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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Форма поиска

Поддерживает ввод нескольких поисковых фраз (по одной на строку). При поиске обеспечивает поддержку морфологии русского и английского языка
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Применить Всего найдено 6935. Отображено 100.
30-08-2012 дата публикации

Galvanized carbon steel with stainless steel-like finish

Номер: US20120219823A1
Автор: Frederick Alan Myers
Принадлежит: AK Steel Properties Inc

A “faux stainless steel” may be produced by processing galvanized carbon steel through a temper mill using textured rolls to develop a “polished” type surface. The galvanized coating is not removed by abrasion but is compressed thereby providing a more uniform substrate than conventional polishing or brushing. The resulting strip may then be coated with an organic film to provide additional appearance and corrosion benefits including anti-fingerprint resistance.

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20-09-2012 дата публикации

Nickel-Plated Steel Sheet for Manufacturing Pipe Having Corrosion Resistance Against Fuel Vapors, Pipe Which Uses the Steel Sheet,and Fuel Supply Pipe Which Uses the Steel Sheet

Номер: US20120234428A1
Принадлежит: Toyo Kohan Co Ltd

Provided is a nickel-plated steel sheet for manufacturing a pipe having corrosion resistance against fuel vapor of fuel such as gasoline, light oil, bioethanol or bio-diesel fuel, and a pipe and a fuel supply pipe. In the nickel-plated steel sheet for manufacturing a pipe, a nickel plating layer having a plating thickness of 0.5 to 10 μm is formed on a surface of a steel sheet thus having corrosion resistance against fuel vapor. In the pipe and the fuel supply pipe, a nickel plating layer having a plating thickness of 0.5 to 10 μm is formed on an inner surface of a pipe formed of a steel sheet thus having corrosion resistance against fuel vapor. In the fuel supply pipe 20 formed of a steel sheet for supplying fuel to a fuel tank 23 , the fuel supply pipe includes: a large-diameter pipe portion 21 through which the fuel passes; and a small-diameter pipe portion 22 which makes an upper portion of the large-diameter pipe portion and a lower portion of the large-diameter pipe portion communicate with each other for ventilation, and a nickel plating layer having a plating thickness of 0.5 to 10 μm is formed on an inner surface of at least the small-diameter pipe portion.

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27-09-2012 дата публикации

Method for Coating, Pole Tube and Device for carrying out the Method

Номер: US20120244374A1
Принадлежит: ROBERT BOSCH GMBH

A method for coating workpieces which consist of two different metallic materials includes providing the workpiece in a nickel strike electrolyte with a nickel layer as substrate before the application of a corrosion-resistant layer.

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21-03-2013 дата публикации

Method of plating stainless steel and plated material

Номер: US20130071688A1
Автор: Takeshi Bessho
Принадлежит: Toyota Motor Corp

The method of plating a stainless steel substrate including depositing a first plating metal layer over the stainless steel substrate), forming an interdiffusion layer in which elements of the stainless steel substrate and elements of the first plating metal layer interdiffuse, by applying a heat treatment to the stainless steel substrate coated by the first plating metal layer, and coating a second plating metal layer over the surface of the stainless steel substrate over which the interdiffusion layer is coated.

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28-03-2013 дата публикации

Process for forming corrosion protection layers on metal surfaces

Номер: US20130078382A1
Принадлежит: Atotech Deutschland GmbH and Co KG

The invention relates to a process for producing a corrosion-inhibiting coating for substrates having a surface consisting of zinc, magnesium, aluminium or one of their alloys, wherein the surface to be treated is brought into contact in direct succession with two aqueous treatment solutions containing chromium(III) ions, metal ions of the substrate surface to be treated and at least one complexing agent. The first treatment solution has a pH in the range from 1.0 to 4.0, while the second treatment solution has a pH of from 3.0 to 12.0. The process of the invention produces a smaller amount of wastewater polluted with heavy metals.

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09-05-2013 дата публикации

Method for Manufacturing Resonance Tube, Resonance Tube, and Filter

Номер: US20130113578A1
Автор: Yanzhao Zhou
Принадлежит: Huawei Technologies Co Ltd

A method for manufacturing a resonance tube includes: mixing powder materials, to form homogeneous powder particles, where the powder materials comprise iron powder with a weight proportion of 50% to 90%, at least one of copper powder and steel powder with a weight proportion of 1% to 30%, and an auxiliary material with a weight proportion of 1% to 20%; pressing and molding the powder particles, to form a resonance tube roughcast; sintering the resonance tube roughcast in a protective atmosphere, to form a resonance tube semi-finished product; and electroplating the resonance tube semi-finished product, to form the resonance tube. In the method, the resonance tube, and the filter according to embodiments of the present invention, the resonance tube is manufactured by using multiple powder materials.

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16-05-2013 дата публикации

Composite Containing Polymer, Filler and Metal Plating Catalyst, Method of Making Same, and Article Manufactured Therefrom

Номер: US20130122202A1
Принадлежит: XEROX CORPORATION

Disclosed herein is a component comprising a substantially homogeneous composition of at least one polymer selected from the group consisting of epoxies, acetals, polyesters, non-ionic rubbers, non-ionic polyurethanes, polyether sulfones, polyether ether ketones, polyether imides, polystyrenes, polyethylene terephthalates, polyamides, polyimides, polyvinylchlorides, polyphenylene oxides, polycarbonates, acrylonitrile-butadiene-styrene terpolymers, silicones, fluropolymers, and polyolefins, a filler, and a metal plating catalyst. A method of making a component also is described comprising obtaining a polymeric material, a liquid, a filler and a metal plating catalyst; combining the metal plating catalyst with the polymeric material, liquid, and filler to form a substantially homogeneous mixture; and evaporating and/or curing the mixture to form a solidified component. The method is useful for making small, precisely engineered, electronic components without requiring the use of caustic solutions or complex equipment. 113-. (canceled)14. A method of making a component comprising obtaining a polymeric material , a liquid , a filler and a metal plating catalyst comprising a metal; combining the metal plating catalyst with the polymeric material , liquid , and filler to form a substantially homogeneous mixture; and at least one of evaporating and curing the mixture to form a solidified component.15. The method of claim 14 , wherein claim 14 , in the solidified component claim 14 , at least a portion of the metal plating catalyst is anchored to the polymer.16. The method of claim 14 , wherein the metal plating catalyst is obtained by dissolving a metal salt in a liquid containing the polymeric material.17. The method of claim 14 , wherein the liquid is at least one of a solvent and a diluent.18. The method of claim 14 , wherein the metal plating catalyst is at least partially dispersed in the liquid claim 14 , combined with filler claim 14 , and dried before being ...

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16-05-2013 дата публикации

ELECTRODES HAVING Pt NANOPARTICLES ON RuO2 NANOSKINS

Номер: US20130122401A1
Принадлежит: US Department of Navy

An article having a titanium, titanium carbide, titanium nitride, tantalum, aluminum, silicon, or stainless steel substrate, a RuO 2 coating on a portion of the substrate; and a plurality of platinum nanoparticles on the RuO 2 coating. The RuO 2 coating contains nanoparticles of RuO 2 . A method of: immersing the substrate in a solution of RuO 4 and a nonpolar solvent at a temperature that is below the temperature at which RuO 4 decomposes to RuO 2 in the nonpolar solvent in the presence of the article; warming the article and solution to ambient temperature under ambient conditions to cause the formation of a RuO 2 coating on a portion of the article; and electrodepositing platinum nanoparticles on the RuO 2 coating.

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20-06-2013 дата публикации

HOT-ROLLED STEEL SHEET, COLD-ROLLED STEEL SHEET, GALVANIZED STEEL SHEET, AND METHODS OF MANUFACTURING THE SAME

Номер: US20130153091A1

A hot-rolled steel sheet has an average value of the X-ray random intensity ratio of a {100} <011> to {223} <110> orientation group at least in a sheet thickness central portion that is in a sheet thickness range of ⅝ to ⅜ from a steel sheet surface of 1.0 to 6.0, an X-ray random intensity ratio of a {332} <113> crystal orientation of 1.0 to 5.0, rC which is an r value in a direction perpendicular to a rolling direction of 0.70 to 1.10, and r30 which is an r value in a direction that forms an angle of 30° with respect to the rolling direction of 0.70 to 1.10. 1. A hot-rolled steel sheet comprising , by mass %:C: 0.0001% to 0.40%;Si: 0.001% to 2.5%;Mn: 0.001% to 4.0%;P: 0.001% to 0.15%;S: 0.0005% to 0.03%;Al: 0.001% to 2.0%;N: 0.0005% to 0.01%;O: 0.0005% to 0.01%;and further comprising one or two or more of:Ti: 0.001% to 0.20%;Nb: 0.001% to 0.20%;V: 0.001% to 1.0%;W: 0.001% to 1.0%;B: 0.0001% to 0.0050%;Mo: 0.001% to 1.0%;Cr: 0.001% to 2.0%;Cu: 0.001% to 2.0%;Ni: 0.001% to 2.0%;Co: 0.0001% to 1.0%;Sn: 0.0001% to 0.2%;Zr: 0.0001% to 0.2%;As: 0.0001% to 0.50%;Mg: 0.0001% to 0.010%;Ca: 0.0001% to 0.010%; andREM: 0.0001% to 0.1%;and balance composed of iron and inevitable impurities,wherein an average value of an X-ray random intensity ratio of a {100} <011> to {223}<110> orientation group at least in a sheet thickness central portion that is in a sheet thickness range of ⅝ to ⅜ from a steel sheet surface is 1.0 to 6.0, an X-ray random intensity ratio of a {332} <113> crystal orientation is 1.0 to 5.0; andrC which is an r value in a direction perpendicular to a rolling direction is 0.70 to 1.10, and r30 which is an r value in a direction that forms an angle of 30° with respect to the rolling direction is 0.70 to 1.10.2. The hot-rolled steel sheet according to claim 1 ,wherein rL which is an r value in the rolling direction is 0.70 to 1.10, and r60 which is an r value in a direction that forms an angle of 60° with respect to the rolling direction is 0.70 to 1.10.3. The ...

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11-07-2013 дата публикации

System and Method for Attaching Soft Tissue To An Implant

Номер: US20130178942A1
Принадлежит: Individual

One embodiment of the present invention is directed to compositions and methods for enhancing attachment of soft tissues to a metal prosthetic device. In one embodiment a construct is provided comprising a metal implant having a porous metal region, wherein said porous region exhibits a nano-textured surface.

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24-10-2013 дата публикации

Method to Produce Golden Bronze by Diffusion of Tin Into Copper Under Controlled Conditions

Номер: US20130277225A1
Принадлежит: ROYAL CANADIAN MINT

The present invention relates to the production of a bronze plated substrate having a golden appearance thanks to a multiple-layer plating method. The method notably comprises plating a substrate having at least one layer of copper with a tin layer which thickness represents 3.5% to 12% of the copper layer thickness. The method further comprises annealing the plated substrate in an annealing furnace comprising a plurality of heating zones, the last heating zone of the furnace having an annealing temperature ranging from 600° C. to 815° C. The annealing step of the method is performed under controlled operating parameters which comprise an annealing residence time, the annealing temperature and the relative thickness of the tin layer in view of the copper layer. The operating parameters are controlled in accordance to each other to ensure obtaining the gold-like appearance of the plated bronze.

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07-11-2013 дата публикации

METHOD FOR MANUFACTURING HOT STAMPED BODY AND HOT STAMPED BODY

Номер: US20130292009A1
Принадлежит:

The present invention provides a method for manufacturing a hot stamped body, the method including: a hot-rolling step; a coiling step; a cold-rolling step; a continuous annealing step; and a hot stamping step, in which the continuous annealing step includes a heating step of heating the cold-rolled steel sheet to a temperature range of equal to or higher than Ac° C. and lower than Ac° C.; a cooling step of cooling the heated cold-rolled steel sheet from the highest heating temperature to 660° C. at a cooling rate of equal to or less than 10° C./s; and a holding step of holding the cooled cold-rolled steel sheet in a temperature range of 550° C. to 660° C. for one minute to 10 minutes.

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23-01-2014 дата публикации

METHOD FOR BALANCING A TURBOMACHINE ROTOR

Номер: US20140021056A1
Принадлежит: SNECMA

The invention relates to a method for balancing a rotor, notably of a turbomachine, comprising a step of determining the unbalancing mass followed by a step of balancing by chemical machining of the rotor. More particularly, the chemical machining comprises the immersion of the rotor in a bath containing a chemical machining agent, the bath having a capacity of heterogeneous material removal (as a function of the depth of the bath), the rotor being oriented in the bath taking account of the said capacity of heterogeneous material removal so that the quantity of material removed from the rotor in the zone of the unbalancing mass is sufficient to balance the rotor. 1. Method for balancing a rotor , notably of a turbomachine , comprising a step of determining the unbalancing mass followed by a step of balancing by chemical machining of the rotor , the chemical machining comprising the immersion of the rotor in a bath containing a chemical machining agent , the bath being arranged so as to have a capacity of heterogeneous material removal as a function of the depth in the bath , the rotor being oriented in the bath taking account of the said capacity of heterogeneous material removal so that the quantity of material removed from the rotor in the zone of the unbalancing mass is sufficient to balance the rotor.2. Method according to claim 1 , according to which claim 1 , the direction of the unbalancing mass having been identified by a mark on the rotor claim 1 , the rotor is attached to a handling tool and suspended so that the mark is oriented in a vertical plane claim 1 , then the rotor is conveyed and submerged in the said chemical machining bath.3. Method according to claim 2 , according to which the rotor is kept in the bath for a sufficient period to remove a minimum quantity of material from the whole rotor.4. Method according to claim 1 , whereof the chemical bath is nitric-acid based and hydrofluoric-acid based.5. Method according to according to which claim 4 , ...

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23-01-2014 дата публикации

Surface-treated steel sheet and method of manufacturing the same

Номер: US20140023879A1
Принадлежит: Individual

A surface-treated steel sheet includes: a steel sheet; and a coated layer which is formed on one surface or both surfaces of the steel sheet and includes zinc and vanadium, wherein the coated layer has a vanadium content of 1% or higher and 20% or less and a coating weight of 3 g/m 2 or higher and 40 g/m 2 or less, and has a plurality of dendritic arms that are grown in a thickness direction of the steel sheet, and a ratio x/y of a content x of vanadium that is present outside the arms to a content y of vanadium that is present inside the arms is 1.1 or higher and 3.0 or less in terms of vanadium element.

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20-02-2014 дата публикации

Flat Steel Product and Method for Producing a Flat Steel Product

Номер: US20140048181A1
Принадлежит: THYSSENKRUPP STEEL EUROPE AG

A flat steel product, intended to be formed into a component by hot press forming and having a base made of steel, onto which a metal anti-corrosion coating of a Zn or a Zn alloy is applied. A separate finishing coat is applied to at least one of the free surfaces of the flat steel product. The finishing coat includes at least one base metal compound (oxide, nitride, sulphide, sulphate, carbide, carbonate, fluoride, hydrate, hydroxide, or phosphate). Also, a method enabling the production of a flat steel product of this kind.

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20-03-2014 дата публикации

Tribologically Loadable Mixed Noble Metal/Metal Layers

Номер: US20140076798A1
Автор: Stefan Koppe
Принадлежит: Schauenburg Ruhrkunststoff GmbH

The invention relates to a method for producing a noble metal/metal layer, which has particularly advantageous tribological properties, comprising the following steps: providing a bath for the currentless deposition of a metal layer, which additionally contains at least one type of noble metal ions; introducing a substrate into the bath; and applying a voltage.

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03-01-2019 дата публикации

NOVEL METHOD OF MAKING DECORATIVE ARTICLES

Номер: US20190001620A1
Автор: LAM Yin Sang

Provided herein is a method of making decorative articles such as seashells comprising the steps of providing an article; coating a first transparent protecting layer on the article; painting a decorative pattern layer on the first transparent protecting layer with an adhesive; covering the decorative pattern layer by metal powder to form a metal powder layer on the decorative pattern layer; curing partially or completely the adhesive to fix the metal powder on the decorative pattern layer; and forming at least one continuous metal layer on the metal powder layer by an electroplating method. Also provided herein are decorative articles such as seashells made by the methods disclosed herein. 1. A method of making a decorative article , comprising the steps of:a) providing an article;b) coating a first transparent protecting layer on the article;c) painting a decorative pattern layer on the first transparent protecting layer with an adhesive;d) covering the decorative pattern layer by metal powder to form a metal powder layer on the decorative pattern layer;e) curing partially or completely the adhesive to fix the metal powder on the decorative pattern layer; andf) forming at least one continuous metal layer on the metal powder layer by an electroplating method.2. The method of claim 1 , wherein the electroplating method is electrochemical deposition claim 1 , pulse electroplating claim 1 , brush electroplating or electroless deposition.3. The method of claim 1 , wherein the adhesive is a one-part adhesive claim 1 , a 2-part adhesive or a combination thereof.4. The method of claim 3 , wherein the one-part adhesive is a heat curing adhesive claim 3 , moisture curing adhesive claim 3 , a UV light curing adhesive claim 3 , or a combination thereof claim 3 , and wherein the 2-part adhesive is cured at room temperature.5. The method of claim 4 , wherein the one-part adhesive is a heat curing adhesive.6. The method of claim 3 , wherein the adhesive is a 2-part adhesive and ...

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05-01-2017 дата публикации

LANDING GEAR COMPRISING A ZINC-NICKEL DEPOSIT RESISTANT TO FRETTING

Номер: US20170001716A1
Принадлежит: SAFRAN LANDING SYSTEMS

A landing gear () for aircraft comprising a first pair of first and second parts (′), said first part (′) having a steel substrate and a sliding layer (C, C′) formed on this substrate, the second part (′) being in sliding contact against said sliding layer (C, C′) with a maximum rectilinear sliding amplitude (G, G′) of less than 0.5 mm, the sliding layer (C, C′) being adapted to support a surface pressure in excess of 50 MPa. 11. A landing gear () for aircraft comprising:{'b': 2', '1, 'a landing gear strut () extending along a main axis (X-X) of the landing gear ();'}{'b': 3', '2', '2, 'i': 'a', 'at least one axle (), mechanically connected to a first side () of the strut ();'}{'b': '4', 'at least one wheel (), rotatably mounted about said at least one axle;'}{'b': 5', '2', '6, 'at least one damper () arranged to dampen a sliding movement of said landing gear strut () relative to the structure of the aircraft ();'}{'b': 1', '7', '8', '7', '8', '7', '7', '8', '8', '8', '8', '7', '7, 'the landing gear () further comprises at least one pair of first and second parts (, , ′, ′), said first part (, ′) having a steel substrate and a sliding layer (C, C′) formed on this substrate, the second part (, ′) being mounted in sliding contact against said sliding layer (C, C′) with a maximum rectilinear sliding amplitude (G, G′) of this second (, ′) part against said sliding layer (C, C′) of the first part (, ′), strictly less than 0.5 mm, the sliding layer (C, C′) being adapted to support, at least during the sliding, a surface pressure in excess of 50 MPa, whereinthe sliding layer (C, C′) is made of a zinc and nickel alloy comprising, in terms of percentage by weight of the alloy, between 12% and 18% nickel, at most 0.5% of other elements such as nickel and zinc, the remainder being zinc; and whereinthe first part also has a protective layer (P, P′) against corrosion extending from the sliding layer (C, C′), this protective layer (P, P′) being formed of said zinc and nickel ...

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05-01-2017 дата публикации

AIRCRAFT LANDING GEAR STRUTS COATED WITH A ZINC-NICKEL ALLOY

Номер: US20170001717A1
Принадлежит: SAFRAN LANDING SYSTEMS

Aircraft landing gear strut () comprising a main part () extending along a main axis (X-X) of the strut and comprising an axle shaft () extending in a plane (P) perpendicular to the main shaft () of the strut, this axle shaft () being designed to support at least one landing gear wheel () equipped with brakes () for braking the wheel, said axle shaft () being made of steel. 113.-. (canceled)141. An aircraft landing gear strut () comprising:{'b': 1', '1', '2', '2', '3', '3', '1, 'i': b', 'b', 'a', 'b', 'a', 'b', 'b, 'a main part (la) extending along a main axis (X X) of the strut and comprising an axle shaft () extending in a plane (P) perpendicular to the main shaft (la) of the strut, the axle shaft () being designed to support at least one landing gear wheel (, ) equipped with brakes (, ) for braking the wheel, said axle shaft () being made of steel,'}{'b': '1', 'i': 'b', 'wherein the axle shaft () has at least one layer of zinc nickel alloy coating (C), the zinc nickel alloy comprising, as a mass percent of the alloy, between 12% and 18% of nickel, at most 0.5% of elements other than nickel and zinc, the rest being zinc,'}{'b': 1', '5', '5', '5', '5', '1', '5', '5, 'i': b', 'a', 'b', 'a', 'b', 'b', 'a', 'b, 'wherein the axle shaft () comprises at least one bearing seat (, ) designed to accept at least one wheel bearing ring, each said at least one bearing seat (, ) being formed by an annular layer of chrome formed on an external surface made of steel of the axle shaft (), the at least one layer of zinc nickel alloy coating extending at least over all the steel surfaces of the axle shaft that are situated outside of the said at least one bearing seat made of chrome (, ), and'}{'b': 5', '5, 'i': a', 'b, 'wherein each at least one bearing seat (, ) made of chrome extends between two chrome annular edges specific to it, the at least one layer of zinc nickel alloy coating extending over the annular edges made of chrome of each at least one bearing seat.'}15. The ...

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05-01-2017 дата публикации

APPARATUS AND METHOD FOR IONIC LIQUID ELECTROPLATING

Номер: US20170002478A1
Автор: Chen Lei
Принадлежит:

An electroplating apparatus includes a container containing plural portions and an ionic liquid plating solution that is capable of flowing therebetween. The plural portions include at least a first portion containing a counter electrode that includes coating donor material and a second portion that includes a workpiece. A porous scrubber separating the first and second portions has a plurality of metallic outer surfaces in contact with the ionic liquid plating solution. Coating, repair, and regeneration methods using an ionic liquid plating solution are also described. 111-. (canceled)12. A method for coating at least a first surface of a workpiece with a metallic coating , the method comprising:electrolytically etching a first portion of the workpiece in an ionic liquid plating solution, the etching step comprising subjecting the workpiece to an anodic potential and subjecting a counter electrode to a cathodic potential to remove at least a portion of a displacement layer, thereby (i) accumulating ionic byproducts in the ionic liquid plating solution and (ii) exposing and activating the first surface;electrodepositing the metallic coating onto the exposed and activated portion of the first surface without removing the workpiece from the ionic liquid plating solution, the electrodepositing step comprising subjecting the counter electrode to an anodic potential and subjecting the workpiece to a cathodic potential to deposit coating donor material from the counter electrode onto the surface to be coated; andduring at least one of the etching step and the electrodepositing step, fluidly communicating a portion of the ionic liquid plating solution through a porous scrubber disposed in the ionic liquid solution between the workpiece and the counter electrode, the scrubber having a plurality of metallic outer surfaces in contact with the ionic liquid plating solution to capture at least some of the accumulated ionic byproducts from the ionic liquid plating solution. ...

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07-01-2016 дата публикации

PROCESS OF MANUFACTURING HIGH-STRENGTH COLD ROLLED STEEL SHEETS

Номер: US20160002807A1
Принадлежит: JFE STEEL CORPORATION

A process of manufacturing high-strength cold rolled steel sheets containing 0.5 to 2.0 mass % silicon includes a pickling step of thermally annealing a steel sheet in a non-oxidizing atmosphere and thereafter pickling the steel sheet to dissolve away 0.5 g/mto less than 2.0 g/mof the steel sheet, and an electroplating step of electroplating the surface of the pickled steel sheet with zinc under such conditions that a coating mass of 100 to 5000 mg/mis obtained. 13.-. (canceled)4. A process of manufacturing high-strength cold rolled steel sheets containing 0.5 to 2.0 mass % silicon , comprising:{'sup': 2', '2, 'a pickling step of thermally annealing a steel sheet in a non-oxidizing atmosphere and thereafter pickling the steel sheet to dissolve away 0.5 g/mto less than 2.0 g/mof the steel sheet, and'}{'sup': '2', 'an electroplating step of electroplating the surface of the pickled steel sheet with zinc under such conditions that a coating mass of 100 to 5000 mg/mis obtained.'}5. The process according to claim 4 , wherein the non-oxidizing atmosphere is obtained by introducing a mixture gas containing nitrogen and hydrogen claim 4 ,the hydrogen content in the non-oxidizing atmosphere is not more than 10 vol %, andthe temperature of heating during the thermal annealing is not more than 900° C.6. The process according to claim 4 , further comprising an aqueous solution contact step of bringing the steel sheet after the electroplating step into contact with a P-containing aqueous solution having a concentration of not less than 0.001 g/L at a temperature of the P-containing aqueous solution of not less than 30° C.7. The process according to claim 5 , further comprising an aqueous solution contact step of bringing the steel sheet after the electroplating step into contact with a P-containing aqueous solution having a concentration of not less than 0.001 g/L at a temperature of the P-containing aqueous solution of not less than 30° C. This disclosure relates to a process ...

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02-01-2020 дата публикации

Methods for electrolytically depositing pretreatment compositions

Номер: US20200002831A1
Принадлежит: PRC Desoto International Inc

Methods for treating a substrate are disclosed. The substrate is deoxidized and then immersed in an electrodepositable pretreatment composition comprising a lanthanide series element and/or a Group IIIB metal, an oxidizing agent, and a metal-complexing agent to deposit a coating from the electrodepositable pretreatment composition onto a surface of the substrate. Optionally, the electrodepositable pretreatment composition may comprise a surfactant. A coating from a spontaneously depositable pretreatment composition comprising a Group IIIB and/or Group IVB metal may be deposited on the substrate surface prior to electrodepositing a coating from the electrodepositable pretreatment composition. Following electrodeposition of the electrodepositable pretreatment composition, the substrate optionally may be contacted with a sealing composition comprising phosphate and a Group IIIB and/or IVB metal. Substrates treated according to the methods also are disclosed.

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02-01-2020 дата публикации

METHODS FOR ELECTROLYTICALLY DEPOSITING PRETREATMENT COMPOSITIONS

Номер: US20200002832A1
Принадлежит: PRC-DeSoto International, Inc.

Methods for treating a substrate are disclosed. The substrate is deoxidized and then immersed in an electrodepositable pretreatment composition comprising a lanthanide series element and/or a Group IIIB metal, an oxidizing agent, and a metal-complexing agent to deposit a coating from the electrodepositable pretreatment composition onto a surface of the substrate. Optionally, the electrodepositable pretreatment composition may comprise a surfactant. A coating from a spontaneously depositable pretreatment composition comprising a Group IIIB and/or Group IVB metal may be deposited on the substrate surface prior to electrodepositing a coating from the electrodepositable pretreatment composition. Following electrodeposition of the electrodepositable pretreatment composition, the substrate optionally may be contacted with a sealing composition comprising phosphate and a Group IIIB and/or IVB metal. Substrates treated according to the methods also are disclosed. 1. A method for treating a substrate comprising:deoxidizing at least a portion of the substrate;contacting at least a portion of the substrate that has been deoxidized with a spontaneously depositable pretreatment composition comprising a Group IIIB metal and/or a Group IVB metal; andpassing electric current between an anode and the substrate that has been contacted with the spontaneously depositable pretreatment composition pretreatment composition, serving as a cathode, said cathode and anode being immersed in an electrodepositable pretreatment composition comprising a lanthanide series metal and/or a Group IIIB metal, an oxidizing agent, and a metal-complexing agent, to deposit a coating from the electrodepositable pretreatment composition onto a surface of the substrate.2. The method of claim 1 , wherein the Group IIIB metal and/or the Group IVB metal is present in the spontaneously deposited pretreatment composition in an amount of 10 ppm to 500 ppm based on the total weight of the spontaneously depositable ...

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02-01-2020 дата публикации

METHOD FOR MODIFIYING A SURFACE OF A METALLIC SUBSTRATE MATERIAL

Номер: US20200002833A1
Принадлежит:

A method for chemically modifying a surface of a metallic substrate material being made of a first metallic material includes the steps of a) bonding an alloy material made of the first metallic material and a second metallic material onto the substrate material; and b) etching away at least some of the first metallic material from the bonded substrate material to obtain a modified substrate material, wherein the modified substrate material has an increased specific surface area. A substrate for Surface Enhanced Raman Spectroscopy (SERS) includes a modified substrate material. 1. A method for chemically modifying a surface of a metallic substrate material being made of a first metallic material comprising the steps of:a) bonding an alloy material made of the first metallic material and a second metallic material onto the substrate material; andb) etching away at least some of the first metallic material from the bonded substrate material to obtain a modified substrate material, wherein the modified substrate material has an increased specific surface area.2. The method of claim 1 , wherein the modified substrate material has a higher specific surface area than the substrate material.3. The method of claim 1 , wherein the first metallic material is less chemically reactive than the second metallic material.4. The method of claim 3 , wherein the first metallic material comprises at least one of gold claim 3 , silver or copper.5. The method of claim 3 , wherein the second metallic material comprises at least one of silver-or copper.6. The method of claim 1 , wherein steps a) and b) are carried out in an electrochemical cell containing a solution of electrolyte.7. The method of claim 6 , wherein step a) comprises the step of electrodepositing of the alloy material onto the metallic substrate material by manipulating at least one of a voltage or a current density applied to the electrochemical cell.8. The method of claim 6 , wherein step b) comprises the step of ...

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13-01-2022 дата публикации

SYSTEM AND METHOD OF ATTACHING SOFT TISSUE TO AN IMPLANT

Номер: US20220008205A1
Принадлежит:

One embodiment of the present invention is directed to compositions and methods for enhancing attachment of soft tissues to a metal prosthetic device. In one embodiment a construct is provided comprising a metal implant having a porous metal region, wherein said porous region exhibits a nano-textured surface. 120-. (canceled)21. A method of generating soft tissue and/or fibrocartilage tissue and/or bone on a metal implant to enhance the attachment of the metal implant to a patient's tissues , said method comprising:implanting said implant, comprising a metal surface having nanosurface roughness produced from anodization, one or more adhered nanoparticles, or etching of the metal surface, the implant further comprising an antibiotic compound or an antimicrobial compound, wherein said implant is in contact with said patient's tissues to induce the generation of soft tissue and/or fibrocartilage tissue and/or bone on said metal implant.22. The method of claim 21 , wherein the anodization of the metal surface is performed by pretreating the metal surface of said implant with an acid; and anodizing said pretreated metal surface at low voltage for at least 1 minute.23. The method of claim 22 , wherein the pretreated metal surface is anodized at low voltage for 1 to 5 minutes.24. The method of claim 23 , wherein the metal surface displaying the nanosurface roughness comprises titanium or a titanium alloy claim 23 , and wherein said pretreating step comprises immersing the metallic implant and a cathode in an acidic electrolyte solution comprising hydrofluoric acid; and said anodizing step comprises applying an electrical potential between the metallic implant and the cathode.25. The method of claim 24 , wherein the electrical potential is about 20 volts that is maintained for 1 claim 24 , 3 or 5 minutes.26. The method of claim 24 , wherein the acidic electrolyte solution comprises 1% hydrofluoric acid.27. The method of claim 24 , wherein the acidic electrolyte solution ...

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07-01-2016 дата публикации

DEVICES TO DETECT A SUBSTANCE AND METHODS OF PRODUCING SUCH A DEVICE

Номер: US20160003732A1

Devices to detect a substance and methods of producing such a device are disclosed. An example device to detect a substance includes an orifice plate defining a first chamber. A substrate is coupled to the orifice plate. The substrate includes nanostructures positioned within the first chamber. The nanostructures are to react to the substance when exposed thereto. A seal is to enclose at least a portion of the first chamber to protect the nanostructures from premature exposure. 1. A device to detect a substance , comprising:an orifice plate defining a first chamber;a substrate coupled to the orifice plate, the substrate comprising nanostructures positioned within the first chamber, the nanostructures to react to the substance when exposed thereto; anda seal to enclose at least a portion of the first chamber to protect the nanostructures from premature exposure.2. The device of claim 1 , wherein the orifice plate comprises at least one of nickel claim 1 , gold claim 1 , platinum claim 1 , palladium claim 1 , or rhodium.3. The device of claim 1 , wherein the nanostructures comprise at least one of pillar structures or conical structures.4. The device of claim 1 , wherein the orifice plate is electroplated with at least one of gold claim 1 , palladium claim 1 , or rhodium.5. The device of claim 1 , wherein the seal comprises at least one of a polymer material claim 1 , a flexible material claim 1 , or a removable material.6. The device of claim 1 , wherein the seal comprises a hermetic seal.7. The device of claim 1 , wherein the seal comprises at least one of polymer tape claim 1 , plastic claim 1 , foil claim 1 , a membrane claim 1 , wax claim 1 , or Polydimethylsiloxane.8. The device of claim 1 , wherein the substrate comprises at least one of a Surface Enhanced Raman spectroscopy substrate claim 1 , a self actuating Surface Enhanced Raman spectroscopy substrate claim 1 , an Enhanced Fluorescence spectroscopy substrate claim 1 , or an Enhanced Luminescence ...

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03-01-2019 дата публикации

High-strength steel sheet and high-strength galvanized steel sheet

Номер: US20190003009A1
Принадлежит: Nippon Steel and Sumitomo Metal Corp

A high-strength steel sheet includes: a specific chemical composition; and a microstructure represented by, in a ⅛ thickness to ⅜ thickness range with ¼ thickness of a sheet thickness from a surface being a center, in volume fraction, ferrite: 85% or less, bainite: 3% or more and 95% or less, tempered martensite: 1% or more and 80% or less, retained austenite: 1% or more and 25% or less, pearlite and coarse cementite: 5% or less in total, and fresh martensite: 5% or less, in which the solid-solution carbon content in the retained austenite is 0.70 to 1.30 mass %, and to all grain boundaries of retained austenite grains having an aspect ratio of 2.50 or less and a circle-equivalent diameter of 0.80 μm or more, the proportion of interfaces with the tempered martensite or the fresh martensite is 75% or less.

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05-01-2017 дата публикации

THIN FILM TYPE COIL COMPONENT AND METHOD OF MANUFACTURING THE SAME

Номер: US20170004917A1
Принадлежит:

A thin film type coil component including coil patterns in a cross section shape having an undercut in lower portions thereof is provided. The coil patterns may reduce parasitic capacitance between the coil patterns, thereby minimizing electrical loss. The volume of the coil patterns may be increased, thereby improving inductance and resistance characteristics. 1. A thin film type coil component comprising:a substrate; anda coil including a plurality of coil patterns disposed on the substrate,wherein a cross-section of each coil pattern has a shape that a width of at least one region among inner regions located between upper and lower cross sections is greater than widths of the upper and lower cross sections.21212. The thin film type coil component of claim 1 , wherein the cross section of each coil pattern satisfies H>H claim 1 , in which H is a height from the upper cross section of the coil pattern to the at least one region and H is a height from the lower cross section thereof to the at least one region.3. The thin film type coil component of claim 1 , wherein an interval between adjacent coil patterns is in the range from about 0.15 to about 0.45 times the width of the at least one region.4. The thin film type coil component of claim 1 , wherein the plurality of coil patterns are made of at least one of gold claim 1 , silver claim 1 , platinum claim 1 , copper claim 1 , nickel claim 1 , and palladium or alloys thereof.5. The thin film type coil component of claim 1 , wherein the substrate is a magnetic substrate.6. The thin film type coil component of claim 1 , further comprising: an insulating layer provided on the substrate.7. The thin film type coil component of claim 6 , wherein the plurality of coil patterns are provided in the insulating layer .8. The thin film type coil component of claim 1 , wherein the cross section of each coil pattern has a double trapezoidal shape in which an undercut is formed in the lower cross section.9. A method of ...

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07-01-2016 дата публикации

METHOD FOR FORMING ELECTRONIC ELEMENT

Номер: US20160005514A1
Принадлежит:

Disclosed is a method for forming an electronic element. The method for forming an electronic element comprises: providing a first substrate comprising a compound comprising a metallic element and a non-metallic element; performing a first treatment by a laser radiation in a first region of the first substrate; and forming a first electrically conductive layer in the first region radiated by the laser. 1. A method for forming an electronic element , comprising:providing a first substrate comprising a compound comprising a metallic element and a non-metallic element;performing a first treatment by a laser radiation in a first region of the first substrate; andforming a first electrically conductive layer in the first region radiated by the laser.2. The method for forming an electronic element as claimed in claim 1 , wherein the compound comprises inorganic compound.3. The method for forming an electronic element as claimed in claim 1 , wherein the first substrate is a monolithic substrate.4. The method for forming an electronic element as claimed in claim 1 , wherein the compound comprises metal oxide or metal nitride.5. The method for forming an electronic element as claimed in claim 1 , wherein a covalent bond exists between the metallic element and the non-metallic element and the step of performing the first treatment breaks some but not all covalent bonds associated with a metallic atom of the metallic element.6. The method for forming an electronic element as claimed in claim 1 , wherein the step of performing the first treatment forms a seed layer for plating.7. The method for forming an electronic element claimed in claim 1 , wherein a lower surface of the first electrically conductive layer is below an upper surface of the first substrate.8. The method for forming an electronic element as claimed in claim 1 , further comprising a light-emitting diode electrically connected to the first electrically conductive layer.9. The method for forming an electronic ...

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20-01-2022 дата публикации

METHOD AND DEVICE FOR PLATING A RECESS IN A SUBSTRATE

Номер: US20220020591A1
Принадлежит: Semsysco GmbH

The teaching relates to a method for plating a recess in a substrate, a device for plating a recess in a substrate and a system for plating a recess in a substrate comprising the device. The method for plating a recess in a substrate includes the following: 110. A method for plating a recess in a substrate () , comprising the following steps:{'b': 10', '11, 'providing a substrate () with a substrate surface () comprising at least one recess,'}{'b': 30', '20', '20, 'applying a replacement gas () to the recess to replace an amount of ambient gas () in the recess to at least partially clear the recess from the ambient gas (),'}{'b': 40', '30', '40', '30, 'applying a processing fluid () to the recess, wherein the replacement gas () dissolves in the processing fluid () to at least partially clear the recess from the replacement gas (), and'}{'b': '10', 'plating the recess in the substrate ().'}23040. Method according to claim 1 , wherein the replacement gas () and the processing fluid () essentially remove any gaseous barrier in the recess before plating the recess.3304020. Method according to claim 2 , wherein the replacement gas () has at a processing temperature a higher solubility in the processing fluid () than the ambient gas ().43040. Method according to claim 3 , wherein the ambient gas is air and the Henry's law solubility constant Hof the replacement gas () in the processing fluid () at room temperature is larger than 6.4×10mol mPa claim 3 , preferably equal to or larger than 1.2×10mol mPaand more preferably equal to or larger than 3.3×10mol mPa53040. Method according to claim 4 , wherein the replacement gas () comprises COand the processing fluid () is essentially water.6. Method according to claim 5 , wherein the plating is an at least partial filling of the recess with an alloy or a metal and in particular with copper claim 5 , nickel claim 5 , indium claim 5 , or cobalt.740401040aa. Method according to claim 6 , wherein the processing fluid () is a plating ...

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20-01-2022 дата публикации

METHOD FOR PRODUCING PACKAGE SUBSTRATE FOR LOADING SEMICONDUCTOR DEVICE

Номер: US20220020602A1
Принадлежит: MITSUBISHI GAS CHEMICAL COMPANY, INC.

A method for manufacturing a package substrate including an insulating layer and a wiring conductor, including: forming, on one or both sides of a core resin layer, a substrate including a peelable first metal layer that has a thickness of 1-70 μm, a first insulating resin layer, and a second metal layer; forming a non-through hole reaching a surface of the first metal layer, performing electrolytic and/or electroless copper plating on its inner wall, and connecting the second and first metal layers; arranging a second insulating resin layer and a third metal layer and heating and pressurizing the first substrate to form a substrate; forming a non-through hole reaching a surface of the second metal layer, performing electrolytic and/or electroless copper plating on its inner wall, and connecting the second and third metal layers; peeling a third substrate; and patterning the first and third metal layers to form the wiring conductor. 1. A method for manufacturing a package substrate for mounting a semiconductor device comprising an insulating layer and a wiring conductor provided on the insulating layer , the method comprising:forming a first substrate comprising a first metal layer that has a thickness of 1 μm to 70 μm and that is peelable from the core resin layer, a first insulating resin layer, and a second metal layer in this order on one side or both sides of a core resin layer;forming a non-through hole reaching a surface of the first metal layer on a surface of the first substrate, carrying out electrolytic copper plating and/or electroless copper plating on an inner wall of the non-through hole, and connecting the second metal layer and the first metal layer;forming a second substrate by heating and pressurizing a laminate formed by arranging a second insulating resin layer and a third metal layer in this order on a surface of the second metal layer of the first substrate;forming a non-through hole reaching the surface of the second metal layer on a surface ...

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03-01-2019 дата публикации

Housing Used for Electric Component and Method for Manufacturing Same

Номер: US20190008063A1
Принадлежит:

A housing and a method for manufacturing a housing are disclosed. In an embodiment a housing for an electric component includes a first housing part and a second housing part, wherein the first housing part and the second housing part are connected in a joining region, wherein the joining region is completely or partially covered by a metallic coating on an outside, wherein the first housing part is joined to the second housing part by a connecting agent, wherein the connecting agent is an adhesive or a solder material, wherein the metallic coating covers the first housing part only at an upper side of the first housing part accessible from the outside when the housing parts are joined by the connecting agent, and wherein the metallic coating extends laterally beyond the first housing part and at least partially covers the second housing part. 121-. (canceled)22. A housing for an electric component comprising:a first housing part; anda second housing part, wherein the first housing part and the second housing part are connected in a joining region, wherein the joining region is completely or partially covered by a metallic coating on an outside,wherein the first housing part is joined to the second housing part by a connecting agent, wherein the connecting agent is an adhesive or a solder material,wherein the metallic coating covers the first housing part only at an upper side of the first housing part accessible from the outside when the housing parts are joined by the connecting agent, andwherein the metallic coating extends laterally beyond the first housing part and at least partially covers the second housing part.23. The housing as claimed in claim 22 , wherein the connecting agent has a viscosity greater than 10000 mPas before solidification.24. The housing as claimed in claim 22 , wherein the first and second housing parts comprise a plastic material or a ceramic material.25. The housing as claimed in claim 22 , wherein the metallic coating comprises at ...

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10-01-2019 дата публикации

Dmlm build release layer and method of use thereof

Номер: US20190009332A1
Автор: Todd Jay Rockstroh
Принадлежит: General Electric Co

A method for additive manufacturing utilizing a build plate with a release layer is provided. The method includes irradiating a first layer of powder in a powder bed to form a first fused region over a support. The first release layer is provided between the first fused region and the support. The method also includes providing a given layer of powder over the powder bed and irradiating the given layer of powder in the powder bed to form a given fused region. Providing the given layer of powder over the powder bed and irradiating the given layer of powder in the powder bed to form a given fused region are repeated until the object is formed in the powder bed. The object may be formed fusing individual layers with irradiation by laser or ebeam, or by binder jetting. The method further includes separating the object from the support by melting or dissolving the first release layer.

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14-01-2016 дата публикации

Method for Producing A Cold-Rolled Flat Steel Product for Deep-Drawing and Ironing Applications, Flat Steel Product, and Use of a Flat Steel Product of Said Type

Номер: US20160010172A1
Принадлежит:

A method is disclosed for the operationally reliable production of a cold-rolled flat steel product of ≦0.5 mm in thickness for deep-drawing and ironing applications. In the method, a steel melt which (in wt %) comprises up to 0.008% C, up to 0.005% Al, up to 0.043% Si, 0.15-0.5% Mn, up to 0.02% P, up to 0.03% S, up to 0.020% N and in each case optionally up to 0.03% Ti and up to 0.03% Nb and, as a remainder, iron and unavoidable impurities, is, with the omission of a Ca treatment, subjected to a secondary metallurgical treatment which, in addition to a vacuum treatment, comprises a ladle furnace treatment and during which the steel melt to be treated is kept under a slag, the Mn and Fe contents of which are, in sum total, <15 wt %. From the steel melt, a thin slab or a cast strip are produced, which are subsequently hot-rolled to form a hot strip with a thickness of <2.5 mm and wound to form a coil. Subsequently, the hot strips are cold-rolled to form a flat steel product of up to 0.5 mm in thickness. 1. A method for producing a cold-rolled flat steel product of up to 0.5 mm in thickness for deep-drawing and ironing applications , comprising the following working steps:a) producing a metal melt which (in wt %) comprises up to 0.008% C, up to 0.005% Al, up to 0.043% Si, 0.15-0.5% Mn, up to 0.02% P, up to 0.03% S, up to 0.020% N and in each case optionally up to 0.03% Ti and up to 0.03% Nb and, as a remainder, iron and unavoidable impurities, the contents of which are to be attributed to up to 0.08% Cr, up to 0.08% Ni, up to 0.08% Cu, up to 0.02% Sn, up to 0.01% Mo, up to 0.0020% V, up to 0.007% B, up to 0.05% Co and up to 0.0060% Ca, wherein the steel melt is, with the omission of a Ca treatment, subjected to a secondary metallurgical treatment which, in addition to a vacuum treatment, comprises a ladle furnace treatment and during which the steel melt to be treated is kept under a slag, the Mn content % Mn and Fe content % Fe are defined by % Mn+% Fe<15 wt %;b) ...

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14-01-2021 дата публикации

METALLIC FOAM BODY WITH CONTROLLED GRAIN SIZE ON ITS SURFACE, PROCESS FOR ITS PRODUCTION AND USE THEREOF

Номер: US20210010146A1
Принадлежит:

The invention relates to a metallic foam body, comprising 1. A metallic foam body , comprising(a) a metallic foam body substrate made of at least one metal or metal alloy A; and(b) a layer of a metal B present on at least a part of the surface of the metallic foam body substrate (a),wherein A and B differ in the grain size of the metal or metal alloy, wherein the grain size of the metal or metal alloy A is in the range of 1 μm to 100 μm and/or the grain size of the metal B is in the range of 1 nm to 50 μm; andwherein the metal B is silver and the metal or metal alloy A is selected from a group consisting of Ni, Cr, Co, Cu, Ag, and any alloy thereof; (i) provision of a porous organic polymer foam;', '(ii) deposition of at least one metal or metal alloy A on the porous organic polymer foam;', '(iii) burning off of the porous organic polymer foam to obtain the metallic foam body substrate (a); and', '(iv) deposition by electroplating of the metallic layer (b) of a metal or metal alloy B at least on a part of the surface of the metallic foam body (a);, 'obtainable by a process comprising the steps'} (ii1) deposition of a first metallic layer containing a metal or metal alloy A1 by a chemical or physical vapor deposition method; and', '(ii2) deposition of a second metallic layer containing a metal or metal alloy A2 by electroplating;, 'wherein step (ii) comprises the steps'}wherein the metal or metal alloy A1 is selected from a group consisting of Ni, Cr, Co, Cu, Ag, and any alloy thereof and wherein A2 and B are silver.2. A metallic foam body according to claim 1 , wherein A and B differ in the crystal grain size of the metal or metal alloy.3. A metallic foam body according to claim 1 , wherein the average thickness of the first metallic layer is up to 0.1 μm and the average thickness of the second metallic layer is from 5 to 50 μm.4. A metallic foam body according to claim 1 , wherein the porous organic polymer foam is selected from the group consisting of polyurethane ...

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10-01-2019 дата публикации

Method for producing electroconductive laminate, laminate, and electroconductive laminate

Номер: US20190010608A1
Принадлежит: Fujifilm Corp

An object of the present invention is to provide a method for producing an electroconductive laminate, which is capable of forming a metal layer having low resistance at a position corresponding to a patterned plated layer, a laminate, and an electroconductive laminate. The method for producing an electroconductive laminate of the present invention includes: a step of forming a plated layer forming layer on a base material using a predetermined plated layer forming composition; a step of subjecting the plated layer forming layer to a patternwise exposure treatment and a development treatment to form a patterned plated layer containing a portion having a line width of less than 3 μm; a step of applying a plating catalyst or a precursor thereof to the patterned plated layer using an alkaline plating catalyst-applying liquid containing the plating catalyst or the precursor thereof; and a step of subjecting the patterned plated layer to which the plating catalyst or the precursor thereof has been applied to a plating treatment using a plating liquid containing aminocarboxylic acids to form a metal layer on the patterned plated layer.

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09-01-2020 дата публикации

LEAK CHECKING METHOD, LEAK CHECKING APPARATUS, ELECTROPLATING METHOD, AND ELECTROPLATING APPARATUS

Номер: US20200010972A1
Принадлежит:

There is disclosed an improved leak checking method which can accurately test a sealing performance of a substrate holder more than conventional leak check techniques. The leak checking method includes: holding a substrate with a substrate holder, the substrate holder including a first holding member and a second holding member, the second holding member having an opening through which a surface of the substrate is exposed; pressing a sealing projection of the second holding member against the surface of the substrate when holding the substrate with the substrate holder; covering the surface of the substrate, exposed through the opening, and the sealing projection with a sealing cap; forming a hermetic space between the sealing cap and the substrate holder; introducing a pressurized gas into the hermetic space; and detecting a decrease in pressure of the pressurized gas in the hermetic space. 1. A leak checking method comprising:holding a substrate with a substrate holder, the substrate holder including a first holding member and a second holding member, the first holding member having a first opening and a back-side sealing projection, the second holding member having a second opening and a front-side sealing projection;pressing the front-side sealing projection and the back-side sealing projection against a front surface and a back surface, respectively, of the substrate when holding the substrate with the substrate holder;covering the front surface of the substrate, exposed through the second opening, and the front-side sealing projection with a front-side sealing cap;forming a front-side hermetic space between the front-side sealing cap and the substrate holder;covering the back surface of the substrate, exposed through the first opening, and the back-side sealing projection with a back-side sealing cap;forming a back-side hermetic space between the back-side sealing cap and the substrate holder;introducing a pressurized gas into the front-side hermetic space ...

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12-01-2017 дата публикации

METHOD FOR MANUFACTURING CERAMIC ELECTRONIC COMPONENT

Номер: US20170011849A1
Принадлежит: MURATA MANUFACTURING CO., LTD.

The variation between different product lots is reduced for plating growth dimensions of plated films to serve as external electrodes. The correlation is grasped in advance among the surface resistance value of a ceramic body, the applying charge amount for electrolytic plating, an actual plating growth dimension obtained when the ceramic body with the surface resistance value is subjected to plating with the foregoing applying charge amount. The surface resistance value is measured for the ceramic body on which plated films to serve as external electrodes are to be formed by applying electrolytic plating, and the applying charge amount required for plating is determined by applying the surface resistance value and a designed value for an intended plating growth dimension to the correlation mentioned above. Thereafter, in order to form the plated films, the ceramic body is subjected to electrolytic plating, with the applying charge amount determined. 1. A method for manufacturing a ceramic electronic component comprising a ceramic body and an external electrode formed on the ceramic body , wherein the external electrode is provided at least partially by a plated film formed by applying electrolytic plating ,the method comprising:a pre-grasping step of grasping in advance a correlation, for a ceramic electronic component to be manufactured, among a surface resistance value of a ceramic body, an applying charge amount for electrolytic plating, and an actual plating growth dimension obtained when the ceramic body with the surface resistance value is subjected to plating with the applying charge amount;a resistance value measurement step of measuring a surface resistance value of a ceramic body on which a plated film to serve as at least a part of an external electrode is to be formed by applying electrolytic plating;an applying charge amount determination step of determining an applying charge amount required for plating by applying the surface resistance value ...

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12-01-2017 дата публикации

PRETREATMENT METHOD FOR PHOTORESIST WAFER PROCESSING

Номер: US20170011906A1
Принадлежит:

Certain embodiments herein relate to methods and apparatus for processing a partially fabricated semiconductor substrate in a remote plasma environment. The methods may be performed in the context of wafer level packaging (WLP) processes. The methods may include exposing the substrate to a reducing plasma to remove photoresist scum and/or oxidation from an underlying seed layer. In some cases, photoresist scum is removed through a series of plasma treatments involving exposure to an oxygen-containing plasma followed by exposure to a reducing plasma. In some embodiments, an oxygen-containing plasma is further used to strip photoresist from a substrate surface after electroplating. This plasma strip may be followed by a plasma treatment involving exposure to a reducing plasma. The plasma treatments herein may involve exposure to a remote plasma within a plasma treatment module of a multi-tool electroplating apparatus. 1. A method of removing photoresist scum and electroplating metal into photoresist features , the method comprising: (i) at least one plasma treatment module comprising a plasma treatment chamber and a plasma generation chamber connected to the plasma treatment chamber; and', '(ii) at least one electroplating module comprising an electroplating chamber;', 'wherein the substrate comprises:', '(i) a metal seed layer, and', '(ii) a layer of photoresist over and directly in contact with the metal seed layer, wherein the layer of photoresist comprises photoresist features patterned therein, and wherein a bottom of the photoresist features comprise photoresist scum;, '(a) receiving a substrate in a multi-tool electroplating apparatus, the multi-tool electroplating apparatus comprising(b) generating a reducing plasma from a reducing plasma generation gas in the plasma generation chamber;(c) flowing the reducing plasma from the plasma generation chamber into the plasma treatment chamber to thereby expose the substrate to the reducing plasma, react the ...

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12-01-2017 дата публикации

EMISSIVITY, SURFACE FINISH AND POROSITY CONTROL OF SEMICONDUCTOR REACTOR COMPONENTS

Номер: US20170011909A1
Принадлежит:

An apparatus and methods are provided related to a surface of a reaction chamber assembly component. The surface may be roughened and/or anodized to provide desirable emissivity and porosity to help reduce burn-in time of a reaction chamber and to help reduce particles within the chamber. The apparatus and methods may be suitable for thin film deposition on semiconductor or other substrates. 1. An apparatus comprising:an aluminum alloy reaction chamber assembly component having at least one anodized surface layer.2. The apparatus of wherein the anodized surface layer has a thickness in a range of 3-15 μm.3. The apparatus of wherein the anodized surface layer has a surface roughness average of 0.4-6.3 μm.4. The apparatus of wherein the anodized surface layer has an emissivity of at least 0.50.5. The apparatus of wherein the anodized surface layer has an emissivity of at least 0.50.6. The apparatus of wherein the anodized surface layer has a surface roughness average of 0.4-6.3 μm.7. The apparatus of wherein the component is a showerhead.8. The apparatus of wherein the at least one anodized surface layer defines a downwardly facing surface of the showerhead.9. The apparatus of wherein the at least one anodized surface layer defines an upwardly facing surface of the showerhead.10. The apparatus of wherein the at least one anodized surface layer defines an upwardly facing surface of the showerhead.11. The apparatus of further comprising a substrate support assembly having a substrate support surface adapted to support thereon a substrate; wherein the showerhead has a surface which is essentially parallel to the substrate support surface; and the at least one anodized surface layer defines the surface of the showerhead.12. The apparatus of wherein the showerhead comprises a showerhead plate; and the at least one anodized surface layer defines a surface of the showerhead plate.13. The apparatus of further comprising a reaction chamber in which the showerhead plate is ...

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12-01-2017 дата публикации

Printed circuit board and corresponding method for producing a printed circuit board

Номер: US20170013715A1
Автор: Hassel Uwe
Принадлежит:

The printed circuit board with at least one substrate layer having signal lines on a corresponding upper surface and on a corresponding lower surface has a sleeve-sized conductive layer on a circumference of at least one via hole between the upper and lower surface for a conductive connection between at least one signal line on the upper surface and at least one signal line on the lower surface. to An axial enlargement of the sleeve-sized conductive layer is radially bent above a base layer of copper on the upper surface and below a base layer of copper on the lower surface. 1. A printed circuit board with at least one substrate layer having signal lines on a corresponding upper surface and on a corresponding lower surface , wherein on a circumference of at least one via hole a sleeve-sized conductive layer is disposed between the upper and lower surface for a conductive connection between at least one signal line on the upper surface and at least one signal line on the lower surface and wherein an axial enlargement of the sleeve-sized conductive layer is radially bent above a metallic base layer on the upper surface and below a metallic base layer on the lower surface.2. The printed circuit board according to claim 1 , wherein the height between the top of the radially bent enlargement of the sleeve-sized conductive layer and the top of the base layer of copper is at least 5 Micrometer claim 1 , preferably at least 10 Micrometer and most preferred at least 15 Micrometer.3. The printed circuit board according to claim 1 , wherein each via hole inside the sleeve-sized conductive layer is filled with a dielectric material.4. The printed circuit board according to claim 3 , wherein the dielectric material is a resin claim 3 , preferably an epoxy resin.5. The printed circuit board according to claim 1 , wherein the sleeve-sized conductive layer comprises an outer chemical-vapor-deposited layer claim 1 , preferably of copper claim 1 , and an inner galvanically deposited ...

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19-01-2017 дата публикации

Electrodermal Activity Sensor

Номер: US20170014043A1
Автор: Daragh Mcdonnell
Принадлежит: Galvanic Ltd

The present invention is directed towards a method of manufacturing a sensor disc for use as a dry electrode in a skin conductance measuring device, the sensor disc comprising a plurality of layers of different materials and the method of manufacturing comprising the steps of etching a copper base layer; electroplating the copper base layer with an intermediate bright copper layer; plating the intermediate bright copper layer with an intermediate palladium plated layer; and, plating the intermediate palladium plated layer with a gold plated surface layer. The advantage of a method of manufacturing a sensor disc in accordance with the present invention is that a roughened surface is created by the etching. This increased roughness corresponds to an increase in surface area of skin in contact with the sensor disc. The larger contact area implies a larger sweat layer between skin and metal, resulting in reduced electrical impedance and hence an improvement in the signal-to-noise ratio of the skin conductance signal detected by the sensor disc. Furthermore, the surface roughness assists in trapping the sweat, also leading to reduced impedance and an improvement in the signal-to-noise ratio of the detected signals. Moreover, in addition to the high performance of the sensor discs manufactured by this process, the sensor discs produced also meet the ergonomic and aesthetic expectations of a contemporary mass market and may be advantageously utilized in a consumer electronics product.

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15-01-2015 дата публикации

Hot-rolled steel sheet and manufacturing method thereof

Номер: US20150017471A1
Принадлежит: Nippon Steel and Sumitomo Metal Corp

There are provided a high-strength hot-rolled steel sheet securing low-temperature toughness and having excellent stretch flangeability by controlling a structural fraction and a hardness difference among structures, and a manufacturing method thereof. A hot-rolled steel sheet contains: C: 0.01 to 0.2%; Si: 0.001 to 2.5% or less; Mn: 0.10 to 4.0% or less; P: 0.10% or less; S: less than 0.03%; Al: 0.001 to 2.0%; N: less than 0.01%; Ti: (0.005+48/14[N]+48/32[S]) % or more and 0.3% or less; Nb: 0 to 0.06%; Cu: 0 to 1.2%; Ni: 0 to 0.6%; Mo: 0 to 1%; V: 0 to 0.2%; Cr: 0 to 2%; Mg: 0 to 0.01%; Ca: 0 to 0.01%; REM: 0 to 0.1%; and B: 0 to 0.002%, and has: an texture in which, at a central portion of a sheet thickness located between ⅜ to ⅝ thickness positions of the sheet thickness from a surface of the steel sheet, an average value of X-ray random intensity ratios of a group of {100}<011> to {223}<110> orientations of a sheet plane is 6.5 or less and an X-ray random intensity ratio of a {332}<113> crystal orientation is 5.0 or less; and a microstructure in which a total area ratio of tempered martensite, martensite and lower bainite is more than 85%, and an average crystal grain diameter is 12.0 m or less.

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19-01-2017 дата публикации

METHOD FOR THE ELECTROPLATING OF TiAl ALLOYS

Номер: US20170016132A1
Принадлежит:

The present invention relates to a method for the coating of a surface of a TiAl alloy, in which at least one layer is electroplated on the surface of the TiAl alloy, wherein the surface of the TiAl alloy is subjected to an at least two-step surface treatment for the formation of a roughened surface, this treatment comprising at least one electrochemical processing and at least one electroless chemical processing. 1. A method for the coating of a surface of a TiAl alloy , in which at least one layer is electroplated on the surface of the TiAl alloy , wherein the surface of the TiAl alloy is subjected to an at least two-step surface treatment for the formation of a roughened surface , in which at least one electrochemical processing and at least one elecroless chemical processing are conducted.2. The method according to claim 1 , wherein in the two-step surface treatment claim 1 , the electrochemical processing occurs in a first step and the electroless chemical treatment occurs in a second step.3. The method according to claim 1 , wherein the electrochemical processing is conducted by anodic etching in an acetic acid-hydrofluoric acid solution claim 1 , wherein concentrations by weight of 800 to 900 g/L of acetic acid and 100 to 200 g/L of hydrofluoric acid are selected for the composition of the acetic acid-hydrofluoric acid solution.4. The method according to claim 1 , wherein the electroless chemical processing is produced by etching in a fluoroboric acid-sodium tetrafluoroborate solution.5. The method according to claim 1 , wherein claim 1 , between the electrochemical processing and the electroless chemical processing and/or prior to the electrochemical processing claim 1 , a cleaning step is carried out with compressed air and/or a water jet and followed by a drying step.6. The method according to claim 1 , wherein claim 1 , prior to the two-step surface treatment claim 1 , a chemical etching of the surface of the TiAl alloy is conducted with a nitric acid ...

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18-01-2018 дата публикации

Surface-treated steel sheet, metal container, and method for producing surface-treated steel sheet

Номер: US20180016693A1
Принадлежит: Toyo Kohan Co Ltd, Toyo Seikan Co Ltd

There is provided a surface-treated steel sheet ( 1 ) comprising: a tin-plated steel sheet ( 10 ) obtained by tin-plating a steel sheet ( 11 ); a phosphate compound layer ( 20 ) containing tin phosphate formed on the tin-plated steel sheet ( 10 ); and an aluminum-oxygen compound layer ( 30 ) formed on the phosphate compound layer ( 20 ), a main constituent of the aluminum-oxygen compound layer being an aluminum-oxygen compound.

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21-01-2016 дата публикации

Microorganism detection sensor, method for manufacturing same, and polymer layer

Номер: US20160018391A1
Принадлежит: Osaka Prefecture University, Sharp Corp

The present invention is a sensor for detecting a microorganism, which is provided with a detection unit equipped with a detection electrode and a polymer layer, wherein the polymer layer is arranged on the detection electrode and is provided with a template having a three-dimensional structure complementary to a three-dimensional structure of a microorganism to be detected. The sensor detects a microorganism on the basis of the captured state of the microorganism onto the template. The polymer layer is formed by a manufacturing method including a polymerization step of polymerizing a monomer in the presence of the microorganism to be detected to form a polymer layer having the microorganism incorporated therein on the detection electrode, and a disruption step of bringing at least a part of the microorganism incorporated in the polymer layer into contact with a solution containing a lytic enzyme to disrupt the microorganism.

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17-01-2019 дата публикации

METHOD OF FORMING A METAL LAYER ON A PHOTOSENSITIVE RESIN

Номер: US20190017175A1
Принадлежит:

The present invention provides a method of forming a metal layer on a specific photosensitive resin. The method comprises the following steps: (i) pretreatment: cleaning and pre-activating a surface of the photosensitive resin by using an alkaline solution; (ii) surface modification: soaking the photosensitive resin in a surface modifier to form an organic modification layer; (iii) surface activation: adding catalytic metal ions to form a metal ion complex with the organic modification layer; (iv) reduction reaction: reducing the metal ion complex into a nano metal catalyst by using a reducing agent; (v) chemical plating: soaking the photosensitive resin in an chemical plating solution to form a conductive metal layer; (vi) heat treatment: baking the photosensitive resin at 100-250° C., and (vii) electroplating thickening: electroplating the baked photosensitive resin to thicken the conductive metal layer. 2. The method of claim 1 , wherein in the surface modification step (ii) claim 1 , the soaking time is 1-20 minutes claim 1 , the concentration of the amino compound in the surface modifier is 0.1-10 g/L claim 1 , and the temperature is 30-75° C.3. The method of claim 1 , wherein the catalytic metal ions added in the surface activation step (iii) is an acidic aqueous solution containing Cu claim 1 , Ni claim 1 , Ag claim 1 , Au claim 1 , or Pd ions.4. The method of claim 1 , wherein the reducing agent used in the reduction reaction step (iv) is sodium hypophosphite claim 1 , sodium borohydride claim 1 , dimethylamine borane or hydrazine aqueous solution.5. The method of claim 1 , wherein the chemical plating solution used in the chemical plating step (v) comprises copper ions claim 1 , nickel ions claim 1 , a chelating agent claim 1 , a reducing agent claim 1 , a pH buffer claim 1 , a surfactant claim 1 , and a pH adjuster.6. The method of claim 5 , wherein the source of the copper ions is copper nitrate claim 5 , copper sulfate claim 5 , copper chloride claim 5 , ...

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21-01-2021 дата публикации

SUBSTRATE LOCKING SYSTEM, DEVICE AND PROCEDURE FOR CHEMICAL AND/OR ELECTROLYTIC SURFACE TREATMENT

Номер: US20210017662A1
Принадлежит:

Exemplary substrate locking system, device, apparatus and method for chemical and/or electrolytic surface treatment of a substrate in a process fluid can be provided. For example, it is possible to provide a first element, a second element and a locking unit. The first element and the second element can be configured to hold the substrate between each other. The locking unit can be configured to lock the first element and the second element with each other. The locking unit can comprise a magnet control device and a magnet. The magnet can be arranged at or near the first element and/or the second element. The magnet control device can be configured to control a magnetic force between the first element and the second element. 119-. (canceled)20. A substrate locking method for at least one of a chemical surface treatment or an electrolytic surface treatment of a substrate in a process fluid , comprising:arranging a substrate between a first element and a second element, andlocking the first element and the second element with each other using a locking arrangement which comprises a magnet control device and a plurality of magnets distributed at or near the first element along the substrate, wherein the magnet control device is configured to control a magnetic force between the first element and the second element.21. The substrate locking method according to claim 20 , wherein the locking arrangement comprises at least one further magnet that is arranged at or near the second element claim 20 ,22. The substrate locking method according to claim 20 , wherein the first element is a first contact ring claim 20 , and the second element is a second contact ring claim 20 , and wherein the first and second contact rings are configured to hold at least one substrate between each other.23. The substrate locking method according to claim 20 , wherein the first element is a substrate holder claim 20 , and the second element is a contact loop claim 20 , and wherein the substrate ...

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21-01-2021 дата публикации

Manufacturing Method of Nickel Plated Steel Sheet and Nickel Plated Steel Sheet Prepared Therefrom

Номер: US20210017663A1
Принадлежит: Tcc Steel Corp

The present invention provides a nickel-plated and thermally-treated steel sheet with excellent corrosion resistance, in which a remaining nickel amount obtained by analyzing an nickel-iron alloy layer using energy dispersive spectrometry (EDS) or electron probe X-ray microanalysis (EPMA) after pure nickel remaining on the nickel-iron alloy layer was completely removed after the heat treatment for alloying of a nickel plated layer with base iron is 0.1 wt % or more to less than 30 wt % of the total amount of iron and nickel.

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28-01-2016 дата публикации

HYPOALLERGENIC ORTHOPEDIC SURGICAL INSTRUMENTS AND METHODS

Номер: US20160022879A1
Принадлежит:

According to an exemplary embodiment, a hypoallergenic orthopedic surgical instrument to prepare bone for the implantation of orthopedic prosthesis may be provided. The instrument may include a hypoallergenic metal alloy such as, but not limited to, titanium nitride, oxidized zirconium, silver, copper, zinc and palladium. In a further embodiment, the hypoallergenic orthopedic surgical may include a high strength, solid low carbon martensitic stainless steel and a thin, high-density hypoallergenic metal alloy coating on the surface of the instrument. According to another exemplary embodiment, a process of building a hypoallergenic orthopedic surgical instrument to prepare bone for the implantation of orthopedic prosthesis may be provided. The process may include cleaning the surface of a high strength, solid low carbon martensitic stainless steel orthopedic surgical instrument to prepare bone for the implantation of orthopedic prosthesis and forming a thin, high-density coating on the surface of the instrument. 1. A hypoallergenic orthopedic surgical instrument to prepare bone for the implantation of orthopedic prosthesis comprising:an orthopedic surgical instrument composed of a hypoallergenic metal alloy.2. The hypoallergenic surgical instrument of claim 1 , wherein the hypoallergenic metal alloy includes metal and at least one of titanium nitride claim 1 , oxidized zirconium claim 1 , silver claim 1 , copper claim 1 , zinc and palladium.3. The hypoallergenic surgical instrument of claim 1 , wherein the hypoallergenic metal is titanium nitride.4. The hypoallergenic surgical instrument of claim 1 , wherein the hypoallergenic metal is zirconium oxide.5. A hypoallergenic orthopedic surgical instrument to prepare bone for the implantation of orthopedic prosthesis comprising:a high strength, solid low carbon martensitic stainless steel; anda thin, high-density coating on the surface of said instrument.6. The hypoallergenic surgical instrument defined in claim 5 , ...

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28-01-2016 дата публикации

CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR

Номер: US20160024346A1
Принадлежит:

A ceramic electronic component that includes a ceramic element, and a coating film and external electrodes that are provided on the surface of the ceramic element. The coating film is selectively formed on the surface of the ceramic element by applying, to the ceramic electronic component, a resin-containing solution containing at least one anion of a sulfuric acid, a sulfonic acid, a carboxylic acid, a phosphoric acid, a phosphoric acid, and a hydrofluoric acid. 1. A ceramic electronic component comprising:a ceramic element;a coating film on a surface of the ceramic element; andan electrode on the surface of the ceramic element,wherein the coating film includes a resin containing at least one anion of a sulfuric acid, a sulfonic acid, a carboxylic acid, a phosphoric acid, a phosphoric acid, and a hydrofluoric acid.2. The ceramic electronic component according to claim 1 , wherein the resin has a thermal decomposition temperature of 240° C. or higher.3. The ceramic electronic component according to claim 1 , wherein the resin comprises at least one of an epoxy resin claim 1 , a polyimide resin claim 1 , a silicone resin claim 1 , a polyamideimide resin claim 1 , a polyetheretherketone resin claim 1 , and a fluorine-containing resin.4. The ceramic electronic component according to claim 1 , wherein the coating film contains cross-linked resin components.5. The ceramic electronic component according to claim 1 , further comprising a plated film on the electrode.6. The ceramic electronic component according to claim 1 , wherein the coating film is formed on the surface of the ceramic element by applying claim 1 , to the surface of the ceramic element claim 1 , a resin-containing solution containing the at least one anion of the sulfuric acid claim 1 , the sulfonic acid claim 1 , the carboxylic acid claim 1 , the phosphoric acid claim 1 , the phosphonic acid claim 1 , and the hydrofluoric acid.7. A method for manufacturing a ceramic electronic component claim 1 , the ...

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28-01-2016 дата публикации

Method for Producing a Profile and a Manufacturing System for Producing a Profile

Номер: US20160024605A1
Принадлежит:

A method for producing a profile includes method steps of: providing a workpiece; shaping the workpiece; joining the workpiece; coating the workpiece; heating the workpiece; and at least partially hardening the workpiece; wherein the coating method step is carried out temporally after the joining method step and temporally before the heating method step. 1. A method for producing a profile , comprising the following method steps:providing a workpiece,shaping the workpiece,joining the workpiece,coating the workpiece,heating the workpiece,at least partially hardening the workpiece,wherein the coating method step is carried out temporally after the joining method step and temporally before the heating method step.2. The method according to claim 1 , wherein claim 1 , in the joining method step claim 1 , the shaped workpiece is welded.3. The method according to claim 1 , wherein claim 1 , in the shaping method step claim 1 , a slit is formed in the shaped workpiece by deformation.4. The method according to claim 1 , wherein the coated workpiece is hardened in a shaping manner in a hardening tool.5. The method according to claim 1 , wherein claim 1 , in the coating method step claim 1 , the joined workpiece is coated with a hot-dip coating process.6. The method according to claim 1 , wherein claim 1 , in the coating method step claim 1 , the joined workpiece is coated with an electrolytic coating process.7. The method according to claim 1 , wherein claim 1 , in the coating method step claim 1 , the joined workpiece is coated with an anti-scale layer in a painting process.8. The method according to claim 1 , further comprising cleaning the workpiece before the coating method step.9. The method according to claim 1 , wherein claim 1 , in the heating method step claim 1 , the coated workpiece is heated to a hardening temperature.10. The method according to claim 1 , wherein claim 1 , in the hardening method step claim 1 , the coated workpiece is transferred into a hardening ...

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24-04-2014 дата публикации

THIN-TIN TINPLATE

Номер: US20140110266A1
Автор: LEVEY Peter R.
Принадлежит:

Iron containing substrates are electrically polarized in a pre-plating composition which activates the surface of the steel substrate to receive thin tin or tin alloy. The thin tin or tin alloy is electroplated onto the activate surface of the steel substrate. The thin tinplate and alloy have reduced amounts of pores in the surface. 1. A method comprising:a) providing a steel substrate;b) contacting the steel substrate with a pre-plating composition comprising one or more organic sulfonic acids, salts or anhydrides thereof and one or more grain refiners;c) electrolytically polarizing the steel substrate; andd) electrolytically plating tin or tin alloy layer on the steel substrate.2. The method of claim 1 , wherein the tin or tin alloy is plated on the steel substrate in amounts of 0.5-11.2 g/m.3. The method of claim 1 , wherein the tin or tin alloy layer comprises a FeSnintermetallic layer of 0.1-1.4 g/m.4. The method of claim 1 , wherein the one or more grain refiners are chosen from carboxy aromatic compounds claim 1 , alkoxylates claim 1 , alkylene oxide compounds and polyalkylene glycols.5. The method of claim 4 , wherein the one or more grain refiners are in amounts of 0.01 g/l to 20 g/L.6. The method of claim 1 , wherein the pre-plating composition further comprises one or more metal solubilizing agent.7. The method of claim 1 , wherein the steel substrate is anodic polarized followed by cathodic polarization.8. The method of claim 1 , wherein the pre-plating composition further comprises one or more inorganic acids.9. The method of claim 1 , wherein the one or more organic sulfonic acids claim 1 , salts or anhydrides thereof are in amounts of 0.1 g/L to 50 g/L. This application claims the benefit of priority under 35 U.S.C. §119(e) to U.S. Provisional Application No. 61/716,450, filed Oct. 19, 2012, the entire contents of which application are incorporated herein by reference.The present invention is directed to a method of electroplating thin-tin tinplate. ...

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26-01-2017 дата публикации

LITHIUM-ION BATTERIES WITH NANOSTRUCTURED ELECTRODES AND ASSOCIATED METHODS OF MAKING

Номер: US20170025672A1
Принадлежит:

Several embodiments related to lithium-ion batteries having electrodes with nanostructures, compositions of such nanostructures, and associated methods of making such electrodes are disclosed herein. In one embodiment, a method for producing an anode suitable for a lithium-ion battery comprising preparing a surface of a substrate material and forming a plurality of conductive nanostructures on the surface of the substrate material via electrodeposition without using a template. 1. A method for producing an anode for a lithium-ion battery , the method comprising:providing a substrate, including a metallic material, having a nucleation layer grown thereon; andforming a plurality of freestanding conductive nanostructures on a surface of the nucleation layer via electrodeposition without using a template.2. The method of wherein:providing the substrate includes growing the nucleation layer on the substrate at a first temperature; andforming the plurality of freestanding conductive nanostructures includes forming the plurality of freestanding conductive nanostructures on the surface of the nucleation layer via electrodeposition at a second temperature different than the first temperature.3. The method of wherein forming the plurality of freestanding conductive nanostructures includes forming the plurality of freestanding conductive nanostructures on the surface of the nucleation layer via electrodeposition without using a template at a temperature greater than about 40° C.4. The method of wherein forming the plurality of freestanding conductive nanostructures includes forming a plurality of freestanding conductive nanoneedles on the surface of the nucleation layer via electrodeposition without using a template.5. The method of wherein forming the plurality of freestanding conductive nanostructures includes forming a plurality of tin nanoneedles on the surface of the nucleation layer via electrodeposition without using a template.6. The method of wherein:forming the ...

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28-01-2021 дата публикации

METALLIC STRUCTURE AND A METHOD FOR SURFACE TREATMENT OF A METALLIC STRUCTURE

Номер: US20210025072A1
Принадлежит:

A metallic structure and a method for surface treatment of a metallic structure. The method includes the steps of: defining a first surface morphology on a surface of the metallic structure using a first surface treatment process; and manipulating the surface using a second surface treatment process to transform the first surface morphology to a second surface morphology; wherein the metallic structure is substantially made of a first metallic material; and wherein the second surface treatment process includes performing at least one cycle of depositing the first metallic material on the surface of the metallic structure and etching away at least some of the first metallic material from the metallic structure. 1. A method for surface treatment of a metallic structure , comprising the steps of:defining a first surface morphology on a surface of the metallic structure using a first surface treatment process; andmanipulating the surface using a second surface treatment process to transform the first surface morphology to a second surface morphology;wherein the metallic structure is substantially made of a first metallic material; andwherein the second surface treatment process includes performing at least one cycle of depositing the first metallic material on the surface of the metallic structure and etching away at least some of the first metallic material from the metallic structure.2. The method in accordance with claim 1 , wherein the first surface treatment process includes etching away at least some of an impurity different from the first metallic material in the metallic structure.3. The method in accordance with claim 1 , wherein the first surface morphology includes a morphology of different nanostructures.4. The method in accordance with claim 1 , wherein the second surface morphology includes a morphology of substantially uniform nanostructures.5. The method in accordance with claim 1 , wherein the first and/or the second surface treatment process is ...

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04-02-2016 дата публикации

HIGH THROUGH-PUT AND LOW TEMPERATURE ALD COPPER DEPOSITION AND INTEGRATION

Номер: US20160032455A1
Принадлежит:

Methods of depositing a metal layer utilizing organometallic compounds. A substrate surface is exposed to a gaseous organometallic metal precursor and an organometallic metal reactant to form a metal layer (e.g., a copper layer) on the substrate. 1. A method comprising:heating a substrate to a temperature in the range of about 60° C. to about 150° C.;exposing at least a portion of a surface of the substrate to a gaseous organometallic metal precursor to form a film of the organometallic metal precursor on the surface of the substrate, wherein the organometallic metal precursor is a metal aminoalkoxide complex, a metal dialkoxide complex or metal diketonate complex; andexposing a gaseous organometallic metal reactant to the film of the organometallic metal precursor to form a metal layer on the substrate.2. The method of claim 1 , wherein the film is a monolayer or sub-monolayer of the organometallic metal precursor claim 1 , and the metal layer is a monolayer or sub-monolayer.3. The method of claim 2 , which further comprises repeating exposure of the substrate and previously deposited metal layer to the gaseous organometallic metal precursor and gaseous organometallic metal reactant to deposit additional monolayers or sub-monolayers of the metal.4. The method of claim 1 , wherein the metal aminoalkoxide complex claim 1 , metal dialkoxide complex claim 1 , and metal diketonate complex claim 1 , is a liquid at temperatures greater than about 50° C. claim 1 , and wherein each organic ligand bonds to the metal through either an oxygen and a nitrogen coordinate bond or two oxygen coordinate bonds.5. The method of claim 4 , wherein the metal aminoalkoxide complexes claim 4 , metal dialkoxide complexes claim 4 , and metal diketonate complexes do not contain any halides claim 4 , and are a liquid at standard ambient temperature and pressure.6. The method of claim 5 , wherein the metal is Cu claim 5 , and the organometallic metal precursor is selected from the group ...

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02-02-2017 дата публикации

SLIDING MEMBER AND SLIDING BEARING

Номер: US20170030409A1
Автор: Wada Hitoshi
Принадлежит: TAIHO KOGYO CO., LTD.

A sliding member includes a base layer that includes soft particles made of a soft material deposited in a matrix and a soft layer made of a soft material. The soft material is softer than the matrix, the soft layer is formed on a surface of the base layer, and a maximum epitaxial index of the soft particles as the boundary portion of the sliding member is equal to or less than 10% and greater than 0%. The epitaxial index of a soft particle at the boundary portion is a ratio of: a portion of a length between a first endpoint and a second endpoint of a soft particle where an edge of the boundary portion is not visible within an area less than 1 μm from the length between the first endpoint and the second endpoint, to the length between the first endpoint and the second endpoint. 1. A sliding member , comprising:a base layer comprising soft particles made of a soft material deposited in a matrix; anda soft layer made of a soft material,wherein the soft material is softer than the matrix,wherein the soft layer is formed on a surface of the base layer,wherein a maximum epitaxial index of the sliding member is equal to or less than 10% and greater than 0%,wherein the maximum epitaxial index of the sliding member is a maximum value of all of an epitaxial index of the soft particles at the boundary portion, and 'a portion of a length between a first endpoint of a soft particle and a second endpoint of the soft particle where an edge of the boundary portion is not visible within an area not farther than 1 μm from the length between the first endpoint and the second endpoint, to', 'wherein the epitaxial index of the soft particles at the boundary portion is a ratio ofthe length between the first endpoint and the second endpoint.2. The sliding member according to claim 1 , wherein a boundary portion is formed between crystal grains of the soft particles and crystal grains of the soft layer.3. The sliding member according to claim 2 , wherein a structure of the crystal grains ...

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31-01-2019 дата публикации

SUBSTRATE LOCKING SYSTEM, DEVICE AND PROCEDURE FOR CHEMICAL AND/OR ELECTROLYTIC SURFACE TREATMENT

Номер: US20190032234A1
Принадлежит:

Exemplary substrate locking system, device, apparatus and method for chemical and/or electrolytic surface treatment of a substrate in a process fluid can be provided. For example, it is possible to provide a first element, a second element and a locking unit. The first element and the second element can be configured to hold the substrate between each other. The locking unit can be configured to lock the first element and the second element with each other. The locking unit can comprise a magnet control device and a magnet. The magnet can be arranged at or near the first element and/or the second element. The magnet control device can be configured to control a magnetic force between the first element and the second element. 1. A substrate locking system for at least one of a chemical surface treatment or a electrolytic surface treatment of a substrate in a process fluid , comprising:a first element and a second element, wherein the first element and the second element are configured to hold or maintain the substrate between each other; anda locking arrangement configured to lock the first element and the second element with each other,wherein the locking arrangement comprises a magnet control device and a magnet,wherein the magnet is arranged at or near at least one of the first element or the second element, andwherein the magnet control device is configured to control a magnetic force between the first element and the second element.2. The substrate locking system according to claim 1 , wherein the first element is a first contact ring claim 1 , and the second element is a second contact ring claim 1 , and wherein the first and second contact rings are configured to hold at least one substrate between each other.3. The substrate locking system according to claim 1 , wherein the first element is a substrate holder claim 1 , and the second element is a contact loop claim 1 , and wherein the substrate holder and the contact loop are configured to hold at least one ...

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02-02-2017 дата публикации

STAINLESS-STEEL FOIL FOR SEPARATOR OF POLYMER ELECTROLYTE FUEL CELL

Номер: US20170033372A1
Принадлежит: JFE STEEL CORPORATION

The surface of a substrate made of stainless-steel foil is coated with a Sn alloy layer, with a strike layer in between. The coating ratio of the strike layer on the substrate is 2% to 70%. 1. A stainless-steel foil for a separator of a polymer electrolyte fuel cell , comprising:a substrate made of stainless-steel foil; anda Sn alloy layer with which a surface of the substrate is coated, with a strike layer in between,wherein a coating ratio of the strike layer on the substrate is 2% to 70%.2. The stainless-steel foil for a separator of a polymer electrolyte fuel cell according to claim 1 ,wherein the strike layer is distributed in a form of islands, and a maximum diameter of each of the islands as coating portions is 1 μm or less.3. The stainless-steel foil for a separator of a polymer electrolyte fuel cell according to claim 1 ,wherein the Sn alloy layer contains at least one selected from the group consisting of Ni and Fe.4. The stainless-steel foil for a separator of a polymer electrolyte fuel cell according to claim 1 ,{'sub': 3', '2, 'wherein the Sn alloy layer contains NiSn.'}5. The stainless-steel foil for a separator of a polymer electrolyte fuel cell according to claim 1 ,wherein the strike layer contains at least one element selected from the group consisting of Ni, Cu, Ag, and Au.6. The stainless-steel foil for a separator of a polymer electrolyte fuel cell according to claim 5 ,wherein the strike layer is made of an alloy layer of Ni and P, and has a P content in a range of 5% to 22% by mass.7. The stainless-steel foil for a separator of a polymer electrolyte fuel cell according to claim 1 , comprisinga Sn-containing oxide layer on a surface of the Sn alloy layer.8. The stainless-steel foil for a separator of a polymer electrolyte fuel cell according to claim 4 ,wherein the strike layer is made of an alloy layer of Ni and P, and has a P content in a range of 5% to 22% by mass.9. The stainless-steel foil for a separator of a polymer electrolyte fuel cell ...

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30-01-2020 дата публикации

Compositions and Methods for Electrodepositing Tin-Bismuth Alloys on Metallic Substrates

Номер: US20200032409A1
Принадлежит: The Boeing Company

A method for depositing a tin-bismuth alloy on a substrate, the method including steps of (1) immersing the substrate and an anode in an electrolyte solution that includes water, a stannous salt, a bismuth salt, and at least one of sulfuric acid and sulfamic acid, the anode including tin and, optionally, bismuth, and (2) passing an electric current between the substrate and the anode to form a deposit on the substrate. 1. An electrolyte solution comprising:water;a stannous salt;a bismuth salt; andat least one of sulfuric acid and sulfamic acid.2. The electrolyte solution of wherein the stannous salt comprises at least one of stannous sulfate claim 1 , stannous chloride and stannous fluoride.3. The electrolyte solution of wherein the stannous salt comprises stannous sulfate.4. The electrolyte solution of wherein the stannous salt is present at a concentration ranging from about 15 grams per liter to about 200 grams per liter claim 1 , based on a total volume of the electrolyte solution.5. The electrolyte solution of wherein the stannous salt is present at a concentration ranging from about 20 grams per liter to about 100 grams per liter claim 1 , based on a total volume of the electrolyte solution.6. The electrolyte solution of wherein the bismuth salt comprises at least one of bismuth sulfate claim 1 , bismuth oxide claim 1 , bismuth nitrate claim 1 , bismuth chloride and bismuth trifluoride.7. The electrolyte solution of wherein the bismuth salt comprises bismuth sulfate.8. The electrolyte solution of wherein the bismuth salt is present at a concentration ranging from about 0.25 grams per liter to about 10 grams per liter claim 1 , based on a total volume of the electrolyte solution.9. The electrolyte solution of wherein the bismuth salt is present at a concentration ranging from about 0.4 grams per liter to about 4 grams per liter claim 1 , based on a total volume of the electrolyte solution.10. The electrolyte solution of wherein the at least one of sulfuric acid ...

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30-01-2020 дата публикации

Compositions and Methods for Activating Titanium Substrates

Номер: US20200032411A1
Принадлежит: The Boeing Company

A method for pretreating a substrate prior to depositing a material thereon, the method including immersing the substrate in an activation solution for a predetermined period of time, the activation solution including a fluoride salt, hydrofluoric acid, sulfuric acid and water. 1. An activation solution comprising:water;a fluoride salt;hydrofluoric acid; andsulfuric acid.2. The activation solution of wherein the fluoride salt comprises at least one of an alkali metal cation and an alkaline earth metal cation.3. The activation solution of wherein the fluoride salt comprises at least one of potassium fluoride claim 1 , lithium fluoride claim 1 , sodium fluoride claim 1 , rubidium fluoride claim 1 , barium fluoride and strontium fluoride.4. The activation solution of wherein the fluoride salt is potassium fluoride.5. The activation solution of wherein the fluoride salt is present at a concentration ranging from about 5 grams per liter to about 120 grams per liter claim 1 , based on a total volume of the activation solution.6. The activation solution of wherein the fluoride salt is present at a concentration ranging from about 10 grams per liter to about 100 grams per liter claim 1 , based on a total volume of the activation solution.7. The activation solution of wherein the fluoride salt is present at a concentration of about 20 grams per liter claim 1 , based on a total volume of the activation solution.8. The activation solution of wherein the hydrofluoric acid is present at a concentration ranging from about 5 milliliters per liter to about 250 milliliters per liter claim 1 , based on a total volume of the activation solution.9. The activation solution of wherein the hydrofluoric acid is present at a concentration ranging from about 20 milliliters per liter to about 150 milliliters per liter claim 1 , based on a total volume of the activation solution.10. The activation solution of wherein the sulfuric acid is present at a concentration ranging from about 1 percent ...

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05-02-2015 дата публикации

STEEL FOIL AND METHOD FOR MANUFACTURING THE SAME

Номер: US20150037684A1
Принадлежит:

A steel foil according to an aspect of the present invention includes, by mass %, C: 0.0001 to 0.02%; Si: 0.001 to 0.01%; Mn: 0.01 to 0.3%; P: 0.001 to 0.02%; S: 0.0001 to 0.01%; Al: 0.0005 to 0.1%; N: 0.0001 to 0.004%; and a balance consisting of Fe and impurities, wherein a thickness is 5 to 15 μm, and a tensile strength is more than 900 MPa and 1.200 MPa or less. 1. A steel foil comprising , by mass %:C: 0.0001 to 0.02%;Si: 0.001 to 0.01%;Mn: 0.01 to 0.3%;P: 0.001 to 0.02%;S: 0.0001 to 0.01%;Al: 0.0005 to 0.1%;N: 0.0001 to 0.004%; anda balance consisting of Fe and impurities, whereina thickness is 5 μm or more and 15 μm or less, and a tensile strength is more than 900 MPa and 1.200 MPa or less.2. The steel foil according to claim 1 , further comprising claim 1 , one or both of claim 1 , by mass %:Ti: 0.1% or less; andNb: 0.1% or less.3. The steel foil according to or claim 1 ,wherein a Ni plated layer or a Cr plated layer is included on an outermost layer of the steel foil.4. A method for manufacturing a steel foil claim 1 , the method comprising claim 1 , foil-rolling a steel sheet including claim 1 , by mass % claim 1 ,C: 0.0001 to 0.02%,Si: 0.001 to 0.01%,Mn: 0.01 to 0.3%,P: 0.001 to 0.02%,S: 0.0001 to 0.01%,Al: 0.0005 to 0.1%,N: 0.0001 to 0.004%, anda balance consisting of Fe and impurities, so as to be the steel foil having a thickness of 5 μm or more and 15 μm or less and a tensile strength of more than 900 MPa and 1,200 MPa or less by a cold-rolling under a cumulative rolling reduction of 90% or more and 98% or less.5. The method for manufacturing a steel foil according to claim 4 , wherein the steel sheet further includes one or both of claim 4 , by mass %:Ti: 0.1% or less; andNb: 0.1% or less.6. The method for manufacturing a steel foil according to or claim 4 , further comprising claim 4 ,plating an outermost layer of the steel foil so as to form a Ni plated layer or a Cr plated layer after the foil-rolling.7. The method for manufacturing a steel foil ...

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11-02-2016 дата публикации

Treatment for Electroplating Racks to Avoid Rack Metallization

Номер: US20160040315A1
Принадлежит:

A method of coating an electroplating rack used for supporting non-conductive substrates during a plating process. The method comprises the steps of contacting at least a portion of the electroplating rack with a plastisol composition, the plastisol composition having dispersed therein an effective amount of an additive having the structure: 2. The method according to claim 1 , wherein the plastisol composition is a PVC plastisol.3. The method according to claim 1 , wherein the additive comprises tetrabenzyl thiuram disulfide or tetraphenyl thiuram disulfide.4. The method according to claim 1 , wherein the additive is selected from the group consisting of zinc dimethyl-dithiocarbamate claim 1 , zinc diethyldithiocarbamate claim 1 , zinc dibutyldithiocarbamate claim 1 , zinc ethylphenyldithiocarbamate claim 1 , zinc dibenzyldithiocarbamate claim 1 , zinc pentamethylenedithiocarbamate claim 1 , nickel dibutyl dithiocarbamate claim 1 , nickel dimethyldithiocarbamate claim 1 , zinc diisononyldithiocarbamate claim 1 , and combinations of one or more of the foregoing.5. The method according to claim 4 , wherein the additive comprises nickel dimethyldithiocarbamate.6. The method according to claim 1 , wherein the additive is present in the plastisol composition at a concentration in the range of about 1% to about 20% by weight.7. The method according to claim 6 , wherein the additive is present in the plastisol composition at a concentration in the range of about 5% to about 15% by weight.8. The method according to claim 1 , wherein steps a) and b) are repeated multiple times.9. A plastisol coated electroplating rack made by the process of .11. The method according to claim 10 , wherein the plastisol composition is a PVC plastisol.12. The method according to claim 10 , wherein the additive comprises tetrabenzyl thiuram disulfide or tetraphenyl thiuram disulfide.13. The method according to claim 10 , wherein the additive is selected from the group consisting of zinc ...

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30-01-2020 дата публикации

SYSTEM AND METHOD FOR CHEMICAL AND HEATED WETTING OF SUBSTRATES PRIOR TO METAL PLATING

Номер: US20200035484A1
Принадлежит:

A wetting tool that provides improved wettability and debris removal from features defined by a patterned resist layer on a substrate. The substrate wetting tool relies on a wetting solution having a pH of 2.0 or less and/or a temperature ranging from 20 to 50° C. With a pH of 2.0 or less, the resist material used to form features chemically reacts, making it more hydrophilic. The wetting solution is therefore attracted into the features, beneficially reducing the chance of bubble formation and removing debris. At elevated temperatures, the heated wetting solution improves particle de-lamination and aids in dissolving debris and oxides from the substrate surface. 1. A substrate wetting tool , comprisinga chamber;a substrate pedestal for supporting a substrate within the chamber;a wetting solution distribution system for introducing a wetting solution into the chamber, the wetting solution having a pH of 2.0 or less and a temperature ranging from 20 to 50° C.2. The substrate wetting tool of claim 1 , further comprising a heater for heating the wetting solution to the temperature ranging from 20 to 50° C.3. The substrate wetting tool of claim 1 , further comprising a pH control system for maintaining the pH of the wetting solution at 2.0 or less.4. The substrate wetting tool of claim 1 , further comprising a recycle station for recycling the wetting solution drained from the chamber.5. The substrate wetting tool of claim 1 , further comprising a vacuum pump for creating a vacuum in the processing chamber.6. The substrate wetting tool of claim 1 , further comprising a vent for venting the chamber.7. The substrate wetting tool of claim 1 , further comprising a drain for draining the wetting solution from the chamber.8. The substrate wetting tool of claim 1 , further comprising a mechanism to rotate the substrate pedestal supporting the substrate.9. The substrate wetting tool of claim 1 , wherein the wetting solution distribution system further includes a storage tank ...

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30-01-2020 дата публикации

METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE

Номер: US20200035524A1
Принадлежит:

A method of manufacturing a semiconductor structure includes loading the substrate from a first load lock chamber into a first processing chamber; disposing a conductive layer over the substrate in the first processing chamber; loading the substrate from the first processing chamber into the first load lock chamber; loading the substrate from the first load lock chamber into an enclosure filled with an inert gas and disposed between the first load lock chamber and a second load lock chamber; loading the substrate from the enclosure into the second load lock chamber; loading the substrate from the second load lock chamber into a second processing chamber; disposing a conductive member over the conductive layer in the second processing chamber; loading the substrate from the second processing chamber into the second load lock chamber; and loading the substrate from the second load lock chamber into a second load port. 1. A method of manufacturing a semiconductor structure , comprising:loading a substrate into a first load port;loading the substrate from the first load port into a first load lock chamber;loading the substrate from the first load lock chamber into a first processing chamber;disposing a conductive layer over the substrate in the first processing chamber;loading the substrate from the first processing chamber into the first load lock chamber;loading the substrate from the first load lock chamber into an enclosure filled with an inert gas and disposed between the first load lock chamber and a second load lock chamber;loading the substrate from the enclosure into the second load lock chamber;loading the substrate from the second load lock chamber into a second processing chamber;disposing a conductive member over the conductive layer in the second processing chamber;loading the substrate from the second processing chamber into the second load lock chamber; andloading the substrate from the second load lock chamber into a second load port.2. The method of ...

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12-02-2015 дата публикации

NICKEL DIRECT-PLATING

Номер: US20150041329A1
Принадлежит:

A method of depositing nickel on a surface of an object, the method including the steps of providing a source of direct current having a positive and a negative terminal; connecting the object to the negative terminal; connecting an anode to the positive terminal; and submerging the object and anode in a solution comprising nickel. The anode is positioned at a distance equal to or less than 2 mm from the surface of the object and when the source of direct current is switched on, nickel in the solution comprising nickel is deposited on the surface of the object. 1. A method of depositing nickel on a surface of an object , the method including:providing a source of direct current having a positive and a negative terminal;connecting the object to the negative terminal;connecting an anode to the positive terminal; andsubmerging the object and anode in a solution comprising the nickel;wherein the anode is positioned at a distance equal to or less than 2 mm from the surface of the object, andwherein when the source of direct current is switched on, the nickel in the solution comprising the nickel is deposited on the surface of the object.2. A method according to claim 1 , wherein the nickel is directly deposited on the surface of the object.3. A method according to claim 1 , wherein the surface of the object is coated in an oxide layer claim 1 , the method including removing the oxide layer before the nickel in the solution comprising the nickel is deposited on the surface of the object.4. A method according to claim 1 , wherein the surface of the object is coated in an oxide layer claim 1 , the method including thickening the oxide layer before the nickel in the solution comprising the nickel is deposited on the surface of the object.5. A method according to claim 1 , wherein the object comprises at least one of aluminium claim 1 , titanium claim 1 , stainless steel and molybdenum.6. A method according to claim 1 , wherein a shape of the object and a shape of the anode ...

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12-02-2015 дата публикации

PROCESS FOR MANUFACTURING A RECOVERY ANNEALED COATED STEEL SUBSTRATE FOR PACKAGING APPLICATIONS AND A PACKAGING STEEL PRODUCT PRODUCED THEREBY

Номер: US20150044500A1
Принадлежит:

This relates to a process for manufacturing a recovery annealed coated steel substrate for packaging applications and a packaging steel product produced thereby. 1. A process for manufacturing a recovery annealed coated steel substrate for packaging applications , comprising the steps of:{'sub': 'a', 'providing a steel slab or strip suitable for producing a low-carbon, an extra-low-carbon or an ultra-low-carbon hot rolled strip for producing packaging steel by hot rolling at a finishing temperature higher than or equal to the Artransformation point;'}cold-rolling the resulting steel strip to produce a single reduced steel substrate;{'sup': '2', 'electrodepositing a tin layer on one or both sides of the single reduced steel substrate to produce a tin-coated steel substrate, wherein the coating weight of the tin layer or layers onto one or both sides of the substrate is at most 1000 mg/m;'}{'sub': a', 'a, 'claim-text': to convert the tin layer into an iron-tin alloy layer which contains at least 90 weight percent (wt. %) of FeSn (50 at. % iron and 50 at. % tin), and', 'to simultaneously obtain a recovered microstructure and wherein no recrystallisation of the single reduced substrate takes place (i.e. recovery annealing);, 'heating the tin-coated steel substrate at a heating rate exceeding 300° C./s followed by annealing the tin-coated steel substrate at a temperature Tof between 513° C. and 645° C. for an annealing time tfast cooling the annealed substrate at a cooling rate of at least 100° C./s; a carbon content of 0.05% or less;', 'a nitrogen content of 0.004% or less;', 'a manganese content between 0.05 and 0.5%;', 'a phosphorous content of 0.02% or less;', 'a silicon content of 0.02% or less;', 'a sulphur content of 0.03% or less;', 'an aluminum content of 0.1% or less;', a niobium content between 0.001% and 0.1%;', 'a titanium content between 0.001% and 0.15%;', 'a vanadium content between 0.001% and 0.2%;', 'a zirconium content between 0.001% and 0.1%;', 'a ...

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07-02-2019 дата публикации

CHROMIUM-BASED COATING, A METHOD FOR PRODUCING A CHROMIUM-BASED COATING AND A COATED OBJECT

Номер: US20190040540A1
Автор: RAISA Jussi
Принадлежит: Savroc Ltd

A chromium-based coating including chromium (Cr), carbon (C) and iron (Fe), Cr being electroplated from a trivalent Cr bath. The coating is further includes nickel (Ni) electroplated from the Cr bath having at least 20 mg l−1 Ni cations, in that C is at least partially in the form of at least one chromium carbide compound, in that the coating has been heat-treated at a temperature of 400-1,200° C., and in that the hardness of the coating is at least 1,500 HV on a Vickers microhardness scale as measured according to standard SFS-EN ISO 4516. A method for producing a coating and to a coated object is also disclosed. 1. A chromium-based coating comprising chromium (Cr) , carbon (C) and iron (Fe) , Cr being electroplated from a trivalent Cr bath , characterized in wherein the coating further comprises nickel (Ni) electroplated from the Cr bath containing at least 20 mg l−1 Ni cations , in that C is at least partially in the form of at least one chromium carbide compound , in that the coating has been heat-treated at a temperature of 400-1 ,200° C. , and in that the hardness of the coating is at least 1 ,500 HV on a Vickers microhardness scale as measured ac-cording to standard SFS-EN ISO 4516.2. The chromium-based coating according to claim 1 , wherein the Cr bath contains 20 to 150 mg l−1 Ni cations.3. The chromium-based coating according to claim 1 , wherein the at least one chromium car-bide compound comprises Cr3C2 claim 1 , Cr7C3 or Cr23C6 claim 1 , or a combination thereof.4. The chromium-based coating according to claim 1 , wherein at least some of the Ni and Cr are dissolved in each other.5. The chromium-based coating according to claim 1 , wherein the Taber index of the coating measured by the Taber abrasion test according to ISO 9352 is below 2.6. The chromium-based coating according to claim 1 , wherein the coating forms at least two layers with distinctive element compositions.7. The chromium-based coating according to claim 1 , wherein the coating is coated ...

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06-02-2020 дата публикации

High strength annealed steel products and annealing processes for making the same

Номер: US20200040422A1
Принадлежит: United States Steel Corp

The present invention provides steel sheet products having controlled compositions that are subjected to two-step annealing processes to produce sheet products having desirable microstructures and favorable mechanical properties such as high strength and ultra-high formability. The steel sheet products may be cold rolled or hot rolled. Steels processed in accordance with the present invention exhibit favorable combined ultimate tensile strength and total elongation (UTS•TE) properties, and may fall into the category of Generation 3 advanced high strength steels, desirable in various industries including automobile manufacturers.

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06-02-2020 дата публикации

Sn-PLATED STEEL SHEET AND METHOD FOR MANUFACTURING Sn-PLATED STEEL SHEET

Номер: US20200040479A1
Принадлежит: NIPPON STEEL CORPORATION

A Sn-plated steel sheet according to the present invention includes a steel sheet, a Sn-plated layer that is provided on at least one surface of the steel sheet, and a film that is provided on a surface of the Sn-plated layer and includes zirconium oxide and tin oxide, in which an amount of the zirconium oxide in the film is 0.2 mg/mto 50 mg/min terms of metal Zr amount, in a depth direction analysis by X-ray photoelectron spectroscopy, a depth position A at which an element concentration of Zr present as the zirconium oxide is maximum is positioned closer to a surface of the film than a depth position B at which an element concentration of Sn present as the tin oxide is maximum, and a distance between the depth position A and the depth position B in a depth direction is 0.5 nm or more. 1. A Sn-plated steel sheet comprising:a steel sheet;a Sn-plated layer that is provided on at least one surface of the steel sheet; anda film that is provided on a surface of the Sn-plated layer and includes zirconium oxide and tin oxide,{'sup': 2', '2, 'wherein an amount of the zirconium oxide in the film is 0.2 mg/mto 50 mg/min terms of metal Zr amount,'}in a depth direction analysis by X-ray photoelectron spectroscopy, a depth position A at which an element concentration of Zr present as the zirconium oxide is maximum is positioned closer to a surface of the film than a depth position B at which an element concentration of Sn present as the tin oxide is maximum, and a distance between the depth position A and the depth position B in a depth direction is 0.5 nm or more.2. The Sn-plated steel sheet according to claim 1 ,wherein, in the depth direction element analysis by the X-ray photoelectron spectroscopy, the element concentration of Zr present as the zirconium oxide at the depth position A is 20% or more.3. The Sn-plated steel sheet according to claim 1 ,wherein the film further includes a phosphate compound, and{'sup': 2', '2, 'in the film, a value α/β obtained by dividing an ...

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15-02-2018 дата публикации

INTEGRATED FLUIDJET SYSTEM FOR STRIPPING, PREPPING AND COATING A PART

Номер: US20180043394A1
Принадлежит:

An integrated liquidjet system capable of stripping, prepping and coating a part includes a cell defining an enclosure, a jig for holding the part inside the cell, an ultrasonic nozzle having an ultrasonic transducer for generating a pulsed liquidjet, a coating particle source for supplying coating particles to the nozzle, a pressurized liquid source for supplying the nozzle with a pressurized liquid to enable the nozzle to generate the pulsed liquidjet to sequentially strip, prep and coat the part, a high-voltage electrode and a ground electrode inside the nozzle for charging the coating particles, and a human-machine interface external to the cell for receiving user commands and for controlling the pulsed liquidjet exiting from the nozzle in response to the user commands. 1. A method of stripping , prepping and coating a part , the method comprising:holding the part inside a cell that defines an electrically shielded enclosure;generating a pulsed liquidjet using an ultrasonic nozzle;supplying coating particles to the nozzle;supplying the nozzle with a pressurized liquid to enable the nozzle to generate the pulsed liquidjet to sequentially strip, prep and coat the part;charging the coating particles using a high-voltage electrode and a ground electrode inside the nozzle;stripping the part by controlling the pulsed liquidjet;prepping the part by controlling the pulsed liquidjet; andcoating the part by controlling the pulsed liquidjet.2. The method as claimed in further comprising optically inspecting the part to determine when stripping is complete and then automatically switching to prepping.3. The method as claimed in further comprising detecting when prepping is complete and then automatically switching to coating.4. The method as claimed in further comprising detecting when coating is complete.5. A method of stripping claim 3 , prepping and coating a part claim 3 , the method comprising:generating a pulsed liquidjet using an ultrasonic nozzle that ultrasonically ...

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19-02-2015 дата публикации

HIGH STRENGTH INTERSTITIAL FREE LOW DENSITY STEEL AND METHOD FOR PRODUCING SAID STEEL

Номер: US20150047752A1
Автор: Liu Cheng, RANA Radhakanta
Принадлежит: TATA STEEL NEDERLAND TECHNOLOGY B.V.

A high strength interstitial free low density steel and method for producing the steel. 2. The steel according to claim h comprising , at most 0.019% titanium.3. The steel according to claim 1 , wherein the steel comprises titanium only as an inevitable impurity.4. The steel according to claim 1 , wherein Al is at least 6.5% and/or at most 8.5%.5. The steel according to claim 1 , wherein N is at most 0.004% (40 ppm).6. The steel according to claim 1 , wherein Mn is at least 0.1% and/or Si is at most 0.05%.7. The steel according to claim 1 , wherein the specific density of the steel is between 6800 and 7300 kg/m.8. The steel according to claim 1 , wherein the steel is a cold-rolled steel sheet.9. A method for producing a ferritic steel strip comprising the steps of: continuous casting, or', 'by thin slab casting, or', 'by belt casting, or', 'by strip casting;, 'providing a steel slab or thick strip, optionally calcium treated, by up to 0.01% C_total;', 'up to 0.2 % Si;', 'up to 1.0% Mn;', 'from 6 to 9% Al;', 'up to 0.010% N;', 'up to 0.080% Ti', 'up to 0.080% Nb;', 'up to 0.1% Zr;', 'up to 0.1% V;', 'up to 0.01% S;', 'up to 0.1% P;', 'up to 0.01% B', 'remainder iron and inevitable impurities;', +Maximum[Z,0]', '+12/93*Nb', '+12/91*Zr', '+12/51*V;, 'wherein C_total<=Minimum[X,Y]'}, 'wherein', 'X=2*12/(2*32)*S;', 'Y=2*12/(4*48)*(Ti−48/14*N);', 'Z=12/48*(Ti−48/14*N−4*48/(2*32)*S);', 'wherein', 'Minimum[X,Y]=lower value of X and Y and Minimum[X,Y]=zero if Y is negative;', 'Maximum[Z,0]=higher value of zero and Z;', Minimum[X,Y]', 'Maximum[Z,0]', '12/93*Nb', '12/91*Zr', '12/51*V;, 'C_solute=C_total'}, 'and wherein C_solute is equal to or smaller than zero;, 'the steel comprising, in weight percent,'}optionally followed by reheating the steel slab or strip at a reheating temperature of at most 1250° C.;hot rolling the slab or thick strip and finishing the hot-rolling process at a hot rolling finishing temperature of at least 850° C. to form a hot rolled ferritic strip; ...

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19-02-2015 дата публикации

BUSBAR

Номер: US20150047876A1
Принадлежит:

A busbar , for use in electrical distribution, is disclosed. The busbar arranged to have an electrically conductive barrier disposed about at least a first portion of the busbar surface for limiting the formation of an oxide layer on the busbar . In a further aspect of the present invention the busbar is arranged to have an electrically insulating barrier disposed about at least a second portion of the busbar surface for limiting undesired electrical connection with the busbar . The present invention provides a pre-insulated busbar which can be subsequently shaped or prepared without compromising the insulating barrier or the conductive barrier . The present invention provides a busbar having improved safety, speed of fitting, and handling characteristics. 1. A pre-insulated busbar , for use in the distribution of electricity , the pre-insulated busbar comprising:an electrically conductive metallic body having at least an external surface disposed between peripheral ends, anda substantially ductile electrically insulating barrier disposed to overlay at least a portion of the external surface for substantially isolating a portion underlying the insulating barrier from an electrical contact,wherein a structural integrity and insulating function of the overlaying insulating barrier is configured to be maintained during a substantial deformation of the underlying the portion of the metallic body.2. A pre-insulated busbar according to claim 1 , wherein the substantial deformation comprises a bending of the portion through an angle up to 90°.3. A pre-insulated busbar according to claim 1 , wherein the substantially ductile insulating barrier comprises a surface coating of an epoxy thermoset material.4. A pre-insulated busbar according to claim 1 , wherein at least a portion of the insulating barrier is selectively removable from the external surface.5. A pre-insulated busbar according to claim 4 , wherein the insulating barrier is selectively removable by scoring the ...

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16-02-2017 дата публикации

HIGH-SPEED FILLING METHOD FOR COPPER

Номер: US20170044682A1
Принадлежит: JCU CORPORATION

To provide a technique of increasing a rate of filling holes or grooves formed in a substrate, by changing the temperature, the concentration, the current density, and the other conditions of the ordinary copper plating. A method for filling holes or grooves formed in a substrate by copper plating at a high speed, containing: immersing the substrate having the holes or grooves in an acidic copper plating solution containing a copper ion, a sulfate ion, and a halide ion, at from 30 to 70° C.; and plating the substrate at a current density of 3 A/dmor more by using an insoluble electrode as an anode. 1. A method for filling holes or grooves formed in a substrate by copper plating at a high speed , comprising: immersing the substrate having the holes or grooves in an acidic copper plating solution containing a copper ion , a sulfate ion , and a halide ion , at from 30 to 70° C.; and plating the substrate at a current density of 3 A/dmor more by using an insoluble electrode as an anode.2. The method for filling holes or grooves formed in a substrate by copper plating at a high speed according to claim 1 , wherein the copper ion contained in the acidic copper plating solution is 25 g/L or more and the saturation copper ion concentration at a temperature of from 30 to 70° C. of the solution temperature of the copper plating solution or less claim 1 , the sulfate ion is 50 g/L or more claim 1 , and the halide ion is from 5 to 500 mg/L.3. The method for filling holes or grooves formed in a substrate by copper plating at a high speed according to claim 1 , wherein the copper ion contained in the acidic copper plating solution is the saturation copper ion concentration at 20° C. of the solution temperature of the copper plating solution or more and the saturation copper ion concentration at a temperature of from 30 to 70° C. of the solution temperature of the copper plating solution or less claim 1 , the sulfate ion is 50 g/L or more claim 1 , and the halide ion is from 5 to ...

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15-02-2018 дата публикации

PREPARATION OF RARE EARTH PERMANENT MAGNET

Номер: US20180044810A1
Принадлежит: SHIN-ETSU CHEMICAL CO., LTD.

A rare earth permanent magnet is prepared by immersing a portion of a sintered magnet body of R—Fe—B composition (wherein Ris a rare earth element) in an electrodepositing bath of a powder dispersed in a solvent, the powder comprising an oxide, fluoride, oxyfluoride, hydride or rare earth alloy of a rare earth element, effecting electrodeposition for letting the powder deposit on a region of the surface of the magnet body, and heat treating the magnet body with the powder deposited thereon at a temperature below the sintering temperature in vacuum or in an inert gas. 1. A method for preparing a rare earth permanent magnet , comprising the steps of:{'sup': 1', '1', '2', '3', '4', '5', '6', '2', '3', '4', '5', '6, 'immersing a portion of a sintered magnet body in an electrodepositing bath of a powder dispersed in water rather than immersing the magnet body entirely in the electrodepositing bath, said magnet body having a R—Fe—B base composition wherein Ris at least one element selected from rare earth elements inclusive of Y and Sc, said powder comprising at least one member selected from the group consisting of an oxide of R, a fluoride of R, an oxyfluoride of R, a hydride of R, and a rare earth alloy of Rwherein R, R, R, Rand Reach are at least one element selected from rare earth elements inclusive of Y and Sc,'}electrodepositing the powder deposit on a region of the surface of the magnet body to form a coating consisting of particles of the powder, andheat treating the magnet body with the powder deposited on the region of its surface at a temperature equal to or less than a sintering temperature of the magnet body in vacuum or in an inert gas.2. The method of wherein the electrodepositing bath contains a surfactant as a dispersant.3. The method of wherein the powder has an average particle size of up to 100 μm.4. The method of wherein the powder is deposited on the magnet body surface at an area density of at least 10 μg/mm.5. The method of wherein at least one ...

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15-02-2018 дата публикации

Inhibitor Composition for Racks When Using Chrome Free Etches in a Plating on Plastics Process

Номер: US20180044813A1
Принадлежит:

The invention relates to an aqueous inhibition composition for the inhibition of electrochemical metal plating on polymer surfaces, said inhibition composition comprising an inhibition agent selected from the group of compounds having at least one sulfur and at least one nitrogen atom as well as to a method for the inhibition of an insulated surface of a rack area. The inventive inhibition composition is capable to provide a solution for prohibiting unintended metallization on insulated areas of the racks when non-chromic etching is utilized for plating on plastics processes. 1. An aqueous inhibition composition for the inhibition of electrochemical metal plating on polymer surfaces , said inhibition composition comprising an inhibition agent selected from the group of compounds having at least one sulfur and at least one nitrogen atom.3. The inhibition composition according to claim 1 , wherein said inhibition agent is selected from the group consisting of thioureas claim 1 , thiocarbamates claim 1 , and thiosemicarbazides.4. The inhibition composition according to claim 3 , wherein said inhibition agent is a thiourea.5. The inhibition composition according to claim 1 , said composition having a pH-value between 2 and 13.6. The inhibition composition according to claim 1 , wherein said inhibition agent is comprised in a concentration range of between ≧0.1 g/l and ≦100 g/l.7. The inhibition composition according to claim 1 , additionally comprising at least one buffering agent.8. The inhibition composition according to claim 1 , additionally comprising agents to increase the solubility of the inhibitor compound in the composition.9. The inhibition composition according to claim 1 , additionally comprising one or more swelling agents for the polymer of the rack insulation.10. A method for the inhibition of an insulated surface of a rack area claim 1 , said method comprising the step of contacting the surface with an aqueous inhibition composition comprising an ...

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18-02-2016 дата публикации

METHOD FOR MANUFACTURING MULTILAYER WIRING SUBSTRATE

Номер: US20160050769A1
Автор: YOSHIDA Nobuyuki
Принадлежит:

To provide a method for manufacturing a multilayer wiring substrate, in which an insulating layer and a metal foil provided thereon are integrally laminated on an inner layer material having a wiring formed thereon, in which a hole for via hole is formed in the metal foil and the insulating layer, and in which the hole for via hole is filled with an electrolytic filled plating layer after a base electroless plating layer is formed, the method being featured in that, after the base electroless plating layer is formed, first, an electrolysis filled plating layer is formed to the extent that the hole for via hole is not completely filled, and then, after the surface of the electrolytic filled plating layer is etched, the hole for via hole is completely filled by an electrolytic filled plating layer. 1. A method for manufacturing a multilayer wiring substrate including:{'b': '1', 'step () of integrally laminating an inner layer material having an inner layer wiring formed thereon, an insulating layer, and a metal foil for upper layer wiring, and providing, in the metal foil for upper layer wiring and the insulating layer, a hole for via hole extending from the metal foil for upper layer wiring to reach the inner layer wiring;'}{'b': '2', 'step () of forming a base electroless plating layer in the hole for via hole and on the metal foil for upper layer wiring, and then filling the hole for via hole by forming an electrolytic filled plating layer, and forming a via hole connecting the metal foil for upper layer wiring and the inner layer wiring; and'}{'b': '3', 'step () of forming an upper layer wiring by forming, after forming the electrolytic filled plating layer, the metal foil for upper layer wiring into a wiring,'}{'b': '2', 'wherein, in step (), filling of the hole for via hole is separately performed twice or more by forming the electrolytic filled plating layer, and'}the electrolytic filled plating layer, formed in the hole for via hole and on the metal foil for ...

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25-02-2016 дата публикации

FE-NI-P-RE MULTICOMPONENT ALLOY PLATING LAYER, AND ELECTRODEPOSITION PREPARATION METHOD AND APPLICATION THEREOF

Номер: US20160053396A1

Disclosed are a Fe—Ni—P-RE multicomponent alloy plating layer, and electrodeposition preparation method and application thereof. An alloy plating layer obtained via electrodeposition contains elements of Fe, Ni, P and RE, the mass percentage of Fe being 20%-65%, the mass percentage of Ni being 25%-70%, the combined mass percentage of Fe and Ni being 65%-90%, the mass percentage of RE being 2%-25%, and the balance being P. The plating solution mainly contains the following components: ferrous salt, nickel salt, NaHPO, RECl, HBOand NaCHO. A multicomponent alloy plating layer of different components can be obtained by adjusting the main salt and complexing agent in the plating solution and by adjusting the process. The present invention realizes controllable adjustment to the components of the obtained plating layer while saving costs, and further improves indexes such as the thermal expansion coefficient, electrical property, magnetic property, etc., and is very suitable for applications in the field of micro-electronics. 1. A Fe—Ni—P-RE multicomponent alloy plating layer , wherein said Fe—Ni—P-RE multicomponent alloy plating layer is plated on a substrate by means of electroplating and comprises the elements of Fe , Ni , P and RE; wherein: the mass percentages of various elements are respectively: 20˜65% Fe , 25˜70% Ni , 65˜90% Fe+Ni , 2˜25% RE and the balance being P; RE is rare earth element.2. The Fe—Ni—P-RE multicomponent alloy plating layer according to claim 1 , wherein said rare earth element(s) is one or two selected from La claim 1 , Ce claim 1 , Pr claim 1 , Nd claim 1 , Eu claim 1 , Gd and Tb.3. The Fe—Ni—P-RE multicomponent alloy plating layer according to claim 1 , wherein said substrate is copper or other metal material.4. An electrodeposition preparation method of the Fe—Ni—P-RE multicomponent alloy plating layer according to claim 1 , wherein said electrodeposition preparation method of the Fe—Ni—P-RE multicomponent alloy plating layer is a method of ...

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25-02-2016 дата публикации

Method of forming a composite material and apparatus for forming a composite material

Номер: US20160053397A1
Принадлежит: INFINEON TECHNOLOGIES AG

A method of forming a composite material is provided. The method may include: arranging a suspension in physical contact with a carrier, wherein the suspension may comprise an electrolyte and a plurality of particles of a first component of the composite material; causing the particles of the first component of the composite material to sediment on the carrier, wherein a plurality of spaces may be formed between the sedimented particles; and forming by electroplating a second component of the composite material from the electrolyte in at least a fraction of the plurality of spaces.

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25-02-2021 дата публикации

METHOD FOR PRODUCING A METAL DECORATION ON A DIAL AND DIAL OBTAINED ACCORDING TO THIS METHOD

Номер: US20210054518A1

A method for producing metal decorations on a curved dial made of insulating material includes forming, by a method of the LIGA-UV type, a mould made of photosensitive resin and of galvanically depositing a layer of at least one metal from the conductive layer in order to form a block substantially reaching the upper surface of the photosensitive resin 19-. (canceled)10. A method of producing at least one metal decoration on a substrate made of insulating material having a curved surface , the method comprising:a) providing the substrate and depositing thereon a photosensitive resin layer;b) irradiating the resin layer through a mask defining the contour of the desired decorations as well as of the photopolymerised areas and of the non-photopolymerised areas;c) dissolving the non-irradiated areas of the photosensitive resin layer in order to show in places the substrate at the location of the decorations;d) depositing a first adhesion layer and a second electrically conductive layer via a vapour deposition on the substrate and the photopolymerised areas;e) galvanically depositing a layer of a metal or of a metal alloy from said second electrically conductive layer in order to form at least one block substantially reaching the upper surface of the photosensitive resin;f) performing a step of surfacing and polishing in order to remove the surplus of the galvanically deposited layer;g) eliminating the remaining resin layer by plasma etching; andh) eliminating the first and second layers by a wet etching.11. The method according to claim 10 , wherein said first adhesion layer is of the Ti claim 10 , Ta claim 10 , Cr or Th type.12. The method according to claim 10 , wherein said second electrically conductive layer is chosen from: Au claim 10 , Pt claim 10 , Ag claim 10 , Cr claim 10 , Pd claim 10 , TiN claim 10 , CrN claim 10 , ZrN or Ni.13. The method according to claim 10 , wherein the first adhesion layer has a thickness between 30 nm and 80 nm.14. The method ...

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13-02-2020 дата публикации

HIGH-SPEED ELECTROPLATING METHOD

Номер: US20200048786A1
Принадлежит: YUAN ZE UNIVERSITY

A high-speed electroplating method is provided. The high-speed electroplating method includes the following steps: providing a substrate containing a conductive layer on its surface; coating a dry-film photoresist on the conductive layer of the substrate, and patterning the dry-film photoresist; performing a pretreatment process to clean the substrate; disposing the substrate in an electroplating solution; turning on an ultrasonic oscillation machine to vibrate the electroplating solution, and turning on a jet flow device to agitate the electroplating solution, and performing a pre-electroplating process with a plating current density of 0.5 A/dmto 5 A/dm, and then performing a high-speed electroplating process with a plating current density of 6 A/dmto 100 A/dm; depositing a conductive pillar on areas without the dry-film photoresist; and removing the dry-film photoresist being coated on the conductive layer of the substrate. Thus, the high-speed electroplating method can achieve high-speed electrodeposition with uniform microstructures. 1. A high-speed electroplating method , comprising:providing a substrate containing a conductive layer on its surface;coating a dry-film photoresist on the conductive layer of the substrate, and patterning the dry-film photoresist;disposing the substrate in an electroplating solution;{'sup': 2', '2', '2', '2, 'turning on an ultrasonic oscillation machine to vibrate the electroplating solution, and turning on a jet flow device to agitate the electroplating solution, and performing a pre-electroplating process with a plating current density of 0.5 A/dmto 5 A/dm, and then performing a high-speed electroplating process with a plating current density of 6 A/dmto 100 A/dm;'}depositing a conductive pillar on areas without the dry-film photoresist; andremoving the dry-film photoresist being coated on the conductive layer of the substrate.2. The method according to claim 1 , wherein ultrasonic oscillation of the electroplating solution is ...

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22-02-2018 дата публикации

COMPOSITE CERAMIC COATINGS FOR ANTI-CORROSION PROTECTION

Номер: US20180051386A1

In some embodiments, an anti-corrosive composite ceramic coating includes an inner metal layer formed on the surface of a metal object to be protected and an outer composite ceramic layer formed on the inner metal layer. 1. An anti-corrosive composite ceramic coating comprising:an inner metal layer formed on the surface of a metal object to be protected; andan outer composite ceramic layer formed on the inner metal layer.2. The coating of claim 1 , wherein the inner metal layer is a zinc or zinc alloy layer.3. The coating of claim 1 , wherein the inner metal layer is approximately 4 to 300 μm thick.4. The coating of claim 1 , wherein the composite ceramic layer contains zinc and silicon.5. The coating of claim 1 , wherein the composite ceramic layer is a hydrous zinc silicate layer.6. The coating of claim 5 , wherein the hydrous zinc silicate layer is made of ZnSiO(OH).7. The coating of claim 1 , wherein the composite ceramic layer is approximately 40 to 300 μm thick.8. A coated metal object protected by an anti-corrosive composite ceramic coating claim 1 , the coated metal object comprising:a steel body having a surface; andan anti-corrosive composite ceramic coating formed on body, the coating including an inner metal layer formed on the surface and an outer composite ceramic layer formed on the inner metal layer.9. The object of claim 8 , wherein the inner metal layer is a zinc or zinc alloy layer.10. The object of claim 8 , wherein the composite ceramic layer is a hydrous zinc silicate layer.11. A method for forming an anti-corrosive coating on a metal object claim 8 , the method comprising:electrolytically plating the surface of the object with a metal to form an inner layer; andelectrolytically depositing a composite ceramic layer on top of the inner layer.12. The method of claim 11 , wherein electrolytically plating the surface of the object comprises electrolytically plating the surface with zinc or a zinc alloy.13. The method of claim 11 , wherein ...

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25-02-2021 дата публикации

METHOD FOR MANUFACTURING PLATED MOLDED ARTICLE

Номер: US20210055655A1
Принадлежит:

A method for manufacturing a plated molded article, the method capable of forming a plated molded article having good adhesion with respect to a metal surface on a substrate using a mold, while forming a pattern used as the mold for forming the plated molded article by using a photosensitive composition while suppressing footing in the pattern. A resist pattern is formed by using the photosensitive composition that includes a sulfur-containing compound having a predetermined structure and/or a nitrogen-containing compound, and before forming the plated molded article, ashing is performed on the surface including a metal that is exposed from a nonresist section of the resist pattern used as the mold. 1. A method of manufacturing a plated article , the method comprising:preparing a substrate having a metal layer on a surface thereof and a photosensitive composition;applying the photosensitive composition onto the substrate to form a photosensitive composition film;exposing the photosensitive composition film;developing the exposed photosensitive composition film to form a pattern so that at least a portion of the metal layer on the substrate is exposed; andforming a plated article using the pattern as a template,wherein the photosensitive composition comprises a sulfur-containing compound and/or a nitrogen-containing compound,the sulfur-containing compound comprises a sulfur atom to be coordinated with metal constituting the metal layer,the nitrogen-containing compound comprises a nitrogen atom constituting a nitrogen-containing aromatic heterocycle to be coordinated with metal constituting the metal layer,the exposed portion of the metal layer is subjected to an ashing treatment between forming the pattern and forming the plated article.2. The method of manufacturing a plated article according to claim 1 , wherein the photosensitive composition comprises a mercapto group-containing compound as the sulfur-containing compound.3. The method of manufacturing a plated ...

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26-02-2015 дата публикации

REMOVABLE MASK FOR COATING A SUBSTRATE

Номер: US20150056427A1
Принадлежит: SIKORSKY AIRCRAFT CORPORATION

A system and a method for selectively coating a substrate includes a removable mask including a magnetic member having a first surface contour shaped to conform to the outside surface of the substrate and a magnetizable member having a second surface contour shaped to conform to the inside surface of the substrate. The method for coating the substrate includes magnetically coupling a removable mask to at least one surface of the substrate; forming a coating of a coating material on the at least one surface of the substrate with the magnetically coupled removable mask using a bath containing the coating material; and selectively decoupling the removable mask from the at least one coated surface to reveal a portion of the coated surface without the coating. 1. A method for selectively coating a substrate , comprising:magnetically coupling a removable mask to at least one surface of the substrate;forming a coating of a coating material on the at least one surface of the substrate with the magnetically coupled removable mask using a bath containing the coating material; andselectively decoupling the removable mask from the at least one coated surface to reveal a portion of the surface without the coating.2. The method of claim 1 , wherein the removable mask is magnetic claim 1 , and the substrate is attracted to the magnet so provide an adhesion force to magnetically couple the at least one surface to the removable mask.3. The method of claim 2 , wherein the magnetically coupling comprises making the removable mask magnetic by applying an electrical current to the removable mask.4. The method of claim 1 , wherein the magnetically coupling comprises:attaching a magnetizable mask to an opposite surface such that the substrate is between the removable and magnetizable masks;wherein the removable mask is magnetic, and the magnetizable mask is attracted to the removable mask so as to provide an adhesion force to magnetically couple the at least one surface to the removable ...

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23-02-2017 дата публикации

MAGNETS INCLUDING AN ALUMINUM MANGANESE ALLOY COATING LAYER AND RELATED METHODS

Номер: US20170053723A1
Принадлежит: Xtalic Corporation

Magnets including a coating and related methods are described herein. The coating may include an aluminum manganese alloy layer. The aluminum manganese alloy layer may be formed in an electroplating process. 1. An article , comprising:a magnet; anda coating formed on the magnet, the coating including an aluminum manganese alloy layer including a manganese concentration of less than or equal to 12 atomic %.2. The article of claim 1 , wherein the manganese concentration of the aluminum manganese alloy layer is between 0.5 atomic % and 12 atomic %.3. The article of claim 1 , wherein the magnet comprises a rare earth magnetic material.4. The article of claim 1 , wherein the rare earth magnetic material comprises neodymium.5. The article of claim 1 , wherein the rare earth magnetic material further comprises iron and boron.6. The article of claim 1 , wherein the magnet comprises a material selected from the group consisting of NdFeB claim 1 , NdFeB claim 1 , SmCo claim 1 , AlNiCo claim 1 , and NiFe.7. The article of claim 1 , wherein the aluminum manganese alloy includes a manganese concentration of between 0.5 atomic % and 10 atomic %.8. The article of claim 1 , wherein the coating includes a single layer claim 1 , the single layer comprising the aluminum manganese alloy.9. The article of claim 1 , wherein the coating includes multiple layers.10. The article of claim 1 , wherein the coating further includes a layer comprising nickel.11. The article of claim 1 , wherein the layer comprising nickel is formed under the aluminum manganese alloy layer.12. The article of claim 1 , wherein the coating further comprises a layer comprising a composition selected from the group consisting of Ni claim 1 , Cu claim 1 , Ni—P claim 1 , Sn claim 1 , Zn claim 1 , and combinations thereof.13. The article of claim 1 , wherein the coating includes a metal layer formed over the aluminum manganese layer.14. The article of claim 1 , wherein the aluminum manganese alloy layer has an average ...

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10-03-2022 дата публикации

Microetch Neutralizer Chemistry For Ni-Au Plating Defect Elimination

Номер: US20220074067A1
Принадлежит:

A neutralizing composition comprising ascorbic acid as a reducing agent, citric acid as a chelator and a pH adjusting agent applied to microetched copper substrates bussed to stainless steel, which have been cleaned with an agent comprising permanganate ions. Unlike the prior art neutralizing agents comprising oxalic acid, which leave insoluble residue on the surface of the copper substrate, the present neutralizing composition leaves no residue and acts quickly. A surprising reduction in defects of Ni—Au plated copper substrates is achieved by utilization of the neutralization composition in a manufacturing process. 1. A neutralizing composition comprising:a reducing agent,a chelator; anda pH adjuster.2. The neutralizing composition of claim 1 , wherein the reducing agent is a carbocyclic acid selected from the group consisting of tartaric acid claim 1 , acetic acid claim 1 , malic acid claim 1 , malonic acid claim 1 , ascorbic acid claim 1 , lactic acid claim 1 , succinic acid claim 1 , and salts thereof.3. The neutralizing composition of claim 1 , wherein the chelator is comprised of citric acid claim 1 , ethylene diamine tetra-acetic acid (EDTA) claim 1 , or other divalent cation chelator.4. The neutralizing composition of claim 1 , wherein the reducing agent is present in an amount in the range of 12-18 wt. % claim 1 , the chelator in an amount in the range of 11-15 wt. % claim 1 , and the pH adjuster in an amount to bring the pH of the composition to a pH of about 2.5. The neutralizing composition of claim 4 , wherein the pH adjuster is selected from the group consisting of sodium hydroxide claim 4 , potassium hydroxide claim 4 , and mixtures thereof.6. The neutralizing composition of claim 1 , wherein the reducing agent comprises ascorbic acid claim 1 , the chelator comprises citric acid and the pH adjuster is selected from the group consisting of sodium hydroxide claim 1 , potassium hydroxide claim 1 , and mixtures thereof.7. A composition comprising: ...

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01-03-2018 дата публикации

METAL PARTICLE AND METHOD FOR PRODUCING THE SAME, COVERED METAL PARTICLE, AND METAL POWDER

Номер: US20180056451A1
Автор: WAKANO Motoki
Принадлежит:

A metal particle having a particle diameter of 10 μm or more and 1000 μm or less and includes Cu and trace elements and a total mass content of P and S, among other trace elements, is 3 ppm or more and 30 ppm or less. A method for producing a metal particle including producing a molten metal material by melting a metal material in a crucible, wherein Cu as determined in GDMS analysis is over 99.995% and a total of P and S is 3 ppm or more and 30 ppm or less; applying a pressure of 0.05 MPa or more and 1.0 MPa or less to drip the molten metal material through an orifice, thereby producing a molten metal droplet; and rapidly solidifying the molten metal droplet using an inert gas whose oxygen concentration is 1000 ppm or less. 16-. (canceled)7. A metal particle having a particle diameter of 10 μm or more and 1000 μm or less and including Cu and trace elements , wherein a Cu mass content as determined in GDMS analysis is over 99.995% and a total mass content of P and S , among other trace elements , is 3 ppm or more and 30 ppm or less.8. A covered metal particle claim 7 , wherein a surface of the metal particle according to is covered with an Ni layer.9. The covered metal particle according to claim 8 , wherein a surface of the Ni layer is covered with a solder layer.10. A metal powder comprising metal particles according to .11. A metal powder comprising covered metal particles according to .12. A metal powder comprising covered metal particles according to .13. A method for producing a metal particle claim 9 , the method comprising:a step a of producing a molten metal material by melting a metal material in a crucible, wherein a Cu mass content as determined in GDMS analysis of the metal material is over 99.995% and a total mass content of P and S of the metal material is 3 ppm or more and 30 ppm or less;a step b of applying a pressure of 0.05 MPa or more and 1.0 MPa or less to an inside of the crucible to drip the molten metal material through an orifice whose ...

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03-03-2016 дата публикации

METHOD FOR DEPOSITING THICK COPPER LAYERS ONTO SINTERED MATERIALS

Номер: US20160060781A1
Принадлежит:

The present invention relates to a method for electrodepositing a thick copper layer onto an electrically conductive, sintered layer. The thick copper layer has a high adhesion strength, is poor in defects and internal stress, and has high electrical and thermal conductivity. The thick copper layer on the sintered layer is suited for printed circuit boards for high power electronic applications. 1. A method for electrodepositing at least one copper layer onto an electrically conductive , sintered layer , the method comprising the steps of(i) providing at least one electrically conductive, sintered layer,(i.a) pre-treating the at least one electrically conductive, sintered layer,(ii) contacting the sintered layer with an electrolytic copper plating solution and applying an electrical current between the sintered layer and at least one anode, and(iii) thereby depositing a copper layer onto the sintered layer,wherein the pre-treating of the at least one electrically conductive, sintered layer comprises a step (i.aa):(i.aa) contacting the at least one electrically conductive, sintered layer with a micro etchant comprising a sulfuric solution and at least one peroxo compound as oxidizing agent.2. The method according to wherein the micro etchant according to method step (i.aa)further comprises at least one source of a halogenide ion.3. The method according to wherein the at least one electrically conductive claim 1 , sintered layer comprises a metal selected from the group of copper claim 1 , titanium claim 1 , silver claim 1 , aluminum claim 1 , tungsten claim 1 , silicon claim 1 , nickel claim 1 , tin claim 1 , palladium claim 1 , platinum claim 1 , and mixtures thereof.4. The method according to wherein the at least one electrically conductive claim 1 , sintered layer is provided on a substrate.5. The method according to wherein the substrate is made of a material selected from ceramics claim 4 , glass claim 4 , enamel claim 4 , and quartz.6. The method according to ...

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04-03-2021 дата публикации

PLATING METHOD AND PLATING APPARATUS

Номер: US20210062354A1
Принадлежит:

A plating method for plating a substrate having resist opening portions is provided. The plating method includes a resist residue removing step of removing resist residues in the resist opening portions of the substrate by spraying first process liquid to a surface of the substrate on which the resist opening portions are formed, a liquid filling step of soaking the substrate passed through the removing step in second process liquid to fill the resist opening portions of the substrate with the second process liquid, and a plating step of plating the substrate passed through the liquid filling step. 1. A plating apparatus for plating a substrate having resist opening portions including:a resist residue removing apparatus for removing resist residues in resist opening portions of the substrate, comprising a spray unit having nozzles for spraying a first process liquid to a surface of the substrate on which the resist opening portions are formed;a liquid filling apparatus for soaking the substrate in a second process liquid to fill the resist opening portions of the substrate with the second process liquid;a plating bath for plating the substrate; anda moving mechanism for moving at least either one of the spray unit and the substrate so that the spray unit moves relatively along the surface of the substrate,wherein the spray unit includes a first nozzle group and a second nozzle group that are spaced from each other in upper and lower positions in a vertical direction, and the first nozzle group and the second nozzle group contain a plurality of nozzles arranged in a horizontal direction, andthe spray unit is configured so that spraying from the first nozzle group and spraying from the second nozzle group are performed on the substrate arranged in the vertical direction at different timings.2. The plating apparatus according to claim 1 , wherein each of the first nozzle group and the second nozzle group includes a first nozzle array and a second nozzle array arranged ...

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04-03-2021 дата публикации

Hydrophobic stainless-steel copper-coated mesh and method of synthesizing same

Номер: US20210062355A1

Disclosed is a copper coated stainless-steel hydrophobic mesh and a method for synthesizing the hydrophobic mesh. In the method, a stainless-steel mesh is sonicated in a solution of acetone and ethanol, and then electroplated in a copper solution to form a copper coating on the surface of the mesh. The copper-coated stainless-steel mesh is treated with an oxidizing solution having an oxidizing potential applied to it. The mesh is then washed with water and dried. The copper-coated stainless-steel mesh is then immersed in a lauric acid solution. The mesh is then rinsed with ethanol to remove adsorbed lauric acid. After drying, the so-synthesized copper-coated stainless-steel hydrophobic mesh is characterized in that it has hydrophobic branches of lauric acid.

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05-03-2015 дата публикации

HIGH STRENGTH AND HIGH FORMABILITY STEEL SHEET AND MANUFACTURING METHOD THEREOF

Номер: US20150064448A1
Принадлежит: JFE STEEL CORPORATION

A high strength and high formability steel sheet contains, by mass % of the steel sheet: greater than 0.020% and less than 0.040% of C; not less than 0.003% and not greater than 0.100% of Si; not less than 0.10% and not greater than 0.60% of Mn; not less than 0.001% and not greater than 0.100% of P; not less than 0.001% and not greater than 0.020% of S; not less than 0.005% and not greater than 0.100% of Al; and greater than 0.0130% and not greater than 0.0170% of N, wherein a remainder is Fe and inevitable impurities, and the steel sheet has: a tensile strength in a rolling direction of not lower than 520 MPa; an Erichsen value of not less than 5.0 mm; and a resin film layer at least on a side to be an inner surface of a can. 1. A high strength and high formability steel sheet comprising:a steel sheet layer comprising, in mass %, greater than 0.020% and less than 0.040% of C;not less than 0.003% and not greater than 0.100% of Si;not less than 0.10% and not greater than 0.60% of Mn;not less than 0.001% and not greater than 0.100% of P;not less than 0.001% and not greater than 0.020% of S;not less than 0.005% and not greater than 0.100% of Al;greater than 0.0130% and not greater than 0.0170% of N;a remainder being Fe and inevitable impurities; anda resin film layer on at least one side of the steel sheet layer;the steel sheet having:a tensile strength in a rolling direction of not less than 520 MPa; andan Erichsen value of not less than 5.0 mm.2. The steel sheet according to claim 1 , wherein thickness of the resin film layer is 5 to 100 μm.3. A method of manufacturing a high strength and high formability steel sheet comprising: greater than 0.020% and less than 0.040% of C;', 'not less than 0.003% and not greater than 0.100% of Si;', 'not less than 0.10% and not greater than 0.60% of Mn;', 'not less than 0.001% and not greater than 0.100% of P;', 'not less than 0.001% and not greater than 0.020% of S;', 'not less than 0.005% and not greater than 0.100% of Al;', ' ...

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08-03-2018 дата публикации

SYSTEM AND METHOD OF ATTACHING SOFT TISSUE TO AN IMPLANT

Номер: US20180064539A1
Принадлежит: PURDUE RESEARCH FOUNDATION

One embodiment of the present invention is directed to compositions and methods for enhancing attachment of soft tissues to a metal prosthetic device. In one embodiment a construct is provided comprising a metal implant having a porous metal region, wherein said porous region exhibits a nano-textured surface. 120-. (canceled)21. An implant comprising:a metal surface comprising a nano-textured surface formed by anodizing the metal surface.22. The implant accord to claim 21 , wherein the implant is a metal implant.23. The implant according to claim 21 , comprising one or more layers on the metal surface selected from the group consisting of:a calcified material layer or calcification-inducing layer coating in contact with the nano-textured surface; anda bioactive scaffold layer comprising a biocompatible polymer matrix and a bioactive agent, wherein at least a portion of the scaffold layer is in contact with the calcified material layer or calcification-inducing layer, where said calcified material layer or calcification-inducing layer is present.24. The implant according to claim 21 , wherein the nano-textured surface comprises one or more bioactive agents or biocompatible inorganic materials.25. The implant according to claim 24 , wherein the one or more bioactive agents or biocompatible inorganic materials comprise an antimicrobial agent.26. The implant according to claim 21 , wherein the metal surface comprises titanium or a titanium alloy.27. The implant according to claim 26 , wherein the metal surface comprises titanium.28. The implant according to claim 26 , wherein the nano-textured surface comprises one or more bioactive agents or biocompatible inorganic materials.29. The implant according to claim 27 , wherein the nano-textured surface comprises one or more bioactive agents or biocompatible inorganic materials.30. The implant according to claim 28 , wherein the one or more bioactive agents or biocompatible inorganic materials comprise an antimicrobial agent ...

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17-03-2022 дата публикации

ELECTROPLATED STEEL SHEET HAVING EXCELLENT SURFACE APPEARANCE, AND MANUFACTURING METHOD THEREFOR

Номер: US20220081795A1
Принадлежит:

Provided is a zinc-nickel-alloy-electroplated steel sheet comprising a base steel sheet, and a zinc-nickel-plated layer which is located on at least one surface of the base steel sheet and which has a hairline pattern formed thereon, wherein the surface roughness of the surface of the base steel sheet, which forms an interface with the zinc-nickel-plated layer, is 0.7-1.0 um on the basis of the center line average roughness (R). According to the present invention, provided are: a zinc-nickel-electroplated steel sheet, which has a beautiful surface appearance after hairline processing, has better price competitiveness than a conventional stainless steel or a vinyl-coated steel, and can ensure high productivity in a coil polishing line; and a manufacturing method therefor. 1. A zinc-nickel alloy electroplated steel sheet , comprising:a base steel sheet; anda zinc-nickel plating layer located on at least one surface of the base steel sheet, and having a hairline pattern formed thereon,{'sub': 'a', 'wherein surface roughness of the base steel sheet forming an interface with the zinc-nickel plating layer is 0.7 to 1.0 μm on the basis of center line average roughness (R).'}2. The zinc-nickel alloy electroplated steel sheet of claim 1 , wherein the zinc-nickel plating layer is composed of a single gamma (NiZn) phase.3. The zinc-nickel alloy electroplated steel sheet of claim 1 , wherein hardness of the zinc-nickel plating layer is 250 to 400 Hv.4. A method of manufacturing a zinc-nickel alloy electroplated steel sheet claim 1 , comprising operations of:skin-pass rolling a base steel sheet;immersing the skin-pass-rolled base steel sheet in a sulfuric acid bath including nickel sulfate hexahydrate and zinc sulfate heptahydrate to form a zinc-nickel plating layer on the base steel sheet; andpolishing the zinc-nickel plating layer and processing a hairline pattern.5. The method of manufacturing a zinc-nickel alloy electroplated steel sheet of claim 4 , wherein the operation of ...

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28-02-2019 дата публикации

HIGH STRENGTH ANNEALED STEEL PRODUCTS

Номер: US20190062864A1
Принадлежит:

The present invention provides steel sheet products having controlled compositions that are subjected to two-step annealing processes to produce sheet products having desirable microstructures and favorable mechanical properties such as high strength and ultra-high formability. Steels processed in accordance with the present invention exhibit combined ultimate tensile strength and total elongation (UTS·TE) properties of greater than 25,000 MPa-%. Steels with these properties fall into the category of Generation 3 advanced high strength steels, and are highly desired by various industries including automobile manufacturers. 1. A high strength cold rolled steel sheet product comprising from 0.12 to 0.5 weight percent C , from 1 to 3 weight percent Mn , and from 0.8 to 3 weight percent of a combination of Si and Al , wherein the steel sheet product has been subjected to a two-step annealing process , comprises ferrite and substantially equiaxed retained austenite grains having an average aspect ratio of less than 3:1 , and has a combination of ultimate tensile strength and total elongation UTS·TE of greater than 25 ,000 MPa %.2. The high strength cold rolled steel sheet product of claim 1 , wherein the Si comprises up to 2 weight percent claim 1 , the Al comprises up to 2 weight percent claim 1 , and the further steel sheet product further comprises up to 0.05 weight percent Ti claim 1 , and up to 0.05 weight percent Nb.3. The high strength cold rolled steel sheet product of claim 2 , wherein the C comprises from 0.15 to 0.4 weight percent claim 2 , the Mn comprises from 1.3 to 2.5 weight percent claim 2 , the Si comprises from 0.2 to 1.8 weight percent claim 2 , the Al comprises up to 1.5 weight percent claim 2 , the Ti comprises up to 0.03 weight percent claim 2 , and the Nb comprises up to 0.03 weight percent.4. The high strength cold rolled steel sheet product of claim 2 , wherein the C comprises from 0.17 to 0.35 weight percent claim 2 , the Mn comprises from 1.5 ...

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09-03-2017 дата публикации

Electrolytic Generation of Manganese (III) Ions in Strong Sulfuric Acid

Номер: US20170067176A1
Принадлежит:

An electrolytic cell and a method of electrochemical oxidation of manganese(II) ions to manganese(III) ions in the electrolytic cell are described. The electrolytic cell comprises (1) an electrolyte solution of manganese(II) ions in a solution of at least one acid; (2) a cathode immersed in the electrolyte solution; and (3) an anode immersed in the electrolyte solution and spaced apart from the cathode. Various anode materials are described including vitreous carbon, reticulated vitreous carbon, woven carbon fibers, lead and lead alloy. Once the electrolyte is oxidized to form a metastable complex of manganese(III) ions, a platable plastic may be contacted with the metastable complex to etch the platable plastic. In addition, a pretreatment step may also be performed on the platable plastic prior to contacting the platable plastic with the metastable complex to condition the plastic surface. 1. An electrolytic cell comprising:an electrolyte solution comprising manganese(III) ions and manganese(II) ions in a solution of comprising sulfuric acid and an additional acid selected from the group consisting of methane sulfonic acid, methane disulfonic acid and combinations thereof;a cathode in contact with the electrolyte solution; andan anode in contact with the electrolyte solution.2. The electrolytic cell according to claim 1 , wherein the solution comprises at least 8M sulfuric acid.3. The electrolytic cell according to claim 2 , wherein the solution comprises at least 12M sulfuric acid.4. The electrolytic cell according to claim 1 , wherein the solution comprises between about 1M and about 6M methane sulfonic acid or methane disulfonic acid.5. The electrolytic cell according to claim 1 , wherein the solution comprises from 9 to 15 molar sulfuric acid and between about 1M and about 6M methane sulfonic acid.6. The electrolytic cell according to claim 1 , wherein the anode comprises a material selected from the group consisting of vitreous carbon claim 1 , reticulated ...

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29-05-2014 дата публикации

APPARATUS FOR PRODUCING ANNEALED STEELS AND PROCESS FOR PRODUCING SAID STEELS

Номер: US20140147697A1
Принадлежит:

An apparatus for producing annealed steels and annealed steels produced thereby. 1. An apparatus for producing annealed steels comprising:a. an uncoiler for uncoiling steel strip material [ A. a first heating unit comprising of radiant tube burners or an induction furnace for heating the steel strip to a temperature of between 400 to 600° C., and', 'B. a second heating unit comprising one or more transversal induction furnaces for further heating the steel strip to an annealing temperature of between 500° C. to about 1000° C.;, 'i. a heating section comprising, 'ii. a soaking step for soaking the steel strip for a period of at most 120 seconds;', 'iii. a cooling step comprising a slow cooling zone, a fast cooling zone, and a third cooling zone, wherein the slow cooling zone is for cooling the steel strip from the annealing temperature to the fast cooling start temperature and wherein the fast cooling zone is for quickly cooling the steel strip from the fast cooling start temperature to a cooling stop temperature of about 300° C. and wherein the third cooling zone is for cooling the steel strip from the second cooling stop temperature to a temperature of between ambient temperature and 100° C.;, 'b. a heating zone comprisingc. an optional reheating zoned. an optional tailor annealing zone for local heat treating one or more zones areas in the longitudinal direction of the stripe. a final cooling zone optionally a pickling and/or activation step', 'optionally a first cleaning step', 'an electrolytic coating step', 'optionally a second cleaning step', 'optionally a drying step, 'f. a coating zone comprisingg. a coiler for coiling the annealed strip material.2. The apparatus according to claim 1 , wherein the heating zone comprises a first heating unit comprising radiant tube burners for heating the steel strip to a temperature of at most about 500° C.3. The apparatus according to claim 2 , wherein the second heating unit comprises a first transversal induction furnace ...

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27-02-2020 дата публикации

PRODUCING METHOD OF MODULE

Номер: US20200066441A1
Принадлежит: NITTO DENKO CORPORATION

A method for producing a module includes a first step of preparing a seed layer disposed at a one-side surface in a thickness direction of a first peeling layer, a second step of forming a conductive pattern at a one-side surface in the thickness direction of the seed layer by plating allowing electric power to be supplied from the seed layer, a third step of pushing the conductive pattern into a first adhesive layer containing a first magnetic particle, and a fourth step of exposing the other-side surfaces in the thickness direction of the conductive pattern and the first adhesive layer. 1. A method for producing a module comprising:a first step of preparing a seed layer disposed at a one-side surface in a thickness direction of a first peeling layer,a second step of forming a conductive pattern at a one-side surface in the thickness direction of the seed layer by plating allowing electric power to be supplied from the seed layer,a third step of pushing the conductive pattern into a first adhesive layer containing a first magnetic particle, anda fourth step of exposing the other-side surfaces in the thickness direction of the conductive pattern and the first adhesive layer.2. The method for producing a module according to claim 1 , whereinin the third step, the seed layer is press-bonded to the first adhesive layer, and the conductive pattern is pushed into the first adhesive layer, andthe fourth step includes a fifth step of peeling the first peeling layer from the seed layer and a sixth step of removing the seed layer.3. The method for producing a module according to claim 2 , whereinin the sixth step, the seed layer is etched.4. The method for producing a module according to claim 1 , whereinthe content ratio of the first magnetic particle in the first adhesive layer is 15 volume % or more and 80 volume % or less.5. The method for producing a module according to claim 1 , whereina first resin component is an epoxy resin, a phenol resin, and an acrylic resin.6. ...

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19-03-2015 дата публикации

METAL-ELECTRODEPOSITED INSULATOR SUBSTRATE AND METHOD OF MAKING THE SAME

Номер: US20150075847A1
Принадлежит:

A method of making a metal-electrodeposited insulator substrate includes: forming first and second continuous conductor parts of a patterned conductive base layer on a pattern-forming surface of an insulator substrate; subjecting an assembly of the patterned conductive base layer and the insulator substrate to electroplating so as to simultaneously form first and second electroplating parts of a patterned electroplating layer on the patterned conductive base layer; and removing a sacrificial portion of the first continuous conductor part and a sacrificial portion of the first electroplating part from the insulator substrate. 1. A method of making a metal-electrodeposited insulator substrate , comprising:forming a patterned conductive base layer on a pattern-forming surface of an insulator substrate, such that the patterned conductive base layer has a first continuous conductor part and a second continuous conductor part that is spaced apart from the first continuous conductor part, each of the first and second continuous conductor parts having an electroplating surface, the first continuous conductor part having a target portion and at least one sacrificial portion that extends from the target portion;subjecting an assembly of the patterned conductive base layer and the insulator substrate to electroplating so as to simultaneously form first and second electroplating parts of a patterned electroplating layer on the patterned conductive base layer, such that the first electroplating part is formed on and overlaps entirely the electroplating surface of the first continuous conductor part, and that the second electroplating part is formed on and overlaps entirely the electroplating surface of the second continuous conductor part, the first electroplating part having at least one sacrificial portion that overlaps the sacrificial portion of the first continuous conductor part; andremoving the sacrificial portion of the first continuous conductor part and the sacrificial ...

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19-03-2015 дата публикации

Method of fabricating a bath of electrolyte for plating a platinum-based metallic underlayer on a metallic substrate

Номер: US20150075996A1
Принадлежит: SNECMA SAS

The invention relates to a method of fabricating a bath of electrolyte for plating a platinum-based metal underlayer on a metallic substrate, the method comprising the following steps: a) providing a first system having ligands and amine functional groups, said first system being constituted by an aqueous solution of an amino ligand comprising at least one compound X—(NH 2 ) n , where X belongs to the group constituted by (CH 3 , CH 3 —CH 2 , CH 3 —(CH 2 ) m ), or NH 3 or an x p− (NH 4 ) + p salt where x is an acid radical belonging to the group constituted by (PO 4 3− , HPO 4 2− , H 2 PO 4 − , HPO 4 2− and H 2 PO 4 − , SO 4 2− , HSO 4 − , H 2 SO 4 , HSO 4 − , and H 2 SO 4 , CH 3 COO − , CH 3 COOH, and CH 3 COO − ), or H 2 SO 4 , or CH 3 COOH, and where n, m, and p are non-zero integers; b) providing a second system forming a buffer system; c) providing a third system providing a metallic salt, and constituted by an aqueous solution of platinum; d) providing a fourth system suitable for imparting the conduction property to the medium; and e) mixing together the four systems so as to obtain the said electrolyte bath. The method is applicable to plating a metallic underlayer as a thermal barrier on a part made of superalloy.

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16-03-2017 дата публикации

TOOTHBRUSH WITH PARTIALLY COATED SURFACE

Номер: US20170071330A1
Принадлежит: TRISA HOLDING AG

The toothbrush has a handle, a neck and a head. In the handle there is a first hard component which has a metallic covering. At least in regions, the metallic covering has a covering of a second hard component. 1. A method for producing a toothbrush with a handle part , having a first hard component , a neck part , adjoining said handle part , and a head part , carried by said neck part , in which the first hard component is formed by means of injection molding or multi-component injection molding and is subsequently provided with a metallic coating , at least in certain regions , the first hard component in the handle part taking up a significant proportion of the cross section of the handle part , at least in certain regions , wherein the metallic coating in the handle part is covered , at least in certain regions , by a second hard component by means of injection molding or multi-component injection molding , the first hard component and the second hard component being firmly connected to each other in a mechanical manner , without forming a material bond.2. The method as claimed in claim 1 , wherein the first hard component is produced by the injection-molding process or multi-component injection-molding process claim 1 , after which the first hard component is decoupled from the cycle of the injection-molding process or multi-component injection-molding process and stored and provided with the metallic coating claim 1 , then the first hard component claim 1 , provided with the metallic coating claim 1 , is placed into an injection-molding tool or multi-component injection-molding tool and overmolded with a second hard component claim 1 , at least in certain regions.3. The method as claimed in claim 1 , wherein the first hard component is produced in an injection-molding tool or a multi-component injection-molding tool claim 1 , is removed from the injection-molding tool or multi-component injection-molding tool and claim 1 , coupled to the cycle of the ...

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