МЕДНО-ЦИНКОВЫЙ СПЛАВ

Изобретение относится к медно-цинковому сплаву, который может быть использован для изготовления подшипников, деталей двигателей, колец синхронизаторов, электропроводящих компонентов, например контактов. Сплав содержит, мас.%: Cu 62,5-67, Sn 0,25-1,0, Si 0,015-0,15, по меньшей мере два силицидообразующих элемента из группы Mn, Fe, Ni и Al 0,15% каждого и 0,6% в сумме, Pb не более 0,1%, остальное Zn и неизбежные примеси. Изобретение направлено на получение высокопрочного сплава, обладающего способностью к холодному формованию и подходящего для изготовления электропроводящих компонентов. 2 н. и 11 з.п. ф-лы, 2 табл., 5 ил.

МЕДНЫЙ СПЛАВ

Изобретение относится к цветной металлургии и может быть использовано для изготовления механических деталей, которые требуют высоких литейных качеств, электропроводности, теплопроводности и высоких механических свойств, а именно электрических контактов, соединителей и электрических деталей, на которых можно легко выполнять сварку и пайку, а также других деталей. Сплав содержит, мас.%: Cu 69-88, Si 2-5, Zr 0,0005-0,04, Р 0,01-0,25, Zn - остальное, а также необязательно по меньшей мере один элемент, выбранный из группы Pb 0,005-0,45, Bi 0,005-0,45, Se 0,03-0,45, Те 0,01-0,45, и/или необязательно по меньшей мере один элемент, выбранный из группы Sn 0,05-1,5, As 0,02-0,25, Sb 0,02-0,25. Сплав имеет металлическую структуру, содержащую α-фазу и κ-фазу и/или γ-фазу, а средний диаметр зерен сплава в макроструктуре при затвердевании составляет 200 мкм или менее. Содержание элементов и фаз в сплаве удовлетворяет дополнительным условиям. Улучшаются свойства медного сплава - литейные качества, механические ...

МЕДНЫЙ ЛИТЕЙНЫЙ СПЛАВ ДЛЯ АСИНХРОННЫХ МАШИН

Изобретение относится к медным литейным сплавам и может быть использовано для изготовления методом литья токопроводящих конструкционных деталей, в частности короткозамкнутых роторов для асинхронных машин. Литейный медный сплав содержит, мас.%: Ag от 0,05 до 0,5, в каждом случае от 0,05 до 0,5 по меньшей мере двух элементов из группы, состоящей из Ni, Zn, Sn и Al, необязательно от 0,01 до 0,2 одного или нескольких элементов из группы, которая состоит из Mg, Ti, Zr, B, P, As, Sb, Cu, и неизбежные примеси – остальное. Кроме того, изобретение относится к токопроводящей конструкционной детали, а также к короткозамкнутому ротору с многочисленными проводящими стержнями и двумя замыкающими кольцами, которые отлиты из медного сплава в виде цельной детали. Изобретение направлено на повышение прочности и проводимости токопроводящих конструкционных деталей, а также улучшение литейных качеств медного сплава. 3 н. и 11 з.п. ф-лы, 1 табл.

Латунный сплав для изготовления прутков

Изобретение относится к области цветной металлургии, в частности к сплавам на основе меди с цинком и свинцом, и может быть использовано для изготовления прутков круглого, квадратного или шестигранного сечений, поставляемых в прямых отрезках, специально предназначенных для обработки на автоматах и предназначенных для изготовления деталей, являющихся составными частями сантехнических изделий. Латунный сплав для изготовления прутков содержит, мас. %: медь 56 – 58, свинец 1,5 – 2,41, железо 0,01 – 0,45, никель 0,04 – 0,43, олово 0,03 – 0,42, кремний 0,02 – 0,26, алюминий 0,022 – 0,41, марганец 0,02 – 0,40, сурьма 0,003 – 0,03, висмут ≤ 0,003, неизбежные примеси ≤ 1,5, цинк – остальное. Техническим результатом изобретения является повышение механообрабатываемости латунных сплавов, обладающих высокими прочностными свойствами. 1 табл., 19 ил.

Спеченный сплав на основе меди

Изобретение относится к области порошковой металлургии и касается спеченных сплавов на основе меди, которые могут быть использованы в приборостроении и машиностроении. Спеченный сплав на основе меди содержит, мас.%: цинк 6,5-8,5; никель 0,5-1,5; железо 0,2-0,3; марганец 4,0-6,0; ванадий 0,15-0,2; церий 0,15-0,2; медь - остальное. Техническим результатом изобретения является повышение твердости сплава. 1 табл.

Латунь

Изобретение относится к области цветной металлургии и касается составов латуней, используемых для изготовления нажимных и червячных винтов, шестерен. Латунь содержит, мас.%: медь 50,0-55,0; марганец 5,5-6,5; железо 1,0-1,5; алюминий 1,0-1,5; индий 0,1-0,2; цинк - остальное. Техническим результатом изобретения является повышение коррозионной стойкости латуни. 1 табл.

СПЛАВ ЛАТУНИ, ВКЛЮЧАЮЩИЙ КЕРАМИЧЕСКИЕ НАНОЧАСТИЦЫ ОКСИДА АЛЮМИНИЯ, КОТОРЫЙ ОБЛАДАЕТ УЛУЧШЕННЫМИ СВОЙСТВАМИ В ОТНОШЕНИИ МЕХАНИЧЕСКОЙ ОБРАБОТКИ

Изобретение относится к сплавам латуни и может быть использовано для изготовления изделий в электротехнической, машиностроительной и автомобильной промышленности. Сплав латуни содержит Cu, Zn, 0-0,25% мас. Pb и 0,04-0,1% мас. AlO, при этом AlOприсутствует в сплаве в форме керамических наночастиц. Сплав латуни может дополнительно содержать As, добавки Sn, Fe, Al, Ni, Mn и/или Si. Способ получения сплава латуни включает добавление наночастиц AlOв начале процесса плавления в плавильную ванну, содержащую латунный лом, при этом указанный латунный лом в плавильной ванне содержит количество компонентов, соответствующее заданному составу сплава латуни. Изобретение направлено на улучшение способности к обработке резанием бессвинцовистой латуни. 5 н. и 16 з.п. ф-лы, 7 ил., 1 табл., 2 пр.

СПОСОБ ИЗГОТОВЛЕНИЯ ЗАГОТОВКИ ИЗ ЛАТУНИ БЕЗ ПРИМЕСИ СВИНЦА ИЛИ С НИЗКИМ СОДЕРЖАНИЕМ СВИНЦА И ЗАГОТОВКА, ИЗГОТОВЛЕННАЯ С ИСПОЛЬЗОВАНИЕМ ЭТОГО СПОСОБА

МЕДНО-ЦИНКОВЫЙ СПЛАВ, А ТАКЖЕ ИЗГОТОВЛЕННОЕ ИЗ НЕГО БЛОКИРУЮЩЕЕ КОЛЬЦО СИНХРОНИЗАТОРА

... 1. Медно-цинковый сплав, содержащий от 55 до 75 мас.% меди, от 0,1 до 8 мас.% алюминия, от 0,3 до 3,5 мас.% железа, от 0,5 до 8 мас.% марганца, от 0 до менее 5 мас.% никеля, от 0 до менее 0,1 мас.% свинца, от 0 до 3 мас.% олова, от 0,3 до 5 мас.% кремния, от 0 до менее 0,1 мас.% кобальта, от 0 до менее 0,05 мас.% титана, от 0 до менее 0,02 мас.% фосфора, неизбежные примеси, а остальное - цинк. ! 2. Медно-цинковый сплав по п.1, отличающийся тем, что в нем содержатся алюминий с содержанием от 0,5 до 2,5 мас.%, железо с содержанием от 0,3 до 1 мас.%, марганец с содержанием от 0,5 до 5 мас.%, никель с содержанием от 0,5 до менее 5 мас.%, олово с содержанием от 0 до 1,5 мас.% и кремний с содержанием от 0,3 до 2 мас.%. ! 3. Медно-цинковый сплав по п.1, отличающийся тем, что в нем содержатся алюминий с содержанием от 3 до 8 мас.%, железо с содержанием от 1 до 3 мас.%, марганец с содержанием от 5 до 8 мас.%, никель с содержанием от 0 до менее 0,5 мас.%, олово с содержанием от 0 до менее 0,5 мас ...

МЕДНО-ЦИНКОВЫЙ СПЛАВ ДЛЯ САНТЕХНИЧЕСКОЙ АРМАТУРЫ И СПОСОБ ЕГО ИЗГОТОВЛЕНИЯ

МЕДНЫЙ ЛИТЕЙНЫЙ СПЛАВ ДЛЯ АСИНХРОННЫХ МАШИН

СПОСОБ ПОЛУЧЕНИЯ ЛАТУННОЙ ЗАГОТОВКИ С ПОНИЖЕННЫМ СОДЕРЖАНИЕМ СВИНЦА И ПОЛУЧЕННАЯ ЗАГОТОВКА

Изобретение относится к области металлообработки, в частности, к способам получения латунной заготовки. Способ получения латунной заготовки с содержанием свинца, пониженным до менее чем 1,5 мас.%, включает следующие этапы: осуществляют механическую обработку посредством снятия стружки с готового изделия или полуфабриката, состоящего из латуни, содержащей 1,5-3,5 мас.% свинца, с получением латунной стружки, осуществляют сжатие латунной стружки для увеличения ее наружной поверхности, измельчают указанную латунную стружку посредством дробления для получения латунных частиц, удаляют свинец из указанных частиц латуни для получения частиц латуни с пониженным содержанием свинца посредством промывки указанных частиц латуни в растворе воды и одной или нескольких органических кислот, выбранных из бутановой кислоты, пропионовой кислоты, 2-пропеновой кислоты и акриловой кислоты, причем ванну для удаления свинца перемешивают посредством ультразвука, плавят в печи шихту, содержащую указанные латунные ...

KUPFERWERKSTOFF MIT VERBESSERTER EROSIONS-KORROSIONSBESTAENDIGKEIT

Nickelfeie weiße CuZn-Legierung und Verwendung derselben

Nickelfreie weiße CuZn-Legierung, mit folgenden Legierungselementen: – 63,0 bis 67,0% Cu, – 0,01 bis 0,15% Pb, – 0,01 bis 0,2% Fe, – 1,3 bis 2,5% Al, – 12,0 bis 15,0% Mn, – Rest Zn sowie – unvermeidbare Verunreinigungen.

Kupfer-Zink-Legierung

Bauteil für medienführende Gas- oder Wasserleitungen

Bauteil für medienführende Gas- oder Wasserleitungen, insbesondere Fitting oder Armatur für Trinkwasserleitungen, wobei das Bauteil zumindest teilweise aus einer bleifreien Kupferlegierung besteht, die die folgenden Legierungskomponenten in Gew.-% aufweist: 3,5 Gew.-% ≤ Sn ≤ 4,8 Gew.-%; 1,5 Gew.-% ≤ Zn ≤ 5,0 Gew.-%; 0,25 Gew.-% ≤ S ≤ 0,65 Gew.-%; 0,015 Gew.-% ≤ P ≤ 0,1 Gew.-%; unvermeidbare Verunreinigungen sowie zum Rest Kupfer.

Bonddraht für Halbleitervorrichtung

Bonddraht für eine Halbleitervorrichtung, wobei der Bonddraht aufweist:ein Cu-Legierungskernmaterial; undeine auf einer Oberfläche des Cu-Legierungskernmaterials gebildete Pd-Überzugschicht, wobeibei Messung von Kristallorientierungen auf einem Querschnitt des Kernmaterials in senkrechter Richtung zu einer Drahtachse des Bonddrahts eine Kristallorientierung <100> im Winkel von höchstens 15 Grad zu einer Drahtachsenrichtung einen Anteil von mindestens 30 % unter Kristallorientierungen in Drahtachsenrichtung hat,eine mittlere Kristallkorngröße im Querschnitt des Kernmaterials in senkrechter Richtung zur Drahtachse des Bonddrahts 0,9 µm oder mehr und 1,5 µm oder weniger beträgt, undder Bonddraht ein oder mehrere Elemente enthält, die aus Ga und Ge ausgewählt sind, und eine Konzentration der Elemente insgesamt 0,011 bis 1,5 Masse-% relativ zum gesamten Draht beträgt.

Verfahren zur Herstellung von Halbzeugen oder Halbfabrikaten aus Kupferlegierungen mit beta- und alpha-Gefuege

Verwendung einer Kupfer-Mangan-Zink-Legierung als Werkstoff fuer einer Gleitbeanspruchung ausgesetzte Maschinenteile

KOLBENBOLZENBUCHSE

Herstellung von Legierungen des Systems Kupfer-Zink-Nickel

Sintered brasses contg. cobalt - to increase yield strength and reduce shrinkage during sintering

A sintered Cu-Zn alloy and a brass powder for prodn. of the alloy have the compsn. (by wt.) 5-45% Zn, 1-7% Co, balance Cu and opt. up to 2% Pb. Esp. for constructional parts in which the permissible stress is less than 1/4 of the ultimate tensile strength or 2/3 of the yield strength. Addn. of cobalt increases the tensile strengthg and yield strength of the brass, reduces shrinkage during sintering, and suppresses Beta phase formation in 60/40 brasses so that denser compacts can be produced.

Verwendung einer Kupfer-Zinn-Eisen-Legierung

Die Erfindung betrifft die Verwendung einer Kupfer-Zinn-Eisen-Legierung, die aus 4 bis 12% Zinn; 0,1 bis 4% Eisen; Rest Kupfer und üblichen Verunreinigungen besteht, zur Herstellung von gefügten Bauteilen, wie insbesondere Schmuck, Bekleidungsaccessoires oder Brillen usw.

KUPFER-ZINK-SILIZIUM-LEGIERUNG, DEREN VERWENDUNG UND DEREN HERSTELLUNG

MESSINGLEGIERUNG

Copper base alloys - contg manganese, zinc and aluminium, suitable for casting under pressure

Alloys suitable for mf r. of gear-box shafts etc. consist of 16-22% Mn, 16-22% Zn, and 0.5 - 2% Al, the balance being Cu. These alloys melt at lower temps. than ordinary aluminium bronzes and cost less, yet their strength and hardness are not inferior.

Copper-zinc alloys

An alloy has the following percentage composition:- Up to 3% in total of the following incidental elements may be present:- Fe up to 1.5, Si up to 0.5, P up to 0.05, Mg up to 0.5, Sn up to 1, Zr up to 0.5, Mn up to 3, Pb up to 0.5, Ni up to 1, Co up to 1.

An improved alloy of copper and zinc

A copper-zinc alloy containing 70 per cent or more of copper and also at least 1 per cent of aluminium and 0,2-2 per cent, preferably not over 1,5 per cent, of chromium, is made by mixing the copper, aluminium, and zinc, and subsequently adding the chromium in small quantities at a time, for example, about 0,1 per cent at a time. The alloy is particularly suitable for making condenser tubes and ends. Specifications 15891/94, [Class 82 (i)], and 398,385 are referred to.

Improvements in methods and apparatus for melting brass chips

... 631,397. Melting brass chips &c. TRIGGS, W. W. (Chase Brass & Copper Co., Inc.). Feb. 24, 1947, No. 5343. [Class 51 (ii)] A process for melting brass chips, such as those produced by machining operations, or small brass articles such as cartridge cases, comprises maintaining a pool of molten brass at a temperature at which zinc vapours are given off, continuously advancing and agitating the chips with such iron particles as may be included therewith through an air-excluding duct, maintaining an incoming portion of the stream of chips at a temperature sufficiently low to condense zinc vapours thereon while preheating another portion in advance of the cooler incoming portion to a temperature above 1000‹ F., continuously passing a reducing gas through the chips to deoxidise them, and introducing the heated and deoxidised chips through a non-oxidising atmosphere into the pool of melted brass. The chips are preferably preheated to within 100‹ F. of their melting point. In the apparatus shown ...

A COPPER-BASED ALLOY FOR OBTAINING ALUMINIUM-BETA-BRASSES, CONTAINING GRAIN SIZE REDUCING ADDITIVES

Bearings

Security alloy

Improvements in alloys

A manganese brass alloy characterised by excellent retention of composition during manufacture and remelting contains 18 to 25 per cent zinc, 7.5 to 12.5 or 15 to 20 per cent manganese, 0.1 to 4 per cent iron, 0.1 to 0.5 per cent aluminium and the balance copper within the range of 61 to 67 per cent copper with the alloys containing 7.5 to 12.5 per cent manganese and 20 to 25 per cent zinc, and within the range of 54 to 60 per cent copper with the alloys containing 15 to 20 per cent manganese and 18 to 23 per cent zinc. The iron is preferably from 1 to 3 per cent. The alloys may include 0.1 to 3 per cent lead.

SHAPE-MEMORY ALLOY BASED ON COPPER

A copper-base shape-memory alloy consisting essentially of 15-35% Zn, 3.2-10% Al, 0.01-1% Si, at least one element selected from the group of 0.5-2% Ti, 0.01-1% Cr, 0.01-8% Mn, 0.01-2% Co and 2.1-4% Ni, the balance being Cu and incidental impurities, the percent being by weight is disclosed. This alloy has high resistance to intercrystalline cracking and thermal cycling as well as improved shape-memory properties.

COPPER ALLOY HAVING HIGH RESISTANCE TO OXIDATION FOR USE IN LEADS OF SEMICONDUCTOR DEVICES AND CLAD MATERIAL CONTAINING SAID ALLOY

Multilayer material

Improvements in or relating to copper base alloys

... 578,873. Alloys ; heat-treating and working. COOK, M., ALEXANDER, W. O., and IMPERIAL CHEMICAL INDUSTRIES, Ltd. Oct. 17, 1941, No. 13376. [Classes 72 and 82 (i)] [Also in Group XXII] Condenser tubes, ferrules, &c. are made from copper zinc aluminum alloys covered by the triangle A, B, C, in the Figure, the alloys being retained completely in the alpha phase by effecting all necessary hot-working and annealing treatments at 500-650‹ C., preferably at 600‹ C. The alloys may also contain a small proportion of an agent to reduce or prevent zincification, e.g. 0.02-0.06 per cent of arsenic and may also contain up to 0.5 per cent of each of one or more of iron, silicon, phosphorus, cadmium, silver, tin, lead and nickel, the total amount of these elements not exceeding 2 per cent.

Tarnish resistant cu-al-za alloys

A tarnish resistant alloy which may be used as a visual colour substitute for copper comprises:- and has a chromaticity consisting of dominant wavelengths between 584 mm and 592 mm in a colour purity range between 18.5% and 30.2%. The alloy may be heat treated in an oxygen containing atmosphere at 400 DEG C. followed by slow cooling or at 600 DEG C. followed by water quenching to improve the tarnish resistance and colour thereof. missing page 110 ...

SILICON BRASS RESISTANT TO PARTIN CORROSION-

... 1443090 Silicon brass ANACONDA CO 25 March 1974 13180/74 Heading C7A A silicon brass which is resistant to parting corrosion comprises:- the balance being Cu; has Zn and Si contents sufficient to produce a micro-structure consisting of alpha + zeta phases; and is rapidly cooled to room temperature from 500‹-760 C.

BRASS MATERIAL AND A METHOD OF PRODUCING SUCH MATERIAL

Improvements in and relating to bearing metals and bearings made therefrom

... 529,889. Alloys. BOSCH GES., R. June 10, 1939, No. 17049. Convention date, June 14, 1938. [Class 82 (i)] Alloys for bearings consist of 55-75 per cent. of copper, 3-7 per cent. of aluminium, 0.5-4 per cent. of iron, 3.5-7 per cent. of manganese, up to 0.8 per cent of lead, and the remainder zinc. Up to 2 per cent. of the copper may be replaced by nickel.

Improvements in or relating to brazing alloys

A brazing alloy consists of copper 51 to 62 per cent, zinc 30.9 to 48.5 per cent, silver 0.4 to 7.0 per cent, silicon 0.1 to 0.8 per cent. The preferred alloy consists of 56 to 60 per cent copper, 32.2 to 42.5 per cent zinc, 0.4 to 7.0 per cent silver, and 0.1 to 0.8 per cent silicon. A silver content of 0.8 to 1.3 per cent gives best results.

COPPER ALLOY, WHICH EXHIBIT EXCELLENT CORROSION RESISTANCE AND DEZINCIFICATION STABILITY, AND A METHOD TO THEIR PRODUCTION

USE MIGRATION ARMS OF A COPPER ALLOY AS WELL AS CONSTRUCTION UNITS FROM THIS ALLOY

LEGIERUNG AUF KUPFERBASIS ZUR GEWINNUNG VON ALUMINIUM-BETA-MESSING, DAS KORNGROESSENREDUKTIONSZUSAETZE ENTHAELT

ELECTRICAL PLUG CONTACTS AND A SEMI-FINISHED MATERIAL FOR THEIR PRODUCTION

USE OF VORLEGIERUNG FOR THE MODIFICATION OF COPPER ALLOY AND CASTING PROCESS THEREBY

MEHRSCHICHTLAGER

LEGIERUNG AUF KUPFERBASIS ZUR GEWINNUNG VON ALUMINIUM-BETA-MESSING, DAS KORNGROESSENREDUKTIONSZUSAETZE ENTHAELT

ARMATURE

MORE DRAHTODER ROD-SHAPED COPPER ALLOY MATERIAL FOR CONSTRUCTION FOR USE IN SEA WATERS

BRASS ALLOY

PROCEDURE FOR THE PRODUCTION OF BY WARM TREATMENT OF RESTORABLE METALLIC ARTICLE

PROCEDURE FOR THE PRODUCTION OF WATER-PROMINENT COPPER CAST PARTS ALSO BY GLOWING OF REDUCTIONS MIGRATION INCLINATION

ALLOY ON COPPER BASIS

MIGRATION ARMS COPPER ALLOY

MEHRSCHICHTGLEITLAGER

The invention relates to a composite bearing (1) comprising at least one bismuth-containing alloy layer and a diffusion barrier layer (4) arranged on top or underneath it. Said diffusion barrier layer (4) is made of steel, especially high-grade steel or stainless steel.

BRASS ALLOY AS WELL AS SYNCHRONIZER

COPPER ALLOY PLATE FOR ELECTRICAL AND ELECTRONIC CONSTRUCTION UNITS

WIRE ELECTRODE.

DENTALLEGIERUNG FROM ALUMINIUM BRONZE.

FRICTION BODY AND PROCEDURE FOR MANUFACTURING SUCH

Copper zinc alloy for pressure tight cast pieces

COPPER ALLOY WITH ZINC, TIN AND IRON FOR ELECTRICAL CONNECTION AND PROCEDURE FOR THE PRODUCTION OF THE ALLOY

WHITE COPPER ALLOY WITHOUT NICKEL

USE OF A COPPER CORROSION RESISTANT ZINC ALLOY FOR DRINKING WATER SHAPED PARTS

DEZINCIFICATION-RESISTANT INJECTION MOULDING BRASS ALLOY

COPPER ALLOY, WHICH EXHIBIT EXCELLENT CORROSION RESISTANCE AND DEZINCIFICATION STABILITY, AND A METHOD TO THEIR PRODUCTION

COPPER ALLOY, WHICH EXHIBIT EXCELLENT CORROSION RESISTANCE AND DEZINCIFICATION STABILITY, AND A METHOD TO THEIR PRODUCTION

COPPER ALLOY, WHICH EXHIBIT EXCELLENT CORROSION RESISTANCE AND DEZINCIFICATION STABILITY, AND A METHOD TO THEIR PRODUCTION

COPPER ALLOY, WHICH EXHIBIT EXCELLENT CORROSION RESISTANCE AND DEZINCIFICATION STABILITY, AND A METHOD TO THEIR PRODUCTION

COPPER ALLOY, WHICH EXHIBIT EXCELLENT CORROSION RESISTANCE AND DEZINCIFICATION STABILITY, AND A METHOD TO THEIR PRODUCTION

COPPER ALLOY, WHICH EXHIBIT EXCELLENT CORROSION RESISTANCE AND DEZINCIFICATION STABILITY, AND A METHOD TO THEIR PRODUCTION

COPPER ALLOY, WHICH EXHIBIT EXCELLENT CORROSION RESISTANCE AND DEZINCIFICATION STABILITY, AND A METHOD TO THEIR PRODUCTION

Copper alloy, copper alloy ingot, copper alloy solution forming material, copper alloy trolley wire and method for producing copper alloy trolley wire

This copper alloy is characterized by having a composition that contains from 0.05 mass% to 0.70 mass% (inclusive) of Co, from 0.02 mass% to 0.20 mass% (inclusive) of P, from 0.005 mass% to 0.70 mass% (inclusive) of Sn, and one or more elements selected from among B, Cr and Zr, with the balance made up of Cu and unavoidable impurities; and this copper alloy is also characterized in that if X (mass ppm) is the content of B, Y (mass ppm) is the content of Cr and Z (mass ppm) is the content of Zr, X, Y and Z satisfy formula (1) 1 ≤ (X/5) + (Y/50) + (Z/100) and formula (2) X + Y + Z ≤ 1,000.

WHITE-COLORED COPPER ALLOY WITH REDUCED NICKEL CONTENT

Abstract The invention relates to a product comprising: a copper alloy comprising (a) 6-25% by weight zinc; (b) 7-17% by weight manganese; (c) 0.1-3.5% by weight nickel; and (d) the balance copper; wherein the copper alloy has a CIELAB a* value from about -2 to about 3 and a b* value from about -2 to about 10. Furthermore, the copper alloy inactivates 99.9% of bacteria in suspension on an uncoated surface of the copper alloy within 120 minutes of exposure. Furthermore, the copper alloy has a AEMc of less than 1 after 30 days exposure in air at 20-25'C without contact with human skin or body fluids. Furthermore, the copper alloy has a AEMc of less than 20 after 24 hours exposure in air at 150'C. Furthermore, the copper alloy has a AEMc of less than 3 after three days of repeated skin contact.

Method for producing metal components and metal component produced in this way

The invention relates to a method for producing metal components, consisting at least partially of a copper alloy, comprising the following alloy components in wt.%: 0 wt.% < Sn ≤ 8 wt.%; 0 wt.% < Zn ≤ 6 wt.%; 0.1 wt.% ≤ S ≤ 0.7 wt.%; optionally no more than 0.2 wt.% phosphorus; optionally no more than 0.1 wt.% antimony; and optionally iron, zirconium and/or boron alone or in a combination of two or more of said elements of no more than 0.3 wt.%; and unavoidable impurities, and the rest being copper. The method comprises the following stages: (a) melting the copper alloy: (b) producing press blanks from the copper alloy; and (c) pressing the press blanks at a suitable pressing temperature to form the metal components. The invention also relates to a metal component which has been produced according to a method of this type.

Copper base alloy, and cast ingot and parts to be contacted with liquid

A lead-free copper alloy and its use

Metal material and method for production thereof

Metal material for electronic components and method for producing same

Provided are: a metal material for electronic components, which has low insertion/removal resistance, low occurrence of whiskers and high durability; and a method for producing the metal material for electronic components. A metal material (10) for electronic components, which is provided with: a base (11); a layer A (14) that constitutes the outermost layer of the base (11) and is formed of Sn, In or an alloy of these elements; and a layer B (13) that is arranged between the base (11) and the layer A (14) so as to constitute an intermediate layer and is formed of Ag, Au, Pt, Pd, Ru, Rh, Os, Ir or an alloy of these elements. The outermost layer (the layer A (14)) has a thickness of 0.002-0.2 m, and the intermediate layer (the layer B (13)) has a thickness of 0.001-0.3 m.

Lead-free brass alloy

The invention relates to brass alloys that are substantially lead-free. In the alloys of the invention, lead is replaced with tellurium resulting in alloys that exhibit excellent machinability and conductivity.

Brass material, brass tube and their production method

Copper alloy for electronic/electric device, copper alloy thin plate for electronic/electric device, method for manufacturing copper alloy for electronic/electric device, and conductive part and terminal for electronic/electric device

Provided is a copper alloy comprising, by mass%, Zn at greater than 2.0% and 36.5% or less, Sn at 0.1% to 0.9%, Ni at 0.05% or more and less than 1.0%, Fe at 0.001% or more and less than 0.10%, P at 0.005% to 0.10%, and the remainder including Cu and inevitable impurities, wherein in atomic ratio, 0.002Fe/Ni<1.5, 3<(Ni+Fe)/P<15, and 0.3 Подробнее

LOW-LEAD COPPER ALLOYS

METHOD FOR PRODUCING LOW LEAD BRASS ALLOY AND PRODUCT COMPRISING THE SAME

A low lead brass alloy and a method for producing a product comprising the same are proposed. The low lead brass comprises 0.05 to 0.3 wt% of lead (Pb); 0.3 to 0.8 wt% of aluminum (Al); 0.01 to 0.1 wt% of bismuth (Bi); 0.1 to 0.15 wt% of micro elements; and more than 98.65 wt% of copper (Cu) and zinc(Zn) , wherein copper is in an amount ranging from 58 to 70 wt%.

STRUCTURE USED IN SEAWATER, COPPER ALLOY WIRE OR BAR FORMINGTHE STRUCTURE, AND METHOD FOR MANUFACTURING THE COPPER ALLOY WIRE OR BAR

A fish cultivation net 3 has a rhombically netted form made by arranging a large number of waved wires 6 in parallel such that the adjacent wires are entwined with each other at their curved portions 6a. The wires 6 has a composition containing 62 to 91 mass% of Cu, 0.01 to 4 mass% of Sn, and the balance being Zn. The Cu content [Cu] and the Sn content [Sn] in terms of mass% satisfy the relationship 62 .ltoreq. [Cu]-0.5[Sn] .ltoreq. 90. The copper alloy material has a phase structure including an a phase, a .gamma. phase, and a .delta. phase and the total area ratio of these phases is 95 to 100%.

COPPER ALLOYS AND HEAT EXCHANGER TUBES

Alloys comprising copper, iron, tin and, optionally, phosphorus or copper, zinc, tin and, optionally, phosphorus, which can be used in, for example, a copper alloy tube for heat exchangers that provides excellent fracture strength and processability for reducing the weight of the tube and for use in high pressure applications with cooling media such as carbon dioxide.

HIGH POTENT AND HIGH ELECTROCONDUCTIVE COPPER ALLOY SUITABLE FOR FIN MATERIAL OF HEAT-EXCHANGER

A highly electroconductive copper alloy is disclosed which contains 0.003 to 1.0 wt. % of Zn, 0.005 to 0.1 wt. % of Mg and the remainder Cu. Not more than 0.1 wt. % in total of one or more of Cr, Mn, Fe, Co, Ni, Y, Sn, Si and Zr may further be present, while the amount of oxygen present is confined to not more than 100 ppm.

ALLOY FOR COINS AND THE LIKE

A coin, a coin blank or a metal strip for the production of a coin or a coin blank having as its surface a copper based alloy containing between 15% and 30% (by wt) zinc, between 2% and 7% (by wt) tin and, optionally, between 2% and 7% (by wt) nickel. The alloy is gold-coloured, tarnish resistant, fabricable and wear resistant.

TWO PHASE NICKEL-ZINC ALLOY

COPPER BASE ALLOYS

UNLEADED FREE-CUTTING BRASS ALLOYS WITH EXCELLENT CASTABILITY, METHOD FOR PRODUCING THE SAME, AND APPLICATION THEREOF

The present invention is directed to an unleaded free cutting brass alloy with excellent machinability, leak-tightness, reca stability, and mechanical properties, wherein the brass alloy comprises 65 to 75 weight% of copper, 22.5 to 32.5 weight% of zinc, 0.5 to 2.0 weight% of silicon, and other unavoidable impurities; wherein the total content of copper and zinc in the brass alloy is 97.5 weight% or more.

HEAT-TREATING METHOD

COPPER-BASED ALLOY AND INGOT AND LIQUID-CONTACTING PART USING THE ALLOY

A copper base alloy having improved soundness of alloy which is produced by a method wherein in a step of solidification of the copper base alloy, an intermetallic compound solidifying at a temperature exceeding a solidus is crystallized in interstices in a dendrite in the alloy, to thereby inhibit the moving of the solute and thus disperse microporosities, and a metal or intermetallic compound having a low melting point and solidifying at a temperature under a solidus is crystallized in a dispersed state due to the crystallization of the former intermetallic compound, and this metal or intermetallic compound having a low melting point enters into the above porosities, to thereby inhibit the generation of microporosities; and an ingot and a member contacting with a liquid using the above alloy. The above copper base alloy is inhibited in the concentrated generation of microporosities while being reduced in the content of lead, to thereby exhibit improved soundness of alloy.

HIGH-STRENGTH FREE-CUTTING COPPER ALLOY AND METHOD FOR PRODUCING HIGH-STRENGTH FREE-CUTTING COPPER ALLOY

This high-strength free-cutting copper alloy comprises 75.4-78.0% Cu, 3.05-3.55% Si, 0.05-0.13% P and 0.005-0.070% Pb, with the remainder comprising Zn and inevitable impurities, wherein the amount of Sn existing as inevitable impurities is at most 0.05%, the amount of Al is at most 0.05%, and the total amount of Sn and Al is at most 0.06%. The composition satisfies the following relations: 78.0<=f1=Cp+0.8xSi+P+Pb<=80.8; and 60.2<=f2=Cu-4.7x S+P+0.5xPb<=61.5. The area percentage (%) of respective constituent phases satisfies the following relations: 291<=.kappa.<=60; 0<=.gamma.<=0.3; .beta.=0; 04<=µ<=1.0; 98.6<=f3=.alpha.+.kappa.; 99.7<=4=.alpha±kappa.+.gamma.+µ; 0<=f5=.gamma.+µ<=1.2; and 30<=f6=.kappa.+6x.gamma. 1/2+0.5xµ62. The long side of the .gamma. phase is at most 25 µm, the long side of the µ phase is at most 20 µm, and the .kappa. phase is present within the a phase.

LEADLESS BRASS ALLOY EXCELLENT IN STRESS CORROSION CRACKING RESISTANCE

A lead-free brass alloy having improved resistance to stress corrosion cr acking. The propagation of corrosion cracks in a lead-free brass alloy is in hibited to thereby prevent the linear cracking characteristic of lead-free b rass alloys. The probability that cracks come into contact with the .gamma. phase present at crystal grain boundaries is heightened, and local corrosion on the brass surface is prevented. Thus, the lead-free brass alloy is provi ded which is inhibited from suffering the cracking caused by that corrosion and hence has improved resistance to stress corrosion cracking. The lead-fre e brass alloy having excellent resistance to stress corrosion cracking is a lead-free brass alloy which is a tin-containing bismuth system, tin-containi ng bismuth + antimony system, or tin-containing bismuth + selenium + antimon y system and has an .alpha.+.gamma. structure or .alpha.+ß+.gamma. structure . The .gamma. phase in this brass alloy is evenly dispersed in a given propo rtion, ...

High-strength brass alloy for sliding members, and sliding members

A high-strength brass alloy for sliding members, consists of, by mass %, 17 to 28% of Zn, 5 to 10% of Al, 4 to 10% of Mn, 1 to 5% of Fe, 0.1 to 3% of Ni, 0.5 to 3% of Si, and the balance of Cu and inevitable impurities. The high-strength brass alloy has a structure that includes a matrix of a single phase structure of the β phase and includes at least one of Fe—Mn—Si intermetallic compounds in the form of aciculae, spheres, or petals dispersed in the β phase.

Low lead ingot

A composition for a low lead ingot comprising primarily copper and including tin, zinc, sulfur, phosphorus, nickel. The composition may contain manganese. The low lead ingot, when solidified, includes sulfur or sulfur containing compounds such as sulfides distributed through the ingot. The presence and a substantially uniform distribution of these sulfur compounds imparts improved machinability and better mechanical properties.

Low Lead Brass Alloy

The present invention relates to a low lead brass alloy which ensures reduction of harmful to human health effects of lead that is useful for increasing machinability of brass raw material used in tapwares, valves and water meters, in the event of it's contact with water and which comprises less than 0.25% lead. The inventive brass alloy is an alloy which has machinability, is cost-efficient and environmentally friendly by means of its bismuth content.

Copper alloy sheet for electric and electronic part

A shear plane ratio is reduced by a dislocation density in which a value obtained by dividing the half-value width β of the intensity of diffraction of {311} plane in the surface of a Cu—Fe—P alloy sheet, by its peak height H, is 0.015 or more. In addition, a Cu—Fe—P alloy sheet with relatively small Fe content is provided with a texture in which a ratio (I(200)/I(220)) of intensity of diffraction of (I(200)) from the (200) plane in the sheet surface to intensity of diffraction of (I(220)) from the (220) plane, is 0.3 or less. In addition, a Cu—Fe—P alloy sheet with relatively small Fe content is provided with a texture in which the orientation distribution density of Brass orientation measured by the crystal orientation analysis method using an EBSP by an FE-SEM, is 25% or more; and an average grain size in the sheet is 6.0 μm or less.

BRASS ALLOY

A brass alloy comprising (a) bismuth in an amount in the range from -% by weight, (b) lead present in an amount in the range of -% by, (c) tin present in an amount in the range of -% by weight, (d) a dezincification agent(s) present in an amount in the range of -% by weight, (e) copper present in the range of -% by weight, and (I) the remainder of the composition being essentially zinc. 1. A brass alloy comprising:(a) bismuth in an amount in the range from 0.5-1% by weight,(b) lead present in an amount in the range of 0.15-0.25% by,(c) tin present in an amount in the range of 0.25-1% by weight,(d) a dezincification agent(s) present in a total amount in the range of 0.02-0.4% by weight,(e) copper present in the range of 60-63% by weight, and(f) the remainder of the composition being essentially zinc.2. A brass alloy according to wherein the amount of bismuth is about 0.7% by weight.3. A brass alloy according to wherein the amount of lead is about 0.22% by weight.4. A brass alloy according to wherein the amount of tin is about 0.3% by weight.5. A brass alloy according to wherein the dezincification agent(s) is/are selected from arsenic claim 1 , phosphorous claim 1 , antimony and/or any other dezincification agent.6. A brass alloy according to wherein the dezincification agent(s) is/are present in an amount of 0.02-0.3% by weight.7. A brass alloy according to wherein the dezincification agent(s) is/are present in an amount of 0.05-0.4% by weight.8. A brass alloy according to wherein the dezincification agent(s) is/are present in an amount of 0.05-0.2% by weight.9. A brass alloy according to wherein the dezincification agent(s) is/are present in an amount of about 0.12% by weight.10. A brass alloy according to where the dezincification agent is arsenic and/or phosphorus.11. A brass alloy according to further comprising one or more other elements and no individual other element being present in more than 0.2% by weight. The invention relates to a brass alloy. In ...

Copper-Zinc Alloy Product and Process for Producing Copper-Zinc Alloy Product

A copper-zinc alloy product of the invention contains zinc in an amount of higher than 35% by weight and 43% by weight or less and has a two-phase structure of an α-phase and a β-phase. Further, the ratio of the β-phase in the copper-zinc alloy is controlled to be higher than 10% and less than 40% and the crystal grains of the α-phase and the β-phase are crushed into a flat shape and arranged in a layer shape through cold working. According to the copper-zinc alloy product, it is possible to decrease the copper content and to appropriately secure the strength and cold workability by appropriately controlling the ratio of the β-phase. 1. A copper-zinc alloy product including a copper-zinc alloy containing zinc in an amount of higher than 35% by weight and 43% by weight or less and having a two-phase structure composed of an α-phase and a β-phase , wherein the ratio of the β-phase in the copper-zinc alloy is controlled to be higher than 10% and less than 40% and the crystal grains of the α-phase and the β-phase are crushed into a flat shape and arranged in a layer shape through cold working.2. The copper-zinc alloy product according to claim 1 , wherein the crystal grains of the β-phase having a flat shape are formed in a layer shape in a direction intersecting a direction in which cracks caused by season cracking due to residual stress or cracks caused by stress corrosion cracking progress.3. The copper-zinc alloy product according to claim 1 , wherein the crystal grains of the α-phase and β-phase having a flat shape are arranged along an external surface of the copper-zinc alloy product.4. The copper-zinc alloy product according to claim 3 , wherein the crystal grains of the β-phase having a flat shape are formed such that a ratio of the length of the long side in a direction parallel to the external surface to the length of the short side in a direction perpendicular to the external surface is 2 or higher claim 3 , when viewed in the cross section.5. The copper- ...

Copper Alloy Metal Strip For Zinc Air Anode Cans

The present disclosure generally relates to a zinc air cell having an anode can made of a copper alloy. The anode can material reduces internal gassing within the electrochemical cell while being compatible with the internal chemistry of the anode and the alkaline electrolyte of the cell itself.

LEADLESS BRASS ALLOY EXCELLENT IN STRESS CORROSION CRACKING RESISTANCE

By enhancing a stress corrosion cracking resistance in a leadless brass alloy, specifically by suppressing a velocity of propagation of corrosion cracks in the brass alloy, a straight line crack peculiar to the leadless brass alloy is suppressed, a probability of cracks coming into contact with γ phases is heightened and local corrosion on the brass surface is prevented to suppress induction of cracks by the local corrosion, thereby providing a leadless brass alloy contributable to enhancement of the stress corrosion cracking resistance. The present invention is directed to an Sn-containing Bi-based, Sn-containing Bi+Sb-based or Sn-containing Bi+Se+Sb-based leadless brass alloy excellent in stress corrosion cracking resistance, having an α+γ structure or α+β+γ structure and having γ phases distributed uniformly therein at a predetermined proportion to suppress local corrosion and induction of stress corrosion cracks. 1. An Sn-containing Bi-based , Sn-containing Bi+Sb-based or Sn-containing Bi+Se+Sb-based leadless brass alloy excellent in stress corrosion cracking resistance , having an α+γ structure and having γ phases distributed therein at a predetermined proportion to suppress a velocity of corrosion cracks propagating therein and enhance the stress corrosion cracking resistance.2. A leadless brass alloy excellent in stress corrosion cracking resistance according to claim 1 , wherein a ratio of each of the γ phases to grains when the γ phases surround the grains is a grain-surrounding γ phase ratio claim 1 , and a grain-surrounding average γ phase ratio that is an average value of grain-surrounding γ phase ratios is 28% or more to secure the predetermined proportion.3. A leadless brass alloy excellent in stress corrosion cracking resistance according to claim 1 , wherein the number of the γ phases existing in unit length in a vertical direction of a stress load when the load is exerted onto the alloy is the number of contacting γ phases claim 1 , and the number ...

HIGH-STRENGTH COPPER ALLOY PLATE EXCELLENT IN OXIDE FILM ADHESIVENESS

The present invention is a Cu—Fe—P system copper alloy plate comprising Fe: 0.02-0.5% and P: 0.01-0.25% in mass % with the balance consisting of copper and unavoidable impurities and having the ratio Fe/P of Fe to P in mass % being 2.0 to 5.0, wherein: a ratio of the area of fine crystal grains less than 0.5 μm in equivalent circle diameter to an observation area when a surface is observed by EBSD analysis is 0.90 or less; and the ratio C1s/Cu2p of a peak area of C1s to a peak area of Cu2p on the surface by XPS analysis is 0.35 or less. 1. A high-strength copper alloy plate excellent in oxide film adhesiveness , the copper alloy plate comprising Fe: 0.02-0.5% and P: 0.01-0.25% in mass % with the balance consisting of copper and unavoidable impurities and having the ratio Fe/P of Fe to P in mass % being 2.0 to 5.0 , wherein: a ratio of the area of fine crystal grains less than 0.5 μm in equivalent circle diameter to an observation area when a surface is observed by electron backscatter diffraction analysis is 0.90 or less; and the ratio C1s/Cu2p of a peak area of C1s to a peak area of Cu2p on the surface by XPS analysis is 0.35 or less.2. The high-strength copper alloy plate excellent in oxide film adhesiveness according to claim 1 , the copper alloy plate further comprising Sn: 0.005-3% in mass %.3. The high-strength copper alloy plate excellent in oxide film adhesiveness according to or claim 1 , the copper alloy plate further comprising Zn: 0.005-3% in mass %.4. The high-strength copper alloy plate excellent in oxide film adhesiveness according to any one of to claim 1 , wherein: a tensile strength in the longitudinal direction of the copper alloy plate is 500 MPa or more; and a percentage elongation after fracture in the longitudinal direction is 5% or more.5. The high-strength copper alloy plate excellent in oxide film adhesiveness according to claim 1 , wherein the XPS analysis is carried out after alkali cathode electrolytic cleaning is applied.6. The high- ...

Cu-Ni-Si-BASED COPPER ALLOY PLATE HAVING EXCELLENT DEEP DRAWING WORKABILITY AND METHOD OF MANUFACTURING THE SAME

The Cu—Ni—Si-based copper alloy plate contains 1.0 mass % to 3.0 mass % of Ni, and Si at a concentration of ⅙ to ¼ of the mass % concentration of Ni with a remainder of Cu and inevitable impurities, in which, when the average value of the aspect ratio (the minor axis of crystal grains/the major axis of crystal grains) of each crystal grains in an alloy structure is 0.4 to 0.6, the average value of GOS in the all crystal grains is 1.2° to 1.5°, and the ratio (Lσ/L) of the total special grain boundary length Lσ of special grain boundaries to the total grain boundary length L of crystal grain boundaries is 60% to 70%, the spring bending elastic limit becomes 450 N/mmto 600 N/mm, the solder resistance to heat separation is favorable and deep drawing workability is excellent at 150° C. for 1000 hours. 1. A Cu—Ni—Si-based copper alloy plate comprising:1.0 mass % to 3.0 mass % of Ni;0.2 mass % to 0.8 mass % of Sn;0.3 mass % to 1.5 mass % of Zn;0.001 mass % to 0.2 mass % of Mg; andSi at a concentration of ⅙ to ¼ of a mass % concentration of Ni,with a remainder of Cu and inevitable impurities,{'sup': 2', '2, 'wherein, an average value of aspect ratios (a minor axis of crystal grains/a major axis of crystal grains) of each crystal grains in an alloy structure is 0.4 to 0.6, an average value of GOS in all crystal grains, which is measured through an EBSD method using a scanning electron microscope equipped with an electron backscatter diffraction image system, is 1.2° to 1.5°, wherein a boundary for which an orientation difference between adjacent pixels is 5° or more as a crystal grain boundary, by measuring orientations of all pixels in a measurement area range; and a ratio (Lσ/L) of a total special grain boundary length Lσ of special grain boundaries to a total grain boundary length L of crystal grain boundaries is 60% to 70%, a spring bending elastic limit becomes 450 N/mmto 600 N/mm, a solder resistance to heat separation is favorable and deep drawing workability is ...

BRASS ALLOY COMPRISING SILICON AND ARSENIC AND A METHOD OF MANUFACTURING THEREOF

An improved brass alloy providing improved ability for machining is detailed that is free of lead and is at the same time environmental friendly. The alloy comprises added alloying elements in an amount that is identified through an iterative process during manufacturing of the alloy. 1. A brass alloy comprising copper and zinc , characterized in that the brass alloy further comprises 0.5 to 2 wt % amount of silicon , at least one alloying element , wherein the wt % amount of the at least one alloying element is identified through an iterative process when producing the brass alloy , wherein the level of the wt % alloying element is identified as a level leaving no free amount of the alloying element in the brass alloy.2. The brass alloy according to claim 1 , wherein the amount of copper is in the range of 60 to 69 at wt % copper claim 1 , the amount of silicon is in the range of 0.5 to 2.0 wt % silicon claim 1 , the alloying element is arsenic added in the range of 0.005 to 0.015 wt % arsenic claim 1 , the remaining amount of wt % is zinc.3. The brass alloy according to claim 2 , wherein the alloying element is arsenic and phosphorus added respectively in the range of 0.005 to 0.015 wt % arsenic and 0.005 to 0.02 wt % phosphorus.4. A method for producing a brass alloy according to claim 1 , characterized in comprising steps of:a) using a clean oven by replacing used heat resistant stones with unused heat resistant stones,b) providing charge of the oven by adding wt % of material from a list of materials comprising Cu elektro, Zn 1020ZN, Cu/As 70/30 and Si,c) heating the oven,d) providing a sample casting of material while maintaining heating the oven,e) providing an analysis of the sample casting determining if chemistry of the sample casting is in accordance with expected properties,f) if step e) indicates any deviation further alloying elements are added to the hot oven and step e) and step f) is iteratively performed until the chemistry is in accordance with ...

Cooper-Zinc-Manganese Alloys with Silvery-White Finish for Coinage and Token Applications

Alloys of copper and manganese and copper, manganese and zinc can be used for the production of coins, such as the U.S. five cent piece or “nickel.” With appropriate platings, these alloys can match the electromagnetic signatures or electrical conductivity of currently circulated coins. This is important as modern vending machines include sensors which measure the conductivity of coins to ensure they are genuine. 1. An alloy comprising copper , zinc and manganese , said alloy having an IACS conductivity between about 5.0 and 9.3.2. The alloy of claim 1 , further comprising a white bronze plating applied over said alloy.3. The alloy of further comprising a nickel plating applied over said alloy.4. The alloy of claim 1 , comprising by weight claim 1 , about 30% zinc claim 1 , about 3% to 7% manganese claim 1 , less than 0.5% nickel and the balance copper.5. (canceled)6. (canceled)7. The alloy of wherein said IACS conductivity between about 5.0% and 9.3% extends over an electromagnetic sensor frequency range of about 240 kHz to 960 kHz.8. The alloy of comprising by weight claim 1 , about 30% zinc claim 1 , about 6% to 7% manganese claim 1 , less than 0.5% tin and the balance copper.9. (canceled)10. (canceled)11. The alloy of comprising by weight claim 1 , about 30% zinc claim 1 , about 6% to 7% manganese claim 1 , less than 0.5% tin claim 1 , less than 0.5% nickel and the balance copper.12. The alloy of further comprising a white bronze plating applied over said alloy and wherein said manganese comprises about 6.5% by weight of said alloy.13. The alloy of further comprising a nickel plating applied over said alloy.14. (canceled)15. An alloy comprising by weight claim 11 , about 30% zinc claim 11 , about 3-7% manganese claim 11 , less than 0.5% tin claim 11 , less than 0.5% nickel claim 11 , and the balance copper.16. The alloy of further comprising a white bronze plating applied over said alloy.17. The alloy of further comprising a nickel plating applied over said ...

LEACH-RESISTANT LEADED COPPER ALLOYS

Copper alloys exhibiting enhanced oxidation resistance are provided by adding an amount of sulfur that is effective to enhance oxidative resistance. Such sulfur addition can be achieved by combining elemental forms of copper and sulfur and heating the mixture to form a molten alloy, or by forming a sulfur-rich pre-mix that is added to a base alloy composition. Forming a pre-mix provides improved homogeneity and distribution of the sulfur predominantly in the form of a metal sulfide. 1. A copper alloy having an elemental composition comprising:at least 50% copper by weight;less than about 10% lead by weight; andan amount of sulfur that is effective to enhance oxidative resistance of lead within a copper alloy.2. An alloy according to claim 1 , wherein the sulfur is present in the copper alloy in the form of a lead sulfide.3. An alloy according to claim 1 , further comprising zinc.4. An alloy according to claim 3 , wherein the zinc is present in an amount from about 10% to about 45% by weight.5. An alloy according to claim 4 , wherein the zinc is present from about 10% to about 15%.6. An alloy according to claim 1 , wherein the lead is present in an amount from about 0.1% to about 0.25% by weight.7. An alloy according to claim 1 , wherein the lead is present in an amount from about 0.25% by weight to about 10% by weight.8. An alloy according to claim 1 , further comprising one or more additives selected from the group consisting of silicon claim 1 , selenium claim 1 , tellurium claim 1 , tin claim 1 , manganese claim 1 , bismuth claim 1 , antimony claim 1 , phosphorous claim 1 , iron claim 1 , nickel claim 1 , aluminum claim 1 , and arsenic claim 1 , each of the one or more additives present in an amount of from about 0.1% to about 6% by weight.9. An alloy according to claim 1 , in which the sulfur is present in an amount that is between about 0.006% and about 4% by weight.10. An alloy according to claim 1 , in which the sulfur is present in an amount of from about 2% ...

High temperature resistant silver coated substrates

A thin film of tin is plated directly on nickel coating a metal substrate followed by plating silver directly on the thin film of tin. The silver has good adhesion to the substrate even at high temperatures.

COPPER/ZINC ALLOYS HAVING LOW LEVELS OF LEAD AND GOOD MACHINABILITY

The free-cutting copper alloy according to the present invention contains a greatly reduced amount of lead in comparison with conventional free-cutting copper alloys, but provides industrially satisfactory machinability. The free-cutting alloys comprise 69 to 79 percent, by weight, of copper, 2.0 to 4.0 percent, by weight, of silicon, 0.02 to 0.4 percent, by weight, of lead, and the remaining percent, by weight, of zinc. 1. (canceled)2. (canceled)3. A free-cutting copper-silicon-zinc alloy , comprising: 69 to 79 percent , by weight , of copper; 2.0 to 4.0 percent , by weight , of silicon; 0.02 to 0.4 percent , by weight , of lead; one element selected from among 0.02 to 0.4 percent , by weight , of bismuth , 0.02 to 0.4 percent , by weight , of tellurium , and 0.02 to 0.4 percent , by weight , of selenium; and a remaining percentage , by weight , of zinc; (a) a matrix comprising an alpha phase, and', '(b) one or more phases selected from the group consisting of a gamma phase and a kappa phase; and, 'wherein the copper-silicon-zinc alloy includes'}wherein the one or more phases are formed in the matrix.4. A free-cutting copper-silicon-zinc alloy as recited in claim 3 , made by a process comprising the step of subjecting the alloy to a heat treatment for 30 minutes to 5 hours at 400 to 600° C. so the one or more phases are finely dispersed in the matrix.5. A free-cutting copper-silicon-zinc alloy claim 3 , comprising: 70 to 80 percent claim 3 , by weight claim 3 , of copper; 1.8 to 3.5 percent claim 3 , by weight claim 3 , of silicon; 0.02 to 0.4 percent claim 3 , by weight claim 3 , of lead; at least one element selected from among 0.3 to 3.5 percent claim 3 , by weight claim 3 , of tin claim 3 , 1.0 to 3.5 percent claim 3 , by weight claim 3 , of aluminum claim 3 , and 0.02 to 0.25 percent claim 3 , by weight claim 3 , of phosphorus; and a remaining percentage claim 3 , by weight claim 3 , of zinc; (a) a matrix comprising an alpha phase, and', '(b) one or more ...

ANTIMONY-MODIFIED LOW-LEAD COPPER ALLOY

Alloys and methods for forming alloys of copper, including red brass, and yellow brass, having sulfur and antimony. 1. A composition of matter comprising:a copper content of about 82% to about 89%;a sulfur content of about 0.01% to about 0.65%;an antimony content of about 0.1 to about 1.5%a tin content of about 2.0% to about 4.0%;a lead content of less than about 0.09%;a zinc content of about 5.0% to about 14.0%; anda nickel content of about 0.5% to about 2.0%2. The composition of matter of claim 1 , further comprising an antimony content of 0.1 to 1.0%.3. The composition of matter of claim 1 , wherein at least a portion of the sulfur and antimony are derived from stibnite.4. The composition of matter of claim 1 , wherein at least a portion of the sulfur and antimony are derived from 1% stibnite.5. The composition of claim 1 , further comprising about 0.3% titanium6. The composition of further comprising about 0.1% carbon.7. A composition of matter comprising about 58% to about 62% copper claim 1 , about 0.01% to about 0.65% sulfur claim 1 , greater than 0 to about 1.5% antimony claim 1 , about 1.5% tin claim 1 , less than about 0.09% lead claim 1 , about 31.0% to about 41.0% zinc claim 1 , and about 1.5% % nickel.8. The composition of matter of claim 7 , further comprising an antimony content of 0.1 to 1.0%.9. The composition of matter of claim 7 , wherein at least a portion of the sulfur and antimony are derived from stibnite.10. The composition of matter of claim 7 , wherein at least a portion of the sulfur and antimony are derived from 1% stibnite.11. The composition of claim 7 , further comprising about 0.1% titanium12. The composition of further comprising about 0.1% carbon.13. A composition of matter comprising about 58% to about 62% copper claim 7 , about 0.01% to about 0.65% sulfur claim 7 , greater than 0.1 to about 1.5% antimony claim 7 , less than about 0.09% lead claim 7 , and about 31.0% to about 41.0% zinc.14. The composition of matter of claim 1 , ...

Pressure resistant and corrosion resistant copper alloy, brazed structure, and method of manufacturing brazed structure

A pressure resistant and corrosion resistant copper alloy contains 73.0 mass % to 79.5 mass % of Cu and 2.5 mass % to 4.0 mass % of Si with a remainder composed of Zn and inevitable impurities, in which the content of Cu [Cu] mass % and the content of Si [Si] mass % have a relationship of 62.0≦[Cu]−3.6×[Si]≦67.5. In addition, the area fraction of the α phase “α”%, the area fraction of a β phase “β”%, the area fraction of a γ phase “γ”%, the area fraction of the κ phase “κ”%, and the area fraction of a μ phase “μ”% satisfy 30≦“α”≦84, 15≦“κ”≦68, “α”+“κ”≧92, 0.2≦“κ”/“α”≦2, “β”≦3, “μ”≦5, “β”+“μ”≦6, 0≦“γ”≦7, and 0≦“β”+“μ”+“γ”≦8. Also disclosed is a method of manufacturing a brazed structure made of the above pressure resistant and corrosion resistant copper alloy.

Copper-Zinc Alloy for a Valve Guide

A novel copper-zinc alloy is particularly suited for a valve guide. The copper-zinc alloy is formed of 59 to 73% copper, 3.1 to 8.3% manganese, 2 to 6% aluminum, 0.5 to 2% silicon, 0.2 to 1.2% iron, and the remainder zinc and inevitable impurities. 1. A valve guide formed of a copper-zinc alloy , the alloy consisting essentially of , in percent by weight:59 to 73% copper;3.1 to 4.0% manganese;2.1 to 2.5% aluminum;0.5 to 0.7% silicon;0.3 to 0.7% iron;0.7 to 1.0% nickel;a remainder zinc and impurities, said alloy formed into a valve guide.2. The valve guide of copper-zinc alloy according to claim 1 , wherein the alloy consists essentially of:59 to 65% copper; and3.1 to 3.5% manganese.3. The valve guide of wherein said alloy formed into a valve guide has a hot tensile strength at 350° C. of at least 200 N/mm.4. A valve guide formed of a copper-zinc alloy claim 1 , the alloy consisting essentially of claim 1 , in percent by weight:65 to 73% copper;7.6 to 7.9% manganese;5.0 to 5.5% aluminum;1.7 to 2.0% silicon;1.0 to 1.2% iron;a remainder zinc and impurities, said alloy formed into a valve guide.5. The valve guide according to further consisting of 0.6 to 1.0% lead.6. The valve guide according to wherein said copper is between 68 to 72%.7. The valve guide according to wherein said alloy formed into a valve guide has a hot tensile strength at 350° C. of at least 200 N/mm. This application is a continuation-in-part of U.S. patent application Ser. No. 11/809,575, filed Jun. 1, 2007, which is a continuation, under 35 U.S.C. §120, of copending International Application No. PCT/EP2005/012824, filed Dec. 1, 2005, which designated the United States; this application also claims the priority, under 35 U.S.C. §119, of German Patent Application No. DE 10 2004 058 318.8, filed Dec. 2, 2004; the prior applications are herewith incorporated by reference in their entirety.The invention relates to a copper-zinc alloy that is particularly suited for use in a valve guide.Copper-zinc ...

Copper alloy and process for producing copper alloy

To provide a copper alloy of the FCC structure containing Ni: 3.0 to 29.5 mass %, Al: 0.5 to 7.0 mass %, and Si: 0.1 to 1.5 mass %, with the remainder consisting of Cu and incidental impurities, wherein the copper alloy is of the high strength, but is excellent in workability, and has high electrical conductivity, and can control property thereof, by precipitating a γ′ phase of the L1 2 structure including Si at an average particle diameter of 100 nm or less in a parent phase of the copper alloy.

Copper alloy for electronic/electric device, copper alloy thin plate for electronic/electric device, method of producing copper alloy for electronic/electric device, conductive component for electronic/electric device and terminal

What is provided is a copper alloy for electronic/electric device comprising: in mass %, more than 2% and 36.5% or less of Zn; 0.1% or more and 0.9% or less of Sn; 0.05% or more and less than 1.0% of Ni; 0.001% or more and less than 0.10% of Fe; 0.005% or more and 0.10% or less of P; and the balance Cu and inevitable impurities, wherein a content ratio of Fe to Ni, Fe/Ni satisfies 0.002≦Fe/Ni<1.5, a content ratio of a sum of Ni and Fe, (Ni+Fe), to P satisfies 3<(Ni+Fe)/P<15, a content ratio of Sn to a sum of Ni and Fe, (Ni+Fe) satisfies 0.3<Sn/(Ni+Fe)<5, an average crystal grain diameter of α phase containing Cu, Zn, and Sn is in a range of 0.1 to 50 μm, and the copper alloy includes a precipitate containing P and one or more elements selected from Fe and Ni.

Cu-Ni-Si-BASED COPPER ALLOY SHEET HAVING EXCELLENT MOLD ABRASION RESISTANCE AND SHEAR WORKABILITY AND METHOD FOR MANUFACTURING SAME

A Cu—Ni—Si-based copper alloy sheet of the invention has excellent mold abrasion resistance and shear workability while maintaining strength and conductivity, in which 1.0 mass % to 4.0 mass % of Ni is contained, 0.2 mass % to 0.9 mass % of Si is contained, the remainder is made up of Cu and inevitable impurities. The number of the Ni—Si precipitate particles having a grain diameter in a range of 20 nm to 80 nm in a surface layer that is as thick as 20% of the entire sheet thickness from the surface is represented by a particles/mm, and the number of the Ni—Si precipitate particles having a grain diameter in a range of 20 nm to 80 nm in a portion below the surface layer is represented by b particles/mm, a/b is in a range of 0.5 to 1.5. 1. A Cu—Ni—Si-based copper alloy sheet having excellent mold abrasion resistance and shear workability , comprising:1.0 mass % to 4.0 mass % of Ni; and0.2 mass % to 0.9 mass % of Siwith a remainder made up of Cu and inevitable impurities,{'sup': 6', '2', '6', '2', '5', '2', '5', '2', '2', '2, 'wherein the number of Ni—Si precipitate particles having a grain diameter in a range of 20 nm to 80 nm on a surface is in a range of 1.5×10particles/mmto 5.0×10particles/mm, the number of Ni—Si precipitate particles having a grain diameter of greater than 100 nm on the surface is in a range of 0.5×10particles/mmto 4.0×10particles/mm, in a case in which the number of the Ni—Si precipitate particles having a grain diameter in a range of 20 nm to 80 nm in a surface layer that is as thick as 20% of the entire sheet thickness from the surface is represented by a particles/mm, and the number of the Ni—Si precipitate particles having a grain diameter in a range of 20 nm to 80 nm in a portion below the surface layer is represented by b particles/mm, a/b is in a range of 0.5 to 1.5, and the concentration of Si forming a solid solution in crystal grains in an area that is less than 10 μm thickness from the surface is in a range of 0.03 mass % to 0.4 mass ...

MATERIAL OBTAINED BY COMPACTION AND DENSIFICATION OF METALLIC POWDER(S)

The invention relates to a compacted and densified metal material comprising one or more phases formed of an agglomerate of grains, the cohesion of the material being provided by bridges formed between grains, said material having a relative density higher than or equal to 95% and preferably higher than or equal to 98%. 1: A compacted and densified metallic material comprising one or more phases formed of an agglomerate of grains , wherein cohesion of the material is provided by bridges formed between grains , said material having a relative density greater than or equal to 95% , the external surface of the grains having an irregular random shape comprising hollows and peaks.2: The material according to claim 1 , wherein the phase or phases comprise at least one element selected from the group consisting of Ni claim 1 , Cu claim 1 , Zn claim 1 , Ti claim 1 , Al claim 1 , Fe claim 1 , Cr claim 1 , Co claim 1 , V claim 1 , Zr claim 1 , Nb claim 1 , Mo claim 1 , Pd claim 1 , Ag claim 1 , Ta claim 1 , W claim 1 , Pt claim 1 , Au and alloys thereof.3: The material according to claim 1 , wherein the grains have different sizes and wherein the grain size distribution varies from 1 to at least 4.4: The material according to claim 1 , wherein the material comprises at least two phases and wherein a difference in grain size distribution between the at least two phases is at least a factor of 4.5: The material according to claim 1 , comprising three phases claim 1 , a first phase comprising nickel claim 1 , a second phase comprising bronze claim 1 , and a third phase comprising brass.6: The material according to claim 5 , wherein a mass fraction of the first phase is between 3 and 40% claim 5 , a mass fraction of the second phase is between 2 and 20% claim 5 , and a mass fraction of the third phase corresponds to a remaining percentage claim 5 , such that a total mass fraction of the first claim 5 , second and third phases sums to 100%.7: A component comprising a compacted and ...

COPPER-ZINC ALLOY AND USE THEREOF

A copper-zinc alloy contains 59.0 to 65.0% Cu, 2.5 to 4.0% Mn, 1.2 to 2.5% Al, 0.5 to 2.0% Si, 0.2 to 1.0% Fe, 0 to 1.0% Pb, 0 to 1.5% Ni, 0 to 0.2% Sn, balance Zn and unavoidable impurities. The zinc alloy has excellent temperature resistance and surfaces produced by machining have a considerably reduced surface roughness. 1. A copper-zinc alloy , comprising:59.0 to 65.0% wt. Cu;2.5 to 4.0% wt. Mn;1.2 to 2.5% wt. Al;0.5 to 2.0% wt. Si;0.2 to 1.0% wt. Fe;0 to 1.0% wt. Pb;0 to 1.5% wt. Ni;0 to 0.2% wt. Sn; andbalance Zn and unavoidable impurities.2. The copper-zinc alloy according to claim 1 , wherein:62.5 to 64.5% wt. of said Cu;2.7 to 3.5% wt. of said Mn;1.3 to 1.9% wt. of said Al;0.8 to 1.2% wt. of said Si;0.3 to 0.6% wt. of said Fe;0 to 1.0% wt. of said Pb;0 to 1.5% wt. of said Ni;0 to 0.2% wt. of said Sn; andbalance said Zn and said unavoidable impurities.3. The copper-zinc alloy according to claim 1 , wherein:63.0 to 64.0% wt. of said Cu;2.9 to 3.2% wt. of said Mn;1.4 to 1.9% wt. of said Al;0.8 to 1.2% wt. of said Si;0.3 to 0.6% wt. of said Fe;0 to 1.0% wt. of said Pb;0.5 to 0.7% wt. of said Ni;0 to 0.2% wt. of said Sn; andbalance said Zn and said unavoidable impurities.4. The copper-zinc alloy according to claim 1 , wherein the copper-zinc alloy has an electrical conductivity of more than 9.0 m/ohm mm.5. The copper-zinc alloy according to claim 1 , wherein cast state intermetallic compounds present in a microstructure have a size of not more than 150 μm.6. A bearing bushing claim 1 , comprising: 59.0 to 65.0% wt. Cu;', '2.5 to 4.0% wt. Mn;', '1.2 to 2.5% wt. Al;', '0.5 to 2.0% wt. Si;', '0.2 to 1.0% wt. Fe;', '0 to 1.0% wt. Pb;', '0 to 1.5% wt. Ni;', '0 to 0.2% wt. Sn; and', 'balance Zn and unavoidable impurities., 'a bearing bushing body, containing7. The bearing bush according to claim 6 , wherein the bearing bushing is a turbocharger bearing bushing. This application is a continuation, under 35 U.S.C. §120, of copending international application No. PCT/ ...

BONDING WIRE FOR SEMICONDUCTOR DEVICE

There is provided a bonding wire for a semiconductor device including a coating layer having Pd as a main component on a surface of a Cu alloy core material and a skin alloy layer containing Au and Pd on a surface of the coating layer, the bonding wire further improving 2nd bondability on a Pd-plated lead frame and achieving excellent ball bondability even in a high-humidity heating condition. The bonding wire for a semiconductor device including the coating layer having Pd as a main component on the surface of the Cu alloy core material and the skin alloy layer containing Au and Pd on the surface of the coating layer has a Cu concentration of 1 to 10 at % at an outermost surface thereof and has the core material containing either or both of Pd and Pt in a total amount of 0.1 to 3.0% by mass, thereby achieving improvement in the 2nd bondability and excellent ball bondability in the high-humidity heating condition. Furthermore, a maximum concentration of Au in the skin alloy layer is preferably 15 at % to 75 at %. 1. A bonding wire for a semiconductor device comprising:a core material having Cu as a main component and containing either or both of Pd and Pt in a total amount of 0.1 to 3.0% by mass;a coating layer having Pd as a main component provided on a surface of the core material; anda skin alloy layer containing Au and Pd provided on a surface of the coating layer,wherein a concentration of Cu at an outermost surface of the wire is 1 at % or more.2. The bonding wire for a semiconductor device according to claim 1 , whereinthe coating layer having Pd as a main component has a thickness of 20 to 90 nm, andthe skin alloy layer containing Au and Pd has a thickness of 0.5 to 40 nm and has a maximum concentration of Au of 15 to 75 at %.3. The bonding wire for a semiconductor device according to claim 1 , whereinthe core material further contains either or both of Au and Ni, andthe total amount of Pd, Pt, Au and Ni in the core material is more than 0.1% by mass and 3.0 ...

Electrode Wire for Electric Discharge Machining and Method for Manufacturing the Electrode Wire

A method for manufacturing an electrode wire () includes melting and mixing copper with a content of 60% by weight and zinc with a content of 40% by weight to form a copper/zinc binary eutectic, heat solidifying the copper/zinc binary eutectic to form a full beta (β) phase alloy (), galvanizing the full beta (β) phase alloy, processing the full beta (β) phase alloy by a low-temperature heat treatment, prolonging the treating time of the low-temperature heat treatment to form a surface electric layer, and heat solidifying the surface electric layer to form a solid alloy layer () on the surface of the full beta (β) phase alloy and to let the solid alloy layer form a gamma (γ) phase, an epsilon (ε) phase or an eta (η) phase at different reaction temperatures. Thus, the electrode wire only needs one working procedure. 1. A method for manufacturing an electrode wire , comprising:a first step of melting and mixing a copper with a content of 60% by weight and a zinc with a content of 40% by weight to form a copper/zinc binary eutectic which is disposed at a liquid phase;a second step of heat solidifying the copper/zinc binary eutectic to solidify the copper/zinc binary eutectic from the liquid phase into a full beta (β) phase alloy which is disposed at a solid solution phase;a third step of galvanizing the full beta (β) phase alloy which functions as a metallic core;a fourth step of processing the metallic core of the full beta (β) phase alloy by a low-temperature heat treatment to form a coating layer on a surface of the full beta (β) phase alloy;a fifth step of prolonging a treating time of the low-temperature heat treatment to let the surface of the full beta (β) phase alloy and the coating layer produce a mutual solution to form a surface electric layer; anda sixth step of heat solidifying the surface electric layer to form a solid alloy layer on the surface of the full beta (β) phase alloy and to let the solid alloy layer form a gamma (γ) phase, an epsilon (ε) phase ...

PIPING ARTICLES INCORPORATING AN ALLOY OF COPPER, ZINC, AND SILICON

A piping component that includes (i) a piping body with an open end; and (ii) an alloy comprising (by weight percentage) 12% to 16.5% zinc, 0.265% to 1.6% silicon and sufficient copper so that the sum of the weight percentages of the zinc, silicon, and copper in the alloy is at least 99.7%. The alloy exhibits an elongation that is within a range of 60% to 70%. Additionally discloses is a piping component including (i) a piping body with an open end; and (ii) a cold worked alloy comprising (by weight percentage) 12% to 16.5% zinc, 0.265% to 1.8% silicon and sufficient copper so that the sum of the weight percentages of the zinc, silicon, and copper in the alloy is at least 99.7%. In embodiments, the weight percentage of the silicon in the alloys disclosed can be 0.5% to 1.6%, 0.5% to 1.8%, or 0.5% to 2.0%. 1. A piping component comprising:a piping body with an open end; anda cold worked alloy comprising (by weight percentage) 12% to 16.5% zinc, 0.265% to 1.8% silicon and sufficient copper so that the sum of the weight percentages of the zinc, silicon, and copper in the alloy is at least 99.7%.2. The piping component of claim 1 , whereinthe open end is joined to another piping component via welding, soldering, or brazing.3. The piping component of claim 1 , whereinthe open end is joined to another piping component via compression, press, push, or slip connection.4. The piping component of claim 1 , wherein an ultimate tensile strength within a range of 340 MPa to 550 MPa;', 'a yield strength within a range of 275 MPa to 480 MPa; and', 'an elongation within a range of 20% to 30%., 'the cold worked alloy exhibits5. The piping component of claim 1 , wherein an ultimate tensile strength within a range of 550 MPa to 750 MPa;', 'a yield strength within a range of 480 MPa to 655 MPa; and', 'an elongation within a range of 12% to 20%., 'the cold worked alloy exhibits6. The piping article of claim 1 , wherein an ultimate tensile strength within a range of 750 MPa to 900 MPa;', ...

High Tensile Brass Alloy and High Tensile Brass Alloy Product

The present disclosure relates to a high-tensile brass alloy containing 55-65 wt-% copper; 1-2.5 wt-% manganese; 0.7-2 wt % tin; 0.2-1.5 wt % iron; 2-4 wt % nitrogen; 2-5 wt % aluminum; 0.2-2 wt % silicon; 2.0 wt % cobalt maximum; and the remainder zinc together with unavoidable impurities, wherein the sum of the elements manganese and tin is at least 1.7 wt % and at most 4.5 wt. 115-. (canceled)16. A high-tensile brass alloy comprising55-65 wt % Cu;1-2.5 wt % Mn;0.7-2 wt % Sn;0.2-1.5 wt % Fe;2-4 wt % Ni;2-5 wt % Al;0.2-2 wt % Si;2.0 wt % Co maximum;0.1 wt % PB maximum;and the remainder Zn together with unavoidable impurities,wherein the sum of the elements Mn and Sn is at least 1.7 wt % and is at most 4.5 wt %.17. The high-tensile brass alloy of claim 16 , wherein the elements Mn and Sn are present in the alloy in a Mn to Sn ratio between 1.25 and 0.85.18. The high-tensile brass alloy of claim 17 , wherein the ratio of the elements Mn to Sn is between 1.1 and 0.92.19. The high-tensile brass alloy of claim 16 , comprising59-65 wt % Cu;1.3-1.65 wt % Mn;1.3-1.65 wt % Sn;0.5-1.0 wt % Fe;2.4-3.4 wt % Ni;3.1-4.1 wt % Al;1.0-1.7 wt % Si;2.0 wt % Co maximum;and the remainder Zn together with unavoidable impurities.20. The high-tensile brass alloy of claim 18 , comprising59-65 wt % Cu;1.3-1.65 wt % Mn;1.3-1.65 wt % Sn;0.5-1.0 wt % Fe;2.4-3.4 wt % Ni;3.1-4.1 wt % Al;1.0-1.7 wt % Si;2.0 wt % Co maximum;and the remainder Zn together with unavoidable impurities.21. The high-tensile brass alloy of claim 19 , comprising59-62 wt % Cu;1.3-1.65 wt % Mn;1.3-1.65 wt % Sn;0.5-1.0 wt % Fe;2.4-3.4 wt % Ni;3.1-4.1 wt % Al;1.0-1.7 wt % Si;and the remainder Zn together with unavoidable impurities.22. The high-tensile brass alloy of claim 19 , wherein the Co content is 0.9-1.6 wt % claim 19 , in particular 0.9-1.5 wt % claim 19 , particularly preferably 0.9 1.1 wt %.23. A high-tensile brass alloy product manufactured from a high-tensile brass alloy of claim 16 , wherein the high-tensile ...

Rectangular rolled copper foil, flexible flat cable, rotary connector, and method of manufacturing rectangular rolled copper foil

A rectangular rolled copper foil includes copper or a copper alloy having a 0.2% yield strength of greater than or equal to 250 MPa. In a cross section perpendicular to a rolling direction, an area ratio of crystal grains oriented at a deviation angle of less than or equal to 12.5° from a Cube orientation is greater than or equal to 8%.

METHOD FOR PRODUCING Nb3Sn SUPERCONDUCTING WIRE, PRECURSOR FOR Nb3Sn SUPERCONDUCTING WIRE, AND Nb3Sn SUPERCONDUCTING WIRE USING SAME

In the production of an internal-tin-processed NbSn superconducting wire, the present invention provides a NbSn superconducting wire that is abundant in functionality, such as, the promotion of formation of a NbSn layer, the mechanical strength of the superconducting filament (and an increase in interface resistance), the higher critical temperature (magnetic field), and the grain size reduction, and a method for producing it. A method for producing a NbSn superconducting wire according to an embodiment of the present invention includes a step of providing a bar that has a Sn insertion hole provided in a central portion of the bar and a plurality of Nb insertion holes provided discretely along an outer peripheral surface of the Sn insertion hole , and that has an alloy composition being Cu-xZn-yM (x: 0.1 to 40 mass %, M=Ge, Ga, Mg, or Al, provided that, for Mg, x: 0 to 40 mass %), a step of mounting an alloy bar with an alloy composition of Sn-zQ (Q=Ti, Zr, or Hf) into the Sn insertion hole and inserting Nb cores into the Nb insertion holes , a step of subjecting the bar to diameter reduction processing to fabricate a Cu-xZn-yM/Nb/Sn-zQ composite multicore wire with a prescribed outer diameter, and a step of subjecting the composite multicore wire to NbSn phase generation heat treatment. 1. A method for producing a NbSn superconducting wire comprising: Cu-xZn-yGe (x: 0.1 to 40 mass %, y: 0.1 to 12 mass %),', 'Cu-xZn-yGa (x: 0.1 to 40 mass %, y: 0.1 to 21 mass %),', 'Cu-xZn-yMg (x: 0 to 40 mass %, y: 0.01 to 3 mass %), or', 'Cu-xZn-yAl (x: 0.1 to 40 mass %, y: 0.01 to 0.85 mass %);, 'a step of providing a bar, wherein the bar has a Sn insertion hole provided in a central portion of the bar and a plurality of Nb insertion holes provided discretely along an outer peripheral surface of the Sn insertion hole, and wherein the bar has an alloy composition being Cu-xZn-yM (M=Ge, Ga, Mg, or Al), and composition ratios x and y mass % are as follows in accordance with a kind ...

COPPER-BASED ALLOYS AND THEIR USE FOR INFILTRATION OF POWDER METAL PARTS

Described are wrought forms of copper alloys for infiltrating powder metal parts, the method for preparing the copper alloys and their wrought forms, the method for their infiltration into a powder metal part, and the infiltrated metal part infiltrated with the novel alloys having a generally uniform distribution of copper throughout and exhibiting high transverse rupture strength, tensile strength and yield strength. Infiltrated metal parts prepared by infiltrating powder metal parts with reduced amounts of the novel infiltrant typically weigh less and have superior strengths compared to similarly prepared infiltrated metal parts prepared with standard methods and conventional infiltration. 1. A method for infiltrating a powder metal part , the method comprising: a) providing the powder metal part; b) providing a copper alloy having a homogeneous wrought form adapted to contact a surface of the powder metal part , c) contacting the alloy with a surface of the powder metal part; and d) heating the alloy and the powder metal part to a temperature sufficient to cause the alloy to melt and infiltrate the powder metal part , wherein the alloy comprises: (i) at least about 85 weight % copper; and ii) about 0.5 to about 3.5 weight % iron.2. The method of claim 1 , wherein the alloy contains at least about 90 weight % copper.3. The method of claim 1 , wherein the powder metal part is an iron-based powder metal part.4. The method of claim 3 , wherein the powder metal part is a sintered metal part.5. The method of claim 1 , wherein the surface of the powder metal part is an upper surface.6. The method of claim 1 , wherein the temperature is at least about 800° C.7. The method of claim 1 , wherein the homogeneous wrought form is a wire segment.8. The method of claim 7 , wherein the wire segment has a generally torus shaped form.9. The method of claim 1 , wherein the homogeneous wrought form is a disk.10. The method of claim 1 , wherein the homogeneous wrought form is a washer ...

FREE-CUTTING COPPER ALLOY AND METHOD FOR PRODUCING FREE-CUTTING COPPER ALLOY

This free-cutting copper alloy contains Cu: 58.5 to 63.5%, Si: more than 0.4% and 1.0% or less, Pb: 0.003 to 0.25%, and P: 0.005 to 0.19%, with the remainder being Zn and inevitable impurities, a total amount of Fe, Mn, Co and Cr is less than 0.40%, a total amount of Sn and Al is less than 0.40%, a relationship of 56.3≤f1=[Cu]−4.7×[Si]+0.5×[Pb]−0.5×[P]≤59.3 is satisfied, constituent phases of a metal structure have relationships of 20≤(α)≤75, 25≤(β)≤80, 0≤(γ)<2, 20≤(γ)×3+(β)×(−0.5×([Si])+1.5×[Si])≤78, and 33≤(γ)×3+(β)×(−0.5×([Si])+1.5×[Si])+([Pb])×33+([P])×14, and a compound including P is present in β phase. 1. A free-cutting copper alloy comprising:higher than or equal to 58.5 mass % and lower than or equal to 63.5 mass % of Cu;higher than 0.4 mass % and lower than or equal to 1.0 mass % of Si;higher than or equal to 0.003 mass % and lower than or equal to 0.25 mass % of Pb; andhigher than or equal to 0.005 mass % and lower than or equal to 0.19 mass % of P,with the balance being Zn and inevitable impurities,wherein, among the inevitable impurities, a total content of Fe, Mn, Co, and Cr is lower than 0.40 mass % and a total content of Sn and Al is lower than 0.40 mass %, {'br': None, 'i': '≤f', '56.31=[Cu]−4.7×[Si]+0.5×[Pb]−0.5×[P]≤59.3'}, 'when a Cu content is represented by [Cu] mass %, a Si content is represented by [Si] mass %, a Pb content is represented by [Pb] mass %, and a P content is represented by [P] mass %, a relationship of'}is satisfied, [{'br': None, '20≤(α)≤75,'}, {'br': None, '25≤(β)≤80,'}, {'br': None, '0≤(γ)<2,'}, {'br': None, 'sup': 1/2', '2, '20≤(γ)×3+(β)×(−0.5×([Si])+1.5×[Si])≤78, and'}, {'br': None, 'sup': 1/2', '2', '1/2', '1/2, '33≤(γ)×3+(β)×(−0.5×([Si])+1.5×[Si])+([Pb])×33+([P])×14'}], 'in constituent phases of a metallographic structure excluding non-metallic inclusions, among 10 metallic phases consisting of α phase, β phase, γ phase, δ phase, ε phase, ζ phase, η phase, κ phase, μ phase, and χ phase, when an area ratio of α phase is ...

Copper alloy tube for heat exchanger with excellent thermal conductivity and breaking strength and method of manufacturing the same

The present disclosure relates to a copper alloy tube for a heat exchanger having excellent breaking strength and a method of manufacturing the same, and more particularly, to a Cu alloy tube having excellent breaking strength and thermal conductivity and suitable for use in a heat exchanger, and a method of manufacturing the same.

Lubricant-Compatible Copper Alloy

A copper alloy having a high corrosion resistance for a wide range of different lubricants, in particular different base oils and a variation of lubricant additives. The property of a low corrosion tendency for different tribological systems is also combined with good mechanical properties, and a high strength in particular. The alloy has a low wear and coefficient of friction. The lubricant-compatible copper alloy is suitable for producing components that come in contact with lubricant and are exposed to friction stresses, such as gear components, for example synchronizer rings. A method for manufacturing such components and a gear having at least one such component is also disclosed. 2. The component of claim 1 , further comprising 3.0-5.0% aluminum claim 1 , 0.5-1.5% iron and ≤0.7% tin by weight.3. The component of claim 1 , further comprising 56-60% copper claim 1 , 3.0-4.0% aluminum claim 1 , 1.3-2.5% silicon claim 1 , 3.0-4.0% nickel claim 1 , 0.5-1.5% iron claim 1 , 0.1-1.5% manganese and 0.3-0.7% tin by weight.4. The component of claim 1 , further comprising 59-62% copper claim 1 , 3.5-4.5% aluminum claim 1 , 1.2-1.8% silicon claim 1 , 2.5-3.9% nickel claim 1 , 0.7-1.1% iron claim 1 , 0.7-1.0% manganese and 0.05-0.5% tin by weight.5. The component of claim 1 , wherein the amount of free silicon is at least 0.65% by weight.6. The component of claim 1 , wherein the weight ratio between zinc and free silicon is selected to be in the range of 20 to 55.7. The component of claim 1 , wherein the amount of aluminum exceeds the stoichiometric ratio of the sum of the iron claim 1 , manganese claim 1 , nickel and chromium amounts.8. The component of claim 1 , wherein a ratio of the sum of the elements Ni+Fe+Mn to Si is ≤3.45 and ≥0.7.9. The component of claim 8 , wherein the ratio is ≤3.25 and ≥0.7.10. The component of claim 1 , further comprising a reaction layer on an outer surface of the component with free silicon present as a reactive element in the alloy matrix ...

WIRE ELECTRODE FOR THE SPARK-EROSIVE CUTTING OF ARTICLES

The invention relates to a wire electrode () for the spark-erosive cutting of articles, comprising and electrically conductive core () and a jacket () surrounding the core (), which jacket comprises at least on α+β-cover layer () that contains β-brass and/or β′-brass. In order to provide a wire electrode that has improved cutting efficiency, according to the invention, the α+β-cover layer () forms a homogenous phase () of β-brass and/or β′-brass in α+β-brass grains () having an α+β-phase and/or a α+β′-phase are embedded. 1. A wire electrode for spark erosive cutting of articles , comprising ,an electrically conducting core with a core-surrounding casing, said casing is provided which at least an α+β-casing layer containing one or more of the elements selected from the group consisting of β brass, β′ brass and α+β-brass, wherein the α+β-casing layer is provided with a homogenous phase from β-brass and/or forms β′-brass, into which α+β-brass grains are embedded, said α+β-brass grains exhibit an α+β and/or a α+β-phase.2. The wire electrode according to claim 1 , wherein the wire electrode has a cross section of circular shape claim 1 , and wherein the α+β-brass grains are configured elongated and predominantly oriented in radial direction.3. The wire electrode according to claim 1 , wherein the α+β-casing layer is the outermost casing layer.4. The wire electrode according to claim 3 , wherein the core-surrounding casing consists entirely from the α+β-casing layer.5. The wire electrode according to claim 1 , wherein the core-surrounding casing has a γ-casing layer which predominantly consists of γ-brass.612. The wire electrode according to claim 5 , wherein the γ-casing layer () consists entirely of γ-brass.712. The wire electrode according to claim 5 , wherein the γ-casing layer () is the outermost casing layer.8. The wire electrode according to claim 1 , wherein the core at least in its outer core layer bordering core-surrounding casing consists of copper or a brass ...

LOW SILICON COPPER ALLOY PIPING COMPONENTS AND ARTICLES

A piping article is provided that comprises a piping component comprising a piping body with an open end. The piping component is formed of an alloy comprising from about 12% to about 16% zinc, from about 0.5% to about 2.0% silicon, and a balance of copper (by weight). The alloy comprises an ultimate tensile strength of from about 200 N/mmto about 300 N/mm, a yield strength of from about 75 N/mmto about 225 N/mm, and an elongation of from about 15% to about 60%. 1. A piping article , comprising:a piping component comprising a piping body with an open end,wherein the piping component is formed of an alloy comprising from about 12% to about 16% zinc, from about 0.5% to about 1.8% silicon, and a balance of copper (by weight), and{'sup': 2', '2', '2', '2, 'further wherein the alloy comprises an ultimate tensile strength of from about 200 N/mmto about 300 N/mm, a yield strength of from about 75 N/mmto about 225 N/mm, and an elongation of from about 15% to about 60%.'}2. The piping article of claim 1 , wherein the alloy further comprises from 0.05% to 0.2% iron (by weight).3. The piping article of claim 1 , wherein the alloy further comprises from 0.03% to 0.09% phosphorous (by weight).4. The piping article of claim 1 , wherein the alloy further comprises from 0.03% to 0.09% arsenic (by weight).5. The piping article of claim 1 , wherein the alloy further comprises from 0.03% to 0.09% antimony (by weight).6. The piping article of claim 1 , wherein the alloy further comprises a minimum of 80% copper (by weight).7. The piping article of claim 1 , wherein the alloy further comprises a maximum of 0.09% lead (by weight).8. The piping article of claim 1 , wherein the alloy comprises from 82% to 88% copper claim 1 , from 12% to 16% zinc claim 1 , from 0.5% to 1% silicon claim 1 , up to 0.2% iron claim 1 , and up to 0.08% phosphorous (by weight).9. The piping article of claim 1 , wherein the alloy further comprises a thermal conductivity claim 1 , k claim 1 , of from about 30 W/m· ...

LEAD-FREE BRASS ALLOY FOR HOT WORKING

Provided is a lead-free brass alloy for hot working provided with good hot-working properties and mechanical characteristics. A lead-free brass alloy for hot working, comprising: 28.0 to 35.0 wt % zinc, 0.5 to 2.0 wt % silicon, 0.5 to 1.5 wt % tin, 0.5 to 1.5 wt % bismuth, 0.10 wt % or less lead, and the remainder being copper and unavoidable impurities, the zinc equivalent being in a range of 40.0 to 43.0, and the area ratio of the κ phase after hot working being 20% or less. 1. A lead-free brass alloy for hot working , characterized in comprising: 28.0 to 35.0 wt % zinc , 0.5 to 2.0 wt % silicon , 0.5 to 1.5 wt % tin , 0.5 to 1.5 wt % bismuth , 0.10 wt % or less lead , and the remainder being copper and unavoidable impurities , the zinc equivalent being in a range of 40.0 to 43.0 , and the area ratio of the κ phase after hot working being 20% or less.2. The lead-free brass alloy for hot working according to claim 1 , characterized in that elongation is 10% or more. The present invention relates to a lead-free brass alloy for hot working, having excellent resistance to dezincification and resistance to erosion and corrosion, and having good hot-working properties and mechanical characteristics.Bronze, brass, and other copper alloys have conventionally been used in faucet parts for water supply, water contact parts for general piping, and in various valves in order to make use the excellent material characteristics of such alloys. These copper alloys require good machinability for working a product, and therefore lead has generally been included to thereby impart the required machinability. For example, JIS H5120 CAC406, CAC407, and other bronze alloys, and JIS H3250 C3604, C3771, and other brass alloys having excellent machinability contain 1 to 6 wt % of lead.However, lead evaporates in the alloy melting and casting process, elutes into drinking water when used as a water contact part, and has other drawbacks. There is a deepening awareness that lead is a toxic ...

SILVER-WHITE COPPER ALLOY AND METHOD OF PRODUCING SILVER-WHITE COPPER ALLOY

Provided are a silver-white copper alloy which has superior mechanical properties such as hot workability, cold workability, or press property, color fastness, bactericidal and antibacterial properties, and Ni allergy resistance; and a method of producing such a silver-white copper alloy. The silver-white copper alloy includes 51.0 mass % to 58.0 mass % of Cu; 9.0 mass % to 12.5 mass % of Ni; 0.0003 mass % to 0.010 mass % of C; 0.0005 mass % to 0.030 mass % of Pb; and the balance of Zn and inevitable impurities, in which a relationship of 65.5≦[Cu]+1.2×[Ni]≦70.0 is satisfied between a content of Cu [Cu] (mass %) and a content of Ni [Ni] (mass %). In a metal structure thereof, an area ratio of β phases dispersed in an α-phase matrix is 0% to 0.9%. 1. A silver-white copper alloy comprising:51.0 mass % to 58.0 mass % of Cu;9.0 mass % to 12.5 mass % of Ni;0.0003 mass % to 0.010 mass % of C;0.0005 mass % to 0.030 mass % of Pb; andthe balance of Zn and inevitable impurities,wherein a relationship of 65.5≦[Cu]+1.2×[Ni]≦70.0 is satisfied between a content of Cu [Cu] (mass %) and a content of Ni [Ni] (mass %), andin a metal structure thereof, an area ratio of β phases dispersed in an α-phase matrix is 0% to 0.9%.2. A silver-white copper alloy comprising:51.0 mass % to 58.0 mass % of Cu;9.0 mass % to 12.5 mass % of Ni;0.05 mass % to 1.9 mass % of Mn;0.0003 mass % to 0.010 mass % of C;0.0005 mass % to 0.030 mass % of Pb; andthe balance of Zn and inevitable impurities,wherein a relationship of 65.5≦[Cu]+1.2×[Ni]+0.4×[Mn]≦70.0 is satisfied between a content of Cu [Cu] (mass %), a content of Ni [Ni] (mass %), and a content of Mn [Mn] (mass %), andin a metal structure thereof, an area ratio of β phases dispersed in an α-phase matrix is 0% to 0.9%.3. A silver-white copper alloy comprising:51.5 mass % to 57.0 mass % of Cu;10.0 mass % to 12.0 mass % of Ni;0.05 mass % to 0.9 mass % of Mn;0.0005 mass % to 0.008 mass % of C;0.001 mass % to 0.009 mass % of Pb; andthe balance of Zn and ...

Low Silver, Low Nickel Brazing Material

A homogenous brazing material essentially consisting of relatively low amounts of silver and nickel together with copper, zinc, and other constituents is provided. The brazing material has a working temperature exceeding 630° F. and is preferably between about 1250° F. and 1500° F. The brazing material preferably has about 30 percent by weight of silver, about 36 percent by weight of copper, about 32 percent by weight of zinc, and about 2 percent by weight of nickel. The addition of nickel in the above-specified amount improves resistance against interface corrosion in aqueous solutions, aids in the strength of the alloy, and provides improved wettability on ferrous and non-ferrous substrates. The brazing material may also include a flux, such as a core or a coating. 1. A brazing material consisting essentially ofless than approximately 35 percent by weight of silver;less than approximately 40 percent by weight of copper;more than 18 percent by weight of zinc; andfrom approximately 1.75 percent by weight to approximately 2.25 percent by weight of nickel.2. The material of having silver in an amount less than 32 percent by weight of silver.3. The material of having silver in an amount less than 31 percent by weight of silver.4. The material of having from approximately 29 percent by weight to approximately 31 percent by weight of silver.5. The material of having from approximately 31 percent by weight to approximately 40 percent by weight of zinc.6. The material of having copper in an amount less than 38 percent by weight.7. The material of having copper in an amount less than approximately 37 percent by weight.8. The material of having from approximately 35 percent by W eight to approximately 37 percent by weight of copper.9. The material of having a working temperature greater than approximately 630° F.10. The material of having a working temperature of between 1250° F. and 1450° F.11. The material of in the form of at least one of a strip claim 1 , a wire claim 1 ...

COPPER-ZINC-NICKEL-MANGANESE ALLOY

A copper alloy having the following composition (in % by weight) Zn: 17 to 20.5%, Ni: 17 to 23%, Mn: 8 to 11.5%, optionally up to 4% Cr, optionally up to 5.5% Fe, optionally up to 0.5% Ti, optionally up to 0.15% B, optionally up to 0.1% Ca, optionally up to 1.0% Pb, balance copper and unavoidable impurities, wherein the proportion of copper is at least 45% by weight. Further, the ratio of the proportion of Ni to the proportion of Mn is at least 1.7 and the alloy has a microstructure which has inclusions of MnNi and MnNh precipitates. 1. A copper alloy having the following composition (in % by weight):Zn: from 17 to 20.5%,Ni: from 17 to 23%,Mn: from 8 to 11.5%,optionally up to 4% of Cr,optionally up to 5.5% of Fe,optionally up to 0.5% of Ti,optionally up to 0.15% of B,optionally up to 0.1% of Ca,optionally up to 1.0% of Pb,{'sub': '2', 'balance copper and unavoidable impurities, wherein the proportion of copper is at least 45% by weight, the ratio of the proportion of Ni to the proportion of Mn is at least 1.7 and the alloy has a microstructure in which precipitates of the type MnNi and MnNiare embedded.'}2. The copper alloy as claimed in claim 1 , wherein the ratio of the proportion of Ni to the proportion of Mn is not more than 2.3.3. The copper alloy as claimed in or claim 1 , wherein the ratio of the proportion of Ni to the proportion of Mn is at least 1.8.4. The copper alloy as claimed in claim 1 , wherein the proportion of Zn is not more than 19.5% by weight.5. The copper alloy as claimed in claim 1 , wherein the alloy has a microstructure comprising an α-phase matrix having a proportion of β-phase embedded therein of not more than 2% by volume and the precipitates of the type MnNi and MnNiare embedded in the α-phase matrix.6. The copper alloy as claimed in claim 5 , wherein the α-phase matrix of the microstructure is free of β-phase.7. The copper alloy as claimed in claim 3 , wherein the ratio of the proportion of Ni to the proportion of Mn is at least 1.9. ...

Refill for a ball-point pen and use thereof

The invention relates to a refill for a ball-point pen, comprising an ink cartridge and a ball, said ball being arranged in a writing tip provided at the front end of the ink cartridge, wherein at least the writing tip of the ink cartridge consists of a copper-zinc alloy of the following composition (wt. %): 28.0 to 36.0% Zn, 0.5 to 1.5% Si, 1.5 to 2.5% Mn, 0.2 to 1.0% Ni, 0.5 to 1.5% Al, 0.1 to 1.0% Fe, optionally also up to a maximum of 0.1% Pb, optionally also up to a maximum of 0.2% Sn, optionally also up to a maximum of 0.1% P, optionally also up to a maximum of 0.08% S, the rest being Cu and inevitable impurities, with mixed silicides containing iron, nickel and manganese being embedded in the matrix.

ELECTRIC AND ELECTRONIC PART COPPER ALLOY SHEET WITH EXCELLENT BENDING WORKABILITY AND STRESS RELAXATION RESISTANCE

An electric and electronic part copper alloy sheet with excellent bending workability and stress relaxation resistance is made from a copper alloy containing 1.5 to 4.0 percent by mass of Ni, Si satisfying a Ni/Si mass ratio of 4.0 to 5.0, 0.01 to 1.3 percent by mass of Sn, and the remainder composed of copper and incidental impurities, wherein the average crystal grain size is 5 to 20 μm, the standard deviation of the crystal grain size satisfies 2σ<10 μm, and the proportion of the number of particles having a particle diameter of 90 to 300 nm in Ni—Si dispersed particles having a particle diameter of 30 to 300 nm is 20% or more, where the particles are observed in a cross-section defined by a direction perpendicular to a sheet surface and a direction parallel to a rolling direction. 1. An electric and electronic part copper alloy sheet with excellent bending workability and stress relaxation resistance , made from a copper alloy comprising:1.5 to 4.0 percent by mass of Ni;Si satisfying a Ni/Si mass ratio of 4.0 to 5.0;0.01 to 1.3 percent by mass of Sn; andthe remainder composed of copper and incidental impurities,wherein the average crystal grain size is 5 to 20 μm,the standard deviation of the crystal grain size satisfies 2σ<10 μm, andthe proportion of the number of particles having a particle diameter of 90 to 300 nm in Ni—Si dispersed particles having a particle diameter of 30 to 300 nm is 20% or more, where the particles are observed in a cross-section defined by a direction perpendicular to a sheet surface and a direction parallel to a rolling direction.2. The electric and electronic part copper alloy sheet with excellent bending workability and stress relaxation resistance claim 1 , according to claim 1 , wherein the proportion of the number of particles having a particle diameter of 120 to 300 nm in Ni—Si dispersed particles having a particle diameter of 30 to 300 nm is 30% or more claim 1 , where the particles are observed in the cross-section.3. The ...

COPPER-NICKEL-ZINC ALLOY CONTAINING SILICON

The invention includes a copper-nickel-zinc alloy with the following composition in weight %: Cu 47.0 to 49.0%, Ni 8.0 to 10.0%, Mn 0.2 to 0.6%, Si 0.05 to 0.4%, Pb 1.0 to 1.5%, Fe and/or Co up to 0.8%, the rest being Zn and unavoidable impurities, wherein the total of the Fe content and double the Co content is at least 0.1 weight % and wherein mixing silicides containing nickel, iron and manganese and/or containing nickel, cobalt and manganese are stored as spherical or ellipsoidal particles in a structure consisting of an α- and β-phase. The invention further relates to a method for producing semi-finished products from a copper-nickel-zinc alloy. 1. A copper-nickel-zinc alloy having the following composition [in % by weight]:Cu 47.0 to 49.0%,Ni 8.0 to 10.0%,Mn 0.2 to 0.6%,Si 0.05 to 0.4%,Pb 1.0 to 1.5%,Fe and/or Co up to 0.8%,remainder Zn and unavoidable impurities, wherein the sum total of the Fe content and twice the Co content is at least 0.1%, and wherein mixed silicides containing nickel, iron and manganese and/or mixed silicides containing nickel, cobalt and manganese are incorporated as spherical or ellipsoidal particles in a microstructure consisting of α and β phase.2. The copper-nickel-zinc alloy as claimed in claim 1 , characterized in that either the Fe content or the Co content is at least 0.1% by weight.3. The copper-nickel-zinc alloy as claimed in claim 1 , characterized in that the sum total of the Fe content and eight times the Co content is at least 0.4% by weight.4. The copper-nickel-zinc alloy as claimed in having the following composition [in % by weight]:Cu 47.0 to 49.0%,Ni 8.0 to 10.0%,Mn 0.2 to 0.6%,Si 0.05 to 0.4%,Pb 1.0 to 1.5%,Fe 0.2 to 0.8%,remainder Zn and unavoidable impurities,optionally up to 0.8% Co,wherein mixed silicides containing nickel, iron and manganese are incorporated as spherical or ellipsoidal particles in a microstructure consisting of α and β phase.5. The copper-nickel-zinc alloy as claimed in having the following ...

COPPER/ZINC ALLOYS HAVING LOW LEVELS OF LEAD AND GOOD MACHINABILITY

The free-cutting copper alloy according to the present invention contains a greatly reduced amount of lead in comparison with conventional free-cutting copper alloys, but provides industrially satisfactory machinability. The free-cutting alloys comprise 69 to 79 percent, by weight, of copper, 2.0 to 4.0 percent, by weight, of silicon, 0.02 to 0.4 percent, by weight, of lead, and the remaining percent, by weight, of zinc. 114-. (canceled)15. A free-cutting copper alloy , comprising: 62 to 78 percent , by weight , of copper; 2.5 to 4.5 percent , by weight , of silicon; 0.02 to 0.4 percent , by weight , of lead; at least one element selected from among 0.3 to 3.0 percent , by weight , of tin , 0.2 to 2.5 percent , by weight , of aluminum , and 0.02 to 0.25 percent , by weight , of phosphorus; and at least one element selected from among 0.7 to 3.5 percent , by weight , of manganese and 0.7 to 3.5 percent , by weight , of nickel; and a remaining percentage , by weight , of zinc; (a) a matrix comprising an alpha phase, and', '(b) one or more phases selected from the group consisting of a gamma phase and a kappa phase; and, 'wherein the copper alloy includes'}wherein the one or more phases are formed in the matrix.16. A free-cutting copper alloy as recited in claim 15 , wherein the alloy includes one or more elements selected from the group consisting of tin and phosphorous claim 15 , and the one or more phases are formed and uniformly dispersed in the matrix.17. A free-cutting copper alloy as recited in claim 15 , made by a process comprising the step of subjecting the alloy to a heat treatment for 30 minutes to 5 hours at 400 to 600° C. so the one or more phases are finely dispersed in the matrix.1832-. (canceled) The present application is a continuation-in-part of U.S. patent application Ser. No. 09/983,029, filed Oct. 22, 2001, which is a continuation-in-part of U.S. patent application Ser. No. 09/403,834, filed on Oct. 27, 1999 (now abandoned), which is a U.S. ...

COPPER ALLOY FASTENER ELEMENT AND SLIDE FASTENER

Provided is a copper alloy fastener element which improves season cracking resistance by a means different from that of increasing a ratio of a β phase. The copper alloy fastener element includes a copper-zinc alloy as a base material, the base material having: an apparent zinc content of from 34 to 38%; a dendrite structure; and a β phase at a ratio of 10% or less. 1. A copper alloy fastener element comprising a copper-zinc alloy as a base material , the base material having: an apparent zinc content of from 34 to 38% by mass; a dendrite structure; and a β phase at a ratio of 10% or less.2. The copper alloy fastener element according to claim 1 , wherein the base material contains from 34 to 38% by mass of Zn.3. The copper alloy fastener element according to claim 1 , wherein the copper alloy fastener comprises: a pair of leg portions for being fixed by sandwiching to a core cord portion provided on one side edge of a fastener tape; a crotch portion for connecting the leg portions; and a head portion provided from the crotch portion in a direction opposite to the leg portions claim 1 , the head portion comprising an engaging concave portion and an engaging convex portion claim 1 , and wherein the base material on an inner side surface of the crotch portion to be in contact with the core cord portion has at least the dendrite structure.4. The copper alloy fastener element according to claim 1 , wherein the ratio of the phase in the base material is from 2 to 10%.5. The copper alloy fastener element according to claim 1 , wherein the base material has been produced through an annealing step under heating conditions where a diffusion distance of copper is from 0.5 to 3.0 nm claim 1 , after casting.6. A fastener chain comprising at least one copper alloy fastener element according to .7. A slide fastener comprising the fastener chain according to .8. An article comprising the slide fastener according to .9. The copper alloy fastener element according to claim 1 , ...

COPPER-BASED ALLOY CASTING IN WHICH GRAINS ARE REFINED

A copper-based alloy casting includes 69 to 88% of Cu, 2 to 5% of Si, 0.0005 to 0.04% of Zr, 0.01 to 0.25% of P by mass, and a remainder including Zn and inevitable impurities, and satisfies 60≤Cu−3.5×Si−3×P≤71. Further, mean grain size after melt-solidification is 100 μm or less, and α, κ and γ-phases occupy more than 80% of phase structure. Furthermore, the copper-based alloy casting according to the invention can further include at least one element selected from a group consisting of 0.001 to 0.2% of Mg, 0.003 to 0.1% of B, 0.0002 to 0.01% of C, 0.001 to 0.2% of Ti and 0.01 to 0.3% of rare earth element. 110-. (canceled)11. A copper-based alloy casting comprising:69 to 88% of Cu by mass;2 to 5% of Si by mass;0.0005 to 0.04% of Zr by mass;0.01 to 0.25% of P by mass; anda remainder including Zn and inevitable impurities, andthe copper-based alloy casting satisfying 60≤Cu−3.5×Si−3×P≤71, and having refined casted grains,wherein the grains as cast are refined during melt-solidification of a casting process, and a mean grain size of the refined casted grains is 100 μm or less, andwherein α, κ and γ-phases of the copper-based alloy casting occupy more than 80% of phase structure of the copper-based alloy casting;wherein the casting has a shape determined by a mold.12. The copper-based alloy casting according to claim 11 , further comprising:at least one element selected from the group consisting of 0.1 to 2.5% of Sn, 0.02 to 0.25% of Sb and 0.02 to 0.25% of As, by mass.13. A copper-based alloy casting comprising:69 to 88% of Cu by mass;2 to 5% of Si by mass;0.0005 to 0.04% of Zr by mass;0.01 to 0.25% of P by mass; anda remainder including Zn and inevitable impurities,the copper-based alloy casting satisfying 60≤Cu−3.5×Si−3×P≤71, and having refined casted grains, andat least one element selected from the group consisting of 0.004 to 0.45% of Pb, 0.004 to 0.45% of Bi, 0.03 to 0.45% of Se and 0.01 to 0.45% of Te, by mass,wherein the grains as cast are refined during melt- ...

UNLEADED FREE-CUTTING BRASS ALLOYS WITH EXCELLENT CASTABILITY, METHOD FOR PRODUCING THE SAME, AND APPLICATION THEREOF

The present invention is directed to an unleaded free cutting brass alloy with excellent machinability, leak-tightness, reca stability, and mechanical properties, wherein the brass alloy comprises 65 to 75 weight % of copper, 22.5 to 32.5 weight % of zinc, 0.5 to 2.0 weight % of silicon, and other unavoidable impurities; wherein the total content of copper and zinc in the brass alloy is 97.5 weight % or more. 120.-. (canceled)21. An unleaded free-cutting brass alloy , comprising:copper: 65 to 75 weight %,zinc: 22.5 to 32.5 weight %,silicon: 0.5 to 2.0 weight %, andother unavoidable impurities,wherein the total content of copper and zinc in the brass alloy is 97.5 weight % or more.22. The brass alloy according to claim 21 , further comprising at least one element selected from the group consisting of 0.1 to 1.0 weight % of aluminum claim 21 , 0.01 to 0.55 weight % of tin claim 21 , 0.01 to 0.55 weight % of manganese claim 21 , 0.01 to 0.8 weight % of nickel claim 21 , 0.01 to 0.55 weight % of antimony claim 21 , and 0.001 to 0.1 weight % of boron claim 21 , wherein the total content of the element(s) is 2.5 weight % or less.23. The brass alloy according to claim 21 , wherein the γ-phase of the brass alloy is uniformly distributed between phase boundaries of the α-phase and the β-phase of the brass alloy in a granular shape.24. The brass alloy according to claim 21 , wherein the brass alloy comprises 1.1 to 1.35 weight % of silicon.25. The brass alloy according to claim 22 , comprising 0.2 to 0.5 weight % of aluminum.26. The brass alloy according to claim 22 , comprising 0.01 to 0.2 weight % of tin.27. The brass alloy according to claim 22 , comprising 0.01 to 0.25 weight % of manganese.28. The brass alloy according to claim 22 , comprising 0.01 to 0.55 weight % of nickel.29. The brass alloy according to claim 22 , comprising 0.1 to 0.45 weight % of antimony.30. The brass alloy according to claim 22 , comprising 0.001 to 0.05 weight % of boron.31. A casting process ...

Metallic Fastener Member and Fastener Equipped with Same

An improved season cracking resistance of a metallic fastener member is provided and includes a copper alloy containing zinc as a base material. The metallic fastener member includes, as a base material, a copper alloy containing zinc, and the metallic fastener member has a surface to which a rust prevention treatment has been applied and has such a property that, when analyzed by a scanning X-ray photoelectron spectroscopy apparatus, a maximum value of an atomic concentration of Mn is detected at a depth of 100 nm or less from the surface. 1. A metallic fastener member comprising , as a base material , a copper alloy containing zinc , wherein the metallic fastener member has a surface to which a rust prevention treatment has been applied and has such a property that , when analyzed by a scanning X-ray photoelectron spectroscopy apparatus , a maximum value of an atomic concentration of Mn is detected at a depth of 100 nm or less from the surface.2. The metallic fastener member according to claim 1 , wherein when analyzing the atomic concentration of Mn in a depth direction from the surface by the scanning X-ray photoelectron spectroscopy apparatus claim 1 , a maximum value of the atomic concentration of Mn is 10 at. % or more claim 1 , and a depth range from the surface within which the atomic concentration of Mn is 5 at. % or more is 10 nm or more.3. The metallic fastener member according to claim 1 , wherein when analyzing an atomic concentration of O in a depth direction from the surface by the scanning X-ray photoelectron spectroscopy apparatus claim 1 , a maximum value of the atomic concentration of O is detected at a depth of 100 nm or less from the surface claim 1 , and the maximum value of the atomic concentration of O is 20 at. % or more.4. The metallic fastener member according to claim 1 , wherein when analyzing an atomic concentration of O in a depth direction from the surface by the scanning X-ray photoelectron spectroscopy apparatus claim 1 , a depth ...

Copper alloy for producing horse bits or horse bit parts

A copper alloy to produce for horse bits or parts thereof is composed of 1 wt % to 30 wt % manganese, 1 wt % to 30 wt % zinc, and the remainder copper and other additives, the other additives in total being less than 6 wt %, in particular less than 3 wt %.

Cast copper alloy for asynchronous machines

The invention relates to a copper alloy having the following composition (in % by weight): in each case 0.05 to 0.5% of at least three elements selected from the group consisting of Ag, Ni, Zn, Sn and Al, remainder Cu and unavoidable impurities, optionally 0.01 to 0.2% of one or more elements selected from the group consisting of Mg, Ti, Zr, B, P, As, Sb. The invention also relates to a current-carrying structural part made of a copper alloy and also to a cage rotor having a plurality of conductor bars and two short-circuiting rings, which are cast in one piece from a copper alloy.

System and Method to Decrease the Viscosity of the Crude Oil and the Potentiation of Dehydration

A method and system for producing crude oil having reduced viscosity in the processed crude and the empowerment of its dehydration process by passing crude oil over a core that ionizes-polarizes the crude oil with an electrostatic charge. The metal bar-core is an alloy with 40-70% copper by weight, 10-32% nickel, 15-40% zinc, 2-20% tin, and 0.05-10% silver. The core comprises a plurality of grooves, which allows crude oil to be agitated as it comes in contact with the core, activating an electrostatic charge. The electrostatic charge of the core creates a magnetic catalytic reaction that causes: (1) a molecular separation in molecular chains in the processed crude oil thereby lowering the viscosity and (2) stretches and twists caused by the molecular ionization-polarization of processed crude, causes that this release accordingly congenital or added water that is trapped in it, resulting in a potentiation of the dehydration of processed crude. 1. Crude oil processed by a system to maintain crude oil in a liquid state and potentiate its dehydration , comprising:exposing crude oil to a core that ionizes-polarizes the crude oil with an electrostatic charge and creating processed crude oil;wherein the core consists of a metal bar made of an alloy comprising, by weight, 40-70% copper, 10-32% nickel, 15-40% zinc, 2-20% tin, and 0.05-10% silver;wherein the metal bar of the core comprises a plurality of cuts having a concave shape and arranged diagonally on an entire surface of an upper and lower face of the metal bar of the core to create grooves, which allows the crude oil to be agitated as it comes in contact with the core, activating the electrostatic charge;wherein the core is within a casing having an inlet and an outlet at its ends for receiving and download crude oil which is to be treated; andwherein the crude oil coming from the casing is processed crude oil which has a lowered viscosity such that the processed crude oil remains in the liquid state at temperatures ...

Physical Vapor Deposition Processing Systems Target Cooling

Physical vapor deposition target assemblies and methods of manufacturing such target assemblies are disclosed. An exemplary target assembly comprises a flow pattern including a plurality of arcs and bends fluidly connected to an inlet end and an outlet end. 1. A physical vapor deposition target assembly comprising:a source material;a backing plate having a front side and a back side, the backing plate configured to support the source material on a front side of the backing plate; anda cooling channel formed in the backing plate including an inlet end configured to be connected to a cooling fluid, an outlet end fluidly coupled to the inlet end, and the cooling channel comprising a plurality of arcs joined together by a plurality of bends between the inlet end and the outlet end, the backing plate configured to be to cool the source material during a physical vapor deposition process.2. The physical vapor deposition target assembly of claim 1 , further comprising a cooling tube that provides a closed cooling loop containing the cooling fluid claim 1 , the cooling tube disposed adjacent the cooling channel.3. The physical vapor deposition target assembly of claim 1 , the plurality of bends defining a flow pattern including a plurality of concentric arcs.4. The physical vapor deposition target assembly of claim 3 , the flow pattern comprising at least four arcs and five bends.5. The physical vapor deposition target assembly of claim 3 , the flow pattern comprising at least eight arcs and six bends.6. The physical vapor deposition target assembly of claim 3 , the flow pattern comprising a first pair of arcs and a second pair of arcs claim 3 , the inlet end fluidly connected to the first pair of arcs and second pair of arcs by a split connection claim 3 , and the outlet end fluidly connected to the first pair of arcs and second pair of arcs.7. The physical vapor deposition target assembly of claim 3 , the flow pattern comprising a first pair of arcs and a second pair of ...

Self-adjusting clad wire for welding applications

Disclosed are self-adjusting wires, methods of making these self-adjusting wires, and thermal joining processes (such as gas metal arc welding or laser brazing) and other processes using these self-adjusting wires. The wires have an outer layer of a metal or metal alloy suitable as a joining material in the joining process and a core of a shape-memory alloy. The outer layer may be continuous about the exterior of the core or discontinuous such as a longitudinal strip or strips. The shape-memory alloy of the self-adjusting wire is “trained” to a straight-wire shape in its austenite phase. In using the self-adjusting wire in a process, a bent end of the self-adjusting wire is straightened by heating the self-adjusting wire above the austenite phase transition temperature of the shape-memory alloy.

CuSn, CuZn AND Cu2ZnSn SPUTTER TARGETS

The invention claims a three dimensional sputter target comprising CuZnSn material, CuZn material or CuSn material. Exemplary has a CuZnSn material a Cu content ranging from 40 atomic percent to 60 atomic percent; a Zn content ranging from 20 atomic percent to 30 atomic percent; and a Sn content ranging from 20 atomic percent to 30 atomic percent, wherein the three dimensional sputter target has at least one principal axis dimension greater than 500 mm and the CuZnSn material has a grain size ranging from 0.005 mm to 5 mm. Additional to that claims the invention a method of producing the three dimensional sputter target. 1. A three dimensional sputter target comprising:a CuZnSn material having a Cu content ranging from 40 atomic percent to 60 atomic percent;a Zn content ranging from 20 atomic percent to 30 atomic percent; anda Sn content ranging from 20 atomic percent to 30 atomic percent, wherein the three dimensional sputter target has at least one principal axis dimension greater than 500 mm and the CuZnSn material has a grain size ranging from 0.005 mm to 5 mm.2. A three dimensional sputter target comprising:a CuZn material having a Cu content ranging from 40 atomic percent to 60 atomic percent; anda Zn content ranging from 40 atomic percent to 60 atomic percent, wherein the three dimensional sputter target has at least one principal axis dimension greater than 500 mm and the CuZn material has a grain size ranging from 0.005 mm to 5 mm.3. A three dimensional sputter target comprising:a CuSn material having a Cu content ranging from 40 atomic percent to 60 atomic percent; anda Sn content ranging from 40 atomic percent to 60 atomic percent, wherein the three dimensional sputter target has at least one principal axis dimension greater than 500 mm and the CuSn material has a grain size ranging from 0.005 mm to 5 mm.4. The three dimensional sputter target according to claim 1 , wherein the material is an alloy composition.5. The three dimensional sputter target ...

Method for Making Mg Brass EDM Wire

A method for making Mg brass EDM wire has the steps of melting a charge of Mg brass to form a melt of Mg brass; transferring the melt to a holding furnace; casting a rod from the melt; and drawing the rod down to a size suitable for EDM machining. Mg deposits may form in the holding furnace. These can be removed by flushing the holding furnace with molten brass. 1. A method for making Mg brass EDM wire comprising the steps: i) copper at about a desired copper concentration;', 'ii) zinc at about a desired zinc concentration; and', 'iii) magnesium at about a desired magnesium concentration;, 'a) in a melting furnace, melt a first charge of Mg brass to form a first melt of Mg brass comprisingb) transfer said first melt of Mg brass to a holding furnace comprising a casting die suitable for casting a rod;c) cast a first rod of Mg brass thereby forming deposits comprising Mg on said casting die;d) draw said first rod of Mg brass through one or more drawing dies to form a quantity of said Mg brass EDM wire;e) after said first rod of Mg brass is cast, melt a charge of flushing metal in said melting furnace to form a melt of flushing metal, said melt of flushing metal being operable to dissolve said deposits;f) transfer said melt of flushing metal to said holding furnace; andg) cast a rod of flushing metal from said holding furnace such that said deposits are substantially removed from said casting die.2. The method of wherein said desired zinc concentration is about 35 wt % and said desired magnesium concentration is in the range of 0.02 wt % to 5 wt %.3. The method of wherein said desired zinc concentration is about 35 wt % and said desired magnesium concentration is in the range of 0.05 wt % to 0.5 wt %.4. The method of wherein said flushing metal comprises copper.5. The method of wherein said flushing metal is substantially brass.6. A quantity of Mg brass EDM wire made by a method comprising the steps: i) copper at about a desired copper concentration;', 'ii) zinc at ...

Edm milling electrode

An apparatus for an electrical discharge machine for milling a shaped cavity in a workpiece includes a hollow electrode having a metallic inner shell with at least one passage for receiving dielectric fluid. A layer including at least one brass alloy is provided over the inner sheel and exhibits a zinc content greater than a zinc content of the inner shell.

LEAD-FREE EASY-TO-CUT CORROSION-RESISTANT BRASS ALLOY WITH GOOD THERMOFORMING PERFORMANCE

The present invention provides a lead-free easy-to-cut corrosion-resistant brass alloy with good thermoforming performance. The brass alloy contains: 74.5-76.5 wt % of Cu, 3.0-3.5 wt % of Si, 0.11-0.2 wt % of Fe, 0.04-0.10% wt % of P, Zn and inevitable impurities. The alloy provided by the present invention has good cold-working and hot-working forming performance, and good dezincification corrosion-resistant and stress corrosion-resistant performance, applies to parts that require cutting and grinding forming in water-heating sanitaryware, electronic appliances, automobiles and the like, and especially applies to production and assembling of complex forging products for which stress is inconvenient to eliminate, such as water taps, values and the like. 1. A lead-free easy-to-cut corrosion-resistant brass alloy with excellent thermoforming performance comprising: 74.5-76.5 wt % Cu , 3.0-3.5 wt % Si , 0.11-0.2 wt % Fe , 0.04-0.10 % wt % P , the balance being Zn and unavoidable impurities.2. The brass alloy according to claim 1 , wherein the content of Cu in the brass alloy is 75-76 wt %.3. The brass alloy according to claim 1 , wherein the content of Si in the brass alloy is 3.1-3.4 wt %.4. The brass alloy according to claim 1 , wherein the content of P in the brass alloy is 0.04-0.08 wt %.5. The brass alloy according to claim 1 , further comprising 0.001-0.01 wt % of at least one element selected from the group consisting of B claim 1 , Ag claim 1 , Ti and RE.6. The brass alloy according to claim 5 , wherein the content of B claim 5 , Ag claim 5 , Ti and RE in the brass alloy is 0.001-0.005 wt %.7. The brass alloy according to claim 1 , further comprising at least one element selected from the group consisting of Pb claim 1 , Bi claim 1 , Se and Te claim 1 , the content of Pb is 0.01-0.25 wt % claim 1 , the content of Bi is 0.01-0.4 wt % claim 1 , the content of Se is 0.005-0.4 wt % claim 1 , and the content of Te is 0.005-0.4 wt %.8. The brass alloy according to ...

ALLOY WITH SELECTED ELECTRICAL CONDUCTIVITY AND ATOMIC DISORDER, PROCESS FOR MAKING AND USING SAME

A primary alloy includes: nickel; copper; zinc; an electrical conductivity from 5.2% International Annealed Copper Standard (IACS) to 5.6% IACS measured in accordance with ASTM E1004-09 (2009); and a disordered crystalline phase wherein atoms of the nickel, cooper, and zinc are randomly arranged in the disordered crystalline phase at room temperature in a post-annealed state. A process for making the primary alloy includes heating a secondary alloy to a first temperature that is greater than or equal to an annealing temperature to form an annealing alloy, the secondary alloy including a secondary phase; and quenching, by cooling the annealing alloy from the first temperature to a second temperature that is less than the annealing temperature, under a condition effective to form the primary alloy including the disordered crystalline phase, wherein the disordered crystalline phase is different than the secondary phase of the secondary alloy. 1. A primary alloy comprising:nickel;copper;zinc;an electrical conductivity from 5.2% International Annealed Copper Standard (IACS) to 5.6% IACS measured in accordance with ASTM E1004-09 (2009); anda disordered crystalline phase wherein atoms of the nickel, cooper, and zinc are randomly arranged in the disordered crystalline phase at room temperature in a post-annealed state.2. The primary alloy of claim 1 , wherein the nickel is present in an amount from 18 wt. % to 21 wt. % claim 1 , based on a total weight of the primary alloy.3. The primary alloy of claim 2 , wherein the zinc is present in an amount from 24 wt. % to 28 wt. % claim 2 , based on the total weight of the primary alloy.4. The primary alloy of claim 3 , wherein the copper is present in an amount as a balance of the total weight of the primary alloy.5. The primary alloy of claim 3 , wherein the copper is present in an amount from 45 wt. % to 68 wt. % claim 3 , based on the total weight of the primary alloy.6. The primary alloy of claim 3 , further comprising ...

Cobalt Silicide-Containing Copper Alloy

The present invention discloses copper alloy containing cobalt and silicon, which comprises (in percentage of weight): 69% to 92% of copper; 6.5% to 30.5% of zinc; 0.01% to 3% of cobalt; and 0.01% to 0.5% of silicon; wherein the total content of copper and zinc is greater than 95%, and the content of inevitable impurities is less than 0.2%. Preferably, the copper alloy comprises matrix phases of copper-zinc α solid solution and CoSiprecipitated phases; the CoSiprecipitated phases are dispersedly distributed on a matrix phase; the percentage of the matrix phases by area is greater than or equal to 95%; and, the percentage of the CoSiprecipitated phases by area is 0.01% to 5%. 1. A copper alloy containing cobalt and silicon comprising (in percentage of weight):69% to 92% of copper;6.5% to 30.5% of zinc;0.01% to 3% of cobalt; and0.01% to 0.5% of silicon;wherein the total content of copper and zinc is greater than 95%, and the content of inevitable impurities is less than 0.2%.2. The copper alloy of claim 1 , wherein the copper alloy comprises matrix phases of copper-zinc α solid solution and CoSiprecipitated phases;{'sub': x', 'y, 'the CoSiprecipitated phases are dispersedly distributed on a matrix phase;'}the percentage of the matrix phases by area is greater than or equal to 95%; and,{'sub': x', 'y, 'the percentage of the CoSiprecipitated phases by area is 0.01% to 5%.'}3. The copper alloy of claim 2 , wherein the percentage of the CoSiprecipitated phases having a particle size between 10 nm and 200 nm is greater than or equal to 90% claim 2 , and the percentage of the CoSiprecipitated phases having a particle size above 200 nm is less than or equal to 10%.4. The copper alloy of claim 3 , wherein an atomic ratio of copper to zinc (Cu/Zn) is 2.3 to 15.8 claim 3 , and a mass fraction of copper and zinc satisfies 0.65≦([Cu]/3+1)/([Zn]+5)≦3.5.5. The copper alloy of claim 4 , wherein a yield strength/tensile strength of the copper alloy is greater than or equal to 85%; ...

BRASS ALLOY FOR TAP WATER SUPPLY MEMBER

A brass alloy is provided having good mechanical properties and castability, and excellent general-purpose properties, while its dezincification corrosion is inhibited. The brass alloy contains 0.4% by mass or more and 3.2% by mass or less of Al; 0.001% by mass or more and 0.3% by mass or less of P; 0.1% by mass or more and 4.5% by mass or less of Bi; 0% by mass or more and 5.5% by mass or less of Ni; 0% by mass or more and 0.5% by mass or less of Mn, Fe, Pb, Sn, Si, Mg, and Cd, respectively; and Zn; the balance being Cu and a trace element or elements. The zinc equivalent (Zneq) calculated from the content of Zn and other elements, and the content of Al (% by mass) satisfy the following Equations (1) and (2): 2. The brass alloy for use in a member for water works according to claim 1 , wherein the at least one trace element comprises a plurality of trace elements claim 1 , and wherein one of the trace elements comprises from 0.001% by mass to 0.1% by mass of B.3. The brass alloy for use in a member for water works according to claim 1 , wherein a content of Al is 2.5% by mass or less of the brass alloy.4. The brass alloy for use in a member for water works according to claim 2 , wherein a content of Al is 2.5% by mass or less of the brass alloy. The present invention relates to a brass alloy containing zinc, and more specifically to a brass alloy for use in a member for water works.A copper alloy containing from 20 to 40% of zinc, referred to as “brass”, has an excellent castability, ductility and machinability, as well as an excellent appearance with a gold-like luster. For example, Patent Document 1 discloses a brass alloy for use in materials and equipment for water works containing from 27 to 35% of zinc and from 1 to 3% of aluminium.Patent Document 1: JP 3919574 BHowever, when a brass alloy having a high zinc content is brought into contact with tap water in which various components are dissolved, zinc, whose standard electrode potential is lower than copper, ...

White Antimicrobial Copper Alloy

Copper based alloys exhibiting a white/silver hue. The alloys contain copper, nickel, zinc, manganese, sulfur, and antimony. 1. A composition comprising:61-67 copper,8-12 nickel,8-14 zinc,10-16 manganese,up to 0.25 sulfur, and0.1-1.0 antimony.2. The composition of claim 1 , further comprising 0.2-1.0 tin.3. The composition of claim 1 , less than 0.6 iron.4. The composition of claim 1 , less than 0.6 aluminum.5. The composition of claim 1 , less than 0.05 phosphorous.6. The composition of claim 1 , less than 0.09 lead.7. The composition of claim 1 , less than 0.05 silicon.8. The composition of claim 1 , less than 0.10 carbon.9. A composition comprising:66-70 copper,3-6 nickel,8-14 zinc,10-16 manganese,up to 0.25 sulfur, and0.1-1.0 antimony.10. The composition of claim 9 , 0.2-1.0 tin.11. The composition of claim 9 , less than 0.6 iron.12. The composition of claim 9 , less than 0.6 aluminum.13. The composition of claim 9 , less than 0.05 phosphorous.14. The composition of claim 9 , less than 0.09 lead.15. The composition of claim 9 , less than 0.05 silicon.16. The composition of claim 9 , less than 0.10 carbon.17. A composition comprising:66-70 copper,3-6 nickel,10-14 zinc,10-16 manganese,up to 0.25 sulfur, and0.1-1.0 antimony.18. The composition of claim 17 , less than 0.6 iron.19. The composition of claim 17 , less than 0.05 phosphorous.20. The composition of claim 17 , less than 0.09 lead.21. The composition of claim 17 , less than 0.05 silicon.22. The composition of claim 17 , less than 0.10 carbon. This application claims priority as a continuation-in-part of Patent Cooperation Treaty Application No. PCT/US2013/066601 filed Oct. 24, 2013, which claims priority to U.S. Provisional Patent Application 61/718,857 filed Oct. 26, 2012, all of which are hereby incorporated by reference in their entirety.The present invention generally relates to the field of alloys. Specifically, the embodiments of the present invention relate to copper alloys exhibiting a muted copper ...

Free-cutting copper alloy and method for manufacturing free-cutting copper alloy

This free-cutting copper alloy includes Cu: more than 61.0% and less than 65.0%, Si: more than 1.0% and less than 1.5%, Pb: 0.003% to less than 0.20%, and P: more than 0.003% and less than 0.19%, with the remainder being Zn and unavoidable impurities, a total content of Fe, Mn, Co, and Cr is less than 0.40%, a total content of Sn and Al is less than 0.40%, a relationship of 56.5≤f1=[Cu]−4.5×[Si]+0.5×[Pb]−[P]≤59.5 is satisfied, constituent phases of a metallographic structure have relationships of 20≤(α)≤80, 15≤(β)≤80, 0≤(γ)<8, 18×(γ)/(β)<9, 20≤(γ)1/2×3+(β)×([Si])1/2≤88, and 33≤(γ)1/2×3+(β)×([Si])1/2+([Pb])1/2×35+([P])1/2×15, and a compound including P is present in β phase.

PRECIPITATION-STRENGTHENED COPPER ALLOY AND APPLICATION THEREOF

The invention is a precipitation-strengthened copper alloy, including the following components in percentage by weight: 80 wt %-95 wt % of Cu, 0.05 wt %-4.0 wt % of Sn, 0.01 wt %-3.0 wt % of Ni, 0.01 wt %-1.0 wt % of Si, and the balance of Zn and unavoidable impurities. According to the invention, the comprehensive performance of the alloy is improved by solution strengthening and precipitation strengthening; while the strength of the matrix is improved, the electrical conductivity of the alloy is hardly affected, the bending workability meets the requirements, and the stress relaxation resistance comparable to that of tin phosphor bronze is achieved. The comprehensive performance of the alloy of the invention is superior to that of the tin phosphor bronze C51900. Furthermore, the alloy of the invention is low in raw material cost, has obvious advantages in welding and plating. 1. A precipitation-strengthened copper alloy , comprising the following components in percentage by weight: 80 wt %-95 wt % of Cu , 0.05 wt %-4.0 wt % of Sn , 0.01 wt %-3.0 wt % of Ni , 0.01 wt %-1.0 wt % of Si , and the balance of Zn and unavoidable impurities.2. The precipitation-strengthened copper alloy according to claim 1 , wherein the copper alloy contains a NiSi phase claim 1 , and after aging claim 1 , the amount of the NiSi phase having a particle diameter of 50 nm or less accounts for 75% or above of the total amount of the NiSi phase precipitates.3. The precipitation-strengthened copper alloy according to claim 1 , wherein a X-ray diffraction intensity of a crystal face {111} claim 1 , having a rolled surface within a range of 0<2θ<90° claim 1 , of a strip of the copper alloy is denoted as I claim 1 , a X-ray diffraction intensity of a crystal face {200} is denoted as I claim 1 , a X-ray diffraction intensity of a crystal face {220} is denoted as I claim 1 , and a X-ray diffraction intensity of a crystal face {311} is denoted as I claim 1 , and I claim 1 , I claim 1 , I claim 1 , ...

COPPER ALLOY

The invention relates to a copper alloy that has been subjected to a thermo-mechanical treatment, composed of (in wt %) 15.5 to 36.0% Zn, 0.3 to 3.0% Sn, 0.1 to 1.5% Fe, optionally also 0.001 to 0.4% P, optionally also 0.01 to 0.1% Al, optionally also 0.01 to 0.03% Ag, Mg, Zr, In, Co, Cr, Ti, Mn, optionally also 0.05 to 0.5% Ni, the remainder copper and unavoidable contaminants, wherein the microstructure of the alloy is characterized in that the proportions of the main texture layers are at least 10 vl % copper layer, at least 10 vl % S/R layer, at least 5 vl % brass layer, at least 2 vl % Goss layer, at least 2 vl % 22RD-cube layer, at least 0.5 vl % cube layer, and finely distributed iron-containing particles are contained in the alloy matrix. 1. A copper alloy , which was subjected to a thermomechanical treatment , consisting of (in wt.-%):15.5 to 36.0% Zn,0.3 to 3.0% Sn,0.1 to 1.5% Fe,optionally also 0.001 to 0.4% P,optionally also 0.01 to 0.1% μl,optionally also in each case 0.01 to 0.3% Ag, Mg, Zr, In, Co, Cr, Ti, Mn,optionally also 0.05 to 0.5% Ni,the remainder copper and unavoidable impurities, wherein the microstructure of the alloy is characterized in thatthe proportions of the main texture layers areat least 10 vol.-% copper layer,at least 10 vol.-% S/R layer,at least 5 vol.-% brass layer,at least 2 vol.-% cast layer,at least 2 vol.-% 22RD cube layer,at least 0.5 vol.-% cube layer, andfinely distributed ferrous particles are contained in the alloy matrix.2. The copper alloy as claimed in claim 1 , characterized by a content of0.7 to 1.5% Sn,0.5 to 0.7% Fe.3. The copper alloy as claimed in claim 1 , characterized by a content of 21.5 to 31.5% Zn.4. The copper alloy as claimed in claim 1 , characterized by a content of 28.5 to 31.5% Zn.5. The copper alloy as claimed in claim 1 , characterized in that the ratio of the proportions of the main texture layers of brass layer and copper layer is less than 1.6. The copper alloy as claimed in claim 5 , ...

COPPER ALLOY FOR USE IN A MEMBER FOR WATER WORKS

It is an object of the present invention to obtain a copper alloy for use in a member for water works which inhibits leaching of Pb and exhibits suitable mechanical properties and castability, while restraining the amount of usage of Bi but securing the recyclability. The alloy of the present invention contains 0.5% by mass or less of Ni; 12% by mass or more and 21% by mass or less of Zn; 1.5% by mass or more and 4.5% by mass or less of Sn, a total content of Zn and Sn being 23.5% by mass or less; 0.005% by mass or more and 0.15% by mass or less of P; 0.05% by mass or more and 0.30% by mass or less of Pb; less than 0.2% by mass of Bi; and the balance, wherein the balance is Cu and unavoidable impurities. 1. A copper alloy for use in a member for water works, the copper alloy consisting of: 0.5% by mass or less of Ni; 12% by mass or more and 21% by mass or less of Zn; 1.4% by mass or more and 4.5% by mass or less of Sn, a total content of Zn and Sn being 23.5% by mass or less; 0.005% by mass or more and 0.15% by mass or less of P; 0.05% by mass or more and 0.30% by mass or less of Pb; less than 0.2% by mass of Bi; and the balance, wherein the balance is Cu and unavoidable impurities. The present invention relates to a material for use in a member for water works, which is made of a copper alloy and in which the level of lead leaching is not more than a stipulated value.A cast bronze metal (JIS H5120 CAC406), which has been conventionally used for parts in materials and equipment for water works and in feed water supply systems, is excellent in castability, corrosion resistance, machinability, and/or water pressure resistance and used for parts in materials and equipment for water works and in feed water supply systems, and the like in various fields. This cast bronze metal (CAC406) contains from 4.0 to 6.0% by weight of lead so as to have the high machinability, and has characteristics of easy workability. However, this lead contained has a property to leach into the ...

USE OF A COPPER ALLOY

The invention relates to the use of a copper alloy, composed of (in wt %): 51.8 to 84.0% Cu, 15.5 to 36.0% Zn, 0.35 to 3.0% Sn, 0.12 to 1.5% Fe, 0.02 to 1.0% P, optionally also 0.1 to 2.0% Al, optionally also 0.05 to 0.7% Si, optionally also 0.05 to 2.0% Ni, optionally also respectively 0.1 to 1.0% Mn, Co, optionally also respectively 0.01 to 1.0% As, Sb, and unavoidable contaminants, wherein more than 95% of the structure consist of α-mixed crystal, in which at least iron phosphides and/or iron are embedded as deposition particles, for metallic articles in breeding organisms living in seawater. 1. The use of a copper alloy , consisting of (in wt.-%):51.8 to 84.0% Cu,15.5 to 36.0% Zn,0.35 to 3.0% Sn,0.12 to 1.5% Fe,0.02 to 1.0% P,optionally also 0.1 to 2.0% Al,optionally also 0.05 to 0.7% Si,optionally also 0.05 to 2.0% Ni,optionally respectively also 0.1 to 1.0% Mn, Co,optionally respectively also 0.01 to 1.0% As, Sb,and unavoidable impurities,wherein the microstructure consists more than 95% of α-mixed crystal, in which at least iron phosphides and/or iron are intercalated as precipitation particles, for metal objects in the cultivation of organisms living in seawater.2. The use of the copper alloy as claimed in claim 1 , characterized by a content of 0.55 to 1.5% Fe.3. The use of the copper alloy as claimed in claim 1 , characterized by a content of0.7 to 1.5% Sn,0.55 to 0.7% Fe.4. The use of the copper alloy as claimed in claim 1 , characterized by a content of 21.5 to 36.0% Zn.5. The use of the copper alloy as claimed in claim 4 , characterized by a content of 26.5 to 35.0% Zn.6. The use of the copper alloy as claimed in claim 1 , characterized in that claim 1 , for the ratio of the content of P claim 1 , As claim 1 , Sb and the content of Fe claim 1 , Ni claim 1 , Mn claim 1 , Co claim 1 , the following applies:{'br': None, '[P+As+Sb]/[Fe+Ni+Mn+Co]>0.25.'}7. The use of the copper alloy as claimed in claim 1 , characterized in that the mean grain size is less ...

HEAT TRANSFER TUBE CONSTRUCTED OF TIN BRASS ALLOY

The present invention provides a heat transfer tube constructed of a tin brass alloy, which results in a heat transfer tube suitable for ACR systems that is superior in resistance to formicary corrosion. 1. A formicary corrosion resistant heat transfer tube comprising a tin brass alloy.2. The heat transfer tube of claim 1 , comprising up to 3.0% tin.3. The heat transfer tube of claim 1 , comprising from 0.8 to 1.4% tin.4. The heat transfer tube of claim 1 , comprising from 86% to 90% copper.5. The heat transfer tube of claim 1 , comprising from 86% to 89% copper.6. The heat transfer tube of claim 1 , comprising from 9.6% to 13.2% zinc.7. The heat transfer tube of claim 1 , comprising up to 35% zinc.8. The heat transfer tube of claim 1 , comprising no more than 0.05% lead.9. The heat transfer tube of claim 1 , comprising no more than 0.05% iron.10. The heat transfer tube of claim 1 , comprising no more than 90% copper claim 1 , no more than 3.0% tin claim 1 , and no more than 13.2% zinc.11. The heat transfer tube of claim 1 , consisting essentially of between 86.0% and 90.0% copper claim 1 , between 0.8%-3.0% tin claim 1 , no more than 0.05% lead claim 1 , no more than 0.05% iron claim 1 , no more than 0.35% phosphorus claim 1 , and the remainder zinc.12. The heat transfer tube of claim 1 , consisting essentially of between 86.0%-89.0% copper claim 1 , between 0.8%-1.4% tin claim 1 , no more than 0.05% lead claim 1 , no more than 0.05% iron claim 1 , no more than 0.35% phosphorus claim 1 , and the remainder zinc.13. The heat transfer tube of claim 1 , wherein the tube is formed from alloy C422.14. The heat transfer tube of claim 1 , wherein the tube is formed from alloy C425.15. A heat exchanger assembly comprising the heat exchange tube of claim 1 , further comprising a plurality of plate fins and at least one tube sheet.16. The heat exchange tube of claim 1 , wherein the tube is formed by welding claim 1 , extrusion or cast-and-rolling.17. A heat exchanger assembly ...

Lead-free Cu-Zn alloy

A lead-free Cu—Zn base alloy consisting of: 58-64 wt % Cu; 0.4-1.4 wt % Fe; 0.4-2.3 wt % Mn; 1.5-3.5 wt % Ni; 0.1-4.4 wt % Al; 0.5-1.8 wt % Si; as an alloy component that promotes chip breaking either 0.65-1.2 wt % Sn with up to 0.025 wt % P, or 0.03-0.1 wt % P with up to 0.25 wt % Sn; up to 0.1 wt % Pb; balance Zn together with unavoidable impurities, which are permitted up to 0.05 wt % per element, wherein the sum total of unavoidable impurities does not exceed 0.15 wt %; and wherein Cr is tolerated up to 0.035 wt %.

Lead-free CU-Zn alloy

A lead-free Cu—Zn alloy with improved machining properties compared to the alloy CuZn42, consisting of: 57-59.3 wt % Cu; 0.12-0.17 wt % Fe as a first alternative, or up to 0.06 wt % Fe and 0.3-0.7 wt % Mn as a second alternative; 0.03-0.1 wt % P; up to 1.0 wt % Sn; up to 0.1 wt % Pb; balance Zn together with unavoidable impurities, which are permitted up to 0.05 wt % per element, wherein the sum total of unavoidable impurities does not exceed 0.15 wt %; and wherein the following elements are tolerated up to the following specified contents: up to 0.03 wt % Ni, up to 0.05 wt % Al, up to 0.01 wt % Si, up to 0.01 wt % Cr.

WEAR RESISTANT, HIGHLY THERMALLY CONDUCTIVE SINTERED ALLOY

A powder metallurgically produced, wear-resistant, and highly thermally conductive copper-based sintered alloy as matrix is disclosed. The sintered alloy includes a powder mixture of a copper-base powder, of a hard phase with a total share of 8 to 40% by weight, of a solid lubricant with a total share of 0.4 to 3.8% by weight, of a pressing additive with a total share of 0.3 to 1.5% by weight, and production-related impurities. The powder mixture includes at least 55% by weight of the copper-base powder.

MATERIALS FOR NEAR FIELD TRANSDUCERS AND NEAR FIELD TRANSDUCERS CONTAINING SAME

A method of forming a near field transducer (NFT) layer, the method including depositing a film of a primary element, the film having a film thickness and a film expanse; and implanting at least one secondary element into the primary element, wherein the NFT layer includes the film of the primary element doped with the at least one secondary element. 1. A method of forming a near field transducer (NFT) layer , the method comprising:depositing a film of a primary element, the film having a film thickness and a film expanse; andimplanting at least one secondary element into the primary element,wherein the NFT layer comprises the film of the primary element doped with the at least one secondary element.2. The method according to claim 1 , wherein the at least one secondary element is implanted using beam line implanting claim 1 , or plasma immersion implanting.3. The method according to claim 1 , wherein the concentration of the at least one secondary element is not constant across the thickness of the film4. The method according to claim 1 , wherein the concentration of the at least one secondary element is not constant across the expanse of the film.5. The method according to claim 1 , wherein the at least one secondary element is implanted at more than one energy.6. The method according to further comprising annealing after implanting the at least one secondary element.7. The method according to further comprising depositing a metal or dielectric layer on the implanted film before annealing.8. The method according to further comprising implanting at least one secondary element after annealing.9. The method according to further comprising patterning the NFT layer into a NFT.10. The method according to further comprising depositing a metal or dielectric layer on the film of primary element before implanting the at least one secondary element.11. A method of forming a peg of a near field transducer (NFT) claim 1 , the method comprising:depositing a primary element to ...

Lead-Free High Tensile Brass Alloy and High Tensile Brass Alloy Product

The present disclosure relates to a lead-free high tensile brass alloy containing 0-65 wt. % Cu; 0.4-3 wt. % Mn; 0.55-3 wt. % Sn; 1 wt. % Fe; max 1 wt.-% Ni; max. 1 wt.-% Al; max 1.5 wt.-% Si; the remainder being Zn and inevitable impurities, and the sum of elements Mn and Sn being at least 1.3 wt.-% and not more than 6.0 wt.-%. 124-. (canceled)25. A lead-free high tensile brass alloy , comprising:50-65 wt.-% Cu;0.4-3 wt.-% Mn;0.55-3 wt.-% Sn;max. 1 wt.-% Fe;max. 1 wt.-% Ni;max. 1 wt.-% Al;max. 1.5 wt.-% Si;the remainder being Zinc (Zn) and inevitable impurities,wherein the sum of the elements Manganese (Mn) and Tin (Sn) is at least 1.3 wt.-% and at most 6.0 wt.-%.26. The lead-free high tensile brass alloy of claim 25 , comprising:56-62 wt.-% Cu;1.5-2.3 wt.-% Mn;1.4-2.2 wt.-% Sn;0.1-0.7 wt.-% Fe;max. 0.3 wt.-% Ni;max. 0.5 wt.-% All;0.25-0.85 wt.-% Si;the remainder being Zn and inevitable impurities.27. The lead-free high tensile brass alloy of claim 26 , further comprising:57-61.5 wt.-% Cu;1.7-2.2 wt.-% Mn;1.5-2.1 wt.-% Sn;0.1-0.7 wt.-% Fe;max. 0.3 wt.-% Ni;max. 0.7 wt.-% Al;0.3-0.7 wt.-% Si;the remainder being Zn and inevitable impurities.28. The lead-free high tensile brass alloy of claim 26 , wherein the elements Mn and Sn participate at a ratio of 0.95 to 1.15 Mn to Sn in the alloy.29. The lead-free high tensile brass alloy of claim 28 , wherein the Mn content is between 8% and 15% greater than the Sn content.30. The lead-free high tensile brass alloy of claim 26 , further comprising:57-61.5 et-% Cu;1.7-2.2 wt.-% Mn;0.6-1.2 wt.-% Sn;0.1-0.7 wt.-% Fe;max. 0.3 wt.-% Ni;max. 0.5 wt.-% Al;0.3-0.7 wt.-% Si;the remainder being Zn and inevitable impurities.31. The lead-free high tensile brass alloy of claim 30 , wherein the elements Mn and Sn participate at a ratio of 1.65 to 1.9 Mn to Sn in the alloy.32. The lead-free high tensile brass alloy of claim 31 , wherein the Mn content is between 60% and 85% greater than the Sn content.33. The lead-free high tensile brass ...

Low Shrinkage Corrosion-Resistant Brass Alloy

A low shrinkage corrosion-resistant brass alloy contains 58 to 64 wt % of copper; 0.1 to 0.3 wt % of tin; less than 0.25 wt % of lead; 0.01 to 0.15 wt % of phosphorus; and more than 97.5 wt % of copper and zinc; zinc and unavoidable impurities; and more than 98 wt % of copper and zinc. It is to be noted that at least two of nickel, niobium, zirconium and aluminum is in an amount ranging from 0.01 to 0.4 wt %. 1. A low shrinkage corrosion-resistant brass alloy comprising:58 to 64 wt % of copper;0.1 to 0.3 wt % of tin;less than 0.25 wt % of lead;0.01 to 0.15 wt % of phosphorus; andmore than 97.5 wt % of copper and zinc, wherein at least two of nickel, niobium, zirconium and aluminum is in an amount ranging from 0.01 to 0.4 wt %;zinc and unavoidable impurities; andmore than 98 wt % of copper and zinc.2. The low shrinkage corrosion-resistant brass alloy as claimed in claim 1 , wherein the niobium is in an amount ranging from 0.07 to 0.15 wt %.3. The low shrinkage corrosion-resistant brass alloy as claimed in claim 2 , wherein the nickel is in an amount ranging from 0.07 to 0.15 wt %.4. The low shrinkage corrosion-resistant brass alloy as claimed in claim 3 , wherein the lead is in an amount ranging from 0.08 to 0.2 wt %.5. The low shrinkage corrosion-resistant brass alloy as claimed in claim 4 , wherein the tin is in an amount ranging from 0.15 to 0.25 wt %.6. The low shrinkage corrosion-resistant brass alloy as claimed in claim 5 , wherein the phosphorus is in an amount ranging from 0.08 to 0.15 wt %.7. The low shrinkage corrosion-resistant brass alloy as claimed in claim 6 , wherein the zirconium is in an amount ranging from 0.07 to 0.15 wt %.8. The low shrinkage corrosion-resistant brass alloy as claimed in claim 7 , wherein the aluminum is in an amount ranging from 0.07 to 0.25 wt %.9. The low shrinkage corrosion-resistant brass alloy as claimed in claim 1 , wherein the nickel is in an amount ranging from 0.07 to 0.15 wt %.10. The low shrinkage corrosion-resistant ...

LOW LEAD ALLOY

A composition for a low lead ingot comprising primarily copper and including tin, zinc, sulfur, phosphorus, nickel. The composition may contain carbon. The low lead ingot, when solidified, includes sulfur or sulfur containing compounds such as sulfides distributed through the ingot. The presence and a substantially uniform distribution of these sulfur compounds imparts improved machinability and better mechanical properties. 1. An alloy composition consisting essentially of:a copper content of 82 wt % to 89 wt %;a tin content of 2.0 wt % to 4.0 wt %;a lead content of less than 0.09 wt %;a zinc content of 5.0 wt % to 14.0 wt %;an iron content of 0.4 wt % or less but greater than 0 wt %;an antimony content of 0.02 wt % or less but greater than 0 wt %;a nickel content of 0.5 wt % to 2.0 wt %;a sulfur content of 0.01 wt % to 0.65 wt %;a phosphorus content of 0.05 wt % or less but greater than 0 wt %;an aluminum content of 0.005 wt % or less but greater than 0 wt %;a silicon content of 0.005 wt % or less but greater than 0 wt %;a manganese content of 0.01% to 0.7 wt %;one or more of a zirconium content of 0.2 wt % or less but greater than 0 wt % and a boron content of 0.2 wt % or less but greater than 0 wt %;a carbon content of up to 0.1%; anda titanium content of up to 0.3%.2. The alloy composition of claim 1 , further wherein the iron content is 0.4 wt %.3. The alloy composition of claim 2 , further wherein the antimony content is 0.02 wt %.4. The alloy composition of claim 3 , further wherein the phosphorous content is 0.05 wt %.5. The alloy composition of claim 4 , further wherein the aluminum content is 0.005 wt %.6. The alloy composition of claim 5 , further wherein the silicon content is 0.005 wt %.7. The alloy composition of claim 6 , further wherein the zirconium content is 0.2 wt %.8. The alloy composition of claim 7 , further wherein the boron content is 0.2 wt %.9. The alloy composition of claim 8 , further wherein the carbon content is 0.1 wt %.10. The alloy ...

COPPER-ALLOY PLATE FOR TERMINAL/CONNECTOR MATERIAL, AND METHOD FOR PRODUCING COPPER-ALLOY PLATE FOR TERMINAL/CONNECTOR MATERIAL

A copper alloy sheet for terminal and connector materials contains 4.5 mass % to 12.0 mass % of Zn, 0.40 mass % to 0.9 mass % of Sn, 0.01 mass % to 0.08 mass % of P, and 0.20 mass % to 0.85 mass % of Ni with a remainder being Cu and inevitable impurities, a relationship of 11≦[Zn]+7.5×[Sn]+16×[P]+3.5×[Ni]≦19 is satisfied, a relationship of 7≦[Ni]/[P]≦40 is satisfied in a case in which the content of Ni is in a range of 0.35 mass % to 0.85 mass %, an average crystal grain diameter is in a range of 2.0 μm to 8.0 μm, an average particle diameter of circular or elliptical precipitates is in a range of 4.0 nm to 25.0 nm or a proportion of the number of precipitates having a particle diameter in a range of 4.0 nm to 25.0 nm in the precipitates is 70% or more, an electric conductivity is 29% IACS or more, a percentage of stress relaxation is 30% or less at 150° C. for 1000 hours as stress relaxation resistance, bending workability is R/t≦0.5 at W bending, solderability is excellent, and a Young's modulus is 100×10N/mmor more. 1. A copper alloy sheet for terminal and connector materials comprising:4.5 mass % to 12.0 mass % of Zn;0.40 mass % to 0.9 mass % of Sn;0.01 mass % to 0.08 mass % of P; and0.20 mass % to 0.85 mass % of Ni,with a remainder being Cu and inevitable impurities,wherein a content of Zn [Zn] (mass %), a content of Sn [Sn] (mass %), a content of P [P] (mass %) and a content of Ni [Ni] (mass %) have a relationship of 11≦[Zn]+7.5×[Sn]+16×[P]+3.5×[Ni]≦19, and the copper alloy sheet is a copper alloy sheet for terminal and connector materials which further has a relationship of 7≦[Ni]/[P]≦40 with regard to a content of Ni and a content of P in a case in which the content of Ni is in a range of 0.35 mass % to 0.85 mass %,an average crystal grain diameter is in a range of 2.0 μm to 8.0 μm,an average particle diameter of circular or elliptical precipitates is in a range of 4.0 nm to 25.0 nm or a proportion of the number of precipitates having a particle diameter in ...

Lower melting point binder metals

A copper, manganese, nickel, zinc and tin binder metal composition having a melting point of 1500° F. or less that includes zinc and tin at a sum weight of about 26.5% to about 30.5% in which zinc is at least about 12% and Sn is at least about 6.5%. The binder metal having a melting point of 1500° F. or less can be used at an infiltrating temperature of 1800° F. or less in forming drilling tools and tool components.

Copper alloy with high strength and excellent processability in bending and process for producing copper alloy sheet

The present invention provides a Cu—Fe—P alloy which has a high strength, high conductivity and superior bending workability. The copper alloy comprises 0.01 to 1.0% Fe, 0.01 to 0.4% P, 0.1 to 1.0% Mg, and the remainder Cu and unavoidable impurities. The size of oxides and precipitates including Mg in the copper alloy is controlled so that the ratio of the amount of Mg measured by a specified measurement method in the extracted residue by a specified extracted residue method to the Mg content in said copper alloy is 60% or less, thus endowing the alloy with a high strength and superior bending workability.

ANTIBACTERIAL SURFACE TREATED COPPER MATERIAL AND A METHOD FOR PREPARING THE SAME

A manufacturing method of an antibacterial surface treated copper material includes: etching a metal base material including copper; primary heat-treating the metal base material; coating the metal base material with a composition for a coating; and secondary heat-treating the metal base material. The composition for the coating includes an acryl resin at 40 wt % to 50 wt % and CuO at 1 wt % to 5 wt % for an entire weight of the composition for the coating. 1. A manufacturing method of an antibacterial surface treated copper material , the manufacturing method comprising:etching a metal base material including copper;primary heat-treating the metal base material;coating the metal base material with a composition for a coating; andsecondary heat-treating the metal base material,wherein the composition for the coating includes an acryl resin at 40 wt % to 50 wt % and CuO at 1 wt % to 5 wt % for an entire weight of the composition for the coating.2. The manufacturing method of claim 1 , whereinthe metal base material including copper is a brass including copper (Cu) at 65 wt % to 75 wt % and zinc (Zn) at 25 wt % to 35 wt % for the entire weight of the metal base material.3. The manufacturing method of claim 1 , whereinthe etching is performed for 1 minute to 10 minutes by using HCl at a 0.5 N to 3 N concentration.4. The manufacturing method of claim 1 , whereinthe primary heat treatment is performed at 150° C. to 200° C. for 1 hour to 2 hours.5. The manufacturing method of claim 1 , further comprisingdegreasing the metal base material after the primary heat treatment of the metal base material and before the coating of the metal base material with the composition for the coating.6. The manufacturing method of claim 5 , wherein{'sub': 3', '4, 'the degreasing is performed for 10 seconds to 10 minutes by using a NaPOaqueous solution of 25 g/l to 35 g/l.'}7. The manufacturing method of claim 1 , wherein{'sub': '2', 'the composition for the coating further includes a ...

WIRE MATERIAL CONSISTING OF A COPPER ALLOY, MESH AND BREEDING CAGE FOR AQUACULTURE

The invention relates to a wire material consisting of metallic material having an oxide surface, wherein the oxide surface of the wire material has a first oxide layer, which covers the metallic material at least in part and has a thickness of at least 200 nm to 2 μm, and the oxide surface of the wire material has a second oxide layer which covers metallic material in the regions which are not covered by the first oxide layer. According to the invention, the second oxide layer has a maximum thickness of 0.01 to 10% of the thickness of the first oxide layer. The invention furthermore relates to a mesh and a breeding cage for aquaculture. 1. A wire material consisting of metallic material having an oxide surface , characterizedin that the oxide surface of the wire material has a first oxide layer which partly covers the metallic material and has a thickness of at least from 200 nm to 2 pm andin that the oxide surface of the wire material has a second oxide layer which covers the metallic material in the regions which are not covered by the first oxide layer, where the second oxide layer has a thickness of from not more than 0.01 to 10% of the thickness of the first oxide layer.2. The wire material as claimed in claim 1 , characterized in that the first oxide layer is arranged in segments and/or bands on the surface of the wire material.3. The wire material as claimed in claim 1 , characterized in that the proportion by area of the first oxide layer in the oxide surface of the wire material is from 60 to 99%.4. The wire material as claimed in claim 3 , characterized in that the proportion by area of the first oxide layer in the oxide surface of the wire material is from 80 to 95%.5. The wire material as claimed in claim 1 , characterized in that the metallic material is a copper alloy.6. The wire material as claimed in claim 5 , characterized in that the copper alloy consists of (in % by weight):from 51.8 to 84.0% of Cufrom 15.5 to 36.0% of Zn,from 0.35 to 3.0% of Sn, ...

COINAGE ALLOY AND PROCESSING FOR MAKING COINAGE ALLOY

A coinage alloy for coinage includes nickel present in an amount from 13 wt. % to 16 wt. %, based on a total weight of the coinage alloy; zinc present in an amount from 25 wt. % to 32 wt. %, based on the total weight of the coinage alloy; manganese present in an amount from 1 wt. % to 4 wt. %, based on a total weight of the coinage alloy; copper; an electrical conductivity from 5% International Annealed Copper Standard (IACS) to 6% IACS; and a color comprising a yellowness vector b* that is from 5 to 10, based on a CIE L*a*b* color space and determined in accordance with ASTM Standard E308-15 (2015). 1. A coinage alloy for coinage comprising:nickel present in an amount from 13 wt. % to 16 wt. %, based on a total weight of the coinage alloy;zinc present in an amount from 25 wt. % to 32 wt. %, based on the total weight of the coinage alloy;manganese present in an amount from 1 wt. % to 4 wt. %, based on a total weight of the coinage alloy;copper;an electrical conductivity from 5% International Annealed Copper Standard (IACS) to 6% IACS measured in accordance with ASTM E1004-09 (2009); anda color comprising a yellowness vector b* that is from 5 to 10, based on a CIE L*a*b* color space and determined in accordance with ASTM Standard E308-15 (2015).2. The coinage alloy of claim 1 , wherein the copper is present in an amount as a balance of the total weight of the coinage alloy.3. The coinage alloy of claim 2 , wherein the copper is present in an amount from 46 wt. % to 61 wt. % claim 2 , based on the total weight of the coinage alloy.4. The coinage alloy of claim 1 , further comprising a disordered crystalline phase claim 1 ,wherein atoms of the nickel, copper, zinc, and manganese are randomly arranged in the disordered crystalline phase at room temperature in a post-annealed state.5. The coinage alloy of claim 4 , wherein the disordered crystalline phase comprises a single phase.6. The coinage alloy of claim 5 , wherein the single phase is a face-centered cubic phase.7. ...

COINAGE ALLOY AND PROCESSING FOR MAKING COINAGE ALLOY

A coinage alloy for coinage includes nickel present in an amount from 4 wt. % to 11 wt. %, based on a total weight of the coinage alloy; zinc present in an amount from 20 wt. % to 35 wt. %, based on the total weight of the coinage alloy; manganese present in an amount from 3 wt. % to 6 wt. %, based on a total weight of the coinage alloy; copper; an electrical conductivity from 5% International Annealed Copper Standard (IACS) to 6% IACS measured in accordance with ASTM E1004-09 (2009); and a color comprising a yellowness vector b* that is from 6 to 11, based on a CIE L*a*b* color space and determined in accordance with ASTM Standard E308-15 (2015). 1. A coinage alloy for coinage process comprising:nickel present in an amount from 4 wt. % to 14 wt. %, based on a total weight of the coinage alloy;zinc present in an amount from 20 wt. % to 35 wt. %, based on the total weight of the coinage alloy;manganese present in an amount from 1 wt. % to 10 wt. %, based on a total weight of the coinage alloy;copper;an electrical conductivity from 5% International Annealed Copper Standard (IACS) to 6% IACS measured in accordance with ASTM E1004-09 (2009); anda color comprising a yellowness vector b* that is from 6 to 11 based on a CIE L*a*b* color space and determined in accordance with ASTM Standard E308-15 (2015).2. The coinage alloy of claim 1 , wherein the copper is present in an amount as a balance of the total weight of the coinage alloy.3. The coinage alloy of claim 2 , wherein the copper is present in an amount from 46 wt. % to 73 wt. % claim 2 , based on the total weight of the coinage alloy.4. The coinage alloy of claim 1 , further comprising a disordered crystalline phase claim 1 ,wherein atoms of the nickel, copper, zinc, and manganese are randomly arranged in the disordered crystalline phase at room temperature in a post-annealed state.5. The coinage alloy of claim 4 , wherein the disordered crystalline phase comprises a single phase.6. The coinage alloy of claim 5 , ...

COINAGE CLADDING ALLOY AND PROCESSING FOR MAKING COINAGE CLADDING ALLOY

A coinage cladding alloy for coinage includes nickel present in an amount from 5 wt. % to 7 wt. %, based on a total weight of the coinage cladding alloy; zinc present in an amount from 21 wt. % to 29 wt. %, based on the total weight of the coinage cladding alloy; manganese present in an amount from 12 wt. % to 16 wt. %, based on a total weight of the coinage cladding alloy; copper; an electrical conductivity from 2% International Annealed Copper Standard (IACS) to 3% IACS; and a color comprising a yellowness vector b* that is from 2 to 10, based on a CIE L*a*b* color space and determined in accordance with ASTM Standard E308-15 (2015). 1. A coinage cladding alloy for coinage comprising:nickel present in an amount from 5 wt. % to 7 wt. %, based on a total weight of the coinage cladding alloy;zinc present in an amount from 21 wt. % to 29 wt. %, based on the total weight of the coinage cladding alloy;manganese present in an amount from 12 wt. % to 16 wt. %, based on a total weight of the coinage cladding alloy;copper;an electrical conductivity from 2% International Annealed Copper Standard (IACS) to 3% IACS measured in accordance with ASTM E1004-09 (2009); anda color comprising a yellowness vector b* that is from 2 to 10, based on a CIE L*a*b* color space and determined in accordance with ASTM Standard E308-15 (2015).2. The coinage cladding alloy of claim 1 , wherein the copper is present in an amount as a balance of the total weight of the coinage cladding alloy.3. The coinage cladding alloy of claim 2 , wherein the copper is present in an amount from 50 wt. % to 60 wt. % claim 2 , based on the total weight of the coinage cladding alloy.4. The coinage cladding alloy of claim 1 , further comprising a disordered crystalline phase claim 1 ,wherein atoms of the nickel, copper, zinc, and manganese are randomly arranged in the disordered crystalline phase at room temperature in a post-annealed state.5. The coinage cladding alloy of claim 4 , wherein the disordered ...

COPPER ALLOY FOR ELECTRIC AND ELECTRONIC DEVICE, COPPER ALLOY SHEET FOR ELECTRIC AND ELECTRONIC DEVICE, CONDUCTIVE COMPONENT FOR ELECTRIC AND ELECTRONIC DEVICE, AND TERMINAL

A copper alloy for electric and electronic devices includes: Zn from more than 2 mass % to less than 23 mass %; Sn at 0.1 mass % or more and 0.9 mass % or less; Ni at 0.05 mass % or more and less than 1.0 mass %; Fe at 0.001 mass % or more and less than 0.10 mass %; P at 0.005 mass % or more and 0.1 mass % or less; and a balance including Cu and unavoidable impurities, wherein a ratio Fe/Ni satisfies 0.002≦Fe/Ni<1.5 by atomic ratio, a ratio (Ni+Fe)/P satisfies 3<(Ni+Fe)/P<15 by atomic ratio, a ratio Sn/(Ni+Fe) satisfies 0.3 Подробнее

Method for inhibiting dezincification of brass

A brass alloy with dezincification inhibition capability and good cutting and mechanical properties is provided. The brass alloy includes niobium and brass. Niobium is in an amount ranging from 0.01 to 0.15 part by weight and brass is in an amount ranging from 99.85 to 99.99 parts by weight based on 100 parts by weight of the brass alloy.

COPPER ALLOY SHEET AND METHOD OF MANUFACTURING COPPER ALLOY SHEET

A copper alloy sheet according to one aspect contains 28.0 mass % to 35.0 mass % of Zn, 0.15 mass % to 0.75 mass % of Sn, 0.005 mass % to 0.05 mass % of P, and a balance consisting of Cu and unavoidable impurities, in which relationships of 44≧[Zn]+20×[Sn]≧37 and 32≦[Zn]+9×([Sn]−0.25)≦37 are satisfied. The copper alloy sheet according to the aspect is manufactured by a manufacturing process including a finish cold-rolling process of cold-rolling a copper alloy material, an average grain size of the copper alloy material is 2.0 μm to 7.0 μm, and a sum of an area ratio of a β phase and an area ratio of a γ phase in a metallographic structure of the copper alloy material is 0% to 0.9%. 1. A copper alloy sheet which is manufactured by a manufacturing process including a finish cold-rolling process of cold-rolling a copper alloy material ,wherein an average grain size of the copper alloy material is 2.0 μm to 7.0 μm,a sum of an area ratio of a β phase and an area ratio of a γ phase in a metallographic structure of the copper alloy material is 0% to 0.9%,the copper alloy sheet contains 28.0 mass % to 35.0 mass % of Zn, 0.15 mass % to 0.75 mass % of Sn, 0.005 mass % to 0.05 mass % of P, and a balance consisting of Cu and unavoidable impurities, and{'sup': '1/2', 'a Zn content [Zn] (mass %) and a Sn content [Sn] (mass %) satisfy relationships of 44≧[Zn]+20×[Sn]≧37 and 32≦[Zn]+9×([Sn]−0.25)≦37.'}2. A copper alloy sheet which is manufactured by a manufacturing process including a finish cold-rolling process of cold-rolling a copper alloy material ,wherein an average grain size of the copper alloy material is 2.0 μm to 7.0 μm,a sum of an area ratio of a β phase and an area ratio of a γ phase in a metallographic structure of the copper alloy material is 0% to 0.9%,the copper alloy sheet contains 28.0 mass % to 35.0 mass % of Zn, 0.15 mass % to 0.75 mass % of Sn, 0.005 mass % to 0.05 mass % of P, either or both of 0.005 mass % to 0.05 mass % of Co and 0.5 mass % to 1.5 mass % of ...

COPPER-ALLOY PLATE FOR TERMINAL/CONNECTOR MATERIAL, AND METHOD FOR PRODUCING COPPER-ALLOY PLATE FOR TERMINAL/CONNECTOR MATERIAL

A copper alloy sheet for terminal and connector materials contains 4.5 mass % to 12.0 mass % of Zn, 0.40 mass % to 0.9 mass % of Sn, 0.01 mass % to 0.08 mass % of P, and 0.20 mass % to 0.85 mass % of Ni with a remainder being Cu and inevitable impurities, a relationship of 11≦[Zn]+7.5×[Sn]+16×[P]+3.5×[Ni]≦19 is satisfied, a relationship of 7≦[Ni]/[P]≦40 is satisfied in a case in which the content of Ni is in a range of 0.35 mass % to 0.85 mass %, an average crystal grain diameter is in a range of 2.0 μm to 8.0 μm, an average particle diameter of circular or elliptical precipitates is in a range of 4.0 nm to 25.0 nm or a proportion of the number of precipitates having a particle diameter in a range of 4.0 nm to 25.0 nm in the precipitates is 70% or more, an electric conductivity is 29% IACS or more, a percentage of stress relaxation is 30% or less at 150° C. for 1000 hours as stress relaxation resistance, bending workability is R/t≦0.5 at W bending, solderability is excellent, and a Young's modulus is 100×10N/mmor more. 15-. (canceled)6. A method for manufacturing a copper alloy sheet for terminal and connector materials , the method comprising , in this order:a hot rolling step;a cold rolling step;a recrystallization thermal treatment step; anda cold finish rolling step,{'sup': −1/2', '1/2, 'wherein a hot rolling initial temperature is in a range of 800° C. to 940° C. in the hot rolling step, a cooling rate of a copper alloy material in a temperature range of a temperature after final rolling to 350° C. or 650° C. to 350° C. is 1° C./second or more, a percentage of cold working is 55% or more in the cold rolling step, the recrystallization thermal treatment step includes: a heating step for heating the copper alloy material to a predetermined temperature; a holding step for holding the copper alloy material at a predetermined temperature for a predetermined time after the heating step; and a cooling step for cooling the copper alloy material to a predetermined ...

ALUMINUM COPPER CLAD MATERIAL

An aluminum copper clad material has excellent bonding strength and includes an aluminum layer and a copper layer that are bonded without a nickel layer interposed therebetween. The aluminum layer and the copper layer are diffusion-bonded via an Al—Cu intermetallic compound layer. The copper layer satisfies Dcs≦0.5×Dcc, where Dcc represents the average crystal grain size of crystal grains in a central portion in the thickness direction of the copper layer, and Dcs represents the average crystal grain size of an interface adjacent portion C in the copper layer that is about 0.5 μm apart from the interface between the copper layer and the intermetallic compound layer. The intermetallic compound layer has an average thickness of about 0.5 μm to about 10 μm. 1. A method for producing an aluminum copper clad material in which an aluminum layer and a copper layer are diffusion-bonded via an Al—Cu intermetallic compound layer , the method comprising the steps of:preparing an aluminum plate that serves as a source of the aluminum layer and a copper plate that serves as a source of the copper layer; pressure-welding the aluminum plate and the copper plate that are stacked on each other; anddiffusion-annealing the resulting pressure-welded material; wherein the copper plate satisfies Hc≧1.6×Hca, where Hc (Hv) represents an average surface hardness of a surface on a pressure-welded side of the copper plate, and Hca (Hv) represents an average surface hardness of a completely annealed material of the copper plate; and [{'br': None, 'tmin≦t≦tmax'}, {'br': None, 'i': t', 'T+, 'max=−1.03×567'}, {'br': None, 'i': t', 'T+, 'min=0.5, when −0.19×86<0.5,'}, {'br': None, 'i': t', 'T+', 'T+, 'min=−0.19×86, when −0.19×86≧0.5.'}], 'the diffusion annealing is carried out at an annealing temperature T(° C.) of about 150° C. to about 550° C. for an annealing time t(min) in a range satisfying the following expressions2. A method for producing an aluminum copper clad material in which an ...

PLUG-IN CONNECTOR AND SEMI-FINISHED PRODUCT MADE FROM AN ALUMINUM ALLOY STRIP

A plug-in connector and a semi-finished product include a strip of an aluminum alloy and at least one bonding layer of a copper/tin alloy electrolytically applied directly onto the aluminum alloy strip. The bonding layer has a thickness of at most 50 nm. A further metal layer or alloy layer is applied onto the bonding layer. 1. A plug-in connector , comprising:a strip of an aluminum alloy;at least one bonding layer of a copper/tin alloy electrolytically applied directly onto said aluminum alloy strip, said bonding layer having a thickness of at most 50 nm; anda further metal layer or alloy layer applied onto said bonding layer.2. The plug-in connector according to claim 1 , wherein said copper/tin alloy contains CuSn or CuSn.3. The plug-in connector according to claim 1 , wherein said copper/tin alloy is formed of CuSn or of CuSntogether with unavoidable impurities.4. The plug-in connector according to claim 1 , wherein said bonding layer has grains with a grain size in a range of from 10 to 30 nm.5. The plug-in connector according to claim 1 , wherein said aluminum alloy strip contains at least 80 wt % aluminum.6. The plug-in connector according to claim 1 , wherein said aluminum alloy strip contains at least 90 wt % aluminum.7. The plug-in connector according to claim 1 , wherein said aluminum alloy strip contains at least 95 wt % aluminum.8. The plug-in connector according to claim 1 , wherein said further metal layer or alloy layer contains a metal or an alloy selected from the group consisting of silver claim 1 , silver/tin claim 1 , silver/antimony claim 1 , gold claim 1 , gold/cobalt claim 1 , copper claim 1 , nickel claim 1 , nickel/phosphorus claim 1 , nickel/tungsten claim 1 , indium claim 1 , lead claim 1 , palladium/nickel claim 1 , tin claim 1 , tin/lead and zinc.9. A semi-finished product for producing a plug-in connector claim 1 , the semi-finished product comprising:a strip of an aluminum alloy;at least one bonding layer of a copper/tin alloy ...

Gaseous sulfur treatment methods for copper zinc alloys

A method of making a corrosion resistant brass component that includes the steps: forming a gaseous atmosphere containing labile sulfur by combustion of potassium bisulfate or hydrogen sulfide; and contacting surfaces of a finished brass component with the gaseous atmosphere containing labile sulfur. The surfaces of the brass component are contacted with the gaseous atmosphere at an elevated temperature for a time sufficient to form a metal-sulfide rich layer of at least 5 microns in thickness. Further, the brass component is corrosion resistant after the contacting step as determined by standardized testing that yields dezincification penetration of less than 200 microns in depth.

LOW-LEAD BRASS ALLOY FOR USE IN MEMBER FOR WATER WORKS

An object of the present invention is to provide a brass alloy, in which the content of Bi is reduced to secure a good recyclability while maintaining the dezincification corrosion resistance required for a member for water works, and which is capable of exhibiting an erosion-corrosion resistance and excellent mechanical properties to be used as a member for water works. This brass alloy contains: 24% by mass or more and 34% by mass or less of Zn; 0.5% by mass or more and 1.7% by mass or less of Sn; 0.4% by mass or more and 1.8% by mass or less of Al; 0.005% by mass or more and 0.2% by mass or less of P; and 0.01% by mass or more and 0.25% by mass or less of Pb; with the balance being copper and an unavoidable impurity(ies). 1. A low-lead brass alloy for use in a member for water works , the brass alloy comprising: 24% by mass or more and 34% by mass or less of Zn; 0.5% by mass or more and 1.7% by mass or less of Sn; 0.4% by mass or more and 1.8% by mass or less of Al; 0.005% by mass or more and 0.2% by mass or less of P; and 0.01% by mass or more and 0.25% by mass or less of Pb; with the balance being copper and an unavoidable impurity(ies); {'br': None, 'Al+2×Sn≧2.8\u2003\u2003(1).'}, 'wherein, in cases where the brass alloy has a content of Sn of less than 1.0% by mass, the contents of Al and Sn in % by mass satisfy the following Inequality (1)2. The low-lead brass alloy for use in a member for water works according to claim 1 , wherein the content of Sn is 1.0% by mass or more.3. The low-lead brass alloy for use in a member for water works according to claim 1 , further comprising 0.0005% by mass or more and 0.015% by mass or less of B.4. The low-lead brass alloy for use in a member for water works according to claim 1 , further comprising 0.1% by mass or more and 1.8% by mass or less of Ni.5. The low-lead brass alloy for use in a member for water works according to claim 2 , further comprising 0.0005% by mass or more and 0.015% by mass or less of B.6. The low- ...

Corrosion Resistant Electrodes for Laser Chambers

Corrosion resistant electrodes are formed of brass that has been doped with phosphorus, arsenic, antimony, or combinations thereof. The electrodes are formed of brass that contains about 100 ppm to about 1,000 ppm of phosphorus, arsenic, or antimony, and the brass has no visible microporosity at a magnification of 400×. The brass may be cartridge brass that contains about 30 weight percent of zinc and the balance copper. Corrosion resistant electrodes also may be formed by subjecting brass to severe plastic deformation to increase the resistance of the brass to plasma corrosion. The corrosion resistant electrodes can be used in laser systems to generate laser light. 1. An electrode , comprising:a body of the electrode having an elongated surface formed of brass that contains about 100 ppm to about 1,000 ppm of arsenic or antimony, the brass having no visible microporosity at a magnification of 400×, and the brass exhibiting increased resistance to plasma corrosion relative to cartridge brass that has not been doped with arsenic or antimony.2. An electrode , comprising:a body of the electrode having an elongated surface, the body of the electrode being formed of a material consisting essentially of 29.7 weight percent to 30.3 weight percent of zinc, 120 ppm to 370 ppm of arsenic or antimony, less than 100 ppm of impurities, and the balance copper, wherein the material has no visible microporosity at a magnification of 400×, and the material exhibits increased resistance to plasma corrosion relative to cartridge brass that has not been doped with arsenic or antimony.3. An electrode , comprising:{'sup': '2', 'a body of the electrode having an elongated surface formed of brass that contains about 100 ppm to about 1,000 ppm of arsenic or antimony, the brass having less than 30 inclusions per mmand each inclusion has a diameter that does not exceed about 5 microns, and the brass exhibiting increased resistance to plasma corrosion relative to cartridge brass that has not ...

MASTER ALLOY FOR CASTING A MODIFIED COPPER ALLOY AND CASTING METHOD USING THE SAME

An advantage of the invention is to provide a master alloy used in a casting of a modified copper alloy, grains of which can be refined during a melt-solidification, and also a method of casting a modified copper alloy using the same. 113-. (canceled)1. A method of casting a modified copper alloy from a molten copper alloy containing Zr and P , the method comprising the steps of:providing a molten copper alloy including Cu: 40 to 80%, Zr: 0.5 to 35% and the balance of Zn;adding at least Zr in the form of Cu—Zn—Zr or Cu—Zn—Zr—P alloy into said molten copper alloy; andcasting said molten copper alloy.2. The method of casting a modified copper alloy from a molten copper alloy containing Zr and P according to claim 1 ,wherein Zr is added in the form of Cu—Zn—Zr—P alloy and concentration of the metal Zr in the molten alloy is in a range of 5 ppm or more in the presence of P when the molten copper alloy begins to solidify.3. The method of casting a modified copper alloy from a molten copper alloy containing Zr and P according to claim 2 ,wherein the concentration of the metal Zr in the molten alloy is in a range of 20 to 500 ppm in the presence of P when the molten copper alloy begin to solidify.4. A master alloy for casting a copper alloy claim 2 , comprising:Cu: 40 to 80%, Zr: 0.5 to 35% and the balance of Zn,wherein when the master alloy is cast, the resulting copper alloy cast includes refined grain having a grain size of 50 μm or less,wherein 0.2% proof strength of the resulting copper alloy cast is improved by 10% or more, comparing to a copper alloy cast obtained without grain refinement.5. A copper alloy cast obtained by using the master alloy comprising Cu: 40 to 80% claim 2 , Zr: 0.5 to 35% and the balance of Zn claim 2 ,wherein the copper alloy cast includes refined grains having a grain size of 50 μm or less. The present invention relates to a master alloy used for casting a modified copper alloy having refined grains, which is used in a casting method such as ...

COPPER ALLOY FOR USE IN A MEMBER FOR USE IN WATER WORKS

Provided is a copper alloy for use in a member for water works, which has not only a reduced lead content and the lowest possible Ni content, but also a reduced Bi content, and which still exhibits suitable properties. The copper alloy includes: less than 0.5% by mass of Ni; 0.2% by mass or more and 0.9% by mass or less of Bi; 12.0% by mass or more and 20.0% by mass or less of Zn; 1.5% by mass or more and 4.5% by mass or less of Sn; and 0.005% by mass or more and 0.1% by mass or less of P; wherein the total content of Zn and Sn is 21.5% by mass or less, and the balance is a trace element(s) and Cu. 1. A copper alloy for use in a member for water works , said copper alloy comprising: less than 0.5% by mass of Ni; 0.2% by mass or more and 0.9% by mass or less of Bi;12.0% by mass or more and 20.0% by mass or less of Zn; 1.5% by mass or more and 4.5% by mass or less of Sn; and 0.005% by mass or more and 0.1% by mass or less of P;wherein a total content of Zn and Sn is 21.5% by mass or less, the balance being trace elements and Cu.2. The copper alloy for use in a member for water works according to claim 1 , wherein one of the trace elements is 0.0003% by mass or more and 0.006% by mass or less of B. The present invention relates to a material for use in a member for water works, which is made of a copper alloy and in which the level of lead leaching is not more than a stipulated value.JIS H5120 CAC406, a bronze alloy which has been conventionally used for parts in materials and equipment for water works and in feed water supply system, contains from 4.0 to 6.0% by weight of lead, and the lead leaching therefrom into the tap water has been frequently observed. Therefore, in order to reduce the amount of toxic lead leaching, the production of a copper alloy containing a reduced amount of lead, or a lead-free copper alloy which contains no lead has been investigated.However, when a copper alloy is produced without or with a reduced amount of lead, the castability, ...

LEAD-FREE, HIGH-SULPHUR AND EASY-CUTTING COPPER-MANGANESE ALLOY AND PREPARATION METHOD THEREOF

Disclosed are a lead-free, high-sulphur and easy-cutting copper-manganese alloy and preparation method thereof. The alloy comprises the following components in percentage by weight: 52.0-95.0 wt. % of copper, 0.01-0.20 wt. % of phosphorus, 0.01-20 wt. % of tin, 0.55-7.0 wt. % of manganese, 0.191-1.0 wt. % of sulphur, one or more metals other than zinc that have an affinity to sulphur less than the affinity of manganese to sulphur, with the sum of the contents thereof no more than 2.0 wt. %, and the balance being zinc and inevitable impurities, wherein the metals other than zinc that have an affinity to sulphur less than the affinity of manganese to sulphur are nickel, iron, tungsten, cobalt, molybdenum, antimony, bismuth and niobium. The copper alloy is manufactured by a powder metallurgy method, in which after uniformly mixing the alloy powder, sulphide powder and nickel powder, pressing and shaping, sintering, re-pressing, and re-sintering are carried out to obtain the copper alloy, and the resulting copper alloy is thermally treated. 1. A lead-free , high-sulphur and easy-cutting copper-manganese alloy , wherein: the alloy comprises the following components in percentage by weight are Cu 52.0-95.0 wt. % , P 0.001-0.20 wt. % , Sn 0.01-20 wt. % , Mn 0.55-7.0 wt. % , S 0.191-1.0 wt. %; one or more metals other than Zn that have an affinity to sulphur less than the affinity of manganese to sulphur , with the sum of the contents thereof not more than 2.0 wt. % , and the balance being Zn and inevitable impurities , where Pb is not more than 0.05 wt. %.2. The lead-free claim 1 , high-sulphur and easy-cutting copper-manganese alloy according to claim 1 , wherein: the said metals other than Zn that have an affinity to sulphur less than the affinity of manganese to sulphur are Ni claim 1 , Fe claim 1 , W claim 1 , Co claim 1 , Mo claim 1 , Sb claim 1 , Bi and Nb.3. The lead-free claim 2 , high-sulphur and easy-cutting copper-manganese alloy according to claim 2 , wherein: ...

FINE CRYSTALLITE HIGH-FUNCTION METAL ALLOY MEMBER AND METHOD FOR MANUFACTURING SAME

Provided by the present invention are a fine crystallite high-function metal alloy member, a method for manufacturing the same, and a business development method thereof, in which a crystallite of a metal alloy including a high-purity metal alloy whose crystal lattice is a face-centered cubic lattice, a body-centered cubic lattice, or a close-packed hexagonal lattice is made fine with the size in the level of nanometers (10m to 10m) and micrometers (10m to 10m), and the form thereof is adjusted, thereby remedying drawbacks thereof and enhancing various characteristics without losing superior characteristics owned by the alloy. 127-. (canceled)28. A fine crystallite high-function metal alloy member , wherein a metal alloy including a high-purity metal alloy whose crystal lattice is a face-centered cubic lattice , a body-centered cubic lattice , or a close-packed hexagonal lattice is made to contain therein 5 to 30000 ppm of gadolinium (Gd) , and the crystallite thereof is made fine with the size in the level of nanometers (10m to 10m) and micrometers (10m to 10m).29. A method for producing a fine crystallite high-function metal alloy member , wherein the method comprises:adding 5 to 30000 ppm of gadolinium (Gd) to a metal alloy including a high-purity metal alloy whose crystal lattice is a face-centered cubic lattice, a body-centered cubic lattice, or a close-packed hexagonal lattice; and{'sup': −9', '−6', '−6', '−3, 'cast-molding an obtained material to make a crystallite thereof fine with the size in the level of nanometers (10m to 10m) and micrometers (10m to 10m).'}30. The method according to claim 29 , wherein said metal alloy is a metal alloy including a high-purity metal alloy whose crystal lattice is a face-centered cubic lattice.31. The method according to claim 29 , wherein said metal alloy including a high-purity metal alloy is a metal alloy including a high-purity metal alloy of a metal selected from the group consisting of gold (Au) claim 29 , silver (Ag ...

FREE-CUTTING COPPER ALLOY, AND METHOD FOR PRODUCING FREE-CUTTING COPPER ALLOY

This free-cutting copper alloy contains 76.0%-79.0% Cu, 3.1%-3.6% Si, 0.36%-0.84% Sn, 0.06%-0.14% P, 0.022%-0.10% Pb, with the remainder being made up of Zn and unavoidable impurities. The composition satisfies the following relations: 74.4≤f1=Cu+0.8×Si−8.5×Sn+P+0.5×Pb≤78.2, 61.2≤f2=Cu−4.4×Si−0.7×Sn−P+0.5×Pb≤62.8, 0.09≤f3=P/Sn≤0.35. The area ratio (%) of the constituent phases satisfies the following relations: 30≤κ≤65, 0≤γ≤2.0, 0≤β≤0.3, 0≤μ≤2.0, 96.5≤f4=α+κ, 99.4≤f5=α+κ+γ+μ, 0≤f6=γ+μ≤3.0, 36≤f7=1.05×κ+6×γ+0.5×μ≤72. The κ phase is present within the α phase, the long side of the γ phase does not exceed 50 μm, and the long side of the μ phase does not exceed 25 μm. 1. A free-cutting copper alloy worked material that is obtained by performing any one or both of cold working and hot working , the free-cutting copper alloy worked material comprising:76.0 mass % to 79.0 mass % of Cu;3.1 mass % to 3.6 mass % of Si;0.36 mass % to 0.84 mass % of Sn;0.06 mass % to 0.14 mass % of P;0.022 mass % to 0.10 mass % of Pb; anda balance including Zn and inevitable impurities,wherein a total amount of Fe, Mn, Co, and Cr as the inevitable impurities is lower than 0.08 mass %, [{'br': None, 'i': 'f', '74.4≤1=[Cu]+0.8×[Si]−8.5×[Sn]+[P]+0.5×[Pb]≤78.2,'}, {'br': None, 'i': 'f', '61.2≤2=[Cu]−4.4×[Si]−0.7×[Sn]−[P]+0.5×[Pb]≤62.8, and'}, {'br': None, 'i': 'f', '0.09≤3=[P]/[Sn]≤0.35'}], 'when a Cu content is represented by [Cu] mass %, a Si content is represented by [Si] mass %, a Sn content is represented by [Sn] mass %, a P content is represented by [P] mass %, and a Pb content is represented by [Pb] mass %, the relations of'}are satisfied, [{'br': None, '30≤(κ)≤65,'}, {'br': None, '0≤(γ)≤2.0,'}, {'br': None, '0≤(β)≤0.3,'}, {'br': None, '0≤(μ)≤2.0,'}, {'br': None, 'i': 'f', '96.5≤4=(α)+(κ),'}, {'br': None, 'i': 'f', '99.4≤5=(α)+(κ)+(γ)+(μ),'}, {'br': None, 'i': 'f', '0≤6=(γ)+(μ)≤3.0, and'}, {'br': None, 'i': 'f', 'sup': '1/2', '36≤7=10.05×(κ)+6×(γ)+0.5×(μ)≤72'}], 'in constituent phases of ...

COPPER ALLOY FOR ELECTRONIC/ELECTRICAL EQUIPMENT, COPPER ALLOY THIN SHEET FOR ELECTRONIC/ELECTRICAL EQUIPMENT, CONDUCTIVE COMPONENT FOR ELECTRONIC/ELECTRICAL EQUIPMENT, AND TERMINAL

One aspect of this copper alloy for an electronic and electrical equipment contains: more than 2.0 mass % to 36.5 mass % of Zn; 0.10 mass % to 0.90 mass % of Sn; 0.15 mass % to less than 1.00 mass % of Ni; and 0.005 mass % to 0.100 mass % of P, with the balance containing Cu and inevitable impurities, wherein atomic ratios of amounts of elements satisfy 3.0 Подробнее

LEAD-FREE COPPER-ZINC ALLOY THAT CAN WITHSTAND THE MARINE ENVIRONMENT

The invention provides a copper-zinc alloy with low lead content useful in the manufacture of wire used in the manufacture of cages for aquaculture, where said wire suffers the least deterioration due to loss of zinc during exposure to stagnant water, water of little movement or sea waters. 1. A matter composition comprises between about 64% to 66.15% Cu; between 32% to 34.5% of Zinc , with an impurity content of 0.5% to 2% consisting mainly of Pb , Sn , Ni , Sb; Fe.3. A composition of matter according to claim 1 , having a fine and homogeneous grain with an average grain size of 33 μm claim 1 ,4. A useful wire for the manufacture of cages for aquaculture claim 1 , manufactured with an alloy comprising about 64% to 66.15% Cu; between 32% to 34.5% of Zinc claim 1 , with an impurity content of 0.5% to 2% consisting mainly of Pb claim 1 , Sn claim 1 , Ni claim 1 , Sb; Fe.5. A useful wire for the manufacture of cages for aquaculture claim 2 , made of the copper-zinc alloy of .6. A wire according to claim 4 , having properties of tensile strength of 583.5 NiPa and 31% elongation.7. A wire according to claim 4 , having an average hardness value of 72 HRB and a micro hardness of 141.3 HV in the cross section and 138 HV in the longitudinal section and on average 140 HV.8. A process for the manufacture of alloy according to claim 1 , comprising melting in a stationary casting furnace cooled by a water sleeve claim 1 , a mixture of 64% to 66.15% Cu; of 32% to 34.5% of Zinc claim 1 , with an impurity content of 0.5% to 2% consisting mainly of Pb claim 1 , Sn claim 1 , Ni claim 1 , Sb; Fe.9. The process according to claim 8 , wherein the furnace is an electric induction furnace that brings the broth to a temperature of 1100° C. claim 8 , so that after a homogenization period claim 8 , the broth reaches a discharge temperature of 1010° C.10. The process according to claim 8 , wherein the broth is poured into a vertical mold and cooled by means of a sleeve with water circulation. ...

BONDING WIRE FOR SEMICONDUCTOR DEVICE

A bonding wire for a semiconductor device includes a Cu alloy core material and a Pd coating layer formed on a surface thereof. Containing an element that provides bonding reliability in a high-temperature environment improves the bonding reliability of the ball bonded part in high temperature. Furthermore, making an orientation proportion of a crystal orientation <100> angled at 15 degrees or less to a wire longitudinal direction among crystal orientations in the wire longitudinal direction 30% or more when measuring crystal orientations on a cross-section of the core material in a direction perpendicular to a wire axis of the bonding wire, and making an average crystal grain size in the cross-section of the core material in the direction perpendicular to the wire axis of the bonding wire 0.9 to 1.5 μm provides a strength ratio of 1.6 or less. 1. A bonding wire for a semiconductor device , the bonding wire comprising:a Cu alloy core material; anda Pd coating layer formed on a surface of the Cu alloy core material, whereinwhen measuring crystal orientations on a cross-section of the core material in a direction perpendicular to a wire axis of the bonding wire, a crystal orientation <100> angled at 15 degrees or less to a wire longitudinal direction has a proportion of 30% or more among crystal orientations in the wire longitudinal direction,an average crystal grain size in the cross-section of the core material in the direction perpendicular to the wire axis of the bonding wire is 0.9 μm or more and 1.5 μm or less, andthe bonding wire contains one or more elements selected from Co, Rh, Ir, Ni, Pd, Pt, Ag, Au, Zn, Al, In, Sn, P, As, Sb, Bi, Se and Te.2. The bonding wire for a semiconductor device according to claim 1 , wherein a strength ratio defined by the following Equation (1) is 1.1 or more and 1.6 or less:{'br': None, 'Strength ratio=ultimate strength/0.2% offset yield strength.\u2003\u2003(1)'}3. The bonding wire for a semiconductor device according to claim 1 ...

Crimped Terminal

A crimped terminal is provided and includes a conductor, a crimped element, and a plurality of conductive particles: The conductor includes aluminium, and the crimped element is disposed around the conductor. The plurality of conductive particles include a copper alloy and are arranged between the conductor and the crimped element.

LOW-LEAD BISMUTH-FREE SILICON-FREE BRASS

The invention relates to a low-lead bismuth-free silicon-free brass alloy with excellent cutting performance, comprising, by the total weight of the brass alloy, 60-65 wt % copper, 0.1-0.25 wt % lead, 0.1-0.7 wt % aluminum, 0.05-0.5 wt % tin, one or more element selected from the group consisting of 0.05-0.3 wt % phosphorus, 0.05-0.5 wt % manganese and 0.001-0.01 wt % boron, and a balance of zinc. 1. A low-lead bismuth-free silicon-free brass alloy with excellent cutting performance , characterized by comprising: by the total weight of the brass alloy , 60-65 wt % copper , 0.1-0.25 wt % lead , 0.1-0.7 wt % aluminum and 0.05-0.5 wt % tin , and a balance of zinc.2. The brass alloy of claim 1 , characterized by further comprising 0.05-0.5 wt % manganese and/or 0.05-0.3 wt % phosphorus by the total weight of the brass alloy.3. The brass alloy of claim 1 , characterized by further comprising one or more element selected from the group consisting of 0.05-0.3 wt % phosphorus claim 1 , 0.05-0.5 wt % manganese and 0.001-0.01 wt % boron by the total weight of the brass alloy.4. The brass alloy of claim 1 , characterized by further comprising 0.05-0.3 wt % phosphorus claim 1 , 0.05-0.5 wt % manganese and 0.001-0.01 wt % boron by the total weight of the brass alloy.5. The brass alloy of claim 4 , characterized by further comprising: unavoidable impurities which comprise claim 4 , by the total weight of the brass alloy claim 4 , 0.25 wt % or less nickel claim 4 , 0.15 wt % or less chrome and/or 0.25 wt % or less iron.6. The brass alloy of claim 4 , characterized in that a total content of manganese claim 4 , aluminum claim 4 , tin claim 4 , phosphorus and boron is not larger than 2 wt % of the total weight of the brass alloy.7. The brass alloy of claim 6 , characterized in that the total content of manganese claim 6 , aluminum claim 6 , tin claim 6 , phosphorus and boron is not less than 0.1 wt % of the total weight of the brass alloy.8. A low-lead bismuth-free silicon-free ...