ФИЛЬТР, ПРЕЖДЕ ВСЕГО ДЛЯ ФИЛЬТРАЦИИ ЭЛЕКТРОМАГНИТНЫХ ПОМЕХ

Изобретение относится к фильтру, прежде всего для фильтрации электромагнитных помех, с базовым элементом (2), по меньшей мере с одним электрическим фильтрующим элементом (3, 4), по меньшей мере с двумя входными соединительными контактами (5) и по меньшей мере с двумя выходными соединительными контактами (6) для подключения провода электрической проводки, при этом входные соединительные контакты (5) соединены с выходными соединительными контактами (6) по расположенным на базовом элементе (2) токопроводящим дорожкам (7). В каждой токопроводящей дорожке (7) предусмотрены два продольных контакта (8), через которые фильтрующий элемент (3, 4) является электрически соединяемым с токопроводящей дорожкой (7) таким образом, что электрическое соединение токопроводящей дорожки (7) между обоими продольными контактами (8) проходит через фильтрующий элемент (3, 4) и что в токопроводящих дорожках (7) предусмотрен в каждом случае по меньшей мере один поперечный контакт (9), так что две токопроводящие дорожки ...

ANORDNUNG MIT GEDRUCKTER SCHALTUNGSPLATTE

LÜCKENÜBERBRÜCKUNGS-BUSSYSTEM

Apparatus and method for high speed signals on a printed circuit board

PRINTED CIRCUIT BOARD

EQUIPMENT FOR THE CONTROLLING OF THE IMPEDANCE OF ELECTRICAL CONTACTS

Access Point Device

This document describes an access point device and associated systems and methods. The techniques and systems include an access point device that includes a housing with an antenna carrier, a circuit board assembly, a heat sink, and a heat shield positioned within the housing. The housing includes a top housing member connected to a bottom housing member. The top housing member includes a concave-down top-end portion connected to a generally cylindrical vertical wall via rounded corners. The antenna carrier supports multiple antennas positioned proximate to an inner surface of the vertical wall. The heat sink is positioned between the antenna carrier and the circuit board assembly. The circuit board assembly is positioned between the heat shield and the heat sink, and the heat shield is positioned between the circuit board assembly and the bottom housing member. 30006900PCT Fig. 1 ...

Element for an electronic assembly

Via stub termination structures and methods for making same

Component mounting method

휴대용 전자 디바이스의 시스템-인-패키지 어셈블리에 대한 열적 솔루션

... 시스템-인-패키지(System-in-Package) 어셈블리로 패키징된 콤팩트한 휴대용 전자 디바이스 및 그 디바이스에 대한 열적 솔루션들이 개시된다. 콤팩트한 휴대용 전자 디바이스는 크기를 줄이고 폼 팩터를 향상시키기 위해 단일 패키지로 조립될 수 있다. 다수의 다이들, 수동 컴포넌트들, 기계적 또는 광학적 컴포넌트들을 포함하는 수십 또는 수백 개의 컴포넌트들이 인쇄 회로 보드 상에 단일 시스템으로 패키징될 수 있다. 컴포넌트들 중 하나 이상은 많은 전력을 소산시켜 과잉 열의 발생을 초래할 수 있다. 과잉 열을 제거하기 위하여, 디바이스는 내부 열적 플러그들, 열 확산기들, 내부 내장형 히트 싱크들, 및/또는 외부 히트 싱크들과 같은 하나 이상의 열적 솔루션들을 포함할 수 있다. 일부 예들에서, 열적 솔루션들은 기판의 하부로의 전도를 통해 또는 시스템의 상부로의 대류를 통해 또는 양측 모두의 조합으로 열을 소산시킬 수 있다.

ELECTRONICS PACKAGE AND MANUFACTURING METHOD THEREOF

A method for manufacturing an electronics package is provided that comprises forming at least one module block by providing a carrier substrate having a recess, placing at least one electronic component die in said recess, filling said recess with a molding material, and depositing a circuit layer connected with said at least one component die. It further provides an electronics package, comprising a carrier substrate having a recess, at least one electronic component die placed in said recess, a molding material filling said recess, and a circuit layer connected with said at least one component die.

WIRING BOARD FOR HIGH FREQUENCY, PACKAGE FOR CONTAINING ELECTRONIC COMPONENT, ELECTRONIC DEVICE AND COMMUNICATION APPARATUS

A wiring board (4) for high frequency comprises a dielectric substrate (4a), a line conductor (4b) for transmitting high frequency signal formed on the first surface of the dielectric substrate (4a) from the connection edge (4bc) to the end (4ba), a grounding conductor (4c) arranged along one side (4bb) of the line conductor (4b) while spaced apart therefrom and to traverse a virtual extension line extending from the end (4ba) in parallel with the line direction of the line conductor (4b).

PRINTED WIRING BOARD WITH BUILT-IN SEMICONDUCTOR ELEMENT, AND PROCESS FOR PRODUCING THE SAME

This invention provides a printed wiring board with a built-in semiconductor element that has excellent adhesion to an overlying wiring board without being adversely influenced by unsatisfactory sealing material packing or excessive sealing material packing. The printed wiring board with a built-in semiconductor element comprises a built-in semiconductor element, in which at least the lower surface, upper surface, or side surface thereof is covered with an insulating film, and an insulating layer is provided on the side and upper part of the semiconductor element. There is also provided a process for producing a printed wiring board with a built-in semiconductor element, comprising the steps of mounting a semiconductor element on a base substrate and covering at least the lower surface, upper surface or side surface of the semiconductor element with an insulating film, disposing and stacking a semicured insulating sheet on the side of the semiconductor element, and disposing and stacking ...

TECHNIQUE FOR ACCOMMODATING ELECTRONIC COMPONENTS ON A MULTILAYER SIGNAL ROUTING DEVICE

A technique for accommodating electronic components on a multilayer signal routing device (100) is disclosed. In one particular exemplary embodiment, the technique may be realized as a method for accommodating electronic components on a multilayer signal routing device (100). Such a method comprises determining a component space that is required to accommodate a plurality of electronic components on a surface of a multilayer signal routing device (100), and then forming at least one signal routing channel (104) on at least the surface of the multilayer signal routing device (100), wherein the at least one signal routing channel (104) has a channel space that is equal to or greater than the component space.

CONDUCTOR ARRANGEMENT FOR GIGAHERTZ FREQUENCY RANGE CIRCUITS

High capacity memory module with higher density and improved manufacturability

The present invention provides a double-sided memory module with improved memory device density and improved manufacturability, and with optional bus terminations mounted directly on the memory module for use with high speed, impedance-controlled memory buses. It also allows the same memory devices to be used on both sides of the card, instead of requiring memory devices with mirrored I/O connections on a second side as on prior art double-sided memory cards. The memory module may be formed on a conventional printed circuit card using cost-effective printed circuit board line widths and spaces with unpacked or packed memory chips attached directly to the memory module, while maintaining good signal integrity. Using memory modules with bus terminations mounted directly on the module improves the signal quality and integrity even further and therefore enhances system performance. Such designs may also eliminate the need for bus exit connections, thereby allowing the freed-up connection capacity ...

Ultra-small resistor-capacitor thin film network for inverted mounting to a surface

A very small electronic device adapted for inverted mounting to a circuit board includes a multiplicity of capacitors and resistors built on a substrate. The capacitors and resistors are interconnected so as to provide multiple RC circuits in various circuit arrangements. The multiple layers of the device are covered by an encapsulate having openings to expose terminal pads of the RC circuits. The openings are filled with solder to produce the individual terminations of the device in a ball grid array (BGA). The device saves cost and/or board space in the manufacture of larger electronic equipment through the elimination of multiple discrete components. In addition, very low inductance is achieved due to the close proximity of the device to a circuit board on which it is mounted.

Apparatus and method for tuning an inter-stage matching network of an integrated multistage amplifier

A tuning circuit for compensating an inter-stage matching network included in an integrated multistage radio frequency (RF) amplifier includes one or more capacitors connected in shunt between ground and a voltage supply to the amplifier. The capacitors have values selected to effectively compensate the inductance from a pull-up inductor included in the inter-stage matching network to provide improved inter-stage matching when inductance and capacitance values of the inter-stage matching network deviate from their desired values due to parasitics and/or when other components, such as input-stage and output-stage transistors of the amplifiers deviate from their pre-fabrication simulation models.

ELECTRONIC DEVICE MODULE

An electronic device module includes a substrate, at least one first component and at least one second component disposed on one surface of the substrate, a shielding wall disposed between the at least one first component and the at least one second component, and disposed on the substrate, and a sealing portion having the at least one first component, the at least one second component and the shielding wall embedded therein, and disposed on the substrate. The shielding wall includes at least one insulating layer and at least one conductive layer disposed on the insulating layer.

Absorber assemblies having a dielectric spacer, and corresponding methods of assembly

Exemplary embodiments are provided of absorber assemblies having dielectric spacers. In an exemplary embodiment, an absorber assembly includes a printed circuit board and a differential line disposed on the printed circuit board. The differential line includes a first trace and a second trace opposite the first trace. The assembly also includes a dielectric spacer coupled to the printed circuit board and covering at least a portion of the differential line, and an absorber coupled to the dielectric spacer to inhibit electromagnetic interference radiation from the differential line. Example methods of assembling an electromagnetic interference radiation absorber assembly for a differential line are also disclosed.

MULTILAYER INTERCONNECTED MODULE WITH DISCRETE CAPACITOR AND COMPONENT BURIED THEREIN AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a multichip module constituted by a module system. SOLUTION: A plurality of small-sized capacitor substrates 20 and/or resistor substrates 30 are assembled and fixed in a regular arrangement pattern on a base substrate 110. A power source substrate 40 is fixed on the base substrate 110 together with the small-sized substrates. In order to improve manufacturing yield of the module, all components are tested preliminarily and have almost the same thickness. A gap 60 between the small-sized substrate and the power source substrate is filled with polymer material. A dielectric layer 112 is formed on the components and made planar. In order to obtain a power source distribution surface and signal lines, a plurality of interleaving system metal layers and dielectric layers 112-116 are formed on the components. The small-sized capacitor substrate 20 is arranged below a corresponding integrated circuit chip 4. The small-sized resistor substrate 30 is arranged in ...

Halbleiterspeichermodul zur Verbesserung der Signalintegrität

Ein Halbleiterspeichermodul (M) weist eine Modulplatine (MP) auf, auf der beidseitig Halbleiterspeicherbausteine (At, Ab, ..., Dt, Db, E) und auf einer Oberseite (O1) ein Steuerbaustein (SB) angeordnet sind. Der Steuerbaustein ist über einen Modulbus (MB) und Buszweige (BZ1, BZ3) mit den Halbleiterspeicherbausteinen verbunden. Bei dem Bus handelt es sich um einen Command-Adress-Bus in Fly-By-Topologie. Ein Halbleiterspeicherbaustein (E) ist über einen Buszweig (BZ2), der von einem Verzweigungspunkt (V2), an dem zwei symmetrisch angeordnete Halbleiterspeicherbausteine (Dt, Db) angeschlossen sind, mit dem Steuerbaustein (SB) verbunden. Ein zusätzlicher Widerstand (R¶BZ2¶) zwischen Leitungsabschnitten des Buszweiges (BZ2) reduziert Schwankungen von Adresssignalpegeln auf dem CA-Bus und erhöht somit die Signalintegrität.

Resonator filter assembly and method of manufacture thereof

EQUIPMENT FOR THE CONTROLLING OF THE IMPEDANCE OF ELECTRICAL CONTACTS

A CIRCUIT, WHICH MEASURES A DIFFERENCE SIGNAL

EQUIPMENT FOR THE CONTROLLING OF THE IMPEDANCE OF ELECTRICAL CONTACTS

Ultra-small resistor-capacitor thin film network for inverted mounting to a surface

APPARATUS FOR PROVIDING CONTROLLED IMPEDANCE IN AN ELECTRICAL CONTACT

An apparatus for providing a controlled impedance directly to predetermined contact elements within a socket, thereby reducing the "distorting" nature of the electrical interconnection system. In an illustrative embodiment of the present invention, predetermined contacts of a socket may have a resistance, inductance, capacitance, or a combination thereof incorporated therein. In another illustrative embodiment, at least one active element(s) may also be incorporated into predefined contacts. In this manner, predefined contacts may "process" the corresponding signal in a predetermined manner, defined by the circuitry incorporated on the contact itself. Illustrative functions that may be performed include, but are not limited to, amplifying, analog-to-digital converting, digital-to-analog converting, predefined logic functions, or any other function that may be performed via a combination of active and/or passive elements including a microprocessor function.

METHOD AND APPARATUS FOR IMPROVING POWER GAIN AND LOSS FOR INTERCONECT CONFIGURATIONS

SEMICONDUCTOR CHIP PACKAGE AND STACKED MODULE THEREOF HAVING FUNCTIONAL PART AND PACKAGING PART ARRANGED SIDEWAYS ON ONE PLANE TO ADVANTAGEOUSLY FORM ULTRA-THIN PACKAGE AND DECREASE THERMAL STRESS CAPABLE OF OCCURRING BETWEEN CONSTITUTION ELEMENTS WITH DIFFERENT THERMAL EXPANSION COEFFICIENTS IN SEMICONDUCTOR CHIP PACKAGE

PURPOSE: A semiconductor chip package and a stacked module thereof having a functional part and a packaging part arranged sideways on one plane is provided to advantageously form an ultra-thin package by decreasing the entire height of a semiconductor chip package, and to decrease thermal stress capable of occurring between constitution elements with different thermal expansion coefficients in the semiconductor chip package by forming the constitution elements in mutually different regions. CONSTITUTION: The first circuit board(102) has the first and second regions(102A,102B) that are divided on the same plane according to a length direction, including the first surface(104) extending across the first and second regions and the second surface(106) opposite to the first surface. A semiconductor chip(110) is mounted on the first region on the first surface. A mounting member is formed on the second region on the first surface to electrically connect the semiconductor chip to an outer terminal ...

Process for assembling an interposer to probe dense pad arrays

Disclosed is a process to manufacture an interposer which includes an interposer socket assembly to use in probing dense pad arrays that minimizes the associated extraneous pin loading and cross-talk caused by a probe tip. The process comprises the steps of: mounting a number of resistors onto a number of predetermined positions in a pad array on an interposer board; inserting a number of interposer pins of a pin socket into the pads of the pad array on the interposer board, wherein the ends of the interposer pins protrude through the interposer board; placing a solder preform around the ends of the interposer pins; and, heating the solder preforms in a solder re-flow oven to solder the interposer pins to the respective pads of the pad array.

Semiconductor module having multiple insulation and wiring layers

A memory IC having an SOJ type package is mounted on a metal wiring layer on the surface of the outer layer of a multilevel interconnection board. Protecting portions are formed on the package of the memory IC. The protecting portions contact the surface of the metal wiring layer when the memory IC is mounted on the multilevel level interconnection board. The shape of the projecting portions can be of various types, e.g., circular cylinders or prisms. Heat generated within the memory IC is transmitted to the metal wiring layer through the projecting portions. A first insulating layer has first and second surfaces. Wiring layers are formed on each of the first and second surfaces of the first insulating layer, and first and second semiconductor chips are connected to those wiring layers. First and second resin layers cover the whole surface of the outermost wiring layers and the first and second semiconductor chips.

Circuit Assembly and Corresponding Methods

A circuit assembly ( 1800 ) includes a first circuit substrate ( 1200 ) defining a first major face ( 1201 ) and a second circuit substrate ( 1500 ) defining a second major face ( 1502 ). A plurality of electrical components ( 1203,1204,1205 ) can be disposed on one or more of the first major face or the second major face. One or more substrate bridging members ( 1301,1302,1303,1304 ) are disposed between the first circuit substrate and the second circuit substrate. Each substrate bridging member can define a unitary structure having a first end bonded to the first major face and a second end bonded to the second major face to bridge the first circuit substrate and the second circuit substrate.

Tamper detection

In described examples, an enclosure for circuitry includes a platform, a charge source, a first capacitive plate, a second capacitive plate, and a capacitive sensor. The circuitry is fixedly coupled to the platform. The first capacitive plate is also fixedly coupled to the platform, and either alone, or together with the platform, surrounds a volume containing the circuitry and the charge source, the charge source electrically coupled to and configured to charge the first capacitive plate. The second capacitive plate is fixedly coupled to the platform without touching the first capacitive plate, and either alone, or together with the platform, surrounds the first capacitive plate. The second capacitive plate is configured so that there is an electric potential difference between the first capacitive plate and the second capacitive plate. The capacitive sensor is electrically connected to the first capacitive plate and configured to determine when a capacitance between the first and second ...

Method of using conductive elastomer for electrical contacts in an assembly

A manufacturing method for manufacturing an electronic device is disclosed. Conductive elastomers comprising of various configurations and resistivity are coupled to contact pads of an electronic device. The conductive elastomers are also coupled to substrate contacts on a substrate, allowing the conductive elastomers to function as electrical connection from device to substrate as well as to embed one or more passive components at the contact pads of the electronic device.

AN ARRANGEMENT FOR ENABLING TRIMMING ON A SUBSTRATE AND A METHOD OF PRODUCING A SUBSTRATE THAT ENABLES TRIMMING

To enable trimming on a substrate (1) having discrete components (6) that are surface-mounted on the substrate and/or components (7) that are integrated in the substrate, a trimmable structure (9) is provided on the surface of the substrate for each component to be trimmed.

Filter, in particular for filtering electromagnetic interference

Beschrieben und dargestellt ist ein Filter, insbesondere zur Filterung von elektromagnetischen Störungen, mit einem Basiselement (2), mit mindestens einem elektrischen Filterbauelement (3, 4) und mit mindestens zwei Eingangs-Anschlusskontakten (5) und mindestens zwei Ausgangs-Anschlusskontakten (6) zum Anschluss der Leiter einer elektrischen Leitung, wobei die Eingangs-Anschlusskontakte (5) über auf dem Basiselement (2) angeordnete Leiterpfade (7) mit den Ausgangs-Anschlusskontakten (6) verbunden sind. Bei dem erfindungsgemäßen Filter ist eine einfache Konfiguration und eine flexible Anwendung dadurch sichergestellt, dass in jedem Leiterpfad (7) mindestens zwei Längskontakte (8) vorgesehen sind, über die ein Filterbauelement (3, 4) derart mit einem Leiterpfad (7) elektrisch verbindbar ist, dass die elektrische Verbindung des Leiterpfades (7) zwischen den beiden Längskontakten (8) über das Filterbauelement (3, 4) führt, und dass in den Leiterpfaden (7) jeweils mindestens ein Querkontakt ...

ELECTRONIC PART BUILT-IN MULTILAYER BOARD

PROBLEM TO BE SOLVED: To provide a highly versatile electronic part built-in multilayer board that can easily cope with even a case where an external circuit to be connected is different. SOLUTION: A connector 4 has a plurality of connecting wires to be connected to each of first sensor 1 to third sensor 3. Among electronic part groups 10a-10c, 11a-11c, and 12a-12c to be connected to the connecting wires, the electronic parts 10a, 11a, and 12a connected directly from the connector 4 are mounted onto either of front and rear surfaces of the multilayer board. Therefore, even if a sensor to be connected is changed to one with different characteristics, an electronic part mounted to the front surface or the rear surface can be changed according to the changed sensor, thus coping with the change of sensor. COPYRIGHT: (C)2008,JPO&INPIT ...

Dual processor adapter card has two processor sockets with some interconnected pins and other pins corresponding to pins in a processor socket in a main circuit board

The arrangement has an adapter card (10) with a number of electrical pins (12) for insertion into a processor plug-in point on a main circuit board and first and second sockets (14a,14b) for accepting and holding first and second processors. The sockets have a number of corresponding pins (16a,16b), some of the pins on the first and second sockets cores. to the electrical pins and the corresponding pins are interconnected.

Circuit system with integrated circuits - has electrically insulated laminated peripheral network stacked together with integrated circuit

The integrated circuit is intended as a micropack of resistance capacitance, RC, and hybrid type. The circuit system has a peripheral network of this type (3-6) which is produced in a foil or laminated technique. This network and the integrated circu it (1) are stacked together, and their terminal elements (2, 8-10) are brought out at the stacked front face and electrically interconnected via a conductive track plane (7) parallel to the stack plane. Between the integrated circuit and the track plane are pref. stacked several peripheral networks, whose dimensions increase in the direction of the conductive plane. The terminal elements are partly interconnected and partly connected to the integrated circuit via the conductive plane.

Ultra-small resistor-capacitor thin film network for inverted mounting to a surface

Ultra-small resistor-capacitor thin film network for inverted mounting to a surface

Resonator filter assembly and method of manufacture thereof

A TEM transmission line resonator filter assembly, comprising a PCB 401 having an edge-plated slot 402, a comb-line resonator filter (Fig 3b) comprising a transmission line portion 302 and at least one resonator line 303 extending therefrom, said filter being mounted on said PCB such that said at least one resonator line 303 extends over said edge-plated slot 402, and upper (ref 407 Fig 8a) and lower (ref 406 Fig 7) conductive plates mounted over said resonator filter on respective upper and lower surfaces of the PCB, the inner surfaces of said conductive plates being configured to form a cavity in respect of said resonator filter. Further aspects of the invention include tuning screws (902 of Fig 9a). The TEM transmission line portion of the resonator filter sits at a side edge of the slot 402 and the edge of each resonator 303 is soldered to an exposed ground plane of the PCB surface, such that the resonators 303 extend over the slot 402. The combination of the cavity, the etched conductive ...

Resonator filter assembly and method of manufacture thereof

ARRANGEMENT AND PROCEDURE FOR TRIMS OF ELECTRONIC COMPONENTS ON A SUBSTRATE

HALBLEITER-BAUELEMENT MIT EINER KÜHLPLATTE

The semiconducting component (SW1) has a cooling plate (KPL) with at least one base layer (MGS) and a metal conducting layer (MLS) separated from the base layer by an insulating layer (ISS). The component is applied to the conducting layer using a solder layer (LOS). At least one filter element provided in order to prevent noise emissions in the conducting layer is associated with at least one of the component's electrodes.

Access Point Device

This document describes an access point device and associated systems and methods. The techniques and systems include an access point device that includes a housing with an antenna carrier, a circuit board assembly, a heat sink, and a heat shield positioned within the housing. The housing includes a top housing member connected to a bottom housing member. The top housing member includes a concave-down top-end portion connected to a generally cylindrical vertical wall via rounded corners. The antenna carrier supports multiple antennas positioned proximate to an inner surface of the vertical wall. The heat sink is positioned between the antenna carrier and the circuit board assembly. The circuit board assembly is positioned between the heat shield and the heat sink, and the heat shield is positioned between the circuit board assembly and the bottom housing member. 30006900PCT Fig. 1 ...

TECHNIQUE FOR ACCOMMODATING ELECTRONIC COMPONENTS ON A MULTILAYER SIGNAL ROUTING DEVICE

A technique for accommodating electronic components on a multilayer signal routing device (100) is disclosed. In one particular exemplary embodiment, the technique may be realized as a method for accommodating electronic components on a multilayer signal routing device (100). Such a method comprises determining a component space that is required to accommodate a plurality of electronic components on a surface of a multilayer signal routing device (100), and then forming at least one signal routing channel (104) on at least the surface of the multilayer signal routing device (100), wherein the at least one signal routing channel (104) has a channel space that is equal to or greater than the component space.

CIRCUIT BOARD WITH DIELECTRIC SURFACE SWITCH AND EMBEDDED METAMATERIALS PROVIDING INCREASED ARC RESISTANCE

A PCBA for use in a high-energy broadband electric field includes a low-voltage power supply and alternating conductive and dielectric layers. An outermost one of the conductive layers includes a dielectric surface switch having closely-spaced switch contacts. The first switch contact is connected to the positive terminal and the second switch contact connected to the negative terminal. Vias connect the conductive layers to the terminals through the respective first and second switch contacts to form power and ground planes. A metamaterial layer of nickel is doped with up to 20 percent phosphorus or chromium by weight, has a uniform thickness of less than 5 µm, is sandwiched between interfacing surfaces of a pair of the conductive and dielectric layers, and evenly coats one of the interfacing surfaces. A sonobuoy system includes the PCBA, e.g., an Electronic Function Select board, a cylindrical housing, and an acoustic array.

TECHNIQUE FOR ACCOMMODATING ELECTRONIC COMPONENTS ON A MULTILAYER SIGNAL ROUTING DEVICE

... ²²²A technique for accommodating electronic components on a multilayer signal ²routing device (100) is disclosed. In one particular exemplary embodiment, the ²technique may be realized as a method for accommodating electronic components ²on a multilayer signal routing device (100). Such a method comprises ²determining a component space that is required to accommodate a plurality of ²electronic components on a surface of a multilayer signal routing device ²(100), and then forming at least one signal routing channel (104) on at least ²the surface of the multilayer signal routing device (100), wherein the at ²least one signal routing channel (104) has a channel space that is equal to or ²greater than the component space.² ...

DEVICE FOR DISTRIBUTING DIGITAL SIGNALS WITH VERY SPEED DATA

MEMORY MODULE HAVING DISCRETE DEVICES WITH AN IMPROVED ARRANGEMENT STRUCTURE, INCLUDING TAPS AND A SUBSTRATE MAIN BODY

PURPOSE: A memory module having discrete devices with an improved arrangement structure is provided to mount memory chips with different sizes on printed circuit boards with the same size, by mounting the memory chips on the printed circuit board even if the memory chip has an outer dimension greater than a memory pad region. CONSTITUTION: A plurality of tabs(113) are disposed at the edge of at least one surface of a substrate main body(100). A memory pad region is disposed on the same surface of the tabs and includes memory chip pads electrically connected to the tabs. Discrete devices(97) are limitedly disposed in one direction in the periphery of the memory pad region and is electrically connected to the tabs and the memory chip pads. The discrete devices are disposed between the tabs and the memory pad region. A memory chip(90) is mounted on the memory pad region. © KIPO 2008 ...

PRINTED-SUBSTRATE DESIGN SYSTEM, AND PRINTED-SUBSTRATE DESIGN METHOD

A printed-substrate design system designs a substrate configuration of a printed substrate on which ICs and passive components are to be mounted and to which a cable is to be connected. This printed-substrate design system comprises: an input unit; an EMI characteristics derivation unit for deriving EMI characteristics from printed-substrate design information received as input from the input unit; a determination criteria storage unit for storing EMI allowance conditions; an EMI conditions determination unit for comparing the EMI characteristics and the EMI allowance conditions and determining whether the EMI characteristics satisfy the EMI allowance conditions; a substrate configuration modification unit for modifying the internal configuration of the printed substrate when it has been determined that the EMI allowance conditions have not been satisfied, and setting the design information of the printed substrate having a re-modified structure to design information for deriving EMI characteristics ...

MOLDED LEAD FRAME CONNECTOR WITH ONE OR MORE PASSIVE COMPONENTS

Exemplary embodiments of the present invention illustrate lead frame connectors for connecting optical sub-assemblies to printed circuit boards in optical transceiver modules. The lead frame connectors include a conductive lead structure that is encased in a plurality of polymer casings. The polymer casings provide electrical insulation for the conductors in the lead frame as well as mechanical support for the finished component. One or more passive components can mount to the conductors of the lead frame connector to aid with impedance matching between an optical sub-assembly, the lead frame connector, and the printed circuit board. The lead frame connectors connect to the leads associated with the optical sub-assemblies and are surface mounted onto the printed circuit board to establish connectivity between the optical sub-assembly and the printed circuit board.

PRINTED CIRCUIT BOARD

The invention relates to an arrangement which is used to increase the density of the components of a printed circuit board (1) comprising electric components (2) which can be mounted on the surface. The printed circuit board (1) is formed by two films (3x, 3y) which are pressed against each other and comprises a dielectric (4) which is disposed therebetween. At least one of the of the opposite sides (3a, 3b) of the films (3x, 3y) is fitted with electric components (2) which can be mounted on the surface. According to the invention, holes (6b), which are used to connect both films (3x, 3y) (3x, 3y) in the printed circuit board (1), are provided and each of the holes (6b) is a direct connection of said opposite sides (3a, 3b) of the films (3x, 3y).

Microelectronic package

An improved microelectronic package is disclosed. The microelectronic package includes a packaging substrate having an upper surface and an underside. At least one chip is mounted on the upper surface of the packaging substrate. A plurality of ball grid array (BGA) solder balls are mounted at the underside of the packaging substrate. At least one RC passive component is disposed underneath the chip. The chip may be mounted on predetermined position on the upper surface of the packaging substrate with solder bumps by using Flip-Chip (FC) assembly method. According to one aspect of the present invention, the RC passive component is disposed between the BGA solder balls. According to one aspect of the present invention, the RC passive component is an adjustable resist having a plurality of bumps formed thereon, and wherein two metal trace lines, which correspond to two bumps of the plural bumps, are provided on the underside of the packaging substrate. The distance between the two metal trace ...

Module

In a memory module, a plurality of memories are mounted on a module base plate, impedance between Vref and Vss near each memory is coupled to Vss by a decoupling capacitor and a Vref plane to achieve low impedance configuration in a wide frequency range, Vref planes are individually provided for the respective memories, and the Vref planes are connected to each other by using a high impedance wire, or a high impedance chip part. Accordingly, a wiring technique for a module which allows effective reduction of self noise and propagation noise can be provided.

Printed circuit board, a buildup substrate, a method of manufacturing printed circuit board, and an electronic device

To provide a printed circuit board, a buildup substrate and a method of manufacturing the printed circuit board capable of curbing a transmission loss thereof at a desired frequency. A printed circuit board having a multilayer substrate, a via hole penetrating the multilayer substrate, a surface wiring wired on the surface of the multilayer substrate and connected to an end which is one end of the via hole, at least one inner layer wiring formed inside the multilayer substrate and connected to a portion other than upper and lower ends of a conductive part of the via hole, and a current-carrying element connected to an end having no surface wiring connected thereto on an opposite side to the end, and wherein the current-carrying element has an electrical length by which a value of an impedance at a predetermined frequency on seeing the current-carrying element side from a connection point between the inner layer wiring and the via hole closest to the end is larger than a value of the impedance ...

Method and components for implementing EMC shielded resonance damping

A method and components are provided for implementing EMC shielded resonance damping of a printed circuit board. The EMC shielded resonance damping component includes a capacitor and resistor formed in series combination and contained within a shielded enclosure. A pair of coaxial pads is provided for connection to the printed circuit board. The series combination of the capacitor and resistor is connected between a first pad of a pair of coaxial pads and an interior wall of the shielded enclosure. The shielded enclosure provides a return current path to a second pad of the pair of coaxial pads through the series components.

PRINTED CIRCUIT BOARD HAVING EMBEDDED RF MODULE POWER STAGE CIRCUIT

Disclosed herein is a printed circuit board having an RF module power stage circuit embedded therein. Specifically, this invention relates to a printed circuit board having an RF module power stage circuit embedded therein, in which a terminal pad for a resistor, a bead, or an inductor is defined or formed on a power supply plane of a multilayered wired board to connect the resistor, the bead, or the inductor to the power supply plane, and the resistor, the bead, or the inductor is connected in parallel with a decoupling capacitor by using a via hole or by embedding the resistor, the bead or the inductor perpendicular to the power supply plane, thus decreasing the size of the RF module and improving the performance thereof.

PRINTED WIRING BOARD AND ELECTRONIC EQUIPMENT

A printed wiring board, comprising a signal plane having a baseband block for processing a baseband signal and a high-frequency block for processing a high-frequency signal which is obtained by converting the baseband signal, and a ground plane opposing to the signal plane. The baseband block and the high-frequency block are connected through a transmission line for transmitting a signal of a specific frequency region. The ground plane is provided with a first ground portion and a second ground portion, the first ground portion being provided at an area opposing to the baseband block, the second ground portion being provided at an area opposing to the high-frequency block. The first ground portion and the second ground portion are coupled to each other through a coupling portion provided therebetween which has a low impedance with respect to the signal of the specific frequency region.

Integrated circuit device/circuit board connection apparatus

In a computer system two integrated circuit devices are operatively mounted on the main system board using a pair of interstitial circuit boards sandwiched between the integrated circuit devices and the system board and having substantially smaller footprints than the system board. Each interstitial board has a series of terminating components, representatively resistors, interposed in its circuitry which interconnects the associated integrated circuit board with system board circuitry that, in turn, operatively couples the two integrated circuit boards. The incorporation of the terminating components in the interstitial boards instead of in the system board reduces the circuit complexity of the system board and the required number of layers therein, thereby reducing the cost of the system board and substantially simplifying its signal trace routing design.

Semiconductor device and printed circuit board

For a multi-terminal semiconductor package, such as a BGA or a CSP, that handles high-speed differential signals, a high-speed signal is assigned to the innermost located electrode pad on an interposer substrate, and the electrode pad is connected to the outermost located ball pad on the interposer substrate. With this arrangement, the length of a plating stub can be considerably reduced, and the adverse affect on a signal waveform can be minimized. This arrangement is especially effective for differential signal lines.

Flexible circuit body and method for production thereof

Provided is a highly reliable flexible circuit body in which a flexible wiring board is prevented from wear caused by rubbing, and a method for production of the flexible circuit body. A flexible circuit body includes a flexible wiring board having an insulating film, a wiring layer formed on the insulating film, and an insulating layer formed on the wiring layer. The flexible wiring board is coated with a thermoplastic elastomer.

Printed circuit board and electronic device having the same

A driving element and a wiring section electrically connected to the driving element are formed on a base substrate. A first ground pattern outputting a reference voltage of the driving element is formed on the base substrate. The base substrate includes a second ground pattern which is spaced apart from the first ground pattern. An external connection section is included on the base substrate, the external connection section being connected to the first and second ground patterns. A connecting cable contacts the external connection section to permit the first and second ground patterns to be connected to external circuitry.

PRINTED WIRING BOARD DEVICE

A printed wiring board device used for electronic equipment, such as the information equipment, etc. A printed wiring board (10) has a power source layer (11) and a ground layer (12) and is mounted with active elements (3 and 4), such as digital ICs, etc. A first capacitor (1) which conductively couples the layers (11 and 12) with each other at a high frequency is provided in the peripheral section of one end side or the other end side of the section of the board (10) where the layers (11 and 12) are faced to each other. Second capacitors (2) which respectively supply transient currents to the active elements (3 and 4) are provided between the power supply pins (3V and 4V) of the elements (3 and 4) and the ground layer (12) near the elements (3 and 4). Therefore, the electromagnetic radiation caused by the power source layer (11) and the ground layer (12) of the printed wiring board (10) can be suppressed easily and remarkably.

Apparatus for providing controlled impedance in an electrical contact

WALL FOR ISOLATION ENHANCEMENT

ELECTRONIC COMPONENT DEVICE AND ELECTRONIC COMPONENT MOUNTING METHOD

PROBLEM TO BE SOLVED: To provide an electronic component device in which even in the case where the size of an electronic component is very smal, the electronic component is mounted on a wiring substrate with high reliability. SOLUTION: An electronic component 20 on the side surface of which electrodes 20a and 20b are formed is mounted on the wiring pattern 12 of a wiring substrate 5. A gold bump 14 connected to the electrodes 20a and 20b of the electronic component 20 and the wiring pattern 12 is provided on the wiring pattern 12 near the side of the electrodes 20a and 20b of the electronic component 20. The electrodes 20a and 20b of the electronic component 20 are electrically connected to the wiring pattern 12 with the gold bump 14. The gold bump 14 is formed by a wire bump method. COPYRIGHT: (C)2008,JPO&INPIT ...

SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a semiconductor device in which an electronic component is arranged between two laminated wiring substrates whose sizes in a thickness direction and a face direction are downsized. SOLUTION: This semiconductor device 10 is provided with: a first electronic component 13; a first wiring substrate 11 having first pads 58, 61, 62 and 65 for mounting electronic components on which the first electronic component 13 is mounted; and a second wiring substrate 17 arranged in the upper part of the first wiring substrate 11, wherein the first pads 58, 61, 62 and 65 are formed on the face of the first wiring substrate 11 on the opposed side of the second wiring substrate 17, and the first wiring substrate 11 and the second wiring substrate 17 are electrically connected by an internal connection terminal 19 arranged between the first wiring substrate 11 and the second wiring substrate 17. The section of the second wiring substrate 17, which is faced with the first electronic ...

Vorrichtung und Verfahren für Hochgeschwindigkeitssignale auf einer gedruckten Leiterplatte

Eine Vorrichtung, umfassend: ein gedrucktes Leiterplattensubstrat; eine Kupfersignalleitung, die auf dem gedruckten Leiterplattensubstrat angeordnet ist; und eine nicht-lineare Übertragungsstruktur, die mit der Kupfersignalleitung gekoppelt ist, wobei die nicht-lineare Übertragungsstruktur konfiguriert ist, um eine Wellenfront eines Hochgeschwindigkeitssignalimpulses auf der Kupfersignalleitung zu schärfen.

A method of providing a bias voltage at radio frequencies

The method provides a bias voltage at radio frequencies for example above 1 GHz, to a device 3 carried by a substrate having a plurality of overlapping electrically conductive layers 5, 6, 7 with dielectric material 8, 9 therebetween. The method consists of connecting a resistor 10 across a pair of the plurality of layers, maintaining one of the pair of layers at ground potential, and connecting the other layer to the device through via holes in the substrate. Thereby, a capacitor is formed in the overlapping layers. The method provides reduced parasitic inductance. The dielectric material 8, 9 may be a prepreg material. The conductive layers may be made from copper. The device 3, is preferably on FET.

MULTI-CHANNEL MODULES AND BUS SYSTEMS

HALBLEITER-BAUELEMENT MIT EINER KÜHLPLATTE

SEMICONDUCTOR COMPONENT WITH A COOLING PLATE

CIRCUIT BOARD WITH DIELECTRIC SURFACE SWITCH AND EMBEDDED METAMATERIALS PROVIDING INCREASED ARC RESISTANCE

A PCBA for use in a high-energy broadband electric field includes a low- voltage power supply and alternating conductive and dielectric layers. An outermost one of the conductive layers includes a dielectric surface switch having closely-spaced switch contacts. The first switch contact is connected to the positive terminal and the second switch contact connected to the negative terminal. Vias connect the conductive layers to the terminals through the respective first and second switch contacts to form power and ground planes. A metamaterial layer of nickel is doped with up to 20 percent phosphorus or chromium by weight, has a uniform thickness of less than 5 µm, is sandwiched between interfacing surfaces of a pair of the conductive and dielectric layers, and evenly coats one of the interfacing surfaces. A sonobuoy system includes the PCBA, e.g., an Electronic Function Select board, a cylindrical housing, and an acoustic array.

Dispositif de distribution de signaux numeriques a tres hauts debits

Le dispositif de l'invention comporte un bus B constitue de troncons de largeurs constantes et de longueurs quelconques. La largeur des troncons du bus varie d'un troncon a l'autre, le troncon relie a un emetteur E ayant la plus grande largeur. Chaque jonction entre deux troncons est reliee par une ligne en derivation L2 a Ln a un dispositif electronique D2 a Dn. Les lignes ont des longueurs quelconques et meme impedance caracteristique. Le troncon extreme B1 du bus est relie a un dispositif electronique D1. Le troncon extreme et les lignes sont charges par une impedance egale a l'impedance caracteristique des lignes. Dans le cas d'une distribution symetrique des signaux, la distribution se fait a partir d'un emetteur differentiel, par deux bus identiques relies par des lignes differentielles aux dispositifs electroniques.

DEVICE HAS SEMICONDUCTOR OPTICAL

GROUND PATTEN STRUCTURE

A ground pattern structure according to an embodiment of the present invention includes a ground connected to a part of a surge protection part, a ground pattern that is located on the ground and is connected to the remaining part of the surge protection part, and a pattern-separation-type screw that separates the ground pattern from the ground or touches the ground. Therefore, the ground pattern is separated from the ground by using the pattern-separation-type screw, thereby removing a varistor from a product. COPYRIGHT KIPO 2017 ...

Semiconductor apparatus

CLOSED-GRID BUS ARCHITECTURE FOR WAFER INTERCONNECT STRUCTURE

An interconnect structure employs a closed-grid bus to link an integrated circuit tester channel to an array of input/output (I/O) pads on a semiconductor wafer so that the tester channel can concurrently communicate with all of the I/O pads. The interconnect structure includes a circuit board implementing an array of bus nodes, each corresponding to a separate one of the I/O pads. The circuit board includes at least two layers. Traces mounted on a first layer form a set of first daisy-chain buses, each linking all bus nodes of a separate row of the bus node array. Traces mounted on a second circuit board layer form a set of second daisy-chain buses, each linking all bus nodes of a separate column of the bus node array. Vias and other circuit board interconnect ends of the first and second daisy-chain buses so that they form the closed-grid bus. Each bus node is connected though a separate iso lated resistor to a separate contact pad mounted on a surface of the circuit board. A set of spring ...

METHOD FOR OPTIMIZING HIGH FREQUENCY PERFORMANCE OF VIA STRUCTURES

A method for enhancing the high frequency signal integrity performance of a printed circuit board (PCB) or backplane is provided. The method may involve the use of the S-parameters as the primary cost factors associated with an iterative process to optimize the physical dimensions and shape of a single or a collection of vias within the PCB or backplane. Such process involves the representation of the via components as equivalent lumped series admittances and impedances, as well as, RLGC sub-circuits upon which basic circuit analysis may be performed to optimize secondary characteristics, for example, the maximization of the sub-circuit's resistance and/or the minimization of the sub-circuit's capacitance. The iterative process involves the alteration of physical dimensions and the shape of the via components such that the secondary characteristics are optimized.

Method of fabricating PCB including embedded passive chip

Disclosed is a method of fabricating a PCB including an embedded passive chip, in which the passive chip is mounted on the PCB and an insulator is then laminated on the PCB, or in which a blind hole for receiving the passive chip is formed in the PCB and the passive chip is mounted in the blind hole.

Processor module with dual-bank SRAM cache having shared capacitors and R-C elements integrated into the module substrate

A processor module has a cache of SRAM chips mounted on both a back and a front surface but de-coupling capacitors mounted on only the back surface. Each de-coupling capacitor is for suppressing current spikes from a pair of SRAM chips. The pair of SRAM chips includes a first SRAM chip on the same surface as the capacitor and a second SRAM chip opposite the first SRAM chip on the front surface of the module. The first SRAM chip belongs to a first bank while the second SRAM chip belongs to a second bank. Two chip-enable signals control access to the two banks. Since only one bank is accessed at any time, and access causes current spikes, only one bank and only one SRAM chip in the pair of SRAM chips creates a current spike at any time. Thus, a capacitor can be shared between the two SRAM chips in the pair. The shared capacitor can be mounted next to or under one of the SRAM chips, or formed within the multi-layer substrate itself. Having capacitors on only one of the surfaces reduces the ...

Electronic circuit, a semiconductor device and a mounting substrate

An electronic circuit includes a first semiconductor device and a second semiconductor device on a mounting substrate. The mounting substrate lines have lengths which are made unequal for respective bits. Assembling lines which reach connecting electrodes of a semiconductor chip from the external terminals of the second semiconductor device have made lengths thereof unequal for respective bits. The unequal lengths of the mounting substrate lines have a relationship which offsets the unequal lengths of the assembling lines.

Memory system having memory devices on two sides

A memory system includes a first signal line to carry a first signal that enters the module at a first end of the first signal line and a second signal line to carry a second signal that enters the module at a first end of the second signal line. The module includes a first memory device disposed on a first side of the module and a second memory module disposed on a second side of the module positioned opposite to the first side. The first memory device and the second memory device are connected to the first signal line and the second signal line. The first signal and the second signal traverse alongside each other to arrive in turn at the first memory device and the second memory device. The system may include a controller that provides the first signal and the second signal.

Method and apparatus for providing a carrier termination for a semiconductor package

A semiconductor termination socket for use with a printed wiring board has a mounting socket base for attachment to the board and plural pin socket receiving elements in the base for connecting to leads of a semiconductor chip package which will be removably inserted into the socket. The socket further has electrical components fabricated within the socket base for connecting a pin of the socket and a termination potential. The electrical components are preferably fabricated using planar technology so that the socket becomes, in essence, a printed wiring board. The semiconductor packages can be of any configuration including, for example, 149 pin grid array packages. If more than one layer of component circuitry is needed, a plurality of layers can be embedded within the mounting socket.

Interconnect system having vertically mounted passive components on an underside of a substrate

An interconnect system for use with interposers or chip carriers provides highly efficient area utilization by attaching very small chip components (50) such as resistors or capacitors to the solder pads (30) on the underside of a carrier substrate (10) such that only one end (55) of the chip component is attached to the solder pad, while the other end (56) is suspended free in space. When the interposer or chip carrier is soldered to a main printed circuit board, the free end of the chip component is soldered to a corresponding pad on the printed circuit board. The vertically mounted chip components provide an electrical function, such as decoupling, and also provide an electrical interconnection between the interposer and the printed circuit board. The interposer has electrical vias that pass vertically through the substrate from the solder pads to a conductive circuitry pattern on the top side, which also contains an integrated circuit die or an array of larger discrete chip components ...

Apparatus and method incorporating discrete passive components in an electronic package

An apparatus and method for incorporating discrete passive components into an integrated circuit package. A metal layer is formed over a surface of a substrate. A layer of photosensitive material is then formed over the metal layer. Using standard photolithographic processing, a pattern is formed with the photosensitive material to expose at least one region of the metal layer. The remaining photosensitive material protects the underlying metal during metal etching. The substrate is then subjected to a metal etching process to remove the metal that is not protected by the photosensitive material. The remaining photosensitive material is then removed from each remaining area of the metal layer. The discrete passive components can then be attached to the formed metal lands.

Electronic device comprising at least one printed circuit board and comprising a plurality of semiconductor components of identical type, and method

An electronic device is provided, in which semiconductor components are structurally identical among one another and have two groups of contact connections arranged on opposite main areas on a printed circuit board. Components are arranged in a manner laterally offset in a direction parallel to the printed circuit board area in such a way that, on opposite main areas, a group of first contact connections of a semiconductor component fitted on one main area is in each case arranged in the same region of the printed circuit board as a group of first contact connections of a semiconductor chip arranged on the opposite main area. Likewise, the groups of second contact connections of the semiconductor chips arranged on opposite main areas in each case attain congruence.

Method For Fabricating Component-Embedded Printed Circuit Board

A method for fabricating a component-embedded PCB includes: providing a carrier plate having a plating metal layer plated thereon; disposing an electronic component on the plating metal layer of the carrier plate; laminating a metal layer onto the plating metal layer having the electronic component disposed thereon and the carrier plate by a dielectric film; removing the carrier plate and exposing the plating metal layer; and patterning at least one of the metal layer and the plating metal layer to be a circuit layer.

Printed wiring board and semiconductor device and processes to prepare the same

A printed wiring board, a substrate for disposing semiconductor chips and a semiconductor device prepared by coating a substrate with a photosensitive resin composition comprising an oxygen sensitizer and a cis-diene-substituted polyamic acid or polyimide and forming fine patterns by exposure to radiation. Processes for producing a printed wiring board, a substrate for disposing semiconductor chips and a semiconductor device, which comprises coating a substrate with the photosensitive resin composition and forming fine patterns by crosslinking cis-diene by oxidation polycondensation with singlet oxygen generated by exposure of the oxygen sensitizer to radiation. The photosensitive resin composition is of the negative type and exhibits high sensitivity and high resolution. The photosensitive resin composition forms a resin layer having excellent heat resistance.

FRAMES FOR SHIELDING ASSEMBLIES AND SHIELDING ASSEMBLIES INCLUDING THE SAME

According to various aspects, exemplary embodiments are disclosed of frames for shielding assemblies. Exemplary embodiments are also disclosed of shielding assemblies including such frames. In exemplary embodiments, a frame for a board level shield (BLS) may include at least one finger or tab (broadly, a portion or contact) configured to fill, cover, or close off a gap or void defined by a cover's sidewalls to thereby inhibit or prevent EMI leakage through the gap or void.

Wall for isolation enhancement

A circuit assembly is provided and includes a printed circuit board (PCB) having a circuit element region and defining a trench surrounding an entirety of the circuit element region, a circuit element disposed within the circuit element region of the PCB; and a Faraday wall. The Faraday wall includes a solid, unitary body having a same shape as the trench. The Faraday wall is disposed within the trench to surround an entirety of the circuit element.

High-speed memory system

A memory system includes a chipset mounted on a circuit board, and first and second memory module connectors mounted respectively on the circuit board. The first and second memory modules are inserted into the first and second memory module connectors, respectively. The memory system further includes a bus connected to the chipset and the first and second memory module connectors so to create a branch point. Each of the first and second memory modules includes at least one memory device connected to the bus via a stub line and a stub resistor. Impedance of the bus is less than that of the stub line.

Printed circuit board

The invention provides a printed circuit board including a terminating structure wherein impedance matching can be established with certainty also for a long wiring line without using a discrete part as a terminating resistor. In the terminating structure, an internal wiring line (11) connected to a signal output terminal (12) of a semiconductor unit (2A) is formed with a resistance value which satisfies an impedance matching condition of a printed circuit board wiring line (13) connected to the signal output terminal (12). The terminating structure is applied to any application wherein impedance matching of a wiring line is established on a printed circuit board on which a semiconductor unit having an internal wiring line having a resistance higher than that of a wiring line on the printed circuit board is mounted.

MODIFIED POLYIMIDE RESIN AND THERMOSETTING RESIN COMPOSITION CONTAINING THE SAME

A novel modified polyimide resin having a polybutadiene sheleton and obtainable by reacting the following three (3) kinds of compounds, i.e., a bifunctional hydroxyl-terminal polybutadiene having a number average molecular weight of 800 to 5,000, a tetrabasic acid dianhydride, and a diisocyanate compound, imparts reduced shrinkage upon setting to a thermosetting resin composition comprising the same and also imparts heat resistance and pliability and the like to a hardened mass or article of such thermosetting resin composition. Therefore, such thermosetting resin composition is an excellent resin composition capable of fully satisfying the requirements with regard to the characteristics of an overcoat agent for a wiring circuit which should be pliable, such as a flexible wiring circuit substrate, a film carrier and the like.

Energy Conditioning Circuit Arrangement for Integrated Circuit

The present invention relates to an interposer substrate for interconnecting between active electronic componentry such as but not limited to a single or multiple integrated circuit chips in either a single or a combination and elements that could comprise of a mounting substrate, substrate module, a printed circuit board, integrated circuit chips or other substrates containing conductive energy pathways that service an energy utilizing load and leading to and from an energy source. The interposer will also possess a multi-layer, universal multi-functional, common conductive shield structure with conductive pathways for energy and EMI conditioning and protection that also comprise a commonly shared and centrally positioned conductive pathway or electrode of the structure that can simultaneously shield and allow smooth energy interaction between grouped and energized conductive pathway electrodes containing a circuit architecture for energy conditioning as it relates to integrated circuit device packaging. The invention can be employed between an active electronic component and a multilayer circuit card. A method for making the interposer is not presented and can be varied to the individual or proprietary construction methodologies that exist or will be developed.

Electrical connectors and printed circuits having broadside-coupling regions

An electrical connector that includes a circuit board having a board substrate that has opposite board surfaces and a thickness measured along an orientation axis that extends between the opposite board surfaces. The circuit board has associated pairs of input and output terminals and signal traces that electrically connect the associated pairs of input and output terminals. The input and output terminals being configured to communicatively coupled to mating and cable conductors, respectively. Each associated pair of input and output terminals is electrically connected through a corresponding signal trace that has a conductive path extending along the board substrate between the corresponding input and output terminals. At least two signal traces form a broadside-coupling region in which the conductive paths of the at least two signal traces are stacked along the orientation axis and spaced apart through the thickness and extend parallel to each other for a crosstalk-reducing distance.

Defected ground structure with shielding effect

A defected ground structure with shielding effect is provided. The structure includes a dielectric layer, a defected metal layer, a grounded metal layer and at least a conductive mushroom-like structure. The defected metal layer has a line-shaped opening and is disposed in the dielectric layer. The conductive mushroom-like structure is disposed between the defected metal layer and the grounded metal layer and is arranged along an extending direction of the line-shaped opening periodically. The conductive mushroom-like structure includes a fungating part and a stipe part. The fungating part is parallel to the defected metal layer and a distance is maintained away from the defected metal layer. The projection area of the fungating part on the defected metal layer covers a length of the line-shaped opening corresponding to the fungating part. The stipe part connects the fungating part and the grounded metal layer.

Apparatus and method for broadband electromagnetic mode suppression in microwave and millimeterwave packages

A parallel plate waveguide structure may be configured to suppress spurious propagating modes by including a lossy frequency selective surface (FSS) formed from a resistive film. The electromagnetic material properties of individual layers disposed between the conductive plates of the waveguide may be engineered to extend the suppression band of the fundamental TE mode up to the cutoff frequency of the second TE mode, and to simultaneously create a multi-octave TM mode suppression band. Applications include, for example, cavity mode suppression in microwave and millimeterwave assemblies at the board, package, and chip level.

Circuit board including embedded decoupling capacitor and semiconductor package thereof

A circuit board including an embedded decoupling capacitor and a semiconductor package thereof are provided. The circuit board may include a core layer including an embedded decoupling capacitor, a first build-up layer at one side of the core layer, and a second build-up layer at the other side of the core layer, wherein the embedded decoupling capacitor includes a first electrode and a second electrode, the first build-up layer includes a first via contacting the first electrode, and the second build-up layer includes a second via contacting the first electrode.

Chip Capacitor Precursors

A capacitive precursor includes electrically conductive material layers stacked on a substrate. The electrically conductive layers provide first and second patterns. The patterns each include overlaying areas free of the electrically conductive material. The first pair of areas overlay areas of the second pattern having the electrically conductive material and the second pair of areas overlay areas of the first pattern having the electrically conductive material. Dielectric layers are interposed between neighboring electrically conductive material layers for electrical isolation. One or more capacitive precursors can be dropped onto or into a board and during assembly of a packaged semiconductor device and have electrically conducting layers associated with its respective plates connected together to form a capacitor during assembly using conventional assembly steps.

Z-directed pass-through components for printed circuit boards

A Z-directed signal pass-through component for insertion into a printed circuit board while allowing electrical connection from external surface conductors to internal conductive planes or between internal conductive planes. The Z-directed pass-through component is mounted within the thickness of the PCB allowing other components to be mounted over it. The body may contain one or more conductors and may include one or more surface channels or wells extending along at least a portion of the length of the body.

Electronic Device and Noise Current Measuring Method

A noise current passing through a substrate on which an electronic component is mounted is suppressed in a housing, to provide a malfunction of an electronic device. A substrate ( 103 ) on which an electronic component is mounted is secured to a housing ( 102 ) by a metal spacer ( 108 ) and a screw ( 104 ). A noise control member ( 100 ) mainly composed of an insulation substance is disposed between the metal spacer ( 108 ) and the substrate ( 103 ). A first conductive film is formed on the metal spacer-side of the noise control member ( 100 ), and a second conductive film is formed on the substrate-side of the noise control member ( 100 ). A resistance member ( 101 ) is disposed between the first conductive film and the second conductive film. A noise current introduced from the housing to the substrate can be suppressed by the resistance member.

Printed circuit board

A power source terminal and a ground terminal for a semiconductor integrated circuit are connected to a conductor pattern through a capacitor. The conductor pattern is connected, through a filter, to a plane conductor connected to neither a ground plane nor a power source plane. Thus, a common mode noise arising from between the power source and the ground is caused to flow into the plane conductor. This reduces the common mode noise flowing in the ground and the power source of the printed wiring board, which relatively act as antennas.

Method and system for reducing trace length and capacitance in a large memory footprint

A method and system are disclosed to reduce trace length and capacitance in a large memory footprint. When more dual in-line memory module (DIMM) connectors are used per memory channel, the overall bus bandwidth may be affected by trace length and trace capacitance. In order to reduce the overall trace length and trace capacitance, the system and method use a palm tree topology placement, i.e., back-to-back DIMM placement, to place surface mount technology (SMT) DIMM connectors (instead of through-hole connectors) back-to-back in a mirror fashion on each side of a printed circuit board (PCB). The system and method may improve signal propagation time when compared to the commonly used traditional topology placements in which all DIMM connectors are placed on one side of the PCB.

Electrosurgical Systems and Printed Circuit Boards for Use Therewith

An electrosurgical system for treating tissue is disclosed. The system includes an electrosurgical generator, a printed circuit board, a generator ground and a patient ground. The printed circuit board is disposed in mechanical cooperation with the electrosurgical generator and includes a plurality of conductive layers. The generator ground includes a first portion and a second portion. The first portion is electro-mechanically connected to a conductive layer of the printed circuit board and the second portion is electro-mechanically connected to another conductive layer of the printed circuit board. The patient ground includes a portion that is at least partially interposed between the first portion of the generator ground and the second portion of the generator ground.

Microwave filter

A filter unit and a corresponding printed circuit board. The filter unit and the printed circuit board have been equipped with modified end portions being matched such that a number of filter units can be used on the printed circuit board without changing the printed circuit board.

Wireless ic device and electronic apparatus

A wireless IC device that is miniaturized, allows simple and low-cost mounting of a wireless IC, and eliminates the possibility of damage occurring to the wireless IC due to static electricity, and an electronic apparatus equipped with the wireless IC device, includes a wireless IC chip that processes transmission and reception signals, and a feeder circuit substrate that includes a resonant circuit having an inductance element. Feeder electrodes are provided on a surface of the feeder circuit substrate and are electromagnetically coupled to the resonant circuit. The feeder electrodes and are electromagnetically coupled to radiation plates and provided for a printed wiring board. The wireless IC chip is activated by a signal received by the radiation plates and a response signal from the wireless IC chip is radiated outward from the radiation plates.

High-frequency switch module

In a high-frequency switch module, a switch IC is mounted on a multilayer board to define a high-frequency switch module. The multilayer board includes two internal wirings and two internal ground electrodes. The internal ground electrodes are spaced apart from each other at an interval when viewed from a lamination direction of the multilayer board. The first internal wiring is located on the upper surface side of the first internal ground electrode, and is entirely separated from an RF wiring, and the first internal wiring includes a power supply wiring for supplying power to the switch IC. The second internal wiring is located on the upper surface side of the second internal ground electrode, and is entirely separated from the power supply wiring, and the second internal wiring includes a signal wiring through which an RF signal propagates.

Protection device against electromagnetic interference

The invention relates to a protection device for reducing grid-bound interference, comprising a protection circuit as an input filter of an electronic circuit, wherein the electronic circuit is applied to a multilayer circuit board or is at least partially integrated therein, wherein individual components of the circuit are implemented as embedded structures in the multilayer circuit board. According to the invention, the protection circuit is formed by a cascade of at least as two capacitances coupled to each other by means of low-inductance circuit board structures, wherein the capacitances are implemented as embedded capacitor structures on or within the multilayer circuit board. By means of said protection device, improved filter behavior can be achieved relative to discretely populated protection filters, in particular at higher frequencies, leading to improved protection against electrostatic interference. The filter structure can further be adjusted very well in simulation to the required interference resistance of the circuit to be protected, and also achieve improved aging behavior.

Printed wiring board and method for manufacturing the same

A method for manufacturing printed wiring board including preparing an electronic component having first and second surfaces and electrode on the first surface, forming in an adhesive tape a mark, mounting based on the mark the component on the tape such that the second surface faces the adhesive of the tape, forming another mark on insulative substrate having first and second surfaces, forming in the substrate an opening larger than the component, mounting based on the marks the substrate on the tape such that the component is in the opening of the substrate, fixing the component to the substrate using resin, forming an insulation layer on the first surface of the substrate where the component is accommodated, removing the tape, forming in the layer an opening reaching the electrode, forming a conductive circuit on the layer, and forming in the opening of the layer a via connected to the electrode.

Heat management in an above motherboard interposer with peripheral circuits

A computing device has a circuit substrate having a socket, a main processor inserted into the socket, an interposer substrate inserted between the socket and the main processor, the circuit substrate, the socket and the interposer substrate being electrically connected, at least one peripheral circuit on the interposer substrate, and a heat sink thermally coupled to the peripheral circuit.

Circuit board and method for making the same

A circuit board includes a base board defining a number of via holes, a power supply connection unit, a load connection unit, and at least one capacitor connection unit(s). Each of the at least one capacitor connection unit(s) includes two capacitor connectors, and one of the two capacitor connectors is positioned nearer to the power supply connection unit and farther away from the load connection unit than the other. The via holes are divided into at least one group(s) corresponding to each of the capacitor connection unit(s), and all of the via holes in each of the group(s) are equidistantly positioned along a semicircle arc surrounding the capacitor connector of the capacitor connection unit corresponding to the group that is positioned nearer to the power supply connection unit.

Pre-distortion based impedence discontinuity remediation for via stubs and connectors in printed circuit board design

Embodiments of the present invention address deficiencies of the art in respect to via structure utilization in a PCB design and provide a novel and non-obvious method, system and computer program product for impedance discontinuity remediation for via stubs and connectors in a PCB. In one embodiment a method for impedance discontinuity remediation in a PCB can be provided. The method can include configuring a pre-distortion filter to negate an impedance discontinuity in an electrical signal caused by a transmission line with one of a via stub or a connector. The method further can include pre-distortion filtering an electrical signal before transmitting the electrical signal over the transmission line. Finally, the method can include transmitting the pre-distortion filtered electrical signal over the transmission line.

Structure and circuit board

A structure ( 10 ) includes a conductor ( 151 ), conductors ( 111, 131 ) that are located on the same side with respect to the conductor ( 151 ), that are opposed to at least a part of the conductor ( 151 ), and that overlap each other when seen in a plan view, a connection member ( 101 ) that penetrates the conductors ( 111, 131, 151 ), that is connected to the conductor ( 151 ), and that is insulated from the conductors ( 111, 131 ), openings ( 112, 132 ) that are formed in the conductors ( 111, 131 ), respectively, and which the connection member ( 101 ) passes through, and conductor elements ( 121, 141 ) that are formed to be opposed to the openings ( 112, 132 ), that are connected to the connection member ( 101 ) passing through the openings ( 112, 132 ), and that are larger than the openings ( 112, 132 ). The number of layers in which the conductor elements ( 121, 141 ) are located is two or more and less than or equal to the number of layers in which the conductors ( 111, 131 ) are located.

Screening Process for Manufacturing a Z-directed Component for a Printed Circuit Board

A method for manufacturing a z-directed component for insertion into a mounting hole in a printed circuit board according to one example embodiment includes adding a substrate material to a mold defining the shape of a layer of the z-directed component. A top surface of the substrate material in the mold is leveled. The substrate material in the mold is treated and the layer of the z-directed component is formed. A conductive material is applied to at least one surface of the formed layer. The z-directed component is formed that includes a stack of component layers that includes the formed layer.

Multilayer circuit board structure and circuitry thereof

An exemplary embodiment of the present disclosure illustrates a multilayer circuit board structure, for suppressing the undesired electromagnetic wave propagation within a specific frequency band. The multilayer circuit board structure includes a plurality of crystals and a plurality of conducting channels, wherein a crystal includes a first through fourth conducting planes, at least a first conducting connector, and at least a second conducting connector, wherein the first through the fourth conducting planes are substantially parallel to each other. The first conducting plane is electrically connected to the third conducting plane through the first conducting connector. The fourth conducting plane is electrically connected to the second conducting plane through the second conducting connector. The first and the third conducting planes are configured to be electrically separated from the second and the fourth conducting planes. Furthermore, the conducting channels are for electrically connecting between crystals in the multilayer circuit board structure.

Apparatus for broadband matching

An apparatus is provided. The apparatus comprises a substrate and a circuit trace. The substrate includes a region that is adapted to receive a discrete component, a metal layer, a dielectric layer formed over the metal layer, a window formed in the metal layer that underlies the region, and a conductive strap that extends across the window. The circuit trace is formed on the dielectric layer and is discontinuous across the region.

Via structures and compact three-dimensional filters with the extended low noise out-of-band area

A filter of the present invention includes a plurality of via structures with a multilayer substrate. Each of the plurality of via structures includes first, second and third functional sections. One end of a signal via of the first functional section is connected to one end of a signal via of the second functional section and another end of the signal via of the second functional section is connected to two signal vias of the third functional section. Those signal vias are surrounded by a plurality of ground vias. Input and output ports of the filter are connected to another end of the signal via of each first functional section.

Circuit board contact pads

The present disclosure provides a circuit board with a first via and a second via, the first and second vias providing an electrical path from a top surface of the circuit board to a bottom surface of the circuit board. The circuit board also includes a first contact pad electrically coupled to the first via and a second contact pad electrically coupled to the second via. The first contact pad is disposed at an angle with respect to a reference line crossing through the center of the first and second vias, and the second contact pad is disposed on an opposite side of the reference line at the angle with respect to the reference line, such that a footprint that encompasses an area between the first and second contact pads does not cover the first and second vias.

System and method for controlling radio frequency transmissions from an electronic device

The disclosure relates to a printed circuit board (PCB) for an electronic circuit for a power amplifier of a wireless communication device. The PCB comprises: a substrate; a ground reference in the substrate; first through fourth locations and first and second pads in the substrate; and first and second electrical tracks in the substrate. The locations are for components for the PCB, including a 0 ohm component, and pads connect tracks to the components. The first pad is for a high band power input terminal of the amplifier. The first track connects the first pad to the second location. The third location is in the first track for placement of a first capacitor in a circuit between the first pad and ground. The second pad is for an output terminal of the amplifier. The second track connects the second pad to an output stage circuit of the amplifier.

Printed circuit board and method for manufacturing the same

Disclosed herein is a printed circuit board, including: a core layer; and a plurality of circuit layers stacked on the core layer, wherein one of the circuit layers includes a mesh pattern and a solid pattern, and another of the circuit layers include a first signal pattern opposite to the mesh pattern and a second signal pattern opposite to the solid pattern, the second signal pattern having a high-speed signal line with a higher speed, as compared with the second signal pattern.

Resonance reducing circuit board

A circuit card is provided that includes ground traces that extend from a resistor to a commoning bar, where a resultant electrical length between the resistor and the commoning bar and is configured to reduce energy carried on the ground terminals that could otherwise result in cross-talk. In an embodiment, the ground trace may be configured in a meandering manner. In another embodiment, the ground trace may be split and joined by an inductor.

DC-DC CONVERTER MODULE AND MULTI-LAYER SUBSTRATE

A DC-DC converter module includes a multi-layer substrate, a switching IC, and a coil. The multi-layer substrate includes component mounting electrodes provided on the top surface and an input terminal, an output terminal, and ground terminals provided on the bottom surface. The switching IC switches an input voltage and includes an input electrode, an output electrode, and a ground electrode, and is mounted on the top surface of the substrate by connecting the electrodes to the component mounting electrodes. The coil is arranged within the multi-layer substrate in a spiral shape with an axis extending in the substrate stacking direction. The bottom surface side end of the coil is connected to the input/output electrode of the switching IC. 1. A DC-DC converter module comprising:a multi-layer substrate including component mounting electrodes provided on a first surface thereof in a stacking direction and an input terminal, an output terminal, and a ground terminal provided on a second surface thereof in the stacking direction;a switching IC that switches an input voltage and outputs a switched voltage and that includes an input electrode that is connected to the input terminal through at least one of the component mounting electrodes, an output electrode that is connected to the output terminal through at least one of the component mounting electrodes, and a ground electrode that is connected to the ground terminal through at least one of the component mounting electrodes; anda coil that is arranged within the multi-layer substrate in a spiral shape with an axis extending in the stacking direction, an end of the coil nearer to the first surface being connected to the input terminal or the output terminal, and an end of the coil nearer to the second surface being connected to the input electrode or the output electrode of the switching IC.2. The DC-DC converter module according to claim 1 , wherein a shield layer including a ground electrode and that is connected to ...

Apparatus capable of selectively using different types of connectors

An apparatus capable of selectively applying different types of connectors to a substrate is disclosed. The memory apparatus includes a substrate having a controller. First and second connector pads may be arranged on edges of top and bottom surfaces of the substrate. A via hole may be arranged between the controller and the first and second connector pads. A first passive device pad may be arranged between the via hole and the first connector pads. A second passive device pad may be arranged between the via hole and the second connector pads. A passive device may be coupled to only one of the first passive device pad or the second passive device pad.

MULTILAYER PRINTED WIRING BOARD

A multilayer printed wiring board includes a core substrate having a through-hole formed through the substrate, an interlayer insulation layer formed on the substrate and having a via conductor formed through the insulation layer, and a conductor layer formed on the insulation layer and connected to the via in the insulation layer. The substrate has multiplayer insulation structure, outer power layer formed on surface of the structure, outer ground layer formed on opposite surface of the structure, inner power layer formed inside the structure and inner ground layer formed inside the structure, each of the inner layers has tapered end having angle satisfying 2.8 Подробнее

Process for making stubless printed circuit boards

A process of copper plating a through-hole in a printed circuit board, and the printed circuit board made from such process. The process comprises: providing a printed circuit board with at least two copper interconnect lines separated by an insulator in the vertical direction; providing a through-hole in the printed circuit board in the vertical direction such that the interconnect lines provide a copper land in the through-hole; applying a seed layer to an interior surface of the through-hole; removing an outermost portion of the seed layer from the interior surface of the through-hole with a laser; applying copper on the seed layer.

Electrical connectors and printed circuits having broadside-coupling regions

An electrical connector that includes a circuit board having a board substrate that has opposite board surfaces and a thickness measured along an orientation axis that extends between the opposite board surfaces. The circuit board has associated pairs of input and output terminals and signal traces that electrically connect the associated pairs of input and output terminals. The input and output terminals being configured to communicatively coupled to mating and cable conductors, respectively. Each associated pair of input and output terminals is electrically connected through a corresponding signal trace that has a conductive path extending along the board substrate between the corresponding input and output terminals. At least two signal traces form a broadside-coupling region in which the conductive paths of the at least two signal traces are stacked along the orientation axis and spaced apart through the thickness and extend parallel to each other for a crosstalk-reducing distance.

Magnetically Enhanced Electrical Signal Conduction Apparatus and Methods

Apparatus and methods for magnetically enhanced electrical signal conduction are disclosed. An embodiment electrical connector comprises a connector body, a first active signal contact mechanically attached to and at least partially disposed within the connector body, a ground contact mechanically attached to the connector body, an insulator mechanically separating and electrically isolating the first active signal contact and the ground contact, and a first permanent magnet electrically connected to the first active signal contact. An embodiment electrical cable comprises an elongated insulating sheath, a first active signal electrical conductor disposed within the sheath, a first connector body mechanically attached to a first end of the sheath, a first active signal contact mechanically attached to the first connector body, and electrically connected to the first active signal electrical conductor, and a first permanent magnet electrically connected to the first active signal electrical conductor.

MULTILAYER WIRING BOARD

In a multilayer wiring board having a high-density wiring region and a high-frequency propagation region mounted in the same board, it is possible to propagate a signal frequency of 40 GHz or more in the high-frequency propagation region by using a resin material with a dissipation factor (tan δ) of less than 0.01 as a material of an insulating layer used at least in the high-frequency propagation region. The insulating layer is formed of a polymerizable composition which contains a cycloolefin monomer, a polymerization catalyst, a cross-linking agent, a bifunctional compound having two vinylidene groups, and a trifunctional compound having three vinylidene groups and in which the content ratio of the bifunctional compound and the trifunctional compound is 0.5 to 1.5 in terms of a weight ratio value (bifunctional compound/trifunctional compound). 1. A multilayer wiring board , in which a plurality of wiring layers are laminated through an insulating layer , comprising a first wiring region where wiring and insulating layers are alternately laminated and a second wiring region where , compared to the first wiring region , a thickness of an insulating layer is twice or more and a width of a wiring layer is twice or more , wherein the first wiring region and the second wiring region are integrally formed in the same board , wherein the insulating layer is made of a resin material formed by bulk-polymerizing and cross-linking a polymerizable composition which contains a cycloolefin monomer , a polymerization catalyst , a cross-linking agent , a bifunctional compound having two vinylidene groups , and a trifunctional compound having three vinylidene groups and in which a content ratio of the bifunctional compound and the trifunctional compound is 0.5 to 1.5 in terms of a weight ratio value (bifunctional compound/trifunctional compound).2. The multilayer wiring board according to claim 1 , wherein the second wiring region includes a portion comprising a third insulating ...

Interchip communication using a dielectric waveguide

An apparatus is provided. There is a circuit assembly with a package substrate and an integrated circuit (IC). The package substrate has a microstrip line, and the IC is secured to the package substrate and is electrically coupled to the microstrip line. A circuit board is also secured to the package substrate. A dielectric waveguide is secured to the circuit board. The dielectric waveguide has a dielectric core that extends into a transition region located between the dielectric waveguide and the microstrip line, and the microstrip line is configured to form a communication link with the dielectric waveguide.

Interchip communication using an embedded dielectric waveguide

An apparatus is provided. There is a circuit assembly with a package substrate and an integrated circuit (IC). The package substrate has a microstrip line, and the IC is secured to the package substrate and is electrically coupled to the microstrip line. A circuit board is also secured to the package substrate. A dielectric waveguide is secured to the circuit board. The dielectric waveguide has a dielectric core that extends into a transition region located between the dielectric waveguide and the microstrip line, and the microstrip line is configured to form a communication link with the dielectric waveguide.

MULTI-PAIR DIFFERENTIAL LINES PRINTED CIRCUIT BOARD COMMON MODE FILTER

Multi-pair differential lines printed circuit board common mode filters are generally described. In one embodiment, the apparatus includes a multi-layer printed circuit board, a first signal line and a second signal line forming a first differential pair on a first layer of the printed circuit board, a second differential pair on the first layer of the printed circuit board, and a common mode filter on a second layer of the printed circuit board, the common mode filter comprising an absence of a predominantly occurring dielectric material of the printed circuit board, the common mode filter spanning an area directly below at least a portion of both the first and the second differential pairs. Other embodiments are also described and claimed. 1. An apparatus comprising:a multi-layer printed circuit board;a first signal line and a second signal line forming a first differential pair on a first layer of the printed circuit board;a second differential pair on the first layer of the printed circuit board; anda common mode filter on a second layer of the printed circuit board, the common mode filter comprising an absence of a predominantly occurring dielectric material of the printed circuit board, the common mode filter spanning an area directly below at least a portion of both the first and the second differential pairs.2. The apparatus of claim 1 , wherein the common mode filter comprises a void on the second layer directly below an area between the first and second differential pairs.3. The apparatus of claim 1 , wherein the common mode filter comprises a magnetic lossy material.4. The apparatus of claim 1 , wherein the common mode filter comprises a conductive lossy material.5. The apparatus of claim 1 , further comprising a third differential pair on the first layer of the printed circuit board above the common mode filter claim 1 , the third differential pair adjacent to the first and second differential pairs.6. The apparatus of claim 1 , wherein the first layer ...

STRUCTURE MEMBER AND COMMUNICATION APPARATUS

A structure member is mounted in a communication apparatus including a conductive housing incorporating a dielectric substrate on which a high-frequency circuit is mounted. The structure member includes a pass member which passes a harmonic current component of an operating frequency generated in the dielectric substrate when the high-frequency circuit operates, and a suppression member having an EBG structure which suppresses a predetermined current component of the operating frequency. The structure member is provided between the dielectric substrate and the conductive housing. The suppression member is disposed along a current path of a harmonic current component flowing in the pass member. 1. A structure member mounted in a communication apparatus including a conductive housing incorporating a dielectric substrate on which a high-frequency circuit is mounted , the structure member comprising:a pass member which passes a harmonic current component of an operating frequency generated in said dielectric substrate when the high-frequency circuit operates; anda suppression member having an EBG structure which suppresses a predetermined current component of the operating frequency,wherein the structure member is provided between said dielectric substrate and said conductive housing, andsaid suppression member is disposed along a current path of a harmonic current component flowing in said pass member.2. The structure member according to claim 1 , wherein the structure member is provided between a GND portion of said dielectric substrate and said conductive housing.3. The structure member according to claim 1 , wherein said pass member passes a harmonic current component of an operating frequency generated in a GND portion of said dielectric substrate when the high-frequency circuit operates.4. The structure member according to claim 1 , wherein said pass member passes a harmonic current component of an operating fundamental frequency generated in a GND portion of said ...

MULTILAYER WIRING BOARD

A multilayer wiring board includes a first dielectric layer, a high-frequency signal line formed on a first surface of the first dielectric layer, a ground layer formed on a second surface of the first dielectric layer, and a second dielectric layer covering part of the ground layer. The high-frequency signal line is electrically connectable to a center conductor of a coaxial structure. The second dielectric layer is spaced from an edge of the first dielectric layer to which the coaxial structure is to be connected, so that a ground exposure portion of the ground layer is exposed on the edge of the first dielectric layer. The ground layer is electrically connectable directly to an outer conductor of the coaxial structure at the ground exposure portion. 1. A multilayer wiring board to which a coaxial structure for transmitting an electric signal with a center conductor and an outer conductor is connected , the multilayer wiring board comprising:a first dielectric layer;a high-frequency signal line formed on a first surface of the first dielectric layer, the high-frequency signal line being electrically connectable to the center conductor of the coaxial structure;a ground layer formed on a second surface of the first dielectric layer; anda second dielectric layer covering part of the ground layer, the second dielectric layer being spaced from an edge of the first dielectric layer to which the coaxial structure is to be connected, thereby exposing a ground exposure portion of the ground layer on the edge of the first dielectric layer,the ground layer being electrically connectable directly to the outer conductor of the coaxial structure at the ground exposure portion.2. The multilayer wiring board as recited in claim 1 , wherein the ground exposure portion of the ground layer is electrically connected directly to the outer conductor of the coaxial structure by at least one of a solder material claim 1 , silver paste claim 1 , and a conductive adhesive material applied ...

HIGH-FREQUENCY MODULE

A high-frequency module includes first and second switch IC elements and a substrate. The first and second switch IC elements are the same or substantially the same IC chips, and are mounted in the same or substantially the same orientation. The first switch IC element is mounted on the substrate. The second switch IC element is mounted above the first switch IC element. Due to wire bonding, the individual pad electrodes of the first and second switch IC elements are connected to the land electrodes of the substrate, which are to be connected to the individual pad electrodes. Between a pad electrode and a land electrode connected to each other, another land electrode is not provided. 1. (canceled)2. A high-frequency module comprising:a first switch IC and a second switch IC defining a switch circuit for a balanced signal and including pad electrodes, in which arrangements of the pad electrodes in each of the first switch IC and the second switch IC are the same or substantially the same as each other; anda substrate including land electrodes connected to the pad electrodes and including electrodes connecting the first switch IC and the second switch IC to an external circuit; whereinthe first switch IC is mounted on the substrate;the second switch IC is mounted on a surface of the first switch IC on a second side of the first switch IC opposite to a first side mounted on the substrate;the first switch IC and the second switch IC are mounted so that the pad electrodes are provided on a surface on the second side;the pad electrodes and the land electrodes are connected to each other via wire bonding; andbetween the pad electrodes connected via the wire bonding and the land electrodes, another land electrode or another pad electrode is not provided.3. The high-frequency module according to claim 2 , wherein the first switch IC and the second switch IC are the same switch ICs.4. The high-frequency module according to claim 2 , wherein the second switch IC is mounted on ...

Equalizer for loss-compensation of high-frequency signals generated in transmission channels

An equalizer for compensating transmission losses of electronic communication signals includes a circuit board and a compensation module. The compensation module includes a pair of input pins, a pair of output pins, first and second resistors, first and second vias, and a pair of micro-strips. When a signal transmitted by the circuit board is received by the input pins, a first part of the signal is directly outputted from the output pins, a second part of the signal is reflected by the first resistor and transmitted back to the output pins to be outputted, and a third part of the signal is reflected by the second resistor and transmitted back to the output pins to be outputted, such that the output of the equalizer applies two stages of compensation.

Device suppressing common-mode radiation

The present invention provides a device for suppressing common-mode radiation comprising: at least one resonator embedded into a plate, wherein the at least one resonator defines a plane having a normal direction parallel and perpendicular, respectively, to a longitudinal direction and a thickness direction of the plate. The embedment of the resonator into the plate enables a magnetic field, which is generated by a cable conductor when the device for suppressing common-mode radiation wraps the cable conductor therein, to perpendicularly pass through the plane so that the magnetic field and the resonator resonate together to generate a strong diamagnetism and thereby to suppress the common-mode radiation.

NETWORK COMMUNICATION DEVICE

A network communication device is disclosed. The network communication device includes a circuit board, a network connector, a network chip and a plurality of network magnetic assemblies. The network connector, the network chip and the network magnetic assemblies are disposed on the circuit board. The network magnetic assemblies are electrically connected with the network connector and the network chip, respectively. Each of the network magnetic assemblies includes an Ethernet transformer and at least one inductor. The Ethernet transformer is electrically connected in series with the inductor via a conductive trace of the circuit board. The spaced distance or a path length of the conductive trace between the Ethernet transformer and the inductor of the at least one network magnetic assembly is less than a first specific length. 1. A network communication device , comprising:a circuit board;a network connector disposed on the circuit board;a network chip disposed on the circuit board; anda plurality of network magnetic assemblies disposed on the circuit board and electrically connected with the network connector and the network chip, respectively, wherein each of the network magnetic assemblies includes an Ethernet transformer and at least one inductor, and the Ethernet transformer is electrically connected in series with the inductor via a conductive trace of the circuit board, wherein a spaced distance or a path length of the conductive trace between the Ethernet transformer and the inductor of at least one network magnetic assembly is less than a first specific length.2. The network communication device according to claim 1 , wherein the network connector is a RJ45 connector claim 1 , and the network chip is a Physical Layer Integrated Circuit.3. The network communication device according to claim 1 , wherein the Ethernet transformer is a surface mount transformer or a chip transformer claim 1 , and the inductor is a surface mount inductor or a chip inductor.4. ...

PRINTED CIRCUIT BOARD, MANUFACTURING METHOD THEREFOR, AND METAL-SURFACE TREATMENT LIQUID

The purpose of the present invention is to provide a printed circuit board wherein a resin layer exhibits excellent adhesion and a method for manufacturing said printed circuit board. This printed circuit board is provided with an insulating substrate, metal wiring laid out on said insulating substrate, and an insulating layer disposed on top of said metal wiring. A layer consisting of a thiol compound having at least four functional groups represented by formula (1) is interposed between the metal wiring and the insulating layer at the interface therebetween. 2. The printed circuit board according to claim 1 , wherein a thiol equivalent (g/eq) of the thiol compound is 2 claim 1 ,100 or less.3. The printed circuit board according to claim 1 , wherein a molecular weight of the thiol compound is 8 claim 1 ,400 or less.6. The manufacturing method of a printed circuit board according to claim 5 , wherein a thiol equivalent (g/eq) of the thiol compound is 2 claim 5 ,100 or less.7. The manufacturing method of a printed circuit board according to claim 5 , wherein a molecular weight of the thiol compound is 8 claim 5 ,400 or less.10. An IC package substrate claim 1 , comprising the printed circuit board according to .11. The printed circuit board according to claim 2 , wherein a molecular weight of the thiol compound is 8 claim 2 ,400 or less.14. The manufacturing method of a printed circuit board according to claim 6 , wherein a molecular weight of the thiol compound is 8 claim 6 ,400 or less. The present invention relates to a printed circuit board, a manufacturing method therefor, and a metal-surface treatment liquid.In recent years, as electronic devices have been required to have high functionality and the like, electronic parts have been becoming more integrated with a high density, and printed circuit boards and the like used for the electronic parts have also been becoming more miniaturized and higher in density. Under these circumstances, the width of metal wiring ...

Mobile wireless communications device with reduced interfering energy from the display and related methods

A mobile wireless communications device includes a housing and circuit board carried by the housing and includes radio frequency (RF) circuitry and a processor carried by the circuit board and operative with each other. A display connector for an LCD connector is mounted on the circuit board and adapted to be connected to a display. Display connection lines are carried by the circuit board and interconnect the display connector and processor for carrying signals from the processor to the display connector and a connected display. Filters are carried by the circuit board and connected to the display connection lines and reduce any interfering energy from the processor and display.

Solder column grid array capacitors

A grid array capacitor can be used to physically and electrically couple an integrated circuit (IC) package to a printed circuit board (PCB). The grid array capacitor includes an inner conductor and an inner dielectric coaxially surrounding the inner conductor. A secondary conductor can be located to surround, in a coaxial orientation, the inner dielectric. Both the inner conductor and the secondary conductor can be electrically connected to the IC package and to the PCB. In certain applications, the structure of the inner conductor, inner dielectric, and secondary conductor can provide capacitance used to decouple electronic circuits.

NOISE REDUCTION DEVICE AND PRINTED CIRCUIT ASSEMBLY INCLUDING THE SAME

A printed circuit assembly includes a printed circuit board, a processor, an oscillator and a noise reduction device. The printed circuit board has a ground connecting portion. The processor is disposed on the printed circuit board. The oscillator is disposed on the printed circuit board. The noise reduction device includes a wave absorber, a blocking sheet and an electrically conductive member. The wave absorber includes a processor covering part and an oscillator covering part. The oscillator covering part protrudes from one side of the processor covering part. The processor covering part and the oscillator covering part respectively cover the processor and the oscillator. The blocking sheet is stacked on the oscillator covering part to cover the oscillator. One end of the electrically conductive member is connected to the blocking sheet, and another end of the printed circuit board is connected to the ground connecting portion. 1. A noise reduction device , comprising:a wave absorber, comprising a processor covering part and an oscillator covering part, and the oscillator covering part protruding from one side of the processor covering part;a blocking sheet, stacked on the oscillator covering part; andan electrically conductive member, one end of the electrically conductive member connected to the blocking sheet, and another end of the electrically conductive member configured to be connected to ground.2. The noise reduction device according to claim 1 , wherein the wave absorber absorbs electromagnetic waves with a frequency ranging from 800 to 1000 megahertz (MHz).3. The noise reduction device according to claim 1 , wherein the wave absorber is electrically insulated.4. The noise reduction device according to claim 1 , wherein the blocking sheet is an aluminum foil.5. The noise reduction device according to claim 1 , wherein the blocking sheet is located within edges of the oscillator covering part.6. The noise reduction device according to claim 5 , wherein a ...

ELECTRICAL CONNECTORS AND PRINTED CIRCUITS HAVING BROADSIDE-COUPLING REGIONS

An electrical connector that includes a circuit board having a board substrate that has opposite board surfaces and a thickness measured along an orientation axis that extends between the opposite board surfaces. The circuit board has associated pairs of input and output terminals and signal traces that electrically connect the associated pairs of input and output terminals. The input and output terminals being configured to communicatively coupled to mating and cable conductors, respectively. Each associated pair of input and output terminals is electrically connected through a corresponding signal trace that has a conductive path extending along the board substrate between the corresponding input and output terminals. At least two signal traces form a broadside-coupling region in which the conductive paths of the at least two signal traces are stacked along the orientation axis and spaced apart through the thickness and extend parallel to each other for a crosstalk-reducing distance. 1. An electrical connector comprising:mating conductors configured to engage plug contacts from a modular plug at a mating interface, the mating conductors comprising differential pairs; anda circuit board including a board substrate that has opposite board surfaces and a thickness measured along an orientation axis extending between the opposite board surfaces, the circuit board having associated pairs of input and output terminals attached to the board substrate and signal traces that electrically connect the associated pairs of input and output terminals, the input terminals being communicatively coupled to the mating conductors and the output terminals being configured to communicatively couple to cable conductors of a communication cable;wherein each associated pair of input and output terminals is electrically connected through a corresponding signal trace that has a conductive path extending along the board substrate between the corresponding input and output terminals, at ...

ABSORBING TERMINATION IN AN INTERCONNECT

Embodiments of the present disclosure are directed toward techniques and configurations for electrical signal absorption in an interconnect disposed in a printed circuit board (PCB) assembly. In one instance, a PCB assembly may comprise a substrate, and an interconnect formed in the substrate to route an electrical signal within the PCB. The interconnect may be coupled with a connecting component that is disposed on a surface of the PCB. An absorbing material may be disposed on the PCB to be in direct contact with at least a portion of the connecting component to at least partially absorb a portion of the electrical signal. Other embodiments may be described and/or claimed. 125-. (canceled)26. An apparatus comprising:a printed circuit board (PCB) comprising at least one transmission line to route an electrical signal within the PCB, wherein at least one end of the transmission line is coupled to a connecting component that comprises a connector slot disposed on a surface of the PCB; anda connecting element inserted in the connector slot, wherein at least a surface of the connecting element that faces the connector slot is covered with an absorbing material in contact with at least a portion of the connector slot, to at least partially absorb a portion of the electrical signal.27. The apparatus of claim 26 , wherein the electrical signal comprises a transmission signal transmitted at a frequency between 5 and 7 GHz.28. The apparatus of claim 26 , wherein the connecting component is a first connecting component claim 26 , wherein the connector slot is a first connector slot claim 26 , wherein the connecting element is a first connecting element of a first computing component coupled with the apparatus.29. The apparatus of claim 28 , further comprising a second connecting component coupled with the transmission line claim 28 , wherein the second connecting component comprises a second connector slot to receive a corresponding second connecting element of a second ...

MULTILAYER CIRCUIT BOARD, SEMICONDUCTOR APPARATUS, AND METHOD OF MANUFACTURING MULTILAYER CIRCUIT BOARD

A multilayer circuit board with a laminated structure includes an outermost insulating layer provided as an uppermost or bottom layer of the multilayer circuit board and formed of a composite material containing a glass fiber; and a multilayer interconnect lamination provided as an adjacent layer next to the outermost insulating layer, the multilayer interconnect lamination having an interconnect provided in an insulating resin layer that does not contain a glass fiber, and an interlayer via electrically connected to the interconnect. 1. A multilayer circuit board with a laminated structure , comprising:an outermost insulating layer provided as an uppermost or bottom layer of the multilayer circuit board and formed of a composite material containing a glass fiber; anda multilayer interconnect lamination provided as an adjacent layer next to the outermost insulating layer, the multilayer interconnect lamination having an interconnect provided in an insulating resin layer that does not contain a glass fiber, and a interlayer via electrically connected to the interconnect.2. The multilayer circuit board as claimed in claim 1 , further comprising:a first surface electrode provided on a surface of the outermost insulating layer; anda via plug provided in the outermost insulating layer,wherein the first surface electrode is electrically connected to the interconnect by the via plug and the interlayer via.3. The multilayer circuit board as claimed in claim 1 ,wherein the interconnect provided in the insulating resin layer is a differential pair.4. The multilayer circuit board as claimed in claim 1 , wherein the insulating resin layer has a coefficient of thermal expansion similar or close to that of the interconnect.5. The multilayer circuit board as claimed in claim 1 , wherein the insulating resin layer is a polyimide layer and the interconnect is a copper interconnect.6. The multilayer circuit board as claimed in claim 1 , further comprising:a through via that passes ...

LOW-COST METHOD FOR SELECTIVELY REDUCING SWITCH LOSS

A method includes identifying a first output terminal of a radio frequency front end (RFFE) switch including a single pole input terminal and a number (N) of output terminals, the first output terminal selectively connected to a single RF band path. Each of the N output terminals is a component of a respective one of N throws of the RFFE switch, with N being greater than one. The N output terminals include the first output terminal corresponding to a first throw of the N throws and at least one additional output terminal not connected to any radio frequency (RF) band path. The at least one additional output terminal includes a second output terminal corresponding to a second throw of the N throws. The method includes forming a parallel connection between the single pole input terminal and the single RF band path. The parallel connection provides at least two parallel branches for routing RF signals being transceived between the single pole input terminal and the single RF band path. 1. A method comprising:identifying a first output terminal of a single input radio frequency front end (RFFE) switch that includes a single pole input terminal and multiple output terminals, each of the multiple output terminals being corresponding to a respective one of multiple throws of the RFFE switch, the multiple output terminals comprising the first output terminal corresponding to a first throw of the multiple throws and at least one additional output terminal not connected to any radio frequency (RF) band path; andforming a parallel connection between the single pole input terminal and a single RF band path, the parallel connection providing at least two branches for routing RF signals being transceived between the single pole input terminal and the single RF band path.2. The method of claim 1 , wherein the RFEE switch is a single-pole N-throw switch and forming the parallel connection comprises:placing a jumper that connects the first output terminal to at least a second output ...

COMPOSITE ELECTRONIC COMPONENT AND BOARD HAVING THE SAME

A composite electronic component includes a composite body in which a capacitor and an inductor are coupled to each other, the capacitor including a ceramic body including a plurality of dielectric layers and first and second internal electrodes, and the inductor including a magnetic body including a coil part. An input terminal is disposed on a first side surface of the composite body and is connected to the coil part. An output terminal includes a first output terminal disposed on the first side surface of the composite body and connected to the coil part and a second output terminal disposed on a first end surface of the composite body and connected to the first internal electrodes. A ground terminal is disposed on a second end surface of the composite body and is connected to the second internal electrodes. The capacitor is coupled to a side surface of the inductor. 1. A composite electronic component comprising:a composite body in which a capacitor and an inductor are coupled to each other, the capacitor including a ceramic body in which a plurality of dielectric layers and first and second internal electrodes disposed to face each other with respective dielectric layers interposed between the first and second internal electrodes are stacked, and the inductor including a magnetic body including a coil part;an input terminal disposed on a first side surface of the composite body in a width direction of the composite body and connected to the coil part of the inductor;an output terminal including a first output terminal disposed on the first side surface of the composite body in the width direction and connected to the coil part of the inductor and a second output terminal disposed on a first end surface of the composite body in a length direction of the composite body and connected to the first internal electrodes of the capacitor; anda ground terminal disposed on a second end surface of the composite body in the length direction and connected to the second ...

Assembly method for converting the precursors to capacitors

A method of assembling a packaged semiconductor device starts by dropping a pre-formed capacitor precursor on a surface of or within a first substrate. An integrated circuit die is dropped on either of the first substrate. If the pre-formed capacitor precursor lacks at least a first pair of vias for providing an electrical contact between capacitor plates of said chip capacitor, then at least a first pair of vias is formed in said pre-formed capacitor precursor. The first pair of vias are filled with an electrically conductive material to form the chip capacitor, wherein said filling of said vias provides an electrical contact between said first and second capacitor plates of said chip capacitor and said electrically conductive contact regions on said first substrate. A plurality of electrically conductive material layers and a plurality of dielectric layers are alternately stacked on a second substrate. The plurality of electrically conductive material layers comprise first and second patterns. The first pattern comprises at least a first pair of overlaying areas free of said electrically conductive material, and said second pattern comprises at least a second pair of overlaying areas free of said electrically conductive material. The first pair of areas overlay areas of the second pattern having said electrically conductive material and the second pair of areas overlay areas of the first pattern having said electrically conductive material. The plurality of electrically conductive material layers are electrically isolated from one another by the dielectric layers.

POWER SUPPLIES INCLUDING SHIELDED MULTILAYER POWER TRANSMISSION BOARDS

A power supply comprises a main circuit board and a multilayer power transmission board electrically coupled to the main circuit board. The multilayer board includes a conductive neutral layer having an inner side, a conductive line layer having an inner side facing the inner side of the conductive neutral layer, and a dielectric medium positioned between the conductive neutral layer and the conductive line layer. The power supply also comprises a first conductive outer layer positioned adjacently to an outer side of the conductive neutral layer, a second conductive outer layer positioned adjacently to an outer side of the conductive line layer, and a conductive plating material positioned within a slot formed in the multilayer power transmission board and covering an interior portion of the multilayer power transmission board facing the slot. The conductive plating material electrically couples the first and second conductive outer layers. 1. A power supply comprising:a main circuit board; and a conductive neutral layer having an inner side;', 'a conductive line layer having an inner side facing the inner side of the conductive neutral layer;', 'a dielectric medium positioned between the conductive neutral layer and the conductive line layer;', 'a first conductive outer layer positioned adjacently to an outer side of the conductive neutral layer;', 'a second conductive outer layer positioned adjacently to an outer side of the conductive line layer;', 'a conductive plating material positioned within a slot formed in the multilayer power transmission board and covering an interior portion of the multilayer power transmission board facing the slot; and', 'wherein the conductive plating material electrically couples the first and second conductive outer layers., 'a multilayer power transmission board electrically coupled to the main circuit board, the multilayer board including2. The power supply of claim 1 , wherein the multilayer power transmission board extends in a ...

POWER CIRCUIT DEVICE

Even when a grounding capacitor is included at either end of a common mode coil, there is noise that flows from a load into a metal frame, and there is a need to restrict an amount of noise propagating to a system power supply. Because of this, a noise loop is formed of a rectifier circuit, an inverter, a first electrical wire that connects a positive polarity side of the rectifier circuit and the inverter, a second electrical wire that connects a negative polarity side of the rectifier circuit and the inverter, a ground wire terminal that can connect a load connected to an output terminal or the inverter, and a conductive plate that connects at least one or the first electrical wire and second electrical wire and the ground wire terminal. 1. A power circuit device , comprising:a rectifier circuit;an inverter;a common mode coil provided on an input side of the rectifier circuit;a first electrical wire that connects the common mode coil, a positive polarity side of the rectifier circuit, and the inverter;a second electrical wire that connects the common mode coil, a negative polarity side of the rectifier circuit, and the inverter; a conductive plate;a bypass capacitor connected between the first electrical wire and second electrical wire and the conductive plate;a ground wire terminal that can connect a load connected to an output terminal of the inverter to a ground potential; anda metal framewherein the metal frame is divided into a first metal frame and a second metal frame, the first metal frame is connected to the conductive plate by an inductor or resistance, the second metal frame is connected to the ground wire terminal, and a noise loop is formed of at least one of the first electrical wire and second electrical wire, the bypass capacitor, the conductive plate, and the ground wire terminal.23-. (canceled)4. The power circuit device according to claim 1 , wherein the bypass capacitor is connected between the rectifier circuit and common mode coil.5. The ...

ELECTROSTATIC CHARGE BUILD-UP PREVENTION FOR DATA STORAGE DEVICES

A data storage drive includes a memory and a controller communicatively coupled to the memory. A casing encloses the controller and the memory. At least one electrically conductive grounding pad is included on an exterior of the casing. The electrically conductive grounding pad forms a portion of a low impedance path that extends from the grounding pad to a system ground in an interior of the data storage drive. The low impedance path prevents a build-up of static electricity. 1. A data storage drive comprising:a memory;a controller communicatively coupled to the memory;a casing that encloses the controller and the memory; andat least one electrically conductive grounding pad on an exterior of the casing, wherein the at least one electrically conductive grounding pad forms a portion of a low impedance path, andwherein the low impedance path extends from the at least one grounding pad on the exterior of the casing to a system ground in an interior of the data storage drive, and wherein the low impedance path is configured to prevent a build-up of static electricity.2. The data storage drive of and further comprising at least one electrically conductive fastener that is electrically coupled to the at least one grounding pad and electrically coupled to the system ground of the data storage drive claim 1 , and wherein the at least one electrically conductive fastener forms a portion of the low impedance path.3. The data storage drive of and further comprising a printed circuit board (PCB) and a low impedance path trace disposed on the PCB claim 2 , wherein the controller claim 2 , the memory and an electrostatic discharge (ESD) diode are mounted on the PCB claim 2 , and wherein the ESD diode is electrically coupled to the low impedance path trace and the system ground claim 2 , and wherein the at least one electrically conductive fastener is electrically coupled to the low impedance path trace via electrically conductive mounting hole pads.4. The data storage drive of ...

CIRCUIT BOARD AND DISPLAY DEVICE INCLUDING THE SAME

A circuit board for a display device includes: a signal line to transmit signal, a first metallic layer overlapping the signal line, a first conductive layer spaced apart from the first metallic layer, a base layer insulating the signal line from the first metallic layer and from the first conductive layer, and a first capacitor including a first terminal electrically coupled to the first metallic layer and a second terminal electrically coupled to the first conductive layer. 1. A circuit board for a display device , the circuit board comprising:a signal line to transmit a signal;a first metallic layer overlapping the signal line;a first conductive layer spaced apart from the first metallic layer;a base layer insulating the signal line from the first metallic layer and from the first conductive layer; anda first capacitor including a first terminal electrically coupled to the first metallic layer and a second terminal electrically coupled to the first conductive layer.2. The circuit board of claim 1 , wherein the first metallic layer comprises a first floating layer having a generally polygonal shape entirely overlapping the signal line.3. The circuit board of claim 1 , wherein the first conductive layer is configured to receive a ground voltage.4. The circuit board of claim 1 , wherein the first terminal of the first capacitor directly contacts the first metallic layer and the second terminal thereof directly contacts the first conductive layer.5. The circuit board of claim 1 , wherein the first metallic layer and the first conductive layer are formed of the same material and disposed on a first surface of the base layer.6. The circuit board of claim 1 , further comprising:a second metallic layer overlapping the signal line;a second conductive layer spaced apart from the second metallic layer; anda second capacitor including a first terminal electrically coupled to the second metallic layer and a second terminal electrically coupled to the second conductive layer.7 ...

Multilayer ceramic capacitor and board for mounting the same

There is provided a multilayer ceramic capacitor including a ceramic body including a plurality of dielectric layers and having first and second main surfaces, first and second side surfaces, and first and second end surfaces, a capacitor part formed in the ceramic body and including a first internal electrode exposed to the first and second end surfaces and a second internal electrode having a lead-out portion exposed to the first main surface, an internal connection conductor formed in the ceramic body and exposed to the first and second main surfaces, and first to fourth external electrodes formed on outer surfaces of the ceramic body and electrically connected to the first and second internal electrodes and the internal connection conductor, wherein the internal connection conductor is connected to the capacitor part in series.

STRUCTURE AND WIRING SUBSTRATE

Provided is a structure including a first conductor plane (); a second conductor plane (); a first transmission line () that is formed in a layer different from the first conductor plane () and the second conductor plane (); a second transmission line () that is disposed so as to face the second conductor plane () in a layer opposite to the first transmission line () with respect to the second conductor plane (); a first conductor via () that connects one end of the first transmission line () with the first conductor plane (); a second conductor via () that connects another end of the first transmission line () with one end of the second transmission line (); and a slit () that is formed on the second conductor plane (). 1. A structure comprising:a first conductor plane;a second conductor plane disposed so as to face the first conductor plane;a first transmission line that is formed in a layer different from the first conductor plane and the second conductor plane and is disposed so as to face the second conductor plane;a second transmission line that is formed in a layer different from the first conductor plane and the second conductor plane and is disposed so as to face the second conductor plane in a layer opposite to the first transmission line with respect to the second conductor plane;a first conductor via that connects one end of the first transmission line with the first conductor plane;a second conductor via that connects another end of the first transmission line and one end of the second transmission line; anda slit that is formed on the second conductor plane so as to partially intersect with one of the first transmission line and the second transmission line in a plan view.2. The structure according to claim 1 , wherein the first conductor plane claim 1 , the second conductor plane claim 1 , the first transmission line claim 1 , the second transmission line claim 1 , the first conductor via claim 1 , the second conductor via claim 1 , and the slit ...

COMMUNICATION DEVICE

A communication device is provided wherein a number of the pairs of transmission lines is N, each pair of the transmission lines comprises (N−1) stages of sub-transmission lines generating a same amount of crosstalk as that caused at a connector, and (N−1) stages of connecting portions comprise a transmission path of the connector and a first stage sub-transmission line, and (N−1) stages of the connecting portions to connect an i th stage sub-transmission line and an (i+1) th stage sub-transmission line by the straight/cross connection, and wherein each pair of the transmission lines is different in all pairs in a number of the connecting portion having the cross connection; and as a j th stage connecting portion in any one pair of the transmission lines has cross connection, a (N−j) th stage connecting portion in the any one pair of the transmission lines also has cross connection. 1. A communication device , comprising:a connector connected a communication cable having multiple pairs of signal lines for transmitting a differential signal; anda plurality of pairs of transmission lines for transmitting the differential signal inputted/outputted through the connector,wherein a number of the pairs of the transmission lines is N (N is an even number), each pair of the transmission lines comprises (N−1) stages of sub-transmission lines generating a same amount of crosstalk as that caused at the connector, and (N−1) stages of connecting portions comprise a first stage connecting portion to connect a transmission path of the connector and a first stage sub-transmission line by a straight/cross connection, and second to (N−1) th stage connecting portions to connect an i (i=1 to N−2) th stage sub-transmission line and an (i+1) th stage sub-transmission line by the straight/cross connection, andwherein each pair of the transmission lines is different in all pairs in a number of the connecting portion having the cross connection, and as a j (j=an integer by 1 to N/2) th stage ...

ADJUSTABLE IMPEDANCE HIGH SPEED DATA CONNECTOR, AND METHODS OF ASSEMBLING AND OPERATING THEREOF

An adjustable impedance high speed data connector, and methods for assembling and operating thereof. The adjustable impedance high speed data connector of this invention includes a printed circuit board accommodated within, or printed or stamped onto, a tray, the printed circuit board including sets of terminals respectively extending on opposite ends of the printed circuit board. Mounted onto the printed circuit board and electrically connected thereto is at least one electric module having a fixed or adjustable capacitance or a fixed or adjustable inductance, which may be combined in any desired combination to achieve a desired impedance for the connector. By adjusting the variable capacitance or inductance of the electric module (or the variable combinations of capacitance and/or inductance of a plurality of electric modules), the impedance within the connector is adjustable for allowing the connector to operate at various ranges of bandwidths. 1. An adjustable impedance high speed data connector , comprising:a cover having at least a first protruding latch;a tray having at least a second protruding latch;a printed circuit board mounted onto a floor of the tray, the printed circuit board having first and second sets of terminals extending on opposite ends thereof; and 'wherein the printed circuit board is housed within the cover and the tray with the first and second protruding latches connected to each other.', 'at least an electric module mounted onto the printed circuit board and connected thereto, the electric module having at least a capacitance or an inductance,'}2. The adjustable impedance high speed data connector as in claim 1 , wherein the electric module has a fixed capacitance or a fixed inductance.3. The adjustable impedance high speed data connector as in claim 2 , wherein the electric module has an adjustable capacitance or an adjustable inductance.4. The adjustable impedance high speed data connector as in claim 2 , wherein a plurality of electric ...

WIRING BOARD AND METHOD FOR DESIGNING SAME

[Problem] To achieve a wiring board capable of suppressing the difference in the amount of delay between two signal wirings constituting differential signal wirings, while securing flexibility in design. 1. A wiring board comprising:a first insulating layer comprising fibers having a long axis in a first direction and aligned approximately parallel to each other at a first interval and an insulating material filling gaps between the fibers of the first direction;a first signal wiring formed approximately parallel to the first direction on the first insulating layer; anda second signal wiring formed parallel to the first signal wiring such that an interval between the first and second wirings be approximately an integral multiple of the first interval, the second wiring transmitting a differential signal of a signal transmitted on the first signal wiring.2. The wiring board according to further comprisinga second insulating layer comprising fibers having a long axis in a third direction approximately parallel to the first direction and aligned approximately parallel to each other at the first interval and a second insulating material filling gaps between the fibers of the third direction, whereinthe first insulating layer and the second insulating layer together form a laminated structure.3. The wiring board according to claim 2 , wherein:the first insulating layer further comprises fibers having a long axis in a second direction different from the first direction and aligned approximately parallel to each other at a second interval, and the first insulating material further fills gaps between the fibers of the second direction; andthe second insulating layer further comprises fibers having a long axis in a fourth direction approximately parallel to the second direction and aligned approximately parallel to each other at the second interval, and the second insulating material further fills gaps between the fibers of the second direction.4. The wiring board according ...

COMPOSITE ELECTRONIC COMPONENT AND BOARD HAVING THE SAME

A composite electronic component includes a composite body in which a capacitor and an inductor are coupled to each other, the capacitor including a ceramic body including a plurality of dielectric layers and first and second internal electrodes, and the inductor including a magnetic body including a coil part. An input terminal is disposed on a first side surface of the composite body and is connected to the coil part. An output terminal includes a first output terminal disposed on the first side surface of the composite body and connected to the coil part and a second output terminal disposed on a first end surface of the composite body and connected to the first internal electrodes. A ground terminal is disposed on a second end surface of the composite body and is connected to the second internal electrodes. The capacitor is coupled to a side surface of the inductor. 1. A composite electronic component comprising:a composite body in which a capacitor and an inductor are coupled to each other, the capacitor including a ceramic body in which a plurality of dielectric layers and first and second internal electrodes disposed to face each other with respective dielectric layers interposed between the first and second internal electrodes are stacked, and the inductor including a magnetic body including a coil part;an input terminal disposed on a first side surface of the composite body in a width direction of the composite body and connected to the coil part of the inductor;an output terminal including a first output terminal disposed on the first side surface of the composite body in the width direction and connected to the coil part of the inductor and a second output terminal disposed on a second side surface of the composite body in the width direction and connected to the first internal electrodes of the capacitor; anda ground terminal disposed on the second side surface of the composite body in the width direction and connected to the second internal electrodes ...

Structure, wiring board and electronic device

A structure comprising: a first and a second conductor planes which are arranged in different layers and in a manner to face to each other; a first transmission line ( 103 ) which is arranged in a different layer from those of the first conductor plane and of the second conductor plane, faces to the second conductor plane, and has its one end being an open end; a first conductor via ( 104 ) which connects the other end of the first transmission line ( 103 ) with the first conductor plane; a second transmission line ( 105 ) which is formed in the same layer as that of the first transmission line, runs parallel to the first transmission line ( 103 ), and has its one end being an open end; and a second conductor via ( 106 ) which electrically connects the other end of the second transmission line ( 105 ) with either of the first and second conductor planes.

RESONANT CIRCUIT ELEMENT AND CIRCUIT MODULE

A first conductive pattern made from a conductive material is formed on a first surface that is one surface of a flexible film made from a dielectric material. An adhesive layer is disposed on a second surface opposite to the first surface of the flexible film. A pair of first outer electrodes generates an electric field in an in-plane direction of a composite member composed of the flexible film and the adhesive layer, and causes an electric current to flow through the first conductive pattern. 1. A resonant circuit element comprising:a flexible film made from a dielectric material;a first conductive pattern made from a conductive material and formed on a first surface that is one surface of the flexible film;an adhesive layer disposed on a second surface opposite to the first surface of the flexible film; anda pair of first outer electrodes configured to generate an electric field in an in-plane direction of a composite member composed of the flexible film and the adhesive layer, and to cause an electric current to flow through the first conductive pattern.2. The resonant circuit element according to claim 1 , wherein each of the first outer electrodes of the pair includes a portion formed on a corresponding end face of the composite member.3. The resonant circuit element according to claim 1 , further comprising:a second conductive pattern made from a conductive material and formed on the first surface; anda pair of second outer electrodes configured to cause an electric current to flow through the second conductive pattern and to generate an electric field in an in-plane direction of the composite member, wherein the first conductive pattern and the second conductive pattern constitute a choke coil.4. The resonant circuit element according to claim 1 , wherein the adhesive layer is formed from a thermosetting or photo-curable adhesive.5. The resonant circuit element according to claim 2 , further comprising:a second conductive pattern made from a conductive ...

Composite component-embedded circuit board and composite component

A composite component-embedded circuit board includes a circuit board including a first functional block disposed closer to an upper surface of the circuit board, and a second functional block different from the first functional block and disposed closer to a lower surface of the circuit board, and a composite chip circuit embedded in the circuit board and including first and second circuit elements. The composite component further includes first and second terminal electrodes. The first terminal electrode is disposed on an upper surface of the composite component. The first terminal electrode is connected to the composite circuit and to the first functional block. The second terminal electrode is disposed on a lower surface of the composite component. The second terminal electrode is connected to the composite circuit and to the second functional block.

Wiring substrate

A wiring substrate comprises a first substrate, a second substrate which includes a frame body located on the outer circumferential edge of the first substrate, at least two connecting parts connected to the inner circumferential part of the frame body, and a support body connecting the two connecting parts to each other, and a third substrate located on a surface of the second substrate opposite the first substrate. The support body includes a direction changing part between the two connecting parts and does not include an annular structure where the direction changing part is included on the circumference.

PRINTED CIRCUIT BOARD

A printed circuit board is disclosed. The printed circuit board includes a first substrate portion, and a second substrate portion connected to the first substrate portion and having a flexible insulation layer which is bendable, and the second substrate portion includes a frame member inserted into the flexible insulation layer. 1. A printed circuit board , comprising:a first substrate portion; anda second substrate portion connected to the first substrate portion, and having a flexible insulation layer which is bendable and comprises a first insulation layer having a through-hole therein and a second insulation layer,wherein the second substrate portion includes a frame member disposed in the through-hole, andthe second insulation layer fills at least a portion of a gap between the frame member and the first insulation layer.2. The printed circuit board of claim 1 , wherein the second substrate portion includes:a first region, adjacent to the first substrate portion and connected to the first substrate portion, and which is bendable; anda second region spaced apart from the first substrate portion, and into which the frame member is inserted.3. The printed circuit board of claim 2 , wherein one side of the flexible insulation layer is provided with a pad on which a first electronic element is mounted is formed claim 2 , andthe pad is formed on the second region.4. The printed circuit board of claim 1 , wherein the frame member is provided with an accommodation space which is penetrated claim 1 , andthe printed circuit board further includes a second electronic element disposed in the accommodation space, and embedded in the flexible insulation layer.5. The printed circuit board of claim 4 , wherein the frame member includes an electromagnetic interference (EMI) shielding material.6. The printed circuit board of claim 5 , wherein the frame member includes at least one of a magnetic material and a metal.7. The printed circuit board of claim 1 , wherein the flexible ...

METAL-CLAD LAMINATED BOARD, METAL MEMBER PROVIDED WITH RESIN, AND WIRING BOARD

A metal-clad laminated board includes an insulating layer and a metal layer, in which the insulating layer includes a cured product of a resin composition containing a modified polyphenylene ether compound terminally modified with a substituent having an unsaturated double bond; and a crosslinkable curing agent having an unsaturated double bond in the molecule, and containing 40 to 250 parts by mass of silica particles with respect to 100 parts by mass in total of the modified polyphenylene ether compound and the crosslinkable curing agent, the resin composition contains 0.2 to 5 parts by mass of a first silane coupling agent having an unsaturated double bond in the molecule with respect to 100 parts by mass of the silica particles, and a contact surface of the metal layer in contact with the insulating layer is surface-treated with a second silane coupling agent having an amino group in the molecule. 1. A metal-clad laminated board comprising an insulating layer and a metal layer present in contact with at least one surface of the insulating layer ,whereinthe insulating layer includes a cured product of a resin composition containing a modified polyphenylene ether compound terminally modified with a substituent having a carbon-carbon unsaturated double bond; a crosslinkable curing agent having a carbon-carbon unsaturated double bond in a molecule; a first silane coupling agent having a carbon-carbon unsaturated double bond in a molecule; and at least one of silica particles and silica particles surface-treated with the first silane coupling agent,a total content of the silica particles and the silica particles surface-treated with the first silane coupling agent is 40 to 250 parts by mass with respect to 100 parts by mass in total of the modified polyphenylene ether compound and the crosslinkable curing agent,a total content of the first silane coupling agent contained in the resin composition and the first silane coupling agent contained in the silica particles ...

ANTI-ELECTROMAGNETIC INTERFERENCE CIRCUIT BOARD

An anti-electromagnetic interference circuit board includes a circuit board and a magnetic conductor. The circuit board has a plurality of vias, and the magnetic conductor is covered on the circuit board to cover some of the vias. The magnetic conductor includes a plate, a carrier, a sprayed magnetic conductor, and a wave absorbing magnetic conductor. 1. An anti-electromagnetic interference circuit board , comprising:a circuit board, having a plurality of vias, anda magnetic conductor, covered on the circuit board to cover some of the vias.2. The anti-electromagnetic interference circuit board according to claim 1 , wherein the magnetic conductor comprises a plate or a carrier.3. The anti-electromagnetic interference circuit board according to claim 2 , wherein the plate comprises a plurality of openings to accommodate elements on the circuit board.4. The anti-electromagnetic interference circuit board according to claim 2 , wherein the plate further comprises an adhesive layer to be attached on the circuit board.5. The anti-electromagnetic interference circuit board according to claim 2 , wherein the carrier comprises a plurality of fixing elements to fix the carrier and the plate on the circuit board.6. The anti-electromagnetic interference circuit board according to claim 2 , further comprising a plurality of clamping elements to clamp the plate on the circuit board.7. The anti-electromagnetic interference circuit board according to claim 2 , further comprising a grounding terminal to connect to the plate or the carrier.8. The anti-electromagnetic interference circuit board according to claim 1 , wherein the magnetic conductor is a sprayed magnetic conductor claim 1 , or a wave absorbing magnetic conductor. This application claims the priority benefit of TW application serial No. 107209124, filed on Jul. 5, 2018. The entirety of the above-mentioned patent application is hereby incorporated by reference herein and made a part of the specification.The disclosure ...

PRINTED WIRING BOARD FOR HIGH FREQUENCY TRANSMISSION

A printed wiring board for high frequency transmission according to an embodiment of the present invention includes: an insulating base material a signal line extending in a longitudinal direction of the insulating base material ground wirings extending in the longitudinal direction while being spaced apart from the signal line by a predetermined distance; a ground layer formed on a major surface a plurality of ground connection vias electrically connecting the ground wiring and the ground layer and a plurality of ground connection vias electrically connecting the ground wiring and the ground layer A width of the ground wirings is smaller than a land diameter of the ground connection vias Then, the ground connection vias and the ground connection vias are arranged not to overlap each other in a width direction perpendicular to the longitudinal direction throughout a cable portion 1. A printed wiring board for high frequency transmission , comprising:an insulating base material having a first major surface and a second major surface opposite to the first major surface, and extending in a longitudinal direction thereof;a first signal line formed on the first major surface and extending in the longitudinal direction;a first ground wiring formed on the first major surface and extending in the longitudinal direction while being spaced apart from the first signal line by a predetermined distance;a second ground wiring formed on an opposite side of the first ground wiring with the first signal line interposed therebetween on the first major surface, and extending in the longitudinal direction while being spaced apart from the first signal line by a predetermined distance;a ground layer formed on the second major surface;a plurality of first ground connection vias electrically connecting the first ground wiring and the ground layer; anda plurality of second ground connection vias electrically connecting the second ground wiring and the ground layer, whereina width of the ...

METHOD OF MANUFACTURING PHYSICAL STRUCTURE FOR HIGH FREQUENCY SIGNAL TRANSMISSION

A method for fabricating a sandwiched structure of silver-copper-silver functioning as a high frequency signal transmission structure includes an insulating sheet and a conductive circuit on the insulating sheet. The conductive circuit includes a silver conductive layer bonded to the insulating sheet, a copper conductive layer formed on the silver conductive layer, and a silver covering layer laid to cover top and side surfaces of the copper conductive layer. The silver conductive layer and the silver covering layer together enclose the copper conductive layer and the higher conductivity of the silver together with the skin effect improves high-frequency transmission efficiency of the copper. 1. A method of manufacturing a high frequency signal transmission structure , comprising:providing an insulating sheet, forming a silver bottom layer on the insulating sheet;forming a copper conductive layer on a part of the silver bottom layer;removing the silver bottom layer which is not covered by the copper conductive layer; andforming a silver covering layer on the copper conductive layer, wherein the copper conductive layer is surrounded by the silver bottom layer and the silver covering layer, the silver bottom layer, the copper conductive layer and the silver covering layer cooperatively form a conductive circuit, the copper conductive layer is a core of the conductive circuit, and the silver conductive layer and the silver covering layer cooperatively form a cladding layer wrapping the core of the conductive wiring layer.2. The method of claim 1 , wherein the silver bottom layer is formed on the insulating sheet by vacuum evaporation.3. The method of claim 1 , wherein the insulating sheet is made from polyester polymer claim 1 , polynaphthalene dicarboxylic acid glycol ester claim 1 , polyimide claim 1 , or polyterephthalate.4. The method of claim 1 , wherein before evaporating a silver bottom layer on the insulating sheet claim 1 , further comprising pre-treating a ...

FLEXIBLE BOARD AND ELECTRONIC DEVICE

A flexible board includes a flexible body and a linear conductor. The flexible body includes a first main surface and a second main surface. The linear conductor is provided at the flexible body so as to be located closer to the first main surface than to the second main surface. The flexible body is valley-folded along a line crossing the linear conductor such that the first main surface is located inside of the fold, and is mountain-folded along a line crossing the linear conductor such that the first main surface is outside of the fold. An average radius of curvature in an area where the flexible body is mountain-folded is greater than an average radius of curvature in an area where the flexible body is valley-folded. 1. (canceled)2. A flexible board comprising:a flexible body including a first main surface and a second main surface; anda linear conductor provided at the flexible body so as to be located closer to the first main surface than to the second main surface; whereinthe flexible body is valley-folded along a line crossing the linear conductor such that the first main surface is located inside of the fold, and is mountain-folded along a line crossing the linear conductor such that the first main surface comes is located outside of the fold; andan average radius of curvature in an area where the flexible body is mountain-folded is greater than an average radius of curvature in an area where the flexible body is valley-folded.3. The flexible board according to claim 2 , further comprising:a first ground conductor provided between the linear conductor and the first main surface; anda second ground conductor provided between the linear conductor and the second main surface; whereina distance between the first ground conductor and the linear conductor is smaller than a distance between the second ground conductor and the linear conductor.4. The flexible board according to claim 3 , wherein an area where the first ground conductor and the linear conductor face ...

Rigid flexible circuit board with impedance control

A rigid-flexible circuit board includes at least one flexible circuit board and at least one rigid circuit board. The flexible circuit board includes a flexible-board substrate, a plurality of flexible circuit board differential mode signal lines, at least one flexible circuit board grounding line, a flexible circuit board insulation layer formed on the upper surface of the flexible-board substrate and covering the flexible circuit board differential mode signal lines and the flexible circuit board grounding line. The rigid circuit board is stacked on the stacking section of the flexible circuit board. A shielding layer is formed on the flexible circuit board insulation layer of the flexible circuit board and corresponds to the extension section of the flexible circuit board. The shielding layer further extends from the extension section to the stacking section. An impedance control structure is formed on the shielding layer to control the impedance of the flexible circuit board differential mode signal lines.

DEVICE AND METHOD FOR TRANSMITTING A HIGH-FREQUENCY SIGNAL

A and a method for transmitting a high-frequency signal. The device is designed to include a carrier, through which a passage is formed; a transmitting element on a first surface of the carrier, to which the high-frequency signal may be applied; and a receiving element on a second surface of the carrier, which is galvanically isolated from the transmitting element, the high-frequency signal being transmittable as an electromagnetic wave through the passage to the receiving element with the aid of the transmitting element. 112-. (canceled)13. A device for transmitting a high-frequency signal , comprising:an electrically non-conductive carrier through which a passage is formed from a first surface of the carrier to a second surface of the carrier;a transmitting element situated on or at the first surface of the carrier and to which the high-frequency signal may be applied;a receiving element situated on or at the second surface of the carrier, the receiving element being galvanically isolated from the transmitting element;wherein the applied high-frequency signal being transmittable as an electromagnetic wave to the receiving element through the passage through the carrier with the aid of the transmitting element.14. The device as recited in claim 13 , wherein at least one of: (i) the transmitting element is situated between the carrier and a first reflector element claim 13 , which reflects electromagnetic waves incident from a direction of the passage in a direction of the passage claim 13 , and (ii) the receiving element is situated between the carrier and a second reflector element claim 13 , which reflects electromagnetic waves incident from the direction of the passage in the direction of the passage.15. The device as recited in claim 14 , wherein at least one of: (i) the first reflector element is a third metallic layer provided on a surface of the first closure element facing away from the carrier claim 14 , and (ii) the second reflector element is a fourth ...

WIRING BOARD STRUCTURE AND METHOD OF MANUFACTURING WIRING BOARD STRUCTURE

A wiring board structure includes: a first wiring board includes a first interconnection and a second interconnection constituting a power supply route; a second wiring board mounted over the first wiring board and includes a third interconnection electrically coupled to the first interconnection; a semiconductor chip mounted over the second wiring board and electrically coupled to the third interconnection; a lid mounted over the second wiring board and electrically coupled to the semiconductor chip; and a coupler electrically couples the lid and the second interconnection to each other.

PRINTED CIRCUIT BOARD WITH REDUCED EMISSION OF ELECTRO-MAGNETIC RADIATION

A printed circuit board including a first outer layer, a second outer layer and an integrated circuit mounted on the second outer layer. The integrated circuit has a single exposed pad electrically connected to a ground reference, a first supply pin electrically connected to a first power supply and a second supply pin electrically connected to a second power supply, wherein the first power supply is configured to generate a first supply current with frequency components higher than the frequency components of a second supply current generated by the second power supply. 1. Printed circuit board comprising:a first outer layer;a second outer layer;an integrated circuit mounted on the second outer layer, said integrated circuit having:a single exposed pad electrically connected to a ground reference,a first supply pin electrically connected to a first power supply,a second supply pin electrically connected to a second power supply,wherein the first power supply is configured to generate a first supply current with frequency components higher than frequency components of a second supply current generated by the second power supply;a first decoupling capacitor mounted on the second outer layer in the proximity of the first supply pin, the first decoupling capacitor having a first terminal electrically connected with the first supply pin and having a second terminal;an inner layer interposed between the first outer layer and the second outer layer, the inner layer comprising a metal layer electrically connected to said ground reference;a first via configured to electrically connect the exposed pad with the metal layer of the inner layer;a second via configured to electrically connect the second terminal of the first decoupling capacitor with the metal layer of the inner layer;a second decoupling capacitor having a first pin electrically connected to the second power supply and having a second pin electrically connected to said ground reference.2. Printed circuit board ...

Semiconductor device and circuit board

A semiconductor device includes a semiconductor chip, a plurality of external terminals, and a board. The board includes a first main surface in which a plurality of first electrodes electrically connected to the semiconductor chip are formed, a second main surface in which a plurality of second electrodes electrically connected to the plurality of external terminals are formed, and a plurality of interconnect layers, provided between the first main surface and the second main surface, for forming a plurality of signal paths that electrically connect the first electrode and the second electrode corresponding thereto. The interconnect layer includes a plurality of metal members which are dispersedly disposed at a distance shorter than an electromagnetic wavelength equivalent to a signal band of a signal supplied to the signal path, in the vicinity of a portion in which a structure of an interconnect for forming the signal path is changed.

STACKED AND FOLDED ABOVE MOTHERBOARD INTERPOSER

A computing device has a motherboard circuit substrate having at least a first layer of electrical interconnects, a socket arranged to receive a main processor for the computing device, the socket electrically coupled to at least a portion of the first layer of electrical interconnects, at least two interposer substrates between the main processor and the socket such that the interposer substrate electrically connects to the main processor and the socket, wherein the interposer substrate has a first set of interconnects that electrically connect between the socket and the first layer of electrical interconnects, at least two peripheral circuits on each interposer substrate, the peripheral circuit connected to the main processor through a second set of interconnects on the interposer substrate that connects to the main processor without connecting to the socket or the motherboard circuit substrate, wherein each interposer substrate is folded to allow each peripheral circuit to have an equal path length between the peripheral circuit and the main processor, wherein the at least two interposer substrates are stacked such that the at least two peripheral circuits on each interposer substrate are stacked with the at least two peripheral circuits on another of the at least two interposer substrates. 1. A computing device , comprising:a motherboard circuit substrate having at least a first layer of electrical interconnects;a socket arranged to receive a main processor for the computing device, the socket electrically coupled to at least a portion of the first layer of electrical interconnects;at least two interposer substrates between the main processor and the socket such that the interposer substrate electrically connects to the main processor and the socket, wherein the interposer substrate has a first set of interconnects that electrically connect between the socket and the first layer of electrical interconnects; andat least two peripheral circuits on each interposer ...

PLUG CONNECTOR FOR TUNING CROSSTALK AND RETURN LOSS

A method and apparatus for tuning crosstalk and return loss are provided. In the method and apparatus, a filter tunes return loss caused by a first external terminal and a second external terminal to compensate for a capacitive load induced by sizes of and a proximity between the first and second external terminals. The filter decouples the tuning of the return loss from tuning a magnitude and a phase of a crosstalk between a first transmission line network and a second transmission line network such that the return loss is tuned with minimal impact on the crosstalk. 1. An apparatus , comprising:a printed circuit board;a plurality of external terminals at a first end of the printed circuit board; anda plurality of internal terminals at a second end of the printed circuit board, the printed circuit board including a filter coupled to a first external terminal and a second external terminal of the plurality of external terminals, the filter including a first inductor coupled between the first external terminal and a first side of a capacitor, and a second inductor coupled between the second external terminal and a second side of the capacitor, the filter being operative to tune return loss caused by the first and second external terminals and help compensate for a capacitive load induced by sizes of and a proximity between the first and second external terminals.2. The apparatus of claim 1 , wherein the printed circuit board further includes a first transmission line network including a first transmission line and a second transmission line claim 1 , the first transmission line being coupled between the first side of the capacitor and a first internal terminal and the second transmission line being coupled between the second side of the capacitor and a second internal terminal claim 1 , each of the first and second transmission lines being located on the printed circuit board within a distance of a second transmission line network to tune a magnitude of crosstalk ...

SYSTEMS, METHODS AND APPARATUS FOR USE WITH SUPERCONDUCTING BASED COMPUTING SYSTEMS

An electrical filter includes a dielectric substrate with inner and outer coils about a first region and inner and outer coils about a second region, a portion of cladding removed from wires that form the coils and coupled to electrically conductive traces on the dielectric substrate via a solder joint in a switching region. An apparatus to thermally couple a superconductive device to a metal carrier with a through-hole includes a first clamp and a vacuum pump. A composite magnetic shield for use at superconductive temperatures includes an inner layer with magnetic permeability of at least 50,000; and an outer layer with magnetic saturation field greater than 1.2 T, separated from the inner layer by an intermediate layer of dielectric. An apparatus to dissipate heat from a superconducting processor includes a metal carrier with a recess, a post that extends upwards from a base of the recess and a layer of adhesive on top of the post. Various cryogenic refrigeration systems are described. 1. An apparatus , comprising:a first shield that provides magnetic shielding to an environment;at least one electrically conductive coil located about the first shield;a current source operable to provide a direct current; causes a degaussing field to be applied to the first shield;', 'determines an initial measurement of a magnetic field in at least one location in the magnetically shielded environment, the initial measurement representative of the magnetic field in at least one location in the magnetically shielded environment following application of the degaussing field to the first shield;', [{'sup': th', 'th', 'th, 'causes a direct current of an iamperage to pass through the at least one electrically conductive coil during an iperiod of time, where the iamperage is greater than a previous amperage, if any;'}, {'sup': th', 'th', 'th', 'th', 'th', 'th, 'after the direct current of the iamperage passes through the at least one electrically conductive coil during the iperiod of ...

COMPOSITE ELECTRONIC COMPONENT AND BOARD HAVING THE SAME

A composite electronic component may include: a composite element in which a capacitor and an inductor are spaced apart from each other, the capacitor including a ceramic body, and the inductor including a magnetic body; a first external electrode disposed on a second end surface of the ceramic body, second external electrodes disposed on first and second side surfaces of the ceramic body, a first dummy electrode disposed on a first end surface of the ceramic body; and third and fourth external electrodes disposed on first and second end surfaces of the magnetic body. The composite element may include a first metal frame disposed on a first end surface of the composite element, a second metal frame disposed on a second end surface of the composite element, and third metal frames disposed on one or more of first and second side surfaces of the composite element. 1. A composite electronic component comprising:a composite element including a capacitor and an inductor spaced apart from each other by a predetermined distance in a stacking direction, the capacitor including a ceramic body in which a plurality of dielectric layers and first and second internal electrodes facing each other with each of the dielectric layers interposed therebetween are stacked, the first internal electrodes being exposed to a second end surface of the ceramic body and the second internal electrodes having lead-out portions exposed to first and second side surfaces of the ceramic body, respectively, and the inductor including a magnetic body in which conductive patterns and a plurality of magnetic sheets are stacked;a first external electrode disposed on the second end surface of the ceramic body and electrically connected to the first internal electrodes, second external electrodes disposed on the first and second side surfaces of the ceramic body and electrically connected to the second internal electrodes, a first dummy electrode disposed on a first end surface of the ceramic body; ...

SIDEBAND CONDUCTOR RESONANCE MITIGATION

An apparatus comprising includes a first pair of conductors to carry differential signals, at least one ground conductor neighboring the first pair of conductors, the ground conductor to be connected to a ground plane, and at least one particular conductor to carry sideband signals. The particular conductor is to be connected to a ground plane via a resonance mitigation circuit, and the resonance mitigation circuit comprises a resistor. 120.-. (canceled)21. An apparatus comprising: a set of signaling conductors corresponding to differential transmitter pairs and differential receiver pairs of an interface;', 'a set of ground conductors; and', 'a set of sideband conductors, wherein each conductor in the set of sideband conductors comprises a respective alternating current (AC) match termination, wherein the AC match termination terminates to ground via a resistor in series with a capacitor., 'an add-in card comprising a connector, wherein the connector comprises22. The apparatus of claim 21 , wherein the interface is based on a Peripheral Component Interconnect Express (PCIe)-based specification.23. The apparatus of claim 21 , wherein one or more of the sideband conductors has a tee connection to the corresponding AC match termination.24. The apparatus of claim 21 , wherein the set of signaling conductors are to carry high-speed data signals and the set of sideband conductors are to carry auxiliary signals.25. The apparatus of claim 24 , wherein the auxiliary signals comprises one or more of a Reserved signal claim 24 , a Present# (PRSNT) signal claim 24 , a Clock Request signal claim 24 , or a Power Brake signal.26. The apparatus of claim 25 , wherein the auxiliary signals comprise the Reserved signal claim 25 , the Present# (PRSNT) signal claim 25 , the Clock Request signal claim 25 , and the Power Brake signal.27. The apparatus of claim 24 , wherein the high-speed data signals are according to a PCIe-based interconnect protocol.28. The apparatus of claim 21 , ...

NOISE FILTER AND ELECTRICAL AND ELECTRONIC EQUIPMENT

A noise filter includes a magnetic core including a magnetic material; and a distance adjusting member that accepts adjustment of a distance between a loop portion and the magnetic core, the loop portion being a portion of one or more conductor wiring lines wired in loop shape out of a first conductor wiring line and a second conductor wiring line. 1. A noise filter comprising:a ground line connected between a first circuit mounted on a first conductor layer of a board and a second circuit mounted on the first conductor layer;a capacitor having a first end connected to the ground line;a first conductor wiring line connected between a second end of the capacitor and the second circuit and wired in loop shape on the first conductor layer;a second conductor wiring line connected between the first circuit and the second end of the capacitor and wired in loop shape on a second conductor layer of the board, the second conductor wiring line being coupled to the first conductor wiring line by a magnetic field;a magnetic core including a magnetic material; anda distance adjusting member to accept adjustment of a distance between at least one of loop portions and the magnetic core, the loop portions being wiring portions in loop shape of the respective first and second conductor wiring lines,wherein the distance adjusting member accepts movement of the magnetic core in a horizontal direction of the first conductor layer or a horizontal direction of the second conductor layer.2. The noise filter according to claim 1 , wherein the loop portion of the first conductor wiring line and the loop portion of the second conductor wiring line go around in a same direction.3. The noise filter according to claim 2 , wherein the loop portion of the first conductor wiring line and the loop portion of the second conductor wiring line are coaxially arranged.4. The noise filter according to claim 1 , wherein the magnetic core is adjusted by the distance adjusting member to a location at which ...

Printed circuit board and switching power supply employing it

A printed circuit board has: a first wiring pattern laid in a first layer such that, when a predetermined component is mounted in a predetermined mounting region, a first current path in an open ring shape leading from a first end to a second end is formed; a second wiring pattern laid in a second layer different from the first layer such that a second current path in an open ring shape leading from a third end to a fourth end is formed; a first conductive member formed between the second and third ends; and a second conductive member formed between the first and fourth ends. The first and second wiring patterns are so laid that, as seen in their respective plan views, the directions of the currents flowing across the first and second current paths, respectively, are opposite to each other.

WALL FOR ISOLATION ENHANCEMENT

A circuit assembly is provided and includes a printed circuit board (PCB) having a circuit element region and defining a trench surrounding an entirety of the circuit element region, a circuit element disposed within the circuit element region of the PCB; and a Faraday wall. The Faraday wall includes a solid, unitary body having a same shape as the trench. The Faraday wall is disposed within the trench to surround an entirety of the circuit element. 1. A circuit assembly , comprising:a printed circuit board (PCB) having a circuit element region and defining a trench surrounding an entirety of the circuit element region;a circuit element disposed within the circuit element region of the PCB; anda Faraday wall comprising a solid, unitary body having a same shape as the trench and being disposed within the trench to surround an entirety of the circuit element.2. The circuit assembly according to claim 1 , wherein the circuit element comprises one or more of a microwave circuit claim 1 , an antenna and a radiator.3. The circuit assembly according to claim 1 , wherein the PCB has multiple layers.4. The circuit assembly according to claim 1 , wherein one or more of the multiple layers defines the trench and the Faraday wall traverses the one or more of the multiple layers within the trench.5. The circuit assembly according to claim 1 , wherein the Faraday wall comprises a conductive material.6. The circuit assembly according to claim 1 , wherein the Faraday wall has a polygonal shape within a plane of the PCB.7. The circuit assembly according to claim 6 , wherein the Faraday wall comprises one or more of corners with complex geometrical shapes claim 6 , chamfered corners and sides comprising inwardly protruding features.8. The circuit assembly according to claim 1 , wherein the Faraday wall is one or more of soldered and press-fit into a secured position within the trench.9. The circuit assembly according to claim 1 , wherein:the trench is defined as multiple trenches ...

Circuit board structure for high frequency signals

A circuit board structure for high frequency signals includes a substrate and an electrical conductive circuit layer formed on the substrate. The conductive circuit layer includes circuit patterns and connection pads. The circuit pattern includes a base part with a shape of a rectangular block and a circular top part with a hemispherical shape provided on the base part. The circular top part can be modified by a circular bottom part embedded in the dielectric plastic film. Alternatively, a double layer structure with the circular top and bottom parts is formed such that the surface of the circuit pattern is provided with hemispheres to strengthen the reflection, thereby overcoming the problem of signal concentration due to the rectangular structure or the issue of signal attenuation due to surface roughness.

HIGH-FREQUENCY TRANSMISSION LINE AND ELECTRONIC DEVICE

A transmission line portion of a flat cable includes first regions and second regions connected alternately. In the first region, the transmission line portion is a flexible tri-plate transmission line including a dielectric element including a signal conductor, a first ground conductor including opening portions, and a second ground conductor which is a solidly filled conductor. In the second region, the transmission line portion is a hard tri-plate transmission line including a wide dielectric element including a meandering conductor, and a first ground conductor and a second ground conductor which are solidly filled conductors. A variation width of the characteristic impedance in the second region is larger than a variation width of the characteristic impedance in the first region. 1. A high-frequency transmission line comprising:a flexible planar dielectric element elongated in one direction, the dielectric element having a predetermined width in a direction perpendicular or substantially perpendicular to a longitudinal direction and having a predetermined thickness;a signal conductor disposed in the dielectric element and configured to extend along the longitudinal direction; anda first ground conductor opposing the signal line conductor and extending in the longitudinal direction; whereinat least one of the signal conductor and the first ground conductor has a characteristic impedance cyclically varied along the longitudinal direction, and includes a first region and a second region with different variation widths of the characteristic impedance;the variation width of the characteristic impedance in the second region is larger than the variation width of the characteristic impedance in the first region; anda width of the second region of the dielectric element is larger than a width of the first region of the dielectric element.2. The high-frequency transmission line according to claim 1 , wherein in the first region claim 1 , the first ground conductor is ...

SEMICONDUCTOR DEVICE

A semiconductor device with enhanced performance. The semiconductor device has a high speed transmission path which includes a first coupling part to couple a semiconductor chip and an interposer electrically, a second coupling part to couple the interposer and a wiring substrate, and an external terminal formed on the bottom surface of the wiring substrate. The high speed transmission path includes a first transmission part located in the interposer to couple the first and second coupling parts electrically and a second transmission part located in the wiring substrate to couple the second coupling part and the external terminal electrically. The high speed transmission path is coupled with a correction circuit in which one edge is coupled with a branching part located midway in the second transmission part and the other edge is coupled with a capacitative element, and the capacitative element is formed in the interposer. 1. A semiconductor device comprising:a first substrate having a first front surface and a first back surface opposite to the first front surface;a second substrate having a second front surface and a second back surface opposite to the second front surface and being mounted over the first substrate with the first front surface of the first substrate facing the second back surface; anda first semiconductor component mounted over the second front surface of the second substrate and coupled with a first signal transmission path,the first signal transmission path comprising:a first coupling part to couple the first semiconductor component and the second substrate electrically;a second coupling part to couple the second substrate and the first substrate;a first external terminal formed on the first back surface of the first substrate;a first transmission part located in the second substrate to couple the first coupling part and the second coupling part electrically; anda second transmission part located in the first substrate to couple the second ...

MICROWAVE DIELECTRIC ANALYZER

Various examples related to microwave dielectric analyzers and their use are provided. In one example, a microwave dielectric analyzer includes a measurement apparatus having a conductive electrode that can couple to a microwave analyzer and processing circuitry that can determine a dielectric characteristic of the dielectric specimen using a reflection coefficient measured by the microwave analyzer. The dielectric characteristic can be determined using a computational electromagnetic model of the measurement apparatus. The reflection coefficient can be measured by the microwave analyzer with the dielectric specimen in contact with the conductive electrode and/or sandwiched between conductive electrodes. The conductive electrodes can be axially aligned, and the second electrode may not be coupled to the microwave analyzer. 1. A microwave dielectric analyzer , comprising: a first conductive electrode configured to couple to a microwave analyzer; and', 'a second conductive electrode axially aligned with the first conductive electrode, where the second conductive electrode is not coupled to the microwave analyzer; and, 'a measurement apparatus havingprocessing circuitry configured to determine a dielectric characteristic of a dielectric specimen based upon a reflection coefficient measured by the microwave analyzer with the dielectric specimen sandwiched between the first and second conductive electrodes, the dielectric characteristic determined based upon a computational electromagnetic model of the measurement apparatus.2. The microwave dielectric analyzer of claim 1 , wherein the dielectric characteristic is permittivity claim 1 , loss or conductivity of the dielectric specimen.3. The microwave dielectric analyzer of claim 1 , wherein the dielectric characteristic is determined from a look-up table determined using the computational electromagnetic model of the measurement apparatus.4. The microwave dielectric analyzer of claim 3 , wherein the dielectric ...

FLEXIBLE CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME

A flexible circuit board includes an insulating layer, a linear signal line, a plurality of grounding lines, a metal coating layer, a circuit layer and an electromagnetic shielding layer. The insulating layer includes a first face and a second face. The metal coating layer covers the linear signal line on the first face. The metal coating layer has a thickness less than that of the linear signal line, and an electrical conductivity larger than that of the linear signal line. The grounding lines are at two opposite sides of the linear signal line on the first face. The circuit layer is on the second face. The electromagnetic shielding layer covers the linear signal line and the grounding lines. The linear signal line and the grounding lines are between the electromagnetic shielding layer and the circuit layer. A method for manufacturing the flexible circuit board is also provided. 1. A flexible circuit board comprising:an insulating layer comprising a first face and a second face opposite to the first face;a linear signal line located on the first face of the insulating layer;a metal coating layer covering the linear signal line on the first face of the insulating layer, and having a thickness less than that of the linear signal line, and an electrical conductivity larger than that of the linear signal line;a plurality of grounding lines located on the first face of the insulating layer, and located at two opposite sides of the linear signal line;a circuit layer located on the second face of the insulating layer; andan electromagnetic shielding layer covering the linear signal line and the grounding lines;wherein the linear signal line and the grounding lines are located between the electromagnetic shielding layer and the circuit layer.2. The flexible circuit board of claim 1 , further comprising a protecting layer covering the linear signal line claim 1 , wherein the protecting layer is located between the linear signal line and the electromagnetic shielding layer.3 ...

Substrate structure having electronic components and method of manufacturing substrate structure having electronic components

The present invention relates to a substrate structure having electronic components and a method of manufacturing a substrate structure having electronic components and can reduce signal loss and internal resistance and improve process efficiency by bringing a first terminal of a first electronic component and a second terminal of a second electronic component in direct contact with each other or in direct contact with each other by solder to minimize a path between the electronic components.

STORAGE DEVICES AND METHODS OF OPERATING STORAGE DEVICES

A storage device is provided. The storage device includes nonvolatile memory devices provided on a printed circuit board (PCB), a connector, a storage controller and at least one first passive filter. The connector is provided in the PCB and includes connection terminals. The storage controller is provided on the PCB, communicates with an external host through the connection terminals and controls the nonvolatile memory devices. The at least one first passive filter is provided in the PCB, is connected between the connector and the storage controller, and performs an equalization on either a signal provided to the storage controller or a signal provided from the storage controller. 1. A storage device , comprising:a plurality of nonvolatile memory devices provided on a printed circuit board (PCB);a connector provided in the PCB, the connector comprising a plurality of connection terminals;a storage controller provided on the PCB, the storage controller being configured to communicate with an external host through the plurality of connection terminals and control the plurality of nonvolatile memory devices; andat least one first passive filter provided in the PCB and connected between the connector and the storage controller, the at least one first passive filter being configured to perform an equalization on any one or any combination of a signal provided to the storage controller and a signal provided from the storage controller.2. The storage device of claim 1 , wherein:the at least one first passive filter comprises a filter resistor and a filter capacitor connected in parallel between a first node and a second node;the filter resistor and the filter capacitor are provided in the PCB; andthe first node is connected to the storage controller and the second node is connected to the connector.3. The storage device of claim 2 , wherein any one or any combination of the filter resistor and the filter capacitor is provided by using at least a portion of the PCB.4. The ...

Thermosetting resin composition, and resin varnish, metal foil with resin, resin film, metal-clad laminate, and printed wiring board using the same

There is provided a thermosetting resin composition including: (A) a modified polyphenylene ether compound which is terminal-modified by using a substituent having a carbon-carbon unsaturated double bond at a molecular terminal; (B) a styrene-butadiene copolymer having a number average molecular weight less than 10,000 and including 1,2 vinyl having cross-linking properties in molecules; (C) a hardening accelerator; and (D) an inorganic filler, in which a compound ratio of (A) component:(B) component is in a range of 80:20 to 20:80.

Low frequency reduced passive equalizer

A differential trace structure reducing the magnitude of low frequency attenuation is disclosed. The trace structure is formed on a printed circuit board. A pair of differential traces connects a signal receiver and a signal transmitter. A passive equalizer has a first shunt coupled to one of the pair of differential traces; and a second shunt coupled to the other one of the pair of differential traces. The passive equalizer has an inductor and a resistor coupled in series to the shunts. For low frequency signals, the passive equalizer behaves as a shunt resistance to the pair of differential traces.

SURFACE-TREATED COPPER FOIL, AND COPPER-CLAD LAMINATE AND PRINTED WIRING BOARD USING SAME

A surface-treated copper foil of the present disclosure includes a copper foil substrate, at least one surface of which has a surface treatment coat including at least a roughening-treated surface on which roughening particles are formed. Observation of a cross-section of the surface-treated copper foil with a scanning electron microscope shows that on a surface of the surface treatment coat, a standard deviation of the particle height of the roughening particles is 0.16 μm or more and 0.30 μm or less, and an average value of the ratio of the particle height to the particle width (particle height/particle width) of the roughening particles is 2.30 or more and 4.00 or less. 1. A surface-treated copper foil comprising a copper foil substrate , at least one surface of which has a surface treatment coat including at least a roughening-treated surface on which roughening particles are formed , whereinobservation of a cross-section of the surface-treated copper foil with a scanning electron microscope shows thaton a surface of the surface treatment coat, a standard deviation of the particle height of the roughening particles is 0.16 μm or more and 0.30 μm or less, and an average value of a ratio of the particle height to the particle width (particle height/particle width) of the roughening particles is 2.30 or more and 4.00 or less.2. A surface-treated copper foil comprising a copper foil substrate , at least one surface of which has a surface treatment coat including at least a roughening-treated surface on which roughening particles are formed , whereinobservation of a cross-section of the surface-treated copper foil with a scanning electron microscope shows thaton a surface of the surface treatment coat, a standard deviation of the particle height of the roughening particles is 0.16 μm or more and 0.30 μm or less, and an average value of a ratio of the particle height to the particle width (particle height/particle width) of the roughening particles is 2.30 or more and ...

Communication device

A communication device includes a ground plane, an antenna array, and an EBG (Electromagnetic Band Gap) structure. The antenna array includes a plurality of antenna elements. The EBG structure includes a plurality of EBG units. The EBG units are coupled to the ground plane. The antenna array is surrounded by the EBG structure. The EBG structure is configured to suppress the front-to-back ratio of the radiation efficiency of the antenna array.

Electronic apparatus

An electronic apparatus includes a first substrate and a second substrate mounted on the first substrate and having a smaller area than the first substrate. The second substrate extends in a longitudinal direction and has a planar or substantially planar shape with a uniform or substantially uniform width across all portions of the second substrate in the longitudinal direction. The second substrate includes a signal line, and a high-frequency transmission line including the signal line, and further includes an input/output pad electrically connected to the signal line, and an auxiliary pad arranged between two input/output pads, on the mounting surface of the second substrate. The first substrate includes lands each connected to the input/output pad and the auxiliary pad. The input/output pad and the auxiliary pad are each soldered on each of the lands of the first substrate and, thus, the second substrate is surface-mounted on the first substrate.