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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Форма поиска

Поддерживает ввод нескольких поисковых фраз (по одной на строку). При поиске обеспечивает поддержку морфологии русского и английского языка
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Применить Всего найдено 3260. Отображено 100.
17-05-2012 дата публикации

Thermosetting fluoropolyether adhesive composition and adhesion method

Номер: US20120123049A1
Автор: Hidenori Koshikawa, Mikio Shiono
Принадлежит: Shin Etsu Chemical Co Ltd

A thermosetting fluoropolyether adhesive composition is provided. This composition cures at lower than 100° C., and the cured product exhibits good adhesion to various substrates and excellent adhesion durability at a temperature of up to 150° C. A method for adhering the composition to the substrate is also provided. The composition comprises (A) a straight chain polyfluoro compound, (B) a fluorine-containing organohydrogenpolysiloxane containing at least 2 SiH groups and not containing other functional group, (C) a platinum group metal catalyst, (D) a fluorine-containing organohydrogenpolysiloxane containing a fluorine-containing organic group, SiH group, epoxy group and/or tri(organoxy)silyl group, and an aryl group, (E) a polyhydric allyl ester compound, (F) an organosilicon compound having epoxy group and an organoxy group, and not containing SiH group, and (G) an organosilicon compound having SiH group and an aryl group, and not containing epoxy group or a tri(organoxy)silyl group, or a fluorine-containing organic group.

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Номер записи: 1
28-06-2012 дата публикации

Glue for repair or attachment free of organotin

Номер: US20120165453A1
Автор: Jacqueline Carrard, Virginie Cagan
Принадлежит: BOSTIK SA

The invention relates to an adhesive composition, including: 10 to 95% of a moisture cross-linkable polymer (A), the main chain includes 2 silyl terminal groupings, each of which includes at least one hydrolyzable group bonded to the silicon atom; 1 to 60% of a mineral filler (B) in the form of particles having a size of between 1 nm and 0.2 mm; and 0.2 to 7% of a cross-linking catalyst (C) consisting of titanium tetraisopropoxide. The invention also relates to the use of said composition as glue for repair or attachment.

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Номер записи: 2
12-07-2012 дата публикации

Reactive diluents containing silane groups

Номер: US20120175563A1
Автор: Axel Schmidt, Frank Kobelka, Jorg Hofmann, Klaus Lorenz, Mathias Matner, Michael Ludewig
Принадлежит: BAYER MATERIALSCIENCE AG

The present invention relates to reactive diluents for moisture-curing coating systems containing silane groups. The invention further relates to a method for the production of said diluents, and to the use thereof in coating agents, adhesives and sealants.

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Номер записи: 3
04-10-2012 дата публикации

Moisture Curable Silylated Polymer Compositions With Improved Adhesion to Concrete

Номер: US20120251832A1
Автор: Jeries Nesheiwat, Misty Huang
Принадлежит: Momentive Performance Materials Inc

A moisture-curable resin composition comprising (a) at least one moisture-curable polymer having at least one hydrolysable silyl group; (b) at least one hydrocarbylalkoxysilane; and (c) at least one silane adhesion promoter containing a glycidoxy group. The composition may also contain additives including a catalyst for catalyzing the reaction between the moisture-curable polymer having at least one hydrolysable silyl group (a) with water under curing conditions, a filler, a plasticizer, and combinations thereof. The moisture-curable resin composition is useful in the production of adhesives, sealants and coatings for use in primerless concrete applications.

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Номер записи: 4
07-03-2013 дата публикации

Structural adhesives

Номер: US20130056153A1
Автор: Michael Czaplicki
Принадлежит: Zephyros Inc

A solid dry to the touch at ambient temperature structural adhesive which can be cured at elevated temperature and which can be moulded at an intermediate temperature is provided as well as the use of the adhesive for bonding metals.

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Номер записи: 5
14-03-2013 дата публикации

WATER-, SOLVENT- AND PHTHALATE-FREE, SILANE-MODIFIED ONE-COMPONENT PARQUET ADHESIVE AND USE THEREOF FOR EXTREMELY DIMENSIONALLY-STABLE GLUING OF PARQUET, WOODEN FLOOR COVERINGS AND WOOD-BASED MATERIAL BOARDS IN INTERIOR FITMENT

Номер: US20130065997A1
Автор: GAHLMANN Frank
Принадлежит: STAUF KLEBSTOFFWERK GMBH

The present invention relates to a silane-modified, one-component water-, solvent- and phthalate-free parquet adhesive and also to the use thereof for extremely dimensionally-stable gluing of parquet, wooden floor coverings and wood-based material boards to sub-floors in interior fitment. 1. Water- , solvent- and phthalate-free , one-component parquet adhesive which is based on silane-terminated polyalkylene oxide oligomers ,wherein it comprises the following materials or consists of them:a) 10 to 30 percent by mass of a moisture-reactive, silane-terminated polyalkylene oxide binding agent with an average molecular weight of 6,000 to 20,000 g/mol, the silane functions being bonded via urethane- and/or urea groups to the oligomeric skeletal structure,b) 30 to 60 percent by mass of a surface-hydrophobised chalk powder with an average particle diameter of 0.8 to 4.0 μm,c) 2 to 10 percent by mass of a surface-hydrophobised chalk powder with an average particle diameter of 0.2 to 0.7 μm,d) 3 to 15 percent by mass of a surface-hydrophobised wollastonite with an average needle length of 15 to 60 μm and an average aspect ratio of 3:1 to 12:1,e) 0.2 to 3 percent by mass of a moisture-reactive, silane-modified drying agent, and alsof) 0.3 to 4 percent by mass of a moisture-reactive, silane-modified adhesion promoter,the percentage data relating to the mass of the ready-to-use parquet adhesive and the sum of the components a) to f) being 45.5% to 100%.2. Water- claim 1 , solvent- and phthalate-free claim 1 , one-component parquet adhesive according to claim 1 ,wherein it comprises the following materials or consists of them:a) 16 to 26 percent by mass of a moisture-reactive, silane-terminated polyalkylene oxide binding agent with an average molecular weight of 7,000 to 13,000 g/mol, the terminal silane functions being bonded via urethane- and/or urea groups to the oligomeric skeletal structure,b) 44 to 54 percent by mass of a surface-hydrophobised chalk powder with an average ...

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Номер записи: 6
28-03-2013 дата публикации

ADHESIVE COMPOSITION, USE THEREOF, CONNECTION STRUCTURE FOR CIRCUIT MEMBERS, AND METHOD FOR PRODUCING SAME

Номер: US20130075142A1
Автор: Izawa Hiroyuki, Katogi Shigeki
Принадлежит: HITACHI CHEMICAL CO., LTD.

An adhesive composition for connection between a first circuit member having a first connecting terminal on the main surface and a second circuit member having a second connecting terminal on the main surface, wherein the first circuit member and/or second circuit member are made of a base material containing a thermoplastic resin with a glass transition temperature of no higher than 200° C., the first connecting terminal and/or second connecting terminal are made of ITO and/or IZO, and the adhesive composition includes a phosphate group-containing compound, the free phosphate concentration of the cured adhesive composition being no greater than 100 ppm by mass. 1. An adhesive composition for connection between a first circuit member having a first connecting terminal on the main surface and a second circuit member having a second connecting terminal on the main surface , wherein:the first circuit member and/or second circuit member are made of a base material containing a thermoplastic resin with a glass transition temperature of no higher than 200° C.,the first connecting terminal and/or second connecting terminal are made of ITO and/or IZO, andthe adhesive composition includes a phosphate group-containing compound,the free phosphate concentration of the cured adhesive composition being no greater than 100 ppm by mass.2. The adhesive composition according to claim 1 , which contains (a) a thermoplastic resin claim 1 , (b) a radical polymerizing compound and (c) a radical polymerization initiator claim 1 , and the (b) radical polymerizing compound includes the phosphate group-containing compound.3. The adhesive composition according to claim 2 , wherein the (b) radical polymerizing compound contains one or more of both a vinyl compound with a phosphate group claim 2 , as the phosphate group-containing compound claim 2 , and a radical polymerizing compound other than the vinyl compound with a phosphate group.4. The adhesive composition according to claim 1 , which ...

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Номер записи: 7
28-03-2013 дата публикации

Adhesion promotion in printed circuit boards

Номер: US20130078367A1
Автор: Abayomi I. Owei, Eric Yakobson, Hiep X. Nguyen
Принадлежит: Enthone Inc

An adhesion promotion process and composition for enhancing adhesion between a copper conducting layer and a dielectric material during manufacture of a printed circuit board. The composition contains a corrosion inhibitor, an inorganic acid, and an alcohol which is effective to increase copper-loading in the composition.

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Номер записи: 8
02-05-2013 дата публикации

Plasticizers for Adhesive, Coating and Sealant Compositions Applied to Asphalt

Номер: US20130108882A1
Автор: Jonathan T. Stuart, William J. Werts
Принадлежит: Henry Co LLC

An asphalt-containing substrate having an adhesive, coating or sealant composition applied to the substrate surface and adhesive, coating or sealant compositions are described herein. The composition resists softening of the asphalt compound in the asphalt-containing substrate at elevated temperatures and includes at least one base material and at least one plasticizer. The plasticizer has is a low molecular weight compound and preferably includes an ester-containing reaction product of at least one glycerol and at least one carboxylic acid or a glycol and an aryl carboxylic acid. The composition base material is preferably a polymer or copolymer that includes polyurethanes, silylated polyurethanes, silylated polyethers, copolymers thereof, and blends thereof. Products containing the composition and a method of applying the composition to a substrate are also disclosed herein.

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Номер записи: 9
11-07-2013 дата публикации

Adhesive composition containing resin having carbon-carbon multiple bond

Номер: US20130177763A1
Автор: Hiroshi Ogino, Mamoru Tamura, Tomoyuki Enomoto
Принадлежит: Nissan Chemical Corp

An adhesive composition has a polymer that contains a unit structure of Formula (1): L 1 -O-T 1 -O  Formula (1) (where L 1 is an arylene group or a combination of an arylene group and a sulfonyl group or a carbonyl group, and T 1 is a fluoroalkylene group, a cyclic alkylene group, an arylene group having a substituent, or a combination of an arylene group optionally having a substituent and a fluoroalkylene group or a cyclic alkylene group) and contains, at a terminal or in a side chain or the main chain, at least one group containing a structure of Formula (2-A), a structure of Formula (2-B), or both structures:

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Номер записи: 10
18-07-2013 дата публикации

ADHESIVE

Номер: US20130180655A1
Автор: Hashimoto Akinori, Kato Masanori
Принадлежит: AKEBONO BRAKE INDUSTRY CO., LTD.

There is provided a powdery adhesive that is used for adhesion between a metal plate and a porous material. The powdery adhesive includes at least thermosetting adhesive particles and an anti-rust filler. A content of the anti-rust filler is 0.1 to 1.0 part by mass with respect to 100 parts by mass of the thermosetting adhesive particles. The anti-rust filler may be at least one of phosphate and molybdate. 1. A powdery adhesive that is used for adhesion between a metal plate and a porous material , the powdery adhesive comprising at least:thermosetting adhesive particles; andan anti-rust filler,wherein a content of the anti-rust filler is 0.1 to 1.0 part by mass with respect to 100 parts by mass of the thermosetting adhesive particles.2. The powdery adhesive according to claim 1 , wherein the anti-rust filler is at least one of phosphate and molybdate.3. A method for adhesion between a metal plate and a porous material claim 1 , the method comprising:{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'electrostatically applying the powdery adhesive according to to a metal plate and pre-curing the same; and'}compression-bonding and heating a porous material on the pre-cured powdery adhesive.4. A method of manufacturing an adhered material of a metal plate and a porous material claim 1 , the method comprising:{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'electrostatically applying the powdery adhesive according to to a metal plate and pre-curing the same; and'}compression-bonding and heating a porous material on the pre-cured powdery adhesive. The invention is related to an adhesive, and more particularly, to a powdery adhesive containing thermosetting adhesive particles.Regarding a method for adhesion between a metal plate and a porous material, for example a pressure plate (metal plate) of a brake pad and a friction material (porous material), a method has been known in which thermosetting adhesive particles are attached to the pressure plate with an ...

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Номер записи: 11
01-08-2013 дата публикации

Gantrez Hydrogel With Dry Tack

Номер: US20130195771A1
Автор: Michael J. Borja
Принадлежит: Individual

A Gantrez hydrogel comprising sodium, calcium, zinc, strontium, and ferric cations, and a polyvinylpyrrolidone based tack agent is disclosed. A method for preparation of the Gantrez hydrogel is also disclosed.

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Номер записи: 12
15-08-2013 дата публикации

ORIENTED STRUCTURAL ADHESIVES

Номер: US20130206333A1
Автор: Czaplicki Michael
Принадлежит: Zephyros, Inc.

A solid, dry to the touch at ambient temperature, heat curable, generally non-foaming structural adhesive that exhibits shape memory characteristics. The adhesive can be cured at an elevated temperature and contains a high molecular weight polymeric constituent that can be oriented such that at an elevated temperature below the curing temperature the material will shrink in one plane while increasing its thickness at a temperature in the range of from above the elevated temperature to below the curing temperature. 1. A dry structural adhesive formulation for bonding together opposing surfaces comprising: i. the first polymeric material is thermohardenable at a first temperature;', 'ii. the second polymeric material is orientable and relaxable at a second temperature', 'wherein the second temperature is lower than the first temperature and the formulation becomes oriented when deformed and cured at the second temperature and forms a bond upon application of heat at the first temperature to cure the first polymeric material;', 'wherein the relaxation of the molecular orientation of the second polymeric material at the second temperature causes the adhesive formulation to increase its thickness and thereby contact an opposing surface and develop a bond with the opposing surface when heated to the first temperature., 'a mixture of a first polymeric material and a second polymeric material that is compatible with the first polymeric material, wherein2. A dry structural adhesive material according to claim 1 , wherein the molecular orientation of at least one of the first or second polymeric material as a minor polymeric constituent is frozen in place prior to heat.3. A dry structural adhesive material according to that can be moulded at temperatures below the temperature at which it cures.4. A dry structural adhesive material according to claim 2 , wherein the molecular orientation of the minor constituent is produce during the injection moulding process.5. A dry ...

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Номер записи: 13
22-08-2013 дата публикации

CURABLE COMPOSITION

Номер: US20130217828A1
Автор: Fujimoto Toyohisa, Miyafuji Kiyoshi, Okamoto Toshihiko, Wakabayashi Katsuyu
Принадлежит: KANEKA CORPORATION

An object of the present invention is to provide a curable composition that can be used as sealing materials, adhesives, and the like, has excellent curing properties, and gives a cured product excellent in elongation properties. The object can be attained by means of a curable composition comprising: a reactive silyl group-containing polyether polymer (A) that contains a reactive silyl group with high activity (e.g., (ClCH)(CHO)Si—, (CHOCH)(CHO)Si—, or CH(CHO)Si—CH—NH—C(═O)—); and a reactive silyl group-containing polyether polymer (B) that contains a reactive silyl group (e.g., CH(CHO)Si— or (CHO)Si—) different from that mentioned above and/or a (meth)acrylic polymer (C) containing a reactive silyl group that is not particularly limited. 1. A curable composition , comprising: a polyether polymer (A) containing a reactive silyl group represented by the following formula (1); and at least one of a polyether polymer (B) containing a reactive silyl group represented by the following formula (2) and a (meth)acrylic polymer (C) containing a reactive silyl group represented by the following formula (3): -W-CH—SiRRX(1) wherein Ris a C1 to C20 hydrocarbon group wherein at least one hydrogen atom on carbon atoms at positions 1 to 3 is replaced with halogen , —OR , —NRR , —N═R , —SR(in which each of R , R , R , and Ris a hydrogen atom or a C1 to C20 substituted or unsubstituted hydrocarbon group , and Ris a divalent C1 to C20 substituted or unsubstituted hydrocarbon group) , a C1 to C20 perfluoroalkyl group , or a cyano group; Rrepresents a C1 to C20 hydrocarbon group , a C6 to C20 aryl group , a C7 to C20 aralkyl group , or a triorganosiloxy group represented by RSiO— wherein each of three Rs is a C1 to C20 hydrocarbon group and they may be the same as or different from each other; X represents a hydroxy or hydrolyzable group; W represents a linking group selected from —O—R— , —O—CO—N(R)— , —N(R)—CO—O— , —N(R)—CO—N(R)— , —S—CO—NH— , —NH—CO—S— , and —S— wherein Rrepresents a ...

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Номер записи: 14
29-08-2013 дата публикации

Adhesive Composition, Varnish, Adhesive Film and Wiring Film

Номер: US20130220674A1
Автор: ABE Tomiya, AMOU Satoru, Komatsu Hiroaki, Murakami Kenichi, SHANAI Daisuke
Принадлежит:

Provided are an adhesive composition with good storage stability, heat resistance, moisture resistance reliability, and adhesion properties; and a curl- and heat-resistant adhesive film and a wiring film using the adhesive composition. The adhesive composition contains 100 parts by weight of a phenoxy resin (A) having plural alcoholic hydroxyl groups in a side chain of the molecule thereof; 2 to 60 parts by weight of a polyfunctional isocyanate compound (B) having an isocyanate group and at least one functional group selected from vinyl, acrylate, and methacrylate groups in the molecule thereof; and 5 to 30 parts by weight of a maleimide compound (C) having plural maleimide groups in the molecule thereof or/and reaction product thereof, in which a total amount of the components (B) and (C) is from 7 to 60 parts by weight. 1. An adhesive composition comprising:100 parts by weight of a phenoxy resin (A) having a plurality of alcoholic hydroxyl groups on the side chain thereof;2 to 60 parts by weight of a polyfunctional isocyanate compound (B) having one isocyanate group and at least one functional group of a vinyl group, an acrylate group and a methacrylate group in the molecule thereof; and5 to 30 parts by weight of a maleimide compound (C) having a plurality of maleimide groups in the molecule thereof or/and a reaction product thereof,wherein a total amount of the component (B) and the component (C) is from 7 to 60 parts by weight.2. The adhesive composition according to claim 1 , further comprising:1 to 20 parts by weight of an isocyanatosilane compound (D) having one or more silanol groups or/and alkoxy groups and one isocyanate group in the molecule thereof.3. The adhesive composition according to claim 1 , further comprising:001 to 0.1 part by weight of an urethanation catalyst (E);0.0002 to 1 part by weight of a radical polymerization inhibitor (F); and0.03 to 1 part by weight of a radical polymerization initiator (G) which has a 1-hour half life temperature of ...

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Номер записи: 15
24-10-2013 дата публикации

TWO-COMPONENT CURABLE COMPOSITION

Номер: US20130280530A1
Автор: Luckert Jens, Rozier Eric, Villemagne Florent, Zander Lars
Принадлежит:

In the context of a curable agent based on at least one silyl-terminated polymer, the adhesion spectrum for bonding plastics, and the speed at which adhesion builds up, are to be improved. This is achieved by making available a curable agent containing two components (1) and (2) that are not in mutual contact, where component (1) contains at least one polymer having at least one terminal group of formula (I) -A-CH—SiXYZ (I), in which A is a divalent bonding group, X, Y, Z are, mutually independently, are Cto Calkyl, Cto Calkoxy, or Cto Cacyloxy groups, where at least one of the substituents is a Cto Calkoxy or Cto Cacyloxy group, and n is 0 or 1; and component (2) contains at least water and at least one silanol condensation catalyst. A further subject of the present invention is the use of the agent according to the present invention as an adhesive and/or sealant. 1. A curable agent containing two components (1) and (2) that are not in mutual contact , wherein {'br': None, 'sub': n', '2, '-A-CH—SiXYZ\u2003\u2003(I),'}, 'component (1) contains at least one polymer having at least one terminal group of the general formula (I)'}in whichA is a divalent bonding group containing at least one heteroatom,{'sub': 1', '8', '1', '8', '1', '8', '1', '8', '1', '8, 'X, Y, Z are substituents on the Si atom and, mutually independently, are Cto Calkyl, Cto Calkoxy, or Cto Cacyloxy residues, where at least one of the substituents is a Cto Calkoxy or Cto Cacyloxy residue, and'} 'component (2) contains at least water and at least one silanol condensation catalyst.', 'n is 0 or 1; and'}2. The curable agent according to claim 1 , wherein the divalent bonding group A in formula (I) is a carbamate group or urea group.3. The curable agent according to claim 1 , wherein X claim 1 , Y claim 1 , Z in formula (I) are claim 1 , mutually independently in each case claim 1 , a methyl claim 1 , an ethyl claim 1 , a methoxy claim 1 , or an ethoxy residue.4. The curable agent according to claim 1 , ...

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Номер записи: 16
24-10-2013 дата публикации

REACTIVE PLASTICIZER AND CURABLE COMPOSITION CONTAINING SAME

Номер: US20130281591A1
Автор: SAITO Takahiro, Sakabe Masaomi, Yano Ayako
Принадлежит: KANEKA CORPORATION

An organic polymer, having a number-average molecular weight of 800 to 15,000, and comprising 0.5 or more but less than 1.2 reactive silicon groups in each molecule of the polymer on average, in which the reactive silicon groups are introduced into one-side out of terminals thereof, and heightening, in particular, the proportion of molecules (of the polymer) into each of which the silicon group is introduced. 2. The organic polymer according to wherein the organic polymer (A) has a linear main chain.3. The organic polymer according to claim 1 , wherein the reactive silicon group(s) of the organic polymer (A) is/are present substantially only at one-side out of terminals of the organic polymer.4. The organic polymer according to claim 1 , wherein Rin the general formula (1) is CH.5. The organic polymer according to claim 1 , wherein Y in the general formula (1) is an oxygen atom.6. The organic polymer according to claim 1 , Wherein a in the general formula (1) is 2.7. The organic polymer according to claim 1 , wherein the main chain of the organic polymer (A) is one or more selected from polyoxyalkylene polymers claim 1 , polyacrylic polymers claim 1 , and hydrocarbon polymers.8. The organic polymer according to claim 1 , wherein the main chain of the organic polymer (A) is polyoxypropylene polymer.9. The organic polymer according to claim 1 , which is obtained by introducing the reactive silicon group(s) (each) represented by the general formula (1) into a polyoxypropylene polymer yielded by causing propylene oxide to react in the presence of a composite metal cyanide complex catalyst claim 1 , and yielded by using an initiator having claim 1 , in a single molecule thereof claim 1 , only one hydroxyl group.10. The organic polymer (A) according to claim 1 , which is obtained by introducing the reactive silicon group(s) (each) represented by the general formula (1) into a polyoxypropylene polymer yielded by causing propylene oxide to react in the presence of a ...

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Номер записи: 17
30-01-2014 дата публикации

Perfluoroether sealant compositions

Номер: US20140027057A1
Автор: Chandra Rao, Juexiao Cai, Renhe Lin
Принадлежит: PRC Desoto International Inc

Disclosed are perfluoroethers and perfluoroether compositions useful in high temperature aerospace applications. The perfluoroethers can be adapted for use with various curing chemistries.

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Номер записи: 18
20-02-2014 дата публикации

Rubber composite reinforced with a textile material provided with a thermoplastic adhesive

Номер: US20140051312A1
Автор: Emmanuel Custodero, Sébastien RIGO, Vincent Abad
Принадлежит: Compagnie Generale des Etablissements Michelin SCA, Michelin Recherche et Technique SA Switzerland

Rubber composite, and in particular tyre, reinforced with a sized textile material, such as a fibre or a film, at least one portion of which is coated with an adhesive layer, capable of adhering directly via curing (crosslinking) to an unsaturated rubber matrix, such as a natural rubber matrix, characterized in that said layer comprises an adhesive composition or thermoplastic adhesive, in the liquid or solid state, which is based on at least one unsaturated thermoplastic styrene (TPS) elastomer and a poly(p-phenylene ether) (PPE). Such an adhesive based on unsaturated TPS and PPE advantageously makes it possible to replace a conventional textile adhesive of RFL type. Use of such an adhesive for the adhesive bonding of a textile material to an unsaturated, in particular diene, rubber. Process for obtaining such a composite.

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Номер записи: 19
03-04-2014 дата публикации

Cladding material for construction

Номер: US20140093679A1
Автор: Toshihiko Okamoto
Принадлежит: Kaneka Corp

A building exterior material is made of a curable composition which has excellent water vapor permeability. The building exterior material comprises a building exterior substrate coated with a curable composition comprising an organic polymer (A) containing a silicon-containing group capable of being cross-linked by forming a siloxane bond, wherein the organic polymer (A) is a polyoxyalkylene polymer (A1) containing an oxyethylene repeating unit in a backbone skeleton, a weight of the oxyethylene repeating unit in the component (A1) being 1 to 80% by weight of the total weight of the component (A1), and/or a (meth)acrylate polymer (A2) containing an oxyethylene repeating unit at a side chain, a weight of the oxyethylene repeating unit in the component (A2) being 1 to 50% by weight of the total weight of the component (A2), and the curable composition is cured into a cured product having a thickness of 0.1 to 3.0 mm.

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Номер записи: 20
03-04-2014 дата публикации

CURABLE COMPOSITION

Номер: US20140094553A1
Автор: Fujimoto Toyohisa, Okamoto Toshihiko
Принадлежит: KANEKA CORPORATION

The present invention provides a curable composition useful as a contact adhesive which has a high rate of initial tack development, high tack strength, and long retention time of the developed tack. The curable composition includes an organic polymer (Q) containing a reactive silyl group, and a linear organic polymer (P) having a number average molecular weight larger than that of the polymer (Q) and having a reactive silyl group containing three hydrolyzable groups at only one terminal. The organic polymer (P) and the organic polymer (Q) are mixed at a mixing ratio (P):(Q), in terms of parts by weight, of 60:40 to 5:95. 1. A curable composition , comprisinga linear organic polymer (P) having a reactive silyl group represented by the following formula (1) at only one terminal, andan organic polymer (Q) containing a reactive silyl group represented by the following formula (2),the organic polymer (P) and the organic polymer (Q) being mixed at a mixing ratio (P):(Q), in terms of parts by weight, of 60:40 to 5:95,the organic polymer (P) having a number average molecular weight larger than that of the organic polymer (Q), {'br': None, 'sub': '3', '-V-SiX\u2003\u2003(1)'}, 'the formula (1) beingwherein V represents a C1 to C8 divalent hydrocarbon group, Xs each represent a hydroxyl or hydrolyzable group, and when there are a plurality of Xs, Xs may be the same as or different from one another, {'br': None, 'sup': '1', 'sub': d', '3-d, '-V-SiRX\u2003\u2003(2)'}, 'the formula (2) being{'sup': 1', '0', '0', '1', '1, 'sub': '3', 'wherein Rrepresents a C1 to C20 hydrocarbon group, a C6 to C20 aryl group, a C7 to C20 aralkyl group, or a triorganosiloxy group represented by RSiO— where the three Rs each represent a C1 to C20 hydrocarbon group and may be the same as or different from one another; V represents a C1 to C8 divalent hydrocarbon group; X represents a hydroxyl or hydrolyzable group; d represents 1 or 2; when there are a plurality of Rs, Rs may be the same as or ...

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Номер записи: 21
03-04-2014 дата публикации

MODIFIED POLYPHENOL BINDER COMPOSITIONS AND METHODS FOR MAKING AND USING SAME

Номер: US20140094562A1
Автор: Atkinson Derek L., Hagiopol Cornel
Принадлежит: GEORGIA-PACIFIC CHEMICALS LLC

Modified polyphenol binder compositions and methods for making and using same are provided. In at least one specific embodiment, the binder composition can include at least one unsaturated monomer and at least one polyphenolic compound. The polyphenolic compound can include a lignin, a tannin, a novolac resin, a modified phenol formaldehyde resin, bis-phenol A, humic acid, or any mixture thereof. 1. A binder composition , comprising:at least one unsaturated monomer; andat least one polyphenolic compound comprising a lignin, a tannin, a novolac resin, a modified phenol formaldehyde resin, bis-phenol A, humic acid, or any mixture thereof.2. The binder composition of claim 1 , wherein the unsaturated monomer is nonionic.3. The binder composition of claim 1 , wherein the unsaturated monomer comprises an unsaturated glycidyl ether claim 1 , an unsaturated glycidyl ester claim 1 , an unsaturated mono-epoxide claim 1 , an unsaturated methylol compound claim 1 , maleic anhydride claim 1 , or any mixture thereof.4. The binder composition of claim 1 , wherein the unsaturated monomer and the polyphenolic compound are at least partially reacted with one another claim 1 , and wherein the binder composition comprises at least two unsaturated monomers.5. The binder composition of claim 1 , wherein the unsaturated monomer does not contain an aromatic ring.6. The binder composition of claim 1 , wherein the binder composition further comprises water in an amount of about 40 wt % to about 70 wt % claim 1 , based on a solids weight of the polyphenolic compound claim 1 , and wherein the binder composition comprises the unsaturated monomer in an amount of about 0.1 wt % to about 50 wt % claim 1 , based on the solids weight of the polyphenolic compound.7. The binder composition 1 claim 1 , wherein the unsaturated monomer comprises an unsaturated glycidyl ether claim 1 , and wherein the unsaturated glycidyl ether comprises vinyl glycidyl ether claim 1 , isopropenyl glycidyl ether claim 1 , ...

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Номер записи: 22
03-01-2019 дата публикации

Stabilized storage container

Номер: US20190002623A1
Автор: Kriesel Matthew
Принадлежит:

The invention provides a unique thermoset viscoelastomeric reaction product and a container combination comprised of the supportive base equipped with a thermoset viscoelastomer reaction product possessing unexpectedly superior adhesive and cohesive efficacy rendering it especially useful as an adhesive insert in a container combination. The thermoset insert bonds to any suitable supportive structure. The unique viscoelastomeric reaction product inserts adhesively immobilize items placed thereupon and adhesively or permanently bonds to most conventional containers. The tenacious cohesive and adhesive features of the insert allows for inverted stowage of stowed items. Due to the confining adhesive and cohesive attributes of the insert, structural supports of a flexible or solid base without a conventional confining structure provide a unique container combination for the stowed items. Containers equipped with the unique insert also surprisingly provide an aseptic environment especially useful for hygienic applications. 1. A stable , adhesive and cohesive thermoset viscoelastomeric reaction product prepared by thermosetting a reaction media comprised of a substantially uniform admixture of an isocyanate prepolymer an effective amount of plasticizer with the amount containing less than 50 percent by weight of an epoxidized triglyceride plasticizer , from about 35 to about 55 percent by weight polyols with said polyols consisting essentially of straight chain linking diols and cross-linking triols each having repetitive oxygen containing functional groups at a diols to triols weight ratio ranging from about 7:13 to about 13:7 with the weight ratio and the effective amount of plasticizer within the reaction media being sufficient to provide an adhesion release strength of more than 300 grams of force per square centimeter.2. The reaction product according to wherein the polyols comprise polyethers having a molecular weight in excess of 1000.3. The reaction product ...

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Номер записи: 23
03-01-2019 дата публикации

POLARIZING PLATE USING ADHESIVE COMPOSITION AND OPTICAL MEMBER COMPRISING THE SAME

Номер: US20190002745A1
Автор: CHO Ik Hwan, HAN In Cheon, Lee Do Heon, Lee Tae Hyun, Yu Mi Yeon
Принадлежит:

Disclosed are an adhesive composition for polarizing plates, a polarizing plate using the same, a method for preparing the same, and an optical member including the same. The adhesive composition includes (A) a (meth)acrylic radical compound, (B) a cationic epoxy compound, (C) a phenoxy resin, and (D) a photoinitiator. 1. A polarizing plate comprising a polarizer and a protective film stacked on one or both sides of the polarizer via an adhesive layer ,wherein the adhesive layer comprises:(A) a (meth)acrylic radical compound, (B) a cationic epoxy compound, (C) a phenoxy resin, and (D) a photoinitiator,wherein the polarizer has a maximum shrinkage length of about 2 mm or less at one end thereof when the polarizing plate is dipped in water having a constant temperature of 60° C. for 2 hours.2. The polarizing plate according as claimed in claim 1 , wherein the (C) phenoxy resin comprises a non-curable phenoxy resin.3. The polarizing plate according as claimed in claim 1 , wherein the (C) phenoxy resin has a repeated structure of bisphenol A.5. The polarizing plate according as claimed in claim 1 , wherein the (C) phenoxy resin has a weight average molecular weight of about 30 claim 1 ,000 g/mol to about 60 claim 1 ,000 g/mol.6. The polarizing plate according as claimed in claim 1 , wherein the (C) phenoxy resin is present in an amount of about 0.1 parts by weight to about 5 parts by weight based on 100 parts by weight of (A)+(B)+(C).7. The polarizing plate according as claimed in claim 1 , wherein a weight ratio of the (A) (meth)acrylic radical compound: the (B) cationic epoxy compound ranges from about 10:90 to about 50:50 based on 100 parts by weight of (A)+(B).8. The polarizing plate according as claimed in claim 1 , wherein the (A) (meth)acrylic radical compound comprises a (meth)acrylate containing C-Calkyl group having at least one hydrophilic group.9. The polarizing plate according as claimed in claim 1 , wherein the (B) cationic epoxy compound comprises an ...

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Номер записи: 24
20-01-2022 дата публикации

ELECTRICALLY CONDUCTIVE ADHESIVE AND ELECTRICALLY CONDUCTIVE MATERIAL

Номер: US20220017793A1
Автор: KUNIMUNE Teppei, KURAMOTO Masafumi
Принадлежит: NICHIA CORPORATION

Disclosed is an electrically conductive adhesive containing: 1. A method of producing an electrically conductive material , comprising hardening , at a temperature in a range of 120° C. to 300° C. , an electrically conductive adhesive comprising:(A) a polyether polymer having: {'br': None, 'sup': '1', '—R—O—'}, 'a backbone comprising a repeating unit of the formula{'sup': '1', 'wherein Ris a hydrocarbon group having 1 to 10 carbon atoms, and an end group which is a hydrolyzable silyl group, and'}(B) silver particles.2. The method according to claim 1 , wherein the hardening is performed at 160° C. to 250° C. in the air for 30 to 120 minutes.3. The method according to claim 1 , wherein the hydrolyzable silyl group in the polyether polymer (A) is of the formula:{'br': None, 'sup': 1', '2, 'sub': n', '3-n, '-si(—X)(—X)'}{'sup': '1', 'wherein Xis a hydrolyzable group,'}{'sup': '2', 'Xa hydrocarbon group having 1 to 12 carbon atoms, and'}n is 1, 2 or 3.4. The method according to claim 3 , wherein the hydrolyzable group in the polyether polymer (A) is at least one group selected from a hydride group claim 3 , an alkoxy group claim 3 , a halogen group claim 3 , an acyloxy group claim 3 , a ketoxymate group claim 3 , an aminoxy group claim 3 , an amide group claim 3 , an amino group and a mercapto group.5. The method according to claim 1 , wherein the electrically conductive adhesive further comprises particles of another metal which is at least one selected from gold claim 1 , copper claim 1 , platinum claim 1 , palladium claim 1 , rhodium claim 1 , ruthenium claim 1 , iridium and osmium.6. The method according to claim 5 , wherein the amount of particles of the other metal is at most 30% by weight claim 5 , based the total of the silver particles (B) and the other metal particles.7. The method according to claim 1 , wherein the silver particles (B) are flake-shaped particles.8. The method according to claim 1 , wherein the average particle diameter (median diameter) of ...

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Номер записи: 25
12-01-2017 дата публикации

CURABLE COMPOSITION

Номер: US20170009113A1
Автор: ITANO Yu, Smits Wendy
Принадлежит: KANEKA CORPORATION

A curable composition includes an organic polymer containing a reactive silicon group (A), and a bound substance of kaolinite and quartz (B) at a proportion of 30-200 parts by weight relative to 100 parts by weight of the organic polymer containing a reactive silicon group (A). 1. A curable composition comprisingan organic polymer containing a reactive silicon group (A), anda bound substance of kaolinite and quartz (B) at a proportion of 30-200 parts by weight relative to 100 parts by weight of the organic polymer containing a reactive silicon group (A).2. The curable composition according to claim 1 , wherein the organic polymer containing a reactive silicon group (A) comprises a reactive silicon group-containing polyoxyalkylene-based polymer (A1) and/or a reactive silicon group-containing (meth)acrylate-based polymer (A2).3. The curable composition according to claim 1 , wherein the organic polymer containing a reactive silicon group (A) comprises a polyoxyalkylene-based polymer (a1) and/or a (meth)acrylate-based polymer (a2) as a main chain.4. (canceled)5. The curable composition according to claim 1 , wherein the bound substance of kaolinite and quartz (B) has a kaolinite content of not more than 15 wt %.6. The curable composition according to claim 1 , wherein the bound substance of kaolinite and quartz (B) has a Dparticle size of 1-3 μm.7. The curable composition according to claim 1 , wherein the bound substance of kaolinite and quartz (B) is calcined.8. The curable composition according to claim 1 , wherein the bound substance of kaolinite and quartz (B) is surface-treated.9. The curable composition according to claim 1 , further comprising an epoxy group-containing silane coupling agent (C) and an amidine compound (D).10. The curable composition according to of claim claim 1 , further comprising an organotin-based compound.11. An adhesive comprising the curable composition according to .12. A cured product obtained by curing the curable composition ...

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Номер записи: 26
14-01-2021 дата публикации

REACTIVE SILICON GROUP-CONTAINING POLYMER AND CURABLE COMPOSITION

Номер: US20210009742A1
Автор: Harumashi Tatsuro, Kubota Nodoka
Принадлежит: KANEKA CORPORATION

Provided are reactive silicon group-containing polymers and a curable composition containing said polymers. The curable composition provides a cured product having a low modulus, flexibility, excellent tensile strength, tensile elongation, and tear strength. The curable composition can also exhibit excellent rapid curing properties even when a low-activity catalyst has been added. In the reactive silicon group-containing polymer, a reactive silicon group, indicated by general formula (1): (—Si(R)(X)), is bonded to the molecular chain of the polymer and an atom adjacent to the reactive silicon group has an unsaturated bond. In general formula (1), each Rcan independently indicate a C1-20 hydrocarbon group, and the Rhydrocarbon groups can be substituted and a hetero-containing group can be used. X can be a hydroxyl group or a hydrolyzable group, and a is 1, 2, or 3. 1. A polymer comprising: {'br': None, 'sup': '1', 'sub': 3-a', 'a, '—Si(R)(X)\u2003\u2003(1)'}, 'a reactive silicon group represented by General Formula (1){'sup': 1', '1, 'wherein each Ris independently a hydrocarbon group having 1 to 20 carbon atoms, wherein the hydrocarbon group of Ris optionally substituted with a hetero-containing group as a substituent,'}wherein X is a hydroxyl group or a hydrolyzable group,wherein a is 1, 2, or 3, andwherein an atom adjacent to the reactive silicon group has an unsaturated bond.4. The polymer according to claim 1 , wherein the polymer has the reactive silicon group represented by General Formula (1) in an average number of more than 0.8 per end.5. The polymer according to claim 1 , wherein the reactive silicon group is a dimethoxymethylsilyl group.6. The polymer according to claim 1 , wherein the reactive silicon group is a trimethoxysilyl group and/or a (methoxymethyl)dimethoxysilyl group.7. The polymer according to claim 1 , wherein a main chain backbone of the polymer is a polyoxyalkylene-based polymer.8. A curable composition claim 1 , comprising: the (A) ...

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Номер записи: 27
09-01-2020 дата публикации

A MOISTURE-CURABLE ADHESIVE COMPOSITION AND A METHOD FOR MOUNTING TILES ON WALL SURFACES

Номер: US20200010746A1
Автор: BULEN Chad P., DEVLIN Liam P., OZTEMIZ Serhan, PORTER Todd V.
Принадлежит:

A moisture-curable adhesive composition comprises a polymer component selected from a silane-terminated polyalkylene oxide and/or a polyurethane; a plurality of amino-silane modified wollastonite fibers having an average aspect ratio of from about 1.5:1 to about 12:1 and an average fiber length of from about 6 μm to about 825 μm; at least two fillers, wherein one of said fillers is untreated and a second of said fillers is treated with a modifier selected from the group consisting of a fatty acid derivative, a silane, a titanate, and mixtures thereof wherein at least one of said fillers is irregularly shaped; and a rheology modifier. The composition preferably further comprises a plurality of irregularly-shaped crumb rubber particles having an average particle size of between about 0.5 to 1.5 mm. The composition is useful for adhering tiles to surfaces, especially large format tiles to substantially vertically-extending wall surfaces. 1. A moisture-curable adhesive composition comprising:a) a polymer component selected from a silane-terminated polyalkylene oxide and/or a polyurethane;b) a plurality of amino-silane modified wollastonite fibers having an average aspect ratio of from about 1.5:1 to about 12:1 and an average fiber length of from about 6 μm to about 825 μm;c) at least two fillers, wherein one of said fillers is untreated and a second of said fillers is treated with a modifier selected from the group consisting of a fatty acid derivative, a silane, a titanate, and mixtures thereof and wherein one of said fillers has an average particle size of between about 1.5 μm and about 10 μm and a second of said fillers has an average particle size of between about 0.1 μm and about 1.3 μm, wherein at least one of said fillers is irregularly shaped;d) a rheology modifier.2. The composition of claim 1 , wherein the polymer component is the silane-terminated polyalkylene oxide and is present in an amount of about 5 to about 40% by weight.3. The composition of claim 2 , ...

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Номер записи: 28
11-01-2018 дата публикации

MODULAR ELECTRONICS APPARATUSES AND METHODS

Номер: US20180013082A1
Автор: Allen Mark, LIU Yinglin, MALIK Surama, Rouvala Markku
Принадлежит:

An apparatus comprising: a module; a substrate; and electrolyte between the module and the substrate, wherein an electronic component is formed between the module and the substrate and wherein the electrolyte is configured to function as the electrolyte in the electronic component and also as the adhesive to attach the module to the substrate. 115-. (canceled)16. An apparatus comprising:a module;a substrate; andelectrolyte between the module and the substrate, wherein an electronic component is formed between the module and the substrate and wherein the electrolyte is configured to function as the electrolyte in the electronic component and also as an adhesive to attach the module to the substrate; anda further substrate on the substrate, the further substrate comprising at least one opening, wherein the electrolyte and module are located at least partially in the opening of the further substrate.17. An apparatus as claimed in claim 16 , wherein at least one electrode of the electronic component is located on the module and at least one electrode of the electronic component is located on the substrate.18. An apparatus as claimed in wherein the apparatus comprises routing for the electronic component on the substrate and on the further substrate.19. An apparatus as claimed in claim 16 , wherein the electronic component comprises an electrochemical transistor.20. An apparatus as claimed in wherein the source and drain electrodes of the electrochemical transistor are located on the module and the gate electrode of the electrochemical transistor is located on the substrate or the gate electrode of the electrochemical transistor is located on the module and the source and drain electrodes of the electrochemical transistor are located on the substrate.21. An apparatus as claimed in wherein the module comprises circuitry and the electrochemical transistor is configured to control the circuitry on the module and/or is configured to be used to read out the circuitry on the ...

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Номер записи: 29
03-02-2022 дата публикации

ADHESIVE

Номер: US20220033698A1
Автор: Guo Yi, Peng Jiang, Song Qiang, Wu Ye
Принадлежит:

Described herein is a two-part condensation curable silyl-modified polymer based adhesive composition suitable for the adhesion of a front lens having an anti-haze coating onto a lamp body for lighting applications. Also described herein are lamps comprising a lamp body and a front lens utilizing the adhesive composition to adhere the front lens to the lamp body while generally preserving the integrity of the anti-haze coating. 1. A two-part condensation curable silyl-modified polymer based adhesive composition comprising a base part , Part A , and a catalyst package , Part B , wherein part A comprises:{'sub': m', '3-m, 'sup': '1', '(a) a silyl modified organic polymer having at least two (R)(Y)—Si groups per molecule'}{'sup': '1', 'where each R is a hydroxyl or a hydrolysable group, each Yis an alkyl group containing from 1 to 8 carbons, and m is 1, 2, or 3, and where the organic polymer is selected from the group consisting of polyethers, hydrocarbon polymers, acrylate polymers, polyesters, polyurethanes and polyureas; and'}(b) a reinforcing filler;andwherein Part B comprises:(i) a tin based catalyst; and [ {'br': None, 'sup': 6', '5, 'sub': j', '4-j, 'RSi(OR)'}, '(iia) a silane of the structure'}, {'sup': 5', '6, 'where each Ris an independently selected alkyl group containing at least 2 carbon atoms; j is 1 or 0; and Ris a silicon-bonded organic group selected from a substituted or unsubstituted straight or branched monovalent hydrocarbon group having at least 2 carbons, a cycloalkyl group, an aryl group, an aralkyl group or any one of the foregoing wherein at least one hydrogen atom bonded to carbon is substituted by a halogen atom, or an organic group having an epoxy group, a glycidyl group, an acyl group, a carboxyl group, an ester group, an amino group, an amide group, a (meth)acryl group, a mercapto group or an isocyanate group;'}, {'br': None, 'sup': '7', 'sub': '3', 'RSi(OMe)'}, '(iib) a silane of the structure'}, {'sub': '3', 'sup': 7', '6, 'wherein Me ...

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Номер записи: 30
26-01-2017 дата публикации

Composite nanoparticles including a thioether ligand

Номер: US20170022412A1
Автор: Zai-Ming Qiu
Принадлежит: 3M Innovative Properties Co

A composite particle that includes: a fluorescent semiconductor core/shell nanoparticle (preferably, nanocrystal); and a thioether-substituted ligand.

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Номер записи: 31
29-01-2015 дата публикации

TWO-COMPONENT HOT-MELT ADHESIVE

Номер: US20150027634A1
Автор: Kohl Matthias, Proebster Manfred
Принадлежит:

A moisture-curing two-component composition consisting of a component A containing at least one polyoxyalkylene, polyolefin and/or polyacrylate prepolymer having at least one hydrolysable silane group and at least one solid inert additive selected from hydrocarbons, polyesters or polyamides, a component B containing at least one crosslinking compound for the prepolymers, and auxiliary substances and additives in one or both components, the component A and the two-component composition each having hot-melt adhesive properties. 1. A moisture-curing two-component composition consisting of a component A containing at least one polyoxyalkylene , polyolefin and/or polyacrylate prepolymer having at least one hydrolysable silane group and at least one solid inert additive selected from hydrocarbons , polyesters or polyamides , and a component B containing at least one crosslinking compound for the prepolymer , the two-component composition and component A each having hot-melt adhesive properties.2. The two-component composition according to claim 1 , characterized in that component A can be melted at 70 to 180° C. and component B has a viscosity of 20 claim 1 ,000 to 800 claim 1 ,000 mPas at 25° C.3. The two-component composition according to claim 1 , characterized in that component B contains water and/or silane-crosslinkable compounds as the crosslinking compound.4. The two-component composition according to claim 1 , characterized in that the inert additive has a softening point of 40 to 150° C.5. The two-component composition according to claim 1 , characterized in that component B contains up to 15 wt. % of water and/or up to 30 wt. % of silane-crosslinkable compounds.6. The two-component composition according to claim 1 , characterized in that the composition contains resins claim 1 , plasticizers claim 1 , stabilizers claim 1 , water-dissolving or water-absorbing substances claim 1 , pigments or fillers claim 1 , thickening agents and/or catalysts.8. A method for ...

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Номер записи: 32
29-01-2015 дата публикации

BREATHABLE SELF-ADHESIVE ARTICLES

Номер: US20150030848A1
Автор: Goubard David
Принадлежит: BOSTIK SA

The invention relates to the use of an adhesive composition comprising at least one silyl-containing polymer, at least one compatible tackifying resin and at least one catalyst, to make a breathable self-adhesive article. The invention also relates to a breathable self-adhesive article comprising at least one breathable substrate coated with a breathable adhesive layer. The invention also relates to a pressure-sensitive adhesive composition. 1. Method for making a breathable self-adhesive article , comprising a step of using an adhesive composition comprising at least one silyl-containing polymer , at least one compatible tackifying resin and at least one catalyst.2. Method according to claim 1 , wherein the adhesive article comprises a substrate and an adhesive layer.3. Method according to claim 1 , wherein the adhesive composition comprises:a) from 20 to 85% by weight of at least one silyl-containing polymer,b) from 15 to 80% by weight of at least one tackifying resin,c) from 0.01 to 3% by weight of at least one catalyst.4. Method according to claim 1 , wherein the tackifying resin has a Softening Point inferior or equal to 150° C.5. Method according to claim 1 , wherein the silyl-containing polymer is selected from a silyl-containing polyether claim 1 , a silyl-containing polyurethane claim 1 , a silyl-containing polyurethane having polyurethane-polyether and polyurethane-polyester blocks claim 1 , and mixtures thereof.6. Method according to claim 1 , wherein the tackifying resin is selected from phenol modified terpene resins claim 1 , hydrocarbon resins claim 1 , rosin ester resins claim 1 , acrylic resins and mixtures thereof.7. Method according to claim 1 , wherein the adhesive layer having a coating weight below 50 g/mhas a Moisture-Vapour Transmission Rate superior or equal to 300 g/m/24 h.8. Method according to claim 1 , wherein the adhesive layer having a coating weight below or equal to 30 g/mhas a Moisture-Vapour Transmission Rate superior or equal to ...

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Номер записи: 33
02-02-2017 дата публикации

Polyamide compositions for sealants and high solids paints

Номер: US20170029565A1
Автор: Carlos Feito, Elke Piron, James Heck, Wouter Ijdo, Yanhui Chen
Принадлежит: Elementis Specialties Inc

A polyamide composition for use in sealants, adhesives and high solids coatings.

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Номер записи: 34
04-02-2016 дата публикации

BONDING ADHESIVE AND ADHERED ROOFING SYSTEMS PREPARED USING THE SAME

Номер: US20160032158A1
Автор: Carr Joseph, Tang Jiansheng
Принадлежит: Firestone Building Products Co., LLC

A bond adhesive composition comprising a polymer having a silicon-containing hydrolyzable terminal group and a hydrocarbon resin, where the composition is substantially devoid of phenolic resin. 1. A bond adhesive composition comprising:i. a polymer having a silicon-containing hydrolyzable terminal group; and 'wherein the composition further includes a plasticizer.', 'ii. a hydrocarbon resin, where the composition is substantially devoid of phenolic resin,'}2. The composition of claim 1 , where the composition further includes an adhesion promoter.3. The composition of claim 1 , where the composition further includes a catalyst.4. The composition of claim 1 , where the composition further includes a moisture scavenger.5. The composition of claim 1 , where the composition further includes a thixotropic compound.6. The composition of claim 1 , where the polymer having a silicon-containing hydrolyzable terminal group is a silane-terminated polymer.7. (canceled)8. The composition of claim 1 , where the adhesive composition has a dynamic viscosity of less than 20 claim 1 ,000 cPs by using a Brookfield viscometer equipped with a #6 spindle operating at room temperature and 10 rpm.9. The composition of claim 1 , where the adhesive composition has a dynamic viscosity of less than 15 claim 1 ,000 cPs by using a Brookfield viscometer equipped with a #6 spindle operating at room temperature and 10 rpm.10. A method for forming an adhered membrane roof system claim 1 , the method comprising:i. applying a bond adhesive to a substrate on a roof to form an adhesive layer, where the bond adhesive includes a polymer having a silicon-containing hydrolyzable terminal group and a hydrocarbon resin devoid of phenolic resin; andii. applying a membrane directly to the adhesive layer.11. The method of claim 10 , where the adhesive forms a substantially continuous layer between the substrate and the membrane over at least 40% of the entire roof surface.12. The method of claim 10 , where the ...

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Номер записи: 35
04-02-2016 дата публикации

Moisture-curable reactive hot-melt adhesive agent composition

Номер: US20160032159A1
Автор: Nobuyoshi Maizuru, Toyohisa Fujimoto
Принадлежит: Kaneka Corp

The present invention aims to provide a moisture-curable reactive hot-melt adhesive composition which contains no vinyl chloride resin, which is excellent in adhesion to oily steel sheets and electroplated steel sheets, which has high strength immediately after application to effectively improve the production cycle, and which can be suitably used in vehicle applications. This challenge is solved by a moisture-curable reactive hot-melt adhesive that includes an oxyalkylene polymer containing a reactive silyl group, an alkyl (meth)acrylate (co)polymer, a tackifying resin, and a specific inorganic filler in combination.

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Номер записи: 36
31-01-2019 дата публикации

Pressure-sensitive adhesive composition for optical film, pressure-sensitive adhesive layer for optical film, pressure-sensitive adhesive optical film and image display

Номер: US20190031815A1
Автор: Akiko SUGINO, Arata Fujihara, Atsushi Yasui, Masayuki Satake, Mizue Nagata, Tomoyuki Kimura, Yuusuke Toyama
Принадлежит: Nitto Denko Corp

A pressure-sensitive adhesive composition for an optical film of the present invention comprises a (meth)acryl-based polymer(A): and a polyether compound (B) having a polyether skeleton and a reactive silyl group represented by formula (1): —SiRaM3-a at at least one terminal, wherein R represents a monovalent organic group having 1 to 20 carbon atoms and optionally having a substituent; M represents a hydroxyl group or a hydrolyzable group; and <a> represents an integer of 1 to 3, provided that in cases where two or more R groups, R groups is the same or different, and in cases where two or more M groups, M groups is the same or different. The pressure-sensitive adhesive composition for an optical film is capable of forming a pressure-sensitive adhesive layer having reworkability that enables an optical film to be easily peeled off from a liquid crystal panel or the like with no adhesive residue and satisfactory durability that prevents a bonded optical film from peeling or lifting.

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Номер записи: 37
24-02-2022 дата публикации

Method for preparing reactive sealant resin

Номер: US20220056209A1
Автор: Bin Liu, Changxun JU, Mingyong Wang, Tian Ye, Weiqi Hua, YUAN Li, Zhengyang SHI
Принадлежит: Wanhua Chemical Group Co Ltd, Wanhua Chemical Ningbo Co Ltd

Disclosed by the present invention is a method for preparing a reactive sealant resin, the method comprising: (1) under the action of an alkali catalyst, polymerizing a hydroxyl-containing initiator with an epoxy compound to obtain a polyether polyol; (2) adding an alkoxide reagent and a halogenated end-capping agent containing a double bond to the polyether polyol obtained in step (1) for reaction, so as to obtain a crude double-bonded polyether product, and refining the crude product to obtain a modified polyether product; and (3) subjecting the modified polyether and hydrogen-containing silane to silane end-capping reaction under the action of a hydrosilylation catalyst, so as to obtain the target product, i.e., a reactive sealant resin. The resin has excellent properties as well as good adhesion and paintability.

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Номер записи: 38
16-02-2017 дата публикации

POLYMER HAVING TERMINAL STRUCTURE INCLUDING PLURALITY OF REACTIVE SILICON GROUPS, METHOD FOR MANUFACTURING SAME, AND USE FOR SAME

Номер: US20170044314A1
Автор: Harumashi Tatsuro, Odaka Hidetoshi, Taniguchi Akio, Wakabayashi Katsuyu
Принадлежит: KANEKA CORPORATION

A polymer (A) having, at one terminal moiety thereof, a terminal structure having two or more carbon-carbon unsaturated bonds. A reactive-silicon-group-containing polymer (B) having, at one terminal moiety thereof, a terminal structure having two or more reactive silicon groups. 1. A polymer (A) having , at one terminal moiety thereof , a terminal structure having two or more carbon-carbon unsaturated bonds.3. The polymer (A) according to claim 1 , wherein a hydroxyl group or hydroxyl groups contained are 0.3 or less in number on average per molecule of the polymer (A).4. The polymer (A) according to claim 1 , having a main skeleton which is a polyoxyalkylene polymer.5. A method for manufacturing the polymer (A) recited in claim 1 , comprising: causing an alkali metal salt to act onto a polymer having claim 1 , at a terminal thereof claim 1 , a hydroxyl group in an amount of 0.6 equivalent or more relative to the hydroxyl group amount in the polymer; causing the resultant to react with an epoxy compound having a carbon-carbon unsaturated bond; and further causing the resultant to react with a halogenated hydrocarbon compound having a carbon-carbon unsaturated bond.6. The method for manufacturing the polymer (A) according to claim 5 , wherein the alkali metal salt is a sodium alkoxide claim 5 , the epoxy compound claim 5 , which has a carbon-carbon unsaturated bond claim 5 , is allyl glycidyl ether or methallyl glycidyl ether claim 5 , and the halogenated hydrocarbon compound claim 5 , which has a carbon-carbon unsaturated bond claim 5 , is allyl chloride or methallyl chloride.7. A curing composition claim 1 , comprising the polymer (A) recited in . This application is a Division of U.S. application Ser. No. 14/404,112 filed Nov. 26, 2014 which is a 371 National Stage of International Application No. PCT/JP2013/064982 filed May 30, 2013, which claims priority to Japanese Patent Application Nos. 2012-124290 and 2012-124291 filed May 31, 2012. The entire contents of ...

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Номер записи: 39
16-02-2017 дата публикации

PRINTED WIRING BOARD

Номер: US20170048968A1
Автор: KOMATSU Naomi
Принадлежит: FUJIKURA LTD.

A printed wiring board is provided which comprises a first insulating substrate () composed of a liquid crystal polymer, a first signal line () formed on one main surface () of the first insulating substrate (), a second insulating substrate () composed of a liquid crystal polymer, a second signal line () formed on one main surface () of the second insulating substrate () and along the extending direction of the first signal line (), and an adhesion layer () composed of a modified polyphenylene ether for adhesion between the one main surface () of the first insulating substrate () and the one main surface () of the second insulating substrate (). When frequencies of signals transmitted by the first signal line and the second signal line are 2.5 GHz or more and 5.0 GHz or less, an offset amount is longer than a circuit width (L) of the first signal line () and 130 μm or more and 300 μm or less. The offset amount is a distance from the position of one end of the first signal line () among ends along the width direction to the position of one end of the second signal line () among ends along the width direction. 1. A printed wiring board comprising:a first insulating substrate composed of a liquid crystal polymer;a first signal line formed on one main surface of the first insulating substrate;a second insulating substrate composed of a liquid crystal polymer;a second signal line formed on one main surface of the second insulating substrate and along an extending direction of the first signal line; andan adhesion layer composed of a modified polyphenylene ether for adhesion between the one main surface of the first insulating substrate and the one main surface of the second insulating substrate,wherein, when frequencies of signals transmitted by the first signal line and the second signal line are 2.5 GHz or more and 5.0 GHz or less, an offset amount is longer than a circuit width of the first signal line and 130 μm or more and 300 μm or less, wherein the offset amount ...

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Номер записи: 40
14-02-2019 дата публикации

Crosslinkable materials based on organyl oxysilane-terminated polymers

Номер: US20190048190A1
Автор: Lars Zander, Volker Stanjek
Принадлежит: Wacker Chemie AG

Moisture curing alkoxysilyl-functional polymer compositions containing a high phenyl-content silicone resin and carbon black exhibit high adhesion to substrates, high tensile strength, very high elongation, and high tear strength without becoming unduly hard.

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Номер записи: 41
25-02-2016 дата публикации

ALKOXYSILYL-CONTAINING ADHESIVE SEALANTS WITH INTRINSICALLY REDUCED VISCOSITY

Номер: US20160053145A1
Автор: Ferenz Michael, Lewin Anke, Lobert Matthias, SCHUBERT Frank
Принадлежит: EVONIK DEGUSSA GmbH

The present invention provides specific alkoxylation products, a process for preparing them, compositions which comprise these alkoxylation products, and the use thereof. 2. The alkoxylation product according to claim 1 , wherein the index x of the formulae (Ia) and (II) is in total greater than or equal to 2 claim 1 , preferably greater than or equal to 3 claim 1 , and b is preferably in total greater than or equal to 0 claim 1 , and Ris preferably a branched alkyl chain having 4 to 20 carbon atoms.3. The alkoxylation product according to claim 1 , wherein the indices of the formula (I) k and l=0 claim 1 , j=0 to 2 claim 1 , i=2 claim 1 , u=j+1 and v=0 claim 1 , and the indices of the formulae (Ia) and (II) x is in total greater than or equal to 2 and b is in total 2 to 300.4. The alkoxylation product according to claim 1 , where in formula (I)i=2 to 10,j=0 to 6,k=0 to 2,l=0 to 2,u=(1*j)+(2*k)+(3*1)+1,v=0,where M corresponds to formula (Ia) witha=0 to 6,b=12 to 500,c=0 to 4,d=0,w=0,x=0 to 10,y=0,e=1 to 10,f=0 to 2,g=1 to 3,with the proviso that g+f=3h=1, 2 or 3, andwhere for formula (II):a=1 to 10,b=10 to 700,c=0 to 2,d=0,w=0,x=1 to 10,y=0,e=1 to 10,f=0 to 2,g=1 to 3,with the proviso that g+f=3,h=1, 2or 3,and where for formula (Ia) and formula (II):{'sup': '2', 'R=independently at each occurrence a methyl or ethyl, propyl or isopropyl group,'}{'sup': '3', 'R=independently at each occurrence a methyl or ethyl, propyl or isopropyl group,'}{'sup': '4', 'R=independently at each occurrence hydrogen, methyl or ethyl, especially preferably hydrogen,'}{'sup': '5', 'R=more preferably hydrogen or a methyl or ethyl group,'}{'sup': '11', 'sub': 12', '14, 'R=independently at each occurrence methyl, ethyl, butyl, hexyl, octyl, C/Calkyl, phenyl, cresyl or benzyl group;'}{'sup': '12', 'sub': 2', '5', '3', '3, 'R=independently at each occurrence an optionally substituted alkyl chain having at least one branched structural element and having 4 to 20 carbon atoms, preferably having 5 ...

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Номер записи: 42
25-02-2021 дата публикации

Heat-curable resin composition, and adhesive agent, film, prepreg, laminate, circuit board and printed-wiring board using same

Номер: US20210054152A1
Автор: Atsushi Tsuura, Hiroyuki Iguchi, Naoyuki Kushihara, Yoshihiro Tsutsumi, Yuki Kudo
Принадлежит: Shin Etsu Chemical Co Ltd

Provided are a heat-curable resin composition capable of being turned into a cured product having a high glass-transition temperature, a low dielectric tangent and a superior adhesion to a metal foil; and an adhesive agent, film, prepreg, laminate, circuit board as well as printed-wiring board using such heat-curable resin composition. The heat-curable resin composition contains: (A) a polyphenylene ether resin having reactive double bonds at molecular chain ends; (B) a (meth)acrylic acid ester compound; (C) a cyclic imide compound containing, in one molecule, at least one dimer acid backbone, at least one linear alkylene group having not less than 6 carbon atoms, and at least two cyclic imide groups; and (D) a reaction initiator.

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Номер записи: 43
23-02-2017 дата публикации

TIRE COMPRISING A STRIP OF DAMPING FOAM

Номер: US20170050474A1
Автор: LAUBRY PHILIPPE
Принадлежит:

Tyre comprising an inner liner facing an internal cavity of the tyre, an adhesive layer positioned on the inner liner and a strip of noise-damping foam attached to the inner liner by the adhesive layer, characterized in that the adhesive layer is based on a silanized polyether. 114-. (canceled)15. A tire comprising:an inner liner facing an internal cavity of the tire;an adhesive layer positioned on said inner liner; anda strip of noise-damping foam attached to said inner liner by said adhesive layer, wherein the adhesive layer is based on a silanized polyether.1605. The tire according to claim , wherein the silanized polyether is an alkoxysilane-functional telechelic polyether.17. The tire according to claim 16 , wherein the alkoxysilane is methyldimethoxysilane.18. The tire according to claim 15 , wherein the polyether is a polyoxypropylene.19. The tire according to claim 15 , wherein the foam of the damping foam strip is an open-cell polyurethane foam.20. The tire according to claim 15 , wherein the strip is a circumferentially continuous strip.21. A method of attaching a strip of noise-damping foam to the surface of an inner liner of a new tire comprising the steps of:applying a layer of adhesive based on silanized polyether to a surface of the inner liner, to a radially outer surface of the foam strip or to both the surface of the inner liner and the radially outer surface of the foam strip;positioning the foam strip against the surface of the inner liner; andleaving the layer of adhesive to crosslink.22. The method according to further comprising the steps of:treating the surface of the inner liner of said tire with a high-pressure water jet in order to clean said surface;drying the surface of the inner liner; andattaching the strip of noise-damping foam to the surface of the inner liner of the tire.23. The method according to claim 21 , wherein the silanized polyether is an alkoxysilane-functional telechelic polyether.24. The method according to claim 21 , ...

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Номер записи: 44
23-02-2017 дата публикации

POLYMER HAVING TERMINAL STRUCTURE INCLUDING PLURALITY OF REACTIVE SILICON GROUPS, METHOD FOR MANUFACTURING SAME, AND USE FOR SAME

Номер: US20170051108A1
Автор: Harumashi Tatsuro, Odaka Hidetoshi, Taniguchi Akio, Wakabayashi Katsuyu
Принадлежит: KANEKA CORPORATION

A polymer (A) having, at one terminal moiety thereof, a terminal structure having two or more carbon-carbon unsaturated bonds. A reactive-silicon-group-containing polymer (B) having, at one terminal moiety thereof, a terminal structure having two or more reactive silicon groups. 2. The curable composition according to claim 1 , comprising claim 1 , as the polymer (B) claim 1 , a reactive-silicon-group-containing polymer (B1) in which a main chain skeleton is a polyoxyalkylene polymer claim 1 , and further comprising a (meth)acrylate polymer (C) having one or more reactive silicon groups.4. The curable composition according to claim 2 , comprising claim 2 , as the polymer (B1) claim 2 , a polyoxyalkylene polymer having both species of one or more reactive silicon groups (b2) which is/are (each) represented by the general formula (4) in which a is 2 claim 2 , and one or more reactive silicon groups (b3) which is/are (each) represented by the general formula (4) in which a is 3; and/or a polyoxyalkylene polymer having the reactive silicon group(s) (b2) and a polyoxyalkylene polymer having the reactive silicon group(s) (b3).5. The curable composition according to claim 4 , wherein the reactive silicon group(s) (b2) is/are (each) a methyldimethoxysilyl group claim 4 , and the reactive silicon group(s) (b3) is/are (each) a trimethoxysilyl group.6. The curable composition according to claim 3 , wherein the polymer (C) has trimethoxysilyl groups which are 1.27 or more in number on average per molecule of the polymer (C).7. The curable composition according to claim 1 , further comprising a polymer (D) having a reactive silicon group or reactive silicon groups which are 0.5 or more and less than 1.2 in number on average per molecule of the polymer (D).8. The curable composition according to claim 7 , wherein the polymer (B) has a number-average molecular weight of 10000 or more and less than 35000 claim 7 , and the polymer (D) has a number-average molecular weight of 3000 or ...

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Номер записи: 45
23-02-2017 дата публикации

FIBER OPTIC CONNECTOR SUB-ASSEMBLIES AND RELATED METHODS

Номер: US20170052328A1
Автор: Baca Adra Smith, Burt Rebecca Lynn, Danley Jeffrey Dean, Miller Darrin Max, Morrison Dennis Craig
Принадлежит:

A fiber optic connector sub-assembly includes a ferrule having a front end, a rear end, and a ferrule bore extending between the front and rear ends along a longitudinal axis. The fiber optic connector sub-assembly also includes a bonding agent disposed in the ferrule bore and having first and second ends along the longitudinal axis. The bonding agent has been melted and solidified at the first and second ends. 1. A fiber optic connector sub-assembly , comprising:a ferrule having a front end, a rear end, and a ferrule bore extending between the front and rear ends along a longitudinal axis; anda bonding agent disposed in the ferrule bore and having first and second ends along the longitudinal axis, wherein the bonding agent has been melted and solidified at the first and second ends.2. The fiber optic connector sub-assembly of claim 1 , wherein the at least a portion of the bonding agent between the first and second ends has not been melted and solidified.3. The fiber optic connector sub-assembly of claim 2 , wherein the at least a portion of the bonding agent between the first and second ends has not been melted and solidified comprises a powdered material.4. The fiber optic connector sub-assembly of claim 3 , wherein the powdered material comprises particles of the bonding agent claim 3 , the particles having an average size between about 5% and about 10% of a minimum diameter of the ferrule bore.5. The fiber optic connector sub-assembly of claim 2 , wherein the bonding agent that has been melted and solidified has a density between about 1.0 g/cc and about 1.5 g/cc claim 2 , and further wherein the at least a portion of the bonding agent between the first and second ends that has not been melted and solidified has a bulk density that is less than 1.0 g/cc.6. The fiber optic connector sub-assembly of claim 2 , wherein the bonding agent that has been melted and solidified has a density between about 1.3 g/cc and about 1.4 g/cc claim 2 , and further wherein the at ...

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Номер записи: 46
20-02-2020 дата публикации

Silane Modified Polymers With Improved Properties

Номер: US20200055984A1
Автор: Eodice Andrea Keys, Klein Johann, Meckel-Jonas Claudia, Suen Wu
Принадлежит:

The disclosure relates to moisture curable compositions based on a combination of silane-modified polymer and silane functional additive, their manufacture and use. The silane functional additive is preferably prepared from a water miscible polyol having a functionality of about 2 to about 4 and/or a polyol having a tertiary nitrogen atom in the backbone and a functionality equal or greater than about 2. 1. A moisture curable composition comprising a physical blend of: [{'br': None, 'sub': n', 'I, 'B(-A-R—SiXYZ)\u2003\u2003(I).'}, 'wherein B is an organic backbone and B will not be a siloxane backbone,', {'sup': '1', 'A is a divalent linking group linking the polymer backbone to the Rgroup,'}, 'I is an integer from 1 to 6,', 'n is 0 or 1,', {'sub': 1', '12, 'R is a divalent C-Chydrocarbon group that optionally comprises a heteroatom,'}, 'at least one of X, Y and Z is a hydrolysable group;, 'a moisture curable, silane modified polymer of structure (I)'}a moisture curable, silane functional additive that is the reaction product of a mixture comprising an isocyanotosilane and a polyol selected from a polyol having a linear ethylene oxide backbone and a functionality of 2 to 4, a polyol comprising at least one nitrogen atom in the backbone and a functionality equal or greater than 2 and combinations thereof, wherein the polyol is free of groups pendant from the backbone and propylene oxide; anda crosslinker;wherein cured reaction products of the moisture curable composition have greater strength and greater elongation compared to the moisture curable composition without the moisture curable, silane functional additive.2. The moisture curable composition of wherein B is selected from polyurethane claim 1 , polyether or polycarbonate.3. The moisture curable composition of wherein the polyol is water miscible.4. The moisture curable composition of wherein A is selected from amide claim 1 , carbamate claim 1 , urea claim 1 , allophanate claim 1 , biuret claim 1 , ...

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Номер записи: 47
04-03-2021 дата публикации

Nanofibrillated Cellulose Ply Bonding Agent or Adhesive and Multi-Ply Absorbent Sheet Made Therewith

Номер: US20210062430A1
Автор: Sumnicht Daniel W., Vaijapurkar Siddharth S., Yu Zhiying
Принадлежит:

A ply-bonding agent or adhesive composition characterized by a viscosity and a surface tension for the manufacture of paper tissue and paper towel, includes: (a) water; (b) nanofibrillated cellulose; and (c) one or more modifiers effective to modify either or both of (i) the viscosity of the composition or (ii) the surface tension of the composition, wherein the one or more additional modifiers are selected from the group consisting of components (iii), (iv), (v), (vi), (vii) or (viii), wherein: (iii) is PVOH and a viscosity modifier; (iv) is a viscosity modifier; (v) is a viscosity modifier and a surface tension modifier other than PVOH; (vi) is a water-soluble cellulose derivative; (vii) is a water soluble polyol; and (viii) is a surface tension modifier other than PVOH. The compositions are particularly useful for ply-bonding multi-ply absorbent sheet when the plies are treated with debonder. 2. The method of making multi-ply absorbent sheet according to claim 1 , wherein the ply-bonding agent or adhesive contains 90 wt. % or more water.3. The method of making multi-ply absorbent sheet according to claim 1 , wherein at least one of said first absorbent cellulosic basesheet or said second absorbent cellulosic basesheet is treated with a debonder composition.4. The method of making multi-ply absorbent sheet according to claim 3 , wherein at least one of the first absorbent cellulosic basesheet or the second cellulosic basesheet are treated with debonder composition in an amount of from 1 lb of debonder composition per ton of cellulosic papermaking fiber used to make the basesheet to 16 lbs of debonder composition per ton of papermaking fiber used to make the basesheet.5. The method of making a multi-ply absorbent sheet according to claim 4 , wherein at least one of the first absorbent cellulosic basesheet or the second cellulosic basesheet are treated with debonder composition in an amount of from 2 lbs of debonder composition per ton of cellulosic papermaking ...

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Номер записи: 48
17-03-2022 дата публикации

Photothermal adhesive composition containing graphene-copper sulfide composite, manufacturing method therefor, and method for fabrication of microfluidic chip using same

Номер: US20220080411A1
Автор: Bong Geun Chung, Hyung Woo Choi, Jae Hyun Lim, Jong Min Lee, Young Jae Kim
Принадлежит: SOGANG UNIVERSITY RESEARCH FOUNDATION

Disclosed herein is a technique for bonding chips made of plastic materials by taking advantage of a photothermal effect of a graphene-copper sulfide composite. Using a photothermal adhesive composition containing the composite, microfluidic chips that pass fluids therethrough with neither leakage nor deformation can be effectively fabricated.

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Номер записи: 49
28-02-2019 дата публикации

Urethane acrylate hybrid structure adhesives

Номер: US20190062612A1
Автор: Jianxia Chen
Принадлежит: HERCULES LLC

A polymerizable adhesive composition comprising a two-part hybrid polymerizable adhesive composition is disclosed. In particular, the polymerizable adhesive composition comprises an organoborane monoamine complex, a free polyol comprising a dimer fatty polyol and a polyether polyol, at least one free radically polymerizable component, an isocyanate-terminated urethane pre-polymer, a free isocyanate and a low molecular weight chain extending compound. Also disclosed is methods of making and using a hybrid adhesive obtained from polymerization of the polymerizable adhesive composition

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Номер записи: 50
09-03-2017 дата публикации

CONDUCTIVE ADHESIVE COMPOSITION, METHOD FOR PRODUCING THE SAME, SEALANT AND DISPLAY PANEL

Номер: US20170066945A1
Автор: QIN Yifeng, ZHOU Yongshan
Принадлежит:

The embodiments of the present disclosure relate to the field of display technologies and provide a conductive adhesive composition, a method for producing the same, a sealant and a display panel, so as to improve the dispersion evenness of conductive particles in the adhesive and ensure excellent conductivity of the conductive adhesive composition, as well as avoid influencing the normal throughput of the adhesive during coating when the doping percentage of conductive particles is high. The conductive adhesive composition comprises: a primary adhesive material; and carrier granules dispersed in the primary adhesive material and having conductive particles adsorbed thereon. The present disclosure is applicable to manufacture a conductive adhesive composition as well as a sealant and a display panel comprising the conductive adhesive composition. 1. A conductive adhesive composition , comprising:a primary adhesive material; andcarrier granules dispersed in the primary adhesive material and having conductive particles adsorbed thereon.2. The conductive adhesive composition according to claim 1 , wherein the carrier granules comprise on their surfaces first functional groups which are organophilic.3. The conductive adhesive composition according to claim 2 , whereinthe primary adhesive material is composed of a resin material; andthe first functional groups comprise at least one of amino, mercapto, vinyl, epoxy, cyano and methacryloyloxy.4. The conductive adhesive composition according to claim 1 , wherein the carrier granules comprise on their surfaces second functional groups carrying positive charges or negative charges.5. The conductive adhesive composition according to claim 1 , wherein the conductive particles are made of at least one material of gold claim 1 , silver claim 1 , copper claim 1 , aluminum claim 1 , nickel and tin.6. The conductive adhesive composition according to claim 1 , wherein the conductive particles are spherical.7. The conductive adhesive ...

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Номер записи: 51
09-03-2017 дата публикации

FASTENING MEANS

Номер: US20170066948A1
Автор: Ortwein Angelika
Принадлежит: ORTWEIN GmbH

A fastening system for fixing an object on a base includes a first receptacle storing an aerobic adhesive and includes an associated first withdrawal device. A second receptacle, separate from the first receptacle, stores a free-flowing substance and includes an associated second withdrawal device. The first withdrawal device is configured to generate an aerobic adhesive layer with a height profile on the base. The second withdrawal device is configured to generate a surface layer of the free-flowing substance on the layer of aerobic adhesive with height profile to form a layer, whereby volumetric incorporations or inclusions of the free-flowing substance are formed in the aerobic adhesive when the object is pressed onto the layer structure. 1. (canceled)2. The fastening system according to claim 13 , wherein the first withdrawal device comprises a notched spatula.3. The fastening system according to claim 13 , wherein the first withdrawal device forms a single structural unit together with the first receptacle.4. The fastening system according to claim 13 , wherein the aerobic adhesive comprises polymers.5. The fastening system according to claim 13 , wherein the free-flowing substance comprise a hydrophilic substance or a hygroscopic substance.6. The fastening system according to claim 13 , wherein the free-flowing substance is comprises a liquid.7. The fastening system according to claim 6 , wherein the free-flowing substance comprises at least one of polyethylene glycol claim 6 , polypropylene glycol claim 6 , an oxygen solution claim 6 , and an alcohol claim 6 , mixed with water.8. The fastening system according to claim 6 , wherein the free-flowing substance comprises water.9. The fastening system according to claim 6 , wherein the second withdrawal device includes a spray head and the liquid is stored in the spray head.10. The fastening system according to claim 13 , wherein the second withdrawal device and the second receptacle comprise a single structural ...

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Номер записи: 52
26-03-2015 дата публикации

CURABLE COMPOSITE MANUFACTURING ADHESIVE

Номер: US20150083321A1
Автор: Yuodelis Robert R.
Принадлежит:

A curable adhesive that is modified to allow spray application and polymerization seamlessly during the process of epoxy resin vacuum infusion. 1. An improved composite manufacturing vacuum infusion process , comprising:preparing a laminate structure, said laminate structure further comprising,a core layer having a first and a second surface;a cross-linking adhesive applied to at least one of said surfaces;and a reinforcing layer in contact with said at least one of said surface containing said adhesive, wherein said adhesive is further comprises a melamine resin and a tack enhancing substance;placing said laminate structure within a vacuum bag;drawing a vacuum on said vacuum bag with a vacuum source;driving a liquid epoxy infusion resin into said vacuum bag, infusing said laminate structure; andcuring said liquid epoxy infusion resin to form a matrix comprising of said adhesive, cross-linked and hardened together with said liquid epoxy infusion resin as an integrated structure.2. The process of claim 1 , wherein said liquid epoxy infusion resin is bisphenol A/epichlorohydrin.3. The process of claim 1 , wherein said cross-linking is free-radical initiated.4. The process of claim 1 , further comprising the preliminary step of dissolving said adhesive in an acetone carrier.5. The process of claim 1 , further comprising the step of initiating a catalyst system for said liquid epoxy infusion resin before driving said infusion resin into said vacuum bag.6. A cross-linking adhesive composition comprising:Melamine resin; and tackifier, wherein said adhesive is dissolved in an organic ketone.7. The adhesive of claim 6 , wherein said melamine resin is hexa(methoxymethyl) melamine.8. The adhesive of claim 6 , further comprising one or more adducts.9. The adhesive of claim 6 , wherein said organic ketone is acetone.10. The adhesive of claim 8 , wherein said melamine resin has a carboxyl terminated butadiene nitrile adduct.11. The adhesive of claim 6 , wherein said tackifier is ...

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Номер записи: 53
12-06-2014 дата публикации

ADHESIVE COMPOSITION, ADHESIVE VARNISH, ADHESIVE FILM AND WIRING FILM

Номер: US20140158413A1
Автор: Aoyama Takashi, Komatsu Hiroaki, SASADA Kazuhiko, SHANAI Daisuke
Принадлежит: HITACHI METALS, LTD.

An adhesive composition includes (A) a phenoxy resin including a plurality of hydroxyl groups at a side chain: 100 parts by mass, (B) a multifunctional isocyanate compound including an isocyanate and at least one functional group selected from the group consisting of a vinyl group, an acrylate group and a methacrylate group within its molecule: 2 to 55 parts by mass, (C) a maleimide compound and/or a reaction product thereof having a plurality of maleimide groups within its molecule: 5 to 30 parts by mass, and (D) one or more kinds of an inorganic filler having an average particle size of 5 μm or less which is measured by a laser diffraction: 1 to 50 parts by mass, a total amount of the components (B) and (C) is 7 to 60 parts by mass. 1. An adhesive composition including:(A) a phenoxy resin including a plurality of hydroxyl groups at a side chain: 100 parts by mass;(B) a multifunctional isocyanate compound comprising an isocyanate and at least one functional group selected from the group consisting of a vinyl group, an acrylate group and a methacrylate group within its molecule: 2 to 55 parts by mass;(C) a maleimide compound and/or a reaction product thereof having a plurality of maleimide groups within its molecule: 5 to 30 parts by mass; and(D) one or more kinds of an inorganic filler having an average particle size of 5 μm or less which is measured by a laser diffraction: 1 to 50 parts by mass,wherein a total amount of the components (B) and (C) is 7 to 60 parts by mass.2. The adhesive composition according to claim 1 , further including:(E) an urethane-forming catalyst: 0.001 to 0.1 parts by mass; and(F) a radical polymerization inhibitor: 0.0002 to 1 parts by mass.3. The adhesive composition according to claim 1 , wherein the inorganic filler in the component (D) is an oxide claim 1 , a hydroxide claim 1 , a carbonate or a silicate which includes at least one element selected from the group consisting of magnesium claim 1 , aluminum claim 1 , silicon and ...

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Номер записи: 54
12-06-2014 дата публикации

ADHESIVE COMPOSITION, ADHESIVE TAPE AND ADHESION STRUCTURE

Номер: US20140162059A1
Автор: Deng Yunhai, He Chengyi, Wan Hongmei
Принадлежит: 3M INNOVATIVE PROPERTIES COMPANY

A halogen-free pressure-sensitive adhesive composition is provided, based on the total weight of the composition, comprising (A) 15-60 wt % of acrylic-based polymer, (B) 10-50 wt % of thermally conductive filler, and (C) 20-50 wt % of halogen-free flame retardant, based on 100% of the total weight of the composition, wherein the component (C) comprises: sub-component (C1) comprising at least one organophosphorous-based flame retardant; and sub-component (C2) comprising at least one flame retardant selected from the group consisting of nitrogen-containing compound-based flame retardants, graphite material-based flame retardants, melamine cyanurate-based flame retardants, metal hydroxide-based flame retardants, metal oxide-based flame retardants, metal phosphate-based flame retardants other than the organophosphorous-based flame retardants of (C1), and the composition has a P content no less than 4.0 wt %, based on 100 wt % of the total weight of the composition. A halogen-free pressure-sensitive adhesive tape and an adhesion structure are also provided. 1. A halogen-free pressure-sensitive adhesive composition , based on the total weight of the composition , comprising (A) 15˜60 wt % of acrylic-based polymer , (B) 10˜50 wt % of thermally conductive filler , and (C) 20˜50 wt % of halogen-free flame retardant , based on 100 wt % of the total weight of the composition , wherein the component (C) comprises: sub-component (C1) comprising at least one organophosphorous-based flame retardant; and sub-component (C2) comprising at least one flame retardant selected from the group consisting of nitrogen-containing compound-based flame retardants , graphite material-based flame retardants , melamine cyanurate-based flame retardants , metal hydroxide-based flame retardants , metal oxide-based flame retardants , metal phosphate-based flame retardants and metal borate-based flame retardants , and organophosphate-based flame retardants other than the organophosphorous-based flame ...

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Номер записи: 55
31-03-2022 дата публикации

TEMPORARY ADHESIVE, TEMPORARY ADHESIVE ASSEMBLY, AND METHOD OF PROCESSING SUBSTRATE

Номер: US20220098456A1
Автор: GAO Xiaoyi, JI Dongchen, WANG Yaosen
Принадлежит:

A temporary adhesive includes: a polar resin of 5 wt % to 50 wt %, a first solvent of 30 wt % to 90 wt %, and a second solvent of 5 wt % to 60 wt %, wherein the polar resin includes at least one selected from a group consisting of a phenoxy resin, a poly(ether-ether-ketone) resin, a polycarbonate resin, a modified epoxy resin, or a polyolefin resin with a modified polar group; the first solvent is used to dissolve the polar resin; and the second solvent is used to improve a leveling property of the temporary adhesive. 1. A temporary adhesive , comprising: a polar resin of 5 wt % to 50 wt % , a first solvent of 30 wt % to 90 wt % , and a second solvent of 5 wt % to 60 wt % ,wherein the polar resin comprises at least one selected from a group consisting of a phenoxy resin, a poly(ether-ether-ketone) resin, a polycarbonate resin, a modified epoxy resin, or a polyolefin resin with a modified polar group;the first solvent is used to dissolve the polar resin; andthe second solvent is used to improve a leveling property of the temporary adhesive.2. The temporary adhesive according to claim 1 , wherein the polar resin has a number average molecular weight of between 10 claim 1 ,000 and 100 claim 1 ,000 claim 1 , and a MWD of between 1 and 3.5.3. The temporary adhesive according to claim 1 , wherein the first solvent comprises at least one selected from a group consisting of an ester-based solvent claim 1 , a ketone-based solvent claim 1 , a sulfone-based solvent claim 1 , or an amide-based solvent.4. The temporary adhesive according to claim 3 , wherein the first solvent comprises at least one selected from a group consisting of ethyl 3-ethoxypropionate claim 3 , ethyl acetate claim 3 , n-butyl acetate claim 3 , ethyl lactate claim 3 , γ-butyrolactone claim 3 , methyl ethyl ketone claim 3 , methyl isobutyl ketone claim 3 , isophorone claim 3 , propylene glycol methyl ether acetate claim 3 , dimethyl sulfoxide claim 3 , dimethyl sulfone claim 3 , dimethylacetamide claim 3 , ...

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Номер записи: 56
31-03-2022 дата публикации

THERMOSETTING ADHESIVE AND ADHESIVE SHEET

Номер: US20220098458A1
Автор: TAKAHASHI Yoshiki, Tokunaga Risako
Принадлежит: NITTO SHINKO CORPORATION

Provided is a thermosetting adhesive including: a polyurethane; an isocyanate; an epoxy; and a phenoxy resin, in which dynamic viscoelasticity spectrum of a cured product has a peak indicating a softening temperature in an area of 200° C. or higher and has no peak in an area of 160° C. or lower. 1. A thermosetting adhesive comprising:an adhesive component, whereindynamic viscoelasticity spectrum of a cured product obtained by curing the thermosetting adhesive has a peak indicating a softening temperature in an area of 200° C. or higher and has no peak in an area of 160° C. or lower,the adhesive component comprises a polyurethane, an isocyanate, and an epoxy to form an epoxy-modified polyurethane, andthe adhesive component further comprises a phenoxy resin.2. The thermosetting adhesive according to claim 1 , wherein the dynamic viscoelasticity spectrum of the cured product obtained by curing the thermosetting adhesive has no peak in a range of above 160° C. to below the softening temperature.3. The thermosetting adhesive according to claim 1 , wherein the softening temperature of the phenoxy resin is 50° C. or more and 90° C. or less.4. The thermosetting adhesive according to claim 1 , further comprising claim 1 , in addition to the adhesive component claim 1 , a foaming agent component for causing the adhesive component into a foamed state claim 1 , whereinthe foaming agent component comprises thermally expandable microcapsules.5. The thermosetting adhesive according to claim 1 , whereinthe thermosetting adhesive when used to cause two steel plates to adhere to each other under conditions (1) to (4) below has a shear adhesive force at 150° C. of 15 MPa or more that is exerted between the steel plates, and has a shear adhesive force at 200° C. of 3.5 MPa or more:(1) 100° C.×6 hours,.(2) 110° C.×3 hours,(3) 150° C.×15 minutes, and(4) 180° C.×5 minutes.6. The thermosetting adhesive according to claim 1 , wherein the adhesive component further comprises an inorganic ...

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Номер записи: 57
12-03-2020 дата публикации

THERMOSETTING ADHESIVE FILMS

Номер: US20200079977A1
Автор: Awkal Michel, Czaplicki Michael, Miller Ira
Принадлежит:

Flexible films of thermosetting adhesive materials which are non-tacky to the touch are storage stable at room temperature and can be cured at elevated temperature with a short cure time and can be cured to produce a tough flexible adhesive layer including bonding to oily surfaces, the materials are particularly useful in bonding together dissimilar substrates. 1: An article comprising: a curable thermosetting epoxy resin based adhesive film which is flexible prior to cure and storage stable at room temperature , the adhesive film being derived from a mixture of:(a) an elastomer/epoxy resin adduct;(b) a core shell material; and(c) a curing agent.2: The article according to claim 1 , wherein the adhesive film is cured in no more than 45 minutes at a temperature no higher than 190° C.3: The article according to claim 1 , wherein the adhesive film forms an adhesive bond with oily surfaces and a shear strength of the adhesive film when bonded with the oily surfaces is 90% or more of a shear strength of the adhesive film when bonded to a similar surface free of oil.4: The article according to claim 2 , wherein the adhesive film is cured at a temperature in the range of 130° C. to 190° C.5: The article according to claim 1 , wherein the adhesive film is foamable and the adhesive film expands to a size at least 50% greater than a size of the adhesive film in an unfoamed state.6: The article according to claim 1 , wherein the adhesive film has an uncured thickness between 0.2 and 3.0 mm.79-. (canceled)10: The article according to claim 1 , wherein the adhesive film contains 5 to 40 wt % of the elastomer/epoxy resin adduct claim 1 , and 5 to 25 wt % of the core shell material.11: The article according to claim 1 , wherein the article is supported by a carrier.12: The article according to claim 11 , wherein the carrier is a fibrous carrier or fleece selected from: a woven mat claim 11 , a knit mat claim 11 , or a random mat; and wherein the fibrous carrier or fleece is ...

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Номер записи: 58
25-03-2021 дата публикации

THERMALLY CONDUCTIVE MOISTURE-CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF

Номер: US20210087442A1
Автор: Watanabe Kentaro
Принадлежит:

The purpose of the present invention is to provide a thermally conductive moisture-curable resin composition which develops excellent thermal conductivity and peelability after curing. 1. A thermally conductive moisture-curable resin composition comprising the following components (A) to (C):component (A): an organic polymer containing two or more hydrolyzable silyl groups;component (B): a thermally conductive filler; andcomponent (C) : a silicone compound having a polar group and/or a polar chain at a terminal or a side chain.2. The thermally conductive moisture-curable resin composition according to claim 1 , wherein the polar group of the component (C) is at least one or more selected from the group consisting of an amino group claim 1 , a silanol group claim 1 , a carbinol group and a carbonyl group claim 1 , andthe polar chain of the component (C) is at least one or more selected from the group consisting of a polyether chain, a polyester chain and a polythioether chain.3. The thermally conductive moisture-curable resin composition according to claim 1 , wherein the component (C) has a polar group and/or a polar chain at a terminal.4. The thermally conductive moisture-curable resin composition according to claim 1 , wherein an amount of the component (C) added is 1 to 50 parts by mass based on 100 parts by mass of the component (A).5. The thermally conductive moisture-curable resin composition according to claim 1 , wherein an amount of the component (B) added is 55 to 95 mass% based on a total of the composition.6. The thermally conductive moisture-curable resin composition according to claim 1 , wherein the component (B) is thermally conductive powder of at least one or more selected from the group consisting of alumina claim 1 , zinc oxide claim 1 , magnesium oxide claim 1 , aluminum nitride claim 1 , boron nitride claim 1 , carbon and diamond.7. The thermally conductive moisture-curable resin composition according to claim 1 , wherein a shape of the ...

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Номер записи: 59
12-03-2020 дата публикации

THERMOPLASTIC TEMPORARY ADHESIVE FOR SILICON HANDLER WITH INFRA-RED LASER WAFER DE-BONDING

Номер: US20200083082A1
Автор: Dang Bing, Gelorme Jeffrey D., Knickerbocker John U.
Принадлежит:

A bonding material including a phenoxy resin thermoplastic component, and a carbon black filler component. The carbon black filler component is present in an amount greater than 1 wt. %. The carbon black filler converts the phenoxy resin thermoplastic component from a material that transmits infra-red (IR) wavelengths to a material that absorbs a substantial portion of infra-red (IR) wavelengths. 1. A bonding material comprising:a phenoxy resin thermoplastic binder; anda carbon black filler component, wherein the carbon black filler converts the phenoxy resin thermoplastic component from a material that transmits infra-red (IR) wavelengths to a material that absorbs a portion of infra-red (IR) wavelengths, wherein the carbon black is comprised of agglomerates of carbon particles having a size as great as 100 microns.2. The bonding material of claim 1 , wherein the phenoxy resin thermoplastic binder comprises 2-(chloromethyl)oxirane; 4-[2-(4-hydroxyphenyl)propan-2-yl]phenol.3. The bonding material of claim 1 , wherein the bonding material being present between two semiconductor wafers.4. The bonding material of claim 1 , wherein the bonding material provides an adhesive layer for wafer bonding claim 1 , or a release layer for wafer de-bonding.5. The bonding material of claim 1 , wherein the IR wavelengths absorbed range from 700 nm to 1 mm.6. The bonding material of claim 1 , wherein the phenoxy resin is a linear polymer of epichloryhdrin and bisphenol A.7. The bonding material of claim 1 , wherein the phenoxy resin has a molecular weight rang of 10 claim 1 ,000 g/mole to 50 claim 1 ,0000 g/mole.8. The bonding material of claim 1 , wherein the carbon black filler is present in amounts as great as 15 wt. %.9. The bonding material of claim 1 , wherein the phenoxy resin thermoplastic binder comprises polyoxy(2-hydrozy-1 claim 1 ,3 propanediyl)oxy-1 claim 1 ,4-phenylene(1-methylethylidene)-1 claim 1 ,4-phenylene.10. The bonding material of claim 1 , wherein the carbon ...

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Номер записи: 60
29-03-2018 дата публикации

ELECTRICALLY CONDUCTIVE ADHESIVE AND ELECTRICALLY CONDUCTIVE MATERIAL

Номер: US20180086950A1
Автор: KUNIMUNE Teppei, KURAMOTO Masafumi
Принадлежит: NICHIA CORPORATION

Disclosed is an electrically conductive adhesive containing: (A) a polyether polymer having a backbone comprising a repeating unit of the formula: —R—O— wherein Ris a hydrocarbon group having 1 to 10 carbon atoms, and an end group which is a hydrolyzable silyl group, and (B) silver particles. Further disclosed is an electrically conductive material which is a hardened product of the electrically conductive adhesive. 3. The electrically conductive adhesive according to claim 2 , wherein the hydrolyzable group in the polyether polymer (A) is at least one group selected from a hydride group claim 2 , an alkoxy group claim 2 , a halogen group claim 2 , an acyloxy group claim 2 , a ketoxymate group claim 2 , an aminoxy group claim 2 , an amide group claim 2 , an amino group and a mercapto group.4. The electrically conductive adhesive according to claim 1 , which further comprises particles of another metal which is at least one selected from gold claim 1 , copper claim 1 , platinum claim 1 , palladium claim 1 , rhodium claim 1 , ruthenium claim 1 , iridium and osmium.5. The electrically conductive adhesive according to claim 1 , wherein the amount of particles of the other metal is at most 30% by weight claim 1 , based the total of the silver particles (B) and the other metal particles.6. The electrically conductive adhesive according to claim 1 , wherein the silver particles (B) are flake-shaped particles.7. The electrically conductive adhesive according to claim 1 , wherein the average particle diameter (median diameter) of the silver particles (B) is from 0.3 micrometers to 5 micrometers.8. The electrically conductive adhesive according to claim 1 , wherein the silver particles (B) are sintered after the hardening of the adhesive.9. The electrically conductive adhesive according to claim 1 , wherein the content of the silver particles (B) is 70% to 99% by weight claim 1 , based on the electrically conductive adhesive.10. The electrically conductive adhesive according ...

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Номер записи: 61
30-03-2017 дата публикации

MACHINE COMPONENT COMPOSED OF METAL AND RUBBER AND MANUFACTURING METHOD OF THE SAME

Номер: US20170089394A1
Автор: SATO Takahiko
Принадлежит: NAKANISHI METAL WORKS CO., LTD.

The present invention is intended to provide a machine component composed of metal and rubber that results in no increase of material costs for an adhesive or increase of manufacturing costs for metal molding, causes no contamination of the metal mold or generates no foreign matter on the metal mold due to adhesion of the adhesive at the time of molding, causes no failure by separation of the adhesive from a fitting portion at the time of fitting the metal component, and is clean and favorable in appearance. A machine component composed of metal and rubber is formed by applying a thermoset resin adhesive A to a surface of a metal component of a predetermined shape, and vulcanizing and adhering a rubber of a predetermined shape to part of the surface of the metal component by metal molding. 1. A machine component composed of metal and rubber that is formed by applying a thermoset resin adhesive to a surface of a metal component of a predetermined shape , and vulcanizing and adhering a rubber of a predetermined shape to part of the surface of the metal component by metal molding , whereinthe range of the adhesive applied to the surface of the metal component before the metal molding covers only a joint surface relative to the rubber.2. The machine component composed of metal and rubber according to claim 1 , whereinthe machine component composed of metal and rubber is a protective cover for a bearing device, anda seal as the rubber is vulcanized and adhered to the outer peripheral surface of a cup-shaped stainless-steel main body as the metal component.3. A manufacturing method of a machine component composed of metal and rubber claim 1 , comprising:an adhesive application step of applying a thermoset resin adhesive to a surface of a metal component of a predetermined shape; anda metal molding step of vulcanizing and adhering a rubber of a predetermined shape to part of the surface of the metal component, whereinat the adhesive application step, the adhesive is ...

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Номер записи: 62
05-05-2022 дата публикации

ADHESIVE FORMULATIONS INCLUDING AT LEAST ONE SILYL MODIFIED POLYMER

Номер: US20220135857A1
Автор: Xing Linlin, Yu Lingtao
Принадлежит:

Some embodiments of the present disclosure relate to an adhesive formulation comprising a high viscosity silyl modified polymer. In some embodiments, the adhesive formulation may further comprise additional components, such as but not limited to, at least one moisture scavenger, at least one adhesion promoter, at least one catalyst, at least one filler, at least one plasticizer, at least one antioxidant, or any combination thereof. In some embodiments, the adhesive formulation may exclude a low viscosity polymer. In some embodiments, the adhesive formulation may include a low viscosity polymer in no more than a specified amount. At least one method of using the adhesive formulation and at least one roofing system comprising the adhesive formulation are also described herein.

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Номер записи: 63
05-05-2022 дата публикации

Bonding film, tape for wafer processing, method for producing bonded body, and bonded body and pasted body

Номер: US20220139864A1
Автор: Hidemichi Fujiwara, Norzafriza Nitta, Yoshihiro Sato
Принадлежит: Furukawa Electric Co Ltd

A bonding film for bonding a semiconductor element and a substrate. The bonding film has an electroconductive bonding layer formed by molding an electroconductive paste including metal fine particles (P) into a film form, and a tack layer having tackiness and laminated on the electroconductive bonding layer. The tack layer includes 0.1% to 1.0% by mass of metal fine particles (M) with respect to the metal fine particles (P) in the electroconductive bonding layer, and the metal fine particles (M) have a melting point of 250° C. or lower.

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Номер записи: 64
07-04-2016 дата публикации

Rubber Composition Adhesive to Metal Surface, Laminated Body of Rubber Composition and Metal, Vulcanized Rubber Product, and Method of Producing Vulcanized Rubber Product

Номер: US20160096981A1
Автор: Miyamoto Tomoaki
Принадлежит: THE YOKOHAMA RUBBER CO., LTD.

The present technology provides a rubber composition comprising: from 1.0 part by mass to 15 parts by mass of water, and from 0.5 parts by mass to 10 parts by mass of water absorbing resin as a water retaining agent, or from 0.5 parts by mass to 20 parts by mass of inorganic water retaining agent as a water retaining agent, per 100 parts by mass of diene polymer that can be sulfur-vulcanized. 1. A rubber composition adhesive to a metal surface , the rubber composition being capable of adhering to a metal surface , the rubber composition comprising: from 1.0 part by mass to 15 parts by mass of water , and from 0.5 parts by mass to 10 parts by mass of water absorbing resin as a water retaining agent , per 100 parts by mass of diene polymer that can be sulfur-vulcanized.2. The rubber composition adhesive to a metal surface according to claim 1 , wherein the water absorbing resin is at least one type selected from the group consisting of a poly(acrylic acid) partial sodium salt crosslinked product claim 1 , a modified acrylic crosslinked polymer claim 1 , and a polyether compound.3. The rubber composition adhesive to a metal surface according to claim 2 , wherein the polyether compound is polyethylene oxide or polyethylene glycol.4. A rubber composition adhesive to a metal surface claim 2 , the rubber composition being capable of adhering to a metal surface claim 2 , the rubber composition comprising: from 1.0 part by mass to 15 parts by mass of water claim 2 , and from 0.5 parts by mass to 20 parts by mass of inorganic water retaining agent as a water retaining agent claim 2 , per 100 parts by mass of diene polymer that can be sulfur-vulcanized.5. The rubber composition adhesive to a metal surface according to claim 4 , wherein the inorganic water retaining agent is at least one type selected from the group consisting of water-swellable clay claim 4 , silica claim 4 , aluminum hydroxide claim 4 , aluminum oxide claim 4 , calcium carbonate claim 4 , magnesium carbonate ...

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Номер записи: 65
05-04-2018 дата публикации

Tape Adhesive for an Insulating Tape in an Insulation System and an Insulation System

Номер: US20180094177A1
Автор: HUBER JUERGEN, Olbrich Irene, SCHIRM DIETER, Uebler Matthias
Принадлежит: SIEMENS AKTIENGESELLSCHAFT

Tape adhesives suitable for impregnating processes for insulation systems are described. Embodiments of the tape adhesives include solid insulation material such as mica, anhydride-free impregnating resins and accelerators for the anhydride-free impregnating resins. The tape adhesives may be adjusted with respect to the reactivity of the accelerators for the anhydride-free impregnating resins in relation for the storage stability of the overall insulation systems. 1. A tape adhesive for an insulating tape in an insulation system , the tape adhesive comprising{'sub': 'n', 'an addition product formed from an A(OH)segment comprising bisphenols, diols, triols and/or higher alcohols, with a Cy segment comprising a cyclohexene oxide, a cyclohexene oxide derivative, or mixtures of a cyclohexene oxide and a cyclohexene oxide derivative, wherein the tape adhesive has a dynamic viscosity of 1-100 Pa*s at impregnation temperature.'}2. The tape adhesive as claimed in claim 1 , wherein the tape adhesive is free of oxirane groups.3. The tape adhesive as claimed in claim 1 , wherein the A(OH)segment is selected from the group of compounds consisting of{'sub': 2', '4', '2', '4', '8', '2', '4', '6', '2', '4', '4', '2', '2', '4', 'x', '2', '3', '6', '2', '3', '6', 'x', '2', '2', '8', '2', '3', '6', '2', '5', '10', '2', '5', '8', '2', '5', '6', '2', '3', '5', '3', '5', '10', '2', '5', '8', '4', '6', '12', '2', '6', '12', '2', '7', '14', '2', '8', '16', '2', '6', '4', '2', '6', '4', '2', '6', '4', '2', '10', '12', '2', '6', '12', '2, 'monoethylene glycol (CH) (OH), butanediols (CH) (OH), butenediols (CH) (OH), butynediol (CH) (OH), polyethylene glycols H(OCH)(OH)with x=1 to 5000, propylene glycol (CH) (OH), polypropylene glycols H(OCH)(OH)with x=1 to 5000, diethylene glycol (CHO) (OH), propanediols (CH) (OH), neopentyl glycol (CH) (OH), cyclopentanediols (CH) (OH), cyclopentenediols (CH) (OH), glycerol (CH) (OH), pentanediols (CH) (OH), pentaerythritol (CH) (OH), hexanediols (CH) (OH), ...

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Номер записи: 66
12-05-2022 дата публикации

Moisture Curable Adhesive Compositions

Номер: US20220145146A1
Автор: Li Wenwen, Sutherland Ken
Принадлежит: Kaneka Americas Holding, Inc.

A moisture curable composition, and a method of application and a substrate including the same are disclosed herein. In some embodiments, a curable composition includes a component (A) comprising an organic polymer containing reactive silicon groups represented by the general formula (1), a component (B) comprising an organic polymer having a viscosity lower than 10,000 cP at 23° C. containing reactive silicon groups represented by the general formula (2), and a component (C) comprising a polyolefin polymer. The moisture curable composition has universal adhesiveness to an adhesion-resistant substrate, such as PVC, EPDM, and TPO. The substrates can be smooth-back or fleece-back substrates. 1. A curable composition , comprising: {'br': None, 'sup': '1', 'sub': 3-a', 'a, '—Si(R)X\u2003\u2003(1)'}, 'a component (A) having an organic polymer containing reactive silicon groups represented by the following general formula (1){'sup': '1', 'wherein Rrepresents an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, or an aralkyl group having 7 to 20 carbon atoms,'}wherein X represents a hydrolyzable group, wherein each X is the same or different when two or more X are present,a is an integer from 1 to 3,{'sup': '1', 'when a is 1, each Rmay be the same or different, and'}when a is 2 or 3, each X may be the same or different; {'br': None, 'sup': '2', 'sub': 3-b', 'b, '—Si(R)X\u2003\u2003(2)'}, 'a component (B) having an organic polymer containing reactive silicon groups, wherein the organic polymer having a viscosity lower than 10,000 cP at 23° C., and wherein the reactive silicon groups represented by the following general formula (2){'sup': '2', 'wherein Rrepresents an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, or an aralkyl group having 7 to 20 carbon atoms,'}wherein X represents a hydroxyl group or a hydrolyzable group, wherein each X is the same or different when two or more X are presentb is an ...

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Номер записи: 67
12-05-2022 дата публикации

Resin sheet

Номер: US20220145151A1
Автор: Yasunori Karasawa, Yasutaka Watanabe
Принадлежит: Lintec Corp

A resin sheet is made of a resin composition containing a (A) heat-curable component. The (A) heat-curable component contains a (A1) first maleimide resin. The (A1) first maleimide resin is a maleimide resin having two or more maleimide groups in one molecule, at least a pair of the maleimide groups being bonded by a binding group whose main chain includes four or more methylene groups.

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Номер записи: 68
28-03-2019 дата публикации

Inkjet adhesive, manufacturing method for semiconductor device, and electronic component

Номер: US20190092963A1
Автор: Mitsuru Tanikawa, Takashi Watanabe, Tasuku Yamada, Yoshito FUJITA, Yusuke Fujita
Принадлежит: Sekisui Chemical Co Ltd

Provided is an inkjet adhesive which is applied using an inkjet device, wherein the adhesive can suppress generation of voids in the adhesive layer and, after bonding, can enhance adhesiveness, moisture-resistant adhesion reliability, and cooling/heating cycle reliability. An inkjet adhesive according to the present invention comprises a photocurable compound, a photo-radical initiator, a thermosetting compound having one or more cyclic ether groups or cyclic thioether groups, and a compound capable of reacting with the thermosetting compound, and the compound capable of reacting with the thermosetting compound contains aromatic amine.

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Номер записи: 69
26-03-2020 дата публикации

SULFURIZED POLYBENZOXAZINE THAT CAN BE USED FOR COATING METAL AND FOR THE BONDING OF SAME TO RUBBER

Номер: US20200095458A1
Автор: Fedurco Milan, RIBEZZO MARCO
Принадлежит:

A polybenzoxazine sulfide has repeating units including at least one unit corresponding to formula (I) or (II): 119.-. (canceled)21. The polybenzoxazine sulfide according to claim 20 , wherein the central benzene ring bears two groups of formula —S—R.22. The polybenzoxazine sulfide according to claim 21 , wherein the two groups of formula —S—R are in the meta-position relative to each other on the central benzene ring.23. The polybenzoxazine sulfide according to claim 20 , wherein x is in a range from 1 to 4.24. The polybenzoxazine sulfide according to claim 20 , wherein R is an alkyl containing from 1 to 5 carbon atoms.25. The polybenzoxazine sulfide according to claim 24 , wherein R represents a methyl or an ethyl.26. The polybenzoxazine sulfide according to claim 23 , wherein x is equal to 1 and R represents a methyl.32. A method for polymeric coating of a substrate claim 23 , wherein at least a surface of the substrate is at least partly metallic claim 23 , comprising the step of:{'claim-ref': {'@idref': 'CLM-00020', 'claim 20'}, 'coating the substrate with a polybenzoxazine sulfide according to to form a coated substrate.'}33. The method according to claim 32 , wherein the coated substrate is bonded to a rubber.34. A substrate having at least a surface which is at least partly metallic claim 20 , the at least partly metallic surface being coated with a polybenzoxazine sulfide according to .35. The substrate according to claim 34 , wherein the substrate is made of steel.36. The substrate according to claim 35 , wherein the steel is a bright steel.37. The substrate according to claim 35 , wherein the steel is at least partially coated with at least one layer of a second surface metal selected from the group consisting of aluminum claim 35 , copper claim 35 , zinc and alloys thereof.38. The substrate according to claim 37 , wherein the second surface metal is brass.39. The polybenzoxazine sulfide according to claim 25 , wherein x is equal to 1 and R represents a ...

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Номер записи: 70
26-03-2020 дата публикации

Adhesive Composition For Use In Roofing Materials

Номер: US20200095478A1
Автор: Stoller Nathaniel P., Young Patrick H.
Принадлежит:

A moisture curable, non-bitumen based and non-asphaltic based adhesive includes an extender, a compatibilizer, and a polymer, wherein the polymer includes reactive silyl groups. 1. A moisture curable , non-bitumen and non-asphaltic based adhesive , said moisture curable , non-bitumen and non-asphaltic based adhesive comprising at least 4 wt. % extender , at least 2 wt. % compatibilizer , at least 10 wt. % polymer , and less than 0.5 wt. % asphalt , bitumen , and/or coal tar , said polymer including reactive silyl groups.2. The moisture curable claim 1 , non-bitumen and non-asphaltic based adhesive as defined in claim 1 , wherein said moisture curable claim 1 , non-bitumen and non-asphaltic based adhesive comprises 4-45 wt. % extender claim 1 , 2-45 wt. % compatibilizer claim 1 , and 10-31 wt. % polymer claim 1 , one or more of said reactive silyl groups in said polymer are selected from the group consisting of a polyether having reactive silyl groups claim 1 , a polyurethane having reactive silyl groups claim 1 , and a polyester having reactive silyl groups.3. The moisture curable claim 1 , non-bitumen and non-asphaltic based adhesive as defined in claim 1 , wherein said moisture curable claim 1 , non-bitumen and non-asphaltic based adhesive further includes one or more of adhesion promoter claim 1 , antioxidant claim 1 , catalyst claim 1 , dehydration agent claim 1 , filler and/or tackifier.4. The moisture curable claim 3 , non-bitumen and non-asphaltic based adhesive as defined in claim 3 , wherein said moisture curable claim 3 , non-bitumen and non-asphaltic based adhesive includes one or more of at least 0.01 wt. % adhesion promoter claim 3 , at least 0.001 wt. % antioxidant claim 3 , at least 0.1 wt. % catalyst claim 3 , at least 0.05 wt. % dehydration agent claim 3 , at least 20 wt. % filler claim 3 , and/or at least 0.01 wt. % tackifier.5. The moisture curable claim 3 , non-bitumen and non-asphaltic based adhesive as defined in claim 3 , wherein said moisture ...

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Номер записи: 71
04-04-2019 дата публикации

High Modulus Curable Composition

Номер: US20190100618A1
Автор: Bonigut Markus, Damke Jan-Erik, Despotopoulou Christina, Klein Johann
Принадлежит:

The invention relates to a curable composition comprising a) at least one polymer having at least one terminal group of the general formula (I) 2. The curable composition according to claim 1 , wherein the at least one polymer has at least two terminal groups of the general formula (I).3. The curable composition according to claim 1 , wherein each Ar in the general formula (II) is a phenyl group.4. The curable composition according to claim 1 , wherein R′ in the general formula (II) is selected from a methyl or ethyl group.5. The curable composition according to claim 1 , wherein the composition comprises the at least one compound of the general formula (II) in an amount of 1 to 60 wt. % based on the total weight of the composition.6. The curable composition according to claim 1 , wherein the each divalent bonding group A in the general formula (I) is independently selected from an oxygen atom claim 1 , a substituted or unsubstituted amide claim 1 , a carbamate claim 1 , a urethane claim 1 , an urea claim 1 , an amino claim 1 , a carboxylate claim 1 , a carbamoyl claim 1 , an amidino claim 1 , a carbonate claim 1 , a sulfonate claim 1 , a sulfinate or an —N(R″)-group claim 1 , wherein R″ is selected from the group consisting of a hydrogen atom claim 1 , an alkyl residue having 1 to 12 carbon atoms or an aryl residue having 1 to 12 carbon atoms.7. The curable composition according to claim 1 , wherein the substituents X claim 1 , Y claim 1 , Z in the general formula (I) are claim 1 , each independently of one another claim 1 , selected from a hydroxyl claim 1 , a methyl claim 1 , an ethyl claim 1 , a methoxy claim 1 , or an ethoxy group claim 1 , wherein at least one of the substituents is a hydroxyl group claim 1 , or a methoxy or an ethoxy group.8. The curable composition according to claim 1 , wherein R in the general formula (I) is selected from a methylene claim 1 , ethylene claim 1 , or n-propylene.9. The curable composition according to claim 1 , wherein the ...

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Номер записи: 72
02-06-2022 дата публикации

TIRE WITH ETHYLENE-VINYL ALCOHOL COPOLYMER INNERLINER

Номер: US20220169076A1
Автор: CHANDRA Dinesh, Gillick James Gregory
Принадлежит:

The present invention is directed to a pneumatic tire comprising a carcass and an innerliner in direct contact with the carcass, the innerliner comprising a film comprising an ethylene vinyl alcohol copolymer; and an adhesive layer disposed between the film and the carcass, the adhesive layer comprising a resorcinol-formaldehyde-latex (RFL) adhesive. 1. A pneumatic tire comprising a carcass and an innerliner in direct contact with the carcass , the innerliner comprising:a film comprising an ethylene vinyl alcohol copolymer; andan adhesive layer disposed between the film and the carcass, the adhesive layer comprising a resorcinol-formaldehyde-latex (RFL) adhesive.2. The pneumatic tire of claim 1 , wherein the RFL comprises a resorcinol-formaldehyde resin claim 1 , a styrene-butadiene rubber claim 1 , and a vinylpyridine-styrene-butadiene rubber.3. The pneumatic tire of claim 1 , wherein the ethylene vinyl alcohol copolymer comprises an ethylene copolymer ratio ranging from about 25 mole percent to about 50 mole percent ethylene.4. The pneumatic tire of claim 1 , wherein the innerliner comprises:a microlayer polymer composite film comprising alternating layers of a polyurethane and the ethylene vinyl alcohol copolymer.5. The pneumatic tire of claim 4 , wherein the polyurethane is selected from the group consisting of thermoplastic polyester-polyurethanes claim 4 , polyether-polyurethanes claim 4 , and polycarbonate-polyurethanes.6. The pneumatic tire of claim 4 , wherein the alternating layers have thicknesses ranging from about 0.01 microns to about 2.5 microns.7. The pneumatic tire of claim 1 , wherein the innerliner has a thickness of from about 0.5 mm to about 2 mm. Conventionally, barrier layers, usually in a form of innerliners, for pneumatic rubber tires are comprised of butyl or halogenated butyl rubber (e.g. halobutyl rubber) layers which have greater resistance to air, oxygen, and nitrogen permeability than other tire components. Such barrier layers, or ...

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Номер записи: 73
21-04-2016 дата публикации

Bonding Dissimilar Materials with Adhesive Paste

Номер: US20160108297A1
Автор: Bednarski Jeanne, Bradley Renee, Sheasley David
Принадлежит: Zephyros, Inc.

A rivetable adhesive for use in a joint between dissimilar materials, comprising a liquid epoxy resin, an expoxidized polysulfide, a flexibilizer, a solid epoxy CTBN adduct based upon bisphenol A, a phenoxy resin, an impact modifier including methacrylate-butadiene-styrene, a curing agent; and a blowing agent. The adhesive finds particular suitability for use in riveting aluminum panels to steel structures, such as for forming automotive vehicle roof structures. 1: A rivetable adhesive for use in a joint between dissimilar materials , comprising:a. a liquid epoxy resin;b. an expoxidized polysulfide;c. a flexibilizer;d. a solid epoxy CTBN adduct based upon bisphenol A;e. a phenoxy resin;f. an impact modifier including methacrylate-butadiene-styrene;g. a curing agent; andh. a blowing agent.2: The adhesive of claim 1 , wherein the liquid epoxy resin has an epoxide equivalent weight (g/eq) per ASTM D-1652-11e1 of about 182-192.3: The adhesive of claim 1 , wherein the impact modifier is a core shell impact modifier.4: The adhesive of claim 1 , including an aromatic substituted urea curing accelerator.5: The adhesive of claim 2 , wherein the blowing agent has a decomposition temperature of about 190 to 220° C.6: The adhesive of claim 3 , wherein the liquid epoxy resin is a resin reaction product of epichlorohydrin and bisphenol A having an epoxide equivalent weight per ASTM D-1652-11e1 of about 182 to about 192.7: The adhesive of claim 1 , wherein the liquid epoxy resin is present in an amount of about 15 to about 25 parts by weight of the adhesive.8: The adhesive of claim 7 , wherein the adhesive includes a liquid epoxy resin reaction product of an epichlorohydrin and a polypropylene glycol.9: The adhesive of claim 8 , wherein liquid epoxy resin reaction product of an epichlorohydrin and a polypropylene glycol is present in amount of about 3 to about 20 parts by weight of the adhesive.10: The adhesive of claim 1 , wherein the flexibilizer is present in an amount of about ...

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Номер записи: 74
19-04-2018 дата публикации

Hemostatic sponge

Номер: US20180104377A1
Автор: Atsushi Edward Osawa, Hans Christian Hedrich, Joris Hoefinghoff, Woonza M. Rhee
Принадлежит: Baxter Healthcare SA, Baxter International Inc

The present invention provides a hemostatic composite sponge comprising oxidized cellulose and an essentially gelatin-free bioadhesive material stably associated with said sponge and present in an organized pattern on said sponge.

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Номер записи: 75
29-04-2021 дата публикации

Highly Active Double Metal Cyanide Compounds

Номер: US20210122878A1
Автор: Damke Jan-Erik, Klein Johann, Kragl Udo, Marquardt Marion, Mejia Esteban
Принадлежит:

The present invention is directed to supported catalyst having utility in the polymerization and co-polymerization of epoxide monomers, said supported catalyst having the general Formula (I): 1. A supported catalyst having the general Formula (I):{'br': None, 'i': 'b', '[DMCC]*Supp\u2003\u2003(I)'} Supp denotes a hydrophobic support material; and,', 'b represents the average proportion by weight of said support material, based on the total weight of [DMCC] and Supp;', 'wherein the hydrophobic support material is selected from the group consisting of hydrophobic materials having a methanol wettability value of at least 30 vol. %; carbonaceous inorganic solid materials; and inorganic solid materials which are isoelectronic with carbon., 'wherein: [DMCC] denotes a double metal cyanide complex which comprises a double metal cyanide (DMC) compound, at least one organic complexing agent and a metal salt;'}2. The supported catalyst according to claim 1 , wherein b is in the range of 10 wt. %≤b≤70 wt. %.3. The supported catalyst according to claim 1 , wherein said double metal cyanide complex [DMCC] is represented either by the general Formula (II-A){'br': None, 'sup': 1', '2', '3, 'sub': d', 'e', 'f', 'g, 'i': *x', '*y, 'M[M(CN)]M(X)H2O*ωL\u2003\u2003(II-A); or'}{'br': None, 'by general Formula (II){'br': None, 'sup': 1', '2', '3', '1', '2, 'sub': d', 'e', 'f', 'g, 'i': *x', '*y', 'z', '*a, 'M[M(CN)]M(X)H2O*LL\u2003\u2003(II)'}{'sup': '1', 'claim-text': [{'sup': '2', 'Mis a Fe, Co, Mn, Cr, Ir, Rh, Ru or V ion;'}, {'sup': '3', 'Mis a Zn, Fe, Co, Ni, Mn, Cu, Sn, Pb, Cr, Ir, Rh, Ru or V ion;'}, 'X is an anion;', 'L is an organic complexing agent;', {'sup': 1', '2, 'Land Lare distinct from one another and represent respectively first and second organic complexing agents;'}, {'sup': 1', '2', '3, 'sub': d', 'e', 'f', 'g, 'd, e, f and g are each integers >0 but have values such that the complex M[M(CN)]*xM(X)is electrically neutral;'}, '0.1≤x≤5;', '0.1≤y≤1;', '0.0001≤ω≤6;', '0. ...

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Номер записи: 76
29-04-2021 дата публикации

POLYMER-METAL JUNCTION

Номер: US20210122953A1
Автор: El-Hibri Mohammad Jamal, HAMMONDS Ryan, LOUIS Chantal
Принадлежит:

Disclosed is a polymer-metal junction including a polymer composition in contact with a metal substrate, where the polymer composition comprises a polymer component including a PEEK-PEDEK copolymer having a PEEK/PEDEK mole ratio ranging from about 60/40 to about 30/70 and a melting point (Tm) greater than 320° C., and where the polymer composition includes less than 10 wt. % of a sulfur-or-carbonyl-containing solvent, based on the total weight of the polymer composition. Also disclosed are methods of making the polymer-metal junction and articles including the polymer-metal junction. 1. A polymer-metal junction comprising a polymer composition in contact with a metal substrate , the polymer composition comprises a polymer component including a PEEK-PEDEK copolymer having a PEEK/PEDEK mole ratio ranging from about 60/40 to about 30/70;', 'the PEEK-PEDEK copolymer has melting point (Tm) greater than 320° C. as determined by differential scanning calorimeter (DSC) according to ASTM D3418-03 and E794-06; and', 'the polymer composition includes less than 10 wt. % of a sulfur-or-carbonyl-containing solvent, based on the total weight of the polymer composition., 'wherein2. The polymer-metal junction of claim 1 , wherein the PEEK/PEDEK mole ratio ranges from about 50/50 to about 30/70.3. The polymer-metal junction of claim 1 , wherein the PEEK-PEDEK copolymer has a melting temperature (Tm) claim 1 , a crystallization temperature (Tc) claim 1 , and a glass transition temperature (Tg) satisfying the relationship claim 1 , (Tm−Tc)/(Tm−Tg)<0.31.4. The polymer-metal junction of claim 1 , wherein the polymer component further comprises a poly(ether ether ketone) (PEEK).5. The polymer-metal junction of claim 1 , wherein the polymer component further comprises a poly(ether ether ketone) (PEEK) and a poly(ether ketone ketone) (PEKK).7. The polymer-metal junction of claim 6 , wherein the low molecular weight aromatic compound is diphenyl sulfone or 1 claim 6 ,4-Bis(4-phenoxybenzoyl) ...

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Номер записи: 77
26-04-2018 дата публикации

Tire with reduced cavity noise

Номер: US20180111428A1
Автор: Byeong Ho Seo, Chang Hwan Kang, Hak Joo KIM, Ju Geon Park
Принадлежит: Hankook Tire Co Ltd

Disclosed is a tire with reduced cavity noise including an adhesive agent layer applied to an inside an inner liner, and a sound absorber layer attached to the adhesive agent layer, wherein the adhesive agent layer includes polyether containing an alkoxysilane substituent group in a main chain, rather than, at an end. The tire with reduced cavity noise is stable without causing separation of a sound absorber even heating and deformation during driving.

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Номер записи: 78
09-06-2022 дата публикации

Adhesive Gels For Respiratory Masks

Номер: US20220177750A1
Автор: JENSEN Sandra, WEIHER Kathryn
Принадлежит: Seal Solutions, LLC

Adhesives for use on user-to-mask interfaces of a respiratory mask and methods of preparing the same are provided. The adhesive includes greater than or equal to about 1 wt. % to less than or equal to about 15 wt. % of one or more glycerides; greater than or equal to about 0.50 wt. % to less than or equal to about 5 wt. % of one or more polyacrylates; greater than or equal to about 1 wt. % to less than or equal to about 10 wt. % of one or more polyethers; greater than or equal to about 25 wt. % to less than or equal to about 45 wt. % of one or more N-vinylpyrrolidone polymers; and a balance of water. The method includes forming a first aqueous mixture, forming a second aqueous mixture, and admixing the first aqueous mixture and the second aqueous mixture to form a substantially homogeneous mixture that defines the adhesive. 1. An adhesive for use on a user-to-mask interface of a respiratory mask , the adhesive comprising:greater than or equal to about 1 wt. % to less than or equal to about 15 wt. % of one or more glycerides;greater than or equal to about 0.50 wt. % to less than or equal to about 5 wt. % of one or more polyacrylates;greater than or equal to about 1 wt. % to less than or equal to about 10 wt. % of one or more polyethers;greater than or equal to about 25 wt. % to less than or equal to about 45 wt. % of one or more N-vinylpyrrolidone polymers; anda balance of water.2. The adhesive of claim 1 , wherein the one or more glycerides comprises glycerol (CHO).3. The adhesive of claim 1 , wherein the one or more polyethers comprises poly(ethylene glycol) ((CHO)HO).4. The adhesive of claim 1 , wherein the one or more N-vinylpyrrolidone polymers comprises polyvinylpyrrolidone.5. The adhesive of claim 1 , wherein the adhesive further comprises greater than or equal to about 0.10 wt. % to less than or equal to about 3 wt. % of one or more amines.6. The adhesive of claim 5 , wherein the one or more amines comprises triethylamine.7. The adhesive of claim 1 , wherein ...

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Номер записи: 79
11-04-2019 дата публикации

SHEET-SHAPED STRETCHABLE STRUCTURE, AND RESIN COMPOSITION FOR STRETCHABLE RESIN SHEET AND STRETCHABLE RESIN SHEET USED FOR THE STRUCTURE

Номер: US20190110361A1
Автор: Abe Takatoshi, SAWADA Tomoaki, YOSHIOKA Shingo
Принадлежит: Panasonic Intellectual Property Management Co., Ltd.

A sheet-shaped stretchable structure including stretchable resin sheets laminated together is provided. A conductive layer may be disposed at least at one of several positions. For example, the conductive layer may be disposed between any two adjacent ones of the laminated stretchable resin sheets. The conductive layer may be disposed on a top surface of an uppermost one of the laminated stretchable resin sheets. Further, the conductive layer may be disposed on a bottom surface of a lowermost one of the laminated stretchable resin sheets, and a via hole. 1. A sheet-shaped stretchable structure , comprising:stretchable resin sheets laminated together, anda conductive layer disposed at one of following positions:between any two adjacent ones of the laminated stretchable resin sheets;on a top surface of an uppermost one of the laminated stretchable resin sheets; andon a bottom surface of a lowermost one of the laminated stretchable resin sheets, and a via hole.2. The sheet-shaped stretchable structure according to claim 1 , wherein the conductive layer is a copper foil.3. The sheet-shaped stretchable structure according to claim 1 , wherein the via is formed by laser-drilling.4. The sheet-shaped stretchable structure according to claim 1 , wherein the laminated stretchable resin sheets comprises rubber.5. The sheet-shaped stretchable structure according to claim 4 , wherein the laminated stretchable resin sheets comprising the rubber is cured or semi-cured.6. A flexible display device containing the sheet-shaped stretchable structure according to . This is a continuation application of U.S. patent application Ser. No. 14/944,338, filed Nov. 18, 2015, which claims the benefit of Japanese Patent Application No. 2014-239899, filed Nov. 27, 2014, and Japanese Patent Application No. 2015-076692, filed Apr. 3, 2015. The entire disclosure of each of the above-identified applications, including the specification, drawings, and claims, is incorporated herein by reference in its ...

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Номер записи: 80
18-04-2019 дата публикации

AQUEOUS ADHESIVE COMPOSITION COMPRISING A THERMOSETTING RESIN

Номер: US20190112512A1
Автор: Doisneau David, MICHOUD CLÉMENT
Принадлежит:

An aqueous adhesive composition comprises a thermosetting resin based on: at least one aromatic compound bearing at least two functions, one of these functions being a hydroxymethyl function and the other being an aldehyde function or a hydroxymethyl function, the aromatic compound comprising at least one aromatic ring; and at least aromatic polyphenol comprising at least one aromatic ring bearing at least two hydroxyl functions in the meta position relative to one another, the two positions ortho to at least one of the hydroxyl functions being unsubstituted. Such an adhesive composition may especially be used to join elements made of wood; it constitutes an advantageous alternative to the use of a formaldehyde-based phenolic resin adhesive. 1. An aqueous adhesive composition comprising a thermosetting resin based on:(A1) at least one aromatic compound comprising at least one aromatic ring bearing at least two functions, one of these functions being a hydroxymethyl function and the other being an aldehyde function or a hydroxymethyl function; and(A2) at least one aromatic polyphenol comprising at least one aromatic ring bearing at least two hydroxyl functions in the meta position relative to one another, the two positions ortho to at least one of the hydroxyl functions being unsubstituted.2. The composition according to claim 1 , wherein the thermosetting resin is also based on:(A2′) at least one aromatic monophenol comprising at least one six-membered aromatic ring bearing a single hydroxyl function, the two positions ortho to the hydroxyl function being unsubstituted, or at least one position ortho to and the position para to the hydroxyl function being unsubstituted.5. The composition according to claim 1 , wherein the aromatic ring of the aromatic polyphenol bears three hydroxyl functions in the meta position relative to one another.6. The composition according to claim 1 , wherein the two positions ortho to each hydroxyl function on the aromatic ring of the ...

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Номер записи: 81
09-04-2020 дата публикации

POLY(ARYLENE ETHER) COPOLYMER

Номер: US20200109281A1
Автор: Carrillo Alvaro, TARKIN-TAS EYLEM, Tas Huseyin
Принадлежит:

A poly(arylene ether) copolymer is the product of oxidative copolymerization of monomers including a monohydric phenol and a dihydric phenol of the formula 2. The poly(arylene ether) copolymer of claim 1 , wherein the monohydric phenol comprises 2 claim 1 ,6-dimethyl phenol claim 1 , 2 claim 1 ,3 claim 1 ,6-trimethyl phenol claim 1 , or a combination thereof claim 1 , and the dihydric phenol comprises 2 claim 1 ,2-bis(3 claim 1 ,5-dimethyl-4-hydroxyphenyl)propane.3. The poly(arylene ether) copolymer of claim 1 , wherein the poly(arylene ether) copolymer has a number average molecular weight of 500 to 2 claim 1 ,500 grams per mole and a weight average molecular weight of 1 claim 1 ,000 to 6 claim 1 ,000 grams per mole claim 1 , wherein number average molecular weight and weight average molecular weight are as determined by gel permeation chromatography.4. The poly(arylene ether) copolymer of claim 1 , wherein the oxidative copolymerization is in the presence of a catalyst composition comprising di-n-butylamine; andwherein the poly(arylene ether) copolymer comprises less than or equal to 0.1 weight percent of incorporated dibutylamine groups, preferably 0.01 to 0.1 weight percent of incorporated dibutylamine groups.5. The poly(arylene ether) copolymer of claim 1 , wherein the oxidative copolymerization is in the presence of a catalyst composition excluding di-n-butylamine; andwherein the poly(arylene ether) copolymer is devoid of incorporated dibutylamine groups.6. The poly(arylene ether) copolymer of claim 1 , wherein the poly(arylene ether) copolymer has an intrinsic viscosity if 0.04 to 0.15 deciliter per gram measured at 25° C. in chloroform claim 1 , preferably 0.06 to 0.1 deciliter per gram claim 1 , more preferably 0.075 to 0.090 deciliter per gram.7. The poly(arylene ether) copolymer of claim 1 , wherein the poly(arylene ether) copolymer has an average of 1.8 to 2 hydroxyl groups per molecule.8. A method of making a poly(arylene ether) copolymer claim 1 , the ...

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Номер записи: 82
05-05-2016 дата публикации

EPHEMERAL BONDING

Номер: US20160122601A1
Автор: BAI Zhifeng, BRANTL Karen R., Gallagher Michael K., Iagodkine Elissei, OLIVER Mark S., Tucker Christopher J., WANG Zidong
Принадлежит:

Compositions containing an adhesive material, a release additive and a compatibilizer are suitable for temporarily bonding two surfaces, such as a wafer active side and a substrate. These compositions are useful in the manufacture of electronic devices where a temporary bonding of a component to a substrate is desired. 1. A temporary bonding composition comprising a curable adhesive material , a polyether release additive , and a compatibilizer , wherein the release additive is free of silicon.2. The composition of wherein the curable adhesive material is chosen from polyarylene oligomers claim 1 , cyclic-olefin oligomers claim 1 , arylcyclobutene oligomers claim 1 , vinyl aromatic oligomers claim 1 , and mixtures thereof.3. The composition of wherein the release additive is chosen from polyalkylene oxide homopolymers or polyalkylene oxide copolymers.4. The composition of wherein the release additive contains one or more polar end groups chosen from alkoxy claim 1 , aryloxy claim 1 , hydroxy claim 1 , carboxylate claim 1 , alkoxycarbonyl claim 1 , mercapto claim 1 , alkylthio claim 1 , primary amine claim 1 , secondary amine claim 1 , and tertiary amine.5. The composition of wherein the compatibilizer is a polyether comprising butylene oxide units.6. The composition of wherein the compatibilizer is a polybutyleneoxide having the formula R—O—(CHO)—(CHO)—R; wherein each of Rand Ris independently chosen from H claim 5 , (C-C)alkyl claim 5 , H—(RO)—R claim 5 , or (C-C)aryl; each Rand Rare independently (C-C)alkylidene; w is an integer from 1 to 5; z is an integer from 5 to 250 claim 5 , and y is an integer from 0 to 200.7. The composition of wherein the release additive and the combatilizer are in a weight ratio of 5:1 to 1:5.8. The composition of wherein the release additive phase separates from the adhesive material during curing of the adhesive material.9. The composition of wherein the compatibilizer lowers an elastic modulus of the cured adhesive material claim 1 , ...

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Номер записи: 83
05-05-2016 дата публикации

ADHESIVE COMPOSITION

Номер: US20160122606A1
Автор: Kusuda Satoshi, MURAYAMA Yukihiko
Принадлежит: Sekisui Fuller Company, Ltd.

The present invention provides an adhesive composition excellent in adhesive strength. The adhesive composition of the present invention contains 100 parts by weight of polyalkylene oxide having a hydrolyzable silyl group, 1 to 20 parts by weight of an epoxy resin, 0.1 to 10 parts by weight of an epoxysilane coupling agent, 0.5 to 20 parts by weight of a ketimine compound, and 1 to 100 parts by weight of fatty acid-treated calcium oxide. 1. An adhesive composition comprising 100 parts by weight of polyalkylene oxide having a hydrolyzable silyl group , 1 to 20 parts by weight of an epoxy resin , 0.1 to 10 parts by weight of an epoxysilane coupling agent , 0.5 to 20 parts by weight of a ketimine compound , and 1 to 100 parts by weight of fatty acid-treated calcium oxide.2. The adhesive composition according to claim 1 , wherein the epoxy resin contains a bisphenol A type epoxy resin.3. The adhesive composition according to claim 1 , further comprising an aminosilane coupling agent.4. The adhesive composition according to claim 1 , wherein a ratio between a total number of moles of epoxy groups in the epoxy resin and a total number of moles of amino groups in an amine compound that is a hydrolyzate of the ketimine compound claim 1 , (total number of moles of epoxy groups in epoxy resin/total number of moles of amino groups in amine compound that is a hydrolyzate of ketimine compound) claim 1 , is 0.7 to 1.2.5. The adhesive composition according to claim 2 , further comprising an aminosilane coupling agent.6. The adhesive composition according to claim 2 , wherein a ratio between a total number of moles of epoxy groups in the epoxy resin and a total number of moles of amino groups in an amine compound that is a hydrolyzate of the ketimine compound claim 2 , (total number of moles of epoxy groups in epoxy resin/total number of moles of amino groups in amine compound that is a hydrolyzate of ketimine compound) claim 2 , is 0.7 to 1.2.7. The adhesive composition according ...

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Номер записи: 84
12-05-2016 дата публикации

MULTI-COMPONENT ADHESIVE FOR PRODUCING AN ADHESIVE HYDROGEL

Номер: US20160130484A1
Автор: Bargel Hendrik, Kozielec Maria, Rischka Klaus, Sader Robert
Принадлежит:

The present invention primarily relates to a multicomponent adhesive for producing an adhesive hydrogel, comprising the compound defined below of the formula (I) and one, two, three, four or more further constituents. The invention further relates to the use of said multicomponent adhesive and corresponding methods for gluing two surfaces together. The present invention further relates to a method for producing a corresponding adhesive hydrogel. The invention also relates to a kit comprising a corresponding multicomponent adhesive and one or more further constituents. The invention also relates to articles which comprise a multicomponent adhesive according to the invention or an adhesive hydrogel produced therefrom. 2. The multicomponent adhesive as claimed in claim 1 , further comprising at least one of{'sub': 'B', 'd) a buffer consisting of a buffer acid and a corresponding buffer base, where the pKof the buffer base is not less than 2,'}and{'sub': 'B', 'e) one or more bases with a pK<1.'}3. The multicomponent adhesive as claimed in claim 1 , wherein the first compound of the formula (I) contains at least one cysteine unit.5. The multicomponent adhesive as claimed in claim 1 , wherein at least one of(i) the linker L of the first compound of the formula (I) is an organic molecule unit, the chain members whereof consisting of at least one of (a) exclusively carbon atoms and (b) carbon atoms and hetero atoms,(ii) the linker L′ in the structural unit B-L′-Y (II) is an organic molecule unit, the chain members whereof consisting of at least one of (a) exclusively carbon atoms and (b) carbon atoms and hetero atoms,and(iii) the linker L″ in the structural unit B′-L″-Z′ (III) is an organic molecule unit, the chain members whereof consisting of at least one of (a) exclusively carbon atoms and (b) carbon atoms and hetero atoms.6. The multicomponent adhesive as claimed in claim 1 , wherein the linker L in the first compound of the formula (I) contains at least one structural ...

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Номер записи: 85
21-05-2015 дата публикации

Anaerobic curable compositions

Номер: US20150136323A1
Автор: Andrew D. Messana, Angelica Messana, Anthony F. Jacobine, Darel GUSTAFSON, David P. Dworak
Принадлежит: Henkel IP and Holding GmbH

The invention provides anaerobic curable compositions comprising a (meth)acrylate component, at least a portion which comprises a (meth)acrylate-functionalized bio-renewable oleaginous polyurethane polymer, and methods of their production and use. These compositions provide excellent adhesion especially on oily surfaces.

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Номер записи: 86
31-07-2014 дата публикации

PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND PRESSURE-SENSITIVE ADHESIVE SHEET

Номер: US20140213716A1
Автор: Nakayama Junichi, NAKAYAMA Naoki, NISHIYAMA Naoyuki, OKADA Yoshihiro, OOTAKE Hironao
Принадлежит: NITTO DENKO CORPORATION

This invention provides a PSA composition comprising a base polymer and a tackifier resin. The base polymer is a block copolymer of a monovinyl-substituted aromatic compound and a conjugated diene compound. The tackifier resin comprises a tackifier resin Thaving a softening point of 120° C. or above. The tackifier resin Tcomprises a tackifier resin Thaving an aromatic ring while having a hydroxyl value of 30 mgKOH/g or lower. 1. A pressure-sensitive adhesive composition comprising a base polymer and a tackifier resin , whereinthe base polymer is a block copolymer of a monovinyl-substituted aromatic compound and a conjugated diene compound,{'sub': 'H', 'the tackifier resin comprises a tackifier resin Thaving a softening point of 120° C. or above, and'}{'sub': H', 'HR1, 'the tackifier resin Tcomprises a tackifier resin Thaving an aromatic ring and having a hydroxyl value of 30 mgKOH/g or lower.'}2. The pressure-sensitive adhesive composition according to claim 1 , wherein the tackifier resin Tis at least one selected from the group consisting of coumarone-indene resins claim 1 , aromatic petroleum resins claim 1 , aliphatic/aromatic copolymer-based petroleum resins and styrene-based resins.3. The pressure-sensitive adhesive composition according to claim 1 , wherein the tackifier resin further comprises a tackifier resin Thaving a softening point below 120° C.4. The pressure-sensitive adhesive composition according to claim 1 , wherein the base polymer is a styrene-based block copolymer.5. The pressure-sensitive adhesive composition according to claim 4 , wherein the styrene content of the styrene-based block copolymer is 20% by mass or lower.6. The pressure-sensitive adhesive composition according to claim 4 , wherein the tackifier resin Tcontent is in a range of 0.1 to 10 parts by mass relative to 1 part by mass of styrene in the styrene-based block copolymer.7. The pressure-sensitive adhesive composition according to claim 1 , wherein the base polymer has a diblock ...

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Номер записи: 87
19-05-2016 дата публикации

COVERLAY ADHESIVE COMPOSITION

Номер: US20160137890A1
Автор: LI TUNG LIN
Принадлежит:

The present disclosure is directed to a coverlay adhesive. The coverlay adhesive contains 40 to 80 wt % maleic anhydride grafted styrene ethylene butadiene styrene copolymer having greater than 1 wt % maleic anhydride, 3 to 14 wt % epoxy resin, 0.5 to 1.5 wt % hardener, 0.05 to 0.1 wt % catalyst, 10 to 26 wt % organic flame retardant, and optionally polypheneylene ether. 1. A coverlay adhesive consisting essentially thereof:I. 40 to 80 wt % maleic anhydride grafted styrene ethylene butadiene styrene copolymer having greater than 1 wt % maleic anhydride;II. 3 to 14 wt % epoxy resin;III. 0.5 to 1.5 wt % hardener;IV. 0.05 to 0.1 wt % catalyst;V. 10 to 26 wt % organic flame retardant; andVI. optionally polypheneylene ether.2. The coverlay adhesive in accordance with wherein said maleic anhydride grafted styrene ethylene butadiene styrene copolymer has greater than 1 wt % and less than 2 wt % maleic anhydride.3. The coverlay adhesive in accordance with wherein the epoxy resin is a bisphenol A derivative or a polyphenylene ether.4. The coverlay adhesive in accordance with wherein the bisphenol A derivative is bisphenol A carboxyl terminated butadiene acrylonitrile or bisphenol A dimer fatty acid or mixtures thereof.5. The coverlay adhesive in accordance with wherein the hardener is a phenol novolac and the catalyst is 2-ethyl-4-methyl-1h-imidazole-1-propanenitrile.6. The coverlay adhesive in accordance with wherein the organic flame retardant is an organophosphorus salt.7. The coverlay adhesive in accordance with having a peel strength of at least 0.50 N/mm when laminated to copper foil at 180° C. for 120 seconds.8. The coverlay adhesive in accordance with having a peel strength of 0.50 to 0.70 N/mm when laminated to copper foil at 180° C. for 120 seconds.9. The coverlay adhesive in accordance with having a dielectric constant from 2.6 to 3.0 at 10 GHz and a dissipation factor from 0.0060 to 0.0080 at 10 GHz. This disclosure relates generally to adhesives. More ...

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Номер записи: 88
17-05-2018 дата публикации

BISMALEIMIDE RESINS FOR ONE DROP FILL SEALANT APPLICATION

Номер: US20180134657A1
Автор: Sridhar Laxmisha M., Woods John G.
Принадлежит:

The present invention relates to curable novel bismaleimide resins and prepolymers, methods of manufacture. Particularly useful applications include one drop fill sealant used in liquid crystal assembly. In particular, the inventive polymers and compositions are useful in the assembly of LCD panels. The present invention relates to monomers and oligomers useful as sealants and particularly as one drop fill sealants for liquid crystal applications. In particular, the present invention permits assembly of LCD panels without migration of the sealant resin into the liquid crystal or vice versa during LCD assembly and/or curing of the resin.The one drop fill (“ODF”) process is becoming the mainstream process in the assembly of LCD panels in display applications, replacing the conventional vacuum injection technology to meet faster manufacturing process demands. In the ODF process, first, a sealant is dispensed on an electrode-equipped substrate to form a frame of a display element, and liquid crystals are dropped inside the depicted frame. In the next step of the assembly, another electrode equipped substrate is joined thereto under vacuum. Then, the sealant undergoes a curing process, either by a combination of UV and thermal or by thermal only process.The ODF method has a few problems in that the sealant material in the uncured state comes into contact with the liquid crystal during the assembly process. This could cause reduction in electro-optical properties of the liquid crystal by resin migration into the liquid crystal or vice versa, or because of ionic impurities that may be present. Hence, design of resin systems for sealant material that show good liquid crystal resistance (less contamination) along with good adhesion and moisture barrier properties has remained a challenge.The present invention relates to unique resins and ODF compositions made therefrom.In one aspect of the invention there is provided a resin comprising the structure I:In another aspect of ...

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Номер записи: 89
17-05-2018 дата публикации

MONOMERIC AND OLIGOMERIC RESINS FOR ONE DROP FILL SEALANT APPLICATION

Номер: US20180134839A1
Автор: Gao Baoshan, Jacobine Anthony F., Kong Shengian, LI QIN, Sridhar Laxmisha M., Woods John G., Zhang Wenhua, Zhou Jing
Принадлежит:

The present invention relates to curable novel resins and prepolymers, methods of manufacture and compositions made therefrom. Particularly useful applications include one drop fill sealant used in liquid crystal assembly. In particular, the inventive resins and prepolymers and compositions are useful in the assembly of LCD panels. 11. An ODF sealant composition comprising the resin of and a material selected from the group consisting of free radical initiators claim 1 , curing agents claim 1 , fillers and combinations thereof.12. The ODF sealant composition of further including and a material selected from the group consisting of photoinitiators claim 11 , thixotropic agents claim 11 , silane coupling agents claim 11 , diluents claim 11 , modifiers claim 11 , coloring agents claim 11 , surfactants claim 11 , preservatives claim 11 , stabilizers claim 11 , plasticizers claim 11 , lubricants claim 11 , defoamers claim 11 , leveling agents claim 11 , tougheners and combinations thereof.13. An ODF sealant composition comprising the resin of and a material selected from the group consisting of free radical initiators claim 2 , curing agents claim 2 , fillers and combinations thereof.14. The ODF sealant composition of further including and a material selected from the group consisting of photoinitiators claim 13 , thixotropic agents claim 13 , silane coupling agents claim 13 , diluents claim 13 , modifiers claim 13 , coloring agents claim 13 , surfactants claim 13 , preservatives claim 13 , stabilizers claim 13 , plasticizers claim 13 , lubricants claim 13 , defoamers claim 13 , leveling agents claim 13 , tougheners and combinations thereof.15. An ODF sealant composition comprising the resin of and a material selected from the group consisting of free radical initiators claim 3 , curing agents claim 3 , fillers and combinations thereof.16. The ODF sealant composition of further including and a material selected from the group consisting of photoinitiators claim 15 , ...

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Номер записи: 90
18-05-2017 дата публикации

COMPOSITIONS ON THE BASIS OF ORGANYLOXYSILANE-TERMINATED POLYMERS

Номер: US20170137677A1
Автор: Prasse Marko, STANJEK Volker, Zander Lars
Принадлежит: Wacker Chemie AG

Moisture-curing adhesives simultaneously having high tensile strength and elongation are prepared by admixing a silane-terminated polyurethane or polyether polymer having a defined and limited molecular weight, finely divided silica, and an organosilicon compound containing basic nitrogen. 2. The composition of claim 1 , wherein c is 1.3. The composition of claim 1 , wherein d is 1 claim 1 , 2 claim 1 , or 3.4. The composition of claim 1 , wherein e is 1 or 0.5. The composition of claim 1 , comprising finely divided silica (B) in a concentration of at least 19 wt % and at most 40 wt % claim 1 , based on the overall weight of composition.6. The composition of claim 1 , wherein the finely divided pyrogenic silica has a BET surface area of from 50 m/g to about 140 m/g.7. The composition of claim 1 , further comprising at least one nonreactive plasticizer.8. The composition of claim 7 , wherein the plasticizer is present in a concentration of at least 5 wt % and at most 50 wt % claim 7 , based on the overall weight of composition.9. A method of forming a composition of claim 1 , comprising mixing the individual components in any desired order.10. A shaped article obtained by crosslinking a composition of .11. A method of adhesively bonding substrates claim 1 , comprising applying a composition of onto the surface of at least one substrate claim 1 , and then contacting this surface with a second substrate claim 1 , and subsequently allowing the composition to crosslink.12. A method of forming composites claim 1 , which comprises applying a composition of onto at least one substrate and then allowing the composition to crosslink.13. A method of forming a composite claim 9 , comprising applying a composition prepared by the method of onto at least one substrate and crosslinking the composition.14. The composition of claim 1 , wherein b is 1 claim 1 , and the composition is free of metal catalysts.15. The composition of claim 1 , further comprising a polyoxyalkylene ...

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Номер записи: 91
09-05-2019 дата публикации

Silanol-group-terminated polyoxyalkylene compound and production process therefor, room-temperature-curable composition, sealing material, and article

Номер: US20190135978A1
Автор: Isao Iwasaki, Masayuki Ikeno, Takafumi Sakamoto, Takahiro Yamaguchi
Принадлежит: Shin Etsu Chemical Co Ltd

(In formula (1), R1 and R2 are each a monovalent hydrocarbon group, a hydrogen atom, or a triorganosiloxy group; n is 2 or larger; m is 1 or larger; and the broken line is a linking bond.)

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Номер записи: 92
30-04-2020 дата публикации

Bonding adhesive and adhered roofing systems prepared using the same

Номер: US20200131775A1
Автор: Jiansheng Tang, Joseph Carr
Принадлежит: Firestone Building Products Co LLC

A method is provided for forming an adhered membrane roof system. The method comprises applying a bond adhesive to a substrate on a roof to form an adhesive layer and applying a membrane directly to the adhesive layer. The bond adhesive includes a polymer having a silicon-containing hydrolyzable terminal group.

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Номер записи: 93
02-06-2016 дата публикации

PHOTOCURABLE COMPOSITION

Номер: US20160152783A1
Автор: ASAI Ryosuke, KOUNO Shouma, Okamura Naomi, Saito Atsushi, WATANABE Yutaka, YAMAGA Hiroshi
Принадлежит:

A rapid-curing photocurable composition exerting excellent adhesion performance even with a low cumulative light quantity and being curable in a short time, thus ensuring excellent workability, is provided. A photocurable composition is made to includes: (A) a crosslinkable silicon group-containing organic polymer; (B) a photobase generator; and (C1) a silicon compound having an Si—F bond and/or (C2) one or more fluorine-based compounds selected from the group consisting of boron trifluoride, a boron trifluoride complex, a fluorinating agent, and an alkali metal salt of a polyfluoro compound. The (B) photobase generator is preferably a photolatent tertiary amine. 1. A photocurable composition comprising:(A) a crosslinkable silicon group-containing organic polymer;(B) a photobase generator; and(C1) a silicon compound having an Si—F bond and/or (C2) one or more fluorine-based compounds selected from the group consisting of boron trifluoride, a boron trifluoride complex, a fluorinating agent, and an alkali metal salt of a polyfluoro compound.2. The photocurable composition as claimed in claim 1 , wherein the (B) photobase generator is a photolatent tertiary amine.3. The photocurable composition as claimed in claim 1 , further comprising (D) a silane coupling agent.4. The photocurable composition as claimed in claim 1 , wherein the (A) crosslinkable silicon group-containing organic compound is one or more members selected from the group consisting of a polyoxyalkylene-based polymer containing claim 1 , on average claim 1 , 0.8 or more crosslinkable silicon groups per molecule claim 1 , a saturated hydrocarbon-based polymer containing claim 1 , on average claim 1 , 0.8 or more crosslinkable silicon groups per molecule claim 1 , and a (meth)acrylic acid ester-based polymer containing claim 1 , on average claim 1 , 0.8 or more crosslinkable silicon groups per molecule.5. A method for producing a cured product claim 1 , comprising irradiating a photocurable composition ...

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Номер записи: 94
15-09-2022 дата публикации

CURABLE FLUOROPOLYETHER ADHESIVE COMPOSITION AND OPTICAL PARTS

Номер: US20220290019A1
Автор: KOSHIKAWA Hidenori
Принадлежит: SHIN-ETSU CHEMICAL CO., LTD.

This curable fluoropolyether adhesive composition contains specific amounts of 1. A curable fluoropolyether adhesive agent composition comprising:(A) 100 parts by weight of a linear polyfluoro compound having two or more alkenyl groups in one molecule and having a perfluoropolyether structure in a main chain,(B) a fluorine-containing organohydrogensiloxane having, in one molecule, a monovalent perfluoroalkyl group or a monovalent perfluorooxyalkyl group, or having a divalent perfluoroalkylene group or a divalent perfluorooxyalkylene group, and further having two or more hydrogen atoms directly bonded to silicon atoms (SiH groups), and free of an epoxy group and an alkoxy group directly bonded to a silicon atom in the molecule,(C) 0.1 to 120 parts by weight of sodium fluoride,(D) 0.1 to 2,000 ppm in terms of the weight of platinum group metal atoms with respect to the component (A) of a platinum group metal-based catalyst,(E) 0.1 to 20 parts by weight of an organopolysiloxane having, in one molecule, a hydrogen atom directly bonded to a silicon atom (SiH group), a monovalent perfluoroalkyl group or a monovalent perfluorooxyalkyl group, and an epoxy group or a trialkoxysilyl group bonded to a silicon atom via a divalent hydrocarbon group which may contain an oxygen atom, or both groups,wherein the compounding amount of the component (B) is an amount such that the amount of hydrogen atoms directly bonded to silicon atoms in the component (B) is 0.5 to 3 mol, based on 1 mol of alkenyl groups contained in the composition.2. The curable fluoropolyether adhesive agent composition according to claim 1 , wherein the alkenyl group content of the linear polyfluoro compound as the component (A) is 0.005 to 0.3 mol/100 g.6. The curable fluoropolyether adhesive agent composition according to claim 1 , which gives a cured product having a total light transmittance of 80% or more at a thickness of 2 mm measured according to JIS K7361-1.7. An optical component comprising a cured ...

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Номер записи: 95
02-06-2016 дата публикации

SHEET-SHAPED STRETCHABLE STRUCTURE, AND RESIN COMPOSITION FOR STRETCHABLE RESIN SHEET AND STRETCHABLE RESIN SHEET USED FOR THE STRUCTURE

Номер: US20160157343A1
Автор: Abe Takatoshi, SAWADA Tomoaki, YOSHIOKA Shingo
Принадлежит:

A sheet-shaped stretchable structure used as an electronics element has a stretch of not less than 10% and includes a plurality of laminated stretchable resin sheet, and at least one hollow is provided between at least one of pairs of two adjacent ones of the laminated stretchable resin sheets. 1. A sheet-shaped stretchable structure used as an electronics element , the structure having a stretch of not less than 10% and comprising a plurality of laminated stretchable resin sheets ,wherein at least one hollow is provided between at least one of pairs of two adjacent ones of the laminated stretchable resin sheets.2. The sheet-shaped stretchable structure according to claim 1 , further comprising a support member supporting the hollow.3. The sheet-shaped stretchable structure according to claim 1 ,wherein at least one of the laminated stretchable resin sheets is embossed with either a raised pattern or a recessed pattern.4. The sheet-shaped stretchable structure according to claim 1 , further comprising a conductive layer disposed at one of following positions:between any two adjacent ones of the laminated stretchable resin sheets;on a top surface of an uppermost one of the laminated stretchable resin sheets; andon a bottom surface of a lowermost one of the laminated stretchable resin sheets.5. The sheet-shaped stretchable structure according to claim 4 ,wherein the conductive layer forms a circuit pattern.6. The sheet-shaped stretchable structure according to claim 1 ,wherein at least one of the laminated stretchable resin sheets is transparent.7. The sheet-shaped stretchable structure according to claim 1 ,wherein each of the laminated stretchable resin sheets contains filler.8. The sheet-shaped stretchable structure according to claim 1 , further comprising one of a liquid claim 1 , a pigment claim 1 , a liquid crystal claim 1 , and an electrophoretic solution required to operate a display disposed in the hollow.9. The sheet-shaped stretchable structure according ...

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Номер записи: 96
09-06-2016 дата публикации

Improvements in or relating to thermosetting adhesive films

Номер: US20160160087A1
Автор: Ira Miller, Michael AWKAL, Michael Czaplicki
Принадлежит: Zephyros Inc

Flexible films of thermosetting adhesive materials which are non-tacky to the touch are storage stable at room temperature and can be cured at elevated temperature with a short cure time and can be cured to produce a tough flexible adhesive layer including bonding to oily surfaces, the materials are particularly useful in bonding together dissimilar substrates.

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Номер записи: 97
23-05-2019 дата публикации

LACTIDE COPOLYMERS AND RING-OPENED LACTIDE COPOLYMERS

Номер: US20190153153A1
Автор: Kobilka Brandon M., Kuczynski Joseph, PORTER Jacob T., Wertz Jason T.
Принадлежит:

A process of forming a lactide copolymer includes forming a dimethylidene lactide molecule from an L-lactide molecule. The process also includes forming a functionalized lactide monomer from the dimethylidene lactide molecule. The process includes forming a mixture that includes the functionalized lactide monomer and a bisphenol A (BPA) monomer or a BPA-derived monomer. The process further includes polymerizing the mixture to form a lactide copolymer. 2. The compound of claim 1 , wherein the compound reacts with a second monomer to form a lactide copolymer.3. The compound of claim 2 , wherein the lactide copolymer participates in a reaction to form a ring-opened lactide copolymer.4. The compound of claim 2 , wherein the second monomer is bisphenol A diglycidyl ether (DGEBA).5. The compound of claim 2 , wherein the second monomer is bisphenol A (BPA).8. The compound of claim 2 , wherein the lactide copolymer participates in a reaction to form a ring-opened lactide copolymer claim 2 , and wherein the ring-opened lactide copolymer is cross-linked with moieties selected from the group consisting of epoxies claim 2 , isocyanates claim 2 , carbonates claim 2 , esters claim 2 , and combinations thereof.10. The compound of claim 9 , wherein the compound reacts with a second monomer to form a lactide copolymer.11. The compound of claim 10 , wherein the lactide copolymer participates in a reaction to form a ring-opened lactide copolymer.12. The compound of claim 10 , wherein the second monomer is selected from the group consisting of bisphenol A (BPA) and BPA diglycidyl ether (DGEBA).15. The compound of claim 10 , wherein the lactide copolymer participates in a reaction to form a ring-opened lactide copolymer claim 10 , and wherein the ring-opened lactide copolymer is cross-linked with moieties selected from the group consisting of epoxies claim 10 , isocyanates claim 10 , carbonates claim 10 , esters claim 10 , and combinations thereof.17. The compound of claim 16 , wherein ...

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Номер записи: 98
23-05-2019 дата публикации

WORKPIECE TREATING METHOD, SEMICONDUCTOR DEVICE, PROCESS FOR MANUFACTURING THE SAME, AND TEMPORARY FIXING COMPOSITION FOR SHEAR PEELING

Номер: US20190157128A1
Автор: Ishii Hiroyuki, Ishikawa Hiroki, KATOU Hitoshi, KITAHAMA Noriko, MIZUNO Hikaru, SASAKI Hirofumi
Принадлежит: JSR Corporation

A workpiece treating method includes a step (1) of forming a stack including a support, a temporary fixing material and a workpiece wherein the material includes a layer containing a polymer (A) in a range of not less than 50 mass %, the polymer (A) including a structural unit represented by the formula (A1), and the workpiece is held on the material; a step (2) of processing the workpiece and/or transporting the stack; and a step (3) of applying a shear force to the material to thereby separate the workpiece from the support. 3. The workpiece treating method according to claim 1 , wherein the polymer (A) has a hydroxyl value of 100 to 240 mgKOH/g.4. The workpiece treating method according to claim 1 , wherein the polymer (A) has a weight average molecular weight of 5 claim 1 ,000 to 70 claim 1 ,000.5. The workpiece treating method according to claim 1 , wherein the step (1) comprises forming a workpiece having at least a wiring layer claim 1 , on the temporary fixing material.6. The workpiece treating method according to claim 5 , wherein the processing in the step (2) comprises arranging at least one selected from semiconductor wafers and semiconductor chips onto the wiring layer.7. The workpiece treating method according to claim 1 , wherein the temporary fixing material is heated before and/or during applying the shear force in the step (3).8. A semiconductor device manufacturing process comprising manufacturing a semiconductor device by processing a workpiece using the treating method described in .9. A semiconductor device obtained by the manufacturing process described in . This application claims the priority benefits of Japanese patent application no. 2017-221740, filed on Nov. 17, 2017, and Japanese patent application no. 2018-133230, filed on Jul. 13, 2018. The entirety of each of the above-mentioned patent applications is hereby incorporated by reference herein and made a part of this specification.The present disclosure relates to a workpiece treating ...

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Номер записи: 99
01-07-2021 дата публикации

Method of Bonding Perfluoroelastomeric Materials to a Surface

Номер: US20210198447A1
Автор: Campbell Ronald R., Corrado Christopher, Quartapella Carmin, Reichl Gary, Rey Robert Anthony, Ux Brian Alan
Принадлежит:

The invention includes a method of bonding a perfluoroelastomer material to first surface that includes: (a) contacting a first surface with a bonding agent comprising a curable perfluoropolymer and a curing agent; (b) curing the bonding agent to form a perfluoroelastomer material that is bonded to the first surface. In the practice of such method, the bonding agent may be a solution prepared by dissolving the curable perfluoroelastomer and the curing agent in a solvent. In an embodiment of the invention, the perfluoroelastomer material formed in step (b) is a coating layer or, alternatively, the first surface is a surface of a perfluoroelastomer member and the perfluoroelastomer material formed is a perfluoroelastomer weld. 1. A method of forming a perfluoroelastomer coating comprising (a) dissolving a curable perfluoropolymer , having at least one curesite monomer comprising a cyano group , and a curing agent in a solvent to form a solution , (b) applying the solution to a surface; and (c) curing the perfluoropolymer to form a cured perfluoroelastomeric coating on the surface , wherein step (c) comprises heating the coating layer for a sufficient period of time to effectively cure the perfluoropolymer , further wherein the curing agent is selected from the group consisting of a monoamidine , a monoamidoxime and an aryldioxime.2. The method according to claim 1 , wherein the curing step further comprises heating the coating layer to about 149° C. (300° F.).3. The method according to claim 1 , wherein step (a) further comprises (i) forming a first solution of the curable perfluoropolymer and a first solvent; (ii) forming a second solution of the curing agent and a second solvent; and (iii) combining the first solution and the second solution.4. The method according to claim 3 , wherein the first solvent and the second solvent are identical.5. The method according to claim 1 , wherein step (b) comprises spraying the solution onto the surface.6. The method according ...

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Номер записи: 100