BEDRUCKTE SCHALTTRÄGER

Organosilicium-Verbindungen, hergestellt aus ungesättigten elastomeren Polymeren

Hitzehärtbare Silikonzusammensetzung, Harzfilm, Metallfolie, Isolationsfilm, Metall-Leiterplatte-Laminat, Multischicht-Leiterplatte, die Zusammensetzung enthaltend und Verwendung der Zusammensetzung

Circuit board assembly

Circuit materials circuits and methods of manufacture thereof

A circuit material (110), comprises a conductive layer (114), and a dielectric substrate (112), disposed on the conductive layer, the dielectric substrate comprising, based on the total dielectric substrate composition, about 10 to about 60 vol.% of a fibrous web (120), and about 40 to about 90 vol.% of a cured resin system (118), wherein the resin system comprises up to 100 vol.% of a syndiotactic polybutadiene elastomer, and 0 to 40 vol.% of a particulate filler (116), based on the combined weight of the resin system and the particulate filler. Such circuit materials have improved tack and good mechanical and electrical properties.

Improvements in or relating to absorption type refrigerating apparatus

... 459,051. Refrigerating. EWART, J. H., HAWES, W. B., and EWART & SON, Ltd., 346, Euston Road, London. June 25, 1935, Nos. 18216 and 31553. [Class 29] Absorption systems.-The descriptive matter is substantially the same as that described in Specification 458,841, but the claims are directed to the features that the lift tube 16 is heated at a rate automatically proportional to that of the generator tubes 5, and that the vapour from the separator 17 is condensed in the tube 19, and returned to the sump 13 of the separator 10. Specification 458,836 also is referred to.

HEAT-HARDENABLE SILICONE COMPOSITION, RESIN FILM, METAL FOIL, ISOLATION FILM, METAL PRINTED CIRCUIT BOARD LAMINATE, MULTI-SHIFT LEADER PLATE, THE COMPOSITION CONTAINING AND USE OF THE COMPOSITION

ELECTRICAL ISOLATION FILM AND CONDENSER

Molded polymer comprising silicone and at least one metal trace and a process of manufacturing the same

The present invention provides a flexible electrode array, comprising a silicone containing body, at least one metal trace layer and at least one electrode pad. on the surface. The present invention further provides a process of manufacturing a flexible electrode array, comprising: a) irradiating a surface area of a molded silicone containing layer yielding traces with a light beam emitted by a pulsed UV laser source, b) immersing said irradiated molded silicone layer for inducing the deposit of metal ions to form metal traces, c) applying a silicone containing layer on said silicone containing layer and said metal traces, d) irradiating the surface for drilling holes into the surface of the molded silicone containing layer, and e) immersing said irradiated molded silicone layer for inducing the deposit of metal ions to form metal electrode pads.

ORGANOSILICON MATERIALS

A crosslinkable organosilicon prepolymer and a crosslinked organosilicon polymer comprising alternating hydrocarbon and cyclic polysiloxane radicals, which is the hydrosilation reaction product of: (a) at least one polyene having at least two non-aromatic, non-conjugated carbon-carbon double bonds highly reactive in hydrosilation, the carbon-carbon double bonds being either in an alpha, beta or gamma position on a linear carbon moiety, next to two bridgehead positions in a strained polycyclic aliphatic ring structure, or in a cyclobutene ring, other than polycyclic polyenes having two reactive double bonds in a fused ring system; (b) at least one polycyclic polyene having at least two chemically distinguishable non-aromatic, non-conjugated carbon-carbon double bonds in its rings; (c) at least one cyclic polysiloxane containing three or more =SiH groups.

Metallbeschichtete aus einem Kern und zwei Metallschichten bestehende Platte

Verfahren zur Herstellung eines Verbundes aus Polyolefinen und Metallen

Cyclic olefin resin composition, and substrate provided from said resin composition

A cyclic olefin resin composition which can be suitably used as a material for a substrate having low permittivity, low dielectric tangent, low water absorbability, excellent heat resistance, and the like, and a substrate obtained from the resin composition are provided. In particular, there is provided a novel cyclic olefin resin composition that can be suitably used as a material for a substrate for high frequency circuit dealing with high frequency signal transmission. The cyclic olefin resin composition comprises (A) 5 to 95 parts by weight of a cyclic olefin polymer having a glass transition temperature of 60 to 200 DEG C and (B) 5 to 95 parts by weight of a flexible copolymer, prepared by polymerizing at least two monomers selected from the group consisting of an olefin compound, a diene compound and an aromatic vinyl hydrocarbon compound, and having a glass transition temperature of 0 DEG C or below. The cyclic olefin resin composition further comprises, based on 100 parts by weight ...

CASTABLE THERMOHARDENING COMPOSITION CONTAINING A POLYBUTADIENE OR POLYISOPRENE RESIN AND A THERMOPLASTIC ELASTOMER WITH OPTIONALLY A LOAD, PROCESS OF ITS SHAPING AND WORKED ARTICLE THERMODURCI THUS PRODUCED

THERMOHARDENING COMPOSITION HAS RESIN POLYBUTADIENE AND POLYISOPRENE, MANUFACTORING PROCESS OF THIS ONE AND ITS APPLICATION LIKE ELECTRIC SUBSTRATE

HEAT-CURABLE RESIN FILLER

... 본 발명은 틱소트로피성의 경시 열화를 억제하는 것이 가능하고, 인쇄 배선판의 구멍부로의 충전ㆍ경화 후의 형상 유지성, 연마성이 우수한 열경화성 수지 충전재를 제공한다. 열경화성 수지 충전재에 있어서, 에폭시 수지, 에폭시 수지 경화제, 무기 충전재, 및 화학식: (R1COO)n-R2(치환기 R1은 탄소수가 5 이상인 탄화수소, 치환기 R2는 수소 또는 금속 알콕시드, 금속, n=1 내지 4)로 표시되는 지방산을 포함한다.

PRINTED CIRCUIT SUBSTRATES

Electrical product manufacturing method

This electrical product manufacturing method is provided with: a disposing step for disposing a connecting terminal of a molded body of a low-melting point resin-molded product and a connecting terminal of a flexible sheet such that the connecting terminals face each other; and an electromagnetic induction heating step for performing electromagnetic induction heating after the disposing step. A solder that is provided between the connecting terminal of the molded body and the connecting terminal of the flexible sheet is molten due to the electromagnetic induction heating, and at that time, the molded body formed of a low-melting point resin is not thermally damaged, then the molten solder is hardened, and the connecting terminal of the molded body and the connecting terminal of the flexible sheet are bonded to each other.

METHOD OF MAKING AN ELECTRONIC DEVICE HAVING A LIQUID CRYSTAL POLYMER SOLDER MASK AND RELATED DEVICES

A method of making an electronic device includes forming a circuit layer on a liquid crystal polymer (LCP) substrate and having at least one solder pad. The method also includes forming an LCP solder mask having at least one aperture therein alignable with the at least one solder pad. The method further includes aligning and laminating the LCP solder mask and the LCP substrate together, then positioning solder paste in the at least one aperture. At least one circuit component may then be attached to the at least one solder pad using the solder paste.

METHOD FOR MANUFACTURING A FLEXIBLE PRINTED CIRCUIT, FLEXIBLE PRINTED CIRCUIT OBTAINED BY SAID METHOD, AND CHIP CARD MODULE COMPRISING SUCH A FLEXIBLE PRINTED CIRCUIT

The invention relates to a method for manufacturing a flexible circuit (3) for a chip card module (100). Said method comprises a step of producing electrically conductive contact pads (15) in a first sheet (11) of conductive material. A layer (8) of electrically insulating adhesive material is also used, either to adhere a second sheet (12) of electrically conductive material onto the first sheet of conductive material or to form an intermediate complex making it possible to perforate the layer of adhesive material before it is transferred onto the first sheet of conductive material. Regardless of which option is chosen, the method according to the invention makes it possible to avoid using a flexible substrate of plastic material (PET, PEN, polyimide) or composite material (glass/epoxy) to perform the structuring and metalization of the conductor tracks and contact pads used in the chip card modules. The adhesive material can be specially formulated to have intrinsic hot-melt properties ...

POLYMER LAYER COMPRISING SILICONE AND AT LEAST ONE METAL TRACE AND A PROCESS OF MANUFACTURING THE SAME

The present invention relates to a process for embedding at least one layer of at least one metal trace in a silicone containing polymer, comprising: a) applying a non adhering on a substrate; b) applying a polymer layer on the non adhering agent; c) irradiation at least one surface area of said polymer with a light beam emitted by an excimer laser; d) immersing said irradiated polymer in at least one autocatalytic bath containing metal ions of at least one metal and metallizing the polymer; e) thermally treating said metallized polymer; f) applying a polymer layer on said thermally treated metallized polymer; and g) thermally treating said metallized polymer.

Printed circuit board and method for manufacturing same

Provided is a printed circuit board which includes: a first dielectric layer including a first principal surface and a second principal surface on a side opposite to the first principal surface; a first adhesive layer formed on the first principal surface; a first metal foil pattern formed on the first adhesive layer and forming a signal line; and a second metal foil pattern formed on the second principal surface and forming a ground layer, in which the first metal foil pattern has a higher specific conductivity than a specific conductivity of the second metal foil pattern.

MATT FILM WITH A ROUGH SURFACE

Dicyclopentadiene polymers with heat-resistant dimensional integrity and high Tg

A molded article comprising a cross-linked ring-opened polymer produced by the metathesis polymerization of a dicyclopentadiene (DCPD) monomer, which may be dicyclopentadiene (DCPD) or of a mixture of (DCPD) and norbornene group-containing cycloolefins, in the presence of an effective amount of a metathesis polymerization catalyst and a co catalyst that is capable of crosslinking the unsaturated double bonds of the polymer and thereby increasing the crosslink density of the polymer and its Tg, a process for making it, a process for increasing the Tg of the molded article, and uses of the molded article with a high Tg.

Substrate for flexible wiring and method for producing the same

The present invention provides a substrate for flexible wiring comprises a liquid crystalline polyester layer and a copper foil with a thickness of 5 mum or less. The substrate has a large adhesion between the resin layer and the copper foil, and is sufficient in water absorbing property and electrical properties.

Polymer composition, an article thereof and a process for preparing the same

Present application discloses a thermoplastic composition comprising a) 42.5 wt. % to 94 wt. % of thermoplastic matrix resin; b) 1 wt. % to 7.5 wt. % of a laser direct structuring additive; and c) 5 wt. % to 50 wt. % fibrous reinforcement agent; wherein the wt. % is relative to the total weight of the composition; wherein the laser direct structuring additive is represented by formula ZnxNi(1-x)Fe2O4, wherein the x is higher than 0.60 and lower than 0.85; wherein the composition is capable of being plated after being activated using a laser.

METHOD OF PREPARING A METAL-SILICONE RUBBER COMPOSITE

MATERIAL FOR FORMING PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD FORMED THEREFROM

PURPOSE: To improve the dielectric properties, moldability, mechanical strengths, and heat resistance by compounding a flame retardant and an auxiliary flame retardant into a polymer compsn. comprising a specific styrenic polymer and a fibrous filler. CONSTITUTION: 100 pts.wt. polymer compsn. comprising 100-20wt.% styrenic polymer mainly having a syndiotactic structure, a degree of crystallization 25% or higher, a wt.-average mol.wt. of 10000-100000, and a melt viscosity (300°C, shear rate: 1000/sec) of 500 P or higher and 0-80wt.% fibrous filler (e.g. glass fiber) is compounded with 0-40 pts.wt. flame retardant (e.g. tetrabromobisphenol A) and 0-15 pts.wt. auxiliary flame retardant (e.g. antimony trioxide) and, if necessary, 0.003-10 pts.wt. tetrafluoroethylene polymer contg. 65-76wt.% fluorine to prepare a material for forming a printed circuit board. The material is molded into a substrate of a desired shape, on the surface of which is formed a metal layer of several tenths of mm to ...

СПОСОБ СНИЖЕНИЯ ПОЛЗУЧЕЙ КОРРОЗИИ

Изобретение относится к способу снижения ползучей коррозии на печатных платах, к печатным платам с покрытием и к применению специфических полимеров для снижения ползучей коррозии. Технический результат - создание надежного и эффективного способа снижения ползучей коррозии. Достигается тем, что в способе снижения ползучей коррозии печатных плат, где печатная плата содержит подложку, множество электропроводящих дорожек, расположенных на по меньшей мере одной поверхности подложки, припойную маску, покрывающую по меньшей мере первый участок множества электропроводящих дорожек, и финишное покрытие, покрывающее по меньшей мере второй участок множества электропроводящих дорожек, осаждают посредством плазменной полимеризации фторуглеводород на по меньшей мере часть припойной маски и по меньшей мере часть финишного покрытия. 4 н. и 14 з.п. ф-лы, 13 ил., 3 пр., 2 табл.

Circuit board with metal inlay

In order to achieve good vibration damping on circuit boards with metal inlay, a metal-plastic composite plate is inserted between the layers of insulating material. According to another solution, the metal inlay is connected to the layers of insulating material by a damping adhesive. ...

Circuit materials with improved bond, method of manufacture thereof, and articles formed therefrom

Circuit Materials Circuits Multi Layer Circuits And Method Of Manufacture

COPOLYMERIZATION OF DICYCLOPENTADIENE WITH NORBORNENE DERIVATIVES & COPOLYMERS OBTAINABLE THEREWITH

Improvements in or relating to a process for bonding polythene to metal surfaces

Metal objects, such as copper or aluminium tapes, are coated with polythene by applying a hot solution of polythene and evaporating the solvent, e.g., xylene, at a temperature above the melting point of polythene without allowing the metal to cool between the application of the solution and its evaporation. The final temperature attained may be 200 or 250 DEG C. The tape may be perforated. Specifications 491,804 and 583,694, [both in Group VIII], are referred to.

Circuit materials with improved bond, method of manufacture thereof, and articles formed therefrom

ELECTRICAL SUBSTRATES

... 1322983 Laminates RICHARDSON CO 24 Aug 1970 [12 Sept 1969] 40669/70 Heading B5N [Also in Divisions C3 and H1] In the example a laminate is formed by pressure and heat treatment of eight sheets of paper which has been treated with phenolformaldehyde and then impregnated with a solution of a polymer mixture and cured, the polymer mixture comprising a graft copolymer of styrene on polybutadiene (over 50% 1,2 unsatnration) and a block copolymer of styrene and butadiene (below 50% 1,2-unsaturation), the solvent being toluene and the curing agent dicumyl peroxide. The laminate so formed is etched by treatment with an aqueous solution comprising sodium dichromate, sulphuric acid and phosphonic acid.

MATERIAL FOR POURING A PRINTED BOARD AND PRINTED BOARD USING THIS MATERIAL

PROCEDURE FOR APPLIZIERUNG A METAL ON PAPER

PRINTED ON SWITCHING CARRIERS

Heating elements comprising polybutadiene and polyisoprene based thermosetting compositions

Molded polymer comprising silicone and at least one metal trace and a process of manufacturing the same

POLYNORBORNENE LAMINATES

TITLE OF THE INVENTION: POLYNORBORNENE LAMINATES Printed wiring boards useful for high frequency applications are obtained by laminating a copper foil pretreated with a silane to a polynorbornene prepreg. The prepreq is made by impregnating a fiberglass cloth with a ring-opening polymerized polymer. The copper foil is pretreated with a silane which is capable of improving the bond strength between the copper foil and a norbornene copolymer.

PRESSURE SENSING SYSTEM AND SEAT CUSHION HAVING THE PRESSURE SENSING SYSTEM

A pressure sensing system (24), seat cushion (20) incorporating the pressure sensing system, and method of sensing a weight group associated with an occupant of an automotive seat are described. The pressure sensing system includes a layer of an electrically conductive foam (28) and a flexible printed circuit (26) that includes a flexible substrate (26a) and N horizontal sensing wires (26b) and M vertical sensing wires (26c) securely placed on a top surface of the flexible substrate. The horizontal sensing wires intersect with the vertical sensing wires and form NXM intersections. The layer of an electrically conductive foam is placed on top of the N horizontal sensing wires and the M vertical sensing wires. When a pressure is applied to the layer of the electrically conductive foam, each intersection generates in real time an electric flux density value to reflect a degree of a compression caused by the pressure to a corresponding point of the electrically conductive foam.

SILK ELECTRONIC COMPONENTS

The invention relates to silk electronic components and methods for fabricating the same. The silk electronic components can be used as novel devices, such as implantable bioelectric and/or biophotonic devices, biosensors, surveillance devices, invisible cloaks, electromagnetic concentrators or antennas.

ELECTRICAL AND ELECTROMAGNETIC APPARATUSES USING LAMINATED STRUCTURES HAVING THERMOPLASTIC ELASTOMERIC AND CONDUCTIVE LAYERS

Electromagnetic and electrical apparatuses use a laminate structure having a thermoplastic elastomer with variable dielectric loss as a dielectric layer. A conductive layer laminated to the thermoplastic elastomer allows use for applications such as printed circuit boards and slot antennas. Additional conductive and dielectric layers still allow use as a printed circuit board as well as other antenna structures. Some embodiments of the apparatuses disclosed exhibit many desired properties, such as flexibility, conformability and weatherability.

Composite material, high-frequency circuit board made thereof and making method

The invention relates to a composite material, a high-frequency circuit substrate produced by the composite material and a production method thereof. The composite material comprises a thermosetting mixture, glass fiber cloth, power filler, flame retardant and a initiator for curing, wherein, the thermosetting mixture consists of an butylbenzene resin with a molecular weight of less than 11, 000 containing more than 60 percent of ethylene, a polybutadiene resin with polar groups containing more than 60 percent of ethylene, and a copolymer of butadiene and phenyl ethylene which has a molecularweight of more than 50, 000 and is grafted with maleic anhydride. The produced high-frequency circuit substrate comprises a plurality of layers of prepregs which are overlapped with each other and are made of the composite material, and copper foils which are respectively pressed at both sides of the prepregs. The composite material ensures that the prepregs can be made easily and has high adhesion ...

PROCESS FOR PREPARING SILOXANE-BASED COMPOSITIONS AND DERIVATIVE COMPOSITIONS THEREOF

A process for forming a new group of siloxane-based compositions by a one-step co-hydrolysis and the compositions formed thereof. The siloxane-based compositions being functionalized with a carbon-carbon double (C=C) bond and a silicon-hydrogen (Si-H) bond. The C=C bond and hydrogen (H) each being attached directly to a silicon (Si) atom of the silicon-oxygen (Si-O) backbone of the siloxane-based composition. The C=C bond may be from a vinyl or an aromatic radical like a phenyl substituent. The C=C bond substituent provides the functionality needed for forming crosslinkages through standard dehydrocoupling catalysts without the need for siloxane fluids or organic compounds containing alkyl or aryl functional groups. The process provides for varying proportions of silanes as starting monomers to tailor the desired silicon, carbon, hydrogen and oxygen ratios in the siloxane-based compositions or resins. The siloxane-based compositions may be used as precursors or replacement resins in the ...

액체 유리의 응용

... 도전성 기둥들을 갖는 기판, 회로를 내장한 기판 및 유리 막을 준비하기 위하여 액체 유리를 사용하는, 액체 유리 응용이 제공된다. 상기 액체 유리는 다수의 사용 편리 특성을 보유한다. 따라서, 준비 비용(preparation cost)을 크게 줄일 수 있다. 게다가, 전통적인 유리 형상 한계를 깨고 유리 두께를 현저하게 줄일 수 있으며, 그로 인하여 오늘날 전자 제품에 대한 경박단소의 요구를 만족시킨다.

Substrate structure and manufacturing method thereof

This invention provides a substrate structure, comprising: a substrate body, an insulating protective layer provided on the substrate body and having a plurality of open-pores, and at least one electrical contact pad and at least one ring body provided in the open-pore, such that each electrical contact pad corresponds to expose on each open-pore, and each ring body corresponds to surround the edge of each electrical contact pad, so as to form a conductive element in each ring body in a follow-up process, and therefore when back welds the conductive element, the ring body can confine the conductive element to expand outwards, and the conductive element thereby can avoid extruding the insulating protective layer and causing the fragmentation of the insulating protective layer. This invention further provides a manufacturing method of the substrate structure.

POLYMER LAYER COMPRISING SILICONE AND AT LEAST ONE METAL TRACE AND A PROCESS OF MANUFACTURING THE SAME

The present invention relates to a process for embedding at least one layer of at least one metal trace in a silicone containing polymer, comprising: a) applying a non adhering on a substrate; b) applying a polymer layer on the non adhering agent; c) irradiation at least one surface area of said polymer with a light beam emitted by an excimer laser; d) immersing said irradiated polymer in at least one autocatalytic bath containing metal ions of at least one metal and metallizing the polymer; e) thermally treating said metallized polymer; f) applying a polymer layer on said thermally treated metallized polymer; and g) thermally treating said metallized polymer.

PARYLENE-BASED FLEXIBLE MULTI-ELECTRODE ARRAYS FOR NEURONAL STIMULATION AND RECORDING AND METHODS FOR MANUFACTURING THE SAME

Method for manufacturing a parylene-based electrode array that includes an underlying parylene layer, one or more patterned electrode layers comprising a conductive material such as a metal, and one or more overlying parylene layers. The overlying parylene is etched away or otherwise processed to expose the electrodes where stimulation or recording is to occur. All other conductive material in the device is occluded from the environment by the two layers of parylene surrounding it.

CIRCUIT MATERIALS, CIRCUITS, MULTI-LAYER CIRCUITS, AND METHODS OF MANUFACTURE THEREOF

An electrical circuit material having a conductive layer disposed a substrate, wherein the substrate comprises an organic or inorganic polymer comprising a covelently bound polyhedral silsesquioxane (POSS). The substrate may further comprise an additional dispersed POSS, any other fillers including fibrous webs. Use of covelently bound POSS allow for flame retardancy in compositions having acceptable dielectric constants and dissipation factors.

FABRICATION OF CONDUCTIVE PATHWAYS, MICROCIRCUITS AND MICROSTRUCTURES IN MICROFLUIDIC NETWORKS

Disclosed herein are a variety of microfluidic devices and solid, typically electrically conductive devices that can be formed using such devices as molds. In certain embodiments, the devices that are formed comprise conductive pathways formed by solidifying a liquid metal present in one or more microfluidic channels (such devices hereinafter referred to as "microsolidic" devices). In certain such devices, in which electrical connections can be formed and/or reformed between regions in a microfluidic structure; in some cases, the devices/circuits formed may be flexible and/or involve flexible electrical components. In certain embodiments, the solid metal wires/conductive pathways formed in microfluidic channel(s) may remain contained within the microfluidic structure. In certain such embodiments, the conductive pathways formed may be located in proximity to other microfluidic channel(s) of the structure that carry flowing fluid, such that the conductive pathway can create energy (e.g. electromagnetic ...

Electronic device having a liquid crystal polymer solder mask and related devices

A method of making an electronic device includes forming a circuit layer on a liquid crystal polymer (LCP) substrate and having at least one solder pad. The method also includes forming an LCP solder mask having at least one aperture therein alignable with the at least one solder pad. The method further includes aligning and laminating the LCP solder mask and the LCP substrate together, then positioning solder paste in the at least one aperture. At least one circuit component may then be attached to the at least one solder pad using the solder paste.

Metal-Free Monolithic Epitaxial Graphene-On-Diamond PWB

According to some embodiments, an apparatus includes a circuit board made of polycrystalline diamond. The circuit board is formed by deposition of layers of poly(hydridocarbyne). Each layer has the geometry of a cross section of the circuit board. The circuit board is further formed by pyrolysis of the layers of poly(hydridocarbyne) at a temperature greater than or equal to 100 degrees Celsius and less than or equal to 800 degrees Celsius. The apparatus additionally includes a plurality of tubes formed within the circuit board. The tubes have a plurality of terminations at one or more surfaces of the circuit board. Each tube comprises a layer of graphene that is operable to permit each tube to conduct electrical current. Each layer of graphene is formed by thermolysis of the polycrystalline diamond circuit board at a temperature greater than or equal to 900 degrees Celsius. Each tube is substantially hollow each layer of graphene forms an outer surface of the respective tube.

RESIN ARTICLE HAVING PLATING LAYER AND MANUFACTURING METHOD THEREOF, AND CONDUCTIVE FILM

There is provided with a method for manufacturing a resin article having a plating layer. A surface of a planar resin article is modified. The resin article is formed in a three-dimensional shape. The surface of the resin article that was formed in the three-dimensional shape is remodified. An electroless plating is performed on the resin article that was remodified to allow a plating layer to be deposited on the surface of the resin article at a portion that was modified.

Long-term packaging for the protection of implant electronics

The present invention provides a micropackaged device comprising: a substrate for securing a device; a corrosion barrier affixed to said substrate; optionally at least one feedthrough disposed in said substrate to permit at least one input and or at least one output line into said micropackaged device; and an encapsulation material layer configured to encapsulate the micropackaged device.

THERMOSETTING FILLING RESIN COMPOSITION

Provided is a heat-curable resin filler in which the deterioration in thixotropic properties over time can be prevented and which has excellent shape retaining properties after being filled in hole parts in a printed wiring board and being cured and also has excellent abradability. The heat-curable resin filler comprises an epoxy resin, an epoxy resin curing agent, an inorganic filler and a fatty acid represented by the following general formula: (RCOO)n-R(wherein the substituent Rrepresents a hydrocarbon group having 5 or more carbon atoms; the substituent Rrepresents a hydrogen atom, an metal alkoxide group or a metal atom; and n is 1 to 4). 15-. (canceled)6. A thermosetting filling resin composition comprising an epoxy resin , an epoxy resin curing agent , an inorganic filler , and a fatty acid represented by formula:{'br': None, 'sub': 1', '2, 'i': 'n', '(RCOO)-R'}{'sub': 1', '2, 'wherein substituent Rrepresents a hydrocarbon having 5 or more carbon atoms; substituent Rrepresents hydrogen, a metal alkoxide, or a metal; and n=1 to 4.'}7. The thermosetting filling resin composition according to claim 6 , wherein the fatty acid is incorporated in an amount of 0.1 parts to 2 parts by mass relative to 100 parts by mass of the inorganic filler.8. The thermosetting filling resin composition according to claim 7 , further comprising a silane-based coupling agent.9. A printed wiring board comprising hole parts that are filled with a cured product of the thermosetting filling resin composition according to .10. A printed wiring board comprising hole parts that are filled with a cured product of the thermosetting filling resin composition according to .11. A printed wiring board comprising hole parts that are filled with a cured product of the thermosetting filling resin composition filler according to .12. A thermosetting filling resin composition comprising an epoxy resin claim 8 , an epoxy resin curing agent claim 8 , an inorganic filler claim 8 , a silane-based ...

Composition for forming substrate, and prepreg and substrate using the same

Disclosed herein is a composition for forming a substrate, comprising: a liquid crystal thermosetting oligomer having one or more soluble structural units in the main chain thereof and having thermosetting groups at one or more ends of the main chain thereof; and a metal alkoxide compound having reaction groups which can be covalently bonded with the thermosetting groups.

INSULATING CIRCUIT BOARD

Provided is an insulating circuit board including: an insulating resin layer; and a circuit layer made of metal pieces, each of which is in a circuit pattern and provided on one surface of the insulating resin layer, wherein thickness of each of the metal pieces constituting the circuit layer is 0.5 mm or more, the insulating resin layer is made of a thermosetting resin, and a void ratio in regions between the metal pieces is 0.8% or less.

Formable transparent conductive films with metal nanowires

A formable transparent conductive film are described that comprise a sparse metal conductive layer, a thermoplastic polymer substrate supporting the sparse metal conductive layer, a viscoelastic polymer with a thickness from about 15 microns to about 150 microns over the sparse metal conductive layer. A layered film structure can be formed that is suitable for contouring on the surface of a three dimensional object without unacceptable increases in sheet resistance and with good optical transparency and low haze. The formable films can be placed into a frozen configuration bent 90 degrees with a radius of curvature of no more than about 5 centimeters while exhibiting a surface resistance of no more than about 500 ohms/sq. with a total transmittance with respect to visible light of at least about 80%.

Matt film

Copolymerization of dicyclopentadiene with norbornene derivatives and copolymers obtainable therewith

A process for the production of thermoset copolymers, having tailored product properties and more particularly a predetermined increase of the glass-transition temperature and/or increase of cross-linking, comprising contacting the comonomer mixture with a methathesis catalyst system, obtainable by combining at least a catalyst component and an activator component, characterized in that the comonomer one or more compounds are used, according to the formulae: Comonomers to be used for said process and reaction mixtures or components thereof containing such comonomers; and thermoset copolymers obtained by said process.

Verfahren zur Herstellung einer aushärtbaren und ausgehärteten Organosilikon-Zusammensetzung

Organosilicon compositions prepared from unsaturated elastomeric polymers

High-temperature environment electronic chassis

Methods for predicting esophageal adenocarcinoma (EAC)

A circuit subassembly, comprising: a conductive layer, a dielectric layer formed from a thermosetting composition, wherein the thermosetting composition comprisses, based on the total weight of the thermosetting composition a polybutadiene or polyiseoprene resin, about 30 to about 70 percent by weight of a magnesium hydroxide having less than about 1000 ppm of ionic contaminants, and about 5 to about 15 percent by weight of a nitrogen-containing compound, wherein the nitrogen-containing compound comprises at least about 15 weight percent of nitrogen; and an adhesive layer disposed between and in intimate contact with the conductive layer and the dielectric layer, whereinthe adhesive comprises a poly(arylene ether), wherein the circuit subassembly has a UL-94 rating of at least V-1.

SURFACE TREATMENT OF FIBERS FROM POLYETHYLENE.

MATTE FILM

Composite Material, High-Frequency Circuit Substrate Made Therefrom and Making Method Thereof

Composite Material, High-frequency Circuit Substrate Made Therefrom and Making Method Thereof The present invention relates to a composite material, a high-frequency 5 circuit substrate made therefrom and making method thereof. The composite material comprises 20-70 parts by weight of thermosetting mixture, a fiberglass cloth, a powder filler, a flame retardant, and a cure initiator. The thermosetting mixture includes a resin containing vinyl in the amount of more than 60% composed of carbon and hydrogen with its molecular weight being less than 10 11000, and a solid styryl resin of middle or low molecular weight with unsaturated double bonds. The made high-frequency circuit substrate comprises a plurality of prepregs mutually overlapped, and copper foils respectively covered on both sides of overlapped prepregs. Each prepreg is made from the composite material. The composite material of the present 15 invention enable to readily make prepregs. The high-frequency circuit substrate made ...

Insulated implantable electrical circuit

ORGANOSILICON MATERIALS

A crosslinkable organosilicon prepolymer and a crosslinked organosilicon polymer comprising alternating hydrocarbon and cyclic polysiloxane radicals, which is the hydrosilation reaction product of: (a) at least one polyene having at least two non-aromatic, non-conjugated carbon-carbon double bonds highly reactive in hydrosilation, the carbon-carbon double bonds being either in an alpha, beta or gamma position on a linear carbon moiety, next to two bridgehead positions in a strained polycyclic aliphatic ring structure, or in a cyclobutene ring, other than polycyclic polyenes having two reactive double bonds in a fused ring system; (b) at least one polycyclic polyene having at least two chemically distinguishable non-aromatic, non-conjugated carbon-carbon double bonds in its rings; (c) at least one cyclic polysiloxane containing three or more =SiH groups.

Composite material, high frequency circuit board prepared from same and preparation method thereof

The invention relates to a composite material, a high frequency circuit board prepared from same and a preparation method thereof. The composite material comprises the following components: 20-70 parts of thermosetting mixture containing a hydrocarbon resin with the molecular weight of less than 11000 and more than 60% of ethylene group and a solid styryl resin with unsaturated double bond and medium or low molecular weight; glass fiber cloth; filler powder; and fire retardant and curing initiator. The prepared high frequency circuit board comprises a plurality of prepreg layers which are superimposed and prepared from the composite material, and copper coils which are pressed and coated on both sides of prepreg layers. The preparation of the prepregs prepared by the composite material ofthe invention is simple and the high frequency circuit board prepared from the prepregs has low dielectric constant and dielectric loss angle tangent, good heat resistance and convenient technological operation ...

MOLECULARLY ORIENTED MOLDED BODY OF ULTRA-HIGH-MOLECULAR-WEIGH ETHYLENE/POLYENE COPOLYMER

MODULATE ELECTRONIC AERONAUTICAL EQUIPMENT EMBARKS AND AERONAUTICAL EQUIPMENT OF AERONAUTICAL VEHICLE

Module électronique haute température (jusqu'à 225°C) d'équipement aéronautique embarqué comportant un circuit hybride en couches épaisses recouvert d'un revêtement d'étanchéité de poly-p-xylylène.

CARRIER-BASED METALLIZED OF POLYMETHYLPENTENE AND METHOD FOR MAKING SAME.

METHOD FOR MANUFACTURING MULTI-LAYER PRINTED CIRCUIT BOARD

Disclosed is a method for manufacturing a multi-layer printed circuit board with excellent reliability which can easily realize a fine circuit, and can reduce a manufacturing lead time and the manufacturing costs. The method for manufacturing a multi-layered printed circuit board comprises the steps of: preparing a plurality of printed circuit boards having at least one fill-plate via hole and a circuit pattern formed on both surfaces; preparing a plurality of prepregs having a prepreg via hole formed therein; alternately matching the plurality of printed circuit boards and the plurality of prepregs and stacking the same; and bonding the plurality of printed circuit boards and the plurality of prepregs at once. COPYRIGHT KIPO 2018 ...

열가소성 액정 폴리머 필름의 제조 방법, 그리고 회로 기판 및 그 제조 방법

... 열가소성 액정 폴리머 필름으로 이루어지는 피착체에 대한 열접착성이 우수한 열가소성 액정 폴리머 필름의 제조 방법, 그리고 회로 기판 및 그 제조 방법을 제공한다. 상기 필름의 제조 방법은, 피착체 필름 및 접착성 필름으로서 각각 열가소성 액정 폴리머 필름을 준비하고, 상기 열가소성 액정 폴리머 필름의 피접착 표면부에 대해, X 선 광전자 분광 분석에 의해, C(1s) 에서 기인하는 결합 피크의 피크 면적의 합계에서 차지하는, [C-O 결합] 및 [COO 결합] 의 피크 면적의 합의 ％비율 : X (％) 및 Y (％) 를 파악하는 파악 공정과, 상기 X 및 Y 가 이하의 식 (1) 또한 (2) 를 만족하도록, 접착성 필름으로서의 열가소성 액정 폴리머 필름을 선택 또는 활성화 처리하는 조정 공정과, 38 ≤ X + Y ≤ 65 (1) -8.0 ≤ Y - X ≤ 8.0 (2) 에 의해 제조된다.

METHOD FOR REDUCING CREEP CORROSION

NORBORNENE POLYMER COMPOSITION

PLACA DE FIACAO DE CIRCUITO IMPRESSO,PROCESSO PARA PRODUZIR A MESMA,COMPOSICAO APROPRIADA PARA IMPREGNAR UM PANO DE VIDRO PARA FORMAR UM PRE-IMPREGNADO E LAMINADO

Resin sheet for circuit substrates, sheet for circuit substrates, and circuit substrate for displays

Resin sheet for circuit substrates (2) which is obtained from energy ray curing polymer material and is used for embedding circuit chips into the resin sheet. The resin sheet before being cured by irradiating with an energy ray has a double bond concentration of 4. 5 to 25 mmol/g; sheet for circuit substrates which comprises a support (1) on a surface of which a face of the resin sheet (2) is formed; and circuit subtrate for displays (5) which is obtained by embedding circuit chips (3) into the face of the resin sheet for circuit substrates (2) and curing the resin sheet by irradiating with an energy ray. The resin sheet for circuit substrates (2) can advantageously be used for efficiently producing circuit substrate for displays, particularly planer displays into which circuit chips (3) is embedded for controlling each of the pixels in a high quality and at a high productivity.

Method for compounding metal onto surface of molded article of cyclic olefin based resin, and molded article of cyclic olefin based resin compounded with metal

The present invention relates to a method for compounding metal onto the surface of the molded article of a cyclic olefin based resin. More particularly, for compounding a metal to an cyclic olefin based resin molded article having very low dielectric constant, dielectric loss and moisture absorptivity and being very suitable as the constituting element of a device for treating high frequency signal at GHz zone, a molded article of the cyclic olefin based resin or its composition has at least one part of the surface thereof being roughened to a ten-point average roughness Rz of 5 m or more and then coated with a metal film by a wet plating method.

ELECTRONIC DEVICE MODULE COMPRISING LONG CHAIN BRANCHED (LCB), BLOCK, OR INTERCONNECTED COPOLYMERS OF ETHYLENE AND OPTIONALLY SILANE

An electronic device module is disclosed comprising: A. at least one electronic device, and B. a polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising (1) An ethylenic polymer comprising at least 0.1 amyl branches per 1000 carbon atoms as determined by Nuclear Magnetic Resonance and both a highest peak melting temperature, Tm> in °C, and a heat of fusion, Hf in J/g, as determined by DSC Crystallinity, where the numerical values of Tm and Hf correspond to the relationship: Tm > (0.2143* Hf) + 79.643, and wherein the ethylenic polymer has less than about 1 mole percent ctane comonomer, and less than about 0.5 mole percent ctane, pentene, or ctane comonomer. (2) optionally, free radical initiator or a photoinitiator in an amount of at least about 0.05 wt% based on the weight of the copolymer, (3) optionally, a co-agent in an amount of at least about 0.05 wt% based upon the weight of the copolymer, and (4) optionally, a ...

ELECTRONIC DEVICE MODULE COMPRISING LONG CHAIN BRANCHED (LCB), BLOCK, OR INTERCONNECTED COPOLYMERS OF ETHYLENE AND OPTIONALLY SILANE

An electronic device module is disclosed comprising: A. at least one electronic device, and B. a polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising (1) An ethylenic polymer comprising at least 0.1 amyl branches per 1000 carbon atoms as determined by Nuclear Magnetic Resonance and both a highest peak melting temperature, Tm> in °C, and a heat of fusion, Hf in J/g, as determined by DSC Crystallinity, where the numerical values of Tm and Hf correspond to the relationship: Tm > (0.2143* Hf) + 79.643, and wherein the ethylenic polymer has less than about 1 mole percent ctane comonomer, and less than about 0.5 mole percent ctane, pentene, or ctane comonomer. (2) optionally, free radical initiator or a photoinitiator in an amount of at least about 0.05 wt% based on the weight of the copolymer, (3) optionally, a co-agent in an amount of at least about 0.05 wt% based upon the weight of the copolymer, and (4) optionally, a ...

PRINTED CIRCUIT SUBSTRATES

A printed circuit board having foamed substrates of low dielectric constant and low dissipation factor and techniques for making printed circuit boards and printed circuits using such substrates. The substrate has a dielectric constant less than 1.5 and a dissipation factor less than 10-2, most preferably, polymethylacrylimide. A conductive layer is placed on the substrate surface using chemical deposition or by use of appropriate adhesives. The printed circuit may be imprinted by conventional techniques such as etching with appropriate etching materials.

Method of metallizing a silicone rubber substrate

A method of metallizing a silicone rubber substrate, the method comprising the steps of (i) depositing a primer layer of aluminum on a surface of a silicone rubber substrate, and (ii) depositing a layer of a ductile metal on the primer layer of aluminum, wherein the ductile metal is selected from gold, platinum, palladium, copper, silver, aluminum, and indium.

LIQUID GLASS APPLICATION

A liquid glass application is provided, which uses liquid glass to prepare a substrate having conductive posts, a substrate embedded with a circuit and a glass membrane. The liquid glass possesses a large number of usage convenience features. Therefore, a preparation cost can be greatly reduced. Besides, a traditional glass configuration limit is broken and a glass thickness can be reduced remarkably, thereby meeting nowadays requirements of lightness, thinness, shortness and smallness on electronic products.

ELECTRICAL DEVICE WITH TEETH JOINING LAYERS AND METHOD FOR MAKING THE SAME

A multilayer electrical device, such as a printed circuit board, having a tooth structure including a metal layer set in a dielectric. The device includes a base; a conductive layer adjacent to the base; a dielectric material adjacent to conductive layer; a tooth structure including a metal layer set in the dielectric material to join the dielectric material to the metal layer; and wherein the metal layer forms a portion of circuitry.

Aluminum nitride substrate with graphite foil

A printed circuit board may include an aluminum nitride (AIN) substrate that includes an AIN thin film and a layer of high-frequency polymer as a carrier substrate of the AIN thin film. The AIN substrate forms a first layer of the printed circuit board. The AIN substrate comprises a heat spreader that laterally spreads out heat from a heat sink on the printed circuit board to form a thermal dissipation path parallel with a signal path on the printed circuit board. The printed circuit board may include a main substrate aligned to and bonded with the AIN substrate. The main substrate may include one or more additional layers of the printed circuit board.

ELECTRONIC CIRCUIT ASSEMBLY SUBSTRATE AND DEVICE THEREOF

A methodology for a thin, flexible substrate having integrated passive circuit elements, and the resulting device are disclosed. Embodiments may include integrating one or more passive circuit components on a first or second surface of a substrate, and interconnecting one or more integrated circuit (IC) dies on a second surface of the interposer to the one or more passive circuit components with one or more metal-filled vias between the first and second surfaces, the first and second surfaces being opposite surfaces of the substrate.

Insulating material containing cycloolefin polymer

An insulating material comprising a cycloolefin polymer, specifically, an interlayer insulating material for a high-density assembly board having interlayer-connecting via holes at most 200 mum in diameter, comprising a cycloolefin polymer containing at least 50 mol % of a repeating unit derived from a cycloolefin monomer; a dry film formed from a curable resin composition comprising a polymer having a number average molecular weight within a range of 1,000 to 1,000,000 as measured by gel permeation chromatography, and a hardener; and a resin-attached metal foil obtained by forming a film of a cycloolefin polymer on one side of a metal foil. Laminates, multi-layer laminates and build-up multi-layer laminates making use of these materials, and production processes thereof.

FLEXIBLE PRINTED CIRCUIT BOARD

A flexible printed circuit board according to the present disclosure includes: a first base sheet, a second base sheet, and a first protection sheet. The first base sheet includes a first Teflon film and a first circuit pattern disposed on the first Teflon film. The second base sheet includes a second Teflon film and a second circuit pattern disposed on the second Teflon film, and is laminated on the first base sheet. The first protection sheet covers the first base sheet. A portion of the first base sheet that is exposed to the first protection sheet is surface-modified.

Multilayer substrate

A multilayer substrate that retains a curved state without causing fluctuations in electrical characteristics includes a main body including a plurality of insulating sheets to be stacked and made of a flexible material. A signal wire extends in the main body. A ground conductor is provided at a positive-direction side in a z-axis direction relative to the signal wire in the main body, and overlaps the signal line in a plan view seen from the z-axis direction. A ground conductor is provided on a negative-direction side in the z-axis direction relative to the signal wire in the main body, and overlaps the signal line in a plan view seen from the z-axis direction. The state in which the main body is curved so that the signal wire defines an arc is retained by plastic deformation of the ground conductors.

Polymer Layer Comprising Silicone and at Least One Metal Trace and a Process of Manufacturing the Same

The present invention relates to a process for embedding at least one layer of at least one metal trace in a silicone containing polymer, comprising: a) applying a non adhering on a substrate; b) applying a polymer layer on the non adhering agent; c) irradiation at least one surface area of said polymer with a light beam emitted by an excimer laser; d) immersing said irradiated polymer in at least one autocatalytic bath containing metal ions of at least one metal and metallizing the polymer; e) thermally treating said metallized polymer; f) applying a polymer layer on said thermally treated metallized polymer; and g) thermally treating said metallized polymer.

Flexible multi-level cable

A flexible cable comprises a cable body of a silicone material and circuits in the flexible cable body. In one embodiment the flexible cable body comprises a multiple number of individual layers of poly(dimethylsiloxane). In one embodiment silicone material encapsulates the individual layers. The flexible cable is made by providing a multiplicity of substrates of a flexible silicone material, producing circuits in the substrates, and stacking the multiplicity of substrates to produce the high density flexible cable.

Method for manufacturing printed circuit board including flame retardant insulation layer

The present invention relates to a method for manufacturing a printed circuit board including a flame retardant insulation layer. The printed circuit board of the present invention exhibits excellent thermal stability and excellent mechanical strength, is suitable for imprinting lithography process, provides improved reliability by reducing coefficient of thermal expansion, and has excellent adhesion between circuit patterns and an insulation layer.

Electronic Device Module Comprising Heterogeneous Polyolefin Copolymer and Optionally Silane

An electronic device module comprising: 1. An electronic device module comprising:A. at least one electronic device, and [{'sub': v', 'hc', 'v', 'hc', 'v', 'hc', 'p, '(1) a polyolefin copolymer characterized as having has an average Mand a valley temperature between the interpolymer and high crystalline fraction, T, such that the average Mfor a fraction above Tfrom ATREF divided by average Mof the whole polymer from ATREF (M/M) is less than about 1.95 and wherein the copolymer has a CDBI of less than 60%,'}, '(2) optionally, a vinyl silane,', '(3) optionally, free radical initiator or a photoinitiator in an amount of at least about 0.05 wt % based on the weight of the copolymer, and', '(4) optionally, a co-agent in an amount of at least about 0.05 wt % based upon the weight of the copolymer., 'B. a polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising'}2. The module of in which the electronic device is a solar cell.3. The module of in which the free radical initiator is present.4. The module of in which the coagent is present.5. The module of in which the free radical initiator is a peroxide.6. The module of in which the polymeric material is in the form of a monolayer film in intimate contact with at least one face surface of the electronic device.7. The module of in which the polymeric material further comprises a scorch inhibitor in an amount from about 0.01 to about 1.7 wt %.8. The module of further comprising at least one glass cover sheet.9. The module of in which the free radical initiator is a photoinitiator.10. The module of which the polymeric material further comprises a polyolefin polymer grafted with an unsaturated organic compound containing at least one ethylenic unsaturation and at least one carbonyl group.11. The module of in which the unsaturated organic compound is maleic anhydride.12. The module of in which the vinyl silane is at least one of vinyl tri-ethoxy silane and vinyl ...

Electronic Device Module Comprising Long Chain Branched (LCB), Block or Interconnected Copolymers of Ethylene and Optionally Silane

An electronic device module is disclosed comprising: 1. An electronic device module comprising:A. at least one electronic device, and {'sub': m', 'f', 'm', 'f, 'claim-text': {'br': None, 'i': T', 'H, 'sub': m', 'f, '≧(0.2143*)+79.643,'}, '(1) an ethylenic polymer comprising at least 0.1 amyl branches per 1000 carbon atoms as determined by Nuclear Magnetic Resonance and both a highest peak melting temperature, T, in ° C., and a heat of fusion, H, in J/g, as determined by DSC Crystallinity, where the numerical values of Tand Hcorrespond to the relationship, 'B. a polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising'}and wherein the ethylenic polymer has less than about 1 mole percent hexene comonomer, and less than about 0.5 mole percent butene, pentene, or octene comonomer.(2) optionally, free radical initiator or a photoinitiator in an amount of at least about 0.05 wt % based on the weight of the copolymer,(3) optionally, a co-agent in an amount of at least about 0.05 wt % based upon the weight of the copolymer, and(4) optionally, a vinyl silane compound.2. The module of in which the electronic device is a solar cell.3. The module of in which the free radical initiator is present.4. The module of in which the free radical initiator is a peroxide.5. The module of in which the polymeric material is in the form of a monolayer film in intimate contact with at least one face surface of the electronic device.6. The module of further comprising at least one glass cover sheet.7. The module of which the polymeric material further comprises a polyolefin polymer grafted with an unsaturated organic compound containing at least one ethylenic unsaturation and at least one carbonyl group.8. The module of in which the unsaturated organic compound is maleic anhydride.9. An electronic device module comprising:A. at least one electronic device, andB. a polymeric material in intimate contact with at least one ...

THERMOSETTING RESIN COMPOSITION, CURED PRODUCT THEREOF, ACTIVE ESTER RESIN, SEMICONDUCTOR ENCAPSULATING MATERIAL, PREPREG, CIRCUIT BOARD, AND BUILD-UP FILM

A thermosetting resin composition contains an active ester resin (A) and an epoxy resin (B) as essential components, the active ester resin (A) having a resin structure which includes a polyaryleneoxy structure (I) and in which aromatic carbon atoms in a plurality of the polyaryleneoxy structures (I) are linked through a structural site (II) represented by a structural formula 1 (wherein Ar represents a phenylene group, a phenylene group nuclear-substituted by 1 to 3 alkyl groups each having 1 to 4 carbon atoms, a naphthylene group, or a naphthylene group nuclear-substituted by 1 to 3 alkyl groups each having 1 to 4 carbon atoms). 118-. (canceled)22. The thermosetting resin composition according to , or , wherein the active ester resin (A) contains , in its resin structure , arylcarbonyloxy groups with a functional group equivalent in a range of 220 to 350 g/eq. in terms of monofunctional group equivalent.23. A cured product produced by curing the epoxy resin composition according to , or .27. A semiconductor encapsulating material comprising a thermosetting resin composition further containing an inorganic filler (C) at a ratio of 70 to 95% by mass in the composition in addition to the active ester resin (A) and the epoxy resin (B) of the epoxy resin composition according to , or .28. A prepreg produced by impregnating a reinforcement substrate with the thermosetting resin composition according to , or , which is diluted with an organic solvent , and then semi-curing the resultant impregnated substrate.29. A circuit board produced by diluting the thermosetting resin composition according to , or with an organic solvent to prepare a varnish , shaping the varnish into a plate , and molding the plate and a copper foil under heating and pressure.30. A build-up film produced by applying the thermosetting resin composition according to , or , which is diluted with an organic solvent , to a base film and then drying the film. The present invention relates to a ...

Epoxy resin composition and pre-preg, support-provided resin film, metallic foil clad laminate plate and multilayer printed circuit board utilizing said composition

The epoxy resin composition according to the present invention contains (A) a phosphorus-containing curing agent and (B) an epoxy resin, wherein the phosphorus-containing curing agent (A) is a phosphorus compound represented by the following Chemical Formula (1); an organic group represented by R in Chemical Formula (1) has two or more phenolic hydroxyl groups; and the organic group has a molecular weight of 190 or more:

WIRING SUBSTRATE, MANUFACTURING METHOD OF WIRING SUBSTRATE, AND SEMICONDUCTOR PACKAGE INCLUDING WIRING SUBSTRATE

A wiring substrate includes an insulating layer having a first surface on which a projecting part is formed, and an electrode pad being formed on the projecting part and including a first electrode pad surface and a second electrode pad surface on a side opposite to the first electrode pad surface. The first electrode pad surface is exposed from the projecting part of the insulating layer. The second electrode pad surface is covered by the insulating layer. A cross-section of the projecting part is a tapered shape. One side of the cross-section toward the first electrode pad surface is narrower than another side of the cross-section toward the first surface of the insulating layer. 1. A wiring substrate comprising:an insulating layer having a first surface on which a projecting part is formed; andan electrode pad being formed on the projecting part and including a first electrode pad surface and a second electrode pad surface on a side opposite to the first electrode pad surface;wherein the first electrode pad surface is exposed from the projecting part of the insulating layer,wherein the second electrode pad surface is covered by the insulating layer,wherein a cross-section of the projecting part is a tapered shape,wherein one side of the cross-section toward the first electrode pad surface is narrower than another side of the cross-section toward the first surface of the insulating layer.2. The wiring substrate as claimed in claim 1 , wherein a via wiring is connected to the second electrode pad surface.3. The wiring substrate as claimed in claim 2 , further comprising:a through-hole formed in the insulating layer, the through-hole penetrating the insulating layer, exposing the second electrode pad surface, and having the via wiring formed therein;a metal layer extending from the through-hole to a second surface of the insulating layer opposite to the first surface of the insulating layer;wherein the metal layer includes the via wiring formed in the through-hole ...

Graphene mounted on aerogel

An apparatus having reduced phononic coupling between a graphene monolayer and a substrate is provided. The apparatus includes an aerogel substrate and a monolayer of graphene coupled to the aerogel substrate.

SILK ELECTRONIC COMPONENTS

The invention relates to silk electronic components and methods for fabricating the same. The silk electronic components can be used as novel devices, such as implantable bioelectric and/or biophotonic devices, biosensors, surveillance devices, invisible cloaks, electromagnetic concentrators or antennas. 1. A silk electronic component comprising:a silk matrix; anda patterned conductive structure coupled to the silk matrix, wherein the patterned conductive structure responds to electromagnetic radiation.2. The silk electronic component of claim 1 , wherein the silk matrix has a surface roughness of less than 5 nm.3. (canceled)4. The silk electronic component of claim 1 , wherein the silk matrix comprises silk fibroin.56-. (canceled)7. The silk electronic component of claim 1 , wherein the silk matrix is a film claim 1 , hydrogel claim 1 , foam claim 1 , e-gel or microsphere.8. The silk electronic component of claim 1 , wherein the silk matrix comprises a dopant.9. (canceled)10. The silk electronic component of claim 8 , wherein the dopant is a pharmaceutical claim 8 , antibody claim 8 , fragment or portion of an antibody claim 8 , antibiotic claim 8 , enzyme claim 8 , organic indicator claim 8 , photoactive dye claim 8 , cell claim 8 , protein claim 8 , peptide claim 8 , nucleic acid analogue claim 8 , nucleotide claim 8 , oligonucleotide claim 8 , peptide nucleic acid claim 8 , aptamer claim 8 , hormone claim 8 , hormone antagonist claim 8 , growth factor claim 8 , fragment of a growth factor claim 8 , variant of a growth factor claim 8 , recombinant growth factor claim 8 , fragment of a recombinant growth factor claim 8 , variant of a recombinant growth factor claim 8 , cytokine claim 8 , antimicrobial compound claim 8 , virus claim 8 , antiviral claim 8 , toxin claim 8 , prodrug claim 8 , drug claim 8 , chemotherapeutic agent claim 8 , small molecule claim 8 , chromophore claim 8 , light-emitting organic compound claim 8 , light-emitting inorganic compounds claim ...

Method for Reducing Creep Corrosion

A method for reducing creep corrosion on a printed circuit board, the printed circuit board comprising a substrate, a plurality of electrically conductive tracks located on at least one surface of the substrate, a solder mask coating at least a first area of the plurality of electrically conductive tracks and a surface finish coating at least a second area of the plurality of electrically conductive tracks, the method comprising depositing by plasma-polymerization a fluorohydrocarbon onto at least part of the solder mask and at least part of the surface finish. 118.-. (canceled)19. A method for reducing creep corrosion on a printed circuit board comprising: a substrate;', 'a plurality of electrically conductive tracks located on at least one surface of the substrate;', 'a solder mask coating at least a first area of the plurality of electrically conductive tracks; and', 'a surface finish coating at least a second area of the plurality of electrically conductive tracks; and, 'selecting a printed circuit board comprisingdepositing by plasma-polymerization a fluorohydrocarbon onto at least part of the solder mask and at least part of the surface finish.20. The method of claim 19 , wherein the surface finish is selected from the group consisting of immersion silver (ImAg) claim 19 , electroless nickel/immersion gold (ENIG) claim 19 , organic solderability preservative (OSP) claim 19 , electroless nickel/electroless palladium/immersion gold (ENEPIG) claim 19 , and immersion tin (ImSn).21. The method of claim 19 , wherein the surface finish is immersion silver (ImAg).22. The method of claim 19 , wherein the fluorohydrocarbon is selected from the group consisting of CF claim 19 , CF claim 19 , CF claim 19 , CF claim 19 , and CF.23. The method of claim 19 , wherein the solder mask is selected from the group consisting of epoxy solder mask claim 19 , liquid photoimageable solder mask ink claim 19 , and dry film photoimageable solder mask.24. The method of claim 19 , wherein ...

FLEXIBLE PRINTED WIRING BOARD AND LAMINATE FOR PRODUCTION OF FLEXIBLE PRINTED WIRING BOARD

The flexible printed wiring board according to the present invention includes a first flexible insulating layer, a first conductor wiring laminated on the first insulating layer, a second single-layered insulating layer laminated on the first insulating layer, as it covers the first conductor wiring, and a second conductor wiring laminated on the second insulating layer. The first conductor wiring has a thickness in the range of 10 to 30 μm, a line width in the range of 50 μm to 1 mm, and a line gap in the range of 50 μm to 1 mm. The thickness from the surface of the first conductor wiring to the surface of the second insulating layer is in the range of 5 to 30 μm. The surface waviness of the part of the second insulating layer covering the first conductor wiring is 10 μm or less. 1. A flexible printed wiring board , comprisinga first insulating layer that is flexible,a first conductor wiring laminated on the first insulating layer,a second insulating layer that is a single layer and laminated on the first insulating layer, as it covers the first conductor wiring, anda second conductor wiring laminated on the second insulating layer, wherein:the first conductor wiring has a thickness in the range of 10 to 30 μm, a line width in the range of 50 μm to 1 mm, and a line gap in the range of 50 μm to 1 mm;a thickness from a surface of the first conductor wiring to a surface of the second insulating layer is in the range of 5 to 30 μm; anda surface waviness of part of the second insulating layer covering the first conductor wiring is 10 μm or less.2. A flexible printed wiring board , comprisinga first insulating layer that is flexible,a first conductor wiring laminated on the first insulating layer,a second insulating layer that is formed of multiple layers and laminated on the first insulating layer,as it covers the first conductor wiring, anda second conductor wiring laminated on the second insulating layer, wherein:the first conductor wiring has a thickness in the range ...

Photo-patternable dielectric materials and formulations and methods of use

Silsesquioxane polymers, silsesquioxane polymers in negative tone photo-patternable dielectric formulations, methods of forming structures using negative tone photo-patternable dielectric formulations containing silsesquioxane polymers, and structures made from silsesquioxane polymers.

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

Disclosed herein is a method of manufacturing a printed circuit board, the method including: preparing a base substrate having one surface and the other surface; forming first signal metal layers including a first signal via penetrating the base substrate from one surface to the other surface and first heat dissipation metal layers on the base substrate; and forming a build-up layer on the base substrate by forming second heat dissipation metal layers including second signal metal layers including second signal vias stacked on the first signal via and a heat dissipation via penetrating the base substrate and the build-up layer in the thickness direction. 1. A method of manufacturing a printed circuit board , the method comprising:preparing a base substrate having one surface and the other surface;forming on the base substrate first signal metal layers including a first signal via penetrating the base substrate from one surface to the other surface and first heat dissipation metal layers; andforming on the base substrate a build-up layer by forming second heat dissipation metal layers including second signal metal layers including second signal vias stacked on the first signal via and a heat dissipation via penetrating the base substrate and the build-up layer in the thickness direction.2. The method as set forth in claim 1 , wherein in the preparing of the base substrate claim 1 , the base substrate is made of a copper-clad laminate.3. The method as set forth in claim 1 , wherein in the forming of the first signal metal layers and the first heat dissipation metal layers claim 1 , the first signal via has a sandglass shape.4. The method as set forth in claim 1 , wherein the via hole for forming the first and second signal vias are formed through a laser drilling process.5. The method as set forth in claim 1 , wherein in the forming of the first signal metal layers and the first heat dissipation metal layers claim 1 , the via hole for forming the first signal via is ...

PREPREG, COPPER CLAD LAMINATE, AND PRINTED CIRCUIT BOARD

Disclosed herein are prepreg, a copper clad laminate (CCL), and a printed circuit board. When a reinforcing member formed of organic fiber including a liquid crystal polymer resin or a super engineering resin and a base resin having the same component as the reinforcing member are used, a coefficient of thermal expansion (CTE) and rigidity may be adjusted. In addition, during an operation of a semiconductor chip mounted on the printed circuit board, the semiconductor chip and the printed circuit board expand and contract due to heat by as much as similar degrees, and thus, the reliability of a solder joint may be enhanced. Moreover, fiber protrusion failure may be prevented compared with a case a via hole is processed by using a COlaser drill, thereby minimizing substrate failures. 1. Prepreg , comprising:a reinforcing member comprising organic fiber formed of a first liquid crystal polymer resin or a first super engineering resin; anda base resin layer formed on the reinforcing member and comprising a second liquid crystal polymer resin or a second super engineering resin,wherein a melting point of the reinforcing member is higher than a melting point of the base resin layer by as much as 10 to 30° C.2. The prepreg as set forth in claim 1 , wherein the liquid crystal polymer resin comprises an aromatic polyester resin.3. The prepreg as set forth in claim 1 , wherein the super engineering resin comprises polyphenylene sulfide (PPS) claim 1 , polyether ether ketone (PEEK) claim 1 , polyphthal amide (PPA) claim 1 , polysulfone (PSU) claim 1 , polyether imide (PEI) claim 1 , polyether sulfone (PES) claim 1 , polyphenyl sulfone (PPSU) claim 1 , or polyamide imide (PAI).4. The prepreg as set forth in claim 1 , wherein a coefficient of thermal expansion (CTE) of the reinforcing member in longitudinal and transverse directions is −20 to 9 ppm/° C.5. The prepreg as set forth in claim 1 , wherein a coefficient of thermal expansion (CTE) of the base resin layer in ...

Polyimide component, polyimide film, and polyimide copper clad laminate

A polyimide component being transparent includes a dianhydride monomer and a diamine monomer. The dianhydride monomer has an asymmetric structure. The dianhydride monomer has at least one first polar group and at least one side chain group. The first polar group is an ester group. A molecular structural formula of the side chain group is:The diamine monomer has an asymmetric structure and at least one second polar group. The second polar group is at least one of a nitrogen heterocycle and an ether group. The polyimide component is polymerized by the dianhydride monomer and the diamine monomer. The disclosure also relates to a polyimide film and a polyimide copper clad laminate.

METHOD FOR PRODUCING METAL-CLAD LAMINATE, AND METAL-CLAD LAMINATE

Provided is a method for producing a metal-clad laminate of a thermoplastic liquid crystal polymer film (TLCP film) and a metal sheet(s) bonded to at least one surface of the film using roll-to-roll processing. The metal sheet has a surface with a ten-point average roughness (Rz) of 5.0 μm or less to be bonded to the TLCP film. The method includes preparing the laminate, dry-treating the laminate by subjecting the laminate passed through a dry zone satisfying the following conditions (1) and (2): 1. A method for producing a metal-clad laminate using roll-to-roll processing , the metal-clad laminate comprising a film of a thermoplastic polymer being capable of forming an optically anisotropic melt phase (hereinafter may be referred to as “a thermoplastic liquid crystal polymer film”) and a metal sheet(s) bonded to at least one surface of the thermoplastic liquid crystal polymer film , the metal sheet having a surface with a ten-point average roughness (Rz) of 5.0 μm or less to be bonded to the thermoplastic liquid crystal polymer film , the method at least comprising:preparing the laminate comprising the metal sheet(s) bonded to the thermoplastic liquid crystal polymer film, (1) the dry treatment is carried out at a drying temperature of lower than the melting point of the thermoplastic liquid crystal polymer film,', '(2) the dry treatment is carried out for a drying period of 10 seconds or longer, and, 'dry-treating the laminate by subjecting the laminate passed through a dry zone satisfying the following conditions (1) and (2)heat-treating the dried laminate by subjecting the laminate passed through a heating zone on a temperature condition of not lower than the melting point of the thermoplastic liquid crystal polymer film successively after the dry treatment.2. The production method according to claim 1 , wherein the metal sheet has a surface with a ten-point average roughness (Rz) of 2.0 μm or less on the side in contact with the thermoplastic liquid crystal ...

POLYMERIZABLE COMPOSITION, CYCLOOLEFIN-BASED POLYMER, CYCLOOLEFIN-BASED RESIN MOLDED BODY, AND LAMINATE

The present invention pertains to: a polymerizable composition comprising a cycloolefin-based monomer represented by a formula (I), and a polymerization catalyst, wherein Ris a hydrocarbon group having 1 to 10 carbon atoms, a halogen atom, etc, m is an integer from 0 to 6n+6, and n is an integer from 1 to 3. As a result of the present invention, a polymerizable composition that is useful as a material for producing a cycloolefin-based resin formed article that exhibits excellent adhesion to a metal, a cycloolefin-based polymer obtained from the polymerizable composition, a cycloolefin-based resin formed article, and a laminate that includes a metal foil and a cycloolefin-based resin layer that is situated adjacent to the metal foil are provided. 2. The polymerizable composition according to claim 1 , wherein the cycloolefin-based monomer represented by the formula (I) is 4 claim 1 ,5-epoxytricyclo[5.2.1.0]dec-8-ene.3. The polymerizable composition according to claim 1 , wherein the polymerization catalyst is a metathesis polymerization catalyst.4. The polymerizable composition according to claim 1 , wherein the polymerization catalyst is a ruthenium carbene complex.5. The polymerizable composition according to claim 1 , further comprising a cycloolefin-based monomer other than the cycloolefin-based monomer represented by the formula (I).6. A cycloolefin-based polymer obtained by polymerizing the polymerizable composition according to .7. A cycloolefin-based resin formed article obtained by subjecting the polymerizable composition according to to bulk polymerization.8. A laminate comprising a metal foil claim 1 , and a cycloolefin-based resin layer that is situated adjacent to the metal foil and formed by subjecting the polymerizable composition according to to bulk polymerization. The present invention relates to a polymerizable composition that is useful as a material for producing a cycloolefin-based resin formed article that exhibits excellent adhesion to a metal ...

Biomass photosensitive material and method for manufacturing the same, and printed circuit board

A method of forming a biomass photosensitive material is provided, which includes ( 1 ) polymerizing (a) itaconic anhydride and (b) acrylate to form a copolymer, and ( 2 ) mixing the copolymer and (c) monomer with a single hydroxy group and a carbon-carbon double bond for a ring-opening addition reaction, wherein the (a) itaconic anhydride and the single hydroxy group of the (c) monomer with the single hydroxy group and the carbon-carbon double bond are reacted in the ring-opening addition reaction.

Method of printing electronic systems on textile substrates

The present invention relates to the very innovative field of smart textiles. More particularly the present invention discloses an innovative process for screen printing of textile substrates, by means of primers, for depositing on said substrates dielectric, conductive, resistive, magnetic, electroluminescent materials and many others.

DISPLAY DEVICE

According to one embodiment, a display device includes an insulating substrate includes a first area, a second area adjacent to the first area, and a third area adjacent to the second area, a wiring substrate mounted at a position overlapping the third area on a surface side of the insulating substrate, and a supporting substrate attached to the insulating substrate on the other surface side of the insulating substrate, which is opposite to the surface side, wherein the second area is located between the first area and the third area, and the supporting substrate is provided so as not to overlap the second area. 1. A display device comprising:an insulating substrate comprising a first area, a second area adjacent to the first area, and a third area adjacent to the second area;a wiring substrate mounted at a position overlapping the third area on a surface side of the insulating substrate; anda supporting substrate attached to the insulating substrate on the other surface side of the insulating substrate, which is opposite to the surface side, whereinthe second area is located between the first area and the third area, andthe supporting substrate is provided so as not to overlap the second area.2. The display device of claim 1 , whereinthe insulating substrate is formed such that a film thickness of the second area is less than a film thickness of the first area and a film thickness of the third area.3. The display device of claim 1 , whereinthe insulating substrate comprises, on the other surface side of the insulating substrate, a first surface located in the first area, a second surface located in the second area, and a third surface located in the third area, andthe second surface is rougher than the first surface and the third surface.4. The display device of claim 1 , whereinthe supporting substrate transmits 70% or more of laser light having a wavelength less than or equal to 355 nm.5. The display device of claim 1 , whereinthe supporting substrate is ...

CURABLE COMPOSITION AND CURED PRODUCT THEREOF

A curable composition to be cured to provide a cured product excellent in heat resistance and dielectric properties, a cured product of the curable composition, a printed wiring board, a semiconductor sealing material, and a build-up film using the curable composition. There is provided a curable composition containing an aromatic ester resin (A) and a maleimide compound (B), the aromatic ester resin (A) being an active ester resin that is a reaction product of a first aromatic compound having two or more phenolic hydroxy groups, a second aromatic compound having a phenolic hydroxy group, and a third aromatic compound having two or more carboxy groups and/or an acid halide thereof or an esterified compound thereof, in which at least one of the first aromatic compound, the second aromatic compound, and the third aromatic compound and/or the acid halide thereof or the esterified compound thereof has a polymerizable unsaturated bond-containing substituent. 1. A curable composition , comprising:an aromatic ester resin (A) and a maleimide compound (B), the aromatic ester resin (A) being an active ester resin that is a reaction product of:a first aromatic compound having two or more phenolic hydroxy groups;a second aromatic compound having a phenolic hydroxy group; anda third aromatic compound having two or more carboxy groups and/or an acid halide thereof or an esterified compound thereof,wherein at least one of the first aromatic compound, the second aromatic compound, and the third aromatic compound and/or the acid halide thereof or the esterified compound thereof has a polymerizable unsaturated bond-containing substituent.3. The curable composition according to claim 2 , wherein each X is a substituted or unsubstituted cycloalkylene having 1 to 20 carbon atoms or an aralkylene having 8 to 20 carbon atoms.4. The curable composition according to claim 1 , wherein the second aromatic compound is a fused ring aromatic compound.5. The curable composition according to claim ...

MOUNTING METHOD AND MOUNTING STRUCTURE FORMED BY THE SAME

A method for mounting an electronic component on a resin base material, the method including: 1. A mounting method for mounting an electronic component on a resin base material , the method comprising:(1) preparing the resin base material having a wiring pattern formed of a conductive paste;(2) supplying a solder paste which contains solder particles and a thermosetting resin in a state before curing to a predetermined portion of the resin base material;(3) placing the electronic component on the solder paste; and(4) heating the resin base material to heat the solder paste to a temperature in a range from 105° C. to 130° C., inclusive to melt the solder particles, and starting a curing exothermic reaction of the thermosetting resin, whereina melting temperature of the solder particles is in a range from 90° C. to 130° C., inclusive, and a peak temperature of the curing exothermic reaction of the thermosetting resin is in a range from 135° C. to 165° C., inclusive.2. The mounting method of claim 1 , whereinin step (4), a heating temperature is maintained for at least 5 minutes.3. The mounting method of claim 1 , whereinthe solder paste further contains a curing agent.4. The mounting method of claim 1 , whereinthe thermosetting resin is an epoxy resin.5. A mounting structure in which an electronic component is mounted on a resin base material claim 1 , the mounting structure comprising:a resin base material; a wiring pattern formed of a conductive paste on the resin base material; an electronic component disposed on the resin base material; and a solder bonding portion electrically connecting the wiring pattern and the electronic component, whereina cured thermosetting resin portion is interposed between the solder bonding portion and the resin base material.6. The mounting structure of claim 5 , whereina ratio of an area occupied by the cured thermosetting resin portion on a main surface of the resin base material to a sum of this area thereof and an area occupied by ...

Liquid crystal polymer film and laminate comprising the same

Provided are a liquid crystal polymer (LCP) film and a laminate comprising the same. The LCP film has a first surface and a second surface opposite each other, and a ratio of a ten-point mean roughness relative to a maximum height (Rz/Ry) of the first surface is from 0.30 to 0.62. By controlling Rz/Ry of at least one surface of the LCP film, the peel strength of the LCP film stacked to a metal foil can be increased, and the laminate comprising the same can still maintain the merit of low insertion loss.

INSULATING MEDIUM RUBBER FILM AND PRODUCTION METHOD THEREOF AND MULTI-LAYER PRINTED-CIRCUIT BOARD

An insulating medium rubber film and a production method thereof, and a multi-layer printed-circuit board. The insulating medium rubber film includes a release film and an insulating medium layer arranged on the surface of the release film, where materials of the insulating medium layer include saturated polyester resin, amino resin or blocked isocyanate, epoxy resin, a curing agent, inorganic filler and a curing accelerator. According to the insulating medium rubber film and the production method thereof and the multi-layer printed-circuit board, by introducing the saturated polyester resin component into an epoxy resin composition, the produced insulating medium rubber film has the advantages that a dielectric constant is low, a dielectric dissipation factor is low, thermal expansion is not liable to happen, and adhesion is good. 110-. (canceled)11. An insulating medium rubber film , comprising: a release film and an insulating medium layer arranged on a surface of the release film , and a material of the insulating medium layer comprises saturated polyester resin , amino resin or blocked isocyanate , epoxy resin , curing agent , inorganic filler and curing accelerator.12. The insulating medium rubber film according to claim 11 , wherein the material of the insulating medium layer comprises claim 11 , by weight claim 11 , 5-30 units of saturated polyester resin claim 11 , 0.5-3 units of amino resin or blocked isocyanate claim 11 , 45-75 units of epoxy Resin claim 11 , 1-25 units of the curing agent claim 11 , 1-100 units of the inorganic filler and 0.1-5 units of the curing accelerator.14. The insulating medium rubber film according to claim 11 , wherein the amino resin is a resin formed by a condensation polymerization of melamine or benzoquanmine claim 11 , with formaldehyde and organic alcohol.15. The insulating medium rubber film according to claim 11 , wherein the blocked isocyanate is selected from the group consisting of phenol-blocked HDI claim 11 , MDI ...

METHOD OF MANUFACTURING PHYSICAL STRUCTURE FOR HIGH FREQUENCY SIGNAL TRANSMISSION

A method for fabricating a sandwiched structure of silver-copper-silver functioning as a high frequency signal transmission structure includes an insulating sheet and a conductive circuit on the insulating sheet. The conductive circuit includes a silver conductive layer bonded to the insulating sheet, a copper conductive layer formed on the silver conductive layer, and a silver covering layer laid to cover top and side surfaces of the copper conductive layer. The silver conductive layer and the silver covering layer together enclose the copper conductive layer and the higher conductivity of the silver together with the skin effect improves high-frequency transmission efficiency of the copper. 1. A method of manufacturing a high frequency signal transmission structure , comprising:providing an insulating sheet, forming a silver bottom layer on the insulating sheet;forming a copper conductive layer on a part of the silver bottom layer;removing the silver bottom layer which is not covered by the copper conductive layer; andforming a silver covering layer on the copper conductive layer, wherein the copper conductive layer is surrounded by the silver bottom layer and the silver covering layer, the silver bottom layer, the copper conductive layer and the silver covering layer cooperatively form a conductive circuit, the copper conductive layer is a core of the conductive circuit, and the silver conductive layer and the silver covering layer cooperatively form a cladding layer wrapping the core of the conductive wiring layer.2. The method of claim 1 , wherein the silver bottom layer is formed on the insulating sheet by vacuum evaporation.3. The method of claim 1 , wherein the insulating sheet is made from polyester polymer claim 1 , polynaphthalene dicarboxylic acid glycol ester claim 1 , polyimide claim 1 , or polyterephthalate.4. The method of claim 1 , wherein before evaporating a silver bottom layer on the insulating sheet claim 1 , further comprising pre-treating a ...

FLEXIBLE CIRCUIT BOARD AND METHOD FOR PRODUCTION THEREOF

A flexible circuit board with high connection reliability and a manufacturing method thereof, wherein the flexible circuit board has a bent section formed thereon, can be deformed flexibly, and wherein a wiring layer will not be peeled off or ruptured even when deformation is repeated onto the flexible circuit board, heat is radiated from electronic parts, or minute wiring is formed on the flexible circuit board. The flexible circuit board is provided with an insulating film comprised of liquid crystal polymer, a wiring layer formed upon the insulating film, and an insulating layer comprised of liquid crystal polymer formed upon the wiring layer. The flexible circuit board has a bent section with a radius of curvature of R (mm) formed on at least one location thereof, and is made to be deformable in a state with the radius of curvature of the bent section maintained at R (mm). 1. A flexible circuit board which has:an insulating film made of a thermoplastic resin;a wiring layer formed on said insulating film; andan insulating layer made of a thermoplastic resin and formed on said wiring layer;whereinsaid flexible circuit board is formed in at least one place thereof with a bent portion having a radius of curvature R (mm) by deforming the thermoplastic resins themselves; andsaid flexible circuit board is constructed such that it is deformable in a state in which the radius of curvature R (mm) of said bent portion is maintained.2. The flexible circuit board as set forth in claim 1 , wherein said radius of curvature R (mm) is equal to or more than 0.3 mm.3. The flexible circuit board as set forth in claim 1 , wherein said thermoplastic resin is a liquid crystal polymer.4. A method for production of a flexible circuit board as set forth in claim 1 , comprising:a first step to form a bent portion with a radius of curvature R (mm) by bending the flexible circuit board by means of a shaping device in a state in which tension is applied to opposite ends of the flexible ...

Low dielectric resin composition with phosphorus-containing flame retardant and preparation method and application thereof

The invention belongs to the technical field of low dielectric resin compositions, and discloses a low dielectric resin composition with phosphorus-containing flame retardant and a prepreg, resin film, laminate and printed circuit board prepared therefrom. The composition comprises the following components: (A) phosphorus-containing flame retardant; (B) vinyl compound. The phosphorus-containing flame retardant has a structure as shown in formula (I). In the present invention, diphenylphosphine oxide is derivatized, and prepared a phosphorus-containing flame retardant, which has no reactive functional groups, has better dielectric properties, and has high melting point, and upon combining with a vinyl compound, a resin composition is obtained, and a laminate having low thermal expansion ratio, high heat resistance, high glass transition temperature, and low dielectric constant and dissipation factor, can be made from the resin composition, and can effectively achieve the flame resistance effect of UL94 V-0 without using halogen-containing flame retardant, and can be used in the preparation of prepregs, resin films, resin coated coppers, flexible resin coated coppers, laminates and printed circuit boards.

Led light arrangement with flexible circuit board having graphite substrate

An LED light arrangement is provided. The light arrangement includes LED light emitting components mounted to a flexible circuit board having a flexible graphite substrate. The flexible circuit board includes a dielectric layer formed an the surface of the flexible graphite substrate and an electrically conductive layer formed on the surface of the dielectric. The high in-plane thermal conductivity graphite substrate provides enhanced heat transfer capability to effectively move of heat away from the electronic components for improved cooling of the heat generating light emitting component and surrounding devices.

Preparation method of flexible transparent circuit

A manufacturing method of a flexible transparent circuit includes preparing a circuit template. The method further includes using a flexible transparent polymer material to prepare a cured transparent carrier on the circuit template, wherein the cured transparent carrier has a groove circuit structure. The method includes coating a solution containing a conductive material in a groove of the cured transparent carrier. The method further includes forming a circuit with the high transparency and conductivity after the solvent is volatilized. The circuit are designed and manufactured according to the requirements, and the precision thereof is able to achieve the micron or nanometer level. The formed circuit is light. The circuit can be stretched, bended or twisted many times. The circuit has a good biological compatibility. The circuit manufactured by such method is expected to be applied in various fields such as smart contact lens, flexible transparent electron devices, electronic skins.

APPLICATION SPECIFIC ELECTRONICS PACKAGING SYSTEMS, METHODS AND DEVICES

Depicted embodiments are directed to an Application Specific Electronics Packaging (“ASEP”) system, which enables the manufacture of additional products using reel to reel () manufacturing processes as opposed to the “batch” processes used to currently manufacture electronic products and MIDs. Through certain ASEP embodiments, it is possible to integrate connectors, sensors, LEDs, thermal management, antennas, RFID devices, microprocessors, memory, impedance control, and multi-layer functionality directly into a product. 1. A method of manufacturing electronic devices comprising:forming a continuous carrier formed of an electrically conductive material;molding a plurality of non-conductive substrates onto the carrier;forming traces on the substrates;electroplating the traces;electrically attaching components to the traces to form a plurality of devices;singulating one of the devices from the remainder of the carrier.2. The method of claim 1 , wherein forming the traces comprises:ablating the substrate with a laser;depositing an ink on the ablated surface; andsintering the ink.3. The method of claim 1 , wherein pockets are molded into the substrate such that portions of the carrier are exposed.4. A device comprising:a singulated carrier portion;a substrate molded onto the singulated carrier portion;seed layer traces on the substrate;plated metal traces on the seed layer traces; anda component electrically attached to at least one plated metal trace.5. The device of claim 4 , wherein the device comprises at least one of a printed circuit board claim 4 , a flex circuit claim 4 , a connector claim 4 , a thermal management feature claim 4 , EMI shielding claim 4 , a high current conductor claim 4 , an RFID apparatus claim 4 , an antenna claim 4 , a wireless power device claim 4 , a sensor claim 4 , a MEMS apparatus claim 4 , an LED device claim 4 , a microprocessor claim 4 , a memory device claim 4 , an ASIC claim 4 , a passive device claim 4 , an impedance control ...

METHODS OF PATTERNING A CONDUCTOR ON A SUBSTRATE

A method of patterning a conductor on a substrate includes providing an inked elastomeric stamp inked with self-assembled monolayer-forming molecules and having a relief pattern with raised features. Then the raised features of the inked stamp contact a metal-coated visible light transparent substrate. Then the metal is etched to form an electrically conductive micropattem corresponding to the raised features of the inked stamp on the visible light transparent substrate. 1. A touch screen panel comprising:a visible light transparent touch sensing area;a plurality of first regions, each first region comprising an electrically conductive micropattern comprising a plurality of electrically conductive traces having a trace width between 0.5 to 25 micrometers; andat least one electrically conductive larger feature outside the touch sensing area having a width greater than about 25 microns, wherein the at least one larger feature and the traces comprise a self-assembled monolayer.2. The touch screen panel of comprising a plurality of larger features claim 1 , each larger feature electrically connected to a corresponding first region.3. The touch screen panel of claim 1 , wherein the self-assembled monolayer is disposed on a metal.4. The touch screen panel of claim 1 , wherein the self-assembled monolayer comprises octadecylthiol.5. The touch screen panel of claim 1 , wherein the at least one larger feature comprises a contact pad.6. The touch screen panel of claim 1 , wherein the at least one larger feature comprises an electrically conductive trace for connecting the first regions to a touch sensor drive device.7. The touch screen panel of claim 1 , wherein the first regions have a fill factor between 0.5 and 15%.8. The touch screen panel of claim 1 , wherein the first regions have a fill factor less than 5%.9. The touch screen panel of claim 1 , wherein the at least one larger feature has a fill factor of 1.10. The touch screen panel of claim 1 , wherein the at least ...

POLYSILSESQUIOXANE RESIN COMPOSITION FOR FLEXIBLE SUBSTRATE

The present invention relates to a polysilsesquioxane resin composition for a flexible substrate. More specifically, the present invention relates to a polysilsesquioxane resin composition for a flexible substrate, having excellent heat resistance and transparency, the resin composition being usable for a flexible display substrate. More specifically, a transparent thin film can be formed, excellent transmittance is exhibited in the visible range even after curing, heat resistance is excellent, and flexibility and crack resistance can be controlled. Compared to a conventional polyimide-based substrate material, the present invention has excellent insulation characteristics and passivation characteristics, which can be satisfied simultaneously, and is advantageous for productivity since release characteristics are ensured during a delamination process from a glass substrate. 2. The polysilsesquioxane random copolymer of claim 1 , wherein in Formula 1 claim 1 , Ris CF—(CF)— claim 1 ,m is an integer of 0 to 18,{'sub': 2', '2-20, 'Ris a Calkylene group, and'}{'sub': '4', 'Ris one or more selected from the group consisting of a glycidyloxy group, a cyclohexyl epoxy group, oxetane, an acryloxy group, a methacryloxy group, an isocyanate group, a hydroxyl group, a phthalic anhydride group, a maleic anhydride group, and a succinic anhydride group,'}{'sub': 2', '4', '1-6', '1-6, 'wherein the alkylene group, aryl group, heteroaryl group, cycloalkyl group, heterocycloalkyl group, and acryloxy group of Rto Rare each independently substituted or unsubstituted with one or more substituents selected from the group consisting of a halogen, a hydroxyl group, —CN, a linear or branched Calkyl, and a linear or branched Calkoxy.'}3. The polysilsesquioxane random copolymer of claim 1 , wherein the random copolymer has a weight average molecular weight (M) of 1 claim 1 ,000 to 50 claim 1 ,000 and a polydispersity index of 1.5 to 8.0.5. The polysilsesquioxane resin composition of claim 4 , ...

STRUCTURE, WIRELESS COMMUNICATION DEVICE AND METHOD FOR MANUFACTURING STRUCTURE

A first resin layer () has: a covered region which is covered by a second resin layer () and an exposed region (); a contact part () which is provided in the exposed region (); and a bend part () which is provided between (a) a boundary between the covered region and the exposed region () and (b) the contact part (). 15-. (canceled)6: A structure comprising:a first resin layer which is an injection-molded article;a second resin layer; andan electrically conductive pattern provided on a surface of the first resin layer,the second resin layer being molded, by insert-molding, on the first layer so that the electrically conductive pattern is provided between the first resin layer and the second resin layer, and a covered region which is covered by the second resin layer and an exposed region which is not covered by the second resin layer;', 'a contact part which is provided in the exposed region and in which a contact for electrically connecting the electrically conductive pattern to another member is provided; and', 'a bend part which is provided between (a) a boundary between the covered region and the exposed region and (b) the contact part and which is a part bending on a surface of the first resin layer., 'the first resin layer having7: The structure as set forth in claim 6 , wherein the first resin layer has the bend part in a region in which the electrically conductive pattern is provided.8: The structure as set forth in claim 6 , wherein:the exposed region has a recess which is recessed with respect to the covered region, which is adjacent to the exposed region; andthe contact part is provided in the recess.9: A structure comprising:a first resin layer;a second resin layer; andan electrically conductive pattern provided on a surface of the first resin layer,the second resin layer being molded on the first layer so that the electrically conductive pattern is provided between the first resin layer and the second resin layer, and a covered region which is covered ...

MULTILAYER RESIN SUBSTRATE AND ELECTRONIC COMPONENT

A multilayer resin substrate includes insulating resin base material layers, and conductor patterns on at least one of the insulating resin base material layers. The conductor patterns include a ground conductor on a main surface of the insulating resin base material layers and extend into a frame shape or a planar shape, and the ground conductor includes openings. An aperture ratio of the openings in an outer peripheral portion of the ground conductor is less than an aperture ratio of the openings in an inner peripheral portion of the ground conductor. 1. A multilayer resin substrate comprising:a plurality of insulating resin base material layers; anda plurality of conductor patterns on at least one of the plurality of insulating resin base material layers; whereinthe plurality of conductor patterns include a planar conductor on a main surface of the plurality of insulating resin base material layers and extending into a frame shape or a planar shape;the planar conductor includes a plurality of openings; andan aperture ratio of the plurality of openings in an outer peripheral portion of the planar conductor is less than an aperture ratio of the plurality of openings in an inner peripheral portion of the planar conductor.2. The multilayer resin substrate according to claim 1 , wherein a first opening group in which a plurality of openings are arranged at regular intervals; and', 'a second opening group in which a plurality of openings located closer to an outer end of the planar conductor than the first opening group are arranged at regular intervals;, 'the plurality of openings includea first opening group area being a total of plane cross-sectional areas of the first opening group is larger than a second opening group area being a total of plane cross-sectional areas of the second opening group;the inner peripheral portion includes the first opening group and does not include the second opening group; andthe outer peripheral portion includes the second opening ...

Resin composition, and prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board each obtained using said resin composition

A resin composition is provided and contains (A) a thermosetting compound having a styrene structure or a (meth)acrylate structure, and (B) a maleimide compound represented by the following formula (1) (in the formula, p represents an integer of 1 to 10), in which the content ratio of the component (A) to the component (B) is (A):(B)=20:80 to 90:10 in mass ratio.

METHOD FOR MANUFACTURING CIRCUIT BOARD AND CIRCUIT BOARD

The present invention relates to a method for manufacturing a circuit board including the steps of preparing a substrate containing silicon at least at a surface, applying a paste containing aluminum particles onto the substrate, forming a conductor layer on the substrate by firing the substrate to which the paste has been applied, forming a resist film having a specific pattern on the conductor layer, and removing with an etchant, the conductor layer in a portion where the resist film has not been formed, the etchant containing fluoride ions and metal ions of a metal M of which standard electrode potential is higher in value than a standard electrode potential of aluminum, and to a circuit board which can be manufactured with such a method. 1. A method for manufacturing a circuit board , comprising the steps of:preparing a substrate containing silicon at least at a surface;applying a paste containing aluminum particles onto the substrate;forming a conductor layer on the substrate by firing the substrate to which the paste has been applied;forming a resist film having a specific pattern on the conductor layer; andremoving with an etchant, the conductor layer in a portion where the resist film has not been formed,the etchant containing fluoride ions and metal ions of a metal M of which standard electrode potential is higher in value than a standard electrode potential of aluminum.2. The method for manufacturing a circuit board according to claim 1 , whereinthe metal ions of the metal M are iron ions or copper ions, and the fluoride ions are derived from at least one compound selected from the group consisting of hydrogen fluoride, tetrafluorosilicon, hexafluorosilicic acid, hexafluorosilicate, boron trifluoride, fluoroboric acid, fluoroborate, phosphorus fluoride, ammonium fluoride, silver fluoride, aluminum fluoride, cesium fluoride, potassium fluoride, sodium fluoride, and lithium fluoride.3. The method for manufacturing a circuit board according to claim 1 , ...

ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT

One aspect of the present invention is a method for manufacturing an electronic component, the method including: a first step of applying a metal paste containing metal particles onto a polymer compact in a prescribed pattern to form a metal paste layer; a second step of sintering the metal particles to form metal wiring; a third step of applying a solder paste containing solder particles and a resin component onto the metal wiring to form a solder paste layer; a fourth step of disposing an electronic element on the solder paste layer; and a fifth step of heating the solder paste layer so as to form a solder layer bonding the metal wiring and the electronic element, and so as to form a resin layer covering at least a portion of the solder layer. 1. A method for manufacturing an electronic component , the method comprising:a first step of applying a metal paste containing metal particles onto a polymer compact in a prescribed pattern to form a metal paste layer;a second step of sintering the metal particles to form a metal wiring;a third step of applying a solder paste containing solder particles and a resin component onto the metal wiring to form a solder paste layer;a fourth step of disposing an electronic element on the solder paste layer; anda fifth step of heating the solder paste layer so as to form a solder layer bonding the metal wiring and the electronic element, and so as to form a resin layer covering at least a portion of the solder layer.2. The method for manufacturing an electronic component according to claim 1 ,wherein, in the second step, the metal wiring has pores.3. The method for manufacturing an electronic component according to claim 2 ,wherein, in the third step, at least some of the pores are loaded with the resin component.4. The method for manufacturing an electronic component according to claim 1 ,wherein the solder particles contain tin.5. The method for manufacturing an electronic component according to claim 4 ,wherein the solder ...

Self-Folding Machines

A self-folding machine comprises a laminate including a flexible layer with a first side and a second side; a first rigid layer including at least one gap laminated to the first side of the flexible layer; a second rigid layer including at least one gap laminated to the second side of the flexible layer, wherein the rigid layers are more rigid than the flexible layer; a first contractible layer laminated to the first rigid layer and extending across at least one gap in the first rigid layer; and a second contractible layer laminated to the second rigid layer and extending across at least one gap in the second rigid layer, wherein the first and second contractible layers retract to respectively create folds in the machine across gaps in the first and second rigid layers when activated. 1. A self-folding machine , comprising a laminate including:a flexible layer with a first side and a second side;a first rigid layer including at least one gap laminated to the first side of the flexible layer;a second rigid layer including at least one gap laminated to the second side of the flexible layer, wherein the rigid layers are more rigid than the flexible layer;a first contractible layer laminated to the first rigid layer and extending across at least one gap in the first rigid layer; anda second contractible layer laminated to the second rigid layer and extending across at least one gap in the second rigid layer, wherein the first and second contractible layers retract to respectively create folds in the machine across gaps in the first and second rigid layers when activated.2. The self-folding machine of claim 1 , wherein the contractible layers are shape-memory layers.3. The self-folding machine of claim 2 , wherein the laminate further comprises electrically conductive pathways electrically coupled with the first shape-memory layer and with the second shape-memory layer.4. The self-folding machine of claim 3 , further comprising a voltage source electrically coupled with ...

FLEXIBLE LIGHTING PANEL

A flexible lighting panel includes: a base layer having one side surface on which a circuit pattern is disposed and made of a flexible material; a plurality of LEDs mounted on one side surface of the base layer; and a heat dissipating layer laminated on the other side surface of the base layer. 1. A flexible lighting panel comprising:a base layer having one side surface on which a circuit pattern is disposed and made of a flexible material;a plurality of LEDs mounted on one side surface of the base layer; anda heat dissipating layer laminated on the other side surface of the base layer.2. The flexible lighting panel of claim 1 , wherein the heat dissipating layer has a plate-like structure having a net structure or a honeycomb structure.3. The flexible lighting panel of claim 1 , wherein the heat dissipating layer is made of a copper or aluminum material.4. The flexible lighting panel of claim 1 , wherein at least one fiber layer is laminated on the other side surface of the heat dissipating layer.5. The flexible lighting panel of claim 4 , wherein the fiber layer is treated to be flame-retarded or waterproofed.6. The flexible lighting panel of claim 1 , wherein the plurality of LEDs comprise at least two groups claim 1 , and each of the groups has a different color temperature.7. The flexible lighting panel of claim 6 , wherein the plurality of LEDs comprise a first group of LEDs having a color temperature of 2 claim 6 ,500 K to 3 claim 6 ,500 K and a second group of LEDs having a color temperature of 4 claim 6 ,500 K to 6 claim 6 ,500 K claim 6 , and the first group of LEDs and the second group of LEDs are lattice-arranged adjacent to each other.8. The flexible lighting panel of claim 6 , wherein the plurality of LEDs comprise a first group of LEDs having a color temperature of 2 claim 6 ,800 K and a second group of LEDs having a color temperature of 6 claim 6 ,500 K claim 6 , andthe flexible lighting panel further comprises a control unit comprising a level ...

ELECTRONIC CIRCUIT

An electronic circuit () comprises at least one electrically conductive portion arranged to a substrate () and at least one electrical coupling point () determined at the at least one electrically conductive portion. The electronic circuit () comprises at the at least one electrical coupling point () at least one magnetic and electrically conductive coupling element () for providing an electrically conductive coupling point () with magnetic fastening force. 1. An electronic circuit comprising at least one electrically conductive portion arranged to a substrate and at least one electrical coupling point determined at the at least one electrically conductive portion , whereinthe electronic circuit comprises at the at least one electrical coupling point at least one magnetic and electrically conductive coupling element for providing an electrically conductive coupling point with magnetic fastening force, and whereinthe coupling element is a conduction pad formed of printable magnetic and electrically conductive ink andthe coupling element comprises at least two different areas provided with opposite magnetic polarities.2. An electronic circuit as claimed in claim 1 , wherein the magnetic and electrically conductive coupling element is intended to connect and fasten the electronic circuit with a counterpart object both electrically and mechanically.3. An electronic circuit as claimed in claim 1 , wherein the coupling element comprises at least one layer of printable magnetic and electrically conductive ink.4. An electronic circuit as claimed in claim 1 , wherein the electrically conductive portion is an electrically conductive conductor.5. An electronic circuit as claimed in claim 1 , wherein the substrate is a flexible substrate at which the at least one electrically conductive portion is arranged to.6. An electronic circuit as claimed in claim 5 , wherein the substrate is at least one of plastic and paper.7. An electronic device comprising at least one electronic ...

METHOD FOR PROCESSING RESIN PRODUCT AND RESIN PRODUCT

There is provided with a method for manufacturing a resin product. One embodiment includes performing a modification process on a portion of a surface of the resin product not less than two times by different methods to modify the portion such that a plating metal can be deposited on the portion. 1. A method for processing a resin product , comprising performing a modification process on a portion of a surface of the resin product not less than two times by different methods to modify the portion such that a plating metal can be deposited on the portion.2. The method according to claim 1 , wherein the modification process comprises:irradiating the portion with ultraviolet light to modify the surface; andoxidizing a region including the portion to modify the surface.3. The method according to claim 2 , wherein the portion is irradiated with an ultraviolet laser having a wavelength of not more than 243 nm.4. The method according to claim 2 , wherein the portion is irradiated with the ultraviolet light in an atmosphere containing at least one of oxygen or ozone.5. The method according to claim 2 , wherein the region is irradiated with an ultraviolet light having a wavelength of not more than 243 nm.6. The method according to claim 5 , wherein the portion is irradiated with the ultraviolet light in an atmosphere containing at least one of oxygen or ozone claim 5 , and the region is irradiated with the ultraviolet light in an atmosphere containing at least one of oxygen or ozone.7. The method according to claim 2 , wherein the oxidizing is performed after the irradiating.8. The method according to claim 2 , wherein the oxidized region includes the irradiated portion and is wider than the irradiated portion.9. The method according to claim 2 , wherein an oxygen atom existence ratio in the portion is not less than 3.0% after the irradiating.10. The method according to claim 2 , wherein an oxygen atom existence ratio in the portion is not less than 18% after the irradiating ...

CONDUCTIVE FILM SUBSTRATE, TRANSPARENT CONDUCTIVE FILM, AND METHOD FOR PRODUCING TRANSPARENT CONDUCTIVE FILM

Provided is a transparent conductive film including a transparent electrode layer composed of a patterned thin metal wire on at least one surface of a transparent film substrate. The line width of the wire is 5 μm or less. The wire includes a first metal layer and a second metal layer that is in contact with the first metal layer, in this order from a transparent film substrate side. Both of the first and second metal layers contain copper in an amount of 90% by weight or more. The total film thickness of the first and second metal layers is 150 to 1000 nm. The diffraction angle 2θ of the (111) plane of the second metal layer is less than 43.400° as measured using a CuKα ray as an X-ray source, and the first metal layer has crystal properties different from those of the second metal layer.

WATERPROOF STRUCTURE FOR IMPLANTED ELECTRONIC DEVICE

A waterproof structure for an implanted electronic device is capable of preventing the liquid or moist from entering and damaging the circuit board of the electronic device. The waterproof structure includes a shell, a first material layer, a second material layer, and a third material layer. The first material layer covers at least a part of the implanted electronic device. The second material layer covers the first material layer. The internal space of the shell is configured for accommodating the implanted electronic device. The shell is made of PEEK (polyether ether ketone). The third material layer is disposed between the second material layer and the shell. 1. A manufacturing method of a waterproof structure applied to a circuit board of an implanted electronic device , comprising steps of:forming a first material layer on the circuit board for covering at least a part of the circuit board;forming a second material layer for covering the first material layer;after forming the second material layer, disposing the circuit board, the first material layer and the second material layer in a shell, wherein the shell is made of PEEK (polyether ether ketone); andfilling a third material layer between the second material layer and the shell.2. The manufacturing method of claim 1 , wherein after filling the third material layer between the second material layer and the shell claim 1 , a porosity in the shell is less than 5%.3. The manufacturing method of claim 1 , wherein each of the first material layer and the third material layer is made of epoxy or silicone.4. The manufacturing method of claim 1 , wherein the second material layer comprises poly-para-xylene claim 1 , and the second material layer is formed by CVD (chemical vapor deposition).5. The manufacturing method of claim 1 , wherein the second material layer comprises a combination of aluminum oxide and titanium oxide claim 1 , and the second material layer is formed by ALD (atomic layer deposition). This ...

ROOM TEMPERATURE-VULCANIZING SILANE-CONTAINING RESIN COMPOSITION AND MOUNTING CIRCUIT SUBSTRATE

Provided is a room temperature-vulcanizing silane-containing resin composition containing: (A) 100 parts by mass of a silane-modified polybutadiene compound represented by formula (1) 2. The room temperature-curable silane-containing resin composition of wherein the silane-modified polybutadiene compound has a number average molecular weight of at least 1 claim 1 ,000.3. The room temperature-curable silane-containing resin composition of or wherein in the silane-modified polybutadiene compound having formula (1) claim 1 , e claim 1 , f and g satisfy the range defined by the formulae (i) and (ii).{'br': None, '0.05≤g/(e+f+g)<1.0 \u2003\u2003(i)'}{'br': None, '0.3≤g/(f+g)≤1.0 \u2003\u2003(ii)'}4. The room temperature-curable silane-containing resin composition of which cures into a cured product having a water vapor permeability of 10 to 50 g/m·day at a thickness of 200 to 500 μm.5. The room temperature-curable silane-containing resin composition of which is used in coating of electrical and electronic parts.6. A packaged circuit board comprising a circuit board having an electrical or electronic part mounted thereon and a cured coating thereon claim 1 , the cured coating being a cured product of the room temperature-curable silane-containing resin composition of . This invention relates to a room temperature-curable (or RT-curable) silane-containing resin composition for forming a coating film, specifically to a room temperature-curable silane-containing resin composition suited in the application as coating agent compositions, especially as coating agents for electrical and electronic parts and substrates thereof and sealing agents for liquid crystal display components. More particularly, it relates to a room temperature-curable silane-containing resin composition for forming a cured coating having a corrosion-preventing function against corrosive gases, and a packaged circuit board having a cured coating of the composition.Because of ease of handling, weather ...

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

There are provided a printed circuit board including: an insulation layer in which a via hole is formed; vias formed in the via hole; first circuit patterns formed below the insulation layer and electrically connected to the vias; and second circuit patterns formed on the insulation layer to be bonded to the vias; wherein the via has a diameter smaller than that of the via hole, and a method of manufacturing a printed circuit board. 1. A printed circuit board comprising:an insulation layer in which a via hole is formed;vias formed in the via hole;first circuit patterns formed below the insulation layer and electrically connected to the vias; andsecond circuit patterns formed on the insulation layer to be bonded to the vias;wherein the via has a diameter smaller than that of the via hole.2. The printed circuit board of claim 1 , wherein one side surface of the via contacts the insulation layer claim 1 , and the other side surface thereof does not contact the insulation layer.3. The printed circuit board of claim 1 , wherein the second circuit patterns have a diameter smaller than that of the via hole.4. The printed circuit board of claim 1 , wherein the first circuit patterns have a diameter smaller than that of the via hole.5. The printed circuit board of claim 1 , wherein the second circuit patterns have a diameter different from that of the via.6. The printed circuit board of claim 1 , wherein a plurality of vias are spaced apart from each other in the via hole.7. The printed circuit board of claim 1 , further comprising a via land formed below the insulation layer and bonded to a lower surface of the via.8. The printed circuit board of claim 7 , wherein the first circuit patterns are bonded to the via land.9. A method of manufacturing a printed circuit board comprising:forming a second insulation layer on the first insulation layer in which a via land is formed;forming a via hole exposing the via land in the second insulation layer;forming a plating resist in ...

Panel for an aircraft

A panel for an aircraft is disclosed. The panel has a body with an integral conductor for the transmission of electrical power and/or signals therethrough.

Heat-curable resin composition, and adhesive agent, film, prepreg, laminate, circuit board and printed-wiring board using same

Provided are a heat-curable resin composition capable of being turned into a cured product having a high glass-transition temperature, a low dielectric tangent and a superior adhesion to a metal foil; and an adhesive agent, film, prepreg, laminate, circuit board as well as printed-wiring board using such heat-curable resin composition. The heat-curable resin composition contains: (A) a polyphenylene ether resin having reactive double bonds at molecular chain ends; (B) a (meth)acrylic acid ester compound; (C) a cyclic imide compound containing, in one molecule, at least one dimer acid backbone, at least one linear alkylene group having not less than 6 carbon atoms, and at least two cyclic imide groups; and (D) a reaction initiator.

WIRING BOARD AND PRODUCTION METHOD FOR SAME

A wiring board according to the present disclosure includes a first insulating material layer having a surface with an arithmetic average roughness Ra of 100 nm or less, a metal wiring provided on the surface of the first insulating material layer, and a second insulating material layer provided to cover the metal wiring, in which the metal wiring is configured by a metal layer in contact with the surface of the first insulating material layer and a conductive part stacked on a surface of the metal layer, and a nickel content rate of the metal layer is 0.25 to 20% by mass.

TOUCH PANEL, PREPARING METHOD THEREOF, AND AG-PD-ND ALLOY FOR TOUCH PANEL

Provided is a touch panel comprising: a transparent substrate, a transparent conductive material disposed on the 5 substrate, and a Ag—Pd—Nd alloy layer disposed on the transparent conductive material. Provided are also a preparation method of the touch panel and a display comprising the touch panel. Provided are also a Ag—Pd—Nd alloy for touch panel, comprising: 97.9 to 99.2 weight % of Ag, 0.7 to 1.8 weight % of Pd, and 0.1 to 0.3 weight % of Nd, based on 100 weight % of the alloy. 1. A touch panel comprising:a transparent substrate;a transparent conductive material disposed on the substrate; andan Ag—Pd—Nd alloy layer disposed on the transparent conductive material.2. The touch panel of claim 1 , further comprising:a metal layer formed of at least one metal selected from the group consisting of Mo, Ag, Ni, Cu, Ti and Cr, and disposed between the transparent conductive material and the Ag—Pd—Nd alloy layer.3. The touch panel of claim 2 , wherein the metal layer is formed of Mo claim 2 , a Mo—Ag alloy claim 2 , a Ni—Cu—Ti alloy or a Ni—Cr alloy.4. The touch panel of claim 1 , further comprising:a metal layer formed of a metal selected from the group consisting of Mo, Ag, Ni, Cu, Ti and Cr, anda metal alloy layer formed of two or more metals selected from the group consisting of Mo, Ag, Ni, Cu, Ti and Cr on the metal layer,between the transparent conductive material and the Ag—Pd—Nd alloy layer.5. The touch panel of claim 1 , wherein the Ag—Pd—Nd alloy layer comprises:97.9 to 99.2 weight % of Ag,0.7 to 1.8 weight % of Pd, and0.1 to 0.3 weight % of Nd,based on 100 weight % of the alloy.6. The touch panel of claim 5 , wherein the Ag—Pd—Nd alloy layer comprises:98.45 to 99.05 weight % of Ag,0.8 to 1.3 weight % of Pd, and0.15 to 0.25 weight % of Nd,based on the 100 weight % of the alloy.7. The touch panel of claim 1 , wherein the transparent substrate is selected from the group consisting of polyethylene terephthalate (PET) claim 1 , polybutylene terephthalate (PBT) ...

Package structure and manufacturing method thereof

A package structure includes a circuit substrate, at least one electronic component, and a connecting slot. The circuit substrate includes at least one core layer, a build-up structure including at least three patterned circuit layers, at least two dielectric layers and conductive through holes, and circuit pads. The electronic component is embedded in at least one of the dielectric layers and located in a disposition area. The electronic component is electrically connected to one of the patterned circuit layers through a portion of the conductive through holes. The connecting slot has a bottom portion, a plurality of sidewall portions connecting the bottom portion, and a plurality of connecting pads located on the sidewall portions. The circuit substrate is assembled to the bottom portion, and the circuit pads are electrically connected to the connecting pads through a bent area of the core layer that is bent relative to the disposition area.

SORBITOL, GLUCARIC ACID, AND GLUCONIC ACID BASED FLAME-RETARDANTS

A flame-retardant sugar derivative, a process for forming a flame-retardant sugar derivative, and an article of manufacture comprising a flame-retardant sugar derivative are disclosed. The flame-retardant sugar derivative can be synthesized from sorbitol, gluconic acid, or glucaric acid obtained from a bio-based source, and can have at least one phosphoryl or phosphonyl moiety. The process for forming the flame-retardant sugar derivative can include reacting sorbitol, gluconic acid, or glucaric acid and a flame-retardant phosphorus-based molecule to form the flame-retardant sugar derivative. 4. The flame-retardant sugar derivative of claim 1 , wherein Ris a phenyl substituent claim 1 , wherein Ris a phenyl substituent claim 1 , wherein Ris a phenyl substituent claim 1 , wherein Ris a phenyl substituent claim 1 , wherein Ris a phenyl substituent claim 1 , and wherein Ris a phenyl substituent.5. The flame-retardant sugar derivative of claim 1 , wherein Ris an epoxide substituent claim 1 , wherein Ris epoxide substituent claim 1 , wherein Ris an epoxide substituent claim 1 , wherein Ris an epoxide substituent claim 1 , wherein Ris an epoxide substituent claim 1 , and wherein Ris an epoxide substituent.6. The flame-retardant sugar derivative of claim 1 , wherein Ris an allyl substituent claim 1 , wherein Ris allyl substituent claim 1 , wherein Ris an allyl substituent claim 1 , wherein Ris an allyl substituent claim 1 , wherein Ris an allyl substituent claim 1 , and wherein Ris an allyl substituent.7. The flame-retardant sugar derivative of claim 1 , wherein Ris a propylene carbonate substituent claim 1 , wherein Ris a propylene carbonate substituent claim 1 , wherein Ris a propylene carbonate substituent claim 1 , wherein Ris a propylene carbonate substituent claim 1 , wherein Ris a propylene carbonate substituent claim 1 , and wherein Ris a propylene carbonate substituent.8. The flame-retardant sugar derivative of claim 1 , wherein the thioether substituent is ...

SHIELD FOR AN ELECTRONIC DEVICE

Example embodiments relate to a shield for an electronic device. The shield may be shaped to enclose the electronic device. The shield may include a number of traces. Each trace may include an electrically conductive inner portion and an electrically non-conductive outer portion. 1. A shield for providing a security barrier , the shield comprising:a plurality of traces, wherein each trace comprises an electrically conductive inner portion and an electrically non-conductive outer portion,wherein the plurality of traces is generated using three-dimensional printing, andwherein the plurality of traces is arranged such that the shield is shaped to enclose an electronic device.2. The shield of claim 1 , wherein the inner portion comprises conductive plastic.3. The shield of claim 1 , wherein the outer portion comprises non-conductive plastic.4. The shield of claim 1 , wherein the plurality of traces is arranged in a pattern to detect penetration of the shield from a source external to the shield.5. The shield of claim 1 , wherein a resistance of the conductive portion changes in response to contact from a source external to the shield.6. The shield of claim 1 , wherein the plurality of traces defines an air passage in the shield.7. The shield of claim 6 , further comprising a plurality of louvers that extend into the air passage claim 6 , wherein the louvers are generated using three-dimensional printing.8. The shield of claim 1 , wherein the shield is thermally conductive.9. An apparatus for providing a security barrier claim 1 , the apparatus comprising:a shield comprising a plurality of traces, wherein each trace comprises an inner portion and an outer portion, the inner portion comprising conductive plastic and the outer portion comprising non-conductive plastic, and wherein the plurality of traces is arranged such that the shield is shaped to enclose an electronic device, anda metal shell enclosing the shield.10. The apparatus of claim 9 , further comprising ...

STRAIN GAUGE AND SENSOR MODULE

The present strain gauge includes a substrate having flexibility; a resistor formed from a material containing at least one of chromium and nickel, on the substrate; a pair of wiring patterns formed on the substrate and electrically connected to both ends of the resistor; and a pair of electrodes formed on the substrate and electrically connected to the pair of wiring patterns, respectively. The wiring patterns include a first layer extending from the resistor, and a second layer having a lower resistance than the first layer and layered on the first layer. On the substrate, an electronic component mounting area is demarcated, on which an electronic component electrically connected to the electrodes is mounted. 1. A strain gauge comprising:a substrate formed of resin and having flexibility;a resistor formed from a material containing at least one of chromium and nickel, on the substrate;a pair of wiring patterns formed on the substrate and electrically connected to both ends of the resistor, anda pair of electrodes formed on the substrate and electrically connected to the pair of wiring patterns, respectively,wherein the wiring patterns include a first layer extending from the resistor, and a second layer having a lower resistance than the first layer and layered on the first layer, andwherein on the substrate, an electronic component mounting area is demarcated, on which an electronic component electrically connected to the electrodes is mounted.213-. (canceled)14. A strain gauge comprising:a substrate formed of resin and having flexibility;a functional layer formed from a metal, an alloy, or a metal compound, directly on one surface of the substrate;{'sub': '2', 'a resistor formed as a film containing Cr, CrN, and CrN into which an element contained in the functional layer is diffused, on one surface of the functional layer;'}a pair of wiring patterns formed on the one surface of the functional layer and electrically connected to both ends of the resistor; anda ...

TOUCH SENSOR AND MANUFACTURING METHOD THEREOF

A touch sensor including a first substrate which extends in a first direction and on which first channels may be formed and stretched, a first conductive liquid injected into the first channels, a second substrate which extends in a second direction which intersects with the first direction and on which second channels may be formed and stretched, and a second conductive liquid injected into the second channels. 1. A touch sensor comprising:a first stretchable substrate comprising first channels extended in a first direction;a first conductive liquid injected into the first channels;a second stretchable substrate comprising second channels extended in a second direction crossing the first direction; anda second conductive liquid injected into the second channels.2. The touch sensor as claimed in claim 1 , wherein:at least one of the first channels or the second channels comprises straight lines and wedges, and at least one of the wedges comprises a round part;the round part comprises an inner round portion and an outer round portion; and {'br': None, 'i': W≦ROC−', 'W, '0.5×0≦0.63×'}, 'a radius of a curvature of the outer round is expressed in an equation below(where W is at least one width of the straight lines and ROC-O is the radius of the curvature of the outer round portion).3. The touch sensor as claimed in claim 2 , wherein:two adjacent first channels among the first channels comprise a first wedge and a second wedge, respectively;the first wedge and the second wedge are adjacent to each other;at least one of a length in the second direction of the first wedge and the second wedge is greater than or equal to 150 μm and less than or equal to 600 μm; anda distance between the first wedge and the second wedge is greater than or equal to 150 μm and less than or equal to 200 μm.4. The touch sensor as claimed in claim 1 , wherein the touch sensor further comprises:first electrodes inserted into first holes formed at one end of the first channels; andsecond ...

FLEXIBLE HYBRID INTERCONNECT CIRCUITS

Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit. 1a first outer dielectric;a second outer dielectric;an inner dielectric;a first conductive element;a second conductive element, stacked with the first conductive element along the thickness of the flexible hybrid interconnect circuit and between the first outer dielectric and the second outer dielectric.. A flexible hybrid interconnect circuit, having a thickness, the flexible hybrid interconnect circuit comprising: This application is a continuation of U.S. patent application Ser. No. 16/950,155, filed on 2020 Nov. 17, which is a continuation of U.S. patent application Ser. No. 16/850,340, filed on 2020 Apr. 16 and granted as U.S. Pat. No. 10,874,015 on 2020 Dec. 22, which is a continuation of U.S. patent application Ser. No. 16/667,133, filed on 2019 Oct. 29 and granted as U.S. Pat. No. 10,694,618 on 2020 Jun. 23, which claims the benefit under 35 U.S.C. § 119(e) of U.S. Provisional Patent Application No. 62/752,019, filed on 2018 Oct. 29, all of which are incorporated herein by reference in ...

Interconnections Formed with Conductive Traces Applied onto Substrates Having Low Softening Temperatures

A method of connecting a wire to a conductive trace formed on a substrate having a predetermined softening point and the functional layered composite formed therefrom. The method comprises applying a conductive ink onto the substrate; curing, drying, or sintering the conductive ink to form the conductive trace with at least one connection pad; applying an activated rosin-type flux and solder to the connection pad and to one end of a metallic wire; placing the end of the wire in contact with the connection pad; applying a source of heat to the wire; melting the solder material to form an interconnection between the wire and the connection pad; removing the source of heat; and allowing the interconnection to cool before moving the wire. The melting point of the solder is either below the softening point of the substrate or above the softening point by about 20° C. or less. 1. A method of connecting a wire to a conductive trace , the method comprising:applying a conductive ink onto a substrate having a predetermined heat deflection temperature, softening point, or melting point;curing, drying, or sintering the conductive ink to form the conductive trace with at least one connection pad provided at a predetermined location;applying a flux to the connection pad and to one end of a metallic wire;applying a solder material to the connection pad and to one end of the metallic wire; the solder material having a melting point that is either below the heat deflection temperature, softening point, or melting point of the substrate or above the softening point by about 20° C. or less;placing the end of the wire in a location where it makes contact with the connection pad;applying a source of heat to the wire proximate to the location at which the wire contacts the connection pad;melting the solder material to form an interconnection between the wire and the connection pad;removing the source of heat from the interconnection; andallowing the interconnection to cool before moving ...

FLEXIBLE SUBSTRATE AND A METHOD THEREOF

A flexible substrate and a method thereof are provided. The flexible substrate includes a first flexible layer fabricated with at least one conducting path, and configured to sustain an electric power within the conducting path, a second flexible layer fabricated with one or more sensors connected in a form of a matrix, and The second flexible layer configured to generate a signal upon receiving an interaction from at least one user, a third flexible layer fabricated in-between the first flexible layer and the second flexible layer, and configured to insulate the conducting path of the first flexible layer from a matrix connection of the second flexible layer, at least one support structure operatively coupled to the first flexible layer, the second flexible layer and the third flexible layer, and configured to receive the signal generated by the second flexible layer and to provide a support. 110. A flexible substrate () comprising:{'b': 20', '30', '30, 'a first flexible layer () fabricated with at least one conducting path (), and configured to sustain an electric power within the conducting path ();'}{'b': 40', '50', '40, 'a second flexible layer () fabricated with one or more sensors () connected in a form of a matrix, wherein the second flexible layer () is configured to generate a signal upon receiving an interaction from at least one user;'}{'b': 60', '20', '40', '30', '20', '40, 'a third flexible layer () fabricated in-between the first flexible layer () and the second flexible layer (), and configured to insulate the conducting path () of the first flexible layer () from a matrix connection of the second flexible layer ();'}{'b': 70', '20', '40', '60', '70, 'at least one support structure () operatively coupled to the first flexible layer (), the second flexible layer () and the third flexible layer (), wherein the at least one support structure () is configured toreceive the signal generated by the second flexible layer; andprovide a support for the first ...

Low package parasitic inductance using a thru-substrate interposer

An interposer for a chipset includes multilayer thin film capacitors incorporated therein to reduce parasitic inductance in the chipset. Power and ground terminals are laid out in a staggered pattern to cancel magnetic fields between conductive vias to reduce equivalent series inductance (ESL).

ANODE FOR HIGH-ENERGY BATTERIES

Anode comprising an anode material, a protective material and a current collector is provided. The anode material is a mixture comprising an active material, at least one electronically conductive agent and at least one binder. The active material may be an alloy of silicon and lithium or an alloy of silicon oxide and lithium. There is provided a process for the preparation of the anode. Also, there is provided use of the anode in the fabrication of a battery. 145-. (canceled)46. An anode comprising: a metal foil , a film of anode material , and at least one protective film.47. The anode of claim 46 , wherein the metal foil is a copper foil claim 46 , an aluminum foil or an aluminum and carbon foil.48. The anode of claim 46 , wherein the film of anode material is deposited on the metal foil claim 46 , and the at least one protective film is deposited on the anode material.49. The anode of claim 48 , wherein the metal foil is an aluminum foil claim 48 , and in a lithium battery when the anode undergoes a cycle claim 48 , a lithium-aluminum alloy is formed at the interface between the film of anode material and the aluminum foil.50. The anode of claim 46 , wherein the at least one protective film comprises a first protective film and a second protective film claim 46 , wherein the first protective film is deposited on the metal foil claim 46 , the film of anode material is deposited on the first protective film claim 46 , and the second protective film deposited on the film of anode material.51. The anode of claim 46 , wherein the metal foil has a thickness of about 5 to 25 μm.52. The anode of claim 46 , wherein the film of anode material has a thickness of about 5 to 150 μm.53. The anode of claim 46 , wherein the protective film has a thickness of about 1 to 5 μm.54. The anode of claim 46 , wherein the metal foil has a thickness of about 5 to 25 μm claim 46 , wherein the film of anode material has a thickness of about 5 to 150 μm claim 46 , wherein the protective ...

Photosensitive epoxy resin composition for optical waveguide, curable film for formation of optical waveguide, and optical waveguide and optical/electrical transmission hybrid flexible printed wiring board produced by using the photosensitive epoxy resin composition, and optical waveguide production method

The present invention provides a photosensitive epoxy resin composition for an optical waveguide. The photosensitive epoxy resin composition contains: (A) a cresol novolak polyfunctional epoxy resin, the cresol novolak polyfunctional epoxy resin not being fluorene skeleton-containing epoxy resins (C) and (D); (B) a solid bisphenol-A epoxy resin; (C) a solid fluorene skeleton-containing epoxy resin; (D) a liquid fluorene skeleton-containing epoxy resin; and (E) a cationic curing initiator, wherein the components (A) to (E) are each present in a proportion falling within a predetermined range based on the amount of the overall epoxy resin component. Therefore, the photosensitive epoxy resin composition is excellent in coatability, patterning resolution, roll-to-roll process adaptability and the like, and has higher transparency and heat resistance.

Polymer Composition For Laser Direct Structuring

A laser activatable polymer composition is provided. The composition contains at least one laser activatable additive and at least one high naphthenic thermotropic liquid crystalline polymer that contains repeating units derived from naphthenic hydroxycarboxylic and/or dicarboxylic acids in an amount of about 10 mol. % or more. The polymer composition exhibits a dielectric constant of about 5 or less as determined at a frequency of 2 GHz.

ROTARY CONNECTOR

A rotary connector includes a rotor, a stator rotatably assembled on the rotor, a main flexible printed circuit having two side edges that are linear and parallel to each other, and wound and coiled within an annular space part formed between the rotor and the stator, a first sub flexible printed circuit mounted on one end part of the main flexible printed circuit, and connecting a connection terminal provided on the one end part and an external connection terminal provided on the rotor, and a second sub flexible printed circuit mounted on another end part of the main flexible printed circuit, and connecting a connection terminal provided on the other end part and an external connection terminal provided on the stator. 1. A rotary connector comprising:a rotor;a stator rotatably assembled on the rotor;a main flexible printed circuit having two side edges that are linear and parallel to each other, and wound and coiled within an annular space part formed between the rotor and the stator;a first sub flexible printed circuit mounted on one end part of the main flexible printed circuit, and connecting a connection terminal provided on the one end part and an external connection terminal provided on the rotor; anda second sub flexible printed circuit mounted on another end part of the main flexible printed circuit, and connecting a connection terminal provided on the other end part and an external connection terminal provided on the stator.2. The rotary connector as claimed in claim 1 , wherein a plurality of main flexible printed circuits are provided claim 1 , and both end parts of each of the plurality of main flexible printed circuits are mounted on the first sub flexible printed circuit and the second sub flexible printed circuit claim 1 , respectively.3. The rotary connector as claimed in claim 1 , wherein at least one of the first sub flexible printed circuit and the second sub flexible printed circuit is mounted to project in a direction crossing a circumferential ...

STRAP BAND INCLUDING ELECTRODES FOR WEARABLE DEVICES AND FORMATION THEREOF

A strap band including a flexible wire bus having electrodes and wires coupled with the electrodes is described. The wire bus may be include in a strap band formed by molding an inner strap, mounting the wire bus in the inner strap, and injection molding an outer strap over the inner strap and wire bus to form a strap band. The electrodes may be positioned on the inner strap to accommodate a target range of a body portion the strap band may be worn on. A material of the strap band and a material the wire bus may be selected to allow a low coefficient of friction between the wire bus and strap band so that loads applied to the strap band may not be coupled with the wire bus or cause damage to wires due to pull and/or torsional load forces applied to the strap band. 1. A wire bus , comprising:a plurality pads;a plurality of wires, each wire connected with one of the pads;a plurality of electrodes;a plurality of skirts, each skirt having a shot channel,each electrode connected with one of the pads and one of the skirts; anda bus substrate including a plurality of alignment structures and a plurality of shot ports with each shot port aligned with the shot channel of one of the skirts, the skirts and a portion of the electrodes are positioned above a first surface of the bus substrate, and a first portion of the plurality of wires is encapsulated by the bus substrate and a second portion of the plurality of wires is positioned at a distal end of the bus substrate.2. The wire bus of and further comprising:a substrate mounted on the bus substrate, the substrate including an antenna and a near field communication chip coupled with the antenna.3. The wire bus of claim 1 , wherein each wire comprises an insulating outer layer claim 1 , a conductor layer surrounded by the insulating outer layer claim 1 , and a core layer surrounded by the conductor layer.4. The wire bus of claim 1 , wherein each electrode includes an upper surface having a distance above the first surface that ...

FABRIC HAVING MULTIPLE LAYERED CIRCUIT THEREON INTEGRATING WITH ELECTRONIC DEVICES

The present invention provides a fabric having a multiple layered circuit thereon integrating with electronic devices. The fabric comprises: a base layer; a plurality of conductive circuit layers; at least one connecting layer having electrically-conductive via-hole(s) and electrically-insulated area covering the area without the via-hole(s) and electrically connecting two conductive circuit layers through the via-hole(s) but electrically insulating the rest of the two conductive circuit layers; one or more than one electrical devices mounted to the conductive circuit layer and connected to circuits on the conductive circuit layer through anisotropic conductive film (ACF); and a water-proof layer disposed on the conductive circuit layer which is the farthest away from the base layer and covering the electrical device(s). 1. A fabric having a multiple layered circuit thereon integrating with an electronic device , comprising:a base layer;a plurality of conductive circuit layers, formed on the base layer;at least one connecting layer, comprising a plurality of via-holes made of a conductive material and a plurality of electrically insulated regions made of an insulating material and being positioned between any two adjacent conductive circuit layers of the plurality of conductive circuit layers wherein the via-holes electrically connect the two adjacent conductive circuit layers and the electrically insulated regions are distributed in areas other than the via-holes of the connecting layer;at least one electronic device, mounted on and electrically connected to a circuit of the conductive circuit layer through anisotropic conductive film; anda waterproof layer, formed on the conductive circuit layer be farthest away from the base layer;wherein the absolute value of the difference between the thermal expansion coefficient of the material constituting the conductive circuit layer and the thermal expansion coefficient of the insulating material constituting the ...

OPTICAL WAVEGUIDE HAVING ALUMINUM NITRIDE THIN FILM

An optical waveguide is disclosed. In a disclosed embodiment, the optical waveguide includes a first aluminum nitride (AlN) thin film disposed on a layer of high-frequency polymer. A second AlN thin film is embedded in the first AlN thin film. In disclosed embodiments, the nitrogen concentration level of the first AlN thin film is different than the concentration level of the second AlN thin film. 1. An optical waveguide comprising:a first aluminum nitride (AlN) thin film disposed on a layer of high-frequency polymer; anda second AlN thin film embedded in the first AlN thin film;wherein a first nitrogen concentration level of the first AlN thin film is different than a second nitrogen concentration level of the second AlN thin film.2. The AlN substrate of claim 1 , wherein the AlN substrate is at least partially transparent and a first index of refraction of the first AlN thin film is different than a second index of refraction of the second AlN thin film.3. The AlN substrate of claim 2 , wherein the AlN substrate is between 85%-90% transparent for wavelengths between 850 nanometers and 1550 nanometers.4. The AlN substrate of claim 1 , wherein the second AlN thin film is embedded in the first AlN thin film to guide a light beam to propagate through the second AlN thin film.5. The optical waveguide of claim 1 , wherein the first AlN thin film and the second AlN thin film form a trench waveguide.6. The optical waveguide of claim 1 , wherein the second AlN thin film is selectively etched to form one or more of:an etched Bragg grating configured to reflect or transmit an optical signal with a particular wavelength; ordistributed Bragg reflectors that operate as a wavelength division multiplexing (WDM) filter. This application is a divisional application of U.S. application Ser. No. 15/138,116, entitled “ALUMINUM NITRIDE SUBSTRATE WITH GRAPHITE FOIL”, filed Apr. 25, 2016, which is a continuation of U.S. application Ser. No. 14/680,719, which claims the benefit of U.S. ...

FLEXIBLE HYBRID INTERCONNECT CIRCUITS

Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit. 1. A flexible hybrid interconnect circuit , having a thickness , the flexible hybrid interconnect circuit comprising:a first outer dielectric;a second outer dielectric;an inner dielectric;a first conductive element;a second conductive element, stacked with the first conductive element along the thickness of the flexible hybrid interconnect circuit and between the first outer dielectric and the second outer dielectric, wherein at least a portion of the inner dielectric extends between the first conductive element and the second conductive element and support the first conductive element and the second conductive element relative to each other; andan interconnecting via, protruding through the first conductive element and at least the portion of the inner dielectric extending between the first conductive element and the second conductive element, wherein the interconnecting via forms an electrical connection between the first conductive element and the second conductive element.2. The flexible hybrid ...

RESIN COMPOSITION, PREPREG, METAL FOIL WITH RESIN, LAMINATE, PRINTED WIRING BOARD, AND METHOD FOR PRODUCING RESIN COMPOSITION

The present invention relates to a resin composition including an acrylic polymer (A) and a thermosetting resin (B), wherein a phase separation structure of a first phase containing the acrylic polymer (A) and a second phase containing the thermosetting resin (B) is formed, and an average domain size of the second phase is 20 μm or less. 1. A prepreg , which is prepared by impregnating a base material with a resin composition comprising an acrylic polymer (A) and a thermosetting resin (B) , wherein a phase separation structure of a first phase containing the acrylic polymer (A) and a second phase containing the thermosetting resin (B) is formed , and an average domain size of the second phase is 20 μm or less ,wherein in case that ten sheets of the prepreg which were processed into a size of 250 mm×250 mm are superimposed and put into a hermetically sealable bag, which is then charged in a constant-temperature and constant-humidity environment at a temperature of 25° C. and a humidity of 70% for 48 hours, the prepreg arranged in the bottom and the prepreg adjacent thereto are separated from each other.3. The prepreg according to claim 1 , wherein a solubility parameter (SP value) of the acrylic polymer (A) is from 9.0 to 12.0.4. The prepreg according to claim 1 , wherein a weight average molecular weight of the acrylic polymer (A) is from 100 claim 1 ,000 to 1 claim 1 ,500 claim 1 ,000.5. The prepreg according to claim 1 , wherein the content of the acrylic polymer (A) is from 10 to 50 parts by mass based on 100 parts by mass of the total solid content of the resin composition.6. The prepreg according to claim 1 , wherein the thermosetting resin (B) is at least one selected from the group consisting of an epoxy resin claim 1 , a cyanate resin claim 1 , a bismaleimide claim 1 , an addition polymer of a bismaleimide and a diamine claim 1 , a phenol resin claim 1 , a resole resin claim 1 , an isocyanate resin claim 1 , triallyl isocyanurate claim 1 , triallyl cyanurate ...

EMBOSSED SMART FUNCTIONAL PREMIUM NATURAL LEATHER

A smart functional leather assembly includes a leather substrate, an electronic circuit layer including one or more conductive traces and optional electronic elements arranged on the leather substrate, optionally a pigmented coating arranged on the circuit layer, and an optional anti-soiling layer arranged on the pigmented layer. The entire smart functional leather assembly, including the circuit, are embossed to provide an embossed smart functional leather assembly with an embossed pattern. 1. A method of producing an embossed functional leather assembly , comprising: providing a leather substrate comprising a first side and a second side opposite from the first side; and', 'applying an electrically conductive trace over the first side of the leather substrate; and, 'preparing a functional leather assembly includingembossing the functional leather assembly to provide an embossed texture at the first side of the leather substrate.2. The method according to claim 1 , further comprising arranging a pigmented coating over the first side of the leather substrate to thereby cover the trace claim 1 , a first coating applied at a thickness of 20-45 microns;', 'a second coating applied at a thickness of 5-20 micron; and', 'a third coating applied at a thickness of 15-60 microns thick., 'wherein the pigmented coating includes3. The method according to claim 2 , wherein:preparing the functional leather assembly further includes electrically connecting an electronic component to the trace,the electronic component is covered by the pigmented coating, andthe trace and the electronic component are camouflaged by the pigmented coating.4. The method according to claim 3 , wherein:the electronic component includes a light source, andwhen the light source is activated, light emitted by the light source is visible through the pigmented coating.5. The method according to claim 4 , wherein the light source includes a light emitting diode.6. The method according to claim 5 , wherein the ...

Transparent conductive film

A transparent conductive film includes a film base and a polycrystalline layer of indium tin oxide formed on the film base. The polycrystalline layer has a thickness of 10 nm to 30 nm, an average value of gain size of 180 nm to 270 nm, and a carrier density of greater than 6×10 20 /cm 3 and less than or equal to 9×10 20 /cm 3 .

Organic insulating body, metal-clad laminate and wiring board

There is provided an organic insulating body which contains a cyclic olefin copolymer as a main component and a peroxide having a benzene ring, and has such a property that a loss tangent peak appears at 120° C. or higher in a dynamic mechanical analysis.

PRINTED CIRCUIT BOARD

Generally, the present disclosure provides example embodiments relating to a printed circuit board (PCB). In an embodiment, a structure includes a PCB including insulating layers with respective metal layers being disposed therebetween. Each of first layers of the insulating layers includes a first fiberglass content. A second layer of the insulating layers has a second fiberglass content less than the first fiberglass content. For example, in some embodiments, the second insulating layer does not include a fiberglass matrix. 1. A method comprising: coating a second insulating layer on a first insulating layer, the first insulating layer having a first fiberglass content, the first insulating layer on a third insulating layer without an intervening insulating layer between the first insulating layer and the third insulating layer, the third insulating layer including fiberglass and the second insulating layer having a second fiberglass content less than the first fiberglass content; and', 'joining a fourth insulating layer over the second insulating layer, the fourth insulating layer including fiberglass., 'forming a printed circuit board (PCB) comprising2. The method of claim 1 , wherein:each of the first insulating layer, the third insulating layer and the fourth insulating layer is formed of pre-preg; andthe second insulating layer is formed of Ajinomoto Build-up Film (ABF).3. The method of claim 1 , further comprising:depositing a first metal layer on the first insulating layer before coating the second insulating layer on the first insulating layer; anddepositing a second metal layer on the second insulating layer before joining the fourth insulating layer over the second insulating layer.4. The method of claim 3 , wherein the first metal layer includes first metal lines claim 3 , a first spacing and a first pitch being between neighboring pairs of the first metal lines; andthe second metal layer includes second metal lines, a second spacing and a second pitch ...

Flexible wiring circuit board, producing method thereof, and imaging device

A mounted board includes a base insulating layer, a conductive pattern, and a cover insulating layer sequentially toward one side in a thickness direction. The entire lower surface of the base insulating layer is exposed downwardly. A total thickness of the base insulating layer and the cover insulating layer is 16 μm or less. The base insulating layer contains an insulating material having a hygroscopic expansion coefficient of 15×10 −6 /% RH or less.

Epoxy resin blend

An example method to prepare a prepreg is disclosed. In one embodiment, the method includes applying a mixture on a fibrous material and heating the mixture and the fibrous material to a temperature greater than about 225 degrees Celsius during a process of preparing the prepreg. The mixture includes an epoxy compound, a compound having a ring structure, and a crosslinking agent.

METHOD FOR MANUFACTURING RESIN STRUCTURE, AND RESIN STRUCTURE

This method for manufacturing a resin structure () is provided with: a step for arranging a sheet () having a smooth surface () having a maximum height roughness of 3 μm or less, inside a forming mold () such that the smooth surface () faces an internal space () of the forming mold (); a step for molding a resin molded body () to which the sheet () is adhered, by filling the internal space () with a resin; a step for separating the resin molded body () from the sheet (), thereby forming a first region () having a maximum height roughness of 3 μm or less on at least a portion of the surface of the resin molded body (); and a step for using a fluid conductive ink to form a wiring () on the first region (). 1. A method for manufacturing a resin structure comprising:a step for arranging a sheet having a smooth surface having a maximum height roughness Rz of 3 μm or less, inside a forming mold such that the smooth surface faces an internal space of the forming mold;a step for molding a resin molded body to which the sheet is adhered, by filling the internal space with a resin;a step for separating the resin molded body from the sheet, thereby forming a region having a maximum height roughness Rz of 3 μm or less on at least a portion of a surface of the resin molded body; anda step for using a fluid conductive ink to form a wiring on the region.2. A method for manufacturing a resin structure comprising:a step for forming a functional layer on a first smooth surface having a maximum height roughness Rz of 3 μm or less of a sheet having the first smooth surface;a step for arranging the sheet with the functional layer formed thereon inside a forming mold such that the functional layer faces an internal space of the forming mold;a step for molding a resin molded body to which the sheet and the functional layer are adhered, by filling the internal space with a resin;a step for separating the functional layer from the sheet in a state in which the functional layer is adhered to ...

SUBSTRATE, CHIP PACKAGE WITH SAME AND METHOD FOR MANUFACTURING SAME

A substrate includes a base layer, first and second circuit layers both coupled to the base layer, a third circuit layer, a fourth circuit layer and two solder resist layers. The first/second circuit layer defines a first/second opening. The third and fourth circuit layers are located at two sides of the first and second circuit layers. The solder resist layers cover outer faces of the third and fourth circuit layers. Each solder resist layer defines a window. The first opening is deviated from the second opening. The third and fourth circuit layers each have a portion exposed to the window to be a solder pad. The first circuit layer and the third circuit layer have a total thickness no more than that of the second circuit layer and the fourth circuit layer. A chip package with the substrate and a method for manufacturing the substrate are also provided. 1. A substrate of chip package comprising:a base layer;a first circuit layer coupled to a side of the base layer and defining a first opening;a second circuit layer coupled to another side of the base layer opposite to the first circuit layer and defining a second opening;a third circuit layer located at a side of the first circuit layer remote from the base layer and having an outer face;a fourth circuit layer located at a side of the second circuit layer remote from the base layer and having an outer face; andtwo solder resist layers covering the outer face of the third circuit layer and the outer face of the fourth circuit layer, each of the two solder resist layers defining a window;wherein the first opening of the first circuit layer is deviated from the second opening of the second circuit layer, each of the third circuit layer and the fourth circuit layer has a portion thereof exposed to a corresponding window to be a solder pad, and the first circuit layer and the third circuit layer have a total thickness that is no more than a total thickness of the second circuit layer and the fourth circuit layer.2. The ...

PRESSURE SENSING SYSTEM AND SEAT CUSHION HAVING THE PRESSURE SENSING SYSTEM

A pressure sensing system (), seat cushion () incorporating the pressure sensing system, and method of sensing a weight group associated with an occupant of an automotive seat are described. The pressure sensing system includes a layer of an electrically conductive foam () and a flexible printed circuit () that includes a flexible substrate () and N horizontal sensing wires () and M vertical sensing wires () securely placed on a top surface of the flexible substrate. The horizontal sensing wires intersect with the vertical sensing wires and form N×M intersections. The layer of an electrically conductive foam is placed on top of the N horizontal sensing wires and the M vertical sensing wires. When a pressure is applied to the layer of the electrically conductive foam, each intersection generates in real time an electric flux density value to reflect a degree of a compression caused by the pressure to a corresponding point of the electrically conductive foam. 1. A pressure sensing system , comprising: a flexible substrate; and', 'N horizontal sensing wires and M vertical sensing wires securely placed on a top surface of the flexible substrate, wherein the horizontal sensing wires intersect with the vertical sensing wires and form (N×M) intersections; and, 'a flexible printed circuit comprisinga layer of an electrically conductive foam placed on top of the N horizontal sensing wires and the M vertical sensing wires,wherein when a pressure is applied to the layer of the electrically conductive foam, each intersection generates in real time an electric flux density value to reflect a degree of a compression caused by the pressure to a corresponding point of the electrically conductive foam.2. The pressure sensing system of claim 1 , further comprising an electronic control unit for receiving and processing the electric flux density value from each intersection of the flexible printed circuit.3. The pressure sensing system of claim 2 , wherein the electronic control unit ...

Resin composition, prepreg containing same, and laminate board and printed circuit board

The present disclosure provides a resin composition, as well as a prepreg, a laminate and a printed circuit board containing the same. The resin composition comprises 48-54 parts by weight of a halogen-free epoxy resin, 16-31 parts by weight of a compound represented by Formula (I), wherein n is 2-15; Ac represents an acetyl group; and 15-32 parts by weight of a cyanate ester resin. The prepreg, laminate and printed circuit board prepared from the resin composition have a low coefficient of thermal expansion.

FPCB with PCT film and Method for making the FPCB

A first embodiment of the present invention provides a flexible printed circuit board (FPCB) comprising a hot melt adhesive layer and a metal foil layer sequentially stacked on an insulating layer made of a PCT film; a flexible copper clad laminate (FCCL) having a circuit pattern on the metal foil layer; a coverlay adhered to the hot melt adhesive layer formed on the insulating layer made of the PCT film while covering the metal foil layer and also provides a method of manufacturing the FPCB. A second embodiment of the present invention provides an FPCB having a pressure-sensitive adhesive layer instead of the hot-melt adhesive layer, and a method for manufacturing the FPCB having the same, and the third embodiment of the present invention provides an FPCB having a UV cured layer instead of a hot melt adhesive layer, and a method for manufacturing the FPCB having the same. 1. A FPCB comprising:a hot melt adhesive layer and a metal foil sequentially stacked on an insulating layer made of a PCT film;a FCCL having a circuit pattern on the metal foil layer; anda coverlay combining to the hot melt adhesive layer formed on the insulating layer made of the PCT film while covering the metal foil layerwherein a thickness of the insulating layer of the FCCL and the insulating layer of the coverlay is within a range of 45 μm to 55 μm, respectively, and a thickness of the metal foil layer is within a range of 30 μm to 40 μm.2. The FPCB of wherein the PCT film used as the insulating layer of the FCCL and the coverlay is a UV pre-treated PCT film where the PCT film is pre-treated by irradiating a UV ray.3. The FPCB of wherein the UV pre-treated PCT film is pre-treated by irradiating the UV ray having a wavelength in a range of 170 nm to 180 nm.47-. (canceled)8. A FPCB comprising:a pressure-sensitive adhesive layer and a metal foil sequentially stacked on an insulating layer made of a PCT film;a FCCL having a circuit pattern on the metal foil layer; anda coverlay combining to the ...

LIGHT EMITTING DIODE (LED) ASSEMBLY AND FLEXIBLE CIRCUIT BOARD WITH IMPROVED THERMAL CONDUCTIVITY

A flexible circuit board includes an electrically insulating top sheet and an electrically insulating bottom sheet. A plurality of conductive traces is positioned between the electrically insulating top and bottom sheets. A first conductive trace has a first contact pad, and a second conductive trace has a second contact pad. The first and second contact pads are exposed through at least one opening in the electrically insulating top sheet, and each of the first and second contact pads are configured to be connected to an LED. A third contact pad is exposed through openings in the electrically insulating top and bottom sheets, with a top surface of the third contact pad configured to be connected to the LED and a bottom surface of the third contact pad configured to be connected to a heat diffusion device. 1. A flexible circuit board comprising:an electrically insulating top sheet;an electrically insulating bottom sheet;a plurality of conductive traces positioned between the electrically insulating top and bottom sheets, with a first conductive trace having a first contact pad and a second conductive trace having a second contact pad, the first and second contact pad being exposed through at least one opening in the electrically insulating top sheet and each of the first and second contact pads configured to be connected to an LED; anda third contact pad being exposed through openings in the electrically insulating top and bottom sheets, with a top surface of the third contact pad configured to be connected to the LED and a bottom surface of the third contact pad configured to be connected to a heat diffusion device.2. The flexible circuit board of claim 1 , wherein the electrically insulating top sheet and the electrically insulating bottom sheet are both flexible films.3. The flexible circuit board of claim 1 , wherein at least one of the flexible films is a polyimide film.4. The flexible circuit board of claim 1 , wherein each of the first claim 1 , second claim ...

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

A circuit board includes a first metal layer having a first via hole penetrating through an upper surface of the first metal layer and a lower surface thereof; a plated part provided to a surface of the first via hole; an insulating film provided to a surface of the plated part; and a first via formed by providing a conductive material to at least a portion of a region surrounded by an outer surface of the insulating film. Since the circuit board may implement fineness of the first via while forming the first metal layer to be thicker than the related art, warpage may be decreased and heat dissipation performance may be improved. 1. A circuit board comprising:a first metal layer and a first via penetrating through the first metal layer,wherein the first metal layer and the first via have an insulating film and a plated part provided therebetween.2. The circuit board according to claim 1 , wherein the plated part includes a plurality of plated layers.3. A circuit board comprising:a first metal layer having a first via hole penetrating through an upper surface of the first metal layer and a lower surface thereof;a plated part provided to a surface of the first via hole;an insulating film provided to a surface of the plated part; anda first via formed of a conductive material and provided at least a portion of a region surrounded by an outer surface of the insulating film.4. The circuit board according to claim 3 , further comprising a second via hole defined by at least a portion of the outer surface of the insulating film has a shape corresponding to that of the first via hole and has a diameter smaller than that of the first via hole.5. The circuit board according to claim 4 , wherein the plated part includes a plurality of plated layers.6. The circuit board according to claim 5 , wherein each of the plurality of plated layers is formed by one plating process.7. The circuit board according to claim 6 , wherein the plating process is performed in a flash plating ...

MANUFACTURING METHOD OF COMPOSITE SUBSTRATE

A manufacturing method of a composite substrate is provided. A first conductive layer is formed on a first liquid crystal polymer layer. The first conductive layer is patterned to form a patterned first conductive layer. A second liquid crystal polymer layer including a soluble liquid crystal polymer is formed to cover the patterned first conductive layer. The second liquid crystal polymer layer which is on the patterned first conductive layer is removed. 1. A manufacturing method of a composite substrate , comprising:forming a first conductive layer on a first liquid crystal polymer layer;patterning the first conductive layer to form a patterned first conductive layer;forming a second liquid crystal polymer layer comprising a soluble liquid crystal polymer to cover the patterned first conductive layer; andremoving the second liquid crystal polymer layer which is on the patterned first conductive layer.2. The manufacturing method of claim 1 , wherein forming the second liquid crystal polymer layer to cover the patterned first conductive layer comprises:coating a mixture comprising the soluble liquid crystal polymer and a solvent on the first liquid crystal polymer layer; andremoving the solvent to form the second liquid crystal polymer layer.3. The manufacturing method of claim 1 , wherein the soluble liquid crystal polymer comprises a repeating unit represented by a formula shown below:{'br': None, '\ue8a0Y—Ar—X—Ar—Z\ue8a0,'}wherein Ar is 1,4-phenylene, 1,3-phenylene, 2,6-naphthalene, or 4,4′-biphenylene; Y is —O— or —NH—; Z is —C═O—; and X is amino group, carboxamido group, imido/imino group, amidino group, aminocarbonylamino group, aminothiocarbonyl group, aminocarbonyloxy group, aminosulfonyl group, aminosulfonyloxy group, aminosulfonylamino group, carboxyl ester group, (carboxyl ester)amino group, (alkoxycarbonyl)oxy group, alkoxycarbonyl group, hydroxyamino group, alkoxyamino group, cyanato group, isocyanato group, or a combination thereof.4. The manufacturing ...

MANUFACTURING METHOD AND STRUCTURE OF CIRCUIT BOARD WITH VERY FINE CONDUCTIVE CIRCUIT LINES

A circuit board manufacturing method includes the steps of providing a conductive motherboard; forming a masking layer on the conductive motherboard, and the masking layer having a plurality of recessed portions that form a predetermined circuit pattern; forming a conductive electrode in each recessed portion, and the conductive electrodes together forming a conductive layer; providing a substrate having an adhesive layer provided thereon for sticking to a top of the masking layer and the conductive layer; and separating the substrate, the adhesive layer and the conductive layer from the conductive motherboard and the masking layer to provide a circuit board. The conductive motherboard is repeatedly usable and presents the predetermined circuit pattern through electroforming process, and the circuit pattern can be transferred to the substrate. The whole circuit board manufacturing process is simplified while ensures largely upgraded yield rate of very fine conductive circuit lines on the circuit board. 1. A manufacturing method of circuit board with very fine conductive circuit lines , comprising the following steps:providing a conductive motherboard;forming a masking layer on the conductive motherboard, and the masking layer being provided with a plurality of recessed portions that form a predetermined circuit pattern;forming a conductive electrode in each of the recessed portions on the masking layer, and the conductive electrodes being very fine conductive circuit lines that together form a conductive layer;providing a substrate, on one side of which an adhesive layer is provided for sticking to a top of the masking layer and the conductive layer; andseparating the substrate, the adhesive layer and the conductive layer from the masking layer and the conductive motherboard to provide a circuit board.2. The manufacturing method of circuit board with very fine conductive circuit lines as claimed in claim 1 , wherein the conductive motherboard is subjected to a ...

HYDROGEL NETWORK

The invention provides a hydrogel network comprising a plurality of hydrogel objects, wherein each of said hydrogel objects comprises: a hydrogel body, and an outer layer of amphipathic molecules, on at least part of the surface of the hydrogel body, wherein each of said hydrogel objects contacts another of said hydrogel objects to form an interface between the contacting hydrogel objects. A process for producing the hydrogel networks is also provided. The invention also provides an electrochemical circuit and a hydrogel component for mechanical devices comprising a hydrogel network. Various uses of the hydrogel network are also described, including their use in synthetic biology and as components in electrochemical circuits and mechanical devices. 1. An electrochemical circuit comprising a hydrogel network , wherein the hydrogel network comprises a plurality of hydrogel objects , wherein each of said hydrogel objects comprises:a hydrogel body,wherein each of said hydrogel objects contacts another of said hydrogel objects to form an interface between the contacting hydrogel objects.2. An electrochemical circuit according to wherein each of the hydrogel objects comprises:(a) said hydrogel body, and(b) an outer layer of amphipathic molecules, on at least part of the surface of the hydrogel body.3. An electrochemical circuit according to wherein (a) a hydrogel body, and', '(b) an outer layer of amphipathic molecules, on at least part of the surface of the hydrogel body,, 'said plurality of hydrogel objects comprises a first hydrogel object and a second hydrogel object, wherein each of the first and second hydrogel objects compriseswherein the first hydrogel object contacts the second hydrogel object to form said interface between the first and second objects.4. An electrochemical circuit according to wherein the interface between the first and second objects comprises a bilayer of amphipathic molecules.5. An electrochemical circuit according to wherein the hydrogel ...

CURVED TYPE RIGID BOARD AND METHOD FOR MANUFACTURING THREE-DIMENSIONAL ANTENNA BY USING THE SAME

Provided is a curved-type rigid board. The curved-type rigid board includes: a main sheet layer capable of maintaining a curved state with a certain curvature; a first adhesive layer formed on the main sheet layer; and a pattern forming layer bonded onto the main sheet layer by the first adhesive layer. 117.-. (canceled)18. A curved-type rigid board comprising:a main sheet layer capable of maintaining a curved state with a certain curvature;a first adhesive layer formed on the main sheet layer; anda pattern forming layer bonded onto the main sheet layer by the first adhesive layer.19. The curved-type rigid board of claim 18 , wherein the pattern forming layer is formed on one or both surfaces of the main sheet layer through the first adhesive layer.20. The curved-type rigid board of claim 18 , wherein the main sheet layer is made of a thermosetting resin with a mesh structure to be processed from a semi-cured state to a fully-cured state in order to have rigidity sufficient to maintain a curved state with a certain curvature.21. The curved-type rigid board of claim 20 , wherein the thermosetting resin is a prepreg.22. The curved-type rigid board of claim 18 , wherein the main sheet layer has a surface on which a coating process is performed by a curable paint being applied in order to have rigidity sufficient to maintain a curved state with a certain curvature.23. The curved-type rigid board of claim 18 , wherein the pattern forming layer is a metal foil sheet.24. The curved-type rigid board of claim 18 , wherein the first adhesive layer is a low-temperature bonding sheet or a liquid adhesive.25. A curved-type rigid board comprising:a main sheet layer capable of maintaining a curved state with a certain curvature;a first adhesive layer formed on the main sheet layer;a sub sheet layer bonded onto the main sheet layer by the first adhesive layer;a second adhesive layer formed on the sub sheet layer; anda pattern forming layer bonded onto the sub sheet layer by the ...

PREGREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATE, AND PRINTED WIRING BOARD

The present invention provides the prepreg being formed by impregnating a fiber base material with a resin composition and the resin composition comprising an acrylic resin, wherein the ratio of the peak height near 2240 cmdue to nitrile groups (P) with respect to the peak height near 1730 cmdue to carbonyl groups (P) in the IR spectrum of the cured resin composition (P/P) is no greater than 0.001 and the like in order to provide a prepreg, a film with a resin, a metal foil with a resin and a metal-clad laminate, which exhibit excellent bending resistance while also prevent ion migration and have excellent insulating reliability when printed wiring boards are fabricated, as well as a printed wiring board employing the same. 2. The printed wiring board according to claim 1 , wherein the acrylic resin is one employing a methacrylic acid ester or acrylic acid ester having a C5-10 cycloalkyl group in the ester portion claim 1 , as the compound represented by formula (1).3. The printed wiring board according to claim 1 , wherein the C5-10 cycloalkyl group contains at least one group selected from the group consisting of cyclohexyl claim 1 , norbornyl claim 1 , tricyclodecanyl claim 1 , isobornyl and adamantyl.4. The printed wiring board according to claim 1 , wherein the weight-average molecular weight (Mw) of the acrylic resin is 50 claim 1 ,000-1 claim 1 ,500 claim 1 ,000.5. The printed wiring board according to claim 1 , wherein the third monomer comprises at least one of an alkoxyalkyl acrylate claim 1 , an alkoxyalkyl methacrylate claim 1 , an acrylic acid ester claim 1 , a methacrylic acid ester claim 1 , an aromatic vinyl compound or a N-substituted maleimide.7. The printed wiring board according to claim 6 , wherein the acrylic resin is one employing a methacrylic acid ester or acrylic acid ester having a C5-10 cycloalkyl group in the ester portion claim 6 , as the compound represented by formula (1).8. The printed wiring board according to claim 7 , wherein the ...

PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, AND METHOD FOR PRODUCING PRINTED WIRING BOARD

The present invention relates to provision of a photosensitive resin composition containing (A) a photopolymerizable compound having an ethylenically unsaturated group and an acidic substituent, and (B) a photopolymerization initiator, wherein at least one of the components contained in the photosensitive resin composition is a component including a dicyclopentadiene structure; a photosensitive resin film using the foregoing photosensitive resin composition; a printed wiring board and a method for producing the same; and a semiconductor package. 1. A photosensitive resin composition comprising(A) a photopolymerizable compound having an ethylenically unsaturated group and an acidic substituent, and(B) a photopolymerization initiator, whereinat least one of the components contained in the photosensitive resin composition is a component including a dicyclopentadiene structure.3. The photosensitive resin composition according to claim 1 , wherein a total mass of the dicyclopentadiene structure contained in the photosensitive resin composition is 5% by mass or more on the basis of the whole amount of the solid components of the components contained in the photosensitive resin composition.4. The photosensitive resin composition according to claim 1 , wherein the photopolymerizable compound having an ethylenically unsaturated group and an acidic substituent is an acid-modified ethylenically unsaturated group-containing epoxy derivative obtained by allowing (A′) a resin that is obtained through a reaction of (a) an epoxy resin and (b) an ethylenically unsaturated group-containing organic acid claim 1 , to react with (c) a saturated group or unsaturated group-containing polybasic acid anhydride.5. The photosensitive resin composition according to claim 1 , wherein the photopolymerizable compound (A) having an ethylenically unsaturated group and an acidic substituent is one including a dicyclopentadiene structure.6. The photosensitive resin composition according to claim 4 , ...

ELECTRONIC COMPONENT AND BOARD HAVING ELECTRONIC COMPONENT MOUNTED THEREON

An electronic component includes a body including a dielectric material and internal electrodes embedded in the dielectric material; external electrodes connected to the internal electrodes and disposed on the body; a first substrate connected to the external electrodes and disposed on one side of the body; and a second substrate connected to the first substrate and disposed on one side of the first substrate. The first and second substrates have different Young's modulus. 1. An electronic component comprising:a body including a dielectric material and internal electrodes embedded in the dielectric material;external electrodes connected to the internal electrodes and disposed on the body;a first substrate connected to the external electrodes and disposed on one side of the body; anda second substrate connected to the first substrate and disposed on one side of the first substrate,wherein the first and second substrates have different Young's modulus.2. The electronic component of claim 1 , wherein the first substrate has a higher Young's modulus than that of the second substrate.3. The electronic component of claim 2 , wherein the first substrate suppresses vibrations of the body claim 2 , and the second substrate absorbs vibrations transferred from the first substrate.4. The electronic component of claim 1 , wherein the first substrate has a lower Young's modulus than that of the second substrate.5. The electronic component of claim 4 , wherein the first substrate converts a displacement of the body into a wave form claim 4 , andthe second substrate suppresses waves transferred from the first substrate.6. The electronic component of claim 1 , wherein the body claim 1 , the first substrate claim 1 , and the second substrate are disposed sequentially.7. The electronic component of claim 1 , wherein one of the first and second substrates has a Young's modulus of 200 GPa to 400 GPa claim 1 , andthe other of the first and second substrates has a Young's modulus of 3 GPa ...

POLYMER COMPOSITION, AN ARTICLE THEREOF AND A PROCESS FOR PREPARING THE SAME

Present application discloses a thermoplastic composition comprising a) 42.5 wt. % to 94 wt. % of thermoplastic matrix resin; b) 1 wt. % to 7.5 wt. % of a laser direct structuring additive; and c) 5 wt. % to 50 wt. % fibrous reinforcement agent; wherein the wt. % is relative to the total weight of the composition; wherein the laser direct structuring additive is represented by formula ZnNiFeO, wherein the x is higher than 0.60 and lower than 0.85; wherein the composition is capable of being plated after being activated using a laser. 1. A thermoplastic composition comprising:a) 42.5 wt. % to 94 wt. % of thermoplastic matrix resin;b) 1 wt. % to 7.5 wt. % of a laser direct structuring additive; andc) 5 wt. % to 50 wt. % fibrous reinforcement agent;wherein the wt. % is relative to the total weight of the composition;{'sub': x', '(1-x)', '2', '4, 'wherein the laser direct structuring additive is represented by formula ZnNiFeO, wherein the x is higher than 0.60 and lower than 0.85; wherein the compositions is capable of being plated after being activated using a laser.'}2. A thermoplastic composition according to claim 1 , wherein x is in the range of 0.65 0.80.3. A thermoplastic composition according to claim 2 , wherein x is in the range of 0.70-0.75; preferably 0.75 A thermoplastic composition claim 2 , wherein the laser direct structuring additive is present in an amount which ranges from 2.5 wt. % to 6 wt. % claim 2 , preferably from 3 wt. % to 5 wt. % claim 2 , more preferably 5wt. %.4. A thermoplastic composition according to claim 1 , wherein the reinforcement agent is one or more selected from glass fiber claim 1 , carbon fiber claim 1 , basalt fiber and aramid fiber; preferably claim 1 , the reinforcement agent is glass fiber.5. A thermoplastic composition according to claim 1 , wherein the fibrous reinforcement agent is present in an amount from 10 wt. % to 50 wt. %; preferably from 15 wt. % to 35 wt. % claim 1 , more preferably from 20 wt. % to 30 wt. %.6. A ...

RESIN COMPOSITION, AND TRANSPARENT MEMBRANE FOR TOUCH PANEL SENSORS AND TOUCH PANEL USING SAME

The present invention has a main purpose of providing a resin composition capable of forming a resin film excellent in hardness and heat resistance. To achieve the purpose described above, the present invention provides a resin composition, comprising: a developable polysiloxane containing a developable group and substantially no radically polymerizable group; a polymerizable polysiloxane containing a radically polymerizable group and substantially no developable group; and a polyfunctional monomer. 1. A resin composition , comprising:a developable polysiloxane containing a developable group and substantially no radically polymerizable group;a polymerizable polysiloxane containing a radically polymerizable group and substantially no developable group; anda polyfunctional monomer.2. The resin composition according to claim 1 , wherein the polyfunctional monomer is a compound having a triazine ring skeleton.3. The rein composition according to claim 1 , wherein the resin composition has a phosphate compound.4. The resin composition according to claim 1 , wherein the resin composition has a refractive index enhancement agent.5. A transparent membrane for a touch panel claim 1 , wherein the transparent membrane for a touch panel is formed using a resin composition claim 1 , andthe resin composition has a developable polysiloxane containing a developable group and substantially no radically polymerizable group,a polymerizable polysiloxane containing a radically polymerizable group and substantially no developable group, anda polyfunctional monomer.6. A touch panel claim 1 , comprising:a transparent substrate; anda sensor electrode formed on the transparent substrate, whereinthe touch panel has a transparent membrane for a touch panel formed using a resin composition, andthe resin composition has a developable polysilozane containing a developable group and substantially no radicaly polymerizable group,a polymerizable polysiloxane containing a radically polymerizable ...

LENGTH- AND WIDTH-DEFORMABLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

A length- and width-deformable printed circuit board includes a first conductive circuit layer, an elastic film, and a plurality of conductive via holes. The first conductive circuit layer includes a plurality of first conductive circuits. The plurality of first conductive circuits is embedded in the elastic film. The first conductive circuit layer have a plurality of first honeycomb hole. Each of the plurality of conductive via holes corresponds to one of the first honeycomb holes. 1. A length- and width-deformable printed circuit board comprising:a first conductive circuit layer, the first conductive circuit layer comprising a plurality of first conductive circuits, the first conductive circuits having a plurality of first honeycomb holes;an elastic film; anda plurality of conductive via holes embedded in the elastic film;wherein the plurality of first conductive circuits is embedded in the elastic film, each of the plurality of conductive via holes corresponds to one of the first honeycomb holes.2. The length- and width-deformable printed circuit board of claim 1 , further comprising a second conductive circuit layer claim 1 , wherein the second conductive circuit layer faces away from the first conductive circuit layer claim 1 , the second conductive circuit layer comprises a plurality of second conductive circuits claim 1 , the second conductive circuits form a plurality of second honeycomb holes claim 1 , each of the second honeycomb holes corresponds to each of the first honeycomb holes.3. The length- and width-deformable printed circuit board of claim 2 , wherein each of the conductive via holes is electrically connected to one of the first conductive circuits and one corresponding second conductive circuits.4. The length- and width-deformable printed circuit board of claim 2 , wherein the second conductive circuit layer is embedded in the elastic film.5. The length- and width-deformable printed circuit board of claim 2 , wherein the elastic film comprises ...

METHOD AND APPARATUS FOR QUANTIFYING DEFECTS DUE TO THROUGH SILICON VIAs IN INTEGRATED CIRCUITS

A device and method to control the heating of an IC chip in a wafer form for measuring various parameters associated therewith are provided. Embodiments include a device having a silicon layer with an upper surface, and on a plastic carrier; a plurality of devices in the silicon layer and electrically coupled through the upper surface to a test control system; a through silicon via (TSV) extending into the silicon layer; and a parallel heating structure adjacent to the plurality of devices electrically coupled to the test control system. 1. A device comprising:a silicon layer having an upper surface, and on a plastic carrier;a plurality of devices in the silicon layer and electrically coupled through the upper surface to a test control system;a through silicon via (TSV) extending into the silicon layer; anda plurality of parallel heating structures, each one of the plurality of heating structures adjacent to one of the plurality of devices electrically coupled to the test control system.2. The device according to claim 1 , wherein the parallel heating structure comprises a plurality of heating elements arranged in parallel.3. The device according to claim 2 , wherein the heating elements are formed in a metal layer of a plurality of metal layers over the silicon layer.4. The device according to claim 1 , further comprises:a plurality of control elements each electrically coupled to a different one of the devices and to the test control system.5. The device according to claim 1 , wherein the test control system comprises:a multiplexing controller unit; anda plurality of voltage and current sources.6. The device according to claim 1 , wherein the test control system is capable of measuring current transfer through each of the plurality of devices.7. The device according to claim 1 , wherein the test control system is capable of varying a temperature level at each of the plurality of heating elements.8. The device according to claim 1 , wherein the plurality of devices ...

Method of manufacturing circuit board, method of manufacturing electronic device, and electronic device

A method of manufacturing a circuit board includes forming a first electrode on a support substrate, covering the support substrate and the first electrode with a first insulating layer, polishing the first insulating layer to expose a first surface of the first electrode, forming a first wiring on the first insulating layer after exposing the first surface of the first electrode, the first wiring being connected to the first electrode, and removing the support substrate to expose a second surface of the first electrode after forming the first wiring.

CURABLE RESIN COMPOSITION, MOLDED CURABLE-RESIN OBJECT, CURED OBJECT, LAYERED PRODUCT, COMPOSITE, AND MULTILAYERED PRINTED WIRING BOARD

The purpose of the present invention is to provide a curable resin composition capable of forming a cured object having excellent adhesiveness to conductor layers. The curable resin composition according to the present invention composes an epoxy compound (A), a triazole compound (B), and a tertiary amine compound (C) represented by the following formula (I). In formula (I), Rand R each independently represent —(RO)H (wherein, Rrepresents a Calkylene group and n is an integer of 1-3). 3. The curable resin composition according to claim 1 , wherein the proportion of the content of the tertiary amine compound in the total of the content of the triazole compound (B) and the content of the tertiary amine compound (C) is 20 mass % to 80 mass %.4. The curable resin composition according to claim 1 , further comprising an active ester compound.5. The curable resin composition according to claim 1 , further comprising a polyphenyiene ether compound.8. The cured object according to claim 7 , wherein the dielectric loss tangent at a frequency of 5 GHz is 0.010 or less. The present invention relates to a curable resin composition, molded curable resin object, cured object, layered product, composite, and multilayered printed wiring board.Recently, in pursuit of the miniaturization, multifunctionality, and increasing communication speed of electronic equipment, etc., a higher density printed substrate used for semiconductor elements in electronic equipment, etc. has been in demand. In order to meet such a demand, a printed substrate (hereinafter, referred to as a “multilayered printed wiring board”) having a multilayered structure is used. Additionally, such a multilayered printed wiring board is, for example, formed by layering an electrical insulating layer on an inner layer substrate (including a core substrate obtained by forming an electrical insulating layer on both surfaces of a base material, as well as a conductor layer (wiring layer) formed on the surface of the core ...

Component Carrier With Exposed Layer

A component carrier includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, and a partially exposed layer in a central region of the stack being exposed with regard to an upper side and a lower side by a respective blind hole formed in the stack, wherein each of opposing main surfaces of the exposed layer is partially covered by a respective adhesive layer. 1. A component carrier , comprising:a stack comprising at least one electrically conductive layer structure and/or at least one electrically insulating layer structure; anda partially exposed layer in a central region of the stack being exposed with regard to an upper side and a lower side by a respective blind hole formed in the stack;wherein each of opposing main surfaces of the exposed layer is partially covered by a respective adhesive layer.2. The component carrier according to claim 1 , wherein the component carrier is configured as sensor claim 1 , in particular one of a microphone claim 1 , a pressure sensor claim 1 , an acceleration sensor claim 1 , and a gas sensor claim 1 , as an actuator claim 1 , in particular a loudspeaker claim 1 , and as a microelectromechanical system.3. The component carrier according to claim 1 , comprising at least one of the following features:wherein the exposed layer forms a functional diaphragm in the blind holes;wherein the exposed layer comprises or consists of an elastic material, for example polyimide;wherein the exposed layer is a single material layer;wherein the exposed layer comprises sub-structures of different materials;wherein a thickness of the exposed layer is in a range between 1 μm and 30 μm, in particular in a range between 3 μm and 7 μm;wherein a lateral offset between a center of an outermost portion of the first blind hole and a center of an outermost portion of the second blind hole is less than 20 μm, in particular not more than 15 μm;wherein a lateral offset between ...

Application specific electronics packaging systems, methods and devices

Depicted embodiments are directed to an Application Specific Electronics Packaging (“ASEP”) system, which enables the manufacture of additional products using reel to reel (68a, 68b) manufacturing processes as opposed to the “batch” processes used to currently manufacture electronic products and MIDs. Through certain ASEP embodiments, it is possible to integrate connectors, sensors, LEDs, thermal management, antennas, RFID devices, microprocessors, memory, impedance control, and multi-layer functionality directly into a product.

ALIPHATIC POLYCARBONATE RESIN FOR FORMING PARTITION, PARTITION MATERIAL, SUBSTRATE AND PRODUCTION METHOD THEREFOR, PRODUCTION METHOD FOR WIRING SUBSTRATE, AND WIRING FORMING METHOD

An aliphatic polycarbonate resin for forming a partition containing a constituent unit represented by the formula (1): 2. The aliphatic polycarbonate resin according to claim 1 , wherein the constituent unit represented by the formula (1) is contained in an amount of 5 mass % or more based on the total mass of all constituent units.4. A partition material comprising the aliphatic polycarbonate resin according to .5. A substrate having a partition made of the aliphatic polycarbonate resin according to .6. A method for producing the substrate according to claim 5 , the method comprising providing a coating film of a partition material comprising the aliphatic polycarbonate resin to form a partition.7. A method for producing a wiring substrate using the substrate according to claim 5 , the method comprising providing a wiring material on the substrate to form wiring.8. The method for producing a wiring substrate according to claim 7 , the method comprising forming a groove in the substrate claim 7 , and providing a wiring material in the groove to form wiring.9. A wiring forming method comprising forming wiring using the partition material according to . The present invention relates to an aliphatic polycarbonate resin for forming partitions, a partition material, a substrate and a method for producing the same, a method for producing a wiring substrate, and a wiring forming method.Aliphatic polycarbonate resins synthesized from raw materials containing carbon dioxide and epoxy compounds have been actively studied in recent years in terms of recycling carbon dioxide, and various applications thereof have been found. Since aliphatic polycarbonate resins have characteristically low thermal decomposition temperatures, their application to ceramic binders and metal ink by taking advantage of this characteristic has been examined (e.g., PTL 1 and PTL 2). Moreover, because aliphatic polycarbonate resins can be easily removed by heating or short-wavelength light (e.g., ...

Epoxy resin composition

[Abstract] An epoxy resin composition having an excellent balance among the shrinkage rate during cure-molding, heat resistance of the cured product, and the thermoelastic modulus of the cured product, is provided. More specifically, provided is an epoxy resin composition including a naphthalene-type epoxy compound and a curing agent for an epoxy resin, the naphthalene-type epoxy compound having: a naphthalene ring; at least one group (A) which is directly bonded to the naphthalene ring and selected from the group consisting of an allyl group and a glycidyl group; and at least one group (B) which is directly bonded to the naphthalene ring and selected from the group consisting of an allyloxy group and a glycidyloxy group, with the proviso that the compound has at least one of the allyl group and the allyloxy group and at least one of the glycidyl group and the glycidyloxy group.

COVALENTLY-BOUND POLYBROMOCYCLODODECANE FLAME RETARDANTS

A polybrominated flame-retardant compound, a process for forming a flame-retardant material, and an article of manufacture are disclosed. The polybrominated flame-retardant compound includes a cyclododecane moiety, at least two bromo groups, and at least one substituent having a reactive functional group. The process includes forming a polybromocyclododecane (PBCD) compound having at least one reactive functional group and incorporating the PBCD compound into a polymer in a process that includes covalent binding of the PBCD compound. The article of manufacture includes a flame-retardant material that comprises a polymer with a covalently-bound PBCD compound. 1. A polybrominated flame-retardant compound , comprising:a cyclododecane moiety;at least two bromo groups; andat least one substituent having a reactive functional group.2. The brominated flame-retardant compound of claim 1 , wherein the at least two bromo groups are bound to the cyclododecane moiety.3. The brominated flame-retardant compound of claim 1 , wherein at least one of the at least two bromo groups is bound to the at least one substituent.4. The brominated flame-retardant compound of claim 1 , wherein the at least one substituent includes an allyl group.5. The brominated flame-retardant compound of claim 1 , wherein the at least one substituent includes a thioether linker.6. The brominated flame-retardant compound of claim 1 , wherein the at least one substituent includes a benzyl moiety.7. The brominated flame-retardant compound of claim 1 , wherein the at least one substituent is linked to the cyclododecadiene moiety by an oxygen atom linker or an ester linker.8. The brominated flame-retardant compound of claim 1 , wherein the reactive functional group is selected from a group consisting of a hydroxyl group claim 1 , an epoxide group claim 1 , a vinyl group claim 1 , an acryloyl group claim 1 , a methacryloyl group claim 1 , a propylene carbonate group claim 1 , an oxalate group claim 1 , a ...

FLEXIBLE PRINTED CIRCUIT BOARD

A flexible printed circuit board (PCB) has stretchability and durability. The flexible PCB includes: a first polymer substrate having flexibility, stretchability, or elasticity; a second polymer substrate having flexibility, stretchability, or elasticity; a conductive track disposed between the first and second polymer substrates and including metal nanowires; and a cured silane coupling agent which bonds the conductive track to at least one of the first and second polymer substrates. 1. A flexible printed circuit board (PCB) comprising:a first polymer substrate having at least one of flexibility, stretchability, and elasticity;a second polymer substrate having at least one of flexibility, stretchability, and elasticity;a conductive track comprising metal nanowires disposed between the first polymer substrate and the second polymer substrate; anda cured silane coupling agent configured to bond the conductive track to at least one of the first polymer substrate and the second polymer substrate.2. The flexible PCB of claim 1 , wherein the first polymer substrate and the second polymer substrate each have a thickness in a range of about 10 μm to about 3 claim 1 ,000 μm.3. The flexible PCB of claim 1 , wherein the first polymer substrate and the second polymer substrate each comprise at least one of a polydimethylsiloxane (PDMS)-based resin claim 1 , a polyimide (PI)-based resin claim 1 , a polyamide-based resin claim 1 , a polyester-based resin claim 1 , a polyethylene-based resin claim 1 , a polypropylene-based resin claim 1 , a polyurethane-based resin claim 1 , and a polycarbonate-based resin.4. The flexible PCB of claim 1 , wherein the first polymer substrate and the second polymer substrate comprise a PDMS-based resin.5. The flexible PCB of claim 1 , wherein the metal nanowires have an average aspect ratio in a range of about 20 to about 300.6. The flexible PCB of claim 1 , wherein the metal nanowires have an average diameter in a range of about 1 nm to about 500 ...

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

A printed circuit board includes a core part including a glass plate and resin layers disposed on an upper surface and a lower surface of the glass plate, and a wiring layer disposed on at least one of an upper portion and a lower portion of the core part. The core part includes a groove part penetrating from the upper surface to the lower surface of the glass plate while being spaced apart from a side surface of the core part by a predetermined distance. 1. A printed circuit board comprising:a core part comprising a glass core and a resin layer disposed on an upper surface and a lower surface of the glass core; anda wiring layer disposed on the core part,wherein a groove part is formed in the glass core, the groove part penetrating the glass core between one surface and the other surface of the glass core.2. The printed circuit board of claim 1 , wherein the glass core is separated into an inner portion thereof and an outer portion thereof by the groove part.3. The printed circuit board of claim 1 , wherein the groove part is formed along a side surface of the core part.4. The printed circuit board of claim 1 , wherein the groove part is continuously formed.5. The printed circuit board of claim 1 , wherein the groove part is filled with a resin.6. The printed circuit board of claim 5 , wherein the resin filling the groove part is integrated with a resin forming the resin layer.7. The printed circuit board of claim 1 , wherein a side surface of the glass core is exposed to an outside.8. The printed circuit board of claim 1 , further comprising an internal circuit layer disposed on the glass core.9. The printed circuit board of claim 8 , further comprising an adhesive layer interposed between the glass core and the internal circuit layera protection layer disposed between the glass plate and the via.10. The printed circuit board of claim 1 , further comprising:a via penetrating through the glass core; andinterposed between the glass core and the via.11. A method of ...