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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Поддерживает ввод нескольких поисковых фраз (по одной на строку). При поиске обеспечивает поддержку морфологии русского и английского языка
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Применить Всего найдено 165. Отображено 100.
24-03-2016 дата публикации

FIXING MEMBER OF APPARATUS FOR UNIFORMING OIL LEVEL AND OUT DOOR UNIT OF AIR CONDITIONER HAVING THE SAME

Номер: KR0101606008B1
Автор: 강현욱, 김문섭, 이광주
Принадлежит: 삼성전자 주식회사

... 본 발명의 일측면은 압축기가 과전압하에서 기동시하는 경우에도 균유장치의 신뢰성을 확보할 수 있는 공기조화기의 실외기를 제공하는 것이다. 개시된 본 발명의 일측면에 따른 공기조화기의 실외기는 적어도 하나의 냉매관이 연결된 복수의 압축기와, 복수의 압축기의 오일이 균일하게 유지되도록 복수의 압축기와 연결되는 균유관과, 균유관의 중도에 마련된 적어도 하나의 균유밸브와, 균유밸브를 적어도 하나의 냉매관에 고정하는 고정부재를 포함하여 이루어질 수 있다.

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Номер записи: 1
24-02-2016 дата публикации

PHOTOCURABLE AND THERMO-CURABLE RESIN COMPOSITION, AND DRY FILM SOLDER RESIST

Номер: KR1020160020875A
Автор: KIM, HEE JUNG, KYUNG, YOU JIN, LEE, KWANG JOO
Принадлежит:

The present invention relates to a photocurable and thermos-curable resin composition comprising a urethane polymer including a reaction product of an alcohol compound having a diol compound with a carboxyl group, a diol compound with an ethylene unsaturated group, and alkylene oxide-added aromatic diol compound by a molar ratio of 1:0.5-2:0.1-0.5, and a diisocyanate compound; a photopolymerizable monomer having one or more photocurable unsaturated functional group; a (meth)acrylate polymer resin including 3-20 mol% of a repeated unit substituted with an epoxy functional group among total repeated units; a thermo-curable binder having a thermos-curable functional group; and a photoinitiator. Further, the present invention relates to a dry film solder resist provided from the same. COPYRIGHT KIPO 2016 ...

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Номер записи: 2
12-09-2016 дата публикации

RESIN COMPOSITION HAVING PHOTOCURABLE AND THERMOSETTING PROPERTIES, AND DRY FILM SOLDER RESIST

Номер: KR1020160106368A
Автор: CHOI, BO YUN, KYUNG, YOU JIN, CHOI, BYUNG JU, JEONG, WOO JAE, LEE, KWANG JOO, JEONG, MIN SU
Принадлежит:

The present invention relates to a resin composition having photocurable and thermosetting properties, and to a dry film solder resist manufactured therefrom. The resin composition comprises: an acid modified oligomer including an iminocarbonate-based compound having a carboxylic group and a photocurable unsaturated functional group; a photocurable monomer having at least two photocurable unsaturated functional groups; a thermocurable binder having a thermocurable functional group; a photoinitiator; and a blue pigment. The dry film type solder resist secures excellent workability based on high legibility and hiding properties, and has a low thermal expansion coefficient and enhanced reliability of thermal resistance through high efficiency of photocuring. COPYRIGHT KIPO 2016 ...

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Номер записи: 3
27-06-2019 дата публикации

VEHICLE SWITCHING DEVICE OF HYPERTUBE TRANSPORTATION SYSTEM

Номер: WO2019124812A1
Автор: KIM, Dong Hee, RHO, Hag Lae, KIM, Kyoung Tae, LEE, Kwan Sup, JO, Jeong Min, LIM, Jung Youl, LEE, Kwang Joo
Принадлежит:

The present invention relates to a vehicle switching device of a hypertube transportation system and, specifically, the objective of the present invention is to provide a vehicle switching device of a hypertube transportation system, the device allowing accelerated traveling by magnetic levitation and propulsion when entering a main section while allowing decelerated traveling with vehicle wheels in divergent sections. To this end, the present invention provides the vehicle switching device of a hypertube transportation system, in which a main track section and divergent track sections for providing a vehicle traveling path from a departure point to a destination are provided inside a partial-vacuum tube, the device comprising: deceleration units provided at the front ends of the divergent track sections on the vehicle traveling path between a departure point and a destination; and acceleration units provided at the rear ends of the divergent track sections on the vehicle traveling path ...

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Номер записи: 4
12-04-2018 дата публикации

SEMICONDUCTOR BONDING RESIN COMPOSITION, SEMICONDUCTOR ADHESIVE FILM, AND DICING DIE BONDING FILM

Номер: WO2018066851A1
Автор: KIM, Hee Jung, KIM, Jung Hak, LEE, Kwang Joo
Принадлежит:

The present invention relates to: a semiconductor bonding resin composition; a semiconductor adhesive film comprising the semiconductor bonding resin composition; a dicing die bonding film comprising an adhesive layer comprising the semiconductor bonding resin composition; and a method for dicing a semiconductor wafer by using the dicing die bonding film, the semiconductor bonding resin composition comprising: a (meth)acrylate-based resin comprising a (meth)acrylate-based repeating unit containing an epoxy-based functional group and a (meth)acrylate-based repeating unit (BzMA) containing an aromatic functional group, and having a hydroxyl equivalent of 0.15 eq/kg or less; a curing agent comprising a phenolic resin having a softening point of 100°C or higher; and an epoxy resin, wherein the amount of a (meth)acrylate-based functional group containing an aromatic functional group is 2-40 wt% in the (meth)acrylate-based resin.

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Номер записи: 5
17-10-2019 дата публикации

ADHESIVE SHEET FOR TEMPORARY ATTACHMENT AND SEMICONDUCTOR DEVICE PRODUCING METHOD USING SAME

Номер: WO2019199085A1
Автор: KIM, Sera, HAN, Ji Ho, JANG, Mi, LEE, Kwang Joo
Принадлежит:

The present invention relates to an adhesive sheet for temporary attachment and a semiconductor device producing method using same, wherein the adhesive sheet has excellent heat-resistance, and thus can implement a sufficient adhesive force even when going through a high-temperature process among semiconductor producing processes and can exhibit sufficient reduction of an adhesive force through photocuring in a separation step.

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Номер записи: 6
22-03-2012 дата публикации

LIGHT-SENSITIVE RESIN COMPOSITION, A DRY FILM SOLDER RESIST AND A CIRCUIT SUBSTRATE

Номер: WO2012036477A3
Автор: CHOI, Bo-Yun, CHOI, Byung-Ju, JEONG, Woo-Jae, LEE, Kwang-Joo, JEONG, Min-Su
Принадлежит:

The present invention relates to a light-sensitive resin composition comprising an acid-modifiable oligomer, a photopolymerisable monomer, a heat-curable binder resin, a photoinitiator and a thioxanthone compound, to a dry film solder resist obtained from the resin composition, and to a circuit substrate comprising the dry film solder resist.

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Номер записи: 7
03-03-2011 дата публикации

NOVEL POLYAMIC ACID, POLYIMIDE, PHOTOSENSITIVE RESIN COMPOSITION COMPRISING SAME, AND DRY FILM PRODUCED FROM THE COMPOSITION

Номер: WO2011025305A3
Автор: LEE, Kwang-Joo, KYUNG, You-Jin, KO, Joo-Eun, SONG, Heon-Sik, SHIM, Jung-Jin, KIM, Hee-Jung
Принадлежит:

The present invention relates to a novel polyamic acid comprising a thermopolymerizable or photopolymerizable functional group, to a photosensitive resin composition which can form a high-resolution pattern, and which has a superior property of being developable with an aqueous alkaline solution, and which can provide a cured coating film having excellent flexibility, adhesion properties, soldering-heat resistance, and pressure cooker test (PCT) resistance, and to a dry film produced from the composition.

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Номер записи: 8
11-10-2018 дата публикации

카메라 장치의 동영상 촬영방법 및 장치

Номер: KR0101905648B1
Автор: 백우현, 이광주, 최승주, 박현호
Принадлежит: 삼성전자 주식회사

... 본 발명의 실시예에 따른 카메라장치에서, 동영상 촬영시 매 프레임 주기에서 이미지를 획득하는 과정과, 획득된 이미지를 표시이미지로 변환 및 상기 표시이미지의 촬영정보를 생성하는 과정과, 표시이미지를 표시하는 동시에 동영상 부호화하여 저장하는 과정과, 촬영정보를 재생성하여 상기 동영상과 함께 저장하는 과정으로 이루어진다.

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Номер записи: 9
11-12-2015 дата публикации

RESIN COMPOSITION HAVING PHOTOCURABLE AND THERMOSETTING PROPERTIES, AND DRY FILM SOLDER RESIST

Номер: KR1020150139284A
Автор: CHOI, BO YUN, KU, SE JIN, LEE, KWANG JOO, JEONG, MIN SU, JEONG, WOO JAE, CHOI, BYUNG JU
Принадлежит:

The present invention relates to a resin composition having photocurable and thermosetting properties, which comprises an acid-modified oligomer, a photopolymerizable monomer, a thermosetting binder resin, a photoinitiator, an organic solvent, and an epoxy resin added with a butadiene/acrylonitrile copolymer of a terminal end of a carboxyl group, to a dry film solder resist obtained from the resin composition, and to a circuit board comprising the dry film solder resist. COPYRIGHT KIPO 2016 ...

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Номер записи: 10
08-11-2016 дата публикации

ADHESIVE FILM FOR SEMICONDUCTOR

Номер: KR1020160128937A
Автор: KIM, HEE JUNG, KIM, SE RA, KIM, JUNG HAK, NAM, SEUNG HEE, JO, JUNG HO, LEE, KWANG JOO, KIM, YOUNG KOOK
Принадлежит:

The present invention relates to an adhesive film for a semiconductor, more easily burying a protrusion such as a wiring of a semiconductor substrate or a wire installed in a semiconductor ship and applied to various cutting methods without serious limitations to have an excellent disruptive property to have specific physical properties improving reliability and efficiency of a semiconductor package process. COPYRIGHT KIPO 2016 ...

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Номер записи: 11
08-08-2016 дата публикации

METHOD AND APPARATUS FOR MEASURING METAL ION PERMEABILITY OF POLYMER FILM

Номер: KR1020160093567A
Автор: KIM, JUNG HAK, KIM, YOUNG KOOK, LEE, KWANG JOO, KIM, HEE JUNG, KIM, SE RA, JO, JUNG HO, NAM, SEUNG HEE, HAN, JI HO
Принадлежит:

The present invention relates to a method and an apparatus for measuring the metal ion permeability of a polymer film. The method for measuring the metal ion permeability of a polymer film comprises: a step of allowing one surface of a polymer film to come in contact with an electrolyte containing metal ions, an organic solvents, and a water-based solvent and then applying voltage to the polymer film at a temperature of 5 to 250 degrees; and a step of measuring the change rate of resistance or currents of the polymer film over time after the voltage is applied. COPYRIGHT KIPO 2016 ...

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Номер записи: 12
30-03-2017 дата публикации

ADHESIVE FILM, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

Номер: WO2017052289A1
Автор: KIM, Jung Hak, KIM, Hee Jung, KIM, Se Ra, LEE, Kwang Joo, KIM, Young Kook, NAM, Seung Hee
Принадлежит:

The present invention relates to an adhesive film which has a thixopropic index of 1.5 to 7.5 at 110°C and is used for fixating a first semiconductor element and a second semiconductor element, the first semiconductor element having an area the ratio of which to an area of the second semiconductor element is 0.65 or lower, and to a method for producing a semiconductor device using the adhesive film and to a semiconductor device using the adhesive film.

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Номер записи: 13
12-10-2017 дата публикации

SEMICONDUCTOR DEVICE

Номер: KR1020170111548A
Автор: KIM, JUNG HAK, KIM, HEE JUNG, NAM, SEUNG HEE, LEE, KWANG JOO, KIM, SE RA, KIM, YOUNG KOOK
Принадлежит:

The present invention provides a semiconductor device having a stable structure and mechanical properties suitable for a package of a multi-layered semiconductor chip structure, preventing a reflow crack, etc., and substantially having no void even if being exposed for a long time in a high temperature condition applied to a semiconductor manufacturing process. According to the present invention, the semiconductor device comprises: a first semiconductor device formed on a body to be bonded; and an adhesive film to bury the first semiconductor device. The adhesive film satisfies a predetermined ratio between the melting viscosity and the weight reduction rate at high temperatures. COPYRIGHT KIPO 2017 ...

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Номер записи: 14
02-04-2015 дата публикации

METHOD FOR PREPARING DRY FILM SOLDER RESIST, AND FILM LAMINATE USED THEREIN

Номер: WO2015046842A1
Автор: JEONG, Min Su, KYUNG, You Jin, CHOI, Byung Ju, JEONG, Woo Jae, CHOI, Bo Yun, LEE, Kwang Joo, KU, Se Jin
Принадлежит:

The present invention relates to: a method for preparing a dry film solder resist capable of allowing a dry film solder resist, having surface micro protrusions, to be formed by a more simplified method; and a film laminate used therein. The method for preparing a dry film solder resist comprises the steps of: forming a predetermined photocurable and thermosetting resin composition on a transparent carrier film having surface micro protrusions with an average roughness (Ra) of 200 nm to 2 μm; forming a layered structure in which a substrate, the resin composition and the transparent carrier film are sequentially formed by layering the resin composition on the substrate; exposing the resin composition and stripping the transparent carrier film; and alkali developing the resin composition of an unexposed portion and thermally curing the same.

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Номер записи: 15
03-03-2011 дата публикации

PHOTOSENSITIVE RESIN COMPOSITION WHICH IS CURABLE AT A LOW TEMPERATURE, AND DRY FILM PRODUCED USING SAME

Номер: WO2011025307A3
Автор: LEE, Kwang-Joo, KO, Joo-Eun, KIM, Byung-Nam, SONG, Heon-Sik, KYUNG, You-Jin, KIM, Hee-Jung
Принадлежит:

The present invention relates to a photosensitive resin composition comprising: a polyamic acid having a repeat unit having a specific structure; a heterocyclic amine compound; a (meth)acrylate compound having a carbon-carbon double bond; a photopolymerization initiator; and an organic solvent, as well as to a dry film produced from the composition. The photosensitive resin composition is curable at a low temperature, and thus ensures safety for processes and working convenience, and not only has superior heat resistance and mechanical and physical properties, but also has characteristics such as superior flexibility, soldering heat resistance, pattern-filling characteristics, etc.

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Номер записи: 16
07-06-2018 дата публикации

SEMICONDUCTOR ADHESIVE FILM AND SEMICONDUCTOR DEVICE

Номер: WO2018101651A1
Автор: KIM, Hee Jung, NA, Nu Ri, KIM, Young Kook, LEE, Kwang Joo
Принадлежит:

The present invention relates to a semiconductor adhesive film and a semiconductor device comprising the adhesive film, the semiconductor adhesive comprising: a conductive layer comprising one or more selected from the group consisting of copper, nickel, cobalt, iron, stainless steel (SUS), and aluminum, and having a thickness of at least 0.05 μm; and an adhesive layer formed on at least one surface of the conductive layer and comprising a (meth)acrylate-based resin, a curing agent, and an epoxy resin.

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Номер записи: 17
01-09-2015 дата публикации

NEW POLY-AMIC ACID, PHOTO-SENSITIVE RESIN COMPOSITION, DRY FILM, AND CIRCUIT BOARD

Номер: KR0101548702B1
Автор: 김정학, 경유진, 김희정, 이광주
Принадлежит: 주식회사 엘지화학

... 본 발명은 신규한 폴리아믹산; 우수한 내열성, 기계적 물성, 내굴곡성 및 전기적 안정성을 나타내는 감광성 재료를 제공할 수 있는 감광성 수지 조성물; 상기 감광성 수지 조성물로부터 얻어지는 드라이 필름; 및 상기 드라이 필름을 포함하는 회로 기판에 관한 것이다.

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Номер записи: 18
11-05-2017 дата публикации

METHOD FOR MANUFACTURING INSULATING LAYER AND METHOD FOR MANUFACTURING MULTI-LAYERED PRINTED CIRCUIT BOARD

Номер: KR1020170050913A
Автор: JEONG, WOO JAE, KYUNG, YOU JIN, CHOI, BYUNG JU, CHOI, BO YUN, LEE, KWANG JOO
Принадлежит:

The present invention relates to a method for manufacturing an insulating layer which can realize a uniform and fine pattern while improving efficiency on costs and productivity, and can secure excellent mechanical properties, and a method for manufacturing a multi-layered printed circuit board using the insulating layer obtained from the method for manufacturing an insulating layer. The method for manufacturing an insulating layer comprises the steps of: forming a patterned protecting layer on a multi-layered structure; forming a patterned metal layer by etching a metal layer while blocking the metal layer with the patterned protecting layer; developing a polymer resin layer with alkali while blocking the polymer resin layer with the patterned metal layer; and curing the polymer resin layer with heat. COPYRIGHT KIPO 2017 ...

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Номер записи: 19
23-06-2016 дата публикации

INTEGRATED TYPE ROAD SIGN HAVING STREET LAMP INTEGRATED WITH SIGNAL LIGHT

Номер: KR1020160072544A
Автор: LEE, GWANG JU
Принадлежит:

The present invention relates to an integrated type road sign having a street lamp integrated with a signal light, which is able to easily increase the installation number of the signal lamps or display panels as the road environment changes by adjusting the protruding length of third and fourth horizontal pipes inserted into first and second horizontal pipes. The road sign including a pillar erected vertically on the ground and a street lamp main body fixated on the upper part of the pillar comprises: a first horizontal pipe which is fixated to protrude from the upper part of the pillar to a road side and has an open outer end part; and a third horizontal pipe which is inserted and fixated through an adjustable type fixing means, which is able to adjust a protruding length, inside the first horizontal pipe. COPYRIGHT KIPO 2016 ...

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Номер записи: 20
04-04-2018 дата публикации

INDEPENDENT AIR LUMBAR SUPPORT STRUCTURE FOR VENTILATION OF VEHICLE SEAT

Номер: KR1020180034006A
Автор: LEE, SANG HOON, CHOI, SOK WON, YU, SUN WOONG, BUM, HYUNG TAEK, KIM, YOUNG GOO, KIM, JIN WOO, LEE, KWANG JU
Принадлежит:

The present invention relates to an air lumbar support structure for ventilation of a vehicle seat back and, more specifically, to a lumbar support structure in which ventilation is provided in a lumbar support. Therefore, air discharged from an air injector to inflate the lumbar support can be transmitted to a seat surface on which a driver sits. COPYRIGHT KIPO 2018 (AA) Inject air ...

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Номер записи: 21
02-11-2017 дата публикации

HEATING ELEMENT

Номер: WO2017188553A1
Автор: MYUNG, Ji Eun, KIM, Sera, KIM, Jooyeon, LIM, Chang Yoon, LEE, Seung Heon, SONG, Mun Seop, LEE, Kwang Joo, HWANG, Ji Young
Принадлежит:

The present invention relates to a heating element and a method for manufacturing same, and more specifically, a heating element and a method for manufacturing same is provided, the heating element comprising: an adhesive film; and a conductive heating pattern provided on the adhesive film, wherein the adhesive film has a rate of adhesive force reduction due to an external stimulus of at least 30% with respect to the adhesive force thereof prior to the application of an external stimulus.

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Номер записи: 22
17-11-2017 дата публикации

광경화성 및 열경화성을 갖는 수지 조성물 및 드라이 필름 솔더 레지스트

Номер: KR0101799092B1
Автор: 최보윤, 경유진, 최병주, 정우재, 이광주, 정민수
Принадлежит: 주식회사 엘지화학

... 본 발명은 카르복시기 및 광경화 가능한 불포화 작용기를 포함한 이미노카보네이트계 화합물을 포함하는 산변성 올리고머; 2개 이상의 광경화 가능한 불포화 작용기를 갖는 광중합성 모노머; 열경화 가능한 작용기를 갖는 열경화성 바인더; 광개시제; 및 청색 안료를 포함하는 광경화성 및 열경화성을 갖는 수지 조성물과 이로부터 제조되는 드라이 필름 솔더레지스트에 관한 것이다.

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Номер записи: 23
06-07-2017 дата публикации

광경화성 및 열경화성을 갖는 수지 조성물 및 드라이 필름 솔더 레지스트

Номер: KR0101755018B1
Автор: 최병주, 정우재, 최보윤, 이광주, 정민수
Принадлежит: 주식회사 엘지화학

... 본 발명은 산변성 올리고머, 광중합성 모노머, 열경화성 바인더 수지, 광개시제, 무기 필러, 실리콘 에폭시 공중합체 및 유기 용매를 포함하고, 상기 유기 용매를 제외한 고형분 중 상기 무기 필러의 함량이 20중량% 내지 55중량%인, 광경화성 및 열경화성을 갖는 수지 조성물과, 상기 수지 조성물로부터 얻어지는 드라이 필름 솔더 레지스트와, 상기 드라이 필름 솔더 레지스트를 포함하는 회로 기판에 관한 것이다.

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Номер записи: 24
03-11-2015 дата публикации

Method for dicing semiconductor wafer

Номер: KR0101565515B1
Автор: 조정호, 김세라, 이광주, 유영임, 김정학, 홍은기, 김영국
Принадлежит: 주식회사 엘지화학

... 본 발명은 다이싱 공정 중 절삭 깊이를 조절하여 버(burr)의 발생 및 픽업 불량을 최소화할 수 있는 반도체 웨이퍼의 다이싱 방법에 관한 것이다. 본 발명의 일 측면에 따른 반도체 웨이퍼의 다이싱 방법은. 기저필름, 점착제층, 접착제층, 및 웨이퍼가 하부로부터 순차적으로 적층된 반도체 웨이퍼를 다이싱 블레이드로 절삭하는 단계; 상기 절삭된 반도체 웨이퍼를 익스팬딩 하는 단계; 및 상기 익스펜딩한 반도체 웨이퍼의 기저필름에 자외선을 조사하고, 반도체 웨이퍼의 절삭에 의해 분리된 개별 칩들을 픽업하는 단계를 포함하고, 상기 절삭의 깊이는 상기 반도체 웨이퍼의 최상부로부터 상기 접착제층 두께의 5 내지 95%까지이다.

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Номер записи: 25
16-08-2016 дата публикации

광경화성 및 열경화성을 갖는 수지 조성물 및 드라이 필름 솔더 레지스트

Номер: KR0101648555B1
Автор: 최보윤, 구세진, 이광주, 정민수, 정우재, 최병주
Принадлежит: 주식회사 엘지화학

... 본 발명은 산변성 올리고머; 광중합성 모노머; 열경화성 바인더 수지; 광개시제; 유기 용매; 및 카르복실기 말단의 부타디엔/아크릴로니트릴 공중합체가 부가된 에폭시 수지;를 포함하는 광경화성 및 열경화성을 갖는 수지 조성물과, 상기 수지 조성물로부터 얻어지는 드라이 필름 솔더 레지스트와, 상기 드라이 필름 솔더 레지스트를 포함하는 회로 기판에 관한 것이다.

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Номер записи: 26
30-03-2018 дата публикации

반도체 접착용 수지 조성물 및 반도체용 접착 필름 및 다이싱 다이본딩 필름

Номер: KR0101843900B1
Автор: 김희정, 김세라, 김정학, 남승희, 조정호, 이광주, 김영국
Принадлежит: 주식회사 엘지화학

... 본 발명은 -10℃ 내지 20℃의 유리 전이 온도를 갖는 열가소성 수지; 70℃ 이상의 연화점을 갖는 페놀 수지를 포함한 경화제; 고상 에폭시 수지; 및 액상 에폭시 수지;를 포함하고, 상기 열가소성 수지 대비 상기 고상 에폭시 수지 및 액상 에폭시 수지의 총 함량의 중량비가 1.6 내지 2.6인 반도체 접착용 수지 조성물과, 상기 반도체 접착용 수지 조성물을 포함한 반도체용 접착 필름과, 상기 반도체 접착용 수지 조성물을 포함한 접착층을 포함한 다이싱 다이본딩 필름과, 상기 다이싱 다이본딩 필름을 이용한 반도체 웨이퍼의 다이싱 방법에 관한 것이다.

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Номер записи: 27
09-11-2017 дата публикации

METHOD FOR MANUFACTURING HEATING ELEMENT

Номер: KR1020170123897A
Автор: MYUNG, JI EUN, KIM, SE RA, KIM, JOO YEON, LIM, CHANG YOON, LEE, SEUNG HEON, SONG, MUN SEOP, LEE, KWANG JOO, HWANG, JI YOUNG
Принадлежит:

The present invention relates to a heating element and a method for manufacturing a heating element. The method for manufacturing a heating element according to the present invention comprises: a step of preparing an adhesive film; and a step of forming a conductive heating pattern on the adhesive film. In the adhesive film, a reduction rate of adhesiveness caused by external stimulus is 30% or more with respect to adhesiveness before applying the external stimulus. Since it is possible to remove the adhesive film for forming the conductive heating pattern, a film other than the adhesive film may not be additionally used between two transparent substrates of a final product. Accordingly, it is possible to prevent distortion of the field of view caused by a difference in the refractive index between films. COPYRIGHT KIPO 2017 (AA) Perform heat treatment on an adhesive film (BB) Form a metal film (CC) Remove a carrier plate (DD) Forming a metal pattern (EE) Adhesion layer (FF) Substrate ( ...

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Номер записи: 28
21-02-2018 дата публикации

METHOD FOR MANUFACTURING INSULATING LAYER AND METHOD FOR MANUFACTURING MULTILAYERED PRINTED CIRCUIT BOARD

Номер: KR1020180018333A
Автор: JEONG, WOO JAE, KYUNG, YOU JIN, CHOI, BYUNG JU, CHOI, BO YUN, LEE, KWANG JOO, JEONG, MIN SU
Принадлежит:

The present invention relates to a method for manufacturing an insulating layer capable of improving efficiency in cost and productivity, implementing a uniform and fine pattern, and securing excellent mechanical properties, and a method for manufacturing a multilayered printed circuit board by using an insulating layer obtained from the method for manufacturing an insulating layer. The method for manufacturing an insulating layer comprises the steps of: bonding an opposite surface of a metal layer onto a polymer resin layer; forming a patterned photosensitive resin layer; forming a patterned metal layer; separating and removing a carrier film; alkali-developing the polymer resin layer; and thermally curing the polymer resin layer. COPYRIGHT KIPO 2018 ...

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Номер записи: 29
12-10-2017 дата публикации

RADIATING FILM AND SEMICONDUCTOR DEVICE

Номер: KR1020170111771A
Автор: KIM, JUNG HAK, SONG, MUN SEOP, KIM, HEE JUNG, LEE, KWANG JOO
Принадлежит:

The present invention relates to a radiating film which comprises: an adhesive layer containing an adhesive resin composition which consists of a (meth)acrylate-based resin containing at least 10 wt% of a (meth)acrylate-based repeating unit having an epoxy-based functional group, an epoxy resin whose softening point is greater than or equal to 70 deg. C, and a phenol resin whose softening point is greater than or equal to 70 deg. C; and a metal layer formed on one side of the adhesive layer. The present invention further relates to a semiconductor device including the radiating film. According to the present invention, the radiating film prevents formation of void by being strongly and uniformly combined with semiconductor devices while having small thickness. COPYRIGHT KIPO 2017 ...

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Номер записи: 30
27-09-2012 дата публикации

NOBLE POLYAMIC ACID, PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM, AND CIRCUIT BOARD

Номер: WO2012128526A2
Автор: KYUNG, You-Jin, KIM, Hee-Jung, LEE, Kwang-Joo, KIM, Jung-Hak
Принадлежит:

The present invention relates to a noble polyamic acid; a photosensitive resin composition which can provide a photosensitive material that satisfies the required characteristics of excellent flexibility and low stiffness and has excellent heat resistance and coating resistance; a dry film obtained from the photosensitive resin composition; and a circuit board including the dry film.

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Номер записи: 31
18-06-2015 дата публикации

COMPOSITION FOR FORMING ADHESIVE LAYER OF DICING FILM, AND DICING FILM

Номер: WO2015088282A1
Автор: KIM, Young Kook, KIM, Se Ra, KIM, Hee Jung, JO, Jung Ho, LEE, Kwang Joo, KIM, Jung Hak, NAM, Seung Hee
Принадлежит:

The present invention relates to: a composition for forming an adhesive layer of a dicing film, comprising a silicone compound oil containing one or more reactive functional groups, an adhesive binder and a photoinitiator, and in which the ratio of the silicone compound oil containing one or more reactive functional groups to the adhesive binder is 0.01-4.5 % by weight; a dicing film comprising an adhesive layer containing the composition; a dicing die bonding film comprising the dicing film; and a method for dicing a semiconductor wafer by using the dicing die bonding film.

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Номер записи: 32
13-04-2018 дата публикации

반도체용 접착 필름

Номер: KR0101832450B1
Автор: 김희정, 김세라, 김정학, 남승희, 조정호, 이광주, 김영국
Принадлежит: 주식회사 엘지화학

... 본 발명은 반도체 기판의 배선이나 반도체 칩에 부설된 와이어 등의 요철을 보다 용이하게 매립할 수 있으면서도, 다양한 절단 방법에 큰 제한 없이 적용되어 우수한 분단성을 구현하여 반도체 패키지 공정의 신뢰성 및 효율을 향상시킬 수 있는 특정 물성을 갖는 반도체용 접착 필름에 관한 것이다.

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Номер записи: 33
05-09-2016 дата публикации

MOVABLE WEIR DEVICE FOR SEDIMENTATION TANK

Номер: KR101651580B1
Автор: KIM, HYEON SU, LEE, JONG SOK, LEE, GWANG JU, KANG, IN SEONG
Принадлежит: BUWON CONSTRUCTION CO., LTD.

The present invention relates to a movable weir device for a sedimentation tank, which can move a weir to a location where a relatively small amount of sediment floats by means of a turnover which occurs due to a change in water temperature of a sedimentation tank, thereby discharging supernatant. According to the present invention, the movable weir device for a sedimentation tank is disposed to be movable upstream and downstream of a sedimentation tank. Furthermore, the movable weir device for a sedimentation tank comprises: a pair of rails which are disposed on opposite inner walls of the sedimentation tank, respectively; a weir which has mounting grooves configured to be seated on the rails and notches configured such that supernatant of the sedimentation tank is introduced therethrough; and a discharge pipe through which supernatant accommodated inside the weir is discharged out of the sedimentation tank. COPYRIGHT KIPO 2016 ...

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Номер записи: 34
21-05-2018 дата публикации

MANUFACTURING METHOD OF INSULATING LAYER AND MANUFACTURING METHOD OF MULTILAYER PRINTED CIRCUIT BOARD

Номер: KR1020180053228A
Автор: JEONG, WOO JAE, KYUNG, YOU JIN, CHOI, BYUNG JU, CHOI, BO YUN, LEE, KWANG JOO, JEONG, MIN SU
Принадлежит:

The present invention relates to a manufacturing method of an insulating layer which can be manufactured by a rapid and simple process to improve processing efficiency, is easy to control the thickness of the insulating layer and can form a high-resolution via hole without physical damage, and a manufacturing method of a multilayer printed circuit board using an insulating layer obtained thereby. The manufacturing method of an insulating layer comprises the following steps of: sealing a semiconductor element with a polymer resin layer including an alkaline soluble resin and a thermosetting binder; forming a pattern on the polymer resin layer while the semiconductor element is kept sealed; primarily curing the polymer resin layer on which the pattern is formed; etching a surface of the cured polymer resin layer with an alkaline solution, and exposing a metal protrusion; and secondarily curing the polymer resin layer while the metal protrusion is exposed. COPYRIGHT KIPO 2018 ...

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Номер записи: 35
22-01-2018 дата публикации

접착제 조성물, 다이싱 다이본딩 필름, 반도체 웨이퍼 및 반도체 장치

Номер: KR0101820936B1
Автор: 남승희, 김희정, 김정학, 김세라, 조정호, 이광주, 김영국
Принадлежит: 주식회사 엘지화학

... 본 발명은 접착제 조성물, 다이싱 다이본딩 필름, 반도체 웨이퍼 및 반도체 장치에 관한 것으로, 보다 상세하게는 에폭시 수지, 열가소성 수지, 경화제 및 다공성 필러를 포함하는 접착제 조성물과, 상기 접착제 조성물의 경화물을 포함하는 다이싱 다이본딩 필름, 상기 다이싱 다이본딩 필름을 포함하는 반도체 웨이퍼 및 반도체 장치에 관한 것이다.

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Номер записи: 36
03-03-2011 дата публикации

PHOTOSENSITIVE RESIN COMPOSITION WHICH IS CURABLE AT A LOW TEMPERATURE, AND DRY FILM PRODUCED USING SAME

Номер: WO2011025307A2
Автор: LEE, Kwang-Joo, KO, Joo-Eun, KIM, Byung-Nam, SONG, Heon-Sik, KYUNG, You-Jin, KIM, Hee-Jung
Принадлежит:

The present invention relates to a photosensitive resin composition comprising: a polyamic acid having a repeat unit having a specific structure; a heterocyclic amine compound; a (meth)acrylate compound having a carbon-carbon double bond; a photopolymerization initiator; and an organic solvent, as well as to a dry film produced from the composition. The photosensitive resin composition is curable at a low temperature, and thus ensures safety for processes and working convenience, and not only has superior heat resistance and mechanical and physical properties, but also has characteristics such as superior flexibility, soldering heat resistance, pattern-filling characteristics, etc.

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Номер записи: 37
22-08-2019 дата публикации

BACK GRINDING TAPE

Номер: WO2019143076A8
Автор: YOON, Mi Seon, KIM, Sera, LEE, Kwang Joo, YEON, Bora, PARK, Sung Chan, KIM, Eun Yeong
Принадлежит:

The present invention relates to a back grinding tape comprising a polymer substrate and an adhesive layer, wherein the adhesive layer comprises a (meth)acrylate resin containing 30-60 wt% of repeating units derived from a monomer or an oligomer having a glass transition temperature of 0°C or higher and the glass transition temperature of the adhesive layer is -20 to 10°C, and to a method for grinding a wafer by using the back grinding tape.

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Номер записи: 38
13-07-2015 дата публикации

DICING FILM AND DICING DIE BONDING FILM

Номер: KR1020150081232A
Автор: KIM, SE RA, JO, JUNG HO, KIM, YOUNG KOOK, KIM, HEE JUNG, LEE, KWANG JOO, KIM, JUNG HAK, NAM, SEUNG HEE
Принадлежит:

The present invention relates to a dicing film which comprises a base film and an adhesive layer, wherein the storage elastic modulus of the adhesive layer is 3x10^5 to 4x10^6 Pa at 30°C. The cross-linking density of the adhesive layer is 80-99%; to a dicing film; to a dicing die bonding film including the dicing film; and to a method for dicing a semiconductor wafer using the dicing die bonding film. COPYRIGHT KIPO 2015 ...

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Номер записи: 39
25-05-2016 дата публикации

ADHESIVE COMPOSITION FOR SEMICONDUCTORS AND ADHESIVE FILM FOR SEMICONDUCTORS

Номер: KR1020160058711A
Автор: KIM, HEE JUNG, KIM, JUNG HAK, KIM, SE RA, LEE, KWANG JOO
Принадлежит:

The present invention relates to a resin composition for adhesion of semiconductors, which comprises: a (meth)acrylate resin comprising epoxy functional group-containing (meth)acrylate repeating units in an amount of 17 wt% or more; an epoxy resin having a softening point of 70°C or higher; and a phenolic resin having a softening point of 105°C or higher, wherein the (meth)acrylate resin is present in a weight ratio of 0.48-0.65 based on the total weight of the (meth)acrylate resin, epoxy resin and phenolic resin. The present invention also relates to an adhesive film for semiconductors obtained from the resin composition, a dicing die bonding film comprising an adhesive layer including the adhesive film for semiconductors, semiconductor wafer comprising the dicing die bonding film, and a method for dicing a semiconductor wafer using the dicing die bonding film. COPYRIGHT KIPO 2016 ...

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Номер записи: 40
03-11-2016 дата публикации

RESIN COMPOSITION FOR BONDING SEMICONDUCTOR, ADHESIVE FILM FOR SEMICONDUCTOR, AND DICING DIE BONDING FILM

Номер: WO2016175611A1
Автор: KIM, Hee Jung, KIM, Se Ra, KIM, Jung Hak, NAM, Seung Hee, JO, Jung Ho, LEE, Kwang Joo, KIM, Young Kook
Принадлежит:

The present invention relates to a resin composition for bonding semiconductors, an adhesive film for semiconductors comprising the resin composition for bonding semiconductors, a dicing die bonding film comprising an adhesion layer comprising the resin composition for bonding semiconductors, and a method for dicing semiconductor wafers utilizing the dicing bonding film, the resin composition for bonding semiconductors comprising: a thermoplastic resin of -10-20°C glass transfer temperature; a hardener comprising a phenolic resin having a softening point of 70°C or higher; a solid epoxy resin; and a liquid epoxy resin, wherein the weight ratio of the thermoplastic resin to the total content of solid and liquid epoxy resin is 1.6-2.6.

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Номер записи: 41
15-02-2018 дата публикации

INSULATING LAYER MANUFACTURING METHOD AND MULTILAYERED PRINTED CIRCUIT BOARD MANUFACTURING METHOD

Номер: WO2018030694A1
Автор: JEONG, Woo Jae, KYUNG, You Jin, CHOI, Byung Ju, CHOI, Bo Yun, LEE, Kwang Joo, JEONG, Min Su
Принадлежит:

The present invention relates to an insulating layer manufacturing method capable of implementing a uniform micropattern while improving efficiency in terms of costs and productivity and capable of securing excellent mechanical properties, and to a method for manufacturing a multilayered printed circuit board using an insulating layer obtained by the insulating layer manufacturing method.

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Номер записи: 42
29-08-2013 дата публикации

RADIATION CURABLE AND THERMOSETTABLE RESIN COMPOSITION, AND DRY FILM SOLDER RESIST

Номер: WO2013125854A1
Автор: KU, Se-Jin, CHOI, Byung-Ju, JEONG, Woo-Jae, CHOI, Bo-Yun, LEE, Kwang-Joo, JEONG, Min-Su
Принадлежит:

The present invention relates to: a radiation curable and thermosettable resin composition enabling provision of a dry film solder resist having a higher glass transition temperature and improved heat resistance; and a dry film solder resist. The resin composition can comprise: an acid-modified oligomer comprising an iminocarbonate-based compound having a carboxyl group (-COOH) and a radiation curable unsaturated functional group; a photopolymerizable monomer having two or more radiation curable unsaturated functional groups; a thermosettable binder having a thermosetting functional group; and a photoinitiator.

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Номер записи: 43
26-05-2017 дата публикации

BUILD-UP METHOD FOR SEMICONDUCTOR ELEMENT

Номер: WO2017086699A1
Автор: JEONG, Min Su, KYUNG, You Jin, CHOI, Byung Ju, JEONG, Woo Jae, CHOI, Bo Yun, LEE, Kwang Joo
Принадлежит:

The present invention relates to a build-up method for a semiconductor element, the method allowing a uniform micropattern to form while imparting highly reliable adhesiveness between an insulation layer and a thin metal film layer.

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Номер записи: 44
18-03-2016 дата публикации

Semiconductor dicing die bonding film

Номер: KR0101604823B1
Автор: 조정호, 김세라, 이광주, 김정학, 김영국
Принадлежит: 주식회사 엘지화학

... 본 발명은 다이싱 공정에서 인장에 의해 필름의 개편화가 쉽게 일어나게 할 수 있는 반도체 다이싱 다이본딩 필름에 관한 것으로, 본 발명의 일 측면에 따른 다이싱 다이 본딩 필름은, 기저필름, 점착층, 및 접착층을 포함하고, 상기 점착층의 Tg는 -50℃ 내지 -35℃ 이며, 상기 기저필름의 Tg는 -5℃ 이하이고, 상기 기저필름은 하기 일반식 1로 계산되는 복원율이 길이방향 및 수직방향에서 각각 90% 이상이다. [일반식 1] 복원율(%) = 100-(L-50)/50 x 100 상기 일반식 1에서 L은 길이 50mm, 폭 10mm의 기저필름을 길이방향 또는 수직방향으로 20mm/s 속도로 75mm 인장시킨 후, 5초 동안 유지하고, 60℃에서 30초 동안 방치한 후 측정한 길이이다.

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Номер записи: 45
13-09-2016 дата публикации

차량의자 등받이부 제조방법 및 이에 사용되는 제조금형

Номер: KR0101657148B1
Автор: 이광주, 선석운, 김민진, 임동욱
Принадлежит: 한국기술교육대학교 산학협력단

... 본 발명은 차량의자 등받이부 제조방법에 관한 것으로서, 복수 개로 분할된 금형부품을 기 설정된 형상으로 결합하여 제조금형을 형성하는 결합단계, 상기 결합단계에 의해 결합된 상기 제조금형의 외측면에 복합재료를 적층하는 적층단계, 별도의 진공챔버 내부에서 상기 복합재료가 적층된 상기 제조금형에 고온, 고압을 가해 상기 복합재료를 경화시켜 등받이부를 성형하는 가공단계 및 상기 가공단계를 거친 상기 등받이부에서 상기 제조금형을 제거하는 분리단계를 포함하는 차량의자 등받이부 제조방법이 개시된다.

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Номер записи: 46
04-08-2017 дата публикации

고분자 필름의 금속 이온 투과도 측정 방법 및 고분자 필름의 금속 이온 투과도 측정 장치

Номер: KR0101761891B1
Автор: 김영국, 김정학, 김희정, 김세라, 조정호, 이광주, 남승희, 한지호
Принадлежит: 주식회사 엘지화학

... 본 발명은, 고분자 필름의 적어도 일면을 금속 이온, 유기 용매 및 수계 용매를 포함한 전해액과 접촉시킨 상태에서 상기 고분자 필름으로 전압을 가해주는 단계; 및 상기 전압이 가해진 이후 상기 고분자 필름의 시간에 따른 저항의 변화율 또는 전류의 변화율을 측정하는 단계;를 포함하는, 고분자 필름의 금속 이온 투과도 측정 방법 및 이의 측정에 이용되는 고분자 필름의 금속 이온 투과도 측정 장치에 관한 것이다.

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Номер записи: 47
12-10-2017 дата публикации

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Номер: KR1020170113430A
Автор: KIM, JUNG HAK, KIM, HEE JUNG, KIM, SE RA, LEE, KWANG JOO, NAM, SEUNG HEE, KIM, YOUNG KOOK
Принадлежит:

The present invention relates to a semiconductor device and a method of manufacturing a semiconductor device using an adhesive for semiconductor having a predetermined melt viscosity and a thixotropic index. The semiconductor device comprises a first semiconductor element fixed on an object by flip chip bonding; an adhesive layer for embedding the first semiconductor element and a space between the object and the first semiconductor element; and a second semiconductor element coupled with the first semiconductor element via the adhesive layer. The adhesive layer has the predetermined melt viscosity and the thixotropic index. The efficiency of a semiconductor manufacturing process can be improved. COPYRIGHT KIPO 2017 (AA,CC) Second semiconductor element (BB) Adhesive layer (DD) Flip chip (EE) Object ...

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Номер записи: 48
26-09-2019 дата публикации

BACK-GRINDING TAPE

Номер: WO2019182271A1
Автор: KIM, Eun Yeong, KIM, Sera, LEE, Kwang Joo, KIM, Sang Hwan, PARK, Sung Chan, YOON, Mi Seon
Принадлежит:

A back-grinding tape according to the present invention has excellent water resistance so as to easily protect a pattern and has excellent adhesion between respective layers such that the respective layers are not separated during a tape removing process. Accordingly, the back-grinding tape is suitable for a back grinding process.

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Номер записи: 49
11-01-2019 дата публикации

표시장치

Номер: KR1020190004008A
Автор: 신명아, 이준재, 최인수, 이광주
Принадлежит:

... 본 발명은 하부 기판의 상면에 부착된 연성 필름의 분리 및 처짐 불량을 방지할 수 있는 표시장치에 관한 것이다. 본 발명의 일 실시예에 따른 표시장치는 기판 상에 배치된 화소 어레이층을 포함하는 표시 모듈, 기판 상에서 화소 어레이층의 주변의 비표시 영역에 부착된 연성 필름, 화소 어레이층을 덮는 배리어 필름, 배리어 필름 상에 부착된 연성 회로 기판, 연성 필름과 연성 회로 기판 사이의 공간에 채워진 제1 레진을 구비한다.

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Номер записи: 50
13-06-2016 дата публикации

Thermo-curable resin composition, and dry film solder resist

Номер: KR0101629942B1
Автор: 정우재, 최병주, 최보윤, 이광주, 정민수, 구세진
Принадлежит: 주식회사 엘지화학

... 본 발명은 현상 시 솔더 레지스트 표면에 조도를 증가시켜 추가적인 솔더 레지스트 표면처리 없이 부자재와의 접착력을 향상 시킬 수 있는 드라이 필름 솔더 레지스트의 제공을 가능케 하는 광경화성 및 열경화성을 갖는 수지 조성물 및 드라이 필름 솔더 레지스트에 관한 것이다. 상기 수지 조성물은, 카르복시기 및 광경화 가능한 작용기를 갖는 산변성 올리고머; 2개 이상의 아크릴레이트기를 갖는 화합물을 포함하는 광중합성 모노머; 히드록실 작용기를 가지는 질소 함유 헤테로 환에 하나 이상의 카르복시기를 가진 작용기가 결합된 구조의 화합물을 포함하는 열경화성 모노머; 열경화 가능한 작용기를 가지는 열경화성 바인더; 및 광개시제를 포함할 수 있다.

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Номер записи: 51
01-11-2017 дата публикации

광경화성 및 열경화성을 갖는 수지 조성물 및 드라이 필름 솔더 레지스트

Номер: KR0101792755B1
Автор: 최병주, 경유진, 정우재, 최보윤, 이광주, 정민수
Принадлежит: 주식회사 엘지화학

... 본 발명은 카르복시기 및 광경화 가능한 불포화 작용기를 포함한 이미노카보네이트계 화합물을 포함하는 산변성 올리고머; 2개 이상의 광경화 가능한 불포화 작용기를 갖는 광중합성 모노머; 열경화 가능한 작용기를 갖는 열경화성 바인더; 세라믹 화합물이 표면에 결합된 탄소 동소체 입자 및 방열 세라믹 입자로 이루어진 군에서 선택된 1종 이상을 포함하는 기능성 필러; 및 광개시제;를 포함하는, 광경화성 및 열경화성을 갖는 수지 조성물과 이로부터 제조되는 드라이 필름 솔더레지스트에 관한 것이다.

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Номер записи: 52
08-11-2016 дата публикации

ADHESIVE COMPOSITION FOR SEMICONDUCTOR, ADHESIVE FILM FOR SEMICONDUCTOR, AND DICING DIE BONDING FILM

Номер: KR1020160128936A
Автор: KIM, HEE JUNG, KIM, SE RA, KIM, JUNG HAK, NAM, SEUNG HEE, JO, JUNG HO, LEE, KWANG JOO, KIM, YOUNG KOOK
Принадлежит:

The present invention relates to a resin composition for bonding a semiconductor, an adhesive film for a semiconductor including the resin composition for bonding a semiconductor, a dicing die bonding film comprising an adhesive layer including the resin composition for bonding a semiconductor, and a dicing method for a semiconductor wafer using the dicing die bonding film. The resin composition for bonding a semiconductor comprises: a thermoplastic resin having the glass transition temperature of -10 to 20°C; a curing agent including a phenol resin having a softening point of 70°C or more; a solid epoxy resin; and a liquid epoxy resin, wherein the weight ratio of the total amount of the solid epoxy resin and the liquid epoxy resin, with respect to the thermoplastic resin, is 1.6 to 2.6. COPYRIGHT KIPO 2016 ...

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Номер записи: 53
22-03-2012 дата публикации

LIGHT-SENSITIVE RESIN COMPOSITION, A DRY FILM SOLDER RESIST AND A CIRCUIT SUBSTRATE

Номер: WO2012036477A2
Автор: CHOI, Bo-Yun, CHOI, Byung-Ju, JEONG, Woo-Jae, LEE, Kwang-Joo, JEONG, Min-Su
Принадлежит:

The present invention relates to a light-sensitive resin composition comprising an acid-modifiable oligomer, a photopolymerisable monomer, a heat-curable binder resin, a photoinitiator and a thioxanthone compound, to a dry film solder resist obtained from the resin composition, and to a circuit substrate comprising the dry film solder resist.

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Номер записи: 54
06-02-2014 дата публикации

RESIN COMPOSITION HAVING PHOTOCURABLE PROPERTY AND THERMOSETTING PROPERTY, AND DRY FILM SOLDER RESIST

Номер: WO2014021590A1
Автор: JEONG, Min-Su, CHOI, Byung-Ju, JEONG, Woo-Jae, CHOI, Bo-Yun, LEE, Kwang-Joo
Принадлежит:

The present invention relates to a resin composition having a photocurable property and a thermosetting property, and a DFSR, wherein the resin composition enables the formation of a DFSR having a micro-undulated surface without an extra treating process such as a plasma treating process. The resin composition having a photocurable property and a thermosetting property comprises: an acid modified oligomer having a carboxyl group (-COOH) and an unsaturated functional group which can be photocured; a polyimide-based resin; a photopolymeric monomer having two or more unsaturated functional groups which can be photocured; a thermosetting binder having a functional group which can be thermoset; and a photoinitiator.

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Номер записи: 55
29-09-2011 дата публикации

PHOTOCURABLE AND THERMOCURABLE RESIN COMPOSITION, AND DRY FILM SOLDER RESIST

Номер: WO2011118939A3
Автор: JEONG, Woo-Jae, CHOI, Byung-Ju, CHOI, Bo-Yun, LEE, Kwang-Joo, JEONG, Min-Su
Принадлежит:

The present invention relates to a photocurable and thermocurable resin composition that shows improved alkali developability and is capable of providing a dry film solder resist having good heat resistance and dimensional stability, and to a dry film solder resist. The resin composition may comprise: an acid-modified oligomer having a carboxyl group (-COOH) and a photocurable functional group; a photopolymerizable monomer having an epoxy acrylate group of 3 or more functions bonded to a nitrogen-containing heteroring, and a compound configured with a functional group having a carboxyl group bonded to one expoxy acrylate group or more; a thermocurable binder having a thermocurable functional group; and a photoinitiator.

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Номер записи: 56
22-05-2020 дата публикации

RESIN COMPOSITION FOR SEMICONDUCTOR ADHESION, SEMICONDUCTOR ADHESIVE FILM USING SAME, DICING DIE BONDING FILM AND SEMICONDUCTOR WAFER DICING METHOD

Номер: WO2020101236A1
Автор: KIM, Wanjung, JANG, Jong Min, CHOI, Byung Ju, LEE, Kwang Joo
Принадлежит:

The present invention relates to a resin composition for semiconductor adhesion, a semiconductor adhesive film produced therefrom, a dicing die bonding film and a semiconductor wafer dicing method, the resin composition for semiconductor adhesion comprising: a heat dissipating filler having a specific functional group introduced on the surface thereof; and a mixture of two types of curing catalysts.

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Номер записи: 57
15-02-2018 дата публикации

INSULATING LAYER PRODUCTION METHOD AND MULTILAYERED PRINTED CIRCUIT BOARD PRODUCTION METHOD

Номер: WO2018030761A1
Автор: JEONG, Woo Jae, KYUNG, You Jin, CHOI, Byung Ju, CHOI, Bo Yun, LEE, Kwang Joo, JEONG, Min Su
Принадлежит:

The present invention relates to: an insulating layer production method which improves efficiency in terms of costs and productivity, allows for the realization of uniform and minute patterns, and can secure excellent mechanical properties; and a multilayered printed circuit board production method using an insulating layer obtained from the insulating layer production method.

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Номер записи: 58
23-02-2017 дата публикации

다이싱 필름 점착층 형성용 조성물 및 다이싱 필름

Номер: KR0101709689B1
Автор: 김영국, 김희정, 김세라, 조정호, 김정학, 남승희, 이광주
Принадлежит: 주식회사 엘지화학

... 본 발명은 (메타)아크릴레이트계 작용기 및 비극성 작용기를 포함한 고분자, 불소를 1이상 포함하는 (메타)아크릴레이트계 고분자 및 반응성 작용기를 포함하는 실리콘 변성 (메타)아크릴레이트계 고분자로 이루어진 군에서 선택된 1종 이상의 고분자를 포함하는 고분자 첨가제; 점착 바인더; 및 광개시제;를 포함하고, 상기 점착 바인더 대비 상기 고분자 첨가제의 중량비가 0.01% 내지 4.5%인, 다이싱 필름 점착층 형성용 조성물과 상기 조성물을 포함하는 점착층을 포함하는 다이싱 필름과 상기 다이싱 필름을 포함하는, 다이싱 다이본딩 필름과 상기 다이싱 다이본딩 필름을 이용하는 반도체 웨이퍼의 다이싱 방법에 관한 것이다.

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Номер записи: 59
02-12-2016 дата публикации

감광성 수지 조성물

Номер: KR0101682006B1
Автор: 조정호, 경유진, 이광주, 김영국
Принадлежит: 주식회사 엘지화학

... 본 발명은 특정 구조의 폴리이미드 수지; 광경화형 다관능 아크릴 화합물; 에폭시 수지; 및 광개시제；를 포함하는 감광성 수지 조성물과, 이러한 감광성 수지 조성물로부터 형성된 유기 절연막 또는 감광성 패턴을 포함하는 전자 소자에 관한 것으로서, 상기 감광성 수지 조성물에 의하면 반도체 장치 또는 디스플레이 장치에 사용 되는 기판에 대하여 높은 접착성을 나타내며, 우수한 기계적 물성을 가지면서도 초미세화된 패턴을 형성할 수 있는 감광성 수지를 얻을 수 있다.

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Номер записи: 60
03-09-2015 дата публикации

MANUFACTURING METHOD OF BACK SEAT OF VEHICLE AND MANUFACTURING MOLD USED FOR SAME

Номер: KR1020150101328A
Автор: LEE, KWANG JU, SEON, SEOK WOON, KIM, MIN JIN, LIM, DONG WOOK
Принадлежит:

The present invention relates to a manufacturing method of a back seat of a vehicle and a manufacturing mold used for the same. Disclosed is a manufacturing method of a back seat of a vehicle, which comprises: a coupling step for forming a manufacturing mold by coupling a mold component divided into multiple parts in a preset form; a lamination step for laminating a composite material on the outer side of the manufacturing mold coupled in the coupling step; a process step for molding a back seat unit by applying high temperatures and high pressures to the manufacturing mold laminated with the composite material inside an extra vacuum chamber and hardening the composite material; and a separation step for removing the manufacturing mold in the back seat unit gone through the process step. COPYRIGHT KIPO 2015 ...

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Номер записи: 61
08-08-2016 дата публикации

METHOD AND APPARATUS FOR MEASURING METAL ION PERMEABILITY OF POLYMER FILM

Номер: KR1020160093566A
Автор: KIM, YOUNG KOOK, KIM, JUNG HAK, KIM, HEE JUNG, KIM, SE RA, JO, JUNG HO, LEE, KWANG JOO, NAM, SEUNG HEE, HAN, JI HO
Принадлежит:

The present invention relates to a method and an apparatus for measuring the metal ion permeability of a polymer film. The method for measuring the metal ion permeability of a polymer film comprises: a step of applying voltage to a polymer film in a state that at least one surface of the polymer film comes in contact with an electrolyte containing metal ions, an organic solvent, and a water based solvent; and a step of measuring the change rate of resistance or currents according to the time of the polymer film after the voltage is applied. COPYRIGHT KIPO 2016 ...

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Номер записи: 62
07-11-2013 дата публикации

NOVEL POLYAMIC ACID, PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM AND CIRCUIT BOARD

Номер: WO2013165211A1
Автор: KIM, Jung-Hak, KYUNG, You-Jin, KIM, Hee-Jung, LEE, Kwang-Joo
Принадлежит:

The present invention relates to: a novel polyamic acid in which imidazole is introduced to polymer chains; a photosensitive resin composition containing the polyamic acid which can provide a photosensitive material satisfying the characteristics of excellent flexibility and low stiffness, and has excellent heat resistance and coating resistance; a dry film obtained from the photosensitive resin composition; and a circuit board including the dry film.

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Номер записи: 63
24-12-2014 дата публикации

PHOTOCURABLE AND THERMOSETTING RESIN COMPOSITION AND DRY FILM SOLDER RESIST

Номер: WO2014204173A1
Автор: CHOI, Byung Ju, JEONG, Woo Jae, CHOI, Bo Yun, LEE, Kwang Joo, JEONG, Min Su, KU, Se Jin
Принадлежит:

The present invention relates to a resin composition which is photocurable and thermosetting, and which comprises an acid-modified oligomer, a photo-polymerizable monomer, a thermosetting binder resin, a photoinitiator, at least two types of spherical alumina particles having mutually different particle sizes, and an organic solvent; a dry film solder resist obtained from the resin composition; and a circuit board comprising the dry film solder resist.

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Номер записи: 64
05-10-2017 дата публикации

SEMICONDUCTOR DEVICE

Номер: WO2017171367A1
Автор: KIM, Jung Hak, KIM, Hee Jung, NAM, Seung Hee, LEE, Kwang Joo, KIM, Se Ra, KIM, Young Kook
Принадлежит:

The present invention relates to a semiconductor device comprising: a first semiconductor element formed on an adherend; and an adhesive film for embedding the first semiconductor element, wherein the adhesive film satisfies a predetermined ratio between a melt viscosity and a weight reduction ratio at a high temperature.

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Номер записи: 65
08-08-2019 дата публикации

ADHESIVE FILM FOR SEMICONDUCTOR

Номер: WO2019151645A1
Автор: JANG, Jong Min, KIM, Heejung, LEE, Kwang Joo
Принадлежит:

The present invention relates to an adhesive film for a semiconductor, comprising: an adhesive binder; a first layer comprising a heat dissipating filler; and a second layer formed on at least one surface of the first layer and comprising an adhesive binder and a magnetic filler, wherein the adhesive binder included in each of the first layer and the second layer has a predetermined composition.

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Номер записи: 66
25-06-2015 дата публикации

COMPOSITION FOR FORMING DICING FILM ADHESIVE LAYER, AND DICING FILM

Номер: WO2015093794A1
Автор: KIM, Young Kook, KIM, Hee Jung, KIM, Se Ra, JO, Jung Ho, KIM, Jung Hak, NAM, Seung Hee, LEE, Kwang Joo
Принадлежит:

The present invention relates to a composition for forming a dicing film adhesive layer, a dicing film containing an adhesive layer comprising the composition, a dicing die bonding film containing the dicing film, and a method for dicing a semiconductor wafer by using the dicing die bonding film, the composition comprising: a polymer additive comprising one or more types of polymers selected from the group consisting of a polymer containing a (meth)acrylate-based functional group and a nonpolar functional group, a (meth)acrylate-based polymer containing at least one fluorine, and a silicone modified (meth)acrylate-based polymer containing a reactive functional group; an adhesive binder; and a photoinitiator, wherein the weight ratio of the polymer additive to the adhesive binder is 0.01-4.5%.

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Номер записи: 67
01-07-2016 дата публикации

ADHESIVE FILM

Номер: KR0101635265B1
Автор: 김영국, 조정호, 유영임, 김정학, 홍은기, 이광주
Принадлежит: 주식회사 엘지화학

... 본 출원은 점착 필름, 다이싱 다이본딩 필름 및 반도체 패키징 방법에 관한 것으로, 본 출원은 다이싱 공정 시에는 반도체 웨이퍼를 고정할 수 있으면서도, 다이싱 공정 후 별도의 자외선 조사 공정 없이도 점착층과 접착층의 박리가 용이하여 다이싱 공정 시 칩의 비산 또는 버 발생을 최소화할 수 있는 점착 필름 및 다이싱 다이본딩 필름을 제공할 수 있으며, 그에 따라 반도체 패키징 공정 시 생산성을 향상시킬 수 있다.

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Номер записи: 68
20-06-2019 дата публикации

DICING DIE BONDING FILM

Номер: WO2019117428A1
Автор: HAN, Ji Ho, KIM, Se Ra, SONG, Mun Seop, LEE, Kwang Joo, YU, Yeong Im
Принадлежит:

The present invention relates to a dicing die bonding film and a dicing method of a semiconductor wafer using the dicing die bonding film, the dicing bonding film comprising: a substrate; an antistatic layer formed on the substrate and including an aliphatic or alicyclic polyurethane resin and a conductive filler; an adhesive layer formed on the antistatic layer; and an adhesive layer formed on the adhesive layer.

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Номер записи: 69
11-05-2017 дата публикации

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

Номер: WO2017078469A1
Автор: KIM, Jung Hak, KIM, Hee Jung, KIM, Se Ra, JO, Jung Ho, LEE, Kwang Joo, NAM, Seung Hee, KIM, Young Kook
Принадлежит:

The present invention relates to a semiconductor device and a semiconductor device manufacturing method and, more specifically, to a semiconductor device and a semiconductor device manufacturing method, which can prevent damage to a top portion semiconductor chip even if some degree of excessive force is applied thereto during a die bonding process or a wire bonding process.

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Номер записи: 70
18-07-2019 дата публикации

METHOD FOR MANUFACTURING INSULATING LAYER FOR SEMICONDUCTOR PACKAGE, AND INSULATING LAYER FOR SEMICONDUCTOR PACKAGE, FORMED BY SAME METHOD

Номер: WO2019139274A1
Автор: JEONG, Minsu, KYUNG, You Jin, CHOI, Byung Ju, JEONG, Woo Jae, LEE, Kwang Joo, CHO, Eunbyurl
Принадлежит:

The present invention relates to: a method for manufacturing an insulating layer for a semiconductor package, wherein, in the process of manufacturing an insulating layer for a semiconductor package, pores generated in the insulating layer are removed using magnetic properties, so that the reliability of the insulating layer can be increased and the insulating layer can have excellent heat resistance; and an insulating layer for a semiconductor package, which is obtained using the method for manufacturing an insulating layer for a semiconductor package.

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Номер записи: 71
26-12-2019 дата публикации

ADHESIVE COMPOSITION

Номер: WO2019245246A1
Автор: JANG, Mi, KIM, Sera, HAN, Ji Ho, LEE, Kwang Joo, YEON, Bora, SEO, Kwang Su
Принадлежит:

The present invention provides an adhesive composition capable of exhibiting excellent adhesive strength, causing no bubbling and peeling even after high-temperature processes, and being easily separated through photo-curing in a delaminating step.

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Номер записи: 72
31-03-2017 дата публикации

다이싱 필름 및 다이싱 다이본딩 필름

Номер: KR0101722137B1
Автор: 김세라, 조정호, 김영국, 김희정, 이광주, 김정학, 남승희
Принадлежит: 주식회사 엘지화학

... 본 발명은, 기재 필름 및 점착층을 포함하고 상기 점착층의 저장탄성률이 30℃에서 3x105 내지 4x106 Pa이며 상기 점착층의 가교 밀도가 80% 내지 99%인 다이싱 필름과 상기 다이싱 필름을 포함한 다이싱 다이본딩 필름과 상기 다이싱 다이본딩 필름을 이용한 반도체 웨이퍼의 다이싱 방법에 관한 것이다.

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Номер записи: 73
17-11-2017 дата публикации

광경화성 및 열경화성을 갖는 수지 조성물 및 드라이 필름 솔더 레지스트

Номер: KR0101799094B1
Автор: 경유진, 최병주, 정우재, 최보윤, 이광주, 정민수
Принадлежит: 주식회사 엘지화학

... 본 발명은 카르복시기를 포함하고 100 내지 180 mg KOH/g의 산가를 갖는 이미노카보네이트계 화합물을 포함하는 산변성 올리고머; 2개 이상의 광경화 가능한 불포화 작용기를 갖는 광중합성 모노머; 열경화 가능한 작용기를 갖는 열경화성 바인더; 광개시제; 및 실리카 50중량% 내지 90중량%를 포함하는 무기 필러를 포함하는 광경화성 및 열경화성을 갖는 수지 조성물과 이로부터 제조되는 드라이 필름 솔더레지스트에 관한 것이다.

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Номер записи: 74
26-09-2017 дата публикации

CUSHIONING CYLINDER, WAVE DISSIPATING BLOCK STRUCTURE USING SAME, AND CONSTRUCTION METHOD THEREOF

Номер: KR101777548B1
Автор: PARK, SEOK AM, LEE, KWANG JU
Принадлежит: PARK, SEOK AM, LEE, KWANG JU

The present invention relates to a cushioning cylinder installed to prevent a wave dissipating block accumulated in a breakwater from being washed away or disturbed by a wave, a wave dissipating block structure using the same, and a construction method thereof. According to the present invention, the cushioning cylinder comprises a cylinder, a cylinder head, a cylinder cap, a piston head, a piston rod, and a cushioning member (560). The cushioning member is manufactured by being compression molded at a high temperature in a state in which nitrile butadiene rubber and nylon fiber are repeatedly stacked. According to the present invention, the wave dissipating block structure using the cushioning cylinder comprises a vertical cable, a horizontal cable, a fixing port, a sinker, the cushioning cylinder, and a tension control member. The construction method thereof is performed by a fixing port installation step, a sinker preparation step, a cushioning cylinder coupling step, a sinker drop step ...

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Номер записи: 75
08-07-2016 дата публикации

BICYCLE FRAME USING CARBON-FIBER REINFORCED COMPOSITE MATERIAL

Номер: KR1020160081266A
Автор: LEE, KWANG JU, SUNG, DAE YOUNG, KIM, MIN JIN, JO, YOUNG GI, LEE, HYUN HEE
Принадлежит:

A bicycle frame using a carbon-fiber reinforced composite material is formed into a flat plate shape with a front part of which a thickness is the same and a rear part of which a thickness becomes narrower. The bicycle frames in a pair are coupled to face each other, thereby forming a receiving space receiving a rear wheel and supporting a bicycle. The bicycle frame using the carbon-fiber reinforced composite material includes a front surface facing a front side of the bicycle and parallel to a handlebar; a rear surface arranged to be parallel to the front surface in a side opposite to the front surface and smaller than the front surface; an upper surface connected to an upper part of the rear surface, corresponding to the rear part, and having a width becoming narrower to a rear side; a front inclined surface arranged in the front surface between the front surface and the upper surface to be inclined and having a uniform width; and a second inclined surface arranged in the rear part between ...

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Номер записи: 76
16-05-2019 дата публикации

ELECTROMAGNETIC FIELD INTENSITY MEASUREMENT METHOD FOR SUBWAY SERVICE AREA AND DEVICE THEREFOR

Номер: WO2019093733A1
Автор: LEE, Kwang Ju, SONG, Jun Seok
Принадлежит:

An electromagnetic field measurement device according to the present invention: detects, from frequency distribution information acquired at regular periods, a unit band having the largest frequency component for each of subbands into which a specified target band is divided, and marks the same as a dominant band; makes a dominant band distribution table by collecting, over a period of time corresponding to a predetermined time period, the frequency distribution information including dominant bands marked for each of the subbands, and recognizes the distribution pattern of dominant bands from the dominant band distribution table; and when a particular distribution pattern corresponding to acceleration sound or the like is recognized from the distribution table, identifies the measured electromagnetic field intensity as being measured at a station or the start point of a tunnel section, on the basis of the time point when the distribution pattern appears.

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Номер записи: 77
17-05-2018 дата публикации

INSULATING LAYER MANUFACTURING METHOD AND MULTI-LAYERED PRINTED CIRCUIT BOARD MANUFACTURING METHOD

Номер: WO2018088754A1
Автор: JEONG, Woo Jae, KYUNG, You Jin, CHOI, Byung Ju, CHOI, Bo Yun, LEE, Kwang Joo, JEONG, Min Su
Принадлежит:

The present invention relates to an insulating layer manufacturing method, which enables manufacturing by a faster and simpler method so as to improve process efficiency, readily adjust the thickness of an insulating layer, and form a via hole of a high resolution without physical damage, and a multi-layered printed circuit board manufacturing method using the insulating layer acquired from the insulating layer manufacturing method.

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Номер записи: 78
20-12-2017 дата публикации

반도체 접착용 수지 조성물, 접착 필름, 다이싱 다이본딩 필름 및 반도체 장치

Номер: KR0101799499B1
Автор: 김희정, 김정학, 이광주, 김세라, 김영국, 남승희, 한지호
Принадлежит: 주식회사 엘지화학

... 본 발명은 낮은 흡습율을 갖는 열가소성 수지; 바이페닐계 에폭시 수지를 포함하는 에폭시 수지; 및 페놀 수지를 포함한 경화제;를 포함하고,고형분 중 상기 바이페닐계 에폭시 수지의 함량이 5 중량% 내지 25중량%인 반도체 접착용 수지 조성물과, 상기 반도체 접착용 수지 조성물의 경화물을 포함한 접착 필름과, 기재 필름 상기 기재 필름 상에 형성되는 점착층 및 상기 점착층상에 형성되고 상기 반도체 접착용 수지 조성물을 포함한 접착층을 포함한 다이싱 다이본딩 필름과, 상기 접착 필름을 포함한 반도체 소자에 관한 것이다.

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Номер записи: 79
27-02-2017 дата публикации

WINDOW CAPABLE OF PHOTOVOLTAIC POWER GENERATION

Номер: KR101710651B1
Автор: LEE, GWANG JU
Принадлежит: DAE KYUNG ENTERPRISE CO., LTD.

The present invention relates to a window capable of photovoltaic power generation, which is used as a common window in a common circumstance and can selectively perform photovoltaic power generation as needed, and enables a user to look at the outside from the inside when the photovoltaic power generation is not performed. The window capable of photovoltaic power generation comprises: a window frame in a rectangular shape which is installed on an outer wall; a glass window which is opened and closed with respect to a lower hinge unit as the center in the window frame; a solar cell window which is opened and closed with respect to the hinge unit as the center in the window frame; a power conversion device which is arranged in the window frame and includes an inverter which is electrically connected to a solar cell module; a battery which is arranged in an indoor space and is connected to the power conversion device; and a handle locking device which is arranged on an upper portion of the ...

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Номер записи: 80
22-12-2016 дата публикации

탄소섬유강화 복합재료를 이용한 자전거 프레임

Номер: KR0101688606B1
Автор: 이광주, 성대영, 김민진, 조영기, 이현희
Принадлежит: 한국기술교육대학교 산학협력단

... 탄소섬유강화 복합재료를 이용한 자전거 프레임은 두께가 균일한 정면 부분과 두께가 점차 감소하는 배면 부분을 구비하는 평판형상을 가지며 한 쌍이 서로 마주보도록 결합하여 뒷바퀴를 수납하는 수납공간을 형성하고 자전거를 지지한다. 상기 탄소섬유강화 복합재료를 이용한 자전거 프레임은 자전거의 정면방향을 향하며 핸들축과 평행한 정면, 상기 정면의 반대쪽에서 상기 정면과 평행하게 배열되며 상기 정면보다 작은 크기를 갖는 배면, 상기 배면의 상단에 연결되고 상기 배면 부분에 대응되며 뒤로 갈수록 폭이 좁아지는 상면, 상기 정면 부분 내에서 상기 정면과 상기 상면 사이에 경사지게 배치되며 균일한 폭을 갖는 제1 경사면, 및 상기 배면 부분 내에서 상기 배면과 상기 저면 사이에 경사지게 배치되며 뒤로 갈수록 폭이 좁아지는 제2 경사면을 포함한다.

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Номер записи: 81
04-04-2018 дата публикации

AIR LUMBAR SUPPORT STRUCTURE FOR VENTILATION OF VEHICLE SEAT

Номер: KR1020180034004A
Автор: LEE, SANG HOON, CHOI, SOK WON, YU, SUN WOONG, BUM, HYUNG TAEK, KIM, YOUNG GOO, KIM, JIN WOO, LEE, KWANG JU
Принадлежит:

The present invention relates to an air lumbar support structure for ventilation of a vehicle seat back and, more specifically, to a lumbar support structure in which ventilation is provided in a lumbar support. Therefore, air discharged from an air injector to inflate the lumbar support can be transmitted to a seat surface on which a driver sits. COPYRIGHT KIPO 2018 (AA) Inject air ...

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Номер записи: 82
18-01-2017 дата публикации

ADHESIVE COMPOSITION FOR SEMICONDUCTOR AND DICING DIE BONDING FILM

Номер: KR1020170007173A
Автор: KIM, JUNG HAK, KIM, HEE JUNG, LEE, KWANG JOO, KIM, SE RA, KIM, YOUNG KOOK, NAM, SEUNG HEE
Принадлежит:

The present invention relates to an adhesive composition for a semiconductor and a dicing die-bonding film and a dicing method of a semiconductor wafer using the dicing die-bonding film. The adhesive composition for a semiconductor comprises a thermosoftening resin with a low absorption rate; an epoxy resin which includes biphenyl-based epoxy resins with a softening point of from 50 to 100 deg. C; and a hardener which includes a novolac phenolic resin and meets level 1 in a moisture sensitivity level test of IPC/JEDEC. The dicing die-bonding film includes the adhesive composition for a semiconductor and the dicing method of the semiconductor wafer uses the dicing die-bonding film. Furthermore, the present invention has high mechanical properties, thermal resistance, shock resistance and strong adhesive ability and has a purpose of preventing a delamination of the dicing die-bonding film or reflow cracks. COPYRIGHT KIPO 2017 ...

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Номер записи: 83
14-10-2016 дата публикации

ADHESIVE COMPOSITION, DICING DIE BONDING FILM, SEMICONDUCTOR WAFER, AND SEMICONDUCTOR DEVICE

Номер: KR1020160119561A
Автор: NAM, SEUNG HEE, KIM, HEE JUNG, KIM, JUNG HAK, KIM, SE RA, JO, JUNG HO, LEE, KWANG JOO, KIM, YOUNG KOOK
Принадлежит:

The present invention relates to an adhesive composition, a dicing die bonding film, a semiconductor wafer, and to a semiconductor device. More specifically, the adhesive composition includes an epoxy resin, a thermoplastic resin, a curing agent, and a porous filler. The dicing die bonding film includes a cured product of the adhesive composition. The semiconductor wafer and the semiconductor device include the dicing die bonding film. The adhesive composition has excellent packaging reliability under a condition of high temperature and high humidity. COPYRIGHT KIPO 2016 ...

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Номер записи: 84
27-01-2016 дата публикации

MAIN POWER CONVERTER FOR VEHICLE AND OPERATING METHOD THEREOF

Номер: KR1020160009756A
Автор: CHO, SUNG JOON, JEONG, MAN KYU, LEE, KWANG JOO, PARK, GEON TAE
Принадлежит:

A method for operating a main power converter for a vehicle according to an embodiment of the present invention may include a step of determining the operation pulse mode of a converter as one of a first mode and a second mode according to information on an operation section; and a step of determining a converter switching frequency based on the determined convertor operation pulse mode. COPYRIGHT KIPO 2016 (AA) Operation section information(High speed line/normal line) (BB) High speed line (C1,C2,C3,C4,C5) Converter control unit (DD) General line (EE) T_e(Traction force command) (F1,F2) Master control unit (GG) Traction force size(kN/axle) (HH) Vehicle speed(km/h) ...

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Номер записи: 85
24-11-2011 дата публикации

PRINTED CIRCUIT BOARD INCLUDING A DAM FOR UNDERFILLS, AND METHOD FOR MANUFACTURING SAME

Номер: WO2011145828A2
Автор: CHOI, Byung-Ju, JEONG, Woo-Jae, CHOI, Bo-Yun, LEE, Kwang-Joo, JEONG, Min-Su
Принадлежит:

The present invention relates to a dam for underfills, which has excellent detectivity. For a dam which is formed in the shape of a fence around a chip to prevent the leakage of underfills filled between a substrate and the chip, a dam for underfills, which is composed of a dry-film-type solder resist, is provided.

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Номер записи: 86
27-09-2012 дата публикации

NOBLE POLYAMIC ACID, PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM, AND CIRCUIT BOARD

Номер: WO2012128526A3
Автор: KYUNG, You-Jin, KIM, Hee-Jung, LEE, Kwang-Joo, KIM, Jung-Hak
Принадлежит:

The present invention relates to a noble polyamic acid; a photosensitive resin composition which can provide a photosensitive material that satisfies the required characteristics of excellent flexibility and low stiffness and has excellent heat resistance and coating resistance; a dry film obtained from the photosensitive resin composition; and a circuit board including the dry film.

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Номер записи: 87
23-01-2019 дата публикации

절연층 제조방법 및 반도체 패키지 제조방법

Номер: KR1020190007967A
Автор: 정우재, 경유진, 최병주, 최보윤, 이광주, 정민수
Принадлежит:

... 본 발명은, 경화시 고분자 수축에 의한 휨 정도를 최소화할 수 있고, 내부에 위치하는 반도체칩의 안정성을 확보할 수 있는 절연층 제조방법 및 상기 절연층 제조방법으로부터 얻어지는 절연층을 이용한 반도체 패키지 제조방법에 관한 것이다.

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Номер записи: 88
22-07-2016 дата публикации

PEDESTRIAN SAFETY FENCE USABLE AS MEDIAN DIVIDER

Номер: KR1020160087506A
Автор: LEE, GWANG JU
Принадлежит:

The present invention relates to a pedestrian safety fence usable as a median divider which improves visibility of a pedestrian and a driver when the pedestrian walks at night, the driver drives a vehicle, or the driver drives in rain. The pedestrian safety fence usable as a median divider is a means installed on a pedestrian safety fence, a median divider of a road, or a guide rail to secure visibility of a pedestrian and a driver, and comprises: a plurality of post pipes separated from each other in a front and a rear direction and erected on the ground, wherein upper portions thereof are blocked by a cover unit; and a plurality of connection pipes connected between the post pipes. The pedestrian safety fence usable as a median divider further comprises: a vertical hole formed on one side and/or the other side of the post pipe; an LED advertisement unit which is mounted in the vertical hole to seal the vertical hole, and provides an advertising effect by light emission of an LED; an LED ...

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Номер записи: 89
04-07-2016 дата публикации

RESIN COMPOSITION FOR ADHERING SEMICONDUCTOR, ADHESIVE FILM, DICING DIE BONDING FILM AND SEMICONDUCTOR DEVICE

Номер: KR1020160078275A
Автор: KIM, HEE JUNG, KIM, JUNG HAK, LEE, KWANG JOO, KIM, SE RA, KIM, YOUNG KOOK, NAM, SEUNG HEE, HAN, JI HO
Принадлежит:

The present invention relates to a resin composition for adhering a semiconductor, an adhesive film comprising a cured product of the resin composition for adhering a semiconductor, a dicing die bonding film, and to a semiconductor device comprising the adhesive film. More particularly, the resin composition for adhering a semiconductor comprises: a thermoplastic resin having low moisture absorption; an epoxy resin including a biphenyl-based epoxy resin; and a curing agent including a phenyl resin. Among solids of the adhesive resin composition, the biphenyl-based epoxy resin constitutes 5-25 wt%. In addition, the dicing die bonding film includes: a substrate film; an gluing layer formed on the substrate film; and an adhesive layer formed on the gluing layer, and includes the resin composition. COPYRIGHT KIPO 2016 ...

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Номер записи: 90
03-03-2011 дата публикации

NOVEL POLYAMIC ACID, POLYIMIDE, PHOTOSENSITIVE RESIN COMPOSITION COMPRISING SAME, AND DRY FILM PRODUCED FROM THE COMPOSITION

Номер: WO2011025305A2
Автор: LEE, Kwang-Joo, KYUNG, You-Jin, KO, Joo-Eun, SONG, Heon-Sik, SHIM, Jung-Jin, KIM, Hee-Jung
Принадлежит:

The present invention relates to a novel polyamic acid comprising a thermopolymerizable or photopolymerizable functional group, to a photosensitive resin composition which can form a high-resolution pattern, and which has a superior property of being developable with an aqueous alkaline solution, and which can provide a cured coating film having excellent flexibility, adhesion properties, soldering-heat resistance, and pressure cooker test (PCT) resistance, and to a dry film produced from the composition.

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Номер записи: 91
16-12-2016 дата публикации

광경화성 및 열경화성을 갖는 수지 조성물 및 드라이 필름 솔더 레지스트

Номер: KR0101687394B1
Автор: 최병주, 정우재, 최보윤, 이광주, 정민수, 구세진
Принадлежит: 주식회사 엘지화학

... 본 발명은 산변성 올리고머, 광중합성 모노머, 열경화성 바인더 수지, 광개시제, 서로 다른 입경을 갖는 2종 이상의 구형 알루미나 입자, 및 유기 용매를 포함하고, 광경화성 및 열경화성을 갖는 수지 조성물과, 상기 수지 조성물로부터 얻어지는 드라이 필름 솔더 레지스트와, 상기 드라이 필름 솔더 레지스트를 포함하는 회로 기판에 관한 것이다.

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Номер записи: 92
19-08-2015 дата публикации

Photo-curable and thermo-curable resin composition, and dry film solder resist

Номер: KR0101545724B1
Автор: 정민수, 최병주, 정우재, 최보윤, 이광주
Принадлежит: 주식회사 엘지화학

... 본 발명은 플라즈마 처리 공정 등 별도의 처리 공정 없이도 표면에 미세 요철을 갖는 DFSR의 형성을 가능케 하는 광경화성 및 열경화성을 갖는 수지 조성물 및 DFSR에 관한 것이다. 상기 광경화성 및 열경화성을 갖는 수지 조성물은 카르복시기(-COOH)와, 광경화 가능한 불포화 작용기를 갖는 산변성 올리고머; 폴리이미드계 수지; 2개 이상의 광경화 가능한 불포화 작용기를 갖는 광중합성 모노머; 열경화 가능한 작용기를 갖는 열경화성 바인더; 및 광개시제를 포함하는 것이다.

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Номер записи: 93
04-08-2016 дата публикации

METHOD FOR MEASURING METAL ION PERMEABILITY OF POLYMER FILM, AND APPARATUS FOR MEASURING METAL ION PERMEABILITY OF POLYMER FILM

Номер: WO2016122263A1
Автор: KIM, Jung Hak, KIM, Young Kook, LEE, Kwang Joo, KIM, Hee Jung, KIM, Se Ra, Jo, Jung Ho, NAM, Seung Hee, HAN, Ji Ho
Принадлежит:

The present invention relates to a method for measuring the metal ion permeability of a polymer film, and an apparatus for measuring the metal ion permeability of a polymer film, the apparatus being used in the measurement and the method comprising the steps of: applying a voltage to a polymer film at a temperature of 5-250°C in a state in which one surface of the polymer film comes into contact with an electrolyte solution comprising a metal ion, an organic solvent and an aqueous solvent; and measuring the rate of change of resistance or the rate of change of voltage of the polymer film over time after the voltage is applied.

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Номер записи: 94
29-11-2012 дата публикации

METHOD FOR MANUFACTURING A GRAPHITE BLOCK

Номер: WO2012161410A1
Автор: ROH, Jae Seung, KANG, Dong Su, LEE, Kwang Joo, KIM, Jae Hong, KIM, Beom Jun, LEE, Jae Ho, SEO, Seung Kuk, AHN, Jai Sang, LEE, Hyun Yong
Принадлежит:

The present invention relates to a method for manufacturing a graphite block, and more particularly, the present invention comprises the steps of: mixing a graphite powder functioning as a filler with a coal tar pitch functioning as a binder, pulverizing the thus-obtained mixed raw material, injecting the pulverized material into a mold and performing compression molding to form a molding object, impregnating the molding object into an impregnating material, and heating the impregnated molding object.

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Номер записи: 95
29-08-2013 дата публикации

HEAT RADIATION COATING COMPOSITION, HEAT RADIATION PLATE COATED WITH SAME, AND PREPARATION METHOD THEREOF

Номер: WO2013125763A1
Автор: ROH, Jae Seung, KIM, Jae Hong, SEO, Seung Kuk, LEE, Kwang Ju, KANG, Dong Su, EOM, Woon Yong
Принадлежит:

The present invention relates to a heat radiation plate using a heat radiation coating composition containing a crystalline graphite powder, wherein the heat radiation coating composition is coated on a substrate, and magnetic fields are applied in the vertical direction of the substrate so as to vertically align the crystalline graphite powder. According to the present invention, the heat radiation plate has a remarkable heat radiating property, and thus can effectively radiate the heat generated inside various electronic devices, particularly, an LED, a solar device, and the like, thereby preventing the deterioration of parts and improving durability.

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Номер записи: 96
07-11-2017 дата публикации

내압성형공법용 몰드유닛 및 이를 이용한 내압성형공법

Номер: KR0101794331B1
Автор: 이광주, 성대영, 오동권
Принадлежит: 한국기술교육대학교 산학협력단

... 본 발명은 내압성형공법용 몰드유닛 및 이를 이용한 내압성형공법에 관한 것으로, 내부가 비어있고 상부는 개방된 틀로 형성되어, 상기 내부에 프리프레그가 상기 틀의 형상을 따라 적층될 수 있게 마련되는 베이스다이와, 내부에 유체가 주입되어 충전될 수 있는 충전공간이 구비되고 상부는 개방된 틀로 형성되어, 상기 베이스다이의 상부로부터 끼워져 상기 베이스다이의 내부에 적층된 프리프레그를 덮을 수 있게 마련되는 프레스백 및 개방된 상기 프레스백의 상부를 덮도록 상기 베이스다이의 상부에 결합되어 상기 충전공간을 밀폐시키며, 유체주입구가 구비되어 밀폐된 상기 충전공간 내로 유체를 주입시킬 수 있게 마련되는 실링커버를 포함하며, 상기 유체주입구를 통해 주입된 유체에 의해 상기 충전공간이 가압됨에 따라, 상기 프레스백이 팽창하여 상기 베이스다이 내부에 적층된 상기 프리프레그를 압착하는 것을 특징으로 하는 내압성형공법용 몰드유닛이 개시된다. 또한, 베이스다이의 형상을 따라 프리프레그를 상기 베이스다이 내부에 적층하는 적층단계와, 상기 베이스다이 상부에 프레스백을 끼워 상기 프리프레그를 덮고, 상기 베이스다이 상부에 실링커버를 결합시켜 상기 프레스백 내부에 마련된 충전공간을 밀폐시키는 실링단계와, 상기 충전공간을 가압하여 상기 프레스백을 팽창시킴으로써, 상기 베이스다이 내부에 적층된 상기 프리프레그를 압착하는 가압단계와, 상기 베이스다이, 상기 프레스백, 상기 실링커버의 결합을 통해 상기 프리프레그가 내부에서 압착된 상태를 유지하도록 마련된 몰드유닛을 드라이오븐에 넣어 가열하는 가열단계와, 상기 몰드유닛을 상기 드라이오븐으로부터 꺼내어 상온에서 냉각시키는 냉각단계 및 상기 충전공간에 가해진 압력을 제거하고, 상기 몰드유닛을 해체하여 성형품으로 성형된 상기 프리프레그를 얻어내는 해체단계를 포함하는 내압성형공법이 개시된다.

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Номер записи: 97
22-09-2016 дата публикации

다이싱 필름 및 다이싱 다이본딩 필름

Номер: KR0101659057B1
Автор: 조정호, 김희정, 김세라, 이광주, 김정학, 김영국
Принадлежит: 주식회사 엘지화학

... 본 발명은, 기재 필름과 상기 기재 필름의 적어도 일면 상에 형성된 점착층을 포함하고, ASTM D624 Trouser 방법에 의하여 300mm/min 속도에서 측정한 상기 기재 필름의 인열강도(tear force)가 200gf 이하인 다이싱 필름에 관한 것이다.

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Номер записи: 98
26-05-2016 дата публикации

RESIN COMPOSITION FOR SEMICONDUCTOR ADHESION, AND ADHESIVE FILM FOR SEMICONDUCTOR

Номер: WO2016080731A1
Автор: KIM, Hee Jung, KIM, Se Ra, KIM, Jung Hak, LEE, Kwang Joo
Принадлежит:

The present invention relates to: a resin composition for semiconductor adhesion, containing a (meth)acrylate-based resin comprising 17 wt% or more of a (meth)acrylate-based repeating unit comprising an epoxy-based functional group, an epoxy resin having a softening point of 70°C or higher and a phenolic resin having a softening point of 105°C or higher, and having a ratio of 0.48-0.65 of the weight of the (meth)acrylate-based resin to the total weight of the (meth)acrylate-based resin, the epoxy resin and the phenolic resin; an semiconductor adhesive film obtained from the resin composition; a dicing die bonding film comprising an adhesive layer comprising the semiconductor adhesive film; a semiconductor wafer containing the dicing die bonding film; and a semiconductor wafer dicing method using the dicing die bonding film.

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Номер записи: 99
11-05-2017 дата публикации

드라이 필름 솔더 레지스트의 제조 방법과, 이에 사용되는 필름 적층체

Номер: KR0101734425B1
Автор: 정민수, 경유진, 최병주, 정우재, 최보윤, 이광주, 구세진
Принадлежит: 주식회사 엘지화학

... 본 발명은 보다 단순화된 방법으로 표면에 미세 요철을 갖는 드라이 필름 솔더 레지스트의 형성을 가능케 하는 드라이 필름 솔더 레지스트의 제조 방법과, 이에 사용되는 필름 적층체에 관한 것이다. 상기 드라이 필름 솔더 레지스트의 제조 방법은 소정의 광경화성 및 열경화성을 갖는 수지 조성물을, 표면에 평균 조도(Ra)가 200nm 내지 2㎛인 미세 요철이 형성된 투명 캐리어 필름 상에 형성하는 단계; 기판 상에 상기 수지 조성물을 적층하여 기판, 수지 조성물 및 투명 캐리어 필름이 순차 형성된 적층 구조를 형성하는 단계; 상기 수지 조성물에 노광하고, 투명 캐리어 필름을 박리하는 단계; 및 비노광부의 수지 조성물을 알칼리 현상하고, 열경화하는 단계를 포함한다.

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Номер записи: 100