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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Поддерживает ввод нескольких поисковых фраз (по одной на строку). При поиске обеспечивает поддержку морфологии русского и английского языка
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Применить Всего найдено 5742. Отображено 100.
29-03-2012 дата публикации

Electrolytic gold or gold palladium surface finish application in coreless substrate processing

Номер: US20120077054A1
Принадлежит: Intel Corp

Electronic assemblies including coreless substrates having a surface finish, and their manufacture, are described. One method includes electrolytically plating a first copper layer on a metal core in an opening in a patterned photoresist layer. A gold layer is electrolytically plated on the first copper layer in the opening. An electrolytically plated palladium layer is formed on the gold layer. A second copper layer is electrolytically plated on the palladium layer. After the electrolytically plating the second copper layer, the metal core and the first copper layer are removed, wherein a coreless substrate remains. Other embodiments are described and claimed.

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07-06-2012 дата публикации

Bathroom appliance

Номер: US20120141821A1
Принадлежит: GROHE AG

A bathroom appliance is provided having a substrate made of metal or plastic and a coating, it is provided to consecutively electroplate metal layers made of copper, an alloy of copper and tin, and chromium and to subsequently apply a cover layer which is made of at least one of the elements of chromium, titanium, zirconium, gold, silver or platinum or is made of a chemical combination of the elements of titanium or chromium and nitrogen and, optionally, carbon, the cover layer being produced on the electroplated chromium layer by means of a PVD method.

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05-07-2012 дата публикации

Nickel-plated steel sheet and process for producing battery can using the nickel-plated steel sheet

Номер: US20120171518A1
Принадлежит: Toyo Kohan Co Ltd

A Ni-plated steel sheet is provided in which thee occurrence of scratches at the time of forming a battery can is suppressed. Also provided is a method which includes a step where a surface of a steel sheet is plated with Ni in a Ni adhesion amount of 0.3-2 μm, a step where the Ni-plated steel sheet is heated to 600-800° C. to form an Fe−Ni diffusion layer as an outermost surface layer, and a step where the steel sheet is rolled by temper rolling so as to adjust the Fe−Ni diffusion layer so that the steel sheet has the surface roughness Ra of 0.9-2.0 μm and the surface roughness Ry of 4.0-15 μm. A Ni-plated steel sheet which includes an Fe−Ni diffusion layer as an outermost surface layer and in which the diffusion layer has the surface roughness Ra of 0.9-2.0 μm and the surface roughness Ry of 4.0-15 μm and the diffusion layer has such an Fe/Ni ratio that the Fe accounts for 20-50% in Auger analysis is subjected to drawing using a water-soluble liquid which contains water-soluble emersion as a press lubricant.

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26-07-2012 дата публикации

Structures for improving current carrying capability of interconnects and methods of fabricating the same

Номер: US20120187558A1
Принадлежит: International Business Machines Corp

Interconnect structures and methods of fabricating the same are provided. The interconnect structures provide highly reliable copper interconnect structures for improving current carrying capabilities (e.g., current spreading). The structure includes an under bump metallurgy formed in a trench. The under bump metallurgy includes at least: an adhesion layer; a plated barrier layer; and a plated conductive metal layer provided between the adhesion layer and the plated barrier layer. The structure further includes a solder bump formed on the under bump metallurgy.

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30-08-2012 дата публикации

Process for the electrolytic copper plating of zinc diecasting having a reduced tendency to blister formation

Номер: US20120217166A1
Принадлежит: UMICORE GALVANOTECHNIK GMBH

In the electroplating of zinc diecastings with a copper layer, the electrolyte penetrates into the pores of the zinc diecasting. When the temperature is increased later, this leads to vaporization of the electrolyte liquid in the pores and to blistering or flaking of the copper layer. It is proposed that plating be carried out in two steps. In the first step, only a thin copper layer of less than 1 μm is applied and the plated parts are then treated at a temperature which leads to vaporization of the electrolyte liquid. The thin copper layer is still sufficiently porous for the vapour to be able to escape. Only the solid constituents of the electrolyte remain. The copper layer is then thickened to a final thickness of from about 20 to 30 μm. In this plating step, electrolyte liquid no longer penetrates into the pores of the zinc diecasting. The parts which are coated in this way display no blistering or flaking of the copper layer after storage at a temperature of 150° C.

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06-09-2012 дата публикации

Invisible set decorative part

Номер: US20120225314A1
Принадлежит: DRESS YOUR BODY AG

The invention relates to a decorative part ( 1, 3, 5 ) including several stones ( 2 ) and a device ( 7, 7′, 47, 47 ′) for securing the stones ( 2 ) in relation to each other. According to the invention, the securing device ( 7, 7′, 47, 47 ′) includes a single electrodeposited base ( 9, 9′, 49, 49 ′) whose shape matches one part of the stones, allowing all the stones ( 2 ) to be attached in relation to each other without any stress, and the girdles ( 6 ) of the stones ( 2 ) are mounted edge-to-edge in relation to each other so that said single base is concealed. The invention also relates to the method for manufacturing a part ( 1, 3, 5 ) of this type. The invention concerns the field of pieces or jewellery or timepieces.

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20-09-2012 дата публикации

Method for Electrochemical Fabrication

Номер: US20120234688A1
Автор: Adam L. Cohen
Принадлежит: University of Southern California USC

An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.

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20-09-2012 дата публикации

Porous three dimensional copper, tin, copper-tin, copper-tin-cobalt, and copper-tin-cobalt-titanium electrodes for batteries and ultra capacitors

Номер: US20120237823A1
Принадлежит: Applied Materials Inc

A method and apparatus for forming a reliable and cost efficient battery or electrochemical capacitor electrode structure that has an improved lifetime, lower production costs, and improved process performance are provided. In one embodiment a method for forming a three dimensional porous electrode for a battery or an electrochemical cell is provided. The method comprises depositing a columnar metal layer over a substrate at a first current density by a diffusion limited deposition process and depositing three dimensional metal porous dendritic structures over the columnar metal layer at a second current density greater than the first current density.

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01-11-2012 дата публикации

Control of electromagnetic signals of coins through multi-ply plating technology

Номер: US20120273361A1
Автор: Hieu Cong Truong
Принадлежит: ROYAL CANADIAN MINT

The present invention relates to novel metallic composites that are useful as coinage materials. These composites are produced through a multi-ply plating process and are designed to overcome difficulties associated with calibrating vending machines that can result in fraud. In one embodiment, the metallic composite comprises a steel core over which nickel and then a non-magnetic metal such as copper, brass or bronze is deposited as a layered pair. The magnetic and non-magnetic metals may also be applied in the reverse order, with the copper, brass or bronze applied directly over the steel and then covered by the nickel. The electromagnetic signature (EMS) of the composite is controlled by defining the thickness of the deposited metal layers. Advantageously, the invention overcomes problems associated when different coins are made from the same alloy and have similar sizes, and therefore cannot be distinguished by vending machines.

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29-11-2012 дата публикации

Electrolyte and process for depositing a matt metal layer

Номер: US20120298519A1
Принадлежит: Enthone Inc

An electrolytic composition for the deposition of a matt metal layer onto a substrate and deposition process where the composition comprises a source of metal from the group consisting of Cr, Mn, Fe, Co, Ni, Cu, Zn, Ru, Rh, Pd, Ag, In, Sn, Sb, Re, Pt, Au, Bi, and combinations thereof; a substituted or unsubstituted polyalkylene oxide or its derivative as an emulsion and/or dispersion former; and a compound comprising fluorated or perfluorated hydrophobic chains or which is a polyalkylene oxide substituted quaternary ammonium compound as wetting agent; wherein the electrolytic composition forms a microemulsion and/or dispersion.

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29-11-2012 дата публикации

Silver-coated composite material for a movable contact part, method of producing the same, and movable contact part

Номер: US20120301745A1
Принадлежит: Furukawa Electric Co Ltd

A silver-coated composite material for movable contact parts, which has: an underlying layer composed of any one of nickel, cobalt, a nickel alloy, and a cobalt alloy at least provided on a part of the surface of a stainless steel substrate; an intermediate layer composed of copper or a copper alloy provided thereon; and a silver or silver alloy layer provided thereon as an outermost layer, wherein a thickness of the intermediate layer is 0.05 to 0.3 μm, and wherein an average grain size of the silver or silver alloy provided as the outermost layer is 0.5 to 5.0 μm.

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10-01-2013 дата публикации

Copper Foil for Printed Circuit

Номер: US20130011690A1
Автор: Atsushi Miki, Hideta Arai
Принадлежит: JX Nippon Mining and Metals Corp

Disclosed is a copper foil for printed circuits prepared by forming a primary particle layer of copper on a surface of a copper foil, and then forming a secondary particle layer based on ternary alloy composed of copper, cobalt and nickel on the primary particle layer; in which the average particle size of the primary particle layer is 0.25 to 0.45 μm, and the average particle size of the secondary particles layer based on ternary alloy composed of copper, cobalt and nickel is 0.05 to 0.25 μm. Provided is a copper foil for printed circuits, in which powder fall from the copper foil can be reduced and the peeling strength and heat resistance can be improved by forming a primary particle layer of copper on a surface of a copper foil, and then forming a secondary particle layer based on copper-cobalt-nickel alloy plating on the primary particle layer.

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24-01-2013 дата публикации

Silver plated electrical contact

Номер: US20130023166A1
Принадлежит: Tyco Electronics Corp

A method for silver plating an electrical contact is provided. The method includes cleaning an electrical contact by removing oil or other contaminants and exposing the electrical contact to at least one of an acid or base. The method also includes preparing a silver plating bath including a silver compound, a transition metal compound, and a supporting salt, wherein the transition metal is at least one of nickel or cobalt. The method further includes silver plating the electrical contact in the silver plating bath.

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28-02-2013 дата публикации

Biocidal metallic layers comprising cobalt

Номер: US20130052482A1
Принадлежит: Integran Technologies Inc

Free standing articles or articles at least partially coated with substantially porosity free, fine-grained and/or amorphous Co-bearing metallic materials optionally containing solid particulates dispersed therein, are disclosed. The electrodeposited metallic layers and/or patches comprising Co provide, enhance or restore strength, wear and/or lubricity of substrates without reducing the fatigue performance. The fine-grained and/or amorphous metallic coatings comprising Co are particularly suited for articles exposed to thermal cycling, fatigue and other stresses and/or in applications requiring anti-microbial properties.

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21-03-2013 дата публикации

Method of plating stainless steel and plated material

Номер: US20130071688A1
Автор: Takeshi Bessho
Принадлежит: Toyota Motor Corp

The method of plating a stainless steel substrate including depositing a first plating metal layer over the stainless steel substrate), forming an interdiffusion layer in which elements of the stainless steel substrate and elements of the first plating metal layer interdiffuse, by applying a heat treatment to the stainless steel substrate coated by the first plating metal layer, and coating a second plating metal layer over the surface of the stainless steel substrate over which the interdiffusion layer is coated.

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09-05-2013 дата публикации

Method for Manufacturing Resonance Tube, Resonance Tube, and Filter

Номер: US20130113578A1
Автор: Yanzhao Zhou
Принадлежит: Huawei Technologies Co Ltd

A method for manufacturing a resonance tube includes: mixing powder materials, to form homogeneous powder particles, where the powder materials comprise iron powder with a weight proportion of 50% to 90%, at least one of copper powder and steel powder with a weight proportion of 1% to 30%, and an auxiliary material with a weight proportion of 1% to 20%; pressing and molding the powder particles, to form a resonance tube roughcast; sintering the resonance tube roughcast in a protective atmosphere, to form a resonance tube semi-finished product; and electroplating the resonance tube semi-finished product, to form the resonance tube. In the method, the resonance tube, and the filter according to embodiments of the present invention, the resonance tube is manufactured by using multiple powder materials.

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09-05-2013 дата публикации

Electrodeposited metallic coatings comprising cobalt with enhanced fatigue properties

Номер: US20130115478A1
Принадлежит: Integran Technologies Inc

Free standing articles or articles at least partially coated with substantially porosity free, fine-grained and/or amorphous Co-bearing metallic materials optionally containing solid particulates dispersed therein, are disclosed. The electrodeposited metallic layers and/or patches comprising Co provide, enhance or restore strength, wear and/or lubricity of substrates without reducing the fatigue performance compared to either uncoated or equivalent thickness chromium coated substrate. The fine-grained and/or amorphous metallic coatings comprising Co are particularly suited for articles exposed to thermal cycling, fatigue and other stresses and/or in applications requiring anti-microbial properties.

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13-06-2013 дата публикации

Three-piece resealable can for acidic liquid

Номер: US20130146594A1
Принадлежит: Individual

A three-piece resealable can for acidic liquid includes, a cylindrical can body member that includes a screw portion at one end; and a can bottom member that contacts the can body member so as to close an opening portion of the other end of the can body member. The can body member includes a cylindrical first steel sheet, Ni plating that is formed on an inner circumferential surface of the first steel sheet, a polyester film that is formed so as to be disposed on the outermost surface of the inner circumference of the can body member, and a chromate film that is formed between the first steel sheet and the polyester film. The can bottom member includes a second steel sheet, and Sn plating that is formed on the can body member side of the can bottom member.

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20-06-2013 дата публикации

Metal Surface and Process for Treating a Metal Surface

Номер: US20130153427A1
Автор: Masashige Tatebe
Принадлежит: Apple Inc

An article having a metal surface is treated to have one or more desired effects, such as desired functional properties or a desired cosmetic appearance. The surface is anodized to create an oxide layer having pores therein and a metal deposition process is performed to deposit multiple different metals within the pores. A pretreatment act, such as degreasing, chemical etching, chemical polishing, and desmutting can also be conducted on the surface prior to anodization. The surface can also be dyed, sealed, and polished.

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01-08-2013 дата публикации

High temperature resistant silver coated substrates

Номер: US20130196174A1
Принадлежит: Rohm and Haas Electronic Materials LLC

A thin film of tin is plated directly on nickel coating a metal substrate followed by plating silver directly on the thin film of tin. The silver has good adhesion to the substrate even at high temperatures.

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08-08-2013 дата публикации

Methods and Electrolytes for Electrodeposition of Smooth Films

Номер: US20130199936A1
Принадлежит: Battelle Memorial Institute Inc

Electrodeposition involving an electrolyte having a surface-smoothing additive can result in self-healing, instead of self-amplification, of initial protuberant tips that give rise to roughness and/or dendrite formation on the substrate and/or film surface. For electrodeposition of a first conductive material (C1) on a substrate from one or more reactants in an electrolyte solution, the electrolyte solution is characterized by a surface-smoothing additive containing cations of a second conductive material (C2), wherein cations of C2 have an effective electrochemical reduction potential in the solution lower than that of the reactants.

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12-09-2013 дата публикации

Copper alloy sheet with sn coating layer for a fitting type connection terminal and a fitting type connection terminal

Номер: US20130237105A1
Принадлежит: Kobe Steel Ltd

A copper alloy sheet with a Sn coating layer comprises a base material made of Cu—Ni—Si system copper alloy. Formed on the base material is a Ni coating layer having an average thickness of 0.1 to 0.8 μm. Formed on the Ni coating layer is a Cu—Sn alloy coating layer having an average thickness of 0.4 to 1.0 μm. Formed on the Cu—Sn alloy coating layer is an Sn coating layer having average thickness of 0.1 to 0.8 μm. A material surface is subject to reflow treatment and has arithmetic mean roughness Ra of 0.03 μm or more and less than 0.15 μm in both a direction parallel to the rolling direction and a direction perpendicular to the rolling direction. An exposure rate of the Cu—Sn alloy coating layer to the material surface is 10 to 50%. A fitting type connection terminal requiring low insertion force can be obtained at a low cost.

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19-09-2013 дата публикации

Fuel cell separator material, and fuel cell stack using the same

Номер: US20130244129A1

Provided are: a separator material for a fuel cell, in which a uniform first Au-plated layer having a thickness of 0.5 - 4 nm is formed on one surface of a metal thin plate and a uniform second Au-plated layer having a larger thickness than that of the first Au-plated layer is formed on the other surface of the metal base material, wherein the covering rate of each of the cross-sections of the first Au-plated layer and the second Au-plated layer is 80% or more as observed on a transmission electron microscope, and which can have excellent corrosion resistance even when the thicknesses of the Au-plated layers formed on the surface of the base material are small, and can be produced at reduced cost; and a separator for a fuel cell and a fuel cell stack, each of which is produced using the separator material.

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16-01-2014 дата публикации

Lithium-ion secondary battery, electrode for the secondary battery, and electrolytic copper foil for electrode for the secondary battery

Номер: US20140017564A1
Принадлежит: Furukawa Electric Co Ltd

To provide an electrolytic copper foil for a negative electrode for a lithium-ion secondary battery with which it is possible to produce a long-life lithium-ion secondary battery in which there is no decline in the capacity retention ratio even when the charge-discharge cycling is repeated, that has long life, and no deformation of a negative electrode current collector occurs. The electrolytic copper foil constituting the negative electrode current collector for the lithium-ion secondary battery has, after heat treatment at from 200 to 400° C., a 0.2% proof stress of 250N/mm 2 or more, and elongation of 2.5% or more; and the surface on which an active material layer of the electrolytic copper foil is provided has been rust-proofed, or roughened and rust-proofed. As a result of analysis of the depth profile (depth direction) obtained by performing secondary ion mass spectrometry (SIMS) in the thickness direction of the copper foil, the copper foil including: chlorine (Cl), carbon (C), and oxygen (O) each in a concentration of 10 17 to 5×10 20 atoms/cm 3 , and sulfur (S) and nitrogen (N) each in a concentration of 10 15 to 10 19 atoms/cm 3 .

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23-01-2014 дата публикации

Surface-treated steel sheet and method of manufacturing the same

Номер: US20140023879A1
Принадлежит: Individual

A surface-treated steel sheet includes: a steel sheet; and a coated layer which is formed on one surface or both surfaces of the steel sheet and includes zinc and vanadium, wherein the coated layer has a vanadium content of 1% or higher and 20% or less and a coating weight of 3 g/m 2 or higher and 40 g/m 2 or less, and has a plurality of dendritic arms that are grown in a thickness direction of the steel sheet, and a ratio x/y of a content x of vanadium that is present outside the arms to a content y of vanadium that is present inside the arms is 1.1 or higher and 3.0 or less in terms of vanadium element.

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06-03-2014 дата публикации

Methods for the implementation of nanocrystalline and amorphous metals and alloys as coatings

Номер: US20140061056A1
Принадлежит: Xtalic Corp

Methods for the use of nanocrystalline or amorphous metals or alloys as coatings with industrial processes are provided. Three, specific, such methods have been detailed. One of the preferred embodiments provides a method for the high volume electrodeposition of many components with a nanocrystalline or amorphous metal or alloy, and the components produced thereby. Another preferred embodiment provides a method for application of a nanocrystalline or amorphous coatings in a continuous electrodeposition process and the product produced thereby. Another of the preferred embodiments of the present invention provides a method for reworking and/or rebuilding components and the components produced thereby.

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20-03-2014 дата публикации

Tribologically Loadable Mixed Noble Metal/Metal Layers

Номер: US20140076798A1
Автор: Stefan Koppe
Принадлежит: Schauenburg Ruhrkunststoff GmbH

The invention relates to a method for producing a noble metal/metal layer, which has particularly advantageous tribological properties, comprising the following steps: providing a bath for the currentless deposition of a metal layer, which additionally contains at least one type of noble metal ions; introducing a substrate into the bath; and applying a voltage.

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03-04-2014 дата публикации

Edgeless pulse plating and metal cleaning methods for solar cells

Номер: US20140090982A1
Автор: Joseph Behnke
Принадлежит: Individual

A method for plating metal to a solar cell is disclosed. The method includes plating a metal layer only on the surface of solar cell without plating metal along the solar cell edges by conducting a first current in a first direction in an electroplating bath, ejecting metal from the metal layer by conducting a second current in a second direction and plating additional metal to the metal layer by conducting a third current in the first direction. The first, second and third current can be alternated. Subsequent to an electroplating process, an ultrasonic cleaning process is performed on the solar cell to remove any excess plated metal along the surface and edges of the solar cell.

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14-01-2021 дата публикации

METHOD OF MANUFACTURING MULTIPLE-COLOR PLATING MEMBER AND MULTIPLE-COLOR PLATING MEMBER MANUFACTURED USING THE SAME

Номер: US20210010144A1
Принадлежит:

A method of manufacturing a multiple-color plating member includes forming a copper plating layer on at least a part of a surface of a substrate, forming a nickel plating layer on a surface of the copper plating layer, forming a chromium plating layer on a surface of the nickel plating layer, applying a color coating agent onto a surface of the chromium plating layer and then drying the applied color coating agent to form a color coating layer, and applying a clear coating agent onto a surface of the color coating layer and photocuring the applied clear coating agent to form a clear layer. The color coating agent includes 10 to 35% by weight of a modified acrylic resin, 1 to 25% by weight of a pigment, and 40 to 80% by weight of a first solvent. The clear coating agent includes 10 to 30% by weight of a polyester-modified acrylic resin, 5 to 25% by weight of an acrylic oligomer, 5 to 45% by weight of an acrylic monomer, 1 to 15% by weight of a photoinitiator, and 10 to 75% by weight of a second solvent. 1. A method of manufacturing a multiple-color plating member comprising:forming a copper plating layer on at least a part of a surface of a substrate;forming a nickel plating layer on a surface of the copper plating layer;forming a chromium plating layer on a surface of the nickel plating layer;applying a color coating agent onto a surface of the chromium plating layer and then drying the applied color coating agent to form a color coating layer; andapplying a clear coating agent onto a surface of the color coating layer and photocuring the applied clear coating agent to form a clear layer,wherein the color coating agent comprises:10 to 35% by weight of a modified acrylic resin;1 to 25% by weight of a pigment; and40 to 80% by weight of a first solvent, andwherein the clear coating agent comprises:10 to 30% by weight of a polyester-modified acrylic resin;5 to 25% by weight of an acrylic oligomer;5 to 45% by weight of an acrylic monomer;1 to 15% by weight of a ...

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10-01-2019 дата публикации

Optically Transparent Films for Measuring Optically Thick Fluids

Номер: US20190011360A1
Автор: David L. Perkins
Принадлежит: Halliburton Energy Services Inc

A multilayered film for performing spectroscopic measurements in a fluid are provided. The multilayered film includes a substrate; a porous layer adjacent to the substrate; and a reflective layer formed on the porous layer, wherein the porous layer selectively allows a component of a fluid to be optically measured when the multilayered film is immersed in the fluid. A sensor for spectroscopic measurements in crude oil samples including a multilayered film as above is also provided. A method of manufacturing a multilayered film for spectroscopic measurements in fluids as above is also provided.

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15-01-2015 дата публикации

Plated instrumentation probes and sensors

Номер: US20150013480A1
Принадлежит: United Technologies Corp

A component comprises a non-metallic core having an outer surface, a first catalyst deposited onto at least a first portion of the outer surface of the non-metallic core, a second catalyst deposited onto at least a second portion of the outer surface of the non-metallic core, an electrical interface, and a metallic coating. The electrical interface is plated onto the first catalyst, and includes a first interface layer electroless plated onto the first catalyst. The metallic coating is plated onto the second catalyst.

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18-01-2018 дата публикации

Low stress property modulated materials and methods of their preparation

Номер: US20180016694A1
Автор: Zhi Liang Bao
Принадлежит: Modumetal Inc

The technology described herein sets forth methods of making low stress or stress free coatings and articles using electrodeposition without the use of stress reducing agents in the deposition process. The articles and coatings can be layered or nanolayered wherein in the microstructure/nanostructure and composition of individual layers can be independently modulated.

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10-02-2022 дата публикации

Electro-Formed Metal Foils

Номер: US20220045260A1
Принадлежит:

A process for producing a cube textured foil is described. The process includes providing a cube textured metal foil M. The process further includes electroplating an epitaxial layer of an alloy on the foil M, whereby the epitaxial layer substantially replicates the cube texture of the metal foil M. The process further includes electroplating a non-epitaxial layer of an alloy on the epitaxial layer. The process further includes separating the electroplated alloy from the cube textured metal foil M to obtain an electro-formed alloy with one cube textured surface. 1. A process for producing a cube textured foil , comprising:providing a cube textured metal foil M; andelectroplating an epitaxial layer of an alloy on the foil M, whereby the epitaxial layer substantially replicates the cube texture of the metal foil M.2. The process of wherein the epitaxial alloy layer comprises Ni(1-X-Y)BXCY and wherein B and C are elements selected from the group consisting of W claim 1 , Mo claim 1 , and Cr; and wherein X is 0.02-0.14 and Y is 0-0.14 claim 1 , in atomic fractions.3. The process of claim 2 , further comprising electroplating at least one non-epitaxial layer of Ni(1-X-Y)BXCY on the epitaxial layer.4. The process of claim 3 , wherein the non-epitaxial layer has a random texture or a fiber texture or mixture thereof.5. The process of claim 3 , wherein electroplating comprises transporting the cube textured metal foil M through a first electroplating bath having a first solution comprising one or more of the elements to form Ni(1-X-Y)BXCy wherein the cube textured metal foil M is configured to operate as a cathode in the first electroplating bath to cause the first solution to be electroplated as the epitaxial layer on the cube textured metal foil M.6. The process of claim 5 , wherein electroplating comprises transporting the cube textured metal foil M having the epitaxial Ni(1-X-Y)BXCy layer deposited thereon through a second electroplating bath having a second solution ...

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04-02-2016 дата публикации

Plating film, method of manufacturing plating film, and plated product

Номер: US20160032478A1
Автор: Noriyuki Saito
Принадлежит: Sony Corp

There are provided a plating film having high durability and high reliability, a method of manufacturing the plating film, and a plated product using the plating film. The plating film according to the disclosure is formed with use of a solvent in which a metallic salt is dissolved and a compound having functionality is dissolved or colloidally dispersed, and the metal and the compound having the functionality are homogenously dispersed and joined.

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08-02-2018 дата публикации

Controlled grain size structures

Номер: US20180037019A1
Принадлежит: Hamilton Sundstrand Corp

A structure includes a first substrate and a variable grain layer disposed on or formed into the first substrate. The variable grain layer includes a first grain portion having a first grain size and second grain portion having a second grain size. The first grain size is smaller than the second grain size.

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31-01-2019 дата публикации

Method for manufacturing all-solid-state thin-film batteries

Номер: US20190036152A1
Принадлежит: I Ten SA

Process for fabrication of all-solid-state thin film batteries, said batteries comprising a film of anode materials, a film of solid electrolyte materials and a film of cathode materials, in which: each of these three films is deposited using an electrophoresis process, the anode film and the cathode film are each deposited on a conducting substrate, preferably a thin metal sheet or band, or a metalized insulating sheet or band or film, said conducting substrates or their conducting elements being useable as battery current collectors, the electrolyte film is deposited on the anode and/or cathode film, and in which said process also comprises at least one step in which said sheets or bands are stacked so as to form at least one battery with a “collector/anode/electrolyte/cathode/collector” type of stacked structure.

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08-02-2018 дата публикации

Transparent electrode, method for manufacturing same, and organic electroluminescent element

Номер: US20180040846A1
Принадлежит: KONICA MINOLTA INC

The present invention addresses the problem of providing a transparent electrode having a low resistance and high storage stability, a method for manufacturing the transparent electrode, and an organic electroluminescent element. This transparent electrode wherein a metal conductive layer is provided on a substrate is characterized in that: the metal conductive layer has a metal fine line, and a plating layer covering the metal fine line; the transparent electrode has a transparent conductive layer on a substrate surface on the side on which the metal fine line is formed, said transparent conductive layer covering the substrate and the metal conductive layer; and the metal fine line is formed using a metal nano-particle ink or a metal complex ink.

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03-03-2022 дата публикации

Compositions and Methods for the Electrodeposition of Nanotwinned Copper

Номер: US20220064812A1
Принадлежит:

A copper electroplating solution comprising a copper salt, a source of halide ions, and a linear or branched polyhydroxyl. The copper electroplating solution is used to deposit copper having a high density of nanotwinned columnar copper grains on a substrate. The linear or branched polyhydroxyl may comprise a reaction product between 2,3-epoxy-1-propanol and aminic alcohol or ammonium alcohol.

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08-05-2014 дата публикации

Substrate with a corrosion resistant coating and method of production thereof

Номер: US20140127532A1
Принадлежит: Coventya SpA

The invention relates to a substrate with a corrosion resistant coating comprising at least one nickel layer and at least one chromium layer as finish. Between these layers, at least one tin-nickel alloy layer is deposited for suppression of corrosion reactions determined by CASS and Russian mud tests. The invention relates also to a method for producing such substrates with corrosion resistant coating.

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25-02-2016 дата публикации

Method of forming a composite material and apparatus for forming a composite material

Номер: US20160053397A1
Принадлежит: INFINEON TECHNOLOGIES AG

A method of forming a composite material is provided. The method may include: arranging a suspension in physical contact with a carrier, wherein the suspension may comprise an electrolyte and a plurality of particles of a first component of the composite material; causing the particles of the first component of the composite material to sediment on the carrier, wherein a plurality of spaces may be formed between the sedimented particles; and forming by electroplating a second component of the composite material from the electrolyte in at least a fraction of the plurality of spaces.

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25-02-2021 дата публикации

Multicorrosion Protection System for Decorative Parts with Chrome Finish

Номер: US20210054520A1
Принадлежит: Enthone GmbH, MacDermid Enthone Inc

The invention relates to a corrosion protection layer system for metal surfaces, said layer system comprising as the two top most layers: a) a discontinuous nickel-phosphorus layer and b) a chromium layer plated from a trivalent chromium electrolyte solution, as well as to a method of producing such a layer system. The inventive layer system is capable to combine the good corrosion resistance of the nickel-phosphorus layer against sodium chloride with the protective power of the chromium layer from the trivalent plating process against magnesium and calcium salts, especially without the need for any post-treatment.

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13-02-2020 дата публикации

Silver-plated product and method for producing same

Номер: US20200048785A1
Принадлежит: Dowa Metaltech Co Ltd

A silver-plated product is produced by forming a surface layer of silver on a base material by electroplating at a liquid temperature of 10 to 35° C. and a current density of 3 to 15 A/dm 2 in a silver plating solution so as to satisfy (32.6x−300)≤y≤(32.6x+200) assuming that a product of a concentration of potassium cyanide in the silver plating solution and a current density is y (g·A/L·dm 2 ) and that a liquid temperature of the silver plating solution is x (° C.), the silver plating solution containing 80 to 110 g/L of silver, 70 to 160 g/L of potassium cyanide and 55 to 70 mg/L of selenium.

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22-02-2018 дата публикации

Plating solution using sulfonium salt

Номер: US20180051384A1
Принадлежит: Mitsubishi Materials Corp

A plating solution including a soluble salt containing at least a stannous salt; an acid selected from organic acid and inorganic acid or a salt thereof; and an additive containing sulfonium salt with one or more of aromatic rings is provided.

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10-03-2022 дата публикации

IRON TUNGSTEN COATING FORMULATIONS AND PROCESSES

Номер: US20220074066A1
Принадлежит:

An electrolyte solution for iron-tungsten plating is prepared by dissolving in an aqueous medium a divalent iron salt (e.g., iron (II) sulfate) and an alkali metal citrate (e.g., sodium citrate, potassium citrate, or other alkali metal citrate) to form a first solution, dissolving in the first solution a tungstate salt (e.g., sodium tungstate, potassium tungstate, or other potassium tungstate) to form a second solution, and dissolving in the second solution a citric acid to form the electrolyte solution. An iron-tungsten coating is formed on a substrate using the electrolyte solution by passing a current between a cathode and an anode through the electrolyte solution to deposit iron and tungsten on the substrate. 1. An electrolyte solution , consisting of:an aqueous medium;a divalent iron salt in an amount ranging from about 0.05 to about 0.5 mol per liter of the electrolyte solution;an alkali metal citrate in an amount ranging from about 0.05 to about 2 mol per liter of the electrolyte solution;a tungstate salt in an amount ranging from about 0.1 to about 1.5 mol per liter of the electrolyte solution;citric acid in an amount ranging from about 0.01 to about 1 mol per liter of the electrolyte solution; andsodium hydroxide, potassium hydroxide, sulfuric acid, or a combination thereof, wherein the electrolyte solution has a pH of about 3 to about 12.2. The electrolyte solution of claim 1 , wherein the divalent iron salt comprises iron (II) sulfate claim 1 , iron (II) halide claim 1 , iron (II) nitrate claim 1 , iron (II) acetate claim 1 , or iron (II) perchlorate.3. The electrolyte solution of claim 1 , wherein the alkali metal citrate comprises sodium citrate or potassium citrate.4. The electrolyte solution of claim 1 , wherein the tungstate salt comprises sodium tungstate or potassium tungstate.5. The electrolyte solution of claim 1 , wherein the citric acid comprises anhydrous citric acid or citric acid monohydrate.6. The electrolyte solution of claim 1 , wherein ...

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22-05-2014 дата публикации

Method for electrodepositing copper nanoparticles

Номер: US20140138251A1
Принадлежит: National Chung Hsing University

A method for electrodepositing copper nanoparticles includes the steps of a) providing a reaction system having an electrolyte solution, a conductive nitride film used as a working electrode and immersed in the electrolyte solution, a copper metal or a copper alloy used as an auxiliary electrode and immersed in the electrolyte solution, and a reference electrode immersed in the electrolyte solution; and b) applying a pulse voltage to the reaction system to form copper nanoparticles on a surface of the conductive nitride film.

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27-02-2020 дата публикации

Muting glucose sensor oxygen response and reducing electrode edge growth with pulsed current plating

Номер: US20200060586A1
Принадлежит: Medtronic Minimed Inc

The invention disclosed herein includes amperometric glucose sensors having electrodes formed from processes that electrodeposit platinum black in a manner that produces relatively smooth three dimensional metal architectures, ones that contribute to sensor reliability and stability. Embodiments of the invention provide analyte sensors having such uniform electrode architectures as well as methods for making and using these sensor electrodes. A number of working embodiments of the invention are shown to be useful in amperometric glucose sensors worn by diabetic individuals.

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12-03-2015 дата публикации

Copper foil structure having blackened ultra-thin foil and manufacturing method thereof

Номер: US20150068912A1
Принадлежит: Nan Ya Plastics Corp

A copper foil structure having blackened ultra-thin copper foil of the instant disclosure includes a carrier foil, a blackened layer, a release layer, and an ultra-thin copper foil. The carrier foil includes a matte surface and a shiny surface wherein the blackened layer is disposed thereon. The release layer is disposed on the blackened layer formed with one selected from the group: copper, cobalt, nickel, and manganese while the release layer is formed with one selected from the group: molybdenum, nickel, chromium, and potassium. Successively, the ultra-thin copper foil is disposed on the release layer. Laser drilling can apply to the blackened ultra-thin copper foil on the inner layers of a high density multi-layer printed wiring board, thus eliminating the traditional blackening or browning chemical process. The blackened ultra-thin copper foil in combination with a polyimide thin (PI) or other substrate materials displays desirable appearance.

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24-03-2022 дата публикации

Semiconductor material based on metal nanowires and porous nitride and preparation method thereof

Номер: US20220088579A1
Принадлежит: Institute of Semiconductors of CAS

Provided are a semiconductor material based on metal nanowires and a porous nitride, and a preparation method thereof. The semiconductor material includes: a substrate; a buffer layer formed on the substrate; and a composite material layer formed on the buffer layer the composite material layer includes: a transverse porous nitride template layer; and a plurality of metal nanowires filled in pores of the transverse porous nitride template layer.

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17-03-2016 дата публикации

Leveling additives for electrodeposition

Номер: US20160076161A1
Принадлежит: Xtalic Corp

Leveling additives, their use in electrodeposition, and regeneration are described. In one embodiment, an electrodeposition bath may include a non-aqueous liquid and an optionally substituted aromatic hydrocarbon. The optionally substituted aromatic hydrocarbon may be protonated.

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24-03-2022 дата публикации

An object comprising a chromium-based coating on a substrate

Номер: US20220090286A1
Автор: Jussi Raisa
Принадлежит: Savroc Ltd

An object including a chromium-based coating on a substrate and a method for its production are disclosed. The chromium-based coating having a first layer on the substrate, wherein the first layer has a top surface on the opposite side to the substrate and includes fissures within the first layer, and wherein the material of the first layer is predominantly formed of chromium and chromium carbide; the chromium-based coating further having a second layer on the first layer, the second layer at least partially filling the fissures in the first layer and at least partially covers the top surface of the first layer, wherein the material of the second layer is selected from a group consisting of: chromium oxide, carbon, and a combination of chromium oxide and carbon.

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25-03-2021 дата публикации

Device for manufacturing hybrid metal foams

Номер: US20210087700A1
Принадлежит: Apollo Energy Systems Inc

A method of electroplating a metal foam includes placing a metal foam to be plated into an electroplating chamber with a plating material source, circulating an electrolyte through the chamber to carry metal ions from the plating material source, the circulating being selected and controlled to produce an even coating of plating material on surfaces of the metal foam.

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25-03-2021 дата публикации

PLATING FILM

Номер: US20210087702A1
Принадлежит: Daicel Corporation

Provided is a plating film that can exhibit a high gloss and a low contact resistance value. The plating film according to an embodiment of the present invention is a plating film including a noble metal matrix and nanodiamond particles dispersed in the noble metal matrix. The plating film according to an embodiment of the present invention preferably has a gloss at an incident angle of 60° of not less than 250 GU and/or a contact resistance value at a load of 50 gf of not greater than 1 mΩ, and a difference between a contact resistance value at a load of 50 gf and a contact resistance value at a load of 5 gf of not greater than 5 mΩ. The nanodiamond particles are preferably nanodiamond particles including a surface-modifying group containing a sterically repulsive group and particularly preferably nanodiamond particles including a surface-modifying group containing a polyglycerol chain. 1. A plating film comprising a noble metal matrix and nanodiamond particles dispersed in the noble metal matrix.2. The plating film according to claim 1 , wherein the plating film has a gloss at an incident angle of 60° of not less than 250 GU.3. The plating film according to claim 1 , wherein the plating film is produced using a plating bath comprising noble metal ions and nanodiamond particles.4. The plating film according to claim 3 , wherein the plating film has a gloss at an incident angle of 60° by not less than 20 GU compared with a plating film produced using a plating bath having an identical composition except for not containing nanodiamond particles.5. The plating film according to claim 1 , wherein the plating film has a contact resistance value at a load of 50 gf of not greater than 1 mΩ claim 1 , and a difference between a contact resistance value at a load of 50 gf and a contact resistance value at a load of 5 gf of not greater than 5 mΩ.6. The plating film according to claim 1 , wherein the plating film has a surface roughness (Ra) of not greater than 0.5 μm.7. The ...

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29-03-2018 дата публикации

Electrical connector electroplating process

Номер: US20180087171A1
Принадлежит: Dongguan CCP Contact Probes Co Ltd

An electrical connector electroplating process includes: performing a pre-treatment of an electrical connector to remove grease; performing an activation treatment of the electrical connector to activate an oxide film on a surface of the electrical connector; plating a layer of bottom coating on the surface of the electrical connector; plating a layer of silver film coating on a surface of the bottom coating; plating a layer of gold film coating on a surface of the silver film coating; plating a layer of platinum or rhodium film coating on a surface of the gold film coating; performing a post-treatment including surface pore sealing, water washing, and baking/drying of a surface of the platinum or rhodium film coating.

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05-05-2022 дата публикации

PLATED PRODUCT AND METHOD FOR PRODUCING SAME

Номер: US20220136122A1
Принадлежит: DOWA METALTECH CO., LTD.

There is provided an inexpensive plated product, which can prevent the increase of the contact resistance of a silver-plating film and the change of the color of the surface thereof after reflow-treating a plated product wherein the silver-plating film is formed on a portion of the surface thereof and wherein a tin-plating film is formed on a portion of the other portion of the surface thereof, and a method for producing the same. The plated product is produced by a method including the steps of: forming a nickel-plating film on a surface of a base material of copper or a copper alloy; forming a silver-plating film on a portion of a surface of the nickel-plating film and forming a tin-plating film on a portion of the other portion of the surface of the nickel-plating film to prepare a plated product which has the silver-plating film and the tin-plating film on the surface of the nickel-plating film formed on the base material and irradiating the surface of the plated product with infrared rays to heat the surface thereof to reflow-treat the tin-plating film to cause the tin-plating film to be a reflowed tin-plating layer

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05-05-2022 дата публикации

Cobalt chemistry for smooth topology

Номер: US20220136123A1
Принадлежит: MacDermid Enthone Inc

An electroplated cobalt deposit and a method of electrodepositing cobalt on a surface to produce a level deposit across the surface of the substrate. The cobalt electrolyte contains (1) a source of cobalt ions; (2) boric acid; (3) a pH adjuster; and (4) an organic additive, which contains a suppressor. The electroplated cobalt deposit exhibits a level surface such that the thickness difference across substantially the entire surface of the substrate of less than about 200 nm.

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19-03-2020 дата публикации

Micro-roughened electrodeposited copper foil and copper foil substrate

Номер: US20200087811A1
Принадлежит: Co Tech Development Corp

A micro-roughened electrodeposited copper foil and a copper foil substrate are provided. The micro-roughened electrodeposited copper foil includes a micro-rough surface. The micro-rough surface has a plurality of peaks, a plurality of V-shaped grooves and a plurality of micro-crystal clusters. Each of the V-shaped grooves is defined by adjacent two of the peaks and has an average depth less than 1 μm. The micro-crystal clusters are correspondingly located on the tops of the peaks and each thereof has an average height less than 1.5 μm. The micro-rough surface of the micro-roughened electrodeposited copper foil has an Rlr value less than 1.06.

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19-03-2020 дата публикации

Electrochemical methods, devices and compositions

Номер: US20200087812A1
Принадлежит: Iontra Inc

The disclosure provides a method comprising inducing a first current between a source of a countercharge and a first electrode, the first current being through an electrolyte. In some instances, the first current is not present. A second current, in the form of waveform, is induced across the first electrode, the second current being transverse to the first current, and the second current inducing a relativistic charge across the first electrode. Metal from the electrolyte is deposited on the substrate or corroded from the substrate, among other things. The methods, as well as associated apparatus, improve deposition, bonding, corrosion, and other effects.

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12-04-2018 дата публикации

Metallic Coating With Macro-Pores

Номер: US20180100241A1
Принадлежит: SIEMENS AG

The present disclosure relates to coatings. For example, some embodiments may include methods for producing a coating comprising: depositing a metallic matrix on a substrate by electrochemical deposition using a deposition bath including carbon comprising particles and oxide particles dispersed therein; wherein the carbon comprising particles are embedded into the metallic matrix and pores are distributed in the coating; wherein at least 80% of the pores have a pore diameter in a range from 3 to 30 μm; wherein oxide particles are incorporated into and fixed in the pores during deposition and the oxide particles remain partially uncoated by the material of the metallic matrix.

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26-03-2020 дата публикации

Electroplating Method and Device

Номер: US20200095700A1
Принадлежит: YKK Corp

A method includes: agitating base members that has been immersed in an electrolytic solution inside of an electroplating tank so as to flow in a circumference direction along an inner wall of the electroplating tank; and electroplating the base members flowing along the circumference direction in the electrolytic solution inside of the electroplating tank. The flow of the base members along the circumference direction is caused by a flow of magnetic media along the circumference direction in the electrolytic solution inside of the electroplating tank or is caused by rotation of an agitation unit provided at a bottom side of the electroplating tank. At least one of the base members touches a bottom cathode, and a base member positioned upward relative to the base member touching the bottom cathode is electrically connected to the bottom cathode via at least the base member touching the bottom cathode.

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03-07-2014 дата публикации

Heat dissipating component for semiconductor element

Номер: US20140182824A1
Принадлежит: Denki Kagaku Kogyo KK

Disclosed is a heat dissipating component for a semiconductor element, having a tabular body 0.4-6 mm in thickness containing 40-70 volume % of diamond particles, with the balance comprising metal of which the principal component is aluminum, and coated on both surfaces by a coating layer comprising metal of which the principal component is aluminum, or an aluminum-ceramic based composite material, to form an aluminum-diamond based composite body. On at least the two major surfaces thereof are formed, in order from the major surface side, (1) an amorphous Ni alloy layer 0.1-1 μm in film thickness, (2) an Ni layer 1-5 μm in film thickness, and (3) an Au layer 0.05-4 μm in film thickness, the ratio of the Ni alloy layer and the Ni layer (Ni alloy layer thickness/Ni layer thickness) being 0.3 or less.

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04-04-2019 дата публикации

Copper Electroplating Solution and Copper Electroplating Process

Номер: US20190100848A1

The present disclosure relates to a copper electroplating solution and a copper electroplating process. The solution includes following components: 20 to 240 g/L of copper sulfate pentahydrate, 20 to 300 g/L of sulfuric acid, 25 to 120 mg/L of chlorine ion, 0.1 to 20 mg/L of a brightener, 1 to 2000 mg/L of an inhibitor, and the balance is deionized water; The brightener is selected from two of the group consisting of alkyl sulfonic acid thiols and derivatives thereof; the inhibitor is selected from one or more compounds of non-ionic surfactants. The solution of this disclosure can greatly improve the current density of plating and the throwing power (TP) of electroplating of the through hole of flexible boards, wherein the TP value can reach more than 200%, and the electroplating deposited copper layer in the hole is flat and the quality thereof meets the requirements of the flexible board.

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17-07-2014 дата публикации

Void-Free Metallic Filled High Aspect Ratio Openings

Номер: US20140197537A1
Автор: Uri Cohen
Принадлежит: Individual

One embodiment is a device which includes at least one filled via or trench wherein the at least one filled via or trench includes void-free filled metal or alloy, and the filled via or trench has an aspect ratio in a range from 9:1 to about 28:1.

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18-04-2019 дата публикации

Plating apparatus and plating method

Номер: US20190112728A1
Автор: Takao Hosokawa
Принадлежит: Murata Manufacturing Co Ltd

A plating apparatus includes a plating tank and a plating unit that performs electrolytic plating on an object. The plating unit includes a workpiece passage region including a partition wall that allows passage of the plating solution but does not allow passage of the object, the workpiece passage region passing the object from above toward below, an injection unit that injects the plating solution from below toward above, a mixing unit that mixes the plating solution injected by the injection unit and the object to be plated passing through the workpiece passage region, an anode outside the workpiece passage region, a cathode inside the workpiece passage region including a hollow region through which a mixed fluid of the plating solution and the object to be plated passes from below toward above, and a guidance unit that guides the mixed fluid to the workpiece passage region.

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09-04-2020 дата публикации

2-shot molded article with multiple electrical current pathways

Номер: US20200109482A1
Автор: Michael Lavallee
Принадлежит: Lacks Enterprises Inc

A molded article includes a first plateable region spaced apart from a second plateable region the first plateable region by a barrier of electrically insulating material. Each of the plateable regions include an associated plateable layer of electrically conductive material for being electroplated with a different plateable finish. Several different geometries and configurations of the barrier and/or the plateable regions are provided to prevent migration of plating material from one of the plateable regions acting as bipolar electrode while another one of the plateable regions is being electroplated. A non-plateable insert may be disposed between the plateable regions to prevent migration of plating material from one of the plateable regions onto the other one of the plateable regions. A conducive robber in electrical communication with one of the one of the plateable regions, and which may be removable, may also be used to prevent migration of plating material.

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27-05-2021 дата публикации

CRYSTAL GRAIN SIZE REDUCTION METHOD FOR PLATING FILM

Номер: US20210156044A1
Автор: TAKAGI MIKIHARU
Принадлежит:

In a crystal grain size reduction method for a plating film, electroplating is performed in a condition where ions of a plating metal, a nanocarbon, and an anion based surfactant as a dispersion agent for dispersing the nanocarbon have been blended in a plating solution. 1. A crystal grain size reduction method for a plating film comprising:performing electroplating in a condition where ions of a plating metal, a nanocarbon, and an anion based surfactant as a dispersion agent for dispersing the nanocarbon have been blended in a plating solution.2. The crystal grain size reduction method for the plating film according to claim 1 , wherein the nanocarbon is positively charged when in the blended state with the plating solution.3. The crystal grain size reduction method for the plating film according to claim 1 , wherein the plating metal is one of silver claim 1 , nickel claim 1 , tin claim 1 , or gold.4. The crystal grain size reduction method for the plating film according to claim 2 , wherein the plating metal is one of silver claim 2 , nickel claim 2 , tin claim 2 , or gold. The present invention relates to a method for forming reduced-size crystal grains of a plating film.Composite plating in which small particles have been eutectically deposited in a plating metal film has been known. For example, Japanese Patent Application Publication No. 2008-214667 mentions a zinc-nanocarbon composite plating. In the above composite plating, a zinc plating film is formed on a plating object by using a zinc plating solution into which nanocarbon, and polyacrylamide as a dispersion agent for the nanocarbon, have been added.Japanese Patent Application Publication No. 2008-214667 also mentions that it is preferable that nanocarbon be present in the zinc plating film and that the amount of nanocarbon added into the zinc plating solution be 0.5 to 5.0 g/L. Furthermore, Japanese Patent Application Publication No. 2008-214667 indicates that because part of the nanocarbon is exposed ...

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27-05-2021 дата публикации

TERMINAL MATERIAL WITH SILVER COATING FILM AND TERMINAL WITH SILVER COATING FILM

Номер: US20210158990A1
Принадлежит:

In a terminal material with a silver coating film including a silver layer on a surface, a terminal and a terminal material having high reliability are easily manufactured with low cost without a heat treatment. A base material formed of copper or a copper alloy; and nickel layer, an intermediate layer, and a silver layer laminated on the base material in this order are included, the nickel layer has a thickness of 0.05 μm to 5.00 μm and is formed of nickel or a nickel alloy, the intermediate layer has a thickness of 0.02 μm to 1.00 μm and is an alloy layer containing silver (Ag) and a substance X, and the substance X includes one or more kinds of tin, bismuth, gallium, indium, and germanium. 1. A terminal material with a silver coating film , comprising:a base material formed of copper or a copper alloy; anda nickel layer, an intermediate layer, and a silver layer laminated on the base material in this order,wherein the nickel layer has a thickness of 0.05 μm to 5.00 μm and is formed of nickel or a nickel alloy,the intermediate layer has a thickness of 0.02 μm to 1.00 μm and is an alloy layer containing silver and a substance X, andthe substance X includes one or more kinds of tin, bismuth, gallium, indium, and germanium.2. The terminal material with a silver coating film according to claim 1 ,wherein the intermediate layer has a two-layer structure of a first layer containing the substance X as a main component and a second layer containing silver as a main component.3. The terminal material with a silver coating film according to claim 1 ,wherein the nickel layer contains any one or more of phosphorus, boron, tungsten, sulfur, zinc, and tin in a total content of 1 at % to 40 at %.4. The terminal material with a silver coating film according to claim 3 ,wherein the nickel layer has a structure containing an amorphous material.5. A terminal with a silver coating film formed of the terminal material with a silver coating film according to .6. The terminal material ...

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21-05-2015 дата публикации

Optical device and manufacture thereof

Номер: US20150140271A1
Принадлежит: Sino American Silicon Products Inc

The invention provides an optical device and manufacture thereof. The optical device of the invention includes a transparent substrate, a seeding layer, a plurality of nano-rods and a protection layer. The seeding layer is formed to overlay an entrance surface and an exit surface of the transparent substrate. The plurality of nano-rods are formed on the seeding layer. The protection layer is formed to completely overlay the plurality of nano-rods.

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02-05-2019 дата публикации

Electroplating repair machine for tack expansion and seal welding region, electroplating repair system, and operating method

Номер: US20190128467A1

Disclosed are an electroplating repair apparatus, an electroplating repair system having the same, and an operating system thereof. The apparatus includes a probe body extending a predefined length in a structure corresponding to an inner diameter part of a tube, an electroplating electrode attached to and surrounding an outer circumferential surface of the probe body, a sealing member attached to opposite end sides of the probe body to seal a target portion to be electroplated, and a solution supply line supplying a solution to the target portion through the inside of the probe body, wherein the apparatus has a structure capable of wholly repairing the inside of the tube including a sealing welding part and an expanded part.

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19-05-2016 дата публикации

Method for manufacturing chromium-chromium oxide coated substrates

Номер: US20160138178A1
Принадлежит: TATA STEEL IJMUIDEN BV

A method for manufacturing a chromium metal-chromium oxide coated substrate by electrolytically depositing the chromium metal-chromium oxide coating on an electrically conductive substrate from an electrolyte solution that includes a trivalent chromium compound and a chelating agent, wherein the electrolyte solution is free of chloride ions and of a boric acid buffering agent, the electrically conductive substrate acts as a cathode and an anode including a catalytic coating of iridium oxide or a mixed metal oxide is chosen for reducing or eliminating the oxidation of Cr(III)-ions to Cr(VI)-ions.

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03-06-2021 дата публикации

Semiconductor dies having ultra-thin wafer backmetal systems, microelectronic devices containing the same, and associated fabrication methods

Номер: US20210167033A1
Принадлежит: NXP USA Inc

Semiconductor dies including ultra-thin wafer backmetal systems, microelectronic devices containing such semiconductor dies, and associated fabrication methods are disclosed. In one embodiment, a method for processing a device wafer includes obtaining a device wafer having a wafer frontside and a wafer backside opposite the wafer frontside. A wafer-level gold-based ohmic bond layer, which has a first average grain size and which is predominately composed of gold, by weight, is sputter deposited onto the wafer backside. An electroplating process is utilized to deposit a wafer-level silicon ingress-resistant plated layer over the wafer-level Au-based ohmic bond layer, while imparting the plated layer with a second average grain size exceeding the first average grain size. The device wafer is singulated to separate the device wafer into a plurality of semiconductor die each having a die frontside, an Au-based ohmic bond layer, and a silicon ingress-resistant plated layer.

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08-09-2022 дата публикации

ROUGHENED NICKEL-PLATED MATERIAL AND METHOD FOR MANUFACTURING SAME

Номер: US20220282388A1
Принадлежит:

[Object] 1. A roughened nickel-plated material comprising:a base material that is a metal; anda roughened nickel plated layer formed on at least one surface of the base material,wherein SRzjis of the surface of the roughened nickel plated layer is equal to or more than 2 μm, and, '(i) a length of the valley region B in a rolling direction or a plate passing direction of the base material is less than 40 μm in a direct distance.', 'letting a maximum height of the roughened nickel plated layer be SRz, a valley region B in a given virtual planer region A as observed at a height position of SRz×0.25 satisfies the following (i)2. The roughened nickel-plated material according to claim 1 , wherein a maximum CLmax of a circumferential length CL of the valley region B is less than 500 μm.3. A roughened nickel-plated material comprising:a base material that is a metal; anda roughened nickel plated layer formed on at least one surface of the base material,wherein Str of three-dimensional surface property parameters of the surface of the roughened nickel plated layer is equal to or more than 0.1.4. The roughened nickel-plated material according to claim 3 , wherein claim 3 , further claim 3 , Sk of the three-dimensional surface property parameters of the surface of the roughened nickel plated layer is 1.0 to 4.0 μm.5. The roughened nickel-plated material according to claim 3 , wherein claim 3 , further claim 3 , Vvc of the three-dimensional surface property parameters of the surface of the roughened nickel plated layer is 0.6 to 3.0 μm3/μm2.6. The roughened nickel-plated material according to claim 3 , wherein claim 3 , further claim 3 , Vmc of the three-dimensional surface property parameters of the surface of the roughened nickel plated layer is 0.45 to 2.0 μm3/μm2.7. The roughened nickel-plated material according to claim 1 , wherein the base material is a steel sheet.8. The roughened nickel-plated material according to claim 1 , wherein brightness of color of the surface ...

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08-09-2022 дата публикации

ADDITIVE HEAT EXCHANGER AND METHOD OF FORMING

Номер: US20220282391A1
Принадлежит:

A method of electroforming can be used to prepare a heat exchanger by electroforming the heat exchanger on a mandrel having a smooth and conductive surface. The mandrel is in the shape of at least part of the heat exchanger, and is removed from the electroformed heat exchanger. 1. A method of electroforming a heat exchanger , the method comprising:polishing a conductive surface of a mandrel shaped as at least a portion of the heat exchanger;electroforming the heat exchanger onto the conductive surface of the mandrel; andremoving the mandrel from the electroformed heat exchanger.2. The method of wherein polishing the conductive surface smooths the conductive surface roughness (rms) to less than 32 microinches (0.81 micrometers).3. The method of wherein electroforming the heat exchanger further includes electroforming the heat exchanger to have a wall thickness that is less than 4 mils (0.01 centimeters).4. The method of further comprising activating the conductive surface for electroforming.5. The method of wherein activating includes treating the conductive surface to remove contaminants.6. The method of wherein the electroformed heat exchanger is treated along inner surfaces that are exposed when the mandrel is removed.7. The method of wherein treating the heat exchanger includes treating the inner surfaces with an etchant.8. The method of further comprising attaching a manifold component to the mandrel.9. The method of further comprising metalizing the mandrel to form the conductive surface prior to polishing the conductive surface.10. The method of further comprising forming the mandrel to shape to at least the portion of the heat exchanger prior to metalizing the mandrel.11. A method of electroforming a component claim 9 , the method comprising:polishing a conductive surface of a mandrel shaped as the component;electroforming the component onto the conductive surface of the mandrel; andremoving the mandrel from the component to expose a new surface of the ...

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08-09-2022 дата публикации

ELECTROCHEMICAL METHODS, DEVICES AND COMPOSITIONS

Номер: US20220282392A1
Принадлежит:

The disclosure provides a method comprising inducing a first current between a source of a countercharge and a first electrode, the first current being through an electrolyte. A second current is induced across the first electrode, the second current being transverse to the first current, and the second current inducing a relativistic charge across the first electrode. 1a source of countercharge;an electrode;an electrolyte in contact with the electrode and through which a first current between the source of countercharge and electrode flows; anda waveform generating device coupled with the electrode, the waveform generating device inducing an electric waveform across the electrode in the presence of the current.. An apparatus, comprising: The present application is a continuation of U.S. Nonprovisional application Ser. No. 16/897,168 filed Jun. 9, 2020 entitled “Electrochemical Methods, Devices and Compositions,” which is a continuation of U.S. Nonprovisional application Ser. No. 15/649,633 filed Jul. 13, 2017 entitled “Electrochemical Methods, Devices and Compositions,” now U.S. Pat. No. 10,697,083, which claims priority to U.S. Provisional Application No. 62/361,650 filed Jul. 13, 2016 entitled “Electrochemical Methods, Devices and Compositions,” both of which are hereby incorporated by reference in their entirety.The present continuation application is related to U.S. Nonprovisional application Ser. No. 15/649,569 filed Jul. 13, 2017 entitled “Electrochemical Methods, Devices and Compositions,” now U.S. Pat. No. 10,480,094, which also claims priority to U.S. Provisional Application No. 62/361,650 filed Jul. 13, 2016 entitled “Electrochemical Methods, Devices and Compositions,” both of which are hereby incorporated by reference in their entirety.Aspects of the present disclosure involve electrochemistry, and particularly materials bonding, surface repair, electroplating, corrosion and electrocatalysis.Traditional material fusion techniques, such as welding, have ...

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30-04-2020 дата публикации

Procedure for the manufacturing of nanostructured platinum

Номер: US20200131655A1
Принадлежит: Albert Ludwigs Universitaet Freiburg

A method for the manufacturing of platinum nanostructures showing improved properties and usable in biomedical appliances is provided. The method includes providing a solution containing hexachloroplatinate with the remainder being water and electrochemical deposition of platinum on a substrate with the platinum deposited in a nanostructured form.

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09-05-2019 дата публикации

Tin-plated product and method for producing same

Номер: US20190136398A1
Принадлежит: Dowa Metaltech Co Ltd, Yazaki Corp

After drying the surface of a tin plating layer having a thickness of 0.4 to 3 μm which is formed on a base material of copper or a copper alloy by electroplating at a current density of 5 to 13 A/dm 2 in a tin plating solution consisting of water, tin sulfate, sulfuric acid and a surfactant, the surface of the tin plating layer is heated to melt tin, and then, cooled to cause a layer of the tin plating layer on the side of the outermost surface to be a tin layer, which has a structure obtained by solidification after melting, while causing a layer of the tin plating layer between the tin layer and the base material to be a copper-tin alloy layer, to produce a tin-plated product wherein a tin layer, which has a structure obtained by solidification after melting, is formed on a copper-tin alloy layer formed on a base material of copper or a copper alloy and wherein the tin-plated product has a glossiness of 0.3 to 0.7.

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10-06-2021 дата публикации

NANO-TWINNED COPPER LAYER, METHOD FOR MANUFACTURING THE SAME, AND SUBSTRATE COMPRISING THE SAME

Номер: US20210172086A1
Принадлежит:

A nano-twinned copper layer is disclosed, wherein over 50% of a volume of the nano-twinned copper layer comprises a plurality of columnar crystal grains, the plurality of columnar crystal grains connect to each other, at least 70% of the plurality of columnar crystal grains are formed by a plurality of nano-twins stacking in an orientation of a [111] crystal axis, and an angle included between two adjacent columnar crystal grains is greater 20° and less than or equal to 60°. In addition, a method for manufacturing the nano-twinned copper layer and a substrate comprising the same are also disclosed. 1. A nano-twinned copper layer , wherein over 50% of a volume of the nano-twinned copper layer comprises a plurality of columnar crystal grains , the plurality of columnar crystal grains connect to each other , at least 70% of the plurality of columnar crystal grains are formed by a plurality of nano-twins stacking in an orientation of a [111] crystal axis , and an angle included between two adjacent columnar crystal grains is greater 20° and less than or equal to 60°.2. The nano-twinned copper layer of claim 1 , wherein a thickness of the nano-twinned copper layer is ranged from 0.1 μm to 500 μm.3. The nano-twinned copper layer of claim 1 , wherein each of the plurality of columnar crystal grains is formed by the plurality of nano-twins stacking in the orientation of the [111] crystal axis.4. The nano-twinned copper layer of claim 1 , wherein lengths of the plurality of columnar crystal grains on a minor axis are respectively ranged from 0.1 μm to 50 μm.5. The nano-twinned copper layer of claim 1 , wherein thicknesses of the plurality of columnar crystal grains are respectively ranged from 0.01 μm to 500 μm.6. A method for manufacturing a nano-twinned copper layer claim 1 , comprising the following steps:providing an electrodepositing system, which comprises an anode, a cathode, a plating solution and a power supply, wherein the power supply is electrically connected to ...

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09-06-2016 дата публикации

Plated polymer compressor

Номер: US20160160869A1
Принадлежит: United Technologies Corp

Plated polymeric gas turbine engine parts and methods for fabricating lightweight plated polymeric gas turbine engine parts are disclosed. The parts include a polymeric substrate plated with one or more metal layers. The polymeric material of the polymeric substrate may be structurally reinforced with materials that may include carbon, metal, or glass. The polymeric substrate may also include a plurality of layers to form a composite layup structure.

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22-09-2022 дата публикации

Compositions and Methods for the Electrodeposition of Nanotwinned Copper

Номер: US20220298665A1
Принадлежит:

A copper electroplating solution comprising a copper salt, a source of halide ions, and a linear or branched polyhydroxyl. The copper electroplating solution is used to deposit copper having a high density of nanotwinned columnar copper grains on a substrate. The linear or branched polyhydroxyl may comprise a reaction product between 2,3-epoxy-1-propanol and aminic alcohol or ammonium alcohol. 1. (canceled)2. The method according to claim 10 , wherein the copper salt is copper sulfate.3. The method according to claim 10 , wherein the copper electroplating solution further comprises an acid claim 10 , wherein the acid comprises sulfuric acid or methane sulfonic acid.4. The method according to claim 10 , wherein the linear or branched polyhydroxyl comprises poly(2 claim 10 ,3-epoxy-1-propanol).5. The method according to claim 10 , wherein the linear or branched polyhydroxyl comprises a reaction product between 2 claim 10 ,3-epoxy-1-propanol and aminic alcohol or ammonium alcohol.6. The method according to claim 10 , wherein the linear or branched polyhydroxyl comprises at least one nitrogen atom.7. The method according to claim 5 , wherein the aminic alcohol or the ammonium alcohol is selected from the group consisting of ethanolamine claim 5 , diethanolamine claim 5 , triethanolamine claim 5 , propanolamine claim 5 , isopropanolamine claim 5 , diisopropanolamine claim 5 , triisopropanolamine claim 5 , N-methyl diethanolamine claim 5 , N-ethyl diethanolamine claim 5 , N-propyl diethanolamine claim 5 , methyl monoethanolamine claim 5 , N claim 5 ,N-dimethyl ethanolamine claim 5 , N claim 5 ,N-diethyl ethanolamine claim 5 , N-propyl monoethanolamine claim 5 , N-propyl diethanolamine claim 5 , N-butyl ethanolamine claim 5 , N-butyl diethanolamine claim 5 , N claim 5 ,N-dibutyl ethanolamine claim 5 , hydroxy ethyl morpholine claim 5 , 2-piperidino ethanol claim 5 , diethanol isopropanolamine claim 5 , N-(2-hydroxyethyl) pyrrolidine claim 5 , choline chloride claim 5 , b- ...

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24-06-2021 дата публикации

High-strength single-crystal like nanotwinned nickel coatings and methods of making the same

Номер: US20210189581A1
Принадлежит: PURDUE RESEARCH FOUNDATION

A high-strength coatings and methods of fabrication to yield single-crystal-like nickel containing nanotwins and stacking faults.

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16-06-2016 дата публикации

Plated polymer aviation components

Номер: US20160167791A1
Принадлежит: United Technologies Corp

Aviation components comprising a polymeric substrate having an outer surface wherein a metal is plated onto the outer surface to form a plated layer are disclosed. A method to make aviation components comprising a polymeric substrate having an outer surface and where a metal is plated onto the outer surface is disclosed. An over-plated heating element for shedding ice from an aircraft component having a polymeric substrate with a pocket to receive a heating element, a metal deposited onto the substrate, a heating element positioned within the pocket and a covering layer deposited onto the heating element and the plated layer is disclosed.

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14-06-2018 дата публикации

Fan blade with protective cladding and method of making

Номер: US20180163746A1
Принадлежит: United Technologies Corp

Disclosed herein is a coated aluminum component which includes an aluminum substrate and a protective material disposed on the substrate wherein the protective material includes a galvanic corrosion protection layer and an impact protection layer. Also disclosed is a method of applying the protective material.

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15-06-2017 дата публикации

Steel foil for power storage device container, power storage device container, power storage device, and manufacturing method of steel foil for power storage device container

Номер: US20170170436A1

A steel foil for a power storage device container includes a rolled steel foil, a nickel layer formed on a surface of the rolled steel foil, and a chromium-based surface treatment layer formed on a surface of the nickel layer. The nickel layer includes an upper layer portion which is in contact with the chromium-based surface treatment layer and contains Ni of 90 mass % or more among metal elements, and a lower layer portion which is in contact with the rolled steel foil and contains Ni of less than 90 mass % among the metal elements and Fe. <111> polar density in a reverse pole figure of the nickel layer in a rolling direction is 3.0 to 6.0. The nickel layer has a sub-boundary which is a boundary between two crystals having a relative orientation difference of 2° to 5°, and a large angle boundary which is a boundary between two crystals having the relative orientation difference of equal to or more than 15°. The average value of a ratio L 5 /L 15 between a boundary length L 5 which is the length of the sub-boundary, and a boundary length L 15 which is the length of the large angle boundary, is equal to or more than 1.0.

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22-06-2017 дата публикации

Method of forming metal coating

Номер: US20170175281A1
Принадлежит: Toyota Motor Corp

A method of forming a metal coating includes: disposing a solid electrolyte membrane ( 13 ) between an anode ( 11 ) and a substrate (B) which forms a cathode; bringing a solution (L) containing metal ions into contact with an anode-side portion of the solid electrolyte membrane ( 13 ); and causing, in a state where the solid electrolyte membrane ( 13 ) is in contact with the substrate (B), a current to flow from the anode ( 11 ) to the cathode so as to form a metal coating formed of the metal on the surface of the substrate (B). The metal coating is formed by repeating a current-flowing period (T) in which a current flows from the anode ( 11 ) to the cathode and a non-current-flowing period (N) in which a current does not flow between the anode ( 11 ) and the cathode.

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08-07-2021 дата публикации

SURFACE-TREATED COPPER FOIL, AND COPPER-CLAD LAMINATE AND CIRCUIT BOARD USING SAME

Номер: US20210212204A1
Принадлежит:

Provided is a surface-treated copper foil excellent in laser processability. The surface-treated copper foil includes a roughened surface formed by subjecting a surface to a roughening treatment, in which when measured using a three-dimensional roughness meter, the roughened surface has a surface skewness Ssk within a range of from −0.300 to less than 0 and an arithmetic mean summit curvature Ssc within a range of from 0.0220 nmto less than 0.0300 nm. 1. A surface-treated copper foil comprising a roughened surface formed by subjecting a surface to a roughening treatment , wherein when measured using a three-dimensional roughness meter , the roughened surface has a surface skewness Ssk within a range of from −0.300 to less than 0 and an arithmetic mean summit curvature Ssc within a range of from 0.0220 nmto less than 0.0300 nm.2. The surface-treated copper foil according to claim 1 , wherein the roughened surface has a surface skewness Ssk within a range of from −0.300 to less than −0.100 and an arithmetic mean summit curvature Ssc within a range of from 0.0250 nmto less than 0.0300 nm.3. A copper-clad laminate comprising the surface-treated copper foil according to .4. A copper-clad laminate comprising the surface-treated copper foil according to .5. The copper-clad laminate according to claim 3 , comprising the surface-treated copper foil and a resin base material laminated on the roughened surface of the surface-treated copper foil claim 3 , the resin base material containing a liquid crystal polymer.6. The copper-clad laminate according to claim 4 , comprising the surface-treated copper foil and a resin base material laminated on the roughened surface of the surface-treated copper foil claim 4 , the resin base material containing a liquid crystal polymer.7. A circuit board comprising the copper-clad laminate according to .8. A circuit board comprising the copper-clad laminate according to .9. A circuit board comprising the copper-clad laminate according to .10. A ...

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09-07-2015 дата публикации

Metallic Material For Electronic Components And Method For Producing Same, And Connector Terminals, Connectors And Electronic Components Using Same

Номер: US20150194746A1
Принадлежит: JX Nippon Mining and Metals Corp

The present invention provides metallic materials for electronic components, having low degree of whisker formation, low adhesive wear property and high durability, and connector terminals, connectors and electronic components using such metallic materials. The metallic material for electronic components includes: a base material; a lower layer formed on the base material, the lower layer being constituted with one or two or more selected from a constituent element group A, namely, the group consisting of Ni, Cr, Mn, Fe, Co and Cu; an intermediate layer formed on the lower layer, the intermediate layer being constituted with one or two or more selected from a constituent element group B, namely, the group consisting of Ag, Au, Pt, Pd, Ru, Rh, Os and Ir; and an upper layer formed on the intermediate layer, the upper layer being constituted with an alloy composed of one or two or more selected from the constituent element group B, namely, the group consisting of Ag, Au, Pt, Pd, Ru, Rh, Os and Ir and one or two selected from a constituent element group C, namely, the group consisting of Sn and In; wherein the thickness of the lower layer is 0.05 μm or more and less than 5.00 μm; the thickness of the intermediate layer is 0.01 μm or more and less than 0.50 μm; and the thickness of the upper layer is 0.02 μm or more and less than 0.80 μm.

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05-07-2018 дата публикации

Steel sheet for containers, and method for producing steel sheet for containers

Номер: US20180187324A1
Принадлежит: Nippon Steel and Sumitomo Metal Corp

This steel sheet for containers includes a steel sheet, a Sn coated layer that is formed on at least one surface of the steel sheet, and a chemical treatment layer that is formed on the Sn coated layer. The Sn coated layer contains 300 mg/m 2 to 5,600 mg/m 2 of Sn in terms of an amount of metal Sn, and the chemical treatment layer contains 5 mg/m 2 to 30 mg/m 2 of a Zr compound in terms of an amount of metal Zr, an average roughness Ra of an outermost surface of the chemical treatment layer obtained with a scanning probe microscope is 10 nm to 100 nm. A variation amount in a yellowness index measured at one measurement point on the outermost surface of the chemical treatment layer is defined as ΔYI represented by Equation (1), an average of absolute values of the ΔYI obtained at a plurality of the measurement points included in a unit area of the outermost surface is 5.0 or less. Δ YI=YI−YI 0   (1) where YI: the yellowness index measured after the steel sheet for containers is subjected to a retort treatment at a temperature of 130° C. for 5 hours, YI 0 : the yellowness index measured before the retort treatment

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14-07-2016 дата публикации

Titanium-Copper Alloy Having Plating Layer

Номер: US20160199929A1
Автор: Kenta Tsujie
Принадлежит: JX Nippon Mining and Metals Corp

There is provided a titanium-copper alloy in which the adhesion strength with solder can be increased. The titanium-copper alloy comprises a base material and a plating layer provided on a surface of the base material, wherein the base material contains 1.5 to 5.0% by mass of Ti with a balance consisting of copper and unavoidable impurities, and the plating layer is selected from the group consisting of a Ni plating layer, a Co plating layer, and a Co—Ni alloy plating layer.

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22-07-2021 дата публикации

PREPARATION METHOD OF MINIATURE INTELLIGENT CALCIUM ALGINATE HYDROGEL END OPERATOR

Номер: US20210222310A1
Принадлежит:

A preparation method of a miniature intelligent calcium alginate hydrogel end operator based on different microelectrodes is introduced. The method includes an electrodeposition step of depositing a deposition solution under the action of a non-uniform magnetic field to form an anode surface; a processing step of transferring obtained hydrogel microstructures to a calcium chloride solution, making the hydrogel microstructure self-wind sufficiently; and a pickup step of collecting a self-winding single-layer film alginate microstructure in a culture dish, and placing it in specific environment for preservation. The preparation method can provide a degradable and convenient micro-operator, which could be locally prepared into different function components. 1. A preparation method of a degradable and self-winding miniature intelligent calcium alginate hydrogel end operator , comprising: electrodeposition , processing and pickup.2. The preparation method of a degradable and self-winding miniature intelligent calcium alginate hydrogel end operator according to claim 1 , characterized in that: the electrodeposition step further comprises:a1: coating a photoresist on an FTO glass by a spin coater, and forming a concave pattern with a specific shape on the FTO glass as an anode;a2: filling a deposition solution between two electrodes and maintaining the deposition solution by insulating spacers with a height of 1 mm;a3: applying direct voltage to the electrodes for 1 to 5 seconds; anda4: washing the anode in an HEPES buffer solution for 5 minutes until all hydrogel microstructures are separated from the FTO glass.3. The preparation method of a degradable and self-winding miniature intelligent calcium alginate hydrogel end operator according to claim 1 , characterized in that the electrodeposition step further comprises:a1: coating the photoresist on the FTO glass by the spin coater, and forming the concave pattern with the specific shape on the FTO glass as the anode;a2: ...

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22-07-2021 дата публикации

Selective metallized translucent automotive components by laser ablation

Номер: US20210222312A1
Принадлежит: Lacks Enterprises Inc

A decorative component includes a plateable resin body portion that is light-transmissive. A thin intermediate layer of material is electrolessly deposited over the body portion. The intermediate layer is laser ablated to selectively remove the intermediate layer and expose the light transmissive portion. The part is then subjected to electroplating. The ablated areas do not receive the metal layers of the electroplating, thereby defining a pattern defined by the ablation. The laser ablation may define an outline, leaving the thin intermediate layer within the outline that is electrically isolated from areas outside of the outline. The electroplating process will not apply layers to the isolated areas, and the intermediate layer therein will dissolve, exposing the light transmissive body portion. An opposite side of the part is also exposed and transmissive, such that light will pass through the body portion and illuminate the pattern.

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14-07-2016 дата публикации

Method of forming asper-silver on a lead frame

Номер: US20160204003A1
Принадлежит: Individual

A method for plating a lead frame comprises the steps of plating the lead frame with at least one plating layer including silver and forming an asper-silver layer comprising nano-silver formations over the at least one plating layer including silver. The asper-silver layer is particularly beneficial for enhancing the adhesion of plastic molding compound to the lead frame.

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30-07-2015 дата публикации

Cu CORE BALL, SOLDER PASTE AND SOLDER JOINT

Номер: US20150209912A1
Принадлежит: Senju Metal Industry Co Ltd

A Cu core ball suppresses a soft error and its alpha dose is low. Its surface roughness does not affect a mounting process. A pure degree of the Cu ball as an internal ball is equal to or larger than 99.9% and equal to or less than 95%. A total contained amount of Pb and/or Bi in impurity contained in the Cu ball is equal to or larger than 1 ppm. Its sphericity is equal to or higher than 0.95. A solder plating film coated on the Cu ball is a Sn solder plating film or a solder plating film comprising a lead free solder alloy whose primary component is Sn. In the solder plating film, a contained amount of U is equal to or less than 5 ppb and that of Th is equal to or less than 5 ppb. A total alpha dose of the Cu ball and the solder plating film is equal to or less than 0.0200 cph/cm 2 . An arithmetic average roughness of the Cu core ball is equal to or less than 0.3 μm.

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29-07-2021 дата публикации

ELECTRICITY STORAGE DEVICE, METHOD FOR PRODUCING ELECTRICITY STORAGE DEVICE, AND ELECTROLYTIC PLATING METHOD

Номер: US20210234169A1
Принадлежит: KABUSHIKI KAISHA TOYOTA JIDOSHOKKI

An electricity storage device includes a stack of bipolar electrodes each including a steel sheet, and a plating layer provided on a surface of the steel sheet. The plating layer includes a base nickel-plating layer provided on the surface of the steel sheet, and a surface nickel-plating layer provided on the base nickel-plating layer, and having a surface roughness greater than that of the base nickel-plating layer. 13.-. (canceled)4. An electricity storage device comprising a stack of electrodes each including a steel sheet , and a plating layer provided on a surface of the steel sheet , wherein a base nickel-plating layer provided on the surface of the steel sheet, and', 'a surface nickel-plating layer provided on the base nickel-plating layer and having a plurality of protrusions protruding in a direction intersecting with a direction in which the surface of the steel sheet extends, and, 'the plating layer includes'}at least some of the protrusions are each provided with an enlarged portion positioned nearer to a tip end of each of the protrusions rather than a base end of each of the protrusions.5. The electricity storage device according to claim 4 , further comprising a resin spacer disposed along a peripheral portion of each of the electrodes and in contact with the plating layer claim 4 , whereina part of the resin spacer is interposed between adjacent two of the protrusions, at least one of which has the enlarged portion, across a range from the tip ends to the base ends thereof.6. The electricity storage device according to claim 4 , wherein an average height of the protrusions is equal to or greater than 15 μm and equal to or smaller than 30 μm.7. The electricity storage device according to claim 4 , wherein at least one of the plurality of protrusions has a plurality of built-up metal deposits.8. The electricity storage device according to claim 7 , wherein each of the metal deposits has a spherical shape.9. The electricity storage device according to ...

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28-07-2016 дата публикации

Multilayer build processes and devices thereof

Номер: US20160217922A1
Автор: David Sherrer
Принадлежит: Nuvotronics Inc

A process to form devices may include forming a seed layer on and/or over a substrate, modifying a seed layer selectively, forming an image-wise mold layer on and/or over a substrate and/or electrodepositing a first material on and/or over an exposed conductive area. A process may include selectively applying a temporary patterned passivation layer on a conductive substrate, selectively forming an image-wise mold layer on and/or over a substrate, forming a first material on and/or over at least one of the exposed conductive areas and/or removing a temporary patterned passivation layer. A process may include forming a sacrificial image-wise mold layer on a substrate layer, selectively placing one or more first materials in one or more exposed portions of a substrate layer, forming one or more second materials on and/or over a substrate layer and/or removing a portion of a sacrificial image-wise mold layer.

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02-07-2020 дата публикации

Apparatus for electro-forming and apparatus for horizontal electro-forming

Номер: US20200208288A1
Принадлежит: LG Display Co Ltd

Provided is an apparatus for electro-forming. The apparatus for electro-forming includes a plating bath which is a space where a substrate is plated and a clamp disposed within the plating bath and configured to grasp the substrate disposed in a horizontal direction. The apparatus for electro-forming further includes an assembly including an anode spaced above the substrate and connected to an external power supply and a plating solution supply unit spaced above the substrate and configured to supply a plating solution. The apparatus for electro-forming also includes a driving unit configured to reciprocate the assembly in a horizontal direction at a distance from the substrate. The assembly further includes an insulator between the anode and the plating solution supply unit.

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23-10-2014 дата публикации

Batteries with nanostructured electrodes and associated methods

Номер: US20140315085A1
Принадлежит: Washington State University WSU

Several embodiments related to batteries having electrodes with nanostructures, compositions of such nanostructures, and associated methods of making such electrodes are disclosed herein. In one embodiment, a method for producing an anode suitable for a lithium-ion battery comprising preparing a surface of a substrate material and forming a plurality of conductive nanostructures on the surface of the substrate material via electrodeposition without using a template.

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20-08-2015 дата публикации

Plated terminal for connector, and terminal pair

Номер: US20150236439A1

It is aimed to provide a plated terminal for connector and a terminal pair having a tin layer on an outermost surface and achieving both a reduction of a terminal insertion force and a reduction of a contact resistance. The plated terminal for connector includes a coating layer containing tin and a hard metal harder than tin at a contact portion to be brought into contact with another electrical conductive member, and both an area where tin is exposed on an outermost surface and an area where the hard metal is exposed on the outermost surface or an area where the hard metal is coated with a tin layer thinner than in other parts are included in the contact portion. Such a material can be obtained, for example, by forming a tin layer on a surface of a base material having an uneven structure on a surface of which a hard metal layer is formed.

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18-07-2019 дата публикации

Plasma frequency trigger

Номер: US20190218681A1
Автор: Dennis G. LETTS
Принадлежит: IH IP Holdings Ltd

An exothermic reaction assembly includes a reaction chamber and a generator operative to generate an AC electrical signal and apply the signal to the reaction chamber by superimposing the AC signal over a DC signal. A gas manifold and controller is operative to connect a vacuum pump and one or more gas chambers to the reaction chamber and to control a pressure of the reaction chamber. The signal generator is operative to create a plasma in the reaction chamber by superimposing the AC electrical signal to the reaction chamber over the DC signal. The gas manifold and controller are operative to adjust the pressure within the reaction chamber to achieve a predetermined plasma frequency.

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09-08-2018 дата публикации

Surface-treated copper foil, and current collector, electrode, and battery cell using the surface-treated copper foil

Номер: US20180226655A1
Автор: Atsushi Miki, Hideta Arai
Принадлежит: JX Nippon Mining and Metals Corp

The surface-treated copper foil for a battery cell according to one or more embodiments of the present application contains a copper foil and a surface treatment layer on at least one surface of the copper foil, wherein the surface treatment layer contains a primary particle layer and a secondary particle layer, and the surface of the surface treatment layer has a ten-point average roughness Rz of 1.8 μm or more measured with a laser microscope with a wavelength of 405 nm according to JIS B0601 1994.

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19-08-2021 дата публикации

Manufacturing method of circuit board assembly for high frequency signal transmission

Номер: US20210259113A1
Принадлежит: Nan Ya Plastics Corp

A manufacturing method of copper foil and circuit board assembly for high frequency transmission are provided. Firstly, a raw copper foil having a predetermined surface is produced by an electrolyzing process. Subsequently, a roughened layer including a plurality of copper particles is formed on the predetermined surface by an arsenic-free electrolytic roughening treatment and an arsenic-free electrolytic surface protection treatment. Thereafter, a surface treatment layer is formed on the roughened layer, and the roughened layer is made of a material which includes at least one kind of non-copper metal elements and the concentration of the non-copper metal elements is smaller than 400 ppm. By controlling the concentration of the non-copper elements, the resistance of the copper foil can be reduced.

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17-08-2017 дата публикации

Cu CORE BALL, SOLDER PASTE AND SOLDER JOINT

Номер: US20170233884A1
Принадлежит: Senju Metal Industry Co Ltd

A Cu core ball and a method of manufacturing such a Cu core ball. Purity of the Cu internal ball is at least 99.9% and not greater than 99.995%. A total contained amount of Pb and/or Bi in impurity contained in the Cu ball is equal to or larger than 1 ppm. Its sphericity is at least 0.95. A solder plating film coated on the Cu ball is of Sn solder or a lead free solder alloy whose primary component is Sn. In the solder plating film, a contained amount of U is not more than 5 ppb and that of Th is not more than 5 ppb. A total alpha dose of the Cu ball and the solder plating film is not more than 0./0200 cph/cm2. An arithmetic average roughness of the Cu core ball is equal to or less than 0.3 μm.

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