Ink

Silver carbonate decomposes to form silver metal by a temperature of 280 degrees Celsius. Its use in inkjet ink allows the low-cost production of conductive metallic inks. The silver metal layer could be further processed to enhance silver decorative properties and in particular light reflective properties

Electronic apparatus and method for fabricating the same

An electronic apparatus includes a first electronic part with a first terminal, a second electronic part with a second terminal opposite the first terminal, and a joining portion which joins the first terminal and the second terminal. The joining portion contains a pole-like compound extending in a direction in which the first terminal and the second terminal are opposite to each other. The joining portion contains the pole-like compound, so the strength of the joining portion is improved. When the first terminal and the second terminal are joined, the temperature of one of the first electronic part and the second electronic part is made higher than that of the other. A joining material is cooled and solidified in this state. By doing so, the pole-like compound is formed.

METHOD FOR MANUFACTURING CERAMIC SUBSTRATE, CERAMIC SUBSTRATE, AND SILVER-BASED CONDUCTOR MATERIAL

A method for manufacturing a ceramic substrate containing glass includes a firing step in which an unfired silver-based conductor material is disposed on an unfired ceramic layer and is fired. The unfired silver-based conductor material contains at least one of a metal boride and a metal silicide. 1. A method for manufacturing a ceramic substrate containing glass , comprising a firing step of firing an unfired ceramic layer and an unfired silver-based conductor material disposed on the unfired ceramic layer , wherein the unfired silver-based conductor material contains a metal boride.2. The manufacturing method according to claim 1 , wherein the metal boride is at least one of lanthanum hexaboride claim 1 , silicon hexaboride claim 1 , titanium diboride claim 1 , and tantalum diboride.3. (Canceled)4. The manufacturing method according to claim 1 , wherein the unfired silver-based conductor material contains the metal boride and the amount of the metal boride with respect to the amount of the inorganic components of the unfired silver-based conductor material is greater than 3 vol. % and less than 20 vol. %.5. The manufacturing method according to claim 1 , wherein the unfired silver-based conductor material contains a silver powder and the metal boride is attached to surfaces of particles of the silver powder in the silver-based conductor material.6. A ceramic substrate comprising a ceramic layer and a wiring layer of a sliver-based conductor which are formed by the firing step according to .7. A silver-based conductor material which is unfired and is fired together with an unfired ceramic layer to form a wiring layer in a ceramic substrate claim 1 , wherein the unfired silver-based conductor material contains a metal boride.8. A method for manufacturing a ceramic substrate containing glass claim 1 , comprising a firing step of firing an unfired ceramic layer and particles of an unfired silver-based conductor material disposed on the unfired ceramic layer claim 1 , ...

Silver-Bismuth Powder,Conductive Paste and Conductive Film

To provide a silver-bismuth powder, which includes: silver; and bismuth, wherein a mass ratio (silver:bismuth) of the silver to the bismuth is 95:5 to 40:60, wherein a cumulative 50% point of particle diameter (D50) of the silver-bismuth powder in a volume-based particle size distribution thereof as measured by a laser diffraction particle size distribution analysis is 0.1 μm to 10 μm, and wherein an oxygen content of the silver-bismuth powder is 5.5% by mass or less.

MOTHER CERAMIC SUBSTRATE, CERAMIC SUBSTRATE, MOTHER MODULE COMPONENT, MODULE COMPONENT, AND METHOD OF MANUFACTURING MOTHER CERAMIC SUBSTRATE

Provided is a mother ceramic substrate that, when divided into individual substrates (ceramic substrates), can be divided to cause divided end surfaces to be perpendicular to principal surfaces of the individual substrates, and that can provide ceramic substrates with high form accuracy; an individual ceramic substrate obtained from the mother ceramic substrate; a module component including the ceramic substrate; and a method of manufacturing a mother ceramic substrate. In a mother ceramic substrate that can be divided at a predetermined position and separated into a plurality of individual substrates, a dividing groove that defines a division position is formed in a principal surface on one side, and a protruding thread is formed on a principal surface on another side at a position corresponding to a position of the dividing groove formed in the principal surface on the one side in view in a thickness direction of the mother ceramic substrate. 1. A mother ceramic substrate dividable at a predetermined position and separated into a plurality of individual substrates , the mother ceramic substrate comprising:a dividing groove defining a division position formed in one principal surface, anda protruding thread formed on another principal surface at a position corresponding to a position of the dividing groove formed in the one principal surface in viewing in a thickness direction of the mother ceramic substrate.2. The mother ceramic substrate according to claim 1 , further comprising inner conductors in such a manner that the individual substrates obtained after dividing the mother ceramic substrate respectively include the inner conductors.3. A ceramic substrate comprising the individual substrate obtained by dividing the mother ceramic substrate according to along the dividing groove.4. A mother module component comprising surface mount devices respectively mounted in regions where the individual substrates are located after dividing the mother ceramic substrate ...

MULTILAYERED CERAMIC SUBSTRATE AND METHOD FOR MANUFACTURING SAME

The present disclosure relates to a multilayer ceramic substrate preparation method. The multilayer ceramic substrate preparation method according to the present disclosure includes firing a plurality of ceramic green sheets, to create a plurality of ceramic thin films; forming a via hall in each of the plurality of ceramic thin films; filling the via hall of the plurality of ceramic thin films with conductive paste, and heat treating the via hall filled with the conductive paste, to form a via electrode; printing a pattern on a cross section of each of the plurality of ceramic thin films, and heat treating the printed pattern, to form an inner electrode; applying a bonding agent on the cross section of each of the ceramic thin films excluding an uppermost ceramic thin film of the plurality of ceramic thin films; aligning and laminating each of the plurality of ceramic thin films such that each of the plurality of ceramic thin films is electrically connected through the via electrode and the inner electrode; and firing or heat treating the laminated plurality of ceramic thin films. 1. A multilayer ceramic substrate preparation method comprising:firing a plurality of ceramic green sheets, to create a plurality of ceramic thin films;forming a via hall in each of the plurality of ceramic thin films;filling the via hall of each of the plurality of ceramic thin films with conductive paste, and heat treating the via hall filled with the conductive paste, to form a via electrode;printing a pattern on a cross section of each of the plurality of ceramic thin films, and heat treating the printed pattern, to form an inner electrode;applying a bonding agent on the cross section of each of the ceramic thin films avoiding the via halls, excluding an uppermost ceramic thin film of the plurality of ceramic thin films;aligning and laminating each of the plurality of ceramic thin films such that each of the plurality of ceramic thin films is electrically connected through the via ...

Method for Producing a Metal-Ceramic Substrate, and a Metal-Ceramic Substrate

A method for producing a metal-ceramic substrate includes attaching a metal layer to a surface side of a ceramic layer, the metal layer being structured into a plurality of metallization regions respectively separated from one another by at least one trench-shaped intermediate space to form conductive paths and/or connective surfaces and/or contact surfaces. The method further includes filling the at least one trench-shaped intermediate space with an electrically insulating filler material, and covering first edges of the metallization regions facing and adjoining the surface side of the ceramic layer in the at least one trench-shaped intermediate space, as well as at least one second edge of the metallization regions facing away from the surface side of the ceramic layer in the at least one trench-shaped intermediate space, by the electrically insulating filler material. 1. A method for producing a metal-ceramic substrate , the method comprising:attaching a metal layer to a surface side of a ceramic layer, the metal layer being structured into a plurality of metallization regions respectively separated from one another by at least one trench-shaped intermediate space to form conductive paths and/or connective surfaces and/or contact surfaces;filling the at least one trench-shaped intermediate space with an electrically insulating filler material; andcovering first edges of the metallization regions facing and adjoining the surface side of the ceramic layer in the at least one trench-shaped intermediate space, as well as at least one second edge of the metallization regions facing away from the surface side of the ceramic layer in the at least one trench-shaped intermediate space, by the electrically insulating filler material.2. The method of claim 1 , wherein the electrically insulating filler material is filled into the at least one trench-shaped intermediate space before any electric or electronic component is mounted onto the metal layer.3. The method of claim ...

Method for Soldering a Circuit Carrier to a Carrier Plate

A method for soldering a circuit carrier to a carrier plate includes providing a carrier plate having an upper side and a first adjusting device, providing a circuit carrier having an underside and a second adjusting device, providing a solder and placing the circuit carrier onto the carrier plate in such a way that: the underside of the circuit carrier faces the upper side of the carrier plate; the solder is arranged between the carrier plate and the circuit carrier; and the first adjusting device forms a stop for the second adjusting device that limits a displacement of the circuit carrier placed on the carrier plate along the upper side of the carrier plate. After placing the circuit carrier onto the carrier plate, the solder is melted and subsequently cooled down until it solidifies and connects the circuit carrier to the carrier plate in a material-bonding manner at a lower metallization layer. 1. A method for soldering a circuit carrier to a carrier plate , the method comprising:providing a carrier plate having an upper side and a first adjusting device;providing a circuit carrier having an underside and a second adjusting device;providing a solder; the underside of the circuit carrier faces the upper side of the carrier plate;', 'the solder is arranged between the carrier plate and the circuit carrier; and', 'the first adjusting device forms a stop for the second adjusting device that limits a displacement of the circuit carrier placed on the carrier plate along the upper side of the carrier plate; and, 'placing the circuit carrier onto the carrier plate in such a way thatafter placing the circuit carrier onto the carrier plate, melting the solder and subsequently cooling down the melted solder until it solidifies and connects the circuit carrier to the carrier plate in a material-bonding manner at a lower metallization layer.2. The method of claim 1 , wherein the circuit carrier rests indirectly on the carrier plate after placement.3. The method of claim 2 , ...

PHOTOSENSITIVE GLASS PASTE, ELECTRONIC COMPONENT, AND METHOD FOR PRODUCING ELECTRONIC COMPONENT

A photosensitive glass paste contains a photosensitive organic component, and an inorganic component containing a glass powder and a ceramic filler. The glass powder contains a glass powder having a crystallization point. The difference between the crystallization point and the softening point of the glass powder having a crystallization point is from 85° C. to 180° C. The glass powder having a crystallization point is preferably a SiO—BO—BaO—ZnO—AlO—MgO—LaOglass powder. 1. A photosensitive glass paste comprising:a photosensitive organic component; andan inorganic component containing a glass powder and a ceramic filler,whereinthe glass powder contains a glass powder having a crystallization point, anda difference between the crystallization point and a softening point of the glass powder having a crystallization point is from 85° C. to 180° C.2. The photosensitive glass paste according to claim 1 , wherein{'sub': 2', '2', '3', '2', '3', '2', '3, 'the glass powder having a crystallization point is a SiO—BO—BaO—ZnO—AlO—MgO—LaOglass powder.'}3. The photosensitive glass paste according to claim 1 , whereina proportion of the glass powder having a crystallization point in an entirety of the glass powder is 80 wt % or more.4. The photosensitive glass paste according to claim 2 , whereina proportion of the glass powder having a crystallization point in an entirety of the glass powder is 80 wt % or more.5. The photosensitive glass paste according to claim 1 , whereinthe ceramic filler is at least one selected from the group consisting of alumina, zirconia, partially stabilized zirconia, silicon nitride, and silicon carbide.6. The photosensitive glass paste according to claim 2 , whereinthe ceramic filler is at least one selected from the group consisting of alumina, zirconia, partially stabilized zirconia, silicon nitride, and silicon carbide.7. The photosensitive glass paste according to claim 4 , whereinthe ceramic filler is at least one selected from the group ...

CIRCUIT BOARD AND METHOD FOR MANUFACTURING CIRCUIT BOARD

A circuit board having an insulating layer containing a low-temperature sintering ceramic material and wiring. The wiring includes a thermal via having an area of 0.0025 mmor more in top view thereof, the thermal via is a stack of layers of tapered conductors, each having tapered end faces, and each end face of the tapered conductors are in direct contact with the insulating layer. 1. A circuit board comprising:an insulating layer containing a low-temperature sintering ceramic material; and{'sup': '2', 'wiring that includes a thermal via having an area of 0.0025 mmor more in a top view thereof, wherein'}the thermal via is a stack of layers of tapered conductors, each having tapered end faces, andeach end face of the tapered conductors is in contact with the insulating layer.2. The circuit board according to claim 1 , wherein a taper length of the tapered conductors in cross-section is 20 μm or more.3. The circuit board according to claim 1 , wherein the tapered conductors contain a metal and the low-temperature sintering ceramic material claim 1 , and a percentage by weight of the low-temperature sintering ceramic material in the tapered conductors is 50% or less.4. The circuit board according to claim 3 , wherein the percentage by weight of the low-temperature sintering ceramic material in the tapered conductors is 10% to 50%.5. The circuit board according to claim 3 , wherein the metal is a silver- or copper-based electrically conductive metal.6. The circuit board according to claim 1 , wherein the insulating layer has a diffused portion in which a metallic material forming the tapered conductors has been diffused where the insulating layer is in direct contact with each end face of the tapered conductors.750. The circuit board according to claim 1 , wherein a thickness of the thermal via is μm or more.8. The circuit board according to claim 1 , wherein the low-temperature sintering ceramic material is SiO—CaO—AlO—BOor SiO—MgO—AlO—BOglass ceramic.9. The circuit ...

CERAMIC WIRING BOARD AND METHOD FOR PRODUCING THE SAME

A ceramic wiring board that includes a ceramic insulator and a via-conductor. The ceramic insulator includes a crystalline constituent and an amorphous constituent. The via-conductor includes a metal and an oxide. The crystalline constituent and the oxide include at least one metal element in common. A tubular region having a thickness of 5 μm adjoins and surrounds the via-conductor and has a higher concentration of the metal element than the ceramic insulator. 1. A ceramic wiring board comprising:a ceramic insulator including a crystalline constituent and an amorphous constituent;a via-conductor formed in the ceramic insulator, the via-conductor including a metal and an oxide the crystalline constituent and the oxide including a metal element in common; anda tubular region adjoining and surrounding the via-conductor, the tubular region having a concentration of the metal element higher than that of the ceramic insulator.2. The ceramic wiring board according to claim 1 , wherein the tubular region has a thickness of 5 μm.4. The ceramic wiring board according to claim 1 , wherein the tubular region includes a crystalline constituent including the metal element.5. The ceramic wiring board according to claim 4 , wherein the metal element is Ti.6. The ceramic wiring board according to claim 5 , wherein the crystalline constituent including the metal element includes a fresnoite compound including Ba claim 5 , Ti claim 5 , and Si.7. The ceramic wiring board according to claim 4 , wherein the metal element is Al.8. The ceramic wiring board according to claim 7 , wherein the crystalline constituent including the metal element includes a celsian compound including Ba claim 7 , Al claim 7 , and Si.9. The ceramic wiring board according to claim 1 , wherein the via-conductor has a diameter of 100 μm or less.10. The ceramic wiring board according to claim 1 , wherein the via-conductor is exposed at a surface of the ceramic wiring board.11. A method for producing a ceramic ...

Plasma ashing of coated substrates

A system for plasma etching or ashing a coating on a substrate includes a plasma chamber, a second electrode, a plasma source coupled to the plasma chamber, a substrate including a coating, and a plasma mask including at least one aperture. The plasma chamber includes a first electrode. The plasma mask is configured to cover the substrate while exposing selected surfaces of the substrate and coating through the at least one aperture. The first electrode and the second electrode are configured to initiate and maintain a plasma within the plasma chamber. The plasma source includes a gas.

Silicon nitride substrate and method for producing silicon nitride substrate

A silicon nitride substrate including a phase encompassed of silicon nitride particles, and intergranular phase formed from a sintering aid, wherein a separation layer is formed on the surface of a molded body including silicon nitride powder, sintering aid powder, and organic binder, by using a boron nitride paste containing boron nitride powder, organic binder, and organic solvent; the separation layer and molded body are heated; the organic binder is removed from the separation layer and molded body; subsequently molded bodies stacked with a separation layer therebetween, are sintered. Boron nitride paste contains 0.01 to 0.50% by oxygen mass and 0.001 to 0.5% by carbon mass, and c/a is within range of 0.02 to 10.00, where c is oxygen content in the powder of the boron nitride paste, and a carbon content in the degreased separation layer, which includes 0.2 to 3.5 mg/cm 2 of hexagonal boron nitride powder.

MIXED-METAL SYSTEM CONDUCTORS FOR USE IN LOW-TEMPERATURE CO-FIRED CERAMIC CIRCUITS AND DEVICES

A composition for forming transition vias and transition line conductors is disclosed for minimizing interface effects at electrical connections between dissimilar metal compositions. The composition has (a) inorganic components selected from the group consisting of (i) 20-45 wt % gold and 80-55 wt % silver and (ii) 100 wt % silver-gold solid solution alloys, and (b) an organic medium. The composition may also contain (c) 1-5 wt %, based upon the weight of the composition, of oxides or mixed oxides of metals selected from the group consisting of Cu, Co, Mg and Al and/or high viscosity glasses mainly containing refractory oxides. The composition may be used as a multi-layer composition in a via fill. Multi-layer circuits such as LTCC circuits and devices may also be formed using the composition for forming transition vias and transition line conductors. 1. A process to produce a composition for forming transition vias and transition line conductors comprising the steps of:a. providing a first layer comprising inorganic components selected from the group consisting of 20-45 wt % gold and 80-55 wt % silver dispersed in organic medium;b. providing a second layer comprising 100 wt % silver-gold solid solution alloys dispersed in organic medium;c. applying the first layer to partially fill a via;d. applying the second layer to the first layer to fill the via; ande. co-firing the first layer and the second layer in the via, wherein the first layer and the second layer are in electrical contact with each other, wherein the wt % of gold in the inorganic component of the first layer is greater than the wt % of gold in the inorganic component of the second layer, wherein the difference in diffusion coefficients of the first layer and the second layer is negligible.2. The process of further comprising providing 1-5 wt % claim 1 , based upon the weight of the composition claim 1 , of oxides or mixed oxides of metals selected from the group consisting of Cu claim 1 , Co claim 1 , ...

Thermal compression bonding process cooling manifold

Embodiments of a thermal compression bonding (TCB) process cooling manifold, a TCB process system, and a method for TCB using the cooling manifold are disclosed. In some embodiments, the cooling manifold comprises a pre-mixing chamber that is separated from a mixing chamber by a baffle. The baffle may comprise at least one concentric pattern formed through the baffle such that the primary cooling fluid in the pre-mixing chamber is substantially evenly distributed to the mixing chamber. The pre-mixing chamber may be coupled to a source of primary cooling fluid. The mixing chamber may have an input configured to accept the primary cooling fluid and an output to output the primary cooling fluid.

Sintered compact, circuit component, and method of producing sintered compact

A sintered compact includes an alumina phase as a primary phase, and further includes an amorphous phase containing Si and Mn and a cordierite phase. The sintered compact has a porosity of higher than or equal to 1.1% and less than or equal to 5.0%. Preferably, I1/(I1+I2) is greater than or equal to 0.20 and less than or equal to 0.45, where I1 is the strength of the main peak of cordierite obtained by an XRD method, and I2 is the strength of the main peak of alumina.

METHOD FOR BONDING PLASTIC COMPONENT TO PRINTED CIRCUIT BOARD

A method for bonding aplastic component to a printed circuit board includes the steps of: a) providing the plastic component, the printed circuit board, and at least one positioning member, b) disposing at least one welding layer, c) positioning the plastic component and the printed circuit board relative to each other, d) melting the at least one welding layer while the plastic component is maintained in a positioning position, and e) cooling the at least one welding layer while the plastic component is maintained in the positioning position. 1. A method for bonding a plastic component to a printed circuit board , comprising the steps of: the plastic component includes a first end surface, which faces the printed circuit board when the plastic component is disposed above the printed circuit board, and at least one fastening hole formed in the first end surface,', 'the printed circuit board includes a substrate, and at least one metal base which is disposed on the substrate and which has a connecting surface connected to the substrate and a first bonding surface opposite to the connecting surface, and', 'the at least one positioning member is fastened in the at least one fastening hole and is made of a metal material, and includes a second bonding surface exposed from the first end surface;, 'a) providing the plastic component, the printed circuit board, and at least one positioning member, wherein'}b) disposing between the first bonding surface of the at least one metal base of the printed circuit board and the second bonding surface of the at least one positioning member, at least one welding layer made of a welding metal, which has a melting point lower than a thermal deformation temperature of the plastic component and which is solid at a predetermined temperature range;c) positioning the plastic component and the printed circuit board relative to each other, such that the plastic component is in a positioning position relative to the printed circuit board;d) ...

IN-SITU WARPAGE MONITORING DURING SOLDER REFLOW FOR HEAD-IN-PILLOW DEFECT ESCAPE PREVENTION

Embodiments of the present invention are directed to an in-situ warpage monitoring system and method for preventing head-in-pillow (HIP) or other potential defect escapes during a solder reflow process. In a non-limiting embodiment of the invention, a product is passed through a reflow oven. The product can include a printed circuit board (PCB). An amount of warpage of the product is measured at one or more monitoring devices positioned along the reflow oven. Each measured amount of warpage is compared to a predetermined warpage limit. The product is sorted into one of a plurality of designated lots based on the comparison. The lots can include a pass lot, a fail lot, and a marginal pass lot. 1. A method comprising:passing a product through a reflow oven;measuring, by an in-situ warpage monitoring system, an amount of warpage of the product at one or more monitoring devices positioned along the reflow oven;comparing, by the in-situ warpage monitoring system, each measured amount of warpage to a predetermined warpage limit; andsorting the product into one of a plurality of designated lots based on the comparison.2. The method of claim 1 , wherein the product comprises a printed circuit board (PCB).3. The method of claim 2 , wherein the product further comprises one or more components coupled to the PCB using a ball grid array (BGA).4. The method of claim 1 , wherein the one or more monitoring devices comprise a first monitoring device positioned at an inlet of the reflow oven.5. The method of claim 4 , wherein the first monitoring device measures a first warpage of the product at room temperature prior to reflow.6. The method of claim 4 , wherein the one or more monitoring devices comprise a second monitoring device positioned at a heating zone of the reflow oven at which the product reaches a peak reflow temperature.7. The method of claim 6 , wherein the one or more monitoring devices comprise a third monitoring device positioned at a cooling zone of the reflow oven ...

SUBSTRATE FOR ELECTRICAL CIRCUITS AND METHOD FOR PRODUCING A SUBSTRATE OF THIS TYPE

A substrate () for electrical circuits, comprising at least one metal layer () and a paper ceramic layer (), which is joined face to face with the at least one metal layer () and has a top side and bottom side (), wherein the paper ceramic layer () has a large number of cavities in the form of pores. Especially advantageously, the at least one metal layer () is connected to the paper ceramic layer () by means of at least one glue layer (), which is produced by applying at least one glue (″) to the metal layer () and/or to the paper ceramic layer (), wherein the cavities in the form of pores in the paper ceramic layer () are filled at least at the surface by means of the applied glue (″). 1. A substrate for electrical circuits , comprising at least one metal layer and a paper ceramic layer , which is flatly joined to the at least one metal layer and has a top side and a bottom side , wherein the paper ceramic layer has a large number of cavities in the form of pores , characterized in that the at least one metal layer is connected to the paper ceramic layer by means of at least one adhesive layer which is produced by applying at least one adhesive to the metal layer and/or to the paper ceramic layer , wherein the cavities in the form of pores in the paper ceramic layer are filled at least on the surface side by means of the applied adhesive.2. The substrate according to claim 1 , characterized in that the paper ceramic layer comprises a porosity of less than 10% claim 1 , after filling with the adhesive.3. The substrate according to claim 1 , characterized in that the at least one metal layer is connected to at least one additional metal layer form to a composite layer.4. The substrate according to claim 1 , characterized in that the paper ceramic layer has a layer thickness ranging from 50 μm to 600 μm.5. The substrate according to claim 1 , characterized in that the paper ceramic layer comprises an e-module ranging from 90 GPa to 150 GPa.6. The substrate according ...

Conductive paste and glass article

A conductive paste contains at least a conductive powder, glass frit, and an organic vehicle. The conductive powder is a mixed powder of an atomized powder prepared by an atomization method and a wet reduced powder prepared by a wet reduction method and the conductive powder contains the atomized powder in the range of 5 to 40 wt %. The atomized powder is 5.2 to 9 μm in average particle size and the content of a chlorine component mixed in the conductive powder is 42 ppm or less. The conductive paste is applied in the form of a line onto a glass substrate 1 and subjected to firing to form conductive films. This conductive paste can prevent glass substrates from undergoing color changes and prevent base layers for conductive films from having structural defects such as cracks.

Wiring board, method of manufacturing wiring board, electronic device, electronic apparatus, and moving object

A base substrate includes a ceramic sintered substrate having through holes, first and second metal wirings which are integrally disposed so as to be connected to the surface of the ceramic sintered substrate and the inside of the through holes, and first and second active metal layers which are disposed between the ceramic sintered substrate and the first and second metal wirings.

PHOTOSENSITIVE GLASS PASTE AND ELECTRONIC COMPONENT

A photosensitive glass paste contains a photosensitive organic component and an inorganic component containing a glass powder having a high softening point, a glass powder having a low softening point, and a ceramic filler. The ceramic filler has a thermal expansion coefficient of 10×10/° C. to 16×10/° C., the inorganic component contains 30% to 50% by volume of the ceramic filler, and the inorganic component contains 0.5% to 10% by volume of the glass powder having a low softening point. 1. A photosensitive glass paste comprising a photosensitive organic component and an inorganic component that contains a glass powder having a high softening point , a glass powder having a low softening point that is lower than the high softening point , and a ceramic filler ,{'sup': −6', '−6, 'wherein the ceramic filler has a thermal expansion coefficient of from 10×10/° C. to 16×10/° C.,'}the inorganic component contains from 30% to 50% by volume of the ceramic filler, andthe inorganic component contains from 0.5% to 10% by volume of the glass powder having a low softening point.2. The photosensitive glass paste according to claim 1 , wherein a difference in softening point between the glass powder having a high softening point and the glass powder having a low softening point is from 50° C. to 240° C.3. The photosensitive glass paste according to claim 1 , wherein:{'sub': 2', '2', '3', '2, 'the glass powder having a high softening point is a SiO—BO—KO-based glass powder, and'}{'sub': 2', '2', '3', '2', '3, 'the glass powder having a low softening point is a SiO—BO—BiO-based glass powder.'}4. An electronic component comprising an insulating layer disposed on a ceramic substrate and produced by firing the photosensitive glass paste according to .5. The photosensitive glass paste according to claim 2 , wherein:{'sub': 2', '2', '3', '2, 'the glass powder having a high softening point is a SiO—BO—KO-based glass powder, and'}{'sub': 2', '2', '3', '2', '3, 'the glass powder having a ...

Via Fill Material For Solar Applications

The present invention is directed toward a via fill material for use in solar applications that exhibits low series resistance and high shunt resistance. The via fill material according to the invention includes silver powder, a glass frit and a vehicle. 1. A conductive paste comprising:a. 65-90 wt % silver powder;b. 0.1-10 wt % of at least one glass frit;c. a separate and distinct portion of at least one oxide or clay of a metal selected from the group consisting of zirconium, bismuth, aluminum, and combinations thereof; andd. a separate and distinct portion of at least one oxide or clay of a metal selected from the group consisting of barium, calcium, magnesium silicon, and combinations thereof.2. The paste of claim 1 , wherein the silver powder has at least a bimodal particle size distribution with a first Daverage particle size and a second Daverage particle size.3. The paste of claim 1 , wherein the silver powder has at least a trimodal particle size distribution with a first portion of silver having a first Daverage particle size claim 1 , a second portion of silver having a second Daverage particle size and a third portion of silver having a third Daverage particle size.4. The paste of claim 3 , wherein the first Dsize is 0.5-5 microns claim 3 , the second Dsize is 0.5-2.5 microns and the third Dparticle size is 0.1-1.5 microns claim 3 , wherein the Dsizes differ by at least 0.1 microns from one another.57-. (canceled)8. The paste of claim 4 , wherein the silver powder comprises 20-50 wt % of the first portion claim 4 , 30-50 wt % of the second portion and 0.1-10 wt % of the third portion.910-. (canceled)11. The paste of claim 3 , wherein the first Dsize is 2-20 microns claim 3 , the second Dsize is 0.5-2.5 microns and the third Dparticle size 0.1-1.5 microns claim 3 , wherein the Dsizes differ by at least 0.1 microns from one another.1214-. (canceled)15. The paste of claim 11 , wherein the silver powder comprises 40-70 wt % of the first portion claim 11 , 5- ...

LEAD-FREE LOW-MELTING GLASS COMPOSITION, LOW-TEMPERATURE SEALING GLASS FRIT, LOW-TEMPERATURE SEALING GLASS PASTE, CONDUCTIVE MATERIAL, AND CONDUCTIVE GLASS PASTE CONTAINING GLASS COMPOSITION, AND GLASS-SEALED COMPONENT AND ELECTRIC/ELECTRONIC COMPONENT PREPARED USING THE SAME

An AgO—VO—TeOlead-free low-melting glass composition that is prevented or restrained from crystallization by heating so as to soften and flow more satisfactorily at a low temperature contains a principal component which includes a vanadium oxide, a tellurium oxide and a silver oxide; a secondary component which includes at least one selected from the group consisting of BaO, WOand PO; and an additional component which includes at least one selected from the group consisting of oxides of elements in Group 13 of periodic table. A total component of the principal component is 85 mole percent or more in terms of VO, TOand AgO. Contents of TeOand AgO each is 1 to 2 times as much as a content of VO. A content of the secondary component is 0 to 13 mole percent. A content of the additional component is 0.1 to 3.0 mole percent. 120.-. (canceled)21. A lead-free low-melting glass composition comprising:a principal component which includes a vanadium oxide, a tellurium oxide and a silver oxide; andan additional component which includes at least one selected from the group consisting of oxides of elements in Group 13 of periodic table,{'sub': 2', '2', '5, 'wherein a content of TeOis 1 to 2 times as much as a content of VO, and'}wherein a content of the additional component is 0.1 to 3.0 mole percent.22. The lead-free low-melting glass composition according to claim 21 , further comprising an optional secondary component which includes at least one selected from the group consisting of BaO claim 21 , WOand PO claim 21 , wherein the content of VOis 17 to 27 mole percent.23. The lead-free low-melting glass composition according to claim 21 ,wherein a content of the optional secondary component is 0 to 13 mole percent.24. The lead-free low-melting glass composition according to claim 21 ,{'sub': 2', '5, 'wherein the content of VOis 17 to 27 mole percent,'}{'sub': '2', 'the content of TeOis 34 mole percent or more, and'}{'sub': '2', 'a content of AgO is 40 mole percent or less.'}25. ...

METHOD AND PROTECTION APPARATUS FOR PROTECTING A THERMAL SENSITIVE COMPONENT IN A THERMAL PROCESS

Provided is a method for protecting a thermal sensitive component mounted on a board during a thermal process. The method includes: providing the board, providing a protection apparatus which is removable and made of a thermoelectric material to protect the thermal sensitive component during the thermal process, wherein the protection apparatus cools the thermal sensitive component during the thermal process in response to applying a voltage to the protection apparatus. Further provided is the protection apparatus for the thermal sensitive component mounted on the board during the thermal process. 1. A protection apparatus for use with a thermal sensitive component disposed on a board during a thermal process , comprising:a removable device body having a void for containing at least a portion of the thermal sensitive component, the removable device body comprises a thermoelectric material, and the removable device body is structured to protect the thermal sensitive component during the thermal process; anda battery for supplying a voltage to the removable device body to thereby enable the protection apparatus to cool the thermal sensitive component.2. The protection apparatus of claim 2 , wherein the thermal process is one of a wave soldering process claim 2 , an SMT reflow process claim 2 , a hand soldering process claim 2 , and a rework process.3. The protection apparatus of claim 2 , wherein the thermal process is a wave soldering process that occurs at 90° C. to 260° C. and uses the board with a through hole penetrable by a solder connection on the thermal sensitive component claim 2 , or is an SMT reflow process that occurs at 183° C. to 260° C. and uses the board further comprising electronic components mounted thereon by the SMT reflow process.4. The protection apparatus of claim 2 , wherein the removable device body comprises a second body portion and a first body portion disposed on the second body portion claim 2 , wherein one of the first body portion and ...

A NON-CONDUCTIVE SUBSTRATE WITH TRACKS FORMED BY SAND BLASTING

A method for forming track(s) on low temperature co-fired ceramic (LTCC) substrate, the method comprising the steps of, forming a layer of coating material on an operative face of the LTCC substrate, disposing a stencil on the layer of coating material thereby covering a selected portion of the layer of coating material while leaving exposed a portion of the layer of coating material corresponding to the track(s) to be formed and forming an assembly of the LTCC substrate, the layer of coating material and the stencil, eroding the exposed portion of the layer of coating material by propelling an abrasive material using a blasting gun towards the assembly on the face on which the layer of coating material is formed and the stencil is disposed and separating the stencil from the abraded assembly, wherein the abrasive material has a composition that is compatible with that of the LTCC substrate. 2. The method as claimed in claim 1 , wherein said non-conductive substrate is low temperature co-fired ceramic (LTCC).3. The method as claimed in claim 1 , wherein said layer of coating material is selected from a group of conductive materials consisting of silver claim 1 , copper claim 1 , gold claim 1 , aluminum claim 1 , iron and combinations thereof.4. The method as claimed in claim 1 , wherein said layer of coating material is selected from a group of semi-conductive materials consisting of silicon claim 1 , germanium and combinations thereof.5. The method as claimed in claim 1 , wherein said layer of coating material is selected from a group of non-conductive materials consisting of dielectric oxides including binary claim 1 , ternary claim 1 , quaternary combinations in the form of paste claim 1 , taper and/or photoresist quartz claim 1 , glass and combinations thereof.6. The method as claimed in claim 1 , wherein said stencil is composed of a material that is resistant to said abrasive material including steel claim 1 , aluminum claim 1 , copper claim 1 , brass claim 1 ...

METAL PARTICLE DISPERSION FOR ELECTROCONDUCTIVE SUBSTRATES, METHOD FOR PRODUCING THE SAME, AND METHOD FOR PRODUCING AN ELECTROCONDUCTIVE SUBSTRATE

The present invention is to provide a metal particle dispersion for electroconductive substrates, which has high dispersibility and dispersion stability and which is able to form a film that shows high electroconductivity after baking. Disclosed is a metal particle dispersion for electroconductive substrates, comprising metal particles, a dispersant and a solvent, wherein the dispersant is a graft copolymer having at least a constitutional unit represented by the following chemical formula (I) and a constitutional unit represented by the following chemical formula (II): 3. The metal particle dispersion for electroconductive substrates according to claim 2 , wherein claim 2 , in the graft copolymer as the dispersant claim 2 , a salt is formed between at least a part of a nitrogen site contained in the constitutional unit represented by the chemical formula (III) and at least one selected from the group consisting of an acidic phosphorus compound claim 2 , a sulfonic acid compound and a halogenated hydrocarbon.5. The metal particle dispersion for electroconductive substrates according to claim 1 , wherein the metal particles are metal particles containing one or more selected from the group consisting of gold claim 1 , silver claim 1 , copper and oxides thereof.8. The method for producing a metal particle dispersion for electroconductive substrates according to claim 7 , wherein claim 7 , in the dispersant preparing step claim 7 , the graft copolymer is prepared and mixed with at least one selected from the group consisting of an acidic phosphorus compound claim 7 , a sulfonic acid compound and a halogenated hydrocarbon claim 7 , thereby forming a salt between at least a part of a nitrogen site derived from the nitrogen-containing monomer represented by the chemical formula (III′) of the graft copolymer and at least one selected from the group consisting of the acidic phosphorus compound claim 7 , the sulfonic acid compound and the halogenated hydrocarbon.10. The ...

METHOD FOR MANUFACTURING CERAMIC SUBSTRATE AND CERAMIC SUBSTRATE

A method for manufacturing a ceramic substrate that includes forming a mother multilayer body by laminating a ceramic green sheet on a shrinkage suppressing green sheet, the shrinkage suppressing green sheet having a planar shrinkage rate in firing smaller than a planar shrinkage rate in firing of the ceramic green sheet; and forming a recessed portion in the mother multilayer body before firing by pressing a recessed portion formation planned region where the recessed portion is to be formed after firing of the mother multilayer body. 1. A method for manufacturing a ceramic substrate , the method comprising:forming a mother multilayer body by laminating a ceramic green sheet on a shrinkage suppressing green sheet, the shrinkage suppressing green sheet having a planar shrinkage rate in firing smaller than a planar shrinkage rate in firing of the ceramic green sheet; andforming a recessed portion in the mother multilayer body before firing by pressing a recessed portion formation planned region where the recessed portion is to be formed after firing of the mother multilayer body.2. The method for manufacturing the ceramic substrate according to claim 1 , wherein the shrinkage suppressing green sheet includes a plate-shaped ceramic filling member.3. The method for manufacturing the ceramic substrate according to claim 2 , wherein the plate-shaped ceramic filling member is alumina.4. The method for manufacturing the ceramic substrate according to claim 2 , wherein a maximum length dimension of the plate-shaped ceramic filling member is equal to or more than twice a maximum length dimension of a ceramic powder that is a main component of the shrinkage suppressing green sheet.5. The method for manufacturing the ceramic substrate according to claim 1 , wherein both the shrinkage suppressing green sheet and the ceramic green sheet include a plate-shaped ceramic filling member.6. The method for manufacturing the ceramic substrate according to claim 5 , wherein the plate- ...

CONDUCTIVE PASTE

A conductive paste including: (A) a silver powder; (B) a glass frit; (C) an organic binder; and (D) a powder containing copper, tin, and manganese. 1. A conductive paste comprising:(A) a silver powder;(B) a glass frit;(C) an organic binder; and(D) a powder containing copper, tin, and manganese.2. The conductive paste according to claim 1 , wherein the powder (D) is a mixed powder of metals including copper claim 1 , tin claim 1 , and manganese.3. The conductive paste according to claim 1 , wherein the powder (D) is a powder of an alloy containing copper claim 1 , tin claim 1 , and manganese.4. The conductive paste according to claim 1 , wherein the powder (D) is a powder of compound containing copper claim 1 , tin claim 1 , and manganese.5. The conductive paste according to claim 1 , wherein the powder (D) contains an oxide or a hydroxide of one or more of copper claim 1 , tin claim 1 , and manganese.6. The conductive paste according to claim 1 , wherein the powder (D) is contained in an amount from 0.1 to 5.0 parts by mass based on 100 parts by mass of the silver powder (A).7. The conductive paste according to claim 1 , wherein a content of tin is from 0.01 to 0.3 in a mass ratio when a content of copper is 1.8. The conductive paste according to claim 1 , wherein a content of manganese is from 0.01 to 2.5 in a mass ratio when a content of copper is 1.9. The conductive paste according to claim 1 , wherein the silver powder (A) has an average particle diameter from 0.1 μm to 100 μm.10. The conductive paste according to claim 1 , further comprising cobalt oxide (E).11. The conductive paste according to claim 1 , further comprising bismuth oxide (F).12. The conductive paste according to claim 1 , wherein the paste has a viscosity from 50 to 700 Pa·s.13. A printed circuit board obtained by claim 1 , after applying the conductive paste according to on a substrate claim 1 , firing the substrate at a temperature of 500° C. to 900° C.14. An electronic device obtained by ...

CIRCUIT BOARD AND PRODUCTION METHOD THEREFOR

A method of manufacturing a circuit substrate includes the steps of preparing a conductor paste in which a powder of at least one of a metal boride and a metal silicide is added to a powder of silver (Ag), applying the conductor paste to a surface of a ceramic substrate which has been fired, applying a glass paste to the surface of the ceramic substrate after applying the conductor paste, firing the conductor paste applied to the surface so as to form a conductor trace, and firing the glass paste applied to the surface so as to form a coating layer. 1. A method of manufacturing a circuit substrate including a ceramic substrate having a surface mainly formed of a ceramic , a conductor trace formed on the surface of the ceramic substrate and mainly formed of silver (Ag) , and a coating layer which contains a glass component and which is formed on the surface of the ceramic substrate and covers the conductor trace , comprising:a step of firing the ceramic substrate;a step of preparing a conductor paste in which a powder of at least one of a metal boride and a metal silicide is added to a powder of silver (Ag);a step of applying the conductor paste to the surface of the fired ceramic substrate;a step of applying a glass paste to the surface of the ceramic substrate after applying the conductor paste;a step of firing the conductor paste applied to the surface so as to form the conductor trace; anda step of firing the glass paste applied to the surface so as to form the coating layer.2. The method of manufacturing a circuit substrate according to claim 1 , wherein the metal boride is at least one of lanthanum hexaboride (LaB) claim 1 , silicon hexaboride (SiB) claim 1 , and titanium diboride (TiB).3. The method of manufacturing a circuit substrate according to claim 1 , wherein the metal silicide is at least one of zirconium disilicide (ZrSi) and tantalum disilicide (TaSi).4. The method of manufacturing a circuit substrate according to claim 1 , wherein the total amount ...

METHOD OF MANUFACTURING SUBSTRATE FOR PRINTED CIRCUIT BOARD

According to one aspect of the present disclosure, a method of manufacturing a substrate for a printed circuit board, including an insulating base film and a metal layer that is layered on at least one surface side of the base film, includes: an application step of applying, to the at least one surface side of the base film, a dispersion liquid containing fine metal particles; a drying step of drying a coating film of the applied dispersion liquid; a sintering step of sintering the dried coating film by a far-infrared heater under a low oxygen atmosphere with an oxygen concentration of 600 ppm by volume or less; and a cooling step of cooling a layered structure of the sintered coating film and the base film under a low oxygen atmosphere with an oxygen concentration of 600 ppm by volume or less. 1. A method of manufacturing a substrate for a printed circuit board including an insulating base film and a metal layer that is layered on at least one surface side of the base film , the method comprising:applying, to the at least one surface side of the base film, a dispersion liquid containing fine metal particles;drying a coating film of the applied dispersion liquid;sintering the dried coating film by a far-infrared heater under a low oxygen atmosphere with an oxygen concentration of 600 ppm by volume or less; andcooling a layered structure of the sintered coating film and the base film under a low oxygen atmosphere with an oxygen concentration of 600 ppm by volume or less.2. The method of manufacturing the substrate for a printed circuit board according to claim 1 , wherein cooled nitrogen gas is supplied to a periphery of the layered structure in the cooling.3. The method of manufacturing the substrate for a printed circuit board according to claim 1 , wherein the sintering and the cooling are carried out continuously in a tunnel furnace including a heating space and a cooling space.4. The method of manufacturing the substrate for a printed circuit board according to ...

Electronics encapsulation through hotmelt lamination

Methods, devices, and systems for encapsulating a flexible electronic device with a waterproof layer are provided. In some embodiments, a manufacturing process is provided where a hotmelt layer is positioned over a flexible substrate that has at least one electronic component. Then, heat and/or pressure are applied to the hotmelt layer causing the hotmelt layer to flow around the at least one component to encapsulate the at least one component and form a waterproof layer. Various embodiments for forming the hotmelt layer and various embodiments of the flexible electronic device with the hotmelt layer are described herein.

BURNING METHOD

There is provided a burning method of burning, on a base member, a precursor in which conductive particles are dispersed in a dispersion medium, and the burning method includes: a first pressurization step of pressurizing the precursor heated to a burning temperature or above; and a second pressurization step of pressurizing, after the first pressurization step, the precursor with a pressurization force higher than a pressurization force in the first pressurization step. 1. A burning method of burning , on a base member , a precursor in which conductive particles are dispersed in a dispersion medium , the burning method comprising:a first pressurization step of pressurizing the precursor heated to a burning temperature or above; anda second pressurization step of pressurizing, after the first pressurization step, the precursor with a pressurization force higher than a pressurization force in the first pressurization step.2. The burning method according to claim 1 ,wherein in the first pressurization step, a pressure is applied with a pressurization member in contact with the precursor, andthe burning method further comprises a non-pressurization step of providing, between completion of the first pressurization step and start of the second pressurization step, a period during which the pressurization member is not in contact with the precursor.3. The burning method according to claim 2 ,wherein in the first pressurization step, the pressurization member is heated to the burning temperature or above, and the precursor is heated to the burning temperature or above.4. The burning method according to claim 1 ,wherein in the first pressurization step, a ratio of a height of the precursor after the pressurization to a height of the precursor before the pressurization is equal to or more than 0.2 but equal to or less than 0.9.5. The burning method according to claim 1 ,wherein in the first pressurization step, pressurization is performed with a first pressurization member ...

MULTILAYER CERAMIC SUBSTRATE AND METHOD OF MANUFACTURING MULTILAYER CERAMIC SUBSTRATE

A multilayer ceramic substrate according to the present disclosure has ceramic layers and a patterned conductor, and a cavity is formed in the multilayer ceramic substrate. The cavity reaches to any one of principal surfaces of the multilayer ceramic substrate and forms an opening, and the opening is covered with a sealing member at the principal surface of the multilayer ceramic substrate. 1. A multilayer ceramic substrate having a cavity provided , the multilayer ceramic substrate comprising:ceramic layers; anda patterned conductor, whereinthe cavity reaches a principal surface of the multilayer ceramic substrate to provide an opening, andthe opening is covered with a sealing member at the principal surface of the multilayer ceramic substrate.2. The multilayer ceramic substrate according to claim 1 , whereina land is provided at a position around the opening, andsolder serving as the sealing member is disposed on the land.3. The multilayer ceramic substrate according to claim 2 , whereinthe land is disposed so as to surround an entire circumference of the opening.4. The multilayer ceramic substrate according to claim 2 , whereinthe land is a surface portion of a via conductor provided inside a ceramic layer serving as the principal surface of the multilayer ceramic substrate, andthe solder is also present on an inside wall of the via conductor.5. The multilayer ceramic substrate according to claim 2 , whereinan outside diameter of the land is larger by 50 μm or more than an outside diameter of the opening.6. The multilayer ceramic substrate according to claim 1 , whereinthe cavity is comprised of a lateral cavity and a communication hole, the lateral cavity stretches inside the multilayer ceramic substrate in a direction parallel to the principal surface of the multilayer ceramic substrate and the communication hole extends from the lateral cavity toward the principal surface of the multilayer ceramic substrate so as to reach the principal surface.7. The ...

用于高温环境的无线遥测电子电路板

本发明揭示了一种耐高温和高g离心力的电路组件（34）。印刷电路板（42）首先由氧化铝制成且具有通过使用厚膜金膏而形成在其上的所述电路的导电迹线。电路组件的有源和无源部件借助于在高温下扩散的金粉末而附着到所述印刷电路板。金导线用于接合在所述电路迹线和所述有源部件之间以便完成所述电路组件（34）。此外，揭示了一种用于制造耐升高温度的电路组件的方法。

control panel

Die Erfindung betrifft ein Bedienpanel mit einem planen oder gebogenen Basiskörper aus einem dielektrischen Werkstoff wie Glas, Glaskeramik oder Keramik, der rückseitig mit mindestens einer Schicht aus einbrennbarer Farbe, wie Glasemail oder Keramikfarbe, und mindestens einer Schicht von Leiterstrukturen aus einbrennbarer Leitpaste bedruckt ist. Das Bedienpanel soll kostengünstiger hergestellt werden. Hierzu ist vorgesehen, dass die Farbe und die Leitpaste im Wesentlichen die gleiche Einbrenntemperatur haben. Die Erfindung betrifft auch ein Verfahren für die Herstellung eines solchen Bedienpanels. The invention relates to a control panel with a flat or curved base body made of a dielectric material such as glass, glass ceramic or ceramic, which is printed on the back with at least one layer of einbrennbarer color, such as glass enamel or ceramic paint, and at least one layer of conductive structures of einbrennbarer conductive paste. The control panel is to be produced more cheaply. For this purpose, it is provided that the paint and the conductive paste have substantially the same baking temperature. The invention also relates to a method for the production of such a control panel.

Method for fabricating blackened conductive patterns

The present invention relates to a method for fabricating blackened conductive patterns, which includes (i) forming a resist layer on a non-conductive substrate; (ii) forming fine pattern grooves in the resist layer using a laser beam; (iii) forming a mixture layer containing a conductive material and a blackening material in the fine pattern grooves; and (iv) removing the resist layer remained on the non-conductive substrate.

흑화 전도성 패턴의 제조방법

본 발명은 흑화 전도성 패턴의 제조방법에 관한 것으로, 보다 상세하게는 (i) 비전도성 기재에 레지스트층을 형성하는 단계, (ⅱ) 레이저를 이용하여 레지스트층에 미세패턴 홈을 형성하는 단계, (ⅲ) 상기 미세패턴 홈에 전도성 물질 및 흑화물질을 함유하는 혼합층을 형성하는 단계, 및 (ⅳ) 비전도성 기재 위에 잔류하는 레지스트층을 제거하는 단계를 포함하는 것을 특징으로 한다. 본 발명에 의한 흑화 전도성 패턴의 제조방법은 종래기술에 따른 화학적 부식 제조 방법과는 달리 공정 간소화로 생산성을 향상시킬 수 있을 뿐만 아니라, 부식액 처리 등과 같은 환경문제가 발생되지 않으며, 전도성 및 흑화도가 우수한 고 해상도 전도성 패턴을 구현할 수 있는 효과가 있다. 전도성, 흑화, 레이저, 미세패턴

印刷线路板和电子部件

所述印刷线路板包括：具有绝缘性的基膜；以及设置在基膜的至少一个表面上的导电图案。所述导电图案包括固定在基膜上的铜颗粒结合层，并且基膜的未层叠导电图案的区域的明度L*为60以下。理想的是，所述基膜的一个表面侧上具有改性层。

Chip embedded print circuit board and fabricating method thereof

A chip embedded printed circuit board and a fabricating method thereof are provided to stably treat the printed circuit board during a fabricating process by using a support layer of sufficient thickness to perform packaging in a very flat state. A fabricating method of a chip embedded printed circuit board includes the steps of: forming a first circuit pattern(115) on a top of a support layer; mounting a semiconductor chip(120) on the first circuit pattern; forming an insulation layer(130) on the top of the support layer to surround the first circuit pattern and the semiconductor chip and forming a metal layer on a top of the insulation layer; forming a via hole(150) passing through the insulation layer and the metal layer on the first circuit pattern and forming a plating layer(155) on an inner wall of the via hole; forming a second circuit pattern(145) on the top of the insulation layer by etching the metal layer; and forming a radiation plate(200) by removing the support layer in a region except a lower region of the semiconductor chip.

Thin film dielectrics with co-fired electrodes for capacitors and methods of making thereof

본 발명은 제1 전극 또는 미처리(bare) 금속성 호일을 갖는 기재상에 유전체층을 형성하고, 상부 전도성 층을 유전체층상에 침착시키고, 유전체층 및 상부 전도성 층을 어닐링시키는 것을 포함하며, 여기서 호일 또는 제1 전극, 유전체, 및 전도성 층이 커패시터를 형성하는 것인 커패시터의 제조 방법을 개시하고 있다. The present invention includes forming a dielectric layer on a substrate having a first electrode or bare metallic foil, depositing a top conductive layer on the dielectric layer, and annealing the dielectric layer and the top conductive layer, wherein the foil or first A method of making a capacitor is disclosed wherein the electrode, dielectric, and conductive layer form a capacitor. 금속성 호일, 유전체층, 전도성 층, 유전체층, 커패시터 Metallic foil, dielectric layer, conductive layer, dielectric layer, capacitor

电路板及其制造方法、电路板组件的制造方法

一种电路板(100)，包括至少一第一线路基板(10)及与第一线路基板(10)相叠合的至少一第二线路基板(20)；每一第一线路基板(10)包括：一第一基材层(11)、设置于所述第一基材层(11)上的一第一线路层(12)及多个第一导通体(13)，第一导通体(13)通过电镀工艺形成；第一线路层(12)包括一热压区(121)及除热压区(121)外的一非热压区(122)；第一导通体(13)一端部电性连接热压区(121)，另一端部露出于第一基材层(11)；每一第二线路基板(20)包括：一第二基材层(21)、设置于第二基材层(21)上的一第二线路层(22)及多个第二导通体(23)，第二导通体(23)包括导电膏；第二导通体(23)一端电性连接第二线路层(22)，另一端露出于第二基材层(21)；第一导通体(13)与第二导通体(23)电性导通。另，本发明还提供一种电路板(100)的制造方法及一种电路板组件的制造方法。

Method for manufacturing non-shrinkage ceramic substrate and non-shrinkage ceramic substrate using the same

무수축 세라믹 기판의 제조방법 및 이를 이용한 무수축 세라믹 기판이 제공된다. Provided are a method of manufacturing a non-contraction ceramic substrate and a non-contraction ceramic substrate using the same. 본 발명은 내부에 전극회로패턴이 구비된 세라믹 적층체를 소성하여 무수축 세라믹 기판을 제조하는 방법에 있어서, 상기 세라믹 적층체의 상,하부면에 구속용 세라믹 시트를 적어도 하나이상 적층하여 구속층을 형성하는 단계; 상기 구속층이 구비된 적층체를 1차 소성하는 단계; 상기 구속층이 제거된 적층체의 표면을 연마하는 단계; 상기 적층체와 동일한 소재로 이루어지며, 상기 연마처리된 적층체의 표면에 내부 전극패턴의 연결단자가 외부로 노출되도록 세라믹 페이스트를 형성하는 단계; 상기 연결단자를 통해 상기 전극회로패턴과 전기적으로 연결되도록 상기 세라믹 페이스트의 표면에 표면전극을 패턴형성하는 단계; 및 상기 표면전극이 상기 세라믹 페이스트와 고착되도록 2차 소성하는 단계;로 이루어지는 무수축 세라믹 기판의 제조방법 및 이를 이용한 무수축 세라믹 기판에 관한 것이다. The present invention provides a method of manufacturing a non-condensable ceramic substrate by firing a ceramic laminate having an electrode circuit pattern therein, wherein the at least one restraining ceramic sheet is laminated on upper and lower surfaces of the ceramic laminate to constrain the layer. Forming a; Primary firing the laminate provided with the constraint layer; Polishing the surface of the laminate from which the constraint layer has been removed; Forming a ceramic paste made of the same material as the laminate and exposing the connection terminal of the internal electrode pattern to the outside of the polished laminate; Patterning a surface electrode on a surface of the ceramic paste to be electrically connected to the electrode circuit pattern through the connection terminal; And secondary baking so that the surface electrode is fixed to the ceramic paste; and a method of manufacturing a non-condensation ceramic substrate, and a non-condensation ceramic substrate using the same. 본 발명에 따르면 1차 소성을 거쳐 연마된 세라믹 적층체의 표면에 적층체와 동일한 재질의 세라믹 페이스트를 형성하고 그 상부면에 표면전극을 형성한 후 2차 소성을 함으로써 세라믹 페이스트와 표면전극의 동시소성에 의한 고착력을 향상시킬 수 있다. According to the present invention, the ceramic paste of the same material as the laminate is formed on the surface of the ceramic laminate polished through primary firing, the surface electrode is formed on the upper surface thereof, and then ...

Manufacture method of printed circuit board for 4wd transfer apparatus

The present invention relates to a method for manufacturing a printed circuit board for a four-wheel drive operation switching device for applying all driving devices for enabling a full-time four-wheel drive operation. According to the present invention, the method for manufacturing a printed circuit board for a four-wheel drive operation switching device includes: a first step (S100) for preparing an epoxy layer (100) having copper foils (110a, 110b) laminated on both surfaces; a second step (S200) of forming individual component insert holes (B, D) and through-holes (A, C) penetrating the upper and lower surfaces at a predetermined location; a third step (S300) of forming an electroless copper plated layer (120) on the copper foils (110) and on the inner surfaces of the component insert holes (B, D) and through-holes (A, C) as well as forming an electro-copper plated layer (130) on the electroless copper plated layer (120); a fourth step (S400) of executing a circuit forming process on the copper foils (110), electroless copper plated layer (120), and electro-copper plated layer (130) to form a predetermined circuit pattern; a fifth step (S500) of using a solder resist ink (200) to print the hole area of through-holes (A, C), hole area of the component insert holes (B, D), and areas other than the circuit; and a sixth step (S800) of sequentially forming a nickel-plated layer (140) and a gold-plated layer (150) sequentially on an area without the solder resist ink (200). The length of one surface of the hole area arranged on a side of the component insert holes (B, D) is longer than that of the other surface.

Laminated body manufacturing method and manufacturing apparatus

Method for forming metal thin film and metal thin film

Manufacturing method of ceramic molded body

Soldering apparatus and soldering method

Printed wiring boards and electronic components

本発明の一態様に係るプリント配線板は、絶縁性を有するベースフィルムと、このベースフィルムの少なくとも一方の面に積層される導電パターンとを備えるプリント配線板であって、上記導電パターンがベースフィルムに固着する銅粒子結合層を含み、上記ベースフィルムの導電パターン非積層領域の明度Ｌ＊が６０以下である。上記ベースフィルムが一方の面側に改質層を有するとよい。 The printed wiring board which concerns on 1 aspect of this invention is a printed wiring board provided with the base film which has insulation, and the conductive pattern laminated | stacked on the at least one surface of this base film, Comprising: The said conductive pattern is a base film The lightness L * of the conductive pattern non-lamination region of the base film is 60 or less. The base film may have a modified layer on one side.

Substrate cutting appartus and method for cutting substrate using the same

본 발명은 기판 절단 장치 및 이를 이용한 기판 절단 방법에 관한 것으로서, 본 발명의 실시예에 따른 기판 절단 장치는 가상의 절단 라인을 따라 절단될 기판을 지지하는 스테이지부와, 상기 절단 라인을 따라 상기 기판의 일부를 가열하기 위한 레이저빔을 방출하는 레이저 발생부와, 상기 레이저빔의 광경로 상에 배치되어 상기 절단 라인으로 향하는 상기 레이저빔의 경사각을 흔들어 광스윙시키는 광스윙부, 그리고 상기 레이저빔에 의해 가열된 상기 기판을 냉각시키는 냉각부를 포함한다. The present invention relates to a substrate cutting apparatus and a substrate cutting method using the same. According to an embodiment of the present invention, a substrate cutting apparatus includes a stage unit supporting a substrate to be cut along a virtual cutting line, and the substrate along the cutting line. A laser generator for emitting a laser beam for heating a portion of the laser beam; an optical swing portion disposed on an optical path of the laser beam to shake the inclination angle of the laser beam toward the cutting line; and the laser beam. It includes a cooling unit for cooling the substrate heated by. 유리 기판, 절단, 광스윙, 적외선 레이저, 기판 절단 장치, 기판 절단 방법 Glass substrate, cutting, optical swing, infrared laser, substrate cutting device, substrate cutting method

Dielectric composition for high-frequencies and manufacturing method thereof

High frequency dielectric magnetic composition contains 38-58wt% of zirconium oxide, 22-43wt% of titanium oxide and 9-26wt% of tin oxide as fundamental components. Based on these components, below 7wt% of zinc oxide, below 10wt% of nickel oxide, below 7wt% of niobium oxide below 4wt% of sintering preparation where hydrated and nitrified manganese are converted into the weight rate of manganese oxide are added to the above composition.

A kind of printed substrate automatic heating blistering equipment

本发明提供一种印刷线路板自动热起凸设备，包括设备骨架以及设在所述设备骨架上的冲床平台、搬运系统平台和上下料平台，所述冲床平台上设有冲床，所述冲床上设有上模装载板，所述搬运系统平台上设有丝杆，所述丝杆上设有搬运机构，所述搬运机构包括搬运Z轴滑轨，所述搬运Z轴滑轨上设有机械手，所述机械手对应所述上模装载板，所述上下料平台上设有丝杆架，所述丝杆架上设有上下料机构和模具开合盖机构，所述上下料平台上还设有托料盘，所述托料盘对应所述上下料机构。本发明提高产品生产效率，降低劳动成本和消除产品品质受作业人员的影响，并且使产品能顺利通过高温高湿的可靠性测试。

Method for fitting out and soldering a circuit board, reflow oven and circuit board for said method

본 발명은 적어도 하나의 연결 와이어 또는 핀 및 종래 자동 납땜 방법을 위한 열에 민감한 하우징 또는 덮개를 갖는 배선 전기 부품이 끼워지는 회로 기판에 대해 배치 및 납땜하기 위한 방법에 관한 것이다. 본 발명은 또한 상기 언급된 방법을 위한 회로 기판과, 회로 기판에 대해 납땜하기 위한 리플로우 오븐에 관한 것이다. 본 발명은 납땜용으로 필요하고 회로 기판 상에 작용하는 열 에너지에 대해 열에 민감한 THT 부품의 열적 차폐용으로 회로 기판을 사용함으로써 리플로우 오븐에서 열에 민감한 부품을 납땜하는 것이 가능하다. 예를 들어, 회로 기판(66)은 프레임(67)에 위치되고 리플로우 오븐(60)을 통해 전달되어 열에 민감한 부품이 열 에너지로부터 벗어나 대향하는 회로 기판(66)의 하부 측면 상에 배열된다. The present invention relates to a method for placing and soldering a circuit board into which a wiring electrical component having at least one connecting wire or pin and a heat sensitive housing or cover for a conventional automatic soldering method is fitted. The invention also relates to a circuit board for the above mentioned method and a reflow oven for soldering to the circuit board. The present invention makes it possible to solder heat sensitive components in a reflow oven by using the circuit board for thermal shielding of heat sensitive THT components to the thermal energy required for soldering and acting on the circuit board. For example, the circuit board 66 is located in the frame 67 and delivered through the reflow oven 60 so that heat sensitive components are arranged on the lower side of the opposing circuit board 66 away from thermal energy. 리플로우 오븐, 회로 기판, 납땜, 연결 와이어, 차폐, 프레임, THT 부품 Reflow Oven, Circuit Board, Soldering, Connection Wire, Shielding, Frame, THT Parts

Soldering Equipment and Soldering Method

전자부품의 납이 납땜되어야 할 위치의 지점에 크림땜납이 놓여지고 그 전자부품의 납이 그 지점에 제공되어 있는 프린트기판을 납땜위치로 공급하고, 공급된 프린트기판의 크림땜납을 국부적으로 가열하여 용융시켜서 전자부품의 납을 그 지점에 납땜하고, 용융된 땜납을 강제 냉각에 의해 고화시켜서 전자부품의 납을 그 지점에 고정시키며, 상기 전자부품의 납이 고학된 땜납에 의해 그 지점에 고정된 프린트기판을 상기 납땜위지로부터 배출하는 납땜방법 및 장치.

Reflow oven and method of operating the same

本申请公开了一种回流焊炉及其操作方法。回流焊炉能够在空气模式和惰性气体模式下操作。回流焊炉包括加热区、阻隔排气区和冷却区。回流焊炉还包括第一管道、第二管道和第三管道。当回流焊炉在空气模式下操作时，将外界的清洁空气输送入加热区，以及从加热区和阻隔排气区排气。当回流焊炉在惰性气体模式下操作时，从阻隔排气区将气体输送入加热区，以及从加热区排气。本申请的回流焊炉在空气和惰性气体两种工作气氛下，都能够在满足回流处理所需的精确的温度分布的情况下，有效地将挥发性污染物排出回流焊炉，从而减少后续的保养和维护次数，并且本申请的回流焊炉能够节省昂贵的惰性气体。

Method for the substrate of electric circuit and for manufacturing this substrate

本发明涉及一种用于电气电路的基底(1，10)，所述基底包括至少一个金属层(2，3，14)和与至少一个金属层(2，3，14)面状地连接的陶瓷纸层(11)，所述陶瓷纸层具有上侧和下侧(11a，11b)，其中陶瓷纸层(11)具有多个孔形的空腔。尤其有利地，至少一个金属层(2，3，14)经由至少一个粘接材料层(6，6a，6b)与陶瓷纸层(11)连接，所述粘接材料层通过将至少一种粘接材料(6a’，6a”，6b’，6b”)涂覆到金属层(2，3，14)和/或陶瓷纸层(11)上来制造，其中借助涂覆的粘接材料(6a’，6a”，6b’，6b”)至少在表面侧填充在陶瓷纸层(11)中的孔形的所述空腔。

Control panel

A panel (1) substrate, comprising a dielectric, e.g. glass, glass-ceramic or ceramic, has several colored layers (3) which can be fired onto the rear, comprising vitreous enamel or ceramic. It also includes one or more layers of printed circuit structures, in conductive paste (5). The colors and conductive paste have the same firing temperature, and at least one electronic component (6) is fastened to the rear of the panel. The firing temperature of colors and paste is in the range 600[deg]C-700[deg]C. It is especially 620[deg]C. The substrate is single-layer safety glass. Electronic components in the printed circuit structures, comprise e.g. resistances or sensor components. A screen-printing process, followed by drying, is used to apply the tracks and colors to the substrate panel. An independent claim is included for the corresponding production.

Method and device for manufacturing electronic unit

(57)【要約】 【課題】 リフロー半田による電子ユニットの製造に関 し、高温による非耐熱部品を保護するとともに良好な半 田付けをし修正作業を少なくする。 【解決手段】 プリント基板の一方の面にクリーム半田 を印刷するクリーム半田印刷機２１と、クリーム半田が 印刷されたプリント基板に平面実装部品を装着するチッ プ装着機２２と、平面実装部品をプリント基板に固着す る第１のリフロー炉２３と、プリント基板に異形部品を 装着するためのクリーム半田を塗布する半田塗布機２４ と、このプリント基板に異形部品を挿入した後、この異 形部品をプリント基板に固着する第２のリフロー炉３０ とを備え、この第２のリフロー炉３０は、プリント基板 の他方の面の温度が一方の面の温度より低く設定された 構成としたものである。これにより、課題を解決するこ とができる。

Method of soldering in a controlled-convection surface-mount reflow furnace

A reflow furnace in which the rate at which the temperature of the parts being processed can change can be varied throughout the furnace in order to provide a high initial rise rate, a period of low or no rise, and a very fast rise to a temperature above the melting point of solder followed by a fast drop to a temperature below the melting point of the solder. The entire operation is performed in an atmosphere of air, inert gas, active gas, or combustible gas. In a stabilization zone and a reflow zone, the primary heating mode is forced, controlled convection that is perpendicular to surface of an assembly to be soldered.

Ceramic substrate, manufacturing method thereof and electric device using same

본 발명은 세라믹 기판 및 그 제조방법과 이를 이용한 전기장치에 관한 것으로 더욱 상세하게는 전기적 특성과 화학적 내성이 우수한 복합 기판과 그 제조방법, 그리고 그 기판을 이용한 전기장치에 관한 것이다. The present invention relates to a ceramic substrate, a method for manufacturing the same, and an electric device using the same. More particularly, the present invention relates to a composite substrate having excellent electrical properties and chemical resistance, a method for manufacturing the same, and an electric device using the substrate.

Sintered body, circuit parts and manufacturing method of sintered body

METHOD AND INSTALLATION FOR TRANSFER OF ELECTRIC CONDUCTING MATERIAL IN FLUID FORM TO PRINT SUBSTRATE

1. Способ переноса электропроводящего материала в текучей форме на подложку, включающий:- предварительный нагрев подложки до первой температуры,- нагревание электропроводящего материала до второй температуры, превышающей температуру плавления электропроводящего материала, что приводит к получению текучего электропроводящего материала,- распыление текучего электропроводящего материала на предварительно нагретую подложку с образованием схемы заданного вида, и- охлаждение подложки, на которую распылен текучий электропроводящий материал, до третьей температуры, которая ниже или равна температуре плавления электропроводящего материала;причем охлаждение включает прижимание той поверхности подложки, на которую распылен текучий электропроводящий материал, к валику, и активное поддержание температуры поверхности валика ниже температуры плавления электропроводящего материала, в результате чего при прижимании к валику происходит охлаждение подложки.2. Способ по п. 1, отличающийся тем, что предварительный нагрев подложки включает по меньшей мере одну из следующих операций: прижимание к нагревательному валику, воздействие теплового излучения, воздействие потока обогревающего газа.3. Способ по любому из предшествующих пунктов, отличающийся тем, что включает разматывание подложки из рулона перед предварительным нагревом.4. Способ по п. 1, отличающийся тем, что включает сматывание подложки, на которую распылен текучий электропроводящий материал, в рулон после охлаждения.5. Способ по п. 1, отличающийся тем, что подложка представляет собой один из следующих материалов: бумагу, бумажный картон, картон, санитарно-гигиеническую бум РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) (51) МПК H05K 3/10 (13) 2014 133 100 A (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ЗАЯВКА НА ИЗОБРЕТЕНИЕ (21)(22) Заявка: 2014133100, 30.01.2013 (71) Заявитель(и): СТОРА ЭНСО ОЙЙ (FI) Приоритет(ы): (30) Конвенционный приоритет: 30.01.2012 FI 20125088 (85) Дата начала рассмотрения заявки PCT на ...

Electrode connection method

A method of connecting first electrodes formed on a first substrate to second electrodes formed on a second substrate and partially coated with a resist pattern so as to substantially expose an opening thereof at a surface of the second electrodes includes (a) coating the second electrodes with a solder at the opening of the resist pattern, (b) aligning the first electrodes with the second electrodes, and (c) electrically connecting the first electrodes to the second electrodes through the solder by heat-pressing the first and second electrodes with a heat-pressure bonding head including a tip face having a width smaller than a width of the opening of the resist pattern so as to heat-press the first and second electrodes at an entire region of the tip face of the heat-pressure bonding head. The method is effective in performing a good electrical connection between electrodes through a solder irrespective of an amount of the solder.

Ceramic substrate and its manufacture method

本发明涉及一种为了以后分单而在陶瓷衬底上目标明确地开设分离线和/或给定断裂线的方法，其中首先在热处理步骤或热工艺步骤中，将有待产生的分离线和/或给定断裂线局部加热，然后用冷却剂突然冷却，从而在陶瓷衬底中由于热交换而沿着分离线和/或给定断裂线目标明确地形成裂纹或材料弱化部分。本发明还涉及一种陶瓷衬底及其应用。根据本发明提出，分离线和/或给定断裂线在烧结好的陶瓷衬底的表面上开设。

A kind of manufacturing process of radar microsensor

本发明公开了一种雷达用微传感器的制造工艺，所述贴膜后进行膜厚测试，所述膜厚测试的用具为测量显微镜，可以确保制备膜的厚度及均匀性复合要求，保证产品的合格率，所述硅的蚀刻气体为SF 6 ，PMMA的蚀刻气体为氧气，有利于保证刻蚀图形的完整性，所述钻孔的同时进行冷却和去污处理，可以减少孔内的杂质，为下一步粘结提供便利，所述粘结后放入到冷却机中进行冷却处理，可以使连接线路板所受温度均匀，又可以减少冷却时间，外形加工后满足外形质量标准，从而适应于安装于雷达内部，采用此种制造工艺加工出来的雷达用微传感器具有产品质量高以及合格率高的优点，市场潜力巨大，前景广阔。

Double-sided touch sensitive panel and flex circuit bonding

A multi-touch sensor panel can be created using a substrate with column and row traces formed on either side. Metal traces running along the border of the substrate can be used to bring the row traces to the same edge as the column traces. A single flex circuit can be fabricated to connect to the rows and columns on directly opposing sides. Flex printed circuits can be bonded to directly opposing attachment areas of a substrate by cooling one side of the substrate while bonding the other. In addition, “coverlay” material extending over right-angled traces on the flex circuit ensure that those traces do not get shorted should conductive bonding material get squeezed out during bonding. Furthermore, a spacer is placed at the distal end of the flex circuit to apply even bonding pressure over the entire flex circuit attachment area during bonding.

Double-sided touch sensitive panel and flex circuit bonding

A multi-touch sensor panel can be created using a substrate with column and row traces formed on either side. Metal traces running along the border of the substrate can be used to bring the row traces to the same edge as the column traces. A single flex circuit can be fabricated to connect to the rows and columns on directly opposing sides. Flex printed circuits can be bonded to directly opposing attachment areas of a substrate by cooling one side of the substrate while bonding the other. In addition, “coverlay” material extending over right-angled traces on the flex circuit ensure that those traces do not get shorted should conductive bonding material get squeezed out during bonding. Furthermore, a spacer is placed at the distal end of the flex circuit to apply even bonding pressure over the entire flex circuit attachment area during bonding.

Double-sided touch sensitive panel and flex circuit bonding

A multi-touch sensor panel can be created using a substrate with column and row traces formed on either side. Metal traces running along the border of the substrate can be used to bring the row traces to the same edge as the column traces. A single flex circuit can be fabricated to connect to the rows and columns on directly opposing sides. Flex printed circuits can be bonded to directly opposing attachment areas of a substrate by cooling one side of the substrate while bonding the other. In addition, “coverlay” material extending over right-angled traces on the flex circuit ensure that those traces do not get shorted should conductive bonding material get squeezed out during bonding. Furthermore, a spacer is placed at the distal end of the flex circuit to apply even bonding pressure over the entire flex circuit attachment area during bonding.

Double-sided touch sensitive panel and flex circuit bonding

A multi-touch sensor panel can be created using a substrate with column and row traces formed on either side. Metal traces running along the border of the substrate can be used to bring the row traces to the same edge as the column traces. A single flex circuit can be fabricated to connect to the rows and columns on directly opposing sides. Flex printed circuits can be bonded to directly opposing attachment areas of a substrate by cooling one side of the substrate while bonding the other. In addition, “coverlay” material extending over right-angled traces on the flex circuit ensure that those traces do not get shorted should conductive bonding material get squeezed out during bonding. Furthermore, a spacer is placed at the distal end of the flex circuit to apply even bonding pressure over the entire flex circuit attachment area during bonding.

Double-sided touch sensitive panel and flex circuit bonding

A multi-touch sensor panel can be created using a substrate with column and row traces formed on either side. Metal traces running along the border of the substrate can be used to bring the row traces to the same edge as the column traces. A single flex circuit can be fabricated to connect to the rows and columns on directly opposing sides. Flex printed circuits can be bonded to directly opposing attachment areas of a substrate by cooling one side of the substrate while bonding the other. In addition, “coverlay” material extending over right-angled traces on the flex circuit ensure that those traces do not get shorted should conductive bonding material get squeezed out during bonding. Furthermore, a spacer is placed at the distal end of the flex circuit to apply even bonding pressure over the entire flex circuit attachment area during bonding.

Thick film resistor circuits

The circuit is formed including (a) depositing a fritless paste having a metal component of primarily Cu with 1-25(1-10) wt.% Ag on a substrate; (b) heating in an oxidising atmos. at less than 1100 deg.C. to bond the metal component to the substrate; (c) forming a resistor material layer on the substrate and portions of the metal; (d) heating in an oxidising atmos. to establish a desired sheet resistance for the resistor material; and (e) heating in a reducing atoms. to establish a desired sheet resistance for the metal without adversely affecting the resistor material.

Process of producing multi-layer glass-ceramic circuit board

내용 없음. No content.

Method for forming metal thin film, and metal thin film

Ag, Au, Ni, Pd, Rh, Ru 및 Pt로부터 선택된 적어도 1종의 금속 또는 이들 금속의 2종 이상으로 형성된 합금의 주위에, 유기물이 분산제로서 부착되어 구성된 금속 나노 입자를 물 및/또는 유기산을 포함하는 가스 분위기하에서 소성하여 금속 박막을 얻는다. 이 금속 박막은 저저항이다. Water and / or organic acids are formed of metal nanoparticles formed by attaching organic matter as a dispersant around at least one metal selected from Ag, Au, Ni, Pd, Rh, Ru, and Pt or an alloy formed of two or more of these metals. Baking in a gas atmosphere containing a to obtain a metal thin film. This metal thin film is low resistance.

Double-sided touch sensitive panel and flex circuit bonding

本发明涉及双面的触感面板与挠性电路粘接。可以使用在两个侧面上形成有列和行迹线的基板来生成多触摸传感器面板。沿着基板边界布置的金属迹线可用于将布迹线引到与列迹线所引向的相同的边缘上。可以制造单个挠性电路以连接到在直接相对侧面上的行和列。可以通过冷却基板的一个侧面同时粘接另一个侧面来将挠性印刷电路粘接到基板的直接相对的连接区域上。此外，延伸到挠性电路上的直角迹线之上的“覆盖层”材料确保如果导电粘接材料在粘接期间被挤压出来，那些迹线不会短路。此外，在挠性电路的末端放置了垫片以在粘接期间在整个挠性电路连接区域之上施加均匀的粘接压力。

Thick print copper pastes for aluminum nitride substrates

本发明提供一种导电浆料，其包含50wt.％至90wt.％的铜粒子、0.5wt.％至10wt.％的玻璃粉、0.1wt.％至5wt.％的粘附促进剂以及5wt.％至20wt.％的有机媒介物，所述粘附促进剂是选自由以下组成的组的成员中的至少一种：氧化亚铜、氧化钛、氧化锆、树脂酸硼、树脂酸锆、无定形硼、磷酸锂、氧化铋、氧化铝以及氧化锌。还提供一种物品，其包含氮化铝衬底和本发明的导电浆料。还提供一种用于形成导电电路的方法。

DEVICE COMPRISING A SUBSTRATE CAPABLE OF BEING THERMOFORMED WITH AN ELECTRICALLY CONDUCTIVE BODY

Le dispositif (1) destiné à être thermoformé comporte un substrat (3) apte à être thermoformé et un organe électriquement conducteur (2) solidaire dudit substrat (3). L'organe électriquement conducteur (2) comporte des particules électriquement conductrices (4), un matériau électriquement conducteur (5), des éléments de forme allongée (6) électriquement conducteurs. Le matériau électriquement conducteur (5) présente une température de fusion strictement inférieure à la température de fusion des particules électriquement conductrices (4) et à la température de fusion des éléments de forme allongée (6). The device (1) intended to be thermoformed comprises a substrate (3) adapted to be thermoformed and an electrically conductive member (2) integral with said substrate (3). The electrically conductive member (2) comprises electrically conductive particles (4), an electrically conductive material (5) and electrically conductive elongated elements (6). The electrically conductive material (5) has a melting temperature strictly below the melting temperature of the electrically conductive particles (4) and the melting temperature of the elongated elements (6).

Patent FR2227351B1

PROCESS FOR DEVELOPING ELECTRICAL CONNECTION MEANS, IN PARTICULAR HYBRID CIRCUIT INTERCONNECTION SUBSTRATES

Soldering method, soldering apparatus and cooling apparatus

종래의 납땜장치를 사용한 프린트 기판의 납땜에서 납땜 후의 냉각이 팬방식의 냉각장치로 실시되었다. 그러나 고온 땜납이나 무아연 땜납을 종래의 납땜장치로 납땜하면, 균열이 생기거나 박리되고 납땜 후의 열 사이클로 인하여 파괴되는 경우가 있었다. In the soldering of the printed circuit board using the conventional soldering apparatus, cooling after soldering was performed by the fan type cooling apparatus. However, when high-temperature solder or zinc-free solder is soldered with a conventional soldering apparatus, there are cases in which cracks or peelings occur and break due to thermal cycles after soldering. 본 발명은 용융 땜납조에서의 납땜 직후에 프린트 기판의 납땜부에 냉각액을 접촉시킴으로써 급냉시켜 납땜부의 균열이나 박리 또는 열 사이클에 의한 파괴 등을 방지하는 납땜방법과 납땜장치 및 냉각장치를 제공하는 것을 과제로 한다. SUMMARY OF THE INVENTION The present invention provides a soldering method, a soldering device, and a cooling device for quenching by contacting a coolant to a soldering portion of a printed board immediately after soldering in a molten soldering tank to prevent cracking, peeling, or destruction by thermal cycling of the soldering portion. It is a task.

Patent JPH0222550B2

Process of producing multiple-layer glass-ceramic circuit board

A process of producing a multiple-layer glass-ceramic circuit board having a copper conductor, comprising the steps of: forming throughholes in a glass-ceramic green sheet at sites where via-contacts will be formed; filling the throughholes with a powder mixture of a copper powder blended with a ceramic powder, the copper powder and the ceramic powder having a powder particle size providing a packing density comparable with or greater than that of the glass-ceramic green sheet when filled in the throughholes; printing a conductor paste on the green sheet having the throughholes filled with the powder mixture, to form a circuit conductor pattern on the green sheet; laminating a plurality of the green sheets having the conductor pattern formed thereon, to form a laminate body; heating the laminate body to thereby remove a binder therefrom and preliminary-fire the laminate body; and firing the preliminary-fired body.

THICK FILM COPPER CONDUCTOR CIRCUITS AND MANUFACTURING METHOD THEREOF

Embedded resistor and capacitor circuit and method of fabricating same

An embedded resistor and capacitor circuit and fabrication method is provided. The circuit includes a substrate, a conductive foil laminated to the substrate, and a thick film dielectric material disposed on the conductive foil. One or more thick film electrodes are formed on the dielectric material and a thick film resistor is formed at least partially contacting the thick film electrodes. A capacitor is formed by an electrode and the conductive foil. The electrodes serve as terminations for the resistor and capacitor.

Method of manufacturing method of ceramic multilayer board

A ceramic multilayer board free from separation and lift can be manufactured by a method including a step in which a stack of ceramic green sheets (10) with holes (12) and intermediate sheets (22 and 24) placed on both sides of the stack are pressed and a step in which the pressed stack produced by the press is baked. The intermediate sheets have communication holes (26) which communicate with the holes. When the stack is pressed, air existing in the holes is discharged out through the communication holes.

An improved thermal conducting system and laminates produced thereform

Disclosed is an improved heat conduction system capable of minimizing a temperature variation between formed laminates at a cooling process. Some laminates interposed between the upper and lower platens are formed under a heated and pressurized environment. The present invention employs a separator with a heat conducting layer therein and a side heat-conducting unit closely contacted to a side of the separator for additionally conducting heat to platens, so that it solves the problems contained in a conventional cooling process, as well as maintaining the advantages of the conventional cooling process.

Circuit board and method of manufacturing circuit board, and method of manufacturing circuit board assembly

A circuit board includes first circuit substrate and second circuit substrate; first circuit substrate includes: a first base layer arranged on the first circuit layer and a plurality of first conductive bodies on the substrate layer; the first circuit layer includes a hot pressing area and a non-hot pressing area except the hot pressing area. One end of the first conductive body is electrically connected to the hot pressing area and the other end is exposed to the first base layer; second circuit substrate includes: a second base layer, a second base layer arranged on the second circuit layer and a plurality of second conductive bodies; one end of the second conductive body is electrically connected to the second circuit layer, and the other end is exposed on the second base layer; The body is electrically connected to the second conductive body.

Ceramic substrate and manufacturing method thereof

SnPbBi ternary alloy three-partalloys increase the technique that material legal system makes circuit board

SnPbBi三元合金增材法制造电路板的工艺，属于电路板制作技术领域。本发明的绝缘基板和SnPbBi三元合金层之间涂布有聚酰亚胺有机硅压敏胶带层。将SnPbBi三元合金置于笔管内；对电热丝进行通电加热，并向环隙空间内充入压缩气体，笔管管体的温度超过95℃时三元合金熔融，待液态三元合金从笔头流出，将液态三元合金涂布于电路板绝缘基材表面形成电路图图案。与现有技术相比为了降低低熔点合金増材制造印制电路板的成本，本发明选用熔点为95℃的低熔点合金，印制电路板制造成本显著降低的,同时解决了印制线路在器件工作中受热融化的问题；印制电路板绝缘基材选用柔性电路板制作领域广泛使用的聚酰亚胺工作安全可靠。

Surface mounted resistor with improved thermal resistance characteristics

A surface mountable resistor chip assembly, containing an integral heat sink, convective cooling provision exhibits higher continuous-mode power ratings than prior art surface mount resistors having comparable printed circuit board footprints. The preferred embodiments are also configured so as to reduce transient thermal impedance in a manner to exhibit increased power rating under short duration overload conditions. The assembly includes a housing with passages, holes or slotted openings, for the chip assembly and for air flow therethrough, and electrically conductive paths to bring the chip electrical connections out to pads on the housing arranged to make electrical connections to a printed circuit board.

Wiring board and method for manufacturing same

The present invention eliminates deterioration of a resin substrate having an electrode/wiring formed thereon. In this wiring board wherein an electrode and wiring are formed on a substrate, the substrate is a resin substrate, and the electrode and/or the wiring is formed by softening an oxide on the resin substrate, said oxide containing P or Ag, and V and Te. Furthermore, this method for manufacturing a wiring board wherein an electrode and wiring are formed on a substrate, which is a resin substrate, is provided with: a step for supplying the resin substrate with an oxide that contains P or Ag, and V and Te; and a step for forming the electrode and/or the wiring by softening the oxide on the resin substrate by radiating electromagnetic waves to the oxide.

Method and device for reflow-soldering and reflow-desoldering of printed circuit boards

Organic binder removal using CO2 plasma

An improved method of fabricating thick film dielectrics and copper conductors comprises depositing and drying an appropriate thick-film ink, treating the resulting patterned layer with a carbon dioxide plasma until substantially all of the organic vehicle is removed therefrom and then firing the layer in an inert atmosphere. In an alternate embodiment, a dried dielectric ink is initially treated with an oxygen plasma until about 75 to 99 percent of the vehicle is removed. Multilayer copper-based circuit structure fabricated utilizing the subject method are characterized by excellent integrity of the dielectric layers.

Process of producing multiple-layer glass-ceramic circuit board

A process of producing a multiple-layer glass-ceramic circuit board having a copper conductor, comprising the steps of: forming throughholes in a glass-ceramic green sheet at sites where via-contacts will be formed; filling the throughholes with a powder mixture of a copper powder blended with a ceramic powder, the copper powder and the ceramic powder having a powder particle size providing a packing density comparable with or greater than that of the glass-ceramic green sheet when filled in the throughholes; printing a conductor paste on the green sheet having the throughholes filled with the powder mixture, to form a circuit conductor pattern on the green sheet; laminating a plurality of the green sheets having the conductor pattern formed thereon, to form a laminate body; heating the laminate body to thereby remove a binder therefrom and preliminary-fire the laminate body; and firing the preliminary-fired body.

Process and an apparatus for producing a thin photoimageable coating on a metallic-layered substrate

A process for producing thin photoresists on printed circuit boards wherein a metallic-layered substrate is conveyed beneath a free falling curtain of a photopolymerizable substance, said substance having a viscosity of 30-120 seconds DIN cup 4 at 25°C, corresponding to 104-608 mPas, and being applied at a curtain height of 5 -25 cm above the board to form a coating having a dry film thickness less than or equal 25 µm after the coated surfaces are dried, whereupon the surfaces are available for photoimaging, developing, etching and stripping operations. The apparatus for producing such thin photoimageable coatings on metallic-layered substrates comprises vacuum means to maintain the boards on the conveyance means in a flat fixed position as they pass beneath the curtain. According to another aspect of the invention the apparatus also comprises a cooling means for cooling the boards from underneath while their upper side is being dryed subsequent to coating in the coating station.

Patent DE3621667C2

Impedance matching conductive structure for high efficiency rf circuits

Process for preparing electrical connection means, in particular interconnection substances of hybrid circuits

내용 없음. No content.

Impedance-matching conductive structures for high-efficiency RF circuits

Improvements in or relating to welding techniques for use in the manufacture of electronic assemblies

1,018,622. Welding by pressure. GENERAL ELECTRIC CO. Ltd., and P. A. BARNET. Feb. 15, 1963 [Feb. 16, 1962; Sept. 24, 1962], Nos. 6059/62 and 36306/62. Heading B3R. The leads of electronic components are welded to portions of the conductors of a printed-circuit pattern, the conductors being mounted on an insulating substrate beyond which the portions extend, by electrodes engaging opposite sides of the members to be welded. In a known method the lead 2 of an electronic component 1 to be connected to a printed-circuit pattern formed in a layer 4 of copper foil on an insulating layer 5 is engaged by an electrode 9 and through a hole 7 provided in the insulating layer 5 an electrode 9 is engaged with the copper foil. Current passed between the electrodes welds the lead to the foil. According to the invention the layer of copper foil projects beyond the insulating material and the component lead and foil are gripped between the electrodes. To dissipate heat generated one metal block is placed in contact with the component and other components on the board 6 and another metal block is contacted with the other side of the board. Fins may be provided on the upper block to bend the leads down into contact with the foil 4. A hood into which cold air is blown may be arranged over the component.

Low dielectric constant composition