Coatings Having Enhanced Corrosion Performance and Method of Using the Same

A method of plating a part comprised of aluminum, alloys of aluminum, magnesium or alloys of magnesium to improve the corrosion resistance of the part. The method comprises the steps of plating the part with a plating bath comprising: (i) particles selected from the group consisting of polytetrafluoroethylene (PTFE), colloidal silica, colloidal graphite, ceramics, carbon nanotubes, silicon carbide, nano-diamond, diamond and combinations of one or more of the foregoing, which have been treated with a corrosion inhibitor and are dispersed in said plating bath; and (ii) metal ions to be plated. The dispersed particles co-deposit with the plated metal. 1. A method of plating a part selected from the group consisting of aluminum , alloys of aluminum , magnesium , alloys of magnesium and connectors in contact with any of the foregoing , to improve the corrosion resistance of said part , the method comprising the steps of: i) particles selected from the group consisting of polytetrafluoroethylene (PTFE), colloidal silica, colloidal graphite, ceramics, carbon nanotubes, boron nitride, silicon carbide, nano-diamond, diamond and combinations of one or more of the foregoing, which have been treated with a corrosion inhibitor, such that the corrosion inhibitor is adsorbed on the surface of said particles, and said particles are dispersed in said plating bath; and', 'ii) metal ions to be plated;, 'plating the part with a plating bath comprisingwherein the dispersed particles co-deposit with the plated metal.2. The method according to claim 1 , wherein the corrosion inhibitor is a cationic surfactant and the particles are treated with the cationic surfactant so that the cationic surfactant is adsorbed on the particles.3. The method according to claim 1 , wherein the particles comprise PTFE.4. The method according to claim 2 , wherein the cationic surfactant comprises an organic anion selected from carboxylate claim 2 , phosphonate and sulfonate anions.5. The method according to ...

Composite Electroless Nickel Plating

A method of producing a composite electroless nickel layer on a substrate is described. The method includes the steps of contacting the substrate with a composite electroless nickel plating bath and generating an electrostatic field in the electroless nickel plating bath. The electric field is generated by placing an anode in the electroless nickel plating bath and connecting the anode to a positive terminal of a DC rectifier, and connecting the substrate to a negative terminal of the DC rectifier, and preferably inserting a capacitor into the circuit to prevent passage of current. An attractive force generated by the electrostatic field increases the attraction of the positively charged PTFE particles to the negatively charged substrate and drives the positively charged PTFE particles to the negatively charged substrate.

Electroless Nickel Plating Solution and Method

An electroless nickel plating solution and a method of using the same is described. The electroless nickel plating solution comprises (i) a source of nickel ions; (ii) a reducing agent; (iii) one or more complexing agents; (iv) one or more bath stabilizers; (v) a brightener, said brightener comprising a sulfonated compound having sulfonic acid or sulfonate groups; and (vi) optionally, one or more additional additives. The use of the sulfonated compound brightener results in a bright electroless nickel deposit on various substrates having a high gloss value.

High Phosphorus Electroless Nickel

An electroless nickel plating bath comprising: i) a source of nickel ions; ii) an effective amount of thiourea; iii) an effective amount of saccharin; iv) a source of hypophosphite ions; v) one or more chelating agents; and vi) optionally, other additives and a method of using the same to provide a high phosphorus electroless nickel plating deposit on a substrate. The high phosphorus electroless nickel deposit is capable of passing an RCA nitric acid test, whereby the substrate with the high phosphorus nickel deposit thereon is immersed into concentrated nickel acid for 30 seconds and a deposit that does not turn black or grey is deemed to have passed the RCA nitric acid test. 1. A method of providing a high phosphorus electroless nickel plating deposit on a substrate , the method comprising the steps of:a) preparing the substrate to accept electroless nickel thereon; i) a source of nickel ions;', 'ii) an effective amount of thiourea;', 'iii) an effective amount of saccharin;', 'iv) a source of hypophosphite ions;', 'v) one or more chelating agents; and', 'vi) optionally, other additives;, 'b) immersing the substrate into an electroless nickel plating bath, the electroless nickel plating bath comprisingwherein the high phosphorus electroless nickel deposit is capable of passing an RCA nitric acid test in which the substrate with the high phosphorus nickel deposit thereon is immersed into concentrated nickel acid for 30 seconds and a deposit that does not turn black or grey is deemed to have passed the RCA nitric acid test.2. The method according to claim 1 , wherein the source of nickel ions is selected from the group consisting of nickel bromide claim 1 , nickel fluoroborate claim 1 , nickel sulfonate claim 1 , nickel sulfamate claim 1 , nickel alkyl sulfonate claim 1 , nickel sulfate claim 1 , nickel chloride claim 1 , nickel acetate claim 1 , nickel hypophosphite and combinations of one or more of the foregoing.3. The method according to claim 2 , wherein the ...

Aqueous Electroless Nickel Plating Bath and Method of Using the Same

An electroless nickel plating solution and a method of using the same to produce a nickel deposit having a phosphorus content that remains at about 12% throughout the lifetime of the electroless nickel plating solution is disclosed. The electroless nickel plating solution comprises (a) a source of nickel ions; (b) a reducing agent comprising a hypophosphite; and (c) a chelation system comprising: (i) one or more dicarboxylic acids; and (ii) one or more alpha hydroxy carboxylic acids. The electroless nickel plating solution may also comprise stabilizers and brighteners. 1. An electroless nickel plating solution comprising:a) a source of nickel ions;b) a reducing agent comprising a hypophosphite; and i) one or more dicarboxylic acids; and', 'ii) one or more alpha hydroxy carboxylic acids;, 'c) a chelation system comprisingwherein the electroless nickel plating solution produces a nickel deposit having a phosphorus content that remains at about 12% throughout the lifetime of the electroless nickel plating solution.2. The electroless nickel plating solution according to claim 1 , wherein the one or more dicarboxylic acids are selected from the group consisting of oxalic acid claim 1 , malonic acid claim 1 , succinic acid claim 1 , glutaric acid claim 1 , adipic acid and pimelic acid and the one or more alpha hydroxy carboxylic acids are selected from the group consisting of glycolic acid claim 1 , lactic acid claim 1 , malic acid claim 1 , citric acid and tartaric acid.3. The electroless nickel plating solution according to claim 2 , wherein the plating solution comprises:a) about 30 to about 40 g/L of hypophosphite;b) about 30 to about 40 g/L of lactic acid;c) about 3 to about 6 g/L of succinic acid; andd) about 25 to about 35 g/L of malonic acid.4. The electroless nickel plating solution according to claim 3 , wherein the plating solution comprises:a) about 33 to about 36 g/L of hyphophosphite;b) about 33 to about 36 g/L of lactic acid;c) about 4 to about 5 g/L of ...

Aqueous electroless nickel plating bath and method of using the same

An electroless nickel plating solution and a method of using the same to produce a nickel deposit having a phosphorus content that remains at about 12% throughout the lifetime of the electroless nickel plating solution is disclosed. The electroless nickel plating solution comprises (a) a source of nickel ions; (b) a reducing agent comprising a hypophosphite; and (c) a chelation system comprising: (i) one or more dicarboxylic acids; and (ii) one or more alpha hydroxy carboxylic acids. The electroless nickel plating solution may also comprise stabilizers and brighteners.

Composite electroless nickel plating

Aqueous electroless nickel plating bath and method of using the same

An electroless nickel plating solution and a method of using the same to produce a nickel deposit having a phosphorus content that remains at about 12% throughout the lifetime of the electroless nickel plating solution is disclosed. The electroless nickel plating solution comprises (a) a source of nickel ions; (b) a reducing agent comprising a hypophosphite; and (c) a chelation system comprising: (i) one or more dicarboxylic acids; and (ii) one or more alpha hydroxy carboxylic acids. The electroless nickel plating solution may also comprise stabilizers and brighteners.

Method of electrolytically dissolving nickel into electroless nickel plating solutions

Method of Electrolytically Dissolving Nickel into Electroless Nickel Plating Solutions

A method of extending the lifetime of an electroless nickel plating bath by avoiding the addition of unwanted anions to the process and of improving the pH stability of the bath and minimizing additions of pH correcting additives. The method includes the steps of (a) depositing electroless nickel from an electroless nickel plating bath onto a substrate, wherein the electroless nickel plating bath preferably contains a source of nickel ions and a source of hypophosphite ions; (2) immersing a nickel anode in the plating bath; (3) completing the circuit by utilizing a cathode separated from the nickel bath by an ion exchange membrane and using a catholyte comprising an acid or a salt thereof; and (4) passing a current through the bath. Nickel is dissolved into the plating bath to maintain the nickel concentration and hydrogen is discharged from the cathode.

Method of electrolytically dissolving nickel into electroless nickel plating solutions

A method of extending the lifetime of an electroless nickel plating bath by avoiding the addition of unwanted anions to the process and of improving the pH stability of the bath and minimizing additions of pH correcting additives. The method includes the steps of (a) depositing electroless nickel from an electroless nickel plating bath onto a substrate, wherein the electroless nickel plating bath preferably contains a source of nickel ions and a source of hypophosphite ions; (2) immersing a nickel anode in the plating bath; (3) completing the circuit by utilizing a cathode separated from the nickel bath by an ion exchange membrane and using a catholyte comprising an acid or a salt thereof; and (4) passing a current through the bath. Nickel is dissolved into the plating bath to maintain the nickel concentration and hydrogen is discharged from the cathode.

Sposób elektrolitycznego rozpuszczania niklu do roztworów do bezprądowego powlekania niklem

Method of electrolytically dissolving nickel into electroless nickel plating solutions

A method of extending the lifetime of an electroless nickel plating bath by avoiding the addition of unwanted anions to the process and of improving the pH stability of the bath and minimizing additions of pH correcting additives. The method includes the steps of (a) depositing electroless nickel from an electroless nickel plating bath onto a substrate, wherein the electroless nickel plating bath preferably contains a source of nickel ions and a source of hypophosphite ions; (2) immersing a nickel anode in the plating bath; (3) completing the circuit by utilizing a cathode separated from the nickel bath by an ion exchange membrane and using a catholyte comprising an acid or a salt thereof; and (4) passing a current through the bath. Nickel is dissolved into the plating bath to maintain the nickel concentration and hydrogen is discharged from the cathode.

Method of electrolytically dissolving nickel into electroless nickel plating solutions

Electroless nickel plating solution and method

An electroless nickel plating solution and a method of using the same is described. The electroless nickel plating solution comprises (i) a source of nickel ions; (ii) a reducing agent; (iii) one or more complexing agents; (iv) one or more bath stabilizers; (v) a brightener, said brightener comprising a sulfonated compound having sulfonic acid or sulfonate groups; and (vi) optionally, one or more additional additives. The use of the sulfonated compound brightener results in a bright electroless nickel deposit on various substrates having a high gloss value.

Electroless nickel plating solution and method

An electroless nickel plating solution and a method of using the same is described. The electroless nickel plating solution comprises (i) a source of nickel ions; (ii) a reducing agent; (iii) one or more complexing agents; (iv) one or more bath stabilizers; (v) a brightener, said brightener comprising a sulfonated compound having sulfonic acid or sulfonate groups; and (vi) optionally, one or more additional additives. The use of the sulfonated compound brightener results in a bright electroless nickel deposit on various substrates having a high gloss value.

High phosphorus electroless nickel

An electroless nickel plating bath comprising: i) a source of nickel ions; ii) an effective amount of thiourea; iii) an effective amount of saccharin; iv) a source of hypophosphite ions; v) one or more chelating agents; and vi) optionally, other additives and a method of using the same to provide a high phosphorus electroless nickel plating deposit on a substrate. The high phosphorus electroless nickel deposit is capable of passing an RCA nitric acid test, whereby the substrate with the high phosphorus nickel deposit thereon is immersed into concentrated nickel acid for 30 seconds and a deposit that does not turn black or grey is deemed to have passed the RCA nitric acid test.

High phosphorus electroless nickel

An electroless nickel plating bath comprising: i) a source of nickel ions; ii) an effective amount of thiourea; iii) an effective amount of saccharin; iv) a source of hypophosphite ions; v) one or more chelating agents; and vi) optionally, other additives and a method of using the same to provide a high phosphorus electroless nickel plating deposit on a substrate. The high phosphorus electroless nickel deposit is capable of passing an RCA nitric acid test, whereby the substrate with the high phosphorus nickel deposit thereon is immersed into concentrated nickel acid for 30 seconds and a deposit that does not turn black or grey is deemed to have passed the RCA nitric acid test.