Leiterplatte und Verfahren zum Erkennen der Position von oberflächenmontierten Bauteilen.

Assembly structure of electronic parts prevents the formation of cracks in adhesive substrate

The assembly structure has the electronic part (11), which has first and second electrodes (13), a substrate on which the part is mounted, first and second solder eyes (15) on the substrate and a conducting adhesive (16) between the first electrode and first solder eye and between the second electrode and second solder eye to electrically connect them. Part of the conducting adhesive spreads out from one of the electrodes and solder eyes. An Independent claim is also included for a method of assembling electronic parts.

Kontaktstellenstruktur, Leiterplatte, und elektronische Vorrichtung

PRINTED CIRCUIT BOARDS

METHOD OF PRODUCING A PRINTED CIRCUIT BOARD

Method for positionally stable soldering

Verfahren zum positionsstabilen Verlöten zumindest einer Bauteilkontaktfläche (11) eines elektronischen Bauteils (1) mit zumindest einer korrespondierenden Trägerplattenkontaktfläche (12) einer Trägerplatte (2), aufweisend die folgenden Schritte: a) Anbringen von zumindest zwei Klebepunkten (3a, 3b, 8a, 8b, 9a, 9b) an der Trägerplatte (2), wobei die Position jedes Klebepunktes (3a, 3b, 8a, 8b, 9a, 9b) vorgegeben wird, b) Bestücken der Trägerplatte (2) mit dem zumindest einen elektronischen Bauteil (1), wobei die Position der Klebepunkte (3a, 3b, 8a, 8b, 9a, 9b) in Schritt a) dergestalt vorgegeben wird, dass das zumindest eine elektronische Bauteil (1) die zumindest zwei Klebepunkte (3a, 3b, 8a, 8b, 9a, 9b) im Wesentlichen in einem durch die zumindest eine Seitenfläche (5a, 5b, 5c, 5d) und die untere Fläche 6 gebildeten Kantenbereich kontaktiert und die zumindest eine Bauteilkontaktfläche (11) mit der zumindest einen Trägerplattenkontaktfläche (12) zumindest teilweise überlappt, c) Abwarten ...

Strukturierung der Lötstoppmaske von Leiterplatten zur Verbesserung der Lötergebnisse

System umfassend eine Trägerplatte (16) und zumindest einen an der Trägerplatte (16) montierten elektronischen Bauteil (10), wobei die Trägerplatte (16) zumindest eine Trägerplattenkontaktfläche (2, 2a, 2b) und das elektronische Bauteil (10) zumindest eine dazu korrespondierende Bauteilkontaktfläche (11) aufweist, wobei die zumindest eine Trägerplattenkontaktfläche (2, 2a, 2b) zumindest teilweise von dem zumindest einen elektronischen Bauteils (10) überdeckt und von einer Lötstopplackschicht (12) umgeben ist, die die zumindest eine Trägerplattenkontaktfläche (2, 2a, 2b) begrenzt, wobei in der Lötstopplackschicht (5) zumindest eine kanalartige Aussparung vorgesehen ist, durch die zumindest eine Hilfskontaktfläche (3a, 3b) ausgebildet ist, welche die zumindest eine Trägerplattenkontaktfläche (2, 2a, 2b) kontaktiert, wobei zumindest die Trägerplattenkontaktfläche (2, 2a, 2b), die Bauteilkontaktfläche (11) und die Hilfskontaktfläche (3a, 3b) eine benetzbare Oberfläche aufweisen.

Printed wiring board

A printed wiring board comprises a wiring substrate provided with at least one conductor circuit, a solder resist layer formed on the surface of the wiring substrate, covering the at least one conductor circuit, conductor pads formed on a part of the at least one conductor circuit exposed from respective openings provided in the solder resist layer for mounting electronic parts, and solder bumps formed on the respective conductor pads. Connection reliability and insulation reliability are easily improved by making the ratio (H/D) of a height H from solder resist layer surface the solder bump to an opening diameter of the opening about 0.55 to about 1.0 even in narrow pitch structure under the pitch of the opening provided in the solder resist layer of about 200 mum or less.

PROCEDE DE MONTAGE D'UNE PLAQUETTE DE CIRCUIT INTEGRE SUR UN SUBSTRAT

LE PROCEDE DE MONTAGE CONSISTE A DEPOSER SUR LE SUBSTRAT 3 PORTANT LES PISTES CONDUCTRICES 4 UNE COUCHE DE SUBSTANCE ISOLANTE 6 PRESENTANT DES FENETRES 7 DECOUVRANT LES PLAGES DE RACCORDEMENT 5 DES PISTES 4. ENSUITE, UNE COUCHE DE MATERIAU DE SOUDURE 8 EST DEPOSEE AU FOND DES FENETRES. IL N'Y A PLUS ALORS QU'A POSER LA PLAQUETTE 1 SUR LE SUBSTRAT 3 MAINTENU HORIZONTALEMENT, LES PLOTS 2 S'ENGAGEANT DANS LES FENETRES 7, ET A FAIRE FONDRE LA SOUDURE. LA PLAQUETTE 1 FLOTTERA ALORS LIBREMENT SUR LES MASSES DE SOUDURE POUR PRENDRE UNE POSITION OPTIMALE. APRES SOLIDIFICATION DE LA SOUDURE, IL SUBSISTE UNE PARFAITE LIAISON ELECTRIQUE ET METALLIQUE ENTRE LES PLOTS 2 ET LES PISTES CONDUCTRICES 4.

PANNEAU DE CIRCUIT IMPRIME

A.PANNEAU DE CIRCUIT IMPRIME, B.PANNEAU DE CIRCUIT IMPRIME CARACTERISE EN CE QU'IL COMPORTE EN OUTRE UN TRACE PILOTE 7 RELIANT LES ZONES 2 ET 3 POUR CANALISER DE LA SOUDURE FONDUE 13 ENTRE CES ZONES. C.L'INVENTION S'APPLIQUE NOTAMMENT A DES CIRCUITS COMPORTANT UN PLUS PETIT NOMBRE DE COMPOSANTS SANS CONDUCTEUR QUE DE COMPOSANTS AVEC CONDUCTEURS.

LAYER CIRCUITS

ELECTRONIC COMPONENT

MODULE AND METHOD FOR MANUFACTURING THE SAME

... [과제] 감광성 수지와 밀봉 수지층의 간극에 부품과 배선 기판을 접속시키는 땜납이 유출되어 인접하는 실장 전극끼리가 단락되는 것을 방지할 수 있는 모듈을 제공한다. [해결 수단] 모듈(1)은 배선 기판(2)과, 상기 배선 기판(2)의 한쪽 주면에 형성된 부품 실장용 복수의 실장 전극(3)과, 배선 기판(2)의 한쪽 주면에 실장되고 실장 전극(3)에 땜납 접속된 복수의 부품(4)과, 실장 전극(3)을 구성하는 도금 전극층(3b)이 노출된 상태에서 배선 기판(2)의 한쪽 주면을 피복해서 형성된 감광성 수지인 솔더 레지스트(5)와, 배선 기판(2)의 한쪽 주면에 실장 전극(3)에 접속된 부품(4) 및 솔더 레지스트(5)를 피복해서 형성된 밀봉 수지층(6)을 구비하고, 실장 전극(3)의 도금 전극층(3b)과 솔더 레지스트(5)의 경계에 단면 쐐기 형상의 오목부(9)를 갖고, 밀봉 수지층(6)의 수지가 오목부(9)에 충전되어 있다.

MULTILAYERED WIRING BOARD AND A METHOD OF MANUFACTURING THE SAME, CAPABLE OF INCREASING THE ADHESION STRENGTH OF A CONNECTION TERMINAL

PURPOSE: A multilayered wiring board and a method of manufacturing the same are provided to secure insulating property between connection terminals by burying the outer surface of a terminal in a resin dielectric layer. CONSTITUTION: In a multilayered wiring board and a method of manufacturing the same, a plurality of openings(35,36) are formed within an outermost resin dielectric layer(24). A plurality of first and second main side connection terminals(41,42,45) are formed with a copper layer as a main component. The first and second main side connection terminals are arranged on the opening. A terminal outer surface(41a) is arranged from the outer surface of outmost resin layer inwardly. A solder resist is extended to the inside of a plurality of opening and is connected to the outer circumference of the terminal. COPYRIGHT KIPO 2012 ...

Printed circuit board and method for manufacturing the same

Electric circuit board

The present invention provides an electric circuit board capable of connecting an IC or a semiconductor chip with high reliability. An electrode part 20 to which the metal electrode (bump) of an IC circuit will be connected from an upper part is formed on the glass substrate 11 of a liquid crystal display device. The electrode part 20 is constituted by opening an inter-layer insulating film 23 in a part corresponding to metal wiring 22 and forming a land-like electrode pad 25 in this opened part. In the present invention, the plane shape of the electrode pad 25 is made smaller than the opened part of the inter-layer insulating film 23. Thus the flatness of the peripheral surface of the electrode 20 is improved.

Package structure and manufacturing method thereof

A package structure and a manufacturing method thereof are provided. The package structure includes a chip, a substrate and a solder. The chip includes a bump disposed on the surface of the chip. The substrate includes a pad and a solder resistor layer. The pad is disposed on the surface of the substrate corresponding to the bump and the solder resistor layer is disposed on the surface of the substrate. The solder resistor layer has an opening for exposing the pad. The ratio of the width of the opening to the diameter of the bump is 1 to 1.5. The solder is disposed in the opening around the bump. The solder, the bump and the pad are welded with each other for electrically connecting the chip and the substrate.

Connected structure and manufacturing method

SOLDER BALL INTERFACE

An intercoupling component is provided that electrically connects the device leads of an integrated circuit package to a substrate. The package includes external device leads, each device lead having a downwardly extending section proximate a side of the package body, and the intercoupling component includes an insulating support member. The support member includes a first surface including first electrical attachment sites, each configured for making an electrical connection with a corresponding one of the device leads of the package. The support member also includes an opposite second surface including second electrical attachment sites in electrical contact with the first electrical attachment sites, each of the second electrical attachment sites including a plurality of solder balls associated with each device lead. The plurality of solder balls are used to form an electrical connection between each surface mount pad on the substrate and the corresponding conductive pad of the intercoupling ...

CIRCUIT SUBSTRATE AND ELECTRONIC DEVICE

A circuit substrate which is capable of decreasing the possibility that the amount of solder in the overall mounting land is uneven and reducing formation of a solder void even when a mounting terminal has a large soldering area. An electronic component having the mounting terminal is mounted on the circuit substrate. A mounting land is connected to the mounting terminal of the electronic component by soldering, and the mounting land has a protruding portion of an insulating material formed so as to protrude from an outer side of the mounting land toward an inner side of the mounting land, and the protruding portion does not divide the mounting land into a plurality of areas.

Printed circuit board and method of manufacturing the same

Provided is a printed circuit board, including: a circuit pattern or a base pattern formed on an insulating layer; and a plurality of metal layers formed on the circuit pattern or the base pattern, wherein the metal layers includes: a silver metal layer formed of a metal material including silver; a first palladium metal layer formed at a lower part of the silver metal layer; and a second palladium metal layer formed at an upper part of the silver metal layer.

Circuit board device and manufacturing method thereof

In a circuit board device having an electronic component mounted on an electrode land on a board by reflow soldering, voids that adversely affect the solder joint in various ways are prevented from forming. The electrode land corresponding to a component electrode for the electronic component is divided into a plurality of land regions by solder resist having a prescribed width. The component electrode is laid above the solder resist so as to form a clearance communicating with the outside of the component electrode, so that gas generated by vaporization of a flux component contained in the solder during reflow-heating is passed through the clearances and let out of the component electrode. In this way, voids in the solder part can more readily be prevented from forming without increasing the number of person hours as compared to the conventional method.

Partially captured oriented interconnections for BGA packages and a method of forming the interconnections

A Ball Grid Array package having an increased fatigue life and improved conductive pad adhesion strength, as well as providing sufficient wiring space within the package, is disclosed. In particular, solder joints having a combination of mask-defined and pad-defined solder joint profiles are formed using a mask having non-circular elongated openings. The non-circular elongated openings of the mask have a major axis and a minor axis, such that the dimension of the openings along the major axis is greater than the diameter of the conductive pads, and the dimension of the openings along the minor axis is less than the diameter of the conductive pads. In addition, the major axis of the openings within the mask are selectively oriented in the direction of highest stress for each solder joint within the package, while providing ample wiring space therein.

Printed circuit board with resist coating defining reference marks

A printed circuit board includes a first mark 2 formed by a thin conductor, a second mark 3 formed by a resist 8, a land 6 which is partially coated by the resist 8 and a land 7 which is not coated by the resist 8. The second mark 3 is formed when the land 6 is partially coated by the resist 8. A device 4, which corresponds to the land 6, is mounted at a position apart from a center O2 of the second mark 3 by a predetermined distance L1. A device 5, which corresponds to the land 7, is mounted at a position apart from a center O1 of the first mark 2 by a predetermined distance L2. Therefor, the devices 4, 5 can be properly mounted on the printed circuit board 1 in spite of a positional error of the resist 8.

Circuit board having bypass pad

An electronic device having a printed circuit board is provided. In one embodiment, the printed circuit board includes a plurality of external pads to be coupled with an external device and a plurality of bypass pads for testing an electric circuit. The external pads are exposed and at least one of the plurality of bypass pads are not exposed from an outer surface of the PCB. A system using the electronic device and a method of testing an electronic device are also provided.

Optical scanning device

The invention provides a printed-wiring board that is capable of preventing the lift-off phenomenon without changing the related process for fabricating related printed-wiring boards. A printed-wiring board of the present invention has the structure in which land portions are formed on both sides (front side and back side) of a board, a through hole is formed through the board, and an electrically conducting layer is formed on the inside peripheral surface of the through hole by means of plating to connect between the above-mentioned land portions of a wiring pattern, wherein the entire surface of the land part including the opening circumference of the through hole is covered with an insulating layer that covers the other part of the wiring pattern on the component side and on the other hand the land part is not covered with an insulating layer and remains exposed on the soldering side.

PRINTED CIRCUIT BOARD

A printed circuit board (PCB) is disclosed on which various kinds of electronic components having diverse specifications may be mounted. The PCB includes a substrate base a substrate base and a pad group formed on a surface of the substrate base. The pad group includes at least two pads. Each of the at least two pads includes a first sub-pad portion and a second sub-pad portion. The first sub-pad portion partially surrounds the second sub-pad portion. The second sub-pad portion of one of the at least two pads protrudes from an end portion of the first sub-pad portion toward another pad of the at least two pads.

Electronic component package, electronic component mounted apparatus, method of inspecting bonding portion therein, and circuit board

An electronic component package includes: an insulating carrier substrate; a connection wiring that is provided on one side of the carrier substrate; an IC chip that is connected to the connection wiring; an external connection land that is disposed on the other side of the carrier substrate and is connected to the connection wiring via a wiring in the carrier substrate; and a solder ball that is disposed on the external connection land. A region of the external connection land that can be bonded to the solder ball has an outer shape that includes at least one arc portion and at least one straight portion. With this configuration, it is possible to provide an electronic component mounted apparatus in which bonding failure of the external connection land and the circuit board-side land with the solder ball can be reduced, and the bonding state can be easily inspected, and a method of inspecting a bonding portion therein.

Printed-wiring board

The invention provides a printed-wiring board (10) that is capable of preventing the lift-off phenomenon without changing the related process for fabricating related printed-wiring boards. A printed-wiring board (10) of the present invention has the structure in which land portions (3a, 3b) are formed on both sides (front side and back side) of a board (2), a through hole (4) is formed through the board (2), and an electrically conducting layer (5) is formed on the inside peripheral surface of the through hole (4) by means of plating to connect between the above-mentioned land portions (3a, 3b) of a wiring pattern, wherein the entire surface of the land part (3a) including the opening circumference of the through hole (4) is covered with an insulating layer (6a) that covers the other part of the wiring pattern on the component side and on the other hand the land part (3b) is not covered with an insulating layer (6) and remains exposed on the soldering side.

SOLDER JOINTING PORTION LESS APT TO GENERATE CRACKS, ELECTRONIC COMPONENT ON CIRCUIT SUBSTRATE HAVING SAME SOLDER CONNECTING PORTION, SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD OF THE ELECTRONIC COMPONENT

PROBLEM TO BE SOLVED: To provide a solder jointing portion hardly generating cracks, such electronic components as a circuit substrate having the solder connecting portion, a semiconductor device, and a manufacturing method of the electronic component. SOLUTION: A land 112 has a flat reference surface p1, and an electronic component has the land 112, having a solder jointing portion p3 for jointing a solder. In this electronic component, the solder jointing portion p3 forms a recessed portion 113 recessed from the reference surface of the land 112, and a nickel-plating layer 114 is laminated on the surface of the recessed portion 113. When the nickel-plating layer 114 is solder-jointed, the position of the boundary plane between a tin containing alloy layer 116 formed in the solder jointing portion p3 of the nickel-plating layer 114 and the nickel-plating layer 114 is deviated from the plane that contains the reference surface p1. COPYRIGHT: (C)2008,JPO&INPIT ...

Leiterplatten-Baugruppe

Leiterplatten-Baugruppe (10) mit einer Leiterplatte (20),welche Leiterplatte (20) eine erste Seite (21), eine zweite Seite (22) und ein Kontaktloch (30) aufweist, in welchem Kontaktloch (30) eine hülsenförmige Durchkontaktierung (32) vorgesehen ist,welcher Durchkontaktierung (32) an mindestens einer Seite (33; 34) ein Restring (35; 36) zugeordnet ist, welcher Restring (35; 36) auf der ersten Seite (21) oder auf der zweiten Seite (22) der Leiterplatte (20) angeordnet und mit der Durchkontaktierung (32) elektrisch verbunden ist, welcher Restring (35; 36) zumindest bereichsweise einen Restringrand (40) aufweist,welche Leiterplatten-Baugruppe (10) eine Lötstopplackschicht (50) aufweist,welche Lötstopplackschicht (50) sich zumindest bereichsweise von außerhalb des Restringrands (40) über den Restringrand (40) auf einen äußeren Bereich (42) des Restrings (35; 36) erstreckt, wobei am Restring (35; 36) ein innerer Bereich (44) verbleibt, der nicht von der Lötstopplackschicht (50) bedeckt ist.

Leiterplatten-Kugelmatrix-System mit verbesserter mechanischer Festigkeit

Ein Leiterplatten-(PCB)-Kugelmatrix-(BGA)-System wird bereitgestellt. In einer Ausführungsform umfasst das Leiterplatten-Kugelmatrix-System eine Leiterplatte, eine auf der Leiterplatte gebildete Leiterplatten-Kugelmatrixkontaktstelle, eine Durchkontaktierung, die zumindest teilweise durch die Leiterplatte verlaufend nächst der Leiterplatten-Kugelmatrixkontaktstelle angeordnet ist, und eine über der Leiterplatte angeordnete Lotmaske. Die Lotmaske umfasst: (i) eine Kugelmatrixkontaktstellenöffnung, durch die die Leiterplatten-Kugelmatrixkontaktstelle freigelegt ist, und (ii) eine Durchkontaktierungsöffnung, durch die ein mittlerer Abschnitt der Durchkontaktierung freigelegt ist. Die Durchkontaktierungsöffnung hat einen Innendurchmesser, der kleiner ist als der Außendurchmesser der Durchkontaktierung.

A method of manufacturing a printed wiring board

In a method of manufacturing a printed wiring or circuit board inequality in the film thickness of a solder resist and the occurrence of blur is eliminated, and it is made possible to perform screen printing for the solder resist having a minute pattern which leads to formation of a minute solder land. Copper wiring pattern (5) is formed by etching copper laminated board (4) using an etching resist (3). Etching resist (3) is left on the formed pattern (5) and a solder resist (60) printed over board (4) to fill recesses (12) between the conductors and to overlay the etching resist (3). Etching resist (3) and overlying resist (60a) are then simultaneously removed to leave a flat surface over the conductive pattern and resist containing recesses (12). A further solder resist is then printed over resist (60) in the recesses to define solder lands on the conductive pattern. To facilitate removal of etching resist (3) pin holes may be provided in the overlying solder resist (60a). ...

Printed circuit board for flow soldering

The printed circuit board comprises an electrically conductive pattern having a plurality of connection pads 7 to which leads 3a of electronic components are to be connected; and a solder resist layer 6 formed over said electrically conductive pattern with a plurality of windows 2 which expose said connection pads. At least one of said windows has an extension 2a exposing an additional part of said pad, said extension being substantially narrower than said window. The extension allows the additionally exposed part of the pad to contact with the solder even when the associated pad is almost entirely covered by trapped gas, so that the solder is pulled to the pad and spread over the pad. Because the extension require a small area, it is effective even when the components are mounted at a high density.

PRINTED CIRCUIT BOARDS

PROCEDURE FOR THE PRODUCTION OF A PRINTED PRINTED CIRCUIT BOARD

Verfahren zur Voidreduktion in Lötstellen

The invention relates to a method for the soldering connection at least of one electronic component (104, 204, 304, 404, 504) to a carrier plate (100, 200, 300, 400, 500), wherein the carrier plate has at least one carrier plate contact surface (102, 202, 302, 402, 502) and the at least one electronic component has at least one corresponding component contact surface (105), wherein the at least one carrier plate contact surface is surrounded by a solder resist layer (101, 201, 301, 401, 401) that abuts the at least one carrier plate contact surface, wherein the method comprises the following steps: a) applying, at least in sections, solder paste (106, 206, 306, 406, 506) to the solder resist layer (101, 201, 301, 401, 501) and with minimal overlapping with the carrier plate contact surface (102, 202, 302, 402, 502) abutting the solder resist layer; b) providing the carrier plate with the at least one electronic component (104, 204, 304, 404, 504), wherein the at least one component contact ...

LEADER CARRIER AND ARRANGEMENT WITH LEADER CARRIER

PRINTED CIRCUIT BOARD

MASKING OF HOLES IN CIRCUIT PATTERNS ON CIRCUIT BOARDS PRIOR TO FLOW SOLDERING

MASKING OF HOLES IN CIRCUIT PATTERNS ON CIRCUIT BOARDS PRIOR TO FLOW SOLDERING A circuit pattern on a circuit board usually has a number of contact areas to which components are soldered. Some of the contact areas have holes extending through the board for insertion of leads of leaded components, the leads then being flow soldered to the contact areas. It often occurs that additional leaded components are to be mounted on the board after a first flow soldering step. However, holes through which the leads are to pass can be closed by solder. These holes are therefore masked mechanically, by a masking member which contacts the board at these holes, or by tape, or other such method. The present invention uses a conventional solder resist layer, usually applied prior to flow soldering, extending the solder resist layer over a part of the contact area to the periphery of the hole. The resist layer extends for at least part of the hole periphery. This prevents the solder being attached to the ...

CIRCUIT BOARD, POWER STORAGE DEVICE, BATTERY PACK, AND ELECTRONIC DEVICE

An electronic apparatus is provided including a substrate, a conductive land formed on a surface of the substrate, an electronic component including an electrode, at least one insulating protrusion formed on the land in an overlapping region between the land and the electrode in plan view, and a solder that bonds the electronic component to the land, the solder being formed between the electrode and the land in the overlapping region in a normal direction to the surface of the substrate.

Interconnect substrate, semiconductor device, and method of manufacturing the same

An interconnect substrate includes an interconnect, an insulating layer, a non-photosensitive resin layer, a photosensitive resin layer, a first electrode pad, and a second electrode pad. The non-photosensitive resin layer is constructed with a non-photosensitive insulating material. Also, the non-photosensitive resin layer has a first opening. The photosensitive resin layer is constructed with a photosensitive insulating material. Also, the photosensitive resin layer has a second opening. The opening area of the second opening is larger than that of the first opening. The first electrode pad is disposed on the first surface side of the insulating layer. The first electrode pad is exposed to the first opening. The second electrode pad is disposed on the second surface side of the insulating layer. The second electrode pad is exposed to the second opening.

Braze welding joint, electronic component, semiconductor device and method for manufacturing electronic component

Electric circuit substrate

Electronic part mounting substrate and semiconductor device

BIAXIALLY ORIENTED COPOLYESTER FILM AND LAMINATES THEREOF WITH COPPER

배선기판 및 그 제조방법

... 반도체칩과의 접속신뢰성이 우수한 배선기판을 제공하는 것. 오가닉 배선기판(10)의 기판 주면(11)측에는 수지절연층(21, 22)과 도체층(24)을 적층한 제 1 빌드업층(31)이 형성되어 있다. 제 1 빌드업층(31)에 있어서의 최표층의 도체층(24)은 반도체칩을 플립칩 실장하기 위한 복수의 접속단자부(41)를 포함한다. 복수의 접속단자부(41)는 솔더 레지스트층(25)의 개구부(43)를 통하여 노출되어 있다. 각 접속단자부(41)는 반도체칩의 접속영역(51)과, 접속영역(51)에서 평면 방향으로 연장 설치된 배선영역(52)을 가진다. 솔더 레지스트층(25)은 개구부(43) 내에 있어서, 접속단자부(41)의 측면을 피복하는 측면 피복부(55)와, 측면 피복부(55)와 일체적으로 형성되고, 접속영역(51)과 교차하도록 돌출 설치된 볼록 형상 벽부(56)를 가진다.

Circuit board and semiconductor package including the same

Electronic part mounting substrate and semiconductor device

Substrate having bond pads for bonding redundant solder beads

A substrate having bond pads for bonding redundant solder beads is disclosed. A first bond pad and a second bond pad are disposed on a surface of substrate, which are corresponding to a first terminal and a second terminal of a surface mounting device (SMD). The first bond pad and the second bond pad have exposed receptacles formed in opposite directions of the corners of the first and second bond pads for bonding solder beads condensed from redundant solder paste. Thus the substrate has an effect of bonding redundant solder beads.

SUBSTRATE FOR MOUNTING ELEMENT, AND METHOD FOR MANUFACTURING THE SUBSTRATE

Disclosed is a substrate for mounting an element, said substrate having excellent anti-sulfuration characteristics. The substrate (1) for mounting an element has: a low-temperature-fired ceramic substrate (2); a thick conductor layer (3), which is formed on the surface of the low-temperature-fired ceramic substrate (2), and which is composed of a metal containing silver as a main component; a covering portion (4), which covers the end portion (31) of the thick conductor layer (3), and which is bonded to the low-temperature-fired ceramic substrate (2) on the outer side of the end portion (31), and is composed of the low-temperature-sintered ceramic; and a plating layer (5), which is formed on the surface of the thick conductor layer (3), and which is composed of a conductive metal.

WIRING BOARD

Provided is a wiring board which is capable of inhibiting short circuiting between connection terminals, and which is capable of coping with the narrowing of connection terminal pitch. A wiring board according to the present invention has a stacked body in which at least one insulating layer and at least one conductor layer are stacked. The wiring board is characterized by being provided with: a plurality of connection terminals which are formed above the stacked body, and which are separated from each other; and a filler member filled between the plurality of connection terminals. The wiring board is further characterized in that: contact surfaces in contact with the filler member, and separated surfaces which are not in contact with the filler member, and which are higher than the contact surfaces and lower than an upper surface of the filler member, are formed in side surfaces of the plurality of connection terminals.

HYBRID INTEGRATED CIRCUIT DEVICE AND METHOD FOR FABRICATING THE SAME AND ELECTRONIC DEVICE

A hybrid integrated circuit device having high mounting reliability, comprising a modular substrate of ceramic wiring board, a plurality of electronic components built in the principal surface of the modular substrate, a plurality of electrode terminals provided on the rear surface of the modular substrate, and a cap secured to the modular substrate while covering the principal surface of the modular substrate. The electrode terminals include a plurality of electrode terminals arranged along the edge of the modular substrate, and power supply potential supply terminals arranged on the inner side of the plurality of electrode terminals, wherein the electrode terminals arranged along the edge of the modular substrate are covered with a protective film at least the part close to the electrode terminals. The protective film is not thicker than ten and several μm. A connection strength enhancing terminal comprises a plurality of split terminals independent of each other. The connection strength ...

Raised Solder-Mask-Defined (SMD) Solder Ball Pads For a Laminate Electronic Circuit Board

A raised solder-mask-defined (SMD) pad configured for receiving a solder ball on a laminate electronic circuit board and a method of creating the raised SMD pad on a laminate electronic circuit board. The method may comprise forming a base bump, covering the base bump with a conductive bump layer and layering a surrounding material over an extended edge of the conductive bump layer. The surrounding material is patterned to expose a pad face and of a portion of the sides of the conductive bump layer, such that the pad face is disposed above the surface of the surrounding material. The surrounding material may be patterned by a photolithography operation or alternatively, a laser-drill operation.

Chip size package

A chip size package comprises a substrate to one surface of which a chip is mounted, a solder ball land formed on the other surface of the substrate and having a projecting center part, a solder mask formed on the other surface of the substrate and having an opening for exposing the solder ball land and a portion of the other surface of the substrate, and a solder ball fused to the solder ball land. As the chip size package has a combined SMD type and NSMD type solder ball land structure, the adhesion force between a solder ball land and a solder ball is reliably increased, and the advantages of SMD type and NSMD type solder ball lands is obtained.

CIRCUIT BOARD HAVING BYPASS PAD

An electronic device having a printed circuit board is provided. In one embodiment, the printed circuit board includes a plurality of external pads to be coupled with an external device and a plurality of bypass pads for testing an electric circuit. The external pads are exposed and at least one of the plurality of bypass pads are not exposed from an outer surface of the PCB. A system using the electronic device and a method of testing an electronic device are also provided.

Structure for fixing an electronic device to a substrate

A structure is disclosed for fixing an electronic device having a heat-releasing plate to a substrate. The structure includes a substrate, a land portion which is formed on a front face of the substrate and on which said heat-releasing plate of the electronic device is to be soldered, a through-hole formed in and penetrating said substrate and said land portion. The through-hole is adapted to release heat generated in the electronic device. The structure further includes a partitioning portion provided to be positioned between the heat-releasing plate and the land portion. The partitioning portion is adapted for preventing a solder, which should partially run out from a specific edge portion of the heat-releasing plate on soldering the heat-releasing plate to the land portion, from partially flowing into the through-hole.

Printed circuit assembly having conductive pad array with in-line via placement

A computer system including a microprocessor and a system memory coupled t provide storage to facilitate execution of computer programs by the microprocessor. An input is coupled to provide input to the microprocessor. A display is coupled to the microprocessor by a video controller and a mass storage is coupled to the microprocessor. A printed circuit board is electrically coupled to the microprocessor. The printed circuit board includes a circuit substrate having two spaced apart major surfaces and a plurality of rows of interconnect assemblies. Each row of interconnect assemblies includes a first and a second interconnect pad on a major surface of the circuit substrate. The first and the second interconnect pads are positioned on a respective reference axis. The first interconnect pad is spaced apart from the second interconnect pad by a first distance. A first and a second conductive via extend through the circuit substrate. The first and the second conductive vias are positioned adjacent ...

Installation of surface mount components on printed wiring boards

Movement of surface mount components during soldering onto TEFLON TM printed wiring boards is prevented by applying a strip of solder mask material to a solder pad to define a component lead area and applying solder to areas of the areas of the solder pad not covered by the solder mask strip. Solder paste is applied to the component bad area and the surface mount component is positioned with a lead in registry with the component lead area. The entire board is then heated to mechanically and electrically adhere the component lead to the pad.

Circuit board pad resonance control system

A circuit board pad resonance control system includes a board. A signal transmission line is included on the board. A plurality of connector pads are positioned on the board. A first connector pad receives the signal transmission line adjacent a first end of that connector pad. The first connector pad includes a mounting surface that mounts directly to a coupling element that is configured to couple a subsystem to the board, and reduces a resonance that is produced by an open portion of a signal transmission path that is created when the coupling element is directly mounted to the mounting surface of the first connector pad in a first orientation. In a specific example, the mounting surface may include a plurality of protrusions, a plated surface, and/or a mask that reduces the conductivity of the connector pad which reduces signal integrity issues due to resonance.

Planar lighting device and mounting substrate including conduction pattern with extension parts

A planar lighting device comprises: a mounting substrate having a conduction pattern having an extension part formed on a base material, and a cover member is arranged on the conduction pattern, wherein the cover member has an opening that exposes together the two lands of the two adjacent light sources, and wherein the extension parts comprise: a first extension part formed to extend from a first end portion of the lands toward the light guide plate and to extend under the cover member; a second extension part formed to extend from a second end portion, toward the light guide plate and the other land of the pair of the lands and to extend under the cover member; and a third extension part formed to extend from the first end portion, toward an opposite side to the light guide plate and to extend under the cover member.

PRINTED SUBSTRATE AND SHIELD SHEET METAL FIXING METHOD

A printed substrate includes: a substrate; a copper layer formed on the substrate; and a resin formed on the substrate to cover a part of the copper layer, wherein the copper layer includes a first region covered by the resin and a second region in which a shield sheet metal is installed, the shield sheet metal surrounding a predetermined region of the substrate, and wherein an angle formed between an outer edge portion of the copper layer covered by the resin and an outer edge portion of the resin which covers the copper layer at a location at which the outer edge portion of the copper layer and the outer edge portion of the resin intersect each other as viewed in plan is an obtuse angle.

CIRCUIT BOARD AND SEMICONDUCTOR DEVICE INCLUDING THE SAME

In a circuit board for a semiconductor package, the contact pad of the circuit board is partially exposed through a contact hole and a subsidiary pad is provided around the contact hole in such a way that the contact hole is defined by the subsidiary pad. A subsidiary film having the subsidiary pad is provided on a mask pattern for protecting an internal circuit pattern and the contact pad from their surroundings. A contact terminal is provided on the subsidiary film in such a way that the contact hole is at least partially filled with the contact terminal and the subsidiary pad is covered with the contact terminal and an external body is bonded to the contact terminal. The contact area between the circuit board and the contact terminal is enlarged due to the subsidiary pad, thereby increasing the contact reliability of the semiconductor package.

PRINTED CIRCUIT BOARD AND ITS DESIGNING METHOD AND DESIGNING METHOD OF IC PACKAGE TERMINAL AND ITS CONNECTING METHOD

The invention provides a printed circuit board capable of mounting BGA or other IC package of narrow terminal interval by using through-holes of conventional size. On one principal surface of printed circuit board (1), soldering lands (2a), (2b), (2c), and (2d) for connecting solder balls are disposed in lattice. Central point (B) of through-hole (3) is set eccentric to the side of soldering land (2a) at the same potential as through-hole (3), remote from intersection (A) formed by diagonal line (200ab) linking soldering lands (2a) and (2b) and diagonal line (200cd) linking soldering lands (2c) and (2d).

CONDUCTOR CARRIER AND ARRANGEMENT COMPRISING A CONDUCTOR CARRIER

Reflow mounting of electronic component on mounting board

Reflow mounting of electronic component on mounting board

SEMICONDUCTOR PACKAGE WITH IMPROVED SOLDER JOINT CHARACTERISTICS

PROBLEM TO BE SOLVED: To improve solder joint characteristics of a semiconductor package. SOLUTION: The semiconductor package comprises a semiconductor chip having chip pads, metal lines 122 electrically connected to the chip pads, solder ball lands 123 formed on a ball-forming surface and electrically connected to the metal lines, solder resist 124 applied on the ball-forming surface so as to define an opening, and solder balls formed on the solder ball lands. Each solder ball land has a first part 123a facing a center M1 of the ball-forming surface and a second part 123b except for the first part. The first part is covered with the solder resist and the second part is exposed from the opening of the solder resist. COPYRIGHT: (C)2005,JPO&NCIPI ...

SEMICONDUCTOR PACKAGE

PROBLEM TO BE SOLVED: To provide a semiconductor package that can reduce stress generated in a jointing part jointing a semiconductor device to a wiring board to prevent the jointing part from cracking when the semiconductor package is heated. SOLUTION: The semiconductor package 10 has the semiconductor device 20 packaged on the wiring board 21. The semiconductor device includes a semiconductor substrate; a through electrode 25 penetrating the semiconductor substrate; a cavity part 26 for isolating the semiconductor substrate from the through electrode; and a connection terminal 40, that is provided at a position not overlapping with the through electrode, in a plan view and electrically connects a wiring board 30 to the semiconductor device. COPYRIGHT: (C)2011,JPO&INPIT ...

VERFAHREN ZUR HERSTELLUNG VON EINER GEDRUCKTEN LEITERPLATTE

Verfahren zur Voidreduktion in Lötstellen

The invention relates to a method for the soldering connection at least of one electronic component (104, 204, 304, 404, 504) to a carrier plate (100, 200, 300, 400, 500), wherein the carrier plate has at least one carrier plate contact surface (102, 202, 302, 402, 502) and the at least one electronic component has at least one corresponding component contact surface (105), wherein the at least one carrier plate contact surface is surrounded by a solder resist layer (101, 201, 301, 401, 401) that abuts the at least one carrier plate contact surface, wherein the method comprises the following steps: a) applying, at least in sections, solder paste (106, 206, 306, 406, 506) to the solder resist layer (101, 201, 301, 401, 501) and with minimal overlapping with the carrier plate contact surface (102, 202, 302, 402, 502) abutting the solder resist layer; b) providing the carrier plate with the at least one electronic component (104, 204, 304, 404, 504), wherein the at least one component contact ...

SELECTIVE SOLDER FORMATION ON PRINTED CIRCUIT BOARDS

SELECTIVE SOLDER FORMATION ON PRINTER CIRCUIT BOARDS Disclosed is a method of providing solder on selected portions of a printed circuit board. Solder is first electroplated over copper conductor patterns on the board by means of a first photoresist layer. After stripping the first photoresist, a second photoresist layer is laminated over the board and developed to expose selected portions of the solder. The exposed portions are selectively stripped. The copper exposed by the selective stripping is then subjected to a scrubbing while the photoresist protects the remaining solder, and the second photoresist is removed.

METHOD FOR PRODUCING PRINTED CIRCUIT BOARD

The printed circuit board and the method for manufacturing the same

WIRING SUBSTRATE AND A MANUFACTURING METHOD THEREOF, CAPABLE OF CONNECTING AN ELECTRODE TO AN ELECTRODE PAD ON A SEMICONDUCTOR DEVICE

PURPOSE: A wiring substrate and a manufacturing method thereof are provided to improve degree of freedom in a design by securing a wide space between a semiconductor device connection pad and wiring conductors. CONSTITUTION: A wiring board(10) includes an insulation unit(1), a semiconductor device connection pad(2A), and a solder resist layer(3). The insulation unit includes a mount part(1A) to mount the semiconductor device. The semiconductor device connection pad is mounted on the mount part with a lattice shape and is comprised of a plating layer connected to the electrode of the semiconductor device through a conductive bump(B1). The wiring board solder resist layer is mounted on the insulation unit and includes a solder resist layer to expose the upper side of the semiconductor device connection pad and covers the side of the semiconductor device connection pad. The solder resist layer includes a concavo part(3A). The lower side of the concavo part is the upper side of the semiconductor ...

SOLDER-MOUNTED BOARD, PRODUCTION METHOD THEREFOR, AND SEMICONDUCTOR DEVICE

... [과제] 부품의 실장 신뢰성이 우수한 땜납 실장 기판과 그 제조방법 및 반도체 장치를 제공한다. [해결 수단] 기판(1)과, 이 기판(1)의 적어도 일방면에 배선과, 부품을 땜납을 통하여 실장하는 땜납 패드(2)와, 적어도 상기 땜납 패드(2)를 노출시켜 상기 배선을 씌우는 절연층을 구비하는 땜납 실장 기판으로서, 상기 절연층은 상기 기판 및 상기 배선 위에 설치된 제 1 절연층(4)과, 이 제 1 절연층(4) 위의 적어도 일부에 설치된 제 2 절연층(5)으로 이루어진다.

METHOD FOR MANUFACTURING PRINTED WIRING BOARD

... [PROBLEMS] To provide a method for manufacturing printed wiring boards, by which bumps having different diameters can be formed with the same height. [MEANS FOR SOLVING PROBLEMS] A small diameter bump (78S) is formed from a small diameter solder ball (77M) mounted on a small diameter opening (71S) on a solder resist layer (70), and a large diameter bump (78P) is formed from a large diameter solder ball (77L) mounted on a large diameter opening (71P). Therefore, the small diameter bump (78S) and the large diameter bump (78P) having different diameters can be formed with the same height (H1, H2). Thus, when an IC chip (90) is mounted through the small diameter bump (78S) and the large diameter bump (78P), reliability in connection of the IC chip (90) with a multilayer printed wiring board (10) can be ensured.

SOLDER BALL INTERFACE

An intercoupling component is provided that electrically connects the device leads of an integrated circuit package to a substrate. The package includes external device leads, each device lead having a downwardly extending section proximate a side of the package body, and the intercoupling component includes an insulating support member. The support member includes a first surface including first electrical attachment sites, each configured for making an electrical connection with a corresponding one of the device leads of the package. The support member also includes an opposite second surface including second electrical attachment sites in electrical contact with the first electrical attachment sites, each of the second electrical attachment sites including a plurality of solder balls associated with each device lead. The plurality of solder balls are used to form an electrical connection between each surface mount pad on the substrate and the corresponding conductive pad of the intercoupling ...

ELECTRONIC DEVICE AND ELECTRONIC DEVICE MANUFACTURING METHOD

Since a part which is unfit for using a 0402 type chip component and causes adverse effects on the efficiency of high frequency characteristics, for example, exists among chip component incorporating parts in the entire circuit of an RF power module when the 0402 type chip component is used, a chip component of different dimensions is used depending on the incorporating part of the chip component in the entire circuit of the RF power module. In the RF power module circuit, the 0402 type chip component of small dimensions is connected electrically to a part being applied with a voltage lower than that applied to a 1005 type or 0603 type chip component of large dimensions.

PADLESS SUBSTRATE FOR SURFACE MOUNTED COMPONENTS

A semiconductor package having a low profile is disclosed. In embodiments, a surface mounted component may be mounted directly to the core of the semiconductor package substrate, so that there is no conductive layer, plating layers or solder paste between the component and the substrate core. The surface mounted component may be any type of component which may be surface mounted on a substrate according to an SMT process, including for example passive components and various packaged semiconductors.

Circuit board device and mounting method therefor

In a circuit board, when lands provided on a rear surface of a substrate are each separated into a mainland and a sub-land, warping or other defects of the substrate can be ignored when soldering, and the substrate can be mounted with a high bonding strength. On the rear surface of a module substrate, partitions are each provided to separate a metal film into the mainland and the sub-land. Accordingly, when the substrate is mounted on a motherboard, solder applied beforehand from each end-surface electrode to the mainland can be largely protruded downward from the mainland, and warping or other defects of the substrate can be ignored by this protruding portion of the solder. In addition, in the state in which the substrate is mounted, since the solder is pushed out from between the mainland and the motherboard and overflows the partition, both the mainland and the sub-land can be soldered to the motherboard side, and hence stable bonding can be obtained at a large bonding area.

Masking of holes in circuit patterns on circuit boards prior to flow soldering

A circuit pattern on a circuit board usually has a number of contact areas to which components are soldered. Some of the contact areas have holes extending through the board for insertion of leads of leaded components, the leads then being flow soldered to the contact areas. It often occurs that additional leaded components are to be mounted on the board after a first flow soldering step. However, holes through which the leads are to pass can be closed by solder. These holes are therefore masked mechanically, by a masking member which contacts the board at these holes, or by tape, or other such method. The present invention uses a conventional solder resist layer, usually applied prior to flow soldering, extending the solder resist layer over a part of the contact area to the periphery of the hole, the hole having an unplated bore or wall. The resist layer extends for at least part of the hole periphery. This prevents the solder being attached to the contact area at the masked periphery ...

Raised solder-mask-defined (SMD) solder ball pads for a laminate electronic circuit board

A raised solder-mask-defined (SMD) pad configured for receiving a solder ball on a laminate electronic circuit board and a method of creating the raised SMD pad on a laminate electronic circuit board. The method may comprise forming a base bump, covering the base bump with a conductive bump layer and layering a surrounding material over an extended edge of the conductive bump layer. The surrounding material is patterned to expose a pad face and of a portion of the sides of the conductive bump layer, such that the pad face is disposed above the surface of the surrounding material. The surrounding material may be patterned by a photolithography operation or alternatively, a laser-drill operation.

Computing device with roll up components

This specification describes techniques for building lightweight computing devices that may weigh less than one pound. The computing device may include a motherboard, a keyboard, and a display. Alternatively it may include a motherboard, a display, and speech-processing capabilities. The motherboard is preferably built on a flexible substrate using a rigid carrier. IC chips are attached using flip chip bonds that employ stud bumps on the IC chips, and corresponding wells filled with solder on the motherboard. The display and keyboard roll up when not in use and employ super-elastic materials as stiffeners. The computing device may be implemented as a mobile computer, and may include a camera, and biometric security features. Passive cooling is employed, using the area of the roll up devices.

WIRING BOARD

To provide a wiring substrate which can prevent short circuit between connection terminals, and which realizes reduction of the pitch between the connection terminals. The wiring substrate of the present invention includes a layered structure including one or more insulation layers and one or more conductor layers, and the wiring substrate is characterized in that a plurality of connection terminals are formed on the layered structure so as to be separated from one another; a filling member is filled between the connection terminals; and each of the connection terminals has a side surface composed of a contact surface which is in contact with the filling member, and a spaced surface which is not in contact with the filling member and which is located above the contact surface and below the top surface of the filling member.

Land structure, printed wiring board, and electronic device

A land part (152) where a connection part (132) of an electronic part is soldered, includes a head end part (161). The head end part includes an inclination part (162). The inclination part may be formed by an end side. The end side may make a designated angle from an end line of the connection part of the electronic part.

METHOD FOR MOUNTING TERMINAL ON CIRCUIT BOARD AND CIRCUIT BOARD

The method for installing terminals comprises a coating step for coating solder paste (3) onto a desired circuit board (1), a superimposing step for superimposing the connecting end (4a) of a terminal (4) having a connecting end (4a) and non-connecting end (4b), and a step for heating and melting the solder paste in order that the connecting end (4a) is soldered to the circuit board (1). In the aforementioned coating step, a plurality of mutually separate solder paste coated regions (3a - 3d) are provided on the circuit board (1). In the aforementioned superimposing step, the connecting end (4a) is superimposed such that it extends over the aforementioned plurality of solder paste coated regions (3a - 3d).

LEITERPLATTE

Lamp integrated into wall e.g. ceiling wall, of cold apparatus i.e. refrigerator, used in household, has connection portion connecting light cover to lamp backing portion and lighting unit, which is arranged on inner side of cover

The lamp (30) has a lamp backing element (31) and a light cover (32), where the lights backing element is provided with a reflector (33). A releasable connection portion is arranged for connecting a light cover to the lamp backing portion. A lighting unit (35) is arranged on an inner side (36) of the light cover that is provided with a glass plate (40). The glass plate is provided with a wiring layer with strip conductors. The lighting unit is provided with LEDs (37, 62) that are arranged with a series element (38) parallel to a longitudinal edge (39).

Mehrschichtige gedruckte Leiterplatte

Printed circuit board for flow soldering

PRINTED CIRCUIT BOARDS

BIAXIAL ORIENTATIONS COPOLYESTERFOLIE AND LAMINATES FROM IT WITH COPPER

Verfahren zum positionsstabilen Verlöten

Method for positionally stable soldering of at least one component part contact face (11) of an electronic component part (1) to at least one corresponding carrier plate contact face (12) of a carrier plate (2), said method comprising the following steps: a) applying at least two adhesive bonding points (3a, 3b, 8a, 8b, 9a, 9b) to the carrier plate (2), wherein the position of each adhesive bonding point (3a, 3b, 8a, 8b, 9a, 9b) is preset, b) populating the carrier plate (2) with the at least one electronic component part (1), wherein the position of the adhesive bonding points (3a, 3b, 8a, 8b, 9a, 9b) in step a) is preset in such a way that the at least one electronic componenet part (1) makes contact with the at least two adhesive bonding points (3a, 3b, 8a, 8b, 9a, 9b) substantially in an edge region formed by the at least one side face (5a, 5b, 5c, 5d) and the lower face (6), and the at least one component part contact face (11) at least partially overlaps with the at least one carrier ...

Structuring of the solder mask printed circuit boards for improving the soldering results

System umfassend eine Trägerplatte (16) und zumindest einen an der Trägerplatte (16) montierten elektronischen Bauteil (10), wobei die Trägerplatte (16) zumindest eine Trägerplattenkontaktfläche (2, 2a, 2b) und das elektronische Bauteil (10) zumindest eine dazu korrespondierende Bauteilkontaktfläche (11) aufweist, wobei die zumindest eine Trägerplattenkontaktfläche (2, 2a, 2b) zumindest teilweise von dem zumindest einen elektronischen Bauteils (10) überdeckt und von einer Lötstopplackschicht (12) umgeben ist, die die zumindest eine Trägerplattenkontaktfläche (2, 2a, 2b) begrenzt, wobei in der Lötstopplackschicht (5) zumindest eine kanalartige Aussparung vorgesehen ist, durch die zumindest eine Hilfskontaktfläche (3a, 3b) ausgebildet ist, welche die zumindest eine Trägerplattenkontaktfläche (2, 2a, 2b) kontaktiert, wobei zumindest die Trägerplattenkontaktfläche (2, 2a, 2b), die Bauteilkontaktfläche (11) und die Hilfskontaktfläche (3a, 3b) eine benetzbare Oberfläche aufweisen.

Flexible circuit with plated cover layer and overlapping protective layer

Driving circuit and liquid crystal display device including the same

A tape carrier package (TCP) includes a film, a plurality of output leads and a plurality of input leads on the film, the plurality of output leads and the plurality of input leads being disposed on different sides, first and second TCP alignment marks arranged on opposing sides of the plurality of output leads, and a third TCP alignment mark at a central portion of the plurality of output leads.

Selective encapsulation of electronic components

A method for the selective encapsulation of electronic components on a printed circuit board comprising, in one embodiment, the steps of delivering the printed circuit board to an encapsulating nest at room temperature; damming the target areas with a dam resin having a latent curing agent and deposited in the shape of walls of predetermined heights, according to the desired fill heights; dispensing a fill resin to fill the dammed areas; and curing the dam and fill resins for a suitable amount of time. In a different embodiment, the invention comprises the additional steps of laying resin beads, each in a position corresponding to the footprint of each target component; and of positioning the target components over the beads and soldering the components.

Method of manufacturing antenna using sintering of metal and antenna manufactured by the same

A method of manufacturing an antenna includes forming a base including a synthetic resin, forming a conductive pattern on the base and forming a circuit pattern by sintering the conductive pattern by applying heat. The conductive pattern includes a conductive paste and a binding material binding the base and the conductive pattern. The conductive paste includes a metal.

Flexible circuit structure with stretchability and method of manufacturing the same

In one example embodiment, a flexible circuit structure with stretchability is provided that includes a flexible substrate, a plurality of flexible bumps formed on the flexible substrate, and a metal layer formed on the plurality of flexible bumps and the flexible substrate.

Wiring Design Support Apparatus and Wiring Design Support Method

According to one embodiment, a wiring design support apparatus comprises a display, a drawing module, and a data creation module. The display is configured to display a three-dimensional object. The drawing module is configured to draw a line connecting two points on a surface of the three-dimensional object displayed by the display. The data creation module is configured to create first three-dimensional data indicating a wiring based on the line drawn by the drawing module.

Multilayer printed wiring board and method for manufacturing multilayer printed wiring board

A multilayer printed wiring board including a first interlayer resin insulation layer, a pad formed on the first interlayer resin insulation layer, a solder resist layer formed on the first interlayer resin insulation layer and the pad, a protective film formed on a portion of the pad exposed by an opening of the solder resist layer, and a coating layer formed between the pad and the solder resist layer. The pad mounts an electronic component. The coating layer has a metal layer and a coating film. The metal layer is formed on the surface of the pad and the coating film is formed on the metal layer.

Memory Modules and Devices Supporting Configurable Core Organizations

Described are memory apparatus organized in memory subsections and including configurable routing to support multiple data-width configurations. Relatively narrow width configurations load fewer sense amplifiers, resulting in reduced power usage for relatively narrow memory configurations. Also described are memory controllers that convey width selection information to configurable memory apparatus and support point-to-point data interfaces for multiple width configurations.

System for manufacturing laminated circuit boards

The present invention relates to a pin-less registration and inductive heating system involving the use of a pre-alignment station for imaging an initial position of a laminate element, an imaging and computer operation control system for determining a required correction factor between an alignment of the laminate element at the pre-alignment station and a preferred stack orientation for the laminate element, and an alignment and transfer system for securely gripping, transferring, and repositioning a laminate element from a top position to the preferred stack orientation employing a preferred four-axis orientation.

Double-sided circuit board and manufacturing method thereof

A double-sided circuit board including a substrate having a first surface and a second surface on an opposite side of the first surface and having a penetrating hole extending between the first surface and the second surface, a first conductive circuit formed on the first surface of the substrate, a second conductive circuit formed on the second surface of the substrate, and a through-hole conductor formed in the penetrating hole of the substrate and electrically connecting the first conductive circuit and the second conductive circuit. The penetrating hole comprises a first hole having a first opening with a diameter R 1 on the first surface of the substrate, a second hole having a second opening with a diameter R 2 on the second surface of the substrate, and a third hole connecting the first hole and the second hole and having a diameter smaller than at least one of R 1 and R 2.

Packaging substrate with conductive structure

A packaging substrate with conductive structure is provided, including a substrate body having at least one conductive pad on a surface thereof, a stress buffer metal layer disposed on the conductive pad and a thickness of the stress buffer metal layer being 1-20 μm, a solder resist layer disposed on the substrate body and having at least one opening therein for correspondingly exposing a portion of top surface of the stress buffer metal layer, a metal post disposed on a central portion of the surface of the stress buffer metal layer, and a solder bump covering the surfaces of the metal post. Therefore, a highly reliable conductive structure is provided, by using the stress buffer metal layer to release thermal stresses, and using the metal post and the solder bump to increase the height of the conductive structure.

High-frequency switch module

In a high-frequency switch module, a switch IC is mounted on a multilayer board to define a high-frequency switch module. The multilayer board includes two internal wirings and two internal ground electrodes. The internal ground electrodes are spaced apart from each other at an interval when viewed from a lamination direction of the multilayer board. The first internal wiring is located on the upper surface side of the first internal ground electrode, and is entirely separated from an RF wiring, and the first internal wiring includes a power supply wiring for supplying power to the switch IC. The second internal wiring is located on the upper surface side of the second internal ground electrode, and is entirely separated from the power supply wiring, and the second internal wiring includes a signal wiring through which an RF signal propagates.

Circuit Layout of Image Capturing Device

A circuit layout of an image capturing device comprises a circuit board, an image capturing circuit, a flashlight circuit and a groove. The circuit board is a multilayered structure. The image capturing circuit is built on the circuit board. The flashlight circuit is built on the circuit board. The groove is formed on the multilayered structure of the circuit board and divides the circuit board into two areas where the image capturing circuit and the flashlight circuit are respectively disposed. The image capturing circuit is located at a first area, and the flash circuit is located at a second area. Therefore, the groove can prevent the interference between the image capturing circuit and the flashlight circuit.

Led backlight module having extrusion housing

The present invention relates to an LED backlight module having extrusion housing, comprising: an extrusion housing, a circuit layer, a thermal conductive band, an accommodating body, a plurality of LED chips, a first elastic thermal-conductive member, and second elastic thermal-conductive member, wherein the accommodating body has a plurality of through holes for receiving the LED chips, such that the LED chips disposed on the circuit layer can pass through the through holes, respectively, therefore, the LED chips accommodated in the through holes are protected from suffering the impact caused by an external force; Moreover, through the thermal conductive band, the first elastic thermal-conductive member and the second elastic thermal-conductive member, when the LED chips emit light, the heat produced by the LED chips can be effectively dissipated via “double-direction dissipation”, that is, the heat can be dissipated via the front surface and the rear surface of the circuit layer.

Printed wiring board and method for manufacturing the same

A method for manufacturing printed wiring board including preparing an electronic component having first and second surfaces and electrode on the first surface, forming in an adhesive tape a mark, mounting based on the mark the component on the tape such that the second surface faces the adhesive of the tape, forming another mark on insulative substrate having first and second surfaces, forming in the substrate an opening larger than the component, mounting based on the marks the substrate on the tape such that the component is in the opening of the substrate, fixing the component to the substrate using resin, forming an insulation layer on the first surface of the substrate where the component is accommodated, removing the tape, forming in the layer an opening reaching the electrode, forming a conductive circuit on the layer, and forming in the opening of the layer a via connected to the electrode.

Apparatus for detecting pattern alignment error

An apparatus for detecting pattern alignment error includes a first conductive pattern disposed over a first insulation member with a power source applied of the first conductive pattern; a second insulation member for covering the first conductive pattern; a second conductive pattern disposed on the second insulation member; a conductive via connected to the second conductive pattern and passing through the second insulation member; and an insulation pattern disposed in the first to conductive pattern for detecting an alignment error in response to a position of the conductive via. The apparatus for detecting pattern alignment error can detect the alignment of lower wiring in a device with multi-layer wiring

Disguising test pads in a semiconductor package

A method of forming a semiconductor package is disclosed including disguising the test pads. Test pads are defined in the conductive pattern of the semiconductor package for allowing electrical test of the completed package. The test pads are formed in shapes such as letters or objects so that they are less recognizable as test pads.

Thermoplastic Composition for Use in Forming a Laser Direct Structured Substrate

A thermoplastic composition that contains a unique combination of a thermotropic liquid crystalline polymer, dielectric material, laser activatable additive, and a fibrous filler is provided. The nature of the components and/or their concentration are selectively controlled in the present invention to maintain a high dielectric constant, good mechanical properties (e.g., deflection under load), and good processibility (e.g., low viscosity), yet still be laser activatable. Thus, the thermoplastic composition can be readily shaped into a thin substrate and subsequently applied with one or more conductive elements using a laser direct structuring process (“LDS”).

Printed circuit board and method for manufacturing the same

Disclosed herein is a printed circuit board, including: a core layer; and a plurality of circuit layers stacked on the core layer, wherein one of the circuit layers includes a mesh pattern and a solid pattern, and another of the circuit layers include a first signal pattern opposite to the mesh pattern and a second signal pattern opposite to the solid pattern, the second signal pattern having a high-speed signal line with a higher speed, as compared with the second signal pattern.

Thin fan and manufacturing method thereof

A manufacturing method of a thin fan comprises the steps of: providing a plastic material containing a plurality of metal particles; molding the plastic material into a housing; removing a part of a surface of the housing to form a circuit layout area at the housing; and forming a metal layer in the circuit layout area.

Metal core substrate and electrical junction box using the same

The electrical junction box is provided with a metal core substrate including: a rectangular-shaped core metal layer in which two core metal plates are arranged with a slit-shaped gap therebetween; and insulating layers filling the gap and integrating the two core metal plates by covering surfaces of the core metal plates. Electric power from a battery is inputted into the core metal plate, and electric power from an alternator is inputted into the core metal plate. The gap includes: a first straight portion vertically extended straight from one side of the core metal layer; a second straight portion vertically extended straight from another side of the core metal layer, parallel to a virtual extended line of the first straight portion, and not arranged in the same line as the first straight portion; and a square-U-shaped portion.

Wiring substrate, manufacturing method thereof, and semiconductor package

A disclosed wiring substrate includes an insulating layer, a recess formed on a surface of the insulating layer, and an alignment mark formed inside of the recess, wherein a face of the alignment mark is roughened, recessed from the surface of the insulating layer, and exposed from the recess.

Three-dimensional circuit component, method of making the same, and physical-quantity measuring instrument

For producing a three-dimensional circuit component, an electronic component is mounted on a synthetic resin block. A plurality of electrically-conductive patterns used to establish an electrical connection to the electronic component are formed on the block along a three-dimensional shape of the block. An end of each electrically-conductive patterns is provided with a solder-disposed section. A solder is provided between the solder-disposed section and an opposed surface of the electronic component. The section of each electrically-conductive patterns other than the solder-disposed section and a section on which the electronic component is mounted is internally formed in the block. Since the section of each electrically-conductive patterns other than the section on which the electronic component is mounted is internally formed in the block, the electrically-conductive patterns are not unnecessarily exposed.

Printed circuit board

Disclosed herein is a printed circuit board. In the printed circuit board provided with a router machining line to be partitioned into a unit region in which a plurality of unit substrates are formed and a dummy region enclosing the unit region, the unit region and the dummy region are formed in a plurality of layers and the printed circuit board includes detection coupons formed on each of the plurality of layers.

Apparatus and methods for a physical layout of simultaneously sub-accessible memory modules

A layout for simultaneously sub-accessible memory modules is disclosed. In one embodiment, a memory module includes a printed circuit board having a plurality of sectors, each sector being electrically isolated from the other sectors and having a multi-layer structure. At least one memory device is attached to each sector, the memory devices being organized into a plurality of memory ranks. A driver is attached to the printed circuit board and is operatively coupled to the memory ranks. The driver is adapted to be coupled to a memory interface of the computer system. Because the sectors are electrically-isolated from adjacent sectors, the memory ranks are either individually or simultaneously, or both individually and simultaneously accessible by the driver so that one or more memory devices on a particular sector may be accessed at one time. In an alternate embodiment, the printed circuit board includes a driver sector electrically isolated from the other sectors and having a multi-layer structure, the driver being attached to the driver sector.

Light-emitting device

A light-emitting device including: a base; light-emitting elements arranged on the base at intervals in an array along a predetermined direction of the base; and conductive-wiring parts formed on first and second sides of the array of the light-emitting elements on the base. The conductive-wiring parts are discretely formed along the predetermined direction of the base, each of the conductive-wiring parts relaying electricalconnection between the light-emitting elements, and the number of the conductive-wiring parts arranged per light-emitting element on each of the first and second sides of the array of the light-emitting elements is two or more.

Electronic component mounting line and electronic component mounting method

Disclosed is an electronic component mounting line on which a substrate undergoes solder paste printing, electronic component placements, and then reflow, while being moved from upstream to downstream. The line includes: a substrate feeding machine; a screen printing machine for applying solder paste to the substrate; a resin dispensing machine arranged downstream of the screen printing machine, for dispensing a thermosetting resin onto at least one reinforcement position on the substrate; a second electronic component placement machine arranged adjacent to and downstream of the resin dispensing machine, for placing a second electronic component on the substrate, such that its peripheral edge portion comes in contact with the resin; a first electronic component placement machine arranged downstream of the second electronic component placement machine, for placing a first electronic component on the substrate; and a reflow machine for bonding the electronic components to the substrate, by heating and cooling the resultant.

Printed wiring board and method for manufacturing printed wiring board

A printed wiring board includes an outermost interlayer resin insulation layer, n outermost conductive layer formed on the outermost interlayer resin insulation layer and including multiple alignment marks, a connection wiring structure connecting the alignment marks, and a solder-resist layer formed on the outermost interlayer resin insulation layer and the outermost conductive layer. The solder-resist layer has openings exposing the alignment marks, respectively, and each of the alignment marks has an electroless plated film formed on each of the alignment marks.

Circuit board and lighting device having the circuit board

Provided is a circuit board including: a supporting substrate; light emitting elements mounted to the supporting substrate; a through hole passing through the supporting substrate; and a connector inserted into the through hole and for supplying an electric current to the light emitting elements.

ANISOTROPIC CONDUCTIVE FILM

An anisotropic conductive film, capable of connecting a terminal formed on a substrate having a wavy surface such as a ceramic module substrate with conduction characteristics stably maintained, includes an insulating adhesive layer, and conductive particles regularly arranged in the insulating adhesive layer as viewed in a plan view. The conductive particle diameter is 10 μm or more, and the thickness of the film is 1 or more times and 3.5 or less times the conductive particle diameter. The variation range of the conductive particles in the film thickness direction is less than 10% of the conductive particle diameter. 1. An anisotropic conductive film comprising an insulating adhesive layer and conductive particles regularly arranged in the insulating adhesive layer as viewed in a plan view , wherein the conductive particle has a conductive particle diameter of 10 μm or more , the film has a thickness of 1 or more times and 3.5 or less times the conductive particle diameter , and positions of the conductive particles are varied in a thickness direction of the film within a variation range of less than 10% of the conductive particle diameter.2. The anisotropic conductive film according to claim 1 , wherein the thickness of the anisotropic conductive film is 1 or more times and 2.5 or less times the conductive particle diameter.3. The anisotropic conductive film according to claim 1 , wherein a distance between one surface of the anisotropic conductive film and each conductive particle is 10% or more of the conductive particle diameter.4. The anisotropic conductive film according to claim 1 , wherein a difference between maximum and minimum values of particle densities claim 1 , as viewed in a plan view claim 1 , measured at ten regions which each have an area of 1 mm×1 mm and are extracted in a longitudinal direction of the anisotropic conductive film is less than 20% of an average of the particle densities at the respective region.5. The anisotropic conductive film ...

Electronic Circuit and Substrate with Identification Pattern for Separate Electronic Circuits and Method for Producing Thereof

The present invention relates to an improved electronic circuit, as well as an improved substrate with electronic circuits, with an identification pattern. The invention makes it possible to make them identifiable and amongst other things to retrace the circuit(s) in this way through the production process. Furthermore, the invention relates to an improved production method for circuits and substrates according to the invention.

Manufacture of a curved electronic device using differential heating and curved electronic device

A curved electronic device ( 10 c ) can be formed by a stack with a curved substrate ( 13 ) comprising a thermoplastic material (Ms), and at least one electronic component ( 14 ) connected to an electronic circuit ( 15 ) disposed on the substrate ( 13 ). A component area ( 11 ) of the substrate surface ( 11.12 ) around the electronic component ( 14 ) comprises a first material (M 1 ) providing relatively low absorption (A 1 ) to light (L) and a surrounding area ( 12 ) of the substrate ( 13 ) outside the component area ( 11 ), comprises a second material (M 2 ) providing relatively high absorption (A 2 ) of the light (L). E.g. as a result of differential heating and thermoforming a first thickness (T 1 ) of the substrate ( 13 ) in the component area ( 11 ) may be relatively high compared to a second thickness (T 2 ) of the substrate ( 13 ) in the surrounding area ( 12 ).

Printed wiring board and method for manufacturing printed wiring board

A method for manufacturing a printed wiring board includes forming metal posts on a conductor circuit formed on a resin insulating layer, forming the outermost resin layer on the resin insulating layer such that the metal posts is embedded in the outermost resin layer, forming a mask at a dam formation site for a dam structure of the outermost resin layer to surround at least part of a pad group including the metal posts on the outermost resin layer, and reducing a thickness of the outermost resin layer exposed from the mask such that end portions of the metal posts are exposed from the outermost resin layer, that the metal posts form the pad group, and that the outermost resin layer has the dam structure forming part of the outermost resin layer and formed to surround at least part of the pad group including the metal posts.

Assembly for attaching a circuit board to a housing

The present invention provides an assembly for attaching a circuit substrate to a housing. The assembly includes a fastener having a first end and a second end opposite the first end, where the first end is larger than a second end. The assembly further includes a circuit substrate including a through hole having a first opening on a first side of the circuit substrate and a second opening on a second side of the circuit substrate, the through hole for receiving the fastener. The assembly still further includes a mounted structure attached to the circuit substrate, which at least partially covers the second opening of the through hole on the second side of the circuit substrate, wherein the mounted structure restricts the size of an exposed portion of the second opening of the through hole. The second end of the fastener, which is received in the through hole of the circuit substrate is sized to extend through the through hole, as well as the restricted size of the exposed portion of the second opening restricted by the mounted structure. The larger first end of the fastener is sized to extend through the through hole, but not through the restricted size of the exposed portion of the second opening. The assembly further includes a housing having a boss adapted and aligned for receiving the second end of the fastener after the second end of the fastener has been received by the through hole of the circuit substrate, and extends therethrough, wherein the boss is adapted to grip the received second end of the fastener.

POWER SUPPLIES INCLUDING SHIELDED MULTILAYER POWER TRANSMISSION BOARDS

A power supply comprises a main circuit board and a multilayer power transmission board electrically coupled to the main circuit board. The multilayer board includes a conductive neutral layer having an inner side, a conductive line layer having an inner side facing the inner side of the conductive neutral layer, and a dielectric medium positioned between the conductive neutral layer and the conductive line layer. The power supply also comprises a first conductive outer layer positioned adjacently to an outer side of the conductive neutral layer, a second conductive outer layer positioned adjacently to an outer side of the conductive line layer, and a conductive plating material positioned within a slot formed in the multilayer power transmission board and covering an interior portion of the multilayer power transmission board facing the slot. The conductive plating material electrically couples the first and second conductive outer layers. 1. A power supply comprising:a main circuit board; and a conductive neutral layer having an inner side;', 'a conductive line layer having an inner side facing the inner side of the conductive neutral layer;', 'a dielectric medium positioned between the conductive neutral layer and the conductive line layer;', 'a first conductive outer layer positioned adjacently to an outer side of the conductive neutral layer;', 'a second conductive outer layer positioned adjacently to an outer side of the conductive line layer;', 'a conductive plating material positioned within a slot formed in the multilayer power transmission board and covering an interior portion of the multilayer power transmission board facing the slot; and', 'wherein the conductive plating material electrically couples the first and second conductive outer layers., 'a multilayer power transmission board electrically coupled to the main circuit board, the multilayer board including2. The power supply of claim 1 , wherein the multilayer power transmission board extends in a ...

Electrical device, model series of electrical devices, and production method

In an electrical device, a model series of electrical devices, and a production method, in particular for a converter, having a circuit board including circuit traces, the circuit board has two similar and/or identical contact area arrays, the contact area arrays in particular transitioning into each other through rotation and/or displacement. A first contact area array of the contact area arrays is fitted with a first power module, and the second contact area array is able to be fitted with a second power module, e.g., so that a respective electric motor is able to be supplied from the respective power module.

INTEGRATED WIRING SYSTEM FOR COMPOSITE STRUCTURES

A composite part comprising an electronic device and method for making the same. A primer is deposited on a surface of the composite part. An electronic device comprising a group of conductive elements is deposited on the primer. Power may be supplied to a device connected to the composite part through current flowing through the group of conductive elements. 1. An apparatus comprising:a composite part;a primer deposited on a surface of the composite part; andan electronic device comprising a group of conductive elements deposited on the primer, wherein power is supplied to a device connected to the composite part through current flowing through the group of conductive elements.2. The apparatus of claim 1 , wherein the primer comprises:a layer of metallic material sprayed on the surface of the composite part using a thermal plasma spray; anda layer of ceramic material sprayed on the layer of metallic material using the thermal plasma spray.3. The apparatus of claim 1 , wherein conductive material is sprayed on the primer using a thermal plasma spray to form the group of conductive elements.4. The apparatus of claim 3 , wherein the conductive material is selected from at least one of copper claim 3 , copper alloy claim 3 , carbon claim 3 , graphene claim 3 , titanium claim 3 , nickel claim 3 , or silver.5. The apparatus of claim 1 , wherein the composite part is an aircraft part.6. The apparatus of claim 5 , wherein the composite part is selected from one of a skin panel claim 5 , an interior panel claim 5 , a stringer claim 5 , a frame claim 5 , a spar claim 5 , a wing claim 5 , a winglet claim 5 , a fuselage claim 5 , an empennage claim 5 , and a control surface.7. The apparatus of claim 1 , wherein the group of conductive elements comprises at least one of an electrical trace claim 1 , an interconnect claim 1 , a wire claim 1 , a transistor claim 1 , an integrated circuit claim 1 , or a conductive connector.8. The apparatus of claim 1 , wherein the device ...

Printed circuit board, method of manufacturing same, and method of mounting the circuit board in a connector socket

A circuit board that is to be mounted in a connector socket includes a plurality of electrical connectors located along a side edge of the circuit board. Retention bosses are formed on first and second opposite sides of the circuit board, each of the retention bosses protruding from a surface of the circuit board and extending parallel to and adjacent to the first edge of the circuit board. When the first edge of the circuit board is inserted into a slot of a connector socket, contact surfaces of the first and second retention bosses contact top surfaces of the connector socket to help immobilize the circuit board with respect to the connector socket. Adhesive layers on the contact surfaces of the first and second retention bosses may adhere to the top surfaces of the connector socket to help hold the circuit board immobile with respect to the connector socket.

Electronic apparatus and method for fabricating the same

An electronic apparatus includes a first electronic part with a first terminal, a second electronic part with a second terminal opposite the first terminal, and a joining portion which joins the first terminal and the second terminal. The joining portion contains a pole-like compound extending in a direction in which the first terminal and the second terminal are opposite to each other. The joining portion contains the pole-like compound, so the strength of the joining portion is improved. When the first terminal and the second terminal are joined, the temperature of one of the first electronic part and the second electronic part is made higher than that of the other. A joining material is cooled and solidified in this state. By doing so, the pole-like compound is formed.

DEPOSITING BULK OR MICRO-SCALE ELECTRODES

Thicker electrodes are provided on microelectronic device using thermo-compression bonding. A thin-film electrical conducting layer forms electrical conduits and bulk depositing provides an electrode layer on the thin-film electrical conducting layer. An insulating polymer layer encapsulates the electrically thin-film electrical conducting layer and the electrode layer. Some of the insulating layer is removed to expose the electrode layer. 1. A method of fabricating or depositing electrode materials , comprising the steps of:depositing an electrically insulating polymer layer on a substrate,depositing a thin-film electrical conducting layer to form electrical conduits connecting,bulk depositing an electrode layer on said thin-film electrical conducting layer,depositing an encapsulating electrically insulating polymer layer on said thin-film electrical conducting layer and said electrode layer,removing some of said insulating layer covering said electrode layer, andreleasing the electrode materials from said substrate.2. The method of fabricating or depositing electrode materials of wherein said step of bulk depositing an electrode layer on said thin-film electrical conducting layer comprises bulk depositing a metal electrode layer on said thin-film electrical conducting layer.3. The method of fabricating or depositing electrode materials of wherein said step of bulk depositing an electrode layer on said thin-film electrical conducting layer comprises bulk depositing a conducting polymer electrode layer on said thin-film electrical conducting layer.4. The method of fabricating or depositing electrode materials of wherein said step of bulk depositing an electrode layer on said thin-film electrical conducting layer is accomplished using a combination of pressure claim 1 , elevated temperature and ultrasonic energy to bond said electrode layer to said thin-film electrical conducting layer.5. The method of fabricating or depositing electrode materials of wherein said ...

ADJUSTABLE IMPEDANCE HIGH SPEED DATA CONNECTOR, AND METHODS OF ASSEMBLING AND OPERATING THEREOF

An adjustable impedance high speed data connector, and methods for assembling and operating thereof. The adjustable impedance high speed data connector of this invention includes a printed circuit board accommodated within, or printed or stamped onto, a tray, the printed circuit board including sets of terminals respectively extending on opposite ends of the printed circuit board. Mounted onto the printed circuit board and electrically connected thereto is at least one electric module having a fixed or adjustable capacitance or a fixed or adjustable inductance, which may be combined in any desired combination to achieve a desired impedance for the connector. By adjusting the variable capacitance or inductance of the electric module (or the variable combinations of capacitance and/or inductance of a plurality of electric modules), the impedance within the connector is adjustable for allowing the connector to operate at various ranges of bandwidths. 1. An adjustable impedance high speed data connector , comprising:a cover having at least a first protruding latch;a tray having at least a second protruding latch;a printed circuit board mounted onto a floor of the tray, the printed circuit board having first and second sets of terminals extending on opposite ends thereof; and 'wherein the printed circuit board is housed within the cover and the tray with the first and second protruding latches connected to each other.', 'at least an electric module mounted onto the printed circuit board and connected thereto, the electric module having at least a capacitance or an inductance,'}2. The adjustable impedance high speed data connector as in claim 1 , wherein the electric module has a fixed capacitance or a fixed inductance.3. The adjustable impedance high speed data connector as in claim 2 , wherein the electric module has an adjustable capacitance or an adjustable inductance.4. The adjustable impedance high speed data connector as in claim 2 , wherein a plurality of electric ...

Insulating ceramic paste, ceramic electronic componet, and method for producing the same

Provided are an insulating ceramic paste, a ceramic electronic component, and a method for producing the ceramic electronic component that allow prevention of solder shorts between narrow-pitch terminal electrodes and suppression of generation of cracks in an insulator covering a portion of terminal electrodes during a firing step. The ceramic electronic component includes a ceramic multilayer substrate, terminal electrodes formed on a surface of the ceramic multilayer substrate, and an insulating ceramic film formed on the surface of the ceramic multilayer substrate so as to cover a portion of the terminal electrodes. An exposed surface portion (celsian-crystal-rich layer) of the insulating ceramic film has a thermal expansion coefficient that is lower than the thermal expansion coefficient of the ceramic multilayer substrate.

Method for manufacturing a printed circuit board element and printed circuit board element

The method for manufacturing a printed circuit board element () having an inlay () and a current sensor () for determining a current flowing in the inlay (), wherein, for the improvement of the positional accuracy of the inlay () relative to the current sensor (), the method comprises the following steps: 1. A method for manufacturing a printed circuit board element having an inlay and a current sensor for determining a current flowing through the inlay , wherein , for the improvement of the positional accuracy of the inlay relative to the current sensor , the method comprises the following steps:providing a layer of printed circuit board material having a recess;providing an inlay having an inlay outline;inserting the inlay in the recess;embedding the inlay in the recess;completing and laminating the layered printed circuit board structure;applying at least two alignment markings on an uppermost printed circuit board layer;forming a defined cross-section tapering on the inlay outline, the tapering being aligned with the at least two alignment markings;applying an assembly marking for a current sensor on an uppermost printed circuit board layer, the assembly marking being aligned with the at least two alignment markings.2. The method according to claim 1 , wherein between the steps of forming the cross-section tapering and applying the current sensor claim 1 , further printed circuit board layers are applied and laminated.3. The method according to claim 1 , wherein forming of the cross-section tapering is performed by means of milling claim 1 , laser cutting or similar.4. The method according to claim 1 , wherein the embedding of the inlay is performed by means of lamination claim 1 , compression or the like.5. The method according to claim 1 , wherein the cross-section tapering is performed by means of at least one indentation or slot.6. The method according to claim 5 , wherein the cross-section tapering is performed by means of a single-sided indentation or slot ...

Wiring board, electronic apparatus, and method for manufacturing electronic apparatus

A wiring board includes a substrate, an electrode on a surface of the substrate, a wall surface in a ring shape surrounding an outer circumference of the electrode, an upper end of the wall surface is located at a position higher than a surface of the electrode, and a protrusion at the upper end of the wall surface, the protrusion protruding with respect to the wall surface inward of a ring shape defined by the wall surface.

METHOD OF FORMING WIRING ON SIDE PORTION OF SUBSTRATE

Disclosed is a method of forming wiring of a substrate includes masking a substrate side portion, on which the wiring will be formed, by attaching a deposition mask to the substrate; and forming the wiring on the substrate side portion based on sputtering after introducing the masked substrate into a chamber. 1. A method of forming wiring of a substrate , comprising:masking a substrate side portion, on which the wiring will be formed, by attaching a deposition mask to the substrate; andforming the wiring on the substrate side portion based on sputtering after introducing the masked substrate into a chamber.2. The method according to claim 1 , wherein the substrate side portion comprises a lateral side of the substrate claim 1 , and a top and bottom of the substrate adjacent to the lateral side claim 1 , and the wiring on the substrate side portion is configured to electrically connect a top circuit pattern formed on a top of the substrate and a bottom circuit pattern formed on a bottom of the substrate.3. The method according to claim 1 , wherein the wiring to be formed on the substrate side portion is deposited inside the chamber based on sputtering using a central source target disposed to face a lateral side of the substrate claim 1 , and side source targets disposed at opposite sides of the central source target and inclined toward the substrate.4. The method according to claim 3 , wherein the substrate is disposed as mounted to a jig inside the chamber claim 3 , rotatable with respect to a lengthwise direction of the substrate claim 3 , and adjustable in angle to face toward the central source target. This application claims priority from Korean Patent Application No. 10-2018-0080297, filed on Jul. 11, 2018 in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference.The disclosure relates to a method of forming wiring on a substrate, and more particularly to a method of forming wiring on a side portion of a substrate, ...

Enhanced product packaging

A packaging system comprises: a package forming a set of discrete compartments; and a film portion interfacing with the package. The film portion includes a set of one or more electrically conductive traces in which each electrically conductive trace is associated with a respective compartment of the set of discrete compartments. Each electrically conductive trace of the set of electrically conductive traces forms a respective circuit loop that has a terminal end that terminates within an interface region of the film portion to collectively form a termination pattern. At least one of the package or the film portion have two or more alignment ports defined therein that are arranged according to an alignment pattern, each alignment port passing through at least one of the package or film portion.

Printed circuit board and method for manufacturing same

A printed circuit board includes a first outer electrically conductive pattern layer, a first insulation layer, a first inner electrically conductive pattern layer, a connection adhesive sheet, a second inner electrically conductive layer, a second insulation layer, a second outer electrically conductive pattern layer, and a identification mark, which are arranged in that order. The first outer electrically conductive pattern layer includes many first gold fingers. The second outer electrically conductive pattern layer includes many second gold fingers. The blind hole corresponds to the identification mark. The first outer electrically conductive pattern layer, the second outer electrically conductive pattern layer, and the at least one identification mark are simultaneously formed.

COMPONENT MOUNTING MACHINE

A component mounting machine mounts components having a component mark for positioning on an upper face on a circuit board. The component mourning machine has a first suction nozzle that sucks a component, a transfer head that mounts the component, on a circuit board, an optical path conversion device disposed above a suction surface and converts the optical path of light from the upper face of the component to the side, a camera that receives light that is changed in an optical path, a camera moving device that moves the camera, and a control device controlling operation of the transfer head and the camera moving device. The camera moving device moves the camera in a first direction orthogonal to an optical axis of the camera, and an imaging region of the camera moves in a second direction when the camera moves in the first direction. 1. A component mounting machine mounting a component , which has a component mark for positioning on an upper face , on a circuit board , comprising:a first suction nozzle that is provided with a suction surface that suctions the upper face of the component;a transfer head that supports the first suction nozzle and mounts the component that is sucked by the first suction nozzle on the circuit board by moving the first suction nozzle relatively to the circuit board;an optical path conversion device that is disposed above the suction surface and converts an optical path of light from the upper face of the component to the side;a first camera that is disposed at a position at which it is possible to receive, from the upper face of the component, light that is changed in the optical path by the optical path conversion device;a camera moving device that moves the first camera relatively to the first suction nozzle; anda control device that controls operation of the transfer head and the camera moving device,wherein the camera moving device moves the first camera in at least a first direction that is orthogonal to an optical axis of the ...

METHOD OF CALIBRATING A DISPENSER

A method is used to identify and compensate for errors created by changes in the relative positions of a deposition unit and a vision system of a dispenser. The method includes calibrating the vision system, dispensing a pattern of features over a working area, moving the vision system over a deposition location to locate a deposition, obtaining an image of the deposition, tagging data associated with the image, calculating a relative distance between the deposition unit and the vision system, storing correction data with spatial location in a file for later use, and using the stored data to make small corrections prior to dispensing additional material. 1. A method used to identify and compensate for errors created by changes in the relative positions of a deposition unit and a vision system of a dispenser , the method comprising:calibrating the vision system;temporarily fixing a camera on a deposition unit;moving a camera at a deposition unit location to the same location as the vision system was calibrated;obtaining an image of same standard which the vision system was calibrated to;tagging data associated with the image;calculating a relative distance between the deposition unit and the vision system;storing correction data with spatial location in a file for later use; andusing the stored data to make corrections prior to dispensing additional material.2. The method of claim 1 , wherein the steps of obtaining an image of the deposition claim 1 , tagging data associated with the image claim 1 , saving the data claim 1 , and calculating a relative distance are repeated for other deposition locations.3. The method of claim 1 , further comprising claim 1 , if multiple dispensing units are employed claim 1 , tagging each dispensing unit.4. The method of claim 1 , wherein the method is performed under the control of a controller configured to manipulate the vision system with a vision gantry system to move to a position defined by the calibration location.5. The ...

Component package and printed circuit board for the same

A component package includes a printed circuit board; a first electronic component disposed in a first region on the printed circuit board; a second electronic component disposed in a second region on the printed circuit board; and a metal wall disposed on the printed circuit board and spatially partitioning the first region and the second region on a plane. The metal wall is directly connected to the printed circuit board.

Display device

A display device includes a display unit including transistors disposed in a display area and signal lines arranged in a non-display area located along an edge of the display area, at least one of the signal lines being electrically connected to the transistors; and an input sensing unit disposed over the display unit and including sensing electrodes disposed on the display area, sensing lines arranged on the non-display area, and a first dummy pattern disposed on the non-display area and spaced apart from the sensing electrodes as compared with the sensing line, wherein the first dummy pattern overlaps a first signal line of the signal lines, the first signal line being spaced farthest from the display area, a planar shape of an overlap pattern formed by overlapping the first dummy pattern and the first signal line coincides with a planar shape of an alignment mark.

Redistribution Board, Electronic Component and Module

A redistribution board includes a first conductive layer including a redistribution structure for low voltage signals, a second conductive layer including a redistribution structure for high voltage signals, and a non-conductive layer. The second conductive layer is spaced apart from the first conductive layer by the non-conductive layer. The redistribution board further includes a conductive connector extending from a mounting surface of the redistribution board to the second conductive layer. The conductive connector is surrounded by a low voltage trace of the first conductive layer.

PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME

A printed circuit board in accordance with a disclosed embodiment may include first insulating layer having first via formed therein and second insulating layer laminated on both surfaces of the first insulating layer and having second via formed therein. The second via may connect first circuit formed on the first insulating layer with second circuit formed on the second insulating layer. A diameter of the second via may become greater toward an inside of the printed circuit board. 1. A printed circuit board , comprising:first insulating layer having first via formed therein; andsecond insulating layer laminated on both surfaces of the first insulating layer and having second via formed therein,wherein the second via connects first circuit formed on the first insulating layer with second circuit formed on the second insulating layer, andwherein a diameter of the second via becomes greater toward an inside of the printed circuit board.2. The printed circuit board as set forth in claim 1 , wherein a diameter of the first via is constant from one surface to the other surface of the first insulating layer.3. The printed circuit board as set forth in claim 1 , wherein a diameter of the first via becomes smaller from one surface to the other surface of the first insulating layer.4. The printed circuit board as set forth in claim 1 , further comprising solder resist laminated on the second insulating layer claim 1 ,wherein the solder resist has opening formed therein, andwherein a diameter of the opening becomes smaller toward the inside of the printed circuit board.5. A method of fabricating a printed circuit board claim 1 , comprising:processing first via hole in first insulating layer;forming first circuit on both surfaces of the first insulating layer and forming first via in the first via hole;processing second via hole in second insulating layer;laminating the second insulating layer on the first insulating layer in such a way that a processing surface of the second ...

Electronic device having fpcb

Disclosed is an electronic device. The electronic device includes: a housing including at least a part of a lateral surface of the electronic device; a printed circuit board (PCB) disposed in the housing; at least one wireless communication circuit disposed on the PCB; a first antenna module including at least one antenna disposed in a first region inside the housing; a second antenna module including at least one antenna disposed in a second region inside the housing; a third antenna module including at least one antenna disposed in a third region inside the housing; a first flexible printed circuit board (FPCB) connecting the first antenna module to the at least one wireless communication circuit; and a second FPCB connecting the second antenna module and the third antenna module to the at least one wireless communication circuit. The second FPCB includes: a first connector disposed on the PCB and electrically connected to the wireless communication circuit; a second connector coupled to a second joint electrically connected to the second antenna module; a third connector coupled to a third joint electrically connected to the third antenna module; and a coupler connecting the first connector, the second connector, and the third connector.

Printed wiring board and method for manufacturing printed wiring board

A printed wiring board includes a base insulating layer, a conductor layer formed on the base layer and including first and second pads, a solder resist layer formed on the base layer such that the solder resist layer has first opening exposing the first pad and second opening exposing the second pad with diameter smaller than diameter of the first opening, and bumps including a first bump on the first pad and a second bump on the second pad such that the second bump has diameter smaller than diameter of the first bump. The first bump has a base plating layer formed in the first opening and having raised portion, and a top plating layer formed on the base plating layer, and the second bump has a base plating layer formed in the second opening and having raised portion, and a top plating layer formed on the base plating layer.

CIRCUIT ASSEMBLIES AND RELATED METHODS

In exemplary embodiments, a circuit assembly may be provided on and/or supported by an electrically conductive structure, such as a board level shield, a midplate, a bracket, a precision metal part, etc. For example, a circuit assembly may be provided on and/or supported by an outer top surface of a board level shield. In an exemplary embodiment, an assembly generally includes an electrically conductive structure configured for a first functionality in the electronic device. An electrically nonconductive layer is on at least part of the electrically conductive structure. First electrical component(s) are at least partly on the electrically nonconductive layer and configured to define at least a portion of a circuit assembly for electrical connection with one or more second electrical components of the electronic device. The electrically conductive structure may thus be configured for a second functionality in the electronic device. 1. An assembly suitable for use in an electronic device , the assembly comprising:a board level shield (BLS) having an outer surface;dielectric material along at least a portion of the outer surface of the BLS; andelectrically conductive material along at least a portion of the dielectric material such that the dielectric material is between the electrically conductive material and the outer surface of the BLS, whereby the electrically conductive material is configured to define at least a portion of a circuit assembly for routing signals and/or for electrically connecting with one or more components of the electronic device, and whereby the BLS is multifunctional having a first functionality of providing EMI shielding and grounding and a second functionality of supporting the circuit assembly.2. The assembly of claim 1 , wherein the dielectric material is thermally conductive claim 1 , and wherein the BLS has a third functionality of defining or providing part of a thermally-conductive heat path within the electronic device from a heat ...

CIRCUIT CARD WITH COHERENT INTERCONNECT

Apparatuses and systems associated with expansion card design with a coherent connector to provide for coherent communication are disclosed herein. In embodiments, a circuit card may comprise an integrated circuit (IC), a first connector to couple the IC to a processor of a computer device, the first connector to provide for non-coherent communication between the IC and the processor, and a second connector to couple the IC to the processor, the second connector to provide for coherent communication between the IC and the processor. Other embodiments may be described and/or claimed. 1. A circuit card , comprising:an integrated circuit (IC);a first connector to couple the IC to a processor of a computer device, the first connector to provide for non-coherent communication between the IC and the processor; anda second connector to couple the IC to the processor, the second connector to provide for coherent communication between the IC and the processor.2. The circuit card of claim 1 , wherein the first connector is to allow for implementation of a peripheral component interconnect express (PCIe) bus standard for the non-coherent communication between the IC and the processor.3. The circuit card of claim 1 , wherein the first connector includes a first edge finger located at a side of the circuit card claim 1 , and wherein the second connector includes a second edge finger located at the side of the circuit card.4. The circuit card of claim 3 , wherein the first edge finger is to be received by a first circuit card connector of the computer device and the second edge finger is to be received by a second circuit card connector of the computer device claim 3 , and wherein the first circuit card connector is located adjacent to the second circuit card connector.5. The circuit card of claim 3 , wherein the second edge finger is shorter than the first edge finger.6. The circuit card of claim 1 , further comprising coherency circuitry coupled to the second connector claim 1 ...

Radio frequency coupling and transition structure

A radio frequency transmission structure couples a RF signal between a first and a second radiating elements arranged at a first and a second sides of a first dielectric substrate, respectively. The RF coupling structure comprises first and second coupling structures. Each coupling structure has a hole arranged through the first dielectric substrate, a first electrically conductive layer arranged on a first wall of the hole to electrically connect a first and a second signal terminals, a second electrically conductive layer arranged on a second wall of the hole opposite to the first wall to electrically connect a first and a second reference terminals. The first electrically conductive layer is separated from the second electrically conductive layer. The first and second coupling structures are symmetrically arranged with the first electrically conductive layers closer to each other than the second electrically conductive layers are to each other.

Structure

A structure ( 10 ) includes: a molded object 2 having a through hole ( 1 ); a conduction pattern ( 3 ) electrically connecting two surfaces having respective openings of the through hole ( 1 ), the conductive body ( 3 ) being provided on an inner wall of the through hole ( 1 ); and an elastic body ( 4 ) being filled in the through hole ( 1 ), the elastic body ( 4 ) being made of a substance that is deformed by an external pressure more easily than the molded object ( 2 ).

Display device

A display device may include a main flexible printed circuit including a first alignment mark and electrically connected to a first panel; and a touch flexible printed circuit including a second alignment mark and electrically connected to a second panel that is perpendicular to the first panel, wherein the main flexible printed circuit is electrically connected to the touch flexible printed circuit through a pad region, and the touch flexible printed circuit includes a first overcoat region disposed between the first alignment mark and the second alignment mark.

RIGID-FLEXIBLE CIRCUIT INTERCONNECTS

In an example embodiment, a circuit interconnect includes a first printed circuit board (PCB), a second PCB, a spacer, and an electrically conductive solder joint. The first PCB includes a first electrically conductive pad. The second PCB includes a second electrically conductive pad. The spacer is configured to position the first PCB relative to the second PCB such that a space remains between the first PCB and the second PCB after the first electrically conductive pad and the second electrically conductive pad are conductively connected in a soldering process. The electrically conductive solder joint conductively connects the first electrically conductive pad and the second electrically conductive pad. 1a first printed circuit board (PCB) including a first electrically conductive pad;a second PCB including a second electrically conductive pad;a spacer configured to position the first PCB relative to the second PCB such that a space remains between the first PCB and the second PCB after the first electrically conductive pad and the second electrically conductive pad are conductively connected in a soldering process; andan electrically conductive solder joint conductively connecting the first electrically conductive pad and the second electrically conductive pad.. A circuit interconnect comprising: This patent application is a Continuation of U.S. patent application Ser. No. 14/289,249, titled RIGID-FLEXIBLE CIRCUIT INTERCONNECTS, filed May 28, 2014, which claims priority to U.S. Provisional Application No. 61/828,312, titled RIGID-FLEXIBLE CIRCUIT INTERCONNECTS, filed May 29, 2013, both applications are incorporated herein by reference in their entirety.The embodiments discussed herein relate to interconnects between printed circuit boards (PCBs). More particularly, embodiments may relate to interconnects between rigid PCBs and flexible PCBs in rigid-flex PCBs with fine-pitch bonding.This Summary introduces a selection of concepts in a simplified form that are ...

METHOD OF REDUCING WARPAGE OF AN ORGANIC SUBSTRATE

An organic substrate includes a core layer including organic materials; a first buildup layer on a top surface of the core layer; a second buildup layer on a bottom surface of the core layer; and at least one correction layer formed on at least one part of surfaces of the first buildup layer and the second buildup layer, wherein the correction layer has a thickness which has been calculated using properties of constituent materials including the coefficient of thermal expansion (CTE) and the Young's modulus of the core layer, and CTEs and the Young's modulus of the first and the second buildup layers for reducing warpage of the organic substrate. 1. An organic substrate comprising:a core layer including organic materials;a first buildup layer on a top surface of the core layer;a second buildup layer on a bottom surface of the core layer; andat least one correction layer formed on at least one part of surfaces of the first buildup layer and the second buildup layer,wherein the correction layer has a thickness which has been calculated using properties of constituent materials including the coefficient of thermal expansion (CTE) and the Young's modulus of the core layer, and CTEs and the Young's modulus of the first and the second buildup layers for reducing warpage of the organic substrate.2. The organic substrate according to claim 1 ,wherein the correction layer on the surface of the second buildup layer includes materials with a high CTEs value and the correction layer on the surface of the first buildup layer includes materials with low CTE materials, if the organic substrate being warped towards the front side,wherein the correction layer on the surface of the first buildup layer includes materials with a high CTEs value and the correction layer on the surface of the second buildup layer includes materials with low CTE materials, if the organic substrate being warped towards the back side.3. The organic substrate according to claim 1 ,wherein the correction ...

Gap supporter for printed circuit board, and package including gap supporter for printed circuit board and insulation sheet coupled thereto

The present invention relates to a gap supporter for a printed circuit board, and a package including a gap supporter for a printed circuit board and an insulation sheet coupled thereto. A gap supporter for a printed circuit board includes a fixed body part which has a metal thin-film formed on the surface of the lower end thereof, and is fixed to one surface of the printed circuit board by soldering of the metal thin-film; a clamping groove formed in a groove shape on the fixed body part, and having an insulation sheet inserted and clamped thereto to protect an element on one surface of the printed circuit board; and an anti-separation part formed on the other end of the fixed body part so as to be defined by the clamping groove, so as to fix the insulation sheet and prevent the insulation sheet from being separated.

INTERCONNECTABLE CIRCUIT BOARDS

In some embodiments, an interconnectable circuit board may include one or more of the following features: (a) a first electrically conductive pad located on a top of the circuit board, (b) a plated through hole on the conductive pad which passes through the circuit board, (c) a second electrically conductive pad coupled to the plated through hole; the second conductive pad capable of being electrically connected to a third electrically conductive pad attached to a top of a second interconnectable circuit board, (d) cut marks indicating safe locations for separating the circuit board, and (e) a second cut mark adjacent to the first cut mark where the area between the first and second cut mark can be utilized to make a safe cut through the circuit board. 1. An interconnectable circuit board , comprising:a distal end having a first electrically conductive pad located on a top of the circuit board;a plated through hole on the conductive pad which passes through a conductive layer of the circuit board and an insulative layer of the circuit board;a second electrically conductive pad coupled to the plated through hole; anda proximal end having a third electrically conductive pad attached to the top of the circuit board.2. The circuit board of claim 1 , further comprising alignment marks for use in aligning circuit boards when interconnecting them.3. The circuit board of claim 1 , further comprising cut marks showing locations where the circuit board can be cut.4. The circuit board of claim 1 , further comprising circuit paths electrically coupled to the electrically conductive pads to provide electrical interconnectivity between the circuit board and a second circuit board.5. The circuit board of claim 1 , further comprising a non-conductive solder repelling material on a surface of the circuit board.6. The circuit board of claim 1 , further comprising a fourth conductive pad for electrically receiving electronic components.7. The circuit board of claim 1 , wherein the ...

Wiring substrate

A wiring substrate includes: a connection pad having a first surface; a protective insulation layer formed on the first surface of the connection pad and having an opening portion therein, wherein a portion of the first surface of the connection pad is exposed from the opening portion; a metal layer having a lower surface facing the first surface of the connection pad and an upper surface opposite to the lower surface and formed on the first surface of the connection pad which is exposed from the opening portion, the metal layer including a raised portion that extends upward from the upper surface of the metal layer in a peripheral portion thereof; and a bump electrode formed on the upper surface of the metal layer.

Touch sensing unit and display device

A display device including a first film, a flexible printed circuit, and a second film. The first film includes a substrate and a non-adhesive pattern, where the substrate includes a first area and a second area adjacent to the first area, and the non-adhesive pattern is formed on at least a portion of the second area. The flexible printed circuit is disposed on the first area of the first film. The second film is disposed on the flexible printed circuit and the first film.

Multilayer board and electronic device

A multilayer board includes a layered body including insulating base material layers that are laminated, and first and second signal lines, a first ground conductor including a first opening, a second ground conductor, a third ground conductor, and an interlayer connecting conductor. The first signal line overlaps the first opening when seen in a layering direction. The second signal line is provided on a layer different from a layer including the first signal line and includes a portion extending side by side with the first signal line when seen in the Z-axis direction. The first, second, and third ground conductors are connected by the interlayer connecting conductor. The third ground conductor is disposed on a layer including the first signal line or a layer positioned between the first signal line and the second signal line.

FLEXIBLE CIRCUIT BOARD INTERCONNECTION AND METHODS

Embodiments of the invention include flexible circuit board interconnections and methods regarding the same. In an embodiment, the invention includes a method of connecting a plurality of flexible circuit boards together comprising the steps applying a solder composition between an upper surface of a first flexible circuit board and a lower surface of a second flexible circuit board; holding the upper surface of the first flexible circuit board and the lower surface of the second flexible circuit board together; and reflowing the solder composition with a heat source to bond the first flexible circuit board and the second flexible circuit board together to form a flexible circuit board strip having a length longer than either of the first flexible circuit board or second flexible circuit board separately. In an embodiment the invention includes a circuit board clamp for holding flexible circuit boards together, the clamp including a u-shaped fastener; a spring tension arm connected to the u-shaped fastener; and an attachment mechanism connected to the spring tension arm. Other embodiments are also included herein. 1. A method of connecting a plurality of flexible circuit boards together comprising the steps of:applying a solder composition between an upper surface of a first flexible circuit board and a lower surface of a second flexible circuit board;holding the upper surface of the first flexible circuit board and the lower surface of the second flexible circuit board together; andreflowing the solder composition with a heat source to bond the first flexible circuit board and the second flexible circuit board together to form a flexible circuit board strip having a length longer than either of the first flexible circuit board or second flexible circuit board separately.2. The method of claim 1 , further comprising applying a solder composition between an upper surface of the second flexible circuit board and a lower surface of a third flexible circuit board; and ...

VEHICLE ACCESSORY CONTROL ARRANGEMENT

A vehicle accessory control component includes a first circuit board substrate and a second circuit board substrate. The first circuit board substrate has a plurality of circuit elements and an overall perimeter shape including an outer edge profile and a plurality of first deviations along the outer edge profile. The second circuit board substrate has a plurality of circuit elements an outer edge profile and a plurality of second deviations along the outer edge profile, at least one of the second deviations being different than the first deviations. The first circuit board substrate and the second circuit board substrate are arranged in a plane and selectively movable relative to each other to form the overall perimeter shape of the substrate. The outer edge profile of the first and second circuit board substrates are received in a housing having a correspondingly shaped perimeter that generally conforms to the outer edge profile. 1. A vehicle accessory control component comprising:a substrate having an overall perimeter shape including a first circuit board substrate and a second circuit board substrate;the first circuit board substrate having a plurality of circuit elements supported thereon and including an outer edge profile and a plurality of first deviations along the outer edge profile;the second circuit board substrate having a plurality of circuit elements supported thereon and including an outer edge profile and a plurality of second deviations along the outer edge profile, at least one of the second deviations being different than the first deviations;wherein the first circuit board substrate and the second circuit board substrate are arranged in a plane and selectively movable relative to each other to form the overall perimeter shape of the substrate;wherein the outer edge profile of the first and second circuit board substrates are received in a housing having a correspondingly shaped perimeter that generally conforms to the outer edge profile;wherein ...

SHIELDED PACKAGE ASSEMBLIES WITH INTEGRATED CAPACITOR

Package assemblies including a die stack and related methods of use. The package assembly includes a substrate with a first surface, a second surface, and a third surface bordering a through-hole extending from the first surface to the second surface. The assembly further includes a die stack, a conductive layer, and a lid. The die stack includes a chip positioned inside the through-hole in the substrate. A section of the conductive layer is disposed on the third surface of the substrate. A portion of the lid is disposed between the first chip and the section of the conductive layer. The conductive layer is configured to be coupled with power, and the lid is configured to be coupled with ground. The portion of the lid may act as a first plate of a capacitor, and the section of the conductive layer may act as a second plate of the capacitor. 1. A method for electrostatically storing energy in a package assembly including a chip stack and a lid , the method comprising:storing a first charge on a first plate of a capacitor provided by the lid coupled with the chip stack; andstoring a second charge on a second plate of the capacitor provided by a section of a conductive layer on a first substrate of the package assembly that supports the chip stack.2. The method of claim 1 , further comprising: shielding electromagnetic interference radiation emitted from the chip stack with the lid.3. The method of claim 1 , further comprising: dissipating heat generated by the chip stack through the lid to a heat sink.4. The method of claim 1 , wherein the storing the first charge on the first plate of the capacitor provided by the lid coupled with the chip stack further comprises:grounding the lid to a ground plane in a second substrate.5. The method of claim 1 , wherein the storing the second charge on the second plate of the capacitor provided by the section of the conductive layer on the first substrate supporting the chip stack comprises:powering the section of the conductive ...

Lighting devices

Lighting devices for a vehicle arc disclosed that can include a light emitting diode and control circuitry for the light emitting diode. Also disclosed are circuits for a light emitting diode. Additionally, a method of forming a lighting device is disclosed. The lighting device, circuits, and method can be used, for example, to illuminate the interior of a vehicle.

Vehicle accessory control arrangement

An illustrative inventory of vehicle accessory control components includes a plurality of first circuit boards and a plurality of second circuit boards. The first circuit boards each have a substrate with a plurality of circuit elements supported on the substrate. The first circuit board substrates have an overall perimeter shape including an outer edge profile and a plurality of first deviations from the outer edge profile. The second circuit boards each have a substrate with a plurality of circuit elements supported on them. The second circuit board substrates have the overall perimeter shape including the same outer edge profile as the first circuit board substrates. The second circuit board substrates include a plurality of second deviations from the outer edge profile. At least one portion of the second deviations is different than the first deviations of the first circuit boards.

Electronics assemblies for downhole use

Methods, systems, devices, and products for constructing a downhole tool electronics module. Methods may include creating a circuit board by metallizing at least part of a first surface on a first side of a substrate to define at least one metallized area on the first surface, wherein the substrate comprises a ceramic material and includes: the first side, including at least (i) the first surface, and (ii) an elevated surface elevated from the first surface, and a second side opposite the first side; flattening at least partially the elevated surface to a predefined first flatness to create a mounting portion by removing material from the elevated surface; attaching an electronics component to the first surface; and mounting the circuit board on an electronics carrier by adhering at least part of the mounting portion to a mounting surface on the electronics carrier. Flattening at least partially the elevated surface to the predefined first flatness may be carried out by removing the material by areal grinding.

ELECTRICAL UNIT

An electrical unit includes a thermally conductive housing, an electrically insulating frame disposed in the thermally conductive housing, a plurality of bus bars disposed at least partially between a base wall of the thermally conductive housing and a first side of the electrically insulating frame, and a plurality of electrical components connected to a second side of the electrically insulating frame. At least one bus bar of the plurality of bus bars may be connected to the electrically insulating frame via one or more plastic rivets. Thermally conductive material may be disposed between at least one bus bar of the plurality of bus bars and a wall of the housing. 1. An electrical unit , comprising:a thermally conductive housing;an electrically insulating frame disposed in the thermally conductive housing, the electrically insulating frame including a first side and a second side;a plurality of bus bars disposed at least partially between a base wall of the thermally conductive housing and the second side of the electrically insulating frame; anda plurality of electrical components connected to the first side of the electrically insulating frame.2. The electrical unit of claim 1 , wherein at least one bus bar of the plurality of bus bars is connected to the electrically insulating frame via one or more plastic rivets integrally formed with the electrically insulating frame.3. The electrical unit of claim 1 , wherein thermally conductive material is disposed between and in contact with at least one bus bar of the plurality of bus bars and a base wall of the thermally conductive housing.4. The electrical unit of claim 3 , wherein the thermally conductive material is thermally conductive and electrically isolating claim 3 , includes adhesive properties claim 3 , and is applied to substantially an entire bottom surface of each bus bar of the plurality of bus bars.5. The electrical unit of claim 1 , wherein the electrically insulating frame includes an outer wall ...

Enhanced liquid detection mechanisms for circuit cards

Enhanced short circuit damage protection by using circuit card and electronic assembly features to steer liquids, including water, onto detector arrays. In a typical implementation, a circuit card has detection elements in one or more places implemented as artwork on an outer circuit layer. The finished circuit card assembly is conformal coated with masked areas over detection artwork. When the masking is removed, channels are left behind for liquids to flow toward and pool over detection artwork. In other implementations through shaping, additive or subtractive manufacturing processes, cavities are left behind for liquids to collect over detection artwork.

Method for manufacturing a printed circuit board, printed circuit board and rear view device

A method of making a printed circuit board and a printed circuit board including a plurality of plastic substrate parts having one or more first substrate parts each having at least one coupling means, and one or more second substrate parts each having at least one receiving means to receive the coupling mean. At least one of the plurality of plastic substrate parts is formed with a further structural element, and at least two of the plurality of plastic substrate parts are connected to each other through the at least one coupling means and the at least one receiving means. The connected substrate parts include a circuit.

Welded High-Density Low-Profile Interconnect System

An electronic device may have printed circuits to which electrical components are mounted. The printed circuits may have metal traces that form signal lines and contact pads. Vias or other conductive structures may he used in interconnecting the signal lines to the contact pads. The contact pads may have elongated shapes or other shapes and may he formed in arrays on the printed circuits. Laser welds or other electrical connections may be used to join contact pads on a first printed circuit to respective contact pads on a second printed circuit. The laser welds may form part of a rectangular region of welds or may form part of a non-rectangular region of welds such as a region with a curved edge. Alignment marks may be used in aligning the contact pads. 1. Apparatus , comprising:a first primed circuit having a first metal trace;a second printed circuit having a second metal trace; anda laser weld that couples the first metal trace to the second metal trace.2. The apparatus defined in wherein the first metal trace has a first signal line and has a first contact and wherein the second metal trace has a second signal line and a second contact claim 1 , and wherein the first and second contacts overlap and are welded together with the laser weld.3. The apparatus defined in wherein the first contact is elongated and extends along a first dimension and wherein the second contact is elongated and extends along a second dimension that is different than the first dimension.4. The apparatus defined in wherein the first and second dimensions are orthogonal to each other.5. The apparatus defined claim 3 , in wherein the first and second dimensions are oriented at an angle of 45° with respect to each other.6. The apparatus defined in wherein the first contact is one of a first at of contacts on the first printed circuit claim 2 , wherein the second contact is one of a second array of contacts on the second printed circuit claim 2 , and wherein the laser weld is one of an array ...

Multilayer electronic structure with integral faraday shielding

A multilayer electronic support structure including at least one metallic component encapsulated in a dielectric material, and comprising at least one faraday barrier to shield the at least one metallic component from interference from external electromagnetic fields and to prevent electromagnetic emission from the metallic component.

RESIN MULTILAYER SUBSTRATE AND AN ELECTRONIC DEVICE AND A JOINT STRUCTURE OF A RESIN MULTILAYER SUBSTRATE

A resin multilayer substrate includes a substrate main body including first, second, and third wiring portions connected to one another by a connecting portion. First, second and third external connection terminals are respectively included in the first, second and third wiring portions. The first external connection terminal includes a conductor exposed at a surface of the substrate main body. The second and third external connection terminals include connectors mounted on conductors on the surface of the substrate main body. An auxiliary mounting conductor is disposed between the first external connection terminal and the second and third external connection terminals on the surface of the substrate main body. 1. A resin multilayer substrate comprising:a substrate main body including a first wiring portion, a second wiring portion, and a third wiring portion that are connected to one another by a connecting portion, and a plurality of resin layers laminated together;a signal conductor provided in the substrate main body so as to extend over the first wiring portion, the second wiring portion, and the third wiring portion;a first external connection terminal provided in the first wiring portion and connected to the signal conductor;a second external connection terminal provided in the second wiring portion and connected to the signal conductor; anda third external connection terminal provided in the third wiring portion and connected to the signal conductor; whereinat least one of the first external connection terminal, the second external connection terminal, and the third external connection terminal is defined by a connector that is mounted on a conductor on a surface of the substrate main body, and at least another one of the first external connection terminal, the second external connection terminal, and the third external connection terminal is defined by a conductor on the surface of the substrate main body; andan auxiliary mounting conductor is disposed ...

Semiconductor module

A semiconductor module includes a circuit substrate, a first semiconductor device substrate that is mounted on the circuit substrate and that processes an input signal of a first frequency band, a second semiconductor device substrate that is mounted on the circuit substrate and that processes an input signal of a second frequency band, and a control device substrate that is arranged between the first and second semiconductor device substrates and that controls the first and second semiconductor device substrates.

METHOD OF PROVIDING POWER INPUT TO A FLEXIBLE PRINTED CIRCUIT AND A FLEXIBLE PRINTED CIRCUIT HAVING POWER INPUT IN ACCORDANCE WITH THE METHOD

A method of providing power input to a flexible printed circuit. The method involves the step of bisecting a flexible printed circuit into a first conductive area adapted for power input and a second conductive area adapted for ground connection. In accordance with this teaching, power input is provided to electrical components attached to the flexible printed circuit via first conductive area and second conductive area, rather than through individual control lines. 1. A method of providing power input to a flexible printed circuit , comprising:bisecting a flexible printed circuit into a first conductive area adapted for power input and a second conductive area adapted for ground connection, such that power input is provided to electrical components attached to the flexible printed circuit via first conductive area and second conductive area.2. The method of claim 1 , wherein the flexible printed circuit is bisected by communication lines between the electrical components.3. The method of claim 1 , wherein the electrical components are attached by conductive adhesive.4. The method of claim 2 , wherein the electrical components are light emitting diodes (LEDs).5. The method of claim 4 , wherein the LEDs have integrated controllers that use a serial communications protocol that facilitates daisy chaining.6. A flexible printed circuit claim 4 , comprising:a flexible printed circuit substrate bisected by communication lines between electrical components into a first conductive area adapted for power input and a second conductive area adapted for ground connection; andelectrical components attached to the substrate along the communication lines and connected to the first conductive area and the second conductive area with power input provided to the electrical components via first conductive area and second conductive area.7. flexible printed circuit of claim 6 , wherein the electrical components are light emitting diodes (LEDs).8. The flexible printed circuits of claim ...

Traceability of Subsequent Layer Structure Manufacturing of Main Body for Component Carriers by means of Laterally and Verticially Displaced Information Carrying Structures

A component carrier related body which includes a stack with a plurality of electrically conductive and/or electrically insulating layer structures, and at least two information carrying structures formed vertically displaced on at least two different of the layer structures, wherein at least two of the at least two information carrying structures are laterally displaced in a plan view on the stack. 1. A component carrier related body , comprising:a stack comprising a plurality of electrically conductive and/or electrically insulating layer structures;at least two information carrying structures formed vertically displaced on at least two different of the layer structures;wherein at least two of the at least two information carrying structures are laterally displaced in a plan view on the stack.2. The component carrier related body according to claim 1 , comprising at least one of the following features;wherein the at least two of the at least two information carrying structures are laterally displaced without overlap in a plan view on the stack;wherein the at least two of the at least two information carrying structures are laterally displaced in the plan view on the stack for enabling separate reading, in particular optical reading, of the at least two information carrying structures;wherein the at least two laterally displaced information carrying structures are vertically adjoining ones of the information carrying structures;wherein each of the at least two information carrying structures includes at least one information element from a group consisting of a link to at least part of a database data set related to the component carrier related body, information indicative of a manufacturing history of the component carrier related body or a layer structure assigned to a respective one of the information carrying structures, a lot number to which the component carrier related body belongs, a panel sequence number to which the component carrier related body belongs ...

SHIELDED PACKAGE ASSEMBLIES WITH INTEGRATED CAPACITOR

Package assemblies including a die stack and related methods of use. The package assembly includes a substrate with a first surface, a second surface, and a third surface bordering a through-hole extending from the first surface to the second surface. The assembly further includes a die stack, a conductive layer, and a lid. The die stack includes a chip positioned inside the through-hole in the substrate. A section of the conductive layer is disposed on the third surface of the substrate. A portion of the lid is disposed between the first chip and the section of the conductive layer. The conductive layer is configured to be coupled with power, and the lid is configured to be coupled with ground. The portion of the lid may act as a first plate of a capacitor, and the section of the conductive layer may act as a second plate of the capacitor. 1. A method for electrostatically storing energy in a package assembly including a chip stack and a lid , the method comprising:storing a first charge on a first plate of a capacitor provided by a flange of the lid that is coupled with the chip stack; andstoring a second charge on a second plate of the capacitor provided by a section of a conductive layer located along a sidewall of a first substrate of the package assembly that supports and laterally surrounds the chip stack, wherein the flange of the first plate and the second plate are laterally separated by a gap composed of dielectric material having a permittivity, and the first substrate is a laminated substrate containing a through-hole in which at least a portion of the chip stack and the lid and flange are located.2. The method of claim 1 , wherein the conductive layer is ring-shaped.3. The method of claim 1 , further comprising a solder ball on the conductive layer of the first substrate.4. The method of claim 1 , wherein the lid is cup shaped.5. The method of claim 1 , wherein the dielectric material that provides the gap is air.6. The method of claim 1 , wherein the ...

Pattern manufacturing apparatus, pattern manufacturing method, and pattern manufacturing program

A pattern forming photo-curing layer is heated, thereby enabling quick shaping. A pattern manufacturing apparatus ( 100 ) includes a controller ( 101 ), a laser projector ( 102 ), and a heater ( 103 ). The controller ( 101 ) controls the laser projector ( 102 ) to form a pattern on a pattern forming sheet ( 130 ) placed on a stage ( 140 ). The laser projector ( 102 ) includes an optical engine ( 121 ), and the controller ( 101 ) controls the laser projector ( 102 ) to irradiate the pattern forming sheet ( 130 ) with a light beam from the optical engine ( 121 ). The heater ( 103 ) heats the pattern forming sheet ( 130 ).

SOLDER MASK VOID REGIONS FOR PRINTED CIRCUIT BOARDS

A printed circuit board having a substrate layer, at least one electrically conductive trace disposed on the substrate layer, and a solder mask layer disposed over the substrate layer and the electrically conductive trace, wherein the solder mask later includes a void region over at least a portion of the electrically conductive trace. Also, a method of optimizing printed circuit board designing including selecting printed circuit board data comprising at least a solder mask layer area, varying the solder mask layer area, determining an insertion loss value for each varied solder mask layer area, comparing the insertion loss values for each varied solder mask layer area, and selecting a solder mask layer area based on the comparing. 1. A printed circuit board comprising:a substrate layer;at least one electrically conductive trace disposed on the substrate layer; anda solder mask layer disposed over the substrate layer and the electrically conductive trace, wherein the solder mask layer includes a void region over at least a portion of the electrically conductive trace.2. The printed circuit board of claim 1 , wherein the void region comprises more than one percent of the total area of the solder mask layer.3. The printed circuit board of claim 1 , wherein the void region comprises between five percent and twenty percent of the total area of the solder mask layer.4. The printed circuit board of claim 1 , wherein the void region comprises between twenty percent and fifty percent of the total area of the solder mask layer.5. The printed circuit board of claim 1 , wherein the printed circuit board includes a void ratio equal to or greater than 0.5:1.6. The printed circuit board of claim 1 , wherein the solder mask layer is disposed on a basal side of the printed circuit board.7. The printed circuit board of claim 1 , wherein the void region comprises a plurality of individual void regions separated by at least one solder mask barrier.8. A method of optimizing printed ...

Interposer For Printed Circuit Boards

A system includes a top printed circuit (PCB) including an array of contact pads, a bottom PCB including an array of contact pads, at least one interposer positioned between the top and bottom PCBs, including: an array of top connectors configured to contact the array of contact pads of the top PCB; an array of bottom connectors configured to contact the array of contact pads of the bottom PCB; and interconnections configured to electrically connect the top connectors and the bottom connectors, at least one spacer element positioned between the top PCB and the bottom PCB and configured to contribute to maintaining a specified distance between the top PCB and the bottom PCB; and at least one fastener of the top PCB and the bottom PCB. The system further includes fasteners configured to press the top PCB, the interposer, the bottom PCB, and the spacer layer together.

3D FLEX SOLDERING

In some designs, getting a flexible circuit (flex) to assume a bent state can be helpful in efficiently routing electrically conductive pathways. One efficient way to implement soldering of flexes in a bent state during a reflow operation is to manipulate paneling that hold batches of the flexes to reliably maintain a suitable bend in those flexes. In some embodiments, a flex can be surface mounted to a portion or the whole of an electric device during a reflow operation during which the bent state is maintained by paneling that is at least partially attached to a periphery of the flex. Another solution is to utilize vacuum or hot glue fixtures to maintain a bend in the flex during surface mounting and reflow operations. 120.-. (canceled)21. A mobile device , comprising:a housing that defines an internal volume;an electrical component disposed within the internal volume, the electrical component comprising a protruding feature positioned between a first lead and a second lead; a first surface, comprising a first region soldered to the first lead, a second region soldered to the second lead and a central region disposed between the first and second regions that has a curved geometry that accommodates the protruding feature of the electrical component, and', 'a plurality of surface mounted components soldered to a second surface of the flexible circuit, the second surface being opposite the first surface., 'a flexible circuit, comprising22. The mobile device of claim 21 , wherein the electrical component is an audio jack comprising a monolithic audio jack housing comprising the first region and the second region.23. The mobile device of claim 21 , wherein the electrical component is an audio jack claim 21 , and wherein the audio jack comprises:a first modular connector component comprising the first lead;a second modular connector component comprising the second lead; anda support structure that interlocks with the first and second modular components, a central ...

Composite wiring board and mounting structure of the same

A composite wiring board includes a first wiring board having an opening for housing an electronic component, and including a plurality of first connection pads on an upper surface and a plurality of second connection pads on a lower surface, and a second wiring board having the electronic component mounted on a lower surface, including a third connection pad provided on the lower surface on an outer peripheral side and bonded to the first connection pad through a solder, and disposed on the first wiring board so as to cover the opening, in which a grounding inner wall conductor layer is deposited on an inner wall of the opening around the electronic component, and a grounding conductor layer is deposited on the lower surface of the second wiring board and connected to the inner wall conductor layer through a solder.

CONFORMAL ELECTRONICS INCLUDING NESTED SERPENTINE INTERCONNECTS

An example stretchable device is described that includes electrical contacts and an interconnect coupling the electrical contacts. The interconnect has a meander-shaped configuration that includes at least one nested serpentine-shaped feature. The interconnect can be conductive or non-conductive. The meander-shaped configuration can be a serpentine structure, providing a serpentine-in-serpentine configuration. 125-. (canceled)26. A stretchable electrical device , comprising:two electrical contacts; andan electrical interconnect electrically coupling the two electrical contacts;wherein the electrical interconnect has a meander-shaped base configuration comprising a plurality of nested serpentine-shaped features arranged along the electrical interconnect such that each of the plurality of nested serpentine-shaped features is at least partially nested within an adjacent one of the plurality of nested serpentine-shaped features.27. The stretchable electrical device of claim 26 , wherein the electrical interconnect comprises a single length of conductive material and couples only the two electrical contacts.28. The stretchable electrical device of claim 26 , wherein the meander-shaped base configured has a base amplitude and a base wavelength claim 26 , and wherein each of the plurality of nested serpentine-shaped features has (i) a nested amplitude that is different than the base amplitude claim 26 , and (ii) a nested wavelength that is different than the base wavelength.29. The stretchable electrical device of claim 28 , wherein the nested amplitude is greater than the base amplitude and the nested wavelength is greater than the base wavelength.30. The stretchable electrical device of claim 28 , wherein the nested amplitude is less than the base amplitude and the nested wavelength is less than the base wavelength.31. The stretchable electrical device of claim 26 , further comprising at least one device component in communication with at least one of the two electrical ...

Flexible printed circuit board and electronic device

A flexible printed circuit board having a copper foil character with good visibility and without copper foil pattern peeling. The flexible printed circuit board has a base material having optical transparency, a wiring pattern formed on one surface of the base material; a first opaque cover lay film covering a surface of the wiring pattern, a character formed on the other surface of the base material; and a second opaque cover lay film covering a surface of the character. The first opaque cover lay film has an opening portion is formed therein, and the character is formed so as to be visually recognizable through the opening portion.

Manufacturing method for substrate

A method for manufacturing a substrate includes manufacturing a substrate with an identifying mark having a plurality of elements, the substrate having a laminated construction including a plurality of resin insulating layers. The method includes the steps of: forming a first element of the identifying mark by irradiating the substrate with a laser to create a first plurality of projections in parallel at equal intervals; and forming another element of the identifying mark by irradiating the substrate with a laser to create a second plurality of projections in parallel at equal intervals that do not overlap the first plurality of projections.

Method of final defect inspection

Disclosed is a method of final defect inspection, including preparing a final defect inspection apparatus which includes a host device, a microscope, a bar code scanner, a support tool and a signal transceiver, using the host device to calibrate an original point in an outline of the circuit board based on a plurality of original mark positions generated by an electromagnetic pen, using the electromagnetic pen to mark each defect position on the inspection region on the circuit board where any defect is found through the microscope, using the signal transceiver to receive and transmit each defect position to the host device, and using the host device to calculate the coordinate of a scrap region based on a relative position between the original point and each defect position so as to generate a shipment file.

Injection molded product and method of manufacturing the same

An injection molded product in which an electrical connection between a contact pin and an electrode pattern is sufficient, and a method of manufacturing the same, are provided. The injection molded product comprises: a base film; an electrode pattern, which is formed on the base film; an electrically conductive adhesive, which is formed on an upper surface of the electrode pattern; a contact pin, which contacts the electrically conductive adhesive, is electrically connected to the electrode pattern via the electrically conductive adhesive, and is electrically conductive; and a molded resin, which is injection molded along the base film such that the electrically conductive adhesive and part of the contact pin are embedded.

Systems and methods for providing electromagnetic interference (emi) shielding between inductors of a radio frequency (rf) module

Electrically-conductive wires are used to construct an EMI shield between inductors of an RF module that prevents, or at least reduces, EMI crosstalk between the inductors while maintaining high Q factors for the inductors. The EMI shield comprises at least a first set of electrically-conductive wires that at least partially surrounds and extends over at least a first inductor of a pair of inductors. Adjacent wires of the first set are spaced apart from one another by a predetermined distance selected to ensure that the EMI shield attenuates a frequency or frequency range of interest. First and second ends of each of the wires are connected to an electrical ground structure. A length of each wire in between the first and second ends of the respective wire extends above the first inductor and is spaced apart from the first inductor so as not to be in contact with the first inductor.

CONTACT ELEMENT AND CONTACT STRUCTURE FOR ELECTRONIC DEVICE

In accordance with an aspect of the present disclosure, a contact structure for an electronic device may include a printed circuit board (PCB) including at least one hole vertically formed through the PCB, a housing (e.g., a mechanical part) on which the PCB is seated, and a contact element, at least part of which is brought into contact with the housing disposed on a side of the hole of the PCB and below the same. The contact element may include a contact part soldered on a peripheral portion around the hole, and a protrusion passing through the hole and making contact with the housing disposed below the PCB. 1. A contact structure for an electronic device , the contact structure comprising:a printed circuit board (PCB) comprising a hole;a housing disposed on a side of the PCB and facing the hole, the PCB being seated on the housing; anda contact element, at least a portion of which contacts the housing, a contact portion soldered onto a peripheral portion of the PCB, the peripheral portion being disposed around the hole; and', 'a protrusion passing through the hole and contacting the housing., 'wherein the contact element comprises2. The contact structure of claim 1 ,wherein the PCB further comprises a plurality of pads formed on a ground of the PCB, andwherein the contact portion is configured to be soldered onto the plurality of pads.3. The contact structure of claim 1 , wherein the contact portion comprises:a first region having a specified polygonal shape and a plurality of second regions extending from the first region, the plurality of second regions being spaced apart from one another to abut the first region,wherein the protrusion extends from a coupling portion where the first region and the plurality of second regions join together, in a direction away from the contact portion.4. The contact structure of claim 2 , wherein the protrusion has a length exceeding a thickness of the PCB.5. The contact structure of claim 3 , wherein the hole has a first width ...

PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING THE SAME

A printed circuit board and an electronic device including the printed circuit board are provided. The electronic device includes a housing, and a printed circuit board located in an inner space of the housing, wherein the printed circuit board includes a component disposition area in which at least one component is disposed, a pre-forming area in which a plastic deformation material is laminated as a polymer material for inducing plastic deformation on a part of the printed circuit board, and a flexible area having flexible characteristics and on which the plastic deformation material is not laminated. 1. An electronic device comprising:a housing; anda printed circuit board disposed at an inner space of the housing, a component disposition area on which at least one component is disposed,', 'a pre-forming area on which a plastic deformation material is laminated as a polymer material for inducing plastic deformation on a part of the printed circuit board, and', 'a flexible area on which the plastic deformation material is not laminated, the flexible area comprising flexible characteristics., 'wherein the printed circuit board comprises2. The electronic device of claim 1 , wherein the flexible area is disposed adjacent to a connector disposition area on which a connector of the printed circuit board is disposed.3. The electronic device of claim 1 ,wherein the plastic deformation material causes an elastic deformation to occur in a region in which an elongation is less than 10%, andwherein the plastic deformation material causes the plastic deformation to occur in a region in which the elongation is within 10% to 80%.4. The electronic device of claim 3 , wherein the plastic deformation material has characteristics in that a modulus value is equal to or smaller than 15 MPa in the region in which the elongation is within 10% to 80%.5. The electronic device of claim 3 , wherein the plastic deformation material has characteristics in that a break occurs in a region in ...

Surface-Mount Waveguide for Vertical Transitions of a Printed Circuit Board

Waveguide assemblies are described that utilize a surface-mount waveguide for vertical transitions of a printed circuit board (PCB). The surface-mount waveguide enables low transmission-loss (e.g., increased return-loss bandwidth) by utilizing a waveguide cavity positioned over a plated slot to efficiently transfer electromagnetic energy from one side of the PCB to another side. The waveguide cavity is designed to excite two resonant peaks of the EM energy to reduce a return-loss of power and increase power delivered to an antenna while supporting a high bandwidth of EM energy. Furthermore, the surface-mount waveguide does not require precise fabrication often required for vertical transitions, allowing the surface-mount waveguide to be compatible with low-cost PCB materials (e.g., hybrid PCB stack-ups). 1. A waveguide assembly comprising: at least one PCB layer that includes a first surface and a second surface positioned opposite and in parallel with the first surface;', 'a plated slot configured to channel an electromagnetic (EM) energy from a planar dimension in parallel with the first surface to a vertical dimension that is orthogonal to the planar dimension, the plated slot comprising an opening surrounded by a conductive material to enable electrical connections between the first surface and the second surface, the opening configured to transfer the EM energy between the first surface and the second surface; and, 'a printed circuit board (PCB) comprisinga waveguide cavity mounted directly on the first surface and positioned over the plated slot, the waveguide cavity configured to perform impedance matching of the EM energy while guiding the EM energy from the first surface to the second surface via the plated slot.2. The waveguide assembly of claim 1 , further comprising at least one antenna mounted on the second surface of the PCB claim 1 , wherein the waveguide assembly is configured to:direct the EM energy from the second surface of the PCB to the at least ...

Light emitting mirror bezel

A multi-function rearview device for use with a vehicle includes a housing configured to be attached to the vehicle and to be moveable relative to the vehicle, a rearview element including at least one of a reflective element, a camera and a display element, a bezel formed at an outer portion of the multi-function rearview device surrounding the rearview element, with the rearview element being attached to at least one of the bezel and the housing, one or more light assemblies providing at least one or more light function indications, including a Human Machine Interface (HMI), and at least one sensor, the sensor controlling the one or more light assemblies or the display element.

Electrical connector and method for producing same

Provided is an electric connector, which is to be arranged between a connection terminal of a first device and a connection terminal of a second device, and is configured to electrically connect the connection terminal of the first device and the connection terminal of the second device to each other, the electric connector including a composite, the composite including: an elastic body having a plurality of through holes that penetrate therethrough in a thickness direction; and a conductive member, which is joined to an inner wall of each of the through holes, and is configured to electrically connect the connection terminal of the first device and the connection terminal of the second device to each other, wherein at least a part of a vicinity of at least one of distal ends of the conductive member is hollow.

Circuit board and electronic device

An electronic device includes an electronic component including a plurality of terminals and a circuit board on which the electronic component is mounted. The circuit board includes a board body, a plurality of electrode pads arranged on the board body, each of the electrode pads being connected to each of the terminals by solder, a first solder resist formed on the board body and having a plurality of first openings, each of the first openings accommodating each of the electrode pads, and a second solder resist formed on the first solder resist and having a plurality of second openings, each of the second openings being larger than each of the first openings and communicating with each of the first openings.

METHOD FOR POSITIONING AT LEAST ONE ELECTRONIC COMPONENT ON A CIRCUIT BOARD

A method for positioning at least one electronic component () on a circuit board () provided for installation in a vehicle headlamp, wherein the circuit board () comprises at least one position mark and the at least one electronic component () is positioned relative to the at least one position mark on the circuit board (), wherein the at least one position mark is detected optically and is used for positioning, wherein the at least one position mark used is at least one alignment mark (″) of the circuit board () which, in the vehicle headlamp, when the circuit board () is installed, interacts mechanically with a positioning means () of the vehicle headlamp that is complementary to the alignment mark (′). 131. A method for positioning at least one electronic component () on a circuit board () intended for installation in a vehicle headlamp , the method comprising:{'b': '1', 'providing the circuit board () which comprises at least one position mark;'}optically detecting the at least one position mark; and{'b': 3', '1, 'using the optically detected at least one position mark to position the at least one electronic component () on the circuit board (),'}{'b': 5', '6', '7', '8', '8', '8', '1', '1', '9', '15', '5', '6', '7', '8', '8', '8, 'wherein the at least one position mark used is at least one alignment mark (, , , , ′, ″) of the circuit board () which, in the vehicle headlamp, when the circuit board () is installed, interacts mechanically with a positioning means (, ) of the vehicle headlamp that is complementary to the alignment mark (, , , , ′, ′).'}256788813. The method according to claim 1 , wherein at least two alignment marks ( claim 1 , claim 1 , claim 1 , claim 1 , ′ claim 1 , ″) of the circuit board () are used for the positioning of the at least one electronic component ().35678881. The method according to claim 2 , wherein the at least two alignment marks ( claim 2 , claim 2 , claim 2 , claim 2 , ′ claim 2 , ″) are disposed on opposite edges of the ...