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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Форма поиска

Поддерживает ввод нескольких поисковых фраз (по одной на строку). При поиске обеспечивает поддержку морфологии русского и английского языка
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Применить Всего найдено 5223. Отображено 100.
05-01-2012 дата публикации

Optoelectronic module having an adapter for use in extracting the module from a cage

Номер: US20120002927A1
Автор: Robert Yi
Принадлежит: Avago Technologies Fiber IP Singapore Pte Ltd

An optoelectronic module is provided that has an adapter that interacts with the tongue actuator of a module removal tool to actuate the cage tongue. Actuation of the cage tongue causes the latch disposed on the optoelectronic module to retract from the opening formed in the tongue to allow the optoelectronic module to be removed from the cage by the module removal tool. The adapter enables the module removal tool to be used to remove the module from the cage despite the fact that the distance between the optical reference plane and the mechanical actuation plane and the distance between the optical reference plane and the bottom surface of the cage may differ.

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Номер записи: 1
23-02-2012 дата публикации

Optical module with ceramic package

Номер: US20120045183A1
Автор: Fumihiro Nakajima, Toshio Takagi, Yasushi Fujimura
Принадлежит: Sumitomo Electric Industries Ltd

An optical module with an arrangement is disclosed in which the module has the LD, the TEC, and the lens with the lens carrier also mounted on the TEC. The signal light from the LD is concentrated by the lens and reflected by the mirror each assembled with the lens carrier mounted on the TEC. The TEC is mounted on the bottom metal that covers the bottom of the ceramic package, the first layer of which is widely cut to set the TEC therein. The FPC is coupled in at least two edges of the first ceramic layer left from the cut.

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Номер записи: 2
15-03-2012 дата публикации

Connector, optical transmission device, and connector connection method

Номер: US20120063785A1
Автор: Takatoshi Yagisawa
Принадлежит: Fujitsu Ltd

A connector includes an electrode sheet, a cover, and a resistor sheet. A plurality of electrodes are attached on a side of the electrode sheet. The electrode sheet is an insulator. The cover covers the electrode sheet. The resistor sheet is provided between the cover and the electrode sheet and has electrical resistivity.

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Номер записи: 3
10-05-2012 дата публикации

Optical transmitter and interconnecting circuit board

Номер: US20120114340A1
Автор: Masaki Sugiyama
Принадлежит: Fujitsu Optical Components Ltd

An optical transmitter including: an optical module; an interconnecting circuit board configured to be electrically coupled to the optical module; and a printed circuit board configured to be electrically coupled to the interconnecting circuit board; wherein the interconnecting circuit board includes: a coplanar waveguide; and a microstrip line including a signal wiring line extended from an end of the coplanar waveguide and a ground wiring line, wherein the width of the signal wiring line is narrower than the width of a signal wiring line of the coplanar waveguide, and the spacing between the signal wiring line extended from the end of the coplanar waveguide and the ground wiring line is smaller than the spacing between the signal wiring line of the coplanar waveguide and the ground wiring line.

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Номер записи: 4
21-06-2012 дата публикации

Element carrier and light receiving module

Номер: US20120153132A1
Автор: Eiji Yagyu, Kohei Sugihara, Satoshi Kajiya, Satoshi Nishikawa, Toshiharu Miyahara, Yasuhisa Shimakura, Yuichiro Horiguchi
Принадлежит: Mitsubishi Electric Corp

An element carrier has a mounting surface where at least one element outputting a high-frequency signal is disposed. A first dielectric layer has a first side surface partially forming the mounting surface and a first main surface connecting to the first side surface and extending in an intersecting direction intersecting with the mounting surface. A first wiring pattern is provided on the first main surface and extends from the first side surface. A second dielectric layer has a second side surface partially forming the mounting surface and a second main surface connecting to the second side surface and extending in the intersecting direction, and is provided on a part of the first main surface of the first dielectric layer where the first wiring pattern is provided. A second wiring pattern is provided on the second main surface of the second dielectric layer and extends from the second side surface.

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Номер записи: 5
19-07-2012 дата публикации

Optical transceiver module having an electromagnetic interference (emi) cancellation device disposed therein, and an emi cancelation method for use in an optical transceiver module

Номер: US20120183302A1
Автор: Laurence R. McColloch, Zuowei Shen
Принадлежит: Avago Technologies Fiber IP Singapore Pte Ltd

A floating heat sink device is provided that attaches to a cage in a floating configuration that enables the heat sink device to move, or “float”, as the parallel optical communications device secured to the cage moves relative to the cage. Because the heat sink device floats with movement of the parallel optical communications device, at least one surface of the parallel optical communications device maintains continuous contact with at least one surface of the heat sink device at all times. Ensuring that these surfaces are maintained in continuous contact at all times ensures that heat produced by the parallel optical communications device will be transferred into and absorbed by the floating heat sink device.

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Номер записи: 6
27-09-2012 дата публикации

Combined Optical and Electrical Interface

Номер: US20120243837A1
Автор: Hengju Cheng, Jamyuen Ko, Simon S. Lee
Принадлежит: Intel Corp

A connection port provides electrical and/or optical interface capability. The combined electrical and optical interface port may include an optical communication light engine within the connection port itself. The connection port includes a connector housing, an electrical interface assembly, and an optical interface assembly incorporated together. One implementation of the optical communication light engine includes a laser diode to generate optical signals, a photo diode to receive optical signals, and an optical integrated circuit (IC) to control optical interface.

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Номер записи: 7
06-06-2013 дата публикации

Electromagnetic radiation shield for an electronic module

Номер: US20130142490A1
Автор: Chris K. Togami, Frank J. Flens, Tat Ming Teo
Принадлежит: Finisar Corp

An electromagnetic radiation shield for an electronic module. In one example embodiment, an EMR shield for an electronic transceiver module includes a conductive carrier sized and configured to surround a shell of an electronic transceiver module. The conductive carrier defines a plurality of extended elements located on at least one edge of the conductive carrier and an orientation element. Each extended element is configured to bias against the shell in order to create a physical and electrical contact between the conductive carrier and the shell. The orientation element is configured to engage a corresponding structure in the shell in order to correctly orient the conductive carrier with respect to the shell.

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Номер записи: 8
11-07-2013 дата публикации

Small packaged tunable laser assembly

Номер: US20130177034A1
Автор: Andrew John Daiber, Boyang LIU, Shengbo Xu, Yinan Wu
Принадлежит: Emcore Corp

A tunable laser configured in a small package coupled to a printed circuit board. The tunable laser includes a housing with a volume formed by exterior walls. An electrical input interface is positioned at the first end of the housing. An optical output interface is positioned at the second end of the housing and configured to transmit a continuous wave optical beam. A beam splitter and photodiode is disposed in the path of the laser beam for determining the emitted intensity of the laser beam, and an optical isolator is positioned downstream of the beam splitter to prevent the incoming light from the beam splitter from reflecting back though the beam splitter and into the cavity of the laser.

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Номер записи: 9
05-09-2013 дата публикации

Chip assembly configuration with densely packed optical interconnects

Номер: US20130230272A1
Автор: David K. McElfresh, Dawei Huang, Kannan Raj, Nicholas E. Aneshansley, Theresa Sze
Принадлежит: Oracle International Corp

A chip assembly configuration includes an substrate with an integrated circuit on one side and a conversion mechanism on the other side. The integrated circuit and the conversion mechanism are electrically coupled by a short electrical transmission line through the substrate. Moreover, the conversion mechanism converts signals between an electrical and an optical domain, thereby allowing high-speed communication between the integrated circuit and other components and devices using optical communication (for example, in an optical fiber or an optical waveguide).

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Номер записи: 10
03-10-2013 дата публикации

Optical connector package and optical connector

Номер: US20130259432A1
Автор: Kai-Wen Wu
Принадлежит: Hon Hai Precision Industry Co Ltd

An optical connector package includes a substrate and a casing positioned on the substrate and comprising a positioning pin. The casing and the substrate cooperatively define a receiving space. The positioning pin defines a vent functioning as a sole channel communicating the receiving space with the outside of the casing. The vent is sealed after the optical connector package subjects to all required heating processes.

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Номер записи: 11
24-10-2013 дата публикации

Optical Module Base and Optical Module

Номер: US20130279861A1
Автор: HASHIGUCHI Osamu
Принадлежит: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED

An optical module base is made up of a plurality of lead frames and a resin structure integrally molded with the lead frames and has an optical device mounting part and an optical waveguide mounting part which are formed in the resin structure. Each of the lead frames includes a connection part to which an optical device is to be mounted and electrically connected and a lead part which is continuous with the connection part. A portion of the thickness of the connection part is embedded in the resin structure and is positioned at the optical device mounting part. A sufficient strength of fixing a lead frame on a resin structure integrally molded with the lead frame can be ensured even if the sizes of the lead frames are miniaturized according to the sizes of electrodes of an optical device to be flip-chip bonded. 1. An optical module base made up of a plurality of lead frames and a resin structure integrally molded with the lead frames and having an optical device mounting part and an optical waveguide mounting part which are formed in the resin structure ,wherein each of the lead frames comprises a connection part to which an optical device is to be mounted and electrically connected and a lead part continuous with the connection part; anda portion of the thickness of the connection part is embedded in the resin structure and positioned at the optical device mounting part.2. The optical module base according to claim 1 ,wherein a base end of the connection part that is connected to the lead part is bent and the connection part is positioned higher than the lead part.3. The optical module base according to claim 2 ,wherein the difference in height between the connection part and the lead part is smaller than the thickness of the lead frame.4. The optical module base according to claim 1 ,wherein three of the connection parts are positioned at the optical device mounting part so that the optical device is three-point-supported by the three connection parts.5. The ...

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Номер записи: 12
05-12-2013 дата публикации

Element housing package, component for semiconductor device, and semiconductor device

Номер: US20130322036A1
Автор: Mahiro Tsujino
Принадлежит: Kyocera Corp

An element housing package includes a base body having a rectangular shape, having a mounting region for mounting a semiconductor element, a frame body disposed so as to surround the mounting region, a connection conductor disposed from the upper surface to a lower surface of the base body, a circuit conductor disposed on the lower surface of the base body, one end of the circuit conductor being electrically connected to the connection conductor and an other end of the circuit conductor being drawn out laterally from a first side surface of the base body, and a metal plate bonded to the lower surface of the base body, having an attachment region and a ground conductor region. The metal plate has an outer peripheral region which is drawn out laterally from the base body, from the ground conductor region to the attachment region along an outer periphery of the base body.

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Номер записи: 13
05-12-2013 дата публикации

FLEXIBLE CIRCUIT BOARD

Номер: US20130322833A1
Автор: HIRAYAMA Masahiro
Принадлежит:

A flexible circuit board includes: an insulative substrate having a first surface and a second surface opposite to the first surface; a microstrip line having a first signal line formed on the first surface and a first ground pattern formed on the second surface and located in an area opposite to the first signal line; a coplanar line having a second signal line formed on the first surface, and second ground patterns that are formed on the first surface and are spaced apart from both sides of the second signal line; a connection line that is formed on the first surface and connects the first signal line and the second signal line together, the connection line having an opening; and third ground patterns formed on the second surface and arranged in areas located at both sides of an area opposite to the connection line including the opening. 1. A flexible circuit board comprising:an insulative substrate having a first surface and a second surface opposite to the first surface;a microstrip line having a first signal line formed on the first surface and a first ground pattern formed on the second surface and located in an area opposite to the first signal line;a coplanar line having a second signal line formed on the first surface, and second ground patterns that are formed on the first surface and are spaced apart from both sides of the second signal line;a connection line that is formed on the first surface and connects the first signal line and the second signal line together, the connection line having an opening; andthird ground patterns formed on the second surface and arranged in areas located at both sides of an area opposite to the connection line including the opening.2. The flexible circuit board according to claim 1 , wherein the connection line includes branch lines defined by the opening claim 1 , and one of the branch lines that is substantially as wide as the first signal line and is aligned with the first signal line.3. The flexible circuit board ...

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Номер записи: 14
30-01-2014 дата публикации

Photonic package architecture

Номер: US20140029639A1
Автор: Debendra Mallik, Edward A. Zarbock
Принадлежит: Intel Corp

A photonic package includes a photonic device having a photon emitter on the front side of the die. A beam of photons from the photon emitter passing from the front side to the backside of the die, passes through the substrate material of the die which is substantially transparent to the beam of photons, to the backside of the die. Other embodiments are also described.

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Номер записи: 15
03-04-2014 дата публикации

Subsea Cable Termination Assembly, Subsea Connector and Method

Номер: US20140093247A1
Автор: Jamtveit Endre Fosso, Villmark Trond Holger
Принадлежит:

A subsea cable termination assembly for a subsea cable that includes an optical fiber for data transmission is provided. The subsea cable termination assembly includes a chamber that has a liquid tight seal against an ambient medium surrounding the subsea cable termination assembly, and a media converter arranged in the chamber. The media converter includes an optical interface adapted to be connected to an optical fiber of the subsea cable, and an electrical interface. The subsea cable termination assembly also includes an electric contact arranged outside the chamber and electrically connected to the electrical interface of the media converter arranged inside the chamber. 1. A subsea cable termination assembly for a subsea cable that includes an optical fiber for data transmission , the subsea cable termination assembly comprising:a chamber that has a liquid tight seal against an ambient medium surrounding the subsea cable termination assembly;a media converter arranged in the chamber, the media converter comprising an optical interface and an electrical interface, the optical interface adapted to be connected to the optical fiber of the subsea cable; andan electric contact arranged outside the chamber and electrically connected to the electrical interface of the media converter arranged inside the chamber,wherein the media converter is adapted to receive data on one interface of the electrical interface and the optical interface and to transmit corresponding data on the other interface of the electrical interface and the optical interface.2. The subsea cable termination assembly of claim 1 , wherein the chamber is a pressure resistant chamber adapted to maintain an inside pressure between 0.5 and 5 bar.3. The subsea cable termination assembly of claim 1 , further comprising a fiber optic penetrator operable to provide an optical connection through a wall of the chamber claim 1 , the fiber optic penetrator operable to provide a pressure resistant and liquid-tight ...

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Номер записи: 16
06-01-2022 дата публикации

FIBER OPTIC CABLE ASSEMBLY WITH A TRACER COMPONENT

Номер: US20220003947A1
Автор: ALVAREZ Paul T., GONZALEZ Yvette, HYNES Joseph M.
Принадлежит: CommScope Technologies LLC

A cable assembly including a tracer conduit and one or more data transmission conduits. Physically separable proximal and/or distal portions of the data transmission conduit(s) and the tracer conduit are held together by a sleeve. In some examples the sleeve is axially and radially expandable and collapsible multiple times. In some examples, the tracer conduit transmits a visible laser light signal that can be observed after it radially diffuses through the sleeve. 1. A cable assembly comprising:at least one transmission conduit having a first axial length extending along an axis of the transmission conduit from a first proximal end to a first distal end of the at least one transmission conduit, the at least one transmission conduit including a first proximal portion, a first distal portion, and a first middle portion positioned between the first proximal portion and the first distal portion, the first distal portion extending distally from a breakout location to the first distal end of the at least one transmission conduit;a tracer conduit having a second axial length extending along an axis of the tracer conduit from a second proximal end to a second distal end of the tracer conduit, the tracer conduit being adapted to carry a tracer signal from the second proximal end to the second distal end, the tracer conduit including a second proximal portion, a second distal portion, and a second middle portion positioned between the second proximal portion and the second distal portion, the second distal portion extending distally from the breakout location to the second distal end of the tracer conduit, an axial length of the second distal portion being different than an axial length of the first distal portion; anda sleeve radially surrounding and holding the first and second distal portions within a predefined radial distance of each other.2. The cable assembly of claim 1 , wherein the first and second middle portions are affixed to each other.3. The cable assembly of ...

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Номер записи: 17
01-01-2015 дата публикации

Optical transceiver

Номер: US20150003839A1
Автор: Yuuji Minota
Принадлежит: NEC Corp

An optical transceiver includes: a main board; a flexible board provided on a surface of the main board; an optical module mounted on the flexible board; and an optical fiber connected to the optical module. A position of the flexible board with respect to the main board is freely adjusted in a length direction of the optical fiber.

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Номер записи: 18
04-01-2018 дата публикации

OPTICAL TRANSMITTER AND OPTICAL MODULE INCLUDING THE SAME

Номер: US20180003908A1
Автор: Jung Eun Kyo, KOO Dai Hyoung, Shin Hyun Chang
Принадлежит: OE SOLUTIONS CO., LTD.

An optical transmitter and an optical module including the optical transmitter are provided. The optical transmitter may include a support substrate, a temperature control module disposed on the support substrate, a sub-mount disposed on the temperature control module, a prism disposed on the temperature control module and having a sloped surface, a light receiving element disposed on the temperature control module, a light emitting element disposed on the sub-mount, and a thermistor disposed on the sub-mount. The light receiving element may be disposed separately from the sub-mount in a first direction, and the prism may be disposed between the light receiving element and the sub-mount. Some first light emitted from the light emitting element may be reflected by the sloped surface of the prism, and some of the first light may pass through the prism and be received by the light receiving element. 1. An optical transmitter comprising:a support substrate;a temperature control module disposed on the support substrate;a sub-mount disposed on the temperature control module;a prism disposed on the temperature control module and having a sloped surface;a light receiving element disposed on the temperature control module;a light emitting element disposed on the sub-mount; anda thermistor disposed on the sub-mount, wherein the light receiving element is disposed separately from the sub-mount in a first direction, the prism is disposed between the light receiving element and the sub-mount, some of first light emitted from the light emitting element is reflected by the sloped surface of the prism, and some of the first light passes through the prism and is received by the light receiving element.2. The optical transmitter of claim 1 , wherein the temperature control module includes:a first pad disposed on the support substrate;a second pad disposed on the first pad; andone or more thermoelectric semiconductors disposed between the first pad and the second pad.3. The optical ...

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Номер записи: 19
02-01-2020 дата публикации

Transceiver and interface for ic package

Номер: US20200003976A1
Автор: Brian R. Vicich, Eric J. Zbinden, Jean-Marc A. VERDIELL, John A. MONGOLD, Keith R. GUETIG, Randall E. MUSSER
Принадлежит: Samtec Inc

An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.

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Номер записи: 20
03-01-2019 дата публикации

Photonic Package and Method Forming Same

Номер: US20190004247A1
Автор: Jui Hsieh Lai, Sung-Hui Huang, Tien-Yu Huang, Wen-Cheng Chen, Yushun Lin
Принадлежит: Taiwan Semiconductor Manufacturing Co TSMC Ltd

A method includes bonding an electronic die to a photonic die. The photonic die includes an opening. The method further includes attaching an adapter onto the photonic die, with a portion of the adapter being at a same level as a portion of the electronic die, forming a through-hole penetrating through the adapter, with the through-hole being aligned to the opening, and attaching an optical device to the adapter. The optical device is configured to emit a light into the photonic die or receive a light from the photonic die.

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Номер записи: 21
02-01-2020 дата публикации

Printed circuit boards and methods for manufacturing thereof for RF connectivity between electro-optic phase modulator and Digital Signal Processor

Номер: US20200006836A1
Автор: Chaudron Georges-Andre, Hu Kaisheng, Wice John David
Принадлежит:

A Printed Circuit Board (PCB) and methods for manufacturing the PCB board are provided. The PCB includes a Radio Frequency (RF) signal transition at a RF signal pad. Multiple conductive layers other than a conductive signal layer of the PCB and conductive portions of the conductive signal layer not in electrical contact with a RF signal transmission trace have common ground connections forming a ground cage structure within the PCB around the RF signal pad and RF the signal transmission trace. 1. A Printed Circuit Board (PCB) having a plurality of dielectric layers distributed between a plurality of conductive layers , the PCB including a Radio Frequency (RF) signal transition at a RF signal pad comprising:a RF signal transmission trace in a conductive signal layer other than a top and bottom conductive layers;a blind via providing electrical conductivity across at least one dielectric layer between the RF signal transmission trace and the RF signal pad; anda ground cage structure within the PCB around the RF signal pad and the RF signal transmission trace, wherein the plurality of conductive layers other than the conductive signal layer and conductive portions of the conductive signal layer not in electrical contact with the RF signal transmission trace have common ground connections.2. The PCB as claimed in claim 1 , the ground connections comprising ground stitching vias arranged in a concentric pattern around the signal pad.3. The PCB as claimed in claim 1 , the ground connections comprising ground stitching vias arranged along the signal transmission trace.4. The PCB as claimed in claim 1 , the ground cage structure comprising a group of conductive layers of the plurality of conductive layers claim 1 , other than the bottom conductive layer claim 1 , contoured with corresponding anti-pad diameters such that contoured inner conductive layer edges collectively form one of a spherical-shaped and a conical shaped ground cage structure claim 1 , wherein dielectric ...

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Номер записи: 22
20-01-2022 дата публикации

OPTICAL TRANSCEIVER WITH VERSATILE POSITIONING

Номер: US20220019039A1
Автор: ZBINDEN Eric
Принадлежит:

An optical transceiver can include a transmitter and a receiver. The optical transceiver is configured to mate with an electrical connector in first and second orientations that are opposite each other. In certain examples, a thermally conductive surface of the transceiver is configured to be placed in thermal communication with a heat dissipation member in one or both of the first and second orientations. Further examples of optical transceivers can be mounted to a base and placed in electrical communication with an electrical connector. A lid provides a compressive force that simultaneously makes electrical contact between the transceiver and a host printed circuit board (PCB) and provides a low impedance heat transfer path to dissipate heat generated during transceiver operation. 1. A transceiver comprising:a transceiver housing defining a first side and a second side opposite the first side along a lateral direction, a first end and a second end opposite the first end along a longitudinal direction, and a first surface and a second surface opposite the first surface along a transverse direction;a plurality of electrical contacts having mating ends disposed at the first and second sides of the transceiver housing; andthe second side of the transceiver housing is arranged to attach and detach at least one optical fiber or electrical cable to the transceiver.2. The transceiver as recited in wherein the first surface is a heat dissipation surface.3. The transceiver as recited in wherein the mating ends are planar.4. The transceiver as recited in wherein the mating ends disposed at the first side are arranged along a first common plane and the mating ends disposed at the second side are arranged along a second common plane.5. The transceiver as recited in wherein the first and second common planes are oriented perpendicular to the transverse direction.6. The transceiver as recited in wherein the at least one optical fiber is a plurality of optical fibers arranged in ...

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Номер записи: 23
20-01-2022 дата публикации

Optical communication system

Номер: US20220019040A1
Автор: Che-Shou Yeh, Hsiang-Jen LU, Ming-You Lai
Принадлежит: Prime World International Holdings Ltd

An optical communication system includes a light source module, a circuit board, a light emitter and a ROSA. The circuit board is disposed in the light source module. The light emitter is disposed in the light source module and electrically connected to the circuit board. The ROSA is located outside the light source module, and the ROSA is optically coupled to the light emitter.

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Номер записи: 24
11-01-2018 дата публикации

OPTICAL COMPONENT ALIGNMENT USING INVERTED CARRIER MEMBER

Номер: US20180011247A1
Автор: Patel Vipulkumar, PFNUER Stefan Martin, TRAVERSO Matthew Joseph
Принадлежит:

Embodiments include an optical apparatus and associated method of assembling. The optical apparatus comprises a substrate defining a first surface and a channel formed relative thereto, the substrate including one or more waveguides extending to a sidewall partly defining the channel, a plurality of first electrical contacts formed on the first surface. The optical apparatus further comprises a carrier member defining a second surface and at least a third surface, the second surface coupled with the first surface of the substrate. The optical apparatus further at least one optical component coupled with the second surface and at least partly disposed within the channel, wherein the at least one optical component is optically coupled with the one or more waveguides and electrically connected with the first electrical contacts via a plurality of second electrical contacts at the third surface of the carrier member. 1. An optical apparatus comprising:a substrate defining a first surface and a channel formed relative thereto, the substrate including one or more waveguides extending to a sidewall partly defining the channel, a plurality of first electrical contacts formed on the first surface;a carrier member defining a second surface and at least a third surface, the second surface coupled with the first surface of the substrate; anda plurality of optical components coupled with the second surface and at least partly disposed within the channel,wherein the plurality of optical components is optically coupled with the one or more waveguides and electrically connected with the first electrical contacts via a plurality of second electrical contacts at the third surface of the carrier member, andwherein the plurality of optical components comprises a lens component and at least one other optical component, wherein the at least one other component is optically coupled with the one or more waveguides through the lens component.2. The optical apparatus of claim 1 , wherein the ...

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Номер записи: 25
11-01-2018 дата публикации

Optical module

Номер: US20180011266A1
Автор: Hiroki Irie, Koichi Omori, Tetsuya Aoki
Принадлежит: Oclaro Japan Inc

The invention provides an optical module which is less likely to be damaged, and can be assembled at low cost. The optical module comprises a housing having an electrical signal port for inputting and/or outputting an electrical signal and an optical signal port for inputting and/or outputting an optical signal, a first substrate arranged in the housing so as to connect to the electrical signal port, an optical fiber arranged in the housing so as to connect to the optical signal port, and a second substrate provided with an optical device which connects to the optical fiber to input the optical signal from the optical fiber and output the optical signal to the optical fiber, and arranged in the housing so as to electrically connect to the first substrate, and to be inclined with respect to a base plane of the housing.

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Номер записи: 26
11-01-2018 дата публикации

Chip on leadframe optical subassembly

Номер: US20180011267A1
Автор: Paul Thien Vui Chia, Tat Ming Teo, Wendy Pei Fen Lau, Yew-Tai Chieng, Yunpeng Song
Принадлежит: Finisar Corp

One example embodiment includes an optical subassembly (OSA). The OSA includes a leadframe circuit, an optical port, and an active optical component subassembly. The active optical component subassembly is mounted to the leadframe circuit. The optical port is mechanically coupled to the leadframe circuit.

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Номер записи: 27
11-01-2018 дата публикации

PLUG FOR CONNECTION TO A SOCKET OF A PANEL OF AN ELECTRONIC EQUIPMENT HOUSING HAVING ANTI-BREAKAGE MEANS FOR THE OPTICAL CABLE ON WHICH THE PLUG IS MOUNTED

Номер: US20180011268A1
Автор: BOURGEAS Fabien, Dupeux Benoit, LOMUSCIO Dominique
Принадлежит: RADIALL

A plug mounted on an optical cable with one or more optical contacts each one having a tab which is deformable elastically or mounted so as to pivot relative to the rest of the contact, including: a body including a front part and a rear part; a bushing fitted around the front part with axial sliding forward, the bushing bearing a tab with an appendage extending inside the rear part, the tab of the bushing and the tab of each contact being disposed relative to each other so that when a traction force is applied to make the bushing slide around the front part, the appendage is able to bear against the tab of each contact so as to deform it elastically or make it pivot until the disconnection is produced between the contact and the converter. 1. Plug , designed to be mounted on at least one optical cable , whose one end bears one or more optical contacts , each one having a tab which is deformable elastically or mounted so as to pivot relative to the rest of the contact , comprising: a front part extending along a longitudinal axis (X), the front part being designed to fit into a socket, the front part being adapted to hold and support at least one optoelectronic converter connected to the contact(s) of the cable;', 'a rear part forming a sheath, designed to receive the end of the cable itself bearing the contact(s) which is (are) connected in removable manner to the optoelectronic converter(s);, 'a body havinga bushing fitted around the front part of the body with possibility of axial sliding along the (X) axis toward the front of the plug, the bushing bearing a tab with an appendage extending inside the rear part, the tab of the bushing and the tab of each contact being disposed relative to each other so that when a traction force is applied to make the bushing slide around the front part, the appendage of the tab of the bushing is able to bear against the tab of each contact so as to deform it elastically or make it pivot until the disconnection is produced between ...

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Номер записи: 28
10-01-2019 дата публикации

OPTICAL MODULE

Номер: US20190011653A1
Автор: SHIMAZU Takayuki, Yamada Takashi
Принадлежит: Sumitomo Electric Industries, Ltd.

An optical module that includes an optical holding member and an optical device is disclosed. The optical holding member includes a first surface, a second surface, a first hole extending from the first surface toward the second surface, a second hole extending from the second surface toward the first surface, and a lens provided between the first and second holes. The lens includes a first lens surface adjacent to the first hole. The optical device includes an optical region on a surface of the optical device. The optical device is mounted on the first surface of the optical coupling member such that the optical region faces the first hole. In the optical module, the central axis of the first hole, the optical axis of the first lens surface, and the central axis of the second hole are located on the identical axis. 1. An optical module , comprising:an optical coupling member comprising a first surface, a second surface opposite to the first surface, a first hole extending from the first surface toward the second surface, a second hole extending from the second surface toward the first surface, and a lens provided between the first and second holes wherein the lens includes a first lens surface adjacent to the first hole; andan optical device comprising an optical region that includes at least one of a light emitting region or a light receiving region on a surface of the optical device, the optical device being mounted on the first surface of the optical coupling member such that the optical region faces the first hole,wherein a central axis of the first hole, an optical axis of the first lens surface, and a central axis of the second hole are located on an identical axis.2. The optical module according to claim 1 ,wherein a depth of the first hole from the first surface to the first lens surface is shorter than a diameter of the first hole.3. The optical module according to claim 1 ,wherein a depth of the first hole from the first surface to the first lens surface ...

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Номер записи: 29
10-01-2019 дата публикации

OPTICAL TRANSCEIVER

Номер: US20190011655A1
Автор: Hino Masato
Принадлежит:

A pluggable optical transceiver is disclosed where the optical transceiver provides a housing, a lid, and a shield finger. The lid and the shield finger are assembled with the housing such that the shield finger fastens the lid against the housing. The housing provides a pocket that receives an end of the shield finger. The pocket provides negative slopes to gradually widen the cross section thereof as advancing a bottom of the pocket. The shield finger provides a tab in an end thereof, where the tab is bent inward to be hooked with the negative slope of the pocket. 1. An optical transceiver , comprising:a housing having a bottom and a pair of sides built from respective sides of the bottom;a lid provided on the sides of the housing, the lid and the housing forming a space within which optical components and electrical components are enclosed, the lid providing a pocket; anda shield finger surrounding the lid and the housing, the shield finger fastening the lid to the housing, the shield finger having two ends facing to each other, the ends having tabs that are hooked within the pocket of the lid,wherein the pocket in the lid is formed by two slopes extending from a surface of the lid, the slopes making acute angles against the surface, andwherein the tabs in the shield finger are bent in acute angles corresponding to the acute angles of the slopes of the pocket, the tab being hooked with the slopes in the pocket.2. The optical transceiver according to claim 1 ,wherein the shield finger provides a top portion extending along the lid, side portions extending along the sides of the housing, and a bottom portion extending along the bottom of the housing,wherein the top portion and the side portions of the shield finger each make angles that are smaller than angles formed by the side portions and the bottom portion of the shield finger. The present application is based on and claims the benefit of priority of Japanese Patent Application No. 2017-131419, filed on Jul. 4, ...

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Номер записи: 30
11-01-2018 дата публикации

PLUG FOR CONNECTION TO A SOCKET OF AN ELECTRONIC EQUIPMENT BOX PANEL, HAVING MEANS OF SELF-ALIGNMENT

Номер: US20180013235A1
Автор: BOURGEAS Fabien, Dupeux Benoit, LOMUSCIO Dominique
Принадлежит:

The present invention concerns a plug intended to be mounted on at least one cable whose one end supports one or more contacts comprising: 1. A plug intended to be mounted on at least one cable whose one end supports one or more contacts , comprising: a front portion made of electrically conductive material and extending along a longitudinal axis, the front portion being designed to be lodged in a socket, the front portion being adapted to lodge and hold the contact or contacts of the cable or at least an optoelectronic converter connected to the contact(s) of the cable;', 'a rear portion forming a sheath, designed to lodge the end of the cable, itself supporting the contact(s); the rear portion being mounted floating on the front portion;, 'a body, comprisinga plurality of flexible tabs made of electrically conductive material, distributed on the outer periphery of the front portion, the flexible tabs being adapted to remain in mechanical contact with the interior of the socket when the front portion of the body is lodged in the latter;a lever for locking to a socket, the locking lever being mounted pivoting on the rear portion of the plug body, the lever comprising two locking hooks distributed on either side of the rear portion and designed to cooperate with two locking lugs distributed on either side of the socket;wherein the floating mount of the rear portion on the front portion of the plug body allows this front portion to remain off axis in the socket cavity, even if the rear portion of the body for its part tends to realign itself with said cavity, in particular during the locking of the plug to the socket with the means of the locking lever.2. The plug according to claim 1 , wherein the plurality of flexible tabs constituting a device for protection against electromagnetic interference (EMI) and/or a lightning arrester protection device.3. The plug according to claim 1 , comprising a ring of electrically conductive material mounted in sliding manner about ...

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Номер записи: 31
11-01-2018 дата публикации

Laser device

Номер: US20180013263A1
Автор: Akiyuki KADOYA, Ichiro Fukushi, Jiro Saikawa, Junki Sakamoto, Kazuma Watanabe, Koji Tojo, Naoya Ishigaki, Shingo UNO, Tomoyuki Hiroki
Принадлежит: Shimadzu Corp

A laser device has a plurality of laser diodes; a plurality of optical elements installed corresponding to the plurality of the laser diodes; a plurality of units formed by fixing the laser diodes and the optical elements per each laser diode and installed corresponding to the plurality of the laser diodes; a converging element that converges laser beams emitted from the plurality of the laser diodes to a fiber; a housing element houses the plurality of the units and the converging element; and a thermal transfer plate performs heat dissipation of the plurality of the units. The heat resistance reducing element having a heat resistance value that is smaller than a predetermined value is installed between the thermal transfer plate and each unit or the processing for reducing the heat resistance is performed.

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Номер записи: 32
14-01-2016 дата публикации

Multichannel coherent transceiver and related apparatus and methods

Номер: US20160013866A1
Автор: Christopher Doerr
Принадлежит: Acacia Communications Inc

A multi-channel optical transceiver is disclosed. The optical transceiver has a multi-package structure. A laser array is disposed in one package. An application specific integrated circuit (ASIC) and photonic integrated circuit (PIC) are disposed in another package. An optical fiber array may couple the first package and second package together.

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Номер записи: 33
15-01-2015 дата публикации

Optical module

Номер: US20150016772A1
Автор: Atsushi Suzuki, Hajime Arao, Mitsuaki Tamura, Toshihisa Yokochi
Принадлежит: Sumitomo Electric Industries Ltd

An optical module ( 1 ) of the invention includes a circuit substrate ( 24 ) on which light receiving and emitting elements ( 52 ) are mounted, a connector component ( 54 ) for holding optical fibers ( 7 ), and a lens array component ( 55 ) which is fixed on the circuit substrate ( 24 ) and optically connects the optical fibers ( 7 ) to the light receiving and emitting elements ( 52 ) on the circuit substrate ( 24 ), and the circuit substrate ( 24 ) has a lens array mounting region (A 1 ) in which the lens array component ( 55 ) is fixed and a connector component opposed region (A 2 ) opposed to the connector component ( 54 ), and thermal insulation space is formed between the connector component ( 54 ) and the connector component opposed region (A 2 ).

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Номер записи: 34
15-01-2015 дата публикации

OPTICAL COMMUNICATION DEVICE

Номер: US20150016776A1
Автор: TSENG KUO-FONG
Принадлежит: HON HAI PRECISION INDUSTRY CO., LTD.

An optical communication device includes a connector, a first substrate, a first driving chip, a light emitting element, a second driving chip, a light receiving element, a coupling lens assembly, and an optical waveguide. The first substrate is supported on the connector and electrically connected to the connector. The first substrate includes a bottom surface and a supporting surface facing away from the bottom surface. Both the light emitting element and the light receiving element are received in the first substrate. The first driving chip is supported on the supporting surface, and electrically connected to the first substrate and the light emitting element. The second driving is supported on the supporting surface, and electrically connected to the first substrate and the light receiving element. The coupling lens assembly is detachably connected to the first and second driving chips. The optical waveguide is detachably connected to the coupling lens assembly. 1. An optical communication device , comprising:a first substrate comprising a supporting surface defining a receiving cavity;a light emitting element received in the receiving cavity, and comprising a light emitting surface;a first driving chip supported on the supporting surface, and electrically connected to the first substrate and the light emitting element;a light receiving element received in the receiving cavity, and comprising a light receiving surface;a second driving chip supported on the supporting surface, and electrically connected to the first substrate and the light receiving element;a coupling lens assembly connected to the first and second driving chips, andan optical waveguide comprising a light guiding portion, the optical waveguide connected to the coupling lens assembly, with the light guiding portion aligning with the light emitting surface and the light receiving surface.2. The optical communication device of claim 1 , comprising a connector claim 1 , wherein the first substrate is ...

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Номер записи: 35
15-01-2015 дата публикации

BI-DIRECTIONAL DATA TRANSMISSION METHOD, HIGH-FREQUENCY CONNECTOR AND OPTICAL CONNECTOR USING THE SAME

Номер: US20150016782A1
Автор: CHAN CHI-JUNG, HSU HUNG-WEI, SU HOU-AN
Принадлежит: NEXTRONICS ENGINEERING CORP.

The instant disclosure relates to bi-direction data transmission method, high-frequency connector and an optical connector using the same. The optical connector includes a first circuit board, a second circuit board, a high-frequency connector and an optical fiber cable. One optical engine is set on the first circuit board. The high-frequency connector is set between the first circuit board and the second circuit board for connecting both two circuit boards. The high-frequency connector includes an insulation base. The insulation base has at least one terminal-accommodating region. Pluralities of connection terminals are inserted into the terminal-accommodating regions of the insulation base. The optical fiber cable connects to the one optical engine. 1. An optical connector for bi-directional data transmission with an output/input connector having a first set of terminals and a second set of terminals , the optical connector comprising:a connector head, having an accommodating space and formed with an opening end and an assembly end;a first circuit board disposed in the accommodating space and having a plurality of first contacts proximal to the opening end and an optical engine proximal to the assembly end, wherein the first contacts are electrically connected to the first set of terminals;a second circuit board disposed in the accommodating space and having plurality of second contacts proximal to the opening end, wherein the second contacts are electrically connected to the second set of terminals;a high frequency connector disposed between the first circuit board and the second circuit board and having an insulation base, wherein the insulation base has a peripheral side surface and a first terminal face and a second terminal face opposite each other, the side surface is adjacent to the first terminal face and the second terminal face, the first terminal face and the second terminal face have at least one corresponding terminal-accommodating region, and a ...

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Номер записи: 36
21-01-2016 дата публикации

CONNECTOR SYSTEM, CONNECTING CABLE AND RECEIVING TOOL

Номер: US20160018611A1
Автор: Kishima Koichiro, Nishio Ayataka, Yamagami Tamotsu
Принадлежит:

A connector provided on a projector has an RF chip. A plug connected to the connector has an RF chip at a position opposite to the RF chip of the connector. When a protruding section of the plug is inserted and fit into an aperture section of the connector, the RF chip of the plug and the RF chip of the connector perform wireless communication with each other in a non-contact state. Thus, a connecting tool can be easily attached to/detached from a receiving tool without breaking a terminal due to contact such as in a case where a conventional contact type terminal is used.

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Номер записи: 37
18-01-2018 дата публикации

Method And System For Implementing High-Speed Electrical Interfaces Between Semiconductor Dies in Optical Communication Systems

Номер: US20180017747A1
Автор: Abdalla Sherif, Guckenberger John Andrew, Kucharski Daniel, Pinguet Thierry
Принадлежит:

A method and system for implementing high-speed electrical interfaces between semiconductor dies in optical communication systems are disclosed and may include communicating electrical signals between a first die and a second die via coupling pads which may be located in low impedance points in Tx and Rx paths. The electrical signals may be communicated via one or more current-mode, controlled impedance, and/or capacitively-coupled interfaces. The current-mode interface may include a cascode amplifier stage split between source and drain terminals of transistors on the dies. The controlled-impedance interfaces may include transmission line drivers on a first die and transmission lines on a second die. The capacitively-coupled interfaces may include capacitors formed by contact pads on the dies. The coupling pads may be connected via one or more of: wire bonds, metal pillars, solder balls, or conductive resin. The dies may comprise CMOS and may be coupled in a flip-chip configuration. 1. A method for processing signals , the method comprising:in a communication system, communicating electrical signals between a first die and a second die via coupling pads on said first die and said second die, wherein said coupling pads are located at low impedance points between two cascode transistors in one or more transmit paths and/or one or more receive paths in said communication system, wherein a first of said two cascode transistors is integrated in said first die and a second of said two cascode transistors is integrated in said second die.2. The method according to claim 1 , comprising communicating said electrical signals via one or more current-mode interfaces.3. The method according to claim 2 , wherein said one or more current-mode interfaces comprise a cascode amplifier stage split between a source terminal of said first of said two cascode transistors integrated in said first die and a drain terminal of said second of said two cascode transistors integrated in said ...

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Номер записи: 38
17-01-2019 дата публикации

LATCH MECHANISM FOR COMMUNICATION MODULE

Номер: US20190018207A1
Автор: Koutrokois Demetrios
Принадлежит:

Some embodiments include a latch mechanism and an optoelectronic module that includes the latch mechanism. The latch mechanism may include a driver, a follower, a pivot member, and a cam member. The driver may be configured to rotate relative to a housing of the optoelectronic module about an axis of rotation between a latched position and an unlatched position. The follower may be configured to be move when the driver rotates between the latched and unlatched position. The follower may include at least one electromagnetic interference (EMI) window that is configured to engage with at least one EMI protrusion positioned on the housing and thereby maintain contact with a cage of a host device. 1. An optoelectronic module , comprising:a housing having at least one electromagnetic interference (EMI) protrusion;a driver configured to rotate relative to the housing between a latched position and an unlatched position; anda follower configured to slide relative to the housing as the driver is rotated between the latched position and the unlatched position, the follower comprising:at least one EMI window, the at least one EMI window configured to engage with the at least one EMI protrusion and to maintain contact with a cage of a host device.2. The optoelectronic module of claim 1 , further comprising:a pivot member coupled to the driver; anda cam member configured to engage the follower so as to urge the follower to slide relative to the housing as the driver is rotated between the latched position and the unlatched position, wherein:in the latched position, the cam member is at a first location in a slot of the housing;in the unlatched position, the cam member is at a second location in the slot that is in front of the first location; androtation of the driver from the latched position to the unlatched position causes the cam member to engage a frontward side and to urge the follower to slide, relative to the housing, toward a front of the housing.3. The optoelectronic ...

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Номер записи: 39
16-01-2020 дата публикации

PACKAGE STRUCTURE FOR PHOTONIC TRANSCEIVING DEVICE

Номер: US20200018912A1
Автор: Kato Masaki, LI Peng-Chih, Nagarajan Radhakrishnan L.
Принадлежит:

A photonic transceiver apparatus in QSFP package. The apparatus includes a case having a base member, two partial side members, and a lid member to provide a spatial volume with an opening at a back end of the base member. Additionally, the apparatus includes a PCB, installed inside the spatial volume over the base member having a pluggable electrical connector at the back end. Further, the apparatus includes multiple optical transmitting devices in mini-transmit-optical-sub-assembly package, each being mounted on a common support structure and having a laser output port in reversed orientation toward the back end. Furthermore, the apparatus includes a silicon photonics chip, including a fiber-to-silicon attachment module, mounted on the PCB and coupled to a modulation driver module and a trans-impedance amplifier module. Moreover, the apparatus includes a pair of optical input/output ports being back connected to the fiber-to-silicon attachment module. 1. An apparatus comprising:a base member extended from a first end to a second end;a side member coupled to the base member;a lid member coupled to the side member and the base member to provide a spatial volume with an opening at the second end;a board body within the spatial volume and extended from a first edge to a second edge, the second edge being near the second end, the board body comprising an array of metallic pin stripes at the second edge to form a pluggable electrical interface connector;an optical transmitting device coupled to a laser output port aimed toward the second edge;a silicon photonics chip including a demultiplexer and a fiber-to-silicon attachment module to couple with a first fiber from the laser output port;an optical input port and an optical output port disposed together at the first end and respectively back connected via a pair of second fibers to the fiber-to-silicon attachment module; andan input fiber terminated with a first connector coupled to the optical input port and an output ...

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Номер записи: 40
16-01-2020 дата публикации

SPACE ACTIVE OPTICAL CABLE

Номер: US20200018913A1
Автор: Kopuru Harsha Krishna, Mitchell Rebekah Jean, Smith Jason Paul, Wasland Timothy John, Wood Lance A.
Принадлежит:

A space active optical cable (SAOC) includes a cable including one or more optical fibers, and two or more electrical transceivers on opposing ends of the cable and interconnected by the cable. Each of the electrical transceivers includes an enclosure that encloses one or more light sources, one or more light detectors, and control electronics. Also included in the enclosure are a coupling medium to couple light into and out of the one or more optical fibers. The coupling medium can be reflecting surface or an on-axis mount. The enclosure provides a suitable heat propagation and electromagnetic interference (EMI) shielding, and the cable and the two or more electrical transceivers are radiation resistant. SAOC features optionally support a health check algorithm that allows trending optical performance in the absence of an optical connector and a potential surface treatment to increase nominally low emissivity of an EMI conductive surface. 1. A space active optical cable (SAOC) comprising:a cable comprising one or more optical fibers; andtwo or more electrical transceivers on opposing ends of the cable and interconnected by the cable, each of the electrical transceivers of the two or more electrical transceivers comprising:an enclosure enclosing:one or more light sources, one or more light detectors, and control electronics enclosed in the enclosure;a coupling medium configured to couple light into and out of the one or more optical fibers;a radio-frequency (RF) modulator and a local oscillator (LO) modulator configured to modulate light generated by the one or more light sources; anda light processor coupled to the one or more light sources, the RF modulator and the LO modulator and comprising a filter and lock-diode unit configured to generate a heterodyne output light.2. The SAOC of claim 1 , wherein the two or more electrical transceivers are configured to receive power and communicate signals including data claim 1 , command claim 1 , control claim 1 , and ...

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Номер записи: 41
17-04-2014 дата публикации

LASER MODULE

Номер: US20140105538A1
Автор: KASAI Yohei, Sakamoto Akira, TOYOHARA Nozomu
Принадлежит: FUJIKURA LTD.

The semiconductor laser module () includes: a laser mount () having thereon a semiconductor laser chip (); a fiber mount () having thereon an optical fiber (); a submount () on which the laser mount () and the fiber mount () are placed; and a substrate () on which the submount is placed, the substrate () having protrusions (to ) on a top surface thereof, the submount being joined to the substrate () with a soft solder () spread between the submount () and the substrate (). 1. A laser module , comprising:a laser mount having thereon a laser source that emits a laser beam;a fiber mount having thereon an optical fiber that receives the laser beam;a submount on which the laser mount and the fiber mount are placed; anda substrate on which the submount is placed,the substrate having a spacer thereon, the spacer keeping a gap between the submount and the substrate, andthe submount being joined to the substrate with solder spread between the submount and the substrate.2. The laser module as set forth in claim 1 , wherein the solder is soft solder having a Young's modulus of not more than 50 Gpa.3. The laser module as set forth in claim 1 , wherein the solder has a Young's modulus which is smaller than a Young's modulus of the submount.4. The laser module as set forth in claim 1 , wherein the spacer is integral with the substrate.5. The laser module as set forth in claim 1 , wherein the spacer has a columnar shape whose surface abutting against the submount is flat.6. The laser module as set forth in claim 1 , wherein the spacer has a height of more than 40 μm.7. The laser module as set forth in claim 1 , wherein:a surface of the submount which surface faces the substrate is partially metallized; andthe submount is placed on the substrate so that the spacer abuts against an unmetallized portion(s) of the surface of the submount.8. The laser module as set forth in claim 1 , wherein the submount is made from a material having a thermal expansion coefficient which is the same ...

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Номер записи: 42
22-01-2015 дата публикации

Optical electrical module used for optical communication used for optical communication

Номер: US20150023632A1
Автор: Hsiao-Chin Lan, Shang-Jen Yu
Принадлежит: CENTERA PHOTONICS Inc

An optical electrical module includes a first substrate, a second substrate, a bearing portion and at least one optical electrical element. The second substrate is combined with the first substrate and has a reflective surface facing the first substrate. The bearing portion is disposed between the first substrate and the second substrate to limit at least one light guide element. The optical electrical element is disposed on a surface of the first substrate facing the reflective surface and faces the reflective surface. The optical electrical element is configured for providing or receiving light signals. The reflective surface and the light guide element are disposed on an optical path of the light signals.

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Номер записи: 43
28-01-2016 дата публикации

Optoelectronic Integrated Circuitry for Transmitting and/or Receiving Wavelength-Division Multiplexed Optical Signals

Номер: US20160025926A1
Автор: Taylor Geoff W.
Принадлежит:

A WDM transmitter and/or receiver optoelectronic integrated circuit includes a plurality of microresonators and corresponding waveguides and couplers that are integrally formed on a substrate. For the WDM transmitter, the microresonators and waveguides are configured to generate a plurality of optical signals at different wavelengths. Each coupler includes a resonant cavity waveguide that is configured to transmit one optical signal from one waveguide to the output waveguide such that the plurality of optical signals are multiplexed on the output waveguide. For the WDM receiver, an input waveguide is configured to provide for propagation of a plurality of optical signals at different wavelengths. Each coupler includes a resonant cavity waveguide that is configured to transmit at least one optical signal from the input waveguide to one waveguide. The waveguides and microresonators are configured to perform optical-to-electrical conversion of the plurality of optical signals at different wavelengths that propagate in the waveguides. 1. An optoelectronic integrated circuit comprising:a substrate;a plurality of microresonators and a corresponding plurality of waveguides that are integrally formed on the substrate, wherein the plurality of microresonators and the corresponding plurality of waveguides are configured to generate a plurality of optical signals at different wavelengths that propagate in said plurality of waveguides;an output waveguide integrally formed on the substrate; anda plurality of couplers integrally formed on the substrate and corresponding to said plurality of waveguides, wherein each coupler includes a resonant cavity waveguide that is disposed between one of said plurality of waveguides and said output waveguide, wherein the resonant cavity waveguide is configured to transmit one of said plurality of optical signals from the one waveguide to said output waveguide such that the plurality of optical signals are multiplexed on said output waveguide.2 ...

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Номер записи: 44
28-01-2016 дата публикации

OPTICAL-ELECTRO CIRCUIT BOARD, OPTICAL COMPONENT AND MANUFACTURING METHOD THEREOF

Номер: US20160025944A1
Автор: Chen Yin-Ju, Huang Pei-Chang, Yu Cheng-Po
Принадлежит:

An optical component including a multi-layer substrate, an optical waveguide element, and two optical-electro assemblies is provided. The multi-layer substrate includes a dielectric layer, two circuit layers, and two through holes passing through the dielectric layer. The optical waveguide element is located on the multi-layer substrate and between the through holes. The optical-electro assemblies are respectively inserted into the corresponding through holes and correspondingly located at two opposite ends of the optical waveguide element. One of the optical-electro assemblies transforms an electrical signal into a light beam and provides the light beam to the optical waveguide element, and the other one of the optical-electro assemblies receives the light beam transmitted from the optical waveguide element and transforms the light beam into another electrical signal. A manufacturing method of the optical component and an optical-electro circuit board having the optical component are also provided. 1. A manufacturing method of an optical component , comprising:providing a multi-layer substrate comprising at least one dielectric layer, at least two circuit layers, and two through holes passing through the at least one dielectric layer, the at least two circuit layers being located on two opposite surfaces of the at least one dielectric layer;forming an optical waveguide element on a surface of the multi-layer substrate and between the through holes; andforming two optical-electro assemblies in the corresponding through holes, and the optical-electro assemblies being correspondingly located at two opposite ends of the optical waveguide element.2. The manufacturing method of the optical component according to claim 1 , wherein a method of forming the optical-electro assemblies in the corresponding through holes comprises:providing a substrate and forming a light guide hole on the substrate, the light guide hole passing through the substrate;cutting the substrate to ...

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Номер записи: 45
26-01-2017 дата публикации

NxN PARALLEL OPTICAL TRANSCEIVER

Номер: US20170023750A1
Автор: MAO Jinglei, Wang Qiang, Wu Kui, Xu Yuanzhong
Принадлежит: Source Photonics (Chengdu) Co., Ltd.

An N×N parallel optical transceiver includes a printed circuit board, a laser driving control chip, one or more lasers, two GRIN lenses, an optical band-pass filter, a multimode fiber array and a photodiode array. In the transmitter, laser beams of the same wavelength simultaneously output from the laser chip are first focused by the first GRIN lens, then the beams pass through a wavelength band-pass filter and are refocused by the second GRIN lens, and enter the channels in the multimode fiber array. In the receiver, laser beams of a different wavelength from the multimode fiber array are focused by the second GRIN lens, then reflected by the band-pass filter, refocused by the second GRIN lens, and received by the photodiode array. The multi-channel parallel transceiver has a small form, and can integrate a DFB or FP laser chip and GRIN lenses. 19-. (canceled)10. A parallel optical transceiver , comprising:a) a printed circuit board, wherein one end of the printed circuit board includes a signal input interface;b) a laser on the printed circuit board configured to simultaneously provide laser beams having a first common wavelength;c) a laser driving control chip configured to control the laser, and directly integrated onto or into the printed circuit board;d) a multimode fiber array having N channels, N being an integer of at least 2;e) a band-pass filter configured to allow the laser beams to pass through to the multimode fiber array;f) a first GRIN lens and a second GRIN lens that flank the band-pass filter and are fixed to the printed circuit board, wherein the first GRIN lens is configured to focus the laser beams, and the second GRIN lens is configured to refocus the laser beams on a location in or on the multimode fiber array after the laser beams pass through the band-pass filter; andg) a photodiode array.11. The parallel optical transceiver of claim 10 , wherein said laser comprises a DFB or FP laser chip claim 10 , flip chip bonded to the printed circuit ...

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Номер записи: 46
26-01-2017 дата публикации

Optoelectronic Module With Improved Heat Management

Номер: US20170023751A1
Автор: Andersson Magnus, Steijer Odd Robert
Принадлежит: TYCO ELECTRONICS SVENSKA HOLDINGS AB

An optoelectronic module is disclosed. The optoelectronic module comprises an optical connector, a contact, an opto-electric assembly, and a casing. The opto-electric assembly has a carrier optically connected to the optical connector by a flexible optical fiber and electrically connected to the contact by a flexible cable. The casing at least partially encloses the opto-electric assembly, the optical connector, and the contact. An inner surface of a wall of the casing is attached to the carrier in a thermally conductive manner. 1. An optoelectronic module , comprising:an optical connector;a contact;an opto-electric assembly having a carrier optically connected to the optical connector by a flexible optical fiber and electrically connected to the contact by a flexible cable; anda casing at least partially enclosing the opto-electric assembly, the optical connector, and the contact, an inner surface of a wall of the casing attached to the carrier in a thermally conductive manner.2. The optoelectronic module of claim 1 , wherein the opto-electric assembly has an optical transducer converting optical signals into electrical signals and electrical signals into optical signals.3. The optoelectronic module of claim 2 , wherein the optical connector is optically connected to a mating optical ferrule.4. The optoelectronic module of claim 3 , wherein the contact is electrically connected to a mating electrical connector.5. The optoelectronic module of claim 4 , wherein the carrier is thermally connected to the inner surface of the wall by a thermal bridge.6. The optoelectronic module of claim 5 , wherein the thermal bridge is integrally formed with the casing.7. The optoelectronic module of claim 5 , wherein the thermal bridge is attached to the casing by a rigid thermal interface joint.8. The optoelectronic module of claim 5 , wherein the thermal bridge is attached to the carrier by a thermally conductive casting compound.9. The optoelectronic module of claim 8 , wherein ...

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Номер записи: 47
25-01-2018 дата публикации

Multi-port optical probe for photonic IC characterization and packaging

Номер: US20180024299A1
Автор: Rui Manuel LEMOS ALVARES DOS SANTOS, Xaverius Jacques Maria Leijtens
Принадлежит: Eindhoven Technical University

Improved passive optical coupling to photonic integrated circuit (PIC) chips is provided. An interposer unit ( 108 ) having one or more flexible optical waveguide members ( 112, 114, 116 ) is employed. The flexible optical waveguide members are coupled to the PIC chip ( 118 ) via their tips. The PIC chip includes alignment features to facilitate lateral, vertical and longitudinal passive alignment of the flexible optical waveguide members to on-chip optical waveguides of the PIC.

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Номер записи: 48
25-01-2018 дата публикации

OPTICAL MODULE

Номер: US20180024303A1
Автор: NAKANISHI Hiromi
Принадлежит: Sumitomo Electric Industries, Ltd.

An optical module includes a light-forming part; a protective member and including an output window and disposed so as to surround the light-forming part; an adapter connected to the protective member and including an optical passage through which light emitted from the light-forming part and transmitted by the output window passes; and an optical coupling component that is connected to the adapter and that light passing through the optical passage enters. The light-forming part includes semiconductor light-emitting devices and lenses configured to convert, in terms of spot size, light emitted from the semiconductor light-emitting devices. The optical coupling component includes an optical component and a support member supporting the optical component. The support member and the adapter are connected together. 1. An optical module comprising:a light-forming part configured to form light;a protective member that includes an output window configured to transmit light from the light-forming part and that is disposed so as to surround the light-forming part;an adapter connected to the protective member and including an optical passage through which light emitted from the light-forming part and transmitted by the output window passes; andan optical coupling component that is connected to the adapter and that light passing through the optical passage enters,wherein the light-forming part includesa semiconductor light-emitting device, anda lens configured to convert, in terms of spot size, light emitted from the semiconductor light-emitting device,wherein the optical coupling component includesan optical component, anda support member supporting the optical component, andwherein the support member and the adapter are connected together.2. The optical module according to claim 1 , wherein the protective member and the adapter are connected together by welding.3. The optical module according to claim 1 , wherein the support member and the adapter are connected together by ...

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Номер записи: 49
24-01-2019 дата публикации

Optical transmitter device

Номер: US20190028189A1
Автор: Ryota Teranishi
Принадлежит: Sumitomo Electric Device Innovations Inc

An optical transmitter device is disclosed. The optical transmitter device includes an optical integrating device, a carrier, and a thermo-electric cooler (TEC). The carrier has a top surface and a back surface opposite to the top surface. The carrier includes an insulating slab and a metal plate attached to the insulating slab. The metal plate has thermal conductivity better than thermal conductivity of the insulating slab. The insulating slab forms the top surface of the carrier that provides an interconnection thereon. The back surface mounts the optical integrating device thereon. The TEC faces the carrier and mounts the carrier thereon. The carrier has a base overlapped with the TEC and an extension not overlapped with the TEC, the extension mounting the optical integrating device thereon.

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Номер записи: 50
02-02-2017 дата публикации

OPTICAL COMMUNICATIONS MODULE EQUIPPED WITH A MOVING-PIN LATCHING/DELATCHING SYSTEM THAT INCLUDES AN ELONGATED DELATCHING PULL TAB

Номер: US20170031109A1
Автор: Meadowcroft David J.K., Yu Paul
Принадлежит:

An optical communications module is provided with a moving pin latching/delatching system that includes an elongated pull tab that is easily accessible and a latch base having a proximal end that is mechanically coupled to a distal end of the pull tab. The latch base has a latch locking pin disposed on a distal end thereof for engaging a latch opening of a cage when the module is mated with the cage and the latch base is in the latched position. When a pull force of sufficient magnitude is exerted on the pull tab in a direction away from the cage parallel to a longitudinal axis of the pull tab, the latch base is moved from a latched position to a delatched position, which causes the pin to move from an extended position to a retracted position in which the pin is disengaged from the opening of the cage. 1. An optical communications module adapted to be mated with a cage , the module comprising:a module housing that houses components of the optical communications module;an elongated pull tab having a proximal end, a distal end and a shaft interconnecting the proximal and distal ends, the shaft having a longitudinal axis; anda latch base mechanically coupled with the distal end of the pull tab and movably engaged with the module housing, the latch base including a latch locking pin adapted to engage an opening of the cage when the module is mated with the cage, wherein movement of the pull tab from a latched position to a delatched position causes the pin to move from an extended position to a retracted position in which the pin is disengaged from the opening of the cage to allow the module to be extracted from the cage.2. The optical communications module of claim 1 , wherein the module housing has an electromagnetic interference (EMI) collar fixedly secured thereto claim 1 , the EMI collar having an opening formed therein through which the pin extends to engage the opening of the cage when the latch locking pin is in the extended position.3. The optical ...

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Номер записи: 51
02-02-2017 дата публикации

RUGGEDIZED PHOTONIC CRYSTAL SENSOR PACKAGING

Номер: US20170031116A1
Автор: Carralero Michael A., Chan Eric Y., Koshinz Dennis G.
Принадлежит: The Boeing Company

A method, system, and apparatus are disclosed for a ruggedized photonic crystal (PC) sensor packaging. In particular, the present disclosure teaches a ruggedized packaging for a photonic crystal sensor that includes of a hermetic-seal high-temperature jacket and a ferrule that eliminate the exposure of the optical fiber as well as the critical part of the photonic crystal sensor to harsh environments. The disclosed packaging methods enable photonic crystal based sensors to operate in challenging environments where adverse environmental conditions, such as electromagnetic interference (EMI), corrosive fluids, large temperature variations, and strong mechanical vibrations, currently exclude the use of traditional sensor technologies. 1. A method for hermetically sealing a sensor chip , the method comprising:sealing the sensor chip to an end of a front snout of a main package body;inserting a fiber into the main package body through an opening of a back snout of the main package body;aligning an end of the fiber to the sensor chip;locking the fiber on a fiber pedestal, wherein the fiber pedestal is located inside the main package body;sealing the fiber at the end of the back snout of the main package body;applying a fiber jacket to an end of the fiber opposite the end of the fiber that is aligned to the sensor chip, wherein a portion of the fiber jacket is located inside of the back snout of the main package body;sealing an internal cavity of the back snout;attaching a fiber boot to the end of the back snout and to at least a portion of the fiber jacket;out-gassing the main package body, the sensor chip, the fiber, the fiber pedestal, the fiber jacket, and the fiber boot; andsealing a lid to a top side of the main package body.2. The method of claim 1 , wherein the sealing of the sensor chip to the front snout is achieved by a self-alignment process that utilizes surface tension of reflowed solder to center the sensor chip to a center axis of the front snout of ...

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Номер записи: 52
02-02-2017 дата публикации

PHOTONIC TRANSCEIVING DEVICE PACKAGE STRUCTURE

Номер: US20170031117A1
Автор: Kato Masaki, LI Peng-Chih, Nagarajan Radhakrishnan L.
Принадлежит:

The apparatus includes a case having a base member, two partial side members, and a lid member to provide a spatial volume with an opening at a back end of the base member. Additionally, the apparatus includes a PCB installed inside the spatial volume over the base member with a pluggable connector at the back end. The apparatus includes one or more optical transmitting devices in transmit-optical-sub-assembly package, each being mounted upside-down on the PCB and including a built-in TEC module in contact with the lid member and a laser output port aiming toward the back end. Furthermore, the apparatus includes a silicon photonics chip including a fiber-to-silicon attachment module, mounted on the PCB and coupled to a modulation driver module and a trans-impedance-amplifier module. Moreover, the apparatus includes an optical input port and output port being back connected to the fiber-to-silicon attachment module. 1. An apparatus for packaging a photonic transceiver comprising:a case, comprising a base member, two partial side members being connected by a joint piece and coupled to the base member, a lid member including a cover coupled to the two partial side members and the base member to provide a spatial volume with an opening at a back end of the base member;a PCB, installed inside the spatial volume over the base member, including a board body extended from a front edge to a back edge, the back edge being near the opening at an back end of the base member, the board body comprising an array of metallic pin stripes at the back edge to form a pluggable electrical interface connector;one or more optical transmitting devices, each being mounted upside-down on the PCB near the front edge and including a TEC module being in thermal contact with the lid member and a laser output port aiming toward the back edge;a silicon photonics chip, mounted on the PCB, including a fiber-to-silicon attachment module to couple with a first fiber from each of the laser output port; ...

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Номер записи: 53
01-02-2018 дата публикации

OPTICAL MODULE

Номер: US20180031789A1
Автор: Akieda Shinichiro, Kanda Mitsuki, Kurashima Shigemi, Yagisawa Takatoshi
Принадлежит:

An optical module includes a board; a photoelectric transducer disposed on the board; an optical waveguide that is connected to the board and transmits light entering or emitted from the photoelectric transducer; an optical connector including a first end connected to the optical waveguide and a second end to be connected to an optical cable; a housing that houses the board, the photoelectric transducer, the optical waveguide, and the optical connector; and a conductive part that is provided between the optical waveguide and the housing, in contact with the housing, and formed of an elastic conductive material or a radio absorbing material. 1. An optical module , comprising:a board;a photoelectric transducer disposed on the board;an optical waveguide that is connected to the board and transmits light entering or emitted from the photoelectric transducer;an optical connector including a first end connected to the optical waveguide and a second end to be connected to an optical cable;a housing that houses the board, the photoelectric transducer, the optical waveguide, and the optical connector; anda conductive part that is provided between the optical waveguide and the housing, in contact with the housing, and formed of an elastic conductive material or a radio absorbing material.2. The optical module as claimed in claim 1 , wherein the conductive part is provided between a first surface of the optical waveguide and the housing and between a second surface of the optical waveguide and the housing.3. The optical module as claimed in claim 1 , further comprising:multiple protrusions formed on a surface of the housing that is in contact with the conductive part,wherein the protrusions are arranged at a pitch of less than or equal to λ/4 where λ indicates a wavelength of an electromagnetic wave emitted out of the housing.4. An optical module claim 1 , comprising:a board;a photoelectric transducer disposed on the board;an optical waveguide that is connected to the board ...

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Номер записи: 54
17-02-2022 дата публикации

OPTICAL MODULE

Номер: US20220050248A1
Автор: CHUANG Zuon-Min, HUANG Lung-Hua, HUANG Sung-Ping, SU Sheng-Pin
Принадлежит: Molex, LLC

An optical module includes a waveguide interposer and at least one light source unit. The waveguide interposer includes at least one input terminal, at least one waveguide channel, and at least one output terminal. The at least one input terminal is configured to receive laser light, and the at least one waveguide channel is coupled to the at least one input terminal and is configured to guide the laser light. Each light source unit is configured to output the laser light to a corresponding input terminal of the at least one input terminal. 1. An optical module , comprising: at least one input terminal, configured to receive laser light;', 'at least one waveguide channel, coupled to the at least one input terminal, and configured to guide the laser light; and', 'at least one output terminal; and, 'a waveguide interposer, comprisingat least one light source unit, wherein each light source unit in the at least one light source unit is configured to output the laser light to a corresponding input terminal of the at least one input terminal.2. The optical module according to claim 1 , wherein each light source unit in the at least one light source unit comprises:a laser light source, configured to generate the laser light; anda lens, configured to adjust a travel direction of the laser light.3. The optical module according to claim 2 , wherein each light source unit in the at least one light source unit further comprises an optical isolator claim 2 , disposed between the lens and a corresponding input terminal in the at least one input terminal claim 2 , and configured to reduce reflected light generated when the laser light enters the corresponding input terminal.4. The optical module according to claim 2 , wherein the lens is further configured to keep light beams of the laser light concentrated in a travel process to match a spot mode field of a waveguide.5. The optical module according to claim 1 , wherein the at least one input terminal comprises at least one first ...

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Номер записи: 55
01-02-2018 дата публикации

AUTOMATICALLY DEDUCING THE ELECTRICAL CABLING BETWEEN ELECTRICAL DEVICES

Номер: US20180034209A1
Автор: BEGOU Aurelien, KIA Emilien
Принадлежит:

A plug adapter configured for application with a system for automatically deducing the electrical cabling between electrical devices includes: a plug configured to plug into in a socket of an electrical device; a socket configured to plug into a plug of an electrical cable; a light receiver positioned to receive light emitted by an optical fiber ending in the plug of the electrical cable; and an electronic unit configured to control the light receiver and/or the light emitter and including an interface configured to communicate with a cabling management system of the system configured to automatically deduce the electrical cabling between electrical devices in order to receive control signals for the light emitter and to transmit detection signals from the light receiver. 112-. (canceled)13: A plug adapter configured for application with a system for automatically deducing the electrical cabling between electrical devices , the plug adapter comprising:a plug configured to plug into in a socket of an electrical device;a socket configured to plug into a plug of an electrical cable;a light receiver positioned to receive light emitted by an optical fiber ending in the plug of the electrical cable, which is plugged in the socket and/or a light emitter positioned in order to couple emitted light into an optical fiber ending in the plug of the electrical cable, which is plugged in the socket; andan electronic unit configured to control the light receiver and/or the light emitter and including an interface configured to communicate with a cabling management system of the system configured to automatically deduce the electrical cabling between electrical devices in order to receive control signals for the light emitter and to transmit detection signals from the light receiver.14: A system for automatically deducing the electrical cabling between electrical devices , the system comprising:an electrical cable configured to connect at least two electrical devices, the ...

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Номер записи: 56
30-01-2020 дата публикации

THERMAL INTERFACE

Номер: US20200033541A1
Автор: Chiang Troy Wy Piew, Koh Julia, Teo Tat Ming, Wang William H.
Принадлежит:

A thermal interface may include a thermally conductive cap. The thermally conductive cap may include a base, a finger, and an extension. The base may define a plurality of cap openings. The finger may extend from the base. The extension may extend from the base. The thermal interface may also include a gasket defining a plurality of gasket openings. The gasket may be located on the base of the cap such that the gasket openings are positioned over the cap openings. 1. A thermal interface comprising: a base defining a plurality of cap openings;', 'a finger extending from the base; and', 'an extension extending from the base; and, 'a thermally conductive cap includinga gasket defining a plurality of gasket openings, the gasket located on the base of the cap such that the gasket openings are positioned over the cap openings.2. The thermal interface of claim 1 , further comprising a pad including a pliant thermal interface material.3. The thermal interface of claim 1 , further comprising an adhesive located between the gasket and the base of the cap.4. The thermal interface of claim 1 , wherein the gasket openings are smaller than the cap openings.5. The thermal interface of claim 1 , wherein the finger is a first finger and the cap includes a plurality of fingers claim 1 , including the first finger.6. The thermal interface of claim 1 , wherein the extension has a length greater than a length of the finger.7. The thermal interface of claim 1 , wherein the cap is configured to be positioned at an end face of a header of an optical subassembly claim 1 , and the finger and the extension are configured to be positioned at a side of the header.8. The thermal interface of claim 1 , wherein the cap includes copper.9. An optoelectronic module comprising:a shell including a seat;an optical subassembly including a header having a plurality of leads; [ a base defining a plurality of cap openings;', 'a finger extending from the base; and', 'an extension extending from the base; and ...

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Номер записи: 57
31-01-2019 дата публикации

HIGH-FREQUENCY OPTOELECTRONIC MODULE

Номер: US20190036618A1
Автор: Hasharoni Jacob
Принадлежит:

A high-frequency optoelectronic module, that includes a first chip, a substrate and at least one optoelectronic unit. The first chip includes a set of high-frequency electrical IO interfaces. The at least one optoelectronic unit includes a group of high-frequency electrical IO interfaces and a group of high-frequency optical IO interfaces. The group of high-frequency optical IO interfaces is coupled to the group of high-frequency electrical IO interfaces. The substrate is coupled to the first chip and the at least one optoelectronic chip. The set of high-frequency electrical IO interfaces is coupled to the group of high-frequency electrical IO interfaces via a group of conductors. A length of each conductor of the group of conductors is of a scale that does not exceed a millimetric scale. The at least one optoelectronic circuit is configured to (a) convert high-frequency output electrical signals from the first chip to high-frequency output optical signals, and (b) convert high-frequency input optical signals sent towards the first chip to high-frequency input electrical signals. The high-frequency it not smaller than one hundred gigabits per second. 1. A high-frequency optoelectronic module , comprising:a first chip that comprises a set of high-frequency electrical input/output (IO) interfaces;an optoelectronic unit that comprises a high-frequency electrical IO chip, a group of high-frequency electrical IO interfaces, and a high-frequency optical transmit chip;a substrate that is (a) coupled, via the set of high-frequency electrical IO interfaces to the first chip, and is (b) coupled, via the group of high-frequency electrical IO interfaces to the high-frequency electrical IO chip;wherein the high-frequency optical transmit chip is positioned within a hole formed in the substrate and is configured to transmit high-frequency optical signals away from the high-frequency electrical IO chip;wherein the set of high-frequency electrical IO interfaces is coupled to the ...

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Номер записи: 58
04-02-2021 дата публикации

CONNECTOR ASSEMBLY

Номер: US20210036466A1
Автор: GOTO Masayuki, ISHIDA Naruki, Sano Yoshiaki
Принадлежит:

A connector assembly involving a plug connector that incorporates a photoelectric conversion element that conducts optical/electrical and electrical/optical signal conversion, and an actuation device that drives said photoelectric conversion element, and a receptacle connector mated with said plug connector, with the plug connector and the receptacle connector being electrically connected through mutual contact between terminals, wherein, in the plug connector, the front end side of a fiber optic cable used for optical signal transmission is connected to the rear end side of said plug connector and extends from the rear, lateral terminals are arranged in each of a pair of lateral edge portions that extend in the forward-backward direction, while end terminals are arranged in a front end edge portion that extends perpendicular to the forward-backward direction. 1. A connector assembly comprising: a photoelectric conversion element configured to convert optical signals to electrical signals, and electrical signals to optical signals; and', 'an actuation device configured to drive said photoelectric conversion element; and, 'a plug connector comprisinga receptacle connector mated with said plug connector, wherein the plug connector and the receptacle connector are electrically connected through mutual contact between terminals; a front end side of a fiber optic cable configured to facilitate optical signal transmission is connected to a rear end side of said plug connector and extends from the rear end side, and', 'lateral terminals are arranged in each of a pair of lateral edge portions that extend in a forward-backward direction, while end terminals are arranged in a front end edge portion that extends perpendicular to the forward-backward direction., 'wherein in the plug connector2. The connector assembly according to claim 1 , wherein at least a pair of adjacent ones of the end terminals in the plug connector serves as differential terminals configured to ...

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Номер записи: 59
04-02-2021 дата публикации

Connector assembly

Номер: US20210036467A1
Автор: Masayuki Goto, Naruki ISHIDA, Yoshiaki Sano
Принадлежит: Hirose Electric Co Ltd

In the plug connector, the front end side of a fiber optic cable used for optical signal transmission is connected to, and rearwardly extends from, the rear end side of said plug connector and lateral terminals are arranged in each of a pair of lateral edge portions that extend in the forward-backward direction; at least one of the plug connector and receptacle connector has provided therein resilient members that generate a biasing force between the plug connector and receptacle connector in the forward-backward direction; and, a restricting portion, which provides a limiting value for the distance of relative displacement of the plug connector with respect to the receptacle connector in the direction of the biasing force under the action of the above-mentioned biasing force, is formed in the receptacle connector, and a restricted portion is formed in the plug connector.

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Номер записи: 60
04-02-2021 дата публикации

Passive optical network device

Номер: US20210036780A1
Автор: I yu Kuo, Shih Chieh Kang, Yu Te CHOU
Принадлежит: EZconn Corp

A passive optical network device comprising a casing, printed circuit board, and fiber optic transceiver system is provided. The fiber optic transceiver system comprises a fiber optic components device, fiber optic transceiver, and RF connector. During operation, the fiber optic components device converts optical signals from the fiber optic transceiver to digital signals, and then transmits the converted digital signals to external electronic systems via the hot-pluggable transceiver connection interface. The fiber optic components device converts digital signals from the external electronic systems to optical signals, and then transmits the optical signals to other external electronic systems via the fiber optic transceiver. The RF connector transmits RF signals from additional external electronic systems to the external electronic systems via the hot-pluggable transceiver connection interface. The RF connector transmits digital signals from the external electronic systems to the additional external electronic systems via the hot-pluggable transceiver connection interface.

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Номер записи: 61
06-02-2020 дата публикации

OPTICAL SUBASSEMBLY AND OPTICAL MODULE

Номер: US20200041735A1
Автор: Noguchi Daisuke, Yamamoto Hiroshi
Принадлежит:

An optical subassembly may include a device mounting substrate on which an optical device is mounted, a relay substrate including a first conductor pattern transmitting a electrical signal to the optical device, a pedestal including a third surface on which the relay substrate is placed and a fourth surface on which the device mounting substrate is placed and a spacer interposed between the third surface and the relay substrate to electrically connect the relay substrate and the pedestal. In an optical subassembly, the first lead terminal may include a small-diameter part and a large-diameter part provided at an end of the small-diameter part and having a larger diameter than that of the small-diameter part, and at least part of the large-diameter part may be exposed from the dielectric on a first surface side and the first lead terminal and the first conductor pattern may be connected by brazing and soldering. 1. An optical subassembly comprising:an eyelet including a first surface and a second surface arranged opposite the first surface, a first through hole penetrating from the first surface to the second surface;a first lead terminal inserted into the first through hole and transmitting an electrical signal;a dielectric filled in the first through hole;a device mounting substrate on which an optical device converting at least one of an optical signal and the electrical signal into another is mounted;a relay substrate including a first conductor pattern transmitting the electrical signal to the optical device;a pedestal protruding from the first surface to an extending direction of the first through hole and including a third surface on which the relay substrate is placed and a fourth surface on which the device mounting substrate is placed; anda spacer interposed between the third surface and the relay substrate to electrically connect a back surface of the relay substrate and the pedestal.2. The optical subassembly according to claim 1 ,wherein the third ...

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Номер записи: 62
06-02-2020 дата публикации

ELECTROMAGNETIC INTERFERENCE LEAKAGE REDUCTION FOR A PLUGGABLE OPTICAL MODULE

Номер: US20200041738A1
Автор: CHAN Kit, LU Jeffy, WANG Lynn
Принадлежит:

A pluggable optical module may include a housing enclosing one or more optical components and one or more electrical components. The pluggable optical module may include a slider to move along an exterior wall of the housing in association with latching or unlatching the pluggable optical module. The pluggable optical module may include an electromagnetic interference (EMI) shield arranged in a gap between the slider and the exterior wall of the housing such that the EMI shield contacts the slider and the exterior wall of the housing. The EMI shield reduce EMI radiation passing through the gap. 1. A pluggable optical module , comprising:a housing enclosing one or more optical components and one or more electrical components;a slider to move along an exterior wall of the housing in association with latching or unlatching the pluggable optical module; and 'wherein the EMI shield is to reduce EMI radiation passing through the gap.', 'an electromagnetic interference (EMI) shield arranged in a gap between the slider and the exterior wall of the housing such that the EMI shield contacts the slider and the exterior wall of the housing,'}2. The pluggable optical module of claim 1 , wherein the EMI shield comprises a metallic spring including a plurality of spring fingers.3. The pluggable optical module of claim 2 , wherein widths of spring fingers claim 2 , of the plurality of spring fingers claim 2 , are selected to reduce EMI radiation at a frequency associated with a line rate of the pluggable optical module.4. The pluggable optical module of claim 1 , wherein the EMI shield comprises a conductive foam.5. The pluggable optical module of claim 1 , wherein the EMI shield comprises a conductive fabric.6. The pluggable optical module of claim 1 , wherein the EMI shield is clipped to a portion of the housing.7. The pluggable optical module of claim 1 , wherein the EMI shield is affixed to the housing by an epoxy claim 1 , a solder claim 1 , or a weld.8. The pluggable optical ...

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Номер записи: 63
16-02-2017 дата публикации

OPTICAL TRANSMISSION AND RECEPTION CONNECTOR SYSTEM

Номер: US20170045691A1
Автор: HWANG Sung-Hwan, JUNG Eun-Joo, KIM Myoung-Jin, LEE Woo-jin, RHO Byung-Sup
Принадлежит: Korea Photonics Technology Institute

An optical transmission and reception connector system includes a cable that has a plug section formed at both ends thereof so as to relay and transmit light and an interfacing module that is mounted on an electronic apparatus and that includes an insertion space into which the plug section is detachably inserted. The cable is provided with a first relay optical path and a second relay optical path. The interfacing module includes a receptacle unit in which a first internal optical terminal and a second internal optical terminal for transmitting and receiving light to and from the cable are separated from each other, an optical transmitter unit, an optical receiver unit, and a main optical transmission unit that includes a first main optical path formed between the optical transmitter unit and the first internal optical terminal so as to transmit light output from the optical transmitter unit through the first internal optical terminal and a second main optical path formed between the second internal optical terminal and the optical receiver unit so as to be separated from the first main optical path and to transmit light received from the second internal optical terminal to the optical receiver unit The plug section of the cable is formed such that an upper part and a lower part are symmetric with respect to the center thereof without depending on the insertion direction thereof, and the cable or the receptacle unit is formed to divide or switch an optical path so as to enable transmission of light by the optical transmitter unit and reception of light by the optical receiver unit. 1. An optical transmission and reception connector system comprising:a cable that has a plug section formed at both ends thereof so as to relay and transmit light; andan interfacing module that is mounted on an electronic apparatus and that includes an insertion space into which the plug section is detachably inserted,wherein the cable is provided with a first relay optical path through ...

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Номер записи: 64
19-02-2015 дата публикации

STRUCTURED SUBSTRATE FOR OPTICAL FIBER ALIGNMENT

Номер: US20150050028A1
Автор: Budd Russell A., Fortier Paul F.
Принадлежит: INTERNATIONAL BUSINESS MACHINES CORPORATION

A structured substrate for optical fiber alignment is produced at least in part by forming a substrate with a plurality of buried conductive features and a plurality of top level conductive features. At least one of the plurality of top level conductive features defines a bond pad. A groove is then patterned in the substrate utilizing a portion of the plurality of top level conductive features as an etch mask and one of the plurality of buried conductive features as an etch stop. At least a portion of an optical fiber is placed into the groove. 1. A method comprising the steps of:forming a substrate comprising a plurality of buried conductive features and a plurality of top level conductive features, at least one of the plurality of top level conductive features defining a bond pad;patterning a groove in the substrate utilizing a portion of the plurality of top level conductive features as an etch mask and one of the plurality of buried conductive features as an etch stop; andplacing at least a portion of an optical fiber into the groove.2. The method of claim 1 , wherein the substrate comprises a surface laminar circuit.3. The method of claim 1 , wherein the plurality of top level conductive features comprise a metal claim 1 , and the plurality of buried conductive features comprise a metal.4. The method of claim 1 , wherein the step of patterning the groove comprises laser ablation.5. The method of claim 1 , wherein the optical fiber is supported by a fiber holder.6. The method of claim 5 , further comprising the steps of:patterning a trench in the substrate; andplacing at least a portion of the fiber holder into the trench.7. The method of wherein the step of patterning the trench comprises utilizing a portion of the plurality of top level conductive features as an etch mask and one of the plurality of buried conductive features as an etch stop.8. The method of claim 1 , further comprising the step of forming a mirror at an end of the optical fiber.9. The method ...

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Номер записи: 65
16-02-2017 дата публикации

EMI CONTAINMENT FOR CONNECTOR ASSEMBLY

Номер: US20170047690A1
Автор: Dunwoody Steven David, Long Richard James, Sharf Alex Michael
Принадлежит:

A connector assembly includes a cage member receiving a pluggable module and providing electrical shielding for the pluggable module. The cage member is mounted behind a bezel and aligned with a bezel opening. The connector assembly includes an EMI skirt at the front end of the cage member. The EMI skirt includes plural spring beams integral and having a unibody design with the cage member. Each spring beam has a front bend at the exit point from the cage member, a base extending rearward from the front bend and an arm extending from the base outward in a direction generally away from the cage member. The cage member is positioned relative to the bezel such that the arms reside behind the bezel. The arms have bezel mating interfaces configured to engage and electrically connect to the bezel. 1. A connector assembly comprising:a cage member having a plurality of walls defining a port configured to receive a pluggable module therein through a front end of the cage member, the walls extending rearward from the front end to a rear end of the cage member, the walls being manufactured from a metal material and providing electrical shielding for the port, the cage member being configured to be mounted generally behind an interior surface of a bezel and being aligned with an opening in the bezel to receive the pluggable module; andan EMI skirt at the front end of the cage member, the EMI skirt comprising plural spring beams extending from the walls at exit points, the spring beams and the cage member being integral and having a unibody design, each spring beam having a front bend at the exit point from the corresponding wall at the front end of the cage member, each spring beam having a base extending rearward from the front bend along the exterior of the cage member and spaced apart from the corresponding wall of the cage member, the base being configured to pass through the opening in the bezel to a position rearward of the interior surface of the bezel, each spring beam ...

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Номер записи: 66
06-02-2020 дата публикации

Printed circuit board, optical module, and optical transmission equipment

Номер: US20200045808A1
Автор: Osamu Kagaya
Принадлежит: Lumentum Japan Inc

Provided is a printed circuit board realizing selective inhibition of electromagnetic noise and enabling high-density arrangement of differential transmission lines without increasing cost. The printed circuit board includes a pair of strip conductors (first layer), a first resonance conductor plate, a ground conductive layer (together with a second layer) including an opening portion, a second resonance conductor plate (third layer), a third resonance conductor plate (fourth layer), first via holes connecting the first and second resonance conductor plates, a second via hole connecting the second and third resonance conductor plates, and third via holes connecting the third resonance conductor plate and the ground conductive layer, wherein a polygon obtained by sequentially connecting centers of the adjacent third via holes overlaps so as to include the first resonance conductor plate, and center-to-center distance between the adjacent third via holes is 0.5 wavelength or less at frequency corresponding to the bit rate.

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Номер записи: 67
15-02-2018 дата публикации

Optical Transceiver and Method of Downloading Data

Номер: US20180048391A1
Автор: FUTAMI Ryutaro, Tanaka Hiromi
Принадлежит:

An optical transceiver that shortens an elapsed time for loading data from an external device, and a method of loading data are disclosed. The optical transceiver includes an inner memory, a central processing unit (CPU), and a serial communication line connecting the CPU with the external device. The CPU actively loads data stored in the external device into the inner memory through the serial communication line by operating as a master device in the serial communication line. 1. An optical transceiver that performs a mutual conversion between an electrical signal and an optical signal , the optical transceiver comprising:an inner memory provided in the optical transceiver, the inner memory storing a data and program loaded from an external device;a central processing unit (CPU) that controls the mutual conversion by the data and program stored in the inner memory; anda first serial interface through which the CPU communicates with the external device,wherein the CPU loads the data and program from the external device through the first serial interface as a master device in the first serial interface, and loads the data and program into the inner memory.2. The optical transceiver of claim 1 ,further including a second serial interface through which the CPU communicates with the inner memory;wherein the CPU loads the data and program read from the external device into the inner memory through the second serial interface as a master device in the second serial interface concurrently with the load of the data and program from the external device through the first serial interface.3. The optical transceiver of claim 2 ,further including a circuit that carries out the mutual conversion,wherein the data and program loaded from the external device includes a data for the mutual conversion by the circuit,wherein the CPU stores the data for the mutual conversion into the inner memory through the second serial interface, andwherein the circuit reads the data for the mutual ...

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Номер записи: 68
03-03-2022 дата публикации

Optical Module

Номер: US20220066110A1
Автор: Kawamura Yuriko, Kikuchi Kiyofumi, Nasu Yusuke, Soma Shunichi
Принадлежит:

An object is to easily convey by suction an optical module equipped with optical fibers having ends coupled to optical receptacles and mount the optical module on a substrate. An optical module according to the present invention includes an optical device to which optical fibers having ends coupled to optical receptacles are optically coupled and also includes a carrier composed of a substrate and adhesive layers formed on the upper and lower surfaces of the substrate. The optical device is bonded on the adhesive layer formed on the lower surface of the substrate. Part of the optical fibers and the optical receptacles are bonded on the adhesive layer formed on the surface of the substrate. 1. An optical module comprising:an optical device to which one or more optical fibers are optically coupled;an optical receptacle optically coupled to at least one of the one or more optical fibers; anda carrier including a substrate and an adhesive layer formed on a surface of the substrate, whereinboth or either of the optical fibers and the optical device is bonded on a surface of the adhesive layer.2. The optical module according to claim 1 , wherein the optical device comprises a ball grid array electrode.3. The optical module according to claim 1 , wherein the carrier is formed of a material that enables the carrier to tolerate a condition according to a reflow soldering thermal history.4. The optical module according to claim 1 , wherein the substrate protrudes downwards to have a protrusion and the optical device is fixed on a lower surface of the protrusion of the substrate.5. The optical module according to claim 1 , wherein the optical device is fixed to the substrate in a manner that enables an outline of the optical device to be partially checked from above the carrier.6. The optical module according to claim 1 , wherein a hole for subjecting the optical device to vacuum suction is provided at the substrate.7. The optical module according to claim 1 , wherein a hollow ...

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Номер записи: 69
13-02-2020 дата публикации

LIGHT SOURCE DEVICE AND ELECTRONIC APPARATUS

Номер: US20200049911A1
Автор: Chen I-Ju, Su Yu-Hung, TSAI Hsin-Wei, Tsao Hou-Yen, YANG SHU-HUA
Принадлежит:

A light source device and an electronic apparatus are provided. The light source device includes a substrate, an electrode layer and a surrounding frame disposed on the substrate, a light emitter and a light detector mounted on the electrode layer and located inside of the surrounding frame, and a light permeable member disposed on the surrounding frame and covering the light emitter and the light detector. When the light emitter receives a predetermined current so as to emit an invisible light toward the light permeable member, the light detector receives a reflected part of the invisible light to generate an initial photocurrent. When the light emitter receives a manipulation current so that a detection photocurrent generated from the light detector is less than a first ratio of the initial photocurrent or greater than a second ratio of the initial photocurrent, the light emitter stops receiving the manipulation current. 1. A light source device , comprising:a substrate including a first surface and a second surface opposite to the first surface;an electrode layer disposed on the first surface of the substrate;a surrounding frame disposed on the first surface;a light emitter and a light detector mounted on the electrode layer and spaced apart from each other, and located on an inner side of the surrounding frame; anda light permeable member disposed on the surrounding frame and covering the light emitter and the light detector,wherein when the light emitter receives a predetermined current, the light emitter emits an invisible light toward the light permeable member, and the light detector receives a part of the invisible light reflected from the light permeable member so as to generate an initial photocurrent,wherein when the light emitter receives a manipulation current so that a detection photocurrent generated from the light detector is less than a first ratio of the initial photocurrent or greater than a second ratio of the initial photocurrent, the light ...

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Номер записи: 70
13-02-2020 дата публикации

SHIELD CAGE ASSEMBLY

Номер: US20200049912A1
Автор: LU You-Qian
Принадлежит:

A shield cage assembly of the present disclosure comprises a metal shield shell and a heat dissipating module. The metal shield shell comprises a plurality of walls and an accommodating space defined by the plurality of walls, and the accommodating space has a front end port. The heat dissipating module is assembled to one of the walls of the metal shield shell, and the heat dissipating module comprises a heat dissipating base member, a first heat dissipating member provided to the heat dissipating base member and at least one clip sandwiched between the heat dissipating base member and the first heat dissipating member, and the clip engages with the metal shield shell, a bottom of the heat dissipating base member covers the wall of the metal shield shell to which the heat dissipating module is assembled. 1. A shield cage assembly , comprising:a metal shield shell composed of a metal plate, and the metal shield shell comprising a plurality of walls and an accommodating space defined by the plurality of walls and extending in a front-rear direction, the accommodating space having a front end port facing forwardly; anda heat dissipating module assembled to one of the plurality of walls of the metal shield shell, and the heat dissipating module comprising a heat dissipating base member, a first heat dissipating member provided to a top of the heat dissipating base member and at least one clip which is sandwiched between the heat dissipating base member and the first heat dissipating member and limited in position, and the clip engaging with the metal shield shell, a bottom of the heat dissipating base member covering the wall of the metal shield shell to which the heat dissipating module is assembled.2. The shield cage assembly of claim 1 , whereinthe wall of the metal shield shell to which the heat dissipating module is assembled is formed with an opening communicated with the accommodating space,the heat dissipating module further comprises a heat source contact ...

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Номер записи: 71
22-02-2018 дата публикации

Optically aligned hybrid semiconductor device and method

Номер: US20180052290A1
Автор: Ari Jason NOVACK, Daniel J. Blumenthal, David Henry Kinghorn, Holger N. Klein, Kishor V. Desai, Michael J. Hochberg, Nathan A. Nuttall, Ruizhi Shi
Принадлежит: Elenion Technologies LLC

Two semiconductor chips are optically aligned to form a hybrid semiconductor device. Both chips have optical waveguides and alignment surface positioned at precisely-defined complementary vertical offsets from optical axes of the corresponding waveguides, so that the waveguides are vertically aligned when one of the chips is placed atop the other with their alignment surface abutting each other. The position of the at least one of the alignment surface in a layer stack of its chip is precisely defined by epitaxy. The chips are bonded at offset bonding pads with the alignment surfaces abutting in the absence of bonding material therebetween.

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Номер записи: 72
22-02-2018 дата публикации

OPTICAL TRANSCEIVER MODULE HAVING A PARTITIONED HOUSING

Номер: US20180052291A1
Автор: Ho I-Lung, LIN Kai-Sheng, WANG Hsiu-Che
Принадлежит:

A transceiver module having a partitioned housing, e.g., a bifurcated or multi-segment housing, is disclosed that allows coupling and alignment of a TOSA arrangement and ROSA arrangement in separate respective portions in order to minimize or otherwise reduce component damage and rework iterations during manufacturing and repair. Technicians may thus perform at least partial assembly and testing of each optical subassembly arrangement in parallel and in relative isolation without necessarily interrupting and/or waiting on completion of the other. In a general sense, each separate portion of the partitioned housing provides a dedicated workspace of about equal dimension for coupling of subassembly components. Each separate portion may lie flat on a tabletop, for instance, which may further simplify manufacturing processes and provide a wide-range of acceptance angles for performing soldering, welding, insertion and coupling of components, visual inspection, fiber routing, and so on. 1. An optical transceiver module comprising:a housing including at least a first housing portion and a second housing portion, each of the first and second housing portions including a base portion providing at least one mounting surface and at least one sidewall extending therefrom that defines a compartment, wherein the first housing portion is configured to couple to the second housing portion to form a cavity therebetween;a transmitter optical subassembly (TOSA) arrangement coupled to the at least one mounting surface of the first housing portion; anda receiver optical subassembly (ROSA) arrangement coupled to at least one mounting surface of the second housing portion,wherein the TOSA arrangement and the ROSA arrangement are disposed opposite each other within the cavity when the first housing portion is coupled to the second housing portion.2. The optical transceiver module of claim 1 , wherein each of the at least one mounting surfaces of the first and second housing portions claim ...

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Номер записи: 73
22-02-2018 дата публикации

Electrical connector for use with optoelectronic module

Номер: US20180052292A1
Автор: Shuo-Hsiu Hsu
Принадлежит: Foxconn Interconnect Technology Ltd

An electrical connector assembly for connection between the optical device and the printed circuit board, includes a frame, a housing received in the frame, a retention lever pivotally mounted upon the frame for retaining the optoelectronic module, an optical jumper module located on a front portion of the housing and optically connected with the optoelectronic module wherein the retention lever includes a pressing section adapted to downwardly press the optoelectronic module, an handling section, and a downwardly protruding stopper formed on the handling section and adapted to abut against the printed circuit board when the retention lever is downwardly moved excessively. The frame is equipped with a locking hook to lock the retention lever in position so as to retain the optoelectronic module in position.

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Номер записи: 74
25-02-2016 дата публикации

FLEXIBLE SMART SLEEVE SYSTEMS AND METHODS FOR PLUGGABLE TRANSCEIVERS

Номер: US20160057518A1
Автор: NEUDORF Kenneth Edward
Принадлежит: Ciena Corporation

A flexible smart sleeve system for a pluggable transceiver includes a pluggable sleeve configured to selectively engage a pluggable transceiver; a smart enclosure configured to selectively engage a host device, wherein the host device is configured for the pluggable transceiver; and a flexible cable connecting the pluggable sleeve to the smart enclosure. A network with a flexible smart sleeve system for a pluggable transceiver includes a network switch; a customer premises switch comprising a host cage configured for the pluggable transceiver; and a flexible smart sleeve system configured to engage the host cage and to engage the pluggable transceiver, wherein the flexible smart sleeve system is configured to provide Operations, Administration, and Maintenance (OAM) to the network switch. 1. A flexible smart sleeve system for a pluggable transceiver , the system comprising:a pluggable sleeve configured to selectively engage a pluggable transceiver;a smart enclosure configured to selectively engage a host device, wherein the host device is configured for the pluggable transceiver; anda flexible cable connecting the pluggable sleeve to the smart enclosure.2. The flexible smart sleeve system of claim 1 , further comprising:circuitry configured to perform Operations, Administration, and Maintenance (OAM) with a network switch communicatively coupled to the pluggable transceiver.3. The flexible smart sleeve system of claim 2 , wherein the circuitry is disposed in the pluggable sleeve.4. The flexible smart sleeve system of claim 2 , wherein the circuitry is disposed in the smart enclosure.5. The flexible smart sleeve system of claim 2 , wherein the network switch is communicatively coupled to a network management system and provides OAM from the flexible smart sleeve system to the network management system.6. The flexible smart sleeve system of claim 2 , wherein the circuitry comprises a Field Programmable Gate Array (FPGA) configured to perform OAM and flash memory ...

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Номер записи: 75
23-02-2017 дата публикации

SYSTEM AND METHOD FOR COMMUNICATING HIGH AND LOW SPEED DATA VIA OPTICAL SIGNALS AND POWER VIA ELECTRICAL SIGNALS

Номер: US20170054501A9
Автор: Jiang Wenbin, Kuo Chien-Yu, Nguyen Nguyen X.
Принадлежит:

A data communication system is disclosed including a cable medium and modulator adapted to carry data and power between a high speed data source and a high speed data sink. Relatively high speed data (e.g. the TMDS data of an HDMI interface) may be carried on optical waveguides in the cable medium. Relatively low-speed data (e.g., DDC data and clock, and CEC of an HDMI interface) may be carried on a separate set of optical waveguides or wire mediums. The optical waveguides allow for substantially less signal distortion of the high-speed data, thereby allowing the cable medium to achieve much higher lengths without significantly affecting the high-speed signaling. 1. A cable , comprising: a first set of one or more electrical contacts configured to receive data from a first device attached to the first connector;', 'a second set of one or more electrical contacts configured to receive a power signal; and', 'a first optical modulator configured to modulate a first optical signal with the data received from the first device;, 'a first connector comprising a first optical demodulator configured to demodulate the first optical signal to generate the data;', 'a third set of one or more electrical contacts configured to provide the data to a second device attached to the second connector;', 'a fourth set of one or more electrical contacts configured to receive the power signal;, 'a second connector comprisingone or more optical waveguides for transmitting the first modulated optical signal from the first connector to the second connector; andone or more electrical wire mediums for transmitting the power signal from the first connector to the second connector or from the second connector to the first connector.2. The cable of claim 1 , wherein the data comprises multimedia data.3. The cable of claim 1 , wherein the data is configured into a Transition Minimized Differential Signaling (TMDS).4. The cable of claim 3 , wherein the Transition Minimized Differential Signaling ( ...

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Номер записи: 76
10-03-2022 дата публикации

OPTICAL TRANSCEIVER

Номер: US20220075133A1
Автор: LIN Jhen, SHIU Hsuan-Chen, YEH Che-Shou
Принадлежит:

An optical transceiver includes a housing, a heat dissipation module and an optical communication module. The heat dissipation module includes a first heat conductive component and a second heat conductive component accommodated in the housing. The first heat conductive component and the second heat conductive component are two independent components, and the first heat conductive component thermally contacts the second heat conductive component. The optical communication module is accommodated in the housing and thermally contacts the heat dissipation module. 1. An optical transceiver , comprising:a housing;a heat dissipation module comprising a first heat conductive component and a second heat conductive component accommodated in the housing, the first heat conductive component and the second heat conductive component being two independent components, and the first heat conductive component thermally contacting the second heat conductive component;an optical communication module accommodated in the housing and thermally contacting the heat dissipation module; andwherein a protrusion of the first heat conductive component extends toward a protrusion of the second heat conductive component, the protrusion of the second heat conductive component extends toward the protrusion of the first heat conductive component, and the protrusion of the first heat conductive component thermally contacts the protrusion of the second heat conductive component.2. The optical transceiver according to claim 1 , wherein the housing comprises an upper cover and a lower cover assembled together claim 1 , the first heat conductive component is located between the second heat conductive component and part of the upper cover claim 1 , the second heat conductive component is located between the first heat conductive component and part of the lower cover claim 1 , and the second heat conductive component thermally contacts the lower cover.3. The optical transceiver according to claim 2 , ...

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Номер записи: 77
03-03-2016 дата публикации

Photoelectric hybrid device and method for manufacturing same

Номер: US20160062063A1
Автор: Akio Ukita, ICHIRO Ogura, Kazuhiko Kurata, Koichi Takemura, Mitsuru Kurihara, Toshinori UEMURA
Принадлежит: PHOTONICS ELECTRONICS TECHNOLOGY RESEARCH ASSOCIATION

In a photoelectric hybrid device, an optical connector is mounted on a flat optical surface provided on one end of vertical optical waveguides for inputting and outputting an optical signal, and along with making integration of the photoelectric hybrid device into an interposer or the like easy, integration is standardized. The photoelectric hybrid device is provided with: conductive pins ( 108 ) that are connected to an electric signal pathway for a photoelectric hybrid substrate; a translucent member ( 116 ) that has a flat optical surface and also has a translucent part ( 118 ); and a plurality of self organizing optical waveguides ( 122 ) that form an optical path between the translucent part ( 118 ) and an optical waveguide of the photoelectric hybrid substrate. The constitution is such that the position of the flat optical surface is not lower than the tops of the electrical connection parts ( 110 ) on the conductive pins ( 108 ); thereby, when an optical connector on which an optical waveguide that transmits an optical signal among the optical waveguides ( 122 ) is mounted on the flat optical surface, collision of the optical connector and the tops of the electrical connection parts can be avoided.

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Номер записи: 78
01-03-2018 дата публикации

SELF-CLOCKED LOW NOISE PHOTORECEIVER (SCLNP)

Номер: US20180058925A1
Автор: Orcutt Jason S., Solomon Paul M.
Принадлежит:

A photoreceiver device includes a light detector connected between a power supply node and a first node, and first to third switching elements. The light detector is configured to detect an incident optical data signal, and to output photocurrent corresponding to a magnitude of the optical data signal through the first node. The first switching element is connected between the first node and a ground node. The second switching element is connected between the power supply node and a second node. The third switching element is connected between the second node and the ground node. The third switching element has a control node connected to the first node. 1. A photoreceiver device , comprising:a first switching element, prior to receipt of an optical data signal, configured to be switched on in response to a first control signal to pull down a first node of the first switching element, wherein a second node of the first switching element is coupled to a ground node;a second switching element, prior to receipt of the optical data signal, configured to be switched on, in response to a second control signal, to pull up a first node of the second switching element, wherein a second node of the second switching element is coupled to a power supply node;a light detector configured to receive the optical data signal, generate photocurrent corresponding to a magnitude of the optical data signal, and output the generated photocurrent through the first node of the first switching element; anda third switching element configured to be switched on, in response to a first magnitude of the photocurrent, to pull down the first node of the second switching element in response to a first magnitude of the photocurrent, wherein the first magnitude is more than a threshold voltage of the third switching element.2. The device of claim 1 , wherein each of the first to third switching elements is a transistor.3. The device of claim 2 , wherein each of the first and third switching elements ...

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Номер записи: 79
01-03-2018 дата публикации

METHOD OF MANUFACTURING PHOTOELECTRIC CONVERSION CONNECTORS, AS WELL AS PHOTOELECTRIC CONVERSION CONNECTOR AND PHOTOELECTRIC CONVERSION CONNECTOR DEVICE UTILIZING SAME

Номер: US20180059341A1
Автор: Sano Yoshiaki
Принадлежит:

The following steps are provided: encapsulating a series of connector components arranged in a column direction among multiple connector components on a support member that are arranged in each direction, respectively, in a row direction and in a column direction, in a state of substantial isolation from connector components adjacent to the series of connector components in the row direction using a first resin member; dicing the multiple connector components on the support member encapsulated using the first resin member into row units in the row direction; molding the multiple connector components on the support member, which have been encapsulated using the above-mentioned first resin member and diced, using a second resin member on a column-by-column basis; and dicing off the multiple molded connector components on the support member in the column direction one by one. 1. A method of manufacturing photoelectric conversion connectors comprising:encapsulating a series of connector components arranged in a column direction among multiple connector components on a support member that are arranged in each direction, respectively, in a row direction and in a column direction, in a state of substantial isolation from connector components adjacent to said series of connector components in the row direction using a first resin member;dicing the multiple connector components on the support member encapsulated using the above-mentioned first resin member into row units in the row direction;molding the multiple connector components on the support member, which have been encapsulated using the above-mentioned first resin member and diced, using a second resin member on a column-by-column basis; anddicing off the multiple molded connector components on the support member in the column direction one by one.2. The method of manufacturing photoelectric conversion connectors according to claim 1 , wherein the encapsulation step is performed by encapsulating claim 1 , at one time ...

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Номер записи: 80
01-03-2018 дата публикации

BACK-REFLECTION PROTECTION AND MONITORING IN FIBER AND FIBER-DELIVERED LASERS

Номер: US20180059343A1
Автор: Kliner Dahv A.V.
Принадлежит: NLIGHT PHOTONICS CORPORATION

A system includes an optical fiber situated to propagate a laser beam received from a laser source to an output of the optical fiber, a first cladding light stripper optically coupled to the optical fiber and situated to extract at least a portion of forward-propagating cladding light in the optical fiber, and a second cladding light stripper optically coupled to the optical fiber between the first cladding light stripper and the optical fiber output and situated to extract at least a portion of backward-propagating cladding light in the optical fiber. 1. A system , comprising:an optical fiber situated to propagate a laser beam received from a laser source to an output of the optical fiber;a first cladding light stripper optically coupled to the optical fiber and situated to extract at least a portion of forward-propagating cladding light in the optical fiber; anda second cladding light stripper optically coupled to the optical fiber between the first cladding light stripper and the optical fiber output and situated to extract at least a portion of backward-propagating cladding light in the optical fiber.2. The system of claim 1 , further comprising:a heat sink situated to receive and absorb the forward-propagating cladding light and the backward-propagating cladding light extracted by the first and second cladding light strippers, respectively.3. The system of claim 1 , further comprising:a detection chamber optically situated between the first and second cladding light strippers.4. The system of claim 1 , further comprising:a beam directing optical system situated to receive the laser beam from the output of the optical fiber.5. The system of claim 4 , wherein the beam directing optical system includes an output beam combiner situated to combine the received laser beam with one or more other laser beams.6. The system of claim 1 , wherein less than about 10% of the forward-propagating cladding light and less than about 10% of the backward-propagating cladding light ...

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Номер записи: 81
02-03-2017 дата публикации

EMI SHIELD TO SUPPRESS EMI LEAKAGE FROM ONE OR MORE OPTICAL PORTS OF AN OPTICAL COMMUNICATIONS MODULE

Номер: US20170059798A1
Автор: Priyadarshi Sunil, Ritter Robert, Seetharam Venkatesh, Yashar Frank
Принадлежит:

In one exemplary embodiment, an optical communications module includes an upper housing portion mated to a lower housing portion with an optical port projecting through an opening in a front surface of the mated assembly. Electronic circuit housed inside the mated assembly can lead to electromagnetic interference (EMI) leakage through a front surface of the mated assembly, especially through the opening that accommodates the optical port. An EMI shield, which is used to address the EMI leakage, includes an annular array of resilient metal fingers that press against a metal flange of the optical port, and also includes at least two peripheral edges each incorporating an array of resilient metal fingers that press against a metal portion of the mated assembly. An interdigital spacing in the annular array and/or the array of resilient metal fingers is defined on the basis of a wavelength associated with the EMI radiation. 1. An optical communications module comprising:an enclosure containing an electronic circuit assembly; andan electromagnetic interference (EMI) shield mounted inside the enclosure, the EMI shield comprising a first opening configured to accommodate a first optical port inserted therethrough, the first opening characterized by a first annular array of resilient metal fingers arranged to press against a metal portion of the first optical port for suppressing EMI emissions leaking from around a periphery of the first optical port, the EMI shield further including at least a first peripheral edge incorporating a linear array of resilient metal fingers arranged to press against a metal portion inside the enclosure.2. The optical communications module of claim 1 , wherein the EMI shield further comprises a second opening configured to accommodate a second optical port inserted therethrough claim 1 , the second opening characterized by a second annular array of resilient metal fingers arranged to press against a metal portion of the second optical port for ...

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Номер записи: 82
02-03-2017 дата публикации

EMI SHIELDING OF AN OPTICAL PORT IN AN OPTICAL COMMUNICATIONS MODULE

Номер: US20170059799A1
Автор: Gupta Sanjeev, McColloch Laurence
Принадлежит:

An optical communications module includes an upper housing portion mated to a lower housing portion, with one or more optical ports located inside the mated assembly. The one or more optical ports are accessible via respective openings in a front portion of the optical communications module. The lower housing portion accommodates an electronic circuit assembly that can lead to emission of electromagnetic interference (EMI) through the front portion of the optical communications module and particularly through the plastic walls of each optical port. Various exemplary embodiments of an electromagnetic interference (EMI) shield in accordance with the disclosure can be embedded inside the front plastic wall of each optical port in order to provide EMI shielding. 1. An optical communications module , comprising:a case; andan optical port located inside the case, the optical port having a metal lead frame operative as an electromagnetic interference (EMI) shield, the metal lead frame having a planar portion that is embedded in a plastic body of the optical port and is oriented orthogonal to an optical axis of the optical port for intercepting at least a portion of EMI emissions that are parallel to the optical axis, the planar portion having a plurality of holes formed therein, the plurality of openings including a central hole having a size that is selected to allow light propagation along the optical axis.2. The optical communications module of claim 1 , wherein the metal lead frame has a protrusion on at least one peripheral edge claim 1 , the protrusion extending out of the plastic body of the optical port.3. The optical communications module of claim 2 , wherein the protrusion constitutes a fractional portion of the at least one peripheral edge and wherein the fractional portion extends away at an angle from a major surface of the planar portion.4. The optical communications module of claim 3 , wherein the metal lead frame is a four-sided metal frame and each of the ...

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Номер записи: 83
21-02-2019 дата публикации

INTEGRATED FAN-OUT PACKAGE INCLUDING DIELECTRIC WAVEGUIDE

Номер: US20190058231A1
Автор: JOU Chewn-PU, Liao Wen-Shiang
Принадлежит: Taiwan Semiconductor Manufacturing Co., Ltd.

A semiconductor structure is disclosed that includes a dielectric waveguide, a first transmission electrode and a second transmission electrode, and a first receiver electrode and a second receiver electrode. The first transmission electrode and the second transmission electrode that are disposed over and below the dielectric waveguide, respectively, and the first transmission electrode and the second transmission electrode are symmetric with respect to the dielectric waveguide. The first receiver electrode and a second receiver electrode that are disposed over and below the dielectric waveguide, respectively, and the first receiver electrode and the second receiver electrode are symmetric with respect to the dielectric waveguide. The dielectric waveguide is configured to receive a transmission signal from a driver circuit through the first transmission electrode and to transmit the received transmission signal to a receiver circuit through the first receiver electrode. 1. A semiconductor structure , comprising:a dielectric waveguide;a first transmission electrode and a second transmission electrode that are disposed over and below the dielectric waveguide, respectively, the first transmission electrode and the second transmission electrode being symmetric with respect to the dielectric waveguide; anda first receiver electrode and a second receiver electrode that are disposed over and below the dielectric waveguide, respectively, the first receiver electrode and the second receiver electrode being symmetric with respect to the dielectric waveguide,wherein the dielectric waveguide is configured to receive a transmission signal from a driver circuit through the first transmission electrode and to transmit the received transmission signal to a receiver circuit through the first receiver electrode.2. The semiconductor structure of claim 1 , whereinthe first transmission electrode is coupled with the dielectric waveguide at a transition region,wherein, in the transition ...

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Номер записи: 84
20-02-2020 дата публикации

OPTICAL FIBER ALIGNMENT DEVICE

Номер: US20200057216A1
Автор: Blumenthal Daniel J., Klein Holger N., Novack Ari, Nuttall Nathan A.
Принадлежит:

A fiber alignment or “fiberposer” device enables the passive alignment of one or more optical fibers to a photonic integrated circuit (PIC) device using mating hard-stop features etched into the two devices. Accordingly, fiber grooves can be provide separate from the electrical and optical elements, and attached to the PIC with sub-micron accuracy. Fiberposers may also include a hermetic seal for a laser or other device on the PIC. All of these features significantly reduce the typical cost of an actively aligned optical device sealed in an hermetic package. 1. An optical assembly comprising:a fiber alignment device for mounting on a photonic integrated chip (PIC), which includes first alignment features, a component, and an optical waveguide with a waveguide core, the optical fiber alignment device comprising:a fiber-mounting section, including a groove for receiving a portion of an optical fiber, configured to align a fiber core of the optical fiber with the waveguide core of the optical waveguide;a PIC mounting section forming an end point of the groove, and including a cavity for receiving the component; andsecond alignment features for abutting the first alignment features.2. The assembly according to claim 1 , wherein the second alignment features comprise pillars configured for abutting hard stops on the PIC.3. The assembly according to claim 2 , wherein the second alignment features comprise an array of pillars configured to extend on each side of the component.4. The assembly according to claim 1 , further comprising a trough extending from an outer free end of the groove for collecting excess material used to bond the optical fiber in the groove.5. The assembly according to claim 1 , further comprising a ground connection in the cavity for grounding the component to the fiber alignment device.6. The assembly according to claim 1 , further comprising a hermetically sealable material surrounding an opening to the cavity for hermetically sealing the component ...

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Номер записи: 85
20-02-2020 дата публикации

LATCH MECHANISM FOR COMMUNICATION MODULE

Номер: US20200057217A1
Автор: Koutrokois Demetrios
Принадлежит:

Some embodiments include a latch mechanism and an optoelectronic module that includes the latch mechanism. The latch mechanism may include a driver, a follower, a pivot member, and a cam member. The driver may be configured to rotate relative to a housing of the optoelectronic module about an axis of rotation between a latched position and an unlatched position. The follower may be configured to be move when the driver rotates between the latched and unlatched position. The follower may include at least one electromagnetic interference (EMI) window that is configured to engage with at least one EMI protrusion positioned on the housing and thereby maintain contact with a cage of a host device. 1. An optoelectronic module , comprising:a housing;a driver coupled to the housing and configured to rotate relative to the housing about an axis of rotation;a follower that defines an opening;a pivot member operably coupled to the driver, wherein the driver is configured to rotate about a portion of the pivot member;a cam member operably coupled to the driver and configured to engage the follower from within the opening so as to urge the follower to slide relative to the housing as the driver is rotated between a latched position and an unlatched position; andat least one EMI window defined by a first dimension that is substantially parallel to a sliding direction of the follower, and by a second dimension that is orthogonal to the sliding direction of the follower.2. The optoelectronic module of claim 1 , wherein the first dimension is larger than the second dimension claim 1 , wherein the follower is configured to slide in the sliding direction relative to the housing without the at least one EMI window engaging at least one EMI protrusion.3. The optoelectronic module of claim 1 , wherein the cam member includes a head positioned on one side of a portion of the driver and a shaft that extends from the head through a second opening defined in the portion of the driver and ...

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Номер записи: 86
04-03-2021 дата публикации

WAVEGUIDE TUBE HAVING A NANO PLATING LAYER AND WAVEGUIDE TUBE ASSEMBLY INCLUDING THE SAME

Номер: US20210063660A1
Автор: Lee James Cheng
Принадлежит:

A waveguide tube includes a first waveguide block, a second waveguide block and a nano plating layer. The first waveguide block has a first combination surface. A middle of one side of the first combination surface is recessed inward to form a first waveguide recess. The second waveguide block is fastened with the first waveguide block. The second waveguide block has a second combination surface disposed corresponding to the first combination surface. A middle of one side of the second combination surface is recessed inward to form a second waveguide recess. The first combination surface and the second combination surface are attached with each other, so the first waveguide recess is combined with the second waveguide recess to form a waveguide space. The nano plating layer is plated on outer surfaces of the first waveguide block and the second waveguide block which are completed being assembled. 1. A waveguide tube , comprising:a first waveguide block having a first combination surface, a middle of one side of the first combination surface being recessed inward to form a first waveguide recess penetrating through two end surfaces of the first waveguide block;a second waveguide block fastened with the first waveguide block, the second waveguide block having a second combination surface disposed corresponding to the first combination surface, a middle of one side of the second combination surface being recessed inward and opposite to the first waveguide recess to form a second waveguide recess penetrating through two end surfaces of the second waveguide block, the second waveguide recess being disposed corresponding to the first waveguide recess, the first combination surface of the first waveguide block and the second combination surface of the second waveguide block being attached with each other, so the first waveguide recess being combined with the second waveguide recess to form a waveguide space between the first waveguide block and the second waveguide block; ...

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Номер записи: 87
03-03-2016 дата публикации

PLUGGABLE CONNECTOR CONFIGURED TO TRANSFER THERMAL ENERGY AWAY FROM INTERNAL ELECTRONICS OF THE PLUGGABLE CONNECTOR

Номер: US20160064873A1
Автор: Bucher Alan Weir, Miller Richard Dean
Принадлежит:

Pluggable connector including a connector housing having a leading end configured to mate with a receptacle assembly. The connector housing has an interior cavity. The pluggable connector also includes a communication assembly held by the connector housing. The communication assembly includes internal electronics located within the interior cavity, and a mating terminal located proximate to the leading end. The mating terminal is communicatively coupled to the internal electronics. The pluggable connector also includes a thermal-transfer assembly that is disposed within the interior cavity. The thermal-transfer assembly includes first and second thermal-transfer modules that each include a plurality of spaced-apart projections. The corresponding projections of the first and second thermal-transfer modules are interleaved with one another. The first thermal-transfer module is coupled to the internal electronics, and the second thermal-transfer module is coupled to the connector housing. 1. A pluggable connector comprising:a connector housing having a leading end that is configured to mate with a receptacle assembly, the connector housing having an interior cavity;a communication assembly held by the connector housing, the communication assembly including internal electronics located within the interior cavity and a mating terminal located proximate to the leading end, the mating terminal being communicatively coupled to the internal electronics; anda thermal-transfer assembly disposed within the interior cavity, the thermal-transfer assembly including first and second thermal-transfer modules that each include a plurality of spaced-apart projections, wherein the corresponding projections of the first and second thermal-transfer modules are interleaved with one another, the first thermal-transfer module being coupled to the internal electronics and the second thermal-transfer module being coupled to the connector housing such that the first and second thermal-transfer ...

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Номер записи: 88
22-05-2014 дата публикации

Small Form-Factor Pluggable Optical Transceiver

Номер: US20140140666A1
Автор: HEIMBUCH Mark, WAINWRIGHT Wayne
Принадлежит:

A small form-factor pluggable (SFP) optical transceiver includes a casing configured to accommodate optical and electrical devices. During normal operation, the casing is connected to a switchboard via a connector in the switchboard, and the optical devices are outside the switchboard, thereby exposing optical devices sensitive to high temperature to the outside air, reducing the operational temperature of the optical device portion relative to the heated portion inside the switchboard. Thus, the present SFP optical transceiver advantageously improves operational performance and extends the life of the device. Also, the present SFP optical transceiver having the optical device portion outside the switchboard advantageously improves the cooling performance for the optical device portion. 1. A small form-factor pluggable optical transceiver , comprising:a switchboard having a connector; anda casing connected to said switchboard via said connector, said casing configured to accommodate optical devices and electrical devices, wherein said optical devices are positioned outside said switchboard during normal operation.2. The transceiver of claim 1 , wherein said casing comprises an internal thermal isolator.3. The transceiver of claim 1 , wherein said internal thermal isolator is configured to divide the casing into a first cavity that contains said optical devices and a second cavity that contains said electrical devices.4. The transceiver of claim 3 , wherein said second cavity is positioned inside the switchboard.5. The transceiver of claim 2 , wherein the internal thermal isolator has an electrical feed therein to electrically connect one side of said internal thermal isolator close to said first cavity with another side of said internal thermal isolator close to said second cavity.6. The transceiver of claim 2 , wherein said internal thermal insulator comprises a ceramic material.7. The transceiver of claim 1 , wherein said casing comprises a cover and a base close ...

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Номер записи: 89
01-03-2018 дата публикации

Optical Communication Module

Номер: US20180062747A1
Автор: Gupta Atul, Tlalka Marek
Принадлежит:

An optic module for use with a host is disclosed that includes a port configured to accept an optical connector connected to fiber optic cables which carry optic signals. A receiver module is configured to receive an incoming optic signal and convert the received optic signal to a received electrical signal while a transimpedance amplifier amplifies the received electrical signal. An electrical interface is configured to electrically interface the optic module with the host thereby providing the amplified received electrical signal to a digital signal processor in the host. On the transmit side, an optic device driver receives an outgoing electrical signal from the host, after processing by a digital signal processor in the host, for amplification while a transmit module is configured to convert the outgoing electrical signal to an outgoing optic signal and transmit the outgoing optic signal on an optic fiber. 1. An optic module and host configured for data communication comprising: a housing having an interior space;', 'a port configured receive an optical connector, the optical connector attached to a fiber optic cable which carries an optic signal;', 'a receiver optic unit configured to receive and convert the optic signal to a receiver signal;', 'a transimpedance amplifier configured to amplify the receiver signal to create an amplified signal and provide an incoming signal to the host;', 'a driver configured to receive and amplify an outgoing electrical signal to be transmitted as an electrical signal, the outgoing electrical signal received from the host;', 'a transmitter optic unit configured to receive and convert the amplifier version of the outgoing electrical signal from the driver to an optic signal, the optic signal transmitted from the transmitter optic unit;, 'An optic module comprising;'} a port having an electrical interface, the port configured to receive the optic module and establish an electrical connection to the optic module;', receive and ...

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Номер записи: 90
20-02-2020 дата публикации

METHOD OF OPERATING AN OPTOELECTRONIC COMPONENT AND OPTOELECTRONIC COMPONENT

Номер: US20200060004A1
Автор: Baumheinrich Thorsten, Grötsch Stefan
Принадлежит:

A method of operating an optoelectronic component, including a plurality of picture elements and a plurality of temperature sensors, wherein the picture elements are each configured to emit light, and the temperature sensors thermally conductively connect to the picture elements, the method including acquiring temperature values supplied by the temperature sensors; and controlling the picture elements in dependence on the acquired temperature values. 125-. (canceled)26. A method of operating an optoelectronic component , comprising a plurality of picture elements and a plurality of temperature sensors , wherein the picture elements are each configured to emit light , and the temperature sensors thermally conductively connect to the picture elements , the method comprising:acquiring temperature values supplied by the temperature sensors; andcontrolling the picture elements in dependence on the acquired temperature values.27. The method according to claim 26 , further comprising interpolating the acquired temperature values to obtain further temperature values.28. The method according to claim 26 , wherein a supply voltage or a supply current strength is changed in dependence on the acquired temperature values in at least one picture element.29. The method according to claim 28 , wherein the supply voltage or the supply current is changed so that a wavelength claim 28 , intensity claim 28 , light color claim 28 , and/or color temperature of the light emitted by the picture element approximates a target value.30. The method according to claim 28 , wherein the supply voltage or the supply current is changed so that a temperature of the picture element decreases.31. The method according to claim 26 , further comprising logging the acquired temperature values.32. The method according to claim 31 , further comprising computing a thermal stress incurred over the previous operating life for each picture element from the logged temperature values.33. The method according to ...

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Номер записи: 91
04-03-2021 дата публикации

Pluggable module having emi prevention fins in airflow channel

Номер: US20210066859A1
Автор: Alex Michael Sharf, Eric David Briant, Jacob RITA, Michael John Phillips, Richard James Long
Принадлежит: TE Connectivity Corp

A pluggable module includes a pluggable body having an upper shell at the top and a lower shell at the bottom that define an interior chamber. The upper shell includes side walls extending to the top and an upper wall extending between the side walls. The upper shell includes an airflow channel and EMI prevention fins having EMI channels therebetween in flow communication with the airflow channel. The upper wall along the airflow channel is at a first depth from the top and the upper wall along the EMI channels is at a second depth deeper than the first depth.

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Номер записи: 92
17-03-2022 дата публикации

PLUGGABLE OPTICAL MODULE AND OPTICAL COMMUNICATION SYSTEM

Номер: US20220082766A1
Автор: MINOTA Yuuji
Принадлежит:

An object is, in a pluggable optical module, to compactly house an optical fiber used for connecting optical components in a housing in which a plurality of optical components are mounted. The pluggable optical module () includes: a plurality of optical components, a printed circuit board (); one or more optical fibers; and optical fiber housing means (). All or a part of the plurality of optical components are mounted on the printed circuit hoard (). One or more optical fibers connect between the plurality of optical components. The optical fiber housing means () includes a guide that is disposed on a plate-like member and can wind the one or more optical fibers, and mounted to he stacked with the printed circuit board () on which the optical components are mounted and all or a part of optical components other than the optical components mounted on the printed circuit board (). 126-. (canceled)27. A pluggable optical module comprising:a pluggable electric connector configured to connect with an optical communication apparatus;a pluggable optical receptor configured to connect with an outer optical fiber transmitting a first optical signal;an optical output module configured to output a second optical signal and a local oscillation light;an optical receiver configured to receive the first optical signal by interfering with the local oscillation light;a printed circuit board configured to connect with the optical receiver;a first optical fiber configured to transmit the first optical signal;a second optical fiber configured to transmit the local oscillation light;a third optical fiber configured to transmit the second optical signal; andan optical fiber housing material configured to house the first optical fiber, the second optical fiber and the third optical fiber,wherein the optical fiber housing material is located between a part of a bottom surface of the printed circuit board and a part of a top surface of the optical output module.28. The pluggable optical ...

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Номер записи: 93
28-02-2019 дата публикации

Optical connector, electronic apparatus and optical interconnection system

Номер: US20190064458A1
Автор: Eiji Otani, Hiizu Ootorii, Shuichi Oka
Принадлежит: Sony Corp

An optical connector includes a core block, a flexible wiring board, an optical device array, a drive circuit, and a housing. The core block has a plurality of faces. The flexible wiring board has an external connection terminal, a first area arranged on a first face of the core block, and a second area arranged on a second face of the core block. The optical device array is mounted on the first area of the flexible wiring board and includes at least one group of a a plurality of optical devices for transmission and a plurality of optical devices for reception arranged. The drive circuit is mounted on the second area of the flexible wiring board and drives the optical device array. The housing stores the core block, the optical device array, and the drive circuit such that the external connection terminal of the flexible wiring board is arranged outside the housing.

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Номер записи: 94
29-05-2014 дата публикации

MULTI-CHANNEL OPTICAL MODULE AND MANUFACTURING METHOD OF THE SAME

Номер: US20140147085A1
Автор: Lim Kwon-Seob
Принадлежит: Electronics and Telecommunications Research Institute

Provided is a multi-channel optical module and a manufacturing method of the same. The optical module includes a base block having a cavity on one edge(?) of the base block; a substrate arranged on the other side of the base block that faces the cavity; an integrated circuit (IC) chip mounted on the substrate; a platform arranged in the cavity; electrical contacts connected to the IC chip, wherein the electrical contacts are formed on the platform; an optical device array block arranged in the platform, wherein the optical device array block is connected to the electrical contacts; a plurality of optical fiber cores aligned with the optical device array block; and an optical fiber array block fixing the plurality of optical fiber cores, wherein the optical fiber array block is bonded to the platform and to the optical device array block and is fixed in the cavity. 1. A multi-channel optical module comprising:a base block having a cavity on one edge of thereof;a substrate arranged on the other side of the base block that faces the cavity;at least one integrated circuit (IC) chip mounted on the substrate;a platform arranged in the cavity;electrical contacts connected to the IC chip and formed on the platform;at least one optical device array block arranged in the platform and connected to the electrical contacts of the platform;a plurality of optical fiber cores aligned with the optical device array block; andan optical fiber array block fixing the plurality of optical fiber cores, wherein the optical fiber array block is bonded to the platform and to the optical device array block and is fixed in the cavity of the base block.2. The multi-channel optical module of claim 1 , wherein the platform comprises:a bottom being in contact with a sidewall of the cavity of the base block;a top being in contact with a the optical fiber array block;a first slope between the top and the bottom to minimize a height and the length of bonding wires between bonding pads of the IC chip ...

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Номер записи: 95
27-02-2020 дата публикации

CABLE DEVICE

Номер: US20200064559A1
Автор: KIM Jin Sub, Kim Sun Woo, KO Baek Seok, PARK Dong Jin
Принадлежит: SAMSUNG ELECTRONICS CO., LTD.

Provided is a cable device including an optical cable capable of power transmission and a connector coupled with the optical cable, and having improved electromagnetic shielding performance. The cable device includes a cable; and a connector coupled to the cable, wherein the connector includes a printed circuit board (PCB) including a ground electrode, a shield case provided to accommodate the PCB and include a first face facing a mounting surface of the PCB and a second face perpendicular to the first face, and an elastic member arranged between the PCB and the shield case and provided to contact the ground electrode and the second face of the shield case so as to ground the shield case. 1. A cable device comprising:a cable; anda connector coupled to the cable, a printed circuit board (PCB) including a ground electrode,', 'a shield case in which the PCB is accommodated, and including a first face facing a mounting surface of the PCB and a second face perpendicular to the mounting surface of the PCB, and', 'an elastic member, accommodated in the shield case, contacting the ground electrode and the second face of the shield case so as to ground the shield case., 'wherein the connector comprises2. The cable device of claim 1 , wherein the cable comprises a conductor provided to transmit power and an optic fiber provided to transmit an optical signal.3. The cable device of claim 1 , wherein the elastic member and the shield case include conductive materials to be electrically connected to each other by contact.4. The cable device of claim 2 , wherein the cable comprises a coating accommodating the conductor and the optic fiber claim 2 , and being transparent to light.5. The cable device of claim 1 , wherein the elastic member is deformable so that the elastic member is compressively deformed when accommodated in the shield case.6. The cable device of claim 1 , wherein at least a portion of the elastic member protrudes outward from the mounting surface of the PCB to ...

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Номер записи: 96
27-02-2020 дата публикации

Laser device

Номер: US20200064566A1
Автор: Koji Tojo, Naoya Ishigaki
Принадлежит: Shimadzu Corp

A laser device includes: a plurality of collimating lenses collimate light emitted from the plurality of light sources; a plurality of holders each hold a pair of light sources and the collimating lens and which adjust emission positions and emission angles of the collimated light of the collimating lenses; a housing which holds the plurality of holders; a light condensing part which condenses each of the collimated light whose emission position and emission angle are adjusted; a heat exhausting member which exhausts heat generated from the plurality of light sources; and a heat transfer member which is disposed between the heat exhausting surfaces of the light sources and a heat absorbing surface of the heat exhausting member, includes an elastic part abutting against the heat exhausting surfaces and the heat absorbing surface, has heat conductivity, and transfers the heat from the heat exhausting surfaces to the heat absorbing surface.

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Номер записи: 97
17-03-2022 дата публикации

Electronic device package and method for manufacturing the same

Номер: US20220084972A1
Автор: Chang-Yu Lin, Chi-Han Chen, Chih-Pin Hung, JR-Wei LIN, Mei-Ju Lu
Принадлежит: Advanced Semiconductor Engineering Inc

An electronic device package includes a circuit layer, a first semiconductor die, a second semiconductor die, a plurality of first conductive structures and a second conductive structure. The first semiconductor die is disposed on the circuit layer. The second semiconductor die is disposed on the first semiconductor die, and has an active surface toward the circuit layer. The first conductive structures are disposed between a first region of the second semiconductor die and the first semiconductor die, and electrically connecting the first semiconductor die to the second semiconductor die. The second conductive structure is disposed between a second region of the second semiconductor die and the circuit layer, and electrically connecting the circuit layer to the second semiconductor die.

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Номер записи: 98
09-03-2017 дата публикации

TECHNIQUES FOR FORMING WAVEGUIDES FOR USE IN LASER SYSTEMS OR OTHER SYSTEMS AND ASSOCIATED DEVICES

Номер: US20170068058A1
Автор: Mohageg Makan, Zamudio Roy
Принадлежит:

A method includes forming a coating that covers at least part of a conduction substrate, where the conduction substrate is configured to transport thermal energy. The method also includes forming at least part of an optical waveguide on the coating. The optical waveguide includes multiple cladding layers and a core, and the optical waveguide is configured to transport optical signals. The conduction substrate, the coating, and the optical waveguide form an integrated monolithic waveguide structure. 1. A method comprising:forming a coating that covers at least part of a conduction substrate, the conduction substrate configured to transport thermal energy; andforming at least part of an optical waveguide on the coating, the optical waveguide comprising multiple cladding layers and a core, the optical waveguide configured to transport optical signals;wherein the conduction substrate, the coating, and the optical waveguide form an integrated monolithic waveguide structure.2. The method of claim 1 , wherein:the conduction substrate comprises a first conduction substrate;the coating comprises a first coating;the at least part of the optical waveguide comprises a first part of the optical waveguide; forming a second coating that covers at least part of a second conduction substrate, the second conduction substrate configured to transport thermal energy;', 'forming a second part of the optical waveguide on the second coating; and', 'attaching the first and second parts of the optical waveguide; and, 'the method further comprisesthe conduction substrates, the coatings, and the optical waveguide form the integrated monolithic waveguide structure.3. The method of claim 2 , wherein:the first part of the optical waveguide comprises a first of the cladding layers and the core;the second part of the optical waveguide comprises a second of the cladding layers; andattaching the first and second parts of the optical waveguide comprises attaching the second cladding layer to the core. ...

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Номер записи: 99
09-03-2017 дата публикации

OPTICAL COMPONENT

Номер: US20170068059A1
Автор: HUANG YongLiang, MU Hongwei, Wang Hao, ZHANG Shun
Принадлежит:

An optical component includes: a first substrate, a second substrate, and a transfer board. A first electrically conductive path is disposed on a top surface of the first substrate. A second electrically conductive path is disposed on a bottom surface of the first substrate. A third electrically conductive path is disposed on a top surface of the second substrate. A microstrip line structure is disposed on the transfer board. The microstrip line structure includes a transfer line disposed on a top surface of the transfer board. The top surface of the second substrate is opposite to the bottom surface of the first substrate, where the second electrically conductive path fits the third electrically conductive path. The transfer board is disposed on the top of the top surface of the second substrate. One end of the transfer line is electrically connected to the first electrically conductive path by a wire bonding. 1. An optical component , comprising:a first substrate, a second substrate, and a transfer board;a first electrically conductive path is disposed on a top surface of the first substrate, and a second electrically conductive path is disposed on a bottom surface of the first substrate;a third electrically conductive path is disposed on a top surface of the second substrate;a microstrip line structure is disposed on the transfer board, wherein the microstrip line structure comprises a transfer line disposed on a top surface of the transfer board;the top surface of the second substrate is opposite to the bottom surface of the first substrate, wherein the second electrically conductive path fits the third electrically conductive path, and the transfer board is disposed on the top of the top surface of the second substrate; andone end of the transfer line is electrically connected to the first electrically conductive path by a wire bonding.2. The optical component according to claim 1 , wherein the first substrate comprises a first microstrip line structure claim 1 ...

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Номер записи: 100