PHOTOSENSITIVE RESIN COMPOSITION WHICH IS CURABLE AT A LOW TEMPERATURE, AND DRY FILM PRODUCED USING SAME

The present invention relates to a photosensitive resin composition comprising: a polyamic acid having a repeat unit having a specific structure; a heterocyclic amine compound; a (meth)acrylate compound having a carbon-carbon double bond; a photopolymerization initiator; and an organic solvent, as well as to a dry film produced from the composition. The photosensitive resin composition is curable at a low temperature, and thus ensures safety for processes and working convenience, and not only has superior heat resistance and mechanical and physical properties, but also has characteristics such as superior flexibility, soldering heat resistance, pattern-filling characteristics, etc.