Flammfestes Hydrauliköl

EPOXY RESIN COMPOSITION FOR FIBER-REINFORCED COMPOSITE MATERIAL

Provided is an epoxy resin composition for fiber-reinforced composite materials, which serves as a matrix resin for a prepreg. This epoxy resin composition is improved in tackiness stability during storage, while maintaining mechanical characteristics. The epoxy resin composition for fiber-reinforced composite materials is characterized by containing 25 to 50 parts by weight of an amine curing agent (B) selected from aliphatic polyamines, alicyclic polyamines and aromatic polyamines, and 1 to 20 parts by weight of an organic acid dihydrazide compound (C) having a melting point of not less than 150°C, per 100 parts by weight of an epoxy resin (A).

EPOXY RESIN COMPOSITION FOR FIBER-REINFORCED COMPOSITE MATERIAL

Disclosed is an epoxy resin composition for fiber-reinforced composite materials, which serves as a matrix resin for a prepreg. This epoxy resin composition is improved in tackiness stability during storage, while maintaining mechanical characteristics. The epoxy resin composition for fiber-reinforced composite materials is characterized by containing 25-50 parts by weight of an amine curing agent (B) selected from aliphatic polyamines, alicyclic polyamines and aromatic polyamines, and 1-20 parts by weight of an organic acid dihydrazide compound (C) having a melting point of not less than 150~C, per 100 parts by weight of an epoxy resin (A).

EPOXY RESIN COMPOSITION FOR FIBER-REINFORCED COMPOSITE MATERIAL, METHOD FOR PRODUCING EPOXY RESIN COMPOSITION FOR FIBER-REINFORCED COMPOSITE MATERIAL, PREPREG, AND HONEYCOMB PANEL

The present technology provides an epoxy resin composition for a fiber-reinforced composite material, a method for producing an epoxy resin composition for a fiber-reinforced composite material, a prepreg, and a honeycomb panel. The epoxy resin composition for a fiber-reinforced composite material of the present technology contains: a reaction product obtained by reacting 100 parts by mass of a phosphorus-containing epoxy resin containing a phosphorus atom in the backbone thereof, and not less than 5 parts by mass and not greater than 20 parts by mass of an amino-terminated butadiene-acrylonitrile rubber; an epoxy resin other than the phosphorus-containing epoxy resin; a curing agent; and a curing accelerator.

VAPORIZER

PROBLEM TO BE SOLVED: To provide a vaporizer which is capable of preventing a solid CVD material from separating out at or attaching to a CVD material feed unit, the CVD material exhaust nozzle of a vaporizing chamber, and its vicinity and vaporizing and supplying the solid CVD material very efficiently with desired concentration at a desired flow rate when a solid CVD material is vaporized and supplied for a long term. SOLUTION: The CVD material feed unit is equipped with a first flow path where the CVD material flows through, a second flow path where a carrier gas flows through, a third flow path through which the CVD material and the carrier gas that have joined together as flowing through the first flow path and the second flow path are spouted out into the vaporizing chamber, and a fourth flow path through which the carrier gas is spouted out into the vaporizing chamber from the periphery of the exhaust nozzle of the third flow path to the vaporizing chamber. Or, the CVD material supply ...

INTRAORAL CAMERA

PROBLEM TO BE SOLVED: To increase convenience relating to an intraoral camera. SOLUTION: The intraoral camera includes: a body case 1; an imaging window 3a; an illuminating element 9; a diaphragm driving unit 14; a focal lens 11 optically connected to the diaphragm driving unit 14; an imaging unit 10 optically connected to a back side of the focal lens 11; and a controller 19 for receiving image data of the imaging unit 10. The focal lens 11 includes an autofocus driving unit 12. The controller 19 includes a contrast determination unit 20 and an imaged part determining unit 21. The contrast determination unit 20 determines that the image data have low contrast. When the imaged part determining unit 21 determines that an imaging unit of the image data is in the oral cavity, the autofocus driving unit 12 moves a focus position of the focal lens 11 to a proximate imaging position. COPYRIGHT: (C)2011,JPO&INPIT ...

Thermosetting resin composition, thermosetting resin composition for fiber-reinforced composite material, prepreg using the same, and honeycomb sandwich panel

Disclosed is a thermosetting resin composition with superior toughness. The thermosetting resin composition comprises a thermosetting resin and an adsorbing filler in which a thermoplastic resin (C) has been adsorbed into a filler, and satisfies an adsorption coefficient in the range of higher than 0 to 0.8 that is defined below (formula 1). (Formula 1) adsorption coefficient = amount of aforementioned thermoplastic resin (C) (parts by mass) adsorbed in 100 parts by mass of aforementioned filler / specific gravity of aforementioned thermoplastic resin (C) / DBP oil absorption (mL/100g) of aforementioned filler ...

EPOXY RESIN COMPOSITION FOR FIBER-REINFORCED COMPOSITE MATERIAL

Disclosed is an epoxy resin composition for fiber-reinforced composite materials, which serves as a matrix resin composition used for a self-adhesive prepreg for face sheet of honeycomb panel. The epoxy resin composition enables to increase self-adhesiveness of the prepreg, while improving workability and appearance quality of the prepreg. Specifically disclosed is an epoxy resin composition for fiber-reinforced composite materials, which is characterized by containing an epoxy resin (A) which is in a liquid state at room temperature, a thermoplastic resin (B) which dissolves in the epoxy resin (A) at a temperature not less than 90~C, thermosetting resin particles (C) which do not completely dissolve in the epoxy resin (A) at a temperature less than 90~C and has a softening point of not less than 120~C, and a curing agent (D).

Flare nut and refrigerant pipe set, air conditioner, and freezer including the same

A flare nut includes a nut main body having a outer surface and a circular cylinder portion provided so as to extend from the nut main body to one opening end of an insertion hole along the insertion hole in a circular cylindrical shape having a major diameter smaller than the nut main body.

INTRAORAL CAMERA

PROBLEM TO BE SOLVED: To provide an intraoral camera for dental surgery or the like, improving the convenience of the intraoral camera. SOLUTION: In order to accomplish the object, this intraoral camera includes: a camera body 1 provided with an image pickup window 3a for imaging a subject; and a control pattern 20 provided in a position opposite to the image pickup window 3a. A recognizing part 21 for identifying/recognizing the control pattern 20 and a control part 22 for conducting predetermined control according to the identification/recognition result of the recognizing part are provided in the interior of the camera body 1. COPYRIGHT: (C)2011,JPO&INPIT ...

EPOXY RESIN COMPOSITION FOR FIBER-REINFORCED COMPOSITE MATERIAL

PROBLEM TO BE SOLVED: To provide an epoxy resin composition for a fiber-reinforced composite material imparting a cured product with high toughness. SOLUTION: The epoxy resin composition comprises (A) the epoxy resin containing an epoxy resin (a3) which is obtained by reacting (a1) an epoxy resin with ≤1,000 of the weight average molecular weight, (a2) an epoxy resin with 10,000-100,000 of the weight average molecular weight and (C) a curing agent, in an extent wherein a part of the epoxy resin (a1), a part or whole of the epoxy resin (a2) and a part of the curing agent (C) are previously reacted, and the rest of the epoxy resin (a1), a thermoplastic resin (B) and the rest of the curing agent (C), wherein the morphology of the epoxy resin composition after curing has the co-continuous phases of the epoxy resin (A) and the thermoplastic resin (B) and/or the continuous phases of the thermoplastic resin (B). COPYRIGHT: (C)2008,JPO&INPIT ...

Verfahren zum Beeinflussen des Gierverhaltens eines Fahrzeugs

Verfahren zum Beeinflussen des Gierverhaltens eines Fahrzeugs, wobei das Fahrzeug ein rechtes und linkes Rad umfaßt, umfassend die folgenden Schritte: a) Bestimmen einer Längsbeschleunigung (Xg) des Fahrzeugs, b) Bestimmen einer Querbeschleunigung (Yg) des Fahrzeugs, c) Ermitteln eines Produkts aus Längs- und Querbeschleunigung (Xg, Yg), d) beruhend auf dem ermittelten Produkt, Bestimmen der Größe einer zur Beeinflussung des Gierverhaltens an einem von linkem und rechtem Rad zu erzeugenden Antriebskraft und der Größe einer zum Beeinflussen des Gierverhaltens an dem anderen von linkem und rechtem Rad zu erzeugenden Bremskraft, e) Erzeugen einer Antriebskraft an dem einen Rad entsprechend der bestimmten Größe der Antriebskraft und Erzeugen einer Bremskraft an dem anderen Rad entsprechend der bestimmten Größe der Bremskraft.

Thermosetting resin composition, thermosetting resin composition for fiber-reinforced composite material, prepreg using the same, and honeycomb sandwich panel

Disclosed is a thermosetting resin composition with superior toughness. The thermosetting resin composition comprises a thermosetting resin and an adsorbing filler in which a thermoplastic resin (C) has been adsorbed into a filler, and satisfies an adsorption coefficient in the range of higher than 0 to 0.8 that is defined below (formula 1). (Formula 1) adsorption coefficient = amount of aforementioned thermoplastic resin (C) (parts by mass) adsorbed in 100 parts by mass of aforementioned filler / specific gravity of aforementioned thermoplastic resin (C) / DBP oil absorption (mL/100g) of aforementioned filler ...

Epoxy resin composition for fiber-reinforced composite material, method for producing epoxy resin composition for fiber-reinforced composite material, prepreg, and honeycomb panel

Provided are: an epoxy resin composition for a fiber-reinforced composite material with which it is possible to obtain a cured article having exceptional adhesiveness to a honeycomb core, the epoxy resin composition being curable at low temperatures and having exceptional flame retardancy and storage stability; a method for producing an epoxy resin composition for a fiber-reinforced composite material; a prepreg; and a honeycomb panel. The epoxy resin composition for a fiber-reinforced composite material of the present invention is characterized by containing: a reaction product obtained by reacting 100 parts by mass of a phosphorus-containing epoxy resin that contains a phosphorus atom in the backbone, and 5-20 parts by mass of an amino group-terminated butadiene-acrylonitrile rubber; an epoxy resin other than a phosphorus-containing epoxy resin; a curing agent; and a curing accelerator.

CYANATE ESTER RESIN COMPOSITION AND PREPREG

The purpose of the present invention is to provide a cyanate ester resin composition such that resin flow when heated to cure can be suppressed without the addition of a thermoplastic resin to control viscosity, resin defects and uneven thickness are eliminated, and excellent workability is exhibited. The composition comprises (A) a cyanate ester resin, (B) a curing agent or a curing accelerator, (C) silica microparticles, and (D) core shell rubber particles, the amounts of (C) the silica microparticles and (D) the core shell rubber particles are, respectively, 1 to 5 parts by mass and 2 to 10 parts by mass with respect to 100 parts by mass of (A) the cyanate ester resin, and the mass ratio (C)/(D) of the (C) the silica microparticles to (D) the core shell rubber particles is 1/1 to 1/5.

EPOXY RESIN COMPOSITION FOR FIBER-REINFORCED COMPOSITE MATERIAL

The present invention is an epoxy resin composition for a fiber-reinforced composite material, which comprises a phosphorous-containing epoxy resin that contains phosphorous in the skeleton thereof, a dicyandiamide, and a curing promoter comprising at least one compound selected from 1,1'-(4-methyl-1,3-phenylene)bis(3,3-dimethylurea), phenyl-dimethylurea represented by formula (1) and methylene-diphenyl-bisdimethylurea represented by formula (2), and which is characterized in that the content of phosphorous in the phosphorous-containing epoxy resin is 1.0 to 5.0 mass% inclusive in the epoxy resin composition.

Epoxy resin composition for fiber-reinforced composite material

Provided is an epoxy resin composition for fiber-reinforced composite materials, which serves as a matrix resin composition for use in a self-adhesive prepreg for a face sheet of a honeycomb panel. The epoxy resin composition enables to increase self-adhesiveness of the prepreg, while improving workability and appearance quality of the prepreg. The epoxy resin composition is characterized by containing: an epoxy resin (A) which is in a liquid state at room temperature; a thermoplastic resin (B) which dissolves in the epoxy resin (A) at a temperature not less than 90 DEG C; thermosetting resinparticles (C) which do not completely dissolve in the epoxy resin (A) at a temperature less than 90 DEG C and has a softening point of not less than 120 DEG C; and a curing agent (D).

VAPORIZER WITH PROTRUDED DOUBLE STRUCTURAL EJECTION TUBE

PURPOSE: A vaporizer is provided to restrain the precipitation and adhesion of a solid CVD(Chemical Vapor Deposition) material near an ejection port by using an ejection tube of double structure protruded toward a vaporization chamber. CONSTITUTION: A vaporizer includes a vaporization chamber(1) for vaporizing a CVD material, a CVD material supply part(2) for supplying the CVD material to the vaporization chamber, a vaporized gas exhaust port(3), a heating part(4) for heating the vaporization chamber, and an ejection tube(8) of double structure. The ejection tube includes an inner tube for ejecting the CVD material and an outer tube for ejecting carrier gas. The outer tube include a reducer-type end portion. The inner and outer tubes are protruded toward the vaporization chamber. © KIPO 2005 ...

EPOXY RESIN COMPOSITION FOR FIBER-REINFORCED COMPOSITE MATERIAL

An epoxy resin composition for fiber-reinforced composite materials which is improved in toughness necessary for improving the strength of self-adhesion of a matrix resin for use in a prepreg for a face plate of a honeycomb panel. The epoxy resin composition comprises an epoxy resin (A), a thermoplastic resin (B), fine solid resin particles (C), and a curing agent (D), and is characterized in that the epoxy resin composition, through curing, comes into a state in which the epoxy resin (A) and the thermoplastic resin (B) form co-continuous phases and the fine solid resin particles (C) are dispersed in at least the continuous phase of the epoxy resin (A) of the co-continuous phases. © KIPO & WIPO 2009 ...

Flammfestes Hydrauliköl

Wärmeleitende Silikonkautschukzusammensetzung

Epoxy resin composition for fiber-reinforced composite material, prepreg and fiber-reinforced composite material

In the present invention, in order to provide an epoxy resin composition for a fiber-reinforced composite material that exhibits excellent heat resistance, toughness and workability, 8-15 parts by mass of (C) a thermoplastic resin, 2-10 parts by mass of (D) elastomer fine particles having an average particle diameter of 1000 nm or less, and 0.5-2.5 parts by mass of (E) silica fine particles having an average particle diameter of 1000 nm or less are blended with 100 parts by mass of an epoxy resin component constituted from: 60-85 parts by mass of (A) a N,N,N',N'-tetraglycidyl diaminodiphenylmethane resin having a viscosity at 50°C of 6000 mPa·s or less; and 15-40 parts by mass of (B) a liquid bisphenol A type epoxy resin having a viscosity at 25ºC of 20,000 mPa·s or less.

Epoxy resin composition for fiber-reinforced composite material

EPOXY RESIN COMPOSITION FOR FIBER-REINFORCED COMPOSITE MATERIAL, PREPREG AND FIBER-REINFORCED COMPOSITE MATERIAL

In the present invention, in order to provide an epoxy resin composition for a fiber-reinforced composite material that exhibits excellent heat resistance, toughness and workability, 8-15 parts by mass of (C) a thermoplastic resin, 2-10 parts by mass of (D) elastomer fine particles having an average particle diameter of 1000 nm or less, and 0.5-2.5 parts by mass of (E) silica fine particles having an average particle diameter of 1000 nm or less are blended with 100 parts by mass of an epoxy resin component constituted from: 60-85 parts by mass of (A) a N,N,N',N'-tetraglycidyl diaminodiphenylmethane resin having a viscosity at 50°C of 6000 mPa·s or less; and 15-40 parts by mass of (B) a liquid bisphenol A type epoxy resin having a viscosity at 25ºC of 20,000 mPa·s or less.

EPOXY RESIN COMPOSITION FOR FIBER-REINFORCED COMPOSITE MATERIAL

The present invention is an epoxy resin composition for a fiber-reinforced composite material comprising a phosphorus-containing epoxy resin containing phosphorus in the skeleton thereof, a dicyandiamide, and a curing accelerator containing at least one selected from 1,1'-(4-methyl-1,3-phenylene)bis(3,3-dimethylurea), phenyl-dimethylurea represented by the following formula (1), and methylene-diphenyl-bisdimethylurea represented by the following formula (2); wherein the phosphorus content of the phosphorus-containing epoxy resin is at least 1.0 mass% and at most 5.0 mass% in the epoxy resin composition. Formula 1 (see formula 1) (see formula 2) ...

Process for Controlling Yaw Moment in Vehicle

A process for controlling a yaw moment in a vehicle by generating a braking force in one of the left and right wheels of the vehicle and by generating a driving force in the other wheel. When a vehicle is accelerated during the turning thereof, grounding loads of rear wheels are increased in order to generate a yaw moment in a direction opposite from a turning direction. However, such yaw moment can be eliminated in order to enhance the turning performance by bringing one of the hydraulic clutches into an engaged state with a torque which is proportional to a product of longitudinal and lateral accelerations. Consequently, a braking force and a driving force in inner and outer wheels during turning of the vehicle, respectively, are generated. When the vehicle is decelerated during turning thereof, grounding loads of front wheels are increased to a yaw moment in the same direction as the turning direction. However, such yaw moment can be eliminated in order to enhance the high-speed stable performance by bringing one of the hydraulic clutches into an engaged state with a torque which is proportional to longitudinal and lateral accelerations. Thus, when the vehicle is accelerated or decelerated during the turning thereof, the generation of an undesired yaw moment can be avoided in order to insure the turning performance and the high-speed stable performance.

Epoxy resin compositions for fiber-reinforced composite materials

Thermally conductive silicone grease composition

Provided is a thermally conductive silicone grease composition that comprises: (A) an organopolysiloxane having a specific kinematic viscosity; (B) an organopolysiloxane having a specific kinematic viscosity; (C) a spherical aluminum oxide powder which has a specific average sphericity, a specific number of surface hydroxyl groups, and a specific average particle size, and for which the proportion of coarse particles in a laser diffraction type particle size distribution of 25 to 45 [mu]m is within a specific range; and (D) a spherical and/or amorphous zinc oxide powder which has a specific average particle size, and for which the proportion of coarse particles in a laser diffraction type particle size distribution of 25 to 45 [mu]m is within a specific range. The composition has a thermal conductivity measured by the hot disk method conforming to ISO 22007-2 of 2 W/m.K or more and less than 5.5 W/m.K, has a coefficient of viscosity measured by a spiral viscometer at a rotation frequency ...

ADHESIVE SILICONE RUBBER COATING AGENT COMPOSITION

PROBLEM TO BE SOLVED: To provide a silicone rubber coating agent composition enabling adhesion to a base material and giving its surface stable and permanent tackiness. SOLUTION: The self-adhesive silicone rubber coating agent composition comprises (A) 100 pts.mass of an organopolysiloxane having in one molecule two or more, on average, of silicon atom-bound alkenyl groups, (B) 1-50 pts.mass of an organopolysiloxane resin represented by the average unit formula: (R13SiO1/2)x(SiO4/2)1.0 (wherein, R1 is a substituted or nonsubstituted monovalent hydrocarbon group; and x is 0.5-1.3), (C) an organohydrogenpolysiloxane having in one molecule at least two SiH groups in such an amount that the SiH groups stand at 0.5-7 mol per mol of the alkenyl groups in the components A and B, (D) an effective amount of an addition reaction catalyst and (E) 0.1-10 pts.mass of an adhesiveness-imparting agent. This silicone rubber coating agent gives a cured product with tackiness of greater than 2 gf. COPYRIGHT ...

RESIN MEMBER RECYCLING METHOD

PROBLEM TO BE SOLVED: To provide a simple resin member recycling method with excellent workability, high effect, and capable of cleaning a resin member without impairing the gloss or pear-like touch of the resin member. SOLUTION: A wet blast method is used to clean the resin member in recycling the resin member 3, and spherical glass beads are used for grinding material 2. When the resin member is formed of ABS resin, the spherical glass beads are 50-250 μm in grain size, preferably, 75-200 μm, the ejection pressure is 0.5-4.0 kgf/cm2, preferably, 2.0-3.0 kgf/cm2, the cleaning time is shortened, and the productivity and the display condition maintaining characteristic are improved. COPYRIGHT: (C)2001,JPO ...

CLEANING AGENT AND CLEANING METHOD OF TOXIC GAS

PROBLEM TO BE SOLVED: To provide the cleaning agent and the cleaning method of toxic gas in a dry type cleaning method of gas containing silicon chlorides as toxic components, safely removing silicon the chlorides from treating object gas, even in cleaning in a condition with possibility of the temperature of the cleaning agent getting high when cleaning. SOLUTION: This cleaning method is performed by using a cleaning agent containing total 70 wt.% or more of basic copper carbonate and zinc oxide and 5-50 wt.% of zinc oxide, a cleaning agent containing total 70 wt.% or more of basic copper carbonate and basic zinc carbonate and 5-40 wt.% of basic copper carbonate, or a cleaning agent containing total 70 wt.% or more of basic copper carbonate and zinc hydroxide and 5-50 wt.% of zinc hydroxide. COPYRIGHT: (C)2008,JPO&INPIT ...

VAPORIZER AND DEVICE FOR VAPORIZING/FEEDING

PROBLEM TO BE SOLVED: To provide a vaporizer and a device for feeding a gaseous CVD raw material into a chemical vapor deposition(CVD) apparatus used for manufacturing semiconductor and the like, which efficiently vaporize and feed the material at a desired concentration and flow rate, without causing precipitation and deposition of the solid CVD raw material at a raw material supply port, even when a solid CVD raw material is used. SOLUTION: The vaporizer is characterized in that a contacting part of a CVD raw-material feeding part with the CVD raw material is composed of a corrosion resistant synthetic resin. The device for vaporizing/feeding comprises the above vaporizer, and a cooler for cooling a metal component of the CVD raw-material feeding part, when heating a vaporizing chamber. COPYRIGHT: (C)2003,JPO ...

KNEADER

【課題】混練材料の供給終了後に、送出し用材料を使用することなく混練中の混練材料を混練しながら送ることを可能し、それにより剥がし作業を不要にして作業性を改善することができる混練装置を提供する。 【解決手段】回転可能な２本の混練ロール７，９を並設し、回転する２本の混練ロール７，９の混練部７Ａ，９Ａ間のバンク１５に供給した混練材料１７を一方の混練ロール７の混練部７Ａに巻き付けつつ、ロール軸方向に一方側から他方側に送りながら混練する混練装置１である。一方の混練ロール７の混練部７Ａに巻き付けられた混練材料１７を押しながら一方側から他方側に送り込む材料送込み手段８０がロール軸方向に沿って往復移動可能に設置されている。 【選択図】図１

CYANATE ESTER RESIN COMPOSITION AND PREPREG

The purpose of the present invention is to provide a cyanate ester resin composition such that resin flow when heated to cure can be suppressed without the addition of a thermoplastic resin to control viscosity, resin defects and uneven thickness are eliminated, and excellent workability is exhibited. The composition comprises (A) a cyanate ester resin, (B) a curing agent or a curing accelerator, (C) silica microparticles, and (D) core shell rubber particles, the amounts of (C) the silica microparticles and (D) the core shell rubber particles are, respectively, 1 to 5 parts by mass and 2 to 10 parts by mass with respect to 100 parts by mass of (A) the cyanate ester resin, and the mass ratio (C)/(D) of the (C) the silica microparticles to (D) the core shell rubber particles is 1/1 to 1/5.

ORGANOPOLYSILOXANE COMPOSITION FOR MATTING A SURFACE, WHICH COMPRISES A THERMOSETTING LIQUID ORGANOPOLYSILOXANE COMPOSITION AND HOLLOW FILLERS, AND A CURED PRODUCT

PURPOSE: An organopolysiloxane composition for mattifying a surface is provided to obtain a cured product having a matt surface and useful as a molding or coating material for electric or electronic devices, with no need for an additional step for mechanically roughening the surface. CONSTITUTION: An organopolysiloxane composition for mattifying a surface comprises: (A) 100 parts by weight of a thermosetting liquid organopolysiloxane composition; and (B) 0.1-100 parts by weight of hollow fillers having a melting point of 150 deg.C or higher, a specific gravity of 0.01-0.8 and a particle size of 200 micrometers or less. The organopolysiloxane composition has a viscosity of 100-100,000 mPa·s at room temperature, and the resultant cured product has a surface gloss of 40 or less. © KIPO 2008 ...

CURABLE SILICONE RESIN COMPOSITION, CURED PRODUCT THEREOF AND PHOTOSEMICONDUCTOR APPARATUS

The present invention is curable silicone resin composition which is an addition-curable silicone composition, and comprises: 3. The curable silicone resin composition according to claim 1 , wherein Component (D) is silicone powder containing a polyorganosilsesquioxane resin.4. The curable silicone resin composition according to claim 2 , wherein Component (D) is silicone powder containing a polyorganosilsesquioxane resin.5. The curable silicone resin composition according to claim 1 , wherein m=0 and n=2 in the CF—(CF)—(CH)— group.6. The curable silicone resin composition according to claim 2 , wherein m=0 and n=2 in the CF—(CF)—(CH)— group.7. The curable silicone resin composition according to claim 3 , wherein m=0 and n=2 in the CF—(CF)—(CH)— group.8. The curable silicone resin composition according to claim 4 , wherein m=0 and n=2 in the CF—(CF)—(CH)— group.11. The curable silicone resin composition according to claim 3 , wherein Component (B) is an organohydrogen polysiloxane represented by the following average compositional formula (2) claim 3 ,{'br': None, 'sup': '3', 'sub': a′', 'b', '(4-a′-b)/2, 'RHSiO\u2003\u2003(2)'}{'sup': '3', 'wherein Rs may be the same or different from each other, and each represent a substituted or unsubstituted silicon atom-bonded monovalent hydrocarbon group other than an aliphatic unsaturated group, and “a′” and “b” are each a positive number satisfying 0.7≦a′≦2.1, 0.001≦b≦1.0, and 0.8≦a′+b≦3.0.'}17. The curable silicone resin composition according to claim 1 , wherein the curable silicone resin composition is used as a material for encapsulating a photosemiconductor device.18. A cured product which comprises a material obtained by curing the curable silicone resin composition according to .19. A photosemiconductor apparatus which comprises encapsulating a photosemiconductor device by using the curable silicone resin composition according to and curing by heating. The present invention relates to a curable silicone resin ...

LIQUID SILICONE RUBBER COATING COMPOSITION, CURTAIN AIRBAG AND METHOD FOR PRODUCING THE SAME

PROBLEM TO BE SOLVED: To provide a liquid silicone rubber coating composition excellent in adhesion to base fabric of an airbag, and to provide a curtain airbag having a silicone rubber coated layer composed of the cured product of the composition on at least one side of the base material, and to provide a method for producing the same. SOLUTION: The liquid silicone rubber coating composition comprises (A) an organopolysiloxane having at least two alkenyl groups coupling with silicon atoms in the molecule, (B) an organohydrogenpolysiloxane having at least two hydrogen atoms coupling with silicon atoms in the molecule, (C) an addition reaction catalyst, (E) triallylisocyanurate, (F) an organic silicon compound having an epoxy group and an alkoxy group coupling with silicon atom in the molecule, (G) a titanium compound or a zirconium compound, and preferably, (D) fine silica powder having ≥50 m2/g of specific surface area. COPYRIGHT: (C)2007,JPO&INPIT ...

Cyanate ester resin composition and prepreg

The purpose of the present invention is to provide a cyanate ester resin composition such that resin flow when heated to cure can be suppressed without the addition of a thermoplastic resin to control viscosity, resin defects and uneven thickness are eliminated, and excellent workability is exhibited. The composition comprises (A) a cyanate ester resin, (B) a curing agent or a curing accelerator, (C) silica microparticles, and (D) core shell rubber particles, the amounts of (C) the silica microparticles and (D) the core shell rubber particles are, respectively, 1 to 5 parts by mass and 2 to 10 parts by mass with respect to 100 parts by mass of (A) the cyanate ester resin, and the mass ratio (C)/(D) of the (C) the silica microparticles to (D) the core shell rubber particles is 1/1 to 1/5.

PROCESS FOR CONTROLLING YAW MOMENT IN VEHICLE

A process for controlling a yaw moment in a vehicle by generating a braking force in one of the left and right wheels of the vehicle and by generating a driving force in the other wheel. When a vehicle is accelerated during the turning thereof, grounding loads of rear wheels are increased in order to generate a yaw moment in a direction opposite from a turning direction. However, such yaw moment can be eliminated in order to enhance the turning performance by bringing one of the hydraulic clutches into an engaged state with a torque which is proportional to a product of longitudinal and lateral accelerations. Consequently, a braking force and a driving force in inner and outer wheels during turning of the vehicle, respectively, are generated. When the vehicle is decelerated during turning thereof, grounding loads of front wheels are increased to a yaw moment in the same direction as the turning direction. However, such yaw moment can be eliminated in order to enhance the high-speed stable performance by bringing one of the hydraulic clutches into an engaged state with a torque which is proportional to longitudinal and lateral accelerations. Thus, when the vehicle is accelerated or decelerated during the turning thereof, the generation of an undesired yaw moment can be avoided in order to insure the turning performance and the high-speed stable performance.

EPOXY RESIN COMPOSITION FOR FIBER-REINFORCED COMPOSITE MATERIAL

Provided is an epoxy resin composition for fiber-reinforced composite materials, which serves as a matrix resin composition for use in a self-adhesive prepreg for a face sheet of a honeycomb panel. The epoxy resin composition enables to increase self-adhesiveness of the prepreg, while improving workability and appearance quality of the prepreg. The epoxy resin composition is characterized by containing: an epoxy resin (A) which is in a liquid state at room temperature; a thermoplastic resin (B) which dissolves in the epoxy resin (A) at a temperature not less than 90°C; thermosetting resin particles (C) which do not completely dissolve in the epoxy resin (A) at a temperature less than 90°C and has a softening point of not less than 120°C; and a curing agent (D).

Flame retardant hydraulic oil containing a partial ester of a polyol and a monocarboxylic acid

Disclosed herein is a flame retardant hydraulic oil excellent in the flame retardancy, unaccompanied by the dangers of pinhole fire at sites of use and giving rise to no environmental contamination.This flame retardant hydraulic oil contain a hydraulic base oil comprising as the essential component an polyol partial ester which is a product formed by reacting (A) a polyol having a total of 6 to 22 carbon atoms and a total of 3 to 6 hydroxyl groups with (B) an acyclic monocarboxylic acid having a total of 6 to 22 carbon atoms. Said polyol partial ester has a hydroxyl value of 35 mg KOH/g or more, a flash point of 290° C. or higher and an average molecular weight of 600 to 1,500.

Epoxy resin composition for fiber-reinforced composite material

EPOXY RESIN COMPOSITION FOR FIBER-REINFORCED COMPOSITE MATERIAL, METHOD FOR PRODUCING EPOXY RESIN COMPOSITION FOR FIBER-REINFORCED COMPOSITE MATERIAL, PREPREG, AND HONEYCOMB PANEL

Provided are: an epoxy resin composition for a fiber-reinforced composite material with which it is possible to obtain a cured article having exceptional adhesiveness to a honeycomb core, the epoxy resin composition being curable at low temperatures and having exceptional flame retardancy and storage stability; a method for producing an epoxy resin composition for a fiber-reinforced composite material; a prepreg; and a honeycomb panel. The epoxy resin composition for a fiber-reinforced composite material of the present invention is characterized by containing: a reaction product obtained by reacting 100 parts by mass of a phosphorus-containing epoxy resin that contains a phosphorus atom in the backbone, and 5-20 parts by mass of an amino group-terminated butadiene-acrylonitrile rubber; an epoxy resin other than a phosphorus-containing epoxy resin; a curing agent; and a curing accelerator.

Substrate for optical semiconductor device and method for manufacturing the same, and optical semiconductor device and method for manufacturing the same

[課題]以提供一種：採用使用有金屬導線之散熱特性為優良的構造，而可實現光半導體裝置之薄型化的光半導體裝置用基板，以及能夠以低成本而容易地製造出該光半導體裝置用基板之製造方法，還有使用有該基板之光半導體裝置，以及該光半導體裝置之製造方法。[解決手段]一種光半導體裝置用基板，係搭載光半導體元件，並具備有與該光半導體元件之第1電極作電性連接的第1導線、和與前述光半導體元件之第2電極作電性連接的第2導線，該光半導體裝置用基板，其特徵為：係為在分別並聯性地作了複數配置之前述第1導線和前述第2導線之間的作了貫通之空隙中，藉由注入成形而成形熱硬化性樹脂組成物之成形體而形成為板狀者，前述第1導線、前述第2導線以及前述樹脂成形體之表背兩面的各別之露出了的表面，係位於同一平面上。

VAPORIZER AND VAPOR FEEDING APPARATUS

PROBLEM TO BE SOLVED: To provide a vaporizer in which a separation and deposition of a solid CVD (chemical vapor deposition) material in a vaporization chamber can be prevented and a vapor feeding can be very efficiently carried out in a desired concentration and flow even if the vapor feeding is carried out decreasing a flow of a carrier gas fed with the CVD material, and a vapor feeding apparatus. SOLUTION: A CVD material feeding potion includes the flow path of the material, the flow path of the carrier gas, and a mixing flow path, which is located downstream of those flow pathes joined, communicated with the vaporizer. The vaporizer includes a means by which the flow path of the CVD material causes a pressure loss of the CVD material. The vapor feeding apparatus is equipped with a means, which causes the pressure loss of the CVD material, between a liquid flow control portion and the vaporizer. COPYRIGHT: (C)2004,JPO ...

APPARATUS AND METHOD FOR VAPORIZING LIQUID MATERIAL

PROBLEM TO BE SOLVED: To provide a vaporizer and a vaporization method for stably and efficiently vaporizing a liquid material, such as a CVD material and an etching material without using an apparatus in a complex configuration with desired concentration and flow rate for supplying to a semiconductor manufacturing apparatus. SOLUTION: The vaporizer has the supply pipe of the liquid material, a first gas supply pipe, and a second gas supply pipe. The liquid material is jetted into the first gas supply pipe and the mixture of the material, and the first gas is jetted into the second gas supply pipe. Additionally, the liquid material is jetted out to the flow of the first gas, and further the mixture of the material and the first gas is jetted out to the flow of the second gas for vaporization. COPYRIGHT: (C)2005,JPO&NCIPI ...

ADHESIVE FOR OPTICAL SEMICONDUCTOR DEVICE, ADHESIVE SHEET FOR OPTICAL SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING ADHESIVE SHEET FOR OPTICAL SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING OPTICAL SEMICONDUCTOR DEVICE

【課題】光半導体装置を効率よく製造でき、特にＬＥＤ、ＬＤをはじめとした光半導体素子を光半導体装置の素子取付部に固定するまでの作業を効率よく行うことができ、光半導体装置の製造の生産性を高めることができる光半導体装置用接着剤、光半導体装置用接着剤シート、光半導体装置用接着剤シートの製造方法、及び光半導体装置の製造方法を提供する。 【解決手段】ウエーハから切り出されソーティングされた光半導体素子を基材シート２上からピックアップし、前記光半導体素子を光半導体装置内の素子取付部に搭載した後、前記光半導体素子を前記素子取付部に硬化接着するために用いる光半導体装置用接着剤１であって、フィルム状に成形されており、基材シート２上に配置されており、基材シート２から剥離できるものである。 【選択図】図１

Epoxy resin composition for fiber-reinforced composite material, prepreg and fiber-reinforced composite material

In the present invention, in order to provide an epoxy resin composition for a fiber-reinforced composite material that exhibits excellent heat resistance, toughness and workability, 8-15 parts by mass of (C) a thermoplastic resin, 2-10 parts by mass of (D) elastomer fine particles having an average particle diameter of 1000 nm or less, and 0.5-2.5 parts by mass of (E) silica fine particles having an average particle diameter of 1000 nm or less are blended with 100 parts by mass of an epoxy resin component constituted from: 60-85 parts by mass of (A) a N,N,N',N'-tetraglycidyl diaminodiphenylmethane resin having a viscosity at 50°C of 6000 mPa·s or less; and 15-40 parts by mass of (B) a liquid bisphenol A type epoxy resin having a viscosity at 25ºC of 20,000 mPa·s or less.

Liquid organopolysiloxane composition for matting and cured article having a matted surface

Two part adhesive for silicone rubber which cures by addition reaction

A two part adhesive for a silicone rubber which cures by addition reaction is provided. This adhesive containing a calcium carbonate powder cures by hydrosilylation, and this adhesive experiences reduced viscosity change in the long term storage. Accordingly, this adhesive can be homogeneously mixed to realize the designed physical properties of the silicone rubber as well as good adhesion to the silicone rubber. This adhesive contains (A) an alkenyl group-containing diorganopolysiloxane; (B) an organohydrogenpolysiloxane; (C) a calcium carbonate powder having its surface treated with a paraffin compound; (D) an inorganic powder of a member selected from quartz, aluminum hydroxide, diatomaceous earth, alumina, titanium dioxide, zinc oxide, iron oxide, magnesium carbonate, and carbon black; and (E) a hydrosilylation catalyst. Of the two parts, the composition (I) contains the components (A), (C), (E), and optionally (D) without (B), and the composition (II) contains the components (A), ( ...

Epoxy Resin Composition for Fiber-Reinforced Composite Material, Method for Producing Epoxy Resin Composition for Fiber-Reinforced Composite Material, Prepreg, and Honey-Comb Panel

The present technology provides an epoxy resin composition for a fiber-reinforced composite material, a method for producing an epoxy resin composition for a fiber-reinforced composite material, a prepreg, and a honeycomb panel. The epoxy resin composition for a fiber-reinforced composite material of the present technology contains: a reaction product obtained by reacting 100 parts by mass of a phosphorus-containing epoxy resin containing a phosphorus atom in the backbone thereof, and not less than 5 parts by mass and not greater than 20 parts by mass of an amino-terminated butadiene-acrylonitrile rubber; an epoxy resin other than the phosphorus-containing epoxy resin; a curing agent; and a curing accelerator. 1. An epoxy resin composition for a fiber-reinforced composite material comprising:a reaction product obtained by reacting 100 parts by mass of a phosphorus-containing epoxy resin containing a phosphorus atom in a backbone thereof, and not less than 5 parts by mass and not greater than 20 parts by mass of an amino-terminated liquid rubber;an epoxy resin other than the phosphorus-containing epoxy resin;a curing agent; anda curing accelerator.2. The epoxy resin composition for a fiber-reinforced composite material according to claim 1 , wherein the amino-terminated liquid rubber is an amino-terminated butadiene-acrylonitrile rubber.4. The epoxy resin composition for a fiber-reinforced composite material according to claim 1 , wherein the curing agent is dicyandiamide.5. The epoxy resin composition for a fiber-reinforced composite material according to claim 1 , wherein a phosphorus content of the phosphorus-containing epoxy resin is not less than 0.5 mass % and not greater than 5.0 mass %.6. The epoxy resin composition for a fiber-reinforced composite material according to claim 1 , wherein a content of the curing accelerator is not less than 1 part by mass and not greater than 15 parts by mass per 100 parts by mass of a sum of a mass of the phosphorus- ...

SILICONE RUBBER COMPOSITION FOR SEWING AIR BAG FILLING MATERIAL

PROBLEM TO BE SOLVED: To provide a silicone rubber composition for sewing air bag filling material used as a filling material at a part at which base cloths of an air bag formed in a bag shape by superposing and sewing treated surfaces of the base cloths by an addition reaction-curable silicone rubber are superposed and sewn, exhibiting excellent adhesiveness to the base cloths and having excellent shelf properties and heat change resistance after cured. SOLUTION: The silicone rubber composition for the sewing air bag filling material used at the above part includes A. 100 pts.mass organopolysiloxane having two or more alkenyl groups bonded to silicon atoms and 0.05 to 10,000 Pa s viscosity at 25°C, B. an organosilane having two or more SiH groups in such an amount that a molar ratio of the SiH groups in this component to the alkenyl groups bonded to the silicon atoms in the whole composition is 0.01 to 5.0, C. 1 to 100 pts.mass fine powder silica having ≥50 m2/g specific surface area ( ...

Epoxy resin composition for fiber-reinforced composite material

Epoxy resin composition for fiber-reinforced composite material

ADDITION-CURABLE SILICONE COMPOSITION CAPABLE OF PROVIDING CURED PRODUCTS HAVING LOW-REFRACTIVE-INDEX AND AN OPTICAL ELEMENT

PURPOSE: An addition-curable silicone composition and an optical element are provided to enhance strength and optical element strength. CONSTITUTION: An addition-curable silicone composition comprises a linear organopolysiloxane having 2 or more silicon atom bond aliphatic unsaturated groups and one or more silicon atom bond CF3 - (CF2) m - (CH2) n-, an organopolysiloxane having a branched structure of siloxane unit represented by SiO4/2 and/or RSiO3/2, 2 or more silicon atom bond aliphatic unsaturated groups and one or more silicon atom bond CF3 - (CF2) m - (CH2) n-, an organosilicon compound having 2 or more silicon atom bond hydrogen atoms, and a platinum based metal system catalyst. COPYRIGHT KIPO 2013 ...

Epoxy resin compositions for fiber-reinforced composite materials

The present invention relates to epoxy resin compositions for fiber-reinforced composite materials, which are a matrix resin for use in a prepreg and are capable of keeping the mechanical property while improving the conservation stability of the adhesive property. The present invention is characterized by comprising 25 to 50 parts by weight of amine-based hardening agent (B) selected from aliphatic polyamine, alicyclic polyamine or aromatic polyamine and 1 to 20 parts by weight of organic diacylhydrazine compound (C) having a melting point of 150 DEG C or above, based on 100 parts by weight of epoxy resin (A).

Liquid silicone rubber coating composition, curtain airbag and making method

A liquid silicone rubber coating composition comprising (A) an organopolysiloxane containing at least two silicon-bonded alkenyl radicals, (B) an organohydrogenpolysiloxane containing at least two SiH radicals, (C) an addition reaction catalyst, optionally (D) finely divided silica, (E) triallyl isocyanurate, (F) an organosilicon compound containing an epoxy radical and a silicon-bonded alkoxy radical, and (G) a titanium or zirconium compound is coated on a surface of an airbag base fabric and cured to form a rubber coating layer thereon. The composition is suited for curtain airbags.

SILICONE RUBBER COMPOSITION FOR SEALING STITCHED AIR BAG

A silicone rubber composition for sealing a stitched air bag, wherein the composition exhibits excellent adhesion to cured silicone rubber. A silicone rubber composition for sealing a stitched air bag, in which the composition is used as a sealing material at those sections of a silicone rubber-treated base fabric that are superimposed with the treated surfaces facing each other and then stitched together to form a bag shape during formation of the air bag, and comprises: (A) an organopolysiloxane containing at least two alkenyl groups bonded to silicon atoms within each molecule, (B) a straight-chain organohydrogenpolysiloxane containing SiH groups only at the molecular chain terminals, (C) an organohydrogenpolysiloxane containing at least three SiH groups within each molecule, (D) a finely powdered silica, and (E) a platinum group metal-based catalyst, wherein the total quantity of all SiH groups within the components (B) and (C) is within a range from 0.01 to 20 groups per alkenyl group ...

Addition one part curing type heat-conductive silicone grease composition

Disclosed herein is an addition one part curing type heat-conductive silicone grease composition contains, as indispensable components: (A) an organopolysiloxane containing at least one alkenyl group per molecule and having a viscosity of 50 mPa.s to 100,000 mPa.s at 25 DEG C; (B) an organohydrogenpolysiloxane which contains at least two silicon-bonded hydrogen atoms per molecule, which has no R2SiO unit, which has no silicon-bonded hydrogen atom at any terminal end, which has the silicon-bonded hydrogen atoms only in a side chain or chains, and which is in a substantially straight chain form, in an amount such that the ratio of {the number of Si-H groups}/{the number of alkenyl groups in the composition} is in the range from 0.1 to 5.0; (C) a photoactive type platinum complex curing catalyst; and (D) a heat-conductive filler, wherein the composition has a viscosity at 25 DEG C of 30 Pa.s to 800 Pa.s as measured by a Malcom viscometer at a rotational speed of 10 rpm. According to the present ...

Epoxy Resin Composition for Fiber-Reinforced Composite Material, Prepreg and Fiber-Reinforced Composite Material

In an epoxy resin composition, per 100 parts by mass of an epoxy resin component containing from 60 to 85 parts by mass of N,N,N′,N′-tetraglycidyldiaminodiphenylmethane resin (A) having a viscosity at 50° C. of 6000 mPa·s or less and from 15 to 40 parts by mass of a liquid bisphenol A epoxy resin (B) having a viscosity at 25° C. of 20000 mPa·s or less, from 8 to 15 parts by mass of a thermoplastic resin (C), from 2 to 10 parts by mass of elastomer microparticles (D) having an average particle diameter of 1000 nm or less, and from 0.5 to 2.5 parts by mass of silica microparticles (E) having an average particle diameter of 1000 nm or less are blended. 1. An epoxy resin composition for a fiber-reinforced composite material comprising:per 100 parts by mass of an epoxy resin component containing from 60 to 85 parts by mass of N,N,N′,N′-tetraglycidyldiaminodiphenylmethane resin (A) having a viscosity at 50° C. of 6000 mPa·s or less and from 15 to 40 parts by mass of a liquid bisphenol A epoxy resin (B) having a viscosity at 25° C. of 20000 mPa·s or less,from 8 to 15 parts by mass of a thermoplastic resin (C),from 2 to 10 parts by mass of elastomer microparticles (D) having an average particle diameter of 1000 nm or less, andfrom 0.5 to 2.5 parts by mass of silica microparticles (E) having an average particle diameter of 1000 nm or less.2. The epoxy resin composition for a fiber-reinforced composite material according to claim 1 , wherein a viscosity at 70° C. is 200 Pa·s or less claim 1 , and a minimum viscosity in a curing process is 1 Pa·s or greater.3. The epoxy resin composition for a fiber-reinforced composite material according to claim 1 , wherein the thermoplastic resin (C) is polyethersulfone.4. The epoxy resin composition for a fiber-reinforced composite material according to claim 1 , wherein the epoxy resin composition is formed by dissolving the thermoplastic resin (C) in the N claim 1 ,N claim 1 ,N′ claim 1 ,N′-tetraglycidyldiaminodiphenylmethane resin (A) ...

ADHESIVE FOR SILICONE RUBBER

PROBLEM TO BE SOLVED: To provide an adhesive for an addition reaction-curable silicone rubber that has good adhesion to a silicone rubber and is excellent in storage stability. SOLUTION: The adhesive for a silicone rubber comprises: (A) an organopolysiloxane having two or more alkenyl groups bonded to a silicon atom on an average in one molecule; (B) an organohydrogenpolysiloxane having two or more silicon-bonded hydrogen atoms on an average in one molecule; (C) a calcium carbonate powder surface-treated with a paraffin compound; and (D) a platinum group metal catalyst. COPYRIGHT: (C)2008,JPO&INPIT ...

PREPREG AND FIBER-REINFORCED COMPOSITE MATERIAL

PROBLEM TO BE SOLVED: To provide a prepreg and a fiber-reinforced composite material enhancing impact resistance while maintaining workability (tackiness) of the prepreg in a good state. SOLUTION: In a prepreg 1 in which a reinforcement substrate 2 consisting of reinforcement fibers 2a is embedded in a thermosetting matrix resin, hollow resin fine particles 4 are dispersed in the thermosetting matrix resin on the side of at least one of the prepreg surfaces from the reinforcement substrate 2. The fiber-reinforced composite material is produced by laminating and curing a plurality of the prepregs 1. The amount of the hollow resin fine particles 4 to be added is preferably 3 wt.% or less to the total sum of the weights of the thermosetting matrix resin and the hollow resin fine particles 4. The particle size of the hollow resin fine particles 4 is preferably 200 μm or less. COPYRIGHT: (C)2009,JPO&INPIT ...

Low heat resistance silicone composition

A low heat resistance silicone composition, including: (A) an organopolysiloxane having a specific kinematic viscosity; (B) an organopolysiloxane having a specific kinematic viscosity; (C) an α-aluminum oxide powder, α-aluminum oxide having a specific crystal structure and a particle shape with a D/H ratio in the predetermined range when a maximum particle diameter parallel to a hexagonal lattice face of the hexagonal close-packed lattice is taken as D and a particle diameter perpendicular to the hexagonal lattice face is taken as H, and the α-aluminum oxide powder having a specific average particle diameter, a specific content of coarse particles, and a specific purity; and (D) a spherical and/or irregular-shaped zinc oxide powder having a specific average particle diameter, and a specific content of coarse particles, in which the low heat resistance silicone composition has a specific heat conductivity and a specific viscosity.

VAPORIZER

PROBLEM TO BE SOLVED: To provide a vaporizer which prevents the closure in the vicinity of the jet port of a vaporizing chamber due to precipitation or adhesion of a solid CVD raw material from occurring for a long time, even when an amount of supplying carrier gas to be supplied together with the CVD raw material is reduced or the concentration of the CVD raw material to be solved in a solvent is raised, vaporized and supplied, and extremely efficiently vaporizes and supplies the raw material at a desired concentration and flow rate. SOLUTION: A CVD raw material supply unit contains a jet tube having a double structure of an inside channel and an outside channel constituted so that the sectional area of the channel in the jet port of the vaporizing chamber is wider than that of the channel except the jet port of the chamber. COPYRIGHT: (C)2004,JPO ...

EPOXY RESIN COMPOSITION FOR REINFORCED COMPOSITE MATERIAL

PROBLEM TO BE SOLVED: To provide an epoxy resin composition for a reinforced composite material as a matrix resin of a reinforced composite material, wherein both of heat resistance and flexibility can be attained and can improve pre-preg handling properties. SOLUTION: The epoxy resin composition for a reinforced composite material comprises 100 pts.wt. of an epoxy resin composed of (A) 20-40 wt.% of an epoxy resin containing a biphenyl skeleton, (B) 20-40 wt.% of an epoxy resin containing at least 3-epoxy groups per molecule which is liquid at 25°C and (C) 30-50 wt.% of a bisphenol A type epoxy resin, (D) 20-40 pts.wt. of a thermoplastic resin and (E) a curing agent. COPYRIGHT: (C)2007,JPO&INPIT ...

ADDITION-HARDENING TYPE SILICONE COMPOSITION AND OPTICAL ELEMENT

The present invention provides an addition-hardening type silicone composition having low refractive index, high transparency, excellent light extraction efficiency, good rubber properties, and solidity. Furthermore, the addition-hardening type silicone composition of the present invention does not have a tack after the hardening process, and provides a high-quality cured product having good light transmittance of 400 nm of wavelength at 25°C. The addition-hardening type silicone composition comprises: a linear chain type organopolysiloxane having CF3-(CF2)y-(CH2)z-group bound to the silicon atom, and an aliphatic unsaturated group bound to the silicon atom (A); an organopolysiloxane having branched structure represented as SiO4/2 and/or RSiO3/2, CF3-(CF2)y-(CH2)z-group bound to the silicon atom, and the aliphatic unsaturated group bound to the silicon atom (B); an organic silicon compound having hydrogen atom bound to the silicon atom represented by the following formula (1)(C); a platinum ...

Primer composition and photo-semiconductor device using the same

The present invention provides a primer composition capable of enhancing the adhesiveness between a substrate installed with a photo-semiconductor element and a sealing material constituted by a composition of addition-reaction curing type polysiloxane for sealing up the photo-semiconductor element, and preventing the metal electrode formed on the substrate from erosion, and a high reliability photo-semiconductor device using the same. The above-mentioned primer composition is characterized in that the primer composition makes adhesion between the substrate installed with the photo-semiconductor element and the sealing material constituted by the composition of the addition-reaction curing type polysiloxane for sealing up the afore-mentioned photo-semiconductor element and comprises the below-mentioned ingredients: (A) an alkoxy silane compound containing in one molecule at least one mercapto group, (B) a Ti compound, and (C) a solvent. The above-mentioned photo-semiconductor device is ...

EPOXY RESIN COMPOSITION FOR FIBER-REINFORCED COMPOSITE MATERIAL

PROBLEM TO BE SOLVED: To provide an epoxy resin composition for a fiber-reinforced composite material which is capable of forming a tough cured product. SOLUTION: The epoxy resin composition for the fiber-reinforced composite material contains an epoxy resin (A) containing an epoxy resin (a1) having a weight average mol. wt. of ≤1,000 and an epoxy resin (a2) having the basic skeleton of the above epoxy resin (a1) by ≥20 mass% and a weight average mol. wt. of 10,000-100,000, a thermoplastic resin (B) and a curing agent (C). Its morphology after the cure has a co-continuous phase between the epoxy resin (A) and the thermoplastic resin (B) and/or a continuous phase of the thermoplastic resin (B). COPYRIGHT: (C)2008,JPO&INPIT ...

Epoxy resin composition for fiber-reinforced composite material

Addition-curable silicone composition and optical device

本發明之課題係提供一種加成硬化型聚矽氧組成物，其可給予低折射率、具有高的透明性、光掠出效率亦優異、且橡膠性質及強度特性良好、硬化後不具有觸黏性、尤其在25℃之波長400nm之光透過率良好之硬化物。 本發明之加成硬化型聚矽氧組成物含有下列成分：(A)具有矽原子鍵結脂肪族不飽和基及矽原子鍵結CF3-(CF2)y-(CH2)z-基之直鏈狀有機聚矽氧烷，(B)具有矽原子鍵結脂肪族不飽和基及矽原子鍵結CF3-(CF2)y-(CH2)z-基，且具有以SiO4/2及/或SiO3/2表示之分支構造之有機聚矽氧烷，(C)以下述通式(1)表示之具有矽原子鍵結氫原子之有機矽化合物， □ 及(D)鉑族金屬系觸媒。

Addition one part curing type heat-conductive silicone grease composition

VIHICULAR STARTING ASSIST DEVICE

PROBLEM TO BE SOLVED: To prevent a lubrication failure from occurring in a differential gear even in any state happening, in this starting assist device which is equipped with an electric motor and this differential gear having those of first, second and third rotational elements, connecting this motor to the first rotational element via a reduction gear train and simultaneously connecting a driven wheel to the second rotational element, and in time of starting a vehicle, braking the third rotation element by a braking means, and then making an output torque in the motor so as to be transmitted to the driven wheel via the reduction gear train and the differential gear. SOLUTION: A first lubricating oil passage 191 feeding each lubricating spot of two differential gears 9L and 9R with oil raked up by rotation of a gear 10f of a reduction gear train and a second lubricating oil passage 192 feeding the lubricating spot with oil raked up by rotation of a third rotational element 9b both are ...

METHOD AND APPARATUS FOR KNEADING THERMOSETTING RESIN

【課題】無溶剤下で、混練時間を短縮しながら熱硬化性樹脂中に固形ゴム成分を均一的に分散することが可能な熱硬化性樹脂の混練方法及び装置を提供する。 【解決手段】硬化剤と液状熱硬化性樹脂とを混練する工程Ｍで得られた混練物ｍと、固形ゴム２０２と固形熱硬化性樹脂２０３とを混合する工程Ｎで得られた混合物ｎとを混練する熱硬化性樹脂の混練方法であり、工程Ｍで粉状の硬化剤と液状熱硬化性樹脂を混練し、工程Ｎで固形ゴム２０２と固形熱硬化性樹脂２０３を冷凍した後、粉状に粉砕して混合する。混練物ｍと混合物ｎの混練工程で、混練ロール３１１に巻き付けながら溝３１５により対流・置換を行いつつ、混合物ｎを混練ロール３１１の一方側に連続的に定量供給して混練し、中途部で混練物ｍを連続的に定量供給して混練された混合物ｎと混練する。 【選択図】図１

METHOD AND DEVICE FOR MANUFACTURING REINFORCED SEMICONDUCTOR SUBSTRATE

(57)【要約】 【課題】 熱処理後の太陽電池セル等の反りを抑え、安 価に樹脂塗布のタクトタイムを短縮することができる補 強半導体基板の製造方法を提供する。 【解決手段】 半導体基板の表面にエポキシ樹脂などの 熱硬化性材料を塗布する塗布工程と、塗布後に前記半導 体基板を第１の熱処理温度で熱処理する第１熱処理工程 と、第１の熱処理後に前記半導体基板を第２の熱処理温 度で熱処理する第２熱処理工程とを備える。第１の熱処 理温度は、第２の熱処理温度よりも高く、１１０℃から １３０℃であり、第２の熱処理温度は、９０℃から１１ ０℃であることが好ましい。

Epoxy resin composition for fiber-reinforced composite material, method for producing epoxy resin composition for fiber-reinforced composite material, prepreg, and honeycomb panel

Provided are: an epoxy resin composition for a fiber-reinforced composite material with which it is possible to obtain a cured article having exceptional adhesiveness to a honeycomb core, the epoxy resin composition being curable at low temperatures and having exceptional flame retardancy and storage stability; a method for producing an epoxy resin composition for a fiber-reinforced composite material; a prepreg; and a honeycomb panel. The epoxy resin composition for a fiber-reinforced composite material of the present invention is characterized by containing: a reaction product obtained by reacting 100 parts by mass of a phosphorus-containing epoxy resin that contains a phosphorus atom in the backbone, and 5-20 parts by mass of an amino group-terminated butadiene-acrylonitrile rubber; an epoxy resin other than a phosphorus-containing epoxy resin; a curing agent; and a curing accelerator.

Epoxy resin composition for fiber-reinforced composite material

Epoxy resin composition for fiber-reinforced composite material, prepreg and fiber-reinforced composite material

In the present invention, in order to provide an epoxy resin composition for a fiber-reinforced composite material that exhibits excellent heat resistance, toughness and workability, 8-15 parts by mass of (C) a thermoplastic resin, 2-10 parts by mass of (D) elastomer fine particles having an average particle diameter of 1000 nm or less, and 0.5-2.5 parts by mass of (E) silica fine particles having an average particle diameter of 1000 nm or less are blended with 100 parts by mass of an epoxy resin component constituted from: 60-85 parts by mass of (A) a N,N,N',N'-tetraglycidyl diaminodiphenylmethane resin having a viscosity at 50°C of 6000 mPa·s or less; and 15-40 parts by mass of (B) a liquid bisphenol A type epoxy resin having a viscosity at 25ºC of 20,000 mPa·s or less.

Epoxy resin composition for fiber-reinforced composite material

Provided is an epoxy resin composition for fiber-reinforced composite materials, which is improved in toughness necessary for improving the strength of self-adhesion of a matrix resin for use in a prepreg for a face sheet of a honeycomb panel. The epoxy resin composition, which comprises: an epoxy resin (A); a thermoplastic resin (B); fine solid resin particles (C); and a curing agent (D), is characterized in that the epoxy resin composition after being cured has a morphology in which the epoxy resin (A) and the thermoplastic resin (B) form co-continuous phases, and the fine solid resin particles (C) are dispersed in at least the continuous phase of the epoxy resin (A) in the co-continuous phases.

Cyanate ester resin composition and prepreg

The purpose of the present invention is to provide a cyanate ester resin composition such that resin flow when heated to cure can be suppressed without the addition of a thermoplastic resin to control viscosity, resin defects and uneven thickness are eliminated, and excellent workability is exhibited. The composition comprises (A) a cyanate ester resin, (B) a curing agent or a curing accelerator, (C) silica microparticles, and (D) core shell rubber particles, the amounts of (C) the silica microparticles and (D) the core shell rubber particles are, respectively, 1 to 5 parts by mass and 2 to 10 parts by mass with respect to 100 parts by mass of (A) the cyanate ester resin, and the mass ratio (C)/(D) of the (C) the silica microparticles to (D) the core shell rubber particles is 1/1 to 1/5.

Epoxy resin composition for fiber-reinforced composite material

Provided is an epoxy resin composition for fiber-reinforced composite materials, which serves as a matrix resin for a prepreg. This epoxy resin composition is improved in tackiness stability during storage, while maintaining mechanical characteristics. The epoxy resin composition for fiber-reinforced composite materials is characterized by containing 25 to 50 parts by weight of an amine curing agent (B) selected from aliphatic polyamines, alicyclic polyamines and aromatic polyamines, and 1 to 20 parts by weight of an organic acid dihydrazide compound (C) having a melting point of not less than 150 DEG C, per 100 parts by weight of an epoxy resin (A).

LIQUID SILICONE RUBBER COATING AGENT COMPOSITION HAVING EXCELLENT ADHESION TO AIRBAG CLOTH, CURTAIN AIRBAG, AND METHOD FOR PREPARING THE SAME

PURPOSE: Provided are a liquid silicone rubber coating agent composition, which has an excellent adhesion to airbag cloth, and a curtain airbag coated with the composition, which prevents a leakage of inflating gas to satisfy the continuance of inflation time. CONSTITUTION: The liquid silicone rubber coating agent composition comprises (A) 100 parts by mass of organopolysiloxane containing at least two silicon-bonded alkenyl groups in a molecule, (B) organohydrogenpolysiloxane containing at least two silicon-bonded hydrogen atoms in a molecule in a sufficient amount to have 1-10 silicon-bonded hydrogen atoms in the component per silicon-bonded alkenyl group in the component (A), (C) an effective amount of an addition reaction catalyst, (D) 0-50 parts by mass of silica powder having a specific surface area of 50m^2/g or more, (E) 0.1-1 part by mass of triallylisocyanurate, (F) 0.1-10 parts by mass of an organic silicon compound having an epoxy group and a silicon-bonded alkoxy group in a ...

EPOXY RESIN COMPOSITION FOR FIBER-REINFORCED COMPOSITE MATERIAL

Disclosed is an epoxy resin composition for fiber-reinforced composite materials, which serves as a matrix resin for a prepreg. This epoxy resin composition is improved in tackiness stability during storage, while maintaining mechanical characteristics. The epoxy resin composition for fiber-reinforced composite materials is characterized by containing 25-50 parts by weight of an amine curing agent (B) selected from aliphatic polyamines, alicyclic polyamines and aromatic polyamines, and 1-20 parts by weight of an organic acid dihydrazide compound (C) having a melting point of not less than 150°C, per 100 parts by weight of an epoxy resin (A). © KIPO & WIPO 2009 ...

Epoxy resin compositions for fiber-reinforced composite materials

METHOD FOR VAPORIZING AND SUPPLYING

PURPOSE: A method for vaporizing and supplying is provided to be capable of subjecting a liquid CVD material to flow rate control with a liquid flow rate controller, supplying a vaporizer with the material, vaporizing the same, and supplying a semiconductor manufacturing apparatus with the vaporized material, characterized in that the method enables a semiconductor thin film to be manufactured with an extremely high accuracy, while controlling the flow rate of the liquid CVD material with a high accuracy. CONSTITUTION: A vaporizing and supplying system comprises a liquid CVD material vessel(2) enclosing a liquid CVD material(1), a plurality of liquid flow rate controllers, for instance, including a liquid flow rate controller for large capacity(4) and a liquid flow rate controller for small capacity(5), a vaporizer(6), a semiconductor manufacturing apparatus(9), and preferably a degassing unit(3). Therein, the plurality of liquid flow rate controllers are installed in parallel so as to ...

Low heat resistance silicone composition

A low heat resistance silicone composition, including: (A) an organopolysiloxane having a specific kinematic viscosity; (B) an organopolysiloxane having a specific kinematic viscosity; (C) an [alpha]-aluminum oxide powder, [alpha]-aluminum oxide having a specific crystal structure and a particle shape with a D/H ratio in the predetermined range when a maximum particle diameter parallel to a hexagonal lattice face of the hexagonal close-packed lattice is taken as D and a particle diameter perpendicular to the hexagonal lattice face is taken as H, and the [alpha]-aluminum oxide powder having a specific average particle diameter, a specific content of coarse particles, and a specific purity; and (D) a spherical and/or irregular-shaped zinc oxide powder having a specific average particle diameter, and a specific content of coarse particles, in which the low heat resistance silicone composition has a specific heat conductivity and a specific viscosity.

Uv-thickening thermally conductive silicone grease composition

本發明係一種紫外線增黏型熱傳導性聚矽氧滑脂組成物，其係將(A)在25℃的黏度係50~100,000mPa‧s，在1分子中至少含有1個烯基的有機聚矽氧烷、(B)1分子中至少含有2個之直接鍵結於矽原子的氫原子的有機氫聚矽氧烷、(C)光活性型鉑錯合物硬化觸媒、(D)具有10W/m‧℃以上之熱傳導率的熱傳導性填充劑 作為必需成分，在25℃的黏度，以Malcom黏度計的旋轉數10rpm測定時係30~800Pa‧s。 本發明之紫外線增黏型熱傳導性聚矽氧滑脂組成物，其係在低黏度時形狀維持性亦高，亦可藉由紫外線照射量而調整深部硬化性，照射紫外線而使其增黏後之該組成物係不變硬而柔軟地固化。

Epoxy resin composition for fiber-reinforced composite material

Provided is an epoxy resin composition for fiber-reinforced composite materials, which serves as a matrix resin composition for use in a self-adhesive prepreg for a face sheet of a honeycomb panel. The epoxy resin composition enables to increase self-adhesiveness of the prepreg, while improving workability and appearance quality of the prepreg. The epoxy resin composition is characterized by containing: an epoxy resin (A) which is in a liquid state at room temperature; a thermoplastic resin (B) which dissolves in the epoxy resin (A) at a temperature not less than 90° C.; thermosetting resin particles (C) which do not completely dissolve in the epoxy resin (A) at a temperature less than 90° C. and has a softening point of not less than 120° C.; and a curing agent (D).

RESIN COMPOSITION FOR PREPREG

PROBLEM TO BE SOLVED: To provide a resin composition for a prepreg excellent in heat resistance, water resistance, flow controllability and adhesion property to a honeycomb core by clarifying the relationship between formability of a fillet and the complex viscosity of a resin, and a structure obtained by gluing the prepreg obtained using the resin composition for the prepreg to the honeycomb core. SOLUTION: The resin composition for the prepreg comprises (a) an epoxy resin, (b) an aromatic amine, (c) at least one selected from the group consisting of an imidazole catalyst, a boron trifluoride-amine salt catalyst and dicyandiamide, (d) a solid rubber and/or a thermoplastic polymer, where the content of the solid rubber and/or the thermoplastic polymer (d) is at least 1 but less than 10 pts.wt. based on 100 pts.wt. of the epoxy resin (a) and the complex viscosity η measured at a vibration frequency of 0.02 Hz satisfies a specified relationship. COPYRIGHT: (C)2005,JPO&NCIPI ...

APPARATUS AND METHOD FOR SUPPLYING VAPORIZATION

PROBLEM TO BE SOLVED: To provide an apparatus and a method for supplying vaporization, which obtains high quality and high-purity semiconductor film, by efficiently performing vaporization with a single vaporizer for supply to a semiconductor manufacturing device, without causing deterioration in individual CVD materials or attachment of solid materials in formation of a ferroelectric film such as BZT, BST, SBT, PLZT or the like. SOLUTION: The apparatus for supplying vaporization consists of a plurality of CVD material supply lines, each having a liquid flow rate control unit; a means for mixing the plural kinds of CVD materials supplied from these CVD material supply lines; a filter for filtering the mixed CVD materials; and the vaporizer, in which a CVD material supply part is at least incorporated with a first channel for flowing the CVD materials, a second channel for flowing a carrier gas and a third channel for converging the CVD materials and the carrier gas from the two channels ...

VAPORIZER AND VAPOR FEEDING APPARATUS

PURPOSE: To provide a vaporizer in which a separation and deposition of a solid CVD (chemical vapor deposition) material in a vaporization chamber can be prevented and a vapor feeding can be very efficiently carried out in a desired concentration and flow even if the vapor feeding is carried out decreasing a flow of a carrier gas fed with the CVD material, and a vapor feeding apparatus. CONSTITUTION: A CVD material feeding potion includes the flow path of the material, the flow path of the carrier gas, and a mixing flow path, which is located downstream of those flow pathes joined, communicated with the vaporizer. The vaporizer includes a means by which the flow path of the CVD material causes a pressure loss of the CVD material. The vapor feeding apparatus is equipped with a means, which causes the pressure loss of the CVD material, between a liquid flow control portion and the vaporizer. © KIPO & JPO 2004 ...

Addition-curable silicone composition and optical element

An addition-curable silicone composition that provides a cured product having a particularly high transparency, an excellent light extraction efficiency and a favorable strength characteristic by subjecting the cured product to a lower refractive index by using a specific composition. The present invention was accomplished by an addition-curable silicone composition, including at least: (A) a linear organopolysiloxane having 2 or more aliphatic unsaturated groups bonded to a silicon atom and 1 or more CF3-(CF2)y-(CH2)z- groups bonded to a silicon atom in one molecule (B) an organopolysiloxane having 2 or more aliphatic unsaturated groups bonded to a silicon atom and 1 or more CF3-(CF2)y-(CH2)z- groups bonded to a silicon atom in one molecule and having a branch structure of a siloxane unit represented by an SiO4/2 and/or an RSiO3/2 (C) an organosilicon compound represented by the following general formula (1) and (D) a platinum group metal-based catalyst.

Method for vaporizing and supplying

A vaporizing and supplying method for controlling a liquid CVD material in flow rate with liquid flow rate controllers, supplying a vaporizer with the material, vaporizing the same, and supplying a semiconductor manufacturing apparatus with the vaporized material, which includes installing in parallel, a plurality of liquid flow rate controllers, preferably each having a different controllable range of flow rate, and supplying the vaporizer with the material at a variable flow rate thereof by altering the single use of any of the controllers to the simultaneous use of a plurality thereof or vice versa, and/or switching any of the controllers one after another.

EPOXY RESIN COMPOSITION

PROBLEM TO BE SOLVED: To obtain an epoxy resin composition useful as a matrix resin for impregnating prepreg, having appropriate fluidity to the extent not to affect the characteristic of the prepreg to obtain uniform adhesion over whole adhering interface of a honeycomb core, excellent in self-adhesion with the honeycomb core. SOLUTION: This epoxy resin composition comprises an epoxy resin, an aromatic amine-based curing agent, and a solid rubber compatible with the epoxy resin and is characterized in that a minimum value η 0,02 of complex viscosity measured at 0.02 Hz of vibrating frequency at 50 to 150°C exists in a range of 1.0 to 200 Pa.s, and a temperature Tlow in the low temperature side where the complex viscosity becomes 1,000 Pa.s in the course of curing of the resin composition and a temperature Thigh in the high temperature side where the complex viscosity becomes 1,000 Pa.s satisfy the relation 80°C≤Thigh-Tlow≤150°C. COPYRIGHT: (C)2002,JPO ...

TAKING-OUT HAND FOR PLATE MEMBER

PROBLEM TO BE SOLVED: To provide a taking-out hand capable of smoothly and surely taking out plate members such as piled wafers one by one regardless of sizes and kinds. SOLUTION: This taking-out hand is provided with fixed legs 3a, 3b for pressing a pair of corner parts opposite to each other in the longitudinal diagonal direction of an approximately square wafer 10 from an upper part to determine a height standard, holding legs 4a, 4b having adsorption pads 5a, 5b on their tips for adsorbing and holding a pair of corner parts opposite to each other in the lateral diagonal direction of the wafer, a Bernoulli sucker 6 for holding a central part of the wafer, and a cylinder for driving the holding legs 4a, 4b to come in and out for changing the pulling-up amount of the wafer from the height standard. COPYRIGHT: (C)2003,JPO ...

VAPORIZER

PROBLEM TO BE SOLVED: To provide a vaporizer which is capable of restraining a solid CVD material from separating out or adhering near the exhaust vent of a vaporizing chamber even in the case that carrier gas that is supplied together with the CVD material is reduced in feed rate or the solid CVD material dissolved into a solvent is increased in concentration, and capable of stably and extremely efficiently vaporizing and feeding the CVD material of a desired concentration at a desired flow rate for a long period of time. SOLUTION: The vaporizer is equipped with a CVD material feeding unit that is provided with the exhaust pipe of a double structure which has an outer pipe whose outer wall is tapered or curved so as to be gradually reduced in an outer diameter toward the exhaust vent of the vaporizing chamber. COPYRIGHT: (C)2005,JPO&NCIPI ...

INTRAORAL CAMERA

【課題】口腔内カメラを用いた撮像において、患者への不快感を無くす。 【解決手段】本体ケースと、本体ケースの前方側に装着された口腔内挿入部と、口腔内挿入部の前方下方側に設けられた撮像窓と、この撮像窓周辺に設けられた高輝度ＬＥＤ９と、前記撮像窓に光学的に接続された絞り駆動部１４と、焦点レンズと、撮像装置と、制御器１７と、制御器１７に接続された電源スイッチ１Ａとを備え、制御器１７には、口腔内判定部２６と、照明制御部２７とを設け、口腔内判定部２６が、高輝度ＬＥＤ９により照明された撮像部位を口腔内であると判断し、その後、口腔内判定部２６が撮像部位を口腔外であると判断した時には、照明制御部２７が高輝度ＬＥＤ９を消灯する。 【選択図】図６

Bei Umgebungstemperatur härtende Organopolysiloxan Zusammensetzungen

EPOXY RESIN COMPOSITION FOR FIBER-REINFORCED COMPOSITE MATERIAL

Disclosed is an epoxy resin composition for fiber-reinforced composite materials, which serves as a matrix resin composition used for a self-adhesive prepreg for face sheet of honeycomb panel. The epoxy resin composition enables to increase self-adhesiveness of the prepreg, while improving workability and appearance quality of the prepreg. Specifically disclosed is an epoxy resin composition for fiber-reinforced composite materials, which is characterized by containing an epoxy resin (A) which is in a liquid state at room temperature, a thermoplastic resin (B) which dissolves in the epoxy resin (A) at a temperature not less than 90°C, thermosetting resin particles (C) which do not completely dissolve in the epoxy resin (A) at a temperature less than 90°C and has a softening point of not less than 120°C, and a curing agent (D). © KIPO & WIPO 2009 ...

THERMOSETTING RESIN COMPOSITION, THERMOSETTING RESIN COMPOSITION FOR FIBER-REINFORCED COMPOSITE MATERIAL, PREPARED USING THE SAME, AND HONEYCOMB SANDWICH PANEL

An object of the present invention is to provide a thermosetting resin composition having superior toughness. The thermosetting resin composition of the present invention includes a thermosetting resin, and an adsorbing filler in which a thermoplastic resin C is adsorbed on a filler, wherein an adsorption coefficient that is greater than 0 and less than or equal to 0.8, defined by Formula 1 below, is satisfied. 1. A thermosetting resin composition comprising: a thermosetting resin and an adsorbing filler in which a thermoplastic resin C is adsorbed on a filler; wherein an adsorption coefficient that is greater than 0 and less than or equal to 0.8 , defined by Formula 1 below , is satisfied:{'br': None, 'i': C', 'C/DBP, 'Adsorption coefficient=Amount(parts by mass)of the thermoplastic resin adsorbed on 100 parts by mass of the filler/specific gravity of the thermoplastic resin oil absorption(mL/100 g)of the filler.\u2003\u2003Formula 1'}2. The thermosetting resin composition according to claim 1 , wherein the thermosetting resin comprises at least one selected from the group consisting of epoxy resins claim 1 , phenolic resins claim 1 , urea resins claim 1 , melamine resins claim 1 , unsaturated polyester resins claim 1 , and thermosetting polyimide and benzoxazine resins.3. The thermosetting resin composition according to claim 1 , wherein a form of the filler is at least one selected from the group consisting of spherical claim 1 , granular claim 1 , and irregular.4. The thermosetting resin composition according to claim 1 , wherein the thermoplastic resin C comprises at least one selected from the group consisting of polyethersulfone claim 1 , polysulfone claim 1 , and polyetherimide.5. The thermosetting resin composition according to claim 1 , wherein the thermoplastic resin C comprises a functional group that reacts with the thermosetting resin.6. The thermosetting resin composition according to claim 1 , wherein an amount of the adsorbing filler is from 0.1 to ...

SUBSTRATE FOR OPTICAL SEMICONDUCTOR APPARATUS, METHOD FOR MANUFACTURING THE SAME, OPTICAL SEMICONDUCTOR APPARATUS, AND METHOD FOR MANUFACTURING THE SAME

The present invention provides a substrate for an optical semiconductor apparatus for mounting optical semiconductor devices, the substrate comprising first leads to be electrically connected to first electrodes of the optical semiconductor devices and second leads to be electrically connected to second electrodes of the optical semiconductor devices, wherein the first leads and the second leads are arranged each in parallel, a molded body of a thermosetting resin composition is molded by injection molding in a penetrating gap between the first leads and the second leads such that the substrate is formed in a plate shape, and an exposed front surface and an exposed back surface of the first leads, the second leads and the resin molded body each tie in a same plane. The substrate exhibits excellent heat dissipation properties and enables manufacture of a thin optical semiconductor apparatus with a low cost. 1. A substrate for an optical semiconductor apparatus for mounting optical semiconductor devices , the substrate comprising first leads to be electrically connected to first electrodes of the optical semiconductor devices and second leads to be electrically connected to second electrodes of the optical semiconductor devices , whereinthe first leads and the second leads are arranged each in parallel, a molded body of a thermosetting resin composition is molded by injection molding in a penetrating gap between the first leads and the second leads such that the substrate is formed in a plate shape, and an exposed front surface and an exposed back surface of the first leads, the second leads and the resin molded body each tie in a same plane.2. The substrate for an optical semiconductor apparatus according to claim 1 , wherein metal plating is applied onto surfaces of the first leads and the second leads.3. The substrate for an optical semiconductor apparatus according to claim 1 , wherein the first leads and the second leads each have a step claim 1 , a taper portion ...

SUBSTRATE FOR OPTICAL SEMICONDUCTOR APPARATUS, METHOD FOR MANUFACTURING THE SAME, OPTICAL SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING THE SAME

The present invention provides a substrate for an optical semiconductor apparatus for mounting optical semiconductor devices, the substrate includes first leads to be electrically connected to first electrodes of the optical semiconductor devices and second leads to be electrically connected to second electrodes of the optical semiconductor devices, wherein the first leads and the second leads are arranged each in parallel, a molded body of a thermosetting resin composition is molded in a penetrating gap between the first leads and the second leads, a reflector of the thermosetting resin composition is molded at a periphery of respective regions on which the optical semiconductor devices are to be mounted, and the resin molded body and the reflector are integrally molded with the first leads and the second leads by injection molding. 1. A substrate for an optical semiconductor apparatus for mounting optical semiconductor devices , the substrate comprising first leads to be electrically connected to first electrodes of the optical semiconductor devices and second leads to be electrically connected to second electrodes of the optical semiconductor devices , whereinthe first leads and the second leads are arranged each in parallel, a molded body of a thermosetting resin composition is molded in a penetrating gap between the first leads and the second leads, a reflector of the thermosetting resin composition is molded at a periphery of respective regions on which the optical semiconductor devices are to be mounted, and the resin molded body and the reflector are integrally molded with the first leads and the second leads by injection molding.2. The substrate for an optical semiconductor apparatus according to claim 1 , wherein metal plating having a glossiness of 1.0 or more is applied onto surfaces of the first leads and the second leads.3. The substrate for an optical semiconductor apparatus according to claim 1 , wherein the first leads and the second leads each have ...

Epoxy Resin Composition For Fiber-Reinforced Composite Material

The present technology is an epoxy resin composition for a fiber-reinforced composite material comprising a phosphorus-containing epoxy resin containing phosphorus in the skeleton thereof, a dicyandiamide, and a curing promoter containing at least one selected from 1,1′-(4-methyl-1,3-phenylene)bis(3,3-dimethylurea), phenyl-dimethylurea represented by the following formula (1), and methylene-diphenyl-bisdimethylurea represented by the following formula (2); wherein the phosphorus content of the phosphorus-containing epoxy resin is at least 1.0 mass % and at most 5.0 mass % in the epoxy resin composition. 2. The epoxy resin composition for a fiber-reinforced composite material according to claim 1 , wherein the content of the curing accelerator is at least 1 part by mass and at most 15 parts by mass with respect to 100 parts by mass of a sum of the mass of the phosphorus-containing epoxy resin and other epoxy resins.3. The epoxy resin composition for a fiber-reinforced composite material according to claim 1 , comprising a phenoxy resin.4. The epoxy resin composition for a fiber-reinforced composite material according to claim 3 , wherein the content of the phenoxy resin is at least 5 parts by mass and at most 40 parts by mass with respect to 100 parts by mass of a sum of the mass of the phosphorus-containing epoxy resin and the other epoxy resins.5. A prepreg obtained by impregnating reinforcing fibers with the epoxy resin composition for a fiber-reinforced composite material according to .6. The epoxy resin composition for a fiber-reinforced composite material according to claim 2 , comprising a phenoxy resin.7. The epoxy resin composition for a fiber-reinforced composite material according to claim 6 , wherein the content of the phenoxy resin is at least 5 parts by mass and at most 40 parts by mass with respect to 100 parts by mass of a sum of the mass of the phosphorus-containing epoxy resin and other epoxy resins.8. A prepreg obtained by impregnating reinforcing ...

Cyanate Ester Resin Composition and Prepreg

A cyanate ester resin composition contains: a cyanate ester resin; a curing agent or a curing accelerator; silica microparticles; and core-shell rubber particles; in which the resin composition includes from 1 to 5 parts by mass of the silica microparticles and from 2 to 10 parts by mass of the core-shell rubber particles based on 100 parts by mass of the cyanate ester resin, and a mass ratio of the silica microparticles to the core-shell rubber particles is from 1/1 to 1/5. 1. A cyanate ester resin composition , comprising:a cyanate ester resin (A);a curing agent or a curing accelerator (B);silica microparticles (C); andcore-shell rubber particles (D), whereinthe resin composition includes from 1 to 5 parts by mass of the silica microparticles (C) and from 2 to 10 parts by mass of the core-shell rubber particles (D) based on 100 parts by mass of the cyanate ester resin (A), anda mass ratio of the silica microparticles (C) to the core-shell rubber particles (D) is from 1/1 to 1/5 as (C)/(D).2. The cyanate ester resin composition according to claim 1 , wherein a tan δ at a strain 1% is less than 1 and a tan δ at a strain 100% is 1 or greater when viscoelasticity is measured at a temperature of 70° C. and a frequency 1 Hz on a parallel plate.3. The cyanate ester resin composition according to claim 1 , wherein the cyanate ester resin (A) is a novolac type cyanate ester resin.4. The cyanate ester resin composition according to claim 1 , wherein a compounded amount of the silica microparticles (C) per 100 parts by mass of the cyanate ester resin (A) is from 2 to 4 parts by mass.5. The cyanate ester resin composition according to claim 1 , wherein a compounded amount of the core-shell rubber particles (D) per 100 parts by mass of the cyanate ester resin (A) is from 4 to 8 parts by mass.6. The cyanate ester resin composition according to claim 1 , wherein a mass ratio of the silica microparticles (C) to the core-shell rubber particles (D) is from 1/1.5 to 1/4 as (C)/(D).7 ...

THERMALLY CONDUCTIVE SILICONE ADHESIVE COMPOSITION FOR REACTOR AND REACTOR

A thermally conductive silicone adhesive composition for a reactor, having good fluidity even when containing a large amount of thermally conductive filler to obtain a thermally conductive silicone adhesive composition, permitting potting of fine substrates, having good properties after curing, having little change in properties even with heat or moist-heat aging, and giving good adhesiveness to metals and organic resins, and a reactor potted by this composition, can be provided by making a thermally conductive silicone adhesive composition having a viscosity of 100 mPa·s at 25° C. and containing a liquid organohydrogenpolysiloxane having 2-10 hydrogen atoms bonded with silicon atoms in the molecule, containing no alkoxy groups, having at least one epoxy group bonded with a silicon atom via an alkylene group, having a polysiloxane degree of polymerization of 15 or lower, and containing a polysiloxane skeleton having a cyclic structure. 3. The heat conductive silicone adhesive composition of or wherein component (C) is at least one member selected from the group consisting of aluminum hydroxide , magnesium hydroxide , aluminum oxide , crystalline silica , zinc oxide , silicon oxide , silicon carbide , silicon nitride , magnesium oxide , titanium oxide , beryllium oxide , aluminum nitride , boron nitride , gold , silver , copper , iron , nickel , aluminum , and stainless steel.4. The heat conductive silicone adhesive composition of wherein component (E) is selected from amongmolecular chain dual end trimethoxysiloxy-blocked dimethylsiloxane,molecular chain dual end trimethoxysiloxy-blocked dimethylsiloxane/methylvinylsiloxane copolymer,molecular chain dual end trimethoxysiloxy-blocked methylvinylpolysiloxane,molecular chain dual end trimethoxysiloxy-blocked dimethylsiloxane/methylvinylsiloxane/methylphenylsiloxane copolymer,molecular chain dual end trimethoxysiloxy-blocked dimethylsiloxane/methylvinylsiloxane/diphenylsiloxane copolymer,molecular chain dual end ...

ONE-LIQUID-TYPE THERMOSETTING HEAT-CONDUCTIVE SILICONE GREASE COMPOSITION, AND METHOD FOR PRODUCING CURED PRODUCT THEREOF

Provided is a one-liquid-type thermosetting heat-conductive silicone grease composition which initially has low viscosity but high shape retention, which becomes soft after heat-curing, which has good adhesion to a substrate, and which can be stored at room temperature. Also provided is a method for producing a cured product of said composition. 1. A normal temperature-storable , addition one-part heat-curable , heat-conductive silicone grease composition comprising , as essential components ,(A) 100 parts by weight of an organopolysiloxane having a viscosity of 50 to 100,000 mPa·s at 25° C. and containing at least one alkenyl group per molecule,(B) a liquid organohydrogenpolysiloxane having a viscosity of up to 100 mPa·s at 25° C., containing 2 to 10 silicon-bonded hydrogen atoms (i.e., Si—H groups) per molecule, containing at least one alkoxy and/or epoxy group bonded to a silicon atom through an alkylene group, the polysiloxane having a degree of polymerization of up to 15 and a cyclic structure-containing skeleton, in such an amount that the number of Si—H groups divided by the number of alkenyl groups in the composition falls in the range from 0.1 to 5,(C) an effective amount of a photoactive platinum complex curing catalyst selected from the group consisting of trimethyl(acetylacetonato)platinum complex, trimethyl(2,4-pentanedionate)platinum complex, trimethyl(3,5-heptanedionate)platinum complex, trimethyl(methylacetoacetate)platinum complex, bis(2,4-pentanedionato)platinum complex, bis(2,4-hexanedionato)platinum complex, bis(2,4-heptanedionato)platinum complex, bis(3,5-heptanedionato)platinum complex, bis(1-phenyl-1,3-butanedionato)platinum complex, bis(1,3-diphenyl-1,3-propanedionato)platinum complex, (1,5-cyclooctadienyl)dimethyl platinum complex, (1,5-cyclooctadienyl)diphenyl platinum complex, (1,5-cyclooctadienyl)dipropyl platinum complex, (2,5-norbornadiene)dimethyl platinum complex, (2,5-norbornadiene)diphenyl platinum complex, (cyclopentadienyl) ...

ADDITION-CURABLE SILICONE COMPOSITION AND OPTICAL ELEMENT

An addition-curable silicone composition that provides a cured product having a particularly high transparency, an excellent light extraction efficiency and a favorable strength characteristic by subjecting the cured product to a lower refractive index by using a specific composition. The present invention was accomplished by an addition-curable silicone composition, including at least: 2. The addition-curable silicone composition according to claim 1 , wherein the addition-curable silicone composition provides a cured product whose optical transmission with a wavelength of 300 to 800 nm at 25° C. is 80% or more in a 2 mm thick layer by curing.3. The addition-curable silicone composition according to claim 1 , wherein the addition-curable silicone composition provides a cured product whose refractive index (25° C.) with a visible light (589 nm) is 1.40 or less by curing.4. The addition-curable silicone composition according to claim 2 , wherein the addition-curable silicone composition provides a cured product whose refractive index (25° C.) with a visible light (589 nm) is 1.40 or less by curing.5. An optical element that is encapsulated with a cured product of the addition-curable silicone composition according to .6. An optical element that is encapsulated with a cured product of the addition-curable silicone composition according to .7. An optical element that is encapsulated with a cured product of the addition-curable silicone composition according to .8. An optical element that is encapsulated with a cured product of the addition-curable silicone composition according to . 1. Field of the InventionThe present invention relates to an addition-curable silicone composition and an optical element, particularly, an addition-curable silicone composition excellent in rubber property and strength characteristic that provides a cured product having a low refractive index and an optical element encapsulated with the cured product of the composition.2. Description of ...

Addition one part curing type heat-conductive silicone grease composition

Disclosed herein is an addition one part curing type heat-conductive silicone grease composition contains, as indispensable components: (A) an organopolysiloxane containing at least one alkenyl group per molecule and having a viscosity of 50 mPa•s to 100,000 mPa•s at 25° C.; (B) an organohydrogenpolysiloxane which contains at least two silicon-bonded hydrogen atoms per molecule, which has no R 2 SiO unit, which has no silicon-bonded hydrogen atom at any terminal end, which has the silicon-bonded hydrogen atoms only in a side chain or chains, and which is in a substantially straight chain form, in an amount such that the ratio of {the number of Si-H groups}/{the number of alkenyl groups in the composition} is in the range from 0.1 to 5.0; (C) a photoactive type platinum complex curing catalyst; and (D) a heat-conductive filler, wherein the composition has a viscosity at 25° C. of 30 Pa•s to 800 Pa•s as measured by a Malcom viscometer at a rotational speed of 10 rpm. According to the present invention, there can be provided a composition which has high shape retention properties, is low in hardness, and can be stored at normal temperature.

Prepreg and method for manufacturing same

A glass fiber fabric is impregnated with a colored resin having an opacifying property, a colored resin layer formed from the colored resin is provided on a first face of the glass fiber fabric, a transparent resin layer becoming transparent after being cured is provided on a second face of the glass fiber fabric, and thus a prepreg is formed.

ADDITION-CURABLE SILICONE COMPOSITION AND OPTICAL DEVICE

The present invention provides an addition-curable silicone composition comprising: (A) a linear organopolysiloxane having silicon atom-bonded aliphatic unsaturated groups and CF—(CF)—(CH)— groups; (B) an organopolysiloxane having silicon atom-bonded aliphatic unsaturated groups and CF—(CF)—(CH)— groups, and having a branched structure represented by SiOand RSiO; (C) an organosilicon compound having silicon atom-bonded hydrogen atoms and represented by the following general formula (1); and (D) a platinum group metal-based catalyst. There can be provided an addition-curable silicone composition that provides a cured product having low refractive index, high transparency, excellent light extraction efficiency, good rubber properties and strength properties, and no tack after curing, and in particular, has good transmittance of light with a wavelength of 400 nm at 25° C. 2. The addition-curable silicone composition according to claim 1 , wherein the addition-curable silicone composition provides a cured product having a transmittance of light with a wavelength of 300 to 800 nm at 25° C. of 80% or more in a 2 mm thick layer by curing.3. The addition-curable silicone composition according to claim 1 , wherein the addition-curable silicone composition provides a cured product having a refractive index (25° C.) with a visible light (589 nm) of 1.40 or less by curing.4. The addition-curable silicone composition according to claim 2 , wherein the addition-curable silicone composition provides a cured product having a refractive index (25° C.) with a visible light (589 nm) of 1.40 or less by curing.5. An optical device encapsulated with a cured product of the addition-curable silicone composition according to .6. An optical device encapsulated with a cured product of the addition-curable silicone composition according to .7. An optical device encapsulated with a cured product of the addition-curable silicone composition according to .8. An optical device encapsulated with a ...

Silicone adhesive

A silicone adhesive used for bonding semiconductor device, containing (A) addition reaction-curable silicone resin composition having viscosity at 25° C. of 100 Pa·s or less, (B) thermal conductive filler having average particle size of 0.1 μm or more and less than 1 μm, and (C) solvent having boiling point of 250° C. or higher and lower than 350° C., wherein component (B) is contained in an amount of 100 to 500 parts by mass based on 100 parts by mass of component (A), component (C) is contained in an amount of 5 to 20 parts by mass based on 100 parts by mass of component (A), and silicone adhesive uncured has viscosity at 25° C. of 5 to 100 Pa·s. Thus, silicone adhesive has good workability in transferring method to substrate, and is capable of providing cured product that can effectively dissipate heat generated from chip and exhibits high adhesiveness and durability.

UV-THICKENING THERMALLY CONDUCTIVE SILICONE GREASE COMPOSITION

A UV-thickening thermally conductive silicone grease composition: which has (A) an organopolysiloxane, the viscosity at 25° C. of which is 50-100,000 mPa·s and which contains at least one alkenyl group in a single molecule, (B) an organohydrogenpolysiloxane, a single molecule of which contains a hydrogen atom directly bonded to at least two silicon atoms, (C) a photoactive platinum complex curing catalyst, and (D) a thermally conductive filler with a thermal conductivity of at least 10 W/m·° C. as essential components; and the viscosity at 25° C. of which is 30-800 Pa·s when measured at a 10 rpm rotation rate using a Malcom viscometer. For this UV-thickening thermally conductive silicone grease composition, shape-retaining properties at low viscosity are high, deep curing properties can be adjusted using the UV irradiation dose, and the composition after being thickened by irradiating UV rays does not become hard but sets so as to be malleable. 2. The UV-thickening claim 1 , heat-conductive silicone grease composition of wherein component (B) is free of RSiO units wherein Ris independently a substituted or unsubstituted monovalent hydrocarbon group claim 1 , and contains the silicon-bonded hydrogen atoms only on side chains claim 1 , but not at the end.5. The UV-thickening claim 1 , heat-conductive silicone grease composition of claim 1 , further comprising (F) 0.1 to 100 parts by weight of finely divided silica per 100 parts by weight of component (A).6. The UV-thickening claim 5 , heat-conductive silicone grease composition of wherein the finely divided silica as component (F) is surface-treated fumed silica.7. The UV-thickening claim 1 , heat-conductive silicone grease composition of claim 1 , further comprising (H) 0.1 to 20 parts by weight of an adhesion promoter per 100 parts by weight of component (A).8. The UV-thickening claim 1 , heat-conductive silicone grease composition of which has a shape retention as demonstrated by a diameter change within 1 mm when ...

Ultraviolet-thickenable thermally conductive silicone grease composition

Provided is a one-pack type ultraviolet-thickable thermally conductive silicone grease composition which, at the initial stage, has a low viscosity (is easy to apply) but has high shape retentivity and which, after curing, is pliable (has low hardness). The ultraviolet-thickable thermally conductive silicone grease composition comprises, as essential components, (A) an organopolysiloxane having a viscosity at 25° C. of 50-100,000 mPa·s and containing at least one alkenyl group in the molecule, (B) a liquid organohydrogenpolysiloxane which has a viscosity at 25° C. of 100 mPa·s or less, contains 2-10 silicon-atom-bonded hydrogen atoms in the molecule and contains at least one alkoxy and/or epoxy group bonded to a silicon atom through an alkylene group and in which the polysiloxane has a degree of polymerization of 15 or less and the skeleton of the polysiloxane includes a cyclic structure, (C) a photoactivable platinum complex curing catalyst, and (D) a thermally conductive filler having a thermal conductivity of 10 W/m·° C. or greater.

THERMALLY CONDUCTIVE SILICONE GREASE COMPOSITION

Provided is a thermally conductive silicone grease composition that comprises: (A) an organopolysiloxane having a specific kinematic viscosity; (B) an organopolysiloxane having a specific kinematic viscosity; (C) a spherical aluminum oxide powder which has a specific average sphericity, a specific number of surface hydroxyl groups, and a specific average particle size, and for which the proportion of coarse particles in a laser diffraction type particle size distribution of 25 to 45 μm is within a specific range; and (D) a spherical and/or amorphous zinc oxide powder which has a specific average particle size, and for which the proportion of coarse particles in a laser diffraction type particle size distribution of 25 to 45 μm is within a specific range. The composition has a thermal conductivity measured by the hot disk method conforming to ISO 22007-2 of 2 W/m·K or more and less than 5.5 W/m·K, has a coefficient of viscosity measured by a spiral viscometer at a rotation frequency of 10 rpm of 5 to 800 Pa·s, has insulation properties and high thermal conductivity, and has excellent flowability, workability, and heat dissipation properties. 2. The heat conductive silicone grease composition of which after heat degradation at 200° C. for 100 hours claim 1 , turns to an uncured grease state having a viscosity at 25° C. of up to 1 claim 1 ,000 Pa·s as measured by a spiral viscometer at rotational speed 10 rpm.3. The heat conductive silicone grease composition of claim 1 , further comprising (E) a volatile solvent in which components (A) and (B) are dispersible or dissolvable claim 1 , in an amount of up to 100 parts by weight per 100 parts by weight of components (A) and (B) combined.4. The heat conductive silicone grease composition of claim 1 , further comprising claim 1 , (F) an alkoxysilane having the general formula (3):{'br': None, 'sup': 4', '5', '6, 'sub': d', 'e', '4-d-e, 'RRSi(OR)\u2003\u2003(3)'}{'sup': 4', '5', '6, 'sub': 9', '15', '1', '8', '1', '6, ' ...

LOW HEAT RESISTANCE SILICONE COMPOSITION

A low heat resistance silicone composition, including: (A) an organopolysiloxane having a specific kinematic viscosity; (B) an organopolysiloxane having a specific kinematic viscosity; (C) an α-aluminum oxide powder, α-aluminum oxide having a specific crystal structure and a particle shape with a D/H ratio in the predetermined range when a maximum particle diameter parallel to a hexagonal lattice face of the hexagonal close-packed lattice is taken as D and a particle diameter perpendicular to the hexagonal lattice face is taken as H, and the α-aluminum oxide powder having a specific average particle diameter, a specific content of coarse particles, and a specific purity; and (D) a spherical and/or irregular-shaped zinc oxide powder having a specific average particle diameter, and a specific content of coarse particles, in which the low heat resistance silicone composition has a specific heat conductivity and a specific viscosity. 2. The low heat resistance silicone composition according to which has a heat resistance at 25° C. as measured by a laser flash method of 6 mm·K/W or less.3. The low heat resistance silicone composition according to which has a heat resistance at 25° C. as measured by a laser flash method of 6 mm·K/W or less after the composition is left to stand for 96 hours under an atmosphere of 130° C./85% RH.4. The low heat resistance silicone composition according to which has a viscosity at 25° C. of 1 claim 1 ,000 Pa·s or less as measured by a spiral viscometer at a rotation speed of 10 rpm after the composition is heat-deteriorated at 200° C. for 100 hours.5. The low heat resistance silicone composition according to claim 1 , further comprising:component (E) of a volatile solvent capable of dispersing or dissolving components (A) and (B) in the solvent, in an amount of 100 parts by weight or less per 100 parts by weight of the total amount of components (A) and (B) combined.7. The low heat resistance silicone composition according to which has a ...

HIGHLY THERMALLY-CONDUCTIVE SILICONE COMPOSITION AND CURED PRODUCT THEREOF

This highly thermally-conductive silicone composition is obtained by blending, as thermally-conductive fillers at a specific ratio and in specific amounts in (A) a silicone composition containing an organopolysiloxane as a main agent, (B) a spherical magnesium oxide powder having an average sphericity of 0.8 or more, an average particle size of 80-150 μm, and a purity of 98 mass % or more, and (C) (C-I) a spherical aluminum oxide powder which has an average sphericity of 0.8 or more and an average particle size of 7-60 μm, and in which the proportion of rough particles of 96-150 μm is 0.1-30 mass % in the entire component (C-I) in a laser diffraction particle size distribution, and (C-II) a spherical or irregularly-shaped aluminum oxide powder having an average particle size of 0.1-4 μm. The thermal conductivity of the composition is 7.0 W/m·K or more, and the viscosity of the composition at 25° C. is 30-800 Pa·s. This highly thermally-conductive silicone composition has excellent electrical insulating properties and thermal conductivity. 1. A highly heat conductive silicone composition comprising(A) an organopolysiloxane,(B) a spherical magnesium oxide powder having an average sphericity of at least 0.8, an average particle size of 80 to 150 μm, and a purity of at least 98% by weight, and(C) (C-I) a spherical aluminum oxide powder having an average sphericity of at least 0.8 and an average particle size of 7 to 60 μm, in which coarse particles having a size of 96 to 150 μm in laser diffractometry particle size distribution account for 0.1 to 30% by weight of the overall component (C-I), and (C-II) a spherical or irregular shape aluminum oxide powder having an average particle size of 0.1 to 4 μm, whereina blending proportion of component (C-I) to component (C-II) ranges from 2.0:8.0 to 8.0:2.0 in volume ratio, a blending proportion of component (B) to component (C) ranges from 5.0:5.0 to 9.5:0.5 in volume ratio, the total amount of components (B) and (C) is 80 to ...

Vaporizer and apparatus for vaporizing and supplying

The present invention provides a vaporizer having a vaporization chamber for a CVD material, a CVD material feed portion supplying the CVD material for the vaporization chamber, a vaporized gas exhaust port and a heater for heating the vaporization chamber, wherein the CVD material feed portion has passageways for the CVD material and for a carrier gas respectively and the passageway for the CVD material has a pressure loss inducer for the CVD material. At the same time, the present invention provides an apparatus for vaporizing and supplying that feeds a CVD material to a vaporizer via a liquid flow controller, and after vaporizing the CVD material that supplies the vaporized gas for a semiconductor production apparatus having a pressure loss-inducer for the CVD material between the liquid flow controller and the vaporizer. According to the present invention, even in the case of vaporizing and supplying with a decrease in a feed amount of a carrier gas to be supplied accompanying the CVD material employing a solid CVD material, reducing and stabilizing both the pressure fluctuation in the vaporizer and the flow rate fluctuation in the liquid flow controller and efficiently vaporizing a CVD material at a desirable concentration and flow rate without causing deposit or adhesion of the solid material in the vaporization chamber can be achieved.

Plate member taking-out hand and plate member taking- out method

(57)【要約】 【課題】 板状部材の取り出し時の衝撃が小さく、切り 離し時の負荷が小さく、板状部材の種類に関わらずスム ーズな取り出しが行なえる板状部材取り出しハンドおよ び板状部材の取り出し方法を提供する。 【解決手段】 このウェハ取り出しハンド１では、吸着 パッド３ａ,３ｂが、図示しない真空ポンプの駆動によ る吸引によって、ウェハ１０の表面に吸着する。また、 ベルヌーイ吸着器４も気流を吹き出すことで、ウェハ１ ０に吸着する。この吸着パッド３ａ,３ｂとベルヌーイ 吸着器４による吸着でもって、ハンド１はウェハ１０を 保持する。このハンド１は、図４(Ｃ)に示す引き上げ途 中段階においても、各シリンダ６ａ,６ｂ,７のピストン １８,７ａの引き上げ量Ｄ１,Ｄ２を調整することで、ウ ェハ１０に生じる応力を最小となるようにして、引き上 げ時のウェハ１０の割れを低減することができる。

Thermally conductive silicone grease composition

Provided is a thermally conductive silicone grease composition that comprises: (A) an organopolysiloxane having a specific kinematic viscosity; (B) an organopolysiloxane having a specific kinematic viscosity; (C) a spherical aluminum oxide powder which has a specific average sphericity, a specific number of surface hydroxyl groups, and a specific average particle size, and for which the proportion of coarse particles in a laser diffraction type particle size distribution of 25 to 45 µm is within a specific range; and (D) a spherical and/or amorphous zinc oxide powder which has a specific average particle size, and for which the proportion of coarse particles in a laser diffraction type particle size distribution of 25 to 45 µm is within a specific range. The composition has a thermal conductivity measured by the hot disk method conforming to ISO 22007-2 of 2 W/m·K or more and less than 5.5 W/m·K, has a coefficient of viscosity measured by a spiral viscometer at a rotation frequency of 10 rpm of 5 to 800 Pa·s, has insulation properties and high thermal conductivity, and has excellent flowability, workability, and heat dissipation properties.

Liquid organopolysiloxane composition for matting and cured article having a matted surface

A liquid organopolysiloxane composition is provided. This composition can readily form a cured article having a matted surface without requiring separate step such as mechanical surface roughening, and this composition is well adapted for use as a potting material or a coating material in electric and electronic components such as LED. An article having a matted surface produced by curing such composition is also provided. The liquid organopolysiloxane composition for matting comprises (A) 100 parts by weight of a thermosetting liquid organopolysiloxane composition, and (B) 0.1 to 100 parts by weight of a hollow filler having a melting point of at least 150° C., a specific weight of 0.01 to 0.8, and a particle size of up to 200 μm. The composition has a viscosity at room temperature of 100 to 100,000 mPa·s. The resulting cured article has a surface glossiness of up to 40.

One-liquid-type thermosetting heat-conductive silicone grease composition, and method for producing cured product thereof

Provided is a one-liquid-type thermosetting heat-conductive silicone grease composition which initially has low viscosity but high shape retention, which becomes soft after heat-curing, which has good adhesion to a substrate, and which can be stored at room temperature. Also provided is a method for producing a cured product of said composition. This one-liquid-type thermosetting heat-conductive silicone grease composition comprises, as essential components, (A) an alkenyl-group-containing organopolysiloxane having a viscosity at 25°C of 50-100,000 mPa·s, (B) a liquid organohydrogenpolysiloxane having a viscosity at 25°C of 100 mPa·s or less, having 2-10 Si-H groups and an alkoxy group and/or an epoxy group, having a degree of polymerization of 15 or less, and having a polysiloxane backbone including a cyclic structure, (C) a specific photoactive platinum complex curing catalyst, and (D) a heat-conductive filler having a heat conductivity of 10 W/m·°C or more, wherein the composition has a viscosity at 25°C of 30-800 Pa·s, as measured at a rotation speed of 10 rpm using a Malcom viscometer, and the composition can be stored at room temperature.

Manufacture of electro-optical device

(57)【要約】 【課題】 優れた電気光学特性と高い光透過率を有しか つ駆動電圧が低くて大面積の電気光学デバイスの製造を 可能にして提供する。 【解決手段】 電気光学デバイスの作製方法は、透明基 板１上に第１透明導電膜２、窒化アルミニウム膜３、お よび第２透明導電膜４を順次堆積する工程を含み、窒化 アルミニウム膜３の形成工程において、ターゲット電圧 とターゲット電流が互いに独立に制御され得るスパッタ 法を用い、ターゲットとしてアルミニウムを使用し、ス パッタガスとしてアルゴンと窒素の混合ガスを用いるこ とを特徴としている。

Vaporizer

A vaporizer which comprises a vaporization chamber for a CVD material, a CVD material feed portion for supplying the vaporization chamber with the CVD material, a vaporized gas exhaust port and a heating means for heating the vaporization chamber, characterized in that it further comprises an ejection tube of double structure wherein the outer diameter of the outer tube has a portion gradually thinning towards the ejection port to the vaporization chamber. The vaporizer in accordance with the present invention provide, even in the case where decreasing the feed amount of carrier gas supplied by accompanying with the CVD material or increasing the concentration of solid CVD material dissolved in the solvent, a capability of suppressing the separating and adhesion of the solid CVD material near the ejection port to the vaporization chamber. Accordingly, a pressure fluctuation of the vaporized gas or a concentration fluctuation of the CVD material was suppressed and the vaporizing and supplying the CVD material with extreme high vaporizing efficiency and stably for long time, with a desired concentration and a desired flow amount became possible.

Adhesive for silicone rubber

An adhesive comprising (A) an organopolysiloxane containing, on average, at least two silicon-bonded alkenyl groups in a molecule, (B) an organohydrogenpolysiloxane containing, on average, at least two SiH groups in a molecule, (C) a calcium carbonate powder surface treated with a paraffinic compound and having a specific surface area of up to 6 m 2 /g, and (D) a platinum group metal catalyst is fully adherent to silicone rubber and shelf stable.

Thermoconductive silicone rubber composition

(57)【要約】 【課題】熱伝導性充填剤を多量に配合しても成形加工性 や接着性が良好な熱伝導性シリコーンゴム組成物および 該組成物を硬化して得られる熱伝導性成形品を提供す る。 【解決手段】(A)一分子中に平均0.1個以上のケイ素原子 結合アルケニル基を含有するオルガノポリシロキサン、 (B)一分子中に平均２個以上のケイ素原子結合水素原子 を含有するオルガノポリシロキサン、(C)熱伝導性充填 剤、(D)白金触媒、および、(E)下記一般式(I)で表され る加水分解性基とビニル基を含有するメチルポリシロキ サン 【化１】 の(A)成分〜(E)成分を含有することを特徴とする熱伝導 性シリコーンゴム組成物および該組成物を硬化して得ら れる成形品。

Thermally conductive silicone grease composition

Provided is a thermally conductive silicone grease composition that comprises: (A) an organopolysiloxane having a specific kinematic viscosity; (B) an organopolysiloxane having a specific kinematic viscosity; (C) a spherical aluminum oxide powder which has a specific average sphericity, a specific number of surface hydroxyl groups, and a specific average particle size, and for which the proportion of coarse particles in a laser diffraction type particle size distribution of 25 to 45 μm is within a specific range; and (D) a spherical and/or amorphous zinc oxide powder which has a specific average particle size, and for which the proportion of coarse particles in a laser diffraction type particle size distribution of 25 to 45 μm is within a specific range. The composition has a thermal conductivity measured by the hot disk method conforming to ISO 22007-2 of 2 W/m·K or more and less than 5.5 W/m·K, has a coefficient of viscosity measured by a spiral viscometer at a rotation frequency of 10 rpm of 5 to 800 Pa·s, has insulation properties and high thermal conductivity, and has excellent flowability, workability, and heat dissipation properties.

Epoxy resin composition for fiber-reinforced composite material

Provided is an epoxy resin composition for fiber-reinforced composite materials, which serves as a matrix resin composition for use in a self-adhesive prepreg for a face sheet of a honeycomb panel. The epoxy resin composition enables to increase self-adhesiveness of the prepreg, while improving workability and appearance quality of the prepreg. The epoxy resin composition is characterized by containing: an epoxy resin (A) which is in a liquid state at room temperature; a thermoplastic resin (B) which dissolves in the epoxy resin (A) at a temperature not less than 90°C; thermosetting resin particles (C) which do not completely dissolve in the epoxy resin (A) at a temperature less than 90°C and has a softening point of not less than 120°C; and a curing agent (D).

Epoxy resin compositions for fiber-reinforced composite materials

Method for vaporizing and supplying

There is disclosed a vaporizing and supplying method for controlling a liquid CVD material in flow rate with liquid flow rate controllers, supplying a vaporizer with the material, vaporizing the same, and supplying a semiconductor manufacturing apparatus with the vaporized material, which comprises installing in parallel, a plurality of liquid flow rate controllers, preferably each having a different controllable range of flow rate, and supplying the vaporizer with the material at a variable flow rate thereof by altering the single use of any of the controllers to the simultaneous use of a plurality thereof or vice versa, and/or switching any of the controllers one after another.

EPOXY RESIN COMPOSITION FOR REINFORCED FIBER COMPOSITE METHOD FOR THE PRODUCTION OF A PREPREGNATED REINFORCED FIBER EPOXY RESIN COMPOSITION

COMPOSIçãO DE RESINA EPóXI PARA MATERIAL COMPOSTO DE FIBRA REFORçADA MéTODO PARA A PRODUçãO DE UMA COMPOSIçãO DE RESINA EPóXI PRé-IMPREGNADO DE FIBRA REFORçADA PAINEL IMPRESSADO COLMéIA. Uma composição de resina de epóxi é provida para materiais compostos de fibra reforçada, que serve como uma resina matriz para um pré-impregnado. Esta composição de resina epóxi é aperfeiçoada na estabilidade de flexibilidade durante armazenamento, mantendo as suas características mecânicas. A composição de resina epóxi para materiais compostos de fibra reforçada é caracterizada por conter 25 à 50 partes por peso de um agente de cura amina (B) selecionado de poliaminas alifático, poliaminas alicícclico, e poliaminas aromáticos, e 1 à 20 partes por peso de um composto dihidrazida ácido orgânico (C) tendo um ponto de fundição não inferior à 150<198>C, por 100 partes por peso da resina epóxi (A) EPOXY RESIN COMPOSITION FOR REINFORCED FIBER COMPOSITION METHOD FOR PRODUCING A PRE-IMPREGNATED FIBER REINFORCED FIBER COMPOSITION. An epoxy resin composition is provided for fiber reinforced composite materials which serves as a matrix resin for a prepreg. This epoxy resin composition is improved in flexibility stability during storage while retaining its mechanical characteristics. The epoxy resin composition for fiber reinforced composite materials is characterized in that it contains 25 to 50 parts by weight of an amine curing agent (B) selected from aliphatic polyamines, alicyclic polyamines, and aromatic polyamines, and 1 to 20 parts by weight. an organic acid dihydrazide compound (C) having a melting point of not less than 150 ° C per 100 parts by weight of the epoxy resin (A)

Vaporizer and apparatus for vaporizing and supplying

The present invention provides a vaporizer having a vaporization chamber for a CVD material, a CVD material feed portion supplying the CVD material for the vaporization chamber, a vaporized gas exhaust port and a heater for heating the vaporization chamber, wherein the CVD material feed portion has passageways for the CVD material and for a carrier gas respectively and the passageway for the CVD material has a pressure loss inducer for the CVD material. At the same time, the present invention provides an apparatus for vaporizing and supplying that feeds a CVD material to a vaporizer via a liquid flow controller, and after vaporizing the CVD material that supplies the vaporized gas for a semiconductor production apparatus having a pressure loss-inducer for the CVD material between the liquid flow controller and the vaporizer. According to the present invention, even in the case of vaporizing and supplying with a decrease in a feed amount of a carrier gas to be supplied accompanying the CVD material employing a solid CVD material, reducing and stabilizing both the pressure fluctuation in the vaporizer and the flow rate fluctuation in the liquid flow controller and efficiently vaporizing a CVD material at a desirable concentration and flow rate without causing deposit or adhesion of the solid material in the vaporization chamber can be achieved.

Thermosetting resin composition

【課題】強靭性に優れる熱硬化性樹脂組成物の提供。 【解決手段】熱硬化性樹脂中に、熱可塑性樹脂をフィラーに吸着させた吸着フィラーを分散させ、下記（式１）で定義される吸着係数が０より大きく０．８以下であることを満たす熱硬化性樹脂組成物。 （式１） 吸着係数＝前記フィラー１００質量部に吸着された前記熱可塑性樹脂の量（質量部）／前記熱可塑性樹脂の比重／前記フィラーのＤＢＰ吸油量（ｍＬ／１００ｇ） 【選択図】なし

Method for supplying with accuracy a liquid to a CVD apparatus

There is disclosed a vaporizing and supplying method for controlling a liquid CVD material in flow rate with liquid flow rate controllers, supplying a vaporizer with the material, vaporizing the same, and supplying a semiconductor manufacturing apparatus with the vaporized material, which comprises installing in parallel, a plurality of liquid flow rate controllers, preferably each having a different controllable range of flow rate, and supplying the vaporizer with the material at a variable flow rate thereof by altering the single use of any of the controllers to the simultaneous use of a plurality thereof or vice versa, and / or switching any of the controllers one after another.

Epoxy resin composition for fiber-reinforced composite material

Vaporizer and apparatus for vaporizing and supplying

There are disclosed a vaporizer wherein at least a portion of a CVD material feed portion in contact with a CVD material is constituted of a corrosion resistant synthetic resin; and an apparatus for vaporizing and supplying which comprises a cooler and the vaporizer wherein the inside of the CVD material feed portion of the vaporizer and the surface on the side of the vaporization chamber of the CVD material feed portion are constituted of a corrosion resistant synthetic resin; the feed portion in contact with the outside of the vaporizer is constituted of a metal; and the CVD material feed portion which is constituted of a metal and which undergoes heat transfer from the heating means upon heating the vaporization chamber can be cooled with a cooler. The vaporizer and apparatus, when used for supplying a gaseous CVD-material to CVD equipment for producing semiconductors, enables the CVD material to be efficiently vaporized and supplied at desirable concentration and flow rate without causing deposit or adhesion of the CVD material at a CVD material feed port even if a solid CVD-material is used.

Droplet applying apparatus, method for measuring gap of droplet ejecting section and method for adjusting gap of droplet ejecting section

A droplet applying apparatus is provided with a base (11) having a placing surface (11a) for placing a substrate (10); beam sections (41, 42) movably attached to the base (11) in a direction shown by an arrow (A) to the base (11); a plurality of droplet ejecting sections (6) movably attached to the beam sections (41, 42) in a direction shown by an arrow (B) for ejecting a droplet to the substrate (10) placed on the placing surface (11a); a reference section, which is arranged at a portion close to the ejecting surface of each of the droplet ejecting sections (6) on the beam sections (41, 42), and has a known distance to the placing surface (11a); a length measuring section (14) for measuring a distance to the ejecting surface of each droplet ejecting section (6) and a distance to each reference section; and a calculating section (15) for calculating a gap between the ejecting surface of one droplet ejecting section (6) and the placing surface (11a), based on a distance measured by the length measuring section (14) between the ejecting surface of the one droplet ejecting section (6) and the length measuring section (14), a distance between the reference section and the length measuring section (14), and a distance between the known one reference section and the placing surface (11a).

Adhesive for silicone rubber

【課題】シリコーンゴムに対して良好に接着し、かつ保存安定性に優れたシリコーンゴム用接着剤を提供する。 【解決手段】（Ａ）ケイ素原子に結合したアルケニル基を一分子中に平均２個以上有し、かつ２３℃における粘度が０．０５〜１，０００Ｐａ・ｓであるオルガノポリシロキサン：１００質量部、（Ｂ）ケイ素原子に結合した水素原子を一分子中に平均２個以上有し、かつ２３℃における粘度が０．００１〜１００Ｐａ・ｓであるオルガノハイドロジェンポリシロキサン：（Ａ）成分のケイ素原子に結合したアルケニル基に対する本成分中のケイ素原子結合水素原子のモル比が０．０１〜２０となる量、（Ｃ）表面が脂肪酸エステルで処理された炭酸カルシウム：１〜１００質量部、及び（Ｄ）白金族金属系触媒：有効量、を含有してなることを特徴とするシリコーンゴム用接着剤。 【選択図】なし

Flame retardant hydraulic oil

Curable silicone resin composition, cured product thereof and photosemiconductor apparatus

The present invention is curable silicone resin composition which is an addition-curable silicone composition, and comprises: (A) (A-1) a compound having at least two aliphatic unsaturated groups per one molecule and represented by the following formula (1), (B) an organic silicon compound having at least two hydrogen atoms bonded to silicon atom per one molecule and having no aliphatic unsaturated group, (C) a hydrosilylation catalyst containing a platinum group metal, and (D) 0.1 to 500 parts by mass of silicone powder having an average particle diameter of 0.5 to 100 μm based on 100 parts by mass of the total Components (A) and (B). Thereby, there can be provided a curable silicone resin composition having high light extraction efficiency and useful as, for example, an encapsulant, a cured product thereof and a photosemiconductor apparatus.

Droplet applying apparatus

【課題】基板の（着色不良部分等の）所定部分に効率よく液滴を塗布できると共に、基板に対する液滴の着弾位置の精度を向上できる液滴塗布装置を提供する。 【解決手段】基板１０が載置される載置面１１ａを有する基台１１と、上記基台１１に対して矢印Ａ方向に移動可能に上記基台１１に取り付けられたビーム部４１，４２と、上記ビーム部４１，４２に矢印Ｂ方向に移動可能に取り付けられると共に上記載置面１１ａに載置された上記基板１０に液滴を吐出する複数の液滴吐出部６と、この複数の液滴吐出部６の移動または停止を制御する制御部１３とを有する。上記制御部１３は、一の上記液滴吐出部６が吐出している間に、上記一の液滴吐出部６の少なくとも近傍にある他の上記液滴吐出部６が移動しているときの、この他の液滴吐出部６の速度変動時の加速度変化がなだらかとなるように制御する。 【選択図】図１Ｂ

RTV organopolysiloxane compositions

An organopolysiloxane composition comprising (A) an organopolysiloxane, (B) a silane compound having at least two hydrolyzable groups or a partial hydrolyzate thereof, and (C) the addition reaction product between a vinyl group-bearing bisphenol A skeleton compound and an organoxy group-bearing silicon compound is curable at room temperature to a variety of resins including PBT, HIPS and acrylic resins.

Droplet applying apparatus

Epoxy resin composition for fiber-reinforced composite material

An epoxy resin composition for fiber-reinforced composite materials which is improved in toughness necessary for improving the strength of self-adhesion of a matrix resin for use in a prepreg for a face plate of a honeycomb panel. The epoxy resin composition comprises an epoxy resin (A), a thermoplastic resin (B), fine solid resin particles (C), and a curing agent (D), and is characterized in that the epoxy resin composition, through curing, comes into a state in which the epoxy resin (A) and the thermoplastic resin (B) form co-continuous phases and the fine solid resin particles (C) are dispersed in at least the continuous phase of the epoxy resin (A) of the co-continuous phases.

熱伝導性シリコーン組成物及びその硬化物、ならびに電子装置及びその製造方法

【課題】ズレ（ポンプアウト現象）が抑制され、放熱性に優れた熱伝導性シリコーン組成物及びその硬化物、熱伝導性シリコーン組成物を用いた高信頼性の電子装置及びその製造方法を提供する。【解決手段】（Ａ）下記一般式（１）Ｒ1aＳｉＯ(4-a)/2（１）で表される２５℃における粘度が１０〜１００，０００ｍｍ2／ｓのオルガノポリシロキサン：１００質量部、（Ｂ）平均粒径０．１〜１５０μｍの熱伝導性充填剤：３００〜４，０００質量部、及び（Ｃ）１０時間半減期温度が６０〜１３０℃である有機過酸化物：０．１〜１０質量部を含有し、熱伝導率が１Ｗ／ｍＫ以上の熱伝導性シリコーン組成物であって、その硬化物の２５℃におけるずり弾性率が５，０００〜３００，０００Ｐａであり、熱伝導率が１Ｗ／ｍＫ以上である熱伝導性シリコーン組成物。【選択図】なし

聚矽氧接著劑

提供一種聚矽氧接著劑，其係賦予對基板之轉印法之作業性良好、接著力高、耐久性優異、可有效地將來自晶片所產生的熱予以散熱的硬化物。 本發明之聚矽氧接著劑，其係半導體元件之接著用之聚矽氧接著劑，包含：(A)25℃時之黏度為100Pa‧s以下之加成反應硬化型聚矽氧樹脂組成物；(B)平均粒徑為0.1μm以上、未滿1μm之熱傳導性填充劑；及(C)沸點為250℃以上、未滿350℃之溶劑，對於(A)成分100質量份而言(B)成分之調配量為100~500質量份，對於(A)成分100質量份而言(C)成分之調配量為5~20質量份，硬化前的聚矽氧接著劑之25℃時之黏度為5~100Pa‧s。

Thermally conductive addition curing silicone composition and method for producing same

紫外線増粘型熱伝導性シリコーングリース組成物

【課題】初期において低粘度（塗布し易い）であっても形状維持性が高く、硬化後は柔らかい（低硬度である）、一液型の紫外線増粘型熱伝導性シリコーングリース組成物を提供する。【解決手段】（Ａ）２５℃の粘度が５０〜１００，０００ｍＰａ・ｓであり、１分子中に少なくとも１つのアルケニル基を含有するオルガノポリシロキサン、（Ｂ）２５℃の粘度が１００ｍＰａ・ｓ以下であり、１分子中にケイ素原子と結合する水素原子を２〜１０個含有し、アルキレン基を介してケイ素原子と結合するアルコキシ基及び／又はエポキシ基を少なくとも１個含有し、ポリシロキサンの重合度が１５以下であり、かつポリシロキサンの骨格が環状構造を含む液状オルガノハイドロジェンポリシロキサン、（Ｃ）光活性型白金錯体硬化触媒、（Ｄ）１０Ｗ／ｍ・℃以上の熱伝導率を有する熱伝導性充填剤を必須成分とする紫外線増粘型熱伝導性シリコーングリース組成物。【選択図】なし

付加硬化型シリコーン組成物及び光学素子

【課題】低屈折率で、高い透明性を有し、光取出し効率にも優れ、かつゴム的性質及び強度特性が良好で、硬化後タックを有せず、特に２５℃における波長４００ｎｍの光透過率が良好な硬化物を与える付加硬化型シリコーン組成物を提供する。【解決手段】（Ａ）珪素原子結合脂肪族不飽和基及び珪素原子結合ＣＦ３−（ＣＦ２）ｙ−（ＣＨ２）ｚ−基を有する直鎖状オルガノポリシロキサン、（Ｂ）珪素原子結合脂肪族不飽和基及び珪素原子結合ＣＦ３−（ＣＦ２）ｙ−（ＣＨ２）ｚ−基を有し、かつＳｉＯ４／２及び／又はＲＳｉＯ３／２で示される分岐構造を有するオルガノポリシロキサン、（Ｃ）下記一般式（１）で表される珪素原子結合水素原子を有する有機珪素化合物、及び【化１】（Ｄ）白金族金属系触媒、を含む付加硬化型シリコーン組成物。【選択図】なし

Zweiteiliges, durch Additionsreaktion härtendes Haftmittel für Silicongummi

白色熱硬化性シリコーン組成物及び該組成物の硬化物からなる白色発光ダイオード用リフレクター

【課題】 光反射材料、特に白色ＬＥＤ用リフレクター材料として有用なシリコーン樹脂硬化物を与える白色熱硬化性シリコーン組成物、および該組成物の硬化物からなる白色発光ダイオード用リフレクターを提供することを目的とする。 【解決手段】 （Ａ）（ａ）Ｓｉ−Ｈを１分子中に２個有する化合物と、（ｂ）付加反応性Ｃ＝Ｃを１分子中に２個有する多環式炭化水素との付加反応生成物であり、付加反応性Ｃ＝Ｃを１分子中に少なくとも２個有する付加反応生成物、（Ｂ）Ｓｉ−Ｈを１分子中に３個以上有する有機ケイ素化合物、（Ｃ）ヒドロシリル化反応触媒、（Ｄ）結晶形態がルチルである酸化チタン粉末を含有する白色熱硬化性シリコーン組成物。 【選択図】なし

Epoxy resin composition for fiber-reinforced composite material, prepreg and fiber-reinforced composite material

Thermally-conductive two-part addition-curable silicone composition and method for producing the same

A thermally-conductive two-part addition-curable silicone composition including a first liquid and a second liquid and a method of producing the same. The first liquid includes a heat-treated mixture including an organopolysiloxane having two or more alkenyl groups and aluminum oxide having Na+ ion content equal to or lower than 100 ppm, a platinum-group metal catalyst, and an ion-trapping agent of a cation-exchange type and/or a cation-and-anion-exchange type. The second liquid includes a heat-treated mixture including an organopolysiloxane having two or more alkenyl groups, an organohydrogenpolysiloxane having three or more SiH groups, aluminum oxide having Na+ ion content equal to or lower than 100 ppm, and an organohydrogenpolysiloxane having two SiH groups.

Thermally conductive two-component addition curing type silicone composition and manufacturing method therefor

移動装置、サーバ、および移動装置制御システム

【課題】転倒等の所定の制御対象状態の発生を制御する。 【解決手段】移動装置（１０）は、各種状態を検出する状態検知部（１１０）と、転倒推定関数に各種状態を示す情報を入力して転倒の可能性値を算出する算出部（１０２）と、転倒可能性値に基づき、検出された状態を示す情報に対応する走行制御処理を実行する制御処理指示部（１０３）と、を備える。 【選択図】図１

Adhesive for optical semiconductor devices, adhesive sheet for optical semiconductor devices, method for producing adhesive sheet for optical semiconductor devices, and method for producing optical semiconductor devices

電子カルテ装置、及び、プログラム

【課題】医師等が診療記録を効率良く入力でき、その入力された診療記録を利活用の幅を広げること。【解決手段】診療記録を入力及び表示する領域である記載領域に対応付けられているメタデータが、問題指向型診療記録に係るＳＯＡＰに対応するＳＯＡＰ要素を含んでおり、ＳＯＡＰ要素と記載領域に含まれるサブ領域とが関連付けられており、電子カルテ装置が、サブ領域に入力された診療記録をメタデータに反映する領域制御部と、メタデータに反映された診療記録を記憶部に格納するデータ制御部と、を備える。【選択図】図３

Epoxy resin composition for prepreg, and prepreg

This epoxy resin composition for prepregs comprises (A) an epoxy resin, (B) a hardener or a hardening accelerator, (C) fine silica particles, and (D) core/shell rubber particles, wherein the fine silica particles (C) and the core/shell rubber particles (D) are contained in amounts of 1-5 parts by mass and 2-10 parts by mass, respectively, per 100 parts by mass of the epoxy resin (A), the mass ratio of the fine silica particles (C) to the core/shell rubber particles (D), (C)/(D), being 1/1 to 1/5.

Epoxy resin composition for prepreg, and prepreg

This epoxy resin composition for prepregs comprises (A) an epoxy resin, (B) a hardener or a hardening accelerator, (C) fine silica particles, and (D) core/shell rubber particles, wherein the fine silica particles (C) and the core/shell rubber particles (D) are contained in amounts of 1-5 parts by mass and 2-10 parts by mass, respectively, per 100 parts by mass of the epoxy resin (A), the mass ratio of the fine silica particles (C) to the core/shell rubber particles (D), (C)/(D), being 1/1 to 1/5.

Epoxy resin composition for prepreg, and prepreg

The epoxy resin composition for a prepreg according to an embodiment of the present invention contains (A) an epoxy resin, (B) a curing agent or a curing accelerator, (C) silica microparticles, and (D) core-shell rubber particles, the epoxy resin composition containing from 1 to 5 parts by mass of (C) the silica microparticles and from 2 to 10 parts by mass of (D) the core-shell rubber particles per 100 parts by mass of (A) the epoxy resin, and a mass ratio of (C) the silica microparticles to (D) the core-shell rubber particles, in terms of (C)/(D), being from 1/1 to 1/5.

粒子含有インク塗布装置、および、粒子含有インク塗布装置の吐出位置補正方法

【課題】短時間に補正量の算出をおこなう。 【解決手段】基板に対して相対的に移動可能なヘッドユニットには、吐出ヘッド１５が保持されている。そして、吐出ヘッド１５内における補正用ノズル２９に連通する圧力室２６とインク室２５との間には、粒子含有インクに含まれている粒子を通し難いフィルタ３０を設けている。こうして、粒子を約１０重量％含有したインクを用いる場合でも、補正用ノズル２９から吐出されたインクに含まれる粒子の濃度を約２重量％程度に下げることができ、着弾位置のばらつきを低減することができる。その結果、着弾ばらつきの中心位置を±５μmの精度で求める際に、補正用ノズル２９よりインクを吐出してから着弾位置を計測するまでの一連の作業を１０回繰り返せばよく、短時間に高精度の着弾位置補正を行うことができる。 【選択図】図３

気化供給方法

【課題】 強誘電体膜の成膜に必要な全ての各種液体ＣＶＤ原料を、１個の脱ガス器、１個の液体流量制御器、及び１個の気化器を用いて気化し、半導体製造装置に供給することが可能な気化供給方法を提供する。 【解決手段】 強誘電体膜成膜用の各種液体ＣＶＤ原料を、混合した後、気化器に供給して気化し、半導体製造装置へ供給する気化供給方法において、予め液体ＣＶＤ原料に、液体ＣＶＤ原料に含まれていないエーテル、ケトン、エステル、及び炭化水素から選ばれる１種以上の有機溶媒を、各種液体ＣＶＤ原料及び有機溶媒を混合した後の液全量に対して１〜２０ｖｏｌ％となるように添加、混合して、混合ＣＶＤ原料液を調製する。 【選択図】 図１

空気入りタイヤ

【課題】軽量化性、剛性及び転がり抵抗性に優れる空気入りタイヤを提供する。 【解決手段】トレッド部のカーカス層のタイヤ径方向外側に、コード方向が互いに交差する少なくとも２層のベルト層を有する空気入りタイヤであって、上記ベルト層のうち少なくとも１層が、ガラス繊維コードとゴム組成物とを含有するガラス繊維コード補強ゴム層であり、上記ガラス繊維コード補強ゴム層中の上記ゴム組成物の体積率Ｖｒと、上記ガラス繊維コード補強ゴム層中の上記ガラス繊維コードの体積率Ｖｆとの比率Ｖｒ／Ｖｆが、０．２０〜５．００である、空気入りタイヤ。 【選択図】図１

Composición de resina epoxídica para material compuesto reforzado con fibra, prepreg y material compuesto reforzado con fibra

En la presente invención, con el fin de proporcionar una composición de resina epoxi para un material compuesto reforzado con fibras que presente excelente resistencia al calor, tenacidad y trabajabilidad, se necesitan de 8 a 15 partes en masa de (C) una resina termoplástica, de 2 a 10 partes en masa de (D) partículas finas de elastómero que tienen un diámetro de partícula promedio de 1000 nm o menos, y 0,5-2,5 partes en masa de (E) partículas finas de sílice que tienen un diámetro de partícula promedio de 1000 nm o menos se mezclan con 100 partes en masa de un componente de resina epoxi constituido por: 60-85 partes en masa de (A) una resina de N,N,N',N'-tetraglicidil diaminodifenilmetano que tiene una viscosidad a 50°C de 6000 mPa·s o menos; y 15-40 partes en masa de (B) una resina epoxídica líquida de tipo bisfenol A que tiene una viscosidad a 25°C de 20.000 mPa·s o menos. (Traducción automática con Google Translate, sin valor legal)

Thermally conductive silicone composition

フレア成形装置

【課題】アルミニウムの粉体付着を抑制することができ、また冷媒を支障なく通流させ得るフレア成形装置を提供する。 【解決手段】アルミニウム管３３の端部３３ａにフレア部を成形するフレア成形装置５０であって、フレア部を成形するためのフレア形成部材５４と、軸部７５を有し、その一端にフレア形成部材５４が、他端にハンドル５３が設けられた回動手段８３と、ハンドル５３からの回動力を前進方向Ａの力に変えるための変換手段８１と、変換手段８１で発生した前進方向Ａの力により圧縮され、その圧縮力によりフレア形成部材５４を端部３３ａに押し付けて拡径させるばね６４とを具備し、フレア形成部材５４の成形面５４ｂにＤＬＣ膜５４ｃが形成され、ばね６４にばね定数が２００〜２４０Ｎ／ｍｍのものが用いられており、変換手段８１はばね６４の縮み量が所定値以上になるとハンドル５３から受けた回動力を前進方向Ａの力に変換しないようにする。 【選択図】図５

Composición de grasa de silicona termoconductora de curado por adición de un solo componente

Una composición de grasa de silicona termoconductora de curado por adición de un solo componente que puede almacenarse a temperatura normal, donde la composición comprende, (A) 100 partes en peso de un organopolisiloxano que contiene al menos un grupo alquenilo por molécula y que tiene una viscosidad de 50 mPa s a 100 000 mPa s a 25 °C medida por un viscosímetro giratorio; (B) un organohidrogenpolisiloxano que contiene al menos dos átomos de hidrógeno unidos al silicio por molécula, que no tiene una unidad R2SiO (en la que R representa independientemente un grupo hidrocarburo monovalente no sustituido o sustituido), que no tiene un átomo de hidrógeno unido al silicio en ningún extremo terminal, que tiene los átomos de hidrógeno unidos al silicio solo en una cadena o cadenas laterales, y que está en una forma de cadena sustancialmente recta, en una cantidad tal que la relación de {la cantidad de grupos Si-H}/{la cantidad de grupos alquenilo en la composición} está en el intervalo de 0,1 a 5,0; (C) un catalizador de curado de complejo de platino de tipo fotoactivo seleccionado del grupo que consiste en complejo de trimetil(acetil-lacetonato)platino, complejo trimetil(2,4-pentanodionato) de platino, complejo trimetil(3,5-heptanodionato) de platino, complejo trimetil(metilacetoacetato) de platino, complejo bis(2,4-pentanodionato)platino, complejo bis(2,4-hexanodionato)platino, complejo bis(2,4-heptanedionato)platino, complejo bis(3,5-heptanedionato)platino, complejo bis(1-fenil-1,3-butanodionato)platino, complejo bis(1,3-difenil-1,3-propanodionato)platino, complejo (1,5-ciclooctadienil)dimetilplatino, complejo (1,5- ciclooctadienil)difenilplatino, complejo (1,5-ciclooctadienil)dipropilplatino, complejo (2,5-norboradi- eno)dimetilplatino, complejo (2,5-norboradieno)difenilplatino, complejo (ciclopentadienil)dimetilplatino, complejo (metilciclopentadienil)dietilplatino, complejo (trimetilsililciclopentadienil)difenilplatino, complejo (metilcicloocta-1,5- dienil) ...

繊維強化複合材料用エポキシ樹脂組成物、繊維強化複合材料用エポキシ樹脂組成物の製造方法、プリプレグ及びハニカムパネル

【課題】低温で硬化可能であり、難燃性及び貯蔵安定性に優れ、しかも、ハニカムコアとの接着性に優れた硬化物を得ることができる繊維強化複合材料用エポキシ樹脂組成物、繊維強化複合材料用エポキシ樹脂組成物の製造方法、プリプレグ及びハニカムパネルを提供すること。【解決手段】本発明の繊維強化複合材料用エポキシ樹脂組成物は、骨格にリン原子を含有するリン含有エポキシ樹脂１００質量部とアミノ基末端ブタジエン−アクリロニトリルゴム５質量部以上２０質量部以下とを反応させた反応物と、リン含有エポキシ樹脂以外の他のエポキシ樹脂と、硬化剤と、硬化促進剤と、を含有することを特徴とする。【選択図】なし

Composición de resina epoxídica para material compuesto reforzado con fibra, método para producir una composición de resina epoxídica para material compuesto reforzado con fibra, material preimpregnado y panel con estructura tipo panal de abeja

Una composición de resina epoxídica para un material compuesto reforzado con fibra que comprende: un producto de reacción obtenido haciendo reaccionar 100 partes en masa de una resina epoxídica que contiene fósforo que contiene un átomo de fósforo en su cadena principal, y no menos de partes en masa y no más de 20 partes en masa de un caucho líquido con terminaciones amino; una resina epoxídica que no sea la resina epoxídica que contiene fósforo; un agente de curado; y un acelerador del curado.

Epoxy resin composition for fiber-reinforced composite material, method for producing epoxy resin composition for fiber-reinforced composite material, prepreg, and honeycomb panel

口腔内カメラ

【課題】口腔内カメラに関するもので、作業性を高める事を目的とする。 【解決手段】口腔内挿入部３と、この口腔内挿入部３に設けられた撮像窓３ａと、この撮像窓３ａ周辺に設けられた高輝度ＬＥＤ９と、撮像窓３ａに光学的に接続された焦点レンズを有する撮像装置とを備え、撮像装置は、前記焦点レンズを、通常ＡＦモード、あるいは根管ＡＦモードで駆動するＡＦ駆動部を有し、本体ケースには、根管ＡＦモードを設定する根管ＡＦモードスイッチを設け、この根管ＡＦモードスイッチからの信号を受けた制御器は、撮像装置を根管ＡＦモードにするとともに、焦点レンズの駆動範囲の近点位置を、この焦点レンズの駆動範囲の遠点位置方向の所定位置に設定する。 【選択図】図９

Thermally conductive addition-curing silicone composition and method for producing same

The present invention is a thermally conductive addition-curable silicone composition, including: a heat-treated mixture including (A) an organopolysiloxane having at least two alkenyl groups bonded to a silicon atom in one molecule, (B) an organohydrogenpolysiloxane having at least three hydrogen atoms bonded to a silicon atom in one molecule, and (C) aluminum oxide; (D) an organohydrogenpolysiloxane having at least two hydrogen atoms bonded to a silicon atom in one molecule; (E) a platinum-based metal catalyst; and (F) a cation-exchange type and/or both-ions-exchange type ion trap agent. This provides a thermally conductive addition-curable silicone composition that can be applied on electric and electronic components and in a module including a circuit substrate mounting these components thereon and that can exhibit excellent stress relaxation property and thermal conductivity after cured. In addition, the present invention provides a method for producing the same.

Thermally conductive addition-curing silicone composition and method for producing same

Thermally conductive addition-curable silicone composition and method for producing the same

A thermally conductive addition-curable silicone composition includes: a heat-treated mixture including (A) an organopolysiloxane having at least two alkenyl groups bonded to a silicon atom in one molecule, (B) an organohydrogenpolysiloxane having at least three hydrogen atoms bonded to a silicon atom in one molecule, and (C) aluminum oxide; (D) an organohydrogenpolysiloxane having at least two hydrogen atoms bonded to a silicon atom in one molecule; (E) a platinum-based metal catalyst; and (F) a cation-exchange type and/or both-ions-exchange type ion trap agent. A thermally conductive addition-curable silicone composition can be applied on electric and electronic components and in a module including a circuit substrate mounting these components thereon and can exhibit excellent stress relaxation property and thermal conductivity after cured. In addition, a method for producing the same.

空間フィルタの設計方法及び該設計方法を実行するプログラムを記録した媒体

(57)【要約】 【課題】 ウエハー検査装置等に使用される空間フィル タの光利用効率を改善し、ＳＮ比の向上を図るために、 新たな位相型の空間フィルタの設計方法を得る。 【解決手段】 最適化計算手法としてシミュレーティッ ドアニーリング法を採用し、空間フィルタの位相を最適 化パラメータとし、入力パターンとして周期パターンの フーリエ変換パターンを使用し、入力パターンに空間フ ィルタの位相変換を施した後再度フーリエ変換したパタ ーンからコスト関数を求める。

粘性材料の混練方法及び装置

【課題】ゴムと熱硬化性樹脂など粘度差のある粘性材料を無溶剤下で混練時間を短縮しながら均一的に分散させ、生産性を向上することが可能な粘性材料の混練方法及び装置を提供する。 【解決手段】粘度の異なる粘性材料１０２，１０３を混練する粘性材料の混練方法であり、粘性材料１０２，１０３を冷凍脆化した後、粉状に粉砕して混合し、得られた混合物ｎを、混練ロール２１１，２１２間のバンク２６０に連続的に定量供給し、一方の混練ロール２１１に巻き付けながら溝２１５により対流・置換を行いつつ混練する。 【選択図】図１