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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Поддерживает ввод нескольких поисковых фраз (по одной на строку). При поиске обеспечивает поддержку морфологии русского и английского языка
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Применить Всего найдено 10478. Отображено 100.
12-01-2012 дата публикации

Resin complex and laminate

Номер: US20120009385A1
Автор: Masataka Satou, Mitsuyuki Tsurumi
Принадлежит: Fujifilm Corp

A resin complex which is capable of being plated, is highly hydrophobic, and has excellent molding properties and good adhesion to a plated layer, a laminate including a layer of the resin complex, and a method of manufacturing the laminate are provided. The resin complex capable of being plated includes a hydrophobic compound A having a functional group capable of interacting with a plating catalyst, its precursor or a metal, and a hydrophobic resin B incompatible with the hydrophobic compound A. The resin complex has a phase-separated morphology in which the hydrophobic compound A forms a dispersed phase and the hydrophobic resin B forms a continuous phase and the hydrophobic compound A is exposed on at least part of a surface of the resin complex.

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Номер записи: 1
02-02-2012 дата публикации

Composition for metal plating comprising suppressing agent for void free submicron feature filling

Номер: US20120024711A1
Автор: Alexandra Haag, Charlotte Emnet, Cornelia Roeger-Goepfert, Dieter Mayer, Roman Benedikt Raether
Принадлежит: BASF SE

A composition for filling submicrometer sized features having an aperture size of 30 nanometers or less comprising a source of copper ions, and at least one suppressing agent selected from compounds of formula (I) wherein the R1 radicals are each independently selected from a copolymer of ethylene oxide and at least one further C3 to C4 alkylene oxide, said copolymer being a random copolymer. the R2 radicals are each independently selected from R1 or alkyl. X and Y are spacer groups independently, and X for each repeating unit independently, selected from C1 to C6 alkylen and Z—(O—Z)m wherein the Z radicals are each independently selected from C2 to C6 alkylen, n is an integer equal to or greater than 0. m is an integer equal to or greater than 1.

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Номер записи: 2
02-02-2012 дата публикации

Composition for metal plating comprising suppressing agent for void free submicron feature filling

Номер: US20120027948A1
Автор: Alexandra Haag, Charlotte Emnet, Cornelia Roeger-Goepfert, Dieter Mayer, Roman Benedikt Raether
Принадлежит: BASF SE

A composition comprising a source of metal ions and at least one suppressing agent obtainable by reacting a) an amine compound comprising active amino functional groups with b) a mixture of ethylene oxide and at least one compound selected from C3 and C4 alkylene oxides, said suppressing agent having a molecular weight M w of 6000 g/mol or more.

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Номер записи: 3
01-03-2012 дата публикации

Biosensor test member and method for making the same

Номер: US20120051972A1
Автор: Abner David Joseph
Принадлежит: Roche Diagnostics Operations Inc

A biological test member, and method of making the same, is disclosed with the member including a substrate. The test member has usefulness, for example, in testing a person's blood glucose level. A first layer and a second layer of conductive metal are printed or otherwise applied on the substrate in an electrode pattern. The metal or metals are cured or sintered at a low, non-damaging temperature, such as by applying one or more pulses of a high-energy broad spectrum light. A layer of reagent may be provided on said second metal layer.

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Номер записи: 4
12-04-2012 дата публикации

Method of providing solar cell electroless platting and an activator used therein

Номер: US20120088653A1
Автор: Chia Wei Chou, Michael Liu, Su-Fei HSU
Принадлежит: E Chem Enterprise Corp

A method of providing solar cell electrode by electroless plating and an activator used therein are disclosed. The method of the present invention can be performed without silver paste, and comprises steps: (A) providing a silicon substrate; (B) contacting the silicon substrate with an activator, wherein the activator comprises: a noble metal or a noble metal compound, a thickening agent, and water; (C) washing the silicon substrate by a cleaning agent; (D) dipping the silicon substrate in an electroless nickel plating solution to perform electroless plating. The method of providing solar cell electrode by electroless plating of the present invention has high selectivity between silicon nitride and silicon, large working window, and is steady, easily to be controlled, therefore is suitable for being used in the fabrication of the electrodes of the solar cell substrate.

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Номер записи: 5
03-05-2012 дата публикации

Plating or Coating Method for Producing Metal-Ceramic Coating on a Substrate

Номер: US20120107627A1
Автор: Wei Gao, Weiwei Chen
Принадлежит: Auckland Uniservices Ltd

A method for producing a metal-ceramic composite coating with increased hardness on a substrate includes adding a sol of a ceramic phase to the plating solution or electrolyte. The sol may be added prior to and/or during the plating or coating and at a rate of sol addition controlled to be sufficiently low that nanoparticles of the ceramic phase form directly onto or at the substrate and/or that the metal-ceramic coating forms on the substrate with a predominantly crystalline structure and/or to substantially avoid formation of nanoparticles of the ceramic phase, and/or agglomeration of particles of the ceramic phase, in the plating solution or electrolyte. The ceramic phase may be a single or mixed oxide, carbide, nitride, silicate, boride of Ti, W, Si, Zr, Al, Y, Cr, Fe, Pb, Co, or a rare earth element. The coating, other than the ceramic phase may comprise Ni, Ni—P, Ni—W—P, Ni—Cu—P, Ni—B, Cu, Ag, Au, Pd.

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Номер записи: 6
17-05-2012 дата публикации

Method of manufacturing fuel system part and fuel system part

Номер: US20120118746A1
Автор: Eiji Isogai
Принадлежит: Otics Corp

Disclosed in the present application is a method of manufacturing a fuel delivery pipe. The fuel delivery pipe includes a crude metal made of forged iron, a nickel-phosphorus plating layer formed on an inner surface of the crude metal, and a nonmetal paint film formed on an outer surface of the crude metal. The method includes the steps of: coating the outer surface of the crude metal with paint to form the paint film; machining the crude metal with the paint film formed thereon to form a machined surface inside the crude metal; and electroless plating the machined crude metal in nickel-phosphorus plating solution to form the nickel-phosphorus plating layer on the machined surface.

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Номер записи: 7
17-05-2012 дата публикации

Metalized plastic articles and methods thereof

Номер: US20120121928A1
Автор: Liang Zhou, Qing Gong, Weifeng Miao, Xiong Zhang
Принадлежит: BYD Co Ltd

Metalized plastic substrates, and methods thereof are provided herein. The method includes providing a plastic substrate having a plurality of accelerators dispersed in the plastic substrate. The accelerators have a formula selected from the group consisting of: CuFe 2 O 4-δ , Ca 0.25 Cu 0.75 TiO 3-β , and TiO 2-σ , wherein δ, β, σ denotes oxygen vacancies in corresponding accelerators and 0.05≦δ≦0.8, 0.05≦β≦0.5, and 0.05≦σ≦1.0. The method further includes removing at least a portion of a surface of the plastic substrate to expose at least a first accelerator. The method further includes plating the exposed surface of the plastic substrate to form at least a first metal layer on the at least first accelerator, and then plating the first metal layer to form at least a second metal layer.

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Номер записи: 8
24-05-2012 дата публикации

Copper conductor film and manufacturing method thereof, conductive substrate and manufacturing method thereof, copper conductor wiring and manufacturing method thereof, and treatment solution

Номер: US20120125659A1
Автор: Hideo Nakako, Katsuyuki Masuda, Kazunori Yamamoto, Shunya Yokozawa, Yasushi Kumashiro, Yoshinori Ejiri, Youichi Machii
Принадлежит: Hitachi Chemical Co Ltd

Provided are a copper conductor film and manufacturing method thereof, and patterned copper conductor wiring, which have superior conductivity and wiring pattern formation, and with which there is no decrease in insulation between circuits, even at narrow wiring widths and narrow inter-wiring spacing. Disclosed are a copper conductor film and manufacturing method thereof in which a copper-based particle-containing layer, which contains both a metal having catalytic activity toward a reducing agent and copper oxide, is treated using a treatment solution that contains a reagent that ionizes or complexes copper oxide and a reducing agent that reduces copper ions or copper complex to form metallic copper in a single solution, and patterned copper conductor wiring that is obtained by patterning a copper-based particle-containing layer using printing and by said patterned particle-containing layer being treated by a treatment method using a solution that contains both a reagent that ionizes or complexes copper oxide and a reducing agent that reduces copper ions or copper complexes to form metallic copper in a single solution.

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Номер записи: 9
21-06-2012 дата публикации

Solution and process for activating the surface of a semiconductor substrate

Номер: US20120156892A1
Автор: Dominique SUHR, Vincent Mevellec
Принадлежит: Alchimer SA

The present invention relates to a solution and a process for activating the surface of a substrate comprising at least one area formed from a polymer, for the purpose of subsequently covering it with a metallic layer deposited via an electroless process. According to the invention, this composition contains: A) an activator formed from one or more palladium complexes; B) a binder formed from one or more organic compounds chosen from compounds comprising at least two glycidyl functions and at least two isocyanate functions; C) a solvent system formed from one or more solvents capable of dissolving said activator and said binder. Application: Manufacture of electronic devices such as, in particular, integrated circuits, especially in three dimensions.

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Номер записи: 10
23-08-2012 дата публикации

Composite ptfe plating

Номер: US20120214924A1
Автор: Michael David Feldstein
Принадлежит: Michael David Feldstein

The present invention is directed to compositions, baths, and methods for composite plating including polytetrafluoroethylene (PTFE), and more particularly, to compositions, baths, and methods of composite plating with PTFE in a metal or alloy matrix where the materials used in the process contain no or essentially no PFOS (perfluorooctane sulfonate) and/or no PFOA (perfluorooctanoic acid).

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Номер записи: 11
13-09-2012 дата публикации

Metal nanostructure and preparation thereof

Номер: US20120231290A1
Автор: Han-Yu Hsueh, Rong-Ming Ho
Принадлежит: National Tsing Hua University NTHU

Nanoporous polystyrene matrix can be fabricated from the self-assembly of degradable block copolymer, polystyrene-b-poly(L-lactide) (PS-PLLA), followed by the hydrolysis of PLLA blocks. Metal is deposited in nanopores of the PS matrix using the nanoporous PS as a template via electroless plating. After subsequent UV degradation of the PS matrix, metal in the nanopores remains, yielding a metal nanostructure. The metal nanostructure may be a gyroid nanostructure, helical nanostructure or columnar nanastructure.

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Номер записи: 12
28-02-2013 дата публикации

Nano-seeding via dual surface modification of alkyl monolayer for site-controlled electroless metallization

Номер: US20130052366A1
Автор: Giin-Shan Chen, Sung-Te Chen, Yu-Lin Lu
Принадлежит: Individual

Self-assembled-monolayer grafted seeding and electroless plating processes for patterning of metal-alloy thin films, comprising the steps of treating the surface of the substrate by organic species, covering the organic species-SAM coated surface of dielectric substrate with a template, treating the surface by vacuum plasma, immersing the substrate into an aqueous solution, removing the hydrogen from the surface of the substrate, immersing the negatively charged dielectric surface into an aqueous metal salt solutions for adsorbing metal ions, reducing the positively charged metallic cations into neutral metal particles which act as catalysts by a reducing agent, and immersing the dielectric substrate into an electroless-plating solution for deposition of metal and metal-alloy thin film patterns.

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Номер записи: 13
20-06-2013 дата публикации

Method for forming interconnection pattern and semiconductor device

Номер: US20130154087A1
Автор: Atsuko Sakata, Hiroshi Tomita, Hisashi Okuchi, Satoshi Wakatsuki, Yasuhito Yoshimizu
Принадлежит: Individual

According to one embodiment, a method for forming an interconnection pattern includes forming an insulating pattern, forming a self-assembled film, and forming a conductive layer. The insulating pattern has a side surface on a major surface of a matrix. The self-assembled film has an affinity with a material of the insulating pattern on the side surface of the insulating pattern. The forming the conductive layer includes depositing a conductive material on a side surface of the self-assembled film.

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Номер записи: 14
25-07-2013 дата публикации

Electrolytic Generation of Manganese (III) Ions in Strong Sulfuric Acid Using an Improved Anode

Номер: US20130186861A1
Автор: Roshan V. Chapaneri, Terence Clarke, Trevor Pearson
Принадлежит: MacDermid Acumen Inc

An electrolytic cell and a method of electrochemical oxidation of manganese (II) ions to manganese(III) ions in the electrolytic cell are described. The electrolytic cell comprises (1) an electrolyte solution of manganese(II) ions in a solution of 9 to 15 molar sulfuric acid; (2) a cathode immersed in the electrolyte solution; and (3) an anode immersed in the electrolyte solution and spaced apart from the cathode. Various anode materials are described including vitreous carbon, reticulated vitreous carbon, and woven carbon fibers.

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Номер записи: 15
25-07-2013 дата публикации

Method for manufacturing sensing electrical device and sensing electrical device

Номер: US20130187813A1
Автор: Cheng-Yen Wang, Hui-Mei Chang, Sheng-Hung Yao
Принадлежит: Taiwan Green Point Enterprise Co Ltd

A method for manufacturing a sensing electrical device includes the following steps; (a) forming a conductive trace on an insulating substrate; (b) placing the insulating substrate with the conductive trace in a mold cavity of a mold; (c) injecting an insulating material into the mold cavity to encapsulate the conductive trace to form an injection product; and (d) removing the injection product from the mold cavity.

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Номер записи: 16
01-08-2013 дата публикации

High temperature resistant silver coated substrates

Номер: US20130196174A1
Автор: Margit Clauss, Michael P. Toben, Wan Zhang-Beglinger
Принадлежит: Rohm and Haas Electronic Materials LLC

A thin film of tin is plated directly on nickel coating a metal substrate followed by plating silver directly on the thin film of tin. The silver has good adhesion to the substrate even at high temperatures.

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Номер записи: 17
08-08-2013 дата публикации

Method for Depositing a Nickel-Metal Layer

Номер: US20130202910A1
Автор: Koppe Stefan
Принадлежит:

A method for depositing nickel-metal layers for colouring surfaces, and a bath for depositing such a layer. This is made possible by depositing a nickel-metal layer from a bath for the electroless deposition of nickel which contains at least one further metal compound, a voltage being additionally applied enable the metal of the metal compound to be incorporated while forming a nickel-metal layer. 1. A method for depositing a nickel-metal layer , comprising the following steps:a) providing a nickel bath for electroless deposition of a nickel layer, wherein the bath additionally contains a compound of another metal; b1) deposition of nickel from the nickel bath and', 'b2) voltage-supported deposition of the other metal compound from the bath provided., 'b) depositing a nickel-metal layer by simultaneous'}2. The method as claimed in claim 1 , 'the electroless deposited metal layer is a nickel/phosphorus or a nickel/boron layer, which further contains at least one other metal.', 'characterized in that'}3. The method as claimed in claim 1 , 'the voltage-supported deposition is carried out at a temperature above 50° C.', 'characterized in that'}4. The method as claimed in claim 1 , 'the other metal compound is a zinc compound.', 'characterized in that'}5. The method as claimed in claim 1 , 'the other metal compound is present in the bath in a range between 0.05 mol/l and 0.5 mol/l relative to the metal.', 'characterized in that'}6. The method as claimed in claim 1 , 'a graphite electrode is used for the voltage-supported deposition.', 'characterized in that'}7. The method as claimed in claim 1 , 'the bath additionally contains at least one conducting salt.', 'characterized in that'}8. The method as claimed in claim 1 , {'sup': '2', 'the voltage-supported deposition is carried out with current densities between 0.01 and 5 A/dm.'}, 'characterized in that'}9. The method as claimed in claim 1 , 'electroless deposition of a nickel layer or nickel-metal layer is carried out ...

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Номер записи: 18
22-08-2013 дата публикации

STABLE CATALYST FOR ELECTROLESS METALLIZATION

Номер: US20130216718A1
Автор: Liu Feng, RZEZNIK Maria Anna
Принадлежит: Rohm and Haas Electronic Materials LLC

Catalysts include nanoparticles of catalytic metal and cellulose or cellulose derivatives. The catalysts are used in electroless metal plating. The catalysts are free of tin. 2. The aqueous catalyst of claim 1 , wherein at least one of R claim 1 , R claim 1 , R claim 1 , Rand Ris —CHCOOX or —C(O)—CH.3. The aqueous catalyst of claim 1 , wherein the nanoparticles are 1 nm to 1000 nm.4. The aqueous catalyst of claim 1 , wherein the cross-linking agent is chosen from one or more of haloepoxy compounds and di-epoxy compounds.6. The method of claim 5 , wherein the substrate comprises a plurality of through-holes.7. The method of claim 5 , wherein the electroless metal plating bath is chosen from a copper claim 5 , copper alloy claim 5 , nickel and nickel alloy bath.8. The method of claim 5 , wherein at least one of R claim 5 , R claim 5 , R claim 5 , Rand Ris —CHCOOX or —C(O)—CH.9. The method of claim 5 , wherein the cross-linking agent is chosen from one or more of haloepoxy compounds and di-epoxy compounds.10. The method of claim 5 , wherein the nanoparticles are 1 nm to 1000 nm. This application claims the benefit of priority under 35 U.S.C. §119(e) to U.S. Provisional Application No. 61/524,414, filed Aug. 17, 2011, the entire contents of which application are incorporated herein by reference.The present invention is directed to stable aqueous catalysts for electroless metallization. More specifically, the present invention is directed stable aqueous catalysts for electroless metallization which are tin free and are stabilized by cellulose and cellulose derivatives.Electroless metal deposition is a well-known process for depositing metallic layers on substrate surfaces. Electroless plating of a dielectric surface requires the prior application of a catalyst. The most commonly used method of catalyzing or activating dielectrics, such as non-conductive sections of laminated substrates used in the manufacture of printed circuit boards, is to treat the substrate with an ...

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Номер записи: 19
22-08-2013 дата публикации

Method of metal deposition

Номер: US20130217227A1
Автор: Colin Boxall, Michael Bromley
Принадлежит: Lancaster University Business Enterprises Ltd

A method of forming a metal layer on an electrically insulating substrate comprises depositing a photocatalyst layer onto the substrate and depositing a mask layer comprising voids on the substrate, such as a layer of latex microparticles with voids between them, to give an open pore structure to the mask. An electroless plating solution is then provided on the photocatalyst layer, and the photocatalyst layer and electroless plating solution are illuminated with actinic radiation whereby deposition of metal from the electroless plating solution to form a metal layer on the photocatalyst layer is initiated whereby the metal deposits in the voids of the mask layer. The mask layer is subsequently removed to leave a porous metal layer on the substrate. The method allows for deposition of porous metal films with controlled thickness and excellent adhesion onto electrically insulating substrates. The method is suitable for providing metal layers with controlled, regular porosity.

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Номер записи: 20
26-09-2013 дата публикации

Method of coating a part of a heat exchanger and heat exchanger

Номер: US20130248157A1
Автор: Jie Zheng
Принадлежит: ALFA LAVAL CORPORATE AB

A method of coating an internal surface of an assembled heat exchanger is provided. The heat exchanger comprising a first passage for a first heat exchange fluid, and a second passage for a second heat exchange fluid. The first and second passages are separated by at least one heat transfer element. The heat transfer element has a first surface facing the first passage. The method comprises; pre-treating the first surface by circulating at least one pre-treatment liquid through the first passage of the heat exchanger and a pre-treatment liquid storage separate from the heat exchanger, and electroless nickel plating the first surface by circulating a solution comprising nickel ions through the first passage of the heat exchanger and a solution container separate from the heat exchanger. A heat exchanger comprising a nickel plating is also disclosed.

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Номер записи: 21
14-11-2013 дата публикации

Method of forming low-resistance metal pattern, patterned metal structure, and display devices using the same

Номер: US20130299450A1
Автор: Ki Yong Song, Sang Eun PARK, Sung Hen Cho
Принадлежит: Samsung Display Co Ltd

Disclosed herein is a method of forming low-resistance metal pattern, which can be used to obtain a metal pattern having stable and excellent characteristics by performing sensitization treatment using a copper compound before an activation treatment for forming uniform and dense metal cores, a patterned metal structure, and display devices using the same.

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Номер записи: 22
21-11-2013 дата публикации

Autocatalytic plating bath composition for deposition of tin and tin alloys

Номер: US20130309404A1
Автор: Arnd Kilian, Isabel-Roda Hirsekorn, Jens Wegricht
Принадлежит: Atotech Deutschland GmbH and Co KG

An autocatalytic tin plating bath containing Sn 2+ ions, Ti 3+ ions as reducing agent, an organic complexing agent and phenanthroline or a derivative thereof as stabilizing agent is disclosed. The plating bath is suitable for manufacture of printed circuit boards, IC substrates and metallization of semiconductor wafers.

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Номер записи: 23
05-12-2013 дата публикации

Method of producing displacement plating precursor

Номер: US20130319871A1
Автор: Hajime Murata, Tomoyuki Nagai, Toshihiro Ikai, Yu Morimoto
Принадлежит: Toyota Motor Corp

A method of producing a displacement plating precursor, including a deposition step of depositing a Cu layer on a surface of a core particle formed of Pt or a Pt alloy by contacting a Cu ion-containing acidic aqueous solution with at least a portion of a Cu electrode, and contacting the Cu electrode with the core particle or with a composite, in which the core particle is supported on an electroconductive support, within the acidic aqueous solution or outside the acidic aqueous solution, and moreover contacting the core particle with the acidic aqueous solution under an inert gas atmosphere.

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Номер записи: 24
16-01-2014 дата публикации

INSULATING BASE PLATED WITH METAL LAYER, PLATING METHOD THEREOF, AND TRANSPARENT ELECTRODE INCLUDING INSULATING BASE

Номер: US20140017508A1
Автор: Cho Sang Ik, Lee Woo Jin, SEO Jung Wook, Shim Da Mi
Принадлежит: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Disclosed herein are an insulating base plated with a metal layer, a plating method thereof, and a transparent electrode including the insulating base. During the manufacture of a polymer layer, a structure of an interface layer between a surface of the polymer layer and a metal layer is modified, adhesion with metal is excellent and the polishability of the interface layer is reduced, and thus, the reflectivity of the metal layer is reduced and particular color impression of metal is reduced to obtain black-oxide treated properties. When the metal layer formed on the insulating base is used in a mesh-type transparent electrode having a fine pattern, sufficient adhesion with metal for forming a pattern is obtained and the reflectivity of an adhesion layer of the metal layer is reduced, thereby increasing the visibility. Accordingly, the insulating base may be suitable for products such as transparent electrodes or touch panels. 1. An insulating base , comprising:an insulating base layer;an interface layer that is formed on the insulating base layer, has a thickness of 40 to 80 nm and has pores with a size of 20 to 200 nm and porosity of 30 to 50%; anda metal layer plated on the interface layer.2. The insulating base as set forth in claim 1 , wherein the insulating base layer has a surface arithmetic mean roughness (Ra) of 100 nm or less.3. The insulating base as set forth in claim 1 , wherein the insulating base layer is a transparent insulating base layer claim 1 , andwherein an adhesive surface between the interface layer and the metal layer is plated with a metal layer that has a color difference value having ΔE*ab of 50 or less and C*ab of 20 or less.4. The insulating base as set forth in claim 1 , wherein the insulating base includes any one of polyethyleneterephthalate (PET) claim 1 , polyimide (PI) claim 1 , polycarbonate (PC) claim 1 , and a triacetylcellulose (TAC) film.5. The insulating base as set forth in claim 1 , wherein a surface of the insulating ...

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Номер записи: 25
06-03-2014 дата публикации

Texturing of monocrystalline semiconductor substrates to reduce incident light reflectance

Номер: US20140065836A1
Автор: Corey O'Connor, Michael P. Toben, Robert K. Barr
Принадлежит: Rohm and Haas Electronic Materials LLC

Monocrystalline semiconductor substrates are textured with alkaline solutions to form pyramid structures on their surfaces to reduce incident light reflectance and improve light absorption of the wafers. The alkaline baths include hydantoin compounds and derivatives thereof in combination with alkoxylated glycols to inhibit the formation of flat areas between pyramid structures to improve the light absorption.

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Номер записи: 26
20-03-2014 дата публикации

Tribologically Loadable Mixed Noble Metal/Metal Layers

Номер: US20140076798A1
Автор: Stefan Koppe
Принадлежит: Schauenburg Ruhrkunststoff GmbH

The invention relates to a method for producing a noble metal/metal layer, which has particularly advantageous tribological properties, comprising the following steps: providing a bath for the currentless deposition of a metal layer, which additionally contains at least one type of noble metal ions; introducing a substrate into the bath; and applying a voltage.

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Номер записи: 27
27-03-2014 дата публикации

Method of depositing metallic layers based on nickel or cobalt on a semiconducting solid substrate; kit for application of said method

Номер: US20140087560A1
Автор: Dominique SUHR, Vincent Mevellec
Принадлежит: Alchimer SA

The present invention relates to a kit intended for the deposition of nickel or cobalt in the cavities of a semiconductor substrate intended to form through-silicon vias (TSV) for making interconnections in integrated circuits in three dimensions. The invention also relates to a method of metallization of the insulating surface of such a substrate which comprises contacting the surface with a liquid aqueous solution containing: at least one metal salt of nickel or cobalt; at least one reducing agent; at least one polymer bearing amine functions, and at least one agent stabilizing the metal ions. The step coverage of the layer of nickel or cobalt obtained can be greater than 80%, which facilitates subsequent filling of the vias with copper by electrodeposition.

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Номер записи: 28
10-04-2014 дата публикации

Recovery method of nickel from spent electroless nickel plating solutions by electrolysis

Номер: US20140097094A1
Автор: Byung Won Cho, Hwa Young Lee, Joong Kee Lee
Принадлежит: Korea Advanced Institute of Science and Technology KAIST

A recovery method of nickel according to the present invention comprises pretreatment step to prepare a solution for electrolysis by adding hexanesulfonate salt to a treatment solution including nickel, and nickel recovery step to recover nickel in a metal form by electrolysis of the above solution for electrolysis. The present invention can produce nickel in high purity with simple process with low cost, and can recover and reproduce nickel in a metal form with at least 99.5% of high purity and at least 90% of recovery rate.

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Номер записи: 29
05-01-2017 дата публикации

HIGH MODULUS LASER DIRECT STRUCTURING POLYCARBONATE COMPOSITES WITH ENHANCED PLATING PERFORMANCE AND BROAD LASER WINDOW BY REFLECTION ADDITIVES

Номер: US20170002193A1
Автор: An Yuxian, Cheng Yunan, Lian Xueming, Wang Jiwen, Zheng Yun
Принадлежит:

The present disclosure relates to a polymer composition comprising a polycarbonate polymer, a laser direct structuring additive capable of being activated by electromagnetic radiation and thereby forming elemental metal nuclei, and a reflection additive. Also disclosed is a method for making the disclosed polymer composition and an article of manufacture comprising the disclosed polymer composition. 1. A polymer composition comprising:a polycarbonate polymer;a laser direct structuring additive capable of being activated by electromagnetic radiation and thereby forming elemental metal nuclei; anda reflection additive, wherein the polymer composition is capable of being plated after being activated using a laser.2. The polymer composition of claim 1 , wherein the laser direct structuring additive comprises a heavy metal mixture oxide spinel or a copper salt or a combination thereof.3. The polymer composition of claim 2 , wherein the copper salt comprises a copper hydroxide phosphate.4. The polymer composition of any of - claim 2 , wherein the reflection additive comprises titanium oxide or aluminum or a combination thereof.5. The polymer composition of any of - claim 2 , wherein the polycarbonate polymer comprises a bisphenol A polycarbonate polymer.6. The polymer composition of claim 5 , wherein the bisphenol A polycarbonate polymer comprises a blend of at least two different bisphenol A polycarbonates.7. The polymer composition of any of - claim 5 , wherein the polycarbonate polymer is present in an amount in the range from about 10 weight % to about 90 weight % relative to the total weight of the polymer composition claim 5 , and wherein the combined weight percent value of all components is 100.8. The polymer composition of any of - claim 5 , wherein the laser direct structuring additive is present in an amount in the range from about 1 weight % to about 10 weight % relative to the total weight of the polymer composition claim 5 , and wherein the combined weight ...

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Номер записи: 30
05-01-2017 дата публикации

Decorative plated product, fitting structure, production method and fitting method

Номер: US20170002477A1
Автор: Hiroaki Ando, Takayasu Ido, Tsuyoshi Suzuki, Yoshinori Yoshizawa
Принадлежит: Toyoda Gosei Co Ltd

A decorative plated product includes: a base comprising contact parts having shapes that are engageable with metal fitting members; a plating layer that covers the base; and a synthetic resin layer that covers at least portions of the plating layer over the contact parts.

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Номер записи: 31
02-01-2020 дата публикации

POLYAMIDE COMPOSITIONS AND PLATING APPLICATIONS THEREOF

Номер: US20200002511A1
Автор: Powers Scott E., Ray Jacob G., Sparks Bradley J., White Kimberly M.
Принадлежит: Ascend Performance Materials Operations LLC

The present disclosure relates to polyamide compositions and resulting injection-molded articles that can be plated, e.g., metal coated, to form structurally aesthetic injection-molded articles. The polyamide compositions may include from 40 wt. % to 80 wt. % of a polyamide, from 0.5 wt. % to 40 wt. % of an etchable filler, from 5 wt. % to 30 wt. % of glass fiber, optionally less than 40 wt. % of a semi-structural mineral, and optionally from 0.1 wt. % to 13 wt. % of additive. The polyamide composition imparts very good surface appearance and excellent mechanical properties to injection-molded articles that are substantially free of visual defects. 1. A polyamide composition comprising:from 40 wt. % to 80 wt. % of a polyamide;from 0.5 wt. % to 40 wt. % of an etchable filler;from 5 wt. % to 30 wt. % of glass fibers having an average diameter up to 10 microns;less than 40 wt. % of a semi-structural mineral; andfrom 0.1 wt. % to 13 wt. % of additive.2. The composition of claim 1 , wherein the polyamide comprises PA-6 claim 1 , PA-6 claim 1 ,6 claim 1 , PA4 claim 1 ,6 claim 1 , PA-6 claim 1 ,9 claim 1 , PA-6 claim 1 ,10 claim 1 , PA-6 claim 1 ,12 claim 1 , PA11 claim 1 , PA12 claim 1 , PA9 claim 1 ,10 claim 1 , PA9 claim 1 ,12 claim 1 , PA9 claim 1 ,13 claim 1 , PA9 claim 1 ,14 claim 1 , PA9 claim 1 ,15 claim 1 , PA-6 claim 1 ,16 claim 1 , PA9 claim 1 ,36 claim 1 , PA10 claim 1 ,10 claim 1 , PA10 claim 1 ,12 claim 1 , PA10 claim 1 ,13 claim 1 , PA10 claim 1 ,14 claim 1 , PA12 claim 1 ,10 claim 1 , PA12 claim 1 ,12 claim 1 , PA12 claim 1 ,13 claim 1 , PA12 claim 1 ,14 claim 1 , PA-6 claim 1 ,14 claim 1 , PA-6 claim 1 ,13 claim 1 , PA-6 claim 1 ,15 claim 1 , PA-6 claim 1 ,16 claim 1 , PA-6 claim 1 ,13 claim 1 , PAMXD claim 1 ,6 claim 1 , PA4T claim 1 , PAST claim 1 , PA-6T claim 1 , PAST claim 1 , PA10T claim 1 , PA12T claim 1 , PA4I claim 1 , PA5I claim 1 , PA-6I claim 1 , PA10I claim 1 , copolymers claim 1 , terpolymers claim 1 , and mixtures thereof.3. The composition ...

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Номер записи: 32
02-01-2020 дата публикации

METHOD FOR NO-SILANE ELECTROLESS METAL DEPOSITION USING HIGH ADHESIVE CATALYST AND PRODUCT THEREFROM

Номер: US20200002817A1
Автор: Hsu Chin-Wei, WANG WEI-YEN, WEI TZU-CHIEN
Принадлежит:

A method for electroless metal deposition and an electroless metal layer included substrate are provided. The method for electroless metal deposition includes steps as follows. a) cleaning a substrate, applying a hydrofluoric acid onto the substrate; and then applying a modifying agent onto the substrate to form a chemical oxide layer on the substrate; b) a catalyst layer is formed on the chemical oxide layer, wherein, the catalyst layer includes a plurality of colloidal nanoparticles, and each of the plurality of colloidal nanoparticles includes a palladium nanoparticle and a polymer which encapsulates the palladium nanoparticle, and c) depositing a metal on the catalyst layer through an electroless metal deposition to form an electroless metal layer. 1. A method for electroless metal deposition , comprising:a) cleaning a substrate, applying a hydrofluoric acid onto the substrate, and then applying a modifying agent onto the substrate to form a chemical oxide layer on the substrate;b) forming a catalyst layer on the chemical oxide layer, wherein the catalyst layer includes a plurality of colloidal nanoparticles, and each of the plurality of colloidal nanoparticles includes a palladium nanoparticle and a polymer which encapsulates the palladium nanoparticle, andc) depositing a metal on the catalyst layer through an electroless metal deposition to form an electroless metal layer.2. The method for electroless metal deposition as claimed in claim 1 , wherein in the step a) claim 1 , the modifying agent is selected from the group consisting of: ozone claim 1 , nitrate claim 1 , hydrofluoric acid claim 1 , mixture of sulfuric acid and hydrogen peroxide claim 1 , and mixture of nitrate and hydrofluoric acid.3. The method for electroless metal deposition as claimed in claim 1 , wherein the step b) further includes using a protective agent and a precursor to form the catalyst layer on the chemical oxide layer claim 1 , and the protective agent and the precursor have a ...

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Номер записи: 33
07-01-2016 дата публикации

DEVICES TO DETECT A SUBSTANCE AND METHODS OF PRODUCING SUCH A DEVICE

Номер: US20160003732A1
Автор: Barcelo Steven J., GE NING, Kuo Huei Pei, Li Zhiyong
Принадлежит: Hewlett-Packard Development Company, L.P.

Devices to detect a substance and methods of producing such a device are disclosed. An example device to detect a substance includes an orifice plate defining a first chamber. A substrate is coupled to the orifice plate. The substrate includes nanostructures positioned within the first chamber. The nanostructures are to react to the substance when exposed thereto. A seal is to enclose at least a portion of the first chamber to protect the nanostructures from premature exposure. 1. A device to detect a substance , comprising:an orifice plate defining a first chamber;a substrate coupled to the orifice plate, the substrate comprising nanostructures positioned within the first chamber, the nanostructures to react to the substance when exposed thereto; anda seal to enclose at least a portion of the first chamber to protect the nanostructures from premature exposure.2. The device of claim 1 , wherein the orifice plate comprises at least one of nickel claim 1 , gold claim 1 , platinum claim 1 , palladium claim 1 , or rhodium.3. The device of claim 1 , wherein the nanostructures comprise at least one of pillar structures or conical structures.4. The device of claim 1 , wherein the orifice plate is electroplated with at least one of gold claim 1 , palladium claim 1 , or rhodium.5. The device of claim 1 , wherein the seal comprises at least one of a polymer material claim 1 , a flexible material claim 1 , or a removable material.6. The device of claim 1 , wherein the seal comprises a hermetic seal.7. The device of claim 1 , wherein the seal comprises at least one of polymer tape claim 1 , plastic claim 1 , foil claim 1 , a membrane claim 1 , wax claim 1 , or Polydimethylsiloxane.8. The device of claim 1 , wherein the substrate comprises at least one of a Surface Enhanced Raman spectroscopy substrate claim 1 , a self actuating Surface Enhanced Raman spectroscopy substrate claim 1 , an Enhanced Fluorescence spectroscopy substrate claim 1 , or an Enhanced Luminescence ...

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Номер записи: 34
03-01-2019 дата публикации

PRETREATMENT OF PLASTIC SURFACES FOR METALLIZATION TO IMPROVE ADHESION

Номер: US20190003057A1
Автор: HYMAN Mark, NARUSKEVICIUS Leonas
Принадлежит:

The present invention relates to the adhesional pretreatment of plastics surface prior to their metallization by chemical or electrochemical methods and may be used in those industrial fields where decorative or functional metalic coatings on top of the plastic surfaces are needed. The purpose of the proposed invention is a high-quality adhesional pretreatment of plastic surface prior to metallization. The purpose is achieved by treating the plastic before to etch it 5-15 min at 50-70° C. in the alcaline permanganic solution containing 1-3M NaOH and 0.1-0.5 M permanganate ions and acidic permanganic etching solution additionally contains 0.5-8.0 M of copper nitrate and the etching is performed at room temperature during 5-60 min. 1. A method for adhesional pretreatment of plastic surfaces prior to their metallization comprising its etching with acidic permanganic solution, characterized in that the plastic before etching is maintained 5-15 minutes at 50-70° C. in an alcaline permanganic solution containing 1-3 M NaOH and 0.1-0.5 permanganate ions while 0.5-8.0 M of copper nitrate are additionally introduced into acidic permanganic etching solution and the etching is performed at room temperature for 5-60 minutes. The present invention relates to the adhesional pretreatment of plastics surface prior to their metallization by chemical or electrochemical methodes and may be used in those industrial fields where decorative or functional metalic coatings on top of the plastic surfaces are needed.A conventional method of plastic surface pretreatment prior to metallization consist of etching the surface with solution containing permanganate or other Mn ions which are the etchants-oxydizers. Permanganate as oxidizing agent is commonly proposed to be used in the acidic media, because only in this case the surfaces of acrylo-nitryl-butadien-styrene copolymere (ABS), ABS mixed with polycarbonate (PC/ABS), polyetherimides (PEI) and polyetheretherketones (PEEK) are able to be ...

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Номер записи: 35
04-01-2018 дата публикации

PROCESS OF FORMING A PHOTOACTIVE LAYER OF AN OPTOELECTRONIC DEVICE

Номер: US20180005764A1
Автор: Anderson Kenrick Forrest, Duffy Noel William, Firet Nienke Joan, Hollenkamp Anthony Frank, Jones Timothy William, Wilson Gregory Joseph
Принадлежит: Commonwealth Scientific and Industrial Research Organisation

A process of forming a thin film photoactive layer of an optoelectronic device comprising: providing a substrate having a surface comprising or coated with a metal M selected from at least one of Pb, Sn, Ge, Si, Ti, Bi, or In; and converting the metal surface or metal coating of the substrate to a perovskite layer. 165.-. (canceled)66. A process of forming a thin film photoactive layer of an optoelectronic device comprising:providing a substrate having a surface comprising or coated with a metal M selected from at least one of Pb, Sn, Ge, Si, Ti, Bi, or In; andconverting the metal surface or metal coating of the substrate to a perovskite layer comprising an organo-metal halide perovskite.67. A process according to claim 66 , wherein the substrate is coated with a metal M prior to the converting step by:applying at least one coating of a metal M selected from at least one of Pb, Sn, Ge, Si, Ti, Bi, or In to a substrate to form a coated substrate.68. A process according to claim 67 , wherein the at least one coating of a metal M is applied to the substrate by at least one of:a deposition method including at least one of electrodeposition, electrophoretic deposition, electroplating, or electroless deposition;a physical coating method including at least one of sputter, cold spray; or application of solid film or layer to the substrate; oran evaporative coating method.69. A process according to claim 67 , wherein the metal layer on the coating substrate is between 25 and 200 nm.70. A process according to claim 66 , wherein the converting step comprises: applying at least one perovskite precursor to the metal coating of the coated substrate to form the perovskite layer.71. A process according to claim 66 , wherein the converting step comprises:contacting the at least one coating of the metal coated substrate with a vapour X selected from a halide vapour comprising at least one of F, Cl, Br or I, or acetic acid vapour to form a metal compound MX2 coating on the coated ...

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Номер записи: 36
04-01-2018 дата публикации

RETICULATED ELECTRODE STRUCTURE AND METHOD OF MAKING THE SAME

Номер: US20180006290A1
Автор: JAN JONATHAN, Snaper Alvin
Принадлежит:

A method of forming an electrode in an electrochemical battery comprises: coating a reticulated substrate with a conductive material; curing the reticulated substrate coated with the conductive material; and electroplating the reticulated substrate coated with the conductive material with a desired metal material. 1. A method of forming an electrode in an electrochemical battery comprising: immersing the reticulated substrate in an ultrasonic tank containing a water-soluble conductive liquid; and', 'applying ultrasonic wave to break down a surface tension at the boundary layer of the reticulated substrate to allow the water-soluble conductive ink to permeate an interior of the reticulated substrate to increase a reactive surface area of the reticulated substrate and promote adhesion of the conductive material;, 'coating a reticulated substrate with a conductive material, wherein coating a reticulated substrate with a conductive material comprisescuring the reticulated substrate coated with the conductive material; andelectroplating the reticulated substrate coated with the conductive material with a desired metal material.2. (canceled)3. (canceled)4. The method of claim 1 , generating signals in the ultrasonic tank having an ultrasonic frequency in a range of 28-48 kHz.5. The method of claim 1 , wherein the conductive liquid is a water-soluble conductive ink having conductive carbon materials.6. The method of claim 1 , wherein the conductive liquid is a water-soluble conductive ink having conductive carbon materials claim 1 , wherein the conductive carbon materials are a combination of graphene and graphite.7. The method of claim 6 , wherein the graphene is approximately 2-25 micron in linear dimensions.8. The method of claim 1 , wherein the reticulated substrate is a reticulated open-cell polymer foam.9. The method of claim 8 , comprising removing the reticulated open-cell polymer foam after electroplating.10. The method of claim 9 , wherein removing the ...

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Номер записи: 37
07-01-2016 дата публикации

ELECTROLESS PLATING METHOD AND CERAMIC SUBSTRATE

Номер: US20160007476A1
Автор: KAIHATSU Yuta, Sekino Shiro, TAKEMOTO Yohei, YAMANAKA Hiromi
Принадлежит: Mitsubishi Electric Corporation

Provided is an electroless plating method for a low temperature co-fired glass ceramic substrate, the method including: a degreasing and activation treatment step of degreasing and activating a surface of a wiring pattern formed of a silver sintered body; a catalyzing step of providing a catalyst onto the surface of the wiring pattern formed of a silver sintered body; and an electroless multi-layered coating plating treatment step. The electroless plating method further includes, between the degreasing and activation treatment step and the catalyzing step, a silver precipitation treatment step of precipitating silver on a glass component present on the surface of the wiring pattern formed of a silver sintered body after the degreasing and activation treatment step, and the catalyzing step includes providing the catalyst also to the silver precipitated in the silver precipitation treatment step. 1. An electroless plating method for a glass ceramic substrate comprising an insulating base material formed of glass ceramic , and a wiring pattern formed of a silver sintered body , the electroless plating method comprising:a degreasing and activation treatment step of degreasing and activating a surface of the wiring pattern formed of a silver sintered body;a catalyzing step of providing a catalyst onto the surface of the wiring pattern formed of a silver sintered body after the degreasing and activation treatment step; andan electroless multi-layered coating plating treatment step of forming a multi-layered electroless plating coating on the surface of the wiring pattern formed of a silver sintered body on which the catalyst is provided,the electroless plating method further comprising, between the degreasing and activation treatment step and the catalyzing step, a silver precipitation treatment step of precipitating silver on a glass component present on the surface of the wiring pattern formed of a silver sintered body after the degreasing and activation treatment step, ...

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Номер записи: 38
20-01-2022 дата публикации

METHOD FOR PRODUCING PACKAGE SUBSTRATE FOR LOADING SEMICONDUCTOR DEVICE

Номер: US20220020602A1
Автор: HIRANO Syunsuke, Kato Yoshihiro, Ogashiwa Takaaki
Принадлежит: MITSUBISHI GAS CHEMICAL COMPANY, INC.

A method for manufacturing a package substrate including an insulating layer and a wiring conductor, including: forming, on one or both sides of a core resin layer, a substrate including a peelable first metal layer that has a thickness of 1-70 μm, a first insulating resin layer, and a second metal layer; forming a non-through hole reaching a surface of the first metal layer, performing electrolytic and/or electroless copper plating on its inner wall, and connecting the second and first metal layers; arranging a second insulating resin layer and a third metal layer and heating and pressurizing the first substrate to form a substrate; forming a non-through hole reaching a surface of the second metal layer, performing electrolytic and/or electroless copper plating on its inner wall, and connecting the second and third metal layers; peeling a third substrate; and patterning the first and third metal layers to form the wiring conductor. 1. A method for manufacturing a package substrate for mounting a semiconductor device comprising an insulating layer and a wiring conductor provided on the insulating layer , the method comprising:forming a first substrate comprising a first metal layer that has a thickness of 1 μm to 70 μm and that is peelable from the core resin layer, a first insulating resin layer, and a second metal layer in this order on one side or both sides of a core resin layer;forming a non-through hole reaching a surface of the first metal layer on a surface of the first substrate, carrying out electrolytic copper plating and/or electroless copper plating on an inner wall of the non-through hole, and connecting the second metal layer and the first metal layer;forming a second substrate by heating and pressurizing a laminate formed by arranging a second insulating resin layer and a third metal layer in this order on a surface of the second metal layer of the first substrate;forming a non-through hole reaching the surface of the second metal layer on a surface ...

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Номер записи: 39
11-01-2018 дата публикации

MULTIFUNCTIONAL FLUORESCENT AND MRI-ACTIVE NANOSTRUCTURE

Номер: US20180008730A1
Автор: Ayala-Orozco Ciceron, Bishnoi Sandra, Halas Nancy J., Henderson Luke, Neumann Oara, Pautler Robia
Принадлежит: William Marsh Rice University

A Magnetic Resonance Imaging (MRI) enhancement agent includes a plurality of particles, each particle including: a metal core; a dielectric shell disposed on the metal core comprising at least one MRI contrast agent; and a metal shell disposed on the exterior surface of the dielectric shell that encapsulates the dielectric shell. 1. A Magnetic Resonance Imaging (MRI) enhancement agent , comprising: a metal core;', 'a dielectric shell disposed on the metal core comprising at least one MRI contrast agent; and', 'a metal shell disposed on the exterior surface o the dielectric shell that encapsulates the dielectric shell., 'a plurality of particles, each particle comprising2. The magnetic resonance imaging enhancement agent of claim 1 , wherein a radius of the metal core is between about 5 nm and 60 nm.3. The magnetic resonance imaging enhancement agent of claim 1 , wherein a thickness of the silica shell is between about 5 and 40 nm.4. The magnetic resonance imaging enhancement agent of claim 1 , wherein a thickness of the metal shell is between 1 and 100 nm.5. The magnetic resonance imaging enhancement agent of claim 1 , wherein at least a portion of the plurality of particles supports a plasmon resonance centered at greater than 400 nm and less than 1200 nm.6. The magnetic resonance imaging enhancement agent of claim 1 , wherein at least a portion of the plurality of particles supports a plasmon resonance centered in the near-IR range of the electromagnetic spectrum.7. The magnetic resonance imaging enhancement agent of claim 1 , wherein the dielectric shell is amorphous silica.8. The magnetic resonance imaging enhancement agent of claim 7 , wherein the amorphous silica is doped with an amine.9. The magnetic resonance imaging enhancement agent of claim 8 , wherein the amine is 3-aminopropyl-triethoxysilane.10. The magnetic resonance enhancement agent of claim 1 , wherein the MRI contrast agent is comprised of at least one selected from the group containing a type 1 ...

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Номер записи: 40
12-01-2017 дата публикации

METHOD OF PRODUCING STANNOUS OXIDE, STANNOUS OXIDE, METHOD OF Sn PLATING SOLUTION, AND METHOD OF REMOVING IMPURITIES FROM SN PLATING SOLUTION

Номер: US20170009078A1
Автор: Hirano Hirotaka, Katase Takuma
Принадлежит: MITSUBISHI MATERIALS CORPORATION

The method of producing stannous oxide includes: a Sn ion-containing acid solution forming step (S); a first neutralizing step (S), which is a step of forming Sn precipitates by adding one or more of alkaline solutions of ammonium carbonate, ammonium bicarbonate, and aqueous ammonia to the Sn ion-containing acid solution to retain pH at 3-6 therein; a Sn precipitate separating step (S); a Sn precipitate dispersing step (S), which is a step of dispersing the separated Sn precipitates in a solvent liquid to obtain a dispersion liquid; and a second neutralizing step (S), which is a step of forming SnO by adding an alkaline solution to the dispersion liquid of the Sn precipitates and then by heating, wherein Na, K, Pb, Fe, Ni, Cu, Zn, Al, Mg, Ca, Cr, Mn, Co, In, and Cd reside in the Sn ion-containing acid solution in the first neutralizing step (S). 1. A method of producing stannous oxide comprising:a Sn ion-containing acid solution forming step, which is a step of preparing a Sn ion-containing acid solution by adding Sn ions to an acid solution;a first neutralizing step, which is a step of forming Sn precipitates by adding one or more of alkaline solutions of ammonium carbonate, ammonium bicarbonate, and aqueous ammonia to the Sn ion-containing acid solution to retain pH at 3-6 therein;a Sn precipitate separating step, which is a step of separating the Sn precipitates from the Sn ion-containing acid solution;a Sn precipitate dispersing step, which is a step of dispersing the separated Sn precipitates in a solvent liquid to obtain a dispersion liquid; anda second neutralizing step, which is a step of forming SnO from the Sn precipitates by adding an alkaline solution to the dispersion liquid of the Sn precipitates and then by heating, whereinNa, K, Pb, Fe, Ni, Cu, Zn, Al, Mg, Ca, Cr, Mn, Co, In, and Cd reside in the Sn ion-containing acid solution in the first neutralizing step.2. The method of producing stannous oxide according to claim 1 , further comprising an acid ...

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Номер записи: 41
12-01-2017 дата публикации

METALLIC COATING AND A METHOD FOR PRODUCING THE SAME

Номер: US20170009350A1
Автор: MYLLYMÄKI Vesa, ROSTEDT Niko
Принадлежит:

The present invention relates to metal plating solution comprising at least one source of metal ions and detonation nanodiamonds, wherein the detonation nanodiamonds are substantially free of negatively charged functionalities, and to a method for producing the solution. The present invention further relates to metal plating method and to a metallic coating comprising metal and detonation nanodiamonds substantially free of negatively charged functionalities. 1. An electroless metal plating solution comprising at least one source of metal ions , a reducing agent and detonation nanodiamonds , wherein acid value of the detonation nanodiamonds is less than 5.0.2. The electroless metal plating solution according to claim 1 , wherein the metal is selected from the group consisting of nickel claim 1 , copper claim 1 , gold claim 1 , cobalt claim 1 , palladium claim 1 , iron claim 1 , silver claim 1 , and mixtures thereof.3. The electroless metal plating solution according to claim 2 , wherein the metal is nickel.4. The electroless metal plating solution according to claim 1 , wherein amount of the detonation nanodiamonds in the plating solution is 0.005-15 g/l.5. The electroless metal plating solution according to claim 1 , wherein particle size distribution D90 of the detonation nanodiamond dispersion added to the electrolyte is not more than 100 nm.6. The electroless metal plating solution according to claim 1 , wherein the detonation nanodiamond dispersion exhibits zeta potential at least +40 mV claim 1 , measured with Laser Doppler Micro-electrophoresis7. The electroless metal plating solution according to claim 1 , wherein acid value of the detonation nanodiamonds is 0.8. The electroless metal plating solution according to claim 1 , wherein the solution further comprises additional components selected from the group consisting of graphite claim 1 , graphene claim 1 , carbon nanotubes claim 1 , diamond particles larger than 15 nm claim 1 , boron carbide claim 1 , ...

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Номер записи: 42
10-01-2019 дата публикации

HEXAVALENT CHROMIUM FREE ETCH MANGANESE RECOVERY SYSTEM

Номер: US20190009184A1
Автор: Bauman Mark, Lacey Daniel, Vogelpohl Gerry
Принадлежит: SRG GLOBAL, INC.

Methods for recovering manganese etchant solutions are provided wherein a process solution used to rinse or neutralize a nonconductive substrate after etching the substrate is collected and evaporated to provide a concentrated process solution that is fed back into the manganese etchant solution or acid rinse. 1. A method for recovering manganese etchant solution , the method comprising:neutralizing with a neutralizer a nonconductive substrate after etching the substrate with an etchant solution, wherein the neutralizer comprises a solution comprising an acid and an oxidizer;removing from the neutralizer or manganese containing rinsate at least a portion of the process solution to an evaporator assembly;evaporating the process solution in the evaporator assembly to remove the water to form a concentrated process solution; andadding the concentrated process solution to the etchant solution or an Acid Rinse.2. The method according to claim 1 , wherein the concentrated process solution is concentrated to greater than or equal to about 2 g/L Mn.3. The method according to claim 1 , wherein the evaporator assembly further comprises an atmospheric evaporator or vacuum evaporator.4. The method according to claim 1 , wherein the evaporator assembly further comprises an evaporating processing tank.5. The method according to claim 1 , wherein the evaporating processing tank is operated under temperature control and with controlled air treatment.6. The method according to claim 5 , wherein the temperature is from about 155° F. to about 180° F.7. The method according to claim 5 , wherein the controlled air treatment is at a flowrate from about 1880 lb/hr to about 2090 lb/hr.8. The method according to claim 6 , wherein the controlled air treatment is at a flowrate from about 1880 lb/hr to about 2090 lb/hr.9. The method according to claim 1 , wherein the process solution comprises a source of manganese ions.10. A method for recovering manganese etchant solution claim 1 , the ...

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Номер записи: 43
08-01-2015 дата публикации

METHOD OF DEPOSITING A METAL LAYER ON AN ELECTRICALLY NON-CONDUCTIVE PLASTIC MEMBER, AND HOUSING FOR A MOBILE DEVICE

Номер: US20150011270A1
Автор: HUA Chien-Cheng, HUANG Tzu-Ting, LIU Yi-Tsung, Tseng Yung-Sheng, YEH Chih-Hsiang
Принадлежит:

A method of depositing a metal layer on an electrically non-conductive plastic member includes: mixing a plastic material and a laser-sensitive additive to form a mixture, followed by injection molding the mixture to form an electrically non-conductive plastic member; irradiating a part of a surface of the electrically non-conductive plastic member with laser to engrave the electrically non-conductive plastic member so as to form a roughened region; forming an activating layer on the roughened region; and forming a metal layer on the activating layer on the roughened region of the electrically non-conductive plastic member. This method is suitable for making a housing for a mobile device. 1. A method of depositing a metal layer on an electrically non-conductive plastic member , comprising the steps of:(a) mixing a plastic material and a laser-sensitive additive to form a mixture, followed by injection molding the mixture to form an electrically non-conductive plastic member that has a surface;(b) irradiating a part of the surface of the electrically non-conductive plastic member with laser to engrave the electrically non-conductive plastic member so as to form a roughened region in the electrically non-conductive plastic member;(a) forming an activating layer on the roughened region of the electrically non-conductive plastic member for metalizing the roughened region in the electrically non-conductive plastic member; and(d) forming a metal layer on the activating layer on the roughened region of the electrically non-conductive plastic member.2. The method as claimed in claim 1 , wherein in step (c) claim 1 , the activating layer is made of palladium.3. The method as claimed in claim 2 , wherein in step (c) claim 2 , a tin-palladium alloy layer is formed on the roughened region of the electrically non-conductive plastic member by deposition claim 2 , followed by removing tin ion from the tin-palladium alloy layer by acid pickling so that palladium remains on the ...

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Номер записи: 44
14-01-2016 дата публикации

Composite Electroless Nickel Plating

Номер: US20160010214A1
Автор: Boules H. Morcos, John Pawlowski, Nicole J. Micyus
Принадлежит: MacDermid Acumen Inc

A method of producing a composite electroless nickel layer on a substrate is described. The method includes the steps of contacting the substrate with a composite electroless nickel plating bath and generating an electrostatic field in the electroless nickel plating bath. The electric field is generated by placing an anode in the electroless nickel plating bath and connecting the anode to a positive terminal of a DC rectifier, and connecting the substrate to a negative terminal of the DC rectifier, and preferably inserting a capacitor into the circuit to prevent passage of current. An attractive force generated by the electrostatic field increases the attraction of the positively charged PTFE particles to the negatively charged substrate and drives the positively charged PTFE particles to the negatively charged substrate.

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Номер записи: 45
14-01-2016 дата публикации

PRIMER FOR ELECTROLESS PLATING

Номер: US20160010215A1
Автор: Kojima Keisuke, SAITO Daigo
Принадлежит:

It is an object of the present invention to provide a novel primer for use in pretreatment steps in electroless plating which is environmentally friendly, by which process is easy with fewer steps, and which can realize cost reduction. A primer for forming a metal plating film on a base material by electroless plating, the primer including: a hyperbranched polymer having an ammonium group at a molecular terminal and a weight-average molecular weight of 500 to 5,000,000; a metal fine particle; and an alkoxysilane. 1. A primer for forming a metal plating film on a base material by electroless plating , the primer comprising:(a) a hyperbranched polymer having an ammonium group at a molecular terminal and a weight-average molecular weight of 500 to 5,000,000;(b) a metal fine particle; and(c) an alkoxysilane having an amino group optionally substituted with an aliphatic group or an epoxy group, or an oligomer of the alkoxysilane.2. The primer according to claim 1 , whereinthe ammonium group of the hyperbranched polymer (a) is attached to the metal fine particle (b) to form a complex.5. The primer according to claim 1 , whereinthe metal fine particle (b) is a fine particle of at least one selected from the group consisting of iron (Fe), cobalt (Co), nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), tin (Sn), platinum (Pt), and gold (Au).6. The primer according to claim 5 , whereinthe metal fine particle (b) is a palladium fine particle.7. The primer according to claim 5 , whereinthe metal fine particle (b) is a fine particle having an average particle diameter of 1 to 100 nm.9. A priming layer for electroless plating claim 1 , obtained by forming a layer of the primer as claimed in .10. A metal plating film claim 9 , formed on the priming layer by performing electroless plating on the priming layer for electroless plating as claimed in .11. A metal-coated base material comprising:a base material;{'claim-ref': {'@idref': 'CLM-00009', 'claim 9'}, 'the priming layer for ...

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Номер записи: 46
14-01-2016 дата публикации

Conductive Fibres

Номер: US20160010273A1
Автор: Christopher Paul HUNT, Roya ASHAYER-SOLTANI
Принадлежит: UK Secretary of State for Business Innovation and Skills

A method for making a fibre electrically conductive comprises the steps of: (a) providing a fibre having a negative electric charge at the surface of the fibre, (b) applying to the fibre a substance (such as a polyelectrolyte) which provides a layer of said substance on the fibre and changes the electric charge at the surface of the fibre from negative to positive, wherein said substance is not chitosan, and (c) making the surface of the fibre electrically conductive with a metal, wherein the metal of step (c) is provided in the form of metal ions and wherein a reducing agent (for example) is employed to reduce the metal ions to elemental metal. Fabrics formed from conductive fibres are also provided.

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Номер записи: 47
10-01-2019 дата публикации

Method for producing electroconductive laminate, laminate, and electroconductive laminate

Номер: US20190010608A1
Автор: Daigo Murai, Kohei Higashi, Takehiro Kasahara
Принадлежит: Fujifilm Corp

An object of the present invention is to provide a method for producing an electroconductive laminate, which is capable of forming a metal layer having low resistance at a position corresponding to a patterned plated layer, a laminate, and an electroconductive laminate. The method for producing an electroconductive laminate of the present invention includes: a step of forming a plated layer forming layer on a base material using a predetermined plated layer forming composition; a step of subjecting the plated layer forming layer to a patternwise exposure treatment and a development treatment to form a patterned plated layer containing a portion having a line width of less than 3 μm; a step of applying a plating catalyst or a precursor thereof to the patterned plated layer using an alkaline plating catalyst-applying liquid containing the plating catalyst or the precursor thereof; and a step of subjecting the patterned plated layer to which the plating catalyst or the precursor thereof has been applied to a plating treatment using a plating liquid containing aminocarboxylic acids to form a metal layer on the patterned plated layer.

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Номер записи: 48
10-01-2019 дата публикации

MEANS FOR CARRYING OUT ELECTROLESS METAL DEPOSITION WITH ATOMIC SUB-MONOLAYER PRECISION

Номер: US20190010609A1
Автор: JANUSZEWSKA Aneta, JURCZAKOWSKI Rafal, LEWERA Adam, POLCZYNSKI Piotr, SZABAT Huber
Принадлежит:

The present invention relates to a method of deposition of thin metal layers on different substrates by electroless chemical method. In the method of the invention, the potential of the plating solution, i.e. a solution from which the metal deposition is carried out, is controlled with a redox buffer. The appropriate plating solution is also disclosed. 1. A method of electroless deposition of a metal monolayer or sub-monolayer or a metal multilayer deposit onto a substrate from a plating solution , wherein the deposition process is controlled by means of a redox buffer having comparable concentration of oxidized and reduced form of a redox pair , which is used to adjust the potential of the plating solution and wherein such adjustment of the potential results in deposition of a metal monolayer or sub-monolayer , or a metal multilayer deposit , onto the substrate , which is immersed into said plating solution.2. A method of claim 1 , wherein the adjustment of the plating solution potential by means of a redox buffer is carried out in the presence of a depositing metal precursor claim 1 , and wherein the plating solution potential adjustment results in deposition of the metal onto the substrate.3. A method of claim 1 , wherein the adjustment of the plating solution potential by means of a redox buffer is followed by addition of a depositing metal precursor into said plating solution claim 1 , and wherein the deposition of a metal is controlled by concentration of said depositing metal precursor.4. The method of claim 1 , wherein adjustment of the plating solution potential is carried out before or after the substrate is immersed into said plating solution.5. The method of claim 1 , wherein the addition of the depositing metal precursor is carried out before or after the substrate is immersed into said plating solution.6. The method of claim 1 , wherein the plating solution is an aqueous solution.7. The method of claim 1 , wherein the redox buffer is selected from a ...

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Номер записи: 49
15-01-2015 дата публикации

Plated instrumentation probes and sensors

Номер: US20150013480A1
Автор: Grant O. Cook, Iii, Shari L. Bugaj, Wendell V. Twelves, Jr.
Принадлежит: United Technologies Corp

A component comprises a non-metallic core having an outer surface, a first catalyst deposited onto at least a first portion of the outer surface of the non-metallic core, a second catalyst deposited onto at least a second portion of the outer surface of the non-metallic core, an electrical interface, and a metallic coating. The electrical interface is plated onto the first catalyst, and includes a first interface layer electroless plated onto the first catalyst. The metallic coating is plated onto the second catalyst.

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Номер записи: 50
15-01-2015 дата публикации

SPINDLE MOTOR AND HARD DISK DRIVE

Номер: US20150015109A1
Автор: SUZUKI Akihiko
Принадлежит:

A spindle motor is provided in which the scattering of contaminating particles are prevented in a stainless steel part used therein. so that a hard disk drive can be prevented from being damaged due to collision between the particles adhered on a magnetic disk surface and a magnetic head. The spindle motor has a fixed portion and a rotating portion in which at least a part of one of the fixed portion and the rotating portion is made of stainless steel, and a metallic film is directly formed on the surface of the stainless steel by electroless nickel plating. 1. A spindle motor comprising:a fixed portion; anda rotating portion,wherein at least a part of one of the fixed portion and the rotating portion is made of stainless steel, and a metallic film is directly formed on the surface of the stainless steel by electroless nickel plating.2. The spindle motor according to claim 1 , wherein the metallic film formed by the electroless nickel plating consists of one layer.3. The spindle motor according to claim 1 , wherein the metallic film formed by the electroless nickel plating contains phosphorus (P) or boron (B).4. The spindle motor according to claim 1 , wherein the metallic film formed by the electroless nickel plating is formed on at least one of a rotor hub and a shaft.5. A hard disk drive comprising:{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'the spindle motor according to .'}6. A method for producing a stainless steel part having electroless nickel plating on a surface thereof claim 1 , at least comprising the steps of:acid activation; andelectroless nickel plating,wherein the electroless nickel plating step is performed subsequent to the acid activation step, without washing the part.7. The method for producing a stainless steel part having electroless nickel plating on the surface thereof according to claim 6 , wherein the method further comprises an acid electrolysis step before the acid activation step.8. The method for producing a stainless steel part ...

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Номер записи: 51
10-01-2019 дата публикации

Conductive Fine Particles and Method for Producing Conductive Fine Particles

Номер: US20190013110A1
Автор: MAEHATA Takayuki, YAEGASHI Satoshi
Принадлежит:

The conductive fine particles according to the present invention each have: a core particle containing an acrylic resin; and a silver layer provided directly on the surface of the core particle directly or provided on the surface of the core particle via a nickel layer, wherein the surface coverage rate of the silver layer is 70% or higher. 1. A conductive fine particle comprising:a core particle containing an acrylic resin; anda silver layer provided on a surface of the core particle, directly or via a nickel layer, whereina surface coverage of the silver layer is 70% or more.2. The conductive fine particle according to claim 1 , wherein a number average particle diameter is 1 μm to 100 μm.3. A method for producing a conductive fine particle claim 1 , comprising:treating a core particle containing an acrylic resin with a solution containing a surfactant; andforming a silver layer on the core particle treated with the surfactant, using an electroless silver plating solution.4. The method for producing a conductive fine particle according to claim 3 , further comprising:forming a nickel layer on the core particle treated with the surfactant using an electroless nickel plating solution, before said forming silver layer.5. The method for producing a conductive fine particle according to or wherein a concentration of the surfactant is 0.5 g/L to 20 g/L.6. The method for producing a conductive fine particle according to claim 3 , wherein the surfactant is aminocarboxylate.7. The method for producing a conductive fine particle according to claim 3 , wherein the electroless silver plating solution is a non-cyan electroless silver plating solution.8. The conductive fine particle according to claim 1 , wherein there is no tin layer on the core particle.9. The conductive fine particle according to claim 1 , wherein the core particle carries a catalyst.10. The conductive fine particle according to claim 1 , wherein the catalyst comprises palladium.11. The conductive fine ...

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Номер записи: 52
19-01-2017 дата публикации

Electrodermal Activity Sensor

Номер: US20170014043A1
Автор: Daragh Mcdonnell
Принадлежит: Galvanic Ltd

The present invention is directed towards a method of manufacturing a sensor disc for use as a dry electrode in a skin conductance measuring device, the sensor disc comprising a plurality of layers of different materials and the method of manufacturing comprising the steps of etching a copper base layer; electroplating the copper base layer with an intermediate bright copper layer; plating the intermediate bright copper layer with an intermediate palladium plated layer; and, plating the intermediate palladium plated layer with a gold plated surface layer. The advantage of a method of manufacturing a sensor disc in accordance with the present invention is that a roughened surface is created by the etching. This increased roughness corresponds to an increase in surface area of skin in contact with the sensor disc. The larger contact area implies a larger sweat layer between skin and metal, resulting in reduced electrical impedance and hence an improvement in the signal-to-noise ratio of the skin conductance signal detected by the sensor disc. Furthermore, the surface roughness assists in trapping the sweat, also leading to reduced impedance and an improvement in the signal-to-noise ratio of the detected signals. Moreover, in addition to the high performance of the sensor discs manufactured by this process, the sensor discs produced also meet the ergonomic and aesthetic expectations of a contemporary mass market and may be advantageously utilized in a consumer electronics product.

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Номер записи: 53
18-01-2018 дата публикации

Joining Member, Solder Material, Solder Paste, Formed Solder, Flux Coated Material, and Solder Joint

Номер: US20180015572A1
Автор: HAGIWARA Takashi, Ikeda Atsushi, KAWAMATA Yuji, KAWASAKI Hiroyoshi, Kondo Shigeki, Roppongi Takahiro, Sato Isamu, Soma Daisuke, Tsuruta Kaichi
Принадлежит:

Provided herein is a solder material that includes a spherical core that provides space between a joint object and another object to be joined to the joint object and a solder coated layer that has a melting point at which a core layer of the core is not melted. The solder coated layer includes Sn as a main ingredient and 0 to 2 mass % of Ag, and coats the core. The solder coated layer has an average grain diameter of crystal grains of 3 μm or less, and the solder material has a spherical diameter of 1 to 230 μm and a sphericity of 0.95 or more. 114.-. (canceled)15. A solder material characterized in that the solder material comprises:a spherical core that provides space between a joint object and another object to be joined to the joint object; anda solder coated layer that has a melting point at which a core layer of the core is not melted, contains Sn as a main ingredient and 0 to 2 mass % of Ag, and coats the core, whereinthe solder coated layer has an average grain diameter of crystal grains of 3 μm or less, and the solder material has a spherical diameter of 1 to 230 μm and a sphericity of 0.95 or more.16. The solder material according to claim 15 , wherein the solder coated layer contains brightener.17. The solder material according to claim 15 , wherein the core is a spherical material made of an elemental metal claim 15 , an alloy claim 15 , a metal oxide claim 15 , or a mixed metal oxide of Cu claim 15 , Ni claim 15 , Ag claim 15 , Bi claim 15 , Pb claim 15 , Al claim 15 , Sn claim 15 , Fe claim 15 , Zn claim 15 , In claim 15 , Ge claim 15 , Sb claim 15 , Co claim 15 , Mn claim 15 , Au claim 15 , Si claim 15 , Pt claim 15 , Cr claim 15 , La claim 15 , Mo claim 15 , Nb claim 15 , Pd claim 15 , Ti claim 15 , Zr claim 15 , or Mg claim 15 , or a resin.18. The solder material according to claim 15 , wherein the solder coated layer contains at least one selected from a group consisting of Cu claim 15 , Bi claim 15 , In claim 15 , Zn claim 15 , Ni claim 15 , Co ...

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Номер записи: 54
18-01-2018 дата публикации

Encapsulation of Thermal Energy Storage Media

Номер: US20180016482A1
Автор: Dhau Jaspreet, Goswami D. Yogi, Jotshi Chand K., Stefanakos Elias K.
Принадлежит: UNIVERSITY OF SOUTH FLORIDA

In one embodiment, a method for depositing metal on a polymer surface, the method includes coating the polymer surface with a binding metal to render the polymer surface solvophillic and/or hydrophilic and depositing a further metal on the binding metal-coated polymer surface. 1. A method for depositing metal on a polymer surface , the method comprising:coating the polymer surface with a binding metal to render the polymer surface solvophillic and/or hydrophilic; anddepositing a further metal on the binding metal-coated polymer surface.2. The method of claim 1 , wherein applying a binding metal comprises applying the binding metal to polytetrafluoroethylene (PTFE) claim 1 , fluorinated ethylene propylene (FEP) claim 1 , perfluoroalkoxy (PFA) claim 1 , polyimide claim 1 , polyvinylidene fluoride (PVDF) claim 1 , or a mixture thereof.3. The method of claim 1 , wherein applying a binding metal comprises applying nickel claim 1 , palladium claim 1 , aluminum claim 1 , copper claim 1 , or an alloy thereof.4. The method of claim 1 , wherein applying a binding metal comprises applying the binding metal as small particles in a powder coating technique.5. The method of claim 4 , wherein the particles are approximately 2 to 30 microns in diameter.6. The method of claim 4 , wherein the power coating technique comprises one of rubbing claim 4 , jar milling claim 4 , or rolling.7. The method of claim 1 , wherein depositing a further metal comprises electrolessly depositing a first plating metal on the binding metal-coated polymer surface to form a plated polymer surface.8. The method of claim 7 , wherein the first plating metal comprises copper claim 7 , nickel claim 7 , tin claim 7 , palladium claim 7 , cobalt claim 7 , silver claim 7 , zinc or an alloys thereof.9. The method of claim 7 , wherein electrolessly depositing a first plating metal comprises applying a catalyst to the binding metal-coated polymer surface.10. The method of claim 9 , wherein applying a catalyst ...

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Номер записи: 55
18-01-2018 дата публикации

METAL-CONTAINING PHOTOPOLYMER RESINS GENERATED BY REDUCTION OF DISSOLVED METAL SALTS

Номер: US20180016680A1
Автор: Duoss Eric, GOLOBIC Alexandra, Jackson Julie A., Pascall Andrew
Принадлежит:

According to one embodiment, a three-dimensional structure includes: at least one photopolymer having at least one metal dispersed throughout at least portions of a bulk of the structure. The structure is characterized by features having a horizontal and/or vertical feature resolution in a range from several hundred nanometers to several hundred microns. The portions of the bulk throughout which metal is dispersed may optionally be selectively determined. In more embodiments, the structure may have electroless plated metal formed on surfaces thereof, alternatively or in addition to the metal dispersed throughout the bulk of the structure. The electroless plating may be achieved without the use of a surface activation bath. Corresponding methods for forming various embodiments of such three dimensional structures are also disclosed. 1. A three-dimensional structure , comprising:at least one photopolymer having at least one metal dispersed throughout at least portions of a bulk of the structure; andwherein the structure is characterized by features having a horizontal and/or vertical feature resolution in a range from several hundred nanometers to several hundred microns.2. The structure as recited in claim 1 , wherein the metal is selected from a group consisting of: palladium claim 1 , platinum claim 1 , gold claim 1 , nickel claim 1 , copper claim 1 , and silver.3. The structure as recited in claim 1 , wherein the structure comprises a plurality of layers of the at least one photopolymer claim 1 , each layer having a thickness in a range from about 10 nm to about 500 μm.4. The structure as recited in claim 1 , wherein the at least portions of the bulk of the structure throughout which the metal is dispersed comprises a continuous pathway defining a circuit claim 1 , wherein the continuous pathway is conductive.5. A method for forming a three-dimensional metallized structure claim 1 , the method comprising:dissolving at least one metal salt in a resin comprising one ...

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Номер записи: 56
17-01-2019 дата публикации

FUEL TANK FOR USE WITH SPACECRAFT AND MANUFACTURING METHOD THEREOF

Номер: US20190016481A1
Автор: CHIKU Naruhiko, Maruyama Tatsuya
Принадлежит: KAWASAKI JUKOGYO KABUSHIKI KAISHA

A fuel tank for use with a spacecraft, the fuel tank being configured to store therein fuel for driving the spacecraft, includes a carbon fiber reinforced plastic layer and a metallic plating layer, the carbon fiber reinforced plastic layer has a polished surface having been subjected to polishing processing, the polished surface being on an inner side of the fuel tank, and the metallic plating layer is provided on the polished surface. 1. A fuel tank for use with a spacecraft , the fuel tank being configured to store therein fuel for driving the spacecraft , the fuel tank comprising:a carbon fiber reinforced plastic layer and a metallic plating layer,wherein the carbon fiber reinforced plastic layer has a polished surface having been subjected to polishing processing, the polished surface being on an inner side of the fuel tank, andwherein the metallic plating layer is provided on the polished surface.2. A fuel tank for use with a spacecraft , the fuel tank being configured to store therein fuel for driving the spacecraft , the fuel tank comprising:a carbon fiber reinforced plastic layer and a metallic plating layer,wherein the carbon fiber reinforced plastic layer has a polished surface having been subjected to polishing processing, the polished surface being on an inner side of the fuel tank, andwherein the metallic plating layer is provided on an outer side of the fuel tank.3. The fuel tank for use with the spacecraft claim 1 , according to claim 1 ,wherein the polishing processing is processing performed by use of a polishing instrument with a count of 200 to 2000.4. The fuel tank for use with the spacecraft claim 1 , according to claim 1 ,wherein the metallic plating layer has a thickness of 100 μm or less.5. The fuel tank for use with the spacecraft claim 1 , according to claim 1 ,wherein the metallic plating layer is formed by performing non-electrolytic nickel plating and then performing copper plating.6. A fuel tank for use with a spacecraft claim 1 , the ...

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Номер записи: 57
18-01-2018 дата публикации

Electrolytic Generation of Manganese (III) Ions in Strong Sulfuric Acid Using an Improved Anode

Номер: US20180016685A1
Автор: Chapaneri Roshan V., Clark Terrence, Pearson Trevor
Принадлежит:

An electrolytic cell and a method of electrochemical oxidation of manganese(II) ions to manganese(III) ions in the electrolytic cell are described. The electrolytic cell comprises (1) an electrolyte solution of manganese(II) ions in a solution of 9 to 15 molar sulfuric acid; (2) a cathode immersed in the electrolyte solution; and (3) an anode immersed in the electrolyte solution and spaced apart from the cathode. Various anode materials are described including vitreous carbon, reticulated vitreous carbon, and woven carbon fibers. 1. An electrolytic cell comprising:an electrolyte solution comprising manganese(III) ions in a solution of acid;a cathode in contact with the electrolyte solution; andan anode in contact with the electrolyte solution, wherein the anode comprises a material selected from the group consisting of vitreous carbon, reticulated vitreous carbon, woven carbon fibers, and combinations of one or more of the foregoing.2. The electrolytic cell according to claim 1 , wherein the anode comprises vitreous carbon.3. The electrolytic cell according to claim 1 , wherein the anode comprises woven carbon fibers.4. The electrolytic cell according to claim 3 , wherein the woven carbon fibers have a turbostratic structure.5. The electrolytic cell according to claim 1 , wherein the solution of acid comprises a solution of sulfuric acid.6. The electrolytic cell according to claim 3 , where the woven carbon fibers comprise at least 95% carbon.7. The electrolytic cell according to claim 1 , wherein the cathode comprises a material selected from the group consisting of platinum claim 1 , platinized titanium claim 1 , iridium/tantalum oxide claim 1 , niobium and lead.8. The electrolytic cell according to claim 7 , wherein the cathode comprises lead.9915. A electrolytic cell according to wherein the solution of acid comprises from to molar sulfuric acid.1030-. (canceled)31. A method of etching a plastic part wherein said method comprises contacting the plastic part with ...

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Номер записи: 58
17-01-2019 дата публикации

Surface-independent, surface-modifying, multifunctional coatings and applications thereof

Номер: US20190016901A1
Автор: Haeshin Lee, Phillip B. Messersmith
Принадлежит: Northwestern University

The present invention provides a surface-independent surface-modifying multifunctional biocoating and methods of application thereof. The method comprises contacting at least a portion of a substrate with an alkaline solution comprising a surface-modifying agent (SMA) such as dopamine so as to modify the substrate surface to include at least one reactive moiety. In another version of the invention, a secondary reactive moiety is applied to the SMA-treated substrate to yield a surface-modified substrate having a specific functionality.

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Номер записи: 59
18-01-2018 дата публикации

Nanogrid electrochemical sensor for detection of biochemical species by electrochemical impedance spectroscopy

Номер: US20180017518A1
Автор: Ang JooChuan, Jothimuthu Preetha, Nazir Ahmed Mohammed Inayathullah, Nicolls Mark, Rajadas Jayakumar, Tian Wen A.
Принадлежит:

Improved electrochemical impedance spectroscopy assays are provided by electrodepositing metallic nanoparticles onto the working electrode for electrochemical impedance spectroscopy. The metallic nanoparticles provide improved assay sensitivity. Electrodeposition of the metallic nanoparticles firmly affixes them to the working electrode, thereby making it easier to clean the working electrode from one assay to the next assay without undesirably removing the metallic nanoparticles. 1. A method of performing electrochemical impedance spectroscopy for detection of chemical species , the method comprising:providing a working electrode for electrochemical impedance spectroscopy;bonding metallic nanoparticles to the working electrode with an electrodeposition process;conjugating the metallic nanoparticles with at least one first receptor species;detecting at least one first target species according to impedance changes at the working electrode caused by binding of the first target species to the first receptor species.2. The method of claim 1 , wherein the conjugating the metallic nanoparticles with at least one first receptor species is performed after the bonding metallic nanoparticles to the working electrode with an electrodeposition process.3. The method of claim 2 , further comprising:cleaning the first receptor species from the metallic nanoparticles without removing the metallic nanoparticles from the working electrode;conjugating the metallic nanoparticles with at least one second receptor species;detecting at least one second target species according to impedance changes at the working electrode caused by binding of the second target species to the second receptor species.4. The method of claim 1 , wherein the conjugating the metallic nanoparticles with at least one receptor species is performed prior to the bonding metallic nanoparticles to the working electrode with an electrodeposition process.5. The method of claim 1 , wherein the working electrode is ...

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Номер записи: 60
21-01-2016 дата публикации

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

Номер: US20160020164A1
Автор: Kunieda Masatoshi, Sawada Noriki, Terui Makoto, TOMINAGA Ryojiro
Принадлежит: IBIDEN CO., LTD.

A wiring substrate includes a first outermost conductor layer, a first outermost insulating layer covering the first conductor layer, a second outermost conductor layer formed on opposite side of the first conductor layer, and a second outermost insulating layer covering the second conductor layer. The first insulating layer has first openings such that the first openings are exposing first conductor pads including portions of the first conductor layer, the second insulating layer has second openings such that the second openings are exposing second conductor pads including portions of the second conductor layer, each of the first conductor pads has a first plating layer recessed with respect to outer surface of the first insulating layer, and each of the second conductor pads has a second plating layer formed flush with outer surface of the second insulating layer or having bump shape protruding from the outer surface of the second insulating layer.

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Номер записи: 61
21-01-2021 дата публикации

PLATED LAMINATE AND PRINTED CIRCUIT BOARD

Номер: US20210017650A1
Автор: CHUN Sung Wook, CHUNG Bo Mook, PARK Myong Whan
Принадлежит:

Provided is a plating lamination technology for providing a highly adhesive inner layer of a printed circuit board. The plating lamination technology is effective in providing an electroless plated laminate, including a non-etched/low-roughness pretreated laminate or a low-roughness copper foil, and a printed circuit board including the plated laminate. 1. A plated laminate comprising a plating target and a copper film having a plurality of crystalline protrusions formed on the plating target by electroless copper plating.2. The plated laminate according to claim 1 , wherein each of the crystalline protrusions has a shape in which the lower portion is larger in width than the upper portion.3. The plated laminate according to claim 1 , wherein each of the crystalline protrusions is formed in a pyramidal shape.4. The plated laminate according to claim 1 , wherein the crystalline protrusions are copper crystals having a surface roughness Ra of 100 nm or less.5. The plated laminate according to claim 1 , wherein a metal release layer claim 1 , an organic release layer claim 1 , an electroplated copper foil or a laminate thereof is interposed between the plating target and the copper film.6. The plated laminate according to claim 1 , wherein one or more insulators are further provided on the copper film.7. A method for producing a plated laminate claim 1 , comprising (a) providing a plating target on a substrate and (b) forming a copper film having a plurality of crystalline protrusions on the surface of the plating target.8. The method according to claim 7 , wherein claim 7 , in step (b) claim 7 , the copper film having a plurality of crystalline protrusions is formed using a plating solution containing the smallest possible amount of a copper component capable of forming copper seeds on the surface of the plating target and a nitrogen-containing component capable of diffusing the copper seeds to form a plurality of protrusions on the surface of the plating target.9. ...

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Номер записи: 62
16-01-2020 дата публикации

METHOD FOR METAL LAYER FORMATION

Номер: US20200017974A1
Автор: LIVANOV Konstantin, SHEYNIN Yana, ZAMOSHCHIK Natalia
Принадлежит: OrelTech Ltd.

A method for forming a crystalline metal layer on a three-dimensional (3D) substrate is provided. The method includes applying crystal growth ink to a surface of the 3D substrate, wherein the crystal growth ink includes a metal ionic precursor and a structuring liquid; and exposing the 3D substrate to plasma irradiation from plasma in a vacuum chamber to cause the growing of a crystalline metal layer on the 3D substrate, wherein the exposure is based on a set of predefined exposure parameters. 1. A method for forming a crystalline metal layer on a three-dimensional (3D) substrate , comprising:applying crystal growth ink to a surface of the 3D substrate, wherein the crystal growth ink includes a metal ionic precursor and a structuring liquid; andexposing the 3D substrate to plasma irradiation in vacuum environment to cause the growing of a crystalline metal layer on the 3D substrate, wherein the exposure is based on a set of predefined exposure parameters.2. The method of claim 1 , wherein the exposure to the plasma causes the crystal growth ink to undergo a reduction process where the structuring liquid from the crystal growth ink evaporates and where metal ions from the metal ionic precursor receive electrons from the plasma claim 1 , converting the metal ions to metal atoms and forming a crystalline metal layer on the 3D substrate.3. The method of claim 1 , wherein the crystalline metal layer comprises at least one of: a crystalline claim 1 , a polycrystalline and a semicrystalline layer.4. The method of claim 1 , wherein the crystalline metal layer comprises at least one of: a spread of separate nanocrystals claim 1 , a spread of clusters of nanocrystals claim 1 , an interconnected network of nanocrystals claim 1 , an interconnected network of nanocrystal clusters claim 1 , and a full uniform polycrystalline metal layer.5. The method of claim 1 , wherein the crystal growth ink further comprises at least one of: a spreading liquid claim 1 , a stabilizing liquid ...

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Номер записи: 63
18-01-2018 дата публикации

ACTIVATION METHOD FOR SILICON SUBSTRATES

Номер: US20180019137A1
Автор: Schwarz Christian, SUCHENTRUNK Christof
Принадлежит: ATOTECH DEUTSCHLAND GMBH

The present invention relates to an activation composition for activation of silicon substrates, which is an aqueous solution comprising a source of palladium ions, a source of fluoride ions and at least two aromatic acids. The present invention further relates to a method for its use and optionally for subsequent metallization of such treated substrates. The method can be employed in semiconductor and solar cell manufacturing. 1. An activation composition for activation of silicon substrates wherein the activation composition is an aqueous solution comprising a source of palladium ions and a source of fluoride ions characterized in that it further comprises at least two aromatic acids selected from the group consisting of aromatic carboxylic acids , aromatic sulphonic acids , aromatic sulphinic acids , aromatic phosphonic acids and aromatic phosphinic acids.2. The activation composition of wherein the at least two aromatic acids are selected from the group consisting of aromatic carboxylic acids claim 1 , aromatic sulphonic acids and aromatic phosphonic acids.4. The activation composition according to wherein the proviso is that at least one of Rto Ris a sulphonic acid moiety.5. The activation composition according to wherein the proviso is that at least one of Rto Ris a carboxylic acid moiety.6. The activation composition according to wherein the proviso of one of the at least two aromatic acids is that at least one of Rto Ris a sulphonic acid moiety and the proviso of another one of the at least two aromatic acids is that at least one of Rto Ris a carboxylic acid moiety.7. The activation composition according to wherein the at least two aromatic acids are selected from the group consisting of benzoic acid claim 1 , 1 claim 1 ,2-benzene dicarboxylic acid (phthalic acid) claim 1 , 1 claim 1 ,3-benzenedicarboxylic acid (isophthalic acid) claim 1 , 1 claim 1 ,4-benzene dicarboxylic acid (terephthalic acid) claim 1 , 1 claim 1 ,2 claim 1 ,3-benzene tricarboxylic acid ...

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Номер записи: 64
22-01-2015 дата публикации

ELECTROCHEMICAL STRIP AND MANUFACTURING METHOD THEREOF

Номер: US20150021179A1
Автор: HUANG Chuan-Hsing
Принадлежит:

An electrochemical strip is disclosed. The electrochemical strip includes a substrate and an electrode deposited on the substrate. The electrode includes a conductive paste layer, a first metal layer, a second metal layer, a third metal layer, and a fourth metal layer. The conductive paste is made of a material selected from the group consisting of copper paste, nickel paste, silver paste, and silver-carbon paste. The first metal layer is made of a group VIII metal. The second metal layer is made of nickel. The third metal layer is made of a group VIII metal. The fourth metal layer is made of a material selected from the group consisting of palladium, gold, and platinum. 1. A manufacturing method of an electrochemical strip , comprising steps of:providing a substrate; and printing a conductive paste layer on the substrate;', 'printing a carbon layer on a first region of the conductive paste layer;', 'etching a second region excluding the first region of the conductive paste layer;', 'chemically plating a first metal layer on the second region of the conductive paste layer;', 'chemically plating a second metal layer on the first metal layer;', 'chemically plating a third metal layer on the second metal layer; and', 'chemically plating a fourth metal layer on the third metal layer;', 'wherein the first metal layer is made of a group VIII metal, the second metal layer is made of nickel (Ni), the third metal layer is made of a group VIII metal, and the fourth metal layer is made of a metal selected from the group consisting of palladium (Pd), gold (Au) and platinum (Pt)., 'disposing an electrode layer on the substrate, which comprising steps of2. The manufacturing method of the electrochemical strip as recited in claim 1 , wherein the step of providing the substrate is providing a material selected from the group consisting of polyethylene terephthalate (PET) claim 1 , polycarbonate (PC) claim 1 , polyimide claim 1 , glass fiber and phenolic resin.3. The manufacturing ...

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Номер записи: 65
16-01-2020 дата публикации

CONDUCTIVE BUMP AND ELECTROLESS Pt PLATING BATH

Номер: US20200020660A1
Автор: Sho Kanzaki, Takuma MAEKAWA, Toshiaki Shibata, Yoshito II, Yukinori Oda
Принадлежит: C Uyemura and Co Ltd

The present invention provides a bump that can prevent diffusion of a metal used as a base conductive layer of the bump into a surface of an Au layer or an Ag layer. A conductive bump of the present invention is a conductive bump formed on a substrate. The conductive bump comprises, at least in order from the substrate: a base conductive layer; a Pd layer; a Pt layer; and an Au layer or an Ag layer having directly contact with the Pd layer, wherein a diameter of the conductive bump is 20 μm or less.

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Номер записи: 66
25-01-2018 дата публикации

ENHANCED RELEASE COMPRESSION SHOE FOR USE WITH CONCRETE PRODUCT FORMING MACHINES

Номер: US20180021979A1
Автор: Johnston Llewellyn L.
Принадлежит:

A compression shoe for use on a concrete products forming machine comprises a main body and a plated layer overlaid on the main body. The main body is configured to be slidingly received within a mold cavity of a concrete products mold. The plated layer overlaid on the main body of the compression shoe comprises a uniform electroless nickel (Ni), phosphorus (P), and polytetrafluoroethylene (PTFE) nano dispersion coating to effect enhanced material release characteristics by preventing the build-up of material on the compression shoes and enhancing their wear characteristics. 1. A method for forming a compression shoe for a concrete products machine comprising the steps of:providing a compression shoe having a main body configured to be slidingly received within a mold cavity of a concrete products mold; andutilizing a plated layer overlaid on the main body of the compression shoe comprising an electroless nickel (Ni), and polytetrafluoroethylene (PTFE) nano dispersion coating.2. The method of claim 1 , wherein the step of utilizing a plating layer includes forming the plated layer by co-depositing the electroless nickel simultaneously with the PTFE so that the PTFE is uniformly distributed throughout a depth of the plated layer.3. The method of claim 2 , wherein a rate of deposit on the main body is constant throughout the forming step.4. The method of claim 1 , further including the step of co-depositing a phosphorus (P) material together with the NI and PFTE materials.5. The method of claim 2 , wherein the P is co-deposited with the Ni and PTFE at an approximate 2%-13% infusion rate.6. The method of claim 2 , wherein the P is co-deposited with the Ni and PTFE at an approximate 10% infusion rate throughout the forming step.7. The method of claim 2 , further including the step of applying a heat treatment to the plating layer after the co-depositing step.8. The method of claim 7 , wherein the heat treatment is approximately 400° C.9. The method of claim 1 , wherein ...

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Номер записи: 67
28-01-2016 дата публикации

BIMETALLIC ZINCATING PROCESSING FOR ENHANCED ADHESION OF ALUMINUM ON ALUMINUM ALLOYS

Номер: US20160024676A1
Автор: Chen Lei, Jaworowski Mark R., Willigan Rhonda R.
Принадлежит: UNITED TECHNOLOGIES CORPORATION

A coated metal component includes an aluminum alloy substrate and a protective aluminum coating on a substrate. An interfacial boundary layer between the coating and substrate enhances coating adhesion. The boundary layer includes isolated regions of copper or tin produced by a double zincating process. The protective aluminum coating exhibits improved adhesion and is formed by electrodeposition in an ionic liquid. 1. A coated metal component comprising:an aluminum alloy substrate;an intermediate layer on the substrate comprising isolated islands of a first metal deposited on the aluminum alloy substrate, wherein the first metal is capable of electroless co-depositing with zinc; andan electrodeposited aluminum protective coating on the intermediate layer and aluminum alloy substrate.2. The component of claim 1 , wherein the intermediate layer is deposited using a double zincating and etch process.3. The component of claim 2 , wherein the double zincating and etch process comprises:depositing a sacrificial zinc layer in a first zincating process;acid etching to partially remove the zinc;depositing a bimetallic layer comprising isolated islands of the first metal in a continuous zinc matrix using a second bimetallic zincating process; andelectrolytic etching to remove the zinc to form the intermediate layer.4. The component of claim 3 , wherein the electrolytic etching is in an ionic liquid.5. The component of claim 3 , wherein the first metal is selected from the group consisting of copper and tin.6. The component of claim 3 , wherein the second bimetallic zincate process solution comprises a bimetallic plating solution containing a zincating solution and a minor amount of about 10 wt. % or less of a first metal immersion coating solution.7. The component of claim 6 , wherein the first metal immersion coating solution is selected from the group consisting of Cu claim 6 , Sn claim 6 , Ce claim 6 , and Zr.8. The component of claim 1 , wherein the electrodeposited ...

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Номер записи: 68
21-01-2021 дата публикации

Catalytic Laminate with Conductive Traces formed during Lamination

Номер: US20210022252A1
Автор: BAHL Kenneth S, KARAVAKIS Konstantine
Принадлежит: CATLAM LLC

A circuit board is formed from a catalytic laminate having a resin rich surface with catalytic particles dispersed below a surface exclusion depth. Trace channels and apertures are formed into the catalytic laminate, electroless plated with a metal such as copper, filled with a conductive paste containing metallic particles, which are then melted to form traces. In a variation, multiple circuit board layers have channels formed into the surface below the exclusion depth, apertures formed, are electroless plated, and the channels and apertures filled with metal particles. Several such catalytic laminate layers are placed together and pressed together under elevated temperature until the catalytic laminate layers laminate together and metal particles form into traces for a multi-layer circuit board. 1) A circuit board layer formed from a catalytic pre-preg layer having a distribution of catalytic particles an exclusion depth below a surface layer which are sufficient to provide electroless copper deposition;the circuit board layer having trace channels with a depth below the exclusion depth, the circuit board layer optionally also having apertures;the trace channels having electroless plating in the regions where catalytic particles are exposed;the channels and optional apertures having conductive traces formed from melting a conductive paste in the channels and in said optional apertures.2) The circuit board layer of where said catalytic particles are homogeneous.3) The circuit board layer of where said homogeneous catalytic particles are at least one of: elemental palladium (Pd) transition metal elements group 9 to 11 claim 2 , platinum (Pt) claim 2 , rhodium (Rh) claim 2 , iridium (Ir) claim 2 , nickel (Ni) claim 2 , gold (Au) claim 2 , silver (Ag) claim 2 , cobalt (Co) claim 2 , or copper (Cu).4) The circuit board layer of where said catalytic particles comprise a filler particle coated with a catalyst.5) The circuit board layer of where said filler is at least ...

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Номер записи: 69
28-01-2016 дата публикации

METHOD AND APPARATUS FOR FABRICATION OF METAL-COATED OPTICAL FIBER, AND THE RESULTING OPTICAL FIBER

Номер: US20160025925A1
Автор: Miyachi Masami, Miyamoto Matsuhiro
Принадлежит:

Method and apparatus for producing metal-coated optical fiber involves providing a length of optical fiber having a glass fiber with or without a carbon layer surrounded by a liquid-soluble polymeric coating. The optical fiber is passed through a series of solution baths such that the fiber will contact the solution in each bath for a predetermined dwell time, the series of solution baths effecting removal of the polymer coating and subsequent electroless plating of metal on the glass fiber. The optical fiber is collected after metal plating so that a selected quantity of the metal-coated optical fiber is gathered, Preferably, the glass fiber passes through the series of solution baths without contacting anything except for the respective solution in each. 1. A method for producing metal-coated optical fiber , said method comprising:(a) providing a length of optical fiber having a glass fiber surrounded by a liquid soluble polymeric coating;(b) passing said optical fiber through a series of solution baths such that the glass fiber will contact the solution in each bath for a predetermined dwell time, the series of solution baths effecting removal of said polymer coating and subsequent plating of metal on the glass fiber; and(c) collecting the optical fiber after metal plating so that a selected quantity of said metal-coated optical fiber is gathered.2. A method as set forth in claim 1 , wherein said glass fiber has a carbon layer.3. A method as set forth in claim 1 , wherein said liquid soluble polymeric coating comprises a polymeric material that is removed by a chemical solvent.4. A method as set forth in claim 3 , wherein said polymeric material that is removed by a chemical solvent comprises acrylate.5. A method as set forth in claim 1 , wherein said liquid soluble polymeric coating comprises a water soluble polymer.6. A method as set forth in claim 5 , wherein said water soluble polymer is selected from the group consisting of sodium polyacrylater claim 5 , ...

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Номер записи: 70
23-01-2020 дата публикации

METAL AND/OR CERAMIC MICROLATTICE STRUCTURE AND ITS MANUFACTURING METHOD

Номер: US20200023614A1
Автор: DELLEA Olivier, Lebaigue Olivier, Tardif Francois
Принадлежит:

A metal and/or ceramic microlattice structure, comprising an alternation of first layers and of second layers formed by tubes, and interlocking with each other in order to form open loops cooperating two by two in order to form nodes of an articulated/ball-joint nature. 11121. Metal and/or ceramic microlattice structure () , comprising an alternation of first layers (C) and of second layers (C) in a first direction (D) of the structure;{'b': 1', '2', '1', '1', '1', '2, 'each first layer (C) comprising a plurality of first tubes (.) each extending in a plane parallel to a first reference plane (P) defined by said first direction (D) of the structure as well as by a second direction (D) orthogonal to the first;'}{'b': 2', '2', '2', '2', '1', '3, 'each second layer (C) comprising a plurality of second tubes (.) each extending in a plane parallel to a second reference plane (P) defined by said first direction (D) of the structure as well as by a third direction (D) orthogonal to the first and distinct from the second;'}{'b': 2', '1', '2', '4', '4', '1', '2, 'i': a', 'b, 'each first tube (.) defining, in said second direction (D), an alternation of first and second loops (, ) open, respectively, in a first heading (S) of the first direction, and in a second heading (S) of the first direction opposite to the first;'}{'b': 2', '2', '3', '4', '4', '1', '2, 'i': c', 'd, 'each second tube (.) defining, in said third direction (D), an alternation of third and fourth loops (, ) open, respectively, in the first heading (S) of the first direction, and in the second heading (S) of the first direction;'}{'b': 4', '2', '1', '1', '4', '2', '2', '2', '2', '4', '4', '8', '1, 'i': a', 'd', 'a', 'd, 'the first and second layers being interlocking with each other in such a way that through each first open loop () of each first tube (.) of any given first layer (C), one of the fourth open loops () of one of the second tubes (.) of the second layer (C) directly consecutive to said first ...

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Номер записи: 71
24-01-2019 дата публикации

METHODS FOR METALIZING VIAS WITHIN A SUBSTRATE

Номер: US20190024237A1
Автор: Jayaraman Shrisudersan
Принадлежит:

Methods of metalizing vias are disclosed. A method of metalizing at least one via includes contacting a substrate with a sacrificial metal sheet. The substrate includes a first surface, a second surface, and the at least one via extending between the first surface and the second surface and the first surface or the second surface of the substrate contacts a surface of the sacrificial metal sheet. The method further includes applying a solution comprising metal ions to the substrate and the sacrificial metal sheet such that a Galvanic displacement reaction occurs between the sacrificial metal sheet and the metal ions in the solution until the metal ions form a metal coating on at least one surface of the at least one via. 1. A method of metalizing at least one via , the method comprising: the substrate comprises a first surface, a second surface, and the at least one via extending between the first surface and the second surface, and', 'the first surface or the second surface of the substrate contacts a surface of the sacrificial metal sheet; and, 'contacting a substrate with a sacrificial metal sheet, whereinapplying a solution comprising metal ions to the substrate and the sacrificial metal sheet such that a Galvanic displacement reaction occurs between the sacrificial metal sheet and the metal ions in the solution until the metal ions form a metal coating on at least a portion of one surface of the at least one via.2. The method of claim 1 , wherein the metal coating fills the at least one via.3. The method of claim 1 , wherein the metal coating partially fills the at least one via.4. The method of claim 1 , further comprising:removing the substrate from the sacrificial metal sheet after causing the Galvanic displacement reaction.5. The method of claim 1 , wherein contacting the substrate with the sacrificial metal sheet comprises applying a mechanical force to at least one of the substrate and the sacrificial metal sheet.6. The method claim 1 , further comprising ...

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Номер записи: 72
23-01-2020 дата публикации

COATED GLASS SLEEVES AND METHODS OF COATING GLASS SLEEVES

Номер: US20200024184A1
Автор: Dannoux Thierry Luc Alain, HORN Clemens Rudolf, Tanguy Ronan
Принадлежит:

Disclosed are methods for coating or decorating a surface of a glass sleeve. The methods include depositing a metal layer onto a surface of the glass sleeve by an electroless plating method. Also disclosed are glass sleeves which are coated or decorated on an internal surface, and electronic devices comprising the coated glass sleeves. 1. A hollow glass sleeve comprising an internal surface , at least a portion of said internal surface coated by an electroless plating method comprising:affixing a physical or chemical barrier to at least a portion of the internal surface of the glass sleeve,contacting at least a portion of the internal surface of the glass sleeve with an electroless plating solution for a time sufficient to deposit a metal layer on at least a portion of the glass sleeve,providing a protective layer to the portion of the internal surface of the glass sleeve comprising the deposited metal layer, andremoving the physical or chemical barrier,the electroless plating solution comprising at least one material for providing metal ions to the glass sleeve and at least one reducing agent.2. A hollow glass sleeve comprising an internal surface , said internal surface comprising a layer of metal , wherein said layer of metal comprises trace amounts of at least one reducing agent.3. An electronic device comprising a glass sleeve , the glass sleeve comprising an internal surface ,wherein said internal surface comprises a layer of metal, andwherein said layer of metal comprises trace amounts of at least one reducing agent.4. The electronic device according to claim 3 , chosen from laptops claim 3 , cell phones claim 3 , electronic tablets claim 3 , watches claim 3 , and media players.5. The electronic device according to claim 3 , wherein at least a portion of the internal surface does not comprise a layer of metal.6. The electronic device according to claim 5 , wherein the portion of the internal surface that does not comprise a layer of metal corresponds to a ...

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Номер записи: 73
23-01-2020 дата публикации

MATERIAL DEPOSITION IN A MAGNETIC FIELD

Номер: US20200024741A1
Автор: Cobley Andrew, Danilova Sofya
Принадлежит: Coventry University

The present invention provides for depositing a desired pattern () of magnetic material () on a non-magnetic substrate (). Control of the deposition pattern () is achieved by use of a magnetised template () shaped to correspond to the desired deposition pattern. In use, the template () is placed behind the substrate (). Subsequently, the front surface of the substrate () is exposed to a solution containing the magnetic material () to be deposited. The magnetic material () is attracted to the magnetised template () and consequently is deposited in a pattern () covering areas corresponding to the shape of the template (). 1. A method of selectively depositing a desired pattern of a material on a front surface of a non-conductive substrate , the method comprising the steps of: providing a magnetised template corresponding to the pattern to be deposited; positioning the template behind the substrate; and exposing at least the front surface of the substrate to one or more solutions containing magnetic catalytic material to be deposited and selectively depositing a desired secondary material on the deposited catalyst pattern.25-. (canceled)6. A method as claimed in wherein the catalytic material comprise ions claim 1 , colloid or nanoparticles of a catalytic material that exhibits magnetic properties.7. A method as claimed in wherein the nanoparticles comprise both catalytic material and magnetic material.8. A method as claimed in wherein the nanoparticles comprise a core of magnetic material provided with an outer layer claim 7 , shell or coating of catalytic material.9. A method as claimed in wherein the nanoparticles comprise Janus particles having one end formed of magnetic material and a second end formed of catalytic material.10. A method as claimed in wherein the catalytic material comprises a material for catalysing an electroless plating process.11. A method as claimed in wherein the catalytic material is Carbon claim 1 , Palladium claim 1 , Gold claim 1 , Silver ...

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Номер записи: 74
24-01-2019 дата публикации

Light Emitting Diode and Fabrication Method Thereof

Номер: US20190027652A1
Автор: Chao Jin, Chaoyu Wu, Chen Kang HSIEH, Chih Pang Ma, Chuang Yu HSIEH, Duxiang Wang
Принадлежит: Xiamen Sanan Optoelectronics Technology Co Ltd

A light-emitting diode includes: a light emitting epitaxial structure including a first-type semiconductor layer, an active layer and a second-type semiconductor layer, and having a first surface as a light emitting surface, and an opposing second surface; a conducting layer formed over the second surface and including a physical plating layer and a chemical plating layer, wherein the physical plating layer is adjacent to the light emitting epitaxial structure and has cracks, and the chemical plating layer fills the cracks in the physical plating layer; and a submount coupled to the light emitting epitaxial laminated layer through the conducting layer.

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Номер записи: 75
24-04-2014 дата публикации

Method for electroless plating

Номер: US20140113158A1
Автор: Bexy Dosse, Birgit Beck, Frank Brüning, Johannes Etzkorn
Принадлежит: Atotech Deutschland GmbH and Co KG

The present invention discloses a method for electroless plating of a metal or metal alloy onto a metal or a metal alloy structure comprising a metal such as molybdenum or titanium and alloys containing such metals. The method comprises the steps of activation, treatment in an aqueous solution comprising at least one nitrogen-containing compound or a hydroxy carboxylic acid and electroless plating of a metal or metal alloy.

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Номер записи: 76
29-01-2015 дата публикации

COBALT SUBSTRATE PROCESSING SYSTEMS, APPARATUS, AND METHODS

Номер: US20150030771A1
Автор: GELATOS AVGERINOS V., Zheng Bo, Zope Bhushan
Принадлежит:

Electronic device processing systems including cobalt deposition are described. One system includes a mainframe having a transfer chamber and at least two facets, and one or more process chambers adapted to carry out a metal reduction or metal oxide reduction process and possibly an annealing processes on substrates, and one or more deposition process chambers adapted to carry out a cobalt deposition process. Other systems includes a transfer chamber, one or more load lock process chambers coupled to the transfer chamber that are adapted to carry out a metal reduction or metal oxide reduction process. Additional methods and systems for cobalt deposition processing of substrates are described, as are numerous other aspects. 1. An electronic device processing system , comprising:a mainframe having at least one transfer chamber, and at least two facets;a first process chamber coupled to at least one of the at least two facets and adapted to carry out a metal reduction process or metal oxide reduction process on substrates; andat least one deposition process chamber coupled to another one of the at least two facets and adapted to carry out a cobalt chemical vapor deposition process on substrates.2. The electronic device processing system of claim 1 , wherein the at least one deposition process chamber comprises at least one deposition process chamber set adapted to carry out the cobalt chemical vapor deposition process.3. The electronic device processing system of claim 1 , comprising a second process chamber coupled to another facet and adapted to carry out an annealing process on the substrates.4. The electronic device processing system of claim 1 , comprising:a first mainframe having a first transfer chamber and a first plurality of facets;the first process chamber coupled to one of the plurality of facets and adapted to carry out the metal reduction process or a metal oxide reduction process on substrates;a load lock apparatus coupled to one of the first plurality ...

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Номер записи: 77
29-01-2015 дата публикации

PLATING METHOD, PLATING SYSTEM AND STORAGE MEDIUM

Номер: US20150030774A1
Автор: INATOMI Yuichiro, Iwashita Mitsuaki, Mizutani Nobutaka, Saito Yusuke, Tanaka Takashi
Принадлежит: TOKYO ELECTRON LIMITED

A plating method can improve adhesivity with an underlying layer. The plating method of performing a plating process on a substrate includes forming a first plating layer serving as a barrier film on a substrate baking the first plating layer forming a second plating layer serving as a barrier film; and baking the second plating layer A plating layer stacked body serving as a barrier film is formed of the first plating layer and the second plating layer 1. A plating method of performing a plating process on a substrate , the plating method comprising:a substrate preparing process of preparing the substrate;a plating layer forming process of forming a plating layer having a preset function by performing the plating process on the substrate with a plating liquid; anda plating layer baking process of baking the plating layer by heating the substrate,wherein by repeating the plating layer forming process and the plating layer baking process at least twice, a plating layer stacked body having a first plating layer obtained through a first plating layer forming process and a first plating layer baking process and a second plating layer obtained through a second plating layer forming process and a second plating layer baking process is formed.2. The plating method of claim 1 ,wherein each of the plating layers of the plating layer stacked body functions as a Cu diffusion barrier film.3. The plating method of claim 1 ,wherein each of the plating layers of the plating layer stacked body functions as a seed film for an electrolytic Cu plating layer.4. The plating method of claim 2 ,wherein a catalyst adsorption layer is formed by adsorbing a catalyst onto the substrate before forming the plating layer stacked body.5. The plating method of claim 4 ,wherein an adhesion layer is formed by adsorbing a coupling agent onto the substrate before forming the catalyst adsorption layer.6. The plating method of claim 4 ,wherein the first plating layer of the plating layer stacked body is ...

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Номер записи: 78
24-01-2019 дата публикации

METHOD FOR FORMING CIRCUIT ON SUBSTRATE

Номер: US20190029126A1
Автор: IBE Kouta, Nishikawa Kenichi, SADOHARA Daisuke, Shimoda Katsumi, SUZUKI Keita
Принадлежит: JCU CORPORATION

A new method capable of forming a circuit by performing metal plating on a desired portion on a substrate through a small number of steps regardless of the kind of the substrate. A method for forming a circuit on a substrate characterized in that when forming a circuit by plating on a substrate, the method includes steps of applying a coating film containing a silicone oligomer and a catalyst metal onto the substrate, and thereafter, performing an activation treatment of the catalyst metal in the coating film to make the catalyst metal exhibit autocatalytic properties, and then, performing electroless plating. 1. A method for forming a circuit by plating on a substrate , the method comprising:applying a coating film containing a silicone oligomer and a catalyst metal onto the substrate,thereafter, performing an activation treatment of the catalyst metal in the coating film to make the catalyst metal exhibit autocatalytic properties, andthen, performing electroless plating.2. The method according to claim 1 , further comprising: after the electroless plating claim 1 ,(a1) providing a dry film on a non-circuit forming portion,(b1) performing electroplating on a circuit forming portion,(c1) removing the dry film,(d1) removing an electroless plating film on the non-circuit forming portion, and(e1) removing the coating film on the non-circuit forming portion.3. The method according to claim 1 , further comprising: after the electroless plating is performed claim 1 ,(a2) performing electroplating,(b2) providing a dry film on a circuit forming portion,(c2) removing an electroless plating film and an electroplating film on the non-circuit forming portion,(d2) removing the coating film on the non-circuit forming portion, and(e2) removing the dry film.4. The method according to claim 1 , wherein the activation treatment of the catalyst metal in the coating film is performed only on a circuit forming portion.5. The method according to claim 1 , wherein the coating film is ...

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Номер записи: 79
02-02-2017 дата публикации

Method for activating metal surfaces to be phosphated

Номер: US20170029954A1
Автор: Fabian Junge, Frank Panter, Gregor Müller, Heinrich Meyring, Nicole Weiher
Принадлежит: Thyssenkrupp AG, THYSSENKRUPP STEEL EUROPE AG

A method of activating a metal surface, such as a galvanized steel sheet, before a phosphating process, may involve bringing the metal surface into contact with an activating bath containing activating particles, which may be based on phosphate and/or titanium, dispersed in water. To alleviate or even eliminate the problems of poor adhesion of surface coatings to preferably electrolytically galvanized, phosphated metal strip, an additive that suppresses or at least slows agglomeration of the activating particles may be added to the activating bath. In some examples, polyethylene glycol (PEG) and/or sodium stearate may be added. Further, the particle size distribution of the activating particles present in the activating bath may be determined and the activating bath may be replaced or taken out of operation as a function of the particle size distribution of the activating particles.”

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Номер записи: 80
01-02-2018 дата публикации

METHOD AND DEVICE FOR PRODUCING METAL PATTERNS ON A SUBSTRATE FOR DECORATIVE AND/OR FUNCTIONAL PURPOSES, MANUFACTURE OF OBJECTS INCORPORATING SAID PRODUCTION AND SET OF CONSUMABLES USED

Номер: US20180030599A1
Автор: JAMMES Arnaud, MOURIER DES GAYETS Edouard, Stremsdoerfer Samuel
Принадлежит: JET METAL TECHNOLOGIES

A method for producing metal patterns, which includes depositing a temporary protection on a substrate surface corresponding to the negative of the patterns to be produced; depositing at least one metal on the areas corresponding to the patterns to be produced; and eliminating the temporary protection at least partly during and/or after, or at least partly during and/or after the deposition step. The method can produce decorative objects or functional objects such as printed circuits, integrated circuits, RFID chips, and electronic reader-readable encoding pictograms. A set of consumables used to implement the method is also disclosed. 1. Process for producing metal patterns on a substrate , A. optionally preparing the surface of the substrate intended to receive the metal patterns;', 'B. depositing a temporary protection on the surface of the substrate corresponding to a negative of the patterns to be produced by a screen printing mask/stencil the cut-outs of which correspond to the negative of the patterns to be produced; and/or by direct printing, preferably by ink jet;', 'C. optionally activating the surface of the substrate, in particular the areas corresponding to the patterns to be produced;', 'D. metallization by depositing at least one metal on the areas corresponding to the patterns to be produced;', 'E. eliminating the temporary protection of step B;', 'F. optionally rinsing the surface of the substrate carrying the metal patterns;', 'G. optionally drying the surface of the substrate carrying the metal patterns;', 'H. optionally performing a finishing treatment on the surface of the substrate carrying the metal patterns;, 'comprising the following stepswherein step E of eliminating the temporary protection is carried out, during step D, or at least partly during step D, and/or after step D, or at least partly during and/or after the metallization step D and partly before the metallization step D.2. Process according to claim 1 , wherein step E comprises ...

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Номер записи: 81
01-02-2018 дата публикации

Method for plating on surface of non-conductive substrate

Номер: US20180030600A1
Автор: Hiroki Okada, Mitsuru Haga, SHENGHUA Li
Принадлежит: Rohm and Haas Electronic Materials LLC

A method for forming a metal layer with selectively high adhesion on a desired section(s) on a non-conductive substrate without etching a surface of the non-conductive substrate is disclosed. The method involves applying a specific photosensitive resin composition onto a non-conductive substrate to form a resin layer in a desired section(s) of the non-conductive substrate by exposure and development, and then, to perform pre-treatment with an alkaline solution.

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Номер записи: 82
17-02-2022 дата публикации

SUBSTRATE LIQUID PROCESSING APPARATUS AND SUBSTRATE LIQUID PROCESSING METHOD

Номер: US20220049356A1
Автор: Kaneko Satoshi, Motomatsu Kazuki
Принадлежит:

A substrate liquid processing apparatus includes a substrate holder configured to hold a substrate; a processing liquid supply configured to supply a processing liquid to an upper surface of the substrate held by the substrate holder; a cover body configured to cover the upper surface of the substrate held by the substrate holder; and a gas supply configured to supply an inert gas to a space between the substrate held by the substrate holder and the cover body, the gas supply having a gas supply opening through which the inert gas is discharged. An opening direction of the gas supply opening is directed to a direction other than the upper surface of the substrate held by the substrate holder. 1. A substrate liquid processing apparatus , comprising:a substrate holder configured to hold a substrate;a processing liquid supply configured to supply a processing liquid to an upper surface of the substrate held by the substrate holder;a cover body configured to cover the upper surface of the substrate held by the substrate holder; anda gas supply configured to supply an inert gas to a space between the substrate held by the substrate holder and the cover body, the gas supply having a gas supply opening through which the inert gas is discharged,wherein an opening direction of the gas supply opening is directed to a direction other than the upper surface of the substrate held by the substrate holder.2. The substrate liquid processing apparatus of claim 1 ,wherein the cover body has a ceiling member extended horizontally; a sidewall member extended downwards from the ceiling member; and a heater provided in the ceiling member and configured to generate heat.3. The substrate liquid processing apparatus of claim 2 ,wherein the gas supply is provided at the sidewall member.4. The substrate liquid processing apparatus of claim 2 ,wherein the gas supply is provided at the ceiling member.5. The substrate liquid processing apparatus of claim 2 ,wherein the opening direction is ...

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Номер записи: 83
17-02-2022 дата публикации

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME

Номер: US20220049357A1
Автор: KAWASUMI Misako, SUNAMOTO Masatoshi, UENO Ryuji
Принадлежит: Mitsubishi Electric Corporation

Provided is a semiconductor device, including: a front-back conduction-type semiconductor element; a front-side electrode formed on the front-back conduction-type semiconductor element; an electroless nickel-containing plating layer formed on the front-side electrode; and an electroless gold plating layer formed on the electroless nickel-containing plating layer, wherein the semiconductor device has a low-nickel concentration layer on a side of the electroless nickel-containing plating layer in contact with the electroless gold plating layer, and wherein the low-nickel concentration layer has a thickness smaller than that of the electroless gold plating layer. 115.-. (canceled)16. A semiconductor device , comprising:a front-back conduction-type semiconductor element;a front-side electrode formed on the front-back conduction-type semiconductor element;an electroless nickel-containing plating layer formed on the front-side electrode; andan electroless gold plating layer formed on the electroless nickel-containing plating layer,wherein the semiconductor device has a low-nickel concentration layer on a side of the electroless nickel-containing plating layer in contact with the electroless gold plating layer, and the low-nickel concentration layer has a thickness smaller than a thickness of the electroless gold plating layer.17. A semiconductor device , comprising:a front-back conduction-type semiconductor element;a front-side electrode formed on a front-side surface of the front-back conduction-type semiconductor element;a back-side electrode formed on a back-side surface of the front-back conduction-type semiconductor element;an electroless nickel-containing plating layer formed on each of the front-side electrode and the back-side electrode; andan electroless gold plating layer formed on each of the electroless nickel-containing plating layers,wherein the semiconductor device has a low-nickel concentration layer on a side of the electroless nickel-containing plating ...

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Номер записи: 84
31-01-2019 дата публикации

SHEET MATERIAL, METAL MESH, WIRING SUBSTRATE, DISPLAY DEVICE AND MANUFACTURING METHODS THEREFOR

Номер: US20190032219A1
Автор: ABE Hisayuki, HORIKAWA Yuhei, KANBAYASHI Yoshihiro, ORIKASA Makoto
Принадлежит: TDK Corporation

A sheet material includes a resin layer containing a binder and catalyst particles, an electroless plating film on the side of one main surface of the resin layer and including first electroless plating films and a second electroless plating film, and a base material on the side of the other main surface of the resin layer. 1. A sheet material comprising a resin layer comprising a binder and a plurality of catalyst particles; an electroless plating film provided on the side of one main surface of the resin layer and comprising first electroless plating films and a second electroless plating film; and a base material provided on the side of the other main surface of the resin layer , whereinat least some of the plurality of catalyst particles respectively have exposure surfaces exposed from the one main surface of the resin layer, and the plurality of exposure surfaces are scattered on the one main surface of the resin layer,the first electroless plating films are provided on the one main surface of the resin layer to respectively surround the plurality of exposure surfaces of the catalyst particles, andthe second electroless plating film is provided to cover the first electroless plating films, and a main surface, on the side of the first electroless plating films, of the second electroless plating film forms concave portions, respectively, along surfaces of the first electroless plating films.2. The sheet material according to claim 1 , wherein an average value of respective longest diameters of the first electroless plating films is 18 to 90 nm when the one main surface of the resin layer is viewed in a planar view from the side of the electroless plating film.3. The sheet material according to claim 1 , wherein an area ratio of the first electroless plating films to the one main surface of the resin layer is 80 to 99% when the one main surface is viewed in a planar view from the side of the electroless plating film.4. The sheet material according to claim 1 , ...

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Номер записи: 85
31-01-2019 дата публикации

SHEET MATERIAL, METAL MESH AND METHOD FOR MANUFACTURING THEREOF

Номер: US20190032221A1
Автор: ABE Hisayuki, Ashizawa Hiroki, HORIKAWA Yuhei, KANBAYASHI Yoshihiro, MORI Miho, ORIKASA Makoto, TAMURA Misaki
Принадлежит:

A sheet material includes a resin layer containing a binder and polypyrrole particles, an electroless plating film provided on the side of one main surface of the resin layer and including first electroless plating films and a second electroless plating film, and a transparent base material provided on the side of the other main surface of the resin layer. 1. A sheet material comprising:a resin layer comprising a binder and a plurality of polypyrrole particles; an electroless plating film provided on the side of one main surface of the resin layer and comprising first electroless plating films and a second electroless plating film; and a transparent base material provided on the side of the other main surface of the resin layer, whereinat least some of the plurality of polypyrrole particles respectively have exposure surfaces exposed from the one main surface of the resin layer, and the plurality of exposure surfaces are scattered on the one main surface of the resin layer,the first electroless plating films are provided on the one main surface of the resin layer to respectively surround the plurality of exposure surfaces of the polypyrrole particles, andthe second electroless plating film is provided to cover the first electroless plating films, and a main surface, on the side of the first electroless plating films, of the second electroless plating film forms concave portions, respectively, along surfaces of the first electroless plating films.2. The sheet material according to claim 1 , wherein an average value of respective longest diameters of the first electroless plating films is 18 to 90 nm when the one main surface of the resin layer is viewed in a planar view from the side of the electroless plating film.3. The sheet material according to claim 1 , wherein an area ratio of the first electroless plating films to the one main surface of the resin layer is 80 to 99% when the one main surface is viewed in a planar view from the side of the electroless plating ...

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Номер записи: 86
05-02-2015 дата публикации

Thermoplastic composition

Номер: US20150035720A1
Автор: Bernardus Antonius Gerardus Schrauwen
Принадлежит: MITSUBISHI CHEMICAL EUROPE GMBH

A thermoplastic composition including a) a thermoplastic resin and b) a laser direct structuring (LDS) additive in an amount of at least 1 wt. % with respect to the weight of the total composition, wherein the LDS additive includes a mixed metal oxide including at least tin and a second metal selected from the group consisting of antimony, bismuth, aluminium and molybdenum, wherein the LDS additive includes at least 40 wt. % of tin and wherein the weight ratio of the second metal to tin is at least 0.02:1.

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Номер записи: 87
04-02-2021 дата публикации

SHAFT MEMBER AND MANUFACTURING METHOD OF SHAFT MEMBER

Номер: US20210032756A1
Автор: IGUCHI Shoji, KITA Akihiko, Matsumoto Osamu, Mori Takahiro, OZAWA Seiya
Принадлежит:

A shaft member of an embodiment includes: a base material having a shaft shape and made of steel; a low phosphorus plating layer that is laminated on the base material, that includes phosphorus, and in which the phosphorus content is 4.5 mass % or less; and a base plating layer that is formed as an electrolytic nickel phosphorus plating layer or a high phosphorus plating layer laminated between the base material and the low phosphorus plating layer. It is thus possible to increase the strength of the shaft member and decrease the size of the shaft member. 1. A shaft member comprising:a base material having a shaft shape and made of steel;a low phosphorus plating layer that is laminated on the base material, that includes phosphorus, and in which a phosphorus content is 4.5 mass % or less; anda base plating layer that is formed as an electrolytic nickel phosphorus plating layer or a high phosphorus plating layer laminated between the base material and the low phosphorus plating layer.2. The shaft member according to claim 1 , wherein the base material is high carbon steel or high carbon alloy steel.3. The shaft member according claim 2 , wherein a carbon content of the high carbon steel or high carbon alloy steel is set to be 0.85 to 1.10 mass %.4. The shaft member according to claim 1 , wherein a thickness of the base plating layer is set to be smaller than a thickness of the low phosphorus plating layer.5. The shaft member according to claim 1 , wherein the phosphorus content of the low phosphorus plating layer is set to be 1.0 to 1.5 mass %.6. The shaft member according to claim 1 , wherein a surface of the shaft member is the low phosphorus plating layer.7. A manufacturing method of a shaft member comprising:a degreasing step of performing electroless degreasing or anodic electrolytic degreasing for a predetermined time on a base material made of steel that configures a shaft member; anda plating step of performing low phosphorus-type plating in which a ...

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Номер записи: 88
05-02-2015 дата публикации

METHOD FOR REGENERATING PLATING LIQUID, PLATING METHOD, AND PLATING APPARATUS

Номер: US20150037512A1
Автор: Banno Tatsuya, Goto Katsuhiro, Kanazawa Nobuhiro
Принадлежит: FUJI SHOJI CO., LTD.

A problem to be solved is to provide a method for regenerating plating liquid from plating waste liquid in a simple and easy way and a plating method utilizing the regenerating method. 1. A plating liquid regenerating method comprising:(i) applying electric current between a plating waste liquid side taken as a cathode and an electrolytic solution side taken as an anode, such that the plating waste liquid and the electrolytic solution are connected through an anion exchanger, wherein the plating waste liquid comprises Fe ions and Cu ions;(ii) separating copper from the plating waste liquid by making a copper deposition electrode as a result of depositing copper on an electrode in contact with the plating waste liquid, to convert the plating waste liquid to a processed remaining liquid, wherein an anode in contact with the electrolytic solution is a copper deposition electrode formed previously;(iii) dissolving copper in the electrolytic solution to generate a copper ion-containing solution; andrepeating (i), (ii) and (iii) one or more times.2. The method of claim 1 , wherein the plating waste liquid further comprises stannous ions.3. The method of claim 1 , further comprising:removing iron from the processed remaining liquid by depositing a substance containing iron by taking the processed remaining liquid as a cathode side and new electrolytic solution, connected to the processed remaining liquid through an anion exchanger, as an anode side and then by applying electric current;wherein a solution comprising water is present on the anode side as an electrolytic solution after the iron has been removed from the processed remaining liquid.43. The method of claim 1 , further comprising claim 1 , before the iron is removed from the processed remaining liquid claim 1 , raising a pH by adding an oxygen-containing chemical compound comprising HO claim 1 , Oor HO.5. The method of claim 1 , wherein the applied electric current is of an amount that corresponds to the greater ...

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Номер записи: 89
05-02-2015 дата публикации

CONTINUOUS PROCESS FOR COATING STEEL WIRE CORD

Номер: US20150037582A1
Автор: Corsaut William J., Domer Christine, Hergenrother William L., Jones Byron L.
Принадлежит: BRIDGESTONE AMERICAS TIRE OPERATIONS, LLC

Continuous processes for producing a coated steel wire are provided. The processes entail wetting steel wire in an aqueous solution comprising at least 95% water and 0.01 to 5% weight/weight of the carboxylic acid salt of an alkoxy modified silsesquioxane of formula (I), evaporating water from the wet coated steel wire to form a mostly-dry coated steel wire and then heating (one or more steps) the mostly-dry coated steel wire at a temperature of 50-240° C. such that the steel wire reaches a minimum temperature of at least 110° C. in at least one step, thereby forming a dry coated steel wire. The coated steel wire is optionally covered with rubber skim or otherwise embedded into rubber and can be incorporated into various objects including tires, conveyor belts, hoses and the like. The silsesquioxane coating improves adhesion between the steel wire and the rubber skim/other rubber covering. 115-. (canceled)17. The process of claim 16 , whereinthe alkoxy modified silsesquioxane comprises at least 10 mole % mercapto functionalized silsesquioxane and at least 55 mole % amino functionalized silsesquioxane;the aqueous solution has a pH of between 4 and 6.5;the step of evaporating water comprises using a warm air current; andthe one or more steps comprises one step of heating at a temperature between 50 and 240° C. such that the steel wire reaches a minimum temperature of at least 110° C. during the heating thereby forming a dry coated steel wire with a continuous silsesquioxane coating of thickness between 5 and 300 nm.18. The process of claim 16 , wherein the aqueous solution comprises 0.01 to 2% weight/volume of the carboxylic acid salt of the alkoxy modified silsesquioxane of formula (I).19. The process of claim 16 , wherein the semi-dry coated steel wire is heated at a temperature between 110 and 240° C. in one step.20. The process of claim 16 , wherein the steel wire that is passed through the aqueous solution contains a coating of a metal selected from the group ...

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Номер записи: 90
05-02-2015 дата публикации

THREE-DIMENSIONAL COPPER NANOSTRUCTURE AND FABRICATION METHOD THEREOF

Номер: US20150037597A1
Автор: CHO Sung-Woon, KIM Chang-Koo
Принадлежит: AJOU UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION

This invention relates to a method of fabricating a three-dimensional copper nanostructure, including manufacturing a specimen configured to include a SiOmask; performing multi-directional slanted plasma etching to form a three-dimensional etching structure layer on the specimen; performing plating so that a multi-directional slanted plasma etched portion of the specimen is filled with a metal; removing an over-plated portion and the SiOmask from the metal layer; and removing a portion of a surface of the specimen other than the metal which is the three-dimensional etching structure layer. In this invention, a uniform copper nanostructure array can be obtained by subjecting a large-area specimen disposed in a Faraday cage to multi-directional slanted plasma etching using high-density plasma, forming a copper film on the etched portion of the specimen, and removing an over-plated copper film and the SiOmask, and the diameter of the copper nanostructure can be arbitrarily adjusted, thus attaining high applicability. 1. A method of fabricating a three-dimensional copper nano structure , comprising:{'sub': '2', 'manufacturing a specimen configured to include a SiOmask;'}performing multi-directional slanted plasma etching to form a three-dimensional etching structure layer on the specimen;performing plating so that a multi-directional slanted plasma etched portion of the specimen is filled with a metal to form a metal layer;{'sub': '2', 'removing an over-plated portion and the SiOmask from the metal layer; and'}removing a portion of a surface of the specimen other than the metal which is the three-dimensional etching structure layer.2. The method of claim 1 , wherein the multi-directional slanted plasma etching is performed by subjecting the specimen to multi-directional slanted plasma etching using a Faraday cage.3. The method of claim 2 , wherein the multi-directional slanted plasma etching is carried out by changing an ion irradiation direction or by changing an ion ...

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Номер записи: 91
04-02-2016 дата публикации

METHOD FOR THE METALLATION OF A WORKPIECE AND A LAYER STRUCTURE MADE UP OF A WORKPIECE AND A METAL LAYER

Номер: US20160037650A1
Автор: HAUMANN Eugen, KRUEGER Robin Alexander, OSTHOLT Roman, ROESENER Bernd
Принадлежит:

A method for the at least portion-wise and adhesive metallisation of a non-conductive workpiece includes introducing periodic microstructures into the workpiece in regions to be metallised, within an area to be metallised that is enclosed by one or more limiting lines, by moulding a tool that is microstructured in accordance with the regions to be metallised within a moulding area. 1. A method for the at least portion-wise and adhesive metallisation of a non-conductive workpiece , the method comprising:introducing periodic microstructures into the workpiece in regions to be metallised, within an area to be metallised that is enclosed by one or more limiting lines, by moulding a tool that is microstructured in accordance with the regions to be metallised within a moulding area.2. The method of claim 1 , wherein the moulding tool comprises a primary shaping metallic tool.3. The method of claim 1 , wherein the moulding tool comprises a forming metallic tool.4. The method of claim 1 , wherein the microstructures of the tool are produced by laser radiation.5. The method of claim 4 , wherein the pulse length of the laser radiation is less than one nanosecond.6. The method of claim 1 , wherein the microstructures in the tool are cone like protrusions.7. The method of claim 1 , wherein a metal layer produced by the metallisation has an adhesive strength according to ASTM D1876-08 of at least 3 N/cm claim 1 , in particular of 5 N/cm.8. The method of claim 1 , wherein a component of the non-conductive workpiece is a polymer.9. The method of claim 1 , wherein a surface of the workpiece is provided in part with microstructures having a different form.10. The method of claim 1 , wherein the workpiece is thermally treated in the course of the method.11. The method of claim 1 , wherein the microstructures are repeatedly reproduced by the tool on a workpiece surface of the same workpiece.12. The method of claim 1 , wherein the adhesive metal layer is applied to a surface of the ...

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Номер записи: 92
04-02-2016 дата публикации

PROCESS FOR PRODUCING THREE-DIMENSIONAL CONDUCTIVE PATTERN STRUCTURE, AND MATERIAL FOR THREE-DIMENSIONAL MOLDING FOR USE THEREIN

Номер: US20160037651A1
Автор: Tsujimoto Kazuhisa, UESUGI Takashi
Принадлежит: SEIREN CO., LTD.

[Problem] To provide: a material which is for three-dimensional molding and on which a conductive pattern that exhibits excellent adhesiveness even after the three-dimensional molding can be formed; and a process for producing a three-dimensional conductive pattern structure, said process using this material for three-dimensional molding and necessitating no special apparatus. [Solution] This three-dimensional conductive pattern structure is produced by: using a material which is for three-dimensional molding and which has, in at least a part thereof, a surface made of a polyimide resin; conducting, in a surface portion () made of a polyimide resin, the formation of a modified pattern and then the adsorption and reduction of metal ions to form a material which is provided with a pattern () having a plating-catalyzing activity; and subjecting the material which is provided with the pattern () to three-dimensional molding and electroless plating successively. 1. A process for producing a three-dimensional conductive pattern structure having a conductive pattern formed on the surface of a three-dimensional structure , which comprises the following steps a)-d):a) a modified-pattern forming step wherein a material for three-dimensional molding having a polyimide resin surface in at least a part thereof is subjected to pattern printing on said polyimide resin surface using a modifier to produce a material for three-dimensional molding on which a modified-pattern with cloven imide rings is formed,b) a plating-catalytic-active pattern forming step wherein, on the pattern-formed place of said material for three-dimensional molding on which a modified-pattern is formed which is obtained by the step a), metal ions having plating catalytic activity are adsorbed, and subsequently said metal ions are reduced to produce a material for three-dimensional molding on which a pattern having plating catalytic activity is formed,c) a three-dimensional molding step wherein said material ...

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Номер записи: 93
11-02-2016 дата публикации

ROLL-TO-ROLL ELECTROLESS PLATING SYSTEM WITH LOW DISSOLVED OXYGEN CONTENT

Номер: US20160040292A1
Автор: Reuter Shawn A., Wainwright Gary P.
Принадлежит:

A roll-to-roll electroless plating system including a sump containing a first volume of a plating solution, and a pan containing a second volume of the plating solution, the second volume being less than the first volume. A web advance system advances a web of media though the plating solution in the pan, wherein a plating substance in the plating solution is plated onto predetermined locations on a surface of the web of media. A pan-replenishing pump moves plating solution from the sump to the pan through a pipe. A distribution system injects an inert gas into the plating solution to reduce the amount of dissolved oxygen. 1. A roll-to-roll electroless plating system , comprising:a sump containing a first volume of a plating solution;a pan containing a second volume of the plating solution, the second volume being less than the first volume;a web advance system for advancing a web of media from an input roll though the plating solution in the pan along a web advance direction and to a take-up-roll, wherein a plating substance in the plating solution is plated onto predetermined locations on a surface of the web of media as it is advanced through the plating solution in the pan;a pan-replenishing pump for moving plating solution from the sump to the pan through a pipe connected to an outlet of the pan-replenishing pump; anda distribution system for injecting an inert gas into the plating solution.2. The roll-to-roll electroless plating system of claim 1 , wherein the distribution system is configured to inject micro-bubbles of the inert gas into the plating solution claim 1 , wherein the micro-bubbles have a diameter between about one micron and one millimeter.3. The roll-to-roll electroless plating system of claim 1 , wherein the plating substance is copper claim 1 , silver claim 1 , nickel or palladium.4. The roll-to-roll electroless plating system of claim 1 , wherein the inert gas is nitrogen or argon.5. The roll-to-roll electroless plating system of claim 1 , ...

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Номер записи: 94
08-02-2018 дата публикации

Composite plating film

Номер: US20180037997A1
Автор: DONG Shuxin, MURASE Masakazu, OHTA Riichiro
Принадлежит: KABUSHIKI KAISHA TOYOTA CHUO KENKYUSHO

An object is to provide a composite plating film excellent in the water-repellent property and oil-repellent property using a material that is less likely to accumulate in the environment, as substitute for a fluorine resin. A composite plating film is provided which includes an alloy matrix phase and a silicone dispersed in the alloy matrix phase. In the composite plating film, the silicone preferably has Hansen solubility parameters comprising a dispersion term δof 15 MPaor less, a polar term δof 3 MPaor less, and a hydrogen bonding term δof 3 MPaor less. The silicone preferably has an interaction radius of a Hansen solubility sphere of 5.0 MPaor less. 1. A composite plating film comprising:an alloy matrix phase; anda silicone dispersed in the alloy matrix phase.2. The composite plating film as recited in claim 1 , wherein the silicone has a siloxane skeleton of which a side chain group is an alkyl group.3. The composite plating film as recited in claim 1 , wherein the silicone has Hansen. solubility parameters comprising a dispersion term δof 15 MPaor less claim 1 , a polar term δof 3 MPaor less claim 1 , and a hydrogen bonding term δof 3 MPaor less.4. The composite plating film as recited in claim 1 , wherein the silicone has an interaction radius of a Hansen solubility sphere of 5.0 MPaor less.5. The composite plating film as recited in claim 1 , wherein the silicone comprises particles having a particle size of 20 micrometers or less.6. The composite plating film as recited in claim 1 , wherein the silicone is octamethylsilsesquioxane.7. The composite plating film as recited in claim 1 , wherein the silicone contained in the composite plating film has a content ratio of 3.5 mass % or more to the composite plating film as a whole as a mass percentage of Si atoms that constitute the silicone claim 1 ,8. The composite plating film as recited in claim 1 , wherein a static contact angle of water on the composite plating film is 100 degrees or more.9. The composite ...

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Номер записи: 95
09-02-2017 дата публикации

Chemically Amplified Positive Resist Composition and Pattern Forming Process

Номер: US20170038684A1
Автор: ASAI Satoshi, HIRANO Yoshinori, Takemura Katsuya
Принадлежит: SHIN-ETSU CHEMICAL CO., LTD.

A chemically amplified positive resist composition is provided comprising (A) a polymer adapted to tarn soluble in alkaline aqueous solution under the action, of acid, (B) a photoacid generator, (C) a car boxy lie acid, and (D) a benzotriazole compound and/or an imidazole compound. When the resist composition is coated on a copper substrate as a thick film of 5-250 μm thick and lithographically processed into a pattern, a high resolution is available and the pattern is of rectangular profile. 2. The resist composition of wherein the carboxylic acid is at least one C-Ccarboxylic acid selected from the group consisting of a saturated or unsaturated aliphatic carboxylic acid claim 1 , alicyclic carboxylic acid claim 1 , oxy carboxylic acid claim 1 , alkoxy carboxylic acid claim 1 , keto carboxylic acid claim 1 , and aromatic carboxylic acid.3. The resist composition of wherein the carboxylic acid is a dicarboxylic acid.4. The resist composition of wherein the dicarboxylic acid is a dicarboxylic acid having a saturated aliphatic alkyl chain.6. The resist composition of claim 1 , further comprising (E) an organic solvent.7. A dry film comprising a support film and a layer formed thereon from the chemically amplified positive resist composition of .8. A pattern forming process comprising the steps of forming a coating of the chemically amplified positive resist composition of or the layer of the chemically amplified positive resist composition of on a substrate claim 1 , optionally prebaking claim 1 , exposing the coating or layer to radiation or electron beam through a photomask claim 1 , optionally baking claim 1 , and developing in a developer.9. The process of wherein the step of exposing the coating or layer to radiation uses radiation with a wavelength of longer than 300 nm.10. The process of claim 8 , further comprising the step of forming a metal plating on the substrate by electroplating or electroless plating claim 8 , subsequent to the developing step. This non ...

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Номер записи: 96
12-02-2015 дата публикации

Electroless Nickel Plating Solution and Method

Номер: US20150044374A1
Автор: Janik Robert, Micyus Nicole J.
Принадлежит: MACDERMID ACUMEN, INC.

An electroless nickel plating solution and a method of using the same is described. The electroless nickel plating solution comprises (i) a source of nickel ions; (ii) a reducing agent; (iii) one or more complexing agents; (iv) one or more bath stabilizers; (v) a brightener, said brightener comprising a sulfonated compound having sulfonic acid or sulfonate groups; and (vi) optionally, one or more additional additives. The use of the sulfonated compound brightener results in a bright electroless nickel deposit on various substrates having a high gloss value. 1. An electroless nickel plating solution comprising:a) a source of nickel ions;b) a reducing agent;c) one or more complexing agents;d) one or more bath stabilizers; ande) a brightener, said brightener comprising a sulfonated compound selected from the group consisting of alkyl or aryl substituted sulfonamides, alkyl or aryl substituted sulfonic acids, alkyl or aryl substituted sulfosuccinates, and alkyl or aryl substituted sulfonates.2. The electroless nickel plating solution according to claim 1 , wherein the source of nickel ions comprises a nickel salt selected from the group consisting of nickel bromide claim 1 , nickel fluoroborate claim 1 , nickel sulfonate claim 1 , nickel sulfamate claim 1 , nickel alkyl sulfonate claim 1 , nickel sulfate claim 1 , nickel chloride claim 1 , nickel acetate claim 1 , nickel hypophosphite and combinations of one or more of the foregoing.3. The electroless nickel plating solution according to claim 2 , wherein the sulfonated compound is selected from the group consisting of 2-amino ethane sulfonic acid claim 2 , toluene sulfonamide claim 2 , 1-octane sulfonic acid claim 2 , 2-chloro-hydroxy-propane sulfonic acid claim 2 , saccharin claim 2 , sodium diamyl sulfosuccinate claim 2 , sodium 1 claim 2 ,4 claim 2 ,-bis(1 claim 2 ,3-dimethylbutyl) sulfosuccinate claim 2 , sulfosuccinic acid claim 2 , and sodium allyl sulfonate.4. The electroless nickel plating solution according to ...

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Номер записи: 97
08-02-2018 дата публикации

Transparent electrode, method for manufacturing same, and organic electroluminescent element

Номер: US20180040846A1
Автор: Kazuhiro Yoshida, Shigeru Kojima, Shun Furukawa, Takeshi Hakii
Принадлежит: KONICA MINOLTA INC

The present invention addresses the problem of providing a transparent electrode having a low resistance and high storage stability, a method for manufacturing the transparent electrode, and an organic electroluminescent element. This transparent electrode wherein a metal conductive layer is provided on a substrate is characterized in that: the metal conductive layer has a metal fine line, and a plating layer covering the metal fine line; the transparent electrode has a transparent conductive layer on a substrate surface on the side on which the metal fine line is formed, said transparent conductive layer covering the substrate and the metal conductive layer; and the metal fine line is formed using a metal nano-particle ink or a metal complex ink.

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Номер записи: 98
24-02-2022 дата публикации

PATTERN PLATE FOR PLATING AND METHOD FOR MANUFACTURING WIRING BOARD

Номер: US20220056586A1
Автор: IGUCHI HIDEO, NIRENGI Takayoshi
Принадлежит:

A plating-pattern plate is configured to transfer, to a substrate, a transfer pattern formed by plating. The plating-pattern plate includes a base body and transfer parts disposed on the base body. Each of the transfer parts has a transfer surface configured to have the transfer pattern to be formed on the transfer surface by plating. The transfer parts are disposed electrically independent of one another on the base body. The plating-pattern plate provides a fine conductive pattern with stable quality. 1. A plating-pattern plate configured to transfer , to a substrate , a transfer pattern formed by plating , the plating-pattern plate comprising:a base body; anda plurality of transfer parts disposed on the base body, whereineach of the plurality of transfer parts has a transfer surface configured to have the transfer pattern to be formed on the transfer surface by plating, andthe plurality of transfer parts are disposed electrically independent of one another on the base body.2. The plating-pattern plate of claim 1 , wherein the base body is light-transmissive.3. The plating-pattern plate of claim 1 , wherein the transfer surfaces of the each of the plurality of transfer parts contain iron and nickel.4. The plating-pattern plate of claim 3 , wherein the plurality of transfer parts are formed by electroplating.5. The plating-pattern plate of claim 3 , wherein the plurality of transfer parts is made of alloy in which a percentage content of a total of iron and nickel is not less than 80%.6. The plating-pattern plate of claim 5 , wherein a ratio of the iron of the plurality of transfer parts to the total of the iron and the nickel the plurality of transfer parts is not less than 20%.7. The plating-pattern plate of claim 1 , wherein claim 1 , the plurality of transfer parts have thicknesses equal to or larger than 0.1 μm.8. The plating-pattern plate claim 1 , wherein the each of the plurality of transfer parts includes:a first metal layer having the transfer surface and ...

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Номер записи: 99
24-02-2022 дата публикации

METAL COATING METHOD FOR PLASTIC OUTER SHAPE REQUIRING ROBUSTNESS

Номер: US20220056588A1
Автор: BAEK Sook Eun, RYU Seung Kyun
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This application relates to a metal coating method for plastic outer part requiring robustness. In the metal coating method, first, provide a plastic outer part as a motion assistance tool. Thereafter, a cold plasma treatment is performed to introduce a polar functional group to a surface of the plastic outer part by treating the plastic outer part with cold plasma. Next, a metal coating layer is formed on the surface of the plastic outer part treated with the cold plasma by an electroless plating method. Thereafter, an adhesive strength improvement process of improving an adhesive strength between the metal coating layer and the plastic outer part to 1,000 g/cmor more by heat treatment of the plastic outer part with the metal coating layer thereon is performed. 1. A metal coating method for plastic outer part requiring robustness , the metal coating method comprising:providing a plastic outer part as a motion assistance tool;performing a cold plasma treatment by treating the plastic outer part with cold plasma to introduce a polar functional group to a surface of the plastic outer part;forming a metal coating layer, by an electroless plating method, on the surface of the plastic outer part which has been treated with the cold plasma; and{'sup': '2', 'increasing an adhesive strength between the metal coating layer and the plastic outer part to 1,000 g/cmor more by heat-treating the plastic outer part with the metal coating layer thereon.'}2. The metal coating method of claim 1 , wherein claim 1 , in the increasing of the adhesive strength claim 1 , a heat treatment is performed by heating the plastic outer part with the metal coating layer thereon claim 1 , at a temperature equal to or lower than the softening point of the plastic outer part for 5 minutes to 200 minutes.3. The metal coating method of claim 1 , wherein claim 1 , due to the increasing of adhesive strength claim 1 , the adhesive strength between the metal coating layer and the plastic outer part is ...

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Номер записи: 100