ТЕРМОПЛАСТИЧНЫЕ ИЗДЕЛИЯ С ВЫСОКОЙ ТЕМПЕРАТУРОЙ СТЕКЛОВАНИЯ

... 1. Композиционный материал, представляющий электронный компонент, где композиционный материал содержит электропроводящий материал, расположенный либо сверху либо снизу, по меньшей мере, части подложки или покрытия, соответственно, где подложка или покрытие содержит материал, выбранный из группы, состоящей из: а) несмешивающейся смеси полимеров, содержащей один или более полиэфиримидов, имеющей более чем одну температуру стеклования, где полиэфиримид имеет температуру стеклования выше, чем 217°С; b) смешивающейся смеси полимеров, содержащей один или более полиэфиримидов, имеющей одну единственную температуру стеклования выше, чем 180°С; или с) одного полиэфиримида, имеющего температуру стеклования выше, чем 247°С. ! 2. Композиционный материал по п.1, где полиэфиримид имеет соотношение атомов водорода к атомам углерода от приблизительно 0,4 до 0,85. ! 3. Композиционный материал по п.1, где полиэфиримид является в значительной степени свободным от бензильных протонов. ! 4. Композиционный материал ...

КОЛЬЦЕОБРАЗНЫЕ ИЛИ ТРУБЧАТЫЕ ФОРМОВАННЫЕ ИЗДЕЛИЯ ИЗ НОВЫХ ПОЛИМЕРНЫХ СМЕСЕЙ

... 1. Трубчатое промышленное изделие кольцеобразной или трубчатой формы, имеющее наружный диаметр, внутренний диаметр и длину, выполненное из одного или нескольких материалов, выбранных из группы, состоящей из a) несмешиваемой смеси полимеров, содержащей один или несколько полиэфиримидов, имеющих более одной температуры стеклования, где полиэфиримид имеет температуру стеклования более чем 217°С; b) смешиваемой смеси полимеров, содержащей один или несколько полиэфиримидов, имеющих единую температуру стеклования более чем 180°С; или с) отдельного полиэфиримида, имеющего температуру стеклования более чем 247°С. ! 2. Трубчатое промышленное изделие по п.1, в котором полиэфиримид имеет отношение атомов водорода к атомам углерода в пределах примерно между 0,4 и 0,85. ! 3. Трубчатое промышленное изделие по п.1, в котором полиэфиримид по существу не содержит бензильных протонов. ! 4. Трубчатое промышленное изделие по п.1, в котором наружный диаметр изделия является по существу одинаковым по всей длине ...

BEDRUCKTE SCHALTTRÄGER

Cyanatharzmasse und kupferkaschiertes Laminat

POLYIMID-ZUSAMMENSETZUNG UND DAMIT HERGESTELLTES PREPREG UND LAMINAT

Fluorierten Kohlenstoff und Polyimide enthaltende Verbundwerkstoffe

Gegossene gedruckte Schaltungsplatte.

BISMALEINIMIDE, SOWIE DARAUS HERGESTELLTE POLYIMIDE.

Verbesserung der Molekulargewichtsverteilung durch Lösungsmittelextraktion.

VERFAHREN ZUR HERSTELLUNG VON POLYIMID-METALL-LAMINATEN

Flexible Polyimid-Mehrschichtlaminate und ihre Herstellung.

Mit einem Cyanatester modifizierte härtbare Harzzusammensetzung und daraus hergestellter Lack, Prepreg, mit Metall bedeckte Schichtplatte, Film, gedruckte Leiterplatte und Mehrschichtleiterplatte

VERFAHREN ZUR OBERFLÄCHENBEHANDLUNG VON POLYAMID-FORMKÖRPERN UND DANACH ERHALTENE FORMKÖRPER

Leiterplattenvorrichtung für ein Bildaufnehmermodul für eine Kamera, Bildaufnehmermodul mit einer Leiterplattenvorrichtung und Verfahren zum Herstellen einer Leiterplattenvorrichtung

Der hier vorgestellte Ansatz betrifft eine Leiterplattenvorrichtung (400) für ein Bildaufnehmermodul für eine Kamera. Die Leiterplattenvorrichtung (400) weist eine Leiterplatte (100), einen Bildsensor (105) und zumindest eine Kupferschicht (405) und/oder Carbonschicht auf. Die Leiterplatte (100) weist eine erste Hauptoberfläche (410) und eine der ersten Hauptoberfläche (410) gegenüberliegende zweite Hauptoberfläche (415) auf. Der Bildsensor (105) ist an der ersten Hauptoberfläche (410) der Leiterplatte (100) angeordnet oder anordenbar. Die zumindest teilweise Kupfer aufweisende Kupferschicht (405) und/oder zumindest teilweise Kohlenstoff aufweisende Carbonschicht (600) ist an der zweiten Hauptoberfläche (415) angeordnet und dazu ausgeformt, um die Leiterplatte (100) zu stabilisieren.

Flexible polyimide multilayer laminates

The invention relates to laminates with layers of fully aromatic polyimides which are no longer shapable and are each bonded directly at one side to a layer of backing material. Two laminated bodies thus obtained are bonded together by means of heat-sealable polyimide on the layers of polyimide which is no longer shapable. The multilayer laminate thus obtained represents the basic body of the laminates according to the invention at the exterior surface(s) of which further layers can be joined. The laminates can be produced by a process which is also claimed in which heat-sealable polyimide or the precursor thereof is applied to polyimide which is no longer shapable, before or after it is completely cured. Subsequently the layers are bonded at elevated temperature, if appropriate after a curing stage. The backing materials are preferably metal or alloy foils. The resulting multilayer laminates are distinguished by outstanding mechanical, thermal and electrical properties. They can be used ...

Circuit board assembly

MULTI-LAYER PRINTED WIRING BOARDS

Polyamide-imide resin pastes

A paste which does not cause screen clogging in repeated printings and shows excellent mechanical stability comprises polyamide-imide resin solution dissolved in a non-nitrogen-containing solvent, and resin fine particles dispersed in the solution in an amount of 1 to 50% by weight relative to the resulting polyamide-imide resin paste.

POLYAMIDE-IMIDE COMPOSITIONS FOR IMPARTING ELECTRICAL PROPERTIES AND ARTICLES PRODUCED USING THE COMPOSITIONS

PRODUCING POLYIMIDE/METALLIC FOIL FILM

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE AND ETCHANT FOR POLYMER RESIN

... 1510944 Etching HITACHI Ltd 30 April 1976 [13 Aug 1975] 17720/76 Heading B6J [Also in Division H1] A semi-cured resin containing amido and/or imido linkages is etched with a composition comprising hydrazine and at least one polyamine of the formula wherein R is selected from divalent radicals having 2-6 carbon atoms. Examples of suitable resins and amines are given.

Conditioning of polyamides for electroless plating

Polyamide substrates are preconditioned for electroless plating by contact with an alkaline aqueous solution having a pH of at least about 10 and etched with an acid solution. The acid solution is preferably an aqueous solution of an organic acid containing at least two carbon atoms, particularly an acetic acid compound, such as trichloroacetic acid.

PP IMIDE RESIN, PROCEDURE FOR ITS PRODUCTION, PP IMIDE COMPOSITION, FROM IT MANUFACTURE OF FILM SCREEN END MATERIAL AND ADHESIVE FOR ELECTRONIC PARTS

DIAMINE UND BISMALEINIMIDE, SOWIE DARAUS HERGESTELLTE POLYIMIDE

PCT No. PCT/EP89/00120 Sec. 371 Date Aug. 22, 1990 Sec. 102(e) Date Aug. 22, 1990 PCT Filed Feb. 9, 1989 PCT Pub. No. WO89/08107 PCT Pub. Date Sep. 8, 1989.A diamine or bismaleimide of the general formula I I in which R1 and R2 denote an H atom or together denote the group -OC-CH=CH-CO-, Y1 and Y2 independently of one another deonte O or S and Het denotes a thiazole, a thiadiazole or a 1-methyltriazole ring. The diamines and bismaleimides are used for the preparation of polyimides which are if appropriate reinforced with fibers and if appropriate incompletely hardened.

PROCEDURE FOR THE PRODUCTION FROM DIAPHRAGM ELECTRODE BUILDING GROUPS TO THE USE IN A PROTON EXCHANGE DIAPHRAGM

PROCEDURE FOR THE PRODUCTION OF METALLIZED PLASTIC ARTICLES

POLYIMIDHARZLAMINATE.

Procedure for the production of with plastic laminated copper, aluminum among other things metallic foils for electrical and radio-technical as well as electronic mechanisms

Procedure for the production of an aqueous emulsion of a Phenolformaldehydresolharzes suitable for impregnating fibrous materials

FLAME RETARDANT POLYCYANATE ESTER BLENDS

METALLISABLE SUBSTRATES FOR PRINTED CIRCUITS, AND THEIR PREPARATION

L'invention concerne des substrats isotropes métallisables ayant de très faibles coefficients de dilatation,caractérisés en ce qu'ils sont constitués par des fibres polymériques liées par un polymère à groupements imides et par des charges, mis en forme par voie humide, séchés puis pressés à chaud. L'invention concerne également un procédé pour la fabrication de ces substrats. Ces substrats peuvent être métallisés sélectivement pour former des circuits imprimés.

SINTERING OF METAL INTERLAYERS WITHIN ORGANIC POLYMERIC FILMS

TITLE Sintering of Metal Interlayers Within Organic Polymeric Films Process for modifying in situ the electrical and/or optical properties of an electrochemicallydeposited interlayer within a polyimide film, the interlayer being comprised of particulate silver and/or gold, by heating the interlayer, either in its entirety or in a spatially selective manner, so as to sinter the particulate silver and/or gold without adversely affecting the properties of the polyimide, and the film structure produced thereby.

CONDITIONING OF POLYAMIDES FOR ELECTROLESS PLATING

... of the Invention Polyamide substrates are pre-conditioned for electroless plating by contact with an alkaline aqueous solution having a pH of at least about 10 and etched with an acid solution. The acid solution is preferably an aqueous solution of an organic acid containing at least two carbon atoms, particularly an acetic acid compound, such as trichloracetic acid.

FLEXIBLE PRINTED CIRCUIT BASE BOARD AND METHOD FOR PRODUCING THE SAME

There are disclosed a flexible printed circuit base board produced as an elemental material suitable for a flexible printed circuit board by coating a heatresistant resin composition composed of a heat-resistant resin having a heterocyclic ring and an epoxy resin dissolved in an organic solvent on a metal foil and drying it to form a film directly on said foil, and a method for producing the same. Said flexible printed circuit base board is more excellent in heat resistance, flame retardancy, adhesiveness, electric insulation, and heat deterioration characteristics than the conventional base board obtained by integrating a heat-resistant film and a metal foil through an adhesive. These properties are of great importance in practical applications of the printed circuit base board. As compared with the conventional products, the production is easy, and hence, the present base board can be produced at a low cost. The base board of this invention is not only usable for various types of flexible ...

COMPOSITE MATERIALS

... : The invention provides a laminate consisting essentially of a metal film or sheet and a film or sheet of a fluorine - containing polyimide , a composite sheet consisting essentially of a fluorohydrocarbon polymer substrate impregnated with a fluorine - containing polyimide , and a laminate consisting essentially of a metal film or sheet and the above composite sheet, the polyimide and being defined in the specification.

IMIDE PREPOLYMER COMPOSITION COMPRISING UNSATURATED BIS IMIDE, DIAMINE AND AN INHIBITOR

The imide prepolymer compositions of the present invention, which contain the unsaturated component (A) and diamine component (B) at the (A)/(B) molar ratio of 0.9-1.5 and 0.01-5.0% by weight, based on the sum of said components (A) and (B), of at least one compound selected from the group consisting of radical polymerization inhibitors, carboxylic acids and acid anhydrides. The imide prepolymer compositions of the present invention are tough and have excellent adhesive strength to glass cloths and metals and heat resistance.

BISMALEIMIDE TRIAZINE POLYMER COMPOSITIONS FOR MAKING CIRCUIT BOARDS

FLEXIBLE PRINTED CIRCUIT BASE BOARD AND METHOD FOR PRODUCING THE SAME

PROCESS FOR THE ADHESION-ACTIVATION OF POLYAMIDE SUBSTRATES FOR ELECTROLESS METALLISATION

POLYBENZAZOLE POLYMERS CONTAINING PERFLUOROCYCLOBUTANE RINGS

Polybenzazole polymers may contain perfluorocyclobutane rings to provide a flexible moiety which is stable at high temperatures. 38,465-F ...

PRINTED WIRING BOARD(S) HAVING POLYIMIDEBENZOXAZOLE DIELECTRIC LAYER(S) AND THE MANUFACTURE THEREOF

A film of polyimidebenzoxazole (PIBO) having an electrically conductive layer adhered to at least one face thereto, wherein the PIBO film has a tensile strength greater than 200 MPa. A printed wiring board having at least one dielectric layer and at least one circuitry layer wherein at least one dielectric layer is a PIBO film. A printed wiring board (PWB) having at least one polyimidebenzoxazole (PIBO) dielectric layer wherein the PWB has at least one thin dielectric base material layer, at least one thin conductor, at least one narrow conductor width and at least one small diameter via.

Polyamidplatte oder -rohr, als Träger für Kupferschichten bestimmt

Verfahren zur Herstellung dünner Filme oder Folien

Film thermostable recouvert d'une pellicule adhésive

VERFAHREN ZUR HERSTELLUNG VON POLYAMID-FORMKOERPERN.

VERFAHREN ZUR HERSTELLUNG VON MINDESTENS STELLENWEISE METALLISIERTEN POLYAMID-FORMKOERPERN.

Verfahren zur Herstellung einer wässrigen Emulsion eines Phenolformaldehydresolharzes

STORABLE LOESUNGEN OF HAERTBARER MIXTURES.

COMPOSITION BASED ON TERMOOTVERZhDAYuShchIKhSYa RESINS WITH ULTRALOW DIELECTRIC LOSS AND HIGH-QUALITY LAMINATED MATERIALS, FROM THEM OUT BY THE

Polyimide film for metallizing, method for producing same, and metal-laminated polyimide film

Conductive polyamide substrate

Polyester-imide precursor and polyester-imide

A polyester-imide precursor characterized by having repeating units represented by the following formula (1). (In the formula (1), Ar is the tetravalent aromatic group represented by the formula (2) and B1 is an ester structure having a specific structure.).

Polyimide metal laminate and circuit substrate

Surface-treated copper foil and copper-clad laminate

COMPOSITIONS EPOXY-IMIDE, LEUR PREPARATION ET PRODUITS OBTENUS A PARTIR DE CES COMPOSITIONS

L'INVENTION SE RAPPORTE AUX COMPOSITIONS DE RESINES SYNTHETIQUES. ELLE CONCERNE UNE COMPOSITION COMPRENANT, EN POIDS: A.20-80 DU PRODUIT DE REACTION OBTENU EN FAISANT REAGIR UNE RESINE EPOXY OU UNE RESINE EPOXYNOVOLAQUE APPROPRIEE AVEC UNE BIS-MALEIMIDE, PUIS AVEC UN DURCISSEUR CONSTITUE D'UNE DIAMINE; ET B.80-20 D'UN SOLVANT CONVENABLE QUI N'EST PAS UN AMIDE. UTILISATION DANS LA FABRICATION DE PLAQUETTES OU PANNEAUX POUR CIRCUITS IMPRIMES.

METHOD FOR PREPARING the SURFACE Of a POLYAMIDE SUBSTRATE TO RECEIVE a CHEMICAL PLATING

Predrying polyimide film for accepting metallic coatings - for mfr. of double sided memory circuit components

Procédé pour attaquer la surface d'un substrat de caprolactame en vue de la formation d'un dépôt chimique.

L'invention concerne un procédé pour attaquer la surface d'un substrat de caprolactame en vue de la formation d'un dépôt chimique. Des substrats polymériques à base de caprolactame sont mis en condition en vue d'une déposition chimique par attaque sous l'action d'une solution aqueuse d'un acide organique contenant 2 à environ 10 atomes de carbone, de préférence un composé du type de l'acide acétique, tel que l'acide trichloracétique. Application à la formation d'un dépôt chimique de métal, notamment de nickel ou de cuivre.

METHOD FOR PREPARING the SURFACE Of a POLYAMIDE SUBSTRATE TO RECEIVE a CHEMICAL PLATING

SOLUTIONS, STABLE WITH THE CONSERVATION, OF SETTING MIXTURES CONTAINING OF THE POLYMALEIMIDES AND THE COMONOMERES

METAL COMPOSITE FILM AND PROCESS FOR PRODUCING THE SAME

가요성 기판의 제조방법

... 본 발명은 가요성 기판의 제조방법에 관한 것으로, 레이저 조사 또는 광 조사 공정 등을 진행하지 않더라도 상기 캐리어 기판으로부터 가요성 기판을 용이하게 분리가 가능하여, 레이저 또는 광 조사 등에 의한 소자의 신뢰성 저하 또는 불량 발생 또한 억제할 수 있을 뿐만 아니라, 롤투롤(roll to roll)공정에 의한 가요성 기판의 연속생산이 보다 용이해질 수 있다.

Resin composition for printed wiring board

... (A) 헥사플루오로이소프로판올기 및 실록산 구조를 갖는 폴리이미드 수지 및 (B) 열경화성 수지를 함유하는 프린트 배선판용 수지 조성물로서, 내용제성이 우수하고, 탄성율의 온도 변화가 작고 내열 특성도 우수한 프린트 배선판용 수지 조성물이다.

FLEXIBLE PRINTED CIRCUIT BOARD

... 본 발명은 연성인쇄회로기판 제조용 은페이스트와 이를 이용하여 제조된 연성인쇄회로기판에 관한 것으로, 은분말 73wt% ~ 88wt%, 폴리머레진 5.9wt% ~ 9.5wt%, 솔벤트 5.7wt% ~ 18.0wt%를 포함하여 기재에 회로패턴을 인쇄하고 저온 소성하여 연성인쇄회로기판을 제조할 수 있도록 하여 기존 고가의 FCCL의 동박을 에칭하는 방법에 비하여 간단하면서도 용이한 공정 진행으로 연성인쇄회로기판의 제조비용을 절감하고, 생산성을 향상시킨다.

POLYIMIDE METAL LAMINATE

PRINTED CIRCUIT SUBSTRATES

Polyamide-imide resin, flexible metal-clad laminate, and flexible printed wiring board

블록 폴리이미드 및 블록 폴리아마이드산 이미드, 및 그의 용도

... 본 발명의 목적은, 알칼리 수용액에 대한 적절한 용해성을 갖는 블록 폴리아마이드산 이미드, 및 그것을 이용하여 얻어지는, 높은 투명성과 저열팽창계수(저CTE)를 갖는 블록 폴리이미드를 제공하는 것이다. 본 발명의 블록 폴리이미드는, 하기 식(1A)로 표시되는 반복 구조 단위로 구성되는 블록과, 하기 식(1B)로 표시되는 반복 구조 단위로 구성되는 블록을 포함한다.

HEAT-RESISTANT RESIN PRECURSOR, HEAT-RESISTANT RESIN AND INSULATING FILM AND SEMICONDUCTOR DEVICE

POLYIMIDE-COPPER COMPOSITE LAMINATE FOR SECURING GOOD MECHANICAL AND ELECTRIC CHARACTERISTICS AND ALKALI AND ACID RESISTANCE BY USING AN AROMATIC POLYIMIDE FILM

PURPOSE: A polyimide-copper composite laminate is provided to supply a carrier containing a thin copper film and an aromatic polyimide film forming electronic circuits with fine patterns. CONSTITUTION: A polyimide-copper composite laminate comprises a metal carrier(4a,4b) with the thickness of 10-20micrometer; a thin copper film(2a,2b) with the thickness of 1-8micrometer; a heat-resistant intermediate layer(3a,3b) positioned between the metal carrier and the thin copper film; and an aromatic polyimide film directly fixed to the thin copper film without an adhesive agent. The thickness of the metal carrier is 10-18micrometer or 15-18micrometer. The heat-resistant intermediate layer is made from ceramic or metal. The aromatic polyimide film is fixed to the copper film at the release strength over 0.7N/nm. The copper film is fixed to the metal carrier at the release strength of 0.001-0.2N/nm. © KIPO 2006 ...

POLYIMIDE FILM FOR FLEXIBLE PRINTED BOARD AND FLEXIBLE PRINTED BOARD USING THE SAME

A flexible printed board free from curling, twisting, and warp even if temperature changes and having an excellent slide bendability. A polyimide film having an average coefficient of linear expansion of 1.0 to 2.5 X 10-5 cm/cm/°C in the range from 100 to 200°C and a stiffness value of 0.4 to 1.2 g/cm is used as the base film for a flexible printed board. As a result, a flexible printed board having an excellent thermal dimension stability and excellent slide bendability can be produced. © KIPO & WIPO 2007 ...

POLYIMIDE FILM AND METHOD FOR PRODUCTION THEREOF

Disclosed is a polyimide film comprising a film resin and an inorganic particle dispersed in the film in an amount of 0.1 to 0.9 wt% relative to the amount of the film resin, wherein the inorganic particle has a particle diameter of 0.01 to 1.5 μm, an average particle diameter of 0.05 to 0.7 μm, and such a particle size distribution that particles having a particle diameter of 0.15 to 0.60 μm account for 80 vol% or more of the total particle volume. Also disclosed is a method for producing a polyimide film, which comprises the steps of reacting tetracarboxylic acid dianhydride with a diamine in a polar organic solvent to produce a polyamic acid, imidizing the polyamic acid, and then molding the imidized product into a film, wherein a slurry comprising an inorganic particle dispersed in the same polar organic solvent as the polar inorganic solvent used above is added to a solution of the polyamic acid produced during the polyimide production process at a ratio of 0.1 to 0.9 wt% relative ...

POLYIMIDE FILM

The present invention provides a novel polyimide film capable of being used in double-sided copper foil laminate plate. According to an embodiment of the present invention, the polyimide film contains an inorganic particle. When a ratio of a protrusion having a height of 0.8 μm or more in one surface (a) of the film is A/100cm^2 and a ratio of a protrusion having a height of 0.8 μm or more in the other surface (b) of the film is B/100cm^2, both A and B are 10 or less. According to an embodiment of the present invention, in the polyimide film containing the inorganic particle, an absolute value of a difference between A and B can be 2 or more. COPYRIGHT KIPO 2018 (A1,A2) Same layer (BB) Polyimide film ...

NON-ADHESIVE-TYPE FLEXIBLE LAMINATE AND METHOD FOR PRODUCTION THEREOF

Disclosed is a non-adhesive-type flexible laminate comprising a polyimide film with at least one surface thereof being plasma-treated, a tie coat layer formed on the plasma-treated surface of the polyimide film and a conductive metal layer formed on the tie coat layer, wherein the ratio of the thickness (T) of the tie coat layer to the ten-point average roughness (Rz) of the plasma-treated surface of the polyimide film (i.e., the T/Rz ratio) is 2 or greater. The object is to improve the initial adhesion force which is a measure of the adhesion force and also improve the adhesion force after heat aging (i.e., after being allowed to stand in the air at 150°C for 168 hours in the air) in a non-adhesive-type flexible laminate (particularly a dual-layered flexible laminate). COPYRIGHT KIPO & WIPO 2010 ...

MATERIAL FOR PLATING AND USE THEREOF

Disclosed is a material for plating having a resin layer which contains a polyimide resin of a specific structure. An electroless plating is performed on this resin layer. This material for plating is excellent in adhesion with an electroless-plated coating film formed on the resin surface even when the surface roughness of the resin layer is low, while exhibiting excellent solder heat resistance. Consequently, this material for plating can be suitably used for production of printed wiring boards or the like. © KIPO & WIPO 2008 ...

HEAT-RESISTANT RESIN PRECURSOR, HEAT-RESISTANT RESIN AND INSULATING FILM AND SEMICONDUCTOR DEVICE

A polybenzoxyazol resin precursor of a specific structure having a cross-linking group in its molecule; a polybenzoxyazol resin obtained from the polybenzoxyazol resin precursor through a condensation reaction and a cross-linking reaction; an insulating film comprising said polybenzoxyazol resin; and a semiconductor device having an inter-layer insulating film and/or an surface preventing film comprising said insulating film. The precursor retains the solubility in an organic solvent and thus maintains good formability, and at the same time, can produce, after ring closure, a heat-resistance resin which has improved heat resistance and is excellent in electric characteristics, physical properties and mechanical characteristics, and thus is suitably used for an inter-layer insulating film in a semiconductor device or the like. © KIPO & WIPO 2007 ...

플렉서블 인쇄 회로

... 플렉서블 인쇄 회로는 플렉서블 바디 부분 및 플렉서블 헤드 단부 부분을 포함할 수 있으며, 도체들 및/또는 세장형 컷 아웃들이 패턴으로 형성될 수 있다. 플렉서블 바디는 근위 단부 및 원위 단부를 포함하며, 근위 단부는 고정 오브젝트에 연결되도록 구성되고 원위 단부는 고정 오브젝트에 대해 이동하는 이동 오브젝트에 연결되도록 구성된다. 플렉서블 인쇄 회로의 헤드 단부는 플렉서블 바디의 원위 단부에 위치될 수 있다. 헤드 단부는 복수의 세장형 컷-아웃들 및/또는 복수의 세장형 컷-아웃들에 의해 플렉서블 바디로부터 현수되는 복수의 전기적 연결 패드들을 포함할 수 있다.

CROSS-LINKED POLYIMIDE RESIN AND METHOD FOR PRODUCING SAME, ADHESIVE RESIN COMPOSITION AND CURED PRODUCT THEREOF, COVER LAY FILM, CIRCUIT BOARD, HEAT-CONDUCTIVE SUBSTRATE, AND HEAT-CONDUCTIVE POLYIMIDE FILM

RESIN COMPOSITE METAL FOIL, LAMINATE HAVING SUPERIOR HEAT RESISTANCE AND PROCESS FOR THE PRODUCTION OF PRINTED WIRING BOARD USING THE LAMINATE

PURPOSE: Provided is a resin composite metal foil whose surface has a very small roughness, a metal-foil-clad laminate having superior heat resistance after absorption and a process for the production of a printed wiring board using the laminate. CONSTITUTION: The resin composite metal foil comprises a metal foil and a block copolymer polyimide resin layer formed on one surface of the metal foil. The block copolymer polyimide resin layer has a thickness of 0.1 to 10micrometers, and the metal foil has a surface roughness less than 4 micrometers. In addition, the printed wiring board is produced by removing an exterior metal foil of the metal-foil-clad laminate and forming a conductive layer on the exterior insulating layer by plating. © KIPO 2006 ...

FLEXIBLE PRINTED WIRING BOARD

PURPOSE: A flexible printed wiring board is provided to obtain a high-performance three-layer type base sheet for flexible printed circuit boards in which an excellent adhesive bonding strength between layers can be obtained with good reproducibility. CONSTITUTION: A base sheet for flexible printed circuit boards consists of an electrically insulating film of a plastic resin having a thickness in the range from 10 to 30 μm, a layer of an adhesive having a thickness in the range from 5 to 15 μm and a copper foil having a thickness in the range from 5 to 15 μm adhesively bonded to the electrically insulating film with intervention of the adhesive layer therebetween. © KIPO 2002 ...

LAMINATE FOR FLEXIBLE BOARD AND HEAT CONDUCTIVE POLYIMIDE FILM

적층체, 도전성 패턴 및 적층체의 제조 방법

... 적어도 지지체로 이루어지는 층 (A) 와, 프라이머층 (B) 와, 제 1 도전층 (C) 와, 절연층 (D) 와, 제 2 도전층 (E) 가 적층된 적층체이며, 절연층 (D) 가, 적어도 제 1 도전층 (C) 의 표면의 일부 또는 전부에, 수지 조성물 (d) 를 도포하고 건조시킴으로써 형성된 층이고, 제 2 도전층 (E) 가, 절연층 (D) 의 표면의 일부 또는 전부에, 도전성 물질을 함유하는 유동체 (e-1) 을 도포함으로써 형성된 제 2 도금핵층 (E-1) 과, 제 2 도금핵층 (E-1) 의 표면에 형성된 제 2 도금층 (E-2) 에 의해서 구성되는 층인 적층체를 제공한다. 이 적층체는, 각 층의 밀착성이 우수하고, 고온 고습도의 환경하에 노출된 경우에도, 우수한 밀착성을 유지하는 것이 가능하다.

Film Metal-clad laminate, flexible substrate, method for producing film, method for producing metal-clad laminate, and method for producing flexible substrate

Polyimide film and polyimide composite sheet

An aromatic polyimide film favorably employable for the chip-on-film (COF) system is composed of a polyimide derived from 3, 3', 4, 4'-biphenyltetracarboxylic acid di- anhydride and p-phenylenediamine and a powdery inorganic filler, in which the film has a thickness in the range of 25 to 35 m and does not have protrusions of 1 m or higher, and the filler has a mean diameter of less than 1 m.

Thermoplastic polyimide resin film, multilayer body and method for manufacturing printed wiring board composed of same

A multilayer body having a two-layer or three-layer structure in which a thermoplastic polyimide layer is formed on one or both sides of a non-thermoplastic polyimide film and the surface of the thermoplastic polyimide layer is subjected to a surface treatment is disclosed. A multilayer body comprising a polymer film and a polyimide resin composition layer which is formed on one or both sides of the polymer film and contains a polyimide resin having a specific structure and a thermosetting component is also disclosed. A resin film at least one side of which has such a surface profile that the arithmetical mean roughness (Ra1) measured at a cut-off of 0.002 mm is 0.05-1 m and the ratio of Ra1 to the roughness (Ra2) measured at a cut-off of 0.1mm (Ra1/Ra2) is 0.4-1 and a multilayer body composed of such a resin film are further disclosed. By using these multilayer bodies, a printed wiring board which is excellent in adhesiveness and enables formation of a very small wiring circuit can be ...

Flexible printed wiring board and manufacturing method thereof

The present invention provides a flexible printed wiring board having a stable quality, not generating curls on a film even after circuit process on a conductor side, and a method of manufacturing such flexible printed wiring board. The flexible printed wiring board is provided with a base layer, which is composed of at least one type of low thermal expansion polyimide resin, between a bottom layer contacting the conductor and a top layer on the opposite side to the conductor. The bottom layer and the top layer are composed of a thermoplastic polyimide rein having a larger thermal expansion coefficient than that of the base layer, and a thickness P1 of the bottom layer and a thickness P2 of the top layer satisfy a condition of P1 < P2.

Resin composition, insulating matrix comprising the same and circuit board using the same

A resin composition, an insulating matrix comprising the same and a circuit board using the same. The resin composition of the present invention comprises: a cross-linked polymer formed by a diamine unit containing an imide group, which is represented by the following formula (1), and an isocyanate unit represented by the following formula (2): (1) (2) wherein, R1, R2, A, X and a are defined in the specification.

TRIAZOLE SILANE COMPOUND, METHOD FOR SYNTHESIZING SAID COMPOUND AND USE THEREOF

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Circuit board and method for manufacturing the same

Heat resistant film and its metal laminate

A heat resistant film is provided. The heat resistant film contains a blend of a polyetherimide resin (A-1) having a repeating unit of formula (1), a polyetherimide resin (A-2) having a repeating unit of formula (2), and a polyaryl ketone resin (B) having a crystalline melt peak temperature of more than 260 DEG C, and a filler of 5-50 wt part to 100 wt part of a resin composition containing at least the three of above resins (A-1), (A-2) and (B), with the blend weight ratio of resin components {(A-1)+(A-2/(B)=(70 to 30)/(30 to 70), and formula (A-1)/(A-2)=(70 to 30)/(30 to 70). The film has an excellent heat adhesion property at low temperature (<= 260 DEG C), and a between the solder heat resisting property after PCT (pressure cooker test) treatment, and the end cracking resistance value, and is suitable as an electronic material.

CIRCUIT BOARD

The present disclosure is directed to a circuit board having a first electrically insulating layer, a first imaged metal layer and a first polyimide coverlay comprising a polyimide derived from 80 to 90 mole % 3,3',4,4'-biphenyl tetracarboxylic dianhydride, 10 to 20 mole % 4,4'-oxydiphthalic anhydride and 100 mole % 2,2'-bis(trifluoromethyl) benzidine. An adhesive layer is not present between the first imaged metal layer and the first polyimide coverlay.

COMPOSITE MATERIAL FOR ELECTRICAL/ELECTRONIC COMPONENT, ELECTRICAL/ELECTRONIC COMPONENT, AND METHOD FOR PRODUCING COMPOSITE MATERIAL FOR ELECTRICAL/ELECTRONIC COMPONENT

Disclosed is a composite material for electrical/electronic components, wherein a resin coating film is formed on at least a part of a metal base and the amount of residual solvent in the resin coating film is controlled to 1-30% by mass. The resin coating film is preferably composed of a polyimide or a polyamideimide.

FLEXIBLE METAL-CLAD LAMINATE AND A METHOD OF MANUFACTURING THE SAME

Disclosed is a flexible metal-clad laminate. More specifically, disclosed is a flexible metal clad laminate including'- a first polyimide layer that is positioned on one surface of a metal foil and has glass transition temperature of 300 to 500 °C; a second polyimide layer that is positioned on one surface of the first polyimide layer and has a linear thermal expansion coefficient of 1 to 20 ppm/K; and a thermoplastic polyimide layer that is positioned on one surface of the second polyimide layer, whereby the flexible metal-clad laminate has an excellent exterior after imidization, is not curled after and before etching, and has excellent adhesive strength with a metal foil and excellent dimensional stability after etching.

Composition, coated film formed of the composition, layered product containing the coated film, and electronic device incorporating the layered product

An object is to provide a composition that has good viscosity stability and flowability at the time of processing, good shape retention after the processing, and good drying property in a temperature range of not degrading the conductor layer at the time of drying and that enables a coated film excellent in strength of adhesion with metal•polyimide, flame resistance, heat resistance, flexibility, mechanical properties, and chemical resistance to obtained after being dried. To meet this object, a composition is prepared containing (A) polyimide and (B) mixed solvent of two kinds or more, and the solubility parameter of the mixed solvent of two kinds or more ranges from 9 to 14.

Thermally and dimensionally stable polyimide films and methods relating thereto

The present disclosure is directed to a polyimide film. The film is composed of a polyimide and a sub-micron filler. The polyimide is derived from at least one aromatic dianhydride component selected from rigid rod dianhydride, non-rigid rod dianhydride and combinations thereof, and at least one aromatic diamine component selected from rigid rod diamine, non-rigid rod diamine and combinations thereof. The mole ratio of dianhydride to diamine is 48-52:52-48 and the ratio of X:Y is 20-80:80-20 where X is the mole percent of rigid rod dianhydride and rigid rod diamine, and Y is the mole percent of non-rigid rod dianhydride and non-rigid rod diamine. The sub-micron filler is less than 550 nanometers in at least one dimension; has an aspect ratio greater than 3:1; is less than the thickness of the film in all dimensions.

Coverlay compositions and methods relating thereto

The present disclosure is directed to a coverlay comprising a polyimide film and an adhesive layer. The polyimide film is composed of a polyimide and a sub-micron filler. The polyimide is derived from at least one aromatic dianhydride component selected from rigid rod dianhydride, non-rigid rod dianhydride and combinations thereof, and at least one aromatic diamine component selected from rigid rod diamine, non-rigid rod diamine and combinations thereof. The mole ratio of dianhydride to diamine is 48-52:52-48 and the ratio of X:Y is 20-80:80-20 where X is the mole percent of rigid rod dianhydride and rigid rod diamine, and Y is the mole percent of non-rigid rod dianhydride and non-rigid rod diamine. The sub-micron filler is less than 550 nanometers in at least one dimension; has an aspect ratio greater than 3:1; is less than the thickness of the film in all dimensions.

Process for producing polyimide film, polyimide film and laminate comprising the same

The present invention relates to a polyimide film prepared from a tetracarboxylic acid component and a diamine component, wherein the strength of orientation anisotropy in the film length of 2000 mm is 1.2 or less and/or the strength of orientation anisotropy in the film length of 1800 mm is 1.1 or less.

Film or plate

Film or plate containing a polyamide having monomer units of butane-1,4-diamine and monomer units of decanedioic acid (PA410). In a preferred embodiment the film or plate contains PA410 and at least one further polymer.

Resin composition, and protective film, dry film, circuit board, and multilayer circuit board containing same

A resin composition which is capable of forming a film that has excellent heat resistance and slidability/bendability; a protective film for circuits, which uses the resin composition; and a dry film or the like which comprises the protective film are provided. Other aspects are a circuit board and a multilayer circuit board, each of which has excellent heat resistance and slidability/bendability. Furthermore, a protective film for circuit boards is provided, which is arranged in contact with a circuit of a printed wiring board, and contains a polyoxazolidone resin that has a weight average molecular weight of 3×10 4 or more.

Polyimide resin composition and laminate including polyimide resin composition

To provide a resin composition that contains a solvent-soluble polyimide and can provide a film exhibiting high viscoelasticity and flexibility at high temperatures. To attain this, a polyimide resin composition is provided that includes a polyimide having a polycondensation unit of a tetracarboxylic acid dianhydride and a diamine, wherein the tetracarboxylic acid dianhydride includes an (α1) tetracarboxylic acid dianhydride represented by general formula (1), or the diamine includes an (β1) aromatic diamine represented by general formula (2), the diamine includes an (β2) aliphatic diamine represented by general formula (3) or (4), a total amour of the (α1) tetracarboxylic acid dianhydride and the (β1) aromatic diamine is 5 to 49 mol % with respect to a total amount of the tetracarboxylic acid dianhydride and the diamine, and an amine equivalent of the polyimide is 4,000 to 20,000.

Two-Layered Copper-Clad Laminate Material, and Method for Producing Same

A two-layered copper-clad laminate material, in which one surface or both surfaces of a polyimide film having a thickness of 12.5 to 50 μm is subjected to a modification treatment by means of a glow discharge plasma treatment in an oxygen gas atmosphere, and a copper layer having a thickness of 1 to 5 μm is formed by means of sputtering or electroplating on one surface or both surfaces of the polyimide film after the modification treatment; characterized in that the integrated intensity ratio of a C1S peak at 287 to 290 eV to a C1S peak at 283 to 287 eV, obtained by analyzing the photoelectron spectroscopy (XPS) spectra of the surface of the polyimide film after the plasma treatment, is within the range of 0.03 to 0.11. The present invention aims at discovering; as a consequence of performing surface characterization by subjecting the PI film surface to XPS analysis before and after the plasma treatment, and of evaluating the dissolution properties and adhesive strength of the PI film before and after the plasma treatment; a two-layered copper-clad laminate material that is ideal to be processed during a wet PI etching step, and a production method for said two-layered copper-clad laminate material. 1. A two-layered copper-clad laminate material , in which one surface or both surfaces of a polyimide film having a thickness of 12.5 to 50 μm is subjected to a modification treatment by means of a glow discharge plasma treatment in an oxygen gas atmosphere , and a copper layer having a thickness of 1 to 5 μm is formed by means of sputtering or electroplating on one surface or both surfaces of the polyimide film after the modification treatment; characterized in that the integrated intensity ratio of a C1S peak at 287 to 290 eV to a C1S peak at 283 to 287 eV , obtained by analyzing the surface of the polyimide film after the plasma treatment by means of photoelectron spectroscopy (XPS) , is within the range of 0.03 to 0.11.2. The two-layered copper-clad laminate material ...

SOLUBLE AROMATIC POLYMER

An aromatic copoly(ester-sulfone) that contains one or more aromatic ester repeating units and one or more aromatic sulfonyl repeating units is provided. While a wide variety of aromatic ester repeating units may be employed, the polymer is nevertheless “low naphthenic” to the extent that it contains a minimal content of repeating units derived from naphthenic hydroxycarboxylic acids and naphthenic dicarboxylic acids. Despite the absence of a high level of conventional naphthenic acid repeating units, the present inventors have discovered that selective control over the type and relative concentration of the aromatic sulfonyl repeating units can lead to “low naphthenic” polymers that are not only soluble in certain solvents, but also capable of exhibiting good mechanical properties. Thus, the ability of the resulting polymer to be dissolved or dispersed in various solvents can be enhanced without sacrificing performance. 2. The aromatic copoly(ester-sulfone) of claim 1 , wherein aromatic sulfonyl repeating units constitute from about 5 mol. % to about 50 mol. % of the copoly(ester-sulfone).3. The aromatic copoly(ester-sulfone) of claim 1 , wherein the aromatic ester repeating units constitute from about 50 mol. % to about 99 mol. % of the copoly(ester-sulfone).4. The aromatic copoly(ester-sulfone) of claim 1 , wherein m claim 1 , n claim 1 , a claim 1 , and b in Formula I are 0.5. The aromatic copoly(ester-sulfone) of claim 1 , wherein X claim 1 , X claim 1 , or both are O.6. The aromatic copoly(ester-sulfone) of claim 1 , wherein X claim 1 , X claim 1 , or both are NH.7. The aromatic copoly(ester-sulfone) of claim 1 , wherein the sulfonyl repeating units are derived from an aromatic sulfonyl alcohol claim 1 , aromatic sulfonyl amine claim 1 , or a combination thereof.8. The aromatic copoly(ester-sulfone) of claim 7 , wherein the sulfonyl repeating units are derived from 4-(4-hydroxyphenyl)-sulfonylphenol claim 7 , 4-(4-aminophenyl)sulfonylphenol claim 7 , 4-(4- ...

BENDABLE CIRCUIT BOARD, EXPANDABLE CIRCUIT BOARD, AND ELECTRONIC DEVICE MADE THEREFROM

Provided are an expandable or bendable circuit board having good body-contact feel, strong against bending and folding, and an electronic device made therefrom. The bendable circuit board includes: a film comprising a polyurethane synthesized by reacting a long-chain polyol with polyisocyanate and having a storage modulus at ° C. of to MPa, a tensile strength of to MPa, and an elongation at break of to %, and the temperature of which the storage elastic modulus reaches to MPa is at ° C. or higher; and circuit wiring formed in contact with a surface of the film. Alternatively, an expandable circuit board having the ratio ρ/ρof the specific electrical resistance ρ of the circuit wiring when the circuit wiring is expanded to the specific electrical resistance (Ω·cm) ρof the circuit wiring before the circuit wiring is expanded is within a range of to 1. A bendable wiring board , comprising:a film composed of a polyurethane to be synthesized by allowing a long-chain polyol to react with a polyisocyanate, whereina temperature of the polyurethane at which a storage elastic modulus measured by a dynamic viscoelasticity measurement becomes 1 MPa is 155° C. or higher, and the storage elastic modulus of 20 to 200 MPa at 25° C.,', 'a tensile strength of 20 to 80 MPa, and', 'elongation at break of 500 to 900%; and, 'the polyurethane has'}circuit wiring formed so as to be in contact with a surface of the film.2. The bendable wiring board according to claim 1 , wherein the polyisocyanate has a constituent unit derived from 1 claim 1 ,4-bis(isocyanatomethyl)cyclohexane with a trans isomer at a proportion of 70% to 95%.3. The bendable wiring board according to claim 1 , wherein the long-chain polyol has a number average molecular weight of 500 to 3 claim 1 ,500.4. The bendable wiring board according to claim 1 , wherein the polyurethane is a thermoplastic polyurethane claim 1 , and the film is a single-layer film.5. An elastic (stretchable and shrinkable) wiring board claim 1 , ...

METAL LAMINATE WITH POLYIMIDE RESIN AND METHOD FOR MANUFACTURING THE SAME

A metal laminate comprising a metal layer and an insulating layer is provided. The insulating layer is disposed on the metal layer and directly contacts the metal layer. The insulating layer is made of a polyimide resin, and the polyimide resin is derived from at least two dianhydrides and at least two diamines. The dianhydride monomers are selected from the group consisting of p-phenylenebis (trimellitate anhydride), 4,4′-(hexafluoroisopropylidene)-diphthalic anhydride, 4,4′-(4,4′-isopropylidenediphenoxy)bis(phthalic anhydride) and the combination thereof. One of the diamine monomers is 2,2′-bis(trifluoromethyl)benzidine, and the other diamine monomers are selected from the group consisting of 2,2-bis[4-(4-aminophenoxy)phenyl, 1,3-bis(4-aminophenoxy)benzene, p-phenylenediamine, 4,4′-oxydianiline, 4,4′-methylenedianiline, 4,4′-diaminobenzanilide, 4,4′-diaminodiphenyl-sulfone, m-tolidine, 2,2-bis[4-(4-aminophenoxy)phenyl]hexafluoropropane and the combination thereof. A molar ratio of the dianhydride monomers to the diamine monomers is between 0.85 and 1.15. 1. A metal laminate comprisinga first metal layer; andan insulating layer disposed on the metal layer and directly contacts the metal layer;wherein the insulating layer is made of a polyimide resin, and the polyimide resin is derived from at least two dianhydride monomers and at least two diamine monomers,wherein the dianhydride monomers are selected from the group consisting of p-phenylenebis(trimellitate anhydride), 4,4′-(hexafluoroisopropylidene)-diphthalic anhydride, 4,4′-(4,4′-isopropylidenediphenoxy)bis(phthalic anhydride) and the combination thereof; one of the diamine monomers is 2,2′-bis(trifluoromethyl)benzidine, and the other diamine monomers are selected from a group consisting of 2,2-bis[4-(4-aminophenoxy)phenyl, 1,3-bis(4-aminophenoxy)benzene, p-phenylenediamine, 4,4′-oxydianiline, 4,4′-methylenedianiline, 4,4′-diaminobenzanilide, 4,4′-diaminodiphenyl-sulfone, m-tolidine, 2,2-bis[4-(4-aminophenoxy) ...

PRINTED CIRCUIT BOARD AND ELECTRONIC COMPONENT

A printed circuit board according to an embodiment of the present invention includes a base film containing, as a main component, a polyimide and a conductive pattern disposed on at least one surface of the base film. The conductive pattern includes a copper particle bond layer which is fixed to the base film. An external transmittance for a wavelength of 500 nm in a conductive pattern non-formed region of the base film is 70% or less of an internal transmittance for a wavelength of 500 nm in a middle layer portion of the base film. 1. A printed circuit board comprising:a base film containing, as a main component, a polyimide; anda conductive pattern disposed on at least one surface of the base film,wherein the conductive pattern includes a copper particle bond layer which is fixed to the base film, andan external transmittance for a wavelength of 500 nm in a conductive pattern non-formed region of the base film is 70% or less of an internal transmittance for a wavelength of 500 nm in a middle layer portion of the base film.2. The printed circuit board according to claim 1 , wherein the middle layer portion of the base film is a portion excluding at least a modified surface layer.3. The printed circuit board according to claim 1 , wherein the base film does not substantially contain a pigment.4. The printed circuit board according to claim 1 , wherein the external transmittance for a wavelength of 500 nm in the conductive pattern non-formed region of the base film is 15% or less.5. An electronic component comprising the printed circuit board according to and an element mounted on the printed circuit hoard. The present invention relates to a printed circuit board and an electronic component.The present application is based upon and claims the benefit of priority from Japanese Patent Application No. 2015-160591, filed Aug. 17, 2015, the entire contents of which are incorporated herein by reference.There is a known printed circuit board which includes a base film and a ...

PRINTED CIRCUIT BOARD AND ELECTRONIC COMPONENT

A printed circuit board according to an embodiment of the present invention includes a base film having an insulating property and a conductive pattern disposed on at least one surface of the base film. The conductive pattern includes a copper particle bond layer which is fixed to the base film, and a lightness L* of a conductive pattern non-formed region of the base film is 60 or less. The base film may include a modified layer on one surface side thereof. 1. A printed circuit board comprising:a base film having an insulating property; anda conductive pattern disposed on at least one surface of the base film,wherein the conductive pattern includes a copper particle bond layer which is fixed to the base film, anda lightness L* of a conductive pattern non-formed region of the base film is 60 or less.2. The printed circuit board according to claim 1 , wherein the base film includes a modified layer on one surface side thereof.3. The printed circuit board according to claim 1 , wherein the base film does not substantially contain a pigment.4. The printed circuit board according to claim 1 , wherein a main component of the base film is a polyimide.5. The printed circuit board according to claim 1 , wherein a chromaticity b* of the conductive pattern non-formed region of the base film is 60 or less.6. The printed circuit board according to claim 1 , wherein the absolute value of a difference between a lightness L* of one surface of the conductive pattern and the lightness L of the conductive pattern non-formed region of the base film is 10 or more.7. An electronic component comprising the printed circuit board according to and an element mounted on the printed circuit board. The present invention relates to a printed circuit board and an electronic component.The present application is based upon and claims the benefit of priority from Japanese Patent Application No. 2015-160592, filed Aug. 17, 2015, the entire contents of which are incorporated herein by reference.There ...

SENSOR DEVICE WITH A FLEXIBLE ELECTRICAL CONDUCTOR STRUCTURE

A sensor device for integration in an electrical circuit, including a support layer (), which is formed with a release layer; at least one flexible insulating layer (), which is made using a printing method; and at least one flexible electrical conductor structure (), which is applied with a printing method onto the insulating layer (). The insulating layer () and the conductor structure () form a flexible unit, which is removable without damage from the support layer (). 1. A sensor device for integration into an electrical circuit , comprising:{'b': '12', 'a support layer (′), which is formed with a release layer;'}{'b': 14', '14', '32, 'at least one flexible insulating layer (, ′, ) produced by a printing method; and'}{'b': 10', '20', '34', '14, 'at least one flexible electrical conductor structure (, ′, ), which is applied with a printing method onto the insulating layer (),'}{'b': 14', '14', '32', '10', '20', '34', '12, 'wherein the insulating layer (, ′, ) and the conductor structure (, ′, ) form a flexible unit, wherein said flexible unit is removable without damage from the support layer ().'}2141432202034. The sensor device according to claim 1 , wherein the insulating layer ( claim 1 , ′ claim 1 , ) and/or the conductor structure ( claim 1 , ′ claim 1 , ) is made with a print screen method.322. The sensor device according to claim 1 , further comprising an adhesive layer () for attachment to a substrate.424. The sensor device according to claim 3 , wherein the substrate is provided with a covering ().5141432. The sensor device according to claim 1 , wherein the insulating layer ( claim 1 , ′ claim 1 , ) is made from a lacquer.6. The sensor device according to claim 5 , wherein the lacquer is a modified lacquer.7. The sensor device according to claim 1 , wherein the insulating layer is formed at least in regions as multi-layered.8202032. The sensor device according to claim 1 , wherein the conductor structure ( claim 1 , ′ claim 1 , ) is formed from a ...

MULTILAYER BOARD

In a flexible board including laminated resin layers containing the same thermoplastic resin as a principal material, a rigid portion includes a region in which a first resin layer is disposed between a second resin layer defining an upper principal surface and a third resin layer defining a lower principal surface so that the rigid portion has a large thickness, and a flexible portion includes a region in which the first resin layer is not disposed between the second and third resin layers so that the flexible portion has flexibility, a step portion at which a thickness changes is between the rigid and flexible portions, and the second and third resin layers extend in a region from the rigid portion beyond the step portion to the flexible portion. 1. A multilayer board comprising:a first resin base material portion;a second resin base material portion; anda third resin base material portion; whereinthe first, second and third resin base material portions include a same thermoplastic resin as a principal material and are laminated on each other; whereinthe first resin base material portion defines a first principal surface of the multilayer board;the second resin base material portion defines a second principal surface of the multilayer board;the third resin base material portion is provided between the first resin base material portion and the second resin base material portion in a lamination direction of the multilayer board;a step portion at which a thickness of the multilayer board changes is provided between a flexible portion which has flexibility and in which the third resin base material portion is not disposed and a thick portion in which the third resin base material portion is disposed so that the thick portion has a thickness larger than that of the flexible portion;the first resin base material portion and the second resin base material portion extend in a region from the thick portion beyond the step portion to the flexible portion; andthe first resin ...

FLEXIBLE SUBSTRATE

A flexible substrate includes a circuit board, a flexible heat-dissipating structure and an adhesive. The circuit board has a substrate and a circuit layer formed on a top surface of the substrate, and the flexible heat-dissipating structure has a flexible supporting plate and a flexible heat-dissipating metal layer formed on a surface of the flexible supporting plate. The flexible heat-dissipating metal layer of the flexible heat-dissipating structure is connected with a bottom surface of the substrate by the adhesive. The circuit layer and the flexible heat-dissipating metal layer are made of same material. 1. A flexible substrate comprising:a circuit board including a substrate and a circuit layer, wherein the substrate has a top surface and a bottom surface, the circuit layer is formed on the top surface, and the top surface has a chip-disposing area;a flexible heat-dissipating structure connected with the bottom surface of the substrate including a flexible supporting plate and a flexible heat-dissipating metal layer, wherein the flexible supporting plate comprises a surface facing toward the bottom surface of the substrate, the flexible heat-dissipating metal layer is formed on the surface of the flexible supporting plate, located underneath the chip-disposing area and not electrically connected to the circuit layer, wherein the substrate and the flexible supporting plate are made of same material; andan adhesive formed on the flexible heat-dissipating metal layer, wherein the flexible heat-dissipating metal layer is directly connected with the bottom surface of the substrate by the adhesive.2. The flexible substrate in accordance with claim 1 , wherein the flexible heat-dissipating metal layer has a lateral surface claim 1 , and the flexible supporting plate has a side wall coplanar with the lateral surface.3. The flexible substrate in accordance with claim 2 , wherein the flexible heat-dissipating structure further includes a protecting layer covering the ...

Paste sealant and sealing method

A paste sealant capable of shortening sealing and molding cycles in spite of containing an aqueous medium and a sealing method of using the sealant are provided. The paste sealant for molding and sealing a device comprises a copolyamide-series resin and an aqueous medium. The copolyamide-series resin may be a crystalline resin. The copolyamide-series resin may have a melting point or softening point of 75 to 160° C. The copolyamide-series resin may be a multiple copolymer, e.g., a binary or ternary copolymer. Further, the copolyamide-series resin may contain a unit derived from a long-chain component having a C 8-16 alkylene group (at least one component selected from the group consisting of a C 9-17 lactam and an aminoC 9-17 alkanecarboxylic acid). The paste sealant may further contain a thickener [e.g., a (meth)acrylic polymer].

Preparation method of flexible transparent circuit

A manufacturing method of a flexible transparent circuit includes preparing a circuit template. The method further includes using a flexible transparent polymer material to prepare a cured transparent carrier on the circuit template, wherein the cured transparent carrier has a groove circuit structure. The method includes coating a solution containing a conductive material in a groove of the cured transparent carrier. The method further includes forming a circuit with the high transparency and conductivity after the solvent is volatilized. The circuit are designed and manufactured according to the requirements, and the precision thereof is able to achieve the micron or nanometer level. The formed circuit is light. The circuit can be stretched, bended or twisted many times. The circuit has a good biological compatibility. The circuit manufactured by such method is expected to be applied in various fields such as smart contact lens, flexible transparent electron devices, electronic skins.

APPLICATION SPECIFIC ELECTRONICS PACKAGING SYSTEMS, METHODS AND DEVICES

Depicted embodiments are directed to an Application Specific Electronics Packaging (“ASEP”) system, which enables the manufacture of additional products using reel to reel () manufacturing processes as opposed to the “batch” processes used to currently manufacture electronic products and MIDs. Through certain ASEP embodiments, it is possible to integrate connectors, sensors, LEDs, thermal management, antennas, RFID devices, microprocessors, memory, impedance control, and multi-layer functionality directly into a product. 1. A method of manufacturing electronic devices comprising:forming a continuous carrier formed of an electrically conductive material;molding a plurality of non-conductive substrates onto the carrier;forming traces on the substrates;electroplating the traces;electrically attaching components to the traces to form a plurality of devices;singulating one of the devices from the remainder of the carrier.2. The method of claim 1 , wherein forming the traces comprises:ablating the substrate with a laser;depositing an ink on the ablated surface; andsintering the ink.3. The method of claim 1 , wherein pockets are molded into the substrate such that portions of the carrier are exposed.4. A device comprising:a singulated carrier portion;a substrate molded onto the singulated carrier portion;seed layer traces on the substrate;plated metal traces on the seed layer traces; anda component electrically attached to at least one plated metal trace.5. The device of claim 4 , wherein the device comprises at least one of a printed circuit board claim 4 , a flex circuit claim 4 , a connector claim 4 , a thermal management feature claim 4 , EMI shielding claim 4 , a high current conductor claim 4 , an RFID apparatus claim 4 , an antenna claim 4 , a wireless power device claim 4 , a sensor claim 4 , a MEMS apparatus claim 4 , an LED device claim 4 , a microprocessor claim 4 , a memory device claim 4 , an ASIC claim 4 , a passive device claim 4 , an impedance control ...

PHOTOSENSITIVE RESIN COMPOSITION, SOLDER RESIST FILM USING SAID PHOTOSENSITIVE RESIN COMPOSITION, FLEXIBLE PRINTED CIRCUIT AND IMAGE DISPLAY DEVICE

The present invention provides a photosensitive resin composition with which a dry resist film can be obtained, the dry resist film exhibiting excellent storage stability and migration resistance in thickness direction thereof. This photosensitive resin composition comprises: a photosensitive prepolymer having a carboxyl group and an ethylenically unsaturated group; a photopolymerization initiator; and a thermosetting agent. The thermosetting agent is a polycarbodiimide compound represented by formula (1), in which a carbodiimide group is protected by an amino group that dissociates at temperatures of 80° C. or greater. The polycarbodiimide compound has a weight average molecular weight of 300-3000, and a carbodiimide equivalent weight of 150-600. In formula (1), R, R, X, X, and n are as defined in the description. 2. The photosensitive resin composition according to claim 1 ,wherein the carbodiimide of the polycarbodiimide compound has 2 to 5 functional groups.3. The photosensitive resin composition according to claim 1 ,wherein the carbodiimide equivalent of the polycarbodiimide compound is 0.9 to 1.3 equivalents with respect to the carboxyl group of the photosensitive prepolymer.4. The photosensitive resin composition according to claim 1 , used for a solder resist film.5. A solder resist film formed using the photosensitive resin composition according to .6. A flexible printed circuit comprising:an insulating layer;a wiring pattern made of a conductive material and provided on the insulating layer; anda solder resist layer provided on the wiring pattern,{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'wherein the solder resist layer is formed using the photosensitive resin composition according to .'}7. The flexible printed circuit according to claim 6 , further comprising:a shield layer on the solder resist layer, the shield layer containing a conductive material,{'sup': '7', 'wherein the flexible printed circuit keeps a resistance value of 1.0×10Ω or more ...

THERMAL EXPANDABILITY ADJUSTER, USE AS THERMAL EXPANDABILITY ADJUSTER, THERMOSET RESIN COMPOSITION, INSULATING MATERIAL, SEALING MATERIAL AND CONDUCTIVE PASTE EACH CONTAINING THERMOSET RESIN COMPOSITION, CURED PRODUCTS, PREPREG AND MEMBER OBTAINED BY CURING THERMOSET RESIN COMPOSITION OF PREPREG, METHOD OF ADJUSTING THERMAL EXPANSION RATE, AND MEMBER MANUFACTURED USING METHOD OF ADJUSTING

A thermal expandability adjuster is provided which contains a glycoluril derivative compound represented by formula (1) below. The thermal expandability adjuster can reduce the linear thermal expansion coefficient of a cured product of a thermoset resin composition used for an insulating resin layer or the like and is effective for suppressing deformation of a circuit substrate due to heating. Compounding the above thermal expandability adjuster can reduce the linear thermal expansion coefficient of a cured product obtained by curing a thermoset resin composition and it is therefore possible to provide a member that exhibits small deformation due to heat. 3. A thermoset resin composition comprising the thermal expandability adjuster as recited in .4. An insulating material comprising the thermoset resin composition as recited in .5. A sealing material comprising the thermoset resin composition as recited in .6. A conductive paste comprising the thermoset resin composition as recited in .7. A cured product obtained by curing the thermoset resin composition as recited in .8. The cured product as recited in having a linear thermal expansion coefficient of 40 ppm/° C. or less.9. The cured product as recited in having a glass transition temperature of 180° C. or higher.10. A substrate material comprising the thermoset resin composition as recited in .11. A prepreg obtained by impregnating a base material with the thermoset resin composition as recited in .12. A member obtained by curing the sealing material as recited in .13. A method of adjusting a linear thermal expansion coefficient of a member claim 5 , comprising:{'claim-ref': {'@idref': 'CLM-00003', 'claim 3'}, 'a measurement step of measuring a linear thermal expansion coefficient of a member obtained by curing the thermoset resin composition as recited in ; and'}an adjustment step of adjusting at least one of a usage of the thermoset resin composition and a content of a thermal expansion rate adjuster in the ...

TRIAZOLE SILANE COMPOUND, METHOD FOR SYNTHESIZING SAID COMPOUND AND USE THEREOF

The abstract of the international application is being replace by the following abstract: The purpose of the present invention is to provide: a novel triazole silane compound and a method for synthesizing the same, and a silane coupling agent containing the triazole silane compound as a component; and a surface treatment solution, a surface treatment method, and a method for bonding two different materials, which use said triazole silane compound. 5. The surface treatment solution according to claim 4 , which is used for treating a surface of at least one material selected from the group consisting of a metal claim 4 , an inorganic material and a resin material.6. The surface treatment solution according to claim 4 , which is used for bonding two materials selected from the group consisting of a metal claim 4 , an inorganic material and a resin material.711-. (canceled)12. A surface treatment method of metal claim 4 , comprising bringing the surface treatment solution described in into contact with a surface of a metal.1314-. (canceled)15. The surface treatment method of metal according to claim 12 ,wherein the metal is copper or a copper alloy, andthe method comprises, before bringing the surface treatment solution into contact with a surface of copper or a copper alloy, bringing an aqueous solution containing a copper ion into contact with the surface of the copper or the copper alloy.16. The surface treatment method of metal according to claim 12 ,wherein the metal is copper or a copper alloy, andthe method comprises, after bringing the surface treatment solution into contact with a surface of copper or a copper alloy, bringing an aqueous acidic solution or an aqueous alkaline solution into contact with the surface of the copper or the copper alloy.17. A surface treatment method of an inorganic material claim 4 , comprising bringing the surface treatment solution described in into contact with a surface of an inorganic material.1819-. (canceled)20. A surface ...

Resin composition, and prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board each obtained using said resin composition

A resin composition is provided and contains (A) a thermosetting compound having a styrene structure or a (meth)acrylate structure, and (B) a maleimide compound represented by the following formula (1) (in the formula, p represents an integer of 1 to 10), in which the content ratio of the component (A) to the component (B) is (A):(B)=20:80 to 90:10 in mass ratio.

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

A conductor trace is formed on a base insulating layer. The conductor trace includes two terminal portions and one wiring portion. The wiring portion is formed to connect the two terminal portions to each other and extend from each terminal portion. A metal cover layer is formed to cover the terminal portion and the wiring portion of the conductor trace and continuously extend from a surface of the terminal portion to a surface of the wiring portion. The metal cover layer is made of metal having magnetism lower than magnetism of nickel, and is made of gold, for example. A cover insulating layer is formed on the base insulating layer to cover a portion, of the metal cover layer formed on the conductor trace, covering the wiring portion and not to cover a portion of the metal cover layer covering the terminal portion. 1. A printed circuit board comprising:a first insulating layer;a conductor trace that is formed on the first insulating layer and has a terminal portion and a wiring portion extending from the terminal portion;a first metal cover layer provided to cover the wiring portion and the terminal portion and continuously extend from a surface of the terminal portion to a surface of the wiring portion; anda second insulating layer provided on the first insulating layer to cover a portion of the first metal cover layer covering the wiring portion and not to cover a portion of the first metal cover layer covering the terminal portion, whereinthe first metal cover layer comes into contact with the wiring portion,the second insulating layer comes into contact with the portion of the first metal cover layer covering the wiring portion, andthe first metal cover layer has magnetism lower than magnetism of nickel.2. A printed circuit board comprising:a first insulating layer;a conductor trace that is formed on the first insulating layer and has a terminal portion and a wiring portion extending from the terminal portion;a first metal cover layer provided to cover the ...

LAMINATE, CONDUCTIVE PATTERN, AND METHOD FOR PRODUCING LAMINATE

Provided is a laminate in which at least a layer including a support, a primer layer, a first conductive layer, an insulating layer, and a second conductive layer are laminated, wherein the insulating layer is formed by coating at least a portion of or entirety of a surface of the first conductive layer with a resin composition and drying the resin composition; and the second conductive layer includes a second plating seed layer formed by coating a portion of or entirety of a surface of the insulating layer with a fluid containing a conductive substance, and a second plating layer formed on a surface of the second plating seed layer. This laminate has high adhesion between layers and allows the high adhesion to be maintained even upon exposure to a high-temperature and high-humidity environment. 110-. (canceled)11. A laminate having a structure in which at least a layer including a support , a first primer layer , a first conductive layer , an insulating layer , a second primer layer , and a second conductive layer are laminated , wherein the first conductive layer includes a first plating seed layer formed by coating a portion of or entirety of a surface of the first primer layer with a fluid containing a conductive substance that is a transition metal or a compound of a transition metal , and a first plating layer formed on a surface of the first plating seed layer; and the second conductive layer includes a second plating seed layer formed by coating a portion of or entirety of a surface of the second primer layer with a fluid containing a conductive substance that is a transition metal or a compound of a transition metal , and a second plating layer formed on a surface of the second plating seed layer.121. The laminate according to claim 11 , wherein the first primer layer (B-) and the second primer layer contain at least one resin selected from the group consisting of a urethane resin claim 11 , a vinyl resin claim 11 , and a urethane-vinyl composite resin.13. ...

FLEXIBLE LED ASSEMBLY WITH UV PROTECTION

Flexible LED assemblies are described. More particularly, flexible LED assemblies having substrates with conductive features positioned on or in the substrate, and layers of ceramic positioned over exposed portions of the substrate to protect against UV degradation, as well as methods of making such assembles, are described. 1. A method of making an LED assembly , the method comprising:applying a ceramic to the surface of a substrate to form a ceramic layer, the substrate comprising, prior to application of the ceramic, first portions on which the exposed top surface is polymer and second portions on which the exposed top surface is a conductive metal,removing the ceramic from the second portions of the surface of the substrate, andsurface finishing the conductive metal in the second portions of the surface of the substrate.2. The method of claim 1 , wherein removing the ceramic from the second portions of the surface of the substrate comprises laminating a tacky liner onto the regions of ceramic corresponding to the second portions claim 1 , and peeling the ceramic from the second portions by removing the tacky liner.3. The method of claim 1 , wherein removing the ceramic from the second portions of the surface of the substrate comprises utilizing a bristle brush technique.4. The method of claim 1 , wherein removing the ceramic from the second portions of the surface of the substrate comprises micro-etching the ceramic.5. The method of claim 1 , wherein the conductive metal comprises copper.6. The method of claim 1 , wherein surface finishing the conductive metal comprises electroless plating claim 1 , electroplating claim 1 , or immersion plating.7. The method of claim 1 , wherein surface finishing the conductive metal comprises first plating a layer of nickel and then plating a layer of gold or silver.8. The method of claim 1 , wherein the ceramic is applied using a sputtering process.9. The method of claim 1 , wherein the ceramic comprises aluminum nitride. The ...

HIGH VOLTAGE POLYMER DIELECTRIC CAPACITOR ISOLATION DEVICE

An electronic isolation device is formed on a monolithic substrate and includes a plurality of passive isolation components. The isolation components are formed in three metal levels. The first metal level is separated from the monolithic substrate by an inorganic PMD layer. The second metal level is separated from the first metal level by a layer of silicon dioxide. The third metal level is separated from the second metal level by at least 20 microns of polyimide or PBO. The isolation components include bondpads on the third metal level for connections to other devices. A dielectric layer is formed over the third metal level, exposing the bondpads. The isolation device contains no transistors. 1. An isolation device , comprising:a monolithic substrate;a pre-metal dielectric (PMD) layer disposed over said monolithic substrate, said PMD layer including silicon dioxide;a first metal level disposed over said PMD layer;a silicon dioxide layer disposed over said first metal layer;a second metal layer disposed over said silicon dioxide layer, said second metal level extending into lower via holes in said silicon dioxide layer to form lower vias which make electrical connections to said first metal level;a polymer dielectric layer disposed over said second metal level, said polymer dielectric layer comprising primarily a layer of polymer selected from the group consisting of polyimide and poly(p-phenylene-2,6-benzobisoxazole) (PBO), said polymer being at least 20 microns thick;a third metal level disposed over said polymer dielectric layer, said third metal level extending into upper via holes in said polymer dielectric layer to form upper vias which make electrical connections to said second metal level;bondpads disposed over said third metal level; anda dielectric overcoat dielectric layer disposed over said third metal level, said dielectric overcoat dielectric layer exposing said bondpads;said isolation device containing a plurality of isolation components, selected ...

FLEXIBLE PRINTED CIRCUIT BOARD WITH COMPONENT MOUNTING SECTION FOR MOUNTING ELECTRONIC COMPONENT AND FLEXIBLE CABLE SECTIONS EXTENDING IN DIFFERENT DIRECTIONS FROM THE COMPONENT MOUNTING SECTION

[Problem] To allow an efficient sheet layout of a flexible printed circuit board having a plurality of cable sections extending in different directions and to improve a yield.

Poly(amic acid) composition and polyimide composition

There is provided a polyimide composition that is useful for electronic substrate materials, retains high heat resistance and mechanical strength intrinsic to polyimides, and has a lower dielectric constant and dielectric loss tangent. A polyimide composition for use in electronic substrate materials, containing a polyimide produced by polymerization between a diamine component containing 5-(4-aminophenoxy)-3-[4-(4-aminophenoxy)phenyl]-1,1,3-trimethylindan and an acid component containing 3,3′,4,4′-biphenyltetracarboxylic acid dianhydride.

FLEXIBLE PRINTED CIRCUIT BOARD ASSEMBLY

The invention provides a printed circuit board assembly () comprising (i) an at least partly folded flexible printed circuit board (), and (ii) an at least partly folded support (), wherein:—the at least partly folded flexible printed circuit board () comprises a first PCB region () and a second PCB region (), wherein at least part of the second PCB region () is configured folded over at least part of the first PCB region ();—the at least partly folded support () is configured to support at least part of the at least partly folded flexible printed circuit board (), wherein the at least partly folded support () comprises a first support region () and a second support region (), wherein at least part of the second support region () is configured folded over at least part of the first support region (), wherein at least part of the at least partly folded flexible printed circuit board () is configured between the first support region () and the second support region (), and wherein the at least partly folded support () is configured to maintain the at least partly folded flexible printed circuit board () folded. 1. A printed circuit board assembly comprising (i) an at least partly folded flexible printed circuit board , and (ii) an at least partly folded support , wherein:the at least partly folded flexible printed circuit board comprises a first PCB region and a second PCB region, wherein at least part of the second PCB region is configured folded over at least part of the first PCB region;the at least partly folded support is configured to support at least part of the at least partly folded flexible printed circuit board, wherein the at least partly folded support comprises a first support region and a second support region, wherein at least part of the second support region is configured folded over at least part of the first support region, wherein at least part of the at least partly folded flexible printed circuit board is configured between the first support ...

Resin composition, printed circuit board using the composition, and method of manufacturing the same

A resin composition, a printed circuit board using the composition, and a method of manufacturing the printed circuit board. The resin composition includes: a photopolymerizable compound, such as one having an ethylenically unsaturated bond which is polymerizable in a molecule, a photoinitiator, and a surface-modified silica by an alkyl sulfonated tetrazole compound.

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

There are provided a printed circuit board including: an insulation layer in which a via hole is formed; vias formed in the via hole; first circuit patterns formed below the insulation layer and electrically connected to the vias; and second circuit patterns formed on the insulation layer to be bonded to the vias; wherein the via has a diameter smaller than that of the via hole, and a method of manufacturing a printed circuit board. 1. A printed circuit board comprising:an insulation layer in which a via hole is formed;vias formed in the via hole;first circuit patterns formed below the insulation layer and electrically connected to the vias; andsecond circuit patterns formed on the insulation layer to be bonded to the vias;wherein the via has a diameter smaller than that of the via hole.2. The printed circuit board of claim 1 , wherein one side surface of the via contacts the insulation layer claim 1 , and the other side surface thereof does not contact the insulation layer.3. The printed circuit board of claim 1 , wherein the second circuit patterns have a diameter smaller than that of the via hole.4. The printed circuit board of claim 1 , wherein the first circuit patterns have a diameter smaller than that of the via hole.5. The printed circuit board of claim 1 , wherein the second circuit patterns have a diameter different from that of the via.6. The printed circuit board of claim 1 , wherein a plurality of vias are spaced apart from each other in the via hole.7. The printed circuit board of claim 1 , further comprising a via land formed below the insulation layer and bonded to a lower surface of the via.8. The printed circuit board of claim 7 , wherein the first circuit patterns are bonded to the via land.9. A method of manufacturing a printed circuit board comprising:forming a second insulation layer on the first insulation layer in which a via land is formed;forming a via hole exposing the via land in the second insulation layer;forming a plating resist in ...

METHOD FOR MANUFACTURING MULTILAYER WIRING SUBSTRATE

To provide a method for manufacturing a multilayer wiring substrate, in which an insulating layer and a metal foil provided thereon are integrally laminated on an inner layer material having a wiring formed thereon, in which a hole for via hole is formed in the metal foil and the insulating layer, and in which the hole for via hole is filled with an electrolytic filled plating layer after a base electroless plating layer is formed, the method being featured in that, after the base electroless plating layer is formed, first, an electrolysis filled plating layer is formed to the extent that the hole for via hole is not completely filled, and then, after the surface of the electrolytic filled plating layer is etched, the hole for via hole is completely filled by an electrolytic filled plating layer. 1. A method for manufacturing a multilayer wiring substrate including:{'b': '1', 'step () of integrally laminating an inner layer material having an inner layer wiring formed thereon, an insulating layer, and a metal foil for upper layer wiring, and providing, in the metal foil for upper layer wiring and the insulating layer, a hole for via hole extending from the metal foil for upper layer wiring to reach the inner layer wiring;'}{'b': '2', 'step () of forming a base electroless plating layer in the hole for via hole and on the metal foil for upper layer wiring, and then filling the hole for via hole by forming an electrolytic filled plating layer, and forming a via hole connecting the metal foil for upper layer wiring and the inner layer wiring; and'}{'b': '3', 'step () of forming an upper layer wiring by forming, after forming the electrolytic filled plating layer, the metal foil for upper layer wiring into a wiring,'}{'b': '2', 'wherein, in step (), filling of the hole for via hole is separately performed twice or more by forming the electrolytic filled plating layer, and'}the electrolytic filled plating layer, formed in the hole for via hole and on the metal foil for ...

POLYIMIDE POROUS BODY AND METHOD FOR PRODUCING SAME

An object of the present invention is to provide a polyimide porous body having an excellent heat resistance, a fine cell structure, and a low relative dielectric constant, and a method for producing the polyimide porous body. The present invention relates to a method for producing a polyimide porous body, comprising a step for applying a polymer solution containing a polyamide acid, a phase separation agent for separating the phases of the polyamide acid, an imidization catalyst, and a dehydrating agent, on a substrate, and drying the polymer solution to produce a phase-separated structure body having a microphase-separated structure; a step for producing a porous body by removing the phase separation agent from the phase-separated structure body; and a step for subjecting the polyamide acid in the porous body to imidization to synthesize a polyimide. 1. A method for producing a polyimide porous body , comprising a step for applying a polymer solution containing a polyamide acid , a phase separation agent for separating the phases of the polyamide acid , an imidization catalyst , and a dehydrating agent , on a substrate , and drying the polymer solution to produce a phase-separated structure body having a microphase-separated structure; a step for producing a porous body by removing the phase separation agent from the phase-separated structure body; and a step for subjecting the polyamide acid in the porous body to imidization to synthesize a polyimide.2. The method for producing a polyimide porous body according to claim 1 , wherein the phase separation agent is removed by solvent extraction.3. The method for producing a polyimide porous body according to claim 2 , wherein the solvent is liquefied carbon dioxide claim 2 , subcritical carbon dioxide claim 2 , or supercritical carbon dioxide.4. The method for producing a polyimide porous body according to claim 1 , wherein the phase separation agent is removed by heating.5. The method for producing a polyimide ...

Resin composition, and prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board each obtained using said resin composition

One aspect of the present invention relates to a resin composition containing (A) a thermosetting compound having a styrene structure or a (meth)acrylate structure, and (B) at least one of maleimide compounds represented by the formulas (1) to (3).

FLEXIBLE WIRING SUBSTRATE, ELECTRO-OPTICAL DEVICE, AND ELECTRONIC APPARATUS

A flexible wiring substrate includes a main substrate having flexibility, a main wiring disposed over the main substrate, a second protective sheet covering the main wiring, and an insulating member partially covering the main wiring exposed from the second protective sheet and being thinner in thickness than the second protective sheet. 1. A flexible wiring substrate , comprising:a base member having flexibility;a wiring disposed over the base member;a protective member covering the wiring; andan insulating member partially covering the wiring exposed from the protective member, and being thinner in thickness than the protective member.2. The flexible wiring substrate according to claim 1 , wherein in plan view of the base member claim 1 , the insulating member partially overlaps the protective member.3. The flexible wiring substrate according to claim 2 , wherein the insulating member covers a side face of the protective member.4. The flexible wiring substrate according to claim 1 , wherein the insulating member includes a photosensitive resin material.5. The flexible wiring substrate according to claim 1 , wherein the insulating member includes a solder resist.6. The flexible wiring substrate according to claim 1 , comprising a plurality of terminals claim 1 , whereinthe insulating member is provided along a direction in which the plurality of terminals are aligned.7. The flexible wiring substrate according to claim 1 , wherein the protective member includes a polyimide.8. An electro-optical device claim 1 , comprising:an electro-optical panel including a semiconductor substrate and a panel-side terminal provided along one side of the semiconductor substrate; and{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'the flexible wiring substrate according to , wherein'}a wiring of the flexible wiring substrate is electrically coupled with the panel-side terminal.9. The electro-optical device according to claim 8 , wherein the insulating member included in the ...

Package structure and manufacturing method thereof

A package structure includes a circuit substrate, at least one electronic component, and a connecting slot. The circuit substrate includes at least one core layer, a build-up structure including at least three patterned circuit layers, at least two dielectric layers and conductive through holes, and circuit pads. The electronic component is embedded in at least one of the dielectric layers and located in a disposition area. The electronic component is electrically connected to one of the patterned circuit layers through a portion of the conductive through holes. The connecting slot has a bottom portion, a plurality of sidewall portions connecting the bottom portion, and a plurality of connecting pads located on the sidewall portions. The circuit substrate is assembled to the bottom portion, and the circuit pads are electrically connected to the connecting pads through a bent area of the core layer that is bent relative to the disposition area.

WEARABLE POWER MANAGEMENT SYSTEM

A wearable power management system includes: a bottom coating layer; a bottom center layer disposed above the bottom coating layer; a circuit layer disposed above the bottom center layer; 1. A wearable power management system comprising:a bottom coating layer;a bottom center layer disposed above the bottom coating layer;a circuit layer disposed above the bottom center layer;a top center layer disposed above the circuit layer; anda top coating layer disposed above the top center layer; wherein:the Young's modulus of both the bottom center layer and the top center layer is in the range of 2.5 kPa-4.5 kPa.2. The wearable power management system of claim 1 , wherein the Young's modulus of both the bottom coating layer and the top coating layer is in the range of 50 kPa-70 kPa and the thickness of both the bottom coating layer and the top coating layer is in the range of 250 um-350 um.3. The wearable power management system of claim 1 , wherein the circuit layer comprises a device layer and a connection layer disposed above the device layer; the connection layer comprises a connection wire network claim 1 , the connection wire network comprising a plurality of connection wires and overlapping with the device matrix; the connection wires essentially have a shape of sine waveforms.4. The wearable power management system of claim 3 , wherein the connection layer comprises:a first polyimide layer;a copper layer disposed above the first polyimide layer; anda second polyimide layer disposed above the copper layer.5. A wearable power management system comprising:a bottom coating layer;a bottom center layer disposed above the bottom coating layer;a circuit layer disposed above the bottom center layer;a top center layer disposed above the circuit layer; anda top coating layer disposed above the top center layer; wherein:the Young's modulus of the bottom coating layer and the top coating layer is greater than the Young's modulus of the bottom center layer and the top center layer. ...

PRINTED CIRCUIT BOARD DEVICE FOR AN IMAGE CAPTURE MODULE FOR A CAMERA, IMAGE CAPTURE MODULE THAT INCLUDES A PRINTED CIRCUIT BOARD DEVICE, AND METHOD FOR MANUFACTURING A PRINTED CIRCUIT BOARD DEVICE

A printed circuit board device for an image capture module for a camera. The printed circuit board device includes a printed circuit board, an image sensor, and at least one copper layer and/or carbon layer. The printed circuit board includes a first main surface and a second main surface opposite from the first main surface. The image sensor is or may be situated on the first main surface of the printed circuit board. The copper layer that contains copper at least in part, and/or the carbon layer that contains carbon at least in part, are/is situated on the second main surface and formed for stabilization of the printed circuit board. 1. A printed circuit board device for an image capture module for a camera , the printed circuit board device comprising:a printed circuit board with a first main surface and a second main surface opposite from the first main surface;an image sensor situated on the first main surface of the printed circuit board; andat least one copper layer that contains copper at least in part, and/or a carbon layer situated on the second main surface and formed for stabilization of the printed circuit board.2. The printed circuit board device as recited in claim 1 , wherein the printed circuit board includes at least one through opening from the first main surface to the second main surface.3600. The printed circuit board device as recited in claim 2 , wherein the printed circuit board includes at least one further through opening from the first main surface to the second main surface claim 2 , a first intermediate section of the first main surface between the through opening and the further through opening being at least partially contacted by the image sensor claim 2 , and/or a second intermediate section of the second main surface between the through opening and the further through opening being at least partially contacted by the copper layer and/or the carbon layer ().4. The printed circuit board device as recited in claim 1 , wherein a first ...

Electrical Insulation Paper, Methods of Manufacture, and Articles Manufactured Therefrom

Fibrous substrates containing polyetherimides and other synthetic fibers are disclosed, along with methods of preparing electrical insulation paper and articles comprising the fibrous substrates.

TRANSLUCENT CONDUCTIVE PATTERNED MEMBER, AND TRANSLUCENT ELECTROMAGNETIC SHIELD - ANTENNA MEMBER USING SAME

Provided is a translucent conductive patterned member in which, as the metal pattern portion itself has a translucency, the metal pattern portion is hardly visible, and scattering caused by a moiré or diffraction is reduced, and in which it is also provided with sufficient conductivity. 1. A translucent conductive patterned member comprising:a base layer formed by using a compound containing a nitrogen atom; anda conductive pattern portion having a translucency formed on at least one part of the base layer by using silver or an alloy containing silver as a main component.2. The translucent conductive patterned member according to claim 1 , wherein a film thickness of the conductive pattern portion is 4 nm or more and 9 nm or less.3. The translucent conductive patterned member according to claim 1 , wherein the compound containing a nitrogen atom has a hetero cycle having the nitrogen atom as a hetero atom.4. The translucent conductive patterned member according to claim 1 , wherein the compound containing a nitrogen atom has a group having a pyridine ring.8. The translucent conductive patterned member according to claim 1 , being formed on a transparent resin film.9. A method for manufacturing a translucent conductive patterned member comprising a base layer formed by using a compound containing a nitrogen atom and a conductive pattern portion having a translucency formed on at least one part of the base layer by using silver or an alloy containing silver as a main component claim 1 ,wherein a silver or alloy layer containing silver as a main component is formed on the base layer by a vapor deposition method.10. A method for manufacturing a translucent conductive patterned member comprising a base layer formed by using a compound containing a nitrogen atom and a conductive pattern portion having a translucency formed on at least one part of the base layer by using silver or an alloy containing silver as a main component claim 1 ,wherein a silver or alloy layer ...

TOUCH SENSOR AND MANUFACTURING METHOD THEREOF

A touch sensor including a first substrate which extends in a first direction and on which first channels may be formed and stretched, a first conductive liquid injected into the first channels, a second substrate which extends in a second direction which intersects with the first direction and on which second channels may be formed and stretched, and a second conductive liquid injected into the second channels. 1. A touch sensor comprising:a first stretchable substrate comprising first channels extended in a first direction;a first conductive liquid injected into the first channels;a second stretchable substrate comprising second channels extended in a second direction crossing the first direction; anda second conductive liquid injected into the second channels.2. The touch sensor as claimed in claim 1 , wherein:at least one of the first channels or the second channels comprises straight lines and wedges, and at least one of the wedges comprises a round part;the round part comprises an inner round portion and an outer round portion; and {'br': None, 'i': W≦ROC−', 'W, '0.5×0≦0.63×'}, 'a radius of a curvature of the outer round is expressed in an equation below(where W is at least one width of the straight lines and ROC-O is the radius of the curvature of the outer round portion).3. The touch sensor as claimed in claim 2 , wherein:two adjacent first channels among the first channels comprise a first wedge and a second wedge, respectively;the first wedge and the second wedge are adjacent to each other;at least one of a length in the second direction of the first wedge and the second wedge is greater than or equal to 150 μm and less than or equal to 600 μm; anda distance between the first wedge and the second wedge is greater than or equal to 150 μm and less than or equal to 200 μm.4. The touch sensor as claimed in claim 1 , wherein the touch sensor further comprises:first electrodes inserted into first holes formed at one end of the first channels; andsecond ...

High Temperature Polyketone Copolymers

Compositions and methods for amorphous high temperature polyketone polymers incorporating 2H-benzimidazol-2-one with dihalobenzophenone and bis(halobenzoyl)benzene as comonomer units are described herein. The polyketones polymers have advantageous properties, particularly in terms of high glass transition temperatures (Tg), inherently flame resistance, good mechanical properties at elevated temperature, chemical resistance and dimensional stability in wet environment. The polymers are suitable for manufacturing high temperature molded systems and other articles of manufacture via injection molding, extrusion, compression molding, coating, blow molding, thermoforming, rotational molding and additive manufacturing.

SURFACE TREATING COMPOSITION FOR COPPER AND COPPER ALLOY AND UTILIZATION THEREOF

A surface treating composition for copper or a copper alloy comprising an imidazole compound and means for using the composition in the soldering of electronic parts to printed wiring boards are disclosed. 2. The printed wiring board according to claim 1 ,wherein the imidazole compound is present in the composition in an amount of from 0.01 wt % to 10 wt %.3. The printed wiring board according to claim 1 ,wherein the surface treating composition further comprises an organic acid or an inorganic acid, present in the composition in an amount of from 0.1 wt % to 50 wt %.4. The printed wiring board according to claim 1 ,wherein the surface treating composition further comprises a metal salt, present in the composition in an amount of from 0.01 wt % to 10 wt %.5. The printed wiring board according to claim 1 ,wherein the surface treating composition further comprises a halogen compound, present in the composition in an amount of from 0.001 wt % to 1 wt %.6. The printed wiring board according to claim 3 ,wherein the organic acid is at least one selected from the group consisting of formic acid, acetic acid, propionic acid, butyric acid, valeric acid, caproic acid, heptanic acid, caprylic acid, pelargonic acid, capric acid, lauric acid, isobutyric acid, 2-ethylbutyric acid, glycolic acid, lactic acid, 2-hydroxybutyric acid, 3-hydroxybutyric acid, gluconic acid, glyceric acid, tartaric acid, malic acid, citric acid, chloroacetic acid, dichloroacetic acid, trichloroacetic acid, bromoacetic acid, iodoacetic acid, methoxyacetic acid, ethoxyacetic acid, propoxyacetic acid, butoxyacetic acid, 2-(2-methoxyethoxy)acetic acid, 2-[2-(2-ethoxyethoxy)ethoxy]acetic acid, 2-{2-[2-(2-ethoxyethoxy)ethoxy]ethoxy}acetic acid, 3-methoxypropionic acid, 3-ethoxypropionic acid, 3-propoxypropionic acid, 3-butoxypropionic acid, levulinic acid, glyoxylic acid, pyruvic acid, acetoacetic acid, acrylic acid, crotonic acid, oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, maleic ...

ROTARY CONNECTOR

A rotary connector includes a rotor, a stator rotatably assembled on the rotor, a main flexible printed circuit having two side edges that are linear and parallel to each other, and wound and coiled within an annular space part formed between the rotor and the stator, a first sub flexible printed circuit mounted on one end part of the main flexible printed circuit, and connecting a connection terminal provided on the one end part and an external connection terminal provided on the rotor, and a second sub flexible printed circuit mounted on another end part of the main flexible printed circuit, and connecting a connection terminal provided on the other end part and an external connection terminal provided on the stator. 1. A rotary connector comprising:a rotor;a stator rotatably assembled on the rotor;a main flexible printed circuit having two side edges that are linear and parallel to each other, and wound and coiled within an annular space part formed between the rotor and the stator;a first sub flexible printed circuit mounted on one end part of the main flexible printed circuit, and connecting a connection terminal provided on the one end part and an external connection terminal provided on the rotor; anda second sub flexible printed circuit mounted on another end part of the main flexible printed circuit, and connecting a connection terminal provided on the other end part and an external connection terminal provided on the stator.2. The rotary connector as claimed in claim 1 , wherein a plurality of main flexible printed circuits are provided claim 1 , and both end parts of each of the plurality of main flexible printed circuits are mounted on the first sub flexible printed circuit and the second sub flexible printed circuit claim 1 , respectively.3. The rotary connector as claimed in claim 1 , wherein at least one of the first sub flexible printed circuit and the second sub flexible printed circuit is mounted to project in a direction crossing a circumferential ...

BLOCK POLYIMIDE, BLOCK POLYAMIDE ACID IMIDE AND USE THEREOF

The purpose of the present invention is to provide a block polyamide acid imide having an appropriate solubility in aqueous alkaline solutions, and block polyimides that are obtained using same and have high transparency and a low coefficient of linear thermal expansion (low CTE). This block polyimide comprises blocks configured from repeating structural units represented by formula (1A) and blocks configured from repeating structural units represented by formula (1B). 2. The block polyimide according to claim 1 , wherein the average values of m and n each independently are 2 to 1 claim 1 ,000.4. The block polyimide according to having a logarithmic viscosity of 0.1 to 3.0 dl/g claim 1 , the logarithmic viscosity being measured in a mixed solvent of p-chlorophenol/phenol=9:1 (weight ratio) at a concentration of 0.5 g/dl and at 35° C.5. The block polyimide according to claim 1 , wherein a film of the block polyimide has a glass transition temperature (Tg) of 260° C. or more as measured by TMA method under a tensile mode at a temperature range of 25° C. to 350° C. claim 1 , a temperature-raising rate of 5° C./min. claim 1 , and a load of 14 g/mm.6. The block polyimide according to claim 1 , wherein the film of the block polyimide has a coefficient of linear thermal expansion of 30 ppm/K or less as measured by TMA method under a tensile mode at a temperature range of 25° C. to 350° C. claim 1 , a temperature-raising rate of 5° C./min. claim 1 , and a load of 14 g/mm.7. The block polyimide according to claim 1 , wherein the film of the block polyimide has a total light transmittance of 80% or more as measured in accordance with JIS K 7105.9. The block polyamic acid imide according to claim 8 , wherein the average values of m and n each independently are 2 to 1 claim 8 ,000.10. The block polyamic acid imide according to claim 8 , wherein a polyimide composed of the repeating structural units represented by formula (2B) is soluble in an aprotic polar solvent.11. The block ...

NORBORNANE-2-SPIRO-a-CYCLOALKANONE-a'-SPIRO-2"-NORBORNANE-5,5",6,6"-TETRACARBOXYLIC DIANHYDRIDE, NORBORNANE-2-SPIRO-a- CYCLOALKANONE-a'-SPIRO-2"-NORBORNANE-5,5",6,6"-TETRACARBOXYLIC ACID AND ESTER THEREOF, METHOD FOR PRODUCING NORBORNANE-2-SPIRO-a-CYCLOALKANONE-a'-SPIRO-2"-NORBORNANE-5,5",6,6"-TETRACARBOXYLIC DIANHYDRIDE, POLYIMIDE OBTAINED BY USING THE SAME, AND METHOD FOR PRODUCING POLYIMIDE

A norbornane-2-spiro-α-cycloalkanone-α′-spiro-2″-norbornane-5,5″,6,6″-tetracarboxylic dianhydride represented by the following general formula (1): 8. The polyamic acid according to claim 6 , wherein the polyamic acid has an intrinsic viscosity [η] of 0.05 to 3.0 dL/g claim 6 , the intrinsic viscosity [η] being measured with a kinematic viscometer under a temperature condition of 30° C. by using a solution of the polyamic acid at a concentration of 0.5 g/dL obtained by dissolving the polyamic acid in N claim 6 ,N-dimethylacetamide.10. A film comprising the polyimide according to .11. A flexible printed wiring board comprising the polyimide according to .12. A liquid crystal orientation film comprising the polyimide according to .13. A transparent electrode substrate comprising the polyimide according to .14. A transparent electrode substrate of an organic EL claim 4 , comprising the polyimide according to .15. A transparent electrode substrate of a solar cell claim 4 , comprising the polyimide according to .16. A transparent electrode substrate of an electronic paper claim 4 , comprising the polyimide according to .17. A heat resistant insulating tape comprising the polyimide according to .18. An enamel for a wire claim 4 , comprising the polyimide according to .19. A protective coating of a semiconductor claim 4 , comprising the polyimide according to .20. A transfer belt comprising the polyimide according to .21. An interlayer dielectric film comprising the polyimide according to .22. A substrate for a sensor claim 4 , comprising the polyimide according to .23. A solution comprising the polyamic acid according to claim 6 , and an organic solvent. The present invention relates to a norbornane-2-spiro-α-cycloalkanone-α′-spiro-2″-norbornane-5,5″,6,6″-tetracarboxylic dianhydride; a norbornane-2-spiro-α-cycloalkanone-α′-spiro-2″-norbornane-5,5″,6,6″-tetracarboxylic acid and an ester thereof; a method for producing a norbornane-2-spiro-α-cycloalkanone-α′-spiro-2″- ...

Flexible wiring circuit board, producing method thereof, and imaging device

A mounted board includes a base insulating layer, a conductive pattern, and a cover insulating layer sequentially toward one side in a thickness direction. The entire lower surface of the base insulating layer is exposed downwardly. A total thickness of the base insulating layer and the cover insulating layer is 16 μm or less. The base insulating layer contains an insulating material having a hygroscopic expansion coefficient of 15×10 −6 /% RH or less.

WIRING CIRCUIT BOARD AND PRODUCING METHOD THEREOF

A wiring circuit board sequentially includes a conductive layer, an insulating layer, and a shield layer toward one side in a thickness direction. The insulating layer covers the conductive layer and has an insulating opening portion exposing a part of a one-side surface in the thickness direction of the conductive layer, and the shield layer has a recessed portion disposed at the inside of the insulating opening portion and recessed toward the other side in the thickness direction so as to be in contact with the conductive layer. The shield layer sequentially includes an adhesive layer and a main body layer toward one side in the thickness direction. A ratio (Tb/Ta) of a thickness Tb of the main body layer to a thickness Ta of the adhesive layer is 4 or more. 1. A wiring circuit board sequentially comprising:a conductive layer, an insulating layer, and a shield layer toward one side in a thickness direction, whereinthe insulating layer covers the conductive layer and has an insulating opening portion exposing a part of a one-side surface in the thickness direction of the conductive layer,the shield layer has a recessed portion disposed at the inside of the insulating opening portion and recessed toward the other side in the thickness direction so as to be in contact with the conductive layer;the shield layer sequentially includes an adhesive layer and a main body layer toward one side in the thickness direction; anda ratio (Tb/Ta) of a thickness Tb of the main body layer to a thickness Ta of the adhesive layer is 4 or more.2. The wiring circuit board according to claim 1 , whereinthe shield layer has a shield opening portion exposing a part of a one-side surface in the thickness direction of the insulating layer.3. The wiring circuit board according to claim 1 , whereina material for the insulating layer is polyimide,a material for the adhesive layer is chromium, anda material for the main body layer is copper.4. The wiring circuit board according to being a wiring ...

Organic light-emitting diode and manufacturing method therefor

Provided are an organic light emitting diode and a method for preparing the same.

Polyimide film, block copolymer of polyamide acid, and method for manufacturing the block copolymer of polyamide acid

A block copolymer of polyamide acid includes a first polyamide acid and a second polyamide acid alternately connected. The first polyamide acid is made by first dianhydride monomers and second diamine monomers. The second polyamide acid is made by second dianhydride monomers and first diamine monomers. Each first dianhydride monomer is or comprises a liquid crystal structure. Each second dianhydride monomer and each second diamine monomer respectively include a first flexible structure. Each first diamine monomer includes a liquid crystal structure. Each liquid crystal structure includes a cyclic group selected from a chemical structural formula of and intermediate groups selected from a chemical structural formula of Each flexible structure includes a group selected from a group consist of ether bond, ketone group, sulphone group, aliphatic hydrocarbon group, and any combination thereof.

Circuit assemblies and method of manufacture thereof

Disclosed herein is a circuit assembly including a polyetherimide dielectric layer; a conductive metal layer disposed on the dielectric layer; and a supporting metal matrix layer disposed on the dielectric layer on a side opposite the conductive metal layer. The polyetherimide dielectric layer includes a polyetherimide having a glass transition temperature of 200° C. or more. The circuit assembly has the same adhesion, within+10%, as determined by IPC-TM-650 test methods, before and after thermal stress at 280° C. for 30 minutes in accordance with SJ 20780-2000. Also disclosed are methods of preparing the circuit assembly, and articles including the circuit assembly.

INDUCTIVE COMPONENT

An inductive component has at least one conductor loop arranged on a printed circuit board and at least one core made of inductive material that cooperates inductively with the conductor loop. The printed circuit board comprises an upper face, a lower face and narrow faces, and moreover at least two printed circuit board parts. Each printed circuit board part has a part of the at least one conductor loop. At least one of the printed circuit board parts comprises a first and a second contact portion. The first contact portion is connected to a first face, in particular the upper face, of the second printed circuit board part and the second contact portion is connected to a second face, in particular the lower face, of the second printed circuit board part, which second face is different from the first face. 11332433262162262356335651061052062051061062165206206226. An inductive component () comprising at least one conductor loop ( , ′) arranged on a printed circuit board () and at least one core () made of an inductive material that inductively cooperates with the at least one conductor loop ( , ′) , wherein the printed circuit board () comprises an upper face () , a lower face () and narrow faces () and moreover at least two printed circuit board parts ( , ) , each of which has a part of the at least one conductor loop ( , ′) , wherein at least one of the printed circuit board parts ( , ) comprises a first ( , ) and a second contact portion ( , ) , wherein the first contact portion ( , ) is connected to a first face , namely the upper face () , of the second printed circuit board part () and the second contact portion ( , ) is connected to a second face , namely the lower face () , of the second printed circuit board part () , which second face is different from the first face.21. The inductive component () according to claim 1 ,wherein{'b': 3', '3', '4, 'the at least one conductor loop (, ′) is passed through the at least one core ().'}31. The inductive component () ...

Halogen-free thermosetting resin composition, prepreg, laminate and printed circuit board comprising the same

The present invention provides a halogen-free thermosetting resin composition, a prepreg, a laminate and a printed circuit board comprising the same. The halogen-free thermosetting resin composition comprises, based on 100 parts by weight of organic solids, (A) from 30 to 60 parts by weight of a halogen-free thermosetting resin, (B) from 10 to 35 parts by weight of a phenolic curing agent, and (C) a phosphorus-containing flame retardant. The prepregs, laminates and printed circuit boards prepared from the halogen-free thermosetting resin composition of the present invention have excellent dimensional stability and dielectric properties, high adhesive force, high heat resistance, low water absorption and better processability, and can achieve halogen-free flame retardancy and reach UL94 V-0.

SOLVENT-FREE RESIN COMPOSITION AND USES OF THE SAME

A solvent-free thermosetting filling resin composition is provided. The resin composition comprises the following components: 2. The resin composition of claim 1 , wherein n is an integer of 0 to 50.3. The resin composition of claim 1 , wherein the epoxy resin (B) with an alicyclic skeleton does not contain a glycidyl ether group.4. The resin composition of claim 1 , wherein the epoxy resin (B) with an alicyclic skeleton has an ester group or an ether group as a connecting group.5. The resin composition of claim 1 , wherein the epoxy resin hardener (C) is selected from the group consisting of imidazole claim 1 , imidazole derivatives claim 1 , salts of imidazole claim 1 , salts of imidazole derivatives claim 1 , and combinations thereof.6. The resin composition of claim 1 , wherein the benzoxazine resin hardener (D) is selected from the group consisting of thiodipropionic acid claim 1 , phenols claim 1 , thiodiphenol benzoxazine claim 1 , sulfonyl benzoxazine claim 1 , sulfonyldiphenol claim 1 , and combinations thereof.7. The resin composition of claim 1 , wherein the modified filler (E) is selected from the group consisting of modified silica claim 1 , modified barium sulfate claim 1 , modified calcium carbonate claim 1 , modified silicon nitride claim 1 , modified aluminum nitride claim 1 , modified boron nitride claim 1 , modified aluminum oxide claim 1 , modified magnesium oxide claim 1 , modified aluminum hydroxide claim 1 , modified magnesium hydroxide claim 1 , modified titanium oxide claim 1 , modified mica claim 1 , modified talc claim 1 , modified organic bentonite claim 1 , modified kaolin claim 1 , modified Sillitin claim 1 , modified silicon claim 1 , and combinations thereof.8. The resin composition of claim 7 , wherein the modified filler (E) is modified silica.9. The resin composition of claim 1 , wherein the weight ratio of the benzoxazine resin (A) to the epoxy resin (B) with an alicyclic skeleton is about 1:9 to about 9:1.10. The resin ...

FILM-CLOSURE APPARATUS FOR PLASTIC FILM MATERIAL, PRINTED CIRCUIT BOARD, AND METHOD OF ENHANCING THE OPERATION OF A FILM-CLOSURE APPARATUS

A film-closure apparatus is provided which is suitable for closing plastic film material using heat. The apparatus comprises a guide path along which at least part of a plastics film material can pass; a drive means for moving the film material along the guide path; and a printed circuit board comprising a circuit substrate having first and second major board surfaces and a perimeter edge surface, and an electrically conductive heating element which is provided on the circuit substrate along at least part of the perimeter edge surface. The electrically conductive heating element is positionable on the guide path to apply heat to the film material thereon.

Stabilized silver catalysts and methods

Zero-valent silver compositions include 4-dimethylaminopyridine as stabilizers. The zero-valent silver and the 4-diemthylaminopyridine form stabilized nano-particles in solution. The zero-valent silver compositions may be used as catalysts in the metallization of non-conductive substrates.

POLYIMIDE FILM FOR FLEXIBLE METAL CLAD LAMINATE AND FLEXIBLE METAL CLAD LAMINATE COMPRISING SAME

The present disclosure relates to a polyimide film for a flexible metal clad laminate and a flexible metal clad laminate including the same, and an aspect of the present disclosure is to provide a polyimide film for a flexible metal clad laminate, which is derived from a polyimide precursor composition including an acid dianhydride and a diamine, in which the acid dianhydride includes 70% by mol or more of pyromellitic dianhydride (PMDA), and the diamine includes m-tolidine and dimer diamine.

LIGHT EMITTING DIODE (LED) ASSEMBLY AND FLEXIBLE CIRCUIT BOARD WITH IMPROVED THERMAL CONDUCTIVITY

A flexible circuit board includes an electrically insulating top sheet and an electrically insulating bottom sheet. A plurality of conductive traces is positioned between the electrically insulating top and bottom sheets. A first conductive trace has a first contact pad, and a second conductive trace has a second contact pad. The first and second contact pads are exposed through at least one opening in the electrically insulating top sheet, and each of the first and second contact pads are configured to be connected to an LED. A third contact pad is exposed through openings in the electrically insulating top and bottom sheets, with a top surface of the third contact pad configured to be connected to the LED and a bottom surface of the third contact pad configured to be connected to a heat diffusion device. 1. A flexible circuit board comprising:an electrically insulating top sheet;an electrically insulating bottom sheet;a plurality of conductive traces positioned between the electrically insulating top and bottom sheets, with a first conductive trace having a first contact pad and a second conductive trace having a second contact pad, the first and second contact pad being exposed through at least one opening in the electrically insulating top sheet and each of the first and second contact pads configured to be connected to an LED; anda third contact pad being exposed through openings in the electrically insulating top and bottom sheets, with a top surface of the third contact pad configured to be connected to the LED and a bottom surface of the third contact pad configured to be connected to a heat diffusion device.2. The flexible circuit board of claim 1 , wherein the electrically insulating top sheet and the electrically insulating bottom sheet are both flexible films.3. The flexible circuit board of claim 1 , wherein at least one of the flexible films is a polyimide film.4. The flexible circuit board of claim 1 , wherein each of the first claim 1 , second claim ...

CERAMIC RESIN COMPOSITE BODY

Provided is a ceramic-resin composite body that has good mass productivity and product properties (heat dissipation properties, insulation properties and adhesive properties), and particularly a ceramic-resin composite that can dramatically improve the heat dissipation properties for electronic devices. The ceramic-resin composite body includes: 35 to 70% by volume of a sintered body having a monolithic structure in which non-oxide ceramic primary particles having an average major diameter of from 3 to 60 μm and an aspect ratio of from 5 to 30 are three-dimensionally continuous; and 65 to 30% by volume of a thermosetting resin composition having an exothermic onset temperature of 180° C. or more and a curing rate of from 5 to 60% as determined with a differential scanning calorimeter, and having a number average molecular weight of from 450 to 4800, wherein the sintered body is impregnated with the thermosetting resin composition. 1. A ceramic-resin composite body comprising:from 35% by volume to 70% by volume of a sintered body having a monolithic structure in which non-oxide ceramic primary particles having an average major diameter of from 3 μm to 60 μm and an aspect ratio of from 5 to 30 are three-dimensionally continuous; andfrom 65% by volume to 30% by volume of a thermosetting resin composition having an exothermic onset temperature of 180° C. or more and a curing rate of from 5% to 60% as determined with a differential scanning calorimeter, and having a number average molecular weight of from 450 to 4800,wherein the sintered body is impregnated with the thermosetting resin composition.2. The ceramic-resin composite body according to claim 1 , wherein the non-oxide ceramic sintered body comprises one or a combination of two or more selected from the group consisting of boron nitride claim 1 , aluminum nitride claim 1 , and silicon nitride.3. The ceramic-resin composite body according to claim 1 , wherein the thermosetting resin composition has a melting ...

MANUFACTURING METHOD AND STRUCTURE OF CIRCUIT BOARD WITH VERY FINE CONDUCTIVE CIRCUIT LINES

A circuit board manufacturing method includes the steps of providing a conductive motherboard; forming a masking layer on the conductive motherboard, and the masking layer having a plurality of recessed portions that form a predetermined circuit pattern; forming a conductive electrode in each recessed portion, and the conductive electrodes together forming a conductive layer; providing a substrate having an adhesive layer provided thereon for sticking to a top of the masking layer and the conductive layer; and separating the substrate, the adhesive layer and the conductive layer from the conductive motherboard and the masking layer to provide a circuit board. The conductive motherboard is repeatedly usable and presents the predetermined circuit pattern through electroforming process, and the circuit pattern can be transferred to the substrate. The whole circuit board manufacturing process is simplified while ensures largely upgraded yield rate of very fine conductive circuit lines on the circuit board. 1. A manufacturing method of circuit board with very fine conductive circuit lines , comprising the following steps:providing a conductive motherboard;forming a masking layer on the conductive motherboard, and the masking layer being provided with a plurality of recessed portions that form a predetermined circuit pattern;forming a conductive electrode in each of the recessed portions on the masking layer, and the conductive electrodes being very fine conductive circuit lines that together form a conductive layer;providing a substrate, on one side of which an adhesive layer is provided for sticking to a top of the masking layer and the conductive layer; andseparating the substrate, the adhesive layer and the conductive layer from the masking layer and the conductive motherboard to provide a circuit board.2. The manufacturing method of circuit board with very fine conductive circuit lines as claimed in claim 1 , wherein the conductive motherboard is subjected to a ...

METHOD OF MANUFACTURING A FLEXIBLE CIRCUIT ELECTRODE FOR ELECTROSURGICAL INSTRUMENT

The disclosure provides a method of manufacturing a flexible circuit electrode assembly and an apparatus manufactured by said method. According to the method, an electrically conductive sheet is laminated to an electrically insulative sheet. An electrode is formed on the electrically conductive sheet. An electrically insulative layer is formed on a tissue contacting surface of the electrode. The individual electrodes are separated from the laminated electrically insulative sheet and the electrically conductive sheet. In another method, a flexible circuit is vacuum formed to create a desired profile. The vacuum formed flexible circuit is trimmed. The trimmed vacuum formed flexible circuit is attached to a jaw member of a clamp jaw assembly. 125.-. (canceled)26. A method of manufacturing a flexible circuit electrode assembly , the method comprising:vacuum forming a flexible circuit;trimming the vacuum formed flexible circuit; andattaching the trimmed vacuum formed flexible circuit to a jaw member of a clamp jaw assembly.27. The method of claim 26 , further comprising:placing the vacuum formed flexible circuit in a molding tool; andmolding a substrate to support a profile of the vacuum formed flexible circuit.28. The method of claim 27 , wherein attaching the trimmed vacuum formed flexible circuit to the jaw member of the clamp jaw assembly comprises molding the trimmed vacuum formed flexible circuit over the jaw member.29. The method of claim 27 , wherein attaching the trimmed vacuum formed flexible circuit to a jaw member of a clamp jaw assembly comprises attaching the trimmed vacuum formed flexible circuit to a jaw member having a complementary jaw member profile to the profile of the vacuum formed flexible circuit.30. The method of claim 26 , wherein attaching the trimmed vacuum formed flexible circuit to the jaw member of the clamp jaw assembly comprises adhering the trimmed vacuum formed flexible circuit to the jaw member with adhesive.31. The method of claim 26 ...

POLYAMIDE ACID, THERMOPLASTIC POLYIMIDE, RESIN FILM, METAL-CLAD LAMINATE AND CIRCUIT BOARD

A polyamide acid which contains at least one diamine compound selected from among diamine compounds represented by general formula (8) within the range of 3-60 parts by mole in total per 100 parts by mole of all diamine components, while containing a biphenyl tetracarboxylic acid dianhydride within the range of 40-100 parts by mole and a pyromellitic acid dianhydride within the range of 0-60 parts by mole per 100 parts by mole of all acid anhydride components; and a thermoplastic polyimide which is obtained curing this polyamide acid. 3. A resin film that including a single layer or a plurality of polyimide layers ,{'claim-ref': {'@idref': 'CLM-00002', 'claim 2'}, 'wherein at least one layer among the polyimide layers is formed of the thermoplastic polyimide according to .'}4. A metal-clad laminate including an insulating resin layer and a metal layer ,wherein the insulating resin layer includes a single layer or a plurality of polyimide layers, and{'claim-ref': {'@idref': 'CLM-00002', 'claim 2'}, 'wherein a polyimide layer in contact with the metal layer is formed of the thermoplastic polyimide according to .'}5. The metal-clad laminate according to claim 4 ,wherein a ten-point average roughness (Rz) of a surface of the metal layer in contact with the insulating resin layer is within the range of 0.05 to 1.0 μm.6. A circuit board obtained by processing the metal layer of the metal-clad laminate according to into a wiring. The present invention relates to a polyimide that is useful as an adhesive layer in a circuit board such as a flexible printed wiring board and use thereof.In recent years, along with advances in reductions in size and weight, and space saving in electronic devices, the demand for a flexible printed wiring board (flexible printed circuit (FPC)) that is thin and lightweight, has flexibility, and has excellent durability even if bending is repeated is increasing. Since FPCs can be mounted three-dimensionally and with a high density even in a limited ...

LOSS-DISSIPATION FLEXIBLE COPPER CLAD LAMINATE, MANUFACTURING METHOD THEREOF, AND ELECTRONIC DEVICE

The present disclosure provides a low-dissipation flexible copper clad laminate, which includes a copper foil and a polyimide film. The polyimide film is attached to the copper foil. The polyimide film includes a polyimide, and the polyimide has a structure represented by formula (I). Formula (I) is defined as in the specification. 4. The low-dissipation flexible copper clad laminate of claim 3 , wherein a dielectric constant of the polyimide film is 2.8 to 3.5.5. The low-dissipation flexible copper clad laminate of claim 3 , wherein a dissipation factor of the polyimide film is less than 0.0025.8. The manufacturing method of claim 6 , wherein the organic solvent is dimethylacetamide claim 6 , dimethylformamide claim 6 , or N-methyl-2-pyrrolidone.9. The manufacturing method of claim 6 , wherein a molar ratio of the diamine monomer represented by formula (i) plus the diamine monomer represented by formula (ii) to the dianhydride monomer represented by formula (iii) is 0.9 to 1.1.10. An electronic device comprising the low-dissipation flexible copper clad laminate of . This application claims priority to Taiwan Application Serial Number 109141890, filed Nov. 27, 2020, which is herein incorporated by reference.The present disclosure relates to a flexible copper clad laminate, a manufacturing method thereof and an electronic device. More particularly, the present disclosure relates to a low-dissipation flexible copper clad laminate, a manufacturing method thereof and an electronic device.Since 2015, the International Telecommunication Union (ITU) is officially announced the vision of 5Generation Mobile Network, all relevant units have successively developed the new technologies and materials. Furthermore, for the new generation of communication networks, it must be achieved the expectances, such as the high transmission rate, the high stability, the low latency and the low transmission loss, at the high frequencies.The printed circuit board (PCB) is mainly used in the ...

ELECTRONIC COMPONENT AND BOARD HAVING ELECTRONIC COMPONENT MOUNTED THEREON

An electronic component includes a body including a dielectric material and internal electrodes embedded in the dielectric material; external electrodes connected to the internal electrodes and disposed on the body; a first substrate connected to the external electrodes and disposed on one side of the body; and a second substrate connected to the first substrate and disposed on one side of the first substrate. The first and second substrates have different Young's modulus. 1. An electronic component comprising:a body including a dielectric material and internal electrodes embedded in the dielectric material;external electrodes connected to the internal electrodes and disposed on the body;a first substrate connected to the external electrodes and disposed on one side of the body; anda second substrate connected to the first substrate and disposed on one side of the first substrate,wherein the first and second substrates have different Young's modulus.2. The electronic component of claim 1 , wherein the first substrate has a higher Young's modulus than that of the second substrate.3. The electronic component of claim 2 , wherein the first substrate suppresses vibrations of the body claim 2 , and the second substrate absorbs vibrations transferred from the first substrate.4. The electronic component of claim 1 , wherein the first substrate has a lower Young's modulus than that of the second substrate.5. The electronic component of claim 4 , wherein the first substrate converts a displacement of the body into a wave form claim 4 , andthe second substrate suppresses waves transferred from the first substrate.6. The electronic component of claim 1 , wherein the body claim 1 , the first substrate claim 1 , and the second substrate are disposed sequentially.7. The electronic component of claim 1 , wherein one of the first and second substrates has a Young's modulus of 200 GPa to 400 GPa claim 1 , andthe other of the first and second substrates has a Young's modulus of 3 GPa ...

POLYIMIDE POLYMER, POLYIMIDE FILM, AND FLEXIBLE COPPER-COATED LAMINATE

A polyimide polymer represented by the following formula 1 is provided. 3. A polyimide film comprising the polyimide polymer of .4. The polyimide film of claim 3 , wherein a dielectric constant of the polyimide film is 3 to 3.55.5. The polyimide film of claim 3 , wherein a coefficient of thermal expansion of the polyimide film is 12 ppm/° C. to 22 ppm/° C.6. The polyimide film of claim 3 , wherein a glass transition temperature of the polyimide film is 350° C. to 365° C.7. A flexible copper-coated laminate comprising: {'claim-ref': {'@idref': 'CLM-00003', 'claim 3'}, 'a polyimide film disposed on the copper foil, wherein the polyimide film is the polyimide film of .'}, 'a copper foil; and'}8. The flexible copper-coated laminate of claim 7 , further comprising an adhesive layer disposed between the copper foil and the polyimide film. This application claims the priority benefit of Taiwan application serial no. 103137208, filed on Oct. 28, 2014. The entirety of the above-mentioned patent application is hereby incorporated by reference herein and made a part of this specification.1. Field of the InventionThe invention relates to a polyimide polymer, a polyimide film, and a flexible copper-coated laminate. More particularly, the invention relates to a polyimide polymer having a low dielectric constant, a polyimide film including the polyimide polymer, and a flexible copper-coated laminate including the polyimide film.2. Description of Related ArtAs electronic devices gradually become thinner and lighter, the demand for use of a flexible printed circuit board greatly increases. The mainly upstream material of the flexible printed circuit board is a flexible copper-coated laminate which is produced by coating or attaching a polyimide polymer onto a copper foil. In the current industry environment, the polyimide polymer is required to have a low dielectric constant, high thermal stability, and a coefficient of thermal expansion close to that of the copper foil. However, in ...

Conductive paste, method of producing conductive pattern, and touch panel

A conductive paste includes a conductive filler (A), a zwitterionic compound (B) and a thermosetting compound (C); a method of producing a conductive pattern including applying the conductive paste to obtain a coating film, drying the coating film to obtain a dried film, exposing and developing the dried film to obtain a pattern, and curing the pattern at 100 to 200° C. to obtain a conductive pattern; and an electrostatic capacitance type touch panel including as peripheral wiring the conductive pattern produced by the method of producing the conductive pattern.

CURABLE RESIN COMPOSITION, MOLDED CURABLE-RESIN OBJECT, CURED OBJECT, LAYERED PRODUCT, COMPOSITE, AND MULTILAYERED PRINTED WIRING BOARD

The purpose of the present invention is to provide a curable resin composition capable of forming a cured object having excellent adhesiveness to conductor layers. The curable resin composition according to the present invention composes an epoxy compound (A), a triazole compound (B), and a tertiary amine compound (C) represented by the following formula (I). In formula (I), Rand R each independently represent —(RO)H (wherein, Rrepresents a Calkylene group and n is an integer of 1-3). 3. The curable resin composition according to claim 1 , wherein the proportion of the content of the tertiary amine compound in the total of the content of the triazole compound (B) and the content of the tertiary amine compound (C) is 20 mass % to 80 mass %.4. The curable resin composition according to claim 1 , further comprising an active ester compound.5. The curable resin composition according to claim 1 , further comprising a polyphenyiene ether compound.8. The cured object according to claim 7 , wherein the dielectric loss tangent at a frequency of 5 GHz is 0.010 or less. The present invention relates to a curable resin composition, molded curable resin object, cured object, layered product, composite, and multilayered printed wiring board.Recently, in pursuit of the miniaturization, multifunctionality, and increasing communication speed of electronic equipment, etc., a higher density printed substrate used for semiconductor elements in electronic equipment, etc. has been in demand. In order to meet such a demand, a printed substrate (hereinafter, referred to as a “multilayered printed wiring board”) having a multilayered structure is used. Additionally, such a multilayered printed wiring board is, for example, formed by layering an electrical insulating layer on an inner layer substrate (including a core substrate obtained by forming an electrical insulating layer on both surfaces of a base material, as well as a conductor layer (wiring layer) formed on the surface of the core ...

Ultra low loss dielectric thermosetting resin compositions and high performance laminates manufactured therefrom

A ultra low loss dielectric thermosetting resin composition has at least one cyanate ester component (A) and at least one reactive intermediate component (B) that is capable of copolymerization with said component (A). The invention is a cyanate ester resin of the form: T-[W-(Z)/(H)-W]-[W-(Z)/(H)-(OCN)/(R)], wherein T is a 1,3,5-substituted-triazine moiety (CN); W is a linking atom between triazine and either component A or component B; Z is component (A); H is component (B); OCN is a cyanate ester end group; R is a reactive end group of component B; n is an integer greater than or equal to 1; and f is a weight or mole fraction of component A. The composition exhibits excellent dielectric properties and yields a high performance laminate for use in high layer count, multilayer printed circuit board (PCB), prepregs, resin coated copper (RCC), film adhesives, high frequency radomes, radio frequency (RF) laminates and various composites. 1. A thermosetting resin composition having the form:{'br': None, 'sub': n', 'f', '1−f', 'n−1', 'f', '1−f', 'f', '1−f', 'n+2, 'T-[W-(Z)/(H)-W]-[W-(Z)/(H)-(OCN)/(R)]'}{'sub': 3', '3, 'wherein “T” is a 1,3,5-substituted-triazine moiety (CN); “W” is a linking atom between triazine and either component A or component B; “Z” is component (A); “H” is component (B); “OCN” is cyanate ester end group; “R” is a reactive end group of component B; “n” is an integer greater than or equal to 1; and “f” is a weight or mole fraction of component A;'} a. at least one cyanate ester component (A);', 'b. at least one reactive intermediate component (B), said component B being capable of copolymerization with said component (A)., 'wherein said thermosetting resin composition is formed by chemical attachment of2. A thermosetting resin composition as recited by claim 1 , wherein said component (A) is a member selected from the group consisting of 2 claim 1 ,2-bis(4-Cyanatophenyl)ispropylyidene claim 1 , Bisphenol F Cyanate ester claim 1 , Bisphenol E Cyanate ...

THERMALLY ENHANCED PRINTED CIRCUIT BOARD ARCHITECTURE FOR HIGH POWER ELECTRONICS

A thermally enhanced printed circuit board architecture includes one or more electrically insulating composite layers, one or more electrically conductive layers, and one or more thermally conductive layers assembled into a stack. 1. A printed circuit board structure , comprising:one or more electrically insulating composite layers;one or more electrically conductive layers;and one or more thermally conductive layers, wherein the one or more thermally conductive layers is comprised of a highly oriented material.2. The printed circuit board structure of claim 1 , wherein the highly oriented material comprises at least approximately 95 weight % carbon.3. The printed circuit board structure of claim 2 , wherein the highly oriented material is comprised of at least one of graphite claim 2 , graphene claim 2 , carbon nanotubes claim 2 , carbon fiber claim 2 , and diamond.4. The printed circuit board structure of claim 1 , wherein the one or more thermally conductive layer is configured as a coating on at least one of the one or more electrically insulating composite layers.5. The printed circuit board structure of claim 4 , wherein the one or more thermally conductive layer is configured as a coating on at least one of the one or more electrically conductive layers.6. The printed circuit board structure of claim 1 , wherein one of the one or more thermally conductive layers is positioned adjacent one of the one or more electrically conductive layers.7. The printed circuit board structure of claim 7 , wherein the one electrically conductive layer is comprised of copper and the one thermally conductive layer is comprised of a carbon material.8. The printed circuit board structure of claim 7 , wherein the carbon material is coated onto the copper layer to define a single sheet of the printed circuit board structure.9. The printed circuit board structure of claim 7 , wherein the carbon material is positioned adjacent and in contact with an upper layer of copper and a lower ...

LED BRACKET, LED BRACKET ARRAY, LED DEVICE AND LED DISPLAY SCREEN

An LED bracket, LED bracket array, LED device and LED display screen are disclosed. The LED bracket includes a PCB circuit substrate and an insulating material. The PCB circuit substrate includes at least two electrically insulated electrode regions. Each electrode region includes a top electrode region, a side electrode region and a bottom electrode region. The side electrode region connects the top electrode region and the bottom electrode region into an integrated structure. The side electrode region is a side surface sunk from outside to an inner part of the PCB circuit substrate. The insulating material is filled in the side electrode region. An upper end surface and a lower end surface of the insulating material do not exceed an upper surface and a lower surface of the PCB circuit substrate. A thickness of the insulating material is less than a thickness of the PCB circuit substrate. 1. An LED bracket , comprising a Printed Circuit Board (PCB) circuit substrate and an insulating material , wherein the PCB circuit substrate comprises at least two electrode regions electrically insulated from each other; each of the at least two electrode regions comprises a top electrode region , a side electrode region and a bottom electrode region; the top electrode region and the bottom electrode region are connected into an integrated structure by the side electrode region; the side electrode region is a side surface sunk from outside to an interior of the PCB circuit substrate; the insulating material is filled in the side electrode region; an upper end surface and a lower end surface of the insulating material do not exceeded an upper surface and a lower surface of the PCB circuit substrate , and a thickness h of the insulating material is less than a thickness H of the PCB circuit substrate.2. The LED bracket according to claim 1 , wherein the upper end surface of the insulating material is at a same level with the upper surface of the PCB circuit substrate; orthe upper ...

FLEXIBLE CIRCUITS FOR ELECTROSURGICAL INSTRUMENT

The disclosure provides a method of manufacturing a flexible circuit electrode assembly and an apparatus manufactured by said method. According to the method, an electrically conductive sheet is laminated to an electrically insulative sheet. An electrode is formed on the electrically conductive sheet. An electrically insulative layer is formed on a tissue contacting surface of the electrode. The individual electrodes are separated from the laminated electrically insulative sheet and the electrically conductive sheet. In another method, a flexible circuit is vacuum formed to create a desired profile. The vacuum formed flexible circuit is trimmed. The trimmed vacuum formed flexible circuit is attached to a jaw member of a clamp jaw assembly. 1. A method of manufacturing a flexible circuit electrode , the method comprising:laminating a flexible electrically conductive sheet to a flexible electrically insulative sheet with an adhesive therebetween to produce a flexible laminate;forming at least one electrode on the flexible electrically conductive sheet;forming at least one electrically insulative layer on a tissue contacting surface of the least one electrode; andseparating the at least one electrode from the flexible laminate.2. The method of claim 1 , wherein the flexible electrically conductive sheet is selected from any one of copper claim 1 , gold plated copper claim 1 , silver claim 1 , platinum claim 1 , stainless steel claim 1 , or aluminum claim 1 , or alloys thereof.3. The method of claim 1 , wherein the flexible electrically insulative sheet is selected from any one of polyimide claim 1 , polyester claim 1 , fluorocarbon claim 1 , or any polymeric material claim 1 , or any combinations thereof.4. The method of claim 1 , wherein forming the at least one electrode on the flexible electrically conductive sheet comprises etching at least one electrode on the flexible electrically conductive sheet.5. The method of claim 4 , wherein etching comprises:screen ...

Component Carrier With Exposed Layer

A component carrier includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, and a partially exposed layer in a central region of the stack being exposed with regard to an upper side and a lower side by a respective blind hole formed in the stack, wherein each of opposing main surfaces of the exposed layer is partially covered by a respective adhesive layer. 1. A component carrier , comprising:a stack comprising at least one electrically conductive layer structure and/or at least one electrically insulating layer structure; anda partially exposed layer in a central region of the stack being exposed with regard to an upper side and a lower side by a respective blind hole formed in the stack;wherein each of opposing main surfaces of the exposed layer is partially covered by a respective adhesive layer.2. The component carrier according to claim 1 , wherein the component carrier is configured as sensor claim 1 , in particular one of a microphone claim 1 , a pressure sensor claim 1 , an acceleration sensor claim 1 , and a gas sensor claim 1 , as an actuator claim 1 , in particular a loudspeaker claim 1 , and as a microelectromechanical system.3. The component carrier according to claim 1 , comprising at least one of the following features:wherein the exposed layer forms a functional diaphragm in the blind holes;wherein the exposed layer comprises or consists of an elastic material, for example polyimide;wherein the exposed layer is a single material layer;wherein the exposed layer comprises sub-structures of different materials;wherein a thickness of the exposed layer is in a range between 1 μm and 30 μm, in particular in a range between 3 μm and 7 μm;wherein a lateral offset between a center of an outermost portion of the first blind hole and a center of an outermost portion of the second blind hole is less than 20 μm, in particular not more than 15 μm;wherein a lateral offset between ...

Application specific electronics packaging systems, methods and devices

Depicted embodiments are directed to an Application Specific Electronics Packaging (“ASEP”) system, which enables the manufacture of additional products using reel to reel (68a, 68b) manufacturing processes as opposed to the “batch” processes used to currently manufacture electronic products and MIDs. Through certain ASEP embodiments, it is possible to integrate connectors, sensors, LEDs, thermal management, antennas, RFID devices, microprocessors, memory, impedance control, and multi-layer functionality directly into a product.

FLEXIBLE PRINTED CIRCUIT BOARD

A flexible printed circuit board (PCB) has stretchability and durability. The flexible PCB includes: a first polymer substrate having flexibility, stretchability, or elasticity; a second polymer substrate having flexibility, stretchability, or elasticity; a conductive track disposed between the first and second polymer substrates and including metal nanowires; and a cured silane coupling agent which bonds the conductive track to at least one of the first and second polymer substrates. 1. A flexible printed circuit board (PCB) comprising:a first polymer substrate having at least one of flexibility, stretchability, and elasticity;a second polymer substrate having at least one of flexibility, stretchability, and elasticity;a conductive track comprising metal nanowires disposed between the first polymer substrate and the second polymer substrate; anda cured silane coupling agent configured to bond the conductive track to at least one of the first polymer substrate and the second polymer substrate.2. The flexible PCB of claim 1 , wherein the first polymer substrate and the second polymer substrate each have a thickness in a range of about 10 μm to about 3 claim 1 ,000 μm.3. The flexible PCB of claim 1 , wherein the first polymer substrate and the second polymer substrate each comprise at least one of a polydimethylsiloxane (PDMS)-based resin claim 1 , a polyimide (PI)-based resin claim 1 , a polyamide-based resin claim 1 , a polyester-based resin claim 1 , a polyethylene-based resin claim 1 , a polypropylene-based resin claim 1 , a polyurethane-based resin claim 1 , and a polycarbonate-based resin.4. The flexible PCB of claim 1 , wherein the first polymer substrate and the second polymer substrate comprise a PDMS-based resin.5. The flexible PCB of claim 1 , wherein the metal nanowires have an average aspect ratio in a range of about 20 to about 300.6. The flexible PCB of claim 1 , wherein the metal nanowires have an average diameter in a range of about 1 nm to about 500 ...

STRETCHABLE POLYMER THICK FILM COMPOSITIONS FOR THERMOPLASTIC SUBSTRATES AND WEARABLES ELECTRONICS

This invention is directed to stretchable polymer thick film compositions useful for wearable garments. More specifically, the polymer thick film may be used in applications where significant stretching is required, particularly on substrates that can be highly elongated. A particular type of substrate is a thermoplastic polyurethane substrate. 1. A polymer thick film composition comprising:(a) a functional component; and(b) an organic medium comprising 5-50 wt % thermoplastic polyurethane resin dissolved in an organic solvent, said thermoplastic polyurethane resin having a per cent elongation of at least 200% and a tensile stress necessary to achieve 100% elongation of less than 1000 psi, wherein the weight percent is based on the total weight of said organic medium.2. The polymer thick film composition of claim 1 , wherein said functional component is an electrical conductive metal powder and said polymer thick film composition is a polymer thick film conductor composition comprising:(a) an electrically conductive metal powder, wherein said metal is selected from the group consisting of Ag, Cu, Au, Pd, Pt, Sn, Al, Ni, an alloy of Ag, Cu, Au, Pd, Pt, Sn, Al, Ni and mixtures thereof; and(b) an organic medium comprising 5-50 wt % thermoplastic polyurethane resin dissolved in an organic solvent, said thermoplastic polyurethane resin having a per cent elongation of at least 200% and a tensile stress necessary to achieve 100% elongation of less than 1000 psi, wherein the weight percent is based on the total weight of said organic medium.3. The polymer thick film composition of claim 2 , wherein said electrically conductive metal powder is silver powder.4. The polymer thick film composition of claim 3 , wherein said silver powder is in the form of silver flakes and wherein said thermoplastic polyurethane resin is selected from the group consisting of a polyester-based polymer claim 3 , a urethane homopolymer and a predominantly linear hydroxyl polyurethane.5. The polymer ...

Polymide precursor and polymide

A polyimide precursor consisting of a repeating unit represented by the following chemical formula (1): and a repeating unit represented by the following chemical formula (2): in which A is a tetravalent group of a tetracarboxylic acid, from which carboxyl groups have been removed; B is a divalent group of a diamine, from which amino groups have been removed; with the proviso that the A group and the B group contained in each repeating unit may be the same as, or different from each other; and X 1 and X 2 are each independently hydrogen, an alkyl group having 1 to 6 carbon atoms, or an alkylsilyl group having 3 to 9 carbon atoms, the amount of the repeating unit represented by the chemical formula (2) is 30 mol % or more and 90 mol % or less relative to the total repeating units, 50 mol % or more of the total amount of the B group in the chemical formula (1) and the chemical formula (2) is p-phenylene group and/or a specific divalent group containing two or more benzene rings, the polyimide precursor is produced by thermal imidization.

POLYMER RESIN COMPOSITION, POLYIMIDE RESIN FILM, PREPARATION METHOD OF POLYIMIDE RESIN FILM, FLEXIBLE METAL LAMINATE, AND CIRCUIT BOARD

The present invention is related to a polymer resin composition capable of providing an insulating material having a low dielectric constant and excellent mechanical properties, a polyimide resin film obtained by using the polymer resin composition, a preparation method of a polyimide resin film, and a circuit board and a metal laminate including the polyimide resin film. 2. The polymer resin composition according to claim 1 , wherein the polyalkylene oxide compound comprises a polymer of an alkylene oxide having a carbon number of 1 to 10 claim 1 , a copolymer of an alkylene oxide copolymer having a carbon number of 1 to 10 claim 1 , or derivatives thereof.3. The polymer resin composition according to claim 1 , wherein the polyalkylene oxide compound has a number average molecular weight of 5000 to 100 claim 1 ,000.4. The polymer resin composition according to claim 1 , wherein the polystyrene has a repeating units of styrene and a number-average molecular weight of 5000 to 100 claim 1 ,000.5. The polymer resin composition according to claim 1 , wherein the polyacrylate compound includes a repeating unit of an acrylate or methacrylate and a number average molecular weight of 5000 to 100 claim 1 ,000.6. The polymer resin composition according to claim 1 , wherein the tetrahydropyran compound comprises at least a compound selected from the group consisting of sucrose claim 1 , cyclodextrin claim 1 , glucose claim 1 , and derivatives thereof.8. The polymer resin composition according to claim 1 , wherein the polyamic acid has a weight average molecular weight of 10 claim 1 ,000 to 1 claim 1 ,000 claim 1 ,000.9. The polymer resin composition according to claim 1 , wherein Yis a tetravalent organic functional group containing one to three aromatic rings; a tetravalent organic functional group containing one to three aliphatic ring; or a tetravalent aliphatic organic functional group derived from a linear or branched alkyl having 1 to 10 carbon atoms.11. The polymer ...

Thin film measuring apparatus and thin film measuring method

A thin film measuring apparatus includes a first sensing module, a second sensing module, and a processing device. The thin film measuring apparatus is configured to non-contact measure a multilayer thin film. The first sensing module and the second sensing module are respectively configured to generate alternating magnetic fields, and respectively sense magnetic field changes correspondingly generated by the multilayer thin film. The processing device has a parameter database. The processing device obtains a first impedance value and a second impedance value of the multilayer thin film according to sensing results of the first sensing module and the second sensing module. The processing device performs a thickness calculation operation to obtain a first thickness value and a second thickness value of the multilayer thin film according to the first impedance value, the second impedance value, and the parameter database. A thin film measuring method is also provided.

RESIN COMPOSITION, PREPREG, AND LAMINATE

It is an object of the present invention to provide, without using a halogenated compound or a phosphorus compound, a resin composition for printed wiring boards, a prepreg, a laminate, and a metal foil-clad laminate, each of which has high-degree flame retardance, has a low water absorption ratio and a high glass transition temperature, and has a high elastic modulus at high temperature. A resin composition according to the present invention includes a specific maleimide compound (A); a cyanate ester compound (B); a non-halogen epoxy resin (C); and an inorganic filler (D). 3. The resin composition according to claim 1 , wherein a content of the maleimide compound (A) is 10 to 50 parts by mass based on 100 parts by mass in total of the maleimide compound (A) claim 1 , the cyanate ester compound (B) claim 1 , and the non-halogen epoxy resin (C).4. The resin composition according to claim 1 , wherein a content of the cyanate ester compound (B) is 10 to 50 parts by mass based on 100 parts by mass in total of the maleimide compound (A) claim 1 , the cyanate ester compound (B) claim 1 , and the non-halogen epoxy resin (C).5. The resin composition according to claim 1 , wherein a content of the non-halogen epoxy resin (C) is 5 to 50 parts by mass based on 100 parts by mass in total of the maleimide compound (A) claim 1 , the cyanate ester compound (B) claim 1 , and the non-halogen epoxy resin (C).6. The resin composition according to claim 1 , wherein a content of the inorganic filler (D) is 50 to 400 parts by mass based on 100 parts by mass in total of the maleimide compound (A) claim 1 , the cyanate ester compound (B) claim 1 , and the non-halogen epoxy resin (C).7. The resin composition according to claim 2 , wherein a content of the imidazole compound (F) is 0.01 to 10 parts by mass based on 100 parts by mass in total of the maleimide compound (A) claim 2 , the cyanate ester compound (B) claim 2 , and the non-halogen epoxy resin (C).10. The resin composition according ...

Multilayer substrate

A multilayer substrate includes a multilayer body including a plurality of stacked resin layers and a wiring layer provided in the resin layer. The multilayer body includes a deformable flexible portion which generally defines a wave-shaped portion extending in a direction of travel that is repeatedly changed when viewed in a direction of stacking of the resin layers, the wiring layer being routed along the wave-shaped portion. The flexible portion includes a turn-back portion arranged at a position where the direction of travel is changed and an intermediate portion connecting adjacent turn-back portions to each other. A width of the turn-back portion is greater than a width of the intermediate portion.

CHIP PACKAGE AND POWER MODULE

A chip package includes a high voltage withstanding substrate and a device chip. The high voltage withstanding substrate has a main body, a functional layer, and a grounding layer. The main body has a top surface, a bottom surface opposite the top surface, a through hole through the top surface and the bottom surface, and a sidewall surrounding the through hole. The functional layer is located on the top surface. The grounding layer covers the bottom surface and the sidewall. The device chip is located on the functional layer, and has a grounding pad that faces the main body. The grounding pad is electrically connected to the grounding layer in the through hole. 1. A chip package , comprising:a high voltage withstanding substrate having a main body, a functional layer and a grounding layer, the main body having a top surface and a bottom surface opposite the top surface, a through hole through the top surface and the bottom surface, and a sidewall surrounding the through hole, wherein the function layer is located on the top surface, and the grounding layer covers the bottom surface and the sidewall; anda device chip located on the functional layer, and having a grounding pad that faces the main body, wherein the grounding pad is electrically connected to the grounding layer in the through hole.2. The chip package of claim 1 , wherein the functional layer is made of a material comprising gallium nitride (GaN).3. The chip package of claim 1 , wherein a thickness of the functional layer is in a range from 3 μm to 4 μm.4. The chip package of claim 1 , wherein the grounding layer substantially covers the entire bottom surface of the main body.5. The chip package of claim 1 , wherein a region of the grounding layer is greater than an area of the grounding pad.6. The chip package of claim 1 , wherein the grounding layer is made of a material comprising copper.7. The chip package of claim 1 , wherein the device chip has a bottom surface that faces the functional layer ...

POLYIMIDE PRECURSOR COMPOSITION AND USE THEREOF

The present invention provides a polyimide precursor composition comprising an amic acid ester oligomer of Formula (1): 9. The composition according to claim 1 , wherein m is an integer from 1 to 15.10. The composition according to claim 1 , further comprising a photoinitiator.12. A dry film comprising a support carrier and a resin layer on the support carrier wherein the resin layer comprises the composition according to claim 1 , and wherein the resin layer has a solvent content of at least 5 wt % based on the total weight of the resin layer.13. The dry film according to claim 12 , wherein the solvent content ranges from 15 to 60 wt % based on the total weight of the resin layer.15. The dry film according to claim 12 , wherein a surface of the support carrier that is laminated to the resin layer has an average surface roughness of 0 to 5 μm.16. A polyimide film prepared from the composition according to17. A polyimide film prepared from the dry film according to .18. A method of forming a polyimide laminate having a matting surface claim 14 , comprising:{'claim-ref': {'@idref': 'CLM-00014', 'claim 14'}, '(1) laminating the dry film according to to a substrate in such a manner that the resin layer of the dry film faces the substrate;'}(2) removing the support carrier from the dry film; and(3) heating to remove the solvent.19. The method according to wherein the amic acid ester oligomer of Formula (1) does not contain any photosensitive group and the method comprises the following steps:{'claim-ref': {'@idref': 'CLM-00014', 'claim 14'}, '(1) laminating the dry film according to to a substrate in such a manner that the resin layer of the dry film faces the substrate;'}(2) removing the support carrier from the dry film; and(3) heating to remove the solvent and imidizing the polyimide precursor composition to form a polyimide.20. The method according to wherein the amic acid ester oligomer of Formula (1) contains a photosensitive group and the method comprises the ...

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

A printed wiring board includes resin insulation layers, conductive layers formed on the resin insulation layers respectively such that each of the conductive layers is formed on a surface of each of the resin insulation layers, and via conductors penetrating through the resin insulation layers respectively such that the via conductors are connecting the conductive layers through the resin insulation layers. Each of the resin insulation layers includes a modified resin layer formed by plasma treatment such that the modified resin layer is forming the surface of each of the resin insulation layers, each of the conducive layers includes a modified conductive layer formed by the plasma treatment such that the modified conductive layer is forming the surface of each of the conductive layers, and the modified resin layer has a surface modification different from a surface modification of the modified conductive layer. 1. A printed wiring board , comprising:a plurality of resin insulation layers;a plurality of conductive layers formed on the resin insulation layers respectively such that each of the conductive layers is formed on a surface of each of the resin insulation layers; anda plurality of via conductors penetrating through the resin insulation layers respectively such that the plurality of via conductors is connecting the plurality of conductive layers through the resin insulation layers,wherein each of the resin insulation layers includes a modified resin layer formed by plasma treatment such that the modified resin layer is forming the surface of each of the resin insulation layers, each of the conducive layers includes a modified conductive layer formed by the plasma treatment such that the modified conductive layer is forming the surface of each of the conductive layers, and the modified resin layer has a surface modification different from a surface modification of the modified conductive layer.2. A printed wiring board according to claim 1 , wherein the ...

CONDUCTIVE FLEXIBLE AND STRETCHABLE ENCAPSULATION METHOD AND APPARATUS

Apparatus and methods are provided for flexible, stretchable, wearable electronics. In an example, an apparatus for providing flexible and stretchable conductors can include a first elastomer layer, conductive ink applied to the first elastomer layer, and an adhesive layer, in cooperation with the first elastomer layer, configured to encapsulate the conductive ink, the adhesive layer further configured to allow the apparatus to be attached to a second apparatus. 1. An apparatus for providing flexible and stretchable conductors , the apparatus comprising:a first elastomer layer;conductive ink applied to the first elastomer layer; andan adhesive layer, in cooperation with the first elastomer layer, configured to encapsulate the conductive ink, the adhesive layer configured to allow the apparatus to be attached to a garment and to waterproof a seam of the garment.2. The apparatus of claim 1 , wherein the first elastomer layer includes a thermoplastic elastomer.3. The apparatus of claim 2 , wherein the thermoplastic elastomer includes thermoplastic polyurethane.4. The apparatus of claim 1 , wherein the adhesive layer includes a thermoplastic elastomer.5. The apparatus of claim 4 , wherein the thermoplastic elastomer includes thermoplastic polyurethane.620-. (canceled) The disclosure herein relates generally to wearable electronics and more particularly to flexible and stretchable, wearable electronics.Electronics continue to be developed that are smaller yet more powerful computationally and functionally. Opportunities and challenges continue to arise that push the creative enterprise of electronic designers to provide small powerful electronic products that provide desired user functionality in a convenient package. Wearable electronics have been developed yet have failed to capture widespread use because they are physically rigid, bulky, or lack computational or functional capabilities.The following description and the drawings sufficiently illustrate specific ...

HIGH-SPEED INTERCONNECTS FOR PRINTED CIRCUIT BOARDS

High-speed interconnects for printed circuit boards and methods for forming the high-speed interconnects are described. A high-speed interconnect may comprise a region of a conductive film having a reduced surface roughness and one or more regions that have been treated for improved bonding with an adjacent insulating layer. Regions of reduced roughness may be used to carry high data rate signals within PCBs. Regions treated for bonding may include a roughened surface, adhesion-promoting chemical treatment, and/or material deposited to improve wettability of the surface and/or adhesion to a cured insulator. 1. A printed circuit board comprising:a first insulating layer;a second insulating layer; anda conductive interconnect comprising a first surface adjacent to the first insulating layer and a second surface opposite the first surface and adjacent to the second insulating layer, wherein at least a first region of the first surface exhibits greater adhesion to the first insulating layer than a second region of the first surface.2. The printed circuit board of claim 1 , wherein the first region includes a chemical adhesion promoter.3. The printed circuit board of claim 1 , wherein the first region includes one or more material depositions between the conductive interconnect and the first insulating layer that provide a greater adhesion than the conductive interconnect to a cured form of the first insulating layer.4. The printed circuit board of claim 1 , wherein the first region has a first surface roughness greater than a second surface roughness of the second region.5. The printed circuit board of claim 4 , wherein the conductive interconnect is formed from a rolled or rolled annealed metallic foil.6. The printed circuit board of claim 5 , wherein the metallic foil comprises copper.7. The printed circuit board of claim 4 , wherein the second region extends across a trace of the conductive interconnect and the first region extends across a pad attached to the trace ...

METHOD FOR MAKING ELECTRONIC DEVICE WITH COVER LAYER WITH OPENINGS AND RELATED DEVICES

A method of making an electronic device includes forming an electrically conductive pattern on a substrate, forming a cover layer on the substrate and the electrically conductive pattern, and forming openings in the cover layer and being aligned with the electrically conductive pattern. The method also includes positioning an IC on the cover layer so that bond pads of the IC are aligned with the openings, and heating under pressure the cover layer to both mechanically secure and electrically interconnect the IC. 119-. (canceled)20. An electronic device comprising:a substrate having an upper surface;an electrically conductive pattern on the upper surface of said substrate and comprising a plurality of traces;a cover layer having a lower surface directly on the upper surface of said substrate and said electrically conductive pattern, said cover layer having a plurality of openings therein aligned with said electrically conductive pattern, each opening having a respective width less than that of a respective trace in said electrically conductive pattern; andan integrated circuit (IC) having a lower surface in direct contact with a lower surface of said cover layer, said IC having a plurality of bond pads on the lower surface thereof electrically coupled to adjacent ones of said plurality of traces.21. The electronic device of wherein said cover layer comprises a liquid crystal polymer (LCP) cover layer.22. The electronic device of wherein said LCP cover layer is heat bonded to adjacent portions of said substrate and said IC.23. The electronic device of wherein said cover layer has a greater thickness adjacent said electrically conductive pattern so that an upper surface thereof contacts and seals against an underside of said IC.24. The electronic device of wherein said substrate comprises an LCP layer.25. The electronic device of further comprising electrically conductive material in said plurality of openings.26. The electronic device of wherein said electrically ...

CAPACITIVE LEADWIRE FOR PHYSIOLOGICAL PATIENT MONITORING

A leadwire for physiological patient monitoring is provided that transfers potentials received at a chest electrode to a data acquisition device. The leadwire includes an electrode end connectable to the chest electrode and a first conductive layer extending from the electrode end. The leadwire also has a device end connectable to a data acquisition device and a second conductive layer extending from the device end. The first conductive layer is galvanically isolated from the second conductive layer such that the first conductive layer and the second conductive layer form a capacitor. 1. A leadwire for physiological patient monitoring that transfers potentials received at a chest electrode to a data acquisition device , the leadwire comprising:an electrode end connecting to a chest electrode;a first conductive layer extending from the electrode end;a device end connectable to a data acquisition device;a second conductive layer extending from the device end; andwherein the first conductive layer is galvanically isolated from the second conductive layer such that the first conductive layer and the second conductive layer form a capacitor.2. The leadwire of claim 1 , wherein the first conductive layer and the second conductive layer are parallel wires divided by a substrate.3. The leadwire of claim 1 , wherein the first conductive layer and the second conductive layer are coaxially arranged.4. The leadwire of claim 1 , wherein the first conductive layer and the second conductive layer are comprised of a conductive ink printed on a substrate.5. The leadwire of claim 4 , wherein the first conductive layer is a first trace printed on a first side of the substrate claim 4 , and the second conductive layer is a second trace printed on a second side of the substrate.6. The leadwire of claim 5 , wherein the substrate is thermoplastic polyurethane.7. The leadwire of claim 6 , further comprising an insulating layer covering the first trace and the second trace.8. The leadwire ...

Interlayer insulating resin film, interlayer insulating resin film having adhesive auxiliary layer, and printed circuit board

Provided are an interlayer insulating resin film, an interlayer insulating resin film having an adhesive auxiliary layer, and a printed circuit board obtained using the interlayer insulating resin film or the interlayer insulating resin film having an adhesive auxiliary layer, with which it is possible to obtain an interlayer insulating layer having exceptional adhesion to a circuit board even after accelerated environmental testing, and exceptional heat resistance, dielectric characteristics, and low thermal expansion. Specifically: an interlayer insulating resin film containing an epoxy resin (A), a cyanate resin (B), and a dicyandiamide (C); an interlayer insulating resin film having an adhesive auxiliary layer, the adhesive auxiliary layer being provided on one surface of the above-mentioned interlayer insulating resin film, wherein the adhesive auxiliary layer having an adhesive auxiliary layer contains an epoxy resin (a), a cyanate resin (b), and an inorganic filer (c); and a printed circuit board obtained using the interlayer insulating resin film or the interlayer insulating resin film having an adhesive auxiliary layer.

HIGH VOLTAGE POLYMER DIELECTRIC CAPACITOR ISOLATION DEVICE

An electronic isolation device is formed on a monolithic substrate and includes a plurality of passive isolation components. The isolation components are formed in three metal levels. The first metal level is separated from the monolithic substrate by an inorganic PMD layer. The second metal level is separated from the first metal level by a layer of silicon dioxide. The third metal level is separated from the second metal level by at least 20 microns of polyimide or PBO. The isolation components include bondpads on the third metal level for connections to other devices. A dielectric layer is formed over the third metal level, exposing the bondpads. The isolation device contains no transistors. 1. An isolation device , comprising:a pre-metal dielectric (PMD) layer disposed over a substrate;a first metal level disposed over the PMD layer;a dielectric layer disposed over the first metal layer;a second metal level disposed over the dielectric layer;a polymer dielectric layer disposed over the second metal level, the polymer dielectric layer comprising primarily a layer of polymer selected from the group consisting of polyimide and poly(p-phenylene-2,6-benzobisoxazole) (PBO), said polymer being at least 20 microns thick;a third metal level disposed over said polymer dielectric layer, said third metal level extending into upper via holes in said polymer dielectric layer to form upper vias which make electrical connections to said second metal level;bondpads disposed over said third metal level; anda dielectric overcoat dielectric layer disposed over said third metal level, said dielectric overcoat dielectric layer exposing said bondpads;said isolation device containing a plurality of isolation components selected from the group consisting of a capacitor and a transformer, said isolation components being formed in at least said second metal level and said third metal level.2. The isolation device of claim 1 , wherein:each instance of said isolation components is a ...

FLEXIBLE PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

A flexible printed circuit board and a method of manufacturing the same are disclosed. A flexible printed circuit board having a flexible region and a rigid region includes an inner board layer, an outer board layer laminated on the inner board layer and having a cavity formed in the rigid region, and a laminate exposing a pad in the cavity and laminated on the inner board layer in the rigid region where the pad is formed. The laminate includes a coverlay layer and a copper foil layer arranged so that the coverlay layer faces the inner board layer. 1. A flexible printed circuit board having a flexible region and a rigid region , comprising:an inner board layer;an outer board layer laminated on the inner board layer and having a cavity formed in the rigid region; anda laminate exposing a pad in the cavity and laminated on the inner board layer in the rigid region where the pad is formed,wherein the laminate comprises a coverlay layer and a copper foil layer arranged so that the coverlay layer faces the inner board layer.2. The flexible printed circuit board of claim 1 , wherein the laminate is laminated continuously on the inner board layer in the rigid region where the pad is formed.3. The flexible printed circuit board of claim 1 , further comprising an electronic device embedded in the cavity and electrically connected to the pad.4. The flexible printed circuit board of claim 3 , wherein the electronic device comprises a terminal formed at a portion thereof claim 3 , andthe terminal is electrically connected with the pad through a contact.5. The flexible printed circuit board of claim 1 , wherein the inner board layer comprises a first insulation layer and an inner circuit layer formed on at least one face of the first insulation layer claim 1 , andthe outer board layer comprises a second insulation layer laminated on the inner board layer and an outer circuit layer formed on the second insulation layer.6. The flexible printed circuit board of claim 5 , wherein ...

Polyamide films and process for preparation

The invention relates to a stretched polymer film made of a polyamide composition comprising a semi-crystalline semi-aromatic polyamide (PPA), wherein the PPA consists of repeat units derived from aromatic dicarboxylic acid comprising at least 80 mole % of terephthalic acid, relative to the total amount of aromatic dicarboxylic acid; and diamine comprising at least 5 mole % 1,4-butanediamine and at least 5 mole % 1,6-hexanediamine, relative to the total amount of diamine, the combined amount of 1,4-butanediamine and 1,6-hexanediamine being at least 60 mole % relative to the total amount of diamine; and 0-2 mole % of other monomeric units, relative to the total amount of aromatic dicarboxylic acid, diamine and other monomeric units. The invention further relates to a process for preparing the polyamide film by melt extrusion and stretching of the film.

WIRING SUBSTRATE AND PRODUCTION METHOD THEREFOR

A wiring substrate includes a surface layer having electrical insulation properties and a connection terminal having electrical conduction properties and protruding from the surface layer. The connection terminal includes a base portion, a covering portion and a filling portion. The base portion of the connection terminal is made of an electrically conductive first metal and located adjacent to the surface layer so as to extend through the surface layer and protrude from the surface layer. The covering portion of the connection terminal is made of an electrically conductive second metal having a melting point lower than that of the first metal and located so as to cover the base portion. The filling portion of the connection terminal is made of at least one of the second metal and an alloy containing the first and second metals and located so as to fill a hollow in the base portion. 16-. (canceled)7. A wiring substrate , comprising:a surface layer having electrical insulation properties; anda connection terminal having electrical conduction properties and protruding from the surface layer,wherein the connection terminal includes:a base portion made of an electrically conductive first metal and located adjacent to the surface layer;a covering portion made of an electrically conductive second metal having a melting point lower than that of the first metal and covering the base portion; anda filling portion made of at least one of the second metal and an alloy containing the first and second metals and filling a hollow in the base portion.8. The wiring substrate according to claim 7 , wherein the first metal is copper (Cu); and wherein the second metal is tin (Sn).9. The wiring substrate according to claim 7 , wherein the base portion is located so as to so as to extend through the surface layer and protrude from the surface layer.10. A production method of a wiring substrate claim 7 , the wiring substrate comprising: a surface layer having electrical insulation ...

METHOD FOR FORMING ORGANIC COATING ON COPPER SURFACE

A method for selective deposition of an organic solderability preservative coating on a copper surface of an article is disclosed. The method includes two steps of organic coatings by two solutions; the first step contains contacting the copper surface with a first solution including azole compound and the second step contains contacting the copper surface treated by the first solution with a second solution including a specific pyrazine derived compound. 2. The method of claim 1 , wherein the second solution comprises the compound represented by the formula (I) in amount of 0.1 g/L to 50 g/L.3. The method of claim 1 , wherein the first solution further comprises the compound represented by the formula (I).4. The method of claim 1 , wherein the second solution further comprises metal ions selected from Cu claim 1 , Sn claim 1 , Zn claim 1 , Ag claim 1 , Ni claim 1 , Pd claim 1 , Ba claim 1 , Mg claim 1 , Fe claim 1 , Au claim 1 , Pt claim 1 , W claim 1 , Bi claim 1 , Sb claim 1 , Mn and Pd.5. The method of claim 1 , wherein the second solution further comprises ammonium chloride.6. The method of claim 1 , wherein the article further comprises a gold surface and the organic film selectively deposit on copper surface with substantially no deposit on gold surface.7. An organic film on a copper surface formed by the method of .9. The organic film of claim 8 , wherein the thickness of the film comprising the first layer and the second layer is from 10 to 500 nm.11. The method of claim 10 , in which the article further comprises a gold surface claim 10 , wherein the organic film selectively deposit on copper surface with substantially no deposit on gold surface.12. The method of claim 10 , wherein the article is selected from printed circuit board claim 10 , electronic components and decorative accessories. The present invention relates generally to a method for forming an organic coating on a surface of copper to prevent corrosion of copper. In particular, the present ...

Touch sensor and manufacturing method thereof

A touch sensor including a first substrate which extends in a first direction and on which first channels may be formed and stretched, a first conductive liquid injected into the first channels, a second substrate which extends in a second direction which intersects with the first direction and on which second channels may be formed and stretched, and a second conductive liquid injected into the second channels.

Conductive Transparent Substrate Manufacturing Method, and Conductive Transparent Substrate

Provided herein is a method for manufacturing a conductive transparent substrate, the method including forming a plurality of main electrodes on the substrate such that the main electrodes are distanced from one another; and forming a connecting electrode that electrically connects two or more main electrodes such that the plurality of main electrodes are grouped into a plurality of group electrodes that are electrically disconnected from one another, thereby producing a conductive transparent substrate with excellent transmittance in a process of high yield. 1. A method for manufacturing a conductive transparent substrate ,comprising:a main electrode step of manufacturing a plurality of main electrodes arranged on a substrate in such a manner that the plurality of main electrodes are spaced apart from each other; anda connection electrode step of manufacturing a connection electrode electrically connecting at least two main electrodes in such a manner that the plurality of main electrodes are grouped as a plurality of group electrodes and the plurality of group electrodes are electrically isolated from each other.219-. (canceled)20. The method according to claim 1 ,wherein at the forming of a connecting electrode, a connecting electrode pattern is printed, or a connecting electrode layer is formed and then a portion of the connecting electrode layer is removed or insulated thereby forming a connecting electrode, such that the main electrodes that are distanced and electrically disconnected from one another are electrically connected but that two or more of the main electrodes are grouped and the grouped main electrodes are disconnected from one another.21. The method according to claim 1 ,wherein the forming of a connecting electrode comprises:depositing a conductive layer having electrical conductivity on the substrate; andpatterning the conductive layer such that the connecting electrode is formed.22. The method according to claim 1 ,wherein the forming of a ...

PATTERNED CONDUCTIVE STRUCTURE AND METHOD FOR FORMING THE SAME

A method for forming a patterned conductive structure is provided. The method includes forming a soluble layer on a surface of a substrate, wherein the soluble layer has an opening exposing a rough portion of the surface. A first conductive layer is formed on the soluble layer, wherein the first conductive layer extends onto the rough portion in the opening. The soluble layer and the first conductive layer on the soluble layer are removed, wherein a portion of the first conductive layer corresponding to the rough portion is remained on the substrate. A patterned conductive structure formed by the method is also provided. 1. A method for forming a patterned conductive structure , comprising:forming a soluble layer on a surface of a substrate,wherein the soluble layer has an opening exposing a rough portion of the surface of the substrate;forming a first conductive layer on the soluble layer, wherein the first conductive layer extends onto the rough portion in the opening; andremoving the soluble layer and the first conductive layer on the soluble layer, wherein a portion of the first conductive layer corresponding to the rough portion is remained on the substrate.2. The method as claimed in claim 1 , wherein the step of removing the soluble layer and the first conductive layer on the soluble layer comprises performing a washing process using a solvent.3. The method as claimed in claim 2 , wherein the solvent is selected from a group consisting of water claim 2 , ethanol claim 2 , methanol claim 2 , isopropanol claim 2 , dimethylformamide (DMF) claim 2 , chloroform or a combination thereof.4. The method as claimed in claim 1 , wherein the soluble layer is dissolved in a nonaggressive solvent to be removed.5. The method as claimed in claim 1 , wherein the soluble layer comprises polyvinyl alcohol claim 1 , polyethylene glycol claim 1 , polyethylene glycol-polypropylene glycol copolymer claim 1 , linear polyacrylamice claim 1 , polyvinylpyrrolidone (homo or copolymer) ...

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

A printed circuit board and a method of manufacturing the same are provided. The printed circuit board includes an insulating layer including a first resin layer and a second resin layer, circuit layers disposed on upper and lower surfaces of the insulating layer, and a via configured to connect the circuit layer formed on the upper surface to the circuit layer formed on the lower surface, and the second resin layer extends from an upper surface of the first resin layer to a lower surface of the first resin layer by passing through the first resin layer as to contact a side surface of the via. 1. A printed circuit board comprising:an insulating layer comprising a first resin layer and a second resin layer;circuit layers disposed on upper and lower surfaces of the insulating layer; anda via configured to connect the circuit layer formed on the upper surface to the circuit layer formed on the lower surface,wherein the second resin layer extends from an upper surface of the first resin layer to a lower surface of the first resin layer by passing through the first resin layer as to contact a side surface of the via.2. The printed circuit board of claim 1 , wherein the second resin layer is a photosensitive resin layer.3. The printed circuit board of claim 1 , wherein the first resin layer comprises a core board having a through hole claim 1 , and the second resin layer on an upper surface of the core board extends to the second resin layer on a lower surface of the core board via the through hole.4. The printed circuit board of claim 1 , wherein the via is formed in an hourglass shape.5. A printed circuit board comprising:a core board with first circuit layers disposed on upper and lower surfaces of the core board;an insulating layer disposed on both the upper and lower surfaces of the core board and the first circuit layers;second circuit layers disposed on upper and lower surfaces of the insulating layer; anda through via disposed through the core board to connect the ...

APPLICATION SPECIFIC ELECTRONICS PACKAGING SYSTEMS, METHODS AND DEVICES

Depicted embodiments are directed to an Application Specific Electronics Packaging (“ASEP”) system, which enables the manufacture of additional products using reel to reel () manufacturing processes as opposed to the “batch” processes used to currently manufacture electronic products and MIDs. Through certain ASEP embodiments, it is possible to integrate connectors, sensors, LEDs, thermal management, antennas, RFID devices, microprocessors, memory, impedance control, and multi-layer functionality directly into a product. 1. A light comprising:a housing;a light pipe attached to the housing; anda device formed by an Application Specific Electronics Packaging System mounted in the housing, the Application Specific Electronics Packaging System having at least one light emitting diode provided thereon, the light pipe being positioned above the at least one light emitting diode.2. The light of claim 1 , wherein forming the Application Specific Electronics Packaging System comprises:forming a continuous carrier;molding a plurality of substrates onto the carrier;forming traces on the substrates;electroplating the traces;electrically attaching components to the traces to form a plurality of devices, at least one of the components on each device being a light emitting diode;singulating one of the devices from the remainder of the carrier.3. The light of claim 2 , wherein forming the traces comprises:ablating the substrate with a laser;depositing an ink on the ablated surface; andsintering the ink.4. The light of claim 2 , wherein the components are seated within pockets formed in the substrates.514-. (canceled)15. A device comprising:a singulated carrier portion;a substrate molded onto the singulated carrier portion;seed layer traces on the substrate;plated metal traces on the seed layer traces; anda component electrically attached to at least one plated metal trace.16. The device of claim 15 , wherein the device comprises at least one of a printed circuit board claim 15 , a ...

Resin Composition, Prepreg, Metal Foil-Clad Laminate, Resin Sheet, and Printed Wiring Board

A resin composition contains a maleimide compound (A), a cyanate ester compound (B), a polyphenylene ether compound (C) with a number average molecular weight of not lower than 1000 and not higher than 7000 and represented by Formula (1), and a block copolymer (D) having a styrene backbone. In Formula (1), X represents an aryl group; —(Y—O)n- represents a polyphenylene ether moiety; R, R, and Reach independently represent a hydrogen atom, an alkyl group, an alkenyl group, or an alkynyl group; nrepresents an integer of from 1 to 100; nrepresents an integer of from 1 to 6; and nrepresents an integer of from 1 to 4. 2: The resin composition according to claim 1 , wherein the block copolymer (D) comprising a styrene backbone contains at least one selected from the group consisting of a styrene-butadiene block copolymer claim 1 , a styrene-isoprene block copolymer claim 1 , a styrene-hydrogenated butadiene block copolymer claim 1 , a styrene-hydrogenated isoprene block copolymer claim 1 , and a styrene-hydrogenated (isoprene/butadiene) block copolymer.4: The resin composition according to claim 1 , further comprising a styrene oligomer (E).5: The resin composition according to claim 1 , further comprising a filler (F).6: The resin composition according to claim 5 , wherein a content of the filler (F) is from 50 to 300 parts by mass relative to 100 parts by mass of resin solid component.7: The resin composition according to claim 1 , further comprising a flame retardant (G).8: The resin composition according to claim 1 , wherein a content of the polyphenylene ether compound (C) represented by Formula (1) is from 1 to 90 parts by mass relative to 100 parts by mass of resin solid component.9: The resin composition according to claim 1 , wherein a content of the block copolymer (D) comprising a styrene backbone is from 1 to 50 parts by mass relative to 100 parts by mass of resin solid component.11: A prepreg formed from a substrate and a resin composition described in .12: A ...