Thermische Legierungsschmelzsicherung und Draht für ein Sicherungselement

Inner alloy anode used for aluminum electrolysis and preparation method therefor

Inner alloy anode used for aluminum electrolysis and preparation method therefor

Inner alloy anode used for aluminum electrolysis and preparation method therefor

PALLADIUM-DOMINATED DENTAL ALLOY

The invention relates to a palladium-dominated dental alloy, in particular a ceramic-bonding dental alloy for the manufacture of dental prostheses such as crowns, bridges, inlays, or onlays, containing at least gold, palladium, and silver, as well as a grain-growth inhibitor in the form of ruthenium. In order to be able to achieve a fine-grained separation without the formation of agglomerates to obtain a dental alloy with high mechanical stability and excellent polishing characteristics, it is proposed that the dental alloy contains, in addition to ruthenium as grain-growth inhibitor, at least one element of the group comprising tantalum, niobium, yttrium, zirconium, chromium, molybdenum as grain-refinement control element, with the remainder being gold, palladium, and silver.

MATERIAU POUR LA CONVERSION DIRECTE A HAUT RENDEMENT D'ENERGIE THERMO-ELECTRIQUE, PROCEDE DE FABRICATION ET CONVERTISSEUR COMPORTANT UN TEL MATERIAU.

Amalgam of E glass metals.

Il «vetrometallico» è un materiale innovativo che nasce dall’amalgama di vetro e metalli; è grazie alla presenza dei metalli che il vetro acquista flessibilità e resistenza che fanno di un materiale fragile un materiale particolarmente resistente e versatile. I metalli associati al vetro sono il piombo e l’argento, in proporzioni variabili a seconda della necessità d’impiego. L’assenza di esposizione diretta all’aria data dalla presenza del vetro nella fusione, fa si che i metalli conservino il loro colore e la loro brillantezza, senza incorrere in fenomeni ossidativi.

Resistant, malleable and long-lasting alloy.

I metalli che compongono questo particolare materiale sono piombo, zinco ed alluminio addizionati da ossido di potassio nelle percentuali; – 30% di Piombo; – 40% di Zinco; – 20% di Alluminio; – 10% di Ossido di Potassio. I campi d’applicazione sono vari, considerando le sue caratteristiche ed il pregio estetico raggiungibile, è possibile, infatti, realizzare manufatti dai tratti leggeri pur potendo contare su un elevata robustezza.

ANODE OF INERT ALLOY FOR ELECTROLYTIC PRODUCTION OF ALUMINUM AND METHOD OF ITS PREPARATION

Manufacturing method of copper-cobalt based diamond knife teeth

ALLIAGE ARGENT-ETAIN-CUIVRE-PALLADIUM ET SON AMALGAME

LE NOUVEL ALLIAGE DENTAIRE SELON L'INVENTION CONSISTE ESSENTIELLEMENT EN 30 A 70 EN POIDS D'ARGENT, 15 A 37 EN POIDS D'ETAIN, 0,05 A 0,95 EN POIDS DE PALLADIUM, JUSQU'A 4 EN POIDS DE ZINC, JUSQU'A 6 EN POIDS D'INDIUM, JUSQU'A 5 EN POIDS DE MANGANESE, JUSQU'A 2 EN POIDS DE CADMIUM, JUSQU'A 2 EN POIDS D'ALUMINIUM, JUSQU'A 5 EN POIDS DE GALLIUM, JUSQU'A 2 EN POIDS DE RUTHENIUM, JUSQU'A 3 EN POIDS DE MERCURE, LE RESTE ETANT ESSENTIELLEMENT DU CUIVRE, LEDIT ALLIAGE CONTENANT AU MOINS 1 DE CUIVRE. APPLICATION: FABRICATION D'AMALGAMES POUR PROTHESES.

전기 디바이스용 부극, 및 이것을 사용한 전기 디바이스

... 본 발명의 과제는, 높은 사이클 특성을 유지하면서, 또한 초기 용량도 높고 밸런스 좋은 특성을 나타내는 Li 이온 2차 전지 등의 전기 디바이스용 부극을 제공하는 것이다. 집전체와, 상기 집전체의 표면에 배치된 부극 활물질, 도전 조제 및 바인더를 포함하는 전극층을 갖는 전기 디바이스용 부극이며, 상기 부극 활물질이, 하기 식(1) : [상기 식(1)에 있어서, M은, Al, V, C 및 이들의 조합으로 이루어지는 군으로부터 선택되는 적어도 1개의 금속이고, A는, 불가피 불순물이고, x, y, z 및 a는, 질량％의 값을 나타내고, 이때, 0＜x＜100, 0＜y＜100, 0＜z＜100 및 0≤a＜0.5이고, x＋y＋z＋a＝100임.] 로 나타내어지는 합금을 포함하고, 상기 바인더가, 1.00㎬ 초과 7.40㎬ 미만의 E 탄성률을 갖는 수지를 포함하는, 전기 디바이스용 부극.

DEGRADABLE WHIPSTOCK APPARATUS AND METHODS OF USE

Whipstocks and deflectors comprising a degradable composition, and methods of using same are described. In one embodiment the degradable composition consists essentially of one or more reactive metals in major proportion, and one or more alloying elements in minor proportion, with the provisos that the composition is high- strength, controllably reactive, and degradable under defined conditions. Methods of using degradable whipstocks in oilfield operations are also described.

SINTERED METAL FRICTION MATERIAL

The present invention provides a sintered metal friction material that has excellent wear resistance, heat resistance even at high load and has a higher friction coefficient while maintaining a friction coefficient and wear resistance that are hard to decrease, and has a reduced content of copper of less than 5 mass %. There is provided a sintered metal friction material characterized in that the sintered metal friction material comprises a sintered material of a friction material composition, the friction material composition comprises matrix metals and a friction modifier, the matrix metals comprise following 20 to 40 mass % of iron powder, 20 to 40 mass % of nickel powder, 0.5 to 10 mass % of zinc powder, 0.5 to 5 mass, of tin powder, 0.5 to 4 mass % of copper powder and 0.5 to 5 mass % of sintering assist powder.

An amorphous alloy and a preparation method thereof

In one aspect, an amorphous alloy comprises Cu, Zr, Be and M. M is at least one element selected from a group consisting of Al, Sn, Si, and transition metals, excluding Cu and Zr. In another aspect, an amorphous alloy comprises Cu, Zr, RE and M. RE is at least one element selected from the Rare-Earth Group, M is at least one element selected from a group consisting of Al, Sn, Si, and transition metals, excluding Cu, Zr and RE. In yet another aspect, a method for preparing an amorphous alloy comprises melting a raw material comprising Cu, Zr, Be, and M to form an alloy. M is at least one element selected from a group consisting of Al, Sn, Si, and transition metals, excluding Cu and Zr.

車両ガラス用無鉛ハンダ合金

CATALYST FOR SYNTHETIZING LOW TEMPERATURE METHANOL*ITS MANUFACTURE AND MANUFACTURE OF METHANOL

Антифрикционный сплав на основе цинка-олова-алюминия

Изобретение относится к области металлургии, в частности к антифрикционному сплаву на основе цинка-олова–алюминия, и может быть использовано при изготовлении взрывозащищенной продукции различного назначения. Антифрикционный сплав на основе цинка-олова–алюминия содержит, мас. %: олово - 18,0-20,3; алюминий - 10,5-12,1; медь - 3,8-5,6; кремний - 0, 05-0,075; железо - 0,01-0,5; свинец - 0,01 - 0,02; кадмий -0,012-0,16; цинк – остальное. Сплав характеризуется высокими значениями прочности, относительного удлинения, твердости, а также низкой опасностью пожара и взрыва. 8 ил., 5 пр.

СПОСОБ ПОЛУЧЕНИЯ ТЕРМОЭЛЕКТРИЧЕСКОГО ПОЛУПРОВОДНИКОВОГО СПЛАВА, МОДУЛЬ ТЕРМОЭЛЕКТРИЧЕСКОГО ПРЕОБРАЗОВАНИЯ И ТЕРМОЭЛЕКТРИЧЕСКОЕ УСТРОЙСТВО ГЕНЕРАЦИИ ЭЛЕКТРОЭНЕРГИИ

... 1. Способ получения гейслерова сплава, включающий в себя отверждение закалкой расплавленного сплава при скорости охлаждения от 1·10до 1·10°C/с с получением гейслерова сплава, представленного формулой: ABC (где каждый из A и B является по меньшей мере одним членом, выбранным из переходных металлов, таких как Fe, Co, Ni, Ti, V, Cr, Zr, Hf, Nb, Mo, Ta и W, а C является по меньшей мере одним членом, выбранным из элементов группы 13 или 14, таких как Al, Ga, In, Si, Ge и Sn).2. Способ получения полугейслерова сплава, включающий в себя отверждение закалкой расплавленного сплава при скорости охлаждения от 1·10до 1·10°C/с с получением гейслерова сплава, представленного формулой: ABC (где каждый из A и B является по меньшей мере одним членом, выбранным из переходных металлов, таких как Fe, Co, Ni, Ti, V, Cr, Zr, Hf, Nb, Mo, Ta и W, а C является по меньшей мере одним членом, выбранным из элементов группы 13 или 14, таких как Al, Ga, In, Si, Ge и Sn).3. Сплав, полученный способом получения по п.1 ...

СПЛАВ ДЛЯ СВАРКИ С ПРИПОЕМ

... 1. Сплав для сварки с припоем, содержащий 18-29 мас.% серебра, 12-30 мас.% цинка, 0,2-5 мас.% марганца, 0,001-5 мас.% никеля, 0,001-5 мас.% индия, необязательно 0,001-6 мас.% олова, 0,001-4 мас.% железа, 0,001-3 мас.% кремния, 0,001-2 мас.% хрома, 0,001-2 мас.% фосфора и необязательно другие элементы в количестве меньше 1 мас.%, причем оставшийся процент для достижения 100 мас.% составляет медь.2. Сплав по п. 1, отличающийся тем, что содержит по меньшей мере один из следующих элементов: 0,001-6 мас.% олова, 0,001-4 мас.% железа, 0,001-3 мас.% кремния, 0,001-2 мас.% хрома, 0,001-2 мас.% фосфора.3. Сплав по п. 1, отличающийся тем, что, по существу, состоит на 18-29 мас.% из серебра, на 12-30 мас.% из цинка, на 0,2-5 мас.% из марганца, на 0,001-5 мас.% из никеля, на 0,001-5 мас.% индия, необязательно на 0,001-6 мас.% из олова, на 0,001-4 мас.% из железа, на 0,001-3 мас.% из кремния, на 0,001-2 мас.% из хрома и на 0,001-2 мас.% из фосфора, причем оставшийся процент для достижения 100 мас.% ...

Lotlegierungen und Anordnungen

Eine Lotlegierung wird bereitgestellt, wobei die Lotlegierung Zink, Aluminium, Magnesium und Gallium aufweist, wobei das Aluminium bezogen auf das Gewicht 8% bis 20% der Legierung ausmacht, das Magnesium bezogen auf das Gewicht 0,5% bis 20% der Legierung ausmacht und das Gallium bezogen auf das Gewicht 0,5 bis 20% der Legierung ausmacht und der Rest der Legierung Zink aufweist.

Legierung

Die vorliegende Erfindung betrifft neue Lotlegierungen enthaltend Kupfer, Silber, Zink, Mangan und Zinn.

Controllably reactive material

A high strength material which consists essentially of one or more reactive metals in major proportion and one or more alloying elements in minor proportion, wherein the material is controllably reactive and degradable under defined conditions. Examples of such materials are alloys of Ca-Mg, Ca-Al, Ca-Zn, Mg-Li, Al-Ga. Al-In and Al-Ga-In. These alloys may additionally comprise one or more of Zn, Cu, Ag, Cd and Pb. The material may be used to in diverter balls, opening valves, seals, floatation apparatus, sensors, actuators switches and moisture getters, particularly for oilfield, medical, automotive or aerospace applications, or in fuel cells. Objects made of this material may be coated with a degradable layer to prevent premature reaction of the material.

ANTIFRICTION BEARING ALLOY

CATALYST

Gold alloy

Alloy for use with internal combustion engine fuels

Pellets for immersion in the fuel tank of an I. C. engine are made of an alloy consisting of:- .Pb.22-36 parts by weight .Sn.30-42 parts by weight .Hg.8-24 parts by weight .Sb.10-15 parts by weight ...

PROCEDURE FOR THE PRODUCTION OF FROM LEAD, COPPER, IRON AND GRAPHITE EXISTENCE SLIDING OR FRICTION MATERIALS

PROCEDURE FOR the PRODUCTION of an ALLOY of the p OR N-TYPS

ADMIX DENTAL ALLOY AND AMALGAM

A composition suitable for amalgamation with mercury to form a dental amalgam comprising a substantially uniform blend of a major proportion by weight of the first alloy in the form of spheroidal particles consisting essentially of about 24 to 45 weight percent silver, 28 to 42 weight percent copper and 29 to 34 weight percent tin, and where the atomic percentage of the total amount of silver plus copper is about 3 times greater than the atomic percentage of tin; and a minor proporiton by weight of a second alloy in the form of irregularly-shaped particles having the same composition as the first alloy.

ALUMINA FORMING BIMETALLIC TUBE FOR REFINERY PROCESS FURNACES AND METHOD OF MAKING AND USING

Provided is a bimetallic tube for transport of hydrocarbon feedstocks in refinery process furnaces, and more particularly in furnace radiant coils, including: i) an outer tube layer being formed from stainless steels including chromium in the range of 15.0 to 26.0 wt.% based on the total weight of the stainless steel; ii) an inner tube layer being formed from an alumina forming bulk alloy including 5.0 to 10.0 wt.% of AL 20.0 wt.% to 25.0 wt.% Cr, less than 0.4 wt.% Si, and at least 35.0 wt.% Fe with the balance being Ni, wherein the inner tube layer is formed plasma powder welding the alumina forming bulk alloy on the inner surface of the outer tube layer; and iii) an oxide layer formed on the surface of the inner tube layer, wherein the oxide layer is substantially comprised of alumina, chromia, silica, mullite, spinels, or mixtures thereof. Also provided are methods of making and using the bimetallic tube.

Nickel-free Miao silver alloy with excellent die-casting performance for corrosion-resistant jewelry

Copper wire with small resistance and preparation technology thereof

COMPOSITIONS INCLUDING/UNDERSTANDING OF NIOBIUM AND SILICON, AND ALLOY COMPONENTS CONTAINING NIOBIUM AND OF SILICON

Refractory composition useful for variety of turbine engine components and other machinery, comprises niobium and silicon

La présente invention concerne une composition réfractaire comprenant du niobium et du silicium, dans laquelle la quantité de silicium représente moins d'à peu près 9 % en atomes de toute la composition. La présente invention concerne également un composant de moteur à turbine, constitué d'un alliage de niobium et de silicium dans lequel la quantité de silicium représente moins d'environ 9 % en atomes.

ALLOY ARGENT-ETAIN-CUIVRE-PALLADIUM AND ITS AMALGAM

MANUFACTORING PROCESS BY MECANOSYNTHESE Of a POWDER OF CZTSE, ITS USE TO FORM a THIN LAYER.

ANISOTROPIC ELECTROCONDUCTIVE MATERIAL

... [PROBLEMS] To provide an anisotropic electroconductive material which can solve problems of the conventional anisotropic electroconductive material using low-melting particles as electroconductive particles that the electroconductivity between conductors in a vertical direction necessary for good continuity is low and, further, the insulating resistance between adjacent conductors necessary for high insulating resistance is low. [MEANS FOR SOLVING PROBLEMS] An anisotropic elctroconductive material in which the solidus line of low-melting particles is 125°C or above, the peak temperature is 200°C or below, and the difference in temperature between the solidus line temperature and the peak temperature is 15°C or above. Among the low-melting particles, the maximum diameter of the low-melting particles is smaller than one-fourth of the distance between the adjacent conductors. COPYRIGHT KIPO & WIPO 2010 ...

NEGATIVE ELECTRODE ACTIVE SUBSTANCE MATERIAL

liga dentária

Corrosion-resistant fuel tank

A corrosion-resistant coated brass metal coated with a corrosion resistant alloy. The corrosion resistant alloy is a tin metal alloy or a tin and zinc metal alloy. The corrosion resistant metal alloy may also include one or more metal additives to improve the coating process and/or to alter the properties of the tin or tin and zinc metal alloy.

ТЕРМИЧЕСКИ УПРОЧНЯЕМЫЙ АЛЮМИНИЕВЫЙ СПЛАВ НА ОСНОВЕ AL-MG-SI

Изобретение относится к области металлургии, в частности к сплавам на основе системы Al-Mg-Si. Сплав содержит, мас.%: 0,6-1,0 магния, 0,2-0,7 кремния, 0,16-0,7 железа, 0,05-0,4 меди, до 0,15 марганца, до 0,35 хрома, до 0,2 циркония, до 0,25 цинка, до 0,15 титана, 0,005-0,075 олова и/или индия, остальное – алюминий и неизбежные примеси, причем отношение Si/Fe меньше 2,5, а содержание Si удовлетворяет условию: мас.% Si = A + [0,3 * (мас.% Fe)], где A составляет от 0,17 до 0,4 мас.%. Сплав обеспечивает сочетание высоких механических свойств после термического упрочнения с высокой стабильностью при хранении. 10 з.п. ф-лы, 3 ил., 1 табл.

РАЗЛАГАЕМОЕ УСТРОЙСТВО ДЛЯ ОТКЛОНЕНИЯ СКВАЖИНЫ И СПОСОБЫ ИСПОЛЬЗОВАНИЯ

... 1. Устройство для отклонения скважины, содержащее корпус, который содержит высокопрочный, реакционноспособный, контролируемый разлагаемый состав, причем корпус содержит первую часть корпуса, предназначенную для соединения с крепежным компонентом, предназначенным для закрепления отклонителя в первичном стволе скважины, и вторую часть корпуса, предназначенную для отклонения инструмента в боковой ствол скважины, пересекающий первичный ствол скважины, причем вторая часть корпуса содержит поверхность, расположенную под острым углом к продольной оси первичного ствола скважины. ! 2. Устройство по п.1, в котором корпус содержит первую часть корпуса, предназначенную для соединения с крепежным компонентом, предназначенным для закрепления отклонителя в первичном стволе скважины, и вторую часть корпуса, предназначенную для отклонения инструмента в боковой ствол скважины, пересекающий первичный ствол скважины, причем вторая часть корпуса содержит поверхность, расположенную под острым углом к продольной ...

Сплав на основе олова

Legierung

Lotlegierung, welche frei ist von Cadmium und Phosphor, enthaltend Kupfer, 32 Gew.-% bis 37 Gew.-% Silber, 15 Gew.-% bis 25 Gew.-% Zink, 8,5 Gew.-% bis 13 Gew.-% Mangan, 1 Gew.-% bis 3 Gew.-% Zinn, ad 100 Gew.-% Kupfer und unvermeidbare Verunreinigungen, wobei sich die Mengen der Bestandteile zu insgesamt 100 Gew.-% ergänzen.

Hochfeste, bei Raumtemperatur plastisch verformbare und mechanische Energie absorbierende Formkörper aus Eisenlegierungen

Die Erfindung bezieht sich auf das Gebiet der Materialwissenschaften und betrifft Formkörper aus Eisenlegierungen, die als Schneid-, Stanz- und Spaltwerkzeuge, in der Flugzeugindustrie, der Raumfahrt, der Fahrzeugindustrie und allgemein im Maschinen- und Gerätebau, einsetzbar sind. Der Erfindung liegt die Aufgabe zugrunde, Formkörper aus Eisenlegierungen anzugeben, die Plastizität und/oder signifikante Festigkeitssteigerungen bei gleichzeitiger vergleichsweise hoher Duktilität aufweisen. Diese Aufgabe wird gelöst durch Formkörper aus Eisenlegierungen gemäß der Formel FeaE1bE2cE3dE4e, und einem Gefüge mit einer homogenen Mikrostruktur mit martensitischer und austenitischer Phase und Resten an boridischen und/oder carbidischen und/oder nitridischen und/oder oxidischen Phasen. Die Aufgabe wird weiterhin gelöst durch ein Verfahren, bei dem die Legierungselemente gemischt, aufgeschmolzen und anschließend in eine Gussform gegossen und mit einer Geschwindigkeit von > 20 K/s abgekühlt werden.

Improvements in or relating to Slippery or Friction Materials

... 1,162,893. Bearings. ZVL MOKRAD NARODNI PODNIK. 22 Sept., 1967 [24 Sept., 1966], No. 43165/67. Heading F2A. [Also in Division C7] Anti friction or friction materials for use as thin wall bearings or clutch facings are made by sintering or brazing spherical Fe particles with the whole or part of the amount of Cu required in the friction or anti-friction layer, in a single layer to a backing member such as steel strip, and then compacting a powder mixture of Pb and graphite or Pb-Cu and graphite on to the layer to form a finished layer consisting of 10-70% Pb., 10-80% Cu, up to 5% graphite and balance Fe. The layer may be heated in an inert gas at 300‹ C.

Degradable whipstock apparatus and methods of use

PROCEDURE FOR the PRODUCTION of an ALLOY of the p OR N-TYPS

Multilayer plain bearing element

Die Erfindung betrifft ein Mehrschichtgleitlagerelement umfassend eine Stützschicht und eine Gleitschicht, wobei die Gleitschicht aus einem Weißmetall umfassend die Elemente Zinn, Zink und Kupfer besteht, wobei der Anteil an Kupfer zwischen 2 Gew.-% und 8 Gew.-% und der Anteil an Zink zwischen 35 und 50 Gew.-%, bevorzugt zwischen 39 und 47 Gew.-%, liegt und den Rest Zinn bildet. Bevorzugt weist zumindest 50% des Zinkanteils eine maximale Korngröße von 250 μm auf. Bevorzugt ist das Weißmetall eine Gusslegierung, insbesondere eine Schleudergusslegierung.

LOW PRESSURE MERCURY STEAMING TLA DUNG LAMP

ALLOY FOR DENTAL AMALGAMS

CORROSION-RESISTANT COATED COPPER AND METHOD FOR MAKING THE SAME

Metal alloys including copper

The present invention relates to metal alloys including copper.

CATALYSTS FOR METHANOL SYNTHESIS

SILVER-TIN-COPPER-PALLADIUM ALLOY AND AMALGAM THEREOF

NEGATIVE ELECTRODE ACTIVE MATERIAL

Provided is a negative electrode active substance material that can improve the capacity per volume and charge-discharge cycle characteristics of a nonaqueous electrolyte secondary cell such as a lithium ion secondary cell. The negative electrode active substance material according to the present embodiment contains an alloy phase. The alloy phase goes through thermoelastic diffusionless transformation when metal ions are released or when metal ions are occluded. The negative electrode active substance material of the present embodiment is used in nonaqueous electrolyte secondary cells. Thermoleastic diffusionless transformation is defined as so-called thermoelastic martensitic transformation.

INERT ALLOY ANODE USED FOR ALUMINUM ELECTROLYSIS AND PREPARING METHOD THEREFOR

An inert alloy anode used for aluminum electrolysis. The anode has Fe and Cu as the main constituents and comprises Sn. The addition of the Sn metal is conducive to the formation of a layer of oxidized film having a great antioxidant activity and structural stability on the surface of the inert alloy anode, and is conducive to an increase in the corrosion resistance of the anode. On this basis, the constituents of the inert alloy anode also comprise Ni, Al, and Y. The addition of the Al metal prevents the main metal constituents from being oxidized, the addition of the Y metal controls the alloy to provide a required polymorph in a preparation process, thus achieving the goal of anti-oxidation. The inert alloy anode having Fe and Cu as the main constituents has a low over-voltage, high electric conductivity, and reduced costs, and is applicable in the aluminum electrolysis industry.

SOLDER COMPOSITION

A solder composition having a mixture of elements including tin, indium, silver, and bismuth, and can include about 30% to 85% tin and about 15% to 65% indium.

TI, RU, FE AND O ALLOYS; USE THEREOF FOR PRODUCING CATHODES USED FOR ELECTROCHEMICALLY SYNTHESIZING SODIUM CHLORATE

L'alliage selon l'invention est de formule: Ti30+x Ru15+y Fer25+z O30+t M u dans laquelle M représente un ou plusieurs métaux qui peuvent être substitué s au fer et sont choisis dans le groupe constitué par le chrome, le manganèse, le vanadium, le tungstène, l'antimoine, le plomb et le platine; x est compris entre - 30 et +50; y est compris entre -10 et +35; z est compris entre -25 e t +70; t est compris entre -28 et +10; et u est compris entre 0 et +50; x, y, z, t et u étant choisis de façon à ce que x + y + z + t + u = 0. Cet alliage, notamment lorsqu'il a une structure nanocristalline, est avantageusement utilisable po ur la fabrication de cathodes pour la synthèse électrochimique du chlorate de sodium. Les cathodes ainsi fabriquées ont une surtension d'hydrogène très inférieure à celle des cathodes en acier utilisées actuellement.

Low-temperature sintering matrix powder, diamond tool adopting same and preparation method thereof

Brazing filler metal, use thereof, and flux combination, and method for connecting metal parts by brazing

Corrosion and oxidation resistant jewelry 10K green gold and processing process thereof

LEAD-FREE SOLDER COMPOSITION HEAT SEALABLE MATERIAL

Une composition de brasure sans plomb est divulguée et comporte : 0,02% à 6% en poids d'antimoine, 0,03% à 3% en poids de cuivre, 0,03% à 8% en poids de bismuth, 42% à 70% en poids d'indium, 0,3% à 8% en poids d'argent, 5% à 11% en poids de magnésium, 0,8% à 1,6% en poids de scandium, 0,7% à 2,0% en poids d'yttrium et 10% à 45% en poids d'étain. La composition de brasure sans plomb de l'invention a une température de solidus non inférieure à 120°C, a de bonnes ductilité et stabilité, et est donc appropriée pour braser des connecteurs électriques sur la surface métallisée sur le verre.

PROCEEDED OF PRODUCTION Of a COMPOSITION Of a CATALYST FOR the SYNTHESIS OF METHANOL At low temperature, CATALYST TO BE USED AND PROCEEDED OF PRODUCTION OF METHANOL

Improvements in alloys of filling for defective molten parts

LEAD-FREE SOLDER COMPOSITION WITH HIGH DUCTILITY

Une composition de brasure sans plomb est divulguée et comporte : 0,02% à 6% en poids d'antimoine, 0,03% à 3% en poids de cuivre, 0,03% à 8% en poids de bismuth, 42% à 70% en poids d'indium, 0,3% à 8% en poids d'argent, 5% à 11% en poids de magnésium, 0,8% à 1,6% en poids de scandium, 0,7% à 2,0% en poids d'yttrium et 10% à 45% en poids d'étain. La composition de brasure sans plomb de l'invention a une température de solidus non inférieure à 120°C, a de bonnes ductilité et stabilité, et est donc appropriée pour braser des connecteurs électriques sur la surface métallisée sur le verre.

SOLDER PASTE INCLUDING HIGH DUCTILITY LEAD-FREE SOLDER COMPOSITION AND SOLDERING FLUX

Disclosed is a solder paste including a high ductility lead-free solder composition and soldering flux, providing excellent ductility and safety. According to the present invention, the lead-free solder composition comprises: 0.02 to 6 weight percent of Sb; 0.03 to 3 weight percent of Cu; 0.03 to 8 weight percent of Bi; 30 to 65 weight percent of In; 0.3 to 8 weight percent of Ag; 5 to 11 weight percent of Mg; 0.2 to 1.45 weight percent of Sc; 0.1 to 1.1 weight percent of Re; and 10 to 45 weight percent of Sn. Moreover, the soldering flux comprises: 25 to 32 weight percent of rosin; 5 to 7 weight percent of a mixture of 2-pentanoic acid and 2-fluorobenzoic acid, as an organic acid activator; 0.2 to 0.5 weight percent of alkylphenol polyoxyethylene as a surfactant; 0.7 to 0.8 weight percent of 1-octyl alcohol as a defoamer; 0.5 to 0.7 weight percent of hydroquinone as a stabilizer; and 20 to 32 weight percent of a monoalkylpropylene glycol-based solvent. COPYRIGHT KIPO 2018 ...

ANISOTROPIC ELECTROCONDUCTIVE MATERIAL

전기 디바이스용 부극 활물질 및 이것을 사용한 전기 디바이스

... 본 발명은, 높은 사이클 내구성을 갖는 리튬 이온 이차 전지 등의 전기 디바이스용 부극 활물질을 제공하는 것을 목적으로 한다. 본 발명의 전기 디바이스용 부극 활물질은, 하기 화학식(1): (상기 화학식(1)에 있어서, M은, Ti, Zn, C 및 이들의 조합으로 이루어지는 군에서 선택되는 적어도 1개의 금속이며, A는, 불가피 불순물이며, x, y, z 및 a는, 질량%의 값을 나타내고, 이 때, 0 Подробнее

전기 디바이스용 부극, 및 이것을 사용한 전기 디바이스

... 본 발명의 과제는 높은 사이클 특성을 유지하면서, 또한 초기 용량도 높고 밸런스 좋은 특성을 나타내는 Li 이온 이차 전지 등의 전기 디바이스용 부극을 제공하는 것이다. 집전체와, 상기 집전체의 표면에 배치된 부극 활물질, 도전 보조제 및 바인더를 포함하는 전극층을 갖는 전기 디바이스용 부극이며, 상기 부극 활물질이, 다음 식 (1): SixZnyMzAa[상기 식 (1)에 있어서, M은 V, Sn, Al, C 및 이들의 조합으로 이루어지는 군에서 선택되는 적어도 1개의 금속이며, A는 불가피 불순물이며, x, y, z 및 a는 질량%의 값을 나타내고, 이때, 0 Подробнее

ALLOY WITH HIGHLY EFFICIENT ELASTO-CALORIC EFFECT

The present invention relates to an alloy with a highly efficient elasto-caloric effect (eCE), capable of enhancing coefficient of performance (COP). According to one embodiment of the present invention, an alloy with a highly efficient eCE converting mechanical energy into heat energy is represented by (Cu_xTi_(52 - y - z)Ni_(48 - x + y)Si_z)_(100 - k)Sn_k, wherein 30 <= x <= 44, -2 <= y <= 3, 0.5 <= z <= 5, and 1.3 <= k <= 5.5, and comprises Cu, Ti, Ni, Si, and Sn. In the alloy, at least a part of Sn is replaced with one or more metal elements among Zr, Nb, V, Fe, Al, and Cr, which increase internal frictional energy in a Cu-Ti-Ni-Si alloy like as Sn to lower a phase transition temperature. COPYRIGHT KIPO 2018 ...

REVERSIBLE INVERSE MAGNETOCALORIC HEUSLER ALLOY AND MANUFACTURING METHOD THEREOF

The present invention relates to a reversible inverse magnetocaloric Heusler alloy and a manufacturing method thereof, and more specifically, to a Ni-Mn Heusler alloy, which is capable of controlling the operating temperature of inverse magnetocaloric effects by substituting a small quantity of 3d transition metal; showing a great magnetic entropy change (ΔSM); and displaying a great, sustainable inverse magnetocaloric effect within a broad temperature range through a small thermal-hysteresis behavior under 20 K, and a manufacturing method thereof. That is, the present invention is based on a composition of Ni45Co5Mn40Sn10, which has a high susceptibility and a small thermal-hysteresis; substitutes Ti, V, and Cr, which are 3d transition metals, for Ni by considering the e/a ratio; reduces the density of the peripheral electrons; and systematically controls the phase change temperature in accordance with the added volume within a broad temperature range (5 K-400 K) under the room temperature ...

SUPER ELASTIC ZIRCONIUM ALLOY FOR BIOLOGICAL USE, MEDICAL INSTRUMENT AND GLASSES

Provided is a super elastic alloy for biological use having a high biocompatibility, good processability and super elasticity, said super elastic alloy being a super elastic zirconium alloy for biological use comprising 27-54 mol% inclusive of titanium, 5-9 mol% inclusive of niobium which is a β phase-stabilizing element capable of stabilizing the β phase of zirconium, and 1-4 mol% inclusive in total of tin and/or aluminum which are ω phase-suppressing elements capable of suppressing the ω phase of zirconium, with the balance consisting of zirconium and unavoidable impurities.

PRODUCTION METHOD OF THERMOELECTRIC SEMICONDUCTOR ALLOY, THERMOELECTRIC CONVERSION MODULE AND THERMOELECTRIC POWER GENERATING DEVICE

The present invention provides a method for producing a half Heuslar alloy including quench-solidifying a molten alloy at a cooling rate of 1 x 102 to 1 x 103°C/sec to produce a Heuslar alloy represented by the formula: ABC (wherein A and B each is at least one member selected from transition metals such as Fe, Co, Ni, Ti, V, Cr, Zr, Hf, Nb, Mo, Ta and W, and C is at least one member selected from Group 13 or 14 element such as Al, Ga, In, Si, Ge and Sn), and a high-performance thermoelectric power generating device using the thermoelectric semiconductor alloy.

NEGATIVE ELECTRODE FOR ELECTRIC DEVICE AND ELECTRIC DEVICE USING THE SAME

The negative electrode for an electric device includes a current collector and an electrode layer containing a negative electrode active material, a conductive auxiliary agent and a binder and formed on a surface of the current collector, wherein the negative electrode active material contains an alloy represented by the following formula (1): Si x Sn y M z A a (in the formula (1), M is at least one metal selected from the group consisting of Al, V, C and a combination thereof, A is inevitable impurities, and x, y, z and a represent mass percent values and satisfy the conditions of 0<x<100, 0<y<100, 0<z<100, 0≦a<0.5, and x+y+z+a=100), and elastic elongation of the current collector is 1.30% or greater.

NEGATIVE ELECTRODE ACTIVE MATERIAL FOR ELECTRIC DEVICE

A negative electrode active material for an electric device includes an alloy containing, in terms of mass ratio, 35%Si78%, 7%Sn30%, 0% Подробнее

DEGRADABLE WHIPSTOCK APPARATUS AND METHOD OF USE

Whipstocks and deflectors comprising a degradable composition, and methods of using same are described. In one embodiment the degradable composition consists essentially of one or more reactive metals in major proportion, and one or more alloying elements in minor proportion, with the provisos that the composition is high-strength, controllably reactive, and degradable under defined conditions. Methods of using degradable whipstocks in oilfield operations are also described. This abstract allows a searcher or other reader to quickly ascertain the subject matter of the disclosure. It will not be used to interpret or limit the scope or meaning of the claims. 37 C.F.R. 1.72(b).

Sliding material and a method for its manufacture

A conventional Bi-containing sliding material sometimes underwent seizing in a sliding part operating at a high rotational speed. The present invention provides a sliding material which does not undergo seizing in a sliding part operating at a high rotational speed and a method for its manufacture. A low melting point alloy containing at least 20 mass % of Bi and having a liquidus temperature of at most 200° C. is made to penetrate into a porous portion comprising a CuSn based alloy. A BiSn based alloy or a BiIn based alloy is suitable as the low melting point alloy. After a low melting point alloy paste is applied to a porous portion, the low melting point alloy is melted and made to penetrate into the porous portion.

СПОСОБ ПОЛУЧЕНИЯ ТЕРМОЭЛЕКТРИЧЕСКОГО ПОЛУПРОВОДНИКОВОГО СПЛАВА, МОДУЛЬ ТЕРМОЭЛЕКТРИЧЕСКОГО ПРЕОБРАЗОВАНИЯ И ТЕРМОЭЛЕКТРИЧЕСКОЕ УСТРОЙСТВО ГЕНЕРАЦИИ ЭЛЕКТРОЭНЕРГИИ

FIELD: chemistry. SUBSTANCE: invention relates to obtaining thermoelectric semiconductor alloys and can be used in elements, modules and devices for thermoelectric transformation, as well as in systems of discharged heat recuperation and solar heat utilisation. Geisler alloy is represented by formula Fe 2 V 1-x A x A 1-y B y , semi-geisler alloy - Ti 1-x A x Ni 1-y B y Sn 1-z C z , where A is at least one element selected from transitive metals, such as Co, Ni, Ti, V, Cr, Zr, Hf, Nb, Mo, Ta and W, B is at least one element selected from group consisting of Al, Ga, In, Si, Ge and Sn. Ratio of the strongest peak of Geisler or semi-geisler phases, measured at Roentgen diffraction on powders, constitutes 85% or more and is determined as IHS/(IHS+IA+IB)×100%, where intensity of the strongest peak of Geisler or semi-geisler phases is designated as HIS, intensity of the strongest peak of additive phase A is designated as IA, and intensity of the strongest peak of phase B is designated as IB. Alloys are obtained by hardening with melt tempering at cooling rate from 1×10 2 to 1×10 3 °C/sec and grinding of obtained alloy using jet mill into powder which has average particle diametre from 1 to 100 mcm. EFFECT: alloys are characterised by having almost single phase, which allows using them for obtaining devices possessing high operating characteristics in wide temperature range. 10 cl, 7 dwg, 3 tbl, 2 ex (19) РОССИЙСКАЯ ФЕДЕРАЦИЯ RU (11) 2 364 643 (13) C2 (51) МПК C22C 1/04 (2006.01) C22C 30/00 (2006.01) H01L 35/20 (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ, ПАТЕНТАМ И ТОВАРНЫМ ЗНАКАМ (12) ОПИСАНИЕ ИЗОБРЕТЕНИЯ К ПАТЕНТУ (21), (22) Заявка: 2007123361/02, 22.12.2005 (24) Дата начала отсчета срока действия патента: 22.12.2005 (73) Патентообладатель(и): СОВА ДЕНКО К.К. (JP) R U (30) Конвенционный приоритет: 24.12.2004 JP 2004-374218 (72) Автор(ы): НАКАДЗИМА Кенитиро (JP) (43) Дата публикации заявки: 27.12.2008 2 3 6 4 6 4 3 (45) Опубликовано: 20.08.2009 Бюл. № ...

Verfahren zur Herstellung eines Gleitschuhs einer hydrostatischen Verdrängermaschine

Die Erfindung betrifft ein Verfahren zur Herstellung eines Gleitschuhs (6) einer hydrostatischen Verdrängermaschine (1), insbesondere einer Axialkolbenmaschine, der an einem druckbeaufschlagten Kolben (5) gelenkig befestigbar ist und den Kolben (5) an einer huberzeugenden Lauffläche (7) abstützt, wobei der Gleitschuh (6) aus einem Stahlgrundkörper (6a) und einer mit der Lauffläche (7) zusammenwirkenden Lagermetallplatte (6c) besteht, die an den Stahlgrundkörper des Gleitschuhs (6) durch einen Lötprozess unter Verwendung eines silberhaltigen Hartlotes gefügt ist. Erfindungsgemäß wird in dem Lötprozess ein silberhaltiges Hartlot mit einem Silberanteil von höchstens 35-Gewichts-% verwendet.

TOOTH FILLING COMPOSITION

... 1474683 Dental alloy GOSUDAR NI I PROEKT INST REDKOMETALL PROMYSHLEN and TSENTRAL NI INST STOMATOLOGII 12 April 1976 14888/76 Heading C7A An alloy suitable for filling teeth or as a base for preparing porcelain crowns consists of: The composition is made by mixing 40-45% of eutectic Ga-Sn alloy containing 11% Sn with 55-60% powdered copper-tin alloy of the Cu3Sn composition having a maximum particle size of 40 microns with 55-70% consisting of particles under 20 microns. The alloy has improved plasticity and good mechanical and physical properties.

SILVER-TIN-COPPER-PALLADIUM ALLOY AND AMALGAM THEREOF

VERFAHREN ZUR HERSTELLUNG EINER LEGIERUNG DES P- ODER N-TYPS

Multilayer plain bearing element

Die Erfindung betrifft ein Mehrschichtgleitlagerelement umfassend eine Stützschicht und eine Gleitschicht, wobei die Gleitschicht aus einem Weißmetall umfassend die Elemente Zinn, Zink und Kupfer besteht, wobei der Anteil an Kupfer zwischen 2 Gew.-% und 8 Gew.-% und der Anteil an Zink zwischen 35 und 50 Gew.-%, bevorzugt zwischen 39 und 47 Gew.-%, liegt und den Rest Zinn bildet. Bevorzugt weist zumindest 50% des Zinkanteils eine maximale Korngröße von 250 μm auf. Bevorzugt ist das Weißmetall eine Gusslegierung, insbesondere eine Schleudergusslegierung.

ELEMENT FOR THERMAL FUSE, THERMAL FUSE AND BATTERY INCLUDING THE SAME

ORGANIC HYDROGEN STORAGE MATERIAL DEHYDROGENATION CATALYST, A SUPPORT FOR THE CATALYST, HYDROGEN-STORAGE ALLOY, AND A PROCESS FOR PROVIDING HIGH-PURITY HYDROGEN GAS

The present invention relates to a catalyst used for dehydrogenation of organic hydrogen storage raw materials to generate hydrogen, a carrier of the catalyst and a preparation method thereof. The present invention also relates to a hydrogen storage alloy and a preparation method thereof. The present invention also relates to a method for providing high purity hydrogen, an efficient distributed method for producing high-purity and high-pressure hydrogen, a system for providing high-purity and high-pressure hydrogen, a mobile hydrogen supply system and a distributed hydrogen supply device.

NEGATIVE ELECTRODE ACTIVE MATERIAL

Provided is a negative electrode active substance material that can improve the capacity per volume and charge-discharge cycle characteristics of a nonaqueous electrolyte secondary cell such as a lithium ion secondary cell. The negative electrode active substance material according to the present embodiment contains an alloy phase. The alloy phase goes through thermoelastic diffusionless transformation when metal ions are released or when metal ions are occluded. The negative electrode active substance material of the present embodiment is used in nonaqueous electrolyte secondary cells. Thermoleastic diffusionless transformation is defined as so-called thermoelastic martensitic transformation.

INERT ALLOY ANODE FOR ALUMINUM ELECTROLYSIS AND PREPARING METHOD THEREOF

An inert alloy anode used for aluminum electrolysis. The anode has Fe and Cu as the main constituents and comprises Sn. The addition of the Sn metal is conducive to the formation of a layer of oxidized film having a great antioxidant activity and structural stability on the surface of the inert alloy anode, and is conducive to an increase in the corrosion resistance of the anode. On this basis, the constituents of the inert alloy anode also comprise Ni, Al, and Y. The addition of the Al metal prevents the main metal constituents from being oxidized, the addition of the Y metal controls the alloy to provide a required polymorph in a preparation process, thus achieving the goal of anti-oxidation. The inert alloy anode having Fe and Cu as the main constituents has a low over-voltage, high electric conductivity, and reduced costs, and is applicable in the aluminum electrolysis industry ...

Oil-free planar sliding bearing with extremely low friction coefficient and preparation method thereof

ALUMINUM ALLOY CASTING AND ALUMINUM ALLOY WITH LIGHTER WEIGHT AND SIMILAR STRENGTH TO EXISTING STAINLESS STEEL

PURPOSE: Aluminum alloy casting and aluminum alloy are provided to maintain strength with lighter weight since Si of 4~13weight%, Cu of 1~5weight%, and Zn of 26~40 weight% are contained. CONSTITUTION: An aluminum alloy contains Si of 4~13weight%, Cu of 1~5weight%, and Zn of 26~40 weight%. The aluminum alloy comprises Al and impurities. The content of the Si is 5 ~ 10 weight%. Alternatively, the content of the Si is 5 ~ 8 weight%. The content of Cu is 2 ~ 5 weight%. The content of the Zn is 26 ~ 35 weight%. COPYRIGHT KIPO 2012 ...

전기 디바이스용 부극 활물질 및 이것을 사용한 전기 디바이스

... 본 발명은, 높은 사이클 내구성을 갖는 리튬 이온 이차 전지 등의 전기 디바이스용 부극 활물질을 제공하는 것을 목적으로 한다. 본 발명의 전기 디바이스용 부극 활물질은, 하기 화학식(1): (상기 화학식(1)에 있어서, M은, Ti, Zn, C 및 이들의 조합으로 이루어지는 군에서 선택되는 적어도 1개의 금속이며, A는, 불가피 불순물이며, x, y, z 및 a는, 질량%의 값을 나타내고, 이 때, 0 Подробнее

전기 디바이스용 부극, 및 이것을 사용한 전기 디바이스

... 본 발명의 과제는 높은 사이클 특성을 유지하면서, 또한 초기 용량도 높고 밸런스 좋은 특성을 나타내는 Li 이온 이차 전지 등의 전기 디바이스용 부극을 제공하는 것이다. 집전체와, 상기 집전체의 표면에 배치된 부극 활물질, 도전 보조제 및 바인더를 함유하는 전극층을 갖는 전기 디바이스용 부극이며, 상기 부극 활물질이, 다음 식 (1): [상기 식 (1)에 있어서, M은 V, Sn, Al, C 및 이들의 조합으로 이루어지는 군에서 선택되는 적어도 1개의 금속이며, A는 불가피 불순물이며, x, y, z 및 a는 질량%의 값을 나타내고, 이때, 0 Подробнее

전기 디바이스용 부극 활물질, 및 이것을 사용한 전기 디바이스

... 리튬 이온 이차 전지 등의 전기 디바이스의 사이클 내구성을 향상시킬 수 있는 수단을 제공한다. Si-Sn-M(M은 1 또는 2 이상의 전이 금속 원소이다)으로 표시되는 3원계의 합금 조성을 갖고, 미세 조직이, 전이 금속의 규화물(실리사이드)을 주성분으로 하는 제1 상과, 일부에 Sn을 포함하고, 비정질 또는 저결정성의 Si를 주성분으로 하는 제2 상을 갖고, 또한, 일부가 복수의 독립적인 제1 상, 및 일부가 제1 상과 제2 상이 공정 조직으로 되어 있는 구조를 갖는 규소 함유 합금을 포함하는 부극 활물질을 전기 디바이스에 사용한다.

BLACK MATERIAL, BLACK PARTICLE DISPERSION LIQUID, BLACK LIGHT-BLOCKING FILM USING SAME, AND BASE WITH BLACK LIGHT-BLOCKING FILM

Disclosed is a black material composed of particles mainly containing an Ag-Sn alloy which includes not less than 47.6% and not more than 90% by weight of Ag, and this black material is characterized in that the particles have an average particle diameter of not less than 1 nm and not more than 300 nm. Also disclosed is a black particle dispersion liquid characterized by containing the black material (particles) and a polyvinyl pyrrolidone (PVP) as a polymer dispersant. Further disclosed are black particles characterized in that the surfaces of the above-described particles are covered with an insulating film which is composed of a metal oxide such as silicon dioxide (silica) and aluminum oxide (alumina), or an organic polymer compound such as a polyamine compound. © KIPO & WIPO 2007 ...

ALLOY FOR BRAZE WELDING

The invention concerns an alloy for braze welding, comprising 18% to 29% silver by weight, 12% to 30% zinc by weight, 0.2% to 5% manganese by weight, 0.001% to 5% nickel by weight, 0.001% to 5% indium by weight, optionally 0.001% to 6% tin, 0.001% to 4% iron by weight, 0.001 % to 3% silicon by weight, 0.001% to 2% chromium by weight, 0.001% to 2% phosphorus by weight and optionally other elements in quantities lower than 1% by weight, wherein the remaining percentage necessary to reach 100% by weight is constituted by copper. The alloy can be used to join components in sintered hard metal to other components in iron or steel, for example in cutting tools.

Cu-Added Ni-Cr-Fe-Based Alloy Brazing Material

A Ni—Cr—Fe-based alloy brazing filler material to which Cu is added, and which has a low melting temperature, and is inexpensive and excellent in corrosion resistance and in strength, for use in manufacture of stainless-steel heat exchangers or the like, specifically, a Ni—Cr—Fe-based alloy brazing filler material, including, in mass %, Cr: 15 to 30%; Fe: 15 to 30%; Cu: 2.1 to 7.5%; P: 3 to 12%; and Si: 0 to 8%; and the balance being Ni and unavoidable impurities, wherein the total content of Cr and Fe is 30 to 54%, and the total content of P and Si is 7 to 14%. 1. A Ni—Cr—Fe-based alloy brazing filler material , comprising , in mass % ,Cr: 15 to 30Fe: 15 to 30%;Cu: 2.1 to 7.5%;P: 3 to 12%; andSi: 0 to 8%; andthe balance being Ni and unavoidable impurities,wherein the total content of Cr and Fe is 30 to 54%, and the total content of P and Si is 7 to 14%.2. The Ni—Cr—Fe-based alloy brazing filler material according to claim 1 , comprising:1% or less in total of at least one of B and C;5% or less in total of at least one of Mo, Co, Mn, and V; and/or2% or less in total of at least one of Sn, Zn, and Bi.3. The Ni—Cr—Fe-based alloy brazing filler material according to claim 1 , wherein the content of Cu is more than 2.5% and less than 6%.4. The Ni—Cr—Fe-based alloy brazing filler material according to claim 1 , wherein the total content of P+Si is more than 8% and less than 13%.5. The Ni—Cr—Fe-based alloy brazing filler material according to claim 1 , wherein the content of Cu is more than 3% and less than 6% claim 1 , and the total content of P+Si is more than 8% and less than 13% The present application is a continuation application of U.S. patent application Ser. No. 14/909,828 filed on Feb. 3, 2016, which is the United States national phase of International Application No. PCT/JP2014/069736 filed Jul. 25, 2014, which claims priority to Japanese Patent Application No. 2013-162961 filed on Aug. 6, 2013, and Japanese Patent Application No. 2014-123074 filed on Jun. 16, ...

Solder, soldering method, and semiconductor device

A solder includes Sn (tin), Bi (bismuth) and Zn (zinc), wherein the solder has a Zn content of 0.01% by weight to 0.1% by weight.

Aluminum alloy, and aluminum alloy casting

Provided are a metal alloy and more particularly, to an aluminum alloy used for electrical, electronic, and mechanical components, and an aluminum alloy casting manufactured using the aluminum alloy. The aluminum alloy according to an embodiment includes 4 to 13 wt % of silicon (Si), 1 to 5 wt % of copper (Cu), 26 wt % or more and less than 40 wt % of zinc (Zn), and a balance being aluminum (Al) and unavoidable impurities.

High-temperature lead-free solder alloy

A Sn—Sb—Ag—Cu based high-temperature lead-free solder alloy which has excellent connection reliability and which does not form a low melting point phase even when solidified by slow cooling is provided. It has an alloy composition consisting essentially of, in mass percent, Sb: 35-40%, Ag: 13-18%, Cu: 6-8%, and a remainder of Sn.

Negative electrode active material for electric device

The negative electrode active material for an electric device of the present invention has an alloy containing Si in a range from 12% by mass or more to less than 100% by mass, Sn in a range from more than 0% by mass to 45% by mass or less, Al in a range from more than 0% by mass to 43% by mass or less, and indispensable impurities as remains. The negative electrode active material can be obtained, for example, using a multiple DC magnetron sputtering apparatus with Si, Sn and Al as targets. Electric devices to which the negative electrode active material of the present invention is applied have an improved cycle life and are excellent in the capacity and cycle durability.

DENTAL ALLOY

A palladium-dominated dental alloy, in particular a ceramic-bonding dental alloy for the manufacture of dental prostheses such as crowns, bridges, inlays, or onlays, containing at least gold, palladium, and silver, as well as a grain-growth inhibitor in the form of ruthenium. In order to achieve a fine-grained separation without the formation of agglomerates to obtain a dental alloy with high mechanical stability and excellent polishing characteristics, it is proposed that the dental alloy contain—in addition to ruthenium as grain-growth inhibitor—at least one element of the group tantalum, niobium, yttrium, zirconium, chromium, and molybdenum as grain-refinement control element. 2. The palladium-dominated dental alloy of claim 1 , wherein the dental alloy contains as grain-refinement control element tantalum or niobium claim 1 , or tantalum and niobium.3. The palladium-dominated dental alloy of claim 1 , wherein the dental alloy contains more than 30% by weight of gold claim 1 , more than 35% by weight of palladium claim 1 , more than 10% by weight of silver claim 1 , and more than 5% by weight of tin.10. The palladium-dominated dental alloy of claim 1 , wherein the gallium content is 0% by weight.11. The palladium-dominated dental alloy of claim 1 , wherein the platinum content is less than 6% by weight.12. The palladium-dominated alloy of claim 11 , wherein the platinum content is less than 5% by weight. The invention relates to a palladium-dominated dental alloy, in particular a ceramic-bonding dental alloy for the manufacture of dental prostheses such as dental crowns, bridges, inlays, or onlays, containing at least gold, palladium, and silver, as well as a grain-growth inhibitor in the form of ruthenium.A dental alloy in accordance with DE-C-32 11 703 contains in % by weight: gold 10-60%, palladium 20-60%, and silver 0-15%. It further contains 0-10% indium, 0-10% tin, 0-5% zinc, 0-2% iridium, 0-2% copper, 0.1-5% platinum, and/or 0.05-2% of each of at least one ...

ALUMINUM-MOLYBDENUM-ZIRCONIUM-TIN MASTER ALLOYS

The present invention relates to titanium base alloys, and more particularly to aluminum-molybdenum-zirconium-tin master alloys, which are suitable for further alloying into titanium base alloys. The present invention also relates to methods for producing aluminum-molybdenum-zirconium-tin master alloys, which are useful in providing titanium base alloys containing refractory materials of greater homogeneity. In accordance with the present invention, the tin: zirconium ratio is reduced from about 1:2 to about 1:1, thereby lowering the amount of excess zirconium. After the highest melting point tin: zirconium intermetallic phases have been precipitated, there is little or no excess zirconium to precipitate out with aluminum; therefore, all of the aluminum is available to combine with molybdenum to precipitate the target lower melting point intermetallic phases. 1. An aluminum-molybdenum-zirconium-tin master alloy composition formed by a single stage thermite reaction , said composition comprising about 36 weight % aluminum , 36 weight % molybdenum , about 12 weight % zirconium , and about 12 weight % tin , wherein the alloy is in a form of an ingot.2. The composition as recited in claim 1 , wherein the ingot has a weight of about 120 pounds.3. The composition as recited in claim 2 , wherein the ingot has a weight of about 100 pounds.4. The composition as recited in claim 1 , wherein the alloy is used for disks claim 1 , blades and seals of turbine engines.5. The composition as recited in claim 1 , wherein the alloy is used for airframe parts.6. The composition as recited in claim 1 , wherein the composition is produced by melting pure titanium with the alloy.7. The composition as recited in claim 1 , further comprising about 4 weight % titanium. This application claims priority to U.S. provisional application Ser. No. 61/782,163 which was filed in the United States Patent and Trademark Office on Mar. 14, 2013.The present invention relates to titanium base alloys, and ...

CONDUCTIVE BALL AND ELECTRONIC DEVICE

A conductive ball includes a copper ball, a nickel layer covering an outer surface of the copper ball, a copper layer covering an outer surface of the nickel layer, and a tin-based solder covering an outer surface of the copper layer. A copper weight of the copper layer relative to a summed weight of the tin-based solder and the copper layer is 0.7 wt % to 3 wt %. 1. A conductive ball comprising:a copper ball;a nickel layer covering an outer surface of the copper ball;a copper layer covering an outer surface of the nickel layer, anda tin-based solder covering an outer surface of the copper layer,wherein a copper weight of the copper layer relative to a summed weight of the tin-based solder and the copper layer is 0.7 wt % to 3 wt %.2. The conductive ball according to claim 1 , wherein a concentration of copper in the copper layer claim 1 , which is to diffuse into the tin-based solder when the tin-based solder is reflow heated claim 1 , is 0.7 wt % to 3 wt %.3. The conductive ball according to claim 1 , wherein the tin-based solder is one of a tin/bismuth solder claim 1 , a tin/silver solder claim 1 , and a tin/bismuth/nickel solder.4. An electronic device comprising:a lower electronic member having a first connection pad;an upper electronic member arranged above the lower electronic member and having a second connection pad; anda conductive ball configured to interconnect the first connection pad of the lower electronic member and the second connection pad of the upper electronic member, a copper ball,', 'a nickel layer covering an outer surface of the copper ball, and', 'a tin-based solder covering an outer surface of the nickel layer, and, 'wherein the conductive ball comprises{'sub': 6', '5, 'wherein a (Cu, Ni)Snlayer is formed between the nickel layer and the tin-based solder.'}5. The electronic device according to claim 4 , wherein each surface of the first connection pad and the second connection pad is a nickel layer or a copper layer claim 4 , and{'sub': 6 ...

COPPER-NICKEL-ZINC ALLOY CONTAINING SILICON

The invention includes a copper-nickel-zinc alloy with the following composition in weight %: Cu 47.0 to 49.0%, Ni 8.0 to 10.0%, Mn 0.2 to 0.6%, Si 0.05 to 0.4%, Pb 1.0 to 1.5%, Fe and/or Co up to 0.8%, the rest being Zn and unavoidable impurities, wherein the total of the Fe content and double the Co content is at least 0.1 weight % and wherein mixing silicides containing nickel, iron and manganese and/or containing nickel, cobalt and manganese are stored as spherical or ellipsoidal particles in a structure consisting of an α- and β-phase. The invention further relates to a method for producing semi-finished products from a copper-nickel-zinc alloy. 3. The copper-nickel-zinc alloy as claimed in claim 1 , characterized in that the ratio of the sum total of the proportions by weight of the elements Ni claim 1 , Co and Mn bound in silicides to the proportion by weight of the silicon bound in silicides is between 2.5 and 5.4. The copper-nickel-zinc alloy as claimed in claim 3 , characterized in that the ratio of the sum total of the proportions by weight of the elements Ni claim 3 , Co and Mn bound in silicides to the proportion by weight of the silicon bound in silicides is between 3 and 4.5.5. The copper-nickel-zinc alloy as claimed in claim 1 , characterized in that the ratio of the sum total of the proportions by weight of the elements Ni and Co bound in silicides to the proportion by weight of the manganese bound in silicides is at least 10.6. The copper-nickel-zinc alloy as claimed in claim 1 , characterized in that the ratio of the proportion by weight of the nickel bound in silicides to the proportion by weight of the cobalt bound in silicides is between 1.5 and 2.5.7. The copper-nickel-zinc alloy as claimed in claim 1 , characterized in that the areal density of the silicides having a particle diameter of at most 2 μm is at least 20 per 5000 μm. This is a divisional of prior U.S. application Ser. No. 14/383,261, which was the national stage of International ...

SEMICONDUCTOR FILM COMPRISING AN OXIDE CONTAINING IN ATOMS, Sn ATOMS AND Zn ATOMS

A field effect transistor including: a substrate, and at least gate electrode, a gate insulating film, a semiconductor layer, a protective layer for the semiconductor layer, a source electrode and a drain electrode provided on the substrate, wherein the source electrode and the drain electrode are connected with the semiconductor layer therebetween, the gate insulating film is between the gate electrode and the semiconductor layer, the protective layer is on at least one surface of the semiconductor layer, the semiconductor layer includes an oxide containing In atoms, Sn atoms and Zn atoms, the atomic composition ratio of Zn/(In+Sn+Zn) is 25 atom % or more and 75 atom % or less, and the atomic composition ratio of Sn/(In+Sn+Zn) is less than 50 atom %.

Sintered sliding member having exceptional corrosion resistance, heat resistance, and wear resistance; and method for producing said member

A sintered sliding material with excellent corrosion resistance, heat resistance, and wear resistance is provided. The sintered sliding material has a composition made of: 36-86 mass % of Ni; 1-11 mass % of Sn; 0.05-1.0 mass % of P; 1-9 mass % of C; and the Cu balance including inevitable impurities. The sintered sliding material is made of a sintered material of a plurality of grains of alloy of Ni—Cu alloy or Cu—Ni alloy, the Ni—Cu alloy and the Cu—Ni alloy containing Sn, P, C, and Si; has a structure in which pores are dispersedly formed in grain boundaries of the plurality of the grains of alloy; and as inevitable impurities in a matrix constituted from the grains of alloy, a C content is 0.6 mass % or less and a Si content is 0.15 mass % or less.

HARDENABLE Al-Mg-Si-BASED ALUMINUM ALLOY

A hardenable Al—Mg—Si-based aluminum alloy is shown. In order to provide a recycling-friendly, storage-stable and particularly thermosetting aluminum alloy, it is proposed that this aluminum alloy should contain from 0.6 to 1% by weight of magnesium (Mg), from 0.2 to 0.7% by weight of silicon (Si), from 0.16 to 0.7% by weight of iron (Fe), from 0.05 to 0.4% by weight of copper (Cu), a maximum of 0.15% by weight of manganese (Mn), a maximum of 0.35% by weight of chromium (Cr), a maximum of 0.2% by weight of zirconium (Zr), a maximum of 0.25% by weight of zinc (Zn), a maximum of 0.15% by weight of titanium (Ti), 0.005 to 0.075% by weight of tin (Sn) and/or indium (In), and the remainder aluminum and production-related unavoidable impurities, wherein the ratio of the weight percentages of Si/Fe is less than 2.5 and the content of Si is determined according to the equation wt. % Si=A+[ 0.3 *(wt. % Fe)], with the parameter A being in the range of 0.17 to 0.4% by weight.

THERMOELECTRIC MATERIAL, MANUFACTURING METHOD OF THERMOELECTRIC MATERIAL, THERMOELECTRIC CONVERSION ELEMENT, AND THERMOELECTRIC CONVERSION MODULE

According to one embodiment, a thermoelectric material are provided. The thermoelectric material includes a sintered body formed of p-type and n-type thermoelectric materials for the thermoelectric conversion element. The thermoelectric materials have a MgAgAs type crystal structure as a main phase. An area ratio of internal defects of the thermoelectric materials for one thermoelectric conversion element is 10% or less in terms of a total area ratio of defective portions in a scanning surface according to ultrasonic flaw detection in a thickness direction of the thermoelectric material. No defect having a length of 800 μm or more is present at any vertex of chips of the thermoelectric materials. 1. A thermoelectric material comprising a sintered body formed of a p-type or an n-type thermoelectric material represented by a composition formula shown below and having a MgAgAs type crystal structure as a main phase , {'br': None, 'sub': a1', 'b1', 'c1', 'x', 'y', '100-x-y, '(TiZrHf)αβ'}, 'wherein an area ratio of internal defects by ultrasonic flaw detection in a thickness direction with respect to a surface parallel with one plane of the thermoelectric material is 10% or less, and no defect having a length of 800 μm or more is present in a surface of the thermoelectric material,'}where 0 Подробнее

POWER MODULE SUBSTRATE, POWER MODULE SUBSTRATE WITH HEAT SINK, POWER MODULE, METHOD OF MANUFACTURING POWER MODULE SUBSTRATE, AND COPPER MEMBER-BONDING PASTE

This power module substrate includes a copper plate that is formed of copper or a copper alloy and is laminated on a surface of a ceramic substrate a nitride layer that is formed on the surface of the ceramic substrate between the copper plate and the ceramic substrate and an Ag—Cu eutectic structure layer having a thickness of 15 μm or less that is formed between the nitride layer and the copper plate. 1. A power module substrate , comprising:{'sub': 3', '4, 'a ceramic substrate that is formed of AlN or SiNand has a first surface;'}a copper plate that is formed of copper or a copper alloy and is laminated and bonded on the first surface of the ceramic substrate;a nitride layer that contains at least one nitride of elements selected from Ti, Hf, Zr, and Nb and is formed on the first surface of the ceramic substrate between the copper plate and the ceramic substrate; andan Ag—Cu eutectic structure layer that has a thickness of 15 μm or less and is formed between the nitride layer and the copper plate;wherein the thickness of the Ag—Cu eutectic structure layer is measured by a method comprising:obtaining a backscattered electron image of an interface between the copper plate and the ceramic substrate using an EPMA;based on the backscattered electron image, measuring the area of the Ag—Cu eutectic structure layer continuously formed on the bonding interface in a measurement visual field at a magnification of 2000 times;dividing the area of the Ag—Cu eutectic structure layer by the width of the measurement visual field, andobtaining the average of the thicknesses in five measurement visual fields as the thickness of the Ag—Cu eutectic structure layer.2. The power module substrate according to claim 1 , wherein the ceramic substrate is formed of AlN claim 1 , andthe thickness of the Ag—Cu eutectic structure layer is 14 μm or less.3. The power module substrate according to claim 1 , wherein{'sub': 3', '4, 'the ceramic substrate is formed of SiNand'}the thickness of the Ag ...

COPPER-NICKEL-ZINC ALLOY CONTAINING SILICON

The invention includes a copper-nickel-zinc alloy with the following composition in weight %: Cu 47.0 to 49.0%, Ni 8.0 to 10.0%, Mn 0.2 to 0.6%, Si 0.05 to 0.4%, Pb 1.0 to 1.5%, Fe and/or Co up to 0.8%, the rest being Zn and unavoidable impurities, wherein the total of the Fe content and double the Co content is at least 0.1 weight % and wherein mixing silicides containing nickel, iron and manganese and/or containing nickel, cobalt and manganese are stored as spherical or ellipsoidal particles in a structure consisting of an α- and β-phase. The invention further relates to a method for producing semi-finished products from a copper-nickel-zinc alloy. 1. A copper-nickel-zinc alloy having the following composition [in % by weight]:Cu 47.0 to 49.0%,Ni 8.0 to 10.0%,Mn 0.2 to 0.6%,Si 0.05 to 0.4%,Pb 1.0 to 1.5%,Fe and/or Co up to 0.8%,remainder Zn and unavoidable impurities, wherein the sum total of the Fe content and twice the Co content is at least 0.1%, and wherein mixed silicides containing nickel, iron and manganese and/or mixed silicides containing nickel, cobalt and manganese are incorporated as spherical or ellipsoidal particles in a microstructure consisting of α and β phase.2. The copper-nickel-zinc alloy as claimed in claim 1 , characterized in that either the Fe content or the Co content is at least 0.1% by weight.3. The copper-nickel-zinc alloy as claimed in claim 1 , characterized in that the sum total of the Fe content and eight times the Co content is at least 0.4% by weight.4. The copper-nickel-zinc alloy as claimed in having the following composition [in % by weight]:Cu 47.0 to 49.0%,Ni 8.0 to 10.0%,Mn 0.2 to 0.6%,Si 0.05 to 0.4%,Pb 1.0 to 1.5%,Fe 0.2 to 0.8%,remainder Zn and unavoidable impurities,optionally up to 0.8% Co,wherein mixed silicides containing nickel, iron and manganese are incorporated as spherical or ellipsoidal particles in a microstructure consisting of α and β phase.5. The copper-nickel-zinc alloy as claimed in having the following ...

IMPROVED CO-PRODUCTION OF LEAD AND TIN PRODUCTS

Metal compositions and production processes are described. A process for the production of a metal composition includes a first distillation step separating off by evaporation primarily lead from a solder mixture of lead, tin, and antimony, thereby producing as a first concentrated lead stream. The process includes a second distillation step separating primarily lead and antimony from the metal composition, thereby producing a second concentrated lead stream and a second bottom product. The method also includes a third distillation step separating primarily lead and antimony from the second concentrated lead stream, thereby producing a third concentrated lead stream and a third bottom product. 1. A metal composition comprising , on a dry weight basis:at least 0.08%wt and at most 6.90%wt of lead (Pb);at least 0.50%wt and at most 3.80%wt of antimony (Sb);at least 92.00%wt and at most 98.90%wt of tin (Sn);at least 96.00%wt of tin, lead,. and antimony together;at least 1 ppm wt and at most 500 ppm wt of copper (Cu);at least 10 ppm wt and at most 0.0500%wt of silver (Ag);at most 0.40%wt of arsenic (As);at most 0.1% of the total of chromium (Cr), manganese (Mn), vanadium (V), titanium (Ti), and tungsten (W);at most 0.1% of aluminium (Al);at most 0.1% of nickel (Ni);at most 0.1% of iron (Fe); andat most 0.1% of zinc (Zn).2. The metal composition according to being a molten liquid.34-. (canceled)5. A process for the production of a soft lead product claim 1 , a hard lead product and a tin product claim 1 , the process comprising:a) providing a solder mixture comprising primarily major amounts of lead and tin, together with a minor amount of antimony;b) a first distillation step separating off by evaporation primarily lead from the solder mixture from step a), thereby producing as overhead product a first concentrated lead stream and a first bottom product enriched in tin, the first concentrated lead stream forming the basis for obtaining the soft lead product;{'claim-ref': ...

HIGH-ENTROPY HALF-HEUSLER THERMOELECTRIC MATERIAL WITH LOW LATTICE THERMAL CONDUCTIVITY AND PREPARATION METHOD THEREOF

The present invention provides a high-entropy Half-Heusler thermoelectric material with a low lattice thermal conductivity and a preparation method thereof. The general formula of the high-entropy Half-Heusler thermoelectric material with a low lattice thermal conductivity is ZrHfNiPdSn, where x is equal to 0.6 to 0.8, and y is equal to 0.8 to 0.9. The preparation method of the high-entropy Half-Heusler thermoelectric material with a low lattice thermal conductivity comprises the following steps: preparing and mixing materials according to the general formula of ZrHfNiPdSn, putting the mixed raw materials in a levitation melting for melting, grinding the obtained ingot into powder and drying it, and sintering the powder by using spark plasma sintering into a bulk high-entropy Half-Heusler thermoelectric material with a low lattice thermal conductivity. The high-entropy Half-Heusler thermoelectric material of the present invention has a relatively low lattice thermal conductivity and a relatively high ZT value. 1. A high-entropy Half-Heusler thermoelectric material with a low lattice thermal conductivity , wherein the general formula is ZrHfNiPdSn , wherein x is equal to 0.6 to 0.8 , and y is equal to 0.8 to 0.9.2. A preparation method of a high-entropy Half-Heusler thermoelectric material with a low lattice thermal conductivity , comprising the following steps: preparing and mixing materials according to the general formula of ZrHfNiPdSn , in which x is equal to 0.6 to 0.8 and y is equal to 0.8 to 0.9 , putting a mixture in a levitation melting furnace for melting , grinding the obtained ingot into powder and drying the powder , and sintering the powder by spark plasma sintering into a bulk high-entropy Half-Heusler thermoelectric alloy sample with a low lattice thermal conductivity.3. The preparation method of a high-entropy Half-Heusler thermoelectric material with a low lattice thermal conductivity according to claim 2 , comprising the following steps:{'sub': x', ...

LEAD-FREE SOLDER COMPOSITION

An electrical connector includes a first layer having a first coefficient of thermal expansion and a second layer overlaying the first layer having a second coefficient of thermal expansion. A first difference between the first coefficient of thermal expansion and a coefficient of thermal expansion of glass is greater than a second difference between the second coefficient of thermal expansion and the coefficient of thermal expansion of glass. The electrical connector further includes a layer of a solder alloy having about 15% to 28% indium by weight, about 5% to 20% zinc by weight, about 1% to 6% silver by weight, and at least 36% tin by weight. The solder layer is disposed on at least a portion of the second layer. 1. A solder alloy , consisting of:17% to 28% indium by weight;5% to 20% zinc by weight;1% to 6% silver by weight; anda remaining weight of the solder alloy being tin.2. (canceled)3. (canceled)4. The solder alloy according to claim 1 , wherein the solder alloy includes at least 55% tin by weight.5. The solder alloy according to claim 1 , wherein the solder alloy includes at least 60% tin by weight.6. The solder alloy according to claim 1 , wherein the solder alloy includes at least 64% tin by weight.7. (canceled)8. The solder alloy according to claim 1 , wherein the solder alloy includes about 17% to 20% indium by weight.9. (canceled)10. The solder alloy according to claim 1 , wherein the solder alloy includes about 18% indium by weight.11. The solder alloy according to claim 1 , wherein the solder alloy includes about 22% indium by weight.12. The solder alloy according to claim 1 , wherein the solder alloy includes about 24% indium by weight.13. (canceled)14. (canceled)15. The solder alloy according to claim 1 , wherein the solder alloy includes about 9% zinc by weight.16. The solder alloy according to claim 1 , wherein the solder alloy includes about 12% zinc by weight.17. The solder alloy according to claim 1 , wherein the solder alloy includes about ...

CHROMIUM-BASED TWO-PHASE ALLOY AND PRODUCT USING SAID TWO-PHASE ALLOY

There is provided a Cr-based two-phase alloy including two phases of a ferrite phase and an austenite phase that are mixed with each other. A chemical composition of the Cr-based two-phase alloy consists of a main component, an auxiliary component, impurities, a first optional auxiliary component, and a second optional auxiliary component. The main component consists of 33-61 mass % Cr, 18-40 mass % Ni and 10-33 mass % Fe, and a total content of the Ni and the Fe is 37-65 mass %. The auxiliary component consists of 0.1-2 mass % Mn, 0.1-1 mass % Si, 0.005-0.05 mass % Al, and 0.02-0.3 mass % Sn. The impurities include 0.04 mass % or less of P, 0.01 mass % or less of S, 0.03 mass % or less of C, 0.04 mass % or less of N, and 0.05 mass % or less of O. 1. A Cr-based two-phase alloy comprising two phases of a ferrite phase and an austenite phase that are mixed with each other , whereina chemical composition of the Cr-based two-phase alloy consists of a main component, an auxiliary component, impurities, a first optional auxiliary component, and a second optional auxiliary component,the main component consists of 33% by mass or more to 61% by mass or less of Cr, 18% by mass or more to 40% by mass or less of Ni, and 10% by mass or more to 33% by mass or less of Fe, and a total content of the Ni and the Fe is 37% by mass or more to 65% by mass or less,the auxiliary component consists of 0.1% by mass or more to 2% by mass or less of Mn, 0.1% by mass or more to 1% by mass or less of Si, 0.005% by mass or more to 0.05% by mass or less of Al, and 0.02% by mass or more to 0.3% by mass or less of Sn, andthe impurities contain more than 0% by mass to 0.04% by mass or less of P, more than 0% by mass to 0.01% by mass or less of S, more than 0% by mass to 0.03% by mass or less of C, more than 0% by mass to 0.04% by mass or less of N, and more than 0% by mass to 0.05% by mass or less of O.2. The Cr-based two-phase alloy according to claim 1 , whereinwhen the Cr-based two-phase alloy ...

THERMOELECTRIC CONVERSION MATERIAL, THERMOELECTRIC CONVERSION MODULE USING THE SAME, AND MANUFACTURING METHOD OF THE SAME

According to an embodiment, a thermoelectric conversion material is made of a polycrystalline material which is represented by a composition formula (1) shown below and has a MgAgAs type crystal structure. The polycrystalline material includes a MgAgAs type crystal grain having regions of different Ti concentrations. 1. A thermoelectric conversion material made of a polycrystalline material which is represented by a composition formula (1) shown below and has a MgAgAs type crystal structure , the polycrystalline material comprising: a MgAgAs type crystal grain having regions of different Ti concentrations ,{'br': None, 'sub': a', 'b', 'c', 'd', 'e, '(ATi)DX\u2003\u2003Composition formula (1)'}wherein 0.2≦a≦0.7, 0.3≦b≦0.8, a+b=1, 0.93≦c≦1.08, and 0.93≦e≦1.08 hold when d=1; A is at least one element selected from the group consisting of Zr and Hf, D is at least one element selected from the group consisting of Ni, Co, and Fe, and X is at least one element selected from the group consisting of Sn and Sb.2. The thermoelectric conversion material according to claim 1 , which comprises MgAgAs type crystal grains for which two or more peaks are present in a frequency graph in which a strength ratio of characteristic X-rays of Ti is plotted on a horizontal axis and a frequency for each strength of the characteristic X-rays of Ti is plotted on a vertical axis when the characteristic X-rays of Ti are measured at intervals of 0.2 μm in a MgAgAs type crystal grain on any cross section of the thermoelectric conversion material by EBSD (backscattering electron beam diffraction).3. The thermoelectric conversion material according to claim 1 , which comprises MgAgAs type crystal grains for which two or more peaks are present in a frequency graph in which a strength ratio of characteristic X-rays of Ti is plotted on a horizontal axis and a frequency for each strength of the characteristic X-rays of Ti is plotted on a vertical axis when the characteristic X-rays of Ti are measured at ...

THERMOELECTRIC CONVERSION MATERIAL AND THERMOELECTRIC CONVERSION MODULE USING THE SAME

The present invention provides a thermoelectric conversion material that is a material comprising elements less poisonous than Te and has a Seebeck coefficient comparable to BiTe. The present invention is a full-Heusler alloy that is represented by the composition formula FeTiSiand has σ, y, and z allowing the material to fall within the region surrounded by (Fe, Ti, Si)=(50, 37, 13), (50, 14, 36), (45, 30, 25), (39.5, 25, 35.5), (54, 21, 25), and (55.5, 25, 19.5) by at % in an Fe—Ti—Si ternary alloy phase diagram. 1. A thermoelectric conversion material wherein said thermoelectric conversion material is a full-Heusler alloy , is represented by the composition formula FeTiSi , and has σ , y , and z allowing the material to fall within the region surrounded by (Fe , Ti , Si)=(50 , 37 , 13) , (50 , 14 , 36) , (45 , 30 , 25) , (39.5 , 25 , 35.5) , (54 , 21 , 25) , and (55.5 , 25 , 19.5) {excluding (50 , 25 , 25)} by at % in an Fe—Ti—Si ternary alloy phase diagram.2. The thermoelectric conversion material according to claim 1 , wherein said full-Heusler alloy represented by the composition formula FeTiSihas σ claim 1 , y claim 1 , and z allowing the material to fall within the region surrounded by (Fe claim 1 , Ti claim 1 , Si)=(39.5 claim 1 , 25 claim 1 , 35.5) claim 1 , (47.5 claim 1 , 27.5 claim 1 , 25) claim 1 , (50 claim 1 , 17 claim 1 , 33) claim 1 , (50 claim 1 , 35 claim 1 , 15) claim 1 , (52.8 claim 1 , 25 claim 1 , 22.2) claim 1 , and (52.2 claim 1 , 22.8 claim 1 , 25) {excluding (50 claim 1 , 25 claim 1 , 25)} by at % in an Fe—Ti—Si ternary alloy phase diagram.3. The thermoelectric conversion material according to claim 2 , wherein the full-Heusler alloy represented by the composition formula FeTiSihas σ claim 2 , y claim 2 , and z allowing the material to fall within the region surrounded by (Fe claim 2 , Ti claim 2 , Si)=(41 claim 2 , 25 claim 2 , 34) claim 2 , (49.2 claim 2 , 25.8 claim 2 , 25) claim 2 , (50 claim 2 , 23 claim 2 , 27) claim 2 , (50 claim 2 ...

METAL PLATED OBJECT WITH BIOCIDAL PROPERTIES

A plated object wherein the plating material has biocidal properties. The plated object can be used in a food preparation or medical care facility. The plating material includes approximately 55% copper (plus or minus 10%), 35% tin (plus or minus 10%) and 10% zinc (plus or minus 5%) by weight. In another embodiment, the plating material includes approximately 45% copper, 45% tin and 10% zinc. A method of depositing the plating material is also disclosed. 1. A device for inhibiting the transmission of microorganisms , said device comprising:a metal object having a medical application adapted for use in an environment where the transmission of microorganisms is undesirable; and copper within a range of about 45% to about 50%;', 'tin within a range of about 40% to about 45%; and', 'zinc within a range of about 5% to about 10%., 'a metal plating disposed on the metal object and forming at least a portion of the exterior surface of the object, the metal plating comprising (by weight)2. (canceled)3. The device of further comprising a hydrophobic surface treatment layer disposed on the metal plating.4. (canceled)5. (canceled)6. The device of wherein the device comprises at least a portion of a stent.7. The device of wherein the device comprises at least a portion of a catheter.8. The device of wherein the device comprises at least a portion of a shunt.9. The device of wherein the device comprises at least a portion of a baclofen pump.10. The device of wherein the device is external orthopedic hardware.11. The device of further comprising a hydrophilic surface treatment layer disposed on the metal plating.12. (canceled)13. The device of wherein the device is a part of a piece of medical equipment.1418-. (canceled)19. The device of wherein the metal plating comprises approximately 45% copper claim 1 , approximately 45% tin and approximately 10% zinc.20. (canceled)21. The device of wherein the portion of the exterior surface of the object formed by the plating layer has a ...

CHIP ARRANGEMENTS

A chip arrangement including: a chip including a chip back side; a substrate including a surface with a plating; and a zinc-based solder alloy which attaches the chip back side to the plating on the surface of the substrate, the zinc-based solder alloy including, by weight, 1% to 30% aluminum, 0.5% to 20% germanium, and 0.5% to 20% gallium, wherein a balance of the zinc-based solder alloy is zinc. 1. A chip arrangement comprising:a chip comprising a chip back side;a substrate comprising a surface with a plating; anda zinc-based solder alloy which attaches the chip back side to the plating on the surface of the substrate, the zinc-based solder alloy comprising, by weight, 1% to 30% aluminum, 0.5% to 20% germanium, and 0.5% to 20% gallium, wherein a balance of the zinc-based solder alloy is zinc.2. The chip arrangement of claim 1 , wherein the zinc-based solder alloy comprises by weight 3% to 8% aluminum.3. The chip arrangement of claim 1 , wherein the zinc-based solder alloy comprises by weight 0.5% to 4% germanium.4. The chip arrangement of claim 1 , wherein the zinc-based solder alloy comprises by weight 0.5% to 4% gallium.5. The chip arrangement of claim 1 , wherein the zinc-based solder alloy further comprises at least one from the following group of materials: silver claim 1 , gold claim 1 , nickel claim 1 , platinum claim 1 , palladium claim 1 , vanadium claim 1 , molybdenum claim 1 , tin claim 1 , copper claim 1 , arsenic claim 1 , antimony claim 1 , niobium claim 1 , tantalum claim 1 , and/or any combination thereof claim 1 , by weight 0.001% to 10% of the zinc-based solder alloy.6. The chip arrangement of claim 1 , wherein the plating comprises at least one of nickel or nickel-phosphorous.7. The chip arrangement of claim 6 , wherein the substrate comprises one or more of copper claim 6 , nickel claim 6 , silver claim 6 , or ceramic.8. The chip arrangement of claim 7 , wherein the at least one of nickel or nickel-phosphorous in the plating provides a reduced ...

Imprinting Metallic Substrates at Hot Working Temperatures

The present invention relates to a method of forming an imprint on a metal substrate. The method comprises a step of providing a mold having a defined imprint surface pattern in the nano-sized or micro-sized range and a step of pressing the metal substrate against the mold at hot-working temperature to form a nano-sized or micro-sized imprint thereon. 1. A method for making an imprint on a metal substrate comprising the steps of:(a) providing a mold having a defined imprint surface pattern in the nano-sized or micro-sized range; and{'sub': m', 'm, '(b) pressing the metal substrate against the mold at hot working temperature to form a nano-sized or micro-sized imprint thereon, wherein the hot working temperature, in degrees Celsius (° C.), is greater than 0.5 T, wherein the Tis the melting point of the metal substrate in absolute temperature scale.'}2. The method of claim 1 , wherein the method does not comprise the use of a sacrificial material.3. The method of claim 2 , wherein the sacrificial material may be selected from the group consisting of binder claim 2 , resist claim 2 , protective films and any combination thereof.4. The method of claim 1 , wherein the metal substrate comprises a metal or metal alloy.5. The method of claim 4 , wherein the metal is selected from the group consisting of gallium claim 4 , indium claim 4 , tin claim 4 , bismuth claim 4 , cadmium claim 4 , lead claim 4 , zinc claim 4 , silver claim 4 , antimony claim 4 , iron claim 4 , nickel claim 4 , cobalt claim 4 , titanium claim 4 , aluminium claim 4 , magnesium and any mixture thereof.6. (canceled)7. The method of claim 5 , wherein the metal alloy comprises 40 to 50 wt % bismuth claim 5 , 20 to 30 wt % lead claim 5 , 5 to 15 wt % tin claim 5 , 0 to 12 wt % cadmium and 0 to 25 wt % indium claim 5 , wherein the total wt % of bismuth claim 5 , lead claim 5 , tin claim 5 , cadmium and indium combined is 100 wt %.8. The method of claim 1 , wherein the metal substrate is supported on a silicon ...

INERT ALLOY ANODE USED FOR ALUMINUM ELECTROLYSIS AND PREPARATION METHOD THEREFOR

An inert alloy anode for aluminum electrolysis contains Fe and Cu as primary components and further contains Sn; addition of the metal Sn contributes to formation of an oxide film with strong oxidization resistance and stable structure on the surface of the inert alloy anode and to improvement of the corrosion resistance of the anode; on this basis, the inert alloy anode further contains Ni, Al and Y, addition of the metal Al can prevent the primary metal components from being oxidized, and addition of the metal Y can control alloy to present a desired crystal form in the preparation process to achieve oxidization resistance. 1. An inert alloy anode for aluminum electrolysis , containing:Fe and Cu as primary components;wherein the inert alloy anode further contains Sn.2. The inert alloy anode according to claim 1 , wherein the mass ratio of Fe to Cu to Sn is (23-40): (36-60): (0.2-5) or (40.01-80): (0.01-35.9): (0.01-0.19).3. The inert alloy anode according to claim 1 , wherein the inert alloy anode further contains Ni.4. The inert alloy anode according to claim 3 , wherein the mass ratio of Fe to Cu to Ni to Sn is (23-40): (36-60): (14-28): (0.2-5) or (40.01-80): (0.01-35.9): (28.1-70): (0.01-0.19).5. The inert alloy anode according to claim 3 , being composed of Fe claim 3 , Cu claim 3 , Ni and Sn claim 3 , wherein the content of Fe is 23-40 wt % claim 3 , the content of Cu is 36-60 wt % claim 3 , the content of Ni is 14-28 wt % and the content of Sn is 0.2-5 wt % claim 3 , or the content of Fe is 40.01-71.88 wt % claim 3 , the content of Cu is 0.01-31.88 wt % claim 3 , the content of Ni is 28.1-59.97 wt % and the content of Sn is 0.01-0.19 wt %.6. The inert alloy anode according to claim 3 , further containing Al.7. The inert alloy anode according to claim 6 , being composed of Fe claim 6 , Cu claim 6 , Ni claim 6 , Sn and Al claim 6 , wherein the content of Fe is 23-40 wt % claim 6 , the content of Cu is 36-60 wt % claim 6 , the content of Ni is 14-28 wt % claim ...

BRAZING ALLOYS

The present invention relates to novel brazing filler metals comprising copper, silver, zinc, manganese and at least one metal selected from the group indium, gallium and tin, the brazing filler metal is free from cadmium and phosphorus, aside from unavoidable impurities, comprising copper, from 15.5 weight percent to 49 weight percent silver, from 10 weight percent to 35 weight percent zinc, from 6 weight percent to 19 weight percent manganese, from 0.1 weight percent to 5 weight percent of at least one metal selected from the group consisting of Indium, Gallium, Tin and combinations thereof, the balance being copper and unavoidable impurities, with the proviso that if the silver content is from 35 weight percent to 49 weight percent, the manganese content is more than 8 weight percent. The present invention further relates to a sandwich brazing filler metal, Use of the brazing filler metal, and a combination of a brazing filler metal with a flux and a method for joining metal parts by brazing, a brazed article. 1. A brazing filler metal that is free from cadmium and phosphorus , aside from unavoidable impurities , comprising copper , from 15.5 weight percent to 49 weight percent silver , from 10 weight percent to 35 weight percent zinc , from 6 weight percent to 19 weight percent manganese , from 0.1 weight percent to 5 weight percent of at least one metal selected from the group consisting of Indium , Gallium , Tin and combinations thereof , the balance being copper and unavoidable impurities , with the proviso that if the silver content is from 35 weight percent to 49 weight percent , the manganese content is more than 8 weight percent.2. The brazing filler metal of claim 1 , comprising 15.5 weight percent to 44 weight percent of silver.3. The brazing filler metal of claim 1 , comprising 15.5 weight percent to 24 weight percent of silver.4. The brazing filler metal of comprising 1 weight percent to 4 weight percent of the metal selected from the group consisting ...

HOT STAMPED STEEL

A hot stamped steel includes a base material, a plated layer that is formed on a surface of the base material, and an oxide film that is formed on a surface of the plated layer; chemical composition of the plated layer contains 20.00 to 45.00 mass % of Al, 10.00 to 45.00 mass % of Fe, 4.50 to 15.00 mass % of Mg, 0.10 to 3.00 mass % of Si, 0.05 to 3.00 mass % of Ca, 0 to 0.50 mass % of Sb, 0 to 0.50 mass % of Pb, 0 to 1.00 mass % of Cu, 0 to 1.00 mass % of Sn, 0 to 1.00 mass % of Ti, 0 to 0.50 mass % of Sr, 0 to 1.00 mass % of Cr, 0 to 1.00 mass % of Ni, and 0 to 1.00 mass % of Mn with a remainder of Zn and impurities; and chemical composition of the oxide film contains 20.0 to 55.0 at % of Mg, 0.5 to 15.0 at % of Ca, 0 to 15.0 at % of Zn, and 0 at % or more and less than 10.0 at % of Al with a remainder of O and a total of 5.0 at % or less of impurities, and the adhesion amount of the oxide film per one surface is in a range of 0.01 to 10 g/m. 1. A hot stamped steel comprising:a base material that is formed of steel;a plated layer that is formed on a surface of the base material; andan oxide film that is formed on a surface of the plated layer,wherein chemical composition of the plated layer contains 20.00 to 45.00 mass % of Al, 10.00 to 45.00 mass % of Fe, 4.50 to 15.00 mass % of Mg, 0.10 to 3.00 mass % of Si, 0.05 to 3.00 mass % of Ca, 0 to 0.50 mass % of Sb, 0 to 0.50 mass % of Pb, 0 to 1.00 mass % of Cu, 0 to 1.00 mass % of Sn, 0 to 1.00 mass % of Ti, 0 to 0.50 mass % of Sr, 0 to 1.00 mass % of Cr, 0 to 1.00 mass % of Ni, and 0 to 1.00 mass % of Mn with a remainder of Zn and impurities,a chemical composition of the oxide film contains 20.0 to 55.0 at % of Mg, 0.5 to 15.0 at % of Ca, 0 to 15.0 at % of Zn, and 0 at % or more and less than 10.0 at % of Al with a remainder of O and a total of 5.0 at % or less of impurities, and{'sup': '2', 'an adhesion amount of the oxide film per one surface is in a range of 0.01 to 10 g/m.'}2. The hot stamped steel according to ...

High Entropy Alloy Having Composite Microstructure and Method of Manufacturing the Same

A method of making a metallic alloy, more particularly, a high-entropy alloy with a composite structure that exhibits high strength and good ductility, and is used as a component material in electromagnetic, chemical, shipbuilding, machinery, and other applications, and in extreme environments, and the like. 1. A method of manufacturing a high-entropy alloy having a composite structure , comprising:preparing metallic elements comprising, by weight %, Fe greater than 5% to 35% or less, Mn greater than 5% to 35% or less, Ni greater than 5% to 35% or less, and Co greater than 5% to 35% or less, and comprising at least one of Cu greater than 3% to 40% or less and Ag greater than 3% to 40% or less;manufacturing an alloy by melting the metallic elements having been prepared in one of casting, arc melting, and powder metallurgy methods;homogenization heat treating the alloy having been manufactured; andcooling the alloy after the homogenization heat treating.2. The method of manufacturing a high-entropy alloy having a composite structure of claim 1 , wherein the homogenization heat treating is performed while the alloy is maintained in a temperature range of 900° C. to 1200° C. for 1 hour to 48 hours.3. The method of manufacturing a high-entropy alloy having a filamentary composite structure of claim 1 , further comprising:performing deformation processing,wherein the deformation processing includes hot working, rolling, drawing, at room temperature and elevated temperatures. This application is a divisional of application Ser. No. 15/455,649, filed Mar. 10, 2017, which claims the benefit of Korean Patent Application No. 10-2016-0029570, filed on Mar. 11, 2016, the disclosures of which are hereby incorporated in their entirety by reference.The present disclosure relates to a metal alloy for a component material used in electromagnetic, chemical, shipbuilding, machinery, and other applications, in addition to components, structural materials, and the like, used in an ...

SUPER ELASTIC ZIRCONIUM ALLOY FOR BIOLOGICAL USE, MEDICAL INSTRUMENT AND GLASSES

Provided is a super elastic alloy for biological use having a high biocompatibility, good processability and super elasticity, said super elastic alloy being a super elastic zirconium alloy for biological use comprising 27-54 mol % inclusive of titanium, 5-9 mol % inclusive of niobium which is a β phase-stabilizing element capable of stabilizing the β phase of zirconium, and 1-4 mol % inclusive in total of tin and/or aluminum which are ω phase-suppressing elements capable of suppressing the ω phase of zirconium, with the balance consisting of zirconium and inevitable impurities. 1. A super-elastic zirconium alloy for living tissues , comprises:titanium within a range of 27 mol %˜54 mol %;niobium within a range of 5 mol %-9 mol %, serving as a β phase stabilizing element for stabilizing the β phase of zirconium;at least one of tin and aluminum within a range of 1 mol %˜4mol %, serving as a ω phase inhibiting element for inhibiting the ω phase of zirconium;zirconium, which accounts for the remaining portion;inevitable impurities.2. A medical appliance claim 1 , made of the super-elastic zirconium alloy for living tissues according to .3. An eyeglasses claim 1 , having a frame made of the super-elastic zirconium alloy for living tissues according to . This application claims priority to PCT Application No. PCT/JP2012/005387, having a filing date of Aug. 28, 2012, the entire contents of which are hereby incorporated by reference.The present invention relates to a super-elastic zirconium alloy for living tissues, and medical appliance and eyeglasses that utilize the super-elastic zirconium alloy for living tissues.A variety of alloys for living tissues are used in surgeries and implants in the medical field.For example, Ti—Ni alloys have advantages such as high strength, wear resistance, corrosion resistance, and high compatibility with living tissues, etc., and are used as materials for living tissues in various medical appliances.However, Ti—Ni light alloys have poor ...

NICKEL TITANIUM ALLOYS, METHODS OF MANUFACTURE THEREOF AND ARTICLE COMPRISING THE SAME

Disclosed herein is a shape memory alloy comprising 45 to 50 atomic percent nickel; and 1 to 30 atomic percent of at least one metalloid selected from the group consisting of germanium, antimony, zinc, gallium, tin, and a combination of one or more of the foregoing metalloids, with the remainder being titanium. The shape memory alloy may further contain aluminum. Disclosed herein too is a method of manufacturing the shape memory alloy. 1. A shape memory alloy comprising:45 to 50 atomic percent nickel; and1 to 30 atomic percent of at least one metalloid selected from the group consisting of germanium, antimony, zinc, gallium, tin, indium, bismuth, and a combination of one or more of the foregoing metalloids, with the remainder being titanium.2. The shape memory alloy of claim 1 , where the at least one metalloid is antimony claim 1 , gallium or tin.3. The shape memory alloy of claim 1 , where the shape memory alloy has the formula NiTiM claim 1 , where M is the at least one metalloid and x can have an integer or non-integer value of from 1 to 30.4. The shape memory alloy of claim 3 , where x has values of 1 claim 3 , 2 claim 3 , 3 claim 3 , 4 claim 3 , 5 claim 3 , 6 claim 3 , 7 claim 3 , 8 claim 3 , 9 claim 3 , 10 claim 3 , 11 claim 3 , 12 claim 3 , 13 claim 3 , 15 claim 3 , 17 claim 3 , 18 claim 3 , 19 claim 3 , 20 claim 3 , 21 claim 3 , 22 claim 3 , 23 claim 3 , 24 claim 3 , 25 claim 3 , 26 claim 3 , 27 claim 3 , 28 claim 3 , 29 and 30 atomic percent.5. The shape memory alloy of claim 1 , where the titanium is initially present in an amount of 45 to 50 atomic percent.6. The shape memory alloy of claim 1 , where the alloy displays a compressive strength of 1 claim 1 ,000 to 3 claim 1 ,000 MPa at a compressive strain of 1.5 to 5%.7. The shape memory alloy of claim 1 , where the alloy has precipitates that have an average particle size of 1 to 100 nanometers.8. The shape memory alloy of claim 1 , where the alloy further comprises aluminum.9. A method of manufacturing ...

MULTILAYERED SINTERED PLATE AND MANUFACTURING METHOD THEREOF

A manufacturing apparatus has a leveler which, while pulling out a steel plate starting with one end thereof and while transporting it, corrects the waviness and the like of the steel plate, which serves as a backing plate and is constituted by a continuous strip having a thickness of 0.3 to 2.0 mm and provided as a hoop material by being wound into a coil shape. 1. A multilayered sintered plate comprising: a backing plate; and a porous sintered alloy layer which is integrally joined to one surface of said backing plate , wherein said porous sintered alloy layer is composed of 30 to 50% by mass of nickel , 1 to 10% by mass of phosphorus , 2.5 to 10% by mass of tin , and the balance iron and inevitable impurities , and has a structure which includes a matrix phase containing an iron-nickel-tin alloy and a hard phase precipitated in the matrix phase and containing a nickel-phosphorus-iron-tin alloy.2. The multilayered sintered plate according to claim 1 , wherein the matrix phase has a micro Vickers hardness (HMV) of at least 220 claim 1 , and the hard phase has a micro Vickers hardness (HMV) of at least 700.3. The multilayered sintered plate according to claim 1 , wherein the backing plate is comprised of a ferritic claim 1 , austenitic claim 1 , or martensitic stainless steel plate claim 1 , and the one surface of said backing plate is one surface of the stainless steel plate.4. The multilayered sintered plate according to claim 1 , wherein said backing plate is comprised of a ferritic claim 1 , austenitic claim 1 , or martensitic stainless steel plate and of a nickel coating covering at least one surface of the stainless steel plate claim 1 , and the one surface of said backing plate is one surface of the nickel coating.5. The multilayered sintered plate according to claim 1 , wherein said backing plate is comprised of a rolled steel plate for general structure or a cold rolled steel plate claim 1 , and the one surface of said backing plate is one surface of the ...

METHOD FOR PRODUCING A THERMOELECTRIC OBJECT FOR A THERMOELECTRIC CONVERSION DEVICE

A method for producing a thermoelectric object for a thermoelectric conversion device is provided. A starting material which has elements in the ratio of a half-Heusler alloy is melted and then cooled to form at least one ingot. The ingot is homogenized at a temperature of 1000° C. to 1400° C. for a period of time t, wherein 0.5 h≦t<12 h or 24 h Подробнее

Ag-Pd-Cu-Co ALLOY FOR USES IN ELECTRICAL/ELECTRONIC DEVICES

The present invention is to provide metal material for electric/electronic devices, which is comprised of 20 to 50 mass % of Ag or 20 to 50 mass % of Pd to 10 to 40 mass % of Cu, 5 to 30 mass % of Co, said alloy has low contact resistance, good oxidation resistance, high hardness, good workability, and low wettability and anti-erosion property to Sn alloy solder. 1. A metal material for use in an electric/electronic device , the metal material comprising an alloy which contains 20 to 50 mass % of Ag , 20 to 50 mass % of Pd , 10 to 40 mass % of Cu and 0.5 to 30 mass % of Co , in which the metal material has low wettability to Sn alloy solder and anti-erosion property to Sn alloy solder.2. The metal material according to claim 1 , wherein the alloy further comprises 0.1 to 10 mass % of Au.3. The metal material according to or claim 1 , wherein the alloy further comprises 0.1 to 3.0 mass % of at least one additive element selected from the group consisting of Ni claim 1 , Pt claim 1 , Re claim 1 , Rh claim 1 , Ru claim 1 , Si claim 1 , Sn claim 1 , Zn claim 1 , B claim 1 , In claim 1 , Nb and Ta.4. The metal material according to or claim 1 , which has a hardness of 200-450 HV after being subjected to plastic working and at the time of precipitation hardening.5. The metal material according to claim 3 , which has a hardness of 200-450 HV after being subjected to plastic working and at the time of precipitation hardening. The present invention relates to a metal material for use in electric/electronic devices.For a metal material used in electric/electronic devices, various properties such as low contact resistance and good oxidation resistance are required, and therefore, expensive noble metal alloys such as a Pt alloy, an Au alloy, a Pd alloy and an Ag alloy are widely used. In addition, depending on the intended use (for example, an inspection probe for a semiconductor integrated circuit and the like), hardness (abrasive resistance) and the like are also required in ...

Negative electrode active material

Provided is a negative electrode active material that can improve the capacity per volume and charge-discharge cycle characteristics of a nonaqueous electrolyte secondary battery represented by a lithium ion secondary battery. The negative electrode active material according to the present embodiment contains an alloy phase. The alloy phase undergoes thermoelastic diffusionless transformation when releasing or occluding metal ions. The negative electrode active material of the present embodiment is used in a nonaqueous electrolyte secondary battery. Thermoelastic diffusionless transformation refers to so-called thermoelastic martensitic transformation.

Field-effect transistor, method for manufacturing same, and sputtering target

A field effect transistor including: a substrate, and at least gate electrode, a gate insulating film, a semiconductor layer, a protective layer for the semiconductor layer, a source electrode and a drain electrode provided on the substrate, wherein the source electrode and the drain electrode are connected with the semiconductor layer therebetween, the gate insulating film is between the gate electrode and the semiconductor layer, the protective layer is on at least one surface of the semiconductor layer, the semiconductor layer includes an oxide containing In atoms, Sn atoms and Zn atoms, the atomic composition ratio of Zn/(In+Sn+Zn) is 25 atom % or more and 75 atom % or less, and the atomic composition ratio of Sn/(In+Sn+Zn) is less than 50 atom %.

High-temperature lead-free solder alloy

Provided is a high-temperature lead-free solder alloy having excellent tensile strength and elongation in a high-temperature environment of 250° C. In order to make the structure of an Sn—Sb—Ag—Cu solder alloy finer and cause stress applied to the solder alloy to disperse, at least one material selected from the group consisting of, in mass %, 0.003 to 1.0% of Al, 0.01 to 0.2% of Fe, and 0.005 to 0.4% of Ti is added to a solder alloy containing 35 to 40% of Sb, 8 to 25% of Ag, and 5 to 10% of Cu, with the remainder made up by Sn.

THERMOELECTRIC ARTICLE AND COMPOSITE MATERIAL FOR A THERMOELECTRIC CONVERSION DEVICE AND PROCESS FOR PRODUCING A THERMOELECTRIC ARTICLE

A thermoelectric article and process for producing a thermoelectric article for a thermoelectric conversion device is provided. The thermoelectric article has an overall composition consisting essentially of 6 atom %≤Ti≤27 atom %, 6 atom %≤Zr≤27 atom %, 0 atom %≤Hf≤1.7 atom %, where 28 atom %≤(Ti+Zr+Hf)≤38 atom %; 1. A thermoelectric article for a thermoelectric conversion device having an overall composition consisting essentially of6 atom %≤Ti≤27 atom %,6 atom %≤Zr≤27 atom %,0 atom %≤Hf≤1.7 atom %,where 28 atom %≤(Ti+Zr+Hf)≤38 atom %;28 atom %≤Sn≤38 atom %,0 atom %≤Sb≤3 atom %,where 28 atom %≤(Sn+Sb)≤38 atom %;0 atom %≤A≤7 atom %,0 atom %≤B≤7 atom %, where A is one or more of the elements selected from the group consisting of Sc, Y and La, B is one or more of the elements selected from the group consisting of V, Nb and Ta and 0.15 atom %≤A+B≤7 atom %;the rest being Ni and up to 5 atom % impurities.2. A thermoelectric article according to claim 1 , wherein the thermoelectric article comprises at least one phase with a half-Heusler structure.3. A thermoelectric article according to claim 2 , wherein the phase with the half-Heusler structure comprises less than 0.2 atom % of one or more of the elements A and B.4. A thermoelectric article according to claim 2 , wherein the composition of the phases with the half-Heusler structure is defined by the chemical formula TiZrNiSnSb claim 2 , where 0≤a≤1 and 0≤b≤0.1.5. A thermoelectric article according to claim 1 , wherein the thermoelectric article comprises one or more A-rich phases without a half-Heusler structure and one or more B-rich phases without a half-Heusler structure.6. A thermoelectric article according to claim 1 , wherein the overall composition is ABTiZrHfNiSnSb claim 1 , where0≤x≤0.2, 0≤y≤0.2, 0.005≤(x+y)≤0.2,0.2≤a1≤0.8, 0.2≤a2≤0.8, 0≤a3≤0.05, 0.9≤(a1+a2+a3)≤1.1,0≤b≤0.1 and0.9≤(b+c)≤1.1.7. A thermoelectric article according to claim 6 , wherein x=y.8. A thermoelectric article according to claim 1 , the ...

SOLDER MATERIAL AND ELECTRONIC COMPONENT

A solder material includes an alloy of at least five elements including Sn, Cu, Sb, and In, and 20 mass % or less of Ag. The solidus temperature of the solder material is higher than 290° C., the liquidus temperature of the solder material is 379° C. or less and is higher than the solidus temperature, and the temperature difference between the liquidus temperature and the solidus temperature is 70° C. or less. 1. A solder material , comprising:an alloy of at least five elements including Sn, Cu, Sb, In, and 20 mass % or less of Ag, whereina solidus temperature of the solder material is higher than 290° C., a liquidus temperature of the solder material is 379° C. or less and is higher than the solidus temperature, and a temperature difference between the liquidus temperature and the solidus temperature is 70° C. or less.2. The solder material according to claim 1 , whereinthe solder material includes 25 to 45 mass % of Sn, 30 to 40 mass % of Sb, 3 to 8 mass % of Cu, 3 to 9 mass % of In, a remaining portion of Ag, and inevitable impurities.3. The solder material according to claim 1 , whereinthe solder material includes Si and Ti, and respective contents of Si and Ti are 0.1 mass % or less.4. The solder material according to claim 1 , wherein the solder material includes at least one of Zn or Pd claim 1 , and respective contents of Zn and Pd are 0.1 mass % or less.5. The solder material according to claim 1 , whereinthe solder material includes 36 to 40 mass % of Sn, 34 to 38 mass % of Sb, 4 to 6 mass % of Cu, 4 to 6 mass % of In, a remaining portion of Ag, and inevitable impurities.6. The solder material according to claim 1 , whereinthe solder material includes a paste mixed with a flux.7. The solder material according to claim 1 , whereinthe solder material is in a form of a preform that is punched out after the solder material is processed into a metal foil.8. An electronic component for mounting on a circuit board claim 1 , comprisinga container that houses an ...

Copper-based alloy for the production of bulk metallic glasses

The present invention relates to an alloy which has the following composition: Cu 47 at %−(x+y+z) (Ti a Zr b ) c Ni 7 at %+x Sn 1 at %+y Si z where c=43-47 at %, a=0.65-0.85, b=0.15-0.35, where a+b=1.00; x=0-7 at %; y=0-3 at %, z=0-3 at %, where y+z≤4 at %.

Hydrogen Storage Alloys

Hydrogen storage alloys comprising a) at least one main phase, b) a storage secondary phase and c) a catalytic secondary phase, where the weight ratio of the catalytic secondary phase abundance to the storage secondary phase abundance is ≧3; or comprising a) at least one main phase, b) from 0 to about 13.3 wt % of a storage secondary phase and c) a catalytic secondary phase, where the alloy comprises from 0.05 at % to 0.98 at % of one or more rare earth elements; or comprising a) at least one main phase, b) from 0 to about 13.3 wt % of a storage secondary phase and c) a catalytic secondary phase, where the alloy comprises for example i) one or more elements selected from the group consisting of Ti, Zr, Nb and Hf and ii) one or more elements selected from the group consisting of V, Cr, Mn, Ni, Sn, Al, Co, Cu, Mo, W, Fe, Si, Sn and rare earth elements, where the atomic ratio of ii) to i) is from about 1.80 to about 1.98, exhibit improved electrochemical properties, for instance improved low temperature electrochemical performance. 1. A hydrogen storage alloy comprising at least one main phase and at least one secondary phase , where the main phase or phases in total are present at a higher abundance by weight than each of the secondary phases ,where the alloy comprises from about 0.05 at % to about 0.98 at % of one or more rare earth elements andwhich alloy exhibits an improvement of surface catalytic ability at{'sub': 2', '12.0', '21.5', '10.0', '7.5', '8.1', '32.2', '0.3', '0.4', '8.0, '−40° C., defined as the product of charge transfer resistance (R) and double layer capacitance (C), of at least 10%, relative to the ABalloy TiZrVCrMnNiSnAlCo; and/or'}which exhibits a charge transfer resistance at −40 C of ≦60 Ω·g; and/orwhich exhibits a surface catalytic ability at −40° C., defined as the product of charge transfer resistance (R) and double layer capacitance (C), of ≦30 seconds.2. An alloy according to comprisinga) at least one main phase,b) optionally a storage ...

Hydrogen Storage Alloys

Hydrogen storage alloys comprising a) at least one main phase, b) a storage secondary phase and c) a catalytic secondary phase, where the weight ratio of the catalytic secondary phase abundance to the storage secondary phase abundance is ≧3; or comprising a) at least one main phase, b) from 0 to about 13.3 wt % of a storage secondary phase and c) a catalytic secondary phase, where the alloy comprises from 0.05 at % to 0.98 at % of one or more rare earth elements; or comprising a) at least one main phase, b) from 0 to about 13.3 wt % of a storage secondary phase and c) a catalytic secondary phase, where the alloy comprises for example i) one or more elements selected from the group consisting of Ti, Zr, Nb and Hf and ii) one or more elements selected from the group consisting of V, Cr, Mn, Ni, Sn, Al, Co, Cu, Mo, W, Fe, Si, Sn and rare earth elements, where the atomic ratio of ii) to i) is from about 1.80 to about 1.98, exhibit improved electrochemical properties, for instance improved low temperature electrochemical performance. 1. A hydrogen storage alloy which exhibits{'sub': 2', '12.0', '21.5', '10.0', '7.5', '8.1', '32.2', '0.3', '0.4', '8.0, 'an improvement of surface catalytic ability at −40° C., defined as the product of charge transfer resistance (R) and double layer capacitance (C), of at least 10%, relative to the ABalloy TiZrVCrMnNiSnAlCo; and/or'}a charge transfer resistance at −40° C. of ≦60 Ω·g; and/ora surface catalytic ability at −40° C., defined as the product of charge transfer resistance (R) and double layer capacitance (C), of ≦30 seconds.2. An alloy according to which exhibitsa charge transfer resistance at −40° C. of ≦30 Ω·g; and/ora surface catalytic ability at −40° C. of ≦8.0 seconds.3. An alloy according to comprising at least one main phase and at least one secondary phase claim 1 , where the main phase or phases in total are present at a higher abundance by weight than each of the secondary phases.4. An alloy according to comprisinga) at ...

Hydrogen Storage Alloys

Hydrogen storage alloys comprising a) at least one main phase, b) a storage secondary phase and c) a catalytic secondary phase, where the weight ratio of the catalytic secondary phase abundance to the storage secondary phase abundance is ≧3; or comprising a) at least one main phase, b) from 0 to about 13.3 wt % of a storage secondary phase and c) a catalytic secondary phase, where the alloy comprises from 0.05 at % to 0.98 at % of one or more rare earth elements; or comprising a) at least one main phase, b) from 0 to about 13.3 wt % of a storage secondary phase and c) a catalytic secondary phase, where the alloy comprises for example i) one or more elements selected from the group consisting of Ti, Zr, Nb and Hf and ii) one or more elements selected from the group consisting of V, Cr, Mn, Ni, Sn, Al, Co, Cu, Mo, W, Fe, Si, Sn and rare earth elements, where the atomic ratio of ii) to i) is from about 1.80 to about 1.98, exhibit improved electrochemical properties, for instance improved low temperature electrochemical performance.

Hydrogen Storage Alloys

Hydrogen storage alloys comprising a) at least one main phase, b) a storage secondary phase and c) a catalytic secondary phase, where the weight ratio of the catalytic secondary phase abundance to the storage secondary phase abundance is ≧3; or comprising a) at least one main phase, b) from 0 to about 13.3 wt % of a storage secondary phase and c) a catalytic secondary phase, where the alloy comprises from 0.05 at % to 0.98 at % of one or more rare earth elements; or comprising a) at least one main phase, b) from 0 to about 13.3 wt % of a storage secondary phase and c) a catalytic secondary phase, where the alloy comprises for example i) one or more elements selected from the group consisting of Ti, Zr, Nb and Hf and ii) one or more elements selected from the group consisting of V, Cr, Mn, Ni, Sn, Al, Co, Cu, Mo, W, Fe, Si, Sn and rare earth elements, where the atomic ratio of ii) to i) is from about 1.80 to about 1.98, exhibit improved electrochemical properties, for instance improved low temperature electrochemical performance. 1. A hydrogen storage alloy , comprisinga) at least one main phase,b) a storage secondary phase andc) a catalytic secondary phase,where the weight ratio of the catalytic secondary phase abundance to the storage secondary phase abundance is ≧3 andwhere the main phase or phases in total are present at a higher abundance by weight than each of the secondary phases,{'sub': 2', '12.0', '21.5', '10.0', '7.5', '8.1', '32.2', '0.3', '0.4', '8.0, 'which alloy exhibits an improvement of surface catalytic ability at −40° C., defined as the product of charge transfer resistance (R) and double layer capacitance (C), of at least 10%, relative to the ABalloy TiZrVCrMnNiSnAlCo; and/or'}which exhibits a charge transfer resistance at −40° C. of ≦60 Ω·g; and/orwhich exhibits a surface catalytic ability at −40° C., defined as the product of charge transfer resistance (R) and double layer capacitance (C), of ≦30 seconds.2. An alloy according to comprisingi) one ...

Negative Electrode Active Material for Electrical Device

A negative electrode active material having high cycle durability contains an alloy represented by the following chemical formula (1): 2. The negative electrode active material for an electric device according to claim 1 , wherein the z is more than 27 and less than 61.3. The negative electrode active material for an electric device according to claim 2 , wherein the y is less than 24 and the z is more than 38.4. The negative electrode active material for an electric device according to claim 2 , wherein the x is 24 or more and less than 38.5. An electric device comprising the negative electrode active material for an electric device set forth in . This application is a divisional application of U.S. patent application Ser. No. 14/897,451 filed on Dec. 10, 2015, which claims priority to Japanese Patent Application No. 2013-123989, filed on Jun. 12, 2013, both of which are herein incorporated by reference.The present invention relates to a negative electrode active material for an electric device and an electric device using the same. The negative electrode active material for an electric device of the present invention and the electric device using the same are used, in the form of a secondary battery, a capacitor, or the like, as a power source or an auxiliary power source for driving a motor of vehicles like an electric vehicle, a fuel cell vehicle, and a hybrid electric vehicle.In recent years, to cope with air pollution or global warming, reducing the amount of carbon dioxide is strongly desired. In the automobile industry, reducing the amount of carbon dioxide emission by introducing an electric vehicle (EV) or a hybrid electric vehicle (HEV) is attracting attention, and thus development of an electric device like a secondary battery for driving a motor, which plays a key role in commercialization, is actively under progress.Compared to a consumer lithium ion secondary battery for a cellular phone, a notebook computer or the like, the motor-driving secondary ...

MIXED ALLOY SOLDER PASTE

A solder paste consists of an amount of a first solder alloy powder between 44 wt % to less than 60 wt %; an amount of a second solder alloy powder between greater than 0 wt % and 48 wt %; and a flux; wherein the first solder alloy powder comprises a first solder alloy that has a solidus temperature above 260° C.; and wherein the second solder alloy powder comprises a second solder alloy that has a solidus temperature that is less than 250° C. In another implementation, the solder paste consists of an amount of a first solder alloy powder between 44 wt % and 87 wt %; an amount of a second solder alloy powder between 13 wt % and 48 wt %; and flux. 1. A solder paste , consisting of:an amount of a first solder alloy powder between 44 wt % to less than 60 wt %;an amount of a second solder alloy powder between greater than 0 wt % and 48 wt %; andflux;wherein the first solder alloy powder comprises a first solder alloy that has a solidus temperature above 260° C.; andwherein the second solder alloy powder comprises a second solder alloy that has a solidus temperature that is less than 250° C.2. The solder paste of claim 1 , wherein the second solder alloy has a solidus temperature between 230° C. and 250° C.3. The solder paste of claim 2 , wherein the second solder alloy comprises a Sn alloy claim 2 , a Sn—Sb alloy claim 2 , or a Sn—Sb—X (X═Ag claim 2 , Al claim 2 , Au claim 2 , Bi claim 2 , Co claim 2 , Cu claim 2 , Ga claim 2 , Ge claim 2 , In claim 2 , Mn claim 2 , Ni claim 2 , P claim 2 , Pd claim 2 , Pt claim 2 , or Zn) alloy.4. The solder paste of claim 1 , wherein the second solder alloy has a solidus temperature between 200° C. and 230° C.5. The solder paste of claim 4 , wherein the second solder alloy comprises a Sn—Ag alloy claim 4 , a Sn—Cu alloy claim 4 , a Sn—Ag—X (X═Al claim 4 , Au claim 4 , Bi claim 4 , Co claim 4 , Cu claim 4 , Ga claim 4 , Ge claim 4 , In claim 4 , Mn claim 4 , Ni claim 4 , P claim 4 , Pd claim 4 , Pt claim 4 , Sb claim 4 , or Zn) alloy ...

Shape Memory Alloy Conductor That Resists Plastic Deformation

A conductor that resists plastic deformation is provided for an electronic signal-carrying or electric power-carrying cable, cable assembly, or device. The conducting element itself has favorable mechanical properties and therefore combines plastic deformation resistance with conductance. In one embodiment, the superelastic conductor is fabricated using a shape memory alloy such that the transformation temperature of the superelastic conductor is set outside the useful operating range of the conductor. In another embodiment, the conductor is fabricated using a shape memory alloy that is nominally in a martensitic phase under stress free conditions. In both embodiments, the conductor microstructures are able to accommodate externally applied strain, bending, deformation, or other external displacement through mechanisms which do not involve plastic deformation. 1. A superelastic conductor comprising a shape memory alloy material that has an electrical resistivity less than 500 nano-ohm-meters and is configured to carry a data signal or to supply electrical power , or both.2. The conductor of that carries a direct current or alternating current waveform having a voltage in the range from about 0V to about 10V and a current in the range from 0 to about 20 milliamps.3. The conductor of that is capable of transmitting a signal having a frequency in the range from DC to about 10 GHz.4. The conductor of that is capable of carrying a digitally encoded signal.5. The conductor of that is capable of carrying a voltage of 100V or more.6. The conductor of that has a cross-sectional dimension in the range from about 10 micrometers to about 10 claim 1 ,000 micrometers.7. The conductor of claim 1 , wherein the material is substantially in an austenitic phase when stress free.8. The conductor of claim 1 , wherein the material is substantially in an austenitic phase when stress free but transforms to a substantially martensitic phase when subjected to gross or localized bending claim ...

LEAD FREE SOLDER COMPOSITION WITH HIGH DUCTILITY

A lead free solder composition is disclosed and includes: 0.02% to 6% by weight stibium, 0.03% to 3% by weight copper, 0.03% to 8% by weight bismuth, 42% to 70% by weight indium, 0.3% to 8% by weight silver, 5% to 11% by weight magnesium, 0.8% to 1.6% by weight scandium, 0.7% to 2.0% by weight yttrium, and 10% to 45% by weight tin. The lead free solder composition of the invention has a solidus temperature no lower than 120° C., has good ductility and stability, and hence is suitable for soldering electrical connectors onto the metalized surface on the glass.

NEGATIVE ELECTRODE FOR ELECTRIC DEVICE AND ELECTRIC DEVICE USING THE SAME

The negative electrode for an electric device includes a current collector and an electrode layer containing a negative electrode active material, a conductive auxiliary agent and a binder and formed on a surface of the current collector, wherein the negative electrode active material contains an alloy represented by the following formula (1): SiTiMA(in the formula (1), M is at least one metal selected from the group consisting of Ge, Sn, Zn and a combination thereof, A is inevitable impurities, and x, y, z and a represent mass percent values and satisfy the conditions of 0 Подробнее

SINTERED SLIDING MEMBER HAVING EXCEPTIONAL CORROSION RESISTANCE, HEAT RESISTANCE, AND WEAR RESISTANCE; AND METHOD FOR PRODUCING SAID MEMBER

A sintered sliding material with excellent corrosion resistance, heat resistance, and wear resistance is provided. The sintered sliding material has a composition made of: 36-86 mass % of Ni; 1-11 mass % of Sn; 0.05-1.0 mass % of P; 1-9 mass % of C; and the Cu balance including inevitable impurities. The sintered sliding material is made of a sintered material of a plurality of grains of alloy of Ni—Cu alloy or Cu—Ni alloy, the Ni—Cu alloy and the Cu—Ni alloy containing Sn, P, C, and Si; has a structure in which pores are dispersedly formed in grain boundaries of the plurality of the grains of alloy; and as inevitable impurities in a matrix constituted from the grains of alloy, a C content is 0.6 mass % or less and a Si content is 0.15 mass % or less. 1. A sintered sliding material with excellent corrosion resistance , heat resistance , and wear resistance comprising:36-86 mass % of Ni;1-11 mass % of Sn;0.05-1.0 mass % of P;1-9 mass % of C; andthe Cu balance including inevitable impurities, whereinthe sintered sliding material is made of a sintered material of a plurality of grains of alloy of Ni—Cu alloy or Cu—Ni alloy, the Ni—Cu alloy and the Cu—Ni alloy containing Sn, P, C, and Si,the sintered material has a structure in which pores are dispersedly formed in grain boundaries of the plurality of the grains of alloy, andas inevitable impurities in a matrix constituted from the grains of alloy, a C content is 0.6 mass % or less and a Si content is 0.15 mass % or less.2. The sintered sliding material with excellent corrosion resistance claim 1 , heat resistance claim 1 , and wear resistance according to claim 1 , wherein a Ni content in the sintered material is 40 mass % or more and 80 mass % or less.3. The sintered sliding material with excellent corrosion resistance claim 1 , heat resistance claim 1 , and wear resistance according to claim 1 , wherein a Ni content in the sintered material is 45 mass % or more and 70 mass % or less.4. The sintered sliding material ...

COPPER-NICKEL-ZINC ALLOY AND USE THEREOF

The invention relates to a copper-nickel-zinc alloy with the following composition in weight percentages: 46.0 to 51.0% Cu, 8.0 to 11.0% Ni, 0.2 to 0.6% Mn, 0.05 to 0.5% Si, up to 0.8% of each of Fe and/or Co, the sum of the Fe content and double the Co content equaling at least 0.1 wt. %, residual Zn, and unavoidable impurities, wherein nickel-, iron-, and manganese-containing and/or nickel-, cobalt-, and manganese-containing mixed silicides are embedded into a microstructure consisting of α- and β-phases as spherical or ellipsoidal particles. The invention further relates to uses of a copper-nickel-zinc alloy according to the invention. 1. A copper-nickel-zinc alloy having the following composition [in % by weight]:Cu from 46.0 to 51.0%,Ni from 8.0 to 11.0%,Mn from 0.2 to 0.6%,Si from 0.05 to 0.5%,Fe and/or Co in each case up to 0.8%,where the sum of Fe content and twice the Co content is at least 0.1%,balance Zn and unavoidable impurities,wherein nickel-, iron- and manganese-containing and/or nickel-, cobalt- and manganese-containing mixed silicides are embedded as spherical or ellipsoidal particles in a microstructure consisting of α and β phase.2. The copper-nickel-zinc alloy as claimed in having the following composition [in % by weight]:Cu from 47.5 to 49.5%,Ni from 8.0 to 10.0%,Mn from 0.2 to 0.6%,Si from 0.05 to 0.4%,Fe from 0.2 to 0.8%,optionally up to 0.8% of Co,balance Zn and unavoidable impurities,wherein nickel-, iron- and manganese-containing mixed silicides are embedded as spherical or ellipsoidal particles in a microstructure consisting of a and p phase.3. The copper-nickel-zinc alloy as claimed in having the following composition [in % by weight]:Cu from 47.5 to 49.5%,Ni from 8.0 to 10.0%,Mn from 0.2 to 0.6%,Si from 0.05 to 0.4%,Co from 0.1 to 0.8%,optionally up to 0.8% of Fe,balance Zn and unavoidable impurities,wherein nickel-, cobalt- and manganese-containing mixed silicides are embedded as spherical or ellipsoidal particles in a microstructure ...

THERMOELECTRIC CONVERSION MATERIAL

There is provided a thermoelectric conversion material made of a full-Heusler alloy and capable of enhancing figure of merit. In order to solve the above problem, the thermoelectric conversion material is made of the full-Heusler alloy represented by the following composition formula: (FeM1)(TiM2)(AM3). A composition in a ternary phase diagram of Fe—Ti-A is inside a hexagon having points (50, 37, 13), (45, 30, 25), (39.5, 25, 35.5), (50, 14, 36), (54, 21, 25), and (55.5, 25, 19.5) as apexes. Further, an amount of change ΔVEC of an average valence electron number per atom VEC in the case of x=y=z=0 satisfies a relation 0<|ΔVEC|≤0.2 or 0.2<|ΔVEC|≤0.3. 1. A thermoelectric conversion material made of p-type or n-type full-Heusler alloy represented by a composition formula (Chemical Formula 1) below:{'br': None, 'sub': 1-x', 'x', '2+σ', '1-y', 'y', '1+φ', '1-z', 'z', '1+ω, '(FeM1)(TiM2)(AM3)\u2003\u2003(Chemical Formula 1),'}wherein the A is at least one element selected from a group including Si and Sn,the M1 and the M2 are at least one element selected from a group including Cu, Nb, V, Al, Ta, Cr, Mo, W, Hf, Ge, Ga, In, P, B, Bi, Zr, Mn, and Mg,the M3 is at least one element selected from a group including Cu, Nb, V, Al, Ta, Cr, Mo, W, Hf, Ge, Ga, In, P, B, Bi, Zr, Mn, Mg, and Sn,when the σ, the φ, and the ω satisfy a relation σ+φ+ω=0, andthe x, the y, and the z satisfy relations x=0, y=0, and z=0, respectively, contents of Fe, Ti, and A in the alloy represented by the composition formula (Chemical Formula 1) are u at %, v at %, and w at %, respectively, andwhen a composition of the alloy in a ternary phase diagram of Fe—Ti-A is represented by a point (u, v, w),the point (u, v, w) is located in a region inside a hexagon having points (50, 37, 13), (45, 30, 25), (39.5, 25, 35.5), (50, 14, 36), (54, 21, 25), and (55.5, 25, 19.5) as apexes in the ternary phase diagram,when a valence electron number of the M1 is m1,a valence electron number of the M2 is m2, anda valence ...

RARE EARTH PERMANENT MAGNETIC MATERIAL AND METHOD OF PREPARING THE SAME

A rare earth permanent magnetic material contains a main phase of R1R2FeCoB, and an auxiliary phase including a first auxiliary phase of R3R4FeCoBMand a second auxiliary of R5R6FeCoBM. Each of R1, R3 and R5 is Pr and/or Nd. Each of R2, R4 and R6 is at least one of Dy, Tb and Ho. M is at least one of Zr, Ga, Cu, Nb, Sn, Mo, Al, V, W, Si, Hf, Ti, Zn, Bi, Ta and In. 26 wt %≦x1+y1≦34 wt %, 0.01 wt %≦y1≦4 wt %, 0≦z1≦6 wt %, and 0.78 wt %≦u1≦1.25 wt %. 35 wt %≦x2+y2≦82 wt %, 5 wt %≦y2≦42 wt %, 0≦z2≦40 wt %, 0≦u2≦1.25 wt %, and 0≦v1≦10 wt %. 10 wt %≦x3+y3≦32 wt %, 0≦y3≦4.8 wt %, 0≦z3≦40 wt %, 0≦u3≦1.25 wt %, and 31 wt %≦v2≦50 wt %. 1. A rare earth permanent magnetic material comprising:{'sub': x1', 'y1', '1-x1-y1-z1-u1', 'z1', 'u1, 'a main phase represented by R1R2FeCoB, wherein R1 is at least one element selected from Pr and Nd; R2 is at least one element selected from Dy, Tb and Ho; x1, y1, z1 and u1 are weight percentages, 26%≦x1+y1≦34%, 0.01%≦y1≦4%, 0≦z1≦6%, and 0.78%≦u1≦1.25%; and'}an auxiliary phase separated from or cladding the main phase, comprising a first auxiliary phase and a second auxiliary, wherein{'sub': x2', 'y2', '1-x2-y2-z2-u2-v1', 'z2', 'u2', 'v1, 'the first auxiliary phase is represented by R3R4FeCoBM, where R3 is at least one element selected from Pr and Nd; R4 is at least one element selected from tho group consisting of Dy, Tb and Ho; M is at least one element selected from Zr, Ga, Cu, Nb, Sn, Mo, Al, V, W, Si, Hf, Ti, Zn, Bi, Ta and In; x2, y2, z2, u2 and v1 are weight percents, 35%≦x2+y2≦82%, 5%≦y2≦42%, 0≦z2≦40%, 0≦u2≦1.25%, and 0≦v1≦10%; and'}{'sub': x3', 'y3', '1-x3-y3-z3-u3-v2', 'z3', 'u3', 'v2, 'the second auxiliary phase is represented by R5R6FeCoBMwhere R5 is at least one element selected from Pr and Nd; R6 is at least one element selected from Dy, Tb and Ho; M is at least one element selected from Zr, Ga, Cu, Nb, Sn, Mo, Al, V, W, Si, Hf, Ti, Zn, Bi, Ta and In; x3, y3, z3, u3 and v2 are weight percentages, 10%≦x3+v3≦32%. 0≦y3≦4.8%, 0≦z3≦40 ...

Negative electrode for electric device and electric device using the same

The negative electrode for an electric device includes a current collector and an electrode layer containing a negative electrode active material, an electrically-conductive auxiliary agent and a binder and formed on a surface of the current collector, wherein the negative electrode active material contains an alloy represented by the following formula (1): Si x Sn y M z A a (in the formula (1), M is at least one metal selected from the group consisting of Al, V, C and a combination thereof, A is inevitable impurities, and x, y, z and a represent mass percent values and satisfy the conditions of 0<x<100, 0<y<100, 0<z<100, 0≦a<0.5, and x+y+z+a=100), and the binder contains a resin having an E elastic modulus of greater than 1.00 GPa and less than 7.40 GPa.

ALLOY AND LITHIUM ION BATTERY

Provided is an alloy comprising eight or more types of constituent elements, wherein the relative difference in terms of distance between nearest neighbors DNN between a constituent element having the largest distance between nearest neighbors DNN when constituting a bulk crystal from a single element and a constituent element having the smallest distance between nearest neighbors DNN when constituting a bulk crystal from a single element is 9% or less, the number of constituent elements having the same crystal structure when constituting a bulk crystal from a single element is not more than 3, and the difference in concentration between the constituent element having the highest concentration and the constituent element having the lowest concentration is 2 at. % or lower. 1. An alloy comprising eight or more types of constituent elements , wherein{'sub': NN', 'NN', 'NN, 'a relative difference in terms of nearest neighbor interatomic distances Dbetween a constituent element having the largest nearest neighbor interatomic distance Dwhen constituting a bulk crystal from a single element and a constituent element having the smallest nearest neighbor interatomic distance Dwhen constituting a bulk crystal from a single element is 9% or less,'}the number of constituent elements having the same crystal structure when constituting a bulk crystal from a single element is not more than 3, anda difference in concentration between the constituent element having the highest concentration and the constituent element having the lowest concentration is 2 at. % or lower.2. The alloy according to claim 1 , wherein the number of constituent elements having the same crystal structure when constituting a bulk crystal from the single element is not more than 2.3. The alloy according to claim 2 , whereinthe number of the constituent elements is 8, andthe concentration of the constituent elements is 11.5 to 13.5 at. %.4. The alloy according to claim 3 ,wherein the constituent elements are ...

CHIP ARRANGEMENTS

A chip arrangement including a chip comprising a chip back side; a back side metallization on the chip back side, the back side metallization including a plurality of layers; a substrate comprising a surface with a metal layer; a zinc-based solder alloy configured to attach the back side metallization to the metal layer, the zinc-based solder alloy having by weight 8% to 20% aluminum, 0.5% to 20% magnesium, 0.5% to 20% gallium, and the balance zinc; wherein the metal layer is configured to provide a good wettability of the zinc-based solder alloy on the surface of the substrate. The plurality of layers may include one or more of a contact layer configured to contact a semiconductor material of the chip back side; a barrier layer; a solder reaction, and an oxidation protection layer configured to prevent oxidation of the solder reaction layer. 1. A chip arrangement comprising:a chip comprising a chip back side;a back side metallization on the chip back side, the back side metallization comprising a plurality of layers;a substrate comprising a surface with a metal layer;a zinc-based solder alloy configured to attach the back side metallization to the metal layer, the zinc-based solder alloy having by weight 8% to 20% aluminum, 0.5% to 20% magnesium, 0.5% to 20% gallium, and the balance zinc;wherein the metal layer is configured to provide a good wettability of the zinc-based solder alloy on the surface of the substrate.2. The chip arrangement of claim 1 , wherein the zinc-based solder alloy is represented by the chemical formula ZnAlGaMg.3. The chip arrangement of claim 1 , wherein the zinc-based solder alloy is represented by the chemical formula ZnAlGaMg.4. The chip arrangement of claim 1 , wherein the substrate is formed by a material selected from a group of materials consisting of:lead;copper;nickel;silver; anda ceramic.5. The chip arrangement of claim 1 , wherein the metal layer comprises at least one of: silver claim 1 , gold claim 1 , nickel claim 1 , platinum ...

Ceramic Copper Circuit Board And Semiconductor Device Based On The Same

According to one embodiment, a ceramic copper circuit board a ceramic substrate, a copper circuit board provided at one surface of the ceramic substrate. A ratio of a thickness of the copper circuit board to a thickness of the ceramic substrate is 1.25 or more. A number of grain boundaries is not less than 5 and not more than 250 along every 10-mm straight line drawn in a front surface of the copper circuit board. 1. A ceramic copper circuit board , comprising:a ceramic substrate; anda copper circuit board provided at one surface of the ceramic substrate,a ratio of a thickness of the copper circuit board to a thickness of the ceramic substrate being 1.25 or more,a number of grain boundaries being not less than 5 and not more than 250 along every 10-mm straight line drawn in a front surface of the copper circuit board.2. The ceramic copper circuit board according to claim 1 , wherein the number of grain boundaries is not less than 20 and not more than 150 along every 10-mm straight line drawn in the front surface of the copper circuit board.3. The ceramic copper circuit board according to claim 1 , wherein the number of grain boundaries is not less than 80 and not more than 150 along every 10-mm straight line drawn in the front surface of the copper circuit board.4. The ceramic copper circuit board according to claim 1 , whereinan arithmetic average roughness Ra of the front surface of the copper circuit board is 0.4 μm or less,a ten-point average roughness Rzjis of the front surface is 4 μm or less, anda maximum height Rz of the front surface is 5 μm or less.5. The ceramic copper circuit board according to claim 1 , whereinan arithmetic average roughness Ra of the front surface of the copper circuit board is not less than 0.1 μm and not more than 0.4 μm,a ten-point average roughness Rzjis of the front surface is not less than 1.5 μm and not more than 4 μm, anda maximum height Rz of the front surface is not less than 1 μm and not more than 5 μm.6. The ceramic copper ...

SOLDER ALLOY AND SOLDER COMPOSITION

A solder alloy includes 18 wt % to 28 wt % of indium, 44.5 wt % to 54.5 wt % of bismuth, greater than 0 wt % and not more than 1.45 wt % of zirconium, and the balance being tin, based on 100 wt % of the solder alloy. 1. A solder alloy , comprising: 18 wt % to 28 wt % of indium , 44.5 wt % to 54.5 wt % of bismuth , greater than 0 wt % and not more than 1.45 wt % of zirconium , and the balance being tin , based on 100 wt % of said solder alloy.2. The solder alloy as claimed in claim 1 , wherein said zirconium is present in an amount ranging from 0.01 wt % to 1.45 wt % based on 100 wt % of said solder alloy.3. The solder alloy as claimed in claim 2 , wherein said zirconium is present in an amount of 0.5 wt % based on 100 wt % of said solder alloy.4. The solder alloy as claimed in claim 1 , which has a melting point ranging between 55° C. and 130° C.5. A solder composition claim 1 , comprising: 0 wt % to 10 wt % of copper claim 1 , 0 wt % to 10 wt % of silver claim 1 , 0 wt % to 10 wt % of nickel claim 1 , 0 wt % to 10 wt % of tin claim 1 , 10 wt % to 15 wt % of flux and the balance being a solder alloy of claim 1 , based on 100 wt % of said solder composition claim 1 , with the proviso that said copper claim 1 , silver claim 1 , nickel and tin are not 0 wt % simultaneously.6. The solder composition as claimed in claim 5 , wherein said solder alloy includes zirconium in an amount ranging from 0.01 wt % to 1.45 wt % based on 100 wt % of said solder alloy.7. The solder composition as claimed in claim 6 , wherein said zirconium is present in an amount of 0.5 wt % based on 100 wt % of said solder alloy.8. The solder composition as claimed in claim 5 , wherein said solder alloy has a melting point ranging between 55° C. and 130° C. This application claims priority of Taiwanese Patent Application No. 106117314, filed on May 25, 2017, which is incorporated by reference as if fully set forth.The disclosure relates to a solder alloy and a solder composition, and more ...

Negative Electrode Active Material for Electric Device and Electric Device Using the Same

A negative electrode active material which has a ternary alloy composition represented by Si—Sn-M (M is one or two or more transition metal elements) and has a microstructure which has a first phase (silicide phase) having a silicide of a transition metal as a main component and a second phase partially containing Sn and having amorphous or low crystalline silicon as a main component, and further has partially a plurality of independent first phases and partially a eutectic structure of the first phase and the second phase is used for an electric device. The negative electrode active material improves cycle durability of an electric device such as a lithium ion secondary battery. 1. A negative electrode active material for an electric device , which comprises: {'br': None, 'sub': x', 'y', 'z', 'a, 'SiSnMA\u2003\u2003(I)'}, 'a silicon-containing alloy having a composition represented by the following Chemical Formula (1)wherein A represents an unavoidable impurity, M represents one or two or more transition metal elements, x, y, z, and a represent a percent by mass, and 0 Подробнее

METHOD OF MANUFACTURING THERMOELECTRIC CONVERSION MATERIAL

A method of manufacturing a thermoelectric conversion material expressed by a chemical formula XTZ(X comprises one or more elements selected from Zr, Hf, Y, La, Nb, and Ta, while including at least Zr or Hf; T comprises one or more elements selected from Ni, Co, Cu, Rh, Pd, Ir, and Pt, while including at least Ni; Z comprises one or more elements selected from Sb, Ge, and Sn, while including at least Sb), the method comprising: preparing materials containing elements, which are the X including selected elements, the T including selected elements, and the Z including selected elements; forming an alloy A by melting the materials containing the all selected elements except for Sb; and forming an alloy B by melting the alloy A and the material containing Sb. 1. A method of manufacturing a thermoelectric conversion material expressed by a chemical formula XTZ(X is composed of one or more elements selected from Zr , Hf , Y , La , Nb , and Ta , while including at least Zr or Hf; T is composed of one or more elements selected from Ni , Co , Cu , Rh , Pd , Ir , and Pt , while including at least Ni; Z is composed of one or more elements selected from Sb , Ge , and Sn , while including at least Sb) , the method comprising:preparing materials containing elements, which are one or more elements selected from Zr, Hf, Y, La, Nb, and Ta, while including at least Zr or Hf, one or more elements selected from Ni, Co, Cu, Rh, Pd, Ir, and Pt, while including at least Ni, and one or more elements selected from Sb, Ge, and Sn, while including at least Sb;forming an alloy A by melting the materials containing desired elements selected from Zr, Hf, Y, La, Nb, Ta, Ni, Co, Cu, Rh, Pd, Ir, Pt, Ge, and Sn; andforming an alloy B by melting the alloy A and the material containing Sb.2. The method of manufacturing a thermoelectric conversion material according to claim 1 , wherein the step of forming the alloy A is performed by any one of an arc melting method claim 1 , an electromagnetic ...

BRAZING ALLOY

The present invention relates to new brazing alloys containing copper, silver, zinc, manganese, and indium, and a method for their production and their use. 1. A brazing alloy consisting of 25 to 33 wt % silver , 15 to 25 wt % zinc , 6 wt % to 14 wt % manganese , 0.25 wt % to 4 wt % nickel , 0.5 wt % to 4 wt % indium , 0 to 1.5 wt % tin and/or gallium , 0 to 1 wt % cobalt , 0 to 0.5 wt % germanium , 20 to 53.5 wt % copper , and—as unavoidable contaminants—aluminum in quantities of up to 0.001 wt % , phosphorus , magnesium , or calcium , as well as other alkali and alkaline earth metals , in respective quantities of up to 0.008 wt % , cadmium , selenium , tellurium , tin , antimony , bismuth , and arsenic in respective quantities of up to 0.01 wt % , lead up to 0.025 wt % , sulfur up to 0.03 wt % , silicon up to 0.05 wt % , and iron in quantities of up to 0.15 wt % , wherein the quantity amounts to up to 0.5 wt % , and wherein the quantities of the components add up to 100 wt % in total.2. Brazing alloy according to claim 1 , containing 26 to 30 wt % silver claim 1 , 17 to 23 wt % zinc claim 1 , 8 wt % to 12 wt % manganese claim 1 , 0.25 wt % to 2 wt % nickel claim 1 , and 1 wt % to 3 wt % indium.3. Brazing alloy according to claim 1 , containing 27 to 29 wt % silver claim 1 , 18 to 22 wt % zinc claim 1 , 9 wt % to 11 wt % manganese claim 1 , 0.5 wt % to 1.5 wt % nickel claim 1 , and 1.5 wt % to 2.5 wt % indium.4. Brazing alloy according to claim 1 , containing 0.1 to 1.5 wt % tin and/or gallium claim 1 , and/or 0.1 to 1 wt % cobalt and/or 0.1 to 0.5 wt % germanium.5. A brazing combination comprising a brazing alloy according to and a flux.6. A method for joining metal components comprising the steps ofproviding a base material;providing a part that is to be joined to the base material;arranging the base material and the part in contact with one another in a way suitable for brazing;{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'arranging the brazing alloy ...

METAL ALLOYS INCLUDING COPPER

The present invention relates to matter alloys including copper. 1. An alloy consisting of:and wherein the alloy has entropy of mixing (ΔS) of at least 1.1 R when calculated according to: This application is a continuation of U.S. patent application Ser. No. 15/522,099 filed Apr. 26, 2017, and entitled “METAL ALLOYS INCLUDING COPPER,” which is a U.S. national stage of International Application Serial No. PCT/AU2015/050670 filed Oct. 27, 2015, which claims priority to Australian Patent Application No. 2014904315 filed Oct. 28, 2014, the benefit of which is claimed and the disclosure of which is incorporated herein by reference in its entirety.Metal alloys including copper are disclosed. The alloys have a similar variety of applications to brass and bronze alloys.The current role of typical brasses and bronzes in the world today is extensive. Some examples include house keys (sometimes chrome plated), the key-ring they are on, the domestic door hinges, door knobs and all their internal lock mechanisms, bathroom fixtures (which are typically chromed or polished brass), clothes and bags zippers, electronics connection hardware, gears in gear motors, automotive and personal electronic device bezels, badges, military munitions and highly corrosion resistant marine fixtures. Brasses are even the largest constituent of world coin currencies.All brasses and bronzes can be chrome or nickel plated with ease for further decorative or corrosion resistant applications.Typical brasses consist predominantly of copper and zinc, with practical alloy compositions being in the range of copper 60 to 80 weight % and zinc 20-40 weight % with minor additions of lead and aluminium possible (from 1-5 weight %).Typical bronzes are generally much higher in copper content and consist of 90-95 weight % copper, with small additions of tin, aluminium and sometimes silver.It would be advantageous to reduce the cost of components formed of copper-based alloys in the existing range of applications. ...

一种金刚石珩磨砂条及其制备工艺

一种金刚石珩磨砂条及其制作工艺，所述珩磨砂条由如下质量百分比的各原料制成：铝粉：2.0‑2.3%；铁粉：10‑12%；钴粉：8‑10%；铜粉：40‑45%；银粉：1.8‑2.2%；锡粉：14‑14.5%；锌粉：5‑8%；其余为D76粒度的金刚石微粒。本发明珩磨砂条寿命长，磨削力稳定，金刚石微粒脱落均匀，确保了珩磨网纹的稳定性。使用本发明珩磨砂条很容易保证网纹参数合格；且珩磨砂条在珩磨气缸套时锋利、自锐性好、加工效率高；气缸套内孔不出现金属折叠、网纹不均匀等缺陷；使用此珩磨砂条加工的气缸套，发动机机油耗低。

A electronic equipment and PCB with a solder alloy

개시된 전자기기 및 인쇄회로기판은, Cu 0.05 내지 2.0중량%, Ni 0.001 내지 2.0중량%, P 0.001 내지 1.0 중량% 및 나머지가 Sn으로 이루어진 4원 합금으로 조성된 무연솔더합금으로 각 종 전자부품 및 전자회로 등을 납땜함으로써, 산화 및 브릿지 불량을 대폭 감소시킬 수 있다. The disclosed electronic devices and printed circuit boards are made of lead-free solder alloy composed of quaternary alloy consisting of Cu 0.05 to 2.0% by weight, Ni 0.001 to 2.0% by weight, P 0.001 to 1.0% by weight, and the rest of the electronic components, and By soldering an electronic circuit or the like, oxidation and bridge defects can be greatly reduced.

一种铝基金刚石复合材料elid磨削用砂轮及其制备方法

本发明公开了一种铝基金刚石复合材料ELID磨削用砂轮及其制备方法，该砂轮的磨料为金刚石或立方氮化硼粉末，砂轮金属结合剂成分为：45％～50％的铁粉，40％～45％的铜粉，5～15％的钴、镍、钛、锡、银等添加剂，采用热压真空烧结。工艺包括以下步骤：将金刚石或立方氮化硼按100％～180％浓度配料后与铁粉、铜粉及金属添加剂放在一起混合搅拌均匀，然后进行热压成型压制，压制压力为18MPa。压制完成后，放入真空烧结炉烧结6～7小时。烧结完成后，冷却至25～35℃后脱模并修型修整，得到本发明的砂轮。本发明解决了铝基金刚石复合材料在磨削加工过程中砂轮磨损和堵塞严重、加工效率低、加工表面缺陷较多，难以实现精密加工等加工难题。

含钒和锆元素的珩磨油石及其制备方法

本发明提供了一种含钒和锆元素的珩磨油石及其制备方法，涉及精密机械加工技术领域，所述珩磨油石主要由钒、锆、铜、银、铝、锌、锡、铁、镍、钴、铅、粘结剂和超硬材料等组成，本发明提供的珩磨油石解决了现有技术中由单一磨料组成的珩磨油石，由于其单一的磨削特性，对一些难加工材料，其磨削效果并不很理想，使用上有一定的局限性，以及国外进口的多元素混合式珩磨油石虽然能达到很好的磨削加工效果，但其使用寿命短，价格高昂的问题，本发明制备出的珩磨油石达到了自锐性优、磨削锋利、磨削质量高、磨削速度快、耐高温，使用寿命长的技术效果。

含钇元素的珩磨油石、制备方法及其应用

本发明涉及精密加工制造领域，具体而言，提供了一种含钇元素的珩磨油石、制备方法及其应用。所述含钇元素的珩磨油石，包括以下重量份的原料：钇0.1‑1份、铜20‑60份、银1‑6份、铝1‑10份、锌1‑6份、锡5‑20份、铁5‑20份、镍1‑10份、钴1‑20份、铅1‑9份、粘结剂1‑5份和超硬材料5‑20份。该含钇元素的珩磨油石具有磨削锋利、磨削质量高、磨削速度快、使用寿命长和自锐性优的优点。

一种易切削锌白铜及其制备方法和应用

本发明公开了一种易切削锌白铜，其重量百分比组成为：Cu:42.5～47.5wt%、Ni:8.0～12.0wt%、Mn:4.0～8.0wt%、Bi:0.05～1.5wt%，余量为Zn和不可避免的杂质。该易切削锌白铜可以加工成棒、线等产品，其制备工艺流程包括：熔铸→挤压→拉伸→中间退火→拉伸→成品前退火→拉伸→成品。该易切削锌白铜利用β相提升合金强度的同时提高切削性能，使Bi在较低的含量情况下达到与铅锌白铜相近的切削性能，该易切削锌白铜的抗拉强度≥550MPa，切削性能达到铅锌白铜C79860的80%以上，能够满足家用电器、通讯设备、医用设备、检测和控制仪器、运动器材、制笔等行业的需求。

一种切削用耐磨金属刀片

本发明揭示了一种切削用耐磨金属刀片，由铁、钛、钼、钒、铬、锰以及锡七种金属成分组成，所述切削用耐磨金属刀片中各成分所占重量份数分别为：所述铁占60‑72份，所述钛占20‑25份，所述钼占10‑14份，所述钒占8‑11份，所述铬占15‑19份，所述锰占18‑22份，所述锡占13‑17份。本发明采用铁、钛、钼、钒、铬、锰以及锡七种金属成分组成，具有耐磨性强，耐高温性好，方便切割，使用寿命长。

含铜金属合金

本发明涉及含铜金属合金。

Ni-fe-cr-based alloy and engine valve coated with same

내충격성과 내마모성, 내고온부식성을 구비하고, 게다가 풍부한 자원이고 저렴한 Fe를 함유하는 표면경화 합금을 제공한다. Mo를 0∼20.0질량%, W를 8.0∼40.0질량% 함유하고, Mo와 W의 합계량이 20.0∼40.0질량%인 것, Fe를 20.0∼50.0질량%, Cr를 12.0∼36.0질량%, B를 1.0∼2.5질량% 함유하고, 잔부가 Ni 및 불가피 불순물로 이루어지는 것을 특징으로 하는 Ni-Fe-Cr계 합금과 그것이 덧씌워진 엔진밸브. 상기의 Ni-Fe-Cr계 합금은 추가로, Co, Mn, Cu, Si, C으로부터 선택되는 원소를 합계로 15.0질량% 이하 함유할 수도 있다. 이때, Co가 15.0질량% 이하, Mn, Cu가 각각 5.0질량% 이하, Si가 2.0질량% 이하, C이 0.5질량% 이하인 것이 바람직하다.

Hydrogen storage alloy, hydrogen separation membrane, hydrogen storage tank, and hydrogen storage / release method

A hydrogen storage alloy includes a composition defined by the following formula (Ca1-XLX)(Li1-Y-ZMYNiZ)m, wherein the L denotes one or more elements selected from the group consisting of Na, K, Rb, Cs, Mg, Sr, Ba, Sc, Ti, Zr, Hf, V, Nb, Ta, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, and Lu, the M denotes one or more elements selected from the group consisting of Cr, Mo, W, Mn, Fe, Ru, Co, Ir, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd, B, Al, Ga, In, Si, Ge, Sn, Pb, Sb, Bi, and S, and the mole ratios X, Y, Z, and m respectively satisfy the following 0<X&nlE;0.4, 0&nlE;Y&nlE;0.4, 0.1&nlE;Z&nlE;0.4, and 1.8&nlE;m&nlE;2.2.

The method of the supper-fast preparation high-performance ZrNiSn block thermoelectric material of one step

本发明涉及一种一步超快速制备高性能ZrNiSn块体热电材料的方法，其特征是在氩气气氛保护下，以Zr粉、Ni粉及Sn粉为起始原料，采用钨极氩弧焊等引发其化学反应，然后在数秒内原位快速加压，得到高性能ZrNiSn块体热电材料。本发明具有反应速度快、工艺简单、高效节能等优点，整个过程在5min内完成，所得产品热电性能优异，热电优值在900K时可达0.64，为其大规模工业化应用奠定了重要基础。

Stainless steel for metal foil, stainless steel foil and manufacturing method thereof

질량%로, 0.0001% 이상 0.15% 이하의 C, 0.30% 이상 2.0% 이하의 Si, 0.1% 이상 15% 이하의 Mn, 0.040% 이하의 P, 5% 이상 30% 이하의 Ni, 0.0001% 이상 0.01% 이하의 S, 16% 이상 25% 이하의 Cr, 5% 이하의 Mo, 0.005% 이하의 Al, 0.0030% 이하의 Ca, 0.0010% 이하의 Mg, 0.0010% 이상 0.0060% 이하의 O, 0.0001% 이상 0.5% 이하의 N를 함유하고, 잔부 Fe 및 불가피한 불순물로 이루어지고, 0.010 ㎜ 이상 0.2 ㎜ 이하의 두께에 있어서, 최대 원 상당 직경 5㎛ 이상의 개재물이 0.5개/㎟ 이하인, 표면 성상이 우수한 금속 박용 스테인레스강, 스테인레스강 박 및 그것들의 제조 방법.

Negative electrode active material for electric device

본 발명의 전기 디바이스용 부극 활물질은, 27질량% 이상 100질량% 미만의 Si와, 0질량% 초과 73질량% 이하의 Sn과, 0질량% 초과 73질량% 이하의 V를 함유하고, 잔량부가 불가피 불순물인 합금을 갖는다. 당해 부극 활물질은, 예를 들어 Si, Sn 및 V를 타깃으로 하고, 다원 DC 마그네트론 스퍼터 장치를 사용함으로써 얻을 수 있다. 그리고, 본 발명의 부극 활물질을 적용한 전기 디바이스는, 사이클 수명이 향상되고, 용량 및 사이클 내구성이 우수하다. The negative electrode active material for an electric device of the present invention contains 27 mass% or more and less than 100 mass% of Si, 0 mass% or more and 73 mass% or less of Sn, 0 mass% or more and 73 mass% or less of V, And an alloy which is inevitable impurities. The negative electrode active material can be obtained by using, for example, a target of Si, Sn and V, and using a multi-source DC magnetron sputtering apparatus. The electric device to which the negative electrode active material of the present invention is applied has an improved cycle life and excellent capacity and cycle durability.

Brazing alloy

本发明涉及新型钎焊合金，其包含铜、银、锌、锰、和铟，以及其产生和其使用的方法。

Solder and mounted products using it

Negative electrode for electric device and electric device using the same

본 발명의 과제는 높은 사이클 특성을 유지하면서, 또한 초기 용량도 높고 밸런스 좋은 특성을 나타내는 Li 이온 이차 전지 등의 전기 디바이스용 부극을 제공하는 것이다. 집전체와, 상기 집전체의 표면에 배치된 부극 활물질, 도전 보조제, 및 바인더를 함유하는 전극층을 갖는 전기 디바이스용 부극이며, 상기 부극 활물질이, 하기 식 (1): Si x Ti y M z A a [상기 식 (1)에 있어서, M은 Ge, Sn, Zn, 및 이들의 조합으로 이루어지는 군에서 선택되는 적어도 1개의 금속이며, A는 불가피 불순물이며, x, y, z, 및 a는, 질량%의 값을 나타내고, 이때, 0<x<100, 0<y<100, 0<z<100, 및 0≤a<0.5이며, x＋y＋z＋a＝100임]로 표현되는 합금을 함유하고, 상기 바인더가 1.00GPa 초과 7.40GPa 미만의 탄성률 E를 갖는 수지를 함유하는, 전기 디바이스용 부극. An object of the present invention is to provide a negative electrode for an electric device such as a Li ion secondary battery which exhibits high initial capacity and good balance while maintaining high cycle characteristics. A negative electrode for an electric device, comprising: a collector; and an electrode layer containing a negative electrode active material, a conductive auxiliary agent, and a binder disposed on a surface of the collector, wherein the negative electrode active material satisfies the following formula (1): Si x Ti y M z A in a [the formula (1), M is Ge, Sn, Zn, and a is at least one metal selected from the group consisting of a combination thereof, a is an unavoidable impurity, x, y, z, and a are, X + y + z + a = 100, wherein 0 < x < 100, 0 < y < 100, 0 & Has a modulus of elasticity E of greater than 1.00 GPa but less than 7.40 GPa.

Degradable compositions, apparatus comprising same, and methods of use

Compositions, apparatus incorporating a composition, and methods of use are described, one composition embodiment consisting essentially of one or more reactive metals in major proportion, and one or more alloying elements in minor proportion, with the provisos that the composition is high-strength, controllably reactive, and degradable under defined conditions. Compositions of the invention may exist in a variety of morphologies, including a reactive metal or degradable alloy processed into an alloy of crystalline, amorphous or mixed structure that may constitute the matrix of other composition, for instance a composite. Methods of using apparatus comprising a composition, particularly in oilfield operations are also described (e.g. flow and displacement control, sensors, actuators). This abstract allows a searcher or other reader to quickly ascertain the subject matter of the disclosure. It will not be used to interpret or limit the scope or meaning of the claims.

Sintered sliding material and manufacturing method thereof

Impregnated diamond composite block

本发明公开了一种孕镶金刚石复合块，由金刚石层和孕镶金刚石层组成，所述金刚石层以金刚石单晶为骨架材料，以碳化钛为填料，以硅、铜、锡、钴为粘接剂均匀混合；所述孕镶金刚石层以碳化钨与碳化硅、氮化硅或碳化钛中的一种或几种组合为骨架，以镍、硅、铬、铜、锡、铁、钴、锌、磷和稀土元素为粘接剂均匀混合；以孕镶金刚石层作为基体与金刚石层叠加后，经热压烧结或冷压烧结而成。孕镶金刚石复合块带有金刚石层，硬度极高，耐磨性极强，对地层有很强的切削能力，使孕镶体的破岩机理转变为以切削为主，犁削、划削和磨削为辅。用于孕镶金刚石钻头将大幅度提高孕镶金刚石钻头的机械钻速和进尺，有利于油气田和矿场勘探开发提速和降本。

Thick sintered polycrystalline diamond and sintered jewelry

Methods of forming larger sintered compacts of PCD and other sintered ultrahard materials are disclosed. Improved solvent metal compositions and layering of the un-sintered construct allow for sintering of thicker and larger high quality sintered compacts. Jewelry may also be made from sintered ultrahard materials including diamond, carbides, and boron nitrides. Increased biocompatibility is achieved through use of a sintering metal containing tin. Methods of sintering perform shapes are provided.

Thick sintered polycrystalline diamond and sintered jewelry

Methods of forming larger sintered compacts of PCD and other sintered ultrahard materials are disclosed. Improved solvent metal compositions and layering of the un-sintered construct allow for sintering of thicker and larger high quality sintered compacts. Jewelry may also be made from sintered ultrahard materials including diamond, carbides, and boron nitrides. Increased biocompatibility is achieved through use of a sintering metal containing tin. Methods of sintering perform shapes are provided.

Low-melting-point high-strength low-silver cadmium-free manganese-free multi-element silver solder and preparation method thereof

本申请涉及一种低熔点、高强度的低银无镉无锰多元银钎料及制备方法，多元银钎料由19%~23%的银、32%~35%的锌、1.0%~3.0%的锡、0~2.0%的镍、0~3.0%的铟、0.01%~1.0%的合金元素以及余量的铜组成，其中合金元素为磷、镧、铈中的一种或多种。所述合金元素由质量百分比为0.2%~1%的磷、0~0.02%的镧、0~0.01%的铈组成。上述多元银钎料制备方法包括以下步骤：S1：将Cu‑X合金中的铜在中频冶炼炉坩埚中加热完全熔化后，加入合金金属X，直到Cu‑X合金全部熔化；S2：纯度至少为99.99%的银、锌、锡、镍、铟以及除去Cu‑X合金中的铜余下的部分按低银无镉无锰多元银钎料成分配比加入含有熔化的Cu‑X合金的中频冶炼炉坩埚内冶炼、浇铸；S3：后续处理。本申请制备简单，钎料不含镉、锰，银及铟的总含量低，固相线及液相线温度、焊接性能适当，可加工性能好。

Rub resistance the is wear-resistant low gold content 8K platinum alloy of jewellery

耐摩擦耐磨损首饰用低金含量8K白金用合金；按照重量百分比,该合金的成分为:Ca:1.0‑1.5wt.%,Mg:2.0‑2.4wt.%,Co:1.2‑1.5wt.%,Si:2.5‑3.0wt.%,Zn:24.0‑28.0wt.%,In:18.0‑20.0wt.%,Au:33.0‑34.0wt.%,余量为锡。该专利解决了目前低金含量K白金性能不足的现状，也就是在使用2年后就会出现腐蚀斑的现象。该材料有效地突破了首饰领域内的发展瓶颈。可以预计，该材料的实施和产业化会取得丰硕的经济成果和社会效益。

Active material of negative electrode

FIELD: electricity.SUBSTANCE: active material of the negative electrode contains an alloy phase containing Cu and Sn which undergoes thermoelastic diffusionless transformation upon release or absorption of metal ions. Thermoelastic diffusionless transformation refers to the so-called thermoelastic martensitic transformation, but the expansion and compression coefficient of a unit cell cannot exceed more than 5%.EFFECT: active material provides an increase in the capacity of the battery and improves the charge-discharge cycling characteristics of the secondary battery with non-aqueous electrolyte.10 cl, 12 tbl, 10 dwg РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) (13) 2 630 229 C2 (51) МПК H01M 4/38 (2006.01) C22C 9/02 (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ОПИСАНИЕ ИЗОБРЕТЕНИЯ К ПАТЕНТУ (21)(22) Заявка: 2015108800, 27.08.2013 (24) Дата начала отсчета срока действия патента: 27.08.2013 Дата регистрации: Приоритет(ы): (30) Конвенционный приоритет: 27.08.2012 JP 2012-186159 (85) Дата начала рассмотрения заявки PCT на национальной фазе: 27.03.2015 (56) Список документов, цитированных в отчете о поиске: US 20110236756 A1, 29.09.2011. US 8231810 B2, 31.07.2012. JP 2005141995 A, 02.06.2005. JP 2010218958 A, 30.09.2010. US 2005208378 A1, 22.09.2005. (86) Заявка PCT: JP 2013/005061 (27.08.2013) (87) Публикация заявки PCT: 2 6 3 0 2 2 9 (45) Опубликовано: 06.09.2017 Бюл. № 25 (73) Патентообладатель(и): НИППОН СТИЛ ЭНД СУМИТОМО МЕТАЛ КОРПОРЕЙШН (JP) (43) Дата публикации заявки: 20.10.2016 Бюл. № 29 R U 06.09.2017 (72) Автор(ы): ЯМАМОТО Сукейоси (JP), НЕГИ Нориюки (JP), НАГАТА Тацуо (JP), МОРИГУТИ Кодзи (JP), ЙОНЕМУРА Мицухару (JP), КАКЕСИТА Томоюки (JP), ТЕРАИ Томоюки (JP), ФУКУДА Такаси (JP) 2 6 3 0 2 2 9 R U Адрес для переписки: 129090, Москва, ул. Б. Спасская, 25, стр. 3, ООО "Юридическая фирма Городисский и Партнеры" (54) АКТИВНЫЙ МАТЕРИАЛ ОТРИЦАТЕЛЬНОГО ЭЛЕКТРОДА (57) Реферат: Изобретение относится к активному содержащую Сu и Sn, которая претерпевает ...

Active material for negative electrode of electric device

FIELD: electricity. SUBSTANCE: active material for negative electrode of electric device includes allow containing Si within the content range more than 27 wt % and less than 100 wt %, Sn within the content range more than 0 wt % and less or equal to 73 wt %, V within the content range more than 0 wt % and less or equal to 73 wt % and inevitable impurities as residue. The active material for negative electrode may be obtained by magnetron sputtering unit for multiple targets at direct current using Si, Sn and V as the targets. EFFECT: electrical device using active material for negative electrode may reach long-term cyclic life and provide high resistance and operating durability in cyclic mode. 8 cl, 5 dwg РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) (51) МПК H01M 4/38 (13) 2 540 321 C1 (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ОПИСАНИЕ (21)(22) Заявка: ИЗОБРЕТЕНИЯ К ПАТЕНТУ 2013157562/07, 09.03.2012 (24) Дата начала отсчета срока действия патента: 09.03.2012 Приоритет(ы): (30) Конвенционный приоритет: (72) Автор(ы): ВАТАНАБЕ Манабу (JP), ЙОСИДА Масао (JP), ТАНАКА Осаму (JP) 25.05.2011 JP 2011-116536 (45) Опубликовано: 10.02.2015 Бюл. № 4 2327254 C1, 20.06.2008. JP 2005116390 A, 28.04.2005. JP 2004185810 A, 02.07.2004. JP 2005078999 A, 24.03.2005 (85) Дата начала рассмотрения заявки PCT на национальной фазе: 25.12.2013 (86) Заявка PCT: JP 2012/056128 (09.03.2012) 2 5 4 0 3 2 1 (56) Список документов, цитированных в отчете о поиске: WO 2007015508 A1, 08.02.2007. RU R U (73) Патентообладатель(и): НИССАН МОТОР КО., ЛТД. (JP) 2 5 4 0 3 2 1 R U WO 2012/160858 (29.11.2012) Адрес для переписки: 129090, Москва, ул. Б. Спасская, 25, строение 3, ООО "Юридическая фирма Городисский и Партнеры" (54) АКТИВНЫЙ МАТЕРИАЛ ОТРИЦАТЕЛЬНОГО ЭЛЕКТРОДА ДЛЯ ЭЛЕКТРИЧЕСКОГО УСТРОЙСТВА (57) Реферат: Активный материал отрицательного электрода электрода может быть получен, например, с для электрического устройства включает в себя помощью установки для магнетронного сплав, ...

Lead-free solder, welding joining product and electronic component

本发明提供一种无铅焊料，其具有良好的抗氧化性能，并能容易并良好地进行塑性加工。该无铅焊料及无铅焊料成形制品可提供焊接接合制品，特别是电子部件，其有很高的可靠性，例如，机械强度和连接强度。本发明还提供用该无铅焊料连接而成的焊接接合产品及电子部件。

A kind of functional quickly solvable rare earth magnesium alloy material and preparation method thereof

本发明公开了一种功能性快速可溶稀土镁合金材料及其制备方法，属于有色金属领域。所述镁合金组成为Mg a Gd b Y c Zr d Ni e M f N g ，其中M为Ga、In元素中的一种或两种元素的组合，N为Al、Mn、Ca、Zn、Cu、Sn、Sr、Li、La、Ce、Pr、Nd、Ge、Ag、Si等元素中一种或一种以上的任意组合，经熔炼铸造，固溶处理，热挤压以及时效处理得到目标合金。与现有技术相比，采用本发明所述成分制备的镁合金材料，具有较高的强度及塑性，且可在含有电解质的溶液中实现快速溶解，适用于加工油气田压裂过程中使用的封堵工具，工具可在服役完成后自行溶解，省去后续返排、磨铣工序，提高施工效率。

Pb-free solder alloy

본 발명은 납을 사용하지 않으면서도 동시에 위스커 발생을 억제할 수 있는 무연 솔더 합금을 제공하기 위한 것으로, 이를 위하여, 납을 포함하지 않고, 제1원소로서 주석(Sn) 및 제2원소로서 붕소(B)를 포함하는 무연 솔더 합금을 제공한다. The present invention is to provide a lead-free solder alloy that can suppress whisker generation at the same time without the use of lead, for this purpose, it does not contain lead, tin (Sn) as the first element and boron (second) A lead-free solder alloy comprising B) is provided.

Negative electrode active material for electric device and electric device using the same

Solder and mounted products using it

Ｓｎ−Ｚｎ系合金はんだは、Ｚｎ：７乃至１０質量％、Ａｇ：０．０７５乃至１質量％、Ａｌ：０．０７乃至０．５質量％を含有し、更にＢｉ：０．０１乃至６質量％及びＣｕ：０．００７乃至０．１質量％の１種又は２種を含有し、必要に応じて、Ｍｇ：０．００７乃至０．１質量％を含有し、残部がＳｎ及び不可避的不純物からなる組成を有する。このはんだは、従来のＳｎ−３７重量％Ｐｂ共晶系はんだと同等の作業性、使用条件、及び接続信頼性を備え、かつ人体に対して有害な鉛を含まない。 Sn—Zn-based alloy solder contains Zn: 7 to 10% by mass, Ag: 0.075 to 1% by mass, Al: 0.07 to 0.5% by mass, and Bi: 0.01 to 6% by mass. % And Cu: 0.007 to 0.1% by mass of 1 type or 2 types, optionally containing Mg: 0.007 to 0.1% by mass, the balance being Sn and inevitable impurities It has the composition which consists of. This solder has workability, use conditions, and connection reliability equivalent to those of a conventional Sn-37 wt% Pb eutectic solder and does not contain lead harmful to the human body.

Corrosion-resistant magnesium alloy material and preparation method thereof

本发明公开了一种耐腐蚀镁合金材料及其制备方法，该耐腐蚀镁合金材料由下列重量份的原料制成：镁粉56‑66份、碳化钨34‑44份、碳化锆10‑15份、钼铁粉45‑55份、硬柱石粉3‑8份、硼化钒10‑20份、凹凸棒粘土粉10‑20份、碱式碳酸镍1‑6份、三氧化二锡2‑5份、硒化镉6‑7份、高岭土5‑8份。本发明方法制备得到的耐腐蚀镁合金材料具有高硬度，高强度，化学稳定好，不水解，抗氧化性好等特点，使用寿命长；且原料易得、加工成本低，制备工艺简单、参数易控，生产过程安全环保，适合大规模的工业化生产。

A kind of preparation method of high brittle alloy weld tabs

本发明涉及一种高脆性合金焊片的制备方法，包括以下步骤步骤一，将金属原料进行高温熔融将质量分数为20~30份的In、40~50的Sn和25~40的Si加入频炉中进行融化，熔融温度为1200~1500℃，保护气为氮气；步骤二，将熔融液置于模具中铸造将步骤一中得到的金属液置于模腔为长100mm、宽20mm、厚5mm的模具中，得到长条形合金片；步骤三，将合金片置于电阻炉中预加热，退火后采用热轧机压延为带材或棒材；步骤四 将上述带材或棒材置于真空电阻炉中退火即可，退火温度为600~760℃，退火时间为6~8h。本发明中的Sn合金焊条延展性好，且里面的Si可有效防止其它金属元素的挥发。

Negative electrode for electrical device, and electrical device using same

본 발명의 과제는, 높은 사이클 특성을 유지하면서, 또한 초기 용량도 높고 밸런스 좋은 특성을 나타내는 Li 이온 2차 전지 등의 전기 디바이스용 부극을 제공하는 것이다. 집전체와, 상기 집전체의 표면에 배치된 부극 활물질, 도전 조제 및 바인더를 포함하는 전극층을 갖는 전기 디바이스용 부극이며, 상기 부극 활물질이, 하기 식(1) : [상기 식(1)에 있어서, M은, Al, V, C 및 이들의 조합으로 이루어지는 군으로부터 선택되는 적어도 1개의 금속이고, A는, 불가피 불순물이고, x, y, z 및 a는, 질량％의 값을 나타내고, 이때, 0＜x＜100, 0＜y＜100, 0＜z＜100 및 0≤a＜0.5이고, x＋y＋z＋a＝100임.] 로 나타내어지는 합금을 포함하고, 상기 바인더가, 1.00㎬ 초과 7.40㎬ 미만의 탄성률 E을 갖는 수지를 포함하는, 전기 디바이스용 부극. An object of the present invention is to provide a negative electrode for an electric device such as a Li ion secondary battery which exhibits high initial capacity and good balance while maintaining a high cycle characteristic. 1. A negative electrode for an electric device, comprising: a collector; and an electrode layer comprising a negative electrode active material disposed on a surface of the collector, a conductive auxiliary agent and a binder, wherein the negative electrode active material satisfies the following formula (1) Wherein M is at least one metal selected from the group consisting of Al, V, C and combinations thereof, A is an inevitable impurity, x, y, z and a are mass 100%, 0? A <0.5, and x + y + z + a = 100, where 0 <x < Wherein the binder comprises a resin having an elastic modulus E of greater than 1.00 m and less than 7.40 m.

Negative electrode active material for electric device and electric device using same

본 발명은, 높은 사이클 내구성을 갖는 리튬 이온 이차 전지 등의 전기 디바이스용 부극 활물질을 제공하는 것을 목적으로 한다. 본 발명의 전기 디바이스용 부극 활물질은, 하기 화학식(1): (상기 화학식(1)에 있어서, M은, Ti, Zn, C 및 이들의 조합으로 이루어지는 군에서 선택되는 적어도 1개의 금속이며, A는, 불가피 불순물이며, x, y, z 및 a는, 질량%의 값을 나타내고, 이 때, 0<x<100, 0<y<100, 0<z<100 및 0≤a<0.5이며, x+y+z+a=100임)로 표시되는 합금을 포함하는 전기 디바이스용 부극 활물질이며, 상기 합금의 CuKα선을 사용한 X선 회절 측정에 있어서, 2θ=24 내지 33°의 범위에서의 Si의 (111)면의 회절 피크의 반값폭이 0.7° 이상이다.

Brazing alloy

The invention relates to novel brazing alloys containing copper, silver, zinc, manganese and indium, and to a method for producing same and the use thereof.

Solder, soldering method, and semiconductor device

본 발명의 과제는 연성이 높고, 장기간에 걸쳐 충분한 접합 강도를 유지할 수 있는 Pb 프리 땜납, 그 땜납을 이용한 반도체 장치 및 납땜 방법을 제공하는 것이다. Sn(주석), Bi(비스무트) 및 Zn(아연)을 포함하고, Zn의 함유량이 0.01wt％ 내지 0.1wt％인 땜납을 사용한다. 예를 들면 Bi 함유량이 45wt％ 내지 65wt％, Zn 함유량이 0.01wt％ 내지 0.1wt％, 잔량부가 Sn으로 이루어지는 땜납, 또는 Bi 함유량이 45wt％ 내지 65wt％, Sb(안티몬) 함유량이 0.3wt％ 내지 0.8wt％, Zn 함유량이0.01wt％ 내지 0.1wt％, 잔량부가 Sn으로 이루어지는 땜납을 사용하여, 전자 부품과 기판을 접합한다

Optical curve grinding wheel and preparation method thereof

本发明属于超硬砂轮修整技术领域，具体涉及一种用于金属结合剂超硬材料倒角砂轮修整用光学曲线磨砂轮；其包括基体和磨料层，所述磨料层包括以下重量份原料：磨料30‑40份，金属结合剂60‑70份；所述金属结合剂由以下重量份数的原料组成：铜粉30‑55份、锡粉25‑50份、银粉5‑10份。本发明的砂轮配方、加工工艺简单，操作简便；可对金属结合剂超硬材料倒角砂轮进行修整，加工效果好，倒角砂轮微槽尺寸可以达到正负0.01mm精度内。