Anerdnung von Sehaltungseinheiten

Inner Conductor Support for Screened Microwave Strip-Line.

... 1,188,727. Strip-line impedances. TELEFUNKEN PATENTVERWERTUNGS G.m.b.H. 3 July, 1968 [6 July, 1967], No. 31696/68. Heading H1W. The central conductor 5 of a tri-plate stripline 5, 6 is located by means of a dielectric screw 3 and spacing sleeve 1, the head 10 of the screw, or a dielectric washer 2 underneath it, being shaped so as to partially fill an aperture 4 in the central conductor 5. It is stated that the dimensions of the aperture 4 are selected so that the longitudinal inductive reactance presented by the aperture compenrates the transverse capacitative reactance presented by the screw. The screw bears a metallic nut 8.

Flat bracket and electronic device

Stripline

Ground planes 2, 4 surrounding a plurality of conductors 3, buried in a dielectric 1 have separating grooves 5 provided between adjacent lines 3 such that the ground planes are electrically connected and thus reducing cross talk between the lines. ...

MICROWAVE CIRCUIT WITH COAXIAL PACKAGE SEMICONDUCTOR DEVICE

... 1,240,416. Microwave assemblies. RCA CORPORATION. 17 Dec., 1969 [24 Dec., 1968], No. 61457/69. Headings H1K and H1R. A microwave electronic circuit comprises a metal plate 2 having microwave transmission lines consisting of thin metal sheets 8, 14 and dielectric sheets 6, 12 laminated together and secured to opposed surfaces 2, 10 of the metal plate, means in said plate for mounting a coaxial package device, e.g. transistor therein, said means comprising connected coaxial apertures 30 and 28 with the latter containing a cylindrical ceramic washer 32 having both good dielectric and heat-conducting properties and a central opening to receive the transistor 16, said transmission lines positioned to make contact with the terminals 18, 26 at either end of said device. The ceramic washer may be made of materials such as beryllium oxide or boron nitride.

Film carrier signal transmission line

Improvements in or relating to high frequency transmission lines

... 948,856. Strip transmission lines. SANDERS ASSOCIATES Inc. Feb. 28, 1962 [Feb. 28, 1961], No. 7854/62. Heading H1W. [Also in Division H3] A high-frequency strip transmission line comprises a pair of planar outer conductors 28, 30, at least three conductor strips 21, 22, 23, 24 disposed between the outer conductors, and insulating means 32 spacing the strips closely apart so that the strips are isolated from each other at low frequency and are closely coupled together at the operating frequency of the line. The outer conductors may be connected together by conductive pins spaced less than half a wavelength apart, e.g. one-eighth wavelength to suppress a parallel plate mode of transmission. A gap 34 may be provided in the inner conductors to accommodate, e.g. a transistor in a housing 38, having a base lead 40 and collector lead 42, the inner conducting strips being used for the bias and power supplies. The inner conductors themselves may form a second transmission line capable of conducting ...

ELECTRICAL INTERCONNECTION MEANS AND METHOD OF FABRICATION THEREOF

... 1,212,626. Printed circuit assemblies. BUNKER-RAMO CORP. 16 Oct., 1968 [6 Nov., 1967], No. 48957/68. Heading H1R. A structure for inter-connecting microminiaturized high-speed electronic circuits includes an electrically conducting plate having an elongated channel formed therein in which an elongated conductor is disposed supported by and electrically insulated from the plate by dielectric material. A conductive plate 82 of copper or aluminium is provided with elongated troughs 84 in its top surface by photo-etching to a depth greater than half the plate thickness to define an endless channel after which the troughs are filled with dielectric material 86. Troughs 90 are now formed in the bottom surface of the plate in a similar manner and have the shape shown in Fig. 5 (d). Three forms of elongated conductors 72, 74 and 78A are thus formed when the troughs 90 are filled with dielectric material, Fig. 5 (e). In order to obtain conductor 78 in the form shown in Fig. 5 (f ) both surfaces ...

Improvements in or relating to transmission lines

... 856,889. Printed strip transmission lines. MARCONI'S WIRELESS TELEGRAPH CO. Ltd. Feb. 19, 1959 [June 11, 1958], No. 18731/58. Class 40(8). A transmission line comprises three parallel conductors 1, 2, 2 printed on the same side of an insulating support 3. The outer conductors may be grounded and are at least three times the width of the central strip. The width of the gaps between the conductors determines the characteristic impedance of the line and is of the order of 1 / 1000th. of the working wavelength. Connection to the line may be made through a bolt inserted through the aperture 4. The line is shown terminated by a printed inductor 5.

MULTILEVEL STRIP LINE RADIO FREQUENCY CIRCUITS AND PROCEDURES FOR THE INTERMEDIATE CONNECTION

CIRCUIT MODULE

SPREIZDUBEL

PRINTED CIRCUIT BOARD ARRANGEMENT WITH SCREEN LATTICES AND MANUFACTURING PROCESSES

STRIP TRANSMISSION LINE STRUCTURES

RESONANCE SUPPRESSION IN INTERDIGITAL CAPACITORS USEFUL AS DC BIAS BREAKS IN DIODE OSCILLATOR CIRCUITS

METHOD AND STRUCTURE FOR HIGH POWER HTS TRANSMISSION LINES USING STRIPS SEPARATED BY A GAP

Microstrip/stripline transmission lines have a plurality of strips on a substrate where strips are separated by a gap. This arrangement results in a reduced maximum current density compared to previous transmission lines with the same power handling capability. The strips can have the same width or different widths. The gaps can have the same width or different widths. The transmission lines can be used in filters and resonators and can be made of high temperature superconductive materials.

STRIPLINE SHIELDING TECHNIQUES IN LOW TEMPERATURE CO-FIRED CERAMIC

STRIPLINE SHIELDING TECHNIQUES IN LOW TEMPERATURE CO-FIRED CERAMIC Stripline shielding structures for stripline conductors implemented in unitized multilayer circuit structures are disclosed. The stripline structures generally include a lower ground plane below the stripline conductor, one or more embedded ground planes above the stripline conductor, and conductive elements laterally spaced from the stripline conductor for electrically connecting the ground planes. Resistive layers may be included above the embedded ground plane(s) for additional shielding.

Dispositif de couplage haute fréquence

Mikrowellenübertragungsleitung

Hochfrequenz-Übertragungsleitung

Bandförmige Energieübertragungseinrichtung mit Bandpasseigenschaften

Ligne de transmission à ondes ultra-courtes

Ligne de transmission d'ondes ultra-courtes

Breitband-Dämpfungsvorrichtung für Hochfrequenz-Übertragungsleitungen

Resin multilayer base plate and electronic equipment

The utility model relates to a resin multilayer base plate and electronic equipment, the utility model discloses a characterized in that of flat cable (101), range upon range of have a plurality of resin layers (11-15) that have the compliance, possesses line conductor (23A) and earthing conductor (21A, 25A, 25B), including earthing conductor (21A, 25A, relative and three printed line way (the 106A that constitute in the two sides of an arbitrary and gate conductor (23A) 25B), 106C), and earthing conductor (21A, 25A, a facial features of the arbitrary and gate conductor (23A) 25B) to and the microstripline (106B) that constitutes, three printed line way (the 106A of width ratio of the line conductor (23A) on the microstripline (106B), the width of the line conductor (23A) 106C) will be extended, carry out the bending with this flat cable (101) on the position that is provided with microstripline (106B).

Electronic equipment

高频低损失电极

... 本发明提供了一种高频低损失电极，它包含主导体和沿主导体的侧面形成的至少一个分导体。至少一个分导体的宽度具有多层结构，其中薄膜导体和薄膜电介质交替层叠。 ...

System of high frequency transmission and in particular device of coupling

Systems of high frequency transmission and in particular device of coupling

Systems of high frequency transmission and in particular device of coupling

Systems of high frequency transmission and in particular device of coupling

Line of transmission to parallel plates

Line of high frequency transmission

COMPACT ELEMENT AERIAL HAS WEAK LOSSES

L'élément rayonnant compact à faibles pertes comporte au moins un résonateur (10) monté sur un plan de masse rayonnant et au moins une ligne d'alimentation triplaque (1) comportant, en épaisseur, une piste métallique interne (2) comprise entre deux substrats diélectriques (3 4), chaque substrat ayant une face externe métallisée, la piste métallique (2) ayant une longueur s'étendant entre une première et une deuxième extrémités (7, 8) de la ligne triplaque (1), caractérisé en ce que : - la ligne triplaque (1) est montée orthogonalement par rapport au plan de masse rayonnant du résonateur (10) et en ce qu'il comprend en outre, - au moins une première (5) et une deuxième (6) rangées de trous métallisés traversant l'épaisseur des deux substrats de la ligne triplaque (1), les deux rangées de trous métallisés (5, 6) étant disposées de part et d'autre de la piste métallique (2) sur toute la longueur de ladite piste (2). The compact low-loss radiating element comprises at least one resonator (10) mounted on a radiant ground plane and at least one triplate feed line (1) having, in thickness, an inner metal track (2) lying between two dielectric substrates (34), each substrate having a metallized outer face, the metal track (2) having a length extending between first and second ends (7, 8) of the stripline line (1), characterized in that that: the triplate line (1) is mounted orthogonally with respect to the radiating ground plane of the resonator (10) and in that it further comprises at least a first (5) and a second (6) row of metallised holes traversing the thickness of the two substrates of the strip line (1), the two rows of metallized holes (5, 6) being arranged on either side of the metal strip (2) along the entire length of said strip (2).

Stripline microwave circuit for direct satellite broadcast receiver - comprises thin substrate carrying SHF and UHF circuits on same face, with ground plane on lower face

The thin substrate carries microstrip SHF and UHF circuits on the same face. A ground plane is carried on its lower face against which is a thicker substrate with a ground plane on its lower face. Rivets ensure mechanical and electrical connection of circuit layers. The SHF circuits comprise sections of high impedance line in thin strips which permits provision of inductive reactances of high value. Metallisation with large dimensions provide decoupling capacities while wide metallic strips provide high impedances for resonant circuits. Small dimension areas (34) allow transistors to be connected. The UHF circuits have similar metallic strips for high and low impedances. Metallic strips on the lower face of the thick substrate permit power distribution to the circuits.

CATHETER-CANULE SAMENSTEL

HIGH-FREQUENCY SIGNAL LINE AND ELECTRONIC DEVICE EQUIPPED WITH SAME

The purpose of the present invention is to provide a high-frequency signal line that is capable of preventing breakage of interlayer connection conductors and an electronic device that is equipped with the high-frequency signal line. A signal line (20) extends along line sections (12a-12e). A reference ground conductor (22) is provided inside a dielectric element assembly (12) more to the positive side of a Z-axis direction than the signal line (20) so as to face the signal line (20). An auxiliary ground conductor (24) is provided inside the dielectric element assembly (12) more to the negative side of the Z-axis direction than the signal line (20) so as to face the signal line (20). Via-hole conductors (B1-B4) connect the reference ground conductor (22) with the auxiliary ground conductor (24). In a plan view of line section (12b) from the z-axis direction, the via-hole conductors (B1-B4) are not provided more to the negative side of the x-direction than the signal line (20).

HIGH-FREQUENCY TRANSMISSION LINE

Provided is a narrow and thin high-frequency transmission line which transmits each of a plurality of high-frequency signals with low loss while comprising a plurality of high-frequency signal lines which respectively transmit the plurality of high-frequency signals with different signal strengths. A first signal line is not prone to incur crosstalk with a second signal line, by being positioned closer than the second signal line to a second ground conductor. With a plurality of first aperture parts being disposed in the second ground conductor, the high-frequency transmission line reduces capacitive coupling between the first signal line and the second ground conductor. As a result, a transmission line including the first signal line offsets an increased capacitance from an increased line width of the first signal line with a reduction in the capacitance from the distance to the first ground conductor and the plurality of first aperture parts. Moreover, it is unnecessary for the high-frequency ...

Low loss and low cross talk transmission lines using shaped vias

Embodiments of the invention include a packaged device with transmission lines that have an extended thickness, and methods of making such device. According to an embodiment, the packaged device may include a first dielectric layer and a first transmission line formed over the first dielectric layer. Embodiments may then include a second dielectric layer formed over the transmission line and the first dielectric layer. According to an embodiment, a first line via may be formed through the second dielectric layer and electrically coupled to the first transmission line. In some embodiments, the first line via extends substantially along the length of the first transmission line.

Signal transmission structure

A signal transmission structure including a signal line, a first reference plane with a first opening, and a second reference plane with a second opening is provided. The first reference plane is disposed beside the signal line, and a portion of the signal line passes through a position of the first opening. In addition, the second reference plane is disposed beside the first reference plane, and the second opening is in a position corresponding to the position of the first opening, while the outline of the second opening projected onto the first reference plane does not overlap with the position of the first opening. Therefore, at high frequency-transmission, the above structure can reduce the insertion loss resulted from impedance mismatch as the signal passes through the opening, and reduce the resonance induced by the coupling between two reference planes to enhance the quality of signal transmission.

Semi-rigid cable designed for the transmission of microwaves

A semi-rigid cable for the transmission of microwaves, such as those used for radar or for digital television. This cable has a symmetrical strip line with a dielectric having an almost rectangular section, with a width close to the thickness of the dielectric and external conductive strips with a width that is substantially greater than that of the central conductor. This symmetrical strip line is advantageously surrounded by an absorbent sheath. The entire unit is protected by an ordinary metallic shielding and by a standard external mechanical protective sheath.

Printed lumped element stripline circuit ground-signal-ground structure

A novel circuit packaging structure including a combination of printed lumped elements within a multi-layer stripline architecture is provided and methods of making the same. The lumped elements are provided by printing the individual passive elements, including interdigital capacitors and spiral inductors, onto the supporting substrate and then embedding these elements into the multi-layer stripline structure. The stripline structure consists of a signal layer sandwiched between at least two ground layers separated by two dielectric substrates of equal thickness. This ground-signal-ground approach confines the electromagnetic fields within the multi-layer structure, thereby minimizing radiation from coupling to nearby components. This approach offers a unique combination of stripline technology and printed lumped elements resulting in miniaturized radio frequency and microwave circuits at operating at frequencies well below 1 GHz, up to several GHz.

FLAT CABLE

A flat cable includes a base material including a signal conductor extending in a first direction, a first ground conductor, and a second ground conductor. The second ground conductor includes elongated conductors extending in the first direction, and bridge conductors that connect the elongated conductors at predetermined spacings along the first direction. The second ground conductor is connected with via-hole conductors at predetermined positions in two mutually opposite directions along the first direction with respect to each of the bridge conductors. Countercurrents generated from a plurality of countercurrent generation points do not flow to the first ground conductor via a common via-hole but flow to the first ground conductor individually via separate via-hole conductors.

RESIN MULTILAYER SUBSTRATE AND ELECTRONIC APPARATUS

A flat cable includes a plurality of resin layers that are flexible and stacked together, a line conductor, and grounding conductors. The flat cable includes a triplate line in which both surfaces of the line conductor oppose the corresponding grounding conductors, and a microstrip line in which only one of the surfaces of the line conductor opposes the corresponding grounding conductor. A width of the line conductor in the microstrip line is greater than a width of the line conductor in the triplate line, and the flat cable is bent at a position where the microstrip line is provided. 1. A resin multilayer substrate comprising:a plurality of resin layers that are flexible and stacked on top of each other;a line conductor stacked on one of the plurality of resin layers; anda pair of grounding conductors, each of which is stacked on one of the plurality of resin layers at a position different from a position of the line conductor in a direction in which the plurality of resin layers are stacked; whereinthe resin multilayer substrate includes a triplate line in which both surfaces of the line conductor oppose the corresponding grounding conductors, and a microstrip line which is connected to the triplate line and in which only one of the surfaces of the line conductor opposes the corresponding grounding conductor;a width of the line conductor in the microstrip line is greater than a width of the line conductor in the triplate line; andthe resin multilayer substrate is bent at a position where the microstrip line is provided.2. The resin multilayer substrate according to claim 1 , wherein the microstrip line includes:a first microstrip line in which one of the grounding conductors included in the triplate line opposes the line conductor; anda second microstrip line in which the other one of the grounding conductors included in the triplate line opposes the line conductor.3. The resin multilayer substrate according to claim 1 , wherein a reduced thickness portion is ...

Laminated flat cable and method for producing same

A laminated flat cable includes a laminate, a signal line for high-frequency signal transmission, a reference ground conductor, and an auxiliary ground conductor. The laminate includes a first base layer with first and second principal surfaces and a second base layer with third and fourth principal surfaces, and the second principal surface is opposed to the third principal surface. The signal line is located on the second principal surface. The reference ground conductor is located on the first principal surface and is opposite to the signal line. The auxiliary ground conductor is located on the third or fourth principal surface and is opposite to the signal line. The auxiliary ground conductor includes a plurality of openings arranged along the signal line.

Strip line cable

МОЛНИЕЗАЩИТНАЯ КОМБИНИРОВАННАЯ СИСТЕМА С ПОЛОСКОВОЙ СХЕМНОЙ ПЛАТОЙ

... 1. Молниезащитная комбинированная система с полосковой схемной платой, содержащая:полосковую схемную плату со схемами иметаллический заземляющий стержень, прикрепленный к полосковой схемной плате, металлический заземляющий стержень, имеющий геометрическую форму, сконфигурированную на функционирование в качестве заземления для схем и одновременно в качестве молниезащитного заземления для линейной решетки элементов, возбуждаемых схемами.2. Молниезащитная комбинированная система с полосковой схемной платой по п. 1, в которой полосковая схемная плата содержит:первую многослойную полосковую схемную плату, содержащую первую подложку первой длины и вторую подложку второй длины, меньшей, чем первая длина, при этом первая часть схем на первой подложке выходит на поверхность,и вторую многослойную полосковую схемную плату, содержащую третья подложку третьей длины и четвертую подложку четвертой длины, меньшей, чем третья длина, при этом вторая часть схем на третьей подложке выходит на поверхность, ...

Mikrowellen-Streifen-Leitungsanordnung.

High-frequency signal path and electronic device

High-frequency signal transmission line and electronic equipment

Provided is a high-frequency signal transmission line and electronic equipment capable of limiting the characteristic impedance in a connector from deviating from a specific characteristic impedance. A dielectric body (12) is formed by stacking a plurality of dielectric sheets (18). A signal line (20) is provided in the dielectric body (12). A connector is installed at one main surface of the dielectric body (12) and is electrically connected to the signal line (20). A ground conductor (25) is provided closer to the other main surface of the dielectric body (12) than the signal line (20), and the ground conductor faces the signal line (20) with a dielectric sheet (18) therebetween. In connection sections (12b, 12c), when viewed in plan view from the z-axis direction, non-formation sections (Oa, Ob) in which conductors are not provided are disposed in at least a portion of regions that overlap the signal line (20). Adjustment conductors (15a, 15b) are provided on the other main surface of ...

Improvements in high frequency circuit units

... 986,672. Strip transmission line devices; semi-conductor devices. SANDERS ASSOCIATES Inc. July 6, 1961 [July 7, 1960], No. 24503/61. Headings H1K and H1W. [Also in Division H3] An electrically controllable element, e.g. a tunnel diode, transistor or a ceramic capacitor, is inserted between the conductors of a strip line. As shown in Fig. 2, a tunnel diode 42 is inserted in series with a line formed of two inner strip conductors 22, 24 and two outer ground conductors 30, 32. Staggered gaps are formed in the line conductors and the overlapping portions used as input and output electrodes. Control potentials are applied through transverse wires 44, 46. The line may be modified on either side of the diode to match the output and input impedances of the diode. In this case there will be a mismatch for output energy transmitted in the reverse direction. The controllable element may be connected in parallel with the line between line and ground conductors, e.g. a pair of diodes may be arranged ...

SIGNAL CARRIER SUPPORT

For the support of a signal conductor, particularly in triplate lines, an ordered layer of uniform spheres (9) of dielectric material is placed about the conductor (11) to support it, the separation being dependent on the diameter ot the spheres (9).

Microwave coupling arrangements

... 726,067. Microwave coupling circuits. STANDARD TELEPHONES & CABLES, Ltd. Jan. 23, 1953 [March 5, 1952], No. 2013/53. Class 40 (8). A microwave coupler using transmission lines of the " line-ground " type described in Specifications 704,050 and 708,601, comprises two parallel conductors 1, 2 spaced apart by a fraction of #/4, the conductor 1 being in the form of a closed loop having branches 6, 7, 8, 9 spaced as indicated on Fig. 1. Coupling exists between pairs of branches 6, 9 and 7, 8. The loop may be of shapes other than circular. The conductors 1, 2 may be in the form of parallel strips of the same width separated by a layer of dielectric 3. Alternatively, the conductor 2 may be two to three times the width of conductor 1 or may be in the form of a plane sheet underlying the whole of the circuit.

High frequency signal transmission line and electronic apparatus

Microwave transmission line

... 761,765. Microwave transmission lines. STANDARD TELEPHONES & CABLES, Ltd. May 1, 1953 [May 8, 1952], No. 12114/53. Class 40 (8). A transmission line of the strip type described in Specifications 704,050, 708,601 and 761,764 is provided with means for adjusting the line wavelength of a short section of line. The transmission line comprises a " line " conductor 1 separated from a " ground conductor 2 by a layer of dielectric 3 a small fraction of a quarter wavelength thick. Overlying a narrowed portion 4 of the conductor 1 are two conductive strips 5, 6 which can be moved towards and away fron each other by means of a two cam-and-pin mechanisms 12, 15 which are geared together by an endless cord 17. The strips 5, 6 are maintained in contact with the line conductor 1 by straps 21, 22. Adjustment of the strips 5, 6 causes variation of the effective width of the line-section and hence of the line wavelength. In a second method of actuating the strips 5, 6 (Figs. 7, 8, not shown) a rack- and-pinion ...

SIGNAL CARRIER SUPPORTS

SIGNAL CARRIER SUPPORTS

RESONATOR WITH A THREE-DIMENSIONAL DEFECTEDGROUND STRUCTURE WITH THE TRANSMISSION LINE

CHANNEL CONTAINING DIELECTRIC MICROZELLULAREN A FOAM

STRIP LEADER CABLE.

SPREIZDUBEL

Multi-layer microwave circuits and methods of manufacture

RESONANCE SUPPRESSION IN INTERDIGITAL CAPACITORS USEFUL AS DC BIAS BREAKS IN DIODE OSCILLATOR CIRCUITS

SLOTTED STRIP-LINE

SLOTTED STRIP-LINE First and second spaced apart, coextensive ground planes with a center conductor positioned therebetween in spaced relation from each of said planes and the volume defined by said planes being filled with a dielectric material fixedly engaging said planes and said center conductor to form a strip-line transmission line, the characteristic impedance of said transmission line being adjusted to a predetermined amount by forming a channel through one of said ground planes to the center conductor. The channel in the strip-line increases the characteristic impedance so that the width of the center conductor can be increased, for a specific characteristic impedance, to significantly improve control of the production of the strip-line.

High-frequency signal line and electronic device

To provide an easily bendable high-frequency signal line and an electronic apparatus which are capable of suppressing the deviation of the characteristic impedance of a signal line from a predetermined characteristic impedance. A dielectric body 12 is obtained by laminating a protection layer 14 and dielectric sheets 18a to 18c, and has a surface and an undersurface. A signal line 20 is a linear conductor disposed in the dielectric body 12. A ground conductor 22 is disposed in the dielectric body 12, faces the signal line 20 via the dielectric sheet 18a, and continuously extends along the signal line 20. A ground conductor 24 is disposed in the dielectric body 12, faces the ground conductor 22 via the signal line 20 sandwiched therebetween, and has a plurality of openings 30 arranged along the signal line 20. The surface of the dielectric body 12 on the side of the ground conductor 22 with respect to the signal line 20 is in contact with a battery pack 206.

Systems of high frequency transmission and in particular devices of coupling

Systems of high frequency transmission and in particular device of coupling

Pièce de maintien mécanique pour ligne de transmission hyperfréquence, notamment du type triplaque

L'invention concerne une pièce de maintien mécanique pour ligne de transmission hyperfréquence, notamment du type triplaque. La pièce de maintien mécanique comprend un cadre 2 en matériau diélectrique de forme rectangulaire. Deux côtés parallèles comportent à l'intérieur et au milieu deux encoches 21 en vis-à-vis dans lesquelles est enfilé le ruban conducteur intérieur 1 de la ligne. Les plans de masse sont en contact avec les deux autres côtés du cadre. Ces côtés portent des plots 22 venant s'engager dans des trous correspondants des plans de masse et assurant le centrage et l'assemblage par exemple par sertissage L'invention s'applique particulièrement aux lignes triplaques à air.

CIRCUIT HAS MICROWAVES

L'INVENTION CONCERNE UN CIRCUIT DE MICRO-ONDES DE CONSTRUCTION TRIPLE AYANT UN CERTAIN NOMBRE DE CIRCUITS INDEPENDANTS QUI SONT FORMES DANS DES PLANCHES DIELECTRIQUES QUI SONT PRISES EN SANDWICH ENTRE DEUX PLANCHES CONDUCTRICES A LA MASSE. SELON L'INVENTION, DES TROUS TRAVERSANTS 6 SONT FORMES DANS LES PLANCHES DIELECTRIQUES 3, 4 ENTRE LES CIRCUITS PHYSIQUEMENT VOISINS 51, 52 DANS LES CIRCUITS INDEPENDANTS AFIN DE CONNECTER LES DEUX PLANCHES CONDUCTRICES A LA MASSE L'UNE A L'AUTRE, LES SURFACES INTERNES DES TROUS ETANT METALLISEES, AFIN DE PROTEGER AINSI LES CIRCUITS VOISINS LES UNS DES AUTRES. L'INVENTION S'APPLIQUE NOTAMMENT AUX CIRCUITS INTEGRES. THE INVENTION RELATES TO A TRIPLE CONSTRUCTION MICROWAVE CIRCUIT HAVING A CERTAIN NUMBER OF INDEPENDENT CIRCUITS WHICH ARE FORMED IN DIELECTRIC BOARDS WHICH ARE TAKEN AS A SANDWICH BETWEEN TWO EARTH CONDUCTIVE BOARDS. ACCORDING TO THE INVENTION, THROUGH HOLES 6 ARE FORMED IN THE DIELECTRIC BOARDS 3, 4 BETWEEN THE PHYSICALLY NEIGHBORING CIRCUITS 51, 52 IN THE INDEPENDENT CIRCUITS IN ORDER TO CONNECT THE TWO CONDUCTIVE BOARDS TO EARTH ONE TO THE OTHER, THE SURFACES INTERNAL HOLES BEING METALLIZED, IN ORDER TO PROTECT THE NEIGHBORING CIRCUITS. THE INVENTION APPLIES IN PARTICULAR TO INTEGRATED CIRCUITS.

Electronic tile packaging

An apparatus includes: electronic tile packaging, the electronic tile packaging comprising: a plurality of tile layers, at least one of the tile layers comprising a crystalline structure having high thermal conductivity.

DUBBELT EXPANDERANDE PLUGG

HIGH-FREQUENCY TRANSMISSION LINE AND ELECTRONIC DEVICE

A high-frequency transmission line (10) is provided with a dielectric element (200) obtained by stacking dielectric layers (201, 202, 203). Resist films (31, 32) are respectively located on the two principal surfaces of the dielectric element (200). A first ground conductor (210) is located on substantially the entire resist film (31)-side surface of the dielectric layer (201). A signal conductor (220) having an elongated shape is located on the dielectric layer (203)-side surface of the dielectric layer (202). A ladder-shaped second ground conductor (230) is located on the resist film (32)-side surface of the dielectric layer (203). The signal conductor (220) is shaped so that the width increases towards the center along the direction of elongation. The first ground conductor (210) has a plurality of openings (211L) provided in the center region along the direction of elongation, and has a plurality of openings (211S) having a small opening area provided so as to flank the region in which ...

MULTILAYER BOARD AND ELECTRONIC DEVICE

A multilayer board includes a layered body including insulating base material layers that are laminated, and first and second signal lines, a first ground conductor including a first opening, a second ground conductor, a third ground conductor, and an interlayer connecting conductor. The first signal line overlaps the first opening when seen in a layering direction. The second signal line is provided on a layer different from a layer including the first signal line and includes a portion extending side by side with the first signal line when seen in the Z-axis direction. The first, second, and third ground conductors are connected by the interlayer connecting conductor. The third ground conductor is disposed on a layer including the first signal line or a layer positioned between the first signal line and the second signal line.

Ultrahigh-frequency transmission line of the three-plate air type and uses thereof

The present invention provides an ultrahigh-frequency transmission line of the three-plate air type comprising two parallel conducting plates, the space separating these two plates being filled with air, a central conducting strip placed between said two plates and a plurality of dielectric material supports spread out along each side of said strip, each support comprising a notch in each of which said strip is positioned so as to be held in place.

MULTI-MODE TRANSMISSION LINE AND STORAGE DEVICE INCLUDING THE SAME

A multi-mode transmission line includes a first and second conductive layers, first and second waveguide walls, a strip line, and a blind conductor. The second conductive layer that is formed over the first conductive layer. The first waveguide wall is elongated in a first direction and is in contact with the first conductive layer and the second conductive layer in a vertical direction. The second waveguide wall is elongated in the first direction parallel to the first waveguide wall and is in contact with the first conductive layer and the second conductive layer in the vertical direction. The strip line is formed between the first and second conductive layers and between the first and second waveguide walls. The blind conductor is connected to one of the first conductive layer, the second conductive layer, the first waveguide wall, or the second waveguide wall.

CONNECTION METHOD AND SUBSTRATE

A connection method includes the step of connecting, using a line on a dielectric element, two points through which a signal flows, the two points having different heights and the widths of the line at the positions of the two points having been adjusted on the basis of the thickness of the dielectric element.

MULTILAYER STRIPLINE RADIO FREQUENCY CIRCUITS AND INTERCONNECTION METHODS

信号線路モジュールおよび通信端末装置

Transmission line structure

A transmission line structure for transmitting a signal over a substrate 2, including at least one longitudinal conducting strip 10 formed over the substrate and laterally encapsulated between underlying and overlying longitudinal low-loss dielectric layers 8,12 also formed over the substrate, the underlying and overlying longitudinal low-loss dielectric layers disposed between overlying and underlying electrical ground layers also formed over the substrate and in electrical contact with each other.

Flat cable

Provided is a flat cable which has reduced thickness, and which is capable of suppressing fluctuation of characteristic impedance. A dielectric element (12) is formed by laminating a plurality of dielectric sheets (18). A signal line (20) is provided on the dielectric element (12). A reference ground conductor (22) is provided further toward the positive direction side in the z axis direction than the signal line (20), and is provided with a plurality of openings (29) that are aligned with each other along the signal line (20). An auxiliary ground conductor (24) is provided further toward the negative direction side in the z axis direction than the signal line (20), and is provided with a plurality of openings (30) that are aligned with each other along the signal line (20). The distance between the reference ground conductor (22) and the signal line (20), said distance being in the z axis direction, is larger than the distance between the auxiliary ground conductor (24) and the signal ...

High frequency signal line and electronic device provided with same

To provide: a high frequency signal line which can be easily bent; and an electronic device which is provided with the high frequency signal line. A dielectric element (12) is a laminate having regions (A1-A3) and is obtained by laminating a plurality of flexible dielectric sheets (18). A signal conductor layer (20) is provided on the dielectric element (12). Ground conductor layers (22, 23) are provided on the dielectric element (12) and face the signal conductor layer (20). The distance (D1) between the ground conductor layer (23) and the signal conductor layer (20) in the region (A1) is smaller than the distance (D2) between the ground conductor layer (22) and the signal conductor layer (20) in the regions (A2, A3). The dielectric element (12) is bent in the region (A1).

Flat bracket and electronic device

A transmission-line part (10) of a flat cable (60) is provided with the following: a dielectric body (110) provided with a signal conductor (40) in the thicknesswise middle thereof; a first ground conductor (20); and a second ground conductor (30). The first ground conductor (20) is provided with the following: elongated conductors (21, 22) that extend in a lengthwise direction with a gap therebetween in the widthwise direction of the dielectric body (110); and bridge conductors (23) that connect the elongated conductors (21, 22) at intervals in the lengthwise direction. Wide sections (25) that are wider than the elongated conductors (21, 22) are formed at points midway between bridge conductors (23) that are adjacent in the lengthwise direction. Each wide section (25) is shaped so as to protrude towards the opposing elongated conductor (21, 22). Interlayer connection conductors (50) are formed in the wide sections (25), and said interlayer connection conductors (50) connect the first ground ...

TRIPLATE CENTRE CONDUCTORS

Low impedance transmission line

... 1,056,650. Impedance matching. HUGHES AIRCRAFT CO. Sept. 28, 1965 [Oct. 26, 1964], No. 41158/65. Heading H1W. A low-impedance transmission line (shown in partial cross-section) comprises a folded laminate 14 enclosing a flat inner conductor 15 and flanked by two outer conductors 13, 13, the whole being clamped together at intervals by screws 26 engaging insulative studs 25. The laminate 14 consists of an internal layer of one or two sheets of terephthalic polyester enclosed between outer layers of electrolytic copper to which it is secured by adhesive. The laminate is folded longitudinally (fold not shown), and the plate 15 inserted in the fold. The longitudinal edges of the copper layers and the edges defining the holes for the clamps are trimmed, e.g. by etching, so as to be non-coincident. The inner copper layer may have a longitudinal gap where the fold occurs. The plate 15 carries terminal tags. The outer conductors 13 may be of L-section and the horizontal flanges adapted to support ...

High frequency signal transmission line and electronic apparatus

Provided are a high frequency signal transmission line whereby the width of a dielectric element can be reduced, and an electronic apparatus. A dielectric element (12) is formed by laminating a plurality of dielectric layers (18), and the dielectric element extends in the x axis direction. A signal line (20) is provided to the dielectric element (12), and the signal line extends in the x axis direction. A reference ground conducting body (22) is provided further toward the positive direction side in the z axis direction than the signal line (20). An auxiliary ground conducting body (24) is provided further toward the negative direction side in the z axis direction than the signal line (20). Each of the via hole conducting bodies (B1, B2) connects the reference ground conducting body (22) and the auxiliary ground conducting body (24) to each other, and is provided, in the dielectric element (12), further toward the negative direction side than the center in the y axis direction. The signal ...

STRIP LINES

Microwave filters

... 761,778. Microwave filters. STANDARD TELEPHONES & CABLES, Ltd. Nov. 13, 1953 [Dec. 6, 1952], No. 31595/53. Class 40 (8). A filter comprises a line of the " line ground " type having conductors 1, 2 spaced by a dielectric 3, e.g. as described in Specifications 704,050, 708,601 and 761,764, either of the conductors having spaced susceptance gaps 7 to provide resonant sections 4, 5, 6 of a length equal to a half-wavelength or a multiple thereof. The resonant sections are coupled by quarterwavelength (#/4) sections 4a, 5a. Various shapes of gaps and arrangements of conductors are described. In one modification, Fig. 9, resonant sections 19, 20 are coupled by a #/4 section 21. In a further modification (Fig. 11, not shown), the resonant sections may be in a different plane from the conductor, being spaced above the conductor by a layer of dielectric material which may be integral with the material between the conductors. The resonant sections may be tuned by the methods disclosed in Specifications ...

FILM CARRIER SIGNAL TRANSMISSION LINE

MICROWAVE HYBRID MICROELECTRONIC CIRCUIT MODULE

... 1,202,769. Printed circuit assemblies; semiconductor devices. GENERAL ELECTRIC CO. 12 Aug., 1968 [30 Aug., 1967], No. 38442/68. Headings H1K and HIR. [Also in Division H4] A microwave hybrid microelectronic circuit module comprises a ceramic substrate provided with a plurality of holes in which semi-conductor chips and/or other circuit elements are bonded, strip transmission lines deposited on the top surface of the substrate and connected to terminal areas on the chips and/or circuit elements and a continuous ground plane deposited on the bottom surface of the substrate. A ceramic substrate 10 having a plurality of holes 11 to 11d is positioned face down on a mandrel plate, Fig. 3 (not shown), and the circuit chip 12 is inserted face down into one of the holes. After packing epoxy powder into the space around the chip 12 and the rear of the hole the epoxy is compressed and heated so that the upper surface of the bonding material 14 is flush with the surface of the substrate 10 and chip ...

AIR-FILLED ONE TRIPLATELEITUNG FOR THE HIGH FREQUENCY RANGE AND YOUR APPLICATIONS.

DIELECTRIC MICROZELLULARER FOAM FOR USE IN CHANNELS

CHANNEL

Snap-RF interconnections

A radio frequency connector includes a substrate, a first ground plane disposed upon the substrate, a signal conductor having a first contact point, with the first contact point being configured to electrically mate with a second contact point, and a first ground boundary configured to electrically mate with a second ground boundary, with the first ground boundary being formed as an electrically continuous conductor within the substrate.

HIGH TC SUPERCONDUCTOR - GALLATE CRYSTAL STRUCTURES

High Tc oxide superconductive films can be formed on gallate layers, where the gallate layers include a rare earth element or a rare earth-like element. Combinations of rare earth elements and rare earth-like elements can also be utilized. The superconductive films can be epitaxially deposited on these gallate layers to form single crystals or, in the minimum, highly oriented superconductive layers. Any high Tc superconductive oxide material can be utilized, but the best lattice matches are to superconductive materials including copper oxides. Examples include Y-Ba-Cu-O systems, Bi-based systems and T1-based systems.

VERTICAL COPLANAR WAVEGUIDE WITH TUNABLE CHARACTERISTIC IMPEDANCE, DESIGN STRUCTURE AND METHOD OF FABRICATING THE SAME

An on-chip vertical coplanar waveguide with tunable characteristic impedance, a design structure, and a method of making the same. An on-chip transmission line (60) includes a signal line (65), an upper ground line (70) spaced apart from and above the signal line, and a lower ground line (75) spaced apart from and below the signal line. The signal line, the upper ground line and the lower ground line are substantially vertically aligned in a dielectric material (80).

LOW CROSS TALK AND IMPEDANCE CONTROLLED ELECTRICAL CONNECTOR AND ELECTRICAL CABLE ASSEMBLY

Disclosed is an electrical connector (90, 92) and an electrical cable assembly (370) in which the conductive (220, 352; 386, 388) and dielectric elements (146, 322; 370) are arranged in a composite I-beam shaped geometry in which the conductive element (220, 352; 368, 388) is perpendiculary interposed between two parallel dielectric and ground plane elements (146, 322; 370). Low cross talk and controlled impedance are found to result from the use of this geometry.

The transmission line and electronic equipment

High-frequency signal transmission line

A flexible high-frequency signal transmission line includes a dielectric body including laminated flexible dielectric layers. A signal line is provided in the dielectric body. A grounding conductor is arranged in the dielectric body to be opposed to the signal line via one of the dielectric layers. The grounding conductor is of a ladder structure including a plurality of openings and a plurality of bridges arranged alternately along the signal line. A characteristic impedance of the signal line changes between two adjacent ones of the plurality of bridges such that the characteristic impedance of the signal line rises from a minimum value to an intermediate value and to a maximum value and falls from the maximum value to the intermediate value and to the minimum value in this order.

HIGH-FREQUENCY SIGNAL TRANSMISSION LINE

A flexible high-frequency signal transmission line includes a dielectric body including laminated flexible dielectric layers. A signal line is provided in the dielectric body. A grounding conductor is arranged in the dielectric body to be opposed to the signal line via one of the dielectric layers. The grounding conductor is of a ladder structure including a plurality of openings and a plurality of bridges arranged alternately along the signal line. A characteristic impedance of the signal line changes between two adjacent ones of the plurality of bridges such that the characteristic impedance of the signal line rises from a minimum value to an intermediate value and to a maximum value and falls from the maximum value to the intermediate value and to the minimum value in this order. 1a dielectric body including laminated dielectric layers;a linear signal line provided in the dielectric body; anda first grounding conductor arranged in the dielectric body to be opposed to the signal line via one of the dielectric layers, the first grounding conductor being of a ladder structure including a plurality of openings and a plurality of bridges alternately arranged in an extending direction of the signal line; whereina width of each the plurality of openings decreases towards respective ones of the plurality of bridges in a step-by-step manner or a continuous manner; anda width of each of the plurality of bridges is uniform in a region in which each of the plurality of bridges overlaps the linear signal line in a planar view.. A high-frequency signal transmission line comprising: 1. Field of the InventionThe present invention relates to a high-frequency signal transmission line, and more particularly to a thin flexible high-frequency signal transmission line.2. Description of the Related ArtIn a high-frequency signal transmission line of a tri-plate stripline structure wherein a signal line is sandwiched between an upper and a lower grounding conductor, one way of decreasing ...

HIGH-FREQUENCY SIGNAL TRANSMISSION LINE

A flexible high-frequency signal transmission line includes a dielectric body including laminated flexible dielectric layers. A signal line is provided in the dielectric body. A grounding conductor is arranged in the dielectric body to be opposed to the signal line via one of the dielectric layers. The grounding conductor is of a ladder structure including a plurality of openings and a plurality of bridges arranged alternately along the signal line. A characteristic impedance of the signal line changes between two adjacent ones of the plurality of bridges such that the characteristic impedance of the signal line rises from a minimum value to an intermediate value and to a maximum value and falls from the maximum value to the intermediate value and to the minimum value in this order. 1. (canceled)2. A high-frequency signal transmission line comprising:a dielectric body including laminated dielectric layers;a linear signal line provided in the dielectric body;a first grounding conductor arranged in the dielectric body to be opposed to the signal line via one of the dielectric layers, the first grounding conductor having a ladder structure including a plurality of openings and a plurality of bridges alternately arranged in an extending direction of the signal line; anda floating conductor arranged in the dielectric body to be opposed to the signal line via the plurality of openings of the first grounding conductor, the floating conductor is not connected to the first grounding conductor.3. The high-frequency signal transmission line according to claim 2 , wherein a width of the floating conductor is smaller than a width of the plurality of openings.4. The high-frequency signal transmission line according to claim 3 , wherein the width of the floating conductor is larger than a width of the linear signal line.5. The high-frequency signal transmission line according to claim 2 , wherein the width of the opening decreases towards the plurality of bridges in a step-by-step ...

WELL THERMALIZED STRIPLINE FORMATION FOR HIGH-DENSITY CONNECTIONS IN QUANTUM APPLICATIONS

A stripline that is usable in a quantum application (q-stripline) includes a first polyimide film and a second polyimide film. The q-stripline further includes a first center conductor and a second center conductor formed between the first polyimide film and the second polyimide film. The q-stripline has a first pin configured through the second polyimide film to make electrical and thermal contact with the first center conductor. 1. A stripline that is usable in a quantum application (q-stripline) comprising:a first polyimide film;a second polyimide film;a first center conductor and a second center conductor formed between the first polyimide film and the second polyimide film; anda first pin configured through the second polyimide film to make electrical and thermal contact with the first center conductor.2. The q-stripline of claim 1 , wherein a thickness of the first polyimide film is at least half of a specified insulator thickness B.3. The q-stripline of claim 2 , wherein the insulator thickness B is selected such that three times the sum of a first dimension of the first center conductor and a separation distance between the first center conductor and the second conductor is greater than twice of the insulator thickness B to yield a microwave crosstalk of less than −50 decibels between the first center conductor and the second center conductor.4. The q-stripline of claim 1 , further comprising:a first recess in the second polyimide film, wherein the first recess is formed through a second ground plane and the second polyimide film to expose a portion of the first center conductor, and wherein the first pin is configured through the first recess.5. The q-stripline of claim 1 , further comprising:an elastic pin, wherein the elastic pin is used as the first pin, and wherein the elastic pin makes the electrical and thermal contact only by applying pressure on the first center conductor and without soldering.6. The q-stripline of claim 1 , further comprising:a ...

Flexible printed circuit board and manufacturing method of flexible printed circuit board

A flexible printed circuit board having at least a set of strip line transmission path by being provided with a signal line, and a pair of ground layers and, includes a pleated part PL having a plurality of curved portions which are curved so as to be opened or closed, in which in the ground layers, mesh ground layers in which conductive portions are provided in a mesh shape, and solid ground layers in which the conductive portions are provided in a planar state, are provided, in which the mesh ground layers are arranged on an outer peripheral side of the curved portions PL 2 , and the solid ground layers are arranged on an inner peripheral side of the curved portions.

Electronic apparatus

An electronic apparatus includes a first substrate and a second substrate mounted on the first substrate and having a smaller area than the first substrate. The second substrate extends in a longitudinal direction and has a planar or substantially planar shape with a uniform or substantially uniform width across all portions of the second substrate in the longitudinal direction. The second substrate includes a signal line, and a high-frequency transmission line including the signal line, and further includes an input/output pad electrically connected to the signal line, and an auxiliary pad arranged between two input/output pads, on the mounting surface of the second substrate. The first substrate includes lands each connected to the input/output pad and the auxiliary pad. The input/output pad and the auxiliary pad are each soldered on each of the lands of the first substrate and, thus, the second substrate is surface-mounted on the first substrate.

Cryogenic device with multiple transmission lines and microwave attenuators

Techniques for implementing multiple microwave attenuators on a high thermal conductivity substrate for cryogenic applications to reduce heat and thermal noise during quantum computing are provided. In one embodiment, a device for using in cryogenic environment is provided that comprises a substrate having a thermal conductivity above a defined threshold, a plurality of transmission lines fabricated on the substrate and arranged with a separation gap between the plurality of transmission lines to maintain crosstalk below −50 decibels, and one or more microwave attenuators embedded on the plurality of transmission lines.

HIGH-DENSITY TRIPLE DIAMOND STRIPLINE INTERCONNECTS

In accordance with embodiments disclosed herein, there is provided a high density triple diamond stripline interconnect. An interconnect includes a first reference layer, a second reference layer disposed below the first reference layer, and a dielectric disposed between the first reference layer and the second reference layer. The interconnect further includes a first pair of conductors including a first conductor and a second conductor that are in a broadside-facing orientation within the dielectric below the first reference layer and above the second reference layer. The interconnect further includes a second pair of conductors including a third conductor and a fourth conductor that are in an edge-facing orientation within the dielectric below the first conductor and above the second conductor. 1. An interconnect comprising:a first reference layer;a second reference layer disposed below the first reference layer;a dielectric disposed between the first reference layer and the second reference layer;a first pair of conductors comprising a first conductor and a second conductor that are in a broadside-facing orientation within the dielectric below the first reference layer and above the second reference layer; anda second pair of conductors comprising a third conductor and a fourth conductor that are in an edge-facing orientation within the dielectric below the first conductor and above the second conductor.2. The interconnect of claim 1 , wherein:the first conductor and the second conductor are differential striplines;the third conductor and the fourth conductor are differential striplines;first dimensions of the first conductor are substantially equal to second dimensions of the second conductor; andthird dimensions of the third conductor are substantially equal to fourth dimensions of the fourth conductor.3. The interconnect of claim 1 , wherein:the first conductor and the second conductor are differential striplines;the third conductor and the fourth conductor ...

METHODS FOR INTEGRATED MICROSTRIP AND SUBSTRATE INTEGRATED WAVEGUIDE CIRCULATORS/ISOLATORS FORMED WITH CO-FIRED MAGNETIC-DIELECTRIC COMPOSITES

Disclosed are embodiments of microstrip and substrate integrated waveguide circulators/isolators which can be integrated with a substrate. This composite structure can serve as a platform for other components, allowing for improved miniaturization of components. Embodiments of the disclosure can be particular advantageous in the high frequency ranges, such as above 1.8GHz or above 3GHz, which allows devices to be used in the 5G space. 1. A method of forming a co-fired integrated microstrip or substrate integrated waveguide circulator , the method comprising:preparing a ferrite disc;preparing a dielectric substrate, the dielectric substrate having an aperture;translating the ferrite disc into the aperture in the dielectric substrate to form a composite structure;co-firing the composite structure to shrink the dielectric substrate around the ferrite disc; andmetallizing the co-fired composite structure.2. The method of wherein the ferrite disc is an yttrium iron garnet disc.3. The method of wherein the co-firing is at a temperature of at least 1000° C.4. The method of further including adding additional radio frequency components onto the dielectric substrate.5. The method of further including slicing the composite structure to a particular thickness claim 1 , wherein each slice contains both a portion of the ferrite disc and a portion of the dielectric substrate or waveguide.6. The method of further including contacting a magnetic disc onto the composite structure to form a microstrip or substrate integrated waveguide circulator.7. The method of wherein no adhesive is used.8. The method of further including applying a coupler claim 1 , switch claim 1 , and load to the dielectric substrate.9. The method of further comprising coupling the coupler to a transmit power amplifier and coupling the switch to a receive low noise amplifier.10. The method of further comprising printing a microstrip filter on the dielectric substrate.11. A method of forming a radio frequency ...

HIGH-FREQUENCY SIGNAL TRANSMISSION LINE AND ELECTRONIC APPARATUS

An easily bendable high-frequency signal transmission line includes a dielectric body including a protection layer and dielectric sheets laminated on each other, a surface and an undersurface. A signal line is a linear conductor disposed in the dielectric body. A ground conductor is disposed in the dielectric body, faces the signal line via the dielectric sheet, and continuously extends along the signal line. A ground conductor is disposed in the dielectric body, faces the ground conductor via the signal line sandwiched therebetween, and includes a plurality of openings arranged along the signal line. The surface of the dielectric body on the side of the ground conductor with respect to the signal line is in contact with a battery pack. 1. (canceled)2. An electronic apparatus comprising a first article , a second article and a high-frequency signal transmission line , the high-frequency signal transmission line comprising:an element assembly including one or more insulating layers, and a first main surface and a second main surface;a linear signal line disposed in the element assembly;a first ground conductor that faces the signal line at a first distance and continuously extends along the signal line, the first ground conductor being located on or at a side of the first main surface with respect to the signal line; anda second ground conductor that faces the signal line at a second distance smaller than the first distance, and includes a plurality of openings arranged along the signal line, the second ground conductor being located on or at a side of the second main surface with respect to the signal line; whereina main surface of the high-frequency signal transmission line that is located near the first ground conductor with respect to the signal line is in contact with the first article; anda main surface of the high-frequency signal transmission line that is located near the second ground conductor with respect to the signal line faces the second article at a ...

High-frequency signal line and electronic device including the same

A high-frequency signal line includes a dielectric body including flexible dielectric sheets laminated in a direction of lamination and also including a first line portion, a second line portion extending along the first line portion, and a third line portion connecting ends in a specified direction of the first and second line portions. In the dielectric body, a signal line extends through the first, second and third line portions, and a first ground conductor and a second ground conductor face the signal line from both sides in the direction of lamination. One or more interlayer connection conductors are pierced in the dielectric sheets to connect the first ground conductor and the second ground conductor. None of the interlayer connection conductors is provided in a portion of the third line portion that is farther in a direction opposite to the specified direction than the signal line when viewed from the direction of lamination.

SNAP-RF INTERCONNECTIONS

A radio frequency connector includes a substrate, a first ground plane disposed upon the substrate, a signal conductor having a first contact point, with the first contact point being configured to electrically mate with a second contact point, and a first ground boundary configured to electrically mate with a second ground boundary, with the first ground boundary being formed as an electrically continuous conductor within the substrate. 1. A method of manufacturing a radio frequency connector , the method comprising:forming a signal trace from a conductive material disposed on a first substrate, the signal trace including a terminal pad;bonding a second substrate to the first substrate to substantially encapsulate the trace and terminal pad between the first substrate and the second substrate;forming an access hole from the second substrate to the terminal pad;forming a trench through the first and second substrate, the trench being positioned at least partially around the terminal pad;depositing a conductor into the access hole, the conductor providing an electrical connection to the terminal pad; anddepositing a conductive ink into the trench to form an electrically continuous conductor within the first and second substrate.2. The method of claim 1 , further comprising depositing a solder bump on the terminal pad.3. The method of claim 1 , further comprising applying solder/reflow to the conductor at the access hole.4. The method of claim 1 , wherein forming the signal trace includes milling the conductive material disposed on the first substrate.5. The method of claim 1 , wherein forming the access hole includes drilling through the second substrate.6. The method of claim 1 , wherein forming the trench includes milling through the first and second substrates.7. The method of claim 6 , wherein milling through the first and second substrates includes milling to a ground plane substantially without piercing the ground plane.8. The method of claim 1 , wherein the ...

Transmission line substrate and electronic device

A transmission line substrate includes a line portion, a base including a first main surface and a second main surface opposite to the first main surface, first and second ground conductors, and a signal line. The first ground conductor is on the first main surface side. The second ground conductor is on the second main surface side. The first ground conductor includes first conductor-non-formed portions overlapping the signal line when viewed in the Z axis direction. The second ground conductor includes second conductor-non-formed portions overlapping the signal line when viewed in the Z axis direction. A total area of the second conductor-non-formed portions is less than a total area of the first conductor-non-formed portions.

COAXIAL WIRING DEVICE AND TRANSMISSION/RECEPTION INTEGRATED SPLITTER

Conventional coaxial wiring devices present a problem in that the management of the manufacturing process therefor is difficult. A coaxial wiring device according to the present invention includes a first member, a second member, and a conductor plate. The first member () and the second member () include, when a line that connects a first port and a second port is denoted by a reference line, a first groove () that has a central point on the reference line and extends in a direction that intersects with the reference line; a second groove () that connects one end (FN) of the first groove () and the first port; a third groove () that connects the other end (FN) of the first groove () and the first port and has a shape that is line symmetrical to the second groove () with respect to the reference line; a fourth groove () that connects one end (FN) of the first groove () and the second port; and a fifth groove () that connects the other end (FN) of the first groove () and the second port and has a shape that is line symmetrical to the fourth groove () with respect to the reference line. 17-. (canceled)8. A coaxial wiring device comprisinga first metallic member,a second metallic member opposed to the first member, anda conductor plate that is provided to be held between the first metallic member and the second metallic member,wherein:a high-frequency signal is transmute d between a first port and a second port provided on respective ends of a coaxial wire formed in the conductor plate by grooves formed in the first metallic member and the second metallic member and the coaxial wire, andthe coaxial wire is arranged to be centrosymmetric with a point on a line that connects the first port and the second port as a center of symmetry.9. The coaxial wiring device according to claim 8 , wherein the second port is provided on an antenna that converts a signal input through a waveguide into a signal that propagates on a coaxial.10. The coaxial wiring device according to claim ...

Multilayer electronic structure with integral faraday shielding

A multilayer electronic support structure including at least one metallic component encapsulated in a dielectric material, and comprising at least one faraday barrier to shield the at least one metallic component from interference from external electromagnetic fields and to prevent electromagnetic emission from the metallic component.

Laminated Ceramic RF Assembly

The present invention is directed to a stripline assembly that includes a first pre-fired ceramic substrate including a ground plane disposed on a first surface of the first pre-fired ceramic substrate. A second pre-fired ceramic substrate includes a ground plane disposed on a first surface thereof and a circuit disposed on a second surface of the second pre-fired ceramic substrate opposite the first surface. The circuit is disposed between the first pre-fired ceramic substrate and the second pre-fired ceramic substrate. A conductive bonding layer is disposed around the periphery of the circuit and between the first pre-fired ceramic substrate and the second pre-fired ceramic substrate. 1. A stripline assembly comprising:a first pre-fired ceramic substrate including a ground plane disposed on a first surface of the first pre-fired ceramic substrate;a second pre-fired ceramic substrate including a ground plane disposed on a first surface thereof and a circuit disposed on a second surface of the second pre-fired ceramic substrate opposite the first surface, the circuit being disposed between the first pre-fired ceramic substrate and the second pre-fired ceramic substrate; anda conductive bonding layer disposed around the periphery of the circuit and between the first pre-fired ceramic substrate and the second pre-fired ceramic substrate.2. The assembly of claim 1 , further comprising a cavity formed in an interior region of the assembly between the first pre-fired ceramic substrate claim 1 , the second pre-fired ceramic substrate claim 1 , and the conductive bonding layer.3. The assembly of claim 2 , further comprising a nonconductive layer on an outside surface of said assembly sufficient to seal said cavity.4. The assembly of claim 3 , wherein said nonconductive layer does not form a primary mechanical bond between said first pre-fired ceramic substrate and said second pre-fired ceramic substrate.5. The assembly of claim 1 , wherein said conductive bonding layer is ...

FIXING STRUCTURE OF CABLE TO WIRING SUBSTRATE, AND CABLE, AND MANUFACTURING METHOD OF CABLE

A transmission line includes an insulator as a base member, a transmission conductor, and a ground layer. A connector is provided at a wiring substrate to fix the transmission line. The transmission line includes a signal columnar conductor having a solid columnar shape integrated with the transmission conductor, and ground columnar conductors having solid columnar shapes integrated with the ground layer. The connector has a through hole corresponding to the signal columnar conductor, and through holes corresponding to the ground columnar conductors. Conductive films are respectively provided on the inner peripheral surfaces of the through holes. The signal columnar conductor is inserted into the through hole, and the ground columnar conductors are respectively inserted into the through holes. 1. A fixing structure configured to fix a cable to a wiring substrate , the fixing structure comprising:a cable including a flexible insulating sheet defining a base member, an elongated transmission conductor configured to transmit a signal, and a protrusion-shaped connection conductor with a solid columnar shape protruding in a thickness direction of the insulating sheet; anda fixing portion provided at the wiring substrate and configured to fix the cable; whereinthe fixing portion has a shape corresponding to a shape of the protrusion-shaped connection conductor, and a hole-shaped connection conductor with a conductor on an inner peripheral surface of the hole-shaped connection conductor;the protrusion-shaped connection conductor has a truncated conical shape;the protrusion-shaped connection conductor is inserted into the hole-shaped connection conductor; andthe protrusion-shaped connection conductor is electrically connected with the hole-shaped connection conductor through a conductive joining material.2. The fixing structure according to claim 1 , wherein an outer diameter of a bottom portion of the protrusion-shaped connection conductor is larger than an inner diameter ...

Well thermalized stripline formation for high-density connections in quantum applications

A stripline that is usable in a quantum application (q-stripline) includes a first polyimide film and a second polyimide film. The q-stripline further includes a first center conductor and a second center conductor formed between the first polyimide film and the second polyimide film. The q-stripline has a first pin configured through a first recess in the second polyimide film to make electrical and thermal contact with the first center conductor.

High-frequency signal line and electronic device

A high-frequency signal line includes an element assembly including a plurality of flexible insulator layers. a linear signal line provided in or on the element assembly, a first ground conductor provided in or on the element assembly and extending along the signal line, a plurality of second ground conductors provided in or on the element assembly and arranged at predetermined intervals in a direction in which the signal line extends, on a first side in a direction of lamination relative to the signal line, the second ground conductors being opposite to the signal line with at least one of the insulator layers positioned therebetween, and a plurality of first via-hole conductors extending through at least one of the insulator layers so as to connect the first and second ground conductors.

CIRCUIT STRUCTURE

Provided is a circuit structural body is formed into a shape including: A circuit structural body, including: a multilayer board, which includes a plurality of layers of a first to N-th tri-plate structural bodies each including a first to N-th (N is an integer of 2 or more) planar conductors; an interlayers connection conductor, which is configured to connect the first to N-th planar conductors to each other; and a side-surface ground conductor, which is formed on a side surface of the multilayer board, and is approximately parallel to and near the interlayers connection conductor. 1. A circuit structural body , comprising:a multilayer board, which includes a plurality of layers of a first to N-th tri-plate structural bodies each including a first to N-th (N is an integer of 2 or more) planar conductors;an interlayers connection conductor, which is configured to connect the first to N-th planar conductors to each other; anda side-surface ground conductor, which is formed on a near side surface to the interlayers connection conductor of the multilayer board, and is approximately parallel to the interlayers connection conductor,wherein an n-th (1≤n≤N) tri-plate structural body is formed of an n-th tri-plate line including: an n-th planar conductor; and an n-th planar ground conductor and an (n+1)-th planar ground conductor sandwiching the n-th planar conductor therebetween,wherein an m-th (2≤m≤N) planar ground conductor, which is provided between the first to N-th planar conductors, has a cutout through which the interlayers connection conductor is allowed to pass, the cutout having one side in contact with the side-surface grounding conductor,wherein the circuit structural body operates a portion between the interlayers connection conductor and the side-surface ground conductor as a high frequency circuit.2. (canceled)3. (canceled)4. The circuit structural body according to claim 1 , wherein the interlayers connection conductor is formed of a planar conductor.5. The ...

SIGNAL TRANSMISSION COMPONENT AND ELECTRONIC DEVICE

A signal transmission cable as a signal transmission component includes a laminate including a first thin portion on one of the opposite ends in a first direction and a second thin portion on the other end in the first direction. A portion between the first thin portion and the second thin portion in the laminate is a main line portion. The thickness of the first and second thin portions is thinner than the thickness of the main line portion. The surface on one end in the thickness direction of the laminate defined by the main line portion and the first and second thin portions is a continuous flat surface. A connector for external connection is arranged on the surfaces of the first and second thin portions, on the sides in which each of the thin portions and the main line portion have a difference in level. 1. A signal transmission component comprising:a laminate including a plurality of dielectric layers that are laminated on each other, the plurality of dielectric layers each including a conductor pattern with a flat film shape and having flexibility;a signal conductor that is defined, in the laminate, by the conductor pattern, has a linear shape, and extends in a direction perpendicular to a lamination direction of the laminate;a first ground conductor and a second ground conductor that are defined by a conductor pattern different from the signal conductor, in an extending direction so as to extend parallel or substantially parallel to the signal conductor, have a flat film shape, and hold the signal conductor between the first ground conductor and the second ground conductor in the lamination direction; anda connector for external connection that is connected to at least one of opposite ends of the signal conductor, wherein the laminate includes a thinned portion of which a thickness in the lamination direction is reduced an end portion;no first ground conductor is located at the thinned portion;the signal conductor is connected to the connector for external ...

HIGH-FREQUENCY TRANSMISSION LINE AND ANTENNA DEVICE

An antenna is connected to a first end of a high-frequency transmission line, and a connector is connected to a second end of the high-frequency transmission line. A characteristic impedance of a microstrip line is higher than characteristic impedances of first and second strip lines, and a characteristic impedance of a coplanar line is higher than a characteristic impedance of the second strip line. Thus, at a certain frequency, a standing wave develops in which the position of the microstrip line and the position of the coplanar line are maximum voltage points and three-quarter-wavelength resonance is a fundamental wave mode. Thus, the cutoff frequency of the high-frequency transmission line is high, and an insertion loss of a signal is significantly reduced to be low over a wide band. 1. A high-frequency transmission line comprising:a first end that is a low-impedance end;a second end that is a high-impedance end;a low-impedance portion including a strip line; anda high-impedance portion having a characteristic impedance higher than the low-impedance portion and including a microstrip line or a coplanar line; whereinthe high-frequency transmission line is bent at the high-impedance portion.2. The high-frequency transmission line according to claim 1 , whereinthe strip line includes ground electrodes; andat least one of the ground electrodes is not located in the high-impedance portion.3. The high-frequency transmission line according to claim 1 , wherein a total length of the low-impedance portion is larger than a total length of the high-impedance portion.4. The high-frequency transmission line according to claim 1 , wherein the low-impedance end is an antenna connection end claim 1 , and the high-impedance end is a connector connection end.5. The high-frequency transmission line according to claim 1 , whereinthe low-impedance portion and the high-impedance portion include a multilayer body including a plurality of dielectric layers and a plurality of line ...

HIGH-FREQUENCY SIGNAL TRANSMISSION LINE, ELECTRONIC DEVICE AND MANUFACTURING METHOD OF HIGH-FREQUENCY SIGNAL TRANSMISSION LINE

A high-frequency signal transmission line includes a dielectric body including dielectric layers stacked together, a linear signal line provided in the dielectric body, a first ground conductor provided at the dielectric body, at a first side of the signal line in a stacking direction so as to face the signal line, and a subsidiary member provided at the dielectric body, at a second side of the signal line in the stacking direction so as to face a central portion of the signal line in a line-width direction. In a sectional view along a plane perpendicular or substantially perpendicular to an extending direction of the signal line, the signal line is curved such that side portions of the signal line in the line-width direction are farther away from the first ground conductor than a central portion of the signal line in the line-width direction. 1. (canceled)2. A high-frequency signal transmission line comprising:a dielectric body including dielectric layers stacked together;a linear signal line provided in the dielectric body;a first ground conductor provided at the dielectric body, at a first side of the signal line in a stacking direction so as to face the signal line; anda subsidiary member provided at the dielectric body, at a second side of the signal line in the stacking direction so as to face a central portion of the signal line in a line-width direction; whereinin a sectional view along a plane perpendicular or substantially perpendicular to an extending direction of the signal line, the signal line is curved such that side portions of the signal line in the line-width direction are farther away from the first ground conductor than a central portion of the signal line in the line-width direction.3. The high-frequency signal transmission line according to claim 2 , further comprising a second ground conductor provided at the dielectric body claim 2 , at the second side of the signal line in the stacking direction so as to face the signal line claim 2 , the ...

FLAT CABLE

A flat cable includes a dielectric element assembly including a plurality of dielectric layers laminated on each other, a linear signal line provided in the dielectric element assembly, a first ground conductor provided on one side in a direction of lamination relative to the signal line and including a plurality of first openings arranged along the signal line, and a second ground conductor provided on the other side in the direction of lamination relative to the signal line and including a plurality of second openings arranged along the signal line. The first ground conductor is more distant from the signal line in the direction of lamination than is the second ground conductor. The first openings are larger than the second openings. 1. (canceled)2. A flat cable comprising:a dielectric element assembly including a plurality of dielectric layers laminated on each other in a lamination direction;a linear signal line provided in the dielectric element assembly;a first ground conductor provided on one side in the direction of lamination relative to the signal line and including a plurality of first openings arranged along the signal line; anda second ground conductor provided on the other side in the direction of lamination relative to the signal line and including a plurality of second openings arranged along the signal line; whereinthe first ground conductor is more distant from the signal line in the direction of lamination than is the second ground conductor; andthe first openings are smaller than the second openings.3. The flat cable according to claim 2 , wherein the first openings are narrower than the second openings in a direction perpendicular or substantially perpendicular to a direction in which the signal line extends.4. The flat cable according to claim 2 , wherein the first openings are shorter than the second openings in a direction in which the signal line extends.5. The flat cable according to claim 2 , wherein edges of the first openings do not ...

High-frequency transmission line

An antenna is connected to a first end of a high-frequency transmission line, and a connector is connected to a second end of the high-frequency transmission line. A characteristic impedance of a microstrip line is higher than characteristic impedances of first and second strip lines, and a characteristic impedance of a coplanar line is higher than a characteristic impedance of the second strip line. Thus, at a certain frequency, a standing wave develops in which the position of the microstrip line and the position of the coplanar line are maximum voltage points and three-quarter-wavelength resonance is a fundamental wave mode. Thus, the cutoff frequency of the high-frequency transmission line is high, and an insertion loss of a signal is significantly reduced to be low over a wide band.

INTEGRATED MICROSTRIP AND SUBSTRATE INTEGRATED WAVEGUIDE CIRCULATORS/ISOLATORS FORMED WITH CO-FIRED MAGNETIC-DIELECTRIC COMPOSITES

Disclosed are embodiments of microstrip and substrate integrated waveguide circulators/isolators which can be integrated with a substrate. This composite structure can serve as a platform for other components, allowing for improved miniaturization of components. Embodiments of the disclosure can be particular advantageous in the high frequency ranges, such as above 1.8 GHz or above 3 GHz, which allows devices to be used in the 5G space. 1. An integrated microstrip or substrate integrated waveguide circulator comprising:a dielectric substrate having an aperture;a ferrite disc fit within the aperture in the dielectric substrate, the dielectric substrate and ferrite disc being co-fired together to contain the ferrite disc within the aperture of the dielectric substrate; andmetallization on the co-fired dielectric substrate and ferrite disc.2. The integrated microstrip or substrate integrated waveguide circulator of wherein the metallization is circuitry.3. The integrated microstrip or substrate integrated waveguide circulator of wherein the ferrite disc is a yttrium iron garnet disc.4. The integrated microstrip or substrate integrated waveguide circulator of wherein the circulator is configured for use in above approximately 1.8 GHz systems.5. The integrated microstrip or substrate integrated waveguide circulator of further including a coupler claim 1 , switch claim 1 , and load located on the dielectric substrate.6. The integrated microstrip or substrate integrated waveguide circulator of wherein no adhesive is used.7. The integrated microstrip or substrate integrated waveguide circulator of wherein the dielectric substrate or waveguide and ferrite disc are co-fired at a temperature of at least 1000° C.8. A method of forming a co-fired integrated microstrip or substrate integrated waveguide circulator claim 1 , the method comprising:preparing a ferrite disc;preparing a dielectric substrate, the dielectric substrate having an aperture;translating the ferrite disc into ...

ELECTRONIC APPARATUS

An electronic apparatus includes a first substrate and a second substrate mounted on the first substrate and having a smaller area than the first substrate. The second substrate extends in a longitudinal direction and has a planar or substantially planar shape with a uniform or substantially uniform width across all portions of the second substrate in the longitudinal direction. The second substrate includes a signal line, and a high-frequency transmission line including the signal line, and further includes an input/output pad electrically connected to the signal line, and an auxiliary pad arranged between two input/output pads, on the mounting surface of the second substrate. The first substrate includes lands each connected to the input/output pad and the auxiliary pad. The input/output pad and the auxiliary pad are each soldered on each of the lands of the first substrate and, thus, the second substrate is surface-mounted on the first substrate. 1. An electronic apparatus comprising:a first substrate that includes a mounting surface; anda second substrate that includes a mounting surface, is mounted on the first substrate, and has a smaller area than the first substrate; whereinthe second substrate extends in a longitudinal direction; a signal line;', 'a high-frequency transmission line including the signal line;', 'a plurality of input/output pads electrically connected to the signal line, on the mounting surface of the second substrate; and', 'an auxiliary pad arranged between at least two input/output pads among the plurality of input/output pads on the mounting surface of the second substrate;, 'the second substrate includesthe first substrate includes a plurality of lands provided on the mounting surface of the first substrate, each of the plurality of lands being respectively connected to a corresponding input/output pad or auxiliary pad;each of the input/output pad and the auxiliary pad is respectively soldered to a corresponding land on the mounting ...

CIRCUIT BOARD AND CONDUCTIVE PATTERN STRUCTURE

A circuit board includes a first conductive layer, a second conductive layer, and a first insulating layer disposed between the first conductive layer and the second conductive layer, wherein the first conductive layer includes a signal line, the second conductive layer includes a ground line, and the ground line of the second conductive layer includes a pattern area patterned in a meander shape. 1. A circuit board comprising:a first conductive layer;a second conductive layer; andan insulating layer disposed between the first conductive layer and the second conductive layer,wherein the first conductive layer comprises a signal line, and the second conductive layer comprises a ground line electrically separated from the signal line,wherein the ground line includes a pattern area in a corresponding area provided with the signal line and an outer area surrounding the pattern area and being connected to the pattern area, andwherein inner unit patterns of the pattern area are oblique to the signal line, and outer unit patterns of the pattern area are connected to the inner unit patterns of the pattern area.2. The circuit board of claim 1 , wherein the outer area connects to the pattern area in two regions.3. The circuit board of claim 1 , wherein the outer area connects to the pattern area via the outer unit patterns.4. The circuit board of claim 1 , wherein a portion of the outer unit patterns is substantially parallel to the signal line.5. The circuit board of claim 1 , wherein a portion of the outer unit patterns is substantially perpendicular to the signal line.6. The circuit board of claim 1 , wherein a portion of the outer unit patterns is substantially parallel to the signal line claim 1 , and another portion of the outer unit patterns is substantially perpendicular to the signal line.7. The circuit board of claim 1 , wherein a shape of the inner unit patterns under the signal line is substantially the same regardless of a position of the signal line within the ...

ELECTRONIC APPARATUS

An electronic apparatus includes a first substrate and a second substrate mounted on the first substrate and having a smaller area than the first substrate. The second substrate extends in a longitudinal direction and has a planar or substantially planar shape with a uniform or substantially uniform width across all portions of the second substrate in the longitudinal direction. The second substrate includes a signal line, and a high-frequency transmission line including the signal line, and further includes an input/output pad electrically connected to the signal line, and an auxiliary pad arranged between two input/output pads, on the mounting surface of the second substrate. The first substrate includes lands each connected to the input/output pad and the auxiliary pad. The input/output pad and the auxiliary pad are each soldered on each of the lands of the first substrate and, thus, the second substrate is surface-mounted on the first substrate. 1. An electronic apparatus comprising:a first substrate that includes a mounting surface; anda second substrate that includes a mounting surface, is mounted on the first substrate, and has a smaller area than the first substrate; wherein the second substrate extends in a longitudinal direction; a signal line;', 'a high-frequency transmission line including the signal line;', 'a plurality of input/output pads electrically connected to the signal line, on the mounting surface of the second substrate; and', 'an auxiliary pad arranged between at least two input/output pads among the plurality of input/output pads on the mounting surface of the second substrate;, 'the second substrate includesthe first substrate includes a plurality of lands provided on the mounting surface of the first substrate, each of the plurality of lands being respectively connected to a corresponding input/output pad or auxiliary pad;each of the input/output pad and the auxiliary pad is respectively soldered to a corresponding land on the mounting ...

In-glass high performance antenna

Disclosed is an antenna including a radiating element, a co-planar ground plane element and a transmission line extending across at least a portion of the radiating element and the ground plane element. The transmission line includes a dielectric layer. The dielectric layer has a portion of a first major surface adjacent to the ground plane and a second major surface opposite and separated from the first surface. A shield is formed on the second major surface. At least one via extends through the dielectric layer to connect the shield to the ground plane. A feed line extends longitudinally through the dielectric layer from a feed point at a proximal end of the transmission line towards a distal end of the transmission line, the feed line being shielded along a portion of its length extending across the ground plane element by the shield with the distal end of the transmission line lying in register with the radiating element and coupling the feed line to the radiating element.

ELECTRONIC APPARATUS AND ELECTRICAL ELEMENT

An electronic apparatus includes a substrate and an electrical element mounted on the substrate. The electrical element includes a base material including a first principal surface and a second principal surface that are deformable and flat or substantially flat surfaces and a conductor pattern included on the base material. The electrical element further includes a first connection portion and a second connection portion that connect to a circuit included on the substrate and a transmission line portion located in a position different from positions of the first connection portion and the second connection portion that electrically connects the first connection portion and the second connection portion. The conductor pattern includes a conductor pattern of the first connection portion, a conductor pattern of the second connection portion, a conductor pattern of the transmission line portion, and an electrical-element-side bonding pattern arranged in the transmission line portion. 1. An electrical element comprising:a base material, being deformable and including a first principal surface and a second principal surface that are flat or substantially flat surfaces; anda conductor pattern included at the base material; wherein a first connection portion and a second connection portion connecting to a circuit included at a substrate;', 'a transmission line portion, including a plurality of signal conductor patterns and connecting to the first connection portion and the second connection portion; and', 'a bonding pattern located in a position different from positions of the first connection portion and the second connection portion and connecting to a conductor included at the substrate;, 'the conductor pattern includesthe first connection portion, the second connection portion, and the bonding pattern are exposed on the first principal surface of the base material.2. The electrical element according to claim 1 , wherein the base material further includes a bending ...

Waveguide device, electromagnetic radiation confinement device, antenna device, microwave chemical reaction device, and radar device

A waveguide device includes a first electrical conductor including a first electrically conductive surface extending along first and second directions, a second electrical conductor including a second electrically conductive surface opposing the first electrically conductive surface, a waveguide located between the first electrical conductor and the second electrical conductor and extending along the first direction, the waveguide including an electrically-conductive waveguide surface opposing the first electrically conductive surface, and a plurality of electrically-conductive rod rows located on opposite sides of the waveguide, each rod row including a plurality of electrically conductive rods arranged along the first direction. At least one of the first electrical conductor and the second electrical conductor includes at least one hole.

LOW LOSS AND LOW CROSS TALK TRANSMISSION LINES USING SHAPED VIAS

Embodiments of the invention include a packaged device with transmission lines that have an extended thickness, and methods of making such device. According to an embodiment, the packaged device may include a first dielectric layer and a first transmission line formed over the first dielectric layer. Embodiments may then include a second dielectric layer formed over the transmission line and the first dielectric layer. According to an embodiment, a first line via may be formed through the second dielectric layer and electrically coupled to the first transmission line. In some embodiments, the first line via extends substantially along the length of the first transmission line. 1. A packaged device , comprising:a stack of dielectric layers;a first transmission line within the stack of dielectric layers, wherein the first transmission line has a shape, wherein the shape comprises an I-shaped cross-section; anda second transmission line within the stack of dielectric layers, wherein the second transmission line comprises the shape.2. The packaged device of claim 1 , wherein the first transmission line and the second transmission line are a differential signal pair.3. The packaged device of claim 1 , wherein a minimum spacing between the first transmission line and the second transmission line is approximately 10 μm or less.4. The packaged device of claim 1 , wherein the first transmission line and the second transmission line extend entirely through a first dielectric layer of the stack of dielectric layers claim 1 , and wherein the first transmission line and the second transmission line extend at least partially into a second dielectric layer of the stack of dielectric layers.5. The packaged device of claim 1 , wherein the shape comprises a cross-section with a plurality of stacked I-shapes.6. The packaged device of claim 1 , wherein the shape comprises an I-shaped cross-section along substantially the entire length of the first transmission line and substantially ...

SIGNAL TRANSMISSION LINE

A signal transmission line includes a laminate, a signal conductor, a hollow portion, and a reinforcing conductor. The laminate includes a flexible laminate including resin layers each of which has flexibility. The signal conductor extends in a signal transmission direction of the laminate and is disposed in an intermediate position in a laminating direction of the resin layers. The hollow portion is in the laminate and defined by an opening provided at a portion of the plurality of resin layers. The reinforcing conductor is in the laminate. The hollow portion is disposed at a position overlapping with the signal conductor, in a plan view of the laminate from a surface perpendicular or substantially perpendicular to the laminating direction. The reinforcing conductor is disposed at a position different from the position of the hollow portion in a plan view. 1. A signal transmission line comprising:a flexible laminate;a signal conductor; anda hollow portion; whereinthe flexible laminate includes a plurality of resin layers, each of which has flexibility;the flexible laminate includes, in a signal transmission direction, a portion including the hollow portion and a portion including no hollow portion, and the portion including no hollow portion is a bent portion;the signal conductor extends in the signal transmission direction of the flexible laminate and is provided in an intermediate position in a laminating direction in which the plurality of resin layers are laminated to one another; andthe hollow portion is provided in the flexible laminate and is disposed at a position that overlaps with the signal conductor, in a plan view of the flexible laminate from a surface perpendicular or substantially perpendicular to the laminating direction.2. The signal transmission line according to further comprising:a ground conductor; whereinthe ground conductor faces the signal conductor with the hollow portion interposed therebetween in the laminating direction.3. The signal ...

COAXIAL TRANSMISSION LINE INCLUDING ELECTRICALLY THIN RESISTIVE LAYER AND ASSOCIATED METHODS

A coaxial transmission line, e.g. a coaxial cable, includes an inner electrical conductor, an outer electrical conductor, a dielectric region between the inner electrical conductor and the outer electrical conductor, and an electrically thin resistive layer within the dielectric region and concentric with the inner electrical conductor and the outer electrical conductor. The electrically thin resistive layer is a resistive layer configured to be transparent to a substantially transverse-electromagnetic (TEM) mode of transmission, while absorbing higher order modes of transmission. 1. A signal transmission line comprising:a first electrical conductor;a second electrical conductor;a dielectric region between the first electrical conductor and the second electrical conductor; andan electrically thin resistive layer disposed within the dielectric region and disposed between the first electrical conductor and the second electrical conductor, the electrically thin resistive layer being configured to be substantially transparent to a substantially transverse-electromagnetic (TEM) mode of transmission while substantially completely attenuating higher order modes of transmission.2. The signal transmission line of claim 1 , wherein an electric field exists between the first electrical conductor and the second electrical conductor claim 1 , the electric field having electric field lines that are perpendicular to the electrically thin resistive layer at each point of contact with the electrically thin resistive layer.3. The signal transmission line of claim 2 , wherein the first electrical conductor is substantially surrounded by the second electrical conductor claim 2 , and is substantially located at a geometric center of the second electrical conductor.4. (canceled)5. (canceled)6. The signal transmission line of claim 1 , wherein the dielectric region comprises:a first dielectric layer disposed between the first electrical conductor and the electrically thin resistive layer; ...

HIGH-FREQUENCY SIGNAL TRANSMISSION LINE AND ELECTRONIC APPARATUS

An easily bendable high-frequency signal transmission line includes a dielectric body including a protection layer and dielectric sheets laminated on each other, a surface and an undersurface. A signal line is a linear conductor disposed in the dielectric body. A ground conductor is disposed in the dielectric body, faces the signal line via the dielectric sheet, and continuously extends along the signal line. A ground conductor is disposed in the dielectric body, faces the ground conductor via the signal line sandwiched therebetween, and includes a plurality of openings arranged along the signal line. The surface of the dielectric body on the side of the ground conductor with respect to the signal line is in contact with a battery pack. 1. (canceled)2. A high-frequency signal transmission line comprising:an element assembly including one or more insulating layers, and a first main surface and a second main surface;a linear signal line disposed in the element assembly;a first ground conductor facing the signal line and continuously extending along the signal line, the first ground conductor being located on or at a side of the first main surface with respect to the signal line; anda second ground conductor facing the first ground conductor via at least one of the one or more insulating layers, the second ground conductor being located on or at a side of the second main surface with respect to the signal line; whereinthe element assembly includes a connection portion used for external connection, and a transmission line portion where the first ground conductor extends along the signal line;the first main surface of the element assembly is a contact surface with an article; andthe first ground conductor is electrically connected to the article by connection between the transmission line and the article via solder or a conductive adhesive.3. The high-frequency signal transmission line according to claim 2 , wherein the element assembly further includes a protection ...

HIGH-FREQUENCY TRANSMISSION LINE AND ELECTRONIC DEVICE

A transmission line portion of a flat cable includes first regions and second regions connected alternately. In the first region, the transmission line portion is a flexible tri-plate transmission line including a dielectric element including a signal conductor, a first ground conductor including opening portions, and a second ground conductor which is a solidly filled conductor. In the second region, the transmission line portion is a hard tri-plate transmission line including a wide dielectric element including a meandering conductor, and a first ground conductor and a second ground conductor which are solidly filled conductors. A variation width of the characteristic impedance in the second region is larger than a variation width of the characteristic impedance in the first region.

HIGH-FREQUENCY SIGNAL LINE, METHOD FOR PRODUCING SAME, AND ELECTRONIC DEVICE

A high-frequency signal line includes a laminate of a plurality of insulator layers, a signal line provided on a first principal surface of one of the insulator layers, a first ground conductor provided on a second principal surface of the insulator layer provided with the signal line, the first ground conductor including openings that overlap with the signal conductor, and a second ground conductor provided in or on the laminate so as to be opposed to the first ground conductor with the signal conductor positioned therebetween.

ELECTRONIC APPARATUS AND ANTENNA DEVICE

An electronic apparatus includes an antenna device, a circuit board, and a housing containing the antenna device and the circuit board. The inner surface of the housing is spaced apart from the circuit board. The antenna device includes an antenna unit, a matching circuit unit connected to the antenna unit, a transmission line unit connected to the matching circuit unit, and a connecting portion included in the transmission line unit. The antenna device is disposed along the inner surface of the housing. The connecting portion is connected to a circuit of the circuit board. The antenna device includes a ground connection portion in the matching circuit unit in a region where the antenna device is disposed along the inner surface of the housing. The ground connection portion electrically connects a second ground conductor of the antenna device to a first ground conductor on the housing. 1. An electronic apparatus comprising:an antenna device;a circuit board including a circuit; anda housing containing the antenna device and the circuit board; whereinan inner surface of the housing and the circuit board are spaced from each other by a distance;the housing includes a first ground conductor; an antenna unit;', 'a matching circuit unit connected to the antenna unit;', 'a transmission line unit connected to the matching circuit unit; and', 'a connecting portion included in the transmission line unit and connected to the circuit of the circuit board;, 'the antenna device includesthe antenna unit, the matching circuit unit, the transmission line unit, and the connecting portion are disposed in a single substrate;the antenna device is at least partly disposed along the inner surface of the housing;at least one of the matching circuit unit and the transmission line unit includes a second ground conductor, and includes a ground connection portion at least in a portion of a surface of a region where the antenna device is disposed along the inner surface of the housing; andthe ...

LOW LOSS AND LOW CROSS TALK TRANSMISSION LINES USING SHAPED VIAS

Embodiments of the invention include a packaged device with transmission lines that have an extended thickness, and methods of making such device. According to an embodiment, the packaged device may include a first dielectric layer and a first transmission line formed over the first dielectric layer. Embodiments may then include a second dielectric layer formed over the transmission line and the first dielectric layer. According to an embodiment, a first line via may be formed through the second dielectric layer and electrically coupled to the first transmission line. In some embodiments, the first line via extends substantially along the length of the first transmission line. 1. A packaged device , comprising: a conductive shield; and', 'a transmission line formed inside the conductive shield., 'a coaxial transmission line integrated into a dielectric package substrate, comprising2. The packaged device of claim 1 , wherein the conductive shield comprises:a first conductive pad formed over a first substrate layer;a first dielectric layer formed over the first conductive pad and the first substrate layer;a pair of first line vias formed through the first dielectric layer and coupled to opposite ends of the first conductive pad;a pair of first intermediate wall lines each formed over one of the first line vias;a second dielectric layer formed over the first dielectric layer and over the first intermediate wall lines;a pair of second line vias each coupled to one of the first intermediate wall lines; anda second conductive pad formed over the second dielectric layer and coupled to each of the second line vias.3. The packaged device of claim 1 , wherein at least a portion of the transmission line extends along a vertical direction within the package substrate.4. The packaged device of claim 1 , wherein a plurality of transmission lines are formed within the conductive shield.5. The packaged device of claim 4 , wherein a first transmission line and a second transmission ...

COAXIAL WIRING DEVICE AND TRANSMISSION/RECEPTION INTEGRATED SPLITTER

Conventional coaxial wiring devices present a problem in that the management of the manufacturing process therefor is difficult. A coaxial wiring device according to the present invention includes a first member, a second member, and a conductor plate. The first member () and the second member () include, when a line that connects a first port and a second port is denoted by a reference line, a first groove () that has a central point on the reference line and extends in a direction that intersects with the reference line; a second groove () that connects one end (FN) of the first groove () and the first port; a third groove () that connects the other end (FN) of the first groove () and the first port and has a shape that is line symmetrical to the second groove () with respect to the reference line; a fourth groove () that connects one end (FN) of the first groove () and the second port; and a fifth groove () that connects the other end (FN) of the first groove () and the second port and has a shape that is line symmetrical to the fourth groove () with respect to the reference line. 17-. (canceled)8. A coaxial wiring device comprising a first metallic member ,a second metallic member opposed to the first member, a conductor plate that is provided to be held between the first metallic member and the second metallic member,a coaxial wire that is formed in the conductor plate, anda first port and a second port that are provided on respective ends of the coaxial wire,wherein:a high-frequency signal is transmitted between the first port and the second port by the coaxial wire and grooves formed in the first metallic member and the second metallic member, andthe coaxial wire is formed in a bent shape and whit a centrosymmetric figure.9. The coaxial wiring device according to claim 8 , wherein the grooves is formed when the front surface of the conductor plate contact with the first metallic member and the back surface of the conductor plate contact with the second ...

HIGH-FREQUENCY SIGNAL TRANSMISSION LINE AND ELECTRONIC DEVICE

A high-frequency signal transmission line includes an element, a linear signal line provided at the element and including a first end and a second end, and at least one ground conductor provided at the element and extending along the signal line. The element includes stacked insulating layers. The ground conductor is positioned opposite to the signal line with the insulating layer positioned therebetween. The ground conductor is a contiguous conductor. The signal line, the ground conductor, and the element generate a characteristic impedance. The signal line includes a first section and a second section. The first section is an uninterrupted section generating a characteristic impedance greater than or equal to a first characteristic impedance at the first end and including the first end. The second section generates a characteristic impedance less than the first characteristic impedance and is adjacent to the first section. The second section is longer than the first section. The signal line is wider in the second section than in the first section. 1. A high-frequency signal transmission line comprising:an element;a linear signal line provided at the element and including a first end and a second end;andat least one ground conductor provided at the element and extending along the signal line; whereinthe element includes stacked insulating layers;the ground conductor is positioned opposite to the signal line with the insulating layer positioned therebetween;the ground conductor includes a plurality of openings arranged along the signal line;the signal line, the ground conductor, and the element generate a characteristic impedance;the signal line includes a first section and a second section, the first section being an uninterrupted section generating a characteristic impedance greater than or equal to a first characteristic impedance at the first end and including the first end, the second section generating a characteristic impedance less than the first ...

WELL THERMALIZED STRIPLINE FORMATION FOR HIGH-DENSITY CONNECTIONS IN QUANTUM APPLICATIONS

A stripline that is usable in a quantum application (q-stripline) includes a first polyimide film and a second polyimide film. The q-stripline further includes a first center conductor and a second center conductor formed between the first polyimide film and the second polyimide film. The q-stripline has a first pin configured through the second polyimide film to make electrical and thermal contact with the first center conductor. 1. A stripline that is usable in a quantum application (q-stripline) comprising:a first polyimide film;a second polyimide film;a first center conductor and a second center conductor formed between the first polyimide film and the second polyimide film; anda first pin configured through the second polyimide film to make electrical and thermal contact with the first center conductor, wherein the q-stripline is configured to provide less than −50 decibels of microwave crosstalk between the first center conductor and the second center conductor.2. The q-stripline of claim 1 , wherein a thickness of the first polyimide film is at least half of a specified insulator thickness B.3. The q-stripline of claim 2 , wherein the insulator thickness B is selected such that three times the sum of a first dimension of the first center conductor and a separation distance between the first center conductor and the second conductor is greater than twice of the insulator thickness B to yield a microwave crosstalk of less than −50 decibels between the first center conductor and the second center conductor.4. The q-stripline of claim 1 , further comprising:a first recess in the second polyimide film, wherein the first recess is formed through a second ground plane and the second polyimide film to expose a portion of the first center conductor, and wherein the first pin is configured through the first recess.5. The q-stripline of claim 1 , further comprising:an elastic pin, wherein the elastic pin is used as the first pin, and wherein the elastic pin makes the ...

ELECTRONIC APPARATUS AND ELECTRICAL ELEMENT

An electronic apparatus includes a substrate and an electrical element mounted on the substrate. The electrical element includes a base material including a first principal surface and a second principal surface that are deformable and flat or substantially flat surfaces and a conductor pattern included on the base material. The electrical element further includes a first connection portion and a second connection portion that connect to a circuit included on the substrate and a transmission line portion located in a position different from positions of the first connection portion and the second connection portion that electrically connects the first connection portion and the second connection portion. The conductor pattern includes a conductor pattern of the first connection portion, a conductor pattern of the second connection portion, a conductor pattern of the transmission line portion, and an electrical-element-side bonding pattern arranged in the transmission line portion. 2. The electrical element according to claim 1 , wherein the bonding pattern is at least provided in a vicinity of the first connection portion of the transmission line portion or in a vicinity of the second connection portion of the transmission line portion.3. The electrical element according to claim 1 , wherein the bonding pattern includes a portion that is bent in the surface direction of the base material along the bending portion in a plan view.4. The electrical element according to claim 2 , wherein the bonding pattern is at least provided in a range from a boundary between the first connection portion and the transmission line portion to one-third of a length in an extending direction of the transmission line portion or in a range from a boundary between the second connection portion and the transmission line portion to one-third of the length in the extending direction of the transmission line portion.5. The electrical element according to claim 1 , wherein the transmission line ...

ANTENNA DEVICE

A ground conductor () having slots (to ) for radiating electromagnetic waves, a ground conductor () in which cavities () recessed in a direction away from the ground conductor () is formed in positions opposite to the slots (to ) of the grounding conductor (), and central conductors (to , and ) arranged in positions overlapping with the slots (to ), respectively, between the ground conductor () and the ground conductor () are provided. The central conductors (to , and ) are arranged such that the ground conductor () is closer to them than the ground conductor (). 111-. (canceled)12. An antenna device comprising:a first ground conductor having a slot for radiating an electromagnetic wave;a second ground conductor on which a cavity recessed in a direction away from the first ground conductor is formed in a position opposite to the slot of the first ground conductor;a first central conductor arranged between the first ground conductor and the second ground conductor in a position overlapping with the slot, the first central conductor being arranged such that the first ground conductor is closer to the first central conductor than the second ground conductor; anda disturbing conductor disturbing an electromagnetic field between the first ground conductor and the second ground conductor.13. The antenna device according to claim 12 , wherein a plurality of antenna elements is arrayed in two-dimensional arrangement claim 12 , each of the plurality of antenna elements including the slot of the first ground conductor and the first central conductor.14. An antenna device comprising:a first ground conductor having a slot for radiating an electromagnetic wave;a second ground conductor on which a cavity recessed in a direction away from the first ground conductor is formed in a position opposite to the slot of the first ground conductor;a first central conductor arranged between the first ground conductor and the second ground conductor in a position overlapping with the slot; ...

Mixer circuit

Vertical coplanar waveguide with tunable characteristic impedance, its design structure, and its fabrication method

고 임피던스 트레이스

본 발명은 마이크로파 전도 구조물(46a, 48b) 및 이러한 구조물을 생성하기 위한 방법과 관련되며, 상기 구조물은 제1 전기 전도층(L32), 상기 제1 전기 전도층(L32) 위에 배열되는 제1 유전 상수를 갖는 제1 유전체 기판(D31) 및 상기 유전체 기판(D31) 상에 또는 내에 배열되는 제1 폭을 갖는 적어도 하나의 전기 전도성 트레이스(CT1, CT2)를 포함한다. 상기 제1 폭보다 넓은 제2 폭 및 상기 제1 유전 상수보다 낮은 제2 유전 상수를 갖는 제2 유전체 기판(DM1, DM2)의 트랙은 상기 전도성 트레이스(CT1, CT2)를 따라 연장되도록 상기 제1 유전체 기판(D31)과 상기 전도성 트레이스(CT1, CT2) 사이에 국지적으로 배열되어, 상기 전도성 트레이스(CT1, CT2)가 전기적으로 상기 제2 유전체 기판(DM1, DM2) 상에 배열되는 것처럼 동작하게 한다.

High speed electrical interconnects and method of manufacturing

High-speed interconnect systems for connecting two or more electrical elements are provided. Interconnect system has the means, which could reduce the microwave loss induced due to the dielectrics. Reducing the effective loss tangent of the dielectrics reduces the microwave loss. With optimize design of the interconnects, the speed of the electrical signal can be made to closer to the speed of the light. The interconnect systems consists of the electrical signal line, inhomogeneous dielectric systems and the ground line, wherein inhomogeneous dielectric system consisting of the opened-trenches into the dielectric substrate or comb-shaped dielectrics to reduce the microwave loss. Alternatively dielectric structure can have the structure based on the fully electronic or electromagnetic crystal or quasi crystal with the line defect. Alternatively, dielectric structure can be made to comb-shaped structure with teethes having thickness and space making the air pocket to reduce the microwave loss. The interconnect system, can be made in rigid or flex board for off-chip interconnects for IC packages, connectors and cables, where conventional manufacturing technology can be used and yet to increase the bandwidth of the interconnects.

Waveguide device, electromagnetic wave locking device, antenna device, and radar device

本发明提供波导装置、电磁波锁定装置、天线装置以及雷达装置。波导装置能够在用于锁定电磁波的结构部件开设孔。波导装置具有：第1导电部件，其具有沿第1方向以及第2方向扩展的第1导电性表面；第2导电部件，其具有与所述第1导电性表面相对的第2导电性表面；波导部件，其位于所述第1导电部件与所述第2导电部件之间，并沿所述第1方向延伸，所述波导部件具有与所述第1导电性表面相对的导电性的波导面；以及导电性的多个杆列，该多个杆列位于所述波导部件的两侧，各杆列包含沿所述第1方向配置的多个导电性杆。所述第1导电部件以及所述第2导电部件中的至少一方具有至少一个孔。

Structure and wiring substrate

提出了一种结构体，包括：第一导体(102)和第二导体(103)，所述第一导体的至少一部分与所述第二导体的至少一部分彼此相对；第三导体(101)，所述第三导体插入到所述第一导体(102)与所述第二导体(103)之间，所述第三导体的至少一部分与所述第一导体(102)和所述第二导体(103)相对，并且所述第三导体具有第一开口(105)；互连(111)，设置在所述第一开口(105)的内部；以及导体过孔(121)，所述导体过孔与所述第一导体(102)和所述第二导体(103)电连接，并且与所述第三导体(101)电绝缘，其中所述互连(111)与所述第一导体(102)和所述第二导体(103)相对，所述互连的一端在所述第一开口(105)的边缘处与所述第三导体(101)电连接，并且所述互连的另一端形成为开路端。

Device apparatus using of meta-structure

The existing technology has problems of using only expensive materials having an absorption feature for absorbing electromagnetic waves; having difficulty for the commercialization of a chemical component or molecular structures of the materials; and using a narrow field. The embodiment of the present invention is provided to block the leakage of the electromagnetic waves generated in the terminal by using a meta-structure having an electromagnetic wave absorption function; minimize the health impacts caused by the electromagnetic waves generated in the terminal; and reuse the leakage of the electromagnetic waves generated in the terminal as power. The embodiment of the present invention provides technology capable of paralleling an electromagnetic wave aggregation function and a wireless power collection function by combining the meta-structure with a wireless power transmission system. [Reference numerals] (300) Recycling unit

Anti-lightning-combined-stripline-circuit system

FIELD: electricity. SUBSTANCE: invention relates to the field of lightning protection combined systems. This anti-lightning-combined-stripline-circuit system contains a stripline board with circuitry and a metal ground bar attached to the stripline board, moreover, the metal ground bar has a thickness and width corresponding to the cross section, moreover, the cross section is sufficient for the metal ground bar to function as a ground for the circuitry and at the same time as lightning ground for a linear array of elements driven by the circuitry. EFFECT: technical result is ensuring the protection of an electrical circuitry located in outdoor environment. 20 cl, 18 dwg РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) (13) 2 681 370 C2 (51) МПК H01P 3/08 (2006.01) H02H 1/04 (2006.01) H01Q 23/00 (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ОПИСАНИЕ ИЗОБРЕТЕНИЯ К ПАТЕНТУ (52) СПК H01P 3/08 (2006.01); H02H 1/04 (2006.01); H01Q 23/00 (2006.01); H01Q 21/0075 (2006.01); H05K 1/142 (2006.01); H01Q 1/50 (2006.01) (21)(22) Заявка: 2015100201, 13.01.2015 13.01.2015 Дата регистрации: (73) Патентообладатель(и): ХАНИВЕЛЛ ИНТЕРНЕШНЛ ИНК. (US) 06.03.2019 (56) Список документов, цитированных в отчете о поиске: US 6362787 B1, 26.03.2002. US 15.01.2014 US 14/155,906 (43) Дата публикации заявки: 10.08.2016 Бюл. № 22 5808529 A, 15.09.1998. WO 95/23441 A1, 31.08.1995. US 6753814 B2, 22.06.2004. WO 97/ 08776 A1, 06.03.1997. RU 2210845 C1, 20.08.2003. Адрес для переписки: 119019, Москва, Гоголевский бульвар, дом 11, "Гоулингз Интернэшнл Инк.", Т.Н. Лыу R U (54) МОЛНИЕЗАЩИТНАЯ КОМБИНИРОВАННАЯ СИСТЕМА С ПОЛОСКОВОЙ СХЕМНОЙ ПЛАТОЙ (57) Реферат: Изобретение относится к области причем металлический заземляющий стержень молниезащитных комбинированных систем. имеет толщину и ширину, соответствующие Технический результат – обеспечение защиты поперечному сечению, причем поперечное сечение электрической схемы, находящейся в условиях является достаточным для того, чтобы внешней среды. ...

High frequency transmission line using printed circuit board for improving MIMO anntena system

본 발명은 다중대역 안테나 성능개선을 위한 인쇄회로기판을 이용한 고주파 전송선로에 관한 것으로, 한 방향으로 신장되고 다수개의 안테나와 전기적으로 연결되는 제1그라운드레이어(110)와, 상기 제1그라운드레이어(110) 상에 적층되고 상기 제1그라운드레이어(110)와 동일한 방향으로 신장되는 제1유전체레이어(120)와, 상기 제1유전체레이어(120) 상에 적층되고 상기 제1유전체레이어(120)와 동일한 방향으로 신장되어 상기 다수개의 안테나의 전기신호를 전송하는 신호전송라인(130)이 적층되어 구성되고, 상기 제1그라운드레이어(110)는 상기 다수개의 안테나와 각각 독립적으로 연결되는 다수개의 접지부로 분리되고, 상기 제1그라운드레이어(110)의 분리에 의한 RF특성 저하는 상기 다수개의 접지부 사이에 해당하는 위치에 구비된 상기 제1그라운드레이어(110)의 보상부 또는 상기 신호전송라인(130)의 보완부 형상에 의해 개선된다. The present invention relates to a high frequency transmission line using a printed circuit board for improving the performance of a multi-band antenna, a first ground layer (110) extending in one direction and electrically connected to a plurality of antennas, and the first ground layer ( A first dielectric layer 120 stacked on the first ground layer 110 and extending in the same direction as the first ground layer 110, a first dielectric layer 120 stacked on the first dielectric layer 120, and the first dielectric layer 120. Signal transmission lines 130 extending in the same direction and transmitting electrical signals of the plurality of antennas are stacked and configured, and the first ground layer 110 is a plurality of ground portions independently connected to the plurality of antennas, respectively. The first ground layer provided at a position corresponding to the plurality of ground portions separated from each other and deteriorating RF characteristics by the separation of the first ground layer 110. It is improved by the shape of the compensator of (110) or the complement of the signal transmission line (130).

snap radio frequency connector interconnect

Electric connector with low crosstalk and impedance control, cable set

在具有侧面与接地面相接的多个信号触头的条线排列的电连接器中，改善包括：信号触头具有由侧面和边缘限定的细长截面，所述侧面在接地面之间横向延伸。用于减小串扰并控制阻抗的电连接器包括：绝缘外壳、接地面以及多个触头。每个触头具有细长截面和用于啮合配合连接器的触头的配合部分。所述细长截面至少在所述配合部分中横向延伸至接地面。所述触头保持基本上沿所述触头长度至接地面的通常统一角度。

INTEGRATED MICROSTRIP AND SUBSTRATE INTEGRATED WAVEGUIDE CIRCULATORS/ISOLATORS FORMED WITH CO-FIRED MAGNETIC-DIELECTRIC COMPOSITES

Disclosed are embodiments of microstrip and substrate integrated waveguide circulators/isolators which can be integrated with a substrate. This composite structure can serve as a platform for other components, allowing for improved miniaturization of components. Embodiments of the disclosure can be particular advantageous in the high frequency ranges, such as above 1.8 GHz or above 3 GHz, which allows devices to be used in the 5G space.

Production of strip line

(57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。

Electrical connector and electrical cable assembly with low crosstalk and controlled impedance

(57)【要約】 導電（２２０，３５２；３８６，３８８）および絶縁部材（１４６，３２２；３７０）が複合Ｉビーム状形状部に配置され、この導電部材（２２０，３５２；３６８，３８８）が２つの平行な絶縁および接地面部材（１４６，３２２；３７０）間に垂直に配置される電気コネクタ（９０，９２）および電気ケーブル組立体（３７０）を開示する。この形状寸法を用いることから、低クロストークおよび制限されたインピーダンスが形成される。

Low Cross Talk and Impedance Controlled Electrical Connector and Electrical Cable Assembly

Structural body and wiring substrate

互いに少なくとも一部が対向する第１導体（１０２）および第２導体（１０３）と、第１導体（１０２）および第２導体（１０３）に挟まれ、少なくとも一部が第１導体（１０２）および第２導体（１０３）と対向し、かつ、第１開口（１０５）を有する第３導体（１０１）と、第１開口（１０５）の内部に設けられた配線（１１１）と、第１導体（１０２）および第２導体（１０３）と電気的に接続され、かつ、第３導体（１０１）と電気的に絶縁された導体ビア（１２１）とを備え、配線（１１１）は、第１導体（１０２）および第２導体（１０３）と対向し、その一端が第１開口（１０５）の縁で第３導体（１０１）と電気的に接続され、他端が開放端となっていることを特徴とする構造体。

METHOD FOR MANUFACTURING A CONNECTION ZONE FOR A TRIPLATE-TYPE MICROWAVE CIRCUIT AND CIRCUIT THUS OBTAINED

Ferrite dielectrics - for high frequency stripline substrates

Cpds. of general formula X xLO, yR2O3, Z(TO2.Qo) Y.(TO2.2NO) where X+Y=100, 90 Y 100, 0.96 = x =1.04, 0.01 =z =0.9 and y+z=2-x are prepared by mixing the component oxides, pressing and firing in air or oxygen. L, Q and N are bivalent metals such as Fe2+ Ni2+, Co2+, Mn2+; R is a trivalent metal such as Fe3+, Cr3+; T is a tetravalent metal e.g. Ti4+. More specifically the general formula X 0.96 MgO, 0.18 MnO, 0.8 Fe2O3, 0.1(TiO2.NiO) Y(TiO2.2MgO) where X+Y=100, 90 Y 100. The materials possess low dielectric loss at high frequencies.

Complex integrated microwave circuit - is made by assembling elementary sub-circuits on own substrates

L'invention concerne les circuits micro-ondes à plusieurs fonctions. Elle consiste à diviser le circuit complexe en circuits élémentaires que l'on peut exécuter sur des substrats séparés au moyen de la technologie micro-ondes intégrée; à exécuter les circuits élémentaires ainsi définis et à empiler les substrats avant de les placer dans un boîtier. L'invention est applicable à tous les circuits micro-ondes réalisant une succession d'opérations nécessaires à une ou plusieurs fonctions.

CONNECTING DEVICE FOR A COAXIAL CABLE CARRYING HIGH FREQUENCY SIGNAL.

Microwave balanced mixer

Patent FR2496996B1

COMPACT RADIANT ELEMENT WITH LOW LOSSES

CONNECTING DEVICE FOR A COAXIAL CABLE CARRYING HIGH FREQUENCY SIGNAL.

La présente invention a pour objet un dispositif de connexion entre une ligne multicouche, comprenant une piste conductrice et au moins un plan de masse, et un câble coaxial transportant un signal haute fréquence, comprenant un conducteur interne et un conducteur externe, le dispositif de connexion comportant un moyen de fixation et un moyen de liaison électrique entre le câble coaxial et le plan de masse de la ligne multicouche. Le moyen de liaison électrique comprend une surface conductrice disposée en regard du plan de masse de la ligne multicouche dont elle est séparée par une couche de matériau diélectrique, de manière à établir une liaison électrique capacitive. The present invention relates to a connection device between a multilayer line, comprising a conductive track and at least one ground plane, and a coaxial cable carrying a high frequency signal, comprising an inner conductor and an outer conductor, the connection device comprising a fixing means and an electrical connection means between the coaxial cable and the ground plane of the multilayer line. The electrical connection means comprises a conductive surface disposed facing the ground plane of the multilayer line from which it is separated by a layer of dielectric material, so as to establish a capacitive electrical connection.

HYPERFREQUENCY TRANSMISSION LINE OF THE AIR TRIPLAQUE TYPE AND USES THEREOF

LA PRESENTE INVENTION CONCERNE UNE LIGNE DE TRANSMISSION HYPERFREQUENCE DU TYPE TRIPLAQUE A AIR. LA LIGNE DE TRANSMISSION COMPORTE DEUX PLAQUES CONDUCTRICES 2A, 2B PARALLELES, L'ESPACE SEPARANT CES DEUX PLAQUES ETANT REMPLI D'AIR, UN RUBAN CENTRAL CONDUCTEUR 3 INTERPOSE ENTRE LES DEUX PLAQUES, ET UNE PLURALITE DE SUPPORTS 5 EN MATERIAU DIELECTRIQUE DISTRIBUES LE LONG DE CHAQUE COTE DU RUBAN, CHAQUE SUPPORT 5 COMPORTANT UNE ENCOCHE DANS CHACUNE DESQUELLES EST POSITIONNE LE RUBAN 3 DE FACON A ETRE MAINTENU EN PLACE. L'INVENTION S'APPLIQUE NOTAMMENT A UN DIVISEUR DE PUISSANCE ALIMENTANT UN ENSEMBLE DE SOURCES RAYONNANTES DISPOSEES EN ALIGNEMENT. THE PRESENT INVENTION CONCERNS A HYPERFREQUENCY TRANSMISSION LINE OF THE TRIPLE AIR TYPE. THE TRANSMISSION LINE INCLUDES TWO CONDUCTIVE PLATES 2A, 2B PARALLEL, THE SPACE SEPARATING THESE TWO PLATES BEING FILLED WITH AIR, A CENTRAL CONDUCTIVE TAPE 3 INTERPOSED BETWEEN THE TWO PLATES, AND A PLURALITY OF SUPPORTS 5 IN DIELECTRIC DISTRIBUTED MATERIAL EACH SIDE OF THE RIBBON, EACH BRACKET 5 INCLUDING A NOTCH IN EACH OF WHICH THE RIBBON 3 IS POSITIONED SO AS TO BE HELD IN PLACE. THE INVENTION IS APPLIED IN PARTICULAR TO A POWER DIVIDER FEEDING A SET OF RADIANT SOURCES ARRANGED IN ALIGNMENT.

A transmission line

Substrate with composite medium and multilayer substrate made by the same

本发明公开了一种具有复合介质的基板及其所组成的多层基板，所述基板包括：一第一介电层、一第一讯号信号传输线路以及一第一导体层。此第一介电层具有第一介质区和第二介质区，其中第二介质区系位于第一介电层的表面，并且与第一介质区系是不同介电材料，以及第一讯号信号传输线路系位于第二介电层中，而第一导体层则系位于第一介电层下。于在此，第二介质区的介电常数可高于或低于第一介质区的介电常数，或者系是其介电损耗可低于第一介质区的介电损耗。本发明主要是在介电层中局部分布一种以上的介电材料，也就是说，在信号传输线路周边/上方/下方的介电材料不同于邻近的介电材料，借此以符合于高频电路中的特定需求。

Transmission line and electronic device

主传输线路(10)具备长条状的电介质基体(110)。在电介质基体(110)的内部，在宽度方向上空开间隔地配置有长条状的信号导体(40A、40B)。基准接地导体(20A)和辅助接地导体(30A)配置成在厚度方向上夹着信号导体(40A)。基准接地导体(20B)和辅助接地导体(30B)配置成在厚度方向上夹着信号导体(40B)。辅助接地导体(30A)具备长条导体(31A、32A)和桥接导体(33A)，辅助接地导体(30B)具备长条导体(31B、32B)和桥接导体(33B)。桥接导体(33A、33B)的沿着长条方向的位置互不相同。

Multi-layer microwave circuits and methods of manufacture

A multi-layer circuit board including top (40), middle (24), and bottom (18) dielectric layers, a conductive pattern (44) disposed on the top surface (42) and a ground layer (46) disposed on the bottom surface of the top dielectric layer (40), a conductive pattern (28) disposed on the bottom surface (22) of the middle dielectric layer (24), and a ground layer (30) disposed on the bottom surface (16) of the bottom dielectric layer (18).

Microwave coupling arrangements

Coupler resource module

A coupling assembly includes multiple composite substrate layers and a flange layer fusion bonded together in a stacked arrangement. The substrate layers are positioned on top of the flange layer and include embedded signal processing circuitry connected to a signal input and a signal output. A cavity is formed through an area of the substrate layers to expose signal connection terminals. These signal connection terminals are coupled to the embedded signal processing circuitry and they enable the addition of a circuit element to the assembly after the fusion bonding of the flange and substrate layers, and they enable the coupling of that added element to the signal processing circuitry.

High impedance trace

Coupler resource module

A coupling assembly includes multiple composite substrate layers and a flange layer fusion bonded together in a stacked arrangement. The substrate layers are positioned on top of the flange layer and include embedded signal processing circuitry connected to a signal input and a signal output. A cavity is formed through an area of the substrate layers to expose signal connection terminals. These signal connection terminals are coupled to the embedded signal processing circuitry and they enable the addition of a circuit element to the assembly after the fusion bonding of the flange and substrate layers, and they enable the coupling of that added element to the signal processing circuitry.

MECHANICAL HOLDING PIECE FOR HYPERFREQUENCY TRANSMISSION LINE, PARTICULARLY TYPE TRIPLAQUE

L'invention concerne une pièce de maintien mécanique pour ligne de transmission hyperfréquence, notamment du type triplaque. La pièce de maintien mécanique comprend un cadre 2 en matériau diélectrique de forme rectangulaire. Deux côtés parallèles comportent à l'intérieur et au milieu deux encoches 21 en vis-à-vis dans lesquelles est enfilé le ruban conducteur intérieur 1 de la ligne. Les plans de masse sont en contact avec les deux autres côtés du cadre. Ces côtés portent des plots 22 venant s'engager dans des trous correspondants des plans de masse et assurant le centrage et l'assemblage par exemple par sertissage. L'invention s'applique particulièrement aux lignes triplaques à air.

High frequency transmission line

High-frequency semiconductor device

본 발명은 차단 주파수를 낮추지 않고 또한 방열의 문제도 적은, 고주파용 반도체 장치를 제공하는 것을 목적으로 한다. An object of the present invention is to provide a high frequency semiconductor device which does not lower the cutoff frequency and has less heat dissipation problem. 본 발명의 일례의 고주파용 반도체 장치는, 방열 기능을 갖는 접지 기판과, 이 접지 기판 상에 설치된 고주파용 반도체 소자와, 상기 고주파용 반도체 소자에 접속된 입력측 정합 회로와, 상기 고주파용 반도체 소자에 접속된 출력측 정합 회로와, 적어도 상기 고주파용 반도체 소자, 상기 입력측 정합 회로 및 상기 출력측 정합 회로를 둘러싸는 측벽부와, 상기 입력측 정합 회로에 접속된 입력용 단자와, 상기 출력측 정합 회로에 접속된 출력용 단자를 구비하는 단위 반도체 장치를 2개 구비하고, 상기 2개의 단위 반도체 장치의 상기 측벽부의 상단이 상호 맞춰져 있는 것을 특징으로 한다. A high frequency semiconductor device of an example of the present invention includes a ground substrate having a heat dissipation function, a high frequency semiconductor element provided on the ground substrate, an input side matching circuit connected to the high frequency semiconductor element, and the high frequency semiconductor element. An output side matching circuit connected, at least a side wall portion surrounding the high frequency semiconductor element, the input side matching circuit and the output side matching circuit, an input terminal connected to the input side matching circuit, and an output connected to the output side matching circuit Two unit semiconductor devices including terminals are provided, and upper ends of the side wall portions of the two unit semiconductor devices are aligned with each other.

Push-pull frequency converter in stripline technology

Microwave switching arrangements

Snap-rf interconnections

A radio frequency connector includes a substrate, a first ground plane disposed upon the substrate, a signal conductor having a first contact point, with the first contact point being configured to electrically mate with a second contact point, and a first ground boundary configured to electrically mate with a second ground boundary, with the first ground boundary being formed as an electrically continuous conductor within the substrate.

Transmission line and antenna device

A transmission line has a triplate line including a first outer conductor and a second outer conductor disposed in parallel with each other at a predetermined interval, and a central conductor disposed in a space between the first outer conductor and the second outer conductor; and a dielectric spacer interposed between the first and second outer conductors and the central conductor and configured to support the central conductor. The central conductor has a supported portion supported by the dielectric spacer, and first and second high-impedance portions having characteristic impedances higher than a characteristic impedance in the supported portion. The first and second high-impedance portions are disposed on input and output sides, respectively, of the supported portion.

Low impedance transmission line

Device for measuring e.g. density of electrically activated gas in industry, has probe comprising symmetrical element that is active in passage for converting electrical unsymmetrical signals into symmetrical signals

The device has a probe shaft (5) connected with a signal generator for electrical coupling of a high frequency signal in a probe head (2). The probe head comprises a probe core (8) that is surrounded by a plastic casing (7) or tube. A probe (1) comprises a symmetrical element (9), which is active in transition between the probe head and an electrical unsymmetrical high frequency signal delivery unit (6) i.e. coaxial line, for converting electrical unsymmetrical signals into symmetrical signals. The probe is designed as a multi-layer circuitry based on sintered ceramic carriers.

Temperature compensated integrated circuit type narrowband stripline filter

Fixed impedance low pass metal powder filter with a planar buried stripline geometry

A fixed impedance low pass metal powder filter having a planar buried stripline geometry comprises first and second parallel ground planes spaced from one another and a central stripline spaced equal distance from the first and second parallel ground planes and parallel thereto. The space between the first and second ground planes is filled with a dielectric containing metal powder. The densities of the metal powder within the dielectric are highest near the central stripline and become less near the first and second ground planes. The dielectric is a laminated structure that comprises layers of epoxy impregnated fiberglass, layers having different densities of metal powder.

High-frequency transmission line

A transmission line portion of a high-frequency transmission cable includes a dielectric body in which a first ground conductor, a signal conductor, and a second ground conductor are arranged along a thickness direction of the dielectric body from a first principle surface side. The second ground conductor is arranged at a position that does not overlap the signal conductor when viewed in a direction perpendicular or substantially perpendicular to the first principle surface. The third ground conductor and the signal conductor are located at the same position in the thickness direction of the dielectric body. The second and third ground conductors are connected to the first ground conductor via interlayer-connector conductors. The width of the second and third ground conductors is narrower than the width of the signal conductor, but a sum of the widths of the second and third ground conductors is larger than the width of the signal conductor.

Low-loss electrode for high frequency

High frequency low loss electrode

A high frequency low loss electrode (1) includes a main conductor (20) and at least one sub-conductors (21-23) formed along a side of the main conductor (20). The width of at least one of the sub-conductors (21-23) has a multi-layer structure in which thin-film conductors (21a-21e) and thin-film dielectrics (41a-41d) are alternately laminated.

Multilayer stripline radio frequency circuits and interconnection methods

Sinuously folded quarter wave stripline directional coupler