СПОСОБ И УСТАНОВКА ДЛЯ ГАЛЬВАНИЧЕСКОГО ОСАЖДЕНИЯ НИКЕЛЯ, КОБАЛЬТА, СПЛАВОВ НИКЕЛЯ ИЛИ СПЛАВОВ КОБАЛЬТА С ИСПОЛЬЗОВАНИЕМ ПЕРИОДИЧЕСКИХ ИМПУЛЬСОВ ТОКА

Группа изобретений относится к гальваническому осаждению никеля, кобальта, сплавов никеля или сплавов кобальта. Способ осуществляют в гальванической ванне с использованием содержащего соединения никеля или соединения кобальта электролита, при этом для осаждения на находящиеся в ванне по меньшей мере на один анод и по меньшей мере один катод периодически подают импульсы тока. Отношение (IA/IC) анодной плотности тока IA к катодной плотности тока Ic задают больше 1 и меньше 1,5, а отношение QA/Qc=(TA· IA)/(Tc·Ic) заряда QA, переносимого анодным импульсом тока за время ТA, к заряду Qc, переносимому катодным импульсом тока за время ТC, составляет от 30 до 45. Ванна для осуществления этого способа имеет, в частности, профильные аноды, экраны для улучшения распределения тока, очистное устройство для очистки электролита и систему циркуляции с обратной подачей электролита через сопла. Техническим результатом является получение покрытий, которые допускают их неразъемное соединение с другими деталями ...

СПОСОБ ИЗГОТОВЛЕНИЯ ЛИСТОВОЙ СТАЛИ С ПОКРЫТИЕМ

Группа изобретений относится к листовой стали с покрытием, способу изготовления листовой стали с покрытием и сварному соединению. Предложена листовая сталь с покрытием, содержащим от 10 до 40 мас. % никеля и остальное представляет собой цинк. Причем листовая сталь обладает микроструктурой, содержащей от 1 до 50 % остаточного аустенита, от 1 до 60 % мартенсита и необязательно по меньшей мере одну микроструктуру, выбранную из бейнита, феррита, цементита и перлита. Способ изготовления листовой стали с покрытием включает следующие далее стадии: А) получение отожженной листовой стали, характеризующейся определенным химическим составом, при котором листовую сталь подвергают отжигу при температуре в диапазоне между 600 и 1200°С, и В) нанесение на листовую сталь, полученную на стадии А), покрытия, содержащего от 1 до 40 мас. % никеля и остальное представляет собой цинк. Изобретение обеспечивает получение листовой стали с покрытием, которой не свойственны проблемы, связанные с жидкометаллическим ...

СПОСОБ И УСТРОЙСТВО ДЛЯ ПРОИЗВОДСТВА ОПТИЧЕСКОГО ВОЛОКНА С МЕТАЛЛИЧЕСКИМ ПОКРЫТИЕМ И ПОЛУЧЕННОЕ ОПТИЧЕСКОЕ ВОЛОКНО

Группа изобретений относится к способам получения оптического волокна с металлическим покрытием. Техническим результатом является сохранение пластичности оптического волокна после термической обработки. Способ получения оптического волокна с металлическим покрытием включает подачу отрезка стекловолокна через ванну с первым раствором для нанесения на него металла посредством осаждения методом химического восстановления. После этого пропускают отрезок стекловолокна непрерывно из ванны с первым раствором в ванну со вторым раствором для нанесения на него второго металла посредством электролитического покрытия. Оптическое волокно контактирует с электродом после нанесения части второго металла. При этом в способе дополнительно каждая из ванн с первым и вторым растворами содержит емкость с впускным отверстием и выпускным отверстием, через которые проходит отрезок стекловолокна в указанную емкость и из нее. При этом соответствующий раствор вытекает из указанных впускного и выпускного отверстий.

РАСТВОР ДЛЯ ФОРМИРОВАНИЯ МЕТАЛЛИЧЕСКОЙ ПЛЕНКИ И СПОСОБ ФОРМИРОВАНИЯ МЕТАЛЛИЧЕСКОЙ ПЛЕНКИ

Предложен раствор для формирования металлической пленки для подачи ионов металлов на мембрану из твердого электролита при формировании пленки. При этом при формировании пленки мембрана из твердого электролита расположена между анодом и подложкой в качестве катода, и мембрана из твердого электролита приведена в контакт с подложкой, и между анодом и подложкой подают напряжение для осаждения металла на поверхности подложки из металлических ионов, содержащихся в мембране из твердого электролита, при этом на поверхности подложки формируется металлическая пленка из металла. Раствор для формирования металлической пленки содержит растворитель и металл, растворенный в растворителе до ионного состояния. Концентрация ионов водорода пленкообразующего металла находится в пределах диапазона от 0 до 10моль/л при 25°C. Растворитель представляет собой спиртовой растворитель, содержащий, по меньшей мере, один компонент, выбранный из метанола, этанола и пропанола, либо растворитель, содержащий этот спиртовой ...

СПОСОБ ЭЛЕКТРОХИМИЧЕСКОГО НАНЕСЕНИЯ НИКЕЛЕВОГО ПОКРЫТИЯ

Изобретение относится к области гальваностегии и может быть использовано при изготовлении стальных деталей, которые эксплуатируются в агрессивных средах. Способ включает электрохимическое осаждение никеля на предварительно подготовленную стальную пластину из электролита, содержащего кристаллогидрат сульфата никеля (II), кристаллогидрат хлорида никеля (II), борную кислоту и воду, при этом перед электрохимическим осаждением никеля проводят выдержку предварительно подготовленной стальной пластины в электролите при температуре 20-25 °С и потенциале -0,45 В относительно хлоридсеребряного электрода сравнения, при этом в качестве электролита используют электролит, содержащий: 140 г/л кристаллогидрата сульфата никеля (II), 70 г/л кристаллогидрата хлорида никеля (II), 25 г/л борной кислоты и воду до 1 л, а электрохимическое осаждение никеля из упомянутого электролита проводят при температуре 20-25 °С, катодной плотности тока 3,5-5,5 А/дми рН 5,5. Технический результат: повышение экологической чистоты ...

СПОСОБ ВОССТАНОВЛЕНИЯ ФОРМЫ ПОДВИЖНОЙ ЛОПАТКИ ГАЗОТУРБИННОГО ДВИГАТЕЛЯ, ЛОПАТКА ГАЗОТУРБИННОГО ДВИГАТЕЛЯ И ГАЗОТУРБИННЫЙ ДВИГАТЕЛЬ, СОДЕРЖАЩИЙ ТАКУЮ ЛОПАТКУ

... 1. Способ восстановления формы изношенной поверхности участка (14) поверхности подвижной лопатки (10) газотурбинного двигателя, изготовленной из титана или из титанового сплава, отличающийся тем, что наносят на упомянутый участок поверхности никель, кобальт или комбинацию двух этих металлов при помощи электролиза. ! 2. Способ по п.1, в соответствии с которым нанесение металла осуществляется при помощи электролиза с использованием тампона. ! 3. Способ по п.1, в соответствии с которым нанесение металла осуществляется при помощи электролиза в ванне. ! 4. Способ по п.1, в соответствии с которым нанесение металла осуществляется при помощи электролиза в микрованне. ! 5. Способ по п.1, в соответствии с которым нанесение металла осуществляется по меньшей мере в два этапа, сочетающих электролиз с использованием тампона и электролиз в ванне или в микрованне. ! 6. Способ по п.5, примененный к лопатке (10) вентилятора. ! 7. Способ по п.6, в соответствии с которым электролитический раствор содержит ...

СПОСОБ И УСТРОЙСТВО ДЛЯ ИЗГОТОВЛЕНИЯ ТВЕРДЫХ ПОКРЫТИЙ С НИЗКОЙ СТЕПЕНЬЮ ИЗНОСА

... 1. Способ изготовления твердого покрытия с низкой степенью износа на металлической поверхности, содержащего никель и бор, причем покрываемую металлическую поверхность при включении напряжения осаждения вводят в контакт с содержащим никель электролитом, который в виде дисперсной ванны содержит частицы бора или частицы соединений бора, причем содержащиеся в электролите частицы бора или частицы соединений бора во время процесса нанесения покрытия удерживаются в дисперсном состоянии с помощью протекающего через электролит газа и предотвращают осаждение частиц, причем способ осуществляется в резервуаре, в котором газ протекает от дна резервуара через электролит до поверхности электролита, в котором дно резервуара, по меньшей мере, частично выполнено герметичным для жидкости, но пропускает газ, и газ при этом поступает в электролит через часть дна резервуара, которая герметична для жидкости, но пропускает газ.2. Способ по п.1, отличающийся тем, что протекающий через электролит газ проходит по ...

НЕАМФОЛИТНЫЕ, КВАТЕРНИРУЕМЫЕ И ВОДОРАСТВОРИМЫЕ ПОЛИМЕРЫ ДЛЯ МОДИФИЦИРОВАНИЯ ПОВЕРХНОСТНОГО ЗАРЯДА ТВЕРДЫХ ЧАСТИЦ

СПОСОБ И УСТРОЙСТВО ДЛЯ ПРОИЗВОДСТВА ОПТИЧЕСКОГО ВОЛОКНА С МЕТАЛЛИЧЕСКИМ ПОКРЫТИЕМ И ПОЛУЧЕННОЕ ОПТИЧЕСКОЕ ВОЛОКНО

МЕТАЛЛИЧЕСКИЕ МАТЕРИАЛЫ С ВНЕДРЕННЫМИ ЛЮМИНЕСЦЕНТНЫМИ ЧАСТИЦАМИ

... 1. Способ осаждения металлического слоя, содержащего внедренные люминесцентные частицы, на металлическую положку, включающий:- смешивание люминесцентных частиц с металлическим материалом для получения раствора для нанесения покрытия;- помещение металлической подложки в раствор для нанесения покрытия; и- осуществление процесса нанесения покрытия для покрытия металлической подложки металлическим слоем, при этом металлический слой содержит внедренные люминесцентные частицы.2. Способ по п.1, отличающийся тем, что процесс нанесения покрытия является процессом нанесения покрытия способом химического восстановления.3. Способ по п.1, отличающийся тем, что процесс нанесения покрытия является процессом нанесения покрытия погружением.4. Способ по п.1, отличающийся тем, что процесс нанесения покрытия является процессом электроосаждения.5. Способ по п.4, отличающийся тем, что процесс электроосаждения включает вращающийся барабан, в котором находится металлическая подложка при помещении в раствор для ...

ХРОМИРОВАННАЯ ДЕТАЛЬ И СПОСОБ ЕЕ ИЗГОТОВЛЕНИЯ

... 1. Хромированная деталь, содержащая:подложку;слой блестящего никелевого покрытия, сформированный поверх подложки;слой никелевого покрытия с благородным потенциалом, сформированный на слое блестящего никелевого покрытия, причем разность электрических потенциалов между слоем блестящего никелевого покрытия и слоем никелевого покрытия с благородным потенциалом находится в пределах диапазона от 40 мВ до 150 мВ; ислой трехвалентного хромового покрытия, сформированный на слое никелевого покрытия с благородным потенциалом и имеющий по меньшей мере одну из структуры с микропорами и структуры с микротрещинами.2. Хромированная деталь по п.1, при этом разность электрических потенциалов между слоем блестящего никелевого покрытия и слоем никелевого покрытия с благородным потенциалом находится в пределах диапазона от 60 мВ до 120 мВ.3. Хромированная деталь по п.1, при этом слой трехвалентного хромового покрытия имеет 10000/смили более мелких пор.4. Хромированная деталь по п.1, при этом слой трехвалентного ...

СПОСОБ ПОЛУЧЕНИЯ КОМПОЗИТНОГО МАТЕРИАЛА НА ОСНОВЕ НАНОТРУБОК ДИОКСИДА ТИТАНА И СФЕРИЧЕСКИХ НАНОЧАСТИЦ НИКЕЛЯ

Изобретение относится к химической промышленности и нанотехнологии и может быть использовано при изготовлении бета-вольтаических и фотокаталитических элементов, магнитных устройств, а также катализаторов для синтеза химических соединений. Сначала синтезируют матрицу нанотубулярного диоксида титана в электрохимической ячейке, содержащей электроды и электролит, состоящий из этиленгликоля, фторида аммония и воды. Анодом является титановая пластина, закреплённая на термостатирующем элементе, а катодом - стальная пластина. Затем проводят первичное анодирование, поддерживая на электродах постоянное напряжение 20-200 В. Оксидный слой, полученный в результате первичного анодирования, удаляют. Затем проводят вторичное анодирование при тех же условиях. Полученный оксидный слой отжигают при 400-450°С. На синтезированную матрицу, диаметр нанотрубок которой составляет от 40 до 140 нм, осаждают сферические наночастицы никеля в электрохимической ячейке, содержащей электроды и электролит, представляющий ...

Verfahren zum Elektroplattieren von Nickel mit reduziertem Aufbau von Nickelionen

Elektrischer Einpress-Kontaktstift

Beschrieben wird ein elektrischer Kontaktstift (6), der zum Einpressen in ein Loch (2) bestimmt ist, welches in einer Schaltungsträgerplatte (1) vorgesehen ist und eine Umfangswand mit einer metallisierten Oberfläche hat, wobei der Kontaktstift (6) hauptsächlich aus Kupfer oder aus einer Kupferlegierung besteht und wenigstens in einem in das Loch (2) einzupressenden Teilbereich von einer Zinn enthaltenden Schicht (10) umgeben ist. Erfindungsgemäß ist vorgesehen, dass die das Zinn enthaltende Schicht (10) die Oberfläche des Kontaktstifts (6) bildet und im Wesentlichen nur Zinn und Zinnoxid enthält, wobei das Zinnoxid durch elektrolytische Oxidation gebildet ist und seine Konzentration am größten an der Oberfläche der Schicht ist.

NANOKRISTALLINE METALLE

VERFAHREN ZUR HERSTELLUNG EINES ELEKTROLYTISCH BESCHICHTETEN KALTBANDES UND DARAUS GEFERTIGTE BATTERIEHÜLSE

Verfahren zur Erzeugung festhaftender und glaenzender galvanischer Metallueberzuege

Verfahren zum galvanischen Niederschlagen von Nickel

KORROSIONSBESTAENDIGE METALLUEBERZUEGE, DIE GALVANISCH ABGESCHIEDENES NICKEL UND MIKROPOROESES CHROM ENTHALTEN

Material und Beschichtung für Verbindungssammelschiene

In einer Ausführungsform weist ein elektrochemisches System eine Verbindungssammelschiene auf, die ein Substrat und eine Beschichtung aufweist, die das Substrat kontaktiert, wobei die Beschichtung eine Schicht aus galvanisiertem elementarem Nickel aufweist.

Korrosionsbestaendige,dekorativ wirkende Chromueberzuege

Galvanische Abscheidung von Nickel

Microstructures and a method for forming the same

Method comprising, i) providing a master 10 having a pattern of conductive material 12 embedded in a non-conductive substrate 14 to provide a surface 22 having conductive and non-conductive portions. ii) Applying a surface treatment to alter the adhesion properties of at least one of the conducting or non-conducting portions. iii) Forming a microstructure by deposition or plating of a functionalising material on to the surface. iv) Separating the microstructure from the master A first layer of conductive material may be deposited/plated before surface treatment. A second layer of material may be applied after surface treatment and first and second layers then removed prior to microstructure formation. Surface treatment may involve passivating the surface using an oxidising agent or using a solution to reduce surface energy. A stencil may be applied to the master prior to microstructure formation. The functionalising material may be one of a large number of metals including copper and zinc ...

Improvements in electrolytic deposition of nickel

... 682,173. Electrodeposition of nickel. BOZEL-MALETRA. May 16, 1949 [Oct. 19, 1948], No. 13041/49. Class 41. A method of obtaining thick ductile and very hard nickel deposits on a metal piece which is to be re-metalled or to be hardened superficially, in which the piece is used as cathode in a bath containing nickel sulphate, nickel chloride, boric acid, and an anti-pitting agent, and containing also at least one of the following ductilizing agents in a concentration of from one half gram to five grams per litre: a sulphonated or polysulphonated derivation of naphthalene or of aminotoluene, benzene sulphonamide, toluene or betanaphthalene sulphonamide or saccharin, the temperature of the bath being maintained higher than 35 ‹ C. and the pH value being lower than 5, is characterized in that the current density on the cathode is from 6 to 8 amperes per sq. dm. The polysulphonated naphthalene derivatives may have two or three sulphonated radicals. Either alpha or beta naphthalene monosulphonate ...

COMPOSITE NICKEL ELECTROPLATE

... 1321859 Electro-deposition of sulphurcontaining nickel layers UDYLITE CORP 28 Sept 1970 [1 Oct 1969] 46088/70 Heading C7B [Also in Division C2] A nickel-containing layer (>50% Ni by wt) having a sulphur-content of 0À02 - 0À3% is electrodeposited from a bath containing a substituted thioalkyl sulphonate containing a nitrile or amide group, e.g. dicyanobutane mercapto propane sulphonate, or nitrilo propane mercapto propane sulphonate. A three-layer nickel-composite electro-plate may be deposited on a corrosion susceptible base metal comprising a lower nickelcontaining layer (each layer containg < 50% by wt Ni) of thickness 0À15 - 1À5 mils and an average sulphur content of less than 0À03%; an intermediate layer of thickness 0À005 - 0À2 mils and an average sulphur content of 0À05 - 0À3%, and an upper layer of thickness 0À2 - 1À5 mils and an average sulphur content of 0À02 - 0À15%; the upper layer containing a lower percentage of sulphur than the intermediate layer and a higher percentage than ...

Nickel plating using electrolytically refined nickel as the anode

... A perforated or wire mesh basket to contain pieces of electrolytic nickel as plating anode, is wholly or partly made of titanium or similar metal which is not corroded by an electrolyte of pH 4.5 or less, and which polarizes under plating conditions. Alternative metals specified are, zirconium, niobium, hafnium, tantalum, and tungsten. Vertical and horizontal frame members 21, 22, 25 are of titanium, hook members 8 are of titanium or nickel, and the perforated walls 24 may be of titanium or inert plastic. The container may be provided with an outer bag to collect falling fragments. The device may also be used in barrel plating.

Bath and process for high speed nickel electroplating

An electroplating bath for producing a semi-bright, ductile, low- stressed nickel deposit, for use with insoluble anodes, comprises a nickel salt such as nickel sulphate, carbonate or citrate, an electrolyte such as boric or citric acid or salt thereof, and as organic brightener and wetting agent, o-formyl benzene sulphonic acid or salt thereof, and potassium perfluoroalkyl sulfonate.

Improvements in electrodeposition of nickel

Nickel plating baths are improved by adding as brightening agent compounds containing the groups -Br-C=C-Br, or -Br2-C-C-Br2-, especially alcohols, poly-alcohols, or ether alcohols. Examples include, 2:3 dibromo-2-butene, 1, 4 diol, 2:3 dibromo-1-hydroxyethoxy-2-propene, and the product obtained by reacting butyne 1, 4-diol with ethylene oxide and bromine, which compounds have the formula:- in which R1, R2 are hydrogen or methyl, and R3 R4 are hydrogen, methyl or chloromethyl. The central double bond -CBr=C-Br may be replaced by - CBr2-CBr2-. Preferably there is also present a sulphonated compound e.g. vinyl sulphuric acid, sodium alkyl sulphonate, p-chlorbenzene sulphuric acid, nickel benzene sulphonate, sodium phenyl ethylene sulphonate, aromatic sulphinic acids-amides, or-imides, poly nuclear sulphonates or thiophene sulphoric acid or its salts with Na, Mg, and Ni. A table of tests is given showing results with and without the additions to a nickel plating bath ...

Process for the electrodeposition of metal coatings

... 762,257. Sulphonic acids. DEHYDAG DEUTSCHE HYDRIERWERKE GES. Sept. 17, 1954 [Sept. 19, 1953], No. 26947/54. Class 2 (3). [Also in Group XXXVI] Sulphonic acids and salts thereof of the general formula G-R-SO 3 H, where G comprises a carbon atom linked via a sulphur atom to the residue R-SO 3 H and linked also to two other atoms of the elements oxygen, sulphur and nitrogen, and where R denotes a substituted or unsubstituted bivalent aliphatic group, are prepared by converting the corresponding mercapto compounds or enolizable thiocarbonyl compounds with cyclic anhydrides of oxyalkansulphonic acids. Typical examples in which G is cyclic as well as acyclic are mentioned. Specification 721,204, [Group XXXVI], is referred to.

Electrodeposition of bright nickel

... 785,931. Electrodeposition of bright nickel. HARSHAW CHEMICAL CO. Jan. 15, 1954 [July 17, 1953], No. 1206/54. Class 41. A cathodic deposit of bright nickel is produced using a nickel anode and an aqueous acid solution of nickel chloride, nickel sulphate, or mixtures of nickel chloride and sulphate containing (1) at least one of amino polyaryl amines, amino polyaryl methanes, or a compound of the formula S-CH 2 -CH 2 -O-CH 2 -CH 2 -S1, where S and S1 are pyridinium or isoquinolinium radicals connected to the chain through the nitrogen atoms; (2) a naphthalene sulphonic acid or its salts; and (3) either a compound ROR1, where R, R1 are radicals of the formula C 6 H 4 SO 2 NHSO 2 R11, R11 being phenyl, halogen substituted phenyl, tolyl or lower (1 to 4 C) alkyl, or the compound (C 6 H 5 SO 2 NHSO 2 C 6 H 4 ) 2 . Typically, the naphthalene sulphonic compounds are 1.5- and 2.7-naphthalene disulphonic acids, the nickel salt mixture is produced ...

Improvements in corrosion-resisting decorative chromium electrolytic deposits

Decorative chromium deposits corrosion resistant.

SURFACE TREATMENTS FOR SPIRAL AND TAPERED GEAR UNITS

BESCHICHTUNG, INSBESONDERE FÜR DIE ZÜNDBRÜCKE EINES ZÜNDERS

Method for electrochemically machining a metallic component

Die Erfindung betrifft ein Verfahren zur elektrochemischen Bearbeitung eines metallischen Bauteils (48), mit den Schritten: Beschichten des Bauteils (48) mit einer chemischen Nickelbeschichtung (50), Einbringen von Strukturen (52) in die nickelbeschichtete Oberfläche des Bauteils mittels elektrochemischer Abtragung, und Härten der chemischen Nickelbeschichtung (50) durch Wärmebehandlung (54).

PROCEDURE FOR THE PRODUCTION OF ACTIVE CATHODES FOR THE ELECTROLYTIC WATER DECOMPOSITION OR FOR THE ALKALI CHLORIDE ELECTROLYSIS

ELECTROLYTE AND PROCEDURE FOR THE SEPARATION MATS OF A LAYER OF METAL

Verfahren zum Nickelbeschichten von Teilen einer Oberfläche eines Bauteils

Die Erfindung betrifft ein Verfahren zum Nickelbeschichten von Teilen einer Oberfläche eines Bauteils (12, 16, 18,112,113, 114, 130), mit den Schritten: Beschichten der gesamten Oberfläche des Bauteils (12, 16, 18, 112, 113, 114 130) mit einer Nickelbeschichtung einer definierten Schichtdicke, Abtragen von Bereichen (50, 16a, 18a, 112b 113a, 114c, 150) der Nickelbeschichtung mittels eines elektrochemischen Abtragungsverfahrens mit Hilfe einer Werkzeugelektrode (100), wobei die Werkzeugelektrode (100) elektrisch leitende Bereiche (102) und elektrisch nicht leitende Bereiche (104) aufweist, wobei die elektrisch leitenden Bereiche in ihrer Geometrie der Geometrie der abzutragenden Bereiche (50, 16a, 18a, 112b 113a, 114c, 150) der Nickelbeschichtung entsprechen.

PROCEDURE FOR THE GALVANIC SEPARATION OF GLARE-FREE NICKEL PRECIPITATION

NICKEL PLATING OF A FORMING TOOL OF MEANS A PULSATING RIVER

INCREASING ABSORPTANCE OF POROUS FILM ON CR CONTAINING IRON ALLOY

Metal material for electronic components and method for producing same

Provided are: a metal material for electronic components, which has low insertion/removal resistance, low occurrence of whiskers and high durability; and a method for producing the metal material for electronic components. A metal material (10) for electronic components, which is provided with: a base (11); a layer A (14) that constitutes the outermost layer of the base (11) and is formed of Sn, In or an alloy of these elements; and a layer B (13) that is arranged between the base (11) and the layer A (14) so as to constitute an intermediate layer and is formed of Ag, Au, Pt, Pd, Ru, Rh, Os, Ir or an alloy of these elements. The outermost layer (the layer A (14)) has a thickness of 0.002-0.2 m, and the intermediate layer (the layer B (13)) has a thickness of 0.001-0.3 m.

BATH FOR THE ELECTRODEPOSITION OF NICKEL

Acid plating bath and method for the electolytic deposition of satin nickel deposits

NICKEL PLATING

SATIN-FINISHED NICKEL OR NICKEL ALLOY COATING

In order to achieve an even satin-finished nickel or nickel alloy coating an acid nickel or nickel alloy electroplating bath is proposed which contains a sulfosuccinic acid compound of the general formula (I) additional to at least one quaternary ammonium compound, wherein R1, R2 = hydrogen ion, alkali ion, alkaline earth ion, ammonium ion and/or C1-C18 hydrocarbon moiety, wherein R1 and R2 are identical or different with the proviso that at the most one of the groups R1 and R2 = hydrogen ion, alkali ion, and alkaline earth ion, and wherein K+ = hydrogen ion, alkaline ion, alkaline earth ion, ammonium ion.

PRODUCTS AND COMPOSITIONS OF LAYERED MATERIAL SYSTEMS FOR FLUXLESS BRAZING OF ALUMINUM OR DISSIMILAR METALS

A brazing product for fluxless brazing comprises an aluminum or aluminum alloy substrate; a layer of an aluminum eutectic-forming layer applied to the substrate, and a braze-promoting layer comprising one or more metals from the group comprising nickel, cobalt and iron is applied on the eutectic-forming layer. The eutectic-forming layer is preferably Si deposited by physical vapor deposition. The brazing product may be brazed to another aluminum shape or to a shape comprised of a dissimilar metal.

MICROCRACKED NICKEL PLATING BATH

PROCESS AND COMPOSITION FOR DEPOSITION OF COBALT-CONTAINING ELECTROPLATE

LIFT PLUNGERS WITH ELECTRODEPOSITED COATINGS, AND SYSTEMS AND METHODS FOR PRODUCING THE SAME

Described herein are coated lift plungers, which have improved hardness, durability, and corrosion resistance, as well as methods of making, reworking, and using the same.

ELECTROLYTIC PROCESS FOR COATING METAL SURFACES TO PROVIDE HIGH RESISTANCE TO CORROSION AND ABRASION

Process for coating a metal article, comprising: preparing an electrolytic bath that comprises a suspension of boron carbide particles, having an average size from 0.01 µm a 2 µm, in an aqueous solution comprising at least one nickel (II) salt and at least one phosphorous compound selected from: phosphoric acid, phosphorous acid, hypophosphorous acid or their salts; immersing in the electrolytic bath a cathode which comprises the article to be coated, and an anode, and carrying out an electrodeposition by passing a direct current in the electrolytic bath. The coating layer thus obtained is provided with high thickness uniformity, high wear resistance, even at high temperatures, high hardness (up to 1500 HV), and, at the same time, corrosion resistance at least equal to 400 hours of exposure to neutral saline fog, in accordance with the ISO 9227:2017 standard.

FLUXLESS BRAZING METHOD AND COMPOSITIONS OF LAYERED MATERIAL SYSTEMS FOR BRAZING ALUMINUM OR DISSIMILAR METALS

A brazing product for fluxless brazing comprises an aluminum or aluminum alloy substrate; a layer of an aluminum eutectic-forming layer applied to the substrate, and a braze-promoting layer comprising one or more metals from the group comprising nickel, cobalt and iron is applied on the eutectic-forming layer. The eutectic-forming layer is preferably Si deposited by physical vapor deposition. The brazing product may be brazed to another aluminum shape or to a shape comprised of a dissimilar metal.

PRESSURIZER HEATER FOR THE PRIMARY COOLING SYSTEM OF A PRESSURIZED-WATER NUCLEAR REACTOR

L'invention concerne une canne chauffante pour un pressuriseur de circuit primaire de réacteur nucléaire à eau sous pression, cette canne comprenant u ne enveloppe externe (36) métallique de forme allongée longitudinalement présentant une surface externe (62), et un organe de chauffage (40) monté à l'intérieur de l'enveloppe (36). Elle comprend un revêtement (60) de protection contre la corrosion couvrant au moins une partie de la surface externe (62) de l'enveloppe (36).

CONNECTING COMPONENT MATERIAL

A connecting component material used as a material constituting a connecting component, wherein: the connecting component material is obtained by using an Ni-plated metal plate in which an Ni plating layer is formed on the surface of a metal plate and the average depth (R) of a surface roughness motif in at least one direction on the surface of the Ni plating layer is 1.0 µm or above, and by forming an Sn plating layer having a thickness of 0.3-5 µm on the Ni plating layer of the Ni-plated metal plate; the connecting component material makes it possible to reduce friction and minimize abrasion of the material when a connecting component such as an electrical connection terminal is fitted, and to improve the reliability of a stable electrical connection; and the connecting component material can be used in, e.g., electrical contact components such as lead frames, harness plugs, and connectors used in electrical and electronic devices and the like.

NICKEL-CHROMIUM NANOLAMINATE COATING HAVING HIGH HARDNESS

The present disclosure describes electrodeposited nanolaminate materials having layers comprised of nickel and/or chromium with high hardness. The uniform appearance, chemical resistance, and high hardness of the nanolaminate NiCr materials described herein render them useful for a variety of purposes including wear (abrasion) resistant barrier coatings for use both in decorative as well as demanding physical, structural and chemical environments.

SINGLE SOLUTION FOR ELECTRO-ELECTROLESS DEPOSITION OF METALS

A hybrid electro-electroless deposition process whereby multiple metal films layers are deposited from a single plating solution which includes both electroless and electroplating components. The article to be plated is immersed in the solution, and electric current is selectively applied at determined voltages for predetermined times, at selected intervals to effect electroplating in conjunction with electroless deposition. Electroplated metal layers are interspersed with electroless deposited metal layers.

NICKEL ELECTROPLATING PROCESS WITH REDUCED NICKEL ION BUILD UP

A process for electrodepositing nickel on a conductive substrate in a manner which inhibits buildup of nickel ions in the electrolyte. A sacrificial anode and insoluble iron anode are immersed in a nickel electroplating bath. The current provided to the iron anode is controlled during plating to reduce the amount of nickel buildup on solution.

AN ELECTROPLATING METHOD OF FORMING PLATINGS OF NICKEL, COBALT, NICKEL ALLOYS OR COBALT ALLOYS

An electroplating method of forming platings of nickel, cobalt, nickel alloy s or cobalt alloys with reduced stresses in an electrodepositing bath of the type: Watt's bath, chloride bath or a combination thereof, by employing pulse plating with periodic reverse pulse and a sulfonated naphthalene additive. This method makes it possible t o deposit nickel, cobalt, nickel or cobalt platings without internal stresses.

Verfahren zur Herstellung eines zur Erzeugung eines elektrolytischen Niederschlages eines Metalles der Eisengruppe geeigneten Bades.

Verfahren zum Reinhalten elektrolytischer Bäder, insbesondere Nickelbäder.

Procédé d'obtention par dépôt électrolytique de métaux magnétiques du groupe du fer, et d'alliages de ces métaux.

Procédé de nickelage des objets en aluminium ou en ses alliages.

Verfahren zur Herstellung dicker Nickelüberzüge.

Verfahren zur Herstellung von galvanischen Metallüberzügen

Verfahren zur Erzeugung festhaftender und glänzender galvanischer Metallüberzüge

Verfahren zur Herstellung von galvanischen Metallüberzügen

Bain électrolytique contenant du nickel et utilisation de ce bain pour le dépôt de nickel sur un support

Verfahren zur Herstellung eines Nickelüberzuges auf einer Metallunterlage.

Nouveau bain de nickelage électrolytique

Procédé pour le dépôt électrolytique de nickel

Procédé de préparation d'un dépôt brillant de nickel

Procédé pour l'obtention par chromage électrolytique de revêtements de chrome à structure microfissurée

Bain de nickelage électrolytique

Electrodeposition of a ni interlayer prior to a micro-

Production of micro-cracked chromium electroplate as in GB. 1,122,795, wherein the intermediate Ni layer is deposited from an aqueous solution at a max. temp. of 35 C and a current density of 1-15 A/dm2 the solution comprising Ni chloride, sulphate, sulphamate, or fluorborate, an alkali metal or ammonium salt of a strong acid (e.g. one or more of hydrochloric, fluoboric, sulphamic and sulphuric) and one or more of acetic, gluconic, tartaric, malic, formic, lactic, citric and succinic acid and the Ni, K, Na and NH4 salts of these acids; with optional additions of a sulphonate, sulphoamide, or sulphonimide of an aromatic compound, butyne 1-4 diol, an amino derivative of a heterocyclic compound such as 2-amino-thiazole or a Co salt to act as a brightening agent. The intermediate Ni layer may be deposited on an initial layer which may be a single or multiple electrodeposited Ni layer.

Contact layers for semiconductor devices

A coherent metal layer is deposited on a substrate. Simultaneously particles of semiconductor material, which are capable of alloying with the metal, are incorporated in the metal layer. The deposition is effected from a suspension, which is produced by suspending the particles of the semiconductor material in a fluid, and at a temperature lower than that at which the metal and the particle semiconductor material alloy together. Heating alloys together the metal and the particle semiconductor material. The metal layer may be applied by electrodeposition, by electroless deposition or with the aid of a gravitational effect. The metal deposited may be gold or silver. The particles of semiconductor material may be of silicon, germanium or gallium arsenide. Doping agents secuh as borom may bed used. IUt is possible to apply a thin metal layer, followed by simultaneous deposition of metal and semiconductor material. Then pure metal could again be applied.

Verfahren zur galvanischen Abscheidung von Nickel oder einer Nickellegierung und Bad zur Durchführung dieses Verfahrens

Electrodeposition of semi-bright nickel

Process comprises passing a current (pref. current density is not 10 amps/aq. decimeter) from an anode to metal cathode in an aqs. acidic Ni-plating soln. contg. at least one Ni cpd. (which gives suitable Ni ions for electrodeposition) and a semibright additive comprising (1) an aromatic aldehyde (pref. cinnamaldehyde) and (2) an aliphatic aldehyde (pref. formaldehyde). Pref. concn. of (1) and (2) are each 0.01-0.2 g)l and their solutions are both 0.010 g/l in electroplating soln. Plating has uniformly fine-grained structure and has excellent ductility.

Verfahren zur Vorbehandlung von Stahlblechen für Emaillierungen

VERFAHREN ZUR GALVANISCHEN ABSCHEIDUNG VON NICKEL UND/ ODER KOBALT.

Procédé pour le recouvrement électrolytique de l'aluminium

Bad zur galvanischen Erzeugung magnetisch hochwertiger Überzüge

Procédé de placage pour déposer un revêtement sur une surface métallique

Procédé de dépôt électrolytique de nickel brillant

Verfahren und Bad zum galvanischen Glanzvernickeln

Verfahren zur Glanznickelabscheidung durch Elektroplattieren

Schädlingsbekämpfungsmittel und Verwendung desselben

Procédé d'obtention d'un revêtement noir sur un article métallique

Procédé pour le dépôt de nickel par électrolyse

Elektroplattierverfahren

Galvanisches Nickelbad

Bad zum galvanischen Abscheiden von Nickel

Verfahren zur Herstellung von galvanischen Nickelüberzügen

Process for high-speed electrodeposition of nickel

In the novel process, the bath fluid is pumped from a storage tank (3) to the nozzle(s), sprayed onto the object to be electroplated and then flows back from the electroplating vessel (1) into the storage tank. The pH of the bath fluid in the storage tank, which at the same time is a measure for the concentration of the nickel ions and which during electroplating drops steadily, is monitored continuously. The pH meter (4) controls a pump (5) which is switched on as soon as the pH drops below a predefined value and which then pumps the bath fluid depleted in nickel ions from the storage tank into a storage vessel (6) filled with metallic nickel and from this vessel returns bath fluid enriched with nickel ions into the storage tank. ...

PROCEDURE FOR THE PRODUCTION OF ACTIVE CATHODES, ITSELF FOR APPLICATION IN ELECTRO-CHEMICAL PROCEDURES BEING SUITABLE.

ELECTROPLATING BATH FOR NICKEL PLATING USING INSOLUBLE ANODES.

Manufacturing micromechanics composite silicon-metal part useful in clock element, comprises manufacturing substrate with upper and lower layers, and selectively etching cavity in upper layer to define pattern in portion of silicon part

The method comprises manufacturing a substrate (3) comprising an upper layer (5) and a lower layer (7) extending from an intermediate layer (9) made of silicon oxide, selectively etching a cavity in the upper layer to define a pattern in a portion of a first silicon part, continuing the etching of the cavity in the intermediate layer, and forming a first metal layer (63) from a portion of the cavity formed by a lower conductive layer to form a first metal part with a thickness of greater than 6 microns for insulating the first silicon part. The method comprises manufacturing a substrate (3) comprising an upper layer (5) and a lower layer (7) extending from an intermediate layer (9) made of silicon oxide, selectively etching a cavity in the upper layer to define a pattern in a portion of a first silicon part, continuing the etching of the cavity in the intermediate layer, forming a first metal layer (63) from a portion of the cavity formed by a lower conductive layer to form a first metal ...

Многослойное ценное изделие

1. Многослойное ценное изделие, содержащее основу из сплава железа, на поверхности которой гальваническим способом нанесен слой металла с люминесцентным защитным элементом, выполненный из маркирующего люминофора, покрытого защитной капсулой, оболочка которой выполнена прозрачной с возможностью пропускать волны оптического спектра.2. Изделие по п. 1, оличающееся тем, что оболочка пропускает волны, находящиеся в оптически видимой части спектра.3. Изделие по п. 1, оличающееся тем, что оболочка пропускает волны, находящиеся в оптически невидимой части спектра.4. Изделие по п. 1, оличающееся тем, что в качестве металла покрытия использован никель.5. Изделие по п. 1, оличающееся тем, что в качестве металла покрытия использовано серебро.6. Изделие по п. 1, оличающееся тем, что выполнено и в качестве металла покрытия использована латунь.7. Изделие по п. 1, оличающееся тем, что в качестве металла покрытия использована медь. РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) (13) 162 264 U1 (51) МПК B32B 15/04 (2006.01) B32B 15/18 (2006.01) C25D 3/12 (2006.01) C25D 15/00 (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ТИТУЛЬНЫЙ (21)(22) Заявка: ЛИСТ ОПИСАНИЯ ПОЛЕЗНОЙ МОДЕЛИ К ПАТЕНТУ 2015150539/05, 25.11.2015 (24) Дата начала отсчета срока действия патента: 25.11.2015 (45) Опубликовано: 10.06.2016 Бюл. № 16 (73) Патентообладатель(и): Федеральное государственное унитарное предприятие "Гознак" (ФГУП "Гознак") (RU) 1 6 2 2 6 4 R U (57) Формула полезной модели 1. Многослойное ценное изделие, содержащее основу из сплава железа, на поверхности которой гальваническим способом нанесен слой металла с люминесцентным защитным элементом, выполненный из маркирующего люминофора, покрытого защитной капсулой, оболочка которой выполнена прозрачной с возможностью пропускать волны оптического спектра. 2. Изделие по п. 1, оличающееся тем, что оболочка пропускает волны, находящиеся в оптически видимой части спектра. 3. Изделие по п. 1, оличающееся тем, что оболочка пропускает волны, ...

Plating or Coating Method for Producing Metal-Ceramic Coating on a Substrate

A method for producing a metal-ceramic composite coating with increased hardness on a substrate includes adding a sol of a ceramic phase to the plating solution or electrolyte. The sol may be added prior to and/or during the plating or coating and at a rate of sol addition controlled to be sufficiently low that nanoparticles of the ceramic phase form directly onto or at the substrate and/or that the metal-ceramic coating forms on the substrate with a predominantly crystalline structure and/or to substantially avoid formation of nanoparticles of the ceramic phase, and/or agglomeration of particles of the ceramic phase, in the plating solution or electrolyte. The ceramic phase may be a single or mixed oxide, carbide, nitride, silicate, boride of Ti, W, Si, Zr, Al, Y, Cr, Fe, Pb, Co, or a rare earth element. The coating, other than the ceramic phase may comprise Ni, Ni—P, Ni—W—P, Ni—Cu—P, Ni—B, Cu, Ag, Au, Pd.

Electrolytic copper process using anion permeable barrier

Processes and systems for electrolytically processing a microfeature workpiece with a first processing fluid and a counter electrode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, a counter electrode, a second processing fluid, and an anion permeable barrier layer. The anion permeable barrier layer separates the first processing fluid from the second processing fluid while allowing certain anionic species to transfer between the two fluids. Some of the described processes produce deposits over repeated plating cycles that exhibit resistivity values within desired ranges.

Nickel-plated steel sheet and process for producing battery can using the nickel-plated steel sheet

A Ni-plated steel sheet is provided in which thee occurrence of scratches at the time of forming a battery can is suppressed. Also provided is a method which includes a step where a surface of a steel sheet is plated with Ni in a Ni adhesion amount of 0.3-2 μm, a step where the Ni-plated steel sheet is heated to 600-800° C. to form an Fe−Ni diffusion layer as an outermost surface layer, and a step where the steel sheet is rolled by temper rolling so as to adjust the Fe−Ni diffusion layer so that the steel sheet has the surface roughness Ra of 0.9-2.0 μm and the surface roughness Ry of 4.0-15 μm. A Ni-plated steel sheet which includes an Fe−Ni diffusion layer as an outermost surface layer and in which the diffusion layer has the surface roughness Ra of 0.9-2.0 μm and the surface roughness Ry of 4.0-15 μm and the diffusion layer has such an Fe/Ni ratio that the Fe accounts for 20-50% in Auger analysis is subjected to drawing using a water-soluble liquid which contains water-soluble emersion as a press lubricant.

Nickel-Plated Steel Sheet for Manufacturing Pipe Having Corrosion Resistance Against Fuel Vapors, Pipe Which Uses the Steel Sheet,and Fuel Supply Pipe Which Uses the Steel Sheet

Provided is a nickel-plated steel sheet for manufacturing a pipe having corrosion resistance against fuel vapor of fuel such as gasoline, light oil, bioethanol or bio-diesel fuel, and a pipe and a fuel supply pipe. In the nickel-plated steel sheet for manufacturing a pipe, a nickel plating layer having a plating thickness of 0.5 to 10 μm is formed on a surface of a steel sheet thus having corrosion resistance against fuel vapor. In the pipe and the fuel supply pipe, a nickel plating layer having a plating thickness of 0.5 to 10 μm is formed on an inner surface of a pipe formed of a steel sheet thus having corrosion resistance against fuel vapor. In the fuel supply pipe 20 formed of a steel sheet for supplying fuel to a fuel tank 23 , the fuel supply pipe includes: a large-diameter pipe portion 21 through which the fuel passes; and a small-diameter pipe portion 22 which makes an upper portion of the large-diameter pipe portion and a lower portion of the large-diameter pipe portion communicate with each other for ventilation, and a nickel plating layer having a plating thickness of 0.5 to 10 μm is formed on an inner surface of at least the small-diameter pipe portion.

Method for Coating, Pole Tube and Device for carrying out the Method

A method for coating workpieces which consist of two different metallic materials includes providing the workpiece in a nickel strike electrolyte with a nickel layer as substrate before the application of a corrosion-resistant layer.

Electrolyte and process for depositing a matt metal layer

An electrolytic composition for the deposition of a matt metal layer onto a substrate and deposition process where the composition comprises a source of metal from the group consisting of Cr, Mn, Fe, Co, Ni, Cu, Zn, Ru, Rh, Pd, Ag, In, Sn, Sb, Re, Pt, Au, Bi, and combinations thereof; a substituted or unsubstituted polyalkylene oxide or its derivative as an emulsion and/or dispersion former; and a compound comprising fluorated or perfluorated hydrophobic chains or which is a polyalkylene oxide substituted quaternary ammonium compound as wetting agent; wherein the electrolytic composition forms a microemulsion and/or dispersion.

Silver-coated composite material for a movable contact part, method of producing the same, and movable contact part

A silver-coated composite material for movable contact parts, which has: an underlying layer composed of any one of nickel, cobalt, a nickel alloy, and a cobalt alloy at least provided on a part of the surface of a stainless steel substrate; an intermediate layer composed of copper or a copper alloy provided thereon; and a silver or silver alloy layer provided thereon as an outermost layer, wherein a thickness of the intermediate layer is 0.05 to 0.3 μm, and wherein an average grain size of the silver or silver alloy provided as the outermost layer is 0.5 to 5.0 μm.

Biocidal metallic layers comprising cobalt

Free standing articles or articles at least partially coated with substantially porosity free, fine-grained and/or amorphous Co-bearing metallic materials optionally containing solid particulates dispersed therein, are disclosed. The electrodeposited metallic layers and/or patches comprising Co provide, enhance or restore strength, wear and/or lubricity of substrates without reducing the fatigue performance. The fine-grained and/or amorphous metallic coatings comprising Co are particularly suited for articles exposed to thermal cycling, fatigue and other stresses and/or in applications requiring anti-microbial properties.

STEEL SHEET FOR CONTAINER AND METHOD OF MANUFACTURING THE SAME

The present invention provides a steel sheet for a container including a cold-rolled steel sheet and a composite film formed on the cold-rolled steel sheet through an electrolysis process in a solution containing: at least one metal ion of an Sn ion, an Fe ion, and an Ni ion; Zr ion; a nitric acid ion: and an ammonium ion, in which the composite film contains at least one element of: Zr of 0.1 to 100 mg/min equivalent units of metal Zr; Sn of 0.3 to 20 g/min equivalent units of metal Sn; Fe of 5 to 2000 mg/min equivalent units of metal Fe; and Ni of 5 to 2000 mg/min equivalent units of metal Ni. 1. A steel sheet for a container , the steel sheet comprisinga cold-rolled steel sheet, and at least one metal ion selected from the group consisting of an Sn ion, an Fe ion, and an Ni ion;', 'a Zr ion;', 'a nitric acid ion; and', 'an ammonium ion, wherein, 'a composite film formed on the cold-rolled steel sheet through an electrolysis process in a solution containing [{'sup': '2', 'Zr of 0.1 to 100 mg/min equivalent units of metal Zr, {'sup': '2', 'Sn of 0.3 to 20 g/min equivalent units of metal Sn;'}, {'sup': '2', 'Fe of 5 to 2000 mg/min equivalent units of metal Fe; and'}, {'sup': '2', 'Ni of 5 to 2000 mg/min equivalent units of metal Ni.'}], 'the composite film contains at least one element selected from the group consisting of2. The steel sheet for a container according to claim 1 , whereinthe solution further contains at least one of a phosphoric acid ion and a phenolic resin, and{'sup': 2', '2, 'the composite film further contains at least one of a phosphoric acid compound of 0.1 to 50 mg/min equivalent units of P, and a phenolic resin of 0.1 to 50 mg/min equivalent units of C.'}3. The steel sheet for a container according to claim 2 , whereinthe solution further contains a fluorine ion, and{'sup': '2', 'the composite film further contains a fluorine compound of not more than 0.1 mg/min equivalent units of F.'}4. The steel sheet for a container according to claim 1 , ...

Electrodeposited metallic coatings comprising cobalt with enhanced fatigue properties

Free standing articles or articles at least partially coated with substantially porosity free, fine-grained and/or amorphous Co-bearing metallic materials optionally containing solid particulates dispersed therein, are disclosed. The electrodeposited metallic layers and/or patches comprising Co provide, enhance or restore strength, wear and/or lubricity of substrates without reducing the fatigue performance compared to either uncoated or equivalent thickness chromium coated substrate. The fine-grained and/or amorphous metallic coatings comprising Co are particularly suited for articles exposed to thermal cycling, fatigue and other stresses and/or in applications requiring anti-microbial properties.

Three-piece resealable can for acidic liquid

A three-piece resealable can for acidic liquid includes, a cylindrical can body member that includes a screw portion at one end; and a can bottom member that contacts the can body member so as to close an opening portion of the other end of the can body member. The can body member includes a cylindrical first steel sheet, Ni plating that is formed on an inner circumferential surface of the first steel sheet, a polyester film that is formed so as to be disposed on the outermost surface of the inner circumference of the can body member, and a chromate film that is formed between the first steel sheet and the polyester film. The can bottom member includes a second steel sheet, and Sn plating that is formed on the can body member side of the can bottom member.

Metal Surface and Process for Treating a Metal Surface

An article having a metal surface is treated to have one or more desired effects, such as desired functional properties or a desired cosmetic appearance. The surface is anodized to create an oxide layer having pores therein and a metal deposition process is performed to deposit multiple different metals within the pores. A pretreatment act, such as degreasing, chemical etching, chemical polishing, and desmutting can also be conducted on the surface prior to anodization. The surface can also be dyed, sealed, and polished.

ELECTROLYTIC BATH FOR ELECTRODEPOSITION AND METHOD FOR PRODUCING SAME

An electrolytic bath for electrodeposition includes nickel salt, phosphoric acid, phosphonic acid, and boric acid in solution. A method for producing an electrolytic bath includes the steps of mixing a nickel salt, phosphoric acid, phosphonic acid, and boric acid, and adding nickel carbonate in order to increase the pH value. 1. An electrolytic bath for electrodeposition , comprising in solution:a) nickel saltb) phosphoric acidc) phosphonic acidd) boric acid.2. The electrolytic bath of claim 1 , comprising in solution phosphoric acid with a concentration in the range of 60-90 g/l.3. The electrolytic bath of claim 2 , further comprising in solution phosphonic acid with a concentration in the range of 20-40 g/l.4. The electrolytic bath of claim 3 , further comprising in solution phosphonic acid with a concentration in the range of 20-40 g/l.5. The electrolytic bath of claim 1 , further comprising in solution boric acid with a concentration in the range of 30-40 g/l.6. The electrolytic bath of claim 1 , further comprising in solution nickel(II) with a concentration in the range of 90-130 g/l.7. The electrolytic bath of any of claim 1 , further comprising in solution 0-4 g/l saccharine.8. The electrolytic bath of claim 1 , having a pH in the range from 1.6 to 2.3.9. The electrolytic bath of claim 1 , wherein the nickel salt comprises nickel sulfate and wherein more than 50% of the nickel(II) in the bath comes from the nickel sulfate.10. The electrolytic bath of claim 1 , further comprising in solution sulfate with a concentration in the range of 147-213 g/l.11. A method for producing an electrolytic bath claim 1 , the method comprising the steps of:A) mixing a nickel salt, phosphoric acid, phosphonic acid, and boric acid; andB) adding nickel carbonate is added to raise the pH.12. The method of claim 11 , wherein the pH of the bath is measured and wherein nickel carbonate is added to raise the pH until a predetermined pH is reached claim 11 , the predetermined pH being ...

METHOD FOR ALUMINIZING A SURFACE BY MEANS OF THE ADVANCE DEPOSITION OF A PLATINUM AND NICKEL LAYER

A method for depositing an aluminizing coating onto a substrate. The method includes: (a) depositing a layer, containing platinum and at least 35% of nickel, onto a surface of the substrate; and (b) depositing an aluminum coating onto the layer. 16-. (canceled)7. A method for depositing an aluminizing coating on a substrate , comprising:(a) depositing a layer containing platinum and at least 35% of nickel on a surface of the substrate;(b) depositing a aluminum coating on the layer.8. The method according to claim 7 , wherein claim 7 , in (a) claim 7 , to deposit the layer claim 7 , a first layer containing platinum is first deposited on the surface claim 7 , then a second layer containing nickel is deposited on the first layer.9. The method according to claim 8 , wherein claim 8 , in (a) claim 8 , the second layer of nickel is deposited by electrolysis.10. The method according to claim 7 , wherein the substrate is a superalloy.11. The method according to claim 10 , wherein the superalloy is a nickel-based superalloy.12. The method according to claim 7 , wherein before the deposition of the layer in (a) claim 7 , the surface is prepared. The present invention relates to a method for depositing an aluminizing coating on a substrate.Aluminum-based coatings, called “aluminizing coatings,” are used to protect the surface of parts operating at high temperatures and in oxidizing environments. Such a coating may also serve as a fastening layer for attaching to another protective coating, said protective coating being more able to adhere to such an aluminizing coating than to the surface of the part itself.For example, such parts are found in aeronautic turbojet engines, such as airplane engines. These parts are in particular turbine vanes or nozzles.These parts are for example made from nickel-based superalloys.To perform an aluminizing coating on such a superalloy, a layer of platinum is first deposited on the surface of said superalloy that is the substrate . This step is ...

High temperature resistant silver coated substrates

A thin film of tin is plated directly on nickel coating a metal substrate followed by plating silver directly on the thin film of tin. The silver has good adhesion to the substrate even at high temperatures.

Methods and Electrolytes for Electrodeposition of Smooth Films

Electrodeposition involving an electrolyte having a surface-smoothing additive can result in self-healing, instead of self-amplification, of initial protuberant tips that give rise to roughness and/or dendrite formation on the substrate and/or film surface. For electrodeposition of a first conductive material (C1) on a substrate from one or more reactants in an electrolyte solution, the electrolyte solution is characterized by a surface-smoothing additive containing cations of a second conductive material (C2), wherein cations of C2 have an effective electrochemical reduction potential in the solution lower than that of the reactants.

Copper alloy sheet with sn coating layer for a fitting type connection terminal and a fitting type connection terminal

A copper alloy sheet with a Sn coating layer comprises a base material made of Cu—Ni—Si system copper alloy. Formed on the base material is a Ni coating layer having an average thickness of 0.1 to 0.8 μm. Formed on the Ni coating layer is a Cu—Sn alloy coating layer having an average thickness of 0.4 to 1.0 μm. Formed on the Cu—Sn alloy coating layer is an Sn coating layer having average thickness of 0.1 to 0.8 μm. A material surface is subject to reflow treatment and has arithmetic mean roughness Ra of 0.03 μm or more and less than 0.15 μm in both a direction parallel to the rolling direction and a direction perpendicular to the rolling direction. An exposure rate of the Cu—Sn alloy coating layer to the material surface is 10 to 50%. A fitting type connection terminal requiring low insertion force can be obtained at a low cost.

Semiconductor device, and method of manufacturing semiconductor device

A semiconductor device which can reduce a heat stress to a solder layer while suppressing an increase of thermal resistance is provided. A semiconductor device includes a semiconductor element, a solder layer which is arranged on at least one surface of the semiconductor element and a lead frame which is arranged on the solder layer so that a porous nickel plating part is sandwiched between the lead frame and the solder layer. Compared with a case that the semiconductor element and the lead frame are jointed by a solder directly, an increased part of a thermal resistance of the solder junction is held down only to a part of the porous nickel plating part and a thermal resistance applied to the solder layer can be reduced.

NICKEL PLATING SOLUTION AND METHOD FOR FORMING NICKEL PLATING LAYER USING THE SAME

Disclosed herein are a nickel plating solution and a method for forming a nickel layer on an external electrode of a chip component by using the nickel plating solution, the nickel plating solution including: a nickel ion; a chloride ion; and a pH buffer, wherein the pH buffer is used by mixing an inorganic acid, and an organic acid and a salt thereof, so that the damage to a body of the chip component can be reduced by containing organic acid and a salt thereof in the nickel plating solution for forming the nickel plating layer on the external electrode of the chip component having a body formed of a material including ferrite or manganese oxide. 1. A nickel plating solution , comprising:a nickel ion;a chloride ion; anda pH buffer,wherein the pH buffer is used by mixing an inorganic acid, and an organic acid and a salt thereof.2. The nickel plating solution according to claim 1 , wherein the pH buffer is contained in a concentration of 30˜100 g/L and the organic acid and the salt thereof are contained in a concentration of 20˜50 g/L in the pH buffer.3. The nickel plating solution according to claim 1 , wherein the organic acid and the salt thereof are at least one selected from the group consisting of succinic acid claim 1 , gluconic acid claim 1 , lactic acid claim 1 , and a salt thereof.4. The nickel plating solution according to claim 1 , wherein the nickel ion is contained in a concentration of 50˜100 g/L and the chloride ion is contained in a concentration of 10˜50 g/L.5. The nickel plating solution according to claim 1 , wherein it has a pH value of 4.5˜6.0.6. A method for forming a nickel plating layer in which the nickel plating layer is formed on an external electrode of a chip component claim 1 , wherein the nickel plating layer is formed by using a nickel electroplating solution containing a nickel ion claim 1 , a chloride ion claim 1 , and a pH buffer where an inorganic acid claim 1 , and an organic acid and a salt thereof are mixed.7. The method ...

Steel Armor Wire Coatings

A wire includes a ferrous core. The ferrous core can be coated. The coatings can include nickel, molybdenum, zinc and Fe. A process of forming a wire can include placing a metal strip alongside a ferrous wire core, bending the strip around the core, and seam welding the strip to form a metal tube around the core. The process of forming a wire can include applying a metal layer to a ferrous metal rod to form a plated rod, placing a metal strip alongside the rod, bending the strip around the rod, and seam welding the strip to form a metal tube around the rod. The process of forming a wire can include coating a ferrous wire core with a layer of nickel, molybdenum or a nickel alloy that circumferentially surrounds the ferrous wire core. 1. A process of forming a wire comprising:coating a ferrous wire core with an interface layer of nickel, molybdenum or a nickel alloy,wherein the interface layer circumferentially surrounds the ferrous wire core; andcoating the interface layer with an outer layer.2. The process of claim 1 , wherein the ferrous wire core is steel.3. The process of claim 1 , wherein the interface layer has a thickness of between 2 and 60 microns.4. The process of claim 1 , wherein outer layer has a thickness of between 1 and 50 microns.5. The process of claim 1 , wherein the outer layer comprises a zinc alloy claim 1 , and wherein the zinc allow comprises:binary Zn—Ni or Zn—Co alloy; orternary Zn—Ni—Co, Zn—Ni—Mo or Zn—Co—Mo alloy.6. The process of claim 1 , further comprising an Fe layer claim 1 , wherein the Fe layer circumferentially surrounds the interface layer and is circumferentially surrounded by the outer layer.7. The process of claim 6 , wherein the Fe layer has a thickness of between 2 and 20 microns.8. The process of claim 1 , further comprising a galvanized zinc coating. The present disclosure relates to steel armor wire strength member coating compositions, structures, and processes.Armor wire strength members used in wireline cables for ...

ELECTROLYTIC BATH FOR PRODUCING ANTIBACTERIAL METAL COATINGS CONTAINING NICKEL, PHOSPHORUS AND NANOPARTICLES OF AN ANTIBACTERIAL METAL (NI-P-MANP'S)

The present invention proposes the use of an electrolytic bath to electroplate metal composites of nickel-phospohrous-metal nano-particles having antibacterial ability, which inhibits bacteria growing, such as and , at least on 99% of its surface. 19-. (canceled)10. A composition of electrolytic bath to electroplate a metal composite of Nickel-phosphorus-metal nano-particles of an antibacterial metal (Ni—P-MANPs) , of the type commonly comprising the source of ions to be deposited and salts to make conductive the electrolytic bath , wherein said ion source to be deposited are nickel sulfamate tetrahydrate salts (Ni(SO3NH2)2.4H2O) , Phosphorous acid (H3PO3) and antibacterial metal nano-particles , having as additives a buffering pH agent and a surfactant agent , the electrolytic bath having a pH between 2 and 5.11. The composition according to claim 10 , wherein the source of Ni2+ ions is the nickel sulfamate tetrahydrate (Ni(SO3NH2)2.4H2O) at a concentration of 300 to 500 g/L.12. The composition according to claim 11 , wherein the nickel sulfamate tetrahydrate (Ni(SO3NH2)2.4H2O) is at a concentration of 400 g/L13. The composition according to claim 10 , wherein the phosphorous acid (H3PO3) is at a concentration of between 0.01 to 30.0 g/L.14. The composition according to claim 13 , wherein the phosphorous acid (H3PO3) is at a concentration of 10.0 g/L.15. The composition according to claim 10 , wherein the antibacterial metal nanoparticles are silver or copper nano-particles in a concentration between 3.0 and 10 g/L.16. The composition according to claim 15 , wherein the size of the antibacterial metal nano-particles is between 10 to 100 nanometers.17. The composition according to claim 16 , wherein the size of the antibacterial metal nano-particles is 60 nanometers.18. The composition according to claim 10 , wherein the pH buffering agent is boric acid (H3BO3).19. The composition according to claim 18 , wherein the boric acid (H3BO3) is at a concentration of ...

Nickel-Chromium Nanolaminate Coating Having High Hardness

The present disclosure describes electrodeposited nanolaminate materials having layers comprised of nickel and/or chromium with high hardness. The uniform appearance, chemical resistance, and high hardness of the nanolaminate NiCr materials described herein render them useful for a variety of purposes including wear (abrasion) resistant barrier coatings for use both in decorative as well as demanding physical, structural and chemical environments. 1. A process for forming a multilayered nickel and chromium containing coating on a surface of a substrate or mandrel by electrodeposition comprising:(a) providing one or more electrolyte solutions comprising a nickel salt and/or a chromium salt;(b) providing a conductive substrate or mandrel for electrodeposition;(c) contacting at least a portion of the surface of the substrate or mandrel with one of said one or more electrolyte solutions;(d) passing a first electric current through the substrate or mandrel, to deposit a first layer comprising either nickel or an alloy thereof, on the substrate or mandrel; and passing a second electric current through the substrate, to deposit a second layer comprising a nickel-chromium alloy on the surface;(e) repeating step (d) two or more times thereby producing a multilayered coating having first layers of nickel, or an alloy thereof, and second layers of a nickel-chromium alloy on at least a portion of the surface of the substrate or mandrel; andoptionally separating the substrate or mandrel from the coating.2. The process of claim 1 , wherein:said providing one or more electrolyte solutions comprises providing an electrolyte solution comprising a nickel salt and a chromium salt;passing an electric current through said substrate or mandrel comprises alternately pulsing said electric current for predetermined durations between said first electrical current and said second electrical current;where said first electrical current is effective to electrodeposit a first composition ...

Method and Apparatus for Continuously Applying Nanolaminate Metal Coatings

Described herein are apparatus and methods for the continuous application of nanolaminated materials by electrodeposition. 1. An apparatus for electrodepositing a nanolaminate coating comprising:at least a first electrodeposition cell through which a conductive workpiece is moved at a rate,a rate control mechanism that controls the rate the workpiece is moved through the electrodeposition cell;an optional mixer for agitating an electrolyte during the electrodeposition process;an optional flow control unit for applying the electrolyte to the workpiece;an electrode; anda power supply controlling the current density applied to the workpiece in a time varying manner as it moves through the cell.2. The apparatus of claim 1 , wherein controlling the current density in a time varying manner comprises applying two or more different current densities to the workpiece as it moves through the electrodeposition cell.3. The apparatus of claim 2 , wherein controlling the current density in a time varying manner comprises applying an offset current claim 2 , so that the workpiece remains cathodic when it is moved through the electrodeposition cell and the electrode remains anodic.4. The apparatus of claim 1 , wherein the time varying manner comprises one or more of: varying the baseline current claim 1 , pulse current modulation and reverse pulse current modulation.57.-. (canceled)8. The apparatus of claim 1 , further comprising a first location claim 1 , from which the workpiece is moved to the electrodeposition cell claim 1 , and/or a second location claim 1 , for receiving the workpiece after it has moved through the electrodeposition cell claim 1 , wherein the first and/or second location comprises a spool or a spindle claim 1 , and wherein the workpiece is a wire claim 1 , rod claim 1 , sheet or tube that can be wound on said spool or around said spindle.913.-. (canceled)14. The apparatus of claim 1 , further comprising one or more locations between the first location and the ...

METHOD FOR REMOVING RARE EARTH IMPURITIES FROM NICKEL-ELECTROPLATING SOLUTION

A method for removing rare earth impurities from a nickel-electroplating solution by adding a rare earth compound to the nickel-electroplating solution containing rare earth impurities, keeping the electroplating solution at 60° C. or higher for a certain period of time, and then removing precipitate generated by the heating from the nickel-electroplating solution together with the added rare earth compound by sedimentation and/or filtration. 1. A method for removing rare earth impurities from a nickel-electroplating solution , comprisingadding a rare earth compound to said nickel-electroplating solution containing rare earth impurities;keeping said nickel-electroplating solution at 60° C. or higher for a certain period of time, and thenremoving a precipitate generated by said heating from said nickel-electroplating solution together with the added rare earth compound by sedimentation and/or filtration.2. The method for removing rare earth impurities from a nickel-electroplating solution according to claim 1 , wherein said rare earth compound is rare earth oxide.3. The method for removing rare earth impurities from a nickel-electroplating solution according to claim 1 , wherein a rare earth element constituting said rare earth compound is neodymium.4. The method for removing rare earth impurities from a nickel-electroplating solution according to claim 1 , wherein said nickel-electroplating solution is stirred while heating.5. The method for removing rare earth impurities from a nickel-electroplating solution according to claim 4 , wherein the stirring of the solution is achieved by air claim 4 , rotating stirring blades claim 4 , or circulation by a pump. The present invention relates to a method for removing rare earth impurities from a nickel-electroplating solution efficiently and easily.Rare earth magnets, particularly sintered R—Fe—B magnets (R is at least one of rare earth elements including Y, indispensably containing Nd), are widely used because of high ...

Method for removing rare earth impurities from nickel-electroplating solution

A method for removing rare earth impurities from a nickel-electroplating solution by keeping a nickel-electroplating solution containing rare earth impurities and having pH of 4.0-5.1 at 60° C. or higher for a certain period of time, and then removing precipitate generated by the heating from the nickel-electroplating solution by sedimentation and/or filtration.

Electroplated Bead Wire Having Excellent Oxidation Resistance

The present disclosure relates to an electroplated bead wire having excellent oxidation resistance, of which oxidation resistance and aging adhesive strength with tire rubber are improved by forming a copper- and cobalt-plated layer by electroplating. The electroplated bead wire includes the plated layer formed through electroplating, wherein the plated layer contains 40 to 99 wt % of copper and 1 to 40 wt % of cobalt. 1. An electroplated bead wire having excellent oxidation resistance and used as an automotive tire reinforcement , the bead wire comprising:a plated layer formed by electroplating,wherein the plated layer comprises40 weight % (wt %) to 99 wt % of copper and 1 to 40 wt % of cobalt.2. The electroplated bead wire having excellent oxidation resistance of claim 1 , whereinthe plated layer further comprises a third element,wherein the third element is 1 to 20 wt % of phosphorus.3. The electroplated bead wire having excellent oxidation resistance of claim 1 , whereinthe plated layer further comprises a third element,wherein the third element is any one element selected from nickel, indium, bismuth, zinc, tin, manganese, and molybdenum, and an amount of the third element in the plated layer is 1 wt % to 20 wt %.4. The electroplated bead wire having excellent oxidation resistance of claim 1 , whereina thickness of the plated layer is 0.005 μm to 2.0 μm.5. The electroplated bead wire having excellent oxidation resistance of claim 1 , whereincopper of the plated layer is formed by electroplating in a first electroplating bath, andcobalt of the plated layer is formed by electroplating in a second electroplating bath after going through the first electroplating bath.6. The electroplated bead wire having excellent oxidation resistance of claim 5 , whereina plating solution used in the first electroplating bath and the second electroplating bath comprises at least one selected from cyanide, pyrophosphoric acid, chloride, sulfide, and hypophosphoric acid plating ...

THIN FILM TYPE COIL COMPONENT AND METHOD OF MANUFACTURING THE SAME

A thin film type coil component including coil patterns in a cross section shape having an undercut in lower portions thereof is provided. The coil patterns may reduce parasitic capacitance between the coil patterns, thereby minimizing electrical loss. The volume of the coil patterns may be increased, thereby improving inductance and resistance characteristics. 1. A thin film type coil component comprising:a substrate; anda coil including a plurality of coil patterns disposed on the substrate,wherein a cross-section of each coil pattern has a shape that a width of at least one region among inner regions located between upper and lower cross sections is greater than widths of the upper and lower cross sections.21212. The thin film type coil component of claim 1 , wherein the cross section of each coil pattern satisfies H>H claim 1 , in which H is a height from the upper cross section of the coil pattern to the at least one region and H is a height from the lower cross section thereof to the at least one region.3. The thin film type coil component of claim 1 , wherein an interval between adjacent coil patterns is in the range from about 0.15 to about 0.45 times the width of the at least one region.4. The thin film type coil component of claim 1 , wherein the plurality of coil patterns are made of at least one of gold claim 1 , silver claim 1 , platinum claim 1 , copper claim 1 , nickel claim 1 , and palladium or alloys thereof.5. The thin film type coil component of claim 1 , wherein the substrate is a magnetic substrate.6. The thin film type coil component of claim 1 , further comprising: an insulating layer provided on the substrate.7. The thin film type coil component of claim 6 , wherein the plurality of coil patterns are provided in the insulating layer .8. The thin film type coil component of claim 1 , wherein the cross section of each coil pattern has a double trapezoidal shape in which an undercut is formed in the lower cross section.9. A method of ...

CATHODE CURRENT COLLECTOR FOR SOLID OXIDE FUEL CELL, AND SOLID OXIDE FUEL CELL COMPRISING SAME

The present invention relates to a cathode current collector for a solid oxide fuel cell and, more particularly, to a cathode current collector inserted between a cell and a metal separator constituting a unit of a fuel cell stack, and a solid oxide fuel cell comprising the same. 1. A cathode current collector for a solid oxide fuel cell ,wherein the cathode current collector is a porous metal foam having pores,wherein the metal foam is formed of one, two or more types of binary alloys consisting of CoNi, CoMn and CuMn, or one or two types of ternary alloys consisting of CoNiMn and CoCuMn.2. The cathode current collector for a solid oxide fuel cell of claim 1 , wherein Co claim 1 , Cu claim 1 , Ni and Mn forming the metal foam have compositions of Co:Ni or Co:Mn claim 1 , where Cu:Mn=1:9 to 9:1.3. The cathode current collector for a solid oxide fuel cell of claim 1 , wherein the metal foam has density of 200 g/mto 1000 g/m.4. A method for manufacturing a cathode current collector for a solid oxide fuel cell that includes a cathode claim 1 , an anode claim 1 , an electrolyte and a separator claim 1 , the method comprising:preparing a polymer foam;depositing a metal on a surface of the polymer foam;coating a metal mixture of two or more types of metal among Co, Cu, Ni and Mn on a top of the deposited metal;reduction heat treating the result after the coating; andpreparing a metal foam by removing the polymer foam after the reduction heat treatment,wherein the metal foam is one or more types of CoNi, CoMn, CuMn, CoNiMn and CoCuMn.5. The method for manufacturing a cathode current collector for a solid oxide fuel cell of claim 4 , wherein the metal is one or more of Ni claim 4 , Cu and Co.6. The method for manufacturing a cathode current collector for a solid oxide fuel cell of claim 4 , wherein the coating of mixed metals is carried out by electroplating or powder coating.7. The method for manufacturing a cathode current collector for a solid oxide fuel cell of claim 4 ...

COATED ARTICLES AND METHODS

Coated articles and methods for applying coatings are described. In some cases, the coating can exhibit desirable properties and characteristics such as durability, corrosion resistance, and high conductivity. The articles may be coated, for example, using an electrodeposition process. 1. An article , comprising:a base material;a coating formed on the base material, the coating comprising:a first layer comprising Ni, and W and/or Mo, wherein the first layer is nanocrystalline or amorphous; anda second layer formed on the first layer, the second layer comprising Au, wherein the second layer is nanocrystalline or amorphous.2. The article of claim 1 , wherein the first layer is formed directly on the base material.3. The article of claim 1 , wherein the second layer is formed directly on the first layer.4. The article of claim 1 , wherein the first layer and the second layer are electrodeposited.5. The article of claim 1 , wherein the second layer covers an entire surface of the first layer.6. The article of claim 1 , wherein the second layer covers only part of a surface of the first layer.7. The article of claim 1 , wherein the first layer is nanocrystalline.8. The article of claim 1 , wherein the second layer is nanocrystalline.9. The article of claim 1 , wherein the base material comprises an electrically conductive material.10. The article of claim 1 , wherein the article is an electrical connector.11. The article of claim 1 , wherein the second layer is a gold layer.12. The article of claim 1 , wherein the first layer comprises an alloy comprising Ni claim 1 , and W and/or Mo.13. The article of claim 12 , wherein the weight percent of nickel in the alloy is between 25-75 weight percent.14. The article of claim 12 , wherein the weight percent of nickel in the alloy is between 50-70 weight percent.15. The article of claim 12 , wherein the first layer comprises a nickel-tungsten alloy.16. The article of claim 12 , wherein the first layer is formed directly on the ...

LOW-FRICTION MEMBER IMITATING SHARK SKIN AND MANUFACTURING METHOD THEREFOR

The present invention relates to a low-friction member imitating shark skin and a manufacturing method therefor, the low-friction member implementing a structure similar to shark skin and having riblets by stacking, in layers, composite particles formed by attaching spherical particles on the surfaces of plate-shaped particles, and thus the low-friction member has excellent low-friction characteristics. The present invention comprises: a base plate; plate-shaped particles stacked in layers on the surface of the base plate in the form of scales; and a plurality of spherical metal lubricating particles having a size smaller than that of the plate-shaped particles, and coated on the surfaces of the plate-shaped particles, wherein the metal lubricating particles are arranged in the form of a bridge connecting the base plate and the plate-shaped particles, and the plate-shaped particles to each other. 1. A low-friction member comprising:a substrate; anda lubricating layer constituted by plate-shaped particles which are stacked in layers on the surface of the substrate in the form of scales and multiple spherical metal lubricating particles having a smaller nano size than the plate-shaped particles and coated on the surfaces of the plate-shaped particles,wherein the spherical metal lubricating particles are disposed in a form of multiple bridges connecting the substrate and the plate-shaped particles and connecting the plate-shaped particles in the lubricating layer.2. The low-friction member of claim 1 , wherein before the plate-shaped particles are stacked on the substrate claim 1 , the metal lubricating particles are coated on the surfaces of the plate-shaped particles to form composite particles and thereafter claim 1 , stacked on the surface of the substrate in a form of the composite particles.3. The low-friction member of claim 2 , wherein the plate-shaped particles are graphene.4. The low-friction member of claim 2 , wherein the plate-shaped particles are made of ...

Aluminized metallic scaffold for high temperature applications and method of making an aluminized metallic scaffold

An aluminized metallic scaffold for high temperature applications comprises a porous non-refractory alloy structure including a network of interconnected pores extending therethrough. The porous non-refractory alloy structure comprises a transition metal phase and an aluminide phase, and portions of the porous non-refractory alloy structure between interconnected pores have a thickness no greater than about 500 nm. A method of making an aluminized metallic scaffold for high-temperature applications comprises introducing aluminum into a surface of a porous metallic structure at an elevated temperature. The porous metallic structure comprises a transition metal and has a network of interconnected pores extending therethrough, where portions of the porous metallic structure between interconnected pores have a thickness no greater than about 500 nm. As the aluminum is introduced into the surface and diffusion occurs, an aluminide phase is formed, resulting in a porous non-refractory alloy structure comprising the aluminide phase and a transition metal phase.

METHOD OF MANUFACTURING MULTIPLE-COLOR PLATING MEMBER AND MULTIPLE-COLOR PLATING MEMBER MANUFACTURED USING THE SAME

A method of manufacturing a multiple-color plating member includes forming a copper plating layer on at least a part of a surface of a substrate, forming a nickel plating layer on a surface of the copper plating layer, forming a chromium plating layer on a surface of the nickel plating layer, applying a color coating agent onto a surface of the chromium plating layer and then drying the applied color coating agent to form a color coating layer, and applying a clear coating agent onto a surface of the color coating layer and photocuring the applied clear coating agent to form a clear layer. The color coating agent includes 10 to 35% by weight of a modified acrylic resin, 1 to 25% by weight of a pigment, and 40 to 80% by weight of a first solvent. The clear coating agent includes 10 to 30% by weight of a polyester-modified acrylic resin, 5 to 25% by weight of an acrylic oligomer, 5 to 45% by weight of an acrylic monomer, 1 to 15% by weight of a photoinitiator, and 10 to 75% by weight of a second solvent. 1. A method of manufacturing a multiple-color plating member comprising:forming a copper plating layer on at least a part of a surface of a substrate;forming a nickel plating layer on a surface of the copper plating layer;forming a chromium plating layer on a surface of the nickel plating layer;applying a color coating agent onto a surface of the chromium plating layer and then drying the applied color coating agent to form a color coating layer; andapplying a clear coating agent onto a surface of the color coating layer and photocuring the applied clear coating agent to form a clear layer,wherein the color coating agent comprises:10 to 35% by weight of a modified acrylic resin;1 to 25% by weight of a pigment; and40 to 80% by weight of a first solvent, andwherein the clear coating agent comprises:10 to 30% by weight of a polyester-modified acrylic resin;5 to 25% by weight of an acrylic oligomer;5 to 45% by weight of an acrylic monomer;1 to 15% by weight of a ...

Co Anode, And Co Electroplating Method Using Co Anode

Provided is a novel anode for electroplating, which replaces the Cu anode and which is capable of suppressing plating defects. The Co anode has a number of particles with a grain size of 0.5 μm or more of 6000 particles/g or less, as measured by an in-liquid particle counter according to JIS B 9925 after dissolving the Co anode in dilute nitric acid having a nitric acid concentration of 20% by mass. 1. A Co anode for electroplating , the Co anode having a number of particles with a grain size of 0.5 μm or more of 6000 particles/g or less , as measured by an in-liquid particle counter according to JIS B 9925 after dissolving the Co anode in dilute nitric acid having a nitric acid concentration of 20% by mass.2. The Co anode according to claim 1 , wherein the number of particles with a grain size of 0.5 μm or more is 5000 particles/g or less.3. The Co anode according to claim 1 , wherein the Co anode has a purity of 3N or more.4. The Co anode according to claim 3 , wherein the purity is 4N or more.5. The Co anode according to claim 3 , wherein the Co anode has a Fe concentration of 10 ppm or less.6. The Co anode according to claim 5 , wherein the Fe concentration is 5 ppm or less.7. A Co electroplating method using the Co anode according to .8. An evaluation method of Co anode for electroplating claim 1 , the method comprising the steps of:dissolving the Co anode in dilute nitric acid having a nitric acid concentration of 20% by mass,measuring an in-liquid particle in the dilute nitric acid in which the Co anode is dissolved by an in-liquid particle counter according to JIS B 9925, andjudging good or bad of the Co anode based on the measurement result by the in-liquid particle counter.9. The evaluation method of Co anode for electroplating according to claim 8 , wherein the step of judging good or bad of the Co anode based on the measurement result by the in-liquid particle counter includes:a step of evaluating if a number of particles with a grain size greater than ...

FE-NI-P ALLOY MULTI-LAYER STEEL SHEET AND MANUFACTURING METHOD THEREFOR

The present disclosure relates to an Fe—Ni—P alloy multilayered steel sheet and a method of manufacturing the same. 1. An Fe—Ni—P alloy multilayered steel sheet comprising:an Fe—Ni alloy layer including 30 wt % to 85 wt % of Ni, a remainder Fe, and other inevitable impurities, with respect to 100 wt % as a whole; andan Fe—P alloy layer including 6 wt % to 12 wt % of P, a remainder Fe, and other inevitable impurities, with respect to 100 wt % as a whole,wherein the Fe—Ni alloy layer and the Fe—P alloy layer are alternately laminated on each other several times.2. The Fe—Ni—P alloy multilayered steel sheet of claim 1 , wherein the Fe—P alloy layer has an amorphous base structure claim 1 , and includes claim 1 , with respect to the total volume 100% of microstructures of the alloy layer claim 1 , less than 5% of an FeP phase claim 1 , an FeP phase claim 1 , or a combination thereof.3. The Fe—Ni—P alloy multilayered steel sheet of claim 2 , wherein the Fe—P alloy layer includes less than 50% of crystal grains having a grain size of 10 nm or less claim 2 , with respect to the total volume 100% of microstructures of the Fe—P alloy layer.4. The Fe—Ni—P alloy multilayered steel sheet of claim 3 , wherein the Fe—Ni alloy layer has an amorphous base structure claim 3 , and includes less than 50% of crystal grains having a grain size of 10 nm or less claim 3 , with respect to the total volume 100% of microstructures of the Fe—Ni alloy layer.5. The Fe—Ni—P alloy multilayered steel sheet of claim 1 , wherein the Fe—Ni alloy layer and the Fe—P alloy layer are alternately laminated on each other one time to ten times.6. A method of manufacturing an Fe—Ni—P alloy multilayered steel sheet claim 1 , the method comprising:preparing an electroforming substrate;electrodepositing an Fe—Ni alloy layer on a surface of the electroforming substrate;electrodepositing an Fe—P alloy layer on a surface of the Fe—Ni alloy layer;laminating the two kinds of alloy layers in multiple layers by ...

Ni-PLATED STEEL SHEET AND METHOD FOR MANUFACTURING Ni-PLATED STEEL SHEET

A Ni-plated steel sheet according to an aspect of the present invention includes: a base steel sheet; an Fe—Ni diffusion alloy region disposed on the base steel sheet; and a Ni plating region disposed on the Fe—Ni diffusion alloy region, in which an average equivalent circle diameter of crystal grains made of Ni (fcc) in the Ni plating region measured in a cross section perpendicular to a rolled surface of the base steel sheet is 0.2 to 4.0 μm. 1. A Ni-plated steel sheet , comprising:a base steel sheet;an Fe—Ni diffusion alloy region disposed on the base steel sheet; anda Ni plating region disposed on the Fe—Ni diffusion alloy region,wherein an average equivalent circle diameter of crystal grains made of Ni (fcc) in the Ni plating region measured in a cross section perpendicular to a rolled surface of the base steel sheet is 0.2 to 4.0 μm.2. The Ni-plated steel sheet according to claim 1 ,wherein a value obtained by dividing the average equivalent circle diameter of the crystal grains made of the Ni (fcc) in the Ni plating region by a thickness of the Ni plating region is 0.50 to 2.00.3. The Ni-plated steel sheet according to claim 1 ,{'sup': '2', 'wherein a Ni coating weight per one surface in the Fe—Ni diffusion alloy region and the Ni plating region is 1.5 to 65 g/m.'}4. A method for manufacturing the Ni-plated steel sheet according to claim 1 , the method comprising:electrolytic Ni plating on a base steel sheet to obtain a Ni-plated steel sheet material; andannealing the Ni-plated steel sheet material,wherein the electrolytic Ni plating includes three or more on-times and off-times between the on-times,{'sup': 2', '2, 'an average current density per one surface of the base steel sheet in each of the on-times is set to 200 A/mto 3,500 A/m,'}{'sup': 2', '2, 'an amount of charge per one surface of the base steel sheet in each of the on-times is set to 800 C/mto 40,000 C/m,'}{'sup': '2', 'in each of the on-times, a current density is set to be inconstant, and a ...

ELECTROCHEMICAL CELL FOR THE ELECTROLYSIS OF LIQUID WATER OR WATER VAPOR, MANUFACTURING PROCESS AND USES

An electrochemical cell for the electrolysis of liquid water or water vapor includes a proton-conducting electrolyte () made of aluminosilicate, sandwiched between a porous metal anode () and a porous electronic conducting cathode (). Preferably, the porous metal anode () is a sintered stainless alloy at least 18% chromium. Also, a method of manufacturing such a cell includes at least:—manufacturing the proton-conducting aluminosilicate electrolyte () and deposition of said electrolyte () on the porous metal anode () by hydrothermal method, and—depositing the electronic conducting porous cathode () on the electrolyte () to form the electrochemical cell (). The electrochemical cell can be used for, amongst other compounds, the reduction of oxidized compounds, such as the oxidized compounds constituted, for example, by carbon dioxide. 1. An electrochemical cell for the electrolysis of liquid water or water vapor , comprising:a porous metal anode,{'b': '1', 'an electronic conducting porous cathode, and p a proton conducting inorganic electrolyte made of aluminosilicate, sandwiched between the porous metal anode and the electronic conducting porous cathode.'}2. The electrochemical cell according to claim 1 , wherein the porous metal anode is a sintered stainless alloy comprising at least 18% chromium.3. The electrochemical cell according to claim 2 , wherein the sintered stainless alloy comprises nickel and/or cobalt and/or iron.4. The electrochemical cell according to claim 2 , comprising a diffusion layer of metal elements constituting the porous metal anode in the aluminosilicate electrolyte resulting from complexing of oxycarbonated compounds.5. The electrochemical cell according to claim 1 , wherein the porous electronically conducting cathode is based on at least one of transition metals and metals selected from the group consisting of Groups IVB claim 1 , VB claim 1 , VIB claim 1 , VIIB claim 1 , VIIIB claim 1 , VIIIB claim 1 , IB claim 1 , and IIB claim 1 , and ...

METHOD FOR THE ELECTROPLATING OF TiAl ALLOYS

The present invention relates to a method for the coating of a surface of a TiAl alloy, in which at least one layer is electroplated on the surface of the TiAl alloy, wherein the surface of the TiAl alloy is subjected to an at least two-step surface treatment for the formation of a roughened surface, this treatment comprising at least one electrochemical processing and at least one electroless chemical processing. 1. A method for the coating of a surface of a TiAl alloy , in which at least one layer is electroplated on the surface of the TiAl alloy , wherein the surface of the TiAl alloy is subjected to an at least two-step surface treatment for the formation of a roughened surface , in which at least one electrochemical processing and at least one elecroless chemical processing are conducted.2. The method according to claim 1 , wherein in the two-step surface treatment claim 1 , the electrochemical processing occurs in a first step and the electroless chemical treatment occurs in a second step.3. The method according to claim 1 , wherein the electrochemical processing is conducted by anodic etching in an acetic acid-hydrofluoric acid solution claim 1 , wherein concentrations by weight of 800 to 900 g/L of acetic acid and 100 to 200 g/L of hydrofluoric acid are selected for the composition of the acetic acid-hydrofluoric acid solution.4. The method according to claim 1 , wherein the electroless chemical processing is produced by etching in a fluoroboric acid-sodium tetrafluoroborate solution.5. The method according to claim 1 , wherein claim 1 , between the electrochemical processing and the electroless chemical processing and/or prior to the electrochemical processing claim 1 , a cleaning step is carried out with compressed air and/or a water jet and followed by a drying step.6. The method according to claim 1 , wherein claim 1 , prior to the two-step surface treatment claim 1 , a chemical etching of the surface of the TiAl alloy is conducted with a nitric acid ...

APPARATUS AND METHOD OF CONTACT ELECTROPLATING OF ISOLATED STRUCTURES

The presently disclosed apparatus and method offer the capability to electroplate pure metals or alloys onto substrates, having no current collectors or being connected to the power supply by a low conductivity seed layer. Thus, the disclosed system enables pure metal or alloy deposition on various substrates, including flexible electronic circuits, wafers for IC processing, and discrete electronic devices in surface finishing applications. 1. An apparatus for electroplating a metal onto a substrate comprising an isolated seed pattern or a substrate comprising a seed pattern connected to a resistance current collector with conductivity of less than 1e+5 ohm-cm , said apparatus comprising:a. a working electrode comprising fine metal mesh, metal fiber cloth, or metal web, wherein the working electrode is configured to directly contact the seed pattern of the substrate; i. fine metal mesh, metal fiber cloth, or metal web; or', 'ii. metal mesh; and, 'b. a counter electrode comprising either wherein current collectors link both electrodes to the respective polarity of a power supply, and', 'wherein the working electrode is free from electrically conductive bristles., 'c. a chemically inert porous material;'}2. The apparatus of claim 1 , wherein the working electrode and counter electrode are constructed from:(a) gold, silver, copper, nickel, palladium, platinum, titanium, stainless steel, cobalt, thallium, tantalum, rhodium, iridium, ruthenium, osmium or alloys of gold, alloys of silver, alloys of copper, tungsten, vanadium, alloys of nickel, alloys of palladium, alloys of platinum, platinized titanium, platinum clad niobium or tantalum, gold plated stainless steel, copper, nickel, or combinations thereof; or(b) chemically inert polymer textile material combined with one or more materials selected from (a).3. The apparatus of claim 1 , wherein the chemically inert porous material is selected from the group comprising porous polymer sponge claim 1 , pile cloth material ...

Manufacturing Method of Nickel Plated Steel Sheet and Nickel Plated Steel Sheet Prepared Therefrom

The present invention provides a nickel-plated and thermally-treated steel sheet with excellent corrosion resistance, in which a remaining nickel amount obtained by analyzing an nickel-iron alloy layer using energy dispersive spectrometry (EDS) or electron probe X-ray microanalysis (EPMA) after pure nickel remaining on the nickel-iron alloy layer was completely removed after the heat treatment for alloying of a nickel plated layer with base iron is 0.1 wt % or more to less than 30 wt % of the total amount of iron and nickel.

JOINING METHOD AND JOINING SYSTEM

A joining method for joining a first member and a second member is provided. The joining method includes a step of providing a first brazing layer on the first member by plating, a step of providing a second brazing layer on the first brazing layer by plating, a step of arranging the first member and the second member to oppose each other across the first brazing layer and the second brazing layer, and a step of melting the first brazing layer and the second brazing layer to join the first member and the second member which are arranged to oppose each other. 1. A joining method for joining a first member and a second member comprising:providing a joining layer on the first member;arranging the first member and the second member to oppose each other across the joining layer; andmelting the joining layer to join the first member and the second member which are arranged to oppose each other,wherein the providing a joining layer on the first member comprises:providing a first brazing layer on the first member by plating; andproviding a second brazing layer on the first brazing layer by plating,wherein a first material constituting the first brazing layer is a material different from a second material constituting the second brazing layer.2. The joining method according to claim 1 , wherein the providing a joining layer on the first member further comprises:providing a third brazing layer on the second brazing layer by plating,wherein a third material constituting the third brazing layer is a material different from the second material constituting the second brazing layer.3. The joining method according to claim 2 , wherein the first material constituting the first brazing layer is the same material as the third material constituting the third brazing layer.4. The joining method according to claim 2 , wherein the first material constituting the first brazing layer is different from the third material constituting the third brazing layer.5. The joining method according ...

Method for Producing a Profile and a Manufacturing System for Producing a Profile

A method for producing a profile includes method steps of: providing a workpiece; shaping the workpiece; joining the workpiece; coating the workpiece; heating the workpiece; and at least partially hardening the workpiece; wherein the coating method step is carried out temporally after the joining method step and temporally before the heating method step. 1. A method for producing a profile , comprising the following method steps:providing a workpiece,shaping the workpiece,joining the workpiece,coating the workpiece,heating the workpiece,at least partially hardening the workpiece,wherein the coating method step is carried out temporally after the joining method step and temporally before the heating method step.2. The method according to claim 1 , wherein claim 1 , in the joining method step claim 1 , the shaped workpiece is welded.3. The method according to claim 1 , wherein claim 1 , in the shaping method step claim 1 , a slit is formed in the shaped workpiece by deformation.4. The method according to claim 1 , wherein the coated workpiece is hardened in a shaping manner in a hardening tool.5. The method according to claim 1 , wherein claim 1 , in the coating method step claim 1 , the joined workpiece is coated with a hot-dip coating process.6. The method according to claim 1 , wherein claim 1 , in the coating method step claim 1 , the joined workpiece is coated with an electrolytic coating process.7. The method according to claim 1 , wherein claim 1 , in the coating method step claim 1 , the joined workpiece is coated with an anti-scale layer in a painting process.8. The method according to claim 1 , further comprising cleaning the workpiece before the coating method step.9. The method according to claim 1 , wherein claim 1 , in the heating method step claim 1 , the coated workpiece is heated to a hardening temperature.10. The method according to claim 1 , wherein claim 1 , in the hardening method step claim 1 , the coated workpiece is transferred into a hardening ...

FILM-FORMING METAL SOUTION AND METAL FILM-FORMING METHOD

A film-forming metal solution for supplying metal ions to a solid electrolyte membrane in film formation is provided. In the film formation, the solid electrolyte membrane is disposed between an anode and a substrate as a cathode, and the solid electrolyte membrane is brought into contact with the substrate and a voltage is placed between the anode and the substrate to precipitate a metal on a surface of the substrate from the metal ions contained in the solid electrolyte membrane, so that a metal film of the metal is formed on the surface of the substrate. The film-forming metal solution contains a solvent, and the metal dissolved in the solvent in an ionic state. A hydrogen ion concentration of the film-forming metal solution is within a range of 0 to 10mol/L at 25° C. 1. A film-forming metal solution for supplying metal ions to a solid electrolyte membrane in film formation in which the solid electrolyte membrane is disposed between an anode and a substrate as a cathode , and the solid electrolyte membrane is brought into contact with the substrate and a voltage is placed between the anode and the substrate to precipitate a metal on a surface of the substrate from the metal ions contained in the solid electrolyte membrane to form a metal film of the metal on the surface of the substrate ,the film-forming metal solution comprising:a solvent; andthe metal dissolved in the solvent in an ionic state,{'sup': '−7.85', 'wherein a hydrogen ion concentration of the film-forming metal solution is within a range of 0 to 10mol/L at 25° C.'}2. The film-forming metal solution according to claim 1 , wherein the solvent is an alcoholic solvent containing at least one selected from methanol claim 1 , ethanol and propanol claim 1 , or a solvent containing the alcoholic solvent and water.3. The film-forming metal solution according to claim 1 , wherein the metal has a higher ionization tendency than an ionization tendency of hydrogen.4. The film-forming metal solution according to ...

COMPLEX PLATING FILM FORMED USING MULTI-LAYER GRAPHENE-COATED METAL PARTICLES THROUGH ELECTRIC EXPLOSION AND METHOD OF MANUFACTURING THE COMPLEX PLATING FILM

Provided is a method of forming a complex plating film using multi-layer graphene metal particles. The method of forming the plating film may include preparing a powder with a metal particle structure coated with multi-layer graphene, and forming a plating film by adding the powder to a plating solution through electric plating. 1. A method of forming a complex plating film , the method comprising the steps of:adding a multi-layer graphene-coated metal powder to a plating solution; andforming a plating film by performing electric plating in a plating solution to which the metal powder is added.2. The method of claim 1 , wherein the multi-layer graphene-coated metal powder is prepared through electric explosion.3. The method of claim 2 , wherein the preparation of the multi-layer graphene-coated metal powder includes the steps of:coating a metal wire with a carbon-based material; andperforming electric explosion of the carbon-based-material-coated metal wire in a solution or in the air,wherein the carbon-based material includes graphene or graphite.4. The method of claim 3 , wherein the metal wire consists of copper claim 3 , nickel claim 3 , aluminum claim 3 , iron claim 3 , gold claim 3 , silver or a mixture thereof.5. The method of claim 3 , wherein the metal powder is prepared by coating multi-layer graphene including 1 to 20 carbon atom layers through the electric explosion.6. The method of claim 3 , wherein the coating of the metal wire with the carbon-based material includes the steps of:synthesizing the graphene on a surface of the metal wire; andtransferring the synthesized graphene onto the surface of the metal wire.7. The method of claim 3 , wherein the metal powder coated with the multi-layer graphene is prepared by performing electric explosion of the metal wire in a solution claim 3 , and the solution includes at least one selected from the group consisting of isopropyl alcohol claim 3 , acetone claim 3 , ethanol claim 3 , methanol claim 3 , carbon ...

MEMBRANE TEMPLATE SYNTHESIS OF MICROTUBE ENGINES

Methods, structures, devices and systems are disclosed for fabrication of microtube engines using membrane template electrodeposition. Such nanomotors operate based on bubble-induced propulsion in biological fluids and salt-rich environments. In one aspect, fabricating microengines includes depositing a polymer layer on a membrane template, depositing a conductive metal layer on the polymer layer, and dissolving the membrane template to release the multilayer microtubes. 126-. (canceled)27. A microstructure , comprising:a microtube having a large opening and a short opening at opposite ends of the microtube and a tube body connecting the large opening and the short opening and a spatially reducing size along a longitudinal direction from the large opening to the small opening;the microtube further including a layered wall structure defining the tube body, the layered wall structure having at least two layers, a first layer that is an external layer formed of a material capable of being functionalized, and a second layer that is an inner layer.28. The microstructure of claim 27 , wherein the first layer comprises a polymer material.29. The microstructure of claim 28 , wherein the polymer material comprises polyaniline (PANT) or polypyrrole (PPy) or poly(3 claim 28 ,4-ethylenedioxythiophene) (PEDOT).30. The microstructure of claim 27 , wherein the second layer comprises a material that is reactive with a fuel or is a catalyst of a fuel.31. The microstructure of claim 30 , wherein the material that is reactive with a fuel or is a catalyst of a fuel comprises a conductive metal.32. The microstructure of claim 30 , wherein the material that is a catalyst of a fuel comprises platinum.33. The microstructure of claim 27 , wherein the template comprises cyclopore polycarbonated membrane.34. The microstructure of claim 33 , wherein the cyclopore polycarbonated membrane comprises an asymmetrical claim 33 , conically-shaped pore structure.35. The microstructure of claim 34 , ...

METHODS AND APPARATUS FOR WETTING PRETREATMENT FOR THROUGH RESIST METAL PLATING

Disclosed are pre-wetting apparatus designs and methods. In some embodiments, a pre-wetting apparatus includes a degasser, a process chamber, and a controller. The process chamber includes a wafer holder configured to hold a wafer substrate, a vacuum port configured to allow formation of a subatmospheric pressure in the process chamber, and a fluid inlet coupled to the degasser and configured to deliver a degassed pre-wetting fluid onto the wafer substrate at a velocity of at least about 7 meters per second whereby particles on the wafer substrate are dislodged and at a flow rate whereby dislodged particles are removed from the wafer substrate. The controller includes program instructions for forming a wetting layer on the wafer substrate in the process chamber by contacting the wafer substrate with the degassed pre-wetting fluid admitted through the fluid inlet at a flow rate of at least about 0.4 liters per minute. 1. A method comprising:(a) providing a wafer substrate having an exposed metal layer on at least a portion of a surface of the wafer substrate to a process chamber, wherein the process chamber comprises a liquid inlet, the liquid inlet including at least one nozzle configured to deliver a pre-wetting liquid onto the wafer substrate;(b) reducing pressure in the process chamber to a subatmospheric pressure using a vacuum port in the process chamber;(c) degassing the pre-wetting liquid to remove one or more dissolved gasses from the pre-wetting liquid using a degasser coupled to the liquid inlet;and(d) contacting the wafer substrate with the degassed pre-wetting liquid at the subatmospheric pressure in the process chamber and thereby forming a wetting layer on the wafer substrate, held by a wafer holder in the process chamber, wherein the degassed pre-wetting liquid is delivered from the one or more nozzles onto the wafer substrate at a velocity of at least about 7 meters per second and is admitted through the liquid inlet to the process chamber at a flow ...

METHOD FOR REALIZING MACROSCOPIC SUPER-LUBRICATION BY A MATCHING PAIR OF NANO METAL-COATED STEEL BALLS AND HYDROGEN-CONTAINING CARBON FILMS

The present disclosure discloses a method for realizing macroscopic super-lubrication by a matching pair of nano metal-coated steel balls and hydrogen-containing carbon films, which is based on the use of nano metal-coated steel balls and diamond-like films with a hydrogen content of 25-30% as the matching pair. Further, a tribochemical reaction occurs through the catalytic action of nano metal during the friction process to form a nano graphene transfer film with incommensurate contact at the contact interface to achieve macroscopic super-lubrication. 1. A method for realizing macroscopic super-lubrication by a matching pair of nano metal-coated steel balls and hydrogen-containing carbon films , wherein nano metal-coated steel balls and diamond-like films with a hydrogen content of 24-30% are used as the matching pair , and a tribochemical reaction occurs through the catalytic action of nano metal during the friction process to form a nano graphene transfer film with incommensurate contact at the contact interface to achieve macroscopic super-lubrication.2. The method for realizing macroscopic super-lubrication by a matching pair of nano metal-coated steel balls and hydrogen-containing carbon films according to claim 1 , wherein the substrate of the nano metal-coated steel ball is GCr15 bearing steel or steel ball of 440c stainless steel.3. The method for realizing macroscopic super-lubrication by a matching pair of nano metal-coated steel balls and hydrogen-containing carbon films according to claim 1 , wherein the nano metal coating of the nano metal-coated steel ball is a nano gold coating claim 1 , a nano platinum coating claim 1 , or a nano cobalt coating claim 1 , and the thickness of the nano metal coating is 600 to 800 nm.4. The method for realizing macroscopic super-lubrication by a matching pair of nano metal-coated steel balls and hydrogen-containing carbon films according to claim 1 , wherein the nano metal coating forms a nano metal film on the surface ...

Electroplated component of a rolling element bearing

A bearing component of a rolling element bearing, such as a rolling element, a bearing ring, and/or a cage for retaining rolling elements of a rolling element bearing. An outer surface of the bearing component is provided with a plating layer providing at least 97 wt. % tin. According to the invention, tin of the plating layer provides alpha and beta phases of tin in an alpha/beta phase ratio of less than 10%.

NICKEL-PLATED, HEAT-TREATED STEEL SHEET FOR BATTERY CANS

The present invention provides a nickel-plated heat-treated steel sheet for a battery can (), having a nickel layer with a nickel amount of 4.4 to 26.7 g/mon a steel sheet (), wherein when the Fe intensity and the Ni intensity are continuously measured along the depth direction from the surface of the nickel-plated heat-treated steel sheet for a battery can, by using a high frequency glow discharge optical emission spectrometric analyzer, the difference (D2-D1) between the depth (D1) at which the Fe intensity exhibits a first predetermined value and the depth (D2) at which the Ni intensity exhibits a second predetermined value is less than 0.04 μm. 1. A nickel-plated heat-treated steel sheet for a battery can , comprising:{'sup': '2', 'a nickel layer constituting an outermost layer with a nickel amount of 4.4 to 26.7 g/mon a first surface of a steel sheet to be an inner surface of the battery can, and'}a nickel layer constituting an outermost layer on a second surface of the steel sheet to be an outer surface of the battery can,wherein when the Fe intensity and the Ni intensity are continuously measured along the depth direction from the first surface of the nickel-plated heat-treated steel sheet for a battery can, by using a high frequency glow discharge optical emission spectrometric analyzer, the difference (D2-D1) between the depth (D1) at which the Fe intensity exhibits a first predetermined value and the depth (D2) at which the Ni intensity exhibits a second predetermined value is less than 0.04 μm,wherein the depth (D1) exhibiting the first predetermined value is the depth exhibiting an intensity of 10% of the saturated value of the Fe intensity measured by the above-described measurement, andthe depth (D2) exhibiting the second predetermined value is the depth exhibiting an intensity of 10% of the maximum value when the measurement is further performed along the depth direction after the Ni intensity shows the maximum value by the above-described measurement ...

ELECTROPLATING ADDITIVE AND PREPARATION METHOD FOR THE SAME

The present invention provides a carboxyl sulfonate compound and preparation method thereof. The present carboxyl sulfonate compound has structure of formula (A): 3. The carboxyl sulfonate compound of claim 1 , wherein said alkali metal is lithium claim 1 , sodium claim 1 , or potassium.4. The carboxyl sulfonate compound of claim 1 , wherein said alkyl is C-Calkyl.5. The carboxyl sulfonate compound of claim 2 , wherein at least one of Mand Mis an alkali metal.6. The carboxyl sulfonate compound of claim 2 , wherein Mis an alkali metal claim 2 , Mand Mare both hydrogen claim 2 , n is 3 claim 2 , and m is 1.7. The carboxyl sulfonate compound of claim 2 , wherein Mis an alkali metal claim 2 , Mand Mare both alkyl claim 2 , n is 3 claim 2 , and m is 1.8. The carboxyl sulfonate compound of claim 2 , wherein Mis an alkali metal claim 2 , one of Mand Mis alkyl and the other one is an alkali metal claim 2 , n is 3 claim 2 , and m is 1.10. The carboxyl sulfonate compound of claim 9 , wherein Mis an alkali metal claim 9 , Mis hydrogen claim 9 , n is 3 claim 9 , Yis hydrogen claim 9 , Yis hydrogen or alkyl.11. The carboxyl sulfonate compound of claim 9 , being used as a glazing agent for electroplating.12. An electroplating additive claim 9 , comprising:{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'the carboxyl sulfonate compound of ; and'}a solvent;wherein a weight percent of said carboxyl sulfonate compound is 0.01 to 50weight percent of said electroplating additive based on a total weight thereof at a temperature of 27±3° C.13. The electroplating additive of claim 12 , wherein said solvent is water.14. The electroplating additive of claim 12 , wherein said electroplating is lead-free plating claim 12 , copper plating claim 12 , tin plating claim 12 , nickel plating claim 12 , or a combination thereof. Technical FieldThe present invention is related to an electroplating additive, especially to an additive for electroplating processes such as lead-free plating, copper ...

ANTIMICROBIAL CHROMIUM ELECTROPLATING

A bioactive coated substrate includes a base substrate, a bioactive metal-containing layer disposed over the base substrate, and an electroplated chromium layer disposed on the bioactive metal-containing layer. The electroplated chromium layer defines a plurality of cracks or pores that expose the bioactive metal-containing layer. 1. A bioactive coated substrate comprising:a base substrate;a bioactive metal-containing layer disposed over the base substrate; andan electroplated chromium layer disposed on the bioactive metal-containing layer, the electroplated chromium layer defining a plurality of cracks or pores that expose the bioactive metal-containing layer.2. The bioactive coated substrate of claim 1 , wherein the bioactive metal-containing layer is a bioactive copper-containing layer.3. The bioactive coated substrate of claim 2 , wherein the bioactive copper-containing layer includes a component selected from the group consisting of copper metal claim 2 , copper alloy claim 2 , copper oxide claim 2 , and combinations thereof.4. The bioactive coated substrate of claim 1 , wherein the bioactive metal-containing layer is a bioactive silver layer.5. The bioactive coated substrate of claim 1 , wherein the plurality of cracks or pores has a width of about 50 nm to 500 nm.6. The bioactive coated substrate of claim 5 , wherein the plurality of cracks or pores extends a distance from about 100 nm to 1 micron in an orthogonal direction to the width.7. The bioactive coated substrate of claim 1 , wherein the bioactive metal-containing layer has a thickness from about 50 to 1500 nm and the electroplated chromium layer has a thickness from about 50 to 1500 nm.8. The bioactive coated substrate of further comprising a base layer interposed between the base substrate and the bioactive metal-containing layer.9. The bioactive coated substrate of claim 8 , wherein the base layer has a thickness from about 1000 to 35000 nm.10. The bioactive coated substrate of claim 8 , wherein the ...

Metal-Plated Music String

A music string for a fretted instrument with extended life of initial tonal characteristics has a central core wire having a wrapped wire wound around it. The wrapped wire is coated with a metal or metal alloy. The metal coating may be nickel or tin or alloys of nickel or tin. The coating may be applied on the wrapped wire by a process of electroplating. 1. A musical instrument string comprisinga core wire; anda winding wire wrapped around the core wire,wherein the winding wire comprises a central strand of metal alloy and a coating adhered to the central strand, the coating comprising at least one material selected from the group consisting of nickel, nickel alloy, tin, and tin alloy.2. The music string of claim 1 , wherein the metal alloy is a copper alloy.3. The music string of claim 1 , wherein the coating constitutes approximately 1-10% by weight of the winding wire.4. The music string of claim 1 , wherein the coating constitutes approximately 2-8% by weight of the winding wire.5. The music string of claim 1 , wherein the coating comprises nickel or tin.6. The music string of claim 3 , wherein the core wire is a tempered steel alloy.7. The music string of claim 1 , wherein the coating is electroplated nickel that constitutes approximately 2-8% by weight of the winding wire.8. The music string of claim 7 , wherein the electroplated nickel coating constitutes approximately 3-5% by weight of the winding wire.9. The music string of claim 1 , wherein the central strand of the winding wire is selected from the group consisting of copper claim 1 , copper alloys and steel.10. The music string of claim 9 , wherein the coating is nickel or alloy thereof.11. The music string of claim 1 , wherein the winding on the wound string is a nickel coated copper alloy wire.12. The music string of claim 11 , wherein the nickel coating constitutes approximately 3-5% by weight of the winding wire.13. The music string of claim 1 , wherein the winding on the wound string is a nickel ...

STAINLESS-STEEL FOIL FOR SEPARATOR OF POLYMER ELECTROLYTE FUEL CELL

The surface of a substrate made of stainless-steel foil is coated with a Sn alloy layer, with a strike layer in between. The coating ratio of the strike layer on the substrate is 2% to 70%. 1. A stainless-steel foil for a separator of a polymer electrolyte fuel cell , comprising:a substrate made of stainless-steel foil; anda Sn alloy layer with which a surface of the substrate is coated, with a strike layer in between,wherein a coating ratio of the strike layer on the substrate is 2% to 70%.2. The stainless-steel foil for a separator of a polymer electrolyte fuel cell according to claim 1 ,wherein the strike layer is distributed in a form of islands, and a maximum diameter of each of the islands as coating portions is 1 μm or less.3. The stainless-steel foil for a separator of a polymer electrolyte fuel cell according to claim 1 ,wherein the Sn alloy layer contains at least one selected from the group consisting of Ni and Fe.4. The stainless-steel foil for a separator of a polymer electrolyte fuel cell according to claim 1 ,{'sub': 3', '2, 'wherein the Sn alloy layer contains NiSn.'}5. The stainless-steel foil for a separator of a polymer electrolyte fuel cell according to claim 1 ,wherein the strike layer contains at least one element selected from the group consisting of Ni, Cu, Ag, and Au.6. The stainless-steel foil for a separator of a polymer electrolyte fuel cell according to claim 5 ,wherein the strike layer is made of an alloy layer of Ni and P, and has a P content in a range of 5% to 22% by mass.7. The stainless-steel foil for a separator of a polymer electrolyte fuel cell according to claim 1 , comprisinga Sn-containing oxide layer on a surface of the Sn alloy layer.8. The stainless-steel foil for a separator of a polymer electrolyte fuel cell according to claim 4 ,wherein the strike layer is made of an alloy layer of Ni and P, and has a P content in a range of 5% to 22% by mass.9. The stainless-steel foil for a separator of a polymer electrolyte fuel cell ...

Ni DIFFUSION-PLATED STEEL SHEET AND METHOD FOR MANUFACTURING Ni DIFFUSION-PLATED STEEL SHEET

A Ni diffusion-plated steel sheet of the present invention includes a base steel sheet and a Fe—Ni diffusion alloy-plating layer positioned on at least one surface of the base steel sheet, an Ni coating weight of the Fe—Ni diffusion alloy-plating layer is 9.0 to 20 g/m, a Fe concentration Cs of an outermost layer of the Fe—Ni diffusion alloy-plating layer is 10 to 55 mass %, the base steel sheet has a predetermined chemical composition, and a ferrite grain size number specified by JIS G 0551 (2013) of the base steel sheet is 11.0 or more. 1. A Ni diffusion-plated steel sheet , comprising:a base steel sheet; anda Fe—Ni diffusion alloy-plating layer positioned on at least a single surface of the base steel sheet,{'sup': '2', 'wherein a Ni coating weight of the Fe—Ni diffusion alloy-plating layer is 9.0 to 20 g/m,'}a Fe concentration Cs of an outermost layer of the Fe—Ni diffusion alloy-plating layer is 10 to 55 mass %,a chemical composition of the base steel sheet contains, by mass %:C: 0.005% to 0.250%;Si: limited to 0.1% or less;Mn: 0.05% to 0.90%;P: limited to 0.025% or less;S: limited to 0.025% or less;sol. Al: 0.005% to 0.100%;N: limited to 0.0070% or less;B: 0% to 0.0050%; anda remainder consisting of Fe and impurities, anda ferrite grain size number specified by JIS G 0551 (2013) of the base steel sheet is 11.0 or more.2. The Ni diffusion-plated steel sheet according to claim 1 ,wherein the Fe concentration Cs of the outermost layer of the Fe—Ni diffusion alloy-plating layer is 15 to 40 mass %.3. The Ni diffusion-plated steel sheet according to claim 1 ,wherein the Ni diffusion-plated steel sheet is used as a material for a container, and,the Fe—Ni diffusion alloy-plating layer is provided on a side of the base steel sheet, the side to become an outer surface of the container by press forming.4. A method for manufacturing a Ni diffusion-plated steel sheet claim 1 , comprising:{'sup': '2', 'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'carrying out a Ni ...

APPARATUSES AND METHODS FOR MAINTAINING PH IN NICKEL ELECTROPLATING BATHS

Disclosed herein are electroplating systems for electroplating nickel onto a semiconductor substrate having an electroplating cell for holding an electrolyte solution during electroplating which includes a cathode chamber and an anode chamber configured to hold a nickel anode, and having an oxygen removal device arranged to reduce oxygen concentration in the electrolyte solution as it is flowed to the anode chamber during electroplating and during idle times when the system is not electroplating. Also disclosed herein are methods of electroplating nickel onto a substrate in an electroplating cell having anode and cathode chambers, which include reducing the oxygen concentration in an electrolyte solution, flowing the electrolyte solution into the anode chamber and contacting a nickel anode therein, and electroplating nickel from the electrolyte solution onto a substrate in the cathode chamber, wherein the electrolyte solution in the cathode chamber is maintained at a pH of between about 3.5 and 4.5. 1. An electroplating system for electroplating nickel onto a semiconductor substrate comprising: a cathode chamber;', 'an anode chamber configured to hold a nickel anode during electroplating;', 'a porous separator between the anode chamber and the cathode chamber permitting passage of ionic current during electroplating, but inhibiting the passage of electrolyte solution; and', 'a wafer holder for holding the wafer during electroplating; and, 'an electroplating cell configured to hold an electrolyte solution during electroplating, the electroplating cell comprisingan oxygen removal device arranged to reduce oxygen concentration in the electrolyte solution as it is flowed to the anode chamber during electroplating and during idle times when the system is not electroplating.2. The electroplating system of claim 1 , wherein the porous separator is capable of maintaining a difference in oxygen concentration between the anode and cathode chambers.3. The electroplating system ...

NICKEL DIRECT-PLATING

A method of depositing nickel on a surface of an object, the method including the steps of providing a source of direct current having a positive and a negative terminal; connecting the object to the negative terminal; connecting an anode to the positive terminal; and submerging the object and anode in a solution comprising nickel. The anode is positioned at a distance equal to or less than 2 mm from the surface of the object and when the source of direct current is switched on, nickel in the solution comprising nickel is deposited on the surface of the object. 1. A method of depositing nickel on a surface of an object , the method including:providing a source of direct current having a positive and a negative terminal;connecting the object to the negative terminal;connecting an anode to the positive terminal; andsubmerging the object and anode in a solution comprising the nickel;wherein the anode is positioned at a distance equal to or less than 2 mm from the surface of the object, andwherein when the source of direct current is switched on, the nickel in the solution comprising the nickel is deposited on the surface of the object.2. A method according to claim 1 , wherein the nickel is directly deposited on the surface of the object.3. A method according to claim 1 , wherein the surface of the object is coated in an oxide layer claim 1 , the method including removing the oxide layer before the nickel in the solution comprising the nickel is deposited on the surface of the object.4. A method according to claim 1 , wherein the surface of the object is coated in an oxide layer claim 1 , the method including thickening the oxide layer before the nickel in the solution comprising the nickel is deposited on the surface of the object.5. A method according to claim 1 , wherein the object comprises at least one of aluminium claim 1 , titanium claim 1 , stainless steel and molybdenum.6. A method according to claim 1 , wherein a shape of the object and a shape of the anode ...

Chemically Amplified Positive Resist Composition and Pattern Forming Process

A chemically amplified positive resist composition is provided comprising (A) a polymer adapted to tarn soluble in alkaline aqueous solution under the action, of acid, (B) a photoacid generator, (C) a car boxy lie acid, and (D) a benzotriazole compound and/or an imidazole compound. When the resist composition is coated on a copper substrate as a thick film of 5-250 μm thick and lithographically processed into a pattern, a high resolution is available and the pattern is of rectangular profile. 2. The resist composition of wherein the carboxylic acid is at least one C-Ccarboxylic acid selected from the group consisting of a saturated or unsaturated aliphatic carboxylic acid claim 1 , alicyclic carboxylic acid claim 1 , oxy carboxylic acid claim 1 , alkoxy carboxylic acid claim 1 , keto carboxylic acid claim 1 , and aromatic carboxylic acid.3. The resist composition of wherein the carboxylic acid is a dicarboxylic acid.4. The resist composition of wherein the dicarboxylic acid is a dicarboxylic acid having a saturated aliphatic alkyl chain.6. The resist composition of claim 1 , further comprising (E) an organic solvent.7. A dry film comprising a support film and a layer formed thereon from the chemically amplified positive resist composition of .8. A pattern forming process comprising the steps of forming a coating of the chemically amplified positive resist composition of or the layer of the chemically amplified positive resist composition of on a substrate claim 1 , optionally prebaking claim 1 , exposing the coating or layer to radiation or electron beam through a photomask claim 1 , optionally baking claim 1 , and developing in a developer.9. The process of wherein the step of exposing the coating or layer to radiation uses radiation with a wavelength of longer than 300 nm.10. The process of claim 8 , further comprising the step of forming a metal plating on the substrate by electroplating or electroless plating claim 8 , subsequent to the developing step. This non ...

APPARATUS FOR A RESONANCE CIRCUIT

Disclosed is a method and apparatus for use with an RLC resonance circuit for inductive heating of a susceptor of an aerosol generating device. The apparatus is arranged to determine a resonant frequency of the RLC resonance circuit; and determine, based on the determined resonant frequency, a first frequency for the RLC resonance circuit for causing the susceptor to be inductively heated, the first frequency being above or below the determined resonant frequency. The apparatus may be arranged to control a drive frequency of the RLC resonance circuit to be at the determined first frequency in order to heat the susceptor. Also disclosed is an aerosol generating device including the apparatus. 1. An apparatus for use with an RLC resonance circuit for inductive heating of a susceptor of an aerosol generating device , the apparatus comprising: determine a resonant frequency of the RLC resonance circuit; and', 'determine, based on the determined resonant frequency, a first frequency for the RLC resonance circuit for causing the susceptor to be inductively heated, the first frequency being above or below the determined resonant frequency., 'a controller arranged to2. The apparatus according to claim 1 , wherein the first frequency is for causing the susceptor to be inductively heated to a first degree at a given supply voltage claim 1 , the first degree being less than a second degree claim 1 , the second degree being a degree to which the susceptor is caused to be inductively heated claim 1 , at the given supply voltage claim 1 , when the RLC circuit is driven at the resonant frequency.3. The apparatus according to claim 1 , wherein the controller is further arranged to:control a drive frequency of the RLC resonance circuit to be at the determined first frequency in order to heat the susceptor.4. The apparatus according to claim 3 , wherein the controller is further arranged to control the drive frequency to be held at the first frequency for a first period of time.5. ...

STRIP-TYPE SUBSTRATE FOR PRODUCING CHIP CARD MODULES

A strip-type substrate includes a foil having a number of substrate units for producing chip card modules. The substrate has an inner face for at least partial direct or indirect contacting of a semiconductor chip and an outer face lying opposite the inner face. The foil includes of steel, in particular high-grade steel, and a first layer of nickel or a nickel alloy on at least some sections of the outer face. 1. A strip-type substrate comprising:a foil comprising a plurality of substrate units, each substrate unit for producing a chip card module;an inner side for direct or indirect contact with a semiconductor chip at least in sections;an outer side formed opposite the inner side; anda first layer formed on the outer side, the first layer comprising, at least in sections, nickel or a nickel alloy;wherein the foil is formed from steel or high-grade steel.2. The substrate as claimed in claim 1 , further comprising a second layer formed on the inner side claim 1 , the second layer comprising claim 1 , at least in sections claim 1 , nickel or the nickel alloy.3. The substrate as claimed in claim 1 , wherein the nickel alloy is a nickel-palladium alloy (NiPd) having a palladium proportion selected from the group of 0.1-30.0% claim 1 , 5.0-25.0% claim 1 , or 10.0-20.0%.4. The substrate as claimed in claim 2 , wherein the first layer or the second layer has a layer thickness selected from the group of 0.1-5.0 μm claim 2 , 0.5-3.0 μm claim 2 , or 1.0-2.0 μm.5. The substrate as claimed in claim 2 ,further comprising a third layer formed, at least in sections, on the second layer;wherein the third layer comprises silver or a silver alloy.6. The substrate as claimed in claim 5 , wherein the third layer has a layer thickness selected from the group of 0.1-5.0 μm claim 5 , 0.5-3.0 μm claim 5 , or 1.0-2.0 μm.7. A chip card module comprising: a foil comprising a plurality of substrate units, each substrate unit for producing a chip card module;', 'an inner side for direct or ...

Transparent electrode, method for manufacturing same, and organic electroluminescent element

The present invention addresses the problem of providing a transparent electrode having a low resistance and high storage stability, a method for manufacturing the transparent electrode, and an organic electroluminescent element. This transparent electrode wherein a metal conductive layer is provided on a substrate is characterized in that: the metal conductive layer has a metal fine line, and a plating layer covering the metal fine line; the transparent electrode has a transparent conductive layer on a substrate surface on the side on which the metal fine line is formed, said transparent conductive layer covering the substrate and the metal conductive layer; and the metal fine line is formed using a metal nano-particle ink or a metal complex ink.

Method of making sound interface in overcast bimetal components

A method of forming a bi-metallic casting. The method includes providing a metal preform of a desired base shape defining a substrate surface and removing a natural oxide layer and surface contamination from the substrate surface to yield a cleaned metal preform. The method further includes galvanizing the cleaned metal preform, yielding a galvanized metal preform followed by electroplating a thin nickel film on at least a portion of the substrate surface of the galvanized metal preform. Additionally, the method includes metallurgically bonding the portion of the metal preform having the nickel film with an overcast metal to form a bi-metallic casting. The nickel film promotes a metallurgical bond between the metal preform and the overcast metal.

Method and apparatus for continuous electrochemical production of three-dimensional structures

The invention provides a device and a method for manufacturing 3D metal structures by a sequence of electroplating steps, each step adding a cross-section layer of the 3D structure via anodes, selected from a planar 2D anode grid array and forming a pattern template, creating a deposition image on a cathode plate.

WEAR RESISTANT COATING, METHOD OF MANUFACTURE THEREOF AND ARTICLES COMPRISING THE SAME

An abrasive coating for a substrate comprises a strike layer is formed on a substrate top surface; a base layer is coupled to the strike layer; a tack layer is coupled to the base layer, wherein the tack layer is configured to adhere first grit particles to the base layer; a plurality of first grit particles are adapted to be coupled to the tack layer, a plurality of second grit particles are placed between each of the plurality of first grit particles, the second grit particles having a nominal size smaller than the first grit particles; and an overplate layer comprising a matrix material is bonded to the tack layer; the matrix material envelops the second grit particles and bonds and partially surrounds the first grit particles, wherein the first grit particles extend above the overplate layer. 1. An abrasive coating for a substrate , comprising:a top surface formed on said substrate;a strike layer formed on said top surface;a base layer coupled to said strike layer;a tack layer coupled to said base layer;a plurality of first grit particles coupled to said tack layer, wherein said plurality of first grit particles are spaced apart to form channels;a plurality of second grit particles ranging in size from 0.0005 to about 0.002 mm placed between each of said plurality of first grit particles, said second grit particles having a nominal size smaller than said first grit particles; andan overplate layer comprising a matrix material coupled to said tack layer; said matrix material envelops said second grit particles and said matrix material bonds to and partially surrounds said first grit particles, wherein said first grit particles extend above said overplate layer.2. The coating according to claim 1 , wherein said first grit particles are selected from the group consisting of a cubic boron nitride material claim 1 , coated silicon carbide (SiC) claim 1 , aluminum oxide claim 1 , and diamond.3. The coating according to claim 1 , wherein said matrix material comprises ...

COPPER ALLOY SHEET STRIP WITH SURFACE COATING LAYER EXCELLENT IN HEAT RESISTANCE

Disclosed is a copper alloy sheet strip with a surface coating layer, including a copper alloy sheet strip, as a base material, consisting of Ni: 0.4 to 2.5% by mass, Sn: 0.4 to 2.5% by mass, and P: 0.027 to 0.15% by mass, a mass ratio Ni/P between the Ni content to the P content being less than 25, as well as any one of Fe: 0.0005 to 0.15% by mass, Zn: 1% by mass or less, Mn: 0.1% by mass or less, Si: 0.1% by mass or less, and Mg: 0.3% by mass or less, with the balance being Cu and inevitable impurities, and having a structure in which precipitates are dispersed in a copper alloy matrix, each precipitate having a diameter of 60 nm or less, 20 or more precipitates each having a diameter of 5 nm or more and 60 nm or less being observed in the visual field of 500 nm×500 nm; and the surface coating layer composed of a Ni layer, a Cu—Sn alloy layer, and a Sn layer formed on a surface of the copper alloy sheet strip in this order; wherein the Ni layer has an average thickness of 0.1 to 3.0 μm, the Cu—Sn alloy layer has an average thickness of 0.1 to 3.0 μm, and the Sn layer has an average thickness of 0.05 to 5.0 μm; wherein the Cu—Sn alloy layer is partially exposed on the outermost surface of the surface coating layer and a surface exposed area ratio thereof is in a range of 3 to 75%; and wherein the Cu—Sn alloy layer is composed of: 1) a η layer, or 2) a ε phase and a η phase, the ε phase existing between the Ni layer and the η phase, a ratio of the average thickness of the ε phase to the average thickness of the Cu—Sn alloy layer being 30% or less, and a ratio of the length of the ε phase to the length of the Ni layer being 50% or less. 118-. (canceled)19. A copper alloy sheet strip with a surface coating layer , comprising:a copper alloy sheet strip, as a base material, comprising Ni: 0.4 to 2.5% by mass, Sn: 0.4 to 2.5% by mass, and P: 0.027 to 0.15% by mass, a mass ratio Ni/P between the Ni content to the P content being less than 25, as well as one or more of Fe: ...

Additive manufacturing by localized electrochemical deposition

A method of electrolytic additive manufacturing provides 3-D parts. The method can be used to form parts from particulate material in an electrolytic bath. Metal is electrolytically deposited, binding the particles. Layers of the particles are built up to form the parts. The same process can be used to form parts without the particulate material. Layers of metal are electrolytically deposited in the electrolyte bath to form the parts.

ELECTRICALLY CONDUCTIVE MATERIAL FOR CONNECTION COMPONENT

Disclosed herein is an electrically conductive material including a base material made of a copper alloy sheet strip, a Cu—Sn alloy coating layer and a reflow Sn coating layer, wherein the Cu—Sn alloy coating layer and the reflow Sn coating layer are arranged on a surface of the base material in this order from a side of the base material, parts of the Cu—Sn alloy coating layer are exposed on a surface, a coefficient of friction in each of a direction perpendicular to and a direction inclined by 45° to a rolling direction of the copper alloy base material is reduced, compared to that in the rolling direction of the copper alloy base material. 1. An electrically conductive material for a connection component , the electrically conductive material comprising:a base material made of a copper alloy sheet strip;a Cu—Sn alloy coating layer having a Cu content of 20 to 70 atomic percent and an average thickness of 0.2 to 3.0 μm; anda reflow Sn coating layer having an average thickness of 0.2 to 5.0 μm,wherein:the Cu—Sn alloy coating layer and the reflow Sn coating layer are arranged on a surface of the base material in this order from a side of the base material;an arithmetic mean roughness Ra in at least one direction is 0.15 μm or more and an arithmetic mean roughness Ra in all directions is 3.0 μm or less;parts of the Cu—Sn alloy coating layer are formed to be exposed on a surface of the reflow Sn coating layer;a material-surface exposure area ratio of the Cu—Sn alloy coating layer is 3 to 75%;an average material-surface exposure interval in at least one direction is 0.01 to 0.5 mm;when a Vickers hardness test is performed by orienting a plane which is a plane parallel to a direction of application of a testing force and which includes one of ridge lines of an indenter with a square pyramid shape, in parallel to a rolling direction of the base material, applying a testing force of 4.903 N onto the surface of the base material with the indenter and then holding for 10 ...

PULSE ENERGY GENERATOR SYSTEM

Apparatus and methods for generating thermal energy from a pulsed DC electric power source utilizing pairs of electrodes disposed in a water medium. Electric pulses are provided at a frequency up to 20 MHz. Efficiencies are obtained when multiple pairs of electrodes are powered by the pulsed DC electric power source. The electrodes may be rods, plates, cylinders, or other useful shapes. The electrodes exposed to water may be a metal or alloy of nickel, platinum, palladium, or tungsten. The DC pulse generator is electrically connected to the electrodes to provide a source of pulsed direct current electric power. The input polarity to the electrodes may be periodically reversed or alternated between the anode and cathode polarity to limit erosion/electroplating of electrode material. 1. A pulse energy generator system comprising:a wet reactor heater comprising at least one pair of electrodes in contact with water. wherein the electrodes comprise an electrode metal that is oxidized and reduced to cause electrode metal oxidation and dissolution and electrode metal electroplating at the electrodes, wherein the electrode metal is selected from nickel, platinum, palladium, and gold; anda DC pulse generator, connected to the electrodes to provide a source of pulsed DC electric power to the electrodes, wherein the pulsed DC electric power level is in the range from 1 to 1500 average watts, wherein the pulse frequency is between 15 Hz and 20 MHz, and wherein the electrodes connected to the DC pulse generator have a first anode and cathode polarity.2. The pulse energy generator system according to claim 1 , further comprising a plurality of pairs of electrodes.3. The pulse energy generator system according to claim 1 , wherein the electrodes are configured rods claim 1 , cylinders claim 1 , or plates.4. The pulse energy generator system according to claim 1 , wherein the electrodes are configured as rods having a diameter in the range from 0.15 mm to 6.5 mm.5. The pulse energy ...

Plated silicon-based electronic cigarette atomizing chip and preparation method thereof

A plated silicon-based electronic cigarette atomizing chip includes the following components: a silicon substrate, wherein the silicon substrate is provided with an array of micro-pillars or an array of micro-holes, an inlet end, and an outlet end, the outer walls of the micro-pillars are plated side walls, the inner walls of the micro-holes are plated inner walls, and the array of micro-pillars defines a plurality of micro-channels or electronic cigarette liquid channels penetrating the micro-holes are provided on the silicon substrate; a glass cover, wherein the air holes passing through the glass cover are provided; and the glass cover is fixedly connected to the silicon substrate by a bonding process.

SYNTHESIS OF NANOPEAPODS BY GALVANIC DISPLACEMENT OF SEGMENTED NANOWIRES

A method for fabricating nanostructures and nanostructures are disclosed, which can include forming a multi-segmented nanowire; and performing a galvanic displacement reaction on the multi-segmented nanowire. The method utilizes template directed electrodeposition to fabricate nanowires with alternating layers of sacrificial/noble metal, enabling a new level of control over particle spacing, aspect ratio, and composition. Moreover, by exploiting the redox potential dependent reaction of galvanic displacement, nanopeapod materials can be extended (semiconductor/metal, p-type/n-type, metal/metal, ferromagnetic/nonmagnetic, etc.) beyond the fundamental metal/metal-oxide nanopeapods synthesized by high temperature techniques. Co/Au and Ni/Au multisegmented nanowires are disclosed, which can be create Te/Au nanopeapods by galvanic displacement, producing Te nanotubes and nanowires with embedded Au particles, respectively. 1. A nanostructure produced by the process of forming a multi-segmented nanowire and performing a galvanic displacement reaction on the multi-segmented nanowire.2. The nanostructure of claim 1 , wherein the nanostructure is a semiconductor.3. The nanostructure of claim 1 , wherein the nanostructure is a semiconductor nanotube.4. The nanostructure of claim 1 , wherein the multi-segmented nanowire is formed by template directed electrodeposition.5. The nanostructure of claim 1 , wherein the multi-segmented nanowire is comprised of alternating layers of Co (Cobalt) and Au (Gold).6. The nanostructure of claim 1 , wherein the multi-segmented nanowire is comprised of alternating layers of Ni (Nickel) and Au (Gold).7. The nanostructure of claim 1 , wherein the multi-segmented nanowire includes alternating layers of sacrificial and noble metals claim 1 , and the sacrificial metal is dissolved by a galvanic displacement reaction on the multi-segmented nanowire in a tellurium (Te) solution.8. The nanostructure of claim 7 , wherein a tellurium (Te) tube is formed ...

Method of forming a composite material and apparatus for forming a composite material

A method of forming a composite material is provided. The method may include: arranging a suspension in physical contact with a carrier, wherein the suspension may comprise an electrolyte and a plurality of particles of a first component of the composite material; causing the particles of the first component of the composite material to sediment on the carrier, wherein a plurality of spaces may be formed between the sedimented particles; and forming by electroplating a second component of the composite material from the electrolyte in at least a fraction of the plurality of spaces.

DEPOSITION METHOD OF NI-P-B SYSTEM ELECTROPLATING FILM, THE FILM, AND SLIDE MEMBER COMPRISING THE FILM

In a deposition method of Ni—P—B system plating film, electroplating is performed in a plating bath containing Ni ions, phosphorous acid ions, alkylamine borane, acetic acid, at least one sort of a primary brightening agent, and a secondary brightening agent including at least one sort of a surface active agent. In the above-mentioned plating bath, concentration of alkylamine borane in said plating bath is 1.37 mmol/L or more, and concentration of acetic acid in said plating bath is 0.70 mol/L or more and less than 2.80 mol/L. Thereby, plating film having high hardness of Hv 700 or more can be deposited with high manufacturing efficiency without baking processing, while reducing occurrence of poor appearance, such as burning and abnormal precipitation, even when current density is increased to 80 A/dmor more to raise deposition rate. 1. A deposition method of Ni—P—B system plating film , wherein:electroplating is performed in a plating bath containing Ni ions, phosphorous acid ions, alkylamine borane, acetic acid, at least one sort of a primary brightening agent, and a secondary brightening agent including at least one sort of a surface active agent,concentration of alkylamine borane in said plating bath is 1.37 mmol/L or more, andconcentration of acetic acid in said plating bath is 0.70 mol/L or more and less than 2.80 mol/L.2. The deposition method of Ni—P—B system plating film according to claim 1 , wherein:said alkylamine borane is trialkyl amine borane or dialkyl amine borane, andsaid surface active agent is anionic surface active agent.3. The deposition method of Ni—P—B system plating film according to claim 2 , wherein:said alkylamine borane is trimethylamine borane or dimethylamine borane, andsaid surface active agent is sodium dodecyl sulfate.4. The deposition method of Ni—P—B system plating film according to claim 1 , wherein:current density is 80 A/dm2 or more when performing said electroplating.5. Ni—P—B system plating film claim 1 , wherein:a content ...

Silver-plated product and method for producing same

A silver-plated product is produced by forming a surface layer of silver on a base material by electroplating at a liquid temperature of 10 to 35° C. and a current density of 3 to 15 A/dm 2 in a silver plating solution so as to satisfy (32.6x−300)≤y≤(32.6x+200) assuming that a product of a concentration of potassium cyanide in the silver plating solution and a current density is y (g·A/L·dm 2 ) and that a liquid temperature of the silver plating solution is x (° C.), the silver plating solution containing 80 to 110 g/L of silver, 70 to 160 g/L of potassium cyanide and 55 to 70 mg/L of selenium.

METHOD FOR ALTERING METAL SURFACES

A surface of an article is modified by first disposing a nickel-enriched region at the surface of a substrate, then enriching the nickel-enriched region with aluminum to form an aluminized region, and finally removing at least a portion of the aluminized region to form a processed surface of the substrate. Upon removal of this material, the roughness of the surface is reduced from a comparatively high initial roughness value to a comparatively low processed roughness value. In some embodiments, the processed roughness is less than about 95% of the initial roughness. Moreover, the sequence of steps described herein may be iterated one or more times to achieve further reduction in substrate surface roughness. 1. A method for altering the surface of an article , the method comprising:disposing a nickel-enriched region at a surface of a substrate, wherein the substrate has an initial composition prior to the disposing step, wherein the surface has an initial roughness, and wherein the nickel-enriched region has a higher nickel concentration than the initial composition of the substrate;heat treating the substrate to form a diffusion zone within the substrate;enriching at least a portion of the nickel-enriched region with aluminum to form an aluminized region; andremoving at least a portion of the aluminized region to form a processed surface of the substrate; wherein, after the removing step, the processed surface has a processed surface roughness that is less than the initial roughness.2. The method of claim 1 , wherein removing comprises chemically or electrochemically removing material.3. The method of claim 1 , wherein the processed surface roughness is less than about 95% of the initial surface roughness.4. The method of claim 1 , wherein the surface has an arithmetic average roughness (R) of at least about 200 microinches prior to the disposing step.5. The method of claim 1 , wherein disposing comprises disposing a nickel-enriched region having a thickness of at ...

ULTRAL-LOW LOADING OF Pt-DECORATED Ni ELECTROCATALYST, MANUFACTURING METHOD OF THE SAME AND ANION EXCHANGE MEMBRANE WATER ELECTROLYZER USING THE SAME

Provided is an electrocatalyst for anion exchange membrane water electrolysis, including a carbonaceous material, and nickel electrodeposited on the carbonaceous material, wherein nickel is partially substituted with platinum and the substitution with platinum provides increased hydrogen evolution activity as compared to the same electrocatalyst before substitution with platinum. Also provided are a method for preparing the electrocatalyst and an anion exchange membrane water electrolyzer using the same. The nickel electrocatalyst coated with an ultralow loading amount of platinum for anion exchange membrane water electrolysis shows excellent hydrogen evolution activity and has a small thickness of catalyst, thereby providing high mass transfer and high catalyst availability. In addition, the electrocatalyst uses a particle-type electrode to facilitate emission of hydrogen bubbles generated during hydrogen evolution reaction and oxygen bubbles generated during oxygen evolution reaction, and requires low cost for preparation to provide high cost-efficiency. 1. An electrocatalyst for an anion exchange membrane water electrolysis , comprising: a carbonaceous material; and a nickel electrodeposited on the carbonaceous material , wherein the nickel is partially substituted with a platinum and the substitution with the platinum provides an increased hydrogen evolution activity as compared to the same electrocatalyst before substitution with the platinum.2. The electrocatalyst according to claim 1 , wherein a surface of the nickel is coated with the platinum.3. The electrocatalyst according to claim 2 , wherein the nickel is nickel particles having a particle shape and the surface of nickel particles is partially or totally coated with platinum.4. The electrocatalyst according to claim 1 , wherein the platinum is included in a loading amount of 1.0-2.3 μg/cm.5. The electrocatalyst according to claim 1 , wherein the platinum is distributed on the surface of nickel in the ...

ZINC-COBALT BARRIER FOR INTERFACE IN SOLDER BOND APPLICATIONS

A microelectronic device has bump bond structures on input/output (I/O) pads. The bump bond structures include copper-containing pillars, a barrier layer including cobalt and zinc on the copper-containing pillars, and tin-containing solder on the barrier layer. The barrier layer includes 0.1 weight percent to 50 weight percent cobalt and an amount of zinc equivalent to a layer of pure zinc 0.05 microns to 0.5 microns thick. A lead frame has a copper-containing member with a similar barrier layer in an area for a solder joint. Methods of forming the microelectronic device are disclosed. 1. A microelectronic device , comprising:an input/output (I/O) pad; a copper-containing structure;', 'a layer on at least a portion of the copper-containing structure, the layer including 0.1 weight percent to 50 weight percent cobalt, the layer including an amount of zinc equivalent to a layer of pure zinc 0.05 microns to 0.5 microns thick; and', 'solder on the layer., 'a bump bond structure electrically coupled to the I/O pad, the bump bond structure including2. The microelectronic device of claim 1 , wherein the solder includes at least 50 weight percent tin.3. The microelectronic device of claim 1 , wherein the layer includes nickel claim 1 , wherein a weight percentage of the nickel is less than the weight percentage of the cobalt.4. The microelectronic device of claim 1 , wherein the layer is 1 micron to 5 microns thick.5. The microelectronic device of claim 1 , wherein a product of a thickness of the barrier layer and a weight percentage of the zinc is 0.05 microns to 0.5 microns.6. The microelectronic device of claim 1 , further including a seed layer between the copper-containing structure and the I/O pad claim 1 , the seed layer including an electrically conductive material.7. The microelectronic device of claim 1 , wherein the bump bond structure is attached to a package structure through a solder joint claim 1 , the solder joint including the solder.8. The microelectronic ...

CIRCUIT SUBSTRATE HAVING A CIRCUIT PATTERN AND METHOD FOR MAKING THE SAME

A circuit substrate includes: an insulative substrate formed with a pattern of a recess, the recess being defined by a recess-defining wall that has a bottom wall surface and a surrounding wall surface extending upwardly from the bottom wall surface; a patterned metallic layer structure including at least a patterned active metal layer disposed within the recess, formed on the bottom wall surface of the recess-defining wall, and spaced apart from the surrounding wall surface of the recess-defining wall, the patterned active metal layer containing an active metal capable of initiating electroless plating; and a primary metal layer plated on the patterned metallic layer structure. 1. A method for making a circuit substrate having a circuit pattern , the method comprising:(a) providing an insulative substrate having a top surface;(b) forming a pattern of a recess in the insulative substrate such that the recess is indented from the top surface, the recess being defined by a recess-defining wall having a bottom wall surface and a surrounding wall surface extending upwardly from the bottom wall surface;(c) forming a metallic layer structure on the recess-defining wall of the recess and the top surface of the insulative substrate, the metallic layer structure including at least one active metal layer containing an active metal capable of initiating electroless plating;(d) removing a portion of the metallic layer structure that is disposed along a peripheral edge of the bottom wall surface of the recess-defining wall so as to form the metallic layer structure into a first region which is disposed on the bottom wall surface, and a second region which is physically separated from the first region; and(e) plating a primary metal layer on the first region of the metallic layer structure.2. The method of claim 1 , wherein claim 1 , in step (c) claim 1 , the active metal of the active metal layer is a reduced active metal claim 1 , and the metallic layer structure is formed on ...

Microetch Neutralizer Chemistry For Ni-Au Plating Defect Elimination

A neutralizing composition comprising ascorbic acid as a reducing agent, citric acid as a chelator and a pH adjusting agent applied to microetched copper substrates bussed to stainless steel, which have been cleaned with an agent comprising permanganate ions. Unlike the prior art neutralizing agents comprising oxalic acid, which leave insoluble residue on the surface of the copper substrate, the present neutralizing composition leaves no residue and acts quickly. A surprising reduction in defects of Ni—Au plated copper substrates is achieved by utilization of the neutralization composition in a manufacturing process. 1. A neutralizing composition comprising:a reducing agent,a chelator; anda pH adjuster.2. The neutralizing composition of claim 1 , wherein the reducing agent is a carbocyclic acid selected from the group consisting of tartaric acid claim 1 , acetic acid claim 1 , malic acid claim 1 , malonic acid claim 1 , ascorbic acid claim 1 , lactic acid claim 1 , succinic acid claim 1 , and salts thereof.3. The neutralizing composition of claim 1 , wherein the chelator is comprised of citric acid claim 1 , ethylene diamine tetra-acetic acid (EDTA) claim 1 , or other divalent cation chelator.4. The neutralizing composition of claim 1 , wherein the reducing agent is present in an amount in the range of 12-18 wt. % claim 1 , the chelator in an amount in the range of 11-15 wt. % claim 1 , and the pH adjuster in an amount to bring the pH of the composition to a pH of about 2.5. The neutralizing composition of claim 4 , wherein the pH adjuster is selected from the group consisting of sodium hydroxide claim 4 , potassium hydroxide claim 4 , and mixtures thereof.6. The neutralizing composition of claim 1 , wherein the reducing agent comprises ascorbic acid claim 1 , the chelator comprises citric acid and the pH adjuster is selected from the group consisting of sodium hydroxide claim 1 , potassium hydroxide claim 1 , and mixtures thereof.7. A composition comprising: ...

METAL PARTICLE AND METHOD FOR PRODUCING THE SAME, COVERED METAL PARTICLE, AND METAL POWDER

A metal particle having a particle diameter of 10 μm or more and 1000 μm or less and includes Cu and trace elements and a total mass content of P and S, among other trace elements, is 3 ppm or more and 30 ppm or less. A method for producing a metal particle including producing a molten metal material by melting a metal material in a crucible, wherein Cu as determined in GDMS analysis is over 99.995% and a total of P and S is 3 ppm or more and 30 ppm or less; applying a pressure of 0.05 MPa or more and 1.0 MPa or less to drip the molten metal material through an orifice, thereby producing a molten metal droplet; and rapidly solidifying the molten metal droplet using an inert gas whose oxygen concentration is 1000 ppm or less. 16-. (canceled)7. A metal particle having a particle diameter of 10 μm or more and 1000 μm or less and including Cu and trace elements , wherein a Cu mass content as determined in GDMS analysis is over 99.995% and a total mass content of P and S , among other trace elements , is 3 ppm or more and 30 ppm or less.8. A covered metal particle claim 7 , wherein a surface of the metal particle according to is covered with an Ni layer.9. The covered metal particle according to claim 8 , wherein a surface of the Ni layer is covered with a solder layer.10. A metal powder comprising metal particles according to .11. A metal powder comprising covered metal particles according to .12. A metal powder comprising covered metal particles according to .13. A method for producing a metal particle claim 9 , the method comprising:a step a of producing a molten metal material by melting a metal material in a crucible, wherein a Cu mass content as determined in GDMS analysis of the metal material is over 99.995% and a total mass content of P and S of the metal material is 3 ppm or more and 30 ppm or less;a step b of applying a pressure of 0.05 MPa or more and 1.0 MPa or less to an inside of the crucible to drip the molten metal material through an orifice whose ...

Elevator sheave traction surface

A traction sheave for an elevator includes a composite coating applied directly to a surface of the traction sheave to at least partially define a traction surface arranged to engage a tension member. The composite coating including a coating having surface roughening particles arranged to provide a predetermined surface roughness of the traction surface within a range of 1-5 μm.

COPPER ALLOY SHEET STRIP WITH SURFACE COATING LAYER EXCELLENT IN HEAT RESISTANCE

Disclosed is a copper alloy sheet strip with a surface coating layer, including a copper alloy sheet strip, as a base material, consisting of 1.0 to 4.5% by mass of one or more of Ni and Co and 0.2 to 1.0% by mass of Si, with the balance being copper and inevitable impurities; and the surface coating layer composed of a Ni layer, a Cu—Sn alloy layer, and a Sn layer formed on a surface of the copper alloy sheet strip in this order; wherein the Ni layer has an average thickness of 0.1 to 3.0 μm, the Cu—Sn alloy layer has an average thickness of 0.2 to 3.0 μm, and the Sn layer has an average thickness of 0.05 to 5.0 μm; wherein the Cu—Sn alloy layer is composed of: 1) a η layer, or 2) a ε phase and a η phase, the ε phase existing between the Ni layer and the η phase, a ratio of the average thickness of the ε phase to the average thickness of the Cu—Sn alloy layer being 30% or less, and a ratio of the length of the c phase to the length of the Ni layer being 50% or less; and wherein the Cu—Sn alloy layer is partially exposed on the outermost surface of the surface coating layer and a surface exposed area ratio thereof is in a range of 3 to 75%, surface roughness of the surface coating layer is 0.15 μm or more in terms of arithmetic average roughness Ra in at least one direction, and 3.0 μm or less in terms of arithmetic average roughness Ra in all directions. 1. A copper alloy sheet strip with a surface coating layer , comprisinga copper alloy sheet strip, as a base material, comprising copper, 1.0 to 4.5% by mass of one or more of Ni and Co and 0.2 to 1.0% by mass of Si; anda surface coating layer comprising a Ni layer, a Cu—Sn alloy layer and a Sn layer formed on a surface of the copper alloy sheet strip in this order;wherein the Ni layer has an average thickness of 0.1 to 3.0 μm, the Cu—Sn alloy layer has an average thickness of 0.2 to 3.0 μm, and the Sn layer has an average thickness of 0.05 to 5.0 μm;wherein the Cu—Sn alloy layer comprises:1) a η layer, or2) a ε ...

METHOD FOR PRODUCING SURFACE-TREATED STEEL SHEET FOR BATTERY CONTAINERS AND SURFACE-TREATED STEEL SHEET FOR BATTERY CONTAINERS

There is provided a method for producing a surface-treated steel sheet for battery containers () comprising forming a dull or semi-bright nickel plating layer () on at least the surface to be the outside of a battery container in a steel sheet (), wherein the nickel plating layer () is formed by performing plating treatment under a condition of a bath temperature of 70° C. or more. 1. A method for producing a surface-treated steel sheet for battery containers , the method comprising forming a dull or semi-bright nickel plating layer on at least the surface to be the outside of a battery container in a steel sheet ,wherein the nickel plating layer is formed by performing plating treatment under a condition of a bath temperature of 70° C. or more.2. The method for producing a surface-treated steel sheet for battery containers according to claim 1 , wherein a plating bath containing no organosulfur compound is used for the plating treatment.3. The method for producing a surface-treated steel sheet for battery containers according to claim 1 , wherein no thermal diffusion treatment of the nickel plating layer is performed after the plating treatment.4. The method for producing a surface-treated steel sheet for battery containers according to claim 1 , wherein the nickel plating layer having a micro-Vickers hardness (HV) under a load of 10 g of 280 or more is formed by the plating treatment.5. The method for producing a surface-treated steel sheet for battery containers according to claim 1 , wherein the nickel plating layer having a kinetic friction coefficient of 0.40 or less measured under a vertical load of 1 N/mm2 is formed by the plating treatment.6. The method for producing a surface-treated steel sheet for battery containers according to claim 1 , wherein the nickel plating layer having a thickness of 2.0 μm or more is formed by the plating treatment.7. The method for producing a surface-treated steel sheet for battery containers according to claim 1 , wherein ...

NANOMOTORS FOR REDUCTION OF NITROARENES

A method for decontamination of nitroarenes including fabricating an exemplary nanomotor and chemically reducing nitroarenes of an acidic solution using the exemplary nanomotor. Fabricating the exemplary nanomotor may include depositing a plurality of magnetic nanoparticles on an Au nanosheet and depositing a plurality of zinc (Zn) nanoparticles on the plurality of magnetic nanoparticles. Chemically reducing the nitroarenes of the acidic solution may include generating hydrogen bubbles in the acidic solution by adding the exemplary nanomotor to the acidic solution and guiding the exemplary nanomotor in the acidic solution by applying a magnetic force to the exemplary nanomotor. Generating the hydrogen bubbles in the acidic solution may include reducing hydrogen ions in the acidic solution through a chemical reaction between the hydrogen ions and the plurality of Zn nanoparticles. 1. A method for decontamination of nitroarenes , the method comprising: depositing a plurality of magnetic nanoparticles on an Au nanosheet; and', 'depositing a plurality of zinc (Zn) nanoparticles on the plurality of magnetic nanoparticles; and, 'fabricating a nanomotor, comprising generating hydrogen bubbles in the acidic solution by adding the nanomotor to the acidic solution comprising reducing hydrogen ions of the acidic solution by causing a chemical reaction between the hydrogen ions and the plurality of Zn nanoparticles of the added nanometer; and', 'guiding the nanomotor in the acidic solution comprising guiding the plurality of magnetic nanoparticles by applying a magnetic force to the nanomotor., 'chemically reducing nitroarenes of an acidic solution, comprising2. The method of claim 1 , wherein guiding the nanomotor in the acidic solution comprises:detecting a polluted area in the acidic solution, the polluted area comprising an area of the acidic solution with a nitroarene concentration of at least 1 mM;moving the nanomotor toward the polluted area by applying the magnetic ...

REACTOR FOR LAYER DEPOSITION BY CONTROLLABLE ANODE ARRAY

An apparatus and method for electrochemically depositing a layer using a reactor configured to contain an electrolyte solution with an anode array containing a plurality of independently electrically controllable anodes arranged in a two-dimensional array, a cathode, an addressing circuit for receiving a signal containing anode address data, and for outputting a signal causing an anode array pattern; in communication with the addressing circuit, the current controller and the anode array, the second controller operable to communicate with the current controller to command the flow of current to each anode in the anode array thereby causing an electrochemical reaction at the cathode to deposit a layer corresponding to the anode array pattern signal received from the addressing circuit. 1. An apparatus comprising:(a) a reactor configured to contain an electrolyte solution;(b) an anode array containing a plurality of independently electrically controllable anodes stationary with respect to one another and the plurality of anodes arranged in a two-dimensional array, the anode array configured to be immersed in the electrolyte solution such that each of the plurality of anodes is in fluid contact with the other anodes in the plurality through the electrolyte solution;(c) a cathode disposed in the reactor such that the cathode is configured to be in fluid contact with the plurality of anodes through the electrolyte solution;(d) an anode addressing circuit for receiving a signal containing anode address data and for outputting a signal causing an anode array pattern;(e) a current controller to control a flow of current to the anode array; and,(e) a second controller in communication with the addressing circuit, the current controller and the anode array, the second controller operable to communicate with the current controller to command the flow of current to each anode in the anode array thereby causing an electrochemical reaction at the cathode to deposit a layer ...

DEPOSITING A STRUCTURALLY HARD, WEAR RESISTANT METAL COATING ONTO A SUBSTRATE

An example method of coating a substrate involves cleaning the substrate and, after cleaning the substrate, sensitizing the substrate using a sensitizing solution including tin chloride and hydrochloric acid. The method also involves, after sensitizing the substrate, activating the substrate in an activating solution including palladium chloride and hydrochloric acid. Further, the method involves subsequently neutralizing the substrate using a neutralizing solution including ammonium hydroxide. Still further, the method involves, after neutralizing the substrate, depositing an electroless nickel layer on the substrate. The method may then involve depositing an electrolytic nickel layer on top of the electroless nickel layer, and depositing an outer layer of metallic material, ceramic material, polymeric material, or any combination thereof on top of the electrolytic nickel layer. 1. A method of coating a substrate , the method comprising:cleaning the substrate;after cleaning the substrate, sensitizing the substrate using a sensitizing solution comprising tin chloride and hydrochloric acid;after sensitizing the substrate, activating the substrate in an activating solution comprising palladium chloride and hydrochloric acid;subsequently neutralizing the substrate using a neutralizing solution comprising ammonium hydroxide; andafter neutralizing the substrate, depositing an electroless nickel layer on the substrate.2. The method of claim 1 , wherein the substrate is non-conductive.3. The method of claim 2 , wherein the substrate comprises a fiber-reinforced plastic.4. The method of claim 2 , wherein the substrate comprises an engineering plastic.5. The method of claim 1 , wherein the sensitizing solution comprises between 5 g/l to 15 g/l of tin chloride and between 20 ml/l to 60 ml/l of hydrochloric acid.6. The method of claim 1 , wherein the activating solution comprises between 0.25 g/l to 1.5 g/l of palladium chloride and between 5 ml/l to 15 ml/l of hydrochloric ...

Agitator

The present invention provides an agitator for agitating a liquid (e.g. an electrolyte solution) containing particles (e.g. abrasive particles) within a tank. The agitator comprises an agitator body having an upper surface and a lower surface with at least one aperture extending through the agitator body. There is a one-way valve for allowing liquid flow through at least one aperture from the upper surface to the lower surface and for blocking liquid flow through at least one aperture from the lower surface to the upper surface.

Electronic component

A ceramic electronic component including a ceramic element assembly, an external electrode, and an underlying layer. In this ceramic electronic component, the underlying layer is formed on the ceramic element assembly, the external electrode is formed on the underlying layer, the underlying layer is formed of a metal material and a glass material containing a silicon atom, and the metal material exists in a highly dispersed state in the glass material.

POROUS METAL BODY AND METHOD FOR PRODUCING POROUS METAL BODY

An object of the present invention is to provide, at a low cost, a porous metal body that can be used in an electrode of a fuel cell and that has better corrosion resistance. The porous metal body has a three-dimensional mesh-like structure and contains nickel (Ni), tin (Sn), and chromium (Cr). A content ratio of the tin is 10% by mass or more and 25% by mass or less, and a content ratio of the chromium is 1% by mass or more and 10% by mass or less. On a cross section of a skeleton of the porous metal body, the porous metal body contains a solid solution phase of chromium, nickel, and tin. The solid solution phase contains a solid solution phase of chromium and trinickel tin (NiSn), the solid solution phase having a chromium content ratio of 2% by mass or less, and does not contain a solid solution phase that is other than a solid solution phase of chromium and trinickel tin (NiSn) and that has a chromium content ratio of less than 1.5% by mass. 1: A porous metal body having a three-dimensional mesh-like structure , the porous metal body comprising nickel (Ni) , tin (Sn) , and chromium (Cr) ,wherein a content ratio of the tin is 10% by mass or more and 25% by mass or less,a content ratio of the chromium is 1% by mass or more and 10% by mass or less,on a cross section of a skeleton of the porous metal body, the porous metal body contains a solid solution phase of chromium, nickel, and tin, and the solid solution phase{'sub': '3', 'contains a solid solution phase of chromium and trinickel tin (NiSn), the solid solution phase having a chromium content ratio of 2% by mass or less, and'}{'sub': '3', 'does not contain a solid solution phase that is other than a solid solution phase of chromium and trinickel tin (NiSn) and that has a chromium content ratio of less than 1.5% by mass.'}2: The porous metal body according to claim 1 , wherein claim 1 , on the cross section of the skeleton of the porous metal body claim 1 , an area ratio of the solid solution phase of chromium ...

WEAR-RESISTANT COATING PRODUCED BY ELECTRODEPOSITION AND PROCESS THEREFOR

Disclosed is process for producing a wear-resistant coating on a component. The process comprises providing an electrolyte which contains Co and/or Ni, dispersing first particles comprising hard material particles and/or slip material particles in the electrolyte, dispersing second particles comprising metal alloy particles in which the metal alloy comprises chromium and aluminum in the electrolyte, providing a component to be coated in a bath of the electrolyte which has first and second particles dispersed therein, and electrodepositing a matrix of Co and/or Ni with incorporated first and second particles on the component. A correspondingly produced wear-resistant coating is also disclosed. 1. A process for producing a wear-resistant coating on a component , wherein the process comprises:providing an electrolyte which contains Co and/or Ni,dispersing first particles in the electrolyte, the first particles comprising hard material particles and/or slip material particles,dispersing second particles in the electrolyte, the second particles comprising metal alloy particles in which the metal alloy comprises chromium and aluminum,providing a component to be coated in a bath of the electrolyte which has first and second particles dispersed therein, andelectrodepositing a matrix of Co and/or Ni with incorporated first and second particles on the component.2. The process of claim 1 , wherein after the electrodeposition the component is subjected to a heat treatment.3. The process of claim 2 , wherein the heat treatment is carried out at a temperature of from 950° C. to 1200° C. for from 2 to 20 h.4. The process of claim 2 , wherein the heat treatment is carried out in vacuo.5. The process of claim 1 , wherein the electrolyte comprises NiSOand/or CoSO.6. The process of claim 1 , wherein the electrolyte comprises NaCl and/or HBO.7. The process of claim 1 , wherein a metal alloy of the metal alloy particles is selected from CrAl claim 1 , CrAlY claim 1 , CrAlHf claim 1 , ...

TOOTHBRUSH WITH PARTIALLY COATED SURFACE

The toothbrush has a handle, a neck and a head. In the handle there is a first hard component which has a metallic covering. At least in regions, the metallic covering has a covering of a second hard component. 1. A method for producing a toothbrush with a handle part , having a first hard component , a neck part , adjoining said handle part , and a head part , carried by said neck part , in which the first hard component is formed by means of injection molding or multi-component injection molding and is subsequently provided with a metallic coating , at least in certain regions , the first hard component in the handle part taking up a significant proportion of the cross section of the handle part , at least in certain regions , wherein the metallic coating in the handle part is covered , at least in certain regions , by a second hard component by means of injection molding or multi-component injection molding , the first hard component and the second hard component being firmly connected to each other in a mechanical manner , without forming a material bond.2. The method as claimed in claim 1 , wherein the first hard component is produced by the injection-molding process or multi-component injection-molding process claim 1 , after which the first hard component is decoupled from the cycle of the injection-molding process or multi-component injection-molding process and stored and provided with the metallic coating claim 1 , then the first hard component claim 1 , provided with the metallic coating claim 1 , is placed into an injection-molding tool or multi-component injection-molding tool and overmolded with a second hard component claim 1 , at least in certain regions.3. The method as claimed in claim 1 , wherein the first hard component is produced in an injection-molding tool or a multi-component injection-molding tool claim 1 , is removed from the injection-molding tool or multi-component injection-molding tool and claim 1 , coupled to the cycle of the ...

PLATED STEEL SHEET AND METHOD FOR PRODUCING SAME

[Object] To provide a plated steel sheet excellent in heat resistance and productivity and a method for producing the same. 1. A plated steel sheet comprising:a steel sheet; andan alloy plating layer formed on a surface of the steel sheet,wherein the alloy plating layer consists of, in mass %, Cr: 5 to 91%, Fe: 0.5 to 10%, and the balance: Ni and unavoidable impurities,the Ni concentration in the alloy plating layer gradually decreases from an outermost surface of the alloy plating layer to a side of the steel sheet,the ratio of the Ni concentration to the Cr concentration is Ni/Cr>1 in an area extending 300 nm or more from the outermost surface of the alloy plating layer,the Fe concentration in the alloy plating layer gradually decreases from the side of the steel sheet to the outermost surface of the alloy plating layer,the Fe concentration in the outermost surface of the alloy plating layer is 0.5% or less,the total thickness of a Cr—Fe-containing alloy layer formed in the alloy plating layer and containing Cr and Fe is 500 to 2000 nm, and{'sup': '2', 'the total amount of the alloy plating layer deposited to the steel sheet is 4.5 to 55.5 g/m.'}2. The plated steel sheet according to claim 1 ,{'sup': '2', 'wherein the deposited amount of Cr plating in the alloy plating layer is 3.5 to 28.8 g/m,'}{'sup': '2', 'the deposited amount of Ni plating in the alloy plating layer is 3.0 to 26.7 g/m, and'}the ratio of the deposited amount of Cr/Ni plating in the alloy plating layer is 0.9 to 5.0.3. The plated steel sheet according to claim 2 ,wherein conditions (a) and (b) below are satisfied,{'sup': 2', '2, '(a) the deposited amount of Cr plating in the alloy plating layer is more than 3.5 g/mand 28.8 g/mor less, and'}{'sup': '2', '(b) at least one of a condition that the deposited amount of Ni plating in the alloy plating layer be 5.0 to 10.0 g/mand a condition that the ratio of the deposited amount of Cr/Ni plating in the alloy plating layer be 1.2 to 3.0 is satisfied.'}4 ...

METHOD FOR FORMING MICROSTRUCTURES

A method for producing a microstructure is disclosed. A master is provided having a pattern formed of conductive material embedded in a non-conducting substrate. The master has a master surface having a conducting portion defined by the pattern and a non-conducting portion defined by the non-conducting substrate. A surface treatment is applied to the master surface to alter the adhesion properties of at least one of the conducting portion or the non-conducting portion. The microstructure is formed by deposition or plating of a functionalising material onto the master surface, and the microstructure is then separated from the master. The master can be reused.

ELECTRICAL CONTACT MATERIAL, METHOD OF PRODUCING AN ELECTRICAL CONTACT MATERIAL, AND TERMINAL

An electrical contact material () having: a conductive substrate () formed from copper or a copper alloy; a first intermediate layer () provided on the conductive substrate (); a second intermediate layer () provided on the first intermediate layer (); and an outermost layer () formed from tin or a tin alloy and provided on the second intermediate layer (), wherein the first intermediate layer () is constructed as one layer of grains extending from the conductive substrate () side to the second intermediate layer () side, and wherein, in the first intermediate layer (), the density of grain boundaries () extending in a direction in which the angle formed by the grain boundary in interest and the interface between the conductive substrate and the first intermediate layer is 45° or greater, is 4 μm/μmor less; a method of producing the same; and a terminal. 1. An electrical contact material having: a conductive substrate formed from copper or a copper alloy; a first intermediate layer provided on the conductive substrate; a second intermediate layer provided on the first intermediate layer; and an outermost layer formed from tin or a tin alloy and provided on the second intermediate layer ,wherein the first intermediate layer is constructed as one layer of grains extending from the conductive substrate side to the second intermediate layer side, and{'sup': '2', 'wherein, in the first intermediate layer, the density of grain boundaries extending in a direction in which the angle formed by the grain boundary in interest and the interface between the conductive substrate and the first intermediate layer is 45° or greater, is 4 μm/μmor less.'}2. The electrical contact material as claimed in claim 1 , wherein the first intermediate layer is formed from any of nickel claim 1 , a nickel alloy claim 1 , cobalt claim 1 , or a cobalt alloy.3. The electrical contact material as claimed in claim 1 , wherein the second intermediate layer is formed from copper or a copper alloy.4. A ...

PROCESS FOR ELECTRODEPOSITION OF COBALT

The present invention relates to a process for the fabrication of cobalt interconnections and to an electrolyte which enables the implementation thereof. The electrolyte which has a pH below 4.0 comprises cobalt ions, chloride ions and at most two organic additives of low molecular weight. One of these additives may be an alpha-hydroxy carboxylic acid or a compound having a pKa value ranging from 1.8 to 3.5. 1. Electrolyte for the electrodeposition of cobalt , characterized in that the electrolyte is an aqueous solution comprising from 1 to 5 g/l of cobalt II ions , from 1 to 10 g/l of chloride ions , an acid in an amount sufficient to obtain a pH of between 1.8 and 4.0 , and at most two organic additives , said organic additives not being polymers.2. Electrolyte according to claim 1 , characterized in that the organic additive(s) have a molecular weight of less than 250 g/mol and greater than 50 g/mol.3. Electrolyte according to claim 1 , characterized in that it comprises at most one organic additive.4. Electrolyte according to claim 1 , characterized in that the organic additive(s) are chosen from alpha-hydroxy carboxylic acids.5. Electrolyte according to claim 1 , characterized in that the acid is hydrochloric acid and that at least one of the organic additives is chosen from organic compounds which have at least 1 pKa ranging from 1.8 to 3.5.6. Electrolyte according to claim 5 , characterized in that at least one of the organic additives is chosen from citric acid claim 5 , tartaric acid claim 5 , malic acid claim 5 , mandelic acid claim 5 , maleic acid claim 5 , fumaric acid claim 5 , glyceric acid claim 5 , orotic acid claim 5 , malonic acid claim 5 , L-alanine claim 5 , acetylsalicylic acid and salicylic acid.7. Electrolyte according to claim 1 , characterized in that the cobalt II ions are in free form claim 1 , that is to say not complexed with the organic additive(s).8. Electrolyte according to claim 1 , characterized in that its pH is between 2.0 and 3.5 ...

ELECTROLYTIC COPPER PROCESS USING ANION PERMEABLE BARRIER

Processes and systems for electrolytically processing a microfeature workpiece with a first processing fluid and a counter electrode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, a counter electrode, a second processing fluid, and an anion permeable barrier layer. The anion permeable barrier layer separates the first processing fluid from the second processing fluid while allowing certain anionic species to transfer between the two fluids. 1. A process for electrolytically processing a microfeature workpiece as the working electrode in a first processing fluid and a counter electrode in a second processing fluid , the method comprising:(a) contacting a surface of the microfeature workpiece with the first processing fluid, the first processing fluid including at least a first metal cation and a second metal cation, the microfeature workpiece having a nonmetallic substrate having a dielectric layer disposed over the substrate and a continuous metal feature disposed on the dielectric layer and having microfeatures comprising recessed structure;(b) contacting the counter electrode with the second processing fluid;(c) providing an anion permeable barrier between the first processing fluid and the second processing fluid to substantially prevent movement of cationic species between the first processing fluid and the second processing fluid; and(d) electrolytically depositing the first and second metal cations onto the surface of the microfeature workpiece.2. The process of claim 1 , wherein the first processing fluid is a catholyte.3. The process of claim 1 , wherein the second processing fluid is an anolyte.4. The process of claim 1 , wherein the anion permeable barrier is an anion exchange membrane.5. The process of claim 1 , wherein the working electrode is a cathode and the counter electrode is an anode.6. The process of claim 1 , wherein the first processing fluid is dosed with the first metal cation.7. The ...

Composite structure and method of making the same

A composite structure includes a passivated substrate, a sealing layer, a conductive layer, and a coating layer. The passivated substrate includes a substrate body made of a metallic material that is magnesium or magnesium alloy, and a porous passivation layer which is disposed on the substrate body, and which is made of an oxide of the metallic material. The sealing layer is disposed on the porous passivation layer, and is made of a sealing material. The conductive layer is disposed on the sealing layer, and is made of an electrically conductive material. The coating layer covers the conductive layer, and includes an electrophoretic material and/or a metal. A method of making the composite structure is also disclosed.

TIN-PLATED PRODUCT AND METHOD FOR PRODUCING SAME

There are provided a tin-plated product which has a zinc plating layer on the surface thereof and which has good corrosion resistance and good adhesion of the zinc plating even if the connecting portion of a terminal of the tin-plated product to an electric wire of aluminum or an aluminum alloy is not processed during press fitting such as swaging (or caulking) when the tin-plated product is used as the material of the terminal which is to be connected to the electric wire by press fitting, and a method for producing the same. The tin-plated product has: a base material of copper or a copper alloy; a tin containing layer formed on the surface of the base material , the tin containing layer having a copper-tin alloy layer and a tin layer of tin which is formed on the surface of the copper-tin alloy layer and which has a thickness of not larger than 5 μm; a nickel plating layer formed on the surface of the tin containing layer ; and a zinc plating layer serving as the outermost layer formed on the surface of the nickel plating layer 1. A tin-plated product comprising:a base material of copper or a copper alloy;a tin containing layer formed on a surface of the base material, the tin containing layer comprising a copper-tin alloy layer and a tin layer of tin which is formed on a surface of the copper-tin alloy layer and which has a thickness of not larger than 5 μm;a nickel plating layer formed on a surface of the tin containing layer; anda zinc plating layer serving as the outermost layer formed on a surface of the nickel plating layer.2. A tin-plated product as set forth in claim 1 , wherein said copper-tin alloy layer has a thickness of 0.2 to 2 μm.3. A tin-plated product as set forth in claim 1 , wherein said nickel plating layer has a thickness of 0.01 to 5 μm.4. A tin-plated product as set forth in claim 1 , wherein said zinc plating layer has a thickness of 0.5 to 40 μm.5. A tin-plated product as set forth in claim 1 , which further comprises an underlying layer ...

TIN-PLATED PRODUCT AND METHOD FOR PRODUCING SAME

There is provided a tin-plated product having an excellent minute sliding abrasion resistance property when it is used as the material of insertable and extractable connecting terminals, and a method for producing the same. After a nickel layer is formed on a substrate of copper or a copper alloy so as to have a thickness of 0.1 to 1.5 μm by electroplating, a tin-copper plating layer containing tin mixed with a copper-tin alloy is formed thereon so as to have a thickness of 0.6 to 10 μm by electroplating using a tin-copper plating bath which contains 5 to 35% by weight of copper with respect to the total amount of tin and copper, and then, a tin layer is formed thereon so as to have a thickness of 1 μm or less by electroplating if necessary. 1. A method for producing a tin-plated product , the method comprising the steps of:preparing a tin-copper plating bath; andforming a tin-copper plating layer, which contains tin mixed with a copper-tin alloy, on a substrate of copper or a copper alloy by electroplating using the tin-copper plating bath.2. A method for producing a tin-plated product as set forth in claim 1 , wherein said tin-copper plating bath contains 5 to 35% by weight of copper with respect to the total amount of tin and copper claim 1 , and wherein said electroplating is carried out so that said tin-copper plating layer has a thickness of 0.6 to 10 μm.3. A method for producing a tin-plated product as set forth in claim 1 , which further comprises the step of forming a tin layer by electroplating after said tin-copper plating layer is formed.4. A method for producing a tin-plated product as set forth in claim 3 , wherein said electroplating for forming said tin layer is carried out so that said tin layer has a thickness of 1 μm or less.5. A method for producing a tin-plated product as set forth in claim 1 , which further comprises the step of forming a nickel layer by electroplating before said tin-copper plating layer is formed.6. A method for producing a ...

METHOD OF ELECTROPLATING PLASTIC SUBSTRATE

Provided is a method of electroplating a plastic substrate, wherein the treatment time of processes including coarsening, copper plating, nickel plating, etc. is decreased, and a semi-gloss nickel plating process (a semi-gloss nickel plating layer) in a conventional electroplating process is obviated. Also, production capacity is remarkably increased and the plating cost and use of chromium are decreased, thus lowering environmental pollution. Furthermore, the process time and the thickness of the copper and nickel plating layers are decreased, and the electroplated surface of the plastic substrate by PVD is eco-friendly and exhibits superior heat resistance, corrosion resistance, and anti-scratching and anti-oxidation properties. Moreover, as the temperature and the gas content are adjusted in the PVD process, the resulting PVD layer can show various vivid colors having a metallic and 3D appearance, and conventional monotonous color defects can be overcome. 1. A method of electroplating a plastic substrate , comprising:(1) subjecting a plastic substrate to degreasing, hydrophilic etching, and coarsening, wherein a surface of the plastic substrate is degreased, etched and coarsened, and thus a butadiene component on the surface of the plastic substrate is oxidized and released, thereby forming a spherical hole in the surface of the plastic substrate, so that the surface of the plastic substrate satisfies electroless nickel plating attachment conditions;(2) subjecting the plastic substrate to neutralization and activation, wherein the coarsened plastic substrate is neutralized to remove chromic acid from the surface thereof, and then activated using a palladium colloid solution, so that highly active metal palladium colloid particles are adsorbed to the surface of the plastic substrate to form an activated surface and to form a uniform nickel plating layer by electroless nickel plating;(3) subjecting the plastic substrate to peptization, electroless nickel plating, ...

CURVED HIGH TEMPERATURE ALLOY SANDWICH PANEL WITH A TRUSS CORE AND FABRICATION METHOD

A lightweight sandwich panel structure with a complex shape and curvature, and a method to fabricate such a panel out of high temperature alloys. Embodiments of a micro-truss core structure that offer high specific strength and stiffness while allowing for curvature, and methods for depositing multiple layers of metals that can be interdiffused into complex alloys, are provided. A core of a panel may be fabricated from a polymer template, which may be shaped, e.g., curved, and coated with metal layers, which may then be heat treated to cause the layers of metal to interdiffuse, to form an alloy. 1. An article , comprising:a core; andtwo facesheets secured to the core; a plurality of hollow first truss members extending in a first direction; and', 'a plurality of hollow second truss members extending in a second direction;', 'the truss members of the plurality of first truss members and the plurality of second truss members interpenetrating at a plurality of hollow nodes,, 'the core comprisingeach of the hollow nodes being immediately adjacent to, and secured to, one of the two facesheets, an outside diameter between 0.1 mm and 5 mm,', 'a length between 3 mm and 50 mm, and', 'a wall thickness between 1 micron and 1000 microns,, 'each of the truss members of the plurality of first truss members and the plurality of second truss members havingwherein a hollow node is truncated, so that a saddle point of the hollow node is spaced from the facesheet to which it is immediately adjacent by a distance of less than one half of an outside diameter of a hollow truss member extending from the hollow node.2. The article of claim 1 , wherein 2 facesheets are attached to the core with an adhesive configured to transfer a load directly from a portion of a hollow node including a saddle point of the hollow node to the facesheet to which the hollow node is immediately adjacent.3. The article of claim 1 , further comprising a hollow fourth truss member perpendicular to the two ...

Electrode Tabs And Methods Of Forming

Electric tabs and methods for manufacturing are described. A method includes disposing a dielectric layer on a second side of a base material, the base material having a first side and the second side. The method including developing the dielectric layer on the second side of the base material. And, the method including etching the first side of the base material to form an electrode tab. 2. The method according to claim 1 , comprising:disposing a tie layer on the second side of the base material before disposing the dielectric layer.3. The method according to claim 2 , comprising:micro-etching the tie layer after etching the first side of the base material.4. The method according to claim 1 , comprising:rounding an edge of the base material.5. The method according to claim 1 , comprising:electroplating nickel on the electrode tab.6. The method according to claim 1 , comprising:cutting through the polyimide coating on a perimeter of the electrode tab.7. The method according to claim 1 , comprising:disposing a sealant on both sides of the electrode tab.8. The method according to claim 1 , wherein the electrode tab is an anode tab.9. The method according to claim 1 , wherein the electrode tab is a cathode tab.10. The method according to claim 1 , comprising:selectively applying a first side dielectric layer.112. The method of where the tie layer is an organic antioxidant.122. The method of where the tie layer is a conversion coating.132. The method of where the tie layer is a vapor deposited metal selected for adhesion properties.142. The method of where nickel is plated via electrolytic or electroless methods.15. A method of manufacturing claim 1 , comprising:disposing lanes of a dielectric on a first side of a base material; andpattern etching the base material to form an electrical tab.16. The method according to claim 15 , wherein the base material is a copper foil including a chromate layer.17. The method according to claim 15 , comprising:micro-etching the base ...