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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Поддерживает ввод нескольких поисковых фраз (по одной на строку). При поиске обеспечивает поддержку морфологии русского и английского языка
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Применить Всего найдено 13027. Отображено 100.
05-01-2012 дата публикации

Electrical connecting apparatus and contacts used therefor

Номер: US20120003864A1
Автор: Kenji Sasaki, Satoshi Narita
Принадлежит: Micronics Japan Co Ltd

An electrical connecting apparatus 10 comprises: a base plate 16 provided on its underside 14 with a plurality of pedestals 12 at intervals in a front-back direction; and multiple contact groups, each of which has a first contact 18 and a second contact 19. Each first contact 18 includes a needle body portion 24 having a rear end portion 20 supported on the pedestal 12 and a front end portion 22 which is a free end and extending leftward. Each second contact 19 includes a needle body portion 25 having a rear end portion 21 supported on the pedestal 12 and a front end portion 23 which is a free end and extending rightward. When the first contact 18 is broken, the second contacts 19 can be used.

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Номер записи: 1
02-02-2012 дата публикации

Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies

Номер: US20120023730A1
Автор: Anna Litza, Douglas L. McKay, Erh-Kong Chieh, Fu Chiung Chong, Roman L. Milter, SHA Li, W.R. Bottoms
Принадлежит: Individual

Enhanced microfabricated spring contact structures and associated methods, e.g. such as for electrical contactors and interposers, comprise improvements to spring structures that extend from the substrate surface, and/or improvements to structures on or within the support substrate. Improved spring structures and processes comprise embodiments having selectively formed and etched, coated and/or plated regions, which are optionally further processed through planarization and/or annealment. Enhanced solder connections and associated processes provide a gap between substrates for componentry, and or improved manufacturing techniques using distributed spacers. Enhanced probe card assembly structures and processes provide improved planarization adjustment and thermal stability.

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Номер записи: 2
09-02-2012 дата публикации

In-process electrical connector

Номер: US20120032694A1
Автор: Imran Khan, James Hinkle, Modesto Sanchez, Thomas Truman
Принадлежит: Individual

Characteristics of partially assembled photovoltaic modules can be determined using electrical connection apparatuses and methods.

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Номер записи: 3
08-03-2012 дата публикации

Singulated semiconductor device separable electrical interconnect

Номер: US20120058653A1
Автор: James Rathburn
Принадлежит: HSIO Technologies LLC

A socket assembly that forms a solderless electrical interconnection between terminals on a singulated integrated circuit device and another circuit member. The socket housing has an opening adapted to receive the singulated integrated circuit device. The compliant printed circuit is positioned relative to the socket housing to electrically couple with the terminals on a singulated integrated circuit device located in the opening. The compliant printed circuit includes a dielectric base layer printed onto a surface of a fixture, while leaving cavities in the surface of the fixture exposed. A plurality of contact members are formed in the plurality of cavities in the fixture and coupled to the dielectric base layer. The contact members are exposed wherein the compliant printed circuit is removed from the fixture. At least one dielectric layer with recesses corresponding to a target circuit geometry is printed on the dielectric base layer. A conductive material is deposited in at least a portion of the recesses to form conductive traces electrically coupling the contact members to the other circuit member.

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Номер записи: 4
29-03-2012 дата публикации

Measuring device for electrically measuring a flat measurement structure that can be contacted on one side

Номер: US20120074971A1
Автор: Alexander Krieg, Daniel Biro, Florian Clement, Markus Glatthaar, Michael Menkö, Stefan Rein
Принадлежит: Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV

A measuring device for electrically measuring a measurement structure that can be electrically contacted at one measuring side, in particular an optoelectronic element, such as a solar cell, including at least two contacting units for electrically contacting the measurement structure and at least one support element for supporting the measurement structure with the measuring side on the support element. It is essential that the measuring device includes at least one suction line for the connection to the suction unit and at least one suction opening that is connected in a fluid-conducting manner to the suction line, wherein the suction opening is arranged in and/or on the support element such that the measurement structure can be pressed against the support element by suctioning via the suction opening. When the measurement structure rests on the support element, the contacting unit can be pressed against the measuring side of the measurement structure for the electrical contacting thereof.

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Номер записи: 5
10-05-2012 дата публикации

Socket for a semiconductor device

Номер: US20120115366A1
Автор: Katsumi Suzuki, Takeyuki Suzuki
Принадлежит: Yamaichi Electronics Co Ltd

A device, wherein, at cells 10 ai of a metallic upper housing 10 corresponding to a signal line, between an end portion of an adapter 24 that has electrically insulating properties the inner surface of an upper housing 12 that has electrically insulating properties, an annular air layer Ai is formed at the peripheries of sleeves 20 S of contact terminals 20 ai that have the same structure as each other, and wherein, at the cells 10 ai that correspond to ground lines, contact points 20 CT 2 of the contact terminals 20 ai are inserted in through-holes 12 ai of the lower housing 12, and their contact points 20 CT 1 are inserted into small diameter holes 22 b of conductive collars 22 that touch the inner surfaces of the cells 10 ai.

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Номер записи: 6
07-06-2012 дата публикации

Vertical probe tip rotational scrub and method

Номер: US20120139574A1
Автор: Garry L. Moore, John J. Cassels, Ronald A. Feroli
Принадлежит: International Business Machines Corp

A vertical probe tip rotational scrub and method is described. The vertical probe includes a wafer prober chuck; a wafer positioned on the wafer prober chuck; and at least one probe having a probe tip, the at least one probe tip rotatably mounted such that the probe tip provides a rotational scrub on a surface of a wafer surface. A method for wafer probing is also described, the method includes: determining a vertical location of a wafer surface relative to at least one probe having a probe tip; retracting the probe tip; and imparting an upward motion on the at least one probe in response to the retracting of the probe tip, wherein the upward motion results in a rotational scrub of the wafer surface.

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Номер записи: 7
12-07-2012 дата публикации

Test Contact System For Testing Integrated Circuits With Packages Having An Array Of Signal and Power Contacts

Номер: US20120176151A1
Автор: Brian K. Warwick, Jeffrey C. Sherry, Patrick J. Alladio, Russell F. Oberg
Принадлежит: Johnstech International Corp

A test fixture ( 120 ) is disclosed for electrically testing a device under test ( 130 ) by forming a plurality of temporary mechanical and electrical connections between terminals ( 131 ) on the device under test ( 130 ) and contact pads ( 161 ) on the load board ( 160 ). The test fixture ( 120 ) has a replaceable membrane ( 150 ) that includes vias ( 151 ), with each via ( 151 ) being associated with a terminal ( 131 ) on the device under test ( 130 ) and a contact pad ( 161 ) on the load board ( 160 ). In some cases, each via ( 151 ) has an electrically conducting wall for conducting current between the terminal ( 131 ) and the contact pad ( 161 ). In some cases, each via ( 151 ) includes a spring ( 152 ) that provides a mechanical resisting force to the terminal ( 131 ) when the device under test ( 130 ) is engaged with the test fixture ( 120 ).

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Номер записи: 8
26-07-2012 дата публикации

Wafer level testing structure

Номер: US20120187972A1
Автор: Wen-Tsung Lee
Принадлежит: Chunghwa Precision Test Technology Co Ltd

A wafer level testing structure, disposed between a wafer and a prober, for transmitting the electrical signal of the wafer to the prober, the wafer level testing structure includes: a socket and a probe interface board disposed between the socket and the prober, wherein the probe interface board is electrically coupled to the prober, and a plurality of pogo pins is inserted through the socket, and one end of the plurality of pogo pins is electrically coupled to the wafer, the other end of the plurality of pogo pins is electrically coupled to the probe interface board, thereby the electrical signal of the wafer transmits from the probe interface board to the prober.

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Номер записи: 9
02-08-2012 дата публикации

Probe card wiring structure

Номер: US20120194210A1
Автор: Wensen Hung, Yung-Hsin Kuo
Принадлежит: Taiwan Semiconductor Manufacturing Co TSMC Ltd

The present disclosure provides a probe card for wafer level testing. The probe card includes a space transformer having first power/ground lines and first signal lines embedded therein, wherein the first power/ground and signal lines are configured to have a first wiring pitch on a first surface and a second wiring pitch on a second surface, the second wiring pitch being substantially less than the first wiring pitch; a printed circuit board bonded to the first surface of the space transformer, wherein the printed circuit board includes second power/ground lines and second signal lines embedded in the printed circuit board and coupled to the first power/ground and signal lines; and conductive lines configured to a surface of the printed circuit board remote to the first surface of the space transformer, wherein each of the conductive lines includes a first end coupled to one of the second signal lines and a second end coupled to a different location of the printed circuit board.

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Номер записи: 10
20-09-2012 дата публикации

Wireless probe card verification system and method

Номер: US20120239339A1
Автор: Susumu Kaneko
Принадлежит: Formfactor Inc

A probe card assembly can include a wireless link to an external verifier (e.g., debugger). The wireless link can interface to a boundary scan interface of a controller on the probe card assembly. The wireless link can allow for verification of the probe card assembly while it is installed within a prober.

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Номер записи: 11
27-09-2012 дата публикации

High-frequency coupling testing device by coupling effect

Номер: US20120242360A1
Автор: Chao-Ping Hsieh, Chih-Hao Ho, Keng-Yi HUANG, Wei-Cheng Ku
Принадлежит: MPI Corp

Method for transmitting a high-frequency signal by a coupling effect includes receiving a high-frequency signal by a high-frequency circuit and coupling the high-frequency signal to a coupling circuit by the coupling effect to output a high-frequency coupled signal, and adjusting a filter between the coupling circuit and the high-frequency circuit formed by the coupling effect for adjusting transmission frequency of the high-frequency coupled signal; upon when the high-frequency circuit includes a high-frequency metal probe, the coupling circuit comprises a coupling transmission wire. Meanwhile, upon when the high-frequency circuit includes the coupling transmission wire, the coupling circuit includes the high-frequency metal probe. Further, the filter between the coupling circuit and the high-frequency circuit can be adjusted by changing the number of the coupling metal probes surrounding the high-frequency metal probe, or by changing the distances between the coupling metal probes and the high-frequency metal probes.

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Номер записи: 12
27-09-2012 дата публикации

Non-Linear Vertical Leaf Spring

Номер: US20120242363A1
Автор: Benjamin N. Eldridge, Eric D. Hobbs, John K. Gritters, Keith J. Breinlinger, Michael J. Armstrong
Принадлежит: Formfactor Inc

An electrically conductive contact element can include a first base and a second base with elongate, spaced apart leaves between the bases. A first end of each leaf can be coupled to the first base and an opposite second end of the leaf can be coupled to the second base. A body of the leaf between the first end and the second end can be sufficiently elongate to respond to a force through said contact element substantially parallel with the first axis and the second axis by first compressing axially while said force is less than a buckling force and then bending while said force is greater than the buckling force.

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Номер записи: 13
15-11-2012 дата публикации

3D IC Testing Apparatus

Номер: US20120286814A1
Автор: Chih-Chia Chen, Ching-Nen Peng, Hao Chen, Hung-Chih Lin, Mill-Jer Wang
Принадлежит: Taiwan Semiconductor Manufacturing Co TSMC Ltd

A three dimensional (3D) integrated circuit (IC) testing apparatus comprises a plurality of connection devices. When a device under test (DUT) such as an interposer or a 3D IC formed by a plurality of 3D dies operates in a testing mode, the 3D IC testing apparatus is coupled to the DUT via a variety of interface channels such as probes. The connection devices and a variety of through silicon vias (TSVs) in the DUT form a TSV chain so that a electrical characteristic test of the variety of TSVs can be tested all at once.

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Номер записи: 14
29-11-2012 дата публикации

Positioning and socketing for semiconductor dice

Номер: US20120299609A1
Автор: David Shia, Eric J. M. Moret, Michael L. Rutigliano
Принадлежит: Intel Corp

Devices and methods useful for testing bare and packaged semiconductor dice are provided. As integrated circuit chips become smaller and increasingly complex, the interface presented by a chip for connectivity with power supplies and other components of the system into which it is integrated similarly becomes smaller and more complex. Embodiments of the invention provide micron-scale accuracy alignment capabilities for fine pitch device first level interconnect areas. Embodiments of the invention employ air-bearings to effectuate the movement and alignment of a device under test with a testing interface. Additionally, testing interfaces comprising membranes supported by thermal fluids are provided.

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Номер записи: 15
20-12-2012 дата публикации

Automatic probe configuration station and method therefor

Номер: US20120319713A1
Автор: Alan Cable, Atila Ersahin, Dave Smiley, David Baldwin, Hai Tran, Kaushal Gangakhedkar, Kent Nguyen, Kiran Jitendra, Nile LIGHT, Steve Aochi, Thomas E. Wishard, Thomas H. Bailey, Yan Wang
Принадлежит: Photon Dynamics Inc

A probe system for facilitating the inspection of a device under test. System incorporates a storage rack; a probe bar gantry assembly; a probe assembly configured to electrically mate the device under test; and a robot system for picking the probe assembly from the storage rack and deliver the probe assembly to the probe bar gantry. The robot system is also enabled to pick a probe assembly from the probe bar gantry and deliver the probe assembly to the storage rack. The probe assembly includes a clamping assembly for attaching the probe assembly to the probe bar gantry or the storage rack. The probe assembly may include an array of contact pins configured to mate with conductive pads on the device under test when the probe assembly is installed on the probe bar gantry assembly.

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Номер записи: 16
27-12-2012 дата публикации

Wiring board and method of manufacturing the same

Номер: US20120325529A1
Автор: Akinori Shiraishi, Hideaki Sakaguchi, Mitsutoshi Higashi
Принадлежит: Shinko Electric Industries Co Ltd

A wiring board includes a first substrate portion including a first feed-through conductor portion in a vertical direction, a second substrate portion provided on the first substrate portion and including a second feed-through conductor portion in a vertical direction of a corresponding part to the first feed-through conductor portion, and a feed-through electrode including the first feed-through conductor portion and the second feed-through conductor portion.

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Номер записи: 17
03-01-2013 дата публикации

High Voltage Sensing Mechanism with Integrated On-Off Switch

Номер: US20130002239A1
Автор: Alex K. Choi, David A. Konopka, John G. Konopka
Принадлежит: Synergistic Tech Solutions Inc

The present invention is an efficient high voltage sensing mechanism that operates only when an individual needs to test the voltage across a wire. The present invention attaches around a tested wire using a jaw and a hook. The hook is tensioned using an expansion spring. The operator propels the hook outwards from the jaw, around the tested wire; thereafter, the expansion spring retracts to latch onto the tested wire against the jaw. An on-off switch is integrated into the mechanical hook device. As the hook is propelled outwards, the on-off switch moves into the “on” position, which powers the electrical processing and voltage analysis equipment. Once the hook is returned to the initial position, the on-off switch moves to the “off” position. This arrangement allows the present invention to remain unpowered for any instance a wire is not being tested. The present invention detects voltage through capacitive coupling.

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Номер записи: 18
10-01-2013 дата публикации

Probe card and method for testing magnetic sensors

Номер: US20130009659A1
Автор: Lianjun Liu, Phillip MATHER
Принадлежит: Everspin Technologies Inc

A probe card and method are provided for testing magnetic sensors at the wafer level. The probe card has one or more probe tips having a first pair of solenoid coils in parallel configuration on first opposed sides of each probe tip to supply a magnetic field in a first (X) direction, a second pair of solenoid coils in parallel configuration on second opposed sides of each probe tip to supply a magnetic field in a second (Y) direction orthogonal to the first direction, and an optional third solenoid coil enclosing or inscribing the first and second pair to supply a magnetic field in a third direction (Z) orthogonal to both the first and second directions. The first pair, second pair, and third coil are each symmetrical with a point on the probe tip array, the point being aligned with and positioned close to a magnetic sensor during test.

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Номер записи: 19
24-01-2013 дата публикации

Wafer prober integrated with full-wafer contacter

Номер: US20130021052A1
Автор: Morgan T. Johnson
Принадлежит: Advanced Inquiry Systems Inc

Methods and apparatus for testing unsingulated integrated circuits on a wafer include adapting a wafer prober for use with full-wafer-contacter disposed on the wafer. Some embodiments include placing wafer on a chuck of the prober, aligning the wafer to a full-wafer contacter incorporated in the wafer prober, removably attaching the wafer to the full wafer contacter, separating the wafer from the chuck, and making electrical contact to one or more integrated circuits of the wafer by making physical contact with a surface of the full-wafer contacter that faces away from the wafer.

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Номер записи: 20
07-02-2013 дата публикации

Probing device

Номер: US20130033283A1
Автор: Chien-Chou Wu, Chung-Che LI, Ming-Chi Chen
Принадлежит: MPI Corp

A probing device includes a circuit board, a reinforcing plate, at least one space transformer and at least one probe assembly. The reinforcing plate is disposed on the circuit board, and the reinforcing plate has a plurality of inner conductive wires electrically connecting to those of the circuit board. The reinforcing plate defines a plurality of receiving space therein. The space transformer is disposed on the reinforcing plate, and the space transformer has a plurality of inner conductive wires electrically connecting to those of the reinforcing plate via a plurality of first solder balls. The probe assembly is disposed on the space transformer, and the probe assembly includes a plurality of probes. The first solder balls are disposed in the receiving spaces, and the reinforcing plate abuts against the space transformer.

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Номер записи: 21
14-02-2013 дата публикации

Probe Calibration Device and Calibration Method

Номер: US20130038336A1
Автор: Chao-Hsien Wu, Chia-Chun Sun, Chien-Li Kuo, Jie-Wei Sun, Yun-San Huang
Принадлежит: United Microelectronics Corp

A calibration device applied for a test apparatus with at least a first probe and a second probe, the calibration device comprising: a first testing region and a second testing region, the first testing region and the second testing region divides into n×n sensing units respectively, the first testing region for generating n×n average electricity corresponding to a contact degree of the first probe contacted with the calibration device, and the second testing region for generating another n×n average electricity corresponding to a contact degree of the second probe contacted with the calibration device, and the pitch is the distance between the center of the first testing region to the center of the second testing region that is the same as that of the center of the first probe to the center of the second probe.

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Номер записи: 22
07-03-2013 дата публикации

Connection terminal and connection jig

Номер: US20130057308A1
Автор: Akihiro Yano, Masami Yamamoto, Norihiro Ohta, Satoshi Furukawa, Yusuke Yokota
Принадлежит: Nidec Read Corp

Provided is a connection terminal that maintains an approximately circular shape before or after a cylindrical part is fixed by resistance welding. The connection terminal used for a connection jig interconnecting target points includes a small-diameter conductive part and a large-diameter cylindrical part disposed to surround the small-diameter conductive part. The small-diameter conductive part has a front end protruding from a front end of the large-diameter cylindrical part. A part of the small-diameter conductive part is joined to a part of the large-diameter cylindrical part. A cutout part is formed in a part of a strip portion around an axis of the cylindrical part that at least includes the portion of the large-diameter cylindrical part which is joined to the small-diameter conductive part.

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Номер записи: 23
21-03-2013 дата публикации

Indirect non-contact high voltage measurement on electrical power line

Номер: US20130069664A1
Автор: Vasu MOGAVEERA
Принадлежит: Honeywell International Inc

A non-contact electrical power line voltage measurement device comprises a probe including an insulated shield supporting an electrode to sense electrostatically induced voltage from the power line. The shield houses a high voltage resistor connected in series with the electrode. A meter comprises a housing operatively associated with the shield and enclosing a measurement circuit electrically connected to the high voltage resistor for measuring induced electrode voltage. A calibration circuit correlates measured electrode voltage to power line voltage. A display is driven by the measurement circuit for displaying actual power line voltage responsive to the electrode being a select distance from the power line.

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Номер записи: 24
11-04-2013 дата публикации

Probe card and manufacturing method thereof

Номер: US20130088251A1
Автор: Dae Hyeong Lee, Ki Pyo Hong, Won Chul Ma, Yong Seok Choi
Принадлежит: Samsung Electro Mechanics Co Ltd

There are provided a probe substrate and a manufacturing method thereof that may prevent an electrode pad bonded with a probe pin from being released from the probe substrate. The probe card includes: a ceramic substrate having at least one electrode pad on one surface thereof; and a probe pin bonded to the electrode pad, and the electrode pad has a larger dimension than a bonding surface of the probe pin.

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Номер записи: 25
18-04-2013 дата публикации

VERTICAL PROBE ARRAY ARRANGED TO PROVIDE SPACE TRANSFORMATION

Номер: US20130093450A1
Автор: Kister January
Принадлежит: FORMFACTOR, INC.

Improved probing of closely spaced contact pads is provided by an array of vertical probes having all of the probe tips aligned along a single contact line, while the probe bases are arranged in an array having two or more rows parallel to the contact line. With this arrangement of probes, the probe base thickness can be made greater than the contact pad spacing along the contact line, thereby advantageously increasing the lateral stiffness of the probes. The probe tip thickness is less than the contact pad spacing, so probes suitable for practicing the invention have a wide base section and a narrow tip section. 1a plurality of probes, each probe comprising a base section and a tip section;said adjacent tip sections of said probes comprising a first center to center spacing;said adjacent base sections of said probes in each said row comprising a second center to center spacing; andsaid base sections comprising thicknesses greater than said center to center spacing of said adjacent tip sections.. A probe array comprising: This application is a continuation application of U.S. patent application Ser. No. 13/118,952 (now U.S. Pat. No. 8,324,923), entitled “Vertical Probe Array Arranged to Provide Space Transformation”, to January Kister, filed May 31, 2011, which is a continuation application of U.S. patent application Ser. No. 12/419,912 (now U.S. Pat. No. 7,952,377), entitled “Vertical Probe Array Arranged to Provide Space Transformation”, to January Kister, filed Apr. 7, 2009, which is a continuation application of U.S. patent application Ser. No. 11/786,107 (now U.S. Pat. No. 7,514,948) entitled “Vertical Probe Array Arranged to Provide Space Transformation”, to January Kister, filed on Apr. 10, 2007, and the specifications and claims of all the applications listed above are incorporated herein by reference.1. Field of the Invention (Technical Field)This invention relates to probe arrays for testing integrated electrical circuits.2. Description of Related ...

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Номер записи: 26
02-05-2013 дата публикации

Jig for use in semiconductor test and method of measuring breakdown voltage by using the jig

Номер: US20130106453A1
Автор: Masaaki Ikegami
Принадлежит: Mitsubishi Electric Corp

A jig for use in a semiconductor test of the present invention includes; a base on which a probe pin and an insulating material are provided such that the probe pin is surrounded by the insulating material in plan view; and a stage arranged to face a surface of the base on which the probe pin and the insulating material are provided. The stage is capable of receiving a test object placed on a surface facing the base. When the test object is placed on the stage and the base and the stage move in a direction in which they get closer to each other, the probe pin comes into contact with an electrode formed on the test object, and the insulating material comes into contact with both the test object and the stage.

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Номер записи: 27
30-05-2013 дата публикации

Hybrid Electrical Contactor

Номер: US20130135001A1
Автор: Keith J. Breinlinger
Принадлежит: Formfactor Inc

An electrical connection between an electrically conductive probe on one device and a compliant pad on another device can be formed by piercing the compliant pad with the probe. The probe can contact multiple electrically conductive elements inside the pad and thereby electrically connect to the pad at multiple locations inside the pad.

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Номер записи: 28
13-06-2013 дата публикации

Vertical probe assembly with air channel

Номер: US20130147502A1
Автор: Daniel J. Murphy, David L. Gardell, David M. Audette, Dustin M. Fregeau, Grant Wagner
Принадлежит: International Business Machines Corp

A vertical probe assembly includes an upper die; a lower die; a plurality of probes, the probes comprising an electrically conductive material, wherein the probes extend from the upper die through the lower die; and an air channel located between the upper die and the lower die, such that airflow through the air channel passes through the plurality of probes.

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Номер записи: 29
20-06-2013 дата публикации

PROBE ASSEMBLY, PROBE CARD INCLUDING THE SAME, AND METHODS FOR MANUFACTURING THESE

Номер: US20130154682A1
Автор: NARITA Satoshi, SASAKI Kenji
Принадлежит: KABUSHIKI KAISHA NIHON MICRONICS

Quality of connection portions between respective probes and respective wires in a probe assembly is improved. Also, time required for work for connection between the probes and the wires is shortened. Further, improper connection between the probes and the wires is eliminated. A probe assembly includes an electric insulating substrate, a plurality of probes supported on one surface of the substrate, a plurality of through holes provided in the substrate to respectively correspond to the plurality of probes and filled with a conductive material attached to the respective probes, and a plurality of conductive membranes formed on the other surface of the substrate and respectively attached to the conductive material in the plurality of through holes. 1. A probe assembly comprising:an electric insulating substrate having two surfaces opposed to each other;a plurality of probes supported on one surface of the substrate;a plurality of through holes provided in the substrate to respectively correspond to the plurality of probes and filled with a conductive material attached to the respective probes; anda plurality of conductive membranes formed on the other surface of the substrate and respectively attached to the conductive material in the plurality of through holes.2. A probe card comprising:a base plate; and{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'the probe assembly according to attached to the base plate,'}wherein the probe assembly is arranged so that the other surface of a substrate thereof may be opposed to the base plate and so that a plurality of conductive membranes thereof may contact a plurality of lands formed on the base plate, respectively.3. The probe card according to claim 2 , wherein the probe assembly is fixed on the base plate via a presser tool at the substrate thereof and is fixed on the base plate via a platform arranged between the substrate and the base plate.4. A probe assembly comprising:an electric insulating first substrate having ...

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Номер записи: 30
20-06-2013 дата публикации

Methods and apparatus for three-dimensional microfabricated arrays

Номер: US20130157498A1
Автор: Boyden Edward, Fonstad Clifton, Scholvin Jorg, Zorzos Anthony
Принадлежит: Massachusetts Institute of Technology

In exemplary implementations of this invention, electrical connections are fabricated between two orthogonal surfaces by electroplating. The two surfaces are separated (except for the electrical connections) by a gap of not more than 100 micrometers. Multiple electrical connections may be fabricated across the gap. In preparatory steps, conductive pads on the two surfaces may be separately electroplated to build up “bumps” that make it easier to bridge the remainder of the gap in a final plating step. Alternately, electroless deposition may be used instead of electroplating. In exemplary implementations, a 3D probe array may be assembled by inserting array structures into an orthogonal base plate. The array structures may be aligned and held in place, relative to the base plate, by mechanical means, including side hooks, stabilizers, bottom hooks, alignment parts and a back plate. 1. A method comprising fabrication of at least one electrical connection between a first surface and a second surface by electrical deposition , wherein:the first and second surfaces are separated, except for the at least one electrical connection, by a gap of not more than 100 micrometers; andthe first and second surfaces are off angle with respect to each other.2. The method of claim 1 , wherein the electrical deposition comprises electroplating.3. The method of claim 1 , wherein the electrical deposition comprises electroless deposition.4. The method of claim 1 , wherein the at least one electrical connection comprises multiple electrical connections claim 1 , and the pitch between at least some of the multiple electrical connections is less than 50 micrometers.5. The method of claim 4 , wherein the pitch between at least some of the multiple electrical connections is less than 40 micrometers.6. The method of claim 5 , wherein the pitch between at least some of the multiple electrical connections is less than 30 micrometers.7. The method of claim 1 , wherein the method further comprises ...

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Номер записи: 31
27-06-2013 дата публикации

Uniform field area testing apparatus and testing method using same

Номер: US20130162277A1
Автор: xiao-lian He
Принадлежит: Hon Hai Precision Industry Co Ltd, Hongfujin Precision Industry Shenzhen Co Ltd

A uniform field area (UFA) testing apparatus, used for an UFA test, including a testing rack and a plurality of field strength probes. The plurality of field strength probes are mounted on the testing rack. The plurality of field strength probes are positioned on a vertical plane and forms a probe grid array corresponding to the testing points of the UFA test, the grid spacing of the probe grid array corresponds to the distance of the neighboring testing points of the UFA test.

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Номер записи: 32
04-07-2013 дата публикации

Wiring board and probe card using the same

Номер: US20130169305A1
Автор: Kenji Terada, TAKAYUKI Taguchi
Принадлежит: Kyocera SLC Technologies Corp

A wiring board 3 according to the present invention includes a first resin layer 18 a formed of a thermoplastic resin; a conductive layer 16 formed partially on the first resin layer 18 a ; a through hole P for insertion of a screw formed in a region where the conductive layer 16 is not formed and penetrating through the first resin layer 18 a in a thickness direction thereof; and a dummy via hole D formed in a region between the through hole P and the conductive layer 16 and penetrating through the first resin layer 18 a.

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Номер записи: 33
08-08-2013 дата публикации

Methods and Systems for Cleaning Needles of a Probe Card

Номер: US20130200914A1
Автор: Hwang In-Seok, KANG Sang-Boo, KIM Do-Yun
Принадлежит: SAMSUNG ELECTRONICS CO., LTD.

A method of cleaning needles of a probe card in a test system includes mounting the probe card, which has a plurality of device under tests (DUTs) and needles, in a card mounting part. The DUTs and needles are scanned using a camera positioned in the test system to provide a scan result. A laser beam is focused on at least one of the needles based on the scan result and the laser beam is irradiated on the at least one of the needles to clean the at least one of the needles. 1. A method of cleaning needles of a probe card in a test system , the method comprising:mounting the probe card having a plurality of device under tests (DUTs) and needles in a card mounting part;scanning the DUTs and needles using a camera positioned in the test system to provide a scan result;focusing a laser beam on at least one of the needles based on the scan result; andirradiating the laser beam on the at least one of the needles to clean the at least one of the needles.2. The method of claim 1 , wherein the laser beam comprises a plurality of laser beams and the at least one needle comprises a plurality of needles and wherein focusing the laser beams comprises comparing the scan result with a stored image corresponding a case where the laser beams are focused on the needles and moving the laser beams or the probe card to focus the laser beams on the needles based on the comparison of the scan result and the stored image.3. The method of claim 2 , wherein irradiating the laser beams is followed by scanning the cleaned needles using the camera to provide a cleaning result image.4. The method of claim 3 , wherein scanning the cleaned needles is followed by:identifying ones of the needles that are not yet clean based on the cleaning result image; andrepeating focusing the laser beams and irradiating the laser beams to clean the identified ones of the needles that are not yet cleaned.5. The method of claim 4 , wherein identifying ones of the needles includes displaying the cleaning result ...

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Номер записи: 34
15-08-2013 дата публикации

DEVICE FOR THE ELECTROMAGNETIC TESTING OF AN OBJECT

Номер: US20130207680A1
Автор: Duchesne Luc, Durand Ludovic, Garreau Philippe, Laporte Raphaël
Принадлежит: SATIMO INDUSTRIES

The invention relates to a device for the electromagnetic testing of an object, comprising a network of electromagnetic probes (), a structure () for supporting the network of probes () and a support () for supporting the object being tested. According to the invention, the structure () is closed in the three dimensions of space all around the support () for the object being tested by at least one conductive wall () forming a Faraday cage which is fitted on its inner side by anechoic electromagnetic absorbers () located in the intervals between the probes (). 123254. A device for the electromagnetic testing of at least one object , the device comprising a network of electromagnetic probes () for transmission and/or for reception of electromagnetic radiations towards or from the object being tested , the device also comprising a support structure () for supporting the network of probes () , comprising anechoic electromagnetic absorbers () , and a support () for supporting the object being tested ,characterised in that{'b': 3', '2', '4', '31', '5', '51', '2, 'the support structure () for supporting the network of probes () is closed in the three dimensions of space all around the support () for the object being tested by at least one conductive wall () forming a Faraday cage which is fitted on its inner side by anechoic electromagnetic absorbers (, ) located in the intervals between the probes ().'}231. The device according to claim 1 , characterised in that the conductive wall () is curved or is facetted.33. The device according to claim 1 , characterised in that the support structure () has a general spherical shape.43302315302. The device according to any one of the preceding claims claim 1 , characterised in that the support structure () comprises at least one upright () to which are fixed the probes () and the at least one conductive wall () claim 1 , wherein anechoic electromagnetic absorbers () are also provided on the inner side of the uprights () in the ...

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Номер записи: 35
15-08-2013 дата публикации

ELECTRICAL CONNECTING APPARATUS AND METHOD FOR ASSEMBLING THE SAME

Номер: US20130207683A1
Автор: TANAKA Kentaro
Принадлежит: KABUSHIKI KAISHA NIHON MICRONICS

An electrical connecting apparatus includes a wiring base plate having a first surface coupled with a reinforcing plate and provided on an opposite surface with first electrical connection portions, a probe base plate provided on a first surface with second electrical connection portions corresponding to the first electrical connection portions and provided on a second surface with probes electrically connected to the second electrical connection portions, anchor portions formed on the first surface of the probe base plate and provided with screw holes, cylindrical spacers having first ends removably coupled with the anchor portions, having screw grooves, and passing through the wiring base plate and the reinforcing plate, reference plates having reference planes to receive the spacers and removably coupled with the reinforcing plate, shims inserted between the respective reference plates and the reinforcing plate, and bolt screwed in the screw groove of the spacer. 1. An electrical connecting apparatus comprising:a reinforcing plate having a first surface and a second surface opposed to each other;a wiring base plate having a first surface, a second surface and a plurality of first electrical connection portions provided on the second surface of the wiring base plate, said wiring base plate being coupled with the reinforcing plate so that the first surface of the wiring base plate abuts on the first surface of the reinforcing plate;a probe base plate having a first surface opposed to the second surface of the wiring base plate, a second surface, second electrical connection portions and multiple probes, the second electrical connection portion being provided on the first surface of the probe base plate and corresponding to the first electrical connection portions, the multiple probes, respectively, being electrically connected to the second electrical connection portions;a plurality of anchor portions respectively formed in an area of the first surface of the probe ...

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Номер записи: 36
29-08-2013 дата публикации

Replaceable coupon for a probing apparatus

Номер: US20130220513A1
Автор: Kenneth R. Smith
Принадлежит: CASCADE MICROTECH INC

The contacts of a probing apparatus are elastically supported on a replaceable coupon and electrically interconnected with conductors on a membrane or a space transformer.

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Номер записи: 37
29-08-2013 дата публикации

WIRING BOARD AND PROBE CARD USING THE SAME

Номер: US20130222003A1
Автор: TAGUCHI Takayuki, TERADA Kenji
Принадлежит: KYOCERA SLC TECHNOLOGIES CORPORATION

A wiring board and a probe card using the wiring board which respond to a demand for improving electrical reliability. 1. A wiring board comprising:a core substrate; anda buildup layer formed on the core substrate, a plurality of resin layers laminated on the core substrate;', 'a plurality of pads formed on a topmost layer of the resin layers and to which a plurality of probes are respectively connected;', 'a plurality of wiring conductors formed on either the resin layers or the core substrate and electrically connecting the plurality of pads individually to an external circuit;', 'a via conductor penetrating through the resin layer in a thickness direction thereof and electrically connecting the pad and the wiring conductor together; and', 'a dummy via conductor penetrating through the resin layer in the thickness direction thereof without electrically connecting the pad and the wiring conductor together,, 'wherein the buildup layer includeswherein the via conductor and the dummy via conductor are arranged immediately below each of the pads,the pads include a first pad with at least one of the dummy via conductors arranged immediately therebelow, and a second pad with only the via conductor arranged immediately therebelow, andwherein a total amount of the dummy via conductors and a quantity of the via conductors formed immediately below the first pad is equal to an amount of the via conductors formed immediately below the second pad.2. The wiring board according to claim 1 ,wherein the plurality of wiring conductors include a first wiring conductor electrically connected to the first pad, and a second wiring conductor positioned in a layer different from a layer in which the first wiring conductor is positioned and electrically connected to the second pad.3. The wiring board according to claim 1 ,wherein the first dummy via conductor and the first via conductor formed immediately below the first pad are distanced away from each other with the resin layer ...

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Номер записи: 38
12-09-2013 дата публикации

Probe assembly

Номер: US20130233099A1
Автор: Gunsei Kimoto
Принадлежит: Individual

Provided is a probe assembly that can be used for fine-pitch pads and can be made with lower cost. The probe assembly includes: a vertical probe which is formed by etching metal foil, and touches a to-be-inspected semiconductor chip electrode; an output terminal which projects from a side opposite to the side of the vertical probe and touches a wiring board; a thin plate-shaped probe which has a substantially rectangular cross section at a part thereof and includes an opening which engages a support rod; and a support rod which includes a first guide groove which guides the opening, a second guide groove which guides the vertical probe, and a third guide groove which guides the output terminal.

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Номер записи: 39
12-09-2013 дата публикации

SHIELDED PROBE ARRAY

Номер: US20130234746A1
Автор: NAMBURI Lakshmikanth
Принадлежит: ADVANTEST CORPORATION

Shielded probe array. In accordance with a first embodiment, an article of manufacture includes a plurality of rows of electronic probes. Each row of probes is substantially in a plane. Each probe includes a metal signal layer and a ground layer, separated by an insulator. The article of manufacture also includes a space transformer for mechanically supporting the plurality of rows of electronic probes. The space transformer also provides an electrical path from each of the probe metal signal layers and the probe ground layers to a higher level electronic assembly. Each of the plurality of rows of electronic probes may include a handle including a substrate for handling the row of electronic probes. 1. An article of manufacture comprising: 'a metal signal layer and a ground layer, separated by an insulator;', 'a plurality of said electronic probes substantially in a plane, each said electronic probe comprising, 'a plurality of rows of electronic probes, each said row comprisinga space transformer for mechanically supporting said plurality of rows of electronic probes; andsaid space transformer also for providing an electrical path from each of said probe metal signal layers and said probe ground layer to a higher level electronic assembly.2. The article of manufacture of wherein each of said plurality of rows of electronic probes further comprises a handle comprising a substrate for handling said row of electronic probes.3. The article of manufacture of wherein said handle is configured for a die stacking apparatus to grasp and manipulate said row of electronic probes.4. The article of manufacture of wherein each said electronic probe further comprises a probe tip configured for contacting a test point of an integrated circuit.5. The article of manufacture of wherein said probe tip extends beyond a projection of said metal signal layer.6. The article of manufacture of wherein said rows of electronic probes are characterized as having a probe pitch claim 1 , and said ...

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Номер записи: 40
12-09-2013 дата публикации

FINE PITCH PROBE ARRAY FROM BULK MATERIAL

Номер: US20130234747A1
Автор: NAMBURI Lakshmikanth
Принадлежит: ADVANTEST CORPORATION

Fine pitch probe array from bulk material. In accordance with a first method embodiment, an article of manufacture includes an array of probes. Each probe includes a probe tip, suitable for contacting an integrated circuit test point. Each probe tip is mounted on a probe finger structure. All of the probe finger structures of the array have the same material grain structure. The probe fingers may have a non-linear profile and/or be configured to act as a spring. 1. An article of manufacture comprising: a probe tip, suitable for contacting an integrated circuit test point;', 'said probe tip mounted on a probe finger structure,, 'an array of probes, wherein each probe compriseswherein all said probe finger structures of said array have the same material grain structure.2. The article of manufacture of wherein said probe finger structure has a non-linear profile.3. The article of manufacture of wherein said probe finger structure is configured to act as a spring.4. The article of manufacture of further comprising a conductive metal coating on said probe finger structure claim 1 , wherein said coating is in electrical contact with said probe tip claim 1 ,5. The article of manufacture of wherein said probe tip comprises a noble metal excluding gold.6. The article of manufacture of wherein said probe tips of said array of probes are arranged on a grid of less than 50 μm.7. The article of manufacture of wherein said array of probes is functionally coupled to a space transforming substrate claim 1 , for transforming a pitch of said array of probes to a larger pitch.8. A method comprising:accessing a bulk material with first and second substantially parallel faces;forming a probe base on said first face;forming a probe tip suitable for contacting an integrated circuit test point on said probe base;mounting said second face to a carrier wafer;removing portions of said bulk material to form a probe finger structure coupled to said probe base and said probe tip; andcoating said ...

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Номер записи: 41
12-09-2013 дата публикации

TRANSFERRING ELECTRONIC PROBE ASSEMBLIES TO SPACE TRANSFORMERS

Номер: US20130234748A1
Автор: CROS Florent, NAMBURI Lakshmikanth
Принадлежит: ADVANTEST CORPORATION

Transferring electronic probe assemblies to space transformers. In accordance with a first method embodiment, a plurality of probes is formed in a sacrificial material on a sacrificial substrate via microelectromechanical systems (MEMS) processes. The tips of the plurality of probes are formed adjacent to the sacrificial substrate and the remaining structure of the plurality of probes extends outward from the sacrificial substrate. The sacrificial material comprising the plurality of probes is attached to a space transformer. The space transformer includes a plurality of contacts on one surface for contacting the plurality of probes at a probe pitch and a corresponding second plurality of contacts on another surface at a second pitch, larger than the probe pitch, wherein each of the second plurality of contacts is electrically coupled to a corresponding one of the plurality of probes. The sacrificial substrate is removed, and the sacrificial material is removed, leaving the plurality of probes intact. 1. A method comprising:forming a plurality of probes in a sacrificial material on a sacrificial substrate via microelectromechanical systems (MEMS) processes,wherein tips of said plurality of probes are formed adjacent to said sacrificial substrate and the remaining structure of said plurality of probes extends outward from said sacrificial substrate;attaching said sacrificial material comprising said plurality of probes to a space transformer,wherein said space transformer comprises a plurality of contacts on one surface for contacting said plurality of probes at a probe pitch and a corresponding second plurality of contacts on another surface at a second pitch, larger than said probe pitch, wherein each of said second plurality of contacts is electrically coupled to a corresponding one of said plurality of probes;removing said sacrificial substrate; andremoving said sacrificial material, while leaving said plurality of probes intact.2. The method of wherein said ...

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Номер записи: 42
19-09-2013 дата публикации

CONDUCTIVE FILM STRUCTURE AND CONDUCTIVE FILM TYPE PROBE DEVICE FOR ICS

Номер: US20130241590A1
Автор: Chou Min-Chieh, Kao Tune-Hune, Tsai Jen-Hui
Принадлежит: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

A method for forming a conductive film structure is provided, which includes: providing an insulating substrate having a surface; forming a plurality of trenches in the surface of the insulating substrate, wherein the trenches are extended substantially parallel to each other; disposing the insulating substrate into a plating solution and plating conducting layers within the trenches to form a plurality of micro-wires; and stacking a plurality of the insulating substrates or winding or folding the insulating substrate along an axis substantially parallel to an extended direction of the micro-wires to form a conducting lump. 1. A conductive film structure , comprising:an insulating bulk having a first surface and an opposite second surface;at least a bonding interface located in the insulating bulk and extending from the first surface to the second surface; anda plurality of micro-wires located in the insulating bulk,wherein extended directions of the micro-wires are substantially parallel to a normal vector of the first surface or the second surface,the micro-wires are disposed substantially along the bonding interface, anda surface of each of the micro-wires is coplanar with the bonding surface.2. The conductive film structure as claimed in claim 1 , wherein the micro-wires comprise copper claim 1 , nickel claim 1 , cobalt claim 1 , gold claim 1 , tin claim 1 , silver claim 1 , lead claim 1 , or alloys thereof.3. The conductive film structure as claimed in claim 1 , wherein the bonding interface comprises a spiroid interface or a folding interface.4. The conductive film structure as claimed in claim 1 , wherein the bonding interfaces are a plurality of planes parallel to each other.5. The conductive film structure as claimed in claim 1 , wherein cross-sectional areas of the micro-wires comprise shapes of a square claim 1 , rectangle claim 1 , half-circle claim 1 , half-ellipse claim 1 , trapezium claim 1 , or polygon.6. A conductive film type probe device for IC ...

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Номер записи: 43
26-09-2013 дата публикации

Multifunction Test Instrument Probe

Номер: US20130249533A1
Автор: Chait Paul Nicholas, Chait Stanley
Принадлежит:

A multifunction test instrument probe includes a housing having a hollow bore with an open end. A clamp plunger is carried in the hollow bore, with a first end including a thumb press, and a second end including an alligator clamp having a pair of jaws, with a compression spring normally biasing the thumb press away from the housing, and normally biasing the alligator clamp substantially within the hollow bore proximate the open end. A point plunger is also carried in the bore, with a first end including a thumb press, and a second end terminating in a point, with a second compression spring normally biasing the thumb press away from the housing, and biasing the point within the hollow bore proximate the open end. When the clamp plunger is depressed, the alligator clamp is extended from the open end and the jaws are urged open by a jaw spring, and when the clamp plunger is released, the compression spring acts to retract the alligator clamp back towards the hollow bore and the jaws are urged closed by contact with the open end. When the point plunger is depressed, the point is extended from the open end. When the clamp plunger is again depressed, the point retracts into the housing. 1. A multifunction test instrument probe comprising:a housing having a hollow bore with an open end;a first plunger carried in said hollow bore, said first plunger having a first end including a thumb press portion, a second end terminating in an alligator clamp having a pair of jaws, and a first plunger compression spring normally biasing said first end thumb press away from said housing, and normally biasing said alligator clamp substantially within said hollow bore proximate said open end;a second plunger carried in said hollow bore, said second plunger having a first end including a thumb press portion, a second end terminating in a point, and a second plunger compression spring normally biasing said first end thumb press away from said housing, and biasing said point within said ...

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Номер записи: 44
26-09-2013 дата публикации

PROBE CARD

Номер: US20130249585A1
Автор: Kinuta Seichin
Принадлежит: OPTNICS PRECISION CO., LTD.

To provide a probe card that is used when carrying out electrical inspection of a high-density fine circuit board to be measured. 1. A probe card comprising: a plurality of probe pins that are elastic and that have one end portions that electrically contact electrodes of a fine circuit board to be measured , and other end portions that electrically contact electrodes of a wiring board for signal input/output; an insulator that has a plurality of through-holes through which the probe pins pass respectively; and one substrate and another substrate that are positioned at both sides of the insulator , the one substrate having supporting holes into which the one end portions of the probe pins are inserted , and the other substrate having supporting holes into which the other end portions of the probe pins are inserted ,wherein the pair of substrates, that are formed from the one substrate and the other substrate, are provided so as to be able to slide with the insulator, the one substrate is formed of a material having a same value as or an approximate value of a coefficient of thermal expansion of the fine circuit board to be measured, and the other substrate is formed of a material having a same value as or an approximate value of a coefficient of thermal expansion of the wiring board for signal input/output.2. The probe card of claim 1 , wherein the pair of substrates are formed of materials whose amounts of expansion/contraction claim 1 , by which the substrates expand/contract accompanying a change in humidity claim 1 , are the same.3. The probe card of claim 1 , wherein the pair of substrates are formed of a nonconductor that is any of silicon claim 1 , silicon oxide claim 1 , silicon carbide claim 1 , or sapphire.4. The probe card of or claim 1 , wherein the pair of substrates are formed of a nonconductor that is any of glass epoxy claim 1 , polyimide claim 1 , polypropylene claim 1 , polyethylene claim 1 , or polytetrafluoroethylene.5. The probe card of claim 1 , ...

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Номер записи: 45
26-09-2013 дата публикации

WAFER INSPECTION INTERFACE AND WAFER INSPECTION APPARATUS

Номер: US20130249587A1
Автор: YAMADA Hiroshi
Принадлежит: TOKYO ELECTRON LIMITED

A wafer inspection interface includes a probe card having a substrate and a multiple number of probes that are provided at a surface of the substrate facing a wafer W and arranged to correspond to electrodes of a plurality of semiconductor devices formed on the wafer W; a pogo frame that is in contact with a surface of the probe card opposite to a surface of the probe card facing the wafer W and supports the probe card ; and a shim provided on the surface of the probe card in contact with the pogo frame and configured to adjust a thickness of the probe card . The shim has a cross shape when viewed from the top. 1. A wafer inspection interface comprising:a probe card including a substrate and a multiple number of probes that are provided at a surface of the substrate facing a wafer and arranged to correspond to electrodes of a plurality of semiconductor devices formed on the wafer;a frame that is in contact with a surface of the probe card opposite to a surface of the probe card facing the wafer and supports the probe card; anda spacer provided on the surface of the probe card in contact with the frame and configured to adjust a thickness of the probe card.2. The wafer inspection interface of claim 1 ,wherein the spacer is configured to improve smoothness of the surface of the probe card facing the wafer.3. The wafer inspection interface of claim 2 ,wherein the surface of the probe card facing the wafer is a surface formed by front ends of the multiple number of probes.4. The wafer inspection interface of claim 1 ,wherein the probes of the probe card are divided into a plurality of probe groups corresponding to multiple semiconductor devices formed on the wafer, andthe spacer is provided at a gap between the probe groups.5. The wafer inspection interface of claim 4 ,wherein the probe groups are arranged in a grid shape, and the spacer is provided at an edge of the gap between the probe groups.6. The wafer inspection interface of claim 5 ,wherein the spacer has a ...

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Номер записи: 46
03-10-2013 дата публикации

System and method to provide talking feature and interactive voice menu in phasing meters

Номер: US20130257414A1
Автор: Adishesha Cs, Edukondalu Yarlagadda, Michael D. Berg
Принадлежит: Honeywell International Inc

A high voltage detection device comprises a probe comprising an electrode for sensing a high voltage electrical line. The electrode is connected in series with a resistor. A meter comprises a housing enclosing a control for measuring parameters of line voltage. The control comprises an input module for connection to the probe to develop a voltage signal. A signal processing module receives the voltage signal and determines parameters of line voltage and drives an audio module. The audio module provides an audio output representing the determined parameters of line voltage.

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Номер записи: 47
10-10-2013 дата публикации

Probe Card And Manufacturing Method Therefor

Номер: US20130265073A1
Автор: Matsuda Kazuhiro, Nakano Hirofumi, Uemura Taishi
Принадлежит: Japan Electronic Materials Corporation

The present invention provides a ST board that is formed with an lower surface electrode ; a unit attachment plate that is fastened on the ST board and formed with an opening part exposing the lower surface electrode ; a probe unit that includes a probe substrate formed with a contact probe and a probe electrode and is fastened on the unit attachment plate ; and an electrically conductive wire that connects the lower surface electrode and the probe electrode to each other through the opening part . The probe unit can be fastened on the ST board with the unit attachment plate intervening, and through the opening part of the unit attachment plate , the probe electrode and the lower surface electrode can be electrically connected to each other. 1. A probe card comprising:a wiring substrate that is formed with an electrode terminal;a unit attachment plate that is fastened on said wiring substrate and formed with an opening part exposing said electrode terminal;a probe unit that includes a probe substrate formed with a contact probe and a probe electrode and is fastened on said unit attachment plate; andan electrically conductive wire that connects said electrode terminal and said probe electrode to each other through said opening part.2. The probe card according to claim 1 , wherein:two or more said electrode terminals are exposed from said opening part in common; andtwo or more said probe electrodes on said probe unit are respectively connected to corresponding ones of said electrode terminals through two or more electrically conductive wires passing through said opening part in common.3. The probe card according to claim 2 , wherein:two or more probe units are arranged on said unit attachment plate in common; andsaid opening part has a long narrow shape that extends along outer edge parts of said probe units.4. A probe card manufacturing method comprising:a step of fastening a probe substrate formed with a contact probe and a probe electrode on a unit attachment plate ...

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Номер записи: 48
17-10-2013 дата публикации

Wiring Substrate With Filled Vias To Accommodate Custom Terminals

Номер: US20130271175A1
Автор: Powell Shawn
Принадлежит: FORMFACTOR, INC.

A probe card assembly and associated processes of forming them may include a wiring substrate with a first surface and an opposite surface, an electrically conductive first via comprising electrically conductive material extending into the wiring substrate from the opposite surface and ending before reaching the first surface, and a plurality of electrically conductive second vias, and a custom electrically conductive terminal disposed on the first surface such that said custom terminal covers the first via and contacts one of the second vias adjacent to said first via without electrically contacting the first via. Each of the second vias may be electrically conductive from the first surface to the opposite surface. The first via may include electrically insulating material disposed within a hole in the first via. 1. A process for providing a custom electrically conductive terminal on a first surface of a wiring substrate , wherein said wiring substrate comprises electrically conductive vias from said first surface to an opposite surface of said wiring substrate , said process comprising:forming a hole at a first one of said vias from said first surface into said wiring substrate and thereby removing all electrically conductive material of said first via in a gap from said first surface into said wiring substrate;depositing an electrically insulating material into said hole such that said electrically insulating material is disposed between all remaining electrically conductive material of said first via and said first surface of said wiring substrate; andproviding on said first surface of wiring substrate and said insulating material said custom terminal such that said custom terminal overlaps said first via and a second one of said vias that is adjacent to said first via without electrically contacting said first via.2. The process of claim 1 , wherein said custom terminal overlaps said first via and said second via and a third one of said vias.3. The process of ...

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Номер записи: 49
24-10-2013 дата публикации

METHOD FOR THERMAL STABILIZATION OF PROBE CARD AND INSPECTION APPARATUS

Номер: US20130278279A1
Автор: ISHII Kazunari, Koizumi Shinya, Matsuzaki Koichi, Watanabe Tetsuji
Принадлежит: TOKYO ELECTRON LIMITED

In a method for thermal stabilization of a probe card, a probe card is adjusted to a prescribed temperature in a short time by making a heat source directly contact the probe card and is accurately determined whether the probe card is thermally stable. A heat transfer substrate is mounted on a mounting table. The temperature of the heat transfer substrate is adjusted through the mounting table. The mounting table is raised, and a plurality of probes is brought into contact with the heat transfer substrate at a prescribed target load. The contact load between the heat transfer substrate and the probes, which changes according to the thermal changes in the probe card, is detected. The mounting table is controlled vertically through a vertical drive mechanism such that the contact load becomes the target load until the probe card is thermally stable. 1. A method for thermal stabilization of a probe card by using an inspection apparatus including: a horizontally and vertically movable mounting table; a probe card having a plurality of probes , disposed above the mounting table; a vertical drive mechanism configured to vertically move the mounting table; a temperature control unit configured to control a temperature of the mounting table; and a control unit configured to control the vertical drive mechanism and the temperature control unit , wherein before inspecting electrical characteristics of an inspection target at a predetermined temperature , the probe card is thermally stabilized by mounting a heat transfer substrate on the mounting table , adjusting the probe card to a predetermined temperature through the heat transfer substrate on the mounting table of which temperature is adjusted by the temperature control unit , and controlling a contact load between the heat transfer substrate and the probes to a predetermined target load by vertically moving the mounting table through the vertical drive mechanism , the method comprising:a first step of mounting the heat ...

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Номер записи: 50
31-10-2013 дата публикации

STIFFENER PLATE FOR A PROBECARD AND METHOD

Номер: US20130285690A1
Автор: Andberg John
Принадлежит: ADVANTEST (SINGAPORE) PTE LTD

A microelectronic contactor assembly can include a probe head having microelectronic contactors for contacting terminals of semiconductor devices to test the semiconductor devices. A stiffener assembly can provide mechanical support to microelectronic contactors and for connecting a probe card assembly to a prober machine. A stiffener assembly may include a main body and a plurality of mounting points, wherein at least one of the mounting points is flexibly connected to the main body by one or more laterally extending beams that has a section modulus normal to the lateral direction significantly greater than in the lateral direction. The stiffener assembly allows for differential thermal expansion of various components of the microelectronic contactor assembly while minimizing accompanying dimensional distortion that could interfere with contacting the terminals of semiconductor devices. 1. A laterally extending stiffener plate adapted to provide stiffening for a probecard , comprising:a main body; anda plurality of mounting points;wherein at least one of the mounting points is flexibly connected to the main body by one or more laterally extending beams that has a section modulus normal to the lateral direction at least sixteen times greater than in the lateral direction.2. The laterally extending stiffener plate of claim 1 , wherein the one or more laterally extending beams has a section modulus normal to the lateral direction at least twenty-five times greater than in the lateral direction.3. The laterally extending stiffener plate of claim 1 , wherein the one or more laterally extending beams has a section modulus normal to the lateral direction at least thirty-six times greater than in the lateral direction.4. The laterally extending stiffener plate of claim 1 , wherein the one or more laterally extending beams has a section modulus normal to the lateral direction at least forty-nine times greater than in the lateral direction.5. The laterally extending ...

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Номер записи: 51
28-11-2013 дата публикации

Vacuum forming method

Номер: US20130313762A1
Автор: Shigeyuki Katou
Принадлежит: MICROPELT GmbH

Mainly, local wall thinning is prevented. The invention relates to a vacuum forming method for fabricating a resin-molded article. The vacuum forming method includes pressing a thermoplastic resin sheet 201 softened by heating into a vacuum forming mold 202 using a core mold 203 to stretch and deform thermoplastic resin sheet 201 at the same time, and bringing the thermoplastic resin sheet 201 into intimate contact with the vacuum forming mold 202 by vacuum suction to shape the thermoplastic resin sheet 201 . In the process of closing the vacuum forming mold 202 and the core mold 203 , at least part of the thermoplastic resin sheet 201 is preshaped using air pressure in such a way that the at least part of the thermoplastic resin sheet 201 is locally stretched and deformed at the same time and thus brought into intimate contact with the core mold 203 . Then, the thermoplastic resin sheet 201 is final-shaped by closing the vacuum forming mold 202 and the core mold 203 and performing vacuum suction through the vacuum forming mold 202.

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Номер записи: 52
28-11-2013 дата публикации

RESISTIVITY-MEASURING DEVICE

Номер: US20130314112A1
Автор: Lai Yankun, Li Minxuan, Yu Lewei
Принадлежит: TPK TOUCH SOLUTIONS (XIAMEN) INC.

A resistivity-measuring device comprising: a carrier platform used for loading a plurality of products under measure; a material-incoming conveyor, on which the carrier platform is disposed, and comprising a material-incoming guide wheel group for moving the carrier platform horizontally; a probe module, used for measuring the resistance of the products under measure; a probe position regulating mechanism, disposed on the material-incoming conveyor and connected to the probe module for elevating the probe module vertically and moving the probe module horizontally; a revolving machine, connected to the material-incoming conveyor for receiving and transferring a plurality of products under measure from the material-incoming conveyor, wherein a transferring direction of the revolving machine is adjustable; and a controller, electrically connected to the material-incoming conveyor, the probe module, the probe position regulating mechanism and the revolving machine. The resistivity-measuring device achieves automatic measuring resistivity, increases the efficiency of measurement, and reduces labor power cost. 1. A resistivity-measuring device , comprising:a carrier platform used for loading a plurality of products under measure;a material-incoming conveyor, on which the carrier platform is disposed, and the material-incoming conveyor comprises a material-incoming guide wheel group for moving the carrier platform horizontally;a probe module, used for measuring the resistance of the products under measure;a probe position regulating mechanism, disposed on the material-incoming conveyor and connected to the probe module for elevating the probe module vertically and moving the probe module horizontally;a revolving machine, connected to the material-incoming conveyor for receiving and transferring a plurality of products under measure from the material-incoming conveyor, wherein a transferring direction of the revolving machine is adjustable; anda controller, electrically ...

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Номер записи: 53
28-11-2013 дата публикации

LASER-ASSISTED DEVICE ALTERATION USING SYNCHRONIZED LASER PULSES

Номер: US20130314116A1
Автор: Reid Derryck, Serrels Keith, Vedagarbha Praveen, Vickers James S.
Принадлежит:

A pulsed-laser LADA system is provided, which utilizes temporal resolution to enhance spatial resolution. The system is capable of resolving CMOS pairs within the illumination spot using synchronization of laser pulses with the DUT clock. The system can be implemented using laser wavelength having photon energy above the silicon bandgap so as to perform single-photon LADA or wavelength having photon energy below the silicon bandgap so as to generate two-photon LADA. The timing of the laser pulses can be adjusted using two feedback loops tied to the clock signal of an ATE, or by adjusting the ATE's clock signal with reference to a fixed-pulse laser source. 1. A laser assisted device alteration (LADA) system operable in conjunction with an automated testing equipment (ATE) for testing integrated circuit device under test (DUT) , comprising:a controller receiving and analyzing test signals from the ATE;timing electronics receiving a clock signal from the ATE, the timing electronics including a first feedback loop generating a synch signal for synchronization of laser pulses to the clock signal;a tunable pulsed laser source generating the laser pulses and having a tunable laser cavity and having a second feedback loop to control the tunable laser cavity so as to generate desired pulse rate of the laser pulses;optical arrangement receiving laser pulses from the tunable pulsed laser source and directing the laser pulses onto desired location on the DUT;wherein the timing electronics is configured for timing the laser pulses to arrive at transistors in the DUT at times synchronized to the clock time to thereby alter the transistors response to test signals applied to the DUT from the ATE, and wherein the controller is configured to detect the altered transistors response.2. The system of claim 1 , wherein the first feedback loop comprises phase-locked loop.3. The system of claim 1 , wherein the second feedback loop comprises phase-locked loop.4. The system of claim 1 , ...

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Номер записи: 54
05-12-2013 дата публикации

MEMBRANE PROBING METHOD USING IMPROVED CONTACT

Номер: US20130321018A1
Автор: Bayne Michael A., Gleason Reed, Koxxy Martin, Lesher Timothy, Smith Kenneth
Принадлежит: Cascade Microtech, Inc.

A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a depression can be readily made therein. A dielectric (insulative) layer, that is preferably patterned, is supported by the substrate. A conductive material is located within the depressions and then preferably lapped to remove excess from the top surface of the dielectric layer and to provide a flat overall surface. A trace is patterned on the dielectric layer and the conductive material. A polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process. 1. (canceled)2. A probing assembly for probing an electrical device , the probing assembly comprising:an elastic assembly including a surface; anda plurality of contacts, wherein the surface of the elastic assembly supports the plurality of contacts, wherein each contact of the plurality of contacts includes a contacting portion that is configured to electrically contact the electrical device, and further wherein at least one of:(i) the contacting portion includes at least one of a roughened surface, a sharp ridge, a waffle pattern, and a pair of projections;(ii) the plurality of contacts includes a first conductive material that defines the contacting portion and a second conductive material that supports the first conductive material, wherein the first conductive material is different from the second conductive material, and further wherein a thickness of the first conductive material at a point of contact between the electrical device and the contacting portion and in a direction that is perpendicular to the surface of the elastic assembly is greater than a thickness of the first conductive material in a direction that is perpendicular to a side of the first ...

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Номер записи: 55
05-12-2013 дата публикации

PROBE CARD

Номер: US20130321019A1
Автор: AKIYAMA Hajime, Okada Akira, YAMASHITA Kinya
Принадлежит: Mitsubishi Electric Corporation

It is an object of the present invention to provide a probe card capable of controlling generation of a scratch or an indentation in a connection pad and capable of controlling generation of heat in a connection pad and its vicinity having contacted a contact probe at low cost and in a simple way. A probe card includes a probe substrate, at least one contact probe electrically connected to a signal line provided to an insulating base of the probe substrate and fixed to the insulating base, and at least one engagement member installed on the contact probe at a position near a tip end portion of the contact probe. The engagement member has at least one engagement portion that makes abutting contact with another predetermined member during operation to restrain the operation of the contact probe. 1. A probe card , comprising:a probe substrate:at least one contact probe electrically connected to a signal line provided to an insulating base of said probe substrate and fixed to said insulating base; andat least one engagement member installed on said contact probe at a position near a tip end portion of said contact probe, the engagement member having at least one engagement portion that makes abutting contact with another predetermined member during operation to restrain the operation of said contact probe.2. The probe card according to claim 1 , wherein said another predetermined member includes a contact probe different from said contact probe on which said engagement member is installed claim 1 , an engagement member different from said engagement member claim 1 , or said insulating base.3. The probe card according to claim 1 , whereinsaid contact probe is provided with at least one stepped part or at least one recessed part formed near said tip end portion of an axial portion of said contact probe, andsaid engagement member is installed on said contact probe through said stepped part or said recessed part.4. The probe card according to claim 1 , wherein said contact ...

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Номер записи: 56
12-12-2013 дата публикации

Probe Card for Simultaneously Testing Multiple Dies

Номер: US20130328586A1
Автор: Chou You-Hua, LAI Yi-Jen
Принадлежит: Taiwan Semiconductor Manufacturing Company, Ltd.

In accordance with an embodiment, a probe card comprises a contact pad interface comprising front side contacts and back side contacts electrically coupled together. The front side contacts are arranged to simultaneously electrically couple respective bumps of a plurality of dies on a wafer, and the back side contacts are arranged to electrically couple respective contacts of a testing structure. 1. A probe card comprising:a contact pad interface comprising front side contacts and back side contacts electrically coupled together, the front side contacts being arranged to simultaneously electrically couple respective bumps of a plurality of dies on a wafer, and the back side contacts being arranged to electrically couple respective contacts of a testing structure.2. The probe card of claim 1 , wherein the front side contacts are arranged to simultaneously electrically couple the respective bumps of all of the dies on the wafer.3. The probe card of claim 1 , wherein the testing structure comprises a docking board secured to the contact pad interface claim 1 , the docking board comprising a contact pad claim 1 , the contact pad comprising board contacts claim 1 , the board contacts being the contacts of the testing structure.4. The probe card of claim 3 , wherein the contact pad interface is secured to the docking board by a clamp.5. The probe card of claim 3 , wherein the contact pad interface is secured to the docking board by a vacuum system.6. The probe card of claim 1 , wherein the contact pad interface comprises:a substrate with a front side and a back side, the back side being opposite from the front, wherein the front side contacts are on the front side, and the back side contacts are on the back side;through substrate vias (TSVs) penetrating through the substrate and electrically coupling the front side contacts to respective back side contacts; andinterconnect structures on at least one of the front side and the back side electrically disposed between the ...

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Номер записи: 57
26-12-2013 дата публикации

PROBE CARD AND MANUFACTURING METHOD

Номер: US20130342232A1
Автор: Park Young Geun
Принадлежит: M2N INC.

There is provided a probe card in contact with pads formed on a plurality of semiconductor dies on a wafer to test the semiconductor dies. The probe card includes a printed circuit board on which a plurality of pads are formed; a block plate having a plurality of grooves and attached to the printed circuit board; a plurality of sub-probe units equipped with a plurality of probe tips in contact with the pads of the semiconductor dies and detachably coupled to the plurality of grooves; and a plurality of interposer/space transformer units interposed between the sub-probe units and the printed circuit board and configured to electrically connect the probe tips to the pads of the printed circuit board and transform a pitch of the pads formed on the printed circuit to a pitch of the plurality of probe tips. 1. A probe card in contact with pads formed on a plurality of semiconductor dies on a wafer to test the semiconductor dies , the probe card comprising:a printed circuit board on which a plurality of pads are formed;a block plate having a plurality of grooves and attached to the printed circuit board;a plurality of sub-probe units equipped with a plurality of probe tips in contact with the pads of the semiconductor dies and detachably coupled to the plurality of grooves; anda plurality of interposer/space transformer units interposed between the sub-probe units and the printed circuit board and configured to electrically connect the probe tips to the pads of the printed circuit board and transform a pitch of the pads formed on the printed circuit to a pitch of the plurality of probe tips.2. The probe card of claim 1 , a body part having a plurality of slits that define a space transformation path; and', 'a plurality of micro pins that are inserted into the plurality of slits to electrically connect the printed circuit board to the sub-probe units., 'wherein the interposer/space transformer unit comprises3. The probe card of claim 2 ,wherein one of the interposer/space ...

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Номер записи: 58
26-12-2013 дата публикации

Wafer Level Integrated Circuit Contactor and Method of Construction

Номер: US20130342233A1
Автор: Edwards Jathan, Halvorson Brian, Marks Charles
Принадлежит:

A testing device for wafer level testing of IC circuits is disclosed. An upper and lower pin () are configured to slide relatively to each other and are held in electrically biased contact by an elastomer (). The elastomer is precompressed from its natural rest state between a top () plate and a bottom (). Pre compression improves the resilient response of the pins. The pin crows () are maintained relatively coplanar by the engagement of at least one flang (-) against an up-stop surface of plate , thereby insuring coplanarity of the crowns. The pin guide () is maintained in alignment with the retainer by establishing a registration corner () and driving the guide into the corner by elastomers in at least one diagonally opposite corner. 1. A test contact pin assembly for temporary contact with a test pad on a wafer level integrated circuit device under test (DUT) comprising:a. at least one slideable upper terminal pin, further having, a top extension for contacting the DUT, portion, at least one lateral cross member flange and a contact surface; said upper pin being slideable between an out of test position and an in-test position;b. at least one lower terminal pin having a foot and a like contact surface;c. said upper and lower pins being held in contact by bias forces which maintain their respective contacts surfaces together but in a slideable relationship to each other;d. an elastomeric material of predetermined height when in an uncompressed state, said material surrounding the pins to create said bias force;e. a substantially rigid top pin guide surface located atop said elastomeric material, including a pair of spaced part parallel walls defining a guide channel for said flange, an upper wall between said parallel walls defining an up-stop surface for said pin and an aperture in said up-stop surface for receiving an extended portion of said upper pin which protrudes beyond said guide surface to make contact with said DUT, said channel being sized to be large ...

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Номер записи: 59
26-12-2013 дата публикации

PROBE CARD

Номер: US20130342235A1
Автор: HAN Chung-Soo
Принадлежит:

The present invention relates to a probe card having improved electrical characteristics and mechanical durability of a portion where the probe needle and bump electrode of the probe card come into contact with each other. 1. A probe card , comprising:an interface board having an opening and a circuit part;a plurality of connection wires configured to have first ends bonded to contact points of the circuit part of the interface board;an interposer configured to have the connection wires penetrate through the interposer and to have second ends of the connection wires exposed from a bottom surface of the interposer, thus forming bump electrodes, and placed in the opening of the interface board;a plurality of probe needles configured to have upper ends connected to the respective bump electrodes provided on the bottom surface of the interposer and to have lower ends extended downward; andat least one support plate configured to have the probe needles inserted into and mounted on the support plate so that the upper ends of the probe needles are exposed upward from the support plate and the lower ends of the probe needles are exposed downward from the support plate,wherein the upper end of each of the probe needles connected to the bump electrodes of the interposer comprises a rhodium plating layer plated with rhodium.2. The probe card of claim 1 , wherein the probe needle is a cobra type probe needle.3. The probe card of claim 2 , wherein the upper end of the probe needle is plated with nickel and then plated with rhodium.4. The probe card of claim 1 , wherein the bump electrodes of the interposer are plated with rhodium.5. The probe card of claim 4 , wherein the bump electrodes is plated with nickel and then plated with rhodium.6. The probe card of claim 1 , wherein the probe needle comprises palladium as an alloy component claim 1 , and the palladium is 20 to 50 wt %.7. The probe card of claim 6 , wherein the alloy component of the probe needle further comprises ...

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Номер записи: 60
26-12-2013 дата публикации

Probe-on-substrate

Номер: US20130344694A1
Автор: David M. Audette, Dustin M. Fregeau, Kevin Bocash, S. Jay Chey, Steven A. Cordes
Принадлежит: International Business Machines Corp

Probes are directly patterned on a test substrate, thereby eliminating a need for an interposer. Probe contact structures are formed as a two-level structure having a greater lateral dimension for a lower level portion than for an upper level portion. First cavities are formed in a masking layer applied to a test substrate, filling the cavities with a conductive material, and planarizing the top surfaces of the conductive material portions to form lower level portions. Another masking layer is applied over the lower level portions and patterned to define second cavities having a smaller lateral dimension that the lower level portions. The second cavities are filled with at least one conductive material to form upper level portions of the probe contact structures. The upper level portion of each probe contact structure can be employed to penetrate a surface oxide of solder balls.

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Номер записи: 61
16-01-2014 дата публикации

HIGH FREQUENCY PROBE CARD

Номер: US20140015561A1
Автор: Chang Chia-Tai, CHANG Keng-Shieng, CHEN Chiu-Kuei, HUANG Yun-Ru, LAI Chien-Chang, TSAI Chin-Yi, Yang Chin-Tien, YANG Hui-Pin, YU Chen-Chih
Принадлежит:

A high frequency probe card includes at least one substrate having at least one first opening, an interposing plate disposed on the at least one substrate and having at least one second opening corresponding to the at least one first opening, a circuit board disposed on the interposing plate and having a third opening corresponding to the at least one first and second openings, and at least one probe module including at least one N-type ground probe and at least one high frequency signal probe passing through the corresponding substrate, the interposing plate and the third opening and being electrically connected with the circuit board. Each high frequency signal probe includes an N-type signal probe and a first conductor corresponding to the N-type signal probe and being electrically connected with the N-type ground probe. An insulation layer is disposed between the first conductor and the N-type signal probe. 1. A high frequency probe card comprising:at least one substrate each having at least one first opening;an interposing plate disposed on the at least one substrate and provided with at least one second opening corresponding to the at least one first opening respectively;a circuit board disposed on the interposing plate and provided with a third opening corresponding to the at least one first opening and the at least one second opening; and at least one N-type ground probe; and', an N-type signal probe; and', 'a first conductor corresponding to the N-type signal probe and being electrically connected with the N-type ground probe; wherein an insulation layer is disposed between the N-type signal probe and the first conductor., 'at least one high frequency signal probe penetrating through the corresponding at least one substrate and the interposing plate, passing through the third opening and being electrically connected with the circuit board; each said high frequency signal probe comprising], 'at least one probe module disposed on the at least one substrate ...

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Номер записи: 62
16-01-2014 дата публикации

PROBE HOLDING STRUCTURE AND OPTICAL INSPECTION DEVICE EQUIPPED WITH THE SAME

Номер: US20140016123A1
Автор: Chang Chia-Tai, CHANG Keng-Shieng, CHEN Chiu-Kuei, HUANG Yun-Ru, LAI Chien-Chang, TSAI Chin-Yi, Yang Chin-Tien, YANG Hui-Pin, YU Chen-Chih
Принадлежит:

A probe holding structure includes a substrate and a plurality of holding modules. The substrate has an opening and a plurality of grooves arranged around a periphery of the opening. The holding modules are connected with the grooves, respectively. Each holding modules includes a fixing member and a plurality of probes. The fixing member is connected with a corresponding groove. The probes are connected with the fixing member and pass through the corresponding groove. The probe holding structure is combined with a lens adjusting mechanism having a lens to form an optical inspection device for testing electric characteristics of chips. 1. A probe holding structure comprising:a substrate having an opening and a plurality of grooves arranged around a periphery of the opening; and a fixing member connected with a corresponding said groove; and', 'a plurality of probes connected with the fixing member and passing through the corresponding said groove., 'a plurality of holding modules connected with the grooves respectively; each of the holding modules comprising2. The probe holding structure as claimed in claim 1 , wherein the grooves penetrate through a body of the substrate; each of the holding modules is received in one of the grooves.3. The probe holding structure as claimed in claim 2 , wherein each of the probes comprises:an extension portion abutted at a lateral surface of the fixing member and passing through the corresponding said groove;a suspension arm connected with the extension portion and defining with the extension portion a first contained angle; anda detecting portion connected with the suspension arm and defining with the suspension arm a second contained angle;wherein an adhesive is applied between the suspension portion and the fixing member.4. The probe holding structure as claimed in claim 1 , wherein each of the probes comprises:an extension portion abutted at a lateral surface of the fixing member and passing through the corresponding said groove ...

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Номер записи: 63
23-01-2014 дата публикации

CONTACT INSPECTION DEVICE

Номер: US20140021976A1
Автор: TANAKA Kentaro
Принадлежит: KABUSHIKI KAISHA NIHON MICRONICS

A contact inspection device including contacts that contact with a test object for inspection, each contact having a base end portion, a needle tip portion having a needle tip that contacts with the test object, and an elastically deformable portion located between the base end portion and the needle tip portion, with the base end portion and the needle tip portion having axes which coincide with each other. The elastically deformable portion is deformable under a compressive force applied in the axial direction of the needle tip portion while the needle tip is pressed against the test object and converts the compressive force into a tilting motion of the needle tip portion about the needle tip through deformation. The needle tip portion is displaceable in a direction in which the needle tip portion is pivotally tilted while the needle tip is pressed against the test object. 1. A contact inspection device including contacts to be brought into contact with a test object for inspection , a base end portion;', 'a needle tip portion having a needle tip to be brought into contact with the test object; and', 'an elastically deformable portion being located between the base end portion and the needle tip portion,, 'each contact comprisingwherein the base end portion and the needle tip portion has axes which coincide with each other,the elastically deformable portion is deformable under a compressive force applied in a direction of the axis of the needle tip portion while the needle tip is pressed against the test object, to convert the compressive force into a pivotal tilting motion of the needle tip portion about the needle tip thereof through the deformation, andthe contact inspection device is configured such that the needle tip portion of each contact is displaceable in a direction in which the needle tip portion is pivotally tilted about the needle tip thereof with the needle tip being pressed against the test object.2. A contact inspection device including contacts ...

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Номер записи: 64
30-01-2014 дата публикации

PROBE CARD AND TESTING APPARATUS

Номер: US20140028341A1
Автор: KIKUCHI YOSHINORI, KUDO TOSHIYUKI, MIKUNI Katsushi, ONUMA Yoshihito
Принадлежит:

Provided is a probe card capable of effectively placing electronic parts. A probe card according to the present invention includes a plurality of probes that come into contact with a plurality of electrodes of a device, a probe board including the plurality of probes provided thereon, a wiring board that is placed facing a surface of the probe board opposite to a surface including the probes provided thereon, a connector that includes a connection pin and a holder, in which the connection pin electrically connects a line of the probe board and a line of the wiring board, and the holder holds the connection pin between the probe board and the wiring board, and a first electronic part that is mounted on a probe board side surface of the wiring board and placed in a mounting space formed by a through hole or a recess provided in the holder. 1. A probe card comprising:a plurality of probes that come into contact with a plurality of electrodes of a device under test;a probe board that includes the plurality of probes provided thereon;a wiring board that is placed facing a surface of the probe board opposite to a surface including the probes provided thereon;a connector that includes a connection pin and a holder, the connection pin electrically connecting a line of the probe board and a line of the wiring board, and the holder holding the connection pin between the probe board and the wiring board; anda first electronic part that is mounted on a probe board side surface of the wiring board and placed in a mounting space, the mounting space being formed by a through hole or a recess provided in the holder.2. The probe card according to claim 1 , wherein the first electronic part is a relay switch that interrupts power supply to the device under test.3. The probe card according to claim 1 , wherein a second electronic part is mounted at a position facing the first electronic part on a wiring board side surface of the probe board.4. The probe card according to claim 3 , ...

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Номер записи: 65
30-01-2014 дата публикации

Probe Card Assemblies And Probe Pins Including Carbon Nanotubes

Номер: US20140028342A1
Автор: Brandorff Alexander
Принадлежит:

A probe card assembly for testing circuit boards is disclosed. In some embodiments, the assembly includes the following: a multi-layered dielectric plate aligned with an integrated circuit, the integrated circuit having on its surface a first plurality of electrical contacts arranged in a pattern, the dielectric plate having arrayed upon its surface a second plurality of electrical contacts arranged in a pattern substantially matching the first plurality of electrical contacts; a nanotube interposer interposed between the dielectric plate and the integrated circuit, the nanotube interposer having compliant carbon nanotubes that are arranged to match the pattern of electrical contacts on the integrated circuit and the dielectric plate; and a plurality of vertical probes arrayed upon the nanotube interposer and joined with the nanotubes, the vertical probes making electrical contact with the first plurality of electrical contacts and the second plurality of electrical contacts via the nanotubes. 1. A probe card assembly for testing circuit boards comprising:a multi-layered dielectric plate aligned with an integrated circuit, said integrated circuit having arrayed upon its surface a first plurality of electrical contacts arranged in a pattern, said dielectric plate having arrayed upon its surface a second plurality of electrical contacts arranged in a pattern substantially matching said first plurality of electrical contacts;a carbon nanotube interposer interposed between said dielectric plate and said integrated circuit, said nanotube interposer having compliant carbon nanotubes that are arranged to match the pattern of electrical contacts on said integrated circuit and said dielectric plate; anda plurality of substantially non-compliant vertical probes arrayed in a pattern upon said nanotube interposer and joined with said nanotubes, said vertical probes making electrical contact with said first plurality of electrical contacts and said second plurality of electrical ...

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Номер записи: 66
30-01-2014 дата публикации

Interposer to regulate current for wafer test tooling

Номер: US20140029150A1
Автор: Evan M. Fledell, Jack D. Pippin, Paul B. Fischer, Roy E. Swart, Timothy J. Maloney
Принадлежит: Intel Corp

An interposer is described to regulate the current in wafer test tooling. In one example, the interposer includes a first connection pad to couple to automated test equipment and a second connection pad to couple to a device under test. The interposer further includes an overcurrent limit circuit to connect the first and second connection pads and to disconnect the first and second connection pads when the current between the first and second connection pads is over a predetermined amount.

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Номер записи: 67
06-02-2014 дата публикации

PROBE CARD WITH SIMPLIFIED REGISTRATION STEPS AND MANUFACTURING METHOD THEREOF

Номер: US20140035609A1
Автор: CHENG GAO-TING, Huang Jung-Tang, LEE KUO-YU, Lin Jian-Ming
Принадлежит:

A probe card is provided. The probe card includes a probe module and a first carrier board. The probe module has a plurality of probes. The probe module is disposed on the first carrier board. The first carrier board is at least partially light-transmitted and has a plurality of vias and a plurality of conductive fillers. The vias are filled with the conductive fillers, respectively. The probe module is electrically connected to the conductive fillers. With the first carrier board being partially light-transmitted, not only is it feasible to simplify the steps of registering the probe card and a device under test, but it is also feasible for an inspector to inspect the contact between the probe card and the device under test synchronously. 1. A probe card , comprising:a probe module having a plurality of probes; anda first carrier board being at least partially light-transmitted and having a plurality of vias and a plurality of conductive fillers, the vias being filled with the conductive fillers, respectively, wherein the probe module is disposed on the first carrier board and electrically connected to the conductive fillers.2. The probe card of claim 1 , further comprising a circuit module disposed on the first carrier board and electrically connected to the probe module through the conductive fillers.3. The probe card of claim 2 , further comprising a bonding pad redistribution layer disposed on the first carrier board and electrically connected to the conductive fillers.4. The probe card of claim 2 , wherein the circuit module comprises a microcontroller.5. The probe card of claim 1 , wherein the first carrier board is made of glass or quartz.6. The probe card of claim 1 , wherein the probes are arranged in an array.7. The probe card of claim 1 , wherein the probes are made of a metal or an alloy.8. The probe card of claim 1 , wherein the probes are made of carbon claim 1 , a carbon compound claim 1 , or a carbon alloy.9. A probe card manufacturing method claim ...

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Номер записи: 68
06-02-2014 дата публикации

Method for fabricating a through wire interconnect (twi) on a semiconductor substrate having a bonded connection and an encapsulating polymer layer

Номер: US20140038406A1
Автор: Alan G. Wood, David R Hembree
Принадлежит: Micron Technology Inc

A method for fabricating a through wire interconnect for a semiconductor substrate having a substrate contact includes the steps of: forming a via through the semiconductor substrate from a first side to a second side thereof; placing a wire in the via having a first end with a bonded connection to the substrate contact and a second end proximate to the second side; forming a first contact on the wire proximate to the first side; forming a second contact on the second end of the wire; and forming a polymer layer on the first side at least partially encapsulating the wire while leaving the first contact exposed.

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Номер записи: 69
27-02-2014 дата публикации

PROBE CARD AND METHOD FOR MANUFACTURING PROBE CARD

Номер: US20140055157A1
Автор: Higashi Mitsutoshi, Sakaguchi Hiedeaki, Shiraishi Akinori
Принадлежит: SHINKO ELECTRIC INDUSTRIES CO., LTD.

A probe card for conducting an electrical test on a test subject includes a substrate body including a first surface, which faces toward the test subject, and a second surface, which is opposite to the first surface. A through electrode extends through the substrate body between the first surface and the second surface. A contact bump is formed in correspondence with the electrode pad and electrically connected to the through electrode. An elastic body is filled in an accommodating portion, which is formed in the substrate body extending from the first surface toward the second surface. The contact bump is formed on the elastic body. 1. A probe card for electrically connecting to an electrode pad formed on a test subject to conduct an electrical test on the test subject , the probe card comprising:a substrate body including a first surface, which is located to face toward the test subject, and a second surface, which is opposite to the first surface; a through electrode extending through the substrate body between the first surface and the second surface;an elastic body filled in an accommodating portion formed, in the substrate body, extending from the first surface toward the second surface, wherein the contact bump is formed on the elastic body;a support body arranged, in the elastic body, extending from the first surface toward the second surface of the substrate body; anda contact bump formed in correspondence with the electrode pad, connected to an end of the support body, and electrically connected to the through electrode.2. The probe card according to claim 1 , wherein the accommodating portion is a through hole extending through the substrate body between the first surface and the second surface.3. The probe card according to claim 1 , wherein the support body extends through the elastic body and serves as the through electrode.4. The probe card according to claim 1 , wherein the probe card electrically connects the electrode pad of the test subject to a ...

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Номер записи: 70
27-02-2014 дата публикации

Integrated Circuit Die Having Input and Output Circuit Pads, Test Circuitry, and Multiplex Circuitry

Номер: US20140055158A1
Автор: Hales Alan, Whetsel Lee D.
Принадлежит: TEXAS INSTRUMENTS INCORPORATED

Test circuits located on semiconductor die enable a tester to test a plurality of die/ICs in parallel by inputting both stimulus and response patterns to the plurality of die/ICs. The response patterns from the tester are input to the test circuits along with the output response of the die/IC to be compared. Also disclosed is the use of a response signal encoding scheme whereby the tester transmits response test commands to the test circuits, using a single signal per test circuit, to perform: (1) a compare die/IC output against an expected logic high, (2) a compare die/IC output against an expected logic low, and (3) a mask compare operation. The use of the signal encoding scheme allows functional testing of die and ICs since all response test commands (i.e. 1-3 above) required at each die/IC output can be transmitted to each die/IC output using only a single tester signal connection per die/IC output. In addition to functional testing, scan testing of die and ICs is also possible. 1. An integrated circuit die comprising:A. input and output circuit pads;B. core circuits having core input leads and core output leads coupled with the input and output circuit pads; i. a core input lead;', 'ii. a first circuit pad lead connected with a first circuit pad;', 'iii. a second circuit pad lead connected with a second circuit pad;', 'iii. a tristate output buffer having an input connected with the core input lead, an output connected with the first circuit pad lead, and a control input;', 'iv. compare circuitry having a first input connected with the core input lead, a second input connected with the first circuit pad lead, a third input coupled with the second circuit pad lead, a scan input, a scan output, and a scan control input; and, 'C. test circuitry havingD. multiplex circuitry having inputs connected to core output leads of the core circuits, a core select input, and a selected core output connected to the core input lead of the compare circuitry.2. The integrated ...

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Номер записи: 71
06-03-2014 дата публикации

PROBE CARD, TEST METHOD FOR IMAGING ELEMENT AND TEST APPARATUS

Номер: US20140062517A1
Автор: Harada Tamotsu
Принадлежит: KABUSHIKI KAISHA TOSHIBA

In accordance with an embodiment, a probe card includes a substrate, a first probe and a second probe. The substrate includes a first area and a second area adjacent to the first area. In the first area a first opening is provided. The first probe is provided in the first area. An end of the first probe extends into the first opening. The second probe is provided in the second area. 1. A probe card comprising:a substrate which comprises a first area and a second area adjacent to the first area, a first opening being provided in the first area;a first probe in the first area, an end of the first probe extending into the first opening; anda second probe in the second area.2. The probe card of claim 1 , further comprising a light shielding member which is provided in the second area and blocks light from the first opening.3. The probe card of claim 2 ,wherein the light shielding member comprises a frame body having a shape associated with a peripheral shape of an imaging element which is a test object.4. The probe card of claim 2 ,wherein the frame body has a height associated with a height of the second probe.5. The probe card of claim 2 ,wherein the light shielding member is formed from a soft member which alleviates an impact shock at a time of probing.6. The probe card of claim 2 ,wherein a second opening, is pierced in the substrate to reach a space in the light shielding member; andthe probe card further comprises a pipe which is provided in the second opening and configured to be connected to an external exhauster.7. The probe card of claim 1 ,wherein the first probe is used in both a bright-period test and a dark-period test.8. The probe card of claim 1 ,wherein the second probe is used in the dark-period test.9. The probe card of claim 1 ,wherein the first probe is constituted of N (N is a natural number) probe pairs arranged at predetermined intervals, and each of the first probe pairs is constituted of a plurality of probe needles arranged in such a manner ...

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Номер записи: 72
06-03-2014 дата публикации

Space Transformation Methods

Номер: US20140062522A1
Автор: Armen Y. Balian, Erkan Acar, Ethan Caughey, Pooya Tadayon
Принадлежит: Intel Corp

A test system includes a test printed circuit board (PCB), a flip chip package mounted on the PCB, one or more test probes coupled to the flip chip package and a first integrated circuit (IC) coupled to the test probes to enable testing of the first IC using electrical circuitry of the flip chip package.

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Номер записи: 73
13-03-2014 дата публикации

METHOD AND APPARATUS FOR MASSIVELY PARALLEL MULTI-WAFER TEST

Номер: US20140070828A1
Автор: Andberg John W., DESTA Yohannes, Grover Sanjeev, Leventhal Ira H., Lopopolo Vincent E., Losey Matthew W., NAMBURI Lakshmikanth, Volkerink Erik
Принадлежит:

Disclosed herein is a cost effective, efficient, massively parallel multi-wafer test cell. Additionally, this test cell can be used for both single-touchdown and multiple-touchdown applications. The invention uses a novel “split-cartridge” design, combined with a method for aligning wafers when they are separated from the probe card assembly, to create a cost effective, efficient multi-wafer test cell. A “probe-card stops” design may be used within the cartridge to simplify the overall cartridge design and operation. 1. A cost effective , efficient , massively parallel multi-wafer test cell for testing semiconductor wafers with probes on probe cards in a probe card assembly , said test cell including:a wafer cartridge handler designed to align said wafers to said probe cards using split wafer cartridges, each said split wafer cartridge having a cartridge top section and a cartridge bottom section;wherein said cartridge top section and bottom section are designed to be moved around said test cell separately.2. The multi-wafer test cell of claim 1 , configured to support multiple touchdown testing claim 1 , wherein a separate target slot in a cartridge rack in said wafer cartridge handler is dedicated to each touchdown.3. The multi-wafer test cell of claim 1 , wherein said wafer cartridge handler is configured to accept one or more Front Opening Unified Pods (FOUPS) containing wafers which are loaded into wafer cartridges and aligned to said probe cards.4. The multi-wafer test cell of claim 1 , including:automated test equipment; anda shared, two-sided backplane acting as an interface between said automated test equipment and said wafer cartridges.5. The multi-wafer test cell of claim 4 , wherein said automated test equipment is a set of computer-controlled electronic hardware which provides stimuli to devices on said wafers and measures and records results.6. The multi-wafer test cell of claim 4 , wherein said wafer cartridge handler includes:load ports into which ...

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Номер записи: 74
20-03-2014 дата публикации

TEST AND CONNECTION APPARATUS ARRANGEMENT, AND CONNECTION APPARATUS

Номер: US20140077832A1
Автор: Hackemack Frank, Jaschke Bernhard, Richts Joerg
Принадлежит:

A testing arrangement is provided for testing the electrical circuits of an assembly of terminal blocks arranged in side-to-side relation, each of the terminal blocks including two mutually-insulated collinearly-arranged horizontal bus bar sections that are normally electrically connected by first and second pairs of leaf spring contacts arranged above and below the bus bar sections, respectively. During the testing operation, the testing device may be arranged either above or below the assembly, and an insulating test plug on the testing device is inserted either vertically downwardly from above, or upwardly from below, the terminal block, thereby to disengage one pair of contacts. A dummy plug is vertically inserted in the opposite direction to disengage the other pair of contacts. The remote ends of the bus bar sections are provided with clamping devices for connection with the bare ends of insulated conductors, respectively. 1. (canceled)2. (Canceled)3. (canceled)4. (canceled)5. (canceled)6. (canceled)7. (canceled)8. (canceled)9. (canceled)10. (canceled)11. (canceled)12. (canceled)13. (canceled)1432. A testing arrangement for testing the electrical circuits of a terminal block assembly () by means of a testing device () , comprising:{'b': '300', 'claim-text': [{'b': 6', '8, '(1) a pair of horizontal bus bar sections (, ) arranged in collinear longitudinally-spaced mutually-insulated relation in a chamber contained in said terminal block body;'}, {'b': 5', '7', '9', '10, '(2) a pair of conductor clamping devices (, ) connected with the remote ends of said bus bar sections, respectively, said clamping devices being operable to connect the bare ends of insulated conductors with said bus bar sections, respectively, said terminal block body upper wall containing access openings (, ) arranged above said clamping devices, respectively;'}, {'b': 15', '16', '15', '16', '19, 'i': b,', 'b', 'a,', 'a', 'a, '(3) an upper first pair of leaf spring electrical contacts () ...

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Номер записи: 75
27-03-2014 дата публикации

DETECTION APPARATUS FOR LIGHT-EMITTING DIODE CHIPS

Номер: US20140084931A1
Автор: Hsu Shou-Wen, Li Yun-Li, Sheu Gwo-Jiun, Tsai Tai-Cheng, WU TAI-WEI
Принадлежит: GENESIS PHOTONICS INC

A detection apparatus for light-emitting diode chips comprises a transparent chuck with the light-concentration capability, a probing device and a light-sensing device. The transparent chuck comprises a light-incident plane and a light-emitting plane. The light-incident plane is used to bear a plurality of light-emitting diode chips under detection. The probing device comprises two probe pins and a power supply. The two ends of each probe pin is electrically connected to one of the light-emitting diode chips and the power supply, respectively, to make the light-emitting diode chip emit a plurality of light beams. The light beams penetrate through the transparent chuck by emitting into the incident plane of the transparent chuck. The light-sensing device is disposed on one side of the light-emitting plane of the transparent chuck to receive the light beams which penetrate through the transparent chuck. 1. A detection apparatus for light-emitting diode chips , the detection apparatus at least comprising:a transparent chuck with the light-concentration capability, the transparent chuck comprising a light-incident plane and a light-emitting plane, where the light-incident plane is used to bear a plurality of light-emitting diode chips under detection;a probing device, comprising two probe pins and a power supply, the two ends of each probe pin being electrically connected respectively to one of the light-emitting diode chips and the power supply to enable the light-emitting diode chip to emit a plurality of light beams which are emitted into the light-incident plane; anda light-sensing device, disposed on one side of the light-emitting plane of the transparent chuck to receive the light beams which penetrate through the transparent chuck.2. The detection apparatus for light-emitting diode chips of claim 1 , wherein the area of the light-emitting plane of the transparent chuck is smaller than that of the light-incident plane.3. The detection apparatus for light-emitting ...

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Номер записи: 76
27-03-2014 дата публикации

Fine pitch interposer structure

Номер: US20140084955A1
Автор: Kai-Chieh Hsieh, Wen-Tsung Lee, Yuan-Chiang Teng
Принадлежит: Chunghwa Precision Test Technology Co Ltd

A fine pitch interposer structure includes a Multi-core base substrate and a plurality of buildup laminates. A surface of each Multi-core base substrate has a first circuit layer, and a second circuit layer which is electrically connected to the first circuit layer. The buildup laminates are stacked on the surface of the Multi-core base substrate. Each buildup laminate includes a photosensitive dielectric layer, and a plurality of blind vias with a pre-determined interval therebetween which are correspondingly arranged on each of the plurality of vias formed on the photosensitive dielectric layer. The blind vias are electrically connected to the first circuit layer. At least one blind via of one buildup laminate is superimposed on another blind via of another buildup laminate.

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Номер записи: 77
03-04-2014 дата публикации

FINE PITCH INTERFACE FOR PROBE CARD

Номер: US20140091826A1
Автор: Chui Ka Ng
Принадлежит:

A probe card interface for interfacing a probe head with a first circuit. The probe card interface includes an impedance control element to interface a first set of pins of the probe head with the first circuit. The impedance control element is further configured to control the impedance of the first set of pins. The probe card interface includes a printed circuit board (PCB) to interface a second set of pins of the probe head with the first circuit. The PCB is further coupled to provide at least one of power or ground to the second set of pins. For some embodiments, the PCB comprises a flexible polyimide substrate coupled between a first conductive layer and a second conductive layer. The first conductive layer is coupled to ground. The second conductive layer is coupled to a power source on the first circuit. 1. A probe card interface comprising:an impedance control element to interface a first set of pins of a probe head with a first circuit, wherein the impedance control element is configured to control the impedance of the first set of pins; anda printed circuit board (PCB) to interface a second set of pins of the probe head with the first circuit, wherein the PCB is coupled to provide at least one of power or ground to the second set of pins.2. The probe card interface of claim 1 , wherein the impedance control circuitry comprises a dielectric substrate coupled between two ground planes claim 1 , and wherein the first set of pins is disposed claim 1 , at least in part claim 1 , within the dielectric substrate.3. The probe card interface of claim 2 , wherein one or more of the pins of the first set of pins comprises a conductive wire.4. The probe card interface of claim 2 , wherein the PCB comprises a flexible polyimide substrate coupled between a first conductive layer and a second conductive layer.5. The probe card interface of claim 4 , wherein the first conductive layer is coupled to ground claim 4 , and wherein the second conductive layer is coupled to a ...

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Номер записи: 78
03-04-2014 дата публикации

PROBE CARD FOR CIRCUIT-TESTING

Номер: US20140091827A1
Автор: HUNG Chien-Yao
Принадлежит: Hermes-Epitek Corp.

A probe card for circuit-testing comprising a testing PCB, a probe head, and a silicon interposer substrate is provided. The probe head has a plurality of probes provided with a fine pitch arrangement and held inside. The silicon interposer substrate is used for conveying signals between said probes and said test PCB. The interconnection of said silicon interposer substrate is formed by utilizing the through-silicon via process. A plurality of upper terminals and a plurality of lower terminals are respectively array-arranged on the top surface and the bottom surface of said silicon interposer substrate. The pitch between the upper terminals is larger than the pitch between the lower terminals and the pitch between adjacent lower terminals is equal to the fine pitch of the arrangement of probes. 1. A probe card for circuit-testing c comprising:a testing print circuit board;a probe head having a plurality of probes provided with a fine pitch arrangement and held inside; anda silicon interposer substrate for conveying signals between said probes and said test PCB, wherein the interconnection of said silicon interposer substrate is formed by utilizing the through-silicon via process; a plurality of upper terminals and a plurality of lower terminals are respectively array-arranged on the top surface and the bottom surface of said silicon interposer substrate; the pitch between said upper terminals is larger than the pitch between said lower terminals; and the pitch between adjacent lower terminals is equal to the fine pitch of the arrangement of probes.2. The probe card for circuit-testing as claimed in claim 1 , wherein said silicon interposer substrate comprises:a silicon substrate with a TSV conductive structure; anda redistribution layer arranged on the upper surface of said silicon substrate, wherein said upper terminals are arranged on the upper surface of said redistribution layer.3. The probe card for circuit-testing as claimed in claim 1 , wherein said silicon ...

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Номер записи: 79
01-01-2015 дата публикации

SPACE TRANSFORMER AND PROBE CARD

Номер: US20150002180A1
Автор: Endo Naoki, Kaneda Noriyoshi, Miyaji Shinya
Принадлежит: NHK SPRING CO., LTD.

A space transformer includes: a ceramic substrate that contains enstatite and boron nitride as components; a through hole running through in a thickness direction with respect to a sintered body in which the boron nitride is oriented in one direction; conductive material provided inside the through hole; and a wiring pattern including a plurality of electrodes provided on each of two principal surfaces, wherein a wiring pitch in the wiring pattern on one principal surface is different from a wiring pitch in the wiring pattern on the other principal surface. 1. A space transformer comprising:a ceramic substrate that contains enstatite and boron nitride as components;a through hole running through in a thickness direction with respect to a sintered body in which the boron nitride is oriented in one direction;conductive material provided inside the through hole; anda wiring pattern including a plurality of electrodes provided on each of two principal surfaces, wherein a wiring pitch in the wiring pattern on one principal surface is different from a wiring pitch in the wiring pattern on the other principal surface.2. The space transformer according to claim 1 , further comprising a thin film of polyimide stacked and firmly fixed on at least one principal surface of the ceramic substrate claim 1 , andwherein the wiring pattern is provided inside or on a surface of the thin film.3. The space transformer according to claim 1 , wherein the ceramic substrate has an orientation index K=|log{(I/I)///(I/I)⊥}| equal to or higher than 0.8 that is calculated based on a ratio (I/I)// between intensity of X-ray diffraction Ialong a (002) plane of a crystal of the boron nitride and intensity of X-ray diffraction Ialong a (100) plane thereof when irradiated with an X-ray in the orientation direction of the boron nitride and a ratio (I/I)⊥ between the intensity of X-ray diffraction Ialong the (002) plane and the intensity of X-ray diffraction Ialong the (100) plane when irradiated with ...

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Номер записи: 80
01-01-2015 дата публикации

Probe tip formation for die sort and test

Номер: US20150002181A1
Автор: Kamil S. Salloum, Keith J. Martin, Kip P. Stevenson, Todd P. Albertson
Принадлежит: Intel Corp

Probe tip formation is described for die sort and test. In one example, the tips of wires of a test probe head are prepared for use as test probes. The wires are attached to a test probe head substrate. The end opposite the substrate has a tip. The tips of the wires are polished when attached to the test probe head to form a sharpened point.

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Номер записи: 81
05-01-2017 дата публикации

BALUNLESS TEST FIXTURE

Номер: US20170003317A1
Автор: GEORGE Ian Robert, Hammond, JR. Bernard Harold, White Gordon John
Принадлежит:

A test fixture and method of its use are disclosed. The test fixture includes a test fixture frame including a first test fixture mount having a first test head mounted thereon, the first test head slidable along a first axis, and a second test fixture mount having a second test head mounted thereon that is slidable along a second axis perpendicular to the first axis. The test fixture further includes a first test plate holder mounted to the first test head and including a clamping mechanism, as well as a probe mounting plate mounted to the first test plate holder and retained by the clamping mechanism and including a plurality of radially-disposed probe receptacles. The test fixture includes a plurality of probe assemblies received in corresponding probe receptacles, each including a probe extending at least partially through the probe mounting plate, each electrically connecting to a design under test. 1. A test fixture for electrical equipment , the test fixture comprising: a first test fixture mount having a first test head mounted thereon, the first test head slidable along a first axis; and', 'a second test fixture mount having a second test head mounted thereon, the second test head slidable along a second axis perpendicular to the first axis;, 'a test fixture frame includinga first test plate holder mounted to the first test head, the first test plate holder including a clamping mechanism;a probe mounting plate mounted to the first test plate holder and retained by the clamping mechanism, the probe mounting plate including a plurality of radially-disposed probe receptacles;a plurality of probe assemblies received in corresponding probe receptacles, each of the probe assemblies including a probe extending at least partially through the probe mounting plate, each probe electrically connecting to a design under test.2. The test fixture of claim 1 , further comprising:a second test plate holder mounted to the second test head, the second test plate holder ...

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Номер записи: 82
05-01-2017 дата публикации

ORGANIC PROBE SUBSTRATE

Номер: US20170003318A1
Автор: Audette David M., CHEY Sukjay J., Cordes Steven A., FORTIN Anthony D., Gardell David L., III Frederick H., III John R., Maher, RAJALINGAM Sankeerth, ROY
Принадлежит:

An organic probe substrate structure includes a daughter card; an organic laminate attached to the daughter card; and multiple probes built onto a top surface of the organic laminate. 1. A method of manufacturing an organic probe substrate structure comprising:attaching an organic laminate to a daughter card;planarizing a top surface of the organic laminate after attaching the organic laminate to the daughter card; andbuilding a plurality of probes on top of the organic laminate.2. The method of claim 1 , wherein planarizing the top surface of the organic laminate comprises milling a sacrificial layer on the top surface of the organic laminate.3. The method of claim 2 , wherein the top surface is planar.4. The method of claim 1 , wherein the daughter card includes a ledge on each side claim 1 , each of which includes a fastening hole claim 1 , wherein when mounted claim 1 , the daughter card is unsupported at corners of the daughter card.5. The method of claim 1 , wherein the attaching the organic laminate to the daughter card is through solder connection.6. The method of claim 5 , further comprising applying soldering paste on a bottom surface of the organic laminate and a top surface of the daughter card claim 5 , wherein attaching the organic laminate to the daughter card further comprises attaching the organic laminate to the daughter cards via the solder paste.7. The method of claim 6 , further comprising applying a filling material between the organic laminate claim 6 , the daughter card claim 6 , and about a plurality of solder connections.8. The method of claim 1 , wherein attaching the organic laminate to the daughter card further comprises attaching the organic laminate to the daughter card using a solder reflow process.9. The method of claim 1 , wherein the daughter card includes a plurality of through vias.10. The method of claim 9 , wherein the organic laminate includes a plurality of probe vias on a pitch that is less than a pitch of the through vias ...

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Номер записи: 83
05-01-2017 дата публикации

PROBE MODULE SUPPORTING LOOPBACK TEST

Номер: US20170003319A1
Автор: HO CHIH-HAO, Ku Wei-Cheng, LAI JUN-LIANG, Wei Hao
Принадлежит: MPI corporation

A probe module, which supports loopback test and is provided between a PCB and a DUT, includes an adapter, two probes, two inductive components provided at the adapter, and a capacitive component. The adapter has two connecting circuits. An end of each of the probes is connected to one of the connecting circuits, while another end thereof, which is a tip, contacts the DUT. Each of the inductive components has an end electrically connected to one of the connecting circuits, and another end electrically connected to the PCB through a conductive member, which is provided at the adapter, wherein two ends of the capacitive component are electrically connected to one of the connecting circuits, respectively. Whereby, the signal paths are changed by the differences between frequencies of signals, and the transmission path of high-frequency signals is effectively shortened. 1. A probe module , which is provided between a printed circuit board (PCB) and a device-under-test (DUT) to perform a loopback test , comprising:an adapter, which has a surface, and is provided with two connecting circuits;two probes, wherein each of which has an end electrically connected to one of the connecting circuits, while another end thereof, which is a tip, contacts a tested pad on the DUT;two inductive components provided at the surface of the adapter, wherein each of the inductive components has two ends, and one of the ends is electrically connected to one of the connecting circuits, while the other one of the ends is electrically connected to the PCB through a conductive member; anda capacitive component provided at the surface of the adapter, wherein the capacitive component has two ends, and one of the ends is electrically connected to one of the connecting circuits, while the other one of the ends is electrically connected to the other one of the connecting circuits.2. The probe module of claim 1 , wherein the adapter has a first surface claim 1 , a second surface opposite to the first ...

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Номер записи: 84
04-01-2018 дата публикации

DESIGNED ASPERITY CONTACTORS, INCLUDING NANOSPIKES, FOR SEMICONDUCTOR TEST, AND ASSOCIATED SYSTEMS AND METHODS

Номер: US20180003737A1
Автор: Johnson Morgan T., Preston Douglas A.
Принадлежит: Translarity, Inc.

Nanospike contactors suitable for semiconductor device test, and associated systems and methods are disclosed. A representative apparatus includes a package having a wafer side positioned to face toward a device under test and an inquiry side facing away from the wafer side. A plurality of wafer side sites are carried at the wafer side of the package. The nanospikes can be attached to nanospike sites on a wafer side of the package. Because of their small size, multiple nanospikes make contact with a single pad/solderball on the semiconductor device. In some embodiments, after detecting that the device under test passes the test, the device under the test can be packaged to create a known good die in a package. 125-. (canceled)26. An apparatus for testing semiconductor dies , comprising:a translator having a wafer side positioned to face toward a device under test, and an inquiry side facing away from the wafer side;a plurality of wafer-side sites carried by the translator at the wafer side of the translator; anda plurality of nanospikes carried by at least one wafer-side site.27. The apparatus of claim 26 , wherein the nanospikes are made of a material selected from a group consisting of tantalum nitride claim 26 , tungsten carbide claim 26 , hafnium carbide claim 26 , titanium carbide claim 26 , titanium diboride claim 26 , molybdenum carbide claim 26 , rhenium diboride claim 26 , and a combination thereof.28. The apparatus of claim 26 , wherein a cross-section of the nanospikes is selected from a group consisting of generally concave claim 26 , triangular claim 26 , convex claim 26 , and a combination thereof.29. The apparatus of claim 26 , wherein a shape of the nanospikes is selected from a group consisting of a star claim 26 , a blade claim 26 , a cross claim 26 , a spike claim 26 , and a combination thereof.30. The apparatus of claim 26 , wherein the nanospikes comprise a cover material.31. The apparatus of claim 26 , wherein the nanospikes are approximately 0 ...

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Номер записи: 85
02-01-2020 дата публикации

Probe Card Support Apparatus for Automatic Test Equipment

Номер: US20200003803A1
Автор: Nelson Scott
Принадлежит:

Various implementations of automatic test equipment are disclosed having a number of innovative features. In one implementation, the equipment includes a test head having a probe card support apparatus that provides stiffening support and/or planarization to the device under test (DUT) area of a probe card. In another implementation, the test head can include a planar surface and the wafer prober can include a corresponding planar surface. The planar surfaces can be brought into contact with each other to planarize the DUT area of the probe card and the wafer chuck in the wafer prober relative to each other. 1. A test head comprising:a probe card support apparatus;wherein the probe card support apparatus is configured to be positioned over a device under test (DUT) area of a probe card and provide stiffening support and planarization to the DUT area of the probe card; andwherein the test head is configured to be used with an automated test unit to test electronic components.2. The test head of comprising a probe card locking frame claim 1 , wherein the probe card support apparatus is positioned in a center area of the probe card locking frame.3. The test head of wherein the probe card support apparatus is configured to be connected to the probe card over the DUT area.4. The test head of wherein the probe card support apparatus comprises a fastener configured to be positioned over the DUT area of the probe card and connect the probe card support apparatus to the probe card.5. The test head of wherein the probe card support apparatus comprises a planar surface configured to contact an opposing planar surface on the probe card and planarize the test head relative to the probe card.6. The test head of wherein the test head comprises a fastener configured to connect the test head to a wafer prober.7. The test head of wherein the test head includes a planar surface configured to contact an opposing planar surface on the wafer prober to planarize the test head relative to ...

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Номер записи: 86
02-01-2020 дата публикации

MODULAR WIRELESS COMMUNICATION DEVICE TESTING SYSTEM

Номер: US20200003835A1
Автор: Ahmad Syed Toaha, Chew Bradley, Christie Eric, Eaton Marguerite, HAN Yen-Lin, Klaas Derek, Petrus Natasha Theodora, Powers Zachary, Taylor Grant, Tou William Ah
Принадлежит:

Arrangements and techniques for testing mobile devices within a test module. The test modules are portable and may be stacked to provide a modular testing system. A pulley system may be used to move an actuator arm horizontally in the X and Y directions. The actuator arm may be moved vertically in the Z direction such that a tip may engage a touchscreen of a mobile device being tested or a user interface element of the mobile device. 1. A test module for testing mobile devices , the test module comprising:a frame;a test bed coupled to the frame;a device platform coupled to the test bed and configured to hold a Device Under Test (DUT); a first belt and a second belt;', 'a first set of pulleys and a second set of pulleys; and', 'a first motor and a second motor,', 'wherein the first belt is engaged with the first set of pulleys and the first motor, and', 'wherein the second belt is engaged with the second set of pulleys and the second motor;, 'a motion system coupled to the frame and configured to move a carriage assembly horizontally along an X axis and a Y axis, the motion system comprisingan actuator arm coupled to the carriage assembly;an actuator arm mount coupled to the actuator arm, the actuator arm mount configured to move vertically along a Z axis and engage the DUT, the actuator arm mount comprising a tip configured to engage a screen of the DUT and one or more User Interface (UI) elements of the DUT; anda controller configured to control the motion system and the actuator arm to perform various tests with respect to the DUT.2. The test module of claim 1 , wherein the actuator arm mount comprises a shaft and a coil spring coupled to the tip.3. The test module of claim 1 , wherein the tip comprises a capacitive tip.4. The test module of claim 1 , further comprising:a sliding drawer movably coupled to the frame below the test bed, the sliding drawer being configured to slide at least partially out from below the test bed,wherein the controller is mounted on ...

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Номер записи: 87
02-01-2020 дата публикации

DIAGNOSTIC METHOD FOR INSPECTION DEVICE AND INSPECTION SYSTEM

Номер: US20200003860A1
Автор: Ueda Masanori
Принадлежит:

An inspection device includes a stage for mounting thereon a substrate, an attachment part to which a probe card that brings probes into contact with devices formed on the substrate is attached, a tester for applying electrical signals to the devices through the probe card to inspect electrical characteristics of the devices, and a connection member having multiple connectors to electrically connect the multiple connectors with the tester and the probe card while being disposed between the tester and the probe card. A diagnostic method for the inspection device performing a self-diagnosis of the multiple connectors includes attaching a diagnosis substrate instead of the probe card, performing a stabilization process for stabilizing a contact between the diagnosis substrate and the connectors of the connection member after the diagnosis substrate is attached, and diagnosing the connectors after the stabilization process. 1. A diagnostic method for an inspection device , wherein the inspection device includes a stage for mounting thereon a substrate , an attachment part , to which a probe card that brings probes of the probe card into contact with devices formed on the substrate is attached , a tester for applying electrical signals to the devices formed on the substrate through the probe card attached to the attachment part to inspect electrical characteristics of the devices , and a connection member having multiple connectors to electrically connect the multiple connectors with the tester and the probe card while being disposed between the tester and the probe card , the diagnostic method for the inspection device performing a self-diagnosis of the multiple connectors , comprising:attaching a diagnosis substrate instead of the probe card;performing a stabilization process for stabilizing a contact between the diagnosis substrate and the multiple connectors of the connection member after the diagnosis substrate is attached; anddiagnosing the multiple connectors ...

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Номер записи: 88
07-01-2021 дата публикации

PROBE HEAD AND CONDUCTIVE PROBE THEREOF

Номер: US20210003609A1
Автор: Huang YaJu, Wang Horngchieh
Принадлежит:

A probe head and a conductive probe thereof are provided. The conductive probe includes a first long lateral surface and an opposite second long lateral surface. The first long lateral surface and the second long lateral surface define a central axis there-between. The conductive probe includes a middle segment, an upper connecting segment and a lower connecting segment respectively extending from the middle segment in two opposite directions, and an upper contacting segment and a lower contacting segment respectively extending from the upper and the lower connecting segments in two opposite directions. The upper connecting segment includes an extension extending from the first long lateral surface in a direction away from the central axis. The upper contacting segment includes a protrusion extending from the first long lateral surface in a direction away from the central axis, and the extension and the protrusion are spaced apart from each other. 1. A probe head for an integrated circuit (IC) test , comprising:an upper die unit and a lower die unit that is spaced apart from the upper die unit; and a middle segment arranged between the upper die unit and the lower die unit;', 'an upper connecting segment and a lower connecting segment which respectively extend from two opposite ends of the middle segment in two opposite directions parallel to the central axis, wherein the upper connecting segment is arranged in the upper die unit, and the lower connecting segment is arranged in the lower die unit, and wherein the upper connecting segment includes an extension extending from the first long lateral surface in a direction away from the central axis;', 'an upper contacting segment extending from the upper connecting segment in a direction away from the middle segment along the central axis to protrude from the upper die unit, wherein the upper contacting segment includes a protrusion extending from the first long lateral surface in a direction away from the central axis ...

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Номер записи: 89
07-01-2021 дата публикации

SYSTEMS AND METHODS FOR MEASURING ELECTRICAL CHARACTERISTICS OF A MATERIAL USING A NON-DESTRUCTIVE MULTI-POINT PROBE

Номер: US20210003628A1
Автор: Faifer Vladimir N., Kayes Brendan M., Limpinsel Jan Moritz, Rodriguez Edwin J., SEMONIN Octavi Santiago Escala
Принадлежит:

This disclosure describes an elastic multi-contact probe that includes conductive strips each of which comprises a conductive elastomer; dielectric strips formed on a back surface of a respective conductive strip; and a layer of a thermoplastic formed on back surfaces of the dielectric strips. The disclosure also describes a method that includes measuring a first I-V curve between a pair of inner probes of the an elastic multi-contact probe based on a first current applied to a pair of outer probes; determining a first slope of a linear region of the first I-V curve; measuring a second I-V curve between the pair of inner probes based on a second current applied to the pair of inner probes; determining a second slope of a linear region of the second I-V curve; and calculating a sheet resistance and a contact resistivity of the semiconductor material based on the first and second slopes. 1. An elastic multi-contact probe comprising:a plurality of conductive strips each of which comprises a conductive elastomer, the plurality of conductive strips being spaced apart from each other, and a front surface of the conductive strips being configured to be placed on a surface of a substrate to be probed;a plurality of dielectric strips, each of the plurality of dielectric strips being formed on a back surface of a respective one of the plurality of conductive strips; anda single layer of a thermoplastic formed on back surfaces of the dielectric strips such that the dielectric strips separate the plurality of conductive strips from the single layer of the thermoplastic.2. The elastic multi-contact probe of claim 1 , wherein the plurality of conductive strips comprises a plurality of linear conductive strips parallel to each other.3. The elastic multi-contact probe of claim 2 , wherein the plurality of linear conductive strips includes:a pair of outer conductive strips having a first length, anda pair of inner conductive strips having a second length that is shorter than the ...

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Номер записи: 90
03-01-2019 дата публикации

CHEVRON INTERCONNECT FOR VERY FINE PITCH PROBING

Номер: US20190004089A1
Автор: Tadayon Pooya
Принадлежит:

An apparatus an apparatus comprising: a substrate having a plane; and an array of at least one conductive probe having a base affixed to the substrate, the at least one conductive probe having a major axis extending from the plane of the substrate and terminating at a tip, wherein the one or more conductive probes comprise at least three points that are non-collinear. 1. An apparatus comprising:a substrate having a plane; andan array of at least one conductive probe having a base affixed to the substrate, the at least one conductive probe having a major axis extending from the plane of the substrate and terminating at a tip,wherein the one or more conductive probes comprise at least three points that are non-collinear.2. The apparatus of claim 1 , wherein the at least one conductive probe comprises a first segment that extends from the substrate at a first angle with respect to the plane of the substrate claim 1 , the first segment having a first end affixed to the substrate and a second end distal to the first end claim 1 , and a second segment that extends from the second end of the first segment at a second angle that is rotated azimuthally 180 degrees from the first angle.3. The apparatus of claim 2 , wherein the at least one conductive probe has a chevron shape.4. The apparatus of claim 2 , wherein the at least one conductive probe comprises a third segment having a first end affixed to the second end of the third segment and extending therefrom at a third angle that is rotated azimuthally from the second angle claim 2 , terminating at a second end.5. The apparatus of claim 3 , wherein the at least one conductive probe comprises a fourth segment having a first end affixed to the second end of the third segment and extending therefrom to a second end at a fourth angle that is rotated azimuthally from the third angle claim 3 , terminating at a second end.6. The apparatus of claim 4 , wherein all of the segments are coplanar.7. The apparatus of wherein two or more ...

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Номер записи: 91
03-01-2019 дата публикации

Self-configuring component identification and signal processing system for a coordinate measurement machine

Номер: US20190004092A1
Автор: Scott Ellis Hemmings
Принадлежит: Mitutoyo Corp

A set of respective self-configuring probe interface circuit boards (SC-MPIC's) are disclosed for use with a measurement system comprising host electronics and respective interchangeable measurement probes. Member SC-MPICs each comprises: a local circuit (LS) for probe identification, signal processing and inter-board signal control; and higher-direction and lower-direction connectors “pointing” toward and away from the measurement probe, respectively. Member SC-MPICs establish a processing hierarchy by generating lower board present signals on their higher-direction connector, higher board present signals on their lower-direction connector, and determining whether they are the highest and/or lowest SC-MPIC based on receiving those signals from adjacent SC-MPICs. They can independently perform probe identification matching operations using probe identification data from compatible and incompatible probes, and the highest SC-MPIC does this first. Member SC-MPICs advantageously pass through or isolate signals from other members in the set depending on the hierarchy, various received signals, and internal processing.

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Номер записи: 92
03-01-2019 дата публикации

TESTING APPARATUS AND METHOD FOR MICROCIRCUIT TESTING WITH CONICAL BIAS PAD AND CONDUCTIVE TEST PIN RINGS

Номер: US20190004093A1
Автор: Andres Michael, Campion Dan, DeBauche John, Eshult Brian, Halvorson Brian, Rott Steve, Sherry Jeffrey
Принадлежит:

The test system provides an array of test probes. The probes pass through a first or upper probe guide retainer which has a plurality of slot sized to receive the probes in a way that they cannot rotate. A plurality of flex circuits at the different heights engage bottom probe ends at their respective height levels and flex circuits continue the electrical connection from the probes to a load board. The test probes are bonded to the flex circuits by ring shaped flowable conductive material. The flex circuits are biased against a load board by an elastomeric pad of spaced part conical projections. 1. A test system for testing integrated circuits (IC) comprising:a. an upper probe guide plate having an array of spaced apart upper apertures for receiving a test probe;b. an anti-intrusion layer proximate said upper probe guide plate, said layer having a like array of spaced apart lower apertures, collinearly aligned with the apertures of said upper guide, or receiving a test probe;c. an elastomeric block have a like a like array of spaced apart apertures, collinearly aligned with the passages of said upper guide, for receiving a test probe;d. a plurality of elongated test probes having a probe tip at its distal end and a connecting end at its proximal end, and a cross member extending generally orthogonally from each of said probes, said cross member being of such extent that it cannot pass through said upper apertures or said passages in said elastomeric material;e. said test probes passing through said upper and lower apertures and said passages, with said cross member located between said upper probe guide plate and said anti-intrusion later, so that the bias force of the elastomer drives said probes upwardly thorough said upper plate to a stop where said cross member engages said upper plate;f. said proximal ends of said test probes being group into a plurality of subgroups, each of the ends in said subgroup having the same height as measured from the lower probe ...

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Номер записи: 93
20-01-2022 дата публикации

Probe unit

Номер: US20220018877A1
Автор: Shuji Takahashi, Tsuyoshi Inuma
Принадлежит: NHK Spring Co Ltd

A probe unit includes: a first contact probe configured to come in contact with a signal electrode; a second contact probe configured to come in contact with a ground electrode; a probe holder including a first holder hole through which the first contact probe passes, and a second holder hole through which the second contact probe passes; and a conductive floating member including a first through hole to which the first contact probe is inserted and the signal electrode is inserted, and a second through hole to which the second contact probe is inserted and the ground electrode is inserted. The probe holder is configured such that at least an inner circumferential surface of the first holder hole has an insulating property, and the probe unit has a coaxial structure in which central axes of the first contact probe and the first through hole are aligned with each other.

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Номер записи: 94
20-01-2022 дата публикации

INSPECTION APPARATUS AND CONTROL METHOD FOR INSPECTION APPARATUS

Номер: US20220018889A1
Автор: NAKAYAMA Hiroyuki
Принадлежит:

An inspection apparatus includes a stage on which a substrate having an inspection target is placed, a probe card, a light irradiator, and a controller. The probe card has probes that supply a current to the inspection target. The light irradiator irradiates light to heat the substrate. The controller controls the light irradiator to excecute uniformly heating the inspection target by the light from the light irradiator, and heating an outer peripheral portion of the inspection target by the light from the light irradiator. 1. An inspection apparatus comprising:a stage on which a substrate having an inspection target is placed;a probe card having probes that supply a current to the inspection target;a light irradiator to irradiate light to heat the substrate; and uniformly heat the inspection target by the light from the light irradiator, and', 'heat an outer peripheral portion of the inspection target by the light from the light irradiator., 'a controller to control the light irradiator configured to2. The inspection apparatus of claim 1 , wherein the uniformly heating of the inspection target is switched to the heating of the outer peripheral portion of the inspection target by the controller based on heat generation of the inspection target.3. The inspection apparatus of claim 1 , wherein the uniformly heating of the inspection target is switched to the heating of the outer peripheral portion of the inspection target by the controller based on an internal variables for controlling the light irradiator.4. The inspection apparatus of claim 1 , further comprising:a tester connected to the probe card to inspect the inspection target,wherein the uniformly heating of the inspection target is switched to the heating of the outer peripheral portion of the inspection target by the controller based on a signal from the tester that indicates start of the inspection of the inspection target.5. The inspection apparatus of claim 1 , further comprising:a tester connected to the ...

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Номер записи: 95
20-01-2022 дата публикации

MEASURING APPARATUS AND TESTING APPARATUS

Номер: US20220018909A1
Автор: IIJIMA Junji
Принадлежит: HIOKI E.E. CORPORATION

A measuring apparatus includes: N pairs of probes that are respectively connected to a positive electrode and an external member of N rechargeable batteries that have a capacitance connected in parallel between the positive electrode and the external member; a scanner that selectively switches to one pair of probes out of the N pairs; a measuring apparatus that measures the voltage between the selected probes; and a controller. A plurality of resistance configurations to be connected between each pair of probes are provided. After a standby time has elapsed in a state where the N pairs of probes are connected to the positive electrodes and external members of the N rechargeable batteries, the controller outputs control signals to the scanner to successively switch to each pair of probes and causes the measuring apparatus to measure the voltage between the selected probes every time switching is performed. 1. A measuring apparatus comprising:a plurality of pairs of probes that are each connected to a pair of voltage measurement target locations on a plurality of measured objects that each have an equivalent of an internal capacitance connected in parallel between the pair of voltage measurement target locations;a switch that selectively switches to one pair of probes out of the plurality of pairs of probes according to a selective switching signal;a meter that measures a voltage between the probes in the pair of probes that have been selectively switched to according to the selective switching signal; anda controller that outputs the selective switching signal to the switch,wherein a plurality of resistance configurations to be connected between each pair of probes are provided, andafter a predetermined standby time has elapsed in a state where the plurality of probes have been connected to each pair of voltage measurement target locations on the plurality of measured objects, the controller outputs the selective switching signal to the switch to cause the switch to ...

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Номер записи: 96
08-01-2015 дата публикации

ELECTRIC CONNECTING APPARATUS

Номер: US20150008945A1
Автор: ARAI Osamu, Inoue Tatsuo, KIYOFUJI Hidehiro, SASAKI Kenji
Принадлежит:

An apparatus includes a probe card having a probe board with a conductive path electrically connected to a tester and probes enabling to respectively contact connection pads of a semiconductor wafer on a chuck top and moving relatively to the chuck top, and an elastic heat conducting member arranged between a working surface of the chuck top or the semiconductor wafer on the working surface and the probe board. The elastic heat conducting member can abut on the working surface of the chuck top or the semiconductor wafer on the working surface and the probe board when the probes do not abut on the respective corresponding connection pads and is elastically deformable not to prevent abutment between the probes and the respective corresponding connection pads. 1. An electric connecting apparatus having a working table holding on a working surface thereof a device under test having a plurality of electrodes and heating or cooling the device under test and electrically connecting the plurality of electrodes to a tester , comprising:a probe card having a probe board provided with a first surface thereof opposed to the tester and having formed therein a conductive path to be electrically connected to the tester and a plurality of probes provided on a second surface of the probe board to be connected to the conductive path so as to enable to respectively contact the plurality of electrodes of the device under test on the working table and moving relatively to the working table; andone or a plurality of elastic heat conducting member(s) arranged between the working surface of the working table or the device under test on the working surface and the probe board,wherein the elastic heat conducting member enables to abut on the working surface of the working table or the device under test on the working surface and the probe board in a state in which the plurality of probes do not abut on the plurality of respective corresponding electrodes and is elastically deformable not to ...

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Номер записи: 97
08-01-2015 дата публикации

ELECTRIC CONNECTING APPARATUS

Номер: US20150008946A1
Автор: ARAI Osamu, Inoue Tatsuo, KIYOFUJI Hidehiro
Принадлежит:

An apparatus includes a wiring base plate arranged on an upper side of a chuck top and having a wiring path connected to a tester, a probe card having a probe board spaced from the wiring base plate with a first surface thereof opposed to the wiring base plate and having a wiring path corresponding to the wiring path and probes provided on a second surface of the probe board to be connected to the wiring path and enabling to respectively contact connection pads of a semiconductor wafer on the chuck top, and an electric connector connecting the wiring base plate to the probe board by low heat conduction supporting members and decreasing heat conduction therebetween and electrically connecting the wiring paths.

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Номер записи: 98
08-01-2015 дата публикации

PROBER FOR TESTING DEVICES IN A REPEAT STRUCTURE ON A SUBSTRATE

Номер: US20150008948A1
Автор: Giessmann Sebastian, Werner Frank-Michael, Zieger Matthias
Принадлежит:

A prober for testing devices in a repeat structure on a substrate is provided with a probe holder plate, probe holders mounted on the plate, and a test probe associated with each holder. Each test probe is displaceable via a manipulator connected to a probe holder, and a substrate carrier fixedly supports the substrate. Testing of devices, which are situated in a repeat structure on a substrate, in sequence without a substrate movement and avoiding individual manipulation of the test probes in relation to the contact islands on the devices, is achieved in that the probe holders are fastened on a shared probe holder plate and the probe holder plate is moved in relation to the test substrate. 1. A prober for testing devices in a repeat structure on a substrate , the prober comprising:a substrate carrier configured to retain the substrate;a plurality of probe holders, wherein each of the plurality of probe holders is configured to retain a test probe of a plurality of test probes, and further wherein each of the plurality of probe holders includes a manipulator configured to move the test probe of the plurality of test probes responsive to a motion of an adjustment shaft; anda probe holder plate, wherein each of the plurality of probe holders is operatively attached to the probe holder plate, wherein the probe holder plate is contained within a vacuum chamber, and further wherein the probe holder plate is configured to translate relative to the substrate without changing a relative orientation of the plurality of test probes with respect to one another.2. The prober of claim 1 , wherein the adjustment shaft includes a linkage that extends to an outside of the vacuum chamber claim 1 , wherein the linkage is configured to control the motion of the adjustment shaft claim 1 , and further wherein the linkage is configured to provide for translation of the probe holder plate relative to the vacuum chamber without changing a relative orientation of the plurality of test ...

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Номер записи: 99
08-01-2015 дата публикации

BALL GRID ARRAY CONFIGURATION FOR RELIABLE TESTING

Номер: US20150008949A1
Автор: TORREITER Otto A., WENDEL Dieter
Принадлежит:

A semiconductor die with an array of contacts, where at least two contacts in adjacent positions have the same data signal during testing operations with a test probe. The adjacent contacts of the cluster allow the use of a larger test probe tip and/or greater tolerance on test probe tip alignment during testing operations. 1. A semiconductor die comprising:a substrate; anda plurality of contacts arranged in a first array;wherein:the plurality of contacts includes a first contact and a second contact;the first contact and the second contact are adjacent;the first contact and the second contact are structured and/or electrically connected to have an identical data signal at least during testing operations.2. The semiconductor die of wherein the first and second contacts are directly electrically connected to each other.3. The semiconductor die of wherein the first array is a staggered array.4. The semiconductor die of wherein:the first and second contacts are in consecutive columns; andthe first and second contacts are in consecutive rows.5. The semiconductor die of wherein the plurality of contacts further comprises:a third contact that is adjacent to both the first and second pads; andthe third pad is structured and/or electrically connected to have an identical data signal, at least during testing operations, to that of the first and second pads.6. The semiconductor die of wherein the plurality of contacts further comprises:a fourth contact adjacent to all of the first, second, and third contact; andthe fourth contact is structured and/or electrically connected to have an identical data signal to all of the first, second and third pads.7. A semiconductor die comprising:a substrate; anda plurality of input/output (I/O) pads arranged in an array having a plurality of rows and a plurality of columns;wherein:the plurality of I/O pads includes: a first plurality of cluster pads forming a first test cluster, a first ground pad, and a first power pad;the first plurality ...

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Номер записи: 100