01-08-2013 дата публикации
Номер: US20130194569A1
A substrate inspection apparatus for inspecting a substrate, on which a measurement object is formed, is shown. The substrate inspection method includes measuring a substrate, on which a measurement object is formed, generating a plane equation of the substrate, and acquiring a region of the measurement object formed on the substrate. After, by considering a height of measurement object a region of the measurement object is converted into a substrate plane by plane equation,. Then, the measurement object is inspected based on a region of the measurement object converted into a substrate plane by plane equation and a region of the measurement object by reference data. Therefore, an offset value of a measurement object is acquired according to a tilted pose of the substrate, and a distortion of measurement data is compensated by using the offset value, to improve a measurement credibility of a measurement object. 1. A method of inspecting a substrate , comprising:generating a plane equation of a substrate by measuring the substrate, on which a measurement object is formed, with an image-capture part;acquiring a region of the measurement object formed on the measured substrate;converting the region of the measurement object into a substrate plane by the plane equation, by considering a height of the measurement object; andinspecting the measurement object based on the region of the measurement object converted into the substrate plane by the plane equation and a region of the measurement object by a reference data.2. The method of inspecting a substrate of claim 1 , wherein generating a plane equation claim 1 , comprises:generating the plane equation by measuring a distance between an indication marks that are formed on the substrate.3. The method of inspecting a substrate of claim 1 , wherein generating a plane equation claim 1 , comprises:generating the plane equation by measuring the substrate with a laser.4. The method of inspecting a substrate of claim 1 , wherein ...
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