СПОСОБ ПОЛИРОВКИ И ПРИДАНИЯ БЛЕСКА МЕДИЦИНСКИМ ИГЛАМ

Изобретение относится к производству медицинской техники, а именно к финишной обработке атравматических медицинских игл, предназначенных для наложения хирургических швов. Способ полировки и придания блеска медицинским иглам заключается в закреплении иглы с помощью приспособления и погружении иглы в электролит, причем расстояние d между приспособлением и электролитом не менее 5 мм, зажигании разряда между обрабатываемой иглой и электролитом путем подачи на иглу положительного потенциала, на электролит - отрицательного, установлении напряжения между медицинской иглой и электролитом в диапазоне 30≤U≤600 В, тока разряда 0,1≤I≤200 А, температуры электролита 20≤Τ≤90°С, времени обработки 2≤t≤60 с, концентрации электролита 1-10%, причем в качестве электролитов используются нетоксичные соли. Изобретение обеспечивает полирование и придание блеска поверхности иглы, что обеспечивает малое усилие при прокалывании биологической ткани и увеличивает атравматизм. 3 ил.

СПОСОБ СУЛЬФИДИРОВАНИЯ ДЕТАЛЕЙ ИЗ ЖЕЛЕЗОСОДЕРЖАЩЕГО СПЛАВА В ВОДНОМ РАСТВОРЕ

Изобретение относится к области гальванотехники и может быть использовано для нанесения сульфидных покрытий на детали из железосодержащих сплавов. Способ включает обработку электролизом железосодержащих поверхностей деталей для улучшения их стойкости к трению, износу и заеданию, в котором упомянутые поверхности образуют электролитический анод в электролитической ванне, которая содержит серосодержащее соединение, хлорсодержащую соль, азотсодержащее соединение и воду, в количествах, подходящих для того, чтобы облегчить сульфидирование упомянутых поверхностей. Технический результат: снижение токсичности сульфидирования, уменьшение потребления энергии, повышение сцепления покрытия с деталью. 2 н. и 23 з.п. ф-лы, 2 табл., 2 пр.

СПОСОБ ХИМИЧЕСКОЙ ОБРАБОТКИ И ГАЛЬВАНИЧЕСКОГО НАНЕСЕНИЯ ПОКРЫТИЯ НА ДЕТАЛИ И АВТОМАТИЧЕСКАЯ КАМЕРА ОСУЩЕСТВЛЕНИЯ ЭТОГО СПОСОБА

Группа изобретений относится к способу химической обработки и гальванического нанесения покрытия на детали и автоматической камере для химической обработки и гальванического нанесения покрытия на детали упомянутым способом. В способе детали загружают внутрь ванн, размещенных в герметизируемой камере, и выполняют технологические операции при погружении деталей в соответствующий раствор, барботируемый инертным газом. Перед всеми операциями осуществляют вытеснение инертным газом воздуха из камеры с обеспечением одновременного полного связывания остатков кислорода атмосферы внутри камеры при подаче дождем нагретого раствора сульфитов щелочных металлов, и осуществляют циркуляцию обескислороженного инертного газа путем его откачки из упомянутой камеры и возврата в ванны для барботажа, при этом давление в камере поддерживают на уровне давления вне камеры за счет восполнения утечки инертного газа из камеры. Выполнение всех операций в ваннах осуществляют без переноса деталей при последовательной ...

СПОСОБ СУЛЬФИРОВАНИЯ ДЕТАЛЕЙ ИЗ ЖЕЛЕЗОСОДЕРЖАЩЕГО СПЛАВА В ВОДНОМ РАСТВОРЕ

... 1. Способ поверхностной обработки железосодержащих поверхностей путем электролиза для улучшения их стойкости к трению или стойкости к износу и заеданию, в котором упомянутые поверхности образуют электролитический анод и электролитическая ванна содержит серосодержащее соединение, отличающийся тем, что ванна содержит, в основном, воду, и, кроме того, она содержит хлорсодержащую соль и азотсодержащее соединение в количествах, подходящих для того, чтобы облегчить сульфирование упомянутых поверхностей. ! 2. Способ поверхностной обработки железосодержащих поверхностей по п.1, отличающийся тем, что серосодержащим соединением является сульфид. ! 3. Способ поверхностной обработки железосодержащих поверхностей по п.2, отличающийся тем, что сульфид вносят в концентрации, эквивалентной концентрации сульфид-ионов, составляющей от 20 до 90 г/л. ! 4. Способ поверхностной обработки железосодержащих поверхностей по любому из п.2 или 3, отличающийся тем, что сульфид представляет собой моносульфид натрия.

СПОСОБЫ ИЗГОТОВЛЕНИЯ БИОСОВМЕСТИМЫХ ЭЛЕМЕНТОВ ПИТАНИЯ ДЛЯ БИОМЕДИЦИНСКИХ УСТРОЙСТВ, СОДЕРЖАЩИХ МНОГОСЛОЙНЫЕ КОМПОЗИТЫ И ОСАЖДЕННЫЕ РАЗДЕЛИТЕЛИ

Изобретение обносится к области электротехники и медицины, а именно к способу и устройству для изготовления биосовместимых элементов питания. В некоторых примерах описаны способы и устройства для изготовления биосовместимых элементов питания, которые включают в себя этапы заполнения полостей активными химическими веществами катода и осаждение разделителей внутри ламинатной конструкции батареи. Предложенная конструкция биосовместимого элемента питания позволяет эффективно удерживать химический состав батареи. Конструктивное выполнение элемента питания позволяет обеспечивать внутренний контроль количества элементов питания внутри батареи. Активные элементы катода и анода герметизированы с помощью ламинатного пакета биосовместимого материала. В некоторых примерах область применения способов и устройства может включать любое биосовместимое устройство или продукт, для которых необходимы элементы питания. Повышение безопасности и надежности биосовместимого элемента питания при его компактности ...

Electrodepositing metallic layers

A method of electrodepositing a metallic layer on a substrate in a hostile environment (e.g. under water or in an atmosphere containing gases to be excluded from the substate during electrolysis) comprises: forming an enclosure around the substrate; providing an electrode and an electrolyte in the enclosure; preventing the hostile environment from entering the enclosure; and electrodepositing the metallic layer on the substrate. The method may be used for joining pipes 22, 24 under water by enclosing the ends of the pipes in a housing 26 provided with an electrode 50, electrolyte and providing an electrolyte and electrodepositing a cylindrical sleeve 72 which joins the pipes. ...

ARTICLE CONSISTING OF A FINE-GRAINED ONE, A METALLIC MATERIAL AND A POLYMER MATERIAL

Thin film memory element, procedure for its production and mechanism for the execution of the procedure

PROCEDURE AND DEVICE FOR THE CLEANING AND/OR COATING OF METAL SURFACES OF MEANS ELECTRICAL PLASMA TECHNOLOGY

Amorphous-crystalline tandem nanostructured solar cells

ELECTRODE WITH FILM OF PRUSSION BLUE ANALOGUE

METHODS TO FORM BIOCOMPATIBLE ENERGIZATION ELEMENTS FOR BIOMEDICAL DEVICES COMPRISING LAMINATES AND DEPOSITED SEPARATORS

Methods and apparatus to form biocompatible energization elements are described. In some examples, the methods and apparatus to form the biocompatible energization elements involve forming cavities comprising active cathode chemistry and depositing separators within a laminate structure of the battery. The active elements of the cathode and anode are sealed with a laminate stack of biocompatible material. In some examples, a field of use for the methods and apparatus may include any biocompatible device or product that requires energization elements.

SURFACE-TREATED STEEL SHEET AND METHOD OF MANUFACTURING THE SAME

The surface-treated steel sheet comprises a steel sheet and a plating layer comprising zinc and vanadium that is formed on one or both surfaces of the steel sheet, wherein the plating layer has a vanadium content between 1 and 20%; a basis weight between 3 g/m2 and 40 g/m2; multiple dendritic arms that have grown in the direction of thickness of the steel sheet; and an x/y ratio, where x is the vanadium content outside the arms and y is the vanadium content inside the arms, between 1.1 and 3.0 in terms of elemental vanadium.

ELECTROPLATING PROCESS

METHOD FOR MANUFACTURING ZINC-SILICA COMPOSITE ELECTROPLATED STEEL SHEET

METHOD FOR MANUFACTURING ZINC-SILICA COMPOSITE ELECTROPLATED STEEL SHEET A method for manufacturing a zinc-silica composite electroplated steel sheet, which comprises the steps of: adding, to a zinciferous acidic electroplating solution containing silica particles and nitric acid ions, a complexing agent, which is capable of forming a stable complex with zinc, in an amount within a range of from 0.001 to 10 moles per litre of the electroplating solution, or a pH buffer, which has a pH buffering effect in a solution having a pH value within a range of from 5 to 12, in an amount within a range of from 1 to 50 g per litre of the electroplating solution; and electroplating a steel sheet in the resultant electroplating solution containing the complexing agent of the pH buffer in addition to the silica particles and the nitric acid ions, to form, on the surface of the steel sheet, a zinciferous plating layer in which silica particles are uniformly dispersed.

ELECTROPLATED STEEL SHEET HAVING A PLURALITY OF COATINGS, EXCELLENT IN WORKABILITY, CORROSION RESISTANCE AND WATER-RESISTANT PAINT ADHESIVITY

PROCESS FOR ELECTROPLATING

PROCESS FOR ELECTROPLATING In the electroplating of certain metals, such as zinc, a metal build-up in the electroplating bath occurs due to a higher anode efficiency than cathode efficiency, in the cell, and also due to chemical dissolution of the anode in the electroplating bath. An electrowinning cell is provided to remove metal from the electroplating bath. The electrowinning cell is operated with a current sufficient to remove metal from the bath substantially equal to that chemically dissolved into the bath as well as the build-up due to the difference in the anodic and cathodic efficiencies.

Verfahren zur Verhütung der Nebelbildung von alkalischen Bädern zum galvanischen Aufbringen oder Entfernen von Metallschichten

Chemical or electrochemical process for coating the surface of an object with metal

Procedure for applying a galvanic coat.

Galvanic metal separation device.

A method of manufacturing a part for timepieces with a trim element in relief.

L’invention se rapporte à un procédé de fabrication d’une pièce (PC) pour l’horlogerie dotée d’un élément d’habillage (EH), comportant les étapes suivantes: se munir d’un substrat électriquement conducteur comprenant une surface supérieure et un motif formant un évidement dans ladite surface supérieure; déposer une couche électriquement isolante dans le motif, de sorte que la couche isolante s’étende jusqu’à la surface supérieure; déposer une couche métallique (CM) sur la surface supérieure du substrat par croissance galvanique, de sorte qu’à l’issue de cette étape, la couche métallique (CM) repose en partie sur la couche isolante; dissoudre la couche isolante; recouvrir un ensemble comprenant le substrat et la couche métallique (CM), par un volume d’un matériau de base de la pièce (PC), le volume formant une empreinte de l’ensemble; séparer (Md_Dem) le volume et la couche métallique (CM), du substrat, le volume présentant alors un élément d’habillage de forme correspondante à l’empreinte ...

A process for producing a mouth part of a mouthpiece of a wind instrument player matched to the mouthpiece and obtained.

Die Erfindung betrifft ein Verfahren zur Herstellung eines Mundstücks (10) für ein Blasinstrument aufweisend die Schritte: Erfassen einer dreidimensionalen Form von Lippen eines Spielers; und Herstellen oder Auswählen des Mundstücks auf der Basis der erfassten dreidimensionalen Form der Lippen des Spielers.

A PROCESS FOR CLEANING AND/OR APPLYING THE ELECTRICALLY CONDUCTING SURFACE, AN APPARATUS FOR REALIZING THE SAME (VARIANTS) AND AN ANODE DEVICE

Direct metallisation, esp. of microcircuits, by electroplating - with low current pre-metallising and high current metallising in single bath

FILLING PLATING SYSTEM AND FILLING PLATING METHOD

It is an object of the present invention to provide a filling plating system and a filling plating method capable of sufficiently filling plating even if plating is stopped between a plurality of electroplating cells. The present invention relates to the filling plating system for forming filling plating in a via hoke and/or a through hole of an object to be plated. The filling plating system includes a plurality of electroplating cells and an additive adhering zone mounted between the electroplating cells. In the additive adhering zone, a leveler having at least nitrogen-containing organic compounds, a brightener having sulphur-containing organic compounds, and a solution containing one or more additives selected from a carrier having polyether compounds are directly adhered on the object to be plated. COPYRIGHT KIPO 2018 ...

Selective shield/material flow mechanism

An apparatus and method for plating a workpiece. The apparatus comprises, generally, an anode, a cathode, and a selective anode shield/material flow assembly. In use, both the anode and the cathode are immersed in a solution, and the cathode is used to support the workpiece. During an electroplating process, the anode and the cathode generate an electric field emanating from the anode towards the cathode, to generate a corresponding current to deposit an electroplating material on the workpiece. The selective shield/material flow assembly is located between the anode and the cathode, and forms a multitude of adjustable openings. These opening have sizes that are adjustable during the electroplating process for selectively and controllably adjusting the amount of electric flux passing through the selective shield/material flow assembly and the distribution of the electroplating material on the workpiece. The selective shield/material flow assembly can also be used with an electroless plating ...

Electrophoretic deposition process

The invention is directed to a photosensitive polymer composition capable of being electrophoretically depositable as an adherent, uniform photosensitive film on a conductive surface. The photosensitive polymer composition useful for electrodeposition is formed from an aqueous solution or emulsion of at least one polymer having charged carrier groups, a photoinitiator and a source of unsaturation for crosslinking the resulting film upon exposure to actinic radiation. The photosensitive film formed from the photosensitive polymer composition is aqueous developable and resistant to strong inorganic acids and strong bases. The photosensitive polymer composition is useful in the preparation of printed circuit boards, lithographic printing plates, cathode ray tubes, as well as in chemical milling, solder resist and planarizing layer applications.

Method for manufacturing gravure-transfer-coated steel plate

A method for manufacturing a gravure transfer-coated continuous metal plate, wound in the form of a coil, comprising: coating, over the metal plate, a primer coating material; curing the primer coating material to form a lower coating layer; thermally transferring a desired pattern from a gravure transfer sheet onto the lower coating layer, thereby forming a transfer coating; coating, over the transfer coating, an upper coating material of thermosetting fluorine resin, thermosetting polyester resin, or UV-thermosetting polyurethane-acryl-based resin; and curing the upper coating material to form an upper coating layer. The primer coating material consists essentially of: 20-40% polyester resin having a number average molecular weight of 5,000-20,000 and a glass transition temperature of 10-50° C., 4-15% melamine resin, 1-10% urethane resin, 0.3-3% isocyanate, 15-35% pigment 30-50% hydrocarbon/ester-based mixed solvent, and 1.5-3% additives.

Protecting anodes from passivation in alloy plating systems

An apparatus for continuous simultaneous electroplating of two metals having substantially different standard electrodeposition potentials (e.g., for deposition of Sn—Ag alloys) comprises an anode chamber for containing an anolyte comprising ions of a first, less noble metal, (e.g., tin), but not of a second, more noble, metal (e.g., silver) and an active anode; a cathode chamber for containing catholyte including ions of a first metal (e.g., tin), ions of a second, more noble, metal (e.g., silver), and the substrate; a separation structure positioned between the anode chamber and the cathode chamber, where the separation structure substantially prevents transfer of more noble metal from catholyte to the anolyte; and fluidic features and an associated controller coupled to the apparatus and configured to perform continuous electroplating, while maintaining substantially constant concentrations of plating bath components for extended periods of use.

Sn-PLATED STAINLESS STEEL SHEET

A tin-plated stainless steel sheet which has a tin plating layer having good adhesion to a stainless steel sheet and exhibits excellent whisker resistance in various environments, and wherein a nickel plating layer having a thickness of 0.3-3 μm is formed on a stainless steel sheet, and a tin plating layer having a thickness of 0.3-5 μm is formed on the nickel plating layer. This tin-plated stainless steel sheet is characterized in that nickel crystals in the nickel plating layer have a lattice distortion of 0.5% or less.

ELECTRODEPOSITION AND PRODUCT

СПОСОБЫ ИЗГОТОВЛЕНИЯ ТОНКОПЛЕНОЧНЫХ ЭЛЕМЕНТОВ ПИТАНИЯ ДЛЯ БИОСОВМЕСТИМЫХ УСТРОЙСТВ, СОДЕРЖАЩИХ МНОГОСЛОЙНЫЕ КОМПОЗИТЫ И ОСАЖДЕННЫЕ РАЗДЕЛИТЕЛИ

Изобретение относится к устройству и способу изготовления тонкопленочного элемента питания для биосовместимого устройства. В некоторых примерах способы и устройства изготовления элементов питания могут включать в себя заполнение полостей активными химическими веществами катода и осаждение разделителей внутри ламинатной конструкции батареи. Активные элементы катода и анода герметизированы с помощью ламинатного пакета биосовместимого материала. В примерах области применения способов и устройства заявленное устройство может включать любое биосовместимое устройство или продукт, для которых необходимы элементы питания, работающие автономно без внешних источников питания, с расчетным сроком службы. Повышение прочности, гибкости, герметичности а также увеличение срока эксплуатации тонкопленочного элемента питания является техническим результатом изобретения. 2 н. и 22 з.п. ф-лы, 9 ил.

ЛИСТ НЕРЖАВЕЮЩЕЙ СТАЛИ С ПОКРЫТИЕМ ИЗ Sn

Изобретение относится к нанесению покрытия из олова на нержавеющий лист стали, который подходит для использования в электрических контактных соединениях, которые применяются в электронном оборудовании. Лист нержавеющей стали с покрытием из олова, в котором слой никелевого покрытия толщиной 0,3-3 мкм сформирован на листе нержавеющей стали, и слой оловянного покрытия толщиной 0,3-5 мкм сформирован на слое никелевого покрытия. При этом кристаллы никеля в слое никелевого покрытия имеют искажение решетки 0,5% или менее. Слой оловянного покрытия имеет хорошую адгезию к листу нержавеющей стали и демонстрирует превосходную стойкость к образованию усов в различных средах. 1 з.п. ф-лы, 2 ил., 2 табл., 12 пр.

СПОСОБЫ ИЗГОТОВЛЕНИЯ БИОСОВМЕСТИМЫХ ЭЛЕМЕНТОВ ПИТАНИЯ ДЛЯ БИОМЕДИЦИНСКИХ УСТРОЙСТВ, СОДЕРЖАЩИХ МНОГОСЛОЙНЫЕ КОМПОЗИТЫ И ОСАЖДЕННЫЕ РАЗДЕЛИТЕЛИ

PHOTOSENSITIVE POLYMER COMPOSITIONS, ELECTROPHORETIC DEPOSITION PROCESSES USING SAME, AND THE USE OF SAME IN FORMING FILMS ON SUBSTRATES

HOT-GALVANIZED STEEL PRODUCT

Thermische Spritz Anwendung von Gleitlager-Auskleidungsschicht

A sliding bearing surface may have at least one thermal spray coating applied to the bearing surface to form a sliding bearing lining layer. A method of forming the sliding bearing lining, the method comprising applying the thermal spray coating to the bearing surface uses a thermal spray technique.

PROCEDURE FOR GALVANIZING METALS.

High purity electrolytic sulfonic acid solutions

Amorphous-crystalline tandem nanostructured solar cells

Sn-plated stainless steel sheet

A tin-plated stainless steel sheet which has a tin plating layer having good adhesion to a stainless steel sheet and exhibits excellent whisker resistance in various environments, and wherein a nickel plating layer having a thickness of 0.3-3 μm is formed on a stainless steel sheet and a tin plating layer having a thickness of 0.3-5 μm is formed on the nickel plating layer. This tin-plated stainless steel sheet is characterized in that nickel crystals in the nickel plating layer have a lattice strain rate of 0.5% or less.

METHODS TO FORM BIOCOMPATIBLE ENERGIZATION ELEMENTS FOR BIOMEDICAL DEVICES COMPRISING LAMINATES AND DEPOSITED SEPARATORS

Methods and apparatus to form biocompatible energization elements are described. In some examples, the methods and apparatus to form the biocompatible energization elements involve forming cavities comprising active cathode chemistry and depositing separators within a laminate structure of the battery. The active elements of the cathode and anode are sealed with a laminate stack of biocompatible material. In some examples, a field of use for the methods and apparatus may include any biocompatible device or product that requires energization elements. 125 ---- 11 FIG. lB ...

ELECTROPLATED STEEL SHEET HAVING A PLURALITY OF COATINGS, EXCELLENT IN WORKABILITY, CORROSION RESISTANCE AND WATER-RESISTANT PAINT ADHESIVITY

ELECTROPLATED STEEL SHEET HAVING A PLURALITY OF COATINGS, EXCELLENT IN WORKABILITY, CORROSION RESISTANCE AND WATER-RESISTANT PAINT ADHESIVITY An electroplated steel sheet having a plurality of coatings, excellent in workability, corrosion resistance and water-resistant paint adhesivity, which comprises: an iron-chromium-zinc alloy coating as a lower layer, having a coating weight of from 0.1 to 40 g/m2 per side, formed on the surface of a steel sheet, consisting essentially of: iron : from 3 to under 15 wt.%, chromium : from 0.1 to 1 wt.%, and the balance being zinc and incidental impurities; another iron-chromium-zinc alloy coating as an intermediate layer, having a coating weight of from 20 to 59.9 g/m2 per side, formed on the iron-chromium-zinc alloy coating as the lower layer, consisting essentially of: iron : from 10 to 40 wt.%, chromium : from over 1 to under 30 wt.%, and the balance being zinc and incidental impurities; and a chromating coating as an upper layer, formed on the another ...

ELECTRODE DOWN THE ANION OF AND THE SENSOR, WHICH INCLUDES THE SAME

With the film tube shield of the plating apparatus

Semiconductor integrated circuit, manufacturing method thereof, and manufacturing apparatus thereof

PROCESS AND CHEMICAL OR ELECTROCHEMICAL PROCESSOR FOR the DEPOSIT Of a METAL COATING

PROCESS AND APPARATUS OF MANUFACTURE Of a WIRE OF CUTTING

Ce procédé de fabrication d'un fil de découpe formé de particules abrasives maintenues sur une âme centrale par un liant, comporte : a) le dépôt (204) de particules abrasives sur l'âme centrale, chaque particule abrasive comportant un matériau magnétique dont la perméabilité relative est supérieure à 50, ce matériau magnétique représentant au moins 1 % du volume de la particule abrasive, et b) le dépôt (204, 208) du liant sur l'âme centrale pour maintenir les particules abrasives fixées sur cette âme centrale, Pendant l'étape a), une interaction magnétique est créée (202, 206) entre l'âme centrale et les particules abrasives aimantées pour attirer les particules aimantées sur l'âme centrale.

작업편을 금속화하기 위한 방법 및 작업편과 금속층으로 이루어진 층구조

... 본 발명은 작업편 표면을 금속화하기 위한 방법에 관한 것이다. 상기 작업편 표면에, 금속화될 영역들에서, 주기적인 미세구조들 (6) 이 제공되고, 상기 주기적인 미세구조들은 바람직하게는 레이저 광선 (5) 을 이용해 미세구조화된 공구 (2) 의 성형 또는 몰딩을 통해 상기 작업편 표면으로 전달된다. 그 후, 적어도 상기 작업편 표면의 미세구조화된 영역들은 접착적으로 금속화되고, 이렇게 층구조가 제조된다.

희토류 영구자석의 제조 방법

R1-Fe-B계 조성(R1은 Y 및 Sc를 포함하는 희토류 원소로부터 선택되는 1종 또는 2종 이상)으로 이루어지는 소결 자석체를, R2의 산불화물 및/또는 R3의 수소화물(R2, R3은 Y 및 Sc를 포함하는 희토류 원소로부터 선택되는 1종 또는 2종 이상)을 함유하는 분말이 용매에 분산된 전착액에 침지하고, 전착법에 의해 당해 분말을 상기 소결 자석체의 표면에 도포부착시켜, 당해 자석체의 표면에 상기 분말을 존재시킨 상태에서, 당해 자석체 및 분말을 당해 자석의 소결 온도 이하의 온도에서 진공 또는 불활성 가스 중에서 열처리를 시행하여, 희토류 영구자석을 제조한다.

DEPOSITION OF PURE METALS IN 3D STRUCTURES

A system and method generate atomic hydrogen (H) for deposition of a pure metal in a three-dimensional (3D) structure. The method includes forming a monolayer of a compound that includes the pure metal 310. The method also includes depositing the monolayer on the 3D structure 330 and immersing the 3D structure with the monolayer in an electrochemical cell chamber including an electrolyte 340. Applying a negative bias voltage to the 3D structure with the monolayer and a positive bias voltage to a counter electrode generates atomic hydrogen from the electrolyte and deposits the pure metal from the monolayer in the 3D structure 360.

CRYOELECTROSYNTHESIS

A method of chemical fabrication for producing chemical compositions composed of at least two elemental constituents at low temperatures in an electrochemical cell is provided. Preferred compositions so produced include semiconductors, superconductors and other materials useful in various applications. By virtue of the synthesis at low temperatures, degradation of the compositions due to, for example, diffusion effects, is substantially eliminated.

MULTIPLICATION OF METAL SURFACE, BY ELECTROPLATING OR ANODIC DISSOLUTION

Method for plating copper conductors and devices formed

A method for plating copper conductors on an electronic substrate and devices formed are disclosed. In the method, an electroplating copper bath that is filled with an electroplating solution kept at a temperature between about 0° C. and about 18° C. is first provided. A copper layer on the electronic substrate immersed in the electroplating solution is then plated either in a single step or in a dual-step deposition process. The dual-step deposition process is more suitable for depositing copper conductors in features that have large aspect ratios, such as a via hole in a dual damascene structure having an aspect ratio of diameter/depth of more than ⅓ or as high as {fraction (1/10)}. Various electroplating parameters are utilized to provide a short resistance transient in either the single step deposition or the dual-step deposition process. These parameters include the bath temperature, the bath agitation, the additive concentration in the plating bath, the plating current density utilized ...

FABRICATION OF TOPICAL STOPPER ON HEAD GASKET BY ACTIVE MATRIX ELECTROCHEMICAL DEPOSITION

A method for making a gasket (32) for an internal combustion engine (20) includes forming a generally annual stopper (38) on a metallic gasket body (40) through the process of electrochemical deposition. An electrolytic cell is completed with the gasket body (40) forming a cathode. The stopper (38) is formed with a contoured compression surface (42) by selectively varying the electrical energy delivered to selected electrodes (70) over time. Electrolyte (48) rich with metallic ions is pumped at high speed through the inter-electrode gap. A PC controller (82) switches selected electrodes (70) ON at certain times, for certain durations, which cause metallic ions in the electrolyte (48) to reduce or deposit onto the gasket body (40), which are built in columns or layers into a three-dimensional formation approximating the target surface profile (106) for the compression surface (42). The subject method for building a three-dimensional formation can be applied to work parts other than cylinder ...

Experimental management apparatus and experimental management program for electroplating

There is provided an experimental management apparatus and experimental management program for electroplating that can carry out an electroplating experiment more efficiently and can manage experimental data more efficiently. The electroplating experimental management apparatus has a computer body 1a, which includes a central processing unit 101, a program memory 102, and a data memory 103. The program memory 102 stores a predicted value calculation program 102a for working out a predicted value of an experimental result based upon a physical property data file 103a and an arithmetic expression data file 103b read out of the data memory 103; an experimental data management program 102b for obtaining experimental data; and a data analysis program 102c for working out experimental data at each point of time during experiment based upon analysis of the experimental data obtained by the experimental data management program 102b.

加熱された基板および冷却された電解質を用いるシリコン貫通ビア（ＴＳＶ）における銅のチップトゥチップ、チップトゥウェハおよびウェハトゥウェハの相互接続物の電着のための方法

УСТРОЙСТВО ФОРМИРОВАНИЯ МЕТАЛЛИЧЕСКИХ НАНОРАЗМЕРНЫХ ОБЪЕКТОВ

... 1. Устройство формирования металлических наноразмерных объектов, содержащее проводящий предметный столик и измерительную головку сканирующего зондового микроскопа, включающего кантилевер, источник электрического воздействия на систему кантилевер/образец виде электронного устройства управления током, пьезосканеры с компенсатором термодеформаций и температурных дрейфов, виброзащитное устройство, цифровую электронную систему управления головкой сканирующего зондового микроскопа, отличающееся тем, что острие кантилевера выполнено из твердого электролита, обеспечивающего перенос ионов металла.2. Устройство по п. 1, отличающееся тем, что кантилевер выполнен сменным.3. Устройство по п. 1, отличающееся тем, что в качестве твердого электролита выбран электролит с ионами серебра, например RbAgI.4. Устройство по п. 1, отличающееся тем, что в качестве твердого электролита выбран электролит с ионами кислорода или фтора.

СПОСОБ ЭЛЕКТРОЛИТИЧЕСКОГО НАНЕСЕНИЯ ПОКРЫТИЯ НА ВНУТРЕННЮЮ ПОВЕРХНОСТЬ ПОЛОГО ЦИЛИНДРИЧЕСКОГО ИЗДЕЛИЯ

Изобретение относится к области гальваностегии и может быть использовано при нанесении размерного высококачественного покрытия на внутреннюю цилиндрическую поверхность длинномерного полого изделия. В полость изделия помещают анод и подают в нее концентрированный и выводят обедненный раствор электролита. Анод центрируют и неподвижно закрепляют посредством торцевых заглушек и гайки. Раствор электролита подают в цилиндрическую полость изделия под давлением с заданной скоростью по меньшей мере через одно отверстие, выполненное в одной из заглушек под углом α от 45° до 65° к поверхности осаждения, а выводят через отверстия, выполненные в другой заглушке. При этом изделие устанавливают в электролитической ванне под углом β от 10° до 20° к зеркалу электролита. Таким образом обеспечивается повышение стабильности качества покрытия за счет непрерывной циркуляции раствора в зоне осаждения с заданной скоростью при упрощении осуществления процесса нанесения покрытия и исключении соприкосновения внутреннего ...

Steel sheet electroplated with a zinc alloy for the outside of motor vehicle bodies, and process for its manufacture

A steel sheet for motor vehicle bodies and a process for its manufacture are described, the steel sheet containing 0.02 to 0.03% of P as an alloy element and a total quantity of Cu, Ni, Cr and Mo of more than 0.01%, but less than 0.08% by weight, and being electroplated with a Zn alloy. ...

ELECTRODE AND METHOD OF PRODUCING THE SAME

Electroplating process

METHOD AND APPARATUS FOR INCREMENTAL ELECTROPROCESSING OF LARGE AREAS

... 1496916 Non-immersion electro-processing J F JUMER 6 Aug 1975 [19 Sept 1974] 32944/75 Heading C7B The metal interior of a vertical vessel is electroprocessed (e.g. polished or plated) in increments by means of one or more chambers 12 which contact an increment 14 of the area via seals 43, and which contain electrolyte and an electrode whose surface conforms with that of the vessel. The chamber(s) are moved round the periphery, continuously or in steps, on arm(s) 26 extending from an axial shaft in the vessel, with vertical movement being effected after processing of each horizontal band. The shaft may be part of the vessel's working appurtenances and may carry an agitator; a supplementary shaft may be attached to such permanent shaft to extend it to the full axial length. Arm(s) 26 may be extensible on springs to ensure sealing action. Each chamber may have an upper/lower extension adapted to the shape of upper/lower angled walls of the vessel. Likewise the electrode may be adapted to fit ...

ELECTRODEPOSITING METALLIC LAYERS JOINING PIPES

METHOD OF ELECTROPLATING

In the chemical or electrochemical coating process which works at reduced pressure, the electrolyte fluid flows from an electrolyte vessel (1) via a lock appliance (8) and a three-way valve (6) optionally to a smaller (2) and a larger process chamber (3). The gases and vapours usually produced in electrolytic coating processes are effectively prevented by the reduced pressure from escaping into the environment. The appliance operates at a pressure of approximately 0.8 atm and, in order to maintain an optimum electrolyte temperature, contains heat exchanger devices (7, 20, 21). ...

CRYOELECTROSYNTHESIS

ZN-FE-P ALLOY COATED STEEL STRIP

ARTICLE COMPRISING A FINE-GRAINED METALLIC MATERIAL AND A POLYMERIC MATERIAL

Lightweight articles comprising a polymeric material at least partially coated with a fine-grained metallic material are disclosed. The fine-grained metallic material has an average grain size of 2nm to 5,000nm, a thickness between 25 micron and 5cm, and a hardness between 200VHN and 3,000 VHN. The lightweight articles are strong and ductile and exhibit high coefficients of restitution and a high stiffness and are particularly suitable for a variety of applications including aerospace and automotive parts, sporting goods, and the like.

PROCESS FOR ELECTROPLATING METALS

ROGERS, BERESKIN \A PARR C A N A D A Title: PROCESS FOR ELECTROPLATING METALS Inventor: CRAIG J. BROWN A process for electroplating metals in an electroplating bath having an anode and a cathode. The cathode is formed by a workpiece to be plated and the anode includes soluble material in the form of the metal to be plated and insoluble material in a proportion selected so that the anode efficiency equals the cathode efficiency This avoids metal salt build-up in the bath. Metal salt solution carried out of the bath with the workpiece is recovered and recycled to the bath, avoiding loss of metal to the system and waste disposal problems.

SURFACE-TREATED STEEL SHEET AND METHOD OF MANUFACTURING THE SAME

A surface-treated steel sheet includes: a steel sheet; and a coated layer which is formed on one surface or both surfaces of the steel sheet and includes zinc and vanadium, wherein the coated layer has a vanadium content of 1% or higher and 20% or less and a coating weight of 3 g/m2 or higher and 40 g/m2 or less, and has a plurality of dendritic arms that are grown in a thickness direction of the steel sheet, and a ratio x/y of a content x of vanadium that is present outside the arms to a content y of vanadium that is present inside the arms is 1.1 or higher and 3.0 or less in terms of vanadium element.

SULPHURATION METHOD OF FERROUS ALLOY PARTS IN AN AQUEOUS SOLUTION

Procédé de traitement superficiel par électrolyse de surfaces ferreuses pour améliorer leurs qualités de frottement ou de résistance à l'usure et au grippage, au cours duquel lesdites surfaces forment l'anode de l'électrolyse, le bain de l'électrolyse contient une espèce soufrée, contient majoritairement de l'eau et contient en outre un sel chloré et une espèce azotée dans des quantités propres à faciliter la réaction de sulfuration desdites surfaces.

Multilayer base plate with holes for assembly and its producing method

Gradient-color electroplating device and method

Potentiostatic nickel or chrome-plating of - titanium and titanium alloy

Process of hard chromium plating to thickness

NON SLIP PAD AND METHOD FOR MANUFACTURING THE SAME

PLATING APPARATUS AND METHOD

A plating computer having a plating cell with an interior processing volume configured to contain a plating solution for a plating process, a cell mounting platform connected at least at a first point to an actuator and at a second point to a movable attachment member, a rotatable substrate support member positioned in the processing volume and having a longitudinally extending shaft extending from a non-substrate engaging side of the support member, a transducer coupled to the longitudinally extending shaft and being configured to impart energy to the substrate support member via the shaft, and at least one detachable chemistry module in fluid communication with the processing volume.

Способ получения микрорельефного электрохимического хромового покрытия прокатного валка

Изобретение относится к прокатному производству и может быть использовано на станах кварто при холодной прокатке и дрессировке стальных полос. Способ включает шлифование бочки валка, электролитическое хромирование валка, в начале которого осуществляют прогрев верхнего слоя валка до температуры, составляющей не менее 0,5 температуры электролита, затем на первой стадии осуществляют подачу обратного тока при его плотности 10-45 А/дм2 в течение 1-25 мин, после этого на второй стадии осуществляют подачу прямого тока при его плотности 35-80 А/дм2 в течение 60-210 мин, на третьей стадии производят подачу прямого тока при его плотности 60-200 А/дм2 в течение 45-200 мин и подачу обратного тока при его плотности 15-50 А/дм2 в течение 3-10 мин, при этом осуществляют цикличное повторение третьей стадии 3-10 раз, а далее на четвертой стадии производят подачу прямого тока при его плотности 40-100 А/дм2 в течение 30-70 мин. Техническим результатом является повышенная износостойкость прокатных валков за ...

Способ получения диффузионного алюминидного покрытия на низкоуглеродистой стали

Изобретение относится к области гальванотехники и может быть использовано для получения изделий, предназначенных для эксплуатации при высоких температурах. Способ включает погружение изделия в алундовый контейнер, содержащий электролит в виде фторидного расплава на основе AlFс добавками NaF и/или KF и анод в виде расплава алюминия на дне контейнера, и получение покрытия, содержащего алюминий, на изделии в качестве катода при температуре 700-980°C, при этом покрытие получают электроосаждением в короткозамкнутом гальваническом элементе, образованном алитируемым изделием, фторидным расплавом и анодом, замыканием экранированных алундовыми трубками токоподводов к катоду и аноду металлическим проводником. Технический результат заключается в получении градиентного покрытия на основе алюминидов железа, обладающего повышенной термостойкостью. 1 табл., 6 ил.

ОБРАБОТКА ДЕТАЛЕЙ С УЧАСТКАМИ МЕТАЛЛИЧЕСКОГО ПОКРЫТИЯ С РАЗЛИЧНЫМ ВНЕШНИМ ВИДОМ

... 1. Способ обработки деталей для создания поверхности с блестящими и матовыми участками, в котором на поверхности, предварительно покрытой первым слоем меди и вторым слоем, содержащим металл, выполняют селективное травление второго слоя, причем селективное травление второго слоя выполняют на участке или участках, подлежащих матированию, в отличие от остальной части детали посредством лазера, который перемещается над поверхностью, матируя требуемый участок или участки, характеризующийся тем, что время действия и мощность лазера регулируют для получения различной текстуры.2. Способ по п.1, в котором лазер представляет собой лазер на иттрий-алюминиевом гранате с длиной волны 1064 нм и мощностью 100 Вт.3. Способ по п.1, в котором второй слой содержит никель.4. Способ по п.2, в котором второй слой содержит никель.5. Способ по п.1, в котором второй слой, в свою очередь, содержит нижележащий слой никеля и другой верхний слой хрома, а селективное травление выполняют на слое хрома.6. Способ по п.2 ...

Steel plate for the outside of automobile bodies electroplated with a zinc alloy

If steel plate contains 0.02 SIMILAR 0.03% of P as an alloying element with a total amount of Cu, Ni, Cr and Mo being more than 0.01% but less than 0.08 weight % pickling times can be reduced and satisfactory adhesion of electroplated zinc alloy layers can be achieved.

LAYER COMPOSITE MATERIAL FOR SLIDING ELEMENTS AND PROCEDURE FOR ITS PRODUCTION

Method of electroplating and pre-treating aluminium workpieces

Portable and modular production electroplating system

Abstract of the Disclosure A portable electroplating system with components integrated into a complete system, rather than separated and disjointed. A single electroplating system can be self contained to include all necessary rectifiers, tanks, cleaning functionalities, and other 5 helpful or necessary items. By using smaller components than conventional electroplating systems, the system can allow for more economical use of chemicals, solutions, and energy and can be utilized more efficiently towards a unique shape or size of object to be plated. The system can also include wheels to make the system portable. A rack management system can be employed to move objects from one location to another within 10 the system. 8897206_1 (GHMatters) P105615.AU Am 0 ~ 4Q~~M!NN~~ 't~ 105 RU 'N'N\* *\ '__ 4fAli ...

ASSEMBLY OF AN ALUMINIUM COMPONENT AND OF A PRESS HARDENED STEEL PART HAVING AN ALLOYED COATING COMPRISING SILICON, IRON, ZINC AND MAGNESIUM, THE BALANCE BEING ALUMINUM

The present invention relates to an assembly of an aluminium-based part and a press hardened steel part provided with an alloyed coating comprising in weight percent, 0.1 to 15.0% silicon, 15.0 to 70% of iron, 0.1 to 20.0% of zinc, 0.1 to 4.0% of magnesium, the balance being aluminum, on at least one of the surfaces thereof placed so as to be in contact with the aluminium-based part.

AUTOMATIC PROCESS FOR UNIFORM ELECTROPLATING WITHIN POROUSSTRUCTURES

PHOTOSENSITIVE POLYMER COMPOSITION AND ELECTROPHORETIC DEPOSITION PROCESS

PATENT APPLICATION of WILLIAM DAVID EMMONS and MARK ROBERT WINKLE for PHOTOSENSITIVE POLYMER COMPOSITION AND ELECTROPHORETIC DEPOSITION PROCESS DN 83-62 MSA:plb The invention is directed to a photosensitive polymer composition capable of being electrophoretically depositable as an adherent, uniform photosensitive film on a conductive surface. The photosensitive polymer composition useful for electrodeposition is formed from an aqueous solution or emulsion of at least one polymer having charged carrier groups, a photoinitiator and a source of unsaturation for crosslinking the resulting film upon exposure to actinic radiation. The photosensitive film formed from the photosensitive polymer composition is aqueous developable and resistant to strong inorganic acids and strong bases. The photosensitive polymer composition is useful in the preparation of printed circuit boards, lithographic printing plates, cathode ray tubes, as well as in chemical milling, solder resist and planarizing layer ...

METHOD OF PLATING A METALLIC SUBSTRATE TO ACHIEVE A DESIRED SURFACE COARSENESS

A method of plating a metallic substrate to achieve a desired surface coarseness includes: plating a metallic substrate with a source metal using a plating solution containing the source metal to produce a plated layer; and during said plating, varying at least one of multiple plating parameters to achieve a value of a coarseness metric of a surface of the plated layer above a minimum predetermined target value of the coarseness metric. Determining a value of a coarseness metric of a plated layer on a metallic substrate includes obtaining a magnified image of a surface of a plated layer recorded by a magnification device; identifying a path across the magnified image that crosses a plurality of pixels; and determining a contrast among the plurality of pixels.

METHODS TO FORM BIOCOMPATIBLE ENERGIZATION ELEMENTS FOR BIOMEDICAL DEVICES COMPRISING LAMINATES AND DEPOSITED SEPARATORS

Methods and apparatus to form biocompatible energization elements are described. In some examples, the methods and apparatus to form the biocompatible energization elements involve forming cavities comprising active cathode chemistry and depositing separators within a laminate structure of the battery. The active elements of the cathode and anode are sealed with a laminate stack of biocompatible material. In some examples, a field of use for the methods and apparatus may include any biocompatible device or product that requires energization elements.

SN-PLATED STAINLESS STEEL SHEET

A tin-plated stainless steel sheet which has a tin plating layer having good adhesion to a stainless steel sheet and exhibits excellent whisker resistance in various environments, and wherein a nickel plating layer having a thickness of 0.3-3 µm is formed on a stainless steel sheet, and a tin plating layer having a thickness of 0.3-5 µm is formed on the nickel plating layer. This tin-plated stainless steel sheet is characterized in that nickel crystals in the nickel plating layer have a lattice distortion of 0.5% or less.

ARTICLE COMPRISING A FINE-GRAINED METALLIC MATERIAL AND A POLYMERIC MATERIAL

Lightweight articles comprising a polymeric material at least partially coated with a fine-grained metallic material are disclosed. The fine-grained metallic material has an average grain size of 2nm to 5,000nm, a thickness between 25 micron and 5cm, and a hardness between 200VHN and 3,000 VHN. The lightweight articles are strong and ductile and exhibit high coefficients of restitution and a high stiffness and are particularly suitable for a variety of applications including aerospace and automotive parts, sporting goods, and the like.

Deposition cylinder washing device and centrifugal depositing machine

Protecting anodes from passivation in alloy plating systems

The invention relates to protecting anodes from passivation in alloy plating systems. An apparatus for continuous simultaneous electroplating of two metals having substantially different standard electrodeposition potentials (e.g., for deposition of Sn-Ag alloys) comprises an anode chamber for containing an anolyte comprising ions of a first, less noble metal, (e.g., tin), but not of a second, more noble, metal (e.g., silver) and an active anode; a cathode chamber for containing catholyte including ions of a first metal (e.g., tin), ions of a second, more noble, metal (e.g., silver), and the substrate; a separation structure positioned between the anode chamber and the cathode chamber, where the separation structure substantially prevents transfer of more noble metal from catholyte to the anolyte; and fluidic features and an associated controller coupled to the apparatus and configured to perform continuous electroplating, while maintaining substantially constant concentrations of plating ...

PROCESS AND CHEMICAL OR ELECTROCHEMICAL PROCESSOR FOR the DEPOSIT Of a METAL COATING

아연계 도금 강판 및 그 제조 방법

... 프레스 성형시의 슬라이딩 저항이 작고, 과혹한 알칼리 탈지 조건(온도가 낮고, 라인 길이가 짧은 조건)에 있어서도 우수한 탈지성을 갖고, 형성된 산화물층의 용해가 억제되고, 세정 처리에 의한 얼룩의 발생을 억제할 수 있고, 또한, 처리액에 환경 부하 물질을 포함하지 않아도 좋은, 아연계 도금 강판의 제조 방법을 제공한다. 표면에 산화물층을 갖는 아연계 도금 강판의 제조 방법으로서, 아연계 도금 강판을, 황산 이온을 함유하는 산성 용액에 접촉시킨 후, 1∼60초간 유지하고, 그 후 물세정을 행하는 산화물층 형성 공정과, 산화물층 형성 공정에서 형성된 산화물층의 표면을, 알칼리성 수용액에 접촉시킨 상태에서 0.5초 이상 유지하고, 그 후, 물세정, 건조를 행하는 중화 처리 공정을 구비하고, 상기 알칼리성 수용액으로서 탄산 이온을 0.1g/L 이상 함유하는 것을 이용한다.

도금가능 수지 조성물

... 본 출원에는 예를 들면, 플라스틱의 금속 도금에서 사용하기 위한 도금가능 수지 조성물이 개시된다. 상기 수지 조성물은 폴리카보네이트, 아크릴로니트릴 부타디엔 스티렌 및 충전제를 포함하고 레이저 직접적인 구조화 첨가제를 제외할 수 있다. 상기 조성물은 현저하게 개선된 특징, 예컨대 노치 아이조드 충격, 휨 탄성계수, 및 박리 강도를 보유한다. 또한 본 출원에는 상기 수지 조성물로 형성된 기재 상에 금속을 도금하는 방법, 뿐만 아니라 개시된 조성물을 포함하는 물품이 개시된다.

고강도 강판 및 그의 제조 방법

... 인장 강도가 1180MPa 이상인 고강도 강판을 제공한다. 해당 고강도 강판은, 규정된 성분 조성을 만족시키고, 또한 강판의 판 두께 1/4 위치의 조직이, 규정된 방법으로 측정했을 때에 하기 (1)∼(4) 모두를 만족시키는 것을 특징으로 하는 가공성과 저온 인성이 우수한 인장 강도가 1180MPa 이상인 고강도 강판이다. (1) 전체 조직에 대한 페라이트의 체적률이 5% 이상 35% 이하이고, 또한 베이니틱 페라이트 및/또는 템퍼링 마텐자이트의 체적률이 50% 이상이다. (2) 전체 조직에 대한 프레시 마텐자이트와 잔류 오스테나이트의 혼합 조직(MA 조직)의 체적률이 20% 이하(0%를 포함하지 않음)이다. (3) 전체 조직에 대한 잔류 오스테나이트의 체적률이 5% 이상이다. (4) 잔류 오스테나이트 중의 적층 결함이 10.0×10-3(nm/nm2) 이하이다.

Process for electrodeposition of copper chip to chip, chip to wafer and wafer to wafer interconnects in through-silicon vias (tsv) with heated substrate and cooled electrolyte

Process of electrodepositing a metal in a high aspect ratio via in a silicon substrate to form a through-silicon-via (TSV), utilizing an electrolytic bath including a redox mediator, in an electrolytic metal plating system including a chuck adapted to hold the silicon substrate and to heat the silicon substrate to a first temperature, a temperature control device to maintain temperature of the electrolytic bath at a second temperature, in which the first temperature is maintained in a range from about 30° C. to about 60° C. and the second temperature is maintained at a temperature (a) at least 5° C. lower than the first temperature and (b) in a range from about 15° C. to about 35° C.

MATERIAL SURFACE TREATMENT METHOD USING CONCURRENT ELECTRICAL AND PHOTONIC STIMULATION

A material surface treatment protocol (e.g., FIG. ) uses concurrent electronic and photonic stimulation to generate an exothermic reaction and coat the surface (e.g., FIGS. and ) of a material, such as palladium. This protocol is performed at or near the boiling point of water within a sealed vessel that prevents the escape of steam and that is lined with silica or a similar glass to increase the silica available to the reaction. The great majority of the applied energy is heat used to elevate the temperature to near the boiling point, while concurrent stimulations provide only about 100 mW of additional energy for the surface treatment. 1. A method of preparing materials at or near their surfaces , comprising:preparing a solution including a lithium silicate, in a liquid;heating and maintaining the solution at an elevated temperature to within 5° C. of the boiling point in a sealed reactor;photonically stimulating the solution with illumination from a light source; andelectrically stimulating two or more conductive electrodes immersed within the solution over an extended time period by applying a voltage between electrodes such that an exothermic reaction occurs evidenced by measured temperature increases during such electrical and photonic stimulating, at least one of the electrodes having a surface to be treated thereby and in intimate contact with a source of silicaceous material, wherein at least one electrode being treated experiences local vaporization of the solution.2. The method as in claim 1 , wherein the liquid for the solution comprises water.3. The method as in claim 2 , wherein the water is predominantly light water (HO).4. The method as in claim 2 , wherein the water is a combination of light water (HO) and heavy water (DO).5. The method as in claim 2 , wherein the water is predominantly heavy water (DO).6. The method as in claim 1 , wherein a surfactant is added to the solution.7. The method as in claim 1 , wherein a buffering agent is added to the ...

PROTECTING ANODES FROM PASSIVATION IN ALLOY PLATING SYSTEMS

An apparatus for continuous simultaneous electroplating of two metals having substantially different standard electrodeposition potentials (e.g., for deposition of Sn—Ag alloys) comprises an anode chamber for containing an anolyte comprising ions of a first, less noble metal, (e.g., tin), but not of a second, more noble, metal (e.g., silver) and an active anode; a cathode chamber for containing catholyte including ions of a first metal (e.g., tin), ions of a second, more noble, metal (e.g., silver), and the substrate; a separation structure positioned between the anode chamber and the cathode chamber, where the separation structure substantially prevents transfer of more noble metal from catholyte to the anolyte; and fluidic features and an associated controller coupled to the apparatus and configured to perform continuous electroplating, while maintaining substantially constant concentrations of plating bath components for extended periods of use. 1. An apparatus for simultaneous electroplating a first metal and a second , more noble metal onto a substrate , comprising:(a) an anode chamber for containing anolyte and an active anode, said active anode comprising the first metal;(b) a cathode chamber for containing catholyte and the substrate;(c) a separation structure positioned between the anode chamber and the cathode chamber and permitting passage of ionic current during electroplating; and(d) a getter comprising a solid phase getter material that undergoes disproportionation when contacting ions of the second metal, wherein the getter is positioned to contact the anolyte but not contact the catholyte during electroplating,wherein the getter is positioned at a first distance from the cathode chamber, the active anode is positioned at a second distance from the cathode chamber, the first distance is greater than the second distance, andwherein the getter is structurally distinct from the active anode.2. The apparatus of claim 1 , wherein the first metal is tin and ...

MICROORGANISM DETECTION SENSOR AND METHOD OF MANUFACTURING THE SAME

The present invention provides a sensor including a detection unit having a detection electrode and a polymer layer that is disposed on the detection electrode and includes a mold having a three-dimensional structure complementary to a steric structure of a microorganism to be detected. The sensor detects the microorganism based on a state of capturing the microorganism in the mold. The polymer layer is formed by a manufacturing method including: a polymerization step of polymerizing a monomer in the presence of the microorganism to be detected, to form the polymer layer having captured the microorganism on the detection electrode; a destruction step of partially destroying the microorganism captured in the polymer layer; and a peroxidation step of peroxidizing the polymer layer to release the microorganism from the polymer layer. 1. A sensor comprising a detection unit including a detection electrode and a polymer layer that is disposed on said detection electrode and includes a mold having a three-dimensional structure complementary to a steric structure of a microorganism to be detected ,said sensor detecting said microorganism based on a state of capturing said microorganism in said mold, andsaid polymer layer being formed by a manufacturing method including: a polymerization step of polymerizing a monomer in presence of the microorganism to be detected, to form said polymer layer having captured said microorganism on said detection electrode; a destruction step of partially destroying the microorganism captured in said polymer layer; and a peroxidation step of peroxidizing said polymer layer to release said microorganism from said polymer layer.2. The sensor according to claim 1 , further comprising a counter electrode claim 1 , whereinsaid sensor applies an alternating-current (AC) voltage between said detection electrode of said detection unit and said counter electrode in a state where said detection unit and said counter electrode are in contact with a ...

Articles from microarc processes and methods of manufacturing same

Disclosed articles as results of a microarc oxidation process, or plurality thereof, which are not limited by size, specifically by certain dimensions of their size, such as their length. Different sections or surfaces of articles of the invention may be subjected to a microarc oxidation process at any given time, such as by gradually subjecting a surface of an article to a microarc oxidation process, or such as by sequentially subjecting different sections of an articles to a microarc oxidation process. Furthermore, disclosed are methods for manufacturing of articles of the invention, or otherwise for subjecting articles of the invention to a microarc oxidation process, or plurality thereof. In some examples, tubes of above 6 meter in length may be coated according to methods of the invention. The coating of said tubes may be beneficial for desalination applications. In other examples, only grooves of pulleys are coated. Further disclosed are articles which underwent a microarc oxidation process, or plurality thereof, which included different solution, optionally by utilizing a solution modulator.

Manufacturing method and manufacturing apparatus for aluminum film

Provided are a manufacturing method and a manufacturing apparatus for an aluminum film in which moisture and oxygen do not intrude into a plating chamber. A manufacturing method for an aluminum film, in which aluminum is electrodeposited on a surface of a long, porous resin substrate imparted with electrical conductivity in a molten salt electrolytic solution, includes a step of transferring the substrate W into a plating chamber 1 through a sealing chamber 4 disposed on the entrance side of the plating chamber; a step of electrodepositing an aluminum film on the surface of the substrate W in the plating chamber 1 ; and a step of transferring the substrate having the aluminum film electrodeposited thereon from the plating chamber 1 through a sealing chamber 5 disposed on the exit side of the plating chamber 1 , in which an inert gas is supplied into the plating chamber such that the plating chamber has a positive pressure relative to outside air, and the inert gas is forcibly discharged from an inert gas exhaust pipe 7 provided on each of the two sealing chambers.

SYSTEMS, METHODS, AND ANODES FOR ENHANCED IONIC LIQUID BATH PLATING OF TURBOMACHINE COMPONENTS AND OTHER WORKPIECES

Ionic liquid bath plating systems, methods, and plating anodes are provided for depositing metallic layers over turbomachine components and other workpieces. In an embodiment, the method includes placing workpieces in a plurality of cell vessels such that the workpieces are at least partially submerged in plating solution baths, which are retained within the cell vessels when the plating system is filled with a selected non-aqueous plating solution. After plating anodes are positioned adjacent the workpieces in the plating solution baths, the plurality of cell vessels are enclosed with lids such that the plurality of cell vessels contain vessel headspaces above the plating solution baths. A first purge gas is then injected into the plurality of cell vessels to purge the vessel headspaces. The workpieces and the plating anodes are then energized to deposit metallic layers on selected surfaces of the workpieces utilizing an ionic liquid bath plating process. 1. A method carried-out utilizing an ionic liquid bath plating system including a plurality of cell vessels , the method comprising:placing workpieces in the plurality of cell vessels such that the workpieces are at least partially submerged in plating solution baths, which are retained within the cell vessels when the ionic liquid bath plating system is filled with a selected non-aqueous plating solution;positioning plating anodes adjacent the workpieces in the plating solution baths;after positioning the plating anodes adjacent the workpieces, enclosing the plurality of cell vessels with lids such that the plurality of cell vessels contain vessel headspaces above the plating solution baths;after enclosing the plurality of cell vessels with lids, injecting a first purge gas into the plurality of cell vessels to purge the vessel headspaces; andenergizing the workpieces and the plating anodes to deposit metallic layers on selected surfaces of the workpieces utilizing an ionic liquid bath plating process.2. The ...

METHOD AND DEVICE FOR PLATING A RECESS IN A SUBSTRATE

The teaching relates to a method for plating a recess in a substrate, a device for plating a recess in a substrate and a system for plating a recess in a substrate comprising the device. The method for plating a recess in a substrate includes the following: 110. A method for plating a recess in a substrate () , comprising the following steps:{'b': 10', '11, 'providing a substrate () with a substrate surface () comprising at least one recess,'}{'b': 30', '20', '20, 'applying a replacement gas () to the recess to replace an amount of ambient gas () in the recess to at least partially clear the recess from the ambient gas (),'}{'b': 40', '30', '40', '30, 'applying a processing fluid () to the recess, wherein the replacement gas () dissolves in the processing fluid () to at least partially clear the recess from the replacement gas (), and'}{'b': '10', 'plating the recess in the substrate ().'}23040. Method according to claim 1 , wherein the replacement gas () and the processing fluid () essentially remove any gaseous barrier in the recess before plating the recess.3304020. Method according to claim 2 , wherein the replacement gas () has at a processing temperature a higher solubility in the processing fluid () than the ambient gas ().43040. Method according to claim 3 , wherein the ambient gas is air and the Henry's law solubility constant Hof the replacement gas () in the processing fluid () at room temperature is larger than 6.4×10mol mPa claim 3 , preferably equal to or larger than 1.2×10mol mPaand more preferably equal to or larger than 3.3×10mol mPa53040. Method according to claim 4 , wherein the replacement gas () comprises COand the processing fluid () is essentially water.6. Method according to claim 5 , wherein the plating is an at least partial filling of the recess with an alloy or a metal and in particular with copper claim 5 , nickel claim 5 , indium claim 5 , or cobalt.740401040aa. Method according to claim 6 , wherein the processing fluid () is a plating ...

PHOTOELECTRODE, METHOD OF MANUFACTURING THE SAME, AND PHOTOELECTROCHEMICAL REACTION DEVICE INCLUDING THE SAME

A method of manufacturing a photoelectrode of an embodiment includes: preparing a stack including a first electrode layer having a light transmitting electrode, a second electrode layer having a metal electrode, and a photovoltaic layer disposed between the electrode layers; immersing the stack in an electrolytic solution containing an ion including a metal constituting a catalyst layer which is to be formed on the first electrode layer; and passing a current to the stack through the second electrode layer to electrochemically precipitate at least one selected from the metal and a compound containing the metal, onto the first electrode layer, thereby forming the catalyst layer. 1. A method for manufacturing an electrode , the method comprising:preparing a stack comprising a first electrode layer, a second electrode layer comprising a metal electrode, and a voltaic layer disposed between the first electrode layer and the second electrode layer, the voltaic layer comprising a pin junction or a pn junction of semiconductors;immersing the stack in an electrolytic solution comprising an ion comprising a metal constituting at least part of a catalyst layer which is to be formed on the first electrode layer; andpassing a current to the stack immersed in the electrolytic solution through the second electrode layer to electrochemically precipitate at least one selected from the group consisting of the metal and a compound comprising the metal, onto the first electrode layer.2. The method of claim 1 ,wherein the electrolytic solution comprises: at least one cation selected from the group consisting of an ion of the metal, an oxide ion of the metal, and a complex ion of the metal; and at least one anion selected from the group consisting of an inorganic acid ion and a hydroxide ion, andwherein a counter electrode is immersed in the electrolytic solution to face the stack immersed in the electrolytic solution, and at least one selected from the group consisting of the metal, a ...

METHODS AND APPARATUS FOR WETTING PRETREATMENT FOR THROUGH RESIST METAL PLATING

Disclosed are pre-wetting apparatus designs and methods. In some embodiments, a pre-wetting apparatus includes a degasser, a process chamber, and a controller. The process chamber includes a wafer holder configured to hold a wafer substrate, a vacuum port configured to allow formation of a subatmospheric pressure in the process chamber, and a fluid inlet coupled to the degasser and configured to deliver a degassed pre-wetting fluid onto the wafer substrate at a velocity of at least about 7 meters per second whereby particles on the wafer substrate are dislodged and at a flow rate whereby dislodged particles are removed from the wafer substrate. The controller includes program instructions for forming a wetting layer on the wafer substrate in the process chamber by contacting the wafer substrate with the degassed pre-wetting fluid admitted through the fluid inlet at a flow rate of at least about 0.4 liters per minute. 1. A method comprising:(a) providing a wafer substrate having an exposed metal layer on at least a portion of a surface of the wafer substrate to a process chamber, wherein the process chamber comprises a liquid inlet, the liquid inlet including at least one nozzle configured to deliver a pre-wetting liquid onto the wafer substrate;(b) reducing pressure in the process chamber to a subatmospheric pressure using a vacuum port in the process chamber;(c) degassing the pre-wetting liquid to remove one or more dissolved gasses from the pre-wetting liquid using a degasser coupled to the liquid inlet;and(d) contacting the wafer substrate with the degassed pre-wetting liquid at the subatmospheric pressure in the process chamber and thereby forming a wetting layer on the wafer substrate, held by a wafer holder in the process chamber, wherein the degassed pre-wetting liquid is delivered from the one or more nozzles onto the wafer substrate at a velocity of at least about 7 meters per second and is admitted through the liquid inlet to the process chamber at a flow ...

METHOD FOR DEPOSITING A COPPER SEED LAYER ONTO A BARRIER LAYER AND COPPER PLATING BATH

The present invention relates to an aqueous electroless copper plating bath, including a source for Cu(II) ions, glyoxylic acid as the reducing agent for Cu(II) ions, at least one complexing agent for Cu(II) ions and at least one source for hydroxide ions selected from the group consisting of RbOH, CsOH and mixtures thereof, wherein the electroless copper plating bath is substantially free of Na+, K+ and tetraalkylammonium ions. 1. An aqueous electroless copper plating bath , comprisinga. a source for Cu(II) ions,b. glyoxylic acid as the reducing agent for Cu(II) ions,c. at least one complexing agent for Cu(II) ions andd. at least one source for hydroxide ions selected from the group consisting of RbOH, CsOH and mixtures thereof,{'sup': +', '+, 'wherein said electroless copper plating bath is substantially free of Na, K and tetraalkylammonium ions.'}2. The aqueous electroless copper plating bath of with a pH ranging between 10 and 14.3. The aqueous electroless copper plating bath of claim 1 , wherein the source for Cu(II) ions is selected from copper sulfate claim 1 , copper chloride claim 1 , copper nitrate claim 1 , copper acetate claim 1 , copper methane sulfonate claim 1 , copper hydroxide claim 1 , copper formate and hydrates thereof.4. The aqueous electroless copper plating bath of claim 1 , wherein the Cu(II) ions have a concentration ranging from 0.05 g/l to 20 g/l.5. The aqueous electroless copper plating bath of claim 1 , wherein the glyoxylic acid has a concentration ranging from 0.05 g/l to 20 g/l.6. The aqueous electroless copper plating bath of claim 1 , wherein the glyoxylic acid has a concentration ranging from 0.1 g/l to 10 g/l.7. The aqueous electroless copper plating bath of claim 1 , wherein the glyoxylic acid has a concentration ranging from 0.2 g/l to 6 g/l.8. The aqueous electroless copper plating bath of claim 1 , wherein the at least one complexing agent for Cu(II) ions is selected from the group consisting of carboxylic acids claim 1 , ...

Metal Cleaning and Deposition Process for Coiled Tubing Using Electro Plasma

A method for creating an improved coiled tubing is provided, comprising cleaning a sheet metal workpiece using an electroplasma process to remove oxide scale and other contaminants on surfaces of the workpiece; applying a first metal coating to the workpiece using the electroplasma process; forming the sheet metal workpiece into a tube having abutting edges to form a seam; welding the seam to complete the formation of the tube; grinding the seam to establish a smooth exterior surface on the seam; applying a second metal coating to the seam of the tube using the electroplasma process; and coiling the tube around a spool. 1. A method for creating an improved coiled tubing , comprising:(a) cleaning a sheet metal workpiece using an electroplasma process to remove oxide scale and other contaminants on surfaces of the workpiece;(b) applying a first metal coating to the workpiece using the electroplasma process;(c) forming the sheet metal workpiece into a tube having abutting edges to form a seam;(d) welding the seam to complete the formation of the tube;(e) grinding the seam to establish a smooth exterior surface on the seam;(f) applying a second metal coating to the seam of the tube using the electroplasma process; and(g) coiling the tube around a spool.2. The method of claim 1 , wherein the electroplasma process comprises:(a) placing the sheet metal workpiece within a reaction chamber, wherein the reaction chamber includes an anode, and wherein the workpiece is a cathode;(b) creating a gap between the anode and the workpiece, wherein the anode includes a plurality of orifices;(c) applying an aqueous electrolyte into the reaction chamber through the orifices in the anode and onto the workpiece, and applying the aqueous electrolyte from below the workpiece, to establish an electrically conductive medium around the workpiece;(d) applying a DC voltage to the electrically conductive medium in excess of 30 VDC, such that a foam is formed within the reaction chamber, wherein ...

CONFIGURATION AND METHOD OF OPERATION OF AN ELECTRODEPOSITION SYSTEM FOR IMPROVED PROCESS STABILITY AND PERFORMANCE

In one aspect, an apparatus includes a plating cell, a degassing device configured to remove oxygen from the plating solution prior to the plating solution flowing into the plating cell; an oxidation station configured to increase an oxidizing strength of the plating solution after the plating solution flows out of the plating cell; and a controller. The controller includes program instructions for causing a process that includes operations of: reducing an oxygen concentration of the plating solution where the plating solution contains a plating accelerator; then, contacting a wafer substrate with the plating solution having reduced oxygen concentration and electroplating a metal such that the electroplating causes a net conversion of the accelerator to a less-oxidized accelerator species within the plating cell; then increasing the oxidizing strength of the plating solution causing a net re-conversion of the less-oxidized accelerator species back to the accelerator outside the plating cell. 1. An apparatus for electroplating a metal , comprising:(a) a plating cell, the plating cell being configured to hold a plating solution;(b) a degassing device coupled to the plating cell, the degassing device being configured to remove oxygen from the plating solution prior to the plating solution flowing into the plating cell;(c) an oxidation station coupled to the plating cell, the oxidation station being configured to increase an oxidizing strength of the plating solution after the plating solution flows out of the plating cell; and (i) reducing an oxygen concentration of the plating solution using the degassing device, wherein the plating solution includes about 100 parts per million or less of an accelerator;', '(ii) after operation (i), contacting, in the plating cell, a wafer substrate with the plating solution, wherein the oxygen concentration of the plating solution in the plating cell is about 1 part per million or less;', '(iii) electroplating a metal with the ...

INTEGRATED FLUIDJET SYSTEM FOR STRIPPING, PREPPING AND COATING A PART

An integrated liquidjet system capable of stripping, prepping and coating a part includes a cell defining an enclosure, a jig for holding the part inside the cell, an ultrasonic nozzle having an ultrasonic transducer for generating a pulsed liquidjet, a coating particle source for supplying coating particles to the nozzle, a pressurized liquid source for supplying the nozzle with a pressurized liquid to enable the nozzle to generate the pulsed liquidjet to sequentially strip, prep and coat the part, a high-voltage electrode and a ground electrode inside the nozzle for charging the coating particles, and a human-machine interface external to the cell for receiving user commands and for controlling the pulsed liquidjet exiting from the nozzle in response to the user commands. 1. A method of stripping , prepping and coating a part , the method comprising:holding the part inside a cell that defines an electrically shielded enclosure;generating a pulsed liquidjet using an ultrasonic nozzle;supplying coating particles to the nozzle;supplying the nozzle with a pressurized liquid to enable the nozzle to generate the pulsed liquidjet to sequentially strip, prep and coat the part;charging the coating particles using a high-voltage electrode and a ground electrode inside the nozzle;stripping the part by controlling the pulsed liquidjet;prepping the part by controlling the pulsed liquidjet; andcoating the part by controlling the pulsed liquidjet.2. The method as claimed in further comprising optically inspecting the part to determine when stripping is complete and then automatically switching to prepping.3. The method as claimed in further comprising detecting when prepping is complete and then automatically switching to coating.4. The method as claimed in further comprising detecting when coating is complete.5. A method of stripping claim 3 , prepping and coating a part claim 3 , the method comprising:generating a pulsed liquidjet using an ultrasonic nozzle that ultrasonically ...

Magnetic structure for metal plating control

Among other things, one or more systems and techniques for promoting metal plating profile uniformity are provided. A magnetic structure is positioned relative to a semiconductor wafer that is to be electroplated with metal during a metal plating process. In an embodiment, the magnetic structure applies a force that decreases an edge plating current by moving metal ions away from a wafer edge of the semiconductor wafer. In an embodiment, the magnetic structure applies a force that increases a center plating current by moving metal ions towards a center portion of the semiconductor wafer. In this way, the edge plating current has a current value that is similar to a current value of the center plating current. The similarity between the center plating current and the edge plating current promotes metal plating uniformity.

Silver-plated product and method for producing same

A silver-plated product is produced by forming a surface layer of silver on a base material by electroplating at a liquid temperature of 10 to 35° C. and a current density of 3 to 15 A/dm 2 in a silver plating solution so as to satisfy (32.6x−300)≤y≤(32.6x+200) assuming that a product of a concentration of potassium cyanide in the silver plating solution and a current density is y (g·A/L·dm 2 ) and that a liquid temperature of the silver plating solution is x (° C.), the silver plating solution containing 80 to 110 g/L of silver, 70 to 160 g/L of potassium cyanide and 55 to 70 mg/L of selenium.

FILM, FILM FORMING METHOD, AND SURFACE-COATED MATERIAL

A film that contains NiOH as a main component. 1. A film comprising NiOH as a main component.2. A film forming method comprising repeatedly alternately applying a first potential and a second potential to a Ni material in a state where the Ni material is immersed in an alkaline solution , such that a film that contains NiOH as a main component is formed on a surface of the Ni material , wherein:{'sub': '2', '#text': 'the first potential is a potential at which Ni turns tetravalent in a Ni—HO system; and'}{'sub': '2', '#text': 'the second potential is a potential at which Ni turns divalent in the Ni—HO system.'}3. The film forming method according to claim 2 , wherein the alkaline solution has a temperature of 40° C. to 90° C. and a pH of 10 or higher.4. The film forming method according to claim 2 , wherein the alkaline solution is one of a KOH solution claim 2 , a NaOH solution claim 2 , and a LiOH solution.5. A surface-coated material comprising:{'claim-ref': {'@idref': 'CLM-00001', '#text': 'claim 1'}, '#text': 'the film according to ; and'}a Ni material in which at least a part of a surface is coated with the film. This application claims priority to Japanese Patent Application No. 2020-151421 filed on Sep. 9, 2020, incorporated herein by reference in its entirety.The present disclosure relates to a film, a film forming method, and a surface-coated material.As a surface modification treatment for a Ni (nickel) material, a method of forming a nickel fluoride passivation film that has anticorrosion properties on a surface of the Ni material by using fluorine gas is known.Japanese Unexamined Patent Application Publication No. 2011-233423 (JP 2011-233423 A) discloses a method of suppressing an increase in amounts of NiOH generated in a positive electrode of an alkaline storage battery, such as a nickel-hydrogen battery. However, a film that contains NiOH as a main component is not known.Nickel fluoride has anticorrosion properties but is an electrical insulator. ...

SPARSE TRUSS STRUCTURES AND METHODS OF MAKING THE SAME

A sparse micro-truss structure having a series of unit cells arranged in an array is disclosed. Each of the unit cells includes a series of struts interconnected at a node. Adjacent unit cells are spaced apart by a gap. Spacing apart the adjacent unit cells is configured to reduce the sensitivity of the sparse micro-truss structure to premature mechanical failure due to buckling in one or more of the struts compared to related art micro-truss structures having a series of fully interconnected unit cells. 1. A micro-truss structure , comprising: each of the plurality of unit cells comprises a plurality of struts interconnected at a node, and', 'adjacent ones of at least two of the plurality of unit cells are spaced apart by a gap., 'a plurality of unit cells arranged in an array, wherein2. The micro-truss structure of claim 1 , wherein the array is rectilinear.3. The micro-truss structure of claim 1 , wherein the plurality of unit cells comprises:a first plurality of unit cells arranged in a first row of the array; anda second plurality of unit cells arranged in a second row of the array.4. The micro-truss structure of claim 3 , wherein the array is a staggered array claim 3 , and wherein the second plurality of unit cells in the second row of the array is laterally offset from the first plurality of unit cells in the first row of the array.5. The micro-truss structure of claim 4 , wherein at least one of the struts in each of the first plurality of unit cells in the first row is interconnected to one of the struts in one of the second plurality of unit cells in the second row.6. The micro-truss structure of claim 3 , wherein the second plurality of unit cells in the second row of the array is aligned with the first plurality of unit cells in the first row of the array claim 3 , and wherein each of the second plurality of unit cells is spaced apart by a gap from a corresponding one of the first plurality of unit cells.7. The micro-truss structure of claim 1 , wherein ...

PROCESS AND APPARATUS FOR MANUFACTURING AN ABRASIVE WIRE

A process for manufacturing an abrasive wire formed by abrasive particles held on a central core by a binder comprises depositing abrasive particles on the central core, each particle comprising a magnetic material that has a relative permeability greater than 50 and that represents at least 1% of the volume of the abrasive particle, and depositing binder on the central core to keep the abrasive particles attached to it. The core has south poles and north poles alternating along either its circumference or its length. 111-. (canceled)12. A process for manufacturing an abrasive wire formed by abrasive particles that are kept on a central core by a binder , said process comprising providing a central core , depositing magnetic abrasive particles on said central core , and depositing a binder on said central core , wherein said central core comprises a surface , wherein north poles and south poles are disposed on said surface , wherein said north poles and south poles are distributed in alternation along at least one of a circumference of said central core and a length of said central core , wherein , as a result of said distribution , a south pole is adjacent to two north poles , wherein , as a result of said distribution , a north pole is adjacent to two south poles , wherein each magnetic abrasive particle comprises a magnetic material , wherein said magnetic material has a relative permeability that is greater than 50 , wherein said magnetic material represents at least 1% of a volume of said magnetic abrasive particle , wherein depositing said magnetic abrasive particles creates a magnetic interaction between said central core and said abrasive particles , wherein said magnetic interaction attracts said abrasive particles to said central core , and wherein depositing said binder on said central core results in keeping said abrasive particles attached to said central core.13. The process of claim 12 , wherein providing a central core comprises providing a central ...

LIGHT-INDUCED ALUMINUM PLATING ON SILICON FOR SOLAR CELL METALLIZATION

Methods for light-induced electroplating of aluminum are disclosed herein. Exemplary methods may comprise preparing an ionic liquid comprising aluminum chloride (AlCl) and an organic halide, placing the silicon substrate into the ionic liquid, illuminating the silicon substrate, the illumination passing through the ionic liquid, and depositing aluminum onto the silicon substrate via a light-induced electroplating process, wherein the light-induced electroplating process utilizes an applied current that does not exceed a photo-generated current generated by the illumination. 1. A method for light-induced electroplating of aluminum directly onto a silicon substrate , the method comprising:{'sub': '3', 'preparing an ionic liquid comprising aluminum chloride (AlCl) and an organic halide;'}placing the silicon substrate into the ionic liquid;illuminating the silicon substrate, the illumination passing through the ionic liquid; anddepositing aluminum onto the silicon substrate via a light-induced electroplating process, wherein the light-induced electroplating process utilizes an applied current that does not exceed a photo-generated current generated by the illumination.2. The method of claim 1 , further comprising:cleaning the silicon substrate with at least one of hydrogen fluoride, hydrogen chloride, hydrogen peroxide, sodium hydroxide, potassium hydroxide, or ammonia hydroxide.3. The method of claim 1 , further comprising:patterning a partially-processed silicon solar cell to expose the silicon substrate.4. The method of claim 3 , wherein the patterning comprises at least one of laser ablation or lithography.5. The method of claim 1 , further comprising:cleaning the deposited aluminum with deionized water.6. The method of claim 1 , further comprising:annealing the deposited aluminum and the silicon substrate to reduce a resistivity of the deposited aluminum.7. The method of claim 1 , wherein the organic halide is 1-ethyl-3-methylimidazolium tetrachloraluminate (EMIm- ...

INVISIBLE SET DECORATIVE PART

The invention relates to a decorative part () including several stones () and a device (′) for securing the stones () in relation to each other. According to the invention, the securing device (′) includes a single electrodeposited base (′) whose shape matches one part of the stones, thus allowing all the stones () to be attached in relation to each other without any stress, and the girdles () of the stones () are mounted edge-to-edge in relation to each other so that the single base is concealed. The invention also relates to the method for manufacturing a part () of this type. 121-. (canceled)22. A method of manufacturing a decorative part , wherein the method includes the following steps:(a) providing several stones, wherein each stone includes a girdle;(b) securing each stone against a support, wherein the girdles of the stones are mounted edge-to-edge in relation to each other so as to form a pavé stone setting;(c) depositing a first electrically conductive layer on at least one part of the stones;(d) electrodepositing a second layer from the first electrically conductive layer so as to form a single electrodeposited base so that all the stones are attached in relation to each other without any stress;(e) removing the decorative part thereby formed from the support by detaching each of the stones from the support.23. The method according to claim 22 , wherein each stone includes a pavilion claim 22 , and between step (a) and step (b) claim 22 , the method further includes the following step:(f) etching one or more grooves in pavilions of said stones so that the single base electrodeposited in step (d) fills each of said one or more grooves so as to form a securing hook;and wherein, in step (c), the first electrically conductive layer is deposited over at least one part of the pavilions of the stones.24. The method according to claim 22 , wherein each stone includes a crown claim 22 , and between step (a) and step (b) claim 22 , the method further includes the ...

FILM FORMATION APPARATUS AND FILM FORMATION METHOD FOR FORMING METAL FILM

A film formation system for continuously forming metal films with desired thickness on the surfaces of substrates, and increase the film forming speed while suppressing abnormality of the metal films. A film formation system includes an anode; a solid electrolyte membrane between the anode and a substrate serving as a cathode such that a metal ion solution is disposed on the anode side thereof; and a power supply portion for applying a voltage across the anode and the substrate. A voltage is applied across the anode and the substrate o deposit metal out of the metal ions contained in the solid electrolyte membrane onto the substrate surface, thereby forming a metal film made of the metal ions. The anode has a base material, which is insoluble in the metal ion solution, and a metal plating film made of the same metal as the metal film, formed over the base material. 1. A film formation apparatus for forming a metal film , comprising at least:an anode;a solid electrolyte membrane disposed between the anode and a substrate serving as a cathode such that a solution containing metal ions contacts the anode side of the solid electrolyte membrane; anda power supply portion adapted to apply a voltage across the anode and the substrate, whereina voltage is applied across the anode and the substrate by the power supply portion to deposit metal out of the metal ions contained in the solid electrolyte membrane onto a surface of the substrate, thereby forming a metal film made of the metal, andthe anode has a base material and a metal plating film formed over the base material, the base material being insoluble in the solution, and the metal plating film being made of the same metal as the metal film to be formed.2. The film formation apparatus for forming a metal film according to claim 1 , wherein the anode is a porous body that has holes formed therein to pass the solution containing metal ions therethrough.3. The film formation apparatus for forming a metal film according to ...

ELECTROPLATING APPARATUS, ELECTROPLATING METHOD, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

According to one embodiment, an electroplating method includes, arranging an anode having passages through which a plating solution flows and a cathode to face each other via a resist mask, in a reaction section storing the plating solution, and setting a potential of the cathode to a negative potential to the anode, to form a metal plated film on the surface of the cathode. 1. An electroplating method comprising:arranging an anode having passages through which a plating solution flows and a cathode to face each other via a resist mask, in a reaction section storing the plating solution; andsetting a potential of the cathode to a negative potential to the anode, to form a metal plated film on the surface of the cathode.2. An electroplating method comprising:arranging an anode and a cathode to face each other, via a mask member comprising a resist mask and a support layer having passages through which a plating solution flows, in a reaction section storing the plating solution; andsetting a potential of the cathode to a negative potential to the anode, to form a metal plated film on the surface of the cathode.3. The electroplating method according to claim 1 ,wherein the anode is constituted in the foam of a porous plate having through holes making up the passages, and{'b': '1', 'a distance between the resist mask and the cathode during the formation of the plated film is pm or less.'}4. The electroplating method according to claim 2 ,wherein the anode is made of a metal material,the support layer is constituted in the form of a porous plate having through holes making up the passages,the resist mask has a pattern corresponding to a pattern shape of the plated film to be formed, anda distance between the resist mask and the cathode during the formation of the plated film is 1 μm or less.5. The electroplating method according to claim 1 ,wherein the passages have through holes arranged at a pitch smaller than a minimum opening width of a pattern of the resist mask.6. ...

Electroplating apparatus, electroplating method, and method of manufacturing semiconductor device

According to an embodiment, an anode portion and a cathode portion are arranged in a reaction tank so as to opposite to each other with a distance provided. A plating solution which contains at least metal ions for plating, an electrolyte and a surfactant is provided in the reaction tank. A pattern of a metal plating film is formed on a surface of the cathode portion by setting the cathode portion at a negative electric potential with respect to an electric potential of the anode portion. A distance between the anode portion and a surface of a pattern of the metal plating film to be formed on the surface of the cathode portion is set to be smaller than a half value width of a cross-section of a portion of the pattern of the metal plating film having a minimum width.

Fabricating Porous Metallic Coatings Via Electrodeposition and Compositions Thereof

A method is provided for creating a porous coating on a surface of a substrate by electrodeposition. The substrate is a part of the cathode. An anode is also provided. A coating is deposited or disposed on the surface by applying a voltage that creates a plurality of porous structures on the surface to be coated. Continuing to apply a voltage creates additional porosity and causes portions of the attached porous structures to detach. A covering layer is created by applying a voltage that creates a thin layer that covers the attached porous structures and the detached portions which binds the porous structures and detached portions together. 1. An article , comprising: a surface having at least one region; and a porous coating on said at least one region of said surface , wherein the coating comprises a plurality of porous structures attached to said at least one region of said surface and at least one layer covering said porous structures.2. The article of wherein between said coating and said surface claim 1 , additionally applying one or more intermediate bonding layers between said coating and said surface.3. The article of wherein said coating and said surface are different materials claim 2 , and said one or more bonding layers are made of materials different from the materials of said coating and said surface.4. The article of claim 1 , wherein said coating is applied to said surface by electrodeposition5. The article of wherein said porous structures and said covering layer are separately selected from metals claim 1 , metal alloys claim 1 , metallic compounds claim 1 , conductive polymers or any combination thereof.6. The article of wherein said surface is a metal claim 1 , metal alloy claim 1 , metallic compound claim 1 , conductive polymer or any combination thereof.7. The article of wherein said coating and said surface are the same material.8. The article of wherein said coating and said surface are different materials.9. The article of wherein said ...

Three-dimensionally printed bipolar plate for a proton exchange membrane fuel cell

A bipolar plate for a fuel cell is provided. The bipolar plate includes a main body with a first end and a second end spaced from the first end along a longitudinal axis of the main body. At least one inlet is disposed at the first end of the main body. At least one outlet corresponding to the at least one inlet is disposed at the second end of the main body. At least one continuous flow path extends from the at least one inlet to the at least one outlet. The main body comprises a single, contiguous piece.

Electroplating Method and Device

A method includes: agitating base members that has been immersed in an electrolytic solution inside of an electroplating tank so as to flow in a circumference direction along an inner wall of the electroplating tank; and electroplating the base members flowing along the circumference direction in the electrolytic solution inside of the electroplating tank. The flow of the base members along the circumference direction is caused by a flow of magnetic media along the circumference direction in the electrolytic solution inside of the electroplating tank or is caused by rotation of an agitation unit provided at a bottom side of the electroplating tank. At least one of the base members touches a bottom cathode, and a base member positioned upward relative to the base member touching the bottom cathode is electrically connected to the bottom cathode via at least the base member touching the bottom cathode.

DEVICE AND METHOD FOR COLORING ANODE COATINGS USING THE COLORING DEVICE

A device for applying a magnetic field to a container comprises an adjustable magnetic field generator. The adjustable magnetic field generator is adjacent to the container and has a magnet having one magnetic pole adjacent a wall of the container and another magnetic pole away from the wall of the container. The adjustable magnetic field generator comprises a magnet. The intensity of magnetic field applied to the container gradually decreases from the container wall adjacent the magnetic pole of the magnet to the opposite container wall. Method for coloring anode coatings using the coloring device is also provided. 1. A method for coloring anode coatings , comprising:providing a coloring device, the coloring device comprising a container and an adjustable magnetic field generator for adjusting the intensity of a magnetic field applied to the container, the adjustable magnetic field generator being positioned adjacent to the container and having a magnet positioned outside of the container, the magnet having one magnetic pole adjacent a wall of the container and another magnetic pole facing away from the wall of the container;providing a coloration solution containing magnetic pigment, the coloration solution held in the container;providing a workpiece, the workpiece comprising a surface coated with an anode coating;coloring the workpiece by immersing the workpiece in the coloration solution and gradually decreasing the intensity of magnetic field applied to the container from the container wall adjacent the magnetic pole of the magnet to the opposite container wall by the adjustable magnetic field generator.2. The coloring method of claim 1 , further comprising suspending the magnetic pigment in the coloration solution.3. The coloring method of claim 2 , wherein the magnetic pigment comprises FeOparticles attached with pigment.4. The coloring method of claim 3 , wherein the magnetic pigment has a diameter of about 40 nm to about 120 nm.5. The coloring method of ...

UV Film Sensor and Preparation Method Therefor, and Touch Control Screen

The present disclosure provides a UV film sensor, a preparation method therefor, and a corresponding touch screen. The UV film sensor comprises a film substrate (A) containing a printing surface (a) and an attaching surface (b), and a UV adhesive layer (), an electroplated color developing particle layer (), an ink layer (), a hardened layer (), an index matching layer () and a transparent conducting layer () for constructing a touch function structure are sequentially formed on the printing surface of the film substrate from one side close to the film substrate to the other side away from the film substrate. The touch screen is obtained after adhering a cover glass to the attaching surface of the film substrate in the UV film sensor via an optical grade transparent double-sided adhesive. The obtained touch screen only contains one layer of substrate. The touch screen can be thinner as a whole. A touch function structure is directly implemented on a UV film, and compared with the traditional process, multiple processes are reduced, the product thickness is decreased, the output and yield are improved, and the costs are decreased. 1. A UV film sensor comprising a film substrate comprising a printing surface and an attaching surface , wherein , from one side close to the film substrate to the other side away from the film substrate , a UV adhesive layer , an electroplated color developing particle layer , an ink layer , a hardened layer , an index matching layer , and a transparent conductive layer for building a touch function structure are formed successively on the printing surface of the film substrate.2. The UV film sensor according to claim 1 , wherein the UV adhesive layer claim 1 , the electroplated color developing particle layer and the ink layer are all located on a frame region claim 1 , the hardened layer and the transparent conductive layer cover the entire printing surface of the film substrate claim 1 , and the index matching layer comprises at least ...

ALUMINUM TRIHALIDE-NEUTRAL LIGAND IONIC LIQUIDS AND THEIR USE IN ALUMINUM DEPOSITION

An ionic liquid composition comprising a complex of a trihalo aluminum (III) species with at least one organic uncharged ligand comprising a ring structure having at least three ring carbon atoms and at least one ring heteroatom selected from nitrogen and sulfur, wherein the complex is a liquid at a temperature of 100° C. or less. Methods of electroplating aluminum onto a metallic substrate using the above-described ionic liquid composition are also described. 1. An ionic liquid composition comprising a complex of a trihalo aluminum (III) species with at least one organic uncharged ligand comprising a ring structure having at least three ring carbon atoms and at least one ring heteroatom selected from nitrogen and sulfur , wherein said complex is a liquid at a temperature of 100° C. or less.2. The ionic liquid composition of claim 1 , wherein said complex is a liquid at a temperature of 50° C. or less.3. The ionic liquid composition of claim 1 , wherein said complex is a liquid at a temperature of 30° C. or less.4. The ionic liquid composition of claim 1 , wherein the ionic liquid composition contains said complex in liquid form in the substantial absence of an organic or inorganic solvent.5. The ionic liquid composition of claim 1 , wherein said organic uncharged ligand comprises a nitrogen-containing heterocyclic structure having at least three ring carbon atoms and at least one ring nitrogen atom.6. The ionic liquid composition of claim 5 , wherein said nitrogen-containing heterocyclic structure further comprises at least one alkyl or alkenyl substituent bound to a ring carbon atom.7. The ionic liquid composition of claim 6 , wherein the alkyl or alkenyl substituent contains at least three carbon atoms.8. The ionic liquid composition of claim 5 , wherein said nitrogen-containing heterocyclic structure is unsaturated.9. The ionic liquid composition of claim 8 , wherein said nitrogen-containing heterocyclic structure comprises a pyridine ring.10. The ionic liquid ...

Electrochemical deposition of refined lithium metal from polymer electrolytes

A method for electrochemical deposition of refined lithium metal to form a lithium anode in situ in a lithium (Li) ion battery comprising providing a fully lithiated cathode, providing a metal anode, providing a block copolymer electrolyte membrane between the cathode and the metal anode, and polarizing the cathode and the metal anode in the lithium ion battery to cause Li ions to migrate from the cathode through the block copolymer electrolyte and cause the electrochemical deposition to deposit refined lithium metal on the metal anode to form the lithium anode. 1. A method for electrochemical deposition of refined lithium metal to form a lithium anode in situ in a lithium (Li) ion battery comprising:providing a fully lithiated cathode;providing a metal anode;providing a block copolymer electrolyte membrane between the cathode and the metal anode; andpolarizing the cathode and the metal anode in the lithium ion battery to cause Li ions to migrate from the cathode through the block copolymer electrolyte and cause the electrochemical deposition to deposit refined lithium metal on the metal anode to form the lithium anode.2. The method of wherein the block copolymer electrolyte membrane comprises a polystyrene-b-poly(ethylene oxide) (SEO) block copolymer.3. The method of wherein the metal anode comprises lithium metal.4. The method of wherein the metal anode comprises nickel metal. This application claims priority to U.S. Provisional Application Ser. No. 62/242,784 filed Oct.16, 2015, which application is incorporated herein by reference as if fully set forth in their entirety.The invention described and claimed herein was made in part utilizing funds supplied by the U.S. Department of Energy under Contract No. DE-AC02-05CH11231 between the U.S. Department of Energy and the Regents of the University of California for the management and operation of the Lawrence Berkeley National Laboratory. The government has certain rights in this invention.Field of the InventionThe ...

ELECTROPLATING APPARATUS FOR TAILORED UNIFORMITY PROFILE

Methods of electroplating metal on a substrate while controlling azimuthal uniformity, include, in one aspect, providing the substrate to the electroplating apparatus configured for rotating the substrate during electroplating, and electroplating the metal on the substrate while rotating the substrate relative to a shield such that a selected portion of the substrate at a selected azimuthal position dwells in a shielded area for a different amount of time than a second portion of the substrate having the same average arc length and the same average radial position and residing at a different angular (azimuthal) position. For example, a semiconductor wafer substrate can be rotated during electroplating slower or faster, when the selected portion of the substrate passes through the shielded area. 1. A method of electroplating a metal on a cathodically biased substrate while controlling azimuthal uniformity , the method comprising:(a) providing the substrate into an electroplating apparatus configured for rotating the substrate during electroplating, wherein the apparatus comprises an anode and a stationary auxiliary azimuthally asymmetric cathode; and(b) electroplating the metal on the substrate while rotating the substrate, and while providing power to the auxiliary azimuthally asymmetric cathode in correlation with the rotation of the substrate, such that the auxiliary azimuthally asymmetric cathode diverts plating current from a first portion of the substrate at a selected azimuthal position of the substrate differently than from a second portion of the substrate having the same average arc length and the same average radial position and residing at a different azimuthal angular position.2. The method of claim 1 , wherein the auxiliary azimuthally asymmetric cathode is C-shaped.3. The method of claim 1 , wherein the auxiliary azimuthally asymmetric cathode is in an azimuthal current flow confinement structure.4. The method of claim 1 , wherein the auxiliary ...

DENTAL IMPLANT

A dental implant including a dental implant basic body extending along a longitudinal axis from an apical end to an opposite coronal end, which includes an anchoring part facing the apical end and intended to be anchored in bone of a patient, and a head part facing the coronal end and intended to form the basis on which a suprastructure is mounted. The anchoring part includes a shaft that is substantially cylindrical or that tapers toward the apical end in a cone-like manner. At least a portion of the shaft forms a bone tissue contact region, the outer surface forming a bone tissue contact surface. Coronally to the contact region a soft tissue contact region is arranged, the outer surface forming a soft tissue contact surface. The implant further includes nanostructures formed on the soft tissue contact surface which extend in at least two dimensions to 200 nm at most. 1. A dental implant comprising a dental implant basic body extending along a longitudinal axis A from an apical end to a coronal end arranged opposite to the apical end , said dental implant basic body comprisingan anchoring part facing the apical end and intended to be anchored in bone of a patient, anda head part facing the coronal end and intended to form the basis on which a suprastructure is mounted,said anchoring part comprising a shaft having a basic form that is substantially cylindrical or that tapers in the direction toward the apical end in a cone-like manner,at least a portion of the shaft forming a bone tissue contact region the outer surface of which forming a bone tissue contact surface, andcoronally to said bone tissue contact region a soft tissue contact region being arranged, the outer surface of which forming a soft tissue contact surface,wherein the dental implant further comprises nanostructures formed on the soft tissue contact surface, said nanostructures extending in at least two dimensions to 200 nm at most.2. Dental implant according to claim 1 , wherein the soft tissue ...

PRODUCING A PRODUCT FROM A FLEXIBLE ROLLED STRIP MATERIAL

A product is made from a rolled strip material with the steps: rolling of a strip material from a sheet metal; working of a blank out of the rolled strip material; forming of the blank to a formed part; cleaning the formed part such that an amount of maximal 0.7 ppm of diffusible hydrogen is introduced into the formed part by cleaning, and coating the formed part with a metal coating material for producing a corrosion protection coating, wherein the step of coating is carried out in an immersion bath with an electrolyte solution, wherein between the formed part and the electrolyte solution a flow is generated. 116.-. (canceled)17. A method for producing a product from a rolled strip material , comprising:rolling a strip material from sheet metal;working a blank from the rolled strip material;forming the blank to a formed part;cleaning the formed part such that an amount of at most 0.7 parts per million (ppm) of diffusible hydrogen is introduced into the formed part by cleaning; andcoating at least a portion of the formed part with a metal coating material for producing a corrosion protection coating, wherein said coating is carried out in an immersion bath with an electrolytic solution,wherein a flow is generated between the formed part and the electrolytic solution.18. The method of claim 17 , wherein said cleaning is carried out by pickling.19. The method of claim 17 , wherein said cleaning is carried out mechanically.20. The method of claim 19 , wherein said cleaning is carried out by blasting or brushing.21. The method of claim 17 , wherein the rolling of the strip material is a flexible rolling claim 17 , wherein a variable thickness is produced along the length of the strip material.22. The method of claim 21 , wherein the flexible rolling is carried out such that at least two portions are produced with different thicknesses claim 21 , wherein a first thickness is smaller than a second thickness and the ratio of the first thickness to the second thickness is ...

ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD

An electroplating apparatus includes an electroplating bath including an anode installed therein and a plating solution received therein, a substrate holder configured to hold a substrate to be submerged into the plating solution and including a support surrounding the substrate and a cathode on the support to be electrically connected to a periphery of the substrate, a magnetic field generating assembly provided in the support and including at least one electromagnetic coil extending along a circumference of the substrate, and a power supply configured to current to the electromagnetic coil. 1. An electroplating apparatus , comprising:an electroplating bath including an anode and a plating solution;a substrate holder configured to hold a substrate to be submerged into the plating solution, the substrate holder including a support and a cathode on the support, the cathode configured to electrically connect to a periphery of the substrate;a magnetic field generating assembly in the support, the magnetic field generating assembly including at least one electromagnetic coil extending along a perimeter of the substrate; anda power supply configured to supply current to the at least one electromagnetic coil.2. The electroplating apparatus of claim 1 , wherein the at least one electromagnetic coil is inside the support.3. The electroplating apparatus of claim 1 , wherein the magnetic field generating assembly includes a plurality of the electromagnetic coils arranged sequentially from the periphery of the substrate.4. The electroplating apparatus of claim 3 , wherein the power supply is configured to supply a first current to a first electromagnetic coil spaced apart from the periphery of the substrate by a first distance claim 3 , and the power supply is configured to supply a second current to a second electromagnetic coil claim 3 , the second magnetic coil spaced apart from the periphery of the substrate by a second distance greater than the first distance.5. The ...

ELECTROLYTIC PROCESS USING CATION PERMEABLE BARRIER

Processes and systems for electrolytically processing a microfeature workpiece with a first processing fluid and an anode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, an anode, a second processing fluid, and a cation permeable barrier layer. The cation permeable barrier layer separates the first processing fluid from the second processing fluid while allowing certain cationic species to transfer between the two fluids. The described processes produce deposits over repeated plating cycles that exhibit deposit properties (e.g., resistivity) within desired ranges. 1. A process for electrolytically processing a microfeature workpiece as the working electrode in a first processing fluid and a counter electrode in a second processing fluid , the method comprising:(a) contacting a surface of the microfeature workpiece with the first processing fluid, the first processing fluid including at least a first metal cation;(b) contacting the counter electrode with the second processing fluid, the second processing fluid including a second metal cation;(c) allowing the second metal cation to move from the second processing fluid to the first processing fluid, but substantially preventing movement of the first metal cation from the first processing fluid to the second processing fluid; and(d) electrolytically depositing the first and second metal cations onto the surface of the microfeature workpiece.2. The process of claim 1 , wherein the first processing fluid is a catholyte.3. The process of claim 1 , wherein the second processing fluid is an anolyte.4. The process of claim 1 , wherein allowing the second metal cation to move from the second processing fluid to the first processing fluid claim 1 , but substantially preventing movement of the first metal cation from the first processing fluid to the second processing fluid includes providing a cation permeable barrier between the first processing fluid and the second ...

ENVIRONMENTALLY FRIENDLY ALUMINUM COATINGS AS SACRIFICIAL COATINGS FOR HIGH STRENGTH STEEL ALLOYS

Electroplating process is described for coating a ferrous alloy steel cathode substrate with an aluminum coating, the process comprises: a) immersing an aluminum anode substrate in a plating bath formulation comprising: a source of aluminum, an ionic liquid, a brightening agent, and a metal-salt compound; b) etching the cathode substrate by immersing it into the aluminum plating bath and conducting an anodic polarization step; c) electroplating the etched cathode substrate with the aluminum plating bath formulation; and d) rinsing with alcohol and water, and drying. Preferably, the process further comprises a heat treatment applied to the aluminum coated ferrous steel alloy obtained in step d).

METHODS AND MATERIALS FOR ELECTROPLATING ALUMINUM IN IONIC LIQUIDS

A method of depositing aluminum onto a substrate is disclosed. In this method, the substrate is disposed as cathode in an electrochemical cell with an anode and a liquid electrodeposition composition comprising an ionic liquid and a source of aluminum, and aluminum is electroplated onto the substrate. Residual water content in the electroplating bath is controlled by exposure to light in the presence of a photo-oxidation catalyst to decompose the water or species associated with water. 1. A method of depositing aluminum onto a substrate , comprisingdisposing a substrate as cathode and an anode in a electroplating bath that includes an ionic liquid and a source of aluminum;electroplating aluminum onto the substrate; andexposing the electroplating bath to light in the presence of a photo-oxidation catalyst to decompose water.2. The method of claim 1 , wherein the photo-oxidation catalyst is dissolved in the ionic liquid.3. The method of claim 1 , wherein the electroplating bath comprises a first phase comprising the ionic liquid and the source of aluminum claim 1 , and a second barrier phase between the ionic liquid phase and a gas space.4. The method of claim 3 , wherein the photo-oxidation catalyst is in the barrier phase.5. The method of claim 1 , wherein the photo-oxidation catalyst is immobilized on a catalyst support in contact with the ionic liquid.6. The method of claim 1 , wherein the photo-oxidation catalyst is a polyoxometalate claim 1 , a biochemical photo-oxidation catalyst claim 1 , metal polypyridyl photocatalysts (ruthenium bipyridine Ru(bpy)/Ru(bpy)) claim 1 , ruthenium blue dimer claim 1 , or 7 claim 1 ,7 claim 1 ,8 claim 1 ,8-tetracyanoquinodimethane.7. The method of claim 6 , wherein the photo-oxidation catalyst is a polyoxometalate.8. The method of claim 7 , wherein the polyoxometalate is a polyoxomolybdate or a Keggin structure polyoxotungstate.9. The method of claim 7 , wherein the polyoxometalate is a Keggin structure polyoxotungstate.10. The ...

MAGNETIC STRUCTURE FOR METAL PLATING CONTROL

Among other things, one or more systems and techniques for promoting metal plating profile uniformity are provided. A magnetic structure is positioned relative to a semiconductor wafer that is to be electroplated with metal during a metal plating process. In an embodiment, the magnetic structure applies a force that decreases an edge plating current by moving metal ions away from a wafer edge of the semiconductor wafer. In an embodiment, the magnetic structure applies a force that increases a center plating current by moving metal ions towards a center portion of the semiconductor wafer. In this way, the edge plating current has a current value that is similar to a current value of the center plating current. The similarity between the center plating current and the edge plating current promotes metal plating uniformity. 1. A system for promoting metal plating profile uniformity , comprising:a plating cell configured to contain a semiconductor wafer, wherein, when the semiconductor wafer is disposed within the plating cell, a first surface of the semiconductor wafer faces an anode; anda magnetic structure disposed within the plating cell between the anode and the semiconductor wafer, wherein the magnetic structure is configured to modify at least one of an edge plating current or a center plating current associated with a metal plating process for the semiconductor wafer.2. The system of claim 1 , comprising:a magnet movement component configured to move the magnetic structure in a direction parallel to the first surface of the semiconductor wafer.3. The system of claim 1 , comprising:a magnet movement component configured to move the magnetic structure in a direction perpendicular to the first surface of the semiconductor wafer.4. The system of claim 1 , comprising: move the magnetic structure in a first direction parallel to the first surface of the semiconductor wafer, and', 'move the magnetic structure in a second direction perpendicular to the first surface of ...

ELECTRODE FOR SUPEROXIDE ANION AND SENSOR INCLUDING THE SAME

An electrode for superoxide anions characterized by comprising a conductive component and, superimposed on a surface thereof, a film resulting from electrolytic polymerization of a metal thiofurylporphyrin/axial ligand complex; and a sensor for measuring a superoxide anion concentration including the same. The electrode for superoxide anions, by virtue of not only the excellent performance of electrode provided with the metal porphyrin complex polymer film, but also the presence of the axial ligand, can prevent poisoning by a catalyst poison such as hydrogen peroxide. Accordingly, in any of in vitro or in vivo environments, this electrode for superoxide anions enables detection of superoxide anion radicals without suffering any influence from a catalyst poison such as hydrogen peroxide. Moreover, quantitative assay of superoxide anions can be performed by the use of this electrode for superoxide anion in combination with a counter electrode or a reference electrode. Thus, this electrode for superoxide anions can find wide applicability in various fields. 1: An electrode for superoxide anions comprising a film produced by electrolytic polymerization of a metal thiofurylporphyrin/axial ligand complex formed on the surface of a conductive component.217-. (canceled) This application is a continuation of U.S. application Ser. No. 13/270,608, filed on Oct. 11, 2011, which is a continuation of U.S. application Ser. No. 10/592,469, filed on Nov. 12, 2007, which is a national stage entry under 35 U.S.C. 371 of international patent application PCT/JP2004/003259, filed on Mar. 12, 2004, the entire content of which is incorporated by reference.The present invention relates to an electrode for superoxide anions such as in vivo superoxide anion radicals (O) and to a sensor for measuring the concentration of the superoxide anions using the electrode. More specifically, the present invention relates to an electrode for superoxide anions that can be applied in vivo without being ...

METHOD AND APPARATUS FOR MANUFACTURING ELECTROPLATED STEEL SHEET

A method for manufacturing an electroplated steel sheet by continuously performing electroplating on a steel sheet, the method including disposing a slit gas nozzle having an ejection port having a width wider than a width of the steel sheet in a width direction of the steel sheet on a side of an exit of an electroplating cell for the steel sheet to pass through, and ejecting a gas through the slit gas nozzle toward the steel sheet. 1. A method for manufacturing an electroplated steel sheet by continuously performing electroplating on a steel sheet , the method comprising: disposing a slit gas nozzle having an ejection port having a width wider than a width of the steel sheet in a width direction of the steel sheet on a side of an exit of an electroplating cell for the steel sheet to pass through , and ejecting a gas through the slit gas nozzle toward the steel sheet.2. The method for manufacturing an electroplated steel sheet according to claim 1 , wherein the electroplating cell is a horizontal flow cell claim 1 , and wherein the slit gas nozzle is disposed on each side of front and back surfaces of the steel sheet downstream of conductor rolls disposed on the side of the exit for the steel sheet to pass through.3. The method claim 1 , for manufacturing an electroplated steel sheet according to claim 1 , wherein the electroplating cell is a vertical flow cell claim 1 , and wherein the slit gas nozzle is disposed on each side of front and back surfaces of the steel sheet upstream of conductor rolls disposed on the side of the exit for the steel sheet to pass through.4. The method for manufacturing an electroplated steel sheet according to claim 1 , wherein the electroplating cell is a radial cell claim 1 , and wherein the slit gas nozzle is disposed on each side of front and back surfaces of the steel sheet downstream of a conductor roll.5. A method for manufacturing an electroplated steel sheet by continuously performing electroplating on a steel sheet claim 1 , ...

Metal Plating Apparatus and Method Using Solenoid Coil

A metal plating apparatus includes a chemical bath chamber, an anode disposed at a bottom portion of the chemical bath chamber, and a cathode disposed at a top portion of the chemical bath chamber. A solenoid coil is disposed within the chemical bath chamber between the anode and the cathode. The solenoid coil is arranged to apply a magnetic field during a metal plating process in a direction from the anode to the cathode. 1. A metal plating apparatus , comprising:a chemical bath chamber;an anode disposed at a bottom portion of the chemical bath chamber;a cathode disposed at a top portion of the chemical bath chamber; anda solenoid coil, wherein the solenoid coil is disposed within the chemical bath chamber between the anode and the cathode;wherein the solenoid coil is arranged to apply a magnetic field during a metal plating process in a direction from the anode to the cathode.2. The metal plating apparatus of claim 1 , further comprising an anode chamber disposed within the chemical bath chamber and inside the solenoid coil claim 1 , wherein the anode chamber has a side wall that surrounds the anode.3. The metal plating apparatus of claim 2 , further comprising a mesh cover over the anode chamber.4. The metal plating apparatus of claim 3 , wherein the mesh cover comprises hydrophilic polyethylene.5. The metal plating apparatus of claim 1 , further comprising a metal block disposed between the anode and the cathode claim 1 , wherein the metal block has at least one hole to allow movement of an electrolyte in the chemical bath chamber through the at least one hole.6. The metal plating apparatus of claim 5 , wherein the metal block comprises iron claim 5 , nickel claim 5 , iron-aluminum alloy claim 5 , cobalt claim 5 , low carbon steel claim 5 , or any combination thereof.7. The metal plating apparatus of claim 5 , wherein the permeability of the metal block is at least 100 H/m.8. The metal plating apparatus of claim 5 , wherein the metal block is Teflon coated.9. ...

Metal Deposition Process Using Electroplasma

A process for treating a surface of an electrically conductive workpiece is provided, comprising placing a movable workpiece within a reaction chamber, wherein the reaction chamber includes an anode, and wherein the workpiece is a cathode; creating a gap between the anode and the cathode, wherein the anode includes a plurality of orifices; applying an aqueous electrolyte into the reaction chamber through the orifices in the anode and onto the workpiece, and applying the aqueous electrolyte from below the workpiece, to establish an electrically conductive medium around the workpiece, applying a DC voltage to the electrically conductive medium in excess of 30 VDC, such that a foam is formed within the reaction chamber, wherein the foam comprises a gas/vapor phase and a liquid phase which fills the entire reaction chamber; adjusting the voltage to establish an electro-plasma discharge between the anode and workpiece, sufficient to cause positive ions in the electrically conductive medium to become concentrated near the surface of the workpiece and cause micro-zonal melting of the surface in the area of discreet plasma bubbles; and moving the workpiece through the reaction chamber and away from the electrically conductive medium to allow re-freezing of the molten surface of the workpiece. The process applies to both cleaning and coating of the workpiece, wherein coating is achieved via sacrificial anodes. 1. A process for treating a surface of an electrically conductive workpiece , comprising:(a) placing a movable workpiece within a reaction chamber, wherein the reaction chamber includes an anode, and wherein the workpiece is a cathode;(b) creating a gap between the anode and the cathode, wherein the anode includes a plurality of orifices;(c) applying an aqueous electrolyte into the reaction chamber through the orifices in the anode and onto the workpiece, and applying the aqueous electrolyte from below the workpiece, to establish an electrically conductive medium ...

ELECTROPLATING SYSTEMS AND METHODS

An electroplating system includes an enclosure with an interior, an anode lead extending through the enclosure and into the interior, and a porous body. The porous body is supported within the interior of the enclosure for coupling an electroplating solution within the interior with a workpiece. A conduit extends through the enclosure and into the interior of the enclosure to provide a flow of nitrogen enriched air to the interior of enclosure for drying and removing oxygen from the electroplating solution. 1. An electroplating apparatus , comprising:an enclosure for water sensitive electrolytes having an interior and a plurality of ports for circulating dry inerting gas and electrolyte through the enclosure interior; andan air separation module in fluid communication with the enclosure interior for supplying the dry inerting gas to the enclosure interior; anda porous body supported within the enclosure interior.2. The apparatus as recited in claim 1 , wherein the dry inerting gas is dry nitrogen enriched air generated in-situ with the air separation module.3. The apparatus as recited in claim 1 , wherein the air separation module includes a membrane configured to remove oxygen and moisture from compressed air provided thereto.4. The apparatus as recited in claim 1 , wherein the electrolyte comprises a chloroaluminate ionic liquid.5. The apparatus as recited in claim 1 , wherein the electrolyte comprises a sold lubricant dispersed within the electrolyte.6. The apparatus as recited in claim 1 , wherein the ports include an inerting gas inlet port arranged below a surface of liquid electrolyte contained within the enclosure interior.7. The apparatus as recited in claim 6 , wherein the ports include a vent port arranged above the surface of the liquid electrolyte contained within the enclosure interior.8. The apparatus as recited in claim 1 , further comprising a recirculation module in fluid communication with the enclosure interior.9. The apparatus as recited in ...

ELECTROPLATING SYSTEMS AND METHODS

An electroplating system includes an enclosure with an interior, an anode lead extending through the enclosure and into the interior, and a porous body. The porous body is supported within the interior of the enclosure for coupling an electroplating solution within the interior with a workpiece. A conduit extends through the enclosure and into the interior of the enclosure to provide a flow of nitrogen enriched air to the interior of enclosure for drying and removing oxygen from the electroplating solution. 1. An electroplating apparatus , comprising:an enclosure for water sensitive electrolytes having an interior and a plurality of ports for circulating dry inerting gas and electrolyte through the enclosure interior; andan air separation module in fluid communication with the enclosure interior for supplying the dry inerting gas to the enclosure interior; anda porous body supported within the enclosure interior.2. The apparatus as recited in claim 1 , wherein the dry inerting gas is dry nitrogen enriched air generated in-situ with the air separation module.3. The apparatus as recited in claim 1 , wherein the air separation module includes a membrane configured to remove oxygen and moisture from compressed air provided thereto.4. The apparatus as recited in claim 1 , wherein the electrolyte comprises a chloroaluminate ionic liquid.5. The apparatus as recited in claim 1 , wherein the electrolyte comprises a sold lubricant dispersed within the electrolyte.6. The apparatus as recited in claim 1 , wherein the ports include an inerting gas inlet port arranged below a surface of liquid electrolyte contained within the enclosure interior.7. The apparatus as recited in claim 6 , wherein the ports include a vent port arranged above the surface of the liquid electrolyte contained within the enclosure interior.8. The apparatus as recited in claim 1 , further comprising a recirculation module in fluid communication with the enclosure interior.9. The apparatus as recited in ...

SYSTEMS, METHODS, AND ANODES FOR ENHANCED IONIC LIQUID BATH PLATING OF TURBOMACHINE COMPONENTS AND OTHER WORKPIECES

Ionic liquid bath plating systems, methods, and plating anodes are provided for depositing metallic layers over turbomachine components and other workpieces. In an embodiment, the method includes placing workpieces in a plurality of cell vessels such that the workpieces are at least partially submerged in plating solution baths, which are retained within the cell vessels when the plating system is filled with a selected non-aqueous plating solution. After plating anodes are positioned adjacent the workpieces in the plating solution baths, the plurality of cell vessels are enclosed with lids such that the plurality of cell vessels contain vessel headspaces above the plating solution baths. A first purge gas is then injected into the plurality of cell vessels to purge the vessel headspaces. The workpieces and the plating anodes are then energized to deposit metallic layers on selected surfaces of the workpieces utilizing an ionic liquid bath plating process. 1. A method for plating a turbomachine component including a plurality of airfoils , the method comprising:obtaining a multi-airfoil plating anode from which a plurality of anode fingers extends;positioning the multi-airfoil plating anode adjacent the turbomachine component such that the plurality of anode fingers is received between the plurality of airfoils of the turbomachine component in a non-contacting relationship;at least partially submerging the multi-airfoil plating anode and the turbomachine component in a plating solution bath; andapplying an electrical potential between the multi-airfoil plating anode and the turbomachine component to deposit metallic layers over the plurality of airfoils utilizing an ionic liquid bath plating process.2. The method of further comprising selecting the multi-airfoil plating anode to include a plating anode centerline about which the plurality of anode fingers twists.3. The method of wherein positioning comprises moving the multi-airfoil plating anode relative to the ...

Localized, in-vacuum modification of small structures

A charge transfer mechanism is used to locally deposit or remove material for a small structure. A local electrochemical cell is created without having to immerse the entire work piece in a bath. The charge transfer mechanism can be used together with a charged particle beam or laser system to modify small structures, such as integrated circuits or micro-electromechanical system. The charge transfer process can be performed in air or, in some embodiments, in a vacuum chamber.

METHOD FOR DEPOSITING A COPPER SEED LAYER ONTO A BARRIER LAYER AND COPPER PLATING BATH

The present invention relates to a method for providing a copper seed layer on top of a barrier layer wherein said seed layer is deposited onto said barrier layer from an aqueous electroless copper plating bath comprising a water-soluble source for Cu(II) ions, a reducing agent for Cu(II) ions, at least one complexing agent for Cu(II) ions and at least one source for hydroxide ions selected from the group consisting of RbOH, CsOH and mixtures thereof. The resulting copper seed layer has a homogeneous thickness distribution and a smooth outer surface which are both desired properties. 1. A method for providing a copper seed layer on top of a barrier layer comprising , in this order , the steps of(i) providing a substrate comprising at least on a portion of the outer surface a barrier layer, a. a water-soluble source for Cu(II) ions,', 'b. a reducing agent for Cu(II) ions,', 'c. at least one complexing agent for Cu(II) ions and', 'd. at least one source for hydroxide ions selected from the group consisting of RbOH, CsOH and mixtures thereof., '(ii) contacting said substrate with an aqueous electroless copper plating bath which comprises'}2. The method for providing a copper seed layer on top of a barrier layer according to wherein the substrate material is selected from the group consisting of silicon claim 1 , a low-κ-dielectric material on a silicon substrate and glass.3. The method for providing a copper seed layer on top of a barrier layer according to wherein the barrier layer is selected from the group consisting of cobalt claim 1 , nickel claim 1 , ruthenium claim 1 , tungsten claim 1 , tantalum claim 1 , titanium claim 1 , iridium claim 1 , rhodium and alloys of the aforementioned.4. The method for providing a copper seed layer on top of a barrier layer according to wherein the electroless copper plating bath utilized in step (ii) is substantially free of Na and K ions.5. The method for providing a copper seed layer on top of a barrier layer according to ...

ELECTRICALLY PROGRAMMABLE FUSE STRUCTURE AND FABRICATION METHOD THEREOF

A method for fabricating an electrically programmable fuse structure is provided. The method includes providing a substrate. The method also includes forming an anode and a cathode on the substrate. Further, the method includes forming a fuse between the anode and the cathode and having an anode-connecting-end connecting with the anode and a cathode-connecting-end connecting with the cathode over the substrate. Further, the method also includes forming a compressive stress region in the cathode-connecting-end, wherein the anode-connecting-end has a tensile stress region. 1. A method for fabricating an electrically programmable fuse structure , comprising:providing a substrate;forming an anode and a cathode on the substrate;forming a fuse between the anode and the cathode and having an anode-connecting-end connecting with the anode and a cathode-connecting-end connecting with the cathode over the substrate; andforming a compressive stress region in the cathode-connecting-end, wherein the anode-connecting-end has a tensile stress region.2. The method according to claim 1 , wherein:the anode-connecting-end is lightly doped with one of phosphorous ions, arsenic ions and boron ions to form the tensile stress region in the anode-connecting-end.3. The method according to claim 2 , wherein:a doping concentration of the compressive stress region is greater than a doping concentration of the tensile stress region.4. The method according to claim 3 , wherein:{'sup': 2', '2, 'a doping concentration difference between the compressive stress region and the tensile stress region is in a range of approximately 1E15 atom/cm˜1E17 atom/cm.'}5. The method according to claim 1 , wherein forming the fuse further comprises:forming a first material layer on the substrate; andforming a second material layer on first material layer,wherein the first material layer and the second material form the fuse.6. The method according to claim 5 , wherein:the first material layer is a polysilicon ...

Providing Traffic Warnings to a User Based on Return Journey

Systems and methods for generating return journey notifications include obtaining a request for navigational directions to a target destination. An outbound journey route from an initial location to the target destination can be determined, wherein the outbound journey route includes an estimated outbound journey time. A return journey route from the target destination to a return destination can be determined, wherein the return journey route includes an estimated return journey time. The outbound journey route and/or return journey route can be determined at least in part from one or more of current traffic conditions or historical traffic conditions. One or more notifications regarding the return journey route can be generated when comparing the estimated outbound journey time to the estimated return journey time results in a determination that one or more predetermined criteria are met.

PREPARATION METHOD OF MINIATURE INTELLIGENT CALCIUM ALGINATE HYDROGEL END OPERATOR

A preparation method of a miniature intelligent calcium alginate hydrogel end operator based on different microelectrodes is introduced. The method includes an electrodeposition step of depositing a deposition solution under the action of a non-uniform magnetic field to form an anode surface; a processing step of transferring obtained hydrogel microstructures to a calcium chloride solution, making the hydrogel microstructure self-wind sufficiently; and a pickup step of collecting a self-winding single-layer film alginate microstructure in a culture dish, and placing it in specific environment for preservation. The preparation method can provide a degradable and convenient micro-operator, which could be locally prepared into different function components. 1. A preparation method of a degradable and self-winding miniature intelligent calcium alginate hydrogel end operator , comprising: electrodeposition , processing and pickup.2. The preparation method of a degradable and self-winding miniature intelligent calcium alginate hydrogel end operator according to claim 1 , characterized in that: the electrodeposition step further comprises:a1: coating a photoresist on an FTO glass by a spin coater, and forming a concave pattern with a specific shape on the FTO glass as an anode;a2: filling a deposition solution between two electrodes and maintaining the deposition solution by insulating spacers with a height of 1 mm;a3: applying direct voltage to the electrodes for 1 to 5 seconds; anda4: washing the anode in an HEPES buffer solution for 5 minutes until all hydrogel microstructures are separated from the FTO glass.3. The preparation method of a degradable and self-winding miniature intelligent calcium alginate hydrogel end operator according to claim 1 , characterized in that the electrodeposition step further comprises:a1: coating the photoresist on the FTO glass by the spin coater, and forming the concave pattern with the specific shape on the FTO glass as the anode;a2: ...

COMPOSITE MATERIAL, METHOD FOR FORMING THE COMPOSITE MATERIAL, ELECTRODE PLATED WITH THE COMPOSITE MATERIAL, AND CONNECTION STRUCTURE HAVING THE COMPOSITE MATERIAL

A composite material includes a metal material having conductivity and an oxidation inhibitor mixed with the metal material. The oxidation inhibitor forms a complex with the metal material to exert a resistance to oxidation of the metal material. For example, the composite material is formed on a surface of a base material as a plating material. As another example, the composite material is plated on a surface of an electrode.

Electrochemical Devices Comprising Compressed Gas Solvent Electrolytes

Disclosed are novel electrolytes, and techniques for making and devices using such electrolytes, which are based on compressed gas solvents. Unlike conventional electrolytes, disclosed electrolytes are based on “compressed gas solvents” mixed with various salts, referred to as “compressed gas electrolytes.” Various embodiments of a compressed gas solvent includes a material that is in a gas phase and has a vapor pressure above an atmospheric pressure at a room temperature. The disclosed compressed gas electrolytes can have wide electrochemical potential windows, high conductivity, low temperature capability and/or high pressure solvent properties. Examples of a class of compressed gases that can be used as solvent for electrolytes include hydrofluorocarbons, in particular fluoromethane, difluoromethane, tetrafluoroethane, pentafluoroethane. Also disclosed are battery and supercapacitor structures that use compressed gas solvent-based electrolytes, techniques for constructing such energy storage devices. Techniques for electroplating difficult-to-deposit materials using compressed gas electrolytes as an electroplating bath are also disclosed. 1. A method for electrodepositing a deposit material on an electrode , the method comprising:preparing an electrodepositing bath comprised of a compressed gas electrolyte made up of a mixture of a compressed gas solvent and one or more types of salts;immersing a target electrode in the compressed gas electrolyte;immersing a donor electrode comprised of the deposit material in the compressed gas electrolyte; andtransferring the deposit material from the donor electrode to the target electrode through the compressed gas electrolyte by applying a voltage across the target and donor electrodes.2. The method of claim 1 , wherein the target electrode is comprised of a difficult-to-electroplate material that is selected from the group of: Ti claim 1 , Zr claim 1 , Nb claim 1 , Mo claim 1 , Hf claim 1 , Ta claim 1 , W claim 1 , Re claim ...

Aluminum plating apparatus and method for producing aluminum film using same

The invention offers an aluminum-plating apparatus that can satisfactorily form an aluminum plating even on the surface of a base body that has a surface on which an insulating or poorly conductive metal oxide film or the like is formed. The aluminum-plating apparatus electrodeposits aluminum onto a base body by conveying the base body in a plating bath. The plating bath is divided into a first electrolysis chamber and a second electrolysis chamber by a partition plate in this order from the upstream side in the conveying direction for the base body. In the first electrolysis chamber, a negative electrode provided in the chamber is electrically connected with the base body such that the base body acts as a positive electrode. In the second electrolysis chamber, a positive electrode provided in the chamber is electrically connected with the base body such that the base body acts as a negative electrode.

Electroplating apparatus with membrane tube shield

An electroplating apparatus has one or more membrane tube rings which act as electric field shields, to provide advantageous plating characteristics at the perimeter of a work piece. The membrane tube rings may be filled with fluids having different conductivity, to change the shielding effect as desired for electroplating different types of substrates. The membrane tube rings may optionally be provided in or on a diffuser plate in the vessel of the apparatus.

METHOD OF REMOVING LIQUID FROM SEAL OF A SUBSTRATE HOLDER

A method capable of removing a liquid from a seal of a substrate holder so as to prevent contact between the liquid and an electrical contact of the substrate holder is provided. The method includes: immersing the substrate in a plating solution, with a seal and an electrical contact of the substrate holder in contact with the substrate; applying a voltage between the substrate and an anode in the presence of the plating solution to plate the substrate; pulling up the plated substrate from the plating solution; separating the seal from the plated substrate; and forming a flow of gas passing through a gap between the plated substrate and the seal, the flow of gas being directed from an inside to an outside of the substrate holder. 1. A method of plating a substrate with use of a substrate holder , comprising:immersing the substrate in a plating solution, with a seal and an electrical contact of the substrate holder in contact with the substrate;applying a voltage between the substrate and an anode in the presence of the plating solution to plate the substrate;pulling up the plated substrate from the plating solution;separating the seal from the plated substrate; andforming a flow of gas passing through a gap between the plated substrate and the seal, the flow of gas being directed from an inside to an outside of the substrate holder.2. The method according to claim 1 , wherein forming the flow of gas passing through the gap comprises forming the flow of gas passing through the gap while keeping the gap within a predetermined range.3. The method according to claim 2 , wherein forming the flow of gas passing through the gap comprises forming the flow of gas passing through the gap while keeping the gap constant.4. The method according to claim 1 , wherein separating the seal from the plated substrate comprises separating the seal from the plated substrate when an internal space of the substrate is filled with the gas having a pressure higher than an atmospheric ...

METHOD FOR COATING AND BONDING SUBSTRATES

A method for coating of a first substrate with a first diffusion bond layer by deposition of a first material which forms the first diffusion bond layer on a first surface of the first substrate such that the first diffusion bond layer forms a grain surface with an average grain diameter H parallel to the first surface smaller than 1 μm. The invention further relates to a method for bonding of a first substrate which has been coated as described above to a second substrate which has a second diffusion bond layer, the method of the bonding comprising the following steps: bring a first diffusion bond layer of a first substrate into contact with a second diffusion bond layer of a second substrate, pressing the substrates together to form a permanent metal diffusion bond between the first and second substrates. 110-. (canceled)11. A method for coating of a first substrate with a first diffusion bond layer by deposition of a first material which forms the first diffusion bond layer on a first surface of the first substrate such that the first diffusion bond layer forms a grain surface with an average grain diameter H parallel to the first surface smaller than 1 μm , wherein between the first diffusion bond layer and the first substrate at least one further intermediate layer is formed , and wherein the further intermediate layer has a larger average grain diameter H′ parallel to the first surface and a larger average grain diameter V′ transversely to the first surface.12. The method as claimed in claim 11 , wherein the first diffusion bond layer on the grain surface forms an average grain diameter V transversely to the first surface less than 1 μm.13. The method as claimed in claim 11 , wherein the first diffusion bond layer is applied with an average thickness t transversely to the first surface less than 1 μm.14. The method as claimed in claim 11 , wherein the intermediate layer is produced by an electrochemical deposition process.15. The method as claimed in claim 11 ...

TILTING MULTIPLIER

A tilting carrier assembly for a finishing process includes a load bar configured to convey a work piece relative to a work station. A skid is configured to receive the work piece. Each of a pair of links is pivotally coupled to the load bar at a first end and pivotally coupled to the skid at an opposite second end. A horizontal span between the first ends of the pair of links is substantially greater than a horizontal span between the second ends of the pair of links. 1. A method of operating a tilting carrier assembly , the method comprising:operating a conveyor in a primary direction of travel;conveying a work piece with a load bar along the primary direction of travel relative to a work station, wherein the load bar is coupled to the conveyor with first and second couplings that are laterally spaced transverse to the primary direction of travel;providing a skid configured to receive the work piece;providing a pair of links, each of the links being pivotally coupled to the load bar at a first end and pivotally coupled to the skid at an opposite second end; andtilting the load bar to a first angle relative to horizontal; andin response to tilting the load bar to the first angle, tilting of the skid to a second angle relative to horizontal, the second angle being greater than the first angle.2. The method of claim 1 , wherein the pair of links is configured so that tilting of the load bar to a first angle relative to horizontal results in tilting of the skid to a second angle relative to horizontal claim 1 , the second angle being at least 50 percent greater than the first angle.3. The method of claim 1 , wherein the pair of links is configured so that tilting of the load bar to a first angle relative to horizontal results in tilting of the skid to a second angle relative to horizontal claim 1 , the second angle being at least twice the first angle.4. The method of claim 1 , wherein the pair of links is configured so that tilting of the load bar to a first angle ...

PLATING METHOD

A method of plating a substrate, such as a wafer, by applying a voltage between the substrate and an anode is disclosed. The plating method includes: preparing a substrate having a recess formed in a surface thereof, a conductive layer being formed in at least a part of the recess; placing an insoluble anode and the substrate in contact with a copper sulfate plating solution containing an additive; applying a predetermined plating voltage between the substrate and the insoluble anode by a plating power source to plate the substrate; and shutting off a reverse electric current, which flows from the insoluble anode to the substrate via the plating power source, by a diode disposed between the insoluble anode and the substrate when the predetermined plating voltage is not applied. 1. A method for plating a substrate while preventing a generation of an electrolyte component which inhibits bottom-up plating of the substrate , comprising:preparing a substrate having a recess formed in a surface thereof, a conductive layer being formed in at least a part of the recess;placing an insoluble anode and the substrate in contact with a copper sulfate plating solution containing an additive;applying a predetermined plating voltage between the substrate and the insoluble anode by a plating power source to plate the substrate; andapplying a forward voltage, which is lower than the predetermined plating voltage, between the substrate and the insoluble anode when the predetermined plating voltage is not applied, thereby decreasing a reverse electric current which flows from the insoluble anode to the substrate via the plating power source.2. The method according to claim 1 , wherein the forward voltage is applied by the plating power source.3. The method according to claim 1 , wherein the forward voltage is applied by an auxiliary power source which is coupled in parallel with the plating power source.4. The method according to claim 1 , wherein an inert gas is supplied into the ...

Method and apparatus for manufacturing particles

Disclosed embodiments provide a method and apparatus for continuous production of micro/nanoscale particles using roll-to-roll manufacturing in combination with electroplating. The roll-to-roll process can move a mechanically flexible reel stock material along rotating elements designed to position the material for various additive, subtractive, and modification processes. In accordance with at least one embodiment, processes applied at various stations may include sputtering, electroplating, and/or etching.

HIGHLY MAGNETICALLY PERMEABLE ALLOY DEPOSITION METHOD FOR MAGNETIC SENSORS

In one example, a method to manufacture a magnetic sensor, comprises providing an electrolyte solution, submersing a substrate in the electrolyte solution, submersing a plurality of ingots in the electrolyte solution, wherein the ingots comprises a metal that is magnetic, and depositing the metal on the substrate by applying a voltage between the metal ingot and the substrate to result in magnetic alloy layer on the substrate. Other examples and related methods are also disclosed herein. 1. A method to manufacture a magnetic sensor , comprising:providing an electrolyte solution;submersing a substrate in the electrolyte solution;submersing a plurality of ingots in the electrolyte solution, wherein the ingots comprises a metal that is magnetic; anddepositing the metal on the substrate by applying a voltage between the metal ingot and the substrate to result in magnetic alloy layer on the substrate.2. The method of claim 1 , wherein some of the ingots comprise nickel and some of the ingots comprise iron.3. The method of claim 2 , wherein the ingots comprise a ratio of nick in an approximately 80 percent atomic quantity and iron in an approximately 20 percent atomic quantity.4. The method of claim 2 , wherein nickel iron are co-deposited on the substrate claim 2 ,5. The method of claim 1 , wherein the metal deposited on the substrate comprises an alloy material having high magnetic permeability.6. The method of claim 1 , wherein the substrate comprises phosphorous doped silicon.7. The method of claim 1 , wherein the substrate comprises glass.8. The method of claim 7 , further comprising etching the glass substrate to micro-roughen a surface of the glass substrate prior to submersing the substrate in the electrolyte solution.9. The method of claim 1 , further comprising rotating the substrate during said depositing the metal on the substrate.10. The method of claim 1 , further comprising agitating the electrolyte solution during said depositing the metal on the substrate ...

NICKEL SOLUTION FOR FORMING FILM AND FILM-FORMING METHOD USING SAME

Provided is a nickel solution for forming a film that can suppress generation of hydrogen gas between a solid electrolyte membrane and a substrate while the solid electrolyte membrane and the substrate are brought into contact with each other. Specifically, provided is a nickel solution for forming a film, the nickel solution being adapted to, when disposing a solid electrolyte membrane between an anode and a substrate that functions as a cathode, bringing the solid electrolyte membrane into contact with the substrate and applying a voltage across the anode and the substrate so as to deposit nickel onto a surface of the substrate from nickel ions contained in the solid electrolyte membrane, thereby forming a nickel film containing the nickel on the surface of the substrate, supply the nickel ions to the solid electrolyte membrane. The pH of the nickel solution for forming a film is in the range of 4.2 to 6.1. The nickel solution for forming a film further contains a pH buffer solution that has a buffer function in the range of the pH and does not form insoluble salts or complexes with the nickel ions during formation of the film. 1. A nickel solution for forming a film , the nickel solution being adapted to , when disposing a solid electrolyte membrane between an anode and a substrate that functions as a cathode , bringing the solid electrolyte membrane into contact with the substrate and applying a voltage across the anode and the substrate so as to deposit nickel onto a surface of the substrate from nickel ions contained in the solid electrolyte membrane , thereby forming a nickel film containing the nickel on the surface of the substrate , supply the nickel ions to the solid electrolyte membrane , whereina pH of the nickel solution for forming a film is in a range of 4.2 to 6.1, andthe nickel solution for forming a film further contains a pH buffer solution, the pH buffer solution having a buffer function in the range of the pH and not forming insoluble salts or ...

ALUMINUM PLATING AT LOW TEMPERATURE WITH HIGH EFFICIENCY

The present disclosure generally relates to methods of electro-depositing a crystalline layer of pure aluminum onto the surface of an aluminum alloy article. The methods may include positioning the article and an electrode in an electro-deposition solution. The electro-deposition solution includes one or more of an aluminum halide, an organic chloride salt, an aluminum reducing agent, a solvent such as a nitrile compound, and an alkali metal halide. The solution is blanketed with an inert gas, agitated, and a crystalline layer of aluminum is deposited on the article by applying a bias voltage to the article and the electrode. 1. A method of depositing aluminum , comprising: an aluminum halide;', 'an organic chloride salt; and', 'an aluminum reducing agent;, 'positioning an article, formed of an aluminum alloy, in an electro-deposition solution, the electro-deposition solution comprisingblanketing the electro-deposition solution with an inert gas;agitating the electro-deposition solution;creating an electrical current between an electrode disposed in the electro-deposition solution and the article; anddepositing an aluminum layer onto one or more surfaces of the article.2. The method of claim 1 , wherein the organic chloride salt is imidazolium chloride claim 1 , 1-butyl-3-methylimidazolium chloride claim 1 , 1-ethyl-3-methylimidazolium chloride claim 1 , 1-ethyl-3-methyl imidazolium chloride claim 1 , 1-(1-butyl)pyridinium chloride claim 1 , or a combination thereof.3. The method of claim 2 , wherein the aluminum halide is AlF claim 2 , AlCl claim 2 , AlBr claim 2 , AlI claim 2 , or a combination thereof.4. The method of claim 3 , wherein an aluminum halide concentration is between about 1 Mol/L and about 3 Mol/L.5. The method of claim 3 , wherein the electro-deposition solution further comprises a solvent consisting of acetonitrile claim 3 , pyrrole claim 3 , propionitrile claim 3 , butyronitrile claim 3 , pyridine claim 3 , or a combination thereof.6. The method ...

Manufacturing method of circuit board assembly for high frequency signal transmission

A manufacturing method of copper foil and circuit board assembly for high frequency transmission are provided. Firstly, a raw copper foil having a predetermined surface is produced by an electrolyzing process. Subsequently, a roughened layer including a plurality of copper particles is formed on the predetermined surface by an arsenic-free electrolytic roughening treatment and an arsenic-free electrolytic surface protection treatment. Thereafter, a surface treatment layer is formed on the roughened layer, and the roughened layer is made of a material which includes at least one kind of non-copper metal elements and the concentration of the non-copper metal elements is smaller than 400 ppm. By controlling the concentration of the non-copper elements, the resistance of the copper foil can be reduced.

METHOD FOR ELECTRODEPOSITION ON A CONDUCTIVE PARTICULATE SUBSTRATE

The present invention relates to a method of electrodepositing a metal on an electrically conductive particulate substrate. There is provided a method of electrodepositing a metal on an electrically conductive particulate substrate comprising the steps of: (i) providing a cathode; (ii) providing an anode formed from the metal to be electrodeposited; (iii) providing the substrate, cathode and anode within an electrodeposition bath comprising an electrolyte; and (iv) providing a voltage between said anode and cathode causing metal ions to flow from the anode to the cathode, wherein a separator is provided between the anode and the cathode. 1. A method of electrodepositing a metal on an electrically conductive particulate substrate comprising the steps of:providing a cathode;providing an anode formed from the metal to be electrodeposited;locating the substrate, cathode and anode within an electrodeposition bath comprising an electrolyte; andapplying a voltage between said anode and cathode, thereby causing metal ions to flow from the anode to the cathode.2. The method according to claim 1 , wherein a separator is provided between the anode and the cathode.3. The method according to claim 2 , wherein said separator is a semipermeable membrane.4. The method according to claim 2 , wherein said separator is an organic liquid which is immiscible with the aqueous electrolyte claim 2 , said separator and aqueous electrolyte thereby forming a biphasic system comprising two immiscible liquids.5. The method according to claim 1 , wherein the substrate has an average longest dimension of less than 10 mm.6. The method according to claim 5 , wherein the substrate is a nano-scaled carbon particulate.7. The method according to claim 1 , further comprising applying agitation using at least one agitation device claim 1 , thereby preventing particle agglomeration.8. The method according to claim 1 , wherein the electrodeposited metal is a ferromagnetic metal.9. The method according to ...

Substrate treatment apparatus, controller of substrate treatment apparatus, method for controlling substrate treatment apparatus, and memory medium storing program

A substrate treatment apparatus includes a plurality of treatment chambers performing different treatment types on a substrate; a transfer device; and a controller that controls the transfer of the substrate and the substrate treatment. The controller enables fixation of a time for pulling up the substrate for each treatment chambers/treatment type and creation of a transfer schedule for transferring the substrate among the plurality of treatment chambers/treatment types and treating the substrate so as to maximize throughput, and enables correction of the transfer schedule to extend, based on a waiting time of the transfer device after storage of the substrate into a treatment chamber of one treatment type and a waiting time of the treatment chamber after treatment of the substrate, a time required for pulling up the substrate from a treatment chamber of an immediately previous treatment type in transfer order of the substrate.

APPARATUS FOR USE IN AN ELECTROETCHING OR ELECTRODEPOSITION PROCESS AND AN ELECTROETCHING OR ELECTRODEPOSITION PROCESS

There is disclosed an apparatus for use in an electroetching or electrodeposition process in which material is etched from or deposited onto the surface of an electrically conductive component. The apparatus comprises a support for supporting the component within a tank containing an electrolytic solution; and a first-polarity electrode arranged to be located within the tank and immersed in the electrolytic solution and shaped to surround at least a part of the component in a contactless manner. In use, an electric field produced by the first-polarity electrode results in an electric variance between at least a part of the component and a second-polarity electrode having a polarity opposite to that of the first-polarity electrode. An electroetching and an electrodeposition process are also disclosed. 1. An apparatus for use in an electroetching or electrodeposition process in which material is etched from or deposited onto the surface of an electrically conductive component , the apparatus comprising:a support for supporting the component within a tank containing an electrolytic solution; anda first-polarity electrode arranged to be located within the tank and immersed in the electrolytic solution and shaped to surround at least a part of the component in a contactless manner such that in use an electric field produced by the first-polarity electrode results in an electric variance between at least a part of the component and a second-polarity electrode having a polarity opposite to that of the first-polarity electrode.2. An apparatus according to claim 1 , wherein the first-polarity electrode comprises first and second side limbs spaced apart to at least partly define an electrode space arranged to receive at least a part of the component.3. An apparatus according to claim 1 , wherein the first-polarity electrode defines an electrode space and wherein the shape of a cross-section of the first-polarity electrode space corresponds to the shape of a cross-section of ...

PLATING METHOD, BUBBLE EJECTION MEMBER, PLATING APPARATUS, AND DEVICE

A method that can plate a predetermined position on various plating targets without implementing a pretreatment thereon is provided. A plating method is performed on a plating target using a plating solution, and the plating method includes at least a bubble ejection step of ejecting a bubble generated by a bubble ejection member to a plating solution. The bubble ejection member includes an electrode formed of a conductive material and an insulating material covering at least a part of the electrode, at least a part of the insulating material forms a bubble ejection port, and an air gap surrounded by the insulating material is formed between at least a part of the electrode and the bubble ejection port. 1. A plating method performed on a plating target using a plating solution , the plating method comprising at least:a bubble ejection step of ejecting a bubble generated by a bubble ejection member to a plating solution,wherein the bubble ejection member includesan electrode formed of a conductive material, andan insulating material covering at least a part of the electrode, andwherein at least a part of the insulating material forms a bubble ejection port, and an air gap surrounded by the insulating material is formed between at least a part of the electrode and the bubble ejection port.2. The plating method according to claim 1 ,wherein the plating solution contains metal ions, andwherein the metal ions in the plating solution are converted into a metal by ejecting a bubble generated by the bubble ejection member to the plating solution in the bubble ejection step.3. The plating method according to claim 1 , wherein the plating solution contains metal nanoparticles.4. The plating method according to claim 1 , wherein the bubble ejection step forms a recess in the plating target by the ejected bubble claim 1 , and a metal is formed inside the recess.5. The plating method according to claim 1 , wherein the bubble ejection step forms a metal on the plating target ...

ELECTROCHEMICAL DEVICES COMPRISING COMPRESSED GAS SOLVENT ELECTROLYTES

Disclosed are novel electrolytes, and techniques for making and devices using such electrolytes, which are based on compressed gas solvents. Unlike conventional electrolytes, disclosed electrolytes are based on “compressed gas solvents” mixed with various salts, referred to as “compressed gas electrolytes.” Various embodiments of a compressed gas solvent includes a material that is in a gas phase and has a vapor pressure above an atmospheric pressure at a room temperature. The disclosed compressed gas electrolytes can have wide electrochemical potential windows, high conductivity, low temperature capability and/or high pressure solvent properties. 1. An electrochemical device , comprising:an ionically conducting electrolyte comprising a compressed gas solvent and one or more types of salts, wherein the compressed gas solvent includes a material that is in a gas phase and has a vapor pressure above an atmospheric pressure at a room temperature;a housing enclosing the ionically conducting electrolyte and structured to provide a pressurized condition to the compressed gas solvent; anda pair of conducting electrodes in contact with the ionically conducting electrolyte.2. The electrochemical device of claim 1 , wherein the ionically conducting electrolyte includes a mixture of two or more types of solvents including the compressed gas solvent and at least one liquid solvent.3. The electrochemical device of claim 1 , wherein the ionically conducting electrolyte includes a mixture of two or more types of solvents including at least two types of compressed gas solvents.4. The electrochemical device of claim 1 , wherein each of the one or more types of salts is in either solid or liquid form before mixing with the compressed gas solvent.5. The electrochemical device of claim 1 , wherein the compressed gas solvent has a boiling point temperature less than room temperature of 293.15 K.6. The electrochemical device of claim 1 , wherein the compressed gas solvent is in a liquid ...

Fabricating Porous Metallic Coatings Via Electrodeposition and Compositions Thereof

A method is provided for creating a porous coating on a surface of a substrate by electrodeposition. The substrate is a part of the cathode. An anode is also provided. A coating is deposited or disposed on the surface by applying a voltage that creates a plurality of porous structures on the surface to be coated. Continuing to apply a voltage creates additional porosity and causes portions of the attached porous structures to detach. A covering layer is created by applying a voltage that creates a thin layer that covers the attached porous structures and the detached portions which binds the porous structures and detached portions together. 1. An article , comprising: a surface having at least one region; and a porous coating on said at least one region of said surface , wherein the coating comprises a plurality of porous structures attached to said at least one region of said surface and at least one layer covering said porous structures.228-. (canceled)29. An application of the article of wherein said coating is used in anti-corrosion claim 1 , anti-fouling claim 1 , anti-condensation claim 1 , anti-ice claim 1 , self-cleaning claim 1 , anti-condensation claim 1 , anti-friction claim 1 , or anti-clotting applications.30. An application of the article of wherein said porous coating is used to enhance the bonding of said coating to paint or polymer.31. An application of the article of wherein said porous coating is used as a catalyst.32. The application of claim 31 , wherein the said covering layer comprises a catalytic material.3335-. (canceled) This application claims the benefit U.S. Provisional Application No. 61/765,438, filed Feb. 15, 2013 and herein incorporated by reference.Not Applicable.Not Applicable.The manufacture and use of porous coatings on surfaces have received great interest due to their importance in both fundamental research and commercial applications. In particular, porous metallic coatings are widely used as catalysts or utilized to enhance ...

Providing Traffic Warnings to a User Based on Return Journey

Systems and methods for generating return journey notifications include obtaining a request for navigational directions to a target destination. An outbound journey route from an initial location to the target destination can be determined, wherein the outbound journey route includes an estimated outbound journey time. A return journey route from the target destination to a return destination can be determined, wherein the return journey route includes an estimated return journey time. The outbound journey route and/or return journey route can be determined at least in part from one or more of current traffic conditions or historical traffic conditions. One or more notifications regarding the return journey route can be generated when comparing the estimated outbound journey time to the estimated return journey time results in a determination that one or more predetermined criteria are met. 121-. (canceled)22. A computer-implemented method , comprising:obtaining, by one or more computing devices, a request for navigational directions to a target destination;determining, by the one or more computing devices, an outbound journey route to the target destination based at least in part on current traffic conditions, wherein the outbound journey route is from an initial location to the target destination, and wherein the outbound journey route comprises an estimated outbound journey time;determining, by the one or more computing devices, a return journey route from the target destination to a return destination based at least in part on historic traffic conditions, wherein the return journey route comprises an estimated return journey time;comparing, by the one or more computing devices, the estimated outbound journey time to the estimated return journey time; andgenerating, by the one or more computing devices, a notification regarding the return journey route when the comparison of the estimated outbound journey time to the estimated return journey time meets one or ...

Membrane circuit structure with function expandability

A membrane circuit structure with function expandability is provided. The membrane circuit structure includes a substrate, a lower circuit layer and a covering layer. The substrate includes a first region and at least one second region. The at least one second region is arranged near the first region. The lower circuit layer is printed on the first region. The lower circuit layer is made of a first conductive material. The covering layer is electroplated on a portion of a surface of the lower circuit layer. The covering layer is made of a second conductive material. At least one expansion line is welded on the corresponding second region, and electrically connected with the covering layer and a corresponding function-expanding unit.

Process for Coating Discrete Articles with a Zinc-Based Alloyed Layer and Articles Obtained Therefrom

A vacuum deposition process suitable for coating discrete articles with a zinc-rich, fully alloyed layer is described. In a process step of contacting the article with metallic Zn vapor, the temperature of the article is equal to or higher than the dew point of the Zn vapor. The process results in a coating having a uniform thickness, even on less accessible surfaces. Additionally, the roughness of the steel substrate is essentially preserved. By properly engineering the surface of the substrate, coated articles can be obtained having a roughness providing for optimal paint adhesion. 1. A galvannealed article comprising a steel substrate and a coating layer consisting of Zn—Fe intermetallics , the surface roughness of the substrate being defined by the parameters Ra and Rz , and the surface roughness of the coating layer being defined by the parameters Ra′ and Rz′ , whereby 0.5≦Ra≦20 μm , 5≦Rz≦140 μm , 0.8≦Ra′/Ra≦1.3 , 0.8≦Rz′/Rz≦1.3.2. The galvannealed article according to claim 1 , additionally comprising a layer of paint.3. The galvannealed article according to claim 1 , wherein the coating layer has a mean thickness of more than 10 μm.4. The galvannealed article according to claim 2 , wherein the coating layer has a mean thickness of more than 10 μm. This application is a continuation-in-part of U.S. application Ser. No. 14/519,262, filed Oct. 21, 2014, which is a continuation of U.S. application Ser. No. 13/147,674, filed Nov. 2, 2011, which issued as U.S. Pat. No. 8,895,106 on Nov. 25, 2014, and which is a national stage application of International Application No. PCT/EP2010/000684, filed Feb. 4, 2010, which is a continuation-in-part of International Application No. PCT/EP2009/000750, filed Feb. 4, 2009, the entire contents of these applications are hereby incorporated herein by reference.The present disclosure concerns a process suitable for coating articles, and in particular discrete articles, with a zinc-rich, completely alloyed layer.By discrete articles ...

MULTILAYER FILM INCLUDING FIRST AND SECOND DIELECTRIC LAYERS

A multilayer dielectric film including a first dielectric layer made from a material having a first breakdown field strength and a second dielectric layer disposed on the first dielectric layer made from a material having a different breakdown filed strength. A multilayer film including first and second electrically conductive layers separated by at least first and second dielectric layers is also disclosed. The first dielectric layer is disposed on the first electrically conductive layer, and the second dielectric layer is disposed on the first dielectric layer. The first electrically conductive layer can have at least one of an average surface roughness of at least ten nanometers, a thickness of at least ten micrometers, or an average visible light transmission of up to ten percent. The first dielectric layer may be a polymer and typically has a lower dielectric constant than the second dielectric layer, which may be ceramic. 1. A multilayer film , comprising:first and second electrically conductive layers separated by at least first and second dielectric layers, with the first and second electrically conductive layers each having an average visible light transmission of less than about ten percent;wherein the first dielectric layer is formed directly on the first electrically conductive layer by condensation of a vaporized liquid; andwherein the second dielectric layer is formed directly on the first dielectric layer, the second dielectric layer not being formed by condensation of a vaporized liquid.2. A multilayer film , comprising:first and second electrically conductive layers separated by at least first and second dielectric layers, wherein the first electrically conductive layer has at least one of an average surface roughness of at least ten nanometers, or a thickness of at least ten micrometers;wherein the first dielectric layer comprises a polymer and is disposed on the first electrically conductive layer; andwherein the second dielectric layer comprises ...

ELECTROPLATING APPARATUS FOR TAILORED UNIFORMITY PROFILE

Methods of electroplating metal on a substrate while controlling azimuthal uniformity, include, in one aspect, providing the substrate to the electroplating apparatus configured for rotating the substrate during electroplating, and electroplating the metal on the substrate while rotating the substrate relative to a shield such that a selected portion of the substrate at a selected azimuthal position dwells in a shielded area for a different amount of time than a second portion of the substrate having the same average arc length and the same average radial position and residing at a different angular (azimuthal) position. The shield is positioned in close proximity of the substrate (e.g., within a distance that is equal to 0.1 of the substrate's radius). The shield in some embodiments may be an ionically resistive ionically permeable element having an azimuthally asymmetric distribution of channels. 14-. (canceled)5. A method of electroplating a metal on a substrate while controlling azimuthal uniformity , the method comprising:(a) providing the substrate into an electroplating apparatus configured for rotating the substrate during electroplating, wherein the electroplating apparatus comprises a shield, configured for providing azimuthally asymmetric shielding, wherein the shield is positioned during electroplating such that a distance between the shield and a working surface of the substrate is no more than about 0.1 of the radius of the substrate; and(b) electroplating the metal on the substrate while rotating the substrate relative to the shield such that a selected portion of the substrate at a selected azimuthal position dwells in a shielded area for a different amount of time than a second portion of the substrate having the same average arc length and the same average radial position and residing at a different angular azimuthal position.64. The method of claim 5 , wherein the shield is positioned during electroplating such that a distance between the shield ...

INTEGRATED FLUIDJET SYSTEM FOR STRIPPING, PREPPING AND COATING A PART

A method of stripping, prepping and coating a surface includes first stripping the exiting coating from a surface, using continuous or pulsed fluid jet, followed by prepping the surface by the same fluid jet. The method also provides entraining particles into a fluid stream, if desired to generate a particle-entrained fluid stream that is directed at the surface to be stripped and prepped. The particles act as abrasive particles for prepping the surface to a prescribed surface roughness required for subsequent application of a coating to the surface. The method then entails coating the surface by electrically charging particles having the same chemical composition as the particles used to prep the surface. Finally, a charged-particle-entrained fluid stream is directed at high speed at the charged surface to coat the surface. The particles form both mechanical and electronic bonds with the surface. 1. An integrated fluidjet system for sequentially stripping , prepping and coating a part to be refurbished , the integrated system comprising:a cell defining an electrically shielded enclosure and having a door;a jig for holding the part inside the cell;a robotic arm movable within the cell;a nozzle mounted on the robotic arm;a pressurized fluid source for supplying a pressurized fluid to the nozzle to enable the nozzle to generate a fluidjet capable of sequentially stripping, prepping and coating the part;an electric field generator for generating an electric field for charging the coating particles; anda human-machine interface external to the cell for receiving user commands and for controlling the robotic arm and fluidjet exiting from the nozzle in response to the user commands.2. The system as claimed in further comprising a magnetic field generator for generating a magnetic field for keeping the particles cohesive and focused to enhance impact of the coating particles on the surface.3. The system as claimed in further comprising an induction heater for heating the ...

ENVIRONMENTALLY FRIENDLY ALUMINUM COATINGS AS SACRIFICIAL COATINGS FOR HIGH STRENGTH STEEL ALLOYS

Electroplating process is described for coating a ferrous alloy steel cathode substrate with an aluminum coating, the process comprises: a) immersing an aluminum anode substrate in a plating bath formulation comprising: a source of aluminum, an ionic liquid, a brightening agent, and a metal-salt compound; b) etching the cathode substrate by immersing it into the aluminum plating bath and conducting an anodic polarization step; c) electroplating the etched cathode substrate with the aluminum plating bath formulation; and d) rinsing with alcohol and water, and drying. Preferably, the process further comprises a heat treatment applied to the aluminum coated ferrous steel alloy obtained in step d). 1. An electroplating process for coating a ferrous alloy steel cathode substrate with an aluminum coating , characterised in that the process comprises: a source of aluminum,', 'an ionic liquid,', 'a brightening agent, and', 'a metal salt;, 'immersing an aluminum anode substrate in an aluminum plating bath formulation comprisingetching a ferrous steel alloy cathode substrate by immersing it into the aluminum plating bath formulation and performing an anodic polarization;{'sup': 2', '2, 'electroplating the etched ferrous alloy steel cathode substrate with the aluminum plating bath formulation, to form an aluminum coated ferrous steel alloy, wherein electroplating is carried out with a current density ranging from 1 mA/cmto 100 mA/cm, at a temperature ranging from 20° C. to 100° C. and under a dry inert gas; and'}rinsing the aluminum coated ferrous steel alloy.2. The electroplating process of claim 1 , wherein the ferrous alloy steel is a high strength steel alloy.3. The electroplating process of claim 1 , wherein the source of aluminum is an aluminum halide.4. The electroplating process of claim 1 , wherein the ionic liquid is a nitrogen-containing compound selected from N-alkyl-pyridinium salts claim 1 , N-alkyl-N′-alkyl′ imidazolium salts claim 1 , N-alkyl-N-alkyl′ ...

ELECTRIC FIELD TREATMENT METHOD AND ELECTRIC FIELD TREATMENT DEVICE

An electrolytic treatment device that performs a prescribed treatment using ions to be treated that are contained in a treatment liquid, and includes a direct electrode and a counter electrode which are arranged on either side of the treatment liquid, an indirect electrode which forms an electric field in the treatment liquid, and a switch which switches between connection of the indirect electrode to the power source and connection of the indirect electrode to the direct electrode or the counter electrode. The switch connects and applies a voltage across the indirect electrode and the power source, and breaks the connection between the indirect electrode and the power source and connects the indirect electrode to the direct electrode or the counter electrode. 1. An electrolytic treatment method for performing a prescribed treatment using treatment target ions contained in a treatment liquid , the method comprising:an arranging step of arranging a direct electrode and a counter electrode with the treatment liquid being interposed therebetween, arranging an indirect electrode configured to form an electric field in the treatment liquid, and arranging a switch configured to perform a switching operation between connection of a power source with the indirect electrode and connection of the direct electrode or the counter electrode with the indirect electrode;a treatment target ion migrating step of migrating the treatment target ions contained in the treatment liquid to the counter electrode, by connecting the indirect electrode with the power source and then applying a voltage using the switch; anda treatment target ion treatment step of oxidizing or reducing the treatment target ions migrated to the counter electrode, by disconnecting the indirect electrode from the power source and connecting the indirect electrode to the direct electrode or the counter electrode using the switch.2. The method of claim 1 , wherein the treatment target ion migrating step is performed ...

Nanocomposite magnetic materials for magnetic devices and systems

Nanocomposite magnetic materials, methods of manufacturing nanocomposite magnetic materials, and magnetic devices and systems using these nanocomposite magnetic materials are described. A nanocomposite magnetic material can be formed using an electro-infiltration process where nanomaterials (synthesized with tailored size, shape, magnetic properties, and surface chemistries) are infiltrated by electroplated magnetic metals after consolidating the nanomaterials into porous microstructures on planar substrates. The nanomaterials may be considered the inclusion phase, and the magnetic metals may be considered the matrix phase of the multi-phase nanocomposite.

Iron strike plating on chromium-containing surfaces

The present disclosure provides materials that include a stainless steel layer with a consistent or substantially consistent composition diffusion bonded to a carbon steel substrate. The material can have the corrosion resistance associated with the explosively welded stainless steel and the deep diffusion bonding observed typical of chromizing applications. In some embodiments, the disclosure provides materials having metal layers deposited onto a chromium surface and methods for depositing metal layers onto chromium surfaces. The present disclosure recognizes certain advantages to depositing metal layers onto chromium, such as more rapid diffusion of metals when heated to provide a stainless steel layer.

Electrospray coating of objects

Devices to deliver one or more active ingredients for medical treatment may include a body of material presenting a surface including a polymer adapted to be rendered conductive such that one or more layers of electrospray particles are formable thereon or a body of conductive material presenting a surface upon which one or more layers of electrospray particles are formable thereon. A coating formed of electrospray particles may be deposited to adhere on the surface of the body of material (e.g., the coating may include one or more layers of coating material, at least one layer of the one or more layers of coating material may include an open matrix coating, the open matrix coating may include one or more active ingredients, the open matrix coating may include one or more polymers and one or more active ingredients, etc.).

PLATED STEEL SHEET HAVING EXCELLENT ADHESION PROPERTY AND MANUFACTURING METHOD THEREFOR

The present invention relates to a plated steel sheet, which can be used for vehicles, home appliances, construction materials and the like, and to a method for manufacturing the plated steel sheet. 1. A plated steel sheet having excellent adhesion property , the plated steel sheet comprising a base sheet , a plating layer formed on the base sheet , and a bonding layer formed between the base sheet and the plating layer , wherein the bonding layer has a columnar structure.2. The plated steel sheet of claim 1 , wherein the bonding layer has porosity.3. The plated steel sheet of claim 1 , wherein the bonding layer has a thickness greater than 0.5 μm.4. The plated steel sheet of claim 1 , wherein the bonding layer comprises at least one selected from the group consisting of zinc (Zn) claim 1 , aluminum (Al) claim 1 , silicon (Si) claim 1 , chromium (Cr) claim 1 , nickel (Ni) claim 1 , titanium (Ti) claim 1 , niobium (Nb) claim 1 , and molybdenum (Mo).5. The plated steel sheet of claim 1 , wherein the plating layer comprises at least one selected from the group consisting of a Zn plating layer claim 1 , an Al plating layer claim 1 , a Ni plating layer claim 1 , a Mg plating layer claim 1 , a Zn—Mg alloy plating layer claim 1 , an Al—Mg alloy plating layer claim 1 , a Zn—Ni alloy plating layer claim 1 , a Zn—Fe alloy plating layer claim 1 , and a Zn—Mg—Al alloy plating layer.6. A method for manufacturing a plated steel sheet having excellent adhesion property claim 1 , the method comprising:preparing a base sheet;forming a bonding layer having a columnar structure on the base sheet by a dry plating method; andforming a plating layer on the bonding layer.7. The method of claim 6 , wherein the dry plating method is a chemical vapor deposition (CVD) method or a physical vapor deposition (PVD) method. The present disclosure relates to a plated steel sheet for vehicles, home appliances, construction materials, and the like, and to a method for manufacturing the plated steel ...

METHOD OF ADJUSTING PLATING APPARATUS, AND MEASURING APPARATUS

There is provided a method of adjusting a plating apparatus and a measuring apparatus that can obtain position adjustment amounts/a position adjustment amount of a substrate holder, an anode holder, a regulation plate, and/or a paddle without carrying out plating treatment. There is provided the method of adjusting the plating apparatus that has a plating bath configured to be able to hold the substrate holder, the anode holder, and an electric field adjusting plate. The method of adjusting the plating apparatus has the steps of: installing a first jig at a position in the plating bath where the substrate holder is installed; installing a second jig at a position in the plating bath where the anode holder or the electric field adjusting plate is installed; measuring a positional relation between the first jig and the second jig installed in the plating bath using a sensor included in either of the first jig and the second jig; and adjusting an installation position of the substrate holder, the anode holder, or the electric field adjusting plate based on the measured positional relation. 1. A method of adjusting a plating apparatus , the method comprising the steps of:providing a plating bath configured to be able to hold a substrate holder, an anode holder, and an electric field adjusting plate;installing a first jig at a position in the plating bath where the substrate holder is installed;installing a second jig at a position in the plating bath where the anode holder or the electric field adjusting plate is installed;measuring a positional relation between the first jig and the second jig installed in the plating bath using sensors included in either of the first jig and the second jig; andadjusting an installation position of the substrate holder, the anode holder, or the electric field adjusting plate based on the measured positional relation.2. The method of adjusting the plating apparatus according to claim 1 , whereinthe sensors included in either of the ...

SILVER-PLATED PRODUCT AND METHOD FOR PRODUCING SAME

A silver-plated product is produced by forming a surface layer of silver on a base material by electroplating at a liquid temperature of 10 to 35° C. and a current density of 3 to 15 A/dmin a silver plating solution so as to satisfy (32.6x−300)≦y≦(32.6x+200) assuming that a product of a concentration of potassium cyanide in the silver plating solution and a current density is y (g·A/L·dm) and that a liquid temperature of the silver plating solution is x (° C.), the silver plating solution containing 80 to 110 g/L of silver, 70 to 160 g/L of potassium cyanide and 55 to 70 mg/L of selenium. 1. A method for producing a silver-plated product , the method comprising the steps of:preparing a silver plating solution which contains 80 to 110 g/L of silver, 70 to 160 g/L of potassium cyanide and 55 to 70 mg/L of selenium; and{'sup': '2', 'forming a surface layer of silver on a base material by electroplating in the silver plating solution so as to satisfy (32.6x−300)≦y≦(32.6x+200) assuming that a product of a concentration of potassium cyanide in the silver plating solution and a current density is y (g·A/L·dm) and that a liquid temperature of the silver plating solution is x (° C.).'}2. A method for producing a silver-plated product as set forth in claim 1 , wherein said electroplating is carried out at a liquid temperature of 10 to 35° C.3. A method for producing a silver-plated product as set forth in claim 1 , wherein said electroplating is carried out at a current density of 3 to 15 A/dm.4. A method for producing a silver-plated product as set forth in claim 1 , wherein said silver plating solution is an aqueous solution containing silver potassium cyanide claim 1 , potassium cyanide and potassium selenocyanate.5. A method for producing a silver-plated product as set forth in claim 1 , wherein said base material is made of copper or a copper alloy.6. A method for producing a silver-plated product as set forth in claim 1 , wherein an underlying layer of nickel is formed ...

METHOD OF ADJUSTING PLATING APPARATUS, AND MEASURING APPARATUS

There is provided a method of adjusting a plating apparatus and a measuring apparatus that can obtain position adjustment amounts/a position adjustment amount of a substrate holder, an anode holder, a regulation plate, and/or a paddle without carrying out plating treatment. There is provided the method of adjusting the plating apparatus that has a plating bath configured to be able to hold the substrate holder, the anode holder, and an electric field adjusting plate. The method of adjusting the plating apparatus has the steps of: installing a first jig at a position in the plating bath where the substrate holder is installed; installing a second jig at a position in the plating bath where the anode holder or the electric field adjusting plate is installed; measuring a positional relation between the first jig and the second jig installed in the plating bath using a sensor included in either of the first jig and the second jig; and adjusting an installation position of the substrate holder, the anode holder, or the electric field adjusting plate based on the measured positional relation. 1. A measuring apparatus that measures positions in a plating bath where a substrate holder , an anode holder , and an electric field adjusting plate are arranged , the measuring apparatus comprising:a first jig installed at a position in the plating bath where the substrate holder is installed; anda second jig installed at a position in the plating bath where the anode holder or the electric field adjusting plate is installed, whereineither of the first jig and the second jig includes sensors, and whereinthe sensors are configured to measure a positional relation between the first jig and the second jig.2. The measuring apparatus according to claim 1 , whereinthe sensors included in either of the first jig and the second jig include a position measuring sensor,the other of the first jig and the second jig has a position measuring member, and whereinthe position measuring sensor is ...

PROTECTING ANODES FROM PASSIVATION IN ALLOY PLATING SYSTEMS

An apparatus for continuous simultaneous electroplating of two metals having substantially different standard electrodeposition potentials (e.g., for deposition of Sn—Ag alloys) comprises an anode chamber for containing an anolyte comprising ions of a first, less noble metal, (e.g., tin), but not of a second, more noble, metal (e.g., silver) and an active anode; a cathode chamber for containing catholyte including ions of a first metal (e.g., tin), ions of a second, more noble, metal (e.g., silver), and the substrate; a separation structure positioned between the anode chamber and the cathode chamber, where the separation structure substantially prevents transfer of more noble metal from catholyte to the anolyte; and fluidic features and an associated controller coupled to the apparatus and configured to perform continuous electroplating, while maintaining substantially constant concentrations of plating bath components for extended periods of use. 1. A leak detection probe for detecting the presence of metal ions in a tin ion containing electrolyte , where the metal ions are of a metal more noble than tin , the leak detection probe comprising:a first electrode comprising substantially tin metal;a second electrode comprising substantially a second metal more noble than tin; andan electrically insulating separator positioned between the first electrode and the second electrode, wherein the leak detection probe is configured such that the tin ion containing electrolyte flows through the electrically insulating separator and contacts the second electrode during operation.2. The leak detection probe of claim 1 , further comprising a resistor electrically connecting the first electrode and the second electrode claim 1 , wherein the leak detection probe is configured such that voltage across the resistor is used to detect the presence of the metal ions in the tin ion containing electrolyte.3. The leak detection probe of claim 1 , wherein the second metal is porous silver. ...

Electrohydraulic and shear cavitation radial counterflow liquid processor

Axially fed fluid is sheared during long residence time in a radial workspace between counter-rotating coaxial disk-shaped centrifugal impellers. Gases evolve in the fractal turbulence of a shear layer, which is forced between laminar boundary layers, and an axial suction pump axially extracts evolved noncondensibles and volatiles through cores of radial vortices in the shear layer. Cavitation due to shear between the impellers kills pathogens by shock waves, microjets, OH radicals, and nearby UV light pulses. Oppositely charged electrodes bounding the workspace cause electroporesis and electrohydraulic cavitation. The electrodes are counter-rotating ridged armatures of disk dynamos, forming a dynamic capacitor having audio frequency pulsed electric fields. Electrode erosion by arcing is prevented by shear between the electrodes. The device is also a continuous crystallizer. Inductive repulsion keeps conductive fractions, including suspended metals such as arsenic and mercury, and mineralized water and brine, from passing through the dynamic capacitor at the periphery of the reactor along with the nonconductive solvent. Solutions reach saturation while gases such as carbon dioxide are axially extracted. Metals and concentrated dissolved solids linger in the highly turbulent workspace and agglomerate into chunks, until reaching a size where momentum transfer from the impellers can impel the chunk through the inductive repulsion. Atomized water sprays from the periphery of the workspace and evaporatively cools, precipitating salt and fine crystals of pharmaceuticals. Scale forming compounds precipitate in the reactor into chunks which are easily separable from cooling water or reverse osmosis feed by conventional means. Electrolytic cracking neutralizes ammonia and VOCs.

Method and apparatus for fluid processing a workpiece

A method and apparatus for fluid processing a workpiece are described. The system can include a process module and a system of one or more fluid processing elements to control the fluid flow and/or the electric field distribution during the fluid processing of the workpiece. A member can be used to agitate the fluid during deposition of a film (e.g., using an oscillatory motion). A plate can be used to shape an electric field incident on a surface of a workpiece. By controlling the fluid flow and the electric field distribution, improved deposition of the film on the workpiece surface can result. Furthermore, a vertical configuration and/or a modular architecture can be employed to improve throughput, increase productivity, and reduce cost.

Plating apparatus and method

The present invention comprises a metal plating apparatus and method, particularly suitable for autocatalytic (i.e.. electroless) plating, comprising a pressurized sealable vessel for disposing a substrate to be plated and for the circulation of plating solutions wherein temperatures and pressure are highly controllable.

ELECTRODEPOSITION METHOD AND DEVICE.

Electroplating systems and methods for wear-resistant coatings

An electroplating system includes a tank functioning as an anode, wherein the tank is configured in a horizontal orientation having a length greater than its height, a component part disposed within the tank and functioning as a cathode, an electrical connection, coupled to the anode and cathode, for providing an electric current, and a supply line for delivering an electrolytic fluid to within the tank.

Photosensitive polymer compositions, electrophoretic deposition processes using same, and the use of same in forming films on substrates

This invention is concerned with photosensitive polymer compositions useful in the preparation of printed circuit boards, lithographic printing plates, cathode ray tubes, as well as in chemical milling, solder resist and planarizing layer applications. The photosensitive polymer compositions comprise a crosslinkable photosensitive polymer composition, which comprises (a) photoinitiator, and (b) at least one polymer having one or more carrier groups per polymer molecule, and wherein the composition contains unsaturated groups so that it is capable, upon exposure to actinic radiation, of forming a film containing crosslinked polymer. The photosensitive polymer compositions, conveniently in the form of aqueous solutions or emulsions, are capable of being electrophoretically deposited as adherent, uniform, photosensitive films on conductive surfaces. Films formed from the photosensitive polymer compositions can be aqueous developable and resistant to strong inorganic acids and strong bases.

도금 처리 장치

본 개시의 일태양에 따른 도금 처리 장치(1)는, 기판 유지부(10)와, 제 1 전극과, 제 2 전극과, 전압 인가부(30)를 구비한다. 기판 유지부(10)는, 기판을 유지한다. 제 1 전극은, 기판에 전기적으로 접속된다. 제 2 전극은, 기판의 표면에 대하여 스캔 가능하게 구성된다. 전압 인가부(30)는, 제 1 전극과 제 2 전극과의 사이에 전압을 인가한다. 또한, 제 2 전극의 저면(22a)에는, 도금액(L1)을 토출하는 제 1 토출구(23)와, 세정액(L2)을 토출하는 제 2 토출구(24)가 마련된다.

강화 투명 전도성 코팅 및 이의 제조 방법

본 발명은 강화된 전기, 광학 등의 특성을 보유하는 전도성 패턴을 형성하는 나노 금속 함유 에멀젼에 의해 코팅하여 제조한 투명 전도성 코팅 소자(필름, 3차원 물체 등)에 관한 것이다.

method and apparatus for electroplating

Electrolysis plating system

An electroplating system is provided to prevent the generation of voids due to projection of patterns by using a magnet in an ECP(Electrochemical Plating) process, and reduce the cost as a whole by excluding use of additives, thereby reducing the process cost. An electroplating system includes: an electrolytic cell(10); a copper electrode(20) formed on a bottom surface of the electrolytic cell within the electrolytic cell; a wafer electrode(30) which is disposed oppositely to the copper electrode, and to which a wafer is fixed; and a magnetic force line generating part(40) installed to be spaced apart from a backside of at least one of the copper electrode and the wafer electrode, wherein the magnetic force line generating part is rotatable. The magnetic force line generating part is formed in a circular shape. The magnetic force line generating part is an electromagnet or permanent magnet. The electroplating system additionally includes a power supply(50) for supplying power to the copper electrode and the wafer electrode.

Method of surface modification of metal articles and device for method realization

FIELD: metallurgical and machine building industries; technology of surface modification of metal articles. SUBSTANCE: method includes placing of metal articles to reaction chamber at atmospheric or above atmospheric pressure and treatment of article surface which covers microzone remelting of surface layer by microelectroplasma discharges between positive ions concentrated near article surface in ionized foam-vapor-gas medium and article surface. In this case, ionized foam-vapor-gas medium is produced in sections of preparation of reaction chamber. Device for realization of the method includes reaction chamber with appliances for withdrawal of excessive medium, system of electrolyte recirculation and power source. Reaction chamber is multisectional. The first sections are designed for preparation of foam-vapor-gas medium. Working section in which metal article is accommodated or pulled through it, is designed for modification of article surface. The method and device for modification of article surface combines at the same time and place of processes of cleaning of surface from impurities, scale, rust, oxide films and modification of surface layer, i.e. combination of cleaning and modification in single technological operation. EFFECT: higher strength, corrosion resistance, durability of article surface and higher efficiency of modification with reduction of power consumption. 11 cl, 1 dwg, 2 ex осббугс ПЧ ГЭ РОССИЙСКОЕ АГЕНТСТВО ПО ПАТЕНТАМ И ТОВАРНЫМ ЗНАКАМ (19) (51) МПК? ВИ "” 2 149 930 ' 13) С1 С 25Е 1/00, 7/00 12) ОПИСАНИЕ ИЗОБРЕТЕНИЯ К ПАТЕНТУ РОССИЙСКОЙ ФЕДЕРАЦИИ (21), (22) Заявка: 99116537/02, 30.07.1999 (24) Дата начала действия патента: 30.07.1999 (46) Дата публикации: 27.05.2000 (56) Ссылки: КУ 2068038 СЛ, 20.10.1996. БРИЗА В.Н. и др. Влияние электролитной очистки на свойства холоднокатанной электротехнической стали. Электронная обработка материалов, 1973, М 5(53), с.14 - 716. КУ 2104338 СЛ, 10.02.1998. КЦ 2055941 СЛ, 10.03.1996. СВ 1399110 А, 02.07.1975 ...

Articles from microarc processes and methods of manufacturing same

Disclosed articles as results of a microarc oxidation process, or plurality thereof, which are not limited by size, specifically by certain dimensions of their size, such as their length. Different sections or surfaces of articles of the invention may be subjected to a microarc oxidation process at any given time, such as by gradually subjecting a surface of an article to a microarc oxidation process, or such as by sequentially subjecting different sections of an articles to a microarc oxidation process. Furthermore, disclosed are methods for manufacturing of articles of the invention, or otherwise for subjecting articles of the invention to a microarc oxidation process, or plurality thereof. In some examples, tubes of above 6 meter in length may be coated according to methods of the invention. The coating of said tubes may be beneficial for desalination applications. In other examples, only grooves of pulleys are coated. Further disclosed are articles which underwent a microarc oxidation process, or plurality thereof, which included different solution, optionally by utilizing a solution modulator.

Method for manufactured tantalum-silver complex electrode of dye-sensitized solar cell(dssc) using lower molten salt electroplating

The present invention comprises the steps of: (a) manufacturing molten salt having a low temperature for melting; (b) arranging corrosion-resisting metals on the both poles; (c) arranging a basic material on the cathode; (d) inserting the corrosion-resisting metals and the basic material into the molten salt; and (e) applying current density to the basic material and electrodepositing the corrosion-resisting metals to the basic material. The corrosion-resisting metals are tantalum and the basic material is a silver substrate. The present invention relates to a manufacturing method of tantalum-silver composite electrode structural member. According to the present invention, the tantalum-silver composite electrode structural member uses an electroplating technique and forms a tantalum coating film having a high corrosion-resistance and conductivity which is uniform and detailed, thereby manufacturing a tantalum-silver composite electrode having higher corrosion-resistance and conductivity than a silver electrode for the existing dye-sensitized solar cell. In addition, according to the present invention, electrolyte pollution and weak adhesion problems of the dye-sensitized solar cell based on the existing carbon nanotubes can be solved. Moreover, according to the present invention, by forming the tantalum coating film having a high corrosion-resistance and conductivity which is thinner and more flexible than a glass frit solving the corrosion problem of the existing silver grid electrode, a compact and flexible composite electrode structural member can be produced.

Copper-connection is electroplated fill method

本发明涉及一种铜互连电镀填充方法，包括以下步骤：将用于孔填充的镀铜液作为电解液，放入三电极体系中，测量其电化学曲线；根据电化学曲线确定电流峰和电流谷分别对应的电压值；将具有孔结构的样品作为工作电极放入三电极体系中，使孔表面的电压对应于电化学曲线上电流谷对应的电压，通电后取出；测量孔截面各处填充铜的厚度，其最厚处对应于电化学曲线上电流峰的位置；调整镀铜液的浓度，改变其电化学曲线上电流峰和电流谷的位置，使在电镀铜过程中孔表面的电压对应于电化学曲线上电流谷对应的电压，孔底的电压对应于电化学曲线上电流峰对应的电压，即可。本发明能够实现镀铜无缺陷的完美填充，而且操作简便，可广泛用于各种高端电子制造领域。