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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Поддерживает ввод нескольких поисковых фраз (по одной на строку). При поиске обеспечивает поддержку морфологии русского и английского языка
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Применить Всего найдено 2187. Отображено 100.
20-09-2012 дата публикации

Enhanced Low Inductance Interconnections Between Electronic and Opto-Electronic Integrated Circuits

Номер: US20120237160A1
Автор: Bipin Dama, David Piede, Kalpendu Shastri, Mark Webster
Принадлежит: LIGHTWIRE LLC

A configuration for routing electrical signals between a conventional electronic integrated circuit (IC) and an opto-electronic subassembly is formed as an array of signal paths carrying oppositely-signed signals on adjacent paths to lower the inductance associated with the connection between the IC and the opto-electronic subassembly. The array of signal paths can take the form of an array of wirebonds between the IC and the subassembly, an array of conductive traces formed on the opto-electronic subassembly, or both.

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Номер записи: 1
01-11-2012 дата публикации

High-frequency signal transmission line

Номер: US20120274423A1
Автор: Noboru Kato
Принадлежит: Murata Manufacturing Co Ltd

A flexible high-frequency signal transmission line includes a dielectric body including laminated flexible dielectric layers. A signal line is provided in the dielectric body. A grounding conductor is arranged in the dielectric body to be opposed to the signal line via one of the dielectric layers. The grounding conductor is of a ladder structure including a plurality of openings and a plurality of bridges arranged alternately along the signal line. A characteristic impedance of the signal line changes between two adjacent ones of the plurality of bridges such that the characteristic impedance of the signal line rises from a minimum value to an intermediate value and to a maximum value and falls from the maximum value to the intermediate value and to the minimum value in this order.

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Номер записи: 2
29-11-2012 дата публикации

Multilayer substrate

Номер: US20120300416A1
Автор: Gohki NISHIMURA, Naoyuki Tasaka, Tetsuo Saji
Принадлежит: TAIYO YUDEN CO LTD

A multilayer substrate is configured by stacking conductive layers and insulation layers. The multilayer substrate includes a core that is one of the conductive layers and is thicker than any of other conductive layers, and a first signal line that is included in the conductive layers and is adjacent to the core so that a first insulation layer that is one of the insulation layers is interposed between the core and the first signal line, the first signal line being used for transmission of an RF signal. The core has a recess portion so as to face the first signal line.

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Номер записи: 3
06-12-2012 дата публикации

Common communications device

Номер: US20120309316A1
Автор: Christopher John Stevens, David John Edwards, Ekaterina Shamonina, Laszlo Solymar
Принадлежит: Oxford University Innovation Ltd

A common communications device comprising an array of near-field coupled resonant elements, the elements each comprising a coupling portion comprising a loop portion with free ends, the device being provided in combination with a data transmission unit and a data reception unit, each unit having a coupling portion, the units being arranged to communicate with one another by means of the coupling portion of each unit and the common communications device, the coupling portion of the data transmission unit comprising a resonant element comprising a loop portion arranged to be near-field coupled to the loop portion of a first resonant element of the device, the coupling portion of the data reception unit comprising a resonant element comprising a loop portion arranged to be near-field coupled to the loop portion of a second resonant element of the device not being the first resonant element.

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Номер записи: 4
14-02-2013 дата публикации

Structure and circuit board

Номер: US20130037316A1
Автор: Hiroshi Toyao, Naoki Kobayashi, Noriaki Ando
Принадлежит: NEC Corp

A structure ( 10 ) includes a conductor ( 151 ), conductors ( 111, 131 ) that are located on the same side with respect to the conductor ( 151 ), that are opposed to at least a part of the conductor ( 151 ), and that overlap each other when seen in a plan view, a connection member ( 101 ) that penetrates the conductors ( 111, 131, 151 ), that is connected to the conductor ( 151 ), and that is insulated from the conductors ( 111, 131 ), openings ( 112, 132 ) that are formed in the conductors ( 111, 131 ), respectively, and which the connection member ( 101 ) passes through, and conductor elements ( 121, 141 ) that are formed to be opposed to the openings ( 112, 132 ), that are connected to the connection member ( 101 ) passing through the openings ( 112, 132 ), and that are larger than the openings ( 112, 132 ). The number of layers in which the conductor elements ( 121, 141 ) are located is two or more and less than or equal to the number of layers in which the conductors ( 111, 131 ) are located.

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Номер записи: 5
16-05-2013 дата публикации

COPLANAR WAVEGUIDE

Номер: US20130120087A1
Автор: GIANESSELLO Frédéric, Pruvost Sébastien
Принадлежит: STMICROELECTRONICS SA

An embodiment relates to a coplanar waveguide electronic device comprising a substrate whereon is mounted a signal ribbon and at least a ground plane. The signal ribbon comprises a plurality of signal lines of a same level of metallization electrically connected together, and the ground plane is made of an electrically conducting material and comprises a plurality of holes. 1. A coplanar microwave waveguide electronic device; comprising:a substrate whereon is mounted a central signal ribbon and at least one ground plane;said ground plane including a plurality of metallization layers;wherein said central signal ribbon is also achieved as a plurality of metallization layers, at least one metallization layer of the ground plane being able to cooperate with a same-level layer of the central signal ribbon for the propagation of a microwave signal; andwherein each metallization layer of the central signal ribbon is operable to propagate a microwave signal and includes a plurality of individual signal lines electrically connected together for the propagation of said microwave signal.2. The device according to claim 1 , wherein the total width covered by the plurality of individual signal lines is greater than the maximal width that could be given to a unique individual signal line without loss of flatness.3. The device according to claim 1 , wherein the ground plane comprises an electrically conducting material and comprises a plurality of holes.4. The device according to claim 3 , wherein the holes are spread over lines parallel to the central signal ribbon claim 3 , each parallel line with holes comprising identical holes.5. The device according to claim 1 , wherein the ground plane comprises a gradient of metallic density from the central signal ribbon towards a periphery of the ground plane.6. The device according to claim 5 , wherein the gradient of metallic density decreases from the central signal ribbon towards the periphery of the ground plane.7. The device ...

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Номер записи: 6
25-07-2013 дата публикации

QUASI-ELECTRIC SHORT WALL

Номер: US20130188328A1
Автор: Hashemi-Yeganeh Shahrokh, SCHUSTER Gary P., YAMAMOTO Gordon A.
Принадлежит: Raytheon Company

Provided is an assembly and process for isolating internal regions of an electromagnetic cavity from interfering electromagnetic radiation. The assembly includes a first portion defining a first electrically conducting broad wall and an elongated, electrically conducting isolating wall, coupled to and extending away from the first broad wall. The assembly also includes a second portion defining a second electrically conducting broad wall and an elongated, electrically conducting trough defined therein. The trough is sized to accept at least a portion of the isolating wall. The first and second portions are adapted for assembly in a facing arrangement in which the isolating wall is aligned with the trough. When assembled, a tip portion of the isolating wall extends to a uniform depth within the trough, such that the isolating wall-trough combination substantially rejects a transfer of electromagnetic energy across the isolating wall over at least a predetermined range of wavelengths. 1. An electromagnetic shield assembly comprising:a first electrically conducting wall extending along a longitudinal axis;a second electrically conducting wall extending between base and tip portions; the second wall attached along its base portion to the first wall forming a line of intersection perpendicular to the longitudinal axis, whereby the tip portion extends away from the first wall; anda third electrically conducting wall extending along a longitudinal axis and having an electrically conducting trough defining an elongated aperture in the third wall, the elongated aperture extending along a direction perpendicular to the longitudinal axis,wherein the trough is configured to accept therein at least the tip portion of the second wall when the first and third walls are arranged in facing opposition and separated by a predetermined separation distance, the tip portion of the second wall and the trough being adapted to maintain physical separation therebetween when so arranged, ...

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Номер записи: 7
22-08-2013 дата публикации

COMBINATION SEAT HEATER AND OCCUPANT SENSOR ANTENNA

Номер: US20130213950A1
Автор: BULGAJEWSKI Edward F., CUBAN Michael M., SLIWA Piotr
Принадлежит: Illinois Tool Works

A combination automobile seat heater and occupant sensor antenna is provided having a flexible substrate with the seat heater applied on one side of the substrate and the occupant sensor antenna applied on the other side of the substrate. Structure is provided to minimize interference in the performance of the antenna by operation of the seat heater, which can include advantageous positioning of the layers and/or the use of a layer defining air gaps between the seat heater and occupant sensor. 1. A combination seat heater and occupant sensor antenna , comprising:an electrically insulative substrate having opposed first and second sides;a seat heater assembly on said first side of said substrate;a capacitor system occupant sensor antenna on said second side of said substrate; andinterference reducing structure interposed between said seat heater assembly and said antenna, include a layer defining air gaps therein.2. The combination seat heater and occupant sensor antenna of claim 1 , said interference reducing structure including a ground plane layer adjacent said layer defining air gaps.3. The combination seat heater and occupant sensor antenna of claim 2 , said layer defining air gaps therein being disposed between said substrate and said ground plane layer.4. The combination seat heater and occupant sensor antenna of claim 3 , said layer defining air gaps therein including a plurality of cutouts.5. The combination seat heater and occupant sensor antenna of claim 3 , said layer defining air gaps therein being a foam material.6. The combination seat heater and occupant sensor antenna of claim 1 , said layer defining air gaps therein including a plurality of cutouts.7. The combination seat heater and occupant sensor antenna of claim 6 , said interference reducing structure including a ground plane layer adjacent said layer defining air gaps.8. The combination seat heater and occupant sensor antenna of claim 1 , said layer defining air gaps therein being a foam ...

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Номер записи: 8
29-08-2013 дата публикации

Transmission line RF applicator for plasma chamber

Номер: US20130221833A1
Автор: ANWAR Suhail, CHO Seon-Mee, KUDELA Jozef, Shinde Ranjit Indrajit, SORENSEN Carl A., Tanaka Tsutomu, Truong Douglas D., WHITE John M.
Принадлежит:

A transmission line RF applicator apparatus and method for coupling RF power to a plasma in a plasma chamber. The apparatus comprises an inner conductor and one or two outer conductors. The main portion of each of the one or two outer conductors includes a plurality of apertures that extend between an inner surface and an outer surface of the outer conductor. 1. A transmission line RF applicator for coupling electrical power to a plasma outside the RF applicator , comprising:an outer conductor having a main portion extending between first and second end portions; andan inner conductor having a main portion extending between first and second end portions, wherein the main portion of the inner conductor is positioned within, and spaced away from, the main portion of the outer conductor; (i) an inner surface facing the main portion of the inner conductor,', '(ii) an outer surface, and', '(iii) a plurality of apertures that extend between the inner surface of the outer conductor and the outer surface of the outer conductor., 'wherein the main portion of the outer conductor includes2. The applicator of claim 1 , further comprising:a dielectric cover;wherein the main portion of each of said inner and outer conductors is positioned within the dielectric cover; andwherein the dielectric cover provides a gas seal around the main portion of each of said conductors such that gas cannot flow between the exterior of the dielectric cover and the main portion of either of said conductors.3. The applicator of claim 1 , wherein:the outer conductor has a tubular shape; andthe inner conductor and the outer conductor are positioned coaxially.4. A plasma chamber comprising:a vacuum enclosure that encloses an interior of the plasma chamber;a dielectric cover having a main portion extending between first and second end portions, wherein the main portion of the dielectric cover is positioned within said interior of the plasma chamber;an outer conductor having a main portion extending ...

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Номер записи: 9
26-09-2013 дата публикации

Tunable High-Frequency Transmission Line

Номер: US20130249653A1
Автор: Ferrari Philippe, Rehder Gustavo Pamplona
Принадлежит: UNIVERSITE JOSEPH FOURIER

The invention relates to a high-frequency transmission line including a central conductive strip () associated with at least one conductive shielding plane (), wherein at least a portion of the space between the conductive plane and the conductive strip comprises a ferroelectric material (). 1. A high-frequency transmission line comprising a central conductive strip associated with at least one conductive shielding plane , wherein at least a portion of the space between the conductive shielding plane and the conductive strip comprises a ferroelectric material.2. The transmission line of claim 1 , wherein the transmission line is of the slow wave coplanar waveguide type claim 1 , comprising two lateral strips extending on either side of the central strip.3. The transmission line of claim 1 , wherein the ferroelectric material is BST.4. The transmission line of claim 3 , wherein the ferroelectric material has a thickness in the range from 0.4 to 1 μm.5. The transmission line of claim 2 , wherein the ferroelectric material extends under all or part of the central strip and of the lateral strips.6. The transmission line of claim 2 , associated with means for selectively biasing the central strip and/or the lateral strips.7. The transmission line of claim 2 , wherein the lateral strips have their central portions formed above recesses and are associated with lateral electrostatic displacement means. The present disclosure relates to a radio frequency (RF) transmission line. Radio frequency here means the field of millimetric or submillimetric waves, for example, in a frequency range from 10 to 500 GHz.The continuous development of integrated circuits on silicon opens up possibilities of operation at very high frequency in the radio frequency range. The passive elements used comprise adapters, dimmers, power dividers, and filters. Transmission lines connecting these elements, or forming them, are a basic element in a RF circuit. To exploit the silicon technology, ...

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Номер записи: 10
03-10-2013 дата публикации

REDIRECTION OF ELECTROMAGNETIC SIGNALS USING SUBSTRATE STRUCTURES

Номер: US20130257670A1
Автор: McCormack Gary D., Sovero Emilio
Принадлежит:

A system for transmitting or receiving signals may include a dielectric substrate having a major face, a communication circuit, and an electromagnetic-energy directing assembly. The circuit may include a transducer configured to convert between RF electrical and RF electromagnetic signals and supported in a position spaced from the major face of the substrate operatively coupled to the transducer. The directing assembly may be supported by the substrate in spaced relationship from the transducer and configured to direct EM energy in a region including the transducer and along a line extending away from the transducer and transverse to a plane of the major face. 1. A system for transmitting or receiving signals , the system comprising:a dielectric substrate having a major face;a communication circuit including a transducer configured to convert between radio-frequency electrical signals and radio-frequency electromagnetic signals, the transducer being supported in a position spaced from the major face of the dielectric substrate operatively coupled to the transducer, the communication circuit containing at least one of a transmitter circuit that transforms a baseband signal into a radio-frequency electrical signal and conducts the radio-frequency electrical signal to the transducer for transmission as an electromagnetic signal and a receiver circuit that receives from the transducer a radio-frequency electrical signal received as an electromagnetic signal by the transducer and transforms the radio-frequency electrical signal into a baseband signal; andan electromagnetic-energy directing assembly supported by the dielectric substrate in spaced relationship from the transducer and configured to direct electromagnetic energy in a region including the transducer and along a line extending away from the transducer and transverse to a plane of the major face of the dielectric substrate.2. The system of claim 1 , wherein the directing assembly further comprises a conductive ...

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Номер записи: 11
17-10-2013 дата публикации

COAXIAL WAVEGUIDE CONVERTER AND RIDGE WAVEGUIDE

Номер: US20130271235A1
Автор: KAI Takafumi
Принадлежит: NEC Corporation

Provided is a coaxial waveguide converter and a ridge waveguide that are insusceptible to manufacturing variances over a broad bandwidth. The coaxial waveguide converter includes a ridge waveguide () including a ridge () and a coaxial line (). A projection () projecting toward a side of a waveguide space () is provided in the ridge (), an amount of projection of the projection () decreases gradually from an end surface of the ridge waveguide () on a side of the coaxial line along a waveguide direction and an inner conductor () of the coaxial line () is inserted in the through-hole () at a position displaced from a center of the ridge waveguide () in a direction perpendicular to a direction in which the projection () projects in the end surface of the ridge waveguide () on the side of the coaxial line. 1. A ridge waveguide including a ridge comprising:a projection that projects from the ridge toward a side of a waveguide space, whereinan amount of projection of the projection decreases gradually from an end surface of the ridge waveguide on a side of a coaxial line along a waveguide direction of the ridge waveguide,a through-hole reaching the waveguide space of the ridge waveguide is provided in the projection,the through-hole is disposed at a position displaced from a center of the ridge waveguide in a direction perpendicular to a direction in which the projection projects in the end surface of the ridge waveguide on the side of the coaxial line, andan inner conductor of the coaxial line is inserted in the through-hole.2. The ridge waveguide according to claim 1 , wherein the projection is a triangular shape in a side view including the waveguide direction.3. The ridge waveguide according to claim 1 , wherein the projection is a rectangular shape on the end surface on the side of the coaxial line.4. The ridge waveguide according to claim 3 , wherein the through-hole is disposed at a center of the projection on the end surface on the side of the coaxial line.5. A ...

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Номер записи: 12
07-11-2013 дата публикации

ELECTROMAGNETIC WAVE TRANSMISSION SHEET

Номер: US20130293323A1
Автор: Nakase Koichiro
Принадлежит:

This electromagnetic wave transmission sheet is provided with: a first conductor plane; a second conductor plane arranged to be opposed the first conductor plane, and provided with a plurality of openings; a dielectric layer provided between the first conductor plane and the second conductor plane; a reflection element provided on outer edge of the dielectric layer; and a lossy material provided to cover the external side of the reflection element. 1. An electromagnetic wave transmission sheet comprising:a first conductor plane;a second conductor plane located opposite to the first conductor plane and comprising a plurality of openings;a dielectric layer disposed between the first conductor plane and the second conductor plane;a reflection element disposed on an outer edge of the dielectric layer; anda lossy material disposed so as to cover an outside of the reflection element.2. The electromagnetic wave transmission sheet according to claim 1 , whereinthe reflection element reflects an electromagnetic wave in a specific frequency band, andthe lossy material absorbs an electromagnetic wave outside the specific frequency band, through which electromagnetic waves propagate in the dielectric layer.3. The electromagnetic wave transmission sheet according to claim 2 , whereinthe electromagnetic wave in a specific frequency band comprises an electromagnetic wave for power transmission, andthe electromagnetic wave outside the specific frequency band comprises an electromagnetic wave for communication.4. The electromagnetic wave transmission sheet according to claim 1 , wherein the lossy material comprises one of a conductive lossy material claim 1 , a dielectric lossy material claim 1 , and a magnetic lossy material.5. The electromagnetic wave transmission sheet according to claim 1 , wherein the reflection element is comprises an electromagnetic band-gap (EBG) structure.6. The electromagnetic wave transmission sheet according to claim 5 , whereinthe EBG structure ...

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Номер записи: 13
26-12-2013 дата публикации

RF FEED LINE

Номер: US20130340940A1
Автор: BELINGER Andreas, HEISS Peter, RHYNER Stefan, WIELAND Werner
Принадлежит:

This disclosure relates to a flexible triplate stripline that can operate in temperatures of 150 C-250 C, flexible to move up/down with the top of a plasma reactor, and prevent plasma generation near the power transmission line in the stripline. The transmission line may be exposed to ambient conditions. The risk of generating plasma near the transmission line may be minimized by optimizing the height and width of the air gap adjacent to the transmission line and decreasing the voltage in a portion of the stripline by widening the transmission line. 1. A radio frequency (RF) power transmission line , comprising:a first end portion configured to be coupled to an output of a RF generator;a second end portion configured to be coupled to a plasma reactor housed within in a vacuum chamber; a first thickness; and', 'a first width that is greater than the first thickness;, 'a first outer conductive layer comprising a second thickness; and', 'a second width that is greater than the second thickness;, 'a second outer conductive layer comprising a third thickness; and', 'a third width that is less than the first width or the second width;, 'an inner conductive layer that is disposed between the first outer conductive layer and the second outer conducting layer, the inner conductive layer comprising a fourth thickness that separates the first outer conductive layer and the inner conductive layer; and', 'a fourth width that is greater than the fourth thickness;, 'a first dielectric layer disposed between the first outer conductive layer and the inner conductive layer, and comprising a fifth thickness that separates the second outer conductive layer and the inner conductive layer;', 'a fifth width that is greater than the fifth thickness;, 'a second dielectric layer disposed between the second outer layer and the inner conductive layer, and comprisinga first gap disposed between the first and second dielectric layer and adjacent to a first side of the inner conductive layer, and ...

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Номер записи: 14
16-01-2014 дата публикации

WAVEGUIDE CONNECTING STRUCTURE, ANTENNA DEVICE AND RADAR DEVICE

Номер: US20140015709A1
Автор: HASHIMOTO Koh, Obayashi Shuichi, Shijo Tetsu
Принадлежит:

There is provided a waveguide connecting structure, including first, second, third and fourth waveguides. A first coupling window at one of magnetic field planes of the third waveguide couples the first and third waveguides in such a manner that the electric field planes of both are in parallel. A second coupling window formed at one of the electric field planes of the third waveguide couples the second and third waveguides in such a manner that the electric field planes of the second waveguide is in parallel with the magnetic field planes of the first waveguide. A third coupling window formed at the other one of the electric field planes couples the fourth and third waveguides in such a manner that the electric field planes of the fourth waveguide is in parallel with the magnetic field planes of the first waveguide. 1. A waveguide connecting structure , comprising:a first waveguide including a pair of electric field planes and a pair of magnetic field planes;a second waveguide including a pair of electric field planes and a pair of magnetic field planes;a third waveguide including a pair of electric field planes and a pair of magnetic field planes; anda fourth waveguide including a pair of electric field planes and a pair of magnetic field planes,wherein the third waveguide hasa first coupling window formed at one of the magnetic field planes of the third waveguide,a second coupling window formed at one of the electric field planes of the third waveguide,a third coupling window formed at the other one of the electric field planes of the third waveguide, anda first shorted plane and a second shorted plane that close ends of the third waveguide,the first coupling window couples one end of the first waveguide to the third waveguide in such a manner that the electric field planes of the first waveguide are in parallel with the electric field planes of the third waveguide,the second coupling window couples one end of the second waveguide to the third waveguide in such a ...

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Номер записи: 15
13-02-2014 дата публикации

LOCALIZED WAVE GENERATION VIA MODEL DECOMPOSITION OF A PULSE BY A WAVE LAUNCHER

Номер: US20140043107A1
Автор: Kamel Aladin H., Niver Edip, Salem Mohamed A.
Принадлежит: NEW JERSEY INSTITUTE OF TECHNOLOGY

Implementations for exciting two or more modes via modal decomposition of a pulse by a wave launcher are generally disclosed. 1. A method for a waveguide to emit two or more modes of propagating waves for observation of a localized wave peak at a predetermined distance from an aperture end of the waveguide , the method comprising:selecting one or more amplitude and/or phase shift settings based at least in part on the predetermined distance from the aperture end of the waveguide; andexciting two or more modes via modal decomposition of a pulse in the waveguide, based at least in part on the selected one or more amplitude and/or phase shift settings.2. The method of claim 1 , further comprising determining the predetermined distance to peak prior to selecting the amplitude and/or the phase shift settings.3. The method of claim 1 , further comprising generating the pulse prior to exciting the two or more modes to synthesize a desired aperture field to produce the localized wave peak at the predetermined distance.4. The method of claim 1 , further comprising observing the peak at the predetermined distance based at least in part on a combination of the two or more modes radiated from the aperture end.5. The method of claim 1 , wherein exciting two or more modes comprises exciting two or more antennas in the waveguide claim 1 , wherein each of the two or more antennas is arranged to emit energy associated with at least one of the modes or superposition of modes of the propagating waves when excited by the modal decomposition of the pulse.6. The method of claim 1 , wherein exciting two or more modes comprises adjusting one or more amplitude and/or phase shift of at least one of the modes of the propagating waves with two or more dielectric tuning elements affixed to the waveguide.7. The method of claim 1 , wherein exciting two or more modes comprises exciting two or more modes of the propagating waves with a corrugated section in the waveguide.825-. (canceled)26. A ...

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Номер записи: 16
20-03-2014 дата публикации

Substrate integrated waveguide coupler

Номер: US20140077893A1
Автор: Chang Soo Kwak, Hong Yeol Lee, In Bok Yom, Jang Sup CHOI, Man Seok Uhm, So Hyeun YUN
Принадлежит: Electronics and Telecommunications Research Institute ETRI

Disclosed is a substrate integrated waveguide coupler. The substrate integrated waveguide coupler according to the present invention includes: a substrate; an upper conducting plate applied to an upper portion of the substrate; a lower conducting plate applied to a lower portion of the substrate; two peripheral via holes disposed parallel to each other on both sides of the substrate, respectively, and being of a pipeline type electrically connecting the upper conducting plate and the lower conducting plate to each other; and an inner via hole disposed between the two peripheral via holes, and having a center thereof separated by a preset distance and forming a short slot functioning to couple input signals.

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Номер записи: 17
27-03-2014 дата публикации

Flexible printed circuit board and circuit-board connection structure

Номер: US20140085856A1
Автор: Hiroshi Aruga, Mizuki Shirao, Nobuo Ohata, Nobuyuki Yasui
Принадлежит: Mitsubishi Electric Corp

A terminal portion configured to obtain electrical connection with a printed circuit board includes a first signal pad that is formed in a first conductor layer and is electrically separated from a ground layer, a pair of first ground pads that is formed in the first conductor layer to sandwich the first signal pad and is connected to the ground layer, a second signal pad that is formed in a second conductor layer and is connected to a signal line, a pair of second ground pads that is formed in the second conductor layer to sandwich the second signal pad and is electrically separated from the signal line, a third signal pad formed in a third conductor layer, and a pair of third ground pads formed in the third conductor layer to sandwich the third signal pad. The second signal pad is wider than the third signal pad.

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Номер записи: 18
10-04-2014 дата публикации

MICROWAVE TRANSMISSION ASSEMBLIES FABRICATED FROM CARBON NANOSTRUCTURE POLYMER COMPOSITES

Номер: US20140097917A1
Автор: Morber John, SHAH Tushar K.
Принадлежит: APPLIED NANOSTRUCTURED SOLUTIONS, LLC

Carbon nanostructures can be formed into polymer composites that are electrically conductive and highly reflective of microwave radiation, thereby facilitating transmission of the microwave radiation. Microwave transmission assemblies containing carbon nanostructures can include an elongate structure containing elongate opposing surfaces that extend the length of the elongate structure and that are spaced apart from one another with a channel region defined in between. The elongate opposing surfaces include a polymer composite containing a polymer matrix and a plurality of carbon nanostructures. Each carbon nanostructure can include a plurality of carbon nanotubes that are branched, crosslinked, and share common walls with one another. 1. A microwave transmission assembly comprising: 'wherein each carbon nanostructure comprises a plurality of carbon nanotubes that are branched, crosslinked, and share common walls with one another.', 'wherein the elongate opposing surfaces comprise a polymer composite comprising a polymer matrix and a plurality of carbon nanostructures;'}, 'an elongate structure comprising elongate opposing surfaces extending the length of the elongate structure and that are spaced apart from one another with a channel region defined therebetween;'}2. The microwave transmission assembly of claim 1 , wherein at least a portion of the carbon nanotubes in each carbon nanostructure are aligned substantially parallel to one another.3. The microwave transmission assembly of claim 1 , wherein the carbon nanostructures are free of a growth substrate adhered to the carbon nanostructures.4. The microwave transmission assembly of claim 3 , wherein the carbon nanostructures are in the form of a carbon nanostructure flake material.5. The microwave transmission assembly of claim 1 , wherein channel region is filled with a dielectric material.6. The microwave transmission assembly of claim 5 , wherein the elongate structure comprises a coaxial cable.7. The ...

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Номер записи: 19
03-01-2019 дата публикации

ON-CHIP COPLANAR WAVEGUIDE (CPW) TRANSMISSION LINE INTEGRATED WITH METAL-OXIDE-METAL (MOM) CAPACITORS

Номер: US20190006728A1
Автор: CHENG Haitao, JIN Zhang
Принадлежит:

A coplanar waveguide may include a first transmission line extending between a first ground plane and a second ground plane at a first interconnect level. The coplanar waveguide may further include a shielding layer at a second interconnect level. The shielding layer may include a first set of conductive fingers coupled to the first ground plane. The first set of conductive fingers may be interdigitated with a second set of conductive fingers that are coupled to the second ground plane. Only a dielectric layer may be between the first set of conductive interdigitated fingers and the second set of conductive interdigitated fingers. The first ground plane, the second ground plane, the dielectric layer, and the shielding layer may form a capacitor. 1. A coplanar waveguide comprising:a first transmission line extending between a first ground plane and a second ground plane at a first interconnect level; anda shielding layer at a second interconnect level, the shielding layer comprising a first set of conductive fingers coupled to the first ground plane and interdigitated with a second set of conductive fingers coupled to the second ground plane, and only a dielectric layer between the first set of conductive interdigitated fingers and the second set of conductive interdigitated fingers, the first ground plane, the second ground plane, the dielectric layer, and the shielding layer comprising a capacitor.2. The coplanar waveguide of claim 1 , in which the first interconnect level is different than the second interconnect level.3. The coplanar waveguide of claim 1 , further comprising a second transmission line between the first transmission line and one of the first ground plane and the second ground plane.4. The coplanar waveguide of claim 1 , in which the coplanar waveguide is on-chip or on a printed circuit board (PCB).5. The coplanar waveguide of claim 1 , in which the first set of conductive fingers are coupled to the first ground plane through a first set of vias ...

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Номер записи: 20
02-01-2020 дата публикации

Method and Apparatus for Integrated Shielded Circulator

Номер: US20200006833A1
Автор: Florian G. Herrault, Jonathan J. Lynch
Принадлежит: HRL LABORATORIES LLC

An RF circulator in combination with a RF integrated circuit, the RF integrated circuit having a plurality of RF waveguide or waveguide-like structures in or on the RF integrated circuit, the RF circulator comprising a disk of ferrite material disposed on a metallic material disposed on or in the RF integrated circuit, the disk of ferrite material extending away from the RF integrated circuit when disposed thereon, the metallic portion having a plurality of apertures therein adjacent the disk of ferrite material which, in use, are in electromagnetic communication with the disk of ferrite material and with the plurality of RF waveguide or waveguide-like structures, the disk of ferrite material being disposed in a metallic cavity.

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Номер записи: 21
14-01-2016 дата публикации

PRECISION WAVEGUIDE INTERFACE

Номер: US20160013534A1
Автор: Bardeen James Robert Amos, Pettus Michael Gregory
Принадлежит:

A waveguide interface comprising a support block configured to support a printed circuit board assembly. An interface is coupled to an end portion of the support block and extends from the support block. The interface includes a slot positioned to receive at least a portion of the printed circuit board assembly and one or more holes positioned to receive attachment devices to secure the interface to a waveguide component. The support block and interface are molded as a monolithic device. A method of forming the waveguide interface, a waveguide assembly including the waveguide interface, and a method of making the waveguide assembly including the waveguide interface are also disclosed. 1. A waveguide interface comprising:a support block configured to support a printed circuit board assembly; andan interface coupled to an end portion of the support block and extending from the support block, the interface having a slot positioned to receive at least a portion of the printed circuit board assembly and one or more holes positioned to receive attachment devices to secure the interface to a waveguide flange, wherein the support block and interface are molded as a monolithic device.2. The waveguide interface of claim 1 , wherein the support block and the interface are formed from a moldable metal alloy.3. The waveguide interface of claim 1 , wherein the support block and interface comprise a plurality of draft angles along one or more surfaces of the support block and the interface to allow for removal from a mold.4. A waveguide assembly comprising: 'a support block having a printed circuit board assembly affixed thereto and an interface coupled to an end portion of the support block and extending from the support block, the interface having a slot positioned to receive at least a portion of the printed circuit board assembly and one or more holes positioned to receive attachment devices to secure the interface to a waveguide flange, wherein the support block and interface ...

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Номер записи: 22
14-01-2016 дата публикации

3-D INTEGRATED PACKAGE

Номер: US20160013536A1
Автор: Deng Hongyu, LIU Yongsheng, Song Yunpeng
Принадлежит:

In an example embodiment, an electronics package includes one or more insulating layers and an electrically conductive transmission line. The electrically conductive transmission line includes a signal trace disposed substantially parallel to the one or more insulating layers. The electrically conductive transmission line further includes one or more signal vias electrically coupled to the signal trace. The one or more signal vias are configured to pass through at least a portion of the one or more insulating layers. The electronics package further includes one or more electrically conductive ground planes substantially parallel to the one or more insulating layers. The ground planes include one or more signal via ground cuts. The one or more signal via ground cuts provide clearance between the one or more signal vias and the one or more ground planes. 1 an insulating layer;', 'a signal via configured to pass through the insulating layer and that is electrically coupled with the signal via of an adjacent transition layer;', 'a ground plane having a signal cut configured to provide clearance between the ground plane and the signal via; and', 'a plurality of ground vias each configured to electrically couple the ground plane of the transition layer with the ground plane of an adjacent transition layer;, 'a plurality of transition layers, each transition layer including a coplanar waveguide portion electrically coupled to a microstrip portion;', 'the signal vias of the plurality of transition layers; and', 'a signal pin electrically coupled to the signal vias, wherein the signal pin is configured to be electrically coupled to a printed circuit board (PCB) via a PCB signal trace deposited on the PCB., 'an electrically conductive transmission line including. An electronics package comprising: This application is a continuation of U.S. patent application Ser. No. 13/417,103, filed Mar. 9, 2012, titled 3-D INTEGRATED PACKAGE, which is incorporated herein by reference in ...

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Номер записи: 23
15-01-2015 дата публикации

HIGH-FREQUENCY SIGNAL TRANSMISSION LINE AND ELECTRONIC DEVICE

Номер: US20150015345A1
Автор: IKEMOTO Nobuo, SASAKI Satoshi, Tago Shigeru
Принадлежит:

A dielectric element assembly includes a plurality of dielectric layers stacked on each other in a direction of lamination and extends in an x-axis direction. A signal line is provided in the dielectric element assembly and extends in the x-axis direction. A reference ground conductor is provided on a positive side in a z-axis direction relative to the signal line. An auxiliary ground conductor is provided on a negative side in the z-axis direction relative to the signal line. Via-hole conductors connect the reference ground conductor and the auxiliary ground conductor and are provided in the dielectric element assembly on the negative side relative to the center in a y-axis direction. A portion of the signal line in a section which includes the via-hole conductors is positioned on the positive side in the y-axis direction relative to another portion of the signal line in a section which does not include the via-hole conductors. 1. (canceled)2: A high-frequency signal transmission line comprising:a dielectric element assembly including a plurality of dielectric layers stacked on each other in a direction of lamination and extending in a predetermined direction;a signal line provided in the dielectric element assembly and extending in the predetermined direction;a first ground conductor provided on one side in the direction of lamination relative to the signal line;a second ground conductor provided on the other side in the direction of lamination relative to the signal line; anda first interlayer connecting conductor connecting together the first ground conductor and the second ground conductor, the first interlayer connecting conductor being provided in the dielectric element assembly on one side relative to a center in a width direction of the dielectric element assembly, the width direction being perpendicular or substantially perpendicular to the predetermined direction and to the direction of lamination; whereina portion of the signal line in a section which ...

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Номер записи: 24
10-01-2019 дата публикации

Coaxial Waveguide Microstructures Having an Active Device and Methods of Formation Thereof

Номер: US20190013561A1
Автор: Fisher John J., Sherrer David W.
Принадлежит:

Provided are coaxial waveguide microstructures. The microstructures include a substrate and a coaxial waveguide disposed above the substrate. The coaxial waveguide includes: a center conductor; an outer conductor including one or more walls, spaced apart from and disposed around the center conductor; one or more dielectric support members for supporting the center conductor in contact with the center conductor and enclosed within the outer conductor; and a core volume between the center conductor and the outer conductor, wherein the core volume is under vacuum or in a gas state. Also provided are methods of forming coaxial waveguide microstructures by a sequential build process and hermetic packages which include a coaxial waveguide microstructure. 120-. (canceled)21. A hermetic package including a coaxial waveguide microstructure , comprising:a multi-layer coaxial waveguide including a center conductor having one or more layers of a conductive material, an outer conductor comprising one or more walls spaced apart from and disposed around the center conductor, the one or more walls having a plurality of layers of the conductive material, and a non-conductive core volume disposed between the center conductor and the outer conductor; anda dielectric cap disposed over an endface of the multi-layer coaxial waveguide to hermetically seal the coaxial waveguide at the endface.22. The hermetic package according to claim 21 , wherein the dielectric cap comprises a membrane extending from the center conductor to the outer conductor23. The hermetic package according to claim 22 , wherein the dielectric membrane covers at least an outer periphery of the center conductor and at least an inner periphery of the outer conductor.24. The hermetic package according to claim 21 , comprising a device mounted on the dielectric cap.25. The hermetic package according to claim 21 , wherein the dielectric cap comprises a photopatternable polymer.26. The hermetic package according to claim 21 ...

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Номер записи: 25
14-01-2021 дата публикации

HALF-PATCH LAUNCHER TO PROVIDE A SIGNAL TO A WAVEGUIDE

Номер: US20210013574A1
Автор: Alvelo Enrique M., Baldauf John E., Barker James M., Ceely William J.
Принадлежит:

An apparatus includes a signal splitter configured to receive an input signal for transmission and to split the input signal to form two or more sub-signals. The apparatus further includes a first amplifier configured to generate a first amplified sub-signal, a second amplifier configured to generate a second amplified sub-signal, a first launcher coupled to the first amplifier and to a waveguide, and a second launcher coupled to the second amplifier and to the waveguide. The first and second launchers are coupled to the waveguide such that a first radiative signal generated by the first launcher responsive to the first amplified sub-signal and a second radiative signal generated by the second launcher responsive to the second amplified sub-signal are combined in the waveguide to form a transmission signal corresponding to the input signal. 1. An apparatus comprising:a signal splitter configured to receive an input signal for transmission and to split the input signal to form two or more sub-signals;a first amplifier coupled to the signal splitter and configured to amplify a first sub-signal of the two or more sub-signals to generate a first amplified sub-signal;a second amplifier coupled to the signal splitter and configured to amplify a second sub-signal of the two or more sub-signals to generate a second amplified sub-signal;a first launcher coupled to the first amplifier and to a waveguide; anda second launcher coupled to the second amplifier and to the waveguide, the first and second launchers coupled to the waveguide such that a first radiative signal generated by the first launcher responsive to the first amplified sub-signal and a second radiative signal generated by the second launcher responsive to the second amplified sub-signal are combined in the waveguide to form a transmission signal corresponding to the input signal.2. The apparatus of claim 1 , wherein the first launcher and the second launcher both adjoin a particular wall of the waveguide.3. The ...

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Номер записи: 26
21-01-2016 дата публикации

TRANSMISSION-LINE-COUPLED MICROFLUIDIC-CHIP TECHNOLOGY FOR ELECTROMAGNETIC SENSING OF BIOMOLECULES AND BIOPARTICLES

Номер: US20160018393A1
Автор: Brown Elliott R., Mendoza Edgar A., Viveros Leamon
Принадлежит: WRIGHT STATE UNIVERSITY

A coplanar waveguide transmission line for use in detecting biomolecules and bioparticles is provided that includes a signal conductor disposed on a top surface of the dielectric substrate, a ground conductor disposed on the top surface of the dielectric substrate on each side of the signal conductor, a continuous gap defined between the signal conductor and each of the ground conductors, micro-channels disposed below a top surface of the dielectric substrate, and reservoirs disposed below the top surface of the substrate.

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Номер записи: 27
17-01-2019 дата публикации

ON-CHIP, WIDEBAND, DIFFERENTIALLY FED ANTENNAS WITH INTEGRATED BIAS STRUCTURES

Номер: US20190017931A1
Автор: Caglayan Cosan, Sertel Kubilay, Trichopoulos Georgios C.
Принадлежит: Ohio State Innovation Foundation

Terahertz (THz) or millimeter wave (mmW) band characterization of a differential-mode device under test (DUT) is performed using a non-contact probing setup based on an integrated circuit that includes the on-chip DUT and an on-chip test fixture as follows. A differential transmission line pair is operatively coupled with the DUT. A first differential antenna pair at a first end of the transmission line pair has a first antenna connected only with the first transmission line and a second antenna connected only with the second transmission line. A second differential antenna pair is likewise connected with a second end of the differential transmission line pair. A THz or mmW transmitter radiates a probe THz or mmW beam to the first differential antenna pair, and an electronic analyzer receives a THz or mmW signal radiated by the second differential antenna pair responsive to the radiation of the probe THz or mmW beam to the first differential antenna pair, thus enabling no-contact S-parameter measurements for characterizing differential-mode, on-wafer, active or passive devices and integrated circuits. 1. An apparatus for performing terahertz (THz) or millimeter wave (mmW) characterization , the apparatus comprising: a differential transmission line pair comprising parallel first and second transmission lines operatively coupled with the DUT;', 'a first differential antenna pair connected with a first end of the differential transmission line pair and including a first antenna connected only with the first transmission line and a second antenna connected only with the second transmission line; and', 'a second differential antenna pair connected with a second end of the differential transmission line pair and including a third antenna connected only with the first transmission line and a fourth antenna connected only with the second transmission line;, 'an integrated circuit including an on-chip device under test (DUT) and an on-chip test fixture includinga THz or mmW ...

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Номер записи: 28
21-01-2016 дата публикации

Flexible printed circuit board and manufacturing method of flexible printed circuit board

Номер: US20160020500A1
Автор: Fumihiko Matsuda
Принадлежит: Nippon Mektron KK

A flexible printed circuit board having at least a set of strip line transmission path by being provided with a signal line, and a pair of ground layers and, includes a pleated part PL having a plurality of curved portions which are curved so as to be opened or closed, in which in the ground layers, mesh ground layers in which conductive portions are provided in a mesh shape, and solid ground layers in which the conductive portions are provided in a planar state, are provided, in which the mesh ground layers are arranged on an outer peripheral side of the curved portions PL 2 , and the solid ground layers are arranged on an inner peripheral side of the curved portions.

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Номер записи: 29
19-01-2017 дата публикации

Integrated PCB Interconnect System

Номер: US20170019997A1
Автор: BOUDREAUX Brent A.
Принадлежит: L-3 Communications Corporation

An electronic assembly and device are provided. The electronic assembly includes a first circuit board, with PCB pads located adjacent to an edge of the circuit board, and a corresponding plurality of contacts, each contact soldered to one of the PCB pads. Each contact has a first portion, soldered to the PCB pad, and a second portion that extends past the edge of the circuit board and forms a leaf spring. The leaf spring compresses when placed in contact with a PCB pad of a second circuit board, where the PCB pad is substantially coplanar with a surface of the second circuit board. A restoring force of the second portion maintains contact between the second portion and the PCB pad of the second circuit board. The contact forms an electrical connection between the PCB pad of the first circuit board and the PCB pad of the second circuit board. 1. An electronic assembly , comprising:a first circuit board, comprising a plurality of PCB pads located adjacent to one or more edges of the first circuit board; and each contact comprises a first portion configured to contact and be soldered to the associated PCB pad of the first circuit board and a second portion configured to extend past the adjacent edge of the circuit board and form a leaf spring configured to compress when placed in contact with a PCB pad of a second circuit board, the PCB pad of the second circuit board substantially coplanar with a surface of the second circuit board, and', 'a restoring force of the second portion configured to maintain contact between the second portion and the PCB pad of the second circuit board, the contact forming an electrical connection between the PCB pad of the first circuit board and the PCB pad of the second circuit board., 'a corresponding plurality of contacts, each contact soldered to an associated PCB pad of the first circuit board, wherein'}2. The electronic assembly of claim 1 , wherein the second portion extends away from the first circuit board in a direction normal ...

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Номер записи: 30
22-01-2015 дата публикации

HIGH-FREQUENCY SIGNAL LINE

Номер: US20150022286A1
Автор: ISHINO Satoshi, KATO Noboru, Sasaki Jun
Принадлежит:

A high-frequency signal line includes a base layer including first and second principal surfaces, a signal line provided on the first principal surface, a ground conductor provided on the first principal surface along the signal line, and a plurality of high-permittivity portions arranged along the signal line and in contact with a portion of both the signal line and the ground conductor, each of the high-permittivity portions having a higher specific permittivity than the base layer. 1. A high-frequency signal line , comprising:a base layer including first and second principal surfaces;a signal line provided on the first principal surface;a ground conductor provided on the first principal surface along the signal line; anda plurality of high-permittivity portions arranged along the signal line and in contact with a portion of both the signal line and the ground conductor, each of the high-permittivity portions having a higher specific permittivity than the base layer.2. The high-frequency signal line according to claim 1 , whereinthe ground conductor is positioned on both sides of the signal line; andthe high-permittivity portions contact the ground conductor on both sides of the signal line.3. The high-frequency signal line according to claim 1 , wherein the high-permittivity portions are arranged along the signal line at intervals of less than one half or about one half of the wavelength of a high-frequency signal to be transmitted through the signal line.4. The high-frequency signal line according to claim 1 , further comprising a second ground conductor arranged on the second principal surface so as to overlap with the signal line when viewed in a plan view in a direction perpendicular or substantially perpendicular to the base layer.5. The high-frequency signal line according to claim 1 , wherein the signal line is narrower in first areas where the signal line contacts the high-permittivity portions than in second areas other than the first areas.6. The high- ...

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Номер записи: 31
22-01-2015 дата публикации

HIGH-FREQUENCY SIGNAL LINE

Номер: US20150022288A1
Автор: ISHINO Satoshi, KATO Noboru, Sasaki Jun
Принадлежит:

A high-frequency signal line includes a body with a first layer level and a second layer level; a signal line including a first line portion provided at the first layer level, a second line portion provided at the second layer level, and a first interlayer connection connecting the first line portion and the second line portion; a first ground conductor including a first ground portion provided at the first layer level; a second ground conductor including a second ground portion provided at the second layer level; and a second interlayer connection connecting the first ground portion and the second ground portion. A distance between the first interlayer connection and the second interlayer connection is not less than a maximum distance between the first line portion and the first ground portion and is not less than a maximum distance between the second line portion and the second ground portion. 1. A high-frequency signal line comprising:a body including a first layer level and a second layer level;a signal line including a first line portion provided at the first layer level, a second line portion provided at the second layer level, and a first interlayer connection connecting the first line portion and the second line portion to each other;a first ground conductor including a first ground portion provided at the first layer level and extending along the first line portion;a second ground conductor including a second ground portion provided at the second layer level and extending along the second line portion; anda second interlayer connection connecting the first ground portion and the second ground portion to each other; whereina distance between the first interlayer connection and the second interlayer connection is not less than a maximum value of a distance between the first line portion and the first ground portion and is not less than a maximum value of a distance between the second line portion and the second ground portion.2. The high-frequency signal line ...

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Номер записи: 32
16-01-2020 дата публикации

3D-MICROSTRIP BRANCHLINE COUPLER

Номер: US20200020612A1
Автор: DEWITT Barbara S., Mina Essam, RAHMAN B M Farid, Wang Guoan
Принадлежит:

The disclosure is directed to semiconductor structures and, more particularly, to a three dimensional microstrip branchline coupler and methods of manufacture. The structure includes a plurality of through silicon vias and conductive lines electrically connected to a first end and a second end of respective ones of the plurality of through silicon vias. A first through silicon via of the plurality of through silicon vias forms a first port of a three dimensional (3D) branchline coupler. A second through silicon via of the plurality of through silicon vias forms a second port of the 3D branchline coupler. A third through silicon via of the plurality of through silicon vias forms a third port of the 3D branchline coupler. A fourth through silicon via of the plurality of through silicon vias forms a fourth port of the 3D branchline coupler. 1. A semiconductor structure , comprising:a thinned wafer;a coupler comprising: plural through silicon vias in the thinned wafer; and plural conductive lines connecting ones of the plural through silicon vias; anda ground shield structure surrounding the coupler.2. The semiconductor structure of claim 1 , wherein the ground shield structure comprises other through silicon vias and other conductive lines.3. The semiconductor structure of claim 1 , further comprising insulator layers on the plural conductive lines on upper and lower surfaces of the thinned wafer.4. The semiconductor structure of claim 1 , wherein the thinned wafer is a semiconductor wafer.5. The semiconductor structure of claim 1 , wherein the thinned wafer is a silicon wafer.6. The semiconductor structure of claim 1 , wherein the plural through silicon vias are respective ports of the coupler.7. The semiconductor structure of claim 6 , wherein a first port of the respective ports is an input signal port.8. The semiconductor structure of claim 7 , wherein the input signal port is split into two quadrature signals at a second port of the respective ports and a third ...

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Номер записи: 33
26-01-2017 дата публикации

HIGH-FREQUENCY SIGNAL TRANSMISSION LINE AND ELECTRONIC DEVICE

Номер: US20170025730A1
Автор: IKEMOTO Nobuo, SASAKI Satoshi, Tago Shigeru
Принадлежит:

A dielectric element assembly includes a plurality of dielectric layers stacked on each other in a direction of lamination and extends in an x-axis direction. A signal line is provided in the dielectric element assembly and extends in the x-axis direction. A reference ground conductor is provided on a positive side in a z-axis direction relative to the signal line. An auxiliary ground conductor is provided on a negative side in the z-axis direction relative to the signal line. Via-hole conductors connect the reference ground conductor and the auxiliary ground conductor and are provided in the dielectric element assembly on the negative side relative to the center in a y-axis direction. A portion of the signal line in a section which includes the via-hole conductors is positioned on the positive side in the y-axis direction relative to another portion of the signal line in a section which does not include the via-hole conductors. 1. (canceled)2. A high-frequency signal transmission line comprising:a dielectric element assembly including a plurality of dielectric layers stacked on each other in a direction of lamination and extending in a predetermined direction;a signal line provided in the dielectric element assembly and extending in the predetermined direction;a first ground conductor provided on one side in the direction of lamination relative to the signal line;a second ground conductor provided on the other side in the direction of lamination relative to the signal line; anda first interlayer connecting conductor connecting together the first ground conductor and the second ground conductor, the first interlayer connecting conductor being provided in the dielectric element assembly on one side relative to a center in a width direction of the dielectric element assembly, the width direction being perpendicular or substantially perpendicular to the predetermined direction and to the direction of lamination; whereinthe dielectric element assembly includes a first ...

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Номер записи: 34
28-01-2016 дата публикации

A FREQUENCY DEMULTIPLEXER

Номер: US20160028137A1
Автор: TAGEMAN Ola
Принадлежит: Telefonaktiebolaget lM Ericsson (publ)

A frequency demultiplexer comprising an input part () with an input port (), a low pass filter () and a band-pass filter () with output ports (). The input part (), the low-pass filter () and the band-pass filter () comprise open waveguide sections, and the band-pass filter () comprises gap-coupled resonators (). The input part () and the low-pass filter () connect to the same resonator (), the connection () of the low-pass filter () being at a first maximum distance (L) from a centre point (N) of the resonator and the connection () of the output port () being at a second maximum distance (L) from said centre point (N) of the resonator. The centre point (N) corresponds to a wave node of a wavelength λ, where λ=2 d/M, M is a positive integer value and d is the shortest end-to-end distance along the resonator. 1106101125120108145106125108108130135140106125116121130121125116106. A frequency demultiplexer comprising an input part () with an input port () , a low pass filter () with an output port () , and a band-pass filter () with an output port () , with the input part () , the low-pass filter () and the band-pass filter () comprising open waveguide sections , and the band-pass filter () comprising a plurality of gap-coupled resonators ( , , ) , with the input part () and the low-pass filter () both being connected at respective connection points ( , ) to one and the same of said gap-coupled resonators () , the connection point () of the low-pass filter () being located at a first maximum distance (L) from a centre point (N) of the resonator and the connection point () of the input part () being located at a second maximum distance (L) from said centre point (N) of the resonator , said centre point (N) corresponding to a wave node of a wavelength λ , where λ=2 d/M , M is a positive integer value and d is the shortest end-to-end distance along the resonator.2100125126127128. The frequency demultiplexer () of claim 1 , in which the low-pass filter () comprises stepped ...

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Номер записи: 35
25-01-2018 дата публикации

SYSTEMS AND METHODS FOR MANUFACTURING STACKED CIRCUITS AND TRANSMISSION LINES

Номер: US20180026324A1
Автор: Jin Yoonyoung, Kazemi Hooman, Miller David Anthony, Mohan Ankush
Принадлежит:

Devices and methods for manufacturing RF circuits and systems in both passive and active forms are contemplated herein. Exemplary devices include 3D electrical and mechanical structures which are created from individual slices which may be assembled to create a final functional block such as a circuit, component or a system. The slices may fabricated by a variety of manufacturing techniques, such as micromachined layer-by-layer metal batch processing. 1. A stacked waveguide structure , comprising a plurality of solid metal waveguide slices , each waveguide slice comprising at least one waveguide cavity disposed therein , where selected pairs of the waveguide slices are disposed adjacent one another , with the waveguide cavity of each slice of a selected pair registered to one another so the waveguide cavities of the selected pair of slices communicate with one another to provide at least one waveguide within the stacked waveguide structure.2. The stacked waveguide structure of claim 1 , wherein the waveguide cavity of a selected slice extends through the depth of the slice to provide openings on opposing surfaces of the slice.3. The stacked waveguide structure according to claim 1 , wherein the waveguide cavity of a selected slice extends partially into the depth of the slice.4. The stacked waveguide structure according to claim 1 , wherein a selected slice comprises two waveguide cavities oriented orthogonal to one another within the slice.5. The waveguide structure according to claim 1 , wherein the selected pair of waveguide slices each have a face disposed adjacent one another claim 1 , and wherein at least a portion of the at least one waveguide is disposed orthogonal to the faces.6. The stacked waveguide structure according to claim 1 , wherein the selected pair of waveguide slices each have a face disposed adjacent one another claim 1 , and wherein at least a portion of the at least one waveguide is disposed parallel to the faces.7. The stacked waveguide ...

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Номер записи: 36
29-01-2015 дата публикации

Flexible substrate and optical device

Номер: US20150028971A1
Автор: Masahiro Hirayama
Принадлежит: Sumitomo Electric Device Innovations Inc

A flexible substrate is disclosed. The flexible substrate includes an insulating substrate having a first surface and a second surface opposite to the first surface, a first connection portion having a first conductor, a first ground pattern, and a second ground pattern on the first surface, the first ground pattern and the second ground pattern being spaced apart from the first conductor and respectively located at either side of the first conductor, a conductor pattern formed on the second surface, the conductor pattern being connected to the first conductor, and a third ground pattern formed on the second surface, the third ground pattern being connected to the first ground pattern, wherein a distance between the conductor pattern and the third ground pattern is smaller than a distance between the first conductor and the first ground pattern.

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Номер записи: 37
10-02-2022 дата публикации

FEEDING STRUCTURE, MICROWAVE RADIO FREQUENCY DEVICE AND ANTENNA

Номер: US20220045413A1
Автор: CHE Chuncheng, JIA Haocheng, Li Liang, LI Qiangqiang, TANG Cuiwei, TING Tienlun, Wang Ying, Wu Jie
Принадлежит:

A feeding structure is provided. The feeding structure includes a feeding unit, which includes: a reference electrode, first and second substrates opposite to each other, and a dielectric layer between the first and second substrates. The first substrate includes a first base plate and a first electrode thereon. The first electrode includes a first main body and a plurality of first branches connected to the first main body and spaced apart from each other. The second substrate includes a second base plate and a second electrode thereon. The second electrode includes a second main body and a plurality of second branches, which are connected to the second main body, spaced apart from each other, and in one-to-one correspondence with the plurality of first branches. Orthographic projections of each second branch and a corresponding first branch on the first base plate partially overlap each other. 1. A feeding structure , comprising a feeding unit , the feeding unit comprising: a reference electrode , a first substrate and a second substrate opposite to each other , and a dielectric layer between the first substrate and the second substrate , whereinthe first substrate comprises a first base plate and a first electrode on the first base plate; the first electrode comprises a first main body and a plurality of first branches, the plurality of first branches are connected to the first main body and spaced apart from each other in a lengthwise direction of the first main body, and both ends of the first main body are an input terminal and a straight-through terminal, respectively;the second substrate comprises a second base plate and a second electrode on the second base plate; the second electrode comprises a second main body and a plurality of second branches, the plurality of second branches are connected to the second main body, spaced apart from each other in a lengthwise direction of the second main body, and in one-to-one correspondence with the plurality of first ...

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Номер записи: 38
30-01-2020 дата публикации

Cryogenic device with multiple transmission lines and microwave attenuators

Номер: US20200035901A1
Автор: James Robert Rozen, Martin O. Sandberg, Patryk GUMANN, Salvatore Bernardo Olivadese
Принадлежит: International Business Machines Corp

Techniques for implementing multiple microwave attenuators on a high thermal conductivity substrate for cryogenic applications to reduce heat and thermal noise during quantum computing are provided. In one embodiment, a device for using in cryogenic environment is provided that comprises a substrate having a thermal conductivity above a defined threshold, a plurality of transmission lines fabricated on the substrate and arranged with a separation gap between the plurality of transmission lines to maintain crosstalk below −50 decibels, and one or more microwave attenuators embedded on the plurality of transmission lines.

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Номер записи: 39
12-02-2015 дата публикации

LAMINATED FLAT CABLE AND METHOD FOR PRODUCING SAME

Номер: US20150042421A1
Автор: KATO Noboru
Принадлежит:

A laminated flat cable includes a laminate, a signal line for high-frequency signal transmission, a reference ground conductor, and an auxiliary ground conductor. The laminate includes a first base layer with first and second principal surfaces and a second base layer with third and fourth principal surfaces, and the second principal surface is opposed to the third principal surface. The signal line is located on the second principal surface. The reference ground conductor is located on the first principal surface and is opposite to the signal line. The auxiliary ground conductor is located on the third or fourth principal surface and is opposite to the signal line. The auxiliary ground conductor includes a plurality of openings arranged along the signal line. 1. A laminated flat cable , comprising:a laminate including a first base layer including first and second principal surfaces and a second base layer including third and fourth principal surfaces, the second principal surface being opposed to the third principal surface;a signal line located on the second principal surface;a reference ground conductor located on the first principal surface and being opposite to the signal line; andan auxiliary ground conductor located on the third or fourth principal surface and being opposite to the signal line; wherein,the auxiliary ground conductor includes a plurality of openings arranged along the signal line.2. The laminated flat cable according to claim 1 , further comprising:an external terminal arranged on the first principal surface so as to overlap with one end of the signal line when viewed in a direction of lamination; andan inter-layer connecting portion piercing through the first base layer in the direction of lamination and connecting the signal line and the external terminal.3. The laminated flat cable according to claim 1 , wherein the laminate further includes an adhesive layer bonding the first base layer and the second base layer.4. The laminated flat cable ...

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Номер записи: 40
09-02-2017 дата публикации

CONTACTLESS SIGNAL CONDUIT STRUCTURES

Номер: US20170040660A1
Автор: Gondi Srikanth, Kosowsky Lex, McCormack Gary D., Sweetman Eric, Zivanovic Bojana
Принадлежит:

Conduit structures for guiding extremely high frequency (EHF) signals are disclosed herein. The conduit structures can include EHF containment channels that define EHF signal pathways through which EHF signal energy is directed. The conduit structures can minimize or eliminate crosstalk among adjacent paths within a device and across devices. 1. A system comprising:a housing comprising an interface that defines a contactless communications port for communicating extremely high frequency (EHF) contactless signals;a substrate positioned within the housing a distance from the interface;a first contactless communication unit (CCU) mounted on the substrate; anda conduit structure positioned over the first CCU and coupled to the substrate and the interface, the conduit structure comprising a first channel that spans the distance and defines a contactless signal path between the first CCU and the interface.2. The system of claim 1 , wherein the conduit structure is dimensioned to provide shock support for the first CCU.3. The system of claim 1 , wherein the first channel comprises a conductive metal material.4. The system of claim 1 , further comprising a conductive foam insert member that is secured within the first channel claim 1 , the conductive foam insert member reduces a cross-sectional area of the first channel.5. The system of claim 4 , wherein the conductive foam insert member mates with the interface and surrounds the first CCU.6. The system of claim 1 , wherein the first CCU comprises a transducer operative to selectively perform one of transmission claim 1 , reception claim 1 , and transmission and reception of the contactless signals.7. The system of claim 1 , wherein the interface is integrated within the housing.8. A contactless signal conduit for use in a device comprising a plurality of CCUs mounted to a substrate and an interface that defines a contactless communications port for communicating extremely high frequency (EHF) contactless signals claim 1 , ...

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Номер записи: 41
19-02-2015 дата публикации

CONTACTLESS COMMUNICATION UNIT CONNECTOR ASSEMBLIES

Номер: US20150048907A1
Автор: Almgren Eric, FADELL Anthony Michael, Isaac Roger D., McCormack Gary D., van Tatenhove Mariel
Принадлежит:

Contactless extremely high frequency connector assemblies, passive cable connector assemblies, and active cable connector assemblies are disclosed herein. In one embodiment, a contactless connector assembly can include several (EHF) contactless communication units operable to selectively transmit and receive EHF signals, and several signal directing structures coupled to the EHF CCUs. The signal directing structures can direct the EHF signals along a plurality of EHF signal pathways. 1. A contactless connector assembly , comprising: a plurality of extremely high frequency (EHF) contactless communication units (CCUs) operable to selectively transmit and receive EHF signals; and', 'a plurality of signal directing structures coupled to the EHF CCUs, wherein the signal directing structures direct the EHF signals along a plurality of EHF signal pathways., 'a connector interface housing comprising2. The contactless connector assembly of claim 1 , further comprising:a plurality of waveguides that are releasably coupled to the signal directing structures within the connector interface housing.3. The contactless connector assembly of claim 2 , wherein the waveguides extend a fixed distance away from a periphery of the connector interface housing and wherein the waveguides extends at least one of the EFH signal pathways to that fixed distance.4. The contactless connector assembly of claim 2 , wherein each of the waveguides directly interfaces with one of the signal directing structures.5. The contactless connector assembly of claim 2 , wherein each of the signal directing structures comprises a signaling face that defines a focal axis of one of the EHF signal pathways claim 2 , and wherein each of the waveguides comprises a focal axis.6. The contactless connector assembly of claim 5 , wherein the focal axes of the signal directing structures and the waveguides are co-axially aligned.7. The contactless connector assembly of claim 1 , wherein the EHF CCUs are arranged in a ...

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Номер записи: 42
07-02-2019 дата публикации

GUIDED SURFACE WAVEGUIDE PROBE STRUCTURES

Номер: US20190044209A1
Автор: Corum James F., Corum Kenneth L.
Принадлежит:

Disclosed a guided surface waveguide probe including a charge terminal configured to generate an electromagnetic field and a support apparatus that supports the charge terminal above a lossy conducting medium, wherein the electromagnetic field generated by the charge terminal synthesizes a wave front incident at a complex Brewster angle of incidence (θ) of the lossy conducting medium. 1. A guided surface waveguide probe comprising:a charge terminal configured to generate an electromagnetic field; anda support apparatus that supports the charge terminal above a lossy conducting medium;{'sub': 'i,B', 'wherein the electromagnetic field generated by the charge terminal synthesizes a wave front incident at a complex Brewster angle of incidence (θ) of the lossy conducting medium.'}2. The probe of claim 1 , wherein the support apparatus comprises a vertical support.3. The probe of claim 2 , wherein the vertical support comprises a non-conductive vertical pole.4. The probe of claim 3 , wherein the vertical pole is made of a polymeric material.5. The probe of claim 2 , wherein the support apparatus further comprises non-conductive tensioned lines that reinforce the vertical pole.6. The probe of claim 5 , wherein the tensioned lines are made of a polymeric material.7. The probe of claim 1 , wherein the support apparatus comprises multiple non-conductive vertical supports.8. The probe of claim 7 , wherein the vertical supports comprise non-conductive vertical poles.9. The probe of claim 8 , wherein the vertical poles are made of a polymeric material.10. The probe of claim 8 , wherein the support apparatus further comprises non-conductive cross-members that extend between the poles.11. The probe of claim 10 , wherein the cross-members are made of a polymeric material.12. The probe of claim 8 , wherein the support apparatus further comprises non-conductive tensioned lines that extend between the vertical poles and the charge terminal.13. The probe of claim 5 , wherein the ...

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Номер записи: 43
07-02-2019 дата публикации

CERAMIC SMT CHIP ANTENNAS FOR UWB OPERATION, METHODS OF OPERATION AND KITS THEREFOR

Номер: US20190044231A1
Автор: ZARIC Andela
Принадлежит: TAOGLAS GROUP HOLDINGS LIMITED

Disclosed are devices, systems and methods regarding ceramic-substrate ultra-wideband (UWB) antennas that utilize surface-mount technology (SMT) for installation, integration and connection to external devices, electronics and systems. Numerous configurations are disclosed for elements comprising each antenna. This ensures that the disclosed antennas may be configured in design to address varying performance requirements as well as to optimize performance across portions of the UWB spectrum. 1. An ultra-wideband antenna comprising:a dielectric substrate having a substrate length, a substrate width and a substrate thickness, a first surface, a second surface, a third surface, a fourth surface, a fifth surface, and a sixth surface;a radiator positioned on at least a portion of the first surface of the dielectric substrate;a feed positioned on the second surface of the dielectric substrate; anda feed positioned on a third surface of the dielectric substrate.2. The ultra-wideband antenna of wherein the ultra-wideband antenna operates within a range of frequencies from 3.1 GHz to 10 GHz.3. The ultra-wideband antenna of wherein the first surface of the dielectric substrate has a two-dimensional shape selected from square claim 1 , rectangular claim 1 , parallelogram claim 1 , oval claim 1 , and round.4. The ultra-wideband antenna of wherein the first surface of the dielectric substrate is at least one of planar and substantially planar.5. The ultra-wideband antenna of wherein the feed is centered on the third surface of the dielectric substrate and occupies an entire substrate thickness and less than one-third of the substrate width or substrate length.6. The ultra-wideband antenna of wherein the feed has a shape selected from circular claim 1 , semi-circular claim 1 , triangular claim 1 , trapezoidal claim 1 , square and rectangular.7. The ultra-wideband antenna of wherein the radiator has a shape selected from square claim 1 , rectangular claim 1 , semi-circular claim 1 ...

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Номер записи: 44
19-02-2015 дата публикации

COPLANAR WAVEGUIDE

Номер: US20150050001A1
Автор: Gianesello Frédéric, Pruvost Sébastien
Принадлежит: STMICROELECTRONICS SA

A coplanar waveguide electronic device is formed on a substrate. The waveguide includes a signal ribbon and a ground plane. The signal ribbon is formed of two or more signal lines of a same level of metallization that are electrically connected together. The ground plane is formed of an electrically conducting material which includes rows of holes. 1. A coplanar microwave waveguide electronic device; comprising:a substrate whereon is mounted a central signal ribbon and at least one ground plane;said ground plane including a plurality of metallization layers;wherein said central signal ribbon is also achieved as a plurality of metallization layers, at least one metallization layer of the ground plane being able to cooperate with a same-level layer of the central signal ribbon for the propagation of a microwave signal; andwherein each metallization layer of the central signal ribbon is operable to propagate a microwave signal and includes a plurality of individual signal lines electrically connected together for the propagation of said microwave signal.2. The device according to claim 1 , wherein the total width covered by the plurality of individual signal lines is greater than the maximal width that could be given to a unique individual signal line without loss of flatness.3. The device according to claim 1 , wherein the ground plane comprises an electrically conducting material and comprises a plurality of holes.4. The device according to claim 3 , wherein the holes are spread over lines parallel to the central signal ribbon claim 3 , each parallel line with holes comprising identical holes.5. The device according to claim 1 , wherein the ground plane comprises a gradient of metallic density from the central signal ribbon towards a periphery of the ground plane.6. The device according to claim 5 , wherein the gradient of metallic density decreases from the central signal ribbon towards the periphery of the ground plane.7. The device according to claim 1 , wherein ...

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Номер записи: 45
08-05-2014 дата публикации

HIGH-FREQUENCY SIGNAL TRANSMISSION LINE AND ELECTRONIC APPARATUS

Номер: US20140125434A1
Автор: KATO Noboru, Kurita Junichi, Sasaki Jun, SASAKI Satoshi, Tago Shigeru
Принадлежит: MURATA MANUFACTURING CO., LTD.

An easily bendable high-frequency signal transmission line includes a dielectric body including a protection layer and dielectric sheets laminated on each other, a surface and an undersurface. A signal line is a linear conductor disposed in the dielectric body. A ground conductor is disposed in the dielectric body, faces the signal line via the dielectric sheet, and continuously extends along the signal line. A ground conductor is disposed in the dielectric body, faces the ground conductor via the signal line sandwiched therebetween, and includes a plurality of openings arranged along the signal line. The surface of the dielectric body on the side of the ground conductor with respect to the signal line is in contact with a battery pack. 1. (canceled)2. A high-frequency signal transmission line comprising:an element assembly including one or more insulating layers, and a first main surface and a second main surface;a linear signal line disposed in the element assembly;a first ground conductor that faces the signal line and continuously extends along the signal line, the first ground conductor being located on or at a side of the first main surface with respect to the signal line; anda second ground conductor that faces the first ground conductor via at least one of the one or more insulating layers and includes a plurality of openings arranged along the signal line, the second ground conductor being located on or at a side of the second main surface with respect to the signal line; whereinthe element assembly includes a connection used for external connection, and a transmission line defined by a portion of the first ground conductor extending along the signal line;the first main surface of the element assembly is a contact surface with a metal article; andthe first ground conductor is electrically connected to the metal article by connection between the transmission line and the metal article via solder or a conductive adhesive.3. The high-frequency signal ...

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Номер записи: 46
15-02-2018 дата публикации

HIGH-DENSITY STACKED GROUNDED COPLANAR WAVEGUIDES

Номер: US20180048044A1
Автор: Aparin Vladimir, He Xiaoyin, OU Yu-Chin, TASSOUDJI Mohammad Ali
Принадлежит:

A pair of stacked ground coplanar waveguides (GCPWs) is provided in two consecutive metal layers that are deposited on opposing surfaces of a dielectric layer. A first metal layer on a first side of the dielectric layer forms a first signal trace and an upper ground plane for a first GCPW in the pair. Similarly, a second metal layer on a second surface of the dielectric layer forms a second signal trace and an upper ground plane for a second GCPW in the pair. 1. A stacked waveguide , comprising:a first dielectric layer having a first surface and an opposing second surface;a first metal layer on the first surface of the first dielectric layer, wherein the first metal layer is configured to form both a first signal trace and a first upper ground plane for a first grounded coplanar waveguide (GCPW); anda second metal layer on the second surface of the first dielectric layer, wherein the second metal layer is configured to form both a second signal trace and a second upper ground plane for a second GCPW, and wherein the second upper ground plane for the second GCPW is further configured to form a first lower ground plane for the first GCPW, and wherein the first upper ground plane is further configured to form a second lower ground plane for the second GCPW, and wherein the first signal trace is arranged to cross over the second signal trace.2. The stacked waveguide of claim 1 , wherein the first signal trace is further arranged to cross over the second signal trace at a right angle.3. The stacked waveguide of claim 1 , wherein the first signal trace is further arranged to completely overlay the second signal trace such that the first signal trace has a zero degree angle of cross-over with regard to the second signal trace.4. The stacked waveguide of claim 1 , further comprising a plurality of vias extending through the first dielectric layer to couple the first upper ground plane to the first lower ground plane and to couple the second upper ground plane to the second ...

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Номер записи: 47
26-02-2015 дата публикации

THREE DIMENSIONAL BRANCHLINE COUPLER USING THROUGH SILICON VIAS AND DESIGN STRUCTURES

Номер: US20150054595A1
Автор: DEWITT Barbara S., JR. Wayne H., Mina Essam, RAHMAN BM Farid, Wang Guoan, Woods
Принадлежит:

A three dimensional (3D) branchline coupler using through silicon vias (TSV), methods of manufacturing the same and design structures are disclosed. The method includes forming a first waveguide structure in a first dielectric material. The method further includes forming a second waveguide structure in a second dielectric material. The method further includes forming through silicon vias through a substrate formed between the first dielectric material and the second dielectric material, which connects the first waveguide structure to the second waveguide structure. 1. A method , comprising:forming a first waveguide structure in a first dielectric material;forming a second waveguide structure in a second dielectric material; andforming through silicon vias through a substrate formed between the first dielectric material and the second dielectric material, which connects the first waveguide structure to the second waveguide structure.2. The method of claim 1 , wherein:the first waveguide structure comprises forming a signal line and ground plates on opposing sides of the signal line; andthe second waveguide structure comprises forming a signal line and ground plates on opposing sides of the signal line of the second waveguide structure.3. The method of claim 2 , wherein:ends of the signal lines of the first waveguide structure and the second waveguide structure are formed in contact with one another by the through silicon vias at an approximate 90 degree angle; andends of the ground plates of the first waveguide structure and the second waveguide structure are formed in contact with one another by the through silicon vias at an approximate 90 degree angle.4. The method of claim 3 , wherein the substrate is silicon material sandwiched between the first dielectric material and the second dielectric material.5. The method of claim 1 , wherein:the first waveguide structure is formed with a first port, Vin and a second port isolated from the first port Vin; andthe second ...

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Номер записи: 48
03-03-2022 дата публикации

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

Номер: US20220068774A1
Автор: LU Shih-Wen
Принадлежит: ADVANCED SEMICONDUCTOR ENGINEERING, INC.

A semiconductor device package includes a substrate and a conductive lid. The conductive lid is disposed within the substrate. The conductive lid defines a waveguide having a cavity. The waveguide is configured to transmit a signal from a first electronic component to a second electronic component through the cavity.

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Номер записи: 49
13-02-2020 дата публикации

METAMATERIAL WAVEGUIDES AND SHIELDED BRIDGES FOR QUANTUM CIRCUITS

Номер: US20200052359A1
Автор: Fang Michael T., Ferreira Vinicius Thaddeu dos Santos, Kalaee Mahmoud, Keller Andrew J., Kim Eun Jong, Mirhosseini Niri Seyed Mohammad, PAINTER Oskar, Sipahigil Alp
Принадлежит: California Institute of Technology

Metamaterial waveguides and shielded bridges are employed to improve the scalability and routing of quantum computing circuits. A metamaterial waveguide includes a signal conductor that has a periodic array of lumped element resonators distributed along and electrically coupled to a signal conductor. The periodic array of lumped element resonator pairs defines a bandgap within an operating bandwidth of the waveguide. Qubits can communicate within the operating bandwidth of the waveguide and communications via the waveguide can be controlled by changing a center frequency of the qubits. A shielded bridge is used to cross over high frequency communications and control CPW's in a quantum computing circuit. The shielded bridge includes a signal bridge that is elevated and extends over a separate CPW, and a ground bridge positioned between the signal bridge and the separate CPW. 1. A waveguide for communicatively coupling qubits , the waveguide comprising:a longitudinal signal conductor extending across a surface of a dielectric substrate;a periodic array of lumped element resonators distributed along and electrically coupled to the signal conductor, wherein the resonators create a bandgap within an operating bandwidth of the waveguide; andwherein all wavelengths within the bandgap are larger than geometrical extents of each of the resonators.2. The waveguide of wherein the qubits are configured to communicate within a communication band that is defined within the operating bandwidth.3. The waveguide of wherein a communication distance within which qubits can communicate via the waveguide is controlled in response to changing a center frequency of the communication band.4. The waveguide of wherein when operating within the bandgap claim 3 , increasing the center frequency of the communication band results in an increase in communication distance within which qubits can communicate.5. The waveguide of wherein all wavelengths within the bandgap are at least 10 times larger ...

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Номер записи: 50
13-02-2020 дата публикации

Systems and methods for signal isolation in radio frequency circuit boards

Номер: US20200052737A1
Автор: Peter J. Moosbrugger, Ray Lovestead, Zachary T. Miers
Принадлежит: Ball Aerospace and Technologies Corp

Systems and methods for isolating radio frequency (RF) signals in high frequency circuit assemblies, including but not limited to 5G communication systems, are provided. The circuit assemblies include an RF suppression structure, which can be in the form of a low ohm resistor, that extends across a transmission line, and that has contacts that are electrically joined to a ground plane. Alternatively or in addition, the circuit assemblies include a low ohm resistor that extends over a transition between a signal via and an end of a transmission line, and that has contacts that are electrically joined to a ground plane. A circuit assembly as disclosed herein can further include multiple low ohm resistors spaced apart from one another by a distance that is a fraction of a wavelength of a highest frequency signal carried by the transmission line.

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Номер записи: 51
05-03-2015 дата публикации

RADIO FREQUENCY DEVICE WITH FEED STRUCTURE

Номер: US20150061795A1
Автор: Lemons Alan C., Milroy William, Sor James
Принадлежит: ThinKom Solutions, Inc.

A radio frequency (RF) device includes an RF transmission line structure having opposing boundary walls with a non-rectilinear form factor, and a feed structure configured to introduce RF energy into an area between the opposing boundary walls to illuminate the RF transmission line structure with the RF energy across the non-rectilinear form factor. The feed structure includes a plurality of traveling-waveguide-fed leaky line-segment structures, each configured to launch the RF energy into the area with a propagation direction having an oblique angle relative to an axis of the line-segment structure. 1. A radio frequency (RF) device , comprising:an RF transmission line structure including opposing boundary walls with a non-rectilinear form factor; and 'a plurality of traveling-waveguide-fed leaky line-segment structures, each configured to launch the RF energy into the area with a propagation direction having an oblique angle relative to an axis of the line-segment structure.', 'a feed structure configured to introduce RF energy into an area between the opposing boundary walls to illuminate the RF transmission line structure with the RF energy across the non-rectilinear form factor, the feed structure including2. The RF device according to claim 1 , wherein the plurality of leaky line-segment structures are positioned proximate a perimeter of the non-rectilinear form factor.3. The RF device according to claim 1 , wherein the non-rectilinear form factor is circular or elliptical.4. The RF device according to claim 3 , wherein the plurality of leaky line-segment structures are positioned along corresponding chords of the circular or elliptical form factor.5. The RF device according to claim 1 , wherein two or more of the plurality of leaky line-segment structures are oriented at oblique angles to one another.6. The RF device according to claim 5 , wherein two of the plurality of leaky line-segment structures are oriented at an oblique angle to one another and extend ...

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Номер записи: 52
05-03-2015 дата публикации

Ruggedized low-relection/high-transmission integrated spindle for parallel-plate transmission-line structures

Номер: US20150061796A1
Автор: James Sor, William Milroy
Принадлежит: Thinkom Solutions Inc

A radio frequency (RF) transmission-line structure includes a parallel-plate transmission line formed from a first conducting plate and a second conducting plate. The second conducting plate is spaced apart from the first conducting plate and substantially parallel to the first conducting plate. A support member is attached to the first and second plates and is operative to maintain a fixed mechanical spacing between the first conducting plate and the second conducting plate. The transmission-line structure further includes at least one feature configured to isolate or suppress RF interaction of the support member with RF fields within the parallel-plate transmission line.

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Номер записи: 53
10-03-2022 дата публикации

Transmission line substrate and electronic device

Номер: US20220077555A1
Автор: Genro KATO, Hiromasa KOYAMA, Kosuke OOI, Kotaro MISHIMA, Shingo Ito
Принадлежит: Murata Manufacturing Co Ltd

A transmission line substrate includes a line portion, a base including a first main surface and a second main surface opposite to the first main surface, first and second ground conductors, and a signal line. The first ground conductor is on the first main surface side. The second ground conductor is on the second main surface side. The first ground conductor includes first conductor-non-formed portions overlapping the signal line when viewed in the Z axis direction. The second ground conductor includes second conductor-non-formed portions overlapping the signal line when viewed in the Z axis direction. A total area of the second conductor-non-formed portions is less than a total area of the first conductor-non-formed portions.

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Номер записи: 54
10-03-2022 дата публикации

TRANSMISSION LINE AND ELECTRONIC DEVICE

Номер: US20220077556A1
Автор: KOYAMA Hiromasa, SOETA Yushi
Принадлежит:

A transmission line includes first, second, third, and fourth signal lines, and first, second, third, and fourth electrode pads respectively connected thereto. A first main surface of an external connection portion includes a first region in which the first electrode pad and the second electrode pad are provided, and a second region in which the third electrode pad and the fourth electrode pad are provided. Each of the first electrode pad and the second electrode pad, in a plan view, is surrounded by a ground electrode, and at least one of the third electrode pad and the fourth electrode pad, in the plan view, includes a portion that is not surrounded by the ground electrode. 1. A transmission line comprising:a plurality of layers stacked on each other;a first signal line on any one of the plurality of layers;a second signal line on any one of the plurality of layers;a third signal line on any one of the plurality of layers;a fourth signal line on any one of the plurality of layers;a first electrode pad connected to the first signal line;a second electrode pad connected to the second signal line;a third electrode pad connected to the third signal line;a fourth electrode pad connected to the fourth signal line; anda ground electrode on any one of the plurality of layers; whereinthe plurality of layers are stacked and include a first main surface and a second main surface;{'claim-text': ['a line portion extending along the first signal line, the second signal line, the third signal line, and the fourth signal line and including a first end and a second end; and', 'a first external connection portion connected to the first end of the line portion;'], '#text': 'the plurality of layers include:'}the first electrode pad, the second electrode pad, the third electrode pad, and the fourth electrode pad are on the first main surface in the first external connection portion;a first frequency of a high-frequency signal to be transmitted through the first signal line and a ...

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Номер записи: 55
21-02-2019 дата публикации

ADAPTATION OF POLYPHASE WAVEGUIDE PROBES

Номер: US20190058327A1
Автор: Corum James F., Corum Kenneth L.
Принадлежит:

Disclosed are various embodiments for transmitting energy conveyed in the form of a guided surface-waveguide mode along a lossy conducting medium such as, e.g., the surface of a terrestrial medium by exciting a polyphase waveguide probe. A probe control system can be used to adjust the polyphase waveguide probe based at least in part upon characteristics of the lossy conducting medium. 1. A system , comprising:a guided surface waveguide probe comprising a first charge terminal and a second charge terminal elevated above a lossy conducting medium, the guided surface waveguide probe being configured to launch a Zenneck surface wave by generating at least one resultant field that synthesizes a wave front incident at a complex Brewster angle of incidence of the lossy conducting medium; anda probe control system configured to optimize operation of the guided surface waveguide probe by adjusting one or more operating parameters of the guided surface waveguide probe.2. The system of claim 1 , further comprising a remotely-located field meter in communication with the probe control system claim 1 , the probe control system being configured to receive field meter data from the remotely-located field meter claim 1 , and the one or more operating parameters being adjusted based at least in part on the field meter data.3. The system of claim 2 , wherein the one or more operating parameters of the guided surface waveguide probe are adjusted until a maximum field strength is detected by the remotely-located field meter.4. The system of claim 1 , wherein the one or more operating parameters comprise at least one of: a distance between the first charge terminal and the second charge terminal claim 1 , a self-capacitance of at least one of the first charge terminal or the second charge terminal claim 1 , a bound capacitance of at least one of the first charge terminal or the second charge terminal claim 1 , a phase of at least one of the first charge terminal or the second charge ...

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Номер записи: 56
22-05-2014 дата публикации

Line Isolation of Radio Frequency Devices

Номер: US20140139300A1
Автор: "OConnor Shane A.", Brown Andrew K.
Принадлежит: Raytheon Company

A radio frequency (RF) device includes a transmission line arranged on a substrate, the transmission line operative to propagate an RF signal having a wavelength (λ), and a first isolation portion arranged on the substrate proximate to the transmission line, the first isolation portion including an arrangement of stubs, where each stub of the arrangement of stubs has a length (y) where y=¼λ, the first isolation portion operative to substantially prevent electromagnetic interference caused by the propagation of the RF signal in the transmission line from passing through the first isolation portion. 1. A radio frequency (RF) device comprising:a transmission line arranged on a substrate, the transmission line operative to propagate an RF signal having a wavelength (λ); anda first isolation portion arranged on the substrate proximate to the transmission line, the first isolation portion including an arrangement of stubs, where each stub of the arrangement of stubs has a length (y) where y=¼λ, the first isolation portion operative to substantially prevent electromagnetic interference caused by the propagation of the RF signal in the transmission line from passing through the first isolation portion.2. The device of claim 1 , wherein the transmission line includes a conductive material.3. The device of claim 1 , wherein each stub of the arrangement of stubs includes a conductive material.4. The device of claim 1 , wherein the first isolation portion includes a body portion arranged on the substrate proximate to the transmission line.5. The device of claim 4 , wherein the arrangement of stubs extends outwardly from the body portion.6. The device of claim 4 , wherein the body portion includes a conductive material.7. The device of claim 1 , wherein each stub of the arrangement of stubs includes a rectangular shape.8. The device of claim 1 , wherein each stub of the arrangement of stubs is arranged with a longitudinal axis that intersects a line tangential to an edge of the ...

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Номер записи: 57
12-03-2015 дата публикации

SLOW-WAVE RADIOFREQUENCY PROPAGATION LINE

Номер: US20150070110A1
Автор: Ferrari Philippe, Franc Anne-Laure, Podevin Florence, Rehder Gustavo Pamplona, Serrano Ariana
Принадлежит: UNIVERSITE JOSEPH FOURIER

The instant disclosure describes a radiofrequency propagation line including a conducting strip connected to a conducting plane parallel to the plane of the conducting strip, wherein the conducting plane includes a network of nanowires made of an electrically conductive, non-magnetic material extending orthogonally to the plane of the conducting strip, in the direction of said conducting strip. 1. A radiofrequency propagation line comprising a conductive strip formed on a first insulating layer having a first thickness , h1 , associated with a conductive plane parallel to the plane of said strip , wherein the conductive plane comprises a network of nanowires made of an electrically-conductive and non-magnetic material extending in a second insulating layer having a second thickness , h2 , all the way to the first insulating layer , orthogonally to the plane of the conductive strip , towards said strip , ratio h1/h2 between the thicknesses of the first and second insulating layers being smaller than 0.05.2. The propagation line of claim 1 , wherein the nanowires are formed in a ceramic layer formed on a conductive plane claim 1 , the ceramic layer being itself coated with an insulating layer.3. The propagation line of claim 2 , wherein the ceramic layer is an alumina layer.4. The propagation line of claim 1 , wherein the first insulating layer has a thickness in the range from 0.5 to 2 μm and the nanowires have a length from 50 μm to 1 mm.5. The propagation line of claim 1 , wherein the nanowires have a diameter from 30 to 200 nm and a spacing from 60 to 450 nm.6. A radiofrequency component support comprising claim 1 , under a first insulating layer claim 1 , a second insulating layer crossed by nanowires connected to a conductive plane claim 1 , ratio h1/h2 between the first and second insulating layers being smaller than 0.05. The present disclosure relates to a radiofrequency (RF) propagation line. Radiofrequency here means the field of millimetric or ...

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Номер записи: 58
28-02-2019 дата публикации

MAGNETIC FLUX CONTROL IN SUPERCONDUCTING DEVICE

Номер: US20190065981A1
Автор: Chen Yu, Kafri Dvir
Принадлежит:

A device includes: a first qubit including a first co-planar waveguide; a second qubit including a second co-planar waveguide, in which the second co-planar waveguide crosses the first co-planar waveguide; and a qubit coupler including a loop having a first lobe and a second lobe, in which a first portion of the first lobe extends parallel to the first co-planar waveguide, a second portion of the first lobe extends parallel to the second co-planar waveguide, a first portion of the second lobe extends parallel to the first co-planar waveguide, and a second portion of the second lobe extends parallel to the second co-planar waveguide. 1. A device comprising:a first qubit comprising a first co-planar waveguide;a second qubit comprising a second co-planar waveguide, wherein the second co-planar waveguide crosses the first co-planar waveguide; anda qubit coupler comprising a loop having a first lobe and a second lobe,wherein a first portion of the first lobe extends parallel to the first co-planar waveguide, a second portion of the first lobe extends parallel to the second co-planar waveguide,a first portion of the second lobe extends parallel to the first co-planar waveguide, and a second portion of the second lobe extends parallel to the second co-planar waveguide.2. The device of claim 1 , comprising a plurality of ground pads arranged around a position where the second co-planar waveguide crosses the first co-planar waveguide.3. The device of claim 2 , wherein the plurality of ground pads consists of four ground pads arranged in a two-by-two array.4. The device of claim 2 , wherein each ground pad of the plurality of ground pads is connected to a plurality of superconducting airbridges.5. The device of claim 4 , wherein claim 4 , for each ground pad of the plurality of ground pads claim 4 , at least one superconducting airbridge of the plurality of superconducting airbridges connects the ground pad to a ground plane.6. The device of claim 5 , wherein claim 5 , for ...

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Номер записи: 59
09-03-2017 дата публикации

Field Strength Monitoring for Optimal Performance

Номер: US20170067951A1
Автор: Corum James F., Corum Kenneth L., Lilly James D., Pinzone Joseph F.
Принадлежит:

Disclosed are various embodiments for field strength monitoring of electromagnetic fields generated by a guided surface waveguide probe. A field meter measures the field strength of the electromagnetic field. The field meter communicates the measured field strength to a probe control system coupled to the guided surface waveguide probe. Adjustments can be made to one or more operational parameters of the guided surface waveguide probe according to the measured field strength. 1. A system , comprising:a probe control system coupled to a guided surface waveguide probe, the probe control system configured to adjust one or more operational parameters of the guided surface waveguide probe; and measure field strength associated with an electromagnetic field generated by the guided surface waveguide probe; and', 'communicate field strength information to the probe control system, the field strength information including the measured field strength., 'a plurality of field meters in data communication with the probe control system, the plurality of field meters configured to2. The system of claim 1 , wherein the guided surface waveguide probe comprises a charge terminal elevated over a lossy conducting medium configured to generate the electromagnetic field that synthesizes a wave front incident at a complex Brewster angle of incidence (θ) of the lossy conducting medium.3. The system of claim 2 , wherein the guided surface waveguide probe comprises a feed network electrically coupled to the charge terminal claim 2 , the feed network providing a phase delay (Φ) that matches a wave tilt angle (Ψ) associated with a complex Brewster angle of incidence (θ) associated with the lossy conducting medium in a vicinity of the guided surface waveguide probe.4. The system of claim 1 , wherein at least one field meter is stationary such that a location of the at least one field meter is the same for repeated field strength measurements.5. The system of claim 1 , wherein at least one field ...

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Номер записи: 60
09-03-2017 дата публикации

GLOBAL EMERGENCY AND DISASTER TRANSMISSION

Номер: US20170069189A1
Автор: "DAurelio Michael J.", Corum James F., Corum Kenneth L., JR. Basil F., Pinzone, Pinzone Joseph F.
Принадлежит:

Disclosed is a disaster warning device with a guided surface wave receive structure, an impedance matching network, a power circuit, a data processing circuit, and a warning output. The power circuit and the data processing circuit may be coupled to the guided surface wave receive structure. The power circuit may supply electrical energy to power to the data processing circuit and warning output. The power circuit may receive power from a guided surface wave. The data processing circuitry may receive data communications from a guided surface wave. 1. An apparatus , comprising:at least one guided surface wave receive structure configured to obtain electrical energy from a guided surface wave traveling along a terrestrial medium;a power circuit coupled the at least one guided surface wave receive structure and experienced as a load at an excitation source coupled to a guided surface waveguide probe generating the guided surface wave, the power circuit configured to generate a power signal based in part on the electrical energy from the guided surface wave;a data processing circuit electrically coupled to the at least one guided surface wave receive structure to receive a data signal, the data processing circuit configured to receive the power signal from the power circuit; anda warning output circuit coupled to receive an output from the data processing circuit, the warning output circuit comprising at least one output device, the warning output circuit configured to receive the power signal from the power circuit.2. The apparatus of claim 1 , wherein the at least one guided surface wave receive structure comprises two guided surface wave receive structures claim 1 , and the power circuit is coupled to a first guided surface wave receive structure of the two guided surface wave receive structures and the data processing circuit is coupled to a second guided surface wave receive structure of the two guided surface wave receive structures.3. The apparatus of claim 2 , ...

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Номер записи: 61
28-02-2019 дата публикации

Multi-Channel Digital Step Attenuator Architecture

Номер: US20190068167A1
Автор: Bacon Peter, Sharma Vikas
Принадлежит:

A multi-channel digital step attenuator (DSA) architecture. One embodiment includes an array comprising N channels of B selectable attenuator cells series-connected. The overall impedance of a multi-channel DSA is a function of the parallel impedances of the N channels, and transition levels are reduced by 1/N since the transient effect of switching any one attenuator cell in or out of circuit in one channel is mitigated by all other in-circuit attenuator cells in the parallel channels. The multi-channel DSA architecture enables a great design flexibility, and allows a designer to vary one or more of at least the following design parameters: the number of attenuator cells B per channel; the number N of channels per DSA; the bit weighting of each attenuator cell per channel; the maximum attenuation per channel; and the characteristic impedance ZOof each channel. 1. A multi-channel digital step attenuator comprising an array of N channels of B selectable attenuator cells series-connected between an input port and an output port , where N is an integer greater than one and n is a channel number within the N channels , and B is an integer equal to or greater than one and b is a bit position within the B selectable attenuator cells.2. The invention of claim 1 , wherein each attenuator cell has at least two selectable states claim 1 , the selectable states comprising at least one attenuation state providing a corresponding specified level of attenuation of a signal applied at the input port claim 1 , and a bypass state providing essentially no significant attenuation of the applied signal.3. The invention of claim 2 , wherein the applied signal is a radio frequency signal.4. The invention of claim 1 , wherein at least one selectable attenuator cell is one of a Bridged-Tee claim 1 , Pi claim 1 , Tee claim 1 , or L-pad type selectable attenuator cell.5. The invention of claim 1 , wherein at least one selectable attenuator cell is a multi-state attenuator cell.6. The ...

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Номер записи: 62
09-03-2017 дата публикации

CHANGING GUIDED SURFACE WAVE TRANSMISSIONS TO FOLLOW LOAD CONDITIONS

Номер: US20170070092A1
Автор: Corum James F., Corum Kenneth L., Pinzone Joseph F.
Принадлежит:

Disclosed are various embodiments of a guided surface waveguide transmit system. One embodiment of the guided surface waveguide transmit system includes a guided surface waveguide probe configured to transmit a guided surface wave along a lossy conducting medium. The system further includes a controller device configured to receive load status data and signal for the guided surface waveguide probe to adjust transmission of the guided surface wave based at least in part on the load status data. 1. An apparatus , comprising:a plurality of guided surface waveguide probes configured to transmit guided surface waves along a lossy conducting medium to a certain geographic area; anda controller device configured to receive load status data and signal for at least a subset of the guided surface waveguide probes to adjust transmission of the guided surface waves for the certain geographic area based at least in part on the load status data.2. The apparatus of claim 1 , wherein an individual one of the guided surface waveguide probes comprises a charge terminal elevated over the lossy conducting medium configured to generate at least one resultant field that synthesizes a wave front incident at a complex Brewster angle of incidence of the lossy conducting medium.3. The apparatus of claim 2 , wherein the charge terminal is one of a plurality of charge terminals.4. The apparatus of claim 2 , further comprising a feed network electrically coupled to the charge terminal claim 2 , the feed network providing a phase delay that matches a wave tilt angle associated with a complex Brewster angle of incidence associated with the lossy conducting medium in a vicinity of the guided surface waveguide probe.5. The apparatus of claim 1 , wherein the controller device adjusts transmission of the guided surface waves by changing a number of guided surface wave receive structures that are assigned to service the certain geographic area.6. The apparatus of claim 1 , wherein the controller ...

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Номер записи: 63
09-03-2017 дата публикации

POWER INTERNAL MEDICAL DEVICES WITH GUIDED SURFACE WAVES

Номер: US20170070094A1
Автор: Carlton, Corum James F., Corum Kenneth L., JR. Paul Kendall, Pinzone Joseph F.
Принадлежит:

Disclosed is an implantable medical device and methods of using the medical device. The medical device may include a guided surface wave receive structure configured to receive a guided surface wave transmitted by a guided surface waveguide probe. The guided surface wave receive structure in the medical device generates an alternating current signal when the guided surface wave is received. The medical device includes a power circuit that is coupled to the guided surface wave receive structure. The power circuit includes a power storage circuit to store the power signal. The medical device includes a medical circuit that comprises a stimulus circuit, a monitoring circuit, and potentially other components. The stimulus circuit provides a stimulus to a human body. The monitoring circuit measures a characteristic of the human body. 1. An apparatus , comprising:a guided surface wave receive structure configured to receive a guided surface wave traveling along a terrestrial medium generated by a guided surface waveguide probe;a power circuit electrically coupled to the guided surface wave receive structure, the power circuit generating a power signal from an alternating current signal generated by the guided surface wave receive structure; anda medical circuit electrically coupled to the power circuit, the medical circuit comprising a monitoring circuit configured to receive measure a characteristic of a human body.2. The apparatus of claim 1 , wherein the medical circuit comprising a stimulus circuit configured to provide a stimulus to the human body.3. The apparatus of claim 1 , wherein apparatus is implanted in the human body.4. The apparatus of claim 1 , wherein the power circuit comprises a power storage circuit configured to store the power signal.5. The apparatus of claim 1 , wherein the monitoring circuit is configured to measure at least one of: a pulse claim 1 , a blood pressure claim 1 , a temperature claim 1 , a respiration rate claim 1 , an electric signal ...

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Номер записи: 64
09-03-2017 дата публикации

LONG DISTANCE TRANSMISSION OF OFFSHORE POWER

Номер: US20170070098A1
Автор: Ashcroft John Robert, Corum James F., Corum Kenneth L., Miller Michael W., Wilson Stephen W.
Принадлежит:

Disclosed are systems and methods for long distance transmission of offshore generated power. A turbine is located offshore. The turbine can be mechanically coupled to a generator. A guided surface waveguide probe is electrically coupled to the generator and configured to launch a guided surface wave on a terrestrial medium. 1. A system , comprising:a turbine located underwater;a generator mechanically coupled to the turbine; anda guided surface waveguide probe electrically coupled to the generator, the guided surface waveguide probe being configured to launch a guided surface wave on a terrestrial medium.2. The system of claim 1 , further comprising a transmission station on the surface of the water claim 1 , wherein the transmission station is electrically coupled to the generator by a transmission line.3. The system of claim 1 , wherein the guided surface waveguide probe comprises a charge terminal elevated over the terrestrial medium configured to generate at least one resultant field that synthesizes a wave front incident at a complex Brewster angle of incidence (θ) of the lossy conducting medium.4. The system of claim 3 , wherein the charge terminal is one of a plurality of charge terminals.5. The system of claim 3 , further comprising a feed network electrically coupled to the charge terminal claim 3 , the feed network providing a phase delay (Φ) that matches a wave tilt angle (ψ) associated with a complex Brewster angle of incidence (θ) associated with the terrestrial medium in the vicinity of the guided surface waveguide probe.6. The system of claim 5 , wherein the turbine is enclosed within a shroud.7. The system of claim 1 , wherein the turbine comprises a helical turbine.8. A system claim 1 , comprising:a guided surface wave receive structure configured to obtain electrical energy from a first guided surface wave traveling along a terrestrial medium; and 'the second guided surface waveguide probe launches a second guided surface wave along the ...

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Номер записи: 65
05-06-2014 дата публикации

ANTENNA AND PRINTED-CIRCUIT BOARD USING WAVEGUIDE STRUCTURE

Номер: US20140152520A1
Автор: Ando Noriaki, Toyao Hiroshi
Принадлежит: NEC Corporation

An antenna includes a first conductive plane, a second conductive plane disposed in parallel with the first conductive plane, a power-supply unit applying a high frequency signal between the first conductive plane and the second conductive plane, and at least one shunt which is aligned in the second conductive plane and includes a transmission line including an open end aligned in a plane above or below the second conductive plane and a conductive via electrically connecting another end of the transmission line to the first conductive plane. A distance between a bottom surface of the transmission line and the second conductive plane is less than a distance between the bottom surface of the transmission line and the first conductive plane. The transmission line is formed on a plane positioned to face the second conductive plane outside a region circumscribed between the first conductive plane and the second conductive plane. 1. An antenna , comprising:a first conductive plane;a second conductive plane disposed in parallel with the first conductive plane;a power-supply unit applying a high frequency signal between the first conductive plane and the second conductive plane; andat least one shunt which is aligned in the second conductive plane and which comprises a transmission line comprising an open end aligned in a plane above or below the second conductive plane and a conductive via electrically connecting another end of the transmission line to the first conductive plane,wherein a distance between a bottom surface of the transmission line and the second conductive plane is less than a distance between the bottom surface of the transmission line and the first conductive plane,wherein the transmission line is formed on a plane which is positioned to face the second conductive plane outside a region circumscribed between the first conductive plane and the second conductive plane, andwherein a clearance is formed at a position corresponding to the conductive via in the ...

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Номер записи: 66
05-06-2014 дата публикации

TRANSMISSION LINE AND ANTENNA DEVICE

Номер: US20140152525A1
Автор: ISO Naoki, KITANO Nobuaki
Принадлежит: HITACHI METALS, LTD.

A transmission line has a triplate line including a first outer conductor and a second outer conductor disposed in parallel with each other at a predetermined interval, and a central conductor disposed in a space between the first outer conductor and the second outer conductor; and a dielectric spacer interposed between the first and second outer conductors and the central conductor and configured to support the central conductor. The central conductor has a supported portion supported by the dielectric spacer, and first and second high-impedance portions having characteristic impedances higher than a characteristic impedance in the supported portion. The first and second high-impedance portions are disposed on input and output sides, respectively, of the supported portion. 1. A transmission line comprising:a triplate line including a pair of outer conductors disposed in parallel with each other at a predetermined interval, and a central conductor disposed in a space between the pair of outer conductors; anda spacer interposed in the space between the pair of outer conductors and the central conductor, the spacer being made of a dielectric material and configured to support the central conductor,wherein the central conductor has a supported portion supported by the spacer, and first and second high-impedance portions having characteristic impedances higher than a characteristic impedance in the supported portion, the first and second high-impedance portions being disposed on input and output sides, respectively, of the supported portion.2. The transmission line according to claim 1 , wherein a line width in the supported portion is greater than line widths in the first and second high-impedance portions.3. The transmission line according to claim 1 , wherein the spacer has a first spacer member having a plate-like base and a protrusion protruding from the base claim 1 , and a second spacer member having a fitting hole into which the protrusion is fitted; andthe ...

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Номер записи: 67
15-03-2018 дата публикации

FERROELECTRIC NANOCOMPOSITE BASED DIELECTRIC INKS FOR RECONFIGURABLE RF AND MICROWAVE APPLICATIONS

Номер: US20180072901A1
Автор: Akyurtlu Alkim, Armiento Craig, Haghzadeh Mahdi
Принадлежит:

A novel ferroelectric ink comprising multiphase Barium Strontium Titanate (BST) in a polymer composite is described. The ink can be employed using direct-ink writing techniques to print high dielectric constant, low loss, and electrostatically-tunable dielectrics on substrates. The substrates can be flexible such as plastics or rigid, such as substrates comprising semiconductor materials or ceramics and the like. The dielectric ink is made by suspending pre-sintered nano/submicron-sized particles of BST in a thermoplastic polymer with a solvent. After printing with the ink, a low temperature curing process is performed at temperatures below 200° C., a temperature too low to sinter BST. Fully printed devices, such as a varactor and a phase shifter using direct ink writing methodologies are described. 1. An apparatus comprising:a first electrode;a second electrode;a filler material disposed between the first electrode and the second electrode, the filler material comprising a plurality of pre-sintered perovskite oxide particles.2. The apparatus as in claim 1 , wherein the first electrode is a first electrically conductive structure and the second electrode is a second electrically conductive structure claim 1 , at least one of the first electrically conductive structure and the second electrically conductive structure being coupled to a substrate claim 1 , the first electrically conductive structure and the second electrically conductive structure each having at least one terminal claim 1 , the first electrically conductive structure and the second electrically conductive structure spaced apart from each other so as to define a channel in which the filler material resides.3. The apparatus of further comprising:a flexible substrate, the first electrode and second electrode disposed on the flexible substrate.4. The apparatus of claim 1 , wherein the apparatus is configured to operate under application of a tunable radio frequency signal.5. The apparatus of claim 1 , ...

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Номер записи: 68
17-03-2016 дата публикации

GEOLOCATION WITH GUIDED SURFACE WAVES

Номер: US20160077201A1
Автор: Corum James F., Corum Kenneth L., Lilly James D., Pinzone Joseph F.
Принадлежит:

Disclosed are various embodiments for fixing a navigational position using guided surface waves launched from guided surface wave waveguide probes at various ground stations. A navigation unit may fix its position by determining the travel time of guided surface waves from the ground stations to the navigation unit. In another embodiment, the navigation unit may also fix its position by determining the change in intensity of the guided surface waves after travelling from the ground stations to the navigation unit. In other embodiments, the navigation unit may also fix its position by determining the difference in phases of phase-locked guided surface waves as they travel from the ground stations to the navigation unit. 1. A system , comprising:{'sub': 'i,B', 'a first guided surface waveguide probe comprising a first charge terminal elevated over a first lossy conducting medium configured to generate at least one resultant field that synthesizes a first wave front incident at a first complex Brewster angle of incidence (θ) of the first lossy conducting medium;'}circuitry communicatively coupled to the first guided surface waveguide probe, wherein the circuitry coupled to the first guided surface waveguide probe is configured to at least launch a first guided surface wave with a first frequency via the first guided surface waveguide probe;{'sub': 'i,B', 'a second guided surface waveguide probe comprising a second charge terminal elevated over a second lossy conducting medium configured to generate at least one resultant field that synthesizes a second wave front at a second complex Brewster angle of incidence (θ) of the second lossy conducting medium;'}circuitry communicatively coupled to the second guided surface waveguide probe, wherein the circuitry communicatively coupled to the second guided surface waveguide probe is configured to at least launch a second guided surface wave with a second frequency via the second guided surface waveguide probe;{'sub': 'i,B', 'a ...

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Номер записи: 69
17-03-2016 дата публикации

Remote surface sensing using guided surface wave modes on lossy media

Номер: US20160077203A1
Автор: James F. Corum, Kenneth L. Corum
Принадлежит: Cpg Technologies Llc

Disclosed are various systems and methods for remote surface sensing using guided surface wave modes on lossy media. One system, among others, includes a guided surface waveguide probe configured to launch a guided surface wave along a surface of a lossy conducting medium, and a receiver configured to receive backscatter reflected by a remotely located object illuminated by the guided surface wave. One method, among others, includes launching a guided surface wave along a surface of a lossy conducting medium by exciting a charge terminal of a guided surface waveguide probe, and receiving backscatter reflected by a remotely located object illuminated by the guided surface wave.

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Номер записи: 70
17-03-2016 дата публикации

Compact magnet system for a high-power millimeter-wave gyrotron

Номер: US20160078992A1
Автор: Larry R. Barnett
Принадлежит: Individual

A compact magnet system for use in a high-power microwave tube includes an electromagnetic coil surrounded on three sides by permanent magnets. More particularly, constituent components include a first tubular retaining member; the electromagnetic coil that fits within the first tubular retaining member and that has a central cavity; first permanent magnets positioned to extend radially from the central cavity so that like poles of the first permanent magnets wrap around the central cavity along a first side of the solenoid coil; and second permanent magnets positioned to extend radially from the central cavity so that opposite poles to the first permanent magnets wrap around the central axis along the second side of the solenoid coil. Optional added components include two sets of permanent magnets, one set on each side of the coil and a pole piece located adjacent to an end of the first tubular retaining member.

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Номер записи: 71
17-03-2016 дата публикации

MODULATED GUIDED SURFACE WAVES

Номер: US20160079643A1
Автор: Corum James F., Corum Kenneth L.
Принадлежит:

Disclosed are various systems and methods directed to the launching of a guided surface wave embodying a modulated signal using a guided surface waveguide probe. A modulated signal is generated and coupled to a guided surface waveguide probe. A resulting guided surface wave is launched that decays exponentially as a function of distance. 1. A system , comprising:a guided surface waveguide probe;modulation circuitry coupled to the guided surface waveguide probe, the modulation circuitry being configured to generate a modulated signal, the modulated signal being applied to the guided surface waveguide probe; andthe guided surface waveguide probe being adjusted to launch a guided surface wave along a terrestrial medium, the guided surface wave embodying the modulated signal.2. The system of claim 1 , wherein the modulation circuitry further comprises amplitude modulation circuitry claim 1 , and the modulated signal further comprises an amplitude modulation signal.3. The system of claim 1 , wherein the guided surface waveguide probe is a polyphase waveguide probe having at least two charge terminals.4. The system of claim 3 , wherein the guided surface waveguide probe comprises a charge terminal elevated over the terrestrial medium configured to generate at least one resultant field that synthesizes a wave front incident at a complex Brewster angle of incidence (θ) of the terrestrial medium at a vicinity of the guided surface waveguide probe.5. The system of claim 1 , wherein the guided surface waveguide probe is a single phase probe having a single charge terminal.6. The system of claim 5 , wherein the guided surface waveguide probe further comprises a feed network electrically coupled to the single charge terminal claim 5 , the feed network providing a phase delay (Φ) that matches a wave tilt angle (Ψ) associated with a complex Brewster angle of incidence (θ) associated with the terrestrial medium in a vicinity of the guided surface waveguide probe.7. The system of ...

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Номер записи: 72
17-03-2016 дата публикации

SITE PREPARATION FOR GUIDED SURFACE WAVE TRANSMISSION IN A LOSSY MEDIA

Номер: US20160079644A1
Автор: Corum James F., Corum Kenneth L., JR. Basil F., Lilly James D., Pinzone, Wilson Stephen W.
Принадлежит:

Aspects of a guided surface waveguide probe site and the preparation thereof are described. In various embodiments, the guided surface waveguide probe site may include a propagation interface including a first region and a second region, and a guided surface waveguide probe configured to launch a guided surface wave along the propagation interface. In one aspect of the embodiments, at least a portion of the first region may be prepared to more efficiently launch or propagate the guided surface wave. Among embodiments, the portion of the first region, which may be composed of the Earth, may be treated or mixed with salt, gypsum, sand, or gravel, for example, among other compositions of matter. In other embodiments, the portion of the first region may be covered, insulated, irrigated, or temperature-controlled, for example. By preparing the site, a guided surface wave may be more efficiently launched and/or propagated. 1. A probe site , comprising:a propagation interface including a lossy conducting medium that extends along the propagation interface; anda guided surface waveguide probe configured to launch a guided surface wave along the propagation interface, the guided surface waveguide probe including a charge terminal elevated at a height over the lossy conducting medium, a ground stake in the lossy conducting medium, and a feed network coupled between the ground stake and the charge terminal,wherein a portion of the lossy conducting medium is prepared to launch the guided surface wave.2. The probe site according to claim 1 , wherein the guided surface waveguide probe is configured to generate at least one resultant field that synthesizes a wave front having a complex Brewster angle of incidence at a crossover distance from the guided surface waveguide probe in the lossy conducting medium.3. The probe site according to claim 1 , wherein the feed network is configured to provide a phase delay that matches a wave tilt angle associated with a complex Brewster angle ...

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Номер записи: 73
17-03-2016 дата публикации

SUPERPOSITION OF GUIDED SURFACE WAVES ON LOSSY MEDIA

Номер: US20160079645A1
Автор: Corum James F., Corum Kenneth L.
Принадлежит:

Disclosed are various embodiments for superposition of guided surface wave launched along the surface of a lossy medium such as, e.g., a terrestrial medium by exciting a guided surface waveguide probe. In one example, among others, a system includes an array of guided surface waveguide probes configured to launch guided surface waves along a surface of a lossy conducting medium and an array control system configured to control operation of waveguide probes in the array via one or more feed networks. The array control circuit can control operation of the guided surface waveguide probes to maintain a predefined radiation pattern produced by the guided surface waves. In another example, a method includes providing voltage excitation to first and second guided surface waveguide probes to launch guided surface waves with the voltage excitation provided to the second guided surface waveguide probe delayed by a defined phase delay. 1. A system , comprising:an array of guided surface waveguide probes configured to launch guided surface waves along a surface of a lossy conducting medium; andan array control system configured to control operation of guided surface waveguide probes in the array of guided surface waveguide probes via one or more feed networks to maintain a predefined field pattern produced by the guided surface waves.2. The system of claim 1 , wherein individual guided surface waveguide probes of the array comprise a charge terminal elevated over a lossy conducting medium configured to generate at least one resultant field that synthesizes a wave front incident at a complex Brewster angle of incidence (θ) of the lossy conducting medium.3. The system of claim 2 , wherein the charge terminal is one of a plurality of charge terminals.4. The system of claim 1 , wherein individual guided surface waveguide probes of the array comprise a feed network electrically coupled to a charge terminal claim 1 , the feed network providing a phase delay (Φ) that matches a wave ...

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Номер записи: 74
17-03-2016 дата публикации

SIMULTANEOUS MULTIFREQUENCY RECEIVE CIRCUITS

Номер: US20160079753A1
Автор: Corum James F., Corum Kenneth L., Lilly James D., Pinzone Joseph F.
Принадлежит:

Disclosed are various receive circuits by which to receive a plurality of guided surface waves transmitted by a plurality of guided surface waveguide probes over a surface of a terrestrial medium according to various embodiments. 1. An apparatus comprising:a plurality of guided surface waveguide receive structures, each of the plurality of guided surface waveguide receive structures being configured to receive energy in a form of at least one guided surface wave transmitted by at least one guided surface waveguide probe on a surface of a terrestrial medium;a plurality of impedance matching networks, each of the plurality of impedance matching networks being coupled to a corresponding one of the plurality of guided surface waveguide receive structures;a plurality of wave rectifiers, each of the plurality of wave rectifiers being coupled to a corresponding one of the plurality of impedance matching networks; andat least one voltage regulator coupled to a corresponding one of the plurality of wave rectifiers.2. The apparatus of claim 1 , wherein a plurality of outputs of the at least one voltage regulator are coupled in parallel.3. The apparatus of claim 1 , wherein a plurality of outputs of the at least one voltage regulator are coupled in series.4. The apparatus of claim 1 , wherein the at least one guided surface waveguide probe comprises a charge terminal elevated over the terrestrial medium configured to generate at least one resultant field that synthesizes a wave front incident at a complex Brewster angle of incidence (θ) of the terrestrial medium.5. The apparatus of claim 4 , wherein the charge terminal is one of a plurality of charge terminals.6. The apparatus of claim 1 , wherein each of the at least one guided surface waveguide probe comprises a feed network electrically coupled to a charge terminal claim 1 , the feed network providing a phase delay (Φ) that matches a wave tilt angle (Ψ) associated with a complex Brewster angle of incidence (θ) associated ...

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Номер записи: 75
17-03-2016 дата публикации

ADAPTATION OF POLYPHASE WAVEGUIDE PROBES

Номер: US20160079754A1
Автор: Corum James F., Corum Kenneth L.
Принадлежит:

Disclosed are various embodiments for transmitting energy conveyed in the form of a guided surface-waveguide mode along a lossy conducting medium such as, e.g., the surface of a terrestrial medium by exciting a polyphase waveguide probe. A probe control system can be used to adjust the polyphase waveguide probe based at least in part upon characteristics of the lossy conducting medium. 1. A method , comprising:exciting a first charge terminal and a second charge terminal of a polyphase waveguide probe with excitation voltages to synthesize a plurality of fields that substantially match a guided surface-waveguide mode of the lossy conducting medium to transmit energy along a surface of the lossy conducting medium via a radial surface current, the first charge terminal positioned at a defined height over the lossy conducting medium and the second charge terminal positioned below the first charge terminal by a defined distance;detecting a change in operating conditions associated with the polyphase waveguide probe; andin response to the detected change, adjusting the polyphase probe to improve the matching of the guided surface waveguide mode.2. The method of claim 1 , wherein detecting the change in operating conditions associated with the polyphase waveguide probe comprises detecting a change in an electric field strength associated with the radial surface current.3. The method of claim 2 , wherein the change in the electric field strength is detected by a field meter located beyond a defined radial distance from the polyphase waveguide probe claim 2 , the defined radial distance associated with a transition between a close-in radial surface current and a far-out radial surface current of the polyphase waveguide probe.4. The method of claim 1 , wherein detecting the change in operating conditions associated with the polyphase waveguide probe comprises detecting a change in conductivity of the lossy conducting medium.5. The method of claim 4 , wherein the change in ...

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Номер записи: 76
07-03-2019 дата публикации

MOBILE DEVICE

Номер: US20190075195A1
Автор: CHIU Pei-liang
Принадлежит:

A mobile device includes a case having an accommodating space, a system circuit board disposed in the accommodating space, a screen disposed on an inner surface of the case, a transparent antenna disposed at a non-display area on the inner surface of the case facing the screen, and a transmission line electrically connected to the transparent antenna. The transparent antenna and the transmission line are integrated into one piece. 1: A mobile device , comprising:a case having an accommodating space, wherein the case is made of a metal material or a light transparent material;a system circuit board disposed in the accommodating space;a screen disposed on an inner surface of the case;a transparent antenna disposed at a non-display area on the inner surface of the case;a transmission line electrically connected to the transparent antenna; anda connector electrically connected to the transmission line, and the connector configured to transmit signals to the transparent antenna and receive signals from the transparent antenna,wherein the transparent antenna and the transmission line are integrated into one piece.2: The mobile device according to claim 1 , wherein the transparent antenna is a monopole antenna or a dipole antenna.3: The mobile device according to claim 1 , wherein the transmission line is a co-planar transmission line.4. (canceled)5: A mobile device claim 1 , comprising:a case having an accommodating space, wherein the case is made of a metal material or a light transparent material;a system circuit board disposed in the accommodating space;a screen disposed on an inner surface of the case;a transparent antenna disposed on one surface opposite to the inner surface of the case facing the screen;a transmission line electrically connected to the transparent antenna; anda connector electrically connected to the transmission line, and the connector configured to transmit signals to the transparent antenna and receive signals from the transparent antenna,wherein ...

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Номер записи: 77
16-03-2017 дата публикации

GLOBAL ELECTRICAL POWER MULTIPLICATION

Номер: US20170077575A1
Автор: Corum James F., Corum Kenneth L.
Принадлежит:

Various examples are provided for global electrical power multiplication. In one example, a global power multiplier includes first and second guided surface waveguide probes separated by a distance equal to a quarter wavelength of a defined frequency and configured to launch synchronized guided surface waves along a surface of a lossy conducting medium at the defined frequency; and at least one excitation source configured to excite the first and second guided surface waveguide probes at the defined frequency, where the excitation of the second guided surface waveguide probe at the defined frequency is 90 degrees out of phase with respect to the excitation of the first guided surface waveguide probe. In another example, a method includes launching synchronized guided surface waves along a surface of a lossy conducting medium by exciting first and second guided surface waveguide probes to produce a traveling wave propagating along the surface. 1. A global power multiplier , comprising:first and second guided surface waveguide probes configured to launch synchronized guided surface waves along a surface of a lossy conducting medium at a defined frequency, the first and second guided surface waveguide probes separated by a distance equal to a quarter wavelength of the defined frequency; andat least one excitation source configured to excite the first and second guided surface waveguide probes at the defined frequency, where the excitation of the second guided surface waveguide probe at the defined frequency is 90 degrees out of phase with respect to the excitation of the first guided surface waveguide probe at the defined frequency.2. The global power multiplier of claim 1 , wherein the first and second guided surface waveguide probes comprise a charge terminal elevated over the lossy conducting medium configured to generate at least one resultant field that synthesizes a wave front incident at a complex Brewster angle of incidence (θ) of the lossy conducting medium.3. ...

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Номер записи: 78
24-03-2022 дата публикации

Josephson traveling wave parametric amplifier

Номер: US20220094320A1
Автор: HASSEL Juha, VESTERINEN Visa
Принадлежит:

According to an example aspect of the present invention, there is provided a travelling wave parametric amplifier comprising a waveguide transmission line comprising therein at least ten Josephson elements, wherein each of the at least ten Josephson element comprises a loop, with exactly one Josephson junction of first size on one half of the loop and at least two Josephson junctions of a second size on a second half of the loop, the second size being larger than the first size, a flux bias line configured to generate a magnetic flux threading each of the at least one loop, and a set of resistors coupled with the flux bias line. 1. A travelling wave parametric amplifier comprising:a coplanar waveguide transmission line comprising therein at least ten Josephson elements, wherein each of the at least ten Josephson elements comprises a loop, with exactly one Josephson junction of first size on one half of the loop and at least two Josephson junctions of a second size on a second half of the loop, the second size being larger than the first size;a flux bias line configured to generate a magnetic flux threading each of the at least one loop, comprising a two-port circuit taking a path ranging repeatedly from one side of the coplanar waveguide transmission line to the other, crossing over the coplanar waveguide transmission line at a place corresponding to a parallel-plate capacitor disposed on the coplanar waveguide transmission line, anda set of resistors coupling the flux bias line to the ground planes of the coplanar waveguide transmission line.2. The travelling wave parametric amplifier according to claim 1 , wherein each of the at least ten Josephson elements does not exhibit Kerr nonlinearity at claim 1 , or exhibits a negligible contribution of Kerr nonlinearity claim 1 , and wherein each of the at least ten Josephson elements does exhibit three-wave mixing.3. The travelling wave parametric amplifier according to claim 1 , wherein a ratio of a Josephson energy of ...

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Номер записи: 79
24-03-2016 дата публикации

Processes For Forming Waveguides Using LTCC Substrates

Номер: US20160087325A1
Автор: Mohd Zulfadli Mohamed Yusoff, Rosidah Alias, Sabrina Mohd Shapee
Принадлежит: Telekom Malaysia Berhad

The present invention describes processes for forming waveguides ( 200 ) using multiple co-planar layers of LTCC substrates ( 212, 212 a, 212 b ). Registration holes ( 222 ) on the substrates help align layering of the substrates. An array of circuit patterns are printed on each substrate, with each circuit being made up of conductor pattern ( 213 ) and/or via holes ( 224 ). Cavity alignment holes ( 226 ) formed around a periphery of each circuit allow alignment marks to be printed on the substrates for vision inspection. Similarly, circuit orientation holes ( 227 ) associated with each circuit allow orientation marks to be printed on the substrates to identify orientation of circuits in each finally formed waveguide. Substrate orientation holes ( 225 ) allow marks to be printed on one side of each substrate for alignment during screen printing. These in-process vision inspections and quality assurance tests allow product quality and process yields to improve.

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Номер записи: 80
23-03-2017 дата публикации

ANTENNA SYSTEM

Номер: US20170084985A1
Автор: JAN Cheng-Geng, KU Kuang-Yuan, Peng Huang-Tse
Принадлежит:

An antenna system includes a ground metal element, a first signal source, a first antenna, a second signal source, a second antenna, an isolation metal element, and a matching circuit. The first signal source is connected to the ground metal element. The first antenna is connected to the first signal source. The first signal source is configured to excite the first antenna. The second signal source is connected to the ground metal element. The second antenna is connected to the second signal source. The second signal source is configured to excite the second antenna. The isolation metal element is disposed between the first antenna and the second antenna, and is configured to improve the isolation between the first antenna and the second antenna. The matching circuit is connected between the isolation metal element and the ground metal element. 1. An antenna system , comprising:a ground metal element;a first signal source, connected to the ground metal element;a first antenna, connected to the first signal source, wherein the first signal source is configured to excite the first antenna;a second signal source, connected to the ground metal element;a second antenna, connected to the second signal source, wherein the second signal source is configured to excite the second antenna;an isolation metal element, disposed between the first antenna and the second antenna, and configured to improve isolation between the first antenna and the second antenna; anda matching circuit, connected between the isolation metal element and the ground metal element.2. The antenna system as claimed in claim 1 , wherein the isolation metal element has a connection end and an open end claim 1 , and the connection end of the isolation metal element is connected through the matching circuit to the ground metal element.3. The antenna system as claimed in claim 1 , wherein the isolation metal element is symmetrical with respect to a central line of the antenna system.4. The antenna system as ...

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Номер записи: 81
29-03-2018 дата публикации

RADIO FREQUENCY POWER SENSOR HAVING A NON-DIRECTIONAL COUPLER

Номер: US20180090809A1
Автор: Holt Timothy L.
Принадлежит:

Disclosed is a capacitive non-directional coupler having a non-directional coupler printed circuit board (PCB) and a capacitive attenuator The non-directional coupler PCB includes a coupler section configured to carry energy travelling on a main transmission line. The non-directional coupler PCB and the capacitive attenuator are configured as a capacitive voltage divider, and provide a sample of the energy on the main transmission line. Also disclosed is a method for measuring for measuring RF power using an RF power sensor having the capacitive non-directional coupler that includes with the non-directional coupler printed circuit board and the capacitive attenuator. Also disclosed is an RF power metering system that includes an RF power sensor having the capacitive non-directional coupler. 195.-. (canceled)96. A radio frequency (RF) power sensor comprising:a non-directional coupler and an analog processing circuit;said non-directional coupler is a capacitive non-directional coupler and comprised of a non-directional coupler printed circuit board (PCB) and a capacitive attenuator;said non-directional coupler PCB is comprised of a coupler section configured to carry energy travelling on a main transmission line;wherein said non-directional coupler PCB and said capacitive attenuator are configured as a capacitive voltage divider and provide a sample of the energy on said main transmission line.97. The RF power sensor as set forth in claim 96 , wherein said coupler section is a microstripline.98. The RF power sensor as set forth in claim 96 , wherein a front side of said non-directional coupler PCB is comprised of said coupler section claim 96 , a reverse side of said non-directional coupler PCB is comprised of a printed metallic structure claim 96 , and a di-electric material located between said coupler section and said printed metallic structure;at least a portion of said coupler section and said printed metallic structure overlap; andsaid coupler section and said ...

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Номер записи: 82
05-05-2022 дата публикации

SYSTEM AND METHOD FOR GENERATING ELECTRIC BASED NON-LINEAR WAVES IN NATURAL TERRESTRIAL ENVIRONMENTS

Номер: US20220140917A1
Автор: Van Neste Charles W.
Принадлежит:

A system for transmitting electrical signals through a terrestrial body, the terrestrial body having an upper surface, may include a transmitter. The transmitter may include a first electrode positioned proximate the upper surface of the terrestrial body and at least one second electrode positioned beneath the upper surface of the terrestrial body and spaced from the first electrode. The system may include a power source operable to supply power to the first electrode and the at least one second electrode. The system may include a receiver assembly spaced away from the transmitter. When power is supplied to the transmitter, the transmitter may be operable to propagate an electric non-linear wave signal through the terrestrial body. The receiver assembly may be operable to detect the electric non-linear wave signal.

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Номер записи: 83
21-03-2019 дата публикации

Simultaneous multifrequency receive circuits

Номер: US20190089154A1
Автор: James D. Lilly, James F. Corum, Joseph F. Pinzone, Kenneth L. Corum
Принадлежит: Cpg Technologies Llc

Disclosed are various receive circuits by which to receive a plurality of guided surface waves transmitted by a plurality of guided surface waveguide probes over a surface of a terrestrial medium according to various embodiments.

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Номер записи: 84
09-04-2015 дата публикации

60 ghz integrated circuit to printed circuit board transitions

Номер: US20150097633A1
Автор: Christopher Andrew Devries, Houssam Kanj, Huanhuan Gu, Morris Repeta
Принадлежит: BlackBerry Ltd

Embodiments are directed to a transition structure for interfacing an integrated circuit chip and a substrate, comprising: a co-planar waveguide (CPW) structure formed based on ground-signal-ground (GSG) pads on the integrated circuit chip, a grounded co-planar waveguide (CPWG) structure coupled to the GSG pads, and a microstrip coupled to the CPWG structure.

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Номер записи: 85
09-04-2015 дата публикации

Hearing assistance coplanar waveguide

Номер: US20150098599A1
Автор: Jay Rabel, Stephen Paul Flood
Принадлежит: Starkey Laboratories Inc

Disclosed herein, among other things, are methods and apparatuses that provide a manufacturable RF transmission line to go through the bend area of a flexible circuit to be used in a compact design, such as in a compact hearing aid design. One aspect of the present subject matter relates to using multiple inner layers of the flexible circuit to route RF transmission. By not using outer layers, the RF transmission line will be less susceptible to delamination from the polyimide dielectric layer. One aspect of the present subject matter relates to choosing copper transmission line to have dimensions that allow for narrower transmission lines with good RF return loss. The copper transmission line dimensions also allow for manufacturing in a standard process without adding extra cost.

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Номер записи: 86
30-03-2017 дата публикации

High-density stacked grounded coplanar waveguides

Номер: US20170093005A1
Автор: Mohammad Ali Tassoudji, Vladimir Aparin, Xiaoyin He, Yu-Chin Ou
Принадлежит: Qualcomm Inc

A pair of stacked ground coplanar waveguides (GCPWs) is provided in two consecutive metal layers that are deposited on opposing surfaces of a dielectric layer. A first metal layer on a first side of the dielectric layer forms a first signal trace and an upper ground plane for a first GCPW in the pair. Similarly, a second metal layer on a second surface of the dielectric layer forms a second signal trace and an upper ground plane for a second GCPW in the pair.

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Номер записи: 87
12-05-2022 дата публикации

SUPERCONDUCTING QUBIT MEMORY OF QUANTUM COMPUTER

Номер: US20220149501A1
Автор: Jang Taehwan, JEON Insu, KWON Hyeokshin, LEE Jaehyeong, Shin Jaeho
Принадлежит: SAMSUNG ELECTRONICS CO., LTD.

A qubit memory of a quantum computer is provided. The qubit memory according to an embodiment includes a first readout unit, a first transmon, and a first data storage unit storing quantum information, and the first data storage unit includes a first superconducting waveguide layer, an insulating layer, and a superconductor layer sequentially stacked on a substrate. In one example, the first superconducting waveguide layer may include a superconducting resonator. 1. A qubit memory of a quantum computer , the qubit memory comprising:a first readout unit;a first transmon; anda first data storage unit configured to store quantum information, a substrate; and', 'a first superconducting waveguide layer, an insulating layer, and a superconductor layer sequentially stacked on the substrate., 'wherein the first data storage unit comprises2. The qubit memory of claim 1 , wherein the first superconducting waveguide layer comprises a superconducting resonator.3. The qubit memory of claim 1 , wherein the first superconducting waveguide layer has a thickness in a range from about 50 nm to about 100 nm.4. The qubit memory of claim 1 , wherein the superconductor layer has a thickness in a range from about 50 nm to about 100 nm.5. The qubit memory of claim 1 , wherein the insulating layer continuously extends onto the superconductor layer and covers an entire upper surface of the superconductor layer.6. The qubit memory of claim 5 ,wherein the first superconducting waveguide layer, the insulating layer, and the superconductor layer constitute a first stack structure of a plurality of stack structures, andwherein the plurality of stack structures are sequentially stacked on the substrate.7. The qubit memory of claim 6 , wherein each of the plurality of stack structures comprises a respective first superconducting waveguide layer claim 6 , a respective insulating layer claim 6 , and a respective superconductor layer.8. The qubit memory of claim 7 , wherein some stack structures from ...

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Номер записи: 88
12-05-2022 дата публикации

Slot antenna assembly with tapered feedlines and shaped aperture

Номер: US20220149529A1
Автор: Christopher K. Cheung, Christopher R. Stroili, Gregory J. Wunsch
Принадлежит: BAE Systems Information and Electronic Systems Integration Inc

A slot antenna includes a substrate having a first side and a second side, a first conductive layer on the first side of the substrate, and a second conductive layer on the second side of the substrate. A first aperture is in the first conductive layer, a second aperture is in the first conductive layer, a first slotline is in the first conductive layer and in communication with the first aperture, and a second slotline is in the first conductive layer and in communication with the second aperture. A third aperture can be in the second conductive layer. A plurality of vias can be in the substrate and surrounding at least a portion of a region including the first aperture, the second aperture, the first slotline, and the second slotline, each of the vias extending through the substrate from the first conductive layer to the second conductive layer.

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Номер записи: 89
19-04-2018 дата публикации

Field Strength Monitoring for Optimal Performance

Номер: US20180106845A1
Автор: Corum James F., Corum Kenneth L., Lilly James D., Pinzone Joseph F.
Принадлежит:

Disclosed are various embodiments for adjusting an operational parameter of a guided surface waveguide probe according to measurements received from one or more measuring devices. A measuring device measures the conditions associated with an environment of the measuring device. The measuring devices communicates the measured data to the guided surface waveguide probe. Adjustments can be made to one or more operational parameters of the guided surface waveguide probe according to the measured data. 1. A system , comprising:a probe control system coupled to a guided surface waveguide probe, the probe control system being configured to adjust an operational parameter of the guided surface waveguide probe, and the guided surface waveguide probe being configured to launch a guided surface wave over a lossy conducting medium; anda measurement device in data communication with the probe control system, the measurement device being configured to communicate measured data associated with an electromagnetic field generated by the guided surface waveguide probe to the probe control system.2. The system of claim 1 , wherein the measurement device comprises a mobile device.3. The system of claim 1 , wherein the measurement device is stationary such that a location of the measurement device is the same for repeated field strength measurements.4. The system of claim 1 , wherein the measurement device comprises a field meter claim 1 , a conductivity measurement probe claim 1 , a permittivity sensor claim 1 , a ground parameter meter claim 1 , or a load receiver.5. The system of claim 1 , wherein the measurement device comprises a primary measurement device claim 1 , the primary measurement device being further configured to:receive a plurality of measurements from a plurality of secondary measurement devices positioned at a plurality of different locations; andcreating a measurement array including the plurality of measurements, the measured data including the measurement array.6. ...

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Номер записи: 90
21-04-2016 дата публикации

Transmission of signals via a high-frequency waveguide

Номер: US20160111766A1
Автор: Kenji Komori, Sho Ohashi, Takahiro Takeda, Yasuhiro Okada
Принадлежит: Sony Corp

Provided is a signal transmission device including a high-frequency signal waveguide that transmits a high-frequency signal emitted from an electronic device. When the electronic device is arranged close to the high-frequency signal waveguide, the high-frequency signal is transmitted via the high-frequency signal waveguide.

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Номер записи: 91
19-04-2018 дата публикации

Radio Frequency Device

Номер: US20180108965A1
Автор: Chiu Jui-Chieh, Huang Chih-Wen
Принадлежит:

A radio frequency (RF) device includes a chip comprising a plurality of vias and at least a hot via; a signal lead and a ground lead disposed under a back side of the chip; and a signal metal sheet, a first ground metal sheet and a second ground metal sheet disposed on a top side of the chip. The signal metal sheet crosses over the first gap formed between the signal lead and the ground lead. The first ground metal sheet and the second ground metal sheet are coupled to the ground lead through the plurality of vias. The first ground metal sheet and the second ground metal sheet substantially surround the signal metal sheet. 1. A radio frequency (RF) device , comprising:a chip, comprising a plurality of vias and at least a hot via;a signal lead, disposed under a back side of the chip;a ground lead, disposed under the back side of the chip, and substantially surrounding the signal lead, wherein a first gap is formed between the signal lead and the ground lead along with a first direction, and a second gap is formed between the signal lead and the ground lead along with a second direction;a signal metal sheet, disposed on a top side of the chip, and coupled to the signal lead through the at least a hot via, wherein the signal metal sheet crosses over the first gap formed between the signal lead and the ground lead;a first ground metal sheet, disposed on the top side of the chip; anda second ground metal sheet, disposed on the top side of the chip;wherein the first ground metal sheet and the second ground metal sheet are coupled to the ground lead through the plurality of vias, and the first ground metal sheet and the second ground metal sheet substantially surround the signal metal sheet.2. The RF device of claim 1 , wherein the first gap or the second gap is larger than 50 micrometer (μm).3. The RF device of claim 1 , wherein the first gap or the second gap is 300 μm.4. The RF device of claim 1 , wherein a third gap is formed between the signal metal sheet and the ...

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Номер записи: 92
10-07-2014 дата публикации

ELECTROMAGNETIC WAVE PROPAGATION SHEET AND DISPLAY SHELF IMPLEMENTING ELECTROMAGNETIC WAVE PROPAGATION SHEET

Номер: US20140191828A1
Автор: Nakase Koichiro, Tsukagoshi Tsuneo
Принадлежит: NEC Corporation

Provided is an electromagnetic wave propagation sheet constituted by a mesh-shaped conductor layer, a planar conductor layer, and an inductor layer sandwiched therebetween, wherein the mesh-shaped conductor layer and the planar conductor layer are electrically connected to each other in an end section of the electromagnetic wave propagation sheet by a short conductor, and a mesh-shaped conductor that constitutes the mesh-shaped conductor layer has a meander shape in the vicinity of the electromagnetic wave propagation sheet end section. 1. An electromagnetic wave propagation sheet comprising:a mesh-shaped conductor layer;a planar conductor layer; andan inductor layer sandwiched therebetween,wherein the mesh-shaped conductor layer and the planar conductor layer are electrically connected to each other in an end section of the electromagnetic wave propagation sheet by a short conductor, and a mesh-shaped conductor that constitutes the mesh-shaped conductor layer has a meander shape in the vicinity of the electromagnetic wave propagation sheet end section.2. An electromagnetic wave propagation sheet comprising:a mesh-shaped conductor layer;a planar conductor layer; anda dielectric layer sandwiched therebetween,wherein the mesh-shaped conductor layer and the planar conductor layer are electrically connected to each other in an end section of the electromagnetic wave propagation sheet by a short conductor, and a mesh-shaped conductor that constitutes the mesh-shaped conductor layer has a spiral shape in the vicinity of the electromagnetic wave propagation sheet end section.3. An electromagnetic wave propagation sheet comprising: a planar conductor layer; and', 'a dielectric layer sandwiched therebetween,', 'wherein the mesh-shaped conductor layer and the planar conductor layer are electrically connected to each other in an end section of the electromagnetic wave propagation sheet by a short conductor, and a mesh-shaped conductor that constitutes the mesh-shaped conductor ...

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Номер записи: 93
19-04-2018 дата публикации

MULTI-WIDTH WAVEGUIDES

Номер: US20180110130A1
Автор: Ghassemi Nasser, Tournier Hugues
Принадлежит: Ciena Corporation

A waveguide. The waveguide may include a first waveguide region that includes a signal trace with a first width. The waveguide may further include a second waveguide region that includes the signal trace with a second width. The first width may be different from the second width. The signal trace may be configured to transmit an electrical signal. The signal trace with the second width may be configured to couple with an integrated circuit. 113.-. (canceled)14. A method of manufacturing , comprising:disposing a signal trace on a first substrate and a second substrate, the signal trace having a first width above the first substrate and a second width above the second substrate, wherein the first width is different from the second width; andforming a first ground plane underneath the first substrate and opposite the signal trace for a first waveguide region; andforming a second ground plane underneath the second substrate and opposite the signal trace for a second waveguide region, andwherein the signal trace is configured to transmit an electrical signal through the first waveguide region and the second waveguide region.15. The method of claim 14 , further comprising:coupling an integrated circuit to the signal trace with the second width.16. The method of claim 15 ,wherein the integrated circuit is coupled to the signal trace with the second width using a ball grid array having a plurality of solder pads,wherein the plurality of solder pads comprises a predetermined pitch size between a respective pair of the plurality of solder pads, andwherein the signal trace with the second width substantially aligns with the predetermined pitch size.17. The method of claim 14 , further comprising:disposing a third ground plane on the first substrate and the second substrate.18. The method of claim 17 , further comprising:forming a via connecting the third ground plane, the second ground plane, and the first ground plane.19. The method of claim 17 ,wherein the third ground plane ...

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Номер записи: 94
20-04-2017 дата публикации

3d-microstrip branchline coupler

Номер: US20170110778A1
Автор: B M Farid Rahman, Barbara S. DEWITT, Essam Mina, Guoan Wang
Принадлежит: International Business Machines Corp

The disclosure is directed to semiconductor structures and, more particularly, to a three dimensional microstrip branchline coupler and methods of manufacture. The structure includes a plurality of through silicon vias and conductive lines electrically connected to a first end and a second end of respective ones of the plurality of through silicon vias. A first through silicon via of the plurality of through silicon vias forms a first port of a three dimensional (3D) branchline coupler. A second through silicon via of the plurality of through silicon vias forms a second port of the 3D branchline coupler. A third through silicon via of the plurality of through silicon vias forms a third port of the 3D branchline coupler. A fourth through silicon via of the plurality of through silicon vias forms a fourth port of the 3D branchline coupler.

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Номер записи: 95
02-04-2020 дата публикации

REDUCED KAPITZA RESISTANCE MICROWAVE FILTER FOR CRYOGENIC ENVIRONMENTS

Номер: US20200106149A1
Автор: GUMANN PATRYK, Olivadese Salvatore Bernardo
Принадлежит:

An architecture for, and techniques for fabricating, a thermal decoupling device are provided. In some embodiments, thermal decoupling device can be included in a thermally decoupled cryogenic microwave filter. In some embodiments, the thermal decoupling device can comprise a dielectric material and a conductive line. The dielectric material can comprise a first channel that is separated from a second channel by a wall of the dielectric material. The conductive line can comprise a first segment and a second segment that are separated by the wall. The wall can facilitate propagation of a microwave signal between the first segment and the second segment and can reduce heat flow between the first segment and the second segment of the conductive line. 1. A thermal decoupling device , comprising:a dielectric material comprising a first channel that is separated from a second channel by a wall of the dielectric material; anda conductive line comprising a first segment and a second segment that are separated by the wall, wherein the wall facilitates propagation of a microwave signal between the first segment and the second segment and reduces heat flow between the first segment and the second segment of the conductive line.2. The thermal decoupling device of claim 1 , wherein the wall has dimensions determined to propagate the microwave signal based on the microwave signal having a frequency above about 1 gigahertz (GHz).3. The thermal decoupling device of claim 1 , wherein the first segment and the second segment extend in directions substantially parallel.4. The thermal decoupling device of claim 1 , wherein the first segment exhibits a first mean temperature that is higher than a second mean temperature of the second segment.5. The thermal decoupling device of claim 1 , wherein the dielectric material is selected to have a thermal conductivity that is above 200 watts per meter-Kelvin (W/m-K) at a temperature of 77 degrees Kelvin (K).6. The thermal decoupling device of ...

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Номер записи: 96
28-04-2016 дата публикации

PACKAGED INTEGRATED CIRCUIT WAVEGUIDE INTERFACE AND METHODS THEREOF

Номер: US20160118705A1
Автор: Tang Jinbang, Tracht Neil T.
Принадлежит: Freescale Semiconductor, Inc.

The embodiments described herein provide for the formation of circuit waveguide interfaces during a wafer-scale die packaging (WSDP) process. Specifically, during the packaging process singulated die are arranged on a wafer-like panel and covered with molding compound that will provide the bodies of the packages. A circuit waveguide interface is formed in the molding compound and subsequent metallization layers. This circuit waveguide interface can include an array of first conductors arranged in the molding compound, and a reflector interface and excitation element formed during metallization. 1. A semiconductor device comprising:a semiconductor die including an integrated circuit, the semiconductor die having a first side and a second side;a molding compound that covers the semiconductor die, the molding compound having a first side and a second side, the molding compound first side corresponding to the semiconductor die first side, and the molding compound second side corresponding to the semiconductor die second side; anda first array of conductors, the first array of conductors extending from the molding compound first side to the molding compound second side, the first array of conductors arranged in the molding compound to define a first waveguide interface perimeter surrounding a first waveguide interface interior.2. The semiconductor device of further comprising:a reflector interface formed at the molding compound first side, the reflector interface substantially extending around and overlapping the first waveguide interface perimeter; andan excitation element formed at the molding compound first side, the excitation element coupled to the semiconductor die and extending past the first waveguide interface perimeter into the first waveguide interface interior.3. The semiconductor device of further comprising a conductive layer formed at the molding compound second side.4. The semiconductor device of further comprising:a circuit board having a first side and ...

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Номер записи: 97
26-04-2018 дата публикации

VEHICLE ANTENNA AND WINDOW GLASS

Номер: US20180115048A1
Автор: KAGAYA Osamu
Принадлежит: Asahi Glass Company, Limited

A vehicle antenna includes a coplanar wave guide including a planar dielectric body, a signal conductor arranged on the dielectric body, and a pair of ground conductors that hold both sides of the signal conductor via slots; a ground plane provided on an opposite side of the dielectric body from the signal conductor and the ground conductors; and an inverted-F antenna including a power feeding unit coupled to the signal conductor, a shorting unit coupled to one of the ground conductors, and a radiation unit coupled to an end portion of the power feeding unit and coupled to an end portion of the shorting unit, the radiation unit extending in a prescribed extension direction. The radiation unit is positioned on the ground plane side with respect to the dielectric body. 1. A vehicle antenna , comprising:a coplanar wave guide including a planar dielectric body, a signal conductor arranged on the dielectric body, and a pair of ground conductors that hold both sides of the signal conductor via slots;a ground plane provided on an opposite side of the dielectric body from the signal conductor and the ground conductors; andan inverted-F antenna including a power feeding unit coupled to the signal conductor, a shorting unit coupled to one of the ground conductors, and a radiation unit coupled to an end portion of the power feeding unit and coupled to an end portion of the shorting unit, the radiation unit extending in a prescribed extension direction,wherein the radiation unit is positioned on the ground plane side with respect to the dielectric body.2. The vehicle antenna according to claim 1 ,wherein a length of the radiation unit in a direction that the radiation unit extends is less than or equal to a length of the ground plane in the direction that the radiation unit extends.3. The vehicle antenna according to claim 1 ,wherein the radiation unit faces the ground plane.4. The vehicle antenna according to claim 2 ,wherein the radiation unit faces the ground plane.5. The ...

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Номер записи: 98
03-05-2018 дата публикации

WAVEGUIDE-TYPE OPTICAL ELEMENT

Номер: US20180120666A1
Автор: Ichikawa Junichiro, KATAOKA Toshio, Kondou Katsutoshi
Принадлежит:

In a waveguide-type optical element, broaderband operation becomes possible. 113-. (canceled)14. A waveguide-type optical element comprising:an optical waveguide formed on a substrate having an electro-optic effect; anda control electrode for controlling an optical wave that is transmitted through the optical waveguide,wherein the control electrode comprises a central electrode and ground electrodes, the central electrode being formed along the optical waveguide, and the ground electrodes being formed so as to put the central electrode therebetween in a surface direction of the substrate at a predetermined distance from the central electrode conductor,wherein the central electrode or the ground electrodes have multiple pairs of facets, each comprising two facets facing each other, along a transmission direction of high-frequency signals that are transmitted through the central electrode and the ground electrodes, andwherein the pair of facets is configured to establish a resonance point in high-frequency transmission characteristics of a distributed constant circuit including the central electrode and the ground electrodes by adding a capacitance component to the circuit.15. The waveguide-type optical element according to claim 14 ,wherein the multiple pairs of facets are formed periodically at predetermined intervals along the transmission direction of the high-frequency signals.16. The waveguide-type optical element according to claim 14 ,wherein the ground electrode has a front portion that extends toward the central electrode along a longitudinal direction of the central electrode, the front portion being thinner than other portions, andwherein the multiple pairs of facets are formed in portions other than the facing portion having a thinner thickness.17. The waveguide-type optical element according to claim 15 ,wherein the ground electrode has a front portion that extends toward the central electrode along a longitudinal direction of the central electrode, the ...

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Номер записи: 99
05-05-2016 дата публикации

INTEGRATED MULTI-BAND BANDPASS FILTERS BASED ON DIELECTRIC RESONATORS FOR MOBILE AND OTHER COMMUNICATION DEVICES AND APPLICATIONS

Номер: US20160126622A1
Автор: Cheng Dajun, Zhang Hongwei
Принадлежит:

Multi-band radio frequency communication is performed using an integrated multi-band bandpass filter implemented based on ring resonators, such as concentric dielectric ring resonators. By constructing the multi-band bandpass filter using concentric ring configurations, the print circuit board (PCB) real estate requirement of multiple filters operating at multiple frequency bands is significantly reduced. Various configurations of the multi-band bandpass filter based on the concentric ring resonators provide flexibility in the layout design and manufacturing of multi-band radios for mobile devices, such as compact smartphones. These configurations of the concentric ring resonators can include but are not limited: a slot-coupling configuration, a direct-coupling configuration, and an embedded direct-coupling configuration. 1. An integrated multi-band bandpass filter , comprising:a transmission line structure for transmitting and receiving multi-band RF signals; anda plurality of ring resonators of different sizes and different resonant frequencies electromagnetically coupled to the transmission line structure to receive the multi-band RF signals, wherein each of the plurality of ring resonators is configured as a bandpass filter for generating a passband signal having a central frequency corresponding to the associated resonant frequency of the ring resonator.2. The integrated multi-band bandpass filter of claim 1 , wherein the transmission line structure includes:a first conductive layer having a signal trace for transmitting and receiving the multi-band RF signals;a second conductive layer configured as a ground plane; anda dielectric substrate positioned between the first conductive layer and the second conductive layer.3. The integrated multi-band bandpass filter of claim 1 , wherein each of the plurality of ring resonators is a dielectric ring resonator.4. The integrated multi-band bandpass filter of claim 1 , wherein the plurality of ring resonators are ...

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Номер записи: 100