinyl groups in each molecule.5. The polyphenylene ether resin composition according to claim 1 , wherein the modified polyphenylene ether compound (A-1) and the modified polyphenylene ether compound (A-2) are contained in a content of 20 to 95% by mass claim 1 , relative to a total amount of the modified polyphenylene ether compound (A) and the crosslinking-type curing agent (B).6. The polyphenylene ether resin composition according claim 1 , wherein in the modified polyphenylene ether compound (A) claim 1 , a content ratio between the modified polyphenylene ether compound (A-1) and the modified polyphenylene ether compound (A-2) is (A-1):(A-2)=5:95 to 95:5 by mass ratio.7. A prepreg comprising:{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'the polyphenylene ether resin composition according to , or a semi-cured product of the resin composition; and'}a fibrous base material.8. A film with resin claim 1 , comprising:{'claim-ref': {'@idref': ' ...

SEALING ELEMENT AND/OR GUIDE RING MADE OF A COMPOSITION OF POLYTETRAFLUOROETHYLENE, PERFLUOROALKOXY POLYMER, AND FILLER

The present invention relates to a sealing element and/or guide ring manufactured from a composition comprising: 1. A sealing element and/or guide ring manufactured from a composition comprising:i) 50% to 98% by weight of polytetrafluoroethylene and/or modified polytetrafluoroethylene,ii) 1% to 49% by weight of perfluoroalkoxy polymer andiii) 1% to 49% by weight of an inorganic filler selected from the group consisting of charcoal, graphite, glass fibers, carbon fibers, molybdenum disulfide, metals, alloys, ceramic particles and any mixtures of two or more of the aforementioned substances,wherein the chemically modified polytetrafluoroethylene optionally present is a polymer composed of tetrafluoroethylene monomer and less than 1% by weight of comonomer, andwherein the perfluoroalkoxy polymer is a copolymer of tetrafluoroethylene and perfluoroalkoxy comonomer containing more than 1% by weight of perfluoroalkoxy comonomer.2. The sealing element and/or guide ring as claimed in claim 1 ,characterized in thatthe composition consists to an extent of 50% to 100% by weight, preferably to an extent of 65% to 100% by weight, more preferably to an extent of 75% to 100% by weight, even more preferably to an extent of 85% to 100% by weight and most preferably entirely of constituents i), ii) and iii), where the remainder to 100% by weight, if the sum total of constituents i), ii) and iii) is less than 100% by weight, is one or more polymers preferably selected from the group consisting of polyphenylene sulfides, polyphenylene sulfones, polyetheretherketones, polyimides and any desired mixtures of two or more of the aforementioned substances.3. The sealing element and/or guide ring as claimed in or claim 1 ,characterized in thatthe composition consists of:i) 50% to 93% by weight of polytetrafluoroethylene and/or chemically modified polytetrafluoroethylene,ii) 5% to 25% by weight of perfluoroalkoxy polymer andiii) 2% to 49% by weight of an inorganic filler selected from the group ...

CARBON PASTE AND CAPACITOR ELEMENT FOR A SOLID ELECTROLYTIC CAPACITOR USING CARBON PASTE

A carbon paste that includes at least a carbon filler, and a thermosetting resin including a phenoxy resin. The phenoxy ratio X in the thermosetting resin is within a range of 20 Wt %≦X≦70 Wt %, and the carbon filler content ratio Y with respect to a total of the carbon filler and the thermosetting resin is within a range of 30 Wt %≦Y≦70 Wt %. 1. A carbon paste comprising:at least a carbon filler; anda thermosetting resin comprising a phenoxy resin, whereina phenoxy ratio X in the thermosetting resin is within a range of 20 Wt %≦X≦70 Wt %, anda carbon filler content ratio Y with respect to a total of the carbon filler and the thermosetting resin is within a range of 30 Wt %≦Y≦70 Wt %.2. The carbon paste according to claim 1 , wherein the phenoxy ratio X is 25 Wt %≦X≦70 Wt %.3. The carbon paste according to claim 1 , wherein the phenoxy resin has a molecular weight Mw within a range of 30 claim 1 ,000≦Mw≦100 claim 1 ,000.4. The carbon paste according to claim 2 , wherein the phenoxy resin has a molecular weight Mw within a range of 30 claim 2 ,000≦Mw≦100 claim 2 ,000.5. The carbon paste according to claim 1 , wherein the thermosetting resin further comprises an epoxy resin.6. A capacitor element for a solid electrolytic capacitor claim 1 , the capacitor element comprising:a valve-action metal substrate;a solid electrolyte layer covering at least a part of a surface of the valve-action metal substrate;a carbon layer on the solid electrolyte layer; andan electrode layer on the carbon layer, wherein at least a carbon filler; and', 'a thermosetting resin comprising a phenoxy resin, wherein', 'a phenoxy ratio X in the thermosetting resin is within a range of 20 Wt %≦X≦70 Wt %, and', 'a carbon filler content ratio Y with respect to a total of the carbon filler and the thermosetting resin is within a range of 30 Wt %≦Y≦70 Wt %., 'the carbon layer is formed from a carbon paste comprising7. The capacitor element according to claim 6 , wherein the phenoxy ratio X is 25 Wt %≦X≦ ...

Thermoplastic resin composition for impact absorbing member and method for producing same

A thermoplastic resin composition includes 1 to 200 parts by weight of an inorganic filler (C) blended with 50 to 80 parts by weight of a thermoplastic resin (A) and 20 to 50 parts by weight of a rubbery polymer having a reactive functional group (B) which together account for 100 parts by weight; wherein the thermoplastic resin (A) and the rubbery polymer having a reactive functional group (B) form a continuous phase and a dispersed phase, respectively, while the inorganic filler (C) is dispersed in the continuous phase and/or the dispersed phase; and the dispersed phase of the rubbery polymer contains fine particles with a diameter of 1 to 100 nm of a compound resulting from a reaction between the thermoplastic resin (A) and the rubbery polymer; and an area occupied by the fine particles account for 10% or more of the dispersed phase.

PREPARATION OF HIGH THERMALLY CONDUCTIVE POLYMER COMPOSITIONS AND USES THEREOF

The present disclosure provides graphite-containing compositions that exhibit favorable thermal conductivity characteristics. 1. A composition , comprising:(a) from about 20 wt % to about 99 wt % of one or more thermoplastic polymers;(b) from about 0.5 to about 50 wt % expandable graphite platelets, the expandable graphite platelets having a thickness of greater than about 1 micrometer; and(c) from greater than 0 wt % to about 60 wt % of one or more additives,the percentages by weight being based in each case on the total weight of components (a), (b), and (c) and together giving 100 wt %.2. The composition of claim 1 , wherein at least one additive comprises at least one low thermally conductive filler having a thermal conductivity in the range of from about 10 to about 30 W/mK claim 1 , the at least one low thermally conductive filler being present at from more than about 10 wt % to about 60 wt %.3. The composition of claim 1 , wherein at least one additive comprises at least one high thermally conductive filler having a thermal conductivity in the range of greater than about 50 W/mK claim 1 , the at least one high thermally conductive filler being present at from more than about 10 wt % to about 60 wt %.4. The composition of claim 1 , wherein at least one additive comprises AlN claim 1 , Al4C3 claim 1 , Al2O3 claim 1 , BN claim 1 , AlON claim 1 , MgSiN2 claim 1 , SiC claim 1 , Si3N4 claim 1 , graphite claim 1 , expanded graphite claim 1 , ZnS claim 1 , CaO claim 1 , MgO claim 1 , ZnO claim 1 , TiO2 claim 1 , CaCO3 claim 1 , mica claim 1 , BaO claim 1 , BaSO4 claim 1 , CaSiO3 claim 1 , CaSO claim 1 , ZrO2 claim 1 , SiO2 claim 1 , glass beads claim 1 , MgO.xAl2O3 claim 1 , CaMg(CO3)2 claim 1 , ceramic-coated graphite claim 1 , clay claim 1 , talc or any combination thereof.5. The composition of claim 1 , wherein at least one additive comprises a reinforcement.6. The composition of claim 5 , wherein the reinforcement comprises glass fiber claim 5 , carbon fiber ...

Resin composition and article made therefrom

A resin composition includes 80 parts by weight to 160 parts by weight of a vinyl-containing resin, 0.1 part by weight to 1.0 part by weight of a first compound and 0.1 part by weight to 2.0 parts by weight of a second compound; wherein the vinyl-containing resin includes a vinyl-containing polyphenylene ether resin, a maleimide resin, a bis(vinylphenyl)ethane, a triallyl isocyanurate, a vinyl-containing polyolefin resin or a combination thereof, the first compound includes a structure of Formula (1) to Formula (3) or a combination thereof, and the second compound includes a structure of Formula (4) to Formula (6) or a combination thereof. Moreover, an article may be made from the resin composition, including a prepreg, a resin film, a laminate or a printed circuit board.

Method for manufacturing a three-dimensional object

A method for manufacturing a three-dimensional (3D) object with an additive manufacturing system, comprising a step consisting in printing layers of the 3D object from the part material comprising a polymeric component comprising, based on the total weight of the polymeric component: from 5 to 95 wt. % of at least one polymer (P 1 ) comprising at least 50 mol. % of recurring units (R 1 ) consisting of an arylene group comprising at least one benzene ring, each recurring unit (R 1 ) being bound to each other through C—C bonds, wherein the recurring units (R 1 ) are such that, based on the total number of moles of recurring units (R 1 ):less than 90 mol. % are rigid rod-forming arylene units (R 1 - a ), and at least 10 mol. % are kink-forming arylene units (R 1 - b ), and from 5 to 95 wt. % of at least one polymer (P 2 ), having a glass transition temperature (Tg) between 140° C. and 265° C., and no melting peak, as measured by differential scanning calorimetry (DSC) according to ASTM D3418.

Flame retardant thermoplastic elastomers

A flame-retardant thermoplastic elastomer compound is disclosed having polyphenylene ether, a hydrogenated styrene block copolymer, at least one solid non-halogenated phosphorus containing flame retardant, a nucleated olefinic polymer, and two different specific UV stabilizers and pigment. The compound has a before-aging tensile elongation of >200% and an after-aging tensile elongation residual of at least 75%, according to the UL 62 test, which makes it useful as an insulation layer, a jacketing layer, or both for protected electrical lines such as alternating current wire and cable products, accessory cables, and variety of injection molded electrical or electronic parts.

POLY(PHENYLENE ETHER) COMPOSITION AND ARTICLE

A poly(phenylene ether) composition comprises, based on the total weight of the poly(phenylene ether), addition polymer, impact modifier, and flame retardant: 40 to 90 weight percent of a poly(phenylene ether); 1 to 20 weight percent of an addition polymer comprising repeat units derived from a glycidyl ester of an α,β-ethylenically unsaturated acid; 1 to 20 weight percent of an impact modifier other than the addition polymer; and 5 to 20 weight percent of a flame retardant comprising an organophosphate ester. The composition is useful for molding articles. 1. A composition comprising , based on the total weight of the poly(phenylene ether) , addition polymer , impact modifier , and flame retardant:40 to 90 weight percent of a poly(phenylene ether);1 to 20 weight percent of an addition polymer comprising repeat units derived from a glycidyl ester of an α,β-ethylenically unsaturated acid;1 to 20 weight percent of an impact modifier other than the addition polymer; and5 to 20 weight percent of a flame retardant comprising an organophosphate ester.2. The composition of claim 1 , wherein the composition further comprises claim 1 , based on the total weight of the poly(phenylene ether) claim 1 , addition polymer claim 1 , impact modifier claim 1 , flame retardant claim 1 , and poly(alkenyl aromatic monomer) claim 1 , 1 to 20 weight percent of a poly(alkenyl aromatic monomer).3. The composition of claim 1 , wherein the composition consists essentially of the poly(phenylene ether) claim 1 , addition polymer claim 1 , impact modifier claim 1 , flame retardant claim 1 , and 0.1 to 10 weight percent claim 1 , based on the total weight of the composition claim 1 , of one or more additives selected from the group consisting of flame retardants other than the organophosphate ester claim 1 , fillers claim 1 , processing aids claim 1 , mold release agents claim 1 , pigments claim 1 , dyes claim 1 , acid quenchers claim 1 , metal deactivators claim 1 , antioxidants claim 1 , light ...

FLEXIBLE, UV RESISTANT POLY(PHENYLENE ETHER) COMPOSITION AND INSULATED CONDUCTOR AND JACKETED CABLE COMPRISING IT

A composition includes specific amounts of a poly(phenylene ether), a hydrogenated block copolymer of an alkenyl aromatic monomer and a conjugated diene, a polypropylene, a low molecular weight polybutene, a flame retardant, an ultraviolet absorbing agent, and a poly(alkylene oxide). The composition is useful as an insulation or jacketing material for wires and cables. 1. A composition , comprising:15 to 45 parts by weight of a poly(phenylene ether);5 to 50 parts by weight of a hydrogenated block copolymer of an alkenyl aromatic monomer and a conjugated diene;1 to 15 parts by weight of a polypropylene;2 to 10 parts by weight of a polybutene having a number average molecular weight of 500 to 1500 grams/mole;10 to 45 parts by weight of a flame retardant;0.5 to 10 parts by weight of an ultraviolet absorbing agent; and0.5 to 10 parts by weight of a poly(alkylene oxide);wherein all parts by weight are based on 100 parts by weight total of flame retardants and polymers other than the poly(alkylene oxide).2. The composition of claim 1 , wherein the poly(phenylene ether) is a poly(2 claim 1 ,6-dimethyl-1 claim 1 ,4-phenylene ether) having an intrinsic viscosity of 0.35 to 0.5 deciliter per gram.3. The composition of claim 1 , wherein the poly(phenylene ether) has an intrinsic viscosity of 0.35 to 0.5 deciliter per gram and comprises poly(phenylene ether) homopolymer and poly(phenylene ether)-polysiloxane block copolymer.4. The composition of claim 1 , wherein the flame retardant is selected from the group consisting of magnesium dihydroxides claim 1 , metal dialkylphosphinates claim 1 , melamine polyphosphates claim 1 , and combinations thereof.5. The composition of claim 1 , wherein the ultraviolet absorbing agent is selected from the group consisting of benzotriazole ultraviolet absorbing agents claim 1 , 2-(2′-hydroxyphenyl)-1 claim 1 ,3 claim 1 ,5-triazine ultraviolet absorbing agents claim 1 , benzophenone ultraviolet absorbing agents claim 1 , oxanilide ultraviolet ...

FUNCTIONALIZED GRAPHENE SHEETS HAVING HIGH CARBON TO OXYGEN RATIOS

Functionalized graphene sheets having a carbon to oxygen molar ratio of at least about 23:1 and method of preparing the same. 120-. (canceled)21. Functionalized graphene sheets comprising:a carbon to oxygen molar ratio of at least about 23:1;{'sup': 3', '3, 'a bulk density of about 0.1 kg/mto about 40 kg/m;'}fully exfoliated sheets of graphene; and have an X-ray diffraction pattern that displays no signature corresponding to graphite or graphite oxide; and', 'are dry., 'wherein the functionalized graphene sheets'}22. The functionalized graphene sheets of comprising a surface area of about 350 and 2 claim 21 ,400 m/g.23. A polymer composite or resin comprising the functionalized graphene sheets of and a polymer.24. The polymer composite comprising of claim 23 , wherein the polymer is one or more of acrylonitrile/butadiene/styrene (ABS) claim 23 , polycarbonates (PC) claim 23 , polyamides claim 23 , polyterephthalamides claim 23 , polyesters claim 23 , poly(butylene terephthalate) (PBT) claim 23 , poly(ethylene terephthalate) (PET) claim 23 , poly(phenylene oxide) (PPO) claim 23 , polysulphone (PSU) claim 23 , polyetherketone (PEK) claim 23 , polyetheretherketone (PEEK) claim 23 , polyimides claim 23 , polyoxymethylene (POM) claim 23 , poly(lactic acid) claim 23 , poly(acrylonitrile) claim 23 , styrene/lacrylonitrile polymers (SAN) claim 23 , polyetherimides claim 23 , polystyrene claim 23 , high impact polystyrene claim 23 , liquid crystalline polymers (LCPs) claim 23 , aramides claim 23 , polytetrafluoroethylene (PTFE) claim 23 , fluorinated ethylene propylene polymers (PEP) claim 23 , poly(vinyl fluoride) claim 23 , poly(vinylidene fluoride) claim 23 , poly(vinylidene chloride) claim 23 , poly(vinyl chloride) claim 23 , polyolefins claim 23 , polyethylene claim 23 , polypropylene claim 23 , poly(vinyl acetates) claim 23 , acrylate polymers claim 23 , poly(methyl methacrylate) claim 23 , polysiloxanes claim 23 , polydimethylenesiloxane claim 23 , elastomers claim 23 ...

SUBSTITUTED CATECHOL ADDITIVES IN COATINGS AND METHODS FOR USE

Disclosed are novel catechol dditives and the like, methods of preparing, as well as compositions and methods using such compositions in various applications. Also provided is a method of preparing an aqueous coating composition such as a latex paint including the above components. 2. The compound of claim 1 , wherein Rand Rare independently selected from —OH claim 1 , —OCH claim 1 , —OCH claim 1 , —OCH claim 1 , —OCH claim 1 , —OCH claim 1 , —OCH claim 1 , —Cl claim 1 , —Br claim 1 , —CN claim 1 , Phosphonate (—POM) claim 1 , Phosphate (POM) claim 1 , Sulfate (SOM) claim 1 , Sulfonate (SOM) claim 1 , carboxylate (COOM) claim 1 , a nonionic group claim 1 , or a quaternary ammonium ion claim 1 , wherein M+ is a counterion.3. The surface active compound of wherein Rand Rare independently selected from —[CH(R)CH(R)O]— claim 1 , wherein x is an integer of from 0 to 100 claim 1 , and Rand Rare independently selected from any of the following:{'sub': 2', '2, 'H; —CHOH; phenyl; —CHCl;'}{'sub': 1', '30, 'a C-Cstraight or branched alkyl or alkenyl;'}{'sub': 2', '22', '22', '1', '30, '—CHORwherein Ris C-Cstraight or branched alkyl or alkenyl, phenyl, or alkyl substituted phenyl; or'}{'sub': 2', '1', '30, 'R′COOCH— where R′ is C-Cstraight or branched alkyl or alkenyl.'}4. The surface active compound of wherein the C-Cbranched or linear alkyl group or alkenyl group is a C-Cbranched or linear alkyl group.5. The surface active compound of wherein the C-Cbranched or linear alkyl group or alkenyl group is a C-Cbranched or linear alkyl group.6. The surface active compound of wherein the C-Cbranched or linear alkyl group or alkenyl group is a C-Cbranched or linear alkyl group.7. The surface active compound of wherein the C-Cbranched or linear alkyl group or alkenyl group is a C-Cbranched or linear alkyl group or alkenyl group.10. The method of wherein the effective amount is an amount of the additive greater than about 0.5% by weight of the polymer.11. The method of wherein the ...

SUBSTITUTED CATECHOL MONOMERS, COPOLYMERS AND METHODS FOR USE

Disclosed are novel substituted catechol monomers, polymers made with the substituted catechol monomers, pH responsive polymers made with the substituted catechol monomers, and related methods. Also provided is a method of preparing an aqueous coating composition such as a latex paint including the above components. 2. The monomer of wherein Rand Rare independently selected from —[CH(R)CH(R)O]— claim 1 , wherein x is an integer of from 0 to 100 claim 1 , and Rand Rare independently selected from any of the following:{'sub': 2', '2, 'H; —CHOH; phenyl; —CHCl;'}{'sub': 1', '30, 'a C-Cstraight or branched alkyl or alkenyl;'}{'sub': 2', '22', '22', '1', '30, '—CHORwherein Ris C-Cstraight or branched alkyl or alkenyl, phenyl, or alkyl substituted phenyl; or'}{'sub': 2', '1', '30, 'R′COOCH— where R′ is C-Cstraight or branched alkyl or alkenyl.'}4. The monomer of wherein the C-Cbranched or linear alkyl group or alkenyl group is a C-Cbranched or linear alkyl group.5. The monomer of wherein the C-Cbranched or linear alkyl group or alkenyl group is a C-Cbranched or linear alkenyl group.6. The monomer of wherein the C-Cbranched or linear alkyl group or alkenyl group is a C-Cbranched or linear alkyl group.7. The monomer of wherein the C-Cbranched or linear alkyl group or alkenyl group is a C-Cbranched or linear alkenyl group.8. The monomer of wherein the C-Cbranched or linear alkyl group or alkenyl group is a C-Cbranched or linear alkyl group.9. The monomer of wherein the C-Cbranched or linear alkyl group or alkenyl group is a C-Cbranched or linear alkenyl group.10. The monomer of wherein the C-Cbranched or linear alkyl group or alkenyl group is a C-Cbranched or linear alkyl group or alkenyl group.11. A copolymer of unsaturated copolymerizable monomers claim 1 , said unsaturated copolymerizable monomers comprising claim 1 , based on total weight of monomers:{'sub': 3', '8', '3', '8, 'A. about 0-60 weight percent of at least one C-Calpha beta-ethylenically unsaturated acidic ...

SUBSTITUTED CATECHOL POLYMERIC DISPERSANTS

Disclosed are novel substituted catechol polymeric dispersants and related method of preparing. Also disclosed are methods of dispersing at least one pigment comprising the following steps: contacting an aqueous solution containing at least one pigment with the polymeric dispersant copolymers as described herein. 2. The polymeric dispersant of wherein the weight average molecular weight is between 2 claim 1 ,000 g/mole to 15 claim 1 ,000 g/mole.3. The polymeric dispersant of wherein the C-Cbranched or linear alkyl group or alkenyl group is a C-Cbranched or linear alkyl group.4. The polymeric dispersant of wherein the C-Cbranched or linear alkyl group or alkenyl group is a C-Cbranched or linear alkenyl group.5. The polymeric dispersant of wherein the C-Cbranched or linear alkyl group or alkenyl group is a C-Cbranched or linear alkyl group.6. The polymeric dispersant of wherein the C-Cbranched or linear alkyl group or alkenyl group is a C-Cbranched or linear alkenyl group.7. The polymeric dispersant of wherein the C-Cbranched or linear alkyl group or alkenyl group is a C-Cbranched or linear alkyl group.8. The polymeric dispersant of wherein the C-Cbranched or linear alkyl group or alkenyl group is a C-Cbranched or linear alkenyl group.9. The polymeric dispersant of wherein the C-Cbranched or linear alkyl group or alkenyl group is a C-Cbranched or linear alkyl group or alkenyl group.10. The polymeric dispersant of wherein the polymeric dispersant is characterized as an oligomer.12. The polymeric dispersant copolymer of wherein the weight average molecular weight is between 2 claim 11 ,000 g/mole to 15 claim 11 ,000 g/mole.13. The polymeric dispersant copolymer of wherein the carboxylic acid monomer (A) is present from about 15 weight percent to about 60 weight percent based on total monomer weight.14. The polymeric dispersant copolymer of wherein the carboxylic acid monomer (A) is selected from a group consisting of methacrylic acid claim 11 , acrylic acid and a ...

THERMOSETTING RESIN COMPOSITION, PREPREG, LAMINATE AND MULTILAYER PRINTED WIRING BOARD

Provided are a thermosetting resin composition having especially good compatibility and having dielectric properties (low dielectric constant and low dielectric dissipation factor) in a high frequency range, high adhesion to conductor, excellent heat resistance, high glass transition temperature, low thermal expansion coefficient and high flame retardancy, and a prepreg, a laminate and a multilayer printed wiring board using the resin composition. Specifically, the thermosetting resin composition contains (A) a polyphenylene ether derivative having an N-substituted maleimide structure-containing group and a structural unit represented by the following general formula (I) in one molecule, (B) at least one thermosetting resin selected from the group consisting of epoxy resins, cyanate resins and maleimide compounds, and (C) a phosphorus flame retardant: 5. The thermosetting resin composition according to claim 1 , wherein the phosphorus flame retardant (C) is at least one selected from an aromatic phosphate claim 1 , and a metal salt of a disubstituted phosphinic acid.8. The thermosetting resin composition according to claim 1 , wherein the content ratio of the component (A) to the component (B) [(A)/(B)] is from 5/95 to 80/20 by mass.9. The thermosetting resin composition according to claim 1 , further comprising an inorganic filler (D).10. The thermosetting resin composition according to claim 1 , further comprising a curing accelerator (E).11. The thermosetting resin composition according to claim 1 , further comprising an organic solvent.12. A prepreg comprising the thermosetting resin composition of and a sheet-form fiber reinforced substrate.13. A laminate comprising the prepreg of and a metal foil.14. A multilayer printed wiring board comprising the prepreg of .15. A multilayer printed wiring board comprising the laminate of .16. A method for forming a laminate claim 13 , comprising:{'claim-ref': {'@idref': 'CLM-00012', 'claim 12'}, 'arranging a metal foil on ...

HALOGEN-FREE LOW DIELECTRIC RESIN COMPOSITION, AND PRE-PREG, METAL-CLAD LAMINATE, AND PRINTED CIRCUIT BOARD USING THE SAME

A halogen-free low dielectric resin composition is provided. The halogen-free low dielectric resin composition includes: 2. The halogen-free low dielectric resin composition of claim 1 , further comprising a reactive phosphorus compound having an unsaturated functional group.3. The halogen-free low dielectric resin composition of claim 2 , wherein the weight ratio of the phosphorus-containing compound (C) represented by formula (I) to the reactive phosphorus compound is from 4:1 to 1:4.4. The halogen-free low dielectric resin composition of claim 2 , wherein the reative phosphorus compound is an allyl cyclophosphazene compound.6. The halogen-free low dielectric resin composition of claim 1 , wherein the cross-linking agent (B) is selected from the group consisting of a polyfunctional allylic compound claim 1 , a polyfunctional acrylate claim 1 , a polyfunctional acrylamide claim 1 , a polyfunctional styrenic compound claim 1 , a bismaleimide compound claim 1 , and combinations thereof.7. The halogen-free low dielectric resin composition of claim 1 , wherein the cross-linking agent (B) is selected from the group consisting of triallyl isocyanurate (TAIC) claim 1 , triallyl cyanurate (TAC) claim 1 , prepolymers thereof claim 1 , and combinations thereof.8. The halogen-free low dielectric resin composition of claim 1 , further comprising a phosphorus-containing additive flame retardant selected from the group consisting of a phosphinate salt claim 1 , a polyphosphate salt claim 1 , a phosphonium salt claim 1 , a phosphate ester claim 1 , a phosphazene claim 1 , a phosphite ester claim 1 , a phosphine oxide claim 1 , and combinations thereof.9. The halogen-free low dielectric resin composition of claim 1 , further comprising a vinyl-containing elastomer.10. The halogen-free low dielectric resin composition of claim 9 , wherein the vinyl-containing elastomer is selected from the group consisting of polybutadiene claim 9 , styrene-butadiene (SB) copolymer claim 9 , ...

RESIN COMPOSITION, PREPREG, FILM INCLUDING RESIN, METAL FOIL INCLUDING RESIN, METAL-CLAD LAMINATE, AND WIRING BOARD

Provided is a resin composition containing: a modified polyphenylene ether compound terminally modified with a substituent having an unsaturated carbon-carbon double bond; a cross-linking curing agent having an unsaturated carbon-carbon double bond in its molecule; a silane coupling agent having a phenylamino group in its molecule; and silica. A content of the silica is 60 to 250 parts by mass with respect to a total of 100 parts by mass of the modified polyphenylene ether compound and the cross-linking curing agent. 1. A resin composition comprising:a modified polyphenylene ether compound terminally modified with a substituent having an unsaturated carbon-carbon double bond;a cross-linking curing agent having an unsaturated carbon-carbon double bond in its molecule;a silane coupling agent having a phenylamino group in its molecule; andsilica,wherein a content of the silica is 60 to 250 parts by mass with respect to a total of 100 parts by mass of the modified polyphenylene ether compound and the cross-linking curing agent.2. The resin composition according to claim 1 , wherein a content of the silane coupling agent is 0.3 to 5 parts by mass with respect to 100 parts by mass of the silica.3. The resin composition according to claim 1 , further comprising a flame retardant claim 1 , whereinthe flame retardant contains a compatible phosphorus compound that is compatible with a mixture of the modified polyphenylene ether compound and the cross-linking curing agent, and an incompatible phosphorus compound that is incompatible with the mixture.4. The resin composition according to claim 3 , wherein a content of the compatible phosphorus compound is 3 to 19% by mass with respect to a total content of the compatible phosphorus compound and the incompatible phosphorus compound.5. The resin composition according to claim 3 , wherein the compatible phosphorus compound contains a phosphazene compound.6. The resin composition according to claim 1 , wherein the substituent ...

RESIN COMPOSITION ELIMINATING VOLATILE LOSS OF INITIATING SPECIES FOR THE PREPARATION OF PRINTED CIRCUIT BOARD LAMINATES

An enhanced prepreg for printed circuit board (PCB) laminates includes a substrate and a resin applied to the substrate. The resin includes a curable polymer and a polymerization initiator polymer having a backbone with a free radical initiator forming segment that breaks apart upon being subjected to heat to generate a plurality of non-volatile initiating species. This resin composition eliminates possible volatile loss of the free radical initiator during all processing steps in the preparation of PCB laminates. The resin may additionally include a cross-linking agent, flame retardant and viscosity modifiers. In one embodiment, a sheet of woven glass fibers is impregnated with the resin and subsequently dried or cured. The glass cloth substrate may include a silane coupling agent to couple the resin to the substrate. In another embodiment, resin coated copper (RCC) is prepared by applying the resin to copper and subsequently curing the resin. 1. A resin , comprising:a curable polymer; anda polymerization initiator polymer having a backbone with a free radical initiator forming segment that breaks apart upon being subjected to heat to generate a plurality of non-volatile initiating species, wherein each of the plurality of non-volatile initiating species has a molecular weight in excess of 1000.2. The resin as recited in claim 1 , wherein the polymerization initiator polymer is a modified polyphenylene ether (PPE) that is blended in the resin with a conventional resin that includes an unmodified PPE.6. A cured resin comprising the reaction product of a resin comprising:a curable polymer; anda polymerization initiator polymer having a backbone with a free radical initiator forming segment that breaks apart upon being subjected to heat to generate a plurality of non-volatile initiating species, wherein each of the plurality of non-volatile initiating species has a molecular weight in excess of 1000.7. The cured resin as recited in claim 6 , wherein the polymerization ...

RESIN COMPOSITION, MOLDED PRODUCT, AND PLUMBING MECHANICAL COMPONENT

Disclosed is a resin composition including: a resin mixture (a) containing a polyphenylene ether resin and atactic homopolystyrene in an amount of above 50 mass % and below 94 mass %; a hydrogenated block copolymer (b) obtained by hydrogenating at least part of a block copolymer containing polymer blocks A and B in an amount of 1 to 20 mass %; a functional group-containing compound (c) having a specific functional group in an amount of 0.01 to 0.5 mass %; and a surface-treated inorganic filler (d) in an amount of 5 mass % or more and less than 30 mass %, in which the resin composition does not substantially contain a polymer having a hydrogenation ratio of less than 98% in a conjugated diene compound portion, the component (a-1) has a weight average molecular weight of less than 70,000, and the component (b) has a number average molecular weight of 150,000 to 300,000. 2. The resin composition according to claim 1 , wherein the component (a-1) exhibits a melting point.3. The resin composition according to claim 1 , wherein the component (a-2) is contained in an amount of 0.1 parts by mass or more and 95 parts by mass or less per 100 parts by mass in total of the components (a-1) and (a-2).4. The resin composition according to claim 1 , wherein the component (c) is at least one compound selected from the group consisting of fumaric acid claim 1 , maleic acid and maleic anhydride claim 1 , succinic acid claim 1 , citric acid claim 1 , aconitic acid claim 1 , itaconic acid claim 1 , citraconic acid claim 1 , and mesaconic acid.5. The resin composition according to claim 1 , wherein the component (d) is an inorganic filler surface-treated with aminosilane or epoxysilane.6. The resin composition according to claim 1 , whereinthe component (d) is a surface-treated glass fiber, anda ratio of an average fiber length L to an average fiber diameter D of the glass fiber, as expressed by L/D, is from 24 to 50.7. The resin composition according to claim 1 , whereinthe component ( ...

THERMOSETTING RESIN COMPOSITION, RESIN SHEET, LAMINATE, AND PRINTED WIRING BOARD

The thermosetting resin composition contains a radical polymerizable unsaturated compound and an organic radical compound. 1. A thermosetting resin composition comprising:a radical polymerizable unsaturated compound (A); andan organic radical compound (C).2. The thermosetting resin composition of claim 1 , whereinthe radical polymerizable unsaturated compound (A) contains: a copolymer (A1) having a structural unit derived from mono-olefin and a structural unit derived from diene; and a terminal modified polyphenylene ether compound (A2).3. The thermosetting resin composition of claim 1 , further containing a thermal radical polymerization initiator (B).4. The thermosetting resin composition of claim 3 , whereinthe thermal radical polymerization initiator (B) contains at least one compound selected from the group consisting of: a t-amyl peroxide-based polymerization initiator; and a t-hexyl peroxide-based polymerization initiator.5. The thermosetting resin composition of claim 1 , whereinthe organic radical compound (C) contains an organic nitroxide radical compound (C1).6. The thermosetting resin composition of claim 1 , further containing a metal deactivator (D).7. The thermosetting resin composition of claim 1 , further containing a styrene-based elastomer (E).8. The thermosetting resin composition of claim 1 , further containing an inorganic filler (F).9. The thermosetting resin composition of claim 8 , whereinthe inorganic filler (F) contains silica subjected to surface treatment with a polymerizable organic compound.10. The thermosetting resin composition of claim 1 , further containing a flame retardant (G).11. A resin sheet comprising a dried product or semi-cured product of the thermosetting resin composition of .12. A laminate comprising an insulating layer and a sheet of metal foil claim 1 ,{'claim-ref': {'@idref': 'CLM-00001', '#text': 'claim 1'}, '#text': 'the insulating layer containing a cured product of the thermosetting resin composition of .'}13. A ...

Tire ready to receive a member on the surface thereof

A tire comprises an inner surface and/or outer surface with an accommodating region, an adhesive layer arranged on the accommodating region and a protective film arranged on said adhesive layer. The adhesive layer is based on a block thermoplastic styrene (TPS) elastomer comprising an elastomer block based on a diene elastomer comprising a molar content (or content by weight) of unsaturations of greater than 10%, and the adhesive layer comprises one or more polyphenylene ethers (PPEs).

Conductive Polyamide/Polyphenylene Ether Resin Composition and Automotive Molded Article Manufactured Therefrom

The present invention relates to a conductive polyamide/polyphenylene ether resin composition and an automotive molded article manufactured therefrom. The conductive polyamide/polyphenylene ether resin composition comprises: (a) a base resin comprising (a-1) polyphenylene ether and (a-2) polyamide; (b) a modified polyolefin based resin; (c) an impact modifier; (d) a compatibilizer; and (e) a conductive filler, and the conductive polyamide/polyphenylene ether resin composition is formed in a domain phase and a matrix phase, wherein the domain phase comprises (a-1) the polyphenylene ether and (c) the impact modifier and the matrix phase comprises (a-2) the polyamide and (b) the modified polyolefin based resin, (e) the conductive filler being dispersed on the domain phase and the matrix phase and the content of the conductive filler dispersed on the matrix phase being higher than that of the conductive filler dispersed on the domain phase. 1. A conductive polyamide/polyphenylene ether resin composition , comprising:(a) a base resin comprising (a-1) a polyphenylene ether and (a-2) a polyamide; (b) a modified polyolefin resin, wherein the modified polyolefin resin (b) is maleic anhydride-modified low density polyethylene; (c) an impact modifier; (d) a compatibilizer; and (e) conductive fillers,wherein the conductive polyamide/polyphenylene ether resin composition comprises a domain phase and a matrix phase,the domain phase comprising the polyphenylene ether (a-1) and the impact modifier (c),the matrix phase comprising the polyamide (a-2) and the modified polyolefin resin (b),the conductive fillers (e) are dispersed in the domain phase and the matrix phase, the conductive fillers being dispersed in a larger amount in the matrix phase than in the domain phase,wherein the conductive polyamide/polyphenylene ether resin composition is prepared by preparing a conductive polyphenylene ether resin composition through melt kneading of the polyphenylene ether (a-1), the modified ...

Thermoplastic Resin Composition and Molded Article Including the Same

A thermoplastic resin composition includes: a base resin including a polyarylene ether resin and an aromatic vinyl polymer; a flame retardant; and an impact modifier, wherein the impact modifier is a rubber-modified vinyl graft copolymer in which an unsaturated monomer including about 95 wt % to about 99 wt % of an aromatic vinyl compound and about 1 wt % to about 5 wt % of a vinyl cyanide compound is grafted to a rubbery polymer; the base resin and the flame retardant form a continuous phase; and the impact modifier forms a dispersed phase. The thermoplastic resin composition can have excellent properties in terms of impact resistance, flame retardancy, and balance therebetween. 1. A thermoplastic resin composition comprising:a base resin comprising a polyarylene ether resin and an aromatic vinyl polymer;a flame retardant; andan impact modifier,wherein the impact modifier is a rubber-modified vinyl graft copolymer in which an unsaturated monomer comprising about 95 wt % to about 99 wt % of an aromatic vinyl compound and about 1 wt % to about 5 wt % of a vinyl cyanide compound is grafted to a rubbery polymer, the base resin and the flame retardant form a continuous phase, and the impact modifier forms a dispersed phase.2. The thermoplastic resin composition according to claim 1 , wherein the base resin comprises about 30 wt % to about 70 wt % of the polyarylene ether resin and about 30 wt % to about 70 wt % of the aromatic vinyl polymer.3. The thermoplastic resin composition according to claim 1 , comprising the flame retardant in an amount of about 5 parts by weight to about 30 parts by weight claim 1 , and the impact modifier in an amount of about 12 parts by weight to about 18 parts by weight claim 1 , each based on about 100 parts by weight of the base resin.5. The thermoplastic resin composition according to claim 1 , wherein the aromatic vinyl polymer comprises at least one of polystyrene claim 1 , poly(α-methylstyrene) claim 1 , poly(β-methylstyrene) claim 1 ...

POLYAMIDE COMPOSITION AND MOLDED ARTICLE

The present invention provides a polyamide composition containing 50 to 99 parts by mass of an aliphatic polyamide (1A) formed from a diamine and a dicarboxylic acid, and 1 to 50 parts by mass of a semi-aromatic polyamide (1B) containing a dicarboxylic acid unit that includes at least 75 mol % of isophthalic acid and a diamine unit that includes at least 50 mol % of a diamine of 4 to 10 carbon atoms, wherein the tan δ peak temperature of the polyamide composition is at least 90° C., and the weight average molecular weight Mw of the polyamide composition satisfies 15,000≤Mw≤35,000. The invention also provides a molded article or the like formed using the polyamide composition. 1. A polyamide composition comprising:50 to 99 parts by mass of an aliphatic polyamide (1A) formed from a diamine and a dicarboxylic acid, and1 to 50 parts by mass of a semi-aromatic polyamide (1B) containing a dicarboxylic acid unit that includes at least 75 mol % of isophthalic acid, and a diamine unit that includes at least 50 mol % of a diamine of 4 to 10 carbon atoms, whereina tan δ peak temperature of the polyamide composition is at least 90° C., anda weight average molecular weight Mw of the polyamide composition satisfies 15,000≤Mw≤35,000.2. The polyamide composition according to claim 1 , wherein a total amount of polyamide having a number average molecular weight Mn of at least 500 but not more than 2 claim 1 ,000 is at least 0.5% by mass but less than 2.5% by mass relative to a total mass of polyamide in the polyamide composition.3. The polyamide composition according to claim 1 , wherein a molecular weight distribution Mw/Mn for the polyamide composition is not more than 2.6.4. The polyamide composition according to claim 1 , wherein a total of an amount of amino ends and an amount of carboxyl ends claim 1 , expressed as a number of equivalents per 1 g of polyamide in the polyamide composition claim 1 , is from 100 to 175 μeq/g.5. The polyamide composition according to claim 1 , ...

POLYPHENYLENE ETHER RESIN COMPOSITION AND MOLDED ARTICLE AND METHOD FOR PRODUCING POLYPHENYLENE ETHER RESIN COMPOSITION

Provided is a polyphenylene ether resin composition having excellent mechanical properties, such as tensile, flexural, and impact strength, high flame retardance, and adequate molding fluidity, and that is sufficiently resistant to use as a thin molded article for an electric/electronic device cooling fan, etc. The polyphenylene ether resin composition contains at least 90 mass % of a polyphenylene ether (A), a styrene resin (B), glass fiber (C), and an organophosphorus flame retardant (D) in terms of total mass of (A) to (D). Taking this total mass as 100 mass %, contents of the polyphenylene ether (A), styrene resin (B), glass fiber (C), and organophosphorus flame retardant (D) are 25-75 mass %, 0-5 mass %, 20-50 mass %, and 5-20 mass %, respectively, and taking mass of the organophosphorus flame retardant (D) as 100 mass %, content of at least one compound selected from the group consisting of triphenyl phosphate and a phosphazene is at least 70 mass %. 1. A polyphenylene ether resin composition comprising at least 90 mass % of a polyphenylene ether (A) , a styrene resin (B) , glass fiber (C) , and an organophosphorus flame retardant (D) in terms of a total mass of (A) to (D) , whereinwhen the total mass of (A) to (D) is taken to be 100 mass %, content of the polyphenylene ether (A) is from 25 mass % to 75 mass %, content of the styrene resin (B) is from 0 mass % to 5 mass %, content of the glass fiber (C) is from 20 mass % to 50 mass %, and content of the organophosphorus flame retardant (D) is from 5 mass % to 20 mass %, andwhen a mass of the organophosphorus flame retardant (D) is taken to be 100 mass %, content of at least one compound selected from the group consisting of triphenyl phosphate and a phosphazene is at least 70 mass %.2. The polyphenylene ether resin composition of having a tensile strength of at least 130 MPa as measured at 23° C. in accordance with ISO 527.3. The polyphenylene ether resin composition of having a flame retardance level of V-0 ...

Resin sheet

A resin sheet is made of a resin composition containing a (A) heat-curable component. The (A) heat-curable component contains a (A1) first maleimide resin. The (A1) first maleimide resin is a maleimide resin having two or more maleimide groups in one molecule, at least a pair of the maleimide groups being bonded by a binding group whose main chain includes four or more methylene groups.

RESIN COMPOSITION AND MOLDED ARTICLE

A resin composition contains: 60 to 95% by mass of polyphenylene ether (A); 35 to 0% by mass of styrene-based resin (B); and 15 to 5% by mass of elastomer component (C). The component (C) is present as dispersion particles in the resin composition. The dispersion particles have a number average particle size of 0.04 to 0.25 μm. 1. A resin composition comprising:60 to 95% by mass of polyphenylene ether (A);35 to 0% by mass of styrene-based resin (B); and15 to 5% by mass of elastomer component (C),whereinthe styrene-based resin (B) is a non-rubber-reinforced styrene-based resin;the elastomer component (C) comprises a block copolymer having a styrene block and a hydrogenated conjugated diene compound block;the block copolymer is a styrene block-hydrogenated conjugated diene compound block copolymer having a molecular weight of 60,000 to 1,500,000 and having a bound styrene amount of 50 to 80% by mass;the elastomer component (C) is present as dispersion particles in the resin composition;the dispersion particles have a number average particle size of 0.04 to 0.25 μm,dispersion particles having a particle size of greater than 1.0 μm are not present, and{'sup': '2', 'the number of the dispersion particles having a particle size of 0.5 to 1.0 μm is 3 or less in an area corresponding to 396 μmas measured by transmission electron microscopy.'}2. The resin composition according to claim 1 , wherein the elastomer component (C) comprises an oil-extended styrene block-hydrogenated conjugated diene compound block copolymer.3. The resin composition according to claim 1 , wherein the elastomer component (C) comprises an oil-extended styrene block-hydrogenated conjugated diene compound block copolymer having an oil-extended amount of 20 to 50% by mass.4. The resin composition according to claim 2 , wherein the elastomer component (C) comprises the oil-extended styrene block-hydrogenated conjugated diene compound block copolymer having an oil-extended amount of 20 to 50% by mass and ...

Low molecular weight polyphenylene ether prepared without solvents

Low molecular weight polyphenylene ether (PPE) is made from higher molecular weight PPE without using solvents by extruding the higher molecular weight PPE with a phenolic modifier and a redistribution catalyst. The low molecular weight PPE has a Mw/Mn polydispersity greater than about 2 and a Mn ranging from about 10,000 to about 20,000.

NON-HALOGEN FLAME RETARDANT RESIN COMPOSITION

The present invention relates to a non-halogen flame retardant resin composition. More particularly, the present invention provides a non-halogen flame retardant resin composition capable of simultaneously exhibiting superior flame retardancy, whiteness, and gloss by addressing problems of a flame retardant resin such as difficulties in realizing V-1 grade or higher flame retardancy when a non-halogen flame retardant is used and poor colorability due to low gloss and whiteness. 1. A non-halogen flame retardant resin composition , comprising: (A) a blended resin comprising a poly(arylene ether)-based polymer , a styrene-based polymer , and a vinyl cyan compound-conjugated diene compound-vinyl aromatic compound copolymer; and (B) a non-halogen flame retardant ,wherein the vinyl cyan compound is comprised in an amount of 1% by weight or more and less than 25% by weight based on a total weight of the vinyl cyan compound-conjugated diene compound-vinyl aromatic compound copolymer, anda specimen manufactured by extruding and injection-molding the non-halogen flame retardant resin composition has a surface gloss degree of 80 or more at 45° and a whiteness (L value) of 75 or more, measured using CIELAB.3. The non-halogen flame retardant resin composition according to claim 1 , wherein the poly(arylene ether)-based polymer is a poly(phenylene ether)-based polymer having a weight average molecular weight of 5 claim 1 ,000 to 100 claim 1 ,000 g/mol.4. The non-halogen flame retardant resin composition according to claim 1 , wherein the styrene-based polymer is a polystyrene resin having a weight average molecular weight of 10 claim 1 ,000 to 300 claim 1 ,000 g/mol and a styrene content of 93 to 100% by weight.5. The non-halogen flame retardant resin composition according to claim 1 , wherein the vinyl cyan compound-conjugated diene compound-vinyl aromatic compound copolymer is a graft copolymer having a seed-shell structure comprising a seed comprising a conjugated diene-based ...

Thermoplastic Resin Composition and Molded Product Including Same

A thermoplastic resin composition includes a base resin including (A) about 16 to about 73 wt % of polyphenylene ether; (B) about 18 to about 82 wt % of polyamide; and (C) about 1 to about 20 wt % of a polyethylene-based polymer; (D) about 0.05 to about 1 part by weight of a multi-functional compatibilizer having at least two carboxyl groups and (E) about 0.05 to about 1 part by weight of a multi-functional compatibilizer having a carboxyl group or an acid anhydride group along with a carbon-carbon double bond, based on about 100 parts by weight of the base resin. 1. A thermoplastic resin composition , comprising:a base resin comprising (A) about 16 to about 73 wt % of polyphenylene ether; (B) about 18 to about 82 wt % of polyamide; and (C) about 1 to about 20 wt % of a polyethylene-based polymer;(D) about 0.05 to about 1 part by weight based on about 100 parts by weight of the base resin of a multi-functional compatibilizer having at least two carboxyl groups; and(E) about 0.05 to about 1 part by weight based on about 100 parts by weight of the base resin of a multi-functional compatibilizer having a carboxyl group or an acid anhydride group along with a carbon-carbon double bond.2. The thermoplastic resin composition of claim 1 , wherein the polyphenylene ether (A) has a number average molecular weight of about 9 claim 1 ,000 to about 50 claim 1 ,000 g/mol and a polydispersity index of about 1.0 to about 2.5 claim 1 , and the polyamide (B) has a number average molecular weight of about 3 claim 1 ,000 to about 50 claim 1 ,000 g/mol and polydispersity index of about 1.0 to about 5.0.3. The thermoplastic resin composition of claim 1 , wherein the polyethylene-based polymer (C) has a weight average molecular weight of about 10 claim 1 ,000 to about 300 claim 1 ,000 g/mol.4. The thermoplastic resin composition of claim 1 , wherein the polyethylene-based polymer (C) comprises high density polyethylene (HDPE) claim 1 , linear low density polyethylene (LLDPE) claim 1 , ...