Настройки

Укажите год
-

Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

Подробнее
-

Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

Подробнее

Форма поиска

Поддерживает ввод нескольких поисковых фраз (по одной на строку). При поиске обеспечивает поддержку морфологии русского и английского языка
Ведите корректный номера.
Ведите корректный номера.
Ведите корректный номера.
Ведите корректный номера.
Укажите год
Укажите год
Применить Всего найдено 20. Отображено 20.
22-08-2013 дата публикации

STARTING MATERIAL AND PROCESS FOR PRODUCING A SINTERED JOIN

Номер: US20130216848A1
Автор: Thomas Kalich, Daniel Wolde-Giorgis, Andrea Feiock, Robert Kolb
Принадлежит: ROBERT BOSCH GMBH

The present invention relates to a starting material for producing a sintered join. In order to avoid the formation of cracks in the case of fluctuating thermal loading, the starting material comprises second particles in addition to metallic first particles which at least proportionately contain elemental silicon and/or silicon dioxide. In addition, the present invention relates to the use of elemental silicon and/or silicon dioxide for reducing the coefficient of thermal linear expansion α of a starting material of a sintered join or of a sintered join in particular in a sintered paste, a sintered powder or a sintered material preform. Furthermore, the present invention relates to sintered joins to electronic circuits and also to processes for forming a thermally and/or electrically conductive sintered join. 2. The starting material as claimed in claim 1 , wherein the elemental silicon and/or silicon dioxide is amorphous elemental silicon and/or amorphous silicon dioxide.320. The starting material as claimed in claim 1 , wherein the second particles () are spherical.42021. The starting material as claimed in claim 1 , wherein the second particles () have a particle core () composed of elemental silicon and/or silicon dioxide.520212222. The starting material as claimed in claim 1 , wherein the second particles () have a particle core () with a second coating () applied thereto claim 1 , where the second coating () comprises at least one metal selected from the group consisting of silver claim 1 , platinum claim 1 , palladium claim 1 , gold claim 1 , tin and combinations thereof.610. The starting material as claimed in claim 1 , wherein the first particles () are noble metal-containing and/or copper-containing.7101112. The starting material as claimed in claim 1 , wherein the first particles () have a particle core () with a first coating () applied thereto.8303010. The starting material as claimed in claim 1 , wherein the starting material further comprises third ...

Подробнее
Номер записи: 1
21-08-2014 дата публикации

LAYERED COMPOSITE OF A SUBSTRATE FILM AND OF A LAYER ASSEMBLY COMPRISING A SINTERABLE LAYER MADE OF AT LEAST ONE METAL POWDER AND A SOLDER LAYER

Номер: US20140234649A1
Автор: Thomas Kalich, Frank Wetzl, Bernd Hohenberger, Rainer Holz, Christiane Frueh, Andreas Fix, Michael Guyenot, Andrea Feiock, Martin Rittner, Michael Guenther, KALICH THOMAS, WETZL FRANK, HOHENBERGER BERND, HOLZ RAINER, FRUEH CHRISTIANE, FIX ANDREAS, GUYENOT MICHAEL, FEIOCK ANDREA, RITTNER MARTIN, GUENTHER MICHAEL
Принадлежит:

The invention relates to a layered composite (), in particular for connecting electronic components as joining partners, comprising at least one substrate film () and a layer assembly () applied to the substrate film. The layer assembly comprises at least one sinterable layer (), which is applied to the substrate film () and which contains at least one metal powder, and a solder layer () applied to the sinterable layer (). The invention further relates to a method for forming a layered composite, to a circuit assembly containing a layered composite () according to the invention, and to the use of a layered composite () in a joining method for electronic components. 110111213111413. A layer composite () , which comprises at least one support film () and a layer arrangement applied thereto comprising at least one sinterable layer () which has been applied to the support film () and contains at least one metal powder and a solder layer () applied to the sinterable layer ().214. The layer composite as claimed in claim 1 , characterized in that the material of the solder layer () is selected from the group consisting of SnCu claim 1 , SnAg claim 1 , SnAu claim 1 , SnBi claim 1 , SnNi claim 1 , SnZn claim 1 , SnIn claim 1 , SnIn claim 1 , CuNi claim 1 , CuAg claim 1 , AgBi claim 1 , ZnAl claim 1 , BiIn claim 1 , InAg claim 1 , InGa and ternary or quaternary alloys of a mixture thereof.314. The layer composite as claimed in claim 1 , characterized in that the solder layer () is formed by a reactive solder consisting of a mixture of a base solder with an AgX claim 1 , CuX or NiX alloy claim 1 , where the component X of the AgX claim 1 , CuX or NiX alloy is selected from the group consisting of B claim 1 , Mg claim 1 , Al claim 1 , Si claim 1 , Ca claim 1 , Se claim 1 , Ti claim 1 , V claim 1 , Cr claim 1 , Mn claim 1 , Fe claim 1 , Co claim 1 , Ni claim 1 , Cu claim 1 , Zn claim 1 , Ga claim 1 , Ge claim 1 , Y claim 1 , Zr claim 1 , Nb claim 1 , Mo claim 1 , Ag claim 1 , In ...

Подробнее
Номер записи: 2
26-09-2013 дата публикации

STARTING MATERIAL AND PROCESS FOR PRODUCING A SINTERED JOIN

Номер: US20130251447A1
Автор: Thomas Kalich, Daniel Wolde-Giorgis, Andrea Feiock, Robert Kolb
Принадлежит: ROBERT BOSCH GMBH

The present invention relates to a starting material for producing a sintered connection. In order to avoid the formation of cracks in the joining partners in the case of fluctuating thermal loading, the starting material comprises second particles in addition to metallic first particles , wherein the second particles at least proportionately contain a particle core material which has a coefficient of thermal linear expansion α at 20° C. which is less than the coefficient of thermal linear expansion α at 20° C. of the metal or of the metals of the first particles in metallic form, and wherein the Dvalue of the second particles is greater than or equal to half the Dvalue of the first particles and less than or equal to two times the Dvalue of the first particles . In addition, the present invention relates to a corresponding sintered connection ′, to an electronic circuit and also to a process for forming a thermally and/or electrically conductive sintered connection. 1100100. A starting material () for a sintered bond (′) , which comprises{'b': '10', 'metal-containing first particles () and'}{'b': '20', 'second particles (),'}{'b': 20', '21', '10, 'characterized in that the second particles () contain at least a proportion of a particle core material () whose coefficient of thermal expansion α at 20° C. is smaller than the coefficient of thermal expansion α at 20° C. of the metal or metals of the first particles () in metallic form,'}and{'sub': 50', '50', '50, 'b': 20', '10', '10, 'the Dof the second particles () is greater than or equal to half the Dof the first particles () and less than or equal to twice the Dof the first particles ().'}221. The starting material as claimed in claim 1 , wherein the coefficient of thermal expansion α of the particle core material () at 20° C. is ≦10·10K.32010. The starting material as claimed in claim 1 , wherein the Dof the second particles () is greater than or equal to half the Dof the first particles and less than or equal to ...

Подробнее
Номер записи: 3
25-04-2017 дата публикации

Laminated composite made up of an electronic substrate and a layer arrangement comprising a reaction solder

Номер: US0009630379B2
Автор: Thomas Kalich, Christiane Frueh, Franz Wetzl, Bernd Hohenberger, Rainer Holz, Andreas Fix, Michael Guyenot, Andrea Feiock, Michael Guenther, Martin Rittner, KALICH THOMAS, FRUEH CHRISTIANE, WETZL FRANZ, HOHENBERGER BERND, HOLZ RAINER, FIX ANDREAS, GUYENOT MICHAEL, FEIOCK ANDREA, GUENTHER MICHAEL, RITTNER MARTIN, Kalich Thomas, Frueh Christiane, Wetzl Franz, Hohenberger Bernd, Holz Rainer, Fix Andreas, Guyenot Michael, Feiock Andrea, Guenther Michael, Rittner Martin
Принадлежит: Robert Bosch GmbH, BOSCH GMBH ROBERT

Laminated composite ( 10 ) comprising at least one electronic substrate ( 11 ) and an arrangement of layers ( 20, 30 ) made up of at least a first layer ( 20 ) of a first metal and/or a first metal alloy and of a second layer ( 30 ) of a second metal and/or a second metal alloy adjacent to this first layer ( 20 ), wherein the melting temperatures of the first and second layers are different, and wherein, after a thermal treatment of the arrangement of layers ( 20, 30 ), a region with at least one intermetallic phase ( 40 ) is formed between the first layer and the second layer, wherein the first layer ( 20 ) or the second layer ( 30 ) is formed by a reaction solder which consists of a mixture of a basic solder with an AgX, CuX or NiX alloy, wherein the component X of the AgX, CuX or NiX alloy is selected from the group consisting of B, Mg, Al, Si, Ca, Se, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ga, Ge, Y, Zr, Nb, Mo, Ag, In, Sn, Sb, Ba, Hf, Ta, W, Au, Bi, La, Ce, Pr, Nd, Gd, Dy, Sm, Er, Tb, Eu, Ho, Tm, Yb and Lu and wherein the melting temperature of the AgX, CuX or NiX alloy is greater than the melting temperature of the basic solder. The invention also relates to a method for forming a laminated composite ( 10 ) and to a circuit arrangement containing a laminated composite ( 10 ) according to the invention.

Подробнее
Номер записи: 4
07-11-2013 дата публикации

STARTING MATERIAL FOR A SINTERED BOND AND PROCESS FOR PRODUCING THE SINTERED BOND

Номер: US20130292168A1
Автор: Daniel Wolde-Giorgis, Andrea Feiock
Принадлежит: ROBERT BOSCH GMBH

The invention relates to a starter material for a sintering compound, said starter material comprising particles which at least proportionally contain an organic metal compound and/or a precious metal oxide, the organic metal compound and/or the precious metal oxide being converted during heat treatment of the starter material into the elemental metal and/or precious metal. The invention is characterized in that the particles have a coating containing a reducing agent by means of which the organic metal compound and/or precious metal oxide is reduced to the elemental metal and/or precious metal at a temperature below the sintering temperature of the elemental metal and/or precious metal.

Подробнее
Номер записи: 5
22-08-2013 дата публикации

STARTING MATERIAL FOR A SINTERED BOND AND PROCESS FOR PRODUCING THE SINTERED BOND

Номер: US20130216847A1
Автор: Daniel Wolde-Giorgis, Andrea Feiock
Принадлежит: ROBERT BOSCH GMBH

The invention relates to a starter material for a sintering compound, said starter material comprising first particles of at least one metal having a first coating which is applied to the first particles and consists of an organic material, and second particles which contain an organic metal compound and/or a precious metal oxide, the organic metal compound and/or the precious metal oxide being converted during heat treatment of the starter material into the fundamental elemental metal and/or precious metal. The invention is characterized in that the second particles have a core of at least one metal and a second coating which is applied to the core and contains the organic metal compound and/or precious metal oxide. Furthermore, the first coating contains a reducing agent by means of which the organic metal compound and/or the precious metal oxide is/are reduced to the elemental metal and/or precious metal at a temperature below the sintering temperature of the elemental metal and/or precious metal.

Подробнее
Номер записи: 6
05-05-2016 дата публикации

SILVER-COMPOSITE SINTERING PASTES FOR LOW-TEMPERATURE SINTERING-BONDING

Номер: US20160121431A1
Автор: Feiock Andrea, Hohenberger Bernd, ORSO Steffen
Принадлежит:

The present invention relates to a liquid-phase sintering composition containing low-molecular organic auxiliary agents, at least one silver salt, silver particles and one further metal solid material, characterized in that the further solid material is particulate and comprises tin. 1. A liquid-phase sintering composition containing low molecular weight organic auxiliaries , at least one silver salt , silver particles and a further solid metal material , characterized in that the further solid material is present in particle form and comprises tin.2. The liquid-phase sintering composition as claimed in claim 1 , wherein the particulate solid material comprising tin is present in spherical claim 1 , spattered or plate shape.3. The liquid-phase sintering composition as claimed in claim 1 , wherein the proportion of the particulate solid material comprising tin in the sintering composition is greater than or equal to 0.1 vol % and less than or equal to 50 vol %.4. The liquid-phase sintering composition as claimed in claim 1 , wherein the maximum dimension of the particulate solid material comprising tin is greater than or equal to 0.1 μm and less than or equal to 1000 μm.5. The liquid-phase sintering composition as claimed in claim 1 , wherein the proportionof the organic auxiliaries is greater than or equal to 0.1 wt % and less than or equal to 10 wt %,of the silver salts is greater than or equal to 5 wt % and less than or equal to 20 wt %,of the silver particles is greater than or equal to 40 wt % and less than or equal to 94 wt %, andof the particulate solid material comprising tin is greater than or equal to 0.1 wt % and less than or equal to 50 wt %,and the sum of the individual proportions corresponds to 100 wt %.6. The liquid-phase sintering composition as claimed in claim 1 , wherein the composition contains further metal or nonmetal particles.7. The liquid-phase sintering composition as claimed in claim 1 , wherein the particulate solid material comprising ...

Подробнее
Номер записи: 7
04-09-2014 дата публикации

LAMINATED COMPOSITE MADE UP OF AN ELECTRONIC SUBSTRATE AND A LAYER ARRANGEMENT COMPRISING A REACTION SOLDER

Номер: US20140248505A1
Автор: Feiock Andrea, Fix Andreas, Frueh Christiane, Guenther Michael, Guyenot Michael, Hohenberger Bernd, HOLZ RAINER, KALICH Thomas, Rittner Martin, Wetzl Franz
Принадлежит:

Laminated composite () comprising at least one electronic substrate () and an arrangement of layers () made up of at least a first layer () of a first metal and/or a first metal alloy and of a second layer () of a second metal and/or a second metal alloy adjacent to this first layer (), wherein the melting temperatures of the first and second layers are different, and wherein, after a thermal treatment of the arrangement of layers (), a region with at least one intermetallic phase () is formed between the first layer and the second layer, wherein the first layer () or the second layer () is formed by a reaction solder which consists of a mixture of a basic solder with an AgX, CuX or NiX alloy, wherein the component X of the AgX, CuX or NiX alloy is selected from the group consisting of B, Mg, Al, Si, Ca, Se, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ga, Ge, Y, Zr, Nb, Mo, Ag, In, Sn, Sb, Ba, Hf, Ta, W, Au, Bi, La, Ce, Pr, Nd, Gd, Dy, Sm, Er, Tb, Eu, Ho, Tm, Yb and Lu and wherein the melting temperature of the AgX, CuX or NiX alloy is greater than the melting temperature of the basic solder. The invention also relates to a method for forming a laminated composite () and to a circuit arrangement containing a laminated composite () according to the invention. 110112030203040. A laminated composite () comprising at least one electronic substrate () and a layer arrangement ( , ) including at least a first layer of at least one of a first metal and a first metal alloy and including a second layer , adjoining said first layer , of at least one of a second metal and a second metal alloy , wherein melting temperatures of the first layer and of the second layer are different , wherein , after the layer arrangement ( , ) has been subjected to a thermal treatment , a region with at least one intermetallic phase () is formed between the first layer and the second layer , wherein one of the first layer and the second layer is formed by a reaction solder which consists of a mixture of a ...

Подробнее
Номер записи: 8
29-10-2015 дата публикации

METHOD FOR CONNECTING AT LEAST TWO COMPONENTS USING A SINTERING PROCESS

Номер: US20150306669A1
Автор: Feiock Andrea, Guenther Michael
Принадлежит: ROBERT BOSCH GMBH

The invention relates to a method for connecting at least two components () using a sintering process. The aim of the invention is to improve the sintering process. This is achieved in that the method has the following method steps: a) providing a starting material () of a sintering compound (), comprising particles () which can be sintered and have at least one metal or at least one metal compound and comprising at least one polymeric, polymerizable, and/or monomeric organic compound (), wherein the polymeric, polymerizable, and/or monomeric compound () has a flow temperature which is higher than or equal to the room temperature and lower than the sintering temperature, and the polymeric, polymerizable, and/or monomeric organic compound () further has a desorption temperature which is higher than the flow temperature and lower than or equal to the sintering temperature; b) arranging the starting material () between two components () to be connected; c) heating the starting material () to a temperature (T) which is higher than or equal to the flow temperature of the polymeric, polymerizable, and/or monomeric organic compound () and lower than the desorption temperature of the polymeric, polymerizable, and/or monomeric organic compound () for a period of time (t); and d) heating the starting material () to a temperature (T) which is higher than or equal to the sintering temperature of the particles () which can be sintered, optionally under the influence of a sintering pressure, for a period of time (t), thereby forming a sintering compound (). 11820. A method for connecting at least two components ( , ) using a sintering process , comprising:{'b': 10', '22', '12', '14', '14', '14, 'a) providing a starting material () of a sintered connection (), comprising sinterable particles (), comprising at least one metal or at least one metal compound, and at least one polymeric, polymerizable and/or monomeric organic compound (), wherein the polymeric, polymerizable and/or ...

Подробнее
Номер записи: 9
19-08-2020 дата публикации

Sintered compound starting material and method for producing the sintered compound

Номер: EP3695921A1
Автор: Andrea Feiock, Daniel Wolde-Giorgis
Принадлежит: ROBERT BOSCH GMBH

Der erfindungsgemäße Ausgangswerkstoff einer Sinterverbindung umfasst Partikel, die zumindest anteilig eine organische Metallverbindung und/oder ein Edelmetalloxid enthalten, wobei die organische Metallverbindung und/oder das Edelmetalloxid bei einer Temperaturbehandlung des Ausgangswerkstoffes in das elementare Metall und/oder Edelmetall umgewandelt wird. Kennzeichnend für die Erfindung ist, dass die Partikel eine Beschichtung enthaltend ein Reduktionsmittel aufweisen, mittels welchem die Reduktion der organischen Metallverbindung und/oder des Edelmetalloxids zu dem elementaren Metall und/oder Edelmetall bei einer Temperatur unterhalb der Sintertemperatur des elementaren Metalls und/oder Edelmetalls erfolgt. The starting material of a sintered compound according to the invention comprises particles which at least partially contain an organic metal compound and / or a noble metal oxide, the organic metal compound and / or the noble metal oxide being converted into the elemental metal and / or noble metal during a temperature treatment of the starting material. It is characteristic of the invention that the particles have a coating containing a reducing agent, by means of which the reduction of the organic metal compound and / or the noble metal oxide to the elemental metal and / or noble metal takes place at a temperature below the sintering temperature of the elemental metal and / or noble metal .

Подробнее
Номер записи: 10
29-08-2013 дата публикации

Layered composite of a substrate film and of a layer assembly comprising a sinterable layer made of at least one metal powder and a solder layer

Номер: WO2013045364A3
Автор: Andrea Feiock, Andreas Fix, Bernd Hohenberger, Christiane Frueh, Franz Wetzl, Martin Rittner, MICHAEL Guenther, Michael Guyenot, Rainer Holz, Thomas Kalich
Принадлежит: ROBERT BOSCH GMBH

The invention relates to a layered composite (10), in particular for connecting electronic components as joining partners, comprising at least one substrate film (11) and a layer assembly (12) applied to the substrate film. The layer assembly comprises at least one sinterable layer (13), which is applied to the substrate film (11) and which contains at least one metal powder, and a solder layer (14) applied to the sinterable layer (13). The invention further relates to a method for forming a layered composite, to a circuit assembly containing a layered composite (10) according to the invention, and to the use of a layered composite (10) in a joining method for electronic components.

Подробнее
Номер записи: 11
16-03-2016 дата публикации

Silver-composite sintering pastes for low-temperature sintering-bonding

Номер: EP2994265A1
Автор: Andrea Feiock, Bernd Hohenberger, Steffen ORSO
Принадлежит: ROBERT BOSCH GMBH

Die vorliegende Erfindung betrifft eine flüssigphasen Sinterzusammensetzung enthaltend niedermolekulare organische Hilfsstoffe, mindestens ein Silbersalz, Silberpartikel und ein weiteres metallisches Vollmaterial, dadurch gekennzeichnet, dass das weitere Vollmaterial partikulär vorliegt und Zinn umfasst.

Подробнее
Номер записи: 12
26-04-2012 дата публикации

Starting material of a sintered compound and method for producing the sintered compound

Номер: DE102010042702A1
Автор: Andrea Feiock, Daniel Wolde-Giorgis
Принадлежит: ROBERT BOSCH GMBH

Der erfindungsgemäße Ausgangswerkstoff einer Sinterverbindung umfasst Partikel, die zumindest anteilig eine organische Metallverbindung und/oder ein Edelmetalloxid enthalten, wobei die organische Metallverbindung und/oder das Edelmetalloxid bei einer Temperaturbehandlung des Ausgangswerkstoffes in das elementare Metall und/oder Edelmetall umgewandelt wird. Kennzeichnend für die Erfindung ist, dass die Partikel eine Beschichtung enthaltend ein Reduktionsmittel aufweisen, mittels welchem die Reduktion der organischen Metallverbindung und/oder des Edelmetalloxids zu dem elementaren Metall und/oder Edelmetall bei einer Temperatur unterhalb der Sintertemperatur des elementaren Metalls und/oder Edelmetalls erfolgt. The starting material of a sintered compound according to the invention comprises particles which at least partially contain an organic metal compound and / or a noble metal oxide, the organic metal compound and / or the noble metal oxide being converted into the elemental metal and / or noble metal during a temperature treatment of the starting material. It is characteristic of the invention that the particles have a coating containing a reducing agent, by means of which the reduction of the organic metal compound and / or the noble metal oxide to the elemental metal and / or noble metal takes place at a temperature below the sintering temperature of the elemental metal and / or noble metal ,

Подробнее
Номер записи: 13
31-01-2013 дата публикации

Layer composite composed of a layer arrangement and an electrical or electronic component

Номер: WO2013013956A2
Автор: Andrea Feiock, Daniel Wolde-Giorgis, Manfred Boehm, Thomas Kalich
Принадлежит: ROBERT BOSCH GMBH

The invention relates to a layer composite, wherein the layer composite comprises at least one electrical or electronic component and a layer arrangement composed of a plurality of layers. The layer arrangement is formed from at least one first layer containing at least one organic metal compound and/or a noble metal oxide, wherein the organic metal compound and/or the noble metal oxide are/is converted into the underlying elemental metal and/or noble metal during a thermal treatment of the layer composite or of the layer arrangement. Furthermore, the layer arrangement comprises at least one second layer adjoining the first layer. The invention is characterized by the fact that the at least second layer contains a reducing agent, by means of which the organic metal compound and/or the noble metal oxide are/is reduced to the elemental metal and/or noble metal at a temperature below the sintering temperature of the elemental metal and/or noble metal. Overall, a sintering connection is formed after the conclusion of the thermal treatment within the layer composite.

Подробнее
Номер записи: 14
26-04-2012 дата публикации

Starting material and process for producing a sintered join

Номер: WO2012052192A1
Автор: Andrea Feiock, Daniel Wolde-Giorgis, Robert Kolb, Thomas Kalich
Принадлежит: ROBERT BOSCH GMBH

The present invention relates to a starting material for producing a sintered join. In order to avoid the formation of cracks in the case of fluctuating thermal loading, the starting material comprises second particles 20, in addition to metallic first particles 10, which at least proportionately contain elemental silicon and/or silicon dioxide. In addition, the present invention relates to the use of elemental silicon and/or silicon dioxide for reducing the coefficient of thermal linear expansion α of a starting material 100 of a sintered join 100' or of a sintered join 100', in particular in a sintered paste, a sintered powder or a sintered material preform. Furthermore, the present invention relates to sintered joins 100', to electronic circuits 70 and also to processes for forming a thermally and/or electrically conductive sintered join.

Подробнее
Номер записи: 15
04-04-2013 дата публикации

Layer composite of a carrier film and a layer arrangement comprising a sinterable layer of at least one metal powder and a solder layer

Номер: DE102011083926A1
Автор: Andrea Feiock, Bernd Hohenberger, Christiane Früh, Martin Rittner, Michael Günther, Michael Guyenot, Thomas Kalich
Принадлежит: ROBERT BOSCH GMBH

Die Erfindung betrifft einen Schichtverbund (10), insbesondere zum Verbinden von elektronischen Bauteilen als Fügepartner, umfassend mindestens eine Trägerfolie (11) und eine darauf aufgebrachte Schichtanordnung (12) umfassend mindestens eine auf die Trägerfolie (11) aufgebrachte, sinterbare Schicht (13) enthaltend mindestens ein Metallpulver und eine auf die sinterbare Schicht (13) aufgebrachte Lotschicht (14). Die Erfindung betrifft weiterhin ein Verfahren zur Ausbildung eines Schichtverbunds, eine Schaltungsanordnung enthaltend einen erfindungsgemäßen Schichtverbund (10) sowie die Verwendung eines Schichtverbunds (10) in einem Fügeverfahren für elektronische Bauteile. The invention relates to a layer composite (10), in particular for joining electronic components as joining partners, comprising at least one carrier film (11) and a layer arrangement (12) applied thereto comprising at least one sinterable layer (13) applied to the carrier film (11) at least one metal powder and a solder layer (14) applied to the sinterable layer (13). The invention further relates to a method for forming a layer composite, a circuit arrangement comprising a layer composite (10) according to the invention and the use of a layer composite (10) in a joining method for electronic components.

Подробнее
Номер записи: 16
28-08-2013 дата публикации

Ausgangswerkstoff einer sinterverbindung und verfahren zur herstellung der sinterverbindung

Номер: EP2629911A2
Автор: Andrea Feiock, Daniel Wolde-Giorgis
Принадлежит: ROBERT BOSCH GMBH

Der erfindungsgemäße Ausgangswerkstoff einer Sinterverbindung umfassend erste Partikel aus mindestens einem Metall mit einer auf den ersten Partikeln aufgetragenen ersten Beschichtung aus einem organischen Material, sowie zweite Partikel, die eine organische Metallverbindung und/oder ein Edelmetalloxid enthalten, wobei die organische Metallverbindung und/oder das Edelmetalloxid bei einer Temperaturbehandlung des Ausgangswerkstoffes in das zugrunde liegende elementare Metall und/oder Edelmetall umgewandelt werden. Kennzeichnend für die Erfindung ist, dass die zweiten Partikel einen Kern mindestens eines Metalls umfassen, sowie eine auf dem Kern aufgetragene zweite Beschichtung enthaltend die organische Metallverbindung und/oder das Edelmetalloxid. Ferner, dass die erste Beschichtung ein Reduktionsmittel enthält, mittels welchem die Reduktion der organischen Metallverbindung und/oder des Edelmetalloxids zu dem elementaren Metall und/oder Edelmetall bei einer Temperatur unterhalb der Sintertemperatur des elementaren Metalls und/oder Edelmetalls erfolgt.

Подробнее
Номер записи: 17
19-08-2021 дата публикации

Schaltungsträger mit einem wärmeleitfähigen gedruckten metall-inlay

Номер: WO2021160511A1
Автор: Andrea Feiock, Thomas Sonntag
Принадлежит: ROBERT BOSCH GMBH

Die Erfindung betrifft einen Schaltungsträger (13). Der Schaltungsträger weist wenigstens eine keramisch ausgebildete, elektrisch isolierende Schicht, und wenigsten seine elektrisch leitfähige Schicht auf. In dem Schaltungsträger ist eine wärmeleitfähige, den Schaltungsträger wenigstens auf einem Abschnitt einer Dickenerstreckung des Schaltungsträgers durchsetzende Metallbrücke (17) ausgebildet. Erfindungsgemäß ist die Metallbrücke aus einem Poren aufweisenden, insbesondere gesinterten Metall, gebildet.

Подробнее
Номер записи: 18
20-08-2021 дата публикации

Support de circuit comportant un insert métallique, thermo-conducteur imprimé

Номер: FR3107396A1
Автор: Andrea Feiock, Thomas Sonntag
Принадлежит: ROBERT BOSCH GMBH

TITRE : Support de circuit comportant un insert métallique imprimé, thermo-conducteur Support de circuit (20) comportant au moins une couche électro-isolante céramique et au moins une couche électro-conductrice (21, 24, 26), et dans lequel est réalisé un pont métallique (17) thermo-conducteur, traversant le support de circuit (20) sur au moins un segment de son épaisseur (36). Le pont métallique (17) est un métal muni de pores (16), notamment du métal fritté. Figure 2

Подробнее
Номер записи: 19
28-08-2013 дата публикации

Ausgangswerkstoff und verfahren zur herstellung einer sinterverbindung

Номер: EP2630267A1
Автор: Andrea Feiock, Daniel Wolde-Giorgis, Robert Kolb, Thomas Kalich
Принадлежит: ROBERT BOSCH GMBH

Die vorliegende Erfindung betrifft einen Ausgangswerkstoff zur Herstellung einer Sinterverbindung. Um eine Rissbildung bei Temperaturwechselbeanspruchung zu vermeiden, umfasst der Ausgangswerkstoff neben metallischen ersten Partikeln 10 zweite Partikel 20, welche zumindest anteilig elementares Silicium und/oder Siliciumdioxid enthalten. Darüber hinaus betrifft die vorliegende Erfindung die Verwendung von elementarem Silicium und/oder Siliciumdioxid zur Verringerung des thermischen Längenausdehnungskoeffizienten α eines Ausgangswerkstoffs 100 einer Sinterverbindung 100' beziehungsweise einer Sinterverbindung 100', insbesondere in einer Sinterpaste, einem Sinterpulver oder einem Sintermaterialvorformkörper. Ferner betrifft die vorliegende Erfindung Sinterverbindungen 100', elektronische Schaltungen 70 sowie Verfahren zur Ausbildung einer thermisch und/oder elektrisch leitenden Sinterverbindung.

Подробнее
Номер записи: 20