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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Поддерживает ввод нескольких поисковых фраз (по одной на строку). При поиске обеспечивает поддержку морфологии русского и английского языка
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Применить Всего найдено 11038. Отображено 100.
22-03-2012 дата публикации

Solder adhesive and a production method for the same, and an electronic device comprising the same

Номер: US20120067629A1
Автор: Seung Jun Jang, Sung Chul Kim, Yong Cheol Chu, Yong Un Jang, Yoon Sang Son
Принадлежит: Duksan Hi Metal Co Ltd

The present invention relates to a solder adhesive and a production method for the same, and to an electronic device comprising the same, and more specifically it relates to a solder adhesive comprising an alloy including tin and having a melting point of from 130 to 300° C., a first binder including a rosin compound, and a second binder having a thermosetting resin, as well as to a production method for the same and an electronic device comprising the same.

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Номер записи: 1
12-04-2012 дата публикации

Electrode connection method, electrode connection structure, conductive adhesive used therefor, and electronic device

Номер: US20120085580A1
Автор: Kyouichirou Nakatsugi, Masamichi Yamamoto, Yasuhiro Okuda
Принадлежит: Sumitomo Electric Industries Ltd

By connecting together connecting electrodes having an organic film serving as an oxidation-preventing film using a conductive adhesive, the manufacturing process can be simplified, and a highly reliable connection structure can be constructed at low cost. An electrode connection method, in which a first connecting electrode 2 and a second connecting electrode 10 are connected together through a conductive adhesive 9 that is interposed between the electrodes, includes an organic film formation step in which an organic film 6 is formed on at least a surface of the first connecting electrode, and an electrode connection step in which the first connecting electrode and the second connecting electrode are connected together through the conductive adhesive. In the electrode connection step, by allowing an organic film decomposing component mixed in the conductive adhesive to act on the organic film, the organic film is decomposed, and thus connection between the connecting electrodes is performed.

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Номер записи: 2
24-05-2012 дата публикации

Connecting and Bonding Adjacent Layers with Nanostructures

Номер: US20120125537A1
Автор: Andrzej Brud, Mohammad Shafiqul Kabir
Принадлежит: Smoltek AB

An apparatus, comprising two conductive surfaces or layers and a nanostructure assembly bonded to the two conductive surfaces or layers to create electrical or thermal connections between the two conductive surfaces or layers, and a method of making same.

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Номер записи: 3
05-07-2012 дата публикации

Polymer dispersed liquid crystal film and method for manufacturing the same

Номер: US20120169987A1
Автор: Chunyan Xie, Gang Wang, Wang Hu, Wenbo Li, Zhuo Zhang
Принадлежит: BOE Technology Group Co Ltd

The disclosed technology involves a polymer dispersed liquid crystal film comprising: a first base substrate, a second base substrate, and a polymer dispersed liquid crystal film between the first base substrate and the second base substrate, wherein a first transparent conductive layer is formed on the first base substrate, the first transparent conductive layer is contacted with the first light permeable pressure-sensitive adhesive layer, and the polymer dispersed liquid crystal is adhered to the first base substrate through the first light permeable pressure-sensitive adhesive layer; and a second transparent conductive layer is formed on the second base substrate, the second transparent conductive layer is contacted with the second light permeable pressure-sensitive adhesive layer, and the polymer dispersed liquid crystal is adhered to the second base substrate through the second light permeable pressure-sensitive adhesive layer.

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Номер записи: 4
05-07-2012 дата публикации

Acrylic Compositions Adhering to Low Surface Energy Substrates

Номер: US20120171915A1
Автор: Brandon S. Miller, Christopher L. Lester, Eric L. Bartholomew, Kyle R. Heimbach, Michael Zajaczkowski, William L. Bottorf
Принадлежит: Avery Dennison Corp

In general, the invention features a pressure sensitive adhesive that comprises the reaction product of: (a) from about 25 to about 95 parts by weight of at least one acrylic acid ester of a monohydric alcohol whose homopolymer has a T g less than 0° C., (b) from 0 to about 75 parts by weight of at least one non-polar ethylenically unsaturated monomer whose homopolymer has a solubility parameter of no greater than 10.50 and a T g greater than 15° C.; and (c) from about 5 to about 35 parts by weight of at least one polar ethylenically unsaturated monomer whose homopolymer has a solubility parameter of greater than 10.50 and a T g greater than 15° C. The pressure sensitive adhesives adhere to substrates having a low surface energy and/or high surface energy.

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Номер записи: 5
13-09-2012 дата публикации

Conductive adhesive, method for manufacturing the same, and electronic device including the same

Номер: US20120228560A1
Автор: Seung Jun Jang, Soon Ho Joeng, Sung Chul Kim, Yong Cheol Chu, Yong Un Jang, Yoon Sang Son
Принадлежит: Duk San Tekopia Co Ltd

The present invention relates to a conductive adhesive, a method for manufacturing the same, and an electronic device including the same. The conductive adhesive includes: a conductive particle; a low-melting alloy powder including an alloy including Sn and at least one material selected from the group consisting of Ag, Cu, Bi, Zn, In, and Pb; a nano powder; a first binder including a thermosetting resin; and a second binder including a rosin compound.

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Номер записи: 6
18-10-2012 дата публикации

Anisotropic conductive film, joined structure, and connecting method

Номер: US20120261171A1
Автор: Koichi Miyauchi, Yasunobu Yamada
Принадлежит: Sony Chemical and Information Device Corp

To provide an anisotropic conductive film, which contains: an electric conductive layer containing Ni particles, metal-coated resin particles, a binder, a polymerizable monomer, and a curing agent; and an insulating layer containing a binder, a monofunctional polymerizable monomer, and a curing agent, wherein the metal-coated resin particles are resin particles each containing a resin core coated at least with Ni.

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Номер записи: 7
22-11-2012 дата публикации

Conductive nonwoven pressure sensitive adhesive tapes and articles therefrom

Номер: US20120295052A1
Автор: Jeong-Wan Choi, Jin-Bae Kim
Принадлежит: 3M Innovative Properties Co

A conductive single-sided tape includes a conductive, nonwoven adhesive layer and a metal layer positioned adjacent the conductive, nonwoven adhesive layer. The conductive, nonwoven adhesive layer includes a conductive nonwoven substrate having a plurality of passageways, an adhesive material positioned within at least a portion of the passageways and a plurality of metal particles dispersed within the adhesive material.

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Номер записи: 8
28-03-2013 дата публикации

ADHESIVE COMPOSITION, USE THEREOF, CONNECTION STRUCTURE FOR CIRCUIT MEMBERS, AND METHOD FOR PRODUCING SAME

Номер: US20130075142A1
Автор: Izawa Hiroyuki, Katogi Shigeki
Принадлежит: HITACHI CHEMICAL CO., LTD.

An adhesive composition for connection between a first circuit member having a first connecting terminal on the main surface and a second circuit member having a second connecting terminal on the main surface, wherein the first circuit member and/or second circuit member are made of a base material containing a thermoplastic resin with a glass transition temperature of no higher than 200° C., the first connecting terminal and/or second connecting terminal are made of ITO and/or IZO, and the adhesive composition includes a phosphate group-containing compound, the free phosphate concentration of the cured adhesive composition being no greater than 100 ppm by mass. 1. An adhesive composition for connection between a first circuit member having a first connecting terminal on the main surface and a second circuit member having a second connecting terminal on the main surface , wherein:the first circuit member and/or second circuit member are made of a base material containing a thermoplastic resin with a glass transition temperature of no higher than 200° C.,the first connecting terminal and/or second connecting terminal are made of ITO and/or IZO, andthe adhesive composition includes a phosphate group-containing compound,the free phosphate concentration of the cured adhesive composition being no greater than 100 ppm by mass.2. The adhesive composition according to claim 1 , which contains (a) a thermoplastic resin claim 1 , (b) a radical polymerizing compound and (c) a radical polymerization initiator claim 1 , and the (b) radical polymerizing compound includes the phosphate group-containing compound.3. The adhesive composition according to claim 2 , wherein the (b) radical polymerizing compound contains one or more of both a vinyl compound with a phosphate group claim 2 , as the phosphate group-containing compound claim 2 , and a radical polymerizing compound other than the vinyl compound with a phosphate group.4. The adhesive composition according to claim 1 , which ...

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Номер записи: 9
28-03-2013 дата публикации

ADHESIVE WITH ANISOTROPIC ELECTRICAL CONDUCTIVITY AND METHODS OF PRODUCING AND USING SAME

Номер: US20130076371A1
Автор: Buschhorn Samuel
Принадлежит: TuTech Innoovation GmbH

The invention relates to an electrically conductive adhesive, comprising an adhesively acting, curable and electrically non-conductive matrix material and a phase of electrically conductive carbon nanotubes distributed in the matrix material. According to the invention, the carbon nanotubes are present in a plurality of individual macrostructures, and each macrostructure consists of a plurality of agglomerated carbon nanotubes forming and electrical contact among each other. Another aspect of the invention concerns a method of producing such an electrically conductive adhesive, and a method for electrically conductive bonding of two components and for checking the quality of an adhesive bond formed in such a manner. 1. An electrically conductive adhesive , comprising{'b': 6', '41, 'an adhesively acting and electrically non-conductive or weakly conductive matrix material (; ), preferably of a polymer material or a polymerisable material, and'}{'b': '1', 'a phase of electrically conductive carbon nanotubes () distributed in the matrix material,'}{'b': 40', '140', '5, 'i': a', 'c', 'a', 'c, 'characterised in that the carbon nanotubes are present in a plurality of individual macrostructures (-; -; ), that each macrostructure consists of a plurality of agglomerated carbon nanotubes forming electrical contact among each other, and that the macrostructures are present in the matrix material in a concentration that is lower than the percolation threshold of the macrostructures within the matrix material.'}2. The adhesive according to claim 1 ,characterised in that the macrostructures are present with a substantially spherical geometry and that the values for the height, width and length of any macrostructure does not deviate in any of the values by more than 50% from any one of the other values.3. The adhesive according to claim 1 ,characterised in that the macrostructures are present in a form that is achieved by shearing a fluid comprising carbon nanotubes distributed ...

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Номер записи: 10
11-04-2013 дата публикации

ANISOTROPIC CONDUCTIVE ADHESIVE, METHOD OF PRODUCING THE SAME, CONNECTION STRUCTURE AND PRODUCING METHOD THEREOF

Номер: US20130087373A1
Автор: Konishi Misao, SAKAMOTO Jun
Принадлежит: DEXERIALS CORPORATION

In an anisotropic conductive adhesive including a magnetic powder such as nickel-coated resin particles used as conductive particles, the conductive particles are present in an insulating adhesive composition without being aggregated. The magnetic powder used as the conductive particles is at least partially composed of a magnetic material. In this case, demagnetization has been performed on the conductive particles in a powder form that have not been dispersed in the insulating adhesive composition, the conductive particles in a paste obtained by dispersing the conductive particles in the insulating adhesive composition, or the conductive particles in a film formed from the paste, before establishment of an anisotropic conductive connection using the anisotropic conductive adhesive. 1. An anisotropic conductive adhesive comprising: an insulating adhesive composition; and magnetic conductive particles dispersed therein , wherein the magnetic conductive particles have been subjected to demagnetization before establishment of an anisotropic conductive connection using the anisotropic conductive adhesive.2. The anisotropic conductive adhesive according to claim 1 , wherein the demagnetization has been performed on the magnetic conductive particles in a powder form that have not been dispersed in the insulating adhesive composition claim 1 , the magnetic conductive particles in a paste obtained by dispersing the magnetic conductive particles in the insulating adhesive composition claim 1 , or the magnetic conductive particles in a film formed using the paste.3. The anisotropic conductive adhesive according to claim 1 , wherein the conductive particles are nickel-coated resin particles or nickel metal particles.4. The anisotropic conductive adhesive according to claim 1 , wherein nickel in the nickel-coated resin particles contains elemental phosphorus.5. The anisotropic conductive adhesive according to claim 4 , wherein the nickel in the nickel-coated resin particles ...

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Номер записи: 11
16-05-2013 дата публикации

Z-axis conductive article and method of making the same

Номер: US20130118773A1
Автор: Ali Berker, Badri Veeraraghavan, Cecil V. Francis, Garry W. Lachmansingh, Junkang J. Liu, Rachel M. Lucking, Stephen H. Larsen
Принадлежит: 3M Innovative Properties Co

A Z-axis conductive article includes an adhesive layer having a first major surface and a second major surface opposite the first major surface. The adhesive layer includes a dielectric pressure-sensitive adhesive and conductive magnetic particles aligned in mutually isolated conductive pathways extending from the first major surface to the second major surface of the adhesive layer. A method of making the same is also disclosed.

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Номер записи: 12
16-05-2013 дата публикации

Hydractive Recipe

Номер: US20130122249A1
Автор: Lykke Mads
Принадлежит: COLOPLAST A/S

A method for assembling an adhesive device comprising a first matrix-forming material with holes and a second material, including the following steps: (a) compose the first matrix-forming material with holes; (b) compose the second material with a Tm lower than the Tm of the first material, while enabling increase in the Tm of the second material; (c) assemble the adhesive device by filling the holes of the first matrix-forming material of step (a) with the deformable second material of step (b) at a temperature where the second material is deformable and the first material is non-deformable; (d) increase the Tm of the second material. 114.-. (canceled)15. An adhesive device wherein the adhesive device or part of the adhesive device is prepared by a method comprising:(a) providing a first matrix-forming material with holes;(b) providing a second material with a Tm lower than the Tm of the first matrix-forming material, while enabling increase in the Tm of the second material;(c) assembling the adhesive device by filling the holes of the first matrix-forming material of step (a) with the deformable second material of step (b) at a temperature where the second material is deformable and the first material is non-deformable; and(d) increasing the Tm of the second material.16. The adhesive device according to claim 15 , wherein the increase in the Tm of the second material is obtained by adding a melting point lowering substance to the second material.17. The adhesive device according to claim 16 , wherein the melting point lowering substance is a solvent.18. The adhesive device according to claim 16 , wherein the increase in Tm of the second material is obtained by evaporation of the melting point lowering substance.19. The adhesive device according to claim 16 , wherein the melting point lowering substance is a plasticiser.20. The adhesive device according to claim 16 , wherein the increase in Tm of the second material is obtained through migration of the melting ...

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Номер записи: 13
06-06-2013 дата публикации

CONDUCTIVE ADHESIVE SHEET, METHOD FOR PRODUCING THE SAME, COLLECTOR ELECTRODE, AND SOLAR CELL MODULE

Номер: US20130139874A1
Автор: Kameyama Kojiro, MATSUMURA Takeshi, Toyoda Eiji, YAMAZAKI Hiroshi
Принадлежит: NITTO DENKO CORPORATION

A conductive adhesive sheet includes a conductor layer including a projecting region that projects curvedly toward at least one side in the thickness direction; a low-melting-point metal layer that is formed on at least one surface in the thickness direction of the projecting region; and an adhesive layer formed on at least one surface in the thickness direction of the low-melting-point metal layer. 1. A conductive adhesive sheet comprising:a conductor layer including a projecting region that projects curvedly toward at least one side in the thickness direction;a low-melting-point metal layer that is formed on at least one surface in the thickness direction of the projecting region; andan adhesive layer formed on at least one surface in the thickness direction of the low-melting-point metal layer.2. The conductive adhesive sheet according to claim 1 , wherein the low-melting-point metal layer comprises tin and/or a tin-bismuth alloy.3. The conductive adhesive sheet according to claim 1 , wherein the conductor layer comprises copper.4. The conductive adhesive sheet according to claim 1 , wherein the projecting region comprises a plurality of projecting regions disposed in a direction perpendicular to the thickness direction in spaced-apart relation to each other.5. A collector electrode for collecting carriers generated in a solar cell claim 1 ,the collector electrode comprising a conductive adhesive sheet, and a conductor layer including a projecting region that projects curvedly toward at least one side in the thickness direction;', 'a low-melting-point metal layer that is formed on at least one surface in the thickness direction of the projecting region; and', 'an adhesive layer formed on at least one surface in the thickness direction of the low-melting-point metal layer., 'the conductive adhesive sheet comprising6. A solar cell module comprising a solar cell and a collector electrode claim 1 ,the collector electrode comprising a conductive adhesive sheet, ...

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Номер записи: 14
20-06-2013 дата публикации

Anisotropic conductive film composition, anisotropic conductive film, and semiconductor device bonded by the same

Номер: US20130154093A1
Автор: Arum Yu, Dong Seon Uh, Hyun Min Choi, Joon Mo Seo, Kyoung Soo Park, Kyung Il SUL, Nam Ju Kim, Young Woo Park
Принадлежит: Individual

An anisotropic conductive film composition for bonding an electronic device may include a hydrogenated bisphenol A epoxy monomer represented by Formula 1 or a hydrogenated bisphenol A epoxy oligomer represented by Formula 2: where n may be an integer from 1 to about 50.

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Номер записи: 15
27-06-2013 дата публикации

SEMICONDUCTOR DEVICE USING COMPOSITION FOR ANISOTROPIC CONDUCTIVE ADHESIVE FILM OR ANISOTROPIC CONDUCTIVE ADHESIVE FILM

Номер: US20130161566A1
Автор: HAN Jae Sun, JUNG Kwang Jin, Kim Hyun Wook, NAMKUNG Hyun Hee, SEO Jin Young, SUL Kyung Il, UH Dong Seon
Принадлежит:

An electronic device includes an anisotropic conductive adhesive film as a connection material, wherein the anisotropic conductive adhesive film has a flowability of 50% or more after preliminary pressing at 80° C. and 1 MPa for 1 second and final pressing at 180° C. and 3 MPa for 5 seconds, and a connection resistance increment greater than 0% but not greater than 25%, as calculated by Expression 1: 2. The electronic device as claimed in claim 1 , wherein the anisotropic conductive adhesive film is formed from a composition that includes:an ethylene-vinyl acetate copolymer,at least one resin selected from the group of an acrylate modified urethane resin and an ester type urethane resin,an isocyanurate acrylate, anda dicyclopentadiene (meth)acrylate.3. The electronic device as claimed in claim 2 , wherein a solid weight ratio of the ethylene-vinyl acetate copolymer to a total amount of the at least one resin selected from the group of the acrylate modified urethane resin and the ester type urethane resin is from about 1:3 to about 3:1.4. The electronic device as claimed in claim 2 , wherein:the isocyanurate acrylate includes an isocyanuric acid ethylene oxide-modified triacrylate, andthe dicyclopentadiene (meth)acrylate includes a tricyclodecanedimethanol diacrylate.5. An electronic device claim 2 , comprising: an ethylene-vinyl acetate copolymer,', 'at least one resin selected from the group of an acrylate modified urethane resin and an ester type urethane resin,', 'an isocyanurate acrylate, and', 'a dicyclopentadiene (meth)acrylate., 'an anisotropic conductive adhesive film as a connection material, wherein the anisotropic conductive adhesive film is formed from a composition that includes6. The electronic device as claimed in claim 5 , wherein the composition further includes a film-forming resin.7. The electronic device as claimed in claim 6 , wherein the anisotropic conductive adhesive composition includes:about 10 to about 40% by weight of the ethylene-vinyl ...

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Номер записи: 16
04-07-2013 дата публикации

Dielectric adhesive film for electronic paper display device

Номер: US20130171399A1
Автор: Chang Ik Hwang, Dong Han Kho, Sang Hoon Lee, Yeon Soo Kim
Принадлежит: Toray Advanced Materials Korea Inc

A dielectric adhesive film for an electronic paper display device. A lower electrode to which voltage is applied and an image upper electrode coated with charged particles whose colors are changed depending on the applied voltage are attached to the adhesive film. Thickness of the adhesive film is controlled to be uniform and constant, and a resistance value in the thickness direction of the adhesive film, i.e., a resistance value in the direction where an electric field is formed, is controlled without changing adhesive properties and reliability as the thickness of the adhesive film is controlled. Since loss of the applied voltage is minimized and the charged particles are freely driven, driving performance of the display device is excellent although a high voltage is not applied in driving a flexible display device, such as a flexible LED, an organic electro luminescence (EL) element including an electronic paper, and the like.

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Номер записи: 17
25-07-2013 дата публикации

Sinterable silver flake adhesive for use in electronics

Номер: US20130187102A1
Автор: Harry Richard Kuder, Juliet Grace SANCHEZ, Matthias Großmann, Xinpei Cao
Принадлежит: Henkel AG and Co KGaA, Henkel Corp

A conductive composition comprises (i) micro- or submicro-sized silver flake having a tap density of 4.6 g/cc or higher and (ii) a solvent that dissolves any fatty acid lubricant or surfactant present on the surface of the silver. In one embodiment, (iii) a small amount of peroxide is present. No organic resin is present in the composition.

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Номер записи: 18
01-08-2013 дата публикации

CONDUCTIVE ADHESIVE

Номер: US20130193383A1
Автор: McGrath Paul
Принадлежит:

A conductive adhesive is provided useful for providing electrically conductive joints in joins between panels, particularly conductive carbon composite panels in a WESP, is prepared from a corrosion resistant resin and particulate carbon black which is uniformly dispersed in the resin. 1. An electrically-conductive adhesive composition comprising:a polyunsaturated resin which, following polymerization, exhibits resistance to corrosion and heat distortion, anda carbon black filler uniformly dispersed in the resin.2. The composition of wherein the polyunsaturated resin is a polyunsaturated vinyl ester resin.3. The composition of wherein said polyunsaturated vinyl ester resin is an epoxy novolac vinyl ester resin.4. The composition of wherein said carbon black filler is present in an amount of about 10 to about 30 wt %.5. The composition of further comprising at least one cross-linking agent for said polyunsaturated resin.6. The composition of wherein the cross-linking agent is cumyl hydroperoxide.7. The composition of further comprising at least one curing accelerator.8. The composition of wherein said curing accelerator is cobalt naphthalate.9. The composition of further comprising a solution of paraffin wax and styrene.10. A method of forming an electrically conductive adhesive composition claim 1 , comprising:mixing a paste of finely divided carbon black filler with a polyunsaturated resin which, following polymerization, exhibits resistance to corrosion and heat distortion, along with other optional additives other than a cross-linking agent for said resin under high shear to fully disperse the carbon black filler and optional additives in the resin to form a homogenous mixture.11. The use of the composition of for the assembly of conductive carbon composite panels in a WESP. In copending PCT Patent Application No. PCT/CA2010/001404 filed Sep. 9, 2010 (WO 2011/029186), assigned to the assignee hereof and the disclosure of which is incorporated herein by reference, ...

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Номер записи: 19
08-08-2013 дата публикации

Conductive Adhesive For A Floorcovering

Номер: US20130199699A1
Автор: Alfred Huf, Gunnar Ernst
Принадлежит: CONSTRUCTION RESEARCH AND TECHNOLOGY GmbH

The invention relates to an adhesive for a floorcovering, comprising, based on the entire adhesive, from 5 to 30% by weight of at least one component selected from graphite and carbon black and/or from 0.2 to 3% by weight of conductive carbon fibers, from 25 to 50% by weight of a polyurethane dispersion with solids content of from 25 to 65% by weight, where less than 5% by weight of an aqueous dispersion of polyhydroxyether polymer, grafted with at least one acrylic or methacrylic monomer, with solids content of from 25 to 40% by weight, is present.

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Номер записи: 20
15-08-2013 дата публикации

DESIGN CONTROL WATER BASED ADHESIVE

Номер: US20130206630A1
Автор: Burmeister Edward W.
Принадлежит: SteriPax, Inc.

The present invention includes compositions of matter, methods of making and using a sealable container using a design control water based adhesive composition for application using a printing press by providing a substrate comprising a first side and a second side each having a top edge, a bottom edge, a right edge, a left edge and a storage region positioned there between; applying a first composition to the top edge, the bottom edge, the right edge, the left edge; applying at least a second composition to the first composition; and placing a cover on the at least a second composition to be sealed by the second composition and the first composition. 1. A design control water based adhesive composition for application for use with a printing press comprising:a design control water based adhesive composition comprising one or more selected from acrylonitrile butadiene, polyamide, polybutadiene, ethylene vinyl acetate, polypropylene, polybutylene, acrylic, natural rubber, neoprene, polycholoroprene, polyester, polyester emulsion, polyisoprene, polypropylene emulsion, polyurethane, polyvinyl acetate, polyvinyl alcohol, polyvinyl butyral, polyvinyl chloride, polyvinylidene chloride, silicone emulsion, styrene isoprene, styrene acronitrile, styrene acrylic, styrene butadiene, vinyl acetate, vinyl acetate-ethylene, vinyl alcohol, and wax emulsion, wherein the design control water based adhesive composition is adapted for use with a printing press.2. The package of wherein the design control water based adhesive composition comprises about 1 to 99.9% of a polymer or combination of polymers claim 1 , selected from the group consisting of: styrene butadiene rubber (SBR) claim 1 , acrylic polymers and copolymers claim 1 , ethylene vinyl acetate (EVA) claim 1 , ethylene methacrylic (EMA) or acrylic acid (EAA) claim 1 , polyethyleneimine (PEI) claim 1 , polyurethane (PU) claim 1 , silanes and silanated polymers.3. The design control water based adhesive composition of further ...

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Номер записи: 21
29-08-2013 дата публикации

Method for connecting conductor, member for connecting conductor, connecting structure and solar cell module

Номер: US20130220540A1
Автор: Isao Tsukagoshi, Naoki Fukushima, Takehiro Shimizu
Принадлежит: Hitachi Chemical Co Ltd

The electric conductor connection method of the invention is a method for electrical connection between a mutually separated first electric conductor and second electric conductor, comprising a step of hot pressing a metal foil, a first adhesive layer formed on one side of the metal foil and a first electric conductor, arranged in that order, to electrically connect and bond the metal foil and first electric conductor, and hot pressing the metal foil, the first adhesive layer or second adhesive layer formed on the other side of the metal foil, and the second electric conductor, arranged in that order, to electrically connect and bond the metal foil and the second electric conductor.

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Номер записи: 22
29-08-2013 дата публикации

ELECTRICALLY CONDUCTIVE ADHESIVES COMPRISING AT LEAST ONE METAL PRECURSOR

Номер: US20130224474A1
Автор: Dreezen Gunther, Theunissen Liesbeth
Принадлежит: Henkel AG & Co. KGaa

The present invention relates to thermally curable adhesives that are suitable for use as electrically conductive materials in the fabrication of electronic devices, integrated circuits, semiconductor devices, passive components, solar cells, solar modules, and/or light emitting diodes. The thermally curable adhesives comprise at least one thermosetting resin, electrically conductive particles having an average particle size of 1 μm to 50 μm, and at least one metal precursor, wherein the metal precursor decomposes substantially to the corresponding metal during the thermal curing of the thermally curable adhesive. 1. A thermally curable adhesive comprising:a) at least one thermosetting resin;b) electrically conductive particles having an average particle size of 1 to 50 μm; andc) at least one metal precursor, wherein the metal precursor decomposes substantially to the corresponding metal during the thermal curing of the thermally curable adhesive.2. The thermally curable adhesive according to claim 1 , wherein the thermosetting resin is selected from epoxy resins claim 1 , benzoxazine resins claim 1 , acrylate resins claim 1 , bismaleimide resins claim 1 , cyanate ester resins claim 1 , polyisobutylene resins and/or combinations thereof.3. The thermally curable adhesive according to claim 1 , wherein the thermosetting resin is selected from epoxy resins.4. The thermally curable adhesive according to claim 1 , wherein the total weight of all thermosetting resins in the thermally curable adhesive is in the range of 3 to 25 wt % claim 1 , preferably in the range of 5 to 18 wt % claim 1 , based on the total amount of the thermally curable adhesive.5. The thermally curable adhesive according to claim 1 , wherein the electrically conductive particles are selected from metal particles claim 1 , metal plated particles or metal alloy particles and/or combinations thereof.6. The thermally curable adhesive according to claim 1 , wherein the electrically conductive particles ...

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Номер записи: 23
12-09-2013 дата публикации

CONDUCTIVE TRANSPARENT ADHESIVE COMPOSITION AND ADHESIVE PREPARED BY USING THE SAME

Номер: US20130234076A1
Автор: Kim Byeong Gwan, Kim Eun Kyoung, KIM Jeong Hun, Kim Young Jung
Принадлежит: INDUSTRY-ACADEMIC COOPERATION FOUNDATION YONSEI UNIVERSITY

An electroconductive transparent adhesive composition containing a transparent adhesive monomer, any one electroconductive mesoporous filler selected from the group consisting of porous carbon, an electroconductive polymer and combinations thereof, and a polymerization initiator, and an electroconductive transparent adhesive produced using the composition are provided. The electroconductive transparent adhesive composition is less expensive and highly economically efficient, and has excellent electrical conductivity and transparency, and has excellent mechanical strength. Thus, the electroconductive transparent adhesive composition can be used in a variety of electrical and electronic applications such as touch screens, displays, and electronic devices. 1. An electroconductive transparent adhesive composition comprising:a transparent adhesive monomer;any one electroconductive mesoporous filler selected from the group consisting of porous carbon, an electroconductive polymer and combinations thereof; anda polymerization initiator.2. The electroconductive transparent adhesive composition according to claim 1 , wherein the porous carbon has an average diameter of pores of 0.5 nm to 1 μm claim 1 , a specific surface area of 0.01 m/g or larger claim 1 , and a specific pore volume of 0.01 cm/g or larger.3. The electroconductive transparent adhesive composition according to claim 1 , wherein the electroconductive polymer is any one selected from the group consisting of polyacetylene claim 1 , polypyrrole claim 1 , polythiophene claim 1 , poly(3-alkylthiophene) claim 1 , polyphenylene sulfide claim 1 , poly-para-phenylene sulfide claim 1 , polyphenylenevinylene claim 1 , poly-para-phenylenevinylene claim 1 , polythienylenevinylene claim 1 , polyphenylene claim 1 , poly-para-phenylene claim 1 , polyazulene claim 1 , polyfuran claim 1 , polyaniline claim 1 , polyselenophene claim 1 , polytellurophene claim 1 , derivatives thereof claim 1 , and combinations thereof.4. The ...

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Номер записи: 24
03-10-2013 дата публикации

CHARGE COLLECTION TAPE

Номер: US20130260171A1
Автор: HARKINS Brian A.
Принадлежит: ADHESIVES RESEARCH, INC.

A charge collection tape is disclosed that includes a foil substrate and an adhesive layer laminated on the foil substrate. The foil substrate is constructed of an aluminum base foil having a conductive metal coating overlying and in direct contact with a non-oxidized surface of the aluminum base foil. A method of making the charge collection tape is also disclosed. 1. A charge collection tape comprising:a foil substrate; andan adhesive layer laminated on the foil substrate,wherein the foil substrate comprises an aluminum base foil having a conductive metal coating overlying and in direct contact with a non-oxidized surface of the aluminum base foil.2. The charge collection tape of claim 1 , wherein the aluminum base foil is a 1000 or 1100 series aluminum alloy.3. The charge collection tape of claim 1 , wherein the conductive metal coating comprises a metal selected from the group consisting of gold claim 1 , silver claim 1 , tin claim 1 , nickel claim 1 , copper claim 1 , platinum claim 1 , palladium claim 1 , zinc claim 1 , and alloys thereof.4. The charge collection tape of claim 1 , wherein the conductive metal coating comprises a layer of copper overlaid by tin.5. The charge collection tape of claim 1 , wherein the thickness of the foil substrate is in the range of 0.00024 inches to 0.005 inches.6. The charge collection tape of claim 1 , wherein the metal coating has a thickness in the range of 0.1 microns to 10 microns.7. The charge collection tape of claim 1 , wherein the metal coating comprises at least one layer of a conductive metal having a thickness in the range of 0.1 microns to 5 microns.8. The charge collection tape of claim 1 , wherein the adhesive is a conductive acrylic adhesive.9. The charge collection tape of claim 8 , wherein the adhesive contains in the range of 0.1% to 90% by weight of conductive fillers.10. A charge collection tape comprising:a foil substrate having a thickness in the range of about 0.0005 inches to about 0.005 inches ...

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Номер записи: 25
17-10-2013 дата публикации

Methods To Control Electrical Resistivity In Filler-Polymer Compositions And Products Related Thereto

Номер: US20130273468A1
Автор: Agathagelos Kyrlidis, Andriy Korchev, Eugene Step, Jeremy Huffman, Pavel Kossyrev
Принадлежит: Cabot Corp

Methods to control electrical resistivity in filler-polymer compositions are described using dual phase fillers. Polymer compositions containing the dual phase fillers are further described.

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Номер записи: 26
24-10-2013 дата публикации

Structure for bonding metal plate and piezoelectric body and bonding method

Номер: US20130276977A1
Автор: Hideo Nakagoshi, Hiroki Kitayama, Kiyoshi Kurihara
Принадлежит: Murata Manufacturing Co Ltd

A bonding structure that provides excellent conductivity and bonding between a piezoelectric body and a metal plate includes a metal plate and an electrode of a piezoelectric body bonded to one another with an electrically conductive adhesive so as to provide electrical conductivity, the electrically conductive adhesive includes carbon black with a nano-level average particle size, and has a paste form included in a solventless or solvent-based resin so that the carbon black forms an aggregate with an average particle size of about 1 μm to about 50 μm. The electrically conductive adhesive is applied between the metal plate and the electrode of the piezoelectric body, and the metal plate and the piezoelectric body are subjected to heating and pressurization so that the carbon black aggregate is deformed, thereby hardening the electrically conductive adhesive.

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Номер записи: 27
24-10-2013 дата публикации

Thermally conductive adhesive

Номер: US20130279118A1
Автор: Taichi Koyama, Takayuki Saito
Принадлежит: Dexerials Corp

A thermally conductive adhesive having: a thermosetting adhesive containing a curable component and a curing agent for the curable component, and a metal filler dispersed in the thermosetting adhesive uses a silver powder and a solder powder as the metal filler. The solder powder to be used has a melting temperature lower than the thermal curing temperature of the thermally conductive adhesive and produces a high-melting-point solder alloy having a melting point higher than the melting temperature of the solder powder when the solder powder is reacted with the silver powder under thermal curing conditions of the thermally conductive adhesive. A curing agent having flux activity to the metal filler is used as the curing agent.

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Номер записи: 28
31-10-2013 дата публикации

Transparent conductive film, electronic device, and method for manufacturing electronic device

Номер: US20130284244A1
Автор: Emi Nakajima, Kazue Uemura, Kunihisa Kato, Tsuyoshi Muto
Принадлежит: Lintec Corp

The present invention provides a transparent conductive film which is low in terms of surface resistivity and high in terms of transparency. The transparent conductive film according to the present invention includes an adhesive conductive layer in openings of a conductive metal mesh layer provided on at least one surface of a transparent base material, wherein the conductive layer is composed of a conductive adhesive composition containing (A) a water-soluble vinyl polymer, (B) an organic additive, and (C) a conductive organic polymer compound, the organic additive (B) is at least one member selected among water-soluble polyhydric alcohols, water-soluble pyrrolidones, and hydrophilic aprotic solvents, and the conductive organic polymer compound (C) is at least one member selected among polyanilines, polypyrroles, polythiophenes, and derivatives thereof. In addition, the present invention provides an electronic device having the foregoing transparent conductive film and a method for manufacturing an electronic device including forming a photoelectric conversion layer on an anodic layer and sticking the conductive layer of the transparent conductive film and a surface of the photoelectric conversion layer to each other at a temperature at which the foregoing conductive adhesive composition is softened or higher.

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Номер записи: 29
31-10-2013 дата публикации

COMPOSITION FOR ADHESIVE HYDROGEL AND USE THEREOF

Номер: US20130289157A1
Автор: Fujiwara Yasuhiro, HATORI Takaaki, SATO Kaori
Принадлежит: SEKISUI PLASTICS CO., LTD.

A composition for an adhesive hydrogel, comprising at least: a polymeric matrix former; water; and a polyhydric alcohol; the polymeric matrix former comprising at least: (a) (meth)acrylic acid, a (meth)acrylic acid derivative or a vinyl derivative having 2 carboxyl groups and 4 or 5 carbon atoms; (b) (meth)acrylamide or a (meth)acrylamide derivative; (c) N-vinyl-2-caprolactam and/or N-vinyl-2-valerolactam; and (d) a cross-linkable monomer, wherein the content percentage of the (b) in the composition for an adhesive hydrogel is 2 to 20% by weight. 1. A composition for an adhesive hydrogel , comprising at least: apolymeric matrix former; water; and a polyhydric alcohol;the polymeric matrix former comprising at least:(a) (meth)acrylic acid, a (meth)acrylic acid derivative or a vinyl derivative having 2 carboxyl groups and 4 or 5 carbon atoms;(b) (meth)acrylamide or a (meth)acrylamide derivative;(c) N-vinyl-2-caprolactam and/or N-vinyl-2-valerolactam; and(d) a cross-linkable monomer,wherein the content percentage of the (b) in the composition for an adhesive hydrogel is 2 to 20% by weight.2. The composition for an adhesive hydrogel of claim 1 , wherein the content percentage of the (a) is 2 to 20% by weight claim 1 , and the content percentage of the (c) is 0.1 to 25% by weight.3. The composition for an adhesive hydrogel of claim 1 , wherein the polymeric matrix former contains the (e) polyvinylpyrrolidone or a polyvinylpyrrolidone derivative.4. The composition for an adhesive hydrogel of claim 3 , wherein the content percentage of the (e) is 0.1 to 20% by weight.5. The composition for an adhesive hydrogel of claim 1 , wherein the polyhydric alcohol is at least one kind selected from group consisting of ethylene glycol claim 1 , propylene glycol claim 1 , butanediol claim 1 , glycerin claim 1 , pentaerythritol claim 1 , sorbitol claim 1 , polyethylene glycol claim 1 , polypropylene glycol claim 1 , polyglycerol and polyoxyethylene polyglyceryl ether.6. The composition ...

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Номер записи: 30
21-11-2013 дата публикации

Chain Extended Epoxy to Improve Adhesion of Conductive Die Attach Film

Номер: US20130306916A1
Автор: Gao Junbo, Hoang Gina
Принадлежит: Henkel Corporation

A conductive adhesive film is prepared from components comprising a thermosetting resin, a film-forming resin, a conductive filler, and further comprising a chain extended epoxy resin prepared from the reaction of a poly-functional phenol with a combination of a poly-functional aromatic epoxy and a poly-functional aliphatic epoxy (poly-functional includes di-functional). The addition of the chain extended epoxy preserves the adhesiveness of the conductive adhesive film at silver loadings of 80 weight percent or greater. 1. A conductive adhesive composition comprising:(i) a thermosetting resin,(ii) optionally, a film-forming resin,(iii) a conductive filler, and(iv) a chain extended epoxy prepared from the reaction of a poly-functional phenol with a combination of a poly-functional aromatic epoxy and a poly-functional aliphatic epoxy.2. The conductive adhesive composition according to in which the chain extended epoxy is present in the composition an amount of 1-20 wt % of the total composition.6. The conductive adhesive composition according to in which the stoichiometric ratio of the total epoxy functional groups to the phenolic functional groups in the chain extended epoxy ranges from 0.05 to 30.8. The conductive adhesive composition according to in which the thermosetting resin is a bismaleimide selected from the group consisting of 4 claim 1 ,4′-diphenylmethane bismaleimide claim 1 , 4 claim 1 ,4′diiphenylether bismaleimide claim 1 , 4 claim 1 ,4′diiphenylsulfone bismaleimide claim 1 , phenylmethane maleimide claim 1 , m-phenylene bismaleimide claim 1 , 2 claim 1 ,2′-bis[4-(4-maleimidophenoxy)phenyl]propane claim 1 , 3 claim 1 ,3′-dimethyl-5 claim 1 ,5′-diethyl-4 claim 1 ,4′-diphenylmethane bismaleimide claim 1 , 4-methyl-1 claim 1 ,3-phenylene bismaleimide claim 1 , 1 claim 1 ,6′-bismaleimide-(2 claim 1 ,2 claim 1 ,4-trimethyl)hexane claim 1 , 1 claim 1 ,3-bis(3-maleimidophenoxy)benzene claim 1 , and 1 claim 1 ,3-bis(4-maleimidophenoxy)-benzene.10. The ...

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Номер записи: 31
28-11-2013 дата публикации

SOLUBLE METAL SALTS FOR USE AS CONDUCTIVITY PROMOTERS

Номер: US20130313489A1
Автор: Dershem Stephen M.
Принадлежит: DESIGNER MOLECULES, INC.

The present invention provides conductivity promoters, and in particular soluble conductivity promoters that contain a hydrocarbon moiety or a siloxane moiety and a metal. The present invention also provides methods of making soluble conductivity promoters and adhesive compositions containing the conductivity promoters of the invention. 1. A soluble conductivity promoter comprising a metal salt , the soluble conductivity promoter including:a) a siloxane moiety, andb) a metal ion.2. (canceled)3. (canceled)4. (canceled)5. (canceled)6. (canceled)7. (canceled)8. The soluble conductivity promoter of claim 1 , wherein the metal salt is a liquid at room temperature.9. The soluble conductivity promoter of claim 1 , wherein the metal salt decomposes at a temperature less than about 220° C.10. The soluble conductivity promoter of claim 1 , wherein the metal salt decomposes at a temperature less than about 200° C.11. The soluble conductivity promoter of claim 1 , wherein the metal ion is selected from the group consisting of Ag claim 1 , Pd claim 1 , Ni claim 1 , Pt claim 1 , and Au.12. The soluble conductivity promoter of claim 11 , wherein the metal ion is Pd.14. (canceled)15. (canceled)16. A method of increasing the conductivity of a thermoset resin comprising:{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'a) incorporating a soluble conductivity promoter of into the resin; and'}b) heating the resin, wherein the conductivity promoter decomposes to generate at least one free metal.17. The method of claim 16 , wherein nano-disperse metal domains are formed within the thermoset resin during step b.18. An adhesive composition comprising: a silver flake filled adhesive and a conductivity promoter according to claim 1 , wherein the silver flake filled adhesive comprises an organic component and a silver flake component.19. The adhesive composition of claim 18 , wherein the organic component comprises about 15% of the total adhesive composition and the conductivity promoter is ...

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Номер записи: 32
28-11-2013 дата публикации

Process for preparing flowable amorphous poly-alpha olefin adhesive pellets

Номер: US20130317193A1
Автор: Darshak Desai, Ed HANTWERKER, Ken GASPAR, Yuhong Hu
Принадлежит: Henkel Corp

The present invention relates to a process for producing free-flowing, agglomeration resistant amorphous poly-alpha-olefin based adhesive pellets. The process includes (a) extruding the adhesive through an orifice of a die plate immersed in a cooling fluid; (b) cutting the adhesive into a plurality of pellets in the cooling fluid; (c) solidifying the pellets at a temperature range of about 25° C. to about 40° C. for at least 30 minutes; and (d) separating the pellets from the recrystallization fluid and drying the pellets. The pellets harden at least three folds faster than conventionally formed pellets.

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Номер записи: 33
05-12-2013 дата публикации

ISOTROPIC CONDUCTIVE ADHESIVE

Номер: US20130323501A1
Автор: Helland Tore, Kristiansen Helge, Redford Keith
Принадлежит: CONPART AS

An isotropic conductive adhesive having silver coated polymer beads within an adhesive matrix and a method of forming an isotropic conductive adhesive are disclosed. The mean average diameter of the polymer cores of the beads is less than 30 μm, and the silver coating comprises interlinked silver deposits grown from dispersed nucleation sites scattered across the surface of the beads. 1. An isotropic conductive adhesive comprising silver coated polymer beads within an adhesive matrix , wherein the mean average diameter of the polymer cores of the beads is less than 30 μm and wherein the silver coating comprises interlinked silver deposits grown from dispersed nucleation sites scattered across the surface of the beads.2. The isotropic conductive adhesive of claim 1 , wherein the mean average diameter of the polymer cores of the beads is 25 μm or lower.3. The isotropic conductive adhesive of claim 1 , wherein the mean average diameter of the polymer cores of the beads is 20 μm or lower.4. The isotropic conductive adhesive of claim 1 , wherein the polymer cores of the beads have a coefficient of variation (CV) in diameter of less than 5% claim 1 ,5. The isotropic conductive adhesive of claim 1 , wherein the polymer cores of the beads have a coefficient of variation (CV) in diameter of less than 3%.6. The isotropic conductive adhesive of claim 1 , wherein the incidence of polymer cores of the beads with a diameter less than two thirds of the mean diameter or with a diameter greater than 1.5 times the mean diameter is less than 1 in 1000.7. The isotropic conductive adhesive of claim 1 , wherein the average thickness of the silver is 350 nm or less8. The isotropic conductive adhesive of claim 7 , wherein the average thickness of the silver is less than 3% of the diameter of the polymer core of the bead.9. The isotropic conductive adhesive of claim 1 , wherein the average thickness of the silver is less than 5% of the diameter of the polymer core of the bead.10. The ...

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Номер записи: 34
02-01-2014 дата публикации

Hot-melt adhesion composition, hot-melt adhesive sheet and adhesion method

Номер: US20140000787A1
Автор: Yoshitomo Ono, Yumiko Amino
Принадлежит: Lintec Corp

The hot-melt adhesive composition contains a hot-melt adhesive, a ferromagnetic substance, and a foaming agent that foams when heated, and the hot-melt adhesive composition has: a surface magnetic force of 20 mT or more; a surface magnetic force after heating for adhesion of 5 mT or less; and a volume change ratio due to heating for adhesion of 110% to 400%. The hot-melt adhesive composition may be formed into a sheet-like shape to provide a hot-melt adhesive sheet, which exhibits an excellent adhesive force by heating and which also exhibits a sufficient temporarily fixing force due to magnetic force at the initial stage, but the magnetic force is sufficiently reduced after heating, so that the occurrence of irregularity on the surface due to magnetic force lines after heating can be suppressed.

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Номер записи: 35
02-01-2014 дата публикации

HIGH PERFORMANCE DIE ATTACH ADHESIVES (DAAs) NANOMATERIALS FOR HIGH BRIGHTNESS LED

Номер: US20140001414A1
Автор: Lang Xianxin, Li Zhiying, Liu Chenmin, Lu Dong, Wang Bo
Принадлежит: NANO AND ADVANCED MATERIALS INSTITUTE LIMITED

The present invention relates to a composition for a one-part die attach adhesives material useful for packaging semi-conductors including HB-LED. The composition of the present invention includes a thermal and electrical conductive filler, a polymer matrix and a solvent which form a material with high thermal conductivity, low curing temperature and high self-life temperature. The present invention also relates to a method of preparing said composition by mixing a size-selected and surface-modified filler formulation, a polymer matrix and a non-reactive organic solvent together followed by curing the mixture at a low temperature. 1. A method of preparing a one-part and heat-curable DAA composition comprising:providing a thermally and electrically conductive filler;providing a polymer matrix;providing a solvent; andmixing the thermally and electrically conductive filler, polymer matrix and a solvent to form the composition,wherein said filler is an inorganic compound with 30-96% by weight of the composition, said inorganic filler being further modified prior to said mixing to form a modified filler formulation, said modified filler formulation comprising microparticles having a diameter of about 13-50 μm in about 20-100% by weight of said inorganic filler, microparticles having a diameter of about 6-12 μm in about 10-100% by weight of said inorganic filler, particles having a diameter of about 5-6 μm in about 10-90% by weight of said inorganic fillers, microparticles having a diameter of 1-5 μm in about 20-100% by weight of said inorganic filler, nanoparticles having a diameter of about 10-200 nm in about 1-10% by weight of said inorganic filler, and/or nanorods having a diameter of about 100 nm-1 μm and a length of about 1-10 μm in 1-10% by weight of said inorganic filler; andwherein said polymer matrix is 2-30% by weight of the composition; said solvent is 2-40% by weight of the composition; andwherein said composition is formed with thermal conductivity of at ...

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Номер записи: 36
09-01-2014 дата публикации

DRY ADHESIVES AND METHODS FOR MAKING DRY ADHESIVES

Номер: US20140010988A1
Автор: KIM Seok, Sitti Metin
Принадлежит:

A dry adhesive and a method of forming a dry adhesive. The method includes forming an opening through an etch layer and to a barrier layer, expanding the opening in the etch layer at the barrier layer, filling the opening with a material, removing the barrier layer from the material in the opening, and removing the etch layer from the material in the opening. 1. An adhesive fiber array , comprising: a tip having with a cross-sectional area;', 'a stem having a cross-sectional area smaller than the tip cross-sectional area; and', 'wherein the stem is connected to the tip, and, 'a plurality of fibers, wherein each fiber of the plurality of fibers includesa backing layer, wherein the plurality of fibers are connected to the backing layer.2. The adhesive fiber array according to claim 1 , wherein the tip further comprises a flat surface.3. The adhesive fiber array according to claim 1 , wherein the stem further comprises a base at a proximal end of the stem claim 1 , and wherein the backing layer is connected to the base of the stem.4. The adhesive fiber array according to claim 1 , wherein the stem further comprises a distal end and a proximal end claim 1 , and wherein the backing layer is connected to the proximal end of the stem and the tip is connected to the distal end of the stem.5. The adhesive fiber array according to claim 1 , further comprising: a tip having a cross-sectional area;', 'a stem having a cross-sectional area smaller than the tip cross-sectional area; and', 'wherein the second plurality of fibers is connected to the tip of the plurality of fibers., 'a second plurality of fibers, wherein each fiber of the second plurality of fibers includes6. The adhesive fiber array according to claim 5 , wherein the tip of the each fiber of the second plurality of fibers further comprises a flat surface.7. The adhesive fiber array according to claim 5 , wherein the each fiber of the second plurality of fibers further comprises a base claim 5 , and wherein the tip ...

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Номер записи: 37
30-01-2014 дата публикации

Perfluoroether sealant compositions

Номер: US20140027057A1
Автор: Chandra Rao, Juexiao Cai, Renhe Lin
Принадлежит: PRC Desoto International Inc

Disclosed are perfluoroethers and perfluoroether compositions useful in high temperature aerospace applications. The perfluoroethers can be adapted for use with various curing chemistries.

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Номер записи: 38
30-01-2014 дата публикации

SILVER SINTERING COMPOSITIONS WITH FLUXING OR REDUCING AGENTS FOR METAL ADHESION

Номер: US20140030509A1
Автор: Kuder Harry Richard, Sanchez Juliet Grace
Принадлежит: Henkel Corporation

A conductive composition that is sinterable comprises (i) micron- or submicron-sized silver flakes or powders and (ii) a fluxing agent, or an oxygenated solvent, or a peroxide. The composition can be used to adhere semiconductor dies with silver backing to copper-, silver-, or gold lead-frames at sintering temperatures of ≦250° C. without the application of pressure. 1. A conductive composition comprising (i) micron- or submicron-sized silver flakes and (ii) a fluxing agent , or an oxygenated solvent , or a peroxide , in the absence of an organic resin.2. The conductive composition according to in which the fluxing agent is present and is selected from the group consisting of 2 claim 1 ,2 claim 1 ,6 claim 1 ,6-tetramethylpiperidinoxy claim 1 , 4 claim 1 ,4′-dithiodibutyric acid claim 1 , succinic acid claim 1 , 8-hydroxyquinoline claim 1 , nitrolotrimethylphosphonic acid claim 1 , triethanolamine claim 1 , glutaric acid claim 1 , malic acid claim 1 , tartaric acid claim 1 , acetylacetone claim 1 , glycerin claim 1 , dithiothreitol claim 1 , 1 claim 1 ,2 claim 1 ,3-trihydroxy-benzene.3. The conductive composition according to in which the fluxing agent is present in the composition in an amount of 0.1 to 10.0% by weight of the total composition.4. The conductive composition according to in which the oxygenated solvent is present and is selected from the group consisting of 2-(2-ethoxy-ethoxy)-ethyl acetate claim 1 , propylene glycol monoethyl ether claim 1 , diethylene glycol monobutyl ether acetate claim 1 , diethylene glycol claim 1 , dipropylene glycol claim 1 , monobutyl ether acetate claim 1 , and propylene carbonate.5. The conductive composition according to in which the oxygenated solvent is present in an amount of 0.1 to 15.0% by weight of the total composition.6. The conductive composition according to in which peroxide is present and is selected from the group consisting of tertiary-butyl peroxy-2-ethylhexanoate claim 1 , tertiary-butyl peroxyneo-decanoate ...

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Номер записи: 39
13-02-2014 дата публикации

ADHESIVE LAYER FOR OPTICAL FILM AND METHOD FOR PRODUCING SAME, ADHESIVE OPTICAL FILM AND METHOD FOR PRODUCING SAME, IMAGE DISPLAY DEVICE, AND COATING LIQUID SUPPLY DEVICE

Номер: US20140044953A1
Автор: Ishii Takaaki, Makihata Yousuke, Masuda Tomoaki, Morohoshi Tsutomu, Ryu Sonjin, Tomoguchi Naoki
Принадлежит: NITTO DENKO CORPORATION

A method for manufacturing a pressure-sensitive adhesive layer for use on an optical film, the method includes a filtration step including filtering a pressure-sensitive adhesive coating liquid under a differential pressure of more than 0 kPa and not more than 150 kPa using a depth type filter having a filtration accuracy of 1 to 20 μm. The pressure-sensitive adhesive coating liquid contains an aqueous dispersion-type pressure-sensitive adhesive; and an application and drying step including applying the filtered pressure-sensitive adhesive coating liquid and then drying the coating liquid. 1. A method for manufacturing a pressure-sensitive adhesive layer for use on an optical film , the method comprising: a filtration step comprising filtering a pressure-sensitive adhesive coating liquid under a differential pressure of more than 0 kPa and not more than 150 kPa using a depth type filter having a filtration accuracy of 1 to 20 μm , wherein the pressure-sensitive adhesive coating liquid contains an aqueous dispersion-type pressure-sensitive adhesive; and an application and drying step comprising applying the filtered pressure-sensitive adhesive coating liquid and then drying the coating liquid.2. The method according to claim 1 , wherein the depth type filter has a filtration accuracy gradient.3. A pressure-sensitive adhesive layer for use on an optical film claim 1 , comprising a product manufactured by the method according to .4. The pressure-sensitive adhesive layer according to claim 3 , which contains no air bubble and/or contaminant with a maximum length of more than 100 μm and has a surface in which the number of air bubbles and/or contaminants with a maximum length of 20 μm or more is 10 per mor less.5. A method for manufacturing a pressure-sensitive adhesive-type optical film comprising an optical film and a pressure-sensitive adhesive layer placed on at least one side of the optical film claim 3 ,the method comprising the step of forming the pressure- ...

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Номер записи: 40
13-02-2014 дата публикации

Adhesive composition, film adhesive, and bonding method

Номер: US20140044962A1
Автор: Atsushi Kubo, Hirofumi Imai, Takahiro Yoshioka, Takuya Noguchi, Toshiyuki Ogata
Принадлежит: Tokyo Ohka Kogyo Co Ltd

An adhesive composition including an elastomer as a main component, an adhesive layer prepared from the adhesive composition having (i) a storage modulus (G′) of not less than 20,000 Pa at 220° C. and/or (ii) a loss modulus (G″) of not less than 20,000 Pa at 220° C.

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Номер записи: 41
20-02-2014 дата публикации

GRAPHENE NANORIBBON COMPOSITES AND METHODS OF MAKING THE SAME

Номер: US20140048748A1
Автор: Raji Abdul-Rahman O., Tour James M., Zhu Yu
Принадлежит: William Marsh Rice University

In some embodiments, the present invention provides graphene nanoribbon composites that include a polymer matrix and graphene nanoribbons that are dispersed in the polymer matrix. In more specific embodiments, the polymer matrix of the composite is an epoxy matrix, and the graphene nanoribbons of the composite include functionalized graphene nanoribbons. In further embodiments, the composites of the present invention further comprise metals, such as tin, copper, gold, silver, aluminum and combinations thereof. Additional embodiments of the present invention pertain to methods of making the graphene nanoribbon composites of the present invention. In some embodiments, such methods include mixing graphene nanoribbons with polymer precursors to form a mixture, and then curing the mixture to form the composite. 1. A composite , comprising:a polymer matrix; andgraphene nanoribbons dispersed in the polymer matrix.2. The composite of claim 1 , wherein the graphene nanoribbons are selected from the group consisting of functionalized graphene nanoribbons claim 1 , pristine graphene nanoribbons claim 1 , doped graphene nanoribbons claim 1 , graphene oxide nanoribbons claim 1 , reduced graphene oxide nanoribbons claim 1 , and combinations thereof.3. The composite of claim 1 , wherein the graphene nanoribbons comprise functionalized graphene nanoribbons.4. The composite of claim 3 , wherein the graphene nanoribbons are functionalized with functional groups selected from the group consisting of polyethylene glycols claim 3 , aryl groups claim 3 , hydroxyl groups claim 3 , carboxyl groups claim 3 , phenol groups claim 3 , phosphonic acids claim 3 , amine groups claim 3 , and combinations thereof.5. The composite of claim 1 , wherein the graphene nanoribbons comprise stacked graphene nanoribbons.6. The composite of claim 1 , wherein the graphene nanoribbons comprise graphene nanoribbons derived from split multi-walled carbon nanotubes.7. The composite of claim 1 , wherein the ...

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Номер записи: 42
20-03-2014 дата публикации

PRESSURE SENSITIVE ADHESIVE COMPOSITION AND PRESSURE SENSITIVE ADHESIVE SHEET

Номер: US20140077139A1
Автор: Amino Yumiko, Ono Yoshitomo, Uemura Kazue
Принадлежит: LINTEC Corporation

A pressure-sensitive adhesive composition containing a pressure-sensitive adhesive that contains from 40 to 95% by mass of a rubber-based resin not containing a styrene-derived constituent unit, and a photochromic dye of a dithienylethene-based compound, wherein the content of the photochromic dye is from 0.40 to 8.00 parts by mass relative to 100 parts by mass of the pressure-sensitive adhesive, and a pressure-sensitive adhesive sheet having a pressure-sensitive adhesive layer formed of the pressure-sensitive adhesive composition have excellent weather resistance that can withstand long-term use, a relatively rapid rate of color change from colored to colorless, and excellent peelability to release sheets. 1. A pressure-sensitive adhesive composition comprising a pressure-sensitive adhesive that comprises:from 40 to 95% by mass of a rubber-based resin not containing comprising a styrene-derived constituent unit; anda photochromic dye of a dithienylethene-based compound,wherein a content of the photochromic dye is from 0.40 to 8.00 parts by mass relative to 100 parts by mass of the pressure-sensitive adhesive.2. The pressure-sensitive adhesive composition according to claim 1 , wherein the dithienylethene-based compound is a compound having two aryl groups claim 1 , a hexafluorocyclopentene group claim 1 , or both claim 1 , in a structure of one molecule.3. The pressure-sensitive adhesive composition according to claim 1 , wherein the rubber-based resin comprises a polyisobutylene-based resin in which a content of the polyisobutylene-based resin is from 60 to 100% by mass in the rubber-based resin.4. The pressure-sensitive adhesive composition according to claim 1 , wherein the pressure-sensitive adhesive further comprises a tackifier and a content of the tackifier is from 5 to 60% by mass in all components of the pressure-sensitive adhesive.5. A pressure-sensitive adhesive sheet having a pressure-sensitive adhesive layer formed of the pressure-sensitive adhesive ...

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Номер записи: 43
10-04-2014 дата публикации

Anisotropic conductive adhesive

Номер: US20140097463A1
Автор: Genki Katayanagi, Hidetsugu Namiki, Shiyuki Kanisawa
Принадлежит: Dexerials Corp

An anisotropic conductive adhesive includes an epoxy adhesive containing an epoxy compound and a curing agent and conducive particles dispersed in the epoxy adhesive. When elastic moduluses at 35° C., 55° C., 95° C., and 150° C. of a cured product of the anisotropic conductive adhesive are denoted by EM 35 , EM 55 , EM 95 , and EM 150 , respectively, and change rates in the elastic modulus between 55° C. and 95° C. and between 95° C. and 150° C. are denoted by ΔEM 55-95 and ΔEM 95-150 , respectively, the following expressions (1) to (5) are satisfied 700 Mpa≦EM 35 ≦3000 MPa  (1) EM 150 <EM 95 <EM 55 <EM 35   (2) ΔEM 55-95 <ΔEM 95-150   (3) 20%≦ΔEM 55-95   (4) 40%≦ΔEM 95-150   (5).

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Номер записи: 44
01-01-2015 дата публикации

Apparatus for temporary bonding of substrate on a carrier and method thereof

Номер: US20150000838A1
Автор: HAYK Khachatryan
Принадлежит: Samsung Display Co Ltd

An apparatus for temporarily bonding a substrate on a carrier includes an electrically conductive adhesion layer disposed between the carrier and the substrate, and a current supply source configured to apply a current to the electrically conductive adhesion layer.

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Номер записи: 45
06-01-2022 дата публикации

ADHESIVES GENERATED FROM SOYBEAN MEAL AND DISTILLER'S DRIED GRAINS WITH SOLUBLES

Номер: US20220002597A1
Автор: Tisserat Brent
Принадлежит:

The invention relates to bio-based adhesives comprising seed flour and distiller's dried grains and solubles (DDGS). The seed flour may be soybean seed flour, and the bio-based adhesive my contain a 50:50 mixture of seed flour and DDGS. The invention also relates to methods for using such bio-based adhesives in the preparation of composite wood panels. 1. A bio-based adhesive comprising seed flour and distiller's dried grains and solubles (DDGS).2. The bio-based adhesive of claim 1 , wherein the seed flour is soybean flour (SBM); or Osage orange seed meal (OOSM).3. The bio-based adhesive of claim 1 , wherein the bio-based adhesive consists essentially of seed flour and DDGS.4. The bio-based adhesive of claim 3 , wherein the bio-based adhesive consists essentially of a 50:50 mixture of seed flour and DDGS.5. The bio-based adhesive of claim 1 , wherein the seed flour and DDGS are ground to about 100 μm to about 300 μm.6. The bio-based adhesive of claim 5 , wherein the seed flour and DDGS are ground to about 200 μm to about 250 μm.7. The bio-based adhesive of claim 1 , wherein the seed flour is SBM.8. A composite wood panel (CWP) fabricated with SBM claim 1 , DDGS claim 1 , OOS claim 1 , or mixtures thereof claim 1 , and at least one wood reinforcement.9. The CWP of claim 8 , wherein the at least one wood reinforcement is maple wood claim 8 , oak wood claim 8 , walnut wood claim 8 , cedar wood claim 8 , pine wood claim 8 , or fir wood.10. The CWP of claim 8 , wherein the wood panel is fabricated with 10%; 15%; 25%; 50%; or 75% of SBM claim 8 , DDGS claim 8 , OOSM claim 8 , or mixtures thereof claim 8 , and the remaining wood reinforcement.11. The CWP of claim 8 , wherein the panel is fabricated with 15% SBM claim 8 , DDGS claim 8 , OOSM claim 8 , or mixtures thereof claim 8 , and 85% wood reinforcement.12. The CWP of claim 8 , wherein the SBM claim 8 , DDGS claim 8 , OOSM claim 8 , or mixtures thereof are ground from about 100 μm to about 350 μm.13. The CWP of claim 12 ...

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Номер записи: 46
02-01-2020 дата публикации

MANUFACTURING METHOD OF CARBON NANOTUBE CONDUCTIVE MICROSPHERES AND CONDUCTIVE GLUE

Номер: US20200002173A1
Автор: Liang Yuheng
Принадлежит:

The present invention provides a manufacturing method of carbon nanotube conductive microspheres and conductive glue. in comparison with a manufacturing method of carbon nanotube conductive microspheres provided by the present invention provides and the conventional “two-step method” which needs to prepare the plastic or resin microspheres and then plating the conductive metal, it is not necessary to respectively prepare the plastic or resin microspheres and the conductive layer, instead, the carbon nanotube are mixed in the polymer microspheres when the styrene monomer, the crosslinking agent and the initiator have a crosslinking reaction to form the polymer microspheres with a method of spray-granulation. Only one step is needed to prepare the conductive microspheres with carbon nanotube as the conductive medium, which can simplify the process, reduce the process, save cost. With mixing the carbon nanotube inside the polymer microspheres, the thermal mismatching between the carbon nanotubes and the resin can be illuminated, to ensure the conductive properties of conductive microspheres. Furthermore, the entire preparing process has no heavy metal salts; the bio-toxicity is reduced and no environmental pollution. The present invention provides a conductive glue, which comprises the carbon nanotube conductive microspheres manufactured by the manufacturing method of carbon nanotube conductive microspheres are easy to manufacture, lower cost, lower impact of thermal mismatching, great conductive properties, and no environmental pollution. 1. A conductive glue comprising carbon nanotube conductive microspheres manufactured by a manufacturing method which comprises following steps:{'b': '1', 'step S, providing a styrene monomer, a crosslinking agent, and an initiator, proportionally mixing the styrene monomer, the crosslinking agent and the initiator to obtain a first liquid;'}{'b': '2', 'step S, providing a dispersant, a surfactant and a carbon nanotube, dissolving- ...

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Номер записи: 47
07-01-2016 дата публикации

Apparatus, composition for adhesive, and adhesive sheet

Номер: US20160002439A1
Автор: Akihiko Tobisawa, Daisuke Kitahara, Kazuya Kitagawa, Mika Tsuda, Yoji Shirato
Принадлежит: Sumitomo Bakelite Co Ltd

An apparatus ( 1 ) includes a supporting base material ( 12 ) that supports an element ( 11 ), a heat-dissipating member ( 13 ) on which the supporting base material ( 12 ) is installed, and an adhesive layer ( 14 ) disposed between the heat-dissipating member ( 13 ) and the supporting base material ( 12 ). The glass transition temperature of the adhesive layer ( 14 ) is equal to or lower than −30° C.

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Номер записи: 48
07-01-2016 дата публикации

Optical Adhesive With Diffusive Properties

Номер: US20160002509A1
Автор: Audrey A. Sherman, James M. Nelson, Kevin R. Schaffer, Ryan E. Marx
Принадлежит: 3M Innovative Properties Co

Optical adhesives that also diffuse visible light include a blend of an adhesive matrix which is an optical adhesive and a block copolymer. The adhesive may be a pressure sensitive adhesive and contains either acid or basic functionality. The block copolymer, which may be a diblock copolymer, contains a high Tg block and a functional block, the functionality of the functional block is complimentary to the functionality of the adhesive matrix to form an acid-base interaction. The adhesive may also contain a crosslinking agent.

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Номер записи: 49
04-01-2018 дата публикации

A conductive elastomer, preparation method and use thereof

Номер: US20180002509A1
Автор: Huilin YANG, Lei Yang, XIAO LIN, Yanjie Bai
Принадлежит: SUZHOU UNIVERSITY

A preparation method of a conductive elastomer includes the following steps: (1) according to the mass percent of 20˜75%, dissolving the metallic salts into deionized water to form an electrolyte solution, wherein said metallic salts is either of magnesium nitrate, sodium nitrate, zinc nitrate, cesium nitrate, calcium nitrate, neodymium nitrate, aluminum nitrate, potassium nitrate, potassium chloride, magnesium chloride, calcium chloride, sodium chloride, zinc chloride, cesium chloride, aluminum chloride or their combinations; (2) according to the mass percent of 10˜40%, mixing starches into the electrolyte solution prepared in step (1), then at the temperature of 33˜120 ° C., stirring to gelatinize the starches, forming a viscous liquid; (3) standing the viscous liquid obtained in step (2) at 25˜90° C. for 10 min to 48 h to obtain the conductive elastomer.

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Номер записи: 50
04-01-2018 дата публикации

ANISOTROPIC CONDUCTIVE FILM

Номер: US20180002575A1
Автор: AKUTSU Yasushi, ODAKA Ryousuke, SATO Daisuke, Tanaka Yusuke
Принадлежит: DEXERIALS CORPORATION

An anisotropic conductive film, capable of connecting a terminal formed on a substrate having a wavy surface such as a ceramic module substrate with conduction characteristics stably maintained, includes an insulating adhesive layer, and conductive particles regularly arranged in the insulating adhesive layer as viewed in a plan view. The conductive particle diameter is 10 μm or more, and the thickness of the film is 1 or more times and 3.5 or less times the conductive particle diameter. The variation range of the conductive particles in the film thickness direction is less than 10% of the conductive particle diameter. 1. An anisotropic conductive film comprising an insulating adhesive layer and conductive particles regularly arranged in the insulating adhesive layer as viewed in a plan view , wherein the conductive particle has a conductive particle diameter of 10 μm or more , the film has a thickness of 1 or more times and 3.5 or less times the conductive particle diameter , and positions of the conductive particles are varied in a thickness direction of the film within a variation range of less than 10% of the conductive particle diameter.2. The anisotropic conductive film according to claim 1 , wherein the thickness of the anisotropic conductive film is 1 or more times and 2.5 or less times the conductive particle diameter.3. The anisotropic conductive film according to claim 1 , wherein a distance between one surface of the anisotropic conductive film and each conductive particle is 10% or more of the conductive particle diameter.4. The anisotropic conductive film according to claim 1 , wherein a difference between maximum and minimum values of particle densities claim 1 , as viewed in a plan view claim 1 , measured at ten regions which each have an area of 1 mm×1 mm and are extracted in a longitudinal direction of the anisotropic conductive film is less than 20% of an average of the particle densities at the respective region.5. The anisotropic conductive film ...

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Номер записи: 51
04-01-2018 дата публикации

HEAT CONDUCTIVE PASTE AND METHOD FOR PRODUCING THE SAME

Номер: US20180002576A1
Автор: MARUYAMA Hiroki, SASAKI Koji
Принадлежит: NAMICS CORPORATION

A heat conductive paste including silver fine particles having an average particle diameter of primary particles of 40 to 350 nm, a crystallite diameter of 20 to 70 nm, and a ratio of the average particle diameter to the crystallite diameter of 1 to 5, an aliphatic primary amine and a compound having at least one phosphoric acid group. The heat conductive paste includes 1 to 40 parts by mass of the aliphatic primary amine and 0.001 to 2 parts by mass of the compound having at least one phosphoric acid group based on 100 parts by mass of the silver fine particles. The heat conductive paste has a high conductivity. 1. A heat conductive paste comprising:silver fine particles having an average particle diameter of primary particles of 40 to 350 nm, a crystallite diameter of 20 to 70 nm, and a ratio of the average particle diameter to the crystallite diameter of 1 to 5,an aliphatic primary amine, anda compound having at least one phosphoric acid group.2. The heat conductive paste according to claim 1 , wherein the paste contains 1 to 40 parts by mass of the aliphatic primary amine and 0.001 to 2 parts by mass of the compound having at least one phosphoric acid group claim 1 , based on 100 parts by mass of the silver fine particles.3. A heat conductive paste produced by:mixing a silver salt of a carboxylic acid and an aliphatic primary amine, then,adding a reducing agent thereto, andmixing a compound having at least one phosphoric acid group with a reaction mixture containing silver fine particles.4. The heat conductive paste according to claim 3 , wherein the reaction mixture contains 1 to 40 parts by mass of the aliphatic primary amine based on 100 parts by mass of the silver fine particles claim 3 , and produced by mixing 0.001 to 2 parts by mass of the compound having at least one phosphoric acid group with the reaction mixture.5. The heat conductive paste according to claim 1 , wherein the compound having at least one phosphoric acid group is at least one substance ...

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Номер записи: 52
04-01-2018 дата публикации

PROPYLENE POLYMER-BASED HOT MELT ADHESIVE COMPOSITION EXHIBITING FAST SET TIME AND ARTICLES INCLUDING THE SAME

Номер: US20180002578A1
Автор: Kauffman Thomas F., Larson Kim M., Roska Timothy W., Schmit Amanda L., Scmidt Scott C.
Принадлежит:

A hot melt adhesive composition that includes at least 35% polymer, from about 15% by weight, to no greater than 75% by weight propylene polymer derived from at least 50% by weight propylene and from 0 mole % to about 37.5% by weight of an alpha-olefin comonomer other than propylene, the propylene polymer exhibiting a heat of fusion of from about 5 Joules per gram (J/g) to 60 J/g, from 5% by weight to about 50% by weight ethylene alpha-olefin copolymer derived from at least 50% by weight ethylene and at least one alpha-olefin comonomer having at least three carbon atoms, the ethylene alpha-olefin copolymer having a density of no greater than 0.90 g/cm, and from 18% by weight to about 37% by weight of a wax component that exhibits a melting point greater than 80° C. and a heat of fusion of at least 200 J/g. 1. A hot melt adhesive composition comprising:at least 35% by weight polymer;from about 15% by weight to no greater than 75% by weight propylene polymer derived from at least 50% by weight propylene and from about 0 mole % to about 37.5 mole % of an alpha-olefin comonomer other than propylene, the propylene polymer exhibiting a heat of fusion of from about 5 Joules per gram (J/g) to 60 J/g;{'sup': '3', 'from 5% by weight to about 50% by weight ethylene alpha-olefin copolymer derived from at least 50% by weight ethylene and at least one alpha-olefin comonomer having at least three carbon atoms, the ethylene alpha-olefin copolymer having a density of no greater than 0.90 g/cm; and'}from 18% by weight to about 37% by weight of a wax component exhibiting a melting point greater than 80° C. and a heat of fusion of at least 200 J/g,the composition exhibiting a set time of no greater than 1.5 seconds at an application temperature of at least 149° C.2. The hot melt adhesive composition of claim 1 , wherein the propylene polymer exhibits a theft temperature of no greater than 126° C.3. The hot melt adhesive composition of claim 1 , wherein the propylene polymer exhibits a ...

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Номер записи: 53
02-01-2020 дата публикации

ELECTRICALLY DEBONDABLE ADHESIVE COMPOSITION, ADHESIVE SHEET, AND ADHERED BODY

Номер: US20200002581A1
Автор: Akamatsu Kaori, Akazawa Koji, AWANE Ryo, HIRAO Akira, MIZOBATA Kaori, Shimizu Yosuke, Tanaka Akiko, Yokoyama Junji
Принадлежит:

An object of the present invention is to provide an electrically debondable composition for forming an electrically debondable adhesive layer suitable for suppressing corrosion of a metal adherend surface. The present invention further provides an adhesive sheet having the electrically debondable adhesive layer, and an adhered body including the adhesive sheet. An electrically debondable composition of the present invention includes a polymer, an ionic liquid, and at least one additive selected from the group consisting of a carbodiimide compound, an adsorptive inhibitor and a chelate-forming metal deactivator. 1. An electrically debondable adhesive composition comprisinga polymer,an ionic liquid, andat least one additive selected from the group consisting of a carbodiimide compound, an adsorptive inhibitor and a chelate-forming metal deactivator.2. The electrically debondable adhesive composition according to claim 1 , wherein the carbodiimide compound is contained in an amount of 0.01 parts by mass or more and 10 parts by mass or less claim 1 , per 100 parts by mass of the polymer.3. The electrically debondable adhesive composition according to claim 1 , wherein the adsorptive inhibitor contains an alkylamine claim 1 , and the content of the alkylamine is 0.01 parts by mass or more and 20 parts by mass or less claim 1 , per 100 parts by mass of the polymer.4. The electrically debondable adhesive composition according to claim 1 , wherein the adsorptive inhibitor contains a carboxylic acid salt or a carboxylic acid derivative claim 1 , and the total content of the carboxylic acid salt and the carboxylic acid derivative is 0.01 parts by mass or more and 10 parts by mass or less claim 1 , per 100 parts by mass of the polymer.5. The electrically debondable adhesive composition according to claim 1 , wherein the adsorptive inhibitor contains an alkyl phosphoric acid salt claim 1 , and the content of the alkyl phosphoric acid salt is 0.01 parts by mass or more and 10 ...

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Номер записи: 54
02-01-2020 дата публикации

Conductive Adhesive

Номер: US20200002582A1
Автор: AOYAGI Yoshihiko, ISOBE Osamu, KAMINO Kenji
Принадлежит:

The conductive adhesive includes a thermosetting resin (A) and a conductive filler (B), and has a loss modulus at 200° C. from 5.0×10Pa to 4.0×10Pa. 1. A conductive adhesive comprising:a thermosetting resin (A); anda conductive filler (B), wherein{'sup': 4', '5, 'the conductive adhesive has a loss modulus at 200° C. from 5.0×10Pa to 4.0×10Pa;'}{'b': 1', '2, 'the thermosetting resin (A) contains a first resin component (A) having a first functional group and a second resin component (A) having a second functional group that reacts with the first functional group; and'}{'b': '2', 'the second resin component (A) is a urethane-modified polyester resin.'}2. The conductive adhesive of claim 1 , wherein the conductive adhesive contains from 40 to 140 parts by mass of the loss modulus modifier (C) relative to 100 parts by mass of the thermosetting resin (A).32. The conductive adhesive of claim 1 , wherein the second resin component (A) has a glass transition temperature from 5° C. to 100° C. and a number average molecular weight from 10 claim 1 ,000 to 50 claim 1 ,000. The present disclosure relates to a conductive adhesive.A conductive adhesive is often used for a flexible printed wiring board. For example, a flexible printed wiring board has been known to include an electromagnetic-wave shielding film bonded thereto and including a shielding layer and a conductive adhesive layer. In this case, the conductive adhesive needs to firmly bond an insulating film (a cover lay) provided on the surface of the flexible printed wiring board and a metal reinforcing plate together, and to ensure good conduction with a ground circuit exposed from an opening of the insulating film.In recent years, as a result of reduced electrical device size, there has been a need to fill a small opening with a conductive adhesive to allow a ground circuit to be reliably conductive. For this reason, consideration has been made to improve the filling performance of the conductive adhesive (see, for ...

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Номер записи: 55
03-01-2019 дата публикации

Thermoelectric (te) ink for three-dimensional (3d) printed te materials, te module including 3d printed te material, and method of manufacturing te module

Номер: US20190002711A1
Автор: Fredrick KIM, Jae Sung Son
Принадлежит: UNIST Academy Industry Research Corp

A thermoelectric (TE) ink for TE materials, a TE module using the TE ink, and a method of manufacturing the TE module are provided. The TE ink may include an inorganic binder including chalcogenidometallate (ChaM), and TE particles including Bi2-xSbxTe3-ySey (0≤x≤2, 0≤y≤1).

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Номер записи: 56
03-01-2019 дата публикации

ANTI-CORROSION COMPOSITION COMPRISING AT LEAST ONE FIRST COMPOUND AND AT LEAST ONE SECOND COMPOUND

Номер: US20190002738A1
Автор: Gryshchuk Oleg, Kaiser Thomas Markus
Принадлежит:

An anti-corrosion composition includes a first compound including: a first polyisobutylene having an average relative molar mass ranging from about 30,000 to about 100,000 g/mole and a Staudinger index ranging from about 15-70 cm/g, a first depolymerized butyl rubber with Brookfield viscosity at 66° C. ranging from about 400,000-2,000,000 mPa·s and an average molecular weight ranging from about 20,000-60,000, and combinations thereof. A second compound includes a second polyisobutylene having an average relative molar mass ranging from about 900,000-6,500,000 g/mole and a Staudinger index ranging from about 240-900 cm/g, at least one second partly cross-linked butyl rubber with a Mooney viscosity at 127° C. ranging from about 65-100 MU. The anti-corrosion composition includes at least one first or at least one second polyisobutylene as well as at least one first or at least one second butyl rubber. 1. An anti-corrosion composition comprising:{'o': {'@ostyle': 'single', 'M'}, 'sub': V', '0', 'W, 'sup': 3', '3, 'a first compound selected from the group consisting of a first polyisobutylene having an average relative molar mass ranging from about 30,000 g/mole to about 100,000 g/mole and a Staudinger index Jranging from about 15 cm/g to about 70 cm/g and/or at least a first depolymerized butyl rubber with an apparent Brookfield viscosity at 66° C. according to DIN EN ISO 2555:2000-01 ranging from about 400,000 mPa·s to about 2,000,000 mPa·s and an average molecular weight Mranging from about 20,000 to about 60,000, and combinations thereof;'}{'o': {'@ostyle': 'single', 'M'}, 'sub': V', '0, 'sup': 3', '3, 'a second compound, selected from the group consisting of a second polyisobutylene having an average relative molar mass ranging from about 900,000 g/mole to about 6,500,000 g/mole and a Staudinger index Jranging from about 240 cm/g to about 900 cm/g, at least one second partly cross-linked butyl rubber with a Mooney viscosity ML(1+3) at 127° C. ranging from about 65 ...

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Номер записи: 57
03-01-2019 дата публикации

NONAQUEOUS SOL-GEL FOR ADHESION ENHANCEMENT OF WATER-SENSITIVE MATERIALS

Номер: US20190002739A1
Автор: HUFF Daniel W., KENNEDY Dennis K., Moore James A.
Принадлежит:

The present disclosure provides sol-gel films and substrates, such as vehicle components, having a sol-gel film disposed thereon. At least one sol-gel formulation has about 10 wt % or less water content based on the total weight of the sol-gel formulation and comprises an organosilane, a metal alkoxide, an acid stabilizer, and an organic solvent. At least one vehicle component comprises a sol-gel coating system comprising a metal substrate and a sol-gel formulation disposed on the metal substrate. The sol-gel formulation has about 10 wt % or less water content based on the total weight of the sol-gel formulation and comprises an organosilane, a metal alkoxide, an acid stabilizer, and an organic solvent. 1. A sol-gel formulation comprising:an organosilane;a metal alkoxide;an acid stabilizer; andan organic solvent, wherein the sol-gel formulation has about 10 wt % or less water content based on the total weight of the sol-gel formulation.2. The sol-gel formulation of claim 1 , wherein the sol-gel formulation has from about 0.1 wt % to about 20 wt % organosilane claim 1 , from about 0.1 wt % to about 10 wt % metal alkoxide claim 1 , and from about 0.1 wt % to about 10 wt % acid stabilizer based on the total weight of the sol-gel formulation.3. The sol-gel formulation of claim 2 , wherein the sol-gel formulation has a water content from about 0.1 wt % to about 3 wt % based on the total weight of the sol-gel formulation.4. The sol-gel formulation of claim 3 , wherein the sol-gel formulation has a water content of about 0.5 wt % or less based on the total weight of the sol-gel formulation.5. The sol-gel formulation of claim 1 , wherein the organic solvent is one or more of alcohol claim 1 , ethylene glycol claim 1 , propylene glycol claim 1 , polyethylene glycol claim 1 , polypropylene glycol claim 1 , an ether claim 1 , tetrahydrofuran claim 1 , N-methyl-2-pyrrolidone claim 1 , and dimethyl sulfoxide.6. The sol-gel formulation of claim 5 , wherein the organic solvent is ...

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Номер записи: 58
03-01-2019 дата публикации

NONAQUEOUS SOL-GEL FOR ADHESION ENHANCEMENT OF WATER-SENSITIVE MATERIALS

Номер: US20190002740A1
Автор: HUFF Daniel W., KENNEDY Dennis K., Moore James A.
Принадлежит:

The present disclosure provides methods for forming sol-gels, sol-gel films and substrates, such as vehicle components, having a sol-gel film disposed thereon. At least one method of forming a sol-gel includes mixing a metal alkoxide, an acid stabilizer, and an organic solvent to form a first mixture having about 10 wt % or less water content based on the total weight of the first mixture. The method includes mixing an organosilane with the first mixture to form a second mixture having about 10 wt % or less water content based on the total weight of the second mixture. 1. A method of forming a sol-gel , comprising:mixing a metal alkoxide, an acid stabilizer, and an organic solvent to form a first mixture having about 10 wt % or less water content based on the total weight of the first mixture; andmixing an organosilane with the first mixture to form a second mixture having about 10 wt % or less water content based on the total weight of the second mixture.2. The method of claim 1 , wherein mixing to form the first mixture comprises dispersing claim 1 , emulsifying claim 1 , suspending claim 1 , or dissolving the metal alkoxide and acid stabilizer in the organic solvent.3. The method of claim 1 , further comprising incubating the second mixture at a temperature from about 10° C. to about 100° C.4. The method of claim 1 , further comprising curing the second mixture at a temperature from about 10° C. to about 150° C.5. The method of claim 1 , further comprising depositing the first mixture or the second mixture onto a metal substrate that comprises one or more of aluminum claim 1 , aluminum alloy claim 1 , nickel claim 1 , iron claim 1 , iron alloy claim 1 , steel claim 1 , titanium claim 1 , titanium alloy claim 1 , copper claim 1 , and copper alloy.6. The method of claim 5 , further comprising cleaning the metal substrate by degreasing claim 5 , alkaline washing claim 5 , chemical etching claim 5 , chemically deoxidizing claim 5 , and/or mechanically deoxidizing the ...

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Номер записи: 59
03-01-2019 дата публикации

METHOD FOR MANUFACTURING CONNECTION STRUCTURE

Номер: US20190002741A1
Автор: Ozeki Hiroki
Принадлежит: DEXERIALS CORPORATION

A method for manufacturing a connection structure capable of increasing the allowable range of a spacing between terminals of a component and mounting at a low temperature. The method for manufacturing a connection structure includes a disposition step of disposing, through an anisotropic conductive adhesive of a thermosetting type including conductive particles, a first electronic component including a first terminal row and a second electronic component including a second terminal row facing the first terminal row, a thermal pressurization step of thermally pressurizing the first electronic component and the second electronic component to sandwich the conductive particles between the first terminal row and the second terminal row, and a full curing step of irradiating with infrared laser light to fully cure the anisotropic conductive adhesive in a state where the conductive particles are sandwiched between the first terminal row and the second terminal row. 1. A method for manufacturing a connection structure comprising:a disposition step of disposing, through an anisotropic conductive adhesive of a thermosetting type including conductive particles, a first electronic component including a first terminal row and a second electronic component including a second terminal row facing the first terminal row;a thermal pressurization step of thermally pressurizing the first electronic component and the second electronic component to sandwich the conductive particles between the first terminal row and the second terminal row; anda full curing step of irradiating with infrared laser light to fully cure the anisotropic conductive adhesive in a state where the conductive particles are sandwiched between the first terminal row and the second terminal row.2. The method for manufacturing a connection structure according to claim 1 ,wherein in the thermal pressurization step, the thermal pressurization is performed at a temperature of not lower than 50° C. and not higher than ...

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Номер записи: 60
02-01-2020 дата публикации

LIQUID CRYSTAL DISPLAY MODULE AND METHOD FOR MANUFACTURING THE SAME

Номер: US20200004079A1
Автор: CHIEN CHUNG-KUANG
Принадлежит:

Provided is a method for manufacturing a liquid crystal display module, including: pre-baking a first substrate and a second substrate; disposing sealing glue at edges of the first substrate and edges of the second substrate; dropping liquid crystals on the second substrate, and coating frame glue on the first substrate and the second substrate; assembling the first substrate and the second substrate so as to form at least one liquid crystal display module, and irradiating the liquid crystal display module with a first light source. 1. A method for manufacturing a liquid crystal display module , comprising:pre-baking a first substrate and a second substrate;forming a sealing glue at edges of the first substrate and edges of the second substrate;dropping liquid crystals on the second substrate, and coating a frame glue on the first substrate and the second substrate;assembling the first substrate and the second substrate coated with frame glue, and forming the liquid crystals in a gap between the first substrate and the second substrate after the first substrate and the second substrate have been assembled so as to form at least one liquid crystal display module;irradiating the liquid crystal display module with a first light source; andirradiating the liquid crystal display module with a second light source.2. The method for manufacturing the liquid crystal display module according to claim 1 , wherein after irradiating the liquid crystal display module with the second light source claim 1 , the method further comprises: detecting flaws on the liquid crystal display module.3. The method for manufacturing the liquid crystal display module according to claim 1 , wherein a wavelength of an absorption spectrum of the sealing glue is 300 nm to 400 nm.4. The method for manufacturing the liquid crystal display module according to claim 1 , wherein the step of assembling the first substrate and the second substrate coated with the frame glue comprises:arranging an alignment ...

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Номер записи: 61
13-01-2022 дата публикации

Electrically conductive adhesive

Номер: US20220010180A1
Автор: Andreas Reisinger, Christian Neumann, Sebastian Vogt, Stefan Schibli
Принадлежит: Heraeus Deutschland GmbH and Co KG

One aspect refers to an electrically conductive adhesive including a) a (meth)acrylate monomer, b) a polymer being soluble in the (meth)acrylate monomer, c) a biocompatible metal having a median particle size d50 of below 50 μm, and d) a polymerization initiator. One aspect also refers to a kit for preparing an electrically conductive adhesive, to an implantable medical device including such an electrically conductive adhesive, or a cured form thereof, and to the use of such an electrically conductive adhesive.

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Номер записи: 62
07-01-2016 дата публикации

Adhesive Film for Organic Electronic Device and Encapsulant Comprising the Same

Номер: US20160005999A1
Автор: Bon Su Koo, Chung Gu Lee, Hwi Yong Lee, Jeong Min Park, Jin Hyuk Kim
Принадлежит: INNOX Corp

Disclosed are an adhesive film for an organic electronic device and an encapsulant including the same, wherein the adhesive film can function to remove or block defect causes such as moisture and impurities so that the defect causes do not approach the organic electronic device, and also to minimize problems due to separation of the organic electronic device and the film and/or interfacial film delamination upon moisture removal.

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Номер записи: 63
20-01-2022 дата публикации

ELECTRICALLY CONDUCTIVE ADHESIVE AND ELECTRICALLY CONDUCTIVE MATERIAL

Номер: US20220017793A1
Автор: KUNIMUNE Teppei, KURAMOTO Masafumi
Принадлежит: NICHIA CORPORATION

Disclosed is an electrically conductive adhesive containing: 1. A method of producing an electrically conductive material , comprising hardening , at a temperature in a range of 120° C. to 300° C. , an electrically conductive adhesive comprising:(A) a polyether polymer having: {'br': None, 'sup': '1', '—R—O—'}, 'a backbone comprising a repeating unit of the formula{'sup': '1', 'wherein Ris a hydrocarbon group having 1 to 10 carbon atoms, and an end group which is a hydrolyzable silyl group, and'}(B) silver particles.2. The method according to claim 1 , wherein the hardening is performed at 160° C. to 250° C. in the air for 30 to 120 minutes.3. The method according to claim 1 , wherein the hydrolyzable silyl group in the polyether polymer (A) is of the formula:{'br': None, 'sup': 1', '2, 'sub': n', '3-n, '-si(—X)(—X)'}{'sup': '1', 'wherein Xis a hydrolyzable group,'}{'sup': '2', 'Xa hydrocarbon group having 1 to 12 carbon atoms, and'}n is 1, 2 or 3.4. The method according to claim 3 , wherein the hydrolyzable group in the polyether polymer (A) is at least one group selected from a hydride group claim 3 , an alkoxy group claim 3 , a halogen group claim 3 , an acyloxy group claim 3 , a ketoxymate group claim 3 , an aminoxy group claim 3 , an amide group claim 3 , an amino group and a mercapto group.5. The method according to claim 1 , wherein the electrically conductive adhesive further comprises particles of another metal which is at least one selected from gold claim 1 , copper claim 1 , platinum claim 1 , palladium claim 1 , rhodium claim 1 , ruthenium claim 1 , iridium and osmium.6. The method according to claim 5 , wherein the amount of particles of the other metal is at most 30% by weight claim 5 , based the total of the silver particles (B) and the other metal particles.7. The method according to claim 1 , wherein the silver particles (B) are flake-shaped particles.8. The method according to claim 1 , wherein the average particle diameter (median diameter) of ...

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Номер записи: 64
07-01-2016 дата публикации

FLAME RETARDANT, ELECTRICALLY CONDUCTIVE ADHESIVE MATERIALS AND RELATED METHODS

Номер: US20160007509A1
Автор: Creasy, Hsu Alex, JR. Larry Don, Lin Yishen
Принадлежит:

Disclosed are exemplary embodiments of a flame retardant, electrically conductive adhesive material. In an exemplary embodiment, a flame retardant, electrically conductive adhesive material suitable for use as tape generally includes a layer of adhesive. A layer of electrically conductive fabric is on the layer of adhesive. A flame retardant coating is on the layer of electrically conductive fabric. The flame retardant coating includes a carbon-containing resin. 1. A flame retardant , electrically conductive adhesive material suitable for use as tape and comprising:a layer of electrically conductive adhesive that is free of flame retardant;a layer of electrically conductive fabric on the layer of electrically conductive adhesive; anda flame retardant coating on the layer of electrically conductive fabric, the coating including a carbon-containing resin;wherein the flame retardant, electrically conductive adhesive material is able to achieve a UL flame rating; and the flame retardant coating including the carbon-containing resin is the sole flame retardant included in the flame retardant, electrically conductive adhesive material; and/or', 'the flame retardant, electrically conductive adhesive material has a z-axis resistance of 0.007 ohms or less, and/or a surface resistivity of 0.07 ohms per square or less, and/or a peel adhesion of at least 1.6 pounds per inch width or higher., 'wherein2. The adhesive material of claim 1 , wherein:wherein the flame retardant, electrically conductive adhesive material has a z-axis resistance of 0.007 ohms or less, and/or a surface resistivity of 0.07 ohms per square or less, and/or a peel adhesion of at least 1.6 pounds per inch width or higher; andthe flame retardant coating including the carbon-containing resin is the sole flame retardant included in the flame retardant, electrically conductive adhesive material; andthe flame retardant, electrically conductive adhesive material is able to achieve a flame rating of UL510.3. The ...

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Номер записи: 65
12-01-2017 дата публикации

ANTIMICROBIAL PRESSURE-SENSITIVE ADHESIVE SYSTEM

Номер: US20170007464A1
Автор: Ali Mahfuza B., CONRAD-VLASAK DEENA M., Johnson Elizabeth E., Liu Junkang J., STEPANOVA NARINA Y.
Принадлежит: 3M INNOVATIVE PROPERTIES COMPANY

An antimicrobial pressure-sensitive adhesive (PSA). The PSA system can include an antimicrobial polymer having a plurality of pendant groups. The plurality of pendant groups can include (i) a first pendant group comprising a nonpolar compound, (ii) a second pendant group comprising a quaternary ammonium compound, and (iii) a third pendant group different from the first pendant group or the second pendent group, wherein the third pendant group provides inter-reactivity, such that the antimicrobial polymer can include one or more intermolecular interactions. The antimicrobial polymer can be free of non-ionic hydrophilic moieties. The PSA system can have a glass transition temperature Tranging from 0 to 50 degrees C. 1. A pressure-sensitive adhesive (PSA) system comprising: a first pendant group comprising a nonpolar compound,', 'a second pendant group comprising a quaternary ammonium compound, and', 'a third pendant group different from the first pendant group or the second pendent group, wherein the third pendant group provides inter-reactivity, such that the antimicrobial polymer can include one or more intermolecular interactions, and wherein the antimicrobial polymer is free of non-ionic hydrophilic moieties; and, 'an antimicrobial polymer having a plurality of pendant groups comprising'}{'sub': 'g', 'wherein the PSA system has a glass transition temperature Tranging from 0 to 50 degrees C.'}2. The PSA system of claim 1 , wherein the PSA system has a glass transition temperature ranging from 10 to 40 degrees C.3. The PSA system of claim 1 , further comprising at least one of a tackifier and a plasticizer.4. The PSA system of claim 1 , further comprising an antimicrobial agent dispersed within the PSA system.5. The PSA system of claim 4 , wherein the antimicrobial agent includes at least one of chlorhexidine gluconate claim 4 , chlorhexidine digluconate claim 4 , polyhexymethyl biguanide claim 4 , a quaternary ammonium compound claim 4 , silver claim 4 , and a ...

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Номер записи: 66
03-01-2019 дата публикации

Heating tape and system

Номер: US20190008000A1
Автор: Anibal S. Sanchez-Garcia, David E. Livingstone, Frank A. Brandys, JIAN Li, Jonathan M. Cliffen, Paolo Rocca, Ranjith Divigalpitiya, Raul P. MORAES, Weixing HOU
Принадлежит: 3M Innovative Properties Co

A heating tape comprises an insulated heating element that includes a heating element layer comprising a polymer composite having conductive particles and at least one set of conductive electrodes at least partially embedded in the polymer composite and extending along at least a substantial portion of the length of the heating tape. A heating tape system for a pipe or other surface, further includes a power ramp controller having a solid state relay component to regulate an in-rush of current to the heating element. The heating tape system also includes a connector having multiple contact points.

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Номер записи: 67
02-01-2020 дата публикации

CONNECTION STRUCTURE

Номер: US20200008304A1
Автор: Araki Yuta
Принадлежит: DEXERIALS CORPORATION

A connection structure: a first electronic component having a terminal pattern in which a plurality of terminals are arranged side by side in a radial form and a second electronic component having a terminal pattern corresponding to the terminal pattern of the first electronic component are anisotropically conductively connected using an anisotropic conductive film, (i) the effective connection area per terminal is 3000 μmor more, and the number density of conductive particles in the anisotropic conductive film is 2000 particles/mmor more and 20000 particles/mmor less, (ii) as the anisotropic conductive film, adopted is an anisotropic conductive film in which the conductive particles are arranged in a lattice form, and the arrangement pitch and the arrangement direction are configured such that each terminal captures three or more conductive particles, or (iii) as the anisotropic conductive film, adopted is an anisotropic conductive film having a multiple circular region. 1. A method for producing a connection structure in which a first electronic component having a terminal pattern in which a plurality of terminals are arranged side by side in a radial form and a second electronic component having a terminal pattern corresponding to the terminal pattern of the first electronic component are anisotropically conductively connected using an anisotropic conductive film , wherein{'sup': '2', 'an effective connection area per terminal is 3000 μmor more, and'}{'sup': 2', '2, 'a number density of conductive particles in the anisotropic conductive film is 2000 particles/mmor more and 20000 particles/mmor less.'}2. A method for producing a connection structure in which a first electronic component having a terminal pattern in which a plurality of terminals are arranged side by side in a radial form and a second electronic component having a terminal pattern corresponding to the terminal pattern of the first electronic component are anisotropically conductively connected ...

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Номер записи: 68
14-01-2021 дата публикации

METHOD OF ELIMINATING ENTRAINED AIR BETWEEN SUBSTRATES DURING OPTICAL BONDING

Номер: US20210008836A1
Автор: Aires Antonio, Caldeira Carlos, Cardoso Hugo, Lima Nelson, McMillan Richard K., Mendiboure Andre, Ruza Andre, Somashankar Abhilash Marthi
Принадлежит: VISTEON GLOBAL TECHNOLOGIES, INC.

A method of forming a display article includes dispensing a material onto a first substrate, and pre-curing the material to form a dam. The method includes depositing a liquid optically clear adhesive in a first pattern onto the first substrate such that the first pattern is spaced apart from the dam to form a coated first substrate. The method includes depositing the adhesive in a second pattern onto a second substrate to form a coated second substrate, and flipping the coated second substrate upside down. The method includes translating the coated first and second substrates towards one another to eliminate an air gap, contacting the first pattern and the second pattern at a plurality of single points, and compressing the first pattern and the second pattern to eliminate the air gap and air entrained between the coated first and second substrates. 1. A method of forming a display article , the method comprising:dispensing a dam material onto a first substrate;after dispensing, pre-curing the dam material to form a dam;depositing a liquid optically clear adhesive in a first fill pattern onto the first substrate such that the first fill pattern is spaced apart from the dam to thereby form a coated first substrate;depositing the liquid optically clear adhesive in a second contact pattern onto a second substrate to thereby form a coated second substrate;flipping the coated second substrate upside down;translating the coated first substrate and the coated second substrate towards one another to eliminate an air gap defined between the coated first substrate and the coated second substrate;contacting the first fill pattern and the second contact pattern at a plurality of single points spaced apart from one another; andcompressing the first fill pattern and the second contact pattern to eliminate the air gap and air entrained between the coated first substrate and the coated second substrate and thereby form the display article.2. The method of claim 1 , wherein ...

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Номер записи: 69
14-01-2016 дата публикации

ELECTRICALLY PEELABLE ADHESIVE COMPOSITION AND ELECTRICALLY PEELABLE ADHESIVE SHEET, AND METHOD FOR USING ELECTRICALLY PEELABLE ADHESIVE SHEET

Номер: US20160009960A1
Автор: HATANAKA Tomio, Kato Kiichiro, Kawada Satoshi, SUGINO Takashi, YAMADA Haruya
Принадлежит: LINTEC Corporation

An electrically peelable pressure sensitive adhesive composition consists of an emulsion type acrylic pressure sensitive adhesive (A) comprising an acrylic polymer (A1) obtained by emulsion polymerization in the presence of a surfactant using a monomer mixture comprising an alkyl(meth)acrylate, and a (poly)alkylene polyol (B) having a number average molecular weight of 2000 or less, wherein a content of the component (B) based on 100 parts by mass of active ingredient of the component (A) is 3.5 parts by mass or more. In the electrically peelable pressure sensitive adhesive composition, the adhesiveness before voltage application is high, but the adhesiveness can decrease effectively by voltage application for a short time. 1. An electrically peelable pressure sensitive adhesive composition comprising an emulsion type acrylic pressure sensitive adhesive (A) comprising an acrylic polymer (A1) obtained by emulsion polymerization in the presence of a surfactant of a monomer mixture comprising an alkyl(meth)acrylate , and a (poly)alkylene polyol (B) having a number average molecular weight of 2000 or less , whereina content of the component (B) is 3.5 parts by mass or more based on 100 parts by mass of active ingredient of the component (A).2. The electrically peelable pressure sensitive adhesive composition according to claim 1 , wherein the content of the component (B) is 3.5 to 50 parts by mass based on 100 parts by mass of active ingredient of the component (A).3. The electrically peelable pressure sensitive adhesive composition according to claim 1 , wherein the component (B) comprises a (poly)alkylene glycol.5. The electrically peelable pressure sensitive adhesive composition according to claim 1 , wherein the component (A1) is an acrylic copolymer comprising 60 to 99.9% by mass of a constituent unit (a1) derived from an alkyl(meth)acrylate claim 1 , and 0.1 to 40% by mass of a constituent unit (a2) derived from a functional group-containing unsaturated monomer.6. ...

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Номер записи: 70
14-01-2016 дата публикации

ELECTRICALLY PEELABLE ADHESIVE COMPOSITION AND ELECTRICALLY PEELABLE ADHESIVE SHEET, AND METHOD FOR USING ELECTRICALLY PEELABLE ADHESIVE SHEET

Номер: US20160009961A1
Автор: HATANAKA Tomio, Kato Kiichiro, Kawada Satoshi, SUGINO Takashi, YAMADA Haruya
Принадлежит: LINTEC Corporation

An electrically peelable pressure sensitive adhesive composition, which contains an acrylic polymer (A), a (poly)alkylene polyol (B) having a number average molecular weight of no greater than 2000, and an ammonium salt (C), has a high adhesiveness before voltage application, but the adhesiveness can decrease effectively by voltage application for a short time. 1. An electrically peelable pressure sensitive adhesive composition comprising an acrylic polymer (A) , a (poly)alkylene polyol (B) having a number average molecular weight of 2000 or less , and an ammonium salt (C).2. The electrically peelable pressure sensitive adhesive composition according to claim 1 , wherein the component(C) is an ammonium sulfonate.3. The electrically peelable pressure sensitive adhesive composition according to claim 2 , wherein the ammonium sulfonate is a compound represented by the following general formula (c-1):{'br': None, '[Chem. 1]'}{'br': None, 'sup': 1', '2, 'sub': n', '3', '4, 'RO\ue8a0RO\ue8a0SONH\u2003\u2003(c-1)'}{'sup': 1', '2, 'wherein Rrepresents any of an alkyl group that may have a substituent, an alkenyl group that may have a substituent, and an aryl group that may have a substituent, and a polycyclic aromatic hydrocarbon group is also included in the aryl group; Rrepresents an alkylene group having 1 to 10 carbon atoms that may have a substituent; and n represents a real number of 1 or more.'}4. The electrically peelable pressure sensitive adhesive composition according to claim 1 , wherein a content of the component(C) is 3 to 250 parts by mass based on 100 parts by mass of the component(A).5. The electrically peelable pressure sensitive adhesive composition according to claim 1 , wherein the component(B) comprises a (poly)alkylene glycol.6. The electrically peelable pressure sensitive adhesive composition according to claim 5 , wherein the (poly)alkylene glycol is a compound represented by the following general formula (b-1):{'br': None, '[Chem. 2]'}{'br': None, ...

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Номер записи: 71
14-01-2016 дата публикации

ELECTRICALLY PEELABLE ADHESIVE COMPOSITION AND ELECTRICALLY PEELABLE PRESSURE SENSITIVE ADHESIVE SHEET, AND METHOD FOR USING ELECTRICALLY PEELABLE PRESSURE SENSITIVE ADHESIVE SHEET

Номер: US20160009962A1
Автор: Kato Kiichiro, YAMADA Haruya
Принадлежит: LINTEC Corporation

An electrically peelable pressure sensitive adhesive sheet has a pressure sensitive adhesive layer formed of an electrically peelable pressure sensitive adhesive composition comprising an acrylic copolymer (A) comprising 1 to 99 mass % of a constituent unit (a1) derived from a compound represented by the following general formula (a1), and a surfactant (B). The electrically peelable pressure sensitive adhesive sheet has high adhesion before voltage application, but the adhesion can be effectively decreased by voltage application for a short time. 2. The electrically peelable pressure sensitive adhesive composition according to claim 1 , wherein the acrylic copolymer (A) further comprises 0.1 to 30 mass % of a constituent unit (a2) derived from a functional group-containing monomer (a2).3. The electrically peelable pressure sensitive adhesive composition according to claim 1 , wherein the acrylic copolymer (A) further comprises 0.1 to 98 mass % of a constituent unit (a3) derived from an alkyl (meth)acrylate (a3) containing an alkyl group having 1 to 20 carbon atoms.4. The electrically peelable pressure sensitive adhesive composition according to claim 1 , wherein the compound represented by the general formula (a1) is one or more selected from the group consisting of 2-methoxyethyl (meth)acrylate claim 1 , 2-methoxyethylene glycol (meth)acrylate claim 1 , ethoxydiethylene glycol (meth)acrylate claim 1 , and methoxytriethylene glycol (meth)acrylate.5. The electrically peelable pressure sensitive adhesive composition according to claim 1 , wherein the component (B) is a compound represented by the following general formula (b1):{'br': None, 'sup': a', 'b', '−', '+, 'sub': m', '3, 'R\ue8a0RO\ue8a0SOX\u2003\u2003(b1)'}{'sup': a', 'b', '+, 'wherein Rrepresents any of unsubstituted or substituted alkyl group having 1 to 18 carbon atoms, unsubstituted or substituted cycloalkyl group having 3 to 18 ring carbon atoms, unsubstituted or substituted alkenyl group having 1 to 18 ...

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Номер записи: 72
11-01-2018 дата публикации

ACRYLIC ADHESIVE SHEET, MEDICAL ADHESIVE TAPE, AND METHOD FOR MANUFACTURING THE SAME

Номер: US20180010019A1
Автор: CHOI Tae-Yi, Han Jeong-In, Kim Dan-A, Kim Jang-Soon, YANG Ji-Yeon, Yue Seong-Hoon
Принадлежит: LG CHEM, LTD.

Provided are: an acrylic adhesive sheet having a porous structure including a plurality of pores and having a water vapor transmission rate of 2,000 g/m·24 h to 3,500 g/m·24 h at 24° C. and 25% RH, and a porosity of 10% to 60%; and a medical adhesive tape including the same. 1. An acrylic adhesive sheet having a porous structure comprising a plurality of pores and having a water vapor transmission rate of 2 ,000 g/m·24 h to 3 ,500 g/m·24 h at 24° C. and 25% RH , and a porosity of 10% to 60%.2. The acrylic adhesive sheet of claim 1 , wherein the pores have an average size of 500 nm to 100 μm.3. The acrylic adhesive sheet of claim 1 , wherein the acrylic adhesive sheet has a thickness of 10 μm to 100 μm.4. The acrylic adhesive sheet of claim 1 , wherein the acrylic adhesive sheet is formed to have the porous structure by carrying out foaming and thermal curing on an aqueous acrylic adhesive composition.5. The acrylic adhesive sheet of claim 4 , wherein the aqueous acrylic adhesive composition comprises at least one selected from the group consisting of an acrylic resin claim 4 , a surfactant claim 4 , a thermal foaming agent claim 4 , water claim 4 , other additives claim 4 , and a combination thereof.6. The acrylic adhesive sheet of claim 5 , wherein the aqueous acrylic adhesive composition further comprises or does not further comprise a separate cross-liking agent.7. The acrylic adhesive sheet of claim 4 , wherein the aqueous acrylic adhesive composition comprises the acrylic resin in an amount of 40 wt % to 70 wt %.8. The acrylic adhesive sheet of claim 4 , wherein the aqueous acrylic adhesive composition comprises a surfactant in an amount of 1 wt % to 10 wt %.9. The acrylic adhesive sheet of claim 8 , wherein the surfactant comprises at least one selected from the group consisting of a cationic surfactant claim 8 , an anionic surfactant claim 8 , an amphoteric surfactant claim 8 , a non-ionic surfactant claim 8 , and a combination thereof.10. The acrylic ...

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Номер записи: 73
11-01-2018 дата публикации

THERMOCONDUCTIVE ELECTROCONDUCTIVE ADHESIVE COMPOSITION

Номер: US20180010020A1
Автор: ABE Shintaro, FURUSHO Rikia, Kondo Takeshi, TANAKA Teruki
Принадлежит:

[Problem] Provided is a thermally and electrically conductive adhesive composition used as a die-bonding material which shows high heat dissipation performance and stable electric conductivity as well as high adhesion force. 1. A thermally and electrically conductive adhesive composition , comprising:(A) an electrically conductive filler,(B) an epoxy resin,(C) a curing agent,(D) an organic solvent, whereinthe electrically conductive filler (A) is a submicron fine silver powder, and the content of the electrically conductive filler (A) is such that (A)/(B) is 96.0/4.0 to 99.5/0.5 in the mass ratio to the content of the epoxy resin (B), andthe epoxy resin (B) comprises at least a bisphenol-type epoxy resin and a novolac-type epoxy resin, andthe curing agent (C) is diaminodiphenyl sulfone and/or a derivative thereof, and the content of the curing agent (C) is 0.4 to 2.4 molar equivalents in terms of equivalent of active hydrogen relative to 1 molar equivalent of epoxy groups in the epoxy resin (B).2. The thermally and electrically conductive adhesive composition according to claim 1 , wherein the mass ratio of the bisphenol-type epoxy resin and the novolac-type epoxy resin contained in the epoxy resin (B) is such that bisphenol-type epoxy resin/novolac-type epoxy resin is 40/60 to 80/20.4. The thermally and electrically conductive adhesive composition according to claim 1 , wherein the submicron fine silver powder used in the electrically conductive filler (A) is coated with a coating agent claim 1 , a surface of the coating agent comprising carboxylic acid.5. The thermally and electrically conductive adhesive composition according to claim 1 , wherein the content of the epoxy resin (B) is 0.3 to 4.0% by mass relative to the total amount of the thermally and electrically conductive adhesive composition.6. The thermally and electrically conductive adhesive composition according to claim 2 , wherein the submicron fine silver powder used in the electrically conductive ...

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Номер записи: 74
14-01-2021 дата публикации

OPTICALLY CLEAR ADHESIVE AND METHOD OF MANUFACTURING SAME, AND DISPLAY PANEL

Номер: US20210009860A1
Автор: HE Chunmei
Принадлежит:

The invention provides for an optically clear adhesive (OCA), a display panel, and a method of manufacturing the OCA. The OCA includes an OCA layer and a polyurethane resin layer which are disposed in a stack. The polyurethane resin layer mixes with the OCA layer. The method includes a plurality of steps of: providing a lower release film, manufacturing the OCA layer, and manufacturing the polyurethane resin layer. The display panel includes a backplate layer, a display layer, a touch control layer, a polarizer, and a flexible plate which are sequentially disposed on each other. The OCA is disposed between the backplate layer and the display layer and/or is disposed between the display layer and the touch control layer and/or is disposed between the touch control layer and the polarizer and/or is disposed between the polarizer and the flexible plate. 1. An optically clear adhesive (OCA) , comprising:an OCA layer; anda polyurethane resin layer disposed on the OCA layer;wherein the polyurethane resin layer mixes with the OCA layer.2. The OCA of claim 1 , wherein material of the OCA layer comprises a thermosetting OCA and/or an ultraviolet curing OCA.3. The OCA of claim 1 , wherein a thickness of the polyurethane resin layer is less than a thickness of the OCA layer.4. The OCA of claim 1 , wherein a thickness of the polyurethane resin layer is less than 5 μm.5. A method of manufacturing the OCA of claim 1 , comprising a plurality of steps of:providing a lower release film;manufacturing the OCA layer, wherein the step of manufacturing the OCA layer is to coat the OCA layer on the lower release film;manufacturing the polyurethane resin layer, wherein the step of manufacturing the polyurethane resin layer is to coat polyurethane on the OCA layer, and then foam the polyurethane, wherein the polyurethane mixes with the OCA layer in a contact area thereof to form the polyurethane resin layer after the OCA layer is foamed.6. The method of claim 5 , wherein a step between the ...

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Номер записи: 75
10-01-2019 дата публикации

Polysaccharide Adhesive

Номер: US20190010302A1
Автор: Kozich Martin, Seidl Bernhard, WASTYN Marnik Michel
Принадлежит:

The present invention relates to the use of a polysaccharide adhesive containing cold water-soluble or cold water-swelling, covalently cross-linked starch as a binder together with a foam generator for producing an adhesive foam. 16.-. (canceled)7. A method comprising:obtaining a polysaccharide adhesive comprising cold water-soluble and/or cold water-swellable, completely lysed, covalently cross-linked starch as a binding agent in combination with a foaming agent further defined as comprising at least one anionic, cationic, amphoteric, or nonionic surfactant; andusing the polysaccharide adhesive to prepare an adhesive foam.8. The method of claim 7 , further comprising selecting a concentration of the covalently cross-linked starch in the polysaccharide adhesive such that an aqueous claim 7 , unfoamed suspension of the adhesive has a viscosity within a range of about 1000 to 4000 mPa-s (Brookfield viscosity claim 7 , 25° C. claim 7 , 100 rpm).9. The method of claim 8 , wherein the concentration of the covalently cross-linked starch in the polysaccharide adhesive is selected such that the aqueous claim 8 , unfoamed suspension of the adhesive has a viscosity within a range of about 1500 to 2500 mPa-s.10. The method of claim 7 , wherein not more than 70% by mass of the cross-linked starch is substituted by degraded starch.11. The method of claim 10 , wherein not more than 60% by mass of the cross-linked starch is substituted by degraded starch.12. The method of claim 11 , wherein not more than 50% by mass of the cross-linked starch is substituted by degraded starch.13. The method of claim 10 , wherein the degraded starch comprises at least one dextrin claim 10 , maltodextrin claim 10 , and/or enzymatically modified starch.14. The method of claim 7 , wherein an aqueous claim 7 , unfoamed suspension containing the polysaccharide adhesive has a solids content of more than 15% by mass of the suspension.15. The method of claim 14 , wherein the aqueous claim 14 , unfoamed ...

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Номер записи: 76
09-01-2020 дата публикации

ADHESIVE ARTICLE

Номер: US20200010733A1
Автор: Hulteen John C., Widenbrant Martin J.
Принадлежит:

Described herein is an adhesive article for fire protection along with methods of using the same. The adhesive article comprises (i) a substrate having a major surface, wherein the major surface has at least two opposing distal portions and a central portion therebetween and wherein the substrate is perforated along the at least two opposing distal portions and is not perforated in the central portion; (ii) a sealing strip positioned between the central portion and the distal portion; and (iii) a discontinuous adhesive layer disposed on the at least two opposing distal portions. 1. An adhesive article , the adhesive article comprising:a substrate having a major surface, wherein the major surface has at least two opposing distal portions and a central portion therebetween and wherein the substrate is perforated along the at least two opposing distal portions and is not perforated in the central portion;(ii) a sealing strip positioned between the central portion and each of the distal portions; and(iii) a discontinuous adhesive layer disposed on the at least two opposing distal portions.2. The adhesive article of claim 1 , wherein the discontinuous adhesive layer is disposed on the central portion.3. The adhesive article of claim 1 , wherein an intumescent material is fixedly attached to the central portion.4. The adhesive article of claim 3 , wherein the intumescent material is fixedly attached via the discontinuous adhesive layer.5. The adhesive article of claim 1 , wherein the at least two opposing distal portions have an open area of at least 0.01%.6. The adhesive article of claim 1 , wherein the discontinuous adhesive layer comprises at least two different adhesives.7. The adhesive article of claim 1 , wherein the perforations are patterned.8. The adhesive article of claim 1 , wherein the perforations are substantially free of the discontinuous adhesive layer.9. The adhesive article of claim 1 , wherein the adhesive article is an extended length.10. The adhesive ...

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Номер записи: 77
09-01-2020 дата публикации

Glue filling method for multilayer thin film sensor structure

Номер: US20200010737A1
Автор: Sheng Che Chen, Yi-Hung Ho
Принадлежит: General Interface Solution Ltd, Interface Optoelectronics Shenzhen Co Ltd, Interface Technology Chengdu Co Ltd

A glue filling method for a multilayer thin film sensor structure is disclosed herein. Two outer layers of a composite heat-resistant membrane are carved to have desired patterned holes; an inner layer is interposed between two outer layers to form a layered structure. The composite heat-resistant membrane is stuck onto the multilayer thin film sensor structure with the patterned holes aligned to an electric-conduction through-hole of the multilayer thin film sensor structure to form a filling region. A conductive glue is filled into the filling region. Sustained by the inner-layer heat-resistant membrane, the conductive glue protrudes from the patterned hole to cover a portion of the conductive metals on the surface of the multilayer thin film sensor structure. Thereby are simultaneously achieved a water-proof effect, an airtight effect and a fine interface compatibility.

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Номер записи: 78
09-01-2020 дата публикации

METHOD FOR MANUFACTURING FINE-PITCH ANISOTROPIC CONDUCTIVE ADHESIVE AND FINE-PITCH ANISOTROPIC CONDUCTIVE ADHESIVE MANUFACTURED BY SAME METHOD

Номер: US20200010738A1
Автор: LEE Kyung Sub
Принадлежит:

The provided relates to a method for preparing an anisotropic conductive adhesive for fine pitch and an anisotropic conductive adhesive for fine pitch prepared by the same method. Provided is a method for preparing an anisotropic conductive adhesive for a fine pitch including: (i) removing an oxide film of solder particles having self-fusion and self-orientation functions between metal terminals of a substrate by melting the solder particles at a predetermined temperature using a first reducing agent; (ii) removing moisture generated in step (i); and (iii) preparing an anisotropic conductive adhesive by mixing the solder particles from which the oxide film and the moisture are removed with a binder resin in steps (i) and (ii), in which step (iii) is performed in a state where a contact with oxygen is blocked. 1. A method for preparing an anisotropic conductive adhesive for fine pitch , the method comprising:(i) removing an oxide film of solder particles having self-fusion and self-orientation functions between metal terminals of a substrate by melting the solder particles at a predetermined temperature using a first reducing agent;(ii) removing moisture generated in step (i); and(iii) preparing the anisotropic conductive adhesive by mixing the solder particles from which the oxide film and the moisture are removed in steps (i) and (ii) with a binder resin,a. wherein step (iii) is performed in a state where a contact with oxygen is blocked.2. The method of claim 1 , wherein the anisotropic conductive adhesive in step (iii) further includes a second reducing agent for preventing further oxidation of the solder particles.3. The method of claim 2 , wherein an amount of the second reducing agent is 0.01 to 3 parts by weight with respect to 100 parts by weight of the anisotropic conductive adhesive in step (iii).4. The method of claim 1 , wherein the first reducing agent is at least one selected from the group consisting of 3-butenoic acid (BA) claim 1 , 1 claim 1 ,3-bis( ...

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Номер записи: 79
09-01-2020 дата публикации

Lightweight rf shielding conductive elastomeric tape

Номер: US20200010739A1
Автор: Alexander T. Smith, Bryan T. Wyrebek, Jared DG Butlin
Принадлежит: Swift Textile Metalizing LLC

A lightweight electromagnetic wave shielding tape is disclosed. The tape includes a first polymer protective layer, a calendered conductive material layer coupled to a bottom side of the first polymer protective layer, and a second polymer protective layer coupled to a bottom side of the conductive material layer so that the conductive material layer is encapsulated within the protective layers. An adhesive layer can also be applied to one of the protective layers.

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Номер записи: 80
09-01-2020 дата публикации

METHOD FOR MANUFACTURING ANISOTROPIC CONDUCTIVE ADHESIVE INCLUDING GAPPER AND METHOD FOR MOUNTING COMPONENT USING GAPPER

Номер: US20200010740A1
Автор: LEE Kyung Sub
Принадлежит:

Provided relates to a method for manufacturing an anisotropic conductive adhesive and a method for mounting a component using an anisotropic conductive adhesive, and provides a method for manufacturing an anisotropic conductive adhesive, including: a process of removing a first oxide film on solder particles by using a first reducing agent; and a process of manufacturing an anisotropic conductive adhesive by mixing the solder particles, a gapper, and an adhesive resin. 1. A method for manufacturing an anisotropic conductive adhesive including a gapper , comprising:a process of removing a first oxide film on solder particles by using a first reducing agent; anda process of manufacturing an anisotropic conductive adhesive by mixing the solder particles, a gapper, and an adhesive resin.2. The method for manufacturing an anisotropic conductive adhesive including a gapper of claim 1 ,wherein the gapper includes at least one material selected from the group consisting of a polymer bead, a polymer particle, an inorganic particle, and mixtures thereof.3. The method for manufacturing an anisotropic conductive adhesive including a gapper of claim 2 ,wherein the polymer bead includes at least one material selected from the group consisting of polymethyl methacrylate, polystyrene, polyurethane, polyethylene, polyethyleneimine, polypropylene, and polyisobutylene.4. The method for manufacturing an anisotropic conductive adhesive including a gapper of claim 2 ,wherein the polymer particle includes Teflon or polyethylene.5. The method for manufacturing an anisotropic conductive adhesive including a gapper of claim 2 ,wherein the inorganic particle includes at least one material selected from the group consisting of alumina, silica, glass, and silicon carbide.6. The method for manufacturing an anisotropic conductive adhesive including a gapper of claim 1 ,wherein in the process of manufacturing the anisotropic conductive adhesive, the gapper is mixed at 2 vol % to 60 vol % relative ...

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Номер записи: 81
11-01-2018 дата публикации

MODULAR ELECTRONICS APPARATUSES AND METHODS

Номер: US20180013082A1
Автор: Allen Mark, LIU Yinglin, MALIK Surama, Rouvala Markku
Принадлежит:

An apparatus comprising: a module; a substrate; and electrolyte between the module and the substrate, wherein an electronic component is formed between the module and the substrate and wherein the electrolyte is configured to function as the electrolyte in the electronic component and also as the adhesive to attach the module to the substrate. 115-. (canceled)16. An apparatus comprising:a module;a substrate; andelectrolyte between the module and the substrate, wherein an electronic component is formed between the module and the substrate and wherein the electrolyte is configured to function as the electrolyte in the electronic component and also as an adhesive to attach the module to the substrate; anda further substrate on the substrate, the further substrate comprising at least one opening, wherein the electrolyte and module are located at least partially in the opening of the further substrate.17. An apparatus as claimed in claim 16 , wherein at least one electrode of the electronic component is located on the module and at least one electrode of the electronic component is located on the substrate.18. An apparatus as claimed in wherein the apparatus comprises routing for the electronic component on the substrate and on the further substrate.19. An apparatus as claimed in claim 16 , wherein the electronic component comprises an electrochemical transistor.20. An apparatus as claimed in wherein the source and drain electrodes of the electrochemical transistor are located on the module and the gate electrode of the electrochemical transistor is located on the substrate or the gate electrode of the electrochemical transistor is located on the module and the source and drain electrodes of the electrochemical transistor are located on the substrate.21. An apparatus as claimed in wherein the module comprises circuitry and the electrochemical transistor is configured to control the circuitry on the module and/or is configured to be used to read out the circuitry on the ...

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Номер записи: 82
03-02-2022 дата публикации

SEPARATION METHOD AND BONDING METHOD FOR ADHEREND

Номер: US20220032600A1
Автор: Akamatsu Kaori, AWANE Ryo, HIRAO Akira, MIZOBATA Kaori
Принадлежит:

A separation method for an adherend according to the present invention allows members to firmly bond to each other by recovery of adhesive force when a predetermined time elapses after a voltage has been applied and can easily separate the adherend by applying the voltage again, and a bonding method for an adherend according to the present invention allows members to firmly bond to each other by recovery of adhesive force when a predetermined time elapses after a voltage has been applied. 1. A separation method for an adherend , comprising:a first voltage application step of applying a voltage to an electrolyte-containing adhesive layer to change an adhesive force so as to generate a potential difference in a thickness direction of the electrolyte-containing adhesive layer in a state where the electrolyte-containing adhesive layer in an adhesive sheet containing at least the electrolyte-containing adhesive layer is allowed to bond to an adherend;a bonding maintenance step of recovering the adhesive force by allowing a predetermined time to elapse in the state where the electrolyte-containing adhesive layer is allowed to bond to the adherend, after the first voltage application step;a second voltage application step of applying a voltage to the electrolyte-containing adhesive layer to change the adhesive force so as to generate a potential difference in the thickness direction of the electrolyte-containing adhesive layer in the state where the electrolyte-containing adhesive layer is allowed to bond to the adherend, after the bonding maintenance step; anda separation step of separating the electrolyte-containing adhesive layer and the adherend.2. The separation method for an adherend according to claim 1 , wherein the second voltage application step and the separation step are performed at the same time.3. The separation method for an adherend according to claim 1 , wherein the separation step is performed after the second voltage application step.4. The separation ...

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Номер записи: 83
19-01-2017 дата публикации

Adhesive composition containing ionic antistatic agent

Номер: US20170015878A1
Автор: Han Young Choi
Принадлежит: Dongwoo Fine Chem Co Ltd

An adhesive composition includes an acryl copolymer, a cross-linking agent, and an ionic antistatic agent represented by Formula 1, thereby exhibiting excellent antistatic property, as well as, significantly improved durability, maintaining excellent adhesiveness under severe conditions such as high temperature and high humidity atmospheres, and securing sufficient antistatic property even if used in a small amount.

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Номер записи: 84
16-01-2020 дата публикации

BIO-ELECTRODE COMPOSITION, BIO-ELECTRODE, AND METHOD FOR MANUFACTURING A BIO-ELECTRODE

Номер: US20200015699A1
Автор: Hatakeyama Jun, IWABUCHI Motoaki, KURODA Yasuyoshi
Принадлежит: SHIN-ETSU CHEMICAL CO., LTD.

The present invention provides a bio-electrode composition including a silsesquioxane bonded to an N-carbonyl sulfonamide salt, wherein the N-carbonyl sulfonamide salt is shown by the following general formula (1): 3. The bio-electrode composition according to claim 1 , further comprising an adhesive resin as a component (B) in addition to the silsesquioxane bonded to an N-carbonyl sulfonamide salt as a component (A).4. The bio-electrode composition according to claim 2 , further comprising an adhesive resin as a component (B) in addition to the silsesquioxane bonded to an N-carbonyl sulfonamide salt as a component (A).5. The bio-electrode composition according to claim 3 , wherein the component (B) is one or more resins selected from a silicone resin claim 3 , a (meth)acrylate resin claim 3 , and a urethane resin.6. The bio-electrode composition according to claim 4 , wherein the component (B) is one or more resins selected from a silicone resin claim 4 , a (meth)acrylate resin claim 4 , and a urethane resin.7. The bio-electrode composition according to claim 3 , wherein the component (B) contains diorganosiloxane having an alkenyl group claim 3 , and organohydrogenpolysiloxane having an SiH group.8. The bio-electrode composition according to claim 5 , wherein the component (B) contains diorganosiloxane having an alkenyl group claim 5 , and organohydrogenpolysiloxane having an SiH group.9. The bio-electrode composition according to claim 7 , wherein the component (B) further contains a silicone resin having an RSiOunit (wherein claim 7 , R represents a substituted or unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms claim 7 , and “x” is a number in a range of 2.5 to 3.5) and an SiOunit.10. The bio-electrode composition according to claim 8 , wherein the component (B) further contains a silicone resin having an RSiOunit (wherein claim 8 , R represents a substituted or unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms claim 8 ...

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Номер записи: 85
21-01-2016 дата публикации

ADHESIVE WITH TUNABLE POROSITY AND METHODS TO SUPPORT TEMPORARY BONDING APPLICATIONS

Номер: US20160017184A1
Автор: Moore John Cleaon, PETTIT Jared
Принадлежит:

Compositions and methods are described for a temporary adhesive used to affix a work unit onto a carrier substrate whereby its porosity is tuned by choosing and adjusting the polymeric resin and filler components to provide sufficient adhesion to support a manufacturing process, and upon completion, there is advanced penetration of a liquid into the interfacial bond causing release of the work unit without harm. The temporary adhesive provides a tunable porosity that is dependent upon the mathematical calculation of the weight basis ratio of filler to binder, that is preferably greater than 0.4, more preferably greater than 1.0, and most preferably greater than 2.0. The temporary adhesive may be applied and cured in a variety of ways that meet the needs of the form of the work unit and objectives of the manufacturing process. The invention provides benefits of flexibility and reduced cost when establishing practices to handle difficult work units in the manufacture of semiconductors and flat panel displays.

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Номер записи: 86
21-01-2016 дата публикации

Method for producing a bonded bow contact for current collectors

Номер: US20160017190A1
Автор: Andreas Schulz, Bernd Kinast
Принадлежит: PanTrac GmbH

The invention relates to a method for producing a connection between a carbon strip and a metal mounting of a bow contact for current collectors by means of an adhesive containing electrically conductive particles. The method is characterised in that the adhesive contains 40 to 50 parts by weight of a first adhesive component on the basis of a phenolic resin, 5 to 20 parts by weight of a second adhesive component on the basis of an epoxy resin, and 40 to 50 parts by weight of conductive particles.

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Номер записи: 87
21-01-2016 дата публикации

PRESSURE-SENSITIVE ADHESIVE LAYER, PRESSURE-SENSITIVE ADHESIVE TAPE, AND DOUBLE-SIDED PRESSURE-SENSITIVE ADHESIVE TAPE

Номер: US20160017193A1
Автор: Ishiguro Shigeki, Tanaka Akiko, Yoshie Satomi
Принадлежит: NITTO DENKO CORPORATION

The purpose of the present invention is to provide: a polyester-based pressure-sensitive adhesive layer, for which a pressure-sensitive adhesive composition (pressure-sensitive adhesive solution) without any acrylic pressure-sensitive adhesive or the like which needs a large amount of an organic solvent and is difficult to apply thickly; to provide a polyester-based pressure-sensitive adhesive layer that is friendly to the global environment, can be applied thickly, has a high level of cost effectiveness and workability, and also has a high level of adhesion, retention, and repulsion resistance; and to provide a pressure-sensitive adhesive tape or double-sided pressure-sensitive adhesive tape having such a pressure-sensitive adhesive layer. The invention is directed to a polyester-based pressure-sensitive adhesive layer including a product made from a polyester-based pressure-sensitive adhesive composition including: a polyester obtained by polycondensation of at least a dicarboxylic acid component and a diol component; and a tackifier, the polyester-based pressure-sensitive adhesive layer having a gel fraction of 15% by weight or more to less than 40% by weight.

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Номер записи: 88
03-02-2022 дата публикации

ELECTROPHOTOGRAPHIC DEVELOPER SET COMPRISING TONER AND POWDER ADHESIVE, AND METHOD FOR PRODUCING BONDED PRODUCT

Номер: US20220035262A1
Автор: Matsuda Kohei, Nishikawa Koji, Nishizawa Yuki, Shimano Tsutomu, Terui Yuhei, Yamashita Shohei
Принадлежит:

An electrophotographic developer set comprising a toner, and a powder adhesive, wherein the powder adhesive comprises a crystalline polyester resin, and a thermoplastic resin other than the crystalline polyester resin; the amount of the crystalline polyester resin in the powder adhesive is 21% by mass or more; the melting point of the crystalline polyester resin is 55° C. to 100° C.; in a viscoelasticity measurement, where Gt′(100) denotes a storage elastic modulus of the toner at 100° C. and Gb′(100) denotes a storage elastic modulus of the powder adhesive at 100° C., Gb′(100) is 1.0×10Pa or less and Gt′(100)/Gb′(100) is 1.2 or more. 2. The electrophotographic developer set according to claim 1 , wherein the Gt′(100)/Gb′(100) is 2.0 to 30.0.3. The electrophotographic developer set according to claim 1 , whereinin the viscoelasticity measurement,{'sup': '4', 'where Tb denotes the temperature at which the storage elastic modulus Gb′ of the powder adhesive is 1.0×10Pa, and'}{'sup': '4', 'Tt denotes the temperature at which the storage elastic modulus Gt′ of the toner is 1.0×10Pa,'}Tt−Tb is 10° C. or higher.4. The electrophotographic developer set according to claim 1 , whereinin the viscoelasticity measurement of the powder adhesive,the maximum value of the ratio (tan δ) of a loss elastic modulus G″ of the powder adhesive to the storage elastic modulus G′ of the powder adhesive in the range of 55° C. to 100° C. is less than 3.0.5. The electrophotographic developer set according to claim 1 , whereinthe crystalline polyester resin comprised in the powder adhesive is a polycondensation polymer of an aliphatic diol having 2 to 12 carbon atoms and an aliphatic dicarboxylic acid having 2 to 12 carbon atoms.6. The electrophotographic developer set according to claim 1 , whereinthe thermoplastic resin comprised in the powder adhesive comprises a non-crystalline polyester resin as a main component.7. The electrophotographic developer set according to claim 1 , whereinthe ...

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Номер записи: 89
17-01-2019 дата публикации

ELECTRICALLY CONDUCTIVE ADHESIVE FILM AND DICING-DIE BONDING FILM USING THE SAME

Номер: US20190016928A1
Автор: KIRIKAE Noriyuki, MIHARA Naoaki, Sugiyama Jirou
Принадлежит: FURUKAWA ELECTRIC CO., LTD.

The electrically conductive adhesive film comprises a metal particle (P), a resin (M) and a prescribed sulfide compound (A), the resin (M) comprises a thermosetting resin (M1), and the metal particle (P) has an average particle size (d50) of 20 μm or less and comprises 10% by mass or more of a first metal particle (P1) having a fractal dimension of 1.1 or more when viewed in a projection drawing in a primary particle state. 2. The electrically conductive adhesive film according to claim 1 , wherein the first metal particle (P1) is a dendritic metal powder.3. The electrically conductive adhesive film according to claim 1 , wherein claim 1 , in the general formula (1) claim 1 , each K independently includes claim 1 , in its moiety claim 1 , one or more group selected from a vinyl group claim 1 , an acrylic group claim 1 , a methacrylic group claim 1 , a maleic acid ester group claim 1 , a maleic acid amide group claim 1 , a maleic acid imide group claim 1 , a primary amino group claim 1 , a secondary amino group claim 1 , a thiol group claim 1 , a hydrosilyl group claim 1 , a hydroboron group claim 1 , a phenolic hydroxyl group and an epoxy group.4. The electrically conductive adhesive film according to claim 1 , wherein the metal particle (P) further comprises a second metal particle (P2) made of a spherical metal powder.5. The electrically conductive adhesive film according to claim 4 , wherein the second metal particle (P2) has an average particle size (d50) of less than 7 μm.6. The electrically conductive adhesive film according to claim 4 , wherein the second metal particle (P2) comprises a metal particle made of tin or a tin-containing alloy.7. The electrically conductive adhesive film according to claim 1 , wherein a loss tangent (tan δ) defined by a ratio (G″/G′) of a loss elastic modulus (G″) to a storage elastic modulus (G′) at 60° C. and 1 Hz in a B-stage state is 1.4 or higher.8. The electrically conductive adhesive film according to claim 1 , wherein the ...

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Номер записи: 90
17-01-2019 дата публикации

ELECTRICALLY CONDUCTIVE ADHESIVE FILM AND DICING-DIE BONDING FILM USING THE SAME

Номер: US20190016929A1
Автор: KIRIKAE Noriyuki, MIHARA Naoaki, Sugiyama Jirou
Принадлежит: FURUKAWA ELECTRIC CO., LTD.

The electrically conductive adhesive film comprises a metal particle (Q), a resin (M), and a prescribed organophosphorus compound (A), the resin (M) comprises a thermosetting resin (M1), and the metal particle (Q) has an average particle size (d50) of 20 μm or less and comprise 10% by mass or more of a first metal particle (Q1) having a fractal dimension of 1.1 or more when viewed in a projection drawing in a primary particle state. 2. The electrically conductive adhesive film according to claim 1 , wherein the first metal particle (Q1) is a dendritic metal powder.3. The electrically conductive adhesive film according to claim 1 , wherein the organophosphorus compound (A) is at least one compound selected from alkyl phosphine claim 1 , aryl phosphine and organic phosphorous acid ester.4. The electrically conductive adhesive film according to claim 1 , wherein claim 1 , in the general formula (1) claim 1 , each R independently includes claim 1 , in its moiety claim 1 , one or more group selected from a vinyl group claim 1 , an acrylic group claim 1 , a methacrylic group claim 1 , a maleic acid ester group claim 1 , a maleic acid amide group claim 1 , a maleic acid imide group claim 1 , a primary amino group claim 1 , a secondary amino group claim 1 , a thiol group claim 1 , a hydrosilyl group claim 1 , a hydroboron group claim 1 , a phenolic hydroxyl group and an epoxy group.5. The electrically conductive adhesive film according to claim 1 , wherein the metal particle (Q) further comprises a second metal particle (Q2) made of a spherical metal powder.6. The electrically conductive adhesive film according to claim 5 , wherein the second metal particle (Q2) has an average particle size (d50) of less than 7 μm.7. The electrically conductive adhesive film according to claim 5 , wherein the second metal particle (Q2) comprises a metal particle made of tin or a tin-containing alloy.8. The electrically conductive adhesive film according to claim 1 , wherein a loss tangent ( ...

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Номер записи: 91
17-01-2019 дата публикации

ADHESIVE COMPOSITION

Номер: US20190016930A1
Автор: Aoki Masaharu, ISHIMATSU Tomoyuki, MATSUMURA Takashi, Namiki Hidetsugu
Принадлежит: DEXERIALS CORPORATION

An adhesive composition having excellent life properties is provided. This adhesive composition achieves excellent life properties by containing an epoxy compound, an aluminum chelating agent, and a hindered amine compound. This is presumably because the aluminum chelating agent stably exists due to the coordination of the nitrogen atom of the hindered amine compound with aluminum of the aluminum chelating agent. 1. An adhesive composition comprising an epoxy compound , an aluminum chelating agent , and a hindered amine compound.2. The adhesive composition according to claim 1 , wherein the aluminum chelating agent is an aluminum chelating latent curing agent held in a porous resin obtained by interfacial polymerization of a polyfunctional isocyanate compound.3. The adhesive composition according to claim 1 , wherein the aluminum chelating agent is an aluminum chelating latent curing agent that is held in a porous resin obtained by interfacial polymerization of a polyfunctional isocyanate compound and simultaneous radical polymerization of divinylbenzene.4. The adhesive composition according to claim 2 , wherein the content of the hindered amine compound is 0.05 to 15 parts by mass with respect to 100 parts by mass of the total of the epoxy compound and the aluminum chelating latent curing agent.5. The adhesive composition according to claim 2 , wherein the aluminum chelating latent curing agent is obtained by impregnating the porous resin with a silanol compound.6. The adhesive composition according to claim 2 , wherein the aluminum chelating latent curing agent is obtained by impregnating the porous resin with a silanol compound.7. The adhesive composition according to claim 1 , wherein an exothermic onset temperature measured at a heating rate of 10° C./min by a differential scanning calorimetry is 80 to 90° C.8. The adhesive composition according to claim 2 , wherein the exothermic onset temperature measured at a heating rate of 10° C./min by a differential ...

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Номер записи: 92
16-01-2020 дата публикации

HIGH PERFORMANCE PHOTOCURABLE OPTICALLY CLEAR ADHESIVE

Номер: US20200017720A1
Автор: Klun Thomas P., Kowitz David A., Liu Lan Hong, Sherman Audrey A., Xia Jianhui
Принадлежит:

The present invention is an optically clear, curable adhesive including a polyvinylbutyral, a polyurethane (meth)acrylate, a (meth)acrylate monomer, and a photoinitiator. The polyvinylbutyral has a dynamic viscosity of between about 9 and about 13 mPA·s and a polyvinyl alcohol weight percent of less than about 18%. The polyurethane (meth)acrylate includes the reaction product of a diol, at least one diisocyanate, and a hydroxyfunctional (meth)acrylate or an isocyanatofunctional (meth)acrylate. When the optically clear, curable adhesive is placed between two transparent substrates and made into a laminate, the laminate has a haze of less than about 6%, a transmission of greater than about 88%, and an optical clarity of greater than about 98% when cured. The optically clear, curable adhesive also has a peel adhesion of at least about 100 g/cm based on ASTM 3330 when cured. 1. An optically clear , curable adhesive comprising:a polyvinylbutyral having a dynamic viscosity of between about 9 and about 30 mPA·s and having a polyvinyl alcohol weight percent of between about 14% and about 21%; a diol;', 'at least one diisocyanate; and', 'a hydroxyfunctional (meth)acrylate or an isocyanatofunctional (meth)acrylate;, 'a polyurethane (meth)acrylate comprising the reaction product ofa (meth)acrylate monomer; anda photoinitiator;wherein when the optically clear, curable adhesive is placed between two transparent substrates and made into a laminate, the laminate has a haze of less than about 6%, a transmission of greater than about 88% and optical clarity of greater than about 98% when cured, andwherein the optically clear, curable adhesive has a peel adhesion of at least about 100 g/cm based on ASTM 3330 when cured.2. The optically clear claim 1 , curable adhesive of claim 1 , wherein the diol is selected from one of a poly(tetramethylene oxide) diol having a number average molecular weight of about 2000 g/mol or less claim 1 , a poly(propylene oxide) diol having a number average ...

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Номер записи: 93
16-01-2020 дата публикации

Double-Sided Pressure-Sensitive Adhesive Sheet, Laminate Comprising Component Member for Image Display Device, Kit for Laminate Formation, and Use of Double-Sided Pressure-Sensitive Adhesive Sheet

Номер: US20200017722A1
Автор: Miara Naoya, Uchida Takahisa, Yoshikawa Hidejiro
Принадлежит: MITSUBISHI CHEMICAL CORPORATION

To provide a double-sided pressure-sensitive adhesive sheet having high flexing resistance that does not suffer flexure and exfoliation in a flexing test that is closer to the actual use environment. A double-sided pressure-sensitive adhesive sheet having no substrate, containing a pressure-sensitive adhesive composition containing a (meth)acrylate ester (co)polymer (A), and having a glass transition temperature (Tg) defined by a Tan δ peak temperature of dynamic viscoelasticity in a range of −50° C. to −20° C., a storage elastic modulus G′ at a frequency of 1 Hz and a temperature 100° C. in a range of 2.0×10to 3.0×10Pa, and a thickness of 10 μm or more and 150 μm or less. 1. A laminate comprising a flexible component member for constituting an image display device capable of being flexed or curved , and a double-sided pressure-sensitive adhesive sheet having no substrate ,{'sup': 3', '4, 'the double-sided pressure-sensitive adhesive sheet containing a pressure-sensitive adhesive composition containing a (meth)acrylate ester (co)polymer (A), and having a thickness of 10 μm or more and 150 μm or less, a glass transition temperature (Tg) defined by a Tan δ peak temperature of dynamic viscoelasticity in a range of −50° C. to −20° C., and a storage elastic modulus G′ at a frequency of 1 Hz and a temperature of 100° C. in a range of 2.0×10to 3.0×10Pa.'}2. The laminate according to claim 1 , wherein when an exponential curve is drawn to pass through two points of a storage elastic modulus G′ (100) at a frequency of 1 Hz and a temperature of 100° C. and a storage elastic modulus G′(150) at a frequency of 1 Hz and a temperature of 150° C. in a storage elastic modulus-temperature graph plotting a temperature as the abscissa axis and a logarithm of a storage shear elastic modulus (G′) as the ordinate axis for the double-sided pressure-sensitive adhesive sheet claim 1 , the double-sided pressure-sensitive adhesive sheet has a natural logarithm of a base of the exponential ...

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Номер записи: 94
21-01-2021 дата публикации

ANTIMICROBIAL HEAT SEAL COATING COMPOSITIONS

Номер: US20210017401A1
Автор: Schmidt Thorsten
Принадлежит:

Antimicrobial heat seal coating compositions are disclosed comprising (A) a copolymer dispersed in a solvent, the copolymer comprising at least one selected from the group consisting of a (meth)acrylate ester (co)polymer, an olefin (co)polymers, a copolymer comprising (meth)acrylic ester units and olefin units and (B) an antimicrobial agent. Food packaging articles are also disclosed, the food packaging articles comprising the disclosed heat seal coatings. When applied in a food packaging application, such as a dairy food packaging application, the disclosed coatings provide for reduced work exposer to hydrogen peroxide and improved packaging reliability. 1. An antimicrobial heat seal coating composition , comprising:(A) a copolymer dispersed in a solvent, the copolymer comprising at least one selected from the group consisting of a (meth)acrylate ester (co)polymer, an olefin (co)polymers, a copolymer comprising (meth)acrylic ester units and olefin units; and(B) an antimicrobial agent.2. The antimicrobial heat seal coating composition of claim 1 , wherein the copolymer dispersed in solvent has a glass transition temperature of from −60 to −30° C. as measured by Differential Scanning calorimetry according to ISO 11357-1.3. The antimicrobial heat seal coating composition of claim 1 , wherein the antimicrobial agent is a substance having a negative impact on the growth rate of at least one of bacteria claim 1 , fungi claim 1 , and yeast.4. The antimicrobial heat seal coating composition of claim 1 , wherein the antimicrobial agent is selected from the group consisting of essential oil claim 1 , sulfur dioxide claim 1 , chlorine dioxide claim 1 , chitosan claim 1 , silver-loaded zeolite claim 1 , nisin claim 1 , sorbic acid claim 1 , lactic acid claim 1 , benzoic acid claim 1 , allylisothiocyanate claim 1 , and combinations thereof.5. The antimicrobial heat seal coating composition of claim 1 , further comprising an antioxidant.6. The antimicrobial heat seal coating ...

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Номер записи: 95
21-01-2021 дата публикации

ADHESIVE FILM

Номер: US20210017427A1
Автор: FUKUI Takahiro, IWAMOTO Shinnosuke, SHIRAKAWA Tetsuyuki
Принадлежит:

One aspect of the present invention is an adhesive film comprising: a first adhesive layer; a metal layer; and a second adhesive layer in this order, wherein each of the first adhesive layer and the second adhesive layer comprises: a first conductive particle being a dendritic conductive particle; and a second conductive particle being a conductive particle other than the first conductive particle and the second conductive particle comprising a non-conductive core and a conductive layer provided on the core. 1. An adhesive film comprising: a first adhesive layer; a metal layer; and a second adhesive layer in this order , a first conductive particle being a dendritic conductive particle; and', 'a second conductive particle being a conductive particle other than the first conductive particle and the second conductive particle comprising a non-conductive core and a conductive layer provided on the core., 'wherein each of the first adhesive layer and the second adhesive layer comprises2. The adhesive film according to claim 1 , wherein the conductive layer comprises at least one selected from the group consisting of gold claim 1 , nickel claim 1 , and palladium.3. The adhesive film according to claim 1 , wherein the metal layer has a thickness of 25 μm or more.4. The adhesive film according to claim 1 , wherein the first adhesive layer has a thickness of 30 μm or less.5. The adhesive film according to claim 1 , wherein the second adhesive layer has a thickness of 30 μm or less. The present invention relates to an adhesive film.In recent years, various adhesives have been used in the fields of semiconductors, liquid crystal displays, and the like for fixing electronic components, connecting circuits, and the like. In these applications, higher integration density and higher fineness of electronic components, circuits, and the like are progressed, and adhesives are required to have a higher level of performance.An adhesive having conductive particles dispersed in the ...

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Номер записи: 96
21-01-2021 дата публикации

ELECTROCONDUCTIVE ADHESIVE COMPOSITION

Номер: US20210017428A1
Автор: ABE Shintaroh, Kondo Takeshi, WATANABE Maki
Принадлежит: TANAKA KIKINZHOKU KOGYO K.K.

The purpose of the present invention is to provide an electroconductive adhesive composition having excellent thermal conductivity and migration resistance. The present invention relates to an electroconductive adhesive composition containing an electroconductive filler (A) including silver powder (a1) and silver-coated copper powder (a2), and a binder composition (B), wherein the electroconductive adhesive composition contains 3-65% by mass of the silver-coated copper powder (a2) with respect to the entire amount of the electroconductive filler (A), and contains 95-99.95% by mass of the electroconductive filer (A) with respect to the total quantity of nonvolatile components in the electroconductive adhesive composition. 1. An electrically conductive adhesive composition comprising an electrically conductive filler (A) containing a silver powder (a1) and a silver-coated copper powder (a2) , and a binder composition (B) , wherein the electrically conductive adhesive composition contains from 3 to 65 mass % of the silver-coated copper powder (a2) relative to the overall amount of the electrically conductive filler (A) , andfrom 95 to 99.95 mass % of the electrically conductive filler (A) relative to the total amount of nonvolatile components in the electrically conductive adhesive composition.2. The electrically conductive adhesive composition according to claim 1 , wherein the silver powder (a1) contains a silver powder having an average particle diameter of 0.5 to 20 μm and a silver powder having an average particle diameter of 10 to 200 nm.3. The electrically conductive adhesive composition according to claim 2 , wherein the electrically conductive adhesive composition contains from 5 to 50 mass % of the silver powder having an average particle diameter of 10 to 200 nm relative to the overall amount of the electrically conductive filler (A).4. A cured electrically conductive adhesive obtained by curing the electrically conductive adhesive composition according to . ...

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Номер записи: 97
17-04-2014 дата публикации

LIGHT-REFLECTIVE CONDUCTIVE PARTICLE, ANISOTROPIC CONDUCTIVE ADHESIVE AND LIGHT-EMITTING DEVICE

Номер: US20140103266A1
Автор: Kanisawa Shiyuki, Namiki Hidetsugu, Umakoshi Hideaki
Принадлежит: SONY CHEMICAL & INFORMATION DEVICE CORPORATION

A light-reflective conductive particle for an anisotropic conductive adhesive used for anisotropic conductive connection of a light-emitting element to a wiring board includes a core particle coated with a metal material and a light-reflecting layer formed from light-reflective inorganic particles having a refractive index of 1.52 or more on a surface of the core particle. Examples of the light-reflective inorganic particles having a refractive index of 1.52 or more include titanium oxide particles, zinc oxide particles, or aluminum oxide particles. 1. A light-reflective conductive particle for an anisotropic conductive adhesive used for anisotropic conductive connection of a light-emitting element to a wiring board , comprising a core particle coated with a metal material and a light-reflecting layer formed from light-reflective inorganic particles having a refractive index of 1.52 or more on a surface of the core particle.2. The light-reflective conductive particle according to claim 1 , wherein the metal material with which the core particle is coated is gold claim 1 , nickel claim 1 , or copper.3. The light-reflective conductive particle according to claim 1 , wherein the core particle is a gold claim 1 , nickel claim 1 , or copper particle.4. The light-reflective conductive particle according to claim 1 , wherein the core particle is formed by coating gold claim 1 , nickel or copper on a resin particle.5. The light-reflective conductive particle according to claim 1 , wherein the core particle has a particle size of 1 to 20 μm claim 1 , and the light-reflecting layer has a layer thickness of 0.5 to 50% of the particle size of the core particle.6. The light-reflective conductive particle according to claim 1 , wherein the light-reflective inorganic particle is at least one type of inorganic particles selected from titanium oxide particles claim 1 , zinc oxide particles claim 1 , and aluminum oxide particles.7. The light-reflective conductive particle according ...

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Номер записи: 98
16-01-2020 дата публикации

Liquid electrophotographic adhesive composition

Номер: US20200019078A1
Автор: Faina Kogan, Gleb Romantcov, Inna Tzomik, Ziv Gilan
Принадлежит: HP Indigo BV

Herein is described a liquid electrophotographic adhesive composition comprising a thermoplastic resin, a moisture activatable adhesive, and a liquid carrier.

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Номер записи: 99
17-04-2014 дата публикации

ANISOTROPIC CONDUCTIVE FILM AND METHOD FOR MANUFACTURING THE SAME

Номер: US20140106160A1
Автор: SHIEH PEI-RONG, WU CHANG-CHIN
Принадлежит: HON HAI PRECISION INDUSTRY CO., LTD.

An anisotropic conductive film includes a base board and an insulation adhesive layer coated on a side surface of the base board. The insulation adhesive layer includes a plurality of conductive particles dispersed in the insulation adhesive layer. Each of the plurality of conductive particles includes a spherical base portion, a conductive film formed on the spherical base portion, and an insulation layer with ceramic materials formed on the conductive film. When the conductive particle is being pressed, the insulation layer is capable of being peeled to partly expose the conductive layer. A method for manufacturing the anisotropic conductive film is also provided. 1. An anisotropic conductive film (ACF) , comprising:a base board, andan insulation adhesive layer coated on a side surface of the base board, the insulation adhesive layer having a plurality of conductive particles dispersed in it;wherein the conductive particles comprises a spherical base portion, a conductive layer formed on the spherical base portion, and an insulation layer formed on the conductive layer;wherein material of the insulation layer comprises ceramic materials, when the conductive particle is being pressed, the insulation layer is capable of being peeled to partly expose the conductive layer.2. The ACF as claimed in claim 1 , wherein the ceramic materials is SiO2 claim 1 , TiO2 claim 1 , Si3N4 or ZrO2.3. The ACF as claimed in claim 1 , wherein the insulation layer further comprises insulating resin.4. The ACF as claimed in claim 1 , wherein the insulation layer is a ceramic layer claim 1 , and the volume of the ceramic layer is 0.1 to 70 percent of the spherical base portion.5. A method of manufacturing an anisotropic conductive film (ACF) claim 1 , comprising:providing a main board;providing a plurality of spherical base portion;forming a conductive layer on the spherical base portion;forming an insulation layer comprising ceramic materials on the conductive layer to form conductive ...

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Номер записи: 100