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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Форма поиска

Поддерживает ввод нескольких поисковых фраз (по одной на строку). При поиске обеспечивает поддержку морфологии русского и английского языка
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Применить Всего найдено 57986. Отображено 100.
05-01-2012 дата публикации

Driving circuit and liquid crystal display device including the same

Номер: US20120002146A1
Автор: Jin-Cheol Hong, Min-Hwa Kim
Принадлежит: Individual

A tape carrier package (TCP) includes a film, a plurality of output leads and a plurality of input leads on the film, the plurality of output leads and the plurality of input leads being disposed on different sides, first and second TCP alignment marks arranged on opposing sides of the plurality of output leads, and a third TCP alignment mark at a central portion of the plurality of output leads.

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Номер записи: 1
05-01-2012 дата публикации

Systems and methods of manufacturing printed circuit boards using blind and internal micro vias to couple subassemblies

Номер: US20120003844A1
Автор: Michael J. Taylor, Monte P. Dreyer, Rajesh Kumar
Принадлежит: Individual

Systems and methods of manufacturing printed circuit boards using blind and internal micro vias to couple subassemblies. An embodiment of the invention provides a method of manufacturing a printed circuit including attaching a plurality of metal layer carriers to form a first subassembly including at least one copper foil pad on a first surface, applying an encapsulation material onto the first surface of the first subassembly, curing the encapsulation material and the first subassembly; applying a lamination adhesive to a surface of the cured encapsulation material, forming at least one via in the lamination adhesive and the cured encapsulation material to expose the at least one copper foil pad, attaching a plurality of metal layer carriers to form a second subassembly, and attaching the first subassembly and the second subassembly.

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Номер записи: 2
12-01-2012 дата публикации

Resin complex and laminate

Номер: US20120009385A1
Автор: Masataka Satou, Mitsuyuki Tsurumi
Принадлежит: Fujifilm Corp

A resin complex which is capable of being plated, is highly hydrophobic, and has excellent molding properties and good adhesion to a plated layer, a laminate including a layer of the resin complex, and a method of manufacturing the laminate are provided. The resin complex capable of being plated includes a hydrophobic compound A having a functional group capable of interacting with a plating catalyst, its precursor or a metal, and a hydrophobic resin B incompatible with the hydrophobic compound A. The resin complex has a phase-separated morphology in which the hydrophobic compound A forms a dispersed phase and the hydrophobic resin B forms a continuous phase and the hydrophobic compound A is exposed on at least part of a surface of the resin complex.

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Номер записи: 3
19-01-2012 дата публикации

Printed wiring board and a method of production thereof

Номер: US20120012464A1
Автор: Tomoyuki Ikeda
Принадлежит: Ibiden Co Ltd

A method for manufacturing a printed wiring board including providing an insulating resin substrate having first and second surfaces, irradiating laser upon the first surface such that a first opening portion having an opening on the first surface and tapering inward is formed, irradiating laser upon the second surface such that a second opening portion having an opening on the second surface, tapering inward and communicated to the first opening portion is formed and that a penetrating-hole having the first and second opening portions is formed, forming an electroless plated film on an inner wall surface of the penetrating-hole, and forming an electrolytic plated film on the electroless plated film such that a through hole conductor structure is formed in the penetrating-hole. The opening of the first portion has an axis of the center of gravity offset with respect to that of the opening of the second opening portion.

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Номер записи: 4
26-01-2012 дата публикации

Ceramic electronic component and wiring board

Номер: US20120018204A1
Автор: Koji Sato, Yasuhiro Nishisaka, Yukio Sanada
Принадлежит: Murata Manufacturing Co Ltd

A ceramic electronic component includes a ceramic element body having a substantially rectangular parallelepiped shape, and first and second external electrodes. The first and second external electrodes are provided on a first principal surface. Portions of the first and second external electrodes project further than the other portions in a thickness direction. A projecting portion of the first external electrode is provided at one end of the first external electrode in a length direction and a second projecting portion of the second external electrode is provided at another end of the second external electrode in the length direction. Thus, a concave portion is provided between the projecting portions, and a portion of the first principal surface provided between the first and second external electrodes is exposed.

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Номер записи: 5
26-01-2012 дата публикации

Method of forming a packaged semiconductor device

Номер: US20120021565A1
Автор: Douglas G. Mitchell, George R. Leal, Jason R. Wright, Jianwen Xu, Scott M. Hayes, Zhiwei Gong
Принадлежит: Individual

A method is used to form a packaged semiconductor device. A semiconductor device, which has an active surface, is placed in an opening of a circuit board. The circuit board has a first major surface and a second major surface having the opening, first vias that extend between the first major surface and the second major surface, first contact pads terminating the vias at the first major surface, and second contact pads terminating the vias at the second major surface. A dielectric layer is applied over the semiconductor device and the second major surface of the circuit board. An interconnect layer is formed over the dielectric layer. The interconnect layer has second vias electrically connected to the second contact pads, third vias that are electrically connected to the active surface of the semiconductor device, an exposed surface, and third contact pads at the exposed surface.

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Номер записи: 6
02-02-2012 дата публикации

Soldering apparatus

Номер: US20120024938A1
Автор: Minoru Yamamoto, Shinji Yoshino, Toshinori Mimura
Принадлежит: Panasonic Corp

A solder drawing member ( 402 ) is detachably attached on the outer side of a jet nozzle ( 303 ) that jets molten solder pumped from a solder tank ( 102 ) storing the molten solder. The solder drawing member ( 402 ) is made of a material having higher wettability to the molten solder than the surface material of the jet nozzle ( 303 ). Thus a force of separating the solder from a point to be soldered can be increased by a surface tension of the molten solder flowing on the solder drawing member ( 402 ), thereby reducing bridge phenomena and icicle phenomena.

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Номер записи: 7
02-02-2012 дата публикации

Semiconductor device comprising a passive component of capacitors and process for fabrication

Номер: US20120025348A1
Автор: Laurent Marechal, Romain Coffy, Yvon Imbs
Принадлежит: STMicroelectronics Grenoble 2 SAS

A semiconductor device includes a wafer having a frontside and a backside. The wafer is formed from at least one integrated circuit chip having an electrical connection frontside co-planar with the wafer frontside and a backside co-planar with the wafer backside. A passive component including at least one conductive plate and a dielectric plate is positioned adjacent the integrated circuit chip. An encapsulation block embeds the integrated circuit chip and the passive component, the block having a frontside co-planar with the wafer frontside and a backside co-planar with the wafer backside. An electrical connection is made between the electrical connection frontside and the passive component. That electrical connection includes connection lines placed on the wafer frontside and wafer backside. The electrical connection further includes at least one via passing through the encapsulation block.

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Номер записи: 8
09-02-2012 дата публикации

Multi-Layer Circuit Assembly And Process For Preparing The Same

Номер: US20120031655A1
Автор: Alan G. Wang, Kevin C. Olson
Принадлежит: PPG Industries Ohio Inc

A process for fabricating a multi-layer circuit assembly is provided. The process includes (a) providing a substrate at least one area of which comprises a plurality of vias area(s) having a via density of 500 to 10,000 holes/square inch (75 to 1550 holes/square centimeter); (b) applying a dielectric coating onto all exposed surfaces of the substrate to form a conformal coating thereon; (c) removing the dielectric coating in a predetermined pattern to expose sections of the substrate; (d) applying a layer of metal to all surfaces to form metallized vias through and/or to the electrically conductive core; (e) applying a resist to the metal layer to form a photosensitive layer thereon; (f) imaging resist in predetermined locations; (g) developing resist to uncover selected areas of the metal layer; and (h) etching uncovered areas of metal to form an electrical circuit pattern connected by the metallized vias.

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Номер записи: 9
09-02-2012 дата публикации

Printed circuit board and method for manufacturing the same

Номер: US20120031658A1
Автор: Jo-Youn Won, Jun-Hyung SON, Young-Il Cho
Принадлежит: Samsung Electro Mechanics Co Ltd

A printed circuit board and a method for manufacturing a printed circuit board are disclosed. The printed circuit board in accordance with an embodiment of the present invention includes: a substrate; a first pad and a second pad, formed on one surface of the substrate and separated from each other; a first wiring extended from the first pad; a second wiring extended from the second pad and neighboring the first wiring; and a solder resist layer formed on one surface of the substrate so as to cover portions of the first wiring and the second wiring, and an indentation is formed in an area between the first wiring and the second wiring on one side of the solder resist layer.

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Номер записи: 10
16-02-2012 дата публикации

Anisotropic conductive film and method of fabricating the same

Номер: US20120037399A1
Автор: Chien-Chih Hsiao, Chin-Hsin CHIANG
Принадлежит: Core Precision Material Corp

A method of fabricating anisotropic conductive film comprises the steps of: mixing conductive particles, a resin material and a solvent to form slurry; and providing a separate means for progressively distributing the conductive particles on one side of the resin material when forming the anisotropic conductive film from slurry. The method disclosed in the present invention is easy to use, and the anisotropic conductive film fabricated by the method has high conductive particles capturing rate.

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Номер записи: 11
16-02-2012 дата публикации

Method of manufacturing antenna using sintering of metal and antenna manufactured by the same

Номер: US20120038514A1
Автор: Kug Hyeon Bang
Принадлежит: Dynatron Co Ltd

A method of manufacturing an antenna includes forming a base including a synthetic resin, forming a conductive pattern on the base and forming a circuit pattern by sintering the conductive pattern by applying heat. The conductive pattern includes a conductive paste and a binding material binding the base and the conductive pattern. The conductive paste includes a metal.

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Номер записи: 12
23-02-2012 дата публикации

Method of producing circuit board

Номер: US20120042511A1
Автор: Takashi Shoji, Takekazu Sakai
Принадлежит: Showa Denko KK

Provided is a method of producing a circuit board that can stably provide normal circuit boards by preventing the solder detachment and the generation of needle-like crystals during the formation of solder bumps. The method of producing a circuit board includes steps of forming an adhesive layer by applying an adhesiveness-imparting compound to the surface of a terminal of the circuit board; attaching solder particles onto the adhesive layer; applying an activator that includes a hydrohalic acid salt of an organic base to the solder particles and fixing the solder particles by heating the circuit board to which the solder particles have been attached at a temperature equal to or lower than the melting point of the solder; applying a flux to the circuit board to which the solder particles have been fixed; and melting the solder particles by heating the circuit board.

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Номер записи: 13
23-02-2012 дата публикации

Flexible circuit structure with stretchability and method of manufacturing the same

Номер: US20120043115A1
Автор: Ying-Ching Shih, Yu-Hua Chen
Принадлежит: Industrial Technology Research Institute ITRI

In one example embodiment, a flexible circuit structure with stretchability is provided that includes a flexible substrate, a plurality of flexible bumps formed on the flexible substrate, and a metal layer formed on the plurality of flexible bumps and the flexible substrate.

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Номер записи: 14
23-02-2012 дата публикации

Terminal structure, printed wiring board, module substrate, and electronic device

Номер: US20120044652A1
Автор: Atsushi Sato, Kenichi Yoshida, Yuhei HORIKAWA
Принадлежит: TDK Corp

The present invention relates to a terminal structure. The terminal structure includes: a terminal having: a conductor layer containing at least one metal selected from gold, silver, and copper; a first layer containing nickel and phosphorus, laid on the conductor layer; a second layer having a smaller atomic ratio of nickel to phosphorus than the first layer and containing Ni 3 P, laid on the first layer; a third layer containing a first intermetallic compound of an Ni—P—Sn type, laid on the second layer; and a fourth layer containing a second intermetallic compound of an Ni—Cu—Sn type, laid on the third layer; and a solder layer on the fourth layer of the terminal. Ra2 is larger than Ra1, where Ra1 is a surface roughness of the third layer on the second layer side and Ra2 is a surface roughness of the third layer on the fourth layer side.

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Номер записи: 15
01-03-2012 дата публикации

Buffer Layer to Enhance Photo and/or Laser Sintering

Номер: US20120049384A1
Автор: Mohshi Yang, Peter B. Laxton, Zvi Yaniv
Принадлежит: Ishihara Chemical Co Ltd

Conductive lines are deposited on a substrate to produce traces for conducting electricity between electronic components. A patterned metal layer is formed on the substrate, and then a layer of material having a low thermal conductivity is coated over the patterned metal layer and the substrate. Vias are formed through the layer of material having the low thermal conductivity thereby exposing portions of the patterned metal layer. A film of conductive ink is then coated over the layer of material having the low thermal conductivity and into the vias to thereby coat the portions of the patterned metal layer, and then sintered. The film of conductive ink coated over the portion of the patterned metal layer does not absorb as much energy from the sintering as the film of conductive ink coated over the layer of material having the low thermal conductivity. The layer of material having the low thermal conductivity may be a polymer, such as polyimide.

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Номер записи: 16
15-03-2012 дата публикации

Method of fabricating circuit board structure

Номер: US20120060368A1
Автор: Cheng-Po Yu, Han-Pei Huang
Принадлежит: Unimicron Technology Corp

A method of fabrication a circuit board structure comprising providing a circuit board main body, forming a molded, irregular plastic body having a non-plate type, stereo structure and at least one scraggy surface by encapsulating at least a portion of said circuit board main body with injection molded material, and forming a first three-dimensional circuit pattern on said molded, irregular plastic body thereby defining a three-dimensional circuit device.

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Номер записи: 17
15-03-2012 дата публикации

Metal pattern formation system

Номер: US20120060708A1
Автор: Chien-Ho Huang, Ching-Yu Tso, Hsiou-Jeng Shy, Li-Jiuan Chen, Shang-Wanq Yeh
Принадлежит: Individual

The invention discloses a metal pattern formation system produced in the following steps: an organic liquid is first printed on a substrate to form a base pattern. A metal is then evaporated to generate several metal particles for covering the printed substrate. At last, the substrate is heated to vaporize the base pattern, and the metal particles adhered to the substrate forms a metal pattern complementary to the base pattern.

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Номер записи: 18
15-03-2012 дата публикации

Method for forming conductive via in a substrate

Номер: US20120064230A1
Автор: Chien-Hung Ho, Hsiao-Chun Liu, Sheng-Li Hsiao, Shih-Long Wei
Принадлежит: Viking Tech Corp

The steps of the present invention are as follows: (a) a detachable film is formed on both sides of a substrate, respectively; (b) a number of vias running through both sides of the detachable films are formed in the substrate; (c) the vias are filled with a conductive paste; (d) the detachable films are peeled off; (e) a metallic conductive layer is deposited on both sides of the substrate, respectively; (f) a specific mold pattern is formed on the metallic conductive layers, respectively, by a photolithographic process; (g) a metallic circuit layout layer is formed on the patterns, respectively, by an electrochemical process; and (h) the mold patterns and the metallic conductive layers are removed. As such, the substrate is not contaminated by the conductive paste. Further, by using deposition, metallic conductive layers are directly adhered to the substrate and, by using photolithography, layouts with small linewidth could be formed.

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Номер записи: 19
15-03-2012 дата публикации

Method of making a semiconductor chip assembly with a post/base heat spreader and a substrate using grinding

Номер: US20120064672A1
Автор: Charles W.C. Lin, Chia-Chung Wang
Принадлежит: Individual

A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post through an opening in the adhesive, mounting a substrate on the adhesive including inserting the post into an aperture in the substrate, then flowing the adhesive between the post and the substrate in the aperture, solidifying the adhesive, then grinding the post and the adhesive, then mounting a semiconductor device on a heat spreader that includes the post and the base, electrically connecting the semiconductor device to the substrate and thermally connecting the semiconductor device to the heat spreader.

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Номер записи: 20
15-03-2012 дата публикации

Composition, coated film formed of the composition, layered product containing the coated film, and electronic device incorporating the layered product

Номер: US20120065310A1
Автор: Eiji Honda, Enhai Sun, Hiroaki Adachi, Syuzou Waki, Toshiyuki Goshima, Yoro Sasaki, Yoshikazu Nishikawa
Принадлежит: Individual

An object is to provide a composition that has good viscosity stability and flowability at the time of processing, good shape retention after the processing, and good drying property in a temperature range of not degrading the conductor layer at the time of drying and that enables a coated film excellent in strength of adhesion with metal•polyimide, flame resistance, heat resistance, flexibility, mechanical properties, and chemical resistance to obtained after being dried. To meet this object, a composition is prepared containing (A) polyimide and (B) mixed solvent of two kinds or more, and the solubility parameter of the mixed solvent of two kinds or more ranges from 9 to 14.

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Номер записи: 21
22-03-2012 дата публикации

Apparatus and method for wet processing substrate

Номер: US20120067848A1
Автор: Chao-Wen Lin
Принадлежит: Foxconn Advanced Technology Inc

An exemplary wet processing apparatus includes a tank, a conveyor configured for conveying a substrate, and a spraying system. The tank receives a wet processing liquid. The conveyor includes a first conveying portion, a second conveying portion, and a third conveying portion. The first conveying portion is in the tank and conveys the substrate in the wet processing liquid. The second conveying portion is obliquely interconnected between the first and third conveying portions. The third conveying portion conveys the substrate above the wet processing liquid in the tank. The spraying system is above the third conveying portion, sprays the wet processing liquid onto the substrate on the third conveying portion.

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Номер записи: 22
29-03-2012 дата публикации

Multi-layered substrate

Номер: US20120073871A1
Автор: Bernd Karl Appelt, Ming-Chiang Lee, You-Lung Yen, Yuan-Chang Su
Принадлежит: Advanced Semiconductor Engineering Inc

The present invention directs to double-sided multi-layered substrate a base, at least a through-hole passing through the base, patterned first and second metal layers formed on the two opposite surfaces of the base, and first and second plating layers. The first plating layer covers a sidewall of the through-hole and the bottom surface surrounding a bottom opening of the through hole. The second plating layer covers the first plating layer and the top surface surrounding a top opening of the through hole.

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Номер записи: 23
29-03-2012 дата публикации

Integrated circuit packaging system with a shield and method of manufacture thereof

Номер: US20120075821A1
Автор: Reza Argenty Pagaila
Принадлежит: Individual

A method of manufacture of an integrated circuit packaging system includes: providing a substrate; mounting a first integrated circuit over the substrate; forming an encapsulant around the first integrated circuit and over the substrate; and forming a shield structure within and over the encapsulant while simultaneously forming a vertical interconnect structure.

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Номер записи: 24
05-04-2012 дата публикации

Multilayer printed wiring board and method for manufacturing multilayer printed wiring board

Номер: US20120080400A1
Автор: Iku Tokihisa, Sho Akai, Tatsuya Imai
Принадлежит: Ibiden Co Ltd

A multilayer printed wiring board including a first interlayer resin insulation layer, a pad formed on the first interlayer resin insulation layer, a solder resist layer formed on the first interlayer resin insulation layer and the pad, a protective film formed on a portion of the pad exposed by an opening of the solder resist layer, and a coating layer formed between the pad and the solder resist layer. The pad mounts an electronic component. The coating layer has a metal layer and a coating film. The metal layer is formed on the surface of the pad and the coating film is formed on the metal layer.

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Номер записи: 25
05-04-2012 дата публикации

Methods of wet etching a self-assembled monolayer patterned substrate and metal patterned articles

Номер: US20120082825A1
Автор: Jeffrey H. Tokie, Lijun Zu, Matthew H. Frey, Myungchan Kang
Принадлежит: 3M Innovative Properties Co

Method of patterning a substrate are described including a method of providing a substrate comprising a metalized surface having a self-assembled monolayer patterned region and unpatterned region; and wet etching the metalized surface in a liquid etchant agitated with bubbling gas to remove metal from the unpatterned regions to form a metal pattern. Also described are metal patterned article including an article comprising a substrate and an etched microcontact printed metal pattern disposed on the substrate wherein the pattern has a thickness of at least 100 nanometers and a pattern feature uniformity of at least 50% for an area of at least 25 cm 2 .

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Номер записи: 26
19-04-2012 дата публикации

Semiconductor chip assembly with bump/base/ledge heat spreader, dual adhesives and cavity in bump

Номер: US20120091493A1
Автор: Charles W.C. Lin, Chia-Chung Wang
Принадлежит: Bridge Semiconductor Corp

A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and dual adhesives. The heat spreader includes a bump, a base and a ledge. The conductive trace includes a pad and a terminal. The semiconductor device is mounted on the bump in a cavity in the bump, is electrically connected to the conductive trace and is thermally connected to the heat spreader. The bump extends into an opening in the first adhesive and is aligned with and spaced from an opening in the second adhesive. The base and the ledge extend laterally from the bump. The first adhesive is sandwiched between the base and the ledge, the second adhesive is sandwiched between the conductive trace and the ledge and the ledge is sandwiched between the adhesives. The conductive trace is located outside the cavity and provides signal routing between the pad and the terminal.

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Номер записи: 27
26-04-2012 дата публикации

Chip package and manufacturing method thereof

Номер: US20120098109A1
Автор: Dongkyun Ko, Jaesun An, Jung Lee
Принадлежит: Individual

A chip package including a shielding layer having a plurality of conductive connectors for better electromagnetic interferences shielding is provided. The conductive connectors can be flexibly arranged within the molding compound for better shielding performance. The shielding layer having the conductive connectors functions as the EMI shield and the shielding layer is electrically grounded within the package structure.

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Номер записи: 28
03-05-2012 дата публикации

Method of manufacturing multilayer wiring substrate

Номер: US20120102732A1
Автор: Shinnosuke Maeda
Принадлежит: NGK Spark Plug Co Ltd

A method of manufacturing a multilayer wiring substrate is provided. A foil of a metal-foil-clad resin insulation material is brought into contact with a foil of a metal-foil-clad support substrate. A peripheral edge portion of the resin insulation material exposed as a result of removal of a peripheral edge portion of the foil is adhered to the foil of the support substrate. A plurality of conductor layers and a plurality of resin insulation layers are laminated so as to obtain a laminate structure having a wiring laminate portion, which is to become the multilayer wiring substrate. The laminate structure is cut along a boundary between the wiring laminate portion and a surrounding portion, and the surrounding portion is removed. The wiring laminate portion is separated from the support substrate along the boundary between the two foils.

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Номер записи: 29
03-05-2012 дата публикации

Etching apparatus with suction mechanism

Номер: US20120103521A1
Автор: Chien-Pang Cheng
Принадлежит: Zhen Ding Technology Co Ltd

An etching apparatus includes a conveyor, a spraying mechanism, a suction mechanism, and a controller. The conveyor is configured for conveying a substrate. The spraying mechanism includes a submersible pump and a number of spraying nozzles. The submersible pump selectively operates at an activated state where the spraying nozzles can spray etchant onto the substrate, or an unactivated state where the spraying nozzles cannot spray etchant. The suction mechanism includes a vacuum pump and a number of suction intakes. The vacuum pump selectively operates at an activated state where the suction intakes can suck up the etchant on the substrate, or an unactivated state where the suction intakes cannot suck up the etchant. The controller controls the pumps to operate alternately, so the vacuum pump is unactivated when the submersible pump is activated and vice versa.

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Номер записи: 30
03-05-2012 дата публикации

Method for Producing an Electrical Circuit and Electrical Circuit

Номер: US20120106112A1
Автор: Ricardo Ehrenpfordt, Sonja Knies
Принадлежит: ROBERT BOSCH GMBH

A method for producing an electrical circuit includes providing a main printed circuit board having a plurality of metalized plated-through holes through the main printed circuit board along at least one separating line between adjacent printed circuit board regions of the main printed circuit board. Each printed circuit board region has electrical contact connection pads on at least the main surface of the printed circuit board region that is to be populated, electrical lines for connection between the plurality of plated-through holes and the contact connection pads, and at least one semiconductor chip electrically contact-connected by means of the contact connection pads. The main printed circuit board is covered with a potting compound across the printed circuit board regions with the semiconductor chips.

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Номер записи: 31
03-05-2012 дата публикации

Method for Producing Lamps

Номер: US20120107973A1
Автор: Klaus Müller, Stefan Grötsch
Принадлежит: OSRAM Opto Semiconductors GmbH

A method for producing luminous means proposes providing a carrier serving as a heat sink, said carrier comprising a planar chip mounting region. The planar chip mounting region is structured for the purpose of producing a first partial region and at least one second partial region. In this case, the first partial region has a solder-repellent property after structuring. Afterward, a solder is applied to the planar chip mounting region, such that said solder wets the at least one second partial region. At least one optoelectronic body is fixed into the at least one second partial region with the solder at the carrier. Finally, contact-connections are formed for the purpose of feeding electrical energy to the optoelectronic luminous body.

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Номер записи: 32
10-05-2012 дата публикации

Electronic element unit and reinforcing adhesive agent

Номер: US20120111617A1
Автор: Koji Motomura, Seiichi Yoshinaga, Tadahiko Sakai
Принадлежит: Panasonic Corp

It is an object of the present invention to provide an electronic element unit and a reinforcing adhesive agent in which a bonding strength can be improved between an electronic element and a circuit board and a repairing work can be carried out without giving a thermal damage to the electronic element or the circuit board. In an electronic element unit ( 1 ) including an electronic element ( 2 ) having a plurality of connecting terminals ( 12 ) on a lower surface thereof, a circuit board ( 3 ) having a plurality of electrodes ( 22 ) corresponding to the connecting terminals ( 12 ) on an upper surface thereof. The connecting terminals ( 12 ) and the electrodes ( 22 ) are connected by solder bumps ( 23 ), and the electronic element ( 2 ) and the circuit board ( 3 ) are partly bond by a resin bond part ( 24 ) made of a thermosetting material of a thermosetting resin, and a metal powder ( 25 ) is included in the resin bond parts ( 24 ) in a dispersed state. The metal powder ( 25 ) has a melting point lower than a temperature at which the resin bond parts ( 24 ) are heated when a work (a repairing work) is carried out for removing the electronic element ( 2 ) from the circuit board ( 3 ).

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Номер записи: 33
10-05-2012 дата публикации

Method of manufacturing circuit board

Номер: US20120111728A1
Автор: Myeong Ho Hong, Suk Hyeon Cho
Принадлежит: Samsung Electro Mechanics Co Ltd

Disclosed herein is a method of manufacturing a circuit board. The method of manufacturing a circuit board according to a preferred embodiment of the present invention is configured to include (A) forming a cavity 115 for a bump on one surface 111 of a carrier 110, (B) forming a bump 130 in the cavity 115 for the bump through an electroplating process, (C) laminating an insulating layer 140 on one surface 111 of the carrier 110 so as to apply the bump 130, (D) forming a circuit layer 150 including a via 155 connected with the bump 130 on the insulating layer 140, and (E) removing the carrier 110, whereby the process of forming separate solder balls is removed by forming the cavities 111 for the bumps in the carriers 110 to form the bumps, thereby simplifying the process of manufacturing a circuit board and reducing the lead time.

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Номер записи: 34
10-05-2012 дата публикации

Suspension board with circuit and producing method thereof

Номер: US20120113547A1
Автор: Yuu Sugimoto
Принадлежит: Nitto Denko Corp

A suspension board with circuit includes a metal supporting board; an insulating layer formed on the metal supporting board having an opening penetrating in the thickness direction formed therein; and a conductive pattern formed on the insulating layer including an external-side terminal electrically connected to an external board. The external-side terminal is filled in the opening of the insulating layer. In the metal supporting board, a support terminal electrically insulated from the surrounding metal supporting board and electrically connected to the external-side terminal is provided. The suspension board with circuit includes a metal plating layer formed below the support terminal and an electrically-conductive layer interposed between the support terminal and the metal plating layer having a thickness of 10 nm or more to 200 nm or less.

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Номер записи: 35
10-05-2012 дата публикации

Stabilized metal nanoparticles and methods for production thereof

Номер: US20120114521A1
Автор: Alfred A. Zinn
Принадлежит: Lockheed Martin Corp

Processes for synthesizing metal nanoparticles, particularly copper nanoparticles, are described. The processes can involve reacting an insoluble complex of a metal salt with a reducing agent in a reaction mixture containing a primary amine first surfactant, a secondary amine second surfactant, and a diamine chelating agent third surfactant. More specifically, processes for forming copper nanoparticles can involve forming a first solution containing a copper salt, a primary amine first surfactant, a secondary amine second surfactant, and a diamine chelating agent third surfactant; allowing an insoluble complex of the copper salt to form from the first solution; combining a second solution containing a reducing agent with the insoluble complex; and forming copper nanoparticles from the insoluble complex. Such copper nanoparticles can be about 10 nm or smaller in size, more particularly about 3 nm to about 6 nm in size, and have a fusion temperature of about 200° C. or lower.

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Номер записи: 36
10-05-2012 дата публикации

Ceramic/metal composite structure and method of manufacturing the same

Номер: US20120114966A1
Автор: Shao-Kuan Lee, Wei-Hsing Tuan
Принадлежит: National Taiwan University NTU

A ceramic/metal composite structure includes an aluminum oxide substrate, an interface bonding layer and a copper sheet. The interface bonding layer is disposed on the aluminum oxide substrate. The copper sheet is disposed on the interface bonding layer. The interface bonding layer bonds the aluminum oxide substrate to the copper sheet. Some pores are formed near or in the interface bonding layer. A porosity of the interface bonding layer is substantially smaller than or equal to 25%. A method of manufacturing the ceramic/metal composite structure is also provided.

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Номер записи: 37
10-05-2012 дата публикации

Method for integrating and erecting carbon nanotube column

Номер: US20120115367A1
Автор: Chih-Pi Cheng, Yen-Chih Chang
Принадлежит: Hon Hai Precision Industry Co Ltd

A method for integrating and erecting CNT column, comprises following steps of: 1) providing a conductive layer; 2) applying a non-conductive layer over the conductive layer; 3) forming a via on the non-conductive substrate; 4) placing an electrode above the via; 5) deploying dispersive liquid containing CNT powder into the via; 6) applying a predetermined AC electric field between the conductive substrate and the electrode for integrating and erecting the CNT powder into CNT column under electric field force.

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Номер записи: 38
17-05-2012 дата публикации

Printed circuit board and method for manufacturing the same

Номер: US20120118618A1
Автор: Byung Seung Min
Принадлежит: Samsung Electro Mechanics Co Ltd

Disclosed herein are a printed circuit board and a method for manufacturing the same. The method for manufacturing a printed circuit board includes: (a) forming at least one plate through hole penetrating through an insulating layer; (b) forming pattern grooves for implementing inner layer circuits on both surfaces of the insulating layer; and (c) filling the plate through hole and the pattern grooves with a conductive material. The method for manufacturing a printed circuit board may provide the printed circuit board having excellent heat radiating characteristics and reduce process cost.

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Номер записи: 39
17-05-2012 дата публикации

Method of Manufacturing a Circuit Carrier Layer and a Use of Said Method for Manufacturing a Circuit Carrier

Номер: US20120118753A1
Автор: Christian Sparing, Dirk Tews, Martin Thoms, Norbert Lützow
Принадлежит: Atotech Deutschland GmbH and Co KG

In order to be able to produce high density circuits on a dielectric substrate wherein the conductor lines of said circuit have a good adhesion to the dielectric substrate surface, a method is provided which comprises the following method steps: a) providing an auxiliary substrate having two sides, at least one of said sides having an electrically conductive surface; b) treating at least one of the at least one electrically conductive surface with at least one release layer forming compound, the at least one release layer forming compound being a heterocyclic compound having at least one thiol group, c) forming a patterned resist coating on at least one of said at least one electrically conductive surface which has been treated with said at least one release layer forming compound, the patterned resist coating having at least one resist opening thereby exposing the electrically conductive surface; d) forming an electrically conductive pattern in the at least one resist opening by electrodepositing a metal on the exposed electrically conductive surface; e) embedding each electrically conductive pattern into a dielectric material by forming a respective dielectric material layer on the respective side of the auxiliary substrate; and f) separating each dielectric material layer comprising the respective embedded electrically conductive pattern and the auxiliary substrate from each other.

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Номер записи: 40
17-05-2012 дата публикации

Metalized plastic articles and methods thereof

Номер: US20120121928A1
Автор: Liang Zhou, Qing Gong, Weifeng Miao, Xiong Zhang
Принадлежит: BYD Co Ltd

Metalized plastic substrates, and methods thereof are provided herein. The method includes providing a plastic substrate having a plurality of accelerators dispersed in the plastic substrate. The accelerators have a formula selected from the group consisting of: CuFe 2 O 4-δ , Ca 0.25 Cu 0.75 TiO 3-β , and TiO 2-σ , wherein δ, β, σ denotes oxygen vacancies in corresponding accelerators and 0.05≦δ≦0.8, 0.05≦β≦0.5, and 0.05≦σ≦1.0. The method further includes removing at least a portion of a surface of the plastic substrate to expose at least a first accelerator. The method further includes plating the exposed surface of the plastic substrate to form at least a first metal layer on the at least first accelerator, and then plating the first metal layer to form at least a second metal layer.

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Номер записи: 41
24-05-2012 дата публикации

Copper conductor film and manufacturing method thereof, conductive substrate and manufacturing method thereof, copper conductor wiring and manufacturing method thereof, and treatment solution

Номер: US20120125659A1
Автор: Hideo Nakako, Katsuyuki Masuda, Kazunori Yamamoto, Shunya Yokozawa, Yasushi Kumashiro, Yoshinori Ejiri, Youichi Machii
Принадлежит: Hitachi Chemical Co Ltd

Provided are a copper conductor film and manufacturing method thereof, and patterned copper conductor wiring, which have superior conductivity and wiring pattern formation, and with which there is no decrease in insulation between circuits, even at narrow wiring widths and narrow inter-wiring spacing. Disclosed are a copper conductor film and manufacturing method thereof in which a copper-based particle-containing layer, which contains both a metal having catalytic activity toward a reducing agent and copper oxide, is treated using a treatment solution that contains a reagent that ionizes or complexes copper oxide and a reducing agent that reduces copper ions or copper complex to form metallic copper in a single solution, and patterned copper conductor wiring that is obtained by patterning a copper-based particle-containing layer using printing and by said patterned particle-containing layer being treated by a treatment method using a solution that contains both a reagent that ionizes or complexes copper oxide and a reducing agent that reduces copper ions or copper complexes to form metallic copper in a single solution.

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Номер записи: 42
24-05-2012 дата публикации

Multilayered printed circuit board and manufacturing method thereof

Номер: US20120125680A1
Автор: Atsushi Shouda, Hiroshi Segawa, Honjin En, Kiyotaka Tsukada, Kouji Asano, Kouta Noda, Naohiro Hirose, Naoto Ishida
Принадлежит: Ibiden Co Ltd

An opening is formed in resin 20 by a laser beam so that a via hole is formed. At this time, copper foil 22 , the thickness of which is reduced (to 3 μm) by performing etching to lower the thermal conductivity is used as a conformal mask. Therefore, an opening 20 a can be formed in the resin 20 if the number of irradiation of pulse-shape laser beam is reduced. Therefore, occurrence of undercut of the resin 20 which forms an interlayer insulating resin layer can be prevented. Thus, the reliability of the connection of the via holes can be prevented. Thus, the reliability of the connection of the via holes can be improved.

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Номер записи: 43
31-05-2012 дата публикации

Improvements in or relating to printing

Номер: US20120132092A1
Автор: John David Adamson, Peter Andrew Reath Bennett, Richard Arthur Hutchinson, Rodney Martin Potts
Принадлежит: JP Imaging Ltd

A printing form precursor comprises a printing surface which comprises an inorganic metal compound, the printing surface being hydrophobic and capable of being made hydrophilic by energy but capable of becoming hydrophobic again, for reuse, if desired. An associated method of printing includes steps of subjecting the printing surface imagewise to energy so as to locally increase its hydrophilicity sufficient to make the surface differentiated in its acceptance of an oxophilic a printing ink; applying the ink to the printing surface and printing from the printing surface; causing or allowing the printing surface to undergo a reduction in hydrophilicity sufficient again to make the printing surface uniform in its acceptance of a printing ink; and,if wished, repeating these steps on multiple occasions. Thus the invention achieves the goal of providing a printing form precursor which does not need a chemical developer, and which can be used multiple times, to print different images.

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Номер записи: 44
31-05-2012 дата публикации

Coating apparatus and coating method

Номер: US20120135135A1
Автор: Masakuni Ikagawa, Naoaki Sakurai, Tsuyoshi Sato
Принадлежит: Toshiba Corp

In applying a coating liquid including a solute and a solvent onto a given area on a substrate so as to allow the coating liquid to be solidified on the substrate by volatizing the solvent, an atmosphere in a vicinity of a coated area of the substrate is kept under an atmosphere that reduces volatilization of the solvent until applying the coating liquid onto the given area of the substrate is finished.

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Номер записи: 45
07-06-2012 дата публикации

Method for controlling glue flow

Номер: US20120138222A1
Автор: William Halliday
Принадлежит: STMicroelectronics Research and Development Ltd

A method for controlling a contact angle between a glue and a surface of a substrate during manufacture of microchip packages is disclosed. The method includes applying a glue to a surface of a substrate, and placing an electrode in electrical connection with the glue. A potential difference is applied between the electrode and the substrate. The potential difference is applied across the glue and causes a contact angle between the glue and the surface of the substrate to be altered.

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Номер записи: 46
07-06-2012 дата публикации

Wiring board, electronic component embedded substrate, method of manufacturing wiring board, and method of manufacturing electronic component embedded substrate

Номер: US20120138346A1
Автор: Hiroyuki Uematsu, Kenichi Kawabata
Принадлежит: TDK Corp

A wiring board or an electronic component embedded substrate includes a substrate that includes a resin containing a plurality of fillers; and a via that is electrically connected to at least one interconnect provided to the substrate, wherein the via includes a mix area in which metal is provided between the fillers on an inner radial side with respect to the substrate. A method of manufacturing a wiring board or an electronic component embedded substrate includes preparing a substrate that includes a resin containing a plurality of fillers; forming a via formation hole in the substrate; performing an ashing process on at least an inner wall of the via formation hole; and performing electroless plating an the inner wall of the via formation hole.

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Номер записи: 47
14-06-2012 дата публикации

Multilayer printed wiring boards with holes requiring copper wrap plate

Номер: US20120144667A1
Автор: Rajwant Singh Sidhu
Принадлежит: DDI Global Corp

Printed circuit boards have circuit layers with one or more via filled holes with copper wraps and methods of manufacturing the same. An embodiment of the present invention provides a method to enhance the consistency of the wraparound plating of through-hole vias of printed circuit boards with (requiring) via filling to provide extra reliability to the printed circuit boards and enables the designers and/or manufacturers of printed circuit boards to design and manufacture boards with relatively fine features and/or tight geometries.

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Номер записи: 48
14-06-2012 дата публикации

Circuit board with double-sided universal circuit layout and layout method thereof

Номер: US20120145443A1
Автор: Ching-Feng Hsieh, Kuo-Chan Peng
Принадлежит: Askey Computer Corp

A circuit board with double-sided universal circuit layout for laying out electronic components has a first side with a first circuit layout thereon and an opposing second side with a second circuit layout thereon; hence, the first circuit layout and the second circuit layout are disposed on the opposing sides of the circuit board, respectively. The first circuit layout and the second circuit layout feature electronic circuits having the same function, thereby allowing users to selectively install the electronic components at one of the first circuit layout and the second circuit layout as needed and still have access to the electronic circuits having the same function. A layout method for use with the circuit board with double-sided universal circuit layout is further introduced.

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Номер записи: 49
14-06-2012 дата публикации

Method of manufacturing printed circuit board

Номер: US20120148960A1
Автор: Chang Sup Ryu, Eung Suek Lee, Je Gwang Yoo, Jee Soo Mok
Принадлежит: Samsung Electro Mechanics Co Ltd

A method of manufacturing a printed circuit board, including: applying a conductive paste including carbon nanotubes and a photosensitive binder on a bump-forming area of a circuit substrate having a circuit layer for transferring electrical signals; and patterning the conductive paste, thus forming bumps.

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Номер записи: 50
21-06-2012 дата публикации

Reduced pth pad for enabling core routing and substrate layer count reduction

Номер: US20120153495A1
Автор: Debendra Mallik, Mihir K. Roy
Принадлежит: Intel Corp

Embodiments are directed to semiconductor packaging having reduced sized plated through hole (PTH) pads by eliminating the margin of the pad-to-PTH alignment and enabling finer traces on the core of the substrate.

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Номер записи: 51
21-06-2012 дата публикации

Flexible circuit board and manufacturing method thereof

Номер: US20120155038A1
Автор: Masaki Fujiwara, Steven Roy Droes, Yasumori Fukushima
Принадлежит: Sharp Corp

The present invention provides a high-performance flexible circuit board having excellent flexibility, a fine wiring pattern, and fine electric contacts, and a manufacturing method thereof. In a flexible circuit board ( 20 ), a second insulating layer ( 24 ) made of an inorganic material is positioned between a wiring layer ( 25 ) and a first insulating layer ( 23 ) made of an inorganic material.

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Номер записи: 52
28-06-2012 дата публикации

Optical alignment module utilizing transparent reticle to facilitate tool calibration during high temperature process

Номер: US20120159782A1
Автор: Andrew D. Perez, Fuad E. Doany, Lavanya Turlapati, Niranjana Ruiz
Принадлежит: International Business Machines Corp

An apparatus and method for aligning one or more components while attaching the component to a substrate. The component is positioned over the substrate. An alignment tool is attachable to the component. The alignment tool includes a tool alignment element, an optical tool, and a substrate alignment element attached to the substrate. The tool alignment element aligns with the substrate alignment element such that the components are positioned at specified locations on the substrate for attachment to the substrate. Further, in the method according to the disclosure, the tool alignment element aligns with the substrate alignment element to position one or more components at a specified location on the substrate.

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Номер записи: 53
28-06-2012 дата публикации

Circuit device and method of manufacturing the same

Номер: US20120160545A1
Автор: Hideyuki Sakamoto
Принадлежит: Semiconductor Components Industries LLC

Provided is a circuit device in which encapsulating resin to encapsulate a circuit board is optimized in shape, and a method of manufacturing the circuit device. A hybrid integrated circuit device, which is a circuit device according to the present invention includes a circuit board, a circuit element mounted on a top surface of the circuit board, and encapsulating resin encapsulating the circuit element, and coating the top surface, side surfaces, and a bottom surface of the circuit board. In addition, the encapsulating resin is partly recessed and thereby provided with recessed areas at two sides of the circuit board. The providing of the recessed areas reduces the amount of resin to be used, and prevents the hybrid integrated circuit device from being deformed by the cure shrinkage of the encapsulating resin.

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Номер записи: 54
28-06-2012 дата публикации

Coreless layer buildup structure

Номер: US20120160547A1
Автор: Frank D. Egitto, Rabindra N. Das, Timothy Antesberger, Voya R. Markovich, William E. Wilson
Принадлежит: Endicott Interconnect Technologies Inc

A substrate for use in a PCB or PWB board having a coreless buildup layer and at least one metal and at least one dielectric layer. The coreless buildup dielectric layers can consist of at least partially cured thermoset resin and thermoplastic resin.

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Номер записи: 55
05-07-2012 дата публикации

Method for producing flexible metal laminate

Номер: US20120168053A1
Автор: Hiroto Shimokawa, Masami Sasaki, Takuro Kochiyama, Yoshitaka Mineki
Принадлежит: UBE Industries Ltd, Ube Nitto Kasei Co Ltd

A method for producing a flexible metal laminate includes continuously thermocompression-bonding laminate metal foils to a resin film. The thermocompression-bonding step is conducted by placing a protection metal foil between a pressure surface of a heat and pressure forming apparatus and the laminate metal foils. When the protection metal foil is subjected to an abrasion resistance test, in which the protection metal foil is placed such that a matte surface of the protection metal foil contacts a plate material having a surface equivalent to the pressure surface and in which the matte surface is rubbed against the surface of the plate material by applying a load to a shiny surface of the protection metal foil and pulling the protection metal foil, a streak is found on the matte surface only in a case where the load is over 500 g per area of 76 mm×26 mm.

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Номер записи: 56
05-07-2012 дата публикации

Adhesion promotion of metal to laminate with multi-functional molecular system

Номер: US20120168075A1
Автор: Abayomi I. Owei, Eric Walch, Hanna Rasmussen, Jean Rasmussen, Joseph A. Abys, Shenliang Sun, Theodore Antonellis
Принадлежит: Enthone Inc

An adhesion promotion composition and method for enhancing adhesion between a copper conducting layer and a dielectric material during manufacture of a printed circuit board. The adhesion promotion composition comprises a multi-functional compound comprising a first functional group and a second functional group, wherein the first functional group is an aromatic heterocyclic compound comprising nitrogen and the second functional group is selected from the group consisting of vinyl ether, amide, thiamide, amine, carboxylic acid, ester, alcohol, silane, alkoxy silane, and combinations thereof.

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Номер записи: 57
12-07-2012 дата публикации

System for manufacturing laminated circuit boards

Номер: US20120174387A1
Автор: Anthony Faraci, Gary N. Sortino
Принадлежит: Duetto Integrated Systems Inc

The present invention relates to a pin-less registration and inductive heating system involving the use of a pre-alignment station for imaging an initial position of a laminate element, an imaging and computer operation control system for determining a required correction factor between an alignment of the laminate element at the pre-alignment station and a preferred stack orientation for the laminate element, and an alignment and transfer system for securely gripping, transferring, and repositioning a laminate element from a top position to the preferred stack orientation employing a preferred four-axis orientation.

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Номер записи: 58
12-07-2012 дата публикации

Wiring board and method of producing the same

Номер: US20120175157A1
Автор: Kentaro Kaneko
Принадлежит: Shinko Electric Industries Co Ltd

A wiring board includes: wiring layers; insulating layers disposed between the wiring layers; and external connection pads respectively including surface plated layers, for connecting to an external circuit. In each of the external connection pads in one face of the wiring board, an outer peripheral edge of the external connection pad is retracted from an outer peripheral edge of the surface plated layer toward a center of the external connection pad.

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Номер записи: 59
12-07-2012 дата публикации

Printed circuit board

Номер: US20120175162A1
Автор: Jee Soo Mok, Jun Heyoung Park
Принадлежит: Samsung Electro Mechanics Co Ltd

A printed circuit board having an insulating layer; circuit patterns formed on both surfaces of the insulating layer in order to be embedded in the insulating layer; and a bump formed to pass through the insulating layer in order to electrically connect the circuit patterns formed on both surfaces of the insulating layer.

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Номер записи: 60
12-07-2012 дата публикации

Led light disposed on a flexible substrate and connected with a printed 3d conductor

Номер: US20120175667A1
Автор: Aaron J. Golle, John Golle, Walter J. Paciorek
Принадлежит: Heilux LLC

An example includes subject matter (such as an apparatus) comprising a planar substrate including a first surface that is planar, at least one bare light emitting diode (“LED”) die coupled to the substrate and conductive ink electrically coupling the at least one bare LED die, wherein the conductive ink is disposed on the substrate and extends onto a surface of the LED that is out-of-plane from the first surface.

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Номер записи: 61
19-07-2012 дата публикации

Electronic device having liquid crystal polymer solder mask and outer sealing layers, and associated methods

Номер: US20120181073A1
Автор: Casey Philip Rodriguez, Louis Joseph Rendek, Jr., Steven R. Snyder
Принадлежит: HARRIS CORP

An electronic device includes a substrate with a circuit layer thereon that has a solder pad. There is a liquid crystal polymer (LCP) solder mask on the substrate that has an aperture aligned with the solder pad. There is a fused seam between the substrate and the LCP solder mask. Solder is in the aperture, and a circuit component is electrically coupled to the solder pad via the solder. A first dielectric layer stack having a first plurality of dielectric layers is on the LCP solder mask and has an aperture aligned with the solder pad. There is a first LCP outer sealing layer on the first dielectric layer stack, and a second dielectric layer stack having a second plurality of dielectric layers on the substrate on a side thereof opposite the LCP solder mask. Further, there is a second LCP outer sealing layer on the second dielectric layer stack.

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Номер записи: 62
19-07-2012 дата публикации

Double-sided circuit board and manufacturing method thereof

Номер: US20120181076A1
Автор: Kota Noda, Satoru Kawai, Tsutomu Yamauchi
Принадлежит: Ibiden Co Ltd

A double-sided circuit board including a substrate having a first surface and a second surface on an opposite side of the first surface and having a penetrating hole extending between the first surface and the second surface, a first conductive circuit formed on the first surface of the substrate, a second conductive circuit formed on the second surface of the substrate, and a through-hole conductor formed in the penetrating hole of the substrate and electrically connecting the first conductive circuit and the second conductive circuit. The penetrating hole comprises a first hole having a first opening with a diameter R 1 on the first surface of the substrate, a second hole having a second opening with a diameter R 2 on the second surface of the substrate, and a third hole connecting the first hole and the second hole and having a diameter smaller than at least one of R 1 and R 2.

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Номер записи: 63
19-07-2012 дата публикации

Packaging substrate with conductive structure

Номер: US20120181688A1
Автор: Shih-Ping Hsu
Принадлежит: Individual

A packaging substrate with conductive structure is provided, including a substrate body having at least one conductive pad on a surface thereof, a stress buffer metal layer disposed on the conductive pad and a thickness of the stress buffer metal layer being 1-20 μm, a solder resist layer disposed on the substrate body and having at least one opening therein for correspondingly exposing a portion of top surface of the stress buffer metal layer, a metal post disposed on a central portion of the surface of the stress buffer metal layer, and a solder bump covering the surfaces of the metal post. Therefore, a highly reliable conductive structure is provided, by using the stress buffer metal layer to release thermal stresses, and using the metal post and the solder bump to increase the height of the conductive structure.

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Номер записи: 64
26-07-2012 дата публикации

Flexible circuit board

Номер: US20120186858A1
Автор: Hiroharu UEHARA, Hiroki Shirato, Katsuhide NAKAI
Принадлежит: Canon Components Inc

A flexible circuit board includes a base film which is composed of an aluminum sheet and first protective films formed on the respective surfaces of the aluminum sheet and has a sprocket hole and a device hole, a predetermined conductor pattern which is formed on a surface of the base film, and a second protective film which is composed of aluminum and an electrically insulative film formed on a surface of the aluminum and is formed so as to cover the predetermined conductor pattern.

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Номер записи: 65
26-07-2012 дата публикации

Printed wiring board

Номер: US20120188672A1
Автор: Hiroshi MORIDERA, Keita Takanashi
Принадлежит: Sanyo Electric Co Ltd, Sanyo Optec Design Co Ltd

A printed wiring board includes: a first-electrostatic-discharge-protecting pattern having a first anode pattern electrically connect to an anode of a laser diode and a first cathode pattern arranged to oppose the first anode pattern and electrically connect to a cathode of the laser diode; and a second-electrostatic-discharge-protecting pattern having a second anode pattern electrically connect to the anode of the laser diode and a second cathode pattern arranged to oppose the second anode pattern and electrically connect to the cathode of the laser diode, wherein the first-electrostatic-discharge-protecting pattern has a first soldering area at which solder is melted by a soldering iron such that the first anode and cathode patterns are short-circuited or short-circuit-released, and the second-electrostatic-discharge-protecting pattern has a second soldering area at which the solder is melted by a reflow such that the second anode and cathode patterns are short-circuited or short-circuit-released.

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Номер записи: 66
26-07-2012 дата публикации

Printed circuit board and method for manufacturing the same, and fuel cell

Номер: US20120189874A1
Автор: Hirofumi Ebe, Shinichi Inoue
Принадлежит: Nitto Denko Corp

A conductor layer having a predetermined pattern is formed on a base insulating layer so that its second main surface opposes the base insulating layer. A barrier layer having higher corrosion resistance to acids than that of the conductor layer is formed on its first main surface and a side surface of the conductor layer while the first main surface and the side surface of the conductor layer and the barrier layer are covered with a conductive cover layer.

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Номер записи: 67
02-08-2012 дата публикации

Method for connecting two objects electrically

Номер: US20120192415A1
Автор: Hiroto Sugahara
Принадлежит: Brother Industries Ltd

A groove, and a recess which communicates with the groove, are formed in a substrate. Next, a through hole which communicates with the groove is formed. Thereafter, a wire is formed on an upper surface of the substrate, and an individual electrode is arranged on a lower surface of the substrate. Further, a droplet of an electroconductive liquid is made to land on the recess, and the liquid is filled in the through hole via the groove. Next, the liquid filled in the groove, the recess, and the through hole is heated to harden. Further, the recess and the groove of the substrate are removed by cutting up to an area near the through hole. Accordingly, it is possible to connect electrically the connecting bodies arranged on both surfaces of the substrate by filling an electroconductive material in the through holes easily.

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Номер записи: 68
02-08-2012 дата публикации

Terminal assembly with regions of differing solderability

Номер: US20120196493A1
Автор: James V. Murphy, Michael J. Murphy
Принадлежит: Advanced Interconnections Corp

An intercoupling component is provided which permits reliable, non-permanent electrical connection between a first substrate and a second substrate. The intercoupling component includes a socket terminal having a first end, and a second end opposed to the first end. An axial hole extends inward from the second end, and an electrically conductive core member is disposed within the axial hole. The core member is formed of a different material than the socket terminal body, and is sized and shaped to obstruct the hole. In addition, the first end of the socket terminal is configured to receive a pin terminal, and the second end of the socket terminal is configured to be received within a hole in a printed circuit board.

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Номер записи: 69
09-08-2012 дата публикации

Method for making an opening in a substrate

Номер: US20120198977A1
Автор: Christian Kohlmeier, Florian Roick, Stefan Boenigk
Принадлежит: LPKF Laser and Electronics AG

A method for making an opening in a substrate includes creating a cutting path in the substrate for cutting out a polygonal area along predetermined side paths which enclose the opening and are connected to each other via respective corner points. The cutting path is started in an internal region of the polygonal area at a distance from the side paths. The cutting path is continued in a recess in the internal region to a start point on a first one of the side paths, the start point being disposed along the first one of the side paths at a substantial distance from each of the respective corner points so as to divide the first one of the side paths into a long side path portion and a short side path portion. The cutting path is continued, from the start point, along each of the side paths.

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Номер записи: 70
09-08-2012 дата публикации

Substrate cutting apparatus and method of cutting substrate using the same

Номер: US20120198981A1
Автор: Masaaki Sofue, Young-Kyung Kim
Принадлежит: SAMSUNG ELECTRONICS CO LTD

A substrate cutting apparatus and a method of cutting a substrate using the same. The substrate cutting apparatus includes: a stand that supports a substrate; a support that is movable up and down, presses the substrate toward the stand, and has a groove forming unit that form grooves corresponding to positions where the substrate is to be cut at an interval; and a cutting unit that is formed in the support to be movable up and down and cuts the substrate using the grooves formed by the groove forming unit. According to the substrate cutting apparatus, V-shaped grooves are formed in advance of cutting a substrate into unit substrates at portions to be cut. Thus, breaking of the substrate may be prevented during the cutting.

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Номер записи: 71
09-08-2012 дата публикации

System and method for protecting a computing device using vsd material, and method for designing same

Номер: US20120200963A1
Автор: Daniel Vasquez, Lex Kosowsky
Принадлежит: Shocking Technologies Inc

Embodiments described herein provide for programmatic design or simulation of substrates carrying electrical elements to integrate voltage switchable dielectric (“VSD”) material as a protective feature. In particular, VSD material may be incorporated into the design of a substrate device for purpose of providing protection against transient electrical conditions, such as electrostatic discharge (ESD).

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Номер записи: 72
16-08-2012 дата публикации

Method for manufacturing wiring board

Номер: US20120204424A1
Автор: Izumi Tanaka, Yuji Yukiiri
Принадлежит: Shinko Electric Industries Co Ltd

There is prepared an insulation layer generation member having a support film and a semi-cured insulation layer provided on a surface of the support film. Subsequently, the insulation layer generation member is affixed to a pad such that the pad contacts the semi-cured insulation layer. The semi-cured insulation layer is cured, to thus generate an insulation layer. Subsequently, the insulation layer is exposed to laser by way of the support film, thereby opening an opening in the insulation layer.

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Номер записи: 73
16-08-2012 дата публикации

Circular interposers

Номер: US20120206892A1
Автор: Chris Ligtenberg, Erik James Shahoian
Принадлежит: Apple Inc

Non-rectangular interposers for space efficient, reliable to manufacture, high speed interconnections between two printed circuit boards, such as a motherboard and a mating board. One example provides space efficiency with a non-rectangular interposer, where the interposer may be at least approximately circular. Reliable manufacturing may be provided by the inclusion of one or more openings to accept one or more alignment features. In one example, a first opening is provided to accept a threaded boss, which may be used to fasten the two printed circuit boards and interposer together. In another example, a second opening may be provided to accept an alignment pin, wherein the pin aligns the interposer to the two printed circuit boards. Contacts may be provided on each side to mate with contacts on each of the two printed circuit boards.

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Номер записи: 74
16-08-2012 дата публикации

Memory module and video camera

Номер: US20120210049A1
Автор: Isao Ozawa, Yasuyuki NAGAHARA
Принадлежит: Toshiba Corp

According to the embodiments, there are provided semiconductor memories that are mounted individually on two sides of a mounting board; a controller that is mounted either on an obverse side or a reverse side of the mounting board, and performs read and write control of the semiconductor memories; and a connector that is deviated in a lateral direction from the controller so as not to overlap the controller, is mounted either on the obverse side or the reverse side of the mounting board, and transfers a signal exchanged between the controller and outside.

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Номер записи: 75
23-08-2012 дата публикации

Wired circuit board and producing method thereof

Номер: US20120211263A1
Автор: Masaki Mizutani
Принадлежит: Nitto Denko Corp

A wired circuit board includes an insulating layer formed with an insulating opening extending through the insulating layer in a thickness direction, and a conductive pattern including a wire formed on the insulating layer and a terminal connected to the wire. The terminal includes a filling portion with which the insulating opening of the insulating layer is internally filled, a first projecting portion formed to continue to the filling portion and project from the filling portion on one side in the thickness direction, and a second projecting portion formed to continue to the filling portion and project from the filling portion on the other side in the thickness direction.

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Номер записи: 76
23-08-2012 дата публикации

Device mounting board and method of manufacturing the same, semiconductor module, and mobile device

Номер: US20120211269A1
Автор: Kouichi Saitou, Toshiya Shimizu
Принадлежит: Sanyo Electric Co Ltd

A device mounting board includes: an insulating resin layer; a wiring layer formed on one of the principal surfaces of the insulating resin layer; a protection layer covering the insulating resin layer and the wiring layer; a protruding electrode electrically connected to the wiring layer, the protruding electrode protruding from the wiring layer toward the insulating resin layer and penetrating through the insulating resin layer; a wiring-layer-side convex portion protruding from the wiring layer toward the insulating resin layer and having the top end thereof located inside the insulating resin layer; and a resin-layer-side convex portion protruding from the protection layer toward the insulating resin layer and having the top end thereof located inside the insulating resin layer.

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Номер записи: 77
30-08-2012 дата публикации

Nanomaterial-based films patterned using a soluble coating

Номер: US20120219702A1
Автор: Graeme Scott, Lorraine Byrne, Richard COULL, Vittorio Scardaci
Принадлежит: Hewlett Packard Development Co LP

A film can be patterned with a nanomaterial. Such patterning can, in various embodiments, be performed by applying a uniform mixture of a solute in a solvent to a surface of the film to form a coating of a soluble material on the surface of the film in a pre-defined pattern that defines coated parts of the film and uncoated parts of the film, depositing an aqueous dispersion, including the nanomaterial and a surfactant, on the defined coated and uncoated parts of the film, washing the film to remove the coating of the soluble material and the nanomaterial from the defined coated parts of the film, but not removing the nanomaterial from the defined uncoated parts of the film, along with removing the surfactant from the defined coated and uncoated parts of the film, and leaving a pattern of the nanomaterial on the defined uncoated parts of the film.

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Номер записи: 78
06-09-2012 дата публикации

Conductive substrate and process for producing same

Номер: US20120222890A1
Автор: Manabu Yoshida, Toshihide Kamata
Принадлежит: National Institute of Advanced Industrial Science and Technology AIST

Provided are a conductive substrate which can be produced from inexpensive materials at a lower temperature than those for conventional substrates, and a process for producing the conductive substrate. The conductive substrate comprises a substrate ( 1 ) and a conductive pattern ( 5 ) provided on the substrate ( 1 ), wherein the conductive pattern ( 5 ), except on a surface and in a vicinity thereof on a side opposite to the substrate side, entirely has a structure comprising a binder ( 2 ) and fine aluminum grains ( 3 ) dispersed therein, and on the surface and in the vicinity a surface metal aluminum layer ( 4 ) is formed in which the fine aluminum grains ( 3 ) are spread with a roller to form a conductive junction connecting the fine aluminum grains to each other.

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Номер записи: 79
20-09-2012 дата публикации

Circuit Board, Image Forming Apparatus, And Method Of Managing Reuse Information Of Circuit Board

Номер: US20120235703A1
Автор: Noriaki Orikasa, Shugo Okamura, Takashi Nishizawa, Yuichiro Ueda
Принадлежит: Ricoh Co Ltd

A circuit board includes a main part on which a processor is mounted, a cut part to be cut off from the main part at a cut section before the board is reused, and a conductor pattern wired through the cut part via the cut section and to be cut off into a plurality of patterns at the cut section as the cut part is cut off. The processor detects a difference in signal level between a level of a signal output from the conductor pattern before the cut part is cut off, and a level of the signal output from the conductor pattern after the cut part is cut off, to determine a number of times the board is reused.

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Номер записи: 80
27-09-2012 дата публикации

system and a method for solder mask inspection

Номер: US20120244273A1
Автор: Albert Yafe, Avi Levy, Michael Lev, Roni Flieswasser
Принадлежит: CAMTEK LTD

A system and a method for method for printing a solder mask on a printed circuit board (PCB), the method includes: acquiring images of multiple areas of a PCB by an inspection unit while the PCB is supported by a mechanical stage; determining spatial differences between a model of the PCB and the PCB based on the images; determining solder mask ink deposition locations based on (i) the spatial differences, and (ii) locations of the model of the PCB that should be coated with the solder mask ink; and printing solder mask ink on the solder mask deposition locations by a printing unit, while the PCB is supported by the mechanical stage.

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Номер записи: 81
11-10-2012 дата публикации

Fabrication method of substrate

Номер: US20120258573A1
Автор: Jing-Yi Yan, Shu-Tang Yeh
Принадлежит: Industrial Technology Research Institute ITRI

A fabricating method of a substrate board is provided. The substrate board includes a substrate having rigid areas and flexible areas, and at least an electronic component disposed on the substrate, wherein each of the rigid areas is thicker than the flexible areas. A patterned high-extensive material may be additionally disposed on the substrate to improve reliability thereof. The rigid areas and the flexible areas may be formed by molds or cutters. By using an above structure, the electronic component is less affected when the substrate is under stress, so that good characteristics are maintained.

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Номер записи: 82
18-10-2012 дата публикации

Heat radiating printed circuit board and chassis assembly having the same

Номер: US20120262945A1
Автор: Eunjin Kim, Haehyung Lee, Hyuksoo Lee, Hyungyu Park, Inhee Cho, Jaeman Park, Jungho Lee
Принадлежит: LG Innotek Co Ltd

The present invention relates to a heat radiating printed circuit board (PCB) and a chassis assembly having the same, the heat-radiating PCB characterized by: a circuit pattern unit; and one or more mounting units bent from the circuit pattern unit to be fixed at a chassis providing a lightguide path of a backlight unit, where the circuit pattern unit includes a driving unit divided into a plurality of driving regions and at least one or more electrodes for supplying a power to the driving unit, and where, the mounting unit is arranged with an electrode line for connecting the driving unit and electrodes other than the electrode arranged on the circuit pattern unit, such that dimming and scanning functions can be performed whereby illumination can be finely controlled, the width of the circuit pattern unit can be narrowed and damage to the PCB caused by heat can be prevented.

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Номер записи: 83
01-11-2012 дата публикации

Spherical solder reflow method

Номер: US20120273155A1
Автор: Jae-Woong Nah, Peter A. Gruber
Принадлежит: International Business Machines Corp

The present disclosure relates to methods of making solder balls having a uniform size. More particularly, the disclosure relates to improved solder ball formation processes that prevent or reduce bridging/merging of two or more solder balls during reflow. The processes of the instant disclosure are desirable because they do not require a sifting step to obtain uniformly-sized solder balls.

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Номер записи: 84
01-11-2012 дата публикации

Method for producing a printed circuit board consisting of at least two printed circuit board regions, and printed circuit board

Номер: US20120275124A1
Автор: Dietmar Drofenik, Johannes Stahr, Liubomir Mareljic, Rainer Pludra, Siegfried Gotzinger
Принадлежит: Individual

In a method for producing a printed circuit board consisting of at least two printed circuit regions, wherein the printed circuit board regions each comprise at least one conductive layer and/or at least one device or one conductive component, wherein printed circuit board regions ( 20, 21, 22 ) to be connected to one another, in the region of in each case at least one lateral surface directly adjoining one another, are connected to one another by a coupling or connection, and wherein, after a coupling or connection of printed circuit board regions ( 20, 21, 22 ) to be connected to one another, at least one additional layer or ply of the printed circuit board is arranged or applied over the printed circuit board regions ( 20, 21, 22 ) to be connected to one another, it is provided that the additional layer is embodied as a conductive layer ( 26 ), which is contact-connected via plated-through holes ( 23 ) to conductive layers or devices or components integrated in the printed circuit board regions ( 20, 21, 22 ) to be connected to one another, as a result of which a simple and reliable connection or coupling of printed circuit board regions ( 20, 21, 22 ) to be connected to one another can be made available. Furthermore, a printed circuit board consisting of a plurality of printed circuit board regions ( 20, 21, 22 ) is made available.

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Номер записи: 85
08-11-2012 дата публикации

Manufacturing method of circuit substrate

Номер: US20120279630A1
Автор: Chih-Hong Chuang, Tzu-Wei Huang
Принадлежит: Subtron Technology Co Ltd

A manufacturing method of a circuit substrate includes the following steps. The peripheries of two metal layers are bonded to form a sealed area. At least a through hole passing through the sealed area is formed. Two insulating layers are formed on the two metal layers. Two conductive layers are formed on the two insulating layers. The two insulating layers and the two conductive layers are laminated to the two metal layers bonded to each other, wherein the metal layers are embedded between the two insulating layers, and the two insulating layers fill into the through hole. The sealed area of the two metal layers is separated to form two separated circuit substrates. Therefore, the thinner substrate can be operated in the following steps, such as patterning process or plating process. In addition, the method may be extended to manufacture the circuit substrate with odd-numbered layer or even-numbered layer.

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Номер записи: 86
08-11-2012 дата публикации

Method for producing metallic foil laminate body

Номер: US20120279652A1
Автор: Hironobu Iyama, Satoshi Okamoto, Shohei Azami
Принадлежит: Sumitomo Chemical Co Ltd

Improved moisture absorption solder heat resistance is obtained in producing a metallic foil laminate body having a metal foil attached on both sides of a laminated base material including a plurality of insulating base materials. A laminated base material ( 2 ) is first prepared by pressurizing and integrating a plurality of insulating base materials ( 2 a ) in a prepressing step. Then, the laminated base material ( 2 ) is heat-treated. Thereafter, this laminated base material ( 2 ) is sandwiched between a pair of metal foils ( 3 A) and ( 3 B), and heated and pressurized to be integrated into a metallic foil laminate body. The prepressing step makes it possible to prevent an interface between the insulating base materials ( 2 a ) from being generated. As a result, swelling is not generated on the surfaces of the insulating base materials ( 2 a ).

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Номер записи: 87
08-11-2012 дата публикации

Heating apparatus and implemented body manufacturing method

Номер: US20120279653A1
Автор: Takashi Matsumura
Принадлежит: Sony Chemical and Information Device Corp

To improve the tact time of a heating apparatus, provided is a heating apparatus comprising a first pressing member that heats a heating target; a second pressing member that includes an elastic body, and sandwiches the heating target between the first pressing member and the elastic body; and a floating jig that thermally separates the first pressing member from the heating target, holds the heating target between the first pressing member and the second pressing member, and when one of the first pressing member and the second pressing member presses the heating target toward the other of the first pressing member and the second pressing member, thermally connects the heating target and the first pressing member.

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Номер записи: 88
08-11-2012 дата публикации

Printed wiring board and method for manufacturing the same

Номер: US20120279770A1
Автор: Hiroyasu Nagata
Принадлежит: Ibiden Co Ltd

A method for manufacturing printed wiring board including preparing an electronic component having first and second surfaces and electrode on the first surface, forming in an adhesive tape a mark, mounting based on the mark the component on the tape such that the second surface faces the adhesive of the tape, forming another mark on insulative substrate having first and second surfaces, forming in the substrate an opening larger than the component, mounting based on the marks the substrate on the tape such that the component is in the opening of the substrate, fixing the component to the substrate using resin, forming an insulation layer on the first surface of the substrate where the component is accommodated, removing the tape, forming in the layer an opening reaching the electrode, forming a conductive circuit on the layer, and forming in the opening of the layer a via connected to the electrode.

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Номер записи: 89
08-11-2012 дата публикации

Circuit board viaholes and method of manufacturing the same

Номер: US20120279775A1
Автор: Chang-han Shim, Se-chuel Park, Sung-Il Kang
Принадлежит: Samsung Techwin Co Ltd

Provided are a circuit board with a viahole and a method of manufacturing the same. The circuit board includes: a substrate formed of an insulating material; a conductive layer disposed on the substrate; a plated layer comprising nickel and disposed on the conductive layer; and a viahole passing through the substrate, the conductive layer, and the plated layer, wherein a crystal growth direction of nickel in the plated layer is parallel to a thickness-wise direction of the substrate.

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Номер записи: 90
08-11-2012 дата публикации

Circuit module and manufacturing method for the same

Номер: US20120281370A1
Автор: Fumikiyo KAWAHARA, Hiroshi Nishikawa, Makoto Fujita
Принадлежит: Murata Manufacturing Co Ltd

A circuit module and a manufacturing method for the same, reduce a possibility that a defect area where an electrically conductive resin is not coated may occur in a shield layer. A mother board is prepared. A plurality of electronic components are mounted on a principal surface of the mother board. An insulator layer is arranged so as to cover the principal surface of the mother board and the electronic components. The insulator layer is cut such that grooves and projections are formed in and on the principal surface of the insulator layer and the insulator layer has a predetermined thickness H. An electrically conductive resin is coated on the principal surface of the insulator layer to form a shield layer. The mother board including the insulator layer and the shield layer both formed thereon is divided to obtain a plurality of circuit modules.

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Номер записи: 91
15-11-2012 дата публикации

Electronic device and manufacturing thereof

Номер: US20120286293A1
Автор: Josef Hoeglauer, Ralf Otremba
Принадлежит: INFINEON TECHNOLOGIES AG

An electronic device and manufacturing thereof. One embodiment provides a carrier and multiple contact elements. The carrier defines a first plane. A power semiconductor chip is attached to the carrier. A body is formed of an electrically insulating material covering the power semiconductor chip. The body defines a second plane parallel to the first plane and side faces extends from the first plane to the second plane. At least one of the multiple contact elements has a cross section in a direction orthogonal to the first plane that is longer than 60% of the distance between the first plane and the second plane.

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Номер записи: 92
15-11-2012 дата публикации

Semiconductor substrate, electrode forming method, and solar cell fabricating method

Номер: US20120289044A1
Автор: Hiroyuki Ohtsuka, Naoki Ishikawa, Satoyuki Ojima, Shigenori Saisu, Takenori Watabe, Toyohiro Ueguri
Принадлежит: Shin Etsu Chemical Co Ltd, Shin Etsu Handotai Co Ltd

A semiconductor substrate having an electrode formed thereon, the electrode including at least silver and glass frit, the electrode including: a multi-layered structure with a first electrode layer joined directly to the semiconductor substrate, and an upper electrode layer formed of at least one layer and disposed on the first electrode layer. The upper electrode layer is formed by firing a conductive paste having a total silver content of 75 wt % or more and 95 wt % or less, the content of silver particles having an average particle diameter of 4 μm or greater and 8 μm or smaller with respect to the total silver content in the upper electrode layer being higher than that in the first electrode layer.

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Номер записи: 93
06-12-2012 дата публикации

Flexible printed wiring board having connector connecting portion

Номер: US20120305294A1
Автор: Akira Takaura
Принадлежит: Canon Inc

A flexible printed wiring board capable of preventing plated leads from peeling off due to repeated insertion and extraction of a connector connecting portion into and from a connector without bringing about an increase in the whole length of the flexible printed wiring board even when the flexible printed wiring board is a one-sided or double-sided one. First plated leads are provided in a manner extending from conductor patterns located outermost in a width direction of the connector connecting portion among a plurality of conductor patterns and reaching sides of the flexible printed wiring board in a width direction. Second plated leads are provided in a manner extending from leading ends of the other conductor patterns among the plurality of conductor patterns in a direction in which the connector connecting portion is inserted into the connector and reaching a leading end face of the flexible printed wiring board.

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Номер записи: 94
06-12-2012 дата публикации

Component-embedded substrate

Номер: US20120307466A1
Автор: Isamu Fujimoto, Masanori Fujidai
Принадлежит: Murata Manufacturing Co Ltd

In a component-embedded substrate, a component and wiring block units are embedded in a component-embedded layer; conductive layers are located on all surfaces of the wiring block units; the component and the wiring block units are arranged such that lower surface side conductive layers of the wiring block units and electrodes of the component contact lower surface side wiring layers; via-hole conductors are located in respective upper positions relative to upper surface side conductive layers of the wiring block units and the electrodes of the component; and upper surface side wiring layers of the component-embedded layer are thus electrically connected to upper surface side conductive layers of the wiring block units, and the electrodes of the component by the via-hole conductors.

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Номер записи: 95
06-12-2012 дата публикации

Wet lamination of photopolymerizable dry films onto substrates and compositions relating thereto

Номер: US20120308929A1
Автор: Pedro Goncalo Carvalhais Teixeira Dias Jorge, Shinji Yu
Принадлежит: EI Du Pont de Nemours and Co

The invention is directed to a lamination fluid useful in processes for wet laminating a photopolymerizable film onto circuit board panels or other substrates. The lamination system comprises 1) a dry film photoresist, 2) a laminate comprising i) copper ii) stainless steel iii) non metal on a surface, 3) a lamination fluid and 4) fluid application device on the laminates. The lamination fluid comprises water and a surface energy modification agent. The surface energy modification agent is present in a range between 0.0001 and 3.0 moles/liter, and the pH of the fluid is between 3 and 11.

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Номер записи: 96
13-12-2012 дата публикации

Method for manufacturing a printed circuit board

Номер: US20120312775A1
Автор: Duck-Young Maeng, Je-Sik Yeon, Se-Won Park
Принадлежит: Samsung Electro Mechanics Co Ltd

A printed circuit board and a method for manufacturing the printed circuit board are disclosed. The method for manufacturing a printed circuit board can include forming a circuit pattern over a seed layer that is formed over an insulation layer, pressing the circuit pattern such that the circuit pattern and the seed layer corresponding with the circuit pattern are buried in the insulation layer, and removing the exposed seed layer. This method can prevent undercuts caused by etching in the seeds positioned between the circuit pattern and the insulation layer, and can thereby prevent the circuit pattern from becoming detached. Also, the adhesion between the circuit pattern and the insulation layer can be increased, making it possible to implement a finer circuit pattern over the insulation layer.

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Номер записи: 97
13-12-2012 дата публикации

Electronic circuit module and method of making the same

Номер: US20120313656A1
Автор: Jae-Soon Kim, Jin-Hong An
Принадлежит: Samsung SDI Co Ltd

An electronic circuit module and a method of manufacturing the electronic circuit module are disclosed. In one embodiment, the electronic circuit module includes i) a substrate on which a circuit is formed, ii) a plurality of electrical devices electrically connected to the circuit and iii) a first molding unit coated on the substrate to cover at least the electrical devices. The module further includes i) a test terminal unit comprising a plurality of test wires and configured to inspect the circuit, wherein each of the test wires comprises a first end electrically connected to the circuit and a second end exposed from the first molding unit, and wherein the second ends of the test wires form an inspection unit and are adjacent to each other on the substrate and ii) a second molding unit coated on the substrate to cover the second ends of the test wires.

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Номер записи: 98
20-12-2012 дата публикации

Pre-treatment process for electroless nickel plating

Номер: US20120321781A1
Автор: Elisabeth Zettelmeyer
Принадлежит: Individual

The present invention discloses a process for electroless plating of nickel onto copper features of a printed circuit board which suppresses extraneous nickel plating. The process comprises the steps i) activation of the copper features with palladium ions; ii) removal of excessive palladium ions or precipitates formed thereof with a pre-treatment composition comprising at least two different types of acids wherein one type is an organic amino carboxylic acid and iii) electroless plating of nickel.

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Номер записи: 99
27-12-2012 дата публикации

Wiring board and method of manufacturing the same

Номер: US20120325529A1
Автор: Akinori Shiraishi, Hideaki Sakaguchi, Mitsutoshi Higashi
Принадлежит: Shinko Electric Industries Co Ltd

A wiring board includes a first substrate portion including a first feed-through conductor portion in a vertical direction, a second substrate portion provided on the first substrate portion and including a second feed-through conductor portion in a vertical direction of a corresponding part to the first feed-through conductor portion, and a feed-through electrode including the first feed-through conductor portion and the second feed-through conductor portion.

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Номер записи: 100