Circuit materials with improved bond, method of manufacture thereof, and articles formed therefrom

Circuit materials with improved bond, method of manufacture thereof, and articles formed therefrom

MODIFIED SEAM FELT

The invention provides a press felt seam comprising a first felt end and a second felt end interconnected by hinge means wherein the soft cover layer on the first felt end is configured to provide a flap element overlaying said hinge means, and the soft cover layer on the second end is configured to support said flap. The surface of said flap contiguous the hinge means is provided with a resilient support material to impart to the seam area a compression recovered thickness substantially equal to or slightly greater than the rest of the felt.

Modified Seam Felt

Methods for predicting esophageal adenocarcinoma (EAC)

A circuit subassembly, comprising: a conductive layer, a dielectric layer formed from a thermosetting composition, wherein the thermosetting composition comprisses, based on the total weight of the thermosetting composition a polybutadiene or polyiseoprene resin, about 30 to about 70 percent by weight of a magnesium hydroxide having less than about 1000 ppm of ionic contaminants, and about 5 to about 15 percent by weight of a nitrogen-containing compound, wherein the nitrogen-containing compound comprises at least about 15 weight percent of nitrogen; and an adhesive layer disposed between and in intimate contact with the conductive layer and the dielectric layer, whereinthe adhesive comprises a poly(arylene ether), wherein the circuit subassembly has a UL-94 rating of at least V-1.

BIAXIALLY ORIENTED ORDERED POLYMER FILMS

BIAXIALLY ORIENTED ORDERED POLYMER FILMS

BIAXIALLY ORIENTED ORDERED POLYMER FILMS This invention relates in general to the formation of multiaxially (e.g., biaxially) oriented films from high molecular weight lyotropic or thermotropic polymers (homopolymers, copolymers, and the like), wherein due to the processing conditions employed, the films have a controlled molecular orientation. The films of the present invention are preferably prepared from rod-like extended-chain, aromatic- heterocyclic polymers. These polymers generally fall into two classes; first, those that are modified in solution form, i.e., lyotropic liquid crystalline polymers; and second, those that are modified by temperature changes, i.e., thermotropic liquid crystalline polymers. For a shorthand expression covering both types of polymers, the present disclosure will use the term "ordered polymers." ...

BIAXIALLY ORIENTED ORDERED POLYMER FILMS

ABSTRACT OF THE DISCLOSURE This invention relates in general to the formation of thick films having a biaxial molecular orientation. Such films are prepared in accordance with the present invention from rod-like extended chain aromatic-heterocyclic ordered polymers. Such films have high tensile strength, modulus, and environmental resistance characteristics. A preferred ordered polymer for use in the present invention is poly (para - phenylenebenzo bisthiazole), (PBT), a compound having the structure:

Circuit materials, circuits laminates and method of manufacture thereof

BIAXIALLY ORIENTED POLYMER FILM

PROBLEM TO BE SOLVED: To improve environmental resistance characteristic and improve thermal stability even at a lower temperature by comprising an ordered polymer having a particular molecular structure and specifying the physio-chemical characteristics such as an ultimate tensile strength, a tensile modulus, a coefficient of thermal expansion, or a dielectric constant. SOLUTION: A biaxially oriented film comprises an ordered polymer having the molecular structure of a rigid rod indicated by the formula and has the following physio-chemical characteristics: an ultimate tensile strength greater than about 50,000 psi in one direction and greater than about 20,000 psi in any direction; a tensile modulus greater than about 2×103 psi in one direction and greater than about 4×102 psi in any direction; a coefficient of thermal expansion selected from either negative, positive or zero in any direction in the plane of the film; a dielectric constant less than about 6.0; a less than 1% weight loss ...

Schaltungsmaterialien, Schaltungslaminate und Herstellungsverfahren hiervon

Ein Schaltungssubstratlaminat, aufweisend eine leitfähige Metallschicht; und ein dielektrisches Verbundmaterial mit einer Dielektrizitätskonstante von weniger als etwa 3,5 und einem dielektrischen Verlustfaktor von weniger als etwa 0,006, wobei das dielektrische Verbundmaterial aufweist: ein Polymerharz; und etwa 10 bis etwa 70 Volumenprozent an Cenosphären mit einem Eisenoxidgehalt von weniger als oder gleich 3 Gewichtsprozent.

CIRCUIT MATERIALS WITH IMPROVED BOND, METHOD OF MANUFACTURE THEREOF, AND ARTICLES FORMED THEREFROM

A circuit subassembly, comprising: a conductive layer, a dielectric layer formed from a thermosetting composition, wherein the thermosetting composition comprises, based on the total weight of the thermosetting composition a polybutadiene or polyisoprene resin, about 30 to about 70 percent by weight of a magnesium hydroxide having less than about 1000 ppm of ionic contaminants, and about 5 to about 15 percent by weight of a nitrogen-containing compound, wherein the nitrogen-containing compound comprises at least about 15 weight percent of nitrogen; and an adhesive layer disposed between and in intimate contact with the conductive layer and the dielectric layer, wherein the adhesive comprises a poly(arylene ether), wherein the circuit subassembly has a UL-94 rating of at least V-1.

Circuit materials with improved bond, method of manufacture thereof, and articles formed therefrom

A circuit subassembly, comprising: a conductive layer, a dielectric layer formed from a thermosetting composition, wherein the thermosetting composition comprises, based on the total weight of the thermosetting composition a polybutadiene or polyisoprene resin, about 30 to about 70 percent by weight of a magnesium hydroxide having less than about 1000 ppm of ionic contaminants, and about 5 to about 15 percent by weight of a nitrogen-containing compound, wherein the nitrogen-containing compound comprises at least about 15 weight percent of nitrogen; and an adhesive layer disposed between and in intimate contact with the conductive layer and the dielectric layer, wherein the adhesive comprises a poly(arylene ether), wherein the circuit subassembly has a UL-94 rating of at least V-1.

Schaltungsmaterialien mit verbesserter Bindung, Verfahren zur Herstellung hiervon und hieraus hergestellte Artikel

Schaltungsbaugruppe aufweisend: eine leitfähige Schicht; eine dielektrische Schicht, die aus einer wärmehärtbaren Zusammensetzung gebildet ist, wobei die wärmehärtbare Zusammensetzung bezogen auf das Gesamtgewicht der wärmehärtbaren Zusammensetzung aufweist: ein Polybutadien- oder Polyisoprenharz, etwa 30 bis etwa 70 Gewichtsprozent eines Magnesiumhydroxids mit weniger als etwa 1000 ppm ionische Verunreinigungen und etwa 5 bis etwa 15 Gewichtsprozent einer stickstoffhaltigen Verbindung, wobei die stickstoffhaltige Verbindung wenigstens etwa 15 Gewichtsprozent Stickstoff aufweist; und eine Klebeschicht, die zwischen und in Kontakt mit der leitfähigen Schicht und der dielektrischen Schicht angeordnet ist, wobei der Klebstoff einen Poly(arylenether) aufweist; wobei die Schaltungsbaugruppe eine UL-94-Klassifizierung von wenigstens V-1 hat. Circuit assembly comprising: a conductive layer; a dielectric layer formed from a thermosetting composition, the thermosetting composition based on the total weight of the thermosetting composition comprising: a polybutadiene or polyisoprene resin, from about 30 to about 70 weight percent of a magnesium hydroxide having less than about 1000 ppm of ionic impurities and from about 5 to about 15 weight percent of a nitrogen-containing compound, wherein the nitrogen-containing compound has at least about 15 weight percent nitrogen; and an adhesive layer disposed between and in contact with the conductive layer and the dielectric layer, the adhesive comprising a poly (arylene ether); wherein the circuit package has a UL-94 classification of at least V-1.

Apparatus and method of manufacture of electrochemical cell components

A component for an electrochemical cell comprises a thermally and electrically conductive core, wherein the conductive core comprises apertures, and wherein the conductive core further comprises an active area substantially covered by an electrically and thermally conductive polymeric composite. The conductive polymeric composite is adhered to the core by an adhesion promoter comprising electrically conductive particles to reduce the volume resistivity of the component, and an optional adhesive composition. Components may be manufactured having a volume resistivity of about 0.500 ohm-cm or less and a thermal conductivity of at least about 5 watts/meter ° K. In addition, the component is economical to produce due to inexpensive starting materials as well as the use of conventional processing equipment.

DIELECTRIC MATERIALS, METHODS OF FORMING SUBASSEMBLIES THEREFROM, AND THE SUBASSEMBLIES FORMED THEREWITH

A circuit subassembly, comprising a dielectric layer formed from a dielectric composition comprising, based on the total volume of the composition: about 15 to about 65 volume percent of a dielectric filler; and about 35 to about 85 volume percent of a thermosetting composition comprising: a poly(arylene ether), and a carboxy-functionalized polybutadiene or polyisoprene polymer. 124-. (canceled)26. A method for the manufacture of a circuit subassembly , comprising: a core dielectric substrate layer having a first surface and an opposite second surface, wherein the composition of said core dielectric substrate layer is based on 1,2-polybutadiene, polytetrafluoroethylene, or a liquid crystal polymer; and', 'a first core wiring layer disposed on the first surface of the core dielectric substrate layer; and, 'providing a core comprising'} about 15 to about 65 volume percent of a dielectric filler; and', an unmodified poly(arylene ether), and', 'a carboxy-functionalized polybutadiene or polyisoprene polymer., 'about 35 to about 85 volume percent of a thermosetting composition comprising], 'laminating a first dielectric layer onto the first core wiring layer, wherein the dielectric layer is formed from a dielectric composition comprising, based on the total volume of the composition27. The method of claim 26 , wherein the core further comprises a second core wiring layer disposed on the second surface of the core dielectric substrate layer claim 26 , and the method further comprises laminating a second dielectric layer on the second core wiring layer claim 26 , wherein the second dielectric buildup layer is formed from said dielectric composition.28. The method of claim 27 , wherein the first and the second dielectric layers are laminated onto the first and second wiring layers simultaneously.29. The method of claim 27 , further comprising metallizing the laminated first layer.3038-. (canceled)39. The method of claim 26 , wherein the composition of the core dielectric ...

Dielectric materials, methods of forming subassemblies therefrom, and the subassemblies formed therewith

A circuit subassembly, comprising a dielectric layer formed from a dielectric composition comprising, based on the total volume of the composition: about 15 to about 65 volume percent of a dielectric filler; and about 35 to about 85 volume percent of a thermosetting composition comprising: a poly(arylene ether), and a carboxy-functionalized polybutadiene or polyisoprene polymer.

Dielectric bond plies for circuits and multilayer circuits, and methods of manufacture thereof

A bond ply, comprising a first outer layer comprising a thermosetting composition and a filler composition; a second outer layer comprising a thermosetting composition and a filler composition that is of the same type as that of the first outer layer; and an intermediate layer disposed between the first and the second outer layers, and comprising a thermosetting composition and a filler composition that is of the same type as the first and second outer layers, wherein the thermosetting composition of the intermediate layer has a degree of cure that is greater than a degree of cure for each of the thermosetting compositions of the first and the second outer layers.

Circuit board materials with improved bond to conductive metals and methods of the manufacture thereof

Use of a roughened dielectric layer between a dielectric substrate and a conductive layer, which allows increased adhesion between layers without the conductor loss associated with roughened conductor layers, as well as improved accuracy in etching. The method is widely applicable to a variety of dielectric substrate and conductive layer constructions, and can be readily tuned to provide the desired level of adhesion and other advantageous properties.

CIRCUIT MATERIALS, CIRCUITS LAMINATES, AND METHOD OF MANUFACTURE THEREOF

A circuit substrate laminate, comprising a conductive metal layer; and a dielectric composite material having a dielectric constant of less than about 3.5 and a dissipation factor of less than about 0.006, wherein the dielectric composite material comprises: a polymer resin; and about 10 to about 70 volume percent of cenospheres having a ferric oxide content of less than or equal to 3 weight percent.

Circuit materials, circuits laminates, and method of manufacture thereof

A circuit substrate laminate, comprising a conductive metal layer; and a dielectric composite material having a dielectric constant of less than about 3.5 and a dissipation factor of less than about 0.006, wherein the dielectric composite material comprises: a polymer resin; and about 10 to about 70 volume percent of cenospheres having a ferric oxide content of less than or equal to 3 weight percent.

Circuit materials with improved bond, method of manufacture thereof, and articles formed therefrom

A circuit subassembly, comprising: a conductive layer, a dielectric layer formed from a thermosetting composition, wherein the thermosetting composition comprises, based on the total weight of the thermosetting composition a polybutadiene or polyisoprene resin, about 30 to about 70 percent by weight of a magnesium hydroxide having less than about 1000 ppm of ionic contaminants, and about 5 to about 15 percent by weight of a nitrogen-containing compound, wherein the nitrogen-containing compound comprises at least about 15 weight percent of nitrogen; and an adhesive layer disposed between and in intimate contact with the conductive layer and the dielectric layer, wherein the adhesive comprises a poly(arylene ether), wherein the circuit subassembly has a UL-94 rating of at least V-1.

Circuit materials with improved bond, method of manufacture thereof, and articles formed therefrom

A circuit subassembly, comprising: a conductive layer, a dielectric layer formed from a thermosetting composition, wherein the thermosetting composition comprises, based on the total weight of the thermosetting composition a polybutadiene or polyisoprene resin, about 30 to about 70 percent by weight of a magnesium hydroxide having less than about 1000 ppm of ionic contaminants, and about 5 to about 15 percent by weight of a nitrogen-containing compound, wherein the nitrogen-containing compound comprises at least about 15 weight percent of nitrogen; and an adhesive layer disposed between and in intimate contact with the conductive layer and the dielectric layer, wherein the adhesive comprises a poly(arylene ether), wherein the circuit subassembly has a UL-94 rating of at least V-1.

Circuit materials, circuits laminates, and method of manufacture thereof

A circuit substrate laminate, comprising a conductive metal layer; and a dielectric composite material having a dielectric constant of less than about 3.5 and a dissipation factor of less than about 0.006, wherein the dielectric composite material comprises: a polymer resin; and about 10 to about 70 volume percent of cenospheres having a ferric oxide content of less than or equal to 3 weight percent.

DIELECTRIC BOND PLIES FOR CIRCUITS AND MULTILAYER CIRCUITS, AND METHODS OF MANUFACTURE THEREOF

A bond ply, comprising a first outer layer comprising a thermosetting composition and a filler composition; a second outer layer comprising a thermosetting composition and a filler composition that is of the same type as that of the first outer layer; and an intermediate layer disposed between the first and the second outer layers, and comprising a thermosetting composition and a filler composition that is of the same type as the first and second outer layers, wherein the thermosetting composition of the intermediate layer has a degree of cure that is greater than a degree of cure for each of the thermosetting compositions of the first and the second outer layers.

DIELECTRIC BOND PLIES FOR CIRCUITS AND MULTILAYER CIRCUITS, AND METHODS OF MANUFACTURE THEREOF

A bond ply, comprising a first outer layer comprising a thermosetting composition and a filler composition; a second outer layer comprising a thermosetting composition and a filler composition that is of the same type as that of the first outer layer; and an intermediate layer disposed between the first and the second outer layers, and comprising a thermosetting composition and a filler composition that is of the same type as the first and second outer layers, wherein the thermosetting composition of the intermediate layer has a degree of cure that is greater than a degree of cure for each of the thermosetting compositions of the first and the second outer layers. 1. A bond ply , comprisinga first outer layer comprising a thermosetting composition and a filler composition;a second outer layer comprising a thermosetting composition and a filler composition that is of the same type as that of the first outer layer; andan intermediate layer disposed between the first and the second outer layers, and comprising a thermosetting composition and 10 to 60 volume percent of a filler composition that is of the same type as the first and second outer layers;wherein the thermosetting composition of the intermediate layer has a degree of cure that is greater than a degree of cure for each of the thermosetting compositions of the first and the second outer layers; andwherein the bond ply does not include glass or other fabric.2. The bond ply of claim 1 , wherein the thermosetting composition comprises an epoxy claim 1 , polybutadiene claim 1 , polyisoprene claim 1 , polyimide claim 1 , or a combination comprising at least one of the foregoing.3. The bond ply of claim 1 , wherein the thermosetting composition comprises:a poly(arylene ether) component; anda carboxy-functionalized polybutadiene or polyisoprene polymer component.4. The bond ply of claim 1 , wherein the thermosetting composition comprises:a cure system; anda component of solid epoxy resin and a nitrile rubber ...

Circuit materials with improved bond, method of manufacture thereof, and articles formed therefrom

A circuit subassembly, comprising: a conductive layer, a dielectric layer formed from a thermosetting composition, wherein the thermosetting composition comprises, based on the total weight of the thermosetting composition a polybutadiene or polyisoprene resin, about 30 to about 70 percent by weight of a magnesium hydroxide having less than about 1000 ppm of ionic contaminants, and about 5 to about 15 percent by weight of a nitrogen-containing compound, wherein the nitrogen-containing compound comprises at least about 15 weight percent of nitrogen; and an adhesive layer disposed between and in intimate contact with the conductive layer and the dielectric layer, wherein the adhesive comprises a poly(arylene ether), wherein the circuit subassembly has a UL-94 rating of at least V-1.

Circuit materials with improved bond, method of manufacture thereof, and articles formed therefrom

A circuit subassembly, comprising: a conductive layer, a dielectric layer formed from a thermosetting composition, wherein the thermosetting composition comprises, based on the total weight of the thermosetting composition a polybutadiene or polyisoprene resin, about 30 to about 70 percent by weight of a magnesium hydroxide having less than about 1000 ppm of ionic contaminants, and about 5 to about 15 percent by weight of a nitrogen-containing compound, wherein the nitrogen-containing compound comprises at least about 15 weight percent of nitrogen; and an adhesive layer disposed between and in intimate contact with the conductive layer and the dielectric layer, wherein the adhesive comprises a poly(arylene ether), wherein the circuit subassembly has a UL-94 rating of at least V-1.

Biaxially oriented ordered polymer films

This invention relates in general to the formation of thick films having a biaxial molecular orientation. Such films are prepared in accordance with the present invention from rod-like extended chain aromatic-heterocyclic ordered polymers. Such films have high tensile strength, modulus, and environmental resistance characteristics. A preferred ordered polymer for use in the present invention is poly (para-phenylenebenzo bisthiazole), (PBT), a compound having the structure: ##STR1## The present invention is also directed to methods and apparatus suitable for producing biaxially oriented films, coatings, and like materials from ordered polymers, preferably PBT.