Verfahren zur Herstellung einer Anbindungsschicht zwischen einer metallischen Oberfläche und einer Glas- und/oder Keramikoberfläche, sowie eine Messanordnung

Ein Verfahren zur Herstellung einer druckstabilen Anbindungsschicht (10) zwischen einer metallischen Oberfläche (107) eines ersten Elements und einer Glas- und/oder Keramikoberfläche (101) eines zweiten Elements, gekennzeichnet durch die folgenden Schritte:Bereitstellen der metallischen Oberfläche (107) des ersten Elements und der Glas- und/oder Keramikoberfläche (101) des zweiten ElementsAuftragen einer ersten Schicht (102) umfassend ein Alkylsilikats auf zumindest der metallischen Oberfläche (107) des ersten Elements und/oder der Glas und/oder Keramikoberfläche (101) des zweiten ElementsAuftragen einer zweiten Schicht (103) umfassend ein organofunktionellen Silanverbindung auf die erste Schicht (102) undAuftragen einer dritten Schicht (104) umfassend einen Epoxyharz auf die zweite Schicht (103) undVerbinden der Oberflächen (101, 107) des ersten und des zweiten Elements unter Ausbildung einer zwischen den Oberflächen befindlichen Anbindungsschicht (10), sowie eine Messanordnung (1) und ...

A resin composition and materials containing a resin composition

Sticking means and adhesion mediator

ADHESIVE COMPOSITIONS

Adhesive compositions comprising epoxy resins, including epoxy novalac resin, and at least one reactive multi-functional acrylate. In preferred embodiments, the compositions also include amine-curing agent having at least one acyclic group. The adhesive compositions according to the present invention are capable of enhancing the bonding strength of the adhesive, particularly at relatively high temperatures, such as at about 80~C.

ADHESIVE TAPE FEATURING ADHESIVE WITH CONTINUOUS POLYMER PHASE

The invention relates to an adhesive tape containing an adhesive comprising - at least one polymer - optionally a tackifier resin - at least one reactive resin, the adhesive comprising at least 104 parts of the at least one reactive resin per 100 parts of polymer and tackifier resin - at least one initiator and/or curing agent and/or accelerator where the adhesive is a pressure sensitive adhesive, the at least one polymer being present as continuous polymer phase in the uncured state of the pressure sensitive adhesive.

PRIMER COMPOSITION

Provided is a primer composition that is for metal materials, forms a primer layer having superior adhesion and film formation characteristics on the surface of various metal materials including ordinary steel, stainless steel, aluminum, aluminum alloys, copper, and zinc plating, and imparts superior adhesion strength and adhesion durability when adhered by means of an epoxy adhesive. The primer composition is applied to the surface of a metal material, is adhered by an epoxy adhesive, and contains: an epoxy resin that uses both a bifunctional epoxy resin containing at least a bisphenol A epoxy resin and a polyfunctional epoxy resin containing at least a phenolic novolac epoxy resin; a curing agent comprising a cyandiamide; a curing catalyst comprising an imidazole; and an inorganic oxide filler comprising silica and titanium oxide.

Klebmittel und Haftvermittler

RUBBER TO METAL ADHESIVES

Adhesive resin composition Adherend adhering method and adhesive resin film

접착시트 및 반도체 장치의 제조 방법

... 본 발명의 접착시트는, (A)고분자량 성분과, (B1)연화점이 50℃ 미만인 열경화성 성분과, (B2)연화점이 50℃ 이상 100℃ 이하인 열경화성 성분과, (C)연화점이 100℃ 이하인 페놀 수지를 포함하는 수지 조성물로 이루어지고, 그 수지 조성물 100질량%를 기준으로 하여, 상기 (A)고분자량 성분을 11∼22질량%, 상기 (B1)연화점이 50℃ 미만인 열경화성 성분을 10∼20질량%, 상기 (B2)연화점이 50℃ 이상 100℃ 이하인 열경화성 성분을 10∼20질량%, 상기 (C)연화점이 100℃ 이하인 페놀 수지를 15∼30질량% 함유한다.

A curable epoxy resin composition

A curable epoxy resin composition, upon curing, has a clarity value of at least 30% and provides improved impact strength while maintaining glass transition temperature; and a process of preparing the curable epoxy resin composition.

Adhesive resin composition for semiconductor device, adhesive film for semiconductor device, and dicing die bonding film

The present invention relates to an adhesive resin composition for a semiconductor, including: a (meth)acrylate-based resin including a (meth)acrylate-based repeating unit containing an epoxy-based functional group and a (meth)acrylate-based repeating unit (BzMA) containing an aromatic functional group, the (meth)acrylate-based resin having a hydroxyl equivalent weight of 0.15 eq/kg or less; a curing agent including a phenol resin having a softening point of 100 DEG C or higher; and an epoxy resin, wherein the content of a (meth)acrylate-based functional group containing an aromatic functional group in the (meth)acrylate-based resin is 2 to 40 % by weight, an adhesive film for a semiconductor including the above adhesive resin composition for a semiconductor, a dicing die bonding film including an adhesive layer including the adhesive film for a semiconductor, and a method for dicing a semiconductor wafer using the dicing die bonding film.

SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR

Provided is a production method for a semiconductor device in which the respective connecting sections of a semiconductor chip and a wiring circuit board are electrically connected to each other, or for a semiconductor device in which the respective connecting sections of a plurality of semiconductor chips are electrically connected to each other. The production method for a semiconductor comprises a step in which at least one portion of the connecting section is sealed using an adhesive for semiconductors that contains a compound comprising the group represented by formula (1). [In formula (1), R1 indicates an electron-donating group.] ...

HYDRAULIC FLUID AND FUEL RESISTANT SEALANTS

Compositions that are resistant to hydraulic fluid and aviation fuel contain sulfur-containing prepolymers and solvent-resistant organic fillers. The compositions are useful in aerospace sealant applications.

CONDUCTIVE ADHESIVE

PRE-CROSSLINKED EPOXY ADHESIVES AND ADHESIVE TAPES CONTAINING THE SAME

ПРОВОДЯЩИЙ АДГЕЗИВ

Предложен проводящий адгезив, пригодный для обеспечения электропроводящего соединения между панелями, в частности проводящими углеродными композитными панелями в WESP, выполненном из коррозионно-стойкой смолы и мелких частиц газовой сажи, равномерно распределенных в смоле. 2 н. и 8 з.п. ф-лы.

УДАЛЯЕМЫЙ СЛОЙ, СПОСОБ ПОДГОТОВКИ ПОВЕРХНОСТИ И СВЯЗЫВАНИЯ КОМПОЗИТНЫХ СТРУКТУР С ЕГО ПРИМЕНЕНИЕМ

Изобретение относится к удаляемым слоям для подготовки поверхности композитных подложек. Предложен обогащаемый смолой удаляемый слой для подготовки поверхностей различных композитных подложек, содержащий плетеную ткань, пропитанную отверждаемой матрицей на основе смолы, полученной из композиции смолы, содержащей смесь эпоксидно-фенольной новолачной смолы и новолачной эпоксидной смолы, содержащей дициклопентадиеновый скелет; дифункциональную эпоксидную смолу, выбранную из диглицидиловых простых эфиров многоатомных фенолов; трифункциональную эпоксидную смолу, выбранную из триглицидиловых простых эфиров аминофенолов; отверждающий агент и частицы неорганического наполнителя, при этом в удаляемом слое содержание смолы составляет по меньшей мере 20% мас. в расчете на общую массу удаляемого слоя, и указанная плетеная ткань содержит множество нитей, сплетенных в ткацкое переплетение, причем указанные нити имеют прочность на разрыв основы ≥70 фунт-сила/дюйм (1,23×10Н/м), прочность на разрыв нитей ...

ПРОВОДЯЩИЙ АДГЕЗИВ

... 1. Применение электропроводящей композиции адгезива, содержащего:полиненасыщенную смолу, которая после полимеризации обладает стойкостью к коррозии и деформации при нагреве, игазовую сажу в качестве наполнителя, равномерно распределенного в смоле, для сборки проводящих углеродных композитных панелей в электрофильтре.2. Применение по п.1, характеризующееся тем, что полиненасыщенная смола представляет собой полиненасыщенную виниловую сложноэфирную смолу.3. Применение по п.2, характеризующееся тем, что указанная полиненасыщенная виниловая сложноэфирная смола представляет собой эпоксидную новолачную виниловую сложноэфирную смолу.4. Применение по п.1, характеризующееся тем, что указанная газовая сажа в качестве наполнителя присутствует в композиции в количестве около 10-30 мас.%.5. Применение по п.1, характеризующееся тем, что указанная композиция дополнительно содержит, по меньшей мере, один сшивающий агент для указанной полиненасыщенной смолы.6. Применение по п.5, характеризующееся тем, что ...

Klebeband mit Klebemasse mit kontinuierlicher Polymerphase

Die Erfindung betrifft ein Klebeband, enthaltend eine Klebemasse enthaltend – mindestens ein Polymer – optional ein Klebharz – mindestens ein Reaktivharzes, wobei die Klebemasse auf 100 Teile Polymer und Klebharz mindestens 104 Teile des mindestens einen Reaktivharzes enthält – mindestens einen Initiator und/oder Härter und/oder Beschleuniger wobei, die Klebemasse eine Haftklebemasse ist, wobei das mindestens eine Polymer im ungehärteten Zustand der Haftklebemasse als kontinuierliche Polymerphase vorliegt.

Adhesive composition

An adhesive composition comprising a silane-modified epoxy resin, a dicyclopentadiene novolac epoxy resin and a curing agent. Preferably the curing agent is an amine or latent amine curing agent, most preferably dicyandiamide. In some embodiments a curing accelerator, preferably a urone accelerator is also included. Toughening agents such as core-shell rubber particles or nitrile rubber-modified epoxy resin are included. Oil absorbents in the form of inorganic fillers such as silica or calcium carbonate may be included. The composition shows good oily steel bonding, even in the absence of rubber or rubber adducts as toughening agents. Methods of using the adhesive, articles produced using the adhesive and composite materials/pre-pregs using the adhesive are all disclosed. The composition may include 1-15 wt% silane-modified epoxy, 20-60wt% dicyclopentadiene novolac epoxy resin, 1-10wt% curing agent, 5-30wt% core shell rubber, 1-10% nitrile rubber-modified epoxy resin and 5-10wt% inorganic ...

COATING SYSTEM

Adhesive compositions

HYDRAULIC FLUID AND FUEL RESISTANT SEALANTS

Compositions that are resistant to hydraulic fluid and aviation fuel contain sulfur-containing prepolymers and solvent-resistant organic fillers. The compositions are useful in aerospace sealant applications.

페놀성 수산기 함유 수지, 에폭시 수지, 경화성 수지 조성물, 그 경화물, 및 반도체 봉지 재료

... 유동성이 우수하며, 또한, 경화물에 있어서의 내열성이나 난연성도 우수한 페놀성 수산기 함유 수지, 에폭시 수지, 이들의 어느 하나를 함유하는 경화성 수지 조성물, 그 경화물, 및 봉지(封止) 재료를 제공하는 것. 페놀 화합물(a)과 포름알데히드와의 중축합 반응물을 아랄킬화제와 반응시켜서 얻어지는 페놀 수지로서, 상기 페놀 화합물(a)의 방향핵 상에 아랄킬기를 1개 갖는 모노아랄킬화체(x1)와, 상기 페놀 화합물(a)의 방향핵 상에 아랄킬기를 2개 갖는 디아랄킬화체(x2)를 필수의 성분으로 하는 페놀성 수산기 함유 수지, 및 이것을 폴리글리시딜에테르화하여 얻어지는 에폭시 수지.

가열 경화형 자착성 접착제 조성물 및 접착 시트

... 아크릴계 중합체 (A) 와, 에폭시 수지 (B) 와, 경화제 (C) 와, 강자성체 (D) 를 함유하는 가열 경화형 자착성 접착제 조성물로서, 에폭시 수지 (B) 가, 크레졸 노볼락형 에폭시 수지, 페놀 노볼락형 에폭시 수지 및 비스페놀형 에폭시 수지로 이루어지는 군에서 선택되는 적어도 1 종을 함유한다. 이러한 가열 경화형 자착성 접착제 조성물에 의하면, 초기 단계에서는 자력에 의해 임시 고정력을 나타냄과 함께, 가열 경화 후에는 전단력이 높고, 내열성도 우수하다.

STORAGE-STABLE HEAT-ACTIVATED TERTIARY AMINE CATALYSTS FOR EPOXY RESINS

Epoxy adhesive compositions contain a heat activatable catalyst. The heat activatable catalyst includes a tertiary amine catalyst and a novolac resin that has a weight average molecular weight of at least 3000. One-component epoxy adhesive formulations that contain the heat activatable catalyst have unexpectedly good storage stability.

Hydraulic fluid and fuel resistant sealants

Compositions that are resistant to hydraulic fluid and aviation fuel contain sulfur-containing prepolymers and solvent-resistant organic fillers. The compositions are useful in aerospace sealant applications.

HYDRAULIC FLUID AND FUEL RESISTANT SEALANTS

Compositions that are resistant to hydraulic fluid and aviation fuel contain sulfur-containing prepolymers and solvent-resistant organic fillers. The compositions are useful in aerospace sealant applications. 1. A composition comprising:(a) from 35 wt % to 65 wt % of a thiol-terminated sulfur-containing prepolymer;(b) from 10 wt % to 35 wt % of an organic filler;(c) from 5 wt % to 30 wt % of an inorganic filler; and(d) from 5 wt % to 20 wt % of a polyepoxide,wherein the composition has a specific gravity less than 1.2, wherein specific gravity is determined according to ISO 2781; andwherein wt % is based on the total weight of the composition.2. The composition of claim 1 , wherein the organic filler has a specific gravity less than 1.6 as determined according to ISO787 (Part 10).3. The composition of claim 1 , wherein the organic filler exhibits less than 1 vol % swelling following immersion in aviation hydraulic fluid at a temperature of less than 50° C. for 1 claim 1 ,000 hours claim 1 , where presence swelling is determined according to EN ISO 10563.4. The composition of claim 1 , wherein the organic filler has a specific gravity from 0.85 to 1.4 claim 1 , wherein specific gravity is determined according to ISO 787 (Part 10).5. The composition of claim 1 , wherein the organic filler comprises solid particles.6. The composition of claim 1 , wherein the organic filler comprises polyamide claim 1 , a polyimide claim 1 , a polyphenylene sulfide claim 1 , a polyether sulfone claim 1 , a thermoplastic copolyester claim 1 , or a combination of any of the foregoing.7. The composition of claim 1 , wherein the organic filler further comprises expanded thermoplastic microcapsules coated with a melamine resin.8. The composition of claim 1 , wherein the thiol-terminated sulfur-containing prepolymer comprises a thiol-terminated polythioether prepolymer claim 1 , a thiol-terminated polysulfide prepolymer claim 1 , a thiol-terminated sulfur-containing polyformal prepolymer ...

Storage-stable heat-activated tertiary amine catalysts for epoxy resins

Epoxy adhesive compositions contain a heat-activatable catalyst. The heat-activatable catalyst includes a tertiary amine catalyst and a novolac resin that has a weight average molecular weight of at least 3000. One-component epoxy adhesive formulations that contain the heat-activatable catalyst have unexpectedly good storage stability.

Conductive materials with electrical stability and good impact resistance for use in electronics devices

A composition that comprises a) an admixing of at least one epoxy resin and aliphatic amine wherein the ratio of epoxy function group/amine is greater than 1; b) a conductive filler; c) one or more corrosion inhibitors, oxygen scavengers or both; d) imidazole as a curing agent/catalyst; and e) optionally other additives such as organic solvents, flow additives, adhesion promoters and rheology modifiers. The reaction of epoxy and aliphatic amine with excess epoxy functionality results in a flexible resin with remaining active epoxy groups. The compositions exhibit improved electrical stability and impact resistance over other conductive adhesive compositions that do not comprise the admixture.

Adhesive compositions

Adhesive compositions comprising: a curable resin; reactive multifunctional acrylate consisting of trimethylolpropane triacrylate and dipentaerythritol pentaacrylate; and curing agent. The adhesive compositions according to the present invention are capable of enhancing the bonding strength of the adhesive, particularly at relatively high temperatures, such as at about 80 DEG C.

УДАЛЯЕМЫЙ СЛОЙ, СПОСОБ ПОДГОТОВКИ ПОВЕРХНОСТИ И СВЯЗЫВАНИЯ КОМПОЗИТНЫХ СТРУКТУР С ЕГО ПРИМЕНЕНИЕМ

Изобретение относится к системе удаляемого слоя для подготовки поверхности различных композитных подложек, способу подготовки поверхности таких подложек и к способу получения связанной композитной структуры. Техническим результатом является повышение надежности и эффективности связывания композитной структуры. Технический результат достигается системой удаляемого слоя для подготовки поверхностей различных композитных подложек, которая содержит композитную подложку, содержащую армирующие волокна, пропитанные отвержденной первой матрицей на основе смолы, и снимаемый удаляемый слой, обогащенный смолой, присоединенный к поверхности композитной подложки. При этом удаляемый слой содержит плетеную ткань, пропитанную отвержденной второй матрицей на основе смолы, отличной от первой матрицы на основе смолы. Причем после снятия рукой удаляемого слоя с поверхности композитной подложки на поверхности последней остается тонкая пленка второй матрицы с обеспечением связываемой поверхности, способной к ...

ПОВЕРХНОСТНАЯ ПЛЕНКА ДЛЯ КОМПОЗИТНЫХ СТРУКТУР И СПОСОБ ЕЕ ИЗГОТОВЛЕНИЯ

Изобретение относится к поверхностным пленкам композитов, в частности к поверхностным пленкам для армированных полимерматричных композитных структур, способу их получения. Поверхностная пленка образуется из отверждаемой композиции на основе смолы, содержащей эпоксиноволачную смолу, имеющую эпоксидную функциональность больше единицы и имеющую определенную структуру, трифункциональную или тетрафункциональную эпоксидную смолу, керамические микросферы, скрытый отвердитель на основе амина, частицы неорганического наполнителя и упрочняющий агент. Наполнитель выбран из группы, включающей тальк, слюду, карбонат кальция, окись алюминия и пирогенный кремнезем. Упрочняющий агент представляет собой предварительно полученный аддукт, образованный путем реакции диглицидилового эфира тетрабромбисфенола А; бисфенола А и эластомера. Поверхностная пленка обладает высокой Tи высокой плотностью сшивки после отверждения, а также высокой стойкостью к растворам для удаления лакокрасочных покрытий. Поверхностная ...

КЛЕЕВАЯ КОМПОЗИЦИЯ И СПОСОБ ОБРАБОТКИ АРМИРУЮЩИХ ВКЛАДЫШЕЙ

... 1. Клеевая композиция в форме водной дисперсии, с содержанием твердых веществ от 10 до 40 мас.% относительно клеевой композиции, для обработки армирующих вставок для производства армированных полимерных изделий, содержащая на 100 мас.% твердых веществ: ! а) от 1 до 20 мас.% бисфенол-А-эпоксидного новолака, ! б) от 0 до 20 мас.% полностью или частично блокированного изоциоаната, ! в) от 60 до 92 мас.% резорцин-формальдегидного латекса (РФЛ). ! 2. Клеевая композиция по п.1, отличающаяся тем, что содержание твердых веществ составляет от 10 до 30 мас.%, предпочтительно от 15 до 30 мас.%, особенно предпочтительно от 18 до 27 мас.%. ! 3. Клеевая композиция по п.1 или 2, отличающаяся тем, что содержание твердых веществ бисфенол-А-эпоксидного новолака (а) составляет от 4 до 19 мас.%. ! 4. Клеевая композиция по п.3, отличающаяся тем, что содержание твердых веществ бисфенол-А-эпоксидного новолака (а) составляет от 12,5 до 18 мас.%. ! 5. Клеевая композиция по п.1, отличающаяся тем, что композиция ...

СКЛЕИВАНИЕ КОМПОЗИЦИОННЫХ МАТЕРИАЛОВ

Эпоксидное связующее, препрег на его основе и изделие, выполненное из него.

Изобретение относится к области создания безрастворных однокомпонентных эпоксидных связующих с ускоренным энергоэффективным режимом отверждения для получения конструкционных полимерных материалов на основе волокнистых армирующих наполнителей, перерабатываемых по препреговой технологии, которые могут быть использованы в авиационной, вертолетной, судостроительной, автомобильной, ветроэнергетической, спортивной, электронной, строительной и других индустриях. Эпоксидное связующее включает смесь, масс.%: полиэпоксидной смолы - 34,9-38,5, низкомолекулярной эпоксидиановой смолы - 17,0-22,0 и высокомолекулярной эпоксидиановой смолы - 25,0-29,3, латентный отвердитель - дициандиамид - 7,8-10,5 , ускоритель отверждения - несимметрично дизамещенную мочевину - 2,4-3,2 и модификатор - наночастицы каучука типа «ядро-оболочка» - 4,4-5,2. В качестве полифункциональной эпоксидной смолы применяется полифункциональная эпоксидная смола, выбранная из гомологического ряда эпоксидных смол на основе трифенолов, ...

ГЕРМЕТИКИ, СТОЙКИЕ К ГИДРАВЛИЧЕСКОЙ ЖИДКОСТИ И ТОПЛИВУ

Группа изобретений относится к композиции герметика, системе для получения герметика, герметизированным деталям и способам герметизации деталей. Композиция герметика содержит от 35 до 65 мас.% серосодержащего форполимера с концевыми тиольными группами, от 10 до 35 мас.% органического наполнителя, от 5 до 30 мас.% неорганического наполнителя и от 5 до 20 мас.% полиэпоксида, в которой мас.% рассчитан на основе общей массы композиции. Содержащийся в упомянутой композиции герметика органический наполнитель характеризуется процентом увеличения объема в результате набухания менее 1 об.% после погружения в гидравлическую жидкость на основе сложного эфира фосфорной кислоты при температуре ниже 50°C на 1000 часов или менее 1,2 об.% после погружения в гидравлическую жидкость на основе сложного эфира фосфорной кислоты при температуре ниже 70°C на 1000 часов, при этом набухание в процентах определяют согласно EN ISO 10563. Органический наполнитель имеет удельный вес меньше 1,4, а композиция герметика ...

УДАЛЯЕМЫЙ СЛОЙ, СПОСОБ ПОДГОТОВКИ ПОВЕРХНОСТИ И СВЯЗЫВАНИЯ КОМПОЗИТНЫХ СТРУКТУР С ЕГО ПРИМЕНЕНИЕМ

... 1. Система удаляемого слоя для подготовки поверхностей различных композитных подложек, содержащая:(a) композитную подложку, содержащую армирующие волокна, пропитанные отвержденной первой матрицей на основе смолы; и(b) снимаемый удаляемый слой, обогащенный смолой, присоединенный к поверхности композитной подложки, при этом указанный удаляемый слой содержит плетеную ткань, пропитанную отвержденной второй матрицей на основе смолы, отличной от первой матрицы на основе смолы,при этом после снятия рукой указанного удаляемого слоя с поверхности композитной подложки на поверхности указанной композитной подложки остается тонкая пленка второй матрицы на основе смолы с обеспечением связываемой поверхности, способной к совместному связыванию и вторичному связыванию с другой композитной подложкой,при этом указанная вторая матрица на основе смолы получена из композиции смолы, содержащей:по меньшей мере одну эпоксидированную новолачную смолу с эпоксидной функциональностью, составляющей по меньшей мере ...

UV-härtbares Klebeband und Verfahren zum Ummanteln von langgestrecktem Gut insbesondere Leitungen

Die vorliegende Erfindung betrifft ein Klebeband und ein Verfahren zum Ummanteln von langgestrecktem Gut, insbesondere Kabelsätzen. Das Klebeband muss innerhalb der Prozeßvorgaben zur Weiterverarbeitung, z.B. innerhalb von 6 Min. aushärten und nach dem Aushärten die geforderten Anforderungen an Formstabilität aufweisen. Andererseits dürfen die Klebemassen nicht schon bei der Lagerung aushärten, da sie ansonsten nicht mehr verwendbar sind. Auch dürfen die Aushärtungstemperaturen nicht zu hoch liegen, da ansonsten die Leistungsisolierungen, die oft aus PVC sind, Schaden nehmen können. Erfindungsgemäß wird ein Klebeband zum Ummanteln von langgestrecktem Gut vorgeschlagen, umfassend einen bandförmigen Träger, der auf mindestens einer Seite mit einer Klebeschicht versehen ist, die aus einem selbstklebenden Haftklebestoff besteht, dadurch gekennzeichnet, dass der selbstklebenden Haftklebestoff eine UV-härtbare Zusammensetzung ist, umfassend bezogen auf das Gesamtgewicht der Zusammensetzung: 15 ...

VORVERNETZTE EPOXID-HAFTKLEBMASSEN UND KLEBEBÄNDER, WELCHE DIESE ENTHALTEN

Die Erfindung betrifft ein Verfahren zur Herstellung einer vorvernetzten Epoxid-Haftklebemasse und die daraus erhaltenen Epoxid-Haftklebemassen. Ferner betrifft die Erfindung ein Klebeband, das die Epoxid-Haftklebemasse enthält, sowie dessen Verwendung zum Fixieren von Punkthaltern oder von Gegenständen im Automobil. Zudem betrifft die Erfindung eine härtbare Zusammensetzung.

Anaerobic curable compositions

An anaerobic curable composition, preferably for use as an adhesive or sealant, comprises (i) a (meth)acrylate component, (ii) an anaerobic cure system and (iii) a reaction product of a novolac epoxy resin and an acid of formula XO-C(=O)C(=CH2)R, wherein R is H or CH3, X is H, CH2CH2COOH, or CH2CH2OC(=O)Y and Y is CH2CH2COOH or CH=CHCOOH. The epoxy resin may be a phenol or cresol formaldehyde novolac epoxy resin or a bisphenol or biphenyl formaldehyde novolac epoxy resin. Typically, the reaction product is a novolac vinyl ester. The anaerobic cure system preferably comprises saccharin, toluidines, acetyl phenylhydrazine, or maleic acid and may be present in an amount of 1-10 wt.% based on the total weight of the composition. Methods of preparing the composition and using it to bond two or more substrates are also disclosed.

RUBBER TO METAL ADHESIVES

... 1,213,691. Metal-rubber laminates. LORD CORP. 4 Jan., 1968 [26 Jan., 1967], No. 714/68. Heading B5N. [Also in Division C3] Natural and synthetic rubbers may be bonded to metal with a composition comprising dinitrosobenzen (DNB) and a silane wherein at least one R is a methoxy, ethoxy, propoxy or acetoxy group or a chlorine atom, and any remaining groups R are inert to hydrolysis. Preferably the composition contains 0À1 to 7À5 parts by weight of silane per part of DNB, and also contains up to 3 part per parts of DNB/silane mixture of a chlorinecontaining film-forming polymer, e.g. chlorosulphonated polyethylene, chlorinated polyethylene - propylene copolymers, chlorinated P.V.C., chlorinated polyethylene and chlorinated natural rubber. In addition the composition may contain, per p.b.w. of DNB/ silane mixture, 0À01 to 1À5 parts of a polyisocyanate, and/or 0À5 to 3 parts of an epoxidized novolak. Other conventional additives may be present e.g. C black and ZnO, as fillers, or hydrocarbon ...

Adhesive compositions

CONDUCTIVE EPOXY RESIN FORMULATION AND ELECTRICAL DEVICES IN WHICH SAID RESIN SERVES AS A BONDING MEDIUM

A technique is described for the preparation of an electrically conductive adhesive system and electrical devices including such system. Briefly, the adhesive system comprises a novolac epoxy resin and a chemically blocked imidazole curing agent in combination with a viscosity reducer and conductive particles. The resulting adhesive system is found comparable to commercially available adhesive systems and is superior thereto with respect to thermal stability.

CONDUCTIVE ADHESIVE

A conductive adhesive is provided useful for providing electrically conductive joints in joins between panels, particularly conductive carbon composite panels in a WESP, is prepared from a corrosion resistant resin and particulate carbon black which is uniformly dispersed in the resin.

Thermosetting resin composition and prepreg and laminate both made with the same

A thermosetting resin composition which comprises (A) a metal salt of a di-substituted phosphinic acid, (B) a maleimide compound having an N-substituted maleimide group in the molecule, (C) a hexa-substituted guanamine compound or dicyandiamide, and (D) an epoxy resin having at least two epoxy groups per molecule. Also provided are a prepreg and a laminate both made with the composition. The prepreg is obtained by impregnating or coating a base with the thermosetting resin. Two or more sheets of the prepreg are superposed and molded to produce the laminate. The prepreg and the laminate have a well balanced combination of all of adhesion to copper foils, glass transition temperature, soldering heat resistance, hygroscopicity, flame retardancy, relative permittivity, and dielectric dissipation factor, and are useful as a printed wiring board for electronic appliances.

Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated by using the same

Adhesive composition

Provided is an adhesive composition which has excellent electrical properties (low relative permittivity and low dielectric dissipation factor) and can form an adhesive layer having excellent adhesion (adhesiveness) after heat curing. The adhesive composition can attain an improvement in adhesion (adhesiveness) in laminating steps, can prevent layer separation or lifting in temporary fixing or roll-to-roll processing, and gives adhesive layers having a high crosslink density and suffering no decrease in heat resistance, solvent resistance, etc. The adhesive composition comprises a bismaleimide resin and a styrene-based elastomer.

CATIONIC HARDENING RESIN COMPOSITION FOR HARD DISK DRIVE ASSEMBLY

The present invention provides: a cationic hardening resin composition for hard disk drive assembly containing a resin (component (A)) with a cationic polymerizing functional group, and a cationic polymerization initiator (component (B)), wherein component (B) is at least one species selected from the group consisting of X+(SbF6)- (B1), X+(B(C6F5)4)- (B2), and X+((Rf)nPF6-n)- (B3) (where in the formulas, X+ represents iodonium or sulfonium, Rf represents a fluorinated alkyl with 1 to 6 carbon atoms, and n represents an integer 1 through 6); a method for manufacturing a hard disk drive that uses this composition; and a hard disk drive assembled using this composition.

Diene/dienophile couples and thermosetting resin compositions having reworkability

Thermosetting resin compositions are provided that are useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”) and the like (collectively, “subcomponents”), or semiconductor chips. Reaction products of the compositions are controllably reworkable when subjected to appropriate conditions.

HYDROTALCITE-CONTAINING SEALING RESIN COMPOSITION AND SEALING SHEET

The present invention aims to provide a resin composition superior in all of resistance to moisture permeability, adhesive strength and transparency. This object is achieved by a resin composition containing (A) an epoxy resin and (B) hydrotalcite having a BET specific surface area of not less than 65 m/g. 1. A resin composition for sealing , comprising:(A) at least one epoxy resin; and{'sup': '2', '(B) hydrotalcite having a BET specific surface area of not less than 65 m/g.'}2. The resin composition according to claim 1 , wherein (A) said at least one epoxy resin has a transmittance of not m less than 90%.3. The resin composition according to claim 1 , further comprising:(C) at least one inorganic filler.4. The resin composition according to claim 2 , further comprising:(C) at least one inorganic filler.5. The resin composition according to claim 3 , wherein (C) said at least one inorganic filler is silica.6. The resin composition according to claim 4 , wherein (C) said at least one inorganic filler is silica.7. The resin composition according to claim 1 , further comprising:(D) at least one thermoplastic resin.8. The resin composition according to claim 2 , further comprising:(D) at least one thermoplastic resin.9. The resin composition according to claim 3 , further comprising:(D) at least one thermoplastic resin.10. The resin composition according to claim 4 , further comprising:(D) at least one thermoplastic resin.11. The resin composition according to claim 7 , wherein (D) said at one thermoplastic resin is a phenoxy resin.12. The resin composition according to claim 8 , wherein (D) said at one thermoplastic resin is a phenoxy resin.13. The resin composition according to claim 9 , wherein (D) said at one thermoplastic resin is a phenoxy resin.14. The resin composition according to claim 10 , wherein (D) said at one thermoplastic resin is a phenoxy resin.15. The resin composition according to claim 7 , wherein (D) said at least one thermoplastic resin has a ...

Cationically curable resin composition for assembling hard disk devices

The present invention provides a cationically curable resin composition for assembling hard disk devices which comprises a resin having a cationically polymerizable functional group (a component A) and a cationic polymerization initiator (a component B), the component B being at least one selected from the group consisting of X+(SbF6)−(B1), X+(B(C6F5)4)−(B2) and X+((Rf)nPF6-n)−(B3) (in the formulae, X+ is iodonium or sulfonium, Rf is a fluorinated alkyl having 1 to 6 carbon atoms, and n is an integer of 1 to 6). The invention also provides a hard disk device manufacturing method using the composition, and a hard disk device assembled with the composition.

COMPOSITION, ADHESIVE AND LAYERED BODY

A composition includes: a polythiol compound; a compound having plural epoxy groups; a radical generator; and an amine-based catalyst. In the composition, the ratio (Ep/SH (epoxy groups/thiol groups)) of the total molar number (Ep) of epoxy groups contained in the compound having plural epoxy groups to the total molar number (SH) of thiol groups contained in the polythiol compound is 0.50 or higher but lower than 2.00. 1. A composition comprising:a polythiol compound;a compound having plural epoxy groups;a radical generator; andan amine-based catalyst,wherein a ratio (Ep/SH (epoxy groups/thiol groups)) of a total molar number (Ep) of epoxy groups contained in the compound having plural epoxy groups to a total molar number (SH) of thiol groups contained in the polythiol compound is 0.50 or higher but lower than 2.00.2. The composition according to claim 1 , wherein the radical generator is a thermal radical generator comprising a peroxide.3. The composition according to claim 1 , wherein the polythiol compound is a primary thiol.4. The composition according to claim 1 , wherein the polythiol compound has three or more thiol groups in one molecule thereof.5. The composition according to claim 1 , wherein the polythiol compound has a molecular weight of from 200 to 3000.6. The composition according to claim 1 , wherein the polythiol compound is selected from the group consisting of: a polythiol in which the portion other than the thiol groups is an aliphatic hydrocarbon; a polythiol obtainable by replacing halogen atoms of a halohydrin adduct of an alcohol with thiol groups; a polythiol that is a hydrogen sulfide reaction product of a polyepoxide compound; a thioglycolic acid ester obtainable by an ester-forming reaction between a polyhydric alcohol having from 2 to 6 hydroxyl groups in a molecule thereof and thioglycolic acid; a mercapto fatty acid ester obtainable by an ester-forming reaction between a polyhydric alcohol having from 2 to 6 hydroxyl groups in a ...

СКЛЕИВАНИЕ КОМПОЗИЦИОННЫХ МАТЕРИАЛОВ

В настоящем изобретении предложен обогащенный смолой внешний слой для подготовки поверхности и способ подготовки поверхности перед соединением путем склеивания. Обогащенный смолой внешний слой наносят на отверждаемую композитную подложку на смоляной основе с последующим совместным отверждением. После совместного отверждения композитная подложка является полностью отвержденной, а матричная смола во внешнем слое остается частично отвержденной. После удаления внешнего слоя открывается шероховатая способная к склеиванию поверхность с химически активными функциональными группами. Композитную подложку с химически активной, способной к склеиванию поверхностью можно соединить с другой композитной подложкой с образованием ковалентно-связанной структуры. Предложенный внешний слой выполнен таким образом, что его можно нанести на различные композитные подложки, такие как препреги, для модифицирования их поверхностей и обеспечения улучшенных адгезионных и связующих свойств. 5 н. и 13 з.п. ф-лы, 11 ил ...

КЛЕЕВАЯ КОМПОЗИЦИЯ И СПОСОБ ОБРАБОТКИ АРМИРУЮЩИХ ВКЛАДЫШЕЙ

Изобретение относится к клеевой композиции для обработки армирующих вкладок, предназначенных для производства армированных полимерных продуктов. Клеевая композиция в виде водной дисперсии с содержанием твердых веществ от 10 до 40% масс. в расчете на клеевую композицию, в которой 100% масс. твердого вещества содержит а) от 1 до 20% масс. бисфенол-А-эпоксидного новолака, б) от 0 до 20% масс. полностью или частично блокированного изоцианата, в) от 60 до 92% масс. резорцин-формальдегидного латекса (РФЛ). Изобретение позволяет получить композицию с увеличенной жизнеспособностью, с хорошей смачиваемостью и адгезией на армирующих вставках. 2 н. и 13 з.п. ф-лы, 2 табл., 2 пр.

Conductive adhesive composition

A technique is described for the preparation of an electrically conductive adhesive system and electrical devices including such system. Briefly, the adhesive system comprises a novolac epoxy resin and a chemically blocked imidazole curing agent in combination with a viscosity reducer and conductive particles. The resulting adhesive system is found comparable to commercially available adhesive systems and is superior thereto with respect to thermal stability.

Moulding material

Molding material

CONDUCTIVE ADHESIVE COMPOSITIONS WITH ELECTRICAL STABILITY AND GOOD IMPACT STRENGTH AND THEIR USE IN ELECTRONIC DEVICES

ADHESIVE FORMULATION AND ALSO METHOD FOR THE TREATMENT OF REINFORCING INSERTS

The present invention relates to an adhesive formulation in the form of an aqueous dispersion having a solids content of from 10 to 40% by weight based on the adhesive formulation for the treatment of reinforcing inserts for producing reinforced polymer products, wherein 100% by weight of the solid contains a) from 1 to 20% by weight of a bisphenol A epoxy novolak, b) from 0 to 20% by weight of a fully or partially blocked isocyanate, c) from 60 to 92% by weight of a resorcinol-formaldehyde latex (RFL).

MODIFIED POLYAMIDE ACRYLATE OLIGOMERS

A liquid resin, which is the Michael addition product of an amine-terminated aminoamide thermoplastic polymer with one or more polyol ester compounds having at least one (meth)acrylate group, wherein the amine-terminated aminoamide thermoplastic polymer contains a bisphenol or novolac segment to provide increased hardness and improved flow of radiation-curable compositions incorporating such resins, methods of printing using such compositions and articles printed with such compositions.

CONDUCTIVE ADHESIVE

A conductive adhesive is provided useful for providing electrically conductive joints in joins between panels, particularly conductive carbon composite panels in a WESP, is prepared from a corrosion resistant resin and particulate carbon black which is uniformly dispersed in the resin.

EPOXY RESIN COMPOSITION WITH REDUCED TOXICITY

The subject matter of the present Application is two-component compositions whose first component is a mixture of reactive epoxy resins and optionally further formulation constituents which contains, based on the mass of all epoxy resins, a) at least 10 wt% of an epoxy group-containing reaction product of epichlorohydrin with polypropylene glycol which has an epoxy equivalent weight of at least 250 g/eq, and b) at least 10 wt% of an epoxy group-containing reaction product of epichlorohydrin with a novolac resin which has an epoxy equivalent weight of at least 175 g/eq, and whose second component contains at least one thiol group-containing hardener for epoxy resins.

EPOXY RESIN COMPOSITION WITH REDUCED TOXICITY

The present specification provides two-component compositions whose first component is a mixture of reactive epoxy resins and optionally further formulating ingredients, comprising, based on the mass of all the epoxy resins, a) at least 10% by weight of an epoxide-group-containing reaction product of epichlorohydrin with polypropylene glycol, having an epoxide equivalent weight of at least 250 g/eq, and b) at least 10% by weight of an epoxide-group-containing reaction product of epichlorohydrin with a novolak resin, having an epoxide equivalent weight of at least 175 g/eq, and whose second component comprises at least one epoxy resin hardener containing thiol groups.

SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR

Provided is a production method for a semiconductor device in which the respective connecting sections of a semiconductor chip and a wiring circuit board are electrically connected to each other, or for a semiconductor device in which the respective connecting sections of a plurality of semiconductor chips are electrically connected to each other. The production method for a semiconductor comprises a step in which at least one portion of the connecting section is sealed using an adhesive for semiconductors that contains a compound comprising the group represented by formula (1). [In formula (1), R1 indicates an electron-donating group.

Primer composition

Provided is a primer composition that is for metal materials, forms a primer layer having superior adhesion and film formation characteristics on the surface of various metal materials including ordinary steel, stainless steel, aluminum, aluminum alloys, copper, and zinc plating, and imparts superior adhesion strength and adhesion durability when adhered by means of an epoxy adhesive. The primer composition is applied to the surface of a metal material, is adhered by an epoxy adhesive, and contains: an epoxy resin that uses both a bifunctional epoxy resin containing at least a bisphenol A epoxy resin and a polyfunctional epoxy resin containing at least a phenolic novolac epoxy resin; a curing agent comprising a cyandiamide; a curing catalyst comprising an imidazole; and an inorganic oxide filler comprising silica and titanium oxide.

High temperature epoxy adhesive formulations

Dual cure adhesives

Semiconductor chip laminate and adhesive composition for semiconductor chip lamination

MODIFIED EPOXY RESIN AND PRODUCTION METHOD THEREOF

The present invention relates to a modified epoxy resin. The resin according to the present invention has low dielectric constant and low dielectric loss factor while having excellent adhesive properties and heat resistance properties. Therefore, the resin is used in a laminate for a semiconductor package, a high frequency transmission laminate, a copper clad laminate (CCL), a flexible display substrate, or an insulating plate, and has advantages for being used as an adhesive, a coating agent, or an encapsulant for a semiconductor. COPYRIGHT KIPO 2017 ...

Heat-activable adhesive tape particularly for bonding electronic components and conductor tracks

Heat-activable adhesive tape particularly for producing and further processing electronic components and conductor tracks, with an adhesive composed at least of (a) a polyamide having terminal amino and/or acid groups, (b) an epoxy resin, (c) a compound having a long apolar chain with at least 6 carbon atoms and at least one reactive end capable of reacting with the epoxy resins, (d) if desired, a plasticizer, the polyamide reacting with the epoxy resin at temperatures of at least 150 DEG C, and the ratio in weight fractions of (a) to (b) lying between 50:50 to 99:1.

Modified polyamide acrylate oligomers

A liquid resin, which is the Michael addition product of an amine-terminated aminoamide thermoplastic polymer with one or more polyol ester compounds having at least one (meth)acrylate group, wherein the amine-terminated aminoamide thermoplastic polymer contains a bisphenol or novolac segment to provide increased hardness and improved flow of radiation-curable compositions incorporating such resins, methods of printing using such compositions and articles printed with such compositions.

METHODS FOR ENHANCING THE BONDING STRENGTH OF THERMOSET ADHESIVES AND SEALANTS VIA DISULFIDE DYNAMIC CHEMISTRY

Curable compositions for dynamic epoxy-based thermoset adhesives and/or sealants are provided. Methods of applying the compositions to form strong, low-stress, cured adhesive polymer films are also provided. The cured polymer films use crosslinkers that include disulfide and carbon-nitrogen bonds, wherein the disulfide bonds impart dynamic chemistry to the polymer network structure in order to the achieve adaptable thermoset adhesives and sealants.

Phenolic-hydroxyl-containing resin, epoxy resin, curable resin composition, substance obtained by curing same, and semiconductor sealant

Provided are a phenolic-hydroxyl containing resin, an epoxy resin, and a curable resin composition containing either resin that have high flowability and exhibit high heat resistance and flame retardancy after curing, a cured composition formed therefrom, and a sealant. A phenolic-hydroxyl containing resin is prepared by reacting a polycondensate of a phenolic compound (a) and formaldehyde with an aralkylating agent. The phenolic-hydroxyl containing resin contains as essential components a monoaralkylated derivative (x1) of the phenolic compound (a) having one aralkyl group on an aromatic nucleus thereof and a diaralkylated derivative (x2) of the phenolic compound (a) having two aralkyl groups on an aromatic nucleus thereof. An epoxy resin is prepared by converting the phenolic-hydroxyl containing resin into a polyglycidyl ether.

ADHESIVE SHEET

[Problem] To provide a thermally expandable adhesive sheet which is tack-free in the state prior to use and exhibits high workability using a different means than that of related art. [Solution] The present invention provides a thermally expandable adhesive sheet () including: a substrate (); two thermally expandable adhesive layers () each provided on either side of the substrate; and two adhesive permeable layers () each provided on a surface of the two adhesive layers, the adhesive permeable layers being permeable to the adhesive at the time of the thermal expansion of the adhesive. By heating the adhesive sheet, it is possible to expand the adhesive sheet while simultaneously allowing the adhesive to emerge on the outermost surface of the adhesive sheet. 1. A thermally expandable sheet comprising:a substrate;two thermally expandable adhesive layers each provided on either side of the substrate; andtwo adhesive permeable layers each provided on a surface of the two adhesive layers, the adhesive permeable layers being permeable to the adhesive at the time of thermal expansion of the adhesive,wherein the adhesive permeable layers are non-woven fabrics.2. The adhesive sheet according to claim 1 , wherein the adhesive permeable layers are formed from a material having a glass transition temperature higher than a curing starting temperature of the adhesive constituting the adhesive layers.3. (canceled)4. A thermally expandable sheet comprising:a substrate;two thermally expandable adhesive layers each provided on either side of the substrate; andtwo adhesive permeable layers each provided on a surface of the two adhesive layers, the adhesive permeable layers being permeable to the adhesive at the time of thermal expansion of the adhesive,wherein the adhesive permeable layers are non-woven papers.5. The adhesive sheet according claim 1 , wherein the adhesive constituting the adhesive layers is an insulating adhesive.6. The adhesive sheet according to claim 1 , wherein ...

Peel ply, method of surface preparation and bonding composite structures using the same

A resin-rich peel ply that does not leave behind residual fibers after peeling and can work well with different resin-based composite substrates. The resin-rich peel ply is composed of a woven fabric impregnated with a resin matrix different from the resin matrix of the composite substrate. The peel ply is designed such that, upon manual removal of the peel ply from the composite substrate's surface, a thin film of the peel ply resin remains on the composite substrate's surface to create a bondable surface capable of bonding with another composite substrate, but no fibrous material from the woven fabric remains on the same surface.

METHOD FOR STRUCTURALLY JOINING SUBSTRATES WITH DIFFERENT THERMAL LENGTH EXPANSION COEFFICIENTS

ПОВЕРХНОСТНАЯ ПЛЕНКА ДЛЯ КОМПОЗИТНЫХ СТРУКТУР И СПОСОБ ЕЕ ИЗГОТОВЛЕНИЯ

... 1. Поверхностная пленка с высокой стойкостью к растворам для удаления лакокрасочных покрытий, имеющая температуру стеклования (T) ≥180°C и твердость по карандашной шкале, равную 7H или выше, согласно ASTM D-3363,где при этом после нахождения в контакте с раствором для удаления лакокрасочных покрытий на основе бензилового спирта в течение 7 дней при температуре в диапазоне 20-25°C указанная поверхностная пленка проявляет поглощение жидкости меньше чем 0,5%, и твердость по карандашной шкале снижается не больше чем на 2Н по карандашной шкале, игде указанная поверхностная пленка образуется из отверждаемой композиции на основе смолы, содержащей:эпоксиноволачную смолу, имеющую эпоксидную функциональность больше единицы;трифункциональную или тетрафункциональную эпоксидную смолу;керамические микросферы;скрытый отвердитель на основе амина;частицы неорганического наполнителя; ипо меньшей мере один упрочняющий агент, выбранный из группы, состоящей из: (a) предварительно полученного аддукта, образующегося ...

LEITFÄHIGE KLEBERZUSAMMENSETZUNGEN MIT ELEKTRISCHER STABILITÄT UND GUTER SCHLAGZÄHIGKEIT UND DEREN VERWENDUNG IN ELEKTRONISCHEN GERÄTEN

A resin composition and materials containing a resin composition

This invention relates to a resin composition for moulding compounds, adhesives and prepregs. The resin composition comprises a first polyfunctional epoxy component (i) comprising an epoxy resin based on an alkylol alkane triglycidyl ether monomer, and a second component (ii) comprising an epoxy resin, e.g. a novolac. The composition further comprises a third component (iii) comprising a hydrazide based curative in combination with either (a) a urone based curative or (b) an imidazole based curative or both.

Surfacing film for composite structures and method of making the same

A surfacing film is formed from a curable resin composition containing an epoxy novolac resin, a tri-functional or tetra-functional epoxy resin, ceramic microspheres, an amine-based curing agent, particulate inorganic fillers; and a toughening component. The surfacing film exhibits high T ...

Joining dissimilar materials using an epoxy resin composition

An epoxy resin composition is disclosed for joining dissimilar materials. The identified epoxy resin compositions can be used to seal metallic and non-metallic components of a capacitor. Specifically the epoxy resin composition can be applied to joints between a non-metallic capacitor bushing and a metallic tank cover and metallic terminal cap. Once the epoxy resin composition is cured, it can provide a seal that can withstand the stresses and environmental conditions to which a capacitor is subjected.

HIGH TG EPOXY FORMULATION WITH GOOD THERMAL PROPERTIES

Varnish compositions and prepregs and laminates made therefrom wherein the varnish compositions include at least one first epoxy resin and at least one second epoxy resin that includes a bisphenol-A novolac epoxy resin and a harder wherein the at least one first epoxy resin and the at least one second bisphenol-A novolac epoxy resin are present in the varnish at a weight ratio ranging from about 1 :1 to about 1 :3.

BONDING OF COMPOSITE MATERIALS

Peel ply for surface preparation and a method of surface preparation prior to adhesive bonding. A resin-rich peel ply is applied onto a curable, resin-based composite substrate, followed by co-curing. After co-curing, the composite substrate is fully cured but the matrix resin in the peel ply remains partially cured. When the peel ply is removed, a roughened, bondable surface with chemically-active functional groups is revealed. The composite substrate with the chemically-active, bondable surface may be bonded to another composite substrate to form a covalently-bonded structure.

Mixtures of binders

Composition adhésive conductrice de l'électricité utilisée pour lier des composants semi-conducteurs et dispositif électrique utilisant ladite composition.

L'invention concerne une composition adhésive conductrice de l'électricité. La composition adhésive comprend une résine novolaque époxydée et un agent de durcissement à base d'imidazole chimiquement bloqué en combinaison avec un agent de réduction de la viscosité et des particules conductrices. Le système adhésif ainsi obtenu est supérieur aux systèmes du commerce par sa stabilité thermique.

ADHESIVE SHEET AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

반도체 접착용 수지 조성물 및 반도체용 접착 필름 및 다이싱 다이본딩 필름

... 본 발명은 -10℃ 내지 20℃의 유리 전이 온도를 갖는 열가소성 수지; 70℃ 이상의 연화점을 갖는 페놀 수지를 포함한 경화제; 고상 에폭시 수지; 및 액상 에폭시 수지;를 포함하고, 상기 열가소성 수지 대비 상기 고상 에폭시 수지 및 액상 에폭시 수지의 총 함량의 중량비가 1.6 내지 2.6인 반도체 접착용 수지 조성물과, 상기 반도체 접착용 수지 조성물을 포함한 반도체용 접착 필름과, 상기 반도체 접착용 수지 조성물을 포함한 접착층을 포함한 다이싱 다이본딩 필름과, 상기 다이싱 다이본딩 필름을 이용한 반도체 웨이퍼의 다이싱 방법에 관한 것이다.

접착제, 접착제-배킹된 부재, 및 부재들 사이를 결합하기 위한 방법

... 부재들 사이를 결합하기 위한 방법으로서, 본 방법은 방사선-중합성 작용기를 갖지 않는 열경화성 수지, 경질화제, 방사선-중합성 작용기 및 열경화성 작용기를 갖는 제1 중합성 화합물, 방사선-중합성 작용기를 갖고 열경화성 작용기를 갖지 않는 제2 중합성 화합물, 및 열팽창성 캡슐(thermally expanding capsule)을 함유하는 액체 조성물을 제1 부재 표면 상에 적용함으로써 접착제 층을 형성하는 단계; 접착제 층 상에 방사선을 조사함으로써 접착제 층을 반고화시키는 단계; 제1 부재 표면과 대향하도록 반고화된 접착제 층 위에 제2 부재를 배치하는 단계; 및 반고화된 접착제 층을 가열하여 팽창 및 고화시킴으로써 제1 부재와 제2 부재를 결합시키는 단계를 포함한다.

Adhesive resin composition for HDD motor and HDD motor fabricated by using the same

열전도성 도전성 접착제 조성물

... 본 발명은 (A) 도전성 필러, (B) 에폭시 수지, (C) 반응성 희석제 및 (D) 경화제를 포함하는 열전도성 도전성 접착제 조성물이며, 상기 (A) 도전성 필러는, 1 내지 10㎛의 평균 입자 직경을 갖는 은분이고, 상기 (B) 에폭시 수지는, 1 분자 내에 2개 이상의 에폭시 관능기 및 방향환을 갖고, 상기 (C) 반응성 희석제는, 지방족 탄화수소쇄에 2개 이상의 글리시딜에테르 관능기를 갖고, 또한 분자량이 150 내지 600인 화합물이며, 또한 상기 (D) 경화제는, 1 분자 내에 2 이상의 페놀 관능기를 갖는 화합물, 1 분자 내에 2 이상의 아닐린 관능기를 갖는 화합물, 또는 그것들의 혼합물이고, 상기 (A) 도전성 필러, (B) 에폭시 수지, (C) 반응성 희석제 및 (D) 경화제의 함유량이 각각 특정 범위 내인 열전도성 도전성 접착제 조성물에 관한 것이다. 본 발명의 열전도성 도전성 접착제 조성물은, 높은 열전도성과 안정된 도전성을 갖는다.

강화된 상계면을 갖는 섬유 강화 고탄성률 중합체 복합물

... 강화 섬유 및 접착제 조성물을 포함하며, 접착제 조성물이 적어도 열경화성 수지, 경화제 및 계면 물질을 포함하고, 섬유가 접착제 조성물의 경화시 섬유와 접착제 조성물 사이의 계면 영역에 계면 물질을 농축시키기에 적합하고, 경화된 접착제가 적어도 4.0 GPa의 수지 탄성률을 가지는 것인 섬유 강화 중합체 조성물을 개시한다. 또한, 섬유 강화 중합체 조성물을 포함하는 프리프레그, 및 강화된 중합체 조성물을 경화함으로써 복합물 물품을 제조하는 방법을 제공한다. 결과적으로 얻은 계면 영역, 즉 강화된 상계면은 인장, 압축 및 파괴 인성의 실질적 개선이 관찰될 수 있도록 계면 물질의 하나 이상의 층에 의해 강화된다.

경화성 에폭시 수지 조성물

... 경화 시에, 유리 전이 온도를 유지하면서 적어도 30%의 투명도를 갖고 향상된 충격 강도를 제공하는 경화성 에폭시 수지 조성물; 및 경화성 에폭시 수지 조성물의 제조 방법이 개시된다.

Temporary adhesive for fabricating semiconductor device and adhesive support body using the same and method for fabricating semiconductor device

The invention provides a temporary adhesive for fabricating a semiconductor device and an adhesive support body using the same and a method for fabricating the semiconductor device. When a treated element (such as a semiconductor wafer) is treated with mechanical and chemical treatment, the temporary adhesive for fabricating the semiconductor device can indeed easily and temporarily support the treated element and not damage the treated element; therefore it is easy to relieve the treated element of temporary support. The temporary adhesive for fabricating a semiconductor device includes (A) a polymer compound having an acid group, (B) a diluent, and (C) a solvent.

Semiconductor-encapsulating adhesive, semiconductor-encapsulating film-form adhesive, method for producing semiconductor device, and semiconductor device

The present invention relates to a semiconductor-encapsulating adhesive, a semiconductor-encapsulating film-form adhesive, a method for producing a semiconductor device, and a semiconductor device. The present invention provides a semiconductor-encapsulating adhesive comprising (a) an epoxy resin, and (b) a compound formed of an organic acid reactive with an epoxy resin and a curing accelerator.

Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated with the same

An epoxy resin composition for encapsulating a semiconductor device includes a curing agent, a curing accelerator, inorganic fillers, and an epoxy resin, the epoxy resin including a first resin represented by Formula 1: wherein R1 and R2 are each independently hydrogen or a C1 to C4 linear or branched alkyl group, and n is a value from 1 to 9 on average.

STORAGE-STABLE HEAT-ACTIVATED TERTIARY AMINE CATALYSTS FOR EPOXY RESINS

Epoxy adhesive compositions contain a heat-activatable catalyst. The heat-activatable catalyst includes a tertiary amine catalyst and a novolac resin that has a weight average molecular weight of at least 3000. One-component epoxy adhesive formulations that contain the heat-activatable catalyst have unexpectedly good storage stability. 1. A heat-activatable catalyst composition comprising mixture of a solid or liquid tertiary amine compound that has a boiling temperature of at least 130° C. and a novolac resin that has a weight average molecular weight of at least about 3000.2. The heat-activatable catalyst composition of wherein the tertiary amine compound includes at least one aminophenol.3. The heat-activatable catalyst composition of wherein the aminophenol is 2-(dimethylaminomethyl)phenol claim 2 , 2 claim 2 ,6-bis(dimethylaminomethyl)phenol claim 2 , 2 claim 2 ,4-bis(dimethylaminomethyl)phenol or 2 claim 2 ,4 claim 2 ,6-tris(dimethylaminomethyl)phenol.4. The heat-activatable catalyst composition of wherein the novolac resin has a weight average molecular weight of from 5000 to 20 claim 1 ,000.5. The heat-activatable catalyst composition of wherein the novolac resin is a phenol novolac resin.6. The heat-activatable catalyst composition of wherein the weight ratio of the tertiary amine compound and the novolac resin is from 40:60 to 70:30.7. The heat-activatable catalyst composition of which is made in a process that includes the steps of:a) combining a tertiary amine catalyst having a melting temperature of no greater than 60° C. and a boiling temperature of at least 130° C. with a particulate novolac resin having a weight average molecular weight of at least 5000 and a volume average particle size of 175 microns or less, at proportions such that from 0.1 to 10 equivalents of phenol groups are provided by the novolac resin per equivalent of tertiary amine groups provided by the tertiary amine catalyst;b) heating the mixture formed in step a) to a temperature of ...

Dual cure adhesives

This invention is a dual cure adhesive that can be designed to have a proper balance of properties by choosing formulation materials to meet certain inequalities. The dual cure adhesive comprises ethylenically unsaturated compounds capable of UV-initiated free radical polymerization and epoxy compounds and their corresponding curing agents capable of thermal cure. In a particular embodiment, the dual cure adhesive comprises (A) one or more monofunctional acrylate compounds containing an oxygen-containing cyclic unit, (B) one or more monofunctional acrylate compounds in which the ester group contains a hydrocarbon group consisting of at least six carbon atoms, and (C) one or more thermoplastic, solid, amorphous epoxy compounds having a softening point or melting point between 60° C. and 100° C.

B-STAGEABLE AND SKIP-CURABLE WAFER BACK SIDE COATING ADHESIVES

An adhesive composition comprising elastomeric polymer, epoxy resin, reactive diluent, and filler, is suitable for use within the electronics industry, and in particular for wafer back side coating adhesives. The elastomeric polymer is a mixture of a vinyl elastomer and an epoxy elastomer; the reactive diluent is a combination of two or more diluents, one of which must have carbon to carbon unsaturation, providing cross-linking within the composition after cure; and the filler is a non-conductive filler. 1. An adhesive composition comprising:(A) an elastomeric polymer comprising a mixture of a vinyl elastomer and an epoxy elastomer, the mixture present in an amount within the range of 20% to 40% by weight,(B) an epoxy resin, present in the adhesive composition in the range of 3% to 10% by weight,(C) reactive diluent comprising a combination of two or more diluents, one of which must have carbon to carbon unsaturation, the combination present in the adhesive composition within the range of 35% to 50% by weight of the composition, and(D) filler, sufficient to bring the total of the composition to 100% by weight.2. The adhesive composition according to in which the mixture of vinyl elastomer and epoxy elastomer are present in a weight ratio of 1:3 and have weight average molecular weights (MW) within the range of 3000 to 100 claim 1 ,000.3. The adhesive composition according to in which the vinyl and epoxy elastomers will have glass transition temperatures (Tg) within the range of −65° to 20° C.4. The adhesive composition according to in which the vinyl and epoxy elastomers are selected from the group consisting of butadiene-acrylonitrile rubbers claim 1 , butadiene rubbers claim 1 , nitrile butadiene rubbers claim 1 , polyurethane elastomers claim 1 , polyisobutene elastomers claim 1 , polyisoprene elastomers claim 1 , polyester amide elastomers claim 1 , ethylene-vinyl acetate copolymer elastomers claim 1 , polypropylene elastomers claim 1 , polyethylene elastomers ...

PRIMER COMPOSITION

Disclosed herein is a primer composition for metal materials, capable of forming a primer layer excellent in adhesion properties and film-forming properties on the surfaces of various metal materials such as common steel, stainless steel, aluminum, aluminum alloy, copper, and zinc plating to impart high bond strength and high bond durability when the metal materials are bonded with an epoxy-based adhesive. The primer composition is intended to be applied onto the surface of a metal material to be bonded with an epoxy-based adhesive and includes an epoxy resin containing both a bifunctional epoxy resin containing at least a bisphenol A-type epoxy resin and a multifunctional epoxy resin containing at least a phenol novolac-type epoxy resin, a curing agent composed of cyandiamide, a curing catalyst composed of imidazole, and an inorganic oxide filler composed of silica and titanium oxide. 1. A primer composition for metal materials to be applied onto a surface of a metal material to be bonded with an epoxy-based adhesive , comprising: an epoxy resin containing both a bifunctional epoxy resin containing at least a bisphenol A-type epoxy resin and a multifunctional epoxy resin , excluding a bifunctional epoxy resin , containing at least a phenol novolac-type epoxy resin; a curing agent composed of cyandiamide; a curing catalyst composed of imidazole; and an inorganic oxide filler composed of silica and titanium oxide , wherein a solvent is not contained.2. The primer composition for metal materials according to claim 1 , whereinthe bifunctional epoxy resin is a bisphenol A-type epoxy resin alone or a mixture of a bisphenol A-type epoxy resin and a bisphenol F-type epoxy resin, andthe multifunctional epoxy resin is a phenol novolac-type epoxy resin alone or a mixture of a phenol novolac-type epoxy resin and a p-aminophenol-type epoxy resin.3. The primer composition for metal materials according to claim 2 , wherein the epoxy resin containing both the bifunctional epoxy ...

DIENE/DIENOPHILE COUPLES AND THERMOSETTING RESIN COMPOSITIONS HAVING REWORKABILITY

Thermosetting resin compositions are provided that are useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”) and the like (collectively, “subcomponents”), or semiconductor chips. Reaction products of the compositions are controllably reworkable when subjected to appropriate conditions. 1. A curable composition reaction products of which are controllably degradable upon exposure to a temperature condition greater than a temperature condition used to cure the composition , comprising:(a) a curable resin component;(b) a curative and(c) a diene/dienophile couple functionalized with at least two carboxylic acid groups.2. An electronic device comprising a semiconductor device and a circuit board to which said semiconductor device is electrically connected or a semiconductor chip and a circuit board to which said semiconductor chip is electrically connected claim 1 , assembled using a curable composition according to as an underfill sealant between the semiconductor device and the circuit board or the semiconductor chip and the circuit board claim 1 , respectively claim 1 , wherein reaction products of the composition are capable of softening and losing their adhesiveness under exposure to temperature conditions in excess of those used to cure the composition.3. A method of sealing underfilling between a semiconductor device including a semiconductor chip mounted on a carrier substrate and a circuit board to which said semiconductor device is electrically connected or a semiconductor chip and a circuit board to which said semiconductor chip is electrically connected claim 1 , the steps of which comprise:{'claim-ref': {'@idref': 'CLM-00001', 'claims 1'}, '(a) dispensing into the underfilling between the semiconductor device and the circuit board or the semiconductor chip and the circuit board a composition according to ; and'}(b) exposing the composition as so ...

THERMOCONDUCTIVE ELECTROCONDUCTIVE ADHESIVE COMPOSITION

[Problem] Provided is a thermally and electrically conductive adhesive composition used as a die-bonding material which shows high heat dissipation performance and stable electric conductivity as well as high adhesion force. 1. A thermally and electrically conductive adhesive composition , comprising:(A) an electrically conductive filler,(B) an epoxy resin,(C) a curing agent,(D) an organic solvent, whereinthe electrically conductive filler (A) is a submicron fine silver powder, and the content of the electrically conductive filler (A) is such that (A)/(B) is 96.0/4.0 to 99.5/0.5 in the mass ratio to the content of the epoxy resin (B), andthe epoxy resin (B) comprises at least a bisphenol-type epoxy resin and a novolac-type epoxy resin, andthe curing agent (C) is diaminodiphenyl sulfone and/or a derivative thereof, and the content of the curing agent (C) is 0.4 to 2.4 molar equivalents in terms of equivalent of active hydrogen relative to 1 molar equivalent of epoxy groups in the epoxy resin (B).2. The thermally and electrically conductive adhesive composition according to claim 1 , wherein the mass ratio of the bisphenol-type epoxy resin and the novolac-type epoxy resin contained in the epoxy resin (B) is such that bisphenol-type epoxy resin/novolac-type epoxy resin is 40/60 to 80/20.4. The thermally and electrically conductive adhesive composition according to claim 1 , wherein the submicron fine silver powder used in the electrically conductive filler (A) is coated with a coating agent claim 1 , a surface of the coating agent comprising carboxylic acid.5. The thermally and electrically conductive adhesive composition according to claim 1 , wherein the content of the epoxy resin (B) is 0.3 to 4.0% by mass relative to the total amount of the thermally and electrically conductive adhesive composition.6. The thermally and electrically conductive adhesive composition according to claim 2 , wherein the submicron fine silver powder used in the electrically conductive ...

RESIN COMPOSITION FOR BONDING SEMICONDUCTORS, ADHESIVE FILM FOR SEMICONDUCTOR USING THE SAME, DICING DIE BONDING FILM, AND METHOD FOR DICING SEMICONDUCTOR WAFER

The present invention relates to a resin composition for bonding semiconductors including two types of curing catalyst mixtures together with a heat dissipation filler in which a specific functional group is introduced onto the surface, an adhesive film for semiconductor produced therefrom, a dicing die bonding film and a method for dicing a semiconductor wafer. 2. The resin composition for bonding semiconductors according to claim 1 ,wherein a weight ratio of the imidazole-based compound and the organic acid compound is 0.5:1 to 10:1.3. The resin composition for bonding semiconductors according to claim 1 ,wherein the organic acid compound includes an aromatic polyacid compound.4. The resin composition for bonding semiconductors according to claim 1 ,wherein the imidazole-based compound includes an imidazole derivative compound containing an electron withdrawing functional group.6. The resin composition for bonding semiconductors according to claim 1 ,comprising the curing catalyst in an amount of 0.5% by weight to 2.0% by weight based on the total weight of the resin composition for bonding semiconductors.7. The resin composition for bonding semiconductors according to claim 1 ,wherein the (meth)acrylate-based resin has a hydroxyl equivalent weight of 0.15 eq/kg or less.8. The resin composition for bonding semiconductors according to claim 1 ,wherein a weight ratio of the (meth)acrylate-based resin relative to the total weight of the binder resin and the curing agent is 0.55 to 0.95.9. The resin composition for bonding semiconductors according to claim 1 ,wherein the (meth)acrylate-based resin includes a (meth)acrylate-based repeating unit containing an epoxy-based functional group and a (meth)acrylate-based repeating unit (BzMA) containing an aromatic functional group, andthe (meth)acrylate-based functional group containing an aromatic functional group is in an amount of 2% by weight to 40% by weight based on the total weight of the (meth)acrylate-based resin.10. ...

METHOD FOR MANUFACTURING FINE-PITCH ANISOTROPIC CONDUCTIVE ADHESIVE AND FINE-PITCH ANISOTROPIC CONDUCTIVE ADHESIVE MANUFACTURED BY SAME METHOD

The provided relates to a method for preparing an anisotropic conductive adhesive for fine pitch and an anisotropic conductive adhesive for fine pitch prepared by the same method. Provided is a method for preparing an anisotropic conductive adhesive for a fine pitch including: (i) removing an oxide film of solder particles having self-fusion and self-orientation functions between metal terminals of a substrate by melting the solder particles at a predetermined temperature using a first reducing agent; (ii) removing moisture generated in step (i); and (iii) preparing an anisotropic conductive adhesive by mixing the solder particles from which the oxide film and the moisture are removed with a binder resin in steps (i) and (ii), in which step (iii) is performed in a state where a contact with oxygen is blocked. 1. A method for preparing an anisotropic conductive adhesive for fine pitch , the method comprising:(i) removing an oxide film of solder particles having self-fusion and self-orientation functions between metal terminals of a substrate by melting the solder particles at a predetermined temperature using a first reducing agent;(ii) removing moisture generated in step (i); and(iii) preparing the anisotropic conductive adhesive by mixing the solder particles from which the oxide film and the moisture are removed in steps (i) and (ii) with a binder resin,a. wherein step (iii) is performed in a state where a contact with oxygen is blocked.2. The method of claim 1 , wherein the anisotropic conductive adhesive in step (iii) further includes a second reducing agent for preventing further oxidation of the solder particles.3. The method of claim 2 , wherein an amount of the second reducing agent is 0.01 to 3 parts by weight with respect to 100 parts by weight of the anisotropic conductive adhesive in step (iii).4. The method of claim 1 , wherein the first reducing agent is at least one selected from the group consisting of 3-butenoic acid (BA) claim 1 , 1 claim 1 ,3-bis( ...

PROTECTIVE FILM FORMING FILM, PROTECTIVE FILM FORMING SHEET AND WORK PRODUCT MANUFACTURING METHOD

A protective film forming film is provided in which the product of the breaking stress (MPa) measured at a measurement temperature of 0° C. and the breaking strain (unit: %) measured at a measurement temperature of 0° C. in at least one of the protective film forming film and a protective film formed from the protective film forming film is in a range of 1 MPa·% to 250 MPa·%. According to such a protective film forming film , the protective film forming film or the protective film formed from the protective film forming film can be suitably divided in an expanding process performed on a workpiece when the workpiece is divided to obtain a work product. 1. A protective film forming film ,wherein the product of the breaking stress (MPa) measured at a measurement temperature of 0° C. and the breaking strain (unit: %) measured at a measurement temperature of 0° C. in at least one of the protective film forming film and a protective film formed from the protective film forming film is in a range of 1 MPa·% to 250 MPa·%.2. The protective film forming film according to claim 1 , wherein the light transmittance at a wavelength of 1064 nm is 30% or greater.3. A protective film forming sheet claim 1 , comprising:a dicing sheet which includes a base material and an adhesive layer laminated on one surface side of the base material; and{'claim-ref': [{'@idref': 'CLM-00001', 'claim 1'}, {'@idref': 'CLM-00002', '2'}], 'the protective film forming film according to or which is laminated on the adhesive layer side of the dicing sheet.'}4. The protective film forming sheet according to claim 3 , wherein the light transmittance at a wavelength of 1064 nm is 30% or greater.5. A method of manufacturing a work product claim 3 , comprising:a first modified layer forming process of forming a modified layer in the inside of a workpiece by irradiating the workpiece with laser beams in the infrared region such that the laser beams are focused on a focal point set in the inside of the workpiece ...

FILM ADHESIVE AND SEMICONDUCTOR DEVICE INCLUDING THE SAME

Provided is a film adhesive which is preferably used as a NCF, void-free, has excellent electrical connectivity and its high reliability, does not develop cracks easily, and has high surface flatness. Also provided is a semiconductor device in which the film adhesive according to the present invention is used as an NCF during the manufacture of the semiconductor device. The film adhesive according to the present invention contains (A) an epoxy resin; (B) a bisphenol F type phenoxy resin; (C) a phenol resin-based curing agent; (D) a modified imidazole compound; (E) a silica filler; (F) oxyquinoline; and (G) a butadiene-acrylonitrile-methacrylic acid copolymer. The content of component (A) is 19.3 to 33.8 parts by mass. The content of component (B) is 7.5 to 9.1 parts by mass. The content of component (D) is 1.915 to 5 parts by mass. The content of component (E) is 30 to 60 parts by mass. The content of component (F) is 2.5 to 10 parts by mass. The liquid epoxy resin of component (A) contains a phenol novolac type epoxy resin and a liquid epoxy resin. The ratio of phenol novolac type epoxy resin to the epoxy resin of component (A) is not less than 46%. The equivalent ratio of component (C) relative to component (A) is 0.25 to 0.75. 1. A film adhesive which contains:(A) an epoxy resin;(B) a bisphenol F type phenoxy resin;(C) a phenol resin-based curing agent;(D) a modified imidazole compound;(E) a silica filler;(F) oxyquinoline; and(G) a butadiene-acrylonitrile-methacrylic acid copolymer,wherein:the content of component (A) is 19.3 to 33.8 parts by mass;the content of component (B) is 7.5 to 9.1 parts by mass;the content of component (D) is 1.9 to 5 parts by mass;the content of component (E) is 30 to 60 parts by mass;the content of component (F) is 2.5 to 10 parts by mass;the content of component (G) is 0.7 to 2.3 parts by mass;the epoxy resin of component (A) contains a phenol novolac type epoxy resin and a liquid epoxy resin;the phenol novolac type epoxy resin has a ...

Thermosetting resin composition and prepreg and laminate both made with the same

The present invention provides a thermosetting resin composition comprising (A) a metal salt of disubstituted phosphinic acid, (B) a maleimide compound having a N-substituted maleimide group in a molecule, (C) a 6-substituted guanamine compound or dicyandiamide and (D) an epoxy resin having at least two epoxy groups in a molecule and a prepreg and a laminated plate which are prepared by using the same. The prepregs obtained by impregnating or coating a base material with the thermosetting resin compositions of the present invention and the laminated plates produced by laminating and molding the above prepregs are balanced in all of a copper foil adhesive property, a glass transition temperature, a solder heat resistance, a moisture absorption, a flame resistance, a relative dielectric constant and a dielectric loss tangent, and they are useful as a printed wiring board for electronic instruments.

ESTER CARBONATE POLYOLS FOR HYDROLYTICALLY STABLE ADHESIVES

A two-component curable adhesive or sealant composition is provided. The first component may comprise a mixture of at least one polyol selected from the group comprising a polyester polyol, a polyester-polycarbonate copolymer polyol, and combinations thereof, a resin, and optionally a solvent. The second component may comprise a prepolymer obtained by reacting a polyester-polycarbonate copolymer polyol which is the reaction product of a polyester polyol which is the reaction product of one or more organic acids, and one or more glycols having a functionality of two or more and one or more polycarbonate polyols, at least one organic polyisocyanate component, and at least one chain extending agent and optionally a solvent. Alternatively, the first component may comprise a polyester-polycarbonate copolymer polyol, a resin, and optionally a solvent. The second component may comprise a polyisocyanate curative and optionally a solvent. The cured adhesive exhibits improved hydrolytic properties while maintaining excellent processability and adhesive properties. 1. A two-component curable adhesive or sealant composition; comprising: [ one or more organic acids; and', 'one or more glycols having a functionality of two or more; and', 'one or more polycarbonate polyols;, 'a polyester polyol which is the reaction product of, '(i) a polyester-polycarbonate copolymer polyol obtained by reacting, '(ii) a resin; and', '(iii) optionally a solvent; and, '(a) a first component comprising a mixture of(b) a second component comprising a polyisocyanate curative.2. A two-component curable adhesive or sealant composition; comprising: (i) at least one polyol selected from the group comprising a polyester polyol, a polyester-polycarbonate copolymer polyol, and combinations thereof;', '(ii) a resin; and', '(iii) optionally a solvent; and, '(a) a first component comprising a mixture of [ [ a polyester polyol which is the reaction product of:', 'one or more organic acids; and', 'one or more ...

SOLID POLYMERIC ADHESIVE COMPOSITIONS HAVING HIGH USE TEMPERATURE, AND ARTICLES AND METHODS THEREOF

The teachings herein are directed at solid polymeric adhesive compositions for adhering metal components, methods for compounding the polymeric adhesive compositions, articles including a component having the polymeric adhesive composition, methods for producing articles including curing a solid adhesive, and articles including the cured adhesive. Preferred solid polymeric adhesive compositions include a plurality of one or more epoxy resins and one or more polysulfones. In one preferred aspect, the teachings are directed at a stator ring (e.g., for a hybrid motor) including the polymeric adhesive composition for adhering components to a ring. 1. A polymeric adhesive composition for molding or extruding an article comprising:i) about 25 to about 85 weight percent of one or more epoxy resins, based on the total weight of the polymeric adhesive composition;ii) about 7 to about 45 weight percent of one or more high temperature thermoplastic polymers, based on the total weight of the polymeric adhesive composition, having a glass transition temperature of about 175° C. or more;iii) about 0.5 to 15 weight percent of one or more impact modifiers, wherein the impact modifiers including an elastomeric polymer core of a core/shell polymer;iv) one or more curatives for curing the epoxy resin(s); andv) optionally up to 40 weight percent of one or more fillers; andvi) optionally up to about 7 weight percent of one or more blowing agents;wherein the one or more epoxy resins includes one or more solid epoxy resins and one or more liquid epoxy resins, wherein the concentration of the solid epoxy resin is sufficiently high so that the polymeric adhesive composition is a solid at room temperature.2. The polymeric adhesive composition of claim 1 , wherein the one or more high temperature thermoplastic polymers includes a polymer having a repeat unit with a sulfone group along the backbone with two aryl sulfone linkages.3. The polymeric adhesive composition of claim 2 , wherein the ...

Resin composition for temporary fixing use, resin film for temporary fixing use, sheet for temporary fixing use, and method for manufacturing semiconductor device

A resin composition for temporary fixing, the resin composition containing (A) a thermoplastic resin, (B) a thermosetting resin, and (C) a silicone compound, the resin composition having a shear viscosity of 4000 Pa·s or less at 120° C. and a rate of change in the shear viscosity being within 30% as determined before and after the resin composition is left to stand for 7 days in an atmosphere of 25° C.

Adhesive sheet and method for manufacturing semiconductor device

The adhesive sheet of the invention comprises a resin composition containing (A) a high-molecular-weight component, (B1) a thermosetting component having a softening point of below 50° C., (B2) a thermosetting component having a softening point of between 50° C. and 100° C. and (C) a phenol resin having a softening point of no higher than 100° C., the composition containing 11 to 22 mass % of the (A) high-molecular-weight component, 10 to 20 mass % of the (B1) thermosetting component having a softening point of below 50° C., 10 to 20 mass % of the (B2) thermosetting component having a softening point of between 50° C. and 100° C. and 15 to 30 mass % of the phenol resin having a softening point of no higher than 100° C., based on 100 mass % of the resin composition.

ONE-COMPONENT THERMOSETTING EPOXY ADHESIVE WITH IMPROVED ADHESION

A one-component thermosetting epoxy resin adhesive, including a) at least one epoxy resin A of formula (II)

Bonding of composite materials

Peel ply for surface preparation and a method of surface preparation prior to adhesive bonding. A resin-rich peel ply is applied onto a curable, resin-based composite substrate, followed by co-curing. After co-curing, the composite substrate is fully cured but the matrix resin in the peel ply remains partially cured. When the peel ply is removed, a roughened, bondable surface with chemically-active functional groups is revealed. The composite substrate with the chemically-active, bondable surface may be bonded to another composite substrate to form a covalently-bonded structure.

Joining Dissimilar Materials Using an Epoxy Resin Composition

An epoxy resin composition is disclosed for joining dissimilar materials. The identified epoxy resin compositions can fee used to seal metallic and non-metallic components of a capacitor. Specifically the epoxy resin composition can be applied to joints between a non-metallic capacitor bushing and a metallic tank cover and metallic terminal cap. Once the epoxy resin composition is cored, it can provide a seal that can withstand the stresses and environmental conditions to which a capacitor is subjected. 1. A capacitor tank comprising:an insulating hushing comprising substantially glass, ceramic, polymer, or glazed material;a metallic tank cover;a casing attached to the metallic tank cover, the casing to contain a fluid comprising one or more aromatic compounds; and wherein the cured seal comprises an epoxy resin composition,', 'wherein the epoxy resin composition comprises a curing agent and one or both of a phenol novoiac epoxy and a bisphenol A epoxy, and', 'wherein the cured seal is exposed to the fluid comprising one or more aromatic compounds when the capacitor tank is completely assembled., 'a cured seal between the insulating bushing and the metallic tank cover,'}2. The capacitor tank of claim 1 , wherein the curing agent is an amine-containing hardener.3. The capacitor tank of claim 1 , wherein the curing agent is cyanamide or dicyandiamide.4. The capacitor tank of claim 1 , wherein the epoxy resin composition comprises a polymer content of at least about 50% polymer content.5. The capacitor tank of claim 1 , wherein the one or more aromatic compounds are selected from the group consisting of diaryl ethanes claim 1 , diaryl methanes claim 1 , triaryl methanes claim 1 , triaryl ethanes claim 1 , biphenyls claim 1 , monoaromatics and naphthalenes.6. The capacitor tank of claim 1 , wherein the epoxy resin composition is cured by heating the epoxy resin composition to between about 80° C. to about 160° C. andholding the epoxy resin composition between about 80° ...

RESIN COMPOSITION AND MATERIALS CONTAINING A RESIN COMPOSITION

This invention relates to a resin composition. The resin composition comprises a first polyfunctional epoxy component (i) comprising an epoxy resin based on a alkylol alkane triglycidyl ether monomer, and a second component, (ii) comprising an epoxy resin. The composition further comprise a third component, (iii) comprising a hydrazide based curative in combination with either (a) a urone based curative or (b) an imidazole based curative or both. 1. A resin composition comprisinga. a first polyfunctional epoxy component (i) comprising an epoxy resin based on an alkylol alkane triglycidyl ether monomer, andb. a second component (ii) comprising an epoxy resin,the composition further comprisingc. a third component (iii) comprising a hydrazide based curative in combination with either (a) a urone based curative or (b) an imidazole based curative or both.2. The resin composition according to claim 1 , wherein the alkylol alkene triglycidylether monomer is a trialkylol alkene triglycidylether monomer.3. The resin composition according to claim 1 , wherein the alkylol alkene triglycidylether monomer is selected from the group of monomers consisting of trimethylolethane triglycidyl ether claim 1 , trimethylolmethane triglycidyl ether claim 1 , trimethylolpropane triglycidyl ether claim 1 , p-aminophenol triglycidyl ether claim 1 , 1 claim 1 ,2 claim 1 ,6-hexanetriol triglycidyl ether claim 1 , glycerol triglycidyl ether claim 1 , diglycerol triglycidyl ether claim 1 , glycerol ethoxylate triglycidyl ether claim 1 , castor oil triglycidyl ether claim 1 , propoxylated glycerine triglycidyl ether claim 1 , and/or combinations thereof.4. The resin composition according to claim 1 , wherein component (i) is based on at least two alkylol alkane triglycidyl ether monomers each having a different structure.5. The resin composition according to claim 4 , wherein component (i) comprises an epoxy novolac resin and a phenol novolac epoxy resin which differs in structure from the epoxy ...

Peel ply, method of surface preparation and bonding composite structures using the same

A resin-rich peel ply that does not leave behind residual fibers after peeling and can work well with different resin-based composite substrates. The resin-rich peel ply is composed of a woven fabric impregnated with a resin matrix different from the resin matrix of the composite substrate. The peel ply is designed such that, upon manual removal of the peel ply from the composite substrate's surface, a thin film of the peel ply resin remains on the composite substrate's surface to create a bondable surface capable of bonding with another composite substrate, but no fibrous material from the woven fabric remains on the same surface.

ADHESIVE COMPOSITION, AND COVERLAY FILM, BONDING SHEET, COPPER-CLAD LAMINATE AND ELECTROMAGNETIC SHIELDING MATERIAL, EACH USING SAID ADHESIVE COMPOSITION

The present invention is an adhesive composition that is characterized by containing (A) a modified polyolefin resin and (B) an epoxy compound, and is also characterized in that: the modified polyolefin resin (A) is obtained by graft modifying a polyolefin resin with use of a modifying agent that contains an α,β-unsaturated carboxylic acid or a derivative thereof; the content of the epoxy compound (B) is 1-20 parts by mass relative to 100 parts by mass of the modified polyolefin resin (A); and the epoxy compound is composed of two or more types of epoxy compounds. 1. An adhesive composition , comprising:(A) a modified polyolefin-based resin; and(B) an epoxy resin,wherein the modified polyolefin-based resin (A) is a resin in which a polyolefin resin is graft-modified with a modifier comprising an α, β-unsaturated carboxylic acid or a derivative thereof,a content of the epoxy resin (B) is in a range of from 1 to 20 parts by mass based on 100 parts by mass of the modified polyolefin-based resin (A), andthe epoxy resin (B) comprises two or more types of epoxy resins.2. The adhesive composition of claim 1 , wherein the epoxy resin (B) comprises a novolak type epoxy resin.3. The adhesive composition of claim 2 , wherein the epoxy resin (B) comprises a bisphenol A novolak type epoxy resin.4. The adhesive composition of claim 1 , wherein the epoxy resin (B) comprises an epoxy resin having an alicyclic skeleton.5. The adhesive composition of claim 1 , wherein the modified polyolefin-based resin (A) comprises a modified polypropylene resin.6. The adhesive composition of claim 1 , wherein the derivative of the α claim 1 , β-unsaturated carboxylic acid is at least one compound selected from the group consisting of an itaconic anhydride claim 1 , a maleic anhydride claim 1 , an aconitic anhydride and a citraconic anhydride.7. The adhesive composition of claim 1 , wherein a content proportion of a graft portion derived from the α claim 1 ,β-unsaturated carboxylic acid or the ...

ADHESIVE COMPOSITION, ULTRASONIC TRANSDUCER, ENDOSCOPE, AND ULTRASONIC ENDOSCOPE

An adhesive composition includes an epoxy resin as a main component and an inorganic zwitterion exchanger. 1. An adhesive composition comprising:an epoxy resin as a main component; andan inorganic zwitterion exchanger.2. The adhesive composition according to claim 1 ,wherein the inorganic zwitterion exchanger is an inorganic compound including at least one type of metal atom selected from a group consisting of bismuth, antimony, zirconium, magnesium, and aluminum.3. The adhesive composition according to claim 1 ,wherein 0.1 parts by mass or more and 1.0 part by mass or less of the inorganic zwitterion exchanger is added with respect to 10 parts by mass of the epoxy resin.4. The adhesive composition according to claim 1 ,wherein the epoxy resin includes at least one type of epoxy resin selected from a group consisting of a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, and a phenol novolak type epoxy resin.5. The adhesive composition according to claim 1 , further comprising:a curing agent including at least one selected from a group consisting of xylenediamine, a polyamine, a tertiary amine, and derivatives thereof.6. The adhesive composition according to claim 1 , further comprising:an inorganic filler.7. The adhesive composition according to claim 6 ,wherein the inorganic filler includes at least one type of inorganic filler selected from a group consisting of alumina, zirconia, silicon nitride, silicon carbide, tungsten trioxide, diamond, sapphire, aluminum nitride, boron nitride, and magnesium oxide.8. The adhesive composition according to claim 6 ,wherein 30 parts by mass or more and 300 parts by mass or less of the inorganic filler is included with respect to 10 parts by mass of the epoxy resin.9. The adhesive composition according to claim 6 ,wherein the inorganic filler is spherical particles having an aspect ratio of 0 or more and less than 0.5.10. An ultrasonic transducer claim 6 , comprising:{'claim-ref': {'@idref': 'CLM-00006', 'claim 6'}, ...

Recyclable Conductive Adhesive Composition for Led Packaging and Preparation Method Thereof, Recycling Method and Recycled Conductive Silver Powder

The present invention refers to a recyclable conductive adhesive composition for LED packaging and preparation method thereof, and its recycling method and the obtained recycled conductive silver powder, wherein the recyclable conductive adhesive composition for LED packaging comprises epoxy resin, epoxy resin diluent, curing agent containing imine bond, amine curing agent, curing accelerator, wetting dispersant, coupling agent, defoamer and conductive silver powder. The epoxy curing agent containing imine bond adopted in the present invention can introduce the dynamic imine chemical bond into the epoxy resin matrix of the conductive adhesive by curing reaction, and can endow the epoxy resin matrix with degradable function by its imine bond's feature of occurring dynamic exchange reaction with amine solvent under heating condition, therefore the conductive silver powder in the conductive adhesive can be recycled and reused. 2. The recyclable conductive adhesive composition for LED packaging of claim 1 , characterized in that claim 1 , the epoxy resin diluent is one selected from ethylene glycol diglycidyl ether claim 1 , butanediol diglycidyl ether and neopentyl glycol diglycidyl ether.3. The recyclable conductive adhesive composition for LED packaging of claim 1 , characterized in that claim 1 , the polyether amine curing agent is at least one selected from D-205 claim 1 , D-230 and D-400 claim 1 , and the alicyclic amine curing agent is at least one selected from isophorone diamine claim 1 , 1 claim 1 ,3-bis(aminomethyl)cyclohexane claim 1 , 1-methyl-2 claim 1 ,4-cyclohexanediamine and 4 claim 1 ,4′-diaminodicyclohexylmethane.4. The recyclable conductive adhesive composition for LED packaging of claim 1 , characterized in that claim 1 , the curing accelerator is one selected from 2-ethyl-4-methylimidazole claim 1 , 1-benzyl-2-methylimidazole claim 1 , 1-cyanoethyl-2-ethyl-4-methylimidazole and DMP-30.5. The recyclable conductive adhesive composition for LED ...

Temporary adhesive for production of semiconductor device, and adhesive support and production method of semiconductor device using the same

The invention is directed to a temporary adhesive for production of semiconductor device, containing (A) a polymer compound having an acid group, (B) a diluent, and (C) a solvent, an adhesive support including a substrate and an adhesive layer formed from the temporary adhesive for production of semiconductor device, and a production method of semiconductor device having a member processed including: adhering a first surface of a member to be processed to a substrate through an adhesive layer formed from the temporary adhesive for production of semiconductor device as claimed; conducting a mechanical or chemical processing on a second surface which is different from the first surface of the member to be processed to obtain the member processed; and releasing the first surface of the member processed from the adhesive layer.

A VACUUM INSULATING GLAZING

The present invention refers to a Vacuum Insulating Glazing (VIG) able to provide excellent thermal insulation to the transparent components of curtain walling systems in buildings and to cabinets for domestic or commercial refrigerators, and to a process for its manufacture. 1: A vacuum insulating glazing comprising:two glass panes facing one another, and spaced apart from one another by one or more pillars so as to create a void volume therebetween;a non-evaporable getter system placed within said volume; anda polymer-based sealing edge sealing off said volume in order to define a closed space in between said glass panes, (a) a curable thermosetting non-halogenated polyepoxide resin comprising in average at least two epoxy groups per molecule;', '(b) an aromatic diamine curing agent in amount sufficient to provide from 0.5 to 2.0 equivalents of amine N—H per equivalent of epoxy groups in the epoxy resin; and', '(c) an inorganic dryer in amount ranging between 5% and 25% by weight with respect to the total weight of said sealant composition., 'wherein said sealing edge is obtained by curing of a sealant composition comprising2: The vacuum insulating glazing of claim 1 , wherein said aromatic diamine curing agent amount provides from 0.5 to 1.0 equivalents of amine N—H per equivalent of epoxy groups in said epoxy resin.3: The vacuum insulating glazing of claim 1 , wherein said inorganic dryer is selected from the group consisting of oxides claim 1 , preferably CaO claim 1 , hygroscopic salts such as perchlorate dryers claim 1 , preferably Mg(ClO) claim 1 , and reversible dryers claim 1 , such as zeolites and active carbon or a mixture thereof.4: The vacuum insulating glazing of claim 1 , wherein said sealant composition further comprises one or more passive fillers.5: The vacuum insulating glazing of claim 4 , wherein said passive filler is selected from the group consisting of poly(vinyl alcohol) claim 4 , polyimides claim 4 , SiO claim 4 , TiO claim 4 , glass ...

HIGH TEMPERATURE EPOXY ADHESIVE FORMULATIONS

The invention is an epoxy resin system useful as an adhesive for high temperature applications. The system is a combination of a diglycidyl ether a bisphenol epoxy resin(s), at amounts of 30-70% by weight, with 1-10% by weight of an epoxy novolac resin 10-30% by weight of a polyurethane toughener which preferably has the terminal isocyanate functional group blocked, 1-8% by weight of a hardener, 0.1-% by weight of a cure accelerator, preferably a latent urea cure accelerator, provides the desired balance of mechanical strength and elastic modulus. The epoxy novolac resin is characterized by at least one of the following features: (i) having a viscosity at 25 degrees C. of less than 3000 mPa-s according to ASTM D-445, (ii) an average number of epoxide groups per molecule of more than 2 but less than 3.7, and (iii) a molecular weight of less than 750 g/mol. 1. An adhesive epoxy resin system comprisinga. 30-70% by weight of one or more diglycidyl ether bisphenol A resins 'D-445, (ii) an average number of epoxide groups per molecule of more than 2 but less than 3.7, and (iii) a molecular weight of less than 750 g/mol', 'b. 1-10% by weight of an epoxy novolac resin wherein the epoxy novolac resin is characterized by at least one of the following features: (i) having a viscosity at 25 degrees C. of less than 3000 mPa-s according to ASTM'}c. 10-30% by weight of a polyurethane toughener, provided that if the system is a single component system the polyurethane toughener is blocked with a monofunctional capping agent,d. 5-20% by weight of a flexibilizere. 1-8% by weight of a hardener, andf 0.1-% by weight of an aromatic urea based cure accelerator,wherein the weight percents are based on total weight of the system.2. The adhesive epoxy resin system of wherein the system is a single component system and the cure accelerator is a latent cure accelerator.3. The adhesive epoxy resin system of wherein the one or more diglycidyl ether bisphenol A resins comprise a liquid expoxy ...

Joining Dissimilar Materials Using an Epoxy Resin Composition

An epoxy resin composition is disclosed for joining dissimilar materials. The identified epoxy resin compositions can be used to seal metallic and non-metallic components of a capacitor. Specifically the epoxy resin composition can be applied to joints between a non-metallic capacitor bushing and a metallic tank cover and metallic terminal cap. Once the epoxy resin composition is cured, it can provide a seal that can withstand the stresses and environmental conditions to which a capacitor is subjected. 1. A method of forming a cured seal between an insulating material and a metallic component , comprising the steps of:a. applying an epoxy resin composition to a portion of one or both of the insulating material and the metallic component;b. contacting the insulating material to the metallic component such that the epoxy resin composition forms a seal between the insulating material and the metallic component; and wherein the insulating material comprises substantially glass, ceramic, polymer or glazed material;', 'wherein the epoxy resin composition comprises: a phenol novolac epoxy, a bisphenol A epoxy, or a combination thereof; and a curing agent; and', 'wherein the cured seal is exposed to a fluid comprising one or more aromatic compounds., 'c. curing the seal to form the cured seal;'}2. The method of claim 1 , wherein the metallic component is one of a tank cover on a capacitor tank and a terminal cap on a bushing.3. The method of claim 1 , wherein the curing agent is an amine-containing hardener.4. The method of claim 1 , wherein the curing agent is cyanamide or dicyandiamide.5. The method of claim 1 , wherein curing the seal comprises heating the seal to a temperature sufficient to cure the epoxy resin composition.6. The method of claim 1 , wherein curing the seal comprises heating the seal to between about 80° C. to about 160° C.7. The method of claim 1 , wherein curing the seal comprises heating the seal to between about 80° C. to about 160° C. and holding ...

Adhesive resin composition, method for bonding adherends, and adhesive resin film

The present invention provides an adhesive resin composition that has excellent adhesiveness and durability, a method for bonding adherends, and an adhesive resin film. More specifically, the present invention relates to an adhesive resin composition containing more than 50 parts by mass and 99.5 parts by mass or less in a solid content of an acid-modified polyolefin resin having a melting point of 50 to 100° C., 0.5 parts by mass or more and less than 50 parts by mass in a solid content of an epoxy resin having a novolac structure, and an organic solvent; a method for bonding adherends including forming an adhesive layer on a first adherend by applying the adhesive resin composition and drying, and then bonding a second adherend to the adhesive layer by laminating the second adherend on the adhesive layer; and an adhesive resin film including a first adhesive layer, a substrate layer, and a second adhesive layer in that order, in which any one or both of the first adhesive layer and the second adhesive layer include(s) the adhesive resin composition.

CYCLOALIPHATIC-BASED EPOXY ADHESIVE COMPOSITION

A new adhesive composition comprising a cycloaliphatic-based epoxy composition, which is particularly suitable for use as a structural adhesive in anchoring applications. 1. An adhesive composition comprising:a first part comprising a liquid epoxy resin and a second part comprising an Amine.2. The adhesive composition of claim 1 , where the liquid epoxy resin comprises a reaction product of epichlorohydrin with bis-phenol A.3. The adhesive composition of claim 1 , wherein the liquid epoxy resin comprises a reaction product of epichlorohydrin with bis-phenol A and bis-phenol F.4. The adhesive composition of claim 1 , wherein the first part further comprises a high viscosity epoxy Novolac resin.5. The adhesive composition of claim 1 , wherein the first part further comprises one or more thickeners claim 1 , fillers claim 1 , additives claim 1 , or a combination thereof.6. The adhesive composition of claim 5 , wherein the filler is sand.7. The adhesive composition of claim 6 , wherein the sand is flour grade quartz.8. The adhesive composition of claim 5 , where the thickener is fumed silica.9. The adhesive composition of claim 5 , wherein the additive is ceramic microspheres claim 5 , trimethylolpropane triglycidyl ether claim 5 , titanium dioxide claim 5 , or a mixture thereof.10. The adhesive composition of claim 1 , wherein the second part further comprises one or more thickeners claim 1 , fillers claim 1 , additives claim 1 , or a combination thereof.11. The adhesive composition of claim 10 , wherein the filler is sand.12. The adhesive composition of claim 11 , wherein the sand is flour grade quartz.13. The adhesive composition of claim 10 , where the thickener is fumed silica.14. The adhesive composition of claim 10 , wherein the additive is glass fibers claim 10 , ceramic microspheres claim 10 , or a mixture thereof.15. A method of embedding an anchor pin comprising:forming a hole in a substrate;introducing a sufficient amount of an adhesive composition of any ...

DIENE/DIENOPHILE COUPLES AND THERMOSETTING RESIN COMPOSITIONS HAVING REWORKABILITY

Thermosetting resin compositions are provided that are useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”) and the like (collectively, “subcomponents”), or semiconductor chips. Reaction products of the compositions are controllably reworkable when subjected to appropriate conditions. 124-. (canceled)26. The composition of claim 25 , wherein the curable resin component is a member selected from the group consisting of epoxy claim 25 , episulfide claim 25 , oxetane claim 25 , thioxetane claim 25 , oxazine claim 25 , maleimide claim 25 , itaconamide claim 25 , nadimide claim 25 , (meth)acrylate claim 25 , (meth)acrylamide claim 25 , and combinations thereof.27. The composition of claim 25 , wherein the two reactive groups are the same.28. The composition of claim 25 , wherein the two reactive groups are different.29. The composition of claim 25 , wherein the curative is selected from imidizoles claim 25 , dicyandimide claim 25 , carboxylic acids claim 25 , anhydride claim 25 , phenolic hardeners claim 25 , amines claim 25 , thiols claim 25 , alcohols claim 25 , and alkalines.30. The composition of claim 25 , wherein the diene/dienophile couple is selected from dicyclopentadiene claim 25 , cyclopentadiene-maleimide claim 25 , cyclopentadiene-maleate claim 25 , cyclopentadiene-fumarate claim 25 , cyclopentadiene-(meth)acrylate claim 25 , cyclopentadiene-crotonate claim 25 , cyclopentadiene-cinnamate claim 25 , cyclopentadiene-(meth)acrylamide claim 25 , and furan-maleimide.31. The composition of claim 25 , wherein the diene of the diene/dienophile couple is selected from acyclic 1 claim 25 ,3-diene claim 25 , cyclopentadiene claim 25 , cyclohexadiene claim 25 , furan claim 25 , fulvene claim 25 , pyrrole claim 25 , naphthalene and anthracene.32. The composition of claim 25 , wherein the dienophile of the diene/dienophile couple is selected from ...

Curable composition for hard disk drive

The present invention provides a curable composition for a hard disk drive, the composition comprising: a compound (component A1) having an ethylenically unsaturated group and having no epoxy group and a compound (component A2) having an ethylenically unsaturated group and an epoxy group, or the component A2 and a compound (component A3) having an epoxy group and having no ethylenically unsaturated group, or the component A1 and the component A3, or the component A1, the component A2, and the component A3, or the component A2; a photo-radical polymerization initiator (component B); and a compound (component C) capable of causing the epoxy group to undergo polymerization, and a method for producing a hard disk drive, which comprises the step of bonding a part to a magnetic head portion using the composition.

ADHESIVE FOR ENDOSCOPE AND CURED PRODUCT THEREOF, AND ENDOSCOPE AND METHOD FOR PRODUCING THE SAME

Provided are an adhesive for an endoscope and a cured product thereof. The adhesive for an endoscope includes an epoxy resin including at least one of a bisphenol A epoxy resin, a bisphenol F epoxy resin, or a phenol novolac epoxy resin, a polyamine compound, and an alcohol compound. Also provided are an endoscope in which the cured product is fixed and a method for producing the endoscope. 1. An adhesive for an endoscope , comprising:an epoxy resin including at least one of a bisphenol A epoxy resin, a bisphenol F epoxy resin, or a phenol novolac epoxy resin;a polyamine compound; andan alcohol compound.2. The adhesive for an endoscope according to claim 1 , wherein the alcohol compound has a hydroxyl equivalent of 25 to 150.3. The adhesive for an endoscope according to claim 1 , wherein the alcohol compound has a molecular weight of 50 to 500.4. The adhesive for an endoscope according to claim 1 , wherein the alcohol compound is a polymer and has a number average molecular weight of 2 claim 1 ,000 to 100 claim 1 ,000.5. The adhesive for an endoscope according to claim 1 , wherein the alcohol compound has a C Log P of −1.5 to 3.5.6. The adhesive for an endoscope according to claim 1 , wherein the alcohol compound is a polyol compound.7. The adhesive for an endoscope according to claim 1 , wherein the polyamine compound has an active hydrogen equivalent of 10 to 2 claim 1 ,000.8. The adhesive for an endoscope according to claim 1 , wherein the polyamine compound has a polyoxyalkylene structure.9. The adhesive for an endoscope according to claim 1 , wherein claim 1 , relative to 100 parts by mass of a content of the epoxy resin claim 1 , a content of the polyamine compound is 5 to 60 parts by mass claim 1 , and a content of the alcohol compound is 1 to 20 parts by mass.10. A cured product formed by curing the adhesive for an endoscope according to .11. An endoscope comprising the cured product according to and a constituent member fixed with the cured product.12. A ...

BLOCKED 1,8-DIAZABICYCLO[5.4.0]UNDEC-7-ENE BICARBONATE CATALYST FOR AEROSPACE SEALANTS

Compositions comprising sulfur-containing prepolymers such as polythioether prepolymers, polyepoxides, and a blocked 1,8-diazabicyclo[5.4.0]undec-7-ene bicarbonate catalyst useful as aerospace sealants are disclosed. The compositions exhibit extended working time and the curing rate can be tailored for specific applications. 1. A composition comprising:(a) a thiol-terminated sulfur-containing prepolymer;(b) a polyepoxide curing agent; and(c) a blocked 1,8-diazabicyclo[5.4.0]undec-7-ene bicarbonate catalyst.2. The composition of claim 1 , wherein the catalyst is in the form of a powder.3. The composition of claim 2 , wherein the powder is characterized by an average particle diameter from 25 μm to 200 μm.4. The composition of claim 2 , wherein the powder is characterized by an average particle diameter less than 100 μm.5. The composition of claim 1 , wherein the polyepoxide curing agent comprises an epoxy novolac resin claim 1 , a bisphenol A/epichlorohydrin epoxy resin claim 1 , or a combination thereof.6. The composition of claim 1 , wherein the composition comprises:from 35 wt % to 65 wt % of the thiol-terminated sulfur-containing prepolymer;from 4 wt % to 11 wt % of the polyepoxide curing agent; andfrom 0.2 wt % to 0.36 wt % of the blocked 1,8-diazabicyclo[5.4.0]undec-7-ene bicarbonate catalyst.7. The composition of claim 1 , wherein the thiol-terminated sulfur-containing prepolymer comprises a thiol-terminated polythioether prepolymer.8. The composition of claim 7 , wherein the thiol-terminated polythioether prepolymer comprises a thiol-terminated polythioether prepolymer of Formula (2) claim 7 , a thiol-terminated polythioether prepolymer of Formula (2a) claim 7 , or a combination thereof:{'br': None, 'sup': 1', '2', '1, 'sub': 2', 'p', 'm', '2', '2', 'n, 'HS—R—[—S—(CH)—O—(R—O)—(CH)—S—R—]—SH\u2003\u2003(2)'}{'br': None, 'sup': 1', '2', '1, 'sub': 2', 'p', 'm', '2', '2', 'n', 'z, '{HS—R—[—S—(CH)—O—(R—O)—(CH)—S—R—]—S—V′—}B\u2003\u2003(2a)'} [{'sup': 1', '3', '3, ...

COMPOUND HAVING ALKOXYSILYL GROUP AND ACTIVE ESTER GROUP, METHOD FOR PREPARING SAME, COMPOSITION COMPRISING SAME, AND USE

The present invention relates to a novel compound having an alkoxysilyl group and an active ester group, a method for preparing the same, a composition comprising the same, and a use, wherein the novel compound exhibits improved low moisture absorption and/or low dielectric properties when cured as an epoxy composition, but is not accompanied by loss of thermal expansion characteristics. Disclosed are a novel compound of formulae AF to LF having an alkoxysilyl group and an active ester group, and a method for preparing the same, a composition comprising the same, and a use of same. 5. An epoxy composition comprising a compound having an alkoxysilyl group and an active ester group selected from a group consisting of Formulae AF to LF of .6. The epoxy composition of claim 5 , further comprising:an epoxy compound, a curing agent, and a filler.7. An electrical and electronic material including the epoxy composition of .8. The electrical and electronic material of claim 7 , wherein the electrical and electronic material is a substrate claim 7 , a film claim 7 , a laminated substrate claim 7 , prepreg claim 7 , a printed circuit board claim 7 , or a packaging material.9. An adhesive comprising the epoxy composition of .10. A paint comprising the epoxy composition of . The present disclosure relates to a novel compound having an alkoxysilyl group and an active ester group, a method for preparing the same, a composition comprising the same, and a use thereof, the novel compound exhibiting improved low moisture absorption and/or low dielectric properties without loss of thermal expansion properties when its epoxy composition is cured.An epoxy material used in various substrates or packagings in the field of semiconductor and electrical and electronic materials has a property to absorb moisture from the air. Moisture absorbed by an epoxy material is rapidly vaporized when exposed to a high temperature such as in a soldering process. The volume expansion during vaporization ...

CYCLOALIPHATIC-BASED EPOXY ADHESIVE COMPOSITION

A new adhesive composition comprising a cycloaliphatic-based epoxy composition, which is particularly suitable for use as a structural adhesive in anchoring applications. 1. An adhesive composition comprising:a first part comprising one or more liquid epoxy resins, ceramic microspheres, and titanium dioxide; anda second part comprising 1,3-cyclohexanedimethanamine, 1-(1-piperazinyl)-2-aminoethane, bis(4-aminocyclohexyl)methane, a styrenated phenol, salicylic acid and ceramic microspheres.2. The adhesive composition of claim 1 , wherein the one or more liquid epoxy resins in the first part comprises a reaction product of epichlorohydrin with bis-phenol A.3. The adhesive composition of claim 1 , wherein the one or more liquid epoxy resins in the first part comprises a reaction product of epichlorohydrin with bis-phenol A and a reaction product of epichlorohydrin with bis-phenol A and bis-phenol F.4. The adhesive composition of claim 3 , wherein the second part further comprises glass fibers.5. The adhesive composition of claim 3 , wherein the first part further comprises quartz.6. The adhesive composition of claim 4 , wherein the quartz is flour grade quartz.7. The adhesive composition of claim 6 , wherein the titanium dioxide comprises 0.5 to 2% (w/w) of the first part.8. The adhesive composition of claim 7 , wherein the ceramic microspheres of the second part comprise 6 to 25% (w/w) of the second part.9. The adhesive composition of claim 8 , wherein the glass fibers comprise 4 to 15% (w/w) of the second part.10. The adhesive composition of claim 9 , wherein the ceramic microspheres of the first part comprise 3 to 8% (w/w) of the first part.11. An adhesive composition comprising:a first part comprising oxirane, 2,2′-((1-methylethylidene)bis(4,1-phenyleneoxymethylene))bis-, homopolymer; liquid epoxy resin; ceramic microspheres; and titanium dioxide; anda second part comprising 1,3-cyclohexanedimethanamine, 1-(1-piperazinyl)-2-aminoethane, bis(4-aminocyclohexyl)methane ...

ULTRA RAPID CURING STRUCTURAL ADHESIVE

A process for adhesively bonding at least two substrates includes the application to the at least two substrates of an uncured adhesive formulation. The uncured adhesive formulation includes at least two curable resin components of epoxy novolac resin, bisphenol A-epichlorohydrin epoxy, or 4,4′-Isopropylidenediphenol, oligomeric reaction products with 1-chloro-2,3-epoxypropane in a total amount of at least 60 total weight percent. An epoxy curing agent is also present in the formulation. The uncured adhesive formulation cures at an elevated onset temperature of at least 140° C. to adhesively bonding the at least two substrates. The adhesive formulation is also provided with a cure accelerator. An assembly is provided that includes a first substrate of nylon or carbon fiber filled polymer and a second substrate of nylon or carbon fiber filled polymer. A layer of the cured adhesive formulation is present in simultaneous contact with the first substrate and the second substrate. 2. The process of further comprising heating said uncured adhesive formulation prior to said applying.3. The process of wherein the at least two substrates are vehicle components.4. The process of wherein the elevated onset temperature is between 160° C. and 200° C.5. The process of wherein said uncured adhesive formulation is applied as a bead.6. The process of wherein one of the at least two substrates is one of a carbon reinforced plastic (CFRP) or filled nylon.7. The process of wherein all of the at least two substrates are either of said CFRP or said filled nylon.9. The formulation of wherein said at least two curable resin components are all three of epoxy novolac resin claim 8 , bisphenol A-epichlorohydrin epoxy claim 8 , or 4 claim 8 ,4′-Isopropylidenediphenol claim 8 , oligomeric reaction products with 1-chloro-2 claim 8 ,3-epoxypropane in an amount of at least 75 total weight percent.10. The formulation of wherein said epoxy curing agent is one or more of a diamide claim 8 , a ...

ADHESIVE RESIN LAMINATE, LAMINATE, AND METHOD OF PRODUCING SAME

Provided are an adhesive resin laminate having an excellent adhesive force to two adherends, a laminate in which this adhesive resin laminate is laminated with two adherends, and a method of producing them. An adhesive resin laminate having at least a first adhesive layer and a second adhesive layer, in which the first adhesive layer includes a base resin and a crosslinking agent, the base resin is a modified polyolefin resin, the crosslinking agent is an epoxy-based compound, the second adhesive layer includes a polyolefin-based resin, and the first adhesive layer has a viscoelastic modulus measurement value E (150) at 150° C. of 1.0×10Pa or more and 1.0×10Pa or less. 1. A method of producing an adhesive resin laminate having at least a first adhesive layer and a second adhesive layer ,{'sup': 4', '8, 'wherein said first adhesive layer comprises a base resin and a crosslinking agent, said base resin is a modified polyolefin resin and said crosslinking agent is an epoxy-based compound, said second adhesive layer comprises a polyolefin-based resin, and said first adhesive layer has a viscoelastic modulus measurement value E (150) at 150° C. of 1.0×10Pa or more and 1.0×10Pa or less,'}the method comprising:(1) a step of dissolving said modified polyolefin resin and said epoxy-based compound in a solvent to produce a coating liquid;(2) a step of coating said coating liquid on a substrate film and drying the coating liquid to produce said first adhesive layer;(3) a step of obtaining said second adhesive layer having a film shape by extrusion molding;(4) a step of laminating said first adhesive layer on said substrate film and said second adhesive layer; and(5) a step of peeling said substrate film to obtain said adhesive resin laminate, in this order.2. A method of producing a laminate comprising an adhesive resin laminate having at least a first adhesive layer and a second adhesive layer; and first and second adherends , said adhesive resin laminate and said first and ...

BONDING OF COMPOSITE MATERIALS

Peel ply for surface preparation and a method of surface preparation prior to adhesive bonding. A resin-rich peel ply is applied onto a curable, resin-based composite substrate, followed by co-curing. After co-curing, the composite substrate is fully cured but the matrix resin in the peel ply remains partially cured. When the peel ply is removed, a roughened, bondable surface with chemically-active functional groups is revealed. The composite substrate with the chemically-active, bondable surface may be bonded to another composite substrate to form a covalently-bonded structure. 115-. (canceled)16. A curable composite structure comprising:a removable, resin-rich peel ply on a surface of a composite substrate,wherein the composite substrate comprises reinforcing fibers impregnated with a curable, first matrix resin and the peel ply comprises a fabric impregnated with a curable, second matrix resin different from the first matrix resin, andwherein the second matrix resin contains an insufficient amount of curing agent for fully curing the second matrix resin under the same curing conditions that would result in fully curing of the first matrix resin.17. The curable composite structure of claim 16 , wherein the second matrix resin comprises at least one thermoset resin and at least one curing agent for crosslinking the thermoset resin claim 16 , and the molar ratio of thermoset resin to curing agent is such that there is a deficiency in the amount of curing agent that is necessary for reacting with 100% of the thermoset resin when both of the first and second matrix resins are subjected to the same curing conditions that would result in fully curing the first matrix resin claim 16 , and consequently claim 16 , there is unreacted claim 16 , non-crosslinked thermoset resin in the peel ply when the first matrix resin is fully cured.18. The curable composite structure of claim 17 , wherein the at least one thermoset resin in the second matrix resin is a multifunctional ...

High Tg Epoxy Formulation with Good Thermal Properties

Varnish compositions and prepregs and laminates made therefrom wherein the varnish compositions include at least one first epoxy resin and at least one second epoxy resin that includes a bisphenol-A novolac epoxy resin and a harder wherein the at least one first epoxy resin and the at least one second bisphenol-A novolac epoxy resin are present in the varnish at a weight ratio ranging from about 1:1 to about 1:3.

Photocurable adhesive composition

Provided is an adhesive composition comprising: a thermosetting epoxy resin formed with an epoxy copolymer containing a hydroxyl group; and a UV curable epoxy resin having an epoxy equivalence of 100 g/eq to 500 g/eq.

ADHESIVE COMPOSITION FOR SEMICONDUCTOR, ADHESIVE FILM FOR SEMICONDUCTOR, AND DICING DIE BONDING FILM

The present invention relates to an adhesive composition for a semiconductor including: a thermoplastic resin having a glass transition temperature of −10° C. to 20° C.; a curing agent containing a phenol resin having a softening point of 70° C. or more; a solid epoxy resin; and a liquid epoxy resin, wherein a weight ratio of the total contents of the solid epoxy resin and the liquid epoxy resin to the thermoplastic resin is 1.6 to 2.6, an adhesive film for a semiconductor including the adhesive composition for a semiconductor, a dicing die bonding film including an adhesive layer including the adhesive composition for a semiconductor, and a method for dicing a semiconductor wafer using the dicing die bonding film. 1. An adhesive composition for a semiconductor comprising:a thermoplastic resin having a glass transition temperature of −10° C. to 20° C.;a curing agent containing a phenol resin having a softening point of 70° C. or more;a solid epoxy resin;and a liquid epoxy resin,wherein a weight ratio of total contents of the solid epoxy resin and the liquid epoxy resin to the thermoplastic resin is 1.6 to 2.6.2. The adhesive composition according to claim 1 ,wherein a weight ratio of total contents of the solid epoxy resin and the liquid epoxy resin to the thermoplastic resin is 1.7 to 2.5.3. The adhesive composition according to claim 1 ,wherein a weight ratio of the phenol resin to the total weight of the thermoplastic resin, the phenol resin, and the liquid epoxy resin is 0.280 or more.4. The adhesive composition according to claim 1 ,wherein a weight ratio of the phenol resin to the total weight of the thermoplastic resin, the phenol resin, and the liquid epoxy resin is 0.300 to 0.600.5. The adhesive composition according to claim 1 ,wherein the liquid epoxy resin has a viscosity of 500 mPa·s to 20,000 mPa·s at 25° C.6. The adhesive composition according to claim 1 ,wherein the liquid epoxy resin has an epoxy equivalent weight of 100 to 1,000.7. The adhesive ...

Adhesive for endoscope, cured product, endoscope, and method for producing endoscope

Provided are an adhesive for an endoscope, a cured product thereof, an endoscope produced using the adhesive for an endoscope, and a method for producing the endoscope. The adhesive for an endoscope is a two-component adhesive for an endoscope. The two-component adhesive has a base and a curing agent. The base includes at least one epoxy resin (A) selected from the group consisting of bisphenol A epoxy resins, bisphenol F epoxy resins, and phenol novolac epoxy resins. The curing agent includes at least one specific polyamine compound (B). The adhesive for an endoscope is used to fix at least one of a metal member or a glass member constituting the endoscope.

THERMALLY AND ELECTRICALLY CONDUCTIVE ADHESIVE COMPOSITION

The present invention relates to a thermally and electrically conductive adhesive composition, which includes (A) an electrically conductive filler, (B) an epoxy resin, (C) a reactive diluent, and (D) a curing agent, wherein the component (A) is a silver powder having an average particle diameter of 1 to 10 μm, the component (B) has two or more epoxy functional groups and aromatic rings in each molecule, the component (C) is a compound having two or more glycidyl ether functional groups in an aliphatic hydrocarbon chain and also having a molecular weight of 150 to 600, and the component (D) is a compound having two or more phenol functional groups in each molecule, a compound having two or more aniline functional groups in each molecule, or a mixture of these compounds, and the content of each of the component (A), (B), (C), and (D) is within a specific range. 1. A thermally and electrically conductive adhesive composition , comprising (A) an electrically conductive filler , (B) an epoxy resin , (C) a reactive diluent , and (D) a curing agent , whereinthe electrically conductive filler (A) is a silver powder having an average particle diameter of 1 to 10 μm, and the content of the electrically conductive filler (A) is in a range of 85 to 94 mass % with respect to the total amount of the thermally and electrically conductive adhesive composition,the epoxy resin (B) has two or more epoxy functional groups and aromatic rings in each molecule, and the content of the epoxy resin (B) is in a range of 1 to 8 mass % with respect to the total amount of the thermally and electrically conductive adhesive composition,the reactive diluent (C) is a compound having two or more glycidyl ether functional groups in an aliphatic hydrocarbon chain and also having a molecular weight of 150 to 600, and the content of the reactive diluent (C) is in a range of 0.2 to 5 mass % with respect to the total amount of the thermally and electrically conductive adhesive composition, andthe curing ...

Thermally Degradable Adhesives with Cellulose, and Related Methods of Manufacture and Use

A method includes heating an adhesive, which secures adjacent parts together and contains one or both of cellulose micro or nanocrystals, to a temperature sufficient to irreversibly degrade the adhesive and separate the adjacent parts. A thermally degradable composition has an adhesive; and one or both of cellulose micro or nanocrystals. A method of making a thermally degradable composition includes forming a thermally degradable composition by mixing the first part and the second part of the epoxy along with cellulose micro or nanocrystals. 1. A method comprising:heating an adhesive, which secures adjacent parts together and contains one or both of cellulose micro or nanocrystals, to a temperature sufficient to degrade the adhesive; and separating the adjacent parts.2. The method of further comprising allowing the adhesive to cool to a temperature between 0 and 50° C. prior to separating the adjacent parts.3. (canceled)4. The method of in which the adhesive comprises cellulose nanocrystals (CNCs).5. The method of in which the cellulose micro or nanocrystals have a concentration of at least fifteen percent by weight of the adhesive.6. (canceled)7. The method of in which heating comprises heating to a maximum temperature of less than 300° C. to degrade the adhesive.8. (canceled)9. The method of in which heating comprises heating to a temperature between 200° C. and 300° C. to degrade the adhesive.10. (canceled)11. The method of in which the adhesive comprises an epoxy.12. The method of in which the epoxy is an end product of a two part polymerizable system comprising a first part containing epoxides and a second part comprising a hardener.13. (canceled)14. The method of in which the epoxy is stable at temperatures of 200° C. or higher when cured in pure form.15. The method of in which the epoxy comprises the end product of reaction between a mixture of aliphatic amine claim 14 , 1 claim 14 ,2 claim 14 ,3 claim 14 ,6-tetrahydro-methyl-3 claim 14 ,6-methano- ...

Curable composition

The present invention provides an epoxy resin-based curable composition which may be used as a structural adhesive for an automobile. Particularly, the present invention provides an epoxy resin-based curable composition having excellent low-temperature curability, while maintaining good storage stability and good adhesion. The present invention relates to a curable composition comprising an epoxy resin, a urea-based curing accelerator (A) and an amine-based curing agent (B) having a pyrazine ring.

CATIONICALLY CURABLE RESIN COMPOSITION FOR ASSEMBLING HARD DISK DEVICES

The present invention provides a cationically curable resin composition for assembling hard disk devices which comprises a resin having a cationically polymerizable functional group (a component A) and a cationic polymerization initiator (a component B), the component B being at least one selected from the group consisting of X(SbF)(B1), X(B(CF))(B2) and X((Rf)PF)(B3) (in the formulae, X is iodonium or sulfonium, Rf is a fluorinated alkyl having 1 to 6 carbon atoms, and n is an integer of 1 to 6). The invention also provides a hard disk device manufacturing method using the composition, and a hard disk device assembled with the composition. 1. A cationically curable resin composition for assembling hard disk devices , comprising a resin having a cationically polymerizable functional group (a component A) and a cationic polymerization initiator (a component B) , the component B being at least one selected from the group consisting of the following formulae:{'br': None, 'sup': +', '−, 'sub': '6', 'X(SbF)\u2003\u2003(B1),'}{'br': None, 'sup': +', '−, 'sub': 6', '5', '4, 'X(B(CF))\u2003\u2003(B2), and'}{'br': None, 'sup': +', '−, 'sub': n', '6-n, 'X((Rf)PF)\u2003\u2003(B3)'}{'sup': '+', 'wherein in the formulae, X is iodonium or sulfonium, Rf is a fluorinated alkyl having 1 to 6 carbon atoms, and n is an integer of 1 to 6.'}2. The cationically curable resin composition for assembling hard disk devices according to claim 1 , wherein the component A is at least one selected from the group consisting of epoxy group-containing resins claim 1 , oxetanyl group-containing resins and vinyl ether group-containing resins.3. The cationically curable resin composition for assembling hard disk devices according to claim 1 , wherein the epoxy group-containing resins have an epoxy equivalent of not less than 150.4. The cationically curable resin composition for assembling hard disk devices according to claim 1 , wherein the component A is a mixture of an epoxy group-containing resin ...

SILVER CONDUCTIVE ADHESIVE AND PREPARATION METHOD

A silver conductive adhesive comprising silver powders is disclosed. The silver powders are spherical silver powders. A method for preparing the silver conductive adhesive is further disclosed. The silver conductive adhesive has higher heating and curing efficiency, obviously shortening the curing time period and improving yield. 1. A silver conductive adhesive , comprising silver powders , wherein the silver powders are spherical silver powders.2. The silver conductive adhesive according to claim 1 , wherein the particle diameter of the spherical silver powders is from 1 to 10 micrometers.3. The silver conductive adhesive according to claim 1 , wherein the silver conductive adhesive comprises 50 to 60 percent of spherical silver powders by weight.4. The silver conductive adhesive according to claim 1 , wherein the silver conductive adhesive further comprises 3 to 10 percent of promoter and 0.5 to 3 percent of catalyst by weight; the promoter is moisture-curable polyurethane; and the catalyst is polyglycol ether.5. The silver conductive adhesive according to claim 4 , wherein the silver conductive adhesive further comprises 10 to 15 percent of epoxy resin claim 4 , 15 to 25 percent of dispersant and 1 to 5 percent of curing agent by weight.6. The silver conductive adhesive according to claim 5 , wherein the epoxy resin is one or more selected from the group consisting of bisphenol-A epoxy resin claim 5 , aliphatic epoxy resin and novolac epoxy resin.7. The silver conductive adhesive according to claim 5 , wherein the dispersant is one or more selected from the group consisting of ethanol claim 5 , isopropanol claim 5 , acetone claim 5 , cyclohexanone claim 5 , ethylene glycol diethyl ether claim 5 , and ethylene glycol monobutyl ether acetate.8. The silver conductive adhesive according to claim 5 , wherein the curing agent is one or more selected from the group consisting of dicyandiamide claim 5 , imidazole and adipic dihydrazide.9. The silver conductive adhesive ...

ADHESIVE RESIN LAMINATE, LAMINATE, AND METHOD OF PRODUCING SAME

Provided are an adhesive resin laminate having an excellent adhesive force to two adherends, a laminate in which this adhesive resin laminate is laminated with two adherends, and a method of producing them. An adhesive resin laminate having at least a first adhesive layer and a second adhesive layer, in which the first adhesive layer includes a base resin and a crosslinking agent, the base resin is a modified polyolefin resin, the crosslinking agent is an epoxy-based compound, the second adhesive layer includes a polyolefin-based resin, and when an adhesion initiation temperature of the first adhesive layer is set to T, and an adhesion initiation temperature of the second adhesive layer is set to T, T is higher than T by 30° C. or more. 1. An adhesive resin laminate having at least a first adhesive layer and a second adhesive layer ,whereinsaid first adhesive layer comprises a base resin and a crosslinking agent, said base resin is a modified polyolefin resin, and said crosslinking agent is an epoxy-based compound,said second adhesive layer comprises a polyolefin-based resin, and{'b': 1', '2', '2', '1, 'when an adhesion initiation temperature of said first adhesive layer is set to T, and an adhesion initiation temperature of said second adhesive layer is set to T, T is higher than T by 30° C. or more.'}2. The adhesive resin laminate according to claim 1 , wherein said epoxy-based compound contained in said first adhesive layer is a phenol novolak-type epoxy resin.3. The adhesive resin laminate according to claim 1 , wherein said epoxy-based compound contained in said first adhesive layer comprises a bisphenol A skeleton.4. The adhesive resin laminate according to claim 1 , wherein said second adhesive layer is a laminate of a plurality of polyolefin-based resin layers.5. The adhesive resin laminate according to claim 1 , wherein said second adhesive layer comprises a layer including block polypropylene.6. The adhesive resin laminate according to claim 1 , wherein ...

ADHESIVE RESIN LAMINATE, LAMINATE, AND METHOD OF PRODUCING SAME

Provided are an adhesive resin laminate having an excellent adhesive force to two adherends, a laminate in which this adhesive resin laminate is laminated with two adherends, and a method of producing them. An adhesive resin laminate having at least a first adhesive layer and a second adhesive layer, in which the first adhesive layer includes a base resin and a crosslinking agent, the base resin is a modified polyolefin resin, the crosslinking agent is an epoxy-based compound, the second adhesive layer includes a polyolefin-based resin, and the first adhesive layer has a viscoelastic modulus measurement value E (150) at 150° C. of 1.0×10Pa or more and 1.0×10Pa or less. 1. An adhesive resin laminate having at least a first adhesive layer and a second adhesive layer ,whereinsaid first adhesive layer comprises a base resin and a crosslinking agent, said base resin is a modified polyolefin resin, and said crosslinking agent is an epoxy-based compound,said second adhesive layer comprises a polyolefin-based resin, and{'sup': 4', '8, 'said first adhesive layer has a viscoelastic modulus measurement value E (150) at 150° C. of 1.0×10Pa or more and 1.0×10Pa or less.'}2. The adhesive resin laminate according to claim 1 , wherein said epoxy-based compound contained in said first adhesive layer is a phenol novolak-type epoxy resin.3. The adhesive resin laminate according to claim 1 , wherein said epoxy-based compound contained in said first adhesive layer comprises a bisphenol A skeleton.4. The adhesive resin laminate according to claim 1 , wherein said second adhesive layer is a laminate of a plurality of polyolefin-based resin layers.5. The adhesive resin laminate according to claim 1 , wherein said second adhesive layer comprises a layer including block polypropylene.6. The adhesive resin laminate according to claim 1 , wherein said second adhesive layer has a film thickness five times or more of a film thickness of said first adhesive layer claim 1 , and said second ...

SEMICONDUCTOR DEVICE

The present invention relates to a semiconductor device including: a first semiconductor element formed on an adherend; and an adhesive film for embedding the first semiconductor element, wherein the adhesive film satisfies a predetermined ratio between a melt viscosity and a weight loss ratio at a high temperature. 1. A semiconductor device comprising: a first semiconductor element; and an adhesive film for embedding the first semiconductor element , {'br': None, 'i': 'â', '1≤{MV/[(5)*10]}\u2003\u2003[General Formula 1]'}, 'wherein the adhesive film satisfies the following General Formula 1wherein, in General Formula 1, MV is a melt viscosity of the adhesive film measured at 125° C. by applying a shear rate of 5 rad/s and is a numerical value in a range of 200 Pa·s to 8000 Pa·s, anda is a weight loss ratio (%) measured by thermogravimetric analysis (TGA) after exposure of the adhesive film at 125° C. for 1 hour.2. The semiconductor device of claim 1 , {'br': None, 'i': 'a', '3≤{MV/[(̂5)*10]}\u2003\u2003[General Formula 2]'}, 'wherein the adhesive film satisfies the following General Formula 2wherein, in General Formula 2, MV and a are as described above in General Formula 1.3. The semiconductor device of claim 1 ,wherein in General Formula 1, a is 1.5% or less.4. The semiconductor device of claim 1 ,wherein a wire is connected to the first semiconductor element.5. The semiconductor device of claim 1 ,further comprising a second semiconductor element that is bonded to the first semiconductor element via the adhesive film.6. The semiconductor device of claim 1 ,further comprising an adherend that is bonded to the first semiconductor element by wire bonding or flip-chip bonding.7. The semiconductor device of claim 6 ,wherein the adherend is a circuit board or a lead frame.8. The semiconductor device of claim 1 ,wherein the adhesive film has a thickness of 10 μm to 200 μm.9. The semiconductor device of claim 1 ,wherein the adhesive film comprises: a thermoplastic ...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

The present invention relates to a semiconductor device including: a first semiconductor element fixed onto an adherend by flip-chip connection; an adhesive layer for embedding a space between the adherend and the first semiconductor element and embedding the first semiconductor element; and a second semiconductor element connected to the first semiconductor element via the adhesive layer, wherein the adhesive layer has a predetermined melt viscosity and thixotropic index. 1. A semiconductor device comprising: a first semiconductor element fixed onto an adherend by flip-chip connection;an adhesive layer for embedding a space between the adherend and the first semiconductor element and embedding the first semiconductor element; anda second semiconductor element connected to the first semiconductor element via the adhesive layer,wherein the adhesive layer has a melt viscosity of 10 to 10,000 Pa·s at a temperature of 110° C. and a shear rate of 5 rad/sec, andwherein a thixotropic index defined by a ratio of the melt viscosity of the adhesive layer at a shear rate of 0.5 rad/sec and a temperature of 110° C. to the melt viscosity of the adhesive layer at a shear rate of 5 rad/sec and a temperature of 110° C. is 1.5 to 7.5.2. The semiconductor device of claim 1 , whereinthe adhesive layer for embedding a space between the adherend and the first semiconductor element and embedding the first semiconductor element may be a continuous phase.3. The semiconductor device of claim 1 , whereinthe adhesive film includes a thermoplastic resin having a glass transition temperature of −10° C. to 30° C., two or more kinds of liquid epoxy resins having different viscosities, and a curing agent including a phenol resin.4. The semiconductor device of claim 3 , whereinthe two or more kinds of liquid epoxy resins having different viscosities include a low viscosity liquid epoxy resin having a melt viscosity of 1 mPa·s to 500 mPa·s at 25° C.5. The semiconductor device of claim 3 , whereinthe ...

EPOXY COMPOSITIONS

Epoxy resin compositions that include oligomeric phosphonates, carbodiimides, carbodiimides and phenolic antioxidants or phosphite antioxidants, oligomeric phosphonates and carbodiimides, or oligomeric phosphonates, carbodiimides, and phenolic antioxidants or phosphite antioxidants and exhibit improved glass transition temperature, improved heat resistance, and improved flame retardancy are described herein. 1. A composition comprising:an epoxy resin;one or more oligomeric phosphonates; andone or more carbodiimides.2. The composition of claim 1 , wherein the epoxy resin is selected from the group consisting of novolac-type epoxy resin claim 1 , cresol-novolac epoxy resin claim 1 , triphenolalkane-type epoxy resin claim 1 , aralkyl-type epoxy resin claim 1 , aralkyl-type epoxy resin having a biphenyl skeleton claim 1 , biphenyl-type epoxy resin claim 1 , dicyclopentadiene-type epoxy resin claim 1 , heterocyclic-type epoxy resin claim 1 , epoxy resin containing a naphthalene ring claim 1 , a bisphenol-A type epoxy compound claim 1 , a bisphenol-F type epoxy compound claim 1 , stilbene-type epoxy resin claim 1 , trimethylol-propane type epoxy resin claim 1 , terpene-modified epoxy resin claim 1 , linear aliphatic epoxy resin obtained by oxidizing olefin bonds with peracetic acid or a similar peracid claim 1 , alicyclic epoxy resin claim 1 , sulfur-containing epoxy resin claim 1 , phenolic novolac type epoxy containing benzoxazines such as bisphenol-A based benzoxazines claim 1 , bisphenol-F based benzoxazines claim 1 , dicyclopentadiene based benzoxazines claim 1 , phenolpthalein based benzoxazines claim 1 , polyphenol-A type benzoxazines and combinations thereof.3. The composition of claim 1 , wherein the one or more oligomeric phosphonates are selected from the group consisting of linear oligomeric phosphonates claim 1 , branched oligomeric phosphonates claim 1 , and hyperbranched oligomeric phosphonates.4. The composition of claim 1 , wherein the one or more ...

CURABLE COMPOSITION, ADHESIVE, METHOD OF PRODUCING FIBER-REINFORCED COMPOSITE MATERIAL, AND FIBER-REINFORCED COMPOSITE MATERIAL

A curable composition obtained by blending a polymerizable compound (A) having predetermined types of polymerizable functional groups, a reactive compound (B) having predetermined types of reactive functional groups, a compound (C) which is an imidazolyl group-containing compound having a predetermined structure, and a compound (D) which is an oxime compound or an oxime ester compound having a predetermined structure. 2. The curable composition according to claim 1 ,wherein the reactive compound (B) contains the compound (B1) having one or more functional groups selected from a hydroxyl group and a carboxyl group, andthe compound (B1) having one or more functional groups selected from a hydroxyl group and a carboxyl group further contains a (meth)acryloyl group.3. The curable composition according to claim 1 , wherein the epoxy compound (A) is an aliphatic epoxy compound.4. The curable composition according to claim 2 , wherein the epoxy compound (A) is an aliphatic epoxy compound.5. An adhesive which is formed from the curable composition according to .6. A method of producing a fiber-reinforced composite material claim 1 , comprising curing the curable composition according to claim 1 , which is impregnated into reinforced fibers claim 1 , by heating.7. A fiber-reinforced composite material comprising:{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'a matrix formed of a cured material of the curable composition according to ; and'}reinforced fibers. This application claims priority to Japanese Patent Application No. 2014-045668, filed Mar. 7, 2014; and Japanese Patent Application No. 2014-189390, filed Sep. 17, 2014, the contents of which are incorporated herein by reference.1. Field of the InventionThe present invention relates to a curable composition that contains a polymerizable compound (A) having predetermined kinds of polymerizable functional groups and a reactive compound (B) having predetermined kinds of reactive functional groups; an adhesive formed of ...

CURABLE EPOXIDE COMPOSITION

An object of the present invention is to provide a composite material including an epoxide resin, having an improved strength. The object can be solved by a curable epoxide composition comprising an epoxide compound; a carbon fiber; a curing agent; and phosphite ester or phosphate ester. According to the present invention, a strength of the curable epoxide composition comprising a carbon fiber can be improved. 1. An adhesive comprising a curable epoxide composition , wherein the curable epoxide composition comprises an epoxide compound; a carbon fiber; a curing agent;and phosphite ester or phosphate ester.2. The adhesive according to claim 1 , wherein an average fiber length of the carbon fiber is 20 μm to 1 mm.3. The adhesive according to claim 1 , wherein an amount of phosphite ester or phosphate ester is 2 to 40% by weight.4. The adhesive according to claim 1 , wherein the curable epoxide composition further comprises a humed silica and/or a rheological agent.5. A molded body comprising a curable epoxide composition claim 1 , wherein the curable epoxide composition comprises an epoxide compound; a carbon fiber; a curing agent; and phosphite ester or phosphate ester.6. The molded body according to claim 5 , wherein an average fiber length of the carbon fiber is 20 μm to 1 mm.7. The molded body according to claim 5 , wherein an amount of phosphite ester or phosphate ester is 2 to 40% by weight.8. The molded body according to claim 5 , wherein the curable epoxide composition further comprises a humed silica and/or a rheological agent. The present invention relates to a curable epoxide composition. According to the present invention, a strength of the curable epoxide composition comprising a carbon fiber can be improved.Carbon fiber has excellent properties such as high strength, high elastic modulus, and high conductivity, and is used in various composite materials. As a matrix resin to be composited with the carbon fiber, there may be mentioned thermosetting resins ...

FIBER REINFORCED HIGH MODULUS POLYMER COMPOSITE WITH A REINFORCED INTERPHASE

A fiber reinforced polymer composition is disclosed comprising a reinforcing fiber and an adhesive composition, wherein the adhesive composition comprises at least a thermosetting resin, a curing agent, and an interfacial material, the fiber is suitable for concentrating the interfacial material in an interfacial region between the fiber and the adhesive composition upon curing of the adhesive composition, and the cured adhesive has a resin modulus of at least 4.0 GPa. Also provided is a prepreg comprising the fiber reinforced polymer composition and a method of manufacturing a composite article by curing the reinforced polymer composition. The resulting interfacial region, viz., the reinforced interphase, is reinforced by one or more layers of the interfacial material such that substantial improvements in tensile, compression and fracture toughness may be observed. 1. A fiber reinforced polymer composition comprising a reinforcing fiber and an adhesive composition , wherein the adhesive composition comprises at least a thermosetting resin , a curing agent and an interfacial material , the adhesive composition when cured has a resin modulus of at least about 4.0 GPa and forms good bonds to the reinforcing fiber , the reinforcing fiber is suitable for concentrating the interfacial material in an interfacial region between the reinforcing fiber and the adhesive composition , and the interfacial region comprises at least the interfacial material.2. The fiber reinforced polymer composition of claim 1 , wherein the cured adhesive composition has a resin modulus of at least about 4.0 GPa and a resin flexural deflection of at least 3 mm claim 1 , the interfacial material is concentrated in-situ in the interfacial region during curing of the thermosetting resin such that the interfacial material has a gradient in concentration in the interfacial region.3. The fiber reinforced polymer composition of claim 2 , additionally comprising a migrating agent.4. The fiber reinforced ...

A CURABLE EPOXY RESIN COMPOSITION

A curable epoxy resin composition, upon curing, has a clarity value of at least 30% and provides improved impact strength while maintaining glass transition temperature; and a process of preparing the curable epoxy resin composition. 2. The curable epoxy resin composition of claim 1 , wherein the curing agent is selected from an anhydride compound claim 1 , a polyoxyalkylene polyamine claim 1 , a cycloaliphatic polyamine claim 1 , or mixtures thereof.3. The curable epoxy resin composition of claim 1 , wherein the curing agent is selected from a polyoxypropylenediamine claim 1 , isophorondiamine; 1 claim 1 ,3-cyclohexanebis(methylamine); 4 claim 1 ,4′-methylenebis (cyclohexylamine); 1 claim 1 ,2-diaminocyclohexane; 4 claim 1 ,4′-dianinodicyclohexylmethane; or mixtures thereof.4. The curable epoxy resin composition of claim 1 , wherein the curing agent is selected from nadic maleic anhydride; methyltetrahydrophthalic anhydride; methylhexahydrophthalic anhydride; methyl-(endo)-5-norbornene-2 claim 1 ,3-dicarboxylic anhydride; hexahydrophthalic anhydride; tetrahydrophthalic anhydride; pyromellitic dianhydride; ciscyclopentanetetracarboxylic acid dianhydride; hemimellitic anhydride; trimellitic anhydride; naphthalene-1 claim 1 ,8-dicarboxylic acid anhydride; phthalic anhydride; dichloromaleic anhydride; dodecenylsuccinic anhydride; glutaric anhydride; maleic anhydride; succinic anhydride; or mixtures thereof.5. The curable epoxy resin composition of claim 1 , further comprising a curing catalyst.6. The curable epoxy resin composition of claim 5 , wherein the curing catalyst is present in an amount of from 0.1 to 1 wt % claim 5 , based on the total weight of the epoxy resin composition.7. The curable epoxy resin composition of claim 1 , wherein the at least one anhydride-reactive group of the amphiphilic block copolymer comprises at least one hydroxyl functional group.8. The curable epoxy resin composition of claim 1 , wherein the epoxy resin miscible block segment ...

Use of epoxy film adhesive with high ink compatibility and thermal oxidative stability for printhead interstitial bonding in high density printheads

An adhesive compound can include an uncured epoxy film having a curing temperature between about 80° C. and about 300° C. The uncured epoxy film can include a cresol novolac epoxy resin and a bisphenol A epoxy resin. The uncured epoxy film can have a thickness between about 0.1 mil and about 5 mil.

ADHESIVE COMPOSITION FOR SEMICONDUCTOR CIRCUIT CONNECTION, ADHESIVE FILM FOR SEMICONDUCTOR, METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PACKAGE USING THE SAME

The present disclosure relates to a resin composition for semiconductor adhesion comprising: a thermoplastic resin; a thermosetting resin; a curing agent; and a curing catalyst compound having a specific structure, and an adhesive film for semiconductor, a method for manufacturing a semiconductor package, and a semiconductor package using the same. 2. The resin composition for semiconductor adhesion of claim 1 ,{'sub': '5', 'wherein Rin the Chemical Formula 2 is hydrogen, a hydroxy group, or an alkoxy group having 1 to 10 carbon atoms.'}3. The resin composition for semiconductor adhesion of claim 1 ,wherein the electron withdrawing functional group is a functional group represented by the Chemical Formula 2, a halogen group, a haloalkyl group having 1 to 10 carbon atoms, a nitro group, a cyano group, a sulfonyl group, or a sulfonic acid group.4. The resin composition for semiconductor adhesion of claim 1 ,{'sub': 3', '4, 'wherein one of Rand Rin the Chemical Formula 1 is an electron withdrawing functional group, and the other one is hydrogen, an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 30 carbon atoms, or an alkoxy group having 1 to 10 carbon atoms.'}6. The resin composition for semiconductor adhesion of claim 5 ,{'sub': 8', '9, 'wherein one of Rand Rin the Chemical Formula 3 is a nitro group, and the other one is hydrogen, an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 30 carbon atoms, or an alkoxy group having 1 to 10 carbon atoms.'}8. The resin composition for semiconductor adhesion of claim 1 ,wherein the curing catalyst is reacted with at least one of the thermoplastic resin; the thermosetting resin; and the curing agent at a temperature of 200° C. or higher.9. The resin composition for semiconductor adhesion of claim 1 , comprising 0.05 parts by weight or more and 15 parts by weight or less of the curing catalyst based on 100 parts by weight of the resin composition for semiconductor adhesion.10. The resin ...

High Tg Epoxy Formulation with Good Thermal Properties

Varnish compositions and prepregs and laminates made therefrom wherein the varnish compositions include at least one first epoxy resin and at least one second epoxy resin that includes a bisphenol-A novolac epoxy resin and a harder wherein the at least one first epoxy resin and the at least one second bisphenol-A novolac epoxy resin are present in the varnish at a weight ratio ranging from about 1:1 to about 1:3. 140-. (canceled)41. A prepreg comprising a b-staged varnish composition including:a multi-functional epoxy wherein the multi-functional resin is not an eight-functional bisphenol-A novolac epoxy resin;an eight-functional bisphenol-A novolac epoxy resin;a bifunctional epoxy resin;a hardener selected from 4,4′-diaminodiphenylsulfone, 3,3′-diaminodiphenylsulfone and mixtures thereof; anda flame retardant wherein the prepreg is capable of being c-staged to a composite having a DMA Tg in excess of 280° C. and a T288 time in excess of 20 minutes42. The prepreg of wherein the b-staged varnish includes 30-60 parts by weight of the multi-functional epoxy.43. The prepreg of wherein the b-staged varnish includes 80-150 parts by weight of the eight-functional bisphenol-A novolac epoxy resin.44. The prepreg of wherein the b-staged resin includes from 30-60 parts by weight of the bifunctional epoxy resin.45. The prepreg of wherein the b-staged resin includes from 20-50 parts by weight of the hardener selected from 4 claim 41 ,4′-diaminodiphenylsulfone claim 41 , 3 claim 41 ,3′-diaminodiphenylsulfone and mixtures thereof.46. The prepreg of wherein the b-staged resin includes from 10-70 parts by weight of the flame retardant.47. The prepreg of wherein the b-staged resin includes from greater than 0 to 50 parts by weight of a filler.48. The prepreg of wherein the b-staged resin includes from greater than 0 to 5 parts by weight of a rubber.49. The prepreg of wherein the hardener is 4 claim 41 ,4′-diaminophenylsulfone.50. The prepreg of wherein the at least one flame ...

ONE-COMPONENT ADHESIVE COMPOSITIONS

One-component (1K) adhesive compositions (“PEEP” compositions) and a process for making them are disclosed. A polyepoxide is reacted with a polyether polyol composition, a polyester polyol composition, or both in the presence of a heat-activated Lewis acid catalyst at a temperature within the range of 100° C. to 220° C. for a time effective to cure the adhesive. The compositions are storage-stable under ambient conditions. Compared with conventional epoxy compositions, the 1K PEEP compositions offer improved room temperature lap shear strength, better resilience, and higher elongation. The 1K PEEP systems deliver a desirable balance of physical and mechanical properties while avoiding polyisocyanates and polyamine crosslinkers. 1. A process for making a one-component (1K) adhesive , the process comprising reacting a mixture which comprises:(a) a polyepoxide compound having an equivalent weight within the range of 125 to 250 g/eq.;(b) a composition comprising:(i) a polyester polyol having a hydroxyl value within the range of 50 to 400 mg KOH/g, an average hydroxyl functionality within the range of 1.5 to 4.0, and an acid number less than 5 mg KOH/g; or(ii) a polyether polyol having a hydroxyl value within the range of 28 to 800 mg KOH/g and an average hydroxyl functionality within the range of 2.7 to 8.0; or(iii) a combination of (i) and (ii);and(c) a heat-activated Lewis acid catalyst;at a temperature within the range of 100° C. to 220° C. for a time effective to cure the adhesive.2. The process of wherein the ratio of epoxy equivalents of the polyepoxide compound to hydroxyl equivalents of the polyol composition is within the range of 1:1 to 6:1.3. The process of wherein the adhesive has a glass-transition temperature as measured by differential scanning calorimetry within the range of −20° C. to 80° C.4. The process of wherein the polyepoxide compound is an aromatic polyepoxide.5. The process of wherein the aromatic polyepoxide is a reaction product of a bisphenol ...

Adhesive composition and foamable adhesive sheet

An adhesive composition including an epoxy resin, an acrylic resin compatibilized with the epoxy resin, a curing agent, and a foaming agent, wherein, as the epoxy resin, the adhesive composition includes a first epoxy resin with a softening temperature of 50° C. or more and an epoxy equivalent of 5000 g/eq or less, and a second epoxy resin with a softening temperature higher than the first epoxy resin and a weight-average molecular weight of 20,000 or more, and a weight-average molecular weight of the acrylic resin is 50,000 or more.

UV-CURABLE ADHESIVE TAPE AND METHOD FOR JACKETING ELONGATED ITEMS, ESPECIALLY LEADS

The present disclosure relates to an adhesive tape and to a method for jacketing an elongated item, more particularly cable sets. The adhesive tape comprises a tapelike carrier provided on at least one side with an adhesive layer which consists of a self-adhesive, pressure-sensitive adhesive, characterized in that the self-adhesive pressure-sensitive adhesive is a UV-curable composition comprising, based on the total weight of the composition: 15 to 50 parts by weight of matrix polymer; 50 to 85 parts by weight of epoxy resin; 0.1 to 3 parts by weight of photoinitiator, with the matrix polymer forming a self-supporting film in which epoxy resin and photoinitiator are embedded. 1. An adhesive tape for jacketing elongated items , comprising a tapelike carrier provided on at least one side with an adhesive layer which consists of a self-adhesive , pressure-sensitive adhesive , wherein the self-adhesive pressure-sensitive adhesive is a UV-curable composition comprising , based on a total weight of the composition:15 to 50 parts by weight of matrix polymer;50 to 85 parts by weight of epoxy resin; and0.1 to 3 parts by weight of photoinitiator, with the matrix polymer forming a self-supporting film in which epoxy resin and photoinitiator are embedded.2. Adhesive tape according to claim 1 , wherein the UV-curable composition claim 1 , based on its total weight claim 1 , comprises 20-40 parts by weight of matrix polymer.3. Adhesive tape according to claim 1 , wherein the UV-curable composition claim 1 , based on its total weight claim 1 , comprises 60 to 75 parts by weight of epoxy resin.4. Adhesive tape according to claim 1 , wherein the matrix polymer is selected from the group consisting of styrene copolymers claim 1 , acrylate copolymers claim 1 , methacrylate copolymers claim 1 , thermoplastic polyurethanes claim 1 , copolyesters claim 1 , copolyamides and ethylene-vinyl acetate copolymers and mixtures thereof.5. Adhesive tape according to claim 1 , wherein the epoxy ...

THERMOSETTING EPOXY RESIN COMPOSITION HAVING LOW CURING TEMPERATURE AND GOOD STORAGE STABILITY

A thermosetting epoxy resin composition including, as curing agent, a dihydrazide selected from the group consisting of glutaric dihydrazide, adipic dihydrazide and pimelic dihydrazide, in combination with a specific urea accelerator, which features good storage stability and a low curing temperature. The epoxy resin composition is especially suitable for use as bodywork adhesive. 2. The thermosetting epoxy resin composition as claimed in claim 1 , wherein Ris H claim 1 , and Rand Rare each a methyl claim 1 , ethyl or propyl group claim 1 , and n=1.4. The thermosetting epoxy resin composition as claimed in claim 1 , wherein the ratio of the proportion of epoxy groups of the epoxy resin A in mol/proportion of dihydrazide in mol is 3-5.5. The thermosetting epoxy resin composition as claimed in claim 1 , wherein the dihydrazide has a median particle size Dof ≤100 μm.6. The thermosetting epoxy resin composition as claimed in claim 1 , wherein the thermosetting epoxy resin composition includes less than 0.5% by weight claim 1 , based on the total weight of the epoxy resin composition claim 1 , of dicyandiamide.7. The thermosetting epoxy resin composition as claimed in claim 1 , wherein the ratio of the proportion of accelerator C in grams per mole of epoxy groups of the epoxy resin A is 0.01-0.5 g/mol of epoxy groups.8. The thermosetting epoxy resin composition as claimed in claim 1 , wherein the thermosetting epoxy resin composition additionally includes at least one toughness improver D selected from the group consisting of terminally blocked polyurethane polymers D1 claim 1 , liquid rubbers D2 and core-shell polymers D3.9. The thermosetting epoxy resin composition as claimed in claim 1 , wherein the proportion of the epoxy resin A is 10-60% by weight claim 1 , based on the total weight of the epoxy resin composition.10. The thermosetting epoxy resin composition as claimed in claim 1 , wherein the epoxy resin composition has a viscosity at 25° C. of 500-3000 Pa*s.11. ...

PHENOLIC-HYDROXYL-CONTAINING RESIN, EPOXY RESIN, CURABLE RESIN COMPOSITION, SUBSTANCE OBTAINED BY CURING SAME, AND SEMICONDUCTOR SEALANT

Provided are a phenolic-hydroxyl containing resin, an epoxy resin, and a curable resin composition containing either resin that have high flowability and exhibit high heat resistance and flame retardancy after curing, a cured composition formed therefrom, and a sealant. A phenolic-hydroxyl containing resin is prepared by reacting a polycondensate of a phenolic compound (a) and formaldehyde with an aralkylating agent. The phenolic-hydroxyl containing resin contains as essential components a monoaralkylated derivative (x1) of the phenolic compound (a) having one aralkyl group on an aromatic nucleus thereof and a diaralkylated derivative (x2) of the phenolic compound (a) having two aralkyl groups on an aromatic nucleus thereof. An epoxy resin is prepared by converting the phenolic-hydroxyl containing resin into a polyglycidyl ether. 3. (canceled)4. The phenolic-hydroxyl containing resin according to claim 2 , wherein a difunctional derivative (y1) represented by structural formula (3) wherein n is 0 is present in an amount of 5% to 30% of the total amount of phenolic-hydroxyl containing resin in terms of area percentage as determined by GPC.5. The phenolic-hydroxyl containing resin according to claim 1 , wherein the phenolic-hydroxyl containing resin has a melting point of 40° C. to 90° C. and a melt viscosity at 150° C. of 0.01 to 10.0 dPa·s.6. A curable resin composition comprising the phenolic-hydroxyl containing resin according to and a curing agent.7. (canceled)10. The epoxy resin according to claim 9 , wherein a difunctional derivative (w1) represented by structural formula (6) wherein n is 0 is present in an amount of 5% to 30% of the total amount of epoxy resin in terms of area percentage as determined by GPC.11. The epoxy resin according to claim 8 , wherein the epoxy resin has a melting point of 40° C. to 80° C. and a melt viscosity at 150° C. of 0.01 to 10.0 dPa·s.12. A curable resin composition comprising the epoxy resin according to and a curing agent.13. ...

SOLID POLYMERIC ADHESIVE COMPOSITIONS HAVING HIGH USE TEMPERATURE, AND ARTICLES AND METHODS THEREOF

The teachings herein are directed at solid polymeric adhesive compositions for adhering metal components, methods for compounding the polymeric adhesive compositions, articles including a component having the polymeric adhesive composition, methods for producing articles including curing a solid adhesive, and articles including the cured adhesive. Preferred solid polymeric adhesive compositions include a plurality of one or more epoxy resins and one or more polysulfones. In one preferred aspect, the teachings are directed at a stator ring (e.g., for a hybrid motor) including the polymeric adhesive composition for adhering components to a ring. 1. A device comprising:i) a first substrate;ii) one or more second substrates attached to the first substrate by:iii) a polymeric adhesive component formed from a polymeric adhesive composition including a blend of one or more solid epoxy resins and one or more high temperature thermoplastic polymers having a glass transition thermoplastic polymers having a glass transition temperature of about 175° C. or more.2. The device of claim 1 , wherein the polymeric adhesive composition comprises:i) about 25 to about 85 weight percent of one or more epoxy resins, based on the total weight of the polymeric adhesive composition;ii) about 7 to about 45 weight percent of one or more high temperature thermoplastic polymers (based on the total weight of the polymeric adhesive composition) having a glass transition temperature of about 175° C. or more;iii) about 0.5 to about 20 weight percent of one or more impact modifiers, wherein the impact modifiers including an elastomeric polymer core of a core/shell polymer;iv) one or more curatives for curing the epoxy resin(s) in an amount from about 0.4 to about 15 weight percent, based on the total weight of the polymeric adhesive composition; andv) optionally up to 40 weight percent of one or more fillers; andvi) optionally up to about 7 weight percent of one or more blowing agents;wherein the ...

ADHESIVE, ADHESIVE-BACKED MEMBER, AND METHOD FOR CONNECTING BETWEEN MEMBERS

A method for joining between members, the method comprising: forming an adhesive layer by applying onto a first member surface a liquid composition containing a thermosetting resin not having a radiation-polymerizable functional group, a hardener, a first polymerizable compound having a radiation-polymerizable functional group and a heat-curable functional group, a second polymerizable compound having a radiation-polymerizable functional group and not having a heat-curable functional group, and a thermally expanding capsule; semi-solidifying the adhesive layer by irradiating radiation onto the adhesive layer; disposing a second member above the semi-solidified adhesive layer so as to oppose the first member surface; and joining the first member and the second member by heating to expand and solidify the semi-solidified adhesive layer. 1. A method for joining between members , comprising:forming an adhesive layer by applying onto a first member surface a liquid composition containing a thermosetting resin not having a radiation-polymerizable functional group, a hardener, a first polymerizable compound having a radiation-polymerizable functional group and a heat-curable functional group, a second polymerizable compound having a radiation-polymerizable functional group and not having a heat-curable functional group, and a thermally expanding capsule;semi-solidifying the adhesive layer by irradiating radiation onto the adhesive layer;disposing a second member above the semi-solidified adhesive layer so as to oppose the first member surface; andjoining the first member and the second member by heating to expand and solidify the semi-solidified adhesive layer.2. The method according to claim 1 , wherein a shear storage modulus of the semi-solidified adhesive layer is not less than 100 and kPa at 25° C. and 1 Hz.3. The method according to claim 1 , wherein the thermosetting resin is an epoxy resin or a cyanate ester resin.4. An adhesive used to fill a gap claim 1 , ...

RESIN COMPOSITION, BONDED BODY AND SEMICONDUCTOR DEVICE

A resin composition is provided, including a binder resin, and silver-coated particles in which a functional group is introduced to a surface. A ratio (a/b) of Young's modulus (a) of the silver-coated particles to Young's modulus (b) of the binder resin after being cured is 0.1 to 2.0, and the Young's modulus (a) of the silver-coated particles is 0.05 to 2.0 GPa. 1. A resin composition , comprising:a binder resin; andsilver-coated particles in which a functional group is introduced to a surface,wherein a ratio (a/b) of Young's modulus (a) of the silver-coated particles to Young's modulus (b) of the binder resin after being cured is 0.1 to 2.0, andthe Young's modulus (a) of the silver-coated particles is 0.05 to 2.0 GPa.2. The resin composition according to claim 1 ,wherein the ratio (a/b) of the Young's modulus (a) of the silver-coated particles to the Young's modulus (b) of the binder resin after being cured is 0.4 to 2.0, andthe Young's modulus (a) of the silver-coated particles is 0.2 to 2.0 GPa.3. The resin composition according to claim 1 ,wherein the functional group is selected from the group consisting of an epoxy group, a carboxyl group, a carbonyl group, an amino group, an amide group, an imino group, an imidazole group, and a mercapto group.4. A bonded body claim 1 , comprising:a first member and a second member bonded to each other,{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'wherein the resin composition according to is interposed between the first member and the second member.'}5. A semiconductor device claim 1 , comprising:an insulating circuit substrate in which a circuit layer is disposed on one surface of an insulating layer; anda semiconductor element bonded to a surface of the circuit layer, said surface being opposite the insulating layer,{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'wherein the resin composition according to is interposed between the circuit layer and the semiconductor element.'}6. The resin composition according to ...

CURABLE RESIN COMPOSITION

A liquid thermally expandable curable resin composition for use such as bonding by tilling a clearance has difficulty in achieving both drying property and film forming property and also has a problem with storage stability. The problems were solved with a curable resin composition having the following composition. A curable resin composition comprises: (A) a film forming resin, (B) an epoxy resin, (C) an organic solvent, (D) thermally expandable particles, and (E) a curing agent ingredient for the (B). The (C) is selected from organic solvents having a boiling point of 100° C. or less and being liquid at normal temperature and contains a combination of (C-1) an ester-based solvent and (C-2) one or more solvents selected from ketone-based solvents, ether-based solvents, and glycol-based solvents, and a content ratio between the (C-1) and the (C-2) in a mass ratio is in a range of (C-1)/(C-2)=0.12 to 0.23. 1. A curable resin composition comprising:(A) a film forming resin,(B) an epoxy resin,(C) an organic solvent,(D) thermally expandable particles, and(E) a curing agent ingredient for the (B), whereinthe (C) is selected from organic solvents having a boiling point of 100° C. or less and being liquid at normal temperature and contains a combination of (C-1) an ester-based solvent and (C-2) one or more solvents selected from ketone-based solvents, ether-based solvents, and glycol-based solvents, and a content ratio between the (C-1) and the (C-2) in a mass ratio is in a range of (C-1)/(C-2)=0.12 to 0.23.2. The curable resin composition according to claim 1 , whereina content of the (C) is 193 to 211 parts by mass relative to 100 parts by mass of the (A).3. The curable resin composition according to claim 1 , whereina content of the (D) is 45 to 88 parts by mass relative to 100 parts by mass of the (A).4. The curable resin composition according to claim 1 , whereinthe (A) contains a phenoxy resin.5. The curable resin composition according to claim 1 , whereinthe (E) ...

ADHESIVE SHEET, MANUFACTURING METHOD THEREFOR, AND LAMINATE

An adhesive sheet includes an adhesive composition layer. The adhesive composition layer is formed using a composition including a polythiol compound, a compound having plural epoxy groups, a radical generator and an amine-based catalyst. The ratio (Ep/SH (epoxy groups/thiol groups ratio)) of a total molar number (Ep) of epoxy groups contained in the compound having plural epoxy groups to a total molar number (SH) of thiol groups contained in the polythiol compound is higher than 0.20 but lower than 1.00. 1. An adhesive sheet , the adhesive sheet comprising an adhesive composition layer , a polythiol compound;', 'a compound having plural epoxy groups;', 'a radical generator; and', 'an amine-based catalyst,', 'wherein a ratio (Ep/SH (epoxy groups/thiol groups ratio)) of a total molar number (Ep) of epoxy groups contained in the compound having plural epoxy groups to a total molar number (SH) of thiol groups contained in the polythiol compound is higher than 0.20 but lower than 1.00., 'the adhesive composition layer being formed using a composition including2. The adhesive sheet according to claim 1 , wherein the radical generator is a thermal radical generator comprising a peroxide.3. The adhesive sheet according to claim 1 , wherein the polythiol compound is a primary thiol.4. The adhesive sheet according to claim 1 , wherein the compound having plural epoxy groups includes two or more aromatic rings or three or more aliphatic rings.5. The adhesive sheet according to claim 1 , wherein the polythiol compound has three or more thiol groups in a molecule thereof.6. The adhesive sheet according to claim 1 , wherein a molecular weight of the polythiol compound is from 200 to 3000.7. The adhesive sheet according to claim 1 , wherein the polythiol compound is selected from the group consisting of: a polythiol in which a portion other than thiol groups is an aliphatic hydrocarbon; a polythiol that is obtained by replacing halogen atoms of a halohydrin adduct of an alcohol ...

Phosphorus-containing compounds useful for making halogen-free, ignition-resistant polymers

A process for making a phosphorus-containing compound is disclosed. The process comprises contacting a compound of formula (A) wherein R A and R B are selected from optionally substituted aryl, aryloxy, alkyl and alkoxy groups or can be combined to form cyclic structures; and R C is methyl, ethyl, isopropyl, n-butyl, i-butyl, t-butyl, phenyl or benzyl; and a compound of formula (B) wherein R 1 -R 4 are selected from optionally substituted aryl, aryloxy, alkyl and alkoxy groups. The phosphorus-containing compound can then be used as a flame retardants for polymers, especially for epoxy, polyurethane, thermosetting resins and thermoplastic polymers. Such flame retardant-containing polymers can be used to make protective coating formulations and ignition-resistant fabricated articles, such as electrical laminates, polyurethane foams, and various molded and/or foamed thermoplastic products.

ADHESIVE FOR RUBBER BONDING

Films comprising a resin matrix, an entanglement polymer, and a latent curative, wherein the resin has a functionality of at least 2.0 and a viscosity of at least 0.1 Pascal-seconds, and the film is dimensionally stable at 25° C. The films are particularly useful for the bonding of elastomers to rigid substrates, such as rubber to metal, and contain no volatile organic compounds (VOCs), and are shelf stable for extended periods of time. 1. A film composition comprising a resin matrix , an entanglement polymer , and a latent curative , wherein the resin has a functionality of at least 2.0 and a viscosity of at least 0.1 Pascal-seconds , and the film is dimensionally stable at 25° C.2. The film of claim 1 , wherein the resin matrix comprises a mixture of a first resin and a second resin having different molecular weights.3. The film of claim 2 , wherein the first resin comprises a molecular weight of less than about 500 Daltons.4. The film of claim 2 , wherein the second resin comprises a molecular weight of about 400 to about 4000 Daltons.5. The film of claim 2 , wherein the first resin comprises between 40 and 60 weight percent claim 2 , and the second resin comprises between 60 and 40 weight percent based on the total weight of the resin matrix.6. The film of claim 1 , wherein the resin matrix comprises at least one of a phenolic resin claim 1 , an acrylic resin claim 1 , or an epoxy resin and is liquid at 25° C.7. The film of claim 1 , wherein the resin matrix comprises an epoxy-functional resin.8. The film of claim 1 , wherein the resin matrix comprises an epoxy novolac claim 1 , a tris-(hydroxyl phenyl) methane-based epoxy resin.9. The film of claim 1 , wherein the entanglement polymer comprises a high molecular weight polymer with a number average molecular weight of at least 15 claim 1 ,000 Daltons.10. The film of claim 9 , wherein the molecular weight of the entanglement polymer is at least 100 claim 9 ,000 Daltons.11. The film of claim 1 , wherein the ...

NOVEL NOVOLAC CURING AGENT WITH ALKOXYSILYL GROUP, METHOD FOR PREPARING THE SAME, COMPOSITION CONTAINING THE SAME, THE CURED PRODUCT, AND USE THEREOF

A new novolac curing agent with an alkoxysilyl group exhibiting excellent heat resistance such as a low CTE and an high Tg when a composite is formed, a preparing method of the same, a composition including the same, a cured article, and an use thereof, are provided. The new novolac curing agent having an alkoxysilyl group of Formulae I-1 to I-4, a preparing method of the new novolac curing agent by alkenylation and alkoxysilylation of the novolac curing agent, a preparing method of the new novolac curing agent by alkoxysilylation of a novolac curing agent, a composition including a novolac curing agent having an alkoxysilyl group of Formulae I-1 to I-4, a cured article and a use thereof, are provided. A composite including a novel novolac curing agent having an alkoxysilyl group exhibits a low CTE and a high glass transition temperature. 36-. (canceled)89-. (canceled)1112-. (canceled)13. The composition of claim 10 , wherein the epoxy resin does or does not include an alkoxysilyl group.14. The composition of claim 10 , further comprising at least one selected from the group consisting of inorganic particles and and a fiber claim 10 , as a filler.15. The composition of claim 14 , wherein the inorganic particles are at least one selected from the group consisting of silica claim 14 , zirconia claim 14 , titania claim 14 , alumina claim 14 , silicon nitride claim 14 , aluminum nitride claim 14 , and silsesquioxane.1618-. (canceled)19. The composition of claim 14 , wherein the fiber is at least one selected from the group consisting of a glass fiber selected from the group consisting of an E-glass fiber claim 14 , a T-glass fiber claim 14 , an S-glass fiber claim 14 , an NE-glass fiber claim 14 , an H-glass fiber claim 14 , and quartz; and an organic fiber selected from the group consisting of a liquid crystal polyester fiber claim 14 , a polyethyleneterephthalate fiber claim 14 , a wholly aromatic fiber claim 14 , a polybenzoxazole fiber claim 14 , a nylon fiber claim ...

ADHESIVE TAPE FEATURING ADHESIVE WITH CONTINUOUS POLYMER PHASE

An adhesive tape containing an adhesive comprising 2. Adhesive tape according to claim 1 , wherein the adhesive comprises at least 120 parts of reactive resin per 100 parts of polymer.3. Adhesive tape according to claim 1 , wherein at least one epoxy resin is present as reactive resin.4. Adhesive tape according to claim 3 , wherein said at least one epoxy resin is based on bisphenol A claim 3 , bisphenol S claim 3 , bisphenol F claim 3 , an epoxy novolak claim 3 , an epoxy-cresol novolak or an epoxidized nitrile rubber.5. Adhesive tape according to claim 1 , wherein the at least one polymer is an elastomer or a thermoplastic.6. Adhesive tape according to claim 1 , wherein the at least one polymer together with the optional tackifier resin is per se not pressure-sensitively adhesive.7. Adhesive tape according to claim 1 , wherein the at least one reactive resin is present at least partly in homogeneous solution in the continuous polymer phase.8. Adhesive tape according to claim 1 , wherein said at least one polymer is selected from the group consisting of polyurethanes claim 1 , nitrile-butadiene rubbers claim 1 , polyamides claim 1 , poly(etheretherketone) (PEEK) claim 1 , poly(sulphone) (PSU) claim 1 , and poly(ethersulphone) (PES).9. Adhesive tape according to claim 1 , wherein the short-term temperature resistance of the uncured adhesive tape is greater than 35° C.10. Adhesive tape according to claim 1 , wherein at least one of the at least one reactive resin is a solid having a softening temperature of at least 45° C. or has a viscosity at 25° C. of at least 20 Pa s.11. Adhesive tape according to claim 3 , wherein at least one of the at least one epoxy resin has on average more than two epoxide groups per molecule.12. Adhesive tape according to claim 1 , wherein the peel adhesion of the uncured pressure sensitive adhesive on steel is at least 1 N/cm.13. Adhesive tape according to claim 1 , wherein the bond strength claim 1 , measured by dynamic shearing test ...

ADHESIVE SHEET

Problem: To provide an adhesive sheet having excellent workability while also maintaining sufficient foaming characteristics. 1. An adhesive sheet comprising:an adhesive layer consisting of an adhesive composition containing a thermosetting resin; anda coating layer comprising a resin and provided on the adhesive layer;characterized in that the coating layer does not exhibit tackiness at room temperature; andat least a part of the coating layer disappears in a region ranging from an interface between the adhesive layer and the coating layer to a surface of the coating layer by heating the adhesive sheet at a temperature not lower than a curing starting temperature of the adhesive layer.2. The adhesive sheet according to claim 1 , characterized in that the adhesive composition comprises a thermal foaming agent and a thermosetting resin having a softening temperature of not higher than 105° C.3. The adhesive sheet according to claim 2 , characterized in that:an equation T3 Подробнее

USE OF EPOXY FILM ADHESIVE WITH HIGH INK COMPATIBILITY AND THERMAL OXIDATIVE STABILITY FOR PRINTHEAD INTERSTITIAL BONDING IN IN HIGH DENSITY PRINTHEADS

An adhesive compound can include an uncured epoxy film having a curing temperature between about 80° C. and about 300° C. The uncured epoxy film can include a cresol novolac resin and a bisphenol A epoxy resin. The uncured epoxy film can have a thickness between about 0.1 mil and about 5 mil. 1. An adhesive compound , comprising: a cresol novolac resin, and', 'at least one bisphenol A epoxy resin, 'an uncured epoxy film having a curing temperature between about 80° C. and about 300° C., the uncured epoxy film comprising'}wherein the uncured epoxy film comprises a thickness between about 0.1 mil and about 5 mil.5. The adhesive compound of claim 1 , wherein the uncured epoxy film further comprises a filler material comprising a plurality of particles claim 1 , wherein a maximum dimension of each of the plurality of particles is 1.0 μm or less.6. The adhesive compound of claim 5 , wherein the filler material comprises one or more of calcium carbonate claim 5 , silica claim 5 , alumina claim 5 , alumina trihydrate claim 5 , barium sulfate claim 5 , titania claim 5 , and kaolin clay.7. The adhesive compound of claim 1 , wherein the thickness is between about 0.1 mil and about 2 mil.8. The adhesive compound of claim 1 , wherein the uncured epoxy film claim 1 , when cured claim 1 , comprises an adhesive epoxy with a storage modulus between about 100 megapascals (MPa) and about 3000 MPa at a temperature of 20° C. and between about 3 MPa and about 1500 MPa at a temperature of 120° C.9. The adhesive compound of claim 1 , wherein the uncured epoxy film has a shelf life of greater than one month at 20° C. and greater than one year at 0° C.10. The adhesive compound of claim 1 , wherein the uncured epoxy film can be transported as a standalone film without being disposed on a substrate support.11. A method claim 1 , comprising: a cresol novolac resin, and', 'at least one bisphenol A epoxy resin., 'forming an epoxy adhesive by curing an adhesive compound, wherein the adhesive ...

METHOD FOR STRUCTURALLY JOINING SUBSTRATES HAVING DIFFERENT COEFFICIENTS OF LINEAR THERMAL EXPANSION

A method of bonding substrates having different coefficients of thermal expansion, especially in the shell construction of modes of transport or white goods, using a one-component thermosetting epoxy resin composition containing toughness improvers based on terminally blocked polyurethane prepolymers. 4. The method as claimed in claim 1 , wherein the weight ratio of the at least one epoxy resin A having an average of more than one epoxy group per molecule to the at least one toughness improver D is 0.4-2.0.5. The method as claimed in claim 1 , wherein Ris a p-valent radical of a linear or branched polyurethane prepolymer terminated by isocyanate groups after the removal of the terminal isocyanate groups claim 1 , and the polyurethane prepolymer is prepared from at least one diisocyanate or triisocyanate and from a polymer Qhaving terminal amino claim 1 , thiol or hydroxyl groups.6. The method as claimed in claim 5 , wherein the polymer Qhaving terminal amino claim 5 , thiol or hydroxyl groups comprises polyols having average molecular weights between 600 and 6000 daltons claim 5 , selected from the group consisting of polyethylene glycols claim 5 , polypropylene glycols claim 5 , polyethylene glycol-polypropylene glycol block polymers claim 5 , polybutylene glycols claim 5 , polytetramethylene ether glycols claim 5 , hydroxyl-terminated polybutadienes claim 5 , hydroxyl-terminated butadiene-acrylonitrile copolymers and mixtures thereof.7. The method as claimed in claim 6 , wherein the polymer Qhaving terminal amino claim 6 , thiol or hydroxyl groups comprises polyols having average molecular weights between 600 and 6000 daltons claim 6 , selected from the group consisting of polytetramethylene ether glycols and hydroxyl-terminated polybutadienes claim 6 , wherein the weight ratio of polytetramethylene ether glycol to hydroxyl-terminated polybutadiene is in the range from 100/0 to 70/30.8. The method as claimed in claim 1 , wherein the thickness of the thermosetting ...

ONE-COMPONENT TOUGHENED EPOXY ADHESIVES WITH IMPROVED ADHESION TO OILY SURFACES AND HIGH WASH-OFF RESISTANCE

Epoxy adhesives include a latent curing agent, a reactive toughener having capped isocyanate groups, and certain urea compounds. The toughener is made by chain extending and capping a mixture of isocyanate-terminated prepolymers. The prepolymers include an isocyanate-terminated polyether and an isocyanate-terminated diene polymer. The adhesives have excellent wash-off resistance and excellent ability to adhere to oily substrates. 1. A one-component epoxy adhesive comprising in admixture:A) at least 25 weight percent, based on the weight of the adhesive, of one or more non-rubber-modified epoxy resins;B) 5 to 45 weight percent, based on the weight of the composition, of a reactive elastomeric toughener having capped isocyanate groups, which reactive elastomeric toughener includes a chain-extended and then isocyanate-capped mixture of i) a 1000 to 10,000 number average molecular weight isocyanate-terminated polyether and ii) a 1000 to 10,000 number average molecular weight isocyanate-terminated diene polymer;C) one or more latent epoxy curing agents in an amount sufficient to cure the adhesive; andD) 0.1 to 5 weight percent, based on the weight of the adhesive, of at least one urea compound having one or more urea groups and a molecular weight per urea group of up to 250,the adhesive being devoid of an aminophenol curing accelerator.2. The one-component epoxy adhesive of wherein the urea compound is polyurea corresponding to a reaction product of an aromatic polyisocyanate with a dialkyl amine.3. The one-component epoxy adhesive of wherein the urea compound corresponds to a reaction product of an aliphatic polyisocyanate with a dialkyl amine.4. The one-component epoxy adhesive of wherein the urea compound is isophorone bis(dimethyl urea).5. The one-component epoxy adhesive of wherein the urea compound is one or more of 2 claim 2 ,4′- and/or 4 claim 2 ,4′-methylene bis(phenyl dimethyl urea) and 2 claim 2 ,4- and/or 2 claim 2 ,6-toluene bis(dimethyl urea).6. The one- ...

USE OF NICKEL AND NICKEL-CONTAINING ALLOYS AS CONDUCTIVE FILLERS IN ADHESIVE FORMULATIONS

In accordance with the present invention, there are provided novel conductive adhesives and methods for the preparation thereof. In another aspect, the present invention provides novel conductive inks and methods for the preparation thereof. In yet another aspect, the present invention provides novel die attach films and methods for the preparation thereof. In still another aspect, the present invention provides novel die attach pastes and methods for the preparation thereof. 1. An electrically conductive adhesive formulation , said formulation comprising:about 5 up to about 50 wt % of an organic matrix, about 5 up to about 100 wt % of said particulated filler is particulated nickel or a particulated nickel-alloy, and', '0 up to about 95 wt % of said particulated filler is particulated, conductive non-nickel-containing filler,, 'about 45 up to about 95 wt % of a particulated filler, whereinoptionally a curing agent, which, when present, is present in the range of about 0.1 up to about 20 wt %, andoptionally a reactive and/or non-reactive organic diluent therefor,{'sup': '−5', 'wherein said formulation, upon curing thereof, has a volume resistivity in the range of about 10up to about 10 Ohm cm.'}2. The formulation of wherein the formulation is further characterized by one or more of the following:{'sup': '−4', 'the volume resistivity of said formulation falls in the range of about 10up to about 10 Ohm cm,'}said formulation is such that the effect of corrosion on the electrical properties of the particulated filler is minimal, andthe coefficient of thermal expansion (CTE) of said formulation is highly compatible with silicon wafers to which it may be applied.3. The formulation of wherein said organic matrix comprises one or more polymerizable monomer.4. The formulation of wherein said polymerizable monomer is a thermosetting or thermoplastic resin component selected from the group consisting of an acetal claim 3 , an acrylic monomer claim 3 , oligomer claim 3 , or ...

Thermally conductive paste and electronic device

A thermally conductive paste of the present invention includes a thermosetting resin, a curing agent, an acrylic compound, and a thermally conductive filler, at least one of the thermosetting resin and the curing agent contains a resin having a biphenyl skeleton, and the acrylic compound contains a (meth)acrylic monomer.

ONE-COMPONENT TOUGHENED EPOXY ADHESIVES WITH IMPROVED ADHESION TO OILY SURFACES AND HIGH WASH-OFF RESISTANCE

Epoxy adhesives include a latent curing agent, a reactive toughener having capped isocyanate groups, and certain urea compounds. The toughener is made by chain extending and capping a mixture of isocyanate-terminated prepolymers. The prepolymers include an isocyanate-terminated polyether and an isocyanate-terminated diene polymer. The adhesives have excellent wash-off resistance and excellent ability to adhere to oily substrates. 2. The method of claim 1 , wherein the urea compound is polyurea corresponding to a reaction product of an aromatic polyisocyanate with a dialkyl amine.3. The method of claim 2 , wherein the urea compound corresponds to a reaction product of an aliphatic polyisocyanate with a dialkyl amine.4. The method of wherein the urea compound is isophorone bis(dimethyl urea).5. The method of wherein the urea compound is one or more of 2 claim 2 ,4′- and/or 4 claim 2 ,4′-methylene bis(phenyl dimethyl urea) and 2 claim 2 ,4- and/or 2 claim 2 ,6-toluene bis(dimethyl urea).6. The method of claim 1 , wherein the latent epoxy curing agent includes dicyanamide.7. The method of claim 1 , wherein the toughener is made in a process that includes the steps of chain-extending the mixture of the isocyanate-terminated polyether and the isocyanate-terminated diene polymer and then capping the remaining isocyanate groups of the chain-extended material.8. The method of claim 1 , wherein the isocyanate groups of the isocyanate-terminated polyether and the isocyanate-terminated diene polymer are aliphatic isocyanate groups.9. The method of claim 1 , wherein the capped isocyanate groups of the toughener are capped with a monophenol or an aminophenol.11. The method of wherein the heat-curable coating is cured in step 3).12. The method of or claim 10 , wherein the degreasing step 2) is performed at a temperature of at least 50° C. This invention relates to one-component epoxy adhesives that contain an elastomeric toughener.Toughened one-component epoxy adhesives are used ...

ADHESION PROMOTERS AND COMPOSITIONS FOR CONTAINERS AND OTHER ARTICLES

This invention provides a coating composition that contains an aromatic adhesion promoter. Containers and other articles comprising the coatings and methods of making such containers and other articles are also provided. The invention further provides compositions including the adhesion promoter, which have utility in a variety of coating end uses, including, for example, valve and pipe coatings. 1. A coating composition , comprising:a binder polymer; andan aromatic adhesion promoter,wherein the coating composition is substantially free of each of mobile or bound bisphenol A, bisphenol F, bisphenol S, and epoxides thereof.2. The composition of claim 1 , wherein the coating composition is substantially free of polyhydric phenols that exhibit an estrogenic agonist activity in the MCF-7 cell proliferation assay greater than or equal to that exhibited by 4 claim 1 ,4′-(propane-2 claim 1 ,2-diyl)diphenol in the assay claim 1 , and epoxides thereof.3. The composition of claim 1 , wherein the composition is free of any dihydric phenols claim 1 , or corresponding diepoxides claim 1 , that exhibit an estrogenic agonist activity in the MCF-7 cell proliferation assay greater than about that of 4 claim 1 ,4′-(propane-2 claim 1 ,2-diyl)bis(2 claim 1 ,6-dibromophenol).4. The composition of claim 1 , wherein the binder polymer comprises a polyester resin claim 1 , acrylic resin claim 1 , a polyether resin claim 1 , a grafted polyester-acrylic resin claim 1 , a grafted polyether-acrylic resin claim 1 , a grafted polyester-epoxy resin claim 1 , or a combination thereof.5. The composition of claim 1 , wherein the coating composition is a liquid thermoset coating composition that includes a crosslinker.6. The composition of claim 1 , wherein the binder polymer is incorporated into or forms a water-soluble or water-dispersible composition.8. The composition of claim 1 , wherein the aromatic adhesion promoter is the reaction product of an aromatic diepoxide and a sulfur-based claim 1 , ...

High Performance Epoxy Adhesive

The present disclosure is directed to a precursor composition for a curable adhesive, the precursor comprising: a) a part (A) comprising: i. a first epoxy curing agent comprising at least one polyether amine and having an amine equivalent weight of at least 45 grams per mole of amine equivalents; ii. a second epoxy curing agent distinct from the first epoxy curing agent or a secondary curative; iii. a metal nitrate catalyst; iv. optionally, a metal triflate catalyst; and b) a part (B) comprising: i. a multifunctional first epoxy resin having at least three functional groups; ii. a second epoxy resin distinct from the first epoxy resin; iii. a core-shell polymer toughening agent iv. a filler material; and v. optionally, an epoxy-based reactive diluent. The compositions of the present disclosure are particularly suitable for use in structural bonding applications, in particular for adhesively bonding parts in manufacturing operations in aeronautic and aerospace industries. The present disclosure also relates to method of using such epoxy resin based curable compositions. 1. A precursor composition for a curable adhesive , said precursor comprising: i. a first epoxy curing agent comprising at least one polyether amine and having an amine equivalent weight of at least 45 grams per mole of amine equivalents;', 'ii. a second epoxy curing agent distinct from the first epoxy curing agent or a secondary curative;', 'iii. a metal nitrate catalyst;', 'iv. optionally, a metal triflate catalyst;', 'v. and, 'a) a part (A) comprising i. at least one multifunctional first epoxy resin having at least three functional groups;', 'ii. at least one second epoxy resin distinct from the first epoxy resin;', 'iii. a core-shell polymer toughening agent;', 'iv. a filler material; and', 'v. optionally, an epoxy-based reactive diluent., 'b) a part (B) comprising2. A precursor composition according to claim 1 , wherein the multifunctional first epoxy resin having at least three functional ...

PHENOLIC EPOXY SYSTEM

The embodiments described herein generally relate to methods and chemical compositions of phenolic epoxy systems. In one embodiment, a composition comprising a phenolic epoxy resin system includes an epoxy resin component and an alkoxylated phenol-aldehyde novolac resin. 1. A composition comprising a phenolic epoxy resin system , comprising:an epoxy resin component; andan alkoxylated phenol-aldehyde novolac resin, andan optional curing agent.2. The composition of claim 1 , wherein the alkoxylated phenol-aldehyde novolac resin comprises a reaction product from at least:a phenol-aldehyde novolac resin; andan alkoxylation agent selected from the group consisting of an alkylene oxide, an alkylene carbonate, and combinations thereof; andan optional alkoxylation catalyst.3. The composition of claim 1 , wherein the composition is a powder.4. The composition of claim 1 , wherein the epoxy resin component comprises a functionality equal or greater than 2.5. The composition of claim 1 , wherein the reaction product comprises 10% to 50% alkoxylated reactive sites of the phenol-aldehyde novolac resin and comprises a functionality equal or greater than 2.6. The composition of claim 1 , wherein the composition comprises:from 20 wt. % to 70 wt. % of the epoxy resin component; andfrom 30 wt. % to 80 wt. % of the alkoxylated phenol-aldehyde novolac resin; andfrom 0 wt. % to 5 wt. % of the optional catalyst, wherein the total weight percent is 100 weight percent.7. The composition of claim 1 , wherein the optional curing agent is selected from the group consisting of hexamethylenetetramine claim 1 , oxazolidine claim 1 , paraformaldehyde claim 1 , trioxane claim 1 , 2-methyl imidazole claim 1 , imidazole claim 1 , melamine claim 1 , triethanol amine claim 1 , tributyl amine claim 1 , and combinations thereof.8. The composition of claim 1 , wherein the optional curing agent is present in the composition and comprises from 0.1 wt. % to 5 wt. % of the composition.9. The composition of ...

RESIN COMPOSITION AND CURED PRODUCT OF SAME, ADHESIVE FOR ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT

An object is to provide a resin composition which is excellent in resistance to impact when dropped after curing and which is also excellent in solvent resistance, a cured product thereof, an adhesive agent for electronic components including this resin composition, a semiconductor device and an electronic component including the cured product of this resin composition. This resin composition includes (A) a hydrogenated bisphenol A-type epoxy resin, (B) a multifunctional thiol resin, and (C) a curing catalyst. The cured product of the resin composition has an elastic modulus of 0.5 GPa or more at 50° C. The resin co sition preferably includes a glycoluril compound as the component (B). 1. A resin composition comprising:(A) a hydrogenated bisphenol A-type epoxy resin;(B) a multifunctional thiol resin; and(C) a curing catalyst, whereina cured product of the resin composition has an elastic modulus of 0.5 GPa or more at 50° C.2. The resin composition according to claim 1 , wherein the cured product further has an elastic modulus of 0.5 GPa or more at 20° C. or more and lower than 50° C.3. The resin composition according to claim 1 , wherein the cured product has a glass transition temperature of higher than 50° C.4. The resin composition according to claim 1 , wherein the component (B) includes a multifunctional thiol resin having no ester bond in a molecule.5. The resin composition according to claim 1 , wherein the component (B) includes a glycoluril compound.6. The resin composition according to claim 5 , wherein a content of the glycoluril compound of the component (B) claim 5 , with respect to 100 parts by mass of the component (B) claim 5 , is 40 to 100 parts by mass.7. The resin composition according to claim 1 , further comprising a silica filler.8. An adhesive agent for electronic components claim 1 , comprising the resin composition according to .9. A cured product of the resin composition according to .10. A semiconductor device comprising the cured product ...

Two-part epoxy-based structural adhesives

A two-part epoxy-based structural adhesive composition comprising a curable epoxy resin, an amine curing agent, a toughening agent, and an oil-displacing agent. The structural adhesive may optionally include reactive liquid modifiers, fillers, secondary curatives, reactive diluents, surfactants, metal salts, pigments and combinations thereof. The structural adhesive may be used to form bonded joints between adherends having clean surfaces, as well as those having surfaces contaminated with hydrocarbon-containing materials, such as oils, processing aids and lubricating agents.

Adhesive, display apparatus having the adhesive, method of manufacturing the display apparatus, and bonding apparatus using the adhesive

An adhesive includes a base resin and a mixture. The base resin maintains a shape of the adhesive. The mixture is mixed in the base resin and a monomer reacts with the base resin and an ultraviolet (UV) initiator to initiate a polymerization reaction of the monomer as it is irradiated with UV light. The output pad electrode of the driving part and the input pad electrode of the display panel are electrically and physically connected to each other by using the adhesive cured as the UV light is irradiated, thereby simplifying a manufacturing process of a display apparatus and preventing a short that may be generated between pad electrodes.

Adhesive, display apparatus having the adhesive, method of manufacturing the display apparatus, and bonding apparatus using the adhesive

An adhesive includes a base resin and a mixture. The base resin maintains a shape of the adhesive. The mixture is mixed in the base resin and a monomer reacts with the base resin and an ultraviolet (UV) initiator to initiate a polymerization reaction of the monomer as it is irradiated with UV light. The output pad electrode of the driving part and the input pad electrode of the display panel are electrically and physically connected to each other by using the adhesive cured as the UV light is irradiated, thereby simplifying a manufacturing process of a display apparatus and preventing a short that may be generated between pad electrodes.

Sealant composition for liquid crystal display and liquid cristal display using the same

A sealant composition for a liquid crystal panel, and a liquid crystal panel containing the sealant obtained by curing the sealant composition are provided to reduce curing time, to decrease volatility and to improve viscosity and adhesion. A sealant composition comprises 100 parts by weight of a partially acrylate novolac epoxy resin represented by the formula 1; 0.1-50 parts by weight of an acrylate compound; 1.5-4.5 parts by weight of a thermal curing agent; 0.1-20 parts by weight of a photoinitiator; and optionally an inorganic filler, wherein m and n represent a molar ratio, 0<m<1, 0<n<1, and m+n=1. Preferably the ratio of m:n is 0.4:0.6 - 0.6:0.4. Preferably the thermal curing agent comprises at least one selected from hydrazide-based, aromatic amine-based, acid anhydride-based and imidazole-based compounds.

Anaerobic curable compositions having novolac vinyl esters

The present invention relates to novolac vinyl esters useful as thermal resistance conferring components for anaerobic curable compositions, and anaerobic curable compositions having such novolac vinyl esters. The compositions are particularly useful as adhesives and sealants.

Adhesive composition, adhesive layer containing said adhesive composition, support assembly, and gas barrier property evaluation apparatus having said support assembly

Provided is an adhesive composition which has excellent heat resistance, thermal cycle resistance and adhesion, and contributes to low outgassing, and which can thus be suitably used as an adhesive for a gas barrier property evaluation apparatus. The adhesive composition contains a novolac-based epoxy resin represented by formula (1) below, and a thermal cationic polymerization initiator represented by formula (2) below.

Adhesive composition, adhesive layer containing the same, support assembly, and gas barrier property evaluation apparatus comprising the support assembly

耐熱性、熱サイクル耐性および接着性に優れ、低アウトガスに寄与することからガスバリア性評価装置用接着剤としても好適に用いられる接着剤組成物を提供する。接着剤組成物は、下記式（１）で表されるノボラック型エポキシ樹脂と下記式（２）で表される熱カチオン型重合開始剤とを含有する。【化１】 The adhesive composition which is suitably used as an adhesive for a gas barrier property evaluation device is provided because it is excellent in heat resistance, thermal cycle resistance and adhesiveness, and contributes to low outgassing. The adhesive composition contains a novolac epoxy resin represented by the following formula (1) and a thermal cationic polymerization initiator represented by the following formula (2). [Chemical formula 1]

用于橡胶粘接的粘合剂

一种包含树脂基质、缠结聚合物和潜在固化剂的膜，其中所述树脂的官能度为至少2.0，粘度为至少0.1帕斯卡‑秒，并且所述膜在25℃下尺寸稳定。所述膜尤其可用于将弹性体粘接至刚性基材，例如将橡胶粘接至金属，并且所述膜不含挥发性有机化合物(VOC)且在长时间内保持贮存稳定。

Flame-retardant adhesive composition