Messaufnehmerhalterung für Beschleunigungsmesser.

Beschleunigungsmessaufnehmer

Verfahren zur Herstellung eines mikromechanischen Bauelements

BESCHLEUNIGUNGSMESSAUFNEHMER.

Elektrostatischer Kapazitätsbeschleunigungssensor

Elektrostatischer Kapazitätsbeschleunigungssensor mit einem Substrat (1), das einen Beschleunigungsdetektor (3) enthält, der ein bewegliches Teil (6) zum Erfassen einer Beschleunigung aufweist, einem Bondrahmen (7), der aus einer Schichtung besteht, die polykristallines Silizium und eine Isolierschicht enthält, und der auf dem Substrat so befestigt ist, dass er den Beschleunigungsdetektor umgibt, einer Kappe (8), die auf dem Substrat bereitgestellt ist, wobei die Fläche der Kappe, die dem Substrat zugewandt ist, aus einem Randbereich, der an dem Bondrahmen befestigt ist, und zusätzlich zu dem Randbereich aus einem Mittelbereich aufgebaut ist, und einer leitenden Abschirmschicht (9), die zumindest auf der gesamten Oberfläche des Mittelbereichs der Kappe ausgebildet ist, wobei die Abschirmschicht elektrisch mit dem beweglichen Teil verbunden ist, wobei ein Teil der Abschirmschicht (9) so ausgebildet ist, dass er sich auf die Oberfläche des Randbereichs erstreckt, und der Teil der Abschirmschicht ...

Pflaster zur Detektion von Bewegungen eines Körpers

Die vorliegende Erfindung betrifft ein Pflaster (20) zur Detektion von Bewegungen eines Körpers sowie dessen Verwendung.

Beschleunigungssensoranordnung

Die Erfindung betrifft eine Beschleunigungssensoranordnung, die insbesondere zur Messung niedrigerer Beschleunigungen geeignet ist. DOLLAR A Erfindungsgemäß weist die Beschleunigungssensoranordnung mindestens auf: DOLLAR A ein Premoldgehäuse (2, 3) aus einem Kunststoffmaterial mit einem Gehäuseinnenraum (5), DOLLAR A einen Leadframe (6), der sich durch das Premoldgehäuse (2, 3) in den Gehäuseinnenraum (5) erstreckt, und DOLLAR A einen Beschleunigungs-Sensorchip (12), der mittels einer Kleberschicht (11) in dem Gehäuseinnenraum (5) befestigt und mittels Leitungsbond-Verbindungen (14) mit dem Leadframe (6) verbunden ist. DOLLAR A Vorteilhafte Spannungsentkopplungen werden hierbei durch eine einheitliche Dicke der Kleberschicht (11) größer als 50 mum, vorzugsweise größer als 100 mum, erreicht, wobei insbesondere das Klebermaterial der Kleberschicht (11) weicher als das Chipmaterial des Beschleunigungs-Sensorchips (12) ist.

Semiconductor sensor, e.g. for pressure measurement etc.

A semiconductor sensor is claimed, with a sensor element (1) consisting of semiconductors and enclosed in a resin housing (5, 6). The housing is connected with another part (2) of the sensor, and a section (5a, 6a) of the housing in contact with part (2) is irradiated with UV to improve its adhesion. Also claimed are (i) a sensor as above, with a connector frame (2) which is electrically connected to element (1), the contact sections (2a, 2b) of the frame and (5a, 6a) of the housing being irradiated with UV as above; (ii) a sensor with an element (1) on a substrate (9), with a housing (5) enclosing the element and stuck to the substrate, the contact section of (5) being irradiated as above; (iii) a sensor with an element on a substrate stuck to the inner wall of a hollow housing, one end of which is open but sealed with a casting resin so that both substrate and element are surrounded by a closed cavity, the inner wall being irradiated with UV at the contact points with the substrate; ( ...

VERFAHREN ZUR SCHAFFUNG GLEICHMÄSSIGER DICKE UND ZUR KAPSELUNG VON MIKROMECHANISCHEN ANORDNUNGEN IN HALBLEITERPROZESSEN

Direction sensitive sensor for motor vehicle use e.g. for use in motor vehicle braking control or airbag system, is mounted using a highly viscous fixing mass that allows easy alignment of the sensor with the required direction

Electronic assembly has a direction dependent sensor arrangement (1) that is mounted on a support (6) using a highly viscous fixing mass (8) made of resin or mastic type material. The sensor arrangement is positioned in the fixing mass. The invention also relates to a corresponding mounting method.

Halbleitersensor eines Kapazitätstyps

In einem Halbleitersensor für eine dynamische Größe eines Kapazitätstyps sind ein Sensorchip (12) und ein Schaltungschip bzw. Mikroschaltungsbaustein (13) miteinander durch einen Haftfilm (16) verbunden, welcher eine Elastizität von 200 MPa oder weniger aufweist, um die Temperaturkenngröße zu verringern. Vier Bonddrähte (17) für eine Verbindung des Sensorchips (12) und des Schaltungschips (13) sind derart angeordnet, dass jeder der Bonddrähte an dem mittleren Abschnitt jedes Seitenabschnitts des Sensorchips (12) oder an jedem Eckenabschnitt des Sensorchips (12) lokalisiert ist, wodurch der Abstand der Bonddrähte (17) hinreichend erhöht wird und somit der absolute Wert der somit auftretenden parasitären Kapazität hinreichend verringert wird. Sogar dann, wenn die parasitäre Kapazität zwischen den vier Bonddrähten (17) sich ändert, ist daher die Änderung sehr klein, und somit kann der Einfluss auf die Sensorcharakteristik verringert werden.

Piezoelectric accelerometer for automobiles

The specification describes a piezoelectric accelerometer as in GB 2231965A but the claims relate to the use of a conductive casing 1 formed by a box-shaped portion 22 and cover 21, the latter having a recess 21 and through-type capacitors 10a, b which pass through a side wall of the recess and thus do not project beyond the casing outline. The capacitors provide connections between the internal circuitry on circuit board 9 and a connector 26. ...

Semiconductor Physical Quality Sensor

A semiconductor physical quantity sensor which is inexpensive, accurate, and has improved resistance to noise. The sensor comprises several digital input/output pads, 1 to 7, connected to a semiconductor chip. These pads are used to digitally trim the sensed signal in order to obtain a predetermined output. Trimming pads 3, 4 and 5 and ground pad 1 are connected to a ground terminal outside the chip and trimming pads 6 and 7 and power supply pad 2 are connected to a power supply terminal outside the chip.

Inertial sensor assembly

Planar array silicon chips 1' are micro-machined to incorporate tuning-fork sensors 2' of rotational acceleration, spatula sensors 9 of translational acceleration and surface formations. The chips are assembled in orthogonal arrangements by engaging the surface formations with one another. The formations may be a series of rectangular projections and recesses along the edges of the chips (8, figure 3) or body mortise holes 10 and corresponding protruding tenon tongues 11. Pads provide electrical connection between chips (7, fig 7). The pads on two chips could be connected by solder plugs (18, fig 7) or wire bonding (19, fig 8); or using electrically-conductive tangs (7', fig 10b), interlocking egde-lap joining forms (20, fig 11b) or residual interference-fit stress pressure (fig 9b).

DEVICE FOR THE RELEASE OF A SAFETY SYSTEM IN A VEHICLE

PRINTINGCOMPENSATED OPTICAL ACCELEROMETER, OPTICAL INCLINATION MEASURER AND SEISMIC SENSOR SYSTEM

MIKROSENSOR

In a microsensor with a micro-electromechanical sensor element and an integrated circuit for measuring, calibration and compensation electronics, whereby the sensor is connected electrically to the integrated circuit (IC), the micro-electromechanical sensor element is arranged directly on the integrated circuit with accurate positioning, and is connected with electric conductivity via a circulating soldered joint.

PROCEDURE FOR THE PRODUCTION OF MICROMECHANICAL STRUCTURES

An apparatus (WSM06)

Sensor apparatus and method for determining pedalling cadence and travelling speed of a bicycle

The present invention relates to a sensor apparatus (1) for determining a crank cadence and a bicycle speed. The sensor apparatus (1) comprises a housing (2) with an accelerometer (4) with first and second perpendicular measurement axes (z, y), capable of providing first and second signals dependent on the two measurement axes (z, y), a wireless transmitter (6), and a power source (8). The housing (2) comprises an attachment means (3) for attaching the housing (2) to a wheel of the bicycle. The sensor apparatus (1) further comprises a first means for determining the cadence from the rate at which consecutive changes of polarity occur in the first signal, or from the rate at which consecutive positive and negative extreme values occur in the first signal, and a second means for determining the speed from the rate at which consecutive maximum and minimum extreme values occur in the second signal.

Arrangement for encasing a functional device, and a process for the production of same

ACCELEROMETER PROTECTIVE STRUCTURE

ARRANGEMENT FOR ENCASING A FUNCTIONAL DEVICE, AND A PROCESS FOR THE PRODUCTION OF SAME

Low stress die attachment

ACCELEROMETER TRANSDUCER USED FOR SEISMIC RECORDING

Method for operating and testing a sensor assembly (210). The sensor assembly (210) preferably includes accelerometers with axes of sensitivity orthogonal to each other. The method preferably includes determining sensor tilt angle, determining the position of the sensor, and synchronizing the operation of the sensor.

AN INERTIAL MEASUREMENT UNIT AND METHOD OF OPERATION

The present invention relates generally to the field of inertial measurement units (IMU's) and their use in downhole applications and particularly to an IMU configured to allow a calculation of bias or drift, an encoder steering assembly and a drilling target indicator to calculate position of a downhole implement relative to an intended path.

ACCELEROMETER AND RATE SENSOR PACKAGE FOR GRAVITY GRADIOMETER INSTRUMENTS

Piezoelectric Type Acceleration Sensor with Metallic Case and Resin Package

Method for producing an acceleration sensor.

Die Erfindung betrifft ein Verfahren zur Herstellung eines Beschleunigungssensors für die Anwendung in Maschinen, Anlagen, Fahrzeugen oder Flugzeugen, der insbesondere zur Messung von Beschleunigungswerten in einer oder drei Achsen geeignet sein soll und der einfach und flexible gefertigt werden kann. Der Beschleunigungssensor umfasst ein in seiner Grundform zylindrisches oder kubisches Gehäuse (1) mit inneren Abstützungen (4) zur Aufnahme von je einem Sensorelement (2), das vormontiert mit einer Stirnfläche auf einer Abstützung (4) positioniert wird, wobei nachfolgend mittels Widerstandsschweissung Stirnfläche eine stoffschlüssige Verbindung zwischen Abstützung (4) und Sensorelement (2) ausgebildet wird.

Receiver device for the admission of seismic signals and use of this receiver device.

Optical-type acceleration sensor.

L’invention concerne un capteur d’accélération de type optique comportant une masse sismique (12), pourvue d’une surface réfléchissante (16) mobile selon un axe de rotation, une fibre optique émettrice (10) couplée à une source de lumière (11), destinée à émettre un faisceau lumineux (L), par une de ses extrémités (8), en direction de la surface réfléchissante (16), et une fibre optique réceptrice (20) couplée à un détecteur optique (21), destinée à recevoir, par une de ses extrémités (9), le faisceau lumineux (L) renvoyé par la surface réfléchissante (16). L’agencement de l’ensemble est tel qu’un mouvement de rotation de la surface réfléchissante (16) entraîne une déflexion du faisceau lumineux (L) et une variation de l’intensité lumineuse reçue par la fibre réceptrice (20). Selon l’invention, une lentille convergente (30) est interposée, sur le trajet optique du faisceau lumineux (L), entre les fibres optiques (10, 20) et la masse sismique (12).

A method of detecting and processing acceleration, particularly during a volleyball match.

La présente invention concerne un procédé de détection pour un appareil électronique comprenant un boîtier contenant un module électronique alimenté en énergie électrique par un moyen de stockage d’énergie électrique, ledit module électronique comportant une unité de calcul reliée à un capteur d’accélération et à une unité de mémoire, ledit module électronique étant également relié à un moyen d’affichage de manière à afficher des informations liées à des données du dit capteur d’accélération. Le procédé est notamment destiné à évaluer les mouvements effectuées lors d’un match de volley-ball.

ACCELEROMETER SENSOR OF RATTLING AND ITS MANUFACTORING PROCESS

Improved screened electrical sensor

TRANSMITTER HAS CONDUCTING CONNECTIONS WITHOUT STIFFNESS AND PROCESS DEFABRICATION

GUIDANCE SYSTEM COMPRISING A TRACK PANEL

Sensor module in conducting enclosure for motor car parts e.g. accelerometer

Le module capteur, contenant par exemple un accéléromètre, comprend un boîtier formé d'un support et d'un capot ou couvercle conducteur (38) délimitant une cavité contenant un capteur (16) à état solide à sorties électriques fixé au support, relié à des traversées de boîtier. Le support est constitué par une bande souple ayant au moins une pellicule isolante continue portant, sur une face, une couche conductrice gravée pour constituer des plages de raccordement et les traversées, sur l'autre face, des zones conductrices équipotentielles. Le capot est fixé de façon étanche sur une desdites zones équipotentielles (36). Les contacts du capteur sont reliés directement ou indirectement aux dites plages de raccordement à travers ladite pellicule isolante.

PIEZOELECTRIC DEVICE AND ELECTRONIC APPARATUS

Method for manufacturing a microelectromechanical component, and a microelectromechanical component

SEMICONDUCTOR ACCELERATION SENSOR AND MANUFACTURING METHOD THEREOF, CAPABLE OF REDUCING HORIZONTAL DEFORMATION OF LOW-ELASTIC MATERIAL BY FILLING THE LOW-ELASTIC MATERIAL IN CONCAVE PORTION

PURPOSE: A semiconductor acceleration sensor and a manufacturing method thereof are provided to enhance sensing accuracy of the acceleration sensor by reducing the deformation of the acceleration sensor chip due to temperrature variation. CONSTITUTION: A semiconductor acceleration sensor includes a package(1), a low-elastic material(3), and an acceleration sensor chip(4). The hollow package containing the acceleration sensor chip includes a concave portion in a predetermined region of the bottom of the inner package. The low-elastic unit is filled in the concave portion and has a viscous property. The acceleration sensor chip is arranged on the low-elastic material. The contact surface between the low-elastic material and the acceleration sensor chip is higher than the bottom of the inner package. © KIPO 2007 ...

SENSOR WITH A SINGLE ELECTRICAL CARRIER MEANS

SEMICONDUCTOR DEVICE TO RELATE TO SEMICONDUCTOR DEVICE HAVING HOLLOW STRUCTURE

PURPOSE: A semiconductor device is provided to embody stable operation even if a package is deformed by preventing deformation of the package caused by external stress or thermal expansion from being directly transferred to a semiconductor device. CONSTITUTION: A cavity(101a,101b) is formed in a package. A support member protrudes from one surface of the cavity. A semiconductor device is fixed to the support member in a manner that doesn't come in contact with any surface of the cavity. The support member can be a terminal with conductivity. The semiconductor device has a first electrode pad electrically and physically connected to the support member, fixed to the support member by the support member and the first electrode pad. © KIPO 2007 ...

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURE THEREOF, CAPABLE OF FORMING A MOLD RESIN COVERING A POLY SILICON AND AN ELECTRODE PAD

PURPOSE: A semiconductor device and a method of manufacture thereof are provided to suppress the exfoliation of a molded resin by forming a nitride film as a surface protection layer. CONSTITUTION: In a semiconductor device and a method of manufacture thereof, a nitride film(20) is formed on an insulating layer(14) and a wiring layer(16). A sealing unit(28) is formed on the nitride film in order to surround a moving part and a supporting part. A glass cap(30) is fixed on the sealing unit. A part of the electrode pad(32) is close to the wiring layer through the opening of the nitride film. A molded resin(36) is formed in order to cover a poly-silicon(22) and an electrode pad. COPYRIGHT KIPO 2012 ...

SENSOR PACKAGE

A sensor package (P) is of a type that is surface-mounted on a printed board (200) and comprises a case (1) in which a semiconductor acceleration sensor chip (100) having output pads (101) is housed. The case (1) has a bottom wall (10) that is demarcated into a central area (10a) where the semiconductor acceleration sensor chip (100) is held and a peripheral area (10b). Output electrodes (15) are formed on the outer surface of the peripheral area (10b) and electrically connected to the output pads (101). By soldering the output electrodes (15) to the printed board (200), the output of the semiconductor acceleration sensor chip (100) is electrically connected to an electric circuit of the printed board (200) through the output electrodes (15), and the sensor package (P) is mechanically held on the printed board. In the inner surface of the bottom wall (10), a groove (12) is formed between the central area (10a) and the peripheral area (10b). © KIPO & WIPO 2007 ...

METHOD OF MANUFACTURING AN ACCELEROMETER

Devices fabricated on a wafer are encapsulated by forming a pattern of bond rings on a cap wafer and aligning and bonding the two wafers together, under thermo-compression, so that an operational part (22) of each device (20) is surrounded by a respective bond ring (21). The bond ring provides a hermetic seal by occupying any trenches (25) or other discontinuities, such as conductive tracks (23), in the upper surface of the device crossed by the ring. An accelerometer is manufactured by etching at least one cavity (5) into the top side of a substrate (1), bonding an intermediate layer of material (6) onto the top side of the substrate, depositing metallization (7) onto the intermediate layer and etching the metallization and intermediate layer to form a sensor structure suspended over each cavity. Conductive tracks (31, 32) of a lower metallization layer deposited on the substrate (30) cross under tracks (37, 38) deposited on the upper side of the intermediate layer (35, 36) without making ...

AN ACCELEROMETER

Accelerometers frequently use piezoelectric elements which are subjected to compression or displacement, however rarely to bending, because asymmetries usually appear, which create signals from undesired influences as well. According to the invention this is avoided in a very symmetric construction with a number of mechanically biased bending elements (2) in the same plane, which are only supported at the ends and at the midpoints, where the electrical connections are also made.

ACCELERATION SENSOR AND SENSOR DEVICE

Disclosed is an acceleration sensor (10) wherein an acceleration sensor chip having an acceleration sensor element (16) including a plummet portion (28), which swings in accordance with the acceleration applied thereto, and a base portion (18) for supporting the acceleration sensor element (16) is mounted onto a substrate (12). A buffering member (46) is arranged between the base portion (18) and the substrate (12) for absorbing thermal stress generated when the base portion (18) and the substrate (12) are thermally expanded or contracted.

HYDROPHONE ASSEMBLY

L'invention porte sur un hydrophone (500) dont la réponse en fréquence (510), correspond à celle d'un accéléromètre. Dans l'exécution préférée, (500), la réponse en fréquence, voisine de celle d'un différenciateur (520), est combinée à une paire de décalages simples de fréquence (510), et à un système d'enregistrements séismiques (550).

Physical quantity sensor device, and inclinometer, inertia measurement device, structure monitoring device, and moving object using physical quantity sensor device

A physical quantity sensor device includes a physical quantity sensor and a storage. The storage stores a first constant used as a constant of each term in an approximate polynomial to obtain a first secondary frequency temperature characteristic approximated to the actual frequency temperature characteristic, in a first temperature region less than the first boundary temperature, and a second constant used as a constant of each term in the approximate polynomial to obtain a second secondary frequency temperature characteristic approximated to the actual frequency temperature characteristic, in a second temperature region equal to or greater than the first boundary temperature.

Servo accelerometer

In a servo accelerometer, a support rod is formed integrally with a pole piece bottom, which is disposed between a magnetic yoke and a magnet. The support rod is extended to penetrate to the outside through a through-hole formed in a closure plate portion of the magnetic yokes. The sensing mechanism is connected via the support rod to a housing by fixing the support rod at the extended end thereof to the housing. The support rod may be formed integrally with the closure plate portion of the magnetic yoke, rather than the pole piece bottom.

INTEGRATED MEMS PACKAGE

Systems and methods of fabricating an integrated Micro-Electro-Mechanical Systems (MEMS) package. The MEMS package includes a substrate that has a substantially planar first surface including a cavity configured to receive a MEMS die. A substantially planar second surface is parallel to and spaced apart from the first surface. The second surface is configured to receive a flip chip. The MEMS die is inserted into the cavity. The flip chip is affixed to the substrate to establish operative connection between the MEMS die and the flip chip through traces in the substrate.

MEMS wafer level package

An improved wafer level encapsulated micro-electromechanical device fabricated on a semiconductor wafer and a method of manufacture using state-of-the-art wafer fabrication and packaging technology. The device is contained within a hermetic cavity produced by bonding a silicon wafer with active circuits to an etched silicon wafer having cavities which surround each device, and bonding the two wafer by either thin film glass seal or by solder seal. The etched wafer and thin film sealing allow conductors to be kept to a minimum length and matched for improved electrical control of the circuit. Further, the device has capability for a ground ring in the solder sealed device. The devices may be packaged in plastic packages with wire bond technology or may be solder connected to an area array solder connected package.

Micro inertia sensor and method of manufacturing the same

The present invention provides a micro inertia sensor and a method of manufacturing the same, the micro inertia sensor includes a lower glass substrate; a lower silicon including a first border, a first fixed point and a side movement sensing structure; an upper silicon including a second border, a second fixed point being connected to a via hole, in which a metal wiring is formed, on an upper side, and an sensing electrode, which correspond to the first border, the first fixed point and the side movement sensing structure; a bonded layer by a eutectic bonding between the upper silicon and the lower silicon; and a upper glass substrate, being positioned on an upper portion of the upper silicon, for providing the via hole on which an electric conduction wiring is formed, thereby aiming at the miniaturization of the product and the simplification of the process.

Physical quantity sensor

A physical quantity sensor includes a package, a circuit chip disposed and held in the package, a sensor chip stacked and fixed on the circuit chip, and a wiring member having flexibility, through which the circuit chip and the package are electrically and mechanically bonded together. In the physical quantity sensor, unwanted external vibrations transmitted to the sensor chip are reduced without an external vibration dumping system such as a rubber pad, because the wiring member weakens the vibrations.

Thermal-stress-resistant semiconductor sensor

A semiconductor sensor is provided with a good temperature characteristic, the sensor being capable of preventing a pressure or acceleration detection characteristic from being affected by a change of the surrounding temperature. A semiconductor chip is provided approximately in the center of a die pad of a lead frame and detects a displacement amount corresponding to a pressure or an acceleration. The displacement amount is converted into an electric signal and output. A resin mold is formed so as to cover the semiconductor chip. A thermal-stress-relieving buffer ring is provided on the die pad so as to surround an external circumference of the semiconductor sensor chip thereby preventing stress caused by thermal expansion/contraction of the resin mold from being directly applied to the semiconductor chip from the side.

Vibration acceleration sensor

An acceleration sensor, including: an oscillator unit for outputting an oscillator signal, the oscillator unit including a first piezoelectric vibrating reed having a vibrating arm that performs bending vibration, as well as an oscillator circuit for oscillating the first piezoelectric vibrating reed; a phase shifting unit for shifting and outputting a given phase angle of an output signal of the oscillator unit; a phase shift circuit unit provided with a second piezoelectric vibrating reed having a vibrating arm that performs bending vibration, arranged at an output side of the phase shifting unit; a multiplier for multiplying the output signal of the phase shift circuit unit by the output signal of the oscillator circuit; and a phase shift modification output unit which receives an output from the multiplier and outputs a value corresponding to a change in a phase shift angle of an input-output signal of the phase shift circuit unit; a resonant frequency of the second piezoelectric vibrating ...

Composite sensor

A composite sensor includes an angular velocity sensor element, an acceleration sensor element, a signal processing IC for processing signals from the angular velocity sensor element and the acceleration sensor element, an inner package for accommodating the angular velocity sensor element, the acceleration sensor element, and the signal processing IC; a coupler connected to this inner package, and a fixing member connected to this coupler for holding the inner package via this coupler. The coupler is elastically deformable. One of the acceleration sensor element and the signal processing IC is located at the right with respect to the center of the inner package, and the other of the acceleration sensor element and the signal processing IC is located at the left with respect to the center of the inner package. The composite sensor angular maintains its characteristics of the angular velocity sensor element while the angular velocity sensor element and the acceleration sensor element are ...

Decoupling structure for accelerometer

Accelerometer including a decoupling structure for fixing the accelerometer on a package and a MEMS sensor chip for measuring an acceleration. The chip is supported by the decoupling structure and includes a sensor wafer layer of a semiconductor material. The decoupling structure forms a bottom portion for fixing the decoupling structure on the package and a top portion fixed to the sensor wafer layer so that the chip is arranged above the decoupling structure. A width of the top portion in a planar direction is smaller than a width of the bottom portion and/or the sensor wafer layer in the planar direction. The decoupling structure is made of the same semiconductor material as the sensor wafer layer. The centre point of the top portion is arranged in a central region of the bottom portion. The chip includes a hermetically closed cavity which includes a seismic mass of the chip.

Use of visco-elastic polymer to reduce acoustic and/or vibration induced error in microelectromechanical devices and systems

A system and method for reducing rectification error in a MEMS device cause by noise and/or vibration. A visco-elastic polymer is situated around at least part of the MEMs device, wherein the visco-elastic polymer converts at least some of the acoustic and/or vibration energy into heat, thereby reducing effects of the external acoustic and/or vibration energy on the MEMS device.

WEARABLE SENSOR ENCLOSURE

Various examples of a wearable sensor enclosure are described. In an example, a wearable sensor enclosure is generally oval-shaped with rigid interior that protects one or more sensors or other electronic devices. The enclosure includes a proximal component and a distal component. The proximal component of the enclosure optionally includes one or more openings for light to pass through for detection by sensing electronic devices. The distal component includes a protrusion positioned in an interior of the distal component and a lip positioned in along the perimeter of the distal component such that the lip surrounds the protrusion.

PHYSICAL QUANTITY DETECTION DEVICE, PHYSICAL QUANTITY DETECTOR, ELECTRONIC APPARATUS, AND MANUFACTURING METHOD OF PHYSICAL QUANTITY DETECTION DEVICE

A physical quantity detection device includes a base; a movable body that is supported by the base, and is displaced depending on a physical quantity; a physical quantity detection element that is laid between the base and the movable body; a support unit that is provided on at least one side of both main surfaces of the movable body; and a mass body that includes a first opening part, and is supported by the support unit in such a way that an inside of the first opening part is filled with the support unit. 1. A physical quantity detection device comprising:a base;a movable body that is supported by the base, and is displaced depending on a physical quantity;a physical quantity detection element that is laid between the base and the movable body;a support unit that is arranged above at least one side of both main surfaces of the movable body; anda mass body that includes a first opening part, and is supported by the support unit in such a way that an inside of the first opening part is filled with the support unit.2. The physical quantity detection device according to claim 1 ,wherein the support unit is arranged to be extended to a circumference of an opening of the first opening part of the mass body.3. The physical quantity detection device according to claim 1 ,wherein the first opening part includes:a first section that has a first internal diameter; anda second section that is further separated from the movable body than the first section, continues on the first section, and has a second internal diameter which is greater than the first internal diameter.4. The physical quantity detection device according to claim 1 ,wherein the first opening part has a taper-shaped inner wall surface.5. The physical quantity detection device according to claim 1 ,wherein the first opening part is a through-hole which communicates with the second opening.6. The physical quantity detection device according to claim 5 ,wherein the support unit is arranged to be extended to the ...

Sеrvо ассеlеrоmеtеr

In а sеrvо ассеlеrоmеtеr, а suppоrt rоd is fоrmеd intеgrаllу with а pоlе piесе bоttоm, whiсh is dispоsеd bеtwееn а mаgnеtiс уоkе аnd а mаgnеt. Тhе suppоrt rоd is ехtеndеd tо pеnеtrаtе tо thе оutsidе thrоugh а thrоugh-hоlе fоrmеd in а сlоsurе plаtе pоrtiоn оf thе mаgnеtiс уоkеs. Тhе sеnsing mесhаnism is соnnесtеd viа thе suppоrt rоd tо а hоusing bу fiхing thе suppоrt rоd аt thе ехtеndеd еnd thеrеоf tо thе hоusing. Тhе suppоrt rоd mау bе fоrmеd intеgrаllу with thе сlоsurе plаtе pоrtiоn оf thе mаgnеtiс уоkе, rаthеr thаn thе pоlе piесе bоttоm.

COMBINED CORRUGATED PIEZOELECTRIC MICROPHONE AND CORRUGATED PIEZOELECTRIC VIBRATION SENSOR

A combined MicroElectroMechanical structure (MEMS) includes a first piezoelectric membrane having one or more first electrodes, the first piezoelectric membrane being affixed between a first holder and a second holder; and a second piezoelectric membrane having an inertial mass and one or more second electrodes, the second piezoelectric membrane being affixed between the second holder and a third holder.

Information handling system stylus with power management through acceleration and sound context

An information handling system stylus includes components to support active tip writing inputs at a touchscreen display with the active tip powered by a rechargeable battery. An accelerometer and microphone included in the housing cooperate to manage battery life with instructions executed on a processing resource included in the accelerometer and/or microphone. The instructions apply different wake behaviors to manage stylus power consumption based upon whether the stylus couples to and information handling system, such as monitoring stylus motion with different wake intervals and monitoring for predetermined acceleration profiles, such as walking, falling and rolling.

Sensor module having conductive bonding members with varying melting points and young's moduli

A sensor module includes: a substrate including a first terminal and a second terminal; a first conductive bonding member having a first melting point and a first Young's modulus; a lead bonded to the first terminal by the first conductive bonding member; a second conductive bonding member having a second melting point lower than the first melting point and a second Young's modulus higher than the first Young's modulus; and an inertial sensor bonded to the second terminal by the second conductive bonding member.

MOLDED HOUSING USED IN FORCE FIT METHOD

WAFER LEVEL PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME

A wafer level package structure, in which a plurality of compact sensor devices with small variations in sensor characteristics are formed, and a method of producing the same are provided. This package structure has a semiconductor wafer having plural sensor units, and a package wafer bonded to the semiconductor wafer. The semiconductor wafer has a first metal layer formed with respect to each of the sensor units. The package wafer has a bonding metal layer at a position facing the first metal layer. Since a bonding portion between the semiconductor wafer and the package wafer is formed at room temperature by a direct bonding between activated surfaces of the first metal layer and the bonding metal layer, it is possible to prevent that variations in sensor characteristics occur due to residual stress at the bonding portion.

Sensor

A system for acquiring environnemental information measurements. The 5 system (100) utilizes a sensor, (205) a front-end circuit, (310) a loop filter (315), a switch controller (206), and a recuced-oder loop control circuit to provide reliable data measurements while providing robust system behavior. The system further includes a sensor simulator (330) for simulating the operation of the sensor (205) and testing the operation of the front-end circuit (310) nd the loop filter (315).

device for housing electrical components

ACCELEROMETER MOUNTING ADAPTOR, ACCELEROMETER MOUNTING SYSTEM AND ACCELEROMETER MOUNTING METHOD

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a semiconductor device ensuring airtightness of a cavity, and also reducing an electric resistance of an the interconnection. SOLUTION: A first interconnection 13 is formed along a groove of a substrate SB1 and on a bottom surface of the groove, and has a first thickness. A second interconnection 3 is electrically connected to the first interconnection 13 and has a second thickness larger than the first thickness. An acceleration sensing unit EL is electrically connected to the second interconnection 3. A sealing unit 6S has a portion opposed to the substrate SB1 with the first interconnection 13 therebetween, and surrounds the second interconnection 3 and the acceleration sensing unit EL on the substrate SB1. A cap 10 is arranged on the sealing unit 6S to form the cavity CV on a region of the substrate SB1 surrounded by the sealing unit 6S. COPYRIGHT: (C)2009,JPO&INPIT ...

Piezoelectric accelerometer for automobiles

ACCELEROMETERS.

A sensitive accelerometer provides signals for use in stabilising the flight of a projectile such as a guided missile, but during launch of the missile, may be subjected to high shock accelerations which can damage its acceleration-sensitive element. An accelerometer which minimises the likelihood of such damage comprises a flexible beam 1 which is able to deform resiliently in the z- direction to measure acceleration in that direction and which is able to move as a whole in the x, y plane transverse to this direction. During launch the movement of inertial mass 2 causes the beam 1 and its supporting members 3, (4), to pivot about one of edges 7, 8 until restrained by one of abutments 9, 10. The beam is returned to its central position under the action of spring 11 when the high acceleration phase is past. ...

Acceleration sensor

Mounting system for precision transducer

Most prior mounting systems for accelerometers have been noncompliant and have therefore resulted in stress being applied to the transducer due to differential thermal expansion. This limitation is overcome by the mounting system of the present invention that is adapted to support a precision transducer (14) in spaced alignment with a supporting case (12). The mounting system comprises a plurality of mounting elements (30), each mounting element having a first end (34), a second end (32) and a resilient intermediate portion (36). The first end is connected to the transducer, and the second end is connected to the case. The first ends of adjacent mounting elements are preferably joined to one another by bridge sections (38) to form a continuous mounting ring (16), and the second ends of adjacent mounting elements are preferably separated by gaps (56). At least the first ends and bridge sections are composed of a substance that has a coefficient of thermal expansion approximately equal to ...

MEMS accelerometer sensing device

Sensor apparatus

The present disclosure relates to a sensor module (2,fig 1) including a housing (3) and a sensor (4). The housing (3) has a first abutment surface (6, fig 3) for abutting a mounting surface (13, 21, fig 9). A first housing axis (Z1) extends perpendicular to said first abutment surface (6). The sensor (4) has at least a first sensing axis (SZ). The sensor (4) is disposed in said housing (3) such that the first sensing axis (SZ) is inclined at an acute angle (a3) to the first housing axis (Z1). The present disclosure also relates to a sensor assembly (1) including a sensor module (2) and an inclined mount (20). The sensor module (2) and the sensor assembly (1) have particular application in a vehicle (V), such as a motor vehicle. The present disclosure also relates to a method of installing a sensor module (2) and/or a sensor assembly (2).

MOUNTINGS FOR TRANSDUCERS

... 1427924 Transducer mountings LUCAS ELECTRICAL CO Ltd 12 June 1973 [17 March 1972] 12530/72 Heading G1N A mounting for a transducer, e.g. a Piezo-electric accelerometer, comprises an electrically insulating block 10 to which the transducer may be fixed by any of threaded holes 17 and a metal base 13 screwed and glued to the block. The base has a contour matching that of a body to which the transducer mounting is to be fixed, and a gap is left between the base and the bottom of block 10 through which a strap may be passed to facilitate mounting. The block 10 may be of nylon filled with glass or asbestos.

Plaster for detecting motions of a body

PIEZOELECTRIC ACCELEROMETER FOR AUTOMOBIES

GRAIN DETECTION APPARATUS

PROCEDURE FOR THE MEASUREMENT OF THE CLOSING SPEED

ARRANGEMENT WITH A SENSOR

ACCELERATION SENSOR WITH TWO POSSIBLE ORIENTATIONS OF THE MEASURING AXLE REGARDING THE HOUSING

PROCEDURE FOR latches of a CAVITY FOR AT LEAST a MICROELECTRONIC DEVICE

SEMICONDUCTOR SENSOR

Package integrated accelerometer

Inertia Detecting Transducer

Micro-mechanical inertial sensors

MEMS SENSOR SYSTEMS AND METHODS

MEMS Sensor Systems and Methods are provided. In one embodiment, a method for producing a six degree of freedom inertial sensor is provided. The method comprises fabricating a first silicon wafer segment having at least one inertial sensor pair, the at least one inertial sensor pair comprising one or both of a pair of orthogonally oriented accelerometers and a pair of orthogonally oriented gyroscopes; fabricating a second silicon wafer segment having at least one inertial sensor, the at least one inertial sensor comprising one or both of an accelerometer and a gyroscope; assembling together the first silicon wafer segment and the second silicon wafer segment such that the at least one inertial sensor pair and the at least one inertial sensor are oriented orthogonal to each other, and bonding the first silicon wafer segment to the second silicon wafer segment.

CALIBRATION OF SENSORS

A plurality of seismic sensors calibration method (100) includes: an assembling so that sensors are coupled with each sensor positioned with its axis of sensitivity in a different spatial direction calibration system step (105), a rotating sensors step (110), a measuring sensors output signals step (115), a sensor output signal processing step (120) and a storing calibration coefficient(s) step (125).

SENSOR DESIGN AND PROCESS

An accelerometer (305) for measuring seismic data. The accelerometer (305) includes an integrated vent hole for use during a vacuum sealing process and a balanced metal pattern for reducing cap wafer bowing. The accelerometer (305) also includes a top cap press frame recess (405) and a bottom cap press frame recess (420) for isolating bonding pressures to specified regions of the accelerometer (305). The accelerometer (305) is vacuum-sealed and includes a balanced metal pattern (730) to prevent degradation of the performance of the accelerometer (305). A dicing process is performed on the accelerometer (305) to isolate the electrical leads of the accelerometer (305). The accelerometer (305) further includes overshock protection bumpers (720) and patterned metal electrodes to reduce stiction during the operation of the accelerometer (305).

ELECTRONIC STATOR END WINDING ACCELEROMETER SENSOR

An insulated accelerometer assembly (10) is provided for attachment to a vibrated component (12). A base (16) has a portion for engagement and connection with the vibrated component (12) and to transmit vibration. An accelerometer (34) senses vibration and is located at least partially within the base (16). A housing (16) at least partially encloses the accelerometer (34) and inhibits voltage discharge, corona damage, and voltage tracking on the accelerometer (34). The housing (16) is made of an insulating material and has an interior for the accelerometer (34). The housing (16) has a plurality of raised fins (60) on the exterior. A mounting cap (42) also inhibits voltage discharge, corona damage, and voltage tracking and secures the housing (36). The mounting cap (42) is made of insulating material and has an exterior that includes a plurality of raised fins (52). A cable (70) has an electrically conductive wire (82) and has a shield (80) to inhibit electrical noise.

Physical quantity detection device, physical quantity detector, electronic apparatus, and manufacturing method of physical quantity detection device

The invention provides a physical quantity detection device, a physical quantity detector, an electronic apparatus, and a manufacturing method of the physical quantity detection device. The physical quantity detection device includes a base; a movable body that is supported by the base, and is displaced depending on a physical quantity; a physical quantity detection element that is laid between the base and the movable body; a support unit that is provided on at least one side of both main surfaces of the movable body; and a mass body that includes a first opening part, and is supported by the support unit in such a way that an inside of the first opening part is filled with the support unit.

Sensor apparatus and sensor apparatus attachment structure

A sensor apparatus is disclosed, which includes: a terminal (20); an electronic component (10) that is connected with a first end part (21) of the terminal (20); an insulating resin (30) that seals the electronic component (10) and the terminal (20), with a second end part (22) of the terminal (20) being exposed from the insulating resin (30); a case resin (40) that is mixed with a conductive filler (40a), and seals the insulating resin (30) so that a first portion of the second end part (22) is exposed from the case resin (40) and a second portion of the second end part (22) is covered by the case resin (40); and a coating material (50) that is formed on the second portion of the second end part (22) to electrically insulate the terminal (20) from the case resin (40).

Sensor

A sensor is provided with a detecting element (28) having an acceleration detecting section. The acceleration detecting section is provided with a spindle section (18) connected to a fixed section (14) through a flexible section (16), a substrate section (10) facing the spindle section (18), and an electrode section composed of opposite electrodes (20, 22, 24, 26) arranged on the facing surfaces of the spindle section (18) and the substrate section (10). Thus, displacement of the spindle section (18) in a Z axis direction is suppressed, and detection accuracy of acceleration in an X axis or Y axis is improved.

加速度传感器装置

... 公开了一种具有以一个IC芯片形式建造的处理电路的加速度传感器装置，并且集成IC芯片和加速度传感器芯片。加速度传感器装置由如下构成：一个加速度传感器芯片，由弹性支撑臂、一个质量部分和一个厚框架构成；一块调节板，用来限制质量部分的运动；及一个保护壳体。调节板是一个IC芯片，该IC芯片具有用来电气处理来自加速度传感器芯片的探测信号的处理电路，也用作调节板的IC芯片以离开加速度传感器芯片的预定间隙布置在加速度传感器芯片的上部处，并且电气连接到加速度传感器芯片上，及IC芯片和保护壳体彼此电气连接。 ...

Manufacturing method for micromechanical component and micromechanical component

Semiconductor package

METHOD OF MANUFACTURING ELECTRONIC COMPONENT

External force detecting device and external force detecting sensor

A device is provided for a detecting external force applied to piezoelectric piece. A crystal piece is cantilever-supported in a container. Excitation electrodes are formed on an upper face and lower face, respectively. A movable electrode, connected via a lead-out electrode to the excitation electrode, is formed on the lower face side at a front end of the crystal piece. A fixed electrode is provided on a bottom portion of the container to face this movable electrode. The excitation electrode on the upper face side and the fixed electrode are connected to an oscillation circuit. When the crystal piece bends in response to an applied external force, capacitance between the movable electrode and fixed electrode, changes. This capacitance change results in a corresponding change in oscillation frequency of the crystal piece.

Module and electronic apparatus

A module includes a sensor device, a mounting substrate that has a plurality of mounting faces, a portion between the mounting faces adjacent to each other being foldable, a supporting member having fixing faces, wherein the sensor device is mounted on at least one of the mounting faces, each of the mounting faces is disposed along each of the fixing faces, and the sensor device is disposed on the supporting member side.

Metal thin shield on electrical device

This disclosure provides systems and methods for forming a metal thin film shield over a thin film cap to protect electromechanical systems devices in a cavity beneath. In one aspect, a dual or multi layer thin film structure is used to seal a electromechanical device. For example, a metal thin film shield can be mated over an oxide thin film cap to encapsulate the electromechanical device and prevent degradation due to wafer thinning, dicing and package assembly induced stresses, thereby strengthening the survivability of the electromechanical device in the encapsulated cavity. During redistribution layer processing, a metal thin film shield, such as a copper layer, is formed over the wafer surface, patterned and metalized.

COMPOSITE SENSOR AND ELECTRONIC DEVICE

A composite sensor includes: a package including a container and a lid; a plurality of spaces that is partitioned by at least the container and the lid, and has different pressures, the plurality of the spaces including a first space sealed at around an atmospheric pressure and a second space sealed at a depressurized state; an acceleration sensor element disposed in the first space; and a vibration type angular velocity sensor element disposed in the second space. In the sensor, the first space has a volume smaller than a volume of the second space. 1. A composite sensor , comprising:a package including a first space having a first pressure, and the package including a second space having a second pressure lower than the first pressure;an acceleration sensor element disposed in the first space; anda angular velocity sensor element disposed in the second space, wherein the first space has a volume smaller than a volume of the second space,the package including a container and a lid, the first space and the second space is partitioned by the container and the lid.2. The composite sensor according to claim 1 , wherein at least one of the container and the lid has a protruded section claim 1 , the acceleration sensor is disposed overlap the protruded section in planar view.3. The composite sensor according to claim 1 , wherein at least one of the container and the lid has a recessed section claim 1 , the acceleration sensor is disposed within the recessed section.4. The composite sensor according to claim 1 , wherein at least one of a wall forming the first space and a wall forming the second space has a through hole claim 1 , the through hole is sealed by a sealing member.5. The composite sensor according to claim 1 , wherein a height of a bottom surface forming the first space and a height of a bottom surface forming the second space are different from each other.6. The composite sensor according to claim 1 , wherein at least one of the container and the lid has a ...

SENSOR UNIT AND MOTION MEASUREMENT SYSTEM USING THE SAME

The first buffer portion provides a first base portion and a first outer wall provided on a peripheral edge of the first base portion. The second buffer portion provides a second base portion which provides a mounting surface outside to a measurement target, and a second outer wall provided on a peripheral edge of the second base portion. The buffer body provides the first base portion and a top surface of the second outer wall abutting against each other. A housing portion for the sensor portion is provided inside. A holding portion which holds the sensor portion is provided at least at a part of the top surface of at least one of the first buffer portion and the second buffer portion. The sensor portion is held by the holding portion. 1. A sensor unit comprising:a buffer body comprising a first buffer portion and a second buffer portion that abuts against the first buffer portion and is softer than the first buffer portion; anda sensor portion arranged inside the buffer body;wherein the first buffer portion provides a first base portion and a first outer wall provided on a peripheral edge of the first base portion,the second buffer portion provides a second base portion which provides a mounting surface outside to a measurement target, and a second outer wall provided on a peripheral edge of the second base portion,the buffer body provides the first base portion and the second base portion facing each other and also provides a top surface of the first outer wall and a top surface of the second outer wall abutting against each other, and a housing portion for the sensor portion is provided inside, anda holding portion which holds the sensor portion is provided at least at a part of the top surface of at least one of the first buffer portion and the second buffer portion, and the sensor portion is held by the holding portion.2. The sensor unit according to claim 1 , wherein the housing portion is filled with a filler.3. The sensor unit according to claim 1 , wherein ...

DOOR LOCK INCLUDING SENSOR

A door assembly includes a door panel connected to a door frame and pivotable about a pivot axis, a door latch coupled to the door panel and operable to selectively inhibit movement of the door from a closed position to an open position, and a sensor coupled to the door latch and operable to detect acceleration of the door and output acceleration data corresponding to the acceleration of the door panel in a first direction. A controller is coupled to the door latch and the sensor. The controller is operable to analyze the acceleration data to determine the cause of the acceleration. 1. A door assembly comprising:a door panel connected to a door frame and pivotable about a pivot axis;a door latch coupled to the door panel and operable to selectively inhibit movement of the door from a closed position to an open position;a sensor coupled to the door latch and operable to detect acceleration of the door and output acceleration data corresponding to the acceleration of the door panel in a first direction; anda controller coupled to the door latch and the sensor, the controller operable to analyze the acceleration data to determine the cause of the acceleration.2. The door of claim 1 , wherein the door latch includes a lock operable to lock the door in the closed position.3. The door of claim 1 , further comprising an alarm triggerable by the controller in response to acceleration data indicative of a forced entry attempt.4. The door of claim 1 , wherein the sensor includes a multi-axis sensor operable to detect the magnitude of acceleration in multiple directions.5. The door of claim 1 , wherein the controller includes a micro-controller operable in a sleep state and an operating state claim 1 , and wherein the micro-controller remains in the sleep state until an acceleration over a non-zero preset threshold is detected.6. The door of claim 1 , wherein the sensor is operable to measure a first acceleration produced by a centripetal force and a second acceleration claim ...

Adjustable motion detector

The invention relates to a motion detector comprising at least of one accelerometer and corresponding control electronics encapsulated in an enclosure with means for attaching the enclosure to a moving body. In accordance with the invention the motion detector includes means for turning, aligning and locking the detector in any desired direction relative to the moving body with the help of the enclosure. 1. A motion detector comprising: at least of one accelerometer and corresponding control electronics encapsulated in an enclosure with means for attaching the enclosure to a moving body whereby the motion detector includes means for turning , aligning and locking the detector in any desired direction relative to the moving body with the help of the enclosure , wherein the support surface between the enclosure and means for attaching of the enclosure is spherical and that that the spherical enclosure of the motion detector can be turned and locked into its position by an expandable and retractable ring structure.2. A motion detector according to claim 1 , wherein the enclosure of the motion detector has one or several reference surfaces or slots that can be used as references for aligning or leveling the enclosure relative to the moving body.3. A motion detector according to claim 1 , wherein the motion detector has means for turning claim 1 , aligning and locking the detector into a given direction relative to the gravity vector.4. A motion detector according to claim 1 , wherein the motion detector includes a lockable ball joint structure for turning and locking the detector into its position.5. A motion detector according to claim 1 , wherein the motion detector includes a lockable single or double hinged or gimbaled structure for turning and locking the detector into its position.6. A motion detector according to claim 1 , wherein the means for attaching the detector on the moving body includes a separate attachment base enabling the motion detector to be removed ...

SMART ACCELEROMETER CANTILEVER

Techniques for an integrated circuit including an accelerometer are provided. In an example, an apparatus can include a unitary silicon substrate including a first portion and a second portion, wherein the first portion is thinner than the second portion, at least a portion of a sensor circuit configured to measure a deflection of the second portion with respect to the first portion, wherein the first portion is configured to anchor the accelerometer to a second device, and wherein the second portion is configured to deflect relative to the first portion in response to acceleration of the apparatus. 1. An accelerometer comprising:a unitary silicon substrate including a first portion and a second portion, wherein the first portion is thinner than the second portion;at least a portion of a sensor circuit configured to measure a deflection of the second portion with respect to the first portion;wherein the first portion is configured to anchor the accelerometer to a second device; andwherein the second portion is configured to deflect relative to the first portion in response to acceleration of the accelerometer.2. The accelerometer of claim 1 , including a plurality of electrical interconnects configured to at least partially anchor the unitary silicon substrate to the second device.3. The accelerometer of claim 1 , including a first major surface coextensive with the first portion and the second portion.4. The accelerometer of claim 3 , wherein the first major surface includes active integrated devices.5. The accelerometer of claim 1 , wherein the second portion of the sensor includes a portion of a capacitor.6. The accelerometer of claim 1 , wherein the sensor circuit includes a strain gauge circuit located at an interface of the first portion and the second portion.7. The accelerometer of claim 1 , including the second device.8. The accelerometer of claim 7 , wherein the second device is a printed circuit board9. The accelerometer of claim 7 , wherein the second ...

ACCELERATION SENSOR

An apparatus for measuring vehicle acceleration includes a housing comprising an interior space and one or more contacts supported in the housing. Each of the contacts includes a pin portion that extends outside the housing and a spring contact portion positioned above an ASIC receptacle inside the housing. The apparatus also includes an accelerometer ASIC positioned the ASIC receptacle in the housing. The accelerometer ASIC includes contact pads that engage the spring contact portions of the one or more contacts and cause the spring contact portions to deflect. The resilient spring characteristics of the spring contact portions applying a retention force on the accelerometer ASIC. The apparatus further includes a retention clip connected to the housing and having a portion extending into the interior space. The retention clip includes a portion that engages the housing to secure the retention clip in an installed condition in the housing. The retention clip includes portions that engage the one or more contacts and maintain the position of the one or more contacts inside the housing, and portions that engage the accelerometer ASIC and maintain the position of the accelerometer ASIC inside the housing. 1. An apparatus for measuring vehicle acceleration , comprising:a housing comprising an interior space;one or more contacts supported in the housing, each of the contacts comprising a pin portion that extends outside the housing and a spring contact portion positioned above an ASIC receptacle inside the housing;an accelerometer ASIC positioned the ASIC receptacle in the housing, wherein the accelerometer ASIC comprises contact pads that engage the spring contact portions of the one or more contacts and cause the spring contact portions to deflect, the resilient spring characteristics of the spring contact portions applying a retention force on the accelerometer ASIC; anda retention clip connected to the housing and having a portion extending into the interior space, ...

INERTIA SENSOR AND METHOD FOR REDUCING THE FRICTION BETWEEN TWO COMPONENTS OF AN INERTIA SENSOR

An inertia sensor (), in particular provided on a belt retractor (), includes at least two components which are reversibly movable relative to each other and each of which includes at least one contact surface () on which the components are in contact with each other, wherein at least one of the contact surfaces () is coated with graphite powder (). 110-. (canceled)111012202234362022343638. An inertia sensor () provided on a belt retractor () , comprising at least two components which are reversibly movable relative to each other and each of which includes at least one contact surface ( , , , ) on which the components are in contact with each other , wherein at least one of the contact surfaces ( , , , ) is coated with graphite powder ().1210223436. The inertia sensor () according to claim 11 , wherein at least the contact surface ( claim 11 , claim 11 , ) of one of the components is made from plastic.131020223436. The inertia sensor () according to claim 11 , wherein the components are arranged so that the contact surfaces ( claim 11 , claim 11 , claim 11 , ) are shifted against each other.141038. The inertia sensor () according to claim 11 , wherein an average grain size of the graphite particles of the graphite powder () ranges from 2 μm and 15 μm.15101618163218182234223438. The inertia sensor () according to claim 11 , wherein an inertia element () claim 11 , a deflection element () in direct contact with the inertia element () and a sensor element () in direct contact with the deflection element () are provided claim 11 , the deflection element () including a contact surface ( claim 11 , ) on each of opposite outer faces and both contact surfaces ( claim 11 , ) being coated with graphite powder ().161018262228261634302632. The inertia sensor () according to claim 15 , wherein the deflection element () has a shell-type portion () claim 15 , wherein a contact surface () is provided on a concave side () of the shell-type portion () facing the inertia element () ...

Concrete sensor device and system

A structure sensor device monitors physical properties within a body of concrete, rock, soil or other structure. The structure sensor device can be embedded inside the body of the structure in use. The structure sensor device includes: a sealed housing; sensors for measuring physical properties within the body of structure, such as a temperature sensor and a moisture sensor; and a wireless transceiver for wirelessly communicating with a gateway device located outside of the body of structure. The wireless transceiver is configured for wirelessly communicating at frequencies of less than 1 GHz. There is a controller configured to obtain sensor data from the sensors, generate monitoring data using at least some of the sensor data, and cause the monitoring data to be transmitted to the gateway device using the wireless transceiver, at predetermined intervals.

Measuring Sensor

A measuring sensor includes a housing in which an acceleration sensor is arranged and in which a circuit board is retained with a sensor electronics arranged thereon and a mounting element functions to secure the measuring sensor to a test object, wherein the acceleration sensor is mechanically rigidly coupled to the mounting element and connected to the sensor electronics via a flexible line connection, where in order to optimize the coupling of the acceleration sensor to the test object to be monitored, in terms of detecting oscillations, vibrations or structure-borne noise, the acceleration sensor is directly connected to the mounting element without mechanical contact with the housing, and the housing is retained elastically on the mounting element and supported by the mounting element. 18.-. (canceled)9. A measuring sensor comprising:a housing;an acceleration sensor arranged in the housing;a circuit board having sensor electronics arranged thereon, the circuit board being retained in the housing; anda mounting element for securing the measuring sensor to a test object, the acceleration sensor being mechanically rigidly coupled directly to the mounting element without mechanical contact with the housing and being connected to the sensor electronics via a flexible line connection, and the housing being elastically retained on the mounting element and being supported hereby;wherein the mounting element is formed as a support which extends through the housing and upon which the housing is suspended.10. The measuring sensor as claimed in claim 9 , wherein the housing has material weaknesses in the regions at which the housing is affixed to the mounting element.11. The measuring sensor as claimed in claim 9 , wherein the support is formed in two parts as a hollow support with an inner guide element; wherein the acceleration sensor is connected to the hollow support which also supports the housing; and wherein the inner guide element is configured for securement to ...

Berry impact recording device

Disclosed are various embodiments for a berry impact recording device. The berry impact recording device comprises a shell. Within the shell are at least a sensor and an integrated circuit. The sensor may be configured to detect an acceleration of the berry impact recording device. The integrated circuit may be configured to record the acceleration of the berry impact recording device and a timestamp corresponding to the acceleration.

ON-AXIS MOUNTING OF AN INERTIAL MEASUREMENT UNIT (IMU) WITHIN AN OPTICAL SYSTEM

Techniques and architecture are disclosed for providing an optical system having an on-axis, internally mounted inertial measurement unit (IMU). In some cases, an IMU may be mounted within an interior region/cavity of an inner housing, which intern is configured to rotate within, an outer housing. In some instances, a mirror assembly may be operatively coupled with the inner housing and permitted to rotate simultaneously with the IMU. Rotation of the inner housing may be achieved, in some example cases, by use of a suitable motor. In some instances, positioning componentry may be operatively coupled with one or more of the IMU and/or mirror assembly. Improvements in mechanical stability, system dimensions, and/or protection from external/environmental hazards may be realized, in some example cases. 1. A system comprising:a first housing having a first cavity provided therein;a second housing having a second cavity provided therein, wherein the second housing is disposed within the first cavity and permitted to rotate therein;an optical assembly operatively coupled with the second housing;an inertial measurement unit (IMU) operatively coupled with the second housing and positioned within the second cavity; anda drive motor operatively coupled with the second housing and configured to cause rotation thereof;wherein rotation of the second housing results in rotation of the optical assembly and the IMU therewith,2. The system of claim 1 , wherein the second housing is permitted to rotate through an angle in the range of less than or equal to about ±40°.3. The system of claim 1 , wherein the optical assembly is permitted to rotate about at least one of an azimuthal axis of the system and/or an elevation axis of the system claim 1 , and the IMU is permitted to rotate about the azimuthal axis of the system.4. The system of claim 1 , wherein the IMU is configured to account for effects of rotation on measurements that it makes.5. The system of claim 1 , wherein the IMU is a ...

Micromechanical Measuring Element and Method for Producing a Micromechanical Measuring Element

A micromechanical measuring element includes a carrier and a sensitive element connected to the carrier by a first solder connection and a second solder connection. The sensitive element is contacted electrically by the first solder connection. The sensitive element, the carrier and the second solder connection form a first chamber. The first chamber has a first opening. 115-. (canceled)16. A micromechanical measuring element , comprising:a carrier; anda sensitive element connected to the carrier by a first and a second solder connection, wherein the sensitive element is contacted electrically by the first solder connection;wherein the sensitive element, the carrier and the second solder connection form a first chamber, the first chamber having a first opening.17. The micromechanical measuring element according to claim 16 ,wherein the sensitive element has a membrane with a bottom side and a top side; andwherein the top side of the membrane is accessible to a first medium by means of the first opening.18. The micromechanical measuring element according to claim 16 , wherein the first opening is realized in the carrier.19. The micromechanical measuring element according to claim 16 , wherein the second solder connection is ring-shaped.20. The micromechanical measuring element according to claim 16 , further comprising an elastomer body arranged between the sensitive element and the solder connections.21. The micromechanical measuring element according to claim 20 , further comprising a metallization arranged between the elastomer bodies and the first solder connection.22. The micromechanical measuring element according to claim 21 , wherein the metallization has a meandering of helical shape.23. The micromechanical measuring element according to claim 16 , wherein the first chamber is provided at least in part with a protective layer.24. The micromechanical measuring element according to claim 23 , wherein the protective layer comprises parylene.25. The ...

Universal Sensor Mount

A universal sensor mount for mounting a sensor module to a machine in a precise orientation and a corresponding sensor module installation method. The universal sensor mount includes a main body having a central main axis. A machine mounting member extends from the main body in a first direction substantially parallel to the main axis for attachment to the machine. A threaded sensor module mounting member extends from the main body in a second direction substantially parallel to the main axis for threaded attachment to the sensor module. The sensor module mounting member is rotatable relative to the main body. An adjustable locking member in the main body is operable to lock the sensor module mounting member in a selected rotational position. The selected rotational position of the sensor module mounting member determines a rotational position of the sensor module when it is attached to the sensor module mounting member. 1. A universal sensor mount for mounting a sensor module to a machine in a precise orientation relative to one or more machine reference axes , comprising:a main body having a central main axis;a machine mounting member extending from the main body in a first direction substantially parallel to the main axis for attachment to the machine;a threaded sensor module mounting member extending from the main body in a second direction substantially parallel to the main axis for threaded attachment to the sensor module;the sensor module mounting member being rotatable relative to the main body;an adjustable locking member in the main body operable to lock the sensor module mounting member in a selected rotational position; andthe selected rotational position of the sensor module mounting member determining a rotational position of the sensor module relative to the one or more machine reference axes when it is threadably attached to the sensor module mounting member.2. The universal sensor mount of claim 1 , wherein the main body is a generally cylindrical ...

SENSOR PACKAGES

A sensor package comprising: a sensor, wherein the sensor comprises a sensing structure formed in a material layer and one or more further material layers arranged to seal the sensing structure to form a hermetically sealed sensor unit; a support structure; one or more springs flexibly fixing the hermetically sealed sensor unit to the support structure; wherein the one or more springs are formed in the same material layer as the sensing structure of the sensor unit; and one or more external package wall(s) encapsulating the sensor unit, the support structure, and the one or more springs, wherein the support structure is fixed to at least one of the package wall(s). The springs decouple mechanical stresses between the sensor unit and the external package wall(s) so as to reduce the long term drift of scale factor and bias. 1. A sensor package comprising:a sensor, wherein the sensor comprises a sensing structure formed in a material layer and one or more further material layers arranged to seal the sensing structure to form a hermetically sealed sensor unit;a support structure;one or more springs flexibly fixing the hermetically sealed sensor unit to the support structure;wherein the one or more springs are formed in the same material layer as the sensing structure of the sensor unit; andone or more external package wall(s) encapsulating the sensor unit, the support structure, and the one or more springs, wherein the support structure is fixed to at least one of the package wall(s).2. The sensor package of claim 1 , wherein the one or more springs have a serpentine form.3. The sensor package of claim 1 , wherein the support structure is formed in the same material layer as the sensing structure of the sensor unit and the one or more springs.4. The sensor package of claim 1 , wherein the support structure is a frame surrounding the hermetically sealed sensor unit.5. The sensor package of claim 1 , wherein the support structure is fixed to one or more of the at least ...

Inertial and pressure sensors on single chip

In one embodiment, the process flow for a capacitive pressures sensor is combined with the process flow for an inertial sensor. In this way, an inertial sensor is realized within the membrane layer of the pressure sensor. The device layer is simultaneously used as z-axis electrode for out-of-plane sensing in the inertial sensor, and/or as the wiring layer for the inertial sensor. The membrane layer (or cap layer) of the pressure sensor process flow is used to define the inertial sensor sensing structures. Insulating nitride plugs in the membrane layer are used to electrically decouple the various sensing structures for a multi-axis inertial sensor, allowing for fully differential sensing.

INERTIAL SENSOR DEVICE AND INERTIAL MEASUREMENT UNIT

An inertial sensor device includes a plurality of inertial measurement units, one of the inertial measurement units includes an inertial sensor, a reception section configured to receive data of another of the inertial measurement units, a combination processing section configured to operate the data of the another of the inertial measurement units and data of the one of the inertial measurement units, and a first transmission section configured to transmit output of the combination processing section. 1. An inertial sensor device comprising:{'claim-text': ['an inertial sensor,', 'a reception section configured to receive data of another of the inertial measurement units,', 'a combination processing section configured to operate the data of the another of the inertial measurement units and data of the one of the inertial measurement units, and', 'a first transmission section configured to transmit output of the combination processing section.'], '#text': 'a plurality of inertial measurement units, wherein one of the inertial measurement units includes'}2. The inertial sensor device according to claim 1 , further comprising:a second transmission section configured to transmit the data of the one of the inertial measurement units; anda setting section configured to enable transmission of one of the first transmission section and the second transmission section.3. The inertial sensor device according to claim 1 , whereinthe one of the inertial measurement units and the another of the inertial measurement units are coupled to each other with star type wiring.4. The inertial sensor device according to claim 1 , whereinthe one of the inertial measurement units and the another of the inertial measurement units are coupled to each other with bus type wiring.5. An inertial measurement unit to be used in an inertial sensor device having a plurality of inertial measurement units claim 1 , comprising:an inertial sensor;a reception section configured to receive data of another ...

Sensor module and sheet module

A sensor module is provided in which a sensor which can be more easily attached to a structure than conventionally and can also suppress variation in attachment quality. The sensor module includes an elastic layer, a sensor arranged above at last one part of the elastic layer and configured to detect a physical quantity related to the properties of a structure, and a film layer arranged above the elastic layer and attached with the sensor.

SEMICONDUCTOR DEVICE

A semiconductor device may include a first substrate, a first electrical component, a lid, a second substrate, and a second electrical component. The first substrate may include an upper surface, a lower surface, and an upper cavity in the upper surface. The first electrical component may reside in the upper cavity of the first substrate. The lid may cover the upper cavity and may include a port that permits fluid to flow between an environment external to the semiconductor device and the upper cavity. The second substrate may include the second electrical component mounted to an upper surface of the second substrate. The lower surface of the first substrate and the upper surface of the second substrate may fluidically seal the second electrical component from the upper cavity. 1. A semiconductor device , comprising:a substrate comprising a substrate top side, a substrate bottom side, and one or more conductive paths;an electrical component mounted to the substrate top side and coupled to the one or more conductive paths of the substrate;a mold layer comprising a mold layer top side and a mold layer bottom side, wherein the mold layer surrounds the electrical component;a cavity in the mold layer top side, wherein the cavity exposes at least a portion of the electrical component; anda conductive via structure that passes through the mold layer, wherein the conductive via structure comprises a lower end coupled to the substrate and an upper end exposed at the mold layer top side.2. The semiconductor device of claim 1 , further comprising a lid over the cavity claim 1 , wherein the lid is coupled to the upper end of the conductive via structure.3. The semiconductor device of claim 2 , wherein the conductive via structure comprises a conductive pillar coupled to the lid and the substrate.4. The semiconductor device of claim 2 , wherein the electrical component is configured to interact through the lid with an environment external to the semiconductor device.5. The ...

METHOD OF OPERATING A HEARING DEVICE, AND HEARING DEVICE

A hearing device has an acceleration sensor that measure along three mutually perpendicular measurement axis. A movement of the hearing aid wearer is deduced from acceleration data of the acceleration sensor issued in an acceleration signal, a movement plane of the movement of the hearing aid wearer is derived from the acceleration data, a movement axis and a movement direction of the movement are ascertained from the acceleration data, and the presence of a rotational movement of the head is deduced on the basis of the movement plane, the movement axis and the movement direction. A direction of view probability distribution is created from the detected rotational movements, in particular on the basis of a yaw angle ascertained in the process. The direction of view probability distribution specifies a probability that the actual direction of view of the hearing aid wearer extends along an assigned angle. 1. A method of operating a hearing device having an acceleration sensor which , in an intended worn state , is positioned on the head of a hearing device wearer and is configured to measure in three mutually perpendicular measurement axes , the method comprising:deducing a movement of the hearing device wearer from acceleration data in an acceleration signal output by the acceleration sensor;deriving from the acceleration data a movement plane of a movement of the hearing device wearer;ascertaining from the acceleration data a movement axis and a movement direction of the movement; anddeducing an occurrence of a rotational movement of the head on a basis of the movement plane, the movement axis, and the movement direction.2. The method according to claim 1 , which comprises using an occurrence of a yawing movement as the occurrence of the rotational movement.3. The method according to claim 1 , which comprises analyzing the acceleration data block by block in successive data frames.4. The method according to claim 1 , which comprises using a range of values and/or a ...

METHOD FOR OPERATING A HEARING DEVICE AND HEARING DEVICE

A method operates a hearing device. The hearing device contains two acceleration sensors, which each provide a sensor signal and by which an orientation of the head of the user is established. The sensor signals of both acceleration sensors are used in combination for establishing the orientation, and an operating parameter of the hearing device is set depending on the orientation. 1. A method for operating a binaural hearing device containing two hearing aids including a left hearing aid and a right hearing aid to be worn on different sides of a head and having two translational acceleration sensors each providing a sensor signal being used to determine an orientation of the head of a user , which comprises the steps of:measuring a translational acceleration in each of the two translational acceleration sensors, each of the translational acceleration sensors is attached in or to one of the two hearing aids such that two sensor signals are provided as a left sensor signal and a right sensor signal;measuring the translational acceleration of each of the two translational acceleration sensors in a Cartesian coordinate system with three axes;using the sensor signals of both of the translational acceleration sensors in combination for establishing the orientation;combining the two sensor signals to form an overall signal, by means of the overall signal the orientation of the head is established, the two sensor signals each having a gravitational acceleration component and are combined to form the overall signal in such a way that gravitational acceleration components are eliminated and the overall signal is independent of gravitational acceleration;performing the combining step to form the overall signal by a mathematical operation; andsetting an operating parameter of the binaural hearing device in dependence on the orientation.2. The method according to claim 1 , which further comprises compensating for a skew position of the translational acceleration sensors in ...

Physical Quantity Sensor, Inertial Measurement Unit, Electronic Apparatus, And Vehicle

A physical quantity sensor includes: a container that includes a storage space and a bottom plate that configures an inner bottom surface of the storage space; a sensor element that is attached to the inner bottom surface; a circuit element that is attached to a surface of the sensor element on the opposite side of the inner bottom surface, and is electrically connected with the sensor element; and a ground plane that is provided on the bottom plate. The ground GND plane is provided apart from the inner bottom surface. 1. A physical quantity sensor comprising: a storage space; and', 'a bottom plate that configures an inner bottom surface of the storage space;, 'a container includinga sensor element that is attached directly to the inner bottom surface;a circuit element that is attached directly to a surface of the sensor element on an opposite side of the inner bottom surface, the circuit element being electrically connected with the sensor element; anda ground plane extending along the bottom plate at a position spaced GND plane apart from the inner bottom surface.2. The physical quantity sensor according to claim 1 ,wherein the ground plane overlaps the sensor element in a plan view.3. The physical quantity sensor according to claim 1 ,wherein the bottom plate is a multilayered substrate including a plurality of stacked layers.4. The physical quantity sensor according to claim 3 ,wherein the plurality of stacked layers is three stacked layers.5. The physical quantity sensor according to claim 1 , the bottom plate,', 'an annular substrate stacked on the bottom plate; and', 'a conductive lid sealingly fixed over an opening of a recess configured by the bottom plate and the annular substrate., 'wherein the storage space further comprises a closed spaced formed by6. The physical quantity sensor according to claim 5 ,wherein the lid and the ground plane are electrically connected to each other by a conductive layer formed in a castellation provided on a side surface of ...

Float with fishing conditions detection

Embodiments of the present disclosure provide for an apparatus for a float with fishing conditions detection capabilities. In one instance, the float may include a float case, one or more sensors disposed inside the float case, and a processing block coupled with the sensors and disposed inside or outside the float case. The processing block may be configured to detect one or more conditions of fishing. To detect the conditions of fishing, the processing block may be configured to receive and process sensor readings from the sensors, and determine the conditions of fishing, based on a result of the processing of the sensor readings. Other embodiments may be described and/or claimed.

A sensor device for monitoring structural elements, a clamping element, an examination unit and a method for constructing said sensor device

Sensor device (1) for monitoring structural elements, comprising a container (4), which is preferably box-shaped and has a first elastic modulus (E1), a processing device (11), which is housed inside the container (4) and comprises a processing unit (11a), a support (12) on which the processing unit (11a) is installed, at least one inclinometer (3) and/or one accelerometer (15), which is/are housed on the support (12) and operatively connected to the processing unit (11a), the support (12) being secured to the container (4) by means of a fixing element (12a) having a second elastic modulus (E2) that is greater than or equal to the first elastic modulus (E1).

Sensor unit, electronic apparatus, and moving object

A sensor unit includes: a sensor device including an inertial sensor; a substrate to which the sensor device is bonded; a case member accommodating at least the sensor device; and an adhesive member provided to cover, in a plan view of the substrate as viewed from the case member side, an outer periphery of the sensor device and so as to connect the sensor device with the case member.

OPTICAL ACCELEROMETER

The invention relates to an optical accelerometer, comprising a seismic mass, equipped with a mobile reflective surface, according to a rotating axis, an emitting optical fiber, coupled with a light source, intended to emit a light beam, through one of its edges, in the direction of the reflective surface, and a receiving optical fiber, coupled with an optical detector, intended to receive, through one of its edges-, the light beam sent back by the reflective surface. The arrangement of the ensemble is such that a rotating movement of the reflective surface leads to a deflection of the light beam and a variation in the light intensity received by the receiving fiber. According to the invention, a convergent lens is interposed, on the optical path of the light beam, between the optical fibers and the seismic mass. 112-. (canceled)13. An optical accelerometer , comprising:a seismic mass equipped with a mobile reflective surface according to a rotating axis;an emitting optical fiber coupled to a light source and configured to emit a light beam through one of its edges in the direction of the mobile reflective surface;a receiving optical fibre coupled with an optical detector configured to receive through one of its edges the light beam sent back by the reflective surface; anda convergent lens interposed on an optical path of the light beam between the emitting and receiving optical fibres and the said seismic mass;wherein a rotating movement of the reflective surface causes a deflection of the light beam and a variation in the light intensity received by the receiving fiber.14. The accelerometer according to claim 13 , wherein the lens is an optical axis AA of focal distance F of object focal plane Fo and in that the edges respectively of emitting fiber and receiving fiber are located in the object focal plane Fo.15. The accelerometer according to claim 13 , wherein the lens is of image focal plane Fi and the seismic mass is flat and defines a plane P coinciding with ...

INERTIAL SENSOR, ELECTRONIC APPARATUS, AND VEHICLE

An inertial sensor includes: a sensor unit; a base substrate having the sensor unit arranged at one surface thereof and having a first lateral surface and a second lateral surface; a package accommodating the sensor unit and the base substrate and having an inner bottom surface, a first inner wall surface, and a second inner wall surface; a first adhesive bonding together an other surface of the base substrate and an inner bottom surface of the package; a second adhesive bonding together the first inner wall surface of the package and the first lateral surface; and a third adhesive bonding together the second inner wall surface of the package and the second lateral surface. 1. An inertial sensor comprising:a sensor unit;a base substrate having the sensor unit arranged at one surface thereof and having a first lateral surface intersecting the one surface and a second lateral surface opposite to the first lateral surface;a package accommodating the sensor unit and the base substrate, the package having an inner bottom surface, a first inner wall surface intersecting the inner bottom surface and opposite the first lateral surface, and a second inner wall surface intersecting the inner bottom surface and opposite the second lateral surface;a first adhesive bonding together an other surface of the base substrate and the inner bottom surface of the package;a second adhesive bonding together the first inner wall surface of the package and the first lateral surface, the second adhesive being different from the first adhesive; anda third adhesive bonding together the second inner wall surface of the package and the second lateral surface, the third adhesive being different from the first adhesive.2. The inertial sensor according to claim 1 , whereinthe base substrate is a rectangle having a first shorter side and a second shorter side opposite the first shorter side, as viewed in a plan view,the first lateral surface corresponds to the first shorter side, andthe second ...

Physical Quantity Sensor, Inertial Measurement Unit, And Method For Manufacturing Physical Quantity Sensor

Provided is a physical quantity sensor including: a movable body; a base body; and a lid body, in which the movable body is accommodated in a space between the base body and the lid body, the space is sealed with a melt portion obtained by melting a through hole provided in the lid body, the lid body and the melt portion contain silicon, and the melt portion has a continuous curved surface having unevenness. 1. A physical quantity sensor comprising:a movable body;a base body; anda lid body, whereinthe movable body is accommodated in a space between the base body and the lid body,the space is sealed with a melt portion obtained by melting a through hole provided in the lid body,the lid body and the melt portion contain silicon, andthe melt portion has a continuous curved surface having unevenness.2. The physical quantity sensor according to claim 1 ,whereinthe lid body is a single crystal, andthe melt portion is a polycrystalline.3. An inertial measurement unit comprising:{'claim-ref': [{'@idref': 'CLM-00001', 'claim 1'}, {'@idref': 'CLM-00002', '2'}], 'the physical quantity sensor according to or .'}4. A method for manufacturing a physical quantity sensor claim 1 , comprising:forming a through hole and a recess portion in a lid body containing silicon;configuring a movable body to be accommodated in a space between the lid body and the base body; andirradiating the through hole and the recess portion with laser light to melt the through hole and the recess portion and seal the space.5. The method for manufacturing a physical quantity sensor according to claim 4 , whereinwhen the laser light is radiated, the physical quantity sensor is in a reduced-pressure atmosphere in a chamber including a transparent window portion, and the lid body is heated via the base body. The present application is based on, and claims priority from JP Application Serial Number 2020-154423, filed Sep. 15, 2020, the disclosure of which is hereby incorporated by reference herein in its ...

SENSOR MODULE AND SENSOR MODULE MOUNTING FOR USE IN A STORAGE OR TRANSPORT SYSTEM

A mounting of a sensor module for use in a storage or transport system, for securing the sensor module to a support of the storage or transport system. The mounting has a clamping device for clamping the mounting to the support, and the clamping device includes at least one slide which is guided in a linearly movable manner and latches in a plurality of latch positions. 119-. (canceled)20. A mounting of a sensor module for use in a storage or transport system for fastening the sensor module to a support of the storage or transport system , the mounting comprising:a clamping device configured to clamp the mounting to the support,wherein the clamping device comprises at least one linearly displaceable guided slide that engages in a plurality of latching positions.21. The mounting of claim 20 , further comprising:a guide, in which the at least one linearly displaceable guided slide is guided, is arranged or formed on the mounting.22. The mounting of claim 21 , wherein the guide has at least one groove through which a T-shaped or a dovetail-shaped guide is formed.23. The mounting of claim 21 , wherein the guide and the at least one linearly displaceable guided slide have a plurality of interlocking latching teeth forming the plurality of latching positions.24. The mounting of claim 23 , wherein the guide has two parallel and mutually spaced grooves between which the plurality of latching teeth of the guide are disposed.25. The mounting of claim 23 , wherein the latching teeth are saw-toothed shaped.26. The mounting of claim 23 , further comprising:a spring element formed on the at least one linearly displaceable guided slide, wherein the spring element is arranged to press the at least one linearly displaceable guided slide into the guide so that the plurality of interlocking latching teeth of the guide and the at least one linearly displaceable guided slide engage one another.27. The mounting of claim 23 , further comprising:a spring formed on the at least one linearly ...

SENSOR THERMAL MANAGEMENT AND STABILIZATION UTILIZING VARIABLE CONDUCTANCE

A system for sensor thermal management and stabilization comprises a sensor block, one or more sensors mounted on the sensor block, one or more heaters mounted on the sensor block, a chassis coupled to the sensor block, a thermal conductor moveably coupled between the sensor block and the chassis, and a thermal control actuation mechanism operatively connected to the thermal conductor. The thermal control actuation mechanism is operative to cause the thermal conductor to vary a total thermal conductance from the sensor block to the chassis by moving the thermal conductor toward the chassis or away from the chassis. The total thermal conductance is varied to provide an optimized thermal stability and optimized environmental range of applicability for the one or more sensors. 1. A system for sensor thermal management and stabilization , the system comprising:a sensor block;one or more sensors mounted on the sensor block;one or more heaters mounted on the sensor block;a chassis coupled to the sensor block;a thermal conductor moveably coupled between the sensor block and the chassis; anda thermal control actuation mechanism operatively connected to the thermal conductor;wherein the thermal control actuation mechanism is operative to cause the thermal conductor to vary a total thermal conductance from the sensor block to the chassis by moving the thermal conductor toward the chassis or away from the chassis;wherein the total thermal conductance is varied to provide an optimized thermal stability and optimized environmental range of applicability for the one or more sensors.2. The system of claim 1 , wherein the thermal conductor comprises at least one thermal strap.3. The system of claim 2 , wherein the at least one thermal strap comprise a graphite-fiber thermal strap.4. The system of claim 2 , wherein the thermal control actuation mechanism includes an actuator claim 2 , a terminal block coupled to the at least one thermal strap and the actuator claim 2 , and at least ...

SYSTEM FOR FREEING STUCK ACCELEROMETERS

According to some aspects of the subject technology, an apparatus includes an accelerometer including one or more sense electrodes to sense an input acceleration, and an unstick device to free the accelerometer from a stuck state due to a saturating acceleration input. The unstick device includes at least one unstick electrode and a control circuitry to cause the unstick electrode to generate vibrational energy to free the accelerometer. 1. An apparatus comprising:an accelerometer including one or more sense electrodes configured to sense an input acceleration; andan unstick device configured to free the accelerometer from a stuck state due to a saturating acceleration input,wherein:the unstick device comprises at least one unstick electrode and control circuitry configured to cause the at least one unstick electrode to generate vibrational energy to free the accelerometer, andthe control circuitry comprises a clip-detection circuit configured to detect stiction.2. The apparatus of claim 1 , wherein the control circuitry is configured to detect the stuck state based on one or more signals from the one or more sense electrodes.3. The apparatus of claim 2 , wherein the accelerometer comprises a microelectromechanical system (MEMS) capacitive accelerometer.4. The apparatus of claim 1 , wherein the accelerometer comprises a pendulous type accelerometer including a cantilever supported by a fulcrum claim 1 , two sense electrodes and a first unstick electrode at an opposite end of the cantilever from a stop-pad end.5. The apparatus of claim 4 , wherein the pendulous type accelerometer is enclosed in a housing and further includes a second unstick electrode attached to a lid of the housing.6. The apparatus of claim 4 , wherein the pendulous type accelerometer is enclosed in a housing including a lid claim 4 , and wherein the lid is used as a second unstick electrode.7. The apparatus of claim 1 , wherein the control circuitry comprises a current-to-voltage (C2V) converter ...

Terminal Insertion Quality Monitoring System

A terminal insertion quality monitoring system includes an acceleration sensor disposed on a gripper of a terminal insertion equipment and configured to detect a dynamic acceleration of the gripper while using the gripper to insert a terminal into a housing, a control parameter acquisition device configured to acquire a plurality of control parameters of the terminal insertion equipment while inserting the terminal into the housing, and an artificial intelligence system adapted to classify the detected dynamic acceleration and the acquired control parameters into a plurality of different insertion modes by analyzing and calculating the detected dynamic acceleration and the acquired control parameters. The different insertion modes have a plurality of different grades of terminal insertion quality. The artificial intelligence system is configured to monitor a terminal insertion quality of the terminal according to the insertion mode to which the detected dynamic acceleration and the acquired control parameters correspond. 1. A terminal insertion quality monitoring system comprising:an acceleration sensor disposed on a gripper of a terminal insertion equipment and configured to detect a dynamic acceleration of the gripper while using the gripper to insert a terminal into a housing;a control parameter acquisition device configured to acquire a plurality of control parameters of the terminal insertion equipment while inserting the terminal into the housing; andan artificial intelligence system adapted to classify the detected dynamic acceleration and the acquired control parameters into a plurality of different insertion modes by analyzing and calculating the detected dynamic acceleration and the acquired control parameters, the different insertion modes have a plurality of different grades of terminal insertion quality and the artificial intelligence system is configured to monitor a terminal insertion quality of the terminal according to the insertion mode to which ...

Angled Acceleration Measurement System

An acceleration measuring device to offset the limiting factors associated with the maximum acceleration an accelerometer can measure by attaching the device onto a mount system pre-calibrated to a specified angle relative to the horizontal axis of the object on which the system is mounted on. 1. An acceleration measurement system consisting of;An accelerometer;A mounting apparatus system2. A mounting apparatus system consisting of;A locking mechanism which will lock the system via the mounting apparatus onto the chosen surface.A securing mechanism which will secure the mounting apparatus and the accelerometer at a pre-calibrated angle relative to the horizontal axis of the surface on which the mount is locked on.3. An accelerometer to measure the acceleration of the device , equipment , or object which it is affixed on via the mounting apparatus system. Presently, analysis and study of G-forces is significant in the fields of engineering, rocket science, astrophysics and planetary sciences. In this application, G-forces, as it is used, pertains to the force of acceleration as opposed to the force of gravity on a body. The calculation of force created by an object requires the use of a specialized device or an accelerometer for acceleration measurements. The issue with specialized devices is the cost associated with purchasing and at time operating the device. Therefore, most users will use an accelerometer to determine the acceleration and then use Newton's Second Law of Motion, Force is equal to mass time acceleration, to calculate the force produced. This then leads to the issue with accelerometers and high acceleration values. Accelerometers, while considerably less costly than specialized force calculation devices, are also rather costly based on the maximum recordable range that the accelerometer can read. To measure these high accelerations, a sensor with a large dynamic range as well as a considerable sample rate is needed. Therefore, there is a need for a ...

INERTIA MEASUREMENT MODULE FOR UNMANNED AIRCRAFT

The present disclosure relates to an inertia measurement module for an unmanned aircraft, which comprises a housing assembly, a sensing assembly and a vibration damper. The vibration damper comprises a first vibration-attenuation cushion; and the sensing assembly comprises a first circuit board, a second circuit board and a flexible signal line for connecting the first circuit board and the second circuit board. An inertia sensor is fixed on the second circuit board, and the first circuit board is fixed on the housing assembly. The inertia measurement module further comprises a weight block, and the second circuit board, the weight block, the first vibration-attenuation cushion and the first circuit board are bonded together. The present disclosure greatly reduces the influence of the operational vibration frequency of the unmanned aircraft on the inertia sensor and improves the measurement stability of the inertia sensor. 1a second circuit board with an inertia sensor;a first circuit board with a processor to process one or more signals from the inertia sensor;a signal line between the first circuit board and the second circuit board;a weight block comprising a recess, wherein the second circuit board is embedded in the recess of the weight block; anda vibration damper provided to attenuate vibration of the inertia sensor.. An inertia measurement module, comprising: The present disclosure generally relates to the technical field of unmanned aircraft control, and more particularly, to an inertia measurement module for an unmanned aircraft.In the conventional technology, for buffering of an inertia measurement module of an unmanned aircraft, four vibration-attenuation cushions are disposed outside a housing of a control module thereof to form four fulcrums that support the housing of the whole control module. The structure of disposing the vibration-attenuation cushions outside the inertia measurement module for the unmanned aircraft has following drawbacks: (1) the ...

PIEZOELECTRIC SENSOR

The present disclosure relates to a piezoelectric sensor, and the piezoelectric sensor includes a support including a connecting member and a supporting member connected to one end of the connecting member; a piezoelectric element, formed as an annular member and disposed surrounding the connecting member; a mass, formed as an annular member and disposed surrounding the piezoelectric element; a first circuit board, disposed on the mass away from the supporting member and provided with a first circuit on a surface close to the mass; and a second circuit board, disposed on the first circuit board away from the supporting member and provided with a second circuit on a surface facing away from the first circuit board. 1. A piezoelectric sensor , comprising:a support, comprising a connecting member and a supporting member connected to one end of the connecting member;a piezoelectric element, formed as an annular member and disposed surrounding the connecting member;a mass, formed as an annular member and disposed surrounding the piezoelectric element;a first circuit board, disposed on the mass away from the supporting member and provided with a first circuit on a surface close to the mass; anda second circuit board, disposed on the first circuit board away from the supporting member and provided with a second circuit on a surface facing away from the first circuit board.2. The piezoelectric sensor according to claim 1 , wherein the first circuit is embedded within the first circuit board.3. The piezoelectric sensor according to claim 1 , wherein the first circuit is disposed corresponding to a central hollow region of the mass on the first circuit board.4. The piezoelectric sensor according to claim 1 , wherein the first circuit board is provided with a first recess recessed inwardly from an outer peripheral surface of the first circuit board.5. The piezoelectric sensor according to claim 4 , wherein the second circuit board is provided with a second recess recessed ...

ACCELERATION TRANSDUCER

An acceleration transducer defines a rectangular coordinate system with two orthogonal horizontal axes that are both normal to a vertical axis and includes a main body disposed within a housing and defining tangential side faces arranged tangentially to the vertical axis, and a normal side face arranged normally to the vertical axis. A piezoelectric element is secured to one of the tangential side faces, and a seismic mass secured to the piezoelectric element. A signal output is attached to the housing and includes a signal conductor spaced apart by an assembly gap from a tangential side face that is not attached to the piezoelectric element. The assembly gap extends perpendicularly to the vertical axis. The normal side face includes main body output conductors spanning the assembly gap in a direction perpendicular to the vertical axis and directly contacting the signal conductor.

Acceleration transducer

An acceleration transducer defines a rectangular coordinate system with two orthogonal horizontal axes that are both normal to a vertical axis and includes a main body defining tangential side faces arranged tangentially to the vertical axis, and normal side faces arranged normally to the vertical axis. The transducer includes a converter unit, exactly three piezoelectric elements and three seismic masses. Each piezoelectric element generates piezoelectric charges transmitted to the converter unit, which is only and directly arranged on a normal side face of the main body or only on a support that is attached to a normal side face of the main body. Exactly one piezoelectric element is secured to each of the three tangential side faces, and exactly one seismic mass is secured to each of the three piezoelectric elements. Each piezoelectric element has a high sensitivity for a shear force exerted by the attached seismic mass along a principal tangential axis that is another one of the three axes for each of the three piezoelectric elements.

SENSOR ASSEMBLY

A sensor assembly is provided with a housing, a sensor package, and terminals. The housing may include a connector opening configured to mate with a wire harness connector. The sensor package may include conductive pads exposed in a surface of the sensor package. The terminals may be inserted into the housing and extend into the connector opening. The terminals form an electrical and mechanical connection the conductive pads of sensor package. 1. An sensor assembly comprising:a molded housing having a connector opening configured to mate with a wire harness connector;a leadless sensor package including conductive pads exposed in a surface of the leadless sensor package; andterminals inserted into the molded housing and extending into the connector opening, each terminal forming an electrical and mechanical connection with a pad of the conductive pads in the surface of the leadless sensor package.2. The assembly of claim 1 , wherein the electrical and mechanical connections with the conductive pads are solderless connections.3. The assembly of claim 1 , wherein the electrical and mechanical connections are maintained by a spring force of the terminals applied between the molded housing and the conductive pads.4. The assembly of claim 1 , wherein a first terminal is in electrical connection with a first pad on the surface of the leadless sensor package to provide power to the leadless sensor package.5. The assembly of claim 4 , wherein a second terminal is in electrical connection with a second pad on the surface of the leadless sensor package to provide an accelerometer signal from the leadless sensor package.6. The assembly of claim 1 , wherein the leadless sensor package interacts with at least one crush rib in the molded housing to restrain movement of the leadless sensor package.7. The assembly of claim 1 , wherein the molded housing includes a bushing for in vehicle mounting and the leadless sensor package is configured to detect impact conditions for safety ...

MULTI-AXIS, SINGLE MASS ACCELEROMETER

A multi-axis, single mass acceleration sensor includes a three-dimensional frame, a test mass, a plurality of transducers, and a plurality of struts. The test mass may have three principal axes disposed within and spaced apart from the frame. The transducers are mechanically coupled to the frame. The struts are configured to couple to the central mass at each of the three principal axes, respectively, and to couple with respective sets of the transducers, thereby suspending the test mass within the frame. The sensor is thus responsive to translational motion in multiple independent directions and to rotational motion about multiple independent axes. 1. A multi-axis , single mass acceleration sensor comprising:a three-dimensional frame;a test mass disposed within and spaced apart from the frame;a plurality of transducers mechanically coupled to the frame at a plurality of respective locations on the frame; anda plurality of struts configured to couple to the central mass at a plurality of respective positions and to couple with respective sets of the transducers at the plurality of respective locations, thereby suspending the test mass within the frame;wherein the sensor is responsive to translational motion in multiple independent directions and to rotational motion about multiple independent axes.2. The sensor of claim 1 , wherein:each set of transducers comprises a pair of the transducers positioned on opposing sides of a respective face of the frame; andlateral ends of respective struts connect to each pair of transducers on the opposing sides of each respective face of the frame.3. The sensor of claim 1 , wherein each strut is stiffer along a longitudinal sensing axis than along axes perpendicular to the longitudinal sensing axis.4. The sensor of claim 1 , wherein:the plurality of struts is arranged in pairs with the struts in each pair arranged parallel to each other;each strut of each pair of struts is positioned on an opposite side of the test mass from its ...

Inertial Measurement Unit

An inertial measurement unit includes: a sensor unit having at least one inertial sensor; a substrate where at least one of a processing unit performing processing based on detection information from the inertial sensor and a display unit performing a display based on the detection information is provided; and at least one fixing member removably fixing the sensor unit and the substrate together. 1. An inertial measurement unit comprising:a sensor unit having at least one inertial sensor;a substrate where at least one of a processing unit performing processing based on detection information from the inertial sensor and a display unit performing a display based on the detection information is provided; andat least one fixing member removably fixing the sensor unit and the substrate together.2. The inertial measurement unit according to claim 1 , further comprisinga plurality of columnar members as the at least one fixing member, whereinthe sensor unit and the substrate are removably fixed together by the plurality of columnar members fitting into a plurality of holes provided in the substrate and a plurality of holes provided in the sensor unit.3. The inertial measurement unit according to claim 2 , whereinthe plurality of columnar members are screw members.4. The inertial measurement unit according to claim 1 , further comprisinga base for installing the inertial measurement unit at an installation surface, whereinthe sensor unit is provided between the base and the substrate, andthe base is fixed to the sensor unit by the at least one fixing member.5. The inertial measurement unit according to claim 4 , whereinthe base has a fixing part that is a magnet, at a surface facing the installation surface.6. The inertial measurement unit according to claim 4 , whereinthe base has a recess at a surface facing the installation surface.7. The inertial measurement unit according to claim 1 , whereina wireless communication unit wirelessly transmitting information based on the ...

SYSTEMS AND METHODS FOR ISOLATED SENSOR DEVICE PROTECTION

Systems and methods for isolated sensor device protection are provided. In one embodiment, an isolated sensor device comprises: a housing having an isolation chamber; an isolator sealed within the isolation chamber; an inertial sensor assembly sealed within the isolation chamber, the inertial sensor assembly coupled to an inner surface of the isolation chamber by the isolator; and at least one progressive impact interface applied to a periphery of the inertial sensor assembly, wherein the at least one progressive impact interface extends outward from the inertial sensor assembly towards the inner surface. 1. An isolated sensor device , the device comprising:a housing having an isolation chamber;an isolator sealed within the isolation chamber an inertial sensor assembly sealed within the isolation chamber, the inertial sensor assembly coupled to an inner surface of the isolation chamber by the isolator;at least one progressive impact interface applied to a periphery of the inertial sensor assembly, wherein the at least one progressive impact interface extends outward from the inertial sensor assembly towards the inner surface.2. The device of claim 1 , wherein the at least one progressive impact interface is positioned around the periphery of the inertial sensor assembly such that when the inertial sensor assembly experiences sufficient deflection within the isolation chamber to impact the inner surface claim 1 , the progressive impact interface will be the first point of contact between the inertial sensor assembly and the inner surface.3. The device of claim 2 , wherein the at least one progressive impact interface comprises a geometry claim 2 , and is formed from a material claim 2 , such that an area of the material in contact with the inner surface claim 2 , starting from an initial contact area claim 2 , progressively increases when inertial forces on the inertial sensor assembly continue to further compress the at least one progressive impact interface against ...

ELECTRONIC DEVICE AND INFORMATION PROCESSING APPARATUS

An electronic device in an aspect of the present disclosure is an electronic device which is mounted on a seat that is turnable around a first axis such that the electronic device is turnable around a second axis. The electronic device includes a detector that detects acceleration information, and a controller that determines which of a turn around the first axis and a turn around the second axis is occurring based on a temporal change in the acceleration information detected by the detector. 1. An electronic device which is mounted on a seat that is turnable around a first axis such that the electronic device is turnable around a second axis , the electronic device comprising:a detector that detects acceleration information; anda controller that determines which of a turn around the first axis and a turn around the second axis is occurring based on a temporal change in the acceleration information detected by the detector.2. An electronic device which is mounted on a reclining seat such that the electronic device is inclinable , the electronic device comprising:a detector that detects acceleration information; anda controller that determines which of an inclination of the seat and an inclination of the electronic device is occurring based on a temporal change in the acceleration information detected by the detector.3. The electronic device according to claim 2 , further comprising a display unit that displays a result determined by the controller.4. An information processing apparatus which is connected to a plurality of electronic devices that are respectively mounted on a plurality of seats arranged in a vehicle claim 2 , where each of the plurality of seats is turnable around a first axis claim 2 , and each of the plurality of electronic devices is turnable around a second axis relative to a respective one of the plurality of seats claim 2 , the information processing apparatus comprising:an input unit that receives acceleration information detected by each of ...

Physical Quantity Sensor, Inertia Measurement Device, Vehicle Positioning Device, Electronic Apparatus, And Vehicle

A physical quantity sensor includes a substrate, a first sensor element that is positioned on one main surface of the substrate and includes a first fixed portion fixed to the substrate, a second sensor element that is positioned on the one main surface of the substrate and includes a second fixed portion fixed to the substrate, a first recess portion that is open to the other main surface of the substrate and is disposed so as to overlap the first fixed portion in plan view of the substrate, and a second recess portion that is open to the other main surface of the substrate and is disposed so as to overlap the second fixed portion in plan view of the substrate, and in which the first recess portion and the second recess portion are disposed so as to be separated from each other. 1. A physical quantity sensor comprising:a substrate;a first sensor element that is positioned on one main surface of the substrate and includes a first fixed portion fixed to the substrate;a second sensor element that is positioned on the one main surface of the substrate and includes a second fixed portion fixed to the substrate;a first recess portion that is provided on the other main surface of the substrate and overlaps the first fixed portion in plan view of the substrate; anda second recess portion that is provided on the other main surface of the substrate and overlaps the second fixed portion in plan view of the substrate,wherein the first recess portion and the second recess portion are separated from each other.2. The physical quantity sensor according to claim 1 ,wherein in plan view of the substrate,the first recess portion includes the first sensor element, andthe second recess portion includes the second sensor element.3. The physical quantity sensor according to claim 1 ,wherein each of the first recess portion and the second recess portion is separated from a side surface of the substrate.4. The physical quantity sensor according to claim 1 , 0.1 T≤D≤0.2 T claim 1 , wherein ...

METHOD FOR OPERATING A HEARING DEVICE AND HEARING DEVICE

A method operates a hearing device. The hearing device contains two acceleration sensors, which each provide a sensor signal and by which an orientation of the head of the user is established. The sensor signals of both acceleration sensors are used in combination for establishing the orientation, and an operating parameter of the hearing device is set depending on the orientation. 113-. (canceled)14. A method for operating a hearing device having two acceleration sensors each providing a sensor signal being used to determine an orientation of a head of a user , which comprises the steps of:using sensor signals of both of the acceleration sensors in combination for establishing the orientation;combining the two sensor signals to form an overall signal, by means of the overall signal the orientation of the head is established, the two sensor signals each having a gravitational acceleration component and are combined to form the overall signal in such a way that gravitational acceleration components are eliminated and the overall signal is independent of gravitational acceleration; andsetting an operating parameter of the hearing device in dependence on the orientation.15. The method according to claim 14 , which further comprises measuring a translational acceleration in each case by means of the two acceleration sensors.16. The method according to claim 14 , wherein the hearing device is a binaural hearing device containing two hearing aids including a left hearing aid and a right hearing aid to be worn on different sides of the head claim 14 , wherein one of the two acceleration sensors is in each case attached in or to one of the two hearing aids in each case such that the two sensor signals are provided as a left sensor signal and a right sensor signal.17. The method according to claim 14 , wherein a skew position of the acceleration sensors in respect of one another is compensated for.18. The method according to claim 17 , wherein the skew position is ...

ACCELERATOR POSITION DETECTION DEVICE

An accelerator position detection device facilitates detection of a neutral position of a handlebar grip turnable in not only a positive direction but in a negative direction from the neutral position. In the accelerator position detection device provided with a detector that outputs voltage according to an angle of the handlebar grip and detects an angle for control for controlling a vehicle based upon the angle of the handlebar grip on the basis of the output of a first sensor and a second sensor, the first sensor is configured so that the first sensor outputs first voltage rising in volume from a position exceeding a first rise start angle located in a normal rotation direction by predetermined quantity from the neutral position in the normal rotation direction, and the second sensor is configured so that the second sensor outputs second voltage rising in volume from a position exceeding a second rise start angle located in a reverse rotation direction by predetermined quantity from the neutral position in the normal rotation direction. 1. An accelerator position detection device comprising:a handlebar grip that is turnable in a normal rotation direction and in a reverse rotation direction from a neutral position and that is energized to the neutral position when no operation is applied;accelerator position sensors that output voltage according to an angle of the handlebar grip and that include a first sensor and a second sensor; anda detector that detects an angle for control for controlling a vehicle on the basis of the angle of the handlebar grip according to output from the accelerator position sensors,wherein the first sensor outputs a first voltage rising in volume from a position exceeding a first rise start angle located in a normal rotation direction by a predetermined quantity from the neutral position in the normal rotation direction, andwherein the second sensor outputs a second voltage rising in volume from a position exceeding a second rise start ...

Apparatus for providing motion sensors on a golf club

A fixed clamping member has a first interior surface and is constructed of a first material. A sensor unit formed on an exterior surface of the fixed clamping member detects a motion of the motion analysis device. A pivoting clamping member secured to a first end of the fixed clamping member has a second interior surface that opposes the first interior surface when the pivoting clamping member is in a secured position. A gripping element constructed of a second material different than the first material is formed over the first interior surface and the second interior surface. A tightening member having a threaded portion is secured to a second end of the fixed clamping member. A knob has a threaded interior portion with a diameter corresponding to the cylindrical threaded portion. An opening on the pivoting clamping member has a shape and a size corresponding to the tightening member.

HYBRID SENSOR ASSEMBLY FOR USE WITH ACTIVE NOISE CANCELLATION

A hybrid sensor assembly is configured to be mounted on a vehicle to sense structure borne and airborne noises generated as the vehicle travels over the roads. The sensor assembly includes a housing having a circuit board mounted therein, an accelerometer mounted on the circuit board, a microphone mounted on the circuit board, an acoustic port through the housing and in communication with the microphone, and an acoustic fabric attached to the housing over the port. An acoustic shield covers the acoustic port and substantially deters the entry of fluid and debris into the acoustic port. 1. A sensor assembly configured to be mounted on a vehicle comprising:a housing defining a compartment therein;a circuit board mounted within the compartment;an accelerometer mounted on the circuit board;a microphone mounted on the circuit board;a port through the housing and in communication with the microphone; andan acoustic fabric attached to the housing over the port.2. The sensor assembly of claim 1 , wherein the microphone includes a chip mounted on the circuit board and an acoustic seal claim 1 , the acoustic seal having a passageway extending longitudinally therethrough claim 1 , the passageway being proximate to the port.3. The sensor assembly of claim 2 , wherein the acoustic seal is formed of one of closed cell foam and santoprene.4. The sensor assembly of claim 3 , wherein the acoustic fabric has oleophobic and hydrophobic properties.516. The sensor assembly of claim 3 , wherein the acoustic seal is on a first side of the circuit board and the chip is on a second side of the circuit board claim 3 , and an opening is provided through the circuit board between the chip and the acoustic sea.. The sensor assembly of claim 3 , wherein the accelerometer is on the second side of the circuit board.7. The sensor assembly of claim 2 , wherein the chip and the acoustic seal are on a first side of the circuit board claim 2 , the chip being positioned within the passageway of the ...

SHOCK-ISOLATED MOUNTING DEVICE WITH A THERMALLY-CONDUCTIVE LINK

A shock-isolated mounting device and a method and system are provided. For example, the shock-isolated mounting device includes an enclosure configured to support the mounting device, at least one damper attached between the mounting device and the enclosure, and a thermally-conductive element disposed on a surface of the mounting device and configured to thermally couple the mounting device to the enclosure. The thermally-conductive element facilitates the dissipation of heat generated by electronic components mounted onto the shock-isolated mounting device. 1. A shock-isolated mounting , comprising:a mounting device;an enclosure configured to support the mounting device;at least one damper attached between the mounting device and the enclosure; anda thermally-conductive element disposed on a surface of the mounting device and configured to thermally couple the mounting device to the enclosure.2. The shock-isolated mounting of claim 1 , further comprising a printed board assembly (PBA) attached to the mounting device.3. The shock-isolated mounting of claim 1 , further comprising a PBA attached to the mounting device claim 1 , and at least one electronic component mounted to the PBA.4. The shock-isolated mounting of claim 1 , further comprising a PBA attached to the mounting device claim 1 , and a plurality of Micro-Electro-Mechanical Systems (MEMS) sensors mounted to the PBA.5. The shock-isolated mounting of claim 1 , wherein the mounting device comprises a mounting ring.6. The shock-isolated mounting of claim 1 , wherein the thermally-conductive element comprises a single layer of a thermally-conductive material.7. The shock-isolated mounting of claim 1 , wherein the thermally-conductive element comprises a first layer made of Kapton claim 1 , a second layer made of copper claim 1 , and a third layer made of Kapton.8. The shock-isolated mounting of claim 1 , wherein the at least one damper comprises a silicon rubber damper.9. The shock-isolated mounting of claim 1 ...

System including a sensor and an electrical cable

A system including a sensor and an electrical cable including electrical conductors, which are provided with an electrically insulating sheathing, the sensor being accommodated in a housing, the conductors of the cable are exposed from the sheathing at certain locations and the housing is fastened in an integrally bonded or form-fitting manner on the conductors of the cable at the exposed locations in the sheathing, and an electrically insulating sheathing is provided, which encloses the housing in a form-fitting manner and covers at least the cable in the area of the housing.

Fastening Device for an Electronic Component, in Particular an Acceleration Sensor for Airbag Systems

A fastening device for an electronic component, in particular an acceleration sensor for airbag systems, in which the electronic component is fixable in a motor vehicle with the aid of fastening elements, a first connection pair being present both on the motor vehicle and on the housing of the electronic component, which interlocks in a form-locked and/or force-fit manner for a pre-mounting of the electronic component and a second connection pair is present on the housing of the electronic component and on the motor vehicle, with the aid of which the electronic component may be fastened and positioned on the vehicle. The second connection pair is made up of a clip connection. 1. A fastening device for an electronic component , in which the electronic component is fix-able in a motor vehicle with fastening elements , comprising:a first connection pair on the motor vehicle and on a housing of the electronic component, wherein two elements of the first connection pair interlock in a form-locked and/or force-fit manner for a pre-mounting of the electronic component; anda second connection pair on the housing of the electronic component and on the vehicle, by which the electronic component is fasten-able and position-able on the vehicle, wherein the second connection pair includes a clip connection.2. The fastening device of claim 1 , wherein the clip connection has a peg which may be snapped into an opening claim 1 , the snap-in peg being formed on the housing of the electronic component claim 1 , while the snap-in opening is provided in the vehicle.3. The fastening device of claim 2 , wherein the snap-in peg is made up of multiple detents claim 2 , and the diameter of the snap-in peg is dimensioned so that the detents are flexibly in contact with the inner wall of the opening in the mounted state.4. The fastening device of claim 2 , wherein the snap-in peg is configured to be hollow on the inside for accommodating a fixing pin.5. The fastening device of claim 4 , ...

SENSOR UNIT, ELECTRONIC APPARATUS, AND MOVING OBJECT

A sensor unit includes: a substrate; an inertial sensor module mounted at the substrate; a container including a storage space for storing the substrate and the inertial sensor module; and a gel material disposed in the storage space, in which the gel material is located between the container and the substrate, and disposed to overlap with the inertial sensor module, in plan view of the substrate, and the substrate is kept in a non-contact state with the container by interposition of the gel material. 1. A sensor unit comprising:a substrate;an inertial sensor module mounted at the substrate;a container including a storage space for storing the substrate and the inertial sensor module; anda gel material disposed in the storage space, whereinthe gel material is located between the container and the substrate, and disposed to overlap with the inertial sensor module, in plan view of the substrate, andthe substrate is kept in a non-contact state with the container by interposition of the gel material.2. The sensor unit according to claim 1 , whereinthe substrate and the inertial sensor module are covered with the gel material.3. The sensor unit according to claim 1 , whereinthe storage space is filled with the gel material.4. The sensor unit according to claim 1 , whereina penetration degree of the gel material is equal to or more than 30 and equal to or less than 100.5. The sensor unit according to claim 1 , further comprising:a coupling member that couples the container and the substrate.6. The sensor unit according to claim 5 , whereinthe coupling member has elasticity.7. The sensor unit according to claim 5 , whereinthe coupling member is located outside the inertial sensor module in the plan view.8. An electronic apparatus comprising:{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'the sensor unit according to ; and'}a control circuit that performs a control based on a detection signal output from the sensor unit.9. A moving object comprising:{'claim-ref': {'@ ...

SENSOR UNIT, ELECTRONIC APPARATUS, AND MOVING BODY

A sensor unit with high reliability and stable detection accuracy against vibrations of an installation target object is to be provided. 1. A sensor unit comprising:three mutually orthogonal axes being defined as an X-axis, a Y-axis, and a Z-axis;a substrate having first and second surfaces opposite to each other and first and second sides, the first and second surfaces extending orthogonal to the Z-axis, the first side extending perpendicular to the X-axis, the second side extending orthogonal to the Y-axis;a first gyro sensor disposed on the first side of the substrate, the first gyro sensor being configured to detect an angular velocity in a direction along the X-axis;a second gyro sensor disposed on the second side of the substrate, the second gyro sensor being configured to detect an angular velocity in a direction along the Y-axis;a third gyro sensor disposed on the first surface of the substrate, the third gyro sensor being configured to detect an angular velocity in a direction along the Z-axis;an acceleration sensor disposed on the first surface of the substrate, the acceleration sensor being configured to detect accelerations along the X-axis, the Y-axis, and the Z-axis;a connector having first and second parts, the first part of the connector being disposed on the first surface of the substrate;an inner case having an exposed surface exposed to an outside of the sensor unit, the exposed surface extending orthogonal to the Z-axis, the inner case being mounted on the substrate so as to face the first surface of the substrate; andan outer case having a first opening, a bottom wall, and a side wall, the first opening being opened toward a direction along the Z-axis, the side wall contacting the bottom wall,wherein the inner case is housed in a first space that is formed by the first opening, the bottom wall, and the side wall of the outer case, and the inner case is disposed on the bottom wall of the outer case via an elastic member,the exposed surface of the ...

STRESS RELIEVING SENSOR FLANGE

The disclosure describes a sensor that includes a transducer, a case, and a mounting flange. The transducer defines an input axis. The case is configured to house the transducer. The mounting flange is statically coupled to the case and flexibly coupled to the transducer. The mounting flange defines an opening and includes a plurality of flexure elements extending radially into the opening to contact the transducer. Each flexure element is configured to flex in a radial direction perpendicular to the input axis and remain fixed in an axial direction parallel to the input axis. 1. A sensor comprising:a transducer defining an input axis;a case configured to house the transducer; anda mounting flange statically coupled to the case and flexibly coupled to the transducer,wherein the mounting flange defines an opening and comprises a plurality of flexure elements extending radially into the opening to contact the transducer, each flexure element configured to flex in a radial direction perpendicular to the input axis and remain fixed in an axial direction parallel to the input axis.2. The sensor of claim 1 , wherein each flexure element of the plurality of flexure elements comprises a discrete radial pad contacting the transducer.3. The sensor of claim 1 , wherein the discrete radial pad of each of the plurality of flexure elements includes a preform configured to couple the discrete radial pad to the transducer and electrically isolate the transducer from the mounting flange.4. The sensor of claim 1 , wherein the sensor is an accelerometer.5. The sensor of claim 1 , wherein the mounting flange is a monolithic unit.6. The sensor of claim 1 , wherein the transducer further comprises an upper stator and a lower stator claim 1 , andwherein the mounting flange is configured to flexibly couple to at least one of the upper stator or the lower stator.7. The sensor of claim 6 , wherein a coefficient of thermal expansion of the upper stator or the lower stator flexibly coupled to ...

Systems and methods for potted shock isolation

Systems and methods for potted shock isolation are provided. In once embodiment a shock isolation system comprises an isolator comprising an outer ring for mounting to an external housing, and an inner ring connected to the outer ring via an isolating element; and an inertial sensing assembly comprising: at least one circuit board secured to the inner ring of the isolator, the at least one circuit board further comprising a triad of gyroscopes and a triad of accelerometers; and a low durometer highly dampened supporting material encapsulating a first surface of the at least one circuit board.

Emergency localization device, in particular elt, for initiating an emergency measure

An emergency localization device for initiating an emergency measure, wherein the emergency localization device comprises a control unit, at least one acceleration sensor and at least one position sensor, the control unit being configured to receive a plurality of motion and/or position parameters from the acceleration sensor and/or from the position sensor, and by evaluating the plurality of motion or position parameters to determine a risk level for an emergency using a predefined logic, and to initiate an emergency measure if the calculated risk level exceeds a predefined threshold. The emergency localization device is reliable, robust and largely independent of aircraft-mounted systems.

ACCELERATION TRANSDUCER AND METHOD FOR MEASURING ACCELERATION DATA

An acceleration transducer for measuring acceleration data of a target device. The acceleration transducer includes a transducer body, an electronic assembly arranged inside the transducer body, a fastener having a cavity, an accelerometer arranged into the cavity, and a communication means connecting the accelerometer with the electronic assembly for transmitting acceleration data of the target device to the electronic assembly. The fastener is arrangeable into the portion of the target device in a manner that the fastener is substantially fitted into the portion of the target device. 1. An acceleration transducer for measuring an acceleration data of a target device , the acceleration transducer comprising:a transducer body to accommodate an electronic assembly;the electronic assembly arranged inside the transducer body;a fastener having a cavity, wherein the fastener is arrangeable into a portion of the target device and the cavity is filled with a filler;an accelerometer arranged in the cavity, wherein the accelerometer is configured to measure the acceleration data, and wherein the filler is configured to retain the accelerometer therein; anda communication means connecting the accelerometer with the electronic assembly for transmitting the measured acceleration data of the target device to the electronic assembly.2. The acceleration transducer according to claim 1 , wherein the electronic assembly comprises a printed circuit board claim 1 , a processor claim 1 , a radio transmitter claim 1 , a memory unit and a power source.3. The acceleration transducer according to claim 2 , wherein the radio transmitter is configured to transmit the measured acceleration data of the target device to an Internet of Things gateway.4. The acceleration transducer according to claim 1 , wherein the fastener comprises a first part and a second part having the cavity claim 1 , the first part being coupled to the transducer body and the second part being coupled to the portion of ...

SYSTEM AND METHOD FOR ANTI-TAMPERING SENSOR ASSEMBLY

The present teaching relates to method and system related to providing an anti-tampering sensor assembly on a vehicle. An inertial measurement unit (IMU) is attached to a structure hosting at least one sensor to form a rigid integral structure, which is deployed on a vehicle with an installation pose to enable the at least one sensor therein to sense surrounding information to facilitate autonomous driving. The installation pose of the IMU is indicative of an installation pose of the at least one sensor. The IMU is configured to obtain, in accordance with a schedule, one or more measurements associated with its state, which can be used to enable detecting tampering of the rigid integral structure. 1. A method for providing an anti-tampering sensor assembly on a vehicle , the method comprising:attaching an inertial measurement unit (IMU) to a structure hosting at least one sensor to form a rigid integral structure; anddeploying the rigid integral structure on a vehicle with an installation pose to enable the at least one sensor therein to sense surrounding information to facilitate autonomous driving, whereinthe installation pose of the IMU is indicative of an installation pose of the at least one sensor,the IMU obtains, in accordance with a schedule, one or more measurements associated with its state, which are used to enable detecting tampering of the rigid integral structure.2. The method of claim 1 , wherein the structure corresponds to a housing or a sensor rack with a plurality of sensors mounted thereon.3. The method of claim 1 , wherein the installation pose of the IMU is recorded as baseline information.4. The method of claim 1 , wherein the IMU transmits the one or more measurements to the vehicle.5. The method of claim 1 , wherein the one or more measurements associated with the state of the IMU include measures indicative of a change in velocity claim 1 , displacement claim 1 , rotation claim 1 , and acceleration.6. The method of claim 5 , wherein ...

BODY MOVEMENT TRACKING

Disclosed methods, systems, and storage media may track body movements and movement trajectories using internal measurement units (IMUs), where a first IMU may be attached to a first wrist of a user, a second IMU may be attached to a second wrist of the user, and a third IMU may be attached to a torso of the user. Upper body movements may be derived from sensor data produced by the three IMUs. IMUs are typically not used to detect fine levels of body movements and/or movement trajectory because most IMUs accumulate errors due to large amounts of measurement noise. Embodiments provide arm and torso movement models to which the sensor data is applied in order to derive the body movements and/or movement trajectory. Additionally, estimation errors may be mitigated using a hidden Markov Model (HMM) filter. Other embodiments may be described and/or claimed. 1. An apparatus comprising:an acceleration engine (AE) to determine, in a global coordinate system (GCS), a right wrist acceleration based on first sensor data, a left wrist acceleration based on second sensor data, and a torso acceleration based on third sensor data;an orientation engine (OE) to determine, in the GCS, a right wrist orientation based on the first sensor data, a left wrist orientation based on the second sensor data, and a torso orientation based on the third sensor data;a relative motion engine (RME) to determine a relative acceleration of a right elbow (RARE) based on the right wrist acceleration, the right wrist orientation, the torso acceleration, and the torso orientation, or a relative acceleration of a left elbow (RALE) based on the left wrist acceleration, the left wrist orientation, the torso acceleration, and the torso orientation; anda hidden Markov Model filter (HMMF) to determine a relative position of the right elbow (RPRE) or a relative position of the left elbow (RPLE) based on the RARE and the RALE.2. The apparatus of claim 1 , wherein the AE is to:determine the right wrist ...

RAILWAY RAIL GUIDE SYSTEM

A guide system including a railway rail extending along an axis and including an upper element having a rolling face; a lower element having a bearing face; a connecting element between the lower and upper elements, at least one lateral recess being formed between the lower and upper elements; at least first and second attitude sensors fixed to the rail by glue at respective positions offset along the axis of the rail, the attitude sensors being housed at least partially in the lateral recess; a processing circuit configured to recover attitude measurements supplied by the first and second attitude sensors and configured to calculate a deformation of the railway rail relative to the axis as a function of the recovered attitude measurements. 1. A guide system , comprising:a railway rail extending along an axis and further comprising:an upper element having a rolling face;a lower element having a bearing face;a connecting element between the lower and upper elements, at least one lateral recess being formed between the lower and upper elements to the side of the connecting element;wherein:at least first and second attitude sensors fixed to the rail by glue at respective positions offset along said axis of the rail, said attitude sensors being housed at least partially in the lateral recess;a processing circuit configured to recover attitude measurements supplied by the first and second attitude sensors and configured to calculate a deformation of said railway rail relative to said axis as a function of the recovered attitude measurements.2. The guide system according to claim 1 , wherein said first and second attitude sensors each comprises:an insulative material support glued to the rail;a box fixed to the support and forming a Faraday cage, said box housing at least one accelerometer of the attitude sensor.3. The guide system according to claim 2 , wherein the box is made of plastic charged with metal particles or plastic coated with a metal wall.4. The guide system ...

Piezoelectric transducer

A piezoelectric transducer includes a transducer unit disposed within a watertight and gas-tight housing and having at least one piezoelectric element contacted by at least two electrodes. A signal lead-through is electrically connected to the electrodes and configured conducting polarization charges as signals from the piezoelectric element through the housing to an environment outside of the housing. A signal cable arranged outside of the housing includes at least two signal conductors. The signal lead-through includes a support element having at least two conducting paths in electrical contact with one of the signal conductors.

Out-of-plane-accelerometer

Accelerometer including a seismic mass in a plane and a first capacitor plate and a second capacitor plate arranged parallel to the plane. The seismic mass is arranged in between the first capacitor plate and the second capacitor plate. The first capacitor plate and the second capacitor plate are configured to detect movements of the seismic mass out of the plane. A pillar extending from the first capacitor plate to the second capacitor plate through a cut-out in the seismic mass for stiffening the accelerometer.

Low-stress packaging structure for mems acceleration sensor chip

A low-stress packaging structure for a MEMS acceleration sensor chip includes a MEMS sensor chip and a chip carrier. Two sides of the bottom of the sensor chip are provided with a first metal layer and a second metal layer respectively. Two sides of a die attach area of the chip carrier are correspondingly provided with a third metal layer and a fourth metal layer. The first metal layer of the sensor chip and the third metal layer of the chip carrier are bonded together. The second metal layer of the sensor chip and the fourth metal layer of the chip carrier are only in contact but not bonded. A groove is arranged between the first metal layer and the second metal layer at the bottom of the sensor chip. A certain gap is defined between the sensor chip and cavity walls of chip carrier.

Physical Quantity Sensor, Physical Quantity Sensor Device, Complex Sensor Device, Electronic Device, And Vehicle

A physical quantity sensor includes a substrate, a sensor element supported on the substrate, and a lid bonded to the substrate so as to store the sensor element between the substrate and the lid. The lid includes a protrusion on the substrate side. The protrusion is disposed not to overlap the sensor element in plan view of the substrate. The protrusion is separated from the substrate or is in contact with the substrate so as to be capable of being separated from the substrate. 1. A physical quantity sensor comprising:a substrate;a sensor element supported on the substrate; anda lid bonded to the substrate so as to store the sensor element between the substrate and the lid,wherein the lid includes a protrusion on the substrate side,the protrusion is disposed not to overlap the sensor element in plan view of the substrate, andthe protrusion is separated from the substrate or is in contact with the substrate so as to be separable from the substrate.2. The physical quantity sensor according to claim 1 ,wherein the lid includes a recess portion which opens to a main surface on the substrate side and in which at least a portion of the sensor element is disposed, andthe protrusion is provided on a bottom surface of the recess portion.3. The physical quantity sensor according to claim 1 ,wherein the protrusion is separated from the substrate.4. The physical quantity sensor according to claim 3 ,wherein a distance between the protrusion and the substrate is shorter than a distance between the sensor element and a bottom surface of the recess portion.5. The physical quantity sensor according to claim 4 ,wherein the distance between the protrusion and the substrate is from 5 μm to 40 μm.6. The physical quantity sensor according to claim 5 ,wherein the distance between the protrusion and the substrate is from 10 μm to 20 μm.7. The physical quantity sensor according to claim 3 , further comprising:a bonding member that is positioned between the substrate and the lid and bonds ...

Sensor Unit, Method Of Manufacturing Sensor Unit, Inertial Measurement Device, Electronic Apparatus, And Vehicle

A sensor unit includes a plurality of terminal members each of which includes a lead portion and an external terminal portion having an external connection end face, a sensor device connected to the lead portions, and a resin member that covers the sensor device and a part of the plurality of terminal members. The lead portion includes a thin wall portion having a thickness thinner than the external terminal portion and a protruding portion protruding from the thin wall portion to an external connection end face side. In a plan view from a direction where the terminal member and the sensor device overlap, the sensor device is disposed at a position overlapping the protruding portion and not overlapping the external terminal portion. 1. A sensor unit comprising: a lead portion, and', 'an external terminal portion having an external connection end face;, 'a plurality of terminal members each of which includes,'}a sensor device connected to the lead portions of the plurality of terminal members; anda resin member that covers the sensor device and a part of the plurality of terminal members, a thin wall portion having a thickness thinner than the external terminal portion, and', 'a protruding portion protruding from the thin wall portion to an external connection end face side, and, 'wherein the lead portion includes,'}wherein, in a plan view from a direction where the terminal member and the sensor device overlap, the sensor device is disposed at a position overlapping the protruding portion and not overlapping the external terminal portion.2. The sensor unit according to claim 1 ,wherein the protruding portion includes a second external connection end face disposed on a plane same as the external connection end face.3. The sensor unit according to claim 2 ,{'b': '1', 'wherein an area of the external connection end face is S,'}{'b': '2', 'claim-text': {'br': None, 'i': S', 'S, '0.3<2/1<2.'}, 'an area of the second external connection end face is S, and'}4. The sensor ...

MOUNTING BOARD, SENSOR UNIT, ELECTRONIC APPARATUS, AND MOVING BODY

A board main body of a board has a sensor mounting area, in which a physical quantity sensor is mounted, disposed on a surface. A non-electrode forming part and a plurality of electrodes are disposed in the sensor mounting area, the electrodes being disposed so as to be isolated from each other, and to correspond to mounting terminals of the physical quantity sensor. A shield electrode is disposed outside the sensor mounting area.

SUPERCONDUCTING ACCELEROMETER, ACCELERATION MEASURING APPARATUS, AND ACCELERATION MEASURING METHOD

Provided are a superconducting accelerometer, an acceleration measurement device, and an acceleration measurement method. The superconducting accelerometer includes a test mass including a rod-shaped body part, a disc-shaped coupling part connected to the body part, the test mass being made of a superconductor; a solenoid levitation coil disposed to surround a portion of the body part and adapted to magnetically levitate the test mass, the solenoid levitation coil being made of a superconductor; a measurement superconductor coil disposed at at least one side of an upper portion and a lower portion of the coupling part; and a SQUID sensor adapted to detect current depending on variation of a distance between the test mass and the measurement superconductor coil. 1. A superconducting accelerometer comprising:a test mass including a rod-shaped body part and a disc-shaped coupling part connected to the body part, the test mass being made of a superconductor;a solenoid levitation coil disposed to surround a portion of the body part and adapted to magnetically levitate the test mass, the solenoid levitation coil being made of a superconductor;a measurement superconductor coil disposed at at least one side of an upper portion and a lower portion of the coupling part; anda SQUID sensor adapted to detect current depending on variation of a distance between the test mass and the measurement superconductor coil.2. The superconducting accelerometer as set forth in claim 1 , wherein the test mass further comprises a neck part disposed between the body part and the coupling part.3. The superconducting accelerometer as set forth in claim 2 , further comprising:a superconductor shielding case adapted to surround and magnetically shield a portion of the neck part, the body part, and the solenoid levitation coil.4. The superconducting accelerometer as set forth in claim 3 , further comprising:a coil bobbin disposed inside the solenoid levitation coil,wherein the coil bobbin is made ...

Passive anti-vibration system for Inertial Measurement Unit (IMU) of Aerial vehicles

As the potential applications of unmanned aerial vehicles (UAVs) are growing, more sensors are installed on-board. One of the most important on-board equipments is Inertial Measurement Unit (IMU). Mechanical vibration of the IMU, which greatly hinders the accuracy of its, becomes an increasingly important issue. In this specification, an anti-vibration framework on IMU is provided. A design process of an anti-vibration system of the IMU will be shown and described. 1. Passive anti-vibration system for an inertial sensor block of flying instruments in a given space which is limited by a box , including a set of main components: a vibration-proof parts , a center-weighted weights , a resulting jigs. a heavy and an inertial sensor blocks , where:anti-vibration elements are designed with a stainless steel material located in a square base and a special round rubber; wherein the anti-vibration elements have high elastic characteristics, good heat resistance, damping coefficient and appropriate stiffness;the box is tightly attached; the anti-vibration elements are fastened to walls of the box; heavy weights and jigs connect vibration-proof components to an inertial sensor unit, which is tightened to prevent mechanical contamination as much as possible;the components are arranged so that the weight is balanced at the center of the system, and tightly connected to the vibration-proof parts through screws and bolts.2. The passive anti-vibration system for the inertial sensor block of the flying instruments according to wherein the entire anti-vibration system is removable during use.3. The passive anti-vibration system for the inertial sensor block of the flying instruments according to claim 1 , wherein the system utilizes four anti-vibration components.4. Methods of designing a anti-vibration system for inertial sensors of flight instruments includes the following steps:Step 1: Receive anti-vibration technical requirements for inertial sensor blocks, receive IMU anti- ...

Inertial measurement device, electronic apparatus, and moving object

An inertial measurement device includes a sensor unit having an angular velocity sensor and an acceleration sensor, an elastic member that has a first portion, a second portion facing the first portion, and a third portion coupled to the second portion, and sandwiches the sensor unit between the first portion and the second portion, a fixing portion on which the sensor unit and the elastic member are disposed and which is in contact with the second portion, and a fixing member that fixes the sensor unit and the elastic member to the fixing portion. The fixing member passes through the sensor unit and the elastic member, and presses and fixes the elastic member. The third portion of the elastic member is positioned between the sensor unit and the fixing member.

PROCESS FOR PRODUCING A PIEZOELECTRIC SENSOR AND PIEZOELECTRIC SENSOR OBTAINED BY MEANS OF SUCH A PROCESS

A process for producing a piezoelectric sensor includes the following steps: a step of providing a housing made of stainless steel; a step of producing a solution of a compound comprising a metal or metalloid element; a step of depositing a layer of the solution over at least one inner surface of the housing; a step of oxidizing the deposited layer of solution; a step of placing a piezoelectric element inside the housing; a step of closing the housing. A piezoelectric sensor obtained by means of such a process and comprising a closed steel housing, a piezoelectric element arranged inside the housing and a layer of a solution of a compound comprising a metal or metalloid element that is arranged over at least one inner surface of the housing. 1. A process for producing a piezoelectric sensor comprising the following steps:a step of providing a housing made of stainless steel;a step of producing a solution of a compound comprising a metal or metalloid element;a step of depositing a layer of said solution over at least one inner surface of the housing;a step of oxidizing the deposited layer of solution;a step of placing a piezoelectric element inside said housing;a step of hermetically closing the housing, subsequent to all of the previous steps.2. The process as claimed in claim 1 , the solution being a rare earth solution.3. The process as claimed in claim 2 , the rare earth solution comprising a compound based on lanthanum claim 2 , yttrium claim 2 , cerium or a combination of said compounds.4. The process as claimed in claim 2 , the rare earth solution comprising a compound chosen from a lanthanum oxide claim 2 , a lanthanum hydroxide claim 2 , a lanthanum carbonate claim 2 , a lanthanum acetate claim 2 , a lanthanum oxalate claim 2 , an yttrium oxide claim 2 , an yttrium hydroxide claim 2 , an yttrium oxalate claim 2 , a cerium oxide or a combination of said compounds.5. The process as claimed in claim 1 , the solution comprising a compound based on polysilazane.6 ...

DEVICE, SYSTEM AND METHOD FOR STRESS-SENSITIVE COMPONENT ISOLATION IN SEVERE ENVIRONMENTS

A system, device and method for stress-sensitive component isolation in severe environments are disclosed. For example, a device for stress-sensitive component isolation is disclosed, which includes a circuit board assembly, a plurality of electronic components mounted onto a surface of the circuit board assembly, and a protective cap disposed over at least one electronic component and mounted onto the surface of the circuit board assembly. The protective cap can be filled with a low modulus material if additional structural support is desired for the electronic component. 1. A device for stress-sensitive component isolation , comprising:a circuit board assembly;a plurality of electronic components mounted onto a surface of the circuit board assembly; anda protective cap disposed over at least one electronic component of the plurality of electronic components and mounted onto the surface of the circuit board assembly.2. The device of claim 1 , further comprising:a first potting material disposed within a cavity formed between the protective cap and the at least one electronic component of the plurality of electronic components.3. The device of claim 1 , further comprising:a first potting material disposed within a cavity formed between the protective cap and the at least one electronic component of the plurality of electronic components; anda second potting material disposed on the protective cap, wherein the first potting material has a first modulus of elasticity and the second potting material has a second modulus of elasticity.4. The device of claim 3 , wherein a modulus value for the first modulus of elasticity is lower than a modulus value for the second modulus of elasticity.5. The device of claim 3 , wherein the protective cap is configured to isolate the at least one electronic component from the second potting material.6. The device of claim 3 , wherein the protective cap is configured to mitigate stress induced into the at least one electronic component ...

THREE-AXIS PIEZOELECTRIC ACCELEROMETER

A three-axis piezoelectric accelerometer, comprising: a housing, three charge output elements arranged inside the housing, and a connector electrically connected to the three charge output elements, wherein the three charge output elements are respectively used for detecting vibrations in directions along X-axis, Y-axis and Z-axis which are perpendicular to each other in pairs. The charge output element comprises: a support comprising a connecting part; a piezoelectric element being an annular structural body, wherein the piezoelectric element is connected to the connecting part in a sheathed manner and is provided with a first deformation groove penetrating a side wall of the piezoelectric element to disconnect the piezoelectric element in a circumferential direction; and a mass block being an annular structural body, wherein the mass block is connected to the piezoelectric element in the sheathed manner, and the piezoelectric element is in interference fit with the connecting part and the mass block. 1. A three-axis piezoelectric accelerometer , comprising:a housing, three charge output elements disposed inside the housing, and a connector electrically connected to the three charge output elements,wherein the three charge output elements are respectively configured to detect vibrations in directions along a X-axis, a Y-axis, and a Z-axis, and the X-axis, the Y-axis, and the Z-axis are perpendicular to each other in pairs, a support, comprising a connecting part;', 'a piezoelectric element, which is an annular structural body and connected to the connecting part in a sheathed manner, wherein the piezoelectric element is provided with a first deformation groove penetrating a side wall of the piezoelectric element to disconnect the piezoelectric element in a circumferential direction thereof; and', 'a mass block, which is an annular structural body and is connected to the piezoelectric element in the sheathed manner, and, 'wherein each of the three charge output ...

MICROMECHANICAL SENSOR

A micromechanical sensor. The sensor includes a substrate, a cap element situated on the substrate, at least one seismic mass that is deflectable orthogonal to the cap element, an internal pressure that is lower by a defined amount relative to the surrounding environment prevailing inside a cavity, and a compensating element designed to provide a homogenization of a temperature gradient field in the cavity during operation of the micromechanical sensor. 110-. (canceled)11. A micromechanical sensor , comprising:a substrate;a cap element situated on the substrate;at least one seismic mass that is deflectable orthogonal to the cap element, an internal pressure that is lower by a defined amount relative to a surrounding environment prevailing inside a cavity; anda compensating element that is configured to provide a homogenization of a temperature gradient field in the cavity during operation of the micromechanical sensor.12. The micromechanical sensor as recited in claim 11 , wherein the compensating element include at least one structuring element of the cap element claim 11 , a defined distance of the seismic mass to the cap element being provided in defined segments by the structuring element.13. The micromechanical sensor as recited in claim 11 , wherein the cap element is lowered and structured in some segments relative to low-mass segments of the seismic mass.14. The micromechanical sensor as recited in claim 12 , wherein additional layers are incorporated into the cap element claim 12 , the layers being thermal insulators and/or thermal conductors.15. The micromechanical sensor as recited in claim 12 , wherein a thermally optimized coupling between defined regions of the micromechanical sensor is realized by thermal coupling elements.16. The micromechanical sensor as recited in claim 15 , wherein the thermal coupling elements include a metal.17. The micromechanical sensor as recited in claim 11 , wherein the compensating element includes a defined porosification ...

PORTABLE MEDICAL DEVICE

A portable medical device adapted to be carried by a user, comprising at least one electrically actuated means for performing a therapeutic and/or a diagnostic function on a patient, at least one mobile electric power supply, a control unit having at least one microelectronic controller, at least one electronic memory and at least one multi-channel impact sensor unit. The impact sensor unit is adapted to simultaneously detect linear acceleration along the three space axes and angular rates around the three space axes. The impact sensor unit generates impact sensor data sets, which are electronically transferred to the microelectronic controller via an interface. The device further comprises a housing, in which the electric components of the device are contained. The device is adapted to execute a classification algorithm, which allows to discriminate a first impact sensor data set, said first impact data set being correlated to a first impact event which is detrimental for the device, from a second impact sensor data set, said second impact data set being correlated to a second impact event which is not detrimental for the device. 1. A portable medical device adapted to be carried by a user , comprisingat least one electrically actuated means for performing a therapeutic and/or a diagnostic function on a patient,at least one mobile electric power supply,a control unit having at least one microelectronic controller and at least one electronic memory,{'sub': x', 'y', 'z', 'x', 'y', 'z, 'at least one multi-channel impact sensor unit, wherein the impact sensor unit is adapted to simultaneously detect linear acceleration (a; a; a) along the three space axes (x; y; z) and angular rates (ω; ω; ω) around the three space axes (x; y; z), wherein'}the impact sensor unit generates impact sensor data sets, and the impact sensor data sets are electronically transferred to the microelectronic controller via an interface,a housing, in which the electric components of the device are ...

Sensor unit, electronic apparatus, and moving body

A sensor unit with high reliability and stable detection accuracy against vibrations of an installation target object is to be provided. A sensor unit includes: a sensor module configured including a substrate with inertial sensors mounted thereon, and an inner case in which the substrate is installed; and an outer case accommodating the sensor module. A recessed part is formed in the inner case. The inertial sensors are arranged in an area overlapping with the recessed part as viewed in a plan view seen from the direction of thickness of the substrate, and a filling member is provided to fill a space formed by the substrate and the recessed part. The sensor module is joined to a bottom wall of the outer case via a joining member.

Reusable Estrus Detection System

A reusable estrus detection system includes disposable components and reusable components that interlock during operation. Following use, the disposable components can be disengaged and replaced by interlocking a new set of disposable components with the reusable components. 1. A reusable estrus detection system comprising:disposable components comprising: i) an adhesive layer having a first side for attachment to a mammal and a second side, and ii) a housing mount secured to the second side of the adhesive layer; andreusable components suitable for one or more uses, the reusable components comprising: i) a housing assembly configured for releasably interlocking with the housing mount, ii) and a sensor apparatus contained within the housing assembly, the sensor apparatus having a contact sensor for detecting contact and a transmitter for transmitting contact information.2. The reusable estrus detection system of claim 1 , wherein the contact sensor claim 1 , and transmitter are connected through a printed board circuit assembly.3. The reusable estrus detection system of claim 1 , wherein the housing mount further comprises at least one tab.4. The reusable estrus detection system of claim 3 , wherein the housing assembly further comprises at least one slot claim 3 , and wherein the at least one slot of the housing assembly mates with the at least one tab of the housing mount to releasably secure the housing assembly to the housing mount.5. The reusable estrus detection system of claim 1 , wherein the housing assembly further comprises at least one tab.6. The reusable estrus detection system of claim 5 , wherein the housing mount further comprises at least one slot claim 5 , and wherein the at least one slot of the housing mount mates with the at least one tab of the housing assembly to releasably secure the housing assembly to the housing mount.7. The reusable estrus detection system of claim 1 , wherein the housing assembly is secured to the housing mount with one ...

Sensor-enabled mouthguard configured to enable monitoring of head impact data via multiple accelerometers, and data processing methods configured to analyse data derived from multiple accelerometers carried by a sensor-enabled mouthguard

Technology disclosed herein relates to sensor-enabled mouthguards. Embodiments have been particularly developed to provide sensor-enabled mouthguards configured to enable monitoring of head impact data via multiple accelerometers, and data processing methods configured to analyse data derived from multiple accelerometers carried by a sensor-enabled mouthguard. This finds application, for example, in the context of managing brain injury risks in the context of sporting activities.

Package, electronic device, method of manufacturing electronic device, electronic apparatus, and moving object

A package includes a base portion, and a lid which is placed on the base portion to define an inner space with the base portion and has a metal plate layer and a brazing material layer that is laminated on the metal plate layer, in which the base portion has a metalized layer which is joined with the brazing material layer around the inner space in a plane view, and the brazing material layer has a protrusion which protrudes in a opposite direction of the base portion on an outer peripheral side surface of the metal plate layer.

METHOD AND APPARATUS FOR MEASUREMENT OF THE NOISINESS OF A ROLLING BEARING, IN PARTICULAR OF A WHEEL HUB BEARING UNIT

A method wherein the possible abnormal noisiness and vibrations of a rolling bearing for a wheel hub unit are detected by fixing a first one of the inner and outer rings of the bearing integral on a support provided with a first and a second accelerometer so that the first and second accelerometers have respective measurement axes (X, Y) arranged at a right angle relative to each other on a plane perpendicular to the axis of symmetry (A) of the bearing. A second ring of the bearing is angularly coupled with means for rotating it at a predetermined speed, calculated beforehand based on operating parameters of the bearing; processing means detect in a predetermined time interval a first and a second electric signal (T, T) emitted by the first and second accelerometers and, through a frequency analysis, obtain a frequency spectrum (P) of the amplitude of any vibrations detected. 1. An apparatus for measurement of the noisiness and of the vibrations of a rolling bearing having a radially outer ring and a radially inner ring mounted coaxial to each other with respect to a common axis of symmetry (A) and between at least one crown of rolling bodies , comprising:a base);a first support supported by the base and having a slide slidingly supported by the base in a predetermined direction (D) and means removably supported by the slide, adapted to integrally receive a first one of the outer ring and the inner ring of the bearing, with the axis of symmetry (A) arranged parallel to the predetermined sliding direction (D) of the slide;a first and a second accelerometer accommodated into respective seats provided on the support so that respective measurement axes (X, Y) of the accelerometers are arranged at right angle relative to each other on a plane perpendicular to the axis of symmetry of the bearing;means for rotating at a predetermined speed a second one of the rings of the bearing;{'b': 1', '2, 'means for axially moving the slide along the predetermined direction (D) and ...

INERTIAL SENSOR, ELECTRONIC DEVICE, AND VEHICLE

An inertial sensor includes a substrate, a first detection element that is provided on a first surface of the substrate and includes a first movable portion displaceable with respect to the substrate and a first fixed portion connected to the first movable portion and fixed to the substrate, and a second detection element that is provided on a second surface in a front-back relationship with the first surface and includes a second movable portion displaceable with respect to the substrate and a second fixed portion connected to the second movable portion and fixed to the substrate. 1. An inertial sensor comprising:a substrate;a first detection element that is provided on a first surface of the substrate and includes a first movable portion displaceable with respect to the substrate and a first fixed portion connected to the first movable portion and fixed to the substrate; anda second detection element that is provided on a second surface in a front-back relationship with the first surface and includes a second movable portion displaceable with respect to the substrate and a second fixed portion connected to the second movable portion and fixed to the substrate.2. The inertial sensor according to claim 1 , further comprising:a first lid body that forms a first space with the first surface; anda second lid body that forms a second space with the second surface, whereinthe first detection element is accommodated in the first space,the second detection element is accommodated in the second space,the first lid body is provided with a first hole sealed with a sealing material, andthe substrate is provided with a second hole making the first space and the second space communicate with each other.3. The inertial sensor according to claim 2 , further comprising:a plurality of first terminals provided outside the first space on the first surface;a plurality of second terminals provided on the second surface and provided in the second space; anda penetrating electrode ...

THERMAL CONTROL DEVICE OF A COMPONENT, ASSOCIATED ELECTRONIC SYSTEM AND PLATFORM

The present invention relates to a thermal control device of a component, the control device including: a power source, a converter able to convert a temperature variation into a resistance variation, and a cooling module including two faces, a first face at a first temperature and a second face at a second temperature, the difference between the first temperature and the second temperature depending on the current supplying the cooling module, the first face being in, contact with the component, the cooling module, the converter and the power source being arranged electrically so that the current supplying the converter decreases with a temperature increase and the current supplying the cooling module remains constant. 1. The thermal control device of a component , the control device including:a power source,a converter able to convert a temperature variation into a resistance variation,a cooling module including two faces, a first face at a first temperature and a second face at a second temperature, the difference between the first temperature and the second temperature depending on the current supplying the cooling module, the first face being in contact with the component,the cooling module, the converter and the power source being arranged electrically so that the current supplying the converter decreases with a temperature increase and the current supplying the cooling module remains constant.2. The control device according to claim 1 , wherein the second face is arranged to be kept at a constant temperature.3. The control device according to claim 1 , wherein the cooling module and the converter are arranged in parallel with the power supply.4. The control device according to claim 1 , wherein the converter has a resistance that increases with the temperature.5. The control device according to claim 1 , wherein the control device is a self-regulated device.6. The control device according to claim 1 , wherein the component includes a sensor and a protective ...

METHOD AND SYSTEM FOR AN EXERCISE APPARATUS WITH ELECTRONIC CONNECTORS

Exemplary embodiments of a method and system of an exercise apparatus are provided where an exercise apparatus can be configured to work with multiple accessories, such as wrist bands, waist bands, clips, etc. The exercise apparatus can comprise an instrument sensor for recording exercise data pertaining to a user's physical activity, and one or more electrical connectors for connecting to an accessory, the one or more electrical connectors providing the exercise data to the accessory. The electrical connectors can also provide power to the accessory for a display on the accessory and/or other functions on the accessory. 1. An exercise apparatus , comprising:an instrument sensor for recording exercise data pertaining to a user's physical activity; andone or more electrical connectors for connecting to an accessory, the one or more electrical connectors providing the exercise data to the accessory.2. The exercise apparatus of claim 1 , further comprising:a front case; anda rear case.3. The exercise apparatus of claim 1 , wherein the instrument is an accelerometer.4. The exercise apparatus of claim 1 , further comprising:a wireless transceiver for streaming the exercise data to the accessory in real time.5. The exercise apparatus of claim 1 , wherein the one or more electrical connectors provide power for the accessory once the exercise apparatus is connected to the accessory using the electrical connectors.6. The exercise apparatus of claim 1 , wherein the accessory is one of a watch claim 1 , wrist band claim 1 , belt clip and underwear clip. This application relates to and claims priority from U.S. patent application Ser. No. 61/748,866 filed Jan. 4, 2013, the entire disclosure of which is hereby incorporated herein by reference.The present disclosure relates to exemplary embodiments of methods and systems for providing an exercise apparatus, and more particularly, to exemplary embodiments of methods and systems for providing an exercise status with electronic ...

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

A semiconductor device includes a substrate, a movable portion provided on the substrate, a junction frame provided on the substrate to surround the movable portion, a cap bonded to the junction frame, the cap having a recessed portion and covering a space over the movable portion with the recessed portion facing the movable portion, the cap having an inside wall provided with irregularities, and a prevention film formed on the inside wall of the cap, the prevention film having irregularities on a surface thereof. 1. A semiconductor device comprising:a substrate;a movable portion provided on the substrate;a junction frame provided on the substrate to surround the movable portion;a cap bonded to the junction frame, the cap having a recessed portion and covering a space over the movable portion with the recessed portion facing the movable portion, the cap having an inside wall provided with irregularities; anda prevention film formed on the inside wall of the cap, the prevention film having irregularities on a surface thereof.2. The semiconductor device according to claim 1 , wherein a surface roughness of the inside wall and a surface roughness of the prevention film are equal.3. The semiconductor device according to claim 1 , wherein the cap and the junction frame are bonded by covalent bonding.4. The semiconductor device according to claim 1 , wherein the prevention film is made of metal.5. The semiconductor device according to claim 1 , wherein a space surrounded by the recessed portion and the substrate contains inert gas.6. The semiconductor device according to claim 1 , wherein a space surrounded by the recessed portion and the substrate is a vacuum.7. A semiconductor device manufacturing method claim 1 , comprising the steps of:forming a device structure on a substrate, the device structure including a movable portion, a fixed portion, and a junction frame surrounding the movable portion and the fixed portion;forming a prevention film having irregularities on ...

INERTIA MEASUREMENT MODULE FOR UNMANNED AIRCRAFT

An unmanned aircraft includes a circuit board with an inertia sensor, and a weight block configured to have a flat surface and a recess formed on the flat surface, and a housing assembly configured to form an inner chamber to accommodate the circuit board and the weight block. The circuit board is embedded in the recess by fixedly bonding to the flat surface through adhesion. 1. (canceled)2. An unmanned aircraft , comprising:a circuit board with an inertia sensor;a weight block configured to have a flat surface and a recess formed on the flat surface, wherein the circuit board is embedded in the recess by fixedly bonding to the flat surface through adhesion; anda housing assembly configured to form an inner chamber to accommodate the circuit board and the weight block.3. The unmanned aircraft of claim 2 , wherein the weight block is made of a metallic material to dissipate heat from the circuit board.4. The unmanned aircraft of claim 2 , wherein the circuit board is further disposed on a supporting sheet that is fixedly bonded to the flat surface of the weight block through an adhesive layer.5. The unmanned aircraft of claim 2 , wherein the weight block is configured to have a mass such that an inherent frequency of the unmanned aircraft is reduced to be less than an operation frequency of the unmanned aircraft.6. The unmanned aircraft of claim 5 , wherein the operation frequency of the unmanned aircraft is in a range from 50 Hz to 200 Hz.7. The unmanned aircraft of claim 2 , wherein the weight block has a weight of about 1 g to 30 g.8. The unmanned aircraft of claim 2 , wherein the weight block has a cuboidal shape.9. The unmanned aircraft of claim 2 , wherein the recess of the weight block has a shape and dimensions substantially matching a shape and dimensions of the circuit board.10. The unmanned aircraft of claim 2 , wherein the circuit board is a flexible circuit board.11. The unmanned aircraft of claim 2 , further comprising:a vibration damper configured to ...

Physical quantity sensor, electronic apparatus, and moving object

A physical quantity sensor includes a sensor element, an integrated circuit that is electrically connected to the sensor element, and a ceramic package (base body) on which the integrated circuit is mounted. A first conductor pattern (interconnection pattern) for electrical connection with the outside is provided on one surface of the ceramic package. A second conductor pattern is provided to be electrically connected to the interconnection pattern. The second conductor pattern includes an interconnection pattern that passes through the inside of the ceramic package, and a metallized region that is exposed on the other surface of the ceramic package. The interconnection pattern is longer than a distance between the one surface and the other surface of the ceramic package.

Physical quantity measurement device and electronic apparatus

A physical quantity measurement device includes a physical quantity measurement sensor and a metal block that is a holding member that includes block surfaces that serve as a plurality of holding portions for holding the physical quantity measurement sensor, and the block surface has a groove formed in a region facing the physical quantity measurement sensor.

Motion sensor assembly and unmanned aerial vehicle

The present disclosure provides a motion sensor assembly applied to an unmanned vehicle. The motion sensor assembly includes a mounting bracket, a sensor assembly body, and a shock absorption mechanism disposed between the mounting bracket and the sensor assembly body. The sensor assembly body includes a protective casing and a sensor module disposed in the protective casing. The shock absorption mechanism including a plurality of elastic members, which are disposed between the mounting bracket and the protective casing for absorbing the shock of the sensor module in the protective casing.

INTEGRATED MOTION PROCESSING UNIT (MPU) WITH MEMS INERTIAL SENSING AND EMBEDDED DIGITAL ELECTRONICS

A module operable to be mounted onto a surface of a board. The module includes a linear accelerometer to provide a first measurement output corresponding to a measurement of linear acceleration in at least one axis, and a first rotation sensor operable to provide a second measurement output corresponding to a measurement of rotation about at least one axis. The accelerometer and the first rotation sensor are formed on a first substrate. The module further includes an application specific integrated circuit (ASIC) to receive both the first measurement output from the linear accelerometer and the second measurement output from the first rotation sensor. The ASIC includes an analog-to-digital converter and is implemented on a second substrate. The first substrate is vertically bonded to the second substrate. 1. A device comprising:an accelerometer operable to provide a measurement output corresponding to measurement of linear acceleration in at least one of the two axes;an application specific integrated circuit (ASIC) implemented on a first silicon substrate, and wherein the accelerometer is electrically connected to the ASIC; anda second silicon substrate that seals the gyroscope within a hermetic enclosure in between the first silicon substrate and the second silicon substrate, wherein the first silicon substrate and the second silicon substrate are the same material.2. The device of claim 1 , further comprising:one or more measurement devices comprising any one of a gyroscope, a barometer or a microphone.3. The device of claim 1 , further comprising:one or more measurement devices comprising two or more of a geomagnetic sensor or a temperature sensor.4. The device of claim 1 , wherein the ASIC comprises built-in logic configured to detect the linear acceleration.5. The device of claim 1 , wherein the ASIC comprises built-in logic comprising a system of programmable interrupts permitting determination of a source of interrupt.6. The device of claim 1 , wherein the ...

FAILURE DIAGNOSIS DEVICE FOR WHEEL BEARING

According to one embodiment of the present disclosure, there is provided a failure diagnosis device used for diagnosing the presence of failure or abnormal operation of a wheel bearing. The failure diagnosis device according to one embodiment of the present disclosure may comprise a housing; a magnetic coupling part provided in the housing; and a sensing part provided in the housing and configured to detect physical characteristic related to an operational state of a vehicle. According to one embodiment of the present disclosure, the sensing part may comprise an acceleration sensor configured to collect acceleration information, and the failure diagnosis device may be configured to be detachably mounted to one side of a wheel by virtue of a magnetic force generated by the magnetic coupling part. 1. A failure diagnosis device used for diagnosing presence of failure or abnormal operation of a wheel bearing , comprising:a housing;a magnetic coupling part provided in the housing; anda sensing part provided in the housing and configured to detect physical characteristic related to an operational state of a vehicle,wherein the sensing part comprises an acceleration sensor configured to collect acceleration information, andwherein the failure diagnosis device is configured to be detachably mounted to one side of a wheel by virtue of a magnetic force generated by the magnetic coupling part.2. The failure diagnosis device of claim 1 , wherein the failure diagnosis device is configured to be detachably mounted to one side of the wheel by virtue of the magnetic force generated between a wheel mounting bolt or a wheel mounting nut claim 1 , which is used to mount the wheel to the wheel bearing claim 1 , and the magnetic coupling part.3. The failure diagnosis device of claim 2 , wherein the magnetic coupling part is formed by magnetizing steel material.4. The failure diagnosis device of claim 2 , wherein a recess formed to be concave is provided in one side of the housing claim ...

ACCELEROMETER TECHNIQUES TO COMPENSATE PACKAGE STRESS

Techniques for compensating package stress of a proof mass are provided. In an example, a proof mass can be suspended from a substrate by a proof mass anchor. The first proof mass can have a major surface that defines a first plane. Portions of electrodes forming part of the proof mass can be symmetric with each other across a first line, wherein the first line bisects the first proof mass anchor, extends parallel to the first plane and extends between the first electrode and the second electrode. 1. A MEMS accelerometer comprising:a first proof mass anchor;a first proof mass suspended from a substrate by the first proof mass anchor, the first proof mass having a major surface defining a first plane;a first portion of a first electrode, the first portion of the first electrode configured to electrically interact with a second portion of the first electrode, wherein the first proof mass includes the second portion of the first electrode;a first portion of a second electrode, the first portion of the second electrode configured to electrically interact with a second portion of the second electrode, wherein the first proof mass includes the second portion of the second electrode;wherein the first electrode and the second electrode are configured to provide a differential signal representative of acceleration of the accelerometer along an axis perpendicular to the first plane;wherein the first portion of the first electrode and the first portion of the second electrode are symmetric with each other across a first line; andwherein the first line bisects the first proof mass anchor, extends parallel to the first plane and extends between the first electrode and the second electrode.2. The accelerometer of claim 1 , including a third electrode having first portion and a second portion;wherein the first portion of the third electrode is suspended from the substrate by a first electrode anchor;wherein the first proof mass includes the second portion of the third electrode; ...

METHOD FOR FORMING A CAPTIVE SPACER HOUSED IN A MOUNTING BASE OF AN ACCELEROMETER SENSOR AND SENSOR EQUIPPED WITH SUCH A MOUNTING BASE

Disclosed is a method for forming a spacer extending at least partially within the length of a central bore passing from one side to the other of a barrel of a mounting base of an accelerometer sensor, the central bore being designed to receive a fastening element for fixing the mounting base onto a support element, the fastening element being centered by the spacer in the central bore, the mounting base being at least partially surrounded by an encapsulation of overmolded plastic material. When the plastic material is overmolded around the mounting base to form the encapsulation, a part of the plastic material passes through the barrel to form the spacer while fixing it to the encapsulation. Also described is a mounting base with at least one channel for the passage of the plastic material, and to an accelerometer sensor equipped with such a mounting base. 1342214525342727237aa. A method for forming a spacer () extending at least partially within the length of a central bore () passing from one side to the other of a barrel () of a mounting base () of an accelerometer sensor () , the central bore () being designed to receive a fastening element () for fixing the mounting base () onto a support element , the fastening element () being centered by the spacer () in the central bore () , the mounting base () being at least partially surrounded by an encapsulation () of overmolded plastic material , wherein , when the plastic material is overmolded around the mounting base () to form the encapsulation () , part of the plastic material passes through the barrel () to form the spacer () while fixing it to the encapsulation ().27365422622443caca. The method as claimed in claim 1 , wherein claim 1 , before the overmolding of the encapsulation () and the fixed spacer () claim 1 , a core () having a shape similar to that of the fastening element () is positioned in the central bore () of the barrel () of the mounting base () claim 1 , the core () having at least one shoulder ...

Physical Quantity Sensor, Inertial Measurement Unit, Electronic Apparatus, Portable Electronic Apparatus, And Vehicle

A physical quantity sensor includes a substrate, an acceleration sensor mounted on the substrate, an integrated circuit mounted on the substrate and stacked with the acceleration sensor, and serial communication wirings provided to the substrate. In a plan view of the acceleration sensor element, a bonding wire connecting the acceleration sensor element to the integrated circuit is disposed on an opposite side to the serial communication wirings with respect to a virtual central line of the acceleration sensor element. 1. A physical quantity sensor comprising:a substrate;a sensor element mounted on the substrate;a semiconductor circuit mounted on the sensor element so as to sandwich the sensor element between the substrate and the semiconductor circuit;serial communication wirings provided on the substrate; andelectrical connectors connecting the sensor element to the semiconductor circuit, and arranged on a side opposite to the serial communication wirings in a lateral direction of the sensor element.2. The physical quantity sensor according to claim 1 ,wherein, in the plan view, ground wiring is provided on the opposite side.3. The physical quantity sensor according to claim 2 ,wherein the ground wiring is provided on the substrate.4. The physical quantity sensor according to claim 1 ,wherein the serial communication wirings include a Master In Slave Out wiring, a Master Out Slave In wiring, and a Serial Clock wiring.5. The physical quantity sensor according to claim 1 ,wherein the serial communication wirings are electrically connected to terminals provided a surface of the substrate opposite the sensor element by way of conductors filling through-holes penetrating through the substrate.6. The physical quantity sensor according to claim 1 ,wherein the sensor element and the semiconductor circuit are connected to each other through flip chip packaging.7. The physical quantity sensor according to claim 1 , further comprising:a ground solid pattern that is separated ...

CONCRETE SENSOR SYSTEM

A mixer vehicle includes a mixer drum, a first acceleration sensor, a second acceleration sensor, and a controller. The first acceleration sensor is configured to produce first acceleration signals and the second acceleration sensor is configured to measure accelerations within the mixer drum to produce second acceleration signals. The controller is configured to receive the first acceleration signals from the first acceleration sensor and second acceleration signals from the second acceleration sensor. The controller is further configured to determine a presence of material within the mixer drum based on the first acceleration signals and the second acceleration signals. The controller is further configured to determine one or more properties of the material within the mixer drum based on the first acceleration signals and the second acceleration signals. 1. A mixer vehicle comprising:a mixer drum;a first acceleration sensor and a second acceleration sensor, wherein the first acceleration sensor is configured to produce first acceleration signals and the second acceleration sensor is configured to measure accelerations within the mixer drum to produce second acceleration signals; and receive the first acceleration signals from the first acceleration sensor and second acceleration signals from the second acceleration sensor;', 'determine a presence of material within the mixer drum based on the first acceleration signals and the second acceleration signals; and', 'determine one or more properties of the material within the mixer drum based on the first acceleration signals and the second acceleration signals., 'a controller configured to2. The mixer vehicle of claim 1 , wherein the one or more properties include a degree of homogeneity of the material claim 1 , a slump of the material claim 1 , and a consistency of the material.3. The mixer vehicle of claim 1 , wherein the controller is further configured to filter the second acceleration signals based on the first ...

RECONFIGURABLE SENSOR UNIT FOR ELECTRONIC DEVICE

An electronic device includes a printed circuit board (PCB) having at least one conductive trace thereon. A system on chip (SoC) is mounted on the PCB and electrically coupled to the conductive trace. A sensor chip is mounted on the PCB in a spaced apart relation with the SoC and electrically coupled to the conductive trace such that the sensor chip and SoC are electrically coupled. The sensor chip includes an accelerometer and/or a gyroscope, and a control circuit. The control circuit is configured to receive configuration data as input, acquire data from the accelerometer and/or the gyroscope. The control circuit is also configured to process the data so as to generate a context of the electronic device relative to its surroundings, the processing being performed in using a processing technique operating in accordance with the configuration data, and output the context. 1. An electronic device , comprising:a printed circuit board (PCB) having at least one conductive trace thereon;a system on chip (SoC) mounted on the PCB and electrically coupled to the at least one conductive trace;a sensor chip mounted on the PCB in a spaced apart relation with the SoC and electrically coupled to the at least one conductive trace such that the sensor chip and SoC are electrically coupled; an accelerometer and/or a gyroscope;', receive configuration data as input,', 'acquire data from the accelerometer and/or the gyroscope,', 'process the data so as to generate a context of the electronic device relative to its surroundings, the processing being performed in using a processing technique operating in accordance with the configuration data, and', 'output the context., 'a control circuit configured to], 'wherein the sensor chip comprises2. The electronic device of claim 1 , further comprising at least one additional sensor; wherein the SoC is configured to acquire additional data from the at least one additional sensor; and wherein the control circuit is further configured to receive ...

Sensor Device for a Vehicle, in Particular a Motor Vehicle

A sensor device for a vehicle, in particular a motor vehicle, includes at least one sensor module and at least one connecting line connected to the sensor module for making electrical contact with the sensor module. The connecting line is formed as a conductor film, on which a plurality of different sensor modules are arranged and are housed by respectively one or a common encapsulation encompassing the conductor film, at least in some sections. 1. A sensor device for a vehicle , comprising:at least one sensor module; andat least one connection line connected to the at least one sensor module and configured to make electrical contact with the sensor module, the at least one connection line configured as a conductor foil,wherein a plurality of different sensor modules of the at least one sensor module are each arranged within and enclosed by one common encapsulation which surrounds the conductor foil at least in sections.2. The sensor device as claimed in claim 1 , wherein a first sensor module of the at least one sensor module includes an acceleration sensor and a second sensor module of the at least one sensor module has a pressure sensor.3. The sensor device as claimed in claim 1 , wherein the common encapsulation includes at least one fastening element configured to fasten the at least one sensor module to a body part of the vehicle.4. The sensor device as claimed in claim 1 , wherein the common encapsulation is configured to be elastically deformable.5. The sensor device as claimed in claim 2 , wherein:the at least one sensor module includes a carrier; andat least one of the acceleration sensor and the pressure sensor is arranged on the carrier.6. The sensor device as claimed in claim 2 , wherein:the first sensor module and the second sensor module include a common carrier; andthe acceleration sensor and the pressure sensor are arranged on the common carrier.7. The sensor device as claimed in claim 5 , wherein the carrier is flexible.8. The sensor device as ...

PHYSICAL QUANTITY SENSOR AND METHOD OF MANUFACTURING PHYSICAL QUANTITY SENSOR

A pressure sensor includes a socket portion and a nut portion which are integrally molded with resin, a screw portion which is tightly fixed to a side wall of an opening in a concave part of the nut portion by adhesive, and a sense element which is fixed to the screw portion and is disposed in the concave part of the nut portion. The socket portion, the nut portion and the screw portion constitute a package. A through hole introducing the pressure measurement target liquid is formed in the screw portion. An external lead-out terminal is fixed to the sense element. The external lead-out terminal passes through the through hole on a base of the concave part of the nut portion, and is tightly fixed to the socket portion with adhesive. The external lead-out terminal is a connection terminal to be connected with external wiring. 1. A physical quantity sensor , comprising:a package including a socket portion, a nut portion, and a screw portion, the screw portion including an introduction hole and a pedestal on one end of the introduction hole; anda sense element disposed on the pedestal so as to block the introduction hole, the sense element being housed in a concave part of the nut portion, whereinthe socket portion and the nut portion are an integrated resin member,the screw portion is a metal member, andan inner side wall of the concave part of the nut portion and a side wall of the pedestal are bonded together with an adhesive.2. The physical quantity sensor according to claim 1 , wherein the sense element includes:an element configured to sense pressure or acceleration;a housing box that houses the element; anda terminal electrically connected with the element and disposed penetrating the housing box.3. The physical quantity sensor according to claim 1 , wherein the side wall of the pedestal has a rough surface.4. The physical quantity sensor according to claim 1 , further comprising a groove on the inner side wall of the concave part of the nut portion.5. The ...

Single Axis Accelerometer with Inertial Threshold

A single axis accelerometer comprising a swing arm pivotally attached to a frame is held in apposition to a stop by a threshold force until an experienced acceleration force greater than the threshold force causes a distal segment of the swing arm to release from the stop and move toward a sensor that is activated by a sensor trigger on the distal segment of the swing arm. 1. A single axis accelerometer comprising:a frame, a swing arm, a sensor, a printed circuit board (PCB), a stop, and a threshold setting device wherein:the swing arm comprises a proximal segment connected to the frame through a pivoting connection allowing the swing arm to swing around a pivot axis and a distal segment comprising a sensor trigger and a threshold engagement element;wherein:the stop is positioned to block the distal segment of the swing arm from swinging in a first direction;the sensor is positioned to be engaged by the sensor trigger when the distal segment of the swing arm swings in a second direction, opposite the first direction;the PCB communicates with the sensor and is configured to convey sensor data from the sensor to a receiving device;the threshold setting device is positioned in apposition to the stop and the threshold engagement element when the distal segment of the swing arm is in contact with the stop;an interaction between the threshold engagement element and the threshold setting device applies a threshold force in the first direction to the distal segment of the swing arm.2. The single axis accelerometer of claim 1 , wherein the threshold engagement device comprises a magnet and the threshold setting device comprises a ferromagnetic material.3. The single axis accelerometer of claim 2 , wherein the magnet is a permanent magnet.4. The single axis accelerometer of claim 2 , wherein the threshold setting device is configured as a screw extending through a threaded hole in the stop and the threshold force may be increased or decreased by turning the screw.5. The ...

Circuit mounting apparatus and method using a segmented lead-frame

A circuit mounting assembly having a segmented lead frame, and an integrated circuit mounted on the segmented lead frame. The segmented lead frame has a main body portion with at least one severable slot and a plurality of connectors extending from the main body portion. Electrical communication between the plurality of connectors and the integrated circuit is controlled by severance of the at least one slot.