КЛЕЕВЫЕ КОМПОЗИЦИИ, ОБЛАДАЮЩИЕ ШИРОКИМ ИНТЕРВАЛОМ РАБОЧИХ ТЕМПЕРАТУР, И ИХ ПРИМЕНЕНИЕ

Группа изобретений относится к термоплавким клеям и их применению. Термоплавкие клеи содержат смесь полимера этилена и винилацетата с низким содержанием винилацетата, а также функционализированный полимер этилена и альфа-олефина, полученный на металлоценовом катализаторе, воск и вещество, повышающее клейкость. Термоплавкий клей обладает широким интервалом рабочих температур для склеивания целлюлозных основ. Термоплавкий клей хорошо подходит для склеивания емкостей для хранения, лотков, мешков и картонных коробок. Термоплавкий клей по изобретению обладает улучшенной гибкостью и термостойкостью при низкой температуре по сравнению с известными термоплавкими клеями. Технический результат, достигаемый группой изобретений, заключается в расширении интервала рабочих температур. 2 н. и 8 з.п. ф-лы, 2 табл.

КОМПОНЕНТ ТРАНСПОРТНОГО СРЕДСТВА, В ЧАСТНОСТИ ЧАСТЬ ДВИГАТЕЛЯ, И ТРАНСПОРТНОЕ СРЕДСТВО

Изобретение относится к компоненту транспортного средства с установленной на нем навесной деталью. Компонент (1) транспортного средства, в частности часть двигателя, с по меньшей мере одной навесной деталью (2), причем компонент (1) транспортного средства и навесная деталь (2) соединены друг с другом посредством клеящего средства (3), и в клеящее средство (3) введены твердые частицы (4). Твердые частицы (4) действуют между компонентом (1) транспортного средства и навесной деталью (2), увеличивая коэффициент трения, или указанные твердые частицы (4) обеспечивают повышение прочности на сдвиг. В случае потенциального нарушения клеевого соединения между компонентом (1) транспортного средства и навесной деталью (2) ввиду нарушения когезии с помощью упомянутых твердых частиц (4) трещина направляется вокруг твердых частиц (4), поскольку их прочность превышает прочность клеевого средства (3). Технический результат: создание альтернативного и/или способного выдерживать более высокие нагрузки, целесообразно ...

Трехслойная лента и способ ее изготовления

Трехслойная лента предназначена для использования в хозяйственной деятельности при выполнении строительных и монтажных работ для устранения щелей в стыках элементов строительных конструкций с целью устранения возможности проникновения через них насекомых при одновременном сохранении возможности пропускания щелями воздуха, влаги и обеспечении вентиляции в помещении. В качестве рабочего слоя используется лента из перфорированного полотна с клеящими слоями, расположенными только по краям ленты на некоторой части ширины ленты с непокрытой средней частью. Ширина средней части достаточна для обеспечения необходимой пропускной способности. Способ изготовления трехслойной ленты заключается в том, что на перфорированное полотно шириной, кратной требуемой ширине трехслойной ленты, увеличенной на удвоенную ширину расположенного у его краев клеящего слоя, наклеивают параллельно длинной стороне перфорированного полотна в соответствии с шириной перфорированного полотна не менее двух клеящих лент. Клеящие ...

ИЗДЕЛИЕ, СОДЕРЖАЩЕЕ ЭФФЕКТИВНЫЙ ПРИ КРАТКОВРЕМЕННОМ ПРИЖАТИИ КЛЕЙ, ИМЕЮЩЕЕ УЛУЧШЕННУЮ АДГЕЗИЮ К ПЛАСТИФИЦИРОВАННОМУ ПОЛИВИНИЛХЛОРИДУ, И СПОСОБ СОЕДИНЕНИЯ ПЛАСТИФИЦИРОВАННОГО ПВХ С ОСНОВОЙ С ПОМОЩЬЮ ЭФФЕКТИВНОГО ПРИ КРАТКОВРЕМЕННОМ ПРИЖАТИИ КЛЕЯ (ЕГО ВАРИАНТЫ)

Изобретение в целом относится к изделиям с надписями, таким, как светоотражающие и светонеотражающие изделия. Описывается изделие, содержащее: (а) слой эффективного при кратковременном прижатии клея, содержащего сшитый сополимер из 100 мас.ч. мономера позиции (i), (ii), (iii) и необязательно (iv), отличающийся тем, что сополимер включает: (i) приблизительно от 50 до 90 мас. ч. по меньшей мере одного мономера, выбранного из группы, состоящей из первого монофункционального акрилатного или метакрилатного эфира нетретичного алкилового спирта и их смесей, алкильная группа которых содержит приблизительно от 4 до 12 атомов углерода, который, как гомополимер, имеет температуру стеклования менее чем -25oС; (ii) приблизительно от 10 до 25 мас.ч., способных к сополимеризации N,N-диалкилзамещенных амидов; (iii) приблизительно от 5 до 7 мас.ч. кислого мономера, способного к сополимеризации с мономерами позиции (i) и со способными к сополимеризации N,N-диалкилзамещенными амидами позиций (ii), при этом ...

Содержащее частицы клеящее средство для соединения двух частей транспортного средства

СИСТЕМА ПОКРЫТИЯ НА ВОДНОЙ ОСНОВЕ С УЛУЧШЕННОЙ АДГЕЗИЕЙ К ПОДЛОЖКАМ С ПОКРЫТИЕМ И ПОДЛОЖКАМ БЕЗ ПОКРЫТИЯ, В ТОМ ЧИСЛЕ К КОРРОЗИЙНО-СТОЙКОЙ НЕРЖАВЕЮЩЕЙ СТАЛИ

... 1. Способ покрытия грузового контейнера, включающий стадии, на которых:обеспечивают грузовой контейнер или его один или более компонентов, при этом грузовой контейнер, по меньшей мере, по существу, соответствует международному стандарту, применимому к грузовым контейнерам, которые транспортируют при помощи, по меньшей мере, одной из морской грузовой системы, которая транспортирует груз по водным путям, системы, которая транспортирует груз по железной дороге, и/или системы, которая транспортирует груз по дорожному полотну, и при этом, по меньшей мере, часть подвергаемой воздействию среды поверхности грузового контейнера или его одного или более компонентов включает, по меньшей мере, один сплав из нержавеющей стали;используют, по меньшей мере, водный состав покрытия с формированием покрытия на, по меньшей мере, подвергаемой воздействию среды поверхности грузового контейнера из нержавеющей стали или его одного или более компонентов, при этом водный состав покрытия включает ингредиенты, содержащие ...

Состав для пластификации пленки из поливинилбутираля

Klebendes Laminat

Verwendung eines latentreaktiven Klebefilms zur Verklebung von eloxiertem Aluminium mit Kunststoff

Zur Verklebung von eloxiertem Aluminium mit Kunststoff wird ein Produkt mit mindestens einer Schicht eines latentreaktiven Klebefilms, der eine thermoplastische Komponente, die eine Schmelztemperatur T(Schmelz) mit 35°C T(Schmelz) 90°C, insbesondere 40°C T(Schmelz) 60°C, aufweist und funktionelle Gruppen enthält, die mit Isocyanat reagieren können, und eine Isocyanat-haltige Komponente, die partikulär in die thermoplastische Komponente eindispergiert vorliegt und im Bereich der Partikeloberfläche im Wesentlichen desaktiviert ist, wobei die Partikel eine Anspringtemperatur T(Anspring) von 40°C T(Anspring) 100°C, insbesondere 45°C T(Anspring) 75°C, aufweisen und wobei T(Anspring) T(Schmelz) ist, enthält, verwendet. Laminate aus eloxiertem Aluminium dem genannten Klebeprodukt und Kunststoff finden insbesondere in der Elektronikindustrie, z.B. bei Mobiltelefonen oder Laptop-Computern Anwendung.

Rhodium enthaltende Trennmittel-Überzugsmischungen.

Sealant tape comprising offsetting particles

Pattern layer to be adhered to living body

... [Problem] Patent Literature 1 discloses a fresh flower for a gift in which a design formed on a punched stencil sheet is drawn by pressing the stencil sheet against a petal and applying cosmetic powder onto a punched portion. However, when ink is adhered to a surface of a living body, the ink is absorbed into the living body, and thus the design gradually disappears. [Solution] The present disclosure provides a pattern layer to be adhered to a living body, characterized in that: the pattern layer has a surface layer and a bonding layer; the bonding layer has a function of adhering to a surface of the living body; dye drawing a design is fixed so as to be held between the surface layer and the bonding layer; and the bonding layer is made of a substance not allowing permeation of the dye.

HEAT-ACTIVATE-CASH FOILS FOR THE ADJUSTMENT OF METAL PARTS ON PLASTICS

HEAT-ACTIVATE STICK TOGETHER-CASH TWO DIMENSIONAL ELEMENT

MEHRSCHICHTFOLIE AND SELF ADHESIVE VOLUME.

EINLAGIGE BATTERY LABEL WITH LACQUER WITH EXAMINED EDGES

METHOD FOR GLUING FPCB'S

Multilayer film for resealable packaging having improved resealing

... 1) Multilayer film comprising two thin layers D and E of a thermoplastic material bonded to one another by a continuous layer A consisting of a hot-melt pressure-sensitive adhesive composition comprising: - from 40 to 70% by weight of a composition formed of styrene block copolymers 0 consisting of a mixture of diblock and triblock copolymers; and - from 30 to 60% by weight of one or more tackifying resins with a softening temperature of between 5 and 140'C; said multilayer film being such that the adhesive layer A is: - connected to the layer D via a tie layer B, and 5 - connected to the layer E via a tie layer C, each of the two layers B and C being respectively composed of a composition comprising a polyethylene or polypropylene which are modified by a cyclic anhydride of an unsaturated acid having from 4 to 8 carbon atoms. 2) Process for the manufacture of said film by coextrusion. 0 3) Use of said film for the manufacture of resealable packagings.

Use of shear to incorporate tilt into the microstructure of reversible gecko-inspired adhesives

The present invention relates to an easy, scalable method, relying on conventional and unconventional techniques, to incorporate tilt in the fabrication of synthetic polymer-based dry adhesives mimicking the gecko adhesive system. These dry, reversible adhesives demonstrate anisotropic adhesion properties, providing strong adhesion and friction forces when actuated in the gripping direction and an initial repulsive normal force and negligible friction when actuated in the releasing direction.

Improved sealant strip and method of forming lap joints

The present invention relates to a form of lap joint (2) for forming a water-tight joint between sheet materials (10, 20) comprising a sealant strip (40) between 2 sheets of material (10, 20), the sheets of material being held about the sealant strip by means of a plurality of fasteners (30, 30'). The sealant strip comprises a pliable sealant material in which is embedded, along the length of the strip, one or more elastomeric cords (52, 52'). The invention provides an improved form of construction such that sealant in a non-hardened form, such as before setting or when of a non-setting form is not extruded from a joint overtime and thus the integrity of the joint is maintained.

Cling films having a microreplicated topography and methods of making and using same

ADHESIVE COMPOUNDS OF BUTYL-TYPE RUBBER

The present invention relates to a substantially gel-free sealant or adhesive compound comprising butyl-type polymer without any conjugated aliphatic diene in its composition having an average molecular weight Mn of more than 20,000 g/mol and containing less than 15 wt.% of solid matter insoluble in boiling cyclohexane under reflux for 60 min. In another of its aspects, the present invention relates to a self- supporting shaped article comprising said compound optionally layered on or interposed between one or more supporting means. In still another of its aspects, the present invention relates to a tape comprising said substantially gel-free compound optionally layered on or interposed between one or more supporting means. In still another of its aspects, the present invention relates to an adhesive composition comprising said substantially gel-free compound. In still another of its aspects, the present invention relates to a sealant composition comprising said substantially gel-free compound ...

ULTRAVIOLET-CURED PRESSURE-SENSITIVE ADHESIVE TAPE OR FILM WITHOUT SUPPORTING SUBSTRATE

A pressure-sensitive adhesive tape or film obtained by curing a UV-curable pressure-sensitive adhesive composition containing a UV-curable polymer or oligomer, wherein the UV curing is controlled to give a higher degree of cure to one surface of the pressure-sensitive adhesive tape or film than that on the opposite surface and thereby the pressure-sensitive adhesive property is suppressed on the one surface and maintained on the opposite surface.

STRETCH RELEASING ADHESIVE TAPE WITH INTEGRAL PULL TAB

An elongated length of a single or double-sided stretch releasing adhesive tape that can be cut to a selected length with integral pull tabs for stretch removing the tape from a substrate. The stretch releasing adhesive tape can be provided as long strips or roll form. The elongated stretch releasing adhesive tape article includes an elongate length of stretch releasing adhesive tape defining a longitudinal axis. The stretch releasing adhesive tape has a first surface and a second non-adhesive surface. The first surface comprises one or more adhesive regions and one or more non-adhesive regions arranged along the longitudinal axis. At least a portion of the non-adhesive regions comprise a series of pull tabs arranged along the longitudinal axis that can be grasped in combination with the second non-adhesive surface by a user during stretch removal of the tape from an associated substrate.

COPPER ALLOY ADHESIVE ANTIBACTERIAL COATING FOR HIGH-TOUCH SURFACES

La présente invention ce présente comme un revêtement adhésif composé de cuivre et/ou d'alliage de cuivre pouvant être appliqué sur des éléments fréquemment touchés tels que les poignées de porte, les plaques de propreté, le mobilier, les brancards, les pieds à perfusion, les interrupteurs, etc. Le cuivre et/ou les alliages utilisés sont principalement : C11000, C51000, C70600, C26000, C75200 et C28000. Une feuille de de l'un de ces métaux est joint à un adhésif de haute efficacité comme l'acrylique qui à son tour est recouvert d'un papier protecteur, semblable à du papier ciré afin de protéger l'adhésif. Il sera retiré juste au moment de l'application de l'invention. Selon l'utilisation, différente épaisseur de matériaux peuvent être utilisé ...

THERMOPLASTIC ADHESIVE FILM

The objective of the present invention is to provide a thermoplastic adhesive film capable of, in a thermobonding step of a laminated body of different materials used particularly in automobile members, electronic members, construction members, etc., such as a polypropylene resin material, a polyamide resin material, and a metal material such as aluminum or steel plates, preventing deformation of the resin material and peeling due to thermal history after molding. Provided as a solution is a thermoplastic adhesive film comprising a resin composition (D) which contains a thermoplastic olefin elastomer resin (A), an acid-modified polypropylene resin (B) and a nucleating agent (C).

DOUBLE-SIDED TAPE FOR AUTOMATIC DISPENSING GUN

A roll of tape for use in an automatic tape gun (10) that includes an adhesive layer (14) having a liner-side surface and an exposed-side surface and a release-liner (16) adhering to the liner-side surface of the adhesive layer (14). The adhesive-layer (14) thickness and the release-liner (16) are selected such that the ratio of tape length to roll diameter on a standard 1.375 in. roll core, where the tape roll has a standard outer diameter of approximately 3.1875 in., is substantially greater than that about 400:1, whereby tape of extended length is usable on standard tape guns (10) to minimize tape-roll changeovers. Version of tape having length to roll diameter ratios greater than about 500:1 are also disclosed along with length to roll diameter ratios greater than 800:1 for tape rolls having a standard outer diameter of approximately 4.3125 inches.

ADHESIVE SYSTEM FOR ADHERING POLAR TO NON-POLAR SURFACES

A multi-component adhesive system for adhering polar surfaces to non-polar surfaces comprising: a) a non-polar adhesive layer for bonding to a non-polar surface; and b) polar adhesive layer bonded to said non-polar adhesive layer for bonding to a polar surface.

ADHESIVE PRODUCT AND TRANSFERRING INSTRUMENT

An adhesive product which has excellent glue cutting performance and provides an excellent finish to the pasted portion while effectively maintaining security is provided. An adhesive layer 10 is formed through pattern application, where an adhesive 100 is intermittently placed on the surface of a film 12, so that a broken paper phenomenon, such that the surface layer portion of a flap F1 or the vicinity of opening F2 adheres to the surface of the adhesive layer 10, and a white envelope F is ripped in the direction of the thickness, can be caused when a peeling movement for peeling the flap F1 from a state where the white envelope F is sealed via the adhesive layer 10.

ADHESIVE ARTICLES WITH IMPROVED AIR EGRESS AND METHODS OF MAKING THE SAME

This invention relates to an adhesive article (10) which provides air egress. Air egress is provided by supplying a route, such as areas (13) of no initial adhesion for the air to flow out from under the construction. The invention relates to an adhesive article (10) comprising a facestock (11) having a front and back surface, a continuous layer of adhesive (12) having an upper and lower surface wherein the upper surface is adhered to the back surface of the facestock (11), and a plurality of spaced-apart non-adhesive material (13) which is in contact with the lower surface of the adhesive layer (12) wherein the lower surface of the adhesive layer (12) has a Sheffield roughness of at least about 10 and the adhesive article (1) provides air egress. The invention also relates to methods of preparing the adhesive articles. These articles have usefulness as industrial graphic images, as well as decorative coverings, etc. The articles provide air egress and optionally repositionability and slideability ...

LAMINATE AND SELF-ADHESIVE TAPE

There are disclosed a laminate comprising (a) a biaxially oriented film of a styrenic polymer having a high degree of syndiotactic configuration of 10 to 100 .mu.m in thickness and (b) a rubber-based self-adhesive layer of 5 to 80 .mu.m in thickness and a self-adhesive tape comprising the above-mentioned laminate. The above laminate and selfadhesive tape are excellent in transparency, heat resistance, water resistance, moisture resistance, dispenser and hand cuttability, insulating properties and mechanical properties such as elasticity and nerve and can find a wide range of effective application.

SULFONATED 2,2'-BIS(DIPHENYLPHOSPHINOMETHYL) -1,1'-BINAPHTHALENES, PROCESS FOR THEIR PREPARATION AND THEIR USE IN A PROCESS FOR THE HYDROFORMYLATION OF OLEFINICALLY UNSATURATED COMPOUNDS

The invention relates to novel sulfonated diphosphines of the formula in which Ar is m-C6H4SO3M, M is hydrogen, ammonium, a monovalent metal or the equivalent of a polyvalent metal, Ph is the phenyl radical, m is identical or different and has the value 1 or 2 and n is identical or different and is 0, 1 or 2, to their preparation and to the hydroformylation of olefins and olefinically unsaturated compounds using these compounds as a constituent of water-soluble catalyst systems for the hydroformylation of olefins and olefinically unsaturated compounds.

Composite hot melt adhesive film and method of manufacturing the same network.

Ein Verbund-Heissschmelz-Klebenetzfilm und Herstellungsverfahren desselben, insbesondere, ein Verbund-Heissschmelz-Klebenetzfilm und Herstellungsverfahren desselben zum Anhaften eines Metalls an ein unpolares Material werden offenbart. Der Netzfilm wird aus einem polaren Polyamid-Heissschmelz-Kleber und einem unpolaren Polyolefin-Heissschmelz-Klebenetzfilm zusammengesetzt, der einen Vermittler enthält, und eine hohe Klebkraft sowie eine anhaltende und stabile Haftung aufweist, besonders geeignet für das Verbinden und Zusammensetzen metallischer Materialien, wie Edelstahl, Aluminium und Kupfer, und unpolarer Polymere, wie Polyethylen und Polypropylen. Das Herstellungsverfahren wird in einem einzigen Herstellungsverfahrenssatz von Rohstoffvorbehandlung bis zur abschliessenden Herstellung des Heissschmelz-Klebenetzfilmprodukts abgeschlossen, wodurch Herstellungsfehler grösstenteils ausgeschlossen, die Herstellungseffizienz erhöht und die Kosten gesenkt werden.

Hot melt adhesive and process for producing the same.

Ein Schmelzkleber und ein Verfahren zu seiner Herstellung werden offenbart, insbesondere ein Schmelzkleber zum Verkleben von Aluminium, Edelstahl und anderen metallischen Werkstoffen und PVC-Kunststoffen. Zunächst wird das jeweilige Copolyamid vom Typ Nylon durch Zusammenstellen von bestimmten Rohstoffen und deren Prozentanteilen hergestellt, und in Kombination mit günstigen Bindungseigenschaften des Copolyamids vom Typ Nylon für Metalle und günstigen Bindungseigenschaften des Perchlorethylenharzes für PVC wird ein Doppelschneckenextruder verwendet, um eine ausreichende Schmelzmischung des Copolyamids vom Typ Nylon und des Perchlorethylenharzes unter den synergistischen Wirkungen entsprechender Hilfsmittel durchzuführen, sodass der erhaltene neuartige Schmelzkleber günstige Bindungseigenschaften sowohl für Metalle als auch für PVC hat.

Set wrist-clasp.

L’invention concerne un ensemble bracelet-fermoir comprenant un bracelet et un fermoir (3). Le bracelet comprend un premier brin de bracelet (1) et un second brin de bracelet (2) faits dans une matière souple. Le fermoir (3) peut prendre un état ouvert et un état fermé. Le premier brin de bracelet (1) est attaché au fermoir (3). Le second brin de bracelet (2) peut être glissé dans le fermoir (3) lorsque ce dernier est dans son état ouvert jusqu’à obtenir une longueur souhaitée du bracelet puis bloqué dans le fermoir (3) en fermant ce dernier. Le premier brin de bracelet (1) ou le fermoir (3) porte au moins un élément adhésif (4) et le fermoir (3) est agencé pour, dans son état fermé, maintenir le second brin de bracelet (2) en contact avec le ou les éléments adhésifs (4) afin de bloquer le second brin de bracelet (2) par adhésion.

Ensemble bracelet-fermoir.

L'invention concerne un ensemble bracelet-fermoir comprenant un bracelet et un fermoir (3). Le bracelet comprend un premier brin de bracelet (1) et un second brin de bracelet (2) faits dans une matière souple. Le fermoir (3) peut prendre un état ouvert et un état fermé. Le premier brin de bracelet (1) est attaché au fermoir (3). Le second brin de bracelet (2) peut être glissé dans le fermoir (3) lorsque ce dernier est dans son état ouvert jusqu'à obtenir une longueur souhaitée du bracelet puis bloqué dans le fermoir (3) en fermant ce dernier. Le premier brin de bracelet (1) ou le fermoir (3) porte au moins un élément adhésif (4) et le fermoir (3) est agencé pour, dans son état fermé, maintenir le second brin de bracelet (2) en contact avec le ou les éléments adhésifs (4) afin de bloquer le second brin de bracelet (2) par adhésion.

Set wrist-clasp.

L’invention concerne un ensemble bracelet-fermoir comprenant un bracelet et un fermoir (3). Le bracelet comprend un premier brin de bracelet (1) et un second brin de bracelet (2) faits dans une matière souple. Le fermoir (3) peut prendre un état ouvert et un état fermé. Le premier brin de bracelet (1) est attaché au fermoir (3). Le second brin de bracelet (2) peut être glissé dans le fermoir (3) lorsque ce dernier est dans son état ouvert jusqu’à obtenir une longueur souhaitée du bracelet puis bloqué dans le fermoir (3) en fermant ce dernier. Le premier brin de bracelet (1) ou le fermoir (3) porte au moins un élément adhésif (4) et le fermoir (3) est agencé pour, dans son état fermé, maintenir le second brin de bracelet (2) en contact avec le ou les éléments adhésifs (4) afin de bloquer le second brin de bracelet (2) par adhésion.

METAL PIPES WITH LAYER OF ANTICORROSIVE COATING POLYOLEFIN

MATERIALS FROM LINEAR LOW-DENSITY POLYETHYLENE FOR SELF EXPECT

SIDE PASSIVATION OF

High capacity easy release extended use adhesive devices

Adhesive film, adhesive composition for the same, and display member including the same

An adhesive film includes a cured product of a (meth)acrylic copolymer and has a refractive index from about 1.5 to about 1.6. An adhesive composition for preparing the adhesive film includes a (meth)acrylic copolymer of a monomer mixture. A display member includes the adhesive film coated on one or more surfaces of an optical film.

Polysulfone structural adhesive film and preparation method thereof

A resin sheet for the electronic component, the electronic component with protective film and a resin sheet for semiconductor device and manufacturing method thereof

Adhesives films

This invention comprises a film useful as an adhesive, a composition useful to make the film, and a laminate comprising the film contiguous with at least one metal substrate, at least one foam substrate or combination thereof. The composition comprises (a) at least one anhydride grafted olefin polymer, (b) at least one high density polyethylene, and (c) at least one elastomer which preferably has a tensile elongation at break of at least about 585%, a density of at most about 0.900 g/cm3 or a combination thereof. The anhydride grafted olefin polymer or combination thereof is preferably present in an amount of from about 20 to about 40 weight percent, the high density polyethylene or combination thereof is preferably present in an amount of from about 40 to about 60 weight percent, and the elastomer or combination thereof is preferably present in an amount of from about 17 to about 30 weight percent. Each anhydride grafted olefin polymer is independently most preferably a maleic anhydride ...

Adhesive agent and adhesive sheet

An adhesive compositon of the present invention is characterized by including: an acrylic copolymer (A) containing 30 to 77% by weight of a structural unit (a1) derived from an alkyl acrylate monomer in which an alkyl group has 5 to 20 carbon atoms; 20 to 60% by weight of a structural unit (a2) derived from an alicyclic group-containing (meth)acrylate monomer; 0.01 to 5% by weight of a structural unit (a3) derived from a tertiary amino group-containing monomer that is derived from (meth)acrylic acid; and 0.1 to 10% by weight of a structural unit (a4) derived from a monomer containing a functional group excluding tertiary amino groups; ; and a crosslinking agent (B), According to the present invention, it is possible to provide an adhesive composition capable of allowing the crosslinking reaction with a crosslinking agent to proceed smoothly and also shortening the period for stabilizing the adhesive composition without the use of heavy metals whose adverse impacts on the environment are ...

Gas barrier film laminate, adhesive film, and electronic component

The present invention relates to a gas barrier film laminate that includes at least two sheets of gas barrier films, in which the two adjacent sheets of gas barrier films are laminated via an adhesive layer, and the adhesive layer has a shear load reduction rate (alpha) of 70% or less as expressed in the formula (I) in claim 1, an electronic component that comprises the gas barrier film laminate, and an adhesive film that comprises the adhesive layer which has a shear load reduction rate (alpha) of 70% or less as expressed in the formula (I) in claim 11. Provided is a gas barrier film laminate that has excellent water vapor barrier properties and is unlikely to have a poor appearance such as one having bubbles even in a case where the gas barrier film laminate is placed for a long period of time under high temperature and high humidity conditions, the electronic component that comprises the gas barrier laminate, and the adhesive film that is useful for manufacturing the gas barrier film ...

Conductive carbon material dispersant and conductive carbon material dispersion

Adhesive film

Temporary adhesive material, wafer processing body for wafer processing, and method for manufacturing thin wafer using the same

Adhesive composition

ADHESIVE FILM THAT CAN BE RETICULATED AND PROCEEDED Of ASSEMBLY USING SUCH a FILM

COMPOSITION D'ETANCHEITE ET COMPOSITION ET BANDE ADHESIVES POUR MEMBRANES DE COUVERTURE

L'INVENTION CONCERNE UNE COMPOSITION D'OBTURATION ETANCHE A BASE DE CAOUTCHOUC BUTYLE. ELLE COMPREND DU CAOUTCHOUC BUTYLE, UN AGENT DE RETICULATION DE CE CAOUTCHOUC BUTYLE, UN ACTIVATEUR DE RETICULATION, AU MOINS UN AGENT D'ADHESIVITE COMPATIBLE AVEC LE CAOUTCHOUC BUTYLE, AU MOINS 2 PARTIES DE NOIR DE CARBONE POUR 100PARTIES DE CAOUTCHOUC BUTYLE, DE L'OXYDE DE ZINC ET UN CONSTITUANT CONTENANT DU SOUFRE. LA COMPOSITION AINSI OBTENUE PEUT NOTAMMENT ETRE APPLIQUEE SUR LA SURFACE INTERIEURE D'UN PNEUMATIQUE 10 AFIN DE FORMER UNE COUCHE 24 EMPECHANT LE PNEUMATIQUE 10 DE SE DEGONFLER EN CAS DE CREVAISON. DOMAINE D'APPLICATION: PNEUMATIQUES POUR VEHICULE, MATERIAUX DE COUVERTURE, ETC.

PROCEDE DE COLLAGE DE DEUX ARTICLES DONT L'UN AU MOINS CONTIENT DE L'HUMIDITE

PROCEDE DE COLLAGE PERFECTIONNE DANS LEQUEL ON INTERPOSE ENTRE LES ARTICLES A COLLER, DONT L'UN AU MOINS CONTIENT, DANS LES CONDITIONS NORMALES, AU MOINS 1 DE SON POIDS D'HUMIDITE, UNE MATIERE ADHESIVE RETICULABLE SOUS L'ACTION DE L'HUMIDITE, ET ON CHAUFFE L'ASSEMBLAGE SOUS PRESSION POUR PROVOQUER LA RETICULATION DE L'ADHESIF SOUS L'ACTION DE LA VAPEUR D'EAU LIBEREE A PARTIR DE L'ARTICLE HUMIDE. LA MATIERE ADHESIVE CONSISTE EN UNE FEUILLE, UNE PELLICULE OU UN RUBAN D'UNE RESINE ETOU D'UN CAOUTCHOUC ADHESIFS THERMOFUSIBLES CONTENANT D'ENVIRON 0,1 A 20 DE LEUR POIDS D'UN GROUPE CARBOXYLE ET PAS PLUS D'ENVIRON 0,5 EN POIDS D'HUMIDITE LIBRE, LA RESINE ETOU LE CAOUTCHOUC CONTENANT EN OUTRE, EN DISPERSION UNIFORME, UNE POUDRE D'UN OXYDE D'UN METAL DU GROUPE IIA DE LA CLASSIFICATION PERIODIQUE DES ELEMENTS, A UN DIAMETRE DE PARTICULES MOYEN D'ENVIRON0,1 A 1000M. L'OXYDE METALLIQUE PRESENT DANS L'ADHESIF PROVOQUE LA RETICULATION DE CE DERNIER QUI, DES LORS, N'EST PLUS FUSIBLE A LA CHALEUR.

METHOD OF COVERING AN ELEMENT WITH A SELF-CUTTING FILM

구조용 혼성 접착제

... 접착제 조성물이 제공되며, 본 접착제 조성물은 a) 에폭시 수지를 포함하는 베이스 수지; b) 제1 에폭시 경화제; 및 c) 제2 에폭시 경화제를 포함하며, 제1 에폭시 경화제 및 제2 에폭시 경화제는, 제1 에폭시 경화제가 조성물 내의 에폭시 수지와 실질적으로 반응하게 하는 온도 및 지속시간의 조건 하에서 제2 에폭시 경화제가 조성물 내에 실질적으로 미반응인 상태로 남아 있을 수 있도록 선택된다. 일부 실시 형태에서, 제1 에폭시 경화제는 조성물 내의 에폭시 수지와 실질적으로 반응하고, 제2 에폭시 경화제는 조성물 내에서 실질적으로 미반응한다. 일부 실시 형태에서, 접착제 조성물은 접착 필름의 형태로 사용된다.

Adhesive Composition, Process for Producing the Same, Adhesive Film Made with the Same, Substrate for Semiconductor Mounting, and Semiconductor Device

이방성 도전 필름, 이방성 도전 필름의 제조 방법, 접속체의 제조 방법 및 접속 방법

... 본 발명은 이방성 도전 필름을 사용한 접속에 있어서, 접속 후의 기판 휨의 저감을 도모하는 것을 목적으로 한다. 이방성 도전 필름(23)은 제1 절연성 접착제층(30)과, 제2 절연성 접착제층(31)과, 제1 절연성 접착제층(30) 및 제2 절연성 접착제층(31)에 끼움 지지되고, 도전성 입자(32)가 절연성 접착제(33)에 함유된 도전성 입자 함유층(34)을 갖고, 도전성 입자 함유층(34)과 제1 절연성 접착제층(30) 사이에 기포(41)가 함유되고, 도전성 입자 함유층(34)은 제2 절연성 접착제층(31)과 접하는, 도전성 입자(32)의 하부의 경화도가 다른 부위의 경화도보다도 낮은 것이다.

AGGREGATE OF FIBROUS COLUMNAR STRUCTURES AND PRESSURE-SENSITIVE ADHESIVE MEMBER USING THE SAME

Low dielectric adhesive number composition

이방성 도전 필름, 접속 방법 및 접속 구조체

... 본 발명에서는, 극성기를 갖는 화합물을 함유하는 플렉시블 인쇄 기판과 알칼리 유리 기판을 저온이면서 양호한 접착력으로 접속한다. 단자(10)가 형성된 제1 전자 부품(11)과, 단자(12)가 형성된 제2 전자 부품(13)을 전기적으로 접속하는 이방성 도전 필름(21)에 있어서, 라디칼계 경화제와, 아크릴 수지와, 에폭시 수지와 도전성 입자(20)를 함유하는 도전성 입자 함유층(22)과, 양이온계 경화제와 에폭시 수지와 아크릴 수지와 라디칼계 경화제를 함유하는 절연성 접착층(23)을 갖는다.

Adhesive Film and Encapsulation Method of Organic Electronic Device Using the Same

... 본 발명은 접착제, 이를 이용한 유기전자장치 봉지 제품 및 유기전자장치의 봉지 방법에 관한 것으로서, 더욱 상세하게는 유기전자장치를 봉지하는 접착제로서, 상기 접착제는 경화성 수지 및 수분 흡착제를 포함하고, 상기 접착제는 유기전자장치의 봉지 시에 유기전자장치와 접촉하는 제 1 영역과 유기전자장치와 접촉하지 않는 제 2 영역을 포함하며, 상기 접착제 내의 전체 수분 흡착제의 질량을 기준으로 상기 제 1 영역에는 0 내지 20%, 상기 제 2 영역에는 80 내지 100%의 수분 흡착제를 포함하는 접착제 및 이를 이용한 유기전자장치의 봉지 방법을 제공한다.

NANOTUBE-BASED DIRECTIONALLY-CONDUCTIVE ADHESIVE

WATERPROOFING NFC PACKAGE, CLOTHES-SUBSIDIARY MATERIALS USING SAME AND INFORMATION PROVIDING SYSTEM USING SAME

The present invention provides an NFC package which is applicable to clothes-subsidiary materials being frequently washed because waterproof property and moisture-proof properties are ensured, and does not degrade, if attached to clothes such as clothing labels, the feeling of wearing when a user wears the clothes and touches a part of the clothes where the NFC package is installed. The NFC package according to the present invention comprises a flexible NFC film; a flexible waterproof film provided on both the upper and lower surfaces of the NFC film, having waterproof and moisture-proof properties, and formed in a thin film type; and a flexible adhesive member applied in the form of a thin film between the NFC film and the waterproof film. COPYRIGHT KIPO 2017 ...

점착 조성물, 점착 필름 및 점착 필름을 적용하는 방법

... 제1 모노머, 제2 모노머, 제3 모노머 및 제4 모노머를 포함하는 모노머 성분의 공중합체를 포함하고, 상기 제1 모노머가 2-에틸헥실 아크릴레이트(2-Ethylhexyl acrylate, 2-EHA)이고, 상기 제2 모노머가 부틸 메타크릴레이트(Butyl metacrylate, BMA), 에틸 메타크릴레이트(Ethyl metacrylate, EMA), 2-에틸헥실 메타크릴레이트(2-Ethylhexyl methacrylate, 2-EHMA), 또는 이들 모두를 포함하고, 상기 제3 모노머가 아크릴산(Acrylic acid, AA)이며, 상기 제4 모노머가 N-비닐-2-피롤리돈(N-vinyl-2-pyrrolidone, NVP) 모노머, 아크릴아미드 또는 이들 모두를 포함하는 점착 조성물을 제공한다.

PRESSURE-SENSITIVE ADHESIVE SHEET AND PRESSURE-SENSITIVE ADHESIVE COMPOSITION

ADHESIVE COMPOSITION, ADHESIVE SHEET AND OPTICAL MEMBER

The present invention relates to an adhesive composition having excellent productivity and endurance reliability, an adhesive sheet and an optical member. The gel fraction of the adhesive composition right after an adhesive layer is formed is more than or equal to 40% and less than or equal to 80%. After the adhesive composition is stored for seven days under the 23°C, 55% RH conditions from the formation of the adhesive layer, the gel fraction is more than or equal to 60% and less than or equal to 85%. COPYRIGHT KIPO 2018 ...

이방성 도전 필름, 이방성 도전 필름의 제조 방법, 접속체의 제조 방법 및 접속 방법

... 본 발명은 이방성 도전 필름을 사용한 접속에 있어서, 접속 후의 기판 휨의 저감을 도모하는 것을 목적으로 한다. 이방성 도전 필름(23)은 제1 절연성 접착제층(30)과, 제2 절연성 접착제층(31)과, 제1 절연성 접착제층(30) 및 제2 절연성 접착제층(31)에 끼움 지지되고, 도전성 입자(32)가 절연성 접착제(33)에 함유된 도전성 입자 함유층(34)을 갖고, 도전성 입자 함유층(34)과 제1 절연성 접착제층(30) 사이에 기포(41)가 함유되고, 도전성 입자 함유층(34)은 제2 절연성 접착제층(31)과 접하는, 도전성 입자(32)의 하부의 경화도가 다른 부위의 경화도보다도 낮은 것이다.

PRESSURE-SENSITIVE ADHESIVE TRANSFER TAPE WITH DIFFERENTIATED ADHESION ON EITHER SIDE AND METHOD FOR PRODUCING THE TAPE

이방성 도전 필름, 접속 방법, 및 접합체

... 제1 전자 부품의 단자와 제2 전자 부품의 단자를 이방성 도전 접속시키는 이방성 도전 필름으로서, 상기 이방성 도전 필름이, 적어도 도전성 입자, 양이온 경화성 수지, 양이온계 경화제, 유기 과산화물, 및 라디칼 포착제를 함유하고, 상기 유기 과산화물의 반응 개시 온도가, 상기 양이온계 경화제의 반응 개시 온도보다 높은 것을 특징으로 하는 이방성 도전 필름이다.

반도체 장치의 제조 방법

... 접속부를 가지는 반도체 칩 및 접속부를 가지는 배선 회로 기판을 구비하고, 각각의 접속부가 서로 전기적으로 접속된 반도체 장치, 또는, 접속부를 가지는 복수의 반도체 칩을 구비하고, 각각의 접속부가 서로 전기적으로 접속된 반도체 장치의 제조 방법이 개시된다. 접속부는 금속으로 이루어진다. 상기 방법은, (a) 반도체 칩 및 배선 회로 기판, 또는 반도체 칩끼리를, 사이에 반도체용 접착제를 개재한 상태에서, 접속부의 금속의 융점보다 낮은 온도에서, 각각의 접속부가 서로 접촉하도록 압착하여, 가접속체를 얻는 제1 공정과, (b) 가접속체의 적어도 일부를 봉지용 수지를 사용해서 봉지하여, 봉지 가접속체를 얻는 제2 공정과, (c) 봉지 가접속체를 접속부의 금속의 융점 이상의 온도에서 가열하여, 봉지 접속체를 얻는 제3 공정을 구비한다.

THERMALLY CONDUCTIVE ADHESIVE COMPOSITION AND THERMALLY CONDUCTIVE THIN FILM ADHESIVE SHEET MANUFACTURED THEREFROM

The present invention relates to a thermally conductive adhesive composition, capable of improving heat conductivity and minimizing delamination by hardening shrinkage, and to a thermally conductive thin film adhesive sheet manufactured therefrom. Disclosed is a thermally conductive adhesive composition for the same, comprising an acrylic-based resin, a thermally hardening agent, and at least two types of thermally conductive fillers. COPYRIGHT KIPO 2016 ...

ANISOTROPIC CONDUCTIVE FILM

METHODS FOR MAKING GLASS FIBER REINFORCED MATERIALS

A process for making a fibered composition, including providing a coatable composition with a polymerizable adhesive composition and inorganic fibers, polymerizing the coatable composition to produce a fibered bulk polymer, and hot melt coating the fibered bulk polymer onto a first substrate to form a dispensable fibered adhesive layer. The fibers in the adhesive layer preferably have a mean fiber lenght of about 10 mils (0.25 mm) to about 60 mils (1.50 mm) and a range of fiber lengths from about 1 mil (0.025 mm) to about 100 mils (2.50 mm). © KIPO & WIPO 2007 ...

접착시트 및 반도체 장치의 제조 방법

... 본 발명의 접착시트는, (A)고분자량 성분과, (B1)연화점이 50℃ 미만인 열경화성 성분과, (B2)연화점이 50℃ 이상 100℃ 이하인 열경화성 성분과, (C)연화점이 100℃ 이하인 페놀 수지를 포함하는 수지 조성물로 이루어지고, 그 수지 조성물 100질량%를 기준으로 하여, 상기 (A)고분자량 성분을 11∼22질량%, 상기 (B1)연화점이 50℃ 미만인 열경화성 성분을 10∼20질량%, 상기 (B2)연화점이 50℃ 이상 100℃ 이하인 열경화성 성분을 10∼20질량%, 상기 (C)연화점이 100℃ 이하인 페놀 수지를 15∼30질량% 함유한다.

화상 표시 장치 구성용 적층체의 제조 방법

... 실온 상태에서는, 시트 형상의 형상을 유지할 수 있고, 박리 가능한 정도의 부착성을 구비할 수 있고, 핫 멜트에 의해 유동성을 가지게 되고, 최종적으로는 가교하여 화상 표시 장치 구성 부재끼리를 강고하게 접착할 수 있는 새로운 화상 표시 장치 구성용 적층체의 제조 방법을 제공한다. 적어도 다음의 (1)∼(3)의 공정을 가지는 것을 특징으로 하는 화상 표시 장치 구성용 적층체의 제조 방법을 제안한다. (1) 가지 성분으로서 매크로 모노머를 구비한 그래프트 공중합체로 이루어지는 아크릴계 공중합체 (A)와, 가교제 (B)와, 광중합 개시제 (C)를 함유하는 점착제 수지 조성물을 제작하여, 당해 점착제 수지 조성물로 이루어지는 점착층을 구비한 단층 또는 다층의 투명 양면 점착재를 시트 형상으로 성형하는 공정. (2) 상기 투명 양면 점착재를 개재하여 2개의 화상 표시 장치 구성 부재를 부착하여 적층하는 공정. (3) 적어도 일방의 화상 표시 장치 구성 부재의 외측으로부터, 활성 에너지선을 투명 양면 점착재의 상기 점착층에 조사하고, 당해 점착층을 가교시켜, 2개의 화상 표시 장치 구성 부재를 접착시키는 공정.

가고정용 필름, 가고정용 필름 시트 및 반도체 장치

... 본 발명에 관련되는 가고정용 필름은, 반도체 웨이퍼를 지지체에 가고정용 필름을 통하여 가고정하는 가고정 공정과, 지지체에 가고정된 반도체 웨이퍼를 가공하는 가공 공정과, 가공된 반도체 웨이퍼를 지지체 및 가고정용 필름으로부터 분리하는 분리 공정을 구비하는 반도체 웨이퍼의 가공 방법에 사용되는 가고정용 필름으로서, (A)고분자량 성분 및 (B)실리콘 변성 수지를 함유하고, 110℃에서 30분간 및 170℃에서 1시간 가열된 후의 탄성률이 23℃에 있어서 0.1∼1000MPa이다.

라디칼 중합형 접착제 조성물, 및 전기 접속체의 제조 방법

... 본 발명의 라디칼 중합형 접착제 조성물은, 라디칼 중합성 화합물과, 열 라디칼 중합 개시제와, 카티온 중합성 화합물과 광산 발생제를 함유한다. 광산 발생제는 라디칼 중합형 접착제 조성물의 열 라디칼 중합 반응을 촉진시키는 성질을 가지며, 카티온 중합성 화합물의 라디칼 중합형 접착제 조성물 중의 함유량은, 광산 발생제 1 질량부에 대해 0.25 ∼ 3.75 질량부이다. 광산 발생제의 라디칼 중합형 접착제 조성물 중의 함유량은, 열 라디칼 중합 개시제 100 질량부에 대해 1.0 ∼ 30 질량부이다.

CONDUCTIVE LIGHT SHIELDING TAPE HAVING EXCELLENT CORROSION RESISTANCE AND MANUFACTURING METHOD THEREOF

The present invention relates to a conductive light shielding tape comprising a conductive bonding layer, a first conductive metal layer, an electrolytic copper foil, a second conductive metal layer, and a light shielding layer, and a manufacturing method thereof. According to the present invention, the conductive light shielding tape has an excellent light shielding characteristic and a superior electromagnetic wave shielding effect by a rising effect by the electrolytic copper foil, the first conductive metal layer, the second conductive metal layer, the light shielding layer, and the conductive bonding layer included therein. Furthermore, the first conductive metal layer and the second conductive metal layer are made of silver (Ag) to obtain an electromagnetic wave shielding effect and improve reliability (oxidation resistance). COPYRIGHT KIPO 2016 ...

THERMOSETTING RESIN COMPOSITION AND ADHESIVE FILM

A thermosetting resin composition which comprises the components (A) and (B) in a total amount of the components (A) and (B) of 90 wt% or above based on the composition; an adhesive film made from the composition; and laminated products produced by laying the adhesive film between adherends and thermosetting the obtained laminate: (A) at least one member selected from among amino acids and imidazoles, and (B) an epoxy-containing ethylenic copolymer obtained by polymerizing the components (b) and (b): (b) ethylene and/or propylene, and (b) a monomer represented by the general formula (1): (1) wherein R is a C hydrocarbon group having a double bond, at least one hydrogen atom of which group may be replaced by halogeno, hydroxyl, or carboxyl; and X is a single bond or carbonyl.12122-18 © KIPO & WIPO 2007 ...

자외선 경화형 점착 시트 및 점착 시트

... 본 발명이 해결하고자 하는 과제는, 단차 추종성, 시트 유지성, 내습열 백화성이 뛰어나고, 재단시에 칼날에 풀이 남지 않는 자외선 경화형 점착 시트를 제공하는 것이다. 본 발명은, 수산기 및/또는 카르복실기를 갖는 아크릴 수지 (A), 가교제 (B), 2개 이상의 (메타)아크릴로일기를 갖는 (메타)아크릴 화합물 (C), 유기용제 (D), 및, 광중합 개시제 (E)를 함유하는 점착제 조성물을 박리지에 도공하고, 유기용제 (D)를 건조시켜 얻어지는 자외선 경화형 점착 시트이며, 상기 자외선 경화형 점착 시트의 온도 20℃, 주파수 10-7Hz의 조건에서 측정한 저장 탄성률이, 5×103Pa을 초과하고 1×105Pa 이하인 것을 특징으로 하는 자외선 경화형 점착 시트를 제공하는 것이다.

Adhesive article

전기-광학 어셈블리용 폴리우레탄 접착제 층

... 본원에서 사용하기 위한 전기-광학 어셈블리 및 관련 재료 (예를 들어, 접착제) 가 일반적으로 제공된다. 접착제 층은 엔드-캡핑된 폴리우레탄을 포함할 수 있다. 일부 접착제 층는 2 이상의 반응성 관능기 (예를 들면, 2 이상의 관능기 중 적어도 하나가 가교를 형성하도록 1 이상의 경화 종과 반응하도록 구성된 반응성 관능기) 를 포함한다. 접착제는 또한 하나 이상의 반응성 관능기를 포함하는 사슬 연장제를 포함할 수 있다. 일부 실시형태에서, 접착제는 하나 이상의 반응성 관능기를 하나 이상의 경화 종과 반응시킴으로써 경화된다. 접착제의 경화는 2 이상의 경화 단계를 포함할 수 있다. 일부 실시형태에서, 접착제 층은 하나 이상의 가교제를 포함할 수 있다.

AGGREGATE OF FIBROUS COLUMNAR STRUCTURES AND PRESSURE-SENSITIVE ADHESIVE MEMBER USING THE SAME

챔버 구성부품들을 연결하기 위해 이용되는 접착제 재료

... 본 발명의 실시예들은 반도체 프로세싱 챔버 구성부품들을 연결하기에 적당한 강건한 본딩 재료를 제공한다. 다른 실시예들은 희망하는 특성들을 갖는 접착제 재료를 이용하여 연결된 반도체 프로세싱 챔버 구성부품들을 제공한다. 하나의 실시예에서, 반도체 챔버 구성부품들을 연결하기에 적당한 접착제 재료는 300 psi보다 낮은 영률(Young's modulus)을 갖는 접착제 재료를 포함한다. 또 다른 실시예에서, 반도체 챔버 구성부품은 제 2 표면에 인접하게 배치된 제 1 표면과, 제 1 및 제 2 표면들을 결합하고 300 psi보다 낮은 영률을 가지는 접착제 재료를 포함한다.

ADHESIVE SHEET BASED ON NITRILE RUBBER BLENDS FOR ATTACHING METAL PARTS TO PLASTICS

Heat-activable adhesive sheet furnished with an adhesive comprising a blend of at least three synthetic nitrile rubbers, S1, S2 and S3, and at least one reactive resin which is capable of crosslinking with itself, with other reactive resins and/or with the nitrile rubbers S1, S2 and S3, a) the blend of the heat-activable sheet being microphase-separated, characterized by at least three different glass transition temperatures in the DSC, b) the blend of the heat-activable sheet possessing at least 3 glass transition temperatures, at least one glass transition temperature being greater than 10°C and one glass transition temperature lower than-20°C, c) the nitrile rubber or rubbers S1 having an acrylonitrile fraction of greater than/equal to 35%, d) the nitrile rubber or rubbers S2 having an acrylonitrile fraction of greater than 25% and less than 35%, e) the nitrile rubber or rubbers S3 having an acrylonitrile fraction of less than/equal to 25%. © KIPO & WIPO 2008 ...

ADHESIVE SHEET

조성물, 시트의 제조 방법, 시트, 적층체 및 디바이스 웨이퍼 부착 적층체

... 엘라스토머의 용해성이 양호하여, 고형분 농도를 높일 수 있고, 건조성, 면 형상 및 내열성이 우수한 막을 형성할 수 있는 조성물, 시트의 제조 방법, 시트, 적층체 및 디바이스 웨이퍼 부착 적층체를 제공한다. 이 조성물은, 25℃부터, 20℃/분으로 승온한 5% 열질량 감소 온도가, 375℃ 이상인 엘라스토머와, 하기 일반식 (1)로 나타나는 비점이 160℃ 이상인 용제와, 비점이 120℃ 미만인 용제를 포함한다. 일반식 (1)에 있어서, R1~R6은, 각각 독립적으로, 수소 원자 또는 지방족 탄화 수소기를 나타낸다.

점착제, 점착 시트 및 표시체

... 첩합(貼合)되는 측의 면에 단차(段差)를 갖는 하나의 표시체 구성 부재와 다른 표시체 구성 부재를 첩합하기 위한 점착제로서, 상기 점착제가, 중합체를 구성하는 모노머 단위로서 반응성 관능기 함유 모노머를 포함하는 (메타)아크릴산에스테르 중합체(A)와, 2관능 이상의 활성 에너지선 경화성 성분(B)과, 열가교성의 가교제(C)를 함유하는 점착성 조성물을 열가교 및 활성 에너지선 경화하여 이루어지고, 상기 점착성 조성물 중에 있어서의 상기 활성 에너지선 경화성 성분(B)의 함유량이, 상기 점착제의 겔분율(G1)과 상기 점착성 조성물로부터 상기 활성 에너지선 경화성 성분(B)을 제외한 점착성 조성물을 열가교하여 이루어지는 점착제의 겔분율(G2)이 실질적으로 동일해지는 양이며, 또한 두께 600㎛, 폭 10㎜의 점착제층으로 했을 경우에, 23℃, 50％ RH의 환경 하에서, 측정 길이 20㎜, 인장 속도 200㎜/분으로 파단 신도까지 신장했을 때의 최대 응력이 2.8N 이상인 점착제.

얼라인먼트 방법, 전자 부품의 접속 방법, 접속체의 제조 방법, 접속체, 이방성 도전 필름

... 얼라인먼트 마크를 이방성 도전 필름이 첩착되는 영역과 중첩되는 위치에 형성함과 함께, 카메라에 의한 촬상 화상을 사용한 얼라인먼트를 정밀도 양호하게 행한다. 투명 기판(12)의 표면에, 도전성 접착제(1)를 개재하여 전자 부품(18)을 탑재하고, 투명 기판(12)의 이면측으로부터 기판측 얼라인먼트 마크(21) 및 부품측 얼라인먼트 마크(22)를 촬상하고, 촬상 화상으로부터 양 얼라인먼트 마크(21, 22)의 위치를 조정하고, 투명 기판(12)에 대한 전자 부품(18)의 탑재 위치를 맞추는 얼라인먼트 방법에 있어서, 도전성 접착제(1)는, 평면으로 볼 때에 도전성 입자(4)가 규칙적으로 배열되고, 촬상 화상에 있어서, 양 얼라인먼트 마크(21, 22)의 외측가장자리의 가상 선분을 따라, 도전성 입자(4) 사이로부터 면하는 양 얼라인먼트 마크(21, 22)의 외측가장자리가 선분(S)으로서 단속적으로 나타나 있다.

METHOD FOR MANUFACTURING ADHESIVE FABRIC BY YARN COATED WITH POLYURETHANE REACTIVE HOT MELT RESIN

The present invention provides a resin for a coating yarn using a polyurethane reactive hot melt resin which manufactures a coating yarn by using an aqueous thermosetting polyurethane reactive hot melt resin having a block isocyanate, weaves the coating yarn into a fabric, and uses the fabric as a substitute for a shoe adhesive, thereby improving heat resistance and preventing a phenomenon of falling adhered since the fabric melts after attaching, in weaving an adhesive fabric capable of being used as the substitute for the adhesive (for example, a liquid adhesive or a hot melt film) used for the shoe. The resin for a coating yarn using a polyurethane reactive hot melt resin is composed by mixing the block isocyanate with thermosetting polyurethane. COPYRIGHT KIPO 2018 ...

다층 프린트 배선판용의 접착 필름

... 실리카 필러를 고충전화해도 요철의 매립성이 우수한 다층 프린트 배선판용의 접착 필름을 제공한다. 해당 접착 필름은, 구체적으로는, (A) 중량 평균 분자량 (Mw)와 수 평균 분자량 (Mn)의 분산비 (Mw/Mn)이 1.05 내지 1.8인 노볼락형 페놀 수지와, (B) 일반식 (1)로 표현되는 에폭시 수지와, (C) 무기 충전재를 포함하는 수지 조성물을, 지지체 필름 위에 층 형성하여 이루어지는 수지 조성물층을 갖고, 해당 수지 조성물층 중의 (C) 무기 충전재의 평균 입경이 0.1㎛ 이상이고, (C) 무기 충전재의 함유량이, 수지 고형분 중 20 내지 95질량%인, 다층 프린트 배선판용의 접착 필름이다.

ENCAPSULATION FILM

저유전 접착제 조성물

... 본 발명은 종래의 폴리이미드 및 폴리에스테르 필름뿐만 아니라, LCP 등의 저극성 수지 기재(基材)나 금속 기재와 높은 접착성을 갖고, 높은 땜납 내열성을 얻을 수 있으며, 또한 저유전 특성이 우수한 접착제 조성물을 제공한다. 그 접착제 조성물은 하기 (A) 성분 및 (B) 성분을 함유하고, 또한 (C) 성분 및 (D) 성분 중 적어도 한쪽을 함유한다: (A) 성분: 결정성 산 변성 폴리올레핀, (B) 성분: 비결정성 폴리올레핀, (C) 성분: 카르보디이미드 수지, 및 (D) 성분: 에폭시 수지.

아크릴계 에멀젼 점착제 및 이의 제조 방법

... 본 발명은 알파-메틸스티렌 다이머를 특정 함량으로 포함함으로써, 우수한 중합 안정성을 통해 응집물의 발생을 최소화할 수 있으며, 이에 따라 우수한 응집력 및 점착력을 구현할 수 있는 아크릴계 에멀젼 점착제 및 이의 제조 방법에 관한 것이다.

pressure sensitive skin adhesive tape, double-sided, method for manufacturing the same and method for mounting an object onto a substrate

Adhesive composition, adhesive film including the same, method of preparing adhesive film, and display member using the same

A UV curable adhesive composition includes a morpholine group-containing (meth)acrylic copolymer.

Method for Producing Finely Structured Surfaces

A method for producing finely structured surfaces, in particular in plastics, includes a) applying at least one coating compound on at least one substrate; b) forming a fine structure by a die, which has the negative of a fine structure, c) curing the resultant finely structured coating compound, obtaining a substantially cured coating; and d) separating the finely structured coating from the die, wherein steps d) and c) can also be carried out in the reverse order.

PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND PRESSURE-SENSITIVE ADHESIVE SHEET

Disclosed is a pressure-sensitive adhesive composition capable of forming a pressure-sensitive adhesive layer having satisfactory tackiness at room temperature and superior reworkability at a low temperature. The pressure-sensitive adhesive composition includes an acrylic polymer formed from a monomer component through polymerization, or a partial polymer of the monomer component. The monomer component includes a (meth)acrylic alkyl ester whose alkyl moiety being a linear or branched-chain alkyl group having 10 to 13 carbon atoms and includes substantially no carboxyl-containing monomer. 1. A pressure-sensitive adhesive composition comprising an acrylic polymer formed from a monomer component through polymerization , or a partial polymer of the monomer component ,wherein the monomer component comprises a (meth)acrylic alkyl ester whose alkyl moiety being a linear or branched-chain alkyl group having 10 to 13 carbon atoms, and the monomer component comprises substantially no carboxyl-containing monomer.2. The pressure-sensitive adhesive composition of claim 1 , wherein the monomer component further comprises a polar-group-containing monomer.3. The pressure-sensitive adhesive composition of claim 2 , wherein the polar-group-containing monomer comprises at least one selected from the group consisting of hydroxyl-containing monomers and nitrogen-containing monomers.4. The pressure-sensitive adhesive composition of claim 1 , wherein the monomer component further comprises a (meth)acrylic alkyl ester whose alkyl moiety being a linear or branched-chain alkyl group having 1 to 9 carbon atoms.5. The pressure-sensitive adhesive composition of claim 1 , wherein the monomer component further comprises a (meth)acrylic ester having an alicyclic hydrocarbon group.6. The pressure-sensitive adhesive composition of claim 1 , wherein the (meth)acrylic alkyl ester whose alkyl moiety being a linear or branched-chain alkyl group having 10 to 13 carbon atoms comprises lauryl acrylate.7. A ...

DOUBLE-FACED PRESSURE-SENSITIVE ADHESIVE SHEET, DOUBLE-FACED PRESSURE-SENSITIVE ADHESIVE SHEET WITH RELEASE SHEET, PROCESS FOR PRODUCING SAME, AND TRANSPARENT LAMINATE

A double-faced pressure-sensitive adhesive sheet, including a first pressure-sensitive adhesive layer, and a second pressure-sensitive adhesive layer provided on one side of the aforementioned first pressure-sensitive adhesive layer, wherein a primary component of the first pressure-sensitive adhesive layer is a two-part acrylic pressure-sensitive adhesive (I), and a weight average molecular weight of the pertinent two-part acrylic pressure-sensitive adhesive (I) is 150,000-800,000, and wherein a primary component of the second pressure-sensitive adhesive layer is a two-part acrylic pressure-sensitive adhesive (II), and a weight average molecular weight of the pertinent two-part acrylic pressure-sensitive adhesive (II) is 900,000-2,000,000. 1. A double-faced pressure-sensitive adhesive sheet , comprising a first pressure-sensitive adhesive layer , and a second pressure-sensitive adhesive layer provided on one side of said first pressure-sensitive adhesive layer , wherein a primary component of the first pressure-sensitive adhesive layer is a two-part acrylic pressure-sensitive adhesive (I) , and a weight average molecular weight of said two-part acrylic pressure-sensitive adhesive (I) is 150 ,000-800 ,000 , and wherein a primary component of the second pressure-sensitive adhesive layer is a two-part acrylic pressure-sensitive adhesive (II) , and a weight average molecular weight of said two-part acrylic pressure-sensitive adhesive (II) is 900 ,000-2 ,000 ,000.2. The double-faced pressure-sensitive adhesive sheet according to claim 1 , wherein a weight average molecular weight of the two-part acrylic pressure-sensitive adhesive (I) is 350 claim 1 ,000-800 claim 1 ,000.3. The double-faced pressure-sensitive adhesive sheet according to claim 1 , wherein a thickness of the first pressure-sensitive adhesive layer is 1.5-fold to 100-fold of a thickness of the second pressure-sensitive adhesive layer.4. The double-faced pressure-sensitive adhesive sheet according to claim ...

Wafer process body, wafer processing member, wafer processing temporary adhesive material, and method for manufacturing thin wafer

Disclosed is a wafer process body, a temporary adhesive layer is formed on a supporting body, and a wafer having a circuit-formed front surface and a to-be-processed back surface is stacked on the temporary adhesive layer, wherein the temporary adhesive layer is provided with a first temporary adhesive layer including a non-aromatic saturated hydrocarbon group-containing organopolysiloxane layer (A) which is adhered to the front surface of the wafer so as to be detachable and a second temporary adhesive layer comprised of a thermosetting-modified siloxane polymer layer (B) which is stacked on the first temporary adhesive layer and adhered to the supporting body so as to be detachable. Thus, temporary adhesion of a wafer with a supporting body may become easy, process conformity with the TSV formation process and with the wafer-back surface-wiring process may become high, and removal may be done easily, with high productivity.

Structural hybrid adhesives

Adhesive compositions are provided comprising: a) a base resin comprising an epoxy resin; b) a first epoxy curative; and c) a second epoxy curative; wherein the first and second epoxy curatives are chosen such that the second epoxy curative may remain substantially unreacted in the composition under conditions of temperature and duration that render the first epoxy curative substantially reacted with epoxy resin in the composition. In some embodiments, the first epoxy curative is substantially reacted with epoxy resin in the composition and the second epoxy curative is substantially unreacted in the composition. In some embodiments, the adhesive composition is used in the form of an adhesive film.

DOUBLE-SIDED ADHESIVE TAPE

Disclosed is a double-sided adhesive tape that has a difference in adhesion between the front and rear sides thereof and can be produced to have a reduced thickness by a simple method. The double-sided adhesive tape is a sheet-shaped cured product of an adhesive composition containing a resin composition and an inorganic filler. The resin composition contains (A) an acrylate-based monomer, (B) a monomer copolymerizable with (A), (C) a photopolymerization initiator, and (D) a photo-crosslinking agent. The inorganic filler has an average particle diameter of 30 μm or less and is localized on one side of the tape. The surface roughness (center line average roughness Ra) of the tape surface on the side on which the inorganic filler is localized is 0.01 to 0.50 μm. 2. The double-sided adhesive tape according to claim 1 , wherein the adhesive composition includes the inorganic filler in an amount of 100 to 500 parts by mass relative to 100 parts by mass of the resin composition.3. The double-sided adhesive tape according to claim 1 , wherein a mixing ratio of the acrylate-based monomer being the component (A) and the monomer copolymerizable with (A) being the component (B) is 1 to 20 parts by mass of the component (B) to 100 parts by mass of the component (A).4. The double-sided adhesive tape according to claim 1 , wherein the resin composition has a viscosity of 500 to 3 claim 1 ,500 mPa·sec (B-type viscometer claim 1 , rotor No. 3 claim 1 , 20 rpm claim 1 , 25° C.).5. The double-sided adhesive tape according to claim 1 , wherein a mixing ratio of the resin composition and the inorganic filler is 100 to 500 parts by mass of the inorganic filler to 100 parts by mass of the resin composition.6. The double-sided adhesive tape according to claim 1 , wherein the acrylate-based monomer being the component (A) is butyl(meth)acrylate claim 1 , isoamyl(meth)aerylate claim 1 , 2-ethylhexyl(meth)acrylate claim 1 , nonyl(meth)acrylate claim 1 , isononyl(meth)acrylate claim 1 , ...

FLEXIBLE BENZOXAZINE RESIN

One or more embodiments contained herein disclose an adhesive for printed circuit board (PCB) applications. The improved adhesive may comprise a benzoxazine resin and a polyester plasticizer. 1. A composition of matter comprising a thermoset resin and a polyester plasticizer.2. The composition of claim 1 , wherein the thermoset resin comprises benzoxazine resin.3. The composition of claim 1 , comprising about 5 wt % to about 25 wt % polyester plasticizer.4. The composition of claim 2 , comprising about 75 wt % to about 95 wt % benzoxazine resin.5. The composition of claim 1 , wherein the thermoset resin comprises an uncured benzoxazine resin claim 1 , the uncured benzoxazine resin being present in the composition in an amount in the range of about 75% by weight to about 95% by weight based on the total weight of the composition; and the polyester plasticizer being present in the composition in an amount in the range of about 5% by weight to about 25% by weight based on the total weight of the composition.6. The composition of claim 5 , wherein the composition further comprises a cured benzoxazine resin claim 5 , the cured benzoxazine resin being present in an amount in the range of about 5% by weight to about 25% by weight based on the total weight of the composition.7. The composition of claim 5 , wherein the uncured benzoxazine resin is present in an amount of about 85% or about 80% by weight based on the total weight of the composition.8. An adhesive film layer comprising about 75 wt % to about 95 wt % benzoxazine resin and about 5 wt % to about 25 wt % of polyester plasticizer.9. The adhesive film layer of claim 8 , comprising about 85 wt % benzoxazine resin and about 15 wt % polyester plasticizer.10. A layered film comprising an adhesive film layer claim 8 , wherein the adhesive film layer comprises about 75 wt % to about 95 wt % of an uncured benzoxazine resin and about 5 wt % to about 25 wt % of polyester plasticizer.11. A printed circuit board comprising a ...

PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND PRESSURE-SENSITIVE ADHESIVE SHEET

The pressure-sensitive adhesive composition provided by the present invention comprises an acrylic polymer as a base polymer and a tackifier resin having a softening point of 125° C. or above. The tackifier resin content is less than 20 parts by mass relative to 100 parts by mass of the acrylic polymer. 1. A pressure-sensitive adhesive composition comprising an acrylic polymer as a base polymer , and a tackifier resin having a softening point of 125° C. or above , wherein the tackifier resin content is less than 20 parts by mass relative to 100 parts by mass of the acrylic polymer.2. The pressure-sensitive adhesive composition according to comprising a solvent that comprises primarily water or ethyl acetate.4. The pressure-sensitive adhesive composition according to claim 1 , wherein the tackifier resin is selected from rosin-based resins claim 1 , rosin derivative resins and terpene-based resins.6. The pressure-sensitive adhesive composition according to claim 2 , wherein the tackifier resin is selected from rosin-based resins claim 2 , rosin derivative resins and terpene-based resins.7. The pressure-sensitive adhesive composition according to claim 3 , wherein the tackifier resin is selected from rosin-based resins claim 3 , rosin derivative resins and terpene-based resins.8. The pressure-sensitive adhesive composition according to claim 5 , wherein the tackifier resin is selected from rosin-based resins claim 5 , rosin derivative resins and terpene-based resins.9. A pressure-sensitive adhesive sheet comprising a pressure-sensitive adhesive layer claim 5 , wherein the pressure-sensitive adhesive layer comprises an acrylic polymer as a base polymer and a tackifier resin having a softening point of 125° C. or above claim 5 , with the tackifier resin content being less than 20 parts by mass relative to 100 parts by mass of the acrylic polymer.10. The pressure-sensitive adhesive sheet according to satisfying the following property:(A) in a light-press repulsion ...

Heat Resistant Adhesive Tape

The aim is to achieve enhanced, and more particularly more stable, adhesive bonds or seals of substrates having different characteristics under thermal load. This aim is accomplished by provision of an adhesive tape having a thickness of at least 150 μm, and exhibiting after storage at 120-150° C. over 60 to 210 days an extendability in machine direction of at least three times its original extent. 1. Adhesive tape comprising a thickness of at least 150 μm , wherein the adhesive tape after storage at 120 to 150° C. over 60 to 210 days has an extendability in machine direction to at least three times its original extent.2. The adhesive tape according to claim 1 , characterized in that the adhesive tape comprises at least one thermally crosslinked polymer.3. The adhesive tape according to comprising at least one pressure-sensitive adhesive layer comprising at least one polymer selected from the group consisting of poly(meth)acrylates claim 1 , synthetic rubbers claim 1 , vinylaromatic block copolymers claim 1 , polyolefins and mixtures thereof.4. The adhesive tape according to comprising at least one pressure-sensitive adhesive layer comprising at least one poly(meth)acrylate.5. The adhesive tape according to wherein the thickness of the adhesive tape is between 200 to 5500 μm.6. The adhesive tape according to wherein the adhesive tape comprises at least one foamed layer.7. The adhesive tape according to wherein the foamed layer consists of a closed-cell foam.8. The adhesive tape according to wherein the foamed layer comprises a syntactic foam.9. The adhesive tape according to wherein the foamed layer comprises at least one poly(meth)acrylate base layer.10. Device comprising a component bonded on one side with a double-sided adhesive tape according to claim 1 , and a heat-resistant release liner applied to the side of the adhesive tape that is not joined to the component. The invention relates to the technical field of adhesive tapes of the kind used for the temporary ...

Hydrophobic nanostructured thin films

Provided herein are the polymers shown below. The value n is a positive integer. R 1 is an organic group, and each R 2 is H or a chemisorbed group, with at least one R 2 being a chemisorbed group. The polymer may be a nanostructured film. Also provided herein is a method of: converting a di-p-xylylene paracyclophane dimer to a reactive vapor of monomers; depositing the reactive vapor onto a substrate held at an angle relative to the vapor flux to form nanostructured poly(p-xylylene) film; reacting the film with an agent to form hydrogen atoms that are reactive with a precursor of a chemisorbed group, if the film does not contain the hydrogen atoms; and reacting the hydrogen atoms with the precursor. Also provided herein is a device having a nanostructured polyp-xylylene) film on a pivotable substrate. The film has directional hydrophobic or oleophobic properties and directional adhesive properties.

Non-Flowing Silicone Adhesive

Adhesive formulations are described that upon sufficient curing and drying, are not sticky or tacky at room temperature, yet can be heat bonded. The adhesives are particularly useful for use in bonding brake components together and find wide application in vehicle brake systems. When used in such systems, the adhesives do not flow in parking applications yet sufficiently dampen vibration in slowing or stopping applications to counter brake squeal. The adhesives can be provided in a tape form and used for bonding brake shims to brake pads in electronic parking brake systems.

Shape memory polymer which functions as a dry adhesive clamp and methods of making and using the same

One embodiment of the invention includes a shape memory polymer which functions similar to a traditional mechanical clamp. A shape memory polymer may exhibit adhesive properties when heated above its glass transition temperature. The shape memory polymers may function as a reversible dry adhesive clamp.

DOUBLE-SIDED ADHESIVE TAPE

Disclosed is a double-sided adhesive tape that has a difference in adhesion between the front and rear sides thereof and can be produced to have a reduced thickness by a simple method. The double-sided adhesive tape is a sheet-shaped cured product of an adhesive composition containing a resin composition and an inorganic filler. The resin composition contains (A) an acrylate-based monomer, (B) a monomer copolymerizable with (A), (C) a photopolymerization initiator, and (D) a photo-crosslinking agent. The inorganic filler has an average particle diameter of 30 μm or less and is localized on one side of the tape. The surface roughness (center line average roughness Ra) of the tape surface on the side on which the inorganic filler is localized is 0.01 to 0.50 μm. 2. The double-sided adhesive tape according to claim 1 , wherein the adhesive composition includes the inorganic filler in an amount of 100 to 500 parts by mass relative to 100 parts by mass of the resin composition.3. The double-sided adhesive tape according to claim 1 , wherein a mixing ratio of the acrylate-based monomer being the component (A) and the monomer copolymerizable with (A) being the component (B) is 1 to 20 parts by mass of the component (B) to 100 parts by mass of the component (A).4. The double-sided adhesive tape according to claim 1 , wherein the resin composition has a viscosity of 500 to 3 claim 1 ,500 mPa·sec (B-type viscometer claim 1 , rotor No. 3 claim 1 , 20 rpm claim 1 , 25° C.).5. The double-sided adhesive tape according to claim 1 , wherein a mixing ratio of the resin composition and the inorganic filler is 100 to 500 parts by mass of the inorganic filler to 100 parts by mass of the resin composition.6. The double-sided adhesive tape according to claim 1 , wherein the acrylate-based monomer being the component (A) is butyl(meth)acrylate claim 1 , isoamyl(meth)acrylate claim 1 , 2-ethylhexyl(meth)acrylate claim 1 , nonyl(meth)acrylate claim 1 , isononyl(meth)acrylate claim 1 , ...

ADHESIVE FILM, ADHESIVE COMPOSITION FOR THE SAME, AND DISPLAY MEMBER INCLUDING THE SAME

An adhesive film includes a cured product of a (meth)acrylic copolymer and has a refractive index from about 1.5 to about 1.6. An adhesive composition for preparing the adhesive film includes a (meth)acrylic copolymer of a monomer mixture. A display member includes the adhesive film coated on one or more surfaces of an optical film. 1. An adhesive film , comprising a cured reaction product of an adhesive composition , the adhesive composition comprising a (meth)acrylic copolymer of a monomer mixture , and the adhesive film having a refractive index from about 1.5 to about 1.6.2. The adhesive film according to claim 1 , wherein the monomer mixture comprises a monomer having at least two aromatic groups.3. The adhesive film according to claim 1 , wherein the monomer mixture comprises about 20 wt % or more of a monomer having at least two aromatic groups claim 1 , based on a total weight of the monomer mixture.6. The adhesive film according to claim 2 , wherein the monomer having at least two aromatic groups comprises at least one of phenoxybenzyl (meth)acrylate and phenylphenoxyethyl (meth)acrylate.7. The adhesive film according to claim 1 , wherein the monomer mixture comprises about 10 wt % to about 50 wt % of a (meth)acrylate monomer having a Cto Calkyl group claim 1 , about 1 wt % to about 30 wt % of a (meth)acrylate monomer having an alicyclic group claim 1 , about 10 wt % to about 30 wt % of a monomer having a hydroxy group claim 1 , and about 20 wt % to about 50 wt % of a monomer having at least two aromatic groups claim 1 , each based on a total weight of the monomer mixture.8. The adhesive film according to claim 7 , wherein the monomer mixture further comprises about 0.1 wt % to about 10 wt % of a monomer having a carboxylic acid group claim 7 , based on a total weight of the monomer mixture.9. The adhesive film according to claim 1 , wherein the (meth)acrylic copolymer has a viscosity from about 1 claim 1 ,000 cPs to about 50 claim 1 ,000 cPs at 25° C.10. ...

PROTECTIVE FILM-FORMING FILM, SHEET FOR FORMING PROTECTIVE FILM, COMPLEX SHEET FOR FORMING PROTECTIVE FILM, AND INSPECTION METHOD

Provided is a sheet () for forming protective film, including: a protective film-forming film () characterized in that the light transmittance thereof at a wavelength of 1600 nm of 72% or more, and the light transmittance thereof at a wavelength of 550 nm of 20% or less; and a release sheet () laminated upon one or both faces of the protective film-forming film (). According to this sheet () for forming a protective film, it is possible to form a protective film that allows for the inspection of cracks, etc., on a workpiece or a product obtained by processing the workpiece, while preventing grinding marks on the workpiece or the product from being visible to the naked eye. 1. A protective film-forming film in which the light transmittance at a wavelength of 1600 nm is 72% or greater , and the light transmittance at a wavelength of 550 nm is 20% or less.2. The protective film-forming film according to claim 1 , which is a single layer formed of an uncured curable adhesive.3. The protective film-forming film according to claim 2 , wherein the curable adhesive comprises a colorant and a filler having an average particle diameter of 0.01 to 3 μm.4. The protective film-forming film according to claim 1 , which has a thickness of 3 to 15 μm.5. A sheet for forming a protective film claim 1 , comprising:{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'the protective film-forming film ; and'}a release sheet which is laminated on one or both surfaces of the protective film-forming film.6. A composite sheet for forming a protective film claim 1 , comprising:an adhesive sheet which is formed by laminating a pressure sensitive adhesive layer on one surface side of a base material; anda protective film-forming film which is laminated on the a pressure sensitive adhesive layer side of the adhesive sheet, whereinthe light transmittance at a wavelength of 1600 nm of the protective film-forming film is 72% or greater, andthe light transmittance at a wavelength of 550 nm of the ...

Protective film for windshield of vehicle

The present invention relates to a protective film for a windshield of a vehicle, which can be installed on a curved portion of the windshield of the vehicle without a thermoforming process, thereby improving the workability of a worker, and improving impact resistance to effectively protect the windshield of the vehicle.

COMPOSITE ARTICLE AND METHODS FOR MAKING THE SAME

The invention relates to a composite article comprising:—an item () to be attached to a substrate; and—an adhesive tape () for attaching the item to the substrate, the adhesive tape having a substantially flat shape with a first main surface () facing the item, the first main surface extending in a cross section perpendicular to the first main surface from a first edge () to a second edge ();—a lamination region () on the first surface, wherein the lamination region is the region where the adhesive tape is laminated to the item; and—wherein the lamination region is smaller than the first main surface. The invention also relates to a method of making a composite article. 1. A composite article comprising:{'b': '2', 'an item () to be attached to a substrate; and'}{'b': 3', '6', '8', '9, 'an adhesive tape () for attaching the item to the substrate, the adhesive tape having a substantially flat shape with a first main surface () facing the item, the first main surface extending in a cross section perpendicular to the first main surface from a first edge () to a second edge ();'}{'b': '11', 'a lamination region () on the first surface, wherein the lamination region is the region where the adhesive tape is laminated to the item; and'}wherein the lamination region is smaller than the first main surface.22. The composite article according to claim 1 , wherein the item () to be attached to a substrate is a shaped rubber article.3. The composite article according to claim 1 , wherein the substrate is a motor vehicle body.43254. The composite article according to claim 1 , wherein the adhesive tape () for attaching the item () to the substrate comprises a heat-activatable adhesive layer () and a pressure-sensitive adhesive layer () claim 1 , wherein the heat-activatable adhesive layer faces the item and is laminated to the item.5. The composite article according to claim 4 , wherein the heat-activatable adhesive layer is a resin layer claim 4 , wherein the resin is a polymer ...

ELECTRICALLY PEELABLE ADHESIVE COMPOSITION AND ELECTRICALLY PEELABLE ADHESIVE SHEET, AND METHOD FOR USING ELECTRICALLY PEELABLE ADHESIVE SHEET

An electrically peelable pressure sensitive adhesive composition consists of an emulsion type acrylic pressure sensitive adhesive (A) comprising an acrylic polymer (A1) obtained by emulsion polymerization in the presence of a surfactant using a monomer mixture comprising an alkyl(meth)acrylate, and a (poly)alkylene polyol (B) having a number average molecular weight of 2000 or less, wherein a content of the component (B) based on 100 parts by mass of active ingredient of the component (A) is 3.5 parts by mass or more. In the electrically peelable pressure sensitive adhesive composition, the adhesiveness before voltage application is high, but the adhesiveness can decrease effectively by voltage application for a short time. 1. An electrically peelable pressure sensitive adhesive composition comprising an emulsion type acrylic pressure sensitive adhesive (A) comprising an acrylic polymer (A1) obtained by emulsion polymerization in the presence of a surfactant of a monomer mixture comprising an alkyl(meth)acrylate , and a (poly)alkylene polyol (B) having a number average molecular weight of 2000 or less , whereina content of the component (B) is 3.5 parts by mass or more based on 100 parts by mass of active ingredient of the component (A).2. The electrically peelable pressure sensitive adhesive composition according to claim 1 , wherein the content of the component (B) is 3.5 to 50 parts by mass based on 100 parts by mass of active ingredient of the component (A).3. The electrically peelable pressure sensitive adhesive composition according to claim 1 , wherein the component (B) comprises a (poly)alkylene glycol.5. The electrically peelable pressure sensitive adhesive composition according to claim 1 , wherein the component (A1) is an acrylic copolymer comprising 60 to 99.9% by mass of a constituent unit (a1) derived from an alkyl(meth)acrylate claim 1 , and 0.1 to 40% by mass of a constituent unit (a2) derived from a functional group-containing unsaturated monomer.6. ...

COMPOSITION FOR FORMING EASY-TO-DETACH THIN RESIN FILM, AND EASY-TO-DETACH THIN RESIN FILM

The invention provides a composition for forming an easy-to-detach thin resin film, the composition being characterized by including a urethane (meth)acrylate compound, and a first polymerizable composition containing an ethylenic unsaturated monomer having a tert-butoxy group and a radical polymerization initiator, or a polymer of a second polymerizable composition containing the ethylenic unsaturated monomer having a tert-butoxy group, wherein the amount of the ethylenic unsaturated monomer having a tert-butoxy group is 5 mass % or more and less than 95 mass % with respect to the sum of the amount of the urethane (meth)acrylate compound and the total amount of the monomer(s) contained in the first polymerizable composition or the second polymerizable composition. 116.-. (canceled)17. A composition for forming an easy-to-detach thin resin film , the composition being characterized by comprising:a urethane (meth)acrylate compound, anda first polymerizable composition containing an ethylenic unsaturated monomer having a tert-butoxy group and a radical polymerization initiator, or a polymer of a second polymerizable composition containing the ethylenic unsaturated monomer having a tert-butoxy group,wherein the amount of the ethylenic unsaturated monomer having a tert-butoxy group is 5 mass % or more and less than 95 mass % with respect to the sum of the amount of the urethane (meth)acrylate compound and the total amount of the monomer(s) contained in the first polymerizable composition or the second polymerizable composition.19. A composition for forming an easy-to-detach thin resin film according to claim 17 , wherein the ethylenic unsaturated monomer having a tert-butoxy group contains tert-butyl (meth)acrylate.20. A composition for forming an easy-to-detach thin resin film according to claim 17 , wherein the radical polymerization initiator is a radiation radical polymerization initiator.21. A composition for forming an easy-to-detach thin resin film according to ...

Novel hot-melt adhesive and preparation method therefor

A novel hot-melt adhesive and a preparation method thereof are disclosed, and in particular a hot-melt adhesive for bonding aluminum, stainless steel or other metal materials and PVC plastics is disclosed. The specific nylon-type copolyamide is firstly prepared by designing specific raw materials and percentage thereof, and in combination with favorable bonding properties of the nylon-type copolyamide for metals and favorable bonding characteristics of the perchloroethylene resin for PVC, a double screw extruder is utilized to perform sufficient melt blending on the nylon-type copolyamide and the perchloroethylene resin under the synergistic actions of related aids, so that the obtained novel hot-melt adhesive has favorable bonding properties for both metals and PVC.

METHOD FOR MANUFACTURING FINE-PITCH ANISOTROPIC CONDUCTIVE ADHESIVE AND FINE-PITCH ANISOTROPIC CONDUCTIVE ADHESIVE MANUFACTURED BY SAME METHOD

The provided relates to a method for preparing an anisotropic conductive adhesive for fine pitch and an anisotropic conductive adhesive for fine pitch prepared by the same method. Provided is a method for preparing an anisotropic conductive adhesive for a fine pitch including: (i) removing an oxide film of solder particles having self-fusion and self-orientation functions between metal terminals of a substrate by melting the solder particles at a predetermined temperature using a first reducing agent; (ii) removing moisture generated in step (i); and (iii) preparing an anisotropic conductive adhesive by mixing the solder particles from which the oxide film and the moisture are removed with a binder resin in steps (i) and (ii), in which step (iii) is performed in a state where a contact with oxygen is blocked. 1. A method for preparing an anisotropic conductive adhesive for fine pitch , the method comprising:(i) removing an oxide film of solder particles having self-fusion and self-orientation functions between metal terminals of a substrate by melting the solder particles at a predetermined temperature using a first reducing agent;(ii) removing moisture generated in step (i); and(iii) preparing the anisotropic conductive adhesive by mixing the solder particles from which the oxide film and the moisture are removed in steps (i) and (ii) with a binder resin,a. wherein step (iii) is performed in a state where a contact with oxygen is blocked.2. The method of claim 1 , wherein the anisotropic conductive adhesive in step (iii) further includes a second reducing agent for preventing further oxidation of the solder particles.3. The method of claim 2 , wherein an amount of the second reducing agent is 0.01 to 3 parts by weight with respect to 100 parts by weight of the anisotropic conductive adhesive in step (iii).4. The method of claim 1 , wherein the first reducing agent is at least one selected from the group consisting of 3-butenoic acid (BA) claim 1 , 1 claim 1 ,3-bis( ...

MULTILAYER OPTICAL ADHESIVES AND METHODS OF MAKING SAME

A multilayer optical adhesive including a first viscoelastic or elastomeric adhesive layer and a second viscoelastic or elastomeric adhesive layer. A crosslinked or soluble resin layer may be disposed between the first viscoelastic or elastomeric adhesive layer and the second viscoelastic or elastomeric adhesive layer or the first viscoelastic or elastomeric adhesive layer may be immediately adjacent to the second viscoelastic or elastomeric adhesive layer. An interface between immediately adjacent layers is structured and there is a difference in refractive indices across the interface.

ADHESIVE COMPOSITION

An adhesive composition includes0 an acryl copolymer having a carboxyl group, and a silane compound represented by Formula 1 or 2, thereby it is possible to exhibit excellent initial adhesiveness and adhesive durability under severe conditions, and prevent the substrate from being torn due to a decrease in adhesiveness by water applied thereto, and the adhesive from remaining on the substrate during peeling-off the adhesive layer, as well as after drying, the adhesive layer may exhibit favorable adhesiveness again, thus being used for re-bonding. 2. The adhesive composition according to claim 1 , wherein the acryl copolymer is prepared by polymerizing monomers including 1 wt. % or more of an ethylenically unsaturated monomer having a carboxyl group to a total weight of the monomers.3. The adhesive composition according to claim 1 , wherein the acryl copolymer is prepared by polymerizing monomers including 2.5 to 8 wt. % of an ethylenically unsaturated monomer having a carboxyl group to a total weight of the monomers.5. The adhesive composition according to claim 1 , wherein the silane compound is included in an amount of 0.01 to 5 wt. parts to 100 wt. parts of the acryl copolymer.6. The adhesive composition according to claim 1 , further comprising a cross-linking agent selected from a group consisting of isocyanate claim 1 , epoxy claim 1 , metal chelate claim 1 , oxazoline and poly-functional acrylate-based compounds.7. An adhesive sheet comprising an adhesive layer formed using the adhesive composition according to .8. A polarizing plate comprising an adhesive layer formed using the adhesive composition according to claim 1 , on at least one surface of the polarizing plate.9. An image display device comprising the polarizing plate according to . 1. Field of the InventionThe present invention relates to an adhesive composition.2. Description of the Related ArtA liquid crystal display device generally consists of liquid crystal cells and a polarizing plate, mostly ...

Adhesive composition containing ionic antistatic agent

An adhesive composition includes an acryl copolymer, a cross-linking agent, and an ionic antistatic agent represented by Formula 1, thereby exhibiting excellent antistatic property, as well as, significantly improved durability, maintaining excellent adhesiveness under severe conditions such as high temperature and high humidity atmospheres, and securing sufficient antistatic property even if used in a small amount.

NOVEL ROAD MARKINGS FOR ASSISTING THE PERCEPTION OF THE SURROUNDINGS OF VEHICLES

The present invention encompasses an innovative concept for the marking of trafficways, more particularly roads. The application qualities and lifetime of these new markings are comparable with those of the prior art. The markings also possess properties comparable with those of the prior art in respect of night visibility, back-in-service time, and surface quality. An additional contribution of the markings of the present invention, however, is that they can be used to support modern driver assistance systems and autonomous driving. With this in mind, the present invention relates more particularly to road markings which, building on established systems, are equipped with additional reflection capacity for electromagnetic radiation, more particular for microwaves and/or infrared radiation.

STRETCH RELEASE ADHESIVE, BATTERY ASSEMBLY AND HOUSING ASSEMBLY

The present disclosure provides a stretch release adhesive, a battery assembly and a housing assembly. The stretch release adhesive includes a first adhesive layer having viscidity; and a second adhesive layer having viscidity, the second adhesive layer and the first adhesive layer being superposed, and the second adhesive layer including a plurality of first adhesive portions spaced apart from one another. 1. A stretch release adhesive , comprising:a first adhesive layer having viscidity; anda second adhesive layer having viscidity, the second adhesive layer and the first adhesive layer being superposed, and the second adhesive layer comprising a plurality of first adhesive portions spaced apart from one another.2. The stretch release adhesive according to claim 1 , wherein the first adhesive portion exhibits a strip shape.3. The stretch release adhesive according to claim 1 , wherein the first adhesive portion extends along a straight line or a curve.4. The stretch release adhesive according to claim 1 , wherein the plurality of first adhesive portions are parallel.5. The stretch release adhesive according to claim 1 , wherein the plurality of first adhesive portions are evenly spaced apart.6. The stretch release adhesive according to claim 1 , wherein each of the first adhesive portions has the same width.7. The stretch release adhesive according to claim 1 , wherein the width of the first adhesive portion is gradually decreased or gradually increased in a direction from an end of the first adhesive portion to the other end of the first adhesive portion.8. The stretch release adhesive according to claim 1 , wherein the first adhesive layer comprises a plurality of second adhesive portions spaced apart.9. The stretch release adhesive according to claim 8 , wherein an extension direction of the second adhesive portion is at an angle α to an extension direction of the first adhesive portion claim 8 , and α satisfies 0°<α≤90°.10. The stretch release adhesive ...

ADHESIVE COMPOSITION SHEET, METHOD OF PRODUCING SAME, AND SEMICONDUCTOR DEVICE

Provided is an adhesive composition sheet containing an organic compound and inorganic particles, the adhesive composition sheet including a structure obtained by stacking a layer A that contains at least an organic compound and a layer B that contains an organic compound and inorganic particles, the layer A having a content rate of the organic compound larger than the content rate of the organic compound in the layer B, and the layer A and/or the layer B containing anisotropically shaped inorganic particles. The present invention provides an adhesive composition sheet excellent in thermal conductivity and insulating properties after cured. 1. An adhesive composition sheet for a semiconductor device , comprising an organic compound and inorganic particles , the adhesive composition sheet comprising a structure in which at least a layer A that contains an organic compound and a layer B that contains an organic compound and inorganic particles are laminated , the layer A having a content rate of the organic compound larger than a content rate of the organic compound in the layer B , and the layer A and/or the layer B containing anisotropically shaped thermal conductive inorganic particles.2. The adhesive composition sheet according to claim 1 , wherein the anisotropically shaped thermal conductive inorganic particles have a length in longitudinal direction 4 times or more and 500 times or less as long as a length in a section perpendicular to a longitudinal direction.3. The adhesive composition sheet according to claim 1 , wherein the anisotropically shaped thermal conductive inorganic particles are at least one type of inorganic particles selected from a carbon nanotube claim 1 , a boron nitride nanotube claim 1 , scale-shaped boron nitride claim 1 , an aluminum nitride whisker claim 1 , a silicon carbide whisker claim 1 , and an aluminum oxide whisker.4. The adhesive composition sheet according to claim 1 , wherein the layer A has a content rate of the organic ...

LAMINATE, TEMPORARY ADHESION COMPOSITION, AND TEMPORARY ADHESION FILM

To provide a laminate, a temporary adhesion composition, and a temporary adhesion film which are capable of making warpage less likely to occur even when a wafer is thin. 1. A laminate comprising , sequentially being adjacent to each other:a first base material;a temporary adhesion film; anda second base material,wherein a tensile elastic modulus E of the temporary adhesion film at 25° C. in conformity with JIS K 7161:1994 is in a range of 25 to 2000 MPa,a base material is peeled off by fixing any one of a first base material and a second base material of the laminate at 25° C. and pulling an end portion of the other base material up in a direction perpendicular to the base material surface of the other base material from an interface with the temporary adhesion film at a speed of 50 mm/min, andthe force applied during the pulling-up is measured using a force gauge and the value is 0.33 N/mm or less.2. The laminate according to claim 1 ,{'sup': '2', 'wherein a surface free energy of the temporary adhesion film is 30 mJ/mor less,'}where the surface free energy indicates a value obtained according to the extended Fowkes equation based on a contact angle of water, ethylene glycol, or diiodomethane with respect to the temporary adhesion film.3. The laminate according to claim 1 ,wherein a shear storage elastic modulus G′ of the temporary adhesion film at 190° C. in conformity with JIS K 7244-6:1999 is in a range of 0.1 to 1 MPa,4. The laminate according to claim 1 ,wherein a tensile storage elastic modulus E′ of the temporary adhesion film at 25° C. in conformity with JIS K 7244-4:1999 is in a range of 150 to 900 MPa.5. The laminate according to of claim 1 ,wherein a ratio E′/G′ of the tensile storage elastic modulus E′ of the temporary adhesion film at 25° C. in conformity with JIS K 7244-4:1999 to the shear storage elastic modulus G′ of the temporary adhesion film at 190° C. in conformity with JIS K 7244-6:1999 satisfies a relationship of E′/G′≦3500.6. The laminate ...

FILM ADHESIVE AND SEMICONDUCTOR DEVICE INCLUDING THE SAME

Provided is a film adhesive which is preferably used as a NCF, void-free, has excellent electrical connectivity and its high reliability, does not develop cracks easily, and has high surface flatness. Also provided is a semiconductor device in which the film adhesive according to the present invention is used as an NCF during the manufacture of the semiconductor device. The film adhesive according to the present invention contains (A) an epoxy resin; (B) a bisphenol F type phenoxy resin; (C) a phenol resin-based curing agent; (D) a modified imidazole compound; (E) a silica filler; (F) oxyquinoline; and (G) a butadiene-acrylonitrile-methacrylic acid copolymer. The content of component (A) is 19.3 to 33.8 parts by mass. The content of component (B) is 7.5 to 9.1 parts by mass. The content of component (D) is 1.915 to 5 parts by mass. The content of component (E) is 30 to 60 parts by mass. The content of component (F) is 2.5 to 10 parts by mass. The liquid epoxy resin of component (A) contains a phenol novolac type epoxy resin and a liquid epoxy resin. The ratio of phenol novolac type epoxy resin to the epoxy resin of component (A) is not less than 46%. The equivalent ratio of component (C) relative to component (A) is 0.25 to 0.75. 1. A film adhesive which contains:(A) an epoxy resin;(B) a bisphenol F type phenoxy resin;(C) a phenol resin-based curing agent;(D) a modified imidazole compound;(E) a silica filler;(F) oxyquinoline; and(G) a butadiene-acrylonitrile-methacrylic acid copolymer,wherein:the content of component (A) is 19.3 to 33.8 parts by mass;the content of component (B) is 7.5 to 9.1 parts by mass;the content of component (D) is 1.9 to 5 parts by mass;the content of component (E) is 30 to 60 parts by mass;the content of component (F) is 2.5 to 10 parts by mass;the content of component (G) is 0.7 to 2.3 parts by mass;the epoxy resin of component (A) contains a phenol novolac type epoxy resin and a liquid epoxy resin;the phenol novolac type epoxy resin has a ...

Moisture-curable polyurethane hot-melt resin composition

The present disclosure provides a polyurethane hot-melt adhesive composition comprising a polyol component and an isocyanate component, wherein the polyol component comprises a polyol having two or more OH groups and a hydrogen-bridging group.

Adhesive sheet, manufacturing method thereof, and layered body

An adhesive sheet, the adhesive sheet having an adhesive composition layer, the adhesive composition layer being formed using a composition including: a polythiol compound; a (meth)acrylic compound having a plurality of at least one of an acryloyl group or a methacryloyl group; a radical generator; and a Michael addition catalyst, a ratio (Ac/SH) of a total molar number (Ac) of the at least one of an acryloyl group or a methacryloyl group contained in the (meth)acrylic compound to a total molar number (SH) of thiol groups contained in the polythiol compound being from 0.25 to 0.80.

PHOTOCURABLE SHEET-TYPE ADHESIVE COMPOSITION FOR OPTICAL USE

An object of the present invention is to provide a photocurable sheet-type adhesive composition for optical use, which is used for bonding cover glass and a touch panel, a touch panel and a display module, or the like, and has high appearance reliability and storage stability even under high temperature and high humidity. 1. A photocurable sheet-shape adhesive for optical use , the adhesive containing following components (A) to (D):(A) 100 parts by mass of a urethane (meth)acrylate oligomer having a weight average molecular weight of 20,000 to 100,000;(B) 3 to 70 parts by mass of a phenoxy resin having a glass transition temperature of 50 to 120° C.;(C) 0.1 to 10 parts by mass of a photopolymerization initiator; and(D) 1 to 50 parts by mass of a (meth)acrylate monomer which has 8 to 30 repeated blocks having an ether linkage in the molecule and contains at least one (meth)acryloyl group in the molecule.2. The photocurable sheet-shape adhesive for optical use according to claim 1 , wherein the component (D) has at least 8 to 25 repeated blocks having an ether linkage in the molecule.3. The photocurable sheet-shape adhesive for optical use according to claim 1 , wherein the component (A) is a compound having at least one structure selected from the group consisting of polycarbonate skeleton claim 1 , polybutadiene skeleton claim 1 , and hydrogenated polybutadiene skeleton.4. An image display device including at least either a display module and a cover panel claim 1 , a cover panel and a touch panel claim 1 , or a touch panel and the display panel bonded with the photocurable sheet-shape adhesive for optical use according to . The present invention relates to a photocurable sheet-type adhesive composition for optical use, which is used to bond a display module and a cover panel, a touch panel and the display module, the cover panel and the touch panel, etc., and has high appearance reliability under high temperature and high humidity.In an image display device such ...

ANISOTROPIC CONDUCTIVE FILM AND CONNECTION STRUCTURE

Provided is an anisotropic conductive film that allows conductive particles to be sufficiently captured even by connecting terminals disposed at a fine pitch and can suppress a short circuit, and in particular, that can suppress variation of conduction resistance of a connection portion even when partial contact is caused by a thermal pressing tool during anisotropic conductive connection. In an anisotropic conductive film A, an insulating adhesive layer contains conductive particles . The conductive particles have an aspect ratio of 1.2 or more and are dispersed without being in contact with each other as viewed in a plan view, and an angle formed between a film surface S of the anisotropic conductive film A and a major axis direction of each of the conductive particles is less than 40°. The anisotropic conductive film A preferably contains columnar conductive glass particles as the conductive particles 1. An anisotropic conductive film comprising an insulating adhesive layer containing conductive particles , wherein the conductive particles have an aspect ratio of 1.2 or more and are dispersed without being in contact with each other as viewed in a plan view , and an angle formed between a film surface of the anisotropic conductive film and a major axis direction of each of the conductive particles is less than 40°.2. The anisotropic conductive film according to claim 1 , wherein the conductive particles are columnar conductive glass particles having a conductive layer at at least a portion of a surface thereof.3. The anisotropic conductive film according to claim 1 , wherein the conductive particles have a cylindrical shape.4. The anisotropic conductive film according to claim 1 , wherein the conductive particles have an aspect ratio of 1.3 or more and 20 or less.5. The anisotropic conductive film according to claim 1 , wherein the conductive particles have an average major axis length of 4 μm or more and 60 μm or less.6. The anisotropic conductive film according ...

Adhesive resin layer and adhesive resin film

The present invention provides an adhesive resin layer and an adhesive resin film which can prevent generation of air bubbles even when adhered to a substrate having a high level difference, and in which even after thermal endurance and after wet thermal endurance, of a laminate obtained by laminating a substrate, an adhesive resin layer, and a substrate in an order, air bubbles are not generated, durability is good, and transparency can be maintained. More specifically, the present invention is a monolayered adhesive resin layer comprising an acrylic-based adhesive resin composition having transparency, wherein the adhesive resin composition contains an acrylic-based polymer, urethane acrylate, and a thermopolymerization initiator, and may optionally contain an acrylic-based monomer, and an adhesive resin layer has pressure sensitive adhesiveness on both surfaces at an ambient temperature, and can be thermally cured by heating at a temperature of 100 to 250° C. and a time of 30 seconds to 10 minutes.

GRAPHITE LAMINATES, PROCESSES FOR PRODUCING GRAPHITE LAMINATES, STRUCTURAL OBJECT FOR HEAT TRANSPORT, AND ROD-SHAPED HEAT-TRANSPORTING OBJECT

The present invention provides, with use of a particular material, (i) a graphite laminate that has high thermal conductivity and that is unlikely to contain a void, (ii) a graphite laminate that is good in thermal conductivity and peel strength, (iii) methods for producing such graphite laminates, (iv) heat transport structures including such graphite laminates, (v) a rod-shaped heat transporter whose operating temperature is not limited and which can be used stably, and (vi) an electronic device including a rod-shaped heat transporter. 110.-. (canceled)11. A graphite laminate , comprising:graphite sheets; andadhesive layers,the graphite sheets and the adhesive layers being disposed alternately on top of each other,the adhesive layers each containing at least one of a thermoplastic resin and a thermosetting resin,the adhesive layers each having a water absorption rate of not more than 2% and a thickness of less than 15 μm,the graphite sheets being included in the graphite laminate in a number of not less than 3.12. A graphite laminate , comprising:graphite sheets; andadhesive layers,the graphite sheets and the adhesive layers being disposed alternately on top of each other,the adhesive layers each containing at least one of a thermoplastic resin and a thermosetting resin,the adhesive layers each having a thickness of less than 15 μm,the graphite sheets being included in the graphite laminate in a number of not less than 3,the graphite laminate having a water absorption rate of not more than 0.25%.13. The graphite laminate according to claim 11 , wherein the thermoplastic resin and the thermosetting resin each have a glass transition point of not lower than 50° C.14. The graphite laminate according to claim 11 , wherein the graphite sheets each have a thermal conductivity of not less than 1000 W/(m·K) in a surface direction.15. The graphite laminate according to claim 11 , wherein the graphite laminate is bent so as to have at least one bent portion.16. A graphite ...

GAS BARRIER FILM LAMINATE, ADHESIVE FILM, AND ELECTRONIC COMPONENT

The present invention relates to a gas barrier film laminate comprising at least two gas barrier films, the gas barrier film laminate having a configuration in which two adjacent gas barrier films are stacked through a pressure-sensitive adhesive layer, and the pressure-sensitive adhesive layer having a shear load reduction ratio α (%) given by an expression (I) in claim , of 70% or less; and an adhesive film that is used to produce a gas barrier film laminate that includes at least two gas barrier films, and has a configuration in which two adjacent gas barrier films are stacked through a pressure-sensitive adhesive layer, the adhesive film comprising at least a gas barrier film and a pressure-sensitive adhesive layer that are stacked adjacent to each other, the pressure-sensitive adhesive layer having a shear load reduction ratio α (%) given by an expression (I) in claim , of 70% or less. Provided is a gas barrier film laminate that exhibits an excellent water vapor barrier capability, and rarely shows a deterioration in external appearance (e.g., air bubbles) even when subjected to a high temperature and a high humidity for a long time, the adhesive film that is useful for producing the gas barrier film laminate, and an electronic member that includes the gas barrier film laminate. 2. The gas barrier film laminate according to claim 1 , wherein the gas barrier film includes a base film claim 1 , and at least one gas barrier layer that is provided on the base film.3. The gas barrier film laminate according to claim 2 , wherein the two adjacent gas barrier films are stacked so that the gas barrier layers face each other.4. The gas barrier film laminate according to claim 2 , wherein the gas barrier layer is a layer that is formed by implanting ions into a layer that includes a silicon-based polymer compound.5. The gas barrier film laminate according to claim 1 , wherein the pressure-sensitive adhesive layer is formed of an acrylic-based pressure-sensitive adhesive ...

Polymerizable composition, polymerization product, image display device, and method for producing same

In relation to a polymerizable composition for forming a transparent optical resin layer to be interposed between an image display section of an image display device and a light-transmissive protective section thereof, the present invention provides a polymerizable composition that does not give rise to display defects caused by the deformation of the image display section, enables high-luminance, high-contrast image displaying, has excellent heat resistance, and also has a low dielectric constant. This polymerizable composition comprises: (1) a urethane (meth)acrylate obtained by reacting a hydrogenated polyolefin polyol and a compound having an isocyanato group and a (meth)acryloyl group; (2) a (meth)acryloyl-group-containing compound having a hydrocarbon group with a carbon number of 6 or greater; and (3) a photopolymerization initiator.

ADHESIVE COMPOSITION AND ADHESIVE SHEET

A pressure-sensitive adhesive composition containing an acrylic copolymer (A) having a structural unit (a1) derived from an alkyl (meth)acrylate (a1)′ and a structural unit (a2) derived from a functional group-containing monomer (a2)′, a crosslinking agent (B), and a photochromic dye (C) selected from a group consisting of dithienylethene-based compounds, oxazine-based compounds and naphthopyran-based compounds has a relatively rapid rate of color change from colored to colorless after termination of irradiation with UV rays, has excellent photochromic performance and can be a pressure-sensitive adhesive layer of a colorless pressure-sensitive adhesive sheet. 1. A pressure-sensitive adhesive composition comprisingan acrylic copolymer (A) having a structural unit (a1) derived from an alkyl (meth)acrylate (a1)′ and a structural unit (a2) derived from a functional group-containing monomer (a2)′,a crosslinking agent (B), anda photochromic dye (C) selected from a group consisting of dithienylethene-based compounds, oxazine-based compounds and naphthopyran-based compounds.2. The pressure-sensitive adhesive composition according to claim 1 , wherein the component (A) is an acrylic copolymer (A-1) having a structural unit (a1) derived from an alkyl (meth)acrylate (a1)′ and a structural unit (a2) derived from a functional group-containing monomer (a2)′ claim 1 ,wherein in (a2)′ a content of a structural unit derived from a carboxyl group-containing monomer and a content of a structural unit derived from a primary amino group-containing monomer are respectively 1.5% by mass or less, andthe component (C) is a dithienylethene-based compound with a content of from 0.40 to 8.00 parts by mass relative to 100 parts by mass of the acrylic copolymer (A-1).3. The pressure-sensitive adhesive composition according to claim 2 , wherein a content of the structural unit (a2) derived from the functional group-containing monomer (a2)′ in the acrylic copolymer (A-1) is from 0.01 to 35% by ...

(meth)acrylic copolymer, adhesive composition containing same, and adhesive sheet

A (meth)acrylic copolymer (A) having a mass average molecular weight of 50,000 to 1,000,000, in which the (meth)acrylic copolymer (A) is obtained by polymerizing a monomer mixture including a macromonomer (a) that has a number average molecular weight of 500 or more and less than 6000 and a vinyl monomer (b), and preferably includes 7 to 40% by mass of a repeat unit derived from the macromonomer (a), has sufficient coating workability, adhesive holding power and adhesive property as an adhesive composition.

Hydrophobic nanostructured thin films

Provided herein are the polymers shown below. The value n is a positive integer. R 1 is an organic group, and each R 2 is H or a chemisorbed group, with at least one R 2 being a chemisorbed group. The polymer may be a nanostructured film. Also provided herein is a method of: converting a di-p-xylylene paracyclophane dimer to a reactive vapor of monomers; depositing the reactive vapor onto a substrate held at an angle relative to the vapor flux to form nanostructured poly(p-xylylene) film; reacting the film with an agent to form hydrogen atoms that are reactive with a precursor of a chemisorbed group, if the film does not contain the hydrogen atoms; and reacting the hydrogen atoms with the precursor. Also provided herein is a device having a nanostructured poly(p-xylylene) film on a pivotable substrate. The film has directional hydrophobic or oleophobic properties and directional adhesive properties.

ADHESIVE FILM FOR POLARIZING PLATE, POLARIZING PLATE INCLUDING THE SAME AND OPTICAL DISPLAY INCLUDING THE SAME

An adhesive film for polarizing plates, a polarizing plate including the same, and an optical display including the same are provided. An adhesive film for polarizing plates is formed of an adhesive composition for polarizing plates, which includes a non-carboxylic acid (meth)acrylic copolymer, an isocyanate curing agent, and an epoxy curing agent, wherein the adhesive film has a modulus at 85° C. of about 0.1 MPa to about 0.8 MPa and a modulus ratio of about 3 or less, as calculated by the equation, Modulus ratio=G′(25° C.)/G′(85° C.), where G′(25° C.) is modulus (unit: MPa) at 25° C. of an adhesive film and G′(85° C.) is modulus (unit: MPa) at 85° C. of the adhesive film. 1. An adhesive film for polarizing plates , the adhesive film being formed of an adhesive composition comprising: a non-carboxylic acid (meth)acrylic copolymer; an isocyanate curing agent; and an epoxy curing agent , {'br': None, 'i': G', 'G, 'Modulus ratio=′(25° C.)/′(85° C.),'}, 'wherein the adhesive film has a modulus at 85° C. of about 0.1 MPa to about 0.8 MPa and a modulus ratio of 3 or less, as calculated by Equation 1where G′(25° C.) is modulus (unit: MPa) at 25° C. of the adhesive film and G′(85° C.) is modulus (unit: MPa) at 85° C. of the adhesive film.2. The adhesive film according to claim 1 , wherein the adhesive film has a resistance change rate of less than 10% claim 1 , as calculated by Equation 2:{'br': None, 'i': P', '−P', 'P, 'sup': 2', '1', '1, 'Resistance change rate=()/×100,'}{'sup': 1', '2, 'where Pis initial resistance (unit: Ω) measured on a specimen in which electrodes are formed at both ends of the adhesive film, and Pis resistance (unit: Ω) measured after the specimen is left alone at 60° C. and 95% RH for 250 hours.'}3. The adhesive film according to claim 1 , wherein the adhesive film has a modulus at 25° C. of about 0.3 MPa or greater.4. The adhesive film according to claim 1 , wherein a polarizing plate for durability evaluation claim 1 , to which the adhesive film ...

Release liner with different surface coating

A heat-resistant release liner for use on pressure-sensitive adhesives and which comprises an externally situated silicone release layer (SR); a layer system (POL) comprising, in each of its layers, based in each case on the total weight of the layer, a total of at least 50% by weight of one or more polyolefins, where the layer system (POL) comprises, based on the total weight of the layer system (POL), at least 60% by weight of polypropylene; and an externally situated layer (PER) comprising, based on the total weight of the layer (PER), at least 80% by weight of polyethylene, where an adhesive bonds the layer (PER) to the next subsequent layer in the structure of the release liner.

METHOD FOR MANUFACTURING SURFACE-MODIFIED THERMOPLASTIC RESIN, METHOD FOR MANUFACTURING BONDED STRUCTURE, BONDED STRUCTURE, THERMAL TRANSFER SURFACE-MODIFYING SHEET, THERMOPLASTIC RESIN WITH THERMAL TRANSFER SURFACE-MODIFYING SHEET, AND SURFACE-MODIFIED THERMOPLASTIC RESIN

A surface-modified thermoplastic resin in which sufficient bonding strength is applied to a thermoplastic resin and a method thereof are provided. A bonded structure capable of exhibiting sufficient bonding strength and a method thereof are provided. A thermal transfer surface-modifying sheet that can be preferably used in the method for manufacturing a surface-modified thermoplastic resin is provided. A thermoplastic resin with a thermal transfer surface-modifying sheet including the thermal transfer surface-modifying sheet is provided. The method for manufacturing a surface-modified thermoplastic resin, in which an easy adherence layer is laminated on a thermoplastic resin having a melting point of T° C., the method includes: providing the easy adherence layer on at least a part of a surface of the thermoplastic resin; and performing heat welding at a temperature equal to or higher than (T−50)° C. 1. A method for manufacturing a surface-modified thermoplastic resin , in which an easy adherence layer is laminated on a thermoplastic resin having a melting point of T° C. , the method comprising:providing the easy adherence layer on at least a part of a surface of the thermoplastic resin; andperforming heat welding at a temperature equal to or higher than (T−50)° C.2. The manufacturing method according to claim 1 ,wherein the heat welding is performed by heating press.3. The manufacturing method according to claim 2 ,wherein a molding process of the thermoplastic resin is performed by the heating press.4. The manufacturing method according to claim 1 ,wherein the easy adherence layer is provided by placing a side of the easy adherence layer of a thermal transfer surface-modifying sheet that is a laminate comprising a release sheet and the easy adherence layer, on at least a part of the surface of the thermoplastic resin.5. The manufacturing method according to claim 4 ,wherein the release sheet is removed after the heat welding.6. A method for manufacturing a surface- ...

ADHESIVE FILM AND PRODUCT FOR ENCAPSULATING ORGANIC ELECTRONIC DEVICE USING SAME

Provided are an adhesive film and an organic electronic device (OED) encapsulation product using the same. As moisture resistance is maintained by preventing traveling of moisture in a matrix resin, moisture or oxygen input to the organic electronic device from an external environment may be effectively prevented, and temporal stability, life span and durability may be enhanced even when a panel of the organic electronic device is formed as a thin film, thereby ensuring long-term reliability. 2. The adhesive film according to claim 1 , wherein the adhesive film has a temporal change in moisture resistance of less than 1%.3. The adhesive film according to claim 2 , wherein the adhesive film satisfies at least one of the following three conditions:a) a temporal change in purity of the moisture absorbent of less than 10 wt %;b) a temporal change in weight increase ratio under a durability condition of a temperature of 85° C. and a relative humidity of 85% of less than 0.2%; andc) a temporal change in moisture permeating speed of less than 10%.4. The adhesive film according to claim 1 , wherein the curable adhesive layer has a viscosity at room temperature of 10dyne/cmor more.5. The adhesive film according to claim 1 , wherein the curable resin has a water vapor transmission rate (WVTR) in a cured state of 50 g/m·day or less.6. The adhesive film according to claim 1 , wherein the curable resin is a heat-curable resin claim 1 , a photocurable resin claim 1 , or a dual-curable resin.7. The adhesive film according to claim 1 , wherein the curable resin comprises at least one curable functional group selected from a glycidyl group claim 1 , an isocyanate group claim 1 , a hydroxyl group claim 1 , a carboxyl group claim 1 , an amide group claim 1 , an epoxide group claim 1 , a cyclic ether group claim 1 , a sulfide group claim 1 , an acetal group claim 1 , and a lactone group.8. The adhesive film according to claim 1 , wherein the curable resin is an epoxy resin comprising a ...

Nitride ceramic resin composite body

A nitride-based ceramics resin composite body having thermal conductivity, electrical insulation, and adhesion to adherends equal to conventional products, and having improved heat resistance reliability during the reflow process, and a thermal conductive insulating adhesive sheet using the same are provided. A nitride-based ceramics resin composite body in which a thermosetting resin composition is impregnated in a porous nitride-based ceramics sintered body is provided. The thermosetting resin composition includes a specific epoxy resin and a bismaleimide triazine resin, and a water absorption of the thermosetting resin composition in a completely cured state measured in accordance with method A in JIS K7209 (2000) is 1% by mass or less.

Adhesive film and display member comprising the same

An adhesive film and a display member including the same are disclosed. The adhesive film is formed of an adhesive composition including: a copolymer of a monomer mixture including a hydroxyl group-containing (meth)acrylate and a comonomer; and nanoparticles. The adhesive film has a creep at −20° C. of about 50 μm to about 100 μm and a gel fraction of about 50% to about 75%.

SHEET-FORMING BODY, ADHESIVE SHEET, AND LAMINATE

The present invention provides a sheet-forming body containing a thiourethane bond-having compound and a thiol group-having compound, wherein, in an IR absorption spectrum thereof, the ratio of the peak intensity A of the absorption peak based on the carbonyl group in the thiourethane bond to the peak intensity B of the absorption peak based on the thiol group (A/B) is 20 or more and 250 or less. Using the sheet-forming body, rubber members, especially vulcanized rubber members can be strongly bonded, and the sheet-forming body and an adhesive sheet, which are excellent in handleability and workability, and a laminate produced by bonding rubber layers using the sheet-forming body are provided. 1. A sheet-forming body comprising a thiourethane bond-having compound and a thiol group-having compound , wherein:in an IR absorption spectrum thereof, the ratio of the peak intensity A of the absorption peak based on the carbonyl group in the thiourethane bond to the peak intensity B of the absorption peak based on the thiol group (A/B) is 20 or more and 250 or less.2. The sheet-forming body according to claim 1 , wherein at least a polythiol compound (A) and an isocyanate group-containing compound (B) are blended.3. The sheet-forming body according to claim 2 , wherein a radical generator (C) is further blended.4. The sheet-forming body according to claim 3 , wherein the radical generator (C) is a thermal radical generator containing a peroxide.5. The sheet-forming body according to claim 3 , wherein the content of the peroxide claim 3 , as measured through liquid chromatography mass spectrometry claim 3 , is 2% by mass or more.6. The sheet-forming body according to claim 2 , wherein the ratio of the total molar number of the isocyanate group contained in the isocyanate group-containing compound (B) to the total molar number of the thiol group contained in the polythiol compound (A) (isocyanate group/thiol group) is 0.2 or more and 0.78 or less.7. The sheet-forming body ...

Expandable Tape

A widthwise expandable tape is provided, the tape having a first adhesive side, a second adhesive side, and a flexible region between the two. The tape is adapted to be expandable and contractable in a widthwise direction. 1. A widthwise expandable tape comprising:a first adhesive strip defining one lengthwise edge of the widthwise expandable tape;a first quantity of adhesive disposed on a bottom face of the first adhesive strip;a second adhesive strip defining the other lengthwise edge of the widthwise expandable tape;a second quantity of adhesive disposed on a bottom face of the second adhesive strip;a flexible region, the flexible region connecting the first adhesive strip to the second adhesive strip, the first adhesive strip and second adhesive strip being substantially parallel when at rest, the flexible region adapted to allow a movement of the second adhesive strip with respect to the first adhesive strip upon an application of a force to at least one of the first adhesive strip and the second adhesive strip;wherein the first adhesive strip, second adhesive strip, and flexible region are formed of a single material;wherein a length of the first adhesive strip, second adhesive strip, and flexible region are equal; andwherein the flexible region is formed as a material having a pre-formed bellows shape, the bellows shaped area directly connecting the first and second strip.2. (canceled)3. The widthwise expandable tape of wherein the bellows are rounded.4. The widthwise expandable tape of wherein the bellows are angled.5. The widthwise expandable tape of claim 1 , the flexible region adapted to allow a movement of the second adhesive strip with respect to the first adhesive strip upon an application of the force greater than approximately 0.5 lb to at least one of the first adhesive strip and the second adhesive strip.7. The protective hanging system in a room of a building of further comprising a second piece of the tape connecting the sheet to one of a second ...

ANTISTATIC ADHESIVE COMPOSITION AND POLARIZING PLATE MANUFACTURED USING SAME

An antistatic adhesive composition includes a polyalkyleneglycol compound having one or more carboxyl group or thiol group in a molecule, an acryl copolymer, a cross-linking agent, and an antistatic agent. The antistatic composition exhibits excellent antistatic property, as well as significantly improving adhesiveness, thus to exhibit superior durability even at a high temperature. A polarizing plate fabricated using the antistatic composition is also provided. 1. An adhesive composition , comprising:a polyalkyleneglycol compound having at one of a carboxyl group or a thiol group in a molecule;an acryl copolymer;a cross-linking agent; andan antistatic agent.4. The adhesive composition according to claim 2 , wherein the polyalkyleneglycol compound is polyethyleneglycol bis(carboxymethyl) ether having a weight average molecular weight ranging from 100 to 1 claim 2 ,000.5. The adhesive composition according to claim 2 , wherein the polyalkyleneglycol compound is any one selected from the group consisting of polyethyleneglycol methyletherthiol having a weight average molecular weight ranging from 500 to 1 claim 2 ,200 claim 2 , polyethyleneglycol dithiol having a weight average molecular weight ranging from 500 to 1 claim 2 ,500 claim 2 , and a mixture thereof.6. The adhesive composition according to claim 1 , wherein the polyalkyleneglycol compound is included in an amount of 0.1 to 10 parts by weight relative to 100 parts by weight of the acryl copolymer based on solid content.7. The adhesive composition according to claim 1 , wherein the antistatic agent is at least one of bis(fluorosulfonyl)imide potassium (KN(FSO)) or bis(fluorosulfonyl)imide sodium (NaN(FSO)).8. An adhesive sheet comprising an adhesive layer formed of the adhesive composition according to .9. A polarizing plate comprising an adhesive layer formed of the adhesive composition according to on at least one surface thereof.10. The polarizing plate according to claim 9 , further comprising a polarizer ...

LINEAR LOW-DENSITY POLYETHYLENE MATERIALS FOR SELF-ADHESIVE FILMS

The present invention relates to a film comprising linear low-density polyethylene having a hexane extractables content as measured according to ASTM D-5227:95 of less than 2.5 wt % and a film RMS roughness measured by AFM according to point 4.2.2 ISO 4287:1997 of lower than 40 nm and/or an average roughness measured according to point 4.2.1 of ISO 4287:1997, of lower than 30 nm and a melt index (MI) measured according to ASTM D1238 at a temperature of 190° C. and a load of 2.16 kg of higher than 1.0 g/10 min. 1. A film comprising a linear low-density polyethylene having a hexane extractables content as measured according to ASTM D-5227:95 of less than 2.5 wt % and a film RMS roughness measured by AFM according to point 4.2.2 ISO 4287:1997 of lower than 40 nm and/or an average roughness measured according to point 4.2.1 of ISO 4287:1997 , of lower than 30 nm and a melt index (MI) measured according to ASTM D1238 at a temperature of 190° C. and a load of 2.16 kg of higher than 1.0 g/10 min and at most 10 g/10 min.2. The film according to in which said linear low-density polyethylene is obtained by a process for producing a copolymer of ethylene and a second α-olefin as comonomer in the presence of an Advanced Ziegler-Natta catalyst claim 1 , wherein the Advanced Ziegler-Natta catalyst is produced in a process comprising the steps of:{'sup': 1', '2', '1', '2, '(a) contacting a dehydrated support having hydroxyl groups with a magnesium compound having the general formula MgRR, wherein Rand Rare the same or different and are independently an alkyl group, alkenyl group, alkadienyl group, aryl group, alkaryl group, alkenylaryl group or alkadienylaryl group;'} [{'sup': 11', '12', '11', '12, 'sub': f', 'g', 'h, 'compound (B) is a compound having the general formula R(RO)SiX, wherein f, g and h are each integers from 0 to 4 and the sum of f, g and h is equal to 4, Si is a silicon atom, O is an oxygen atom, X is a halide atom and Rand Rare the same or different and are ...

PRESSURE SENSITIVE ADHESIVE TYPE OF WAVELENGTH CONVERSION TAPE FOR ENHANCING SOLAR HARVESTING EFFICIENCY

Described herein are pressure sensitive adhesive type of wavelength conversion tapes that are easy-to-apply to a solar harvesting device using an adhesive layer. The pressure sensitive adhesive type of wavelength conversion tape comprises a pressure sensitive adhesive layer, wherein the pressure sensitive adhesive layer comprises one, or multiple, luminescent dyes that convert photons of a particular wavelength to a different more desirable wavelength. The adhesive layer is designed to adhere to the light incident surface of a solar harvesting device such as a solar cell, solar panel, or photovoltaic device, to improve the efficiency of the device. 1. A pressure sensitive wavelength conversion tape comprising:a pressure sensitive adhesive layer, wherein the pressure sensitive adhesive layer comprises;an adhesive polymeric material; andat least one luminescent dye, wherein the at least one luminescent dye is configured to convert a portion of incoming photons of a first wavelength to a second wavelength.2. The tape according to claim 1 , further comprising a substrate layer claim 1 , wherein the substrate layer comprises a polymer material.3. The tape according to claim 1 , wherein the pressure sensitive adhesive layer comprises two or more luminescent dyes.4. The tape according to claim 1 , wherein the at least one luminescent dye is an up-conversion chromophore.5. The tape according to claim 1 , wherein the at least one luminescent dye is a down-shifting chromophore.6. The tape according to claim 1 , wherein the at least one luminescent dye is an organic dye.7. The tape according to claim 1 , wherein the at least one luminescent dye is selected from the group consisting of perylene derivative dye claim 1 , benzotriazole derivative dye claim 1 , and benzothiadiazole derivative dye.13. The tape according to claim 1 , wherein the polymer material is selected from the group consisting of polyethylenes claim 1 , polypropylenes claim 1 , polyester claim 1 , polyamide ...

METAL PIPES WITH ANTICORROSIVE POLYOLEFIN COVERING LAYER

The present invention provides a metal pipe coated on at least a section of the metal pipe with a polyolefin coating system, wherein the system consists of the following layers: (a) optionally, a corrosion protective layer of a chromate, phosphate or other salt; (b) a polyolefin based adhesive, preferably in a thickness of 0.3-5 mm; (c) a PE or PP coating layer, preferably in a thickness of 1-10 mm; (d) optionally, an adhesion promoting layer between the polyolefin based adhesive and a PE or PP layer; wherein the polyolefin based adhesive contains an organic phase consisting of substantially saturated hydrocarbons, and wherein the adhesive contains amorphous polypropylene, ethylene-propylene copolymers or poly(iso)butylene (co)polymers, said adhesive being flowable when a pressure of 10 kgf/cmis applied, wherein the PE or PP coating is a continuous layer over the coated section, and wherein said polyolefin based adhesive adheres to both the metal pipe and to said PE or PP coating. 3. Metal pipe according to claim 1 , wherein the metal pipe has an outer diameter of between about 60.3 (2 inch) and about 2540 mm (100 inch).4. Metal pipe according to claim 1 , wherein the polyolefin based adhesive contains an organic phase claim 1 , wherein the organic phase has an amount of ethylenic unsaturation of about 0.2 meq/g or less.5. Metal pipe according to claim 1 , wherein the polyolefin based adhesive exhibits a yield point at 90° C. claim 1 , at deformations of more than 1% when measured at 10 rad/sec with increased deformation.6. Metal pipe according to claim 1 , wherein the PE or PP layer consists substantially of—optionally reactive—HDPE claim 1 , MDPE claim 1 , LLDPE claim 1 , LDPE or isotactic or syndiotactic PP.7. Metal pipe according to claim 6 , wherein the continuous PE or PP layer is a HDPE.8. Metal pipe according to claim 1 , wherein the PE or PP is non-crosslinked.9. Metal pipe according to claim 1 , wherein the section of the metal pipe is a field joint claim ...

TRANSPARENT DOUBLE-SIDED ADHESIVE SHEET FOR IMAGE DISPLAY DEVICE AND IMAGE DISPLAY DEVICE USING THE SAME

A novel transparent double-sided adhesive sheet for image display device is provided, that, under the constraint of holding down the thickness of the adhesive sheet to 250 μm or less, can relieve a distortion arising within the adhesive sheet after laminating even if a member has a stepped portion of 50 μm to 100 μm in height on the laminating surface. 1. An image display device , comprising:two facing constitutive members, at least one constitutive member comprising, on a laminating surface, a stepped portion of from 50 μm to 100 μm in height and a flat surface portion excluding the stepped portion, anda transparent double-sided adhesive sheet filled in between the constitutive members,wherein a maximum thickness of the transparent double-sided adhesive sheet is 250 μm or less, andwherein a gel fraction at a position of the transparent double-sided adhesive sheet in contact with the stepped portion is 10% or greater, and is smaller than a gel fraction at a position of the transparent double-sided adhesive sheet in contact with the flat surface portion.2. The image display device according to claim 1 , wherein a difference between the gel fraction at the position in contact with the stepped portion and the gel fraction at the position in contact with the flat surface portion is from 5 to 30% in the transparent double-sided adhesive sheet.3. The image display device according to claim 1 , wherein the gel fraction at the position in contact with the stepped portion is from 30 to 80% and the gel fraction at the position in contact with the flat surface portion is from 35 to 100% in the transparent double-sided adhesive sheet.4. The image display device according to claim 1 , wherein the transparent double-sided adhesive sheet has been obtained by a process comprising forming the sheet from a photocuring-type adhesive composition.5. The image display device according to claim 1 , wherein the transparent double-sided adhesive sheet has been obtained by a process ...

SEMI-HARDENED PRESSURE-SENSITIVE ADHESIVE FILM

Disclosed is a semi-hardened pressure sensitive adhesive film to be used in the semi-hardened state and having excellent printing step absorption properties. The adhesive film according to the present invention contains a radial polymer composition and a cationic polymer composition, and the radial polymer composition is primarily cross-linked to maintain the semi-hardened state. When applied onto a substrate through a printing step, the present invention has excellent step absorption properties and adhesion properties and excellent durability even under high-temperature and high-humidity conditions. 1. An adhesive film comprising:a radical polymerizable composition; anda cation polymerizable composition,wherein the adhesive film is maintained in a semi-cured state by primary crosslinking of the radical polymerizable composition.2. The adhesive film according to claim 1 , wherein the adhesive film is completely cured by secondary crosslinking of the cation polymerizable composition.3. The adhesive film according to claim 1 , wherein the radical polymerizable composition comprises a compound having at least one unsaturated double bond and a photopolymerization initiator.4. The adhesive film according to claim 3 , wherein the compound having at least one unsaturated double bond comprises at least one of acrylic monomers and acrylic prepolymers.5. The adhesive film according to claim 3 , wherein the photopolymerization initiator comprises at least one of acetophenone claim 3 , benzophenone claim 3 , Michler's ketone claim 3 , benzoin claim 3 , benzylmethylketal claim 3 , benzoyl benzoate claim 3 , α-acyloxime ester claim 3 , and thioxanthone initiators.6. The adhesive film according to claim 1 , wherein the cation polymerizable composition comprises a cation polymerizable compound and a cation polymerization initiator.7. The adhesive film according to claim 6 , wherein the cation polymerizable compound comprises at least one of epoxy resins and vinyl ether resins.8. ...

Adhesive sheet

An adhesive sheet includes: a carbon nanotube sheet including a plurality of carbon nanotubes aligned preferentially in one direction within a plane of the sheet; and an adhesive agent layer including an adhesive agent, in which a rupture elongation of the adhesive sheet is 10% or more.

POLYESTER FILM AND ELECTRICAL INSULATION SHEET MANUFACTURED USING SAME, WIND POWER GENERATOR, AND ADHESIVE TAPE

A polyester film provided with a layer (a P layer) that contains a crystalline polyester (A) also contains plate-like particles (b) each having an aspect ratio of 2 or more and/or needle-like particle (b) each having an aspect ratio of 2 or more, wherein the Young's modulus of the polyester film is 2 GPa or more and the values of Wb and V/Wb are 10 or more and 1 or less, respectively, wherein Wb (% by mass) represents the total content of the plate-like particles (b) and the needle-like particles (b) in the P layer, and V (% by volume) represents the porosity in the P layer. 114-. (canceled)151212. A polyester film provided with a layer (a P layer) that contains a crystalline polyester (A) and also contains plate-like particles (b) each having an aspect ratio of 2 or more and/or needle-like particles (b) each having an aspect ratio of 2 or more , wherein the Young's modulus of the polyester film is 2 GPa or more and the values of Wb and V/Wb are 10 or more and 1 or less , respectively , wherein Wb (% by mass) represents the total content of the plate-like particles (b) each having an aspect ratio of 2 or more and the needle-like particles (b) each having an aspect ratio of 2 or more in the P layer , and V (% by volume) represents the porosity in the P layer.1612. The polyester film according to claim 15 , wherein the plate-like particle (b) and the needle-like particle (b) have on their surfaces a substituent reactive with the crystalline polyester (A) (hereinafter claim 15 , the substituent is called reactive substituent (a)) claim 15 , and the amount of the reactive substituent (a) on a unit surface area of the particle (B) is not smaller than 0.2×10mol/mand not greater than 1.4×10mol/m.1712211122. The polyester film according to claim 15 , wherein the P layer comprises both the plate-like particle (b) and the needle-like particle (b) claim 15 , and a Wb/Wb value is not smaller than 0.7 and not greater than 9 claim 15 , with the content of the plate-like particle ...

PRESSURE-SENSITIVE ADHESIVE SHEET

Provided is a pressure-sensitive adhesive (PSA) sheet having a low relative dielectric constant, satisfactory metal corrosion preventing property, and excellent member holding performance. The present invention provides a PSA sheet having a PSA layer including a base polymer and a rust inhibitor. The base polymer is an acrylic polymer, and monomeric components constituting the acrylic polymer comprise a (meth)acrylate having an alkyl group having 5 or more carbon atoms at an ester end at 50% by weight or more of the monomeric components. The PSA layer has a relative dielectric constant of 3 or less at 300 kHz. 1. A pressure-sensitive adhesive sheet comprising a pressure-sensitive adhesive layer comprising a base polymer and a rust inhibitor , whereinthe base polymer is an acrylic polymer;monomeric components constituting the acrylic polymer comprise a (meth)acrylate having an alkyl group having 5 or more carbon atoms at an ester end at 50% by weight or more of the monomeric components; andthe pressure-sensitive adhesive layer has a relative dielectric constant of 3 or less at 300 kHz.2. The pressure-sensitive adhesive sheet according to claim 1 , wherein the monomeric components comprise a carboxy group-containing monomer.3. The pressure-sensitive adhesive sheet according to claim 2 , wherein the amount of the carboxy group-containing monomer among the monomeric components is more than 3% by weight.4. The pressure-sensitive adhesive sheet according to claim 1 , wherein the monomeric components comprise an acrylate having an alkyl group having 6 to 10 carbon atoms at an ester end at 50% by weight or more of the monomeric components.5. The pressure-sensitive adhesive sheet according to claim 1 , wherein the pressure-sensitive adhesive layer comprises a tackifier resin.6. The pressure-sensitive adhesive sheet according to claim 5 , comprising a tackifier resin having a hydroxyl value of 30 mg KOH/g or more as the tackifier resin.7. The pressure-sensitive adhesive sheet ...

PRESSURE-SENSITIVE ADHESIVE SHEET

Provided is a pressure-sensitive adhesive (PSA) sheet including a PSA layer formed from a PSA composition including a base polymer, crosslinking agents of two or more species having mutually different types of crosslinkable functional groups, and an azole-based rust inhibitor. Here, one of the crosslinking agents of two or more species is an isocyanate-based crosslinking agent. Monomeric components constituting the base polymer include a carboxy group-containing monomer. The amount of the azole-based rust inhibitor in the PSA layer is less than 8 parts by weight with respect to 100 parts by weight of the base polymer. 1. A pressure-sensitive adhesive sheet including a pressure-sensitive adhesive layer , whereinthe pressure-sensitive adhesive layer is formed from a pressure-sensitive adhesive composition including a base polymer, crosslinking agents of two or more species having mutually different types of crosslinkable functional groups, and an azole-based rust inhibitor;one of the crosslinking agents of two or more species is an isocyanate-based crosslinking agent;monomeric components constituting the base polymer comprise a carboxy group-containing monomer; andan amount of the azole-based rust inhibitor in the pressure-sensitive adhesive layer is less than 8 parts by weight with respect to 100 parts by weight of the base polymer.2. The pressure-sensitive adhesive sheet according to claim 1 , wherein the pressure-sensitive adhesive layer has a relative dielectric constant of 3 or more at 300 kHz.3. The pressure-sensitive adhesive sheet according to claim 1 , wherein the monomeric components constituting the base polymer comprise a (meth)acrylate having an alkyl group having 4 or less carbon atoms at an ester end at 50% by weight or more of the monomeric components.4. The pressure-sensitive adhesive sheet according to claim 1 , wherein an amount of the carboxy group-containing monomer among the monomeric components is more than 3% by weight.5. The pressure-sensitive ...

METHOD FOR MANUFACTURING ELECTRICALLY CONDUCTIVE ADHESIVE FILM, ELECTRICALLY CONDUCTIVE ADHESIVE FILM, AND METHOD FOR MANUFACTURING CONNECTOR

A step of scattering electrically conductive particles on a wiring board having wiring that is formed in accordance with an array pattern of the electrically conductive particles and prevented from being charged, and charging the electrically conductive particles; a step of aligning the charged electrically conductive particles in a predetermined array pattern corresponding to the wiring pattern by moving a squeegee on the wiring board; and a step of bonding a transfer film having an adhesive material layer formed thereon to the wiring board and transferring the electrically conductive particles aligned in a predetermined array pattern to the adhesive layer. 1. An electrically conductive adhesive film comprising:a base film;a binder resin that is laminated on the base film; andelectrically conductive particles that are regularly dispersed and disposed on the binder resin in a predetermined pattern,wherein, among the electrically conductive particles, electrically conductive particles having a mark on a surface are within 30% of the total number of particles.2. The electrically conductive adhesive film according to claim 1 , wherein the electrically conductive particles is subjected to further insulation treatment.3. An electrically conductive adhesive film comprising:a base film;a binder resin that is laminated on the base film; andelectrically conductive particles that are regularly dispersed and disposed on the binder resin in a predetermined pattern,wherein the electrically conductive particles have a metal surface, andwherein the electrically conductive particles include electrically conductive particles in which a portion of the metal surface is peeled off.4. The electrically conductive adhesive film according to claim 3 , wherein the electrically conductive particles are coated on a surface with a metal.5. The electrically conductive adhesive film according to claim 4 , wherein the electrically conductive particles coated on a surface with a metal are plated ...

Adhesive sheet and method for manufacturing semiconductor device

The adhesive sheet of the invention comprises a resin composition containing (A) a high-molecular-weight component, (B1) a thermosetting component having a softening point of below 50° C., (B2) a thermosetting component having a softening point of between 50° C. and 100° C. and (C) a phenol resin having a softening point of no higher than 100° C., the composition containing 11 to 22 mass % of the (A) high-molecular-weight component, 10 to 20 mass % of the (B1) thermosetting component having a softening point of below 50° C., 10 to 20 mass % of the (B2) thermosetting component having a softening point of between 50° C. and 100° C. and 15 to 30 mass % of the phenol resin having a softening point of no higher than 100° C., based on 100 mass % of the resin composition.

PROTECTIVE FILM ATTACHING APPARATUS

A protective film attaching apparatus is for attaching a protective film to a display area of a portable electronic apparatus. A protective film attaching apparatus includes a case configured to receive a rear surface of a portable electronic apparatus, a cover configured to receive a front surface of the portable electronic apparatus and formed at a side of the case configured to rotate for opening or closing the case, and a film member provided in the cover configured to be attached on a front display area of the portable electronic apparatus. 1. A protective film attaching apparatus , comprising:a case having a first receiving groove configured to receive a rear surface of a portable electronic apparatus;a cover having a second receiving groove configured to receive a front surface of the portable electronic apparatus, and formed at a side of the case configured to rotate for opening or closing the case, the second receiving groove being corresponding to the first receiving groove; anda film member provided in the second receiving groove,with the proviso that the protective film attaching apparatus has at least one of the following features of (i) to (iv):(i) wherein the cover has a first extending groove formed from an upper edge of the cover to an upper portion of the second receiving groove, a second extending groove formed from a lower edge of the cover to a lower portion of the second receiving groove, and a folding line which is formed from the first extending groove to the second extending groove through the second receiving groove;(ii) wherein a through hole is formed through a bottom surface of the second receiving groove, a pair of adhesive tape to support the film member is attached on the both side of the through hole, respectively; andthe cover comprises a stepped portion formed at both side of the through hole in a width direction, and boundary of the film member is received in the second receiving groove with spaced apart from the stepped portion ...

DOUBLE-SIDED ADHESIVE TAPE COMPRISING A FIRST OUTER, PRESSURE-SENSITIVE ADHESIVE SIDE, AND A SECOND OUTER SIDE WHICH CAN BE THERMALLY-ACTIVATED

The invention relates to a double-sided adhesive tape having a first outer, pressure-sensitive adhesive side and a second outer, thermally-activatable side, and that comprises an at least dual-layered product construction consisting of layers A and B, layer A being a pressure-sensitive adhesive layer that is chemically cross-linked by thermal initiation, or being a pressure-sensitively adhesive carrier layer chemically cross-linked by thermal initiation, layer B being a thermoplastic synthetic material-based layer, layers A and B being in direct contact with one another, and the surface of layer A, which is in direct contact with layer B, having been corona or plasma pre-treated. The corona or plasma pre-treatment takes place in an atmosphere of nitrogen, carbon dioxide or a noble gas, or a mixture of at least two of these gases. The inventive adhesive tape is useful for adhesively bonding articles composed of thermoplastic polymer, of EPDM, or of another rubberlike material. 1. A double-sided adhesive tape having a first outer pressure-sensitive adhesive side and a second outer heat-activatable side , comprising an at least two-layer product system composed of layers A and B ,layer A being a layer of pressure-sensitive adhesive crosslinked chemically by thermal initiation, or a pressure-sensitively adhesive carrier layer crosslinked chemically by thermal initiation,layer B being a layer based on a thermoplastic polymer,layer A and layer B being in direct contact with one another, andthe surface of layer A that is in direct contact with layer B having been corona- or plasma-pretreated,whereinthe corona or plasma pretreatment has taken place in an atmosphere of nitrogen, carbon dioxide, or a noble gas, or a mixture of at least two of these gases.2. The double-sided adhesive tape as claimed in claim 1 ,whereinthe surface of the layer A that is in contact with layer B has been corona- or plasma-pretreated in the chemically crosslinked state.3. The double-sided adhesive ...

MULTILAYER OPTICAL ADHESIVES AND METHODS OF MAKING SAME

A multilayer optical adhesive including a first viscoelastic or elastomeric adhesive layer and a second viscoelastic or elastomeric adhesive layer. A crosslinked or soluble resin layer may be disposed between the first viscoelastic or elastomeric adhesive layer and the second viscoelastic or elastomeric adhesive layer or the first viscoelastic or elastomeric adhesive layer may be immediately adjacent to the second viscoelastic or elastomeric adhesive layer. An interface between immediately adjacent layers is structured and there is a difference in refractive indices across the interface. 1. An optical adhesive comprising:{'sub': '1', 'a first viscoelastic or elastomeric adhesive layer having a first major surface, an unstructured second major surface, and having a first refractive index n;'}{'sub': '2', 'a second viscoelastic or elastomeric adhesive layer immediately adjacent the first major surface of the first viscoelastic or elastomeric adhesive layer, the second viscoelastic or elastomeric adhesive having a second refractive index n;'}{'sub': 1', '2, 'wherein a first interface between the first viscoelastic or elastomeric adhesive layer and the second viscoelastic or elastomeric adhesive layer includes a substantially continuous grating having a peak to valley height h and a pitch and wherein h multiplied by |n−n| is in a range of about 150 nm to about 350 nm and the pitch is in a range of about 2 microns to about 50 microns.'}2. The optical adhesive of claim 1 , wherein the first viscoelastic or elastomeric adhesive layer is a first viscoelastic optically clear adhesive and the second viscoelastic or elastomeric adhesive layer is a second viscoelastic optically clear adhesive.3. The optical adhesive of claim 1 , further comprising a first release liner having a first release surface immediately adjacent the unstructured second major surface and a second release liner having a second release surface immediately adjacent the second viscoelastic or elastomeric ...

Cellulose Cyanoacrylate and Method of Employment

Cellulose cyanoacrylate is employed either to bond two surfaces or to duplicate the shape of a three-dimensional object. The method is carried out by applying a release material to the object to be duplicated, applying a sheet of cellulosic material formed of wood fibers onto the three dimensional object, then saturating the sheet of cellulosic material with a cyanoacrylate glue and permitting the saturated sheet to cure. The resulting product duplicates the shape of the object. Two surfaces may be bonded by placing a sheet of cellulosic material between the two surfaces and applying the cyanoacrylate glue to edges of the sheet until saturated and allowing it to cure. Paper toweling may favorably be employed as the cellulosic material. This material may also be employed in bone or tooth repair. A break or fracture in an article can be repaired by positioning a sheet of cellulosic material over the break, saturating it with cyanoacrylate glue, and holding the saturated sheet in place with a releasable film. Irritating fumes may be suppressed by covering the saturated cellulosic material with a release film. 120-. (canceled)21. (canceled)22. (canceled)23. (canceled)24. A cellulose cyanoacrylate compound , comprising a waterproof composition of matter formed by saturating fibrous cellulosic material selected from the group consisting of cotton and sheets of paper toweling comprising wood fibers , with liquid cyanoacrylate glue.25. compound of wherein the glue is selected from the group consisting of one or more of cyano-methyl claim 24 , cyano-ethyl and cyano-octyl acrylates.26. compound of having properties of high rigidity and high abrasion resistance.27. compound of shaped while curing with pressure applied through a layer of flexible material that is releasable from the cured surface.28. compound of applied as a support system for repair of a bone fracture. An invention is provided for repairing a wide variety of broken items made of plastic, wood or metal and is ...

Composite Pillar Structures

Composite pillar structures, in particular for adhesion to soft and rough surfaces, include in the longitudinal direction at least one region with lower elasticity modulus and at least one region with higher elasticity modulus. The region with lower elasticity modulus preferably includes an end face, wherein the two regions adjoin one another. 1. A structured surface of a solid body , wherein the surface has a structuring which comprises a large number of projections which each have at least one stem with an end face pointing away from the surface , whereinthe stem in the longitudinal direction comprises at least two regions with different elasticity modulus, wherein at least two of the regions adjoin one another and form a phase boundary.2. The structured surface as claimed in claim 1 , wherein the phase boundary is not parallel to the end face of the respective projection.3. The structured surface as claimed in claim 1 , wherein the phase boundary has a curvature.4. The structured surface as claimed in claim 1 , wherein the projections have an aspect ratio of at least 3.5. The structured surface as claimed in claim 1 , wherein the projections are connected by a film.6. The structured surface as claimed in claim 1 , wherein the projections has broadened end faces.7. A method for the production of a structured surface of a solid body claim 1 , wherein the surface has a structuring which comprises a large number of projections claim 1 , which each comprise at least one stem with an end face pointing away from the surface claim 1 , wherein the stem in the longitudinal direction comprises at least one region with lower elasticity modulus and at least one region with higher elasticity modulus claim 1 , comprising the following steps:a) providing a template for the structured surface;b) producing a composition comprising the material for the end faces of the surface;c) introducing the composition into the template;d) optionally completely or partially curing the ...

ADHESIVE MICROSTRUCTURE

A microstructure made of flexible material includes a plurality of projections extending from a common substrate. A distal end of each projection includes a resilient flap. All lateral dimensions of each of the projections increase monotonically with increased distance from a surface defined by distal ends of the flaps when the flaps are unbent. Each of the projections extends from the common substrate in a general direction that is locally substantially perpendicular to the surface defined by the ends of the flaps. When a shear force is applied to each of the flaps by relative motion between the flap and a cooperating surface in contact with the flap, the flap bends so as to increase the area of contact of that flap with the cooperating surface, affecting adhesion between the microstructure and the cooperating surface. 1. A microstructure made of flexible material and comprising a plurality of projections extending from a common substrate , a distal end of each projection including a resilient flap , wherein all lateral dimensions of each of the projections increase monotonically with increased distance from a surface defined by distal ends of the flaps when the flaps are unbent , and wherein each of the projections extends from the common substrate in a general direction that is locally substantially perpendicular to the surface defined by the ends of the flaps , such that when a shear force is applied to each of the flaps by relative motion between that flap and a cooperating surface in contact with that flap , that flap bends so as to increase the area of contact of that flap with the cooperating surface and to affect adhesion between the microstructure and the cooperating surface.2. The microstructure of claim 1 , wherein claim 1 , the surface defined by the ends of the flaps is substantially planar.3. The microstructure of claim 2 , wherein the thickness of the flap is less than one millimeter.4. The microstructure of claim 1 , wherein said plurality of ...

CONDUCTIVE ADHESIVE, ANISOTROPIC CONDUCTIVE FILM AND ELECTRONIC DEVICES USING BOTH

[Problem] To provide: a conductive adhesive which contains an epoxy (meth)acrylate resin and which can form a bonded zone that is not susceptible to being deteriorated by halogen; an anisotropic conductive film; and electronic devices using both. [Solution] A conductive adhesive and an anisotropic conductive film which each contain a conductive filler and a binder resin, wherein: the binder resin comprises an epoxy (meth)acrylate resin that is a product of addition reaction of (meth)acrylic acid and an epoxy compound having a sum of total chlorine atom concentration and total bromine atom concentration of 300 massppm or less, preferably 50 massppm or less; and the conductive filler is dispersed in the binder resin which comprises such an epoxy (meth)acrylate resin. The epoxy (meth)acrylate resin is preferably prepared by subjecting a starting compound (substrate) having a carbon-carbon double bond to epoxidation of the double bond with an oxidizing agent consisting of hydrogen peroxide, and then subjecting the obtained epoxy compound to addition reaction with (meth)acrylic acid. 1. A conductive adhesive comprising conductive fillers and a binder resin ,the binder resin comprising an epoxy (meth)acrylate resin, and the epoxy (meth)acrylate resin being formed by adding a (meth)acrylic acid to an epoxy compound having the sum of total chlorine atom concentration and total bromine atom concentration of 300 mass ppm or less.2. A conductive adhesive according to claim 1 , wherein the sum of total chlorine atom concentration and total bromine atom concentration is 50 mass ppm or less.3. A conductive adhesive according to claim 1 , wherein a raw material for the epoxy (meth)acrylate resin is an epoxy compound obtained by epoxidizing a carbon-carbon double bond of a raw material compound (substrate) having a carbon-carbon double bond claim 1 , using a peroxide as an oxidant.4. A conductive adhesive according to claim 1 , wherein the raw material compound (substrate) is a ...

Adhesive wall panel

An adhesive wall panel provides a thin layer of drywall or paneling with peel-and-stick backing, for mounting on an existing wall or on particle board or plywood. The peel-and-stick backing is comprised of a thin layer of strong, permanent adhesive, preferably covered with a thin cover sheet of plastic or similar durable material which may be peeled away immediately before installation. 1(a) a wall panel;(b) an adhesive layer;(c) said adhesive layer being located on a back side of said wall panel;(d) said adhesive layer being a strong and permanent adhesive;(e) a thin cover sheet; and(f) said thin cover sheet being removably placed over said adhesive layer.. An adhesive wall panel, comprising: This Application claims the benefit of U.S. Provisional Application No. 62/043,808, filed Aug. 29, 2014, which is hereby incorporated by reference.Not ApplicableNot ApplicableNot ApplicableThe invention relates generally to construction materials and in particular to an adhesive wall panel. On some construction and remodeling projects, drywall or wooden paneling is being installed where a wall already exists. On other projects, drywall or paneling is desired as an outer surface, but a more structurally durable base layer is desired. These construction and remodeling methods produce a top quality wall surface, but are quite labor intensive and costly, and an alternative would be well received. An adhesive wall panel, providing a thin layer of drywall or paneling with peel-and-stick backing, for rapid mounting on an existing wall or on particle board or plywood, without the use of nails or drywall tape, would resolve this problem.Accordingly, the invention is directed to an adhesive wall panel. The panel provides a thin layer of drywall or paneling with peel-and-stick backing, for mounting on an existing wall or on particle board or plywood. The peel-and-stick backing is comprised of a thin layer of strong, permanent adhesive, preferably covered with a thin cover sheet of ...

TRANSPARENT ADHESIVE SHEET

The present invention is a transparent pressure-sensitive adhesive sheet that is formed of a resin composition [F], and has a storage modulus at 25° C. of 1×10to 1×10Pa, the resin composition [F] comprising a modified hydrogenated block copolymer [E] as a main component, the modified hydrogenated block copolymer [E] being obtained by introducing an alkoxysilyl group into a hydrogenated block copolymer [D], the hydrogenated block copolymer [D] being obtained by hydrogenating 90% or more of unsaturated bonds of a block copolymer [C] that comprises at least two polymer blocks [A] comprising a specific compound and at least one polymer block [B] comprising a specific compound, and a ratio (wA:wB) of a total weight fraction wA of the polymer block [A] in the block copolymer [C] to a total weight fraction wB of the polymer block [B] in the block copolymer [C] being 20:80 to 60:40. 1. A transparent pressure-sensitive adhesive sheet that is formed of a resin composition [F] , and has a storage modulus at 25° C. of 1×10to 1×10Pa , the resin composition [F] comprising a modified hydrogenated block copolymer [E] as a main component , the modified hydrogenated block copolymer [E] being obtained by introducing an alkoxysilyl group into a hydrogenated block copolymer [D] , the hydrogenated block copolymer [D] being obtained by hydrogenating 90% or more of unsaturated bonds of a block copolymer [C] that comprises at least two polymer blocks [A] and at least one polymer block [B] , the polymer block [A] comprising a repeating unit derived from an aromatic vinyl compound as a main component , the polymer block [B] comprising a repeating unit derived from a linear conjugated diene compound as a main component , and a ratio (wA:wB) of a total weight fraction wA of the polymer block [A] in the block copolymer [C] to a total weight fraction wB of the polymer block [B] in the block copolymer [C] being 20:80 to 60:40.2. The transparent pressure-sensitive adhesive sheet according to claim ...

Adhesive composition and adhesive sheet

Provided is an adhesive sheet having an adhesive layer formed of an adhesive composition that contains 100 parts by mass of a polyisobutylene-based resin (A) having a weight-average molecular weight of from 270,000 to 480,000, from 5 to 55 parts by mass of a polyisobutylene-based resin (B) having a weight-average molecular weight of from 100,000 to 250,000, and from 10 to 55 parts by mass of a hydrogenated petroleum resin (C) having a softening point of from 90 to 135° C.; and provided is an adhesive sheet having at least one adhesive layer wherein the probe tack of the adhesive layer, as measured at a peel rate of 600 mm/min according to JIS-Z0237 (1991), has two maximum values and wherein the first maximum value P1 detected first is at least 4.0 N and the ratio of the second maximum value P2 detected secondarily to the first maximum value P1 [P2/P1] is from 0.25 to 1.50. The adhesive sheets have excellent adhesion force and retention force, can prevent occurrence of zipping, have a low moisture vapor transmission rate, are excellent in transparency and can retard outgas generation.

SYSTEMS AND METHODS FOR DRILLING HOLES IN PRINTED CIRCUIT BOARDS

An entry sheet comprising polymer material for drilling printed circuit boards is provided. The entry sheet is suitable for use with a broad range of diameters, including commonly available drill diameters. The entry sheet comprises an adhesive epoxy configured to, among others, resist drill deflection, resist mechanical damage, and reduce to dust such that the entry sheet may increase drilling accuracy, protect printed circuit board from damage, minimize entry burrs, and may addresses other issues such as fliers, bird nesting, and the like. 1. An entry sheet for drilling circuit boards , the entry sheet comprising:a substrate layer having a thickness of about 6 mils or less; andan entry sheet component provided over the substrate layer, wherein the entry sheet component has a thickness of about 6 mils or less.2. The entry sheet of claim 1 , wherein the entry sheet has a thickness in the range of about 4-12 mils.3. The entry sheet of claim 1 , wherein the substrate layer has a thickness in the range of about 1-6 mils.4. The entry sheet of claim 1 , wherein the entry sheet component has a thickness in the range of about 3-6 mils.5. The entry sheet of claim 1 , wherein the entry sheet is configured to be used with drill diameters in the range of about 0.10-6.7 mm.6. The entry sheet of claim 1 , wherein the entry sheet component comprises an adhesive.7. The entry sheet of claim 1 , wherein the entry sheet component comprises an epoxy.8. The entry sheet of claim 7 , wherein the epoxy is of the type bisphenol a/epichlorohydrin.9. The entry sheet of claim 1 , wherein the substrate layer comprises high-density fiberboard claim 1 , medium density fiberboard claim 1 , metal claim 1 , metal alloys claim 1 , paper claim 1 , melamine claim 1 , random fiber mats claim 1 , plastic claim 1 , chip board claim 1 , particle board claim 1 , phenolic claim 1 , phenolic supported with paper claim 1 , cloth claim 1 , or glass fiber claim 1 , solid phenolic sheets claim 1 , or laminated ...

Sealing Element

A sealing element of flexible foam which includes at least three sealing tape sections which are arranged next to each other in a functional direction of the sealing element. At least one first barrier layer section and at least one second barrier layer section are each accommodated between two adjacent sealing tape sections. The barrier layer sections connect the adjacent sealing tape sections to each other. The first barrier layer section forms a loop in an area of the bottom surface of the sealing element and the second barrier layer section forms a loop in an area of the top surface of the sealing element. 2. The sealing element of comprising several first barrier layer sections and/or several second barrier layer sections claim 1 , wherein when viewed in the functional direction claim 1 , a first barrier layer section and a second barrier layer section always occur in alternation.3. The sealing element of wherein the at least one first barrier layer section and the at least one second barrier layer section comprise a film.4. The sealing element of wherein each of the loops comprises two substantially parallel legs and a curved part connecting the legs claim 1 , the two legs being bonded together. This application claims priority to European Patent Application No. EP 17 189 098.1, filed Sep. 1, 2017, the entire contents of which are incorporated by reference in its entirety.The present invention relates to a sealing element and to a method for the production of a sealing tape roll of flexible, compressible foam with at least one barrier layer extending in the radial direction.Sealing tapes unwound from sealing tape rolls are usually used to seal joints such as those between a frame profile of a window or a door and a building wall to seal the joints against drafts and driving rain. Films additionally provided on a lateral surface of the sealing tape increase the impermeability of the tape to water vapor; see, for example, U.S. Pat. No. 4,401,716, US 2010/009118 ...

POLYMERIZABLE COMPOSITION, POLYMER, OPTICAL ADHESIVE SHEET, IMAGE DISPLAY DEVICE, AND METHOD FOR MANUFACTURING IMAGE DISPLAY DEVICE

Provided are: a polymerizable composition; a polymer obtained by polymerizing the composition (including an optical adhesive sheet); an image display device using the polymer; and a method for manufacturing the image display device. The polymerizable composition includes: (1) at least one chosen from the group consisting of a compound including a (meth)acrylol group with a polyolefin structural unit, a compound including a (meth)acrylol group with a hydrogenated polyolefin structural unit, a compound including a (meth)acrylol group with a (poly)ester structural unit, and a compound including a (meth)acrylol group with a (poly)carbonate structural unit; (2) a liquid compound including a (meth)acrylol group other than constituent (1); (3) at least one chosen from the group consisting of liquid hydrogenated polybutadiene polyol, liquid hydrogenated polyisoprene polyol, and hydrogenated dimer diol; and (4) a photopolymerization initiator. 1. A polymerizable composition for manufacturing a polymerization product for forming a polymerization product layer interposed between an image-display unit and a light-transmitting protection unit of an image-display device , wherein the polymerizable composition comprisesComponent (1): at least one selected from the group consisting of a (meth)acryloyl group-containing compound having a polyolefin structural unit, a (meth)acryloyl group-containing compound having a hydrogenated polyolefin structural unit, a (meth)acryloyl group-containing compound having a (poly)ester structural unit, and a (meth)acryloyl group-containing compound having a (poly)carbonate structural unit;Component (2): a liquid (meth)acryloyl group-containing compound other than Component (1);Component (3): at least one selected from the group consisting of a liquid hydrogenated polybutadiene polyol, a liquid hydrogenated polyisoprene polyol, and a hydrogenated dimer diol; andComponent (4): a photopolymerization initiator.2. The polymerizable composition according ...

PRESSURE-SENSITIVE ADHESIVE SHEET FOR FASTENING POLISHING PAD

This invention provides a polishing pad-fastening pressure-sensitive adhesive sheet capable of tightly fastening a polishing pad. The polishing pad-fastening pressure-sensitive adhesive sheet comprises a pressure-sensitive adhesive layer constituting an adhesive face of the pressure-sensitive adhesive sheet. The adhesive face exhibits a 180° peel strength of 30 N/20 mm or greater relative to a stainless steel plate. 1. A pressure-sensitive adhesive sheet for fastening a polishing pad , the pressure-sensitive adhesive sheet comprising a pressure-sensitive adhesive layer constituting an adhesive face of the pressure-sensitive adhesive sheet , whereinthe adhesive face exhibits a 180° peel strength of 30 N/20 mm or greater relative to a stainless steel plate.2. The pressure-sensitive adhesive sheet according to claim 1 , wherein the pressure-sensitive adhesive layer comprises claim 1 , as a base polymer claim 1 , a block copolymer of a monovinyl-substituted aromatic compound and a conjugated diene compound.3. The pressure-sensitive adhesive sheet according to claim 2 , wherein the base polymer is a styrene-based block copolymer.4. The pressure-sensitive adhesive sheet according to claim 1 , wherein the pressure-sensitive adhesive layer comprises a tackifier resin claim 1 , the tackifier resin comprising a high softening point resin having a softening point of 120° C. or above.5. The pressure-sensitive adhesive sheet according to claim 4 , wherein the high softening point resin comprises a terpene phenol resin.6. The pressure-sensitive adhesive sheet according to claim 4 , wherein the tackifier resin comprises a low softening point resin having a softening point below 120° C.7. The pressure-sensitive adhesive sheet according to claim 1 , constituted as an adhesively double-faced pressure-sensitive adhesive sheet comprising a substrate claim 1 , a first pressure-sensitive adhesive layer as the pressure-sensitive adhesive layer provided on a face of the substrate claim 1 , ...

Method of manufacturing organic electronic device

Provided is a method of manufacturing an organic electronic device using a pressure-sensitive adhesive film. The method of manufacturing an organic electronic device including an encapsulation layer having excellent moisture barrier property and adhesiveness may be provided. In addition, according to the manufacturing method, for example, though the encapsulation layer is formed on an entire surface of an organic electronic element, a flexibility phenomenon of the organic electronic device may be minimized, and the organic electronic device may be manufactured without damage to the organic electronic element for a short process time.

Adhesive tape, preferably self-adhesive tape, comprising of at least two layers a and b laminated directly on one another, with at least one or both layers a or b being an adhesive

Adhesive tape having at least two layers A and B laminated directly on one another, with at least one or both layers A or B being an adhesive, and the interfaces of the layers A and B laminated on one another being subjected to a physical method, the physical method being selected from the group consisting of corona discharge, dielectric barrier discharge, flame pretreatment and plasma treatment, before the layers are laminated to one another, with the two methods differing from one another.

THERMOPLASTIC ADHESIVE FILM, BONDING METHOD AND BONDED BODY

The objective of the present invention is to provide a thermoplastic adhesive film capable of, in a thermobonding step of a laminated body of different materials used particularly in automobile members, electronic members, construction members, etc., such as a polypropylene resin material, a polyamide resin material, and a metal material such as aluminum or steel plates, preventing deformation of the resin material and peeling due to thermal history after molding. Provided as a solution is a thermoplastic adhesive film comprising a resin composition (D) which contains a thermoplastic olefin elastomer resin (A), an acid-modified polypropylene resin (B) and a nucleating agent (C). 1. A thermoplastic adhesive film comprising , a thermoplastic olefin elastomer resin (A);', 'an acid-modified polypropylene resin (B);', 'a crystal nucleating agent (C); and', 'a polypropylene resin (E),', 'satisfying a weight ratio [(A)/(E)] of the thermoplastic olefin elastomer resin (A) and the polypropylene resin (E) being from 100/0 to 10/90 (provided that (A)+(E)=100), and', 'containing the acid-modified polypropylene resin (B) in an amount of from 20 to 500 parts by weight relative to 100 parts by weight of a total weight of (A) and (E),, 'a resin composition (D) comprising{'sup': '−1', 'claim-text': {'br': None, 'i': T', 'T, '(1/2)≥0.90\u2003\u2003Equation (1).'}, 'wherein the resin composition (D) has a viscosity increase initiation temperature T1 when being cooled from a molten state of 180° C. at a strain of 1%, a share rate of 100 sand a rate of 3° C./min and a softening initiation temperature T2 when being pulled at a strain of 1% and a temperature rising rate of 10° C./min while applying oscillation having a frequency from 1 to 100 Hz, satisfying the following Equation (1)2. (canceled)3. The thermoplastic adhesive film according to claim 1 , wherein the resin composition (D) has a complex viscosity at 150° C. claim 1 , a strain of 1% and a shear rate of 100 s-1 being 600 Pa·s ...

TAPE, TAPE ATTACHING METHOD, AND TAPE EXPANDING METHOD

A tape adapted to be attached to a workpiece. The tape has a pattern for checking tension applied to the tape. The pattern is provided on the whole or part of the front side of the tape. The tension may be checked before expansion of the tape, during expansion of the tape, or after expansion of the tape. The tension may be checked after attaching the tape to the workpiece. By using a tape expander having four holding units holding the four side edge portions of the tape, the tape is expanded by moving the four holding units holding the tape so that the holding units are moved away from the workpiece. Deformation of the pattern due to the expansion of the tape is checked by visual inspection or by using an imaging camera to thereby determine the attached condition of the tape to the workpiece. 1. A tape adapted to be attached to a workpiece , the tape having a pattern for checking tension applied to the tape.2. The tape according to claim 1 , wherein the pattern is provided on the whole surface of one side of the tape.3. A tape attaching method for attaching a tape to a workpiece claim 1 , the tape having a pattern for checking tension applied to the tape claim 1 , the tape attaching method comprising:a tape preparing step of preparing the tape;a tape attaching step of attaching the tape to the workpiece; anda determining step of checking the tension applied to the tape according to deformation of the pattern after performing the tape attaching step, and then determining whether or not an attached condition of the tape to the workpiece is good.4. A tape expanding method for expanding a tape attached to a workpiece claim 1 , the tape having a pattern for checking tension applied to the tape claim 1 , the tape expanding method comprising:an attaching step of attaching the tape to the workpiece;an expanding step of expanding the tape after performing the attaching step; anda tension checking step of checking the tension applied to the tape according to deformation of ...

Interlayer filler material for touch panels, and laminate

The present invention aims to provide an interlayer filling material for a touch panel which is used for filling an interlayer space between a touch panel and another component or an interlayer space between transparent conductive films included in the touch panel in production of a personal digital assistant, which is excellent in followability to steps of a decorative printing portion or wiring upon filling of an interlayer space (lamination) and also excellent in defoaming properties to release air bubbles entrapped during filling of an interlayer space (lamination) or air bubbles left near the steps, which is less likely to be whitened and less likely to deteriorate an ITO film even under a high-temperature and high-humidity environment. The present invention also aims to provide a laminate produced using the interlayer filling material for a touch panel. The present invention relates to an interlayer filling material for a touch panel used for filling an interlayer space between a touch panel and another component or an interlayer space between transparent conductive films included in the touch panel, the interlayer filling material including: a polyvinyl acetal; a plasticizer; and an organic acid, the plasticizer being at least one selected from the group consisting of triethylene glycol-di-2-ethylhexanoate, tetraethylene glycol-di-2-ethylhexanoate, triethylene glycol-di-pivalate, and di-(2-butoxyethyl)adipate, the organic acid being at least one selected from the group consisting of 2-ethylhexanoic acid, adipic acid, and phthalic acid.

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND UNDERFILL FILM

A method for manufacturing a semiconductor device and an underfill film which can achieve voidless mounting and excellent solder bonding properties even in the case of collectively bonding a plurality of semiconductor chips are provided. The method includes a mounting step of mounting a plurality of semiconductor chips having a solder-tipped electrode onto an electronic component having a counter electrode opposing the solder-tipped electrode via an underfill film; and a compression bonding step of collectively bonding the plurality of semiconductor chips to the electronic component via the underfill film. The underfill film contains an epoxy resin, an acid anhydride, an acrylic resin, and an organic peroxide and has a minimum melt viscosity of 1,000 to 2,000 Pa*s and a melt viscosity gradient of 900 to 3,100 Pa*s/° C. from a temperature 10° C. higher than a minimum melt viscosity attainment temperature to a temperature 10° C. higher than the temperature. 1. A method for manufacturing a semiconductor device comprising:a mounting step of mounting a plurality of semiconductor chips having a solder-tipped electrode onto an electronic component having a counter electrode opposing the solder-tipped electrode via an underfill film; anda compression bonding step of collectively bonding the plurality of semiconductor chips to the electronic component via the underfill film,wherein the underfill film contains an epoxy resin, an acid anhydride, an acrylic resin, and an organic peroxide, the underfill film having a minimum melt viscosity of 1,000 to 2,000 Pa*s and a melt viscosity gradient of 900 to 3,100 Pa*s/° C. from a temperature 10° C. higher than a minimum melt viscosity attainment temperature to a temperature 10° C. higher than the temperature.2. The method for manufacturing a semiconductor device according to claim 1 , wherein the melt viscosity gradient is 1 claim 1 ,700 to 3 claim 1 ,100 Pa*s/° C.3. The method for manufacturing a semiconductor device according to ...

CURABLE ACRYLIC COMPOSITION, ACRYLIC TAPE, ACRYLIC RUBBER ROLL AND METHOD FOR PREPARING THE ACRYLIC RUBBER ROLL

Disclosed is a curable acrylic composition, an acrylic tape, an acrylic rubber roll and a method for preparing the acrylic rubber roll. The acrylic composition contains 50-77 wt % 2-ethylhexyl acrylate, 2-10 wt % acrylic acid, 20-40 wt % 2-hydroxyethyl acrylate, 0.1-0.5 wt % curing agent and 0.1-0.2 wt % photoinitiator. The acrylic rubber roll formed by the acrylic composition can recover its viscosity if washed directly with clean water without cleanser, and is characterized by excellent cleaning ability and washability. 1. A curable acrylic composition comprising:50-77 wt % 2-ethylhexyl acrylate;2-10 wt % acrylic acid;20-40 wt % 2-hydroxyethyl acrylate;0.1-0.5 wt % curing agent; and0.1-0.2 wt % photoinitiator.2. The acrylic composition according to claim 1 , wherein the curing agent comprises a bifunctional acrylic ester.3. The acrylic composition according to claim 1 , wherein the photoinitiator comprises 2 claim 1 ,2-dimethoxy-phenyl ketone.4. The acrylic composition according to claim 2 , wherein the bifunctional acrylic ester comprises HDDA or TPGDA.5. The acrylic composition according to claim 1 , wherein the acrylic composition also comprises one or more of: antiseptic claim 1 , antibacterial agent claim 1 , flavoring agent claim 1 , plasticizer and fumed silica.6. An acrylic tape formed by curing the acrylic composition according to .7. The acrylic tape according to claim 6 , wherein curing comprises ultraviolet (UV) light polymerization.8. An acrylic rubber roll comprising a roller and the acrylic tape according to wrapped on the roller.9. A method for preparing an acrylic rubber roll claim 6 , comprising:mixing and stirring 50-77 wt % 2-ethylhexyl acrylate, 2-10 wt % acrylic acid, 20-40 wt % 2-hydroxyethyl acrylate, and 0.1-0.5 wt % curing agent at room temperature to form a mixture;adding 0.1-0.2 wt % photoinitiator into the mixture, and continuing to stir until the photoinitiator is fully dissolved in order to form an acrylic composition;irradiating the ...

ADHESIVE FOR TEMPORARY BONDING, ADHESIVE LAYER, WAFER WORK PIECE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING SAME, REWORK SOLVENT, POLYIMIDE COPOLYMER, POLYIMIDE MIXED RESIN, AND RESIN COMPOSTION

The present invention provides a temporary-bonding adhesive having excellent heat resistance, whereby a semiconductor circuit formation substrate and a support substrate can be bonded by a single type of adhesive layer, the adhesive force thereof does not change over the course of steps for manufacturing a semiconductor device or the like, and the adhesive can subsequently be easily de-bonded at room temperature under mild conditions; and a method for manufacturing a semiconductor device using the temporary-bonding adhesive. The present invention includes a temporary-bonding adhesive wherein a polyimide copolymer having at least an acid dianhydride residue and a diamine residue, the diamine residue including both of (A1) a polysiloxane-based diamine residue represented by a general formula (1) in which n is a natural number from 1 to 15, and (B1) a polysiloxane-based diamine residue represented by a general formula (1) in which n is a natural number from 16 to 100, the polyimide copolymer containing 40-99.99 mol % of the (A1) residue and 0.01-60 mol % of the (B1) residue. 1. (canceled)2. (canceled)4. The temporary-bonding adhesive according to claim 3 , wherein a glass transition temperature of the (a) resin is 100° C. or lower.5. The temporary-bonding adhesive according to claim 3 , wherein a 1% weight Loss temperature of the (a) resin is 300° C. or higher.6. The temporary-bonding adhesive according to claim 3 , wherein the (a) resin is a polyimide resin.7. The temporary-bonding adhesive according to claim 3 , containing the (b-1) siloxane polymer represented by a general formula (2) in an amount of 0.01 to 30 wt % with respect to the (a) resin.8. The temporary-bonding adhesive according to claim 3 , containing the (b-2) compound represented by a general formula (3) in an amount of 0.01 to 30 wt % with respect to the (a) resin.9. The temporary-bonding adhesive according to claim 3 , further comprising (c) a solvent.10. The temporary-bonding adhesive according to ...

THERMOSETTING ADHESIVE FILMS

Flexible films of thermosetting adhesive materials which are non-tacky to the touch are storage stable at room temperature and can be cured at elevated temperature with a short cure time and can be cured to produce a tough flexible adhesive layer including bonding to oily surfaces, the materials are particularly useful in bonding together dissimilar substrates. 1: An article comprising: a curable thermosetting epoxy resin based adhesive film which is flexible prior to cure and storage stable at room temperature , the adhesive film being derived from a mixture of:(a) an elastomer/epoxy resin adduct;(b) a core shell material; and(c) a curing agent.2: The article according to claim 1 , wherein the adhesive film is cured in no more than 45 minutes at a temperature no higher than 190° C.3: The article according to claim 1 , wherein the adhesive film forms an adhesive bond with oily surfaces and a shear strength of the adhesive film when bonded with the oily surfaces is 90% or more of a shear strength of the adhesive film when bonded to a similar surface free of oil.4: The article according to claim 2 , wherein the adhesive film is cured at a temperature in the range of 130° C. to 190° C.5: The article according to claim 1 , wherein the adhesive film is foamable and the adhesive film expands to a size at least 50% greater than a size of the adhesive film in an unfoamed state.6: The article according to claim 1 , wherein the adhesive film has an uncured thickness between 0.2 and 3.0 mm.79-. (canceled)10: The article according to claim 1 , wherein the adhesive film contains 5 to 40 wt % of the elastomer/epoxy resin adduct claim 1 , and 5 to 25 wt % of the core shell material.11: The article according to claim 1 , wherein the article is supported by a carrier.12: The article according to claim 11 , wherein the carrier is a fibrous carrier or fleece selected from: a woven mat claim 11 , a knit mat claim 11 , or a random mat; and wherein the fibrous carrier or fleece is ...

ADHESIVE COMPOSITION, AND COVERLAY FILM, BONDING SHEET, COPPER-CLAD LAMINATE AND ELECTROMAGNETIC SHIELDING MATERIAL, EACH USING SAID ADHESIVE COMPOSITION

The present invention is an adhesive composition that is characterized by containing (A) a modified polyolefin resin and (B) an epoxy compound, and is also characterized in that: the modified polyolefin resin (A) is obtained by graft modifying a polyolefin resin with use of a modifying agent that contains an α,β-unsaturated carboxylic acid or a derivative thereof; the content of the epoxy compound (B) is 1-20 parts by mass relative to 100 parts by mass of the modified polyolefin resin (A); and the epoxy compound is composed of two or more types of epoxy compounds. 1. An adhesive composition , comprising:(A) a modified polyolefin-based resin; and(B) an epoxy resin,wherein the modified polyolefin-based resin (A) is a resin in which a polyolefin resin is graft-modified with a modifier comprising an α, β-unsaturated carboxylic acid or a derivative thereof,a content of the epoxy resin (B) is in a range of from 1 to 20 parts by mass based on 100 parts by mass of the modified polyolefin-based resin (A), andthe epoxy resin (B) comprises two or more types of epoxy resins.2. The adhesive composition of claim 1 , wherein the epoxy resin (B) comprises a novolak type epoxy resin.3. The adhesive composition of claim 2 , wherein the epoxy resin (B) comprises a bisphenol A novolak type epoxy resin.4. The adhesive composition of claim 1 , wherein the epoxy resin (B) comprises an epoxy resin having an alicyclic skeleton.5. The adhesive composition of claim 1 , wherein the modified polyolefin-based resin (A) comprises a modified polypropylene resin.6. The adhesive composition of claim 1 , wherein the derivative of the α claim 1 , β-unsaturated carboxylic acid is at least one compound selected from the group consisting of an itaconic anhydride claim 1 , a maleic anhydride claim 1 , an aconitic anhydride and a citraconic anhydride.7. The adhesive composition of claim 1 , wherein a content proportion of a graft portion derived from the α claim 1 ,β-unsaturated carboxylic acid or the ...

CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE TAPE AND METHOD OF PRODUCING CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE TAPE

Provided is a conductive pressure-sensitive adhesive tape that achieves both strong adhesion to an adherend and a reworking property. A conductive pressure-sensitive adhesive tape () includes a pressure-sensitive adhesive layer () containing a pressure-sensitive adhesive resin containing a pressure-sensitive adhesive polymer and conductive particles () dispersed in the pressure-sensitive adhesive resin, in which: the pressure-sensitive adhesive layer () has a surface layer () that is formed of the pressure-sensitive adhesive resin and that forms a surface of the pressure-sensitive adhesive layer; and a thickness of the surface layer () includes an analysis depth from the surface of the pressure-sensitive adhesive layer when a spectral intensity derived from the conductive particles in glow discharge spectrometry becomes one half of a maximum thereof, and is 0.1 μm or more and 0.9 μm or less. 1. A conductive pressure-sensitive adhesive tape , comprising a pressure-sensitive adhesive layer containing a pressure-sensitive adhesive resin containing a pressure-sensitive adhesive polymer and conductive particles dispersed in the pressure-sensitive adhesive resin , wherein:the pressure-sensitive adhesive layer has a surface layer that is formed of the pressure-sensitive adhesive resin and that forms a surface of the pressure-sensitive adhesive layer; anda thickness of the surface layer, which is defined as an analysis depth from the surface of the pressure-sensitive adhesive layer when a spectral intensity derived from the conductive particles in glow discharge spectrometry becomes one half of a maximum thereof, is 0.1 μm or more and 0.9 μm or less.2. The conductive pressure-sensitive adhesive tape according to claim 1 , wherein the pressure-sensitive adhesive layer has a thickness of 5 μm or more and 250 μm or less.3. The conductive pressure-sensitive adhesive tape according to claim 1 , wherein a volume fraction (vol %) of the conductive particles in the pressure- ...

Filler-containing pressure-sensitive adhesive tape and method of producing filler-containing pressure-sensitive adhesive tape

Provided is a filler-containing pressure-sensitive adhesive tape having an excellent pressure-sensitive adhesive strength while suppressing the occurrence of a volatile component. The filler-containing pressure-sensitive adhesive tape includes a pressure-sensitive adhesive layer containing a pressure-sensitive adhesive resin containing an acrylic polymer and a filler dispersed in the pressure-sensitive adhesive resin, in which the acrylic polymer contains at least a constituent unit derived from a (meth)acrylic acid alkyl ester having a linear or branched alkyl group having 1 to 20 carbon atoms, a constituent unit derived from a nitrogen-containing monomer, and a constituent unit derived from a carboxyl group-containing monomer, and has a ratio (mass ratio) of the constituent unit derived from the carboxyl group-containing monomer to the constituent unit derived from the nitrogen-containing monomer of from 0.01 to 40.

PRESSURE-SENSITIVE ADHESIVE

Provided are a pressure-sensitive adhesive, a polarizing plate, and a liquid crystal display device. The pressure-sensitive adhesive may be used to provide a polarizing plate which has a tensile modulus that varies in a thickness direction, and for example, which has a smaller thickness and a lighter weight, and also satisfies all of the physical properties required for the polarizing plate such as durability, water resistance, workability and light leakage preventability, and a liquid crystal display device including the same. 1. A pressure-sensitive adhesive , which is in the shape of a film having a first surface and a second surface , of which an elastic modulus varies along a thickness direction , of which an average tensile modulus at the room temperature is in the range from 0.01 GPa to 1 GPa , and a peel strength of the second surface with respect to a glass being in the range from 100 to 2 ,500 gf/25 mm at the room temperature.2. The pressure-sensitive adhesive according to claim 1 , wherein a peel strength of the first surface with respect to a glass is different from that of the second surface.3. The pressure-sensitive adhesive according to claim 2 , wherein a difference (P2−P1) between the peel strength (P2) with respect to a glass of the second surface and a peel strength (P1) with respect to a glass of the first surface is 100 gf/25 mm or more.4. The pressure-sensitive adhesive according to claim 2 , wherein a ratio (P2/P1) of the peel strength (P2) with respect to a glass of the second surface and a peel strength (P1) with respect to a glass of the first surface is 5 or more.5. The pressure-sensitive adhesive according to claim 1 , wherein a peel strength (P1) with respect to a glass of the first surface is in the range from 5 to 100 gf/25 mm.6. The pressure-sensitive adhesive according to claim 1 , wherein a value (MP) obtained by multiplying the average tensile modulus (M) at the room temperature and the peel strength with respect to a glass (P) of ...

Multilayer Adhesive Tape

A multilayer adhesive tape exhibiting high step coverage and having both high reworkability and excellent punchability is provided. The multilayer adhesive tape sequentially includes: a first outer adhesive layer; an intermediate adhesive layer; and a second outer adhesive layer, in which a glass transition temperature of the intermediate adhesive layer is −40° C. or more and 0° C. or less, a glass transition temperature of each of the first outer adhesive layer and the second outer adhesive layer is −60° C. or more and −20° C. or less, and a difference in glass transition temperature between each of the first outer adhesive layer and the second outer adhesive layer and the intermediate adhesive layer is 5° C. or more and 25° C. or less.

Screen protector and a method for location protector pasting for mobile phones

This invention provides a screen protector and a method for location protector pasting for mobile phones, which includes a position alignment layer, a protector layer and a release film layer, and through the mark printed on the position alignment layer, which corresponds to that displayed on the mobile phone screen for alignment, download a screen mark diagram in the mobile phone through the WeChat or other ways, to align the mark on the position alignment layer with the mark displayed on the mobile phone screen, so as to achieve an accurate protector pasting. This method is more accurate and more economical comparing with that makes a fixture surrounding the mobile phone to fix the protector; it can achieve the correction protector pasting to all screens including plane or 3D, which is more convenient. It just needs to print any mark pattern on the surface protector to correct the pasting location on the screen, which can provide the probability to achieve different appearance effects for developers. 1. A screen protector comprising a position alignment layer , a protector layer , and a release film layer , wherein the protector layer sis configured to protect a mobile phone screen and is set between the position alignment layer and the release film layer , where the position alignment layer is set in an outer layer.2. The screen protector of claim 1 , wherein the protector layer is coated with a glue layer claim 1 , for pasting with the mobile phone screen claim 1 , and the position alignment layer and the release film layer are set with labels respectively.3. The screen protector of claim 1 , wherein the position alignment layer is printed with a first mark which corresponds to a second mark displayed on the mobile phone screen for alignment claim 1 , and the first mark is printed according to the screen protector for actual type of each mobile phone.4. The screen protector of claim 3 , wherein the first mark is set in the center or four corners of the screen ...

ADHESIVE FILM AND OPTICAL DISPLAY INCLUDING THE SAME

An adhesive film and an optical display including the same. The adhesive film has a tan δ of about 0.12 to about 0.4 upon frequency sweep testing under conditions of a strain of 5%, 30° C. and 1 rad/s, and a tan δ of about 0.2 to about 0.7 upon frequency sweep testing under conditions of a strain of 5%, 30° C. and 100 rad/s. 1. An adhesive film having a tan δ of about 0.12 to about 0.4 upon frequency sweep testing under conditions of a strain of 5% , 30° C. and 1 rad/s and a tan δ of about 0.2 to about 0.7 upon frequency sweep testing under conditions of a strain of 5% , 30° C. and 100 rad/s.2. The adhesive film according to claim 1 , wherein the adhesive film has a storage modulus of about 7×10dyne/cmto about 1×10dyne/cmand a loss modulus of about 1×10dyne/cmto about 8×10dyne/cmupon frequency sweep testing under conditions of a strain of 5% claim 1 , 30° C. and 1 rad/s.3. The adhesive film according to claim 1 , wherein the adhesive film has a storage modulus of about 1×10dyne/cmto about 5×10dyne/cmand a loss modulus of about 1×10dyne/cmto about 3×10dyne/cmupon frequency sweep testing under conditions of a strain of 5% claim 1 , 30° C. and 100 rad/s.4. The adhesive film according to claim 1 , wherein the adhesive film has a storage modulus of about 1×10dyne/cmto about 5×10dyne/cmupon frequency sweep testing under conditions of a strain of 5% claim 1 , 80° C. and 1 rad/s.5. The adhesive film according to claim 1 , wherein the adhesive film has a gel fraction of about 40% to about 90%.7. The adhesive film according to claim 1 , wherein the adhesive film is formed of an adhesive composition comprising a (meth)acrylic copolymer claim 1 , an initiator and a crosslinking agent claim 1 , wherein the (meth)acrylic copolymer being a polymerization reaction product of a mixture of (meth)acrylic monomers.8. The adhesive film according to claim 7 , wherein the adhesive composition comprises: about 100 parts by weight of the (meth)acrylic copolymer;about 0.01 to about 0.15 ...

UPPER BLADE ROLLER, SLITTING DEVICE, SLITTING METHOD, AND LAMINATED TAPE

A laminated film including an adhesive layer peelably laminated on a base film is shear cut using an upper roller including specific upper blades arranged at a pitch of 0.5 mm or less for slitting. The upper blade includes one side surface constituting a blade edge being a flat surface and the other side surface having a first ridge and a second ridge from the blade edge aide. A laminated tape including an adhesive layer peelably laminated on a base film is slit by slitting using this upper blade to a tape width of 0.5 mm or less without the base film and the adhesive layer peeling apart and with suppressed protrusion of the adhesive layer in the slit tape. 1. An upper blade roller comprising a plurality of disk-shaped upper blades arranged at a predetermined pitch , wherein one of side surfaces constituting a blade edge of each of the upper blades is a flat surface , the other side surface has a first ridge and a second ridge in order from the blade edge side , and the pitch of the upper blades is 0.5 mm or less.2. The upper blade roller according to claim 1 , wherein the pitch of the upper blades is 0.1 mm or more and 0.4 mm or less.3. The upper blade roller according to claim 1 , wherein an angle that the upper blade side surface between the first ridge and the blade edge forms with the flat surface is 20° or more and 45° or less claim 1 , and an angle that the upper blade side surface between the first ridge and the second ridge forms with the flat surface is 2° or more and 15° or less.4. The upper blade roller according to claim 1 , wherein a distance between the blade edge and the first ridge in a radial direction of the upper blade is 0.13 mm or more and 0.40 mm or less claim 1 , and a distance between the blade edge and the second ridge in the radial direction of the upper blade is 0.4 mm or more and 7.6 mm or less.5. A slitting device comprising: the upper blade roller according to ; and a lower blade roller including lower blades arranged at the ...

REACTIVE 2-COMPONENT ADHESIVE FILM SYSTEM

Reactive adhesive film, comprising (a) a polymeric film-forming matrix, (b) at least one reactive monomer or reactive resin, and (c) a reagent selected from the group consisting of a radical initiator and an activator, and a reactive 2-component adhesive film system for bonding various materials, such as metal, wood, glass and/or plastic 1. A reactive adhesive film , comprising (a) a polymeric film-forming matrix , (b) at least one reactive monomer or reactive resin and (c) a reagent selected from the group consisting of a radical initiator and an activator.2. The reactive adhesive film as claimed in claim 1 , wherein the polymeric film-forming matrix (a) is a thermoplastic polymer claim 1 , or an elastomer or a thermoplastic elastomer.3. The reactive adhesive film as claimed in claim 1 , wherein the reactive monomer (b) comprises at least one member of the group consisting of acrylic acid claim 1 , acrylic acid ester claim 1 , methacrylic acid claim 1 , methacrylic acid ester and vinyl compounds and/or oligomeric or polymeric compounds having carbon-carbon double bonds.4. The reactive adhesive film as claimed in claim 1 , wherein said reactive adhesive film has pressure sensitive adhesive properties.5. The reactive adhesive film as claimed in claim 1 , wherein the radical initiator is a peroxide.6. The reactive adhesive film as claimed in claim 1 , wherein the activator is an amine claim 1 , a dihydropyridine derivative claim 1 , a transition metal salt or a transition metal complex.7. The reactive adhesive film as claimed in claim 1 , comprising from 20 to 80% by weight polymeric film-forming matrix (a) claim 1 , from 20 to 80% by weight of at least one reactive monomer (b) and from 3 to 30% by weight radical initiator (c).8. The reactive adhesive film as claimed in claim 1 , comprising from 20 to 80% by weight polymeric film-forming matrix (a) claim 1 , from 20 to 80% by weight of at least one reactive monomer (b) and from more than 0 to 40% by weight activator ( ...

ADHESIVE FILM, ADHESIVE COMPOSITION FOR THE SAME, AND DISPLAY MEMBER INCLUDING THE SAME

An adhesive film, an adhesive composition for the same, and a display member including the same are disclosed. The adhesive film includes a cured product of an adhesive composition, which includes a (meth)acrylic copolymer formed from a monomer mixture including (a1) an alkyl (meth)acrylate having a Cto Calkyl group and (a2) an alkyl (meth)acrylate having an alkyl group having 18 or more carbon atoms. The adhesive film has a ratio (B/A) of 90° peel strength (B) after aging the adhesive film at 25° C. for 30 minutes and leaving the adhesive film at 90° C. for 40 seconds to 90° peel strength (A) after aging the adhesive film at 25° C. for 30 minutes of about 0.1 or less. 1. An adhesive film comprising: [{'sub': 1', '17, '(a1) an alkyl (meth)acrylate having a Cto Calkyl group; and'}, '(a2) an alkyl (meth)acrylate having an alkyl group having 18 or more carbon atoms,, 'a (meth)acrylic copolymer formed from a monomer mixture comprising, 'a cured product of an adhesive composition, the adhesive composition comprisingthe adhesive film having a ratio (B/A) of 90° peel strength (B) after aging the adhesive film at 25° C. for 30 minutes and exposing the adhesive film to a temperature of 90° C. for 40 seconds to 90° peel strength (A) after aging the adhesive film at 25° C. for 30 minutes of about 0.09 to about 0.1.2. The adhesive film according to claim 1 , wherein the peel strength (A) is about 1800 g/in to about 3500 g/in claim 1 , and the peel strength (B) is about 50 g/in to about 350 g/in.3. The adhesive film according to claim 1 , wherein the (a2) alkyl (meth)acrylate having an alkyl group having 18 or more carbon atoms comprises a (meth)acrylate having a Cto Calkyl group.4. The adhesive film according to claim 1 , wherein the (a1) alkyl (meth)acrylate having a Cto Calkyl group is ethylhexyl (meth)acrylate claim 1 , and the (a2) alkyl (meth)acrylate having an alkyl group having 18 or more carbon atoms is behenyl (meth)acrylate.5. The adhesive film according to claim 1 , ...

ADHESIVE FILM FOR POLARIZING PLATE, ADHESIVE COMPOSITION FOR THE SAME, POLARIZING PLATE INCLUDING THE SAME, AND OPTICAL DISPLAY DEVICE INCLUDING THE SAME

An adhesive film for polarizing plates includes a (meth)acrylic copolymer obtained by polymerizing about 15 wt % to about 30 wt % of a (meth)acrylic monomer having a hetero-alicyclic ring. The adhesive film has a storage modulus (G′) of about 30 kPa or greater as determined from Frequency sweep testing at 85° C. by oscillation at an angular speed of 10rad/s to 10rad/s. An adhesive composition for the same, a polarizing plate including the same, and an optical display device including the same are also disclosed. 1. An adhesive film for polarizing plates , the adhesive film comprising: a (meth)acrylic copolymer comprising about 15 wt % to about 30 wt % of a polymerized (meth)acrylic monomer having a hetero-alicyclic ring , based on the total weight of the (meth)acrylic copolymer , the adhesive film having a storage modulus (G′) of about 30 kPa or greater as determined from frequency sweep testing at 85° C. using oscillation at an angular speed of 10rad/s to 10rad/s.2. The adhesive film for polarizing plates according to claim 1 , wherein the (meth)acrylic monomer having a hetero-alicyclic ring comprises a morpholine group.3. The adhesive film for polarizing plates according to claim 1 , wherein the (meth)acrylic monomer having a hetero-alicyclic ring comprises a Cto C(meth)acrylic monomer having a hetero-alicyclic ring.4. The adhesive film for polarizing plates according to claim 1 , wherein the (meth)acrylic copolymer comprises a copolymerization product of a monomer mixture comprising about 15 wt % to about 35 wt % of the (meth)acrylic monomer having a hetero-alicyclic ring claim 1 , about 60 wt % to about 84 wt % of a (meth)acrylic monomer having an alkyl group claim 1 , about 0.5 wt % to about 5 wt % of a (meth)acrylic monomer having a hydroxyl group claim 1 , and about 0.1 wt % to about 3 wt % of a (meth)acrylic monomer having a carboxylic acid group.5. The adhesive film for polarizing plates according to claim 1 , wherein the (meth)acrylic copolymer has a ...

ADHESIVE RESIN PELLETS AND METHOD OF MANUFACTURING SAME

A method for manufacturing adhesive resin pellets includes adding an antiblocking agent to water, melting an adhesive resin and extruding the adhesive resin into the water, and cutting the adhesive resin extruded into the water to form adhesive resin pellets. Polyolefin fine particles used for the antiblocking agent have an average particle diameter of 1 μm or more and less than 18 μm, and the adhesive resin has an adhesive force of less than 15.00 N/25 mm. 1. A method for manufacturing adhesive resin pellets , comprising:adding an antiblocking agent to water;melting an adhesive resin and extruding the adhesive resin into the water; andcutting the adhesive resin which have been extruded into the water to form adhesive resin pellets, whereinthe antiblocking agent comprises polyolefin fine particles,the polyolefin fine particles have an average particle diameter of 1 μm or more and less than 18 μm, andthe adhesive resin has an adhesive force of less than 15.00 N/25 mm.2. The method for manufacturing adhesive resin pellets according to claim 1 , wherein the adhesive resin has a holding force of 0.5 mm or less.3. The method for manufacturing adhesive resin pellets according to claim 1 , comprising:dehydrating and drying the adhesive resin pellets after the cutting step; andattaching the antiblocking agent to the dehydrated and dried adhesive resin pellets.4. The method for manufacturing adhesive resin pellets according to claim 1 , wherein the polyolefin fine particles are compatible with the adhesive resin.5. The method for manufacturing adhesive resin pellets according to claim 1 , wherein the dehydrated and dried adhesive resin pellets with the antiblocking agent attached thereto have an average particle diameter of 2 to 10 mm.6. Adhesive resin pellets having fine particles attached to surfaces thereof claim 1 , whereinthe fine particles comprise thermoplastic polyolefin fine particles,the fine particles have an average particle diameter of less than 18 μm,the ...

DISPLAY DEVICE

According to one embodiment, a display device includes a first display panel including a first and second transparent substrate, a first liquid crystal layer, and a first light-emitting element, a second display panel including a third and fourth transparent substrate, a second liquid crystal layer and a second light emitting element, a filling member provided between the first and second display panel and having a refractive index equal to that of the first to fourth transparent substrates, a first light guide bonded to the first and second display panel, and a first adhesive member provided between the first display panel and the first light guide and between the second display panel and the first light guide. 1. A display device comprising:a first display panel comprising a first transparent substrate, a second transparent substrate opposing the first transparent substrate, a first liquid crystal layer located between the first transparent substrate and the second transparent substrate and containing a polymer and a liquid crystal molecule, and a first light-emitting element opposing an end surface of the second transparent substrate;a second display panel comprising a third transparent substrate, a fourth transparent substrate opposing the third transparent substrate, a second liquid crystal layer located between the third transparent substrate and the fourth transparent substrate and containing a polymer and a liquid crystal molecule and a second light emitting element opposing an end surface of the fourth transparent substrate, the second display panel opposing the first display panel on an opposite side to the second light emitting element;a filling member provided between the first display panel and the second display panel and having a refractive index equal to that of the first transparent substrate, the second transparent substrate, the third transparent substrate and the fourth transparent substrate;a first light guide bonded to the first display panel ...

ANISOTROPIC CONDUCTIVE FILM AND PRODUCTION METHOD OF THE SAME

An anisotropic conductive film contains conductive particles and spacers. The spacers are arranged at a central part of the film in a width direction. The central part of the film in the width direction represents 20 to 80% of the overall width of the film. The height of the spacers in the thickness direction of the anisotropic conductive film is larger than 5 μm and less than 75 μm. Such an anisotropic conductive film has a layered structure having a first insulating adhesion layer and a second insulating adhesion layer, wherein the conductive particles are dispersed in the first insulating adhesion layer, and the spacers are regularly arranged on a surface of the first insulating adhesion layer on a side of the second insulating adhesion layer. 1. An anisotropic conductive film containing conductive particles and spacers , wherein the spacers are arranged at a central part of the anisotropic conductive film in a width direction.2. The anisotropic conductive film according to claim 1 , wherein the central part of the film in the width direction has a width being 20% or more and 80% or less of an overall width of the film.3. The anisotropic conductive film according to claim 1 , wherein the spacer has a height in a thickness direction of the anisotropic conductive film being more than 5 μm and less than 75 μm.4. The anisotropic conductive film according to claim 1 , wherein the anisotropic conductive film has a layered structure having a first insulating adhesion layer and a second insulating adhesion layer claim 1 , the conductive particles are dispersed in the first insulating adhesion layer claim 1 , and the spacers are regularly arranged on a surface of the first insulating adhesion layer on a side of the second insulating adhesion layer.5. The anisotropic conductive film according to claim 1 , wherein the anisotropic conductive film has a layered structure having a first insulating adhesion layer and a second insulating adhesion layer claim 1 , the conductive ...

Pressure-sensitive adhesive sheet

This invention provides a PSA sheet comprising a PSA layer. The PSA layer has a storage modulus at 25° C., G′(25° C.), of 0.15 MPa or greater and a storage modulus at 85° C., G′(85° C.), of 0.02 MPa or greater. The PSA sheet satisfies at least one of the following features: having a 180° peel strength of 8 N/20 mm or greater when determined within one minute after press-bonded at 23° C. at a press-bonding load of 0.1 kg or a 180° peel strength of 8 N/20 mm or greater when determined within one minute after press-bonded at 40° C. at 0.05 MPa for 3 seconds.

ADHESIVE FILM FOR POLARIZING PLATE, POLARIZING PLATE INCLUDING THE SAME AND OPTICAL DISPLAY INCLUDING THE SAME

An adhesive film for polarizing plates has a K value of about 0.2 to about 0.5, as calculated by Equation 1. A polarizing plate includes the adhesive film for polarizing plates. An optical display includes the polarizing plate. The adhesive films for polarizing plates according to embodiments of the invention suppress light leakage due to dimensional changes in the polarizing plates at high temperature and/or high humidity. 1. An adhesive film for polarizing plates having a K value of about 0.2 to about 0.5 , as calculated by Equation 1:{'br': None, 'i': 'K=ΔG′×ΔR', 'sub': '0', 'Equation 1'}{'sub': '0', 'claim-text': {'br': None, 'i': G′=G', 'G, 'Δ1−2\u2003\u2003Equation 2'}, 'wherein ΔG′ is defined by Equation 2, and ΔRis defined by Equation 3;'} {'br': None, 'i': R', '=R', '−R, 'sub': 0', '01', '02, 'Δ\u2003\u2003Equation 3'}, 'wherein G1 is a storage modulus in MPa at 23° C. and G2 is a storage modulus MPa at 85° C., as measured from a 500 μm thick stacked adhesive film for polarizing plates by temperature sweep testing under a strain of 5%, a normal force of 100 N and an angular frequency of 1 rad/sec while elevating temperature from 0° C. to 100° C. at a rate of 10° C./min using an advanced rheometry expansion system;'}{'sub': 01', '02, 'wherein Ris retardation in nm at 85° C. at a wavelength of 590 nm, and Ris retardation in nm at 23° C. at a wavelength of 590 nm, as measured from a 1 mm thick adhesive film for polarizing plates upon application of a stress of 125 mN/15 mm while elevating temperature from 0° C. to 100° C. at a rate of 10° C./min.'}2. The adhesive film for polarizing plates according to claim 1 , wherein the G1 of the adhesive film is about 0.45 MPa to about 1 MPa.3. The adhesive film for polarizing plates according to claim 1 , wherein the G2 of the adhesive film is about 0.01 MPa to about 0.3 MPa.4. The adhesive film for polarizing plates according to claim 1 , wherein the adhesive film is formed of an adhesive composition for polarizing ...