Настройки

Укажите год
-

Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

Подробнее
-

Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

Подробнее

Форма поиска

Поддерживает ввод нескольких поисковых фраз (по одной на строку). При поиске обеспечивает поддержку морфологии русского и английского языка
Ведите корректный номера.
Ведите корректный номера.
Ведите корректный номера.
Ведите корректный номера.
Укажите год
Укажите год

Применить Всего найдено 7042. Отображено 100.
05-01-2012 дата публикации

Treatment of boron-containing, platinum group metal-based alloys

Номер: US20120000582A1

Castings made of boron-containing alloys based on at least one platinum group metal are treated by thermal ageing in the presence of oxygen and at temperatures below the melting point of the alloy. This enables the alloys to be processed at temperatures customary in the jewelry industry. The treated castings can also be processed into medical technology products.

Подробнее
19-04-2012 дата публикации

Conductive particle, and anisotropic conductive film, bonded structure, and bonding method

Номер: US20120090882A1

To provide a conductive particle, containing: a core particle; and a conductive layer formed on a surface of the core particle, wherein the core particle is a nickel particle, and wherein the conductive layer is a nickel plating layer a surface of which has a phosphorous concentration of 10% by mass or lower, and the conductive layer has an average thickness of 1 nm to 10 nm.

Подробнее
19-04-2012 дата публикации

Composite alloy bonding wire and manufacturing method thereof

Номер: US20120093681A1
Автор: Jun-Der LEE
Принадлежит: Individual

A manufacturing method for a composite alloy bonding wire and products thereof. A primary material of Ag is melted in a vacuum melting furnace, and then a secondary metal material of Pd is added into the vacuum melting furnace and is co-melted with the primary material to obtain an Ag—Pd alloy solution. The obtained Ag—Pd alloy solution is drawn to obtain an Ag—Pd alloy wire. The Ag—Pd alloy wire is then drawn to obtain an Ag—Pd alloy bonding wire with a predetermined diameter.

Подробнее
26-04-2012 дата публикации

Method of manufacturing sintered silver alloy body and copper oxide-containing clay-like composition

Номер: US20120098168A1
Принадлежит: Mitsubishi Materials Corp

A method of manufacturing a sintered silver alloy body of the present invention includes steps of adding copper oxide to a silver-containing clay-like composition that contains silver-containing metal powder containing silver, a binder, and water to manufacture a clay-like composition for forming a sintered silver alloy body; making an object by making the clay-like composition for forming a sintered silver alloy body into an arbitrary shape; and baking the object in a reduction atmosphere or a non-oxidizing atmosphere after the object is dried.

Подробнее
03-05-2012 дата публикации

Method for producing decorative metallic article with wood grain metal pattern, and decorative metallic article with wood grain metal pattern

Номер: US20120107561A1
Принадлежит: Aida Chemical Industries Co Ltd

Provided are a method for producing a decorative metallic article with a wood grain metal pattern and the decorative metallic article with the wood grain metal pattern; the decorative metallic article comprising a sintered copper part produced by sintering a plastic copper containing clay compound, and a sintered silver part produced by sintering a plastic silver containing clay compound. The method comprises: a plate forming step of forming a copper plate and a silver plate; a multi layering and adhesion step of mutually laminating the copper and silver plates one another by applying water to the surfaces of the plates, and elongating the laminated plates so that a thickness thereof decreases in 10% or more, thereby to adhesively paste together; a wood grain metal plate forming step of forming a wood grain pattern by carving the surface of the multi layered plate produced in the multi layering and adhesion step so as to expose at least a part of the plurality of plate layers, and elongating the surface of the multi layered plate to become flat; a decorative object forming step of forming a decorative object by using the prepared wood grain metal plate; a decorative object drying step of drying the decorative object; and a sinter producing step of sintering the decorative object produced in the decorative object drying step, thereby to obtain the decorative metallic article.

Подробнее
17-05-2012 дата публикации

Coated articles, electrodeposition baths, and related systems

Номер: US20120118755A1
Принадлежит: Xtalic Corp

Coated articles, electrodeposition baths, and related systems are described. The article may include a base material and a coating comprising silver formed thereon. In some embodiments, the coating comprises a silver-based alloy, such as a silver-tungsten alloy. The coating can exhibit desirable properties and characteristics such as durability (e.g., wear), hardness, corrosion resistance, and high conductivity, which may be beneficial, for example, in electrical and/or electronic applications. In some cases, the coating may be applied using an electrodeposition process.

Подробнее
30-08-2012 дата публикации

Silver powder and method for producing same

Номер: US20120219453A1
Автор: Kozo Ogi, Takatoshi Fujino
Принадлежит: Dowa Mining Co Ltd

After a reducing agent is added to a water reaction system containing silver ions to deposit silver particles by reduction, the silver particles are dried to obtain a silver powder which is heat-treated at a temperature of higher than 100° C., and lower than 400° C. The silver powder thus heat-treated has a maximum coefficient of thermal expansion of not greater than 1.5% at a temperature of 50° C. to 800° C., and has no heating peak when the silver powder is heated from 50° C. to 800° C. The silver powder has an ignition loss of not greater than 1.0% when the silver powder is ignited until the weight of the silver powder is constant at 800° C. The silver powder has a tap density of not less than 2 g/cm 3 and a BET specific surface area of not greater than 5 m 2 /g.

Подробнее
06-09-2012 дата публикации

Magnetic recording medium

Номер: US20120225325A1
Принадлежит: HITACHI LTD

Surface flatness of magnetic recording medium to which a magnetic recording layer made of L1 0 FePt magnetic alloy thin film, with distance between a magnetic head and a magnetic recording medium sufficiently reduced. The magnetic recording layer includes: magnetic layers containing a magnetic alloy including Fe and Pt as principal materials; and one non-magnetic material selected from carbon, oxide and nitride. The first magnetic layer disposed closer to a substrate has a granular structure in which magnetic alloy grains including FePt alloy as the principal material are separated from grain boundaries including the non-magnetic material as the principal material. The second magnetic layer disposed closer to the surface than the first magnetic layer is fabricated so as to have a homogeneous structure in which an FePt alloy and the non-magnetic material are mixed in a state finer than diameters of the FePt magnetic alloy grains in the first magnetic layer.

Подробнее
31-01-2013 дата публикации

Element and photovoltaic cell

Номер: US20130025668A1
Принадлежит: Hitachi Chemical Co Ltd

The invention provides an element including a semiconductor substrate and an electrode disposed on the semiconductor substrate, the electrode being a sintered product of a composition for an electrode that includes phosphorus-containing copper alloy particles, glass particles and a dispersing medium, and the electrode includes a line-shaped electrode having an aspect ratio, which is defined as electrode short length:electrode height, of from 2:1 to 250:1.

Подробнее
21-02-2013 дата публикации

Electrocatalytic composite(s), associated composition(s), and associated process(es)

Номер: US20130045866A1
Принадлежит: Kemijski Institut Ljubljana

Compositions having electrocatalytic activity and composites having electrocatalytic activity, as well as processes for making compositions and composites are described. Also, processes for using such compositions and/or composites, such as, for example, a machine or equipment are described. Some aspects of embodiments and/or embodiments of the present invention are directed to a nanosize transition metal alloy (such as for example an alloy and/or one or more intermetallics comprising copper, cobalt, nickel, palladium, platinum, ruthenium, the like, and combinations thereof) that is electrocatalytically active. Some other aspects of embodiments and/or embodiments of the present invention are directed to a composite material comprising a nanosize transition metal alloy and a carbonaceous matrix.

Подробнее
18-04-2013 дата публикации

SPUTTERING TARGET MATERIAL

Номер: US20130094990A1
Принадлежит: ISHIFUKU METAL INDUSTRY CO., LTD.

This invention provides sputtering target materials having high reflectance and excellent heat resistance, which are formed of Ag base alloys formed by adding a specific, minor amount of P to Ag and alloying them. 12-. (canceled)3. A sputtering target material for forming a thin film having high reflectance , said material being an Ag base alloy consisting of Ag having a purity of at least 99.95% , 0.008-1.0 mass % of P , 0.01-0.9 mass % of Au , and 0.01-5.0 mass % of at least one metallic element selected from Cu and Bi , and P , Au , Cu and Bi having a purity of at least 99.9%.45-. (canceled)6. Thin film formed from the material of . This invention relates to thin film-forming sputtering target material having improved heat resistance while retaining high reflectance, and to the thin film which is formed with use of the sputtering target material.For reflection film or coating used on optical recording media such as CD (Compact Disc), DVD (Digital Versatile Disc), and the like or photo-reflective conductive coating used on reflection type STN (Super Twist Nematic) liquid crystal display devices, organic EL (Electroluminescence) display devices and the like, generally aluminum (Al) or Al alloys are used.Such photoreflective thin film put to usages with those optical recording media, liquid crystal display devices, organic EL display devices and the like is generally prepared by making sputtering target material having desired properties, and film-forming using the sputtering target material by such methods as RF (radiofrequency) sputtering or DC (direct current) sputtering.Thin films formed of Al or Al alloys which are prepared by such methods exhibit moderate degrees of reflectance, low electrical resistance and furthermore, stable corrosion resistance even in the air because passive state films are formed in the surface layers. However, reflectance of thin film made of Al or an Al alloy is, for example, around 80% of light having a wavelength of 700 nm, which is ...

Подробнее
09-05-2013 дата публикации

Method for Manufacturing Resonance Tube, Resonance Tube, and Filter

Номер: US20130113578A1
Автор: Yanzhao Zhou
Принадлежит: Huawei Technologies Co Ltd

A method for manufacturing a resonance tube includes: mixing powder materials, to form homogeneous powder particles, where the powder materials comprise iron powder with a weight proportion of 50% to 90%, at least one of copper powder and steel powder with a weight proportion of 1% to 30%, and an auxiliary material with a weight proportion of 1% to 20%; pressing and molding the powder particles, to form a resonance tube roughcast; sintering the resonance tube roughcast in a protective atmosphere, to form a resonance tube semi-finished product; and electroplating the resonance tube semi-finished product, to form the resonance tube. In the method, the resonance tube, and the filter according to embodiments of the present invention, the resonance tube is manufactured by using multiple powder materials.

Подробнее
23-05-2013 дата публикации

BONDING WIRE FOR SEMICONDUCTOR DEVICES

Номер: US20130126934A1

A bonding wire for semiconductor devices and a method of manufacturing the wire are provided. The bonding wire contains at least one element selected from zinc, tin, and nickel in an amount of 5 ppm to 10 wt %, the remainder containing silver and inevitable impurities. The method involves pouring a silver alloy according to the invention into a mold and melting the silver alloy, continuously casting the melted silver alloy, and drawing the continuously casted silver alloy. 1. A bonding wire for semiconductor devices , comprising at least one element selected from the group consisting of zinc (Zn) , tin (Sn) , and nickel (Ni) in an amount of 5 ppm to 10 wt %; wherein a remainder of the bonding wire comprises silver (Ag) and inevitable impurities.2. The bonding wire of claim 1 , further comprising at least one element selected from the group consisting of copper (Cu) claim 1 , platinum (Pt) claim 1 , rhodium (Rh) claim 1 , osmium (Os) claim 1 , gold (Au) claim 1 , and palladium (Pd) in an amount of 0.03 wt % to 10 wt %.3. The bonding wire of claim 1 , further comprising at least one element selected from the group consisting of beryllium (Be) claim 1 , calcium (Ca) claim 1 , magnesium (Mg) claim 1 , barium (Ba) claim 1 , lanthanum (La) claim 1 , cerium (Ce) claim 1 , and yttrium (Y) in an amount of 3 ppm to 5 wt %.4. A light emitting diode (LED) package comprising an LED chip claim 1 , a lead frame claim 1 , and a bonding wire claim 1 , wherein the lead frame supplies power to the LED chip claim 1 , and wherein the bonding wire connects the LED chip and the lead frame and is a bonding wire for semiconductor devices according to .5. A method of manufacturing a bonding wire for semiconductor devices claim 1 , comprising the steps of:pouring a silver (Ag) alloy into a mold and melting the silver alloy, wherein the silver alloy comprises at least one element selected from the group consisting of zinc (Zn), tin (Sn), and nickel (Ni) in an amount of 5 ppm to 10 wt %, and ...

Подробнее
23-05-2013 дата публикации

COATING AND ELECTRONIC COMPONENT

Номер: US20130130059A1
Принадлежит: TDK Corporation

A coating is provided to a conductor, and has a layered structure of a palladium layer. The palladium layer has a crystal plane whose orientation rate is 65% or more. 1. A coating provided to a conductor , the coating comprising:a palladium layer having a crystal plane whose orientation rate is 65% or more.2. The coating according to claim 1 , wherein the crystal plane whose orientation rate is 65% or more is the (111) plane or (200) plane.3. The coating according to claim 1 , wherein the palladium layer contains phosphorus in a concentration ranging from 0.5% by mass to 2.5% by mass.4. The coating according to claim 2 , wherein the palladium layer contains phosphorus in a concentration ranging from 0.5% by mass to 2.5% by mass.5. The coating according to claim 1 , further comprising a gold layer on the opposite surface of the palladium layer to the conductor.6. The coating according to claim 1 , further comprising a metal underlayer between the palladium layer and the conductor.7. The coating according to claim 5 , further comprising a metal underlayer between the palladium layer and the conductor.8. The coating according to claim 6 , wherein the metal underlayer includes at least one metal selected from the group consisting of Ni claim 6 , Sn claim 6 , Fe claim 6 , Co claim 6 , Zn claim 6 , Rh claim 6 , Ag claim 6 , Pt claim 6 , An claim 6 , Pb claim 6 , and Bi.9. The coating according to claim 7 , wherein the metal underlayer includes at least one metal selected from the group consisting of Ni claim 7 , Sn claim 7 , Fe claim 7 , Co claim 7 , Zn claim 7 , Rh claim 7 , Ag claim 7 , Pt claim 7 , Au claim 7 , Pb claim 7 , and Bi.10. An electronic component comprising:{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'a signal transfer unit including the coating according to ; and'}a conductor coated with the coating. Some aspects of the present invention relate to a coating provided to a conductor and an electronic component including a signal transfer unit having a ...

Подробнее
30-05-2013 дата публикации

Ceramic, graded resistivity monolith using the ceramic, and method of making

Номер: US20130135078A1
Принадлежит: General Electric Co

According to one embodiment, a monolithic cassette with graded electrical resistivity is presented. The monolithic cassette has a continuous grain structure between a first end and a second end; wherein electrical resistivity of the monolithic cassette is graded such that the resistance varies continuously from the first end to the second end. Methods and compositions for forming the monolithic cassette are also presented.

Подробнее
20-06-2013 дата публикации

GOLD ALLOY WITH IMPROVED HARDNESS

Номер: US20130153097A1

The invention concerns a gold alloy. 116-. (canceled)17. A 3N 18 carat yellow gold-based alloy , comprising in weight percent:at least 75% of gold;from 0.5% to 2.1% of an aluminium metal capable of forming at least one precipitate with gold;from 20% to 25% of at least one first additional metal having an ability to favor a stable face centered cubic (FCC) structure and to increase high temperature solubility of the aluminum metal in the gold;0% to 0.5% of at least one component affecting fluidity and grain size refinement of the alloy; and{'sub': 2', '5, 'at least one aluminium and gold precipitate comprising AlAuforming an intermetallic compound which provides the alloy with more than 250 HV hardness so as to improve structural hardening of the alloy.'}18. The alloy according to claim 17 , wherein the first additional metal is silver.19. The alloy according to claim 18 , wherein the first additional metal is 10% to 12.5% weight percent silver claim 18 , and the alloy further comprises 10% to 12.5% weight percent of a second additional metal of lower concentration than that of the silver.20. The alloy according to claim 19 , wherein the second additional metal is copper.21. The alloy according to claim 17 , wherein a content of the at least one first additional metal is between 22.4% and 24.5%.22. The alloy according to claim 17 , wherein the at least one component affecting fluidity and grain size refinement of the alloy is selected from the group consisting of zinc claim 17 , cobalt and iridium.23. The alloy according to claim 17 , comprising claim 17 , as the only precipitate of aluminium and gold claim 17 , the aluminium and gold precipitate comprising AlAu.25. The method according to claim 24 , wherein the rapid cooling (ii) is achieved by water hardening.26. The method according to claim 24 , wherein the at least one precipitate is a single precipitate.27. The method according to claim 24 , wherein the tempering (iii) occurs for at least 24 hours after the ...

Подробнее
04-07-2013 дата публикации

Transparent conductive thin film

Номер: US20130171469A1
Принадлежит: MKE Tech CO Ltd

A transparent conductive thin film comprises at least one stack layer of Ag—Ag 3 Sn—SnOx, or at least one stack layer of Ag—Ag 4 Sn—SnOx.

Подробнее
04-07-2013 дата публикации

Alloy wire and methods for manufacturing the same

Номер: US20130171470A1
Принадлежит: WIRE Tech CO Ltd

An alloy wire made of a material selected from one of a group consisting of a silver-gold alloy, a silver-palladium alloy and a silver-gold-palladium alloy is provided. The alloy wire is with a polycrystalline structure of a face-centered cubic lattice and includes a plurality of grains. A central part of the alloy wire includes slender grains or equi-axial grains, and the other parts of the alloy wire consist of equi-axial grains. A quantity of the grains having annealing twins was 20 percent or more of the total quantity of the grains of the alloy wire.

Подробнее
18-07-2013 дата публикации

Synthesis of fluorescent noble metal nanoparticles

Номер: US20130183665A1
Принадлежит: University of Toronto

A process for the production of fluorescent nanoparticles selected from noble metal, silica or polymer nanoparticles which comprises: 1. A process for the production of fluorescent nanoparticles selected from noble metal or silica nanoparticles which comprises: (1) providing a platform of nanoparticles; (2) covering the surfaces of the nanoparticles to saturation with thiol-terminated polymers by one of the following methods: 1. mixing the nanoparticles with methoxy-(polyethylene glycol)-thiol and biotin-(polyethylene glycol)-thiol; 2. mixing the nanoparticles with fluorescently-labeled methoxy-(polyethylene glycol)-thiol and/or biotin-(polyethylene glycol)-thiol 3. coordinating thiol and biotin thiol to the surfaces of the nanoparticles by a non-covalent bond; and 4. directly conjugating methoxy-thiol and biotin-thiol to the surfaces of the nanoparticles, so that the polymers bind to the surfaces of the nanoparticles as a brush layer via thiol particle coordination of the thiol ends so that the biotin or methoxy ends are free; and (3) homogeneously mixing the resulting biotin nanoparticles with fluorescent avidin or a derivative thereof in proportions such that the final concentration is 1 biotin molecule for every 10 to 1000 avidin molecules in the fluorescent multi-coloured nanoparticle-avidin complexes, each being capable of having a different targeting molecule, and which may be mixed with biotin related targets, and the fluorescent labeled avidin or a derivative thereof being spaced away from the particle surface, thus reducing or removing the potential quenching of the dye.

Подробнее
01-08-2013 дата публикации

High temperature resistant silver coated substrates

Номер: US20130196174A1
Принадлежит: Rohm and Haas Electronic Materials LLC

A thin film of tin is plated directly on nickel coating a metal substrate followed by plating silver directly on the thin film of tin. The silver has good adhesion to the substrate even at high temperatures.

Подробнее
15-08-2013 дата публикации

Thermal diffusion control film for use in magnetic recording medium, for heat-assisted magnetic recording, magnetic recording medium, and sputtering target

Номер: US20130209310A1
Автор: Hideo Fujii, Yoko Shida
Принадлежит: Kobe Steel Ltd

A thermal diffusion control film which includes an Ag alloy containing Nd, Bi, and Si. The thermal diffusion control film can be used for a magnetic recording medium for heat-assisted magnetic recording. The thermal diffusion control film has a good heat resistance even after heat hysteresis at about 600° C.

Подробнее
22-08-2013 дата публикации

Metal Wire Rod Made of Iridium-Containing Alloy

Номер: US20130213107A1
Принадлежит: TANAKA KIKINZOKU KOGYO K.K.

The present invention is a metallic wire rod comprising iridium or an iridium-containing alloy and, the wire rod has in the cross section thereof biaxial crystal orientation of 50% or more of abundance proportion of textures in which crystallographic orientation has preferred orientation to <100> direction. In the present invention, crystal orientation in the outer periphery from semicircle of the cross section which is the periphery of the wire rod is important, and in this zone, abundance proportion of textures in which crystallographic orientation has preferred orientation to <100> direction is preferably not less than 50%. 1. A metallic wire rod comprising iridium or an iridium-containing alloy , wherein the wire rod has in a cross section thereof a biaxial crystal orientation of 50% or more of abundance proportion of textures in which crystallographic orientation has an orientation to <100> direction.2. The metallic wire rod according to claim 1 , wherein the wire rod has in the outer periphery from semicircle of the cross section 50% or more of the abundance proportion of textures in which crystallographic orientation has an orientation to <100> direction.3. The metallic wire rod according to claim 1 , wherein the iridium-containing alloy is an alloy containing rhodium claim 1 , platinum claim 1 , and nickel.4. A method of manufacturing the metallic wire rod claim 1 , the wire rod defined in claim 1 , comprising:a first step in which an ingot of iridium or an iridium-containing alloy is made into a rod-shape article by biaxial pressurization while intermediate heat treatment is performed, and a second step in which the rod-shape article undergoes wire drawing to be a wire rod, wherein hardness of the ingot in the first step is maintained in not more than 550 Hv, and temperatures of the intermediate heat treatment are set to be not more than the recrystallization temperature of the iridium or an iridium-containing alloy.5. The method of manufacturing the ...

Подробнее
22-08-2013 дата публикации

Alloy material for high temperature having excellent oxidation resistant properties and method for producing the same

Номер: US20130216846A1

An Ir-based alloy material or Ru-based alloy material containing in Ir or Ru at least one member of Al, Sc, Ti, V, Cr, Mn, Y, Zr, Nb, Mo, Tc, Hf, Ta, W, and Re in such an amount that a precipitation phase is not formed, wherein the Ir-based alloy material or Ru-based alloy material has a surface uniformly covered with an IrAl intermetallic compound film or a RuAl intermetallic compound film.

Подробнее
22-08-2013 дата публикации

Starting material for a sintered bond and process for producing the sintered bond

Номер: US20130216847A1
Принадлежит: ROBERT BOSCH GMBH

The invention relates to a starter material for a sintering compound, said starter material comprising first particles of at least one metal having a first coating which is applied to the first particles and consists of an organic material, and second particles which contain an organic metal compound and/or a precious metal oxide, the organic metal compound and/or the precious metal oxide being converted during heat treatment of the starter material into the fundamental elemental metal and/or precious metal. The invention is characterized in that the second particles have a core of at least one metal and a second coating which is applied to the core and contains the organic metal compound and/or precious metal oxide. Furthermore, the first coating contains a reducing agent by means of which the organic metal compound and/or the precious metal oxide is/are reduced to the elemental metal and/or precious metal at a temperature below the sintering temperature of the elemental metal and/or precious metal.

Подробнее
03-10-2013 дата публикации

Thermoregulatory Interactive Gold Alloys for Therapeutic Jewelry Items

Номер: US20130259736A1
Автор: Dyment Victor
Принадлежит:

Gold alloys are provided that offer therapeutic benefits to a biological organism by enhancing thermoregulation, metabolism, and improving blood circulation. In addition to the therapeutic benefits, the alloys retain their metallurgical properties, thereby allowing the alloys to be utilized with conventional lost-wax casting techniques as both jewelry items and therapeutic instruments. The alloys contain 88% to 95% gold, 2% to 10% platinum, 0.1% to 0.9% silver, 0.01% to 1.5% rhodium, and 0.01% to 1.5% iron. 1. A gold jewelry alloy comprising:88% to 95% by weight gold;7% to 9.5% by weight platinum;0.1% to 0.9% by weight silver;0.01% to 1.5% by weight rhodium; and0.01% to 1.5% by weight iron.2. The alloy of claim 1 , wherein said alloy comprises:88% to 92% by weight gold;7% to 9.5% by weight platinum;0.4% to 0.9% by weight silver;0.01% to 0.9% by weight rhodium; and0.01% to 0.9% by weight iron.3. The alloy of claim 1 , wherein said alloy comprises:88% to 95% by weight gold;3% to 10% by weight platinum;0.1% to 0.9% by weight silver;0.01% to 1.5% by weight rhodium; and0.02% to 1.5% by weight iron. This application claims the benefit of U.S. Provisional Application No. 61/610,733, filed on Mar. 14, 2012, entitled “Health Frequency Thermoregulatory Interactive Gold Alloys With Therapeutic Features.” The above identified patent application is herein incorporated by reference in its entirety to provide continuity of disclosure.The present invention relates to alloys for use in the manufacture of jewelry. More particularly, the present invention pertains to alloys that provide therapeutic benefits to an organism by enhancing thermoregulation and metabolism, while also improving blood circulation.Homeostasis is the tendency of an organism to regulate its internal environment in order to stabilize health and function despite changes external to the organism. If an organism is unable to maintain its internal environment within a specified range of parameters its health may be ...

Подробнее
17-10-2013 дата публикации

RHODIUM ALLOY WHICH HAS EXCELLENT HARDNESS, PROCESSABILITY AND ANTIFOULING CHARACTERISTICS AND IS SUITABLE FOR WIRE ROD FOR PROBE PINS

Номер: US20130271173A1
Автор: Obata Tomokazu
Принадлежит: TANAKA KIKINZOKU KOGYO K.K.

The present invention is a rhodium alloy suitable for wire for a probe pin, the rhodium alloy comprising 30 to 150 ppm of Fe, 80 to 350 ppm of Ir and 100 to 300 ppm of Pt as additive elements, and the balance being Rh. A probe pin composed of the material maintains processability of rhodium, has stable contact resistance even at a low contact pressure, and has excellent strength and antifouling properties, and therefore, can be used in a stable manner for a long period. 1. A rhodium alloy suitable for wire for a probe pin , the rhodium alloy comprising: 30 to 150 ppm of Fe , 80 to 350 ppm of Ir and 100 to 300 ppm of Pt as additive elements , and the balance being Rh.2. A probe pin comprising the rhodium alloy defined in . The present invention relates to a rhodium alloy suitable for wire rod constituting a probe pin for testing electric properties of semiconductor integrated circuits or the like.Electric properties of semiconductor integrated circuits or the like are tested with a probe pin brought into contact with a large number of electrode pads thereof. Constituent materials of a probe pin are required to have various properties such as hardness for ensuring abrasion resistance for the test repeated several million times, oxidation resistance for preventing contamination of test objects caused by the generation of oxidation film, and low specific resistance for improving signal delay.Copper alloy such as beryllium copper and phosphor bronze, tungsten and palladium alloy or the like have long been known as a material for a probe pin. However, these conventional materials do not have all required properties. For example, copper alloy and tungsten have sufficient mechanical properties but are relatively easily oxidized, and palladium alloy has good oxidation resistance but may be slightly inferior in hardness or the like.Thus, as a novel constituent material of a probe pin, a material composed of precious metal such as iridium as a main component has been ...

Подробнее
07-11-2013 дата публикации

Material for Electrical/Electronic Use

Номер: US20130292008A1
Принадлежит: TOKURIKI HONTEN CO., LTD.

The present invention provides an electrical/electronic material which has low contact resistance, excellent corrosion resistance, high hardness, high flexing strength and excellent processability. The electrical/electronic material is characterized by being composed of 20-40% by mass of Ag, 20-40% by mass of Pd, 10-30% by mass of Cu and 1.0-20% by mass of Pt and having a hardness of 340-420 HV at the time of precipitation hardening after metal forming and an adequate flexing strength. 1. An electrical and electronic material comprising an alloy containing 20-40 mass percent Ag , 20-40 mass percent Pd , 10-30 mass percent Cu , and 1.0-20 mass percent Pt , having a hardness of HV 340-420 after plastic forming and precipitation hardening treatment is processed to said material , and having a high folding strength.2. An electrical and electronic material comprising the alloy of to which 0.1-10 mass percent Au claim 1 , and 0.1-3.0 mass percent of at least one of Re claim 1 , Rh claim 1 , Co claim 1 , Ni claim 1 , Si claim 1 , Sn claim 1 , Zn claim 1 , B and In are added as additive elements to improve the properties according to the usage. The present invention relates to Ag—Pd—Cu alloy for electrical and electronic device.Materials for electrical and electronic device are generally required to have properties of low contact resistance, excellent corrosion resistance and the like, thus expensive noble metals such as Pt alloy, Au alloy, Pd alloy, Ag alloy or the like are widely used.However, according to the usage, a test probe pin or the like for a semiconductor integrated circuit is required to have properties of hardness and wear resistance other than low contact resistance and corrosion resistance.In such a case, Pt alloy, Ir alloy or the like indicating a high hardness in a state of plastic forming, or Au alloy, Pd alloy or the like which are hardened by precipitation treatment are preferably used. (Refer to the Japanese Patent No. 4176133 as an example).Japanese ...

Подробнее
21-11-2013 дата публикации

Sputtering Target for Magnetic Recording Film

Номер: US20130306470A1
Принадлежит: JX Nippon Mining and Metals Corp

A sputtering target for a magnetic recording film which contains carbon, the sputtering target is characterized in that the ratio (I G /I D ) of peak intensities of the G-band to the D-band in Raman scattering spectrometry is 5.0 or less. The sputtering target for a magnetic recording film, which contains carbon powders dispersed therein, makes it possible to produce a magnetic thin film having a granular structure without using an expensive apparatus for co-sputtering; and in particular, the target is an Fe—Pt-based sputtering target. Carbon is a material which is difficult to sinter and has a problem that carbon particles are apt to form agglomerates. There is hence a problem that carbon masses are readily detached during sputtering to generate a large number of particles on the film after sputtering. The high-density sputtering target can solve these problems.

Подробнее
21-11-2013 дата публикации

Composite material for the making of decorative items and procedure for the making of a decorative item

Номер: US20130307188A1
Принадлежит: ANTIGO PROPERTIES

Composite material for the making of decorative items which contains at least a polymeric component and at least a metallic powder dispersed in the polymeric component in an amount in weight between 2% and 95%. The metallic powder includes plate-like particles with a nanometric thickness of between 5 and 300 nm and a preferential growth in a two-dimensional surface with at least a dimension of between 0.6 and 100 μm. A procedure for the making of an ornamental article includes at least a phase for preparing at least a base component of a silicone resin; at least a phase for preparing the metallic powder; at least an initial phase for mixing the metallic powder with the silicone resin base component to obtain an even mixture; and at least an initial phase for reticulating the base component in the even mixture with the metallic powder distributed in a homogeneous way.

Подробнее
05-12-2013 дата публикации

Impeller manufacturing method

Номер: US20130320073A1
Принадлежит: Mitsubishi Heavy Industries Ltd

The present invention relates to an impeller manufacturing method in which a thermal cycle is performed on an assembly body with a brazing material formed of a Ni-containing Au alloy being placed at a bond portion of at least two impeller constituent members. The thermal cycle includes a temperature increasing process with a temperature increasing rate of 20° C./hr. to 100° C./hr., the process including a first intermediate retention and a second intermediate retention each keeping the temperature, the first intermediate retention performed in a temperature range of 500° C. to 850° C. and the second intermediate retention performed in a temperature range of 850° C. to 950° C. (but not including 850° C.). In the thermal cycle, the temperature is increased in a temperature range exceeding 950° C. after the second intermediate retention at a rate lower than that before the second intermediate retention.

Подробнее
26-12-2013 дата публикации

Composite Material Comprising a Precious Metal, Manufacturing Process and Use of Such Material

Номер: US20130344316A1
Принадлежит:

A composite material combining—a precious metal or an alloy containing a precious metal—and a boron-based ceramic having a melting point greater than that of said precious metal and a density at most equal to 4 g/cm3. 1. A composite material combining:a precious metal or an alloy containing a precious metal;and a boron-based ceramic with a melting point greater than that of said precious metal and a density at most equal to 4 g/cm3.2. The composite material according to claim 1 , having a concentration of precious metal greater than 75% by weight of the total weight of said material.3. The composite material according to claim 1 , in which said precious metal is chosen from among: gold claim 1 , platinum claim 1 , palladium claim 1 , and silver.4. The composite material according to claim 3 , in which said precious metal is gold.5. The composite material according to claim 1 , in which the ceramic is combined with an alloy of gold or aluminum claim 1 , the composite material having a concentration of aluminum at most equal to 20% by weight of the total weight of the composite material claim 1 , preferably at most equal to 5% by weight of the total weight of the composite material.6. The composite material according to claim 1 , in which the precious metal is alloyed to titanium claim 1 , the concentration of titanium being comprised between 0.5 and 2% of the total weight of the composite material claim 1 , preferably approximately 1% by weight of the total weight of the composite material.7. The composite material according to claim 1 , in which said ceramic is chosen from among: a boron carbide claim 1 , a boron nitride claim 1 , a boron oxide claim 1 , and a BCN heterodiamond.8. The composite material according to claim 7 , in which said ceramic is chosen from among the boron carbides having as an approximate formula B4C claim 7 , B13C2 claim 7 , and B12C3.9. The composite material according to claim 7 , in which said ceramic is boron nitride having the formula BN ...

Подробнее
02-01-2014 дата публикации

Composition of silver-conjugated compound composite

Номер: US20140001422A1
Принадлежит: Sumitomo Chemical Co Ltd

A composition of a silver-conjugated compound composite containing (1) a silver-conjugated compound composite containing a silver particle with a Feret diameter of 1,000 nm or less and a conjugated compound having a weight average molecular weight of 3.0×10 2 or more being adsorbed to the silver particles and (2) an ionic compound. The ionic compound may be a compound having a structure represented by the following Formula (hh-1): [Chem. 1] M m′ + a X′ n′− b   (hh-1) wherein M m′+ represents a metal cation, X′ n′− represents an anion, a and b each independently represent an integer of 1 or more, and when M m′+ and X′ n′− are each plurally present, they may be the same as or different from each other.

Подробнее
02-01-2014 дата публикации

TARNISH-RESISTANT STERLING SILVER ALLOYS

Номер: US20140003992A1
Автор: Fogel Kenneth
Принадлежит:

Titanium sterling silver alloy compositions that exhibit enhanced tarnish resistance while maintaining an acceptable hardness. Applications and manufacturing methods thereof are disclosed. 1. A sterling silver alloy comprising from about 92.5 wt % to about 98.1 wt % silver and from about 1.9 wt % to about 7.0% wt % titanium.26-. (canceled)7. The sterling silver alloy according to claim 1 , fluffier comprising a third metal selected from the group consisting of palladium claim 1 , niobium claim 1 , aluminum claim 1 , germanium claim 1 , boron claim 1 , zinc claim 1 , copper and zirconium.8. The sterling silver alloy according to claim 1 , further comprising up to about 5% palladium claim 1 , wherein the ternary alloy has improved tarnish resistance and/or hardness.910-. (canceled)11. The sterling silver alloy according to claim 1 , further comprising up to about 5 wt % niobium.1213-. (canceled)14. A method of making a titanium silver alloy claim 1 , comprising melting a mixture of silver and titanium comprising 92.5-98.1 wt % of silver and 1.9-7.5 wt % titanium until the mixture is uniformly mixed claim 1 , and transferring the melt mixture into a cast or mold.15. The method of claim 14 , further comprising hot-working claim 14 , annealing and/or solution treatment.16. The method of claim 14 , wherein the melting container is a crucible made of refractory material selected from graphite claim 14 , zirconia claim 14 , calcia claim 14 , and yittria.17. The method of claim 16 , wherein the crucible is made of stabilized zirconia.18. The method of claim 14 , wherein melting and casting the alloy are performed under an inert atmosphere to avoid reaction of titanium with materials it is in contact with.19. The method of claim 18 , wherein said inert atmosphere comprises argon gas.20. (canceled)21. The method of claim 18 , wherein the melting is conducted under a second argon fill after flushing with clean dry argon twice.22. The method of claim 14 , wherein the melting is ...

Подробнее
09-01-2014 дата публикации

Composites of bulk amorphous alloy and fiber/wires

Номер: US20140007986A1
Принадлежит: Apple Inc

A composite structure includes a matrix material having an intrinsic strain-to-failure rating in tension and a reinforcing material embedded in the bulk material. The reinforcing material is pre-stressed by a tensile force acting along one direction. The embedded reinforcing material interacts with the matrix material to place the composite structure into a compressive state. The compressive state provides an increased strain-to-failure rating in tension of the composite structure along a direction that is greater than the intrinsic strain-to-failure rating in tension of the matrix material along that direction. At least one of the matrix material and the reinforcing material is a bulk amorphous alloy (BAA). The reinforcing material can be a fiber or wire. In various embodiments, the matrix material may be a bulk amorphous alloy and/or the reinforcing material may be a bulk amorphous alloy.

Подробнее
23-01-2014 дата публикации

NANOWIRE PREPARATION METHODS, COMPOSITIONS, AND ARTICLES

Номер: US20140023552A1
Принадлежит:

Methods of producing metal nanowires, compositions, and articles are disclosed. Such methods allow production of metal nanowires with reproducibly uniform diameter and length, even in the presence of catalyst concentration variation. Such metal nanowires are useful for electronics applications. 1. A method comprising:providing at least one compound capable of forming at least one halide ion, said compound comprising at least one first atom, at least one halogen atom bonded to the at least one first atom, and at least one aromatic ring comprising at least one carbon atom bonded to the at least one first atom; andreducing at least one first metal ion to at least one first metal in the presence of at least one of the at least one compound or the at least one halide ion,wherein the absolute value of the difference in electronegativities of the at least one first atom and the at least one halogen atom is greater than about 0.4 Pauling units and less than about 2.0 Pauling units.2. The method according to claim 1 , wherein the at least one first atom comprises at least one of a boron atom claim 1 , a nitrogen atom claim 1 , a phosphorus atom claim 1 , a silicon atom claim 1 , a sulfur atom claim 1 , or a selenium atom.3. The method according to claim 1 , wherein the at least one first atom comprises at least one of a boron atom claim 1 , a phosphorus atom claim 1 , or a silicon atom.4. The method according to claim 1 , further comprising forming the at least one halide ion by solvolysis of the at least one compound.5. The method according to claim 1 , wherein the at least one halide ion comprises at least one chloride ion or bromide ion.6. The method according to claim 1 , wherein the at least one compound is capable of forming at least one carbocation.7. The method according to claim 1 , wherein the at least one compound comprises at least one of phenylphosphonic dichloride claim 1 , dichlorophenylborane claim 1 , or triphenylmethylchloride.8. The method according to ...

Подробнее
20-02-2014 дата публикации

Virus film as template for porous inorganic scaffolds

Номер: US20140048126A1
Принадлежит: Massachusetts Institute of Technology

Virus multilayers can be used as templates for growth of inorganic nanomaterials. For example, layer-by-layer construction of virus multilayers on functionalized surfaces form nanoporous structures onto which metal particles or metal oxide nanoparticles can be nucleated to result in an interconnected network of nanowires.

Подробнее
06-03-2014 дата публикации

SILVER ALLOY

Номер: US20140065011A1
Принадлежит: JOSTENS, INC.

A platinum-free silver alloy may include about 0.1% to 0.9% Au, about 83% to 90% Ag, about 2% to 3% Pd, about 3% to 5% Zn, about 2% to 8% Cu, about 0.01% to 0.4% B, about 0.1% to 0.3% Ge, and about 0.01% to 0.03% Ir. 1. A platinum-free silver alloy comprising:about 0.1% to 0.9% Au;about 83% to 90% Ag;about 2% to 3% Pd;about 3% to 5% Zn;about 2% to 8% Cu.about 0.01% to 0.4% B;about 0.1% to 0.3% Ge; andabout 0.01% to 0.03% Ir.2. The alloy of comprising:about 0.4% to 0.6% Au;about 84% to 89% Ag;about 2.25% to 2.75% Pd;about 3.5% to 4.5% Zn;about 4% to 7.5% Cu;about 0.02% to 0.35% B;about 0.15% to 0.25% Ge; andabout 0.015% to 0.025% Ir.3. The alloy of comprising about 0.5% Au.4. The alloy of comprising about 85% Ag.5. The alloy of comprising about 88% Ag.6. The alloy of comprising about 2.5% Pd.7. The alloy of comprising about 4% Zn.8. The alloy of comprising about 4.3% Cu.9. The alloy of comprising about 7% Cu.10. The alloy of comprising about 0.04% B.11. The alloy of comprising about 0.25% B.12. The alloy of comprising about 0.2% Ge.13. The alloy of comprising about 0.02% Ir.14. The alloy of claim 1 , wherein the alloy includes a Vickers hardness value from approximately 86 to 102 HV.15. The alloy of claim 14 , wherein the alloy includes a Vickers hardness value from approximately 95 to 105 HV.16. The alloy of claim 15 , wherein the alloy includes an average Vickers hardness value ranging from approximately 90 to 95 HV.17. The alloy of claim 16 , wherein the alloy includes an average Vickers hardness value ranging from approximately 92 to 96 HV.18. A platinum-free silver alloy consisting of:about 0.1% to 0.9% Au;about 83% to 90% Ag;about 2% to 3% Pd;about 3% to 5% Zn;about 2% to 8% Cu;about 0.01% to 0.4% B; anda grain modifier consisting of one of Ge, Ga, and In and one of Ir, Os, and Re.19. The alloy of claim 18 , wherein the grain modifier is about 0.1% to 0.3% Ge and about 0.01% to 0.03% Ir. The present application claims priority to U.S. Provisional Application No ...

Подробнее
20-03-2014 дата публикации

Tribologically Loadable Mixed Noble Metal/Metal Layers

Номер: US20140076798A1
Автор: Stefan Koppe
Принадлежит: Schauenburg Ruhrkunststoff GmbH

The invention relates to a method for producing a noble metal/metal layer, which has particularly advantageous tribological properties, comprising the following steps: providing a bath for the currentless deposition of a metal layer, which additionally contains at least one type of noble metal ions; introducing a substrate into the bath; and applying a voltage.

Подробнее
10-04-2014 дата публикации

PLATINUM BASED ALLOYS

Номер: US20140096874A1
Автор: WEBER Ludger

An article made of an alloy of the general formula PtM(BMd)in which i) M stands for one or a mixture of metallic element(s) of the group Zr, Ti, Fe, Ni, Co, Cu, Pd, Ag, Al; ii) Md stands for one or a mixture of several metalloids of the group Si, P, C, S, As, Ge; iii) a is smaller than 0.2; iv) b is comprised between 0.2 and 0.5; v) x is comprised between 0 and 0.8; vi) the overall P content, if present, is less than 10 atomic percent the proportions of the elements forming the alloy having been selected to confer a hardness of at least 400 HV, a melting point below 1000° C. and improved processibility to the alloy. 1. An article made of an alloy of the general formula PtM(BMd)in whichi) M stands for one or a mixture of metallic element(s) of the group Zr, Ti, Fe, Ni, Co, Cu, Pd, Ag, Alii) Md stands for one or a mixture of several metalloids of the group Si, P, C, S, As, Geiii) a is smaller than 0.2iv) b is comprised between 0.2 and 0.55v) x is comprised between 0 and 0.8vi) the overall P content, if present, is less than 10 atomic percent the proportions of the elements forming the alloy having been selected to confer a hardness of at least 400 HV, a melting point below 1000° C. and improved processibility to the alloy.2. An article according to made of an alloy of the general formula PtM(BMd)in which Md stands for one or a mixture of several metalloids of the group Si claim 1 , C claim 1 , S claim 1 , As claim 1 , Ge.3. An article according to in which x is comprised between 0.1 and 0.8.4. An article according to wherein said alloy is an amorphous-based alloy with the composition PtNi(BSi)5. An article according to wherein said alloy is an amorphous-based alloy with the composition PtNi(BSi)6. An article according to having an overall Pt-content of at least 850/1000 by weight.7. An article according to having an overall Pt-content of at least 900/1000 by weight.8. An article according to having an overall Pt-content of at least 950/1000 by weight.9. An article ...

Подробнее
10-04-2014 дата публикации

Bonding method and production method

Номер: US20140097232A1
Принадлежит: Fujikura Ltd

A bonding method of the present invention is a method of bonding two members (A and B) to each other with use of an Au—Sn solder. According to the bonding method of the present invention, after the bonding, an Au—Sn solder (S′) has weight percent of Sn which is not less than 38.0 wt % but not more than 82.3 wt %.

Подробнее
10-04-2014 дата публикации

PREPARATION METHOD OF SILVER NANO-STRUCTURE FOR SURFACE ENHANCED, RAMAN SCATTERING SUBSTRATE AND SILVER NANO-STRUCTURE THEREBY

Номер: US20140099513A1

A preparation method of silver nanostructure for use as substrate of surface-enhanced Raman scattering (SERS), which can ensure the ‘hot spot’, which provides the considerably very intense electromagnetic field in which the silver nano-structures have uniform average size and very strong forms of particles, by characterizing a variety of conditions such as, for example, concentration of AgNOand reductant, reaction temperature, stirring velocity, single dropwise addition quantity, dropwise addition rate, or total dropwise addition quantity, which were unpredictable in the conventional silver nanoparticle preparation method using AgNOaqueous solution and NaBHreductant, so that the preparation method can be advantageously applied for the mass production of silver nano-structures for use as substrate of SERS because the method can provide multimer form with enhanced SERS signals and reproducibility, and also ability to selectively control the particle size. 1. A preparation method of silver nano-structures for use as substrate of surface-enhanced Raman scattering (SERS) , comprising steps of:{'sub': '4', 'cooling NaBHdown to 0-5° C. (step 1);'}{'sub': '4', 'preparing reductant solution by placing NaBHcooled at step 1 in a flask maintained at 0-5° C. or room temperature, and stirring the same (step 2);'}{'sub': '3', 'obtaining reaction solution by dropwise-adding room-temperature AgNOto the reductant solution prepared at step 2 until end point (step 3); and'}{'sub': '4', 'ending the reaction by adding NaBHprepared at step 1 into the reaction solution obtained at step 1.'}2. The preparation method as set forth in claim 1 , comprising steps of:{'sub': '4', 'sup': −3', '−3, 'cooling NaBHat concentration between 1.0×10M and 3.0×10M down to 0-5° C. (step 1);'}{'sub': '4', 'preparing reductant solution by placing NaBHcooled to 0-5° C. at step in a flask maintained at 0-5° C., and stirring the same at 1000-2000 rpm (step 2);'}{'sub': '3', 'sup': −3', '−3, 'obtaining reaction ...

Подробнее
01-01-2015 дата публикации

METHOD FOR PRODUCING SILVER NANOPARTICLES, SILVER NANOPARTICLES, AND SILVER COATING COMPOSITION

Номер: US20150001452A1
Принадлежит:

The present invention provides silver nano-particles that are excellent in stability and develop excellent conductivity by low-temperature calcining, a producing method for same, and a silver coating composition comprising the silver nano-particles. A method for producing silver nano-particles comprising: preparing an amine mixture liquid comprising: an aliphatic hydrocarbon monoamine (A) comprising an aliphatic hydrocarbon group and one amino group, said aliphatic hydrocarbon group having 6 or more carbon atoms in total; an aliphatic hydrocarbon monoamine (B) comprising an aliphatic hydrocarbon group and one amino group, said aliphatic hydrocarbon group having 5 or less carbon atoms in total; and an aliphatic hydrocarbon diamine (C) comprising an aliphatic hydrocarbon group and two amino groups, said aliphatic hydrocarbon group having 8 or less carbon atoms in total; mixing a silver compound and the amine mixture liquid to form a complex compound comprising the silver compound and the amines; and thermally decomposing the complex compound by heating to form silver nano-particles. 1. A method for producing silver nano-particles comprising:preparing an amine mixture liquid comprising:an aliphatic hydrocarbon monoamine (A) comprising an aliphatic hydrocarbon group and one amino group, said aliphatic hydrocarbon group having 6 or more carbon atoms in total;an aliphatic hydrocarbon monoamine (B) comprising an aliphatic hydrocarbon group and one amino group, said aliphatic hydrocarbon group having 5 or less carbon atoms in total; andan aliphatic hydrocarbon diamine (C) comprising an aliphatic hydrocarbon group and two amino groups, said aliphatic hydrocarbon group having 8 or less carbon atoms in total;mixing a silver compound and the amine mixture liquid to form a complex compound comprising the silver compound and the amines; andthermally decomposing the complex compound by heating to form silver nano-particles.2. The method for producing silver nano-particles ...

Подробнее
07-01-2016 дата публикации

SILVER POWDER AND SILVER PASTE

Номер: US20160001361A1
Принадлежит: SUMITOMO METAL MINING CO., LTD.

A silver powder is provided that has thixotropy suitable for utilization as a paste, combines the thixotropy with good dispersibility, is easy to knead, and prevents flake generation. The silver powder has a maximum torque per specific surface area of not less than 2 N·g/m and not more than 5 N·g/m, the maximum torque per specific surface area being obtained by dividing a maximum torque determined in accordance with a method for measuring an absorption amount defined by JIS K6217-4 by a specific surface area determined by the BET method. 1. A silver powder , having a maximum torque per specific surface area of not less than 2 N·g/m and not more than 5 N·g/m , said maximum torque per specific surface area being obtained by dividing a maximum torque by a specific surface area determined by BET method , said maximum torque being determined in accordance with a method for measuring an absorption amount which is defined by Japanese Industrial Standard (JIS) K6217-4.2. The silver powder according to claim 1 , the silver powder having:{'sub': SEM', 'SEM, 'a number average particle diameter Dof not less than 0.2 μm and not more than 2.0 μm, said number average particle diameter Dbeing determined by an image observed by a scanning electron microscope; and'}{'sub': 50', 'SEM', '50', 'SEM', '50', 'SEM, 'a ratio D/Dof not less than 1.8 and not more than 4.2, said ratio D/Dbeing a ratio of a particle diameter Don a volume basis measured by laser diffraction scattering to the number average particle diameter D.'}3. The silver powder according to claim 1 , the silver powder having a volume resistivity of not more than 10 μΩ·cm when a silver paste obtained by kneading the silver powder claim 1 , terpineol claim 1 , and a resin with a rotary and revolutionary agitator at a centrifugal force of 420 G is printed on an alumina substrate and baked for 60 minutes at a temperature of 200° C. in the atmosphere.4. The silver powder according to claim 2 , the silver powder having a volume ...

Подробнее
04-01-2018 дата публикации

CARBON-COATED METAL POWDER, CONDUCTIVE PASTE CONTAINING CARBON-COATED METAL POWDER AND MULTILAYER ELECTRONIC COMPONENT USING SAME, AND METHOD FOR MANUFACTURING CARBON-COATED METAL POWDER

Номер: US20180001388A9
Принадлежит:

This invention aims at providing a carbon-coated metal powder having few impurities, a narrower particle size distribution, and sintering properties particularly suitable as a conductive powder of a conductive paste for forming internal conductors in a ceramic multilayer electronic component obtained by co-firing multilayered ceramic sheets and internal conductor layers; a conductive paste containing the carbon-coated metal powder; a multilayer electronic component using the conductive paste; and a method for manufacturing the carbon-coated metal powder. The carbon-coated metal powder has specific properties in TMA or ESCA measurements. The carbon-coated metal powder can be obtained by melting and vaporizing a metallic raw material in a reaction vessel, conveying the generated metal vapor into a cooling tube and rapidly cooling the metal vapor by endothermically decomposing a carbon source supplied into the cooling tube, and forming a carbon coating film on metal nuclei surfaces in parallel with generation of the metal nuclei. 2. The carbon-coated metal powder according to claim 1 , wherein when the temperature width of 200° C. giving the Xis taken as not less than T° C. to not more than (T+200)° C. claim 1 , T° C.>400° C.3. The carbon-coated metal powder according to claim 1 , wherein X′ represented by X′ (%)=(X′/X)×100 is 30 or less claim 1 , when X′is a maximum shrinkage percentage in a range of from a room temperature to 400° C.4. The carbon-coated metal powder according to claim 1 , wherein the metal powder includes at least one of nickel and copper.5. A carbon-coated metal powder comprising a nickel-based powder consisting essentially of nickel only or comprising nickel as a main component claim 1 , and a carbon coating film that covers the nickel-based powder claim 1 , wherein{'sup': '2', 'an oxygen content in a weight proportion of an oxygen component to the carbon-coated metal powder of a unit weight is 1500 ppm or less per specific surface area of 1 m/g of ...

Подробнее
07-01-2021 дата публикации

Oxidation-Resistant Coated Superalloy

Номер: US20210001603A1
Принадлежит: PRATT & WHITNEY CANADA CORP.

A coating-substrate combination includes: a Ni-based superalloy substrate comprising, by weight percent: 2.0-5.1 Cr; 0.9-3.3 Mo; 3.9-9.8 W; 2.2-6.8 Ta; 5.4-6.5 Al; 1.8-12.8 Co; 2.8-5.8 Re; 2.8-7.2 Ru; and a coating comprising, exclusive of Pt group elements, by weight percent: Ni as a largest content; 5.8-9.3 Al; 4.4-25 Cr; 3.0-13.5 Co; up to 6.0 Ta, if any; up to 6.2 W, if any; up to 2.4 Mo, if any; 0.3-0.6 Hf; 0.1-0.4 Si; up to 0.6 Y, if any; up to 0.4 Zr, if any; up to 1.0 Re, if any. 1. An article comprising:a Ni-based superalloy substrate comprising, by weight percent: 2.0-5.1 Cr; 0.9-3.3 Mo; 3.9-9.8 W; 2.2-6.8 Ta; 5.4-6.5 Al; 1.8-12.8 Co; 2.8-5.8 Re; 2.8-7.2 Ru; anda coating comprising, exclusive of Pt group elements, by weight percent: Ni as a largest content; 5.8-9.3 Al; 4.4-25 Cr;3. 0-13.5 Co; up to 6.0 Ta , if any; up to 6.2 W , if any; up to 2.4 Mo , if any; 0.3-0.6 Hf; 0.1-0.4 Si; up to 0.6 Y , if any; up to 0.4 Zr , if any; up to 1.0 Re , if any.2. The article of wherein:the substrate comprises 0.05-0.7 weight percent Hf.3. The article of wherein:the substrate has a 1800° F. & 45 ksi (982° C. & 310 MPa) rupture life of at least 120 hours.4. The article of wherein:the coating comprises exclusive of Pt group elements, by weight percent: 0.4-0.6 said Hf; 0.2-0.4 said Si.5. The article of wherein:the coating has less than 1.0 weight percent overall said Pt group elements combined.6. The article of wherein:in weight percent exclusive of Pt group elements, the coating has less than 1.0 weight percent individually elements other than said Ni, Al, Cr, Co, Ta, W, Mo, Hf, Si, Y, Zr, Re, and Pt group elements, if any.7. The article of wherein:the substrate also falls within one of the broader ranges of Table VI; andthe coating also falls within the associated broader range of Table VII.8. The article of wherein:the coating and substrate fall within the narrower associated ranges.9. The article of wherein:in weight percent the coating has 6.0≤W+Ta≤13.0 or Ta+W≤0.05 ...

Подробнее
05-01-2017 дата публикации

FANCY COLOR SILVER CONTAINING ALLOYS

Номер: US20170002446A1
Автор: RAYKHTSAUM Grigory
Принадлежит: RICHLINE GROUP, Inc.

The present invention is directed to a formulation of one or more low silver containing alloys (including those with silver content below weight %, “w %”) that show one of the group of distinct pink, yellow and green colors and further demonstrate enhanced resistance to tarnish and other beneficial features described herein. 1. A silver based alloy composition comprising:at least 22% silver;about 0.5-3% palladium;about 9-16% zinc;about 0.2% silicon; andcopper;wherein said composition exhibits characteristics of resistance to tarnish.2. The composition of claim 1 , wherein said silver is limited to 22-25%.3. The composition of claim 2 , wherein the amount of zinc is limited to about 10% claim 2 , and said composition exhibits a yellow color.4. The composition of claim 3 , wherein the density is about 9.0 g/km and the annealed hardness is about 60 vickers.5. The composition of claim 1 , which is used for making jewelry.6. The composition of claim 1 , wherein the amount of zinc is at about 15% and said composition exhibits a green color.7. The composition of claim 6 , wherein said composition is limited to 22-23% silver.8. The composition of claim 6 , wherein said composition further comprises gold.9. The composition of claim 6 , wherein the density is about 8.5 g/km and the annealed hardness is about 65 vickers.10. The composition of claim 1 , wherein said silver is limited to a range of 46-52% of said composition and wherein said composition exhibits a pale color.11. The composition of claim 10 , further comprising germanium in an amount limited to 0.7% or less and said composition exhibits a pale yellow color.12. The composition of claim 10 , further comprising germanium in at most trace amounts and the composition exhibits a pale pink color.13. The composition of claim 10 , wherein palladium is limited to about 2% of said composition.14. The composition of claim 10 , wherein said composition further comprises gold.15. The composition of claim 10 , which is used for ...

Подробнее
03-01-2019 дата публикации

AGE-HARDENABLE STERLING SILVER ALLOY WITH IMPROVED "TARNISHING" RESISTANCE AND MASTER ALLOY COMPOSITION FOR ITS PRODUCTION

Номер: US20190003015A1
Принадлежит:

The present invention relates to a sterling silver alloy, copper-free in its basic embodiment, age-hardenable, with improved resistance to tarnishing, thanks to the presence of palladium in combination with zinc and indium, this alloy being mainly used for the realization of precious articles; the present invention also relates to a master alloy composition suitable for the production of said sterling silver alloy. 1. An age-hardenable sterling silver alloy , characterised in that it consists of at least:silver (Ag): from 92.5 to 96.8% by weight;palladium (Pd): from 0.7 to 1.9% by weight;zinc (Zn): from 1 to 5.8% by weight;indium (In): from 1 to 5.8% by weight;wherein thesum of zinc (Zn) and Indium (In) is from 2.5 to 6.8% by weight, when zinc (Zn) and indium (In) are both present in the final (ready-to-use) alloy;and optionallygermanium (Ge) and/or silicon (Si); maximum 0.25% by weight;copper (Cu): maximum 3% by weight;tin (Sn) and/or gallium (Ga): maximum 2% by weight;hardened to a value of about 82-120 HV by means of thermal treatment carried out on “as cast” or previously homogenized material.2. An alloy according to claim 1 , characterised in that it consists of:silver (Ag): from 92.5 to 96.6% by weight;palladium (Pd): from 0.9 to 1.5% by weight;zinc (Zn): from 1 to 5.6% by weight;indium (In): from 1 to 5.6% by weight;sum of zinc (Zn) and indium (In): from 2.5 to 6.6% by weight.3. An alloy according to or claim 1 , characterised in that it consists of:silver (Ag): from 92.5 to 94% by weight;palladium (Pd): from 0.9 to 1.5% by weight;zinc (Zn): from 1 to 5.6% by weight;indium (In): from 1 to 5.6% by weight;sum of zinc (Zn) and indium (In): from 2.5 to 6.6% by weight.4. An alloy according to claim 1 , characterised in that said sum of zinc (Zn) and indium (In) is not less than 3.75% by weight.5. An alloy according to claim 1 , characterised in that said copper (Cu) has a value in the range of 1 to 2.5% by weight.6. An alloy according to claim 1 , characterised in ...

Подробнее
12-01-2017 дата публикации

ASSEMBLY AND METHOD FOR GRAVITATIONALLY SEPARATING GOLD FROM SMALL PARTICLES

Номер: US20170008006A1
Автор: JR. Jesse W., Rhodes
Принадлежит:

An assembly and method for gravitationally separating gold from particles, and specifically for separating small components of gold, less than 1 millimeter from small particles. A series of sieves having graduated mesh sizes, and arranged in a sequential, stacked configuration sieves the aggregate of large particles and larger components of gold. The remaining small particles and smaller components of gold fall into a container. A pressurized column of fluid is forced into the container. The fluid has sufficient flow velocity to suspend the lighter small particles, but insufficient flow velocity to support the denser, high specific gravity gold. Gold has a large specific gravity relative to the fluid and particles. Gravity causes the gold to falls into a transparent collection conduit. Manipulation of valves enables gold to redirect to a collection bin. Fluid flow is shut, enabling small particles to be flushed out through gravitational forces and excess fluid momentum. 1. An assembly for separating gold from small particles , the assembly comprising:a container, the container defined by an open end, a sidewall, and a bottom end, the bottom end comprising an aperture;a series of sieves having graduated mesh sizes, the series of sieves arranged in a sequential, stacked configuration in general alignment with the open end of the container, whereby a sieve having a small mesh is proximal to the open end of the container and a sieve having a large mesh is distal to the open end of the container;a collection conduit, the collection conduit defined by a source end and a container end, the container end configured to join with the aperture of the container;a fluid source, the fluid source configured to enable the flow of a fluid through the collection conduit;a flow regulation valve, the flow regulation valve operational at the fluid source, the flow regulation valve configured to regulate the flow rate of the fluid;a container valve, the container valve operational at the ...

Подробнее
12-01-2017 дата публикации

Brazing and soldering alloy wires

Номер: US20170008130A1
Принадлежит: Morgan Advanced Ceramics Inc

Brazing alloy wire formed from a composite comprising a sheath of at least one ductile first phase and a core comprising particles of a different composition to the sheath, in which: the sheath has an annealing temperature in degrees K the particles have a melting point at least 20% above the annealing temperature of the sheath the particles have a size distribution in which 25% by weight or less comprise particles less than 25 μm in size the particles are discrete

Подробнее
08-01-2015 дата публикации

METHOD FOR PREPARING HOLLOW SILVER PARTICLES AND CORE-SHELL SILVER PARTICLES

Номер: US20150010769A1

A method for preparing core-shell and hollow silver particles is provided. In the method silver salts and glycine nitrate or starch are mixed with solvent to form precursor solution. The mole percentage of the silver salts over the silver salts plus glycine nitrate or starch is 5 to 50 mol %. The precursor solution is then atomized to form precursor droplets. The precursor droplets are heated by pyrolysis to form silver particles. The composition of the precursor solution can be adjusted to finely manipulate the structure of the silver particles. 1. A method for manufacturing core-shell and hollow silver particles , comprising:mixing a silver salt with a glycine nitrate or starch as a solute in a polar solvent to form a precursor solution, wherein the mole percentage of the silver salt over the silver salts plus glycine nitrate or starch is 5 to 50 mol %;atomizing the precursor solution to form a plurality of precursor droplets; andheating the precursor droplets to pyrolyze the precursor droplets to form the core-shell silver particles and the hollow silver particles.2. The method of claim 1 , wherein claim 1 , in mixing the silver salt with the glycine nitrate or the starch as the solute in the polar solvent to form the precursor solution claim 1 , the silver salt plus glycine nitrate or starch are 0.01-10 wt % to the precursor solution.3. The method of claim 1 , wherein claim 1 , in mixing the silver salt with the glycine nitrate or the starch as the solute in the polar solvent to form a precursor solution claim 1 , the silver salt is silver nitrate or silver acetate.4. The method of claim 1 , wherein claim 1 , in mixing the silver salt with the glycine nitrate or the starch as the solute in the polar solvent to form a precursor solution claim 1 , the polar solvent is water.5. The method of claim 1 , wherein claim 1 , in mixing the silver salt with the glycine nitrate or the starch as the solute in the polar solvent to form a precursor solution claim 1 , the ...

Подробнее
10-01-2019 дата публикации

SILVER ALLOY POWDER AND METHOD FOR PRODUCING SAME

Номер: US20190009341A1
Принадлежит: DOWA ELECTRONICS MATERIALS CO., LTD.

While a molten metal obtained by melting silver and a metal, which is selected from the group consisting of tin, zinc, lead and indium, in an atmosphere of nitrogen is allowed to drop, a high-pressure water (preferably pure water or alkaline water) is sprayed onto the molten metal in the atmosphere or an atmosphere of nitrogen to rapidly cool and solidify the molten metal to produce a silver alloy powder which comprises silver and the metal which is selected from the group consisting of tin, zinc, lead and indium and which has an average particle diameter of 0.5 to 20 μm, the silver alloy powder having a temperature of not higher than 300° C. at a shrinking percentage of 0.5%, a temperature of not higher than 400° C. at a shrinking percentage of 1.0% and a temperature of not higher than 450° C. at a shrinking percentage of 1.5% in a thermomechanical analysis. 1. A silver alloy powder comprising silver and a metal which is selected from the group consisting of tin , zinc , lead and indium , the silver alloy powder having an average particle diameter of 0.5 to 20 μm , and the silver alloy powder having a temperature of not higher than 300° C. at a shrinking percentage of 0.5% in a thermomechanical analysis.2. A silver alloy powder as set forth in claim 1 , which has a temperature of not higher than 400° C. at a shrinking percentage of 1.0% in said thermomechanical analysis.3. A silver alloy powder as set forth in claim 1 , which has a temperature of not higher than 450° C. at a shrinking percentage of 1.5% in said thermomechanical analysis.4. A silver alloy powder as set forth in claim 1 , which has an oxygen content of not higher than 6% by weight.5. A silver alloy powder as set forth in claim 1 , which has a carbon content of not higher than 0.5% by weight.6. A silver alloy powder as set forth in claim 1 , which has a BET specific surface area of 0.1 to 3.5 m/g.7. A silver alloy powder as set forth in claim 1 , which has a tap density of not less than 2.5 g/cm.8. A ...

Подробнее
14-01-2021 дата публикации

SHAPE-MEMORY ALLOY AND SHAPE-MEMORY ALLOY WIRE

Номер: US20210010120A1
Принадлежит:

The present invention provides a shape-memory alloy including a Au—Cu—Al alloy having 20 at % or more and 40 at % or less Cu and 15 at % or more and 30 at % or less Al, with the balance being Au and inevitable impurities. The shape-memory alloy has a Vickers hardness of 360 Hv or less. The Au—Cu—Al alloy of the present invention is an alloy capable of developing both biocompatibility and a shape-memory effect, and further capable of achieving artifactlessness in a magnetic environment. The Au—Cu—Al alloy can be produced by heat-treating a clad material formed of a combination of a hollow material made of a Au—Cu alloy and a core material made of metallic Al at 500° C. or more and 700° C. or less. 1. A shape-memory alloy comprising a Au—Cu—Al alloy having 20 at % or more and 40 at % or less Cu and 15 at % or more and 30 at % or less Al , with the balance being Au and inevitable impurities , whereina Au concentration analyzed with respect to an arbitrary cross-section has a standard deviation of 1.0 at % or less, andthe shape-memory alloy has a bulk susceptibility of −24 ppm or more and 6 ppm or less, and has a Vickers hardness of 360 Hv or less.23-. (canceled)4. A shape-memory alloy wire claim 1 , comprising the shape-memory alloy defined in and having a diameter of 1 mm or less.5. The shape-memory alloy wire according to claim 4 , wherein the wire has a diameter of 10 μm or more and 100 μm or less.6. The shape-memory alloy wire according to claim 4 , wherein a Au concentration analyzed with respect to an arbitrary cross-section has a standard deviation of 1.0 at % or less.7. A method for producing the shape-memory alloy defined in claim 1 , comprising the steps of:inserting a core material made of metallic Al into a hollow material made of a Au—Cu alloy, and closely attaching the both materials provide a clad material; andheat-treating the clad material at a temperature of 500° C. or more and 700° C. or less, thereby providing a Au—Cu—Al alloy.8. A method for ...

Подробнее
14-01-2016 дата публикации

FEPT-C-BASED SPUTTERING TARGET AND METHOD FOR MANUFACTURING SAME

Номер: US20160013033A1
Принадлежит:

An FePt—C-based sputtering target containing Fe, Pt, and C, wherein the FePt—C-based sputtering target has a structure in which primary particles of C that contain unavoidable impurities are dispersed in an FePt-based alloy phase containing 33 at % or more and 60 at % or less of Pt with the balance being Fe and unavoidable impurities, the primary particles of C being dispersed so as not to be in contact with each other. 1. An FePt—C-based sputtering target containing Fe , Pt , and C , whereinthe FePt—C-based sputtering target has a structure in which primary particles of C that contain unavoidable impurities are dispersed in an FePt-based alloy phase containing 33 at % or more and 60 at % or less of Pt with the balance being Fe and unavoidable impurities, the primary particles of C being dispersed so as not to be in contact with each other.2. An FePt—C-based sputtering target containing Fe , Pt , and C and further containing at least one metal element other than Fe and Pt , whereinthe FePt—C-based sputtering target has a structure in which primary particles of C that contain unavoidable impurities are dispersed in an FePt-based alloy phase containing 33 at % or more and less than 60 at % of Pt and more than 0 at % and 20 at % or less of the at least one metal element other than Fe and Pt with the balance being Fe and unavoidable impurities and with the total amount of Pt and the at least one metal element being 60 at % or less, the primary particles of C being dispersed so as not to be in contact with each other.3. The FePt—C-based sputtering target according to claim 2 , whereinthe one or more kinds of metal elements other than Fe and Pt are one or more kinds of Cu, Ag, Mn, Ni, Co, Pd, Cr, V, and B.4. The FePt—C-based sputtering target according to claim 1 , whereinthe primary particles have an average particle diameter of 1 μm or more and 30 μm or less.5. The FePt—C-based sputtering target according to claim 1 , whereinthe crystal structure of the primary ...

Подробнее
14-01-2021 дата публикации

ELECTRONIC DEVICE

Номер: US20210013121A1
Автор: MIYAKE Toshihiro
Принадлежит:

An electronic device includes a metal member and a connected member. A metal connecting layer is provided between a lower-side surface of the metal member and an upper-side surface of the connected member, to connect the metal member and the connected member to each other. The metal connecting layer includes at least one of metal films, each of which is made of gold or gold alloy. A thickness of the metal connecting layer in an opposing area between the metal member and the connected member is smaller than a flatness of each of the lower-side surface and the upper-side surface. A rust-preventing film is formed on a side wall of the metal member in such a way that the rust-preventing film extends from an outer periphery of the metal connecting layer to a position away from the outer periphery by a predetermined distance. 1. An electronic device comprising:a metal member made of metal material including one of copper, copper alloy, aluminum and aluminum alloy;a connected member located on a lower side of the metal member and having an upper-side surface, which is opposed to a whole surface area of a lower-side surface of the metal member;a metal connecting layer having a metal film made of metal material including gold or gold alloy, wherein the metal connecting layer connects the lower-side surface of the metal member to the upper-side surface of the connected member, and wherein a thickness of the metal connecting layer is made to be smaller than a flatness of the lower-side surface of the metal member and a flatness of the upper-side surface of the connected member; anda rust-preventing film formed on an outer side surface of the metal member and extending from an outer periphery of the metal connecting layer to a position away from the outer periphery of the metal connecting layer by a predetermined distance.2. The electronic device according to claim 1 , whereinthe rust-preventing film covers all outer surfaces of the metal member, except for the lower-side ...

Подробнее
09-01-2020 дата публикации

Cu ALLOY CORE BONDING WIRE WITH Pd COATING FOR SEMICONDUCTOR DEVICE

Номер: US20200013747A1

A bonding wire for a semiconductor device includes a Cu alloy core material and a Pd coating layer formed on a surface thereof, and the boding wire contains one or more elements of As, Te, Sn, Sb, Bi and Se in a total amount of 0.1 to 100 ppm by mass. The bonding longevity of a ball bonded part can increase in a high-temperature and high-humidity environment, improving the bonding reliability. When the Cu alloy core material further contains one or more of Ni, Zn, Rh, In, Ir, Pt, Ga and Ge in an amount, for each, of 0.011 to 1.2% by mass, it is able to increase the reliability of a ball bonded part in a high-temperature environment of 170° C. or more. When an alloy skin layer containing Au and Pd is further formed on a surface of the Pd coating layer, wedge bondability improves.

Подробнее
15-01-2015 дата публикации

SILVER POWDER AND METHOD FOR PRODUCING SAME

Номер: US20150017465A1
Принадлежит:

The present invention provides a method for producing a silver powder, the method being capable of producing a silver powder with high productivity and at low cost, the silver powder having an average particle diameter of 0.3 to 2.0 μm and a narrow particle size distribution, and provides a silver powder produced by the production method. According to the present invention, the method for producing a silver powder includes: quantitatively and continuously supplying each of a silver solution containing a silver complex and a reductant solution to a flow path; and quantitatively and continuously reducing a silver complex in a reaction solution obtained by mixing the silver solution with the reductant solution in the flow path, wherein the reaction solution is made to contain a dispersant, and also a silver concentration in the reaction solution is adjusted to be in a range of 5 to 75 g/L. 1. A method for producing a silver powder , the method comprising:quantitatively and continuously supplying each of a silver solution containing a silver complex and a reductant solution to a flow path; andquantitatively and continuously reducing a silver complex in a reaction solution obtained by mixing said silver solution with said reductant solution in the flow path;wherein the above-mentioned reaction solution is made to contain a dispersant, and a silver concentration in the reaction solution is adjusted to be in a range of 5 to 75 g/L.2. The method for producing a silver powder according to claim 1 , wherein a particle size of silver particles formed by reduction is controlled by adjusting a silver concentration in the above-mentioned reaction solution.3. The method for producing a silver powder according to claim 1 , wherein the above-mentioned silver solution is obtained by dissolving silver chloride in ammonia water.4. The method for producing a silver powder according to claim 1 , wherein the above-mentioned reductant is ascorbic acid claim 1 , and a mixing ratio of said ...

Подробнее
17-01-2019 дата публикации

Palladium Based Alloys

Номер: US20190015300A1
Принадлежит: IVOCLAR VIVADENT AG, Ivoclar Vivadent Inc

A palladium-based alloy having a coefficient of thermal expansion (CTE) of about 12.0 to about 13.0 and having one or more of the following additive metals: platinum, gallium, chromium, molybdenum, tin, silicon, ruthenium, rhenium, indium, tungsten, niobium, boron and lithium.

Подробнее
15-01-2015 дата публикации

PALLADIUM BASED ALLOYS

Номер: US20150017606A1
Принадлежит:

A palladium-based alloy having a coefficient of thermal expansion (CTE) of about 12.0 to about 13.0 and having one or more of the following additive metals: platinum, gallium, molybdenum, tin, silicon, ruthenium, rhenium, indium, tungsten, niobium, boron and lithium. 1. A dental alloy free of gold , copper and silver comprising palladium , platinum , gallium , molybdenum , ruthenium and rhenium and having a CTE in the range of about 11.5 to about 13.0×10/° C. at 25-500° C.2. A dental alloy of claim 1 , wherein the CTE is in the range of about 12 to about 13.0×10/° C. at 25-500° C.3. A dental alloy of claim 1 , wherein the CTE is in the range of about 12 to about 12.8×10/° C. at 25-500° C.4. The dental alloy of wherein the molybdenum is at least about 0.5 percent by weight of the total alloy.5. The dental alloy of claim 1 , wherein the platinum is at least about 10% percent by weight of the total alloy.6. A dental article comprising;{'sup': '−6', 'a dental alloy substrate free of gold, copper and silver comprising palladium, platinum, gallium, molybdenum, ruthenium and rhenium and having a CTE in the range of about 11.5 to about 13.0×10/° C. at 25-500° C.; and'}{'sup': '−6', 'a ceramic or glass ceramic having a CTE in the range of about 8.0 to about 13×10/° C. at 25-500° C. pressed onto the dental alloy substrate.'}7. The dental article of claim 6 , wherein the CTE is in the range of about 12 to about 13.0×10/° C. at 25-500° C.8. The dental article of claim 6 , wherein the CTE is in the range of about 12 to about 12.80×10/° C. at 25-500° C.9. The dental article of claim 6 , wherein the ceramic or glass ceramic comprises lithium silicate.10. The dental article of claim 9 , wherein the lithium silicate comprises lithium metasilicate claim 9 , lithium disilicate or a mixture thereof.11. The dental article of fabricated as a crown claim 10 , bridge claim 10 , veneer claim 10 , inlay claim 10 , onlay claim 10 , partial crown claim 10 , fixed partial denture claim 10 , ...

Подробнее
21-01-2016 дата публикации

Au-Sn-Bi ALLOY POWDER PASTE, Au-Sn-Bi ALLOY THIN FILM, AND METHOD FOR FORMING Au-Sn-Bi ALLOY THIN FILM

Номер: US20160016265A1
Принадлежит: MITSUBISHI MATERIALS CORPORATION

The present invention provides to an Au—Sn—Bi alloy film which has an excellent bondability on a metalized layer formed on an LED element or a substrate as a bonding layer made of the Au—Sn—Bi alloy and is uniform and thin. In the present invention, an Au—Sn—Bi alloy thin film which has the thickness of 5 μm or less and includes at least a eutectic structure can be formed by using an Au—Sn—Bi alloy powder paste that mixes the Au—Sn alloy powder containing 20 wt % to 25 wt % of Sn, 0.1 wt % to 5.0 wt % of Bi, and a balance of Au, and having a particle diameter of 10 μm or less with an RA flux of 15 wt % to 30 wt %, screen printing the Au—Sn—Bi alloy powder paste in a predetermined region on the Au metallized layer, and subsequently, heating, melting and then solidifying the Au—Sn—Bi alloy powder. 1. An Au—Sn—Bi alloy powder paste which is a mixture comprising: an Au—Sn—Bi alloy powder containing 20 wt % to 25 wt % of Sn , 0.1 wt % to 5.0 wt % of Bi , and the balance of Au and having a particle diameter of 10 μm or less; and 15 wt % to 30 wt % of an flux containing at least an activator.2. An Au—Sn—Bi alloy thin film comprising: 20 wt % to 25 wt % of Sn , 0.1 wt % to 5.0 wt % of Bi , and the balance of Au , and having a thickness of 5 μm or less , the thin film having:at least a eutectic structure.3. A method for forming an Au—Sn—Bi alloy , comprising:screen-printing an Au—Sn—Bi alloy powder paste in a predetermined region on a metallized layer, the paste being a mixture comprising: an Au—Sn—Bi alloy powder containing 20 wt % to 25 wt % of Sn, 0.1 wt % to 5.0 wt % of Bi, and the balance of Au and having a particle diameter of 10 μm or less; and 15 wt % to 30 wt % of an flux containing at least an activator; andheating, melting and then solidifying the Au—Sn—Bi alloy powder to form an Au—Sn alloy thin film having at least a eutectic structure.4. The method for forming an Au—Sn alloy thin film according to claim 3 ,wherein the screen-printing is performed by gap ...

Подробнее
18-01-2018 дата публикации

GAS SENSOR

Номер: US20180017520A1
Принадлежит:

A gas sensor includes a sensor element. The sensor element includes; a solid electrolyte body that has oxygen ion conductivity and includes a first main surface exposed to a gas to be measured and a second main surface exposed to a reference gas; a sensor electrode that is provided on the first main surface and detects a specific gas component in the gas to be measured; and a reference electrode that is provided on the second main surface. The sensor electrode is made of a Pt—Rh alloy that contains 30 mass % to 70 mass % Pt and 70 mass % to 30 mass % Rh, when an overall noble metal component is 100 mass %. A variation amount of the Rh content of the Pt—Rh alloy from an outermost surface to a depth of 350 nm in a thickness direction of the sensor electrode is within a range of up to 10 mass %. 1. A gas sensor comprising:a sensor element that detects gas concentration, a solid electrolyte body that has oxygen ion conductivity, the solid electrolyte body including a first main surface that is exposed to a gas to be measured and a second main surface that is exposed to a reference gas;', 'a sensor electrode that is provided on the first main surface of the solid electrolyte body, and detects a specific gas component in the gas to be measured; and', 'a reference electrode that is provided on the second main surface of the solid electrolyte body,', 'the sensor electrode being made of a Pt—Rh alloy that contains 30 mass % to 70 mass % Pt and 70 mass % to 30 mass % Rh, when an overall noble metal component is 100 mass %,', 'a variation amount of the Rh content of the Pt—Rh alloy from an outermost surface of the sensor electrode to a depth of 350 nm in a thickness direction of the sensor electrode being within a range of up to 10 mass %., 'the sensor element comprising2. The gas sensor according to claim 1 , wherein:particles configuring the Pt—Rh alloy are within a range of 0.5 μm to 5 μm in size.3. The gas sensor according to claim 1 , wherein: a measured gas chamber into ...

Подробнее
21-01-2021 дата публикации

PRECIPITATION-HARDENING Ag-Pd-Cu-In-B ALLOY

Номер: US20210017627A1
Автор: Shishino Ryu
Принадлежит:

A precipitation-hardening alloy, including 17 to 23.6 at % of Ag, 0.5 to 1.1 at % of B, and a total of 74.9 to 81.5 at % of Pd and Cu, wherein the at % ratio of the Pd and Cu is 1:1 to 1:1.2, and the rest includes In and inevitable impurities. This provides an alloy with good overall balance, having all of maintaining low specific resistance, at least almost equal to that of conventional Ag—Pd—Cu alloys, and also having contact resistance stability (oxidation resistance), good plastic workability, and higher hardness than before. 1. A precipitation-hardening alloy , comprising 17 to 23.6 at % of Ag , 0.5 to 1.1 at % of B , and a total of 74.9 to 81.5 at % of Pd and Cu , wherein an at % ratio of the Pd and Cu is 1:1 to 1:1.2 , and a rest comprises In and inevitable impurities.2. The precipitation-hardening alloy according to claim 1 , characterized in that Vickers hardness is 515 HV or more.3. The precipitation-hardening alloy according to claim 2 , characterized in that specific resistance is 15 μΩ·cm or less.4. The precipitation-hardening alloy according to claim 3 , characterized by having a crystal grain size of 1.0 μm or less and a metallographic structure having uniformly distributed intermetallic compounds.5. The precipitation-hardening alloy according to claim 1 , characterized by being applied to electric and electronic equipment.6. The precipitation-hardening alloy according to claim 1 , characterized by being applied to contact probe pins.7. The precipitation-hardening alloy according to claim 2 , characterized by being applied to electric and electronic equipment.8. The precipitation-hardening alloy according to claim 3 , characterized by being applied to electric and electronic equipment.9. The precipitation-hardening alloy according to claim 4 , characterized by being applied to electric and electronic equipment.10. The precipitation-hardening alloy according to claim 2 , characterized by being applied to contact probe pins.11. The precipitation- ...

Подробнее
03-02-2022 дата публикации

Ceramic copper circuit board and semiconductor device using same

Номер: US20220037225A1
Принадлежит: Toshiba Corp, Toshiba Materials Co Ltd

A ceramic copper circuit board including a ceramic substrate, and a copper circuit part located on the ceramic substrate, wherein an arbitrary line parallel to a first direction at a cross section of the copper circuit part parallel to the first direction crosses multiple copper crystal grains, the first direction is from the ceramic substrate toward the copper circuit part, an average of multiple distances in a second direction between the line and edges of the copper crystal grains is not more than 300 μm, and the second direction is perpendicular to the first direction.

Подробнее
16-01-2020 дата публикации

Timepiece component with a shaft-like portion made of non-magnetic alloy

Номер: US20200019122A1
Принадлежит: Blancpain SA

A timepiece component including a shaft-like portion including at least one pivot about a pivot axis, at least the material forming this shaft-like portion is a non-magnetic alloy containing at least silver and palladium and having a Vickers hardness of more than 450 HV.

Подробнее
21-01-2021 дата публикации

PLATINUM-BASED ALLOY CATALYST AND PREPARATION METHOD THEREFOR, MEMBRANE ELECTRODE, AND FUEL CELL

Номер: US20210020955A1

The disclosure includes a platinum-based alloy catalyst and a preparation method thereof, a membrane electrode and a fuel cell. The method for preparing the platinum-based alloy catalyst comprises the following steps: (1) preparing nano-sized alloy particles of platinum and 3d transition metal; (2) carrying out acid treatment on the alloy particles prepared in step (1); and (3) annealing the alloy particles treated in step (2). The size of the platinum-based alloy particles is controlled, an atom number ratio of platinum to transition metal in the platinum-based alloy is controlled, and then etching and dissolution of acid is combined so that an atom number ratio of platinum to transition metal is further controlled, subsequently annealing is carried out at high temperature. The prepared platinum-based alloy catalyst improves the stability and durability of the platinum-based alloy catalyst, which supports the large-scale application of the platinum-based alloy catalyst in the fuel cell. 1. A preparation method of a platinum-based alloy catalyst , comprising the following steps:(1) preparing nano-sized alloy particles of platinum and a 3d transition metal;(2) carrying out an acid treatment on the nano-sized alloy particles prepared in step (1), wherein the acid treatment is carried out at 40-90° C.; and(3) annealing the nano-sized alloy particles treated in step (2), wherein an annealing temperature is 100-200° C.2. The preparation method of the platinum-based alloy catalyst according to claim 1 , wherein in step (1) claim 1 , an atom number ratio of platinum to the 3d transition metal in the nano-sized alloy particles is controlled to be 1:(1-5).3. The preparation method of the platinum-based alloy catalyst according to claim 2 , wherein in step (1) claim 2 , the atom number ratio of platinum to the 3d transition metal in the nano-sized alloy particles is controlled to be 1:(1-3).4. The preparation method of the platinum-based alloy catalyst according to claim 1 , ...

Подробнее
28-01-2016 дата публикации

PREFERRED ORIENTED AU FILM, METHOD FOR PREPARING THE SAME AND BONDING STRUCTURE COMPRISING THE SAME

Номер: US20160024678A1
Автор: CHEN Chih, CHIU Wei-Lan
Принадлежит:

The present invention relates to a preferred oriented Au film, a method for preparing the same, and a bonding structure comprising the same. The Au film comprises a plurality of Au grains connected to each other, wherein at least 50% by volume of the Au grains are composed of a plurality of nano-twin Au grains, and the nano-twin Au grains are formed of a plurality of nano-twin Au stacked along a [] crystal axial orientation. 1. A preferred oriented Au film , comprising a plurality of Au grains connected to each other , wherein at least 50% by volume of the Au grains are composed of a plurality of nanotwinned Au grains , and the nanotwinned Au grains are formed of a plurality of nanotwinned Au stacked along a [111] crystal axial orientation.2. The preferred oriented Au film of claim 1 , wherein the Au film has a thickness direction claim 1 , and any cross-section perpendicular to the thickness direction has at least 50% by area of a [111] crystal plane.3. The preferred oriented Au film of claim 1 , wherein the Au film has a thickness of 0.05-1000 μm.4. The preferred oriented Au film of claim 1 , wherein the nanotwinnedAu grains have a thickness of 0.05-1000 μm.5. The preferred oriented Au film of claim 1 , wherein the nanotwinnedAu grains have a diameter of 0.1-10 μm.6. A method for preparing a preferred oriented Au film claim 1 , comprising:(A) providing a plating apparatus comprising an anode, a cathode, a pulsed current supply, and a plating solution, wherein the pulse current supply is electrically connected to the anode and the cathode which are immersed in the plating solution; and(B) providing a pulse current for plating by using the pulsed current supply to grow an Au film on a surface of the cathode;wherein the Au film comprises a plurality of Au grains connected to each other, wherein at least 50% by volume of the Au grains are composed of a plurality of nanotwinned Au grains, and the nanotwinned Au grains are formed of a plurality of nanotwinned Au stacked ...

Подробнее
26-01-2017 дата публикации

DETECTION DEVICE COMPRISING AN IMPROVED COLD FINGER

Номер: US20170023412A1
Принадлежит:

The detection device comprises a cold finger which performs the thermal connection between a detector and a cooling system. The cold finger comprises at least one side wall at least partially formed by an area made from the amorphous metal alloy. Advantageously, the whole of the cold finger is made from the amorphous metal alloy. 2. The detection device according to claim 1 , wherein the area made from amorphous metal alloy forms a ring.3. The detection device according to claim 2 , wherein the at least one side wall is completely formed by an amorphous metal alloy.4. The detection device according to claim 3 , wherein the cold finger comprises a top formed from crystalline metal and connected to the readout circuit.5. The detection device according to claim 1 , wherein the amorphous metal alloy is chosen from Zirconium/Aluminium/Nickel/Copper alloys claim 1 , Zirconium/Titanium/Copper/Nickel/Beryllium alloys claim 1 , Iron/Nickel/Phosphorus/Boron alloys claim 1 , Iron/Boron alloys claim 1 , Iron/Nickel/Chromium/Phosphorus/Boron alloys claim 1 , Palladium/Nickel/Copper/Phosphorus alloys claim 1 , Palladium/Nickel/Phosphorus alloys claim 1 , Iron/Cobalt/Yttrium/Boron alloys claim 1 , and Cobalt/Nickel/Iron/Silicon/Boron alloys.6. The detection device according to claim 5 , wherein the amorphous metal alloy is chosen from ZrAlNiCualloys claim 5 , ZrTiCuNiBealloys claim 5 , FeBalloys claim 5 , FeNiPBand FeNiCrPBalloys claim 5 , PdNiCuPalloys claim 5 , PdNiPalloys claim 5 , Fe/Co/Y/Bor Fe/Co/Cr/Mo/C/B/Yor (Fe/Cr/Co/Mo/Mn/C/B)/Yalloys claim 5 , and CoNFeSiBalloys. This is a continuation of application Ser. No. 14/335,073 filed Jul. 18, 2014, and claims the benefit of French Application No. 1301711 filed Jul. 18, 2013. The entire disclosures of the prior applications are hereby incorporated by reference in their entirety.The invention relates to a detection device comprising a cold finger forming a cooling support of an infrared detector.In the field of detection devices, ...

Подробнее
10-02-2022 дата публикации

MEDICAL Au-Pt-Pd ALLOY

Номер: US20220042140A1
Принадлежит:

The present invention relates to a medical Au—Pt—Pd alloy including Au, Pt, Pd, and inevitable impurities. The Au—Pt—Pd alloy has an alloy composition inside a polygon (A1-A2-A3-A4) surrounded by straight lines connected at point A1 (Au: 53 atom %, Pt: 4 atom %, and Pd: 43 atom %), point A2 (Au: 70 atom %, Pt: 4 atom %, and Pd: 26 atom %), point A3 (Au: 69.9 atom %, Pt: 30 atom %, and Pd: 0.1 atom %), and point A4 (Au: 49.9 atom %, Pt: 50 atom %, and Pd: 0.1 atom %) in a Au—Pt—Pd ternary state diagram. In a metal structure of the alloy, at least one of a Au-rich phase and a Pt-rich phase is distributed, and the total of the area ratio of the Au-rich phase and the area ratio of the Pt-rich phase is 1.5% or more and 25.4% or less. 1. A medical Au—Pt—Pd alloy comprising Au , Pt , Pd , and inevitable impurities , whereinthe medical Au—Pt—Pd alloy has an alloy composition inside a polygon (A1-A2-A3-A4) surrounded by straight lines connected at point A1 (Au: 53 atom %, Pt: 4 atom %, and Pd: 43 atom %), point A2 (Au: 70 atom %, Pt: 4 atom %, and Pd: 26 atom %), point A3 (Au: 69.9 atom %, Pt: 30 atom %, and Pd: 0.1 atom %), and point A4 (Au: 49.9 atom %, Pt: 50 atom %, and Pd: 0.1 atom %) in a Au—Pt—Pd ternary state diagram, andin a metal structure on any cross-section,with a composition of a mother phase Au—Pt—Pd alloy as a criterion, at least one of a Au-rich phase which is an alloy phase having a Au content higher by 4 atom % or more than that of the mother phase and a Pt-rich phase which is an alloy phase having a Pt content higher by 4 atom % or more than that of the mother phase is distributed, and a total of an area ratio of the Au-rich phase and an area ratio of the Pt-rich phase is 1.5% or more and 25.4% or less.2. The medical Au—Pt—Pd alloy according to claim 1 , which has an alloy composition within the range inside a polygon (A1-A2-B3-B4) surrounded by straight lines connected at point A1 (Au: 53 atom % claim 1 , Pt: 4 atom % claim 1 , and Pd: 43 atom %) claim 1 ...

Подробнее
29-01-2015 дата публикации

CONTACT MATERIAL SUITABLE FOR FUEL SENDER SLIDER, AND FUEL SENDER SLIDER

Номер: US20150027223A1
Принадлежит: TANAKA KIKINZOKU KOGYO K.K.

Proposed is a contact material constituting a slider for a fuel sender, the slider moving on a conductor in conjunction with a float moving in accordance with a liquid level, wherein the contact material includes 10 to 25 mass % of nickel and a balance of palladium. The present contact material is useful in the light of material cost in addition to corrosion resistance and durability. The fuel sender is useful for vehicles, such as FFV, using composite fuel of alcohol and the like. The present invention allows for producing a slider for a fuel sender having excellent corrosion resistance and abrasion resistance. 1. A contact material for a slider for a fuel sender , the slider being capable of moving on a conductor in conjunction with a float capable of moving in accordance with a liquid level , wherein the contact material comprises 10 to 25 mass % of nickel and a balance being palladium.2. A slider for a fuel sender comprising the contact material defined in .3. A fuel sender having the slider defined in .4. A fuel sender for detecting a liquid level in a fuel tank which comprises: a substrate claim 2 , a conductor on the substrate claim 2 , and a resistor on the substrate claim 2 , which resistor is electrically connected to the conductor claim 2 , a slider electrically connected to the conductor and which slider is capable of moving on the conductor claim 2 , the slider being connected to an arm claim 2 , which arm is connected to a float claim 2 , which float is adapted to rise and fall in accordance with a liquid level when positioned in a fuel tank claim 2 , which slider changes a value of the resistor in response to a movement of the arm claim 2 , the slider comprising a contact material which comprises 10 to 25 mass % of nickel and a balance being palladium. 1. Technical FieldThe present invention relates to a contact material suitable for a constituent material of a slider of a fuel sender that detects the amount of fuel remaining in a vehicle.2. ...

Подробнее
28-01-2016 дата публикации

Ion Beam Modification of Noble Metals for Electrical Contacts

Номер: US20160027547A1
Принадлежит:

Ion beam modification of noble metal electrical contact coatings can achieve suitable friction and wear behavior with inherently stable low ECR. For example, this method of producing Au electrical contact coatings can produce wear properties similar to electroplated hard Au, but without the environmental concerns due to stringent OSHA regulations on the use and disposal of toxic chemicals associated with Au electroplating baths. Integration of physical vapor deposition techniques with ion implantation can produce noble metal coatings with surfaces modified to achieve the desired balance between adhesion/friction/wear and electrical contact resistance on a commercial scale. 1. An electrical contact , comprising a noble metal thin film that has been ion implanted with a noble gas.2. The electrical contact of claim 1 , wherein the noble metal comprises Au.3. The electrical contact of claim 1 , wherein the noble metal comprises Pd claim 1 , Ag claim 1 , or Pt.4. The electrical contact of claim 1 , wherein the noble gas comprises He claim 1 , Ne claim 1 , Ar claim 1 , Kr claim 1 , or Xe.5. The electrical contact of claim 1 , wherein the noble gas is ion implanted to a dose of greater than 1×10ions-cmand less than 1×10ions-cm.6. The electrical contact of claim 1 , wherein the thickness of the noble metal thin film is less than 10 microns.7. A method for fabricating an electrical contact claim 1 , comprising:depositing a noble metal film on a substrate, andion implanting a noble gas into the noble metal film.8. The method of claim 7 , wherein the noble metal comprises Au.9. The method of claim 7 , wherein the noble metal comprises Pd claim 7 , Ag claim 7 , or Pt.10. The method of claim 7 , wherein the noble gas comprises He claim 7 , Ne claim 7 , Ar claim 7 , Kr claim 7 , or Xe.11. The method of claim 7 , wherein the depositing comprises physical vapor deposition.12. The method of claim 11 , wherein the physical vapor deposition comprises e-beam evaporation.13. The method ...

Подробнее
23-01-2020 дата публикации

AIRFOIL WITH IMPROVED COATING SYSTEM AND METHODS OF FORMING THE SAME

Номер: US20200024976A1
Принадлежит:

A coating system for a surface of a superalloy component is provided. The coating system includes a MCrAlY coating on the surface of the superalloy component, where M is Ni, Fe, Co, or a combination thereof. The MCrAlY coating generally has a higher chromium content than the superalloy component. The MCrAlY coating also includes a platinum-group metal aluminide diffusion layer. The MCrAlY coating includes Re, Ta, or a mixture thereof. Methods are also provided for forming a coating system on a surface of a superalloy component. 1. A method of forming a coating system on a surface of a superalloy component , the method comprising:forming a MCrAlY layer on the surface of the superalloy component, wherein the MCrAlY layer has a chromium content that is higher than the superalloy component, and wherein M is Ni, Fe, Co, or a combination thereof;forming a platinum-group metal layer on the MCrAlY layer;heating the platinum-group metal layer to a treatment temperature of about 900° C. to about 1200° C.; andforming an aluminide coating over the platinum-group metal layer.2. The method as in claim 1 , further comprising:heating the coating system to form a MCrAlY coating from the MCrAlY layer, the platinum-group metal layer, and the aluminide coating.3. The method as in claim 2 , wherein the surface of the superalloy component defines a plurality of film holes therein claim 2 , and wherein the MCrAlY coating is formed to a thickness of about 10 μm to about 100 μm while keeping the film holes defined within the surface of the superalloy component open.4. The method as in claim 1 , wherein the MCrAlY layer claim 1 , prior to forming the platinum-group metal layer claim 1 , has a composition comprising up to about 25% Cr claim 1 , about 6 to about 7% Al claim 1 , up to about 1% Hf claim 1 , up to about 0.5% Y claim 1 , about 8% to about 12% Co claim 1 , about 5% to about 7% Ta claim 1 , about 1% to about 3% Re claim 1 , about 0.5 to about 1.5% Si claim 1 , up to about 0.5% Zr ...

Подробнее
28-01-2021 дата публикации

SILVER PASTE COMPOSITION FOR CONFIGURABLE SINTERED INTERCONNECT AND ASSOCIATED METHOD OF PREPARATION

Номер: US20210024766A1
Принадлежит:

A silver paste composition for screen and/or 3D printing of interconnects of an integrated circuit chip on a metal oxide ink coated stainless steel substrate carrier comprising a mixture of two or more distinct range of sizes of electrically conductive silver particles, a resin in an amount from 0.05 to 10 wt. % of the silver paste composition, a solvent in an amount from 1 to 25 wt. % of the silver paste composition, such that the silver paste composition has silver particles containing calcium content of less than 20 ppm and a viscosity of 10 to 400 Pa·s at a shear rate of 10 secat 25° C. 1. A silver paste composition for screen and/or 3D printing of interconnects of an integrated circuit chip on a metal oxide ink coated stainless steel substrate carrier comprising:a mixture of two or more distinct range of sizes of electrically conductive silver particles;a resin in an amount from 0.05 to 10 wt. % of the silver paste composition;a solvent in an amount from 1 to 25 wt % of the silver paste composition; and{'sup': '−1', 'wherein the conductive silver particles are imbedded with a calcium content of less than 20 ppm, and wherein the silver paste composition has a viscosity of 10 to 400 Pa·s at a shear rate of 10 secat 25° C.'}2. The silver paste composition of claim 1 , wherein the mixture of two or more distinct range of sizes of electrically conductive silver particles comprises:a combination of two or more multi-micron-sized silver particles, wherein smaller micron-sized particles are in the range of 3 to 8 μm with a particle size distribution of D50, and bigger micron-sized particles are in the range of 8 to 20 μm with a particle size distribution of D90; andwherein the wt. ratio of the bigger micron-sized particles to the smaller micron-sized particles is approximately 3:1, and wherein the multi-micron-sized silver particles are greater than 50 wt. % of the silver paste composition.3. The silver paste composition of claim 1 , wherein the mixture of two or more ...

Подробнее
28-01-2021 дата публикации

Binary Ag-Cu Amorphous Thin-Films for Electronic Applications

Номер: US20210025051A1
Принадлежит:

An interconnect and a method of making an interconnect between one or more features on a substrate comprises: sputtering a noble metal-copper eutectic thin film under controlled power on an oxide grown or deposited on a substrate; and forming an amorphous alloy structure from the noble metal-copper eutectic thin film in the shape of the interconnect and the interconnect comprising no grain or grain boundaries without temperature sensitive resistivity. 1. An integrated circuit interconnect on a substrate comprising:an amorphous noble metal-copper metallic alloy glass thin film disposed on the substrate, wherein the amorphous noble metal-copper metallic alloy glass thin film is homogenous with no poly-crystalline heterogeneity; andwherein the amorphous noble metal-copper metallic alloy glass thin film comprises 20 to 70 at % copper and a remainder at % noble metal.2. The interconnect of claim 1 , wherein the noble metal is selected from at least one of ruthenium claim 1 , rhodium claim 1 , palladium claim 1 , silver claim 1 , osmium claim 1 , iridium claim 1 , platinum claim 1 , or gold.3. The interconnect of claim 1 , wherein the interconnect is formed by low power sputtering in a temperature gradient assist.4. The interconnect of claim 1 , wherein the amorphous noble metal-copper metallic alloy glass thin film is an eutectic that comprises 60 to 80 at % noble metal and the remainder at % copper.5. The interconnect of claim 1 , wherein the amorphous noble metal-copper metallic alloy glass thin film is an eutectic.6. The interconnect of claim 1 , wherein the interconnect is formed with a deposition rate is 0.5 claim 1 , 0.6 claim 1 , 0.7 claim 1 , 0.8 claim 1 , 0.9 claim 1 , 1.0 claim 1 , 1.1 claim 1 , 1.2 claim 1 , 1.3 claim 1 , 1.4 claim 1 , 1.5 claim 1 , 1.6 claim 1 , 1.7 claim 1 , 1.8 claim 1 , 1.9 claim 1 , or 2.0 Å/s.7. The interconnect of claim 1 , wherein the interconnect is formed by a low power sputtering at 20 claim 1 , 30 claim 1 , 40 claim 1 , 50 claim 1 ...

Подробнее
23-01-2020 дата публикации

STABLE BINARY NANOCRYSTALLINE ALLOYS AND METHODS OF IDENTIFYING SAME

Номер: US20200025697A1
Принадлежит: Massachusetts Institute of Technology

Identifying a stable phase of a binary alloy comprising a solute element and a solvent element. In one example, at least two thermodynamic parameters associated with grain growth and phase separation of the binary alloy are determined, and the stable phase of the binary alloy is identified based on the first thermodynamic parameter and the second thermodynamic parameter, wherein the stable phase is one of a stable nanocrystalline phase, a metastable nanocrystalline phase, and a non-nanocrystalline phase. In different aspects, an enthalpy of mixing of the binary alloy may be calculated as a first thermodynamic parameter, and an enthalpy of segregation of the binary alloy may be calculated as a second thermodynamic parameter. In another example, a diagram delineating a plurality of regions respectively representing different stable phases of at least one binary alloy is employed, wherein respective regions of the plurality of regions are delineated by at least one boundary determined as a function of at least two thermodynamic parameters associated with grain growth and phase separation of the at least one binary alloy. 143-. (canceled)44. An alloy comprising:a solvent element and a solute element;the alloy comprising at least one of Al—Pb, Co—Bi, Co—Cd, Co—Pb, Cr—Au, Cr—Bi, Cr—La, Cr—Na, Cr—Pb, Cr—Sc, Cr—Sn, Cr—Th, Cr—Y, Cu—Y, Fe—Ba, Fe—Bi, Fe—Ca, Fe—Cd, Fe—In, Fe—La, Fe—Mg, Fe—Pb, Hf—Mg, Hf—Ti, Ir—Cu, Ir—Ni, Ir—Rh, La—Mn, Mn—Ba, Mn—Ca, Mn—Cd, Mn—La, Mn—Mg, Mn—Pb, Mn—Sr, Mn—Tl, Mo—Au, Mo—Cr, Mo—In, Mo—Na, Mo—Sc, Mo—Th, Mo—V, Mo—Y, Nb—Bi, Nb—Cu, Nb—Ti, Nb—Tl, Nb—V, Ni—Pb, Ni—Sn, Ni—Tl, Os—Bi, Os—Co, Os—Ni, Os—Pb, Os—Pt, Os—Rh, Os—Ru, Pb—Al, Pd—Au, Pt—Au, Re—Bi, Re—Co, Re—La, Re—Ni, Re—Pd, Re—Rh, Re—Sb, Re—Sn, Re—Tc, Rh—Au, Rh—Co, Rh—Cu, Rh—Ni, Ru—Bi, Ru—Co, Ru—Hg, Ru—Ni, Ru—Pt, Ru—Sb, Ta—Bi, Ta—Cu, Ta—Hf, Ta—In, Ta—Ti, Ta—Tl, Ta—Zr, Tc—Ni, Tc—Pd, Tc—Rh, Th—La, Th—Sc, Th—Y, V—Bi, V—Cd, V—In, V—Ti, V—Tl, W—Au, W—Cr, W—In, W—Mn, W—Sb, W—Sc, W—Sn, W—Sr, W—Th, W—Ti, W—V, W ...

Подробнее
24-04-2014 дата публикации

RECOVERY OF GOLD FROM ROASTER CALCINE LEACH TAILINGS

Номер: US20140112823A1
Принадлежит: BARRICK GOLD CORPORATION

A method to recover gold lost in roaster calcine-leach tailings, due to the formation of cyanide refractory compounds or morphologies during the roasting process. The process can include acid leaching of magnetic concentrate from roaster leach tailings, combining the acid leach slurry to the pre-acidulation tank for pressure oxidation feed, acid pressure oxidation of the pressure oxidation feed, and recovery of gold. 1. A process , comprising:magnetically separating an iron-containing magnetic concentrate from an iron-containing material;leaching, by a mineral acid, iron from the iron-containing magnetic concentrate to form a dissolved iron-containing leach slurry;contacting at least a portion of the dissolved iron-containing leach slurry with a precious metal- and carbonate-containing material; andthereafter recovering the precious metal from the precious metal- and carbonate-containing material.2. The process of claim 1 , wherein the iron-containing magnetic concentrate and material each contain a precious metal and further comprising:roasting a precious metal- and iron-containing feed material to form a precious metal-containing calcine; andleaching, by a precious metal lixiviant, the precious metal-containing calcine to form a precious metal-containing fraction containing most of the precious metal in the precious metal-containing calcine and the precious metal- and iron-containing material.3. The process of claim 1 , wherein a combined feed material is formed by the contacting of the dissolved iron-containing leach slurry with a precious metal- and carbonate-containing material and wherein the combined feed material has a lower carbonate content than the precious metal- and carbonate-containing material.4. The process of claim 3 , wherein the iron-containing magnetic concentrate and material each contain a precious metal claim 3 , wherein the precious metal-containing fraction is one of a pregnant leach solution and a precious metal-containing sorbent claim 3 , ...

Подробнее
24-04-2014 дата публикации

Bonding material and bonded object produced using same

Номер: US20140113109A1
Принадлежит: Dowa Electronics Materials Co Ltd

A bonding material using silver nanoparticles considerably changes in coating-material property in response to a slight change in composition, and the stability thereof has been insufficient for large-amount application. A bonding material which uses silver nanoparticles, meets the requirements for mass printing, attains dimensional stability, and gives a smooth printed surface is provided. The bonding material includes silver nanoparticles which have at least an average primary particle diameter of 1 nm to 200 nm and have been coated with an organic substance having 8 or less carbon atoms, a dispersion medium, and a viscosity modifier composed of an organic substance, and has a viscosity (measured at a shear rate of 15.7 [1/s]) of 100 Pa·s or lower and a thixotropic ratio (measured at a shear rate of 3.1 [1/s]/measured at a shear rate of 15.7 [1/s]) of 4 or lower.

Подробнее
29-01-2015 дата публикации

Metal fine particle association and method for producing the same

Номер: US20150030967A1
Принадлежит: Gunma University NUC, Nissan Chemical Corp

There is provided a metal fine particle association suitably applied to an electrode catalyst to achieve even higher output leading to reduction in amount of the catalyst used, and a process for producing the same, that is, a metal fine particle association including a plurality of metal fine particles that have a mean particle diameter of 1 nm to 10 nm and are associated to form a single assembly, an association mixture including the metal fine particle association and a conductive support; a premix for forming an association, including metal fine particles, a metal fine particle dispersant made of a hyperbranched polymer, and a conductive support; and a method for producing the association mixture.

Подробнее
01-02-2018 дата публикации

Gold evaporative sources with reduced contaminants and methods for making the same

Номер: US20180029096A1
Принадлежит: Praxair ST Technology Inc

A unique sequence of steps is provided to reduce contaminants along one or more surfaces and faces of gold evaporative sources without deleteriously impacting the structure of the gold evaporative sources. Edges are deburred; contaminants are successfully removed therealong; and surface smoothness is substantially retained. The resultant gold evaporative source is suitable for use in evaporative processes as a precursor to gold film deposition without the occurrence or a substantial reduction in the likelihood of spitting by virtue of significantly reduced levels of contaminants, in comparison to gold evaporative sources subject to a standard cleaning protocol.

Подробнее
02-02-2017 дата публикации

ALLOY FOR MEDICAL USE, AND METHOD FOR PRODUCING SAME

Номер: US20170029927A1
Принадлежит:

The present invention provides an alloy for medical use including an Au—Pt alloy, in which the Au—Pt alloy has a Pt concentration of 24 mass % or more and less than 34 mass % with the balance being Au, and has at least a material structure in which a Pt-rich phase having a Pt concentration higher than that of an α-phase is distributed in an α-phase matrix, the Pt-rich phase has a Pt concentration that is 1.2 to 3.8 times the Pt concentration of the α-phase, and the Pt-rich phase has an area ratio of 1 to 22% in any cross-section. This alloy is an artifact-free alloy material that exhibits excellent compatibility with a magnetic field environment such as an MRI and has magnetic susceptibility of ±4 ppm with respect to magnetic susceptibility of water. 1. An alloy for medical use comprising an Au—Pt alloy , whereinthe Au—Pt alloy has a Pt concentration of 24 mass % or more and less than 34 mass % with a balance being Au, and has at least a material structure in which a Pt-rich phase having a Pt concentration higher than that of an α-phase is distributed in an α-phase matrix,the Pt-rich phase has a Pt concentration that is 1.2 to 3.8 times the Pt concentration of the α-phase, andthe Pt-rich phase has an area ratio of 1 to 22% in any cross-section.2. The alloy for medical use according to claim 1 , whereinthe Pt concentration is 28 mass % or more and less than 34 mass %,{'sub': '2', 'the Pt-rich phase is distributed as an α-phase, and'}the Pt-rich phase has an area ratio of 5 to 15% in any cross-section.3. The alloy for medical use according to claim 1 , whereinthe Pt concentration is 24 mass % or more and less than 28 mass %,the Au—Pt alloy having the Pt concentration of 86 to 90 wt % is distributed as the Pt-rich phase, andthe Pt-rich phase has an area ratio of 10 to 22% in any cross-section.4. The alloy for medical use according to claim 1 , whereinthe Pt concentration is 28 mass % or more and less than 34 mass %,the Au—Pt alloy having the Pt concentration of 86 to ...

Подробнее
04-02-2016 дата публикации

Low Silver, Low Nickel Brazing Material

Номер: US20160032429A1
Автор: Belohlav Alan, Kuta Marcin
Принадлежит:

A homogenous brazing material essentially consisting of relatively low amounts of silver and nickel together with copper, zinc, and other constituents is provided. The brazing material has a working temperature exceeding 630° F. and is preferably between about 1250° F. and 1500° F. The brazing material preferably has about 30 percent by weight of silver, about 36 percent by weight of copper, about 32 percent by weight of zinc, and about 2 percent by weight of nickel. The addition of nickel in the above-specified amount improves resistance against interface corrosion in aqueous solutions, aids in the strength of the alloy, and provides improved wettability on ferrous and non-ferrous substrates. The brazing material may also include a flux, such as a core or a coating. 1. A brazing material consisting essentially ofless than approximately 35 percent by weight of silver;less than approximately 40 percent by weight of copper;more than 18 percent by weight of zinc; andfrom approximately 1.75 percent by weight to approximately 2.25 percent by weight of nickel.2. The material of having silver in an amount less than 32 percent by weight of silver.3. The material of having silver in an amount less than 31 percent by weight of silver.4. The material of having from approximately 29 percent by weight to approximately 31 percent by weight of silver.5. The material of having from approximately 31 percent by weight to approximately 40 percent by weight of zinc.6. The material of having copper in an amount less than 38 percent by weight.7. The material of having copper in an amount less than approximately 37 percent by weight.8. The material of having from approximately 35 percent by W eight to approximately 37 percent by weight of copper.9. The material of having a working temperature greater than approximately 630° F.10. The material of having a working temperature of between 1250° F. and 1450° F.11. The material of in the form of at least one of a strip claim 1 , a wire claim 1 ...

Подробнее
04-02-2016 дата публикации

PROCESS FOR MAKING FINISHED OR SEMI-FINISHED ARTICLES OF SILVER ALLOY

Номер: US20160032436A1
Автор: Johns Peter Gamon
Принадлежит:

A process for making a finished or semi-finished article of silver alloy, said process comprising the steps of providing a silver alloy containing silver in an amount of at least 77 wt %, copper and an amount of germanium that is preferably at least 0.5 wt % and is effective to reduce tarnishing and/or firestain, making or processing the finished or semi-finished article of the alloy by heating at least to an annealing temperature, gradually cooling the article; and reheating the article to effect precipitation hardening thereof. The avoidance of quenching reduces the risk of damage to the article. 1. A process for making a finished or semi-finished article of silver alloy , said process comprising the steps of:providing a silver alloy containing silver in an amount of at least 77 wt %, copper and an amount of germanium that is at least 0.5 wt % and that is effective to reduce tarnishing and/or firestain;making or processing the finished or semi-finished article of the alloy by heating at least to 600° C. for annealing or brazing or to a melting temperature;gradually cooling the article over a period of at least 10 seconds; andreheating the article at 180-350° C. to effect precipitation hardening thereof.2. The process of claim 1 , wherein the silver is melted claim 1 , gradually cooled from molten and reheated to effect precipitation hardening.3. The process of claim 1 , wherein annealing and/or brazing is carried out at a. temperature of from 600-650° C.4. The process of claim 1 , wherein the alloy is reheated at about 200-300° C.5. The process of claim 1 , wherein germanium is present in the alloy in an amount of 0.8-1.5 wt %.6. The process of claim 1 , wherein 1-40 ppm boron is present in the alloy as grain refiner.7. The process of claim 1 , wherein the article is claim 1 , apart from grain refiner claim 1 , a ternary alloy of silver claim 1 , copper and germanium.8. The process of claim 7 , wherein the alloy comprises claim 7 , apart from impurities claim 7 , ...

Подробнее
31-01-2019 дата публикации

EMBOLIZATION COIL AND METHOD FOR PRODUCING EMBOLIZATION COIL

Номер: US20190030215A1
Принадлежит:

The present invention is an embolization coil having an optimum morphological stability. The embolization coil includes a wire material made of an Au—Pt alloy. The wire material constituting the embolization coil has such a composition that a Pt concentration is 24 mass % or more and less than 34 mass %, with the balance being Au. The wire material has such a material structure that a Pt-rich phase of an Au—Pt alloy having a Pt concentration of 1.2 to 3.8 times a Pt concentration of an α phase is distributed in an α phase matrix. The wire material has a bulk susceptibility of −13 ppm or more and −5 ppm or less. In a material structure of a transverse cross-section of the wire material, an average value of two or more average crystal particle diameters measured by a linear intercept method is 0.20 μm or more and 0.35 μm or less. 1. An embolization coil comprising a wire material made of an Au—Pt alloy ,wherein the wire material constituting the embolization coil has such a composition that a Pt concentration is 24 mass % or more and less than 34 mass %, with the balance being Au, and the wire material has such a material structure that a Pt-rich phase of an Au—Pt alloy having a Pt concentration of 1.2 to 3.8 times a Pt concentration of an α phase is distributed in an α phase matrix,wherein the wire material has a bulk susceptibility of −13 ppm or more and −5 ppm or less, andwherein in a material structure of a transverse cross-section of the wire material, an average value of two or more average crystal particle diameters measured by a linear intercept method is 0.20 μm or more and 0.35 μm or less.2. The embolization coil according to claim 1 , wherein in the material structure of the transverse cross-section of the wire material claim 1 , a standard deviation of the two or more average crystal particle diameters measured by the linear intercept method is 0.025 or more and 0.085 or less.3. The embolization coil according to claim 1 , wherein the wire material has a ...

Подробнее
31-01-2019 дата публикации

METHODS OF CONTROLLING NANOWIRE MORPHOLOGY

Номер: US20190030610A1
Принадлежит:

Disclosed herein are synthetic methods of producing silver nanowires with controlled morphology, as well as purifying the same. Also disclosed are coating solutions comprising populations of silver nanowires of certain length and diameter distributions. 1. A coating solution comprising a plurality of silver nanostructures , wherein more than 80% of the silver nanostructures with aspect ratios of at least 3 are less than about 25 nm in diameter.2. A coating solution of claim 1 , wherein more than 90% of the silver nanostructures with aspect ratios of at least 3 are more than 5 μm long.3. The coating solution of claim 1 , wherein the silver nanostructures with aspect ratios of at least 3 have a mean length of about 12-20 μm claim 1 , and a standard deviation of about 6 to 8 μm.4. The coating solution of claim 1 , wherein more than 85% of the silver nanostructures with aspect ratios of at least 3 have a length within 5-25 μm.5. A conductive film prepared by a coating solution of .6. The conductive film of having a haze of less than 1.3% at sheet resistance of less than about 35 ohms/sq. This disclosure is a division of and claims priority to U.S. patent application Ser. No. 14/684,313, now pending and filed on Apr. 10, 2015, which claims the benefit under 35 U.S.C. § 119(e) of U.S. Provisional Patent Application No. 61/978,715, filed Apr. 11, 2014, which application is incorporated herein by reference in its entirety.This disclosure relates to the field of nanotechnology, and more specifically to processes of controlling silver nanowire morphology, i.e., their lengths, diameters and aspect ratios.Silver nanowires are the key components of transparent conductive films, which find wide applications in electronic devices, such as touch panels, photovoltaic cells, flat liquid crystal displays (LCD), organic light emitting diodes (OLED), and the like. Unlike transparent conductive films formed by vacuum depositing a continuous metal oxide layer (e.g., indium tin oxide), ...

Подробнее
30-01-2020 дата публикации

ALLOYS

Номер: US20200030921A1
Принадлежит:

Novel alloys which can be employed in joining technology and have improved wetting properties are described. 121-. (canceled)22. A process for vacuum brazing of joints for use in vacuum switching chambers , the process comprising brazing of the joints using a brazing alloy comprising the following constituents: from 41% by weight to 75% by weight of copper; from 20% by weight to 44% by weight of silver; from 5% by weight to 15% by weight of gallium wherein the constituents have a carbon content that does not exceed 0.005 by weight , and wherein the content of cadmium , phosphorus , lead , and zinc of the brazing alloy does not exceed 0.01% by weight each.23. The process of claim 22 , wherein the brazing alloy contains from 25 to 40% by weight of silver.24. The process of claim 22 , wherein the brazing alloy contains from 45 to 60% by weight of copper.25. The process of claim 22 , wherein the brazing alloy contains from 6% by weight to 14% by weight of gallium.26. The process of claim 22 , wherein the silver and copper in the brazing alloy are present in a proportional ratio of from 25:61 to 44:45.27. The process of claim 22 , wherein the brazing alloy further comprises from 0.1% by weight to 15% by weight of one or more further alloy constituents selected from the group consisting of manganese claim 22 , nickel claim 22 , indium claim 22 , tin claim 22 , germanium claim 22 , titanium and silicon.28. The process of claim 27 , wherein the one or more further alloy constituents are selected from the group consisting of from 0.5% by weight to 15% by weight of manganese claim 27 , from 0.1% by weight to 5% by weight of nickel claim 27 , from 0.5% by weight to 7% by weight of indium claim 27 , from 0.3% by weight to 3% by weight of tin claim 27 , from 0.3% by weight to 1.5% by weight of germanium claim 27 , from 0.1% by weight to 4% by weight of titanium claim 27 , and from 0.1% by weight to 1% by weight of silicon and combinations thereof.29. A vacuum switching chamber ...

Подробнее
04-02-2016 дата публикации

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING SAME

Номер: US20160035691A1
Принадлежит: Mitsubishi Electric Corporation

A semiconductor device includes, an alloy layer sandwiched between a first Ag layer formed on a mounting board or circuit board and a second Ag layer formed on a semiconductor element, wherein the alloy layer contains an intermetallic compound of AgSn formed by Ag components of the first Ag layer and the second Ag layer and Sn, and wherein a plurality of wires containing Ag are arranged extended from an outside-facing periphery of the alloy layer. 1. A semiconductor device in which a semiconductor element is bonded to a mounting board , said semiconductor device comprising:an alloy layer sandwiched between a first Ag layer formed on the mounting board and a second Ag layer formed on the semiconductor element;{'sub': '3', 'wherein the alloy layer contains an intermetallic compound of AgSn formed by Ag components of the first Ag layer and the second Ag layer and Sn, and a plurality of wires containing Ag are arranged as being extended from an outside-facing periphery of the alloy layer.'}2. The semiconductor device of claim 1 , wherein the wires are arranged as being extended in the same direction.3. The semiconductor device of claim 1 , wherein the wires are arranged as being extended radially from the outside-facing periphery of the alloy layer.4. The semiconductor device of claim 1 , wherein claim 1 , in the wires claim 1 , as a material other than Ag claim 1 , there is added at least one of Pd claim 1 , Ni claim 1 , Cu claim 1 , Fe claim 1 , Au claim 1 , Pt claim 1 , Al claim 1 , Sn claim 1 , Sb claim 1 , Ti and P.5. The semiconductor device of claim 1 , wherein the semiconductor element is formed of a wide bandgap semiconductor material.6. (canceled)7. A semiconductor device fabrication method of fabricating a semiconductor device in which a semiconductor element is bonded to a mounting board claim 1 , said semiconductor device fabrication method comprising:a wire structure forming step of forming a wire structure in which a plurality of wires containing Ag are ...

Подробнее
02-02-2017 дата публикации

POWER MODULE SUBSTRATE, POWER MODULE SUBSTRATE WITH HEAT SINK, POWER MODULE, METHOD OF MANUFACTURING POWER MODULE SUBSTRATE, AND COPPER MEMBER-BONDING PASTE

Номер: US20170034905A1
Принадлежит:

This power module substrate includes a copper plate that is formed of copper or a copper alloy and is laminated on a surface of a ceramic substrate a nitride layer that is formed on the surface of the ceramic substrate between the copper plate and the ceramic substrate and an Ag—Cu eutectic structure layer having a thickness of 15 μm or less that is formed between the nitride layer and the copper plate. 1. A power module substrate , comprising:{'sub': 3', '4, 'a ceramic substrate that is formed of AlN or SiNand has a first surface;'}a copper plate that is formed of copper or a copper alloy and is laminated and bonded on the first surface of the ceramic substrate;a nitride layer that contains at least one nitride of elements selected from Ti, Hf, Zr, and Nb and is formed on the first surface of the ceramic substrate between the copper plate and the ceramic substrate; andan Ag—Cu eutectic structure layer that has a thickness of 15 μm or less and is formed between the nitride layer and the copper plate;wherein the thickness of the Ag—Cu eutectic structure layer is measured by a method comprising:obtaining a backscattered electron image of an interface between the copper plate and the ceramic substrate using an EPMA;based on the backscattered electron image, measuring the area of the Ag—Cu eutectic structure layer continuously formed on the bonding interface in a measurement visual field at a magnification of 2000 times;dividing the area of the Ag—Cu eutectic structure layer by the width of the measurement visual field, andobtaining the average of the thicknesses in five measurement visual fields as the thickness of the Ag—Cu eutectic structure layer.2. The power module substrate according to claim 1 , wherein the ceramic substrate is formed of AlN claim 1 , andthe thickness of the Ag—Cu eutectic structure layer is 14 μm or less.3. The power module substrate according to claim 1 , wherein{'sub': 3', '4, 'the ceramic substrate is formed of SiNand'}the thickness of the Ag ...

Подробнее
11-02-2016 дата публикации

Synthesis of Bimetallic Nanoparticle Catalysts Using Microwave Irradiation

Номер: US20160039008A1
Принадлежит:

The present invention provides compositions and methods of making bimetallic metal alloys of composition for example, Rh/Pd; Rh/Pt; Rh/Ag; Rh/Au; Rh/Ru; Rh/Co; Rh/Ir; Rh/Ni; Ir/Pd; Ir/Pt; Ir/Ag; Ir/Au; Pd/Ni; Pd/Pt; Pd/Ag; Pd/Au; Pt/Ni; Pt/Ag; Pt/Au; Ni/Ag; Ni/Au; or Ag/Au prepared using microwave irradiation. 1. A bimetallic metal alloy nanoparticle comprising:a random mixture of a first metal and a second metal contacting to form a randomly alloyed bimetallic nanoparticle, wherein the first metal comprises Rh; Ir; Pd; Pt; Ni; Ag; Au; or a combination thereof and the second metal comprises Ru; Co; Ir; Ni; Pd; Pt; Ag; Au; or a combination thereof.2. The bimetallic metal alloy nanoparticle of claim 1 , wherein the first metal and a second metal are in a ratio of between 1:99 and 99:1.3. The bimetallic metal alloy nanoparticle of claim 1 , wherein the bimetallic metal alloy nanoparticle is Rh/Ru metal alloy nanoparticle; Rh/Co metal alloy nanoparticle; Rh/Ir metal alloy nanoparticle; Rh/Ni metal alloy nanoparticle; Rh/Pd metal alloy nanoparticle; Rh/Pt metal alloy nanoparticle; Rh/Ag metal alloy nanoparticle; Rh/Au metal alloy nanoparticle; Ir/Pd metal alloy nanoparticle; Ir/Pt metal alloy nanoparticle; Ir/Ag metal alloy nanoparticle; Ir/Au metal alloy nanoparticle; Pd/Ni metal alloy nanoparticle; Pd/Pt metal alloy nanoparticle; Pd/Ag metal alloy nanoparticle; Pd/Au metal alloy nanoparticle; Pt/Ni metal alloy nanoparticle; Pt/Ag metal alloy nanoparticle; Pt/Au metal alloy nanoparticle; Ni/Ag metal alloy nanoparticle; Ni/Au metal alloy nanoparticle or Ag/Au metal alloy nanoparticle.4. The bimetallic metal alloy nanoparticle of claim 1 , wherein the bimetallic metal alloy nanoparticle is a Rh:Au metal alloy nanoparticle claim 1 , a Rh:Ag metal alloy nanoparticle claim 1 , a Rh:Pd metal alloy nanoparticle claim 1 , or a Rh:Pt metal alloy nanoparticle with a ratio of about 1:1; 1:2; 1:3; 2:1; or 3:1.5. The bimetallic metal alloy nanoparticle of claim 1 , wherein the ...

Подробнее
11-02-2016 дата публикации

Silver-Bismuth Powder,Conductive Paste and Conductive Film

Номер: US20160040271A1
Принадлежит: Dowa Electronics Materials Co Ltd

To provide a silver-bismuth powder, which includes: silver; and bismuth, wherein a mass ratio (silver:bismuth) of the silver to the bismuth is 95:5 to 40:60, wherein a cumulative 50% point of particle diameter (D50) of the silver-bismuth powder in a volume-based particle size distribution thereof as measured by a laser diffraction particle size distribution analysis is 0.1 μm to 10 μm, and wherein an oxygen content of the silver-bismuth powder is 5.5% by mass or less.

Подробнее
11-02-2016 дата публикации

ROLL-TO-ROLL ELECTROLESS PLATING SYSTEM WITH MICRO-BUBBLE INJECTOR

Номер: US20160040291A1
Принадлежит:

A roll-to-roll electroless plating system including a reservoir containing plating solution. A web advance system advances a web of media though the plating solution in the reservoir, wherein a plating substance in the plating solution is plated onto predetermined locations on a surface of the web of media. A distribution system injects an inert gas into the plating solution to reduce the amount of dissolved oxygen. The distribution system includes an injector having a converging tube segment, a diverging tube segment downstream of the converging tube segment, a throat formed at a junction of the converging tube segment and the diverging tube segment, and an inlet for the inert gas in proximity to the throat. 1. A roll-to-roll electroless plating system , comprising:a reservoir containing plating solution;a web advance system for advancing a web of media from an input roll through the plating solution in the reservoir to a take-up roll, wherein a plating substance in the plating solution is plated onto predetermined locations on a surface of the web of media as it is advanced through the plating solution in the reservoir; and a converging tube segment;', 'a diverging tube segment downstream of the converging tube segment;', 'a throat formed at a junction of the converging tube segment and the diverging tube segment; and', 'an inlet for the inert gas in proximity to the throat., 'a distribution system for injecting an inert gas into the plating solution, wherein the distribution system includes an injector for injecting the inert gas into the plating solution, wherein the injector includes2. The roll-to-roll electroless plating system of claim 1 , wherein diameters of the converging and diverging tube segments increase with distance from the throat.3. The roll-to-roll electroless plating system of claim 1 , wherein the injector is located downstream of a pump which pumps the plating solution through the injector.4. The roll-to-roll electroless plating system of claim ...

Подробнее
12-02-2015 дата публикации

Dispersoid reinforced alloy powder and method of making

Номер: US20150040724A1
Принадлежит:

A method of making dispersion-strengthened alloy particles involves melting an alloy having a corrosion and/or oxidation resistance-imparting alloying element, a dispersoid-forming element, and a matrix metal wherein the dispersoid-forming element exhibits a greater tendency to react with a reactive species acquired from an atomizing gas than does the alloying element. The melted alloy is atomized with the atomizing gas including the reactive species to form atomized particles so that the reactive species is (a) dissolved in solid solution to a depth below the surface of atomized particles and/or (b) reacted with the dispersoid-forming element to form dispersoids in the atomized particles to a depth below the surface of said atomized particles. The atomized alloy particles are solidified as solidified alloy particles or as a solidified deposit of alloy particles. Bodies made from the dispersion strengthened alloy particles, deposit thereof, exhibit enhanced fatigue and creep resistance and reduced wear as well as enhanced corrosion and/or oxidation resistance at high temperatures by virtue of the presence of the corrosion and/or oxidation resistance imparting alloying element in solid solution in the particle alloy matrix. 114.-. (canceled)15. Atomized alloy particles , each comprising a matrix metal comprising Au , an environmental resistance-imparting alloying element substantially in solid solution in the matrix metal to provide a particle alloy matrix , and dispersoids formed in-situ in the particle alloy matrix during atomization , wherein the particles include a surface compound thereon formed during atomization by reaction of a reactive species and the alloying element.16. The particles of having at least a surface region that contains the dispersoids.17. The particles of wherein the surface region has a thickness greater than 1 micrometer.18. (canceled)19. The particles of wherein the alloying element is selected from the group consisting of Cr claim 15 , Mo ...

Подробнее
09-02-2017 дата публикации

Synthesis of Au-induced Structurally Ordered AuPdCo Intermetallic Core-shell Nanoparticles and Their Use as Oxygen Reduction Catalysts

Номер: US20170037494A1
Принадлежит:

Embodiments of the disclosure relate to intermetallic nanoparticles. Embodiments include nanoparticles having an intermetallic core including a first metal and a second metal. The first metal may be palladium and the second metal may be at least one of cobalt, iron, nickel, or a combination thereof. The nanoparticles may further have a shell that includes palladium and gold. 1. A nanoparticle comprising intermetallic palladium and cobalt , wherein the palladium and cobalt are ordered into different distinct sites of the nanoparticle.2. The nanoparticle of claim 1 , wherein at least parts of the intermetallic palladium and cobalt comprises a trigonal symmetry.3. The nanoparticle of claim 1 , wherein at least parts of the intermetallic palladium and cobalt comprises a rhombohedral symmetry.4. The nanoparticle of claim 1 , wherein the nanoparticle has an average diameter of between about 2 nm and about 10 nm.5. (canceled)6. A nanoparticle claim 1 , comprising:an intermetallic core comprising a first metal and a second metal, wherein the first metal is palladium and the second metal is at least one of cobalt, iron, nickel, or combination thereof, and the first metal and the second metal are ordered into different distinct sites of the intermetallic core; anda shell comprising palladium and gold.7. The nanoparticle of claim 6 , wherein at least parts of the intermetallic core comprises a trigonal symmetry.8. The nanoparticle of claim 6 , wherein at least parts of the intermetallic core comprises a rhombohedral symmetry.9. The nanoparticle of claim 6 , the nanoparticle has an average diameter of between about 2 nm and about 10 nm.10. (canceled)11. The nanoparticle of claim 6 , wherein the second metal is cobalt.12. The nanoparticle of claim 6 , wherein the shell is conformal with the intermetallic core.13. A method of producing a nanoparticle claim 6 , comprising:providing seed nanoparticles suspended in a liquid, wherein the seed nanoparticles comprises at least one of ...

Подробнее
04-02-2021 дата публикации

SPARK PLUG

Номер: US20210036492A1
Принадлежит: NGK SPARK PLUG CO., LTD.

In a spark plug, a base material contains 50 mass % or more of Ni, 8 mass % or more and 40 mass % or less of Cr, 0.01 mass % or more and 2 mass % or less of Si, 0.01 mass % or more and 2 mass % or less of Al, 0.01 mass % or more and 2 mass % or less of Mn, 0.01 mass % or more and 0.1 mass % or less of C, and 0.001 mass % or more and 5 mass % or less of Fe. A discharge member contains at least Pt of a P group (Pt, Rh, Ir, and Ru) and Ni. The atomic concentration K of the P group of the discharge member, the atomic concentration L of the P group of the base material, the atomic concentration M of Ni of the discharge member, and the atomic concentration N of Ni of the base material satisfy (K+L)/(M+N)≤1.14. 1. A spark plug comprising:a first electrode including a base material and a discharge member having at least a portion thereof bonded to the base material with a diffusion layer interposed therebetween; anda second electrode facing the discharge member with a spark gap interposed therebetween,wherein the base material contains 50 mass % or more of Ni, 8 mass % or more and 40 mass % or less of Cr, 0.01 mass % or more and 2 mass % or less of Si, 0.01 mass % or more and 2 mass % or less of Al, 0.01 mass % or more and 2 mass % or less of Mn, 0.01 mass % or more and 0.1 mass % or less of C, and 0.001 mass % or more and 5 mass % or less of Fe,wherein the discharge member is an alloy containing Pt most and containing Ni, or the alloy further containing at least one of Rh, Ir, and Ru, andwherein, when Pt, Rh, Ir, and Ru are considered as a P group,K (at %) represents an atomic concentration of the P group of the discharge member,L (at %) represents an atomic concentration of the P group of the base material,M (at %) represents an atomic concentration of Ni of the discharge member, andN (at %) represents an atomic concentration of Ni of the base material,(K+L)/(M+N)≤1.14 is satisfied.2. The spark plug according to claim 1 , wherein the base material and the discharge member ...

Подробнее
07-02-2019 дата публикации

A METHOD FOR PREPARING SILVER POWDER BY USING MICRO-NANO BUBBLES AS CRYSTAL SEEDS

Номер: US20190039142A1
Автор: Gong Qiang

A preparation method using micro-nano bubbles as crystal seeds to induce spherical or spherical-type silver power production, said method specifically comprising the steps of: pre-adding a prepared dispersing agent solution to a reaction vessel, within the reaction vessel, simultaneously adding a prepared oxidizing solution (an aqueous solution containing silver ions or a silver ammonia solution) and a reducing solution (an aqueous solution containing one or a plurality of hydroxylamine compounds, vitamin C, formaldehyde or hydrazine hydrate), performing a reduction reaction under vigorous stirring, and using the pre-generated micro-nano bubbles within the dispersing agent solution as crystal seeds, the micro-nano bubbles crystal seeds effectively controlling the particle size of reduced silver particles throughout the reduction reaction. The method effectively controls the particle size of the silver powder during production, and also controls the crystal nucleus growth rate and dispersibility. 1. A method for preparing silver powder by using micro-nano bubbles as crystal seeds , characterized in that it comprises the following steps:(1) preparation of an oxidant solution: a solid of metal nitrate or sulfate is dissolved in deionized water, or ammonia water is further added, to form a complex metal ammonia solution, with concentration of [metal ion] in the oxidant solution maintained at 0.1-10 mol/L, or one or more of polyvinylpyrrolidone (PVP), polyethylene glycol 400, Tween 40 and glycerol is/are further added, and the oxidant solution is kept at a constant temperature of 10° C. to 50° C. after being fully stirred;(2) preparation of a reductant solution: one or more hydroxylamine compound solids or vitamin C or formaldehyde or hydrazine hydrate reductant is added to deionized water to obtain a reductant solution, wherein concentration of [reducing agent] in the reductant solution is maintained at 0.1-10 mol/L, the volume of the reductant solution is 0.5-5 times ...

Подробнее
18-02-2021 дата публикации

GE-DOPED AUSN SOLDER ALLOYS

Номер: US20210047710A1
Принадлежит:

Implementations of the disclosure are directed to improving the ductility of a tin-enriched AuSn solder alloy by doping the solder alloy with Germanium (Ge). The final AuSnGe alloy may consist of 75 to 80 wt % Au, 20 to 25 wt % Sn, and 0.05 to 1.5 wt % Ge. 1. A solder alloy , consisting of:75 wt % to 80 wt % of Au;20 wt % to 25 wt % of Sn; and0.05 wt % to 1.5 wt % of Ge.2. The solder alloy of claim 1 , wherein the wt % ratio of Au to Sn is between 75:25 and 79:21.3. The solder alloy of claim 2 , wherein the solder alloy has 0.5 to 1.0 wt % of Ge.4. The solder alloy of claim 2 , wherein the wt % ratio of Au to Sn is 75:25.5. The solder alloy of claim 4 , wherein the solder alloy is 78Au22Sn doped with about 0.75 wt % of Ge.6. The solder alloy of claim 2 , wherein the wt % ratio of Au to Sn is 78:22.7. The solder alloy of claim 1 , wherein the solder alloy is a solder ribbon.8. The solder alloy of claim 1 , wherein the solder alloy is a solder foil.9. The solder alloy of claim 1 , wherein the solder alloy is a solder wire.10. The solder alloy of claim 1 , wherein the solder alloy is a solder preform.11. A method claim 1 , comprising:placing a solder preform on a surface of a substrate to form an assembly; and 75 wt % to 80 wt % of Au;', '20 wt % to 25 wt % of Sn; and', '0.05 wt % to 1.5 wt % of Ge., 'reflow soldering the assembly to form a solder joint from the solder preform, wherein the solder preform consists of12. The method of claim 11 , further comprising: prior to placing the solder preform claim 11 , punching the solder preform from a solder ribbon.13. The method of claim 12 , wherein the surface of the substrate is Au or Au-coated.14. The method of claim 11 , wherein the surface of the substrate is Au or Au-coated.15. The solder alloy of claim 14 , wherein the wt % ratio of Au to Sn is between 75:25 and 79:21.16. The solder alloy of claim 15 , wherein the wt % ratio of Au to Sn is 75:25.17. The solder alloy of claim 15 , wherein the solder alloy is 78Au22Sn ...

Подробнее
18-02-2021 дата публикации

ALLOY FOR MEDICAL USE, AND METHOD FOR PRODUCING SAME

Номер: US20210047717A1
Принадлежит:

The present invention provides an alloy for medical use including an Au—Pt alloy, in which the Au—Pt alloy has a Pt concentration of 24 mass % or more and less than 34 mass % with the balance being Au, and has at least a material structure in which a Pt-rich phase having a Pt concentration higher than that of an α-phase is distributed in an α-phase matrix, the Pt-rich phase has a Pt concentration that is 1.2 to 3.8 times the Pt concentration of the α-phase, and the Pt-rich phase has an area ratio of 1 to 22% in any cross-section. This alloy is an artifact-free alloy material that exhibits excellent compatibility with a magnetic field environment such as an MRI and has magnetic susceptibility of ±4 ppm with respect to magnetic susceptibility of water. 1. An alloy for medical use comprising an Au—Pt alloy , whereinthe Au—Pt alloy has a Pt concentration of 24 mass % or more and less than 34 mass % with a balance being Au, and has at least a material structure in which a Pt-rich phase having a Pt concentration higher than that of an α-phase is distributed in an α-phase matrix,the Pt-rich phase has a Pt concentration that is 1.2 to 3.8 times the Pt concentration of the α-phase, andthe Pt-rich phase has an area ratio of 1 to 22% in any cross-section.2. The alloy for medical use according to claim 1 , whereinthe Pt concentration is 28 mass % or more and less than 34 mass %,{'sub': '2', 'the Pt-rich phase is distributed as an α-phase, and'}the Pt-rich phase has an area ratio of 5 to 15% in any cross-section.3. The alloy for medical use according to claim 1 , whereinthe Pt concentration is 24 mass % or more and less than 28 mass %,the Au—Pt alloy having the Pt concentration of 86 to 90 wt % is distributed as the Pt-rich phase, andthe Pt-rich phase has an area ratio of 10 to 22% in any cross-section.4. The alloy for medical use according to claim 1 , whereinthe Pt concentration is 28 mass % or more and less than 34 mass %,the Au—Pt alloy having the Pt concentration of 86 to ...

Подробнее
19-02-2015 дата публикации

METHOD OF MANUFACTURING SILVER NANOWIRES

Номер: US20150047468A1
Принадлежит:

A method of manufacturing silver nanowires includes: forming a first solution including a dispersion stabilizer and a polyol; forming a second solution including a dispersion stabilizer, a silver precursor, a halogen-ion donor, deionized water, and the polyol; forming a third solution by adding the second solution to the first solution; heating the third solution from a first temperature to a second temperature; and forming silver nanowires by maintaining the third solution at the second temperature. 1. A method of manufacturing silver nanowires , the method comprising:forming a first solution comprising a dispersion stabilizer and a first polyol;forming a second solution comprising a dispersion stabilizer, a silver precursor, a halogen-ion donor, deionized water, and a second polyol;forming a third solution by mixing the second solution and the first solution;heating the third solution to increase the temperature of the third solution from a first temperature to a second temperature; andforming silver nanowires by maintaining the third solution at the second temperature.2. The method of claim 1 , wherein the first temperature is about 50° C. to about 60° C. claim 1 , and the second temperature is about 145° C. to about 170° C.3. The method of claim 1 , further comprising filtering the formed silver nanowires from the third solution.4. The method of claim 3 , wherein the filtering comprises using a filter having a pore size of about 10 μm to about 40 μm.5. The method of claim 1 , wherein the forming of the first solution comprises:dissolving the dispersion stabilizer in the first polyol by stirring, while the first solution is heated at a temperature of about 90° C. to about 110° C.; andcooling the first solution to a temperature of about 50° C. to about 60° C.6. The method of claim 1 , wherein the temperature of the third solution is increased from the first temperature to the second temperature over a time period of about 10 minutes to about 40 minutes.7. The ...

Подробнее
24-02-2022 дата публикации

TIN-BASED CATALYSTS, THE PREPARATION THEREOF, AND FUEL CELLS USING THE SAME

Номер: US20220059850A1
Принадлежит:

A composition comprised of a tin (Sn) or lead (Pb) film, wherein the film is coated by a shell, wherein the shell: (a) is comprised of an active metal, and (b) is characterized by a thickness of less than 50 nm, is discloses herein. Further disclosed herein is the use of the composition for the oxidation of e.g., methanol, ethanol, formic acid, formaldehyde, dimethyl ether, methyl formate, and glucose. 1. A composition comprising:metal nanoparticles (NP) coated by a shell, wherein:said metal NPs comprise a metal selected from the group consisting of: tin (Sn), lead (Pb), antimony (Sb) or a combination thereof;said shell: (a) comprises a noble metal, and (b) is characterized by a thickness of less than 50 nm; andsaid metal is in an elemental state within said composition.2. The composition of claim 1 , wherein said element is Sn.3. The composition of claim 1 , wherein said thickness is in the range of 2 nm to 10 nm.4. The composition of claim 1 , wherein said noble metal is selected from the group consisting of: platinum (Pt) claim 1 , palladium (Pd) claim 1 , ruthenium (Ru) claim 1 , gold (Au) claim 1 , silver (Ag) claim 1 , rhodium (Rh) claim 1 , iridium (Ir) claim 1 , or an alloy or a combination thereof.5. The composition of claim 1 , wherein said shell further comprises a metal selected from the group consisting of Sn claim 1 , Pb claim 1 , Sb claim 1 , Mo claim 1 , Co claim 1 , Fe claim 1 , Mn claim 1 , Os claim 1 , Ni claim 1 , Ti claim 1 , W claim 1 , indium-tin-oxide and selenium (Se) claim 1 , including any oxide or a combination thereof.6. The composition of claim 1 , wherein herein a median size of said metal nanoparticles is from 1 to 50 nanometers.7. The composition of claim 4 , wherein said Pt claim 4 , and Pd are in a molar ratio of from 3:1 to 1:3 claim 4 , respectively.8. The composition of claim 1 , wherein said composition is in a form of an electrocatalyst configured for oxidation of a fuel.9. The composition of claim 8 , wherein said fuel is ...

Подробнее
15-02-2018 дата публикации

BINARY AG-CU AMORPHOUS THIN-FILMS FOR ELECTRONIC APPLICATIONS

Номер: US20180044782A1
Принадлежит:

An interconnect and a method of making an interconnect between one or more features on a substrate comprises: sputtering a noble metal-copper eutectic thin film under controlled power on an oxide grown or deposited on a substrate; and forming an amorphous alloy structure from the noble metal-copper eutectic thin film in the shape of the interconnect and the interconnect comprising no grain or grain boundaries without temperature sensitive resistivity. 1. A method of making an interconnect between one or more features on a substrate comprising:growing or depositing a thermal oxide on the substrate;sputtering a noble metal-copper metallic glass thin film under controlled power on the thermal oxide; andforming the noble metal-copper metallic glass thin film into the interconnect.2. The method of claim 1 , wherein the noble metal is selected from at least one of ruthenium claim 1 , rhodium claim 1 , palladium claim 1 , silver claim 1 , osmium claim 1 , iridium claim 1 , platinum claim 1 , or gold.3. The method of claim 1 , further comprising using a temperature gradient assist during the sputtering.4. The method of claim 1 , wherein the noble metal-copper metallic glass thin film is a eutectic that comprises between 20 claim 1 , 30 claim 1 , 40 claim 1 , 50 claim 1 , 60 claim 1 , and 70 at % noble metal and the remainder Cu.5. The method of claim 1 , wherein the noble metal-copper metallic glass thin film is a eutectic that comprises between 20 claim 1 , 30 claim 1 , 40 claim 1 , 50 claim 1 , 60 claim 1 , and 70 at % Cu and the remainder the noble metal.6. The method of claim 1 , further comprising using a deposition rate of 0.5 claim 1 , 0.6 claim 1 , 0.7 claim 1 , 0.8 claim 1 , 0.9 claim 1 , 1.0 claim 1 , 1.1 claim 1 , 1.2 claim 1 , 1.3 claim 1 , 1.4 claim 1 , 1.5 claim 1 , 1.6 claim 1 , 1.7 claim 1 , 1.8 claim 1 , 1.9 claim 1 , or 2.0 Å/s during the sputtering.7. The method of claim 1 , wherein the controlled power is defined further as a low power sputtering at ...

Подробнее
07-02-2019 дата публикации

CONDUCTIVE PASTE

Номер: US20190043637A1
Автор: YOSHII Yoshiaki
Принадлежит: NAMICS CORPORATION

A conductive paste of the present invention includes (A) a silver powder, (B) a glass frit, (C) an organic binder and (E) an oxide of a platinum group element and/or a compound which can be converted to an oxide of a platinum group element. The conductive paste has excellent solder heat resistance and adhesion to a substrate. 1. A conductive paste comprising:(A) a silver powder;(B) a glass frit;(C) an organic binder; and(E) a powder containing an oxide of a platinum group element and/or a compound which can be converted to an oxide of a platinum group element.2. The conductive paste according to claim 1 , wherein the platinum group element is at least one element selected from the group consisting of ruthenium claim 1 , platinum claim 1 , palladium claim 1 , and iridium.3. The conductive paste according to claim 1 , wherein the platinum group element is ruthenium.4. The conductive paste according to claim 1 , wherein the content of the powder (E) is 0.5 to 3.0 parts by mass based on 100 parts by mass of the silver powder (A).5. The conductive paste according to claim 1 , wherein the glass frit (B) is a glass frit containing bismuth (III) oxide.6. The conductive paste according to claim 1 , further comprising (D) a powder containing copper and/or manganese.7. The conductive paste according to claim 6 , wherein the powder (D) is a mixed powder of metals containing copper and/or manganese.8. The conductive paste according to claim 6 , wherein the powder (D) is an alloy powder containing copper and/or manganese.9. The conductive paste according to claim 6 , wherein the powder (D) is a compound powder containing copper and/or manganese.10. The conductive paste according to claim 6 , wherein the powder (D) contains an oxide or a hydroxide of copper and/or manganese.11. The conductive paste according to claim 6 , wherein the powder (D) is a mixed powder of metals including copper claim 6 , tin claim 6 , and manganese.12. The conductive paste according to claim 6 , wherein ...

Подробнее
08-05-2014 дата публикации

Brazing material, brazing material paste, ceramic circuit substrate, ceramic master circuit substrate, and power semiconductor module

Номер: US20140126155A1
Принадлежит: Hitachi Metals Ltd

To provide a brazing material for maintaining bonding strength between ceramic substrate and metal plate at a conventionally attainable level, while addition amount of In is reduced, and a brazing material paste using the same. A mixture powder provided by mixing alloy powder composed of Ag, In, and Cu, Ag powder, and active metal hydride powder, the mixture powder containing active metal hydride powder with a 10-to-25-μm equivalent circle average particle diameter by 0.5 to 5.0 mass %, the equivalent circle average particle diameters for the alloy powder, Ag powder, and active metal hydride powder having a relationship: alloy powder≧active metal hydride powder>Ag powder, and the powder mixture having a particle size distribution of d10 of 3 to 10 μm, d50 of 10 to 35 μm, and d90 of 30 to 50 μm, and in the frequency distribution, a peak of the distribution existing between d50 and d90.

Подробнее
03-03-2022 дата публикации

PALLADIUM-COPPER-SILVER-RUTHENIUM ALLOY

Номер: US20220064761A1
Принадлежит:

The invention relates to a palladium-copper-silver alloy with palladium as the main component, wherein the palladium-copper-silver alloy has a weight ratio of palladium to copper of at least 1.05 and at most 1.6 and has a weight ratio of palladium to silver of at least 3 and at most 6, and wherein the palladium-copper-silver alloy contains more than 1 wt % and up to a maximum of 6 wt % of ruthenium, rhodium or ruthenium and rhodium and contains, as the remainder, palladium, copper and silver and at most 1 wt % of other metallic elements including impurities. The invention also relates to a wire, a strip or a probe needle made of such a palladium-copper-silver alloy and to the use of such a palladium-copper-silver alloy for testing electrical contacts or for making electrical contact or for producing a sliding contact. 1. A palladium-copper-silver alloy with palladium as the main component , wherein the palladium-copper-silver alloy has a weight ratio of palladium to copper of at least 1.05 and at most 1.6 and has a weight ratio of palladium to silver of at least 3 and at most 6 , and wherein the palladium-copper-silver alloy contains more than 1 wt % and up to a maximum of 6 wt % of ruthenium , rhodium or a mixture of ruthenium and rhodium and , as the remainder , palladium , copper and silver and at most 1 wt % of other metallic elements including impurities.2. The palladium-copper-silver alloy of claim 1 , whereinthe impurities in total have a proportion of at most 0.9 wt % in the palladium-copper-silver alloy.3. The palladium-copper-silver alloy of claim 1 , wherein the palladium-copper-silver alloy contains up to 1 wt % of rhenium and/or less than 0.1 wt % of rhodium.4. The palladium-copper-silver alloy of claim 1 , whereinthe palladium-copper-silver alloy contains at least 45 wt % and at most 55 wt % of palladium, at least 30 wt % and at most 45 wt % of copper at least 8 wt % and at most 15 wt % of silver.5. The palladium-copper-silver alloy of claim 1 , ...

Подробнее