Способ определения формы эталона поверхности сварного шва

Изобретение относится к области сварки и может быть использовано при проведении измерительного контроля качества сварных швов, а также при оценке квалификации сварщиков, качества сварочных материалов и сварочного оборудования. Способ определения формы эталона поверхности сварного шва осуществляют путем сканирования лазерным триангулярным датчиком поверхности сварного соединения. В каждом поперечном сечении измеряют высоту и ширину сварного шва. По измеренным значениям высоты и ширины определяют капиллярную постоянную расплавленного материала с последующим вычислением формы эталона поверхности как стыкового, так и углового сварного шва в любом пространственном положении по заданным нормативной документацией размерам высоты, ширины и площади сварного шва. 2 табл.

СИСТЕМА РЕГИСТРАЦИИ ОБЪЕМА ЗАГРУЖАЕМОГО МАТЕРИАЛА, ИМЕЮЩАЯ НЕСКОЛЬКО РАДИОЛОКАЦИОННЫХ ДАТЧИКОВ

СПОСОБ РЕНТГЕНОВСКОЙ МИКРОСКОПИИ ДЛЯ ОЦЕНКИ ФОРМЫ ОТВЕРСТИЙ И РАЗМЕРОВ ХИРУРГИЧЕСКИХ ИГЛ

... 1. Способ характеризации высверленного лазером отверстия в хирургической игле, содержащий этапы, при которых:направляют рентгеновский пучок излучения от генератора рентгеновского излучения на проксимальный конец хирургической иглы, содержащий высверленное лазером отверстие;получают в цифровой форме изображение проксимального конца иглы, включающее изображение отверстия, с помощью датчика, на который падает рентгеновское излучение, при этом проксимальный конец иглы располагается между генератором рентгеновского излучения и датчиком; иобрабатывают цифровое изображение для определения отклонения отверстия от стандартных размеров, установленных спецификацией.2. Способ по п.1, в котором указанной игле присваивается уникальный цифровой идентификатор.3. Способ по п.1, в котором указанное отклонение преобразовывается в сигнал, отправляемый в контроллер.4. Способ по п.3, в котором контроллер вычисляет сигнал, отправляемый на устройство лазерного сверления, для модифицирования параметров лазера для ...

Способ и схема для определения характеристики краев структур в измерительных приборах

Изобретение относится к контрольно-измерительной технике. Целью изобретения является обеспечение контроля геометрических параметров микро.труктур. -Схема устройства содержит центральное устройство, предназначенное для анализа сигнала с У2 fB (Л ...

X-RAY MICROSCOPY FOR CHARACTERIZING HOLE SHAPE AND DIMENSIONS IN SURGICAL NEEDLES

A novel method of characterizing laser drilled boreholes is disclosed. The method uses x-ray microscopy for dimensional characterization. The x- ray output may be processed to control manufacturing equipment in automated production systems, including laser drilling systems and swaging apparatus.

MATERIAL EROSION MONITORING SYSTEM AND METHOD

Disclosed is an improved system and method to evaluate the status of a material. The system and method are operative to identify flaws and measure the erosion profile and thickness of different materials, including refractory materials, using electromagnetic waves. The system is designed to reduce a plurality of reflections, associated with the propagation of electromagnetic waves launched into the material under evaluation, by a sufficient extent so as to enable detection of electromagnetic waves of interest reflected from remote discontinuities of the material. Furthermore, the system and method utilize a configuration and signal processing techniques that reduce clutter and enable the isolation of electromagnetic waves of interest. Moreover, the launcher is impedance matched to the material under evaluation, and the feeding mechanism is designed to mitigate multiple reflection effects to further suppress clutter.

MEASURING APPARATUS, PARTICULARLY THIN THICKNESSES, BROUGHT IN COINCIDENCE WITH THE AXIS OF A MEASURING PROBE WITH A NORMAL TO THE SURFACE OF A TEST PART.

3D shape measuring system of both-sides mounting electronic components using 2D X-ray image

SCANNING ELECTRON MICROSCOPE

... 본 발명은, 주사 전자 현미경에 있어서, 시료 표면이 도전성 재료였다고 해도, 구멍 바닥 등으로부터 방출되는 전자를 고효율로 인상하는 전계를 형성하는 것이다. 전자 빔의 주사 위치를 편향시키는 편향기와, 시료를 탑재하기 위한 시료 스테이지를 구비한 주사 전자 현미경에 있어서, 측정 대상 패턴에 대하여 전자 빔을 주사하기 전에, 당해 측정 대상 패턴의 하층에 위치하는 다른 패턴에 대한 전자 빔 조사를 행하도록, 상기 편향기 또는 상기 시료 스테이지를 제어하도록 했다.

PATTERN MEASUREMENT DEVICE AND COMPUTER PROGRAM

METHOD AND DEVICE FOR GENERATING CORRECTION LINE INDICATING RELATIONSHIP BETWEEN AMOUNT OF SEPARATION BETWEEN WAFER PATTERN EDGE AND REFERENCE PATTERN EDGE AND REFERENCE PATTERN SPACE WIDTH, AND COMPUTER-READABLE RECORDING MEDIUM

MICROSTRUCTURE INSPECTION METHOD, MICROSTRUCTURE INSPECTION APPARATUS, AND MICROSTRUCTURE INSPECTION PROGRAM

Method and device for line pattern shape evaluation

The present invention pertains to a method and device for quantitatively evaluating the degree and characteristics of wiggling, which is a phenomenon that occurs in electronic device fabrication processes and consists of the deformation in the same shape of the left and right edges of fine line patterns, and takes advantage of the fact that this wiggling is included in measured values for line edge variation but not line width variation by acquiring the differences between these values. Further, the present invention is configured so as to calculate line center positions and use the distribution of the deviation from the average line center position as an indicator. Additionally, the present invention is configured to quantify wiggling characteristics by outputting a coefficient of wiggling correlation between lines or a wiggling component synchronized between lines as an indicator.

Spin-split scanning electron microscope

A spin-split scanning electron microscope (SSSEM) uses a spin-split electron beam interferometer to measure the difference between two electron beam paths. By measuring the difference in path lengths, and/or measuring changes in the relative difference between the two paths as the electron beams are scanned over a surface, the topology of an object's surface may be measured. The measuring changes in the relative difference between the two paths as a material etching or material deposition or growth process is performed, the amount of material added or removed from an object's surface may be metered. The spin-split scanning electron microscope includes an electron beam source that generates a flying stream of electrons, a spin-split electron beam splitter splits the flying stream of electrons into first and second electron beams having different trajectories, an electron beam intensity detector that receives a reflected portion of the first and second electron beams after they have been ...

Pattern inspection method

The present invention may include a pattern inspection method of extracting a pattern edge shape from an image obtained by a scanning microscope and inspecting the pattern. A control section and a computer of the scanning microscope process the intensity distribution of reflected electrons or secondary electrons, find the distribution of gate lengths in a single gate from data about edge positions, estimate the transistor performance by assuming a finally fabricated transistor to be a parallel connection of a plurality of transistors having various gate lengths, and determine the pattern quality and grade based on an estimated result. In this manner, it is possible to highly, accurately and quickly estimate an effect of edge roughness on the device performance and highly accurately and efficiently inspect patterns in accordance with device specifications.

Filling material volume detection system comprising multiple radar sensors

A fill level measurement system for detecting a topology of a filling material surface or a volume of a filling material in a container including a master device and one or more slave devices, the master device being designed to transmit control signals to the slave device. As the slave devices do not include all the functionalities of an independent fill level measurement device, the slave devices can be produced in a cost-effective manner.

SURFACE DETECTION APPARATUS OF BLAST FURNACE BURDEN AND DETECTION METHOD

An apparatus includes: a guide portion in which a reflection plate is disposed in an opening portion at one end, and an antenna is disposed at the other end, and which is to be inserted into a blast furnace through an opening of the furnace; a guide portion moving unit which moves the guide portion to the inside or outside of the furnace; a guide portion rotating unit which rotates the guide portion; and a reflection plate tilting unit which changes a tilt angle of the reflection plate with respect to the antenna. During measurement, the opening portion of the guide portion is protruded into the furnace, and the guide portion rotating unit and the reflection plate tilting unit are driven to scan planarly or linearly the surface of a burden in the furnace. 1. A surface detection apparatus of a blast furnace burden , the surface detection apparatus which is configured to transmit a detection wave to a surface of a burden such as iron ore and coke that are charged into a blast furnace , and to receive a reflection wave of the detection wave , thereby detecting a surface profile of the burden , comprising:a guide portion which is cylindrical, and which has an opening portion that is formed by removing a part of a peripheral wall of one end of the guide portion;a reflection plate which is disposed directly above the opening portion;an antenna which is disposed at another end of the guide portion while being opposed to the reflection plate;a guide portion rotating unit which is configured to rotate the guide portion through a predetermined angle about an axis of the guide portion;a guide portion moving unit which is configured to move the guide portion to an inside or outside of the blast furnace; anda reflection plate tilting unit which is configured to tilt the reflection plate at a predetermined angle to an antenna side or an anti-antenna side, whereinthe guide portion is inserted through an opening of the blast furnace while disposing the opening portion on a side of ...

METHOD AND APPARATUS FOR DETERMINING THE GEOMETRICAL DIMENSIONS OF A VEHICLE WHEEL MOUNTED SUCH THAT IT CAN ROTATE ABOUT AN AXIS OF ROTATION

Method and related apparatus for determining the geometrical dimensions of a wheel, or at least one part of a wheel, with particular reference to vehicle wheels, in the context of a wheel maintenance process. This method uses contactless sensors which comprise a scanning radar system, preferably a millimeter-wave radar system, to scan the wheel, or at least one part of the wheel, quickly and accurately.

APPARATUS FOR ESTIMATING OBSTACLE SHAPE AND METHOD THEREOF

An obstacle shape estimating apparatus and a method thereof, includes: a processor configured to receive a the sensing signal from at least one ultrasonic sensor at a predetermined cycle, to generate positions of one or more obstacles according to distance values of an ultrasonic sensor by estimating the distance values of the ultrasonic sensor based on a sensing signal, and to generate obstacle shape information according to positions of remaining obstacles after deleting a position of an obstacle corresponding to a virtual distance value and a position of an obstacle which does not satisfy a validation condition among the positions of the one or more obstacles; and a storage configured to store data and an algorithm driven by the processor, and the obstacle shape information generated by the processor.

COORDINATE MEASURING APPARATUS AND METHOD FOR MEASURING AN OBJECT

PATTERN MEASURING METHOD

PURPOSE: To compute the size of the width of a pattern based on the angle formed with each cursor, by approximating the values of a plurality of positions obtained from an edge part, among the values of the positions corresponding to the width measuring positions to the values forming a straight line by a least square method. CONSTITUTION: The cursors K1 and K2 are moved to approximately intermediate points E and F of the lower part of the pattern. These positions are specified as width size position of the mark. The following operation is automatically performed. The specified positions of a point Po and cursors K1 and K2 are automatically read by the electronic computer 4. Relations between the specified positions and the peak to peak value a/b and a'/b are computed and memorized. Then the scanning position P1 is scanned at a minute interval. Curves θ and θ' formed by coordinate values from the edge part are approximated to a straight line by the least square method. The angle θ and θ ...

METHOD AND APPARATUS FOR DETECTING PATTERN EDGE

PURPOSE: To obtain the position of the pattern edge with high accuracy by using a secondary electron generating model, in which the interaction of a sample substance and electron beams is considered, in order to make the shape of an actual edge and a signal waveform correspond to each other, previously obtaining a waveform generated at the position of the edge theoretically and comparing the waveform with an actual scanning waveform. CONSTITUTION: Clocks generated in a clock generating circuit 39 are transmitted over an electron-beam deflection circuit 40, and deflected in succession in response to the number of clocks, beams from an electron gun are irradiated to the edge, and the edge is scanned crossingly. Clocks are also transmitted over an AD converter 44 through a gate 42 at the same time, and secondary electrons generated through the irradiation of the beams are detected by a detector 43, and fed to a shift register 45 as a digital value. A gate 46 is opened by using a close signal ...

SCANNING ELECTRON MICROSCOPE AND MANUFACTURE OF SEMICONDUCTOR ELEMENT BY IT

PURPOSE: To observe the shape or residue at the bottom section of a deep hole by using high-energy primary electrons generating reflected electrons at the bottom section of the hole with the energy to penetrate the side wall of the hole. CONSTITUTION: When high-energy primary electrons 4 are radiated into a hole, generated secondary electrons 2 are absorbed by the side wall, however reflected electrons 6 penetrate the side wall and go out from the surface. Secondary electrons (called tertiary electrons 5) are again generated when the reflected electrons 6 pass the surface. When the tertiary electrons 5 are detected, the image in the hole can be obtained. COPYRIGHT: (C)1992,JPO&Japio ...

Verfahren zur Abstandsmessung und Konturerfassung mittels Mikrowellen

A method and a device for surface determination by means of microwaves

Method and apparatus for measuring bowing of single-crystal substrate

At least two values of an X-ray irradiation width are set for a single specimen. A rocking curve is measured for each of the X-ray irradiation widths. A value of a rocking curve width is determined for each of the rocking curves. The values of the X-ray irradiation width and the values of the rocking curve width are plotted on a planar coordinate system having a vertical axis representing the rocking curve width value and a horizontal axis representing the X-ray irradiation width value, and a rocking curve width shift line is determined based on the plotted points. A gradient of the rocking curve width shift line is determined. A curvature radius of the specimen is determined based on the gradient. The amount: of bowing of a single-crystal substrate under measurement can be measured without a need to move the single-crystal substrate for reliable measurement with a small amount of error.

Device and method for scanning items

EINRICHTUNG ZUR KONTINUIERLICHEN BERUEHRUNGSLOSEN VERMESSUNG DER SCHIENENKOPFOBERFLAECHEN EINES VERLEGTEN GLEISES

MECHANISM FOR THE CONTINUOUS CONTACTLESS MEASUREMENT OF THE RAIL HEAD SURFACES OF A MOVED TRACK

INSPECTION METHOD UTILIZING VERTICAL SLICE IMAGING

An inspection method (X-ray laminography or tomography) utilizing vertical slice imaging. A number of horizontal slice images, extending through an object of interest, are acquired. A vertical region of interest is defined from the data representing the horizontal slice images. A vertical slice image is constructed based upon the horizontal slice image data falling within the vertical region of interest. The vertical slice image data may be analyzed to detect defects. In addition, a method is provided to detect defects in a BGA (ball grid array) joint. The method includes locating a center of the joint. The method may further include measuring a number of diameters through the center of the joint and applying a rule to compare the measured diameters to an expected diameter.

A METHOD OF GENERATING A THREE DIMENSIONAL SURFACE PROFILE OF A FOOD OBJECT

This invention relates to method of generating a three dimensional surface profile of a food object, where the food object is exposed with a conical X-ray beam while the food object is conveyed. The attenuation of the X-rays after penetrating through the food object is detected, the detection being performed using a plurality of sensors arranged below the food object, the plurality of sensors being positioned at a pre-determined angular positions in relation to the X-ray source. For each of the plurality of sensors, the detected attenuation is converted into a penetration length of the X-ray beam, the penetration length indicating the length from where the X-ray beam enters and leaves the food object, and surface coordinates are sequentially determined using the penetration lengths and the angular positions as input data.

SYSTEM FOR DETERMINING THE RELIEF OF A SURFACE FOR FILLING APETROCHEMICAL REACTOR WITH GRANULES

L invention concerne un système de détermination (22) du relief d une sur face de remplissage de granulés dans un réacteur pétrochimique, la direction de remplissage du réacteur définissant une direction verticale, le réacteur comprenant un axe vertical central (X), le système comprenant un émetteur ( 24) configuré pour être positionné au- dessus de la surface de remplissage d e façon à émettre un signal vers différents points de cette surface. Le syst ème comprend des moyens(26) de déplacement de l émetteur (24) selon un angle (?) par rapport à l axe central (X) du réacteur supérieur à 60°.

METHOD OF INSPECTING ABNORMALITY OCCURRING INSIDE PIPE AND APPARATUS FOR PRACTICING THE METHOD

A method of inspecting an abnormality occurring inside a pipe to be inspected and an apparatus for practicing the method, includes the steps of transmitting an electric wave having a predetermined frequency from an antenna of a transmitter located at a predetermined position inside the pipe, receiving the transmitted electric wave by an antenna of a receiver located at a predetermined position inside the pipe, and discriminating the characteristic of the received electric wave. The characteristic of the received electric wave is the intensity of the electric wave, and an attenuation amount is detected in the first example. On the other hand, the characteristic of the received electric wave is a time required to reflect the transmitted electric wave until it is received by the receiver, and a time interval between transmission of the electric wave and reception of the reflected electric wave is measured in the second example.

PROCEDE D'ALIGNEMENT D'UN DETECTEUR DE RAYONS-X A RESEAU LINEAIRE

UN DISPOSITIF D'INSPECTION RADIOGRAPHIQUE COMPREND UNE SOURCE DE RAYONS-X 12 POUR PRODUIRE UN FAISCEAU DIRIGE DE RAYONS-X ET UN DETECTEUR 14 A RESEAU LINEAIRE POUR MESURER L'INTENSITE DU RAYONNEMENT RECU ET GENERER DES SIGNAUX ELECTRIQUES REPRESENTATIFS DE CE RAYONNEMENT. UN PROCEDE POUR L'ALIGNEMENT DU DETECTEUR AVEC LE FAISCEAU DIRIGE DE RAYONS-X COMPREND LES ETAPES CONSISTANT A ENLEVER TOUTE PIECE ENTRE LA SOURCE DE RAYONS-X ET LE DETECTEUR, OUVRIR UN LIMITEUR DE FAISCEAU DE RAYONS-X, POSITIONNER LE DETECTEUR POUR OBTENIR UN SIGNAL MAXIMUM EN PROVENANCE DE CHAQUE ELEMENT DU DETECTEUR, REDUIRE L'OUVERTURE DU LIMITEUR DE FAISCEAU DE RAYONS-X, DETECTER SI UN SIGNAL EN PROVENANCE D'UN ELEMENT DU DETECTEUR EST REDUIT, DEPLACER LE LIMITEUR POUR PRODUIRE UN SIGNAL MAXIMUM POUR CHAQUE ELEMENT, FIXER LE LIMITEUR DE FAISCEAU DE RAYONS-X, ET POSITIONNER LE RESEAU DE DETECTEURS POUR OBTENIR UN SIGNAL MAXIMUM. APPLICATION AUX SYSTEMES D'INSPECTION DE PIECES, PAR EXEMPLE POUR L'EVALUATION DES AUBES ...

주사 전자 현미경 시스템 및 그것을 이용한 패턴 계측 방법 및 주사 전자 현미경

... 본 발명의 주사 전자 현미경은, 가속 전압 30㎸ 이상의 1차 전자선(102)을 시료(200)에 조사하고, 상기 시료로부터 발생하는 저각(예를 들면 앙각 5도 이상)의 후방 산란 전자(BSE)를 검출한다. 이에 따라, 상기 시료의 구멍부의 구멍 바닥에서 발생하며, 상기 구멍부의 측벽(200)을 관통한 "관통 BSE(110)"를 이용해서 상기 구멍 바닥의 관찰을 행할 수 있다. 또한, 구멍이 깊으면 관통 거리가 상대적으로 길어지므로, 관통 BSE의 양이 줄어 상이 어둡게 된다고 하는 특성을 이용해서, 구멍 깊이 vs 밝기의 검량선을 만들어, 구멍 깊이의 계측을 행한다. 이에 따라, 3D-NAND의 구멍 뚫기 공정으로 대표되는 초고(超高) 어스팩트비의 구멍의 개구/비 개구의 판정, 또는 구멍의 탑 직경/바텀 직경을 검사·계측하는 것이 가능해진다.

MICROSTRUCTURE INSPECTION METHOD, MICROSTRUCTURE INSPECTION APPARATUS, AND MICROSTRUCTURE INSPECTION PROGRAM STORAGE MEDIUM

패턴 검사·계측 장치 및 프로그램

... 검사 또는 계측 대상의 패턴을 촬상해서 얻어진 화상 데이터로부터 추출한 에지의 위치를 사용한 검사 또는 계측에 있어서, 노이즈 등의 영향을 저감해서 검사 또는 계측 결과의 신뢰성을 향상시키는 패턴 검사·계측 장치를 제공한다. 이 를 위해서, 검사 또는 계측 대상 패턴을 촬상해서 얻어진 화상 데이터로부터 에지 추출 파라미터를 사용해서 추출한 에지의 위치를 사용하여 검사 또는 계측 대상 패턴의 검사 또는 계측을 행하는 패턴 검사·계측 장치에 있어서, 검사 또는 계측의 기준이 되는 형상을 나타내는 기준 패턴과 상기 화상 데이터를 사용해서 상기 에지 추출 파라미터를 생성하는 것을 특징으로 한다.

Evaluating an object

A method for evaluating an object, the method may include acquiring, by a charged particle beam system, an image of an area of a reference object, wherein the area includes multiple instances of a structure of interest, and the structure of interest is of a nanometric scale; determining multiple types of attributes from the image; reducing a number of the attributes to provide reduced attribute information; generating guidelines, based on the reduced attribute information and on reference data, for evaluating the reduced attribute information; and evaluating an actual object by implementing the guidelines.

Multipoint thickness measurement system

A multipoint thickness measurement system is provided to reduce the difference about the sensitivity for radiation of an ionization chamber in the width direction and to accurately measure the thickness of a board. An ionization chamber (5) is arranged in a detecting section (2) and turned around in the clockwise or counterclockwise direction in relation to the direction in which an object (4) to be measured flows. Thereby, a low sensitive region for the radiation existing in conventional arrangement of the ionization chamber is eliminated, and the measurement of the object to be measured is carried out continuously and accurately in the width direction.

X-RAY TOMOGRAPHY BGA (BALL GRID ARRAY) INSPECTIONS

An inspection method (X-ray laminography or tomography) utilizing vertical slice imaging. A number of horizontal slice images, extending through an object of interest, are acquired. A vertical region of interest is defined from the data representing the horizontal slice images. A vertical slice image is constructed based upon the horizontal slice image data falling within the vertical region of interest. The vertical slice image data may be analyzed to detect defects. In addition, a method is provided to detect defects in a BGA (ball grid array) joint. The method includes locating a center of the joint. The method may further include measuring a number of diameters through the center of the joint and applying a rule to compare the measured diameters to an expected diameter.

Method of aligning a linear array X-ray detector

An X-ray inspection system includes an X-ray source for generating a directed X-ray beam and a linear array detector for measuring the intensity of the received radiation and generating electrical signals representative thereof. A method for aligning the detector with the directed X-ray beam includes removing any part between the X-ray source and the detector, opening an X-ray beam limiter, positioning the linear array detector for maximum signal from each detector element, reducing the X-ray beam limiter opening, detecting whether any signal from a detector element is reduced, moving the limiter for producing a maximum signal on each signal, securing the X-ray beam limiter, and positioning the detector array for maximum signal.

MEASUREMENT METHOD, IMAGE PROCESSING DEVICE, AND CHARGED PARTICLE BEAM APPARATUS

An error of an outline point due to a brightness fluctuation cannot be corrected by a simple method such as a method of adding a certain amount of offset. However, in recent years as the miniaturization of the pattern represented by a resist pattern has progressed, it has been difficult to appropriately determine a region that serves as a reference. An outline of the resist pattern is extracted from an image of the resist pattern obtained by a charged particle beam apparatus in consideration of influence of the brightness fluctuation. That is, a plurality of brightness profiles in the vicinity of edge points configuring the outline are obtained and an evaluation value of a shape of the brightness profile in the vicinity of a specific edge is obtained based on the plurality of brightness profiles, and the outline of a specific edge point is corrected, based on the evaluation value.

Pattern shape evaluation method and pattern shape evaluation apparatus

An image of the joint portion of circuit patterns manufactured using a design pattern for double patterning is read out. Target boundary lines and evaluation regions are set on the image. In the evaluation regions, image processing is performed along the directions of the target boundary lines. Furthermore, binarization processing is performed. A decision is made based on an image obtained in this way as to whether the patterns have defects.

Method of extracting contour lines of image data obtained by means of charged particle beam device, and contour line extraction device

The present invention is intended to provide a contour extraction method and a contour extraction device with an objective of either suppression of unnecessary contouring processings or selective contouring of necessary portions. To attain the objective, provided are a contour extraction method, and a device, with which contours of pattern edges on an image formed based on charged particles emitted from a sample are extracted and, when contouring of a pattern located in an overlapping region provided in connecting images of plural image-capturing regions to form a synthesized image is performed, either areas of the pattern in the plurality of image-capturing regions, or a pre-set measurement portion is found, and selective contour extraction of the pattern with respect to an image of an image-capturing region is carried out either on a side where the area is large, or on a side where a measurement portion regarding the pattern is located.

Device and method for image reconstruction at different X-ray energies, and device and method for X-ray three-dimensional measurement

The present invention provides a device and a method for image reconstruction at different X-ray energies that make it possible to achieve image reconstruction with higher accuracy. A device for image reconstruction at different X-ray energies includes: an X-ray source 1 that irradiates a specimen to be imaged 2 with X-rays; an energy-dispersive detector 4 that detects a characteristic X-ray emitted from the specimen to be imaged 2; a signal processing means that quantifies the peak of the characteristic X-ray detected by the detector 4; and an image reconstruction means that reconstructs an image on the basis of a signal from the signal processing means.

Material analysis method

A material analysis method is provided. A plurality of wafers processed from a plurality of ingots are measured by a measuring instrument to obtain an average of a bow of each of the wafers processed from the ingots and a plurality of full widths at half maximum (FWHM) of each of the wafers. Key factors respectively corresponding to the ingots are calculated according to the FWHM of the wafers. A regression equation is obtained according to the key factors and the average of the bows.

METHOD AND ARRANGEMENT FOR INVESTIGATION OF AN OBJECT TO BE MEASURED BY MEANS OF INVASIVE RADIATION

Pattern configuration measuring apparatus

A pattern configuration measuring method of and apparatus for measuring a cross sectional profile of a pattern (10) formed on a flat plane with a concave or convex structure having a taper portion (10a, 10b) on both sides thereof, by scanning a beam in a predetermined direction with a scanning electron microscope (1), detecting a secondary electron to acquire an image signal of the pattern, and processing the image signal. The column (1a) of the scanning electron microscope is set at an optional inclination angle relative to the flat plane formed with the pattern, a beam is scanned onto the pattern with the scanning electron microscope in the direction perpendicular to the longitudinal direction of the concave or convex structure, an output signal is acquired from the scanning electron microscope and image-processed to detect both the taper portions of the pattern and calculate the dimension of the pattern, a beam is scanned onto the pattern with the scanning electron microscope in the ...

СПОСОБ РЕНТГЕНОВСКОЙ МИКРОСКОПИИ ДЛЯ ОЦЕНКИ ФОРМЫ ОТВЕРСТИЙ И РАЗМЕРОВ ХИРУРГИЧЕСКИХ ИГЛ

Использование: для оценки формы и размеров отверстий хирургических игл посредством рентгеновской микроскопии. Сущность изобретения заключается в том, что направляют рентгеновский пучок излучения от генератора рентгеновского излучения на проксимальный конец хирургической иглы, содержащий высверленное лазером отверстие, получают в цифровой форме изображение проксимального конца иглы, включающее изображение отверстия, с помощью датчика, на который падает рентгеновское излучение, при этом проксимальный конец иглы располагается между генератором рентгеновского излучения и датчиком, и обрабатывают цифровое изображение для определения отклонения отверстия от стандартных размеров, установленных спецификацией. Технический результат: обеспечение возможности оценки просверленных отверстий в условиях высокоскоростного производства, подходящих для контроля лазерного сверления. 2 н. и 18 з.п. ф-лы, 14 ил.

Dreidimensionale Rekonstruktion rasterelektronenmikroskopischer Abbildungen durch Anpassung der optischen Photogrammetrie

Erzeugung dreidimensionaler (3D) Oberflächenmodelle von rasterelektronenmikroskopischen Proben ist aufwändig und führt zu einer Zerstörung der Proben. Das neue Verfahren führt zu einer unkomplizierten und zerstörungsfreien 3D Rekonstruktion der Probenoberfläche. Bei der optischen Photogrammetrie wird ein sich nicht bewegendes Objekt von einer Kamera kreisförmig umfahren und überlappende Fotos aufgenommen. Die Erfindung ist die Übertragung der optischen Photogrammetrie auf die Bedürfnisse der Rasterelektronenmikroskopie: Der Detektor des REM entspricht der optischen Kamera. Statt den fest eingebauten Detektor zu bewegen wird das Präparat schrittweise gedreht und auf diese Weise werden sich überlappende Bilder aufgenommen. Um die die Oberfläche des Präparates möglichst vollständig aufnehmen zu können, wird das Präparat dafür leicht gekippt, siehe Zeichnung der Zusammenfassung. Die weiteren Schritte der Rekonstruktion entsprechen denen der optischen Photogrammetrie und nutzen die für optische ...

STRAHLUNGSDETEKTIONSVORRICHTUNG, COMPUTERPROGRAMM, UND POSITIONIERVERFAHREN

Vorgesehen sind eine Strahlungsdetektionsvorrichtung, ein Computerprogramm und ein Positionierverfahren, die die Genauigkeit der Positionierung ohne Einsatz eines Lasers verbessern kann. Die Strahlungsdetektionsvorrichtung umfasst: eine Probenhalteeinheit; ein optisches Mikroskop, das so konfiguriert ist, dass es eine von der Probenhalteeinheit gehaltene Probe beobachtet; eine Bestrahlungseinheit, die die von dem optischen Mikroskop beobachtete Probe mit Strahlung bestrahlt; eine Detektionseinheit, die die von der mit der Strahlung bestrahlten Probe erzeugte Strahlung detektiert; eine Einstelleinheit, die eine Beziehung zwischen einer Fokalposition des optischen Mikroskops und einer Position der Probe so einstellt, dass das optische Mikroskop auf einen Abschnitt der Probe fokussiert ist; eine Änderungseinheit, die eine Position, auf die das optische Mikroskop fokussiert werden soll, auf der Probe ändert; eine Abbildungseinheit, die ein Teilbild erzeugt, das durch das optische Mikroskop ...

Rasterelekronenmikroskop und Bilderzeugungsverfahren

KALIBRIERVERFAHREN EINER RÖNTGEN-MESSVORRICHTUNG

Ein Kalibrierverfahren einer Röntgen-Messvorrichtung beinhaltet: einen Berechnungsschritt einer Merkmalsposition einer vorderen Stufe eines parallelen Bewegens von Kugeln 106, welche an N Stellen angeordnet werden, mehrere Male, und eines Identifizierens von Schwerpunktpositionen ImPos(1..Q)_Dis(1..M)_Sphr_(1..N)) von projizierten Bildern der Kugeln 106 an den N Stellen; einen Berechnungsschritt einer individuellen Matrix eines Berechnens einer individuellen Projektionsmatrix PPj (j=1..Q) für jede der Kugeln 106; einen Berechnungsschritt einer individuellen Position eines Berechnens von Bewegungspositionen Xb der Kugeln 106 auf der Basis der individuellen Projektionsmatrix PPj (j=1..Q); einen Koordinaten-Integrationsschritt eines Berechnens von bestimmten relativen Positionsabständen X(1..N) der Kugeln 106; einen Berechnungsschritt einer Merkmalsposition einer hinteren Stufe; einen Berechnungsschritt einer Transformationsmatrix eines Berechnens einer projektiven Transformationsmatrix Hk ...

METHOD OF ALIGNING A LINEAR ARRAY X-RAY DETECTOR

Method and device for determining the geometry of structures by means of computer tomography

Method and device for correcting computed tomography measurements comprising a coordinate measuring machine

VERFAHREN UND VORRICHTUNG ZUR BERECHNUNG EINER OBERFLÄCHE EINES FÜLLGUTS EINES BEHÄLTERS

The invention relates to a method and a device (1) for calculating a surface (3') of a filling material (4) of a container (7), comprising an antenna unit (27), which comprises a plurality of antennas (9) arranged in a housing (7), in particular next to each other, for transmitting and receiving electromagnetic signals (1', 1''), in particular radar signals, which are reflected on at least two different partial regions (A1 to A2) of the filling material surface (31), and comprising a calculating unit (28) connected to the antenna unit (27) for calculating the surface (3') of the filling material (4) from the data (29) dependent at least on the transmitted and received electromagnetic signals (11, 1''). In order to create advantageous design conditions, it is proposed for the antenna unit (27) to transmit electromagnetic signals (1') reflected on all partial regions (A1 to AN) of the filling material surface (3') to be determined, wherein the device (1) comprises a controller (31) that is ...

VERFAHREN UND VORRICHTUNG ZUR BERECHNUNG EINER OBERFLÄCHE EINES FÜLLGUTS EINES BEHÄLTERS

The invention relates to a method and a device (1) for calculating a surface (3') of a filling material (4) of a container (7), comprising an antenna unit (27), which comprises a plurality of antennas (9) arranged in a housing (7), in particular next to each other, for transmitting and receiving electromagnetic signals (1', 1''), in particular radar signals, which are reflected on at least two different partial regions (A1 to A2) of the filling material surface (31), and comprising a calculating unit (28) connected to the antenna unit (27) for calculating the surface (3') of the filling material (4) from the data (29) dependent at least on the transmitted and received electromagnetic signals (11, 1''). In order to create advantageous design conditions, it is proposed for the antenna unit (27) to transmit electromagnetic signals (1') reflected on all partial regions (A1 to AN) of the filling material surface (3') to be determined, wherein the device (1) comprises a controller (31) that is ...

Spin-split scanning electron microscope

Radiation inspection apparatus and radiation inspection method

INSPECTION METHOD FOR A MANUFACTURED ARTICLE AND SYSTEM FOR PERFORMING SAME

A method for performing inspection of a manufactured article. The method comprises acquiring a sequence of radiographic images of the article; determining a position of the article for each one of the acquired radiographic images; and performing a three- dimensional model correction loop which comprises, iteratively: generating a simulated radiographic image for each determined position of the article; and comparing the simulated radiographic images and the acquired radiographic images and generating a match result. If the match result is indicative of a mismatch, the method includes identifying and characterizing differences between the simulated radiographic images and the acquired radiographic images; correcting one of a geometry and a material density of a region of interest of the detailed three- dimensional model of the article based on each one of the identified and characterized differences; and performing a new iteration. A system for performing inspection is also provided.

MEASURING SYSTEM AND METHOD FOR MEASURING A MEASURED OBJECT, IN PARTICULAR, A PLASTICS PROFILE

The invention relates to a measurement system (2) for measuring a measurement object, in particular a plastic profile (3), wherein the measurement system (2) has: - an antenna arrangement (4) comprising a plurality of THz transceivers (5) which each occasionally actively emit a THz transmission beam (6) and occasionally passively receive reflected THz radiation (11), - wherein the antenna arrangement (4) outputs measurement signals (S1) from the measurements of the THz transceivers (5), - an adjustment device (12) for adjusting the antenna matrix (4) in a plurality of measurement positions (MP1, MP2, MP3) along an adjustment direction (m1, m2), for example a circular arcuate path around the measurement object (3), - a control and evaluation device (14) for receiving and evaluating the measurement signals (S1) which is configured in such a manner that the measurement signals (S1) from the plurality of THz transceivers (5) in the plurality of measurement positions (MP1, MP2,...) are evaluated ...

SYSTEM FOR DETERMINING THE RELIEF OF A SURFACE FOR FILLING A PETROCHEMICAL REACTOR WITH GRANULES

L invention concerne un système de détermination (22) du relief d une surface de remplissage de granulés dans un réacteur pétrochimique, la direction de remplissage du réacteur définissant une direction verticale, le réacteur comprenant un axe vertical central (X), le système comprenant un émetteur (24) configuré pour être positionné au- dessus de la surface de remplissage de façon à émettre un signal vers différents points de cette surface. Le système comprend des moyens(26) de déplacement de l émetteur (24) selon un angle (?) par rapport à l axe central (X) du réacteur supérieur à 60°.

DETERMINING THE SHAPE AND ORIENTATION OF A BOREHOLE

A method and apparatus (10) are provided for estimating the cross-sectional shape and orientation of an earth borehole (12) and the motion of a tool therein. The method and apparatus involve measuring the distance (30) from the tool to the borehole wall at a plurality of locations around the periphery of the tool and fitting those measured distances to a predetermined shape function using a nonlinear parameter estimation technique to minimize the error between the estimated shape of the borehole and the measured distances. The method and apparatus may be used to estimate elliptical and higher order borehole shapes. Additionally, the method and apparatus may be used while drilling the borehole.

Fill level measuring device

DEVICE OF SETTING IN COINCIDENCE OF the AXIS Of a PROBE OF MEASUREMENT WITH a NORMAL ON the SURFACE Of a PART TO BE CONTROLLED AND APPLICATION TO MEASUREMENTS THIN THICKNESSES OF LAYERS

DETERMINATION OF the SHAPE Of a SAMPLE BY the MEASUREMENT OF the SLOPE Of UNESURFACE BY MEANS OF an ELECTRON MICROSCOPE HAS SWEEPING

Apparatus for removing fish bones using information about fish bones measured through a sensor

PATTERN MEASUREMENT DEVICE AND COMPUTER PROGRAM

Visualization of three-dimensional semiconductor structures

A semiconductor metrology tool inspects an area of a semiconductor wafer. The inspected area includes a plurality of instances of a 3D semiconductor structure arranged periodically in at least one dimension. A computer system generates a model of a respective instance of the 3D semiconductor structure based on measurements collected during the inspection. The computer system renders an image of the model that shows a 3D shape of the model and provides the image to a device for display.

IMAGE-FORMING DEVICE, AND DIMENSION MEASUREMENT DEVICE

The objective of the present invention is to provide an image-forming device and the like that enable the formation of an appropriate integrated signal, even when obtaining an image or a signal waveform of a pattern which can be difficult to appropriately match, such as a repeating pattern or a shrinking pattern. In order to achieve said objective, proposed is an image-forming device that integrates a plurality of image signals to form an integrated image, said image-forming device being provided with: a matching processing unit that carries out matching processing between the plurality of image signals; an image integration unit that integrates the plurality of image signals that have been aligned by the matching processing unit; and a periodicity determination unit that determines the periodicity of the pattern included in the image signal. The matching processing unit alters the size of the image signal region subjected to matching in accordance with the determination made by the periodicity ...

Measuring dimensions of sections

To measure the dimensions of an elongate section such as a rolled or extruded section, two fixed observation points are chosen so that the elongate section lies between them. Two directional telemeters are arranged to measure the distance from the respective observation points to the section along a directional axis which is pivotable about a pivot axis passing through the corresponding observation point and extending along the elongate section; the observation points and directional axes lie in a single plane transverse to the elongate section, and the intersection of this plane with the elongate section has a periphery which is the sectional contour of the elongate section. The sectional contour is scanned by means of the telemeters by pivoting the directional axes about the pivot axes. The distance and direction of a plurality of points on the sectional contour with respect to the corresponding observation point are recorded. The dimensions of the elongate section are computed from the ...

SAMPLE DIMENSION INSPECTING/MEASURING METHOD AND SAMPLE DIMENSION INSPECTING/MEASURING APPARATUS

One of principal objects of the present invention is to provide a sample dimension measuring method for detecting the position of an edge of a two-dimensional pattern constantly with the same accuracy irrespective of the direction of the edge and a sample dimension measuring apparatus. According to this invention, to accomplish the above object, it is proposed to correct the change of a signal waveform of secondary electrons which depends on the direction of scanning of an electron beam relative to the direction of a pattern edge of an inspection objective pattern. It is proposed that when changing the scanning direction of the electron beam in compliance with the direction of a pattern to be measured, errors in the scanning direction and the scanning position are corrected. In this configuration, a sufficient accuracy of edge detection can be obtained irrespective of the scanning direction of the electron beam.

Full beam metrology for X-ray scatterometry systems

Methods and systems for characterizing dimensions and material properties of semiconductor devices by full beam x-ray scatterometry are described herein. A full beam x-ray scatterometry measurement involves illuminating a sample with an X-ray beam and detecting the intensities of the resulting zero diffraction order and higher diffraction orders simultaneously for one or more angles of incidence relative to the sample. The simultaneous measurement of the direct beam and the scattered orders enables high throughput measurements with improved accuracy. The full beam x-ray scatterometry system includes one or more photon counting detectors with high dynamic range and thick, highly absorptive crystal substrates that absorb the direct beam with minimal parasitic backscattering. In other aspects, model based measurements are performed based on the zero diffraction order beam, and measurement performance of the full beam x-ray scatterometry system is estimated and controlled based on properties ...

Image-Forming Device, and Dimension Measurement Device

An image forming device is provided that is capable of forming a proper integrated signal even when an image or a signal waveform is acquired from a pattern having the possibility of preventing proper matching, such as a repetition pattern, a shrinking pattern, and the like. In particular, the image forming device forms an integrated image by integrating a plurality of image signals and is provided with: a matching processing section that performs a matching process between the plurality of image signals; an image integration section that integrates the plurality of image signals for which positioning has been performed by the matching processing section; and a periodicity determination section that determines a periodicity of a pattern contained in the image signals. The matching processing section varies a size of an image signal area for the matching in accordance with a determination by the periodicity determination section.

METHOD FOR ANALYZING A SEMICONDUCTOR DEVICE

A method for analyzing a semiconductor device includes repeatedly etching an entire surface of a wafer at a same etch rate by a target depth to expose a next surface of the wafer. The method includes obtaining two-dimensional structure information from each repeatedly etched surface of the wafer and serially stacking the repeatedly obtained two-dimensional structure information to generate a three-dimensional image. 1. A method of analyzing a semiconductor device , the method comprising:repeatedly etching an entire surface of a wafer at a same etch rate by a target depth to expose a next surface of the wafer;obtaining two-dimensional structure information from each repeatedly etched surface of the wafer; andserially stacking the repeatedly obtained two-dimensional structure information to generate a three-dimensional image.2. The method of claim 1 , wherein obtaining the two-dimensional structure information comprises:obtaining two-dimensional physical information of the wafer; andobtaining two-dimensional electrical information of the wafer.3. The method of claim 1 , wherein obtaining two-dimensional structure information comprises classifying the two-dimensional images by target depths and two-dimensional coordinates (X claim 1 , Y).4. The method of claim 3 ,wherein the two-dimensional structure information is serially stacked based on the target depths and the two-dimensional coordinates.5. The method of claim 1 , further comprising analyzing byproducts generated in etching the wafer.6. The method of claim 5 , wherein an amount of the byproducts is analyzed to control the target depth.7. The method of claim 1 , further comprising cleaning the etched surface of the wafer between repeated etchings of the surface of the wafer and obtaining the two-dimensional structure information.8. A method of analyzing a wafer on which a semiconductor device is formed claim 1 , the method comprising:repeatedly etching an entire surface of a wafer by a target depth to expose a ...

СИСТЕМА РЕГИСТРАЦИИ ОБЪЕМА ЗАГРУЖАЕМОГО МАТЕРИАЛА, ИМЕЮЩАЯ НЕСКОЛЬКО РАДИОЛОКАЦИОННЫХ ДАТЧИКОВ

Изобретение касается системы измерения уровня наполнения для регистрации топологии поверхности загружаемого материала или объема загружаемого материала в емкости, способа регистрации топологии поверхности загружаемого материала или объема загружаемого материала в емкости и компьютерно-читаемого носителя данных. Система измерения уровня наполнения для регистрации топологии поверхности загружаемого материала или объема загружаемого материала в емкости содержит первое устройство (101) измерения уровня наполнения, которое выполнено в качестве главного устройства, и второе устройство (102, 103) измерения уровня наполнения, которое выполнено в качестве подчиненного устройства и которое необходимо подключать к главному устройству на некотором пространственном расстоянии от главного устройства. При этом главное устройство выполнено для передачи сигналов управления подчиненному устройству для управления подчиненным устройством. Техническим результатом является создание эффективной и гибкой системы ...

СПОСОБ И АППАРАТ ДЛЯ ОПРЕДЕЛЕНИЯ ИНФОРМАЦИИ О РАЗМЕРЕ ПИЩЕВЫХ ИНГРЕДИЕНТОВ

Изобретение относится к способу и аппарату для определения информации о размере пищевых ингредиентов. Способ содержит этап приложения (110) к пищевым ингредиентам электрического поля, имеющего заданную радиочастоту, причем это электрическое поле генерируют посредством источника, расположенного в непосредственной близости к пищевым ингредиентам, первый этап измерения (120) отношения между энергией электрического поля, отраженного от пищевых ингредиентов, и энергией электрического поля, сгенерированного упомянутым источником и приложенного к пищевым ингредиентам. Способ также содержит первый этап определения (130) средней толщины пищевых ингредиентов вдоль направления электрического поля, приложенного к пищевым ингредиентам, на основании упомянутого отношения, второй этап измерения (140) отношения (R2) между энергией электрического поля, отраженного от пищевых ингредиентов, и энергией электрического поля, приложенного к пищевым ингредиентам, для множества расстояний между источником электрического ...

СПОСОБ ИЗМЕРЕНИЯ ВНУТРЕННЕГО ОБЪЕМА ОБЪЕКТА

Использование: для измерения внутреннего объема объекта. Сущность изобретения заключается в том, что при измерении внутреннего объема неметаллического объекта, содержащего металлические элементы, выполняют следующие операции: внутренний объем объекта заполняют наполнителем многократного использования, объект бесконтактно сканируют с использованием компьютерного томографа, результаты сканирования используют для автоматизированного построения трехмерной модели внутреннего объема объекта, внутренний объем объекта измеряют с использованием компьютерной обработки полученной трехмерной модели, при этом рентгеновская плотность наполнителя отлична от рентгеновской плотности объекта и в качестве наполнителя используют кварцевый песок для избежания артефактов от металлических элементов на изображении объекта. Технический результат - измерение внутреннего объема объекта, обеспечивающее автоматизированное получение трехмерной модели внутреннего объема объекта, в том числе с незамкнутым контуром внутреннего ...

УСТРОЙСТВО ДЛЯ ДЕТЕКТИРОВАНИЯ ТОЛЩИНЫ И ПЛОСКОСТНОСТИ ПЛАСТИН И ПОЛОС

Изобретение относится к устройству для детектирования толщины и плоскостности пластин и полос в области применения ядерных технологий. Устройство включает C-образную раму, два источника излучения, установленные на верхнем плече C-образной рамы и расположенные с некоторым интервалом в направлении ширины стальной пластины/полосы, два ряда матриц детекторов - газонаполненных ионизационных камер, установленных на нижнем плече С-образной рамы и расположенных с некоторым интервалом в направлении движения пластины/полосы, коллиматоры, установленные ниже двух источников излучения, причем коллиматоры позволяют излучению от каждого источника облучать только соответствующий ряд детекторов, модули предварительных усилителей, соединенные с матрицами детекторов, устройство сбора данных, соединенное с модулями предварительных усилителей, компьютер для обработки и отображения данных, соединенный с устройством сбора данных, и систему подачи охлаждающей воды и сжатого воздуха, и систему управления для обеспечения ...

Verfahren und Vorrichtung zum Vermessen eines rohrförmigen Strangs

Verfahren zum Vermessen eines aus einer Extrusionsvorrichtung (10, 110, 210) austretenden rohrförmigen Strangs (16, 116, 216), dadurch gekennzeichnet, dass von mindestens einer Strahlungsquelle elektromagnetische Strahlung im Frequenzbereich von 1 GHz bis 6000 GHz von innen auf die Innenseite (36) des rohrförmigen Strangs (16, 116, 216) geleitet wird, dass durch den rohrförmigen Strang (16, 116, 216) reflektierte elektromagnetische Strahlung von mindestens einem Strahlungsempfänger empfangen wird, dass aus der empfangenen elektromagnetischen Strahlung der Durchmesser und/oder die Wandstärke und/oder Formabweichungen des rohrförmigen Strangs (16, 116, 216) ermittelt wird, dass die elektromagnetische Strahlung auf mehrere über den Innenumfang des rohrförmigen Strangs (16, 116, 216) verteilte Messbereiche der Innenseite (36) des rohrförmigen Strangs (16, 116, 216) geleitet wird, und dass die elektromagnetische Strahlung mit mindestens einem im Inneren des rohrförmigen Strangs (16, 116, 216 ...

Measurement device for rotating object, especially tool, workpiece, or machine part

The device includes a transmitter and a receiver (6) for transmitting and/or receiving electromagnetic radiation, as well as an evaluation unit (7) which detects frequency differences between a transmitted signal and a corresponding received signal. The frequencies are preferably chosen in the radar- and/or microwave range, and the receiver is arranged in a certain angle with respect to a rotation axis (5) of the object (4) to be measured. An Independent claim is provided for a corresponding measurement method.

Instrumental method of detecting three=dimensional objects

The method for measurement engineering determination of three dimensional objects, carried out, so that a wave propagating in one direction is split in several partial waves, which are radiated in different directions, and are delayed compared to each other. Several waves merging from different directions onto one point are conveyed in a common propagation direction. Waves radiated in different directions are differentiated by sequential modulation in the same system and in addition to time marking are also differentiated unambiguously from each other, and according to their reflection at an object, by one or more detectors. The detectors detect solid angle regions separated off from each other. The waves are also identified by characterising the waves using their radiation directions and their transit times.

Method and device for correcting computed tomography measurements, comprising a coordinate measuring machine

The invention relates to a device and a method for correcting the results of a computed tomography measurement of the geometry of a workpiece, the computed tomography sensor system, which consists at least of a radiation source, a two-dimensional detector and a mechanical axis of rotation for rotating the workpiece or component, being integrated into a coordinate measuring machine. To provide a simple and inexpensive method for carrying out a distortion correction, imaging errors present on the detector are corrected by measuring a calibration object in at least two relative positions between the calibration object and the detector.

Method and device for determining surfaces by means of microwaves

Vehicle inspection method, apparatus and system, and computer-readable storage medium

MECHANISM FOR THE CONTINUOUS CONTACTLESS MEASUREMENT OF THE RAIL HEAD SURFACES OF A MOVED TRACK

RÖNTGENTOMOGRAPHI BGA (BALL GRID ARRAY) EXAMINATIONS

X-RAY MICROSCOPY FOR CHARACTERIZING HOLE SHAPE AND DIMENSIONS IN SURGICAL NEEDLES

A novel method of characterizing laser drilled boreholes is disclosed. The method uses x-ray microscopy for dimensional characterization. The x- ray output may be processed to control manufacturing equipment in automated production systems, including laser drilling systems and swaging apparatus.

SYSTEM OF DETERMINATION OF the RELIEF Of a SURFACE OF FILLING OF GRANULES IN a PETROCHEMICAL ENGINE

THE INVENTION RELATES TO A DEVICE FOR MEASURING X-RAY MEASUREMENTS.

DISPOSITIF DE MISE EN COINCIDENCE DE L'AXE D'UNE SONDE DE MESURE AVEC UNE NORMALE A LA SURFACE D'UNE PIECE A CONTROLER ET APPLICATION AUX MESURES D'EPAISSEURS DE COUCHES MINCES

DISPOSITIF DE MISE EN COINCIDENCE DE L'AXE D'UNE SONDE DE MESURE AVEC UNE NORMALE A LA SURFACE D'UNE PIECE A CONTROLER ET APPLICATION AUX MESURES D'EPAISSEURS DE COUCHES MINCES. CE DISPOSITIF 5, FAISANT PARTIE AINSI QUE LA SONDE 4 D'UN APPAREIL DE MESURE COMPORTANT DES MOYENS DE POSITIONNEMENT DE LA PIECE 3, COMPREND: AU MOINS UN ORGANE 25 DE TRANSLATION DE LA SONDE PERMETTANT DE FAIRE VARIER SA DISTANCE A LA PIECE, DES MOYENS 53 DE PALPAGE SOLIDAIRES DE LA SONDE POUR CONTROLER LA MISE EN COINCIDENCE, DES MOYENS 43 DE ROTATION SELON UN AXE YY PERMETTANT DE DONNER A L'AXE A DE LA SONDE UNE DIRECTION VOISINE DE CELLE DE LADITE NORMALE N, ET DES MOYENS 44 D'OSCILLATION DE L'AXE A DE LA SONDE AUTOUR DE CETTE DIRECTION, DE FACON A ACHEVER LA MISE EN COINCIDENCE.

Radiation-counting, expandable probe for measuring borehole diameters - is lowered by cable to be opened at required depth

METHOD FOR DETERMINING THE INTENSITY VARIATIONS DIFFRACTED BY DIMENSIONAL ARRAY ALONG A DIRECTION ORGANIZES GIVEN

Method for Making a Numerical Three-Dimensional Model of a Structure of Soft and Hard Parts, Three-Dimensional Model and Carrier

The invention relates to a method for making a numerical three-dimensional model of a structure from relatively soft and relatively hard parts, comprising of making by means of penetrating radiation a plurality of numerical sections of the structure located at a mutual distance and representing the absorption for the radiation, storing in a memory the numerical sections and constructing a numerical three-dimensional model of the structure on the basis of the numerical sections stored in the memory, wherein at least during making of the sections at least a part of the relatively soft parts of the structure is provided with a layer of contrast agent with an absorption coefficient for the radiation differing substantially from that of the relatively soft parts.

Method of Extracting Contour Lines of Image Data Obtained By Means of Charged Particle Beam Device, and Contour Line Extraction Device

The present invention is intended to provide a contour extraction method and a contour extraction device with an objective of either suppression of unnecessary contouring processings or selective contouring of necessary portions. To attain the objective, provided are a contour extraction method, and a device, with which contours of pattern edges on an image formed based on charged particles emitted from a sample are extracted and, when contouring of a pattern located in an overlapping region provided in connecting images of plural image-capturing regions to form a synthesized image is performed, either areas of the pattern in the plurality of image-capturing regions, or a pre-set measurement portion is found, and selective contour extraction of the pattern with respect to an image of an image-capturing region is carried out either on a side where the area is large, or on a side where a measurement portion regarding the pattern is located.

Image generating method and device using scanning charged particle microscope, sample observation method, and observing device

In a process of acquiring an image of semiconductor patterns by using a scanning electron microscope (SEM), this invention provides an image generating method and device that allows a high-resolution SEM image to be produced while suppressing damages caused by SEM imaging to a sample as a result of irradiation of an electron beam. A plurality of areas having similarly shaped patterns (similar areas) are extracted from a low-resolution SEM image which has been imaged while suppressing the irradiation energy of electron beam. From the image data of the extracted areas a single high resolution image of the patterns is generated by image restoration processing. Further, the method of this invention also uses design data in determining the similar areas and the SEM imaging position and imaging range for performing the image restoration processing.

Component aperture location using computed tomography

An exemplary component measuring method includes determining a position of an aperture of a component using a computed tomography scan of a gage and a component. The gage is inserted into the aperture of the component during the computed tomography scan.

Pattern Dimension Measurement Method Using Electron Microscope, Pattern Dimension Measurement System, and Method for Monitoring Changes in Electron Microscope Equipment Over Time

Beforehand, the device characteristic patterns of each critical dimension SEM are measured, a sectional shape of an object to undergo dimension measurement is presumed by a model base library (MBL) matching system, dimension measurements are carried out by generating signal waveforms through SEM simulation by inputting the presumed sectional shapes and the device characteristic parameters, and differences in the dimension measurement results are registered as machine differences. In actual measurements, from the dimension measurement results in each critical dimension SEM, machine differences are corrected by subtracting the registered machine differences. Furthermore, changes in critical dimension SEM's over time are monitored by periodically measuring the above-mentioned device characteristic parameters and predicting the above-mentioned dimension measurement results. According to the present invention, actual measurements of machine differences, which require considerable time and effort, are unnecessary. In addition, the influence of changes in samples over time, which is problematic in monitoring changes in devices over time, can be eliminated.

Measuring apparatus and measuring method

In accordance with an embodiment, a measuring apparatus includes an electromagnetic wave applying unit, a detecting unit, a data processing unit, a film structure transforming unit, and a film structure measuring unit. The electromagnetic wave applying unit generates electromagnetic waves to apply it to a periodic structure of films on a substrate. The detecting unit detects the electromagnetic waves scattered or reflected by the substrate. The data processing unit calculates a surface shape of the periodic structure. The film structure transforming unit calculates a virtual film structure regarding the internal structure of the periodic structure. The film structure measuring unit calculates the thickness of each layer constituting the periodic structure by fitting a first reflectance profile by actual measurement regarding the periodic structure to a second reflectance profile obtained by a simulation using the virtual film structure to restructure the shape of the periodic structure.

Image processing device and computer program for performing image processing

It is an object of the present invention to provide an image processing device for allowing an actual-image-closer pattern to be formed based on the design data, or its simulation image. In order to accomplish the above-described object, the proposal is made concerning an image processing device which includes an image processing unit which sets the operation condition of a charged-particle beam device on the basis of the design data on a semiconductor element. Here, the image processing device accesses a library for storing device-condition information on the charged-particle beam device, pattern types, and a plurality of combinations of pattern information on each pattern-region basis. Moreover, the image processing device forms a composite image of each pattern region, using the pattern information on each pattern-region basis, and based on the device-condition information and the selection of a pattern type from the pattern types.

ELECTRON MICROSCOPE AND IMAGE CAPTURING METHOD USING ELECTRON BEAM

The present invention is characterized by an electron microscope which intermittently applies an electron beam to a sample and detects a secondary electron signal, wherein an arbitrarily defined detection time (T) shorter than the pulse width (Tp) of the applied electron beam is selected, and a secondary electron image is formed using the secondary electron signal acquired during the detection time. Consequently, it is possible to reflect necessary sample information including the internal structure and laminated interface of the sample in the contrast of an image and prevent unnecessary information from being superimposed on the image, thereby making it possible to obtain the secondary electron image with improved sample information selectivity and image quality. 1. In an image capturing method using electron beam that a sample is irradiated with an electron beam and an electron emitted from the sample is detected to image a shape that the sample has ,the image capturing method using electron beam, including:the electron beam irradiation step of irradiating a region which is planned to be observed of the sample with the electron beam for a predetermined time;the emitted electron detection step of detecting the electron emitted from the sample in a detection time which has been set shorter than the predetermined irradiation time within the predetermined irradiation time in the electron beam irradiation step, andthe imaging step of imaging the shape of the sample on the basis of a detection signal of the emitted electron.2. The image capturing method using electron beam according to claim 1 , whereinirradiation for the predetermined time is repeated a plurality of times in the electron beam irradiation step, andthe electron which has been emitted from the sample during at least one time electron beam irradiation in the irradiation which has been repeated the plurality of times is detected.3. The image capturing method using electron beam according to claim 1 ,wherein ...

A FOOD PROCESSING SYSTEM FOR PROCESSING AND BATCHING FOOD ITEMS

A food processing system and a method for processing and batching food items conveyed by a conveyor means where the batches fulfil at least one target criteria including at least one weight target, including a first weight determining means for determining the weight of incoming food items, a batching system, a food item separation device positioned downstream in relation to the first weight determining means and upstream in relation to the batching system, and a control system for controlling the batching system and the food item separation device. The controlling including, repeatedly: monitoring the weight of the incoming food items, determining, based on the weight of the incoming food items, a prospect indicator indicating the prospect to meet the target criteria for the batches such that each batch fulfils the at least one target criteria, and comparing if the prospect indicator fulfils a pre-defined criteria. 131-. (canceled)32. A food processing system for processing and batching food items conveyed by a conveyor means where the batches fulfil at least one target criteria including at least one weight target , comprising:a first weight determining means for determining the weight of incoming food items,a batching system,a food item separation device positioned downstream in relation to the first weight determining means and upstream in relation to the batching system,a control system for controlling the batching system and the food item separation device, the controlling including, repeatedly:monitoring the weight of the incoming food items,determining, based on the weight of the incoming food items, a prospect indicator indicating the prospect to meet the target criteria for the batches such that each batch fulfils the at least one target criteria,comparing if the prospect indicator fulfils a pre-defined criteria,in case the prospect indicator does not fulfil the pre-defined criteria, instructing the food item separation device to separate at least some of ...

SCANNING ELECTRON MICROSCOPE

An object of the invention is to provide a scanning electron microscope which forms an electric field to lift up, highly efficiently, electrons discharged from a hole bottom or the like even if a sample surface is an electrically conductive material. To achieve the above object, according to the invention, a scanning electron microscope including a deflector which deflects a scanning position of an electron beam, and a sample stage for loading a sample thereon, is proposed. The scanning electron microscope includes a control device which controls the deflector or the sample stage in such a way that before scanning a beam on a measurement target pattern, a lower layer pattern situated in a lower layer of the measurement target pattern undergoes beam irradiation on another pattern situated in the lower layer. 1. A scanning electron microscope including an electron source , an objective lens which condenses an electron beam discharged from the electron source , a deflector which deflects a scanning position of the electron beam , and a sample stage for loading a sample thereon , the scanning electron microscope comprisinga control device which controls the deflector or the sample stage in such a way that before scanning a beam on a measurement target pattern, a lower layer pattern situated in a lower layer of the measurement target pattern undergoes beam irradiation on another pattern situated in the lower layer.2. The scanning electron microscope according to claim 1 , wherein the deflector or the sample stage is controlled in such a way that the beam is cast on the another pattern situated at a position spaced apart from a scanning area of the measurement target pattern.3. A pattern measurement method using a scanning electron microscope which casts an electron beam discharged from an electron source onto a sample and thus forms a signal waveform of a pattern included in the sample claim 1 , whereinbefore the electron beam is allowed to scan on a measurement target ...

Simultaneous Diagnosis And Shape Estimation From A Perceptual System Derived From Range Sensors

Systems, methods, and devices for estimating a shape of an object based on sensor data and determining a presence of a fault or a failure in a perception system. A method of the disclosure includes receiving sensor data from a range sensor and calculating a current shape reconstruction of an object based on the sensor data. The method includes retrieving from memory a prior shape reconstruction of the object based on prior sensor data. The method includes calculating a quality score for the current shape reconstruction by balancing a function of resulted variances of the current shape reconstruction and a similarity between the current shape reconstruction and the prior shape reconstruction. 1. A method comprising:calculating a current shape reconstruction of an object based on sensor data;retrieving a prior shape reconstruction of the object;generating a shape point flag identifying non-faulty points in the prior shape reconstruction;generating a sensor point flag identifying non-faulty points in the sensor data; andfusing the shape point flag and the non-faulty points from the sensor point flag to compensate for uncertainties in the sensor data.2. The method of claim 1 , wherein:the sensor data comprises range sensor data received from one or more of a LIDAR (light detection and ranging) system or a radar system; andcalculating the current shape reconstruction of the object based on the sensor data comprises calculating with an implicit surface function or an explicit surface function.3. The method of claim 1 , further comprising calculating a confidence in the current shape reconstruction of the object by applying a function of resulted variances to the current shape reconstruction claim 1 , wherein the function of resulted variances defines a shape of the object as an implicit surface function or explicit surface function.4. The method of claim 3 , further comprising calculating a similarity between the current shape reconstruction of the object and the prior ...

Pattern Measurement Apparatus and Flaw Inspection Apparatus

The purpose of the present invention is to provide a pattern measurement apparatus that appropriately assesses patterns formed by patterning methods for forming patterns that do not exist on photomasks. In order to achieve this purpose, the present invention provides a pattern measurement apparatus comprising a processor that measures the dimensions of patterns formed on a sample by using data acquired by irradiating the sample with a beam, wherein the processor extracts pattern coordinate information on the basis of the data acquired by irradiating the sample with a beam, and uses the coordinate information to generate measurement reference data used when performing dimension measurements of the pattern. 1. A pattern measurement apparatus comprising:a processor that measures a dimension of a pattern formed in a sample by using data obtained by irradiating the sample with a beam,wherein the processor extracts coordinate information of the pattern on the basis of the data obtained by irradiating the sample with a beam, and generates measurement reference data during the measurement of the dimension of the pattern by using the coordinate information.2. The pattern measurement apparatus according to claim 1 ,wherein the processor extracts the coordinate information on the basis of determination of a correlation between a first image obtained by irradiating the sample with a beam and a second image obtained by performing autocorrelation processing on the image obtained by irradiating the sample with a beam.3. The pattern measurement apparatus according to claim 2 ,wherein the processor generates a pattern coordinate map on the basis of the determination of the correlation between the first image and the second image.4. The pattern measurement apparatus according to claim 3 ,wherein the processor determines whether or not a shape having a plurality of coordinates included in the pattern coordinate map as vertexes is a predetermined shape.5. The pattern measurement ...

PATTERN SHAPE EVALUATION DEVICE, PATTERN SHAPE EVALUATION SYSTEM, AND PATTERN SHAPE EVALUATION METHOD

Line-edge roughness or line width roughness is evaluated while preventing influence of noise caused by a device or an environment. Therefore, an averaged signal profile in which a moving average of S pixels (S is an integer greater than 1) is taken in a Y direction is obtained from a signal profile showing a secondary electron signal amount distribution in an X direction with respect to a predetermined Y coordinate obtained from a top-down image, an edge position of a line pattern is extracted based on the averaged signal profile, and a noise floor height is calculated based on a first power spectral density of LER data or LWR data based on the extracted edge position and a second power spectral density of a rectangular window function corresponding to the moving average of the S pixels. 1. A pattern shape evaluation device configured to evaluate a shape of a line pattern formed on a sample , the pattern shape evaluation device comprising:a processor;a memory; andan edge extraction program and a pattern shape evaluation program which are read into the memory and executed by the processor, whereinthe edge extraction program includes an edge position extraction unit configured to extract an edge position of the line pattern from a top-down image of the line pattern,the pattern shape evaluation program includes a noise floor calculation unit,a longitudinal direction of the line pattern in the top-down image is defined as a Y direction and a direction perpendicular to the longitudinal direction is defined as an X direction,the edge position extraction unit obtains an averaged signal profile obtained by performing a moving average of S pixels (S is an integer greater than 1) in the Y direction on a signal profile showing a secondary electron signal amount distribution in the X direction with respect to a predetermined Y coordinate obtained from the top-down image, and extracts the edge position of the line pattern based on the averaged signal profile, andthe noise floor ...

SAMPLE OBSERVATION METHOD AND SAMPLE OBSERVATION DEVICE

An inspection method uses a charged particle microscope to observe a sample and view a defect site or a circuit pattern. A plurality of images is detected by a plurality of detectors and a mixed image is generated by automatically adjusting and mixing weighting factors required when the plurality of images are synthesized with each other. The sample is irradiated and scanned with a charged particle beam so that the plurality of detectors arranged at different positions from the sample detects a secondary electron or a reflected electron generated from the sample. The mixed image is generated by mixing the plurality of images of the sample with each other for each of the plurality of detectors, which are obtained by causing each of the plurality of detectors arranged at the different positions to detect the secondary electron or the reflected electron. The generated mixed image is displayed on a screen. 1. A sample observation method for observing a sample by using a charged particle microscope , the method comprising:causing a plurality of detectors arranged at different positions from the sample to detect a secondary electron or a reflected electron generated from the sample by irradiating and scanning the sample with a charged particle beam;generating a mixed image by mixing a plurality of images of the sample with each other for each of the plurality of detectors, which are obtained in such a way that each of the plurality of detectors arranged at the different positions detects the secondary electron or the reflected electron; andoutputting the generated mixed image.2. The sample observation method according to claim 1 ,wherein the mixed image is generated by mixing the plurality of images of the sample for each of the plurality of detectors, which are obtained in such a way that each of the plurality of detectors arranged at the different positions detects the secondary electron or the reflected electron, so as to output an image whose visibility of a defect ...

METHODS AND SYSTEMS FOR INSPECTING INTEGRATED CIRCUITS BASED ON X-RAYS

In one embodiment, an automatic high-speed X-ray system may generate a high-resolution X-ray image of an inspected sample at a direction substantially orthogonal to a plane of the inspected sample. The system may determine a first cross-sectional shape of a first portion of a first element of interest in the inspected sample based on grayscale values of the X-ray image associated with the first element of interest. The system may determine a second cross-sectional shape of a second portion of the first element of interest in the inspected sample. The second cross-sectional shape may be determined based on the grayscale values of the X-ray image associated with the first element of interest. The system may determine one or more first metrological parameters associated with the first element of interest in the inspected sample based a comparison of the first cross-sectional shape and the second cross-sectional shape. 1. A method comprising , by an automated high-speed X-ray inspection system:generating an X-ray image of an inspected sample at a direction substantially orthogonal to a plane of the inspected sample, wherein the X-ray image is a high-resolution grayscale image;determining a first cross-sectional shape of a first portion of a first element of interest in the inspected sample, wherein the first cross-sectional shape is determined based on a plurality of grayscale values of the X-ray image associated with the first element of interest;determining a second cross-sectional shape of a second portion of the first element of interest in the inspected sample, wherein the second cross-sectional shape is determined based on the plurality of grayscale values of the X-ray image associated with the first element of interest; anddetermining one or more first metrological parameters associated with the first element of interest in the inspected sample based a comparison of the first cross-sectional shape and the second cross-sectional shape.2. The method of claim 1 , ...

METHOD FOR AUTOMATICALLY DETECTING A LOADING SURFACE AND WASHING INSTALLATION FOR CARRYING OUT SAID METHOD

An automatic detection method for automatically detection a loading surface of a vehicle, includes determining a side contour of a vehicle, determining a height profile of the vehicle, calculating a deviation between the side contour and the height profile, and determining the loading surface based on the deviation. 1. A method for automatically detecting a lower-lying loading area of a vehicle with an at least partially lateral side wall , the method comprising:determining a side contour of a vehicle;determining a height profile of the vehicle;calculating a deviation between the side contour and the height profile; anddetermining the loading area on the basis of the deviation and the position and/or extent of the loading area from a course of the deviation.2. The method according to claim 1 , wherein the depth of the loading area is determined relative to the side wall of the vehicle.3. The method according to claim 1 , wherein the side contour is determined by an electronic camera recording a side view of the vehicle.4. The method according to claim 1 , wherein the side contour is determined by a light grid moving along the vehicle.5. The method according to claim 1 , wherein the side contour is determined by an ultrasonic sensor or a radar sensor.6. The method according to claim 1 , wherein the height profile is determined in the center of the vehicle.7. The method according to claim 1 , wherein the height profile is determined by a runtime measurement of light.8. The method according to claim 1 , wherein the height profile is determined by triangulation of light.9. The method according to claim 1 , wherein the height profile is determined by an ultrasonic sensor or a radar sensor.10. The method according to claim 1 , wherein a first height profile is determined by a radar sensor and a second height profile is determined by a light sensor.11. The method according to claim 1 , wherein the method is used in a vehicle washing system.12. A vehicle washing system ...

Coordinate measuring apparatus and method for measuring an object

The invention relates to a coordinate measuring apparatus for measuring an object, having an x-ray sensory mechanism as a first sensory mechanism that is provided with an x-ray source and at least one x-ray sensor which detects the x-rays, and a second sensory mechanism such as a tactile and/or an optical sensory mechanism that can be placed in the x, y, and/or z direction of the coordinate measuring apparatus in relation to the object. In order to be able to easily measure also large-size test objects, the x-ray sensory mechanism can be positioned in the coordinate measuring apparatus according to the second sensory mechanism.

SYSTEM AND METHOD FOR ANALYZING A SEMICONDUCTOR DEVICE

A system for analyzing a semiconductor device includes an etching module, an analyzing module, and a computing module. The etching module may repeatedly etch an entire surface of a wafer at a same etch rate to expose a next surface of the wafer at a next depth where an object to be analyzed exits. The analyzing module may obtain two-dimensional structure information from each repeatedly etched surface of the wafer. The computing module may serially stack the repeatedly obtained two-dimensional structure information to generate a three-dimensional image. 1. A system for analyzing a semiconductor device , the system comprising:an etching module for repeatedly etching an entire surface of a wafer at a same etch rate to expose a next surface of the wafer at a next depth where an object to be analyzed exits;an analyzing module for obtaining two-dimensional structure information from each repeatedly etched surface of the wafer; anda computing apparatus for serially stacking the repeatedly obtained two-dimensional structure information to generate a three-dimensional image.2. The system of claim 1 , wherein the etching module comprises at least one of:a milling apparatus for irradiating the entire surface of the wafer with an ion beam;a chemical mechanical polishing (CMP) apparatus;a dry etching apparatus; anda wet etching apparatus.3. The system of claim 2 , wherein the milling apparatus comprises an ion accelerator for accelerating ions into the entire surface of the wafer to remove material.4. The system of claim 1 , wherein the analyzing module comprises at least one of:a scanning electron microscope (SEM) apparatus;a photoelectron emission microscopy (PEEM) apparatus;a Energy Dispersive X-ray analysis (EDX) apparatus;an X-ray photoelectron spectroscopy (XPS) apparatus; andan optical metrology/inspection tool.5. The system of claim 1 , wherein the analyzing module comprises:a first analyzing unit for obtaining a physical image of the etched surface of the wafer; anda ...

Pattern Evaluation Apparatus and Computer Program

The present invention is intended to provide a pattern evaluation apparatus and a computer program aimed at achieving defect inspection with high efficiency and high precision while allowing manufacturing variations that are dissimilar depending on the sites of a circuit. In order to achieve the above object, proposed are a computer program and an inspection system having a means of performing statistical processing of measurement data of a plurality of inspection target patterns having similar or same design pattern shape used for manufacturing the inspection target patterns, and performing adjustment of a defect determination threshold in accordance with a distribution state of measurement data.

A METHOD OF GENERATING A THREE DIMENSIONAL SURFACE PROFILE OF A FOOD OBJECT

A method of generating a three dimensional surface profile of a food object is provided wherein a food object is exposed with a conical X-ray beam while the food object is conveyed. The attenuation of the X-rays after penetrating through the food object is detected, and the detection is performed using a plurality of sensors arranged below the food object. The plurality of sensors are positioned at predetermined angular positions in relation to the X-ray source. For each of the plurality of sensors, the detected attenuation is converted into a penetration length of the X-ray beam, and the penetration length indicates the length from where the X-ray beam enters and leaves the food object. Surface coordinates are sequentially determined using the penetration lengths and the angular positions as input data. 110.-. (canceled)11. A method of generating a three dimensional surface profile of a food object , comprising:exposing the food object with a conical X-ray beam while the food object is conveyed,detecting the attenuation of the X-rays after penetrating through the food object, the detection being performed using a plurality of sensors arranged below the food object, the plurality of sensors being positioned at a pre-determined positions in relation to the X-ray source,converting, for each of the plurality of sensors, the detected attenuation into a penetration length of the X-ray beam, the penetration length indicating the length from where the X-ray beam enters and leaves the food object, andsequentially determining surface coordinates using the penetration lengths and the sensor positions as input data.12. The method according to claim 11 , wherein the step of converting the detected attenuation into the penetration length is performed in accordance to a pre-calibration.13. The method according to claim 11 , wherein the plurality of sensors are arranged in at least one line substantially perpendicular to a conveying direction of the food item.14. The method ...

REDUCING THE IMPACT OF CHARGED PARTICLE BEAMS IN CRITICAL DIMENSION ANALYSIS

Measuring a feature on a wafer, the feature including at least two edges. Scanning the wafer with an electron beam over the length of a first scan interval that includes at least a portion of a first edge of the feature. Preventing the electron beam from illuminating the wafer while moving the scan position of the electron beam across a portion of the wafer to a second scan interval that includes at least a portion of a second edge of the feature. Scanning the wafer with an electron beam over the length of the second scan interval. Determining a distance between the first and second edges of the feature. 1. A method for measuring a feature on a wafer using , the feature including at least two edges , the method comprising:scanning the wafer with an electron beam over the length of a first scan interval that includes at least a portion of a first edge of the feature;preventing the electron beam from illuminating the wafer while moving the scan position of the electron beam across a portion of the wafer to a second scan interval that includes at least a portion of a second edge of the feature;scanning the wafer with the electron beam over the length of the second scan interval; anddetermining a distance between the first and second edges of the feature.2. A method in accordance with claim 1 , wherein determining a distance further comprises:receiving a signal representative of emissions from the feature and/or wafer caused by the interaction of the electron beam and the feature and/or wafer;analyzing the signal to determine most likely locations for the first and second edges of the feature; anddetermining a distance between the most likely locations for the first and second edges of the feature.3. A method in accordance with claim 1 , wherein scanning the wafer over the length of the first and/or second scan interval further comprises:aligning the electron beam to the start of the scan interval, wherein aligning includes one or more of: aligning the electron beam to ...

OPTICAL METROLOGY IN MACHINE LEARNING TO CHARACTERIZE FEATURES

A metrology system may include an optical metrology tool configured to produce an optical metrology output for one or more features on a processed substrate, and a metrology machine learning model that has been trained using a training set of (i) profiles, critical dimensions, and/or contours for a plurality of features, and (ii) optical metrology outputs for the plurality of features. The metrology machine learning model may be configured to: receive the optical metrology output from the optical metrology tool; and output the profile, critical dimension, and/or contour of the one or more features on the processed substrate. 1. A method of determining a profile , critical dimension , and/or contour of one or more features on a processed substrate , the method comprising:performing optical metrology on the one or more features on the processed substrate to produce an optical metrology output;providing the optical metrology output to a metrology machine learning model that has been trained using a training set of (i) profiles, critical dimensions, and/or contours for a plurality of features, and (ii) optical metrology outputs for said plurality of features; andreceiving, from the metrology machine learning model, the profile, critical dimension, and/or contour of the one or more features on the processed substrate.2. The method of claim 1 , further comprising training the metrology machine learning model by producing multiple sets of optical metrology output claim 1 , each generated for a different orientation and/or location of test features with respect an optical metrology apparatus claim 1 , for said test features.3. The method of claim 1 , wherein the optical metrology is a scatterometry technique.4. The method of claim 1 , wherein the optical metrology output comprises a reflectance spectra.5. The method of claim 1 , wherein the optical metrology output comprises ellipsometric output data.6. The method of claim 1 , further comprising:performing pattern ...

MEASURING DEVICE, MEASURING METHOD, AND SEMICONDUCTOR STORAGE DEVICE

A measuring device includes a measuring stage on which a subject is placed, an X-ray irradiation unit, an X-ray detection unit that detects scattered X-rays generated from the subject and an analysis unit that analyzes the diffraction image obtained by photo-electrically converting scattered X-rays and presumes (estimates) the three-dimensional shape of the subject. In the subject, holes are formed in the ON stack film from the opening of the etching mask film formed on the ON stack film. The analysis unit presumes the three-dimensional shape of the subject based a plurality of the diffraction images acquired while changing a rotation angle of the measuring stage and the measurement data of the subject by at least one of measuring methods of a multi-wavelength light measurement and a laser ultrasonic wave measurement. 1. A measuring device comprising:a stage arranged to support a subject;an X-ray irradiator configured to irradiate the stage with X-rays;an X-ray detector configured to detect scattered X-rays emitted from the subject based on the irradiation by the X-ray irradiator; anda processor configured to analyze a diffraction image obtained by photo-electrically converting the scattered X-rays, estimate a front surface contour shape of a measurement area irradiated with the X-rays,', 'estimate an interface between a first film and a second film of the subject and a hole portion penetrating the second film,, 'the processor configured towherein the processor is configured to estimate the front surface contour shape based on (i) a plurality of the diffraction images acquired by rotating the subject, and (ii) measurement data obtained by measuring the subject using at least one measuring method of a multi-wavelength light measurement or a laser ultrasonic wave measurement.2. The measuring device according to claim 1 , wherein the x-ray irradiator includes a Transmission Small Angle X-ray Scattering arrangement.3. The measuring device according to claim 1 , wherein ...

System and Method to Adjust A Kinetics Model of Surface Reactions During Plasma Processing

A system is disclosed, in accordance with one or more embodiments of the present disclosure. The system includes a metrology tool configured to acquire one or more measurements of a portion of a sample. The system includes a controller including one or more processors configured to execute program instructions causing the one or more processors to: generate a surface kinetics model output based on a surface kinetics model; determine an expected response of the surface kinetics model output to excitation by polarized light; compare the determined expected response to the one or more measurements; generate one or more metrics based on the comparison between the determined expected response and the one or more measurements of the sample; adjust one or more parameters of the surface kinetics model to generate an adjusted surface kinetics model; and apply the adjusted surface kinetics model to simulate on-sample performance during plasma processing. 1. A system , comprising:a metrology tool, wherein the metrology tool is configured to acquire one or more measurements of a portion of a sample; and generate a surface kinetics model output based on a surface kinetics model, wherein the surface kinetics model is run based on an initial guess of one or more parameters of the surface kinetics model;', 'determine an expected response of the surface kinetics model output to excitation by polarized light;', 'compare the determined expected response to the one or more measurements of the sample received from the metrology tool;', 'generate one or more metrics based on the comparison between the determined expected response and the one or more measurements of the sample;', 'adjust the one or more parameters of the surface kinetics model based on the one or more metrics to generate an adjusted surface kinetics model; and', 'apply the adjusted surface kinetics model to simulate on-sample performance during plasma processing of the sample., 'a controller communicatively coupled to the ...

CHARGED PARTICLE BEAM DEVICE

To provide a charged particle beam device which enables observation and evaluation of the surface and the inside of a sample with low damage to the sample, the charged particle beam device has: a charged particle beam source ; a sample table in which the sample is placed; a charged particle beam optical system which pulsates a charged particle beam and irradiates the charged particle beam to the sample at an acceleration voltage within a range of 0 kV to 5 kV; a split distance selector for selecting a measurement object of the sample; and a split distance setting unit for setting a split distance in one line scanning of the charged particle beam on the sample. 1. A charged particle beam device comprising:a charged particle beam source;a sample table on which a sample is placed;a charged particle beam optical system that accelerates and pulsates a charged particle beam emitted from the charged particle beam source, and irradiates the charged particle beam to the sample at an acceleration voltage within a range of 0 kV to 5 kV while scanning the charged particle beam;a split distance selector that selects a surface or an under layer of the sample as a measurement object;a split distance setting unit that sets a split distance as a distance between irradiation regions in one line scanning of the charged particle beam on the sample, based on the measurement object selected with the split distance selector; anda controller that controls the charged particle beam optical system based on the split distance set with the split distance setting unit, so as to irradiate the charged particle beam to the sample.2. The charged particle beam device according to claim 1 ,wherein the acceleration voltage of the charged particle beam irradiated to the sample is set to a value within a range of 0 kV to 3 kV.3. The charged particle beam device according to claim 1 ,wherein the split distance is set to a value within a range of 5 nm to 500 nm.4. The charged particle beam device ...

ELECTRON REFLECTOMETER AND PROCESS FOR PERFORMING SHAPE METROLOGY

An electron reflectometer includes: a sample stage; a source that produces source electrons; a source collimator; and an electron detector that receives collimated reflected electrons. 1. An electron reflectometer comprising: receives a sample comprising a sample surface;', 'disposes the sample in a position to be analyzed;', 'moves the sample surface to be positioned perpendicular to an azimuthal axis and coincident at a point of common intersection of a pitch axis, roll axis, and azimuthal axis;', 'provides a pitch rotation through a pitch angle to the sample about a pitch axis;', 'provides a roll rotation through a roll angle to the sample about a roll axis, the pitch axis being perpendicular to and independent of the roll axis; and', 'provides an azimuthal rotation through an azimuthal angle to the sample about an azimuthal axis,', 'such that the sample can be rotated into a measurement position;, 'a sample stage thata source moveably disposed at an incident angle with respect to the sample stage and that produces source electrons directed toward the sample; receives the source electrons;', 'collimates the source electrons; and', 'produces incident electrons from the source electrons in response to collimating the source electrons,', 'the source collimator comprising an electron lens and source transmission aperture having an incident angular width from 0.° to 5° and that provides incident electrons along an incident direction at incident angle providing an incident footprint of impinging electrons on sample surface at the point of common intersection with pitch axis, roll axis and azimuthal axis, with incident angle being adjustable from 0° to 5° relative to the plane through the pitch axis and the roll axis and incident footprint having length and width controllable via source collimator;, 'a source collimator interposed between the source and the sample stage and that receives reflected electrons that are reflected by the sample and produced from the incident ...

Method and system for optimizing optical inspection of patterned structures

A system for use in inspection of patterned structures, including a data input utility for receiving first type of data indicative of image data on at least a part of the patterned structure, and a data processing and analyzing utility configured and operable for analyzing the image data, and determining a geometrical model for at least one feature of a pattern in said structure, and using said geometrical model for determining an optical model for second type of data indicative of optical measurements on a patterned structure.

Method for Validating Measurement Data

A method includes receiving, into a measurement tool, a substrate having a material feature, wherein the material feature is formed on the substrate according to a design feature. The method further includes applying a source signal on the material feature, collecting a response signal from the material feature by using a detector in the measurement tool to obtain measurement data, and with a computer connected to the measurement tool, calculating a simulated response signal from the design feature. The method further includes, with the computer, in response to determining that a difference between the collected response signal and the simulated response signal exceeds a predetermined value, causing the measurement tool to re-measure the material feature. 1. A method comprising:receiving, into a measurement tool, a substrate having a material feature, wherein the material feature is formed on the substrate according to a design feature;applying a source signal on the material feature;collecting a response signal from the material feature by using a detector in the measurement tool to obtain measurement data;with a computer connected to the measurement tool, calculating a simulated response signal from the design feature; andwith the computer, in response to determining that a difference between the collected response signal and the simulated response signal exceeds a predetermined value, causing the measurement tool to re-measure the material feature.2. The method of claim 1 , wherein applying the source signal is done by using a source in the measurement tool having a tool setting parameter.3. The method of claim 2 , wherein calculating the simulated response signal comprises using the tool setting parameter.4. The method of claim 3 , wherein collecting the response signal comprises collecting a secondary electron signal with a scanning electron microscope (SEM) tool.5. The method of claim 1 , wherein calculating the simulated response signal includes calculating a ...

CALIBRATION METHOD OF X-RAY MEASURING DEVICE

A calibration method of an X-ray measuring device includes: a front-stage feature position calculation step of parallelly moving spheres disposed in N places a plurality of times, and identifying centroid positions ImPos(1 to Q)_Dis(1 to M)_Sphr_(1 to N) of projected images of the spheres in the N places; an individual matrix calculation step of calculating an individual projection matrix PPj (j=1 to Q) for each of the spheres; an individual position calculation step of calculating moving positions Xb of the spheres on the basis of the individual projection matrix PPj (j=1 to Q); a coordinate integration step of calculating specific relative position intervals X(1 to N) of the spheres; a rear-stage feature position calculation step; a transformation matrix calculation step of calculating a projective transformation matrix Hk (k=1 to Q); a rotation detection step; a position calculation step; and a center position calculation step. 1. A calibration method of an X-ray measuring device configured to measure a three-dimensional shape of an object to be measured using an X-ray ,the X-ray measuring device including an X-ray source that generates an X-ray, a rotating table on which the object to be measured is rotatably mounted, and an X-ray image detector that detects the X-ray passing through the object to be measured,the method comprising:a mounting step of mounting on the rotating table a calibration tool that allows disposition of reference objects in N places (N≥4) at specific relative positional intervals, the reference objects having a shape that is identifiable by projected images on the X-ray image detector;a front-stage feature position calculation step of parallelly moving the reference objects disposed in the N places a plurality of times without changing the specific relative positional intervals of the reference objects, irradiating the calibration tool with the X-ray before and after the parallel movement, and identifying positions of feature points of ...

LEVEL INDICATOR COMPRISING AN ENERGY TRANSMISSION DEVICE

A fill level measurement device for determining a topology of a surface of a filling material or of a bulk material is provided, including a rotatable antenna including an array of radiator elements configured to emit a measurement signal towards the surface and to receive a reflected measurement signal reflected from the surface, and a high-frequency signal processor configured to generate the measurement signal and to at least partially process the received reflected measurement signal; and a power supply and communications circuitry, coupled to the high-frequency signal processor by a sliding contact or a pair of coils, and configured to supply the high-frequency signal processor with electrical power for measurement operation. 112.-. (canceled)13. A fill level measurement device for determining a topology of a surface of a filling material or of a bulk material , comprising: an array of radiator elements configured to emit a measurement signal towards the surface and to receive a reflected measurement signal reflected from the surface, and', 'a high-frequency signal processor configured to generate the measurement signal and to at least partially process the received reflected measurement signal; and, 'a rotatable antenna comprisinga power supply and communications circuitry, coupled to the high-frequency signal processor by a sliding contact or a pair of coils, and configured to supply the high-frequency signal processor with electrical power for measurement operation.14. The fill level measurement device according to claim 13 , wherein the high-frequency signal processor is integrated in the rotatable antenna.15. The fill level measurement device according to claim 13 , further comprising:a power supply and communications interface configured to connect the power supply and communications circuitry to a two-wire line, to supply the fill level measurement device with electrical power for measurement operation, and to transmit measurement data to a remote ...

Methods And Systems For Determining Quality Of Semiconductor Measurements

Methods and systems for estimating a value of a quality metric indicative of one or more performance characteristics of a semiconductor measurement are presented herein. The value of the quality metric is normalized to ensure applicability across a broad range of measurement scenarios. In some embodiments, a value of a quality metric is determined for each measurement sample during measurement inference. In some embodiments, a trained quality metric model is employed to determine the uncertainty of defect classification. In some embodiments, a trained quality metric model is employed to determine the uncertainty of estimated parameters of interest, such as geometric, dispersion, process, and electrical parameters. In some examples, a quality metric is employed as a filter to detect measurement outliers. In some other examples, a quality metric is employed as a trigger to adjust a semiconductor process. 1. A system comprising:{'claim-text': ['an illumination source configured to provide an amount of illumination radiation directed to a first measurement site on a surface of a semiconductor wafer;', 'a detector configured to detect an amount of radiation collected from the first measurement site in response to the amount of illumination radiation; and'], '#text': 'a metrology subsystem comprising:'}{'claim-text': ['generate a first plurality of features characterizing the detected amount of radiation from the first measurement site;', 'estimate values of one or more parameters of interest characterizing the measurement site from values of the first plurality of features of the detected amount of radiation based on a trained measurement model;', 'determine reconstructed values of each of the first plurality of features, wherein a reconstructed value of a feature of the first plurality of features is determined from the one or more parameters of interest and the values of each of the first plurality of features except the value of the feature of the first plurality of ...

STORAGE MEDIUM, SHAPE CALCULATION DEVICE, AND SHAPE MEASUREMENT METHOD

According to one embodiment, a recording medium records a shape calculation program that causes a computer to calculate a shape of a periodic structure. The shape calculation program causes the computer to extract a second scattering profile from a first scattering profile obtained when the electromagnetic waves are incident and to extract a fourth scattering profile from a third scattering profile calculated using a second periodic structure that is virtually set. The shape calculation program causes the computer to perform fitting between the second scattering profile and the fourth scattering profile and to calculate the shape of the first periodic structure on the basis of the result of the fitting. 1. A non-transitory computer readable medium that records a shape calculation program which causes a computer to calculate a shape of a periodic structure and to perform:extracting, from a first scattering profile of electromagnetic waves obtained when the electromagnetic waves are incident on a first periodic structure on a substrate, a second scattering profile, on the basis of a certain condition;extracting, from a third scattering profile calculated using a second periodic structure that is virtually set, a fourth scattering profile, on the basis of the certain condition;fitting the second scattering profile and the fourth scattering profile; andcalculating a shape of the first periodic structure on the basis of the result of the fitting.2. The non-transitory computer readable recording medium according to claim 1 ,wherein the shape calculation program causes the computer to further perform:repeating the extraction of the fourth scattering profile and the fitting while changing a shape parameter of the second periodic structure.3. The non-transitory computer readable recording medium according to claim 1 ,wherein the shape calculation program causes the computer to further perform:performing a scattering intensity distribution simulation for the second periodic ...

SHAPE MEASUREMENT METHOD AND SHAPE MEASUREMENT APPARATUS

According to one embodiment, a substrate measurement method comprises irradiating a substrate with an electromagnetic wave, such as an X-ray, at a plurality of incident azimuth angles with respect to an orientation of a repetitive array on the substrate. The irradiating conditions are varied in different incident azimuth angle ranges. The repetitive array comprises a pattern feature, such as a hole or a pillar, for example. The scattering intensity of the electromagnetic waves scattered from the substrate is measured at each of the different incident azimuth angles. Shape information for the pattern feature in the is calculated based on the measured scattering intensity of the electromagnetic waves at the plurality of incident azimuth angles. 1. A substrate measurement method , comprising:irradiating a substrate with an electromagnetic wave at a plurality of incident azimuth angles with respect to an orientation of a repetitive array on the substrate, the irradiating conditions being varied for different incident azimuth angle ranges, the repetitive array comprising a pattern feature;measuring scattering intensity of the electromagnetic waves scattered from the substrate at each different incident azimuth angles; andcalculating shape information for the pattern feature based on the scattering intensity of the electromagnetic waves at the plurality of incident azimuth angles.2. The substrate measurement method according to claim 1 , wherein the incident angle of the electromagnetic waves at a surface of the substrate is changed for different incident azimuth angle ranges.3. The substrate measurement method according to claim 2 , wherein a slit width for changing a beam size for the electromagnetic waves incident on the substrate is changed for the different incident azimuth angle ranges.4. The substrate measurement method according to claim 2 , wherein an irradiation beam dwell time for the electromagnetic waves is changed for the different incident azimuth angle ...

Measurement method, image processing device, and charged particle beam apparatus

An error of an outline point due to a brightness fluctuation cannot be corrected by a simple method such as a method of adding a certain amount of offset. However, in recent years as the miniaturization of the pattern represented by a resist pattern has progressed, it has been difficult to appropriately determine a region that serves as a reference. An outline of the resist pattern is extracted from an image of the resist pattern obtained by a charged particle beam apparatus in consideration of influence of the brightness fluctuation. That is, a plurality of brightness profiles in the vicinity of edge points configuring the outline are obtained and an evaluation value of a shape of the brightness profile in the vicinity of a specific edge is obtained based on the plurality of brightness profiles, and the outline of a specific edge point is corrected, based on the evaluation value.

Radar Fill Level Measurement Device with a Radar System-on-chip

A radar fill level measurement device includes an arrangement having at least one radar chip which has a plurality of transmitting channels and a plurality of receiving channels. In addition, the device includes an antenna arrangement having a plurality of transmitting elements and receiving elements. The device has more transmitting channels than transmitting elements and/or more receiving channels than receiving elements. 1. A radar fill level measurement device for measuring a fill level or detecting a topology of a surface of a filling material in a container , comprising:an arrangement including at least one radar chip, the arrangement having (a) a plurality of transmitting channels, each of the transmitting channels configured to generate a transmission signal and/or (b) a plurality of receiving channels, each of the receiving channels configured to detect the transmission signals reflected from the filling material surface; andan antenna arrangement having a plurality of transmitting elements and a plurality of receiving elements,wherein the device has (a) a number of the transmitting channels which is greater than a number of the transmitting elements and/or (b) a number of the receiving channels which is greater than a number of the receiving elements.2. The device according to claim 1 , wherein the device is configured to use (a) fewer transmitting elements for measuring the fill level than there are transmitting channels provided and/or (b) fewer receiving elements for measuring the fill level than there are receiving channels provided.3. The device according to claim 1 , wherein the at least one radar chip includes a plurality of radar chips.4. The device according to claim 1 , wherein the at least one radar chip includes a radar chip configured to transmit and receive transmission signals and an integrated microwave circuit configured only to transmit transmission signals or only to receive transmission signals reflected from the filling material ...

Method and device for line pattern shape evaluation

The present invention pertains to a method and device for quantitatively evaluating the degree and characteristics of wiggling, which is a phenomenon that occurs in electronic device fabrication processes and consists of the deformation in the same shape of the left and right edges of fine line patterns, and takes advantage of the fact that this wiggling is included in measured values for line edge variation but not line width variation by acquiring the differences between these values. Further, the present invention is configured so as to calculate line center positions and use the distribution of the deviation from the average line center position as an indicator. Additionally, the present invention is configured to quantify wiggling characteristics by outputting a coefficient of wiggling correlation between lines or a wiggling component synchronized between lines as an indicator.

METHOD AND DEVICE FOR MEASURING A TUBULAR STRAND

A device for measuring a strand that is tubular includes a first radiation source to emit terahertz radiation in a first measurement region from an inside onto an inner surface of the strand. A first radiation receiver receives terahertz radiation reflected by the strand in a second measurement region. A first evaluation apparatus determines at least one geometric parameter of the strand in the first measurement region. A second radiation source emits terahertz radiation in the second measurement region from an outside onto an outer surface of the strand. A second radiation receiver receives terahertz radiation reflected by the strand in the second measurement region. A second evaluation apparatus determines at least one geometric parameter of the strand in the second measurement region. A third evaluation apparatus determines a change in the at least one geometric parameter of the strand between the first and second measurement regions. 125-. (canceled)26. A method for measuring a tubular strand emerging from an extruder and conveyed in a longitudinal direction , the method comprising:guiding terahertz radiation in a first measurement region from at least one first radiation source from an inside onto an inner surface of the tubular strand;reflecting the terahertz radiation by the tubular strand;receiving the reflected terahertz radiation by at least one first radiation receiver;determining at least one geometric parameter of the tubular strand from the received terahertz radiation in the first measurement region,guiding terahertz radiation in a second measurement region from at least one second radiation source from an outside onto an outer surface of the tubular strand;reflecting the terahertz radiation by the tubular strand;receiving the reflected terahertz radiation by at least one second radiation receiver;determining at least one geometric parameter of the tubular strand from the received terahertz radiation in the second measurement region, wherein the ...

Method for Validating Measurement Data

A method includes receiving, into a measurement tool, a substrate having a material feature, wherein the material feature is formed on the substrate according to a design feature. The method further includes applying a source signal on the material feature, collecting a response signal from the material feature by using the measurement tool, and with a computer connected to the measurement tool, calculating a simulated response signal from the design feature. The method further includes, with the computer, in response to determining that a difference between the collected response signal and the simulated response signal exceeds a predetermined value, causing the measurement tool to re-measure the material feature.

APPARATUS AND SYSTEM FOR GENERATING A CROSS-SECTIONAL ABDOMINAL IMAGE

An apparatus for generating a cross-sectional abdominal image includes a memory for storing a cross-sectional abdominal image, a measuring unit for measuring an outline of an abdomen, and a controller configured to correct the cross-sectional abdominal image based on the outline of the abdomen measured by the measuring unit. 1. An apparatus for generating a cross-sectional abdominal image comprising:a memory for storing a plurality of cross-sectional abdominal images;a measuring unit for measuring an outline of an abdomen; anda controller configured to correct a cross-sectional abdominal image of the plurality of cross-sectional abdominal images based on the outline measured by the measuring unit.2. The apparatus for generating a cross-sectional abdominal image according to claim 1 ,wherein the memory stores the plurality of cross-sectional abdominal images having different ranges of a visceral fat area and a subcutaneous fat area, andthe controller calculates a shape characteristic from the outline of the abdomen, estimates at least one of the visceral fat area and the subcutaneous fat area of the abdomen based on the shape characteristic, and then selects and corrects the cross-sectional abdominal image corresponding to the estimated at least one of the visceral fat area and the subcutaneous fat area.3. The apparatus for generating a cross-sectional abdominal image according to claim 1 ,wherein the cross-sectional abdominal image is a CT image acquired in a recumbent state.4. The apparatus for generating a cross-sectional abdominal image according to claim 1 ,wherein the outline of the abdomen is an outline acquired by measuring a subject in an upright state.5. The apparatus for generating a cross-sectional abdominal image according to claim 1 ,wherein the controller corrects the cross-sectional abdominal image based on an aspect ratio of the outline of the abdomen.6. The apparatus for generating a cross-sectional abdominal image according to claim 1 ,wherein the ...

Pattern measurement method and pattern measurement device

The presently disclosed subject matter provides a pattern measurement method and device for achieving highly accurate measurement in the depth direction of a pattern. The method involves a focused ion beam irradiated to form an inclined surface in a sample area; a field of view of a SEM set to include the boundary between the inclined surface and a sample surface; and an image of the field of view obtained on the basis of a detection signal. Such an acquired image is used to specify a first position, the boundary between inclined surface and non-inclined surface, and a second position, the position of a desired deep hole or deep groove positioned within the inclined surface. The pattern dimension in a height direction is determined on the basis of the distance in the sample surface direction between the first position and second position and the angle of the inclined surface.

Antenna device and method for operating an antenna device

An antenna device is disclosed, including a control means and at least two transmission means in predeterminable positions and at least two receiving means in predeterminable positions. The control means is set up in such a way that it alternately individually excites the at least two transmission means in transmission, in such a way that each of the at least two receiving means receives a transmitted signal generated by each of the at least two transmission means. The control means is further set up to excite the at least two transmission means jointly in transmission at a predeterminable moment in such a way that each of the at least two receiving means receives a transmission signal generated by a single virtual transmission means.

ANTENNA DEVICE AND METHOD FOR OPERATING AN ANTENNA DEVICE

An antenna device is disclosed including a control means and at least two transmission means in predeterminable positions and at least two receiving means in predeterminable positions. The control means is set up in such a way that it alternately individually excites the at least two transmission means in transmission, in such a way that each of the at least two receiving means receives a transmitted signal generated by each of the at least two transmission means. The control means is further set up to excite the at least two transmission means jointly in transmission at a predeterminable moment in such a way that each of the at least two receiving means receives a transmission signal generated by a single virtual transmission means. 1: An antenna device , comprising:a controller; and at least two transmission devices in first predeterminable positions,', 'at least two receiving devices in second predeterminable positions,, 'an antenna array comprisingwherein the controller is configured to alternately individually excite the at least two transmission devices for transmission in such a way that each of the at least two receiving devices receives a transmitted signal generated by each of the at least two transmission devices, 'wherein the virtual transmission device is arranged in a predeterminable position which differs from the first predeterminable positions of the at least two transmission devices.', 'wherein the controller is further configured to excite the at least two transmission devices jointly for transmission at a predeterminable moment, in such a way that each of the at least two receiving devices receives a transmitted signal generated by a single virtual transmission device, and'}2: The antenna device according to claim 1 , further comprising:an evaluation device,wherein the controller is further configured to determine the predeterminable moment by applying at least two different time schemes,wherein the controller is further configured to excite the ...

SYSTEM TO PERFORM RADIO FREQUENCY INTERFEROMETRY USING OPTICAL FIBER SENSING SIGNAL PROCESSING TECHNIQUES

Aspects of the present disclosure involve a system and method for performing radio frequency interferometry using optical fiber sensing. Optical fiber sensing is performed as a reference signal is defined and compared, in the optical domain, to incoming signals to obtain interference fringe patterns that can be used to decode phase shift offsets with respect to the designated reference signal. The phase shift offsets can be determined by first optically modulating the reference and incoming signals using a laser source as the carrier. In the optical domain, the reference and incoming signals are combined using an optical coupler and then converted back to the electrical domain for processing. 1. A method comprising:receiving radio frequency signals, wherein at least one of the radio frequency signals is selected as a reference signal;optically modulating the received radio frequency signals and the reference signal to yield modulated optical signals, wherein the received radio frequency signals and the reference signal are optically modulated using a laser beam from a laser source;optically combining the modulated optical signals to generate fringe patterns;interrogating the fringe patterns to determine corresponding phase offsets between the reference signal and the received radio frequency signals; andsynchronizing the laser source with processing electronics to ensure the processing electronics are synchronized to the received radio frequency signals for interrogating the fringed patterns.2. The method of claim 1 , further comprising:stabilizing the modulated optical signals for phase compensation and signal level control.3. The method of claim 1 , further comprising:attenuating the modulated optical signals to obtain balanced signal levels.4. The method of claim 1 , further comprising:converting the fringe patterns to electrical signals;5. The method of claim 4 , further comprising:filtering the electrical signals to maintain lower frequency changes.6. The ...

PATTERN MEASUREMENT CONDITION SETTING DEVICE AND PATTERN MEASURING DEVICE

The purpose of the present invention is to provide a pattern measurement condition setting device which appropriately sets a measurement condition for finding out an appropriate exposure condition. To achieve the purpose, proposed is a pattern measurement condition setting device which sets a pattern measurement condition when the measurement of a pattern is executed, and is provided with an arithmetic unit which selects a pattern having a predetermined condition from pattern information for each exposure condition obtained when the exposure condition of a reduced projection exposure device is changed or pattern information for each exposure condition obtained when the exposure condition is changed by optical simulation, the arithmetic unit selecting a pattern as an object to be measured or a candidate for the object to be measured, the change of the size or shape of the pattern with respect to the change of the exposure condition satisfying a predetermined condition, and the number of patterns having the same shape as that of the pattern satisfying a predetermined condition. 1. A pattern measurement condition setting device which sets a pattern measurement condition when the measurement of a pattern is executed based on a detection signal obtained by emitting a charged particle beam to a sample , comprising:an arithmetic unit which selects a pattern having a predetermined condition from pattern information for each exposure condition obtained when the exposure condition of a reduced projection exposure device is changed or pattern information for each exposure condition obtained when the exposure condition is changed by optical simulation, the arithmetic unit selecting a pattern as an object to be measured or a candidate for the object to be measured, the change of the size or shape of the pattern with respect to the change of the exposure condition satisfying a predetermined condition, and the number of patterns having the same shape as that of the pattern ...

MEASURING DEVICE AND METHOD FOR DETECTING THE CHARACTERISTICS OF AN OBJECT

A measuring apparatus for detecting properties of an object including an object guidance device of a definable width, a first transmitter and at least two receivers and control circuitry. The control circuitry transmits a transmit signal and receives a receive signal. The control circuitry uses the receive signals to analyse the structure of the object along a linear region inside the width of the object guidance device. 1: A measuring apparatus for detecting properties of an object on an object guidance device , comprising:a transmitter;at least two receivers; andcontrol circuitry,wherein the control circuitry is configured to transmit a transmit signal from the transmitter,wherein the control circuitry is configured to receive, from the at least two receivers, receive signals which are produced by the transmit signal, andwherein the control circuitry is configured to use the receive signals from the at least two receivers to analyse the structure of the object along a linear region inside a width of the object guidance device.2: The measuring apparatus according to claim 1 , wherein the transmitter and the at least two receivers are arranged in the same plane at a definable distance from the object guidance device.3: The measuring apparatus according to claim 1 , wherein the transmitter and/or the at least two receivers are arranged in a line.4: The measuring apparatus according to claim 1 ,wherein the object guidance device is configured to restrict a movement of the object to a region inside the width of the object guidance device.5: The measuring apparatus according to claim 4 , wherein the at least two receivers and the transmitter are arranged inside the region of the width of the object guidance device.6: The measuring apparatus according to claim 4 , wherein the object guidance device comprises a marker device configured to define a reference plane.7: The measuring apparatus according to claim 1 , wherein the main receive direction of the receivers is ...

Method for Inspecting a Pattern of Features on a Semiconductor Die

The present disclosure is related to a method for detection of defects in a printed pattern of geometrical features on a semiconductor die, the pattern comprising an array of features having a nominal pitch, the method comprising determining deviations from the nominal pitch in the printed pattern, and comparing the printed pattern with another version of the pattern, the other version having the same or similar pitch deviations as the printed pattern. According to various embodiments, the other version of the pattern may a printed pattern on a second die, or it may be a reference pattern, obtained by shifting features of the array in a version having no or minimal pitch deviations, so that the pitch deviations in the reference pattern are the same or similar to the pitch deviations in the printed pattern under inspection. 1. A method for detection of one or more defects in a printed pattern of geometrical features on a semiconductor die , the printed pattern comprising an array of geometrical features having a nominal pitch , the method comprising:determining one or more deviations from the nominal pitch in the printed pattern; andcomparing the printed pattern with a second version of the printed pattern, wherein the second version has the same or similar pitch deviations as the printed pattern.2. The method according to claim 1 , wherein the semiconductor die is a first die of a plurality of dies comprising versions of the same printed pattern claim 1 , the method further comprising:determining deviations from the nominal pitch of the array in each of the plurality of dies, and wherein the second version of the printed pattern is a pattern printed on a second die of the plurality of dies, the second die comprising an array with the same or similar pitch deviations as the first die.3. The method according to claim 2 , wherein the plurality of dies are printed on the same semiconductor wafer.4. The method according to claim 1 , wherein an initial pattern is provided ...

Device and method for determining geometry characteristic values of a wheel profile on a rolling wheel of a rail vehicle

A device for determining geometry characteristic values of a wheel profile on a rolling wheel of a rail vehicle that includes a first sensor arrangement, which has a first non-contact measuring distance sensor, which is oriented at a reference surface in the form of the inner planar surface of the rolling wheel, and at least one further non-contact measuring distance sensor, which is oriented at a defined angle of incidence at the wheel surface of the rolling wheel facing the rail or the wheel surface of the rolling wheel to be examined. Both distance sensors are arranged a defined distance to the rail. An electronic evaluation device calculates the geometry characteristic values from the detected distance signals. The first and the further non-contact measuring distance sensor use a frequency-modulated continuous-wave radar (FMCW), and a lens is used to bundle the radar waves and thus to define a measuring spot.

METHOD FOR DETERMINING UNCERTAINTIES IN MEASUREMENT DATA FROM THE MEASUREMENT OF AN OBJECT

Described is a computer-implemented method for determining uncertainties in measurement data from a measurement of an object, wherein a digital representation of the object is generated by the measurement. The object representation has items of image information, which each indicate a value of a measurement variable for the object at a defined position of the object. Statistical noise is superimposed on the image information. The method includes determining the object representation, determining a distance field from the image information relating to the object representation, determining a strength of the statistical noise in the image information, determining an uncertainty of the distance values of the distance field on the basis of the strength of the statistical noise, and determining an uncertainty of the position of at least one point on at least one material boundary surface from the uncertainty of the distance values of the distance field. 1. A computer-implemented method for determining uncertainties in measurement data from a measurement of an object , wherein a digital representation of the object is generated by the measurement , wherein the object representation has a multiplicity of items of image information , wherein an item of image information indicates a value of a measurement variable for the object at a defined position of the object , wherein statistical noise is superimposed on the image information , wherein the method has the following steps:determining the object representation,determining a distance field from the image information relating to the object representation, wherein the distance field has a multiplicity of distance values, wherein a distance value for a particular point in the distance field indicates the shortest distance between the point and a closest material boundary surface of the object,determining a strength of the statistical noise in the image information,determining an uncertainty of the distance values of the ...

Handheld multi-sensor system for sizing irregular objects

A handheld scanner system for obtaining sizing of an irregularly shaped object. The system includes a housing and an inertial measurement unit configured to record orientation and displacement history of the housing. An optical module includes at least one 3D optical sensor configured to generate a 3D point cloud of information about the object. A radar module includes at least one radar sensor configured to sense spacing between the housing and the object. A processor receives data from the inertial measurement unit, the optical module and the radar module and creates a map representing the object based on the received data.

Measurement processing device, x-ray inspection apparatus, method for manufacturing structure, measurement processing method, x-ray inspection method, measurement processing program, and x-ray inspection program

A measurement processing device used for an x-ray inspection apparatus that detects an x-ray passing through a predetermined region of a specimen placed on a placement unit to perform an inspection on the shape of the predetermined region of the specimen includes: a setting unit that sets a three-dimensional region to be detected on the specimen; and a sliced-region selection unit that sets a plurality of sliced regions on the region to be detected, calculates, for each of the plurality of sliced regions, an amount of displacement of the predetermined region that is required to detect the region to be detected when the plurality of sliced regions is regarded as the predetermined region, and selects a sliced region for the inspection from among the plurality of sliced regions on the basis of each of the calculated amounts of displacement.

Methods for monitoring turbine components

Methods for monitoring a components include locating a plurality of machined surface features on the component, locating at least one reference point, and measuring a plurality of first distances between the plurality of machined surface features and the at least one reference point.

Pattern Measurement Method and Pattern Measurement Device

The purpose of the present invention is to provide a pattern measurement method and a pattern measurement device, whereby high-precision measurement of a pattern in a depth direction thereof is realized. Provided are a pattern measurement method and device, the pattern measurement method having a step for forming an inclined plane in a sample region including a circuit element having a deep hole, a deep groove, or a three-dimensional structure by focused ion beam irradiation, setting the field of view of a scanning electron microscope so as to include a boundary between the inclined plane and the sample surface, acquiring an image of the field of view on the basis of a detection signal obtained by scanning an electron beam toward the field of view, specifying a first position which is the boundary between the inclined plane and a non-inclined plane and a second position which is the position of a desired deep hole or deep groove positioned in the inclined plane using the acquired image, and calculating the height-direction dimension of a pattern constituting the circuit element having the deep hole, deep groove, or three-dimensional structure on the basis of a dimension in the sample surface direction between the first position and the second position and the angle of the inclined plane. 1. A pattern measurement method that acquires information on a pattern formed on a sample on the basis of scanning of a charged particle beam , the method comprising:forming a first inclined plane by irradiating an ion beam to a sample area including at least a first pattern and a second pattern different from the first pattern;acquiring a detection signal by scanning the charged particle beam to an area including the first pattern and the second pattern after the inclined plane is formed;obtaining an x coordinate and a y coordinate of each position of edges of the first pattern and the second pattern on the inclined plane on the basis of the detection signal and pitch information ...

CONSTRUCTION OF THREE-DIMENSIONAL PROFILES OF HIGH ASPECT RATIO STRUCTURES USING TOP DOWN IMAGING

The methods and systems disclosed here leverage currently available reliable top down imaging techniques used by SEMs and use computational methods to synthesize accurate D profiles of features of high aspect ratio structures in a device. Radial cross-sectional profiles obtained from different locations along the lateral direction at different heights/depths are stitched together to create one composite D profile of the HAR feature. 1. A computer-implemented method comprising:obtaining top-down scanning electron microscope (SEM) images of cross-sections of an array of high-aspect-ratio (HAR) features, wherein depths of the HAR features of the array gradually vary along a lateral direction from a maximum value to a minimum value;detecting edges of the cross-sections of each HAR feature of the array of HAR features;re-sampling each of the detected edges in a spatial domain at a target angular resolution;representing each of the re-sampled edges as a corresponding set of harmonics in a frequency domain, each set of harmonics preserving characteristic information about a respective cross-section of a HAR feature at a certain depth, wherein the set of harmonics is obtained by performing Fast Fourier Transform (FFT) on the re-sampled edges; andgenerating a composite three-dimensional (3D) profile of a HAR feature by stitching a plurality of cross-sections at various depths that are reconstructed from analyzing the corresponding sets of harmonics in the frequency domain, wherein the stitching is based on the preserved characteristic information about each cross-section of the plurality of cross-sections.2. The method of claim 1 , wherein the method further comprises: obtaining a coupon comprising the array of high-aspect-ratio (HAR) features, each HAR feature of the array of HAR features having substantially identical initial depth; and', 'preparing a test structure for vertical sampling along a direction of depth of the HAR features by removing a portion of the coupon to ...

Pattern Measurement Device and Computer Program

The purpose of the present invention is to provide a pattern measurement device that achieves both high-throughput measurement using a small number of measurements and high-accuracy measurement that uses statistical processing. To accomplish this purpose, the present invention proposes a pattern measurement device provided with a calculation processing device that acquires the signal intensity distribution for a plurality of positions included in a scanning region from a signal obtained through beam scanning; substitutes, into a probability density function having the signal intensity distribution as a random variable and the coordinates within the scanning region as a variable, a signal intensity distribution based on the signal obtained from the beam scanning; and for the plurality of positions within the scanning region, sets the coordinates within the scanning region at which the probability density function is at the maximum or at which prescribed conditions are met as the edge position. 1. A pattern measurement device comprising a calculation processing device that acquires signal intensity distribution for a plurality of positions included in a scanning region from a signal obtained through beam scanning , substitutes , into a probability density function having the signal intensity distribution as a random variable and coordinates within the scanning region as a variable , the signal intensity distribution based on the signal obtained through the beam scanning , and for the plurality of positions within the scanning region , sets the coordinates within the scanning region at which the probability density function is at the maximum or at which prescribed conditions are met as an edge position.2. The pattern measurement device according to claim 1 , wherein the calculation processing device sets a hyper parameter based on the coordinates in the scanning region.3. The pattern measurement device according to claim 2 , wherein the calculation processing device ...

CD-SEM TECHNIQUE FOR WAFERS FABRICATION CONTROL

A Critical Dimensions Scanning Electron Microscope (CD-SEM) is described that comprises a unit for performing CD-SEM measurements of a semiconductor wafer, a BSE imaging unit for obtaining a Grey Level image (GL) of the wafer, and a unit for GL analysis and for processing the GL analysis results with reference to results of the CD-measurements. 1. A method for detecting material properties and/or defects of semiconductor wafers , the method comprising:concurrently performing CD-SEM measurements of a semiconductor wafer, and analysis of a Grey Level image of the wafer, obtained by a material-sensitive and HAR-sensitive imaging technology; andprocessing together results of the CD-SEM measurements of the semiconductor wafer, and the analysis of the Grey Level image of the wafer, obtained by the material-sensitive and HAR-sensitive imaging technology.2. A method according to further comprising:automatically inspecting the semiconductor wafer, by performing:BSE imaging for obtaining the Grey Level image (GL) of the wafer,analysis of the obtained GL, concurrently withCD-SEM measurements of the semiconductor wafer,processing results of the CD-measurements together with results of the GL analysis, to determine material properties and/or defects of said wafer.3. The method of claim 2 , wherein the CD-SEM measurements are also performed using a Grey Level image created by the BSE imaging.4. A method according to claim 2 , further comprising detecting defectivity of the semiconductor wafers' fabrication process claim 2 , based on the material properties and/or defects determined for the wafer claim 2 , to enable control of the fabrication process.5. The method of claim 1 , wherein the semiconductor wafers are manufactured according to one or more of technologies characterized by High Aspect Ratio (HAR) claim 1 , the technologies comprising VIT claim 1 , DRAM claim 1 , VNAND.6. The method according to claim 2 , wherein performing the GL analysis comprises determining one or ...

Pose estimation

A method for pose recognition includes storing parameters for configuration of an automated pose recognition system for detection of a pose of a subject represented in a radio frequency input signal. The parameters having been determined by a first process including accepting training data including a number of images including poses of subjects and a corresponding number of radio frequency signals and executing a parameter training procedure to determine the parameters. The parameter training procedure including, receiving features characterizing the poses in each of the images, and determining the parameters that configure the automated pose recognition system to match the features characterizing the poses from the corresponding radio frequency signals.

INSPECTION METHOD FOR A MANUFACTURED ARTICLE AND SYSTEM FOR PERFORMING SAME

A method for performing inspection of a manufactured article. The method comprises acquiring a sequence of radiographic images of the article; determining a position of the article for each one of the acquired radiographic images; and performing a three-dimensional model correction loop which comprises, iteratively: generating a simulated radiographic image for each determined position of the article; and comparing the simulated radiographic images and the acquired radiographic images and generating a match result. If the match result is indicative of a mismatch, the method includes identifying and characterizing differences between the simulated radiographic images and the acquired radiographic images; correcting one of a geometry and a material density of a region of interest of the detailed three-dimensional model of the article based on each one of the identified and characterized differences; and performing a new iteration. A system for performing inspection is also provided. 1. A method for performing inspection of a manufactured article defined by a detailed three-dimensional model , the method comprising:acquiring a sequence of radiographic images of the article using a radiographic image acquisition device including at least one sensor array, the acquisition of the sequence of radiographic images being performed as relative movement occurs between the article and the radiographic image acquisition device;performing registration of the article in 3D space relative to the radiographic image acquisition device for each one of the acquired radiographic images; and generating a simulated radiographic image for each radiographic image acquired and corresponding to a registration of the article in a 3D space, generation of the simulated radiographic images being performed by ray casting through the detailed three-dimensional model to define the optical path of each pixel of the at least one sensor array;', 'comparing the simulated radiographic images and the ...

CROSS SECTIONAL DEPTH COMPOSITION GENERATION UTILIZING SCANNING ELECTRON MICROSCOPY

A method for generating cross-sectional profiles using a scanning electron microscope (SEM) includes scanning a sample with an electron beam to gather an energy-dispersive X-ray spectroscopy (EDS) spectrum for an energy level to determine element composition across an area of interest. A mesh is generated to locate positions where a depth profile will be taken. EDS spectra are gathered for energy levels at mesh locations. A number of layers of the sample are determined by distinguishing differences in chemical composition between depths as beam energies are stepped through. A depth profile is generated for the area of interest by compiling the number of layers and the element composition across the mesh. 1. A method for generating cross-sectional profiles using a scanning electron microscope (SEM) , comprising:scanning a sample with an electron beam to gather an energy-dispersive X-ray spectroscopy (EDS) spectrum for at least one energy level to determine element composition across an area of interest;generating a mesh to locate positions where a depth profile will be taken;gathering EDS spectra for a plurality of energy levels at a plurality of mesh locations;determining a number of layers by distinguishing differences in chemical composition between depths as beam energies are stepped through; andgenerating a depth profile for the area of interest by compiling the number of layers and the element composition across the mesh.2. The method as recited in claim 1 , wherein determining the number of layers by distinguishing differences in chemical composition between depths as beam energies are stepped through includes stepping through at least three different beam energies.3. The method as recited in claim 1 , wherein determining the number of layers by distinguishing differences in chemical composition between depths as beam energies are stepped through includes stepping through different beam energies by incrementing or decrementing beam energy by a set step size.4. ...

Measurement processing device, measurement processing method, measurement processing program, and method for manufacturing structure

A measurement processing device used for an x-ray inspection apparatus that detects an x-ray passing through a specimen with a detection unit to sequentially inspect a plurality of specimens on the basis of an acquired transmission image, includes a setting unit that sets a region to be inspected on a portion of the specimen; a determination unit that determines the non-defectiveness of the region to be inspected by using a transmission image of the x-ray that passed through the region to be inspected; a correction unit that performs a correction on the region to be inspected on the basis of a determination result by the determination unit; and a display control unit that displays the corrected region to be inspected corrected by the correction unit.

INSPECTION TOOL, INSPECTION METHOD AND COMPUTER PROGRAM PRODUCT

A method of determining a measurement sequence for an inspection tool inspecting a structure generated by a lithographic process performed by a lithographic system is presented, the method including deriving a model for the lithographic process as performed by the lithographic system, the model including a relationship between a set of system variables describing the lithographic system and an output variable representing the structure resulting of the lithographic process, determining an observability of one or more system variables in the output variable, and determining the measurement sequence for the inspection tool, based on the observability. 1. A method of determining a measurement sequence for an inspection tool inspecting a structure generated by a lithographic process performed by a lithographic system , the method comprising:deriving a model for the lithographic process as performed by the lithographic system, the model including a relationship between a set of system variables describing the lithographic system and an output variable representing the structure resulting of the lithographic process,determining an observability of one or more system variables in the output variable, anddetermining, by a hardware computer system and based on the observability, the measurement sequence for the inspection tool.2. The method according to claim 1 , wherein the set of system variables comprises one or more input variables of the lithographic process.3. The method according to claim 1 , wherein the output variable comprises an image of an area of interest comprising the structure claim 1 , obtained by an inspection tool.4. The method according to claim 3 , wherein the image comprises a two-dimensional digital image of the structure claim 3 , obtained by an electron beam inspection tool.5. The method according to claim 1 , wherein the model is a steady state mathematical model.6. The method according to claim 1 , wherein the model comprises a state-space model of ...

Image-Forming Device, and Dimension Measurement Device

An image forming device is provided that is capable of forming a proper integrated signal even when an image or a signal waveform is acquired from a pattern having the possibility of preventing proper matching, such as a repetition pattern, a shrinking pattern, and the like. In particular, the image forming device forms an integrated image by integrating a plurality of image signals and is provided with: a matching processing section that performs a matching process between the plurality of image signals; an image integration section that integrates the plurality of image signals for which positioning has been performed by the matching processing section; and a periodicity determination section that determines a periodicity of a pattern contained in the image signals. The matching processing section varies a size of an image signal area for the matching in accordance with a determination by the periodicity determination section. 1. A dimension measurement device comprising a processor that measures a dimension of a pattern formed on a sample based on an integrated signal formed by integrating a plurality of signal waveforms obtained by a microscope , whereinthe processor includes:a matching processing section that performs a matching process between the plurality of signal waveforms; and,a signal integration section that integrates the plurality of signal waveforms for which positioning has been performed by the matching process,wherein the matching processing section executes the matching such that another signal waveform shape is aligned with a certain signal waveform.2. The dimension measurement device according to claim 1 , wherein the matching processing section executes the matching such that a temporally subsequently acquired waveform is aligned with a temporally previously acquired waveform.3. The dimension measurement device according to claim 2 , wherein the matching processing section performs the matching with the previously acquired waveform by dividing ...

Scatterometry with High Harmonic Generation (HHG) Sources

A method for extending scatterometry measurements of periodic structures created on a substrate into the deep UV and soft X-ray regions of the electromagnetic spectrum is presented. The method comprises measuring the scattering of a high harmonic generated (HHG) beam, which is created by a driving laser, that is scattered from the structures on the substrate. The scattered HHG beam is measured by a spectrometer or a detector sensitive to HHG radiation. Also presented is a system for carrying out the method. 1. A method of measuring in the UV , XUV , x-ray spectral region the reflectance of a sample comprised of structures created on a substrate as a function of incident angle , polarization , wavelength , the scattered light angle , and , in the case of a periodic structure , the diffraction order; the method comprising:(a) focusing amplified femtosecond pulses of light from a laser into a high harmonic generated (HHG) medium, thereby generating a HHG beam;(b) directing the HHG beam to fall on the sample;(c) scanning the HHG beam relative to the sample;(d) measuring the intensity of the scattering/diffraction pattern of the HHG beam scattered/diffracted by the sample using a grazing incidence XUV spectrometer;(e) repeating steps (a) to (d) for a well-calibrated sample for which the reflectance as a function of wavelength and polarization is known; and(f) determining the reflectance of the sample from the measured intensity of the scattering/diffraction pattern of the sample and the measured intensity of the scattering/diffraction pattern and known reflectance of the well-calibrated sample.2. The method of comprising the additional step of applying scatterometry algorithms to the reflectance determined in step (f) in order to determine properties of the structures created on the substrate.3. The method of claim 1 , wherein the grazing incidence XUV spectrometer is replaced with one of the following:(a) an XUV spectrometer;(b) a deep UV spectrometer;(c) a soft X-ray ...

Thickness and convexity detection device for plate strip

The invention relates to a device for detecting the thickness and crown of plates and strips, belonging to the field of nuclear technology applications. The device comprises a C-frame; two ray source mounted in an upper arm of the C-frame and distributed at an interval along the width direction of a steel plate/strip; two rows of gas-pressurized ionization chamber detector arrays mounted in a lower arm of the C-frame and distributed at an interval along the moving direction of the plate/strip; collimators mounted below the two ray source, the collimators enabling the rays of each ray source to only irradiate to a corresponding row of detectors; pre-amplifier modules connected with the detector arrays; a data collector connected with the pre-amplifier modules; a data processing and displaying computer connected with the data collector; and a cooling water and pressurized air service system and a control system for ensuring system operation and monitoring. The device of the invention is simple in structure and high in dynamic measurement accuracy, and the detectors have the advantages of small temperature drift, irradiation resistance, high spatial resolution, high cost performance and the like.

MONITORING SYSTEM AND METHOD FOR CONTROLLING PROCESS OF SURFACE TREATMENT FOR CONSTRUCTION

A monitoring method and system are present for process control of surface treatment associated with material deposition on the surface, which provides for achieving and maintaining a desired (according to design rules) geometrical profile of the surface while being coated by certain substance/material. The technique of the invention provides for remotely and fully-automatically monitoring/verifying the geometrical profile of the surface being treated, and providing the control/verification data for executing local corrections. The technique can be applied to various geometrical profiles such as planar geometry, round/curved surface of a predetermined curvature, multi-portions surface with predetermined angular orientations of the multiple portions (e.g. 90 degree angles at corners of a room). 1. A monitoring system for monitoring a process of surface treatment including material deposition process applied to the surface to create a coating of said material on the surface , the system comprising a control unit comprising:data input utility configured to receive measured data indicative of a measured geometrical profile of the surface undergoing said treatment; and data processor and analyzer utility configured to analyze said measured data and determine a relative profile of said surface indicative of distribution of variations of the measured geometrical profile with respect to a design profile of said surface, and utilize said data indicative of the relative profile to generate control data indicative thereof; and a feedback module configured to receive said control data and generate feedback data formatted to be indicative of regions of the surface that are to undergo at least one of the additional material deposition process and a material removal process to maintain said design profile of the surface while being coated by said material.2. The monitoring system according to claim 1 , wherein the measured data indicative of the measured geometrical profile ...

Device and method for the additive manufacture of a workpiece

A device for additive manufacturing of a workpiece (10; 30) having a cell-like building space (24) for the workpiece to be built, preferably layer by layer, and an additive manufacturing unit (14; 34, 36) provided on or in the building space, wherein a workpiece measurement apparatus (16, 18, 20; 40, 42; 82, 86) is provided on or in the building space such that the workpiece measurement apparatus that provides the workpiece with irradiation from an irradiation source has a detector unit (22; 42) configured to detect an irradiation image of the workpiece provided with the irradiation on and/or through an outer wall of the workpiece, and/or to detect a nuclear spin image of the workpiece provided with the magnetic field excitation, and to generate workpiece measurement data from the irradiation image or the nuclear spin image.

SURFACE PROFILE DETECTION APPARATUS OF BURDEN IN BLAST FURNACE AND OPERATION METHOD

Provided is a surface profile detection apparatus of a burden in a blast furnace having a simple apparatus configuration and capable of detecting a deposited state of the burden while a shooter is turning and enabling an operation close to a theoretical deposition profile. The surface profile detection apparatus of a burden in a blast furnace includes a rotating plate mounted immediately above an opening part of the blast furnace and configured to rotate about an opening center of the opening part as a central axis, a rotating means for rotating the rotating plate, and a transmission and reception means for transmitting a detection wave such as a microwave or a millimeter wave in a linear shape along a diametrical direction of the rotating plate and receiving the detection wave. The surface profile detection apparatus performs transmission and reception in a direction orthogonal to a rotating direction of the rotating plate while rotating the rotating plate in synchronization with turning of the shooter so that transmission of the detection wave is not interrupted. 1. A surface profile detection apparatus of a burden in a blast furnace ,wherein the surface profile detection apparatus is configured to detect a surface profile of the burden such as iron ore, coke, limestone and the like in the blast furnace, to which the burden is supplied by a shooter, by transmitting a detection wave toward a surface of the burden deposited in the furnace and receiving the detection wave reflected on the surface of the burden, through an opening part of the blast furnace,wherein the surface profile detection apparatus comprises:a rotating plate mounted immediately above the opening part and configured to rotate about an opening center of the opening part as a central axis;a rotating means for rotating the rotating plate; anda transmission and reception means for transmitting the detection wave in a linear shape along a diametrical direction of the rotating plate and receiving the ...

IMAGE PROCESSING DEVICE, IMAGE PROCESSING METHOD AND CHARGED PARTICLE MICROSCOPE

An object of the invention is to quantitatively evaluate crystal growth amount in a wide range from an undergrowth state to an overgrowth state with nondestructive inspection. By using a plenty of image feature values such as pattern brightness, a pattern area and a pattern shape which are extracted from an SEM image, and depending on whether brightness inside a pattern is lower than brightness outside the pattern (), undergrowth and overgrowth is determined (). Based on a brightness difference or the pattern area, a growth amount index or a normality index of crystal growth in a concave pattern such as a hole pattern or a trench pattern is calculated (). 1. An image processing device , whereinpattern brightness and a pattern area are extracted as image feature values from an image of a concave pattern obtained by a charged particle beam microscope, anda growth amount index of crystal growth in the pattern is calculated by using the pattern brightness and the pattern area which are extracted.2. The image processing device according to claim 1 , whereinin a case where brightness inside the pattern is lower than brightness outside the pattern, a brightness difference between the brightness inside the pattern and the brightness outside the pattern is measured, and the growth amount index is calculated based on the brightness difference and a first calibration curve prepared in advance, andin a case where the brightness inside the pattern is higher than the brightness outside the pattern, the growth amount index is calculated based on the pattern area and a second calibration curve prepared in advance.3. The image processing device according to claim 1 , whereina pattern shape is extracted from the image of the pattern as the image feature value.4. The image processing device according to claim 3 , whereinthe pattern shape refers to a degree of circularity of the pattern, and a degree of tetragon to a degree of hexagon of the pattern.5. The image processing device ...

Automated and adaptive three-dimensional robotic site surveying

A method for generating a three-dimensional model of an asset includes receiving input parameters corresponding to constraints of a mission plan for operating an unmanned vehicle around an asset, generating the mission plan based on the input parameters including information of a representative asset type, wherein the mission plan includes waypoints identifying locations and orientations of one or more image sensors of the unmanned vehicle, generating a flight path for the unmanned vehicle connecting the waypoints that satisfy one or more predefined criteria, monitoring a vehicle state of the unmanned vehicle during execution of the flight path from one waypoint to the next waypoint, determining, at each waypoint, a local geometry of the asset sensed by the one or more image sensors, changing the mission plan on-the-fly based on the local geometry, and capturing images of the asset along waypoints of the changed mission plan.

APPARATUS FOR AND METHOD OF MEASURING SURFACE

An apparatus for measuring a surface comprises first sensors, which are distributed two-dimensionally in space, said first sensors interacting with the surface in a contactless manner using a microwave range of electromagnetic signals, and the first sensors receive at least two of the microwave signals of the interaction with information relating to distances between the sensors and the surface as a reflection, the microwave signals of the interaction representing both dimensions of the space of two-dimensional distribution of the first sensors. A data processing unit receives said information on the distances, and determines at least one geometrical parameter of the surface on the basis of the information. 1. An apparatus for measuring a surface of a sheet , wherein the apparatus comprisesat least two first sensors, which are distributed parallel with a longitudinal extent of a first edge of the sheet, the at least two first sensors being configured have an interaction with the surface of the sheet at the first edge in a contactless manner using a microwave range of electromagnetic signals, and at least one of the at least two first sensors being configured to receive at least two of the microwave signals of the interaction with information relating to distances between the at least two first sensors and the first edge as a reflection at different longitudinal sections of the sheet; anda data processing unit configured to receive the information, and determine at least one geometrical parameter of the first edge of the sheet based on the information.2. An apparatus for measuring a surface , wherein the apparatus comprisesat least three first sensors, which are distributed two-dimensionally in space, said at least three first sensors being configured to interact with the surface in a contactless manner using a microwave range of electromagnetic signals, and at least two of the at least three first sensors being configured to receive at least two of the microwave ...

MEASUREMENT PROCESSING DEVICE, MEASUREMENT PROCESSING METHOD, MEASUREMENT PROESSING PROGRAM, AND METHOD FOR MANUFACTURING STRUCTURE

A measurement processing device used for an x-ray inspection apparatus that detects an x-ray passing through a specimen with a detection unit to sequentially inspect a plurality of specimens on the basis of an acquired transmission image, includes a setting unit that sets a region to be inspected on a portion of the specimen; a determination unit that determines the non-defectiveness of the region to be inspected by using a transmission image of the x-ray that passed through the region to be inspected; a correction unit that performs a correction on the region to be inspected on the basis of a determination result by the determination unit; and a display control unit that displays the corrected region to be inspected corrected by the correction unit. 1. A measurement processing device used for an xray inspection apparatus that detects an x-ray passing through a specimen with a detection unit to sequentially inspect a plurality of specimens on the basis of an acquired transmission image , comprising:a setting unit that sets a region to be inspected on a portion of the specimen;a determination unit that determines the non-defectiveness of the region to be inspected by using a transmission image of the x-ray that passed through the region to be inspected;a correction unit that performs a correction on the region to be inspected on the basis of a determination result by the determination unit; anda display control unit that displays the corrected region to be inspected corrected by the correction unit.2. The measurement processing device according to claim 1 , wherein:after inspecting the plurality of specimens, the display control unit displays the non-defectiveness of the plurality of specimens corresponding to the region to be inspected or the corrected region to be inspected.3. The measurement processing device according to claim 2 , wherein:the display control unit displays a change in the non-defectiveness of the region to be inspected changing with each ...

Apparatus and method for generating three-dimensional (3d) shape of object under water

Provided is an apparatus and method for generating a three-dimensional (3D) shape of an object immersed in a liquid, in which the method may include receiving an image captured by photographing a section contour of the object immersed in a matching solution, generating a 3D shape of the object using the image, wherein the section contour may be formed according to a line laser emitted toward a surface of the object.

Method and system for dimensional analysis of an object

The invention relates generally to the measurement and dimensional analysis of an object and, more particularly, to the correction of distortion in volumetric data of the object using dimensional data of the object. In one embodiment, the invention provides a method of analyzing an object, the method comprising: acquiring volumetric data of an object using an X-ray computed tomography (CT) imaging system; acquiring dimensional data of the object using a vision-based system; determining whether the volumetric data include a distortion; and in the case that the volumetric data are determined to include a distortion, correcting the distortion in the volumetric data using the dimensional data.

METHOD OF MEASURING THE INTERIOR VOLUME OF AN OBJECT

The invention relates to a method of measuring the interior volume of an object, in which the object is contactlessly scanned using a computer tomographic scanner, the scanning results are used for an automatised construction of a three-dimensional model of the interior volume of the object, and the interior volume of the object is measured using computer processing of the obtained three-dimensional model. For an automatised creation of the three-dimensional model of the interior volume of the object, including an object with an open contour, and to prevent the occurrence of artefacts during measuring of an object, mainly a non-metallic one, according to the invention the interior volume of the object is filled with a filler before scanning, wherein the filler is a reusable filler and the radiodensity of the filler differs from the radiodensity of the object. Additionally the invention relates to the application of the inventive method for measuring the interior volume of shoes. 1. Method of measuring the interior volume of a non-metallic object comprising metallic elements , in which:{'b': 2', '2, 'the interior volume of the object is filled with a filler (), wherein the filler () is a reusable filler,'}the object is contactlessly scanned using a computer tomographic scanner,the scanning results are used for an automatised construction of a three-dimensional model of the interior volume of the object, andthe interior volume of the object is measured using computer processing of the obtained three-dimensional model,characterised in that{'b': 2', '2, 'the radiodensity of the filler () differs from the radiodensity of the object, wherein in order to avoid artefacts from metallic elements on the image of the object quartz sand is used as the filler ().'}22. Method according to claim 1 , characterised in that modified quartz sand is used as the filler () claim 1 , wherein the modified quartz sand is a quartz sand with additional ingredients claim 1 , which allows to ...

DIMENSION MEASURING DEVICE, DIMENSION MEASURING METHOD, AND SEMICONDUCTOR MANUFACTURING SYSTEM

The present disclosure relates to a dimension measuring device that shortens a time required for dimension measurement and eliminates errors caused by an operator. A dimension measuring device that measures a dimension of a measurement target using an input image is provided, in which a first image in which each region of the input image is labeled by region is generated by machine learning, an intermediate image including a marker indicating each region of the first image is generated based on the generated first image, a second image in which each region of the input image is labeled by region is generated based on the input image and the generated intermediate image, coordinates of a boundary line between adjacent regions are obtained by using the generated second image, coordinates of a feature point that defines a dimension condition of the measurement target are obtained by using the obtained coordinates of the boundary line, and the dimension of the measurement target is measured by using the obtained coordinates of the feature point. 1. A dimension measuring device that measures a dimension of a measurement target using an input image , whereina first image in which each region of the input image is labeled by region is generated by machine learning,an intermediate image including a marker indicating each region of the first image is generated based on the generated first image,a second image in which each region of the input image is labeled by region is generated based on the input image and the generated intermediate image,coordinates of a boundary line between adjacent regions are obtained by using the generated second image,coordinates of a feature point that defines a dimension of the measurement target are obtained by using the obtained coordinates of the boundary line, andthe dimension of the measurement target is measured by using the obtained coordinates of the feature point.2. The dimension measuring device according to claim 1 , whereinthe ...

ERROR REDUCTION IN IMAGES WHICH WERE GENERATED WITH CHARGED PARTICLES AND WITH THE AID OF MACHINE-LEARNING-BASED METHODS

Methods for determining one or more quality or size parameters of a structure in a semiconductor product, on the basis of an image of the semiconductor product which was generated with the aid of charged particles which have been radiated onto the semiconductor product, include: providing the image of the semiconductor product; applying the provided image to a machine-learning-based method such as, e.g., an artificial neural network which has been trained with training images of semiconductor products and which is configured to generate an output parameter from the provided image; and determining the size parameter of the structure on the basis of the output parameter. 1. A method , comprising:applying an image of a semiconductor product to a machine-learning-based method which has been trained with training images of semiconductor products to generate an output parameter from the image of the semiconductor product; andusing the output parameter to determine a size parameter of a structure in the semiconductor product,wherein the image of the semiconductor product was generated by radiating charged particles onto the semiconductor product.2. The method of claim 1 , wherein the image of the semiconductor product is an error-containing image comprising error components created due to the charged particles.3. The method of claim 1 , wherein:the image of the semiconductor product comprises an error-reduced image of the structure in the semiconductor product; andin the error-reduced image of the structure in the semiconductor product, error components created due to the charged particles are reduced compared to an image of the structure which comprises error components created due to the charged particles.4. The method of claim 3 , wherein the machine-learning-based method determines the size parameter of the structure in the semiconductor product directly from the image of the semiconductor product.5. The method of claim 2 , wherein the machine-learning-based method ...

Method and apparatus of measuring objects using selective imaging

A method of measuring an object registers the object with a model of the object, and determines at least one feature of the object to scan. Next, the method controls an X-ray scanning device to scan less than the entirety of the object to produce visual data representing at least one scanned portion. The at least one scanned portion has the at least one feature, while the X-ray scanning device is controlled as a function of registering the object and model.

Method and system for optimizing optical inspection of patterned structures

A system and method are presented for use in inspection of patterned structures. The system comprises: data input utility for receiving first type of data indicative of image data on at least a part of the patterned structure, and data processing and analyzing utility configured and operable for analyzing the image data, and determining a geometrical model for at least one feature of a pattern in said structure, and using said geometrical model for determining an optical model for second type of data indicative of optical measurements on a patterned structure.

MEASUREMENT SYSTEM AND METHOD FOR MEASURING A MEASUREMENT OBJECT, IN PARTICULAR A PLASTIC PROFILE

The invention relates to a measuring system () for measuring a measured object, in particular a plastic profile (), said measuring system () comprising: 1. A measuring system for measuring a measured object , in particular a plastic profile , said measuring system comprising:an antenna arrangement made of a plurality of THz transceivers, each at times actively emitting a THz transmission beam and at times passively receive reflected THz radiation,wherein said antenna arrangement puts out measuring signals of the measurements of the THz transceivers,an adjustment means for adjusting the antenna matrix into several measuring positions along an adjustment direction, a controller and evaluation device for receiving and evaluating the measuring signals which is configured in such a way that the measuring signals of said several THz transceivers in said several measuring positions are evaluated by means of an SAR evaluation process and a virtual model of the boundary surfaces of the measured object is created, andsubsequently the controller and evaluation device determines layer thicknesses between the boundary surfaces from the virtual model.2. The measuring system according to claim 1 , wherein the adjustment means pivots the antenna arrangement along a circumferential path claim 1 , in particular a complete or partial circular path claim 1 , about an axis of symmetry of the measuring system claim 1 , whereby in the measurements in the various measuring positions of the circumferential path an optical main axis of the antenna arrangement is each aligned to the axis of symmetry.3. The measuring system according to claim 1 , wherein the antenna arrangement comprises a two-dimensional claim 1 , preferably planar claim 1 , arrangement of THz transceivers claim 1 , in particular at constant distances between the THz transceivers claim 1 , e.g. as antenna matrix.4. The measuring system according to claim 1 , wherein the THz transceiver which currently is actively emitting the ...

CONSTRUCTION OF THREE-DIMENSIONAL PROFILES OF HIGH ASPECT RATIO STRUCTURES USING TOP DOWN IMAGING

The methods and systems disclosed here detect edges of top-down images of respective cross-sections of an array of high-aspect-ratio (HAR) features. The respective cross sections are at various depths of a HAR feature along a longitudinal direction. The detected edges are re-sampled in a spatial domain at a target angular resolution. The re-sampled edges are represented as a corresponding set of harmonics in a frequency domain, each set of harmonics preserving characteristic information about a respective cross-section of the HAR feature at a certain depth. A plurality of cross-sections at the various depths of the HAR feature are reconstructed by analyzing the corresponding sets of harmonics in the frequency domain. A 3D profile of the HAR feature is generated by stitching the plurality of re-constructed cross-sections at the various depths of the HAR feature. 1. A computer-implemented method comprising:detecting edges of top-down images of respective cross-sections of an array of high-aspect-ratio (HAR) features, wherein the respective cross sections are at various depths of a HAR feature along a longitudinal direction;re-sampling the detected edges in a spatial domain at a target angular resolution;representing the re-sampled edges as a corresponding set of harmonics in a frequency domain, each set of harmonics preserving characteristic information about a respective cross-section of the HAR feature at a certain depth, wherein the set of harmonics is obtained by performing Fast Fourier Transform (FFT) on the re-sampled edges;reconstructing a plurality of cross-sections at the various depths of the HAR feature by analyzing the corresponding sets of harmonics in the frequency domain; andgenerating a three-dimensional (3D) profile of the HAR feature by stitching the plurality of re-constructed cross-sections at the various depths of the HAR feature.2. The method of claim 1 , wherein the stitching comprises parametric stitching based on the preserved characteristic ...

SYSTEM AND METHODS FOR THREE DIMENSIONAL MODELING OF AN OBJECT USING A RADIO FREQUENCY DEVICE

A system for generating a three dimension (3D) imaging of an object, the system comprising: an electromagnetic transducer array such as an RF (radio-frequency) antenna array surrounding the object said array comprising: a plurality of electromagnetic transducers; a transmitter unit for applying RF signals to said electromagnetic transducer array; and a receiver unit for receiving a plurality of RF signals affected by said object from said electromagnetic transducers array; a Radio Frequency Signals Measurement Unit (RFSMU) configured to receive and measure said plurality of plurality of affected RF signals and provide RF data of the object; and at least one processing unit, configured to process said RF data to identify the dielectric properties of said object and construct a 3D image of said object. 1. A method for generating a three dimension (3D) image of an object using an electromagnetic transducer array surrounding the object , wherein said electromagnetic transducer array is a MIMO (Multiple Input Multiple Output) antenna array and wherein said electromagnetic transducer array comprising:a plurality of electromagnetic transducers;a transmitter unit;a receiver unit; anda Radio Frequency Signals Measurement Unit (RFSMU);the method comprising:rotating the antenna array or the object with respect to Y or X axis using one or more motors;applying RF (radiofrequency) signals to said electromagnetic transducer array using said transmitter unit;receiving at the receiver a plurality of RF signals affected by said object from said electromagnetic transducers array;measuring said plurality of affected RF signals using said RFSMU;providing RF data of the object based on said plurality of affected RF signals;processing said RF data using a processing unit to identify the dielectric properties of said object; andconstructing the 3D image of said object based on the identified dielectric properties of said object.2. The method according to claim 1 , further comprising: ...

FILLING MATERIAL VOLUME DETECTION SYSTEM COMPRISING MULTIPLE RADAR SENSORS

A fill level measurement system for detecting a topology of a filling material surface or a volume of a filling material in a container including a master device and one or more slave devices, the master device being designed to transmit control signals to the slave device. As the slave devices do not include all the functionalities of an independent fill level measurement device, the slave devices can be produced in a cost-effective manner. 116-. (canceled)17. A fill level measurement system for determining a topology of a filling material surface or a volume of a filling material in a container , comprising:a first fill level measurement device, which is configured as a master device; anda second fill level measurement device, which is configured as a slave device and is to be connected to the master device at a physical distance from the master device,wherein the master device is configured to transmit control signals to the slave device in order to control the slave device.18. The fill level measurement system according to claim 17 ,wherein the master device is connected to an external energy supply, in the form of a two-wire loop, andwherein the master device is configured to supply energy to the slave device.19. The fill level measurement system according to claim 18 ,wherein the master device is configured to be the sole supplier of energy to the slave device.20. The fill level measurement system according to claim 17 ,wherein at least one of the control signals is configured to initiate a measurement by way of the slave device.21. The fill level measurement system according to claim 20 ,wherein the slave device is not configured to independently decide whether to carry out a measurement, but requires the corresponding control signal from the master device in order to initiate a measurement.22. The fill level measurement system according to claim 17 ,wherein the slave device is configured to detect an echo curve, from which the distance between the slave ...

Waveguide coupling configuration for a line scanner

Exemplary waveguide coupling configuration can be provided for a fill level radar antenna, e.g., in the form of a line scanner. The exemplary waveguide coupling configuration can include a waveguide openings on the antenna side which can have a distance from one another that can correspond to less than or equal to one half of the wavelength of the transmission signal. For example, the distance between adjacent radiator elements can be greater than one half of the wavelength of the transmission signal. In this exemplary manner, more space can be provided for a front end on the printed circuit board.

Pattern Measurement Device and Pattern Measurement Method

The present invention comprises a computation device for measuring the dimensions of patterns formed on a sample on the basis of a signal obtained from a charged particle beam device. The computation device comprises a positional deviation amount calculation unit for calculating the amount of positional deviation in a direction parallel to a wafer surface between two patterns having different heights on the basis of an image acquired at a given beam tilt angle; a pattern inclination amount calculation unit for calculating an amount of pattern inclination from the amount of positional deviation using a predetermined relational expression for the amount of positional deviation and the amount of pattern inclination; and a beam tilt control amount calculation unit for controlling the beam tilt angle so as to match the amount of pattern inclination. The pattern measurement device sets the beam tilt angle to a calculated beam tilt angle, reacquires an image and measures the patterns. 1. A pattern measurement device comprising:a calculation device that measures a dimension of a pattern formed on a sample based on a signal obtained by a charged particle beam device, wherein a positional deviation calculation unit that calculates a positional deviation amount between two patterns having different heights in a direction parallel to the wafer surface based on an image acquired at any beam tilt angle,', 'a pattern inclination amount calculation unit that calculates an inclination amount of the pattern based on the positional deviation amount according to a relational expression between the positional deviation amount acquired in advance and the inclination amount of the pattern, and', 'a beam tilt control amount calculation unit that controls a beam tilt angle to match the inclination amount of the pattern, wherein, 'the calculation device includes'}the calculated beam tilt angle is set, the image is acquired again, and the pattern is measured.2. The pattern measurement device ...

Method for Validating Measurement Data

A method includes receiving, into a measurement tool, a substrate having a material feature, wherein the material feature is formed on the substrate according to a design feature. The method further includes applying a source signal on the material feature by using a source in the measurement tool having a tool setting parameter, collecting a response signal from the material feature by using a detector in the measurement tool to obtain measurement data, and with a computer connected to the measurement tool, calculating a simulated response signal from the design feature using the tool setting parameter. The method further includes, with the computer, in response to determining that a difference between the collected response signal and the simulated response signal exceeds a predetermined value, causing the measurement tool to re-measure the material feature. 1. A method comprising:receiving, into a measurement tool, a substrate having a material feature, wherein the material feature is formed on the substrate according to a design feature;applying a source signal on the material feature by using a source in the measurement tool having a tool setting parameter;collecting a response signal from the material feature by using a detector in the measurement tool to obtain measurement data;with a computer connected to the measurement tool, calculating a simulated response signal from the design feature using the tool setting parameter; andwith the computer, in response to determining that a difference between the collected response signal and the simulated response signal exceeds a predetermined value, causing the measurement tool to re-measure the material feature.2. The method of claim 1 , wherein applying a source signal includes applying an optical claim 1 , electronic claim 1 , or mechanical signal.3. The method of claim 2 , wherein collecting a response signal includes collecting a responded optical claim 2 , electronic claim 2 , or mechanical signal.4. The method ...

METHOD AND FACILITY FOR THE IN-LINE DIMENSIONAL CONTROL OF MANUFACTURED OBJECTS

A measurement method comprises acquiring, using image sensors (Cji) for each object during its displacement, at least three radiographic images of the region to be inspected. The images are obtained from at least three radiographic projections of the region to be inspected, the directions of projection (Dji) of which are different from each other. A computer system is provided with an a priori geometric model of the region to be inspected for the series of objects. Using the computer system and considering a constant attenuation coefficient and, from the a priori geometric model, at least three radiographic images of the region to be inspected, a digital geometric model of the region to be inspected is determined. For each object of the series, from the digital geometric model of the region to be inspected, at least one linear dimension measurement of the region to be inspected is determined. 12. A method for automatically measuring linear dimensions of manufactured objects () of a series consisting in:{'b': '2', 'selecting a series of manufactured objects () in which each of said objects is made of a material with a constant attenuation coefficient at all points of the object;'}selecting at least one region to be inspected from the objects in which at least one linear dimension is to be measured;transporting, by means of a transport device, the moving objects in a displacement direction (T) along a substantially rectilinear trajectory in a conveying plane (Pc), these objects generating a conveying volume (Vt) during their displacement;positioning, outside the conveying volume (Vt), at least one focus (Fj) of an X-ray generator tube and image sensors (Cji) each exposed and sensitive to X-rays obtained from an associated focus (Fj), these X-rays having passed through at least the region to be inspected producing on each image sensor a radiographic projection in the direction of projection (Dji);acquiring using image sensors (Cji), for each object during its ...

Full Beam Metrology For X-Ray Scatterometry Systems

Methods and systems for characterizing dimensions and material properties of semiconductor devices by full beam x-ray scatterometry are described herein. A full beam x-ray scatterometry measurement involves illuminating a sample with an X-ray beam and detecting the intensities of the resulting zero diffraction order and higher diffraction orders simultaneously for one or more angles of incidence relative to the sample. The simultaneous measurement of the direct beam and the scattered orders enables high throughput measurements with improved accuracy. The full beam x-ray scatterometry system includes one or more photon counting detectors with high dynamic range and thick, highly absorptive crystal substrates that absorb the direct beam with minimal parasitic backscattering. In other aspects, model based measurements are performed based on the zero diffraction order beam, and measurement performance of the full beam x-ray scatterometry system is estimated and controlled based on properties of the measured zero order beam.

Overlay measurement method, device, and display device

To address the problem in which when measuring the overlay of patterns formed on upper and lower layers of a semiconductor pattern by comparing a reference image and measurement image obtained through imaging by an SEM, the contrast of the SEM image of the pattern of the lower layer is low relative to that of the SEM image of the pattern of the upper layer and alignment state verification is difficult even if the reference image and measurement image are superposed on the basis of measurement results, the present invention determines the amount of positional displacement of patterns of an object of overlay measurement from a reference image and measurement image obtained through imaging by an SEM, carries out differential processing on the reference image and measurement image, aligns the reference image and measurement image that have been subjected to differential processing on the basis of the positional displacement amount determined previously, expresses the gradation values of the aligned differential reference image and differential measurement image as brightnesses of colors that differ for each image, superposes the images, and displays the superposed images along with the determined positional displacement amount.

A METHOD AND APPARATUS FOR DETERMINGING SIZE INFORMATION OF FOOD INGREDIENTS

The invention relates to a method and apparatus for determining a size information of food ingredients. The method comprises a step of applying () to the food ingredients an electrical field having a given radio frequency, the electrical field being generated by a source positioned in close proximity to the food ingredients, a first step of measuring () a ratio between the energy of the electrical field reflected from the food ingredients, and the energy of the electrical field generated by said source and applied to the food ingredients. The method also comprises a first step of determining (), based on said ratio, an average thickness of the food ingredients along the direction of the electrical field applied to the food ingredients. The method also comprises a second step of measuring (), for a plurality of distances between the source of the electrical field and the food ingredients, the ratio (R) between the energy of the electrical field reflected from the food ingredients, and the energy of the electrical field applied to the food ingredients. The method further comprises a step of identifying () a relatively sudden change in the amplitude of the ratios measured by said second step of measuring () and a step of deriving () the corresponding distance between the source of the electrical field and the food ingredients for which said relatively sudden change occurred. The method also comprises a second step of determining (), based on said corresponding distance and the divergent angle of the electrical field irradiating at said corresponding distance, an average diameter of the food ingredients in a plane perpendicular to the direction of the electrical field applied to the food ingredients. This invention results in a more convenient, robust and accurate way to determine the average thickness of the food ingredients. 1. A method of determining a size information of food ingredients , the method comprising:a step of applying to the food ingredients an ...

Method and device for determining the geometry of structures by means of computer tomography

The invention relates to a method for determining the geometry of a structure on an object at least by using a computer tomography sensor system comprising at least a radiation source, a mechanical axis of rotation, and a detector, preferably a planar detector, wherein surface measurement points are generated by the computer tomography sensor system, for example in the region of material transitions. In order to select the surface measurement points to be used for the determination of a geometry feature by using any target geometry, in particular without the availability of a CAD model being necessary, according to the invention, in order to determine the geometry features, surface measurement points are used which are associated with the geometry features to be determined on the basis of specifiable rules and the geometry features are determined from the associated surface measurement points.

Analysis method for fine structure, and apparatus and program thereof

Provided is a fine structure determination method capable of easily determining tilt angles of columnar scattering bodies that are long in a thickness direction, and provided are an analysis apparatus and an analysis program thereof. There is provided an analysis method for a fine structure of a plate-shaped sample formed to have columnar scattering bodies that are long in a thickness direction and periodically arranged, comprising the steps of preparing scattering intensity data from the plate-shaped sample, that is generated via transmission of X-rays; and determining tilt angles of the scattering bodies in the plate-shaped sample with respect to a reference rotation position at which a surface of the plate-shaped sample is perpendicular to an incident direction of the X-rays, based on the prepared scattering intensity data.

ANALYSIS METHOD FOR FINE STRUCTURE, APPARATUS, AND PROGRAM

Provided is an analysis method for a fine structure, that is capable of determining shapes of scattering bodies that are long in a thickness direction of a plate-shaped sample; and provided are an apparatus and a program thereof. There is provided an analysis method for a fine structure of a plate-shaped sample formed to have scattering bodies that are long in a thickness direction and periodically arranged, comprising the steps of preparing data of a scattering intensity from the plate-shaped sample measured via transmission of X-rays at a plurality of co rotation angles; calculating a scattering intensity of the X-rays scattered by the plate-shaped sample under a specific condition; fitting the calculated scattering intensity to the prepared scattering intensity; and determining shapes of the scattering bodies for the plate-shaped sample, based on a result of the fitting. 1. An analysis method for a fine structure of a plate-shaped sample formed to have scattering bodies that are long in a thickness direction and periodically arranged , comprising the steps of:preparing data of a scattering intensity from the plate-shaped sample measured via transmission of X-rays at a plurality of ω rotation angles;calculating a scattering intensity of the X-rays scattered by the plate-shaped sample under specific conditions;fitting the calculated scattering intensity to the prepared scattering intensity; anddetermining shapes of the scattering bodies for the plate-shaped sample, based on a result of the fitting.2. The analysis method according to claim 1 ,wherein the calculated scattering intensity of the X-rays is calculated by assuming a shape model in which the scattering bodies specified by parameters are periodically arranged in a direction parallel to a surface of the plate-shaped sample.3. The analysis method according to claim 1 ,wherein the calculated scattering intensity of the X-rays is calculated under a condition that the scattering bodies are formed by laminating ...

Methods And Systems For Combining X-Ray Metrology Data Sets To Improve Parameter Estimation

Methods and systems for measuring a complex semiconductor structure based on measurement data before and after a critical process step are presented. In some embodiments, the measurement is based on x-ray scatterometry measurement data. In one aspect, a measurement is based on fitting combined measurement data to a simplified geometric model of the measured structure. In some embodiments, the combined measurement data is determined by subtraction of a measured diffraction pattern before the critical process step from a measured diffraction pattern after the critical process step. In some embodiments, the simplified geometric model includes only the features affected by the critical process step. In another aspect, a measurement is based on a combined data set and a trained signal response metrology (SRM) model. In another aspect, a measurement is based on actual measurement data after the critical process step and simulated measurement data before the critical process step.

METHOD AND A DEVICE FOR SURFACE DETERMINATION BY MEANS OF MICROWAVES

An apparatus comprises: (1) measuring unit configured to transmit a signal towards the object and to determine a plurality of voxels, each comprising phase and magnitude of a reflected signal and spatial coordinates (comprising Z-axis, X-axis and Y-axis), and the voxels comprise a plurality of series of voxels along the Z-axis, each having a same X-coordinate and a same Y-coordinate; and (2) surface-determining unit comprising (a) magnitude unit configured to determine a maximum magnitude voxel for each series of voxels, (b) phase unit configured to determine, for each maximum magnitude voxel, phases of at least three voxels (maximum magnitude voxel and voxels adjacent thereto), (c) angle unit configured to determine, for each maximum magnitude voxel, a normal vector based on the respective phases, and (d) reconstructing unit configured to determine the object surface based on the spatial coordinates of the maximum magnitude voxels and the respective normal vectors. 115-. (canceled)16. An apparatus for measuring a surface of an object , comprising:a measuring unit configured to transmit a measurement signal in a direction towards the object and to determine, based on a reflected signal resulting from the transmitted measurement signal, a plurality of voxels, wherein each voxel comprises a phase and a magnitude of the reflected signal and one or more spatial coordinates, wherein the spatial coordinates comprise a Z-axis, which corresponds to a depth within the object, and an X-axis and a Y-axis, which are disposed perpendicular to the Z-axis and to each other, and wherein the plurality of voxels comprises a plurality of series of voxels along the Z-axis, each series of voxels along the Z-axis having a same X-coordinate and a same Y-coordinate; anda surface-determining unit comprising (a) a magnitude-determining unit configured to determine a voxel of a maximum magnitude for each series of voxels along the Z-axis, (b) a phase-determining unit configured to determine, ...

DEVICE AND METHOD FOR IMAGE RECONSTRUCTION AT DIFFERENT X-RAY ENERGIES, AND DEVICE AND METHOD FOR X-RAY THREE-DIMENSIONAL MEASUREMENT

The present invention provides a device and a method for image reconstruction at different X-ray energies that make it possible to achieve image reconstruction with higher accuracy. A device for image reconstruction at different X-ray energies includes: an X-ray source that irradiates a specimen to be imaged with X-rays; an energy-dispersive detector that detects a characteristic X-ray emitted from the specimen to be imaged ; a signal processing means that quantifies the peak of the characteristic X-ray detected by the detector ; and an image reconstruction means that reconstructs an image on the basis of a signal from the signal processing means. 1. An X-ray three-dimensional measurement device comprising:an image acquisition device that acquires an X-ray CT image of an object to be measured on a three-dimensional coordinate axis;an actual measurement device that actually measures the three-dimensional shape of the object to be measured on the three-dimensional coordinate axis; andan image correction device that corrects the X-ray CT image such that a sinogram of the X-ray CT image of the object to be measured, which has been acquired by the image acquisition device, converges to a sinogram of the three-dimensional shape of the object to be measured which has been actually measured by the actual measurement device.2. The X-ray three-dimensional measurement device according to claim 1 , wherein the image correction device corrects the X-ray CT image by using a maximum likelihood estimation and expectation-maximization reconstruction method.3. The X-ray three-dimensional measurement device according to claim 1 , wherein the image correction device corrects the X-ray CT image by using any one of a filtered backprojection method claim 1 , an addition type ART method claim 1 , a multiplication type ART method claim 1 , a SIRT method claim 1 , a gradient method claim 1 , a steepest descent method claim 1 , a conjugate gradient method claim 1 , a MAP-EM method claim 1 , ...

Measurement processing device, x-ray inspection apparatus, method for manufacturing structure, measurement processing method, x-ray inspection method, measurement processing program, and x-ray inspection program

A measurement processing device used for an x-ray inspection apparatus that detects an x-ray passing through a predetermined region of a specimen placed on a placement unit to perform an inspection on the shape of the predetermined region of the specimen includes: a setting unit that sets a three-dimensional region to be detected on the specimen; and a sliced-region selection unit that sets a plurality of sliced regions on the region to be detected, calculates, for each of the plurality of sliced regions, an amount of displacement of the predetermined region that is required to detect the region to be detected when the plurality of sliced regions is regarded as the predetermined region, and selects a sliced region for the inspection from among the plurality of sliced regions on the basis of each of the calculated amounts of displacement.

Pattern Measurement Device, and Computer Program

A purpose of the present invention is to provide a pattern measurement device that allows the selection of device conditions for calculating proper variability and allows the estimation of proper variability. The present invention provides a pattern measurement device comprising a computation processing device that, on the basis of a plurality of measured values acquired by a charged particle radiation device, calculates the variability of the measured values of a pattern that is the object of measurement, said pattern measurement device characterized in that a variability σof the plurality of measured values formed at different positions and σ=σ/Np+σ/(Np·Nframe) are used to calculate σ, which indicates measurement reproducibility error. σis the variability due to pattern shape error, Np is the number of measurement points, and Nframe is a value that changes according to device conditions. 2. The pattern measurement device according to claim 1 , whereinthe Nframe is a number of frames of the charged particle radiation device.3. The pattern measurement device according to claim 2 , wherein{'sup': 2', '2, 'sub': pattern0', 'sem0, 'the computation processing device calculates the Nframe with which σ/Np+σ/(Np·Nframe) satisfies a predetermined condition.'}4. The pattern measurement device according to claim 1 , wherein{'sup': '2', 'sub': 'CDpatterno', 'claim-text': {'br': None, 'sup': 2', '2', '2, 'sub': CDpattern0', 'CDobserved', 'CDsem0, 'i': '·Np·σ', 'σ−σ/Nframe\u2003\u2003[Expression]'}, 'the computation processing device calculates a variability σbased on a following expression having following parameters.'}5. The pattern measurement device according to claim 1 , whereinthe plurality of measured values are values measured at different timings and different positions. The present disclosure relates to a measurement device for a pattern formed on a semiconductor device or the like and a computer program that enables a computer to execute measurement processing, and ...

Characterizing a cutting tool edge

A method and apparatus for characterizing a cutting tool edge from an image of the cutting tool edge. Chips, cracks and other tool edge defects are measured, providing an indication of the condition of a cutting tool edge.