Лаковая композиция

Изобретение относится к лакокрасочным покрытиям, в частности к лаковым композициям с высокими электроизоляционными свойствами и низкой влагопроницаемостью, предназначенным для защиты плат печатного монтажа и элементов радиоэлектронной аппаратуры (РЭА), и может быть использовано в авиастроении, ракетно-космической, машиностроении и других отраслях промышленности. Лаковая композиция содержит полуфабрикат лака и отвердитель. Полуфабрикат лака содержит фторсополимер - продукт сополимеризации мономеров трифторхлорэтилена с алкилвиниловыми и гидроксилвиниловыми эфирами в соотношении 22,4:8,8:8,8, модификатор полиорганосилоксан К-9 марки А , органический растворитель ксилол. В качестве отвердителя лаковая композиция содержит полиизоцианатбиурет, при следующем соотношении компонентов, масс. %: фторсополимер 60-85, модификатор 4-14, отвердитель 5-25, органический растворитель 5-30. Лаковая композиция является композицией холодного отверждения, процесс отверждения которой протекает при температуре ...

СПОСОБ ИЗГОТОВЛЕНИЯ ГИБКИХ ЭЛЕКТРОННЫХ СХЕМ, ИМЕЮЩИХ КОНФОРМНЫЕ МАТЕРИАЛЬНЫЕ ПОКРЫТИЯ

Предложен способ изготовления гибкой электронной схемы. Способ включает образование формы из позитивного фоторезиста на гибкой полимерной подложке, имеющей множество металлических дорожек, нанесение конформного материального покрытия поверх формы из позитивного фоторезиста, гибкой полимерной подложки и металлических дорожек, удаление излишка конформного материального покрытия путем выполнения прохода ножевого полотна над формой из позитивного фоторезиста, удаление формы из позитивного фоторезиста для открывания полости, заданной конформным материальным покрытием, подачу анизотропной проводящей пасты в полость, вставление кристалла в полость и присоединение кристалла к проводящим дорожкам. Изобретение обеспечивает более точный контроль толщины конформного материального покрытия. 3 н. и 15 з.п. ф-лы, 14 ил.

СВЕТОДИОДНЫЙ МОДУЛЬ И СПОСОБ ГЕРМЕТИЗАЦИИ

Способ нанесения фоторезиста на подложку печатной схемы с отверстиями

Struktur und Verfahren zum Verhindern von Kurzschlüssen von Farbstoff und mit dem Druckkopf verbundenen Leitern

METHOD OF MAKING PRINTED CIRCUITS

KUPFERKASCHIERTE LAMINIERTE PLATTE, LEITERPLATTE UND VERFAHREN ZUR HERSTELLUNG

MEHRSCHICHTIGE LEITERPLATTE

Contactless chip card manufacturing method

The manufacturing method has a conductive adhesive (9) applied via a dosing device to the surface of an antenna contact surface (20) incorporated in the card body, for securing a chip module contact surface, the height of the applied conductive adhesive measured via an electrode (35) displaced perpendicular to the chip card surface, with a voltage applied across the antenna contact surface and the measuring electrode, for providing a voltage discharge in the gas-filled space between the measuring electrode and the deposited conductive adhesive. An Independent claim for a device for a manufacture of chip cards is also provided.

GEDRUCKTE SCHALTUNG.

Verfahren zur Herstellung von Leiterplatten und Leiterplatte

Dargestellt und beschrieben ist eine Leiterplatte mit einem Basismaterial (2) aus Isolierstoff als Träger von Leiterbahnen (3), wobei die fertigen Leiterbahnen (3) eine Dicke von mindestens 100 mum aufweisen, sowie ein Verfahren zur Herstellung einer derartigen Leiterplatte (1). DOLLAR A Mit dem erfindungsgemäßen Verfahren kann eine Leiterplatte durch folgende Schritte sehr einfach und zuverlässig hergestellt werden: DOLLAR A È Strukturieren der Leiterfolienschicht zur Erzeugung der Leiterbahnen, DOLLAR A È Verpressen mit einem isolierenden Füllmaterial, so daß sowohl die Kanäle zwischen den Leiterbahnen mit dem Füllmaterial vollständig gefüllt als auch die Oberfläche der Leiterbahnen von dem Füllmaterial bedeckt sind, und DOLLAR A È Anbinden der im Inneren der Leiterplatte angeordneten Leiterbahnen an Anschlußflächen auf der Oberfläche der Leiterplatte durch Bohren und Metallisieren von Löchern.

Thick film circuit board useful as an IC substrate installed in an automobile engine compartment

A circuit board has a conduction suppressing agent between silver-containing wiring portions to prevent conduction in the silver deposited on the substrate between the wiring portions. Independent claims are also included for the following: (i) an insulating paste composition containing a potassium compound; (ii) a conductive paste composition comprising a dispersion of silver-containing metal powder and an inorganic binder in an organic vehicle and which also contains a potassium compound; (iii) a conductive paste composition comprising an organic dispersion of silver-containing metal powder and an inorganic binder formed of a substance which prevents evaporation of the silver from the metal powder; (iv) a conductive paste composition comprising a dispersion of silver-containing metal powder in an organic vehicle; (v) an insulating paste composition which is used between the wiring portions of the above circuit board and which comprises the conduction suppressing agent; (vi) a conductive ...

VERFAHREN ZUR HERSTELLUNG EINER ELEKTRONISCHEN BAUGRUPPE

Halbleitervorrichtung und Halbleitervorrichtungs-Herstellverfahren

Es wird eine Halbleitervorrichtung bereitgestellt, um ein Knicken eines Anschlussstifts in der Halbleitervorrichtung mit einer Leiterplatte, in der der Anschlussstift eingepresst wird, zu verhindern, wobei die Halbleitervorrichtung eine Leiterplatte, mehrere in die Leiterplatte eingepresste Stifte, einen Harzblock, in dem mehrere Durchgangslöcher ausgebildet sind, wobei die mehreren Stifte jeweils in die mehreren Durchgangslöcher eingepresst sind, und ein Harzgehäuse, das mindestens einen Teil der Leiterplatte und des Harzblocks abdeckt, umfasst.

Elektronikmodul und Verfahren zum Herstellen eines Elektronikmoduls mit einem fluiddichten Gehäuse

Es wird ein Elektronikmodul (1) beschrieben, aufweisend eine erste Leiterplatte (2) mit elektronischen Bauelementen (3), Abstandshalter (4), die zumindest in Eckbereichen der ersten Leiterplatte (2) aufliegend angeordnet sind, eine Deckelplatte (6), wobei die Deckelplatte (6) auf den Abstandshaltern (4) angeordnet ist, und eine Vergussmasse (7), die als stirnseitiger Verschluss eine durch die Abstandshalter (4) erzeugte Beabstandung zwischen Leiterplatte (2) und Deckelplatte (6) zu einem Gehäuse (26) für die darin angeordneten elektronischen Bauelemente (3) abdichtet. Die Erfindung zeichnet sich dadurch aus, dass die Vergussmasse (7) an der Leiterplatte (2) stoffschlüssig die Deckelplatte (6) sichert, wobei der thermische Längenausdehnungskoeffizient (CTE) von der Vergussmasse (7) im Wesentlichen mit den thermischen Längenausdehnungskoeffizienten (CTE) von der Leiterplatte (2) und der Deckelplatte (6) übereinstimmt.

Method for increasing thermal mechanical resistance of ceramic substrate for mounting electrical components, involves covering edges of metallization layer by applying electrical isolation fill material between edges and substrate

The method involves forming a metallization layer (6) of thickness of 100mu m, on a substrate (5) made of ceramic material. The edges of the metallization layer are patterned. The edges of the metallization layer are covered by applying electrical isolation fill material (8) between the edges of the metallization layer and substrate. An independent claim is included for material composite of ceramic substrate.

Verfahren zum Verbinden einer integrierten Schatung mit einem Substrat und elektronische Schaltungsanordnung

Method for fitting a circuit arrangement with electronic components

Published without abstract.

ELEKTRISCHES NETZWERK

Harzgegossene Platte

Verfahren zur Herstellung von elektrischen Anschluessen

Verfahren zum Verbinden einer Edelmetalloberfläche mit einem Polymer

Verfahren zum Verbinden einer Edelmetalloberfläche eines Halbleitermaterials oder eines Schaltungsträgers mit einem Polymer mit den Schritten:Abscheiden einer Schicht (3) aus 20% bis 40% Gold und 80% bis 60% Silber auf einen Träger,selektives Entfernen des Silbers zur Erzielung einer nanoporösen schwammartigen Goldschicht (4),Auftragen eines flüssigen Polymers, wobei das flüssige Polymer in die nanoporöse schwammartige Goldschicht (4) eindringt und eine dreidimensionale Grenzfläche mit mechanischer Verzahnung zwischen der nanoporösen schwammartigen Goldschicht (4) und dem flüssigen Polymer gebildet wird,Aushärten des flüssigen Polymers zur Erzeugung einer Polymerschicht (5).

Tintenstrahlpatrone und Verfahren zum Identifizieren der Farbe von deren Tinte durch eine flexible Leiterplatte

Eine Tintenstrahldruckpatrone und ein Verfahren zum Identifizieren der Farben von darin enthaltener Tinte durch eine flexible Farb-PCB werden offenbart. Die Tintenstrahlpatrone umfasst ein Gehäuse und eine flexible Leiterplatte (PCB). Das Gehäuse weist einen Tintenbehälter zum Enthalten von Tinte auf. Die flexible PCB, die am Gehäuse angeordnet ist, umfasst ein flexibles Substrat, eine Leiterbahn und eine Drucktintenschicht, wobei das flexible Substrat eine erste Oberfläche aufweist und die Leiterbahn auf dieser ausgebildet ist. Die Drucktintenschicht ist auf der ersten Oberfläche des flexiblen Substrats ausgebildet und die erste Oberfläche ist teilweise mit der Drucktintenschicht bedeckt, um Teile der Leiterbahn freizulegen. Mindestens eine identifizierbare Fläche ist auch auf der Drucktintenschicht zur Identifikation ausgebildet, wobei die Farbe der identifizierbaren Fläche der Farbe der Tinte im Tintenbehälter zugeordnet ist.

Making printed circuit boards

An insulating substrate (10) coated with a thin copper layer is drilled to form through holes (16) and etched to define a circuit pattern (15). A liquid photopolymer solder mask layer ( 1) having a smooth planar outer surface is applied over the circuit pattern and processed to expose land areas (14) surrounding the through holes (16), the walls (18) of the solder mask surrounding the lands (14) being substantially cylindrical and roughened. A thin copper layer (20) is then applied by electroless deposition overall the exposed surfaces and an insulating resist layer (13) is applied over the copper on the planar surface of the mask (11). A thick copper layer is electroplated onto the copper coating in the through hole (16) and the resist (13), together with the underlying copper layer (20), is mechanically removed. The land (14) then forms the bottom surface of an indentation having copper coated sidewalls. ...

A method of producing a printed circuit board

Flexible coil structure

A flexible coil structure 400 or a method of manufacturing the same comprises a magnetic core 410 and a pair of flexible insulating sheets 110 each with a plurality of parallel conductive lines 210, 220 formed there on. The magnetic core 410 is sandwiched between the insulating sheets 110 and the conductive lines 210, 220 are arranged and interconnected to form a coil around the magnetic core and insulating sheet sandwich. The interconnections 420 formed between the conductive lines may be made via openings formed in the insulating sheets. These openings may be formed by removing a portion of an insulating sheet which corresponds with each end region of the conductive lines or by removing a portion which exposes one end region of all of the conductive lines. The interconnections my involve solder coating, dipping, printing or ball array techniques and / or metal build-up and ultrasonic welding techniques. The insulating sheets may have alignment markers 240 and the conductive lines may ...

FLEXIBLE CIRCUIT CONNECTIONS

Improvements relating to adjustable antennas

Process for making a printed circuit board partially coated with solder

A process for making a printed circuit board with partial land areas coated with solder has the steps of coating the printed circuit board with solder, applying print ink or dry film resist onto the land areas 30 for a tape carrier package (TCP), removing solder outside the land areas 30, applying a layer of immersion nickel/gold or anti-oxidant agent on the land areas outside the land areas 30, thus forming a printed circuit board having partial land areas coated with solder. The process overcomes the conventional drawbacks that neither the print ink nor dry film resist effectively covers circuitry and areas defining through-holes.

Edge detection

Controlling the deposition of sealant material at one or more edges of a substrate 3 of an electronic apparatus on the basis of one or more detectable marks 7 (see figure 5). The detectable marks having at least one edge that coincides with a part of at least one of said one or more edges of the substrate. The mark provides an input to a controller for adjusting the position of the application needle 30 so as to accurately deposit the sealant 24. These marks may be located at the corner of the substrate. The detectable marks are made on the substrate before it is cut; these have a large enough size to allow for any size variation in the apparatus after the cutting process. The marks may be part of the patterned layer that also defines the conductive elements for one level of an array of electronic devices.

PRINTED CIRCUIT BOARD

... 1451127 Printed circuits MATSUSHITA ELECTRIC INDUSTRIAL CO Ltd 17 May 1974 22170/74 Heading H1R A printed circuit board formed with conductors wholly or in part of silver on an insulant substrate, e.g. alumina or other ceramic, glass, phenolic resin, imprengated paper, epoxy impregnated glass cloth; is provided with an underlayer of insulant resin between conductors and substrate and an overlayer of resin over the conductors; the resin being doped with an organic inhibitor discouraging migration of silver. The substrate may have conductively coated through holes and be planar, spherical, cylindrical or rod-shaped. A flat printed circuit board 1 has silver electrodes 3 on the surface 2 thereof over an underlayer 4, and an overlayer 5 is applied thereto (Fig. 3) the underlayer being formed by screen printing with epoxy resin and heat curing, after which the electrodes 3 are screen printed with resin based silver paint and heat cured. The overlayer is formed by screen printing with epoxy resin ...

PROCEDURE AND DEVICE FOR THE ISOLATION OF ELECTROTECHNICAL CONSTRUCTION UNITS

PRINTED CIRCUIT BOARD WITH AT LEAST AN ELECTRONIC CONSTRUCTION UNIT

VERFAHREN ZUR HERSTELLUNG EINES LOTABWEISENDEN SCHUTZES AUF LEITERPLATTEN MIT DURCHGEHENDEN LOCHERN

PROCEDURE AND MACHINE TO THE PRODUCTION OF ELECTRICAL CIRCUITS

HARDENABLE RESIN COMPOSITION TO INK RADIATION PRINTINGS, FROM IT WINNING HARDENED OBJECT AND FROM IT WON PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD WITH AT LEAST STARING AND AT LEAST A FLEXIBLE RANGE AS WELL AS PROCEDURE FOR THE PRODUCTION OF RIGID-FLEXIBLE PRINTED CIRCUIT BOARDS

Verfahren zur Herstellung eines mehrlagigen Funktionsbauteiles sowie Funktionsbauteil

Die Erfindung betrifft ein Verfahren zur Herstellung eines mehrlagigen Funktionsbauteiles (1), welches ein integriertes Funktionselement (4), etwa eine elektrische Leiterbahn, aufweist, wobei zur Bildung des Funktionsbauteiles (1) das Funktionselement (4) auf eine Basiskörperoberfläche eines, insbesondere metallischen, Basiskörpers (3) aufgebracht wird, wonach zumindest eine Abdecklage (6) auf die Basiskörperoberfläche aufgebracht wird, welche das Funktionselement (4) bedeckt. Um das Funktionsbauteil aufwandsarm und mit optimierter Einsatzfähigkeit herzustellen, ist erfindungsgemäß vorgesehen, dass zumindest eine Opferdünnschicht (5) im Funktionsbauteil (1) angeordnet wird, um bei einem Aufbringen von Aufbringmaterial auf einen Oberflächenabschnitt einer Funktionsbauteilstruktur (2) des Funktionsbauteiles (1) zur Bildung des Funktionsbauteiles (1) ein auf einer dem Oberflächenabschnitt abgewandten Seite der Opferdünnschicht (5) befindliches Funktionsbauteilmaterial der Funktionsbauteilstruktur ...

SUBSTRATES WITH INVISIBLE ELECTRICAL CONDUCTIVE ONE LAYERS

THERMALHARDENABLE RESIN COMPOSITION

Strukturierung der Lötstoppmaske von Leiterplatten zur Verbesserung der Lötergebnisse

System umfassend eine Trägerplatte (16) und zumindest einen an der Trägerplatte (16) montierten elektronischen Bauteil (10), wobei die Trägerplatte (16) zumindest eine Trägerplattenkontaktfläche (2, 2a, 2b) und das elektronische Bauteil (10) zumindest eine dazu korrespondierende Bauteilkontaktfläche (11) aufweist, wobei die zumindest eine Trägerplattenkontaktfläche (2, 2a, 2b) zumindest teilweise von dem zumindest einen elektronischen Bauteils (10) überdeckt und von einer Lötstopplackschicht (12) umgeben ist, die die zumindest eine Trägerplattenkontaktfläche (2, 2a, 2b) begrenzt, wobei in der Lötstopplackschicht (5) zumindest eine kanalartige Aussparung vorgesehen ist, durch die zumindest eine Hilfskontaktfläche (3a, 3b) ausgebildet ist, welche die zumindest eine Trägerplattenkontaktfläche (2, 2a, 2b) kontaktiert, wobei zumindest die Trägerplattenkontaktfläche (2, 2a, 2b), die Bauteilkontaktfläche (11) und die Hilfskontaktfläche (3a, 3b) eine benetzbare Oberfläche aufweisen.

ELEMENT ARRANGEMENT WITH STARING SUBSTRATE.

PROCEDURE FOR THE PRODUCTION OF RELEASE STOP MASKS ON PRINTED CIRCUITS

AN ELECTRICAL PROTECTION AND PROTECTIVE CIRCUIT

MONOLITHIC MICROELECTRONIC CIRCUIT MODULES FROM LIQUID CRYSTAL POLYMER

Method for producing a contactless ticket comprising a chip

METHOD FOR MANUFACTURE OF PRINTED CIRCUIT BOARDS

PRINTED CIRCUIT BOARDS

METHOD AND DEVICE FOR COATING PRINTED BOARDS WITH SOLDER STOP LACQUERS AND GALVANORESISTS THAT CAN BE LASER-STRUCTURED AND THERMALLY HARDENED

PROBE FOR IN-CIRCUIT EMULATOR

METHOD FOR FORMING HOUSINGS FOR ELECTRONIC COMPONENTS AND ELECTRONIC COMPONENTS THAT ARE HERMETICALLY ENCAPSULATED THEREBY

Masks for use in applying protective coatings to electronic assemblies, masked electronic assemblies and associated methods

One or more masks may be used to control the application of protective (e.g., moisture-resistant, etc.) coatings to one or more portions of various components of an electronic device during assembly of the electronic device. A method for applying a protective coating to an electronic device includes assembling two or more components of the electronic device with one another. A mask may then be applied to the resultingelectronic assembly. The mask may shield selected portions of the electronic assembly, while other portions of the electronic assembly, i.e., those to which a protective coating is to be applied, may remain exposed through the mask. With the mask in place, application of a protective coating to portions of the electronic assembly exposed through the mask may commence. After application of the protective coating, the mask may be removed from the electronic assembly. Embodiments of masked electronic assemblies are also disclosed.

SOLDER MASK VACUUM LAMINATOR CONVERSION

PROCESS FOR MANUFACTURING PRINTED CIRCUIT BOARDS

Printed circuits are fabricated by a process which employs initial chemical deposition of copper on a predrilled substrate followed by electroplating build-up of conductors to desired pattern. The conductors are then passivated by thinly plating them with a mechanically durable, chemically passive metal. To provide solder compatibility in areas where connections are to be made to the printed circuits, a plating of tin/lead is applied in those areas while masking all other areas to eliminate plating. The remaining exposed copper is then etched away. An insulating solder mask is then applied.

STRIPLINE CABLE WITH REDUCED CROSSTALK

STRIPLINE CABLE WITH REDUCED CROSSTALK A transmission line having substantially reduced far-end forward wave crosstalk is characterized by a single layer of dielectric material having a thickness chosen to provide a forward wave coupling constant KF substantially equal to zero. In one embodiment, the dielectric layer is located on a ground plane, and has a plurality of signal carrying conductors embedded in it. The thicknesses of the dielectric layer above and below the signal carrying conductors are carefully chosen to provide a transmission line having selected values of impedance, etc. and substantially reduced forward wave crosstalk. The ground plane and the signal carrying conductors can be superconductors.

METHOD OF INDUCING FLOW OR DENSIFICATION OF PHOSPHOSILICATE GLASS FOR INTEGRATED CIRCUITS

METHOD OF INDUCING FLOW OR DENSIFICATION OF PHOSPHOSILICATE GLASS FOR INTEGRATED CIRCUITS Reda Razouk Phosphorus-doped silicon oxide glass is flowed on an integrated circuit by raising the pressure in which that integrated circuit is placed above atmospheric for a selected period of time and heating said phosphosilicate glass to a selected temperature sufficient to cause said glass to flow at said pressure. The atmosphere in which the device is placed includes moisture to enhance the flow of the glass at temperatures substantially beneath those at which dopants in the underlying integrated circuit move. The result is that the electrical characteristics of the integrated circuit are not substantially altered during glass flow.

METHOD OF MANUFACTURING PRINTED WIRING BOARDS

METHOD OF MANUFACTURING PRINTED WIRING BOARDS BY JAMES ALLAN COPPIN An improved method of manufacturing a printed wiring board having the characteristics of one with a solder mask over bare copper for circuit traces and ground planes. The method includes the step of electroplating a very thin coating of tin-lead over the circuit traces, ground planes, holes and circuit pads prior to selectively coating only the pads and holes with a relatively thick coating of tin-lead solder plate. After removing the plating resist which defines the areas for selective solder coating, the board is chemically etched and then mechanically scrubbed to roughen the surface of and reduce the thickness of the thin solder plate. A solder mask may be applied over circuit traces and ground planes prior to reflowing the thick coating of solder plate. Assembled printed wiring boards may then be wave soldered without wrinkling of the solder mask.

METHOD OF MAKING ELECTRICALLY CONDUCTIVE PATTERNS

A method of making a pattern of an electrically conductive material such as a printed circuit comprises (i) electrodepositing on an electrically conductive surface a film of an organic polymer having, per average molecule, more than one reactive functional group, (ii) forming on the electrodeposited film a predetermined pattern of a heat-curable resist having, per average molecule, more than one group reactive with the reactive groups in the electrodeposited film on heating, thereby leaving predetermined areas of the electrodeposited film uncovered, (iii) removing the uncovered areas of the electrodeposited film by treatment with a solvent therefor, thereby forming a surface comprising bare conductive material in predetermined areas and, in other predetermined areas, conductive material coated by areas of the electrodeposited film covered by the resist, and (iv) heating to complete adhesion of the resist to the electrically conductive surface through the areas of the electrodeposited film ...

PROCESS FOR MANUFACTURING PRINTED CIRCUIT BOARDS

POROUS BOTTOM-LAYER DIELECTRIC COMPOSITE STRUCTURE

HEATING FABRIC AND METHOD FOR FABRICATING THE SAME

Disclosed herein is a heating fabric. The heating fabric according to the present invention comprises: a base layer composed of a synthetic, regenera ted or natural fiber; a conductive layer formed on the base layer to be capa ble of being freely formed by a pre-designed electric pattern; a heating lay er wholly or partially in contact with an upper surface, a lower surface, or the same surface thereof as a line or a surface; and an insulating layer fo rmed on the conductive layer and the heating layer.

METAL BASE CIRCUIT BOARD

Provided is a metal base circuit board having a new function of a light r eflection in addition to the conventional printed circuit board function for mounting electronic parts. The metal base circuit board has a circuit arran ged on a metal plate via an insulation layer. A white film is arranged at le ast on the insulation layer.

HALO-HYDROCARBON POLYMER COATING

In some embodiments, a printed circuit board (PCB) comprises a substrate comprising an insulating material. The PCB further comprises a plurality of conductive tracks attached to at least one surface of the substrate. The PCB further comprises a multi-layer coating deposited on the at least one surface of the substrate. The multi-layer coating (i) covers at least a portion of the plurality of conductive tracks and (ii) comprises at least one layer formed of a halo-hydrocarbon polymer. The PCB further comprises at least one electrical component connected by a solder joint to at least one conductive track, wherein the solder joint is soldered through the multi-layer coating such that the solder joint abuts the multilayer coating.

GLASS MATERIAL FOR USE AT HIGH FREQUENCIES

The aim of the invention is to improve the high-frequency characteristics of high-frequency substrates or high-frequency conductor assemblies. To achieve this, the invention provides a glass material for producing insulation layers for high-frequency conductor assemblies. Said material is applied as a layer, in particular with a layer thickness ranging between 0.05 .mu.m and 5 mm, with a tangent of loss angle tan.delta. in at least one frequency range above 1 GHz of less than or equal to 70*10-4.

PROCESS FOR MANUFACTURING PRINTED CIRCUITS EMPLOYING SELECTIVE PROVISION OF SOLDERABLE COATING

The areas of a printed circuit where electrical components are to be solder connected, such as throughholes, surrounding pads and surface mount areas, are selectively provided with a metal coating (e.g., tinlead) which preserves and promotes solderability thereat, by a process in which a photoimageable electrophoretically deposited organic resin is used to provide, on an already patterned surface, an additional resist pattern which selectively exposes areas on which the solderable metal coating is to be provided and in which the resist serves also as an etch resist for metal areas over which it is arranged.

MULTI-LAYER WIRING BOARD AND A MANUFACTURING METHOD THEREOF

A multi-layer wiring board has at least one stacking block with an insulating hard substrate, a grounding layer being provided in the insulating hard substrate. A plurality of wiring layers are provided over upper and lower major surfaces of the insulating hard substrate. A plurality of throughholes are provided in the insulating hard substrate for connecting wiring layers on the top and bottom surfaces of the substrate. A base block has an insulating base board, and at least one wiring layer provided over one major surface of the insulating base board. Connections electrically and mechanically connect the at least one stacking block and the base block. The stacking block and the base block may be simultaneously manufactured in parallel with others. The stacking block and the base block may be adhered to each other by an adhesive layer. Each electrical connection between the stacking block and the base block may be achieved with bumps and pads.

FINE-PITCH ELECTRODE, PROCESS FOR PRODUCING THE SAME, AND FINE-PITCH ELECTRODE UNIT

A fine pitch electrode is provided in which fine electrode lines are disposed at even intervals and with high precision, and which has improved productivity and quality. The fine-pitch electrode 11 comprises a plurality of fine electrode lines 12, each of which is coated around its periphery with a coating film which is made of an electrical insulator, and a sealing member 19 in which a plurality of the fine electrode lines 12 are disposed on a plane and which is molded so as to incorporate the fine electrode lines 12.

Procédé de fabrication d'un panneau comprenant un circuit électrique

Eingeebnete, gedruckte Schaltung

Verfahren zur Herstellung eines dünnen, gleichmässigen Überzugs auf einem Träger, insbesondere für elektronische Schaltungen

Verfahren zum Herstellen einer gedruckten Leiterplatte

Verfahren zum Herstellen einer gedruckten Leiterplatte

Verfahren zur Herstellung einer Leiterplatte

Anordnung mit Überspannungsableitern zum Einbau in Anlagen der Nachrichtentechnik, insbesondere in Garnituren und Endgestellen von Fernmeldekabelanlagen

Verfahren zur Herstellung von mit Leiterbahnen versehenen Schaltungsplatten mit metallisierten Bohrungen unter Verwendung metallkaschierter Isolierstoffplatten

Verfahren zum Herstellen von Oberflächenüberzügen

Verfahren zur Herstellung von gedruckten Leiterplatten

Procedimento per rivestire circuiti stampati o strati di fondo di circuiti stampati e circuiti ottenuti col procedimento

Method of producing multilayer printed circuit boards

The fabrication of multilayer pcbs with their connections via through contacts (9) is tricky. The contacting cross-section (10) is small. Testing can only be done at the end, and corrections, e.g. breaking links, are by then almost never possible. A method which offers more reliability was therefore sought. For this purpose, the ultra-sound metal welding method is used. The layers are joined to each other so that they conduct, using a preform (3, 4, 5, 12). If another through contact is necessary, the sounded intermediate ring (4) provides a reliable contacting surface. The sound points or assembly steps can be continuously tested, and steps taken. ...

PROCEDURE FOR THE PRODUCTION OF PRINTED CIRCUITS.

Flexible printed board and method of manufacture.

Procedure for the attachment of laminar electronic elements, like solar cells, on a flexible planar formation.

Die Erfindung betrifft ein Verfahren zum Anbringen eines flächigen elektronischer Bauelements (12), insbesondere einer photovoltaischen Zelle, auf einem flexibles Flächengebilde (11), die Verwendung einer programmgesteuerten Stickmaschine, ein flexibles Flächengebilde (11) mit mindestens einem elektronischen Bauelement (12) und ein Solarmodul. Auf dem flexiblen Flächengebilde ist mindestens eine Leiterbahn (14, 15) aufgestickt, wobei eine erste Leiterbahn (14) nur ein erstes Oberflächensegment, insbesondere die Unterseite, von dem Bauelement (12) und eine zweite Leiterbahn (15) nur ein zweites Oberflächensegment, insbesondere die Oberseite, desselben Bauelements kontaktiert.

Method for dividing a large substrate into smaller ones and method for controllably selectively depositing a sealant material

A technique comprising: forming a plurality of smaller substrates from one or more larger substrates by a reduction process according to which there is some possible variation size between the smaller substrates within a variation range; and, in advance of said reduction process, providing said one or more larger substrates with one or more detection marks whose size and location are selected such that after the reduction process each smaller substrate includes a portion of at least one of said one or more detection marks, said portion having one or more edges that coincide with at least a part of one or more edges of the smaller substrate whatever actual size the smaller substrate has within said variation range.

Intelligent switch production process based on wave soldering

Wiring base board and its producing method, semiconductor device and electronic machine

Signal line circuit device

Flexible printed circuit board

Photosensitive resin composition, dry film, cured product, printed circuit board, semiconductor element and electronic component

Suspension board with circuits and method for manufacturing the same

A thick portion having a first thickness and a thin portion having a second thickness on a base insulating layer are formed on a conductive support substrate. The second thickness is smaller than the first thickness. A boundary surface is formed between an upper surface of the thick portion and an upper surface of the thin portion. A boundary line between the upper surface of the thick portion and the boundary surface extends in a first direction. Write wiring traces and read wiring traces are formed to extend on the thick portion and the thin portion of the base insulating layer. The lateral sides of the write wiring traces and the read wiring traces extend in a second direction that intersects with the first direction, and the second direction forms an angle of not less than 60 degrees and not more than 90 degrees with the first direction.

Interconnecting board and three-dimensional wiring structure using it

A first circuit board (1) mounted with an electronic component (16) and a second circuit board (2) are vertically connected three-dimensionally through an interconnecting board (3) wherein the terminal portion (6) of the land electrode (5) on the interconnecting board (3) is buried in the termination material (9) of the interconnecting board (3). Consequently, the chance of peeling or cracking due to peeling stress or shearing stress acting between the upper/lower circuit boards and the land electrode by high density mounting, thermal shock or falling impact can be suppressed or buffered resulting in high reliability.

半导体装置及其制造方法、电路基板和电子装置

... 在半导体装置的制造方法中，准备形成了布线图形10、在除了与半导体元件20的电极22导电性地连接的部分外用保护层50覆盖的基板12，该方法包括：将各向异性导电材料16设置在布线图形10与电极22之间、且设置在从基板12的半导体元件20的安装区到保护层50上的第1工序；以及利用各向异性导电材料16粘接基板12与半导体元件20、使布线图形10与电极22导电性地导通的第2工序。 ...

Circuit device and manufacturing method thereof

Bonding pads for a printed circuit board and formation method thereof

Method for manufacturing wiring circuit substrate

A method of producing a wired circuit board that can prevent the electrostatic damage of the components mounted on the wired circuit board effectively, while preventing operation errors of the device caused by the static electricity. After a thin metal film is formed over an entire area of a front side of an insulating cover layer and an entire surface of a conductor layer at a terminal portion thereof by sputtering, a metal oxide layer is formed on the thin metal layer by an oxidation-by-heating method or by the sputtering. According to this method, since the semi-conductor layer comprising the thin metal film and the metal oxide layer is formed on the surface of the insulating cover layer, the electrostatic damage of the components mounted on the wired circuit board can be prevented effectively. Also, the operation errors of the device caused by the construction wherein only the thin metal film is formed can also be prevented effectively. Further, the semi-conductor layer having a uniform ...

RESISTANCE IN LAYER THIN AND MANUFACTORING PROCESS

METHOD OF MANUFACTURING A WAFER HOLDING CONDUCTOR PATTERNS UPON TWO OPPOSITE FACES ELECTROCHEMICAL PRODUCTION OF SUBSTITUTED PYRIDINES

TETE D'INSCRIPTION ELECTROSTATIQUE

TETE D'INSCRIPTION ELECTROSTATIQUE FORMEE PAR UNE PLATINE ISOLANTE MUNIE DE PISTES CONDUCTRICES QUI COMPORTENT DES TRONCONS TERMINAUX A PARTIES PLUS EPAISSES SERVANT D'ELECTRODES D'INSCRIPTION, SITUES DANS UNE REGION EN FORME DE BANDE QUI S'ETEND SUR LA PARTIE CENTRALE DE LA PLATINE ET PARALLELES A LA DIRECTION LONGITUDINALE DE LADITE REGION. LES TRONCONS TERMINAUX DIRECTEMENT VOISINS DESDITES PISTES CONDUCTRICES SE PROLONGENT DANS DES PISTES CONDUCTRICES ORIENTEES DANS DEUX DIRECTIONS OPPOSEES ET UNE COUCHE ISOLANTE COUVRE LESDITS TRONCONS TERMINAUX MAIS LAISSE A DECOUVERT LEURS PARTIES EPAISSIES. APPLICATION AUX APPAREILS D'ENREGISTREMENT ETOU DE REPRODUCTION D'INFORMATION.

Led strip for small channel letters

A light emitting diode, LED, strip ( 301 ) for the illumination of channel signs is provided. The LED strip comprises a flexible circuit board, a plurality of LEDs mounted on the circuit board, and an electrical connector for connecting the LED strip to a power supply. The LED strip is at least in part encapsulated by a flexible resin such that the LED strip is foldable. The LED strip according to the present invention is advantageous in that its length can be adjusted by folding instead of cutting, thereby retaining the waterproof encapsulation of the LED strip. Further, a method for mounting a flexible LED strip ( 301 ) in a channel sign is provided. The method comprises the steps of attaching at least one clip ( 302 ) to an interior surface ( 303 ) of the channel sign, folding back an end ( 304 ) of the LED strip, and fixating the LED strip including the folded end using the clip. The method according to the present invention is advantageous in that it provides an easier and more reliable mounting of a LED strip as compared to standard prior art techniques.

Waterproof flexible and rigid led lighting systems and devices

The present invention relates to lighting strips and more particularly to flexible lighting systems and devices, which are waterproof. The lighting strips are modular and are capable of being physically and electrically connected with one another to provide lighting systems that are waterproof and adaptable to many situations. Included in embodiments of the invention are modular lighting strips comprising: a non-conductive substrate strip comprising an electrical circuit; a plurality of high brightness LEDs operably connected to the electrical circuit; a colloid layer comprising polyurethane resin providing a waterproof coating over the substrate, the circuit, and the LEDs; and a plug at one end and a socket at an opposing end of the substrate which is integrally formed with the strip to provide for waterproof electrical interconnection of two or more circuits or to a power supply. The lighting strips of the invention can be used in particular for back lighting, accent lighting, aisle or path lighting, contour lighting, elegant interior decoration, holiday decorations, or landscape lighting.

Покрытие печатных плат

Полезная модель относится к области электроники, приборостроения и может быть использована при разработке современных конструкций печатных плат (ГШ) с многослойным токопроводящим финишным покрытиям, гибко-жестких печатных плат, гибких печатных плат, трехмерных электронных схем на пластиках.Печатная плата с покрытием, полученным путем нанесения иммерсионного олова с барьерным подслоем из органического металла на медный слой основания, дополнительно введен слой органического защитного покрытия, нанесенный поверх иммерсионного олова. Достигаемым техническим результатом является создание покрытия за счет изменения конструкции структуры слоев ПП, что позволяет повысить качество и технологичность печатных плат на монтажных операциях. 1 ил. РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) (13) 184 905 U1 (51) МПК H05K 3/28 (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ОПИСАНИЕ ПОЛЕЗНОЙ МОДЕЛИ К ПАТЕНТУ (52) СПК H05K 3/282 (2006.01) (21)(22) Заявка: 2018103150, 06.06.2016 (24) Дата начала отсчета срока действия патента: Дата регистрации: 14.11.2018 (45) Опубликовано: 14.11.2018 Бюл. № 32 Адрес для переписки: 607188, Нижегородская обл., г. Саров, пр. Мира, 37, ФГУП "РФЯЦ-ВНИИЭФ", зам. директора департамента инновационно-проектной деятельности и корпоративного управления начальнику УИСНТИ В.Е. Миронову R U 1 8 4 9 0 5 U 1 (56) Список документов, цитированных в отчете о поиске: СМЕРТИНА ТАТЬЯНА. Иммерсионное олово как финишное покрытие. Технология в электронной промышленности, 2007, N4, с. 16-19. RU 2573583 C2, 20.01.2016. RU 2450903 C2, 20.05.2012. US 5960251 A, 28.09.1999. US 8263177 B2, 11.09.2012. US 2011/0206909 A1, 25.08.2011. (54) ПОКРЫТИЕ ПЕЧАТНЫХ ПЛАТ (57) Реферат: Полезная модель относится к области электроники, приборостроения и может быть использована при разработке современных конструкций печатных плат (ГШ) с многослойным токопроводящим финишным покрытиям, гибко-жестких печатных плат, гибких печатных плат, трехмерных электронных схем на пластиках. Печатная ...

Light emitting module

Disclosed is a light emitting module capable of representing improved heat radiation and improved light collection. there is provided a light emitting module. The light emitting module includes a metallic circuit board formed therein with a cavity, and a light emitting device package including a nitride insulating substrate attached in the cavity of the metallic circuit board, at least one pad part on the nitride insulating substrate, and at least one light emitting device attached on the pad part.

Selective encapsulation of electronic components

A method for the selective encapsulation of electronic components on a printed circuit board comprising, in one embodiment, the steps of delivering the printed circuit board to an encapsulating nest at room temperature; damming the target areas with a dam resin having a latent curing agent and deposited in the shape of walls of predetermined heights, according to the desired fill heights; dispensing a fill resin to fill the dammed areas; and curing the dam and fill resins for a suitable amount of time. In a different embodiment, the invention comprises the additional steps of laying resin beads, each in a position corresponding to the footprint of each target component; and of positioning the target components over the beads and soldering the components.

Storage apparatus and method of manufacturing the same

A storage apparatus including a circuit board, a control circuit element, a terminal module and a storage circuit element is provided. The circuit board includes a first surface, a second surface, a connect part, openings, metal contacts and metal units. The openings pass through the circuit board from the first surface to the second surface and the metal contacts are exposed on the first surface. The terminal module is disposed on the first surface and has elastic terminals and each of the elastic terminals has a first contact part and a second contact part. The first contact parts respectively contact with the metal contacts and the second contact parts respectively pass through the openings to protrude from the second surface. The metal units are disposed on the second surface and located between the openings and the connect part. Accordingly, the volume of the storage apparatus can be reduced.

Composition, coated film formed of the composition, layered product containing the coated film, and electronic device incorporating the layered product

An object is to provide a composition that has good viscosity stability and flowability at the time of processing, good shape retention after the processing, and good drying property in a temperature range of not degrading the conductor layer at the time of drying and that enables a coated film excellent in strength of adhesion with metal•polyimide, flame resistance, heat resistance, flexibility, mechanical properties, and chemical resistance to obtained after being dried. To meet this object, a composition is prepared containing (A) polyimide and (B) mixed solvent of two kinds or more, and the solubility parameter of the mixed solvent of two kinds or more ranges from 9 to 14.

System and method of forming a patterned conformal structure

A system and method of forming a patterned conformal structure for an electrical system is disclosed. The conformal structure includes a dielectric coating shaped to conform to a surface of an electrical system, with the dielectric coating having a plurality of openings therein positioned over contact pads on the surface of the electrical system. The conformal structure also includes a patterned conductive coating layered on the dielectric coating and on the contact pads such that an electrical connection is formed between the patterned conductive coating and the contact pads. The patterned conductive coating comprises at least one of an interconnect system, a shielding structure, and a thermal path.

Multi-layered substrate

The present invention directs to double-sided multi-layered substrate a base, at least a through-hole passing through the base, patterned first and second metal layers formed on the two opposite surfaces of the base, and first and second plating layers. The first plating layer covers a sidewall of the through-hole and the bottom surface surrounding a bottom opening of the through hole. The second plating layer covers the first plating layer and the top surface surrounding a top opening of the through hole.

Integrated circuit packaging system with a shield and method of manufacture thereof

A method of manufacture of an integrated circuit packaging system includes: providing a substrate; mounting a first integrated circuit over the substrate; forming an encapsulant around the first integrated circuit and over the substrate; and forming a shield structure within and over the encapsulant while simultaneously forming a vertical interconnect structure.

Circuit board for signal transmission and method of manufacturing the same

Provided is a circuit board for signal transmission and a method of manufacturing the same. The circuit board for signal transmission includes a first insulating layer, a plurality of signal interconnection disposed on the first insulating layer, ground interconnections disposed on the first insulating layer at both sides of the plurality of signal interconnections, a second insulating layer disposed on the first insulating layer including the plurality of signal interconnections and ground interconnections, a first shield layer disposed on the second insulating layer, a first shield wall for electrically connecting the ground interconnections and the first shield layer and passing through the second insulating layer, a second shield layer disposed under the first insulating layer, and a second shield wall for electrically connecting the ground interconnections and the second shield layer and passing through the first insulating layer.

Multilayer printed wiring board and method for manufacturing multilayer printed wiring board

A multilayer printed wiring board including a first interlayer resin insulation layer, a pad formed on the first interlayer resin insulation layer, a solder resist layer formed on the first interlayer resin insulation layer and the pad, a protective film formed on a portion of the pad exposed by an opening of the solder resist layer, and a coating layer formed between the pad and the solder resist layer. The pad mounts an electronic component. The coating layer has a metal layer and a coating film. The metal layer is formed on the surface of the pad and the coating film is formed on the metal layer.

Electrode connection method, electrode connection structure, conductive adhesive used therefor, and electronic device

By connecting together connecting electrodes having an organic film serving as an oxidation-preventing film using a conductive adhesive, the manufacturing process can be simplified, and a highly reliable connection structure can be constructed at low cost. An electrode connection method, in which a first connecting electrode 2 and a second connecting electrode 10 are connected together through a conductive adhesive 9 that is interposed between the electrodes, includes an organic film formation step in which an organic film 6 is formed on at least a surface of the first connecting electrode, and an electrode connection step in which the first connecting electrode and the second connecting electrode are connected together through the conductive adhesive. In the electrode connection step, by allowing an organic film decomposing component mixed in the conductive adhesive to act on the organic film, the organic film is decomposed, and thus connection between the connecting electrodes is performed.

Chip package and manufacturing method thereof

A chip package including a shielding layer having a plurality of conductive connectors for better electromagnetic interferences shielding is provided. The conductive connectors can be flexibly arranged within the molding compound for better shielding performance. The shielding layer having the conductive connectors functions as the EMI shield and the shielding layer is electrically grounded within the package structure.

Multilayered printed circuit board and manufacturing method thereof

An opening is formed in resin 20 by a laser beam so that a via hole is formed. At this time, copper foil 22 , the thickness of which is reduced (to 3 μm) by performing etching to lower the thermal conductivity is used as a conformal mask. Therefore, an opening 20 a can be formed in the resin 20 if the number of irradiation of pulse-shape laser beam is reduced. Therefore, occurrence of undercut of the resin 20 which forms an interlayer insulating resin layer can be prevented. Thus, the reliability of the connection of the via holes can be prevented. Thus, the reliability of the connection of the via holes can be improved.

Circuit device and method of manufacturing the same

Provided is a circuit device in which encapsulating resin to encapsulate a circuit board is optimized in shape, and a method of manufacturing the circuit device. A hybrid integrated circuit device, which is a circuit device according to the present invention includes a circuit board, a circuit element mounted on a top surface of the circuit board, and encapsulating resin encapsulating the circuit element, and coating the top surface, side surfaces, and a bottom surface of the circuit board. In addition, the encapsulating resin is partly recessed and thereby provided with recessed areas at two sides of the circuit board. The providing of the recessed areas reduces the amount of resin to be used, and prevents the hybrid integrated circuit device from being deformed by the cure shrinkage of the encapsulating resin.

Electronic device having liquid crystal polymer solder mask and outer sealing layers, and associated methods

An electronic device includes a substrate with a circuit layer thereon that has a solder pad. There is a liquid crystal polymer (LCP) solder mask on the substrate that has an aperture aligned with the solder pad. There is a fused seam between the substrate and the LCP solder mask. Solder is in the aperture, and a circuit component is electrically coupled to the solder pad via the solder. A first dielectric layer stack having a first plurality of dielectric layers is on the LCP solder mask and has an aperture aligned with the solder pad. There is a first LCP outer sealing layer on the first dielectric layer stack, and a second dielectric layer stack having a second plurality of dielectric layers on the substrate on a side thereof opposite the LCP solder mask. Further, there is a second LCP outer sealing layer on the second dielectric layer stack.

Printed circuit board and method for manufacturing the same, and fuel cell

A conductor layer having a predetermined pattern is formed on a base insulating layer so that its second main surface opposes the base insulating layer. A barrier layer having higher corrosion resistance to acids than that of the conductor layer is formed on its first main surface and a side surface of the conductor layer while the first main surface and the side surface of the conductor layer and the barrier layer are covered with a conductive cover layer.

system and a method for solder mask inspection

A system and a method for method for printing a solder mask on a printed circuit board (PCB), the method includes: acquiring images of multiple areas of a PCB by an inspection unit while the PCB is supported by a mechanical stage; determining spatial differences between a model of the PCB and the PCB based on the images; determining solder mask ink deposition locations based on (i) the spatial differences, and (ii) locations of the model of the PCB that should be coated with the solder mask ink; and printing solder mask ink on the solder mask deposition locations by a printing unit, while the PCB is supported by the mechanical stage.

Transparent conductive structure applied to a touch panel and method of making the same

A transparent conductive structure applied to a touch panel includes a substrate unit, a first coating unit, a transparent conductive unit, and a second coating unit. The substrate unit includes a transparent substrate. The first coating unit includes a first coating layer formed on the top surface of the transparent substrate. The transparent conductive unit includes a transparent conductive layer formed on the top surface of the first coating layer. The transparent conductive layer includes a plurality of conductive circuits arranged to form a predetermined circuit pattern. The second coating unit includes a second coating layer formed on the top surface of the transparent conductive layer to cover the conductive circuits. The second coating layer has a touching surface formed on the top side thereof, and the touching surface allows an external object (such as user's finger, any type of touch pen, or etc.) to touch.

Circuit module and manufacturing method for the same

A circuit module and a manufacturing method for the same, reduce a possibility that a defect area where an electrically conductive resin is not coated may occur in a shield layer. A mother board is prepared. A plurality of electronic components are mounted on a principal surface of the mother board. An insulator layer is arranged so as to cover the principal surface of the mother board and the electronic components. The insulator layer is cut such that grooves and projections are formed in and on the principal surface of the insulator layer and the insulator layer has a predetermined thickness H. An electrically conductive resin is coated on the principal surface of the insulator layer to form a shield layer. The mother board including the insulator layer and the shield layer both formed thereon is divided to obtain a plurality of circuit modules.

Polymide resin composition, adhesive agent and laminate each comprising same, and device

Provided are a polyimide resin composition containing a polyimide obtained by the condensation of: a diamine component containing an aromatic diamine (A) represented by the general formula (1-1) or the like, a silicone diamine (B) represented by the general formula (2) and an aliphatic diamine (C) represented by the general formula (3); and an acid anhydride component containing a specific aromatic tetracarboxylic dianhydride (D); and a laminate and a device using the polyimide resin composition.

Electronic circuit module and method of making the same

An electronic circuit module and a method of manufacturing the electronic circuit module are disclosed. In one embodiment, the electronic circuit module includes i) a substrate on which a circuit is formed, ii) a plurality of electrical devices electrically connected to the circuit and iii) a first molding unit coated on the substrate to cover at least the electrical devices. The module further includes i) a test terminal unit comprising a plurality of test wires and configured to inspect the circuit, wherein each of the test wires comprises a first end electrically connected to the circuit and a second end exposed from the first molding unit, and wherein the second ends of the test wires form an inspection unit and are adjacent to each other on the substrate and ii) a second molding unit coated on the substrate to cover the second ends of the test wires.

Injection molded control panel with in-molded decorated plastic film that includes an internal connector

Provided are systems and methods for a control assembly including: a first film that is in-molded that includes decorative graphics, a front surface and a rear surface; and a second film molded to the rear surface of the first film having a printed circuit that includes sensors, control circuits and interconnects and a front and rear surface; and an internal connector.

Circuit board, semiconductor device, process for manufacturing circuit board and process for manufacturing semiconductor device

A circuit board ( 1 ) exhibits an average coefficient of thermal expansion (A) of the first insulating layer ( 21 ) in the direction along the substrate surface in a temperature range from 25 degrees C. to its glass transition point of equal to or higher than 3 ppm/degrees C. and equal to or lower than 30 ppm/degrees C. Further, an average coefficient of thermal expansion (B) of the second insulating layer ( 23 ) in the direction along the substrate surface in a temperature range from 25 degrees C. to its glass transition point is equivalent to an average coefficient of thermal expansion (C) of the third insulating layer ( 25 ) in the direction along the substrate surface in a temperature range from 25 degrees C. to its glass transition point. (B) and (C) are larger than (A), and a difference between (A) and (B) and a difference between (A) and (C) are equal to or higher than 5 ppm/degrees C. and equal to or lower than 35 ppm/degrees C.

Resin composition for adhesive, adhesive containing resin composition for adhesive, adhesive sheet containing resin composition for adhesive, and printed wiring board including adhesive or adhesive sheet as adhesive layer

Provided is a resin composition for an adhesive comprising a polyurethane resin containing a carboxyl group, having specific range of an acid value having specific range of a number average molecular weight and having specific range of a glass transition temperature a polyester resin having specific range of a number average molecular weight and having specific range of a glass transition temperature; an epoxy resin containing a nitrogen atom; and an epoxy resin having a dicyclopentadiene skeleton, in which a content rate of the polyurethane resin to a sum of the polyurethane resin and the polyester resin is 70 to 95 percent by mass, a content rate of the total epoxy resin contained in the resin composition to the sum of the polyurethane resin and the polyester resin is 5 to 30 percent by mass.

Circuit module

A circuit module includes a substrate that has a substantially rectangular parallelepiped shape and includes a plurality of inner conductive layers, an electronic component disposed on a first main surface of the substrate, an insulating layer disposed on the first main surface of the substrate so as to cover the electronic component, a shielding layer disposed on a surface of the insulating layer, and a ground electrode connected to the plurality of inner conductive layers. At least two of the inner conductive layers are directly connected to the shielding layer.

Method for surface-treating printed circuit board and printed circuit board

Disclosed herein are a method for surface-treating a printed circuit board and a printed circuit board including a surface treatment layer. The method includes: plasma-treating a surface of a printed circuit board; treating the plasma-treated substrate with an organic solderability preserve; performing heat treatment on the substrate treated with the organic solderability preserve; printing a solder paste on the substrate subjected to the heat treatment; reflowing the solder paste printed substrate to fix the solder paste; and deflux washing the resulting substrate. According to the present invention, the discoloration problem due to oxidation of copper can be solved by performing heat treatment under predetermined conditions after treatment with an organic solderability preserve. Therefore, the present invention can meet various multi-reflow processes, as compared with products of the related art.

Card key

A card key has a molded body and an upper and a lower housings. The molded body has a circuit board, to which electronic parts for communicating with an in-vehicle equipment are mounted and which is covered with resin. The molded body is formed in a plate shape. The upper and the lower housings are fixed to each other so that the molded body is arranged between them. An external appearance of the card key is defined by the upper and the lower housings.

Composition and method for micro etching of copper and copper alloys

Disclosed is a composition for and applying said method for micro etching of copper or copper alloys during manufacture of printed circuit boards. Said composition comprises a copper salt, a source of halide ions, a buffer system and a benzothiazole compound as an etch refiner. The inventive composition and method is especially useful for manufacture of printed circuit boards having structural features of ≦100 μm.

Barrier layer dielectric for rfid circuits

This invention is directed to a polymer thick film barrier layer dielectric composition. Dielectrics made from the composition can be used in various electronic applications to protect electrical elements and particularly to insulate and protect both the conductive silver antenna above it and the polycarbonate substrate below it in RFID applications.

Method of fabricating micro structured surfaces with electrically conductive patterns

A method comprises forming a first pattern on a first flat surface and forming an inverse of the pattern on a second flat surface. The method further comprises attaching the second flat surface to a roller to produce an embossing tool and applying pressure between the embossing tool and a substrate thereby forming a second pattern in the substrate. The substrate is coated with a radiation curable resin material. The method also comprises transferring ink to the substrate, the ink containing a catalyst, and coating the substrate with the second pattern in an electroless plating bath. The first pattern alternatively may be formed on a sleeve which is then attached to a drum/roller.

SEGMENTABLE WIRING BOARD AND METHOD FOR PRODUCING THE SAME, AND WIRING SUBSTRATE AND METHOD FOR PRODUCING THE SAME

A segmentable wiring board includes a ceramic base body, a conductor, a metal plating film and a glass layer, the glass layer having an upwardly-protruding convexity located on the metal plating film. The ceramic base body has a plurality of wiring substrate regions and dividing grooves located in boundaries among the plurality of wiring substrate regions. Moreover, the conductor is located in a periphery of each of the plurality of wiring substrate regions. Moreover, the metal plating film is located on the conductor. Further, the glass layer coveringly extends from an inner surface of each of the dividing grooves of the ceramic base body to the metal plating film. 1. A segmentable wiring board , comprising:a ceramic base body having a plurality of wiring substrate regions and dividing grooves formed in boundaries among the plurality of wiring substrate regions;a conductor located in a periphery of each of the plurality of wiring substrate regions; anda glass layer coveringly extending from an inner surface of each of the dividing grooves of the ceramic base body to the conductor,the glass layer having an upwardly-protruding convexity located on the conductor.2. The segmentable wiring board according to claim 1 ,wherein the conductor is situated under the convexity of the glass layer and upwardly protrudes.3. The segmentable wiring board according to claim 1 ,wherein a thickness of the conductor falls in a range of 20 μm to 80 μm.4. The segmentable wiring board according to claim 1 ,wherein a depth of each of the dividing grooves falls in a range of 5 μm to 16 μm.5. The segmentable wiring board according to claim 4 ,wherein the depth of each of the dividing grooves falls in a range of 30% to 62% of a thickness of the ceramic base body.6. A wiring substrate claim 4 , comprising:a ceramic base body;a conductor located in a periphery of a first main surface of the ceramic base body; anda glass layer which covers a side surface of the ceramic base body and a side ...

Method for manufacturing printed circuit board

A base insulating layer is formed on a suspension body, and write wiring traces and read wiring traces are formed on the base insulating layer. The write wiring trace and the read wiring traces are formed on a body region of the base insulating layer, and the write wiring trace is formed on an auxiliary region of the base insulating layer. The base insulating layer is bent along a bend portion. This causes the write wiring trace to be positioned above the write wiring trace.

Storage device and method for producing the same

A storage device including a circuit board, an electronic device package and a terminal module is provided. The circuit board has a first surface and a second surface opposite to each other, a plurality of via-holes connecting the first surface and the second surface, a plurality of first pads on the first surface, and a plurality of first pads on the second surface. The electronic device package is disposed on the first surface. The terminal module disposed on the first surface has a plurality of first and second contact parts, and each of the first contact parts passes through the corresponding via-hole and is protruded out of the second surface, and each of the second contact parts is electrically connected to the corresponding first pad. An orthogonal projection area of the electronic device package on the first surface is smaller than an area of the first surface.

METHOD OF MANUFACTURING A MOLDED SENSOR SUBASSEMBLY

A method of producing an insert molded sensor assembly having at least one sensor element accommodated on a first side of a circuit board of the sensor assembly. During a first step, a plurality of pins are introduced and penetrate through the circuit board. The circuit board, including the at least one sensor element, is then disposed, during a second step, into a two-part insert mold tool so that the pins are supported on both sides of the circuit board in a direction transverse to a plane defined by the circuit board. A defined spacing distance, between a surface of the sensor element and the insert mold tool, is produced by the pins. During a third step of the method, the insert mold tool is filled with insert molding material, particularly a duroplast. 110-. (canceled)11100134221a. A method () of manufacturing a molded sensor subassembly () having at least one sensor element ( , ) supported on a first side () of a circuit board () of the sensor assembly () , the method comprising the steps of:{'b': 110', '6', '2, 'during a first step (), introducing a plurality of pins () which penetrate through the circuit board ();'}{'b': 210', '2', '3', '4', '6', '10', '6', '2', '7', '8', '6', '10', '6', '3', '4', '10, 'i': a', 'a, 'during a second step (), disposing the circuit board () including the at least one sensor element (, ) and the plurality of pins () in a two-part insert mold tool () so that the pins () are supported on both sides of the circuit board (), in a direction transverse to a plane defined by the circuit board, by face side tool contact surfaces (, ) of the plurality of pins () which engage with the insert mold tool (), and the plurality of pins () define a spacing distance between a surface of the sensor element (, ) and the insert mold tool (); and'}{'b': 310', '10', '14, 'during a third step (), filling the insert mold tool () with insert molding material ().'}121002110276ab. The method () according to claim 11 , further comprising the step of ...

IC-PROCESSED POLYMER NANO-LIQUID CHROMATOGRAPHY SYSTEM ON-A-CHIP AND METHOD OF MAKING IT

Embodiments in accordance with the present invention relate to packed-column nano-liquid chromatography (nano-LC) systems integrated on-chip, and methods for producing and using same. The microfabricated chip includes a column, flits/filters, an injector, and a detector, fabricated in a process compatible with those conventionally utilized to form integrated circuits. The column can be packed with supports for various different stationary phases to allow performance of different forms of nano-LC, including but not limited to reversed-phase, normal-phase, adsorption, size-exclusion, affinity, and ion chromatography. A cross-channel injector injects a nanolitre/picolitre-volume sample plug at the column inlet. An electrochemical/conductivity sensor integrated at the column outlet measures separation signals. A self-aligned channel-strengthening technique increases pressure rating of the microfluidic system, allowing it to withstand the high pressure normally used in high performance liquid chromatography (HPLC). On-chip sample injection, separation, and detection of mixture of anions in water is successfully demonstrated using ion-exchange nano-LC. 1. A method of fabricating a nano-liquid chromatography system on-a-chip , the method comprising:patterning a sacrificial material on a first side of a substrate to define a column region;forming an encapsulant over the first side of the substrate and the sacrificial material;removing the sacrificial material to define a column; andproviding access to an inlet of the column region and an outlet of the column region.2. The method of wherein providing access to the column inlet and the column outlet comprises etching through a backside of the substrate to stop on the sacrificial material.3. The method of wherein providing access to the column inlet and the column outlet comprises forming a hole through the encapsulant present in a front side of the substrate.4. The method of wherein:patterning the sacrificial material ...

Method of processing solder bump by vacuum annealing

A method includes vacuum annealing on a substrate having at least one solder bump to reduce voids at an interface of the at least one solder bump. A die is mounted over the substrate.

Method and apparatus for curing thin films on low-temperature substrates at high speeds

A curing apparatus for thermally processing thin films on low-temperature substrates at high speeds is disclosed. The curing apparatus includes a strobe head, a strobe control module and a conveyor control module. The strobe control module controls the power, duration and repetition rate of a set of pulses generated by a flash lamp on the strobe head. The conveyor control module along with the strobe control module provide real-time synchronization between the repetition rate of the set of pulses and the speed at which the substrate is being moved under the strobe head, according to the speed information.

Display Device

A display device includes a first substrate which constitutes a part of a display panel, the first substrate having a first side and having a terminal formed thereon adjacent to the first side, and a flexible printed circuit board which is connected to the first substrate. The flexible printed circuit board includes a board portion, a wiring layer which is mounted on the board portion, a cover portion which covers the wiring layer, and a connecting portion which is connected to the terminal formed on the first substrate. The connecting portion includes a metal layer, and wherein the cover portion overlaps with the first side and an area between the first side and the terminal.

ENCAPSULATION AND PRODUCTION OF AN ENCAPSULATED PRINTED CIRCUIT BOARD ASSEMBLY

An encapsulation is formed on a printed circuit board that is populated with electronic components, especially a printed circuit board having electronic components that have to meet certain safety standards because they are used, e.g. in the area of explosion control. The printed circuit board assembly is coated with a bottom layer, preferably a bottom layer produced from a plasma and pretreated such that the protective coat adheres on the entire surface of the printed circuit board assembly evenly and in a sufficient thickness and does not shrink during the subsequent curing process regardless of the material of the surface and/or regardless of the fact whether the coat is applied to a geometrically problematic area on the printed circuit board assembly such as a corner or an edge. 19-. (canceled)10. An encapsulated circuit board , comprising:a populated printed circuit board; and a bottom layer covering the printed circuit board; and', 'a protective lacquer coating formed on the bottom layer, the bottom layer having a surface to which the protective lacquer coating readily adheres, the protective lacquer coating being thicker than the bottom layer, the protective lacquer coating protecting the populated printed circuit board against undesirable and/or harmful environmental influences., 'a dual-layered encapsulation comprising11. The encapsulated circuit board as claimed in claim 10 , wherein the bottom layer is a plasma coating.12. The encapsulated circuit board as claimed in claim 10 , wherein the bottom layer is a plasma coating produced from an organosilicon precursor and/or a gaseous hydrocarbon compound precursor.13. The encapsulated circuit board as claimed in claim 10 , wherein the bottom layer has a layer thickness less than 150 nm.14. The encapsulated circuit board as claimed in claim 12 , wherein the bottom layer has a layer thickness less than 150 nm.15. The encapsulated circuit board according to claim 10 , wherein the bottom layer is a coating other ...

Systems for assembling electronic devices with internal moisture-resistant coatings

A system for assembling electronic devices includes at least one coating element for applying a moisture-resistant coating to surfaces of a device under assembly, or an electronic device under assembly. As components and one or more moisture-resistant coatings are added to the electronic device under assembly to form a finished electronic device, at least one surface on which the coating resides and, thus, at least a portion of the coating itself, is located internally within the finished electronic device. Methods for assembling electronic devices that include internally confined moisture-resistant coatings are also disclosed.

TOUCH PANEL MOTHER SUBSTRATE AND TOUCH PANEL CUT THEREFROM

An objective of the present invention is to provide a touch panel mother substrate that has a novel structure and facilities the cutting of a touch panel, and a touch panel that has been cut from the touch panel mother substrate. A plurality of touch panel units () that are to be touch panels () after being cut is formed on a touch panel mother substrate (). The touch panel mother substrate () includes an organic resin film () that is deposited on the front side of the touch panel mother substrate (), and a cutting groove () that opens at the surface of the organic resin film () and extends in a predetermined direction. The materials of a bottom surface () of the cutting groove () and a back surface () of the touch panel mother substrate () have the same main ingredient. 1. A touch panel mother substrate on which a plurality of touch panel units that become touch panels after being cut is formed , the touch panel mother substrate comprising:an organic resin film deposited on a front side of the touch panel mother substrate; anda cutting groove that opens on a surface of the organic resin film and extends in a predetermined direction,wherein materials of a bottom surface of the cutting groove and a back surface of the touch panel mother substrate have the same main ingredient.2. The touch panel mother substrate according to claim 1 , further comprising:an inorganic insulating film provided at a layer lower than the organic resin film, the inorganic insulating film being deposited on the front side of the touch panel mother substrate,wherein the inorganic insulating film forms the bottom surface of the cutting groove.3. A method for fabricating a touch panel using a touch panel mother substrate on which a plurality of touch panel units that become touch panels after being cut is formed claim 1 , the method comprising:an organic resin film deposition process for depositing an organic resin film on a front side of the touch panel mother substrate;a cutting groove ...

MASKS FOR USE IN APPLYING PROTECTIVE COATINGS TO ELECTRONIC ASSEMBLIES, MASKED ELECTRONIC ASSEMBLIES AND ASSOCIATED METHODS

One or more masks may be used to control the application of protective (e.g., moisture-resistant, etc.) coatings to one or more portions of various components of an electronic device during assembly of the electronic device. A method for applying a protective coating to an electronic device includes assembling two or more components of the electronic device with one another. A mask may then be applied to the resulting electronic assembly. The mask may shield selected portions of the electronic assembly, while other portions of the electronic assembly, i.e., those to which a protective coating is to be applied, may remain exposed through the mask. With the mask in place, application of a protective coating to portions of the electronic assembly exposed through the mask may commence. After application of the protective coating, the mask may be removed from the electronic assembly. Embodiments of masked electronic assemblies are also disclosed. 1. A method for coating an electronic device , comprising:assembling a plurality of components of an electronic device to form an electronic assembly;applying a mask to the electronic assembly, the mask shielding at least a portion of the assembly;applying a protective coating to at least two components of the electronic assembly with the mask in place; andremoving the mask from the electronic assembly, the protective coating remaining on coated portions of the electronic assembly, uncoated portions of the electronic assembly being exposed through the mask.2. The method of claim 1 , wherein assembling the plurality of components comprises assembling a plurality of components to be located at least partially within an interior of the electronic device.3. The method of claim 1 , further comprising:assembling at least one exterior component of the electronic device with the electronic assembly, the at least one exterior component defining at least a portion of an interior of the electronic device, at least a portion of the ...

Moisture-proof insulating material

Provided are: a moisture-proof insulating material having superior long-term insulating reliability and adhesiveness to polyimides and glass substrates, and has a solid content concentration that can secure a thickness that realizes sufficient moisture-proof performance after application and drying in a viscosity region that can be easily coated by means of a dispenser; and an electronic component that has been insulation-processed by means of the moisture-proof insulating material. The moisture-proof insulating material contains a styrene-based thermoplastic elastomer, a tackifying agent, and a solvent, and is characterized by the solvent containing an aliphatic hydrocarbon solvent (for example, methylcyclohexane or cyclohexane) having a boiling point that is at least 80° C. and less than 110° C. The solvent preferably further contains an aliphatic hydrocarbon solvent (for example, ethylcyclohexane or dimethylcyclohexane) having a boiling point that is at least 110° C. and less than 140° C.

Sensor Package and Method for Producing a Sensor Package

Some embodiments herein relate to a sensor package. The sensor package includes a printed circuit board with a laminar current conductor arranged on a first main surface of the printed circuit board. The sensor package also includes a sensor chip adapted to measure a current flowing through the laminar current conductor, wherein the sensor chip comprises a magnetic field sensor. The sensor chip is electrically insulated from the current conductor by the printed circuit board, and is arranged on a second main surface of the printed circuit board opposite to the first main surface. The sensor chip is hermetically sealed between the mold material and the printed circuit board, or is arranged in the printed circuit board and hermetically sealed by the printed circuit board. 1. A sensor package , comprising:a current conductor;a sensor chip arranged adapted to measure a current flowing through the current conductor, the sensor chip comprising a magnetic field sensor; anda printed circuit board arranged between at least a part of the current conductor and at least a part of the sensor chip;wherein the sensor chip is sealed between a mold material and the printed circuit board, or wherein the sensor chip is sealed within the printed circuit board.2. The sensor package of claim 1 , wherein the sensor chip is flip-chip mounted or face-up mounted.3. The sensor package of claim 1 , wherein the sensor chip is arranged on a main surface of the printed circuit board claim 1 , and wherein the main surface of the printed circuit board comprises alignment structures or alignment marks for aligning of the sensor chip.4. The sensor package according to claim 1 , wherein the current conductor comprises a laminar current conductor.5. The sensor package according to claim 1 , wherein the current conductor comprises a planar current conductor.6. The sensor package according to claim 1 , wherein the lateral dimensions of the current conductor are larger than the vertical dimension of the ...

Method for encapsulation of electronics received in water meter pits with an improved wax-based encapsulant/moisture barrier

The presently disclosed subject matter is directed to method for forming an encapsulant and coating electronic components such as those utilized in AMR technology with the encapsulant. The encapsulant comprises a wax, a tackifier, a polymer, a plasticizer, a thixotropic agent, and an antioxidant and is designed to protect electronic components from harsh environments such as those where high levels of humidity or corrosive liquids may be present. For example, the encapsulant exhibits minimal percent weight gain due to moisture vapor when subjected to temperatures ranging from about −40° C. to about 70° C. and relative humidities ranging from 0% to 85% over a period of 200 days.

RESIN COMPOSITION SHEET FOR ENCAPSULATING ELECTRONIC PARTS AND METHOD OF PRODUCING ELECTRONIC PART APPARATUS USING THE SHEET

A resin composition sheet for encapsulating electronic parts and a method of producing an electronic part apparatus using the sheet are provided. The method includes: loading, on a substrate, a resin composition sheet for encapsulating electronic parts including a thermosetting resin composition containing an epoxy resin, a phenol resin, an inorganic filler, and a curing accelerator, having a lowest viscosity in a specific range, and a thickness in a specific range; heating the substrate in a chamber in a decompressed state to sag an end portion of the sheet until it is in contact with a surface of the substrate; and releasing a pressure in the chamber to cause the sheet to adhere onto the substrate due to a difference between a pressure in the space between the sheet and the substrate, and the pressure in the chamber after the release, followed by thermal curing. 1. A resin composition sheet for encapsulating electronic parts , comprising:a thermosetting resin composition comprisingan epoxy resin,a phenol resin,an inorganic filler, anda curing accelerator,wherein the thermosetting resin composition has a lowest viscosity in temperature increase measurement with a viscoelasticity-measuring apparatus in a range of 100 to 20,000 Pa·s, andwherein the sheet has a thickness in a range of 20 to 200 μm.2. The resin composition sheet for encapsulating electronic parts according to claim 1 , wherein the sheet has a tensile elongation rate in a range of 20 to 300% and a tensile strength in a range of 1 to 20 (N/20 mm) in an uncured state at 25° C.3. A method of producing an electronic part apparatus claim 1 , comprising:arranging and mounting a plurality of electronic components on a circuit substrate to provide a mounted substrate, followed by loading of a resin composition sheet in a state where the sheet covers upper surfaces of the electronic parts;heating the mounted substrate in a chamber in a decompressed state to sag an end portion of a perimeter of the sheet through ...

Coating Method for an Optoelectronic Chip-on-Board Module

A method is proposed for coating an optoelectronic chip-on-board module including a flat substrate populated with one or more optoelectronic components having at least one primary optical arrangement and optionally at least one secondary optical arrangement. The optoelectronic chip-on-board module is coated with a transparent, UV-resistant, and temperature-resistant coating made of silicone by the following steps: (a) casting a liquid silicone into a mold open towards the top and having outer dimensions corresponding to or exceeding outer dimensions of the substrate; (b) inserting the substrate into the mold, wherein the optoelectronic component(s) are immersed completely into the silicone and a surface of the substrate contacts the silicone completely or the substrate immerses into the silicone at least partially with full surface contact; (c) curing and cross-linking the silicone with the optoelectronic component(s) and the substrate; and (d) removing the substrate from the mold with the coating of cured silicone.

Method for the Production of a Ceramic Green Sheet

In order to produce ceramic green sheets with embedded structures of a functional material, structures of a functional material are first created on a carrier. The same structures are then embedded in a slip layer of a ceramic base material. Nearly plane-parallel green sheets obtained in this manner can easily be further processed to produce ceramic multilayer components.

Thin Film for a Lead for Brain Applications

A thin film for a lead for brain applications includes at least one section comprising a high conductive metal and a low conductive metal, whereby the low conductive metal is a biocompatible metal and has a lower electrical conductivity than the high conductive metal and whereby the high conductive metal is at least partially encapsulated by the low conductive metal. Furthermore, the present invention relates to a method of manufacturing a thin film for a lead for brain applications and a deep brain stimulation system.

CIRCUIT MODULE AND METHOD FOR PRODUCING SUCH A CIRCUIT MODULE

The invention relates to a circuit module () having a circuit carrier (), at least one circuit () mounted on the circuit carrier (), encapsulated by a protective material (), and at least one electrical/electronic component () encapsulated by a protective coating (), protecting the at least one electrical/electronic component () from the protective material (), and to a method for producing the circuit module (). According to the invention, the protective coating () protecting the at least one electrical/electronic component () is only partially encapsulated by the protective material (). 11214121618201816201816. A circuit module having a circuit carrier () , at least one circuit () which is mounted on the circuit carrier () and which is surrounded by a protective mass () , and at least one electrical/electronic component () which is surrounded by a protective shell () which protects at least the at least one electrical/electronic component () from the protective mass () , characterized in that the protective shell () protecting the at least one electrical/electronic component () is surrounded by the protective mass () only in part.2202218242012. The circuit module as claimed in claim 1 , characterized in that the protective shell () forms a holding area () for holding the at least one component () and a flange area () for tethering the protective shell () to the circuit carrier ().3522024. The circuit module as claimed in claim 1 , characterized in that the holding area () of the protective shell () is in the form of a pot claim 1 , the open end of which accommodates the flange area () claim 1 , which is in the form of a circumferential collar.42426. The circuit module as claimed in claim 1 , characterized in that the flange area () has at least one sealing device ().52030. The circuit module as claimed in claim 1 , characterized in that the protective shell () has a pressure equalization device ().62016. The circuit module as claimed in claim 1 , characterized in ...

Anti-corrosion conformal coating comprising modified porous silica fillers for metal conductors electrically connecting an electronic component

A conformal coating comprising modified porous silica particles is disclosed. A porous silica particle, such as MCM-14 or SBA-15 is modified with a sulfur gettering functionality, such as a phosphine compound, covalently bonded to silicon atoms in the porous silica particle. The conformal coating comprising the modified porous silica particles may be applied to metallic wiring areas of a circuit component, with the sulfur gettering functionality preventing sulfur from atmospheric gasses from penetrating the conformal coating to the metallic wiring.

PACKAGING TECHNIQUES AND CONFIGURATIONS

One embodiment of the present disclosure provides an apparatus comprising a flex circuit substrate having a core, a first solder mask and first traces disposed on the core on a first side of the flex circuit substrate, and a second solder mask and second traces disposed on the core on a second side of the flex circuit substrate. The first side is opposite to the second side. The apparatus further includes vias formed through the core to electrically couple the first traces to the second traces, and a stiffening structure coupled to the first side of the flex circuit substrate to increase structural rigidity of the flex circuit substrate. The stiffening structure provides structural support to allow attachment of an integrated circuit die to the first side of the flex circuit substrate. 1. A method comprising:providing a flex circuit substrate comprising non-metal areas formed on a first side of the flex circuit substrate;forming metal portions on a second side of the flex circuit substrate,wherein the second side of the flex circuit substrate is located opposite to the first side of the flex circuit substrate, andwherein the metal portions are formed on the second side of the flex circuit substrate to complement the non-metal areas formed on the first side of the flex circuit substrate.2. The method of claim 1 , wherein the metal portions are formed on the second side of the flex circuit substrate to complement the non-metal areas formed on the first side of the flex circuit substrate such that the metal portions formed on the second side of the flex circuit substrate are orthogonal to the non-metal areas formed on the first side of the flex circuit substrate.3. The method of claim 1 , wherein the metal portions are formed on the second side of the flex circuit substrate to complement the non-metal areas formed on the first side of the flex circuit substrate such that the metal portions formed on the second side of the flex circuit substrate are parallel to the non- ...

Modular light emitting diode systems and devices

The present invention relates to devices, systems and methods comprising light emitting diodes. Some embodiments include a module comprising a light emitting diode, an electrical circuit, and a connector. In various embodiments a module provides an extensible conductive circuit containing light emitting diodes and/or other electric circuitry. Some embodiments comprise a method for constructing a luminary from modules comprising a light emitting diode.

METHOD OF MANUFACTURING MULTILAYER WIRING BOARD

Embodiments disclosed herein include a method of manufacturing a multilayer wiring board that includes the steps of forming, on a support substrate, a laminate in which insulating layers and conductor layers are alternately laminated, accommodating a semiconductor chip in an opening of a prepreg which is formed on the surface of the laminate and that includes a sheet-like glass fiber impregnated with resin, and heating and pressurizing the surface of the prepreg in a state where the semiconductor chip is accommodated in the opening. 1. A method of manufacturing a multilayer wiring board in which a plurality of insulating layers and a plurality of conductor layers are alternately laminated , the method comprising:a first step of forming, on a support substrate, a laminate in which at least one insulating layer and at least one conductor layer are alternately laminated;a second step of fixing an electronic component on a surface of the laminate formed by the first step;a third step of forming an opening capable of accommodating the electronic component in a prepreg which includes a sheet-like glass fiber impregnated with resin;a fourth step of laminating the prepreg with the opening formed by the third step on the surface of the laminate such that the electronic component fixed by the second step is accommodated in the opening; anda fifth step of heating and pressurizing a surface of the prepreg laminated on the surface of the laminate by the fourth step.2. The method according to claim 1 , wherein:in the first step, pads for electrical connection to connection terminals of the electronic component are formed on the surface of the laminate, andin the second step, after a solder paste is provided on the pads and the electronic component is placed on the surface of the laminate, the solder paste is reflowed to fix the electronic component such that voids are formed between the pads and the connection terminals.3. The method according to claim 2 , wherein claim 2 , when ...

MODULE SUBSTRATE AND METHOD FOR MANUFACTURING MODULE SUBSTRATE

A module substrate includes a plurality of electronic components mounted on at least one surface of a base substrate and a columnar terminal connection substrate connected to the one surface of the base substrate on which a plurality of the electronic components are mounted. The terminal connection substrate includes a plurality of conductor portions, at least one corner of the columnar terminal connection substrate is chamfered with a flat surface and/or curved surface, and the terminal connection substrate is connected at a side surface thereof contacting the chamfered surface, to the one surface of the base substrate. 1. A module substrate comprising:a base substrate;a plurality of electronic components mounted on at least one surface of the base substrate;a plurality of conductor portions connected to the one surface of the base substrate on which the plurality of the electronic components are mounted; whereinat least one corner of each of the plurality of conductor portions is chamfered with a flat surface and/or curved surface; andeach of the plurality of conductor portions is connected, at a side surface thereof contacting the chamfered flat surface and/or curved surface, to the one surface of the base substrate.2. The module substrate according to claim 1 , wherein each of the plurality of conductor portions is arranged such that the chamfered flat surface and/or curved surface faces an inside of the base substrate.3. The module substrate according to claim 1 , wherein a cross-sectional shape of each of the plurality of conductor portions in a plane perpendicular to the base substrate is an inverted L shape.4. The module substrate according to claim 1 , further comprising:a columnar terminal connection substrate including the plurality of the conductor portions and connected to the one surface of the base substrate on which the plurality of the electronic components are mounted; whereinat least one corner of the terminal connection substrate is chamfered ...

HIGH-SPEED, FLEXIBLE INTEGRATED CIRCUITS AND METHODS FOR MAKING HIGH-SPEED, FLEXIBLE INTEGRATED CIRCUITS

The present invention provides flexible devices, such as integrated circuits, having a multilevel electronic device structure including two or more electronic components. The electronic components within the structure are electrically connected by an interconnect structure having multiple interconnect levels. In addition to the multilevel electronic device structure, the flexible devices include an elastomeric material disposed around the interconnect levels, including within the spaces between the interconnect levels. 1. A flexible device comprising:(a) a multilevel electronic device structure comprising at least two electronic components electrically connected by an electrical interconnect structure having multiple interconnect levels along the vertical axis of the device; and(b) an elastomeric dielectric material disposed around the electrical interconnect structure, including within spaces between the interconnect levels.2. The flexible device of claim 1 , wherein the flexible device has a thickness of no greater than about 50 μm and can be formed into a rolled structure with a convex bending radius of 20 mm or less and still perform its intended functions.3. The flexible device of claim 1 , wherein the electronic components and the electrical interconnect structure are encased in the elastomeric dielectric material.4. The flexible device of claim 1 , wherein the flexible device is substantially free of inorganic dielectric material between interconnect levels claim 1 , other that inorganic dielectric materials that form part of a device active region.5. The flexible device of claim 1 , wherein the electrical interconnect structure has a least four interconnect levels.6. The flexible device of claim 1 , wherein the elastomeric dielectric material comprises PDMS.7. The flexible device of comprising an integrated circuit having at least two transistors electrically connected by the electrical interconnect structure.8. The flexible device of claim 7 , wherein at ...

Method for Reducing Creep Corrosion

A method for reducing creep corrosion on a printed circuit board, the printed circuit board comprising a substrate, a plurality of electrically conductive tracks located on at least one surface of the substrate, a solder mask coating at least a first area of the plurality of electrically conductive tracks and a surface finish coating at least a second area of the plurality of electrically conductive tracks, the method comprising depositing by plasma-polymerization a fluorohydrocarbon onto at least part of the solder mask and at least part of the surface finish. 118.-. (canceled)19. A method for reducing creep corrosion on a printed circuit board comprising: a substrate;', 'a plurality of electrically conductive tracks located on at least one surface of the substrate;', 'a solder mask coating at least a first area of the plurality of electrically conductive tracks; and', 'a surface finish coating at least a second area of the plurality of electrically conductive tracks; and, 'selecting a printed circuit board comprisingdepositing by plasma-polymerization a fluorohydrocarbon onto at least part of the solder mask and at least part of the surface finish.20. The method of claim 19 , wherein the surface finish is selected from the group consisting of immersion silver (ImAg) claim 19 , electroless nickel/immersion gold (ENIG) claim 19 , organic solderability preservative (OSP) claim 19 , electroless nickel/electroless palladium/immersion gold (ENEPIG) claim 19 , and immersion tin (ImSn).21. The method of claim 19 , wherein the surface finish is immersion silver (ImAg).22. The method of claim 19 , wherein the fluorohydrocarbon is selected from the group consisting of CF claim 19 , CF claim 19 , CF claim 19 , CF claim 19 , and CF.23. The method of claim 19 , wherein the solder mask is selected from the group consisting of epoxy solder mask claim 19 , liquid photoimageable solder mask ink claim 19 , and dry film photoimageable solder mask.24. The method of claim 19 , wherein ...

Photocurable resin composition, dry film, cured product and printed wiring board

[Problems] The present invention provides a photocurable resin composition having excellent adhesion with a substrate and excellent resolution; a film obtained by using the photocurable resin composition; a cured product obtained by curing the photocurable resin composition; and a printed wiring board comprising the cured product. [Means for Solution] The photocurable resin composition according to the present invention is characterized by comprising (A) a carboxyl group-containing resin, (B) an acylphosphine oxide-based photopolymerization initiator, (C) a titanocene-based photopolymerization initiator, (D) a photosensitive monomer and (E) a polymerization inhibitor.

PCB Droplet Actuator Fabrication

Alternative approaches to fabricating printed circuit boards for use in droplet actuator operations are provided. In one embodiment, a method of manufacturing a droplet actuator for conducting droplet operations includes positioning a dielectric material between a first metal layer configured to include an electrode and a second metal layer configured to include an interconnect pad. The method additionally includes forming a connection between the first and second metal layers. Droplet actuators and methods of fabricating and supporting printed circuit boards of droplet actuators are also provided. 1. A method of manufacturing a droplet actuator for conducting droplet operations , the method comprising:(a) positioning a dielectric material between a first metal layer configured to include an electrode and a second metal layer configured to include an interconnect pad; and(b) forming a connection between the first and second metal layers.2. The method of further comprising applying a photoresist layer onto the first metal layer.3. The method of further comprising stripping a photoresist layer from the first metal layer.4. The method of claim 1 , wherein forming the connection further comprises forming a via connection between the first and second metal layers.5. The method of claim 1 , wherein forming the connection further comprises forming an opening through both the dielectric material and the second metal layer through to the first metal layer.6. The method of further comprising applying a photoresist layer onto the second metal layer in such a manner as to leave the opening exposed.7. The method of further comprising applying a metal plating into the opening to form the connection.8. The method of further comprising stripping the photoresist layer from the second metal layer.9. The method of further comprising forming the electrode from the first metal layer.10. The method of further comprising forming the interconnect pad from the second metal layer.11. The ...

Resin composition, and protective film, dry film, circuit board, and multilayer circuit board containing same

A resin composition which is capable of forming a film that has excellent heat resistance and slidability/bendability; a protective film for circuits, which uses the resin composition; and a dry film or the like which comprises the protective film are provided. Other aspects are a circuit board and a multilayer circuit board, each of which has excellent heat resistance and slidability/bendability. Furthermore, a protective film for circuit boards is provided, which is arranged in contact with a circuit of a printed wiring board, and contains a polyoxazolidone resin that has a weight average molecular weight of 3×10 4 or more.

Injection molded control panel with in-molded decorated plastic film that includes an internal connector

Provided are systems and methods for a control assembly including: a first film that is in-molded that includes decorative graphics, a front surface and a rear surface; and a second film molded to the rear surface of the first film having a printed circuit that includes sensors, control circuits and interconnects and a front and rear surface; and an internal connector.

Control module and method for producing same

A control module includes a circuit board having conductor paths arranged on at least one plane and having at least one rigid, inflexible conductor path section. The control module also includes an electronic control circuit which electrically contacts the conductor paths and has electrical components. The control module also includes a pan-shaped cover part protecting the control circuit. The cover part is arranged over a part of the electronic control circuit and contacts a side of the circuit board in a sealing manner with a flat contact region aligned parallel to the side. At least part of the electronic control circuit is protectively arranged in a housing inner chamber between the cover part and the circuit board, and electrical contacts of the circuit board are provided outside of the housing inner chamber, which is covered by the cover part, to contact electrical components of the control module.

Printed circuit board and method for manufacturing same

A printed circuit board according the present embodiment includes an insulating layer; at least one circuit pattern or pad formed on the insulating layer; a solder resist having an opening section exposing the upper surface of the pad and formed on the insulating layer and a bump formed on the pad exposed through the opening section of the solder resist and having a lower area narrower than the upper area.

High frequency module having surface acoustic wave device and method for manufacturing the same

A high frequency module having a surface acoustic wave device and a method of manufacturing the same are provided. The high frequency module includes a substrate provided with a top ground pattern at both upper ends and provided with, inside thereof, an inner ground pattern electrically connected to the top ground pattern through a via electrode; at least one SAW device installed on the substrate; a molding layer formed on the substrate to cover the SAW device and provided with a groove at both ends to expose the top ground pattern; and an electromagnetic wave shield layer formed to cover a surface of the molding layer including an inside of the groove.

COMPONENT-EMBEDDED RESIN SUBSTRATE AND METHOD FOR MANUFACTURING SAME

A component-embedded resin substrate () includes a plurality of resin layers () made of a first resin and laminated on one another, and a component () arranged to be surrounded by each resin layer () in a first group () which is a group of two or more resin layers arranged successively in a thickness direction included in the plurality of resin layers (). An auxiliary resin portion () made of a second resin different from the first resin is arranged to be in contact with and along at least one of surfaces of the component (). 1. A component-embedded resin substrate , comprising:a plurality of resin layers, each of said plurality of resin layers including a first resin and laminated on one another;a component surrounded by a first group of two or more resin layers of said plurality of resin layers, said first group of two or more resin layers being arranged successively in a thickness direction; andan auxiliary resin portion including a second resin different from said first resin, said auxiliary resin portion being in contact with and along at least one of surfaces of said component.2. The component-embedded resin substrate according to claim 1 , wherein said second resin has a Young's modulus higher than that of said first resin.3. The component-embedded resin substrate according to claim 1 , wherein said auxiliary resin portion covers a side surface of said component.4. The component-embedded resin substrate according to claim 1 , wherein said auxiliary resin portion extends along all of said first group of two or more resin layers in the thickness direction.5. The component-embedded resin substrate according to claim 1 , wherein said auxiliary resin portion includes a portion surrounding a periphery of said component as seen in planar view.6. The component-embedded resin substrate according to claim 1 , wherein said component has a first main surface parallel to surfaces of said plurality of resin layers claim 1 , and said auxiliary resin portion covers said ...

Light-emitting device

A light-emitting device including: a base; light-emitting elements arranged on the base at intervals in an array along a predetermined direction of the base; and conductive-wiring parts formed on first and second sides of the array of the light-emitting elements on the base. The conductive-wiring parts are discretely formed along the predetermined direction of the base, each of the conductive-wiring parts relaying electricalconnection between the light-emitting elements, and the number of the conductive-wiring parts arranged per light-emitting element on each of the first and second sides of the array of the light-emitting elements is two or more.

Flexible Printed Circuit Film and Display Device Using the Same

Disclosed is a flexible printed circuit film (FPC film) and display device using the same, the FPC film comprising a body extending along a side of a substrate; and a connector protruding from the body and detachably combined with a PCB wherein the connector comprises: a flexible polymer film including pad region and line region, wherein a plurality of first via holes are formed in the pad region; a plurality of pads overlapped with the first via hole in the pad region on one surface of the flexible polymer film; and a plurality of lines electrically connected with the plurality of pads through the first via hole, wherein the plurality of pads are formed of pad sets of plural rows including a pad set of a first row and a pad set of a second row.

Thermally-conductive particles in printed wiring boards

A printed wiring board (PWB) can be fabricated with enhanced thermal characteristics that can enable the use of higher performance electronic components and/or a smaller packaging configuration. A substrate layer of the PWB includes a matrix material and optional reinforcing fibers embedded in the matrix material. The matrix material and/or the reinforcing fibers may include thermally-conductive particles such as nanodiamonds that increase the thermal conductivity of the substrate layer. Holes may be formed through the substrate layer for receiving and/or electrically connecting electronic components. The thermally-conductive particles are sized sufficiently small to allow the formation of the holes through the substrate layer using conventional equipment and processes such as drilling. The PWB may also include a protective coating that comprises thermally-conductive particles. The thermally-conductive particles described herein can reduce the need for heavy and bulky metal thermal layers in a manufacturing-friendly manner.

COMPOSITION FOR AN FPCB COVERLAY AND METHOD FOR PRODUCING THE SAME

A composition for a coverlay having superior thermal resistance, flexibility, and electrical properties, as well as a method of producing the coverlay and a method of forming the coverlay on a PCB are provided. The composition for a coverlay according to an embodiment of the invention may include 10.0˜45.0 wt % of polyimide, 0.01˜5.0 wt % of a defoaming agent, 0.01˜5.0 wt % of a leveling agent, 0.01˜5.0 wt % of a dispersing agent, 0.1˜15.0 wt % of modified polyimide, and a remainder of a solvent. Also provided is a method for producing a composition for a coverlay for an FPCB that includes: placing amine and an acid anhydride in a reaction solvent and subjecting to first polymerization; placing an acid anhydride in a separate reaction solvent subjecting to second polymerization; forming a polyamic acid by mixing a product of the first polymerization with a product of the second polymerization; and adding a defoaming agent, a leveling agent, a dispersing agent, and modified polyimide to the polyamic acid. Also provided is a method of forming a polyimide coverlay on an FPCB that includes: preparing a mask over a circuit of an FPCB, the mask having a desired printing pattern; applying the liquid polyimide composition of claim over an opening of the mask; and curing the PCB having the polyimide composition applied thereto. 1. A composition for a PCB coverlay , the composition comprising:10.0˜45.0 wt % of polyimide, 0.01˜5.0 wt % of a defoaming agent, 0.01˜5.0 wt % of a leveling agent, 0.01˜5.0 wt % of a dispersing agent, 0.1˜15.0 wt % of modified polyimide, and a remainder of a solvent.2. The composition of claim 1 , further comprising 1.0˜15.0 wt % of silica.3. The composition of claim 1 , wherein the polyimide is formed by a polymerization of an acid anhydride and amine.4. The composition of claim 3 , wherein the acid anhydride is any one of PMDA (pyromellitic dianhydride) claim 3 , PA (phthalic anhydride) claim 3 , BPDA (3 claim 3 ,3′4 claim 3 ,4′- ...

OVERMOULDING METHOD AND OVERMOULDED ELECTRONIC DEVICE

An overmoulded electronic assembly wherein a moulded thermoplastic cover encapsulates and is in direct contact with the electronic components, printed circuit board and an antenna is disclosed. There also a disclosed a method of fabricating an overmoulded electronic assembly using an injection moulding machine and where the thermoplastic cover encapsulates and is in direct contact with the electronic components, printed circuit board and an antenna. 1. A method of fabricating an overmoulded electronic assembly using an injection moulding machine comprising a mould , the assembly comprising a plurality of electronic components attached to a printed circuit board using a solder having a melting temperature and at least one antenna , the method comprising:drying a thermoplastic elastomeric compound in pellet form, said elastomeric compound having a melting temperature;heating said elastomeric compound to an injection temperature above said melting temperature;placing the electronic assembly in the mould, wherein the mould is maintained at a mould temperature of less than 32° C.;injecting said molten elastomeric compound into the mould at a pressure greater than about 20 MPascals wherein said molten elastomeric compound comes into direct contact with the plurality of electronic components and the at least one antenna;maintaining said mould pressure for at least about 5 seconds; andremoving said covered electronic assembly from the mould.2. The method of claim 1 , wherein said molten elastomeric compound is injected into the mould at a pressure of less than about 40 MPascals.3. The method of claim 2 , wherein said molten elastomeric compound is injected into the mould at a pressure of about 35 MPascals.4. The method of claim 1 , wherein said mould pressure is maintained for between 5 to 15 seconds.5. The method of claim 1 , wherein said mould pressure is maintained for about 10 seconds.6. The method of claim 1 , wherein said injection temperature is at least above a ...

CHIP PACKAGING SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND CHIP PACKAGING STRUCTURE HAVING SAME

A chip packaging substrate includes a dielectric layer, a first inner wiring layer embedded in the dielectric layer, an outer wiring layer, and many conductive connection points. The outer wiring layer is formed at one side of the dielectric layer, and is electrically connected to the first inner wiring layer through many first conductive vias in the dielectric layer. The conductive connection points are formed at the other side of the dielectric layer, and are electrically connected to the first inner wiring layer through many second conductive vias in the dielectric layer. 1. A method for manufacturing a chip packaging substrate , comprising:providing a supporting substrate, a first adhesive sheet, a first copper foil, a second adhesive sheet, a second copper foil, a third adhesive sheet, a third copper foil, a fourth adhesive sheet, and a fourth copper foil;stacking and laminating the second copper foil, the second adhesive sheet, the first copper foil, the first adhesive sheet, the supporting substrate, the third adhesive sheet, the third copper foil, the fourth adhesive sheet, and the fourth copper foil in the described order;patterning the second copper foil into a first inner wiring layer, and patterning the fourth copper foil into a second inner wiring layer;laminating a fifth adhesive sheet and a fifth copper foil onto the first inner wiring layer, and laminating a sixth adhesive sheet and a sixth copper foil onto the second inner wiring layer, such that the fifth adhesive sheet is sandwiched between the first inner wiring layer and the fifth copper foil, and the sixth adhesive sheet is sandwiched between the second inner wiring layer and the sixth copper foil;removing the supporting substrate, the first adhesive sheet, and the third adhesive sheet from the first copper foil and the third copper foil, thereby obtaining a first substrate, the first substrate comprising the second adhesive sheet, the fifth adhesive sheet, the first inner wiring layer, the ...

Method for producing multi-layer substrate and multi-layer substrate

A mounting-completed core parent substrate in which surface mount devices are mounted on both principal surfaces of the core parent substrate including a plurality of the core individual substrates and having a through hole formed in each core individual substrate so as to extend therethrough is formed. Then, resin layers in a partially cured state are formed on both the principal surfaces of the core parent substrate and the resin layers on both the principal surfaces are joined through the through holes so that the resin layers on both principal surfaces of each core individual substrate are joined and integrated to each other at a predetermined region, each core individual substrate being obtained by dividing the core parent substrate. After that, the resin layers are subjected to main curing. Thereafter, the core parent substrate is divided at a predetermined position and separated into the core individual substrates.

Method of making lens modules and the lens module

A method of making lens modules includes the following steps: Put a plurality of lens members between a first die and a second die, wherein the first die touches the substrate of each lens module, and the second die touches the lens of each lens module. Provide a housing material between the first die and the second die, and then solidify the housing material. Remove the first die and the second die to obtain a block; and Cut the block to obtain a plurality of lens modules.

Swallowing sensor device and methods of manufacturing the same

A swallowing sensor device includes a sensor unit comprising a sensor and a device that wirelessly transmits information detected by the sensor and a board group formed by stacking a plurality of rigid boards. The board group includes a fist rigid board on which one part of the sensor unit is mounted, a second rigid board on which other part of the sensor unit except for the one part of the sensor unit is mounted, and a third rigid board being disposed between the first rigid board and the second rigid board and comprising a through-hole drilled thereon, the through-hole being configured to electrically connecting the one part and the other part.

ELECTRICAL ARRANGEMENTS FOR SENSOR ASSEMBLIES IN ELECTROMAGNETIC NAVIGATION SYSTEMS

A sensor assembly includes a multilayer circuit, a first magnetic field sensor, and a second magnetic field sensor. The multilayer circuit extends between a proximal end and a distal end along a longitudinal axis. The multilayer circuit includes a plurality of electrical pads positioned at the proximal end. The first magnetic field sensor is coupled to the multilayer circuit and has a primary sensing direction aligned with the longitudinal axis. The second magnetic field sensor is coupled to the multilayer circuit and oriented with respect to the first magnetic field sensor such that the second magnetic field sensor has a primary sensing direction aligned with an axis orthogonal to the longitudinal axis. 1. A system comprising: a multilayer circuit including a proximal section, a distal section, and a longitudinal axis, the proximal section including a plurality of electrical pads,', 'a first magnetic field sensor coupled to the multilayer circuit at the distal section and having a primary sensing direction aligned with the longitudinal axis, and', 'a second magnetic field sensor coupled to the multilayer circuit at the distal section and oriented with respect to the first magnetic field sensor such that the second magnetic field sensor has a primary sensing direction aligned with an axis orthogonal to the longitudinal axis,', 'wherein the multilayer circuit includes a flexible substrate layer, wherein a first subset of the plurality of electrical pads is positioned on a first side of the flexible substrate layer, and wherein a second subset of the plurality of electrical pads is positioned on a second side of the flexible substrate layer opposite the first side., 'a sensor assembly including2. The system of claim 1 , wherein the proximal section of the multilayer circuit is substantially c-shaped.3. The system of claim 1 , wherein the flexible substrate layer is only partially covered by a mask layer such that a portion of the flexible substrate layer is exposed.4. ...

Display device and manufacturing method thereof

According to an exemplary embodiment of the present invention, the gap between a display panel and a driving circuit is maintained by an insulating side wall that covers the sides of conductors provided on a drive pad and that is higher than the surface of the conductors without adding a photolithography process. Even when, as the resolution of the display device is increased, the gap between two adjacent conductors is reduced, the two adjacent conductors may be prevented from being shorted.

SMART FUNCTIONAL LEATHER FOR STEERING WHEEL AND DASH BOARD

A smart functional vehicle component includes a vehicle component, a leather sheet fixed over a surface of the vehicle component, a flexible electronic circuit contacting an A-surface of the leather sheet and including a printed and cured conductive ink, a light source that emits light when electrical power is supplied to the light source, the light source being electrically connected to the circuit, and a pigmented coating arranged over the electronic circuit and over the light source. The pigmented coating inhibits or prevents the circuit and the light source form being visible through the pigmented coating. Light emitted by the light source is visible through the pigmented coating. Light emitted by the light source provides visual indicators that convey information to a vehicle occupant. 1. A smart functional vehicle component comprising:a vehicle component,a leather sheet fixed over a surface of the vehicle component,a flexible electronic circuit contacting an A-surface of the leather sheet and includinga printed and cured conductive ink,a light source that emits light when electrical power is supplied to the light source, the light source being electrically connected to the circuit, anda pigmented coating arranged over the electronic circuit and over the light source.2. The smart functional vehicle component according to claim 1 , wherein:the pigmented coating inhibits or prevents the circuit and the light source from being visible through the pigmented coating,light emitted by the light source is visible through the pigmented coating, andlight emitted by the light source provides visual indicators that convey information to a vehicle occupant.3. The smart functional vehicle component according to claim 1 , further including an acrylic urethane anti-soiling component over the A-surface of the leather sheet claim 1 , wherein the anti-soiling component is included a) as part of the pigmented coating claim 1 , orb) as a top coat over the pigmented coating.4. The ...

Illuminated wallpaper system

An illuminated wallpaper system according to various embodiments can include a laminated wallpaper and an electronic control unit. The laminated wallpaper can be configured to include a bottom layer and an outer layer. A flexible circuit board is interdisposed between the bottom layer and the outer layer. The electronic control unit wirelessly or directly connects to the laminated wallpaper for controlling the operation of the laminated wallpaper.

POLYIMIDE DRY FILM AND APPLICATION THEREOF

A polyimide dry film including a carrier and a polyimide layer and a method of using the same are provided. The polyimide layer contains (a) a polyimide precursor or soluble polyimide and (b) a solvent. The solvent includes a hydrophilic solvent and a hydrophobic solvent and a weight ratio of the hydrophilic solvent to the hydrophobic solvent is in the range of about 0.05 to about 2. The polyimide dry film of the present invention has water absorbability, is relatively stable even in the presence of water, and has a non-sticky surface. The resulting polyimide has excellent physical properties and can be used in a process in which water or an aqueous solution is involved to form a coverlay with excellent physical properties. 2. The dry film according to claim 1 , wherein the weight ratio of the hydrophilic solvent to the hydrophobic solvent is in the range of about 0.1 to about 1.3. The dry film according to claim 1 , wherein the weight ratio of the hydrophilic solvent to the hydrophobic solvent is in the range of about 0.25 to about 0.8.4. The dry film according to claim 1 , wherein the content of the solvent is in the range of about 30 wt % to about 70 wt % claim 1 , based on the total weight of the polyimide layer.5. The dry film according to claim 1 , wherein the hydrophilic solvent comprises dimethyl sulfoxide claim 1 , diethyl sulfoxide claim 1 , N claim 1 ,N-dimethyl-formamide claim 1 , N claim 1 ,N-diethyl-formamide claim 1 , N claim 1 ,N-dimethylacetamide claim 1 , N claim 1 ,N-diethylacetamide claim 1 , N-methyl-2-pyrrolidone claim 1 , N-ethyl-2-pyrrolidone claim 1 , N-propyl-pyrrolidone claim 1 , N-propyl-2-pyrrolidone claim 1 , phenol claim 1 , o-cresol claim 1 , m-cresol claim 1 , p-cresol claim 1 , xylenol claim 1 , halogenated phenol claim 1 , pyrocatechol claim 1 , tetrahydrofuran claim 1 , dioxane claim 1 , dioxolane claim 1 , propylene glycol monomethyl ether claim 1 , tetraethylene glycol dimethyl ether claim 1 , 2-butoxyethanol claim 1 , γ- ...

INKJET INKS FOR MANUFACTURING PRINTED CIRCUIT BOARDS

115-. (canceled)18. The method according to wherein X is O.19. The method according to wherein Land Lindependently represent a substituted or unsubstituted alkylene group.20. The method according to wherein the substituted or unsubstituted alkyl group claim 16 , the substituted or unsubstituted alkenyl group claim 16 , the substituted or unsubstituted alkynyl group claim 16 , the substituted or unsubstituted alkaryl group claim 16 , the substituted or unsubstituted aralkyl group claim 16 , or the substituted or unsubstituted (hetero)aryl group comprises at least one polymerizable group selected from the group consisting of an acrylate claim 16 , a methacrylate claim 16 , an acrylamide claim 16 , and a methacrylamide.21. The method according to wherein n is 1.22. The method according to wherein curing is carried out using UV radiation.23. The method according to wherein a solder mask is provided on a dielectric substrate containing an electrically conductive pattern in the inkjet printing step.24. The method according to also comprising a heating step.25. The method according to wherein an etch resist is provided on a metal surface in the inkjet printing step.26. The method according to wherein the metal surface is a copper surface.28. The method according to wherein a radiation curable inkjet ink comprising a polymerizable compound having a pKa of at least 2.5 is used.29. The radiation curable inkjet ink according to wherein the polymerizable compound is a phenolic monomer.30. The radiation curable inkjet ink according to wherein the phenolic monomer is selected from the group consisting of a phenolic acrylate claim 29 , a phenolic methacrylate claim 29 , a phenolic acrylamide and a phenolic methacrylamide. The present invention relates to a radiation curable inkjet ink that may be used in the manufacturing of PCBs, for example as an etch resistant inkjet ink, and methods of manufacturing such PCBs.The production workflow of printed circuit boards (PCBs) is ...

Optic for a Light Source

Optics over a light source, such as, but not limited to, an LED on a circuit board. The optic does not entirely encapsulate the LED but rather includes an inner surface such that an air gap exists between the optic and the LED. The optic may include a lens and may conform to the shape of the circuit board. 120-. (canceled)21. A method of providing an optic on a circuit board having an upper surface populated with at least one light emitting diode , the method comprising:a. first positioning an inner optic having an inner surface and outer surface on the upper surface of the circuit board and over the at least one light emitting diode such that an air gap exists between the inner surface of the inner optic and the at least one light emitting diode; andb. then molding an outer optic having an inner surface over the outer surface of the inner optic, wherein:the outer surface of the inner optic directly contacts the inner surface of the outer optic such that no gap exists between the inner optic and the outer optic; andthe inner optic and the outer optic comprise material having identical optical properties.22. The method of claim 21 , wherein the inner optic and the outer optic comprise silicone.23. The method of claim 21 , wherein the inner optic comprises an interlocking feature and wherein the method further comprises molding the outer optic into the interlocking feature to mechanically interlock the inner and outer optic.24. The method of claim 21 , wherein the circuit board comprises a thickness and an opening extending at least partially through the thickness of the circuit board and wherein the method further comprises molding the outer optic within the opening.25. The method of claim 24 , wherein the opening extends entirely through the thickness of the circuit board and wherein the method further comprises molding the outer optic within the opening and entirely through the thickness of the circuit board.26. The method of claim 21 , wherein the outer optic ...

Module, terminal assembly, and method for producing module

A module according to the present disclosure includes a circuit board, an electronic component on one of two principal surfaces of the circuit board, a connection conductor on the principal surface of the circuit board, and sealing resin on the principal surface of the circuit board. The electronic component and the connection conductor are covered with the sealing resin. The connection conductor includes a plate-shaped conductor and terminal sections. The plate-shaped conductor is disposed upright on the principal surface of the circuit board. The terminal sections extend from the plate-shaped conductor and away from the principal surface of the circuit board and are arranged side by side. Tip portions of the terminal sections are exposed at a surface of the sealing resin.

Biomass photosensitive material and method for manufacturing the same, and printed circuit board

A method of forming a biomass photosensitive material is provided, which includes ( 1 ) polymerizing (a) itaconic anhydride and (b) acrylate to form a copolymer, and ( 2 ) mixing the copolymer and (c) monomer with a single hydroxy group and a carbon-carbon double bond for a ring-opening addition reaction, wherein the (a) itaconic anhydride and the single hydroxy group of the (c) monomer with the single hydroxy group and the carbon-carbon double bond are reacted in the ring-opening addition reaction.

CHIP ON PRINTED CIRCUIT UNIT AND DISPLAY APPARATUS COMPRISING THE SAME

Disclosed is a printed circuit unit that includes a flexible member which has an upper surface and a lower surface and includes a first end and a second end. An output pad is disposed at the first end and is implemented to be connected to a bent display panel. A connecting unit is disposed at the second end and is implemented to be connected to a system board, and a drive chip is located between the output pad and the connecting unit. 1. A display device , comprising:a printed circuit unit having at least two electrode layers, a contact pad and a connector;a system board connected to the connector;a display panel connected to the contact pad, the display panel capable of being bent; anda driving unit driving the display panel, andwherein the driving unit and the connector are integrally formed and directly mounted on the printed circuit unit.2. The display device according to claim 1 , wherein the driving unit and the connector are disposed on the same surface of the printed circuit unit.3. The display device according to claim 2 , wherein the same surface of the printed circuit unit faces a rear surface of the display panel.4. The display device according to claim 3 , wherein the driving unit and the connector are located between the printed circuit unit and the display panel to reduce a thickness of the display device.5. The display device according to claim 1 , wherein the driving unit and the connector are located on different surfaces of the printed circuit unit.6. The display device according to claim 1 , wherein the driving unit and the contact pad are disposed on the same surface of the printed circuit unit.7. The display device according to claim 6 , wherein the connector is located on the same surface where the driving unit is disposed.8. The display device according to claim 6 , wherein the connector is disposed on a surface opposite to the surface where the driving unit and the contact pad are located.9. The display device according to claim 1 , wherein ...

SWIRL INTERCONNECTION IN A FLEXIBLE CIRCUIT

The present disclosure concerns a flexible electronic circuit () and method of manufacturing. A flexible substrate () with conductive tracks is provided with a rigid electronic component (). The component () comprises electrical contacts () on either sides. The conductive tracks connect to the contacts via an arced section that originates from respective sides of the contacts but swirls partially around the component to approaches the component along a centerline (CL) separating the contacts (). 1. A flexible electronic circuit comprisinga substrate; a first electrical contact on a first side of the electronic component, and', 'a second electrical contact on a second side of the electronic component opposite the first side; and, 'an electronic component comprising'} a first conductive track formed along a first pathway between a first contact pad contacting one of the electrical contacts of the electronic component and a first main connection to the rest of the conductive tracks disposed at the first side of the electronic component, and', 'a second conductive track formed along a second pathway between a second contact pad contacting the other one of the electrical contacts of the electronic component and a second main connection to the rest of the conductive tracks disposed at the second side of the electronic component; wherein, 'conductive tracks disposed on the substrate; wherein the conductive tracks comprise'}the first pathway comprises a first arced section that approaches the electronic component along a center line of the electronic component and reaches the electronic component exclusively from a third side, which center line intersects the electronic component at the third side of the electronic component transverse to the first side and the second side of the electronic component and between the electrical contacts; andthe second pathway comprises a second arced section that approaches the electronic component along the center line of the electronic ...

Electronic device and manufacturing method of the same

An electronic device and manufacturing method of the electronic device are disclosed. The manufacturing method includes: providing a substrate; forming a thin film circuit on the substrate, wherein the thin film circuit comprises at least one thin film transistor and at least one conductive trace; forming at least one first connection pad on the substrate, wherein the first connection pad is electrically connected with the thin film transistor through the conductive trace; disposing the substrate on a driving circuit board, wherein the driving circuit board comprises at least one second connection pad adjacent to and corresponding to the first connection pad; and forming a conductive member covering at least a part of the second connection pad and the first connection pad, wherein the second connection pad is electrically connected with the first connection pad through the conductive member.

Printed circuit board and method of fabricating the same

Disclosed is a printed circuit board. The printed circuit board includes an insulating layer, a copper foil formed on the insulating layer and formed therein with a groove to expose a portion of a top surface of the insulating layer, and a thermal conductive layer filled in the groove.

PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE USING THE SAME

A printed circuit board (PCB) includes: a base substrate including a top surface including an electronic device mounting region; chip connection pads that are provided on the electronic device mounting region; a conductive pattern group that is provided on the top surface of the base substrate and includes an extended conductive pattern extending between two adjacent chip connection pads from among the chip connection pads, the extended conductive pattern being spaced apart from each of the two adjacent chip connection pads; and a solder resist layer that covers a part of the extended conductive pattern and is spaced apart from the chip connection pads. 1. A printed circuit board (PCB) comprising:a base substrate comprising a top surface comprising an electronic device mounting region;chip connection pads that are provided on the electronic device mounting region;a conductive pattern group that is provided on the top surface of the base substrate and comprises an extended conductive pattern extending between two adjacent chip connection pads from among the chip connection pads, the extended conductive pattern being spaced apart from each of the two adjacent chip connection pads; anda solder resist layer that covers a part of the extended conductive pattern and is spaced apart from the chip connection pads.2. The PCB of claim 1 , wherein the solder resist layer comprises:a first solder resist layer that covers a part of the electronic device mounting region on the top surface of the base substrate; anda second solder resist layer that covers at least a part of a region excluding the electronic device mounting region on the top surface of the base substrate.3. The PCB of claim 2 , wherein the second solder resist layer is spaced apart from the first solder resist layer.4. The PCB of claim 2 , wherein the conductive pattern group protrudes from the top surface of the base substrate claim 2 , andthe first solder resist layer covers both a part of a side surface and a ...

ELECTRONIC DEVICE MODULE AND METHOD OF MANUFACTURING THE SAME

An electronic device module includes: a board including at least one mounting electrode and at least one external connection electrode and having a protective insulation layer which is provided on an outer surface thereof; at least one electronic device mounted on the mounting electrodes; a molded part sealing the electronic device; and at least one connective conductor of which one end is bonded to the external connection electrode of the board and which penetrates through the molded part to be disposed in the molded part, wherein the protective insulation layer is disposed to be spaced apart from the connective conductor. 1. An electronic device module comprising:a board including at least one mounting electrode and at least one external connection electrode and having a protective insulation layer on an outer surface of the board;at least one electronic device mounted on the mounting electrode;a molded part sealing the electronic device; andat least one connective conductor of which one end is bonded to the external connection electrode of the board and which penetrates through the molded part to be disposed in the molded part,wherein the protective insulation layer is spaced apart from the connective conductor.2. The electronic device module of claim 1 , wherein the molded part is interposed between the protective insulation layer and the connective conductor.3. The electronic device module of claim 1 , wherein the protective insulation layer covers a portion of the external connection electrode.4. The electronic device module of claim 1 , wherein the protective insulation layer is spaced apart from the external connection electrode.5. The electronic device module of claim 1 , wherein a portion of the molded part is bonded to the external connection electrode.6. The electronic device module of claim 5 , wherein an insulation film is interposed between the molded part and the external connection electrode.7. The electronic device module of claim 1 , wherein the ...

Package structure and manufacturing method thereof

A package structure and a method of manufacturing the package structure are disclosed. The package structure in accordance with an aspect of the present invention includes: a stiffener substrate; a dielectric layer and a circuit pattern layer laminated on the stiffener substrate; a protective layer laminated on the dielectric layer so as to protect the circuit pattern layer; a first electrode post protruded by penetrating the protective layer from the circuit pattern layer; and a chip receiving portion formed on a surface of the protective layer that is in a protruded direction of the first electrode post.

DISPLAY DEVICE

A display device includes a first substrate, at least one trace, a hydrophobic protective layer, a flexible printed circuit board (FPCB), a second substrate and a sealant. The first substrate has a display region and a peripheral region having an outer lead bonding (OLB) portion. The trace and the hydrophobic protective layer are disposed on the first substrate and extend from the display region to the OLB portion. The hydrophobic protective layer covers the trace and has at least one opening exposing a portion of the trace to define at least one lead and a surface microstructure. The lead and the surface microstructure are located in the OLB portion, and the surface microstructure is located on a surface of the hydrophobic protective layer away from the trace. One end of the FPCB leans against the surface microstructure and the FPCB is electrically connected to the lead. 1. A display device , comprising:a first substrate having a display region and a peripheral region located around the display region, the peripheral region having an outer lead bonding portion connected to the display region;at least one trace disposed on the first substrate and extending from the display region into the outer lead bonding portion of the peripheral region;a hydrophobic protective layer disposed on the first substrate and extending from the display region into the outer lead bonding portion of the peripheral region, the hydrophobic protective layer covering the trace and having at least one opening and a surface microstructure, the opening exposing a portion of the trace to define at least one lead, the lead and the surface microstructure being located in the outer lead bonding portion, and the surface microstructure being located on a surface of the hydrophobic protective layer away from the trace;a flexible printed circuit board disposed on the first substrate and located in the outer lead bonding portion of the peripheral region, wherein an end of the flexible printed circuit ...

ELECTRONIC DEVICE MODULE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE MODULE

An electronic device module may include: a board; a ground electrode disposed on a first surface of the board; a sealing portion disposed on the first surface of the board; electronic devices mounted on the first surface of the board such that at least one of the electronic devices is embedded in the sealing portion; a first shielding wall connected to the ground electrode and disposed along a side surface of the sealing portion; and a shielding layer formed of a conductive material and disposed along a surface formed by the sealing portion and the first shielding wall. 1. An electronic device module , comprising:a board;a ground electrode disposed on a first surface of the board;first and second electronic devices mounted on the first surface of the board;a sealing portion disposed on the first surface of the board embedding the second electronic device;a first shielding wall connected to the ground electrode and disposed to divide the sealing portion; anda shielding layer formed of a conductive material and disposed along a surface formed by the sealing portion and the first shielding wall,wherein the first shielding wall comprises an extension portion at the surface formed by the sealing portion and the first shielding wall.2. The electronic device module of claim 1 , wherein the second electronic device comprises a plurality of second electronic devices.3. The electronic device module of claim 1 , wherein the shielding layer is spaced apart from the board.4. The electronic device module of claim 3 , further comprising an external sealing portion disposed between the board and a bottom of the shielding layer.5. The electronic device module of claim 1 , wherein at least a portion of the shielding layer is disposed on the board.6. The electronic device module of claim 1 , wherein a width of the first shielding wall decreases in a direction from an end of the first shielding wall spaced from the board toward the board.7. The electronic device module of claim 6 , ...

ECOLOGICAL MULTILAYER STRUCTURE FOR HOSTING ELECTRONICS AND RELATED METHOD OF MANUFACTURE

Integrated multilayer structure for hosting electronics, including a first substrate—including organic, electrically substantially insulating natural material including and exhibiting a related naturally grown or natural textile based surface texture, said first substrate having a first side facing a predefined front side of the structure, said first side of the first substrate being optionally configured to face a user and/or use environment of the structure or of its host device, and an opposite second side, a plastic layer, optionally including thermoplastic or thermoset plastics, molded onto said second side of the first substrate so as to at least partially cover it, and circuitry provided on the second side of the first substrate, said circuitry being at least partially embedded in the molded material of the plastic layer. Related method of manufacture is presented. 117.-. (canceled)18. An integrated multilayer structure for hosting electronics , comprising:a 3d-formable first substrate fabricated from a substantially electrically-insulative, organic material, the first substrate having a first side, and an opposite second side;a plastic layer molded onto the second side of the first substrate to at least partially cover the first substrate, the plastic layer having a first side that faces the second side of the first substrate, and an opposite second side;a second substrate disposed on the second side of the plastic layer; anda light source and associated circuitry disposed on the second substrate, wherein the organic material of the first substrate comprises opaque material being at least locally configured to have a reduced thickness area to enable light emitted by the light source to glow through the first substrate and thereby towards an environment of the integrated multilayer structure on the first side of the first substrate.19. The integrated multilayer structure according to claim 18 , wherein the second substrate is plastic.20. The integrated ...

ELECTRONIC COMPONENT MODULE AND MANUFACTURING METHOD THEREOF

An electronic device module includes a first substrate, at least one electronic device mounted on a lower surface of the first substrate, a second substrate mounted on a lower surface of the first substrate to electrically connect the first substrate to an external source of power, a connecting conductor bonded to a lower surface of the second substrate, and a sealing portion sealing the electronic device, the second substrate, and the connecting conductor, wherein a mounting height of the second substrate is configured to be lower than a mounting height of the electronic device. 1. An electronic device module comprising:a first substrate;an electronic device mounted on a lower surface of the first substrate;a second substrate mounted on the lower surface of the first substrate, the second substrate being configured to electrically connect the first substrate to an external source of power;a connecting conductor bonded to a lower surface of the second substrate; anda sealing portion that seals the electronic device, the second substrate, and the connecting conductor,wherein the sealing portion covers the lower surface of the second substrate,the connecting conductor passes through the sealing portion so that a surface of the connecting conductor is exposed to an exterior of the sealing portion, andthe exposed surface of the connecting conductor and a lower surface of the sealing portion are disposed on a same plane.2. The electronic device module of claim 1 , wherein a surface of the electronic device is exposed to the exterior of the sealing portion claim 1 , andthe exposed surface of the connecting conductor, the lower surface of the sealing portion, and the exposed surface of the electronic device are disposed on a same plane.3. The electronic device module of claim 1 , further comprising a protective layer disposed along a surface formed by the electronic device and the sealing portion.4. The electronic device module of claim 3 , further comprising a shielding ...

DISPLAY DEVICE

According to one embodiment, a display device includes an insulating substrate includes a first area, a second area adjacent to the first area, and a third area adjacent to the second area, a wiring substrate mounted at a position overlapping the third area on a surface side of the insulating substrate, and a supporting substrate attached to the insulating substrate on the other surface side of the insulating substrate, which is opposite to the surface side, wherein the second area is located between the first area and the third area, and the supporting substrate is provided so as not to overlap the second area. 1. A display device comprising:an insulating substrate comprising a first area, a second area adjacent to the first area, and a third area adjacent to the second area;a wiring substrate mounted at a position overlapping the third area on a surface side of the insulating substrate; anda supporting substrate attached to the insulating substrate on the other surface side of the insulating substrate, which is opposite to the surface side, whereinthe second area is located between the first area and the third area, andthe supporting substrate is provided so as not to overlap the second area.2. The display device of claim 1 , whereinthe insulating substrate is formed such that a film thickness of the second area is less than a film thickness of the first area and a film thickness of the third area.3. The display device of claim 1 , whereinthe insulating substrate comprises, on the other surface side of the insulating substrate, a first surface located in the first area, a second surface located in the second area, and a third surface located in the third area, andthe second surface is rougher than the first surface and the third surface.4. The display device of claim 1 , whereinthe supporting substrate transmits 70% or more of laser light having a wavelength less than or equal to 355 nm.5. The display device of claim 1 , whereinthe supporting substrate is ...

Polymeric Electromagnetic Shield for Electronic Components

An electronic device can include a circuit board, an electronic component mounted on the circuit board, a conductive contact disposed (e.g., deposited) on the circuit board, and a shielding polymer layer deposited over the electronic component. The shielding polymer layer includes a network of conductive pathways formed from sintered particles. The network of conductive pathways is electrically coupled to the conductive contact, which can be configured for connection to a power source ground. As such, the network of conductive pathways enables electromagnetic shielding of the electronic component. 1. (canceled)2. An electronic device comprising:a circuit board;an electronic component mounted on the circuit board;a conductive contact disposed on the circuit board and configured for connection to a power source ground; anda shielding polymer layer disposed over the electronic component and including a network of conductive pathways formed from sintered particles, wherein the network of conductive pathways is electrically coupled to the conductive contact and the sintered particles are produced from non-electrically conductive sinterable particles exposed to sufficient energy to sinter the particles.3. The electronic device of claim 2 , wherein the energy is electromagnetic energy selected from the group consisting of ultraviolet light claim 2 , visible laser light claim 2 , infrared light claim 2 , x-rays claim 2 , and microwaves.4. The electronic device of claim 2 , wherein the shielding polymer layer substantially encloses the electronic component.5. The electronic device of claim 2 , wherein the network of conductive pathways occupies an entire surface area of the shielding polymer layer.6. An electronic device comprising:a circuit board;an electronic component mounted on the circuit board;a conductive contact disposed on the circuit board and configured for connection to a power source ground; anda shielding polymer layer disposed over the electronic component and ...

ELECTRONIC UNIT AND METHOD OF MAKING THE SAME

A digital amplifier integrated circuit (“IC”), which is a heat-generating electronic component, is mounted on an upper surface of an insulating substrate. The digital amplifier IC is disposed inside a recess of a heat sink. The heat sink includes a peripheral wall having an end face placed on the upper surface of the insulating substrate. A hot-melt resin layer, molded by hot-melt molding, covers the upper surface of the insulating substrate. The hot-melt resin layer is in contact with a side face of the peripheral wall and retains the heat sink on the insulating substrate. The recess of the heat sink has no hot-melt resin therein. 1. An electronic unit comprising:a substrate;a heat-generating electronic component mounted on the substrate;a heat sink disposed on the heat-generating electronic component; anda hot-melt resin layer disposed on the substrate,wherein the heat sink includes an upper part that serves as a radiating portion and a lower part that has a recess facing downward and that includes a peripheral wall surrounding the recess and having an end face and a side face, the recess of the heat sink covering the heat-generating electronic component, and the end face of the peripheral wall of the heat sink placed on a surface of the substrate,wherein the hot-melt resin layer covers at least part of the surface of the substrate and at least part of the side face of the peripheral wall of the heat sink, andwherein the peripheral wall separates the heat-generating electronic component from the hot-melt resin layer.2. The unit according to claim 1 , wherein the heat sink is fixed to the surface of the substrate by adhesion of the hot-melt resin layer.3. The unit according to claim 2 ,wherein the end face of the peripheral wall is placed on the surface of the substrate with an adhesive layer in between, andwherein the hot-melt resin layer retains the heat sink on the substrate with a force greater than a force with which the adhesive layer retains the heat sink on ...

Implantable thin film devices

Implementations described and claimed herein provide thin film devices and methods of manufacturing and implanting the same. In one implementation, a shaped insulator is formed having an inner surface, an outer surface, and a profile shaped according to a selected dielectric use. A layer of conductive traces is fabricated on the inner surface of the shaped insulator using biocompatible metallization. An insulating layer is applied over the layer of conductive traces. An electrode array and a connection array are fabricated on the outer surface of the shaped insulator and/or the insulating layer, and the electrode array and the connection array are in electrical communication with the layer of conductive traces to form a flexible circuit. The implantable thin film device is formed from the flexible circuit according to the selected dialectic use.