Translucent ceramic with high refractive index

A ceramic material powder for a translucent ceramic is moulded with a binder and the resulting green compact is embedded in a ceramic powder containing at least one element in common with the green compact. The compact embedded in the ceramic powder is heated in an oxidising atmosphere to remove the binder. Thereafter the compact is fired in an oxygen concentration higher than that in the oxidising atmosphere to yield a translucent ceramic. The translucent ceramic has a refractive index of at least 1.9 and is paraelectric, having a perovskite crystal phase as a principal crystal phase. The translucent ceramic may be represented by Formula I: Ba (SnuZr1-u)xMgyTaz vOw, Formula II: Ba(ZrxMgyTaz)vOw or Formula III: Ba (SnuZr1-u)x(ZntMg1-t)yNbz vOw. The ceramic may be used as an optical part.

Mode converter and method of fabricating thereof

HYBRID PLANAR ONES BURIALS/BAR TRANSVERSE ELECTROMAGNETIC WAVE

MANUFACTURING PROCESS OF AN OPTICAL FILM WAVE LEADER

HYBRID PLANAR ONES BURIALS/BAR TRANSVERSE ELECTROMAGNETIC WAVE

HYBRID PLANAR ONES BURIALS/BAR TRANSVERSE ELECTROMAGNETIC WAVE

HYBRID PLANAR ONES BURIALS/BAR TRANSVERSE ELECTROMAGNETIC WAVE

HYBRID PLANAR ONES BURIALS/BAR TRANSVERSE ELECTROMAGNETIC WAVE

HYBRID PLANAR ONES BURIALS/BAR TRANSVERSE ELECTROMAGNETIC WAVE

HYBRID PLANAR ONES BURIALS/BAR TRANSVERSE ELECTROMAGNETIC WAVE

HYBRID PLANAR ONES BURIALS/BAR TRANSVERSE ELECTROMAGNETIC WAVE

HYBRID PLANAR ONES BURIALS/BAR TRANSVERSE ELECTROMAGNETIC WAVE

Multiphoton curing to provide encapsulated optical elements

Deep uv laser internally induced densification in silica glasses

GYPSUM PANEL HAVING UV-CURED MOISTURE RESISTANT COATING AND METHOD FOR MAKING THE SAME

A fibrous mat faced gypsum panel having on at least one of the facing sheets a moisture resistant, cured coating of a radiation curable, e.g., UV curable, polymer.

WAVE GUIDE WITH CHANNEL FOR OPTICAL SUBSTRATE

L'invention présente un guide d'onde comportant un canal (12) sur un substrat optique (11), l'indice de réfraction de ce canal étant supérieur à celui du substrat. Ce guide d'onde comporte au moins une couche guidante (13) agencée sur le canal, l'indice de cette couche guidante étant supérieur à celui du substrat. De plus, le canal (12) est intégré dans le substrat (11). Avantageusement, le guide comporte de plus une couche de recouvrement (14) disposée sur la couche guidante (13), l'indice de cette couche de recouvrement étant inférieur à celui de la couche guidante et à celui du canal. L'invention vise également une méthode de fabrication de ce guide d'onde.

OPTICAL WAVEGUIDE HAVING A HYBRID CORE

This invention discloses an optical waveguide having a hybrid core useful in the fabrication of a host of active and passive optical devices. The core is primarily inorganic glass having a lesser portion of polymer grafted therein. Preferably, the polymer has a substantially different thermo-optic coefficient. By appropriately selecting a polymer with a suitable thermo-optic coefficient a temperature stable waveguide can be fabricated. Active devices having a smaller section of polymer can be realized with heaters for varying the temperature and hence the refractive index of the polymer section.

在光学衬底上有一个通道的波导管

... 本发明展现一种波导，其中有在光学衬底11上面的一个通道12，通道12的折射率大于衬底的折射率，在这个波导中至少还有一个在通道上安排的波导层13，波导层13的折射率也大于衬底的折射率，而且通道12是集成在衬底11上的。通常，这个波导中还有一层在波导层13上沉积的覆盖层14，这个覆盖层的折射率小于波导层的折射率和通道的折射率。本发明还在于一种制造这种波导的方法。 ...

OPTICAL DIVIDER 2 TOWARDS N IN OPTICS INTEGREE

GUIDE WAVE COMPRISING a CHANNEL ON an OPTICAL SUBSTRATE

GUIDE WAVE COMPRISING a CHANNEL ON an OPTICAL SUBSTRATE

POLARIZATION ROTATOR INTEGRATED OPTICAL DEVICE IN A GLASS SUBSTRATE AND METHOD FOR MAKING SAME

L'invention concerne un dispositif optique (200) comportant au moins un guide d'onde (203) intégré dans un substrat (201) en verre, dans lequel le guide (203) a la forme d'un ruban torsadé autour de son axe central longitudinal.

INTEGRATED CIRCUIT COMPRISING AN ACTIVE DEVICE OF A LUMINOUS FLUX CONTAINMENT

Le circuit intégré (IC) comprend dans un substrat (F) semiconducteur, un dispositif actif (DA) de confinement d'un flux lumineux comportant une nervure de confinement (NC) séparée de deux zones dopées (ZD) par deux tranchées (T), chaque zone dopée (ZD) comportant une zone de prise de contact (PC) sur une face supérieure (FS) de cette zone dopée (ZD). Chaque tranchée (T) s'évase depuis sa paroi de fond (PF) vers la face supérieure (FS) de la zone dopée (ZD) correspondante.

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME

WAVELENGTH SELECTOR FOR WAVELENGTH DIVISION MULTIPLEXING NETWORK

PURPOSE: A wavelength selector for wavelength division multiplexing network is provided to shorten the length of an all-optical switch and enhance the switching speed by forming an optical switching portion with a Michelson interferometer. CONSTITUTION: A wavelength selector for wavelength division multiplexing network includes an input portion, a demultiplexing portion(410), and an optical switching portion(420). The demultiplexing portion(410) which is coupled to the input portion divides the input beam of the input portion into beams of different wavelengths and outputs the divided beams. The optical switching portion(420) includes an all-optical switch(424) and a mirror(426). The all-optical switch(424) is used for transmitting the output beams of the demultiplexing portion(410). The mirror(426) is used for reflecting the beams of the all-optical switch(424) to the opposite direction. The optical switching portion(420) selects the beam having a particular wavelength by a Michelson interferometer ...

INTEGRATED PHOTONICS INCLUDING WAVEGUIDING MATERIAL

A photonic structure can include in one aspect one or more waveguides formed by patterning of waveguiding material adapted to propagate light energy. Such waveguiding material may include one or more of silicon (single-, poly-, or non-crystalline) and silicon nitride.

MICROPHOTONIC WAVEGUIDE INCLUDING CORE/CLADDING INTERFACE LAYER

The invention provides a waveguide with a waveguide core having longitudinal sidewall surfaces, a longitudinal top surface, and a longitudinal bottom surface that is disposed on a substrate. An interface layer is disposed on at least one longitudinal sidewall surface of the waveguide core. A waveguide cladding layer is disposed on at least the waveguide core sidewall and top surfaces, over the interface layer. The waveguide of the invention can be produced by forming a waveguide undercladding layer on a substrate, and then forming a waveguide core on the undercladding layer. An interface layer is then formed on at least a longitudinal sidewall surface of the waveguide core, and an upper cladding layer is formed on a longitudinal top surface and on longitudinal sidewall surfaces of the waveguide core, over the interface layer.

PHOTONIC CRYSTAL WAVEGUIDE WITH REDUCED COUPLING LOSS TOWARDS THE SUBSTRATE

A photonic device and methods of formation that provide an area providing reduced optical coupling between a substrate and an inner core of the photonic device are described. The area is formed using holes in the inner core and an outer cladding. The holes may be filled with materials which provide a photonic crystal. Thus, the photonic device may function as a waveguide and as a photonic crystal.

METHOD AND DEVICE FOR OPTICAL SWITCHING AND VARIABLE OPTICAL ATTENUATION

An optical switching device for switching M input signals into N output signals, wherein M and N are each equal to or greater than one, including a mode division multiplexer to join the M input signals into a first multi-mode signal having M initial modes, a mode converter to convert the first multi-mode signal into a second multi-mode signal having N converted modes, and a mode division demultiplexer to separate the second multi-mode signal into the N output signals, wherein the converter is able to be controllably activated such that the N converted modes are separated by the demultiplexer to the N output signals according to a desired scheme.

DIELECTRIC-IN-DIELECTRIC DAMASCENE PROCESS FOR MANUFACTURING PLANAR WAVEGUIDES

Photonic light circuits including one or more optical waveguides and one or more waveguide features and methods for manufacturing photonic light circuits including one or more optical waveguides. One aspect of this invention includes methods for manufacturing planar waveguide based devices including the steps of removing a portion of an exposed surface of a substrate (10) to form a first cavity (12), depositing a layer (14) of first optical material on the exposed substrate surface in an amount sufficient to fill the first cavity (12) with the first optical material and to cover at least a portion of the exposed substrate surface; and removing at least a portion of the first optical material layer to form at least one planar waveguide. In another aspect, this invention is a method for manufacturing a planar waveguide including at least one feature by the further steps including removing at least a portion of the first optical material (14) located in the first cavity to form a second cavity ...

LIGHT COMBINING/DIVIDING ELEMENT AND LIGHT MODULATOR

Provided is a light combining/dividing element which allows generation of reflected light to be suppressed, as compared with a conventional light combining/dividing element. A core of the light combining/dividing element includes an MMI part which is connected to a first core and to each of a second core and a third core. A width of a rib of a rib waveguide of the MMI part becomes narrower from a width equal to that of a channel waveguide to a width equal to that of the first core.

Silica-based optical waveguide circuit and fabrication method thereof

A silica-based optical waveguide circuit serves to reduce the time required to production while allowing a spot size converting function to work sufficiently. In a silica-based optical waveguide circuit comprising an input/output waveguide core formed to be thicker than an waveguide core and a tapered portion for connecting the input/output waveguide core and the waveguide core, wherein the waveguide circuit further has a core layer at each side of the input/output waveguide core, a thickness T of the core layer at the side of the input/output waveguide core is smaller than the thickness H of the input/output waveguide core.

Integrated structure and manufacturing method thereof

A method for fabricating an integrated structure, using a fabrication system having a CMOS line and a photonics line, includes the steps of: in the photonics line, fabricating a first photonics component in a silicon wafer; transferring the wafer from the photonics line to the CMOS line; and in the CMOS line, fabricating a CMOS component in the silicon wafer. Additionally, a monolithic integrated structure includes a silicon wafer with a waveguide and a CMOS component formed therein, wherein the waveguide structure includes a ridge extending away from the upper surface of the silicon wafer. A monolithic integrated structure is also provided which has a photonics component and a CMOS component formed therein, the photonics component including a waveguide having a width of 0.5 μm to 13 μm.

Translucent ceramic, method of producing the same and optical devices

A ceramic material powder for a translucent ceramic is molded with a binder, and the resulting green compact is embedded in a ceramic powder having the same composition with the ceramic material powder. After removing the binder, the green compact embedded in the ceramic powder is fired in an atmosphere having an oxygen concentration higher than that in the removal procedure of the binder and thereby yields a translucent ceramic represented by Formula I: Ba{(SnuZr1-u)xMgyTaz}vOw, Formula II: Ba(ZrxMgyTaz)vOw or Formula III: Ba{(SnuZr1-u)x(ZntMg1-t)yNbz}vOw. The translucent ceramic has a refractive index of 1.9 or more and is paraelectric.

Optically active waveguide device comprising a channel on an optical substrate

The invention concerns an optically active device comprising an optical waveguide core on an optical substrate (11, 15, 20) and a control element (32-33, 37, 40). The core comprises a channel (12, 17, 25, 35-36, 38-39) and at least an active layer (13, 18, 22) arranged on said channel, the refractive index of the channel and that of the active layer being higher than that of the substrate. The optical substrate (11, 15, 20) has a mobile ion concentration less than 0.01%. Advantageously, the device further comprises a covering layer (14, 19, 23) arranged on the active layer (13, 18, 22), the index of said covering layer being less than that of the active layer and of the channel. The invention also concerns a method for making said device.

Electrode Pad on Conductive Semiconductor Substrate

An electrode pad on a semiconductor substrate having a reduced capacitance of an electrode pad portion and allowing control of a characteristic impedance for a practical electrode pad size is provided. A mesa-stripe type optical waveguide formed by stacking an n-InP clad layer 2, an i layer 3 and a p-InP clad layer and p type contact layer 4 is formed on an n-InP substrate 1, an insulating material film 8 having a mesa-shaped deposited portion 8c near the optical waveguide is formed on the n-InP substrate 1, an electrode 11a and wiring electrodes 11b and 11c for supplying an electrical signal to the optical waveguide are placed on the optical waveguide and the insulating material film 8, respectively, and an electrode pad 10 is placed on the top surface of the mesa-shaped deposited portion 8c, so that the n-InP substrate 1 and the electrode pad 10 have a predetermined interval t1 (about 17 to 29 μm) ...

Method for separating silica waveguides

A method is provided for separating silica waveguides made in multiple units on a wafer at the end of fabrication. Streets are formed between adjacent waveguides by etching the IC material to a substrate. The substrate is then sawed along the streets.

Temperature insensitive optical waveguides and optical devices using the same

In order to obtain a temperature insensitive optical waveguide which is formed on a substrate and comprises a core and a cladding whose refractive index is less than that of said core, the substrate has a zero or negative coefficient of thermal expansion in the range between 0° C. and 65° C.

Optical radiation detection system comprising an electric parameter measuring circuit

An optical radiation detection system (100) comprising: an optical medium (1) structured to define a region (5) suitable for transmitting an optical radiation and being associated to at least one electric parameter varying as a function of the optical radiation concerning said region; at least one electrode (2, 3) electrically coupled to the optical medium (1), and spaced from said region (5), an electric power generator (4) connected to said at least one electrode (2) and structured to provide an electric signal (Se) to be applied to the optical medium. Further, the system comprises an electric measuring circuit (50) connected to said at least one electrode (2) and structured to provide a measuring electric signal (SM) representing a variation of said at least one electric parameter.

Semiconductor device and manufacturing method of the same

A rectangular optical waveguide, an optical phase shifter and an optical modulator each formed of a semiconductor layer are formed on an insulating film constituting an SOI wafer, and then a rear insulating film formed on a rear surface of the SOI wafer is removed. Moreover, a plurality of trenches each having a first depth from an upper surface of the insulating film are formed at a position not overlapping with the rectangular optical waveguide, the optical phase shifter and the optical modulator when seen in a plan view in the insulating film. As a result, since an electric charge can be easily released from the SOI wafer even when the SOI wafer is later mounted on the electrostatic chuck included in the semiconductor manufacturing apparatus, the electric charge is less likely to be accumulated on the rear surface of the SOI wafer.

Method for fabricating optical devices by assembling multiple wafers containing planar optical waveguides

A method for fabricating optical devices comprises the steps of preparing a first substrate wafer with at least one buried optical waveguide on an approximately flat planar surface of the substrate and a second substrate wafer with at least a second buried optical waveguide. The waveguides so formed may be straight or be curved along the surface of the wafer or curved by burying the waveguide at varying depth along its length. The second wafer is turned (flipped) and bonded to the first wafer in such a manner that the waveguides, for example, may form an optical coupler or may crossover one another and be in proximate relationship along a region of each. As a result, three dimensional optical devices are formed avoiding conventional techniques of layering on a single substrate wafer. Optical crossover angles may be reduced, for example, to thirty degrees from ninety degrees saving substrate real estate. Recessed areas may be provided in one or the other substrate surface reducing crosstalk ...

Method for the collective production of a plurality of optoelectronic chips

A method is provided for producing, on a wafer-scale, a plurality of optoelectronic chips, including: providing a receiver substrate including a plurality of elementary zones, each being configured to contain one optoelectronic chip, and each including at least one coupling waveguide integrated into the receiver substrate and configured to be optically coupled to a first optoelectronic component; transferring a plurality of pads to the elementary zones such that the pads partially cover the at least one coupling waveguide; and producing the first optoelectronic component from the pads such that each first optoelectronic component is facing the at least one coupling waveguide of a corresponding elementary zone, and, following the transferring step, each pad of the plurality of pads extends over a set of at least two adjacent elementary zones, so as to partially cover the at least one coupling waveguide of each of the adjacent elementary zones.

Devices and methods for etch loading planar lightwave circuits

This relates to optical devices such as planar light-wave components/circuits which are designed to have a high waveguide pattern density effecting a higher etch selectivity and overall improved dimensional control of the functional waveguides on the optical device.

Reflective semiconductor optical amplifier (R-SOA) and superluminescent diode (SLD)

Provided are a reflective semiconductor optical amplifier (R-SOA) and a superluminescent diode (SLD). The R-SOA includes: a substrate; an optical waveguide including a lower clad layer, an active layer independent of the polarization of light, and an upper clad layer sequentially stacked on the substrate, the optical waveguide comprising linear, curved, and tapered waveguide areas; and a current blocking layer formed around the optical waveguide to block a flow of current out of the active layer, wherein the linear and curved waveguide areas have a single buried hetero (BH) structure, and the tapered waveguide area has a dual BH structure.

Electrode pad on conductive semiconductor substrate

An electrode pad on a conductive semiconductor substrate comprises a conductive substrate (21), an insulating material film (28) formed on the conductive substrate (21), an electrode pad (30) formed on the insulating material film (28), and a wiring electrode (31b, 31c) formed on said insulating material film (28), connected to said electrode pad (30), and having a width different from that of said electrode pad (30), wherein a first thickness (t2) of a first region of said insulating material film (28) on which at least said electrode pad (30) is formed is greater than a second thickness (to) of a second region of said insulating material film (28) on which at least part of said wiring electrode (31b, 31c) is formed and which is a region other than said first region, wherein the width of said wiring electrode (31b, 31c) is smaller than the size of said electrode pad (30), and wherein a trench portion (28c) is formed in said conductive substrate (21), and a part of the first region of said ...

Optical waveguide and method of its manufacture

An optical waveguide capable of having various characteristics and a method of manufacture thereof as well as a method of manufacturing a crystal film are provided. An optical functional material KTaxNb1-xO3 is used as an optical waveguide. The input optical signal (3) is transmitted to the KTaxNb1-xO3 film (2). The KTaxNb1-xO3 film (2) undergoes changes in optical property when an external voltage signal is applied to the electrode (4). Therefore, as it passes through the KTaxNb1-xO3 film (2), the input optical signal is modulated by the characteristic change. The modulated optical signal is taken out as an output optical signal (5). Alternatively the optical functional material can be K1-vLivTaxNb1-xO3.

METHOD OF CONNECTING OPTICAL DEVICE FOR PROVIDING ENCAPSULATED OPTICAL ELEMENTS

PROBLEM TO BE SOLVED: To provide a method of connecting a first encapsulated optical element and a second optical element. SOLUTION: In the method of connecting a first optical device 100 in which a waveguide 101 is processed and formed in a body of a photopolymerizable composition and a second optical device 102 having a glass fiber core 112 surrounded by cladding, the end 118 of the glass fiber core is in substantial alignment with the end 104 of the waveguide, and when laser light pulses 122 and 124 are made incident on the waveguide, the glass fiber core or both of them, light is transmitted through a region 110, and the portion of the region absorbs it and is photocured. The waveguide is thus completed, and the waveguide is optically coupled to a glass fiber. After it is coupled, the first optical device is subjected to blanket irradiation to photocure a matrix material 108 and form a protective encapsulating matrix around the waveguide. COPYRIGHT: (C)2011,JPO&INPIT ...

Integrated structure and manufacturing method thereof

An integrated optoelectronic device structure comprising CMOS circuitry and optical waveguides is manufactured using a fabrication system having a CMOS line and a photonics line. A first photonics component (eg a waveguide) is formed in a silicon wafer in the photonics line; the wafer is transferred from the photonics line to the CMOS line; and in the CMOS line, a CMOS component is fabricated in the silicon wafer. Additionally, a monolithic integrated structure includes a silicon wafer with a ridge waveguide and CMOS circuitry. The waveguide has a width of 0.5µm to 13µm.

OPTICAL 2 X N ACHIEVEMENT DIVISOR IN INTEGRATED OPTICS

HYBRID PLANAR ONES BURIALS/BAR TRANSVERSE ELECTROMAGNETIC WAVE

HYBRID PLANAR ONES BURIALS/BAR TRANSVERSE ELECTROMAGNETIC WAVE

HYBRID PLANAR ONES BURIALS/BAR TRANSVERSE ELECTROMAGNETIC WAVE

HYBRID PLANAR ONES BURIALS/BAR TRANSVERSE ELECTROMAGNETIC WAVE

HYBRID PLANAR ONES BURIALS/BAR TRANSVERSE ELECTROMAGNETIC WAVE

HYBRID PLANAR ONES BURIALS/BAR TRANSVERSE ELECTROMAGNETIC WAVE

HYBRID PLANAR ONES BURIALS/BAR TRANSVERSE ELECTROMAGNETIC WAVE

METHOD FOR THE COLLECTIVE PRODUCTION OF A PLURALITY OF OPTOELECTRONIC CHIPS

L'invention porte sur un procédé de réalisation collective d'une pluralité de puces optoélectroniques (P1, P2), comportant les étapes suivantes : i) fourniture d'un substrat de réception (1), comportant une pluralité de zones dites élémentaires (z1, z2), chacune comportant au moins un guide d'onde dit de couplage (31, 32), intégré dans le substrat de réception (1); ii) report d'une pluralité de plots (6) sur les zones élémentaires (z1, z2), de sorte que les plots (6) recouvrent partiellement les guides d'onde de couplage (31, 32); iii) réalisation desdits premiers composants optoélectronique (21, 22) à partir desdits plots (6); caractérisé en ce que, à la suite de l'étape de report, chaque plot (6) s'étend sur un ensemble (E) d'au moins deux zones élémentaires adjacentes (z1, z2).

聚酰亚胺光学波导管的制造方法

... 聚酰亚胺光学波导管的制造方法，包括(a)在基材上形成包层下层，(b)在该包层下层上形成光敏聚酰亚胺树脂前体组合物层，(c)用紫外线经掩模照射除了相应于芯图案区域之外的光敏聚酰亚胺树脂前体组合物层，随后在曝光后加热，(d)通过显影去掉未紫外线曝光的区域，(e)加热该层中的紫外线曝光区域，使酰亚胺化紫外线曝光区域，形成具有所需图案的包层，(f)用聚酰胺酸涂敷与芯图案对应的区域和包层的一个表面，该聚酰胺酸形成比包层的聚酰亚胺树脂有更高折射率的聚酰亚胺树脂，通过加热使该聚酰胺酸酰亚胺化以形成芯层，和(g)在该芯层上形成包层上层。 ...

AN OPTICAL BEAM SPOT SIZE CONVERTOR

FILM OPTICAL WAVEGUIDE AND METHOD FOR MANUFACTURE THEREOF, AND ELECTRONIC INSTRUMENT DEVICE

Il est prévu un mélange d’un monomère d’uréthane et d’un oligomère d’uréthane ayant un groupe représenté sur la figure 4 et un initiateur de polymérisation, qui est un précurseur d’un élastomère présentant un module de flexion d’élasticité inférieur ou égal à 1.000 MPa après cuisson, servant de matériau de placage. Le matériau de placage est appliqué sur une plaque de base et comprimé du dessus par une matrice de pressage et étalé en un film mince. Après polymérisation du matériau de placage pour constituer une couche plaquée inférieure, un noyau se forme sur la couche plaquée inférieure. Ensuite, le matériau de placage ci-dessus est appliqué sur la couche plaquée inférieure, est comprimé par une matrice de pressage du dessus et étalé en un film mince. Ce dernier matériau de placage est polymérisé pour constituer une couche plaquée supérieure. Finalement, on retire la plaque de base et l’on obtient un guide d’onde optique de film capable de se replier sur un petit rayon de courbure.

HIGH-INDEX CONTRAST DISTRIBUTED BRAGG REFLECTOR

A distributed Bragg reflector has a sectioned waveguide with a high index of refraction. The waveguide is disposed within a medium having a relatively low index of refraction. Each of the sections of the waveguide are coupled with a thin waveguide having a high index of refraction. In one embodiment, AD wire and waveguide sections are formed of the same high index material.

SURFACE WAVEGUIDE AND METHOD OF MANUFACTURE

A surface waveguide (100) is disclosed. In the illustrative embodiment, the waveguide (100) has a core (110) and an upper (108) and lower (102) cladding. The core (110) has a thickness that is greater than the critical thickness of the material that composes the core. This is achieved by depositing/growing the core as a conformal layer within a region (104) that is recessed from the planar surface of the lower cladding, wherein the recessed region (104) has a width that is no more than twice the critical thickness of the core material.

POSITIVE TYPE RADIOSENSITIVE COMPOSITION AND METHOD FOR FORMING PATTERN

A positive type radiosensitive composition comprising the following components (A) to (C): (A) at least one compound selected from the group consisting of a hydrolyzable silane compound represented by the general formula (1): (R1)pSi(X)4-p (1) wherein R1 represents a non-hydrolyzable organic group having 1 to 12 carbon atoms, X represents a hydrolyzable group, and p represents an integer of 0 to 3, a hydrolyzate thereof and a condensed product therefrom; (B) an agent generating an acid by the irradiation with a light; and (C) a basic compound. The use of the above composition allows the production of a cured product excellent in the precision of a pattern and the like, and the above composition can be used as a material for forming an optical wave guide.

PLANAR OPTICAL COMPONENT FOR COUPLING LIGHT TO A HIGH INDEX WAVEGUIDE, AND METHOD OF ITS MANUFACTURE

A planar optical component (30) is presented that defines an optical path for light propagation in between a first waveguide (103) and an optical fiber. The optical component (30) comprises a waveguide structure defining a transition region between the first waveguide (103) and the optical fiber. The transition region is formed by first and second cladding layers and first and second core segments (C1, C2). The first core segment (C1) is formed by a core of said first waveguide (103) having a refractive index n1, and the second core segment (C2) is formed by a core of a second connecting waveguide (102) having a refractive index n2 Подробнее

Temperature control of components on an optical device

The optical device includes a waveguide positioned on a base and a modulator positioned on the base. The modulator includes an electro-absorption medium. The waveguide is configured to guide a light signal through the modulator such that the light signal is guided through the electro-absorption medium. A heater is positioned on the electro-absorption medium such that the electro-absorption medium is between the base and the heater.

Optoelectronic device and method of manufacturing thereof

An optoelectronic device and method of manufacturing the same. The device includes: a layer disposed above a substrate, the layer having a first cavity therein, which cavity is at least partially defined by an inclined interface between the cavity and an insulating liner, the interface being disposed at an angle relative to the substrate of greater than 0° and less than or equal to 90°; and a regrown semiconductor material, providing or forming a part of a waveguide, the regrown semiconductor material being at least partly disposed in the first cavity and including an inclined interface between the regrown semiconductor material and the insulating liner, the interface being disposed at an angle relative to the substrate of greater than 0° and less than or equal to 90°.

Active optical MMI waveguide device

An optical waveguide device has a hybrid core and a cladding. A first waveguide having a glass core is coupled to a polymer waveguide disposed adjacent and parallel to the first waveguide such that the respective cores are contiguous in a coupling region. The polymer is a thermo-optically active polymer. A heater is provided over the coupling region and the refractive index of the polymer is varied by applying heat to the region. By application of sufficient heat, the refractive index of the polymer can be changed to approach the refractive index of the cladding whereby the device acts as a simple glass waveguide. In the absence of heat, the device acts as a MMI coupler.

MICRO-CHANNEL STRUCTURE WITH VARIABLE DEPTHS

A micro-channel structure having variable depths includes a substrate and a cured layer formed on the substrate. At least first and second micro-channels are embossed in the cured layer. The first micro-channel has a bottom surface defining a first depth and the second micro-channel has a bottom surface defining a second depth different from the first depth. A cured electrical conductor is making a micro-wire is formed in each of the first and second micro-channels over their respective bottom surfaces.

METHODS AND APPARATUS PROVIDING THERMAL ISOLATION OF PHOTONIC DEVICES

Described embodiments include photonic integrated circuits and systems with photonic devices, including thermal isolation regions for the photonic devices. Methods of fabricating such circuits and systems are also described. 1. An integrated structure comprising:a substrate having an upper surface;a trench formed in the upper surface of the substrate;a device formation region over the upper surface of the substrate;a temperature-sensitive photonic device formed in the device formation region;a heating device formed in the device formation region for heating the temperature-sensitive photonic device, wherein the heating device is located over the trench; anda thermal isolation region formed under the heating device, wherein the thermal isolation region is located in the trench, such that the thermal isolation region is provided in the upper surface of the substrate, and wherein the thermal isolation region thermally isolates the substrate from the heating device.2. The integrated structure of claim 1 , wherein the thermal isolation region and the trench both extend under the temperature-sensitive photonic device.3. The integrated structure of claim 1 , further comprising a waveguide formed in the device formation region claim 1 , and wherein the thermal isolation region and the trench both extend under the waveguide.4. The integrated structure of claim 1 , further comprising a waveguide formed in the device formation region claim 1 , and wherein the waveguide is separated from the trench by a portion of the substrate.5. The integrated structure of claim 1 , wherein the first thermal isolation region comprises a physical gap between the heating device and substrate.6. The integrated structure of claim 5 , wherein the physical gap is further provided on a side of the heating device.7. The integrated structure of claim 1 , wherein the thermal isolation region is a first thermal isolation region claim 1 , and further comprising a second thermal isolation region under the ...

Optical device, photodetection system, and method for manufacturing the same

An optical device includes a first substrate having a first surface, a second substrate having a second surface, at least one optical waveguide, and a plurality of spacers, disposed on at least either the first surface or the second surface, that include a first portion and a second portion. The first portion of the plurality of elastic spacers is at least one elastic spacer located in a region between the first substrate and the second substrate in which the first substrate and the second substrate overlap each other as seen from an angle parallel with a direction perpendicular to the first surface. The second portion of the plurality of elastic spacers is at least one elastic spacer located in a region in which the first substrate and the second substrate do not overlap each other as seen from an angle parallel with the direction perpendicular to the first surface.

Process for producing polyimide optical waveguide

This invention provides a process for producing a polyimide optical waveguide, which comprises the steps of: (a) forming an undercladding layer on a substrate, (b) forming a photosensitive polyimide resin precursor composition layer on the undercladding layer, (c) irradiating the photosensitive polyimide resin precursor composition layer, excepting a region corresponding to a core pattern, with a UV light through a mask, followed by heating after exposure, (d) removing a UV-unexposed area of the layer by development, (e) heating a UV-exposed area of the layer to imidize the UV-exposed area, thereby forming a cladding layer having a desired pattern, (f) coating the region corresponding to the core pattern and a surface of the cladding layer with a polyamic acid that forms a polyimide resin having a higher refraction index than the polyimide resin of the cladding layer, and imidizing the polyamic acid by heating to form a core layer, and (g) forming an overcladding layer on the core layer ...

半導体光素子を作製する方法

ГИПСОВАЯ ПАНЕЛЬ, ИМЕЮЩАЯ УФ-ОТВЕРЖДАЕМОЕ ВЛАГОСТОЙКОЕ ПОКРЫТИЕ, И СПОСОБ ЕЕ ИЗГОТОВЛЕНИЯ

... 1. Гипсовая панель, содержащая гипсовую сердцевину, имеющую плоскую первую лицевую поверхность и плоскую вторую лицевую поверхность, волокнистый облицовочный материал, прикрепленный, по меньшей мере, к первой лицевой поверхности; и радиационно-отвержденное покрытие из радиационно-отверждаемой композиции на волокнистом облицовочном материале. 2. Гипсовая панель по п.1, в которой волокнистый облицовочный материал представляет собой облицовочный материал в виде многослойной бумаги. 3. Гипсовая панель по п.1, в которой волокнистый облицовочный материал представляет собой нетканый мат из минеральных волокон. 4. Гипсовая панель по п.3, в которой волокнистый облицовочный материал представляет собой облицовочный материал в виде однослойного стекловолокнистого мата. 5. Гипсовая панель по п.1, в которой волокнистый облицовочный материал представляет собой тканый либо нетканый мат из синтетических волокон. 6. Гипсовая панель по п.1, в которой волокнистый облицовочный материал представляет собой смесь ...

HYBRIDE PLANARE VERGRABENE / STEG-WELLENLEITER

Optical bus cross-coupler for data traffic within multiple modules arranged in rows and columns, feeds data traffic from upstream or downstream bus users through optical part of bus coupler

The data traffic from upstream or downstream bus users are fed through the optical part of the bus coupler. Thereby, only a small insertion loss is suffered by the optical bus signals, dependent on the material used, and the bus coupler does not need to supply any additional energy for the transport of these data.

Fotodetektor mit einer sich verjüngenden Wellenleiterstruktur

Techniken und Mechanismen zum Bereitstellen einer effizienten Lenkung von Licht zu einem Fotodetektor mit einer sich verjüngenden Wellenleiterstruktur. Bei einer Ausführungsform umfasst eine Verjüngungsstruktur eines Halbleiterbauelements ein im Wesentlichen einkristallines Silizium. Ein vergrabenes Oxid liegt unter dem monokristallinen Silizium der Verjüngungsstruktur und grenzt daran an, und ein polykristallines Si ist unter dem vergrabenen Oxid angeordnet. Während des Betriebs des Halbleiterbauelements wird Licht in der Verjüngungsstruktur umgelenkt und über eine erste Seite eines Germanium-Fotodetektors empfangen. Bei einer weiteren Ausführungsform können eine oder mehrere, auf einer fernen Seite des Germanium-Fotodetektors positionierte Spiegelstrukturen dafür sorgen, dass ein Teil des Lichts zum Germanium-Fotodetektor zurückreflektiert wird.

PRODUCTION OF MATERIALS FOR TRANSVERSE ELECTROMAGNETIC WAVE WITH STAGE REFRACTIVE INDEX

OPTICAL TRANSVERSE ELECTROMAGNETIC WAVE AND MANUFACTURING PROCESS FOR IT

HYBRID PLANAR ONES BURIALS/BAR TRANSVERSE ELECTROMAGNETIC WAVE

HYBRID PLANAR ONES BURIALS/BAR TRANSVERSE ELECTROMAGNETIC WAVE

HYBRID PLANAR ONES BURIALS/BAR TRANSVERSE ELECTROMAGNETIC WAVE

HYBRID PLANAR ONES BURIALS/BAR TRANSVERSE ELECTROMAGNETIC WAVE

HYBRID PLANAR ONES BURIALS/BAR TRANSVERSE ELECTROMAGNETIC WAVE

HYBRID PLANAR ONES BURIALS/BAR TRANSVERSE ELECTROMAGNETIC WAVE

Vertical waveguide tapers for optical coupling between optical fibers and thin silicon waveguides

Siloxane optical waveguides

Single Mode Photonic Circuit Architecture and a New Optical Splitter Design Based on Parallel Waveguide Mode Conversion

The new single mode circuit (SMC) architecture is invented for photonic integrated circuits (PIC). This architecture allows using multimode waveguides or structures to construct a single mode operated PIC. The multimode sections used in such SMC based PIC possess strong lateral confinement so that the PIC can have high circuit density and high optical performance at the same time. A parallel mode converter structure is also invented here. Based on this parallel mode converter, a low loss optical splitter can be constructed for high index contrast waveguide system.

Method of manufacturing optical waveguide core, method of manufacturing optical waveguide, optical waveguide, and optoelectric composite wiring board

In order to provide a method of efficiently manufacturing an optical waveguide core having an endface inclined at a predetermined angle, the following method of manufacturing an optical waveguide core is employed. The method includes: a core material layer forming step of forming a core material layer formed of a photosensitive material on a surface of a cladding layer that has been formed on a substrate; a high refractive index substance covering step of covering a surface of the core material layer with a substance having a refractive index higher than 1 by bringing the high refractive index substance into close contact with the core material layer surface; an exposure step of pattern exposing the core material layer in a predetermined core-forming shape to from a core by irradiating the core material layer on a side covered with the high refractive index substance with exposure light inclined at a predetermined angle with respect to the cladding layer surface; a high refractive index substance removing step of removing the high refractive index substance from the surface of the core material layer exposed in the exposure step; and an development step of developing the core material layer from which the high refractive index substance has been removed in the high refractive index substance removing step so as to form the core having an inclined endface.

Optical switch device and method of manufacturing the same

Provided are an optical switch device having a simple light path and capable of achieving high speed switching, and a method of manufacturing the optical switch device. The optical switch device comprises one or more first optical waveguides extending in a first direction, one or more second optical waveguides connected to the first optical waveguides in a second direction crossing the first direction, and one or more switching parts configured to control light transmitted in the first direction within the first optical waveguide connected with the second waveguide, to selectively reflect the light to the second waveguide extending in the second direction.

Optical force based biomolecular analysis in slot waveguides

An architecture for the handling and transport of nanoscopic matter in lab on a chip devices using optical forces. A slot waveguide is used to focus and harness optical energy to trap and transport nanoscale objects. The slot waveguide is a unique structure that has several advantageous features, such as high optical confinement, and enables nanoparticles to interact fully with a propagating optical mode.

Embedded vertical optical grating for heterogeneous integration

An embedded vertical optical grating, a semiconductor device including the embedded vertical optical grating and a method for forming the same. The method for forming the embedded optical grating within a substrate includes depositing a hard mask layer on the substrate, patterning at least one opening within the hard mask layer, vertically etching a plurality of scallops within the substrate corresponding to the at least one opening within the hard mask layer, removing the hard mask layer, and forming an oxide layer within the plurality of scallops to form the embedded vertical optical grating.

Multi-core optical cable to photonic circuit coupler

An optical device includes a substrate and a plurality of three or more planar waveguides formed over the substrate. Each planar waveguide includes a corresponding grating coupler formed therein. The grating couplers are arranged in a non-collinear pattern over said substrate. The plurality of grating couplers is configured to optically couple to a corresponding plurality of fiber cores in a multi-core optical cable.

Method And System For A Photonic Interposer

Methods and systems for a photonic interposer are disclosed and may include receiving one or more continuous wave (CW) optical signals in a silicon photonic interposer from an external optical source, either from an optical source assembly or from optical fibers coupled to the silicon photonic interposer. The received CW optical signals may be processed based on electrical signals received from the electronics die. The modulated optical signals may be received in the silicon photonic interposer from optical fibers coupled to the silicon photonic interposer. Electrical signals may be generated in the silicon photonic interposer based on the received modulated optical signals, and may then be communicated to the electronics die via copper pillars. Optical signals may be communicated into and/or out of the silicon photonic interposer utilizing grating couplers. The electronics die may comprise one or more of: a processor core, a switch core, or router.

Waveguide photo-detector

Provided is a waveguide photodetector that may improve an operation speed and increase or maximize productivity. The waveguide photodetector includes a waveguide layer extending in a first direction, an absorption layer disposed on the waveguide layer, a first electrode disposed on the absorption layer, a second electrode disposed on the waveguide layer, the second electrode being spaced from the first electrode and the absorption layer in a second direction crossing the first direction, and at least one bridge electrically connecting the absorption layer to the second electrode.

Optical device, modulator module, and method for manufacturing the optical device

An optical device includes a ridge-like optical waveguide portion, a mesa protector portion that is arranged in parallel to the optical waveguide portion, a resin portion that covers upper parts of the mesa protector portion and is disposed at both sides of the mesa protector portion, an electrode that is disposed on the optical waveguide portion, an electrode pad that is disposed on the resin portion located at an opposite side to the optical waveguide portion with respect to the mesa protector portion, and a connection portion that is disposed on the resin portion and electrically connects the electrode to the electrode pad.

Method And System For Coupling Optical Signals Into Silicon Optoelectronic Chips

A method and system for coupling optical signals into silicon optoelectronic chips are disclosed and may include coupling one or more optical signals into a back surface of one or more of a plurality of CMOS photonic chips comprising photonic, electronic, and optoelectronic devices. The devices may be integrated in a front surface of the chips and optical couplers may receive the optical signals in the front surface of the chips. The optical signals may be coupled into the back surface of the chips via optical fibers and/or optical source assemblies. The optical signals may be coupled to the optical couplers via a light path etched in the chips, which may be refilled with silicon dioxide. The chips may be flip-chip bonded to a packaging substrate. Optical signals may be reflected back to the optical couplers via metal reflectors, which may be integrated in dielectric layers on the chips.

Optical semiconductor device, and manufacturing method thereof

The optical semiconductor device includes a spot-size converter formed on a semiconductor substrate. The spot-size converter has a multilayer structure including a light transition region. The multilayer structure includes a lower core layer, and an upper core layer having a refractive index higher than that of the lower core layer. The width of the upper core layer is gradually decreased and the width of the lower core layer is gradually increased in the light transition region. Both sides and an upper side of the multilayer structure are buried by a semi-insulating semiconductor layer in the light transition region. Light incident from one end section of the spot-size converter is propagated to the upper core layer. The light transits from the upper core layer to the lower core layer in the light transition region, is propagated to the lower core layer, and exits from the other end section thereof.

Method of manufacturing photodiode with waveguide structure and photodiode

A process to form a photodiode (PD) with the waveguide structure is disclosed. The PD processes thereby reduces a scattering of the parasitic resistance thereof. The process includes steps to form a PD mesa stripe, to bury the PD mesa stripe by the waveguide region, to etch the PD mesa stripe and the waveguide region to form the waveguide mesa stripe. In the etching, the lower contact layer plays a role of the etching stopper.

Area array waveguide power splitter

A method for constructing an area array waveguide power splitter includes preparing a reflective layer on a substrate and forming a core of an area array waveguide layer and alignment features for an optical fiber input and a plurality of optical fiber outputs atop the reflective layer, wherein the core of the area array waveguide layer and the alignment features are formed concurrently. The method also includes applying a reflective layer to the top and side surfaces of the core of the area array waveguide layer and exposing an input and exposing a plurality of outputs in the reflective layer.

Wavelength division multiplexing device

A technology for wavelength division multiplexing light of a plurality of different wavelengths into one or more optical fibers is disclosed. In a first main embodiment, the light is multiplexed and turned by a designated angle using two lens arrays and a flat surface that functions as a mirror. In a second embodiment, a waveguide-based combiner structure multiplexes and turns a plurality of light beams of different wavelengths.

Electro-optical Assembly Fabrication

A flip-chip bonder fabricates an optical assembly by horizontally positioning a flexible portion of a substrate including a waveguide with the waveguide exposed at one end edge of the substrate; bending a portion of the flexible substrate to place the waveguide exposed end in approximately a vertical position; vertically positioning a bond head containing an optical component upon the waveguide exposed substrate edge to optically mate the optical component with the exposed waveguide; and fixably mounting the optical component to the substrate edge.

Optical elements, method of replicating optical elements, particularly on a wafer level, and optical devices

Integrated multiple optical elements may be formed by bonding substrates containing such optical elements together or by providing optical elements on either side of the wafer substrate. The wafer is subsequently diced to obtain the individual units themselves. The optical elements may be formed lithographically, directly, or using a lithographically generated master to emboss the elements. Alignment features facilitate the efficient production of such integrated multiple optical elements, as well as post creation processing thereof on the wafer level.

Optical device and method for manufacturing the optical device

The invention provides an optical device and an optical device manufacturing method wherein provisions are made to be able to precisely align an optical fiber relative to a substrate without heating the substrate and to maintain the optimum alignment condition for an extended period of time. More specifically, the invention provides an optical device manufacturing method which includes the steps of forming a first metallic film on a portion of a substrate, forming a second metallic film on a portion of the outer circumference of an optical fiber, and bonding together the first metallic film and the second metallic film by surface activated bonding,, and an optical device manufactured by such a manufacturing method.

Design for reducing loss at intersection in optical waveguides

A core intersection in an optical waveguide formed of a plurality of cores and a clad that surrounds the cores is disclosed, the structure characterized in that the same material as that of the cores is added to two planes, upper and lower planes, of each of core intersection spaces where the plurality of cores intersect (instead of using a clad material). The structure of a core intersection in an optical waveguide formed of a plurality of cores and a clad is disclosed, the structure characterized in that four planes that divide (isolate) each of core intersection spaces where the plurality of cores intersect, that is, four discontinuity spaces between the core intersection space and the cores connected thereto, are filled with the same material as that of the clad (instead of using a core material so that the core intersection space is seamlessly connected to surrounding core intersection spaces).

Optical wavelength dispersion device and method of manufacturing the same

An optical wavelength dispersion device includes a first substrate, an input unit formed on the first substrate having a slit for receiving an optical signal, a grating formed on the first substrate for producing a first light beam form the optical signal for outputting, and a second substrate covered on the top of the input unit and the grating, wherein the input unit and the grating are formed from a photo-resist layer by high energy light source exposure.

Spot size converter, optical transmitter, optical receiver, optical transceiver, and method of manufacturing spot size converter

The spot size converter includes a first cladding layer, a first core layer and a second core layer arranged side by side on the first cladding layer so as to extend from a first end which receives/outputs light along a direction from the first end toward a second end, a third core layer which is disposed on the first cladding layer between the first and second core layers, is a member different from the first and second core layers, and extends to the second end along the direction from the first end toward the second end, and a second cladding layer disposed on the first, second, and third core layers.

Optical component having reduced dependency on etch depth

An optical device includes an active component on a base. The active component is a light sensor and/or a light modulator. The active component is configured to guide a light signal through a ridge of an active medium extending upwards from slab regions of the active medium. The slab regions are on opposing sides of the ridge. The active medium includes a doped region that extends into a lateral side of the ridge and also into one of the slab regions. The depth that the doped region extends into the slab region is further than the depth that the doped region extends into the ridge.

Photonic Crystal Magneto-Optical Circulator and Manufacturing Method Thereof

The invention relates to a photonic crystal magneto-optical circulator, which comprises first dielectric material columns in an air background, wherein the first dielectric material columns are arranged in the form of two-dimensional square lattice. The photonic crystal magneto-optical circulator also comprises a “T-shaped” or a “cross-shaped” photonic crystal waveguide, a second dielectric material column, four same magneto-optical material columns and at least three same third dielectric material columns, wherein the “T-shaped” or a “cross-shaped” photonic crystal waveguide comprises a horizontal photonic crystal waveguide and a vertical photonic crystal waveguide which are intercrossed; the second dielectric material column is arranged at a cross-connected position of the horizontal photonic crystal waveguide and the vertical photonic crystal waveguide and has the function of light guiding; the four same magneto-optical material columns are uniformly arranged on the periphery of the second dielectric material column; and at least three same third dielectric material columns.

Human placental collagen compositions, and methods of making and using the same

The present invention provides compositions comprising human placental telopeptide collagen, methods of preparing the compositions, methods of their use and kits comprising the compositions. The compositions, kits and methods are useful, for example, for augmenting or replacing tissue of a mammal.

Flexible fiber to wafer interface

A fiber to wafer interface system includes an interface device comprising a flexible substrate portion, a flexible cladding portion arranged on the substrate portion, a flexible single-mode waveguide portion arranged on the cladding portion including a substantially optically transparent material, a connector portion engaging a first distal end of the flexible substrate portion, the connector portion operative to engage a portion of an optical fiber ferrule, a wafer portion comprising a single mode waveguide portion arranged on a portion of the wafer, an adhesive disposed between a portion of the single mode waveguide portion of the body portion and the single mode waveguide portion of the wafer portion, the adhesive securing the body portion to the wafer portion.

Integrated driver and related method

A driver circuit may include a first node (VA), and a first circuit to generate on the first node (VA) an inverted replica of an input signal (VIN) during driver switching between a first supply voltage (Vdd 1 ) and ground, the inverted replica having a threshold voltage value based upon a reference voltage (Vref) greater than the first supply voltage (Vdd 1 ). The driver circuit may include a cascode stage (M 3 ) to be controlled by the reference voltage (Vref) and to be coupled between a second supply voltage (Vdd 2 ) and the first node, a delay circuit (D) to generate a delayed replica of the input signal (VIN), an amplifier, and a switching network (M 5, M 6 ) to couple a control terminal of an active load transistor (M 9 ) either to one of the reference voltage (Vref) or to ground, based upon the input signal (VIN).

Light transmission system with optical waveguide

A light transmission system includes a light guide support, a first convex lens, an optical waveguide member, and two second convex lenses. The light guide support includes a first surface, a second surface, a hollow space formed between the first surface and the second surface, and an inner reflecting surface forming an angle of 45 degrees relative to the first surface. The first convex lens is formed at the first surface, and configured for converging light to the inner reflecting surface. The optical waveguide member is located at the hollow space, and includes a main section parallel with the first surface, two first branch sections extending from and forming equal angles relative to the main section, and two second branch sections extending from the respective first branch sections. The two second convex lenses are formed at the second surface and aligned with the respective second branch sections.

Optical biosensor, bio-sensing system including the same, and method of fabricating the optical biosensor

An optical biosensor including a bio-sensing unit configured to receive an optical signal and generating a sensed optical signal, the wavelength of which varies according to a result of sensing a biomaterial; and a spectrometer including a plurality of ring resonators for dividing the sensed optical signal according to a wavelength and generating a plurality of output optical signals, respectively.

Liquid-crystal display with coherent illumination and reduced speckling

Disclosed is a liquid-crystal display with coherent illumination. The display has a multilayered matrix structure comprising a matrix of micromirrors, lightguide panel with a matrix of holographic elements, a liquid-crystal matrix containing a plurality of liquid-crystal cells and a polarization analyzer. The micromirrors perform reciprocating linear or tilting movements. Therefore, in each current moment, the speckle pattern of the image shifts relative to the preceding pattern so that in each current moment the viewer sees an image in different micropositions, which are perceptible by the human eye as a quasistationary pattern. As a result, the speckle pattern seen by the viewer is smoothened.

Exciting a selected mode in an optical waveguide

A method of exciting a selected light propagation mode in a device is disclosed. At least two light beams are propagated proximate a waveguide of the device substantially parallel to a selected surface of the waveguide. Light is transferred from the at least two beams of light into the waveguide through the selected surface to excite the selected light propagation mode in the waveguide.

Passive Periodic-Slot Waveguide As An Optical Filter And Phase Reference

A device that filters optical signals using a waveguide having a slotted optical pathway. The shape of the optical pathway passively restricts at least one optical signal from traveling through the waveguide. The device can also be used to reference the phase of an optical signal in an optical circuit.

Method and system for grating couplers incorporating perturbed waveguides

Methods and systems for grating couplers incorporating perturbed waveguides are disclosed and may include in a semiconductor photonics die, communicating optical signals into and/or out of the die utilizing a grating coupler on the die, where the grating coupler comprises perturbed waveguides. The perturbed waveguides may comprise a variable width along their length. The grating coupler may comprise a single polarization grating coupler comprising perturbed waveguides and a non-perturbed grating. The grating coupler may comprise a polarization splitting grating coupler (PSCC) that includes two sets of perturbed waveguides at a non-zero angle, or a plurality of non-linear rows of discrete shapes. The PSCC may comprise discrete scatterers at an intersection of the sets of perturbed waveguides. The grating couplers may be etched in a silicon layer on the semiconductor photonics die or deposited on the semiconductor photonics die. The grating coupler may comprise individual scatterers between the perturbed waveguides.

Surface acoustic wave tag-based coherence multiplexing

A surface acoustic wave (SAW)-based coherence multiplexing system includes SAW tags each including a SAW transducer, a first SAW reflector positioned a first distance from the SAW transducer and a second SAW reflector positioned a second distance from the SAW transducer. A transceiver including a wireless transmitter has a signal source providing a source signal and circuitry for transmitting interrogation pulses including a first and a second interrogation pulse toward the SAW tags, and a wireless receiver for receiving and processing response signals from the SAW tags. The receiver receives scrambled signals including a convolution of the wideband interrogation pulses with response signals from the SAW tags and includes a computing device which implements an algorithm that correlates the interrogation pulses or the source signal before transmitting against the scrambled signals to generate tag responses for each of the SAW tags.

Optical filter having single reflecting total internal reflection echelle grating filter and optical waveguide device including the same

An optical filter of the inventive concept includes a slab waveguide disposed on a substrate, an input guide gate and an output guide gate spaced apart from each other in the slab waveguide, and an echelle grating filter disposed in the slab waveguide. The echelle grating filter has curvature and extends in a first direction. The echelle grating filter has gratings of sawtooth shape on one surface thereof. Light inputted through the input guide gate is totally reflected at the echelle grating filter by one reflecting process.

In-Plane MEMS Optical Switch

An optical switch includes a first bus waveguide supported by a substrate, an optical antenna suspended over the first bus waveguide via a spring, and interdigitated electrodes coupling the substrate with optical antenna and configured to control a position of the optical antenna relative to the first bus waveguide. When a voltage difference applied to the interdigitated electrodes is less than a lower threshold, the optical antenna is at a first position offset from the first bus waveguide, when the voltage difference applied to the interdigitated electrodes is greater than an upper threshold, the optical antenna is at a second position offset from the first bus waveguide, and the offset at the second position is greater than at the first position. 1. An optical switch comprising:a first bus waveguide supported by a substrate;an optical antenna suspended over the first bus waveguide via a spring; andinterdigitated electrodes coupling the substrate with optical antenna and configured to control a position of the optical antenna relative to the first bus waveguide,wherein when a voltage difference applied to the interdigitated electrodes is less than a lower threshold, the optical antenna is at a first position separated from the first bus waveguide by a first vertical distance, when the voltage difference applied to the interdigitated electrodes is greater than an upper threshold, the optical antenna is at a second position separated from the first bus waveguide by a second vertical distance less than the first vertical distance.2. The optical switch of further comprising claim 1 ,a second bus waveguide supported by the substrate and parallel with the first bus wave guide,wherein when a voltage difference applied to the interdigitated electrodes is less than a lower threshold, the optical antenna is at a first position a first distance offset from the first bus waveguide, when the voltage difference applied to the interdigitated electrodes is greater than an upper ...

INTEGRATED PHOTONICS OPTICAL GYROSCOPES WITH IMPROVED SENSITIVITY UTILIZING HIGH DENSITY SILICON NITRIDE WAVEGUIDES

Aspects of the present disclosure are directed to structural modifications introduced in a waveguide structure in order to more tightly pack adjacent waveguide turns in an optical gyroscope fabricated on a planar silicon platform as a photonic integrated circuit. Increasing number of turns of the gyroscope coil increases total waveguide length as well as enclosed area of the gyroscope loop, which translates to increased sensitivity to rotational measurement. 1. An integrated photonics chip comprising:a waveguide coil comprising a plurality of waveguide turns looping around a central area enclosed by the waveguide coil, each waveguide turn being parallel to adjacent waveguide turns; anda structural modification introduced on either side of each waveguide turn to reduce crosstalk between the adjacent waveguide turns, thereby increasing a spatial density of waveguide turns that can be fabricated within a predetermined area of the integrated photonics chip.2. The integrated photonics chip of claim 1 , wherein the predetermined area depends on an exposure field of a reticle used to fabricate the waveguide coil with the plurality of turns.3. The integrated photonics chip of claim 1 , wherein the waveguide coil is used as a rotational sensing element of an optical gyroscope.4. The integrated photonics chip of claim 3 , wherein increasing spatial density of waveguide turns increases the central area enclosed within the waveguide coil claim 3 , as well as increases a number of waveguide turns enclosing the central area claim 3 , thereby increasing sensitivity of the rotational sensing element.5. The integrated photonics chip of claim 1 , wherein each waveguide turn comprises a waveguide core sandwiched between an upper cladding and a lower cladding.6. The integrated photonics chip of claim 5 , wherein the waveguide core comprises silicon nitride and the upper cladding and lower cladding comprise oxide.7. The integrated photonics chip of claim 5 , wherein the structural ...

Beam Combiner

A beam combiner is disclosed that comprises a planar lightwave circuit that is based on undoped silicon nitride-based surface waveguides, wherein the planar lightwave circuit comprises a plurality of input ports, a mixing region, and an output port, and wherein the mixing region comprises a plurality of directional couplers that are arranged in a tree structure. Embodiments of the present invention are capable of combining a plurality of light signals characterized by disparate wavelengths on irregular spacings with low loss. Further, the present invention enables high-volume, low cost production of beam combiners capable of combining three or more light signals into a single composite output beam. 1. A beam combiner that includes a planar lightwave circuit , the planar lightwave circuit comprising:a plurality of input ports, the plurality of input ports including a first input port;a mixing region, the mixing region comprising a plurality of directional couplers that are arranged in a first arrangement comprising a tree structure;a first output port that is optically coupled with the plurality of input ports via the mixing region;a first polarization filter that is optically coupled with the first input port, the first polarization filter being dimensioned and arranged to (1) receive a first light signal that comprises a first polarization mode and a second polarization mode and (2) selectively reduce the magnitude of the first polarization mode.2. The beam combiner of wherein the plurality of directional couplers comprises:a first directional coupler that is dimensioned and arranged to enable a first light signal in a first waveguide to substantially completely couple into a second waveguide and substantially disable a second light signal in the second waveguide from coupling into the first waveguide;a second directional coupler that is dimensioned and arranged to enable a third light signal in a third waveguide to substantially completely couple into a fourth ...

Method and Structure for Reducing Light Crosstalk in Integrated Circuit Device

The present disclosure provides an integrated circuit device comprising a substrate having a back surface and a sensing region disposed in the substrate and being operable to sense radiation projected towards the back surface of the substrate. The device further includes a waveguide disposed over the back surface of the substrate. The waveguide is aligned with the sensing region such that the waveguide is operable to transmit the radiation towards the aligned sensing region. The waveguide includes a waveguide wall, and an inner region disposed adjacent to the waveguide wall. A diffractive index of the waveguide wall is less than a diffractive index of the inner region. 1. An integrated circuit device comprising:a substrate having a back surface;a sensing region disposed in the substrate and operable to sense radiation projected towards the back surface of the substrate; anda waveguide disposed over the back surface of the substrate, the waveguide being aligned with the sensing region such that the waveguide is operable to transmit the radiation towards the aligned sensing region,wherein the waveguide includes a waveguide wall, and an inner region disposed adjacent to the waveguide wall, andwherein a diffractive index of the waveguide wall is less than a diffractive index of the inner region.2. The integrated circuit device of claim 1 , further comprising:a color filter aligned with and disposed over the waveguide.3. The integrated circuit device of claim 2 , wherein a width of the inner region is greater than a width of the aligned color filter.4. The integrated circuit device of claim 1 , wherein a width of the inner region is greater than a width of the aligned sensing region.5. The integrated circuit device of claim 1 , wherein the waveguide wall has multiple layers.6. The integrated circuit device of claim 1 , wherein the inner region of the waveguide has multiple layers.7. The integrated circuit device of claim 1 , further comprising:an antireflective layer ...

OPTICAL PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

Provided is an optical printed circuit board, including: a first insulating layer on which at least one receiving groove with an inclined angle on at least one end is formed; an optical waveguide which is formed in the receiving groove of the first insulating layer; and a second insulating layer which is formed on the first insulating layer and buries the optical waveguide formed in the receiving groove. 1. An optical printed circuit board , comprising:a first insulating layer on which at least one receiving groove with an inclined angle on at least one end is formed;an optical waveguide which is formed in the receiving groove of the first insulating layer; anda second insulating layer which is formed on the first insulating layer and buries the optical waveguide formed in the receiving groove.2. The optical printed circuit board of claim 1 , wherein the optical waveguide is configured such that a lower clad claim 1 , a core and an upper clad are sequentially laminated.3. The optical printed circuit board of claim 1 , wherein the optical waveguide is formed so that a part thereof is protruded to an upper part of the receiving groove.4. The optical printed circuit board of claim 1 , wherein the receiving groove comprises: a lower surface; and a left side surface and a right side surface which have a constant inclined angle from both ends of the lower surface and is formed to extend to an upper side claim 1 , and the constant inclined angle is any one of 45° and 135°.5. The optical printed circuit board of claim 4 , further comprising a first mirror and a second mirror which are formed on the left side surface and the right side surface of the receiving groove.6. The optical printed circuit board of claim 5 , wherein a circuit pattern is formed on at least one surface of the first insulating layer claim 5 , an optical transmitter is electrically connected to the circuit pattern formed at an upper part of the first mirror claim 5 , and an optical receiver is ...

SEMICONDUCTOR INTEGRATED CIRCUIT

A semiconductor integrated circuit according to an example of the present invention includes a chip substrate, first and second switches arranged on the chip substrate in which ON/OFF of an electrical signal path is directly controlled by an optical signal, a first light shielding layer arranged above the chip substrate, an optical waveguide layer arranged on the first light shielding layer, a second light shielding layer arranged on the optical waveguide layer, a reflecting plate arranged in the optical waveguide layer to change an advancing direction of the optical signal, and means for leading the optical signal to the first and second switches from an inside of the optical waveguide layer. The first and second light shielding layers reflect the optical signal, and the optical waveguide layer transmits the optical signal radially. 1. A semiconductor integrated circuit comprising:a chip substrate;a plurality of first optical waveguide layers and a plurality of first light shielding layers alternately stacked above the chip substrate;a plurality of first reflecting plates arranged inside the plurality of first optical waveguide layers to change an advancing direction of an optical signal; anda plurality of first vertical holes connecting the plurality of first optical waveguide layers,wherein the plurality of first light shielding layers reflect the first optical signal, the plurality of first optical waveguide layers transmit the first optical signal radially, and the first optical signal moves among the plurality of first optical waveguide layers via the plurality of first vertical holes.2. The semiconductor integrated circuit according to claim 1 ,wherein a light incident hole which captures the first optical signal is provided on a first light shielding layer farthest from the chip substrate among the plurality of first light shielding layers, and a light emission hole which takes out the first optical signal is provided on a first light shielding layer closest ...

PHOTOCURABLE COATING COMPOSITION AND APPLICATION THEREOF

The present disclosure provides a photocurable coating composition, including: (a) a (meth)acrylate monomer or oligomer with at least four functional groups; (b) a difunctional (meth)acrylate monomer, (c) a monofunctional (meth)acrylate monomer, and (d) an initiator. The difunctional (meth)acrylate monomer is present in an amount of 30 to 70 wt % based on the total weight of the photocurable coating composition. The present disclosure also provides an optical film having a microstructure layer made from the photocurable coating composition. The optical film can be as a light guide film in a back light module of a display. 4. The photocurable coating composition according to claim 1 , wherein the composition has a viscosity of 100 to 2000 cps at 25° C.5. The photocurable coating composition according to claim 1 , wherein the (meth)acrylate monomer or oligomer with at least four functional groups is present in an amount of 5 wt % to 25 wt % based on the total weight of the photocurable coating composition.6. The photocurable coating composition according to claim 1 , wherein the (meth)acrylate monomer with at least four functional groups comprises pentaerythritol tetraacrylate claim 1 , ethoxylated pentaerythritol tetraacrylate claim 1 , propoxylated pentaerythritol tetraacrylate claim 1 , dipentaerythritol hexaacrylate or caprolactone modified dipentaerythritol hexaacrylate.7. The photocurable coating composition according to claim 1 , wherein the (meth)acrylate oligomer with at least four functional groups comprises a hyperbranched polyurethane (meth)acrylate or a hyperbranched polyester (meth)acrylate.8. The photocurable coating composition according to claim 1 , wherein the (meth)acrylate oligomer with at least four functional groups has not more than twenty functional groups and has a number average molecular weight between 2000 and 5000.9. The photocurable coating composition according to claim 1 , wherein the monofunctional (meth)acrylate monomer is present in ...

Adiabatic Coupler

A system for selectively adiabatically coupling electromagnetic waves from one waveguide to another waveguide is described. It comprises a first waveguide portion and a second waveguide portion having substantially different surface normal cross-sections. Portions thereof are positioned with respect to each other in a coupling region so that under first predetermined environmental conditions coupling of electromagnetic waves between the first waveguide portion and the second waveguide portion can occur and under second predetermined environmental conditions substantially no coupling of electromagnetic waves between the first waveguide portion and the second waveguide portion can occur. The system also comprises a fluid positioning means for selectively positioning at least a first fluid simultaneously overlaying both said first waveguide portion and said second waveguide portion in the coupling region thus selectively inducing first predetermined environmental conditions or second predetermined environmental conditions.

DIRECT WRITABLE AND ERASABLE WAVEGUIDES IN OPTOELECTRONIC SYSTEMS

Technologies are generally described to form a waveguide in a polymer multilayer comprising a first and second polymer layer. The waveguide may be formed by directing light beams toward the polymer multilayer to form first and second cladding regions in the polymer multilayer, where the first and second cladding regions comprise a mixture of the first and second polymer layers. The first and second cladding regions may define a third cladding region and a waveguide core therebetween, where the third cladding region comprises a portion of the second polymer layer, and the waveguide core comprises a portion of the first polymer layer. In some examples, the polymer multilayer may be formed on a substrate such that the waveguide is formed on the substrate. Additionally, the waveguide may be formed temporarily to test components of an optoelectronic system and then erased by heating the polymer multilayer to destroy the waveguide core, or the waveguide may be formed as a default optical interconnection configuration that may be changed to alter the functional mode of the backplane in the manner of a jumper setting. 1. A method to form a waveguide , the method comprising:providing a polymer multilayer, the polymer multilayer comprising a first polymer layer and a second polymer layer,the first polymer layer having a first refractive index,the second polymer layer having a second refractive index, the second refractive index being lower than the first refractive index;writing a first cladding region by directing a first light beam onto the polymer multilayer to induce mixing of the first and second polymer layers within the first cladding region; andwriting a second cladding region by directing a second light beam on the polymer multilayer to induce mixing of the first and second polymer layers within the second cladding region,such that the waveguide is formed, the waveguide having a waveguide core comprising a portion of the first polymer layer located between the first ...

METHOD FOR POLISHING PHOTONIC CHIPS

A method for polishing photonic chips is described. A gauge is placed in a photonic chip adjacent to an edge to be polished. The gauge includes a set of bars of various lengths. The bar lengths can be progressively ordered from shortest to longest or vice versa. The photonic chip is then secured in a chip polishing jig to get ready for polishing. When the photonic chip is being polished, an operator can visually inspect the gauge by looking at the polishing edge to estimate a polishing depth in order to determine a stopping point for polishing. Once the stopping point has been reached, the polishing of the photonic chip can be stopped. 1. A method for polishing a photonic chip edge , said method comprising:placing a gauge underneath a surface of a photonic chip, wherein said gauge is located adjacent to an edge to be polished, wherein said gauge includes a plurality of bars of various lengths;securing said photonic chip in a chip polishing jig;when said photonic chip is being polished, determining a stopping point by visually inspecting said bars of said gauge to estimate a polishing depth at which polishing should stop; andstopping polishing said photonic chip after said stopping point has been reached.2. The method of claim 1 , wherein said determining further includes basing on the number of bars on said gauge uncovered by said polishing.3. The method of claim 1 , wherein said determining further includes basing on the number of bars on said gauge removed by said polishing.4. The method of claim 1 , wherein said bars are located at different distance from said edge.5. The method of claim 1 , wherein said bars are located at equal distance from said edge.6. The method of claim 1 , wherein said gauge is located at the same level as a waveguide.7. The method of claim 1 , wherein said gauge is made of the same material as a waveguide.8. The method of claim 1 , wherein said gauge is made of silicon.9. The method of claim 1 , wherein said visually inspecting further ...

ENHANCED MICROBEND SENSOR

An optical fiber sensor includes a first single mode fiber, a second single mode fiber, and a multimode fiber positioned between, and coupled to, the first single mode fiber and the second single mode fiber. The multimode fiber includes a graded-index core with an outer diameter between about 35 μm and about 45 μm. A numerical aperture of the core is between about 0.15 and about 0.25. The multimode fiber includes a cladding with an outer diameter between about 70 μm and about 90 μm. A coupling strength of an LPmode of the first single mode fiber to each of an LPmode and an LPmode of the multimode fiber is at least about 0.25. 1. An optical fiber sensor , comprising:a first single mode fiber comprising a core and a cladding;a second single mode fiber comprising a core and a cladding; and a graded-index core having an outer diameter between about 35 μm and about 45 μm, wherein a numerical aperture of the core is between about 0.15 and about 0.25;', 'a cladding having an outer diameter between about 70 μm and about 90 μm; and', {'sub': 01', '02', '03, 'wherein a coupling strength of an LPmode of the first single mode fiber to each of an LPmode and an LPmode of the multimode fiber is at least about 0.25.'}], 'a multimode fiber positioned between, and coupled to, the first single mode fiber and the second single mode fiber, the multimode fiber comprising2. The optical fiber sensor of claim 1 , wherein the coupling strength of the LPmode of the first single mode fiber to the LPmode of the multimode fiber is at least about 0.35.3. The optical fiber sensor of claim 2 , wherein the coupling strength of the LPmode of the first single mode fiber to the LPmode of the multimode fiber is at least about 0.28.4. The optical fiber sensor of claim 3 , wherein the LPand the LPmodes of the multimode fiber coherently interfere as light propagates through the multimode fiber.5. The optical fiber sensor of claim 2 , wherein a coupling strength of an LPmode of the second single mode fiber ...

Integrated bound-mode spectral/angular sensors

A 2-D sensor array includes a semiconductor substrate and a plurality of pixels disposed on the semiconductor substrate. Each pixel includes a coupling region and a junction region, and a slab waveguide structure disposed on the semiconductor substrate and extending from the coupling region to the region. The slab waveguide includes a confinement layer disposed between a first cladding layer and a second cladding layer. The first cladding and the second cladding each have a refractive index that is lower than a refractive index of the confinement layer. Each pixel also includes a coupling structure disposed in the coupling region and within the slab waveguide. The coupling structure includes two materials having different indices of refraction arranged as a grating defined by a grating period. The junction region comprises a p-n junction in communication with electrical contacts for biasing and collection of carriers resulting from absorption of incident radiation.

WAVEGUIDE AND SENSOR BASED ON SAME

A waveguide is provided. The waveguide having a first core, a second core spaced apart from and parallel with the first core, and a cladding surrounding the first core and the second core. An interstitial portion of the cladding is located between the first core and the second core. A first region of the first core adjacent to the cladding or of the cladding adjacent to the first core is color dyed. 1. A waveguide , comprising:a first core having a first refractive index;a second core having a second refractive index, the second core being spaced apart from and parallel with the first core;a cladding surrounding the first core and the second core, the cladding having a refractive index lower than the first refractive index and the second refractive index, and wherein an interstitial portion of the cladding is located between the first core and the second core; andwherein a first region of the first core adjacent to the cladding or of the cladding adjacent to the first core is color dyed.2. The waveguide of claim 1 , wherein the first color-dyed region is of the first core and adjacent to the interstitial cladding.3. The waveguide of claim 1 , wherein the first color-dyed region extends over a cross-sectional area of the first core which is less than or equal to 50% of a cross-sectional area of the first core.4. The waveguide of claim 1 , wherein the cladding comprises silicone.5. The waveguide of claim 1 , wherein the first core and/or the second core comprises polyurethane.6. The waveguide of claim 1 , wherein a cross-sectional area of the first core is larger than a cross-sectional area of the second core.7. The waveguide of claim 1 , wherein the first refractive index is the same as the second refractive index.8. The waveguide of claim 1 , wherein the first core has a diameter of 10 μm to 5 cm claim 1 , and/or a cross sectional area of 100 μmto 25 cm.9. The waveguide of claim 1 , wherein the second core has a diameter of 10 μm to 5 cm claim 1 , and/or a cross ...

Holographic waveguide lidar

A holographic waveguide LIDAR having a transmitter waveguide coupled to a beam deflector and a receiver waveguide coupled to a detector module. The transmitter waveguide contains an array of grating elements for diffracting a scanned laser beam into a predefined angular ranges. The receiver waveguide contains an array of grating elements for diffracting light reflected from external points within a predefined angular range towards the detector module.

Rolling bearing with integrated optical fiber sensor

The rolling bearing provides a first ring, a second ring and at least one row of rolling elements arranged therebetween. Each of the first and second rings include an inner bore having an outer surface and at least one raceway for the row of rolling elements formed on one of the inner bore and outer surface. The first ring provides at least one part ring delimiting the raceway, and at least one sleeve secured to the part ring and delimiting at least partly the other of the inner bore and outer surface of the first ring. The rolling bearing further provides at least one optical fiber sensor mounted inside at least one circumferential groove formed on the first ring and passing through at least one optical fiber sensor passage opening into the circumferential groove.

Electro-optical modulator

An electro-optical modulator is provided. The modulator comprises a first and a second optical waveguide, at least one first capacitance, via which a voltage can be applied to a light-guiding region of the first optical waveguide, at least one second capacitance, via which a voltage can be applied to a light-guiding region of the second optical waveguide, an electrically conductive region, via which the first and second capacitances are electrically connected to one another, and a feed line to the electrically conductive region, via which feed line a DC voltage can be applied to the electrically conductive region, wherein the feed line is constituted such that it represents an electrical resistance connected in parallel with the second capacitance, and a compensation resistance connected in parallel with the first capacitance and serving for reducing transients in a voltage profile on the first and second capacitances during the operation of the modulator.

SEMICONDUCTOR DEVICE PACKAGES

A semiconductor device package includes a substrate and an optical device. The optical device includes a first portion extending into the substrate and not extending beyond a first surface of the substrate. The optical device further includes a second portion extending along the first surface of the substrate. 1. A semiconductor device package , comprising:a substrate having a first surface; andan optical device comprising a first portion extending into the substrate and under the first surface of the substrate, and further comprising a second portion extending along the first surface of the substrate.2. The semiconductor device package of claim 1 , wherein the first portion of the optical device has a first width and the second portion of the optical device has a second width claim 1 , wherein the second width is greater than the first width.3. The semiconductor device package of claim 1 , wherein the second portion of the optical device comprises a protrusion and the substrate defines a groove extending from the first surface of the substrate claim 1 , and wherein the protrusion of the second portion of the optical device engages with the groove of the substrate.4. The semiconductor device package of claim 1 , wherein the substrate comprises a semiconductor layer and a semiconductor oxide layer claim 1 , the semiconductor device package further comprising a waveguide disposed in the semiconductor oxide layer.5. The semiconductor device package of claim 4 , wherein the optical device further comprises a light emitting or a light receiving portion aligned with the waveguide claim 4 , and a vertical offset between the light emitting or the light receiving portion and the waveguide is less than about one third of a width of the waveguide.6. The semiconductor device package of claim 1 , wherein the first portion of the optical device is disposed in the substrate.7. The semiconductor device package of claim 1 , wherein the second portion of the optical device is ...

Junction region between two waveguides and associated method of production

A photonic integrated device includes a first waveguide and a second waveguide. The first and second waveguides are mutually coupled at a junction region the includes a bulge region.

OPTIMIZED 2X2 3DB MULTI-MODE INTERFERENCE COUPLER

An optimized SOI 2×2 multimode interference (MMI) coupler is designed by use of the particle swarm optimization (PSO) algorithm. Finite Difference Time Domain (FDTD) simulation shows that, within a footprint of 9.4×1.6 μm, <0.1 dB power unbalance and <1 degree phase error are achieved across the entire C-band. The excess loss of the device is <0.2 dB. 111-. (canceled)12. An optical coupler , comprising:a multi-mode region including: a length L between a first end and a second end; and a plurality of segments having widths, at least five of said segment widths from the first end to the second end being different one from the other;a plurality of first ports at the first end of the multi-mode region; anda plurality of second ports at the second end of the multi-mode region.13. The coupler according to claim 12 , wherein the multi-mode region comprises a few-mode region.14. The coupler according to claim 12 , wherein said segment widths vary in a symmetric pattern relative to a central distance L/2 along said length defining a bidirectional coupler.15. The coupler according to claim 12 , wherein said segment widths are at equally spaced locations along the length.16. The coupler according to claim 12 , wherein the second and fourth segment widths from the first end are greater than the third and fifth widths from the first end.17. The coupler according to claim 13 , wherein the plurality of first ports comprises two ports; and wherein the plurality of second ports comprises two ports.18. The coupler according to claim 17 , wherein said widths range from 1.439 μm to 1.6 μm.19. The coupler according to claim 17 , wherein the few-mode region and the plurality of first and second ports are within a footprint of 9.4×1.6 μm20. The coupler according to claim 17 , wherein each of said ports is connected to said few-mode region by a taper connector.21. The coupler according to claim 12 , wherein at least one taper connector is connected to an edge of the few-mode region to ...

PHOTOACOUSTIC APPARATUS AND METHODS

A photoacoustic apparatus, comprising: 1. A photoacoustic apparatus , comprising:at least one optical amplifier, configured to produce light;at least one photonic integrated circuit, configured as a tunable light filter;a light guide, wherein the at least one optical amplifier, at least one photonic integrated circuit and light guide are configured as an optical cavity to produce laser light having an optical path within the optical cavity; andat least one acoustic sensor configured to detect sound produced by analyte introduced into the optical path of the laser light.2. A photoacoustic apparatus as claimed in claim 1 , wherein the at least one optical amplifier comprises at least one semiconductor optical amplifier.3. A photoacoustic apparatus as claimed in claim 1 , wherein the at least one acoustic sensor comprises at least one quartz fork.4. A photoacoustic apparatus as claimed in claim 1 , comprising inlet configured to introduce analyte into the optical path of the laser light.5. A photoacoustic apparatus as claimed in claim 1 , wherein the light guide comprises a light coupler configured to couple light between the at least one optical amplifier and the at least one photonic integrated circuit.6. A photoacoustic apparatus as claimed in claim 1 , wherein the at least one acoustic sensor is located between the at least one optical amplifier and the at least one photonic integrated circuit.7. A photoacoustic apparatus as claimed in claim 1 , wherein light guide comprises a lens configured to focus the laser light to pass between prongs of the quartz fork.8. A photoacoustic apparatus as claimed in claim 7 , wherein the lens comprises a ball lens.9. A photoacoustic apparatus as claimed in claim 1 , wherein the at least one optical amplifier is formed as a first chip and the at least one photonic integrated circuit is formed as a second claim 1 , separate chip.10. A photoacoustic apparatus as claimed in claim 1 , wherein the at least one optical amplifier and the ...

STRUCTURES AND METHOD FOR THERMAL MANAGEMENT IN ACTIVE OPTICAL CABLE (AOC) ASSEMBLIES

Disclosed are structures and methods for active optic cable (AOC) assembly having improved thermal characteristics. In one embodiment, an AOC assembly includes a fiber optic cable having a first end attached to a connector with a thermal insert attached to the housing for dissipating heat from the connector. The AOC assembly can dissipate a suitable heat transfer rate from the active components of the connector such as dissipating a heat transfer rate of 0.75 Watts or greater from the connector. In one embodiment, the thermal insert is at least partially disposed under the boot of the connector. In another embodiment, at least one component of the connector has a plurality of fins. Other AOC assemblies may include a connector having a pull tab for dissipating heat from the assembly. 1. An active optic cable (AOC) assembly , comprising:a fiber optic cable having a first end attached to a connector;the connector having a thermal insert attached to a housing for dissipating heat from the connector, wherein the assembly can dissipate a heat flux of 1 Watt or greater from the connector.2. The AOC assembly of claim 1 , wherein a portion of the thermal insert is at least partially disposed under the boot.3. The AOC assembly of claim 1 , the thermal insert including a metal or a polymer.4. The AOC assembly of claim 1 , further including a total internal reflection (TIR) block attached to the at least one optical fiber at the first end of the fiber optic cable.5. The AOC assembly of claim 1 , wherein the fiber optic cable comprises two metal strength members attached to a collar.6. The AOC assembly of claim 5 , wherein the collar comprises an inner portion and an outer portion.7. An active optic cable (AOC) assembly claim 5 , comprising:a fiber optic cable having a first end attached to a connector;the connector having a collar, and a thermal insert attached to a housing for dissipating heat from the connector, wherein the assembly can dissipate a heat flux of 1 Watt or ...

PHOTONIC SEMICONDUCTOR DEVICE AND METHOD

A method includes forming silicon waveguide sections in a first oxide layer over a substrate, the first oxide layer disposed on the substrate, forming a routing structure over the first oxide layer, the routing structure including one or more insulating layers and one or more conductive features in the one or more insulating layers, recessing regions of the routing structure, forming nitride waveguide sections in the recessed regions of the routing structure, wherein the nitride waveguide sections extend over the silicon waveguide sections, forming a second oxide layer over the nitride waveguide sections, and attaching semiconductor dies to the routing structure, the dies electrically connected to the conductive features. 1. A method , comprising:forming silicon waveguide sections in a first oxide layer over a substrate, the first oxide layer disposed on the substrate;forming a routing structure over the first oxide layer, the routing structure comprising one or more insulating layers and one or more conductive features in the one or more insulating layers;recessing regions of the routing structure;forming nitride waveguide sections in the recessed regions of the routing structure, wherein the nitride waveguide sections extend over the silicon waveguide sections;forming a second oxide layer over the nitride waveguide sections; andattaching semiconductor dies to the routing structure, the dies electrically connected to the conductive features.2. The method of claim 1 , further comprising patterning the first oxide layer and the second oxide layer to form a cladding structure surrounding the silicon waveguide sections and the nitride waveguide sections claim 1 , the cladding structure having exposed sidewalls.3. The method of claim 1 , wherein the nitride waveguide sections are straight.4. The method of claim 1 , further comprising forming a photonic device over the first oxide layer claim 1 , wherein the photonic device comprises silicon claim 1 , and wherein the ...

Method of Fabrication Polymer Waveguide

A method of fabricating a waveguide device is disclosed. The method includes providing a substrate having an elector-interconnection region and a waveguide region and forming a patterned dielectric layer and a patterned redistribution layer (RDL) over the substrate in the electro-interconnection region. The method also includes bonding the patterned RDL to a vertical-cavity surface-emitting laser (VCSEL) through a bonding stack. A reflecting-mirror trench is formed in the substrate in the waveguide region, and a reflecting layer is formed over a reflecting-mirror region inside the waveguide region. The method further includes forming and patterning a bottom cladding layer in a wave-tunnel region inside the waveguide region and forming and patterning a core layer and a top cladding layer in the waveguide region.

Single edge coupling of chips with integrated waveguides

Techniques are provided for single edge coupling of chips with integrated waveguides. For example, a package structure includes a first chip with a first critical edge, and a second chip with a second critical edge. The first and second chips include integrated waveguides with end portions that terminate on the first and second critical edges. The second chip includes a signal reflection structure that is configured to reflect an optical signal propagating in one or more of the integrated waveguides of the second chip. The first and second chips are edge-coupled at the first and second critical edges such that the end portions of the integrated waveguides of the first and second chips are aligned to each other, and wherein all signal input/output between the first and second chips occurs at the single edge-coupled interface.

INTEGRATED POLARIZATION SPLITTER AND ROTATOR

An integrated polarization splitter and rotator (PSR) employs the TE0 and TE1 modes of propagating light, rather than the TE0 and TM0 modes used in conventional prior art PSR. The integrated PSR exhibits appreciably flatter wavelength response because it does not require a directional coupler to de-multiplex incoming polarizations. The PSR allows tuning of the TM0 loss to reduce polarization dependent loss (PDL). This integrated polarization splitter and rotator is applicable to all integrated platforms including Silicon-on-Insulator (SOI) and III-V semiconductor compound systems. The PSR may be very compact (12×2 μm), and provides low loss (<0.3 dB across the C-band) and ultra-broadband operation. The PSR also affords better control of polarization dependent losses. 120-. (canceled)21. An optical device , comprising: a first port for receiving an input optical signal comprising a TE0 mode with a first polarization and a TM0 mode with a second polarization;', 'a rotator configured to pass the TE0 mode, and configured to rotate the TE0 mode to a TE1 mode;', 'a splitter configured to split the TE0 mode into a first portion and a second portion, and to split the TE1 mode into a third portion and a fourth portion, and configured to mix the first portion and the third portion to produce a first output TE0 mode signal with the first polarization, and to mix the second portion and the fourth portion to produce a second TE0 output mode signal with the first polarization;', 'a tuner for tuning PDL of the first output TE0 mode signal and the second output TE0 mode signals;', 'a second port for outputting the first output TE0 mode signal; and', 'a third port for outputting the second output TE0 mode signal., 'a first integrated optical apparatus comprising22. The device according to claim 21 , wherein the TE1 mode exits the rotator appearing as two superposed TE0 modes claim 21 , which are out of phase by 180° claim 21 , forming the third portion and the fourth portion.23. The ...

LASER ASSEMBLY PACKAGING FOR SILICON PHOTONIC INTERCONNECTS

Processes and apparatuses described herein reduce the manufacturing time, the cost of parts, and the cost of assembly per laser for photonic interconnects incorporated into computing systems. An output side of a laser assembly is placed against an input side of a silicon interposer (SiP) such that each pad in a plurality of pads positioned on the output side of the laser assembly is in contact with a respective solder bump that is also in contact with a corresponding pad positioned on the input side of the SiP. The laser assembly is configured to emit laser light from the output side into an input grating of the SiP. The solder bumps are heated to a liquid phase. Capillary forces of the solder bumps realign the laser assembly and the SiP while the solder bumps are in the liquid phase. The solder bumps are then allowed to cool. 1. A method comprising:placing an output side of a laser assembly against an input side of a silicon interposer (SiP) such that each pad in a plurality of pads positioned on the output side of the laser assembly is in contact with a respective solder bump that is also in contact with a corresponding pad positioned on the input side of the SiP, wherein the laser assembly comprises a laser diode and is configured to emit laser light from the output side, and wherein the SiP comprises an input grating configured to redirect the laser light through a silicon layer of the SiP;heating the solder bumps to at least a first temperature at which the solder bumps change from a solid phase to a liquid phase;allowing capillary forces of the solder bumps to realign the laser assembly and the SiP while the solder bumps are in the liquid phase; andcooling the solder bumps to a second temperature below the first temperature such that the solder bumps change from the liquid phase to the solid phase, wherein the solder bumps couple the laser assembly to the SiP when the cooling is completed, wherein the output side of the laser assembly comprises an output ...

METHOD FOR MANUFACTURING AN OPTICAL DEVICE

An embodiment optical device includes a glass plate, a first trench disposed in the glass plate, and a second trench disposed in the glass plate. The second trench crosses the first trench, and the first trench has an open end in a first wall of the second trench. The optical device includes a waveguide disposed inside the first trench, where the waveguide is formed of a material having a refractive index different from that of the glass plate, and a mirror on a second wall of the second trench opposite the first wall and waveguide. The optical device includes an encapsulation layer filling the second trench and covering all of an upper surface of the waveguide and having a refractive index that is different from the waveguide and the glass plate.

Optical switches based on induced optical loss

An optical switch device includes a first semiconductor structure configured to operate as a first waveguide and a second semiconductor structure configured to operate as a second waveguide. The second semiconductor structure is located above or below the first semiconductor structure and separated from the first semiconductor structure. The second semiconductor structure includes a first portion having a first width and a second portion having a width different from the first width and located on the first portion. The first portion is located between a first doped region and a second doped region.

PHOTONICS STABILIZATION CIRCUITRY

Methods and apparatus for tuning a photonics-based component. An opto-electrical detector is configured to output an electrical signal based on a measurement of light intensity of the photonics-based component, the light intensity being proportional to an amount of detuning of the photonics-based component. Analog-to-digital conversion (ADC) circuitry is configured to output a digital signal based on the electrical signal output from the opto-electrical detector. Feedback control circuitry is configured to tune the photonics-based component based, at least in part, on the digital signal output from the ADC circuitry. 1. A device , comprising:an opto-electrical detector configured to output an electrical signal based on a measurement of light intensity of a photonics-based component, the light intensity being proportional to an amount of detuning of the photonics-based component;analog-to-digital conversion (ADC) circuitry configured to output a digital signal based on the electrical signal output from the opto-electrical detector; andfeedback control circuitry configured to tune the photonics-based component based, at least in part, on the digital signal output from the ADC circuitry.2. The device of claim 1 , wherein the photonics-based component is a ring resonator.3. The device of claim 1 , whereinthe photonics-based component includes a viewport, andthe opto-electrical detector comprises a photodetector configured to detect a light intensity through the viewport.4. The device of claim 1 , further comprising a digital controller configured to:receive the digital signal output from the ADC circuitry;generate a digital pulse sequence based, at least in part, on the received digital signal; andprovide the digital pulse sequence to the feedback control circuitry.5. The device of claim 4 , wherein the ADC circuitry further comprises an integrating capacitor configured to integrate at least a portion of the electrical signal output from the opto-electrical detector ...

OPTICAL WAVEGUIDE AND OPTICAL CIRCUIT BOARD

An optical waveguide includes a laminate including a lower cladding, a core on the lower cladding, and an upper cladding positioned on the lower cladding and covering the core, via holes positioned in the laminate in a spaced opposing relation to each other, a cavity positioned over a span from an upper surface of the upper cladding to the lower cladding, the cavity including a sectional surface sectioning the core obliquely relative to the upper surface of the upper cladding, and a reflective surface positioned in the core and defined by part of the sectional surface, wherein the cavity extends from a region between the via holes in the spaced opposing relation toward the outside of the region, and an opening size of the cavity in the region is smaller than an opening size of the cavity outside the region when viewed in an opposing direction of the via holes. 1. An optical waveguide comprising:a laminate including a lower cladding, a core on the lower cladding, and an upper cladding positioned on the lower cladding and covering the core;via holes positioned in the laminate in a spaced opposing relation to each other;a cavity positioned over a span from an upper surface of the upper cladding to the lower cladding, the cavity including a sectional surface sectioning the core obliquely relative to the upper surface of the upper cladding; anda reflective surface positioned in the core and defined by part of the sectional surface,wherein the cavity extends from a region between the via holes in the spaced opposing relation toward outside of the region, andan opening size of the cavity in the region is smaller than an opening size of the cavity outside the region when viewed in an opposing direction of the via holes.2. The optical waveguide according to claim 1 , wherein an opening of the cavity has a triangular shape with one of three apexes being positioned in the region.3. The optical waveguide according to claim 2 , wherein claim 2 , outside the region claim 2 , a ...

Optical scanning device that includes waveguides

An optical scanning device includes: a first waveguide that propagates light by total reflection; and a second waveguide. The second waveguide includes: a first multilayer reflective film; a second multilayer reflective film that faces the first multilayer reflective film; and a first optical waveguide layer directly connected to the first waveguide and located between the first and second multilayer reflective films. The first optical waveguide layer has a variable thickness and/or a variable refractive index and propagates the light transmitted through the first waveguide. The first multilayer reflective film has a higher light transmittance than the second multilayer reflective film and allows part of the light propagating through the first optical waveguide layer to be emitted to the outside. By changing the thickness of the first optical waveguide layer and/or its refractive index, the direction of the part of the light emitted from the second waveguide is changed.

OPTICAL COMPONENT HAVING VARIABLE DEPTH GRATINGS AND METHOD OF FORMATION

An optical grating component may include a substrate, and an optical grating, the optical grating being disposed on the substrate. The optical grating may include a plurality of angled structures, disposed at a non-zero angle of inclination with respect to a perpendicular to a plane of the substrate, wherein the plurality of angled structures are arranged to define a variable depth along a first direction, the first direction being parallel to the plane of the substrate. 2. The optical grating of claim 1 , wherein the plurality of angled structures extend along a second direction claim 1 , perpendicular to the first direction claim 1 , and wherein a grating height of an angled structure along the second direction is uniform.3. The optical grating component of claim 2 ,wherein the optical grating is a first optical grating,the optical grating component further comprising a second optical grating, the second optical grating comprising a second plurality of angled structures, disposed at a second non-zero angle of inclination with respect to the perpendicular to the plane of the substrate, wherein the second plurality of angled structures are arranged to define a second variable depth along the second direction.4. The optical grating component of claim 1 , wherein the optical grating comprises silicon oxide claim 1 , silicon nitride claim 1 , or a glass.5. The optical grating component of claim 1 , wherein the optical grating comprises a grating height in a range of 100 nm to 1000 nm claim 1 , wherein the optical grating comprises a grating height variation of 10%-40%.6. The optical grating component of claim 1 , wherein the optical grating is disposed in a grating layer claim 1 , the optical grating component further comprising an etch stop layer claim 1 , disposed between the substrate and the grating layer.7. The optical grating component of claim 6 , wherein the etch stop layer comprises a thickness of 10 nm to 100 nm.8. The optical grating component of claim 6 , ...

INTEGRATED TRANSCEIVER WITH LIGHTPIPE COUPLER

A transceiver comprising a chip, a semiconductor laser, and one or more photodetectors, the chip comprising optical and optoelectronic devices and electronics circuitry, where the transceiver is operable to: communicate, utilizing the semiconductor laser, an optical source signal into the chip via a light pipe with a sloped reflective surface, generate first optical signals in the chip based on the optical source signal, transmit the first optical signals from the chip via the light pipe, and receive second optical signals from the light pipe and converting the second optical signals to electrical signals via the photodetectors. The optical signals may be communicated out of and in to a top surface of the chip. The one or more photodetectors may be integrated in the chip. The optoelectronic devices may include the one or more photodetectors integrated in the chip. The light pipe may be a planar lightwave circuit (PLC). 117-. (canceled)18. A communication system comprising:a transceiver comprising a chip, a semiconductor laser, and one or more photodetectors, said chip comprising optical and optoelectronic devices and electronic circuitry;wherein said semiconductor laser communicates an optical source signal into said chip via a light pipe with a sloped reflective surface, said optical source signal for generating first optical signals that are transmitted from said chip via said light pipe; andwherein second optical signals are received via said light pipe and converted to electrical signals via said one or more photodetectors.19. The system of claim 18 , wherein said optical devices comprise waveguide and couplers claim 18 , and said optoelectronic devices comprise modulators and optical switches.20. The system of claim 18 , wherein said one or more photodetectors are integrated in said chip.21. The system of claim 20 , wherein said optoelectronic devices comprise said one or more photodetectors integrated in said chip.22. The system of claim 18 , wherein said one ...

OPTICAL SENSOR FOR SENSING HYDROGEN GAS AND HYDROGEN GAS DETECTION SYSTEM INCLUDING THE SAME

Embodiments relate to an optical sensor for sensing hydrogen gas, which includes an optical fiber through which light moves; a ferrule formed at one end of the optical fiber to surround the optical fiber; and a sensor module configured to form an interference wave according to a Fabry-Perot interferometer with respect to light that moves through the optical fiber, wherein the sensor module includes a sensing material that expands and contracts by reacting with hydrogen gas, and spectrum periodicity of the interference wave changes according to a volume change of the sensing material, and a hydrogen gas detection system including the optical sensor. 1. An optical sensor for sensing hydrogen gas , comprising:an optical fiber through which light moves;a ferrule formed at one end of the optical fiber to surround the optical fiber; anda sensor module configured to form an interference wave according to a Fabry-Perot interferometer with respect to light that moves through the optical fiber and is output from the optical fiber,wherein the sensor module includes a sensing material that expands and contracts by reacting with hydrogen gas, andwherein spectrum periodicity of the interference wave changes according to a volume change of the sensing material.2. The optical sensor according to claim 1 ,wherein the sensor module includes:a module case having a sidewall for forming a cavity so that one end of the sidewall is in contact with the ferrule;a support layer provided in contact with the other end of the sidewall; anda hydrogen reaction layer formed on the support layer and made of the sensing material,wherein the sensor module is attachable to and detachable from the ferrule, andwherein the light output from the optical fiber moves through the cavity between the ferrule and the support layer.3. The optical sensor according to claim 2 ,wherein the interference wave is formed by repeated reflection and transmission of light between a first reflection surface formed at one ...

PHOTONIC INTEGRATED CIRCUIT DISTANCE MEASURING INTERFEROMETER

A digital measuring device implemented on a photonic integrated circuit, the digital measuring device including a laser source implemented on the photonic integrated circuit configured to provide light, a first waveguide structure implemented on the photonic integrated circuit configured to direct a first portion of light from the laser source at a moving object and receive light reflected from the moving object, a second waveguide structure implemented on the photonic integrated circuit configured to combine a second portion of light from the laser source with the light reflected from the moving object to produce a measurement beam, a first multiplexer implemented on the photonic integrated circuit configured to split the measurement beam into a plurality of channels, and a plurality of detectors implemented on the photonic integrated circuit configured to detect an intensity value of each channel to measure a distance between the digital measuring device and the moving object. 1. A digital measuring device implemented on a photonic integrated circuit , the digital measuring device comprising:a laser source implemented on the photonic integrated circuit configured to provide light;a first waveguide structure implemented on the photonic integrated circuit configured to direct a first portion of light from the laser source at a moving object and receive light reflected from the moving object;a second waveguide structure implemented on the photonic integrated circuit configured to combine a second portion of light from the laser source with the light reflected from the moving object to produce a measurement beam;a first multiplexer implemented on the photonic integrated circuit configured to split the measurement beam into a plurality of channels spaced in frequency; anda first plurality of detectors implemented on the photonic integrated circuit configured to detect an intensity value of each channel of the plurality of channels to measure a distance between the ...

CONTACT IMAGE SENSOR USING SWITCHABLE BRAGG GRATINGS

A contact image sensor having: an illumination; a first SBG array device; a transmission grating; a second SBG array device; a waveguiding layer having a multiplicity of waveguide cores separated by cladding material; an upper clad layer; and a platen. The sensor also including an optical device for coupling light from an illumination source into the first SBG array; and an optical coupler for coupling light out of the cores into output optical paths coupled to a detector having at least one photosensitive element. 1. A contact image sensor comprising the following parallel optical layers configured as a stack:an illumination means for providing a collimated beam of first polarisation light;a first SBG array device further comprising first and second transparent substrates sandwiching an array of selectively switchable SBG column, and transparent electrodes applied to opposing faces of said substrates and said SBG substrates together providing a first TIR light guide for transmitting light in a first TIR beam direction;a transmission grating;a second SBG array device further comprising third and fourth transparent substrates sandwiching a multiplicity of high index HPDLC regions separated by low index HPDLC regions and patterned transparent electrodes applied to opposing faces of said substrates; and a platen; and further comprising:means for coupling light from said illumination means into said first TIR light guide;means for coupling light out of said second SBG array device into an output optical path;and a detector comprising at least one photosensitive element;wherein said high index regions providing waveguiding cores are disposed parallel to said first beam direction,wherein said low index HPDLC regions providing waveguide cladding, said substrate layers having a generally lower refractive index than said cores,wherein said patterned electrodes applied to said third substrate comprise column shaped elements defining a multiplicity of selectively switchable ...

Arrangement of a substrate with at least one optical waveguide and with an optical coupling location and of an optoelectronic component, and method for manufacturing such an arrangement

An arrangement of a substrate with at least one optical waveguide and with an optical coupling location for coupling in and/or coupling out an optical a radiation into and/or out of the at least one optical waveguide, and of at least one optoelectronic component which is assembled on the substrate and a method for manufacturing such an arrangement is suggested. The optical coupling location is designed in a manner such that the radiation is coupled in and/or coupled out with a coupling-in and/or coupling-out angle of greater than 2° to the perpendicular to the substrate surface. The optoelectronic component is assembled over the coupling location on the substrate in a manner tilted obliquely to the substrate surface, wherein the tilt angle to this surface corresponds to the coupling-in angle and/or coupling out-angle.

INTEGRATED SUB-WAVELENGTH GRATING SYSTEM

An integrated grating element system includes a first transparent layer formed on an optoelectronic substrate layer which includes at least two optoelectronic components, a first grating layer disposed on the first transparent layer which includes at least two sub-wavelength grating elements formed therein aligned with active regions of the optoelectronic components, and a second grating layer placed at a distance from the first grating layer such that light propagates between a diffraction grating element formed within the second grating layer and the at least two sub-wavelength grating elements. 1. An integrated grating element system comprising:a first transparent layer formed on an optoelectronic substrate layer, said optoelectronic substrate layer comprising at least two optoelectronic components;a first grating layer disposed on said first transparent layer, said grating layer comprising at least two sub-wavelength grating elements formed therein aligned with active regions of said optoelectronic components; anda second grating layer at a distance from said first grating layer such that light propagates between a diffraction grating element formed within said second grating layer and said at least two sub-wavelength grating elements.2. The system of claim 1 , wherein said distance between said first grating layer and said second grating layer comprises a second transparent layer.3. The system of claim 1 , further comprising claim 1 , reflective surfaces positioned to bounce light between said first grating layer and said second grating layer between said diffraction grating element and said sub-wavelength grating elements.4. The system of claim 1 , wherein said at least two optoelectronic components comprise optical sources to project light of different wavelengths into said sub-wavelength grating elements.5. The system of claim 4 , wherein said sub-wavelength grating elements are to collimate and angle light projected from said optical sources towards said ...

OPTICAL WAVEGUIDE AND MANUFACTURING METHOD THEREOF

The optical waveguide includes: a lower clad layer, a core layer, an upper clad layer, a substrate, and a mirror, the lower clad layer, the core layer, and the upper clad layer being sequentially laminated to the substrate, the mirror being formed on the core layer, in which the substrate has an opening, the maximum diameter of the opening is larger than that of luminous flux reflected by the mirror, and the maximum diameter of the opening is 240 μm or less. The optical waveguide is capable of transmitting a light signal regardless of the type of the substrate, suppressing the spread of a light signal reflected from the mirror, and transmitting a light signal with a low optical transmission loss. 1. An optical waveguide comprising: a lower clad layer , a core layer , an upper clad layer , a substrate , and a mirror , the lower clad layer , the core layer , and the upper clad layer being sequentially laminated to the substrate , the mirror being formed on the core layer , wherein the substrate has an opening , the maximum diameter of the opening is larger than that of luminous flux reflected by the mirror , and the maximum diameter of the opening is 240 μm or less , and a pillar-shaped transparent member projecting from the opening beyond the back surface direction of the substrate , wherein a projecting part of the pillar-shaped transparent member has a pillar shape.2. The optical waveguide according to claim 1 , further comprising a reinforcing plate connected with at least a part of the sidewall of the pillar-shaped transparent member.3. The optical waveguide according to claim 2 , wherein the reinforcing plate is pattern-formed.4. The optical waveguide according to claim 2 , wherein the reinforcing plate is a metal layer.5. The optical waveguide according to claim 1 , further comprising a transparent resin layer A formed of a transparent resin a between the substrate and the lower clad layer claim 1 , wherein the opening is filled with the transparent resin a.6. ...

Optical Switches with Surface Grating Couplers and Edge Couplers

A photonic integrated circuit (PIC) comprises an optical switch, a plurality of input edge couplers comprising a first input edge coupler and coupled to the optical switch, a plurality of input surface grating couplers (SGCs) comprising a first input SGC and coupled to the optical switch, a plurality of output edge couplers comprising a first output edge coupler and coupled to the optical switch, and a plurality of output SGCs comprising a first output SGC and coupled to the optical switch. A method of fabricating a PIC comprises patterning and etching a silicon substrate to produce a first optical switch, a first surface grating coupler (SGC) coupled to the first optical switch, and a first edge coupler coupled to the first optical switch. 1. A photonic integrated circuit (PIC) comprising:an optical switch;a plurality of input edge couplers comprising a first input edge coupler and coupled to the optical switch;a plurality of input surface grating couplers (SGCs) comprising a first input SGC and coupled to the optical switch;a plurality of output edge couplers comprising a first output edge coupler and coupled to the optical switch; anda plurality of output SGCs comprising a first output SGC and coupled to the optical switch.2. The PIC of claim 1 , further comprising a chip claim 1 , wherein the chip comprises the optical switch claim 1 , the input edge couplers claim 1 , the input SGCs claim 1 , the output edge couplers claim 1 , and the output SGCs.3. The PIC of claim 2 , wherein the chip primarily comprises silicon.4. The PIC of claim 2 , wherein the chip is a silicon-on-insulator (SOI) chip.5. The PIC of claim 1 , wherein the optical switch is a dilated optical switch.6. The PIC of claim 5 , wherein the optical switch comprises a Benes network.7. The PIC of claim 1 , wherein the optical switch comprises an input cell and an output cell claim 1 , wherein the input cell comprises a first input and a second input claim 1 , and wherein the output cell comprises a ...

APPARATUS AND METHOD FOR TUNING AND SWITCHING BETWEEN OPTICAL COMPONENTS

Apparatuses and methods for tuning and switching between optical components are provided. The apparatuses and methods may be used in the context of optical communication. An example apparatus may include a first optical path having a first tunable component and a second optical path having a second tunable component. The apparatus may also include a first switch component for selectively connecting the first optical path to an output, and a second switch component for selectively connecting the second optical path to the output. The first and second switch components may be semiconductor optical amplifiers (SOAs). The apparatus may have a controller that controls the first switch component and the second switch component to select which optical path is connected to the output and controls tuning of the tunable component in the optical path that is not connected to the output. 1. An apparatus comprising:a first optical path having a first tunable component and a second optical path having a second tunable component;a first switch component for selectively connecting the first optical path to an output;a second switch component for selectively connecting the second optical path to the output;a controller that controls the first switch component and the second switch component to select which optical path is connected to the output and controls tuning of the tunable component in the optical path that is not connected to the output.2. The apparatus of claim 1 , further comprising an optical coupler that couples the first switch component and the second switch component to the output.3. The apparatus of claim 2 , wherein the optical coupler is a 3 dB directional coupler.4. The apparatus of claim 1 , wherein each switch component is a semiconductor optical amplifier (SOA).5. The apparatus of claim 4 , wherein each SOA is selectively configurable by the controller for reverse biasing.6. The apparatus of claim 1 , wherein each switch component has a switching time of less ...

SYSTEM FOR STABILIZING THE TEMPERATURE SENSITIVITY IN PHOTONIC CIRCUITS COMPRISING THERMOELASTIC OPTICAL CIRCUIT CLADDINGS

A system for stabilizing the temperature sensitivity in photonic circuits comprising a thermoelastic cladding directly overlaid on a photonic circuit, wherein the properties of the thermoelastic cladding are such that the temperature of the photonic circuit is passively stabilized, such as by adjustment of the effective refractive index of the photonic circuit. The thermoelastic cladding may comprise a negative thermo-optic coefficient and the photonic circuit has a positive thermo-elastic coefficient. The thermoelastic cladding may be a liquid, solid, or gas, and may be contained within a chamber having an inlet and an outlet. A pressure sensor may be contained within the chamber for monitoring pressure. The sensor can detect whether the fluid/gas has reached its maximum expansion and can send a signal when that happens. The pressure sensor is connected in a feedback loop and it sends an alarm once the chamber pressure is at a maximum. 1. A system for stabilizing the temperature sensitivity in photonic circuits comprising:a thermoelastic cladding directly overlaid on a photonic circuit, wherein the thermoelastic cladding comprises a negative thermo-optic coefficient (TOC) and the photonic circuit comprises a positive TOC such that the temperature of the photonic circuit is passively stabilized.2. The system of claim 1 , wherein the thermoelastic cladding further comprises a volume thermal expansion coefficient having a range of 600×10/K-1120×10/K and a negative TOC with a range of 0.0003-0.0007-dn/dT.3. The system of claim 2 , wherein the thermoelastic cladding further comprises a refractive index of n=1 to n=2 claim 2 , an extinction coefficient of less than k=7×10 claim 2 , and an absorption coefficient of less than α=5.700 cm.4. The system of claim 3 , wherein the photonic circuit is passively stabilized by adjustment of the effective refractive index of the photonic circuit.5. The system of claim 4 , wherein the thermoelastic cladding is contained within a ...

SURFACE-MOUNT CONNECTOR STRUCTURE FOR EMBEDDED OPTICAL AND ELECTRICAL TRACES

A system for use with optical and electrical signaling is disclosed. The system may include a printed circuit board (PCB) that includes a plurality of layers vertically stacked between a first face and a second face and a first optical signal transmission path within a first internal layer of the plurality of layers. The PCB may also include an electrical signal transmission path and a via extending through the plurality of layers. The via may include a first reflective surface that is configured to reflect light between the first optical signal transmission path and an opening of the via on the first face and an electrically conductive material that is configured to electrically connect the electrical signal transmission path to a portion of the via on the first face. 1. A method for forming a system for use with optical and electrical signaling in a printed circuit board that includes a plurality of layers vertically stacked between a first face and a second face , a first optical signal transmission path within a first internal layer of the plurality of layers and an electrical signal transmission path , the method comprising:creating an opening in the printed circuit board that intersects the first optical signal transmission path and the electrical signal transmission path;depositing an electrically conductive and optically reflective material in the opening;removing an inner portion of the electrically conductive and optically reflective material to form a reflective surface that is configured to reflect light between the optical signal transmission path and an opening of the via on the first face; andremoving an outer portion of the electrically conductive material from the via to allow light from the optical signal transmission path to reach the reflective surface, while leaving a portion of the conductive material in the via in contact with the electrical signal transmission path.2. The method of claim 1 , wherein removing an inner portion of the ...

OPTICAL WAVEGUIDE ELEMENT

An optical waveguide element includes a waveguide core formed of silicon, and a cladding layer formed of a material identical to the waveguide core for enveloping the waveguide core. The optical waveguide element comprising: a high-order propagation mode waveguide; a single input tapered waveguide that is provided on an input terminal of the high-order propagation mode waveguide; a plurality of output tapered waveguides that are provided on an output terminal of the high-order propagation mode waveguide; and an optical feedback elimination waveguide that is provided on the input terminal and disposed alongside the input tapered waveguide. In the optical waveguide element, the input tapered waveguide and the output tapered waveguides are tapered waveguides in which a waveguide width becomes gradually narrower the greater the separation from a terminal of connection to the high-order propagation mode waveguide, and the optical feedback elimination waveguide eliminates reflected light into the cladding layer. 1. An optical waveguide element including a waveguide core formed of silicon , and a cladding layer formed of a material identical to the waveguide core for enveloping the waveguide core , the optical waveguide element comprising:a high-order propagation mode waveguide;a single input tapered waveguide that is provided on an input terminal of the high-order propagation mode waveguide;a plurality of output tapered waveguides that are provided on an output terminal of the high-order propagation mode waveguide; andan optical feedback elimination waveguide that is provided on the input terminal and disposed alongside the input tapered waveguide;whereinthe input tapered waveguide and the output tapered waveguides are tapered waveguides in which a waveguide width becomes gradually narrower the greater the separation from a terminal of connection to the high-order propagation mode waveguide, andthe optical feedback elimination waveguide eliminates reflected light into the ...

Waveguide resonator component and method for the production thereof

The invention pertains to the field of electrical engineering/electronics and relates to a waveguide resonator component, which can be used, for example, in integrated circuits. The problem addressed by the invention is that of producing a waveguide resonator component simply and economically. The problem is solved by a waveguide resonator component in which a substrate ( 1 ) having two waveguides ( 3 ) is present and a microtube ( 2 ) is present as resonator, wherein the resonator has a respective recess ( 4 ) in the region of each waveguide in order to form an intermediate space between the waveguide and the resonator. The aim is additionally achieved by a method in which a sacrificial layer is applied to a substrate having two waveguides and at least a second layer is applied to the sacrificial layer, and thereafter the sacrificial layer is at least partially removed and the resonator is produced in the form of a microtube by rolling up the second layer and possible additional layers.

Optical device

An optical device, comprising: a waveguide substrate in which two waveguides are formed along a waveguide plane, and a first emission light beam and a second emission light beam which are emitted from the two waveguides in parallel with each other; and a condensing member including a first condensing element which emits the first emission light beam after collimation, and a second condensing element which emits the second emission light beam after collimation, the first condensing element and the second condensing element being formed in an element installation surface with a constant interval, wherein when an angle made by an emission end surface of the waveguide substrate in the waveguide plane and a waveguide direction that is an extension direction of the waveguide is set as θ, a relationship of 0°<|θ|<90° is satisfied.

Optical component with angled-facet waveguide

A system comprises a first optical component comprising a component body; at least a first waveguide formed in the component body, wherein the first waveguide is substantially mirror-symmetrical in shape relative to a line at or near the center of the first waveguide; and a self-alignment feature configured to assist in optically-coupling the first waveguide with a second waveguide located outside of the component body.

OPTICAL COMPONENT ALIGNMENT USING INVERTED CARRIER MEMBER

Embodiments include an optical apparatus and associated method of assembling. The optical apparatus comprises a substrate defining a first surface and a channel formed relative thereto, the substrate including one or more waveguides extending to a sidewall partly defining the channel, a plurality of first electrical contacts formed on the first surface. The optical apparatus further comprises a carrier member defining a second surface and at least a third surface, the second surface coupled with the first surface of the substrate. The optical apparatus further at least one optical component coupled with the second surface and at least partly disposed within the channel, wherein the at least one optical component is optically coupled with the one or more waveguides and electrically connected with the first electrical contacts via a plurality of second electrical contacts at the third surface of the carrier member. 1. An optical apparatus comprising:a substrate defining a first surface and a channel formed relative thereto, the substrate including one or more waveguides extending to a sidewall partly defining the channel, a plurality of first electrical contacts formed on the first surface;a carrier member defining a second surface and at least a third surface, the second surface coupled with the first surface of the substrate; anda plurality of optical components coupled with the second surface and at least partly disposed within the channel,wherein the plurality of optical components is optically coupled with the one or more waveguides and electrically connected with the first electrical contacts via a plurality of second electrical contacts at the third surface of the carrier member, andwherein the plurality of optical components comprises a lens component and at least one other optical component, wherein the at least one other component is optically coupled with the one or more waveguides through the lens component.2. The optical apparatus of claim 1 , wherein the ...

Reduction of back reflections

In the examples provided herein, an apparatus has a mode converter coupled to a first waveguide to convert light propagating in a first set of spatial modes along the first waveguide to a second set of spatial modes. The apparatus also has a second waveguide coupled to the mode converter, where the second set of spatial modes propagate along the second waveguide in a first direction away from the mode converter. Further, the apparatus includes a coupler to couple a portion of the light propagating in the second set of spatial modes out of the second waveguide. Additionally, the second waveguide has an end facet away from the mode converter to reduce back reflection of the light not coupled out of the second waveguide to the first waveguide.

SYSTEM ARCHITECTURE FOR INTEGRATED PHOTONICS OPTICAL GYROSCOPES

The present disclosure relates to system-level integration of lasers, electronics, integrated photonics-based optical components and a sensing chip. Novel waveguide design on the integrated photonics chip, acting as a front-end chip, ensures precise detection of phase change in a fiber coil or a sensing chip having a waveguide coil or ring resonator, where the sending chip is coupled to the front end chip. Strip waveguides are designed to primarily select TE mode over TM mode when laser light is coupled into the integrated photonics chip. A plurality of mode-selective filters, based on multi-mode interference (MMI) filter, a serpentine structure, or other types of waveguide-based mode-selective structure, are introduced in the system architecture. Additionally, implant regions are introduced around the waveguides and other optical components to block unwanted/stray light into the waveguides and optical signal leaking out of the waveguide. 1. An integrated photonics-based front-end chip for coupling light into and out of an optical waveguide chip , the front-end chip comprising:a light source, wherein the light source comprises one or more semiconductor lasers;control electronics for the light source;an input coupler that couples the light from the light source into an integrated photonics waveguide structure on the front-end chip that propagates the coupled light in the form of a guided optical beam towards the optical waveguide chip;one or more optical mode-selective filters integrated with the integrated photonics waveguide structure to select a preferred optical mode of the guided optical beam;at least one optical splitter in the path of the guided optical beam to produce a first branch and a second branch of the guided optical beam;a phase modulator that modulates optical phases of the first branch and the second branch of the guided optical beam relative to each other;a first output coupler that couples the first branch of the guided optical beam with a first ...

PHOTONIC INTEGRATED DISTANCE MEASURING PIXEL AND METHOD OF DISTANCE MEASUREMENT

A distance-measuring pixel apparatus includes a photonic integrated circuit disposed on a common substrate that further includes a photonic integrated circuit substrate having disposed thereon two 3 dB directional couplers, a GRIN lens, and a partially reflecting Faraday mirror having a first side that is optomechanically coupled to a second side of the GRIN lens; and a source laser, a first photodetector, and a second photodetector. A related distance measuring method includes, using the distance-measuring pixel apparatus, generating a local oscillator (LO) beam, generating an echo, combining the LO beam and the echo beam, splitting the combined LO beam and the echo beam, and producing a modulation of the photodetector assembly photocurrent at a frequency that encodes the distance of a remote object. 1. A distance-measuring pixel apparatus , comprising: a photonic integrated circuit substrate having disposed thereon,', 'a first 3 dB directional coupler having first and second output ports and first and second input ports;', 'a second 3 dB directional coupler having first and second output ports and first and second input ports,, 'a photonic integrated circuit disposed on a common substrate, comprising a GRIN lens having a first side that is optomechanically coupled to the first output port of the first 3 dB directional coupler;', 'a partially reflecting Faraday mirror having a first side that is optomechanically coupled to a second side of the GRIN lens;, 'wherein the second input port of the first 3 dB directional coupler is directly optically coupled to the first input port of the second 3 dB directional coupler;'}a source laser having an output that is optically coupled to the first input port of the first 3 dB directional coupler;a first photodetector optomechanically coupled to the first output port of the second 3 dB directional coupler; anda second photodetector optomechanically coupled to the second output port of the second 3 dB directional coupler.2. The ...

Method of Making a Metal Grating in a Waveguide and Device Formed

A method of making a grating in a waveguide includes forming a waveguide material over a substrate, the waveguide material having a thickness less than or equal to about 100 nanometers (nm). The method further includes forming a photoresist over the waveguide material and patterning the photoresist. The method further includes forming a first set of openings in the waveguide material through the patterned substrate and filling the first set of openings with a metal material. 1. A waveguide structure comprising:a substrate;a dielectric layer over the substrate, the dielectric layer comprising a light-transmissive material, the dielectric layer having a first surface facing towards the substrate and a second surface facing away from the substrate;a plurality of first metal features extending from the first surface of the dielectric layer to the second surface of the dielectric layer, the first metal features having a first pitch; anda plurality of second metal features extending from the first surface of the dielectric layer to the second surface of the dielectric layer, the second metal features having a second pitch, the second pitch being different from the first pitch.2. The waveguide structure of claim 1 , wherein the light-transmissive material is one of silicon dioxide claim 1 , silicon carbide claim 1 , carbon nitride claim 1 , silicon oxynitride claim 1 , or silicon nitride.3. The waveguide structure of claim 1 , wherein a thickness of the dielectric layer is less than or equal to about 100 nanometers.4. The waveguide structure of further comprising:an insulating layer disposed between the dielectric layer and the substrate.5. The waveguide structure of claim 4 , wherein the insulating layer comprises one of silicon dioxide claim 4 , silicon carbide claim 4 , carbon nitride claim 4 , silicon oxycarbide claim 4 , or silicon nitride.6. The waveguide structure of claim 1 , wherein each of the first metal features and each of the second metal features have a ...

Optical splitter circuit

Provided is an optical splitter circuit capable of solving a problem that stability of an optical splitting ratio is low. An optical splitter 201 splits an input light beam. Arm waveguides 202 and 203 each have a width that decreases in a direction in which a light beam propagates and a tapered structure that propagates the light beam split by the optical splitter 201. Taper angles of these tapered structures differ from each other. The optical multiplexer 204 multiplexes the light beams from the arm waveguides 202 and 203 and then outputs them.

Semiconductor optical modulator

A semiconductor optical modulator includes an input waveguide provided on a side of a substrate, a first and a second output waveguides provided on the same side of the substrate, a dividing portion optically connected to the input waveguide, eight arm waveguides optically connected to the dividing portion, a first multiplexing portion optically connecting four of the arm waveguides to the first output waveguide, a second multiplexing portion optically connecting the other four of the arm waveguides to the second output waveguide, and modulation electrodes provided on respective ones of the eight arm waveguides. The first and second output waveguides are arranged symmetrically about the input waveguide.

MODE MATCHED Y-JUNCTION

A mode-matched waveguide Y-junction with balanced or unbalanced splitting comprises an input waveguide, expanding from an input end to an output end, for expanding the input beam of light along a longitudinal axis; first and second output waveguides extending from the output end of the input waveguide separated by a gap. Ideally, each of the first and second output waveguides includes an initial section capable of supporting a fundamental super mode, and having an inner wall substantially parallel to the longitudinal axis, and a mode splitting section extending from the initial section at an acute angle to the longitudinal axis. 120-. (canceled)21. A splitter for splitting an input beam of light into first and second portions comprising:an input port for launching the input beam of light;an input waveguide including a longitudinal axis, capable of providing adiabatic expansion of the input beam of light from an input end proximate the input port to an output end, which has a width that supports a fundamental mode and a second order mode;first and second output waveguides extending from the output end of the input waveguide on either side of the longitudinal axis, and separated by a gap; andfirst and second output ports for outputting the first and second portions, respectively; an initial section, including an initial width smaller than the input end of the input waveguide, whereby the initial sections and the gap form a single waveguide capable of supporting a super mode of the input beam of light, which spans the initial sections of the first and second output waveguides and the gap;', 'a mode splitting section extending from the initial section at an acute angle to the longitudinal axis for splitting the super mode of the input beam of light into first and second portions; and', 'a final expansion section extending from the mode splitting section, at least one of the final expansion sections including an expanding width expanding to a same width as the input end ...

Plasmonic funnel for focused optical delivery to a metallic medium

An apparatus includes a transducer including a plasmonic funnel having first and second ends with the first end having a smaller cross-sectional area than the second end, and a first section positioned adjacent to the first end of the plasmonic funnel, and a first waveguide having a core, positioned to cause light in the core to excite surface plasmons on the transducer.

POLARIZATION BEAM COMBINER/SPLITTER, POLARIZATION BEAM COMBINING/SPLITTING STRUCTURE, LIGHT MIXER, OPTICAL MODULATOR MODULE, AND METHOD FOR MANUFACTURING POLARIZATION BEAM COMBINER/SPLITTER

The present invention provides a polarization beam combiner/splitter, a polarization beam combining/splitting structure, a light mixer, an optical modulator module, and a method for manufacturing a polarization beam combiner/splitter with suitable polarization beam combining/splitting characteristics. In the polarization beam combiner/splitter, a polarization beam combining/splitting film is placed on a substrate and allows TE light to pass through and causes TM light to branch off. A first optical waveguide is formed on the substrate with an end surface facing a first surface of the polarization beam combining/splitting film and with a waveguide direction coinciding with a propagation direction of the TE light. A second optical waveguide is formed on the substrate with an end surface facing a second surface of the polarization beam combining/splitting film and with a waveguide direction coinciding with a propagation direction of the TM light. 1. A polarization beam combiner/splitter comprising:a substrate;a polarization beam combining/splitting film placed on the substrate, for allowing a first polarization signal to pass through and causing a second polarization signal having a different polarization plane from the first polarization signal to branch off;a first optical waveguide placed on the substrate, with an end surface facing a first surface of the polarization beam combining/splitting film and with a waveguide direction coinciding with a propagation direction of the first polarization signal; anda second optical waveguide placed on the substrate, with an end surface facing a second surface on an opposite side of the first surface of the polarization beam combining/splitting film and with a waveguide direction coinciding with a propagation direction of the second polarization signal.2. The polarization beam combiner/splitter according to claim 1 , whereinthe polarization beam combining/splitting film allows the first polarization signal contained in incident ...

OPTICAL DEVICE AND FABRICATION METHOD OF OPTICAL DEVICE

An optical device includes a substrate having an electrooptical effect, and including an optical waveguide that guides light and a reflection groove having a bottom face that reflects light output from the optical waveguide; and a light-receiving element positioned above the reflection groove and fixed to the substrate. The light output from the optical waveguide into the reflection groove is reflected by the bottom face of the reflection groove while traveling through a space inside the reflection groove and is incident to the light-receiving element. 1. An optical device comprising:a substrate having an electrooptical effect, and including an optical waveguide that guides light and a reflection groove having a bottom face that reflects light output from the optical waveguide; anda light-receiving element positioned above the reflection groove and fixed to the substrate, whereinthe light output from the optical waveguide into the reflection groove is reflected by the bottom face of the reflection groove while traveling through a space inside the reflection groove and is incident to the light-receiving element.2. The optical device according to claim 1 , whereina part through which the light travels in the space inside the reflection groove is filled with air.3. The optical device according to claim 1 , whereinthe reflection groove has an end face from which the light from the optical waveguide is output, the end face being a sloped surface that refracts the light output from the optical waveguide, causing the light to travel toward the bottom face of the reflection groove.4. The optical device according to claim 3 , whereinthe sloped surface forms, with respect to a direction of thickness of the substrate, an angle that is smaller than an angle at which the light traveling through the optical waveguide is totally reflected by the sloped surface.5. The optical device according to claim 1 , comprisinga reflection groove protecting projection formed around the ...

OPTICAL WAVEGUIDE AND MANUFACTURING METHOD THEREOF

The optical waveguide includes: a lower clad layer, a core layer, an upper clad layer, a substrate, and a mirror, the lower clad layer, the core layer, and the upper clad layer being sequentially laminated to the substrate, the mirror being formed on the core layer, in which the substrate has an opening, the maximum diameter of the opening is larger than that of luminous flux reflected by the mirror, and the maximum diameter of the opening is 240 μm or less. The optical waveguide is capable of transmitting a light signal regardless of the type of the substrate, suppressing the spread of a light signal reflected from the mirror, and transmitting a light signal with a low optical transmission loss. 1. An optical waveguide comprising: a lower clad layer , a core layer , an upper clad layer , a substrate , and a mirror , the lower clad layer , the core layer , and the upper clad layer being sequentially laminated to the substrate , the mirror being formed on the core layer , wherein the substrate has an opening , the maximum diameter of the opening is larger than that of luminous flux reflected by the mirror , and the maximum diameter of the opening is 240 μm or less.2. The optical waveguide according to claim 1 , further comprising a pillar-shaped transparent member projecting from the opening to the back surface direction of the substrate.3. The optical waveguide according to claim 2 , further comprising a reinforcing plate connected with at least a part of the sidewall of the pillar-shaped transparent member.4. The optical waveguide according to claim 3 , wherein the reinforcing plate is pattern-formed.5. The optical waveguide according to claim 3 , wherein the reinforcing plate is a metal layer.6. The optical waveguide according to claim 1 , further comprising a transparent resin layer A formed of a transparent resin a between the substrate and the lower clad layer claim 1 , wherein the opening is filled with the transparent resin a.7. The optical waveguide ...

Apparatus and method for passive alignment of optical devices

An apparatus for passive alignment of optical devices comprises a substrate including a trench in a top surface thereof, where the trench has a first end positioned at an edge of the substrate and a second end positioned at an interior region of the substrate, and a lens disposed on the top surface of the substrate adjacent to the second end of the trench. The apparatus further includes a top holder having a longitudinal indentation in a bottom surface thereof for mounting an optical fiber. The longitudinal indentation is sized to fit a top portion of the optical fiber such that a bottom portion of the optical fiber extends below the bottom surface of the top holder when the optical fiber is mounted therein. One or both of the substrate and the top holder include one or more spacer features configured for three-dimensional (3D) alignment of the lens with the optical fiber when the top holder is brought into contact with the substrate.

Waveguide Structure

A waveguide structure includes a bottom dielectric layer, a core layer disposed over the bottom dielectric layer, an etch stop layer disposed over the core layer, and a cladding layer or a buffer layer disposed over the etch stop layer. The waveguide structure is configured to guide a light signal through different geography, such as straight, taper, turning, grating and tight coupling sections. 1. A waveguide structure , comprising:a bottom dielectric layer;a core layer disposed over the bottom dielectric layer;an etch stop layer disposed over the core layer; anda cladding layer disposed over the etch stop layer,wherein the waveguide structure is configured to guide a light signal.2. The waveguide structure of claim 1 , wherein the core layer comprises silicon nitride or a high-k dielectric material.3. The waveguide structure of claim 1 , wherein the etch stop layer has an equal or higher refractive index compared to the cladding layer.4. The waveguide structure of claim 1 , wherein the etch stop layer has a lower refractive index compared to the core layer.5. The waveguide structure of claim 1 , wherein the etch stop layer comprises silicon oxynitride or a low-k dielectric material.6. The waveguide structure of claim 1 , further comprising a buffer layer disposed between the etch stop layer and the cladding layer claim 1 , wherein the buffer layer has a higher refractive index compared to the cladding layer.7. The waveguide structure of claim 6 , wherein the buffer layer has a higher refractive index compared to the etch stop layer.8. The waveguide structure of claim 6 , wherein the buffer layer has a lower or equal refractive index compared to the core layer.9. The waveguide structure of claim 6 , wherein the buffer layer comprises silicon oxynitride or a high-k dielectric material.10. The waveguide structure of claim 1 , wherein the cladding layer comprises silicon dioxide or a low-k dielectric material.11. A method of fabricating a waveguide structure claim 1 , ...

Optical Interconnector, Optoelectronic Chip System, and Optical Signal Sharing Method

An optical interconnector ( 915 ) includes: a first vertical coupled cavity ( 100 ), a first optical waveguide ( 102 ), and a second optical waveguide ( 103 ). The first vertical coupled cavity ( 100 ) includes N identical micro-resonant cavities that are equidistantly stacked, where a center of each micro-resonant cavity is located on a first straight line that is perpendicular to a plane on which the micro-resonant cavity is located, the first optical waveguide ( 102 ) and a first micro-resonant cavity ( 11 ) are in a same plane, the second optical waveguide ( 103 ) and a second micro-resonant cavity ( 13 ) are in a same plane, the first optical waveguide ( 102 ) is an input optical waveguide, the second optical waveguide ( 103 ) is a first output optical waveguide, and an optical signal having a first resonant wavelength in the first optical waveguide ( 102 ) enters the second optical waveguide ( 103 ) through the first vertical coupled cavity ( 100 ).

OPTICAL DEVICE USING ECHELLE GRATING THAT PROVIDES TOTAL INTERNAL REFLECTION OF LIGHT

Embodiments of the present disclosure are directed toward techniques and configurations for an optical device having a semiconductor layer to propagate light and a mirror disposed inside the semiconductor layer and having echelle grating reflective surface to substantially totally internally reflect the propagating light inputted by one or more input waveguides, to be received by one or more output waveguides. The waveguides may be disposed in the semiconductor layer under a determined angle relative to the mirror reflective surface. The determined angle may be equal to or greater than a total internal reflection angle corresponding to the interface, to provide substantially total internal reflection of light by the mirror. The mirror may be formed by an interface of the semiconductor layer comprising the mirror reflective surface and another medium filling the mirror, such as a dielectric. Other embodiments may be described and/or claimed. 1. An optical apparatus comprising:a semiconductor layer to propagate light from at least one light source;a mirror disposed inside the semiconductor layer, and having echelle grating reflective surface to reflect and refocus the propagating light;at least one input optical waveguide disposed inside the semiconductor layer to spatially disperse the propagating light onto the mirror; andat least one output optical waveguide disposed inside the semiconductor layer to receive at least a portion of light reflected by the mirror,wherein the input and output optical waveguides are disposed under a determined angle relative to the mirror reflective surface, to provide substantially total internal reflection of light by the mirror.2. The optical apparatus of claim 1 , wherein the mirror is formed in a trench disposed in the semiconductor layer.3. The optical apparatus of claim 2 , wherein the mirror reflective surface is etched on at least one facet of the trench.4. The optical apparatus of claim 3 , wherein the trench is filled with a ...

SEMICONDUCTOR DEVICE

A semiconductor device for use in an optical application and a method for fabricating the device. The device includes: an optically passive aspect that is operable in a substantially optically passive mode; and an optically active material having a material that is operable in a substantially optically active mode, wherein the optically passive aspect is patterned to include a photonic structure with a predefined structure, and the optically active material is formed in the predefined structure so as to be substantially self-aligned in a lateral plane with the optically passive aspect. 1. A method for fabricating a semiconductor device for use in an optical application , the method comprising:providing an optically passive aspect that is operable in a substantially optically passive mode;providing an optically active material having a material that is operable in a substantially optically active mode;wherein the optically passive aspect is patterned to include a photonic structure with a predefined structure; andwherein the optically active material is formed in the predefined structure so as to be substantially self-aligned in a lateral plane with the optically passive aspect.2. The method according to claim 1 , wherein the optically active material is substantially selectively formed in the predefined structure.3. The method according to claim 1 , wherein the optically active material is formed relative to the optically passive aspect so as to exceed an area of the predefined structure.4. The method according to claim 3 , wherein excess optically active material is removed so that the optically active material is provided in the predefined structure.5. The method according to claim 4 , wherein the excess optically active material is removed by wet-chemical etching or chemical mechanical polishing.6. The method according to claim 1 , wherein a structural characteristic of the predefined structure is chosen to facilitate the optically active material to be ...

Transmission type high-absorption optical modulator and method of manufacturing the same

Provided are a transmission type high-absorption optical modulator and a method of manufacturing the transmission type high-absorption optical modulator. The optical modulator includes: a substrate; a lower distributed Bragg reflector (DBR) layer on the substrate; a lower clad layer on the lower DBR layer; an active layer that is formed on the lower clad layer and includes a quantum well layer and a quantum barrier layer; an upper clad layer on the active layer; an upper DBR layer on the upper clad layer; and a doping layer that supplies carriers to the quantum well layer. In the optical modulator, the doping layer may be included in the quantum barrier layer or in at least one of the upper and lower clad layers.

Integrated ldmos devices for silicon photonics

A device includes a laterally diffused metal-oxide-semiconductor (LDMOS) device integrated with an optical modulator. An optical waveguide of the optical modulator includes a silicon-containing structure in a drift region of the LDMOS device.