Diverting mounting support for electronic components - has base of thermally-conducting plastics material accepting thick film circuit

An electronic circuit of the type used in motor vehicle engine ignition systems is produced with a base (4), frame (5) and a cover (6). The unit may be mounted onto a body using side fixings (9). The base of the unit forms a board for the formation of a printed circuit onto which electronic devices may be mounted. Some of the devices can be in the form of heat generating power transistors (3), with good contact ensured by a contact paste. The base is produced of a plastics material with high thermal conductivity for good heat dissipation. ADVANTAGE - Provides good dissipation of generated heat to chassis or part of bodywork.

Verfahren zur Bildung einer Drahtbondelektrode auf einer Dickschichtleiterplatte

Verfahren zum Herstellen einer Drahtbondelektrode auf einer Dickschichtleiterplatte, bei welcher eine Kupfer-Dickschicht (2) als Verdrahtungsschicht auf einem isolierenden Substrat (1) gebildet ist und ein auf dem isolierenden Substrat angebrachtes Teil (7) elektrisch mit der Kupfer-Dickschicht (2) über einen Golddraht (8) verbunden ist, mit: einem Schritt des Druckens der Kupfer-Dickschicht (2) auf das isolierende Substrat und des Sinterns der Kupfer-Dickschicht zur Bildung der Verdrahtungsschicht; und einem Schritt des Druckens einer Gold-Dickschicht, welcher vor dem Drucken Kupfer hinzugefügt worden ist, auf das isolierende Substrat und des Sinterns der Gold-Dickschicht als Drahtbondelektrode, um wenigstens partiell die Kupfer-Dickschicht zu überlappen, welche auf dem isolierenden Substrat gebildet ist.

Verbindungsanordnung zwischen einem koaxialen Verbinder und einem planaren Substrat

Leiterplatten mit selbsttragender Verbindung zwischen den Seiten.

Connection between sensor terminal and conductor path applied to glass plate uses conductive connection element ultrasonically welded to conductor path

Connection is provided by electrically conductive connection element (11), e.g. bonding wire, which is ultrasonically welded to conductor path (5) applied to surface of glass plate (1) and which is coupled to sensor terminal (13) mounted on glass plate. Surface (3) of glass plate is ridged at point of connection between conductor path and connection element, ultrasonic welding position lying in furrow between 2 ridges (4). An Independent claim for an application of a sensor terminal connection for a ceramic glass cooking hob surface is also included.

Kunststoffgehäuse mit einer schwingungsdämpfenden Lagerung eines bondbaren Elements

Bonding wire protecting device, has bonding sites provided on circuitry carrier e.g. circuit board, and plug connector, where bend protection units are provided on regions of bonding wire

The device has bonding sites provided on a circuitry carrier (20) e.g. circuit board, and a plug connector (22). Bend protection units e.g. medium-soft or medium-hard silicone cappings, are provided on regions of a bonding wire (16). The silicone cappings are provided with hardness of 20-80 shore and vulcanized by UV-radiation. The silicone cappings comprise an elastic module region that lies between 0.5 to 10 Newton per square millimeter. The circuitry carrier is arranged in a sensor housing (12).

Mehrfach-Bonddrahtverbund und simultanes Bonden

Verbund, enthaltend eine Isolierung und einen Bonddraht, dadurch gekennzeichnet, dass die Isolierung eine den Bonddraht teilweise einbettende Rinne aufweist, so dass eine Seite des Verbunds aus Isolation besteht und eine Seite des Verbunds eine freiliegende Bonddrahtoberfläche aufweist.

Substrate for interconnecting electronic integrated circuit components, which is provided with a repair arrangement

An interconnecting substrate according to the invention comprises an insulating base on which rests a set of alternating, superimposed conductive and insulating layers. Contacts are formed on the uppermost insulating layer which border at least one site or zone intended for an integrated circuit chip device whose output conductors are to be connected to the said contacts. Through-connections enable the contacts to be coupled to one of the inner conductive layers. The through-connections include at least one through-connection on the inside of the site relative to at least a predetermined one of the said contacts. A shunt conductor means connected to the predetermined contact has a part outside the site which is connected to an additional contact which serves as a substitute or replaces the said predetermined contact for the connection to the associated output conductor of the chip device. The repair arrangement according to the invention allows one to substitute for a connection inside ...

A method of manufacturing a shielding

Ein Verfahren zum Herstellen einer Schirmung eines auf einer Leiterplatte (1) angeordneten Bauteils (2) mit induktiver Komponente, bei welchem zumindest ein Schirmdraht (7) zunächst mit einem Ende auf ein erstes Bondpad (5) an der Leiterplatte aufgebondet wird, der Schirmdraht das Bauteil umfangend zu einem zweiten Bondpad (6) geführt wird und sodann auf dieses aufgebondet wird. sowie eine entsprechend aufgebaute Leiterplatte.

ELEKTRISCHE SCHALTUNG

The electrical circuit forms an LED light source and the components are LEDs (6) mounted on contact surfaces (5). These have a greater area than the base areas of the LEDs. The through contacts (7) are arranged inside the contact areas, but exclusively close to the LEDs.

ELECTRONIC CIRCUIT MODULE AND PROCEDURE FOR ITS ASSEMBLY

PROCEDURE FOR THE PRODUCTION OF A CONDENSER ELEMENT

INTEGRATED CIRCUIT WITH BUILT-IN REPAIR DEVICE

INTEGRATED CIRCUIT WITH BUILT-IN REPAIR DEVICE

L'invention se rapporte à un substrat d'interconnexion, du type comprenant un support isolant sur lequel repose un ensemble de couches conductrices et isolantes alternées et superposées; des plots formés sur la couche isolante supérieure et bordant au moins un domaine destiné à un composant dont les conducteurs de sortie sont à connecter auxdits plots; et des traversées permettant le couplage des plots, par l'intermédiaire de la couche conductrice supérieure, à l'une des couches conductrices intérieures et comprenant au moins une traversée intérieure au domaine relative à au moins un plot donné desdits plots, ledit substrat étant caractérisé en ce qu'il comporte un dispositif de réparation comprenant un moyen conducteur de dérivation relié audit plot donne et présentant une partie extérieure au domaine connectée à un plot additionnel se substituant audit plot donné pour la connexion audit composant.

HALO-HYDROCARBON POLYMER COATING

In some embodiments, a printed circuit board (PCB) comprises a substrate comprising an insulating material. The PCB further comprises a plurality of conductive tracks attached to at least one surface of the substrate. The PCB further comprises a multi-layer coating deposited on the at least one surface of the substrate. The multi-layer coating (i) covers at least a portion of the plurality of conductive tracks and (ii) comprises at least one layer formed of a halo-hydrocarbon polymer. The PCB further comprises at least one electrical component connected by a solder joint to at least one conductive track, wherein the solder joint is soldered through the multi-layer coating such that the solder joint abuts the multilayer coating.

SUBSTRATE COMPONENT INTERCONNECT INTEGRATED CIRCUIT ELECTRONIC.

PROCESS FOR THE CONTINUOUS PRODUCTION OF A PRINTED CIRCUIT AND USE OF THAT CIRCUIT.

Capacitor component

MODULE DE PUISSANCE POUR EQUIPEMENTS AUTOMOBILES

LE MODULE SELON L'INVENTION EST CARACTERISE PAR LE FAIT QU'IL COMPREND UN CIRCUIT IMPRIME 1 ASSEMBLE RIGIDEMENT SUR UN REFROIDISSEUR 2 SUR LEQUEL SONT DEPOSES PAR COLLAGE OU SOUDURE DIRECTEMENT UNE OU PLUSIEURS PASTILLES DE SILICIUM DE PUISSANCE 10 AFIN DE PERMETTRE UNE EVACUATION ET UNE REPARTITION DES CALORIES ENTRE LES DIFFERENTES PASTILLES 10, LA LIAISON ELECTRIQUE ENTRE LES DIFFERENTES PLAGES DE SORTIES 7, 9 DES PASTILLES DE SILICIUM 10 ET LES CONNEXIONS ETANT EFFECTUEES PAR SOUDURE ULTRASONIQUE D'UN FIL D'ALUMINIUM ENTRE LES PLAGES DE SORTIES 7, 9 DES PASTILLES DE SILICIUM 10 ELLES-MEMES ET LE CIRCUIT IMPRIME 1 QUI PERMET AINSI LE PASSAGE DU COURANT VERS UN CONNECTEUR 13 RACCORDE DIRECTEMENT A CELUI-CI. APPLICATION A L'INDUSTRIE AUTOMOBILE.

CIRCUIT IMPRIME A COMPOSANTS ELECTRONIQUES INCORPORES ET SON PROCEDE DE FABRICATION

Circuit imprimé multicouche à composants électroniques et collecteur thermique incorporée. Les cristaux semi-conducteurs 23 sont, d'une part, fixés directement sur le collecteur thermique 15 et, d'autre part, noyés dans la matière isolante 27 du stratifié 10. Le collecteur thermique 15 borde le circuit sur l'essentiel de sa surface et a sa face 22 libre pour la dissipation des calories. Application aux appareillages électroniques.

ATTACHING A HEAT SINK OR EQUIVALENT ELECTRONIC ELEMENT

HYBRID ELECTRICAL CONNECTION OF STRUCTURAL GROUPS, HAS PRINTED CIRCUIT BOARDS

SUBSTRAT D'INTERCONNEXION DE COMPOSANTS ELECTRONIQUES A CIRCUITS INTEGRES, MUNI D'UN DISPOSITIF DE REPARATION

L'invention concerne un substrat d'interconnexion 10 pourvu d'un ensemble de couches conductrices 19a-C et isolantes 20a, b alternées et superposées; des plots formés sur la couche isolante supérieure 20a et bordant au moins un domaine 13 destiné à un composant 11 dont les conducteurs de sortie 12 sont à connecter aux plots 14; et des traversées 21 comprenant au moins une traversée intérieure au domaine 13. L'invention présente un dispositif de réparation comprenant un moyen conducteur de dérivation 28a, b, 26a, b relié au plot 14 connecté à la traversée intérieure 21 et présentant au moins une plage de connexion auxiliaire 30 extérieure au domaine 13. L'invention permet de réparer le substrat sans avoir à enlever le composant il et s'applique à tout substrat porteur de pastilles de circuits intégrés.

CASE FOR ELECTRONIC CIRCUIT

Component mounting method

UNIT CONTROL APPARATUS AND METHOD FOR ELECTRICAL COUPLING OF A GRID DRAWN TO THE COMPONENTS INSTALLED ON THE MOUNTING SURFACE OF A CIRCUIT ELEMENT

Unité d'appareil de commande (1), comportant un élément de plaque de circuit (10) ayant une surface de montage (20) garnie de composants (30, 31, 32), et une grille emboutie (40) sur le côté de l'élément de plaque de circuit (10) pour le branchement des composants (30, 31, 32) de la surface de montage (20). La grille emboutie (40) est pratiquement en cuivre ou en aluminium. L'unité comporte une broche (60) reliant la grille (40) aux composants (30, 31, 32) et traversant l'élément de plaque de circuit (10). La broche (60) est en une matière pratiquement identique à celle de la grille (40).

WASTEFUL FASTENER OF HEAT Of an ELECTRONIC ELEMENT OR EQUIVALENT

HALO-HYDROCARBON POLYMER COATING

일부 구체예에서, 인쇄 회로 보드(PCB)는 절연재를 포함하는 기판을 포함한다. 상기 PCB는 기판의 하나 이상의 표면에 결합된 복수의 도전성 트랙을 더 포함한다. 상기 PCB는 기판의 하나 이상의 표면상에 증착된 다중층 코팅을 더 포함한다. 상기 다중층 코팅은 (i) 복수의 도전성 트랙의 적어도 일부를 커버하고, (ii) 할로-하이드로카본 폴리머로 형성된 하나 이상의 층을 포함한다. 상기 PCB는 하나 이상의 도전성 트랙에 솔더 접합에 의해 연결된 하나 이상의 전기 소자를 더 포함하며, 상기 솔더 접합은 상기 솔더 접합이 상기 다중층 코팅에 인접하도록 상기 다중층을 통해 솔더된다. In some embodiments, the printed circuit board (PCB) comprises a substrate comprising an insulating material. The PCB further includes a plurality of conductive tracks coupled to at least one surface of the substrate. The PCB further comprises a multilayer coating deposited on at least one surface of the substrate. The multilayer coating includes (i) at least a portion of a plurality of conductive tracks, and (ii) at least one layer formed of a halo-hydrocarbon polymer. The PCB further comprises at least one electrical element connected by solder bonding to the at least one conductive track, wherein the solder joint is soldered through the multilayer so that the solder joint is adjacent the multilayer coating.

Stacked printed devices on a carrier substrate

Disclosed herein are systems and methods for stacking passive component devices (110) on a substrate (112). A conductive material is printed onto a first substrate using a fluid ejection device to form a printed passive device according to a predetermined design. The first substrate is attached to a second substrate, such as a die (114), to form a component for performing a predetermined function. The component may then be tested to determine whether the component formed according to the predetermined design performs the predetermined function. The design may be adjusted in response to the test to improve the performance of the component in performing the predetermined function. Multiple substrates having printed passive devices may be stacked and electrically connected to the die or other substrate in order to increase the number of devices formed on a particular area of that die or other substrate.

CONDUCTOR GRID FOR ELECTRONIC HOUSINGS AND MANUFACTURING METHOD

With the present invention, conductor grids for electronic housings and a manufacturing method for such conductor grids are provided. According to the invention, the conductor grid is produced from two metal strips (130, 110, 140) welded along the joint edge (150), with only one of the two metal strips needing to have a surface suitable for the wire bonding. The amount of the conventionally used, plated starting material can be considerably reduced in this way.

MULTI CHIP MODULE AND FABRICATION METHOD THEROF

A multi chip module and a fabrication method thereof are provided. The multi chip module includes: a plate; a substrate adhered to the plate, and having a chip and a signal pattern formed thereat; and a stopper formed at the plate, and defining a region where the substrate is adhered. The method includes: providing a plate connected with a lead, and having a region defined by a stopper; adhering a substrate having a chip and a signal pattern, to the region defined by the stopper on the plate; and wire bonding the signal pattern with the lead.

SEMICONDUCTOR DEVICE

This semiconductor device (1) contains the following: a metal substrate; a semiconductor element disposed on the metal substrate; and a flexible circuit board that is electrically connected to the semiconductor element and extends outwards past an edge of the metal substrate, one end of said flexible circuit board being disposed on the metal substrate. This semiconductor device is characterized in that a thickness-increasing member is joined to the metal-substrate side of the flexible circuit board in the region of the flexible circuit board located above the aforementioned edge of the metal substrate.

INSULATING REFLECTIVE SUBSTRATE AND LED PACKAGE

The purpose of the present invention is to provide an LED package exhibiting excellent insulating properties and diffuse reflectance, and an insulating reflective substrate used therein. The insulating reflective substrate according to the present invention has a metal substrate having an insulating layer on the surface thereof, a metal wiring layer provided on the insulating layer, and a porous layer provided on part of the insulating layer and on part of the metal wiring layer. The metal substrate is a valve metal substrate, the insulating layer is an anodic oxide film of the valve metal, the porosity of the porous layer is 10% or higher, the porous layer contains inorganic particles with an average particle size of 0.1 μm or higher and an inorganic binder, and the inorganic binder is at least one type selected from the group consisting of aluminum phosphate, sodium silicate, and aluminum chloride.

METHODS OF FORMING METALLURGY STRUCTURES FOR WIRE AND SOLDER BONDING AND RELATED STRUCTURES

Metallurgy structures (34a’-d’) for input/output pads (23a-d) of an electronic device can be adapted to receive both solder and wire bonds. First and second metallurgy structures, for example, can be provided on respective first and second input/output pads of an electronic device such that the first and second common metallurgy structures have a shared structure adapted to receive both solder and wire bonds. A solder bond can thus be applied to the first metallurgy structure, (346’, 34c’) and a wire bond can be applied to the second metallurgy structure (34a’, 34d’).

METHODS OF FORMING METALLURGY STRUCTURES FOR WIRE AND SOLDER BONDING AND RELATED STRUCTURES

Metallurgy structures for input/output pads of an electronic device can be adapted to receive both solder and wire bonds. First and second metallurgy structures, for example, can be provided on respective first and second input/output pads of an electronic device such that the first and second common metallurgy structures have a shared structure adapted to receive both solder and wire bonds. A solder bond can thus be applied to the first metallurgy structure, and a wire bond can be applied to the second metallurgy structure.

A WIRELESS TELEMETRY ELECTRONIC CIRCUIT BOARD FOR HIGH TEMPERATURE ENVIRONMENTS

A circuit assembly (34) resistant to high-temperature and high g centrifugal force is disclosed. A printed circuit board (42) is first fabricated from alumina and has conductive traces of said circuit formed thereon by the use of a thick film gold paste. Active and passive components of the circuit assembly are attached to the printed circuit board by means of gold powder diffused under high temperature. Gold wire is used for bonding between the circuit traces and the active components in order to complete the circuit assembly (34). Also, a method for manufacturing a circuit assembly resistant to elevated temperature is disclosed ...

IMPROVED BONDING ARRANGEMENT AND METHOD FOR LTCC CIRCUITRY

An LTCC (low temperature cofired ceramic) structure which has conductors to which leads are to be bonded for connection to external circuitry. The conductors include additives to promote adhesion to the ceramic layer. The presence of these additives degrade bonding performance. For better bondability of the leads, a pure conductor metal layer, devoid of the additives is placed on the conductors in areas where leads are to be bonded. This pure conductor metal layer may be cofired with the stack of ceramic layers or may be post fired after stack firing.

Integrated circuit chip packaging

An electrical circuit device that includes a circuit board with an integrated circuit chip in a cavity that extends from a surface of the circuit board to an embedded conductor, and an electrical connection between the integrated circuit chip and the embedded conductor.

Wiring substrate and semiconductor package implementing the same

A wiring substrate may have a first surface including a chip mounting pad, and a second surface opposite to the first surface. A heat radiating layer may be provided on the second surface of the wiring substrate. A plurality of heat conducting elements may connect the chip mounting pad to the heat radiating layer. Metal protrusions may be provided on the chip mounting pad and may directly contact a semiconductor chip.

Semiconductor power module with high speed operation and miniaturization

In order to obtain a miniature unit having a simple structure which can operate at a high speed at a low cost, a copper pattern (225) provided on a power substrate (221) having a DBC substrate structure is exposed on an outer surface of the unit. Thus, it is possible to discharge heat which is generated in a main circuit of the unit to the exterior without providing a copper base plate by mounting the unit so that the pattern (225) is directly in contact with an external heat slinger or the like. The power substrate (221) is not deformed following its temperature change, since no copper base plate is required. Thus, no S-bent structure is required for a terminal which is connected with the circuit or the like, whereby speed increase and miniaturization are enabled, while the structure is simplified since no silicone gel is required.

ARRANGEMENT COMPRISING A SHUNT RESISTOR AND METHOD FOR PRODUCING AN ARRANGEMENT COMPRISING A SHUNT RESISTOR

The invention relates to an arrangement comprising a shunt resistor with at least an electrically conductive first connecting leg and an electrically conductive second connecting leg. A resistance area of the shunt resistor is electrically connected to the first connecting leg and to the second connecting leg. The arrangement further comprises a circuit carrier with a first metallization and a second metallization. The first connecting leg is directly joined to the first metallization and the second connecting leg is directly joined to the second metallization. The resistance area of the shunt resistor is in thermal contact with the thermally conductive substrate by use of a thermal filler arranged between the resistance area and the substrate, and/or by directly contacting the resistance area with the substrate. The invention further relates to a method for producing an arrangement with a shunt resistor and a circuit carrier.

Control apparatus, in particular a mechatronic transmission control device or engine control device

A control device includes a number of individual flexible printed circuit boards that are preferably laminated on an aluminum base plate. A molded seal is used to reliably seal the edge areas of the partially flexible printed circuit board and these edge areas are formed to assist in creating the seal. The device is suited for mechatronic control units and is particularly suited for control devices that are mounted in a transmission or engine of a motor vehicle.

Substrate-level DC bus design to reduce module inductance

A DC bus for use in a power module includes a positive DC conductor bus plate parallel with a negative DC conductor bus plate. The positive bus and negative bus permit counter-flow of currents, thereby canceling magnetic fields and their associated inductances, and the positive and negative bus are connectable to the center portion of a power module.

Liquid discharge head and manufacturing method therefor

A liquid discharge head includes a recording element board provided with an energy generating element, an electrical wiring board to supply the energy generating element with an electrical signal, a supporting member to support the recording element board and the electrical wiring board, a plurality of wires to connect a plurality of terminals provided on the recording element board and a plurality of terminals provided on the electrical wiring board, and a sealing member. The plurality of wires include a plurality of transmitting wires contributory to transmission of the electrical signal and a plurality of non-transmitting wires non-contributory to the transmission and formed at a higher position than that of the transmitting wires from a surface of the supporting member which supports the recording element board. The sealing member is arranged to cover the plurality of transmitting wires as well only some parts of the plurality of non-transmitting wires.

Integrated Circuit With Sensor Printed In Situ

The present disclosure teaches a method for manufacturing a module comprising an integrated circuit and a sensor. The method may comprise: mounting an integrated circuit (IC) die on a printed circuit board (PCB) using a high temperature process to provide an electrical connection between interconnects of the PCB and the die; and printing a sensor directly onto the module after all high temperature mounting processes are complete. 1. A method for manufacturing a module comprising an integrated circuit and a sensor , the method comprising:mounting an integrated circuit (IC) die on a printed circuit board (PCB) using a high temperature process to provide an electrical connection between interconnects of the PCB and the die; andprinting a sensor directly onto the module after all high temperature mounting processes are complete.2. A method according to claim 1 , wherein the IC die is enclosed in a housing comprising a top surface with a plurality of exposed contact areas providing electrical connections to the die enclosed in the housing; andwherein the method further comprises printing the sensor device directly onto the top surface of the housing.3. A method according to claim 1 , wherein the IC die is enclosed in a housing comprising a top surface with an opening that exposes a portion of the IC die; andwherein the method further comprises printing the sensor device directly onto the exposed IC die.4. A method according to claim 1 , wherein:the IC die is enclosed in a housing comprising a top surface with an opening that exposes a portion of the IC die; andthe exposed portion of the IC die includes a plurality of exposed electrical contact areas; andwherein the method further comprises printing the sensor device directly onto the exposed IC die.5. A method according to claim 1 , wherein:the IC die is enclosed in a housing comprising a top surface with an opening that exposes a portion of the IC die; andthe exposed portion of the IC die includes a plurality of exposed ...

Circuit carrier, method for manufacturing a circuit carrier and bonding method

Die Erfindung betrifft den Bereich der Bondtechnologie, insbesondere einen Schaltungsträger (10), z. B. Leiterplatte, für wenigstens ein mittels Bonddrähten (18-1, 18-2) daran anzubindendes Bauelement (BE), umfassend eine Leiterbahnanordnung (14) mit freiliegenden metallischen Bondbereichen (14-1, 14-2) zur schaltungsträgerseitigen Kontaktierung der Bonddrähte (18-1, 18-2). In der Praxis entstehen oftmals unkontrollierbare, oberflächliche "Störschichten" (z. B. natürliche Oxide, Flussmittel etc.), welche die Zuverlässigkeit des Bondprozesses seitens des Schaltungsträgers (10) erheblich beeinträchtigen. Um die Bondtechnologie ohne großen Aufwand hinsichtlich der Zuverlässigkeit der Fügestelle zwischen Drahtmaterial und Bondbereich zu verbessern, werden beim erfindungsgemäßen Schaltungsträger (10) die Bondbereiche (14-1, 14-2) jeweils mit einer beim Bondprozess vom Drahtmaterial zu durchdringenden Passivierungsschicht (20) ausgebildet. Derart kontrolliert passivierte Bondbereichoberflächen ...

ORGANIC CHIP CARRIERS FOR WIRE BOND-TYPE CHIPS

A chip carrier (10) for wire bond-type chips is disclosed. This chip carrier employs organic dielectric materials, rather than ceramic materials, as is conventional. This chip carrier also employs at least one organic, photoimageable dielectric layer (110), having plated photo-vias (120), to electrically interconnect two (or more) layers (80, 130) of fan-out circuitry. This chip carrier further employs a single-tiered cavity (140) to contain a chip (150), rather than a multi-tiered cavity,as is conventional. Moreover, this chip carrier includes thermal via holes (170) and/or a metallic layer (230), directly beneath the chip (150), to enhance heat dissipation.

Method for manufacturing an electronic part

In the method for manufacturing an electronic part according to the present invention, a pair of elongated comb terminals (8) which is mechanically secured to a printed circuit board (6) is transferred in the longitudinal direction, so that the printed circuit board (6) is able to be transferred simultaneously with the comb terminal (8). During the above-described transfer, a chip part (14) is mounted on and soldered to the printed circuit board. Accordingly, the comb terminal (8) and the chip part (14) can be soldered to the printed circuit board (6) at one time.

Electric device with conductive elements bound together

Elektrische Vorrichtung (10) mit einem Trägerteil (13) aus einem Einbettungsmaterial (19) sowie mit ersten Leiterelementen (16), insbesondere gestanzten Leiterbahnen, wobei die ersten Leiterelemente (16) in dem Einbettungsmaterial (19) des Trägerteils (13) eingebettet sind, des Weiteren mit zweiten Leiterelementen (46), wobei die zweiten Leiterelemente (46) mittels einer stoffschlüssigen Verbindung mit den ersten Leiterelementen (16) an einer Verbindungsstelle (50) verbunden sind und die Verbindungsstelle (50) zu einer Verankerungsstellte (49) benachbart ist, in der das erste Leiterelement (16) von Einbettungsmaterial (19) an mehr als 3 Seiten (53,54,55,56) umgriffen ist, und wobei, das erste Leiterelement (16) an der Verankerungsstelle (49) eine Kontur aufweist, die Einbettungsmaterial (19) hintergreift.

半導体装置及び半導体装置の製造方法

Electrical circuit arrangement has heat sink thermally coupled to a circuit carrier for electronic components and a second carrier within the first having an electronic component between it and the heat sink

An electronic circuit comprises a heat sink (12) thermally coupled to a circuit carrier (16) for wiring electronic components (20,22). A second circuit carrier (18) in a recess (24) in the first has top surface interconnections to the first carrier (26,28,30) and an electrical component (34) between the second carrier and the heat sink is electrically connected to the second carrier and thermally coupled to the heat sink. An independent claim is also included for a production process for the above.

Halbleiterleistungsmodul und Verfahren zur Herstellung des Halbleiterleistungsmoduls

Halbleiterleistungsmodul (200) mit einem nach oben und unten offenen Gehäuse (201), in das ein Halbleiterelement (220) zum Leistungsumschalten aufgenommen ist, welches wiederholt einen Strom ab- und anschaltet, der als Antwort auf ein Steuersignal einer Last zuzuführen ist, und mit einem Bodenteil (221, 231) für das Gehäuse (201), das integriert vorgesehen ist mit: einem Substrat (221) für Leistungshalbleiterchips, welches eine erste Grundschicht (222) aus einem hitzebeständigen Isoliermaterial, eine erste thermisch und elektrisch leitende Leiterstruktur (223, 224), welche auf der oberen Oberfläche des Substrats (221) für Leistungshalbleiterchips angeordnet ist und mit dem Halbleiterelement (220) zum Leistungsumschalten verbunden ist, und eine erste thermisch leitende Platte (225) enthält, welche auf der unteren Oberfläche des Substrats (221) für Leistungshalbleiterchips angeordnet ist, wobei die erste Platte (225) ein Material aufweist, welches identisch zu demjenigen der ersten Leiterstruktur ...

Verfahren zur Herstellung einer Kontaktierungsvorrichtung auf einem keramischen Substrat sowie eine nach dem Verfahren erzeugte Kontaktierungsvorrichtung

Verfahren zur Herstellung einer Kontaktierungsvorrichtung auf einem keramischen Substrat (201) umfassend• einen ersten Schritt (101) in dem ein Substrat (201) aus einem keramischen Material bereitgestellt wird, wobei auf oder im Substrat (201) eine elektrische Schaltung angeordnet ist, und• einen dritten Schritt (103) in dem ein Anschlusselement (206) bereitgestellt wird, und dadurch gekennzeichnet, dass• in einem zweiten Schritt (102) ein Kontaktelement (204) haftend auf einem lokal begrenzten, mit der Schaltung elektrisch verbundenen Kontaktierungsbereich auf einer Oberfläche (202) des Substrats (201), in einer Vertiefung (203) im Substrat (201) mittels eines maskenlosen kontinuierlichen Materialauftrags mit gleichzeitiger Aushärtung aufgebracht wird, wobei das Kontaktelement (204) mit einer Schichtdicke (205) erzeugt wird, deren Höhe größer als wenigstens eine laterale Ausdehnungsbreite des Kontaktelementes (204) ist, und• in einem vierten Schritt (104) das Anschlusselement (206) auf ...

Integrated circuit modules connection method involves connecting interlocking edge, by aligning teeth and recesses of edge of integrated circuit with adjacent edge

The method involves connecting the interlocking edge (106) of an integrated circuit module having teeth and recesses respectively, by aligning edge with adjacent circuit module (108), to allow communication between integrated circuit elements in modules.

Steuermodul

Steuermodul, insbesondere für ein Kraftfahrzeuggetriebe, mit einem ersten Gehäuseteil (6), auf dem ein elektronisches Schaltungsteil (7) angeordnet ist, einem zweiten Gehäuseteil (14) und mit einem Träger (2), an dem eine flexible Leiterfolie (9) angeordnet ist, die in einem zwischen dem ersten Gehäuseteil und dem zweiten Gehäuseteil befindlichen Gehäuseinnenraum (16) mit dem Schaltungsteil und die außerhalb des Gehäuseinnenraums mit an dem Träger (2) festgelegten elektrischen Bauelementen (4, 3) elektrisch verbunden ist, wobei das zweite Gehäuseteil (14) auf die flexible Leiterfolie (9) aufgesetzt ist, gekennzeichnet durch einen stapelförmigen Aufbau, bei dem - der Träger (2, 2a, 2b) mit einer ersten Seite auf einer mit dem Schaltungsteil versehenen Innenseite (6a) des ersten Gehäuseteils (6) aufliegend angeordnet ist, - das Schaltungsteil (7) in einer Aussparung (31) des Trägers (2, 2a, 2b) angeordnet ist und - die flexible Leiterfolie (9) auf der von dem ersten Gehäuseteil (6) abgewandten ...

Halbleitervorrichtung mit Lötstellen und Verfahren zur Herstellung

GEHAEUSE FUER ELEKTRONISCHE SCHALTUNG.

Verfahren zur Herstellung einer oberflächenmontierbaren Leiterplatte.

Connection of a junction to an electrical conductor track on a plate

A connection of an electrical junction (13) to a conductor track (5) applied to a glass or glass ceramic plate (1) is to be resistant to temperature change and traction and conductive. For this purpose an electrically conductive connecting element (11) is ultrasonically welded to the composite consisting of the conductor track (5) and plate (1). The connecting element (11) extends to the terminal (13) which is fastened to the plate (1).

Attachment of a camera module to a printed circuit board

Provided is a camera module 200 using a printed circuit board (PCB) 100 with a step portion. The camera module includes a PCB 100, a housing 210, and a lens barrel 220 installed vertically in an upper region of the housing. The PCB includes a substrate main body, a plurality of pads 110, and a step portion (120). The substrate main body is formed of a stacked structure with the shape of a rectangular plate. The pads are formed on both sides of the top of the substrate main body and are electrically connected through wires 131 to an image sensor 130 mounted on a central portion of the top of the substrate main body. The step portion is formed outside the peripheral edges of the pads. The housing has a bottom peripheral portion that is closely attached to the step portion of the PCB.

Co-axial connector interface to a planar substrate

A coaxial connector mounts directly to a planar substrate (2) of a circuit module and is oriented perpendicularly to the substrate. A radially symmetric coaxial structure, maintained through a conductive bore (6) in the substrate (2) provides a good impedance match to a planar transmission line (8 and 10) on the substrate (2). A flange (24) of the coaxial connector provides the mating surface to the substrate (2). A nipple (30) formed on the flange (24) fits in the conductive bore (6), aligning the center conductor in the conductive bore (6) and maintaining the coaxial structure. A bond 12 connects the center conductor to a microstrip transmission line on the top of the substrate.

Oscillator and electronic apparatus using the same

CONNECTING ELECTRODE TO SUPPORT ELECTRONIC CIRCUIT ELEMENT/DEVICE

Apparatus and methods for tool mark free stitch bonding

Apparatus and methods for tool mark free stitch bonding

A method for wire bonding includes feeding a wire through a capillary tip of a wirebonding tool and attaching a first end of the wire to a first location on a first surface (eg a bond pad on a semiconductor device die) with a ball bond. The capillary tip is moved towards a second location while the wire feeds out of the capillary tip and second end of the wire to the second location with a stitch bond. Contact between the capillary tip and the second location is prevented, thereby forming a stitch bond without a tool mark that damages the surface of the underlying surface (eg a lead finger on a circuit board).

SWITCHING CONFIGURATION AND MANUFACTURING PROCESS

Drahtbondingverfahren und Drahtbondingwerkzeug

The invention relates to a wire-bonding method for establishing an electric connection between a first bond body (210) with a first bond surface (211) which is to be contacted, and a second bond body (220) having a second bond surface (221) which is to be contacted, the first and the second bond surfaces having different inclinations. Said method comprises the following steps: (a) a wire-bonding head (200) with two differently inclined pressing surfaces (201, 202) and a guiding element (207) for a bond wire (203) are provided, the inclination of the first pressing surface (201) corresponds essentially to the inclination of the first bond surface (211), and the inclination of the second pressing surface (202) corresponds essentially to the inclination of the second bond surface (221), (b) a first bond connection is established between the bond wire (203) and the first bond body (210), the wire (203) being connected to the first bond surface (211) by means of the first pressing surface (201 ...

THIN ELECTRONIC MODULE FOR MICROCHIP MAP

MINIMIZING PLATING STUB REFLECTIONS IN A CHIP PACKAGE USING CAPACITANCE

Embodiments of the present invention are directed to shifting the resonant frequency in a high-frequency chip package away from an operational frequency by connecting a capacitance between an open-ended plating stub and ground. One embodiment provides a multi-layer substrate for interfacing a chip with a printed circuit board. A first outer layer provides a chip mounting location. A signal interconnect is spaced from the chip mounting location, and a signal trace extends from near the chip mounting location to the signal interconnect. A chip mounted at the chip mounting location may be connected to the signal trace by wirebonding. A plating stub extends from the signal interconnect, such as to a periphery of the substrate. A capacitor is used to capacitively couple the plating stub to a ground layer.

Control unit comprising a flexible circuit board

A wireless telemetry electronic circuit board for high temperature environments

本发明揭示了一种耐高温和高g离心力的电路组件（34）。印刷电路板（42）首先由氧化铝制成且具有通过使用厚膜金膏而形成在其上的所述电路的导电迹线。电路组件的有源和无源部件借助于在高温下扩散的金粉末而附着到所述印刷电路板。金导线用于接合在所述电路迹线和所述有源部件之间以便完成所述电路组件（34）。此外，揭示了一种用于制造耐升高温度的电路组件的方法。

Wiring substrate device, lighting device, and method for manufacturing the wiring substrate

ELECTRICAL DEVICE AND METHOD OF MANUFACTURING THEREOF

PROCEDE DE FABRICATION EN CONTINU D'UNE CARTE IMPRIMEE

LA PRESENTE INVENTION CONCERNE UN PROCEDE DE FABRICATION EN CONTINU D'UNE CARTE IMPRIMEE. CETTE CARTE COMPORTE UN SUBSTRAT 10, DES PLAGES LATERALES CONDUCTRICES 15 ET UNE PLAGE CONDUCTRICE CENTRALE 14 MENAGEE SUR UNE DES FACES DU SUBSTRAT. AVANT L'APPLICATION DE LA FEUILLE ELECTRIQUEMENT CONDUCTRICE PERMETTANT DE REALISER LESDITES PLAGES CONDUCTRICES 15, 14, ON REALISE DANS LE SUBSTRAT 10 DES PERFORATIONS TRANSVERSALES 12 ET UN EVIDEMENT CENTRAL 13 DESTINES A RECEVOIR UN CIRCUIT INTEGRE 17. LES FILS DE RACCORDEMENT 18 DU CIRCUIT INTEGRE 17 SONT DISPOSES A L'INTERIEUR DES PERFORATIONS TRANSVERSALES 12 ET FIXE ENTRE LES PLAGES ELECTRIQUEMENT CONDUCTRICES 15. CES CARTES IMPRIMEES SONT UTILISEES COMME CLES DE CODAGE DE CARTES DE CREDIT.

Electronic device comprising an electronic component mounted on a carrier substrate and mounting method

Device for coupling and connecting, to an electrical appliance, an electronic power module

SUBSTRATE Of INTERCONNECTION OF ELECTRONICS COMPONENTS HAS CIRCUITS JUST, PROVIDED With a DEVICE OF REPAIR

광전자 모듈 그리고 광전자 모듈을 제조하기 위한 방법

... 본 발명은 방사선을 방출하는 반도체 소자(1), 전기 소자(2) 및 캐리어 기판(3)을 구비하는 광전자 모듈과 관련이 있다. 캐리어 기판(3)은 상부 면(31) 및 하부 면(33)을 가지며, 이 경우 하부 면(33)에는 제 1 전기 단자들(8)이 배치되어 있고, 상부 면(31)에는 제 2 전기 단자들(5a, 5b, 6a, 6b, 7a, 7b)이 배치되어 있다. 전기 소자(2)는 캐리어 기판(3)의 상부 면(31)에 배치되어 있고, 제 1 전기 단자들(8)에 도전 접속되어 있다. 방사선을 방출하는 반도체 소자(1)는 캐리어 기판(3)으로부터 떨어져서 마주한 상기 전기 소자(2)의 측에 배치되어 있다. 또한, 방사선 방출 반도체 소자(1)는 제 2 전기 단자들(5a, 5b, 6a, 6b, 7a, 7b)에 전기 전도 가능하게 접속된 도체 구조물들(4a, 4b)도 구비한다. 본 발명은 또한 상기와 같은 광전자 모듈을 제조하기 위한 방법과도 관련이 있다.

CIRCUIT DEVICE USING PACKAGE STRUCTURE WITHOUT SUPPORT SUBSTRATE FOR RESTRAINING INCREASE OF DEVICE THICKNESS AND MANUFACTURING METHOD THEREOF

PURPOSE: A circuit device and a manufacturing method thereof are provided to prevent the increase of device thickness by using a package structure without a support substrate and to improve the degree of integration by using a gold-plated electrode portion. CONSTITUTION: A conductive pattern(3) is buried in an insulating resin. A semiconductor element(1) is electrically connected with the conductive pattern. A passive element(6) is buried in the insulating region. The passive element includes an electrode portion at both sides. A bottom portion of the passive element is lower than a surface of the conductive pattern. A bonding wire(8) is connected to the electrode portion of the passive element. The electrode portion of the passive element is plated with gold. © KIPO 2006 ...

ELECTRONIC DEVICE

An electronic device having an interposer substrate of MCM structure, or the like, in which heat dissipation performance is enhanced while sustaining connection reliability between the interposer substrate and a mother board. A metal core substrate having high thermal capacity and thermal conductivity is employed as both interposer substrate and mother board. At least one of the interposer substrate and the mother board is provided with a core metal exposing part. A pad for direct solder joint is formed at the core metal exposing part in order to solder-join the interposer substrate and the mother board. © KIPO & WIPO 2007 ...

프린트 기판, 프린트 기판의 제조 방법 및 도전성 부재의 접합 방법

... 극세 배선을 극협 피치로 접합하는 경우라도 높은 수율로 땜납 접합하고 또한 도전성 접합부 사이에 브리지를 쉽게 생기지 않게 한다. 예비 땜납된 도전성 접합부(2) 상에 심선(41)을 탑재하고, 도전성 접합부(2) 및 심선(41)을 광투과성 시트(30)로 덮는다. 이로써, 심선(41)이 도전성 접합부(2) 상에 탑재된 상태를 유지한다. 이 상태에서 광투과성 시트(30)를 향해 광을 조사한다. 예비 땜납(3)은 가열 용융되고, 도전성 접합부(2)와 심선(41)을 접합한다.

Circuit device and method for making same

In a conventional circuit device, passive elements are soldered to mounting lands with solder as electrodes are tin plated, and therefore a single layer cross-wiring is impossible when passive elements are mounted on the circuit device. Therefore, a larger mounting area is required, the reflow temperature of the reflow process when mounting passive elements on a printed circuit board is limited, and the reliability is deteriorated due to cracking of solder after packaging. This invention provides a new circuit device in which the electrodes for passive elements are gold plated, and the bonding wires are directly press fixed to the electrodes. As a result the mounting density can be improved. Furthermore, an increase of the thickness of the package is controlled by employing the package without a supporting substrate and fixing the bonding wires by bonding the passive elements in an isolation trench.

Glass ceramic composition, substrate for light-emitting element, and light-emitting device

Provided is a glass ceramic composition which enables the production of a substrate that is used for a light-emitting element and has high reflectivity and high heat conductivity, and which can prevent the occurrence of breakage of a substrate for a light-emitting element during the production process thereof. A glass ceramic composition for use in the production of a substrate on which a light-emitting element is to be mounted, which comprises a glass powder in an amount of 30-45 mass%, an alumina powder in an amount of 35-50 mass% and a zirconia powder in an amount of 10-30 mass% all relative to the total amount of the glass powder, the alumina powder and the zirconia powder, wherein the zirconia powder has an average particle diameter of one-fourth or less of that of the alumina powder.

Bendable solid state planar light source, a flexible substrate therefor, and a manufacturing method therewith

A bendable solid state planar light source, a flexible substrate therefor, and a manufacturing method therewith are introduced herein. In the flexible substrate, a first metal layer with a circuit layout is formed on a first side of the flexible substrate, and a second metal layer is entirely formed or formed with a pattern, which has characteristics of reflection and scattering, on a second side of the flexible substrate. Banding pads are alternatively formed on the first side or the second side. A plurality of LED chips are interposed on the second side of the flexible substrate in predetermined regions and electrically connected to the corresponding bonding pads by wire bonding or flip chip bonding techniques. The LED chips are conducted to current from the circuit layout to generate light for the solid state planar light source.

Method of providing metallurgy or bonding structures for input/output pads of an electronic device, and electronic device

Metallurgy structures for input/output pads of an electronic devices can be adapted to receive both solder and wire bonds. First and second metallurgy structures, for example, can be provided on respective first and second input/output pads of an electronic device such that the first and second common metallurgy structures have a shared structure adapted to receive both solder and wire bonds. A solder bond can thus be applied to the first metallurgy structure, and a wire bond can be applied to the second metallurgy structure.

SEMICONDUCTOR MEMORY CARD, PRINTED CIRCUIT BOARD FOR MEMORY CARD AND METHOD OF FABRICATING THE SAME

A printed circuit board for a memory card according to the embodiment includes an insulating layer; a mounting part on a first surface of the insulating layer, the mounting part being electrically connected to a memory device; and a terminal part on a second surface of the insulating layer, the terminal part being electrically connected to an external electronic appliance, wherein a same metal layer having a same property is formed on surfaces of the mounting part and the terminal part.

SUBSTRATE FOR MOUNTING ELEMENTS AND METHOD FOR PRODUCING SAME, AND SEMICONDUCTOR MODULE AND METHOD FOR PRODUCING SAME

A substrate furnished with a slit (ST) between one mounting area (34) and another mounting area (34) is prepared beforehand. Forming an oxide film (36) in areas that also include side surfaces merely exposes the side surfaces at the locations corresponding to the cut cross section when the tie bar (35) is cut. The cut surface at which the metal material lies exposed can thereby be made extremely small.

POWER ELECTRONICS SUBSTRATE AND PROCESS FOR MAKING IT

The proposal is for a power electronics substrate (1) with a metal plate (3) forming a heat sink and a metal coating (7 to 13) separated therefrom by an insulating layer (5), in which an electrically conductive connection (15) is formed between the metal coating forming a first signal plane and the metal plate (3) forming a ground layer. Several signal planes consisting of insulating layers (5, 19) with appropriate conductive tracks (7 to 13; 21 to 29) can advantageously be formed above the metal plate (3) forming the base. Electronic components (39) are connected to the appropriate conductive tracks only in the uppermost signal plane. The lower signal planes are used solely to make electric connections without crossings. It is thus possible to make very compact substrates even with complex conductive tracks.

Illuminator and production method

An illuminator ( 1 ) has an array of cavities ( 3 ) are drilled in a substrate having an FR4 electrically insulating body ( 7 ) plated with copper conductors ( 6 (a), 6 (b)). Further patterning of the substrate provided electrical conductors ( 3 (b)) in the cavities to act as both part of the light drive circuit and reflectors in the cavities. The drilling is performed to the full depth of the FR4 body ( 7 ) until underneath plating ( 6 (b)) is reached. A further Cu plating ( 4 (b)) is applied on the platings ( 6 (b)) so that they together form a heat spreader under each cavity ( 3 ). A layer ( 8 ) of resin incorporating thermally conductive particles is bonded to the underside surfaces, both of the FR4 ( 7 ) and of the platings ( 4 (b)). A heat sink ( 9 ) is bonded to the layer ( 8 ). Good optical efficiency and thermal dissipation is achieved, despite the fact that conventional PCT processing techniques are used.

Printed circuit board and semiconductor package using the same

A printed circuit board and a semiconductor package using the same. The semiconductor package includes a printed circuit board (PCB) and a semiconductor chip mounted on the PCB. The printed circuit board includes a base substrate that has a first surface and a second surface which are positioned opposite to each other, and has through-holes, the first surface having a concave-convex portion, an adhesive layer that is disposed on the second surface of the base substrate, a wiring layer that is attached to the second surface of the base substrate by the adhesive layer and that comprises exposed portions exposed through the through-holes, an adhesive member that is disposed on the first surface of the base substrate and adheres the semiconductor chip to the first surface, and electrical connection members that electrically connect the wiring layer with the semiconductor chip.

Method of making a semiconductor chip assembly with a bump/base/ledge heat spreader, dual adhesives and a cavity in the bump

A method of making a semiconductor chip assembly includes providing a bump and a ledge, mounting a first adhesive on the ledge including inserting the bump into an opening in the first adhesive, mounting a conductive layer on the first adhesive including aligning the bump with an aperture in the conductive layer, then flowing the first adhesive between the bump and the conductive layer, solidifying the first adhesive, then providing a heat spreader that includes the bump, a base and the ledge, then mounting a second adhesive on the ledge, mounting a conductive trace that includes a pad and a terminal on the second adhesive, then mounting a semiconductor device on the bump in a cavity in the bump, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader.

Method of preparing surface-mounted wiring board

A method of preparing a surface-mounted wiring board according to the present invention includes forming a plurality of die pads and bonding pads, which are composed of Cu or Ni and arranged at predetermined areas of a wiring board. Electrical connections are formed between the die pads and between the die pad and the bonding pads. An Au-plated coating on each of the formed pad surfaces is formed by electroplating. The Au-electroplated pad surfaces are isolated from each other by selectively cutting away part of a predetermined area on the wiring board to separate the conductors electrically interconnecting the pads. When both the die pad for arranging and mounting an electronic component and the bonding pads for connecting the arranged and mounted electronic component to the signal lines (wiring pattern) are Au-electroplated to coat them, one conductor terminal for plating is shared among the die pad and the bonding pads.

Stacked Semiconductor Component Having Through Wire Interconnect And Method Of Fabrication

A stacked semiconductor component includes a plurality of semiconductor substrates in a stacked array and a continuous wire extending through aligned vias on the semiconductor substrates of the stacked array in electrical contact with contacts on the semiconductor substrates. A method for fabricating the semiconductor component includes the steps of stacking the semiconductor substrates in a stacked array with aligned vias; threading a wire through the aligned vias; and forming a plurality of electrical connections between the wire and the contacts on the semiconductor substrates.

Simultaneous bidirectional cable interface

A cable connection with at least one cable as a wire conducted signal interconnection between two cables module circuits connected to respective ends of the cable connection. Conductors of the cable may be directly and permanent electrical connected at each end to the respective contacts at the respective cable module circuit. The cable module circuits may be arranged for sending and/or receiving of a wire-conducted signal transmitted via the cable connection. During fabrication of the integrated cable module the cable module circuits can be matched to the respective cable impedance with high accuracy. Further, by connecting the cable permanent and directly to transceiver circuits at each end of the cable, the connection may be protected from different kinds of disturbances, enabling high simultaneous bidirectional bit rates using such interconnections between electronic units or modules.

Selectively coating bond pads

Solder ball bond pads and wire bond pads may be selectively coated so that the wire bond bond pads have a thicker gold coating than the solder ball bond pads. This may reduce the embrittlement of solder ball joints while providing a sufficient thickness of gold for the wire bonding process. In general, gold coatings are desirable on electrical contact surfaces to prevent oxidation. However, the thickness of gold which is necessary on solder ball bond pads may be less and excessive gold may be disadvantageous. Thus, by masking the solder ball bond pads during the gold coating of the wire bond bond pads, a differential gold thickness may be achieved which is more advantageous for each application.

Semiconductor chip assembly with bump/base/ledge heat spreader, dual adhesives and cavity in bump

A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and dual adhesives. The heat spreader includes a bump, a base and a ledge. The conductive trace includes a pad and a terminal. The semiconductor device is mounted on the bump in a cavity in the bump, is electrically connected to the conductive trace and is thermally connected to the heat spreader. The bump extends into an opening in the first adhesive and is aligned with and spaced from an opening in the second adhesive. The base and the ledge extend laterally from the bump. The first adhesive is sandwiched between the base and the ledge, the second adhesive is sandwiched between the conductive trace and the ledge and the ledge is sandwiched between the adhesives. The conductive trace is located outside the cavity and provides signal routing between the pad and the terminal.

LIQUID DISCHARGING APPARATUS AND WIRING MEMBER

A liquid discharging apparatus includes: liquid discharging modules which are arranged in a first direction along a predetermined plane; and a wiring member commonly joined to the liquid discharging modules. The wiring member includes: first parts joined to the liquid discharging modules, respectively, in a state that the first parts are arranged side by side in the first direction along the predetermined plane; second parts; and a sixth part. The second parts include: third parts extending from the first parts, respectively, in a second direction orthogonal to the first direction and along the predetermined plane, fourth parts extending in a third direction away from the predetermined plane, and fifth parts connected to the third parts and the fourth parts, respectively. Width in the first direction of each of the second parts is smaller than width in the first direction of the sixth part. 1. A liquid discharging apparatus comprising:head units arranged in a first direction along a predetermined plane; andflexible wiring boards drawn from the head units respectively toward a second direction orthogonal to the first direction and along the predetermined plane,wherein each of the head units includes an IC,each of the head unit has an outer shape that is a parallelogram and that is not a rectangle,each of the flexible wiring boards is joined to only one side of corresponding one of the head units, in a state of being bent toward a third direction away from the predetermined plane, andeach of the flexible wiring boards is not joined to the other sides of the corresponding one of the head units.2. The liquid discharging apparatus according to claim 1 , wherein each of the flexible wiring boards includes a driving signal wiring through which a driving signal is supplied to the corresponding one of the head units.3. The liquid discharging apparatus according to claim 1 , wherein each of the flexible wiring boards includes a constant potential wiring through which a ...

WIRING SUBSTRATE, STACKED WIRING SUBSTRATE, AND MANUFACTURING METHOD OF WIRING SUBSTRATE

A wiring substrate includes: a wiring structure that includes a wiring layer and an insulating layer laminated; a plurality of first posts that are formed along a periphery of a predetermined area on a surface of the wiring structure, and that protrude out from the surface of the wiring structure; and a second post that is connected to the wiring layer at a position surrounded by the first posts, and that protrudes out from the surface of the wiring structure. The first posts are formed such that a post arranged at a central portion of a side constituting the periphery of the predetermined area is lower in height from the surface of the wiring structure than posts arranged at both ends of the side. 1. A wiring substrate comprising:a wiring structure that includes a wiring layer and an insulating layer laminated;a plurality of first posts that are formed along a periphery of a predetermined area on a surface of the wiring structure, and that protrude out from the surface of the wiring structure; anda second post that is connected to the wiring layer at a position surrounded by the first posts, and that protrudes out from the surface of the wiring structure, whereinthe first posts are formed such that a post arranged at a central portion of a side constituting the periphery of the predetermined area is lower in height from the surface of the wiring structure than posts arranged at both ends of the side.2. The wiring substrate according to claim 1 , further comprisinga solder resist layer that covers the surface of the wiring structure, whereinthe first posts are formed on the solder resist layer.3. The wiring substrate according to claim 1 , whereinthe first posts are formed on the insulating layer exposed to the surface of the wiring structure.4. The wiring substrate according to claim 1 , whereinthe first posts and the second post are made from an identical metal material.5. The wiring substrate according to claim 1 , whereinthe first posts are formed such that ...

Hybrid interconnect

A connector for connection to terminals of an integrated circuit. The connector consists of a dielectric substrate having a first side and a second side. The connector has wire bond terminals which are attached to the first side of the substrate and configured to receive wire bonds connected to a first set of the terminals of the integrated circuit. The connector also has solder bump terminals, attached to the second side of the substrate so as to be insulated from the wire bond terminals, the solder bump terminals being configured to be coupled via solder balls with a second set of the terminals of the integrated circuit.

SOLDERING APPARATUS

A soldering apparatus, that moves a jet nozzle while ensuring that molten solder does not spill to the outside of the jet nozzle, is provided. The soldering apparatus includes a solder tank storing the molten solder, a jetting mechanism including the jet nozzle and a pump, which pumps the molten solder stored in the solder tank, an XY-direction moving mechanism that moves the solder tank, and a control device that controls the acceleration and deceleration of the solder tank according to the height of the molten solder protruding upwards from a tip of the jet nozzle or the height of the molten solder protruding upwards from the tip of the jet nozzle according to the acceleration and deceleration of the solder tank. 1. A soldering apparatus that solders a lead wire of an electronic component onto a circuit board by applying molten solder to the lead wire , which passes through a through-hole formed in the circuit board , the apparatus comprising:a solder tank that is disposed below a holding surface on which the circuit board is held and that stores the molten solder;a jetting mechanism that has a jet nozzle, which is provided in the solder tank and extends upwards from the solder tank toward the holding surface, and a pump, which pumps the molten solder stored in the solder tank to the jet nozzle, and that jets the molten solder from the jet nozzle toward the holding surface by the pump being driven;an XY-direction moving mechanism that moves the solder tank in an X-direction and a Y-direction, which arc parallel to the holding surface; anda control device that controls the jetting mechanism and the XY-direction moving mechanism,wherein the control device controls the acceleration and deceleration of the solder tank according to the height of the molten solder protruding upwards from a tip of the jet nozzle or the height of the molten solder protruding upwards from the tip of the jet nozzle according to the acceleration and deceleration of the solder tank such that ...

Method and Apparatus for Flexible Circuit Cable Attachment

A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.

LED SUBSTRATE WITH ELECTRICAL CONNECTION BY BRIDGING

A support for one or more light sources for a lighting and/or light-signaling module for an automotive vehicle, comprising a substrate made of heat-conducting material, preferably made of a metal material, at least one light source of light-emitting diode type with one face for mounting on the substrate, in thermal contact with the latter and a circuit for controlling the electrical power supply of the one or more light sources. The circuit for controlling the power supply is electrically connected to the one or more light sources by means of metal wires that are soldered to the surface using the technique commonly referred to as “wire/ribbon bonding”. A method for assembling such a support. 12102202302{'b': 4', '104', '204', '304, 'a substrate (; ; , ) made of heat-conducting material, preferably made of a metal material;'}{'b': 12', '112', '212', '312', '4', '104', '204', '304, 'at least one light source (; ; ; ) of light-emitting diode type with one face for mounting on the substrate (; ; , ), in thermal contact with the latter;'}{'b': 10', '29', '11', '21', '310, 'a circuit for controlling the electrical power supply (, ; O; O; ) of the one or more light sources,'}. A support (; ; ; ) for one or more light sources for a lighting and/or light-signaling module for an automotive vehicle, comprising:102911213101211221231216116216316the circuit for controlling the power supply (, ; O; O; ) is electrically connected to the one or more light sources (, ; ; ) by means of metal wires that are soldered to the surface (; ; ; ). This application is a Continuation of U.S. application Ser. No. 15/102,964, filed Jun. 9, 2016, which is a national phase application of International Application No. PCT/EP2014/078892, filed Dec. 19, 2014 and claims priority to French Patent Application 1363260, filed Dec. 20, 2013. The entire contents of the above applications are incorporated herein by reference.The invention relates to the field of lighting and/or light signaling, especially for ...

PCB Based Semiconductor Package Having Integrated Electrical Functionality

A semiconductor package includes a metal baseplate, a semiconductor die having a reference terminal attached to the baseplate and an RF terminal facing away from the baseplate, and a multilayer circuit board having a first side attached to the baseplate and a second side facing away from the baseplate. The multilayer circuit board includes a plurality of interleaved signal and ground layers. One of the signal layers is at the second side of the multilayer circuit board and electrically connected to the RF terminal of the semiconductor die. One of the ground layers is at the first side of the multilayer circuit board and attached to the metal baseplate. Power distribution structures are formed in the signal layer at the second side of the multilayer circuit board. RF matching structures are formed in a different one of the signal layers than the power distribution structures.

Circuit board and light emitting device provided with same

A circuit board includes a substrate that is composed of a ceramic and has a first surface, a conductor layer that is based on a metal, and a resin layer that is based on a resin. Each of the conductor layer and the resin layer is located side by side in contact with the first surface. The conductor layer has a first site that covers at least a part of a site of the resin later on a side of the conductor layer and a side of a surface of the resin layer.

SYSTEM AND METHOD FOR FABRICATING Z-AXIS VERTICAL LAUNCH

An apparatus for automating the fabrication of a copper vertical launch (CVL) within a printed circuit board (PCB) includes a feed mechanism to feed and extrude copper wire from a spool of copper wire and a wire cutting and gripping mechanism to receive copper wire from the feed mechanism, cut and secure a segment of copper wire, insert the segment of copper wire into a hole formed within the PCB, solder an end of the segment of copper wire to a signal trace of the PCB, and flush cut an opposite end of the segment of the copper wire to a surface of the PCB. The wire cutting and gripping mechanism includes a wire cutter to flush cut the segment of copper wire and an integrated heated gripper device to receive the copper wire from the spool of copper wire and cut and grab a segment from copper wire. 1. An apparatus for automating the fabrication of a copper vertical launch (CVL) within a printed circuit board (PCB) , the apparatus comprising:a feed mechanism configured to feed and extrude copper wire from a spool of copper wire; and receive copper wire from the feed mechanism,', 'cut and secure a segment of copper wire,', 'insert the segment of copper wire into a hole formed within the PCB,', 'solder an end of the segment of copper wire to a signal trace of the PCB, and', 'flush cut an opposite end of the segment of the copper wire to a surface of the PCB., 'a wire cutting and gripping mechanism configured to'}2. The apparatus of claim 1 , wherein the wire cutting and gripping mechanism includes a wire cutter configured to flush cut the segment of copper wire and an integrated heated gripper device to receive the copper wire from the spool of copper wire and cut and grab a segment from copper wire.3. The apparatus of claim 2 , wherein the wire cutter is mounted on a slide claim 2 , which is used to position the wire cutter below the wire gripper assembly.4. The apparatus of claim 2 , wherein the wire gripper assembly includes a pair of gripper jaws and an inverted ...

THREE-DIMENSIONAL PACKAGING STRUCTURE AND PACKAGING METHOD OF POWER DEVICES

A three-dimensional packaging structure and a packaging method of power devices. The packaging structure includes power devices, direct copper bonded substrates (i.e., DBC substrates), flexible printed circuit boards (i.e., FPC boards), bonding wires, heat dissipation substrates, decoupling capacitors, a heatsink with integrating the fan, shells, and forms a half-bridge circuit structure composed by the power devices. The power circuit structure is optimized, parasitic inductance in the commutation loop is reduced by mutual inductance cancellation, thus overvoltage and oscillation during the power device switching process can be reduced. Additionally, by using the flexible characteristic of the flexible PCB, a three-dimensional packaging structure is formed and power density is improved. 1. A three-dimensional packaging structure of power devices , comprising: a heatsink for integrating a fan , a first heat dissipation substrate , a second heat dissipation substrate , a third heat dissipation substrate , a first DBC substrate , a second DBC substrate , a third DBC substrate , a power devices , a first FPC board , a second FPC board and a third FPC board;the first heat dissipation substrate, the second heat dissipation substrate and the third heat dissipation substrate are respectively fixed on three surfaces of the heatsink;the first DBC substrate, the second DBC substrate and the third DBC substrate are respectively soldered on the three heat dissipation substrates;the power devices include a plurality of MOSFET chips and a plurality of SBD chips, and all MOSFET chips and all SBD chips are attached to the three DBC substrates and constitute a half-bridge circuit;the first FPC board, the second FPC board and the third FPC board are soldered on the three DBC substrates, the first FPC board is used for connecting the main power circuit, the second FPC board serves as a driving connection board of the high-side MOSFET chips in the half-bridge circuit, and the third FPC ...

SYSTEMS AND METHODS TO FABRICATE A RADIO FREQUENCY INTEGRATED CIRCUIT

To reduce radio frequency losses during operation of a radio frequency integrated circuit module, the radio frequency integrated circuit module is fabricated such that at least one of an edge of the wirebond pad on the copper trace and a sidewall of the copper trace is free from high-resistivity plating material. The unplated portion provides a path for the radio frequency current to flow around the high-resistivity material, which reduces the radio frequency signal loss associated with the high resistivity plating material. 1. A radio frequency integrated circuit module comprising:a substrate;a radio frequency integrated circuit die supported by the substrate;a copper trace including at least a sidewall and formed on the substrate;a nickel layer plated over a portion of a top surface of the copper trace;a palladium layer plated over the nickel layer; anda gold layer plated over the palladium layer, the nickel, palladium, and gold layers forming a wire bonding pad that covers a plated portion of the top surface copper trace and does not cover an unplated portion of the top surface of the copper trace that is substantially parallel to the wire bonding pad, a width of the unplated portion extending from a periphery of the wire bonding pad to the sidewall, a lead of the radio frequency integrated circuit die bonded to the wire bonding pad.2. The radio frequency integrated circuit module of wherein the width of the unplated portion of the top surface of the copper trace is at least approximately 50 microns.3. The radio frequency integrated circuit module of wherein the width of the unplated portion of the top surface of the copper trace is approximately 50 microns to approximately 100 microns.4. The radio frequency integrated circuit module of wherein the width of the unplated portion of the top surface of the copper trace is approximately 20 microns to approximately 200 microns.5. The radio frequency integrated circuit module of wherein the unplated portion of the ...

Power conversion module

The disclosure relates to a power conversion module, including: a substrate including a routing layer and an insulating layer, the routing layer including a first routing area and a second routing area; an electronic device provided on the first routing area and electrically connected to the first routing area and the second routing area, respectively; a vertical type power device provided on the second routing area and electrically connected to the second routing area; and a capacitor provided on the substrate, disposed between the electronic device and the vertical type power device, and electrically connected to the electronic device and the vertical type power device, respectively. The power conversion module is provided with all devices on the same substrate, thus cost is reduced, yield rate and reliability are improved, and parasitic inductance inside the power conversion module can be reduced.

Integrated packaged light engine and signal transmitting and receiving method thereof

Disclosed are an integrated packaged light engine and signal emitting and receiving method thereof. The light engine includes molded interconnection device in which ceramic substrate is embedded, laser chip, photodiode chip, optical driving chip, transimpedance amplifier chip, array lens module and optical fiber interface provided on the ceramic substrate; the signal transmitting method includes: S1, powering optical drive chip by external power supply; S2, transmitting external signal to optical drive chip, so that laser chip emits optical signal; S3, totally reflecting and then transmitting optical signal by array lens module. The signal receiving method includes: S1, optical signal entering optical fiber interface; S2, optical signal entering array lens module; S3, transmitting optical signal to photodiode chip by array lens module; S4, converting and then transmitting optical signal into electrical signal to transimpedance amplifier chip by photodiode chip; S5, transmitting electrical signal to external circuit by transimpedance amplifier chip.

Semiconductor device

A semiconductor device includes a semiconductor unit, a printed circuit board and a case, including a bottom portion formed in a plate-like shape and a side wall portion surrounding an outer periphery of the bottom portion of the case. The bottom portion has a main circuit area having an opening, and a control circuit area adjacent to the main circuit area in a plan view. The semiconductor unit is attached in the main circuit area from a rear surface of the bottom portion such that an insulating plate of the semiconductor unit is exposed to inside the case through the opening. The printed circuit board is disposed in the control circuit area on the front surface of the bottom portion via a spacer, having a gap between the printed circuit board and the front surface of the bottom portion.

Impedance Controlled Electrical Interconnection Employing Meta-Materials

A method of improving electrical interconnections between two electrical elements is made available by providing a meta-material overlay in conjunction with the electrical interconnection. The meta-material overlay is designed to make the electrical signal propagating via the electrical interconnection to act as though the permittivity and permeability of the dielectric medium within which the electrical interconnection is formed are different than the real component permittivity and permeability of the dielectric medium surrounding the electrical interconnection. In some instances the permittivity and permeability resulting from the meta-material cause the signal to propagate as if the permittivity and permeability have negative values. Accordingly the method provides for electrical interconnections possessing enhanced control and stability of impedance, reduced noise, and reduced loss. Alternative embodiments of the meta-material overlay provide, the enhancements for conventional discrete wire bonds whilst also facilitating single integrated designs compatible with tape implementation. 120.-. (canceled)21. A device comprising: the first set of layers includes a second conductor layer and a third conductor layer, wherein the second conductor layer is disposed between the first surface of the first conductor layer and the third conductor layer;', 'the second set of layers includes a fourth conductor layer and a fifth conductor layer, wherein the fourth conductor layer is disposed between the second surface of the first conductor layer and the fifth conductor layer;', 'the second conductor layer includes a first plurality of electrically independent conductors arranged to span the width of the plurality of layers and the third conductor layer extends continuously along the width of the plurality of layers; and', 'the fourth conductor layer includes a second plurality of electrically independent conductors arranged to span the width of the plurality of layers and the ...

Printed circuit boards having metal layers and semiconductor packages including the same

Printed circuit boards are provided. The printed circuit board includes an insulation layer, an interconnection portion and a metal layer. The insulation layer has a flat plate shape and includes a top surface and a bottom surface. The interconnection portion is disposed on at least one of the top and bottom surfaces of the insulation layer. The interconnection portion includes a plurality of interconnection patterns. The metal layer covers the plurality of interconnection patterns of the interconnection portion. Related semiconductor packages are also provided.

LIQUID DISCHARGING APPARATUS AND WIRING MEMBER

A liquid discharging apparatus includes: liquid discharging modules which are arranged in a first direction along a predetermined plane; and a wiring member commonly joined to the liquid discharging modules. The wiring member includes: first parts joined to the liquid discharging modules, respectively, in a state that the first parts are arranged side by side in the first direction along the predetermined plane; second parts; and a sixth part. The second parts include: third parts extending from the first parts, respectively, in a second direction orthogonal to the first direction and along the predetermined plane, fourth parts extending in a third direction away from the predetermined plane, and fifth parts connected to the third parts and the fourth parts, respectively. Width in the first direction of each of the second parts is smaller than width in the first direction of the sixth part. 1. A liquid discharging apparatus comprising:liquid discharging modules which are arranged in a first direction along a predetermined plane; anda wiring member commonly joined to the liquid discharging modules, first parts joined to the liquid discharging modules, respectively, in a state that the first parts are arranged side by side in the first direction along the predetermined plane; and', third parts extending from the first parts, respectively, in a second direction orthogonal to the first direction and along the predetermined plane,', 'fourth parts extending in a third direction away from the predetermined plane, and', 'fifth parts connected to first ends of the third parts and second ends of the fourth parts, respectively, the first ends being located on a side opposite to the first parts in the second direction, the second ends being located on a side close to the predetermined plane in the third direction; and, 'second parts including, 'a sixth part commonly connected to third ends of the fourth parts, the third ends being located on a side far from the predetermined ...

Fixture for use with fine wire laser soldering

A fixture assembly for use with fine wire laser soldering. The fixture includes a holding and support fixture and a wire securing and tensioning fixture. The holding and support fixture has a wire holding member and a retention member. The wire holding member and the retention member cooperate with wires prior to the wires being soldered. The wire securing fixture has wire tensioning projections and wire retention members. The wire tensioning projections and wire retention members cooperate with the wires to provide tension to the wire prior to the wires being soldered.

Microelectronic modules with sinter-bonded heat dissipation structures and methods for the fabrication thereof

High thermal performance microelectronic modules containing sinter-bonded heat dissipation structures are provided, as are methods for the fabrication thereof. In various embodiments, the method includes the steps or processes of providing a module substrate, such as a circuit board, including a cavity having metallized sidewalls. A sinter-bonded heat dissipation structure is formed within the cavity. The sintered-bonded heat dissipation structure is formed, at least in part, by inserting a prefabricated thermally-conductive body, such as a metallic (e.g., copper) coin into the cavity. A sinter precursor material (e.g., a metal particle-containing paste) is dispensed or otherwise applied into the cavity and onto surfaces of the prefabricated thermally-conductive body before, after, or concurrent with insertion of the prefabricated thermally-conductive body. The sinter precursor material is then sintered at a maximum processing temperature to produce a sinter bond layer bonding the prefabricated thermally-conductive body to the metallized sidewalls of the module substrate.

ELECTRIC CIRCUIT AND METHOD OF MANUFACTURE

In accordance with an embodiment, a method for manufacturing an electric circuit that includes providing a support having a first region, the first region having a first conductor that has a first sidewall and a second conductor that has a second sidewall, wherein the first conductor is electrically isolated from the second conductor is provided. A distance between the first sidewall and the second sidewall is increased using a technique such as stamping, etching, or trimming. A first circuit element is coupled to the first conductor and encapsulated in a mold compound. In accordance with another embodiment, an electric circuit includes a support having interconnect with sidewalls wherein notches extend from one or more of the sidewalls into the interconnect. A circuit element is coupled to the interconnect by a bonding agent and protected by a protective structure. 1. A method for manufacturing an electric circuit , comprising:providing a support having a first region, the first region having a first conductor that has a first sidewall and a second conductor that has a second sidewall, wherein the first conductor is electrically isolated from the second conductor;increasing a distance between the first sidewall of the first conductor and the second sidewall of the second conductor;coupling a first circuit element to the first conductor; andencapsulating the first circuit element and a portion of the first conductor having the first sidewall in a mold compound.2. The method of claim 1 , wherein increasing the distance between the first sidewall of the first conductor and the second sidewall of the second conductor includes forming a first notch that extends from the first sidewall into the first conductor.3. The method of claim 2 , wherein increasing the distance between the first sidewall of the first conductor and the second sidewall of the second conductor includes forming a second notch that extends from the second sidewall into the second conductor.4. The ...

Electronic device comprising a chip and at least one smt electronic component

An electronic device includes a carrier substrate with an electronic IC chip mounted on top of the carrier substrate. An encapsulation block on top of the front face of the carrier substrate embeds the IC chip. The encapsulation block has a through-void for positioning and confinement that extends through the encapsulation block to the top of the carrier substrate. At least one electronic component is positioned within the through-void and mounted to the top of the carrier substrate. Solder bumps or pads are located within the through-void to electrically connect the at least one electronic component to the carrier substrate.

PCB Based Semiconductor Package with Impedance Matching Network Elements Integrated Therein

A Doherty amplifier includes a metal baseplate having a die attach region and a peripheral region; a main amplifier and one or more peaking amplifiers, each amplifier comprising a transistor die that includes at least one RF terminal; and a multilayer circuit board having a first side attached to the peripheral region and a second side facing away from the baseplate. The circuit board includes two embedded electrically conductive layers separated from the two sides by respective composite fiber layers, and an embedded dielectric layer disposed between the embedded electrically conductive layers and having a higher dielectric constant than either of the composite fiber layers. The Doherty amplifier also includes an RF impedance matching network that is electrically connected to an RF terminal of at least one amplifier transistor die, and that comprises one or more reactive components formed from at least one of the embedded electrically conductive layers. 1. A Doherty amplifier , comprising:a metal baseplate having a die attach region and a peripheral region;a main amplifier and one or more peaking amplifiers, wherein each amplifier comprises a transistor die that includes at least one RF terminal; a first side attached to the peripheral region;', 'a second side facing away from the baseplate:', 'a first embedded electrically conductive layer that is separated from the first side by a first embedded composite fiber layer;', 'a second embedded electrically conductive layer that is separated from the second side by a second embedded composite fiber layer; and', 'an embedded dielectric layer that is disposed between the first and second embedded electrically conductive layers, and that has a higher dielectric constant than either of the first and second embedded composite fiber layers;, 'a multilayer circuit board comprisingan RF impedance matching network that is electrically connected to an RF terminal of at least one of the amplifier transistor dies, and that ...

Retaining structure of wiring member, liquid discharge head, liquid discharge device, and liquid discharge apparatus

A retaining structure of a flexible wiring member includes a flexible wiring member; and a retaining member. The flexible wiring member includes a front side wiring electrode formed on a front side the flexible wiring member and a rear side wiring electrode formed on a rear side thereof, and the flexible wiring member is bonded to the retaining member via the rear side wiring electrode. A liquid discharge head includes nozzles to discharge a liquid; an individual liquid chamber to hold the liquid; a pressure generator to press the liquid inside the individual liquid chamber; an actuator substrate, including an electrode, in which a wiring and the pressure generator are disposed. The electrode of the actuator and that of the flexible wiring member are connected; and the flexible wiring member is retained to the actuator or a member joined to the actuator via the retaining structure of the wiring member.

METHOD AND APPARATUS FOR FLEXIBLE CIRCUIT CABLE ATTACHMENT

A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength. 1. A method for flexible circuit cable attachment , the method comprising:bonding a plurality of gold bumps to each interconnection pad of a plurality of interconnection pads on a substrate to create columns at each interconnection pad;dispensing a bonding material on a first flexible circuit cable;aligning and forcibly pressing the substrate and the first flexible circuit cable together, wherein the column restricts dispersion of the bonding material; andapplying a first set of predetermined levels of heat to promote the bonding material to bond between the substrate and the first flexible circuit cable.2. The method of claim 1 , further comprising:bending a second flexible circuit cable with respect to the first flexible circuit cable;bonding another plurality of gold bumps to each interconnection pad of another plurality of interconnection pads on the substrate to create columns at each interconnection pad;dispensing a bonding material on the second flexible circuit cable;aligning and forcibly pressing the substrate and the second flexible circuit cable together; andapplying a second set of predetermined levels of heat to promote the bonding material to bond between the substrate and the second flexible circuit cable.3. The method of claim 2 , wherein the first flexible circuit cable ...

OPTOELECTRONIC MODULE ASSEMBLY AND MANUFACTURING METHOD

An optoelectronic module assembly includes an optoelectronic module. The module includes: an active optoelectronic component in or on a mounting substrate, an optical sub-assembly, and a spacer disposed between the mounting substrate and the optical sub-assembly so as to establish a particular distance between the active optoelectronic component and the optical sub-assembly. The optoelectronic module assembly also includes a recessed substrate including first and second surfaces, wherein the second surface is in a plane closer to the optical sub-assembly than is the first surface. The optoelectronic module is mounted on the first surface. The second surface is for mounting other components. 1. An optoelectronic module comprising:an active optoelectronic component in or on a mounting substrate, the mounting substrate having a first surface and having a second surface on an opposite side from the first surface;an optical sub-assembly; anda spacer disposed between the mounting substrate and the optical sub-assembly so as to establish a particular distance between the active optoelectronic component and the optical sub-assembly;first electrical contacts disposed on the first surface of the mounting substrate; andsecond electrical contacts disposed on the second surface of the mounting substrate.2. The optoelectronic module of claim 1 , wherein the spacer comprises electrically insulating protrusions that project beyond the second surface of the mounting substrate in a direction away from the optical sub-assembly.3. The optoelectronic module of wherein the mounting substrate comprises a lead frame claim 1 , printed circuit board or ceramic board having conductive wiring.4. A method for manufacturing an optoelectronic module assembly claim 1 , the method comprising:establishing electrical contact to an active optoelectronic component in or on a first side of a mounting substrate, wherein the electrical contact is established via electrical contacts on a second side of the ...

Electrically conductive material

An electrically conductive material includes a liquid gallium alloy mixed with multiple solid particles, so as to form an electrically conductive material in which solid and liquid coexist. The electrically conductive material is disposed between and electrically connecting a first conductor and a second conductor. The first conductor is disposed on a first electronic element, and the second conductor is disposed on a second electronic element.

Led lighting apparatus

A LED lighting apparatus includes a driver, a substrate, LED chips, a first fluorescent layer and a second fluorescent layer. The driver converts an external power source to a driving current. The substrate is mounted with two electrodes electrically connected to the driver for getting the driving current. The plurality of LED chips are mounted on a first side of the substrate. The first fluorescent layer is disposed on the first side of the substrate covering the plurality of LED chips. The second fluorescent layer is disposed on a second side of the substrate. A part of a light emitted from the plurality of LED chips passing through the first fluorescent layer and then exciting the second fluorescent layer to emit a second light.

SYSTEMS AND METHODS FOR FLEXIBLE COMPONENTS FOR POWERED CARDS AND DEVICES

Die may be thinned using a thinning and/or a polishing process. Such thinned die may be flexible and may change operational characteristics when flexed. The flexible die may be applied to a mechanical carrier (e.g., a PCB) of a card or device. Detection circuitry may also be provided on the PCB and may be used to detect changed operational characteristics. Such detection circuitry may cause a reaction to the changed characteristics by controlling other components on the card or device based upon the flex-induced changed characteristics. The thinned die may be stacked, interconnected, and encapsulated between sheets of laminate material to form a flexible card or device. 13-. (canceled)4. A method of making a device , comprising:reducing a thickness of two or more die;stacking said two or more die onto a PCB;encapsulating said die between sheets of a laminate material; andhardening said encapsulation to form said device.5. (canceled)6. The method of claim 4 , wherein:a thickness of each of said two or more die is between approximately 0.003 inches and 0.005 inches.7. The method of claim 4 , wherein:a thickness of each of said two or more die is approximately 0.004 inches. This application claims the benefit of U.S. Provisional Patent Application No. 61/600,950, titled “SYSTEMS AND METHODS FOR FLEXIBLE COMPONENTS FOR POWERED CARDS AND DEVICES,” filed Feb. 20, 2012 (Attorney Docket No. D/083 PROV), which is hereby incorporated by reference herein in its entirety.This invention relates to powered cards and devices and related systems.A card may include a dynamic magnetic communications device, which may take the form of a magnetic encoder or a magnetic emulator. A magnetic encoder, for example, may be utilized to modify information that is located on a magnetic medium, such that a magnetic stripe reader may then be utilized to read the modified magnetic information from the magnetic medium. A magnetic emulator, for example, may be provided to generate electromagnetic ...

WIRING BOARD SOLDERED WITH LEAD WIRE AND ELECTRONIC DEVICE COMPRISING WIRING BOARD

A wiring board and an electronic device which suppress variation in a leading direction of lead wire after soldering and variation in a tip position of the lead wire and keep a height of a soldered lead wire low while suppressing variation in the height. A wiring board is soldered with lead wire. A surface of the wiring board is formed with a land part by exposing a conductor. The land part is formed with a groove part, which is a region not including the conductor, for positioning of the lead wire along a leading direction. The lead wire mounted to the groove part is soldered to the land part in such a manner as to cover the groove part. 1. An electronic device comprising:lead wire; anda wiring board soldered with said lead wire,wherein a surface of said wiring board is formed with a land part by exposing a conductor,wherein the land part is formed with a groove part, which is a region not including the conductor, for positioning of said lead wire along a leading direction, andwherein said lead wire mounted to the groove part is soldered to the land part in such a manner as to cover the groove part.2. The electronic device according to claim 1 ,wherein end parts of the land part on the leading side of said lead wire are connected by a first connecting part formed by the conductor.3. The electronic device according to claim 1 ,wherein a longitudinal direction of the groove part and a longitudinal direction of the land part are different.4. The electronic device according to claim 1 ,wherein a width of the groove part is smaller than a diameter of a part of said lead wire to be soldered.5. The electronic device according to claim 1 ,wherein end parts of the land part on an opposite side of the leading side of said lead wire are connected by a second connecting part formed by the conductor.6. The electronic device according to claim 1 ,wherein solder is provided to regions including the conductor, the regions opposite to each other interposing the groove part in the ...

Photosensitive assembly, camera module and manufacturing method thereof

The present application relates to a photosensitive assembly, including a circuit board, a photosensitive chip and a metal wire. A first surface of the circuit board has a protrusion structure and a chip attachment area, and the protrusion structure is distributed in the chip attachment area. The photosensitive chip is attached to the first surface by an adhesive, and the adhesive is at least disposed between the top surface of the protrusion structure and the bottom surface of the photosensitive chip. The metal wire electrically connects the photosensitive chip and the circuit board in a wire bonding manner. The present application further provides a corresponding manufacturing method for a camera module and a photosensitive assembly. The present application can avoid or suppress the deformation of the photosensitive chip at a smaller cost of space size. The photosensitive assembly and the camera module of the present application can improve the structural strength of the circuit board. The photosensitive assembly and the camera module of the present application can improve the heat dissipation efficiency of the photosensitive chip.

Organic light emitting diode

An organic light emitting diode including a structure of a flexible printed circuit board installed on a substrate is provided.

INTEGRATED CIRCUIT CHIP PACKAGING

A method of mounting an integrated circuit chip to a circuit board includes placing the integrated circuit chip into a cavity extending from a surface of the circuit board to an embedded conductor, electrically connecting the integrated circuit chip to the embedded conductor, and disposing a heat sink over a surface of the integrated circuit chip. The electrically connecting the integrated circuit chip to the embedded conductor includes flip chip mounting of the integrated circuit chip within the cavity. 1. A method of mounting an integrated circuit chip to a circuit board , the method comprising:placing said integrated circuit chip into a cavity extending from a surface of said circuit board to an embedded conductor; andelectrically connecting said integrated circuit chip to said embedded conductor,wherein said electrically connecting said integrated circuit chip to said embedded conductor comprises flip chip mounting said integrated circuit chip within said cavity.2. The method of claim 1 , further comprising providing said cavity in said circuit board.3. The method of claim 2 , wherein said providing said cavity comprises milling said surface of said circuit board to said embedded conductor.4. The method of claim 3 , wherein said providing of said cavity comprises providing said cavity with a side surface that includes a step.5. The method of claim 4 , wherein a top surface of said step is aligned with another embedded conductor.6. The method of claim 4 , wherein a top surface of said step exposes said embedded conductor.7. The method of claim 1 , further comprising:disposing a heat sink over a surface of said integrated circuit chip.8. The method of claim 7 , further comprising:disposing the heat sink on an outer surface of a thermal slug for transferring a thermal energy away from said circuit board.9. The method of claim 8 , wherein said integrated circuit chip abuts a bottom surface of the thermal slug.10. The method of claim 8 , wherein claim 8 , with ...

INTEGRATED CIRCUIT CHIP PACKAGING

A method of mounting an integrated circuit chip to a circuit board includes placing the integrated circuit chip into a cavity extending from a surface of the circuit hoard to an embedded conductor, electrically connecting the integrated circuit chip to the embedded conductor, and disposing a heat sink over a surface of the integrated circuit chip. 1. A method of mounting an integrated circuit chip to a circuit board , the method comprising:placing said integrated circuit chip into a cavity extending from a surface of said circuit board to an embedded conductor:electrically connecting said integrated circuit chip to said embedded conductor; anddisposing a heat sink over a surface of said integrated circuit chip.2. The method of claim 1 , further comprising providing said cavity in said circuit board.3. The method of claim 2 , wherein said providing said cavity comprises milling said surface of said circuit board to said embedded conductor.4. The method of claim 3 , wherein said providing of said cavity comprises providing said cavity with a side surface that includes a step.5. The method of claim 4 , wherein a top surface of said step is aligned with another embedded conductor.6. The method of claim 4 , wherein a top surface of said step exposes said embedded conductor.7. The method of claim 4 , wherein said electrically connecting comprises electrically connecting said integrated circuit chip to a plurality of embedded conductors in addition to said embedded conductor claim 4 ,8. The method of claim 7 , wherein said electrically connecting said integrated circuit chip to the plurality of embedded conductors comprises providing one of a ribbon bond claim 7 , a wire bond claim 7 , and a ball bond.9. The method of claim 1 , wherein said electrically connecting said integrated circuit chip to said embedded conductor comprises flip chip mounting said integrated circuit chip within said cavity.10. The method of claim 1 , wherein a top surface of said integrated circuit ...

BIOCOMPATIBLE ELECTROMECHANICAL CONNECTION FOR CERAMIC SUBSTRATE ELECTRONICS FOR BIOMEDICAL IMPLANT

A biocompatible electrical connection includes: a substrate; a ferrule having a concentric flange at a first end of the ferrule; a first adhesive; and a second adhesive. The substrate includes a hole having a diameter that is a specified amount larger than an outside diameter of the ferrule forming an annular space between the hole and the ferrule, the first adhesive adheres a first surface of the concentric flange of the ferrule to a first surface of the substrate, and the second adhesive fills the annular space between the hole and the ferrule. 1. A biocompatible electrical connector , comprising:a substrate;a ferrule comprising a concentric flange at a first end of the ferrule;a first adhesive; anda second adhesive, the substrate comprises a hole having a diameter that is a specified amount larger than an outside diameter of the ferrule forming an annular space between the hole and the ferrule,', 'the first adhesive adheres a first surface of the concentric flange of the ferrule to a first surface of the substrate, and', 'the second adhesive fills the annular space between the hole and the ferrule., 'wherein2. The biocompatible electrical connector of claim 1 , wherein the ferrule further comprises a substantially concentric through hole configured to accept a conductive wire lead.3. The biocompatible electrical connector of claim 2 , wherein an electrical connection between the conductive wire lead and the ferrule is formed by a welded joint between the conductive wire lead and the ferrule around a circumference of the through hole.4. The biocompatible electrical connector of claim 3 , wherein the welded joint is formed using one of a laser welding process and a resistive welding process.5. The biocompatible electrical connector of claim 1 , wherein the substrate comprises a ceramic material.6. The biocompatible electrical connector of claim 1 , wherein the ferrule comprises one of a platinum-iridium (Pt-Ir) material and an implant grade stainless steel.7. The ...

Radio frequency amplifiers having improved shunt matching circuits

RF amplifiers are provided that include a submount such as a thermally conductive flange. A dielectric substrate is mounted on an upper surface of the submount, the dielectric substrate having a first outer sidewall, a second outer sidewall that is opposite and substantially parallel to the first outer sidewall, and an interior opening. An RF amplifier die is mounted on the submount within the interior opening of the dielectric substrate, where a longitudinal axis of the RF amplifier die defines a first axis. The RF amplifier die is positioned so that a first angle defined by the intersection of the first axis with the first outer sidewall is between 5° and 45°. The dielectric substrate may be a ceramic substrate or a dielectric layer of a printed circuit board.

Minimizing plating stub reflections in a chip package using capacitance

The present invention is directed to shifting the resonant frequency in a high-frequency chip package away from an operational frequency by connecting a capacitance between an open-ended plating stub and ground. One embodiment provides a method including capacitively coupling a plating stub to ground so that the resonant frequency caused by the plating stub in a semiconductor package is shifted away from an operational frequency.

Electronic circuit

An electronic circuit, comprising at least three circuit boards ( 2.1, 2.2, 2.3 ) fastened at a frame ( 1 ) and electrically connected via contact pins ( 7 ) arranged therein, and an electric connection ( 11 ), connected to a third of the circuit boards ( 2.1 ). The circuit shall show a low structural space and here be cost-effective in its production and assembly. The circuit boards ( 2.1, 2.2, 2.3 ) are arranged in levels parallel in reference to each other and are fastened at a predetermined mutual distance at the frame ( 1 ), with bases ( 4, 5, 6 ) being embodied at the faces of the frame ( 1 ), with the ends being parallel to the faces of at least two of the bases ( 4, 5, 6 ) in one level, arranged in groups, and with the embodiment of the frame ( 1 ) and the circuit boards ( 2.1, 2.2, 2.3 ) being adjusted to each other.

LASER DIODE CHIP ON PRINTED CIRCUIT BOARD

A light source module comprising a semiconductor light source mounted directly to a conducting trace of a multilayer printed circuit board having a core comprising a plurality of core layers electrically and thermally coupled by a plurality of buried vias wherein at least one of the core layers comprises a heat sink plane. 1. A light source module comprising:a multilayer printed circuit board (ML-PCB) having:a core comprising a plurality of core layers electrically and thermally coupled together, wherein at least one of the plurality of core layers comprises a heat sink plane;a top layer on a first side of the core having formed thereon a first conducting element and second and third conducting elements respectively on either side of the first conducting element, wherein each of the first, second, and third conducting elements is thermally coupled to the heat sink plane of the at least one of the plurality of core; anda semiconducting light source having a first electrode bonded to the first conducting element with a thermally and electrically conducting epoxy and electrically connected to each of a second electrode and a third electrode.2. The light source module according to wherein a second core layer of the plurality of core layers comprises a second heat sink plane and wherein the heat sink plane and the second heat sink plane are thermally coupled by a plurality of buried vias.3. The light source module according to wherein the plurality of buried vias are arrayed at a pitch less than or equal to about 500 μm.4. The light source module according to wherein the at least one of the plurality of core layers and the second core layer of the plurality of core layers comprises all of the plurality of core layers.5. The light source module according to wherein a plurality of microvias that couple the first conducting element to the heat sink plane of the at least one of the plurality of core layers are distributed in array having a pitch less than or equal to about ...

PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD ARRANGEMENT

The invention describes a printed circuit board with a top side and a bottom side, the printed circuit board comprising at least two electrically conductive layers () for transmitting electrical current and at least one electrically insulating layer () comprising electrically insulating material, wherein the electrically conductive layers () and the electrically insulating layer () are arranged in an alternating assembly such that the two electrically conductive layers () are electrically insulated with respect to each other by means of the electrically insulating layer (), wherein each of the electrically conductive layers () is adapted to be coupled to a bond wire () independently from the other electrically conductive layer () at a side surface of the printed circuit board being inclined to the top side and the bottom side of the printed circuit board. The invention further describes a corresponding method of fabricating the printed circuit board. The invention further describes a printed circuit board arrangement comprising the printed circuit board and a corresponding method of fabricating the printed circuit board arrangement. 1. A printed circuit board arrangement comprising: a top side;', 'a bottom side;', 'at least two electrically conductive layers, wherein the at least two electrically conductive layers are arranged to transmit electrical current; and', 'at least one electrically insulating layer, the at least one electrically insulating layer comprising electrically insulating material,, 'at least one printed circuit board, the printed circuit board comprisinga carrier; anda contacting circuit board,wherein the at least two electrically conductive layers and the at least one electrically insulating layer are arranged in an alternating assembly such that the at least two electrically conductive layers are electrically insulated with respect to each other by means of the at least one electrically insulating layer,wherein each of the at least two ...

Circuit board and light emitting device including circuit board

A circuit board according to the present disclosure includes a substrate, a conductor layer arranged on the substrate, a reflective layer arranged on the conductor layer, and a silicone-resin layer arranged on the substrate. The silicone-resin layer is in contact with the conductor layer and the reflective layer. The silicone-resin layer contains equal to or more than 45% by mass of a plurality of fillers. A first filler whose aspect ratio is larger than 5 occupies equal to or more than 5% of 100% of a total number of the fillers.

Printed circuit board assembly (pcba) with integrated mounting structure to align and couple to transmitter optical assembly (tosa) modules

The present disclosure is generally directed to an optical transceiver module that includes a mounting section for aligning and coupling to associated TOSA modules. In particular, an embodiment of the present disclosure includes TOSA and ROSA components disposed on a printed circuit board assembly (PCBA). The PCBA includes a plurality of grooves at a optical coupling end to provide a TOSA mounting section. Each of the grooves provides at least one mating surface to receive and couple to an associated TOSA module. Opposite the optical coupling end, the PCBA includes an electric coupling section for coupling to, for example, a transmit (RX) circuit that provides one or more electrical signals to drive TOSA modules coupled to the TOSA mounting section.

STRUCTURE FOR FLEXIBLE PRINTED CIRCUIT BOARDS

A flexible printed circuit board installed on a substrate in a display device is provided. 114.-. (canceled)15. A display device comprising:a display panel including a substrate having a display portion and non-display portion positioned on an outer side of the display portion, anda structure of a flexible printed circuit board positioned in the non-display area,wherein the structure of a flexible printed circuit board comprising two or more flexible printed circuit boards positioned at edges on the substrate and mounted with anode pads and cathode pads, the two or more flexible printed circuit boards including a first flexible printed circuit board and a second flexible printed circuit board,wherein at least one of a soldering portion and a wire bonding portion which respectively make the anode pads and the cathode pads mounted on neighboring end portions of the first and second flexible printed circuit boards conduct electricity,wherein a first end of the at least one of a soldering portion and a wire bonding portion is connected with the anode pad or the cathode pad of the first flexible printed circuit board, and a second end of the at least one of a soldering portion and a wire bonding portion is connected with the anode pad or the cathode pad of the second flexible printed circuit board, andwherein the first flexible printed circuit board has an end portion and the second flexible printed circuit board has an end portion, the end portion of the first flexible printed circuit board overlaps the end portion of the second flexible printed circuit board, and the at least one of a soldering portion and a wire bonding portion overlaps each of the end portion of the first flexible printed circuit board and the end portion of the second flexible printed circuit board.16. The display device of claim 15 , wherein the display device is any one of a plasma display panel (PDP) claim 15 , a touch panel claim 15 , a light emitting diode (LED) claim 15 , an organic light ...

Integrated Circuit With Sensor Printed In Situ

The present disclosure teaches a method for manufacturing a module comprising an integrated circuit and a sensor. The method may comprise: mounting an integrated circuit (IC) die on a printed circuit board (PCB) using a high temperature process to provide an electrical connection between interconnects of the PCB and the die; and printing a sensor directly onto the module after all high temperature mounting processes are complete. 1. A method for manufacturing a module comprising an integrated circuit and a sensor , the method comprising:mounting an integrated circuit (IC) die on a printed circuit board (PCB) using a high temperature process to provide an electrical connection between interconnects of the PCB and the die; andenclosing the IC die in a housing comprising a top surface with a plurality of exposed contact areas providing electrical connections to the die enclosed in the housing; andprinting a sensor directly onto the top surface of the housing after all high temperature mounting processes are complete.26-. (canceled)7. A method for manufacturing a module comprising an integrated circuit and a sensor , the method comprising:mounting an integrated circuit (IC) die on a printed circuit board (PCB) using a high temperature process to provide an electrical connection between interconnects of the PCB and the die; andprinting a sensor directly onto the PCB after all high temperature mounting processes are complete.8. A method for joining a sensor device to an integrated circuit , the method comprising:mounting an integrated circuit die (IC) to a printed circuit board with a high temperature mounting process;at least partially enclosing the IC in a housing comprising a top surface; andprinting the sensor device directly onto the top surface of the housing.9. A method according to claim 8 , wherein the top surface of the housing defines a plurality of exposed contact areas providing electrical connections to the IC die; andwherein the method includes printing the ...

Flexible light emitting semiconductor device with large area conduit

A flexible polymeric dielectric layer ( 12 ) having first and second major surfaces, the first major surface having a conductive layer ( 20 ) thereon, the dielectric layer having at least one conduit ( 10 ) extending from the second major surface to the first major surface, the conduit having at least one lateral dimension of at least about one centimeter and being at least partially filled with conductive material ( 18 ), the conductive layer including at least one conductive feature ( 21 ) substantially aligned with the conduit ( 10 ), the conductive feature ( 21 ) supporting a plurality of light emitting semiconductor devices ( 22 ).

Printed circuit board for memory card and method of manufacturing the same

Provided is a printed circuit board for a memory card and a method of manufacturing the same, the printed circuit board for the memory card, including: an insulating layer; a mounting unit formed on a first surface of the insulating layer and electrically connected to a memory device; a terminal unit formed on a second surface of the insulating layer and electrically connected to electronic apparatuses of an outside; and metal layers formed at the mounting unit and the terminal unit and made of the same material.

Semiconductor module

A semiconductor module includes: a circuit board on which a first semiconductor chip and a second semiconductor chip are mounted and includes a first through hole formed with a conductor foil therein; a press-fit terminal that is electrically connected to the conductor foil in the first through hole of the circuit board; and a second resin that is disposed on a surface side and a back surface side of the circuit board. Further, the press-fit terminal is provided with a pressure contact portion which is press-fitted into the first through hole and is electrically connected to the conductor foil in the first through hole, and the second resin on the surface side of the circuit board and the second resin on the back surface side of the circuit board are integrally formed via a second resin that is filled in the first through hole.

POTENTIAL EQUALIZATION IN A CONTROL DEVICE FOR A MOTOR VEHICLE

An arrangement for potential equalization in a control device for a motor vehicle includes at least one electrical component on a circuit carrier, a carrier structure on which the circuit carrier is arranged, and at least one contacting element that electroconductively connects the circuit carrier to the carrier structure by way of a connecting element that forms a potential equalization. The contacting element has a bondable surface coating. 111-. (canceled)12. An arrangement for potential equalization in a control device for a motor vehicle , comprising:a carrier structure;a circuit carrier disposed on said carrier structure;at least one electrical component disposed on said circuit carrier; andat least one contact-making element connecting said circuit carrier to said carrier structure electrically conductively by way of a connecting element in order to establish potential equalization, said at least one contact-making element having a bondable surface coating.13. The arrangement according to claim 12 , wherein said surface coating is an electrodeposited coating or a chemically deposited coating on said contact-making element.14. The arrangement according to claim 13 , wherein said surface coating comprises a material selected from the group consisting of aluminum claim 13 , copper claim 13 , silver claim 13 , and a compound thereof.15. The arrangement according to claim 13 , wherein said surface coating comprises a compound selected from the group consisting of nickel/gold claim 13 , nickel/silver claim 13 , nickel/palladium/gold and nickel/palladium/silver.16. The arrangement according to claim 12 , wherein said contact-making element is connected to said carrier structure with a force-fit or with a positively locking connection by way of a screw or rivet connection.17. The arrangement according to claim 12 , wherein said carrier structure is a part of a control device housing.18. The arrangement according to claim 17 , wherein said carrier structure is a base ...

DISPLAY DEVICE

A display device includes a display substrate including a display area and a pad area, which is disposed on the periphery of the display area; and a display panel including at least one wire pad, which is disposed in the pad area of the display substrate, where the wire pad includes a main pad portion, which extends in a first direction, a first protruding pad portion, which protrudes from a first side, in a second direction intersecting the first direction, of the main pad portion, and a second protruding pad portion, which protrudes from a second side, in the second direction, of the main pad portion, and the first protruding pad portion is disposed closer than the second protruding pad portion to the display area. 1. A display device comprising:a display substrate including a display area and a pad area, which is disposed on a periphery of the display area; and a main pad portion, which extends in a first direction;', 'a first protruding pad portion, which protrudes from a first side, in a second direction intersecting the first direction, of the main pad portion; and', 'a second protruding pad portion, which protrudes from a second side, in the second direction, of the main pad portion,, 'a display panel including a wire pad, which is disposed in the pad area of the display substrate, the wire pad includingwherein the first protruding pad portion is disposed closer than the second protruding pad portion to the display area.2. The display device of claim 1 , whereinthe first direction is a direction from the display area toward an end of the pad area where the wire pad is disposed, andthe second side, in the second direction, of the main pad portion is opposite to the first side, in the second direction, of the main pad portion.3. The display device of claim 2 , wherein the wire pad further includes a third protruding pad portion claim 2 , which protrudes from the first side claim 2 , in the second direction claim 2 , of the main pad portion claim 2 , and a ...

Led lighting apparatus

An LED lighting apparatus includes an LED substrate, a LED chip, a sealing resin member, and a reflecting face. The LED substrate has a main surface. The LED chip is mounted on the main surface of the LED substrate. The sealing resin member is made of a material that transmits light from the LED chip. The sealing resin member covers the LED chip. The sealing resin member has a shape bulging in the direction in which the main surface faces. The reflecting face surrounds the sealing resin member.

LED SUBSTRATE WITH ELECTRICAL CONNECTION BY BRIDGING

A support for one or more light sources for a lighting and/or light-signaling module for an automotive vehicle, comprising a substrate made of heat-conducting material, preferably made of a metal material, at least one light source of light-emitting diode type with one face for mounting on the substrate, in thermal contact with the latter and a circuit for controlling the electrical power supply of the one or more light sources. The circuit for controlling the power supply is electrically connected to the one or more light sources by means of metal wires that are soldered to the surface using the technique commonly referred to as “wire/ribbon bonding”. A method for assembling such a support. 1. A support for one or more light sources for a lighting and/or light-signaling module for an automotive vehicle , comprising:a substrate made of heat-conducting material, preferably made of a metal material;at least one light source of light-emitting diode type with one face for mounting on the said substrate in thermal contact with the latter; anda circuit for controlling an electrical power supply of said one or more light sources,wherein said circuit for controlling said electrical power supply is electrically connected to said one or more light sources by means of metal wires that are soldered to surface of said circuit.2. The support as claimed in claim 1 , wherein said metal wires aerially extend claim 1 , preferably with looping profiles claim 1 , away from respective outer surfaces of said circuit for controlling said electrical power supply and of the said one or more light sources.3. The support as claimed in claim 1 , wherein said circuit for controlling said electrical power supply is borne by said substrate and comprises an edge that is facing said one or more light sources.4. The support as claimed in claim 1 , wherein said circuit for controlling said electrical power supply is printed on or in a board made of an electrically insulating material claim 1 , ...

Three-dimensional packaging structure and packaging method of power devices

A three-dimensional packaging structure and a packaging method of power devices. The packaging structure includes power devices, direct copper bonded substrates (i.e., DBC substrates), flexible printed circuit boards (i.e., FPC boards), bonding wires, heat dissipation substrates, decoupling capacitors, a heatsink with integrating the fan, shells, and forms a half-bridge circuit structure composed by the power devices. The power circuit structure is optimized, parasitic inductance in the commutation loop is reduced by mutual inductance cancellation, thus overvoltage and oscillation during the power device switching process can be reduced. Additionally, by using the flexible characteristic of the flexible PCB, a three-dimensional packaging structure is formed and power density is improved.

OPTICAL SUBASSEMBLY, OPTICAL MODULE, AND OPTICAL TRANSMISSION EQUIPMENT

An optical subassembly includes: a conductor plate having a pair of penetration holes, both penetrating the conductor plate from an outer surface to an inner surface; a pair of lead terminals fixed in the two respective penetration holes and passing through the pair of penetration holes; a wiring board with a pair of wiring patterns arranged on a surface; and a plurality of bonding wires electrically connecting the pair of lead terminals and the pair of wiring patterns. A cross section of the pair of lead terminals on the inner surface side is larger than a cross section on the outer surface side. End faces on the inner surface side are situated within a range from +180 μm to −100 μm to the inner side from the inner surface of the conductor plate in a direction perpendicular to the inner surface. 1. An optical subassembly comprising:a conductor plate having a pair of penetration holes, both penetrating the conductor plate from an outer surface to an inner surface;a pair of lead terminals fixed in the two respective penetration holes by a dielectric and passing through the pair of penetration holes from the outer surface to the inner surface;a wiring board with a pair of wiring patterns arranged on a surface; anda plurality of bonding wires electrically connecting the pair of lead terminals and the pair of wiring patterns,wherein a cross section of the pair of lead terminals at an end part on the inner surface side is larger than a cross section at an end part on the outer surface side, andend faces on the inner surface side of the pair of lead terminals are situated within a range from +180 μm to −100 μm to the inner side from the inner surface of the conductor plate in a direction perpendicular to the inner surface.2. The optical subassembly according to claim 1 , further comprisinga pedestal section arranged protruding further to the inner side from the inner surface of the conductor plate,wherein the wiring board is arranged on a top surface of the pedestal ...

ELECTRONIC DEVICE COMPRISING AN ELECTRONIC COMPONENT MOUNTED ON A SUPPORT SUBSTRATE AND ASSEMBLY METHOD

A support substrate has first electric contacts in a front face. An electronic component is located above the front face of the support substrate and has second electric contacts facing the first electric contacts of the support substrate. An electric connection structure is interposed between corresponding first and second electric contacts of the support substrate and the electronic component, respectively. Each electric connection structure is formed by: a shim that is made of a first electrically conducting material, and a coating that is made of a second electrically conducting material (different from the first electrically conducting material). The coating surrounds the shim and is in contact with the corresponding first and second electric contacts of the support substrate and the electronic component. 1. An electronic device , comprising:a support substrate having first electric contacts in a front face;an electronic component located above the front face of the support substrate and having second electric contacts facing the first electric contacts of the support substrate; andan electric connection structure interposed between corresponding first and second electric contacts of the support substrate and the electronic component, respectively; a shim made of a first electrically conducting material; and', 'a coating made of a second electrically conducting material, different from the first electrically conducting material, which surrounds the shim and which is in contact with corresponding first and second electric contacts of the support substrate and of the electronic component, respectively., 'wherein each electric connection structure comprises2. The device according to claim 1 , wherein the coating adheres to the shim.3. The device according to claim 2 , wherein each shim adheres to the first electric contact of the support substrate.4. The device according to claim 1 , wherein each shim adheres to the electric contact of the support substrate.5. The ...

Circuit board, image sensor unit, image reading apparatus, and image forming apparatus

A circuit board includes: a printed board including SWB pads for wire bonding and lands; image sensor ICs mounted on the printed board by a thermosetting adhesive and including FWB pads for wire bonding to be electrically connected to the SWB pads by wire bonding; and surface-mount elements mounted on the lands by soldering, wherein the surface-mount elements and the lands are connected by solders including bromine-containing flux, and coating films are formed on surfaces of the solders to prevent attachment of bromine to the SWB pads and the FWB pads.

Optical Module

The disclosure discloses an optical module, and relates to the field of optic fiber communications. A circuit according to an embodiment of the disclosure includes: a chip, which includes at least one wiring side, and on which there are arranged first signal interface pads arranged parallel to the wiring side; a circuit board on which there are arranged a number of second signal interface pads corresponding to the first signal interface pads, wherein at least two of the distances between the respective second signal interface pads and the wiring side are different from each other; and signal wires configured to connect the corresponding first signal interface pads and second signal interface pads. 1. An optical module , comprising:a chip having at least one wiring side and a plurality of first signal interface pads arranged parallel to the wiring side;a circuit board having a plurality of second signal interface pads corresponding to the first signal interface pads, wherein at least two of distances between the respective second signal interface pads and the wiring side are different from each other; anda plurality of signal wires each connected between corresponding ones of the first signal interface pads and second signal interface pads, wherein at least one signal wire corresponding to one of the second signal interface pads positioned at a first distance from the wiring side has a first steepness, at least one signal wire corresponding to one of the second signal interface pads positioned at a second distance from the wiring side has a second steepness different than the first steepness to inhibit crosstalk between the signal wires, and the first distance is different than the second distance.2. The optical module according to claim 1 , wherein projections of centers of the respective second signal interface pads onto the wiring side do not coincide with each other.3. The optical module according to claim 1 , wherein the respective second signal interface pads ...

PRINTED CIRCUIT BOARD, METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD, AND METHOD FOR JOINING CONDUCTIVE MEMBER

Soldering is performed with a high yield ratio even when extremely-thin wires are joined at an extremely-narrow pitch. Moreover, a bridge between conductive joint portions is reduced. A core wire is placed on a preliminarily-soldered conductive joint portion Then, the conductive joint portions and the core wires are covered with an optically-transparent sheet Thus, the state in which the core wire is placed on the conductive joint portion is held. In this state, the optically-transparent sheet is irradiated with light. A preliminary solder is heated and melted to join the core wire and the conductive joint portion together. 1. A method for joining a conductive member , comprising:a placement state holding process of holding a placement state of the conductive member in such a manner that an upper surface of the conductive member placed on each of a plurality of conductive joint portions with preliminary solders applied thereto and the preliminary solder are covered with an optically-transparent sheet having an adhesive layer; anda joint process of joining the conductive joint portion and the conductive member together by heating and melting the preliminary solder by light irradiation of the conductive joint portion and the conductive member through the optically-transparent sheet.2. A method for manufacturing a printed circuit board , comprising:a conductive member setting process of placing a conductive member on each of a plurality of conductive joint portions with preliminary solders applied thereto;a placement state holding process of holding a placement state of the conductive member in such a manner that an upper surface of the conductive member and the preliminary solder are covered with an optically-transparent sheet having an adhesive layer; anda joint process of joining the conductive joint portion and the conductive member together by heating and melting the preliminary solder by light irradiation of the conductive joint portion and the conductive member ...

SUPPORT STRUCTURE FOR STACKED INTEGRATED CIRCUIT DIES

Delamination of stacked integrated circuit die configurations on printed circuit boards is avoided by providing a metal trace support structure underneath the die stack. The metal trace support structure features substantially equally spaced thin metal traces in place of a contiguous metal plate which has been used in the past. Spaced apart thin metal traces are less vulnerable to thermal expansion than a metal plate which has a large thermal mass. The metal traces still provide structural stability, while preventing delamination of the die stack configuration during thermal processing. A method of attaching a bridge die stack configuration to a printed circuit board by adhering a die attach film to a field of metal traces is demonstrated. In addition, the electrical and structural integrity of the bridge die stack formed with a metal trace support structure is confirmed with test results. 1. A device comprising:a printed circuit board including an embedded interconnect structure having a top metal layer;a metal trace support structure formed within the top metal layer, the support structure including metal trace lines that are equally spaced apart in a regular pattern and substantially parallel along their entire length;a stacked arrangement of integrated circuit dies attached to the printed circuit board and overlying the metal trace support structure; andbond wires coupling the integrated circuit dies to one another.2. The device of wherein the metal trace support structure extends across an area comparable to a lower surface area of the stacked arrangement of integrated circuit dies.3. The device of wherein the stacked arrangement of integrated circuit dies is electrically coupled to the embedded interconnect structure by a ball grid array on a lower surface of a base die.4. The device of wherein the stacked arrangement of integrated circuit dies is electrically coupled to the embedded interconnect structure by a land grid array on a lower surface of a base die. ...

Electronic Component And Method For Producing An Electronic Component Of This Kind

The disclosure relates to an electronic component that includes a printed circuit board with two opposite flat sides and a plurality of electronic components, and a base plate. A number of the electronic components are each fixed on and electrically conductively connected to a rear flat side of the printed circuit board and a further number of the electronic components are each fixed on and electrically conductively connected to a front flat side of the printed circuit board. The base plate has at least one first cutout for receiving electronic components that are arranged on the rear flat side of the printed circuit board. The disclosure also relates to a method for producing an electronic component of this kind. 1. An electronic component comprising: two opposing flat sides being a rear flat side and a front flat side, and', 'a plurality of electronic component parts, wherein a number of the electronic component parts is fixed and electrically conductively connected to the rear flat side of the printed circuit board and a further number of the electronic component parts is fixed and electrically conductively connected to the front flat side of the printed circuit board; and, 'a printed circuit board includinga base plate having at least one first recess for accommodating electronic component parts, which are arranged on the rear flat side of the printed circuit board.2. The electronic component of claim 1 , wherein the number of the electronic component parts is fixed in an integrally joined manner on the rear flat side by solder points and electrically conductively connected to the printed circuit board.3. The electronic component of claim 1 , wherein the further number of the electronic component parts is adhesively bonded to the front flat side by means of an electrically conductive adhesive and electrically conductively connected to the printed circuit board by wire contacting.4. The electronic component of claim 1 , wherein a position of one of the electronic ...

Liquid ejection head and method of manufacturing the same

A recording element substrate is bonded to an FPC in at least a part of a region of a second face between a liquid supply port and an edge of the recording element substrate, and an electric connection part is provided in which a wiring conductor and a pad are electrically connected to each other by a bonding wire.

COATED WIRE FOR BONDING APPLICATIONS

The invention is related to a bonding wire which contains a core having a surface and a coating layer which is at least partially superimposed over the surface of the core. The core contains a core main component selected from copper and silver. The coating layer contains a coating component selected from palladium, platinum, gold, rhodium, ruthenium, osmium and iridium in an amount of at least 10% and further contains the core main component in an amount of at least 10%. 121.-. (canceled)22. A bonding wire comprising a core having a surface and a coating layer which is at least partially superimposed over the surface of the core , wherein the core comprises a core main component selected from the group consisting of copper and silver; and wherein the coating layer comprises a coating component selected from the group consisting of palladium , platinum , gold , rhodium , ruthenium , osmium and iridium in an amount of at least 10% and further comprises the core main component in an amount of at least 10%.23. The wire according to claim 22 , wherein an outer range of the coating layer extends from a depth of 0.1% of a wire diameter to a depth of 0.25% of the wire diameter claim 22 , and wherein the amount of the core main component and the amount of the coating component are present in the outer range.24. The wire according to claim 23 , wherein the amount of the core main component in the outer range is between 30% and 70%.25. The wire according to claim 23 , wherein the amount of the coating component decreases within the outer range toward an inside of the wire.26. The wire according to claim 25 , wherein a difference of the amount of the coating component at a radially inner border of the outer range and the amount of the coating component at a radially outer border of the outer range is not more than 30%.27. The wire according to claim 22 , wherein a main component of the wire changes at least two times starting from an outside of the wire up to a depth of 0.25% ...

Image pickup apparatus and image pickup apparatus manufacturing method

An image pickup apparatus is configured with an image pickup device on which a plurality of bumps are arranged in line on an outer circumferential portion of a light receiving surface; and a flexible wiring board including a plurality of inner leads each of which is configured with a distal end portion, a bending portion and a rear end portion, the distal end portion being compression-bonded to a bump, and the rear end portion being arranged parallel to a side face of the image pickup device with the bending portion interposed between the distal end portion and the rear end portion. A height of a light receiving portion side of the bumps is lower than a height of a side face side; and each of the inner leads is plastically transformed according to a shape of a top face of the bumps.

Electronic Assembly and Method for the Production thereof

The disclosure provides an electronic assembly that includes: a carrier element, a circuit carrier having a number of electronic components, a circuit board, which is electrically conductively connected to the circuit carrier, and a covering element for covering the circuit carrier. The covering element is arranged on one flat side of the circuit board and the carrier element is arranged on an opposite flat side of the circuit board. The circuit board is welded respectively to the carrier element and to the covering element. The disclosure further relates to a method for producing such an electronic assembly.

Method for Bonding an Electrically Conductive Element to a Bonding Partner

One aspect relates to a method that includes bonding an electrically conductive element to a bonding surface of a bonding partner by increasing a temperature of a bonding section of the electrically conductive element from an initial temperature to an increased temperature by passing an electric heating current through the bonding section, and pressing the bonding section with a pressing force against the bonding surface using a sonotrode and introducing an ultrasonic vibration into the bonding section via the sonotrode such that the increased temperature of the bonding section, the ultrasonic signal in the bonding section and the pressing force are simultaneously present and cause the formation of a tight and direct bond between the bonding section and the bonding surface. 1. A method for bonding an electrically conductive element to a bonding surface of a bonding partner , the method comprising:increasing a temperature of a bonding section of the electrically conductive element from an initial temperature to an increased temperature by passing an electric heating current through the bonding section; andpressing the bonding section with a pressing force against the bonding surface using a sonotrode and introducing an ultrasonic vibration into the bonding section via the sonotrode such that the increased temperature of the bonding section, the ultrasonic signal in the bonding section and the pressing force are simultaneously present and cause the formation of a tight and direct bond between the bonding section and the bonding surface.2. The method of claim 1 , wherein the increased temperature is greater than 80° C. and less than a melting point of the bonding section.3. The method of claim 1 , wherein the increased temperature greater than 80° C. and greater than or equal to a melting point of the bonding section.4. The method of claim 1 , wherein the electric heating current is supplied to the bonding section via the sonotrode.5. The method of claim 1 ,wherein the ...

Method and Apparatus for Flexible Circuit Cable Attachment

A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength. 1. A system for attaching flexible circuit cables , comprising:a substrate including a first set of interconnection pads, wherein a plurality of gold bumps are bonded to each interconnection pad to create a columnar structure;at least one flexible circuit cable, wherein a bonding material is dispensed on the at least one flexible circuit cable;an alignment device to align the substrate and the at least one flexible circuit cable;a weight to forcibly press together the substrate and the at least one flexible circuit cable; anda hot air reflow system (HARS) to apply a first set of predetermined levels of heat to promote the bonding material to bond between the substrate and the at least one flexible circuit cable, wherein the columnar structure restricts dispersion of the bonding material.2. The system of claim 1 , wherein another plurality of gold bumps are bonded to another set of interconnection pads to create additional columnar structures claim 1 , further comprising:a bending tool;at least another flexible circuit cable, wherein the bending tool bends the at least another flexible circuit cable with respect to the at least one flexible circuit cable and wherein bonding material is dispensed on the at least another flexible circuit cable;the alignment device aligning the substrate ...

Method and apparatus for edge connection between elements of an integrated circuit

An integrated circuit (IC) having a plurality of IC modules, each IC module having attachment surfaces to which elements of the IC are attached, and each IC module having interlocking edges adjacent to the attachment surface. The interlocking edges of adjacent IC modules are interlocked to form a structural connection between the IC modules. The interlocking edges are a plurality of teeth and recesses, which are arranged in rows. The teeth are securely received by a respective recess in an adjacent interlocking edge to create a structural connection between adjacent IC modules. In addition, the interlocking edges can be a ridge member or a ridge recess, where the ridge member or ridge recess is securely received by a respective ridge recess or ridge member of an adjacent IC module to create a structural connection between the IC modules. The interconnection edge can also be a combination of the ridge member, ridge recess, and/or the rows of teeth and recesses. The attachment surfaces of adjacent IC modules can be co-planar and non-planar, depending on the shape desired. The elements on the IC modules communicate using external pathways and/or internal pathways using conventional wire-bond techniques or using conductive layers within the IC module. The IC module is formed of conventional Si wafers. Using this configuration, an IC can be constructed that utilizes less real estate, fits in non-planar spaces in a housing, and has improved speed due to reduced pathway lengths.

Method and apparatus for edge connection between elements of an integrated circuit

Flip-chip adaptor package for bare die

A board for connecting a bare semiconductor die with a bond pad arrangement which does not conform to a master printed circuit board with a specific or standardized pin out, connector pad, or lead placement arrangement. The board comprises a printed circuit board including first elements, such as minute solder balls, pins, or bond wires, for making electrical contact between the board and the master board, and second elements, such as minute solder balls, pins, or bond wires, for making electrical contact between the semiconductor die and the board. The board has circuit traces for electrical communication between the board/master board electrical contact elements, and the semiconductor die board electrical contact elements.

Grid array packages and assemblies including the same

A semiconductor device assembly includes a substrate and a semiconductor die adjacent to a first surface of the substrate. The substrate also includes a second surface opposite from the first surface, an opening extending from the first surface and the second surface, contact pads on the second surface, and substrate pads on the second surface, adjacent to the opening. Bond pads of the semiconductor die are aligned with the opening through the substrate. Intermediate conductive elements, such as bond wires, extend from bond pads of the semiconductor die, through the opening, to substrate pads on the opposite, second surface of the substrate. An encapsulant, which fills the opening and covers the intermediate conductive elements, protrudes beyond a plane in which the second surface of the substrate is located. Discrete conductive elements, such as solder balls, may protrude from the contact pads of the substrate to connect the semiconductor device assembly to another component, such as a printed circuit board or another packaged semiconductor device.

Methods for providing and using grid array packages

Methods for providing and using semiconductor device assemblies or packages include providing or using various elements of a semiconductor device assembly or package. Such a semiconductor device package or assembly may include a substrate and a semiconductor die adjacent to a first surface of the substrate. The substrate of such a semiconductor device assembly or package may also include a second surface opposite from the first surface, an opening extending from the first surface and the second surface, contact pads on the second surface, and substrate pads on the second surface, adjacent to the opening. Bond pads of the semiconductor die may be aligned with the opening through the substrate. Intermediate conductive elements, such as bond wires, may extend from bond pads of the semiconductor die, extend through the opening, protrude beyond the second surface of the substrate, and extend to substrate pads on the second surface. An encapsulant, which may fill the opening and cover the intermediate conductive elements, protrudes beyond a plane in which the second surface of the substrate is located. Discrete conductive elements, such as solder balls, may protrude from the contact pads of the substrate.

Stackable semiconductor device assemblies

A semiconductor device assembly includes a substrate and a semiconductor die adjacent to a first surface of the substrate. The substrate also includes a second surface opposite from the first surface, an opening extending from the first surface and the second surface, contact pads on the first surface, and substrate pads on the second surface, adjacent to the opening. Bond pads of the semiconductor die are aligned with the opening through the substrate. Intermediate conductive elements, such as bond wires, extend from bond pads of the semiconductor die, through the opening, to substrate pads on the opposite, second surface of the substrate. An encapsulant, which fills the opening and covers the intermediate conductive elements, protrudes beyond a plane in which the second surface of the substrate is located. Another electronic device, such as another semiconductor device package, may communicate electrically with the die of the semiconductor device assembly through the contact pads on the first surface of the substrate. In some embodiments, the other electronic device may be stacked with the semiconductor device assembly.

Grid array packages

A semiconductor device assembly includes a substrate and a semiconductor die adjacent to a first surface of the substrate. The substrate also includes a second surface opposite from the first surface, an opening extending from the first surface and the second surface, contact pads on the second surface, and substrate pads on the second surface, adjacent to the opening. Bond pads of the semiconductor die are aligned with the opening through the substrate. Intermediate conductive elements, such as bond wires, extend from bond pads of the semiconductor die, through the opening, to substrate pads on the opposite, second surface of the substrate. An encapsulant, which fills the opening and covers the intermediate conductive elements, protrudes beyond a plane in which the second surface of the substrate is located. Discrete conductive elements, such as solder balls, may protrude from the contact pads of the substrate.

Flip-chip adaptor package for bare die

A board for connecting a bare semiconductor die with a bond pad arrangement which does not conform to a master printed circuit board with a specific or standardized pin out, connector pad, or lead placement arrangement. The board comprises a printed circuit board including first elements, such as minute solder balls, pins, or bond wires, for making electrical contact between the board and the master board, and second elements, such as minute solder balls, pins, or bond wires, for making electrical contact between the semiconductor die and the board. The board has circuit traces for electrical communication between the board/master board electrical contact elements, and the semiconductor die board electrical contact elements.

Apparatus with a multi-layer coating and method of forming the same

In some embodiments, a printed circuit board (PCB) comprises a substrate comprising an insulating material. The PCB further comprises a plurality of conductive tracks attached to at least one surface of the substrate. The PCB further comprises a multi-layer coating deposited on the at least one surface of the substrate. The multi-layer coating (i) covers at least a portion of the plurality of conductive tracks and (ii) comprises at least one layer formed of a halo-hydrocarbon polymer. The PCB further comprises at least one electrical component connected by a solder joint to at least one conductive track, wherein the solder joint is soldered through the multi-layer coating such that the solder joint abuts the multi-layer coating.

Chip carrier and chip package structure thereof

A chip carrier comprising a laminated layer and an oxidation protection layer is provided. The oxidation protection layer is a non-electrolytic metallic coating or an organic oxidation protection film on the surface of bonding finger pads or other contacts formed by deploying a simple, fast film-coating technique. Therefore, there is no need to plate a Ni/Au layer on the bonding pads or contacts using expensive electroplating equipment for preventing oxidation and there is no need to fabricate plating lines on the chip carrier or reserve space for laying out the plating lines. Thus, the cost for fabricating the chip carrier is reduced, the effective area of the chip carrier is increased and the electrical performance of the chip carrier is improved.

Chip carrier with oxidation protection layer

A chip carrier comprising a laminated layer and an oxidation protection layer is provided. The oxidation protection layer is a non-electrolytic metallic coating or an organic oxidation protection film on the surface of bonding finger pads or other contacts formed by deploying a simple, fast film-coating technique. Therefore, there is no need to plate a Ni/Au layer on the bonding pads or contacts using expensive electroplating equipment for preventing oxidation and there is no need to fabricate plating lines on the chip carrier or reserve space for laying out the plating lines. Thus, the cost for fabricating the chip carrier is reduced, the effective area of the chip carrier is increased and the electrical performance of the chip carrier is improved.

Printed circuit board, optoelectronic component and arrangement of optoelectronic components

Es wird eine Leiterplatte (1) für einen optoelektronischen Halbleiterchip (2) angegeben, mit – einer ersten Metallfolie (11), die elektrisch leitend ist, – einer ersten elektrisch isolierenden Folie (12). The invention relates to a printed circuit board (1) for an optoelectronic semiconductor chip (2), comprising - a first metal foil (11) which is electrically conductive, - a first electrically insulating foil (12).

Laser diode chip on printed circuit board

A light source module comprising a semiconductor light source mounted directly to a conducting trace of a multilayer printed circuit board having a core comprising a plurality of core layers electrically and thermally coupled by a plurality of buried vias wherein at least one of the core layers comprises a heat sink plane.

Low impedance structure for PCB based electrodes

A PCB based electrochemical sensor includes a PCB having a first electrode on a first surface of the PCB, and a second electrode on a second surface. A sensing element, such as a conductive wire, is attached to the first electrode. The PCB includes one or more through holes, and the conductive wire is positioned proximate one or more of the one or more through holes. When the PCB based electrochemical sensor is positioned in a solution to be sensed, the solution fills the through holes. The ions within the solution provide a current pathway between the conductive wire and the second electrode through the through holes. A voltage potential between the two electrodes is measured. The measured voltage potential is used to determine a value associated with the solution, such as a pH value.

Semiconductor element-mounting package substrate, and method for manufacturing package substrate

본 발명은, ＰｏＰ를 구성하는 경우에 있어서, 조합하는 패키지의 자유도가 크고, 패턴 설계상의 제약도 작고, 상부 패키지와 하부 패키지 사이의 접속을 고밀도로 행함이 가능하고, 게다가 휨을 저감하고, 신뢰성이 높은 반도체소자 탑재용 패키지 기판과 그 제조방법을 제공함을 목적으로 한다. 본 발명은, 개구 및 관통구멍을 가지는 접착제 부착 캐비티층과, 상기 접착제에 의해 상기 캐비티층에 적층된 베이스층과, 상기 개구에 의해 형성된 캐비티부와, 상기 관통구멍에 의해 형성된 바닥을 가진 비아를 가지는 반도체 패키지 기판에 있어서, 상기 접착제가 엘라스토머재이고, 상기 바닥을 가진 비아의 내벽이 금속피복 되며, 그 위에 도전수지가 충전되는 반도체소자 탑재용 패키지 기판과 그 제조방법이다. According to the present invention, in the case of forming a PI, the degree of freedom of the package to be combined is small, the constraints on the pattern design are small, and the connection between the upper package and the lower package can be performed at a high density, further reducing warpage and high reliability. An object of the present invention is to provide a package substrate for mounting a semiconductor device and a method of manufacturing the same. The present invention provides a via-attached cavity layer having an opening and a through hole, a base layer laminated on the cavity layer by the adhesive, a cavity portion formed by the opening, and a bottom having a bottom formed by the through hole. A semiconductor package substrate having a semiconductor substrate, wherein the adhesive is an elastomer material, the inner wall of the via having the bottom is covered with a metal, and a conductive resin is filled thereon, and the manufacturing method is a semiconductor device mounting package substrate.

半导体装置、安装基板及其制造方法、电路基板和电子装置

半导体装置包含：在布线图形(21)的一个面上形成的第1电镀层(30)；在布线图形(21)中的通孔(28)内形成的第2电镀层(32)；与第1电镀层(30)导电性地连接的半导体芯片(10)；在第1电镀层(30)上设置的各向异性导电材料(34)；以及在第2电镀层(32)上设置的导电材料(36)，第1电镀层(30)的性质适合于与各向异性导电材料(34)的密接性，第2电镀层(32)的性质适合于与导电材料(36)的接合性。

method of forming solder ball and related fabrication and structure of semiconductor package using the method

본 발명은 솔더 볼 형성 방법과 이를 이용한 반도체 패키지의 제조 방법 및 구조에 관한 것이다. 본 발명은 볼 미부착 불량, 볼 단락 불량, 볼 변형 불량과 같은 종래의 문제점들을 해결하고, 미세 볼 피치를 구현할 뿐만 아니라, 솔더 볼의 접합 신뢰도를 향상시키기 위한 것이다. 본 발명의 솔더 볼 형성 방법에 따르면, 먼저 와이어 본딩을 통하여 배선 기판의 랜드 패턴 위에 와이어 볼 범프를 형성하고, 스크린 프린트를 통하여 와이어 볼 범프 위에 솔더 크림을 도포한다. 이어서, 리플로우를 통하여 솔더 크림을 용융시킴으로써 와이어 볼 범프가 내장된 솔더 볼을 형성한다. The present invention relates to a solder ball forming method and a method and structure for manufacturing a semiconductor package using the same. The present invention is to solve the conventional problems such as poor ball failure, short ball failure, poor ball deformation, and to implement a fine ball pitch, as well as to improve the soldering reliability of the solder ball. According to the solder ball forming method of the present invention, wire ball bumps are first formed on land patterns of a wiring board through wire bonding, and solder cream is applied onto the wire ball bumps through screen printing. The solder balls are then melted through reflow to form solder balls with embedded wire ball bumps. 솔더 볼, 와이어 볼 범프, 스크린 프린트, 솔더 크림 Solder ball, wire ball bump, screen print, solder cream

Halogen-hydrocarbon polymer coating

FIELD: chemistry. SUBSTANCE: invention relates to polymer coatings, namely, to a halogen-hydrocarbon polymer coating for electric devices. A printed circuit board (PCB) includes a substrate, including an insulation material. The PCB additionally includes multitudes of electroconductive printing paths, connected to at least one substrate surface. The PCB additionally includes a multi-layered coating, precipitated on at least one substrate surface. The multilayered coating covers at least a part of a multitude of the electroconductive paths and includes at least one layer of the halogen-hydrocarbon polymer. The PCB additionally includes at least one electric component, connected by a solder connection to at least one electroconductive printing path, with the solder connection being soldered through the multilayered coating in such a way that the connection adjoins the multilayered coating. EFFECT: prevention of oxidation or corrosion of metal surfaces, capable of preventing the formation of strong solder connections or capable of reducing a service term of the said connections. 39 cl, 18 dwg РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) (51) МПК H05K 1/18 H05K 3/28 H05K 3/34 C09D 4/00 C09D 185/00 C09K 15/32 (13) 2 533 162 C2 (2006.01) (2006.01) (2006.01) (2006.01) (2006.01) (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ОПИСАНИЕ (21)(22) Заявка: ИЗОБРЕТЕНИЯ К ПАТЕНТУ 2011110260/07, 11.08.2009 (24) Дата начала отсчета срока действия патента: 11.08.2009 Приоритет(ы): (30) Конвенционный приоритет: (72) Автор(ы): ХАМФРИЗ Марк Робсон (GB), ФЕРДИНАНДИ Фрэнк (GB), СМИТ Родни Эдвард (GB) 18.08.2008 GB 0815094.8; 18.08.2008 GB 0815095.5; 18.08.2008 GB 0815096.3 R U (73) Патентообладатель(и): СЕМБЛАНТ ЛИМИТЕД (GB) (43) Дата публикации заявки: 20.10.2012 Бюл. № 29 (56) Список документов, цитированных в отчете о поиске: US 3931454 A, 06.01.1976. US 2004/ (85) Дата начала рассмотрения заявки PCT на национальной фазе: 18.03.2011 C 2 C 2 0026775 A1, 12.02.2004. US 4693799 A ...

Printed board and method for production thereof

FIELD: electrical engineering.SUBSTANCE: invention relates to a halocarbon polymer coating for electrical devices. It is achieved by the fact that the printed circuit board (PCB) includes a substrate including insulating material, and additionally includes multiple electroconductive printed paths connected to at least one surface of the substrate. PP further includes a multilayer coating deposited on at least one surface of the substrate. Multilayer coating (i) covers at least part of multiple electroconductive printed paths and (ii) includes at least one layer of halocarbon polymer. PP further includes at least one electrical component, connected by soldered joint to at least one electroconductive printed path, soldered connection is soldered through multilayer coating so that soldered joint is adjacent to multilayer coating.EFFECT: technical result is protection from environmental conditions.21 cl, 16 dwg РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) (13) 2 685 692 C2 (51) МПК H05K 1/18 (2006.01) H05K 3/28 (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ОПИСАНИЕ ИЗОБРЕТЕНИЯ К ПАТЕНТУ (52) СПК H05K 1/0353 (2019.02); H05K 3/282 (2019.02) (21) (22) Заявка: 2014121727, 28.05.2014 (24) Дата начала отсчета срока действия патента: 11.08.2009 (73) Патентообладатель(и): СЕМБЛАНТ ЛИМИТЕД (GB) 23.04.2019 18.08.2008 GB 0815094.8; 18.08.2008 GB 0815095.5; 18.08.2008 GB 0815096.3 Номер и дата приоритета первоначальной заявки, из которой данная заявка выделена: 2011110260 18.08.2008 (56) Список документов, цитированных в отчете о поиске: US 2004/0026775 A1, 12.02.2004. US 391453 A, 06.01.1976. US 2008/0176096 A1, 24.07.2008. RU 2032286 C1, 27.03.1995. (43) Дата публикации заявки: 10.12.2015 Бюл. № 2 6 8 5 6 9 2 Приоритет(ы): (30) Конвенционный приоритет: R U Дата регистрации: (72) Автор(ы): ХАМФРИЗ Марк Робсон (GB), ФЕРДИНАНДИ Фрэнк (GB), СМИТ Родни Эдвард (GB) 34 C 2 R U 2 6 8 5 6 9 2 C 2 (45) Опубликовано: 23.04.2019 Бюл. № 12 Адрес для переписки: 129090, Москва, ул. Б ...

반도체 장치, 실장기판 및 그 제조방법, 회로기판 및전자기기

본 발명의 반도체 장치는 배선 패턴(21)의 한쪽 면에 형성된 제 1 도금층(30)과, 배선 패턴(21)에 있어서의 관통 구멍(28)내에 형성된 제 2 도금층(32)과, 제 1 도금층(30)에 전기적으로 접속된 반도체 칩(10)과, 제 1 도금층(30)상에 형성된 이방성 도전재료(34)와, 제 2 도금층(32)상에 형성되는 도전재료(36)를 포함하고, 제 1 도금층(30)의 성질은 이방성 도전재료(34)와의 밀착성에 적합하며, 제 2 도금층(32)의 성질은 도전재료(36)와의 접합성에 적합하다.

電子ハウジング用の導体グリッドおよび製造方法

本発明により、電子ハウジング用の導体グリッドおよびかかる導体グリッドの製造方法が提供される。本発明によれば、導体グリッドは結合縁部（１５０）に沿って溶接された２つの金属ストリップ（１３０、１１０、１４０）から作製されるが、２つの金属ストリップのうちいずれか一方のみがワイヤ・ボンディングに適した表面を有すればよい。このようにして、従来から用いられてきためっきされた出発原料の使用量を大幅に低減することができる。

Printed circuit board with bonding wire shield structure for high speed semiconductor package

본 발명은 본딩 와이어 차폐 구조를 가지는 고속 반도체 패키지용 인쇄 회로 기판에 관한 것으로서, 고속 데이터 전송을 위한 신호 전송선 구조에서 인접 신호선 간의 커플링 잡음을 최소화하기 위한 것이다. 인쇄 회로 기판은 신호 전송선 양쪽의 접지 패턴을 서로 연결하는 다수의 본딩 와이어를 포함한다. 본딩 와이어는 신호 전송선의 개방된 위쪽 영역을 차폐함으로써 접지 패턴을 따라 전달되는 표면파에 의한 커플링 잡음을 억제한다. 본딩 와이어를 이용한 차폐 구조는 일반적인 와이어 본딩 공정을 적용함으로써 저비용으로 간편하게 구현할 수 있다. The present invention relates to a printed circuit board for a high speed semiconductor package having a bonding wire shielding structure, and to minimize coupling noise between adjacent signal lines in a signal transmission line structure for high speed data transmission. The printed circuit board includes a plurality of bonding wires connecting the ground patterns on both sides of the signal transmission line with each other. Bonding wires suppress coupling noise due to surface waves propagating along the ground pattern by shielding the open upper area of the signal transmission line. Shielding structure using the bonding wire can be easily implemented at low cost by applying a common wire bonding process. 인쇄 회로 기판, 신호 전송선, 접지 패턴, 커플링 잡음, 비아, 본딩 와이어, 차폐 Printed Circuit Boards, Signal Transmission Lines, Ground Patterns, Coupling Noise, Vias, Bonding Wires, Shielding

A Semiconductor device and a method of making the same

본 발명은, 센터 패드 구조의 반도체칩의 기능면에 회로기판이 접착되고, 상기 반도체칩의 센터 패드와 상기 회로기판의 본딩 패드가 본딩 와이어를 매개하여 접속된 반도체장치 및 그 제조방법에 관한 것이다. 여기에서, 상기 제조방법은, 금속박과 절연필름을 적층시킨 적층판의 상기 금속박에 에칭을 실시하여, 접착해야 할 반도체칩의 센터 패드와 대응하는 영역에 도금용 인출선을, 상기 반도체칩의 그 이외의 부분과 대응하는 영역에 외부 입출력단자부와 본딩 패드를, 이들 양 영역에 걸쳐서 이들을 전기적으로 연결하는 회로패턴을, 각각 형성하여 회로기판을 얻는다. 더욱이, 상기 회로기판의 도금용 인출선으로부터 전기를 공급하면서 상기 외부 입출력단자부 및 본딩 패드에 전해도금을 실시하는 공정과, 상기 회로기판중, 반도체칩의 센터 패드와 대응하는 영역을 도금용 인출선과 더불어 제거하여 창부를 형성하는 공정, 상기 회로기판의 절연필름측을 상기 창부로부터 센터 패드가 노출되도록 반도체칩에 접착하는 공정, 상기 회로기판의 본딩 패드와 상기 반도체칩의 센터 패드를 본딩 와이어로 접속시키는 공정, 상기 회로기판의 외부 입출력단자부에 외부 입출력단자를 형성하는 공정을 갖추고 있다. The present invention relates to a semiconductor device in which a circuit board is bonded to a functional surface of a semiconductor chip having a center pad structure, and a center pad of the semiconductor chip and a bonding pad of the circuit board are connected through bonding wires, and a manufacturing method thereof. . Here, the said manufacturing method etchs the said metal foil of the laminated board which laminated | stacked the metal foil and the insulating film, and puts the lead wire for plating in the area | region corresponding to the center pad of the semiconductor chip to adhere | attach, except that of the said semiconductor chip. An external input / output terminal portion and a bonding pad are formed in a region corresponding to the portion of the circuit, and circuit patterns for electrically connecting them over these regions are formed to obtain a circuit board. Further, the process of electroplating the external input / output terminal portion and the bonding pad while supplying electricity from the plating lead wire of the circuit board, and the region corresponding to the center pad of the semiconductor chip in the circuit board, Removing and forming a window; bonding the insulating film side of the circuit board to the semiconductor chip so that the center pad is exposed from the window; connecting the bonding pad of the circuit board and the center pad of ...

Package substrate for mounting semiconductor element and method for manufacturing the package substrate

본 발명은, PoP를 구성하는 경우에 있어서, 조합시키는 패키지의 자유도가 크고, 패턴설계상의 제약도 작고, 상부 패키지와 하부 패키지 사이의 접속을 고밀도로 행하는 것이 가능한 반도체소자 탑재용 패키지 기판과 그 제조방법을 간이한 프로세스로 저렴하게 제공하는 것을 목적으로 한다. 본 발명은, 개구 및 관통구멍을 갖는 캐비티층과, 이 캐비티층에 접속된 베이스층과, 상기 개구에 의해 형성된 캐비티부와, 상기 관통구멍에 의해 형성된 바닥을 갖는 비아를 갖는 반도체소자 탑재용 패키지 기판에 있어서, 상기 바닥을 갖는 비아의 내벽에 금속피복이 형성되고, 이것을 바탕으로 하여 상기 바닥을 갖는 비아에 도전수지가 충전되고, 이 도전수지 중에 포함되는 도전성분이, 노출된 상태에서 상기 바닥을 갖는 비아의 입구측에 배치되고, 이 노출된 도전성분 위에, 도금이 직접 석출함으로써 형성된 금속피막을 갖는 반도체소자 탑재용 패키지 기판과 그 제조방법이다. According to the present invention, in the case of constituting a PoP, a package substrate for semiconductor element mounting and its manufacture, which have a large degree of freedom in the package to be combined, a small limit in pattern design, and a high density connection between the upper package and the lower package can be performed. Its purpose is to provide a method at a low cost in a simple process. The present invention provides a semiconductor device mounting package having a cavity layer having an opening and a through hole, a base layer connected to the cavity layer, a cavity portion formed by the opening, and a via having a bottom formed by the through hole. In the substrate, a metal coating is formed on an inner wall of the via having the bottom, and based on this, a conductive resin is filled in the via having the bottom, and the conductive powder contained in the conductive resin is exposed in the bottom. A semiconductor device mounting package substrate having a metal film formed by directly depositing a plating on the exposed conductive powder, which is disposed on an inlet side of a via having a via, and a manufacturing method thereof.

Substrate having heat spreading layer and semiconductor package using the same

본 발명은 표면 금속층을 방열층으로 사용하는 배선기판 및 그를 이용한 반도체 패키지에 관한 것이다. 종래의 방열판을 갖는 반도체 패키지의 경우, 반도체 패키지 제조 공정이 완료된 이후에 수지 봉합부 상에 방열판을 부착하는 공정을 별도로 진행하기 때문에, 반도체 패키지의 생산성이 떨어졌다. 아울러 방열판은 반도체 패키지를 박형화하는 데 걸림돌로 작용하고, 수지 봉합부에 부착된 방열판은 열 방출 효율이 높지 않았다. The present invention relates to a wiring board using a surface metal layer as a heat radiation layer and a semiconductor package using the same. In the case of the semiconductor package having the conventional heat sink, since the process of attaching the heat sink to the resin sealing portion separately after the semiconductor package manufacturing process is completed, the productivity of the semiconductor package is lowered. In addition, the heat sink acts as a stumbling block to thin the semiconductor package, and the heat sink attached to the resin sealing portion has not been high in heat dissipation efficiency. 따라서 본 발명은 반도체 칩이 실장되는 제 1 면에 반대되는 제 2 면 전체에 방열층이 형성되어 있고, 칩 실장 영역과 방열층은 히트 파이프로 연결된 구조를 갖는 배선기판을 제공함으로써, 반도체 패키지의 두께 증가를 최소화하면서 반도체 칩에서 발생되는 열을 효과적으로 외부로 방출시킬 수 있다. 방열층을 형성하는 공정이 배선기판의 제조 공정 중에 진행되기 때문에, 종래와 같이 별도의 방열판 추가에 따른 비용적인 부담과 반도체 패키지의 생산성이 떨어지는 문제를 해소할 수 있다. 더욱이 칩 실장 영역의 상부면에 반도체 칩과 직접 접촉할 수 있는 금속 돌기를 균일하게 형성함으로써, 반도체 칩에서 발생되는 열을 더욱 신속하게 외부로 방출시킬 수 있고, 칩 실장 영역에 도포된 액상의 접착제가 반도체 칩의 활성면을 침범하는 것을 억제할 수 있다. Accordingly, the present invention provides a wiring board having a heat dissipation layer formed on a second surface opposite to a first surface on which a semiconductor chip is mounted, and a chip mounting area and a heat dissipation layer connected to each other by a heat pipe, The heat generated in the semiconductor chip can be effectively radiated to the outside while minimizing the thickness increase. Since the step of forming the heat dissipation layer proceeds during the manufacturing process of the wiring board, it is possible to solve the problem of a costly burden due to the addition of a separate heat dissipating plate and a low productivity of the semiconductor package. Further, by uniformly forming ...

칩 내장형 기판을 이용한 카메라 모듈

본 발명은 칩 내장형 기판을 이용한 카메라 모듈에 관한 것이다. 본 발명은, 상면 중앙부에 홈이 형성되고 각 측면에 등간격으로 패드면이 형성되며 상기 패드면과 단턱부를 이루는 루프가 형성된 기판과, 상기 기판의 홈 내부에 실장되는 전자부품과, 상기 기판의 홈에 복개되며 상기 기판과 와이어 본딩 결합되는 이미지센서로 이루어진 이미지센서 모듈과; 상기 이미지센서 모듈 상부에 결합되는 하우징; 및 내부에 다수의 렌즈가 적층되며 상기 하우징의 상단부에 결합되는 렌즈배럴;을 포함하는 카메라 모듈로 구성되며, 상기 이미지센서의 하부 기판에 홈을 형성하여, 상기 홈 내에 칩 형태의 전자부품 및 수동소자들을 실장함으로써, 카메라 모듈이 차지하는 면적을 줄일 수 있는 장점이 있다. 칩 내장형, FPCB, 카메라 모듈, 이미지센서 모듈, 수동소자

Memory card and method of fabricating the same

메모리 카드 및 그 제조 방법이 개시된다. 본 발명에 따른 메모리 카드는 뒷면에 제 1 콘택핀 어레이를 갖는 제 1 인쇄회로기판과 제 1 인쇄회로기판 상에 탑재되고, 제 1 콘택핀 어레이와 연결되어 있는 메모리 칩 및 제 1 인쇄회로기판 상에 적층되고, 앞면에 제 1 콘택핀 어레이와 연결되는 제 2 콘택핀 어레이를 갖는 제 2 인쇄회로기판을 포함한다. A memory card and a method of manufacturing the same are disclosed. The memory card according to the present invention is mounted on a first printed circuit board and a first printed circuit board having a first contact pin array at a rear side thereof, and is mounted on a memory chip and a first printed circuit board connected to the first contact pin array. And a second printed circuit board having a second contact pin array stacked on the front surface and connected to the first contact pin array.

Mehod of manufacturing a surface-mounted wiring board

Semiconductor chip and semiconductor package including the same

일부 실시예들에 따른 반도체 칩은 대략 직사각형 형상의 회로 영역 및 상기 회로 영역을 둘러싸는 주변 영역을 포함하는 기판; 상기 회로 영역의 일부 및 상기 주변 영역의 일부와 중첩되는 키 영역; 상기 회로 영역 상에 배치된 복수개의 구동 회로 셀들; 및 상기 주변 영역 상에 배치되고, 상기 회로 영역의 상기 직사각형의 네 모서리 중 어느 하나인 제1 모서리에 평행한 제1 방향을 따라 연장되는 도전성 기준선을 포함할 수 있다. A semiconductor chip according to some embodiments may include a substrate including a circuit region having a substantially rectangular shape and a peripheral region surrounding the circuit region; a key region overlapping part of the circuit region and part of the peripheral region; a plurality of driving circuit cells disposed on the circuit area; and a conductive reference line disposed on the peripheral area and extending in a first direction parallel to a first corner that is one of four corners of the rectangle of the circuit area.

Camera module using a circuit board builted-in integrated circuit

본 발명은 칩 내장형 기판을 이용한 카메라 모듈에 관한 것이다. 본 발명은, 상면 중앙부에 홈이 형성된 기판과, 상기 기판의 홈 내부에 실장되는 전자부품과, 상기 기판의 홈에 복개되며 상기 기판과 와이어 본딩 결합되는 이미지센서로 이루어진 이미지센서 모듈과; 상기 이미지센서 모듈 상부에 결합되는 하우징; 및 내부에 다수의 렌즈가 적층되며 상기 하우징의 상단부에 결합되는 렌즈배럴;을 포함하는 카메라 모듈로 구성되며, 상기 이미지센서의 하부 기판에 홈을 형성하여, 상기 홈 내에 칩 형태의 전자부품 및 수동소자들을 실장함으로써, 카메라 모듈이 차지하는 면적을 줄일 수 있는 장점이 있다. 칩 내장형, FPCB, 카메라 모듈, 이미지센서 모듈, 수동소자

Ic module, wireless information storage medium, and wireless information transmitting/receiving device using the same

【課題】高精度の静電容量および温度特性に優れたコンデンサを有する薄型のＩＣモジュールを提供する。 【解決手段】ＩＣカード１０のアンテナコイル１００に接続される端子１７０ａ〜１７０ｃを構成するリードフレーム１７０に、ＩＣチップ１２０と同調用積層型チップコンデンサ１４０ａ〜１４０ｃとが実装され、樹脂封止されたＩＣモジュールであり、積層型チップコンデンサがリードフレームを切り欠いて形成された溝部１７２に実装されている。 【選択図】　図２

Circuit board and electronic device having the same

[Problem] To provide a highly-reliable circuit board and an electronic device obtained by mounting electronic components on the circuit board, which have high bonding strength and excellent heat discharge properties, and can be used over a long period as a result of minimizing cavities in a metal wiring layer formed on a through conductor. [Solution] A circuit board (10) is provided with a through conductor (13) comprising a metal in a through hole (12) that penetrates in the thickness direction of a ceramic sintered body (11), and a metal wiring layer (14) that covers and is connected to the surface of the through conductor (13) on at least one main surface side of the ceramic sintered body (11). The through conductor (13) comprises: a first area (13a) that is positioned on an inner wall side of the through hole (12), from one end to the other end of the through hole (12) in the thickness direction of the ceramic sintered body (11); and a second area (13b) that adjoins the first area (13a). The average crystal grain size in the second area (13b) is larger than the average crystal grain size in the first area (13a).