Preparation method of static suppressor module

Printed circuit board and manufacturing method thereof

Disclosed herein is a printed circuit board including: a first metal layer; an insulator applied onto the first metal layer; a second metal layer applied onto the insulator; and a protective insulator formed on a side of at least one of the first and second metal layers, thereby making it possible to easily inspect a breakdown voltage even at a high voltage.

SYSTEMS AND METHODS FOR POWER MODULES

Systems and methods described herein relate to an adapter driver board for parallel operation of power modules. The systems and methods receive an electrical signal at an input interface of a high voltage adapter board. The systems and methods may deliver the electrical signals to first and second switches along corresponding first and second conductive traces. The first conductive trace extends along the high voltage adapter board and is conductively coupled to the input interface and the first switch. The second conductive trace extends along the high voltage adapter board and is conductively coupled to the input interface and the second switch. The first and second conductive traces may have an inductance or other property that is substantially the same as each other.

System and method for protecting a computing device using vsd material, and method for designing same

Embodiments described herein provide for programmatic design or simulation of substrates carrying electrical elements to integrate voltage switchable dielectric (“VSD”) material as a protective feature. In particular, VSD material may be incorporated into the design of a substrate device for purpose of providing protection against transient electrical conditions, such as electrostatic discharge (ESD).

Electrostatic discharge protection for electrical components, devices including such protection and methods for making the same

Systems and methods for protecting electrical components such as light emitting diodes are described. In some embodiments, electrical components are protected from high level electrostatic discharge (“ESD”) events by a circuit board that provides an intrinsic level of ESD protection. At the same time, such electrical components are protected against low level ESD events by one or more diodes that are electrically coupled thereto. The one or more diodes may be thin film diodes comprising at least one layer of p-type semiconductive material and at least one layer of n-type semiconductive material. Devices including ESD protection and methods for manufacturing such devices are also described.

Electrostatic discharge protection board

An electrostatic discharge (ESD) protection board may include an electrostatic discharge (ESD) protection board, including a substrate, a pattern layer including circuit patterns formed on the substrate, and a high-voltage conductive material formed on the circuit patterns, which are insulated from each other, and a portion of the substrate between the circuit patterns.

ELECTRICAL TRANSIENT MATERIAL AND METHOD FOR MAKING SAME

Electrical transient materials are disclosed. Furthermore, methods to provide electrical transient materials are disclosed. In one implementation, an apparatus includes an electrical transient material; and conductive particles disposed in the electrical transient material, at least one or more of the conductive particles have an irregular shape. 1. An apparatus , comprising:an electrical transient material; andconductive particles disposed in the electrical transient material, at least one or more of the conductive particles have an irregular shape.2. The apparatus according to claim 1 , wherein the at least one or more of the conductive particles has an exterior surface that is flat or straight.3. The apparatus according to claim 1 , further comprising nonconductive particles disposed in the electrical transient material.4. The apparatus according to claim 3 , wherein at least one of the nonconductive particles is formed as a sphere or an oval shape.5. The apparatus according to claim 1 , wherein the electrical transient material comprises first and second opposite surfaces claim 1 , and comprising an electrically conductive layer disposed over at least one of the first and second opposite surfaces.6. The apparatus according to claim 1 , wherein the electrical transient material is a voltage variable material (VVM).7. A method claim 1 , comprising:providing an electrical transient material; anddisposing conductive particles in the electrical transient material, at least one or more of the conductive particles have an irregular shape.8. The method according to claim 7 , wherein the at least one or more of the conductive particles has an exterior surface that is flat or straight.9. The method according to claim 7 , further comprising disposing nonconductive particles in the electrical transient material.10. The apparatus method to claim 9 , wherein at least one of the nonconductive particles is formed as a sphere or an oval shape.11. The apparatus method to claim 7 ...

Surface-mountable electrical circuit protection device

Provided herein are improved electrical circuit protection devices for protection against electrostatic discharge (ESD), the devices including a first support substrate, a first electrode and a second electrode formed on the first support substrate, wherein the first electrode and the second electrode are formed from a conductive material. The devices further include a first bonding pad disposed on the first and second electrode, the first bonding pad having a first cavity formed therein; a second support substrate disposed on the first bonding pad, the second support substrate having a second cavity formed therein, and a voltage variable material disposed within the first cavity and the second cavity and electrically connected to the first electrode and the second electrode. The devices further include a second bonding pad disposed on the second support substrate, and a third support substrate disposed on the second bonding pad.

Power Module Having Reduced Susceptibility to Defects, and Use Thereof

A power module is disclosed. In an embodiment a power module includes a carrier substrate having a dielectric layer, a metallization layer and a recess and an electrical functional element, wherein the metallization layer includes a structured electrical conductor, wherein the functional element is interconnected with the electrical conductor, wherein the functional element is arranged in the recess, and wherein the functional element includes a thermal bridge that has a greater thermal conductivity than the carrier substrate.

SINTERED BODY FOR VARISTOR, MULTILAYER SUBSTRATE USING SAME, AND PRODUCTION METHOD FOR THESE

To provide a zinc oxide-based varistor that exhibits adequate characteristics without using antimony. Disclosed is a sintered body for a varistor, including zinc oxide as a main component; 0.6 to 3.0 mol % of bismuth oxide in terms of bismuth (Bi); 0.2 to 1.4 mol % of cobalt oxide in terms of cobalt (Co); 0.1 to 1.5 mol % of chrome oxide in terms of chrome (Cr); and 0.1 to 1.5 mol % of manganese oxide in terms of manganese (Mn), wherein the contents of antimony (Sb), a rare earth element and tin (Sn) are not more than a level of impurities. 1. A sintered body for a varistor , comprising:zinc oxide as a main component;0.6 to 3.0 mol % of bismuth oxide in terms of bismuth (Bi);0.2 to 1.4 mol % of cobalt oxide in terms of cobalt (Co);0.1 to 1.5 mol % of chrome oxide in terms of chrome (Cr); and0.1 to 1.5 mol % of manganese oxide in terms of manganese (Mn), whereinthe contents of antimony (Sb), a rare earth element and tin (Sn) are not more than a level of impurities.2. The sintered body for a varistor according to claim 1 , comprising:0.6 to 3.0 mol % of bismuth oxide in terms of bismuth (Bi);0.2 to 1.4 mol % of cobalt oxide in terms of cobalt (Co);0.1 to 1.5 mol % of chrome oxide in terms of chrome (Cr);0.1 to 1.5 mol % of manganese oxide in terms of manganese (Mn); andthe balance being zinc oxide and inevitable impurities.3. The sintered body for a varistor according to claim 1 , further comprising at least one selected from the group consisting of 0.1 to 2.0 mol % of scandium oxide in terms of scandium (Sc); 0.1 to 2.0 mol % of barium oxide in terms of barium (Ba); and 0.1 to 4.0 mol % of boron oxide in terms of boron (B).4. The sintered body for a varistor according to claim 3 , further comprising at least one selected from the group consisting of 0.1 to 2.0 mol % of scandium oxide in terms of scandium (Sc); 0.1 to 2.0 mol % of barium oxide in terms of barium (Ba); and 0.1 to 2.0 mol % of boron oxide in terms of boron (B).5. The sintered body for a varistor ...

Method for suppressing electrostatic discharge in wireless IC tag

Surface-mountable electrical circuit protection device

本发明涉及表面贴装式电路保护装置。本发明提供一种用于防止静电放电(ESD)的改进的电路保护装置，所述装置包括第一支撑基底，形成在第一支撑基底上的第一电极和第二电极，其中所述第一电极和第二电极由导电材料形成。所述装置进一步包括设置在第一和第二电极上的第一结合垫，第一结合垫中形成有第一腔；设置在第一结合垫上的第二支撑基底，所述第二支撑基底中形成有第二腔；放置在第一腔和第二腔中并被电连接到第一电极和第二电极的电压可变材料。所述装置还包括设置在第二支撑基底上的第二结合垫；以及设置在第二结合垫上的第三支撑基底。

Devices and systems for electrostatic discharge suppression

A device ( 10 ) for suppressing electrostatic discharge comprises first and second multilayer structures ( 14, 16 ) surrounding an electrostatic discharge reactance layer ( 12 ), the resistance of said electrostatic discharge reactance layer ( 12 ) varying in response to the occurrence of an electrostatic discharge signal. Each multilayer structure ( 14, 16 ) comprises a barrier layer ( 18 ), a terminal layer ( 20 ) and an electrode layer ( 28 ). Alternatively, a conductive layer ( 80 ) can be used instead of a second multilayer structure ( 16 ). An ESD suppression device ( 110 ) can be embedded in a printed circuit board ( 122, 210 ) providing a way to protect board components from harmful ESD events.

Variable voltage protection structures and method for making same

본 발명의 가변전압 보호부품은 전압가변 물질 내에 삽입된 대체로 일정한 두께의 절연 물질층으로 된 보강층을 포함한다. 이러한 구성으로, 상기 보강층은, 클램프 전압을 감소시키거나 전압가변 물질에서 단락을 일으키는 압력에 저항하는 가변전압 보호부품을 위한 균일한 두께를 한정한다. 게다가, 상기 가변전압 보호 부품은 가변전압 보호장치를 형성하기 위해 가압성 접지판에 부착될 수 있다. 상기 가변전압 보호부품 및 장치를 제조하기 위한 방법이 제공된다. The variable voltage protection component of the present invention includes a reinforcement layer of a layer of insulating material having a substantially constant thickness embedded in a voltage variable material. With this configuration, the reinforcing layer defines a uniform thickness for the variable voltage protection component that is resistant to pressure reducing the clamp voltage or causing a short circuit in the voltage variable material. In addition, the variable voltage protection component can be attached to the pressurized ground plate to form the variable voltage protection device. A method for manufacturing the variable voltage protection component and device is provided.

Methods for fabricating current-carrying structures using voltage switchable dielectric materials

A method is provided for fabricating current-carrying formation on substrates. The method includes providing a substrate including a layer of a voltage switchable dielectric material, forming a mask over the layer of the voltage switchable dielectric material, and forming an electrically conductive layer. The mask includes gaps and the electrically conductive layer is formed in the gaps. The voltage switchable dielectric material has a characteristic voltage and the electrically conductive layer is formed by applying a voltage in excess of the characteristic voltage to the substrate and depositing the electrically conductive material through an electrochemical process such as electroplating.

Substrate device or package using embedded layer of voltage switchable dielectric material in a vertical switching configuration

A substrate device includes an embedded layer of VSD material that overlays a conductive element or layer to provide a ground. An electrode, connected to circuit elements that are to be protected, extends into the thickness of the substrate to make contact with the VSD layer. When the circuit elements are operated under normal voltages, the VSD layer is dielectric and not connected to ground. When a transient electrical event occurs on the circuit elements, the VSD layer switches instantly to a conductive state, so that the first electrode is connected to ground.

A light-emitting device using voltage switchable dielectric material

A voltage switchable dielectric material (VSD) material as part of a light-emittin component, including LEDs and OLEDs.

Machine, program product, and computer-implemented method to simulate reservoirs as 2.5D unstructured grids

Example embodiments utilize machines to model reservoir geometry having geological layers as 2.5D unstructured grids. Example embodiments include program products to simulate a reservoir by generating a reservoir data system, performing a numerical fluid flow simulation, and visualizing the simulation. Data system embodiments include data structures to model a reservoir geometry as laterally unstructured two- dimensional (2D) grids and associated layer depths defining z-lines to thereby define a 2.5D unstructured grid, including datasets for: vertices of the grid cells for the future grid top and bottom surfaces, a number and listing of vertices for each grid cell, cell center coordinates, and vertex adjacency information using a compressed sparse row format. Computer- implemented methods include projecting external and internal boundaries onto a future grid surface; generating 2D unstructured, e.g., Voronoi, grids, for the top and bottom surfaces; and generating z-lines of depths corresponding to reservoir layers to thereby generate 2.5D unstructured grids.

Light-emitting diode device for voltage switchable dielectric material having high aspect ratio particles

One or more embodiments provide for a light emitting diode device that utilizes voltage switchable dielectric material having semi-conductive or conductive materials that have a relatively high aspect ratio.

Electrostatic discharge protection for electrical components, devices including such protection and methods for making the same

Systems and methods for protecting electrical components such as light emitting diodes are described. In some embodiments, electrical components are protected from high level electrostatic discharge (“ESD”) events by a circuit board that provides an intrinsic level of ESD protection. At the same time, such electrical components are protected against low level ESD events by one or more diodes that are electrically coupled thereto. The one or more diodes may be thin film diodes comprising at least one layer of p-type semiconductive material and at least one layer of n-type semiconductive material. Devices including ESD protection and methods for manufacturing such devices are also described.

Metal deposition

系统和方法包括在电压可切换介电材料上沉积一种或多种材料。在特定方面，电压可切换介电材料设置在导电背板上。在一些实施例中，电压可切换介电材料包括具有与在其上的沉积相关联的不同特性电压的区域。一些实施例包括掩模，并且可包括使用可去除接触掩模。特定实施例包括电接枝。一些实施例包括设置在两层之间的中间层。

Electronic device for voltage switchable dielectric material having high aspect ratio particles

One or more embodiments provide for a device that utilizes voltage switchable dielectric material having semi-conductive or conductive materials that have a relatively high aspect ratio for purpose of enhancing mechanical and electrical characteristics of the VSD material on the device.

Metal Deposition

Systems and methods include depositing one or more materials on a voltage switchable dielectric material. In certain aspects, a voltage switchable dielectric material is disposed on a conductive backplane. In some embodiments, a voltage switchable dielectric material includes regions having different characteristic voltages associated with deposition thereon. Some embodiments include masking, and may include the use of a removable contact mask. Certain embodiments include electrografting. Some embodiments include an intermediate layer disposed between two layers.

Voltage variable material for direct application and device using voltage variable material

本発明は、過電圧保護を実現する。特に、本発明は、電導面および非電導面に本質的に接着するように形成されている絶縁性結合剤(50)を含む電圧可変物質(VVM、100)を提示する。結合剤およびしたがってVVMは、自己硬化性を持ち、インクの形でアプリケーションに塗布してから、最終的に乾燥させて使用することができる。結合剤を使用すると、VVMを別のデバイスに、またはVVMを電気的に接続する別のプリント基板のパッド用に、配置する必要が無くなる。結合剤およびしたがってVVMは、硬い(FR-4)ラミネート、ポリイミド、またはポリマーなどの多数の異なる種類の基板に直接塗布することができる。VVMは、さらに、デバイス内に配置されているさまざまな種類の基板に直接塗布することもできる。

Light-emitting device using voltage switchable dielectric material

A voltage switchable dielectric material (VSD) material as part of a light-emitting component, including LEDs and OLEDs.

Protection of electrical devices with voltage variable materials

An arrangement of voltage variable materials for the protection of electrical components from electrical overstress (EOS) transients. A device having a plurality of electrical leads, a ground plane and a layer of voltage variable material. The voltage variable material physically bonds the plurality of electrical leads to one another as well as provides an electrical connection between the plurality of electrical leads and the ground plane. A die having a circuit integrated therein is attached to the ground plane. Conductive members electrically connect the plurality of electrical leads to the integrated circuit. At normal operating voltages, the voltage variable material has a high resistance, thus channeling current from the electrical leads to the integrated circuit via the conductive members. In response to a high voltage EOS transient, the voltage variable material essentially instantaneously switches to a low resistance state, channeling the potentially harmful EOS transient to the ground plane and away from the integrated circuit.

Substrates having voltage switchable dielectric materials

A method for designing a printed circuit board to meet a specification is described. A first voltage switchable dielectric material is placed in apposition with a first copper foil. A second voltage switchable dielectric material is placed in apposition with a second copper foil. An arcuate portion of the first copper foil is placed in apposition with a first side of an aluminum member, an adhesive substance being situated between the first copper foil and the first side of the aluminum member. An arcuate portion of the second copper foil in is placed apposition with a second side of the aluminum member, an adhesive substance being situated between the second copper foil and the second side of the aluminum member.

Voltage variable material for direct application and devices employing same

本发明提供过电压电路保护。具体地，本发明提供压变材料(VVM，100)，其包括配制来实质粘结到传导及非传导表面的绝缘粘合剂(50)。粘合剂及因而VVM是自固化的并可以墨水形式应用到应用中，其最终为干燥形式用于使用。粘合剂消除了需将VVM放置在单独装置中的需要及单独印刷电路板衬垫的需要，其中衬垫电连接VVM。粘合剂及VVM可被直接应用于许多不同类型的衬底，如刚性(FR-4)迭层板、聚酰亚胺或聚合物。VVM还可直接应用到不同类型的、放置在装置内的衬底。

Carrier system

A multi-layer carrier system (10) is described, having: at least one multi-layer ceramic substrate (2); at least one matrix module (7) of heat-producing semiconductor components (1a, 1b), the semiconductor components (1a, 1b) being provided on the multi-layer ceramic substrate (2); and an additional substrate (3), the multi-layer ceramic substrate (2) being provided on the substrate (3), wherein the matrix module (7) is connected in an electrically conductive manner to a driver circuit via the multi-layer ceramic substrate (2) and the additional substrate (3). Furthermore, a method for producing a multi-layer carrier system (10) and the use of a multi-layer ceramic substrate are described.

Metal deposition

Multi-layer semiconductor element package structure with surge-proof function and method of manufacturing the same

Electrostatic discharge multifunction resistor

The present invention provides a multifunction resistor having an improved voltage variable material (“VVM”). More specifically, the present invention provides a polymer VVM that has been formulated with a high percentage loading of conductive and/or semiconductive particles. A known length of the relatively conductive VVM is placed between adjacent electrodes to produce a desired Ohmic normal state resistance. When an electrostatic discharge event occurs, the VVM of the multifunctional resistor becomes highly conductive and dissipates the ESD threat. One application for this “resistor” is the termination of a transmission line, which prevents unwanted reflections and distortion of high frequency signals.

Variable voltage protection structures and methods for making same

根据本发明的可变电压保护部件，包括嵌入可变电压材料中具有大体为恒定厚度的绝缘材料的加固层。利用该结构，该加固层限定了一个用于可变电压保护部件的可以抵抗可以造成可变电压材料中的钳位电压降低或短路的均匀厚度。此外，该可变电压保护部件可以结合到一个可压缩的接地平面，形成一个可变电压保护装置。本发明也提供了用于制作该可变电压保护部件和装置的方法。

System and method for including protective voltage switchable dielectric material in design or simulation of substrate devices

通过确认一个或多个用于处理衬底器件上的瞬态电学事件的标准来设计衬底器件。所述一个或多个标准至少部分地基于设计者所提供的输入。根据所述一个或多个标准，可确定一个或多个用于将VSD材料集成作为衬底器件的至少一部分内或其至少一部分之上的一个层。VSD材料层被布置用于保护衬底的一个或多个部件受瞬态电学状况的侵害。

Circuit protection apparatus and method for making electrical transient material

本發明揭露一種電路保護裝置和製造電暫態材料的方法。 電路保護裝置包括電暫態材料和導電粒子。導電粒子設置於電暫態材料中，且導電粒子中的至少一者或多者具有不規則形狀。

Electrostatic discharge appts. for network devices

一种包括一与电容器(24)串联的电过载抑制器件(16)的ESD装置。ESD装置理想上是适于与网络通信器件一起使用，其同样可用于任何要求过电压保护和隔离的电子器件。具有电压可变的材料及电容器(24)的电过载器件被做成可经受住预定稳态电压的施加的大小。

Components having voltage switchable dielectric materials

스퓨리어스 전기적 이벤트(예컨대, 정전기 방전)로부터 보호하기 위한 구조 및 장치에 대해 다양한 양태가 제공된다. 일부 실시예는 두 전도성 패드들 간의 간격을 이어주는 VSDM을 포함한다. 일반적으로는 절연 상태에 있는 VSDM은 스퓨리어스 전기적 이벤트 발생 시 어느 한 패드에서 다른 패드로 전류를 전달할 수 있다(예컨대, 전류를 접지로 단락시킴). 일부 양태는 전기적 리드들(상기 전기적 리드는 패드에 연결됨) 간의 간격의 50%보다 큰 폭을 갖는 간격을 갖는다. 일부 장치는 단일 층의 VSDM을 포함한다. 일부 장치는 다층의 VSDM을 포함한다. 다양한 장치가 비활성 체적에 대한 (VSDM의) 활성 체적의 비율을 증가시키도록 설계될 수 있다. Various aspects are provided for structures and devices for protecting against spurious electrical events (e.g., electrostatic discharge). Some embodiments include VSDM coupling the spacing between two conductive pads. In general, a VSDM in an isolated state can carry current from one pad to another pad in the event of a spurious electrical event (for example, shorting the current to ground). Some embodiments have an interval that is greater than 50% of the spacing between the electrical leads (the electrical leads are connected to the pad). Some devices include a single layer of VSDM. Some devices include multilayer VSDM. Various devices can be designed to increase the ratio of active volume (of VSDM) to inactive volume.

Vertical switching configuration for ESD protection

Device applications for voltage switchable dielectric material having high aspect ratio particles

One or more embodiments provide for a device that utilizes voltage switchable dielectric material having semi-conductive or conductive materials that have a relatively high aspect ratio for purpose of enhancing mechanical and electrical characteristics of the VSD material on the device.

LED-assembly, has light emission opening unsealed by enclosing unit, and electro static discharging units formed in such manner such that discharging units made up of ceramic material form enclosing unit

The assembly has electrical supply units supplying power to an LED-chip, and an enclosing unit (4) partially surrounding the LED-chip. A light emission opening (10) is unsealed by the enclosing unit, and electro static discharging units (7, 8) are formed in such a manner that the discharging units made up of ceramic material form the enclosing unit. The LED-chip is arranged on a substrate layer that is made up of electrical non-conducting material selected from aluminum nitrate or aluminum-di-oxide, and the discharging units are made up of the ceramic material.

Light-emitting diode device for voltage switchable dielectric material having high aspect ratio particles

One or more embodiments provide for a light emitting diode device that utilizes voltage switchable dielectric material having semi-conductive or conductive materials that have a relatively high aspect ratio.

A light-emitting device using voltage switchable dielectric material

A voltage switchable dielectric material (VSD) material as part of a light-emittin component, including LEDs and OLEDs.

Dielectric composition

选择一种VSD组合物的粘合剂，使其在高电场存在下具有增强的电子迁移率。

Voltage switchable dielectric material with superior physical properties for structural applications

Embodiments described herein provide for VSD material that has superior characteristics for its use as an integral structural component of a device.

For the construction of the Vertical Handover of ESD protections

公开了用于ESD保护的垂直切换的构造。此处所公开的实施例一般涉及使用电压可切换的介电材料来实现针对ESD及其他过电压事件的垂直和/或双切换保护的结构、方法以及设备。

Apparatus and method for high speed signals on a printed circuit board

Apparatus and method for high speed signals on a printed circuit board

Eine Vorrichtung, umfassend: ein gedrucktes Leiterplattensubstrat; eine Kupfersignalleitung, die auf dem gedruckten Leiterplattensubstrat angeordnet ist; und eine nicht-lineare Übertragungsstruktur, die mit der Kupfersignalleitung gekoppelt ist, wobei die nicht-lineare Übertragungsstruktur konfiguriert ist, um eine Wellenfront eines Hochgeschwindigkeitssignalimpulses auf der Kupfersignalleitung zu schärfen. A device comprising: a printed circuit board substrate; a copper signal line disposed on the printed circuit board substrate; and a non-linear transmission structure coupled to the copper signal line, wherein the non-linear transfer structure is configured to sharpen a wavefront of a high-speed signal pulse on the copper signal line.

Easily fault power module and its application with reduction

说明一种具有降低的易故障性的功率模块。通过耗散的能量产生的热由功能结构经由热桥导出到载体衬底的下侧。为了降低热阻，功能元件位于所述载体衬底中的凹槽中。

Apparatus and method for high speed signals on a printed circuit board

In some embodiments, an apparatus includes a printed circuit board substrate, a copper signal line disposed on the printed circuit board substrate, and a nonlinear transmission structure coupled to the copper signal line, wherein the nonlinear transmission structure is configured to sharpen a wavefront of a high speed signal pulse on the copper signal line. In some embodiments, the nonlinear transmission structure may include a voltage dependent dielectric layer on the printed circuit board substrate. In some embodiments, the voltage dependent dielectric layer may include a plurality of varactors positioned at a receiving end of the signal line.

Sintered body for varistor, multilayer substrate using same, and production method for these

To provide a zinc oxide-based varistor that exhibits adequate characteristics without using antimony. Disclosed is a sintered body for a varistor, including zinc oxide as a main component; 0.6 to 3.0 mol % of bismuth oxide in terms of bismuth (Bi); 0.2 to 1.4 mol % of cobalt oxide in terms of cobalt (Co); 0.1 to 1.5 mol % of chrome oxide in terms of chrome (Cr); and 0.1 to 1.5 mol % of manganese oxide in terms of manganese (Mn), wherein the contents of antimony (Sb), a rare earth element and tin (Sn) are not more than a level of impurities.

Voltage switchable dielectric material containing conductor-on-conductor core shelled particles

A composition of voltage switchable dielectric (VSD) material that comprises a concentration of core shelled particles that individually comprise a conductor core and a conductor shell, so as to form a conductor-on-conductor core shell particle constituent for the VSD material.

Core layer structure having voltage switchable dielectric material

Electrical transient material and method for making same

Electrical transient materials are disclosed. Furthermore, methods to provide electrical transient materials are disclosed. In one implementation, an apparatus includes an electrical transient material; and conductive particles disposed in the electrical transient material, at least one or more of the conductive particles have an irregular shape.

Methods for fabricating current-carrying structures using voltage switchable dielectric materials

A method is provided for fabricating current-carrying formation on substrates. The method includes providing a substrate including a layer of a voltage switchable dielectric material, forming a mask over the layer of the voltage switchable dielectric material, and forming an electrically conductive layer. The mask includes gaps and the electrically conductive layer is formed in the gaps. The voltage switchable dielectric material has a characteristic voltage and the electrically conductive layer is formed by applying a voltage in excess of the characteristic voltage to the substrate and depositing the electrically conductive material through an electrochemical process such as electroplating.

Voltage switchable dielectric material incorporating modified high aspect ratio particles

Embodiments described herein provide for a composition of voltage switchable dielectric (VSD) material that includes a concentration of modified high-aspect ratio (HAR) particles. In an embodiment, at least a portion of the concentration includes HAR particles are surface-modified to provide core-shell HAR particles. As an alternative or addition, a portion of the concentration includes HAR particles that are surface-modified to have activated surfaces.

Devices and systems for electrostatic discharge suppression

A device (10) for suppressing electrostatic discharge comprises first and second multilayer structures (14, 16) surrounding an electrostatic discharge reactance layer (12), the resistance of said electrostatic discharge reactance layer (12) varying in response to the occurrence of an electrostatic discharge signal. Each multilayer structure (14, 16) comprises a barrier layer (18), a terminal layer (20) and an electrode layer (28). Alternatively, a conductive layer (80) can be used instead of a second multilayer structure (16). An ESD suppression device (110) can be embedded in a printed circuit lard (122, 210) providing a way to protect board components from harmful ESD events.

Power module with a low failute rate and application thereof

說明一種具低故障率之電力模組。將由耗散能量產生的熱從功能結構經一個熱橋(熱滲透)傳導到載體基板的底面。功能元件裝在載體基板的一個凹槽中，以降低熱阻。

Substrates having voltage switchable dielectric materials

Various aspects provide for incorporating a VSDM into a substrate to create an ESD-protected substrate. In some cases, a VSDM is incorporated in a manner that results in the ESD-protected substrate meeting one or more specifications (e.g., thickness, planarity, and the like) for various subsequent processes or applications. Various aspects provide for designing a substrate (e.g., a PCB) incorporating a VSDM, and adjusting one or more aspects of the substrate to design a balanced, ESD-protected substrate. Certain embodiments include molding a substrate having a VSDM layer into a first shape.

Metal deposition

Systems and methods include depositing one or more materials on a voltage switchable dielectric material. In certain aspects, a voltage switchable dielectric material is disposed on a conductive backplane. In some embodiments, a voltage switchable dielectric material includes regions having different characteristic voltages associated with deposition thereon. Some embodiments include masking, and may include the use of a removable contact mask. Certain embodiments include electrografting. Some embodiments include an intermediate layer disposed between two layers.

Substrate device or package using embedded layer of voltage switchable dielectric material in a vertical switching configuration

A substrate device includes an embedded layer of VSD material (230) that overlays a conductive element or layer (240) to provide a ground. An electrode (210), connected to circuit elements that are to be protected, extends into the thickness of the substrate to make contact with the VSD layer. When the circuit elements are operated under normal voltages, the VSD layer is dielectric and not connected to ground. When a transient electrical event occurs on the circuit elements, the VSD layer switches instantly to a conductive state, so that the first electrode is connected to ground.

Printed circuit board with integrated positive temperature coefficient device

装置包括第一线缆插头(104)部件。装置进一步包括具有多个层的印刷电路板(PCB)(116)，PCB(116)耦合到第一线缆插头(104)部件。正温度系数(PTC)设备(102)可以设置在多个层的第一层(302)上，并且多个层的第二层(304)可以被设置在多个层的第一层(302)之上。

ESD protection devices and methods of making same using standard manufacturing processes

Devices capable of protecting electronic components during the occurrence of a disturbance event using printed circuit board manufacturing techniques. A three (3) layer structure is formed comprising a polymer-based formulation sandwiched between two electrode layers. The devices can be manufactured in panel form providing high quantities of devices which can be removed from the panel and applied directly to the component to be protected. Desired patterns can be formed on either one of the electrode layers by photo-etch techniques thereby providing a process that can be tailored to a large number of applications.

Transient voltage protection circuit boards and manufacturing method

本发明涉及瞬态电压保护电路板及制造方法，特别是包括嵌入式瞬态电压保护的电路板。根据本发明，一种瞬态电压抑制设备包括介电基底层，所述介电基底层限定第一主表面、第二主表面和贯穿式延伸的多个孔；以及基本上填充所述基底中所述多个孔中每一个孔的可变阻抗材料，其中，所述可变阻抗材料在经受预定阈值以下的电压和/或电流时呈现相对高的阻抗，而在经受超过所述预定阈值的电压和/或电流时呈现相对低的阻抗，所述可变阻抗材料在呈现所述低阻抗时限定通过所述孔的分流通道。所述瞬态电压抑制设备可以保护电子部件和组件免受短时间或瞬时高电压损害。

Method for electroplating a substrate

One or more embodiments provide for a device that utilizes voltage switchable dielectric material having semi-conductive or conductive materials that have a relatively high aspect ratio for purpose of enhancing mechanical and electrical characteristics of the VSD material on the device.

Electrostatic discharge protection for embedded components

本发明提供了包括嵌入电元件(18)和嵌入电压可变材料或VVM(10)的电路。嵌入的VVM(10)提供为电压可变衬底，其与嵌入的电元件(18)如嵌入的电阻材料或嵌入的电容材料结合使用。

Surge protection circuit boards and manufacturing processes

Leiterplatten, die einen eingebauten Stoßspannungsschutz aufweisen. Printed circuit boards with built-in surge protection.

A substantially continuous layer of embedded transient protection for printed circuit boards

The protection of sensitive components on printed circuit boards by using planar transient protection material in one or more layers of a printed circuit board stackup is disclosed.

Suppress electrostatic discharge associated with radio frequency identification tags

System zur Unterdrückung elektrostatischer Entladung, umfassend: eine elektrische Schaltung (100) mit einer ersten Leiterspur (118) und einer zweiten Leiterspur (120), die mit der ersten Leiterspur ausgerichtet ist und ausgestaltet ist eine Lücke (128) dazwischen festzulegen; eine elektrische Einrichtung (112) mit einem ersten Kontakt, der für ein Verbinden mit der ersten Leiterspur ausgestaltet ist, und einen zweiten Kontakt, der für ein Verbinden mit der zweiten Leiterspur ausgestaltet ist; und ein Spannungsvariables Material (126), das an der Lücke in einer anisotropen Konfiguration benachbart angeordnet ist, um die erste Leiterspur mit der zweiten Leiterspur bei Auftreten eines elektrostatischen Entladungsereignisses direkt elektrisch zu verbinden.

Metal deposition

Systems and methods include depositing one or more materials on a voltage switchable dielectric material. In certain aspects, a voltage switchable dielectric material is disposed on a conductive backplane. In some embodiments, a voltage switchable dielectric material includes regions having different characteristic voltages associated with deposition thereon. Some embodiments include masking, and may include the use of a removable contact mask. Certain embodiments include electrografting. Some embodiments include an intermediate layer disposed between two layers.

Apparatus and method for high speed signals on a printed circuit board

Simultaneous and selective partitioning of via structures using plating resist

本发明公开了用于通过利用PCB层叠内的电镀保护层将多个通孔结构同时分割为电绝缘部分的系统和方法。这种通孔结构是通过在子复合结构中的一个或多个位置内选择性地沉积电镀保护层形成。在不同的位置上沉积的多个具有电镀保护层的子复合结构被层压以形成所期望的PCB设计的PCB层叠。通过导电层、介电层以及通过电镀保护层钻取穿过PCB层叠的穿通孔。由此，PCB板具有多个穿通孔，另一通过将PCB板放置到籽晶槽同时电镀多个穿通孔，随后浸入到非电解铜槽中。这种分割的通孔提高了线缆密度并且限制了通孔结构中的短线形成。这种分割的通孔使得大量的电信号能够传送到每个电绝缘部分而不相互干扰。

Current carrying structure using voltage switchable dielectric material

A device includes a substrate comprises a voltage switchable dielectric material. A current carrying formation is formed on a plurality of selected sections of a surface of the substrate. Another device includes a substrate comprising a voltage switchable dielectric material. The substrate includes a first surface and a second surface opposite to the first surface. A vias extends between the first surface and the second surface of the substrate. A current carrying formation is formed on a plurality of selected sections of the first and second surfaces, as well as on a surface of the substrate defining the vias to extend an electrical connection from the first surface to the second surface.

Methods for Manufacturing a Panel of Electronic Component Protection Devices

Devices capable of protecting electronic components during the occurrence of a disturbance event using printed circuit board manufacturing techniques. A three (3) layer structure is formed comprising a polymer-based formulation sandwiched between two electrode layers. The devices can be manufactured in panel form providing high quantities of devices which can be removed from the panel and applied directly to the component to be protected. Desired patterns can be formed on either one of the electrode layers by photo-etch techniques thereby providing a process that can be tailored to a large number of applications.

Metal deposition

Substrates Having Voltage Switchable Dielectric Materials

Various aspects provide for incorporating a VSDM into a substrate to create an ESD-protected substrate. In some cases, a VSDM is incorporated in a manner that results in the ESD-protected substrate meeting one or more specifications (e.g., thickness, planarity, and the like) for various subsequent processes or applications. Various aspects provide for designing a substrate (e.g., a PCB) incorporating a VSDM, and adjusting one or more aspects of the substrate to design a balanced, ESD-protected substrate. Certain embodiments include molding a substrate having a VSDM layer into a first shape.

Metal Deposition

Systems and methods include depositing one or more materials on a voltage switchable dielectric material. In certain aspects, a voltage switchable dielectric material is disposed on a conductive backplane. In some embodiments, a voltage switchable dielectric material includes regions having different characteristic voltages associated with deposition thereon. Some embodiments include masking, and may include the use of a removable contact mask. Certain embodiments include electrografting. Some embodiments include an intermediate layer disposed between two layers.

具有降低的易故障性的功率模块和其应用

说明一种具有降低的易故障性的功率模块。通过耗散的能量产生的热由功能结构经由热桥导出到载体衬底的下侧。为了降低热阻，功能元件位于所述载体衬底中的凹槽中。

印刷电路板及其显示器连接结构

本实用新型是有关于一种印刷电路板及其显示器连接结构，其特征在于,包括：复数个接合垫区；用以电连接至一显示器；复数个假垫区；位于所述复数个接合区中，用以接地；其特征在于在所述复数个假垫区之间具有一连接垫区，其电连接所述接合区。藉此可以避免额外单独设置连接垫区，节省了印刷电路板面积，进而降低了产品成本，且可以避免扇出区域的静电对印刷电路板上的组件造成损伤，以提升产品的良率。

具有集成正温度系数设备的印刷电路板

装置包括第一线缆插头(104)部件。装置进一步包括具有多个层的印刷电路板(PCB)(116)，PCB(116)耦合到第一线缆插头(104)部件。正温度系数(PTC)设备(102)可以设置在多个层的第一层(302)上，并且多个层的第二层(304)可以被设置在多个层的第一层(302)之上。

Embedded protection against spurious electrical events

Schutzstrukturen gegen veränderliche spannung und verfahren zur herstellung

Transmission device with dipole orienting system

Transmission device including at least one electric conductor for the transmission of an AC signal and a dielectric material at least partly surrounding the at least one conductor. The dielectric material includes dipoles. The device further includes a dipole orienting system adapted to orient the dipoles and to force the dipoles in a saturation regime in order to limit the movement of the dipoles when the at least one electric conductor conducts an AC signal.

Transmission device

Transmission device comprising at least one electric conductor for the transmission of an AC signal and a dielectric material at least partly surrounding the at least one conductor, said dielectric material comprising dipoles, further comprising a dipole orienting system adapted to orient said dipoles and to force said dipoles in a saturation regime in order to limit the movement of the dipoles when the at least one electric conductor conducts an AC signal.

저전압 배리스터, 회로 기판, 반도체 부품 패키지 및 인터포저

저전압으로 동작 가능한 우수한 성능의 배리스터를 제공한다. 저전압 배리스터 형성용 수지 조성물의 경화체를 포함하는 저전압 배리스터로서, 저전압 배리스터 형성용 수지 조성물이, (A) 카본 나노튜브 및 카본 에어로겔로부터 선택되는 적어도 하나와, (B) 에폭시 수지 및 아크릴 수지로부터 선택되는 적어도 하나를 포함하는 것을 특징으로 하는 저전압 배리스터이다.

Substrates having voltage switchable dielectric materials

電圧感応状態遷移誘電体材料を用いる無線通信デバイス

ＲＦＩＤタグのような無線通信デバイスに材料の特性電圧レベルをこえる電圧が印加されない限り誘電性である材料が設けられる。そのような電圧が存在すると、材料は導電性になる。そのような材料のデバイスへの一体化は機械的及び／または電気的とすることができる。

Partitioning a via structure using plating resist

Simultaneous and selective partitioning of via structures using plating resist

Simultaneous and selective partitioning of via structures using plating resist

Systems and methods for simultaneously partitioning a plurality of via structures into electrically isolated portions by using plating resist within a PCB stackup are disclosed. Such via structures are made by selectively depositing plating resist in one or more locations in a sub-composite structure. A plurality of sub-composite structures with plating resist deposited in varying locations are laminated to form a PCB stackup of a desired PCB design. Through-holes are drilled through the PCB stackup through conductive layers, dielelectric layers and through the plating resist. Thus, the PCB panel has multiple through-holes that can then be plated simultaneously by placing the PCB panel into a seed bath, followed by immersion in an electroless copper bath. Such partitioned vias increase wiring density and limit stub formation in via structures. Such partitioned vias allow a plurality of electrical signals to traverse each electrically isolated portion without interference from each other.

Simultaneous and selective partitioning of via structures using plating resist

Systems and methods for simultaneously partitioning a plurality of via structures into electrically isolated portions by using plating resist within a PCB stackup are disclosed. Such via structures are made by selectively depositing plating resist in one or more locations in a sub-composite structure. A plurality of sub-composite structures with plating resist deposited in varying locations are laminated to form a PCB stackup of a desired PCB design. Through-holes are drilled through the PCB stackup through conductive layers, dielelectric layers and through the plating resist. Thus, the PCB panel has multiple through-holes that can then be plated simultaneously by placing the PCB panel into a seed bath, followed by immersion in an electroless copper bath. Such partitioned vias increase wiring density and limit stub formation in via structures. Such partitioned vias allow a plurality of electrical signals to traverse each electrically isolated portion without interference from each other.

Simultaneous and selective partitioning of via structures using plating resist

Systems and methods for simultaneously partitioning a plurality of via structures into electrically isolated portions by using plating resist within a PCB stackup are disclosed. Such via structures are made by selectively depositing plating resist in one or more locations in a sub-composite structure. A plurality of sub-composite structures with plating resist deposited in varying locations are laminated to form a PCB stackup of a desired PCB design. Through-holes are drilled through the PCB stackup through conductive layers, dielelectric layers and through the plating resist. Thus, the PCB panel has multiple through-holes that can then be plated simultaneously by placing the PCB panel into a seed bath, followed by immersion in an electroless copper bath. Such partitioned vias increase wiring density and limit stub formation in via structures. Such partitioned vias allow a plurality of electrical signals to traverse each electrically isolated portion without interference from each other.

めっきレジストによるビア構造の同時かつ選択的な分割

Metal deposition

Systems and methods include depositing one or more materials on a voltage switchable dielectric material. In certain aspects, a voltage switchable dielectric material is disposed on a conductive backplane. In some embodiments, a voltage switchable dielectric material includes regions having different characteristic voltages associated with deposition thereon. Some embodiments include masking, and may include the use of a removable contact mask. Certain embodiments include electrografting. Some embodiments include an intermediate layer disposed between two layers.

含可切換電壓介電材料之基板

Wireless communication device using voltage switchable dielectric material

A wireless communication device, such as an RFID tag, is provided material that is dielectric, unless a voltage is applied that exceeds the materials characteristic voltage level. In the presence of such voltage, the material becomes conductive. The integration of such material into the device may be mechanical and/or electrical.

印刷电路板及包含该印刷电路板的显示器的连接结构

本申请是有关于一种印刷电路板及包含该印刷电路板的显示器的连接结构，其中所述印刷电路板包括：数个接合垫区，用以电连接至一显示器；数个假垫区，位于所述数个接合垫区中，用以接地；在所述数个假垫区之间具有一连接垫区，其电连接所述数个接合垫区；所述连接垫区中，包括数个连接垫，其用以电连接一外部输入连接器；所述数个连接垫的宽度为0.3毫米；所述数个连接垫之间的间距为0.2毫米；所述连接垫的长度与所述接合垫区中的一接合垫长度相同。

低压变阻器、电路基板、半导体部件封装以及内插件

提供能在低电压下动作的卓越的性能的变阻器。低压变阻器包含低压变阻器形成用树脂组成物的固化体，特征在于，低压变阻器形成用树脂组成物包含(A)从碳纳米管以及碳气凝胶选择的至少一者和(B)从环氧树脂以及丙烯酸树脂选择的至少一者。

Transmission device

Transmission device including at least one electric conductor for the transmission of an AC signal and a dielectric material at least partly surrounding the at least one conductor. The dielectric material includes dipoles. The device further includes a dipole orienting system adapted to orient the dipoles and to force the dipoles in a saturation regime in order to limit the movement of the dipoles when the at least one electric conductor conducts an AC signal.

伝送デバイス

ＡＣ信号を伝送するための少なくとも１つの電気導体と、少なくとも１つの導体を少なくとも部分的に囲む誘電体材料であって、双極子を含む、誘電体材料とを含み、少なくとも１つの電気導体がＡＣ信号を伝導するとき、双極子の運動を制限するために、前記双極子を配向させ、前記双極子を飽和領域に強制的に入れるように構成された双極子配向システムをさらに含む伝送デバイス。

傳輸裝置

本發明揭示一種傳輸裝置，其包括用於傳輸一AC信號之至少一電導體及至少部分地包圍該至少一導體之一介電材料，該介電材料包括偶極，其進一步包括一偶極定向系統，該偶極系統經調適用以使該等偶極定向且用以迫使該等偶極處於一飽和區中以在該至少一電導體傳導一AC信號時限制該等偶極之移動。

表面実装素子および埋め込み素子用の放電保護

電圧切り替え型誘電体材料（ＶＳＤＭ）を含むプリント回路ボードが開示される。このＶＳＤＭは、プリント回路ボード上に配置されるかあるいはその中に埋め込まれた電子素子を、静電放電のような放電あるいは電気的な過大ストレスに対して保護するために用いられる。過大電圧事象の間、ＶＳＤＭ層は過剰電流をアースに分路し、それによって電子素子の破壊または損傷を防ぐ。 【選択図】図４

電圧可変基板材料

この発明は、改善された電圧可変材料（「ＶＶＭ」）を提供する。より詳細には、この発明は、改善されたプリント回路基板と、回路保護を有する改善された素子と、回路保護を有する改善されたデータ通信ケーブルと、この発明のＶＶＭ基板を使用する素子を大量生産する方法と、を提供する。ＶＶＭ基板は、既知の電圧可変材料と結び付けられた導電粒子、及び可能なら半導電性粒子及び／又は絶縁粒子を、基地のプリント回路基板と結び付けられたワニス又はエポキシ樹脂に注入することによって中間のドーターボード又はキャリヤボードに対する必要を省く。