Гибридный сегментированный электрод для металлизированного пленочного конденсатора

Полезная модель относится к электротехнике, а именно к электроду металлизированного пленочного конденсатора постоянной емкости, и может быть использована при изготовлении конденсаторов в импульсной и силовой технике. Уменьшение сопротивления электрода конденсатора является техническим результатом, который достигается за счет того, что электрод выполнен из тонкой электропроводящей пленки и образован элементами с низким поверхностным сопротивлением, электрически соединенными между собой элементом с более высоким поверхностным сопротивлением, при этом элементы с низким поверхностным сопротивлением не имеют прямого контакта друг с другом, а область между ними представляет собой элемент с более высоким поверхностным сопротивлением. Элементы с низким поверхностным сопротивлением имеют поверхностное сопротивление в диапазоне 3-6 Ом/квадрат, а элемент с более высоким поверхностным сопротивлением имеет поверхностное сопротивление в диапазоне 20-40 Ом/квадрат. Элементы с низким поверхностным сопротивлением ...

УСТРОЙСТВО НАКОПЛЕНИЯ ЗАРЯДА, СПОСОБ ЕГО ИЗГОТОВЛЕНИЯ, СПОСОБ ИЗГОТОВЛЕНИЯ ЭЛЕКТРОПРОВОДЯЩЕЙ СТРУКТУРЫ ДЛЯ УСТРОЙСТВА, МОБИЛЬНОЕ ЭЛЕКТРОННОЕ УСТРОЙСТВО, ИСПОЛЬЗУЮЩЕЕ УСТРОЙСТВО, И МИКРОЭЛЕКТРОННОЕ УСТРОЙСТВО, СОДЕРЖАЩЕЕ УСТРОЙСТВО

... 1. Устройство накопления заряда, содержащее:первую электропроводящую структуру и вторую электропроводящую структуру, отделенные друг от друга электрическим изолятором,при этом:по меньшей мере одна электропроводящая структура из первой электропроводящей структуры и второй электропроводящей структуры содержит пористую структуру, содержащую множество каналов; икаждый из каналов имеет отверстие на поверхности пористой структуры.2. Устройство накопления заряда по п.1, в котором:наименьший размер каждого из каналов составляет не менее 2 нанометров.3. Устройство накопления заряда по п.1, в котором:наименьший размер каждого из каналов составляет не более 1 микрометра.4. Устройство накопления заряда по п.1, в котором:пористая структура состоит из материала, выбранного из группы, содержащей кремний, германий, карбид кремния, кремний-германий, алюминий, вольфрам и медь.5. Устройство накопления заряда по п.1, дополнительно содержащее:электропроводящее покрытие по меньшей мере на участке пористой структуры ...

Kondensator mit verbessertem linearen Verhalten

Kondensator, umfassend – eine erste und eine zweite elektrisch leitende Lage, – eine erste und eine zweite in der ersten Lage strukturierte Elektrode und eine dritte in der zweiten Lage strukturierte Elektrode, – eine zwischen den leitenden Lagen angeordnete dielektrische Lage, wobei – ein Teil der ersten Elektrode und ein Teil der zweiten Elektrode jeweils zumindest einen Teil der dritten Elektrode überlappen, – die erste Elektrode und die zweite Elektrode Anschlusselektroden des Kondensators sind und – die dielektrische Lage eine Spiegellage eines mit akustischen Wellen arbeitenden Bauelements ist.

MEHRSCHICHT-KERAMIKKONDENSATOR

Elektrisches Bauelement, Bauelementanordnung und Verfahren zur Herstellung eines elektrischen Bauelements sowie einer Bauelementanordnung

Es wird ein elektrisches Bauelement (1) zur Einbettung in einen Träger (9) angegeben. Das Bauelement weist einen keramischen Grundkörper (2), eine elektrisch isolierende Passivierungsschicht (4), die auf dem Grundkörper (2) aufgebracht ist, und wenigstens eine Innenelektrode (3) auf. Zudem weist das Bauelement (1) eine Außenelektrode (5) auf, die mit der Innenelektrode (3) verbunden ist, wobei die Außenelektrode (5) eine erste Elektrodenschicht (6) aufweisend ein Metall und eine darauf angeordnete zweite Elektrodenschicht (7) aufweisend Kupfer aufweist.

Dielectric material and capacitor comprising the dielectric material

A dielectric material suitable for use in an electronic component includes bismuth ferrite (BiFeO3); strontium titanate (SrTiO3) and an additive of barium titanate (BaTiO3). The barium titanate reduces the temperature capacitance change of the dielectric material and allows for increased working voltages. The material is useful for the construction of capacitors, and particularly capacitors intended for use at high temperatures. Also provided are a capacitor including the dielectric material, methods of manufacturing the dielectric material and the capacitor, and the use of an additive to improve the lifetime and/or reduce the dissipation factor of a capacitor. The capacitor 100 comprises a first electrode 12, a second electrode 14 and a capacitive layer 16 of the dielectric material. The dielectric material can be formed into the capacitive layer 16 by sintering a powder or sintering a slurry containing the powder.

Improvements in or relating to units for suppression of electrical interference

... 712,650. Impedance networks. STANDARD TELEPHONES & CABLES, Ltd. Feb. 18, 1952, No. 4223/52. Drawings to Specification. Class 40 (8). [Also in Group XXXVI] Relates to various forms of construction of radio interference suppression condensers (see Group XXXVI) with each form possessing the feature of low self-inductance due to terminal or e!ectrode connections being brought out at regular intervals from each end of each electrode. The Specification uses inductance-capacity networks, Figs. 7 and 8 (not shown), in explaining the low value of self-inductance for a roll-type capacitor. Reference has been directed by the Comptroller to Specification 680,432, [Group XXXVI].

Improvements in or relating to electrical condensers

... 432,793. Condensers. PORZELLANFABRIK KAHLA, Kahla, Thuringia, Germany. Oct. 30, 1933, Nos. 30096, 30097, and 30098. Convention dates, Oct. 29, 1932, Sept. 13, 1933, and Sept. 13, 1933. [Class 38 (ii)] A condenser is made with heat-resisting ceramic insulating material 10 as the dielectric, the armatures 11 being produced by burning on layers of precious metal by a process such as that described in Specification 407,599. The metal coatings may be reinforced by metal layers 12 applied by spraying or other dry process. The coatings, or the reinforcing layers, may be protected from damp by a covering of damp resisting insulating material. In the example shown this covering may fill a hollow space formed in the dielectric mass.

HIGH TENSION CAPACITOR

The simple, high-voltage capacitor for this invention has larger electrostatic capacitance than that of existing high-voltage condensers. It is easily supplied to ignition systems of internal combustion engines for automobiles and electric generators. A capacitor consists of aggregated alternative sheets of electrically insulating material and metal foil (2-4), the sheets being wound over a high voltage cable or pad of a terminal (14). An external layer or layers of insulation (6) are provided and optionally a grounding lead (8). ...

A buffer capacitor

A buffer capacitor is comprised of two endplates, separated by a dielectric layer 12. Said endplates are comprised of a loop of electrically conductive material 10 with a layer of dielectric material 11 interposed within the loop. Said electrically conductive material may be rigid or flexible. The endplates may further comprise an electrode or connector 13.

A power controller

HIGH VOLTAGE CAPACITOR WITH HIGH ENERGY DENSITY

An elementary capacitor of high energy density and high voltage, for energy accumulation, discharge, commutation or filtering purposes, comprises two layers A,B formed by a metallization 4,4 having a resistance per surface unit of between 2 and 30 ohm being applied on a fibrous support 5,5' and having at least one further dielectric 6, 7,6',7', two such layers forming the capacitor, which is impregnated with a liquid dielectric and is self-healing. The thickness and the nature of each dielectric as well as the liquid dielectric are so selected to ensure that when the rated voltage is applied, the ratio between the prevailing electric field strength and the disruptive strength is substantially equal for each of the dielectrics. When this capacitor is charged to its rated voltage, the average electric field strength prevailing in the dielectric is between about 200 V/ mu m and more than 400 V/ mu m, and the volumetric energy density is between about 0,5 J/cm<3> and more than 2 J/cm<3>. Подробнее

FIXED CAPACITOR AND ITS MANUFACTURING PROCESSES

Voltage dividing device with rod structure

Die Erfindung betrifft eine Spannungsteilungsvorrichtung (1), umfassend einen Kernbereich (2) mit einer im Kernbereich (2) angeordneten Kondensatoranordnung und einen im Kernbereich (2) angeordneten elektrischen Widerstand (3), eine erste Elektrode (4) der Kondensatoranordnung mit einem Koppelteil (5), wobei ein spannungsführendes Element über das Koppelteil (5) mit der Spannungsteilungsvorrichtung (1) elektrisch leitend verbindbar ist, eine zweite Elektrode (6) der Kondensatoranordnung mit einem Erdungsteil (7), wobei eine Erdung über das Erdungsteil (7) mit der Spannungsteilungsvorrichtung (1) elektrisch leitend verbindbar ist, wobei die erste Elektrode (4) und die zweite Elektrode (6) elektrisch leitend über den elektrischen Widerstand (3) verbunden sind, und wobei die erste Elektrode (4) und die zweite Elektrode (6) mehrere elektrisch leitende, im Wesentlichen fingerförmige oder stabförmige, Aussteuerungselemente (9) umfassen. Die Erfindung betrifft ferner die Anordnung einer Spannungsteilungsvorrichtung ...

Metal fiber/metal powder sheet and process for making same

HIGH TENSION CAPACITOR

ELECTRICAL CHARGE STORAGE DEVICE HAVING ENHANCED POWER CHARACTERISTICS

The present invention relates generally to an electrical charge storage device (ECSD) with enhanced power characteristics. More particularly, the present invention relates to enhancing the current density, voltage rating, power transfer characteristics, frequency response and charge storage density of various devices, such as capacitors, batteries, fuel cells and other electrical charge storage devices. For example, one aspect of the present invention is solid state and electrolytic capacitors where the conductor surface area is increased with smooth structures, thereby reducing the distance separating the conductors, and improving the effective dielectric characteristics by employing construction techniques an atomic, molecular, and macroscopic levels.

OLIGOMERIC DIELECTRIC MATERIALS AND CAPACITOR THEREOF

A metadielectric composite oligomeric organic material according to the formulae: ( D )p`-[ C ]-( A )q` or ( D )p`-[C]-( D )q` wherein C is a linear chain oligomeric polarizable core, wherein the linear chain oligomeric polarizable core possesses at least two different monomers with differing electron affinity, and the different monomers are positioned such that an electron affinity gradient is present, and there is either at least one electron-donor group or electron-rich monomer, D, and at least one electron-acceptor group or electron-poor monomer, A, or electron-donor group or electron-rich monomer, D, attached at each end of the oligomeric polarizable core, p' and q' represent the number of electron-donor and electron-acceptor groups present, respectively, and are any integer greater than zero, and at least one resistive insulating group is covalently attached to the molecular structure at any location.

CAPACITORS HAVING A HIGH ENERGY DENSITY

Kondensator mit unsymmetrischem Aufbau der leitenden Schichten.

Echappement.

Kondensator.

Verfahren zur Herstellung von Kondensatorplatten.

Elektrischer Schichtkondensator

Verfahren zur Herstellung eines Metallpapierkondensators

HIGH-VOLTAGE CAPACITOR WITH HIGH ENERGY DENSITY.

High power-energy source for e.g. industrial purposes, has battery, injector, anode, cathode and plate arranged in parallel, thin dielectric layer arranged between anode and cathode, and dielectric layer arranged between cathode and plate

The source has a tunnel current battery (100) i.e. high voltage battery, made from metal and provided with a semiconductor disk, an injector, an anode (3), a cathode (4) and a control plate (2) arranged in parallel. A thin dielectric layer (5) is arranged between the anode and the cathode, and a dielectric layer (6) is arranged between the cathode and the control plate. The tunnel current battery has an anode connection (7) electrically connected with the anode and a cathode connection (8) electrically connected with a cathode plate.

ПРИСТРІЙ НАКОПИЧЕННЯ ЕЛЕКТРИЧНОГО ЗАРЯДУ

Даний винахід стосується, головним чином, пристрою для накопичення електричного заряду з поліпшеними показниками, що характеризують густину струму, номінальну напругу, перехідні характеристики потужності, частотні характеристики і густину накопичення заряду різних пристроїв, наприклад конденсаторів, батарей, паливних елементів та інших пристроїв накопичення електричного заряду.

Orientation-insensitive ultra-wideband coupling capacitor and method of making

An orientation-insensitive ultra-wideband coupling capacitor. The orientation insensitive ultra-wideband coupling capacitor includes a plurality of external surfaces, a low frequency portion, and a high frequency portion. The high frequency portion is so disposed on, and electrically connected to, the low frequency portion so as to allow the orientation insensitive ultra-wideband coupling capacitor to work identically when mounted on any external longitudinal surface of the plurality of external surfaces thereof and thereby be readily SMT compatible without regard to special orienting procedures.

Laminated ceramic electronic component and manufacturing method thereof

Orientation-insensitive ultra-wideband coupling capacitor and method of making

An orientation-insensitive ultra-wideband coupling capacitor. The orientation insensitive ultra-wideband coupling capacitor includes a plurality of external surfaces, a low frequency portion, and a high frequency portion. The high frequency portion is so disposed on, and electrically connected to, the low frequency portion so as to allow the orientation insensitive ultra-wideband coupling capacitor to work identically when mounted on any external longitudinal surface of the plurality of external surfaces thereof and thereby be readily SMT compatible without regard to special orienting procedures.

Multilayer ceramic capacitor and circuit board for mounting the same

A multilater ceramic capacitor includes: a ceramic body in which a plurality of dielectric layers are laminated; and an active layer including a plurality of first and second internal electrodes formed to be alternately exposed to both end surfaces of the ceramic body with the dielectric layer interposed therebetween, and forming capacitance. An upper cover layer is formed on an upper portion of the active layer; a lower cover layer is formed on a lower portion of the active layer and having a thickness greater than that of the upper cover layer. First and second external electrodes cover both end surfaces of the ceramic body. Specific sizing of ceramic body and electrodes is defined.

Capacitor, integrated device, radio frequency switching device and electronic apparatus

The invention provides a capacitor, an integrated device, a radio frequency switching device and an electronic apparatus which can inhibit the influence of signal processed in an active element while obtaining sufficient capacitance density. According to one embodiment, a capacitor includes a substrate, a first electrode, a second electrode, and a first dielectric portion. The substrate includes an insulating layer and a semiconductor layer provided on the insulating layer. The semiconductor layer includes a dummy active region electrically isolated from an active region including an active element. The first electrode and the second electrode are located to oppose each other above the dummy active region. The first dielectric portion is provided between the first electrode and the secondelectrode.

Multilayer ceramic electronic component, manufacturing method thereof and circuit board with same

Condensers with dielectric mica with money electrodes applied and their manufactoring process

THREE-DIMENSIONAL AND PROCEEDED CONDENSER OF TOPOLOGICAL DESIGN Of SUCH a CONDENSER.

STRUCTURE HAS ENHANCED CAPACITY

Structure à capacité de type Métal-Isolant-Métal (1) comprenant un substrat (2), une première couche isolante (14) électriquement disposée sur le substrat (2), une électrode inférieure (6) disposée sur la première couche isolante (14), une couche de métal structurée (12) comprenant une pluralité de pores disposée sur l'électrode inférieure (6), une capacité (4) MIM comprenant une première couche conductrice (18) disposée sur la couche de métal structurée (12) en contact avec l'électrode inférieure (6) et à l'intérieur des pores, une couche diélectrique (20) recouvrant la première couche conductrice (18), une seconde couche conductrice (24) recouvrant la couche diélectrique (20) en contact avec une électrode supérieure (8) disposée sur la capacité (4) MIM, une seconde couche isolante (16) électriquement disposée sur l'électrode supérieure (8).

CAPACITOR COMPONENT AND METHOD FOR MANUFACTURING THE SAME

Package type multi layer thin film capacitor for high capacitance

MULTI-LAYERED CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME

복합 전자 부품

... 접합되는 복수의 전자 부품 중 기판형의 전자 부품에서의 상면 도체끼리의 절연 저항의 저하를 억제할 수 있는 복합 전자 부품을 제공한다. 복합 전자 부품(1A)은 제1 전자 소자(20A)와, 제2 전자 소자(10)와, 접합재(31)를 포함한다. 제1 전자 소자(20A)는, 기부(21)와 기부(21)의 상면(21a)에 마련된 상면 도체(24A)를 갖는다. 제2 전자 소자(10)는, 기부(21)의 상면(21a)에 대향하는 하면(11a)을 갖는 소자 본체(11)와, 소자 본체(11)의 하면(11a)에 마련된 단자 도체(14A)를 갖는다. 접합재(31)는 상면 도체(24A)와 단자 도체(14A)를 접합한다. 상면 도체(24A)는, 중량비에서 최대의 금속 성분이 Ag인 도전층(24a)을 포함한다. 도전층(24a)의 측면(24a1)은, 보호 금속막으로서의 도전층(24b, 24c)에 의해 덮이고, 보호 금속막으로서의 도전층(24b, 24c)에 함유된 중량비에서 최대의 금속 성분은 Ag 및 Cu 이외이다.

MULTI-LAYERED CERAMIC ELECTROIC COMPONENTS AND BOARD HAVING THE SAME MOUNTED THEREON

박막 커패시터 및 그 제조방법

... 본 개시의 일 실시 예에 따른 박막 커패시터는 기판 상에 복수의 제1 전극층 및 유전체층을 사이에 두고 복수의 제1 전극층과 교대로 적층된 복수의 제2 전극층을 포함하는 바디를 포함하며, 제1 및 제2 전극층의 평균 표면 거칠기는 유전체층의 평균 표면 거칠기보다 작은 것을 만족함으로써, 용량 확보와 유전체층의 특성을 모두 확보할 수 있다.

EMBEDDED MULTILAYER CERAMIC ELECTRONIC PART AND PRINT CIRCUIT BOARD HAVING EMBEDDED MULTILAYER CERAMIC ELECTRONIC PART

MULTILAYER CERAMIC CAPACITOR AND METHOD FOR MANUFACTURING THE SAME

High Capacitance Multilayer with High Voltage Capability

MULTI-LAYERED CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME

ELECTRIC SHOCK PROTECTION DEVICE AND PORTABLE ELECTRONIC DEVICE INCLUDING SAME

Provided is an electric shock protection device. An electric shock protection device according to an embodiment of the present invention comprises: a body having a volume of 0.025 to 0.060 mm^3 and including a barium titanate-based component and a vitreous component; and an internal electrode disposed within the body. The electric shock protection device is realized as an electric shock protection function of preventing leakage current or static electricity from being introduced into the electric shock protection device is combined with a signal transfer function of letting incoming data signals through the electric shock protection device by inhibiting the attenuation of the incoming data signals. Accordingly, even though the electric shock protection device is realized to be compact and slim, the electric shock protection device may protect a user from leakage current from a power source and protect an internal circuit from outside static electricity. In addition, the electric shock protection ...

CAPACITOR

The present invention relates to a capacitor. Especially, the capacitor includes an electrode layer which includes a first electrode layer and a second electrode layer formed on a dielectric layer. The first electrode layer and the second electrode layer are separated from each other. At least part of the first electrode layer and the second electrode layer is arranged on the same surface. Thereby, the capacitor can facilitate a process of applying electricity. The capacitor can be easily manufactured by allowing the first and second electrode layers to function as electrodes charged with different polarities. The capacitor of a simple structure can be obtained. COPYRIGHT KIPO 2016 ...

MULTILAYER CAPACITOR AND MANUFACTURING METHOD THEREOF

The present invention relates to a multilayer capacitor with improved capacitance and a manufacturing method thereof. According to the present invention, the multilayer capacitor comprises: a first group electrode including n + 1 (wherein, n is a natural number of two or more) capacitor electrodes overlapped with each other along a first direction to be stacked and connected with each other in a first side part which is one end part of a second direction intersecting the first direction; a second group electrode including n capacitor electrodes placed between two capacitor electrodes of the first group electrode faced with each other and connected with each other in a second side part facing the first side part in the second direction; and a dielectric layer filling all separation areas where the first and the second group electrode are faced with each other. COPYRIGHT KIPO 2016 ...

CERAMIC CAPACITOR AND METHODS OF MANUFACTURE

MULTILAYER CERAMIC ELECTRONIC COMPONENT

The present invention relates to a multilayer ceramic electronic component capable of improving breakdown voltage (BDV), controlling relaxation time, having high capacity, and being miniaturized. The multilayer ceramic electronic component comprises: a ceramic body in which a first dielectric layer having one side on which a first inner electrode is disposed and a second dielectric layer having one side on which a second inner electrode is disposed are alternately laminated; a first outer electrode disposed on a first surface of the ceramic body and connected with the first inner electrode; and a second outer electrode disposed on a second surface of the ceramic body and connected with the second inner electrode. The first inner electrode is exposed to the first surface of the ceramic body. The second inner electrode is exposed to the second surface of the ceramic body. The first inner electrode and the second electrode are not overlapped in a direction in which the first dielectric layer ...

DIELECTRIC CERAMIC COMPOSITION, DIELECTRIC MATERIAL, AND LAMINATED CERAMIC CAPACITOR CONTAINING SAME

According to an embodiment of the present invention, provided is a dielectric ceramic composition which contains barium titanate -based base material main component and additional components. A crystal grain of which Ca content in a microstructure after sintered is less than 2.5 mol% is designated as a first crystal grain, whereas a crystal grain of which Ca content is 4.0-12.0 mol% becomes a second crystal grain. The ratio of average size of the second sintered crystal grain to that of the first sintered crystal grain ranges from 1.6 to 22. COPYRIGHT KIPO 2017 ...

ELECTRIC DOUBLE-THIN SHEETS

Combination stiffener and capacitor

FORFARANDE FOR FRAMSTELLNING AV SKIKT AV TANTAL FOR TUNNSKIKTSKONDENSATORER RESP.- MOTSTAND

Electronic component and its manufacturing method

The subject of the present invention is to provide an electronic component, which has stable and tough characteristics for the effects from outside, and its manufacturing method. The solving means is to have the followings in an electronic component: a magnetic sintered body 11, which has an embedded internal electrode 13; and an external electrode 12, which is formed on the outer surface of this magnetic sintered body 11 and is connected to the internal electrode stated above. After an external electrode having multiple pores 12a is formed in the sintered body 11, the sintered body is impregnated in the resin through the pores 12a. Buffer material 14 is interposed between the magnetic sintered body 11 and the internal electrode 13; and the pores 12a of the external electrode 12 are impregnated with a substance of the same sort as that of the buffer material 14. Therefore, even the internal electrode 13 and the magnetic sintered body 11 are individually expanded or contracted, the stress ...

Multilayer ceramic capacitor and board having the same mounted thereon

ELECTRICAL DEVICE

Disclosed is an electrical device (100) comprising dielectric layers (1-10), conductor plates (11-14, 21-25), anode electrodes (30, 40) and cathode electrodes (50, 60). The conductor plates (11-14) and the conductor plates (21-25) are alternately arranged in the width direction (DR1) of the electrical device (100). The anode electrodes (30, 40) are connected to the conductor plates (11-14) at a certain distance. The cathode electrodes (50, 60) are connected to the conductor plates (21-24) at a certain distance. The electrical device (100) is mounted on a substrate in such a manner that the bottom surface (100A) of the device is in contact with the substrate. The anode electrode (30) is connected to a first signal line arranged on the substrate and having a width generally equal to that of the electrical device (100), while the anode electrode (40) is connected to a second signal line arranged on the substrate and having a width generally equal to that of the electrical device (100).

DIELECTRIC COMPONENTS AND METHOD OF MANUFACTURE

A method of forming a dielectric component, such as a capacitor is disclosed. In such a method, a conductive surface is applied to a dielectric to form a coated dielectric. Then a portion of the conductive surface is removed from the coated dielectric to form at least two electrically isolated conductive areas.

Electronic Component

An element body includes first and second end surfaces opposing each other in a first direction, first and second side surfaces opposing each other in a second direction, and first and second principal surfaces opposing each other in a third direction. The length of the element body in the second direction is shorter than that of the element body in the first direction, and the length of the element body in the third direction is shorter than that of the element body in the second direction. A pair of first external electrodes is disposed at both ends of the element body in the first direction. A second external electrode is disposed on the element body and positioned between the pair of first external electrodes. The second external electrode includes a first conductor part disposed on the first side surface. A depression is formed in the first conductor part.

ELECTRONIC DEVICE

An electronic device in which an equivalent series inductance including a parasitic inductance of a capacitor and an inductance of wiring of a mount board may be decreased is provided. An electronic device includes a first terminal conductor, a second terminal conductor, a third terminal conductor, and a fourth terminal conductor; one or a plurality of first inner electrodes, and one or a plurality of second inner electrodes; and a connection conductor. The one or plurality of first inner electrodes are connected to the first terminal conductor. The one or plurality of second inner electrodes are connected to the second terminal conductor. Each of the first inner electrodes and each of the second inner electrodes are stacked via a dielectric. The third terminal conductor and the fourth terminal conductor are connected by the connection conductor.

ELECTRONIC COMPONENT

An electronic component includes a substrate including electrode pads disposed on an upper surface; and a plurality of multilayer capacitors mounted on the substrate and including external electrodes connected to the electrode pads. At least one multilayer capacitor among the plurality of multilayer capacitors is a multilayer capacitor of a horizontally stacked structure.

MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

There are provided a multilayer ceramic electronic component and a manufacturing method thereof. The multilayer ceramic electronic component includes: a body part including internal electrodes and dielectric layers and having at least one connection surface to which a portion of the internal electrodes are exposed; external electrodes coupled to the connection surface to thereby be electrically connected to the internal electrodes; and protective layers provided on the connection surface so as to shield at least portions of the internal electrodes exposed at the connection surface, wherein a width of an exposed part of the internal electrode shielded by the protective layer has 0.8 to 0.9 of that of an overall width of the internal electrode.

Low tunneling current MIM structure and method of manufacturing same

Disclosed herein are new MIM structures having increased capacitance with little or no tunneling current, and related methods of manufacturing the same. In one embodiment, the new MIM structure comprises a first electrode comprising a magnetic metal and having a magnetic moment aligned in a first direction, and a second electrode comprising a magnetic metal and having a magnetic moment aligned in a second direction antiparallel to the first direction. In addition, such an MIM structure comprises a dielectric layer formed between the first and second electrodes and contacting the first and second magnetic metals.

Manufacturing method for electrodes that inhibit corona effect on ceramic capacitor

A manufacturing method for electrodes that inhibit corona effect on ceramic capacitor is disclosed. It is mainly to coat the two electrodes of a ceramic capacitor (including AC ceramic capacitor and DC ceramic capacitor) by printing or chemical electroless plating and vapor deposition. Then, the coating overflow area of the ceramic capacitor is subject to polishing treatment, so the cross-section of the two electrodes of the ceramic capacitor is completely covered by conductive layer and electrode leakage is eliminated. Besides, withstanding voltage is thus increased and corona effect is inhibited.

Nanofiber surface based capacitors

This invention provides novel capacitors comprising nanofiber enhanced surface area substrates and structures comprising such capacitors, as well as methods and uses for such capacitors.

Photogravure pressure and method for manufacturing multilayer ceramic electronic component

In a print area provided on a peripheral surface of a gravure roll, a plurality of cells are defined by printing-direction walls and perpendicular walls, and each perpendicular wall has a plurality of cuts. In a center portion of the print area, most intersections of the printing-direction walls and the perpendicular walls are defined by T-shaped intersections where the perpendicular walls do not cross the printing-direction walls, but meet the printing-direction walls in a T-shaped arrangement. Preferably, round chamfers are provided at corners where a portion of each printing-direction wall and a portion of each perpendicular wall intersect, and at leading ends of the perpendicular walls pointing toward the cuts.

Multi layer ceramic capacitor

A multi-layer ceramic capacitor is made up of a laminated body in which ceramic layers and internal electrodes are laminated on one another, and external electrodes are provided at end portions of the laminated body, in which the internal electrodes extend to either one of at least a pair of edges of the ceramic layers opposing each other, thereby leading the internal electrodes to end surfaces of the laminated body opposing each other, respectively, and connecting the internal electrodes led out to the end surfaces of the laminated body to the external electrodes, respectively, whereby internal electrodes facing each other through the ceramic layers within the laminated body through the ceramic layers are formed by conductor particles lying between the ceramic layers end-to-end, along a boundary surface between the ceramic layers, continuously. In the internal electrodes are provided spaces where no conductor particles exist, and the number of conductor particles lying along the boundary ...

METHOD OF MANUFACTURING A SINGULATED FEEDTHROUGH INSULATOR FOR A HERMETIC SEAL OF AN ACTIVE IMPLANTABLE MEDICAL DEVICE INCORPORATING A POST CONDUCTIVE PASTE FILLED PRESSING STEP

A method for manufacturing a singulated feedthrough insulator for a hermetic seal of an active implantable medical device (AIMD) is described. The method begins with forming a green-state ceramic bar with a via hole filled with a conductive paste. The green-state ceramic bar is dried to convert the paste to an electrically conductive material filling via hole and then subjected to a pressing step. Following pressing, a green-state insulator is singulated from the green-state ceramic bar. The singulated green-state insulator in next sintered to form an insulator that is sized and shaped for hermetically sealing to close a ferrule opening. The thusly produced feedthrough is suitable installation in an opening in the housing of an active implantable medical device.

MIM capacitor with enhanced capacitance

A method of forming a metal-insulator-metal capacitor having top and bottom plates separated by a dielectric layer, one of the top and bottom plates having at least one protrusion extending into a corresponding cavity in the other of the top and bottom plates, the method including the steps of growing one or more nanofibers on a base surface.

MULTIPLE LAYER CYLINDRICAL CAPACITOR

Aspects generally relate to multilayer capacitor structures formed in vias in a substrate of an integrated circuit. The multilayer cylindrical capacitor includes multiple cylindrical conductive layers formed in the via and separated by multiple cylindrical insulating layers between the plurality of cylindrical conductive layers. The cylindrical conductive layers form plates of the multilayer cylindrical capacitor.

CONDUCTIVE COATINGS FOR CAPACITORS AND CAPACITORS EMPLOYING THE SAME

The present invention provides a novel conductive coating for capacitors, and a capacitor employing the conductive coating. The conductive coating of the present invention includes two types of coatings, i.e. thermosetting conductive coatings and thermoplastic conductive coatings. The thermosetting conductive coating of the present invention includes an epoxy resin, a curing agent for the epoxy resin, nonmetallic silver-plated particles and a solvent. The thermoplastic conductive coating of the present invention includes a thermoplastic resin, nonmetallic silver-plated particles and a solvent; wherein the thermoplastic resin is a fluorine rubber. 1. A conductive coating for capacitors , comprising:5 to 30 wt % of an epoxy resin;0.5 to 5 wt % of a curing agent for the epoxy resin;20 to 50 wt % of nonmetallic silver-plated particles; and40 to 70 wt % of a solvent.2. The conductive coating according to claim 1 , wherein the epoxy resin is a biphenol based epoxy resin or novolac based epoxy resin.3. The conductive coating according to claim 2 , wherein the epoxy resin is a biphenol A based epoxy resin.4. The conductive coating according to claim 1 , wherein the curing agent is an amine based curing agent or an imidazole based curing agent.5. The conductive coating according to claim 4 , wherein the curing agent is triethanolamine.6. The conductive coating according to claim 1 , wherein the nonmetallic silver-plated particles satisfy at least one of the following conditions:{'sup': '3', 'a density is 3 to 5 g/cm,'}an average particles size is 5 to 100 μm, andan amount of plated silver of 20 to 60 wt %, based on the total amount of the nonmetallic silver-plated particles.7. The conductive coating according to claim 1 , wherein the nonmetallic material of the nonmetallic silver-plated particles is one or more selected from glass claim 1 , boron nitride claim 1 , calcium carbonate claim 1 , carbon black claim 1 , carbon fiber claim 1 , alumina and polymer materials.8. The ...

Folding type capacitor comprising through hole

A folding type capacitor includes a metal substrate wherein a through hole penetrates an inside thereof; at least one dielectric layer formed on a surface of the metal substrate and an inner peripheral surface of the through hole; and an electrode layer formed on the at least one dielectric layer, wherein the metal substrate has bending portions whose surfaces are facing each other. Thus, manufacturing process is more simplified since Al2O3 insulation layers are formed by anodizing the aluminum layer without forming the extra dielectric layers after forming the aluminum layer, so that the manufacturing cost can be reduced, and also a multi-stacked capacitor having a high capacitance and a high reliability can be provided by stacking capacitors including a plurality of aluminum oxide layers using a more simplified process.

Multilayer ceramic capacitor and circuit board for mounting the same

A multilater ceramic capacitor includes: a ceramic body in which a plurality of dielectric layers are laminated; and an active layer including a plurality of first and second internal electrodes formed to be alternately exposed to both end surfaces of the ceramic body with the dielectric layer interposed therebetween, and forming capacitance. An upper cover layer is formed on an upper portion of the active layer; a lower cover layer is formed on a lower portion of the active layer and having a thickness greater than that of the upper cover layer. First and second external electrodes cover both end surfaces of the ceramic body. Specific sizing of ceramic body and electrodes is defined.

Electronic component and manufacturing method thereof

In an electronic component including: a sintered body with an internal electrode embedded; and an external electrode formed on the outer surface of this sintered body that is connected to the above internal electrode, a porous external electrode having numbers of pores is formed in the sintered body and thereafter the resin is impregnated through the pores. Thereby the pores of the external electrode are impregnated with a substance of the same sort as that of the buffer material as well as the buffer material interposes between the sintered body and the internal electrode.

CHIP-TYPE ELECTRONIC COMPONENT

A chip-type electronic component has: a ceramic element body; a plurality of first and second internal electrodes arranged in the ceramic element body so as to be opposed at least in part to each other; a first external connection conductor to which the plurality of first internal electrodes are connected; a second external connection conductor to which the plurality of second internal electrodes are connected; first and second terminal electrodes; a first internal connection conductor arranged in the ceramic element body and connecting the first external connection conductor and the first terminal electrode; and a second internal connection conductor arranged in the ceramic element body and connecting the second external connection conductor and the second terminal electrode. The number of the first internal connection conductor is set to be smaller than the number of the first internal electrodes and the number of the second internal connection conductor is set to be smaller than the ...

Multilayer capacitor

A multilayer capacitor includes a capacitor body, a first external electrode, and a second external electrode. The capacitor body includes a plurality of first and second internal electrodes alternately stacked with dielectric layer interposed therebetween. The first and second external electrodes are electrically connected to the first and second internal electrodes, respectively. A first Schottky layer is Schottky-junctioned to an interface between the dielectric layer and the first internal electrode in the capacitor body. A second Schottky layer is Schottky-junctioned to an interface between the dielectric later and the second internal electrode in the capacitor body. The work function values of the first and second Schottky layers is higher than the work function values of the first and second internal electrodes.

CAPACITOR UNIT

In a capacitor unit including a pair or a plurality of pairs of capacitors having a dielectric, a first electrode formed on the dielectric, and a second electrode formed on the dielectric, wherein voltages in reverse directions are applied between the first electrodes and the second electrodes of respective two capacitors forming a pair.

MULTILAYER CERAMIC ELECTRONIC COMPONENT

There is provided a multilayer ceramic electronic component including a ceramic body having internal electrodes formed therein, external electrodes formed on external surfaces of the ceramic body and connected to the internal electrodes, and a buffer layer formed on surfaces of contact between the internal electrodes and the external electrodes among external surfaces of the ceramic body, in an interior direction of the ceramic body, wherein when a thickness of the external electrode is denoted by T, a thickness of the buffer layer is denoted by t, a thickness of an active region is denoted by TA, and a thickness of the ceramic body is denoted by Tc, T10 m, TA/TC>0.8, and t5 m, so that a multilayer ceramic electronic component having excellent reliability may be realized.

MULTI-LAYER CERAMIC ELECTRONIC COMPONENT AND CIRCUIT BOARD

A multi-layer ceramic electronic component that satisfies the following: 30 μm≤Ts≤100 μm, 6 μm≤T≤18 μm, and 0.19≤(2T+t)/Ts≤1.55, where Ts represents a dimension of a ceramic body measured along a first axis, T represents a mean value of thickness dimensions of upper and lower portions of an external electrode measured along the first axis that cover edges of top and bottom surfaces of the ceramic body, and t represents a sum of thickness dimensions of internal electrodes drawn to and in contact with the external electrode.

ELECTRONIC COMPONENT

An interposer includes a plurality of first connection electrodes each of which is arranged on either of first- and second-side-surface sides of a first principal surface of a substrate; a plurality of second connection electrodes each of which is arranged on either of first- and second-side-surface sides of a second principal surface of the substrate; and a plurality of third connection electrodes each of which is arranged on either of first and second side surfaces. Each of the first connection electrodes has a first portion located away from an edge of the first principal surface, and a second portion extending from the first portion to the edge and connected to the third connection electrode. Each of the second portion of each first connection electrode and the plurality of third connection electrodes has a width smaller than a width of the first portion of each first connection electrode.

Polymerization method for preparing conductive polymer

A improved process for preparing a conductive polymer dispersion is provided as is an improved method for making capacitors using the conductive polymer. The process includes providing a monomer solution and shearing the monomer solution with a rotor-stator mixing system comprising a perforated stator screen having perforations thereby forming droplets of said monomer. The droplets of monomer are then polymerized during shearing to form the conductive polymer dispersion.

Co-fired hermetically sealed feedthrough with alumina substrate and platinum filled via for an active implantable medical device

A co-fired hermetically sealed feedthrough is attachable to an active implantable medical device. The feedthrough comprises an alumina dielectric substrate comprising at least 96 or 99% alumina. A via hole is disposed through the alumina dielectric substrate from a body fluid side to a device side. A substantially closed pore, fritless and substantially pure platinum fill is disposed within the via hole forming a platinum filled via electrically conductive between the body fluid side and the device side. A hermetic seal is between the platinum fill and the alumina dielectric substrate, wherein the hermetic seal comprises a tortuous and mutually conformal interface between the alumina dielectric substrate and the platinum fill.

THIN-FILM CAPACITOR AND METHOD FOR MANUFACTURING THIN-FILM CAPACITOR

A thin-film capacitor includes an insulating base member, and a capacitance portion that is laminated on the insulating base member has a plurality of internal electrode layers which are laminated on the insulating base member and are provided in a lamination direction and dielectric layers which are sandwiched between the internal electrode layers. A relative dielectric constant of the dielectric layers is 100 or higher.

FILM CAPACITOR, AND OUTER CASE FOR FILM CAPACITOR

A film capacitor that includes a capacitor element including one or more wound or laminated metallized films, each metallized film including a resin film and a metal layer on a surface of the resin film; an outer case that houses the capacitor element; and a filling resin that fills a space between the capacitor element and the outer case, wherein the outer case is made of a resin composition containing a liquid crystal polymer and an inorganic filler.

MULTILAYER CERAMIC ELECTRONIC COMPONENT

A multilayer ceramic electronic component includes a body including a dielectric layer, first and second internal electrodes, a stacked portion including first and second surfaces opposing each other in a stacking direction of the first and second internal electrodes, third and fourth surfaces connected to the first and second surfaces and opposing each other, and fifth and sixth surfaces connected to the first and second surfaces, connected to the third and fourth surfaces, and opposing each other, and a coating layer disposed on the first to sixth surfaces of the stacked portion and having first and second connection portions; and first and second external electrodes connected to the first and second internal electrodes, respectively, and arranged on the third and fourth surfaces of the body, wherein the first and second internal electrodes are respectively connected to the first and second external electrodes through the first and second connection portions.

THIN-FILM CERAMIC CAPACITOR

A thin-film ceramic capacitor includes: a body in which a plurality of dielectric layers and first and second electrode layers are alternately disposed on a substrate; and first and second electrode pads disposed on an external surface of the body. The dielectric layer contains a mixed phase of a perovskite phase having ferroelectric properties and a pyrochlore phase having paraelectric properties, the pyrochlore phase being disposed on interfaces between the dielectric layers and the first and second electrode layers in lower portions of the dielectric layers.

Integrated capacitor and inductor with low parasitic inductance

A combination capacitor and inductor employ a common volume of high permeability material for energy-storing electrical and magnetic fields thereby reducing the bulk of these components with respect to separate components of comparable value. Capacitor conductors are arranged so that while proximate to the high permeability material they provide countervailing current flows to minimize parasitic inductance exacerbated by the high permeability material.

Electronic component with external electrode including sintered layer and conductive resin layer on the sintered layer

An element body of a rectangular parallelepiped shape includes a first principal surface arranged to constitute a mounting surface, a second principal surface opposing the first principal surface in a first direction, a pair of side surfaces opposing each other in a second direction, and a pair of end surfaces opposing each other in a third direction. An external electrode is disposed on the element body. The external electrode includes a conductive resin layer. The conductive resin layer continuously covers one part of the first principal surface, one part of the end surface, and one part of each of the pair of side surfaces. A length of the conductive resin layer in the first direction is smaller than a length of the conductive resin layer in the third direction.

Method of manufacturing a thin film capacitor

The instant disclosure provides a thin film capacitor and a method of manufacturing the same. The method includes the following steps: placing a carrier substrate on a processing machine including at least one processing unit, and the at least one processing unit having a metal-layer forming module and an insulation-layer forming module that are arranged along a planar production line; forming a plurality of metal layers by the metal-layer forming module of the at least one processing unit, forming a plurality of insulation layers by the insulation-layer forming module of the at least one processing unit, and the metal layers and the insulation layers being alternately stacked on the carrier substrate to form a multilayer stacked structure; and then forming two terminal electrode structures to respectively enclose two opposite side end portions of the multilayer stacked structure.

CAPACITOR AND METHOD FOR MANUFACTURING CAPACITOR

A capacitor includes a bus bar. The bus bar includes a bus bar body member and a terminal formation member configured to be superposed on and fixed to a terminal formation part of the bus bar body member. In the terminal formation part, a plurality of first connection terminal parts are formed so as to be arranged in one direction, by portions of the terminal formation part being cut and raised. In the terminal formation member, a plurality of second connection terminal parts are formed so as to be arranged in one direction, by portions of the terminal formation member being cut and raised, and second openings are formed in places where the portions have been cut and raised. The first connection terminal parts and the second connection terminal parts are alternately arranged in one direction, by the first connection terminal parts being passed through the second openings.

HIGH CAPACITANCE MULTILAYER WITH HIGH VOLTAGE CAPABILITY

ГРАФИТОВЫЕ НАНОВОЛОКНА В ЭЛЕКТРОХИМИЧЕСКИХ КОНДЕНСАТОРАХ

... 1. Электрод, содержащий нановолокна, имеющие площадь поверхности, большую чем около 100 м2/г. 2. Электрод по п.1, отличающийся тем, что нановолокна функционализированы. 3. Электрод по п.1 или 2, отличающийся тем, что нановолокна функционализированы одной или более функциональными группами, выбранными из группы, состоящей из хинона, гидрохинона, квартернизованных ароматических аминов, меркаптанов или дисульфидов. 4. Электрод по п.3, отличающийся тем, что функциональные группы находятся в многозвенном полимере, имеющем формулу: где G является CH или N или является подобным графиту углеродным аналогом одного или более из 5. Электрод по любому из предшествующих пунктов, отличающийся тем, что нановолокна являются углеродными нановолокнами по существу цилиндрической формы с по существу постоянным диаметром, имеющими графитовые слои, концентричные с осью нановолокна, и по существу свободными от пиролитически осажденного углерода. 6. Электрод по любому из предшествующих пунктов, отличающийся тем ...

КОНДЕНСАТОРЫ С ВЫСОКОЙ ПЛОТНОСТЬЮ ЭНЕРГИИ

... 1. Конденсатор, отличающийся тем, что содержит пористую электропроводящую подложку, на внутренней и внешней поверхности которой нанесены первый слой диэлектрика, который не является оксидом тантала или оксидом ниобия, и второй электропроводящий слой, и подложка изготовлена изa) по меньшей мере, из одного порошкообразного неметаллического материала, который окружен оболочкой, по меньшей мере, из одного металла или, по меньшей мере, одного металлического сплава, илиа) порошкообразных электропроводящих материалов.2. Конденсатор по п.1, отличающийся тем, что подложка имеет удельную поверхность от 0,01 до 10 м/г.3. Конденсатор по п.1, отличающийся тем, что подложка содержит, по меньшей мере, один металл или, по меньшей мере, один металлический сплав, которые имеют точку плавления, по меньшей мере, 900°С.4. Конденсатор по п.1, отличающийся тем, что подложка содержит Ni, Cu, Pd, Ag, Cr, Mo, W, Mn или Со и/или, по меньшей мере, один металлический сплав на их основе.5. Конденсатор по п.1, отличающийся ...

Kondensator mit unsymmetrischem Aufbau

Laminate type ceramic electronic component and manufacturing method therefor

In a laminate type ceramic electronic component, when an external electrode is formed directly by plating onto a surface of a component main body, the plating film that is to serve as the external electrode may have a low fixing strength with respect to the component main body. In order to prevent this problem, an external electrode includes a first plating layer composed of a Ni—B plating film and is first formed such that a plating deposition deposited with the exposed ends of respective internal electrodes as starting points is grown on at least an end surface of a component main body. Then, a second plating layer composed of a Ni plating film containing substantially no B is formed on the first plating layer. Preferably, the B content of the Ni—B plating film constituting the first plating layer is about 0.1 wt % to about 6 wt %.

Capacitor structure and manufacturing method thereof

A capacitor structure and a manufacturing method thereof. The capacitor structure includes a first conductor layer, a dielectric layer and a second conductor layer. The first conductor layer has a first metal material and a second metal material. The first metal material is formed with voids and the second metal material is filled in the voids via hot melt. Accordingly, in the first conductor layer, the second metal material is filled into the voids of the first metal material by means of hot melt to bond with the first metal material. In this case, the thermal treatment temperature can be effectively lowered and the electrical conductivity of the capacitor structure can be increased. Also, the strength of the capacitor structure is increased.

Multilayer capacitor

A multilayer capacitor which can control ESR in a wide frequency band is provided. In a multilayer capacitor 1 , inner electrodes 8 a , 8 b oppose each other as different polarities through a dielectric layer 7 in a capacitance unit 10 , inner electrodes 8 c to 8 f oppose each other as different polarities through dielectric layers 7 in ESR control units 11 A, 11 B, and the inner electrodes 8 a, 8 b of the capacitance unit 10 connected to the outer electrodes 3, 4 and the inner electrodes 8 c, 8 f of the ESR control units 11 A, 11 B connected to the outer electrodes 3, 4 are kept from opposing each other as different polarities through the dielectric layer 7 at boundaries between the capacitance unit 10 and the ESR control units 11 A, 11 B.

Multilayer ceramic capacitor and method of manufacturing the same

The present invention relates to a multilayer ceramic capacitor and a method of manufacturing the same. The multilayer ceramic capacitor includes a ceramic body having a first side and a second side opposed to each other and having a third side and a fourth side connecting the first side to the second side; a plurality of inner electrodes formed within the ceramic body and having respective one ends exposed to the third side and the fourth side; and outer electrodes formed on the third side and the fourth side and electrically connected to the inner electrodes. A shortest distance from distal edges of an outermost inner electrode among the plurality of inner electrodes to the first side or the second side is smaller than a shortest distance from distal edges of a central inner electrode to the first side or the second side.

Multilayer ceramic electronic component

A multilayer ceramic electronic component that is small, that has high electrical strength, and that is resistant to separation between ceramic layers includes a ceramic sintered body having a substantially rectangular parallelepiped shape and a plurality of first and second internal electrodes. The plurality of first and second internal electrodes are alternately arranged so as to face each other. The first and second internal electrodes are parallel or substantially parallel to first and second major surfaces. The first and second internal electrodes are exposed to at least one of the fifth and sixth surfaces and are not exposed to the third or fourth surface. No bends exist in any of the ends of each of the first and second internal electrodes adjacent to the third and fourth surfaces.

Laminated capacitor

In a laminated capacitor, one additional first internal electrode layer, which has its edge connected to the first external electrode as do the first internal electrode layers, is provided to one of the five first internal electrode layers so as to face one another via the second dielectric layer having a thickness smaller than the thickness of the first dielectric layer and not contributing to the formation of capacity, and one additional second internal electrode layer, which has its edge connected to the second external electrode as do the second internal electrode layers, is provided to one of the five second internal electrode layers so as to face one another via the third dielectric layer having a thickness smaller than the thickness of the first dielectric layer and not contributing to the formation of capacity.

Chip type laminated capacitor

There is provided a chip type laminated capacitor including: a ceramic body formed by laminating a dielectric layer having a thickness equal to 10 or more times an average particle diameter of a grain included therein and being 3 μm or less; first and second outer electrodes; a first inner electrode having one end forming a first margin together with one end surface of the ceramic body at which the second outer electrode is formed and the other end leading to the first outer electrode; and a second inner electrode having one end forming a second margin together with the other end surface of the ceramic body at which the first outer electrode is formed and the other end leading to the second outer electrode, wherein the first and second margins have different widths under a condition that they are 200 μm or less.

Charge storage device, method of making same, method of making an electrically conductive structure for same, mobile electronic device using same, and microelectronic device containing same

In one embodiment a charge storage device includes first ( 110 ) and second ( 120 ) electrically conductive structures separated from each other by a separator ( 130 ). At least one of the first and second electrically conductive structures includes a porous structure containing multiple channels ( 111, 121 ). Each one of the channels has an opening ( 112, 122 ) to a surface ( 115, 125 ) of the porous structure. In another embodiment the charge storage device includes multiple nanostructures ( 610 ) and an electrolyte ( 650 ) in physical contact with at least some of the nanostructures. A material ( 615 ) having a dielectric constant of at least 3.9 may be located between the electrolyte and the nanostructures.

Multilayer ceramic condenser and method for manufacturing the same

Disclosed herein are a multilayer ceramic condenser and a method for manufacturing the same. The multilayer ceramic condenser includes inner metal electrode layers formed within a magnetic layer, and conductive layers each formed between the inner metal electrode layers, and a method for manufacturing the same. According to the present invention, a contact between the inner metal electrode layers in the multilayer ceramic condenser can be prevented, thereby reducing the manufacturing loss due to occurrence of short circuits and improving thermal stability, by forming an ultrathin conducting layer with a thickness of about 10 nm or less between the inner metal electrode layers. Therefore, the multilayer ceramic condenser can be ensured to have excellent reliability to meet the demands of markets requesting a high-capacity multilayer ceramic condenser (MLCC) having high performance, small size, and light weight.

Multilayer ceramic capacitor

There is provided a multilayer ceramic capacitor including: a ceramic body; first and second internal electrodes provided within the ceramic body and including respective lead-out portions exposed to a first surface of the ceramic body and a third or fourth surface thereof connected to the first surface and having an overlapping area, the overlapping area being exposed to the first surface of the ceramic body; first and second external electrodes extended from the first surface of the ceramic body to the third or fourth surface thereof connected to the first surface and connected to the respective lead-out portions; and an insulation layer formed on the first surface of the ceramic body and the third and fourth surfaces thereof connected to the first surface.

Ceramic electronic component and manufacturing method thereof

A ceramic electronic component includes a ceramic body, an inner electrode, an outer electrode, and a connecting portion. The inner electrode is disposed inside the ceramic body. The end portion of the inner electrode extends to a surface of the ceramic body. The outer electrode is disposed on the surface of the ceramic body so as to cover the end portion of the inner electrode. The outer electrode includes a resin and a metal. The connecting portion is disposed so as to extend from an inside of the outer electrode to an inside of the ceramic body. In a portion of the surface of the ceramic body on which the outer electrode is disposed, the length of the connecting portion that extends in a direction in which the inner electrode is extends about 2.4 μm or more.

MULTILAYER CERAMIC ELECTRONIC PART AND METHOD OF MANUFACTURING THE SAME

There is provided a multilayer ceramic electronic part, including: a ceramic element having a plurality of dielectric layers laminated therein; and a plurality of first and second internal electrodes each including a body part formed on at least one surface of each of the plurality of dielectric layers within the ceramic element, the first and second internal electrodes including first and second lead parts extended from one surfaces of the body parts to be exposed through one surface of the ceramic element, respectively, wherein inside connection portions between the body parts and the first and second lead parts are curvedly formed, and have a curvature radius of 30 to 100 μm. 1. A multilayer ceramic electronic part , comprising:a ceramic element having a plurality of dielectric layers laminated therein; anda plurality of first and second internal electrodes each including a body part formed on at least one surface of each of the plurality of dielectric layers within the ceramic element, the first and second internal electrodes including first and second lead parts extended from one surface of the body parts to be exposed through one surface of the ceramic element, respectively,inside connection portions between the body parts and the first and second lead parts being curvedly formed, and having a curvature radius of 30 to 100 μm.2. The multilayer ceramic electronic part of claim 1 , wherein in each of the body parts of the first and second internal electrodes claim 1 , corner portions of an edge thereof are curvedly formed.3. The multilayer ceramic electronic part of claim 1 , wherein a distance between the first lead part and the second lead part is at least 200 μm or more.4. The multilayer ceramic electronic part of claim 1 , further comprising first and second external electrodes formed on one surface of the ceramic element claim 1 , and electrically connected to the first and second internal electrodes through exposed portions of the first and second lead ...

MULTILAYER CERAMIC ELECTRONIC PART AND METHOD OF MANUFACTURING THE SAME

There is provided a multilayer ceramic electronic part, including: a ceramic element having a plurality of dielectric layers laminated therein; first and second internal electrodes formed on at least one surface of each of the plurality of dielectric layers within the ceramic element and exposed through one surface of the ceramic element; and first and second external electrodes formed on one surface of the ceramic element and electrically connected to the first and second internal electrodes through exposed portions of the respective first and second internal electrodes, wherein a ratio of an area of the first or second external electrode to an area of one surface of the ceramic element is 10 to 40%. 1. A multilayer ceramic electronic part , comprising:a ceramic element having a plurality of dielectric layers laminated therein;first and second internal electrodes formed on at least one surface of each of the plurality of dielectric layers within the ceramic element and exposed through one surface of the ceramic element; andfirst and second external electrodes formed on one surface of the ceramic element and electrically connected to the first and second internal electrodes through exposed portions of the respective first and second internal electrodes,wherein a ratio of an area of the first or second external electrode to an area of one surface of the ceramic element is 10 to 40%.2. The multilayer ceramic electronic part of claim 1 , wherein the first and second external electrodes have equal areas.3. The multilayer ceramic electronic part of claim 1 , wherein the first and second external electrodes have unequal areas.4. The multilayer ceramic electronic part of claim 1 , wherein a distance between the first external electrode and an end of the ceramic element is equal to a distance between the second external electrode and an opposite end of the ceramic element.5. The multilayer ceramic electronic part of claim 1 , wherein a distance between the first external ...

Multilayer ceramic capacitor

There is provided a multilayer ceramic capacitor, including: a multilayer body having a plurality of dielectric layers and a plurality of internal electrode layers alternately laminated; wherein each internal electrode layer has a width gradually decreases from a center thereof towards both ends thereof in a length direction; and when a width of each internal electrode layer at the ends thereof in the length direction is defined as a minimum width L 2 and a width of a portion of a margin portion M in each dielectric layer is defined as a maximum width M 2 , the portion of the margin portion M having no internal electrode layer present thereon and corresponding to the ends of each internal electrode layer in the length direction, a ratio of M 2 to L 2 (M 2 /L 2 ) ranges from 0.2 to 0.3.

Polymerization method for preparing conductive polymer

A improved process for preparing a conductive polymer dispersion is provided as is an improved method for making capacitors using the conductive polymer. The process includes providing a monomer solution and shearing the monomer solution with a rotor-stator mixing system comprising a perforated stator screen having perforations thereby forming droplets of said monomer. The droplets of monomer are then polymerized during shearing to form the conductive polymer dispersion.

CERAMIC ELECTRONIC COMPONENT

A ceramic electronic component includes a ceramic body; a plurality of internal electrodes provided in the ceramic body and including ends exposed on a surface of the ceramic body; a coating layer covering a surface portion of the ceramic body on which the internal electrodes are exposed, the coating layer being made of a glass or resin medium in which metal powder particles are dispersed; and an electrode terminal provided directly on the coating layer and including a plating film. The metal powder particles define conduction paths electrically connecting the internal electrodes with the electrode terminal and have an elongated shape in cross section along a thickness direction of the coating layer. The metal powder particles defining the conduction paths have a maximum diameter not smaller than the thickness of the coating layer. 1. A ceramic electronic component comprising:a ceramic body;a plurality of internal electrodes provided in the ceramic body and including ends exposed on a surface of the ceramic body;at least one coating layer covering a portion of the surface of the ceramic body on which the plurality of internal electrodes are exposed, the at least one coating layer being made of a glass medium or resin medium in which metal powder particles are dispersed; andat least one electrode terminal provided directly on the at least one coating layer and including a plating film; whereinthe metal powder particles define conduction paths electrically connecting the plurality of internal electrodes with the at least one electrode terminal;the metal powder particles have an elongated shape as viewed in cross section along a direction of thickness of the at least one coating layer; andthe metal powder particles defining the conduction paths have a maximum diameter equal to or larger than a thickness of the at least one coating layer.2. The ceramic electronic component according to claim 1 , wherein the metal powder particles are in flake form.3. The ceramic ...

CERAMIC ELECTRONIC COMPONENT

A ceramic electronic component includes a ceramic body, a plurality of internal electrodes provided in the ceramic body and including ends exposed on a surface of the ceramic body; a glass coating layer covering a portion of the surface of the ceramic body on which the internal electrodes are exposed; and an electrode terminal provided directly on the glass coating layer and including a plating film. The glass coating layer is made of a glass medium in which metal powder particles are dispersed. The internal electrodes project from the surface of the ceramic body into the glass coating layer without passing through the glass coating layer. The metal powder particles define conduction paths electrically connecting the internal electrodes with the electrode terminal. 1. A ceramic electronic component comprising:a ceramic body;a plurality of internal electrodes provided in the ceramic body and including ends exposed on a surface of the ceramic body;at least one glass coating layer covering a portion of the surface of the ceramic body on which the plurality of internal electrodes are exposed; andat least one electrode terminal provided directly on the at least one glass coating layer and including a plating film; whereinthe at least one glass coating layer is made of a glass medium in which metal powder particles are dispersed;the plurality of internal electrodes project from the surface of the ceramic body into the at least one glass coating layer without passing through the at least one glass coating layer; andthe metal powder particles define conduction paths electrically connecting the plurality of internal electrodes with the at least one electrode terminal.2. The ceramic electronic component according to claim 1 , wherein portions of the internal electrodes projecting from the surface of the ceramic body have a length of about 50% or less of a thickness of the at least one glass coating layer.3. The ceramic electronic component according to claim 2 , wherein the ...

Graphene mounted on aerogel

An apparatus having reduced phononic coupling between a graphene monolayer and a substrate is provided. The apparatus includes an aerogel substrate and a monolayer of graphene coupled to the aerogel substrate.

MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME

There is provided a multilayer ceramic electronic component, including: a ceramic body having external electrodes; and internal electrodes disposed between ceramic layers within the ceramic body, the ceramic body having a width smaller than a length thereof and the number of laminated internal electrodes being 250 or more, wherein when the thickness of the ceramic layer is denoted by Tand the thickness of the internal electrode is denoted by T, 0.5≦T/T≦2.0, and when the thickness of a central portion of the ceramic body is denoted by Tand the thickness of each of side portions of the ceramic body is denoted by T, 0.9≦T/T≦0.97, and thus, a multilayer ceramic electronic component having low equivalent series inductance (ESL) may be obtained. 1. A multilayer ceramic electronic component , comprising:a ceramic body having external electrodes; andinternal electrodes disposed between ceramic layers within the ceramic body,when a direction in which the external electrodes are connected and extended is denoted as a ┌width direction┘; a direction in which the internal electrodes are laminated is denoted as a ┌thickness direction┘; and a direction perpendicular to the width direction and the thickness direction is denoted as a ┌length direction┘, the ceramic body having a width smaller than a length thereof,the number of the internal electrodes laminated being 250 or more,{'sub': d', 'e', 'e', 'd, 'when the thickness of the ceramic layer is denoted by Tand the thickness of the internal electrode is denoted by T, 0.5≦T/T≦2.0, and'}{'sub': m', 'a', 'a', 'm, 'when the thickness of a central portion in a width direction of the ceramic body is denoted by Tand the thickness of each of side portions of the ceramic body is denoted by T, in a cross section in a width-thickness direction of the ceramic body, 0.9≦T/T≦0.97.'}2. The multilayer ceramic electronic component of claim 1 , wherein the central portion in the width direction of the ceramic body is within sections inside 15% of ...

CERAMIC CAPACITOR

When a voltage two times a rated voltage is applied between a first external electrode and a second external electrode of a ceramic capacitor, the electric field intensity generated at portion connected between a first internal electrode and an end of a portion of a second external electrode at a side of a first side surface by a shortest distance Fis about 0.34 kV/mm or less. 1. A ceramic capacitor comprising:a ceramic base including a first and a second primary surface extending along a length direction and a width direction, a first and a second side surface extending along the length direction and a thickness direction, and a first and a second end surface extending along the width direction and the thickness direction;first internal electrodes which extend in the ceramic base along the length direction and the width direction and which are exposed at the first end surface;second internal electrodes which are arranged in the ceramic base to face the first internal electrodes in the thickness direction and which are exposed at the second end surface;a first external electrode which is electrically connected to the first internal electrodes and includes a first portion arranged on the first end surface, second portions arranged on the first and second primary surfaces, and third portions arranged on the first and second side surfaces, and which includes Ag at least in a surface layer thereof; anda second external electrode which is electrically connected to the second internal electrodes and includes a fourth portion arranged on the second end surface, fifth portions arranged on the first and second primary surfaces, and sixth portions arranged on the first and second side surfaces, and which includes Ag at least in a surface layer thereof; wherein{'sub': 'S', 'when a voltage that is about two times a rated voltage is applied between the first external electrode and the second external electrode, an electric field intensity generated at a portion connected between ...

Abrasive Blasted Cathode of a Wet Electrolytic Capacitor

A wet electrolytic capacitor that includes a porous anode body containing a dielectric layer, an electrolyte, and a cathode containing a metal substrate on which is disposed a conductive coating is provided. Prior to application of the conductive coating, the metal substrate is blasted with abrasive particles to enhance the ability of the substrate to adhere to the coating. The micro-roughened metal substrate can be treated after blasting so that substantially all of the abrasive particles are removed. This is accomplished by contacting the metal substrate with an extraction solution to remove the particles, and also by selectively controlling the nature of the abrasive particles so that they are dispersible (e.g., soluble) in the solution. 1. A method for forming a cathode of a wet electrolytic capacitor , the method comprising:blasting a metal substrate with a plurality of abrasive particles to form a micro-roughened surface having a plurality of pits;contacting the micro-roughened surface of the metal substrate with an extraction solution, wherein the abrasive particles are dispersed in the extraction solution; andthereafter, forming a conductive coating on the micro-roughened surface.2. The method of claim 1 , wherein the abrasive particles include ceramic particles.3. The method of claim 1 , wherein the abrasive particles are conductive.4. The method of claim 3 , wherein the abrasive particles include manganese dioxide.5. The method of claim 1 , wherein the abrasive particles have an average size of from about 25 to about 200 micrometers.6. The method of claim 1 , wherein the pits have an average depth of from about 200 to about 2500 nanometers and/or a peak-to-peak distance that ranges from about 30 to about 400 micrometers.7. The method of claim 1 , wherein the abrasive particles are propelled at a pressure of from about 10 to about 35 pounds per square inch for a time of from about 10 to about 30 seconds.8. The method of claim 1 , wherein the abrasive ...

MULTILAYER CERAMIC ELECTRONIC COMPONENT

There is provided a multilayer ceramic electronic component, including: a ceramic body formed by laminating dielectric layers having an average thickness of 0.7p or less; external electrodes formed on external surfaces of the ceramic body; and internal electrodes respectively disposed on the dielectric layer so as to have a gap formed therebetween, wherein, when a narrowest gap between the internal electrode edges adjacent to one another is denoted by Gmin, 10 μm≦Gmin≦60 μm is satisfied. 1. A multilayer ceramic electronic component , comprising:a ceramic body formed by laminating dielectric layers having an average thickness of 0.7 μm or less;at least two external electrodes formed on external surfaces of the ceramic body; andinternal electrodes printed on the dielectric layers so as to be printed on a single dielectric layer and thus have a gap formed therebetween, the internal electrodes constituting at least two internal electrode lamination portions,the gap between the internal electrode of one internal electrode lamination portion and the internal electrode of the other internal electrode lamination portion adjacent to the one internal electrode lamination portion being defined by internal electrode edges with curves, adjacent to one another,when a narrowest gap between the internal electrode edges adjacent to one another is denoted by Gmin, 10 μm≦Gmin≦60 μm, andwhen a width of a central portion of the internal electrode is denoted by Wa, and a width of an end portion of an outline of the internal electrode is denoted by Wb, 1.1≦Wa/Wb≦1.35.2. The multilayer ceramic electronic component of claim 1 , wherein claim 1 , when a margin portion between the internal electrode edge of the internal electrode and one end surface of the ceramic body adjacent thereto is denoted by Ms claim 1 , Gmin≦Ms is satisfied.3. The multilayer ceramic electronic component of claim 1 , wherein Wa is a widest width of the internal electrode and Wb is a narrowest width of the internal ...

MIM CAPACITOR

A method of forming a metal- insulator-metal capacitor having top and bottom plates separated by a dielectric layer, one of the top and bottom plates having at least one protrusion extending into a corresponding cavity in the other of the top and bottom plates, the method including the steps of growing one or more nanofibers on a base surface. 1. A capacitor comprising top and bottom plates separated by a dielectric layer , at least one of the top and bottom plates being formed of metal , one of said top and bottom plates comprising at least one protrusion extending into a corresponding cavity in the other of said top and bottom plates , wherein each of said at least one protrusion comprises a nanofiber.2. The capacitor of claim 1 , wherein said nanofibers are coated with a metallic layer.3. The capacitor of claim 2 , wherein said metallic layer is coated with a layer of dielectric material forming said dielectric layer.4. The capacitor of claim 1 , wherein said nanofibers are conducting.5. The capacitor of claim 4 , wherein said nanofibers are coated with a layer of dielectric material forming said dielectric layer.6. The capacitor of claim 4 , wherein said nanofibers are formed on a base surface of a conductive material claim 4 , and wherein said nanofibers and said base surface form one of said top and bottom plates.7. The capacitor of claim 1 , wherein said nanofibers are formed on a base surface comprising at least one of nickel and cobalt.8. The capacitor of claim 1 , wherein said nanofibers comprise carbon nanofibers.9. The capacitor of claim 1 , wherein said nanofibers have a diameter of less than 50 nm.10. A capacitor comprising top and bottom plates separated by a dielectric layer claim 1 , at least one of the top and bottom plates being formed of metal claim 1 , wherein one of said top and bottom plates comprising at least one protrusion extending into a corresponding cavity in the other of said top and bottom plates claim 1 , said cavity formed by ...

Semiconductor Devices and Methods of Manufacture Thereof

Semiconductor devices and methods of manufacture thereof are disclosed. In a preferred embodiment, a capacitor plate includes a first propeller-shaped portion and a second propeller-shaped portion. A via portion is disposed between the first propeller-shaped portion and the second propeller-shaped portion. 1. A capacitor comprising:a first propeller-shaped portion disposed in a first metal level, wherein the first propeller-shaped portion comprises a first horizontal member oriented in a first direction and a first vertical member oriented in a second direction, the first horizontal member having a first horizontal length in the first direction and the first vertical member having a first vertical length in the second direction, the first vertical member intersecting the first horizontal member in a first intersection region having a first center point, the first direction being orthogonal to the second direction, wherein the first horizontal length is greater than the first vertical length;a second propeller-shaped portion disposed in the first metal level, wherein the second propeller-shaped portion comprises a second horizontal member oriented in the first direction and a second vertical member oriented in the second direction, the second vertical member intersecting the second horizontal member in a second intersection region having a second center point;a third propeller-shaped portion disposed in the first metal level, wherein the third propeller-shaped portion comprises a third horizontal member oriented in the first direction and a third vertical member oriented in the second direction, the third vertical member intersecting the third horizontal member in a third intersection region having a third center point; anda fourth propeller-shaped portion disposed in the first metal level, wherein the fourth propeller-shaped portion comprises a fourth horizontal member oriented in the first direction and a fourth vertical member oriented in the second direction, the ...

Capacitor

A capacitor includes a dielectric layer, a first external electrode layer, a second external electrode layer, a first internal electrode portion, a second internal electrode portion, and a close contact portion. The first internal electrode portion is provided on a first through-hole portion, one end of the first internal electrode portion being connected to the first external electrode layer. The second internal electrode portion is provided on a second through-hole portion, one end of the second internal electrode portion being connected to the second external electrode layer. The close contact portion brings at least any one of the first external electrode layer and the second external electrode layer into close contact with the dielectric layer, the close contact portion being provided on a third through-hole portion.

Ceramic electronic component

In a ceramic electronic component, a section of a first extraction section located closer to a first end surface defines a first thick section. The first thick section is at least about 1.5 times as thick as a first central section of a first opposed section in a direction. The length of the first thick section is within the range of about ¼ to about ¾ of a distance from a tip of a second opposed section closer to the first end surface, to the first end surface in the direction.

CAPACITOR, STRUCTURE AND METHOD OF FORMING CAPACITOR

There is provided a capacitor including a dielectric layer having a first plane, a second plane opposite to the first plane, and a plurality of through-holes communicated with the first plane and the second plane, including a plurality of arrangement regions where arrangement directions of the plurality of through-holes are same; a first external electrode layer disposed on the first plane; a second external electrode layer disposed on the second plane; a first internal electrode housed in a part of the plurality of through-holes and connected to the first external electrode layer; and a second internal electrode housed in a part of the plurality of through-holes and connected to the second external electrode layer. 1. A capacitor , comprising:a dielectric layer having a first plane, a second plane opposite to the first plane, and a plurality of through-holes communicated with the first plane and the second plane, including a plurality of arrangement regions where arrangement directions of the plurality of through-holes are same;a first external electrode layer disposed on the first plane;a second external electrode layer disposed on the second plane;a first internal electrode housed in a part of the plurality of through-holes and connected to the first external electrode layer; anda second internal electrode housed in a part of the plurality of through-holes and connected to the second external electrode layer.2. The capacitor according to claim 1 , whereinthe through-holes in the arrangement regions have a hexagonal ordered array.3. The capacitor according to claim 2 , whereinthe dielectric layer is made of ceramics.4. The capacitor according to claim 3 , whereinthe dielectric layer is made of aluminum oxide.5. A structure claim 3 , comprising:a dielectric layer having a first plane, a second plane opposite to the first plane, and a plurality of through-holes communicated with the first plane and the second plane, including a plurality of arrangement regions where ...

LAMINATED CERAMIC ELECTRONIC COMPONENT

A laminated ceramic electronic component has electrode layers stacked with ceramic layers, where the thickness of each electrode layer is controlled to 0.5 μm or less and the average size of crystal grains constituting the electrode layer is controlled to 0.1 μm or less. The occurrence of structural defects in the laminated ceramic electronic component can be suppressed and high continuity of the electrode layers stacked with the ceramic layers is ensured. 10.1 μm or less.. A laminated ceramic electronic component having ceramic layers and electrode layers stacked with the ceramic layers , wherein a thickness of each electrode layer is 0.5 μm or less and an average size of crystal grains constituting the electrode layer is2. A laminated ceramic electronic component according to claim 1 , wherein a surface roughness based on a maximum height of an interface between each ceramic layer and each electrode layer is one-third the thickness of the electrode layer or less.3. A laminated ceramic electronic component according to claim 2 , wherein the thickness of the electrode layer is one-half the thickness of the ceramic layer or less.4. A laminated ceramic electronic component according to claim 1 , wherein the thickness of the electrode layer is 0.5 μm or less and 0.4 μm or more.5. A laminated ceramic electronic component according to claim 2 , wherein the thickness of the electrode layer is 0.5 μm or less and 0.4 μm or more.6. A laminated ceramic electronic component according to claim 3 , wherein the thickness of the electrode layer is 0.5 μm or less and 0.4 μm or more.7. A laminated ceramic electronic component according to claim 1 , wherein each electrode layer is comprised of continuous portions and discontinuous portions along an extending direction as viewed in a cross section claim 1 , wherein the total length of the continuous portions is more than 80% but less than 100% of the length of the electrode layer.8. A multilayer ceramic capacitor comprising ceramic ...

CAPACITOR, STRUCTURE AND METHOD OF FORMING CAPACITOR

There is provided a capacitor including a dielectric layer having a first plane, a second plane opposite to the first plane, and a plurality of through-holes communicated with the first plane and the second plane; a first external conductor layer disposed on a part of the first plane; a second external conductor layer disposed on the second plane; a third external conductor layer disposed on another part of the first plane; a first internal conductor housed in a part of a plurality of the through-holes and connected to the first external conductor layer; a second internal conductor housed in another part of a plurality of the through-holes and connected to the second external conductor layer; and a third internal conductor housed in the other part of a plurality of the through-holes and connected to the second external conductor layer and the third external conductor layer. 1. A capacitor , comprising:a dielectric layer having a first plane, a second plane opposite to the first plane, and a plurality of through-holes communicated with the first plane and the second plane;a first external conductor layer disposed on a part of the first plane;a second external conductor layer disposed on the second plane;a third external conductor layer disposed on another part of the first plane;a first internal conductor housed in a part of a plurality of the through-holes and connected to the first external conductor layer;a second internal conductor housed in another part of a plurality of the through-holes and connected to the second external conductor layer; anda third internal conductor housed in the other part of a plurality of the through-holes and connected to the second external conductor layer and the third external conductor layer.2. The capacitor according to claim 1 , further comprising:a first protective layer coating the first external conductor layer and the third external conductor layer;a second protective layer coating the second external conductor layer;a first ...

Electrical Multilayer Component

An electrical multilayer component includes a stack composed of functional layers and also a first and a second external contact. The external contacts are arranged on side surfaces of the stack. Internal electrodes of a first type are directly electrically conductively connected to the first external contact and internal electrodes of a second type directly electrically conductively connected to the second external contact. An internal electrode of the first type and an internal electrode of the second type partly overlap. An internal electrode of the first type and an internal electrode of the second type are arranged in a manner spaced apart from one another in an identical plane.

ELECTRONIC COMPONENT

In an electronic component, capacitor conductors include linear portions parallel or substantially parallel to a lower surface of a laminate, and lead-out portions led out respectively from the linear portions to the lower surface. Outer electrodes are disposed on the lower surface and cover exposed portions where the lead-out portions are exposed at the lower surface, respectively. At least one of the linear portions includes a groove, which is recessed in a direction away from the lower surface, in a region thereof overlapping with the corresponding outer electrode when looking at the electronic component in a plan view from a z-axis direction. 1. (canceled)2. An electronic component comprising:a laminate including a plurality of stacked dielectric layers and a mounting surface defined by continuously-arranged outer edges of the plurality of dielectric layers;a first capacitor conductor and a second capacitor conductor stacked together with the dielectric layers in opposed relation to each other, the first capacitor conductor and the second capacitor conductor respectively including a first linear portion and a second linear portion extending along outer edges thereof and parallel or substantially parallel to the mounting surface, the first capacitor conductor and the second capacitor conductor further respectively including a first lead-out portion and a second lead-out portion led out to the mounting surface from the first linear portion and the second linear portion; anda first outer electrode and a second outer electrode disposed on the mounting surface and not disposed on end surfaces of the laminate, which are adjacent to the mounting surface and which are each defined by continuously-arranged outer edges of the plurality of dielectric layers, the first outer electrode and the second outer electrode covering respective portions where the first lead-out portion and the second lead-out portion are exposed at the mounting surface; whereinthe first linear ...

LAMINATED CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME

In a laminated ceramic electronic component, a side-surface outer electrode includes a first electrode portion including side-surface electrode portions located on first and second side surfaces and wrap-around electrode portions arranged to extend around from the side-surface electrode portions of the first electrode portion to portions of third and fourth side surfaces; and a second electrode portion including side-surface electrode portions located on the third and fourth side surfaces and wrap-around electrode portions arranged to extend around from the side-surface electrode portions of the second electrode portion to portions of the first and second side surfaces. The wrap-around electrode portions of the second electrode portion reach regions covering portions of outermost inner electrodes located at an outermost side portion among inner electrodes, which portions are exposed in the first and second side surfaces. 110-. (canceled)11. A laminated ceramic electronic component comprising:a ceramic element assembly including a plurality of laminated ceramic layers and including first and second end surfaces opposed to each other, first and second side surfaces which connect the first and second end surfaces and are opposed to each other, and third and fourth side surfaces which connect the first and second end surfaces and are opposed to each other;a plurality of inner electrodes provided within the ceramic element assembly and extended to the first and second side surfaces; anda strip-shaped side-surface outer electrode located on the first, second, third and fourth side surfaces of the ceramic element assembly so as to extend around the ceramic element assembly and connected to the inner electrodes extended to the first and second side surfaces; whereinthe side-surface outer electrode extending around the ceramic element assembly includes a first electrode portion including side-surface electrode portions located on the first and second side surfaces of the ...

LAMINATED CAPACITOR

Provided is a laminated capacitor that achieves low impedance in a wide band. The laminated capacitor includes an element assembly , terminal electrodes , internal electrodes that are connected to the terminal electrodes , and an internal electrode that is not connected to the terminal electrodes . In the laminated capacitor , an interval between each of the first electrode parts of the first and second terminal electrodes and the internal electrode is smaller than an interval between the internal electrode and the internal electrode or the internal electrode located adjacent to the internal electrode 1. A laminated capacitor comprising:an element assembly having a pair of first and second end surfaces opposed to each other, a pair of first and second main surfaces extending so as to connect between a pair of the first and second end surfaces and opposed to each other, and a pair of first and second side surfaces extending so as to connect a pair of the first and second main surfaces and opposed to each other;first and second terminal electrodes disposed on both end portions of the element assembly, and each having a first electrode part located on at least the first main surface;first and second internal electrodes that are connected to corresponding terminal electrodes out of the first and second terminal electrodes, and disposed in the element assembly so as to be opposed to each other in a first direction in which the first main surface and the second main surface are opposed; anda third internal electrode that is disposed in the element assembly so as to be located, adjacent to the first main surface, outside in the first direction further than the first and second internal electrodes and be opposed to each of the first electrode parts of the first and second terminal electrodes, and not connected to the first and second terminal electrodes, whereina first capacitance unit composed of the first internal electrode and the second internal electrode, a second ...

Multilayer ceramic electronic component and method of manufacturing the same

There are provided a multilayer ceramic electronic component and a method of manufacturing the same, the multilayer ceramic electronic component, including: a ceramic body including a plurality of dielectric layers laminated therein, each dielectric layer having an average thickness of 0.65 μM or less; internal electrodes disposed to face each other while having each dielectric layer interposed therebetween in the ceramic body; and external electrodes electrically connected to the internal electrodes, wherein, when td denotes the average thickness of each of the dielectric layers and te denotes an average thickness of each of the internal electrodes, te/td≦0.77 is satisfied.

Multilayer ceramic electronic component and method of manufacturing the same

There is provided a multilayer ceramic electronic component, including: a ceramic body including dielectric layers; first and second internal electrodes disposed to face each other within the ceramic body with the dielectric layer interposed therebetween; and first and second external electrodes electrically connected to the first and second internal electrodes, wherein the ceramic body includes a capacitance forming part contributing to capacitance formation and a non-capacitance forming part provided on at least one of upper and lower surfaces of the capacitance forming part, and when the capacitance forming part is divided into three areas in a thickness direction of the ceramic body, a difference in continuity between internal electrodes in a middle area of the three areas and internal electrodes in upper and lower areas thereof is 1% to 5%.

Capacitors in Integrated Circuits and Methods of Fabrication Thereof

In one embodiment, a capacitor includes a first via level having first metal bars and first vias, such that the first metal bars are coupled to a first potential node. The first metal bars are longer than the first vias. Second metal bars and second vias are disposed in a second via level, the second metal bars are coupled to the first potential node. The second metal bars are longer than the second vias. The second via level is above the first via level and the first metal bars are parallel to the second metal bars. Each of the first metal bars has a first end, an opposite second end, and a middle portion between the first and the second ends. Each of the middle portions of the first metal bars and the second ends of the first metal bars do not contact any metal line. 1. A method of fabricating a semiconductor device , the method comprising:depositing a first insulating layer over a workpiece;forming first metal bars in the first insulating layer over a first region of the workpiece;forming a second insulating layer over the first insulating layer;forming metal lines over a second region of the workpiece and not directly over the first metal bars;forming a third insulating layer over the second insulating layer; andforming second metal bars in the third insulating layer over the first region of the workpiece.2. The method of claim 1 , wherein the first metal bars are parallel to the second metal bars claim 1 , wherein each of the first metal bars has a first end claim 1 , an opposite second end claim 1 , and a middle portion between the first and the second ends claim 1 , and wherein each of the middle portions of the first metal bars and the second ends of the first metal bars do not contact any metal line.3. The method of claim 2 , wherein each of the second metal bars has a first end claim 2 , an opposite second end claim 2 , and a middle portion between the first and the second ends claim 2 , wherein each of the middle portions of the second metal bars and the ...

LAMINATED CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR

A laminated body is divided into a large grain region and a small grain region. The large grain region is located outside the small grain region, and a boundary surface between the regions is located inside the outer surface of the laminated body while surrounding a section in which internal electrodes are present in the laminated body. To obtain the laminated body, firing is carried out with a profile in which the average rate of increase from room to the maximum temperature is 40° C./second or more. 1. A laminated ceramic electronic component comprising:a laminated body including a plurality of stacked ceramic layers and internal electrodes formed along specific interfaces between the ceramic layers; andan external electrode on an outer surface of the laminated body electrically connected to specific ones of the internal electrodes,wherein the laminated body is divided into a large grain region in which a ceramic constituting the ceramic layers has a relatively large grain diameter and a small grain region in which the ceramic has a relatively small grain diameter, the large grain region is located outside the small grain region, and a boundary surface between the large grain region and the small grain region is located inside the outer surface of the laminated body while surrounding a section in which internal electrodes are present in the laminated body.2. The laminated ceramic electronic component according to claim 1 , wherein the internal electrodes comprise a base metal.3. A laminated ceramic electronic component according to whereinthe laminated body has a rectangular parallelepiped shape including a LW surface defined by a length-direction dimension L and a width-direction dimension W of the laminated body, a LT surface defined by the length-direction dimension L and a thickness-direction dimension T of the laminated body, and a WT surface defined by the width-direction dimension W and the thickness-direction dimension T of the laminated body,the external ...

Chip device and method for manufacturing the same

Disclosed herein is a chip device including: a multilayer body having a hexahedral shape; an external electrode covering both distal ends of the multilayer body; and a shape maintaining material contained in the external electrode to maintain a shape of the external electrode at the time of forming the external electrode.

BONE FRAME, LOW RESISTANCE VIA COUPLED METAL OXIDE-METAL (MOM) ORTHOGONAL FINGER CAPACITOR

An orthogonal finger capacitor includes a layer having an anode bone frame adjacent a cathode bone frame, the anode bone frame having a first portion extending along an axis and a second portion extending perpendicular to the axis. A set of anode fingers extends from the first portion. A set of cathode fingers extends from the cathode bone frame, interdigitated with the set of anode fingers. An overlaying layer has another anode bone frame having a first portion parallel to the axis and a perpendicular second portion. A via couples the overlaying anode bone frame to the underlying anode bone frame. The via is located where the first portion of the overlaying anode bone frame overlaps the second portion of the underlying anode bone frame or, optionally, where the second portion of the overlying anode bone frame overlaps the first portion of the underlying anode bone frame. 1. An orthogonal finger capacitor comprising:an anode bone frame having an anode spine that extends along a longitudinal axis, and an anode rib connected to the anode spine;a set of anode fingers that extends from one from among the anode spine and the anode rib;a cathode bone frame having a cathode spine that extends parallel to the longitudinal axis and having a cathode rib connected to the cathode spine; anda set of cathode fingers that extends from one among the cathode spine and the cathode rib and that is interdigitated with the set of anode fingers.2. The orthogonal finger capacitor of claim 1 , wherein the anode bone frame claim 1 , the set of anode fingers claim 1 , the cathode bone frame and the set of cathode fingers are located in a metal layer.3. The orthogonal finger capacitor of claim 2 , further comprising:an insulating dielectric on the anode bone frame, the set of anode fingers, the cathode bone frame, and the set of cathode fingers;an overlaying anode bone frame, in an overlaying metal layer above the insulating dielectric and the metal layer, having an overlaying anode spine and ...

LOW EQUIVALENT SERIES RESISTANCE RF FILTER FOR AN ACTIVE IMPLANTABLE MEDICAL DEVICE

A hermetically sealed filtered feedthrough assembly includes an electrically conductive ferrule sealed by a first gold braze to an insulator disposed at least partially within a ferrule opening. A conductive wire is disposed within a via hole disposed through the insulator extending from a body fluid side to a device side. A second gold braze hermetically seals the conductive leadwire to the via hole. A capacitor is disposed on the device side having a capacitor dielectric body with a dielectric constant k that is greater than 0 and less than 1000. The capacitor is the first filter capacitor electrically connected to the conductive leadwire coming from the body fluid side into the device side. An active electrical connection electrically connects the conductive leadwire to the capacitor active metallization. A ground electrical connection electrically connects the capacitor ground metallization to the ferrule and housing of the active implantable medical device. 1. A hermetically sealed filtered feedthrough assembly that is attachable to an opening of a housing of an active implantable medical device , the filtered feedthrough assembly comprising:a) an electrically conductive ferrule comprising a ferrule opening, wherein the ferrule is configured to be attachable to an opening in a housing of an active implantable medical device (AIMD);b) an insulator at least partially residing in the ferrule opening where a first gold braze hermetically seals the insulator to the ferrule, the insulator comprising an insulator outer surface extending to an insulator body fluid side and to an insulator device side, wherein, when the ferrule is attached to the housing of the AIMD, the insulator body fluid side and the insulator device side reside outside the AIMD and inside the AIMD, respectively;c) at least one insulator active via hole extending through the insulator to the insulator body fluid side and to the insulator device side;d) an electrically conductive active leadwire ...

CAPACITOR AND METHOD OF MANUFACTURE THEREOF

An alternating current power capacitor including one or more capacitor bodies (e.g., bobbins) having conductive and dielectric film windings, wherein edges of the conductive film windings define a plane forming at least one capacitor body contact surface, one or more electrodes having one or more electrode contact surfaces and a housing operative to apply compressive force that binds the capacitor body and electrode together so that to maintain uniform electrical and thermal conductive contact throughout a plane parallel to and between the electrode contact surface and capacitor body contact surface. 1200. AC Capacitor () , comprising:{'b': 204', '230', '210, 'at least one capacitor body () having conductive and dielectric film windings and wherein an edge () of the conductive film windings defines a plane normal to a concentric axis (W) of the windings forming at least one capacitor body contact surface ();'}{'b': 206', '208, 'at least one electrode () having at least one electrode contact surface (); and'}{'b': 202', '210', '208, 'a housing () operative to apply compressive force operative to bind the capacitor body contact surface () and the electrode contact surface () together so that to maintain uniform electrical and thermal conductive contact throughout a plane parallel to and between the electrode contact surface and capacitor body contact surface.'}2. The capacitor according to claim 1 , wherein when assembled the electrode contact surface is in contact with over 50% of the winding's edge of the conductive film windings constituting a body contact surface.3. The capacitor according to claim 1 , wherein when assembled the electrode contact surface is in contact with over 75% of the winding's edge of the conductive film windings constituting a body contact surface.4. The capacitor according to claim 1 , wherein when assembled the electrode contact surface is in contact with over 90% of the winding's edge of the conductive film windings constituting a body ...

MULTILAYER CERAMIC CAPACITOR AND BOARD HAVING THE SAME

A multilayer ceramic capacitor may include: a ceramic body including a plurality of dielectric layers; first and second internal electrodes disposed in the ceramic body, the first internal electrode having first and second lead portions exposed to a first surface of the ceramic body in a width direction, and the second internal electrode having a third lead portion exposed to the first surface of the ceramic body in the width direction; first to third external electrodes disposed on the first surface of the ceramic body in the width direction to be connected to the first to third lead portions, respectively; and an insulation layer disposed on the first surface of the ceramic body in the width direction. Each of the first and second lead portions may be spaced apart from the third lead portion by a predetermined distance. 1. A multilayer ceramic capacitor comprising:a ceramic body including a plurality of dielectric layers;first and second internal electrodes disposed in the ceramic body, the first internal electrode having first and second lead portions spaced apart from each other by a predetermined distance and exposed to a first surface of the ceramic body in a width direction, and the second internal electrode having a third lead portion spaced apart from a third surface and a fourth surface connected to the first surface of the ceramic body by predetermined distances and exposed to the first surface of the ceramic body in the width direction;first to third external electrodes disposed on the first surface of the ceramic body in the width direction to be connected to the first to third lead portions, respectively; andinsulation layers disposed on the first surface of the ceramic body in the width direction, and on the third and fourth surfaces of the ceramic body in the length direction, wherein first and second insulation layers of the insulation layers are disposed on the first surface of the ceramic body in the width direction, and third and fourth ...

CAPACITOR AND PRODUCING METHOD THEREFOR

A capacitor includes: a first electrode and a second electrode respectively configured to connect an external circuit; at least one support, the a support is a pillar-shaped or wall-shaped structure; a laminated structure including multiple conductive layers and multiple dielectric layers for insulating the conductive layers; and an interconnection structure electrically connects the first electrode and the second electrode to the first conductive layer and second conductive layer of the conductive layers respectively, the second conductive layer is adjacent to the first conductive layer, and the first conductive layer and second conductive layer are separated by a dielectric layer of the multiple dielectric layers. The capacitor is formed using a laminated structure, which could obtain a great capacitance value in a case of a small device size. 1. A capacitor , comprising:a first electrode and a second electrode respectively configured to connect an external circuit;at least one support, the at least one support being a pillar-shaped structure or a wall-shaped structure;a laminated structure comprising at least one dielectric layer and at least one conductive layer; the at least one dielectric layer and the at least one conductive layer covering the at least one support, and the at least one dielectric layer and the at least one conductive layer forming a structure that a dielectric layer and a conductive layer are adjacent to each other; andan interconnection structure configured to electrically connect the first electrode to the at least one support or a first conductive layer of the at least one conductive layer, and to electrically connect the second electrode to a second conductive layer of the at least one conductive layer, wherein the second conductive layer is adjacent to the at least one support or the first conductive layer which is electrically connected to the first electrode, and the second conductive layer and the support or the first conductive layer ...

CAPACITOR AND MANUFACTURING METHOD THEREFOR

A capacitor includes: a substrate; a first trench entering the substrate downward from the upper surface of the substrate; a laminated structure provided in the first trench and including m dielectric layers and n conductive layers, the m dielectric layers and the n conductive layers forming a structure that a conductive layer and a dielectric layer are adjacent to each other, each dielectric layer of the m dielectric layers including at least one high-k insulating material with a relative dielectric constant k greater than a first threshold value, and each conductive layer of the n conductive layers including at least one high work function conductive material with a work function greater than a second threshold value, where m and n are positive integers; and a first electrode electrically connected to all odd-numbered conductive layers, and a second electrode electrically connected to all even-numbered conductive layers. 1. A capacitor , comprising:a substrate comprising an upper surface and a lower surface disposed oppositely;a first trench provided in the substrate and entering the substrate downward from the upper surface;a laminated structure provided above the substrate and in the first trench, the laminated structure comprising m dielectric layers and n conductive layers, the m dielectric layers and the n conductive layers forming a structure that a conductive layer and a dielectric layer are adjacent to each other so that a corresponding dielectric layer of the m dielectric layers electrically isolates the n conductive layers from each other, each of the m dielectric layers comprising at least one high-k insulating material with a relative dielectric constant k greater than or equal to a first threshold value, and each conductive layer of the n conductive layers comprising at least one high work function conductive material with a work function greater than or equal to a second threshold value, wherein m and n are positive integers;a first electrode ...

TRENCH CAPACITOR

A trench capacitor according to one embodiment of the present invention includes a base member with an upper surface having a plurality of trenches provided therein and an MIM structure provided on the base member so as to be embedded in the plurality of trenches. In the embodiment, the plurality of trenches include a first trench and a second trench adjacent to the first trench in a first direction orthogonal to a depth direction of the plurality of trenches. The base member includes a first wall separating the first trench from the second trench. The first wall includes a first portion having an acute angle at a distal end thereof in a section including the first direction and the depth direction. 1. A trench capacitor , comprising:a base member with an upper surface having a plurality of trenches provided therein; andan MIM structure provided on the base member so as to be embedded in the plurality of trenches, a first trench; and', 'a second trench adjacent to the first trench in a first direction orthogonal to a depth direction of the plurality of trenches,, 'wherein the plurality of trenches includewherein the base member includes a first wall separating the first trench from the second trench, andwherein the first wall includes a first portion having an acute angle at a distal end thereof in a section including the first direction and the depth direction.2. The trench capacitor according to claim 1 , wherein the first wall is formed so that the distal end of the first portion has a distal end curvature radius of 50 nm or less.3. The trench capacitor according to claim 1 , wherein the first portion of the first wall includes:a first inclined surface inclined at a first angle with respect to the depth direction; anda second inclined surface inclined at a second angle with respect to the depth direction, the second inclined surface being connected to the first inclined surface.4. The trench capacitor according to claim 3 , wherein the first wall is formed so ...

EDDER COMPOUND AND CAPACITOR THEREOF

A metadielectric composite oligomeric organic material according to the formula: 3. The metadielectric composite oligomeric organic material of wherein all resistive insulating groups are selected independently from the group consisting of non-aromatic carbocycles and non-aromatic heterocycles.4. The metadielectric composite oligomeric organic material of wherein each instance of A is independently selected from —NO claim 1 , —CHO (aldehyde) claim 1 , —CRO (keto group) claim 1 , —SOH (sulfonic acids) claim 1 , —SOR (sulfonates) claim 1 , SONH claim 1 , —SONHR claim 1 , —SONR′R″ (sulfonamides) claim 1 , —COOH (carboxylic acid) claim 1 , —COOR (esters claim 1 , from carboxylic acid side) claim 1 , —CONH claim 1 , CONHR claim 1 , CONR′R″ (amides claim 1 , from carboxylic acid side) claim 1 , —CF claim 1 , —CCl claim 1 , and —CN claim 1 , and{'sub': 2', '2', '6', '5, 'wherein each instance of D is independently selected from —NH, —NHR, —NR, —OH, OR (ethers), —NHCOR (amides, from amine side), —OCOR (esters, from alcohol side), alkyls, —CH, and vinyls, and'}wherein R and R′ and R″ are radicals independently selected from the list comprising hydrogen, alkyl (methyl, ethyl, isopropyl, tert-butyl, neopentyl, cyclohexyl etc.), allyl (˜CH2-CH═CH2), benzyl (—CH2C6H5) groups, phenyl (+substituted phenyl) and other aryl (aromatic) groups.6. The composite oligomeric organic material of wherein the insulating resistive groups are independently selected from the group consisting of saturated hydrocarbon claim 1 , saturated halogenated hydrocarbon claim 1 , partially halogenated hydrocarbon claim 1 , aryl chain claim 1 , and cycloalkyl claim 1 , and X—RR′R″; wherein X is selected from C claim 1 , O claim 1 , N claim 1 , and S claim 1 , and R claim 1 , R′ claim 1 , and R″ claim 1 , wherein R′ and R″ are absent when necessitated by the valence of X claim 1 , are independently selected from H and C claim 1 , wherein one or more of R claim 1 , R′ claim 1 , and R″ is C.7. The composite ...

FILM CAPACITOR

A film capacitor includes a capacitor element that includes an element body formed of a winding of or a laminate of metallized films and a P pole electrode and an N pole electrode that are respectively formed on opposite end faces of the element body. The film capacitor also includes a P electrode bus bar and an N electrode bus bar that are respectively connected to the P pole electrode and the N pole electrode, and an electrically conductive covering that covers a peripheral surface of the capacitor element with the covering spaced away from at least one of the P pole electrode or the N pole electrode. 1. A film capacitor comprising:a capacitor element including an element body that is formed of a winding of a metallized film or a laminate of metallized films, a positive (P) pole electrode, and a negative (N) pole electrode, the P pole electrode and the N pole electrode being respectively formed on opposite end faces of the element body;a positive (P) electrode lead terminal connected to the P pole electrode;a negative (N) electrode lead terminal connected to the N pole electrode; anda covering that is electrically conductive and covers a peripheral surface of the capacitor element with the covering spaced away from at least one of the P pole electrode or the N pole electrode.2. The film capacitor according to claim 1 , whereinthe covering touches one of the P pole electrode and the N pole electrode and is spaced away from another one of the P pole electrode and the N pole electrode.3. The film capacitor according to claim 2 , whereinthe covering touches the N pole electrode and is spaced away from the P pole electrode.4. The film capacitor according to claim 2 , wherein:the covering extends over to a surface of the one of the P pole electrode and the N pole electrode; anda lead terminal corresponding to the one of the P pole electrode and the N pole electrode among the P electrode lead terminal and the N electrode lead terminal is covered by the covering at a ...

Ceramic electronic component, method of producing the same, and electronic component mounting substrate

A ceramic electronic component includes a ceramic body, a sintered metal film, and a metal terminal. The ceramic body includes internal electrodes. The sintered metal film has a joint surface having a surface roughness Ra of 0.200 μm or less. The sintered metal film is connected to the internal electrodes and formed on a surface of the ceramic body. The metal terminal is jointed to the joint surface.

Multi-Layer Ceramic Capacitor and Method of Producing the Same

A multi-layer ceramic capacitor includes a multi-layer unit, side margins, and bonding units. The multi-layer unit includes ceramic layers laminated in a first direction and internal electrodes disposed between the ceramic layers. The side margins cover the multi-layer unit from a second direction orthogonal to the first direction. The bonding units are each disposed between the multi-layer unit and each of the side margins and have higher silicon content than the ceramic layers and the side margins. 1. A multi-layer ceramic capacitor , comprising: ceramic layers laminated in a first direction, and', 'internal electrodes disposed between the ceramic layers;, 'a multi-layer unit that includes'}side margins that cover side surfaces of the multi-layer unit from a second direction orthogonal to the first direction; andbonding units that are each disposed between the multi-layer unit and each of the side margins and have more pores filled with glass phases than the ceramic layers and the side margins,wherein the bonding units cover entire areas of the side surfaces of the multi-layer unit covered by the side margins.2. The multi-layer ceramic capacitor according to claim 1 , whereineach of the bonding units has a thickness of 0.5 μm or more and 5 μm or less.3. The multi-layer ceramic capacitor according to claim 1 , whereinthe glass phases contain silicon.4. The multi-layer ceramic capacitor according to claim 3 , whereinthe glass phases contain at least one of barium, manganese, magnesium, boron, vanadium, holmium, aluminum, calcium, zinc, potassium, tin, and zirconium.5. The multi-layer ceramic capacitor according to claim 4 , whereinthe ceramic layers are polycrystals having a Perovskite structure containing barium and titanium, andthe glass phases contain barium. This application is a continuation of U.S. application Ser. No. 15/380,346, filed Dec. 15, 2016, which claims the benefit under 35 U.S.C. § 119 to Japanese Patent Application No. 2015-243881, filed Dec. 15, ...

MULTILAYER CERAMIC CAPACITOR

In an exemplary embodiment, a multilayer ceramic capacitor is formed in such a way that a first face f of a capacitor body has a concave shape and a first part of a first external electrode contacts the concave-shaped first face f, and that a second face f of the capacitor body has a concave shape and a first part of a second external electrode contacts the concave-shaped second face f 1. A multilayer ceramic capacitor , comprising:(1) a capacitor body having a first face and a second face that are facing each other in a length direction, a third face and a fourth face that are facing each other in a width direction, and a fifth face and a sixth face that are facing each other in a height direction, as well as a built-in capacitive part constituted by multiple first internal electrode layers and multiple second internal electrode layers stacked alternately with dielectric layers in between in the height direction, wherein the number of the dielectric layers is at least 15;(2) a first external electrode having a first part along the first face, and a second part along the fifth face, of the capacitor body, where ends of the multiple first internal electrode layers are exposed on the first face and connected to the first part, respectively; and(3) a second external electrode having a first part along the second face, and a second part along the fifth face, of the capacitor body, where ends of the multiple second internal electrode layers are exposed on the second face and connected to the first part, respectively;wherein the first face of the capacitor body has a concave shape along the height direction and the first part of the first external electrode contacts the first face of the capacitor body; andwherein while the second face of the capacitor body has a concave shape along the height direction and the first part of the second external electrode contacts the second face of the capacitor body.2. The multilayer ceramic capacitor according to claim 1 , wherein the ...

HIGH ENERGY DENSITY CAPACITOR WITH MICROMETER STRUCTURES AND NANOMETER COMPONENTS

A high density energy storage system including a giant-colossal dielectric thin film material electrically insulating between two electrodes configured to have increased overlapping surface area. 2. (canceled)3. The system of claim 1 , wherein the through-holes are defined by one or more sets of a hub claim 1 , one or more spokes extending from the hub and one or more rims surrounding the hub and coupled to the hub via the spokes.4. The system of claim 3 , wherein the rims claim 3 , the spokes and the protrusions each have a width of between 0.1976 and 100 micrometers and the hubs each have a radius of between 0.1976 and 100 micrometers.5. The system of claim 4 , wherein the hubs claim 4 , the rims claim 4 , the spokes and the protrusions each have a height of between 0.025 and 10 centimeters.6. The system of claim 1 , wherein the non-conductive film has a thickness of between 10 and 5000 nanometers.7. The system of claim 6 , wherein the non-conductive film is a compound dielectric material of two or more dielectric materials.8. The system of claim 6 , wherein the non-conductive film is a complex dielectric material of two or more dielectric materials.9. The system of claim 6 , wherein the non-conductive film comprises at least one giant-colossal dielectric material and at least one material having a non-giant-colossal dielectric constant.10. The system of claim 6 , wherein the non-conductive film covers the entirety of the first electrode or the second electrode.11. The system of claim 1 , wherein two or more of the capacitor modules are electrically coupled together in series claim 1 , in parallel or both.13. (canceled)14. The capacitor of claim 12 , wherein the through-holes are defined by one or more sets of a hub claim 12 , one or more spokes extending from the hub and one or more rims surrounding the hub and coupled to the hub via the spokes.15. The capacitor of claim 14 , wherein the rims claim 14 , the spokes and the protrusions each have a width of between ...

ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME

An electronic component is provided with: an electronic component body including a top face, a bottom face, a pair of side faces, and a pair of end faces provided with an outside electrode; and a pair of metal terminals individually connected to the pair of outside electrodes of the electronic component body, wherein the metal terminals is electrically and mechanically connected to the outside electrode of the electronic component body, and is also in contact with bottom face of the electronic component. The electronic component requires no jig or a simple jig if any for securing a metal terminal and electronic component body in place. 1. An electronic component comprising:an electronic component element having a top face, a bottom face, a pair of side faces, and a pair of end faces as well as a pair of external electrodes provided on the pair of end faces; anda pair of metal terminals respectively connected to the pair of external electrodes on the electronic component element;wherein each metal terminal is constituted by: a lead terminal whose one end is electrically and mechanically connected to the external electrode on the electronic component element; and a plate-shaped horizontal part to which another end of the lead terminal is connected and which also has a bottom contact part in contact with the bottom face of the electronic component element, wherein the lead terminal includes a part formed between the one end and the other end as a lead facing the external electrode, said lead being capable of undergoing flexural deformation by bending.2. An electronic component according to claim 1 , wherein a center of gravity of the metal terminal is positioned inside the electronic component element as viewed from above.3. (canceled)4. A method for manufacturing an electronic component claim 1 , which is a method for manufacturing an electronic component comprising an electronic component element having a top face claim 1 , a bottom face claim 1 , a pair of side ...

ELECTRICAL COMPONENT HAVING LAYERED STRUCTURE WITH IMPROVED BREAKDOWN PERFORMANCE

An electrical component having a layered structure including first and second electrodes each having first and second electrode portions located in a plane and at least partially embedded in a dielectric body, each of the first and second electrode portions separated by a gap and substantially isolated by the dielectric, the first electrode substantially parallel to and at least partially overlapping the second electrode, wherein the first and second electrodes are electrically isolated and separated by the dielectric body. 1. An electrical component having a layered structure , the electrical component comprising:a dielectric body having a first end portion and a second end portion;a first electrode comprising a first portion and a second portion located in a common plane and at least partially embedded in the dielectric body between the first and second end portions thereof, the first and second portions of the first electrode separated by a gap and substantially isolated by the dielectric body; a second electrode comprising a first portion and a second portion located in a common plane and at least partially embedded in the dielectric body between the first and second end portions thereof, the first and second portions of the second electrode separated by a gap and substantially isolated by the dielectric body; andthe first electrode substantially parallel to and at least partially overlapping the second electrode, and the first and second electrodes electrically isolated and separated by the dielectric body.2. The electrical component of further comprising:a first conductive termination coupled to the first end portion of the dielectric body, the first conductive termination electrically coupled to the first and second portions of the first electrode; anda second conductive termination coupled to the second end portion of the dielectric body, the second conductive termination electrically coupled to the first and second portions of the second electrode.3. The ...

EMI FILTERED CO-CONNECTED HERMETIC FEEDTHROUGH, FEEDTHROUGH CAPACITOR AND LEADWIRE ASSEMBLY FOR AN ACTIVE IMPLANTABLE MEDICAL DEVICE

A co-connected hermetic feedthrough, feedthrough capacitor, and leadwire assembly includes a dielectric substrate with a via hole disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via forming a hermetic seal and is electrically conductive between the body fluid side and the device side. A feedthrough capacitor is attached to the dielectric substrate and includes a capacitor dielectric substrate, an unfilled capacitor via hole including an inner metallization, a set of capacitor active electrode plates electrically coupled to the inner metallization, an outer metallization disposed and a set of capacitor ground electrode plates electrically coupled to the outer metallization. A conductive leadwire is disposed within the unfilled capacitor via hole. An electrical joint connects the conductive fill, the capacitor inner metallization along with the capacitor active electrode plates and the conductive leadwire. 1. A filter feedthrough assembly , comprising: i) an insulator of electrically non-conductive material defined by an insulator sidewall having an outer insulator surface extending along a first length from a first insulator end to a second insulator end;', 'ii) at least one insulator via defined by an insulator bore extending along a second length that is less than the first length, wherein the insulator via extends from a first via end spaced from the first insulator end to a second via end at the second insulator end;', 'iii) an internal circuit trace extending from the insulator bore to the outer insulator surface, wherein the circuit trace is spaced from the first and second insulator ends;', 'iv) a conductive fill disposed within the insulator via, wherein the conductive fill forms both a hermetic seal with the insulator bore and an electrically conductive path extending from the internal circuit trace to a second conductive fill end at the second insulator end; and', 'v) a ferrule of ...

LOW EQUIVALENT SERIES RESISTANCE RF FILTER FOR AN AIMD

An AIMD includes a conductive housing, an electrically conductive ferrule with an insulator hermetically sealing the ferrule opening. A conductive pathway is hermetically sealed and disposed through the insulator. A filter capacitor is disposed on a circuit board within the housing and has a dielectric body supporting at least two active and two ground electrode plates interleaved, wherein the at least two active electrode plates are electrically connected to the conductive pathway on the device side, and the at least two ground electrode plates are electrically coupled to either the ferrule and/or the conductive housing. The dielectric body has a dielectric constant less than 1000 and a capacitance of between 10 and 20,000 picofarads. The filter capacitor is configured for EMI filtering of MRI high RF pulsed power by a low ESR, wherein the ESR of the filter capacitor at an MRI RF pulsed frequency or range of frequencies is less than 2.0 ohms. 1. A low equivalent series resistance filter capacitor assembly for an active implantable medical device , the filter capacitor assembly comprising:a) an electrically conductive ferrule defining a ferrule opening, wherein the ferrule is configured to be attachable to an opening in a housing of an active implantable medical device;b) an insulator at least partially residing in the ferrule opening and being hermetically sealed to the ferrule, wherein the insulator extends from an insulator body fluid side to an insulator device side with an insulator via hole extending through the insulator to the insulator body fluid and device sides;c) an active conductive pathway hermetically sealed to the insulator in the via hole, the active conductive pathway extending from an active conductive pathway body fluid side to an active conductive pathway device side, wherein the active conductive pathway is in a non-conductive relation to the ferrule; i) a ceramic dielectric body having a dielectric constant. that is greater than zero, but less ...

ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME

A method for manufacturing an electronic component includes preparing a rectangular or substantially rectangular parallelepiped multilayer body made of dielectric ceramic containing Ti and Ba. The multilayer body includes inner electrodes embedded therein, a pair of opposite end surfaces, and four side surfaces connecting the end surfaces to each other. The method further includes forming an oleophobic coating film containing BaF on the surface of the multilayer body, and immersing the end surfaces of the multilayer body having the coating film formed thereon into a conductive paste having a viscosity of about 15 Pa·s or less. 1. An electronic component comprising:a rectangular or substantially rectangular parallelepiped multilayer body made of dielectric ceramic containing Ti and Ba, the multilayer body including inner electrodes embedded therein, a pair of opposite end surfaces, and four side surfaces connecting the end surfaces to each other; andtwo outer electrodes provided on the pair of end surfaces, respectively, and electrically connected to the inner electrodes; whereinat least a portion of an exposed portion of each of the four side surfaces between the outer electrodes is covered with BaF.2. The electronic component according to claim 1 , wherein an entirety of the exposed portion of each of the four side surfaces between the outer electrodes is covered with the BaF.3. The electronic component according to claim 1 , wherein the at least the portion of the exposed portion is covered with a coating film that is made of a polymer in which monomers of CF claim 1 , CF claim 1 , CF claim 1 , and the BaF are polymerized.4. The electronic component according to claim 3 , wherein the BaF is detected as BaF by time-of-flight secondary ion mass spectrometry.5. The electronic component according to claim 4 , wherein{'sup': +', '+', '+, 'sub': 2', '2', '3', '3, 'the CF is detected as CF, the CFis detected as CF, and the CFis detected as CF by the time-of-flight ...

COMPOSITE ELECTRONIC COMPONENT AND RESISTANCE ELEMENT

A composite electronic component includes an electronic element mounted on a resistance element in a height direction. The electronic element includes an electronic element body, and first and second external electrodes separated from each other in a length direction. The resistance element includes a base portion, a resistor disposed on an upper surface of the base portion, and first and second upper surface conductors on the upper surface of the base portion. The first and second upper surface conductors are separated from each other in the length direction, and the resistor is located between the first and second upper surface conductors. A dimension in the height direction of the resistor is smaller than both a dimension in the height direction of the first external electrode of a portion located on a lower surface of the electronic element body, and a dimension in the height direction of the second external electrode of a portion located on a lower surface of the electronic element body. 1. A composite electronic component comprising:a resistance element; andan electronic element mounted on the resistance element in a height direction; wherein an insulating base portion including an upper surface and a lower surface intersecting with the height direction;', 'a first upper surface conductor and a second upper surface conductor that are disposed on the upper surface of the base portion and are separated from each other in a length direction perpendicular or substantially perpendicular to the height direction; and', 'a resistor that is disposed on the upper surface of the base portion and is located between the first upper surface conductor and the second upper surface conductor; wherein, 'the resistance element includes an electronic element body including a lower surface intersecting with the height direction; and', 'a first external electrode and a second external electrode that are disposed at least on the lower surface of the electronic element body and are ...

COMPOSITE ELECTRONIC COMPONENT AND RESISTANCE ELEMENT

A composite electronic component includes an electronic element and a resistance element in a height direction. The electronic element includes an electronic element body, and first and second external electrodes separated from each other in a length direction. The resistance element includes a base portion, a resistor disposed on an upper surface of the base portion, a protective film and first and second upper surface conductors. The first and second upper surface conductors are separated from each other in the length direction and the resistor is between the first and second upper surface conductors. The protective film covers the resistor. Dimensions in the height direction from the upper surface of the base portion to exposed surfaces of a pair of end portions in the length direction of the protective film are smaller than a dimension in the height direction from the upper surface of the base portion to an exposed surface of the protective film in the center portion. 1. A composite electronic component comprising:a resistance element; andan electronic element mounted on the resistance element in a height direction; wherein an insulating base portion including an upper surface and a lower surface intersecting the height direction;', 'a first upper surface conductor and a second upper surface conductor that are disposed on the upper surface of the base portion and are separated from each other in a length direction perpendicular or substantially perpendicular to the height direction;', 'a resistor that is disposed on the upper surface of the base portion and is located between the first upper surface conductor and the second upper surface conductor; and', 'a protective film that covers the resistor and at least a portion of the upper surface of the base portion;, 'the resistance element includes an electronic element body including a lower surface intersecting the height direction; and', 'a first external electrode and a second external electrode that are ...

Multilayer Ceramic Structure

An improved multilayer ceramic capacitor is described. The multilayered ceramic capacitor comprises first internal electrodes and second internal electrodes. The first internal electrodes and said second internal electrodes are parallel with dielectric there between. A first external termination is in electrical connection with the first internal electrodes and a second external termination is in electrical contact with the second internal electrodes. A closed void layer, comprising at least one closed void, is between electrodes. 1. A multilayer ceramic capacitor comprising:first internal electrodes and second internal electrodes wherein said first internal electrodes and said second internal electrodes are parallel with dielectric there between;a first external termination wherein said first internal electrodes are in electrical contact with said first external termination;a second external termination wherein said second internal electrodes are in electrical contact with said second external termination; anda first closed void layer comprising at least one closed void wherein said closed void layer is between a first internal electrode of said internal electrodes and a second internal electrode of said second internal electrodes.2. The multilayered ceramic capacitor of further comprising a ceramic band at least partially circumnavigating at least one said closed void.3. The multilayered ceramic capacitor of wherein said ceramic band circumnavigates said closed void.4. The multilayered ceramic capacitor of wherein at least one said closed void is circumnavigated by a combination of said ceramic band and at least one of said first external termination or said second external termination.5. The multilayered ceramic capacitor of wherein said first closed void layer comprises at least two closed voids.6. The multilayered ceramic capacitor of further comprising a second closed void layer.7. The multilayered ceramic capacitor of wherein said first closed void layer and ...

COMPOSITE CONDUCTIVE POWDER, CONDUCTIVE PASTE FOR EXTERNAL ELECTRODE INCLUDING THE SAME, AND MANUFACTURING METHOD OF MULTILAYER CERAMIC CAPACITOR

There is provided a composite conductive powder including a conductive particle, and a coating layer formed on a surface of the conductive particle and including glass, wherein when a thickness of the coating layer in a portion A in which the coating layer is the thickest, on the surface of the conductive particle is defined as a, and a thickness of the coating layer in a portion B forming an angle of 90° with respect to the portion A on the surface of the conductive particle, based on a center of the conductive particle is defined as b, 0.1≦b/a≦0.7 is satisfied. 1. A composite conductive powder comprising:a conductive particle; anda coating layer formed on a surface of the conductive particle and including glass,wherein when a thickness of the coating layer in a portion A in which the coating layer is the thickest, on the surface of the conductive particle is defined as a, and a thickness of the coating layer in a portion B forming an angle of 90° with respect to the portion A on the surface of the conductive particle, based on a center of the conductive particle is defined as b, 0.1≦b/a≦0.7 is satisfied.2. The composite conductive powder of claim 1 , wherein when a diameter of the conductive particle is defined as d claim 1 , a/d<0.2 is satisfied.3. The composite conductive powder of claim 1 , wherein the thickness of the coating layer is gradually increased from a portion in which the coating layer is thinnest to the portion A in which the coating layer is the thickest claim 1 , on the surface of the conductive particle.4. The composite conductive powder of claim 1 , wherein the glass is included in an amount of 1 to 20 parts by weight based on 100 parts by weight of the conductive particle.5. The composite conductive powder of claim 1 , wherein the glass has a density of 1.5 g/cc to 5.0 g/cc.6. The composite conductive powder of claim 1 , wherein the conductive particle has an average particle diameter of 0.5 to 2.0 μm.7. The composite conductive powder of claim ...

CAPACITOR

A capacitor including a conductive metal base material having a porous part, a dielectric layer on the porous part, an upper electrode on the dielectric layer, and an oxide film on a surface of the conductive metal base material. 1. A capacitor comprising:a conductive metal base material having a porous part and a surface;a dielectric layer on the porous part;an upper electrode on the dielectric layer; andan oxide film on the surface of the conductive metal base material.2. The capacitor according to claim 1 , wherein the oxide film is on an end of the surface of the conductive metal base material.3. The capacitor according to claim 2 , wherein the end of the surface of the conductive metal base material is a region that occupies 1% to 30% of a distance between a pair of sides of the conductive metal base material opposed to each other.4. The capacitor according to claim 2 , wherein the end of the surface of the conductive metal base material is a region that occupies 3 μm or more of a distance from an edge of the surface of the conductive metal base material.5. The capacitor according to claim 1 , wherein the oxide film is an anodized film of the conductive metal base material.6. The capacitor according to claim 5 , wherein the anodized film is selected from AlO(for example claim 5 , AlO) claim 5 , TaO claim 5 , TiO claim 5 , NbO claim 5 , ZrO claim 5 , WO claim 5 , AlTiO claim 5 , TiZrO claim 5 , and TiZrWO claim 5 , where x is any value larger than 0.7. The capacitor according to claim 1 , wherein the conductive metal base material comprises a high-porosity part that defines the porous part and a low-porosity part that surrounds at least two sides of the high-porosity part claim 1 , and the oxide film is on at least the low-porosity part.8. The capacitor according to claim 7 , wherein the low-porosity part completely surrounds the high-porosity part.9. The capacitor according to claim 7 , wherein a porosity of the high-porosity part is 20% to 90%.10. The ...

ELECTRODE FORMATION

Apparatuses, methods, and systems related to electrode formation are described. A first portion of a top electrode is formed over a dielectric material of a storage node. A metal oxide is formed over the first portion of the electrode. A second portion of the electrode is formed over the metal oxide. 1. An apparatus , comprising:a first portion of an electrode formed over a dielectric material of a storage node;a metal oxide formed over the first portion of the electrode; anda second portion of the electrode formed over the metal oxide.2. The apparatus of claim 1 , wherein the electrode is a titanium nitride (TiN) electrode to a storage node that is a capacitor cell.3. The apparatus of claim 1 , wherein the metal oxide is aluminum oxide (AlOx).4. The apparatus of claim 1 , wherein the metal oxide is silicon oxide (SiOx).5. The apparatus of claim 1 , wherein the metal oxide is formed to a thickness in a range ten percent (10%) to fifteen percent (15%) of a thickness of the top electrode.6. The apparatus of claim 1 , wherein the metal oxide is positioned in a distinct area of the top electrode.7. The apparatus of claim 1 , wherein the dielectric material is a high dielectric constant (k) material.8. A method comprising:depositing a first portion of an electrode over a dielectric material of a storage node to a memory cell;depositing a metal oxide over the first portion of the electrode; anddepositing a second portion of the electrode over the metal oxide.9. The method of claim 8 , further comprising depositing the electrode as a top electrode to a thickness in a range of 0-40 Angstroms (Å).10. The method of claim 8 , further comprising depositing the metal oxide to a thickness in a range of 0-5 Å.11. The method of claim 8 , further comprising depositing the metal oxide using atomic layer deposition (ALD).12. The method of claim 8 , further comprising depositing the metal oxide using multiple cycles of atomic layer deposition (ALD).13. The method of claim 8 , further ...

CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME

External electrodes, electrically connected to exposed portions of internal electrodes, are arranged on end surfaces of a ceramic main body of a laminated ceramic capacitor. Alloy layers of a metal contained in internal electrodes, and a metal contained in external electrodes, are arranged at the boundaries between external electrodes, and the ceramic main body and internal electrodes. Plating layers are provided on surfaces of external electrodes. A ceramic electronic component having a reduced ESR is thus provided. 1. A ceramic electronic component comprising:a ceramic main body including a plurality of laminated ceramic layers;an internal electrode disposed inside the ceramic main body, the internal electrode including an exposed portion exposed on an end surface of the ceramic main body;an external electrode arranged on the end surface of the ceramic main body so as to be electrically connected with the exposed portion of the internal electrode; anda plating film arranged on the external electrode; whereinthe external electrode includes a metal medium in which metal powder is integrated and a glass medium in which glass powder is integrated;an alloy layer of a metal contained in the external electrode and a metal contained in the internal electrode are located at an interface between the external electrode, and the ceramic main body and the internal electrode; andthe metal medium and the glass medium are located between the alloy layer and the plating film.2. The ceramic electronic component according to claim 1 , wherein the metal medium is made of Cu.3. The ceramic electronic component according to claim 1 , wherein the alloy layer is an Ni—Cu alloy layer.4. The ceramic electronic component according to claim 1 , wherein a coverage ratio of the alloy layer on the end surface of the ceramic main body is about 72% or more.5. The ceramic electronic component according to claim 1 , wherein a distance between exposed portions of a plurality of the internal ...

MULTILAYER CERAMIC ELECTRONIC COMPONENT

There is provided a multilayer ceramic electronic component, including: a ceramic body formed by laminating dielectric layers having an average thickness of 0.7 μm or less; external electrodes formed on external surfaces of the ceramic body; and internal electrodes respectively disposed on the dielectric layer so as to have a gap formed therebetween, wherein, when a narrowest gap between the internal electrode edges adjacent to one another is denoted by Gmin, 10 μm≦Gmin≦60 μm is satisfied. 1. A multilayer ceramic electronic component , comprising:a ceramic body including dielectric layers;external electrodes formed on external surfaces of the ceramic body; andinternal electrodes adjacent to one another with a gap therebetween on a single dielectric layer, each of the internal electrodes having convex-shape sides adjacent to the internal electrodes,wherein the gap between the convex-shape sides of adjacent internal electrodes is narrower toward a central portion of the internal electrode in a width direction thereof.2. The multilayer ceramic electronic component of claim 1 , wherein each of the dielectric layers has an average thickness of 0.7 μm or less.3. The multilayer ceramic electronic component of claim 1 , wherein a narrowest gap between the convex-shape sides of the internal electrodes adjacent to one another is denoted by Gmin claim 1 , 10 μm≦Gmin≦60 μm.5. The multilayer ceramic electronic component of claim 4 , wherein Wa is a widest width of the internal electrode and Wb is a narrowest width of the internal electrode.6. The multilayer ceramic electronic component of claim 1 , wherein claim 1 , when a margin portion between the convex-shape sides of the internal electrodes and one end surface of the ceramic body adjacent thereto is denoted by Ms claim 1 , Gmin≦Ms is satisfied.7. The multilayer ceramic electronic component of claim 1 , wherein claim 1 , between the internal electrodes having the dielectric layer therebetween and facing one another in a ...

CHIP-TYPE ELECTRONIC COMPONENT

A chip-type electronic component mounted on a board includes a chip element assembly having an upper surface, a lower surface, and a side surface; inner electrodes and formed inside the chip element assembly and a cover layer that is formed with an insulation material having a lower permittivity than the chip element assembly and is so provided as to cover at least part of the side surface of the chip element assembly With this structure, unnecessary stray capacitance between the inner electrodes and formed inside the chip element assembly and other electrode members arranged outside the cover layer in a direction orthogonal to a thickness direction of the chip element assembly can be reduced, whereby the chip-type electronic component capable of realizing the desired characteristics can be provided. 1. A chip-type electronic component adapted for being mounted on a board , comprising:a chip element assembly having an upper surface, a lower surface, and a side surface;an inner electrode located inside the chip element assembly; anda cover layer comprising an insulation material having a lower permittivity than the chip element assembly, the cover layer being positioned to cover at least a part of the side surface of the chip element assembly.2. The chip-type electronic component according to claim 1 , further comprising:a plurality of first side-surface electrodes located on the side surface of the chip element assembly,wherein at least a part of each of the plurality of first side-surface electrodes is covered with the cover layer.3. The chip-type electronic component according to claim 2 ,wherein each of the plurality of first side-surface electrodes further includes an extended section exposed from the cover layer and positioned to extend from the side surface of the chip element assembly onto the lower surface of the chip element assembly.4. The chip-type electronic component according to claim 1 , further comprising:a second side-surface electrode located on ...

MULTILAYER CERAMIC CAPACITOR

A multilayer ceramic capacitor that includes a laminate which has a plurality of dielectric layers and a plurality of internal electrode layers respectively laminated. The dielectric layers are a perovskite type structure containing Ba, Sr, Zr, Ti and Hf, and optionally Ca, and further include V, wherein (number of moles of Sr)/(number of moles of Ba+number of moles of Ca+number of moles of Sr) is 0.6 to 0.95, (number of moles of Zr)/(number of moles of Zr+number of moles of Ti+number of moles of Hf) is 0.9 to 0.98, thicknesses of the dielectric layers are 1 μm or less, and an average particle size of dielectric particles constituting the dielectric layers is 0.8 μm or less. 1. A multilayer ceramic capacitor comprising: (number of moles of Sr)/(number of moles of Ba+number of moles of Sr) is 0.6 to 0.95,', '(number of moles of Zr)/(number of moles of Zr+number of moles of Ti+number of moles of Hf) is 0.9 to 0.98,', 'a thickness of the dielectric layers is 1 μm or less, and', 'an average particle size of dielectric particles of the dielectric layer is 0.8 μm or less;, 'a laminate having a plurality of dielectric layers and a plurality of internal electrode layers respectively laminated, and having a first main surface and a second main surface opposed to each other in a lamination direction, a first side surface and a second side surface opposed to each other in a width direction orthogonal to the lamination direction, and a first end surface and a second end surface opposed to each other in a length direction orthogonal to the lamination direction and the width direction, the dielectric layers comprising a perovskite type structure containing Ba, Sr, Zr, Ti, Hf, and V, wherein'}a first external electrode covering the first end surface and extending from the first end surface onto the first and second main surfaces and the first and second side surfaces; anda second external electrode covering the second end surface and extending from the second end surface onto the ...

ELECTRONIC COMPONENT

An electronic component capable of suppressing variations in dimension of plating growth of a plating film serving as an external electrode. The external electrodes include plating films formed so as to extend from each of end surfaces to side surfaces of an electronic component body by electrolytic plating. Underlying main electrodes in which the degree of plating growth is relatively high, and underlying sub-electrodes in which the degree of plating growth is relatively low, are formed as a seed electrode serving as a starting point of plating growth for forming a plating film. 1. An electronic component comprising:an electronic component body;underlying electrodes formed so as to be exposed at a plurality of points of an outer surface of the electronic component body; andexternal electrodes including plating films formed on the outer surface of the electronic component body by electrolytic plating using the underlying electrodes as a seed electrode serving as a starting point of plating growth,wherein the underlying electrodes include underlying main electrodes and underlying sub-electrodes, the underlying sub-electrodes are located along the specific end edges of the plating films, the underlying main electrodes are located away from the specific end edges of the plating films at a greater distance than the underlying sub-electrodes,in a stage prior to formation of the plating film, the underlying main electrodes are commonly electrically connected to one another, and the underlying main electrodes are not electrically connected to the underlying sub-electrode, andan exposed area of the underlying sub-electrode which is exposed to the outer surface of the electronic component body is made smaller than an exposed area of the underlying main electrodes commonly electrically connected to one another which are exposed to the outer surface of the electronic component body.2. The electronic component according to claim 1 ,wherein the electronic component body has a ...

MULTILAYER CERAMIC CAPACITOR

A multilayer ceramic capacitor includes a laminated body and first and second external electrodes respectively on both end surfaces of the laminated body. When regions where first internal electrodes or second internal electrodes are not present are regarded as side margin portions in a cross section of the laminated body as viewed from the laminating direction, the side margin portions include multiple side margin layers, and the content of Si in the side margin layer closest to the internal electrode is lower than that in the side margin layer other than the side margin layer closest to the internal electrode. 1. A multilayer ceramic capacitor comprising:a laminated body including a plurality of dielectric layers laminated and a plurality of internal electrodes; anda plurality of external electrodes electrically connected to the internal electrodes; whereinthe laminated body includes a first principal surface and a second principal surface opposed in a laminating direction, a first side surface and a second side surface opposed in a width direction perpendicular or substantially perpendicular to the laminating direction, and a first end surface and a second end surface opposed in a length direction perpendicular or substantially perpendicular to both the laminating direction and the width direction;the plurality of internal electrodes includes first internal electrodes exposed at the first end surface, and second internal electrodes exposed at the second end surface to be opposed to the first internal electrodes with the dielectric layers interposed therebetween;the plurality of external electrodes includes a first external electrode covering the first end surface and electrically connected to the first internal electrodes, and a second external electrode covering the second end surface and connected to the second internal electrodes; andregions where the first internal electrodes or the second internal electrodes are not present are regarded as side margin ...

Methods and systems for increasing surface area of multilayer ceramic capacitors

Methods and systems to improve a multilayer ceramic capacitor using additive manufacturing are disclosed. Layers of a capacitor may be modified from its traditional planar shape to a wavy structure. The wavy shape increases surface area within a fixed volume of the capacitor, thus increasing capacitance, and may comprise smooth and repetitive oscillations without the presence of voltage-degrading sharp corners. In addition, the ends of each conductive layer do not have sharp edges, such as comprising of a round corner. The one-dimensional wave pattern may run parallel to the width of the capacitor, or it may align in parallel to the length of the capacitor. In some embodiments, the wave pattern may be parallel to both the width and the length—in two dimensions—such that it forms an egg-crate shape. Further, the wavy structures may comprise of secondary or tertiary wavy structures to further increase surface area.

ELECTRONIC PART, ELECTRONIC DEVICE, AND MANUFACTURING METHOD

An electronic part includes: a substrate; a first electrode configured to extend through the substrate and have a first opening size; a second electrode configured to extend through the substrate and have a second opening size; a switching section configured to switch between connection of the first electrode to a first power line and connection of the second electrode to the first power line; and a third electrode configured to extend through the substrate and be connected to a second power line different in potential from the first power line, a capacitance between the first and third electrodes and a capacitance between the second and third electrodes being different.

Multilayer ceramic electronic component to be embedded in board and printed circuit board having multilayer ceramic electronic component embedded therein

There is provided a multilayer ceramic electronic component, including a ceramic body having first and second side surfaces facing each other, and first and second end surfaces facing each other; first and second internal electrodes having first and second lead portions; and first and second external electrodes extended from the first and second end surfaces of the ceramic body to the first and second side surfaces, respectively, wherein when a distance from an end portion of the first or second external electrode formed on the first or second side surface of the ceramic body to a point of the first or second external electrode connected to the first or second lead portion is defined as G, and a width of the first or second external electrode on the first or second side surface of the ceramic body is defined as BW, 30 μm≦G<BW is satisfied.

MULTILAYER CERAMIC ELECTRONIC PART TO BE EMBEDDED IN BOARD AND PRINTED CIRCUIT BOARD HAVING MULTILAYER CERAMIC ELECTRONIC PART EMBEDDED THEREIN

There is provided a multilayer ceramic electronic part to be embedded in a board including: a ceramic body including dielectric layers; an active layer including a plurality of first and second internal electrodes; upper and lower cover layers disposed on and below the active layer, respectively; and first and second external electrodes formed on both end portions of the ceramic body, wherein a first internal electrode positioned at an outermost position among the first electrodes is connected to the first external electrode by at least one first via extended to at least one of first and second main surfaces of the ceramic body, and a second internal electrode positioned at an outermost position among the second internal electrodes is connected to the second external electrode by at least one second via extended to at least one of first and second main surfaces of the ceramic body. 1. A multilayer ceramic electronic part to be embedded in a board , the multilayer ceramic electronic part comprising:a ceramic body including dielectric layers and having first and second main surfaces opposing each other, first and second side surfaces opposing each other, and first and second end surfaces opposing each other;an active layer including a plurality of first and second internal electrodes alternately exposed through the first and second end surfaces of the ceramic body, having the dielectric layers therebetween, to thereby form capacitance;upper and lower cover layers disposed on and below the active layer, respectively; andfirst and second external electrodes formed on both end portions of the ceramic body,wherein the first external electrode includes a first base electrode and a first terminal electrode formed on the first base electrode,the second external electrode includes a second base electrode and a second terminal electrode formed on the second base electrode,a first internal electrode positioned at an outermost position among the first and second internal ...

MULTILAYER CERAMIC CAPACITOR AND BOARD HAVING THE SAME

A multilayer ceramic capacitor may include: a ceramic body including a plurality of dielectric layers; first and second internal electrodes disposed in the ceramic body, the first internal electrode having first and second lead portions exposed to a first surface of the ceramic body in a width direction, and the second internal electrode having a third lead portion exposed to the first surface of the ceramic body in the width direction; first to third external electrodes disposed on the first surface of the ceramic body in the width direction to be connected to the first to third lead portions, respectively; and an insulation layer disposed on the first surface of the ceramic body in the width direction. Each of the first and second lead portions may be spaced apart from the third lead portion by a predetermined distance. 1. A multilayer ceramic capacitor comprising:a ceramic body including a plurality of dielectric layers;first and second internal electrodes disposed in the ceramic body, the first internal electrode having first and second lead portions spaced apart from each other by a predetermined distance and exposed to a first surface of the ceramic body in a width direction, and the second internal electrode having a third lead portion spaced apart from a third surface and a fourth surface connected to the first surface of the ceramic body by predetermined distances and exposed to the first surface of the ceramic body in the width direction;first to third external electrodes disposed on the first surface of the ceramic body in the width direction to be connected to the first to third lead portions, respectively; andan insulation layer disposed on the first surface of the ceramic body in the width direction,wherein each of the first and second lead portions is spaced apart from the third lead portion by a predetermined distance.2. The multilayer ceramic capacitor of claim 1 , wherein when the predetermined distance by which each of the first and second lead ...

Ferroelectric Nanoshell Devices

Disclosed herein are nanoscale devices comprising one or more ferroelectric nanoshells characterized as having an extreme curvature in at least one spatial dimension. Also disclosed are ferroelectric field effect transistors and metal ferroelectric metal capacitors comprising one or more ferroelectric nanoshells. Methods for controlling spontaneous ferroelectric polarization in nanoshell devices are also disclosed.

ELECTRONIC COMPONENT AND COMPONENT-EMBEDDED SUBSTRATE

An electronic component includes: a component body into which elements are built; and a metal plate electrode that is joined to the component body by conductive paste so as to be electrically coupled to the elements, wherein the metal plate electrode exceeds in size a surface of the component body onto which the conductive paste is deposited. 1. An electronic component comprising:a component body into which elements are built; anda metal plate electrode that is joined to the component body by conductive paste so as to be electrically coupled to the elements,wherein the metal plate electrode exceeds in size a surface of the component body onto which the conductive paste is deposited.2. The electronic component according to claim 1 ,wherein the metal plate electrode is joined onto at least a surface on one side of the component body.3. The electronic component according to claim 1 ,wherein a recessed part is formed in a part of the metal plate electrode that faces the component body.4. The electronic component according to claim 1 ,wherein the metal plate electrode is bent so as to have a shape of a letter L.5. The electronic component according to claim 1 ,wherein a part of the metal plate electrode that protrudes from the surface onto which the conductive paste is deposited is bent so as to extend along another surface of the component body.6. The electronic component according to claim 1 ,wherein two surfaces of the component body are each furnished with the metal plate electrode and only one of the metal plate electrodes exceeds in size the surface onto which the conductive paste is deposited.7. A component-embedded substrate comprising:a core substrate;an electronic component that is placed in a hole formed in the core substrate; andinsulating layers, interconnections, and vias that are formed on a top side and a bottom side of the core substrate,wherein the electronic component includesa component body into which elements are built, anda metal plate electrode ...

MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME

There is provided a multilayer ceramic electronic component includes a ceramic body including a dielectric layer; and an internal electrode formed in the ceramic body, wherein on a cross-section of the ceramic body in a width-thickness direction, a thickness Te of the internal electrode satisfies 0.1 μm≦Te≦1.0 μm, and when the internal electrode is divided into three regions including a central region and both edge regions in a width direction of the ceramic body and a ratio of an actual total length of the internal electrode corresponding to the sum of lengths of electrode portions to an ideal total length of the internal electrode is defined as connectivity S of the internal electrode, connectivity of the internal electrode in the edge regions satisfies 75%≦S≦98%, and a ratio of connectivity of the internal electrode in the edge regions to connectivity of the internal electrode in the central region is 0.9 to 0.98. 1. A multilayer ceramic electronic component comprising:a ceramic body including a dielectric layer; andan internal electrode formed in the ceramic body,wherein, on a cross section of the ceramic body in a width-thickness direction, a thickness Te of the internal electrode is within a range of 0.1 μm to 1.0 μm (0.1 μm≦Te≦1.0 μm), andwhen the internal electrode is divided into three regions including a central region and both edge regions in a width direction of the ceramic body and a ratio of an actual total length of the internal electrode corresponding to the sum of lengths of electrode portions to an ideal total length of the internal electrode is defined as connectivity S of the internal electrode, connectivity S of the internal electrode in the edge regions thereof is within a range of 75% to 98% (75%≦S≦98%), and a ratio of the connectivity of the internal electrode in the edge regions thereof to connectivity of the internal electrode in the central region thereof is within a range of 0.9 to 0.98.2. The multilayer ceramic electronic component of ...

CAPACITOR STRUCTURE

A capacitor structure includes a first electrode structure and a second electrode structure. The first electrode structure includes a first negative plate and a first positive plate spaced apart from each other. The first electrode structure has a first horizontal capacitance between the first negative plate and the first positive plate. The second electrode structure includes a second positive plate and a second negative plate spaced apart from each other on the first electrode structure. The second electrode structure has a second horizontal capacitance between the second negative plate and the second positive plate. First and second vertical capacitances are formed between the first negative plate and the second positive plate and between the first positive plate and the second negative plate. 1. A capacitor structure , comprising:a first electrode structure including a first negative plate and a first positive plate spaced apart from each other, the first negative plate and the first positive plate being arranged alternately and repeatedly in a first direction substantially parallel to a top surface of a substrate, and the first electrode structure having a first horizontal capacitance between the first negative plate and the first positive plate; anda second electrode structure on the first electrode structure, the second electrode structure including a second positive plate and a second negative plate spaced apart from each other, the second negative plate and the second positive plate being arranged alternately and repeatedly in the first direction, and the second electrode structure having a second horizontal capacitance between the second negative plate and the second positive plate,wherein at least a portion of the second negative plate overlaps at least a portion of the first positive plate in a third direction substantially perpendicular to the top surface of the substrate and at least a portion of the second positive plate overlaps at least a portion of ...

CAPACITIVE ELEMENT

A capacitive element is provided that includes a substrate, a lower electrode on the substrate, first upper electrodes disposed to face the lower electrode, second upper electrodes disposed to face the lower electrode, a dielectric layer disposed between the lower electrode and the first upper electrodes and between the lower electrode and the second upper electrodes, a first wiring conductor that connects the first upper electrodes, and a second wiring conductor that connects the second upper electrodes. The first and second upper electrodes are adjacent to each other in a surface direction along the lower electrode and in an X-axis direction, and the first and second upper electrodes are adjacent to each other in the surface direction along the lower electrode and in a Y-axis direction. 1. A capacitive element comprising:a substrate;a lower electrode disposed on the substrate;a plurality of first upper electrodes disposed to face the lower electrode;a plurality of second upper electrodes disposed to face the lower electrode;a dielectric layer disposed between the lower electrode and the plurality of first and second upper electrodes;a first wiring conductor that electrically connects the plurality of first upper electrodes; anda second wiring conductor that electrically connects the plurality of second upper electrodes,wherein a portion of the plurality of first and second upper electrodes are disposed adjacent to each other in a surface direction along the lower electrode and in a first axis direction, andwherein a portion of the plurality of first and second upper electrodes are disposed adjacent to each other in the surface direction along the lower electrode and in a second axis direction.2. The capacitive element according to claim 1 , further comprising a first interval between the first and second upper electrodes that are adjacent to each other in the first axis direction that is substantially a same length as a second interval between the first and second ...

MULTILAYER CERAMIC CAPACITOR

A multilayer ceramic capacitor includes a laminated body and first and second external electrodes respectively on both end surfaces of the laminated body. When regions where first internal electrodes or second internal electrodes are not present are regarded as side margin portions in a cross section of the laminated body as viewed from the laminating direction, the side margin portions include multiple side margin layers, and the content of Si in the side margin layer closest to the internal electrode is lower than that in the side margin layer other than the side margin layer closest to the internal electrode. 1. A multilayer ceramic capacitor comprising:a laminated body including a plurality of dielectric layers and a plurality of internal electrodes laminated in a lamination direction; anda plurality of external electrodes electrically connected to respective ones of the internal electrodes; whereinthe laminated body includes a first principal surface and a second principal surface opposed in the lamination direction, a first side surface and a second side surface opposed in a width direction perpendicular or substantially perpendicular to the lamination direction, and a first end surface and a second end surface opposed in a length direction perpendicular or substantially perpendicular to both the lamination direction and the width direction;the laminated body includes rounded ridges;Si is included along the ridges;the plurality of internal electrodes include first internal electrodes exposed at the first end surface, and second internal electrodes exposed at the second end surface;the laminated body includes outer layer portions provided at a top and a bottom of the laminated body in the lamination direction, and an inner layer portion between the outer layer portions;the plurality of external electrodes include a first external electrode covering the first end surface and electrically connected to the first internal electrodes, and a second external electrode ...

MULTILAYER ELECTRONIC COMPONENT AND BOARD HAVING THE SAME MOUNTED THEREON

A multilayer electronic component includes a multilayer capacitor including a capacitor body and a plurality of external electrodes spaced apart from each other on a mounting surface of the capacitor body, and a connection terminal including a plurality of land portions disposed on the plurality of external electrodes, respectively. When a thickness of the multilayer capacitor is defined as T and a distance from an uppermost end of the plurality of external electrodes to a bottom of the connection terminal is defined as T, T/T is 0.6 to 0.9. 1. A multilayer electronic component comprising:a multilayer capacitor including a capacitor body and a plurality of external electrodes spaced apart from each other on a mounting surface of the capacitor body; anda connection terminal including a plurality of land portions disposed on the plurality of external electrodes, respectively,{'b': 1', '2', '1', '2, 'wherein T/T is 0.6 to 0.9, in which T is a thickness of the multilayer capacitor and T is a distance from an uppermost end of the plurality of external electrodes to a bottom of the connection terminal.'}2. The multilayer electronic component of claim 1 , wherein the capacitor body has a first surface which is a mounting surface claim 1 , and a second surface opposing the first surface claim 1 , and third and fourth surfaces connected to the first and second surfaces and opposing each other claim 1 , and fifth and sixth surfaces connected to the first and second surfaces and connected to the third and fourth surfaces claim 1 , the fifth and sixth surfaces opposing each other claim 1 , and the capacitor body comprises a first internal electrode and a second internal electrode claim 1 , one ends of the first and second internal electrodes being alternately exposed through the third and fourth surfaces;the plurality of external electrodes comprise a first external electrode and a second external electrode, the first and second external electrodes including first and second ...

High energy density capacitor with high aspect micrometer structures and a giant colossal dielectric material

A high density energy storage system including a giant-colossal dielectric thin film material electrically insulating between two electrodes configured to have increased overlapping surface area.

THIN FILM CAPACITOR AND SEMICONDUCTOR DEVICE

The present invention provides a thin film capacitor including a first electrode layer, a second electrode layer, and a dielectric layer provided between the first electrode layer and the second electrode layer, wherein a ratio (S/S) of a surface area S of a surface of the first electrode layer on an opposite side to the dielectric layer to a projected area Sin a thickness direction of the first electrode layer is 1.01 to 5.00. 1. A thin film capacitor comprising:a first electrode layer;a second electrode layer; anda dielectric layer provided between the first electrode layer and the second electrode layer,{'sub': 0', '0, 'wherein a ratio (S/S) of a surface area S of a surface of the first electrode layer on an opposite side to the dielectric layer to a projected area Sin a thickness direction of the first electrode layer is 1.01 to 5.00.'}2. The thin film capacitor according to claim 1 ,wherein heat conductivity λ of the first electrode layer is 90 W/(m·K) or higher.3. The thin film capacitor according to claim 1 ,wherein ten-point average roughness Rz of the surface of the first electrode layer on the opposite side to the dielectric layer is 0.02 to 2.00 μm.4. A semiconductor device comprising:a support substrate;a semiconductor element mounted on one main surface of the support substrate; and{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'the thin film capacitor according to ,'}wherein the thin film capacitor is embedded inside the support substrate in such a way that the second electrode layer and the semiconductor element face each other. The present invention relates to a thin film capacitor and a semiconductor device.Conventionally, as described in Japanese Unexamined Patent Publication Application No. 2007-258430, a semiconductor device including a semiconductor element and a capacitor which functions as a bypass capacitor (decoupling capacitor) is known.In recent years, as a semiconductor element is highly functionalized and accelerated, the amount of ...

MULTI-LAYER CERAMIC ELECTRONIC DEVICE

A multi-layer ceramic electronic device includes an element body and terminal electrodes. The terminal electrodes include end electrode parts covering ends of the element body in which internal electrode layers are led and upper electrode parts continuing to the end electrode parts and each partially covering an upper surface of the element body in a lamination direction. The terminal electrodes are not substantially formed on a lower surface of the element body located opposite to the upper surface of the element body in the lamination direction. 1. A multi-layer ceramic electronic device comprising:an element body in which internal electrode layers and insulation layers substantially parallel to a plane including a first axis and a second axis are laminated alternately in a third axis; andterminal electrodes formed on an external surface of the element body and electrically connected with the internal electrode layers, a pair of end electrode parts facing each other in the second axis and covering ends of the element body in the second axis in which the internal electrode layers are led; and', 'a pair of upper electrode parts continuing to the end electrode parts and each partially covering an upper surface of the element body substantially perpendicular to the third axis,, 'wherein the terminal electrodes includewherein conductive metal films are formed in interfaces between the element body and the terminal electrodes, andwherein the terminal electrodes are not substantially formed on a lower surface of the element body located opposite to the upper surface of the element body in the third axis.2. A multi-layer ceramic electronic device comprising:an element body in which internal electrode layers and insulation layers substantially parallel to a plane including a first axis and a second axis are laminated alternately in a third axis; andterminal electrodes formed on an external surface of the element body and electrically connected with the internal electrode ...

Thin film capacitor

Provided is a manufacturing method of a thin film capacitor comprising a capacitance portion in which at least one dielectric layer is sandwiched between a pair of electrode layers included in a plurality of electrode layers, the manufacturing method including a lamination process of alternately laminating the plurality of electrode layers and a dielectric film and forming a laminated body which will be the capacitance portion, a first etching process of forming an opening extending in a laminating direction with respect to the laminated body and exposing the dielectric film laminated directly on one of the plurality of electrode layers on a bottom surface of the opening, and a second etching process of exposing the one electrode layer at the bottom surface of the opening. In the second etching process, an etching rate of the one electrode layer is lower than an etching rate of the dielectric film.

CAPACITOR COMPONENT

A capacitor component includes a body, and first and second external electrodes formed on external surfaces of the body. The body includes a first connection electrode connected to the first external electrode, a second connection electrode disposed on the first connection electrode to partially cover the first connection electrode and connected to the second external electrode, and a porous capacitor portion disposed to cover the first and second connection electrodes and connected to each of the first and second connection electrodes. 1. A capacitor component comprising:a body; andfirst and second external electrodes formed on external surfaces of the body,wherein the body includes:a first connection electrode connected to the first external electrode,a second connection electrode disposed on the first connection electrode to partially cover the first connection electrode and connected to the second external electrode, anda porous capacitor portion disposed to cover the first and second connection electrodes and connected to each of the first and second connection electrodes.2. The capacitor component of claim 1 , wherein the porous capacitor portion includes a porous body claim 1 , a dielectric layer covering a surface of the porous body claim 1 , and an electrode layer covering the dielectric layer.3. The capacitor component of claim 2 , wherein the porous body is formed of a conductive material and is connected to the first connection electrode claim 2 , and the electrode layer is connected to the second connection electrode.4. The capacitor component of claim 3 , wherein the porous body is formed of the same material as that of the first connection electrode.5. The capacitor component of claim 2 , wherein the porous body is formed of an electrically insulating material claim 2 , andthe porous capacitor portion further includes an additional electrode layer formed between the porous body and the dielectric layer and connected to the first connection electrode.6 ...

METHODS AND SYSTEMS TO IMPROVE PRINTED ELECTRICAL COMPONENTS AND FOR INTEGRATION IN CIRCUITS

Methods and systems to improve printed electrical components and for integration in circuits are disclosed. Passive components, e.g., capacitors, resistors and inductors, can be printed directly into a solid ceramic block using additive manufacturing. A grounded conductive plane or a conductive cage may be placed between adjacent electrical components, or around each component, to minimize unwanted parasitic effects in the circuits, such as, e.g., parasitic capacitance or parasitic inductance. Resistors may be printed in non-traditional shapes, for example, S-shape, smooth S-shape, U-shape, V-shape, Z-shape, zigzag-shape, and any other acceptable alternative configurations. The flexibility in shapes and sizes of the printed resistors allows optimal space usage of the ceramic block. The present invention also discloses an electrical component comprising combined predetermined values of capacitance, resistance and inductance. The integration and adjustability of a multi-property device can provide significant advantages in electronics manufacturing. 1. An integrated circuit , comprising:a circuit die;a lid covering a top surface of the circuit die;a ceramic matrix packaging, andwherein the ceramic matrix packaging comprises at least one of an embedded resistor, capacitor, inductor, and multi-property device disposed within the ceramic matrix packaging.2. The integrated circuit of claim 1 , further comprising:wherein the at least one of an embedded resistor, capacitor, inductor, and multi-property device is oriented at an angle to minimize a parasitic effect.3. The integrated circuit of claim 1 , further comprising:wherein the at least one of an embedded resistor, capacitor, inductor, and multi-property device is oriented at an angle to optimize space usage of the ceramic matrix.4. The integrated circuit of claim 1 , further comprising:wherein the multi-property device comprises at least one helical coil encased in a cylindrical housing, andwherein the cylindrical ...

GATE-ALL-AROUND FIN DEVICE

A gate-all around fin double diffused metal oxide semiconductor (DMOS) devices and methods of manufacture are disclosed. The method includes forming a plurality of fin structures from a substrate. The method further includes forming a well of a first conductivity type and a second conductivity type within the substrate and corresponding fin structures of the plurality of fin structures. The method further includes forming a source contact on an exposed portion of a first fin structure. The method further comprises forming drain contacts on exposed portions of adjacent fin structures to the first fin structure. The method further includes forming a gate structure in a dielectric fill material about the first fin structure and extending over the well of the first conductivity type. 1. A method comprising:forming a first doped fin of a first conductivity type located over a first portion of a doped well;forming a second doped fin of a second conductivity type located over a second portion of the doped well;forming a gate structure located adjacent to the first doped fin over the doped well;forming a shallow trench isolation (STI) region in the doped well between the first portion and the second portion of the doped well; andforming a source contact located over the first doped fin,wherein the source contact includes alternating p regions and n regions.2. The method of claim 1 , wherein the gate structure is formed in a dielectric fill material.3. The method of claim 2 , wherein the STI region is formed in the doped well partially under the dielectric fill material and partially under the gate structure.4. The method of claim 1 , wherein:the doped well is formed as a continuous deep N-well; andthe gate structure is formed completely over the continuous deep N-well.5. The method of claim 4 , wherein the first doped fin is formed as a floating P-type fin.6. The method of claim 5 , further comprising forming a drain contact over the second doped fin.7. The method of claim ...

DIELECTRIC COMPOSITION, DIELECTRIC ELEMENT, ELECTRONIC COMPONENT AND LAMINATED ELECTRONIC COMPONENT

The problem addressed lies in providing a dielectric composition having a relatively high dielectric constant of 900 or greater when a DC bias of at least 8 V/ym is applied, and also in providing a dielectric element employing said dielectric composition, an electronic component, and a laminated electronic component. 2. The dielectric composition as claimed in claim 1 , wherein a claim 1 , b claim 1 , c and d satisfy the following: 0.27≦a≦0.48 claim 1 , 0.18≦b≦0.38 claim 1 , 0.20≦c≦0.60 claim 1 , 0.02≦d≦0.05 claim 1 , and 0.95≦a+b+c≦1.05.3. A dielectric element comprising the dielectric composition as claimed in .4. An electronic component provided with a dielectric layer comprising the dielectric composition as claimed in .5. A laminated electronic component having a laminated portion formed by alternately laminating an internal electrode layer and a dielectric layer comprising the dielectric composition as claimed in . The present invention relates to a dielectric composition and a dielectric element employing same, and to an electronic component and a laminated electronic component; more specifically, the present invention relates to a dielectric composition and a dielectric element which are advantageously used for medium- and high-voltage applications with a relatively high rated voltage.In recent years there has been a great demand for miniaturization of dielectric elements as electronic circuits reach higher densities, and miniaturization of electronic components such as laminated ceramic capacitors together with increased capacity are rapidly progressing, while the applications thereof are also expanding. Various characteristics are required as this takes place.For example, medium- and high-voltage capacitors which are used in devices such as ECMs (engine electronic computer modules), fuel injection devices, electronic control throttles, inverters, converters, HID headlamp units, hybrid engine battery control units and digital still cameras have a rated ...

Multi-layered ceramic electronic component and manufacturing method thereof

A multilayer ceramic electronic component includes a ceramic body including first and second internal electrodes disposed to face each other and a dielectric layer interposed therebetween. When an average thickness of the dielectric layer is denoted as ‘td,’ an average thickness of the first and second internal electrodes is denoted as ‘te,’ and a standard deviation of thicknesses of an internal electrode, measured at a plurality of points in a predetermined region of the internal electrode, is denoted as ‘σte,’ a ratio of the standard deviation of thicknesses of the internal electrode to the average thickness of the dielectric layer, which is denoted as ‘σte/td,’ satisfies 0.12≤σte/td≤0.21.

FILTERED FEEDTHROUGH ASSEMBLY HAVING A CAPACITOR GROUND METALLIZATION ELECTRICALLY CONNECTED TO THE GOLD BRAZE PORTION SEALING A FERRULE PENINSULA TO A MATCHING INSULATOR CUTOUT

A hermetically sealed filtered feedthrough assembly attachable to an AIMD includes an insulator hermetically sealing the opening of a ferrule with a gold braze. The ferrule includes a peninsula extending into the ferrule opening and the insulator has a cutout matching the peninsula. A sintered platinum-containing paste hermetically seals at least one via hole extending through the insulator. At least one capacitor is disposed on the device side. An active electrical connection electrically connects the capacitor active metallization to the sintered paste. A ground electrical connection electrically connects the capacitor ground metallization disposed within a capacitor ground passageway to the portion of the gold braze along the ferrule peninsula. The dielectric of the capacitor may be less than 1,000 k. 1. A hermetically sealed filtered feedthrough assembly attachable to an active implantable medical device (AIMD) , the filtered feedthrough assembly comprising: i) a metallic and electrically conductive ferrule configured to be installed in an opening of a housing of an AIMD, the ferrule separating a body fluid side opposite a device side and comprising a ferrule opening extending to the body fluid and device sides, wherein the ferrule comprises a peninsula extending into the ferrule opening;', 'ii) an insulator disposed at least partially within the ferrule opening, the insulator comprising a cutout matching the peninsula of the ferrule;', 'iii) at least one active via hole extending through the insulator to the body fluid and device sides;', 'iv) an electrically conductive material disposed within and hermetically sealing the at least one active via hole; and', 'v) a gold braze hermetically sealing the insulator to the ferrule;, 'a) a hermetic feedthrough, comprising i) a capacitor dielectric body having a dielectric constant, k, that is greater than zero but less than 1000;', 'ii) at least one active electrode plate and at least one ground electrode plate ...

DIELECTRIC COMPOSITION, DIELECTRIC ELEMENT, ELECTRONIC COMPONENT AND LAMINATED ELECTRONIC COMPONENT

The problem addressed lies in providing a dielectric composition having a relatively high dielectric constant of 800 or greater when a DC bias of at least 8 V/μm is applied, and also in providing a dielectric element employing said dielectric composition, an electronic component, and a laminated electronic component. [Solution] A dielectric composition in which the composition of the main component is in accordance with the following formula (1): (BiNaSr) (MgTi)O(1) [where a, b, c and d satisfy the following: 0.10≦a≦0.65, 0 Подробнее

Multi-Layer Ceramic Electronic Component and Method of Producing the Same

There is provided a multi-layer ceramic electronic component includes a ceramic body, an end external electrode unit, a side face external electrode unit. The ceramic body includes a pair of end faces, a pair of first side faces, and a pair of second side faces all of which are faced each other, respectively. The ceramic body includes a plurality of ceramic layers and an internal electrode unit. A plurality of the ceramic layers extend along a pair of the first side faces, and are laminated along a pair of the second side faces. The internal electrode unit includes first and second internal electrodes disposed alternately between a plurality of the ceramic layers, the first internal electrodes are drawn to both ends of a pair of the end faces, and the second internal electrodes are dawn to both ends of a pair of the second side faces. The end external electrode unit is connected to the first internal electrodes. The side face external electrode unit goes around from one of a pair of the first and second side faces to the other and are connected directly or indirectly each other at the other. There is also provided a method of producing the same. 1. A multi-layer ceramic electronic component , comprising: a pair of end faces, a pair of first side faces, and a pair of second side faces all of which are faced each other,', 'a plurality of ceramic layers extending along a pair of the first side faces and laminating along a pair of the second side faces, and', 'an internal electrode unit having first and second internal electrodes disposed alternately between a plurality of the ceramic layers, the first internal electrodes drawn to both ends of a pair of the end faces, and the second internal electrodes dawn to both ends of a pair of the second side faces;, 'a ceramic body including'}an end external electrode unit connected to the first internal electrodes; anda side face external electrode unit connected to the second internal electrodes and having first and second side ...

ELECTRONIC COMPONENT

An electronic component includes: a body containing a ceramic material; and an indication part formed on a surface of the body and including a base region and a marking region formed of a non-conductive paste on a portion of the base region. 1. An electronic component comprising:a body containing a ceramic material; andan indication part formed on a surface of the body and including a base region and a marking region formed of a non-conductive paste on a portion of the base region.2. The electronic component of claim 1 , wherein the ceramic material comprises at least one selected from the group consisting of a BaTiObased ceramic material claim 1 , a BaTiObased ceramic material claim 1 , a BaTiO—SrTiObased ceramic material claim 1 , a BaTiO—PbTiObased ceramic material claim 1 , a BaTiO—CaTiObased ceramic material claim 1 , a BaTiO—YTiObased ceramic material claim 1 , a BaTiO—BaSnObased ceramic material claim 1 , a BaTiO—BaZrObased ceramic material claim 1 , and a PbTiO—PbZrObased ceramic material.3. The electronic component of claim 1 , wherein the body includes a plurality of coil patterns and electrode patterns claim 1 , and has a structure in which the plurality of coil patterns and electrode patterns are stacked.4. The electronic component of claim 1 , wherein the body contains a plurality of stacked and sintered ceramic sheets on which the coil pattern is printed and a plurality of stacked and sintered ceramic sheets on which the electrode pattern is printed.5. The electronic component of claim 4 , wherein the body further contains glass.6. The electronic component of claim 1 , wherein the marking region has a color darker than that of the base region.7. The electronic component of claim 1 , wherein the marking region has a black color.8. The electronic component of claim 1 , wherein the non-conductive paste contains a powder comprising one or more selected from the group consisting of (Co claim 1 ,Fe claim 1 ,Mn) (Fe claim 1 ,Mn)O claim 1 , (Co claim 1 ,Fe ...

DVC UTILIZING MIMS IN THE ANCHOR

The present disclosure generally relates to a MEMS DVC utilizing one or more MIM capacitors located in the anchor of the DVC and an Ohmic contact located on the RF-electrode. The MIM capacitor in combination with the ohmic MEMS device ensures that a stable capacitance for the MEMS DVC is achieved with applied RF power. 1. A DVC , comprising:a substrate having at least one RF electrode and at least one anchor electrode disposed therein;an insulating layer disposed on the at least one anchor electrode;a conductive layer disposed on the insulating layer, wherein the at least one anchor electrode, insulating layer and conductive layer form a MIM capacitor; andat least one MEMS bridge disposed over the substrate and coupled to the conductive layer, the at least one MEMS bridge movable from a position spaced a first distance from the RF electrode and a position spaced a second distance from the RF electrode that is less than the first distance.2. The DVC of claim 1 , further comprising an ohmic contact layer disposed on the conductive layer.3. The DVC of claim 2 , wherein the at least one MEMS bridge is coupled to the ohmic contact layer.4. The DVC of claim 3 , wherein the insulating layer is at least partially disposed on the RF electrode.5. The DVC of claim 4 , wherein at least a portion of the conductive layer is disposed on the RF electrode.6. The DVC of claim 5 , wherein the ohmic contact layer comprises a material selected from the group consisting of W claim 5 , Pt claim 5 , Ir claim 5 , Rh claim 5 , Ru claim 5 , RuO claim 5 , ITO and Mo.7. The DVC of claim 1 , wherein the at least one anchor electrode comprises two anchor electrodes.8. The DVC of claim 7 , wherein each anchor electrode has at least a portion of the insulating layer disposed thereon.9. The DVC of claim 8 , wherein at least a portion of the conductive layer is disposed on each anchor electrode.10. The DVC of claim 1 , wherein the at least one MEMS bridge comprises a plurality of MEMS bridge and ...

DIELECTRIC CERAMIC COMPOSITION, MULTILAYER CERAMIC CAPACITOR CONTAINING THE SAME, AND MANUFACTURING METHOD OF MULTILAYER CERAMIC CAPACITOR

A dielectric ceramic composition contains: a barium titanate-based powder as a main ingredient; a first accessory ingredient containing Na; a second accessory ingredient containing Ba; and a third accessory ingredient containing Si. A content of the first accessory ingredient (based on moles of Na) is 0.3 to 4.0 moles per 100 moles of the main ingredient, and a Ba/Si ratio is in a range of 0.16 to 1.44. 1. A dielectric ceramic composition comprising:a barium titanate-based powder as a main ingredient;a first accessory ingredient containing sodium (Na);a second accessory ingredient containing barium (Ba); anda third accessory ingredient containing silicon (Si),wherein a content of the first accessory ingredient (based on moles of Na) is within a range of 0.3 to 4.0 moles per 100 moles of the main ingredient, anda Ba/Si ratio is within a range of 0.16 to 1.44.2. The dielectric ceramic composition of claim 1 , wherein the first accessory ingredient is NaO or NaCO.3. The dielectric ceramic composition of claim 1 , wherein the second accessory ingredient is one or more selected from the group consisting of oxides and carbonates of Ba claim 1 , and a content of the second accessory ingredient is within a range of 0.2 to 1.80 moles per 100 moles of the main ingredient.4. The dielectric ceramic composition of claim 1 , wherein the third accessory ingredient is one or more selected from the group consisting of oxides and carbonates of Si and glass containing Si claim 1 , and a content of the third accessory ingredient is within a range of 0.5 to 4.0 moles per 100 moles of the main ingredient.5. The dielectric ceramic composition of claim 1 , further comprising a fourth accessory ingredient being one or more selected from the group consisting of oxides or carbonates of rare earth elements including yttrium (Y) claim 1 , dysprosium (Dy) claim 1 , holmium (Ho) claim 1 , lanthanum (La) claim 1 , cerium (Ce) claim 1 , neodymium (Nd) claim 1 , samarium (Sm) claim 1 , gadolinium ( ...

CAPACITOR AND METHOD OF MANUFACTURE THEREOF

An alternating current power capacitor including one or more capacitor bodies (e.g., bobbins) having conductive and dielectric film windings, wherein edges of the conductive film windings define a plane forming at least one capacitor body contact surface, one or more electrodes having one or more electrode contact surfaces and a housing operative to apply compressive force that binds the capacitor body and electrode together so that to maintain uniform electrical and thermal conductive contact throughout a plane parallel to and between the electrode contact surface and capacitor body contact surface. 1. An AC Capacitor , comprising:at least one capacitor body having conductive and dielectric film windings and wherein an edge of the conductive film windings defines a plane normal to a concentric axis (W) of the windings forming at least one capacitor body contact surface;a pair of electrodes sandwiching the capacitor body with each electrode having at least one electrode contact surface; andwherein the pair of electrodes is urged against the capacitor body contact surface to apply compressive force, operative to bind the capacitor body contact surface and the electrode contact surface together so that to maintain uniform electrical and thermal conductive contact throughout a plane parallel to and between the electrode contact surface and capacitor body contact surface.2. The AC capacitor according to claim 1 , wherein the compressive force is the sole force that provides a functional contact between the capacitor body and the electrode contact surface negating need for an intermediate bonding material.3. The AC capacitor according to claim 1 , wherein the compressive force is a vector which is parallel to axis (W) and normal to capacitor body contact surface.4. The AC capacitor according to claim 1 , wherein the electrodes include at least one through hole.5. The AC capacitor according to claim 1 , wherein magnitude of the compressive force is limited only by value ...

Methods of Forming Capacitors

A method of forming capacitors includes providing first capacitor electrodes within support material. The first capacitor electrodes contain TiN and the support material contains polysilicon. The polysilicon-containing support material is dry isotropically etched selectively relative to the TiN-containing first capacitor electrodes using a sulfur and fluorine-containing etching chemistry. A capacitor dielectric is formed over sidewalls of the first capacitor electrodes and a second capacitor electrode is formed over the capacitor dielectric. Additional methods are disclosed.

MOUNTING STRUCTURE AND MULTILAYER CAPACITOR BUILT-IN SUBSTRATE

A mounting structure includes a circuit board including one principal surface on which a multilayer capacitor is mounted. The circuit board includes a first insulating layer, and a second insulating layer having a Young's modulus smaller than that of the first insulating layer. The second insulating layer is closer to the one principal surface than the first insulating layer. A multilayer capacitor built-in substrate includes a circuit board, a multilayer capacitor on one principal surface of the circuit board, and a resin layer on the one principal surface of the circuit board and embedding the multilayer capacitor. The circuit board includes a first insulating layer, and a second insulating layer having a Young's modulus smaller than that of the first insulating layer. The second insulating layer is closer to the one principal surface than the first insulating layer. 1. A mounting structure comprising:a circuit board including one principal surface on which a multilayer capacitor is mounted; whereinthe circuit board includes a first insulating layer, and a second insulating layer having a Young's modulus smaller than a Young's modulus of the first insulating layer; andthe second insulating layer is disposed closer to the one principal surface on which the multilayer capacitor is mounted than the first insulating layer.2. The mounting structure according to claim 1 , whereina land is provided on a surface of the second insulating layer; andthe multilayer capacitor is mounted on the land on the second insulating layer.3. The mounting structure according to claim 1 , whereinthe circuit board further includes a third insulating layer having a Young's modulus larger than the Young's modulus of the second insulating layer; andthe third insulating layer is disposed closer to the one principal surface on which the multilayer capacitor is mounted than the second insulating layer.4. The mounting structure according to claim 3 , whereina land is provided on a surface of the ...