Method for producing a stamp for hot embossing

The present invention provides a process for producing a stamp for hot embossing (HE). The stamp can be constructed from any photo-resist epoxy that is stable at temperatures equal to the glass transition temperature (T g ) of the material to be stamped. The stamp can be used repeatedly without significant distortion of features. The stamp benefits from low relative cost, high fidelity of features in all three-dimensions and fast construction. The process for producing a stamp for hot embossing from a resist, comprising the steps of producing a seed layer L 1 from a selected photoresist polymer material, soft baking the seed layer L 1 , exposing said seed layer L 1 to initiate cross-linking and then post-exposure bake L 1 to fully cross-link it, coating the cross-linked seed layer L 1 with a second photoresist polymer layer L 2 ; soft baking the second photoresist polymer layer L 2 ; applying a mask to the top surface of the soft baked layer L 2 and illuminating the unmasked portions of the soft baked layer L 2 with UV radiation through the mask, wherein the exposed areas form the pattern of the embossing features, washing away un-exposed regions of the photoresist with a developer to leave behind a relief pattern formed in the second photoresist polymer layer L 2 , which relief pattern corresponds to a pattern in the mask.

Carbon molds for use in the fabrication of bulk metallic glass parts and molds

Novel molds and methods for Bulk Metallic Glass (BMG) molding using carbon templates obtained from pyrolyzed materials are provided. The method employs the Carbon MEMS (C-MEMS) technique to derive molds of different geometries and dimensions. The resultant carbon structures are stable at very high temperatures and have sufficient mechanical strength to be used as master molds for the thermoplastic forming of BMGs.

Methods of fabricating nanoimprint stamp

A method of fabricating a nanoimprint stamp includes forming a resist pattern having a nano size width on a stamp substrate by performing imprint processes repeatedly. In the imprint processes, resist layers that are selectively etched are sequentially used. The stamp substrate is etched using the resist pattern as an etch mask.

Nanoimprinting mold and method for producing the nanoimprinting mold

A nanoimprinting mold having high durability enables reduction of thickness fluctuations in resist. The mold is equipped with a patterned base plate having a patterned region, in which a fine pattern of protrusions and recesses is formed, on a first surface thereof, and a second surface having a 3σ value related to a height difference distribution within a range from 1 nm to 6 nm; a hollowed base plate having a hollowed shape at least at a portion corresponding to the patterned region and a thickness greater than or equal to that of the patterned base plate; and a metal film formed between the patterned base plate and the hollowed base plate so as to bond the second surface of the patterned base plate and a surface of the hollowed base plate that faces the second surface.

Method for manufacturing mold

According to one embodiment, a method is disclosed for manufacturing a mold. The method can include forming a second major surface receded from a first major surface by irradiating a portion of the first major surface with a charged beam to etch a base material having the first major surface. The method can include forming a mask pattern on the first major surface and the second major surface. In addition, the method can include forming a first pattern on the first major surface and a second pattern on the second major surface by etching the base material through the mask pattern.

METHOD FOR PRODUCING ETCHABLE STRUCTURES USING A LASER HAVING A WAVELENGTH IN THE INFRARED RANGE

The invention relates to a method for producing etch-resistant structures (masks) on the surfaces of metallic pressing tools, specifically continuous press bands or press plates, by means of a laser, wherein a surface of the press tool to be structured is provided with a thermally sensitive, etch-resistant coating and the laser burns structures out of the etch-resistant coating. In order to prevent negative influences when lasering on the surface of the press plate, the invention proposes that the structure is burned with a laser that emits light having a wavelength in the infrared range between 780 nm and 1 mm.

METHOD FOR MANUFACTURING MICROFLUIDIC DEVICE AND ASSOCIATED STRUCTURE

A method for manufacturing a microfluidic device includes following steps. A mold made of a glass material is provided. The mold has at least one hollow mold cavity and at least one blocking wall around the hollow mold cavity. The mold is disposed on a silicon substrate, which includes a formation surface corresponding to the hollow mold cavity and a microfluidic male mold protruding from the formation surface. Polydimethylsiloxane (PDMS) is poured into the hollow mold cavity and baked to harden the PDMS to form the microfluidic device. The microfluidic device has a microfluidic structure corresponding to the microfluidic male mold, and a height of a sidewall of the microfluidic device is between 3 mm and 30 mm. With the glass material of the mold, the microfluidic device having a sidewall height greater than 3 mm can be manufactured, preventing an insufficient suction force of a negative pressure. 1. A method for manufacturing a microfluidic device , comprising:{'b': '1', 'S: providing a mold made of a glass material, the mold having at least one hollow mold cavity and at least one blocking wall around the hollow mold cavity, the blocking wall having a height greater than or equal to 3 mm;'}{'b': '2', 'S: disposing the mold on a silicon substrate, the silicon substrate comprising a formation surface corresponding to the hollow mold cavity and a microfluidic male mold protruding from the formation surface;'}{'b': '3', 'S: pouring unhardened polydimethylsiloxane (PDMS) into the hollow mold cavity, and performing baking to harden the PDMS to form the microfluidic device; and'}{'b': '4', 'S: removing the microfluidic device from the hollow mold cavity and the silicon substrate, the microfluidic device comprising a microfluidic structure corresponding to the microfluidic male mold, and a height of a sidewall of the microfluidic structure being between 3 mm and 30 mm.'}2. The method for manufacturing a microfluidic device of claim 1 , wherein a process for manufacturing ...

MANUFACTURE METHOD OF NANO-IMPRINT LITHOGRAPHY TEMPLATE AND NANO-IMPRINT LITHOGRAPHY TEMPLATE

The present invention provides a manufacture method of a nano-imprint lithography template and a nano-imprint lithography template. In the manufacture method of the nano-imprint lithography template, first, the soft membrane having a nanowire gate structure is wrapped on the outer circumferential surface of the cylindric hard roller to form the nanowire gate structure film layer to obtain the temporary roller. Then, the low melting point solder alloy is utilized to form the structure hardened layer on the outer circumferential surface of the temporary roller along the nanowire gate structure of the nanowire gate structure film layer to obtain the nano-imprint lithography template having the nanowire gate structure. By forming the hard structure hardened layer on the soft nanowire gate structure for hardening the soft nanowire gate structure, the issue that the hardness of the micro structure material itself in the imprint procedure is not enough is overcame. 1. A manufacture method of a nano-imprint lithography template , comprising steps of:step 1, providing a cylindric hard roller;step 2, providing a membrane having a nanowire gate structure, and wrapping the membrane on an outer circumferential surface of the hard roller to form a nanowire gate structure film layer to obtain a temporary roller;step 3, providing low melting point solder alloy, and heating the low melting point solder alloy to a liquid state, and immersing the temporary roller obtained in the step 2 in the low melting point solder alloy liquid, or coating one layer of the low melting point solder alloy liquid on the temporary roller which is heated, and after cooling, one structure hardened layer is formed on an outer circumferential surface of the temporary roller along the nanowire gate structure of the nanowire gate structure film layer to obtain the nano-imprint lithography template having the nanowire gate structure.2. The manufacture method of the nano-imprint lithography template according ...

STAMPS INCLUDING A SELF-ASSEMBLED BLOCK COPOLYMER MATERIAL, AND RELATED METHODS

Methods for fabricating stamps and systems for patterning a substrate, and devices resulting from those methods are provided. 1. A stamp , comprising: an unpatterned, neutral wetting floor;', 'opposing preferential wetting ends; and', 'opposing parallel preferential wetting sidewalls, a fixed width separating the opposing parallel preferential wetting sidewalls; and, 'a trench in a material overlying a structure and comprising{'sub': 'o', 'claim-text': a first polymer block having affinity for and swellable by absorption of an ink material selected from the group consisting of a mercaptoalcohol, an acetylenic having a hydrocarbon tail group, and an acetylenic having at least one of an alcohol functional group, a thiol functional group, an amine functional group, and a halide functional group; and', 'a second polymer block having substantially no affinity for and not swellable by the ink material., 'a self-assembled block copolymer material filling the trench and having an inherent pitch value (L) equal to a depth of the trench, the self-assembled block copolymer material comprising2. The stamp of claim 1 , further comprising the ink material within the first polymer block but not within the second polymer block.3. The stamp of claim 1 , wherein a first polymer block of the self-assembled block copolymer material is formulated to substantially absorb the ink material.4. A method of forming a stamp claim 1 , comprising:forming a trench in a material overlying a structure, the trench comprising opposing preferential wetting ends, and opposing parallel preferential wetting sidewalls separated from one another by a fixed width;{'sub': 'o', 'filling the trench with a block copolymer material having an inherent pitch value (L) equal to a depth of the trench and comprising a first polymer block having chemical affinity for and swellable by an ink material and a second polymer block having substantially no affinity for and not swellable by the ink material;'}annealing the ...

METHOD OF REPAIRING DEFECT AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

According to one embodiment, in a method of repairing a defect on a template substrate for imprint lithography using a charged particle beam, a drift correction mark to correct drift of the charged particle beam is formed on the template substrate. The defect on the template substrate is repaired while correcting the drift of the charged particle beam with reference to the drift correction mark. The drift correction mark is removed. 1. A method of repairing a defect on a template substrate for imprint lithography using a charged particle beam , the method comprising:forming a drift correction mark on the template substrate to correct drift of the charged particle beam;repairing the defect on the template substrate while correcting the drift of the charged particle beam with reference to the drift correction mark; andremoving the drift correction mark.2. The method of repairing the defect according to claim 1 , whereinthe drift correction mark is removed using etchant capable of selectively etching the drift correction mark against the template substrate.3. The method of repairing the defect according to claim 1 , whereinthe drift correction mark is removed by supplying etchant to a whole surface of the template substrate, the defect being on the surface of the template substrate.4. The method of repairing the defect according to claim 1 , whereinthe drift correction mark is formed by chemical vapor deposition method.5. The method of repairing the defect according to claim 1 , whereinthe drift correction mark includes at least one element selected from a group including molybdenum (Mo), chromium (Cr), nickel (Ni), iron (Fe), tungsten (W), vanadium (V), manganese (Mn), aluminum (Al) and zinc (Zn).6. The method of repairing the defect according to claim 1 , whereina size of the drift correction mark is larger than a width of a line pattern provided on the template substrate.7. A method of manufacturing a semiconductor device claim 1 , comprising:transferring a template ...

Method for embossing micro-structures and/or nano-structures

A method and apparatus for embossing micro-structures and/or nano-structures. The method includes the steps of providing a structured embossing roll having end faces; coupling a crosslinking radiation into the structured embossing roll which is transparent for the crosslinking radiation, wherein the embossing roll functions as a light guide for the coupled in crosslinking radiation; providing a carrier having an embossing compound applied thereto; contacting the embossing roll with the embossing compound; coupling the crosslinking radiation out of the embossing roll; and curing the embossing compound which has been acted upon by the coupled out crosslinking radiation via the embossing roll.

MANUFACTURE METHOD OF NANO-IMPRINT LITHOGRAPHY TEMPLATE AND NANO-IMPRINT LITHOGRAPHY TEMPLATE

The present invention provides a manufacture method of a nano-imprint lithography template and a nano-imprint lithography template. In the manufacture method of the nano-imprint lithography template, first, the soft membrane having a nanowire gate structure is wrapped on the outer circumferential surface of the cylindric hard roller to form the nanowire gate structure film layer to obtain the temporary roller. Then, the low melting point solder alloy is utilized to form the structure hardened layer on the outer circumferential surface of the temporary roller along the nanowire gate structure of the nanowire gate structure film layer to obtain the nano-imprint lithography template having the nanowire gate structure. By forming the hard structure hardened layer on the soft nanowire gate structure for hardening the soft nanowire gate structure, the issue that the hardness of the micro structure material itself in the imprint procedure is not enough is overcame. 1. A manufacture method of a nano-imprint lithography template , comprising steps of:{'b': '1', 'step , providing a cylindric hard roller;'}{'b': '2', 'step , providing a membrane having a nanowire gate structure, and wrapping the membrane on an outer circumferential surface of the hard roller to form a nanowire gate structure film layer to obtain a temporary roller;'}{'b': 3', '2, 'step , providing low melting point solder alloy, and heating the low melting point solder alloy to a liquid state, and immersing the temporary roller obtained in the step in the low melting point solder alloy liquid, or coating one layer of the low melting point solder alloy liquid on the temporary roller which is heated, and after cooling, one structure hardened layer is formed on an outer circumferential surface of the temporary roller along the nanowire gate structure of the nanowire gate structure film layer to obtain the nano-imprint lithography template having the nanowire gate structure.'}23. The manufacture method of the nano ...

Imprinting method

An imprinting method, which includes following steps. A workpiece is conveyed to a working region by a first conveyer unit. The workpiece is imprinted in the working region through an imprinting segment of a flexible imprinting mold film. The flexible imprinting mold film is driven by a driving roller set, such that at least another one of the imprinting segments of the flexible imprinting mold film rolled around the driving roller set is expanded from the driving roller set and moved to the working region.

POLYCARBONATE HEAT MOLDING FOR SOFT LITHOGRAPHY

A method of replicating master molds used in the fabrication of microsystems having micron to millimeter sized features. Master molds are replicating using a polymer sheet, which is heated and melted onto an elastomeric mold fabricated from the master mold. The copy molds accurately replicate the geometries of the master mold, such as high aspect ratio features, microposts, and channels with slender sidewalls. The polymer sheet encases the elastomeric mold without the application of an external force, permitting copying without deformation of the features. 1. A method of replicating a master mold of a microsystem having a plurality of features , the method comprising:forming a replica mold from the master mold, wherein the replica mold comprises an elastomer and has the features of the master mold;placing a solid sheet of a polymer on the surface of the replica mold;heating the sheet and the replica mold to a temperature above the glass transition temperature of the polymer;maintaining the temperature for a period of time sufficient to allow the polymer to disperse into the features of the replica mold;cooling the polymer below the glass transition temperature, forming a solid polymer; andremoving the replica mold from the polymer, wherein the solidified polymer forms a copy mold and has the shape of the master mold.2. The method of claim 1 , wherein the polymer is polycarbonate.3. The method of claim 1 , wherein the elastomer is polydimethylsiloxane.4. The method of claim 1 , wherein the polymer is a thermoplastic.5. The method of claim 1 , further comprising:molding the microsystem using the copy mold.6. The method of claim 1 , further comprising:drying the polymer sheet prior to heating.7. The method of claim 1 , wherein drying the polymer sheet occurs at a temperature less than the glass transition temperature of the polymer.8. The method of claim 1 , wherein the temperature is less than a thermal degradation temperature of the replica mold.9. The method of ...

DIFFRACTIVE SECURITY DEVICE AND METHOD OF MANUFACTURE THEREOF

A diffractive security device is disclosed including at least a first diffractive structure defined in a carrier layer. The first diffractive structure is an on-axis diffractive zone plate structure of a continuously curved surface configured such that when the device is illuminated by on-axis light a first diffraction pattern generated by the first diffractive structure can be viewed from at least a first side of the device at substantially all viewing angles, the first diffraction pattern exhibiting a reference point or reference line relative to which other features of the first diffraction pattern appear to move when the viewing angle is changed. 1. A diffractive security device comprising at least a first diffractive structure defined in a carrier layer ,the first diffractive structure being an on-axis diffractive zone plate structure of a continuously curved surface configured such that when the device is illuminated by on-axis light a first diffraction pattern generated by the first diffractive structure can be viewed from at least a first side of the device at substantially all viewing angles, the first diffraction pattern exhibiting a reference point or reference line relative to which other features of the first diffraction pattern appear to move when the viewing angle is changed;wherein the device has an array of first regions in the form of indicia in each of which a part of the first diffractive structure is present, the first regions being spaced by one or more non-diffractive regions of the device, wherein each of the first regions exhibits a portion of the first diffraction pattern;such that upon changing the viewing angle in a continuous sense, features of the first diffraction pattern appear to move from one first region to the next so as to highlight and/or reveal different indicia of the array.2. A diffractive security device according to claim 1 , wherein the first diffractive structure is a diffractive zone plate structure of a dome claim 1 , a ...

METHOD FOR MANUFACTURING A HOROLOGY COMPONENT

Method for manufacturing a horology component, including manufacturing (E) a first structure () from a first photosensitive resin () having at least one layer of photosensitive resin having a first pattern obtained by polymerizing the first photosensitive resin by irradiation through at least one mask (), then developing the first photosensitive resin; and transforming (E) the first structure () into a second structure () by structuring at least one surface of the first structure by the addition of a second photosensitive resin () to the at least one surface, the second structure () being intended to at least partially form a manufacturing mold for the horology component. 1. A method for manufacturing a horology component , wherein the method comprises:manufacturing a first structure from a first photosensitive resin comprising at least one layer of photosensitive resin comprising a first pattern obtained by polymerizing the first photosensitive resin by irradiation through at least one mask, then developing said first photosensitive resin; andtransforming the first structure into a second structure by structuring at least one surface of the first structure by the addition of a second photosensitive resin to the at least one surface, the second structure being intended to at least partially form a manufacturing mold for the horology component, (i) applying a layer of the second photosensitive resin on at least part of the at least one surface of the first structure;', '(ii) performing two-photon polymerization on the second photosensitive resin in order to obtain three-dimensional polymerization according to a second pattern, using a photon device which comprises an objective which is at least partially immersed in the second resin to direct and focus a beam on voxels that define a shape or a geometry of the second pattern; and', '(ii) developing in order to eliminate the non-polymerized second photosensitive resin and obtain the second structure of a form defined ...

Method for manufacturing a horology component

Method for manufacturing a master pattern for a mold for a horology component, wherein the method includes manufacturing a first structure from a first photosensitive resin comprising at least one layer of photosensitive resin comprising a first pattern obtained by polymerizing the first photosensitive resin by irradiation through at least one mask, then developing the first photosensitive resin; and transforming the first structure into a second structure by structuring at least one surface of the first structure by the addition of a second photosensitive resin to the at least one surface.

METHOD FOR MAKING AN EPOXY RESIN MOLD FROM A LITHOGRAPHY PATTERNED MICROSTRUCTURE MASTER

A method for pattern transfer to a silicone-based microstructure device comprises the steps of molding a silicone-based negative replica from a lithography patterned master mold. An epoxy resin-based master mold is molded from the silicone-based replica. A surface of the epoxy resin-based master mold is coated with a layer of Cr and then with a layer of Au on the CR layer to facilitate demolding of a silicone-based material. The silicone-based microstructure device is then molded from the coated epoxy resin-based master mold, wherein the silicone-based microstructure device has a dimensional pattern that substantially corresponds to the dimensional pattern of the lithography patterned master mold. 2. The method for pattern transfer to a microstructure device as recited in claim 1 , further comprising the step of forming at least one pillar greater about 4 mm in height into the epoxy master mold.3. The method for pattern transfer to a microstructure device as recited in claim 2 , wherein the at least one pillar forming step comprises forming a hole in the silicone-based replica.4. The method for pattern transfer to a microstructure device as recited in claim 1 , further comprising the step of cutting the silicone-based replica such that boundaries are formed in the epoxy-resin based master mold.5. The method for pattern transfer to a microstructure device as recited in claim 1 , wherein the silicone-based negative replica comprises PDMS.6. The method for pattern transfer to a microstructure device as recited in claim 1 , wherein the step of molding an epoxy resin based master mold comprises the step of degassing between the uncured epoxy-based resin and the silicone-based negative replica.7. The method for pattern transfer to a microstructure device as recited in claim 1 , wherein each of the steps of coating the epoxy-resin based master mold with the Cr layer and then the Au layer comprises sputter deposition of chromium and gold.8. The method for pattern transfer ...

APPARATUSES AND METHODS UTILIZING ETCH STOP LAYERS

Provided herein is an apparatus, including a substrate; an etch stop layer overlying the substrate, wherein the etch stop layer is substantially resistant to etching conditions; and a patterned layer overlying the etch stop layer, wherein the patterned layer is substantially labile to the etching conditions, and wherein the patterned layer comprises a number of features including substantially consistent feature profiles among regions of high feature density and regions of low feature density. 1. An apparatus , comprising:a substrate;an etch stop layer overlying the substrate; and wherein the etch stop layer is substantially resistant to etching conditions and the patterned layer is substantially labile to the etching conditions, and', 'wherein the patterned layer comprises a plurality of nanometer-sized features comprising substantially consistent feature profiles among regions of high feature density and regions of low feature density., 'a patterned layer overlying the etch stop layer,'}2. The apparatus of claim 1 , wherein each feature of the plurality of nanometer-sized features is tens of nanometers or less in at least a minor dimension of the feature.3. The apparatus of claim 1 , wherein the substantially consistent feature profiles are substantially consistent with respect to depths and sidewall angles.4. The apparatus of claim 1 , wherein features in the regions of low feature density are spaced at least 10 times farther apart than features in the regions of high feature density.5. The apparatus of claim 4 , wherein features in the regions of low feature density are hundreds of nanometers or less in center-to-center pitch claim 4 , and wherein features in the regions of high feature density are tens of nanometers or less in center-to-center pitch.6. The apparatus of claim 1 , wherein the etching conditions are fluorine-based etching conditions.7. The apparatus of claim 1 , wherein the etch stop layer is configured to be transparent to UV radiation for curing ...

Apparatuses and methods utilizing etch stop layers

Provided herein is an apparatus, including a substrate; an etch stop layer overlying the substrate, wherein the etch stop layer is substantially resistant to etching conditions; and a patterned layer overlying the etch stop layer, wherein the patterned layer is substantially labile to the etching conditions, and wherein the patterned layer comprises a number of features including substantially consistent feature profiles among regions of high feature density and regions of low feature density.

Apparatuses and methods utilizing etch stop layers

Provided herein is an apparatus, including a substrate; an etch stop layer overlying the substrate, wherein the etch stop layer is substantially resistant to etching conditions; and a patterned layer overlying the etch stop layer, wherein the patterned layer is substantially labile to the etching conditions, and wherein the patterned layer comprises a number of features including substantially consistent feature profiles among regions of high feature density and regions of low feature density.

STRUCTURE STAMP, DEVICE AND METHOD OF EMBOSSING

A structure stamp has a flexible stamp which has a microstructured or nanostructured stamp surface for embossing of an embossing structure which corresponds to the stamp surface on an embossing surface, and a frame for clamping the stamp. Moreover, the invention relates to a device for embossing an embossing pattern on an embossing surface with the following features: a stamp receiver for accommodating and moving a structure stamp, an embossing material receiver for accommodating and placing an embossing material opposite the structure stamp, and an embossing element drive for moving an embossing element along the structure stamp. 1. A structure stamp , comprising:a flexible stamp having a microstructured or nanostructured stamp surface that is configured to emboss an embossing structure corresponding to the stamp surface on an embossing surface; anda frame configured to clamp the flexible stamp.2. The structure stamp as claimed in claim 1 , wherein at least two opposing clamping sides of the frame clamp the flexible stamp.3. The structure stamp as claimed in claim 1 , where at least two opposing clamping sides of the frame are spring-loaded with springs to clamp the flexible stamp.4. The structure stamp as claimed in claim 1 , wherein at least two opposing clamping sides of the frame clamp the flexible stamp with two clamping strips located on the two opposing clamping sides.5. The structure stamp as claimed in claim 1 , wherein the frame has two guide strips that run opposite to one another claim 1 , the guide strips being configured to guide an embossing element along one exposure side of the flexible stamp.6. The structure stamp as claimed in claim 5 , wherein the two guide strips run parallel to one another.7. The structure stamp as claimed in claim 5 , wherein the embossing element is an embossing roll.8. The structure stamp as claimed in claim 5 , wherein the one exposure side is located along one side of the flexible stamp facing away from the stamp surface. ...

Multiple patterning with organometallic photopatternable layers with intermediate freeze steps

Multiple patterning approaches using radiation sensitive organometallic materials is described. In particular, multiple patterning approaches can be used to provide distinct multiple patterns of organometallic material on a hardmask or other substrate through a sequential approach that leads to a final pattern. The multiple patterning approach may proceed via sequential lithography steps with multiple organometallic layers and may involve a hardbake freezing after development of each pattern. Use of an organometallic resist with dual tone properties to perform pattern cutting and multiple patterning of a single organometallic layer are described. Corresponding structures are also described.

METHODS OF FORMING IMPRINTED PATTERNS

A method of forming imprinted patterns is provided. The method may include detecting a particle located on a wafer. The method may include distributing an imprint medium material on a surface of the wafer. The method may include forming an imprint medium layer on a surface of the wafer with a template and the imprint medium material. 1. A method of forming imprinted patterns , the method comprising:detecting a particle located on a wafer;distributing an imprint medium material on a surface of the wafer; andforming an imprint medium layer on a surface of the wafer with a template and the imprint medium material,wherein the imprint medium layer has a first thickness and a second thickness greater than the first thickness, and the second thickness is closer in proximity to the particle than the first thickness.2. The method of claim 1 , wherein distributing the imprint medium material on the surface of the wafer comprises:forming first droplets of the imprint medium material on the surface of the wafer; andforming second droplets of the imprint medium material at positions adjacent to the particle.3. The method of claim 2 , wherein distances between the second droplets of the imprint medium material are less than a distance between the first droplets of the imprint medium material.4. The method of claim 2 , wherein each of the second droplets of the imprint medium material is formed to have a volume size which is greater than a volume size of each of the first droplets of the imprint medium material.5. The method of claim 2 , wherein the second droplets of the imprint medium material are formed such that an integration density of the second droplets is greater than an integration density of the first droplets.6. The method of claim 2 , wherein forming the imprint medium layer on the surface of the wafer includes spreading the first and second droplets by pressing down the template toward the wafer.7. The method of claim 2 , wherein the imprint medium layer is formed ...

Stamps including a self-assembled block copolymer material, and related methods

Methods for fabricating stamps and systems for patterning a substrate, and devices resulting from those methods are provided.

Method of Producing a Relief Image From a Liquid Photopolymer Resin

A method of producing a relief image or mold from a liquid photopolymer resin, said method comprising the steps of: a) placing an image film onto an exposure glass; b) placing a cover film over the image film and drawing a vacuum c) placing substrate material on a bottom glass d) casting a liquid photopolymer resin layer onto the substrate material; d) laminating a flexible polyester sheet onto a backside of the liquid photopolymer resin layer as the liquid photopolymer resin layer is being cast onto the substrate material; and e) exposing the liquid photopolymer resin layer through the image film to selectively crosslink and cure the photopolymerizable resin layer and form a cured relief image, wherein said depth of the cured relief image is less than the height of the cast liquid photopolymerizable resin.

METHOD FOR MAKING MICROSTRUCTURED TOOLS HAVING DISCONTINUOUS TOPOGRAPHIES, AND ARTICLES PRODUCED THEREFROM

Methods for making a microstructured tool having interspersed topographies are disclosed, and the production of articles therefrom. 1. An article having a first major surface comprising first microstructural features within a matrix of second microstructural features , wherein the first microstructural features are discontinuous , wherein collectively the first and second microstructural features form a pattern visible at least when viewed normal to the first major surface , and wherein the first and second microstructural features are independently selected from the group consisting of cones , diffraction gratings , lenticulars , segments of a sphere , pyramids , cylinders , fresnels , and prisms.2. The article of claim 1 , wherein the first and second microstructural features independently have a pitch in a range from 0.1 micrometer to 1000 micrometers claim 1 , wherein the first pitch is up to 90% of the second pitch.3. The article of claim 2 , wherein the first pitch is up to 90% of the second pitch.4. The article of claim 2 , wherein the first pitch is up to 50% of the second pitch.5. The article of claim 1 , wherein the pattern includes at least one of alphanumerics claim 1 , a first trademark indicia claim 1 , or a first copyrighted indicia.6. The article of claim 1 , wherein the first and second microstructural features independently comprise at least one of a thermosetting material or a thermoplastic material.7. The article of claim 1 , wherein the pattern comprises regions having no microstructural features.8. An article having a first major surface comprising first microstructural features and second microstructural features arranged in a pattern visible at least when viewed normal to the first major surface claim 1 , wherein the first and second microstructural features are different relative to each other claim 1 , and are selected from the group consisting of cones claim 1 , diffraction gratings claim 1 , lenticulars claim 1 , segments of a sphere ...

HEAT-REACTIVE RESIST MATERIAL, MOLD MANUFACTURING METHOD, MOLD, DEVELOPMENT METHOD AND PATTERN FORMATION MATERIAL

A heat-reactive resist material contains copper oxide, and silicon or silicon oxide, and is formed so that the content of silicon or silicon oxide in the heat-reactive resist material is 4.0 mol % or more less than 10.0 mol % in terms of mole of silicon. A heat-reactive resist layer is formed using the heat-reactive resist material, is exposed, and then, is developed with a developing solution. Using the obtained heat-reactive resist layer as a mask, dry etching is performed on a substrate with a fluorocarbon to manufacture a mold having a concavo-convex shape on the substrate surface. At this point, it is possible to control a fine pattern comprised of the concavo-convex shape. 1. A pattern formation material comprising a combination of a heat-reactive resist material and a developing solution , whereinthe heat-reactive resist material contains copper oxide, and silicon or silicon oxide,the developing solution comprises glycine solution or a mixed solution of glycine and ammonium oxalate, anda Si additive amount of the silicon or the silicon oxide in the heat-reactive resist material ranges from 4.5 mol % to 9.5 mol % in the total moles of copper (Cu) and silicon (Si).2. The pattern formation material according to claim 1 , whereinthe content of the silicon or the silicon oxide in the heat-reactive resist material ranges from 5.5 mol % to 8.5 mol % in the total number of moles of copper (Cu) and silicon (Si).3. The pattern formation material according to claim 1 , whereinthe content of the silicon or the silicon oxide in the heat-reactive resist material ranges from 6.5 mol % to 8.5 mol % in the total number of moles of copper (Cu) and silicon (Si). This application is a Divisional application of copending application Ser. No. 14/359,869, filed May 21, 2014, which is the National Phase under 35 U.S.C. § 371 of International Application No. PCT/JP2012/079784, filed on Nov. 16, 2012, which claims the benefit under 35 U.S.C. § 119 (a) to Patent Application No. 2011- ...

Method For Applying Curable Gellant Composition For Digital Embossing And Other Raised Print Applications

A process including providing a substantially flat printed image on a substrate; disposing a curable gellant composition onto the printed image in registration with the printed image, successively depositing additional amounts of the gellant composition to create a raised image in registration with the printed image; and curing the deposited raised image. A process including providing a printed image on a substrate; disposing a curable non-gellant composition onto the printed image in registration with the printed image; and disposing a curable gellant composition onto the printed image in registration with the printed image; to create a raised image in registration with the printed image; and curing the deposited raised image. An ultraviolet curable phase change gellant composition including a radiation curable monomer or prepolymer, a photoinitiator, a silicone polymer or pre-polymer, and a gellant. 1. A process comprising:providing a substantially flat printed image on a substrate;disposing a curable gellant composition onto the printed image in registration with the printed image, wherein the curable gellant composition comprises a radiation curable monomer or prepolymer, a photoinitiator, and a gellant;successively depositing additional amounts of the gellant composition to create a raised image in registration with the printed image; andcuring the deposited raised image.2. The process of claim 1 , wherein the printed image is a xerographic image.3. The process of claim 1 , wherein the process comprises an in-line process.4. The process of claim 1 , wherein the cured raised image has a height of greater than 30 micrometers.5. The process of claim 1 , wherein the raised image has a height of from about 40 micrometers to about 60 micrometers.6. The process of claim 1 , wherein curing the deposited curable gellant composition comprises curing after the last of the successive additional amounts of the curable gellant composition are deposited.7. The process of ...

Flexographic Printing Plate with Improved Storage Stability

A method of making a relief image printing element comprising a plurality of relief printing dots. The method includes the steps of: (a) providing at least one photocurable layer disposed on a substrate, the at least one photocurable layer being capable of being selectively crosslinked and cured upon exposure to actinic radiation, (b) imagewise exposing the at least one photocurable layer to actinic radiation to selectively crosslink and cure portions of the at least one photocurable layer; and (c) developing the relief image printing element to separate and remove uncrosslinked and uncured portions of the at least one photocurable layer to reveal the relief image therein. The at least one photocurable layer comprises (i) an ethylenically unsaturated monomer; (ii) a binder; and (iii) a photoinitiator exhibiting a quantum yield of initiation (Qi) of more than 0.05 at a 365 nm wavelength. The substrate has an optical density from 0.5 to 5 in the wavelength range of 365 nm to 450 nm but preferably allows transmission of from 0.1% to 10% of incident light in the wavelength range of 365 nm to 450 nm. 1. A method of making a relief image printing element comprising a plurality of relief printing dots , the method comprising the step of: i) an ethylenically unsaturated monomer;', 'ii) a binder; and', 'iii) a photoinitiator, the photoinitiator exhibiting a quantum yield of initiation (Qi) of more than 0.05 at a 365 nm wavelength;', 'wherein the substrate has an optical density from 0.5 to 5 in the wavelength range of 365 nm to 450 nm but allows transmission of from 0.1% to 10% of incident light in the wavelength range of 365 nm to 450 nm;, 'a) providing at least one photocurable layer disposed on a substrate, the at least one photocurable layer being capable of being selectively crosslinked and cured upon exposure to actinic radiation, the at least one photocurable layer comprisingb) imagewise exposing the at least one photocurable layer to actinic radiation to selectively ...

Film mask, method for manufacturing same, and method for forming pattern using film mask and pattern formed thereby

The present application relates to a film mask comprising: a transparent substrate; a darkened light-shielding pattern layer provided on the transparent substrate; and groove portions provided in a region where the darkened light-shielding pattern layer is not provided, a method for manufacturing the same, a method for forming a pattern by using the same, and a pattern manufactured by using the same.

STRUCTURE STAMP, DEVICE AND METHOD FOR EMBOSSING

A structure stamp has a flexible stamp which has a microstructured or nanostructured stamp surface for embossing of an embossing structure which corresponds to the stamp surface on an embossing surface, and a frame for clamping the stamp. Moreover, the invention relates to a device for embossing an embossing pattern on an embossing surface with the following features: a stamp receiver for accommodating and moving a structure stamp, an embossing material receiver for accommodating and placing an embossing material opposite the structure stamp, and an embossing element drive for moving an embossing element along the structure stamp. 1. A structure stamp , comprising:a flexible stamp having a microstructured or nanostructured stamp surface that is configured to emboss an embossing structure corresponding to the stamp surface on an embossing surface; anda frame configured to clamp the flexible stamp.2. The structure stamp as claimed in claim 1 , wherein at least two opposing clamping sides of the frame clamp the flexible stamp.3. The structure stamp as claimed in claim 1 , where at least two opposing clamping sides of the frame are spring-loaded with springs to clamp the flexible stamp.4. The structure stamp as claimed in claim 1 , wherein at least two opposing clamping sides of the frame clamp the flexible stamp with two clamping strips located on the two opposing clamping sides.5. The structure stamp as claimed in claim 1 , wherein the frame has two guide strips that run opposite to one another claim 1 , the guide strips being configured to guide an embossing element along one exposure side of the flexible stamp.6. The structure stamp as claimed in claim 5 , wherein the two guide strips run parallel to one another.7. The structure stamp as claimed in claim 5 , wherein the embossing element is an embossing roll.8. The structure stamp as claimed in claim 5 , wherein the one exposure side is located along one side of the flexible stamp facing away from the stamp surface. ...

Manufacture of a horology component

Method for manufacturing by photolithography a resin multilayer mould (10; 10′) including a cavity (11; 11′) provided with an inlet (110; 110′) for the manufacture of a horological component, including producing at least two resin layers of the mould (10; 10′), by producing a first resin layer (C10; C20′) having a first through-opening or open opening (111; 111′) oriented in the direction of the inlet (110; 110′) of the mould to delimit a first volume of the cavity (11; 11′) of the mould (10, 10′), and producing a second resin layer (C20; C30′) including a rigid film and having a second through-opening (112; 112′) that delimits a second volume of the cavity (11; 11′) of the mould (10, 10′) and is at least partly superposed on the first through-opening or open opening (111; 111′), the second resin layer partly covering that same first through-opening or open opening (111; 111′).

Method for realizing a multispacer structure, use of said structure as a mould and method for producing circuital architectures using said mould

Method and system for making a nano-plate for imprint lithography

Provided is a method and system for manufacturing a nano-plate. The method includes depositing two or more types of film around a central core to form a plurality of film layers, each film layer being of a different type than its adjacent layers. Next, the deposited film layers are sectioned to expose a patterned surface. Finally, the patterned surface is then planarized and selectively etched to form a relief pattern which can be used as an imprint stamp.

Method and system for making a nano-plate for imprint lithography

Provided is a method and system for manufacturing a nano-plate. The method includes depositing two or more types of film around a central core to form a plurality of film layers, each film layer being of a different type than its adjacent layers. Next, the deposited film layers are sectioned to expose a patterned surface. Finally, the patterned surface is then planarized and selectively etched to form a relief pattern which can be used as an imprint stamp.

Method for making a metal forming structure

A method for making a forming structure for use in an apparatus for making formed polymeric film. The method comprises a multiple step process of applying a photoresist polymer to a metal base sheet, curing the polymer, acid etching the portions of the metal base sheet not covered by cured polymer to form a protrusion having an upper surface and a side wall (or walls), washing the base sheet with caustic and repeating the process as necessary, each time covering the upper surface and side wall of the protrusion with cured polymer.

Method for making a metal forming structure

A method for making a forming structure for use in an apparatus for making formed polymeric film. The method comprises a multiple step process of applying a photoresist polymer to a metal base sheet, curing the polymer, acid etching the portions of the metal base sheet not covered by cured polymer to form a protrusion having an upper surface and a side wall (or walls), washing the base sheet with caustic and repeating the process as necessary, each time covering the upper surface and side wall of the protrusion with cured polymer.

Mold for manufacturing large area pattern and manufacturing method thereof and method of forming pattern using the same

본 발명은 대면적의 패턴을 제작 시 정렬 마크를 사용하지 않고 미세 패턴 간 정밀 정렬을 수행하기 위한 것으로, 일 실시예에 따른 대면적 패턴 제작용 몰드는 마스터 기판에 패턴을 복제하는 영역인 제1 영역과, 상기 마스터 기판에 복제된 이전 패턴 영역의 형상과 겹쳐지는 형상을 가지며, 제1 방향을 따라 상기 제1 영역을 다음 패턴 영역에 위치하도록 정렬시키는 영역인 제2 영역과, 상기 마스터 기판에 복제된 이전 패턴 영역의 형상과 겹쳐지는 형상을 가지고 상기 이전 패턴 영역과 결합되며, 상기 제1 방향의 수직 방향인 제2 방향을 따라 상기 제1 영역을 다음 패턴 영역에 위치하도록 정렬시키는 영역인 제3 영역을 포함한다. 한편, 본 발명은 2020년도 교육부의 재원으로 한국연구재단의 지원을 받아 수행된 지자체-대학 협력기반 지역혁신 사업의 결과로서 "연구과제명: R2R장비 및 Mesoporous Silica Nanoparticle을 이용한 5G급 모바일 회로용 저유전율 필름 코팅기술 개발(과제고유번호: 2020-0257, 연구기간: 2020.05.01. ~ 2021.12.31.)"를 통해 창원대학교 산학협력단(주관연구기관)에 의해 개발된 기술에 관한 것이다. The present invention is to perform precise alignment between fine patterns without using an alignment mark when manufacturing a large-area pattern. a second region having a shape overlapping the shape of the previous pattern region duplicated on the master substrate, and aligning the first region to be positioned in the next pattern region along the first direction; A second region that has a shape overlapping the shape of the duplicated previous pattern region, is combined with the previous pattern region, and aligns the first region to be positioned in the next pattern region along a second direction perpendicular to the first direction Includes 3 areas. On the other hand, the present invention is the result of a local government-university cooperation-based regional innovation project carried out with the support of the National Research Foundation with the funding of the Ministry of Education in 2020, "Research project name: 5G-class mobile circuit storage using R2R equipment and Mesoporous Silica Nanoparticles. It relates to the technology developed by Changwon University Industry-University Cooperation Foundation (supervised research institute) through "Development of dielectric constant film coating technology (Project unique number: 2020-0257, research period: 2020.05.01. ~ 2021.12.31.)".

Thermally reactive resist material, mold manufacturing method

Method to produce nanometer-sized features with directed assembly of block copolymers

Methods for fabricating stamps and systems for patterning a substrate, and devices resulting from those methods are provided.

Producing method for stamper for light guide plate

본 발명은 도광판 제조용 스탬퍼의 제작방법에 관한 것으로, 하기의 단계를 포함하는 것을 특징으로 한다: The present invention relates to a manufacturing method of a stamper for manufacturing a light guide plate, characterized in that it comprises the following steps: (a) 전도막이 증착된 유리를 세척하는 단계, (a) washing the glass on which the conductive film is deposited, (b) 상기 전도막 위에 전도성 재료로 도금하는 단계, (b) plating with a conductive material on the conductive film, (c) 상기 도금층 위에 감광막((Photoresist)을 스핀코팅하는 단계, (c) spin coating a photoresist on the plating layer; (d) 원하는 패턴 마스크를 올리고 노광하고 현상하는 단계, (d) raising, exposing and developing a desired pattern mask, (e) 감광막이 부분적으로 제거되어진 곳에 도금된 면을 습식 식각 방법으로 에칭하는 단계, (e) etching the plated surface by the wet etching method where the photoresist film is partially removed, (f) 남아 있는 감광막을 제거하는 단계, (f) removing the remaining photoresist film, (g) 완성된 패턴 면을 니켈 도금을 통해 마스터(master)를 제작하는 단계 및 (g) fabricating a master through nickel plating of the finished pattern surface; and (h) 상기 마스터를 이형시켜 재도금을 통해 스템퍼를 제작하는 단계. (h) releasing the master to produce a stamper through replating. 도광판, 스탬퍼, 도금, 에칭 Light guide plate, stamper, plating, etching

Manufacturing method of imprinting mold

本发明提供一种压印模具的制作方法，包括如下步骤：1)制作母版结构，母版结构的表面形成有多个第一凹槽结构；2)基于母版结构制作转印模板，转印模板的表面形成有多个凸起结构；3)提供压印模具基板；4)于压印模具基板的表面形成压印模具柔性材料层；5)基于转印模板采用压印工艺于压印模具柔性材料层的表面形成多个第二凹槽结构；6)将压印模具柔性材料层固化；7)剥离转印模板。本发明的压印模具的制作方法可以提高母版结构的利用率，制备工艺简单，压印模具内的应力较小，不会存在爆裂的风险。

Manufacturing Method of Mold and Manufacturing Method of Plastic Film Using Mold

본 발명은 플라스틱 필름에 장식 문양을 형성하기 위한 금형에 있어서, 몸체; 상기 몸체의 상부 표면에 형성된 제 1 미세 패턴; 및 상기 제 1 미세 패턴과 단차지도록 상기 제 2 미세 패턴 사이에 형성된 제 2 미세 패턴을 포함하여 구성되는 금형의 제조방법 및 상기 금형을 이용한 플라스틱 필름의 제조 방법에 관한 것으로서, 본 발명에 따르면 다양한 미세 패턴을 가지는 금형을 용이하게 제작할 수 있으며, 플라스틱 필름에 다양한 미세 패턴을 용이하게 형성할 수 있는 효과를 제공한다. The present invention provides a mold for forming a decorative pattern on a plastic film, the body; A first fine pattern formed on an upper surface of the body; And a second fine pattern formed between the second fine pattern to be stepped with the first fine pattern, and a method of manufacturing a plastic film using the mold, according to the present invention. The mold having a pattern can be easily manufactured, and the plastic film can be easily formed with various fine patterns.

Multiple Patterning Using Organometallic Photopatternable Layers with Intermediate Fixation Steps

감방사선성 유기금속 재료를 사용하는 다중 패터닝 접근법이 기술된다. 특히, 다중 패터닝 접근법은 최종 패턴에 이르게 하는 순차적 접근법을 통해 하드마스크 또는 다른 기판 상에 유기금속 재료의 별개의 다중 패턴을 제공하기 위해 사용될 수 있다. 다중 패터닝 접근법은 다중 유기금속 층을 사용하여 순차적인 리소그래피 단계를 통해 진행할 수 있으며 각 패턴의 현상 후 하드베이크 고정을 포함할 수 있다. 단일 유기금속 층의 패턴 커팅 및 다중 패터닝을 수행하기 위해 이중 톤 특성을 갖는 유기금속 레지스트의 사용이 기술된다. 해당 구조도 또한 기술된다.

Method for manufacturing micro-nano structure on any curved surface based on flexibility

一种基于柔性的可在任意曲面制造微纳结构的方法,先运用计算机三维测量重构技术将曲面物体表面重新构造出来，然后制备热塑性形状记忆聚合物印模，其一侧有微纳结构图案，另一侧涂有复合物；再在热塑性形状记忆聚合物印模图形区均匀的涂覆一层压印胶，用计算机辅助驱动控制器处理热塑性形状记忆聚合物印模上的复合物使热塑性形状记忆聚合物印模变形为曲面物体表面的形状，采取逆压印的方式将压印胶转印到曲面物体表面上，最后固化压印胶，脱模，并刻蚀曲面物体表面即可在曲面上制造出微纳结构图案，本发明具有制备工艺简单、成本低、制备周期短、印模可多次利用、以及可在曲面上做任意微纳结构等优点。

Nano imprint mold manufacturing method, light emitting diode manufacturing method and light emitting diode using the nano imprint mold manufactured by the method

본 발명은 나노 임프린트 몰드 제조방법, 이를 이용한 발광다이오드 및 그 제조방법에 관한 것이다. 본 발명에 따른 발광다이오드 제조방법은 임시기판 상에 n형 질화물 반도체층, 발광층 및 p형 질화물 반도체층을 형성하는 단계, p형 질화물 반도체층 상에 p형 전극을 형성하는 단계, p형 전극 상에 도전성 기판을 형성하는 단계, 임시기판을 제거하여 n형 질화물 반도체층을 노출시키는 단계, n형 질화물 반도체층 상에 나노 임프린트 레지스트층을 형성하는 단계, 나노 임프린트 몰드를 나노 임프린트 레지스트층에 가압하여 나노 패턴을 나노 임프린트 레지스트층에 전사하는 단계, 나노 패턴이 형성된 나노 임프린트 레지스트층으로부터 나노 임프린트 몰드를 분리하는 단계 및 나노 패턴이 형성된 나노 임프린트 레지스트층의 일부를 식각하여 n형 전극을 형성하는 단계를 포함하여 구성된다. 본 발명에 따르면, 발광다이오드의 광추출 효율을 향상시키기 위한 나노 패턴을 효율적이고 경제적으로 형성할 수 있는 나노 임프린트 몰드 제조방법, 이 나노 임프린트 몰드를 이용한 발광다이오드 제조방법 및 발광다이오드가 제공되는 효과가 있다.

Method for producing a pattern formation mold

본 발명의 패턴 형성 몰드의 제조 방법은 하기 화학식 1로 표시되는 에폭시 수지를 함유하는 방사선 민감성 네가티브형 레지스트 조성물을 방사선 민감성 양이온성 중합 개시제 및 상기 에폭시 수지를 용해시키기 위한 용매와 함께 기판에 도포하는 제1 단계; 상기 방사선 민감성 네가티브형 레지스트 조성물로 코팅된 기판을 건조시켜서 레지스트 필름을 형성하는 제2 단계; 상기 형성된 레지스트 필름을 소정 패턴에 따라 활성 에너지 빔에 선택적으로 노출시키는 제3 단계; 형성하고자 하는 패턴의 콘트라스트를 증가시키도록 상기 노출된 레지스트 필름을 가열하는 제4 단계; 상기 가열된 레지스트 필름을 현상하여 용해를 통하여 상기 레지스트 필름의 미노출 부분을 제거하여 패턴 형성된 층을 형성하는 제5 단계; 및 상기 패턴 형성된 층의 재료 이외의 재료를, 상기 패턴 형성된 층에 존재하는 공간을 상기 재료로 적어도 일부 높이로 충전하도록 상기 패턴 형성된 층에 도포하여 제2 층을 형성하고, 상기 제2 층을 제거하여 패턴 형성 몰드를 얻는 제6 단계를 포함한다: The method for producing a pattern forming mold of the present invention is a method of applying a radiation-sensitive negative type resist composition containing an epoxy resin represented by the following formula (1) to a substrate together with a radiation-sensitive cationic polymerization initiator and a solvent for dissolving the epoxy resin Stage 1; Drying the substrate coated with the radiation sensitive negative resist composition to form a resist film; Selectively exposing the formed resist film to an active energy beam according to a predetermined pattern; Heating the exposed resist film to increase the contrast of the pattern to be formed; A fifth step of developing the heated resist film to remove the unexposed portions of the resist film through dissolution to form a patterned layer; And applying a material other than the material of the patterned layer to the patterned layer to fill a space present in the patterned layer with the material at least in part to form a second layer, and removing the second layer. And a sixth step of obtaining a pattern forming mold: 화학식 1 Formula 1 상기 식에서, R 1 은 k 활성 수소 원자를 가진 유기 화합물로부터 유도되는 부 분을 나타내고, k는 1 내지 100의 정수를 나타내며; 각각의 n 1 , n 2 내지 n k 는 0 또는 1 내지 100의 정수이고; n 1 , n 2 내지 n k 의 합은 1 내지 100의 범위 내에 있으며; 각각의 "A"는 서로 동일하거나 상이할 수 있고, 하기 화학식 2로 표시되는 옥시시클로헥산 골격을 나타내며: Wherein R 1 represents a portion derived from an organic compound having k active hydrogen atoms, and k represents an integer ...

Manufacturing method of near-eye display diffraction grating waveguide

나노 임프린트 기술을 적용한 근안 디스플레이 회절 격자 도파로의 제조 방법은 근안 표시 기술분야에 속하는 것으로, 종래 기술에서 회절 격자 도파로의 제조 난이도가 높고, 수율이 낮으며, 반복성이 낮고, 대규모 생산을 수행할 수 없는 문제를 해결한다. 제조 방법은, 회절 격자 도파로 패턴을 갖는 임프린트 템플레이트를 제조하는 단계; 나노 임프린트 공정을 통해 임프린트 템플레이트의 회절 격자 도파로 패턴을 전사 템플레이트에 전사하여 회절 격자 도파로 패턴의 미러 패턴을 갖는 전사 템플레이트를 획득하는 단계; 및 나노 임프린트 공정을 통해 전사 템플레이트의 회절 격자 도파로 패턴의 미러 패턴을 도파로 기판에 전사하여 근안 디스플레이 회절 격자 도파로를 획득하는 단계를 포함한다. 제조 방법은 근안 디스플레이 회절 격자 도파로의 제조에 사용될 수 있다.

Method for making stamp for plasmonic nano lithography apparatus plasmonic nano lithography apparatus

본 발명은 플라즈모닉 나노리소그래피 장치용 스탬프 제조방법에 관한 것이며, 본 발명의 플라즈모닉 나노리소그래피 장치용 스탬프 제조방법은 기판 상에 플라즈모닉 공명(plasmonic resonance) 특성을 갖는 소재로 마련되는 금속패턴을 형성하는 금속패턴 형성단계; 상기 기판 및 상기 금속패턴의 외면에 소수성 박막을 코팅하여 소수성 처리하는 소수성 처리단계; 상기 금속패턴의 외면만 선택적으로 친수성 처리하는 친수성 처리단계; 상기 기판 및 상기 금속패턴 상에 버퍼층을 적층하는 버퍼층 적층단계; 상기 금속패턴 및 버퍼층을 상기 기판으로부터 광투과성 소재의 베이스 측으로 전사시켜 결합시키는 결합단계;를 포함하는 것을 특징으로 한다. 따라서, 본 발명에 의하면, 표면 플라즈몬 에너지를 이용하여 광회절의 한계를 극복하고 미세패턴을 형성할 수 있는 플라즈모닉 나노리소그래피 장치용 스탬프 제조방법 및 플라즈모닉스 나노리소그래피 장치가 제공된다. The present invention relates to a method for manufacturing a stamp for a plasmonic nanolithography apparatus, and a method for manufacturing a stamp for a plasmonic nanolithography apparatus according to the present invention comprises forming a metal pattern provided on a substrate with a plasmonic resonance characteristic Forming a metal pattern; A hydrophobic treatment step of coating a hydrophobic thin film on an outer surface of the substrate and the metal pattern to perform a hydrophobic treatment; A hydrophilic treatment step of selectively treating only the outer surface of the metal pattern with a hydrophilic treatment; A buffer layer laminating step of laminating a buffer layer on the substrate and the metal pattern; And a bonding step of transferring the metal pattern and the buffer layer from the substrate to the base side of the light-transmitting material. Thus, according to the present invention, there is provided a method of manufacturing a stamp for a plasmonic nanolithography apparatus and a plasmonic nanolithography apparatus capable of overcoming the limitations of optical diffraction by using surface plasmon energy and forming a fine pattern.

Multi-tiered lithographic template

본 발명은 반도체 장치, 마이크로 전자 장치, 마이크로 전자 기계 장치, 마이크로 유체 공학 장치에 관한 것으로, 보다 상세하게는, 다층 리소그래피 템플릿, 다층 리소그래피 템플릿을 형성하는 방법, 및 다층 리소그래피 템플릿을 사용하여 장치를 형성하는 방법에 관한 것이다. 다층 리소그래피 템플릿(10/10')은 제1 릴리프 구조와 제1 릴리프 구조를 포함하여, 이로써 다층 릴리프 이미지를 규정하도록 형성된다. 이러한 템플릿은 반도체 장치(40)(그 위에 형성된 방사선 감응 물질을 포함함) 매우 가까이에 템플릿을 배치하고 압력을 인가하여 방사선 감응 물질이 그 템플릿에 존재하는 다층 릴리프 이미지로 흘러들어가도록 함으로써 장치(40)의 패턴에 영향을 미치는 반도체 장치(40) 제조에 이용된다. 그 다음 방사선이 다층 템플릿을 통하여 인가되어 방사선 감응 물질의 일부를 경화시키고 방사선 감응 물질에서 패턴을 규정한다. 그 다음 다층 템플릿이 제거되어 반도체 장치 제조(40)가 종료한다.

Method for manufacturing imprint mold

本发明提供一种压印模具制造方法。压印模具制造方法，包含：设置模具图案层于基材上；于模具图案层上设置第一硬掩膜层，第一硬掩膜层具有一个或多个第一镂空区域；在模具图案层形成第一模具图案，第一模具图案的范围与第一镂空区域于模具图案层的垂直投影范围完全重迭；去除第一硬掩膜层；于模具图案层上设置第二硬掩膜层，第二硬掩膜层具有一个或多个第二镂空区域，第二镂空区域于模具图案层的垂直投影范围与第一模具图案相邻接；在模具图案层形成第二模具图案，第二模具图案的范围与第二镂空区域于模具图案层的垂直投影范围完全重迭；去除第二硬掩膜层。

Photosensitive resin composition and method for producing same

提供在需要回流焊工序的固体摄像元件或电子元件一体型产品的制造中，具有优异的耐温度冲击性的感光性透明树脂组合物，以及使用该组合物而成的微塑料透镜或液晶偏振板用光学元件成型物。该感光性树脂组合物含有：聚有机硅氧烷(a)：100质量份、和光聚合引发剂(b)：0.01～30质量份，所述聚有机硅氧烷(a)为通过使下述通式(1)：R 1 a R 2 b Si(OR 3 ) 4－a－b (1){R 1 、R 2 、R 3 、a和b在说明书中定义}的烷氧基硅烷化合物和催化剂混合并聚合的方法得到的、具有聚合性官能团的聚有机硅氧烷(a)，该聚有机硅氧烷(a)含有下述通式(2)：≡Si-O-X-Si≡(2){X在说明书中定义}的结构，并且该聚有机硅氧烷(a)所具有的Si原子数中5～60%包含在下述通式(2)所示的结构内。

Patterning mold and manufacturing method thereof

미세한 패턴을 기판 또는 유리 등에 형성시킬 수 있는 패터닝 몰드를 개시한다. 기판에 미세패턴을 형성하기 위해 사용되는 패터닝 몰드에 있어서, 상기 패터닝 몰드는, 전사체;와, 상기 전사체의 일단에 형성되며 상기 기판의 일면에 나노물질을 전사하는 패터닝부;와, 상기 전사체의 외형이 변형되는 방지하기 위해 상기 전사체의 외측에 결합되는 고정부재;를 포함하는 것을 특징으로 한다.

A optical film having round-hexagonal pattern and backlight assembly using the same

PURPOSE: An optical film having a smoothing hexagonal pattern and a backlight assembly using the same are provided to improve shielding properties by increasing a light scattering effect and minimizing moire generated in a circular or polygonal pattern. CONSTITUTION: A base layer(101) transmits light from outside. A pattern layer includes a smoothing hexagonal pattern(110,111,112). The smoothing hexagonal pattern is formed on one side of the base layer. The smoothing hexagonal pattern forms a rounded edge by reducing the distance of an inscribed circle by 2/5 to 2/3 in the inscribed circular arc direction.

Structure stamp, device and method for embossing

본 발명은 엠보싱 표면(6o) 위에 스탬프 표면(2)에 상응하는 엠보싱 구조를 엠보싱하기 위해 마이크로구조 또는 나노구조의 스탬프 표면(2)을 가진 가요성 스탬프(1), 및 상기 스탬프(1)를 클램핑하기 위한 프레임(3)을 포함하는 구조 스탬프(5)에 관한 것이다. 또한, 본 발명은 엠보싱 표면(6o) 위에 엠보싱 패턴을 엠보싱하기 위한 장치에 관한 것으로서, 상기 장치는: 청구항 제1항 내지 제8항 중 어느 한 항에 따른 구조 스탬프(5)를 수용하고 이동시키기 위한 스탬프 리시버, 엠보싱 재료(6)를 구조 스탬프(5) 맞은편에 수용하고 배열시키기 위한 엠보싱 재료 리시버, 및 특히 제3항, 제4항, 제7항 또는 제8항 중 어느 한 항에 따라 형성된 엠보싱 요소(8)를 구조 스탬프(5)를 따라 이동시키기 위한 엠보싱 요소 드라이브를 포함한다. 추가로, 본 발명은 이에 상응하게 엠보싱 패턴을 엠보싱 재료의 엠보싱 표면 위에 엠보싱하기 위한 방법에 관한 것이다.

Tool for making microstructured articles

A method for making a microstructured article, including (1 forming a first microstructured pattern on a substrate; (2) replicating the first microstructured pattern to make a second microstructured pattern in a flexible material; (3) replicating the second microstructured pattern multiple times to form a third microstructured pattern in a crosslinkable material to make a tool on a first carrier; and (4) replicating the third microstructured pattern in a polymer to make at least one microstructured article.

Fabrication of finely featured devices by liquid embossing

Elastomeric stamps facilitate direct patterning of electrical, biological, chemical, and mechanical materials. A thin film of material is deposited on a substrate. The deposited material, either originally present as a liquid or subsequently liquefied, is patterned by embossing at low pressure using an elastomeric stamp having a raised pattern. The patterned liquid is then cured to form a functional layer. The deposition, embossing, and curing steps may be repeated numerous times with the same or different liquids, and in two or three dimensions. The various deposited layers may, for example, have varying electrical characteristics, interacting so as to produce an integrated electronic component.

Stamp with anti-adhesive layer as well as ways of making and ways to repair such a stamp

A stamp for use in transferring a pattern in nano-scale has a monomolecular antisticking layer. The anti-sticking layer comprises molecular chains, which are covalently bound to the surface of the stamp and which each comprise at least one fluorine-containing group. Each molecular chain contains a group Q, which comprises a bond which is weaker than the other bonds in the molecular chain as well as the covalent bond that binds the molecular chain to the surface of the stamp. Splitting of said bond in the group Q creates a group Q1, which is attached to the part of the molecular chain being left on the surface of the stamp and which is capable of reacting with a fluorine-containing compound to restore the antisticking layer. In a method of manufacturing a stamp for use in transferring a pattern in nanoscale, the stamp is provided with the above-mentioned molecular chain. In a method of repairing a damaged antisticking layer of the above-mentioned stamp, the stamp is treated with a repairing reagent, which has a coupling end, which is capable of reacting with the group Q1, and a fluorine-containing group located at the other end of the repairing reagent.

Film mask, preparing method thereof, pattern forming method using the same and pattern formed by using the same

본 출원은 투명기재; 상기 투명 기재 상에 구비된 암색 차광 패턴층; 및 상기 암색 차광 패턴층이 구비되지 않은 영역에 구비된 홈부를 포함하는 필름 마스크, 이의 제조방법, 이를 이용한 패턴 형성 방법, 및 이를 이용하여 제조된 패턴에 관한 것이다.

Adhesive sheet for immobilizing imprint mold, imprint device, and imprint method

本发明提供一种压印模具固定用粘合片材，它是能够以压印时不发生压印模具的剥离和偏离的方式固定压印模具的粘合片材，其在更换压印模具时能够从压印装置的压力施加部剥离。本发明的压印模具固定用粘合片材是用于使向被转印体按压形成有微细的图案的压印模具并将该压印模具的上述图案形状转印至上述被转印体的压印装置的压印模具与压力施加部之间固定成为一体的粘合片材，其特征是，包括：基材，设置在基材的一表面上的粘合剂层(A)，和设置在基材的另一表面上的粘合剂层(B)；粘合剂层(A)被用于粘贴在压印装置的压力施加部，粘合剂层(B)被用于粘贴在压印模具；粘合剂层(B)的23℃时的粘合力＞粘合剂层(A)的23℃时的粘合力；粘合剂层(A)的23℃时的粘合力为1～10N/25mm，且在80℃、湿度65％下放置7小时后的粘合力为1～30N/25mm；粘合剂层(B)的23℃时的粘合力为3～30N/25mm。

Embossed surface microstructures, devices and method for their making

FIELD: process engineering. SUBSTANCE: proposed microstructures can be used for protection of documents against counterfeit. Replication of relief microstructures that form the pattern comprises the steps that follow. Making of first ply (21) with surface microstructure to produce pattern on second ply (22). Note here that first ply comprises first material while second ply comprises second material. Production of matrix including copying of first ply microstructure in second ply at one etching step. Note also that first ply first material and second ply (22) second material as well as etching conditions are selected to that etching rate of second ply (22) exceeds that of first ply (21). Matrix microstructure is brought in contact with image material for matrix microstructure to be reproduced in image material with surface relief profile reversed relative to matrix surface relief profile. EFFECT: simplified duplication. 21 cl, 24 dwg РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) (13) 2 540 092 C2 (51) МПК G02B 5/18 (2006.01) B42D 25/40 (2014.01) B42D 25/324 (2014.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ОПИСАНИЕ (21)(22) Заявка: ИЗОБРЕТЕНИЯ К ПАТЕНТУ 2011138073/28, 15.02.2010 (24) Дата начала отсчета срока действия патента: 15.02.2010 Приоритет(ы): (30) Конвенционный приоритет: (72) Автор(ы): Мохаммед ИБН-ЭЛЬХАДЖ (CH), Жюльен МАРТЦ (FR), Хуберт ЗАЙБЕРЛЕ (DE), Вольфганг ВЕРНЕТ (DE) (43) Дата публикации заявки: 27.03.2013 Бюл. № 9 R U (73) Патентообладатель(и): РОЛИК АГ (CH) 18.02.2009 EP 09153151.7 (45) Опубликовано: 27.01.2015 Бюл. № 3 2003219992 A1, 27.11.2003. US 2006118426 A1, 08.06.2006. US 2008088930 A1, 17.04.2008 (85) Дата начала рассмотрения заявки PCT на национальной фазе: 19.09.2011 (86) Заявка PCT: 2 5 4 0 0 9 2 (56) Список документов, цитированных в отчете о поиске: EP 1855127 A1, 14.11.2007. US 2 5 4 0 0 9 2 R U (87) Публикация заявки PCT: WO 2010/094441 (26.08.2010) Адрес для переписки: 105082, Москва, Спартаковский пер., д. 2, стр. 1, секция ...

PROCESS FOR PRODUCING MISCELLANEOUSLY REPRODUCIBLE MOLD INSERTS, INSERTS AND PLASTIC PARTS MANUFACTURED THEREBY

INSERT ÉLECTROFORMÉ POUR MOULE DESTINÉ À LA FABRICATION DE PIÈCES PLASTIQUES COMPORTANT À LA FOIS AU MOINS UN MOTIF DIFFRACTIF OBTENU PAR NANOSTRUCTURATION ET AU MOINS UNE STRUCTURE MICROMÉTRIQUE FINE OBTENUE PAR PHOTOLITHOGRAPHIE ÉPAISSE. ELECTROFORMED MOLD INSERT FOR THE MANUFACTURE OF PLASTIC PARTS HAVING BOTH AT LEAST ONE DIFFRACTIVE PATTERN OBTAINED BY NANOSTRUCTURING AND AT LEAST ONE FINE MICROMETRIC STRUCTURE OBTAINED BY THICK PHOTOLITHOGRAPHY.

MICRO-LITHOGRAPHY METHOD USING CURVED SURFACE MASK

Patent FR2184315A5

Glass substrate cutting method and light guide plate manufacturing method

본 발명의 기술적 사상은 유리 기판의 제1 면 상에 상기 제1 면에 렌티큘라 패턴을 포함하는 레진 패턴을 형성하는 단계; 레이저 광을 이용하여 상기 레진 패턴의 일부를 제거하는 단계; 상기 유리 기판의 상기 레진 패턴이 제거에 의해 노출된 부분에 스크라이브 라인들을 형성하는 단계; 및 상기 스크라이브 라인들을 따라 상기 유리 기판을 절단하는 단계를 포함하는 유리 기판 절단 방법을 제공한다. The technical idea of the present invention is to form a resin pattern including a lenticular pattern on the first surface of the glass substrate on the first surface; removing a portion of the resin pattern using laser light; forming scribe lines on a portion of the glass substrate where the resin pattern is exposed by removal; and cutting the glass substrate along the scribe lines.

Micro-needle array kit and manufacture method of micro-needle array kit using ultraviolet exposure

본 발명은 인체에 착탈가능한 미세바늘배열 키트 및 자외선 노광을 이용하여 미세바늘배열 키트를 제작하는 방법을 개시한다. 본 발명의 미세바늘키트는 일측에 홈이 형성되고, 폴리머판 상에 배열형태로 배치되며, 상면이 기울어진 복수의 미세바늘과, 폴리머판 상에 형성되고, 착탈식으로 피부에 접착되는 착탈막으로 구성된다. 또한, 본 발명의 미세바늘배열 키트 제작방법은 자외선 투광기판상에 자외선 흡수부의 패턴을 형성시켜 자외선 마스크를 제작하는 단계와, 자외선 마스크와 감광성 폴리머를 정렬시키는 단계와, 자외선 마스크상에 자외선을 수직노광하는 단계와, 자외선 마스크상에 자외선을 경사노광하는 단계와, 감광성 폴리머를 현상하는 단계와, 현상된 감광성 폴리머 음각 금형에 금형 제조용 물질을 주입하여 양각금형을 제작하는 단계와, 양각금형 위에 금속재료를 형성시켜 미세바늘 제조용 음각금형을 제작하는 단계와, 미세바늘 제조용 음각금형에 미세바늘용 폴리머를 인젝션 몰딩하는 단계로 구성된다. 그에 따라, 본 발명은 정확하게 제작할 수 있고, 충격 등에 의하여 쉽게 파괴되지 않으며, 인체로의 약품진입이나 인체내 물질을 촉진할 수 있는 미세바늘배열 키트를 제조할 수 있다. MEMS, 미세, 바늘, 자외선, 수직노광, 경사노광, 감광성 폴리머, 마스크

Method for manufacturing a forming tool and storage medium formed using the forming tool

Manufacture of stamper for optical information recording medium

(57)【要約】 【課題】 露光スポットのビーム径よりも細かい溝を均 一に形成した光情報記録媒体用スタンパを作製するこ と。 【解決手段】 ガラス基板（原盤）１上のフォトレジス ト層３に露光して現像を行う光情報記録媒体用スタンパ の製造方法において、ガラス基板（原盤）１とフオトレ ジスト層３との間に、膜厚がスタンパ表面に形成される 溝深さと等しい水溶性樹脂層２を設け、原盤露光によっ てフォトレジスト層３に微細パタンを形成し、このフォ トレジスト層をマスクとしてその下層である水溶性樹脂 層２をエッチングして、下層（水溶性樹脂層２）に微細 パタンを形成し、その後フォトレジスト層３を除去して 微細パタンを有するガラス原盤を作成する。

Method for the production of micromechanical parts that are difficult to reproduce, and resulting micromechanical parts

The invention relates to a method for the production of a part, comprising the following steps: a) deposition of a diffractive layer on a substrate; b) deposition of a first photosensitive resin layer on the diffractive layer; c) illumination of the first photosensitive resin layer through a first photomask, such as to selectively remove portions of the photosensitive resin; d) etching of the diffractive layer in the areas not covered by the photosensitive resin; e) removal of the first photosensitive resin layer; f) deposition of a conductive layer on top of the substrate, on top of the remaining diffractive layer portions; g) deposition of a second photosensitive resin layer; h) illumination of the photosensitive resin layer through a second photomask, such as to selectively remove portions of the second photosensitive resin layer; i) electroforming-based deposition on top of the conductive layer between the remaining portions of the second photosensitive resin; j) release of the part by removal of at least the photosensitive resin.

Stamps including a self-assembled block copolymer material, and related methods

Methods for fabricating stamps and systems for patterning a substrate, and devices resulting from those methods are provided.

Methods for Manufacturing Three-Dimensional Devices and Devices Created Thereby

In certain exemplary embodiments of the present invention, three-dimensional micro-mechanical devices and/or micro-structures can be made using a production casting process. As part of this process, an intermediate mold can be made from or derived from a precision stack lamination and used to fabricate the devices and/or structures. Further, the micro-devices and/or micro-structures can be fabricated on planar or nonplanar surfaces through use of a series of production casting processes and intermediate molds. The use of precision stack lamination can allow the fabrication of high aspect ratio structures. Moreover, via certain molding and/or casting materials, molds having cavities with protruding undercuts also can be fabricated. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. This abstract is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.

Formation methods of embossing and formation apparatus

본 발명은 엠보싱 형성 장치 및 그 형성 방법에 관한 것으로, 더욱 상세하게는 용융 물질을 공급한 후 프레싱(pressing)하여 엠보싱부를 형성함에 따라 상기 엠보싱부의 형성 용이성과 균일성의 추구, 가공 단가 및 가공 시간이 감소되는 엠보싱 형성 장치 및 그 형성 방법에 관한 것이다. The present invention relates to an embossing forming apparatus and a method for forming the embossing. More specifically, the embossing portion is formed by supplying a molten material and then pressed to form an embossing portion. An embossing forming apparatus that is reduced and a method of forming the same. 본 발명의 엠보싱 형성 장치의 구성을, 피처리물 상에 엠보싱을 형성하기 위한 용융물질이 채워진 챔버; 상기 챔버에 구비되어 상기 피처리물에 용융물질을 공급하기 위한 분사노즐; 상기 챔버에 구비되어 상기 분사노즐로 공급된 용융물질을 가압하여 성형하는 성형부; 상기 챔버가 상기 피처리물에 대한 승강운동이 가능하게 하는 승강수단; 을 포함하여 이루어진다. The embossing forming apparatus of the present invention includes a chamber filled with a molten material for forming embossing on a workpiece; An injection nozzle provided in the chamber for supplying molten material to the workpiece; A molding part provided in the chamber and configured to pressurize the molten material supplied to the injection nozzle; Lifting means for allowing the chamber to lift and lower the workpiece; It is made, including. 엠보싱 형성 장치, 형성 방법, 엠보싱부, 분사노즐, 성형부 Embossing forming apparatus, forming method, embossing portion, spray nozzle, molding portion

Methods for manufacturing three-dimensional devices and devices created thereby

In certain exemplary embodiments of the present invention, three-dimensional micro-mechanical devices and/or micro-structures can be made using a production casting process. As part of this process, an intermediate mold can be made from or derived from a precision stack lamination and used to fabricate the devices and/or structures. Further, the micro-devices and/or micro-structures can be fabricated on planar or nonplanar surfaces through use of a series of production casting processes and intermediate molds. The use of precision stack lamination can allow the fabrication of high aspect ratio structures. Moreover, via certain molding and/or casting materials, molds having cavities with protruding undercuts also can be fabricated.

Pattern forming method, pattern forming device, method for manufacturing recording medium, and method for manufacturing member

본 발명은 기판 상에의 미세 패턴 형성시에, 감광성 수지가 반응하는 부위를 보다 미소하게 제어하는 동시에, 감광성 수지층의 두께 관리를 보다 간이화할 수 있는 패턴 형성 방법을 실현하는 것을 목적으로 한다. 특히 극단(極短) 펄스 레이저를 그 초점이 기판과 감광성 수지층의 계면에 위치하도록 집광하고 감광성 수지층을 반응시켜 미세 패턴을 형성한다. 이때, 극단 펄스 레이저는 기판측으로부터 조사된다.

Imprint lithography template

Systems, methods, and processes for forming imprint lithography templates from a multi-layer substrate are described. The multi-layer substrate may include a block copolymer layer positioned on a substrate layer. The block copolymer layer may include two or more domains. At least one domain may have a different composition sensitivity than another domain such that the domains have different reactions to a specific process. Reaction of the domains to the specific process may provide a pattern in the block copolymer layer. The pattern may be transferred into the substrate layer to form the imprint lithography template.

Methods for Manufacturing Three-Dimensional Devices and Devices Created Thereby

In certain exemplary embodiments of the present invention, three-dimensional micro-mechanical devices and/or micro-structures can be made using a production casting process. As part of this process, an intermediate mold can be made from or derived from a precision stack lamination and used to fabricate the devices and/or structures. Further, the micro-devices and/or micro-structures can be fabricated on planar or nonplanar surfaces through use of a series of production casting processes and intermediate molds. The use of precision stack lamination can allow the fabrication of high aspect ratio structures. Moreover, via certain molding and/or casting materials, molds having cavities with protruding undercuts also can be fabricated. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. This abstract is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.

Lithographic template

This invention relates to a lithographic template, a method of forming the lithographic template and a method for forming devices with the lithographic template. The lithographic template (10, 110, 210) is formed having a substrate (12, 112, 212) and a charge dissipation layer (20, 120, 220), and a patterned imageable relief layer, (16, 116, 216) formed on a surface (14, 114, 214) of the substrate (10, 110, 210) using radiation. The template (10, 110, 210) is used in the fabrication of a semiconductor device (344) for affecting a pattern in the device (344) by positioning (338) the template (10, 11, 210) in close proximity to semiconductor device (344) by positioning (338) the template (10, 11, 210) in close proximity to semiconductor device (344) having a radiation sensitive material (334) formed thereon and applying a pressure (340) to cause the radiation sensitive material to flow into the relief image present on the template (10, 110, 210). Radiation (342) is then applied through the template (10, 110, 210) to cure portions of the radiation sensitive material and define the pattern in the radiation sensitive material. The template (10, 110, 210) is then removed to complete fabrication of semiconductor device (344).

Compositions and processes for nanoimprinting

Method for manufacturing nano-imprint mould, method for manufacturing light-emitting diode using the nano imprint mould manufactured thereby, and light-emitting diode manufactured thereby

本发明涉及制造纳米压印模具的方法、使用该纳米压印模具的发光二极管以及制造发光二极管的方法。本发明的制造发光二极管的方法包括：在临时基板上形成n型氮化物半导体层、发光层和p型氮化物半导体层的步骤；在p型氮化物半导体层上形成p型电极的步骤；在p型电极上形成导电基板的步骤；通过去除临时基板而露出n型氮化物半导体层的步骤；在n型氮化物半导体层上形成纳米压印抗蚀剂层的步骤；通过将纳米压印模具按压在纳米压印抗蚀剂层上来将纳米图案转印到纳米压印抗蚀剂层上的步骤；将纳米压印模具与具有纳米图案的纳米压印抗蚀剂层分离开的步骤；以及通过刻蚀具有纳米图案的纳米压印抗蚀剂层的一部分来形成n型电极的步骤。本发明得到了一种制造可以有效地并经济地形成用于增强发光二极管的光提取效率的纳米压印模具的方法、制造发光二极管的方法以及利用纳米压印模具的发光二极管。

Diffractive security device and method of manufacturing thereof

Method for fabricating mold

Fabrication of seamless large area master templates for imprint lithography using step and repeat tools

Method of making a sight model, said model, its use as a mold part and said mold

Abstract This invention comprises a process for molding a three dimensional decorative article 16 where cored out or raised portions extend to a depth of at least 0.6 centimeter, said process comprising generating electronically a line drawing 2 of said article and electronically displaying the drawing 3; photographing said drawing to form a photographic transparency 4; positioning said transparency over a layer of a liquid photopolymer having a depth greater than 0.6 centimeter; exposing said photopolymer through said transparency to actinic light 9 to set the photopolymer; and removing the liquid from the set photopolymer to form a three dimensional article 16 having the appearance Or said drawing 2.

Resin stamper for nanoimprint and nanoimprint apparatus using the same

Process for obtaining relief photographs on ceramic products

Methods and systems for embossing microstructures and/or nanostructures

본 발명은 마이크로구조물 및/또는 나노구조물을 엠보싱하기 위한 방법 및 시스템에 관한 것이다. The present invention relates to methods and systems for embossing microstructures and/or nanostructures.

Method of producing a decorated element for a timepiece or piece of jewellery, and decorated element made by the method

本发明的方法能够制造用于钟表或首饰的装饰元件(1)。该装饰元件例如可以是手表表盘。该方法包括以下步骤：取得基底，在所述基底上按照所编程图案微加工形成模具或装饰隔墙(6)，以及用至少一种填充材料(7)填充所述模具或装饰隔墙，以获得装饰元件。该填充材料可以是环氧树脂，该模具或隔墙是通过熔化和凝固焊膏或焊粉而获得的。

Method to produce nanometer-sized features with directed assembly of block copolymers

스탬프를 제조하기 위한 방법, 기판을 패터닝하기 위한 시스템, 및 그러한 방법으로부터 야기된 장치가 제공된다. A method for manufacturing a stamp, a system for patterning a substrate, and an apparatus resulting therefrom are provided.

METHOD OF MANUFACTURING A MICROPOROUS PRINTING PLATE

Structure stamp, device and method for embossing

本发明涉及结构印模(5)，带有：具有微结构化和/或纳米结构化的印模面(2)的柔性印模(1)，印模面(2)用于将与印模面(2)对应的压印结构压印在压印面(6o)上；框架(3)，其用于夹紧印模(1)。此外，本发明涉及用于将压印图案压印在压印面()上的装置，带有以下特征：印模容纳部，其用于容纳根据上述权利要求中任一项所述的结构印模(5)且使之运动；压印材料容纳部，其用于相对于结构印模(5)容纳和布置压印材料(6)；压印元件驱动部，其用于使尤其根据权利要求3、4、7或8中任一项构造的压印元件(8)沿着结构印模(5)运动。此外，本发明涉及对应的方法。

Casting microstructures into stiff and durable materials from a flexible and reusable mold

Described are methods for making microstructured flexible molds, for example useful for making microstructured metal objects in a casting process. Also described are casting methods for making microstructured epoxy objects. In some embodiments, the microstructured metal and epoxy objects are useful for embossing polymer sheets to form microstructured polymer sheets.

Method for producing a stamp for hot embossing

The present invention provides a process for producing a stamp for hot embossing (HE). The stamp can be constructed from any photo-resist epoxy that is stable at temperatures equal to the glass transition temperature (T g) of the material to be stamped. The stamp can be used repeatedly without significant distortion of features. The stamp benefits from low relative cost, high fidelity of features in all three-dimensions and fast construction. The process for producing a stamp for hot embossing from a resist, comprising the steps of producing a seed layer L1 from a selected photoresist polymer material, soft baking the seed layer L1, exposing said seed layer L1 to initiate cross-linking and then post-exposure bake L1 to fully cross-link it, coating the cross-linked seed layer L1 with a second photoresist polymer layer L2; soft baking the second photoresist polymer layer L2; applying a mask to the top surface of the soft baked layer L2 and illuminating the unmasked portions of the soft baked layer L2 with UV radiation through the mask, wherein the exposed areas form the pattern of the embossing features, washing away unexposed regions of the photoresist with a developer to leave behind a relief pattern formed in the second photoresist polymer layer L2, which relief pattern corresponds to a pattern in the mask.

Structured materials and methods

Lithographic template

This invention relates to a lithographic template, a method of forming the lithographic template and a method for forming devices with the lithographic template. The lithographic template (10, 110, 210) is formed having a substrate (12, 112, 212) and a charge dissipation layer (20, 120, 220), and a patterned imageable relief layer, (16, 116, 216) formed on a surface (14, 114, 214) of the substrate (10, 110, 210) using radiation. The template (10, 110, 210) is used in the fabrication of a semiconductor device (344) for affecting a pattern in the device (344) by positioning (338) the template (10, 11, 210) in close proximity to semiconductor device (344) by positioning (338) the template (10, 11, 210) in close proximity to semiconductor device (344) having a radiation sensitive material (334) formed thereon and applying a pressure (340) to cause the radiation sensitive material to flow into the relief image present on the template (10, 110, 210). Radiation (342) is then applied through the template (10, 110, 210) to cure portions of the radiation sensitive material and define the pattern in the radiation sensitive material. The template (10, 110, 210) is then removed to complete fabrication of semiconductor device (344).

Method for realizing a multispacer structure, use of said structure as a mold and circuital architectures obtained from said mold

A method realizes a multispacer structure including an array of spacers having same height. The method includes realizing, on a substrate, a sacrificial layer of a first material; b) realizing, on the sacrificial layer, a sequence of mask spacers obtained by S n PT, which are alternately obtained in at least two different materials; c) chemically etching one of the two different materials with selective removal of the mask spacers of this etched material and partial exposure of the sacrificial layer; d) chemically and/or anisotropically etching the first material with selective removal of the exposed portions of the sacrificial layer; e) chemically etching the other one of the two different materials with selective removal of the mask spacers of this etched material and obtainment of the multispacer structure.

Methods of forming a self-assembled block copolymer material

Methods for fabricating stamps and systems for patterning a substrate, and devices resulting from those methods are provided.

Film mask, method for manufacturing same, and method for forming pattern using film mask and pattern formed thereby

Multistage lithographic template, manufacturing method thereof, and device creation method using the template

For the method preparing the microstructured tool with discontinuous shape characteristic and the goods manufactured by described instrument

本发明公开了一种用于制备具有散布的形貌特征的微结构化工具和从所述工具制备制品的方法，其包括：通过在模制工具（490）的第一微结构化表面上涂布辐射固化性树脂（430）将模制工具改性；使具有第二微结构化表面的第二模制工具（480）接触涂布在第一模制工具（490）的第一微结构化表面上的辐射固化性树脂（430）；将所述辐射固化性树脂暴露于图案化的（450、451、452）照射（440）；将所述第二模制工具（480）与所述部分固化的树脂分离；以及随后从所述模制工具（490）去除未被照射的辐射固化性树脂（区域432）以在所述模制工具上提供改性的微结构化表面（区域431）。本发明还要求了具有不连续的或不同的微结构化特征的制品。