Solder applying device for restricted areas of PCB's - has pivotable lever squeezing press to provide solder in cooperation with screen printing masks

A device for applying solder paste to restricted areas of PCB's on which components are already mounted by screen printing methods. The device includes a transporting and holding device (1) for the PCB's (2). The device also has a lifting and lowering device (3) which is movable vertically in relation to the holding device (1) and has a motor (4). A screen circuit printing device (5) is attached. This includes a base-plate (6) and a stencil arm (7) with stencil printing films (8), attached to the base (6). A pivotable lever (9) has a spring-loaded press (10) which cooperates with the films (8). The printing device (5) also has a pivot driver (11) for the lever (9) and a contact part (12) with a solder cartridge (13) and a flexible lead (14) to the press (10). USE/ADVANTAGE - E.g. for mounting components on PCB's in SMD technology. Enables solder to be deposited accurately to particular areas of the PCB in a simple manner and at a speed acceptable for production line manufacture.

Method and device for calibrating production systems for thick-film circuit patterns

A calibration method and a calibration device are created for a system for producing a thick-film circuit pattern, in which the pattern-producing system is automatically calibrated in such a way that lines of a desired thickness can be produced with a specific paste. ...

Vorrichtung zum Aufbringen von Kunstharz und Vorrichtung zum Erzeugen von Daten zum Aufbringen von Kunstharz

Es ist eine Aufgabe der Erfindung, eine Vorrichtung zum Aufbringen von Kunstharz zu schaffen, die in der Lage ist, die Arbeit zum Aufbringen von Kunstharz zur Kunstharz-Verstärkung effizient auszuführen, bei der ein Eckenteil eines elektronischen Bauelementes als Ziel festgelegt ist, und eine Vorrichtung zum Erzeugen von Daten zum Aufbringen von Kunstharz zu schaffen. In der Vorrichtung zum linearen Aufbringen eines Kunstharzes zur Verstärkung entlang einer Außenkante des elektronischen Bauelementes in einem Trägerkörper zur Montage elektronischer Bauelemente, in dem das elektronische Bauelement auf ein Substrat montiert ist, werden Informationen über die Bauelement-Position, die eine Position des elektronischen Bauelementes im Trägerkörper zur Montage elektronischer Bauelemente anzeigen, Bauelemente-Informationen einschließlich einer Seitenabmessung des elektronischen Bauelementes und ein Grundmuster mit einer Aufbringungs-Form zum Ausbilden eines eckenverstärkten Teils, der im Eckenteil ...

Verfahren zum flussmittelfreien Beschichten und Löten.

Füllanlage

Füllanlage zum Füllen von in einer Platte, insbesondere Leiterplatte, ausgebildeten Löchern mit einem Füllmaterial, aufweisend eine Abstützvorrichtung zum Abstützen der Platte, eine Füllvorrichtung mit einer Füllmaterialquelle und einem an die Füllmaterialquelle angeschlossenen Zuführkanal zum Zuführen von Füllmaterial von der Füllmaterialquelle zur von der Abstützvorrichtung abgestützten Platte, wobei der Zuführkanal in einer angrenzend zur Platte gehaltenen Ausgabeöffnung ausmündet zum Einfüllen des Füllmaterials in das jeweilige Loch der abgestützten Platte, und eine mit einer Seitenwand des Zuführkanals verbundene Schwingungsvorrichtung, von welcher die Seitenwand mit einer bestimmten Frequenz quer zum Zuführkanal in Schwingung versetzbar ist, so dass der Zuführkanal zumindest benachbart zu seiner Ausgabeöffnung entsprechend periodisch verjüngt wird.

Abschirmgehäuse

Auf einer Leiterplatte (100) montiertes Abschirmgehäuse (200), mit einer Öffnung (201), die aus einer Vielzahl von Löchern gebildet wird und zum Einspritzen von feuchtigkeitsfestem Abdeckmaterial (130) bei der Montage des Gehäuses auf der Leiterplatte in einen dem oberen Teil einer mit feuchtigkeitsfestem Abdeckmaterial abzudeckenden Elektronikkomponente entsprechenden Bereich vorgesehen ist, und einem Diffusionsverhinderungsabschnitt (202), der das Diffundieren des feuchtigkeitsfesten Abdeckmaterials (130) über den Bereich des Abschirmgehäuses hinaus verhindert.

Targetted passivation of conductive track intermediate space or track regions on circuit board by applying conductive adhesive in region of tracks formed

The method involves applying a passivation substance (2) to the intermediate spaces between conductive tracks, and then applying a conductive adhesive (3) in the region of the conductive tracks formed. The application of passivation substance involves the application of a passivation mask. An Independent claim is also included for a dispenser device for targetted passivation.

Druckeinrichtung und Verfahren zum Bedrucken eines Gegenstands

Die Erfindung bezieht sich unter anderem auf eine Druckeinrichtung (10) mit einer Transportvorrichtung, die geeignet ist, einen zu bedruckenden Gegenstand (20) entlang einer vorgegebenen Transportrichtung (T) durch einen Druckabschnitt der Druckeinrichtung (10) zu bewegen, einem ersten Druckkopf (D1) zum Abscheiden eines viskosen Druckmaterials, wobei der erste Druckkopf (D1) mittels einer ersten Druckkopfverfahreinrichtung entlang einer ersten Schiebeachse (S1), die quer zur Transportrichtung (T) liegt, verschieblich ist, und einem zweiten Druckkopf (D2) zum Abscheiden des viskosen Druckmaterials, wobei der zweite Druckkopf (D2) mittels einer zweiten Druckkopfverfahreinrichtung entlang einer zweiten Schiebeachse (S2) verschieblich ist, die parallel zur ersten Schiebeachse (S1) liegt und entlang der Transportrichtung (T) versetzt ist.Erfindungsgemäß ist vorgesehen, dass die erste und die zweite Schiebeachse (S1, S2) mittels einer von einer Steuereinrichtung (12) ansteuerbaren Verfahreinrichtung ...

Einrichtung zum Aufdrucken elektrischer Schaltungselemente auf Traegerkoerper

VERFAHREN ZUM ANKLEBEN EINER SCHALTUNGSKOMPONENTE AN EINE LEITERPLATTE

Production of conducting pathways on a substrate e.g. in microelectronics comprises applying a defined conducting adhesive on the substrate, partially hardening and repeating the previous steps

Production of conducting pathways on a substrate comprises applying a defined conducting adhesive on the substrate; partially hardening; and repeating the previous steps. An Independent claim is also included for a device for producing conducting pathways on a substrate (1) comprising a dispensing arrangement (5) for structuring and applying the conducting adhesive (7) on the substrate, and a hardening arrangement (8) for hardening the adhesive.

SOLDERING SURFACE MOUNTED DEVICES TO FLAT SURFACES

An apparatus for soldering surface mounted devices to flat substrates uses a temperature-resistant hydrocarbon fluid both as a heat- and a solder-transfer medium. The fluid is heated to a temperature above the melting point of the solder, and a suspension of droplets of molten solder is formed in the fluid by mechanical means. Jets of this suspension are directed against the joints to be soldered, surplus solder being removed subsequently by further jets of hot, solder-free fluid, the assembly being fully immersed in the fluid during this procedure. Afterwards, the assembly is removed from the hot fluid, adhering fluid being removed by jets of air and recovered. By the same principle, circuit boards with plated-through holes can be given a uniform coating of solder, the bores of the holes remaining free of solder.

Screen printer and screen printing method

Method of forming electrically conductive elements and patterns of such elements

Screen printing apparatus

A Screen printing apparatus in which a squeegee head 13 is moved on a mask plate 12 thereby to print paste on a substrate through pattern hole 12a, slide contact portion 37A and 37B form respectively front and rear walls in the squeegeeing direction of a printing space 35 which reserves cream solder 5 therein and makes cream solder contact with the surface of the mask plate 12 through an opening portion formed at the lower surface thereof. Each slide-contact portion is configured by a partition plate 39 for partitioning between the printing space 35 and the outside and a filling block 38 having a filling surface 388a which forms an acute angle with respect to the surface mask plate 12. In squeegeeing operation, the filling surface 38a rolls the cream solder 5. Thus, the cream solder 5 can be filled into the pattern holes 12a without pressurising the cream solder, and a problem caused by the leakage of the cream solder can be eliminated.

Paste container for screen printing and screen printing apparatus

Edge detection

Controlling the deposition of sealant material at one or more edges of a substrate 3 of an electronic apparatus on the basis of one or more detectable marks 7 (see figure 5). The detectable marks having at least one edge that coincides with a part of at least one of said one or more edges of the substrate. The mark provides an input to a controller for adjusting the position of the application needle 30 so as to accurately deposit the sealant 24. These marks may be located at the corner of the substrate. The detectable marks are made on the substrate before it is cut; these have a large enough size to allow for any size variation in the apparatus after the cutting process. The marks may be part of the patterned layer that also defines the conductive elements for one level of an array of electronic devices.

Pressure control system for printing a viscous material

ELECTRICAL PRINTED CIRCUITS

PROCEDURES FOR THE PRODUCTION OF A IN VOLUME MINIATURIZED DEVICE

PROCEDURE FOR GLUING A CIRCUIT COMPONENT TO A PRINTED CIRCUIT BOARD

PROCEDURE FOR FLUXING AGENT-FREE COATING AND LOETEN.

BLADES FOR THE SCREEN PRINTING

SCREEN PRINTING DEVICE

Interconnecting flexible printed boards

Circuit board printer

Improvements in or relating to circuit boards

Method and apparatus for applying viscous or paste material onto a substrate

Printed circuit board and heat sink arrangement

METHOD AND APPARATUS OF FORMING THICK FILM CIRCUITS

Disclosed is a method and apparatus for forming patterns in a thick film circuit or the like to be used when forming elements such as conductors and resistors on a thick film circuit board. The pattern forming apparatus comprises a writing head for storing paste to form patterns, and the writing head lowers and approaches an arbitrary point in close proximity to the board of a thick film circuit and, while in the same state, moves laterally to another arbitrary point along the surface of the board, and then ascends to be separated from the board. The paste in the writing head is pressurized to be forced out of the head before the writing head begins to move laterally such that the paste is immediately applied on the board when the writing head begins to move laterally. This pressurization of the paste is stopped before the writing head finishes its lateral movement, so that the extrusion of the paste may be stopped the moment the writing head finishes the lateral movement. As a result, ...

METHOD AND APPARATUS OF FORMING THICK FILM CIRCUITS

RADIATION SUPPLY AND ADHESIVE DISPENSING SYSTEM

METHOD AND ARRANGEMENT FOR PRODUCING AN ELECTRICALLY CONDUCTIVE PATTERN ON A SURFACE

CA 02863130 2014-07-29 22 Abstract A method and an arrangement are disclosed for producing an electrically con-ductive pattern on a surface. Electrically conductive solid particles are trans-ferred onto an area of predetermined form on a surface of a substrate. The electrically conductive solid particles are heated to a temperature that is higher than a characteristic melting point of the electrically conductive solid particles, thus creating a melt. The melt is pressed against the substrate in a nip, wherein a surface temperature of a portion of the nip that comes against the melt is lower than said characteristic melting point. Fig. 1 ...

METHOD AND ARRANGEMENT FOR PRODUCING AN ELECTRICALLY CONDUCTIVE PATTERN ON A SURFACE

A method and an arrangement are disclosed for producing an electrically conductive pattern on a surface. Electrically conductive solid particles are transferred onto an area of predetermined form on a surface of a substrate. The electrically conductive solid particles are heated to a temperature that is higher than a characteristic melting point of the electrically conductive solid particles, thus creating a melt. The melt is pressed against the substrate in a nip, wherein a surface temperature of a portion of the nip that comes against the melt is lower than said characteristic melting point.

PROCEDURE AND DEVICE FOR THE PRODUCTION OF AN INTEGRATED THICK FILM CIRCUIT.

Method for varying the distance between a printed wiring board terminal and a construction unit connection.

Die Erfindung betrifft ein Verfahren zum Variieren des Abstands (1) zwischen einem Leiterplattenanschluss (2) einer Leiterplatte (3) und einem Bauteilanschluss (4) eines Bauteils (5), das mit der Leiterplatte (3) kontaktiert wird. Es umfasst folgende Verfahrensschritte: Erzeugen von mindestens einem ersten Tröpfchen (6) eines elektrisch leitfähigen und viskosen Mediums, wobei das mindestens erste Tröpfchen (6) ein vorbestimmtes Volumen aufweist, Platzieren des mindestens ersten Tröpfchens (6) auf dem Leiterplattenanschluss (2), Platzieren des Bauteils (5) auf der Leiterplatte (3), so dass das mindestens erste Tröpfchen (6) eine stoffschlüssige und elektrische Verbindung zwischen dem Leiterplattenanschluss (2) und dem Bauteilanschluss (h) herstellt, wobei der Abstand (1) zwischen dem Leiterplattenanschluss (2) und dem Bauteilanschluss (4) durch das Volumen des mindestens ersten Tröpfchens (6) variiert wird.

PROCEDURE AND DEVICE FOR CALIBRATING A PLANT FOR THE PRODUCTION OF IN THICK FILM TECHNIQUE OF APPLIED CIRCUITS.

Method for applying epoxy adhesive on substrate during mounting e.g. octagonal semiconductor chips, involves delivering adhesive portions, where nozzle height above location during delivery step is temporary larger than at beginning of step

The method involves positioning a dispensing nozzle (3) in a preset height (z1) above a location of a substrate (1). Adhesive portions (4.1-4.n) are delivered on the substrate location by the dispensing nozzle. The height of the dispensing nozzle above the substrate location during the delivery step is temporary larger than at beginning of the delivery step. The height of the nozzle above the substrate location is increased continuously or in discrete steps during delivery. A needle tip is moved towards a container with an adhesive for receiving the adhesive by immersion in the container.

Method for applying adhesive to a substrate.

Die Erfindung betrifft ein Verfahren zum Auftragen von Klebstoff, bei dem mittels einer Dispensdüse (3) Klebstoff auf Substratplätze eines Substrats (1) aufgebracht wird, und umfasst die Schritte: Positionieren der Dispensdüse in einer vorbestimmten Höhe über jeden Substratplatz, Abgeben von Klebstoff, wobei die Höhe der Dispensdüse über dem Substratplatz am Ende dieses Schrittes grösser ist als am Beginn dieses Schrittes. Die Erfindung betrifft ferner ein Verfahren mit Schritten Abgeben von Klebstoff über jeden Substratplatz mit konstanter Höhe der Dispenserdüse, Erhöhen der Höhe der Dispensdüse, Wiederholen der ersten beiden Schritte für eine vorgegebene Anzahl Wiederholungen.

Device and procedure for the Auftrangen of adhesive on a substrate.

A method for varying the distance between a terminal and a terminal board component.

Die Erfindung betrifft ein Verfahren zum Variieren des Abstands (1) zwischen einem Leiterplattenanschluss (2) einer Leiterplatte (3) und einem Bauteilanschluss (4) eines Bauteils (5), das mit der Leiterplatte (3) kontaktiert wird. Es umfasst folgende Verfahrensschritte: Erzeugen von mindestens einem ersten Tröpfchen (6) eines elektrisch leitfähigen und viskosen Mediums, wobei das mindestens erste Tröpfchen (6) ein vorbestimmtes Volumen aufweist; Platzieren des mindestens ersten Tröpfchens (6) auf dem Leiterplattenanschluss (2); Platzieren des Bauteils (5) auf der Leiterplatte (3), sodass das mindestens erste Tröpfchen (6) eine stoffschlüssige und elektrische Verbindung zwischen dem Leiterplattenanschluss (2) und dem Bauteilanschluss(4) herstellt, wobei der Abstand (1) zwischen dem Leiterplattenanschluss (2) und dem Bauteilanschluss (4) durch das Volumen des mindestens ersten Tröpfchens (6) variiert wird.

PRODUCTION OF MUCH LAYER MICROCOMPONENTS OF ARBITRARY SHAPE FROM SEVERAL MATERIALS

Method for dividing a large substrate into smaller ones and method for controllably selectively depositing a sealant material

A technique comprising: forming a plurality of smaller substrates from one or more larger substrates by a reduction process according to which there is some possible variation size between the smaller substrates within a variation range; and, in advance of said reduction process, providing said one or more larger substrates with one or more detection marks whose size and location are selected such that after the reduction process each smaller substrate includes a portion of at least one of said one or more detection marks, said portion having one or more edges that coincide with at least a part of one or more edges of the smaller substrate whatever actual size the smaller substrate has within said variation range.

Liquid Dispensing Apparatus and Method of Inspecting the same

Liquid droplet ejection apparatus and method

Method for realization of printed circuit

DISPOSITIF ET PROCEDE D'ECRITURE POUR LA REALISATION DE CIRCUITS ELECTRIQUES

MACHINE DESTINEE A LA REALISATION DE CIRCUITS HYBRIDES PAR DEPOT D'ENCRE 22 SUR UN SUBSTRAT 1 TEL QU'UNE PLAQUE D'ALUMINE. ELLE COMPORTE UNE TETE D'ECRITURE 2 TELECOMMANDEE ET UN DISPOSITIF 6, 4 DE COMMANDE DE L'ALIMENTATION EN ENCRE DE CETTE TETE. LA TETE D'ECRITURE EST EQUIPEE D'UNE BUSE D'ECRITURE 3 EN FORME DE TUBE CAPILLAIRE EN VERRE.

DEVICE OF COLLECTIVE FILLING OF SURGE ONE-EYED

METHOD AND APPARATUS FOR SUPPLYING A MOLTEN METAL COMPOUND TO A SUBSTRATE.

A METHOD FOR MACHINING COMPOSITE MATTERS

Method of refilling the hollow grid of the printed circuit boards during the manufacture of IC chips, uses a mesh which rests on the substrate without any deformation, and which acts as a guide for the injection unit

L'invention consiste en un moyen permettant de remplir des inter-pistes profonds sur un circuit imprimé (1) par l'utilisation d'un écran à mailles métalliques d'épaisseur inférieures à 150µ et dont le rapport de surface ouverte est supérieur à 50%. Ladite maille (4) en tension est inextensible sous l'effet de la pression de transfert du produit à transférer. La maille prend appui sur le substrat et ne subit aucune déformation, elle permet de guider sur un plan parfaitement défini l'organe de transfert (7).

Filler for blind cavities e.g. for electronic or medical use has body with two apertures linked to vacuum source and filling product reservoir

Dispositif de remplissage collectif de cavités borgnes. L'invention concerne un dispositif qui permet de remplir des cavités borgnes de façon efficace et contrôlée. Il est constitué d'un corps mobile (1) et en contact étanche par rapport à la surface comprenant les orifices des cavités. Le corps (1) comporte deux fentes et la première (2) est espacée de façon étanche à la fois de l'extérieur du dispositif et de la deuxième fente (5), d'une distance mesurée parallèlement au déplacement du dispositif, supérieure à la dimension du plus grand orifice et dont la première fente à rencontrer les orifices lors du mouvement est reliée à une chambre à vide (3) et la deuxième fente à rencontrer les orifices est reliée à un réservoir (6) contenant le produit (7) à transférer.

APPARATUS AND METHOD FOR DIRECT WRITE

Procede et appareil pour commander une machine d'inscription servant a distribuer une pate pour circuit integre a couche epaisse sur la surface d'un substrat

Dans le procede et l'appareil selon la presente invention, un moyen secondaire 28 evite l'endommagement de l'ajutage grace a un ressort 32 servant d'absorbeur de chocs lorsque cet ajutage descend jusqu'au substrat 48. En outre, un moyen de limitation 52, 54 limite l'action du moyen secondaire d'entrainement vers le haut et vers le bas, de sorte que l'ajutage est souleve du substrat d'une distance predeterminee, de facon precise quand le moyen secondaire d'entrainement vers le haut et vers le bas se trouve dans un etat ou son action est limitee.

Methods for continuously moving a fluid dispenser while dispensing amounts of a fluid material

Methods for applying fluid materials to a substrate, such as circuit board, while continuously moving the fluid dispenser. Some methods generally involve correcting the dispense location for each of the dispensed amounts of fluid material by executing a statistical comparison of either the predicted and actual landing locations on the substrate, or the predicted and actual positions of the dispenser at each of the dispense locations. Other methods generally involve initiating the dispensing of amounts of the fluid material at dispense locations corrected by a correction factor specified in terms of the servo cycle for the movement of the dispenser or by a correction factor specified in terms of partial servo cycles courtesy of a timer.

METHOD OF PRODUCING CONDUCTIVE CIRCUIT BOARD

A conductive circuit board is produced by imparting tackiness to the conductive circuit surface on a printed wiring board, attaching solder powder to the tacky area by supplying a slurry containing solder powder, and then heating the printed wiring board to melt the solder, thereby forming a solder circuit. In the solder circuit prepared by this method, tackiness is imparted to portions of the circuit with an insufficient amount of solder attached thereto and solder powder is attached to these tacky areas, or a solder paste is applied to the portions of the circuit with an insufficient amount cf solder attached, and the solder powder or solder paste is melted to rectify the solder circuit, thereby producing a conductive circuit board with little variation in the amount of solder attached.

BUILT-UP SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND SEMICONDUCTOR INTEGRATED CIRCUIT PACKAGE

Disclosed is a method for manufacturing a built-up substrate wherein an insulating layer and a wiring pattern layer are laminated on a circuit board. The method includes (i) a step wherein a photoreactive metal oxide precursor raw material is applied to both of or one of the surfaces of the circuit board that is provided with the wiring pattern, the photoreactive metal oxide precursor raw material is dried, and an insulating film is formed, (ii) a step wherein an opening for a via hole is formed in the insulating film by exposing and developing the insulating film, (iii) a step wherein the insulating film is changed into an inorganic metal oxide film by heat-treating the insulating film, thereby obtaining a built-up insulating layer configured of the inorganic metal oxide film, and (iv) a step wherein the via hole is formed, and at the same time, a metal layer is formed, by plating the built-up insulating layer, and a built-up wiring pattern is formed by etching the metal layer, and in ...

FILLING DEVICE AND METHOD FOR FILLING BALLS IN THE APERTURES OF A BALL-RECEIVING ELEMENT

L'invention concerne un dispositif de remplissage et un procédé de remplissage de boules dans un réseau d'ouvertures se trouvant dans un élément récepteur de boules, le dispositif de remplissage comprenant un compartiment présentant une ouverture située sur une surface inférieure de celui-ci et définissant en partie une chambre destinée à contenir une alimentation en boules, le compartiment étant disposé mobile lors de son utilisation sur un élément récepteur de boules présentant un réseau d'ouvertures, ainsi qu'un moyen de distribution disposé à l'intérieur du compartiment pour la distribution de boules contenues dans la chambre, de manière à maintenir un nombre limité de couches de boules sur au moins une région de l'ouverture se trouvant dans le compartiment.

METHOD AND APPARATUS FOR DRAWING THICK-FILM CIRCUITS

A method of and apparatus for drawing a thick-film circuit on a substrate (2) by bringing a drawing nozzle (1), which has a paste-discharging port at the free end thereof, near the substrate (2) on which a thick-film circuit is to be drawn, and discharging paste from the discharge port onto the substrate (2) while moving the nozzle (1) relatively thereto. If the discharge rate of the paste is controlled in accordance with the relative speed of linear motion of the drawing nozzle (1) to the substrate (2), fluctuations of the thickness and width of the film which occur due to variations in this speed can be prevented, so that a highly accurate thick-film circuit can be formed rapidly.

METHOD FOR PRODUCING A CARD-TYPE DATA CARRIER AND A DEVICE FOR CARRYING OUT SAID METHOD

The aim of the invention is to produce card-type data carriers, on which electronic components, conductor strips and transmission elements are provided. To achieve this, the conductor strips and/or transmission elements are formed by the successive, continuous application of a conductive substance or dispersion along predetermined tracks on the carrier layer by means of a dispersion needle, an air-brush system or an inkjet system. This method even overcomes differences in height between the components.

Resin application method on panel, manufacturing method of panel for display and resin applying apparatus thereof

On an application stage of resin are provided two (2) sets of dispensers 20 and 40. The one dispenser 20 supplies the resin directing to an upper side corner on a liquid crystal cell 1, while the other dispenser 40 directing to a lower side corner thereon. The dispenser 40 has a syringe 41 and a needle-like nozzle 42, and the needle-like nozzle 42 emits the resin, directing upward obliquely, onto the lower side corner. Thereby, the resin can be supplied between an edge portion of a lower substrate and a lower surface of a connecting board, but without turning over the panel for display, such as, a liquid crystal cell, etc.

Method and apparatus for soldering circuit boards

A method and apparatus for depositing solder on the terminal pads (10) of printed circuit boards (12) in which a solder resist layer (16) or layers (16, 17) having a thickness corresponding to the desired solder height border the pads. Molten solder from a reservoir (58) is directed by nozzles (72) against the sides of the board (12) to fill the cavities extending above the terminal pads while the board (12) is moving via a conveyor mechanism relative to the reservoir (58). The cavities when filled with molten solder are covered by a suitable element such as a flexible belt (52) or roller. The molten solder within the covered cavities is then cooled below its solidification point and the covering element removed. If desired, part or all of the solder resist layer (16) or layers (16, 17) may then be stripped from the board (12) to leave solder pads extending above the surface of the board (12).

Method of locating conductive spheres utilizing screen and hopper of solder balls

Apparatus and methods for placing conductive spheres on prefluxed bond pads of a substrate using a stencil plate with a pattern of through-holes positioned over the bond pads. Conductive spheres are placed in the through-holes by a moving feed mechanism and the spheres drop through the through-holes onto the bond pads. In one embodiment, the feed mechanism is a sphere hopper which crosses the entire through-hole pattern. In another embodiment, a shuttle plate fed spheres from a reservoir and reversibly moves about one-half of the pitch, moving from a non-discharge position to a discharge position.

Method and apparatus for the computer-controlled manufacture of three-dimensional objects from computer data

A method and process for computer-controlled manufacture of three-dimensional objects involves dispensing a layer of a first material, such as a liquid, insoluble material onto a platform at predetermined locations corresponding to a cross-section of the object, which then hardens. A second medium, preferably water soluble, is then sprayed onto this layer to thereby encapsulate the hardened insoluble media. The uppermost surface of this encapsulant is planned, thus removing a portion of the encapsulant to expose the underlying insoluble material for new pattern deposition. After the resulting planing residue is removed, another layer of liquid, insoluble media is dispensed onto the planned surface. The insoluble media can be of any color and may vary from layer to layer, and from location within a layer to location with a layer. These steps are repeated, until the desired three-dimensional object, surrounded by a mold, is completed. At this point, the object is either heated or immersed in solvent, thereby dissolving the mold and leaving the three-dimensional object intact. Other system methods, and processes are also disclosed.

Flat type display device having flexible wiring board and common wiring board bonded to display panel

A flat type display device is assembled compactly with high reliability. The flat type display device has a liquid crystal panel having electrode terminals on a peripheral portion of one face of the liquid crystal panel, a flexible wiring board having a drive IC mounted thereon for driving the liquid crystal panel, and a common wiring board having electrode terminals on one face thereof. The flexible wiring board is electrically connected to the electrode terminals of the liquid crystal panel. The common wiring board is electrically connected to the flexible wiring board so as to transmit an input signal, which has been received by the electrode terminals from external, to the drive IC. The liquid crystal panel and the common wiring board are mounted on each other so as to overlap each other in a state that their faces on which their respective electrode terminals are provided are opposed to each other and that the electrode terminals of the common wiring board are located outside of a ...

Method and apparatus for dispensing viscous material

A novel apparatus for compressing viscous material through openings in a stencil is disclosed. The novel apparatus has a compression head cap which provides a contained environment to direct and to aid the flow of pressurized viscous material through the openings in the stencil.

Apparatus for making wiring board

A manufacturing apparatus of a wiring board includes: a fixed die; a movable die configured to abut with the fixed die so as to form a cavity in which a resin substrate having a wiring gutter is to be molded; and an injection machine configured to inject molten resin into the cavity via the fixed die. The movable die includes a movable main mold, and a movable core having a nested structure in which the movable core is slidably accommodated in the movable main mold. A wall surface of the movable core has a projection portion that molds the wiring gutter. An injector configured to inject molten metal into the wiring gutter via the projection portion is provided inside the movable core.

Dispensed electrical interconnections

An electronic device includes a substrate, an electrical element on the substrate, a nonconductive adhesive material on the substrate, and a conductive adhesive material on the electrical element and extending onto the nonconductive adhesive material. Methods of forming a packaged LED include providing a substrate having an electrical element thereon, and dispensing a nonconductive adhesive material on the substrate. The nonconductive adhesive material is at least partially cured, and a conductive adhesive material is dispensed on the electrical element and on the at least partially cured nonconductive material. The conductive adhesive material is at least partially cured. The conductive adhesive material may provide an electrical connection between the electrical element and a second electrical element on the substrate or on another substrate.

Droplet discharge device and method

An example of droplet discharge device includes a discharge path (12) having an end that constitutes a discharge opening (11), a plunger (30), a liquid chamber (50) into which the plunger (30) is inserted, a plunger driving mechanism that moves the plunger (30) forward and backward, and a plunger position determining mechanism that specifies a position of a tip portion of the plunger (30). The liquid material is discharged in a droplet state by applying inertial force to the liquid material with forward movement of the plunger (30) in a state where the tip portion of the plunger (30) and an inner wall of the liquid chamber (50) are not contacted with each other. A minute droplet is formed by moving the plunger (30) forward to push the liquid material out of the discharge opening (11) in an amount necessary to form a droplet of a desired size.

Electrical circuit assembly with improved shock resistance

An assembly of the present invention includes a substrate and an integrated circuit device adapted to be electrically and mechanically attached to the substrate. Electrically conductive connecting elements between the device and the substrate electrically connect the device and the substrate. At least one adhesive body is positioned between the integrated circuit device and the substrate to form a mechanical connection between the circuit device and the substrate. The at least one adhesive body comprises a non-thermosetting material which, when heated, releases said mechanical connection to allow removal of the circuit device from the substrate.

Method and apparatus for applying viscous material

By using an application unit having: a storage chamber for a viscous material; a discharge hole, for the viscous material, provided so as to communicate with the storage chamber, where a viscous-material feeding device for feeding the viscous material to the storage chamber is coupled to the application unit; and a discharge-pressure adjusting device for imparting a discharge pressure to the viscous material stored in the storage chamber, a screen mask having openings corresponding to the application object or the application object itself and the discharge hole of the application unit are brought into contact with each other, either the application unit and the screen mask or the application unit and the application object are moved relative to each other while the discharge pressure is imparted to the viscous material in the storage chamber, and the viscous material is applied onto the application object while the storage chamber is replenished at all times with the viscous material by ...

System and Method for Controlling Powder Bed Density for 3D Printing

A system and corresponding method for additive manufacturing of a three-dimensional (3D) object to improve packing density of a powder bed used in the manufacturing process. The system and corresponding method enable higher density packing of the powder. Such higher density packing leads to better mechanical interlocking of particles, leading to lower sintering temperatures and reduced deformation of the 3D object during sintering. An embodiment of the system comprises means for adjusting a volume of a powder metered onto a top surface of the powder bed to produce an adjusted metered volume and means for spreading the adjusted metered volume to produce a smooth volume for forming a smooth layer of the powder with controlled packing density across the top surface of the powder bed. The controlled packing density enables uniform shrinkage, without warping, of the 3D object during sintering to produce higher quality 3D printed objects.

Methods for continuously moving a fluid dispenser while dispensing amounts of a fluid material

Methods for applying fluid materials to a substrate, such as circuit board, while continuously moving the fluid dispenser. Some methods generally involve correcting the dispense location for each of the dispensed amounts of fluid material by executing a statistical comparison of either the predicted and actual landing locations on the substrate, or the predicted and actual positions of the dispenser at each of the dispense locations. Other methods generally involve initiating the dispensing of amounts of the fluid material at dispense locations corrected by a correction factor specified in terms of the servo cycle for the movement of the dispenser or by a correction factor specified in terms of partial servo cycles courtesy of a timer.

Viscous fluid supply device

In solder printer, solder supply device uses positive and negative pressure supply device to apply pressure inside air chamber to move solder cup inside outer tube, such that solder paste is supplied from supply nozzle. Controller, when supply of solder paste from supply nozzle is stopped, performs drive control of positive and negative pressure supply device to decrease the pressure inside air chamber, and uses timer to measure the time required from the starting of decreasing the pressure inside the air chamber to when the pressure inside air chamber has reached a set pressure. Because this required time corresponds to the movement amount of solder cup from the start of supply of the solder paste to when supply is stopped, controller using the measured required to estimate the remaining amount of the solder paste in detail with good accuracy.

SLURRY DISCHARGE DEVICE

Soldering method and soldering apparatus

METHOD OF FORMING ELECTRICALLY CONDUCTIVE ELEMENTS AND PATTERNS OF SUCH ELEMENTS

A method of forming a printed circuit board using an ink jet print head by printing a three dimensional groove using a curable, non-conductive deposition liquid and depositing a liquid that dries to form a conductive track. The walls on either side of the groove impede the liquid from spreading and consequently larger quantities of the conductive deposition liquid can be deposited without causing a short circuit. A multi layer printed circuit board can be produced by depositing further layers of curable non-conductive deposition liquid over the conductive track, a further conductive track in an upper layer being in contact with a conductive track in a lower layer along a slope formed from the non-conductive deposition liquid.

SYSTEMS AND METHODS FOR APPLYING A LIQUID COATING MATERIAL TO A SUBSTRATE

DISPENSER FOR APPLYING CREAM SOLDER

PURPOSE: To restrain the development of bridge and to solder terminals for electronic device to a land with excellent strength and low electric resistance by improving spreading property of cream solder or molten solder over the whole surface of land. CONSTITUTION: By using a dispenser forming a transition part 34 expanding from a solder feeding pipe 31 whose pipe axis directs the center of a flattened opening part 35 toward the flatted opening part 35 having the same cross sectional area, the cream solder is applied on the substrate. As the dispenser, one providing a levelling tool, such as roller, and doctor knife, and one separately providing flux coating device, as well are used. Almost the whole surface of land is cleaned with the applied flux or the flux contained in the cream solder and wettability to the molten solder is improved. Therefore, the terminals are soldered to the land with wide joining interface and with thin soldering layer and the development of bridge is restrained ...

СПОСОБ ПРОИЗВОДСТВА ЧАСТИЧНО МЕТАЛЛИЗОВАННОГО ПЛЕНОЧНОГО ЭЛЕМЕНТА

... 1. Способ производства частично металлизованной тисненой, трафаретной или ламинирующей пленки, отличающийся тем, что создают цифровой массив (332) данных, который определяет графическую конфигурацию частичной металлизации, при этом по цифровому массиву (332) рассчитывают траекторию движения инструмента и управляющие данные (333) для управления инструментом, причем инструмент (38) и одно- или многослойный пленочный каркас (30, 41, 60, 80) согласно траектории движения инструмента перемещают друг относительно друга, и инструмент (38), управляемый согласно управляющим данным, обеспечивает частичное дискретное деметаллирование металлического слоя (16, 31, 44, 63, 84) посредством нанесения смываемой маски (83) для частичного маскирования одно- или многослойного пленочного каркаса (80), при этом маску (83) наносят разбрызгиванием (91), одно- или многослойный пленочный каркас (80) затем высушивают, снабжают металлическим слоем (84), и металлический слой (84) методом промывки в области смываемой ...

Mesh pressure device

A device is described for pressing a viscous material onto the surface of a circuit by means of a mesh having openings. The device contains a dispenser (S) for the viscous material having a box-shaped housing (A) in which there is arranged a chamber (5) for receiving the material and having a bottom opening (3) of gap shape connected to the latter. Two leaves (2A, 2B) hang down from the housing (A) on opposite sides of the bottom opening (3). A back wall (8) of the housing (A) contains an immovable upper wall part (8A) and a lower wall flap part (8B), which is connected pivotably and displaceably to the upper wall part (8A) and hangs down from this. The lower wall flap part (8B) forms the back side of the bottom opening (3). One of the leaves, which is used as a squeezing leaf, is fastened to the wall flap part. The wall flap part (8B) is connected to a pair of manually actuable height setting devices (22) which are fastened in each case to the housing for regulating the height of the wall ...

Verfahren und Vorrichtung zur selektiven Lackierung einer mit Bauteilen unterschiedlicher Höhe bestückten Leiterplatte

Conductor track extrusion, comprises dispensing a continual profile section with a conductor, and stabilizing and solidifying the section on a substrate

A process for extruding conductor tracks with a conductor, comprises dispensing a continual profile section with a conductor, stabilizing and solidifying the profile section on a substrate, and separating the profiled section at the connection surface of a component. A thermoplastic material is melted and passed through a nozzle unit while simultaneously advancing the conductor. The arrangement used to carry out the process consists of a dispenser unit (1) composed of a plastifier (2) for melting the thermoplastic, a nozzle unit (8) with a capillary system (3) and an advancing system (5).The nozzle unit has a cutting unit at the capillary tip, to separate the profile section behind the tip. The speed at which the conductor is advanced is controlled by a gas stream.

VERFAHREN UND VORRICHTUNG ZUR KONTROLLE VON LOTPASTENSCHICHTEN AUF SUBSTRATEN

Verfahren zum Schutz von bestückten Leiterplatten

Die Erfindung betrifft ein Verfahren zum mechanischen und hygienischen Schutz von bestückten Leiterplatten vor einem selektiven Lötvorgang. Nach dem erfindungsgemäßen Verfahren wird eine zu schützende Leiterplatte mit einer Lötstoppaste abgedeckt und geschützt. Diese Abdeckung (XXXX) ist nach dem Aushärten und nach dem Lötvorgang von der Leiterplatte abziehbar.

SIEBDRUCKVORRICHTUNG

Screen printing apparatus, screen printing method, and paste storage container for screen printing apparatus

Method of printing using a droplet deposition apparatus

Screen printing apparatus and method of screen printing

Screen printing method

It is possible to obtain a screen printing method that may assure excellent printing qualities since the screen printing method of the present invention includes: (A) sliding a squeegee head with a paste stored in the squeegee head on a mask plate, while the past is pressurized, and printing the paste on a substrate through pattern holes of the mask plate, (B) at least one step of (b) separating the squeegee head with a the paste stored therein from the mask plate, and (e) sliding the squeegee head on the mask plate for a pre-squeezing purpose before the step (A). The step of separating the squeegee head from the mask plate includes the steps of (1) discontinuing the pressure application to the paste stored in the squeegee head, (2) horizontally moving the squeegee head by a predetermined distance while the bottom end portion of the squeegee head is abutted on the mask plate in a state of the pressure application being discontinued, and (3) moving the squeegee head upward off from the mask ...

A METHOD OF PACKING FILLER INTO THROUGH HOLES IN A PRINTED CIRCUIT BOARD

Screen printing apparatus and method

The apparatus and method reduces the need for high pressing forces required to print paste on a substrate (6) through a mask plate (12) thereby providing reliable printing qualities. The apparatus has a squeegee head (13) comprising a printing head section (26) with rolling guide surfaces (26A, 26B), paste transfer passage (25), paste storage cartridge (21) holding paste or solder (22), pressure applying plate (23) and scraping members (27A, 27B). The paste in the storage cartridge is pressurised and forced through transfer passage (25) into the printing space portion (26) where it is given a rolling motion by the guide surfaces (26A, 26B) whilst being forced through the aperture formed by the scraping members into the mask pattern (12a). The rolling ability of the paste is enhanced which improves the filling of the paste into the mask pattern holes and reduces paste leakage.

Pressure control system for printing a viscous material

Circuit board printer

Electronic component mounting line and electronic component mounting method

Disclosed is an electronic component mounting line on which a substrate undergoes solder paste printing, electronic component placements, and then reflow, while being moved from upstream to downstream. The line includes: a substrate feeding machine; a screen printing machine for applying solder paste to the substrate; a resin dispensing machine arranged downstream of the screen printing machine, for dispensing a thermosetting resin onto at least one reinforcement position on the substrate; a second electronic component placement machine arranged adjacent to and downstream of the resin dispensing machine, for placing a second electronic component on the substrate, such that its peripheral edge portion comes in contact with the resin; a first electronic component placement machine arranged downstream of the second electronic component placement machine, for placing a first electronic component on the substrate; and a reflow machine for bonding the electronic components to the substrate, by heating and cooling the resultant.

Method and apparatus for calibrating dispensed deposits

A method of calibrating a dispenser, which has a material dispensing unit that is configured to dispense material on a substrate, includes dispensing a line of material on a surface, capturing at least one image of the line dispensed on the surface, calculating an average line width of the line dispensed on the surface, and comparing the average line width of the line dispensed on the surface to a desired line width. A controller configured to perform the method is further disclosed.

Method and system of depositing a viscous material into a surface cavity

A method of depositing a viscous material into a surface cavity of a target object. The method includes providing the target object having the surface cavity. The target object has an exterior surface with a cavity opening that provides access to the surface cavity. The method also includes evacuating air from the surface cavity through the cavity opening and covering the cavity opening to seal the surface cavity. The surface cavity constitutes a partial vacuum when the surface cavity is sealed. The method also includes permitting a viscous material to flow into the surface cavity through the cavity opening as the cavity opening is uncovered.

Method and device for fabricating multi-piece substrate

Provided are a multi-piece board fabrication method and apparatus which are capable of efficiently bonding a frame and a non-defective board piece together, thereby efficiently fabricating a multi-piece board comprising a plurality of non-defective board pieces. The method and apparatus are configured to cause a board piece conveyance mechanism to extract and hold a board piece stored in a board piece stacker and couple the board piece with a frame placed on a retaining table located in a first working area, and, after moving the retaining table from the first working area to a second working area, apply an adhesive to a coupled region between the board piece and the frame by using a dispenser to thereby fix a positional relationship therebetween.

APPARATUS FOR LAYING CONDUCTIVE PATHWAYS, METHOD OF LAYING CONDUCTIVE PATHWAYS AND TEXTILE PRODUCT COMPRISING CONDUCTIVE PATHWAYS

A conductive tape formed by laying a conductive pathway on a tape layer is disclosed. Various apparatus and methods for laying conductive pathways to form conductive tape are disclosed. The conductive pathways may be laid by varying the lateral position of the conductive pathway on the tape substrate. Such patterns all stretchable conductive tape to be realized. Multiple conductive pathways may be laid in the tape and the lateral separation of the pathways in the tape may vary. In some embodiments the pathways are formed from conductive yarn or by printing or laying conductive ink. 1. An apparatus for laying conductive pathways on a tape to form a conductive tape , the apparatus comprising:a pair of surfaces arranged to apply a bonding pressure;a first conductive pathway laying device configured to lay a first conductive pathway on the tape and configured to vary the lateral position of the first conductive pathway as the tape moves through the pair of surfaces; anda second conductive pathway laying device configured to lay a second conductive pathway on the tape and configured to vary the lateral position of the second conductive pathway as the tape moves through the pair of surfaces, wherein the first conductive pathway laying device and/or the second conductive pathway laying device are configured to vary a lateral separation between the first conductive pathway and the second conductive pathway.2. An apparatus according to claim 1 , wherein the first conductive pathway laying device comprises a first yarn position controller arranged to control the lateral position of a first conductive yarn on the tape when the bonding pressure is applied and the second conductive pathway laying device comprises a second yarn position controller arranged to control the lateral position of a second conductive yarn on the tape when the bonding pressure is applied.3. An apparatus according to claim 2 , wherein the first and/or second yarn position controller comprises a nozzle.4. ...

METHOD OF CALIBRATING A DISPENSER

A method is used to identify and compensate for errors created by changes in the relative positions of a deposition unit and a vision system of a dispenser. The method includes calibrating the vision system, dispensing a pattern of features over a working area, moving the vision system over a deposition location to locate a deposition, obtaining an image of the deposition, tagging data associated with the image, calculating a relative distance between the deposition unit and the vision system, storing correction data with spatial location in a file for later use, and using the stored data to make small corrections prior to dispensing additional material. 1. A method used to identify and compensate for errors created by changes in the relative positions of a deposition unit and a vision system of a dispenser , the method comprising:calibrating the vision system;temporarily fixing a camera on a deposition unit;moving a camera at a deposition unit location to the same location as the vision system was calibrated;obtaining an image of same standard which the vision system was calibrated to;tagging data associated with the image;calculating a relative distance between the deposition unit and the vision system;storing correction data with spatial location in a file for later use; andusing the stored data to make corrections prior to dispensing additional material.2. The method of claim 1 , wherein the steps of obtaining an image of the deposition claim 1 , tagging data associated with the image claim 1 , saving the data claim 1 , and calculating a relative distance are repeated for other deposition locations.3. The method of claim 1 , further comprising claim 1 , if multiple dispensing units are employed claim 1 , tagging each dispensing unit.4. The method of claim 1 , wherein the method is performed under the control of a controller configured to manipulate the vision system with a vision gantry system to move to a position defined by the calibration location.5. The ...

DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF

A manufacturing method of a display device is disclosed. The method includes the following steps. A first substrate having a first region and a second region is provided. A second substrate is disposed on the first substrate. The second substrate is overlapping the first region. At least one drive IC is disposed on the second region. A protection layer is disposed on the second region, The protection layer is disposed enclosing the at least one drive IC. The protection layer has a maximum height larger than a maximum height of the at least one drive IC. 1. A manufacturing method of a display device , comprising:providing a first substrate having a first region and a second region;disposing a second substrate on the first substrate, wherein the second substrate is overlapping the first region;disposing at least one drive IC on the second region; anddisposing a protection layer on the second region, wherein the protection layer is disposed enclosing the at least one drive IC, and the protection layer has a maximum height larger than a maximum height of the at least one drive IC.2. The manufacturing method of the display device according to claim 1 , wherein disposing the protection layer on the second region of the first substrate comprises:coating an adhesive in the second region.3. The manufacturing method of the display device according to claim 1 , the at least one drive IC comprising a plurality of drive ICs:disposing the plurality of drive ICs on the second region wherein the plurality of drive ICs are arranged along an extending direction of one lateral side of the second substrate;disposing an adhesive on the first substrate, wherein the adhesive is disposed between a side of one of the plurality of drive ICs and the second substrate; anddisposing the adhesive on the first substrate, wherein the adhesive is disposed on another side of the one of the plurality of drive ICs opposite to the second substrate.4. The manufacturing method of the display device ...

Method and apparatus to create electrical junctions for information routing in textile structures

Disclosed are systems or apparatuses and methods for forming a junction between conductive fibers that are incorporated into a fabric. Briefly, one method includes the steps of removing insulation from two intersecting individually insulated conductive fibers to expose the individually conductive fibers, bringing the exposed individually conductive fibers into contact with each other at a junction point, and forming a molecular bond between the conductive fibers at the junction point. Also disclosed are systems for forming a junction between conductive fibers that are incorporated into a fabric. In this regard, one embodiment of such a system can include a first apparatus that removes insulation from two intersecting individually insulated conductive fibers to expose the individually conductive fibers, a second apparatus that brings the exposed individually conductive fibers into contact with each other at a junction point, and a third apparatus that aids in formation of a molecular bond between the conductive fibers at the junction point.

Metal Body Formed on a Component Carrier by Additive Manufacturing

A component carrier includes a carrier body formed of a plurality of electrically conductive layer structures and/or electrically insulating layer structures, a metal surface structure coupled to the layer structures and a metal body directly on the metal surface structure formed by additive manufacturing. 1. A component carrier , wherein the component carrier comprises:a carrier body formed of a plurality of electrically conductive layer structures and/or electrically insulating layer structures;a metal surface structure coupled to the layer structures; anda metal body directly on the metal surface structure formed by additive manufacturing.2. The component carrier according to claim 1 ,wherein the metal body is arranged directly on the metal surface structure without material in between.3. The component carrier according to claim 1 ,wherein the metal surface structure comprises a metal foil,wherein the metal body comprises a material selected of at least one of the group consisting of copper, aluminum, silver, nickel, bronze, gold, titanium, tantalum, wolfram, molybdenum and steel.4. The component carrier according to claim 1 ,wherein the metal body comprises cooling fins,wherein the cooling fins comprise a fractal geometry.5. The component carrier according to claim 1 ,wherein the metal body is a heat removal body arranged for forced water flow,wherein the metal body functioning as a heat pipe comprises a tube extending at least partially along the metal surface structure,wherein the tube surrounds at least partially a heat generating component.6. The component carrier according to claim 1 ,wherein the metal body comprises at least one locally roughened surface which has a higher roughness than other surfaces of the metal body for providing a heat exchange with a cooling medium or enhanced irradiation,wherein the metal surface structure or the metal body forms an electrical contact element selected from the group consisting of a contact pad, a contact line or a ...

Fabrication of Intra-Structure Conductive Traces and Interconnects for Three-Dimensional Manufactured Structures

A method for forming a three-dimensional object with at least one conductive trace comprises providing an intermediate structure that is generated (e.g., additively or subtractively generated) from a first material in accordance with a model design of the three-dimensional object. The intermediate structure may have at least one predefined location for the at least one conductive trace. The model design includes the at least one predefined location. Next, the at least one conductive trace may be generated adjacent to the at least one predefined location of the intermediate structure. The at least one conductive trace may be formed of a second material that has an electrical and/or thermal conductivity that is greater than the first material.

EMI SHIELDING STRUCTURE

An EMI shielding structure includes a shielding pad surrounding at least one circuit component mounted on a printed circuit board and grounded to a ground pad disposed on the printed circuit board; and a shield can configured to cover the at least one circuit component, wherein a portion of the shield can is attached to the shielding pad. 1. An electromagnetic interference (EMI) shielding structure comprising:a shielding pad surrounding at least one circuit component mounted on a printed circuit board and grounded to a ground pad disposed on the printed circuit board; anda shield can configured to cover the at least one circuit component, wherein at least a portion of the shield can is attached to the shielding pad.2. The EMI shielding structure of claim 1 , whereina lower end portion of a side wall of the shield can is embedded in an upper portion of the shielding pad.3. The EMI shielding structure of claim 2 , whereinthe lower end portion of the side wall of the shield can is bent.4. The EMI shielding structure of claim 3 , whereina width of the shielding pad is greater than a width of the lower end portion of the side wall of the shield can.5. The EMI shielding structure of claim 1 , further comprising:a shielding member comprising a shielding material at least partially covering a side wall of the shield can and an upper portion of the shielding pad.6. The EMI shielding structure of claim 5 , whereinthe shielding member covers the entire side wall of the shield can and at least a portion of an edge portion of a top surface of the shield can.7. The EMI shielding structure of claim 1 , further comprising:an insulator at least partially covering a side wall of the shield can and an upper portion of the shielding pad.8. The EMI shielding structure of claim 7 , whereinthe insulator covers a portion of a top surface of the printed circuit board.9. The EMI shielding structure of claim 3 , whereinthe lower end portion of the shield can includes at least one groove.10. ...

APPARATUS FOR LAYING CONDUCTIVE PATHWAYS, METHOD OF LAYING CONDUCTIVE PATHWAYS AND TEXTILE PRODUCT COMPRISING CONDUCTIVE PATHWAYS

A conductive tape formed by laying a conductive pathway on a tape layer is disclosed. Various apparatus and methods for laying conductive pathways to form conductive tape are disclosed. The conductive pathways may be laid by varying the lateral position of the conductive pathway on the tape substrate. Such patterns all stretchable conductive tape to be realized. Multiple conductive pathways may be laid in the tape and the lateral separation of the pathways in the tape may vary. In some embodiments the pathways are formed from conductive yarn or by printing or laying conductive ink. 1. An apparatus for laying conductive pathways on a tape to form a conductive tape , the apparatus comprising:a pair of surfaces arranged to apply a bonding pressure;a first conductive pathway laying device configured to lay a first conductive pathway on the tape and configured to vary the lateral position of the first conductive pathway as the tape moves through the pair of surfaces.2. An apparatus according to claim 1 , further comprising a second conductive pathway laying device configured to lay a second conductive pathway on the tape and configured to vary the lateral position of the second conductive pathway as the tape moves through the pair of surfaces claim 1 , wherein the first conductive pathway laying device and/or the second conductive pathway laying device are configured to vary a lateral separation between the first conductive pathway and the second conductive pathway.3. An apparatus according to wherein the first conductive pathway laying device comprises a first yarn position controller arranged to control the lateral position of a first conductive yarn on the tape when the bonding pressure is applied.4. An apparatus according to claim 1 , wherein the second conductive pathway laying device comprises a second yarn position controller arranged to control the lateral position of a second conductive yarn on the tape when the bonding pressure is applied.5. An apparatus ...

METHOD AND SYSTEM FOR LOW TEMPERATURE PRINTING OF CONDUCTIVE METAL ALLOYS

System and method of producing on-demand three-dimensional (3D) printed devices on flexible substrates such as paper, plastic, or polymer using metal alloy nanopowders at low temperatures of printing in the range of 150 degrees Celsius (C) to 300 degrees C. The printer disclosed herein may employ a computer-aided design graphics file given as an input to the printer. The printer will selectively release and print the metal alloy nanopowders on select areas on the substrate to form a conductive pattern. 1. A method comprising:printing a conductive pattern on a flexible substrate using metal alloy nanopowders, wherein the nanopowders are in the range of approximately 1 nanometers (nm) to approximately 20 nm in diameter; andfusing the nanopowders on the flexible substrate at a temperature ranging from approximately 150 degrees Celsius (C) to 300 degrees C. in a fuser.2. The method of claim 1 , wherein the nanopowders are in the range of approximately 2 to approximately 10 nm in diameter.3. The method of claim 1 , wherein the fusing of the nanopowders on the flexible substrate occurs at a temperature ranging from approximately 200 degrees C. to approximately 250 degrees C. without the use of any of the group consisting of the following: surface modifiers claim 1 , organic surfactants claim 1 , and surface treating agents.4. The method of claim 1 , wherein the conductive pattern forms a plurality of metal circuits.5. The method of claim 1 , wherein the nanopowders are from the group consisting of copper (Cu) claim 1 , silver (Ag) claim 1 , tin (Sn) claim 1 , nickel (Ni) claim 1 , gold (Au) and their alloys.6. The method of claim 1 , further comprising: forming the nanopowder in a flame spray reactor.7. The method of claim 1 , wherein the nanopowders are applied to the substrate using an aerosol stream.8. The method of claim 1 , wherein the conductive patterns are received as a computer aided design (CAD) file.9. The method of claim 1 , wherein the printing of the ...

METHOD FOR PRODUCING CERAMIC CIRCUIT BOARD

A method for producing a ceramic circuit board including a ceramic substrate and a metal circuit formed on the ceramic substrate. The disclosed method includes a step of forming the first metal layer in contact with the ceramic substrate by spraying a first metal powder containing at least either of aluminum particles or aluminum alloy particles together with an inert gas onto a surface of a ceramic substrate from a nozzle, in which the first metal powder is heated to from 10° C. to 270° C. and then ejected from the nozzle and a gauge pressure of the inert gas at an inlet of the nozzle is from 1.5 to 5.0 MPa, a step of subjecting the first metal layer to a heat treatment in an inert gas atmosphere, and the like. 1. A method for producing a ceramic circuit board including a ceramic substrate and a metal circuit formed on the ceramic substrate , the metal circuit having a first metal layer containing at least either of aluminum or an aluminum alloy and a second metal layer containing at least either of copper or a copper alloy , the method comprising:a step of forming the first metal layer in contact with the ceramic substrate by spraying a first metal powder containing at least either of aluminum particles or aluminum alloy particles together with an inert gas onto a surface of the ceramic substrate from a nozzle, the first metal powder being heated to from 10° C. to 270° C. and then ejected from the nozzle, and a gauge pressure of the inert gas at an inlet of the nozzle being from 1.5 to 5.0 MPa;a step of subjecting the first metal layer formed on the ceramic substrate to a heat treatment in an inert gas atmosphere;a step of forming the second metal layer in contact with the first metal layer by spraying a second metal powder containing at least either of copper particles or copper alloy particles together with an inert gas onto a surface of the first metal layer from a nozzle, the second metal powder being heated to from 10° C. to 650° C. and then ejected from the ...

Alignment of components coupled to a flexible substrate for wearable devices

Embodiments relate generally to wearable electrical and electronic hardware, computer software, wired and wireless network communications, and to wearable/mobile computing devices. More specifically, various embodiments are directed to, for example, aligning a flexible substrate and/or components thereof during fabrication to enhance reliability. In one example, a method includes forming a framework that includes, for example, a portion (e.g., an anchor portion) configured to couple to a flexible substrate, the portion having a neutral axis. Also, the method may include forming a flexible substrate that includes a supported flex region including conductors and one or more rigid regions configured to receive one or more components. A rigid region might include an encapsulated rigid region. The method further may also include aligning the encapsulated rigid region at an angle to the neutral axis, and molding over the encapsulated rigid region.

Screen printer improved in solder separation and method of controlling the same

Disclosed are a screen printer improved in solder separation and a method of controlling the same, in which close contact between a printed circuit board and a mask unit is enhanced to thereby improve the solder separation and stably supply a fixed quantity of solder supplied through a squeeze unit to the printed circuit board.

DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF

A display device and a manufacturing method thereof are provided. The display device includes a first substrate, a second substrate, a drive IC and a protection layer. The first substrate has a first region and a second region. The second substrate is correspondingly disposed on the first region. The drive IC is disposed on the second region. The protection layer is disposed enclosing the drive IC, and the protection layer has a maximum height larger than the height of the drive IC. 1. A display device , comprising:a first substrate having a first region and a second region;a second substrate correspondingly disposed on the first region;a drive IC disposed on the second region; anda protection layer disposed on the second region, wherein the protection layer is disposed enclosing the drive IC, and the protection layer has a maximum height larger than a maximum height of the drive IC.2. The display device according to claim 1 , wherein a top surface of the protection layer is higher than a top surface of the drive IC claim 1 , a distance between the top surface of the protection layer and the top surface of the drive IC in a normal direction of the first substrate ranges from 0.01 mm to 0.35 mm.3. The display device according to claim 2 , wherein at least part of the top surface of the protection layer is curved.4. The display device according to claim 2 , wherein the protection layer covers at least part of the top surface of the drive IC.5. The display device according to claim 1 , wherein the protection layer comprises a recess corresponding to the driver IC.6. The display device according to claim 1 , wherein the protection layer comprises adhesives claim 1 , epoxy resin or polyurethane.7. The display device according to claim 1 , further comprising:a flexible circuit board and a printed circuit board, the drive IC is electrically connected to the printed circuit board through the flexible circuit board, and the flexible circuit board is disposed between the ...

METHOD FOR PRODUCING A PRINTED CIRCUIT BOARD PROVIDED WITH AT LEAST ONE COATING, AND COATING HEAD FOR CARRYING OUT THE METHOD

The present disclosure includes a method for producing a printed circuit board having at least one coating includes mixing a first component with a second component of a two component coating system to form a coating mixture by means of a dynamic mixer or by means of a static-dynamic mixer. The method also includes supplying the coating mixture to an output unit, and coating the printed circuit board by outputting the coating mixture using the output unit onto the printed circuit board. The output unit is moved automatically in at least one, two, or three dimensions relative to the printed circuit board. The mixer is connected with the output unit in such a manner that it is moved together with the output unit relative to the printed circuit board. The present disclosure also includes a coating head for performing the method. 115-. (canceled)16. A method for producing a printed circuit board having at least one coating , comprising the following steps:mixing at least a first component with a second component of an at least two component coating system to form a coating mixture using a dynamic mixer or a static-dynamic mixer;supplying the coating mixture to an output unit; andcoating the printed circuit board by outputting the coating mixture by means of the output unit onto the printed circuit board;wherein the output unit during the coating is moved automatically in at least one dimension relative to the printed circuit board;wherein the mixer is connected in such a manner with the output unit that it is moved together with the output unit relative to the printed circuit board.17. The method of claim 16 , wherein the output unit outputs the coating mixture with a cross sectional area of no more than 1% of the area of the printed circuit board.18. The method of claim 16 , wherein the output unit outputs the coating mixture with a cross sectional area claim 16 , whose longest dimension amounts to no more than a third of the square root of the area of the printed ...

A Circuit Board and Component Fabrication Apparatus

A circuit board and component fabrication apparatus comprises a print head configured to deposit one or more materials on a substrate so as to print electronic circuit boards and/or components. 1. A circuit board and component fabrication apparatus , comprising:a print head configured to deposit one or more materials on a substrate so as to print electronic circuit boards and/or components.2. The apparatus of claim 1 , wherein the print head comprises:an X, Y drive system for driving the print head relative to the substrate; anda dispenser for dispensing the one or more materials.3. The apparatus of claim 2 , wherein the dispenser comprises at least:a pressure cylinder;a pressure control unit and drive;a pressure extension arm; anda pressure extension arm stop and empty sensor.4. The apparatus of claim 1 , wherein the print head further comprises a curing energy source to cure the material deposited on the substrate.5. The apparatus of claim 4 , wherein the print head comprises at least one additional curing energy source.6. The apparatus of claim 4 , wherein the at least one energy source comprises one or more of an infra-red claim 4 , ultra violet or other frequency light emitting diode claim 4 , a directed heating element claim 4 , a radio frequency sonic directed frequency or a high energy broad spectrum curing system.7. The apparatus of claim 1 , wherein the print head comprises at least one material dispensing nozzle.8. The apparatus of claim 7 , wherein the print head further comprises at least one additional material dispensing nozzle.9. The apparatus of claim 8 , wherein the material dispensing nozzles are each positioned so as to dispense material at or near the same location claim 8 , so as to allow materials from different ones of the material dispensing nozzles to be combined at a point of dispensing.10. The apparatus of claim 7 , wherein the height of at least one of the material dispensing nozzles is adjustable.11. The apparatus of claim 7 , wherein ...

Automatic solder paste addition apparatus for solder paste printer

The present application provides an automatic solder paste addition apparatus and system for a solder paste printer, the apparatus comprising: a push rod, a pressure plate, a support plate, a movable plate and a working platform; the pressure plate moves up and down as the push rod moves up and down, the support plate is fixed in relation to movement of the push rod, an outer side of the movable plate is disposed on the support plate so as to be capable of sliding up and down, the pressure plate is disposed on an inner side of the movable plate so as to be capable of sliding up and down, and the working platform is fixed to the movable plate and used for bearing a solder paste tub, wherein a lower one-way locking mechanism is provided between the movable plate and the support plate, the lower one-way locking mechanism being configured to lock the movable plate when the movable plate is in the working position, so that the movable plate cannot move downward; and wherein an upper locking mechanism is provided between the movable plate and the pressure plate, the upper locking mechanism being configured so that the pressure plate can move relative to the movable plate when the movable plate is not moving, and can also move together with the movable plate when the movable plate is moving.

Three dimensional sub-mm wavelength sub-thz frequency antennas on flexible and uv-curable dielectric using printed electronic metal traces

Novel methods for micro-additive manufacturing three dimensional sub-millimeter components are disclosed herein. The methods can include dispensing a dielectric at positions on a substrate so as to provide dielectric structures having an aspect ratio of up to 1:20. The methods can also include in-situ curing of the dielectric structure upon dispensing of the dielectric wherein the dispensing and curing steps provide for three dimensional configurations. Direct printing a metal nanoparticle solution on the dielectric to create conductive traces and thereafter sintering the printed nanoparticle solution so as to cure the conductive traces enables three dimensional conductive (antenna) elements having a length and width scale of down to 1 μm.

SYSTEMS AND METHODS FOR ENHANCED COATING DISPENSING CONTROLS

Systems and methods for enhanced coating dispensing controls are disclosed. A dispensing system is configured to apply material to a sequence of substrates. The dispensing system applies a first amount of material to a first substrate according to a first value of an operating parameter. A sensor is used to measure a characteristic of the first amount of material applied on the first substrate. Based on the characteristic of the first amount of material applied on the first substrate, a characteristic of an amount of material, after being applied on a subsequent substrate in the sequence of substrates, is estimated to be outside of a range. The value of the operating parameter is adjusted in response and a second amount of material is applied to a second substrate. 1. A method for controlling a dispensing system , the dispensing system being operated by a controller and having a dispensing device configured to apply a liquid or viscous material to a sequence of substrates that are moved through the dispensing system , the method comprising:operating the dispensing device to apply a first amount of material to a first substrate of the sequence of substrates according to a first value of an operating parameter of the dispensing system;measuring, using a sensor, a characteristic of the first amount of material applied on the first substrate;determining, based on the characteristic of the first amount of material applied on the first substrate, that a characteristic of an amount of material, after being applied on a subsequent substrate in the sequence of substrates, is estimated to be outside of a range;adjusting the value of the operating parameter to a second value in response to the determination that the characteristic of the amount of material, after being applied on the subsequent substrate, is estimated to be outside of the range; andapplying, according to the second value of the operating parameter, a second amount of material from the dispensing device to a ...

METHODS OF DISPENSING A METALLIC NANOPARTICLE COMPOSITION FROM A NOZZLE ONTO A SUBSTRATE

A method of dispensing a metallic nanoparticle composition along a trajectory on a substrate is disclosed. The composition is dispensed from a nozzle through its outlet. The outlet is characterized by an outlet size. First, an initial pressure is applied to the composition in the nozzle to cause the composition to flow from the outlet. The nozzle is positioned at a height such that the composition does not flow onto the substrate. Second, the nozzle is lowered toward the substrate such that a fluid bridge forms between the outlet and the substrate and an adjusted pressure is applied to the composition in the nozzle. The adjusted pressure is lower than needed for the composition to continue to flow from the outlet. Third, the fluid is dispensed from the nozzle. A dispensing pressure is applied to the fluid while the nozzle is laterally displaced along the trajectory on the substrate. 1. A method of dispensing a metallic nanoparticle composition along a trajectory on a substrate , comprising of steps of:providing a nozzle comprising an inlet, an outlet, and an elongate fluid passageway between the inlet and the outlet, the outlet pointing downward toward the substrate, the outlet being characterized by an outlet size;providing a metallic nanoparticle composition in the nozzle;initializing the nozzle;initializing a fluid bridge; anddispensing the composition from the nozzle onto the substrate;wherein the step of initializing the nozzle comprises applying an initial pressure to the composition in the nozzle to cause the composition to flow from the outlet and positioning the outlet at an initial height above the substrate such that the composition does not flow onto the substrate;wherein the step of initializing a fluid bridge is carried out after the step of initializing the nozzle and comprises (1) lowering the outlet from the initial height toward the substrate such that a fluid bridge forms between the outlet and the substrate and the outlet is not in direct contact ...

MANUFACTURING PROCESS OF A POSITIONING CONTROL TOOL VIA 3D-PRINTING TECHNOLOGY

A manufacturing process to form a positioning control tool, such as a gyroscope, by using a three-dimensional (3D) printer printing a polymer material mixed with powdered graphene () components () on a piezoelectric substrate (), the components () include: a resonator () transducer configured to create a first surface acoustic wave (); a pair of reflectors () configured to reflect the first surface acoustic wave (); a structure () which, when subjected to a Coriolis force, creates a second surface acoustic wave (); a first sensor transducer () configured to sense the second surface acoustic wave (); and a second sensor transducer () configured to sense a residual surface acoustic wave from a second region of the surface () of the piezoelectric substrate free of the structures that respond to the Coriolis force. 1. A method to 3D print a gyroscope , wherein the method includes:3D print an insulating 3D-printing polymer material to form a first part of a frame for the gyroscope;3D print a polymer material mixed with powdered graphene on the first part of the frame to form a piezoelectric substrate;3D print a pattern on the piezoelectric substrate, wherein the pattern has apertures; a resonator transducer configured to create a first surface acoustic wave on a surface of the piezoelectric substrate;', 'a pair of reflectors configured to reflect the first surface acoustic wave to form a standing wave within a first region of the surface and between the pair of reflectors;', 'a structure within the first region wherein the structure is subject to a Coriolis force to create a second surface acoustic wave on the piezoelectric substrate;', 'a first sensor transducer disposed on the surface and configured to sense the second surface acoustic wave; and', 'a second sensor transducer disposed on the surface and configure to sense a residual surface acoustic wave from a second region of the surface, wherein the second region is separated form the structure, and the second sensor ...

Calibration methods for a viscous fluid dispensing system

A method for calibrating a fluid dispensing system includes the steps of locating an external reference point with an optical sensor, moving a fluid dispenser to the external reference point, dispensing fluid with the fluid dispenser at the external reference point, locating the dispensed fluid with the optical sensor, calculating a distance between the location of the external reference point and the location of the dispensed fluid, determining a correction value based at least in part on the calculated distance, and using the correction value to improve placement accuracy of dispensed fluid.

Material temperature sensor for stencil printer

A print head assembly of a stencil printer includes a print head frame and a wiper blade assembly coupled to the print head frame. The wiper blade assembly includes wiper blades that contact the stencil to print solder paste onto the stencil during a print stroke. The wiper blades are configured to force solder paste through the apertures of the stencil. The print head assembly further includes a dispensing unit coupled to the print head frame. The dispensing unit is disposed between the wiper blades to deposit solder paste between the wiper blades. The dispensing unit includes a cartridge receiver. The print head assembly further includes a cartridge positioned in the cartridge receiver and a sensor coupled to the print head frame proximate the cartridge. The sensor is configured to measure a temperature of the cartridge.

LOW COST APPROACH FOR DEPOSITING SOLDER AND ADHESIVES IN A PATTERN FOR FORMING ELECTRONIC ASSEMBLIES

A method for depositing a material to join two surfaces of an electronic assembly includes determining, using dimensions of a pad area of a substrate, a deposition pattern for the material that extends across the pad area of the substrate. The method further includes creating a tool to deposit the material in the deposition pattern that extends across the pad area of the substrate. 1. A method for depositing a material to join two surfaces of an electronic assembly , the method comprising:determining, using dimensions of a pad area of a substrate, a deposition pattern for the material that extends across the pad area of the substrate; andcreating a tool to deposit the material in the deposition pattern that extends across the pad area of the substrate.2. The method of further comprising using the tool to deposit the material in an array of discrete domains that extends across the pad area of the substrate.3. The method of claim 1 , wherein the material comprises a solder paste.4. The method of claim 1 , wherein the material comprises an adhesive.5. The method of claim 1 , wherein a pitch of the array of discrete domains is about 0.254 to about 1.27 millimeters (mm) claim 1 , and a spacing of the array of discrete domains is about 0.001 to about 0.254 millimeters (mm).6. The method of claim 1 , wherein the tool comprises a stencil having an array of apertures.7. The method of claim 1 , wherein the tool comprises a direct deposition machine.8. A method for depositing a material to join two surfaces of an electronic assembly claim 1 , the method comprising:using a tool to deposit an array of discrete domains of the material in a deposition pattern that extends across a pad area of a substrate, the deposition pattern comprising an array of discrete domains that extends across the pad area of the substrate and has a tangency with respect to an edge of the pad area of about or less than 0.127 millimeters (mm).9. The method of claim 8 , wherein the material comprises a ...

Estimation device

A soldering device includes a detection sensor which can detect a liquid level height of molten solder inside a solder bath. It is determined whether or not a detection height which is the detected liquid level height is greater than or equal to a first set height which is arbitrarily set. In a case where the detection height is greater than or equal to the first set height, it is estimated that the amount of molten solder capable of performing a soldering work for a predetermined number or more of boards is stored in the solder bath. The amount of molten solder stored in the solder bath is estimated by multiplying a difference between a detection height which is the detected liquid level height of the molten solder and a second set height which is preset, by an area inside the solder bath in a horizontal direction.

DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF

A manufacturing method of a display device is disclosed. The method includes the following steps. A first substrate having a first region and a second region is provided. A second substrate is disposed on the first substrate. The second substrate is overlapping the first region. At least one drive IC is disposed on the second region. A protection layer is disposed on the second region. The protection layer is disposed enclosing the at least one drive IC. The protection layer has a maximum height larger than a maximum height of the at least one drive IC. 1. A display device , comprising:a first substrate having a first region and a second region near to the first region;a second substrate disposed on the first region and having a lateral side;a plurality of drive ICs disposed on the second region and arranged along the lateral side; andat least one flexible circuit board disposed on the second region and disposed correspondingly to the lateral side;wherein in a top view of the display device, at least one of the plurality of drive ICs does not overlap with the at least one flexible circuit board in a direction perpendicular to an extending direction of the lateral side.2. The display device according to claim 1 , wherein the at least one of the plurality of drive ICs and the at least one flexible circuit board are separated from each other by a distance in the extending direction.3. The display device according to claim 1 , wherein the at least one flexible circuit board is disposed between two adjacent ones of the plurality of drive ICs.4. The display device according to claim 3 , wherein the at least one flexible circuit board are separated from the two adjacent ones of the plurality of drive ICs for different distances.5. The display device according to wherein at least two of the plurality of drive ICs are disposed between two adjacent ones of the at least one flexible circuit board.6. The display device according to claim 1 , wherein a distance between two ...

METHOD FOR REPAIRING CONDUCTOR TRACKS

A method for modifying an elongate structure including providing a fluid deposited onto the substrate, the fluid containing a dispersion of electrically polarizable nanoparticles and applying an AC voltage across a portion of the elongate structure so as to cause an alternating electric current to pass through the narrow section such that a break in the elongate structure is formed at the narrow section, the break being defined between a first broken end and a second broken end of the elongate structure, and then cause, when the break is formed, an alternating electric field to be applied to the fluid such that a plurality of the nanoparticles contained in the fluid are assembled to form a continuation of the elongate structure extending from the first broken end towards the second broken end so as to join the first and second broken ends. 1. A method of modifying an elongate structure , the method comprising:providing on a substrate an elongate structure formed of assembled electrically polarizable nanoparticles, the elongate structure including a narrow section to be modified;providing a fluid deposited onto the substrate, the fluid containing a dispersion of electrically polarizable nanoparticles and being positioned so that at least the narrow section of the elongate structure is immersed therein; and cause an alternating electric current to pass through the narrow section such that a break in the elongate structure is formed at the narrow section, the break being defined between a first broken end and a second broken end of the elongate structure, and then', 'cause, when the break is formed, an alternating electric field to be applied to the fluid such that a plurality of the nanoparticles contained in the fluid are assembled to form a continuation of the elongate structure extending from the first broken end towards the second broken end so as to join the first and second broken ends., 'applying an AC voltage across a portion of the elongate structure that ...

VERTICAL EMBEDDED COMPONENT IN A PRINTED CIRCUIT BOARD BLIND HOLE

A printed circuit board (PCB) comprises a blind via and a discrete component vertically embedded within the blind via. 1. A printed circuit board (PCB) comprising:a blind via; anda discrete component vertically embedded within the blind via.2. The PCB of claim 1 , wherein the discrete component is vertically embedded under a ball grid array coupling the PCB to an integrated circuit (IC) package.3. The PCB of claim 1 , wherein the discrete component is a decoupling capacitor.4. The PCB of claim 1 , further comprising:a conductive pad layered in the blind via below the discrete component; anda solder paste layered over the discrete component.5. The PCB of claim 1 , wherein vertically embedding the discrete component comprises:performing a blind via process on the PCB;performing an assembly process on the PCB; andperforming a via-in-pad process on the PCB.6. The PCB of claim 5 , wherein performing the blind via process comprises:producing a multilayer board; andperforming an ablation process to produce depth of the blind via.7. The PCB of claim 6 , wherein performing the ablation process comprises performing a direct laser ablation.8. The PCB of claim 6 , wherein performing the ablation process comprises performing a combination of a mechanical drill with laser ablation.9. The PCB of claim 6 , wherein performing the assembly process comprises:injecting a solder paste into the blind via;plugging the discrete component into the blind via;applying a solder paste on the top layer of the PCB; andperforming a reflow to permanently attach the component to the PCB.10. The PCB of claim 9 , wherein the solder paste is injected using a solder jet printer to control a location and an amount of solder paste to be injected.11. The PCB of claim 9 , wherein the solder paste is applied on the PCB by spraying the solder paste on using a stencil.12. The PCB of claim 9 , wherein the solder paste is applied on the PCB by spraying the solder paste using a jet printer.13. A method for ...

Interdigitated chip capacitor assembly

A method of registering terminals on an interdigitated chip capacitor (“IDC”) with a plurality of contact pads on a substrate. At least one vertically extending nonconductive abutment surface is formed between adjacent ones of the contact pads. A plurality of grooves projecting outwardly from said a central recess is formed on the substrate top portion. At least one sidewall portion of the IDC is urged into abutting engagement with the at least one abutment surface on the substrate. Another method prevent solder from causing short circuits between adjacent terminals. A plurality of grooves extending laterally outwardly from a central recessed portion are formed. The plurality of grooves defining a plurality of inwardly projecting fingers. A plurality of contact pads on are formed on a respective plurality of fingers. A solder bead is formed on at least some of the plurality of contact pads. The at least one solder bead is isolated from adjacent solder beads and adjacent terminals.

COMPONENT MOUNTING LINE AND COMPONENT MOUNTING METHOD

A component mounting line has a screen printing apparatus and component mounting apparatuses. The screen printing apparatus carries in substrates based on substrate carrying-in order data which is determined so that alternate carrying-in in which a first type substrate and a second type substrate are alternately carried in and continuous carrying-in in which the first type substrate or the second type substrate which has a shorter line tact time is continuously carried in are mixed. 1. A component mounting line comprising:a screen printing apparatus that prints paste on a substrate; anda plurality of component mounting apparatuses that are arranged in series on a downstream side of the screen printing apparatus and perform a component mounting-relevant operation on the substrate on which the paste has been printed by the screen printing apparatus, a mask in which a first pattern-forming area in which a first pattern corresponding to a first type substrate is formed and a second pattern-forming area in which a second pattern corresponding to a second type substrate is formed are arranged in a predetermined pattern arrangement direction,', 'a substrate support unit moving mechanism that moves a substrate support unit supporting a substrate in the pattern arrangement direction below the mask and that selectively brings the substrate into contact with one of the first pattern-forming area and the second pattern-forming area, and', 'a print head that prints the paste on the substrate selectively brought into contact with one of the first pattern-forming area and the second pattern-forming area by moving over the mask,, 'wherein the screen printing apparatus includes'}wherein each of the plurality of component mounting apparatuses includes a first substrate carrying lane and a second substrate carrying lane which are arranged in the pattern arrangement direction, carries the first type substrate on which the first pattern has been printed in the first substrate carrying ...

DEVICE AND METHOD FOR PRODUCING AN ELECTRICAL CONNECTING CONTACT ON A COATED METAL SHEET

An apparatus and a method are disclosed for producing an electric terminal contact on a coated sheet, whose coating has at least one electric conductor path covered by an electrical insulation layer, in which apparatus and method a recess is produced extending through the insulation layer at least to the electrical conductor path and in this recess, an electrically conductive contact element is provided, one end of which is electrically connected to the conductor path and at the other end of which forms the electrical terminal contact. In order to increase the reproducibility, the proposal is made for the recess to be produced with the aid of a hollow needle, which is advanced in the direction toward the conductor path and which, as it is withdrawn from the recess, introduces an electrically conductive, viscous compound into this recess in order to produce the contact element. 1. A method for producing an electric terminal contact on a coated sheet , whose coating has at least one electric conductor path covered by an electrical insulation layer , the method comprising:producing a recess extending through the insulation layer at least to the electrical conductor path; andproviding an electrically conductive contact element in the recess, with one end of the electrically conductive contact element electrically connected to the conductor path and another end of the electrically conductive contact element forming the electrical terminal contact;wherein the recess is produced with the aid of a hollow needle, which is advanced in a direction toward the conductor path and, as the hollow needle is withdrawn from the recess, the hollow needle introduces an electrically conductive, viscous compound into the recess in order to produce the contact element.2. The method according to claim 1 , wherein a paste or an ink is introduced as the viscous compound.3. The method according to claim 1 , comprising measuring at least one measurement variable claim 1 , which depends on a ...

Method of manufacturing electronic unit

There is provided a method of manufacturing an electronic unit that includes an electronic component having a rectangular plate shape and generating heat during operation, and a heat dissipation gel covering the electronic component. The method includes a side surface coating step of coating opposite two side surfaces of four side surfaces of the electronic component with the heat dissipation gel by discharging the heat dissipation gel from a flat-shaped opening of a nozzle, and a top surface coating step of coating a top surface of the electronic component by discharging the heat dissipation gel from the opening of the nozzle after completion of the side surface coating step.

Methods for continuously moving a fluid dispenser while dispensing amounts of a fluid material

Methods for applying fluid materials to a substrate, such as circuit board, while continuously moving the fluid dispenser are disclosed. Initially, a dispenser is continuously moved through a constant motion trajectory connecting the plurality of dispense locations on the substrate. The electrical output signals generated by one or more of encoders of the dispenser are monitored as the dispenser is continuously moved through the constant motion trajectory. The dispenser is triggered at each of the plurality of dispense locations and droplets of the fluid material are jetted while continuously moving the dispenser. The spatial coordinates of each droplet of the fluid material on the substrate are measured and compared to expected landing coordinates for each droplet of the fluid material to generate a spatial error for each droplet of the fluid material. At least one dispense location is corrected and an updated constant motion trajectory is generated.

Touch substrate manufactured by three-dimensional printing and method for manufacturing the same

A touch substrate manufactured by three-dimensional printing and a method for manufacturing the same are disclosed. The method for manufacturing the touch substrate works together with a three-dimensional printer. The three-dimensional printer includes a first nozzle, a second nozzle, and a light source. The method includes the steps of: jetting a photocuring material by the first nozzle and exposing the photocuring material to the light source to form a base layer; jetting a conductive material on the base layer by the second nozzle and exposing the conductive material to the light source to form a touch electrode layer; and jetting the photocuring material on the base layer and the touch electrode layer by the first nozzle and exposing the photocuring material to the light source to form a protective layer. The touch electrode layer is embedded between the base layer and the protective layer.

Backplane module and method of manufacturing same

A method of manufacturing a backplane module includes providing a thermally conductive substrate, and applying a predetermined volume of epoxy extending between a first electrical component disposed on the thermally conductive substrate and a second electrical component disposed on the thermally conductive substrate to create an electrical pathway therebetween.

METHOD OF USING HAND-MADE CIRCUIT BOARD FOR LEARNING

A method of using a hand-made circuit board for learning includes: providing a hand-made circuit board which comprises a substrate; and a medium layer disposed on a surface of the substrate to form a pattern, wherein the medium layer has a notably paintable non-conductive zone configured with a plurality of electrical blocks, and the electrical blocks are discontinuously distributed in the notably paintable non-conductive zone, so that the electrical blocks on at least one cross-section of the notably paintable non-conductive zone are not electrically connected; and drawing a drawn conductive layer on the notably paintable non-conductive zone of the pattern by an end user, wherein the drawn conductive layer has conductive particles linking the electrical particle blocks in the notably paintable non-conductive zone, thereby electrically connecting the electrical particle blocks to complete a circuit line. 1. A method of using a hand-made circuit board for learning , comprising:providing a hand-made circuit board which comprises a substrate and a medium layer disposed on a surface of the substrate to form a pattern, wherein the medium layer has a notably paintable non-conductive zone configured with a plurality of electrical blocks, and the electrical blocks are discontinuously distributed in the notably paintable non-conductive zone, so that the electrical blocks on at least one cross-section of the notably paintable non-conductive zone are not electrically connected; anddrawing a drawn conductive layer on the notably paintable non-conductive zone of the pattern by an end user, wherein the drawn conductive layer has conductive particles linking the electrical particle blocks in the notably paintable non-conductive zone, thereby electrically connecting the electrical particle blocks to complete a circuit line.2. The method according to claim 1 , wherein the medium layer further has a conductive zone configured with a plurality of electrical blocks claim 1 , and the ...

NANOPARTICLE APPLICATION WITH ADHESIVES FOR PRINTABLE ELECTRONICS

A circuit assembly can be made by adhering a conductive element to a substrate with an adhesive. A first layer including an adhesive can be applied over at least a portion of a surface of the substrate. A second layer including a conductive metal can be applied over at least a portion of the first layer. The first layer and the second layer can be exposed to a temperature for a duration of time to (1) fuse the conductive metal together in at least a portion of the first layer and (2) cure the adhesive of the second layer. The fusing can be substantially complete before the curing is substantially complete to enhance bonding of the adhesive to the fused conductive metal. 1. A method of forming a conductive element on a substrate , the method comprising:applying a first layer first layer comprising an adhesive over at least a portion of a surface of a substrate;applying a second layer comprising particles of a conductive metal over at least a portion of the first layer; andexposing the first layer and the second layer to a temperature for a duration of time to (1) fuse the particles of the conductive metal together in at least a portion of the first layer and (2) cure the adhesive of the second layer, wherein the fusing is substantially complete before the curing is substantially complete.2. The method of claim 1 , wherein the temperature is no more than 240° C.3. The method of claim 1 , wherein the second layer further comprises a curing agent configured to catalyze curing of the adhesive.4. The method of claim 1 , wherein a thickness of the second layer is greater than a thickness of the first layer.5. The method of claim 1 , wherein the adhesive is nonconductive.6. The method of claim 1 , wherein the adhesive has an electrical polarity that is greater than an electrical polarity of the particles of the conductive metal.7. The method of claim 1 , wherein the exposing comprises infiltrating the first layer with the conductive metal.8. The method of claim 1 , wherein ...

Electrohydrodynamic printing of nanomaterials for flexible and stretchable electronics

Disclosed are examples for printing a one-dimensional (1D) nanomaterial for use in stretchable electronic devices. An ink comprising a nanomaterial solution is dispersed from a pneumatic dispensing system of a printing device. The 1D nanomaterial is printed in a predefined pattern on an underlying substrate positioned on a ground electrode. A voltage is applied between the printing nozzle and the ground electrode to cause the ink to form into a cone during the printing. The substrate can be modified to increase the wettability of the substrate to enhance adhesion of the ink to the substrate.

METHOD FOR COATING CONDUCTIVE SUBSTRATE WITH ADHESIVE

Disclosed is a method of coating a conductive substrate with an adhesive, wherein the amounts and positions of conductive and non-conductive adhesives for bonding a plurality of circuit elements to the conductive substrate are set, thus preventing the spread of the adhesive from causing defects, including a poor aesthetic appearance, low electrical conductivity, and short circuits. 1. A method of coating a conductive substrate with an adhesive using an adhesive-discharging device for bonding a plurality of circuit elements to the conductive substrate , on which an electrode is formed so as to enable conduction of an electrical signal , {'br': None, 'M=AVT'}, 'wherein one or more center points are set at positions at which one or more transverse reference lines extending in a transverse direction and one or more longitudinal reference lines extending in a longitudinal direction intersect each other on a bonding area to which a circuit element is bonded, a nozzle of the adhesive-discharging device is positioned directly above each of the center points, and the adhesive is discharged in an amount calculated using the following Mathematical Formulawherein M=flow rate, A=inner diameter of nozzle, V=speed, and T=time, in which an inner diameter of the nozzle and the speed are fixed and the time is changed to thereby adjust the amount of the adhesive that is discharged depending on the inner diameter of the nozzle.2. The method of claim 1 , wherein the adhesive comprises a conductive adhesive and a non-conductive adhesive claim 1 , a number of the center points on the bonding area is set in a range from 1 to 4 claim 1 , and the adhesive is discharged using the nozzle claim 1 , which is positioned directly above each of the center points.3. The method of claim 2 , wherein transverse reference lines claim 2 , which are set on the bonding area that is coated with the conductive adhesive claim 2 , are set to extend in a transverse direction from positions spaced apart by 10% ...

METHOD OF CALIBRATING A DISPENSER

A method is used to identify and compensate for errors created by changes in the relative positions of a deposition unit and a vision system of a dispenser. The method includes calibrating the vision system, dispensing a pattern of features over a working area, moving the vision system over a deposition location to locate a deposition, obtaining an image of the deposition, tagging data associated with the image, calculating a relative distance between the deposition unit and the vision system, storing correction data with spatial location in a file for later use, and using the stored data to make small corrections prior to dispensing additional material. 1. A method used to identify and compensate for errors created by changes in the relative positions of a deposition unit and a vision system of a dispenser , the method comprising:calibrating the vision system;dispensing a pattern of features over a working area;moving the vision system over a deposition location to locate a deposit of the pattern of features;obtaining an image of the deposit at the deposition location;processing and storing data associated with the image to obtain location data;calculating a relative distance between the deposition unit and the vision system based on the stored data to obtain correction data;storing correction data with spatial location in a file for later use; andusing the stored data to make corrections prior to depositing additional material on a substrate.2. The method of claim 1 , wherein the steps of moving the vision system claim 1 , obtaining an image of the deposit at the deposition location claim 1 , processing and storing data associated with the image and calculating a relative distance are repeated for other deposition locations.3. The method of claim 1 , further comprising claim 1 , if multiple deposition units are employed claim 1 , processing and storing data associated with images taken from each of the multiple deposition units.4. The method of claim 1 , wherein ...

Solder supply device

A solder supply device is provided with a solder cup housing liquid solder that is cylindrical and open at one end; a nozzle section, for ejecting solder from the solder container, that is inserted into the solder container; a flange section that is provided on an outer circumferential section of the nozzle section and that is engaged inside of the solder cup; solder supplied from the tip of the nozzle section by the solder cup being moved; a magnet provided in the outer circumferential surface of the solder cup; and magnetic sensors able to detect the approaching of the magnet are provided at a position facing the outer circumferential surface of the solder container. Based on the positions of the magnet and the sensor, the post-movement position of the solder container is detected and it is detected that solder has run out from inside the solder cup.

Layered manufacturing of free-form multi-material micro-components

The present invention relates to layer manufacturing, more particularly to a method for additive layer manufacturing of objects comprised of more than one material with free-form capability for all included materials. The invention can for example be used for producing packaging for Microsystems where the ceramic acts as an insulator and the secondary material is used to produce electrical or optical 3D conductor lines or electrical or optical 3D vias. The fine powder used in this method enables it to be used for building components with small feature size and demand for high precision. Other intended uses for this method is to build small mechanical precision parts or grinding tools, dental objects or medical implants.

METHOD OF DISPENSING MATERIAL BASED ON EDGE DETECTION

A dispensing system for depositing material on an electronic substrate includes a frame, a dispensing unit gantry movably coupled to the frame, a dispensing unit coupled to the dispensing unit gantry, a vision system gantry coupled to the frame, and a vision system coupled to the vision system gantry. A controller is configured to manipulate the vision system with the vision gantry system to move to the position defined by a feature, to acquire an image of at least a portion of a feature, to search for an edge of interest along a center of the image, and to return a value indicating an offset of zero (0), which is interpreted as the location that is exactly as expected, and an offset that reflects where the edge of interest intersected that axis location. 1. A dispensing system for depositing material on an electronic substrate , the dispensing system comprising:a frame;a dispensing unit gantry movably coupled to the frame;a dispensing unit coupled to the dispensing unit gantry, the dispensing unit being configured to deposit material onto the substrate during the dispense operation;a vision system gantry coupled to the frame;a vision system coupled to the vision system gantry, the vision system being configured to obtain one or more images of the electronic substrate prior to performing the dispense operation; anda controller coupled to the dispensing unit gantry, the dispensing unit, the vision system gantry, and the vision system, the controller being configured to manipulate the vision system with the vision gantry system to move to the position defined by a feature, to acquire an image of at least a portion of a feature, to search for an edge of interest along a center of the image, and to return a value indicating an offset of zero (0), which is interpreted as the location that is exactly as expected, and an offset that reflects where the edge of interest intersected that axis location.2. The dispensing system of claim 1 , wherein the controller further is ...

REAL-TIME DETECTION AND CORRECTION OF PRINTED CIRCUITRY

A method is provided for detecting faults in a conductive circuitry. The method includes: printing the conductive circuitry on top of a substrate using a printing head; heating the conductive circuitry with a heat source; scanning the heated conductive circuitry with a non-contact thermal detector; detecting, with the non-contact thermal detector and concurrently with the printing of the conductive circuitry, the faults where the printing head failed to print; and reprinting the faults with the printing head. 1. A method for detecting faults in a conductive circuitry , the method comprising:printing the conductive circuitry on top of a substrate using a printing head;heating the conductive circuitry with a heat source;scanning the heated conductive circuitry with a non-contact thermal detector;detecting, with the non-contact thermal detector and concurrently with the printing of the conductive circuitry, the faults where the printing head failed to print; andreprinting the faults with the printing head.2. The method of claim 1 , wherein the non-contact thermal detector moves and scans across a length of the substrate in a synchronized manner with movements of the printing head across the length of the substrate.3. The method of claim 1 , wherein the non-contact thermal detector avoids scanning intentional gaps designed in the conductive circuitry.4. The method of claim 1 , wherein the conductive circuitry is heated without heating the substrate.5. The method of claim 4 , wherein the conductive circuitry is heated by one selected from a group consisting of: induction claim 4 , microwave claim 4 , and radio frequency waves.6. The method of claim 5 , wherein the conductive circuitry is heated evenly across a surface of the substrate.7. The method of claim 5 , wherein the conductive circuitry is heated from one end of the substrate.8. The method of claim 1 , wherein the non-contact thermal detector is a thermal sensor array.9. The method of claim 8 , wherein the thermal ...

Piezoelectric jetting system and method with amplification mechanism

A jetting dispenser includes an actuator with a piezoelectric unit that lengthens by a first distance in response to an applied voltage, and an amplifier operatively coupled to the piezoelectric unit. The amplifier includes first and second ends and the second end moves through a second distance, larger than the first distance under the applied voltage. First and second springs are positioned on opposite sides of the piezoelectric unit. The springs are coupled to the piezoelectric unit in a manner that maintains the piezoelectric unit under constant compression. A fluid body includes a movable shaft operatively coupled with the second end of the amplifier and includes a fluid bore and an outlet orifice. The movable shaft is moved by the second end of the amplifier under the applied voltage and jets an amount of fluid from the fluid bore through the outlet orifice.

Printing device, solder management system, and printing managing method

A printing device includes a storage that stores allowable time for which use of solder supplied to a screen mask can be allowed, a timer that measures time for which the solder is supplied to the screen mask, a determination unit that determines whether or not the solder supplied to the screen mask has exceeded the allowable time based on time measured by the timer, and a notifier that notifies a worker in a case where the determination unit determines that the solder supplied to the screen mask has exceeded the allowable time. The timer measures time by weighting a measurement interval of time for which the solder is moved on the screen mask by a squeegee so as to become greater than a measurement interval of time for which the solder does not move on the screen mask.

Multi-tier conductive circuits free of supporting substrate with intermediary devices on a plurality of tiers, detachable production platform for additive manufacturing, solder-dispensers and device-dispensers

Four parts of a unity is described here, centered around the multi-tier conductive circuits. The detachable production platform is a prerequisite for manufacturing of these circuits as described. The solder-dispenser is necessary if the circuits are made of anything but magnetic metal powder, or if the means for containing solder material are made solid, and the device-dispenser replaces conventional pick-n-place machines to provide devices to a circuit much quicker and much cheaper. 4. The method of wherein the conductive lines are electronically conductive lines.5. The method of wherein the conductive lines are electro-magnetically conductive lines.6. The method of wherein the conductive lines are optically conductive lines.7. The method of for multi-tier three-dimensional conductive circuits claim 3 , wherein the construction of the circuits is to be realized by means of an additive manufacturing machine for metal powder claim 3 , with a removable production platform claim 3 , and wherein{'claim-ref': {'@idref': 'CLM-00003', 'claim 3'}, 'a. the plurality of unities of are to be arranged to be printed on a production platform of an additive manufacturing machine for metal powder in a single printing procedure'}{'claim-ref': {'@idref': 'CLM-00003', 'claim 3'}, 'b. supporting structures are to be built at first, with outlines identical to the conductive circuit lines of ,'}{'claim-ref': {'@idref': 'CLM-00003', 'claim 3'}, 'c. cutting structures, constructed to facilitate the final cutting off, are to be built on top of said supporting structures, with outlines identical to the conductive circuit lines of , and'}d. said three-dimensional conductive circuit lines are to be built on top of said cutting structures, ande. at the procedure of cutting loose said plurality of unities with devices, said cutting structures will get pulverized, and said supporting structures will be left on said production platform, to be re-used for repeated building of three-dimensional ...

Printed Circuit Board And Method For Fabricating The Same, And Apparatus For Fabricating Printed Circuit Borad

The present disclosure provides a printed circuit board and a method for fabricating the same, and an apparatus for fabricating printed circuit board. The printed circuit board includes a substrate having an upper surface; a first trench in the upper surface of the substrate; a first via formed in the first trench and penetrating through the substrate; and a first conductive layer disposed in the first trench and the first via, the first trench is electrically connect to the first via. A method for fabricating the printed circuit board and an apparatus for fabricating the printed circuit board is also provided. 1. A printed circuit board , comprising:a substrate having an upper surface;a first trench depressed in the upper surface of the substrate;a first via disposed in the first trench, and penetrating through the substrate; anda first conductive layer disposed in the first trench and the first via, wherein the first via is electrically connected to the first trench.2. The printed circuit board of claim 1 , further comprising a first insulating layer claim 1 , covering the first conductive layer in the first trench claim 1 , and an interior of the first via is not covered by the first insulating layer.3. The printed circuit board of claim 2 , wherein a height of the first insulating layer is the same as the upper surface of the substrate.4. The printed circuit board of claim 2 , further comprising:a second insulating layer covering the upper surface of the substrate and the first insulating layer;a second trench formed on an upper surface of the second insulating layer;a second via disposed in the second trench and going through the second insulating layer;a second conductive layer formed in the second trench and inside the second via; anda third insulating layer covering the second conductive layer and filling the second trench, wherein an interior of the second via is not covered by the third insulation layer.5. The printed circuit board of claim 1 , wherein a ...

SERVER AND PRINTED CIRCUIT BOARD PRINTING METHOD

A printed circuit board (PCB) printing method includes obtaining PCB parameters and stencil printing parameters of a PCB to be printed, determining print parameters for printing the PCB according to a print model parameter relationship, the obtained PCB parameters, and standard values of solder paste detection parameters, transmitting the determined print parameters to a printer for printing the PCB, receiving values of the solder paste detection parameters detected by a solder paste inspection device, determining whether the detected values are within a preset range of the standard values, and re-determining the print parameters when the detected values are not within the preset range of the standard values. The print model parameter relationship indicates a relationship of the PCB parameters and the print parameters to solder paste detection parameters. The solder paste detection parameters include information related to solder paste on the printed PCB. 1. A server communicatively coupled to a printed circuit board (PCB) printer and a solder paste inspection device , the server comprising:a processor; and store a print model parameter relationship, the print model parameter relationship indicating a relationship of PCB parameters and print parameters to solder paste detection parameters, the solder paste detection parameters comprising information related to solder paste on the printed PCB;', 'obtain PCB parameters and stencil printing parameters for printing a PCB;', 'determine the print parameters for printing the PCB according to the print model parameter relationship, the obtained PCB parameters, and standard values of the solder paste detection parameters;', 'transmit the determined print parameters to the printer for setting and printing the PCB, and receiving values of the solder paste detection parameters detected by the solder paste inspection device;', 'determine whether the detected values of the solder paste detection parameters are within a preset ...

METHOD FOR PRODUCING A PRINTED WIRING BOARD

A method for producing a printed circuit board on a substrate uses control data derived from a circuit schematic, CAD file, Gerber file or files or equivalents, to operates a function head configured to effect printing conductive and non-conductive materials on the substrate and produces control data to effect the circuit printing. The method optionally uses a layout translation module configured to accept PCB multilayer circuit board files and convert multilayer circuit board layout data of the PCB multilayer circuit board files to printing data files for controlling the function head to print conductive material and nonconductive material onto the substrate to produce a printed circuit effecting functionality of the multilayer circuit board layout data. 1. A computer-implemented method for producing printer control data configured to operate a printer unit to produce a printed circuit board , the printing unit being responsive to the printer control data for printing at least one of or both of a conductive material or nonconductive material at a given time , the printing unit accepting a substrate to print on to form the printed circuit board , the method comprising:accepting circuit schematic information of a circuit to be embodied in the printed circuit board; and first and second printed intersecting conductive traces wherein the second printed intersecting conductive trace intersects the first printed intersecting conductive trace at an intersection location as viewed from a direction perpendicular to the printed circuit board, the first and second printed intersecting conductive traces being defined by the circuit schematic information as not electrically connected by the printed circuit board absent circuit components to be mounted;', 'printed component connection pads; and', 'a printed insulator configured to be printed interposed between said first and second printed intersecting traces at the intersection location to insulate said first printed ...

Reaction product preparation method for liquid photoimageable solder mask

Process for coating circuit boards

A process is disclosed for coating a circuit board with a photopolymerizable material which is applied by extension at temperatures of 100° to 180° C. followed by distributing the material under pressure by a roller.

Process for coating circuit boards

Conductive paste coating mechanism and cell wiring device

【課題】太陽電池ストリングを製造する装置のサイズを縮小する。 【解決手段】本発明の実施形態の導電性ペースト塗布機構１４は、太陽電池セル１の表面が保持面に位置するように、太陽電池セル１を保持する旋回部１４０と、太陽電池セル１の第１面及び第２面に、導電性ペーストを塗布する塗布部１４２と、を備え、旋回部１４０は、第１面に導電性ペーストが塗布されてから、第２面に導電性ペーストが塗布されるまでの間に、太陽電池セル１を保持しながら、旋回軸を中心に旋回し、旋回軸と保持面との間には、垂直方向のオフセットがある。 【選択図】図３ The size of an apparatus for manufacturing a solar cell string is reduced. A conductive paste coating mechanism according to an embodiment of the present invention includes a swivel unit that holds a solar battery cell, and a solar battery cell so that the surface of the solar battery cell is positioned on a holding surface. The swivel unit 140 is coated with the conductive paste on the first surface and then applied with the conductive paste on the second surface. In the meantime, the solar battery cell 1 is held while being turned around the turning axis, and there is a vertical offset between the turning axis and the holding surface. [Selection] Figure 3

Method for filling high aspect ratio via holes in electronic substrates and the resulting holes

High aspect ratio (5:1-30:1) and small (5 μm-125 μm) diameter holes in a dielectric substrate are provided, which are filled with a solidified conductive material, as well as a method of filling such holes using pressure and vacuum. In certain embodiments, the holes are lined with conductive material and/or capped with a conductive material. The invention also contemplates a chip carrier formed by such material.

Method for filling high aspect ratio via holes in electronic substrates and the resulting holes

High aspect ratio (5:1-30:1) and small (5 μm-125 μm) diameter holes in a dielectric substrate are provided, which are filled with a solidified conductive material, as well as a method of filling such holes using pressure and vacuum. In certain embodiments, the holes are lined with conductive material and/or capped with a conductive material. The invention also contemplates a chip carrier formed by such material.

Cleaner of stencil mask for screen printer

A stencil mask cleaner for a screen printer is provided to reduce a unit cost and to improve productivity and quality by excluding the generation of failure of produced PCBs(Printed Circuit Boards). A stencil mask cleaner(50) for a screen printer includes a cleaner frame(51) having a supplying roll(53) for supplying a cleaning paper and a winding roll(54) for winding the cleaning paper drawn from the supplying roll. A cleaning block(55) is installed at a center of the cleaning frame. An ejection nozzle(56) discharges alcohol to the cleaning paper. A vacuum hole(57) is connected to a vacuum unit to suck solder liquid attached to a stencil mask(45). A cleaning rubber(59) is fixed to a rubber hole(58) formed on both sides of the vacuum hole. The stencil mask cleaner further include a vibrator to remove the solder liquid attached to a coating hole of the cleaning rubber. The vibrator includes a vibration cylinder inserted into a vibration groove formed at the cleaning, a vibration plate connected to a rod of the vibration cylinder, and a buffer pad to prevent damage and impact of the stencil mask.

Dispensing unit mass dampener

分配系統包括框架、支撐件、分配單元組件及台架。台架係配置以支撐分配單元組件，並在x軸和y軸方向上移動分配單元組件。分配單元組件包括固定到台架的一支撐托架，及可旋轉地聯接至支撐托架的一可移動托架，支撐托架配置以使可移動托架能夠相對於支撐托架繞第一軸線而旋轉，其中一分配單元可旋轉地聯接至可移動托架，可移動托架配置以使分配單元相對於可移動托架繞第二軸線旋轉，第二軸線大致垂直於第一軸線。質量阻尼器組件聯接至可移動托架，其中質量阻尼器組件經配置以在操作期間減少分配單元的振動。

Printing apparatus and method of manufacturing liquid crystal display device using the same

이동레일; 상기 이동레일 상에 위치한 인쇄판 및 기판; 상기 이동레일을 통해 상기 인쇄판 및 기판을 경유하여 패턴을 전사하는 인쇄롤; 상기 인쇄롤에 패턴물질을 전사하기 위한 코팅롤; 및 상기 코팅롤에 패턴물질을 도포하기 위한 인쇄노즐을 포함하여 이루어지는 인쇄장비에 관한 것으로서, 본 발명에 따르면, 코팅롤에 패턴물질을 도포한 후 이를 인쇄롤에 전사하기 때문에, 인쇄공정 중 용제 흡수에 의한 블랭킷의 영향을 최소화할 수 있어, 블랭킷을 자주 교체하지 않아도 되므로 제조비용이 절감된다. 인쇄롤, 코팅롤, 블랭킷, 세정노즐

Circuit carrier with electrical conductors

Schaltungsträger mit elektrischen Leiterbahnen, an denen elektrisch leitfähige Anschlusshöcker für die Oberflächenmontage von elektronischen Komponenten angebracht sind, wobei der Schaltungsträger (9) und die Anschlusshöcker (1, 10) aus einem elastisch dehnbaren Material bestehen. Circuit carrier with electrical conductor tracks, on which electrically conductive connection bumps for the surface mounting of electronic components are mounted, wherein the circuit carrier (9) and the connection bumps (1, 10) consist of an elastically extensible material.

INTERIOR COVERING PART WITH GROOVES FOR THE INTEGRATED SHAPING OF ELECTRICAL CIRCUITS

Adhesive application method

The layering manufacture of many materials micro element of free forming

本发明涉及一种分层制造方法，尤其涉及一种积层制造方法，用于制造包括一种或多种以上的材料的物体，所有包括的材料具有自由成形的能力。例如，本方法可用于生产微型系统的封装，其中，采用陶瓷作为绝缘体，采用辅助材料产生电学或光学3D导体线或3D导体孔。在本方法中使用细粉末，从而可以用于形成小形体尺寸和高精度需求的部件。本法的其它的预期用途有：形成小型机械精密零件或研磨工具、牙科用具或医疗植入物。

Apparatus for dispensing material in a printer

A printer for printing a viscous material at predetermined positions forming a pattern on a substrate. The printer includes a frame, a device having a number of perforations arranged to form the pattern, a support apparatus that supports the substrate in a printing position, and a material dispenser having a substantially cylindrical chamber to contain the viscous material. The chamber has an opening through which the material is dispensed. The material dispenser is positioned over the device and constructed and arranged to dispense the viscous material through the perforations in the device onto the substrate. In embodiments of the present invention, the material dispenser is adapted to receive standard cartridges containing the viscous material, and the printer further includes a pressurized air source for forcing the viscous material from the cartridges into the material dispenser and from the material dispenser through the perforations on the device and onto the substrate.

Method and apparatus for dispensing material in a printer

A printer for printing a viscous material at predetermined positions forming a pattern on a substrate. The printer includes a frame, a device, mounted to the frame, having a number of perforations arranged to form the pattern, a support apparatus, coupled to the frame, that supports the substrate in a printing position beneath the device, and a material dispenser. The material dispenser has a chamber to contain the viscous material to be printed on the substrate. The chamber has an opening through which the viscous material is dispensed. The material dispenser is coupled to the frame, positioned over the device, and constructed and arranged to dispense the viscous material through the perforations in the device and onto the substrate. The material dispenser has a retraction device that prevents leakage of the viscous material from the opening after dispensing is complete. The material dispenser includes a temperature control system.

Method and apparatus for depositing viscous products on a substrate through a stencil

(57)【要約】 ステンシルの開口部（３）を通して基板（１）上に粘性および／あるいはペースト状生成物の堆積を実施する方法とその装置。生成物用中空容器（７）はステンシルに向いている低開口部（１９）を備えている。容器の低開口部（１９）は、その長さが基板の大きさに調整され、その幅がスクリーン印刷の実施速度の関数であるように仕切られている。この仕切りは、シール部材（１５、１６）によって与えられ、好ましくは開口部の両側に容器の移動方向に関して交叉し、お互いに向き合い、ワイパー間の水平部に対して１２０°および１８０°間に傾斜する二個のワイパー（１５）を有し、前記ワイパーは容器の断面に対し交叉し、および横断している。圧力が容器内の粘性生成物に働き、その圧力は、それ（粘性生成物）を散布するためにワイパー間のステンシルに向けてそれ（粘性生成物）を押圧し、およびワイパーをステンシルに押圧するためにそれら（ワイパー）に圧力を加えながら、ワイパーにそれ（粘性生成物）を押圧する。容器は生成物に圧力が働くと同時にステンシルを横断して移動する。本発明は付着性あるいは半田ペーストの堆積を実行する電子産業に適用することができる。

Embedding a component into a component carrier by transferring the component into a cavity being already filled with filling material

Methods for liquid transfer coating of three-dimensional substrates

Methods here disclosed provide for selectively coating the top surfaces or ridges of a 3-D substrate while avoiding liquid coating material wicking into micro cavities on 3-D substrates. The substrate includes holes formed in a three-dimensional substrate by forming a sacrificial layer on a template. The template includes a template substrate with posts and trenches between the posts. The steps include subsequently depositing a semiconductor layer and selectively etching the sacrificial layer. Then, the steps include releasing the semiconductor layer from the template and coating the 3-D substrate using a liquid transfer coating step for applying a liquid coating material to a surface of the 3-D substrate. The method may further include coating the 3-D substrate by selectively coating the top ridges or surfaces of the substrate. Additional features may include filling the micro cavities of the substrate with a filling material, removing the filling material to expose only the substrate surfaces to be coated, coating the substrate with a layer of liquid coating material, and removing said filling material from the micro cavities of the substrate.

Electronic module with-ray protection for a transmission control unit, and transmission control unit

一種用於聯動器控制單元(10)的電子模組(12)以及一種相應的聯動器控制單元(10)。該電子模組(10)具有一包含電子電路(18)的印刷電路板元件(14)，該電子電路(18)佈置在該印刷電路板元件(14)的安裝面(16)上且具有至少一未封閉的半導體元件(20)，該半導體元件透過接觸面(22)佈置在該安裝面(16)上。該電子電路(18)被保護材料(26)完全覆蓋。該電子模組(12)的主要特徵在於，在該半導體元件(20)之相對該接觸面(22)佈置的表面(28)上，佈置有用於保護該半導體元件(20)免受電離輻射影響的保護層(30)，其中該保護層(30)的α輻射表面發射率小於該保護材料(26)的α輻射表面發射率。如此便能可靠地對半導體元件(20)提供抗射線誘發損壞保護。

Device for the flux-free application of a solder to a substrate or a chip

Methods for liquid transfer coating of three-dimensional substrates

Methods here disclosed provide for selectively coating the top surfaces or ridges of a 3-D substrate while avoiding liquid coating material wicking into micro cavities on 3-D substrates. The substrate includes holes formed in a three-dimensional substrate by forming a sacrificial layer on a template. The template includes a template substrate with posts and trenches between the posts. The steps include subsequently depositing a semiconductor layer and selectively etching the sacrificial layer. Then, the steps include releasing the semiconductor layer from the template and coating the 3-D substrate using a liquid transfer coating step for applying a liquid coating material to a surface of the 3-D substrate. The method may further include coating the 3-D substrate by selectively coating the top ridges or surfaces of the substrate. Additional features may include filling the micro cavities of the substrate with a filling material, removing the filling material to expose only the substrate surfaces to be coated, coating the substrate with a layer of liquid coating material, and removing said filling material from the micro cavities of the substrate.

Substrate Production Device

하지기판이 도포스테이지에 지지된다. 노즐유닛이, 도포스테이지에 지지된 하지기판에 대향하여, 복수의 노즐구멍으로부터 하지기판을 향하여 박막재료의 액체방울을 토출한다. 리저버탱크에 박막재료가 축적된다. 공급계가, 리저버탱크로부터 노즐유닛으로 박막재료를 공급한다. 제1 열원이 리저버탱크를 가열한다. 제1 온도센서가 리저버탱크의 온도를 측정한다. 제2 열원이 공급계의 적어도 1개소를 가열한다. 제2 온도센서가 공급계의 적어도 1개소의 온도를 측정한다. 온도제어장치가, 제1 온도센서 및 제2 온도센서의 측정결과에 근거하여, 리저버탱크 내의 박막재료의 온도와, 공급계를 흐르는 박막재료의 온도가, 온도의 목표범위 내에 들어가도록, 제1 열원 및 제2 열원을 제어한다. The base substrate is supported on the application stage. The nozzle unit ejects liquid droplets of the thin film material from the plurality of nozzle holes toward the base substrate in opposition to the base substrate supported on the application stage. Thin film material accumulates in the reservoir tank. The supply system supplies the thin film material from the reservoir tank to the nozzle unit. The first heat source heats the reservoir tank. The first temperature sensor measures the temperature of the reservoir tank. And the second heat source heats at least one portion of the supply system. The second temperature sensor measures the temperature of at least one part of the supply system. The temperature control device controls the first and second temperature sensors so that the temperature of the thin film material in the reservoir tank and the temperature of the thin film material flowing in the supply system fall within the target range of temperature, And controls the heat source and the second heat source.

Multi-station gluing and film pasting system for PCB

本发明涉及一种PCB电路板用多工位涂胶贴膜系统。一种PCB电路板用多工位涂胶贴膜系统，包括旋转工作台、多个涂胶机构与多个贴膜机构，所述旋转工作台上形成有多个工位，所述多个工位均用于定位PCB电路板，所述多个涂胶机构与所述多个贴膜机构均围绕所述旋转工作台的周缘设置，所述多个涂胶机构与所述多个贴膜机构依次间隔设置。所述PCB电路板用多工位涂胶贴膜系统的涂胶贴膜效率较高。

Direct writing on e.g. thick-film integrated circuit - involves compensation of distance data obtd. from laser beam reflections at predetermined points on circuit substrate

The ceramic or similar substrate (1) is positioned on an X-Y table (2) under a nozzle (3) from which thick-film paste is ejected. the nozzle is raised and lowered by a motor (5) under the control of a height sensor (6) comprising a laser diode (12), condenser lenses (13,14), polaroid filters (15,16) and a position recognition element (11). Photocurrents (11,12) are processed (17,18) by application of mathematical formulae to obtain sum and difference data for computation (10) of movements required of the controller (9) of the X-Y table (2) and nozzle height adjustment motor (5). Circuit pattern data are stored in the computer's memory (20) for distance data compensation. ADVANTAGE - Precise measurements of distances on circuit substrate make for reprodn. of exact circuit pattern by stable process with narrow tolerances.

Systems and methods for applying a liquid coating material to a substrate

전자 부품 또는 회로기판과 같은 기판에 액체 코팅 물질을 도포하기 위한 시스템 및 방법이 개시된다. 코팅 시스템(10)의 제어 시스템(18, 24, 26)은 코팅 프로그램에 포함된 정보에 따라서 기판(12)에 액체 코팅 물질을 도포하도록, 애플리케이터(16)와, 애플리케이터(16)를 이동시키는 로봇(14)을 제어한다. 제어 시스템(18, 24, 26)은 코팅 프로그램 동안 기판(12) 상으로 분배되는 액체 코팅 물질의 체적을 결정하고, 분배된 체적을 액체 코팅 물질의 필요한 분배 체적과 비교하여 계산된 체적값과 필요한 체적값 사이의 차이를 나타내는 에러 신호를 발생시킨다. 제어 시스템(18, 24, 26)은 추후의 코팅 프로그램에 의한 연속하는 기판 상에 액체 코팅 물질의 분배된 체적을 변화시키도록 에러 신호를 사용한다. A system and method for applying a liquid coating material to a substrate, such as an electronic component or circuit board, is disclosed. The control system 18, 24, 26 of the coating system 10 includes an applicator 16 for applying the liquid coating material to the substrate 12 in accordance with the information contained in the coating program, a robot 16 for moving the applicator 16, (14). The control system 18, 24, 26 determines the volume of the liquid coating material that is dispensed onto the substrate 12 during the coating program, compares the dispensed volume to the required dispensed volume of the liquid coating material, And generates an error signal indicating the difference between the volume values. The control system 18, 24, 26 uses an error signal to vary the dispensed volume of the liquid coating material on successive substrates by subsequent coating programs. 액체 코팅, 기판, 애플리케이터, 에러 신호 Liquid coating, substrate, applicator, error signal

Printing Apparatus and Method of manufacturing Liquid Crystal Display Device using the same

이동레일; 상기 이동레일 상에 위치한 인쇄판 및 기판; 상기 이동레일을 통해 상기 인쇄판 및 기판을 경유하여 패턴을 전사하는 인쇄롤; 상기 인쇄롤에 패턴물질을 전사하기 위한 코팅롤; 및 상기 코팅롤에 패턴물질을 도포하기 위한 인쇄노즐을 포함하여 이루어지는 인쇄장비에 관한 것으로서, 본 발명에 따르면, 코팅롤에 패턴물질을 도포한 후 이를 인쇄롤에 전사하기 때문에, 인쇄공정 중 용제 흡수에 의한 블랭킷의 영향을 최소화할 수 있어, 블랭킷을 자주 교체하지 않아도 되므로 제조비용이 절감된다. 인쇄롤, 코팅롤, 블랭킷, 세정노즐

Panel mounting structure, mounting method, and resin supply curing method

Systems and methods for applying a liquid coating material to a substrate

用于向诸如电子部件或电路板的衬底涂敷液体涂层材料的系统和方法。涂敷系统(10)的控制系统(18，24，26)控制涂敷器(16)以及移动涂敷器(16)的机器人(14)，以根据包含在涂覆程序中的信息来向衬底(12)涂敷液体涂层材料。控制系统(18，24，26)确定在涂覆程序期间实际分配到衬底(12)上的液体涂层材料的体积，并将该分配体积与液体涂层材料的期望分配体积相比较以产生表示计算的体积值与期望的体积值之间的差的误差信号。控制系统(18，24，26)使用该误差信号来改变液体涂层材料通过未来涂覆程序在后续衬底上的分配体积。

METHOD AND INSTALLATION FOR PRODUCING SURFACE CONDUCTING CIRCUIT

1. Способ получения электропроводящей схемы на поверхности, включающий следующие этапы:- перенос электропроводящих твердых частиц на область заданной формы на поверхности подложки, которая содержит один из следующих материалов: бумагу, картон, полимерную пленку, текстиль, нетканый материал,- нагревание электропроводящих твердых частиц до температуры, превышающей характеристическую температуру плавления электропроводящих твердых частиц, с образованием расплава, и- прижимание расплава к подложке в зазоре, где температуру поверхности той части зазора, которая контактирует с расплавом, регулируют таким образом, чтобы поддерживать температуру поверхности ниже характеристической температуры плавления.2. Способ по п. 1, в котором перед переносом электропроводящих твердых частиц на область заданной формы на поверхности подложки создают адгезионную зону на поверхности подложки, при этом адгезия электропроводящих твердых частиц к подложке в адгезионной зоне превышает адгезию за пределами адгезионной зоны.3. Способ по п. 2, в котором для создания адгезионной зоны на подложку наносят клеящее вещество.4. Способ по п. 2, в котором для создания адгезионной зоны в подложке создают пространственное распределение статического электрического заряда.5. Способ по любому из пп. 1-4, в котором электропроводящие твердые частицы переносят на область заданной формы в виде сухого порошка.6. Способ по п. 1, в котором электропроводящие твердые частицы переносят на указанную область в виде части композиции, которая содержит, помимо электропроводящих твердых частиц, текучее или гелеобразное вещество.7. Способ по п. 6, в котором при нагревании дополнительно осущес РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) (51) МПК H05K 3/10 (13) 2014 133 101 A (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ЗАЯВКА НА ИЗОБРЕТЕНИЕ (21)(22) Заявка: 2014133101, 30.01.2013 (71) Заявитель(и): СТОРА ЭНСО ОЙЙ (FI) Приоритет(ы): (30) Конвенционный приоритет: 30.01.2012 FI 20125087 (85) Дата начала рассмотрения ...

Liquid Infusion Apparatus

본 발명은 노즐에 피토출물을 주입하는 장치로서, 피토출물이 저장되도록 내부공간을 가지는 저장부; 상기 저장부가 장착될 수 있는 제1 관통구와 상기 노즐이 장착될 수 있는 제2 관통구를 구비하는 몸체부; 내부로 피토출물을 흡입하거나 배출할 수 있는 주입부; 및 상기 주입부의 적어도 일부분을 안내하도록, 상기 제1 관통구와 상기 제2 관통구 중 적어도 어느 하나에 위치하는 가이드부;를 포함하고, 노즐 내부로 용이하게 피토출물을 주입할 수 있다. The present invention provides a device for injecting the object to be discharged into the nozzle, the storage unit having an internal space to store the object to be discharged; A body part having a first through hole through which the reservoir can be mounted and a second through hole through which the nozzle can be mounted; An injection unit capable of inhaling or discharging the discharged object therein; And a guide part positioned in at least one of the first through hole and the second through hole so as to guide at least a portion of the injection part.

Dispensed electrical interconnections

An electronic device includes a substrate, an electrical element on the substrate, a nonconductive adhesive material on the substrate, and a conductive adhesive material on the electrical element and extending onto the nonconductive adhesive material. Methods of forming a packaged LED include providing a substrate having an electrical element thereon, and dispensing a nonconductive adhesive material on the substrate. The nonconductive adhesive material is at least partially cured, and a conductive adhesive material is dispensed on the electrical element and on the at least partially cured nonconductive material. The conductive adhesive material is at least partially cured. The conductive adhesive material may provide an electrical connection between the electrical element and a second electrical element on the substrate or on another substrate.

Dispensed electrical interconnections

An electronic device includes a substrate, an electrical element on the substrate, a nonconductive adhesive material on the substrate, and a conductive adhesive material on the electrical element and extending onto the nonconductive adhesive material. Methods of forming a packaged LED include providing a substrate having an electrical element thereon, and dispensing a nonconductive adhesive material on the substrate. The nonconductive adhesive material is at least partially cured, and a conductive adhesive material is dispensed on the electrical element and on the at least partially cured nonconductive material. The conductive adhesive material is at least partially cured. The conductive adhesive material may provide an electrical connection between the electrical element and a second electrical element on the substrate or on another substrate.

Combined formwork printing machine and distributor and associated method

一种组合式模板印刷机和分配器包括机架(202)、耦合至机架的可移动模板(206)、耦合至机架以在印刷位置支撑基板(216)的基板支撑件(212)以及耦合至机架以在模板上沉积和印刷粘性材料的印刷头(210)。组合式模板印刷机和分配器进一步包括安装在可移动模板上以在基板处于印刷位置时向基板上分配粘性材料的分配器(230)。在另一些实施例中，分配器可以安装在模板刮擦器(128)或者设于组合式模板印刷机和分配器内的独立台架(304)上。

Micro-fluidic injection molded solder (IMS)

A portion of compliant material includes four walls defining a slot. The slot has a relatively large cross-section end in fluid communication with a solder reservoir, and also has a relatively small cross-section end opposed to the relatively large cross-section end. The slot has a generally elongate rectangular shape when viewed in plan, with a length perpendicular to a scan direction, a width, parallel to the scan direction, associated with the relatively large cross section end, and a width, parallel to the scan direction, associated with the relatively small cross section end. The slot is configured in the portion of compliant material such that the relatively small cross-section end of the slot normally remains substantially closed, but locally opens sufficiently to dispense solder from the reservoir when under fluid pressure and locally unsupported by a workpiece. Methods of operation and fabrication are also disclosed.

The printing equipment that is used for liquid crystal display device

本发明公开了一种用于液晶显示器件的印刷装置。所述印刷装置包括：具有多个凸起的印版；印刷辊，在具有多个凸起的印版上滚动以将部分印刷图案材料印刷到所述凸起上，使具有预定图案的图案材料留在所述印刷辊上，以将具有所述预定图案的图案材料印刷到基板上；涂敷辊，用于向印刷辊上转移图案材料；印刷喷嘴，用于向涂敷辊上涂敷图案材料，其中，所述涂敷辊和所述印刷辊之一是朝向所述涂敷辊和所述印刷辊中另一个的方向移动的。

METHOD AND APPARATUS FOR TRANSPORTING AND DEPOSITING VISCOUS SUBSTANCES

Manufacturing method of a positioning control tool using 3D printing technology

Método de fabricación de una herramienta de control de posicionamiento mediante tecnología de impresión 3D que comprende las siguientes etapas con el fin de formar un giroscopio: - imprimir en 3D (100) una primera parte del armazón (110) con un material polimérico de impresión 3D aislante, con el fin de formar un recipiente colocado sobre la cama de impresión (14), - imprimir en 3D (200) un conjunto de capas de sustrato piezoeléctrico (205) dentro de la primera parte del armazón basado en un material polimérico mezclado con grafeno en polvo (12a) dentro de dicha primera parte del armazón; - imprimir en 3D (300) un patrón (310) que tiene una pluralidad de aberturas (320) pasantes; - imprimir en 3D (400) con un material polimérico mezclado con grafeno en polvo (12a), utilizando dicho patrón (310), una pluralidad de características (410) sobre dicho sustrato (205), comprendiendo dichas características (410): - un transductor resonador (411) para crear una primera onda acústica superficial (215) sobre dicha superficie (210) del sustrato piezoeléctrico (205); - un par de reflectores (412a, 412b) para reflejar dicha primera onda acústica superficial (215) con el fin de formar una onda estacionaria dentro de una primera zona (220) de dicha superficie (210) entre dicho par de reflectores (412); - una estructura (413) dentro de dicha zona (220), en donde una fuerza de Coriolis que actúa sobre dicha estructura (413) crea una segunda onda acústica superficial (230); y - un primer transductor sensor (414) dispuesto sobre dicha superficie (210) para detectar dicha segunda onda acústica superficial (230); y - un segundo transductor sensor (415) dispuesto sobre dicha superficie (210) para detectar una onda acústica superficial residual de una segunda zona de dicha superficie (210) que está libre de cualquier estructura sobre la que pueda actuar dicha fuerza de Coriolis, y para proporcionar una salida indicativa de dicha onda acústica superficial residual; - imprimir en 3D (500) ...

Spin-printing of electronic and display components

The present invention is directed to a process for printing conductors, insulators, dielectrics, phosphors, emitters, and other elements that may be for electronics and display applications. The present invention also relates to viscoelastic compositions used in this printing process. The present invention further includes devices made therefrom.

Patterning method, method of manufacturing organic field effect transistor, and method of manufacturing flexible printed circuit board

In the condition where a nozzle for applying a coating liquid is disposed on the lower side of a substrate and a substrate surface controlled in wettability is faced down, the nozzle and the substrate are moved relative to each other, whereby the coating liquid is applied to a desired region of the substrate, and then the coating liquid is dried, to obtain a pattern included a dried coating layer.

Solder deposition

5 n7 Deposition of heated solder onto a plurality of conductive pads 18 which are disposed in one or more linear arrays on a circuit board is effected by a robotically controlled arm on which is mounted a solder nozzle. The solder nozzle is first manipulated to a selected point A offset in a known direction and distance from a first conductive pad by means of a data set which specifies the centroid and footprint for a selected group of conductive pads. After feeding solder into the solder nozzle, aligning the solder nozzle at a desired angle parallel to a linear array of conductive pads and lowering the solder nozzle until a solder droplet contacts the circuit board, the solder nozzle is manipulated at a substantially constant velocity toward the first conductive pad B and thereafter along a selected line which tracks the linear array of conductive pads. To avoid solder starvation at the last few pads in a linear array, the solder nozzle is manipulated C, D at a selected angle away from the selected line while decreasing the solder nozzle velocity. The angle of departure from the selected line is preferably an acute angle selected so that the solder nozzle avoids contact with alignment points 72 or other areas which do not require solder deposition.

Electrodeposition process and device

ELECTRODEPOSITION PROCESS AND DEVICE Abstract An electrically conducting surface is applied with an electrodeposition paint by brush coating, roll coating, flow coating or the like coating method using a paint applicator having a container for containing the paint. An electrode is disposed in the container for contact with the paint contained in the container. Simultaneously with the application of the paint, a direct current voltage is continuously impressed between the electrode and the conducting surface to effect electrodeposition of the paint onto the conducting surface.

COLLECTIVE FILLING DEVICE FOR BORGNED CAVITIES

The invention concerns a device for collectively filling blind cavities in controlled and efficient manner. It consists of a mobile body (1) in sealed contact relative to the surface comprising the orifices of the cavities. The body (1) includes two slots, the first of which (2) is spaced apart in sealed manner both from outside the device and from the second slot (5), by a distance, measured parallel to the displacement of the device, greater than the dimension of the largest orifice. The first slot to encounter the orifices during displacement is connected to a vacuum chamber (3) and the second slot to encounter the orifices is connected to a tank (6) containing the product (7) to be transferred.

Spin-printing of electronic and display components

The present invention is directed to a process for printing conductors, insulators, dielectrics, phosphors, emitters, and other elements that may be for electronics and display applications. The present invention also relates to viscoelastic compositions used in this printing process. The present invention further includes devices made therefrom.

Deposition of viscous matter through stencil esp. for PCB manufacture

There may be one or more seals (15) which are inclined to make an angle (A) with the stencil between 120 deg and 180 deg within the opening and are placed at right angles to the displacement (F2) of the receptacle (6). The receptacle is mounted on a printing machine and it may be displaced in one direction then the other to remove excess material. The width of the opening is less than that of the receptacle and its length is adapted to that of the substrate on which the deposition is made. Pressure is applied to the matter by a piston (10). A removable grid (17) with openings comprising 20-90% of the area may be placed in the receptacle.

Screen printing method for transferring viscous product e.g. ink, involves transferring product in transfer zone, constituted by concave form plugged with elastic body, in which it is spinned, pressurized and scraped by scrapping edge

The method involves transferring a thixotropic viscous product (1) in a transfer zone constituted by a concave forme (15) plugged at its end with an elastic body. The forme is delimited at rear by a scrapping unit (9) contacting a mask (2), and at front by an isolation wall (14) allowing passage of the product from a supply tank towards the zone in which the product is spinned, evenly pressurized and scraped by a scrapping edge (6). An independent claim is also included for a viscous product transfer device by screen printing, for transferring viscous product on a substrate through a mask, by displacement of the device at the surface and related to the mask.