METHOD FOR FORMING HOUSINGS FOR ELECTRONIC COMPONENTS AND ELECTRONIC COMPONENTS THAT ARE HERMETICALLY ENCAPSULATED THEREBY

GLASS MATERIAL FOR USE AT HIGH FREQUENCIES

Method for encasing electronic components and integrated circuits

Method for the production of structured layers on substrates

Glass material for use at high frequencies

METHOD FOR PRODUCING A COMPONENT COMPRISING A CONDUCTOR STRUCTURE THAT IS SUITABLE FOR USE AT HIGH FREQUENCIES

Method for producing a component comprising a conductor structure that is suitable for use at high frequencies and corresponding component

METHOD FOR PRODUCING MICRO-ELECTROMECHANICAL COMPONENTS

Method for connecting substrates and composite element

METHOD FOR CONNECTING SUBSTRATES AND COMPOSITE ELEMENT

METHOD FOR PRODUCING CONTACTS AND PRINTED CIRCUIT PACKAGES

Method for producing a copy protection for an electronic circuit and corresponding component

METHOD FOR PRODUCING A COPY PROTECTION FOR AN ELECTRONIC CIRCUIT

Method for producing contacts and printed circuit packages

METHOD FOR PRODUCING A PRODUCT HAVING A STRUCTURED SURFACE

Method for producing a product having a structured surface

METHOD FOR PRODUCING ELECTRONIC COMPONENTS

METHOD FOR COATING METAL SURFACES AND SUBSTRATE HAVING A COATED METAL SURFACE

Method for producing electronic components

METHOD FOR THE PRODUCTION OF STRUCTURED LAYERS ON SUBSTRATES

Process for producing microelectromechanical components

Method for forming contact and packaged integrated circuit component

The invention proposes a process for producing electrical contact connections for at least one component which is integrated in a substrate material, the substrate material having a first surface region, and at least one terminal contact being arranged at least partially in the first surface region for each component, which is distinguished in particular by application of a covering to the first surface region and production of at least one contact passage which, in the substrate material, runs transversely with respect to the first surface region, in which process, in order to form at least one contact location in a second surface region which is to be provided, at least one electrical contact connection from the contact location to at least one of the terminal contacts is produced via the respective contact passages. Very advantageously, it is in this way possible for a contact location to be produced on the to the terminal contact [sic] and therefore a contact location which is electrically ...

Process for making contact with and housing integrated circuits

The invention proposes a process for producing electrical contact connections for at least one component which is integrated in a substrate material, the substrate material having a first surface region, and at least one terminal contact being arranged at least partially in the first surface region for each component, which is distinguished in particular by application of a covering to the first surface region and production of at least one contact passage which, in the substrate material, runs transversely with respect to the first surface region, in which process, in order to form at least one contact location in a second surface region which is to be provided, at least one electrical contact connection from the contact location to at least one of the terminal contacts is produced via the respective contact passages. Very advantageously, it is in this way possible for a contact location to be produced on the terminal contact and therefore a contact location which is electrically connected ...