22-06-2017 дата публикации
Номер: US20170179064A1
Принадлежит:
A bonding wire for a semiconductor device including a coating layer having Pd as a main component on the surface of a Cu alloy core material and a skin alloy layer containing Au and Pd on the surface of the coating layer has a Cu concentration of 1 to 10 at % at an outermost surface thereof and has the core material containing a metallic element of Group 10 of the Periodic Table of Elements in a total amount of 0.1 to 3.0% by mass, thereby achieving improvement in 2nd bondability and excellent ball bondability in a high-humidity heating condition. Furthermore, a maximum concentration of Au in the skin alloy layer is preferably 15 at % to 75 at %. 1. A bonding wire for a semiconductor device comprising:a core material having Cu as a main component and containing a metallic element of Group 10 of the Periodic Table of Elements in a total amount of 0.1% by mass or more and 3.0% by mass or less;a coating layer having Pd as a main component provided on a surface of the core material; anda skin alloy layer containing Au and Pd provided on a surface of the coating layer,wherein a concentration of Cu at an outermost surface of the wire is 1 at % or more and 10 at % or less, and the metallic element of Group 10 of the Periodic Table of Elements comprises Ni.2. The bonding wire for a semiconductor device according to claim 1 , wherein the metallic element of Group 10 of the Periodic Table of Elements further comprises either or both of Pd and Pt.3. (canceled)4. The bonding wire for a semiconductor device according to claim 1 , whereinthe coating layer having Pd as a main component has a thickness of 20 nm or more and 90 nm or less, andthe skin alloy layer containing Au and Pd has a thickness of 0.5 nm or more and to 40 nm or less and has a maximum concentration of Au of 15 at % or more and 75 at % or less.5. The bonding wire for a semiconductor device according to claim 1 , whereinthe core material further contains Au, andthe total amount of Ni, Pd, Pt and Au in the core ...
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