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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Поддерживает ввод нескольких поисковых фраз (по одной на строку). При поиске обеспечивает поддержку морфологии русского и английского языка
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Применить Всего найдено 2205. Отображено 100.
01-03-2012 дата публикации

Buffer Layer to Enhance Photo and/or Laser Sintering

Номер: US20120049384A1
Автор: Mohshi Yang, Peter B. Laxton, Zvi Yaniv
Принадлежит: Ishihara Chemical Co Ltd

Conductive lines are deposited on a substrate to produce traces for conducting electricity between electronic components. A patterned metal layer is formed on the substrate, and then a layer of material having a low thermal conductivity is coated over the patterned metal layer and the substrate. Vias are formed through the layer of material having the low thermal conductivity thereby exposing portions of the patterned metal layer. A film of conductive ink is then coated over the layer of material having the low thermal conductivity and into the vias to thereby coat the portions of the patterned metal layer, and then sintered. The film of conductive ink coated over the portion of the patterned metal layer does not absorb as much energy from the sintering as the film of conductive ink coated over the layer of material having the low thermal conductivity. The layer of material having the low thermal conductivity may be a polymer, such as polyimide.

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Номер записи: 1
15-03-2012 дата публикации

Method of fabricating circuit board structure

Номер: US20120060368A1
Автор: Cheng-Po Yu, Han-Pei Huang
Принадлежит: Unimicron Technology Corp

A method of fabrication a circuit board structure comprising providing a circuit board main body, forming a molded, irregular plastic body having a non-plate type, stereo structure and at least one scraggy surface by encapsulating at least a portion of said circuit board main body with injection molded material, and forming a first three-dimensional circuit pattern on said molded, irregular plastic body thereby defining a three-dimensional circuit device.

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Номер записи: 2
24-05-2012 дата публикации

Multilayered printed circuit board and manufacturing method thereof

Номер: US20120125680A1
Автор: Atsushi Shouda, Hiroshi Segawa, Honjin En, Kiyotaka Tsukada, Kouji Asano, Kouta Noda, Naohiro Hirose, Naoto Ishida
Принадлежит: Ibiden Co Ltd

An opening is formed in resin 20 by a laser beam so that a via hole is formed. At this time, copper foil 22 , the thickness of which is reduced (to 3 μm) by performing etching to lower the thermal conductivity is used as a conformal mask. Therefore, an opening 20 a can be formed in the resin 20 if the number of irradiation of pulse-shape laser beam is reduced. Therefore, occurrence of undercut of the resin 20 which forms an interlayer insulating resin layer can be prevented. Thus, the reliability of the connection of the via holes can be prevented. Thus, the reliability of the connection of the via holes can be improved.

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Номер записи: 3
28-02-2013 дата публикации

Screening Process for Manufacturing a Z-directed Component for a Printed Circuit Board

Номер: US20130052338A1
Автор: Keith Bryan Hardin, Paul Kevin Hall, Qing Zhang, Zachary Charles Nathan KRATZER
Принадлежит: Lexmark International Inc

A method for manufacturing a z-directed component for insertion into a mounting hole in a printed circuit board according to one example embodiment includes adding a substrate material to a mold defining the shape of a layer of the z-directed component. A top surface of the substrate material in the mold is leveled. The substrate material in the mold is treated and the layer of the z-directed component is formed. A conductive material is applied to at least one surface of the formed layer. The z-directed component is formed that includes a stack of component layers that includes the formed layer.

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Номер записи: 4
14-11-2013 дата публикации

Mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillers

Номер: US20130299226A1
Автор: Houssam Jomaa, Omar Bchir, Ravi Nalla
Принадлежит: Intel Corp

In some embodiments, an improved mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillers is presented. In this regard, a substrate build-up film is introduced having epoxy material and a plurality of epoxy microspheres, wherein an interior of the microspheres is not fully cured. Other embodiments are also disclosed and claimed.

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Номер записи: 5
01-01-2015 дата публикации

Wiring board, semiconductor device, and method of manufacturing wiring board

Номер: US20150001738A1
Автор: Akio Rokugawa, Noriyoshi Shimizu, Toshinori Koyama
Принадлежит: Shinko Electric Industries Co Ltd

A wiring board includes a first via hole in a first insulating layer to expose a first wiring layer. A first via in the first via hole includes an end surface. A second wiring layer is arranged on the first insulating layer and the end surface of the first via. A second insulating layer covers the second wiring layer. A second via hole in the second insulating layer exposes the second wiring layer. A second via in the second via hole is arranged above the first via through the second wiring layer. The outer surface of the first insulating layer is lower in surface roughness than an inner surface of the first via hole.

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Номер записи: 6
03-01-2019 дата публикации

METHOD FOR PRODUCING PLATED COMPONENT, PLATED COMPONENT, CATALYTIC ACTIVITY INHIBITOR AND COMPOSITE MATERIAL FOR ELECTROLESS PLATING

Номер: US20190008051A1
Автор: KITO Akiko, USUKI Naoki, YUSA Atsushi
Принадлежит: Maxell Holdings, Ltd.

A method for producing a plated part, includes: forming, on a surface of a base member, a catalyst activity inhibiting layer containing a polymer which has at least one of an amide group and an amino group; irradiating with light or heating a part of the surface of the base member on which the catalyst activity inhibiting layer is formed; applying an electroless plating catalyst to the surface of the base member heated or irradiated with the light; and bringing an electroless plating solution into contact with the surface of the base member to which the electroless plating catalyst is applied, to form an electroless plating film at a light-irradiated portion or a heated portion of the surface. 1. A method for producing a plated part , comprising:forming, on a surface of a base member, a catalyst activity inhibiting layer containing a polymer which has at least one of an amide group and an amino group;irradiating with light or heating a part of the surface of the base member on which the catalyst activity inhibiting layer is formed;applying an electroless plating catalyst to the surface of the base member heated or irradiated with the light; andbringing an electroless plating solution into contact with the surface of the base member to which the electroless plating catalyst is applied, to form an electroless plating film at a light-irradiated portion or a heated portion of the surface.2. The method for producing the plated part according to claim 1 , further comprising washing the surface of the base member after the part of the surface of the base member is heated or irradiated with the light and before the electroless plating solution is brought into contact with the surface of the base member.3. The method for producing the plated part according to claim 1 , wherein the polymer is a branched polymer having a side chain.4. The method for producing the plated part according to claim 3 , wherein the branched polymer is a dendritic polymer.5. The method for producing ...

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Номер записи: 7
02-01-2020 дата публикации

ELECTRICALLY CONDUCTING ASSEMBLIES

Номер: US20200008297A1
Автор: Apostolo Marco, COJOCARU Paula, Falco Ivan, Marrani Alessio
Принадлежит:

The present invention pertains to a process for the manufacture of a multilayer assembly comprising applying at least one patterned substrate onto at least one surface of at least one non-patterned substrate. 19-. (canceled)10. A multilayer assembly comprising: a patterned layer (LMP) made of a core of at least one first metal compound (M1) and, optionally, a shell of at least one second metal compound (M2) at least partially coating said core, said compound (M2) being equal to or different from said compound (M1), and', 'optionally, directly adhered onto at least one surface of layer (LMP), preferably onto one surface of layer (LMP), an optically transparent substrate layer (LT-1); and, '(1) at least one patterned substrate, said patterned substrate comprising an optically transparent substrate layer (LT-2) having an outer surface and an inner surface, said layer (LT-2) being equal to or different from layer (LT-1), if any, and', {'sub': 'ot', 'directly adhered onto one surface of layer (LT-2), an optically transparent non-patterned layer (LMT) made of at least one optically transparent metal compound (M),'}, 'said at least one surface of layer (LT-2) being optionally treated by a radio-frequency glow discharge process in the presence of an etching gas, wherein layer (LMP) of the patterned substrate of the multilayer assembly is directly adhered onto the opposite surface of layer (LMT) of the non-patterned substrate., '(2) at least one non-patterned substrate, said non-patterned substrate comprising12. The multilayer assembly according to claim 10 , said multilayer assembly comprising:a patterned layer (LMP) made of a core of at least one first metal compound (M1) and, optionally, a shell of at least one second metal compound (M2) at least partially coating said core, said compound (M2) being equal to or different from said compound (M1),{'sub': 'ot', 'directly adhered onto one surface of layer (LMP), an optically transparent non-patterned layer (LMT) made of at ...

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Номер записи: 8
10-01-2019 дата публикации

Co-Fired Passive Integrated Circuit Devices

Номер: US20190013464A1
Автор: Cappabianca David, Kalnitsky Alexander, Searles Shawn
Принадлежит:

Co-fired integrated circuit devices and methods for fabricating and integrating such on a workpiece are disclosed herein. An exemplary method includes forming a first passive device and a second passive device over a carrier substrate. The first passive device and the second passive device each include at least one material layer that includes a co-fired ceramic material. The carrier substrate is removed after performing a co-firing process to cause chemical changes in the co-fired ceramic material. The first passive device may include a conductive loop disposed between a first magnetic layer and a second magnetic layer. The first magnetic layer, the second magnetic layer, or both includes a co-fired ceramic magnetic material. The second passive device may include a first conductive layer and a second conductive layer separated by a dielectric layer. The first conductive layer, the second conductive layer, or both includes a co-fired ceramic conductive material. 1. A method comprising:forming a first passive device and a second passive device over a carrier substrate, wherein the first passive device is different than the second passive device, and further wherein the first passive device and the second passive device each include at least one material layer that includes a co-fired ceramic material; andremoving the carrier substrate after performing a co-firing process to cause chemical changes in the co-fired ceramic material.2. The method of claim 1 , wherein:the forming the first passive device includes forming a conductive loop disposed between a first magnetic layer and a second magnetic layer, wherein the first magnetic layer, the second magnetic layer, or both includes a co-fired ceramic magnetic material; andthe forming the second passive device includes forming a first conductive layer and a second conductive layer separated by a dielectric layer, wherein the first conductive layer, the second conductive layer, or both includes a co-fired ceramic ...

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Номер записи: 9
11-01-2018 дата публикации

METHOD FOR MANUFACTURING CERAMIC SUBSTRATE, CERAMIC SUBSTRATE, AND SILVER-BASED CONDUCTOR MATERIAL

Номер: US20180014408A1
Автор: Ito Masanori, Katoh Tatsuya, KUTSUNA Masaki
Принадлежит:

A method for manufacturing a ceramic substrate containing glass includes a firing step in which an unfired silver-based conductor material is disposed on an unfired ceramic layer and is fired. The unfired silver-based conductor material contains at least one of a metal boride and a metal silicide. 1. A method for manufacturing a ceramic substrate containing glass , comprising a firing step of firing an unfired ceramic layer and an unfired silver-based conductor material disposed on the unfired ceramic layer , wherein the unfired silver-based conductor material contains a metal boride.2. The manufacturing method according to claim 1 , wherein the metal boride is at least one of lanthanum hexaboride claim 1 , silicon hexaboride claim 1 , titanium diboride claim 1 , and tantalum diboride.3. (Canceled)4. The manufacturing method according to claim 1 , wherein the unfired silver-based conductor material contains the metal boride and the amount of the metal boride with respect to the amount of the inorganic components of the unfired silver-based conductor material is greater than 3 vol. % and less than 20 vol. %.5. The manufacturing method according to claim 1 , wherein the unfired silver-based conductor material contains a silver powder and the metal boride is attached to surfaces of particles of the silver powder in the silver-based conductor material.6. A ceramic substrate comprising a ceramic layer and a wiring layer of a sliver-based conductor which are formed by the firing step according to .7. A silver-based conductor material which is unfired and is fired together with an unfired ceramic layer to form a wiring layer in a ceramic substrate claim 1 , wherein the unfired silver-based conductor material contains a metal boride.8. A method for manufacturing a ceramic substrate containing glass claim 1 , comprising a firing step of firing an unfired ceramic layer and particles of an unfired silver-based conductor material disposed on the unfired ceramic layer claim 1 , ...

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Номер записи: 10
11-01-2018 дата публикации

Manufacturing method of circuit board structure

Номер: US20180014409A1
Автор: Cheng-Chung Lo, Chien-Te Wu, Chien-Tsai Li
Принадлежит: Unimicron Technology Corp

Provided is a manufacturing method of a circuit board structure including steps as below. A glass film is provided on an electrostatic chuck (E-chuck). A dicing process is performed, such that at least one slit is formed in the glass film. A plurality of first conductive vias are formed in the glass film. A first circuit layer is formed on the glass film. A polymer layer is formed on the first circuit layer. The polymer layer covers surfaces of the first circuit layer and the glass film. A plurality of second conductive vias are formed in the polymer layer. A second circuit layer is formed on the polymer layer, such that a first circuit board structure is formed. A singulation process is performed, such that the first circuit board structure is divided into a plurality of second circuit board structures.

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Номер записи: 11
14-01-2016 дата публикации

APPARATUS, SYSTEM, AND METHOD FOR ELECTRONICS MANUFACTURING USING DIRECT WRITE WITH FABRICATED FOILS

Номер: US20160014900A1
Автор: Culp Slade R., Dardona Sameh, Piech Marcin, Schmidt Wayde R.
Принадлежит: UNITED TECHNOLOGIES CORPORATION

An apparatus system and method for an electronic component made with additive manufacturing processes and a foil substrate is provided. The electronic component may include one or more foil substrates and one or more elements. The elements may be produced by an additive manufacturing process. Moreover, the elements may be produced in the same plane or out of plain with one or more foil substrates. The elements may also be various structures, including, for example, connectors, electrical components (e.g., a resistor, a capacitor, a switch, and/or the like), and/or any other suitable electrical elements and/or structures. 1. A method , comprising:producing a first foil from a metal substrate by at least one of an etching process or micro-machining process, wherein the foil is a portion of a circuit;writing a first structure by depositing conductive material via a direct write manufacturing process to the first foil, wherein the first structure is substantially in a plane defined by the first foil; andwriting a second structure by depositing conductive material via the direct write manufacturing process to the first foil, wherein at least a portion of the second structure is substantially out of the plane defined by the first foil.2. The method of claim 1 , further comprising pre-processing the first foil claim 1 , wherein the pre-processing includes treating the foil to facilitate bonding of at least one of the first structure or the second structure.3. The method of claim 1 , further comprising post-processing an electronic assembly claim 1 , wherein the electronic assembly comprises the foil claim 1 , the first structure and the second structure.4. The method of claim 1 , wherein the first structure is at least one of a connector or an electronic component.5. The method of claim 1 , wherein the second structure is at least one of a connector and an electronic component.6. The method of claim 1 , further comprising coupling a second foil to the second structure.7. ...

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Номер записи: 12
17-04-2014 дата публикации

Resin composition for insulating layer for multi-layered printed board

Номер: US20140102623A1
Автор: Kenji Kawai, Shigeo Nakamura
Принадлежит: Ajinomoto Co Inc

Epoxy resin compositions, which comprise (A) en epoxy resin having two or more epoxy groups in a molecule; (B) a phenol type curing agent where an average hydroxyl group content in a molecule (a mean value of (the total number of hydroxyl groups)/(the total number of benzene rings)), P, satisfies the equation 0<P<1; (C) a phenoxy resin; and (D) rubber particles, are suitable for use as an insulating layer of a multi-layered printed board in which, in spite of the fact that the roughness of a roughened surface after a roughening treatment is relatively small, an insulating layer having a good tight adhesion with a conductor layer formed by plating is able to be easily introduced into a multi-layered printed board.

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Номер записи: 13
26-01-2017 дата публикации

CONTACT-DISTANCE TRANSFORMER, ELECTRICAL TESTING DEVICE, AND METHOD FOR PRODUCING A CONTACT-DISTANCE TRANSFORMER

Номер: US20170023615A1
Автор: Ekin Cetin
Принадлежит: FEINMETALL GMBH

A contact-distance transformer of an electric testing device for testing an electric specimen such as a wafer, for reducing a distance between neighboring electric contacts, the transformer having a non-electrically conductive supporting structure with a first side with first electric contacts positioned apart a first distance and a second side with second electric contacts positioned apart a second, smaller distance. The first contacts are connected to the second contacts by electric connections passing through the support structure and/or which are positioned on the support structure. 125-. (canceled)26. A contact-distance transformer of an electric testing device for testing an electric specimen ,a non-electrically conductive supporting structure provided with a first side and a second side, the first side having first electric contacts positioned at a first contact distance to each other, the second side having second electric contacts positioned at a contact distance to each other which is smaller than the first contact distance, the first electric contacts connected to the second electric contacts by electric connections passing through the support structure and/or positioned on the support structure,wherein both the support structure and the electric connections are formed as 3D-printed components, andwherein the contact-distance transformer is used to reduce a distance between neighboring electric contacts.27. The contact-distance transformer according to claim 26 , wherein the first and/or second electric contacts are also formed as 3D-printed components.28. The contact-distance transformer according to claim 26 , wherein at least a first and/or at least a second contact are formed by the front surface of at least one of the electric connections.29. The contact-distance transformer according to claim 26 , wherein the transformer is formed exclusively of 3D-printed components.30. The contact-distance transformer according to claim 26 , wherein the ...

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Номер записи: 14
29-01-2015 дата публикации

TRANSPARENT CONDUCTIVE FILM, SUBSTRATE CARRYING TRANSPARENT CONDUCTIVE FILM, AND PRODUCTION METHOD THEREOF

Номер: US20150027755A1
Автор: Matsui Taisuke, Tadamasa Akihiko, Tsujimoto Akira, Yasuhara Eri
Принадлежит: Panasonic Corporation

Provided is a transparent conductive film wherein an electrically conductive region is converted to an electrically insulating region more readily and rapidly than traditional conductive films and the level difference between the electrically conductive region and the electrically insulating region is smaller. The transparent conductive film has an electrically conductive region and an electrically insulating region . The electrically conductive region contains a resin component , a metal nanowire and an insulation-promoting component . The insulation-promoting component has a light absorption higher than that of the metal nanowire . The electrically insulating region is defined by a region which contains a resin component but not the metal nanowire or a region which contains a resin component and additionally a metal nanowire having an aspect ratio of smaller than that of the metal nanowire 1. A transparent conductive film , comprising:an electrically conductive region; andan electrically insulating region,wherein:the electrically conductive region contains a resin component, a metal nanowire, and an insulator-conversion promoting component;the insulator-conversion promoting component is a nanoparticle having light absorption higher than that of the metal nanowire; andthe electrically insulating region is defined by a region which contains a resin component but not the metal nanowire or a region which contains a resin component and additionally a metal nanowire having an aspect ratio of smaller than that of the metal nanowire.2. A transparent conductive film , comprising:an electrically conductive region; andan electrically insulating region,wherein:the electrically conductive region contains a resin component, a metal nanowire, and an insulator-conversion promoting component;the insulator-conversion promoting component is a photochemical or thermal acid generator; andthe electrically insulating region is defined by a region which contains a resin component but not ...

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Номер записи: 15
29-01-2015 дата публикации

Pcb having glass core

Номер: US20150027757A1
Автор: Seung Eun Lee, Yee Na Shin
Принадлежит: Samsung Electro Mechanics Co Ltd

Disclosed herein is a printed circuit board (PCB) including a glass core for maintaining sufficient rigidity while maintaining a thin thickness to minimize warpage. The PCB includes a glass core having upper and lower surfaces in which pattern formation grooves and through via holes are formed, a plating layer filled in the pattern formation groves and the through via holes, insulating layers stacked on the upper and lower surfaces of the glass core, and solder resist layers formed on the insulating layers via coating.

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Номер записи: 16
29-01-2015 дата публикации

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

Номер: US20150027760A1
Автор: Cho Seong Min, KANG Seung Min, LEE Eun Heay, Pang Jung Youn
Принадлежит: SAMSUNG ELECTRO-MECHANICS., LTD.

A printed circuit board includes an insulating layer; a metal pad formed on the insulating layer; a surface treatment layer formed on the metal pad; a solder layer formed on the surface treatment layer and the insulating layer; and an intermetallic compound layer formed between the solder layer and the surface treatment layer. Further, a printed circuit board may include an insulating layer; a metal seed layer formed on the insulating layer; a metal pad formed on the metal seed layer; a surface treatment layer formed on the metal pad and the metal seed layer; a solder layer formed on the surface treatment layer of the metal pad and the surface treatment layer of the metal seed layer; and an intermetallic compound layer formed between the solder layer and the surface treatment layer. 1. A printed circuit board comprising:an insulating layer;a metal pad formed on the insulating layer;a surface treatment layer formed on the metal pad;a solder layer formed on the surface treatment layer and the insulating layer; andan intermetallic compound layer formed between the solder layer and the surface treatment layer.2. The printed circuit board according to claim 1 , wherein the plane shape of one or both of the surface treatment layer and the insulating layer on which the solder layer is formed is a ring shape.3. The printed circuit board according to claim 2 , wherein the ring-shaped surface treatment layer and the ring-shaped insulating layer are arranged alternately.4. The printed circuit board according to claim 2 , wherein the metal pad consists of an inner pad and an outer pad claim 2 , and the width between the inner pad and the outer pad is greater than 10 μm.5. The printed circuit board according to claim 1 , wherein the surface treatment layer is a metal surface treatment layer.6. The printed circuit board according to claim 5 , wherein the metal surface treatment layer comprises at least one of Cu claim 5 , Ni claim 5 , Pd claim 5 , Au claim 5 , Sn claim 5 , and Ag ...

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Номер записи: 17
10-02-2022 дата публикации

Wiring substrate, semiconductor package and method of manufacturing wiring substrate

Номер: US20220044990A1
Автор: Tomoaki Machida
Принадлежит: Shinko Electric Industries Co Ltd

A second wiring layer is connected to a first wiring layer via an insulating layer. The second wiring layer comprises pad structures. Each pad structure includes a first metal layer formed on the insulating layer, a second metal layer formed on the first metal layer, and a third metal layer formed on the second metal layer. The pad structures comprises a first pad structure and a second pad structure. A via-wiring diameter of the first pad structure is different from a via-wiring diameter of the second pad structure. A distance from an upper surface of the insulating layer to an upper surface of the second metal layer of the first pad structure is the same as a distance from the upper surface of the insulating layer to an upper surface of the second metal layer of the second pad structure.

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Номер записи: 18
23-01-2020 дата публикации

Co-Fired Passive Integrated Circuit Devices

Номер: US20200028071A1
Автор: Cappabianca David, Kalnitsky Alexander, Searles Shawn
Принадлежит:

Co-fired integrated circuit devices and methods for fabricating and integrating such on a workpiece are disclosed herein. An exemplary method includes forming a first passive device and a second passive device over a carrier substrate. The first passive device and the second passive device each include at least one material layer that includes a co-fired ceramic material. The carrier substrate is removed after performing a co-firing process to cause chemical changes in the co-fired ceramic material. The first passive device may include a conductive loop disposed between a first magnetic layer and a second magnetic layer. The first magnetic layer, the second magnetic layer, or both includes a co-fired ceramic magnetic material. The second passive device may include a first conductive layer and a second conductive layer separated by a dielectric layer. The first conductive layer, the second conductive layer, or both includes a co-fired ceramic conductive material. 1. A device comprising:a first wafer including a first passive device and a second passive device, wherein the first passive device is different than the second passive device, the first passive device is disposed laterally adjacent to the second passive device, and the first passive device and the second passive device each include at least one layer that includes a co-fired ceramic material; anda second wafer attached to the first wafer, wherein a circuit element of the second wafer is connected to the first passive device and the second passive device.2. The device of claim 1 , wherein:the first passive device includes a conductive loop disposed between a first magnetic layer and a second magnetic layer, wherein the first magnetic layer, the second magnetic layer, or both includes a co-fired ceramic magnetic material; andthe second passive device includes a first conductive layer and a second conductive layer separated by a dielectric layer, wherein the first conductive layer, the second conductive layer, ...

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Номер записи: 19
10-02-2022 дата публикации

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

Номер: US20220046802A1
Автор: HU XIAN-QIN, PENG CHAO, ZHENG YING-QIU
Принадлежит:

A method for manufacturing a circuit board with narrow conductive traces and narrow spaces between traces includes a base layer and two first wiring layers disposed on opposite surfaces of the base layer. Each first wiring layer includes a first bottom wiring and a first electroplated copper wiring. The first bottom wiring is formed on the base layer. The first bottom wiring includes a first end facing the base layer, a second end opposite to the first end, and a first sidewall connecting the first end and the second end. The first electroplated copper wiring covers the second end and the first sidewall of the first bottom wiring. 1. A method for manufacturing a circuit board , comprising:providing a base layer;forming two first photosensitive resin layers on opposite surfaces of the base layer, each first photosensitive resin layer comprising a photosensitive resin and a conductive material disposed in the photosensitive resin, each first photosensitive resin layer being divided into a first portion and a second portion beside the first portion;treating the first portion through an exposure process;removing the second portion through a development process, thereby obtaining a first bottom wiring, each first bottom wiring comprising a first end facing the base layer, a second end opposite to the first end, and a first sidewall connecting the first end and the second end; andforming a first electroplated copper wiring on the second end and the first sidewall of each first bottom wiring, and each first bottom wiring and the corresponding first electroplated copper wiring cooperatively forming a first wiring layer.2. The method of claim 1 , wherein a width of the second end is greater than a width of the first end.3. The method of claim 1 , further comprising:defining a first through hole in the base layer;wherein at least one of the first photosensitive resin layers is filled in the first through hole to form a first conductive block, which electrically connects the ...

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Номер записи: 20
24-01-2019 дата публикации

METHOD FOR FORMING CIRCUIT ON SUBSTRATE

Номер: US20190029126A1
Автор: IBE Kouta, Nishikawa Kenichi, SADOHARA Daisuke, Shimoda Katsumi, SUZUKI Keita
Принадлежит: JCU CORPORATION

A new method capable of forming a circuit by performing metal plating on a desired portion on a substrate through a small number of steps regardless of the kind of the substrate. A method for forming a circuit on a substrate characterized in that when forming a circuit by plating on a substrate, the method includes steps of applying a coating film containing a silicone oligomer and a catalyst metal onto the substrate, and thereafter, performing an activation treatment of the catalyst metal in the coating film to make the catalyst metal exhibit autocatalytic properties, and then, performing electroless plating. 1. A method for forming a circuit by plating on a substrate , the method comprising:applying a coating film containing a silicone oligomer and a catalyst metal onto the substrate,thereafter, performing an activation treatment of the catalyst metal in the coating film to make the catalyst metal exhibit autocatalytic properties, andthen, performing electroless plating.2. The method according to claim 1 , further comprising: after the electroless plating claim 1 ,(a1) providing a dry film on a non-circuit forming portion,(b1) performing electroplating on a circuit forming portion,(c1) removing the dry film,(d1) removing an electroless plating film on the non-circuit forming portion, and(e1) removing the coating film on the non-circuit forming portion.3. The method according to claim 1 , further comprising: after the electroless plating is performed claim 1 ,(a2) performing electroplating,(b2) providing a dry film on a circuit forming portion,(c2) removing an electroless plating film and an electroplating film on the non-circuit forming portion,(d2) removing the coating film on the non-circuit forming portion, and(e2) removing the dry film.4. The method according to claim 1 , wherein the activation treatment of the catalyst metal in the coating film is performed only on a circuit forming portion.5. The method according to claim 1 , wherein the coating film is ...

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Номер записи: 21
02-02-2017 дата публикации

METAL CIRCUIT STRUCTURE

Номер: US20170029953A1
Автор: Chou Min-Chieh, Huang Meng-Chi, Kao Tune-Hune
Принадлежит: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

A metal circuit structure is provided. The metal circuit structure includes a substrate, a first trigger layer and a first metal circuit layer. The first trigger layer is disposed on the substrate and includes a first metal circuit pattern. The first metal circuit layer is disposed on the first circuit pattern and is electrically insulated from the substrate. The composition of the first trigger layer includes an insulating gel and a plurality of trigger particles. The trigger particles are at least one of organometallic particles, a chelation and a semiconductor material having an energy gap greater than or equal to 3 eV. The trigger particles are disposed in the insulating gel, such that the dielectric constant of the first trigger layer after curing is between 2 and 6.5. 1. A metal circuit structure , comprising:a substrate;a first trigger layer disposed on the substrate and comprised of a first circuit pattern; anda first metal circuit layer disposed on the first circuit pattern and electrically insulated from the substrate;wherein the first trigger layer has a composition comprised of an insulating gel that is cured; and a plurality of trigger particles comprised of at least one of organometallic particles, a chelation, and a semiconductor material having an energy gap greater than or equal to 3 eV, the plurality of trigger particles being distributed in the insulating gel such that the first trigger layer has a dielectric constant ranging between 2 and 6.5.2. The metal circuit structure according to claim 1 , further comprising:a second trigger layer including a second circuit pattern and covering the first trigger layer and the first metal circuit layer; anda second metal circuit layer disposed on the second circuit pattern;wherein, the second trigger layer is made of a material that is the same as that of the first trigger layer.3. The metal circuit structure according to claim 2 , wherein the second trigger layer has a thickness claim 2 , and wherein the ...

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Номер записи: 22
05-02-2015 дата публикации

WIRING BOARD, MOUNTING STRUCTURE USING SAME, AND METHOD OF MANUFACTURING WIRING BOARD

Номер: US20150037611A1
Автор: Hayashi Katsura, Nagasawa Tadashi
Принадлежит: KYOCERA CORPORATION

A wiring board () according to an embodiment of the present invention includes an inorganic insulating layer (A); a first resin layer (A) on one main surface of the inorganic insulating layer (A); a second resin layer (A) on another main surface of the inorganic insulating layer (A); and a conductive layer () partially on one main surface of the second resin layer (A), the one main surface being on an opposite side to the inorganic insulating layer (A). The inorganic insulating layer (A) includes a plurality of first inorganic insulating particles () which are bound to each other at a part of each of the first inorganic insulating particles and gaps (G) surrounded by the plurality of first inorganic insulating particles (). A part of the first resin layer (A) and a part of the second resin layer (A) are located inside the gaps (G). 1. A wiring board , comprising:an inorganic insulating layer;a first resin layer on one main surface of the inorganic insulating layer;a second resin layer on another main surface of the inorganic insulating layer; anda conductive layer partially on one main surface of the second resin layer, the one main surface being on an opposite side to the inorganic insulating layer, whereinthe inorganic insulating layer comprises a plurality of first inorganic insulating particles which are bound to each other at a part of each of the first inorganic insulating particles, and gaps which are surrounded by the plurality of first inorganic insulating particles, anda part of the first resin layer and a part of the second resin layer are located inside the gaps.2. The wiring board according to claim 1 , whereinthe part of the first resin layer is in contact with the part of the second resin layer in the gaps.3. The wiring board according to claim 1 , whereinthe second resin layer comprises a plurality of filler particles whose average particle diameter is larger than a width of each of the gaps and which are made of an inorganic insulating material,the ...

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Номер записи: 23
17-02-2022 дата публикации

Wiring board

Номер: US20220053648A1
Автор: Junichi Nakamura, Shuhei Momose, Takeshi Takai, Toshiki SHIROTORI, Yoshihisa Kanbe, Yusuke KARASAWA
Принадлежит: Shinko Electric Industries Co Ltd

A wiring board includes a core layer having a first through hole formed therein, a magnetic resin filled inside the first through hole, a second through hole formed in the magnetic resin, and a plating film covering an inner wall surface of the second through hole. The plating film includes an electroless plating film, and an electrolytic plating film. The electroless plating film makes direct contact with an inner wall surface of the second through hole.

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Номер записи: 24
11-02-2016 дата публикации

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

Номер: US20160043027A1
Автор: Inagaki Yasushi, Noda Kota
Принадлежит: IBIDEN CO., LTD.

A printed wiring board includes an insulating layer, a first conductor layer embedded into first surface of the insulating layer and including multiple wirings such that the wirings include connecting portions positioned to connect an electronic component, respectively, a second conductor layer projecting from second surface of the insulating layer on the opposite side, a solder resist layer formed on the first surface of the insulating layer such that the solder resist layer is covering the first conductor layer and has an opening structure exposing the connecting portions of the wirings, and multiple metal posts formed on the connecting portions respectively such that each of the metal posts has a width which is larger than a width of a respective one of the wirings having the connecting portions. The wirings are formed such that the connecting portions are positioned side by side on every other adjacent one of the wirings. 1. A printed wiring board , comprising:a resin insulating layer;a first conductor layer embedded into a first surface of the resin insulating layer and comprising a plurality of wirings such that the plurality of wirings includes a plurality of connecting portions positioned to connect an electronic component, respectively;a second conductor layer projecting from a second surface of the resin insulating layer on an opposite side with respect to the first surface of the resin insulating layer;a solder resist layer formed on the first surface of the resin insulating layer such that the solder resist layer is covering the first conductor layer and has an opening structure exposing the connecting portions of the wirings; anda plurality of metal posts formed on the plurality of connecting portions respectively such that each of the metal posts has a width which is larger than a width of a respective one of the wirings having the connecting portions,wherein the plurality of wirings is formed such that the connecting portions are positioned side by ...

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Номер записи: 25
09-02-2017 дата публикации

Carrier-Attached Copper Foil, Laminate, Method For Producing Printed Wiring Board, And Method For Producing Electronic Device

Номер: US20170042044A1
Автор: Nobuaki Miyamoto
Принадлежит: JX Nippon Mining and Metals Corp

Provided herein is a carrier-attached copper foil having desirable fine circuit formability. The carrier-attached copper foil includes a carrier, an interlayer, and an ultrathin copper layer in this order, wherein D2-D1 is 0.30 to 3.83 μm, where D1 is the gravimetrically measured thickness of the carrier-attached copper foil excluding the carrier and the interlayer, and D2 is the maximum thickness of the layer remaining on a bismaleimide-triazine resin substrate in case of detaching the carrier after the carrier-attached copper foil is laminated to the resin substrate from the ultrathin copper layer side by being heat pressed under a pressure of 20 kgf/cm 2 at 220° C. for 2 hours.

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Номер записи: 26
15-02-2018 дата публикации

Embedding apparatus and method utilizing additive manufacturing

Номер: US20180043618A1
Автор: Corey Shemelya, David Espalin, Eric MacDonald, Ryan Wicker
Принадлежит: University of Texas System

An embedded material and an embedding apparatus and method. A compatible solute can be dissolved in a solvent. The object to be embedded can be coated with the solvent/plastic solution using, for example, addition and/or condensation polymerization. The solvent can be removed. The coated object can be inserted, snap fit, or submerged into a partially 3D printed substrate with or without the aid of ultrasonic embedding, thermal energy, joule heating, and/or the use of adhesives, and the 3D printing process resumes in order to fully embed the coated object within the 3D printed substrate. The coated object can be inserted, snap fit, or submerged into a partially 3D printed substrate with or without the addition of ultrasonic embedding, thermal energy, joule heating, and/or adhesives, and the 3D printing process resumes in order to fully embed the coated object within the 3D printed substrate.

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Номер записи: 27
15-02-2018 дата публикации

LOW TEMPERATURE COFIRED CERAMIC MATERIAL, CERAMIC SINTERED BODY, AND CERAMIC ELECTRONIC COMPONENT

Номер: US20180044244A1
Автор: Kaneko Kazuhiro, SUGIMOTO Yasutaka
Принадлежит:

A mixed powder for a low temperature cofired ceramic material that contains 65 to 80 parts by weight of SiO, 5 to 25 parts by weight of BaO, 1 to 10 parts by weight of AlO, 0.1 to 5 parts by weight of MnO, 0.1 to 5 parts by weight of BO, and 0.1 to less than 3 parts by weight of LiO. The ceramic sintered body is used for, for example, ceramic electronic components, e.g., a multilayer circuit board or a coupler. 1. A mixed powder for producing a ceramic material , the mixed powder comprising:{'sub': '2', '65 to 80 parts by weight of SiO;'}5 to 25 parts by weight of BaO;{'sub': 2', '3, '1 to 10 parts by weight of AlO;'}0.1 to 5 parts by weight of MnO;{'sub': 2', '3, '0.1 to 5 parts by weight of BO; and'}{'sub': '2', '0.1 to less than 3 parts by weight of LiO.'}2. The mixed powder for producing a ceramic material according to claim 1 , wherein:{'sub': '2', 'the SiOis 70 to 80 parts by weight;'}the BaO is 10 to 20 parts by weight;{'sub': 2', '3, 'the AlOis 3 to 7 parts by weight;'}the MnO is 2 parts by weight;{'sub': 2', '3, 'the BOis 2 parts by weight; and'}{'sub': '2', 'the LiO is 0.4 parts by weight.'}3. A ceramic sintered body comprising:65 to 80 parts by weight of Si;5 to 25 parts by weight of Ba;2 to 20 parts by weight of Al;0.1 to 5 parts by weight of Mn;0.2 to 10 parts by weight of B; and0.2 to less than 6 parts by weight of Li.4. The ceramic sintered body according to claim 3 , wherein:the Si is 70 to 80 parts by weight;the Ba is 10 to 20 parts by weight;the Al is 6 to 14 parts by weight;the Mn is 2 parts by weight;the B is 4 parts by weight; andthe Li is 0.8 parts by weight.5. The ceramic sintered body according to claim 3 , wherein the Si claim 3 , Ba claim 3 , Al claim 3 , Mn claim 3 , B and Li are in the form of:{'sub': 2', '2', '2', '8, 'glass and at least quartz (SiO) and celsian (BaAlSiO) as a crystal phase,'}wherein a peak intensity ratio denoted by Pq/Pc in powder X-ray diffractometry is 2.2 or more and 5.3 or less, where Pc represents the peak ...

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Номер записи: 28
07-02-2019 дата публикации

MULTI-LAYERED PRINTED CIRCUIT BOARD

Номер: US20190045639A1
Автор: MOHR Adilson Arthur, SILVEIRA Roberto Per
Принадлежит: Hewlett-Packard Development Company, L.P.

A method of forming a multi-layered printed circuit board (PCB) may include, with a printing device, delivering a flexible medium to at least one fluid jet printhead. Printing an electrically conductive fluid on the flexible medium may be performed with at least one fluid jet printhead, to form a first conductive layer on the flexible medium. With the at least one fluid jet printhead, an electrically insulating fluid may be printed on the first conductive layer to form at least one insulating layer on the first conductive layer. With the at least one fluid jet printhead, the electrically conductive fluid may be printed on the at least one insulating layer to form a second conductive layer. 1. A method of forming a multi-layered printed circuit board (PCB) comprising:with a printing device, delivering a flexible medium to at least one fluid jet printhead;with at least one fluid jet printhead, printing an electrically conductive fluid on the flexible medium to form a first conductive layer on the flexible medium;with the at least one fluid jet printhead, printing an electrically insulating fluid on the first conductive layer to form at least one insulating layer on the first conductive layer; andwith the at least one fluid jet printhead, printing the electrically conductive fluid on the at least one insulating layer to form a second conductive layer.2. The method of claim 1 , wherein the at least one fluid jet printhead is thermal inkjet (TIJ) printheads.3. The method of claim 1 , wherein the flexible medium is feedable through a plurality of rollers of the printing device.4. The method of claim 1 , wherein the flexible medium comprises paper or plastic.5. The method of claim 1 , further comprising curing the electrically conductive fluid claim 1 , the electrically insulating fluid claim 1 , or combinations thereof during the printing.6. The method of claim 1 , wherein the at least one fluid jet printhead is a multi-chamber printhead claim 1 , andwherein the ...

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Номер записи: 29
18-02-2016 дата публикации

Multi-layer substrates

Номер: US20160050751A1
Автор: Hongyu Deng, Maziar Amirkiai, Yunpeng Song
Принадлежит: Finisar Corp

This disclosure generally relates to high-speed fiber optic networks that use light signals to transmit data over a network. The disclosed subject matter includes devices and methods relating to header subassemblies and/or optoelectronic subassemblies. In some aspects, the disclosed devices and methods may relate to a header subassembly that can include: a multi-layer substrate with a bottom layer, a top layer having top thin film signal lines, and one or more intermediate layers having thick film traces between the top layer and the bottom layer, the thick film traces electrically coupled to the top thin film signal lines; and optoelectronic components positioned over the multi-layer substrate and electrically coupled with the signal lines.

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Номер записи: 30
14-02-2019 дата публикации

LARGE SCALE MANUFACTURING OF HYBRID NANOSTRUCTURED TEXTILE SENSORS

Номер: US20190048473A1
Автор: Oh Se Chang, Rai Pratyush, VARADAN Vijay K.
Принадлежит: NANOWEAR INC.

A process for the large-scale manufacturing vertically standing hybrid nanometer scale structures of different geometries including fractal architecture of nanostructure within a nano/micro structures made of flexible materials, on a flexible substrate including textiles is disclosed. The structures increase the surface area of the substrate. The structures maybe coated with materials that are sensitive to various physical parameters or chemicals such as but not limited to humidity, pressure, atmospheric pressure, and electromagnetic signals originating from biological or non-biological sources, volatile gases and pH. The increased surface area achieved through the disclosed process is intended to improve the sensitivity of the sensors formed by coating of the structure and substrate with a material which can be used to sense physical parameters and chemicals as listed previously. An embodiment with the structures on a textile substrate coated with a conductive, malleable and bio-compatible sensing material for use as a biopotential measurement electrode is provided. 116-. (canceled)17. A method for manufacturing of hybrid nanostructured textile sensors comprising:feeding one or more polymers and a matrix polymer in molten form through respective extruders to a spinneret to produce fibers having filaments of the one or more polymers in the matrix polymer, the filaments having dimensions of from about 10 to about 100 nanometers;cutting the fibers to a length of from about 0.1 to about 1.5 mm to produce nanofibers;activating the cut nanofibers in a reactor;drying the activated nanofibers;applying an adhesive to a conductive fabric;depositing the activated nanofibers as vertically standing nanofibers, the depositing step including performing an electrostatic and/or pneumatic assisted deposition process using a high strength electrostatic field of 2 kV/cm-10 kV/cm to electrostatically charge the activated nanofibers and deposit the electrostatically charged activated ...

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Номер записи: 31
25-02-2016 дата публикации

BOTTOM ELECTRODE SUBSTRATE FOR SEGMENT-TYPE ELECTRO-PHORETIC DISPLAY AND METHOD FOR MANUFACTURING THEREOF

Номер: US20160054635A1
Автор: CHEN Wei-Juin, Huang Chien-Chung, YANG Huai-Tze
Принадлежит:

The present disclosure provides a bottom electrode substrate for a segment-type electrophoretic display. The bottom electrode substrate includes a flexible substrate, a first conductive layer, an insulating layer, a second conductive layer and a segment-type electrode. The first conductive layer is disposed on the flexible substrate. The insulating layer covers the first conductive layer and the flexible substrate, wherein the insulating layer has at least one opening exposing a part of the first conductive layer. The second conductive layer is filled in the opening and in contact with the exposed first conductive layer. The segment-type electrode covers the second conductive layer and the insulating layer, and is in contact with the second conductive layer. A method for manufacturing the bottom electrode substrate is also provided herein. 1. A bottom electrode substrate for a segment-type electrophoretic display device , comprising:a flexible substrate;a first conductive layer disposed on the flexible substrate;a first insulating layer covering the flexible substrate and the first conductive layer, wherein the first insulating layer has at least one opening exposing a part of the first conductive layer;a second conductive layer filled in the opening and in contact with the exposed first conductive layer;a segment-type electrode covering the second conductive layer and the first insulating layer, and in contact with the second conductive layer,wherein the first conductive layer is formed of a first conductive slurry, the second conductive layer is formed of a second conductive slurry, and the segment electrode is formed of a third conductive slurry.2. The bottom electrode substrate of claim 1 , wherein the material of the flexible substrate comprises polyethylene terephthalate (PET) claim 1 , poly(methyl methacrylate) (PMMA) claim 1 , polycarbonate (PC) claim 1 , polyethylene (PE) claim 1 , polypropylene (PP) or a combination thereof.3. The bottom electrode ...

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Номер записи: 32
26-02-2015 дата публикации

CURABLE RESIN COMPOSITION, FILM, LAMINATED FILM, PREPREG, LAMINATE, CURED ARTICLE, AND COMPOSITE ARTICLE

Номер: US20150056434A1
Автор: Kamata Kouhei, Kawasaki Masafumi
Принадлежит:

A curable resin composition containing an epoxy compound (A), active ester compound (B), filler (C), and alicyclic olefin polymer (D) containing an aromatic ring and/or hetero atom and not having reactivity to an epoxy group, wherein a ratio of content of said alicyclic olefin polymer (D) with respect to 100 parts by weight of said epoxy compound (A) is 1 to 50 parts by weight, is provided. 19-. (canceled)10. A curable resin composition containing an epoxy compound (A) , active ester compound (B) , filler (C) , and alicyclic olefin polymer (D) containing an aromatic ring and/or hetero atom and not having reactivity to an epoxy group ,wherein a ratio of content of said alicyclic olefin polymer (D) with respect to 100 parts by weight of said epoxy compound (A) is 1 to 50 parts by weight.11. The curable resin composition as set forth in wherein a ratio of said epoxy compound (A) and said active ester compound (B) is 0.5 to 1.25 in range in terms of the ratio of (the amount of epoxy groups of said epoxy compound (A)/the amount of active ester groups of said active ester compound (B)).12. A film which is comprised of the curable resin composition as set forth in .13. A laminated film having an adhesive layer which is comprised of the curable resin composition as set forth in and a platable layer which is comprised of a platable layer-use resin composition.14. A prepreg which is comprised of the film as set forth in and a fiber base material.15. A prepreg which is comprised of the laminated film as set forth in claim 13 , and a fiber base material.16. A laminate obtained by laminating claim 12 , on a base material claim 12 , the film as set forth in .17. A laminate obtained by laminating claim 13 , on a base material claim 13 , the laminated film as set forth in .18. A cured article obtained by curing the curable resin composition as set forth in .19. A cured article obtained by curing the film as set forth in .20. A cured article obtained by curing the laminated film as ...

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Номер записи: 33
25-02-2016 дата публикации

CIRCUIT SUBSTRATE HAVING A CIRCUIT PATTERN AND METHOD FOR MAKING THE SAME

Номер: US20160057865A1
Автор: LIAO Pen-Yi, YI Sheng-Hung
Принадлежит: TAIWAN GREEN POINT ENTERPRISES CO., LTD.

A circuit substrate includes: an insulative substrate formed with a pattern of a recess, the recess being defined by a recess-defining wall that has a bottom wall surface and a surrounding wall surface extending upwardly from the bottom wall surface; a patterned metallic layer structure including at least a patterned active metal layer disposed within the recess, formed on the bottom wall surface of the recess-defining wall, and spaced apart from the surrounding wall surface of the recess-defining wall, the patterned active metal layer containing an active metal capable of initiating electroless plating; and a primary metal layer plated on the patterned metallic layer structure. 1. A method for making a circuit substrate having a circuit pattern , the method comprising:(a) providing an insulative substrate having a top surface;(b) forming a pattern of a recess in the insulative substrate such that the recess is indented from the top surface, the recess being defined by a recess-defining wall having a bottom wall surface and a surrounding wall surface extending upwardly from the bottom wall surface;(c) forming a metallic layer structure on the recess-defining wall of the recess and the top surface of the insulative substrate, the metallic layer structure including at least one active metal layer containing an active metal capable of initiating electroless plating;(d) removing a portion of the metallic layer structure that is disposed along a peripheral edge of the bottom wall surface of the recess-defining wall so as to form the metallic layer structure into a first region which is disposed on the bottom wall surface, and a second region which is physically separated from the first region; and(e) plating a primary metal layer on the first region of the metallic layer structure.2. The method of claim 1 , wherein claim 1 , in step (c) claim 1 , the active metal of the active metal layer is a reduced active metal claim 1 , and the metallic layer structure is formed on ...

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Номер записи: 34
14-02-2019 дата публикации

INTERMEDIATE PRINTED BOARD FOR MAKING MULTIPLE PRINTED CIRCUIT BOARDS AND METHOD OF MANUFACTURING THE SAME

Номер: US20190053380A1
Автор: Miyazaki Masashi, Sugiyama Yuichi
Принадлежит: TAIYO YUDEN CO., LTD.

An intermediate printed board has a plurality of unit regions that are to be cut out and separated to become a plurality of individual printed circuit boards, respectively. The intermediate printed board includes a metal core substrate including: a metal layer; and a plating layer formed on each of a top surface and a bottom surface of the metal layer, the plating layer being absent in each of cutting regions, the cutting regions being regions on the intermediate printed board where the plurality of unit regions are separated so as to produce the plurality of individual printed circuit boards; an insulating layer formed so as to cover a surface of the metal core substrate; and a conductive pattern formed on the insulating layer. 1. An intermediate printed board having a plurality of unit regions that are to be cut out and separated to become a plurality of individual printed circuit boards , respectively , the intermediate printed board comprising: a metal layer; and', 'a plating layer formed on each of a top surface and a bottom surface of the metal layer, the plating layer being absent in each of cutting regions, the cutting regions being regions on the intermediate printed board where the plurality of unit regions are separated so as to produce the plurality of individual printed circuit boards;, 'a metal core substrate includingan insulating layer formed so as to cover a surface of the metal core substrate; anda conductive pattern formed on the insulating layer.2. The intermediate printed board according to claim 1 , wherein in each of the cutting regions claim 1 , the metal layer straddles adjacent two of the unit regions that are separated by the cutting region therebetween claim 1 , and each of the cutting regions has an area in a plan view where the metal layer is absent.3. The intermediate printed board according to claim 1 , wherein the metal layer is made of stainless steel.4. The intermediate printed board according to claim 1 , wherein the metal layer ...

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Номер записи: 35
13-02-2020 дата публикации

MANUFACTURING METHOD OF A MULTI-LAYER CIRCUIT BOARD

Номер: US20200053884A1
Автор: Chen Yu-Ming
Принадлежит: WINBOND ELECTRONICS CORP.

A multi-layer circuit board including a plurality of insulation bumps, a first conductive layer, and a second conductive layer is provided. The plurality of insulation bumps are disposed between a first substrate and a second substrate. A top portion of the plurality of insulation bumps is served as a circuit connection point. The first conductive layer is disposed on the first substrate and connected to the circuit connection point. The second conductive layer is disposed on the second substrate and connected to the circuit connection point. 1. A manufacturing method of a multi-layer circuit board , comprising:forming a plurality of insulation bumps with a protruding shape on a first substrate, wherein the plurality of insulation bumps comprise being formed by a 3D printing method, and a material of the insulation bumps is a ceramic material;forming a first conductive layer on the first substrate, and a portion of the first conductive layer being located at a top portion of the plurality of insulation bumps;forming an adhesive layer on a second substrate;pressing the first substrate and the second substrate, the insulation bumps penetrating the adhesive layer and the second substrate and exposing the top portion; andforming a second conductive layer on the second substrate, and the second conductive layer being electrically connected to the first conductive layer of the top portion of the plurality of insulation bumps;wherein the first conductive layer and the second conductive layer comprise being formed by a 3D printing method.2. The manufacturing method of the multi-layer circuit board according to claim 1 , wherein after forming the plurality of insulation bumps by the 3D printing method claim 1 , further comprising performing a sintering process.3. The manufacturing method of the multi-layer circuit board according to claim 1 , wherein after forming the adhesive layer on the second substrate and before pressing the first substrate and the second substrate ...

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Номер записи: 36
21-02-2019 дата публикации

MULTILAYER SUBSTRATE AND A MANUFACTURING METHOD OF THE MULTILAYER SUBSTRATE

Номер: US20190057800A1
Автор: ITO Yuki
Принадлежит:

A multilayer substrate includes an element assembly including a second insulating layer and a first insulating layer arranged in this order from a first side to a second side with respect to a layer stacking direction, a first conductor layer on the first side of the first insulating layer and including a plated layer, and a second conductor layer on the first side of the second insulating layer. The first conductor layer includes a first connection portion and a first circuit portion, and the second conductor layer includes a second connection portion and a second circuit portion. When viewed from the layer stacking direction, the first circuit portion includes an overlapping portion which overlaps the second circuit portion. A portion of the first connection portion connected to the second connection portion has a maximum thickness greater than a maximum thickness of the overlapping portion. 1. A multilayer substrate comprising:an element assembly including a first insulating layer and a second insulating layer stacked such that the second insulating layer and the first insulating layer are arranged in this order from a first side to a second side with respect to a layer stacking direction;a first conductor layer disposed on a first principal surface of the first insulating layer and including a plated layer, the first principal surface being on the first side of the first insulating layer with respect to the layer stacking direction; anda second conductor layer disposed on a first principal surface of the second insulating layer, the first principal surface being on the first side of the second insulating layer with respect to the layer stacking direction; whereinthe first conductor layer includes a first connection portion and a first circuit portion which defines a signal transmission path;the second conductor layer includes a second connection portion and a second circuit portion which defines a signal transmission path;the first connection portion and the ...

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Номер записи: 37
21-02-2019 дата публикации

MULTILAYER SUBSTRATE AND A MANUFACTURING METHOD OF THE MULTILAYER SUBSTRATE

Номер: US20190057803A1
Автор: GOUCHI Naoki, ITO Yuki, MURAOKA Kazutaka, YOSUI Kuniaki
Принадлежит:

A multilayer substrate includes first and second insulating layers stacked in a stacking direction with the second insulating layer located at a first side of the first insulating layer in the stacking direction, a first coil pattern disposed on a first principal surface of the first insulating layer on the first side of the first insulating layer in the stacking direction, and a second coil pattern disposed on a first principal surface of the second insulating layer on the first side of the second insulating layer in the stacking direction. The first and second coil patterns have spiral shapes. When viewed from the layer stacking direction, at least a portion of a first area in which the first coil pattern is disposed and at least a portion of a second area in which the second coil pattern is disposed overlap each other. 1. A multilayer substrate comprising:an element assembly including a first insulating layer and a second insulating layer which are stacked in layers in a layer stacking direction such that the second insulating layer is located at a first side of the first insulating layer with respect to the layer stacking direction;a first coil pattern disposed on a first principal surface of the first insulating layer that is on the first side of the first insulating layer with respect to the layer stacking direction; anda second coil pattern disposed on a first principal surface of the second insulating layer that is on a first side of the second insulating layer with respect to the layer stacking direction; whereineach of the first coil pattern and the second coil pattern has a two-dimensional spiral shape including turns when viewed from the layer stacking direction;when viewed from the layer stacking direction, at least a portion of a first area in which the first coil pattern is disposed and at least a portion of a second area in which the second coil pattern is disposed overlap each other;a maximum thickness of the second coil pattern is smaller than a ...

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Номер записи: 38
21-02-2019 дата публикации

MULTI-LAYER CIRCUIT BOARD CAPABLE OF BEING APPLIED WITH ELECTRICAL TESTING AND METHOD FOR MANUFACTURING THE SAME

Номер: US20190059153A1
Автор: Chang Chin-Hsi, CHANG SHUO-HSUN, Liu Chin-Kuan, Lu Yu-Te, Wang Chao-Lung
Принадлежит:

A multi-layer circuit board capable of being applied with electrical testing includes a patterned metal-interface layer, a metallic delivery loading plate, an electrical connection layer, a conductive corrosion-barrier layer, a bottom dielectric layer, and a multi-layer circuit structure. The multi-layer circuit structure is disposed on the delivery loading plate through the bottom dielectric layer. The top-layer circuit of the multi-layer circuit structure is electrically connected to the conductive corrosion-barrier layer through the bottom-layer circuit and the electrical connection layer. The delivery loading plate and the patterned metal-interface layer expose the conductive corrosion-barrier layer. Therefore, before the multi-layer circuit board is packaged, an electrical testing can be applied to the multi-layer circuit board to check if it can be operated normally. Hence, costs for figuring out reasons of the unqualified electronic component can be reduced, and responsibilities for the unqualified electrical testing result of the electronic component can be clarified. 1. A multi-layer circuit board capable of being applied with electrical testing , the multi-layer circuit board comprising:a patterned metal interface layer being conductive;a delivery loading plate overlapping on a top surface of the patterned metal interface layer, the delivery loading plate comprising a first side and a second side opposite to the first side, wherein the second side is connected to the top surface of the patterned metal interface layer, and the delivery loading plate is made of metal;a bottom dielectric layer overlapping on the first side of the delivery loading plate; a bottom-layer circuit on the bottom dielectric layer;', 'a top dielectric layer on a top side of the bottom-layer circuit; and', 'a top-layer circuit on the top dielectric layer and electrically connected to the bottom-layer circuit;, 'a multi-layer circuit structure overlapping on the bottom dielectric layer ...

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Номер записи: 39
21-02-2019 дата публикации

MULTI-LAYER CIRCUIT BOARD CAPABLE OF BEING APPLIED WITH ELECTRICAL TESTING AND METHOD FOR MANUFACTURING THE SAME

Номер: US20190059154A1
Автор: Chang Chin-Hsi, CHANG SHUO-HSUN, Liu Chin-Kuan, Lu Yu-Te, Wang Chao-Lung
Принадлежит:

A multi-layer circuit board capable of being applied with electrical testing includes a metallic delivery loading plate, a bottom-layer circuit structure, a conductive corrosion-barrier layer, and a multi-layer circuit structure. The bottom-layer circuit structure is overlapping on the delivery loading plate. The conductive corrosion-barrier layer is disposed on the bottom dielectric layer. The multi-layer circuit structure is overlapping on the bottom-layer circuit structure. The top-layer circuit of the multi-layer circuit structure is electrically connected to the conductive corrosion-barrier layer through the inner-layer circuit of the multi-layer circuit structure and the bottom-layer circuit of the bottom-layer circuit structure. The delivery loading plate and the bottom dielectric layer of the bottom-layer circuit structure expose the conductive corrosion-barrier layer. Therefore, before the multi-layer circuit board is packaged, an electrical testing can be applied to the multi-layer circuit board to check if it can be operated normally. 1. A multi-layer circuit board capable of being applied with electrical testing , the multi-layer circuit board comprising:a delivery loading plate made of metal and comprising a first side and a second side opposite to the first side; a bottom dielectric layer on the first side of the delivery loading plate; and', 'a bottom-layer circuit on the bottom dielectric layer;, 'a bottom-layer circuit structure overlapping on the first side of the delivery loading plate and comprisinga conductive corrosion-barrier layer on the bottom dielectric layer and electrically connected to the bottom-layer circuit; and a top-layer circuit electrically connected to the bottom-layer circuit;', 'a top dielectric layer between the top-layer circuit and the bottom-layer circuit structure;', 'an inner dielectric layer on the bottom dielectric layer and the bottom-layer circuit; and', 'an inner-layer circuit on the inner dielectric layer and ...

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Номер записи: 40
03-03-2016 дата публикации

PART-EMBEDDED CIRCUIT STRUCTURE AND METHOD FOR MANUFACTURING SAME

Номер: US20160066418A1
Автор: CHENG YU-HAO, HU WEN-HUNG, Wang Yue
Принадлежит:

A method for manufacturing a part-embedded circuit structure includes: forming an inner resist layer with an opening on a base member to expose a portion of the base member; forming an inner wiring layer on the inner resist layer which extends into the opening of the inner resist layer; laminating a dielectric layer on the inner wiring layer; forming an outer wiring layer on the dielectric layer opposite to the inner wiring layer; and removing the base member to expose the inner wiring layer in the opening and the inner resist layer such that a level plane is formed. 1. A method for manufacturing a part-embedded circuit structure comprising:forming an inner resist layer with an opening on a base member to expose a portion of the base member;forming an inner wiring layer on the inner resist layer which extends into the opening of the inner resist layer;laminating a dielectric layer on the inner wiring layer;forming an outer wiring layer on the dielectric layer opposite to the inner wiring layer; andremoving the base member to expose the inner wiring layer in the opening and the inner resist layer such that a level plane is formed.2. The method for manufacturing a part-embedded circuit structure of claim 1 , wherein forming an inner wiring layer on the inner resist layer which extends into the opening of the inner resist layer comprises:forming a seed layer on the inner resist layer which extends into the opening;forming a patterned dry film on the seed layer;forming an inner plated layer on the seed layer exposed from the patterned dry film; andremoving the patterned dry film and the seed layer covered by the patterned dry film.3. The method for manufacturing a part-embedded circuit structure of claim 1 , wherein a copper layer is laminated on the dielectric layer opposite to the inner wiring layer before laminating the dielectric layer on the inner wiring layer claim 1 , and forming an outer wiring layer on the dielectric layer opposite to the inner wiring layer ...

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Номер записи: 41
12-03-2015 дата публикации

Multi-layer micro-wire substrate method

Номер: US20150068032A1
Автор: Ronald Steven Cok
Принадлежит: Individual

A method of making a multi-layer micro-wire structure includes providing a substrate having a substrate edge and first and second layers formed over the substrate. One or more micro-channels are imprinted in each of the first and second layers and first and second micro-wires located in the imprinted micro-channels, the micro-wires forming at least a portion of an exposed connection pad in each layer. The second layer edge is farther from the substrate edge than the first layer edge for at least a portion of the second layer edge so that the first connection pads are exposed through the second layer.

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Номер записи: 42
12-03-2015 дата публикации

PRINT ELEMENT SUBSTRATE, METHOD OF MANUFACTURING THE SAME, PRINTHEAD AND PRINTING APPARATUS

Номер: US20150070434A1
Автор: Kurita Noriyuki, Sasaki Keiichi
Принадлежит:

A method of manufacturing a print element substrate, comprising preparing a substrate, including a first region and a second region, in which a printing portion is formed on the first region, and a wiring pattern connected to the printing portion is formed on the first region and the second region, forming an insulating film covering the printing portion and the wiring pattern, and forming a conductive cavitation-resistant film on the insulating film, wherein in the forming the insulating film, the insulating film is formed such that a side surface of a portion of the insulating film, which is formed on the second region, includes an inclined face. 1. A method of manufacturing a print element substrate , comprising steps of:preparing a substrate including a first region, a second region different from the first region, a printing portion configured to print by supplying thermal energy to a liquid and formed on the first region, and a wiring pattern electrically connected to the printing portion and formed on the first region and on the second region;forming an insulating film covering the printing portion and the wiring pattern, the insulating film being formed on the first region and on the second region; andforming a conductive cavitation-resistant film on the insulating film by forming a conductive member on the insulating film, and removing at least a portion of the conductive member, the portion of the conductive member being formed on the second region,wherein in the step of forming the insulating film, the insulating film is formed such that a side surface of a portion of the insulating film, portion of the insulating film being formed on the second region, includes an inclined face.2. The method according to claim 1 , further comprising a step of forming the wiring pattern claim 1 ,wherein the step of forming the wiring pattern includes:a first step of forming a metal pattern on the first region and the second region by a patterning method; anda second step ...

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Номер записи: 43
28-02-2019 дата публикации

Wiring substrate and semiconductor device

Номер: US20190067224A1
Автор: Jun Furuichi
Принадлежит: Shinko Electric Industries Co Ltd

A wiring substrate includes a first wiring structure. The first wiring structure has a first insulation layer including a reinforcement material. A first wiring layer is embedded in the first insulation layer. A second wiring structure having a higher wiring density than the first wiring structure is formed on the first insulation layer. The second wiring structure includes at least one second insulation layer and two or more second wiring layers. A lower surface of the first wiring layer is flush with a lower surface of the first insulation layer. The reinforcement material is located toward the second wiring structure from a thickness-wise center of the first insulation layer and laid out at a thickness-wise center of a thickness from the lower surface of the first insulation layer to an upper surface of the uppermost second wiring layer in the second wiring structure.

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Номер записи: 44
10-03-2016 дата публикации

Manufacturing method of multilayer flexible circuit structure

Номер: US20160073505A1
Автор: Cheng-Po Yu, Kuo-Wei Li
Принадлежит: Unimicron Technology Corp

A manufacturing method of multilayer flexible circuit structure including the following steps is provided. Two first flexible substrates are correspondingly bonded on two sides of a release film, and two conductive materials are correspondingly formed on the two first flexible substrates. The two conductive materials are patterned to form two first inner-layer circuits. Two outer build-up structures are bonded on the two corresponding first flexible substrates. The release film is removed, so as to separate the two first flexible substrates. An outer-layer circuit is formed on each of the first flexible substrates and the corresponding outer build-up structure, wherein the outer-layer circuit is connected to the corresponding first inner-layer circuit, and each of the first flexible substrates, the corresponding first inner-layer circuit, the outer build-up structure and the outer-layer circuit correspondingly form a multilayer flexible circuit structure. Another manufacturing method of multilayer flexible circuit structure is also provided.

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Номер записи: 45
08-03-2018 дата публикации

STRETCHABLE CABLE AND STRETCHABLE CIRCUIT BOARD

Номер: US20180070446A1
Автор: Takahashi Akio, TERADA Tsunehiko
Принадлежит:

A stretchable cable includes a sheet-shaped stretchable base material exhibiting elasticity and elongated in one direction, and a stretchable wiring formed on one surface of the stretchable substrate and exhibiting elasticity. The stretchable base material is made of a material exhibiting elasticity. The stretchable wiring is made of a conductive composition including elastomer and a conductive filler filling the elastomer. 1. A stretchable cable comprising:a sheet-shaped base material exhibiting elasticity; anda wiring formed on one surface of the base material and exhibiting elasticity, whereinthe wiring is made of a conductive composition containing elastomer and a conductive filler filling the elastomer.2. The stretchable cable according to claim 1 , whereinthe conductive filler includes a coil-shaped conductive filler.3. The stretchable cable according to claim 1 , whereinthe conductive filler includes a dendrite-shaped conductive filler.4. A stretchable circuit board comprising:a stretchable substrate exhibiting elasticity;a non-stretchable substrate bonded to a partial region of one surface of the stretchable substrate and not exhibiting elasticity; anda stretchable wiring formed on the other surface of the stretchable substrate and exhibiting elasticity.5. The stretchable circuit board according to claim 4 , further comprising:a conductor layer formed on a surface of the non-stretchable substrate opposite to a surface bonded to the stretchable substrate; anda first via penetrating the stretchable substrate and the non-stretchable substrate and connecting the stretchable wiring and the conductor layer together.6. The stretchable circuit board according to claim 5 , further comprising:an insulating layer covering the conductor layer;an electronic component provided on a surface of the insulating layer; anda second via penetrating the insulating layer and electrically connecting the conductor layer and the electronic component together.7. A stretchable circuit ...

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Номер записи: 46
19-03-2015 дата публикации

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

Номер: US20150075845A1
Автор: YOO Ki Young
Принадлежит: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Disclosed herein are a printed circuit board and a method of manufacturing the same. According to a preferred embodiment of the present invention, the printed circuit board includes: a base substrate; an inner layer build-up layer formed on the base substrate and including a first inner layer circuit layer, a second inner layer circuit layer, an inner layer insulating layer, and an inner layer via having a tapered section; and an outer layer build-up layer formed on the inner layer build-up layer and including an outer layer circuit layer, an outer layer insulating layer, and an outer layer via having a rectangular section. 1. A printed circuit board , comprising:a base substrate;an inner layer build-up layer formed on the base substrate and including a first inner layer circuit layer, a second inner layer circuit layer, an inner layer insulating layer, and an inner layer via having a tapered section; andan outer layer build-up layer formed on the inner layer build-up layer and including an outer layer circuit layer, an outer layer insulating layer, and an outer layer via having a rectangular section.2. The printed circuit board as set forth in claim 1 , wherein the inner layer build-up layer includes at least one of the first inner layer circuit layer claim 1 , the second inner layer circuit layer claim 1 , the inner layer insulating layer claim 1 , and the inner layer via.3. The printed circuit board as set forth in claim 1 , wherein the inner layer build-up layer includes:the first inner layer circuit layer formed on the base substrate;the inner layer insulating layer formed on the base substrate and the first inner layer circuit layer;the inner layer via formed on the first inner layer circuit layer and formed to penetrate through the inner layer insulating layer; andthe second inner layer circuit layer formed on the inner layer insulating layer and the inner layer via.4. The printed circuit board as set forth in claim 1 , wherein the outer layer build-up layer ...

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Номер записи: 47
28-02-2019 дата публикации

COMPOSITE CIRCUIT BOARD

Номер: US20190069406A1
Автор: HU XIAN-QIN, LI CHENG-JIA, Yang Mei
Принадлежит:

A composite circuit board includes an insulation layer, an inner circuit layer, a first conductive layer and a second conductive layer embedded in the insulation layer, a third conductive layer and a fourth conductive layer formed on opposite surfaces of the insulation layer. The third conductive layer electrically connects with the first conductive layer. The fourth conductive layer electrically connects with the second conductive layer. The inner circuit layer is in a middle portion of the insulation layer. The first conductive layer and the second conductive layer respectively forms on opposite sides of the inner circuit layer. The insulation layer forms a plurality of first through holes between the first conductive layer and the inner circuit layer, a plurality of second through holes between the second conductive layer and the inner circuit layer. 1. A composite circuit board , comprising:an insulation layer;an inner circuit layer, a first conductive layer and a second conductive layer embedded in the insulation layer;a third conductive layer and a fourth conductive layer formed on opposite surfaces of the insulation layer;the third conductive layer electrically connecting with the first conductive layer, the fourth conductive layer electrically connecting with the second conductive layer;wherein, the inner circuit layer is in a middle portion of the insulation layer, the first conductive layer and the second conductive layer respectively located on opposite sides of the inner circuit layer, the insulation layer forms a plurality of first through holes between the first conductive layer and the inner circuit layer, a plurality of second through holes between the second conductive layer and the inner circuit layer, the first conductive layer extends toward the inner circuit layer through the plurality of first through holes to connect with the inner circuit layer, the second conductive layer extends toward the inner circuit layer through the plurality of second ...

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Номер записи: 48
28-02-2019 дата публикации

FABRIC HAVING MULTIPLE LAYERED CIRCUIT THEREON INTEGRATING WITH ELECTRONIC DEVICES

Номер: US20190069407A1
Автор: Chen Chien-Cheng, Chou Tzu-Wei, Rwei Syang-Peng, Sung Guo-Ming
Принадлежит: NATIONAL TAIPEI UNIVERSITY OF TECHNOLOGY

The present invention provides a fabric having a multiple layered circuit thereon integrating with electronic devices. The fabric comprises: a base layer; a plurality of conductive circuit layers; at least one connecting layer having electrically-conductive via-hole(s) and electrically-insulated area covering the area without the via-hole(s) and electrically connecting two conductive circuit layers through the via-hole(s) but electrically insulating the rest of the two conductive circuit layers; one or more than one electrical devices mounted to the conductive circuit layer and connected to circuits on the conductive circuit layer through anisotropic conductive film (ACF); and a water-proof layer disposed on the conductive circuit layer which is the farthest away from the base layer and covering the electrical device(s). 1. A fabric having a multiple layered circuit thereon integrating with an electronic device , comprising:a base layer;a plurality of conductive circuit layers, formed on the base layer;at least one connecting layer, comprising a plurality of via-holes made of a conductive material and a plurality of electrically insulated regions made of an insulating material and being positioned between any two adjacent conductive circuit layers of the plurality of conductive circuit layers wherein the via-holes electrically connect the two adjacent conductive circuit layers and the electrically insulated regions are distributed in areas other than the via-holes of the connecting layer;at least one electronic device, mounted on and electrically connected to a circuit of the conductive circuit layer through anisotropic conductive film; anda waterproof layer, formed on the conductive circuit layer be farthest away from the base layer;wherein the absolute value of the difference between the thermal expansion coefficient of the material constituting the conductive circuit layer and the thermal expansion coefficient of the insulating material constituting the ...

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Номер записи: 49
05-06-2014 дата публикации

METHOD AND APPARATUS TO PREWET WAFER SURFACE

Номер: US20140154405A1
Автор: Ma Yue, Wang David
Принадлежит: ACM Research (Shanghai) Inc.

The present invention improves the wetting between process solution and the wafer surface when they are put into contact by pre-implementing an adsorbed liquid layer on the entire front surface of the wafer just prior to the process. The pre-implementing adsorbed liquid layer is realized by transporting vaporized liquid molecules from vapor phase at elevated temperature (relative to wafer) and condensing them onto wafer surface. The pre-implementing adsorbed liquid is fully filled in the patterned structures formed on the wafer by multilayer absorption of the vaporized liquid molecules and the temperature of the wafer surface is above dew point of the vaporized liquid while condensing, which avoids generating bubbles inside the patterned structures. 1. A method for pre-wetting a wafer surface having patterned structures , comprising:vaporizing a liquid to form vaporized liquid molecules;delivering the vaporized liquid molecules to the environment near the wafer surface;displacing bulk air in the environment surrounding the wafer surface with the vaporized liquid molecules and transporting the vaporized liquid molecules onto the wafer surface and into the patterned structures;condensing the vaporized liquid molecules onto the wafer surface to form a pre-implementing adsorbed liquid layer on the wafer surface and in the patterned structures, wherein the pre-implementing adsorbed liquid fully fills the patterned structures by multilayer absorption of the vaporized liquid molecules and the temperature of the wafer surface is above a dew point of the vaporized liquid;contacting the wafer surface bearing the pre-implementing adsorbed liquid layer with a processing solution.2. The method of claim 1 , wherein the patterned structures have an opening width of less than 500 nm claim 1 , and a depth/width aspect ratio of greater than 5:1.3. The method of claim 1 , wherein the condensing step includes condensing the vaporized liquid molecules at a speed that is lower than the ...

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Номер записи: 50
17-03-2016 дата публикации

Mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillers

Номер: US20160079174A1
Автор: Houssam Jomaa, Omar Bchir, Ravi Nalla
Принадлежит: Individual

In some embodiments, an improved mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillers is presented. In this regard, a substrate build-up film is introduced having epoxy material and a plurality of epoxy microspheres, wherein an interior of the microspheres is not fully cured. Other embodiments are also disclosed and claimed.

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Номер записи: 51
24-03-2022 дата публикации

Systems and methods of fabricating smt mounting sockets

Номер: US20220095461A1
Автор: Aviram LANCOVICI, Daniel Sokol
Принадлежит: Nano Dimension Technologies Ltd

The disclosure relates to systems and methods for using additive manufacturing techniques for fabricating ball grid array (BGA) surface mounting pads (SMP), and surface mounted technology devices (SMT) package sockets. More specifically, the disclosure relates to additive manufacturing methods for additively manufactured electronic (AME) circuits such as a printed circuit board (PCB), and/or flexible printed circuit (FPC), and/or high-density interconnect printed circuit board (HDIPCB) each having integrated raised and/or sunk BGA SMP, and or surface mounting sockets for SMT device(s) defined therein, and methods of coupling surface mounted devices such as BGA and/or SMT thereto.

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Номер записи: 52
05-03-2020 дата публикации

TERMINAL, BOARD CONNECTOR, BOARD WITH CONNECTORAND TERMINAL PRODUCTION METHOD

Номер: US20200076147A1
Автор: Matsuda Hidekazu, Nakanishi Yuichi, Sakai Hiroto
Принадлежит:

It is aimed to provide a terminal capable of realizing a cost reduction while maintaining solder wettability. The terminal has a board connecting portion to be connected to a circuit board, and includes a base and a plating layer. The base has a plated surface covered by the plating layer and an exposed surface. The plating layer on the board connecting portion has a first inclined surface for covering a slope connecting the plated surface and the exposed surface. 1303110. A terminal () with a board connecting portion () to be connected to a circuit board () , comprising:{'b': '41', 'a base (); and'}{'b': 44', '44, 'a plating layer (A, B);'}wherein:{'b': 41', '42', '42', '44', '44', '43, 'the base () has a plated surface (A, B) covered by the plating layer (A, B) and an exposed surface (A); and'}{'b': 44', '44', '45', '1', '45', '1', '42', '1', '42', '1', '42', '42', '43', '31, 'the plating layer (A, B) has a first inclined surface (A, B) for covering a slope (A, B) connecting the plated surface (A, B) and the exposed surface (A) in the board connecting portion ().'}230. The terminal () of claim 1 , wherein:{'b': 31', '43', '43', '43, 'the board connecting portion () has a rising surface (B, C) rising at an angle from the exposed surface (A);'}{'b': 43', '43', '41, 'the rising surface (B, C) exposes the base (); and'}{'b': 44', '44', '45', '2', '45', '2', '45', '2', '45', '2', '42', '42', '43', '43, 'the plating layer (A, B) has a second inclined surface (A, B) for covering a slope (A, B) connecting the plated surface (A, B) and the rising surface (B, C).'}3304444. The terminal () of claim 1 , wherein the plating layer (A. B) contains Sn.4303435. The terminal () of claim 1 , comprising a nonlinear part ( claim 1 , ).53041. The terminal () of claim 1 , wherein a thickness of the base () is 0.05 mm or more and 0.80 mm or less.620. A board connector () claim 1 , comprising:{'b': '30', 'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'the terminal () of ; and'}{'b': 21 ...

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Номер записи: 53
22-03-2018 дата публикации

INTEGRATED ELECTRONIC COMPONENTS AND METHODS OF FORMATION THEREOF

Номер: US20180082923A1
Автор: Rollin Jean-Marc, Sherrer David W.
Принадлежит:

Provided are integrated electronic components which include a waveguide microstructure formed by a sequential build process and an electronic device, and methods of forming such integrated electronic components. The microstructures have particular applicability to devices for transmitting electromagnetic energy and other electronic signals. 18-. (canceled)9. A method of forming an integrated electronic component , comprising:providing an electronic device;disposing a plurality of layers over a substrate, wherein the layers comprise one or more of dielectric, conductive and sacrificial materials; andforming from the layers a microstructure comprising: a waveguide section comprising a plurality of waveguides, the waveguides each having a non-solid core volume within an outer conductor surrounding the core volume; and a transition structure coupling the waveguides to the electronic device.10. The method according to claim 9 , wherein the transition structure comprises a thermally conductive and electrically isolative material.11. The method according to claim 9 , wherein the waveguides each comprise a center conductor disposed in and surrounded by the outer conductor with the non-solid volume disposed between the center conductor and the outer conductor claim 9 , and wherein the transition structure comprises a post mechanically coupling the substrate to the center conductor.12. The method according to claim 11 , wherein the transition structure is disposed at an end of the center conductor.13. The method according to claim 11 , wherein the center conductor primarily comprises copper.14. The method according to claim 9 , wherein the transition structure comprises a dielectric.15. The method according to claim 9 , wherein the transition structure comprises silicon carbide.16. The method according to claim 9 , wherein the core volume comprises air.17. The method according to claim 9 , wherein the core volume comprises a vaporizing and condensing vapor.18. The method ...

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Номер записи: 54
31-03-2016 дата публикации

PRINTED BOARD WITH WIRING PATTERN FOR DETECTING DETERIORATION, AND MANUFACTURING METHOD OF THE SAME

Номер: US20160091557A1
Автор: OKOUCHI Yuichi, SAIDO Norihiro
Принадлежит:

A printed board with a wiring pattern for detecting deterioration includes an insulating substrate, a wiring pattern group that is formed on the insulating substrate and includes a wiring pattern for detecting deterioration; and a solder resist covering the wiring pattern group, in which the board has a thin film section, and a thick film section in which a thickness of the solder resist is larger than the thin film section, and the wiring pattern for detecting deterioration is formed in the thin film section whose entire surrounding area or partial surrounding area is surrounded by the thick film section. 1. A printed board with a wiring pattern for detecting deterioration , comprising: an insulating substrate; a wiring pattern group that is formed on the insulating substrate and includes a wiring pattern for detecting deterioration which detects a degree of deterioration of the printed board; and solder resist covering the wiring pattern group , wherein the printed board with a wiring pattern for detecting deterioration has:a thin film section in which a thickness of the solder resist from the insulating substrate surface is small; and a thick film section in which the thickness of the solder resist is larger than the thin film section, andthe wiring pattern for detecting deterioration is formed in the thin film section whose entire surrounding area or partial surrounding area is surrounded by the thick film section.2. The printed board with a wiring pattern for detecting deterioration according to claim 1 , whereinthe thickness of the solder resist in the thin film section is smaller than the thickness of the wiring pattern of the wiring pattern group.3. The printed board with a wiring pattern for detecting deterioration according to claim 1 , whereina width of the wiring pattern for detecting deterioration is narrower than a width of another wiring pattern in the wiring pattern group.4. The printed board with a wiring pattern for detecting deterioration ...

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Номер записи: 55
19-06-2014 дата публикации

BOARD PRINTING APPARATUS AND BOARD PRINTING METHOD

Номер: US20140170304A1
Автор: Fujimoto Takeshi
Принадлежит: YAMAHA HATSUDOKI KABUSHIKI KAISHA

A board printing apparatus includes a board working table, a first printing table, a second printing table, and a control portion controlling printing operations. The control portion is configured to perform second printing on a board held by the board working table by a large component mask of the second printing table after a first printing performed on the board held by the board working table by a small component mask of the first printing table. 1. A board printing apparatus comprising:a board working table holding a board to be printed on;a first printing table and a second printing table aligned in a prescribed direction in a horizontal direction above the board working table; anda control portion controlling printing operations of the first printing table and the second printing table,the first printing table holding a small component mask having a first thickness configured to perform first printing to print a viscous material on the board,the second printing table holding a large component mask having a second thickness thicker than the first thickness, formed with a relief portion having a depth larger than the first thickness on a board contact surface to relieve the viscous material printed by the small component mask, and configured to perform second printing to print the viscous material on the board after the first printing performed by the first printing table,the board working table and at least one of the first printing table and the second printing table are configured to be movable in the prescribed direction in the horizontal direction,the board working table and at least one of the first printing table and the second printing table being configured to be movable in a vertical direction, andthe control portion being configured to perform the second printing on the board held by the board working table by the large component mask of the second printing table after the first printing performed on the board held by the board working table by the ...

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Номер записи: 56
21-03-2019 дата публикации

MULTILAYER INTERCONNECTION SUBSTRATE FOR HIGH FREQUENCY AND MANUFACTURING METHOD THEREOF

Номер: US20190089044A1
Автор: FUTAMATA Yousuke, ISHIMOTO Atsushi, KOBUKE Hisashi, NINOMIYA Emi, SOTOMA Naoki
Принадлежит:

[Problem] To realize high reliability and high functionalization while suppressing characteristics variation in a multilayer interconnection substrate used in a microwave or millimeter-wave band integrated with an antenna. [Resolution Means] A multilayer substrate for high frequency with an antenna element formed on a surface. The multilayer substrate for high frequency has an intermediate substrate. The intermediate substrate consists of a low-temperature co-fired glass-ceramic substrate and has intermediate insulating layers consisting of a glass-ceramic and an internal conductor formed between these intermediate insulating layers. A surface insulating layer consisting of an organic material having a dielectric constant lower than a glass-ceramic material is stacked on a surface of the intermediate substrate. An outer-side via conductor penetrating this surface insulating layer is configured by a sintered metal that forms a metallic bond with a wiring conductor in the substrate. The outer-side via conductor is formed at the same time as sintering the glass-ceramic multilayer substrate. 1. A multilayer interconnection substrate for high frequency , comprising:an intermediate substrate where an internal conductor layer of a predetermined pattern is formed between intermediate insulating layers consisting of a glass-ceramic or on a surface of the intermediate insulating layer;an intermediate via conductor that penetrates the intermediate insulting layer and connects the internal conductor layers present in different interlayer positions to each other;a surface insulating layer consisting of an organic material integrally formed on at least one surface of the intermediate substrate; and the outer-side via conductor is comprised of a sintered metal integrally sintered with the internal conductor layer or the intermediate via conductor; and', 'a relative dielectric constant of the surface insulating layer is lower than a relative dielectric constant of the intermediate ...

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Номер записи: 57
21-03-2019 дата публикации

WIRING BOARD AND PLANAR TRANSFORMER

Номер: US20190090347A1
Автор: MORITA Masahito, SUZUKI Kenji
Принадлежит:

Disclosed is a wiring board having a plurality of insulating layers and at least one wiring layer each formed between adjacent two of the plurality of insulating layers such that, when a cross section of the wiring layer is taken in parallel to a thickness direction, at least one corner portion of the cross section of the wiring layer is rounded. 1. A wiring board , comprising:a plurality of insulating layers; andat least one wiring layer each located between adjacent two of the plurality of insulating layers,wherein, when a cross section of the at least one wiring layer is taken in parallel to a thickness direction, at least one corner portion of the cross section of the at least one wiring layer is rounded.2. The wiring board according to claim 1 ,wherein, in the cross section, a dimension of the rounded corner portion in the thickness direction is 30% or less of an average thickness of the at least one wiring layer.3. The wiring board according to claim 1 ,wherein all of corner portions of the cross section of the at least one 3 wiring layer are rounded.4. The wiring board according to claim 1 ,wherein the at least one wiring layer include a plurality of wiring layers, andwherein the plurality of insulating layers and the plurality of wiring layers are alternately laminated in the thickness direction.5. The wiring board according to claim 1 ,wherein each of the at least one wiring layer is not fixed to any of the plurality of insulating layers adjacent thereto.6. The wiring board according to claim 1 ,wherein the plurality of insulating layers contain a ceramic material as a main component.7. A planar transformer comprising the wiring board according to . The present invention relates to a wiring board and a planar transformer.There is known a method for manufacturing a multilayer wiring board in which a plurality of insulating layers and a plurality of wiring layers are alternately laminated together, including a process of forming the wiring layers by printing ...

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Номер записи: 58
21-03-2019 дата публикации

METHOD FOR PRODUCING RESIN MULTILAYER BOARD

Номер: US20190090361A1
Автор: WAKIYAMA Jun
Принадлежит:

A method for producing a resin multilayer board includes preparing a first resin layer including one or more conductor patterns that are disposed thereon and a conductor pattern including a first region that is to be connected to a conductor via; forming a paint layer by applying a paste including a LCP powder to a second region entirely covering the one or more conductor patterns; forming a cavity in the paint layer such that at least the first region is exposed, by performing laser processing; stacking a second resin layer including the conductor via on the first resin layer; and obtaining a resin multilayer board including a layer obtained by curing the paint layer, by applying pressure and heat to the multilayer body to perform thermal pressure-bonding. 1. A method for producing a resin multilayer board , comprising:preparing a first resin layer that includes a liquid crystal polymer as a main material, a main surface, and one or more conductor patterns disposed on the main surface, the one or more conductor patterns including a conductor pattern including a first region that is to be connected to a conductor via;forming a paint layer by applying a paste including a liquid crystal polymer powder to a second region entirely or substantially entirely covering the one or more conductor patterns on the main surface;forming a cavity in the paint layer such that at least the first region of the one or more conductor patterns is exposed, by performing laser processing on the paint layer;stacking a second resin layer including the conductor via, on the first resin layer after the cavity is formed, such that the conductor via overlaps the first region; andconnecting the conductor via and the conductor pattern in the first region and obtaining a resin multilayer board including a layer obtained by curing the paint layer, by applying pressure and heat to a multilayer body including a stack of the second resin layer stacked on the first resin layer to perform thermal ...

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Номер записи: 59
26-06-2014 дата публикации

Circuit board and method of manufacturing the same

Номер: US20140174809A1
Автор: Chang Bae Lee, Jae Kul Lee, Jin Gu Kim, Seung Wook Park
Принадлежит: Samsung Electro Mechanics Co Ltd

Disclosed herein is a circuit board including: a core layer including a via hole; a metal film covering an inner wall of the via hole; a circuit pattern connected to the metal film on the core layer; and a plug surrounded by the metal film in the via hole and having a thickness thinner than a thickness of the core layer.

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Номер записи: 60
01-04-2021 дата публикации

PHOTOSENSITIVE INSULATING PASTE AND ELECTRONIC COMPONENT

Номер: US20210096464A1
Автор: KONDO Kenta, TANABE Shimpei
Принадлежит: MURATA MANUFACTURING CO., LTD.

A photosensitive insulating paste according to preferred embodiments of the present disclosure contains glass frit, a first inorganic filler, a second inorganic filler, an alkali-soluble polymer, a photosensitive monomer, a photopolymerization initiator, and a solvent. The first inorganic filler has a refractive index of 1.7 or higher. The second inorganic filler has a refractive index of 1.55 or lower. An electronic component according to preferred embodiments of the present disclosure is produced by using the photosensitive insulating paste. 1. A photosensitive insulating paste comprising:glass frit;a first inorganic filler;a second inorganic filler;an alkali-soluble polymer;a photosensitive monomer;a photopolymerization initiator; anda solvent,wherein the first inorganic filler has a refractive index of 1.7 or higher, andthe second inorganic filler has a refractive index of 1.55 or lower.2. The photosensitive insulating paste according to claim 1 , whereinwhen an amount of the glass frit is denoted as A, an amount of the first inorganic filler is denoted as B, and an amount of the second inorganic filler is denoted as C, the following conditions are satisfied in the photosensitive insulating paste: A+B+C=100, B is from 5 vol % to 20 vol %, and C is from (25-B) vol % to (40-B) vol %.3. The photosensitive insulating paste according to claim 1 , whereinthe glass frit has a softening point of from 700° C. to 900° C., and the first inorganic filler and the second inorganic filler each have a melting point of 950° C. or higher.4. The photosensitive insulating paste according to claim 1 , whereinthe first inorganic filler is at least one selected from alumina, titania, zirconia, and ceria.5. The photosensitive insulating paste according to claim 1 , whereinthe second inorganic filler is at least one selected from quartz and crystallized glass.6. The photosensitive insulating paste according to claim 2 , whereinthe glass frit has a softening point of from 700° C. to 900° ...

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Номер записи: 61
16-04-2015 дата публикации

TEMPERATURE-RESISTANT, TRANSPARENT ELECTRICAL CONDUCTOR, METHOD FOR THE PRODUCTION THEREOF, AND USE THEREOF

Номер: US20150101849A1
Автор: Bockmeyer Matthias, HOFFMANN Ulf, Riethmueller Franziska
Принадлежит:

A transparent electrical conductor with a transparent substrate and an electrically conductive layer on the substrate are provided. The conductive layer has a plurality of electrically conductive nanoscale additives. The additives are in electrically conductive contact with one another, in order to form the electrically conductive layer. The substrate is formed from a glass or glass-ceramic material or a composite material having a glass and/or glass-ceramic. The additives are embedded in a matrix layer at least in some regions. The matrix layer is formed by a transparent matrix material. In order to make such a transparent electrical conductor useful, particularly for application in a display, as a touch sensor, or the like for cooking surfaces, the transparent electrical conductor exhibits a temperature resistance of at least 140° C. The additives are dispersed in a matrix material, which is applied as a coating material onto the substrate in one coating step. 1. A transparent electrical conductor , comprising:a transparent substrate formed from a material selected from the group consisting of glass, glass-ceramic, a composite material glass, a composite material having glass ceramic, and combinations thereof; andan electrically conductive layer on the transparent substrate, the electrically conductive layer having a plurality of electrically conductive, nanoscale additives, the additives being in electrically conductive contact with one another in order to form the electrically conductive layer, the additives being embedded in a matrix layer at least in some regions, the matrix layer being formed by a transparent matrix material, wherein the transparent electrical conductor has a temperature resistance of at least 140° C.2. The transparent electrical conductor according to claim 1 , wherein the electrically conductive layer has a scratch resistance of at least 500 g and/or a sheet resistance of less than 500 ohm/sq.3. The transparent electrical conductor ...

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Номер записи: 62
16-04-2015 дата публикации

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

Номер: US20150101857A1
Автор: CHO Yong Yoon, HAN Gi Ho, JEONG Sung Won, KIM Da Hee, Kim Ki Hwan, PARK Jung Hyun
Принадлежит: SAMSUNG ELECTRO-MECHANICS CO., LTD.

There is provided a method for manufacturing a printed circuit board including: preparing a substrate having a conductive layer formed on at least a portion thereof; forming an insulating layer formed with an opening through which a portion of the conductive layer is exposed on the substrate; forming a plating seed layer on the insulating layer and the exposed conductive layer; forming an electroplating layer on the plating seed layer by overplating the plating seed layer; and etching the overplated portion in a lump to form a circuit layer in the opening. 1. A method for manufacturing a printed circuit board , the method comprising:preparing a substrate having a conductive layer formed on at least a portion thereof;forming an insulating layer formed with an opening through which a portion of the conductive layer is exposed on the substrate;forming a plating seed layer on the insulating layer and the exposed conductive layer;forming an electroplating layer on the plating seed layer by overplating the plating seed layer; andetching the overplated portion in a lump to form a circuit layer in the opening.2. The method of claim 1 , wherein the forming of the electroplating layer includes overplating the plating seed layer until an exposed surface of the electroplating layer is planarized.3. The method of claim 1 , wherein the etching of the overplated portion in a lump includes etching the overplated portion in a lump until the insulating layer is exposed.4. The method of claim 1 , wherein the etching of the overplated portion in a lump includes etching the overplated portion in a lump so that the electroplating layer and the plating seed layer of 1 μm or less remains outside the insulating layer and the electroplating layer and the plating seed layer of 1 μm or less which are formed outside the insulating layer serve as the plating seed layer for forming additional circuit layer.5. The method of claim 1 , wherein the forming of the plating seed layer includes forming ...

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Номер записи: 63
19-03-2020 дата публикации

MANUFACTURING APPARATUS FOR PERFORMING ADDITIVE MANUFACTURING OF AN ELECTRICAL DEVICE

Номер: US20200093000A1
Автор: Fujita Masatoshi, Hashimoto Yoshitaka, Kawajiri Akihiro, Suzuki Masato, Tsukada Kenji
Принадлежит: FUJI CORPORATION

A manufacturing apparatus that includes a conveyance device that moves a stage, where an electronic device shaped by multiple layers is placed, in X-axis and Y-axis directions. A first shaping unit, a second shaping unit, and a component mounting unit are arranged within a range in which the stage can move. The manufacturing apparatus performs additive manufacturing of the electronic device on the stage by performing a sequential movement of the stage to respective working positions of different units. As a result, in this manufacturing apparatus, a workpiece on the stage does not have to be removed and repositioned during each work process such as shaping by a first shaping unit, shaping by a second shaping unit, and electronic component mounting by a component mounting unit. 1. A manufacturing apparatus comprising:a stage including a placing surface where a three-dimensional article is placed;a conveyor configured to move the stage in a first direction and a second direction, the first direction and the second direction being directions parallel to the placing surface and different from each other;a three-dimensional manufacturing device that is disposed within a range in which the stage can be moved and is configured to form each layer of multiple layers of the three-dimensional article;a component mounting device that is disposed within the range in which the stage can be moved and is configured to mount an electronic component on a layered workpiece formed by the three-dimensional manufacturing device, the component mounting device including a component supply configured to hold a plurality of electronic components and a mounting device configured to pick up the electronic component from the component supply and place the electronic component on the layered workpiece; andcircuitry configured to sequentially move the stage from a working position of one of the three-dimensional manufacturing device or the component mounting device to a working position of the ...

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Номер записи: 64
16-04-2015 дата публикации

Method Of Manufacturing Multilayer Interconnects For Printed Electronic Systems

Номер: US20150104562A1
Автор: Chen Ray T., Subbaraman Harish
Принадлежит: OMEGA OPTICS, INC.

A fully additive method for forming multilayer electrical interconnects for printed electronic and/or optoelectronic devices is disclosed. Electrical interconnects are fabricated by directly ink-jet printing a dielectric material with selective interconnection holes, and then ink jet printing conductive patterns and filling the interconnection holes with conductive material to form multilayer interconnects. A method for manufacturing a multilayer printed electronic system utilizing the invention is also disclosed. Other embodiments are described and claimed. 1. A method for manufacturing multilayer electrical interconnects comprising:ink jet printing a first dielectric layer on a substrate, wherein the substrate comprises one or more electronic or optoelectronic devices and one or more alignment marks;ink jet printing a first interconnection layer on the first dielectric layer;ink-jet printing a second dielectric layer on the first interconnection layer; andink jet printing a second interconnection layer on the second dielectric layer.2. The method of claim 1 , wherein ink jet printing the first dielectric layer comprises:determining the position of the alignment marks on the substrate;depositing a first liquid dielectric material on the substrate to form one or more vias through the first liquid dielectric material, wherein the one or more vias through the first liquid dielectric material allow access to the one or more electronic or optoelectronic devices; andcuring the first liquid dielectric material, wherein curing the first liquid dielectric material comprises irradiating the first liquid dielectric material with UV, heating the first liquid dielectric material, exposing the first liquid dielectric material to high power, short light pulses, and/or air drying the first liquid dielectric material.3. The method of claim 1 , wherein ink jet printing the first interconnection layer comprises:determining the position of the alignment marks on the substrate; ...

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Номер записи: 65
14-04-2016 дата публикации

TRANSPARENT CONDUCTIVE FILM, METHOD FOR MAKING THE SAME, AND TOUCH-SENSITIVE SCREEN USING THE SAME

Номер: US20160103532A1
Автор: CHEN CHIU-CHI, JAW TEN-HSING, WU CHIN-YANG
Принадлежит:

A transparent conductive film includes a transparent substrate. A support layer is formed on one surface of the substrate. A surface of the support layer away from the substrate defines grooves formed in a mesh pattern. The grooves include a first groove portion and a second groove portion communicating with the first groove portion. A depth of the first groove portion is less than that of the second groove portion. An ink layer is formed at a bottom of the first groove portion and the second groove portion. A conductive layer is formed on the ink layer and in a mesh pattern. A top of the conductive layer formed in the first groove portion protrudes out of the first groove portion, and the conductive layer formed in the second groove portion is totally received in the second groove portion. 1. A transparent conductive film comprising:a transparent substrate;a support layer formed on at least one surface of the substrate, a surface of the support layer away from the substrate defining a plurality of grooves formed in a mesh pattern, the grooves including a first groove portion and a second groove portion communicating with the first groove portion, a depth of the first groove portion being less than that of the second groove portion;an ink layer formed at a bottom of the first groove portion and a bottom of the second groove portion; anda conductive layer formed on the ink layer and in a mesh pattern, a top of the conductive layer formed in the first groove portion protruding out of the first groove portion, and the conductive layer formed in the second groove portion being totally received in the second groove portion.2. The transparent conductive film of claim 1 , wherein the first groove portion is defined adjacent to a peripheral edge of the support layer claim 1 , and the second groove portion is surrounded by the first groove portion.3. The transparent conductive film of claim 1 , wherein a difference between the depth of the first groove portion and the depth ...

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Номер записи: 66
28-03-2019 дата публикации

DOUBLE-SIDED AND MULTILAYERED PRINTED CIRCUIT BOARD FABRICATION USING INKJET PRINTING

Номер: US20190098771A1
Автор: Elimelech Hila, Fima Sharon
Принадлежит: Nano Dimension Technologies, LTD.

The disclosure relates to methods, kits and compositions for direct printing of double-sided and/or multilayered printed circuit boards. Specifically, the disclosure relates to the printing of conductive leads and insulating portions of printed circuit boards using inkjet printing. 1. An inkjet printing method for forming a double-sided printed circuit board (PCB) comprising:a. providing a peelable substrate; i. a first print head having: at least one aperture, a first ink reservoir, and a first pump configured to supply the first inkjet ink through the aperture;', 'ii. a second print head having: at least one aperture, a second ink reservoir, and a second pump configured to supply the second inkjet ink through the aperture; and', 'iii. a conveyor, operably coupled to the first print head and to the second print head, configured to convey the peelable substrate to the first and second print head;, 'b. providing an ink jet printing system comprisingc. providing a first inkjet conductive ink composition;d. using the first inkjet ink, forming a first circuit pattern on the removable substrate;curing the first circuit pattern; providing a second inkjet ink composition configured to form a reinforced thermoset, insulating board;e. using the second inkjet ink, forming an insulating portion on the removable substrate on all exposed areas of the removable substrate not occupied by the first circuit pattern;curing the second inkjet ink; andf. removing the peelable substrate, wherein the first circuit pattern and the thermoset reinforced board form a substantially planar surface.2. An inkjet printing method for forming a single sided printed circuit board (PCB) comprising:a. providing a peelable substrate; i. a first print head having: at least one aperture, a first ink reservoir, and a first pump configured to supply the first inkjet ink through the aperture;', 'ii. a second print head having: at least one aperture, a second ink reservoir, and a second pump configured to ...

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Номер записи: 67
03-07-2014 дата публикации

Ultrathin buried die module and method of manufacturing thereof

Номер: US20140183750A1
Автор: Elizabeth Ann Burke, Paul Alan McConnelee, Scott Smith
Принадлежит: General Electric Co

A method of forming a buried die module includes providing an initial laminate flex layer and forming a die opening through the initial laminate flex layer. A first uncut laminate flex layer is secured to the first surface of the initial laminate flex layer by way of an adhesive material and a die is positioned within the die opening of the initial laminate flex layer and onto the adhesive material. A second uncut laminate flex layer is secured to the second surface of the initial laminate flex layer by way of an adhesive material and the adhesive materials are then cured. Vias and metal interconnects are formed in and on the first and second uncut laminate flex layers, with each of the metal interconnects extending through a respective via and being directly metalized to a metal interconnect on the initial laminate flex layer or a die pad on the die.

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Номер записи: 68
03-07-2014 дата публикации

NICKEL-GOLD PLATEABLE THICK FILM SILVER PASTE, AND PLATING PROCESS FOR LOW TEMPERATURE CO FIRED CERAMIC DEVICES AND LTCC DEVICES MADE THEREFROM

Номер: US20140186521A1
Автор: NAIR KUMARAN MANIKANTAN, Skurski Michael A., Voultos John D.
Принадлежит: E I DU PONT DE NEMOURS AND COMPANY

Described are LTCC devices, with external silver containing electrical contacts, that are sequentially plated with a nickel containing metal and a gold containing metal. 1. A method for nickel-gold plating on a fired LTCC structure having a printed silver composition to reduce pad lift of the printed silver composition from the LTCC structure comprising the sequential steps of:a. activation of the printed silver composition;b. electroless plating nickel onto the activated printed silver composition;c. providing a catalyst layer of immersion gold; andd. electroless plating of a gold layer onto the immersion gold layer, wherein the plating conditions of (i) pH, (ii) temperature and (iii) thickness of the nickel and immersion gold layer are complimentary to the LTCC structure and printed silver composition.2. The method of claim 1 , wherein the plating bath conditions of pH are in the range of 4-12.3. The method of wherein the plating thickness of nickel of 100-300 micro-inches claim 2 , preferably 100-150 micro-inches and a plating thickness of electro-less gold over nickel of thickness of 20-100 micro-inches preferably 20-60 micro-inches.4. The method of claim 3 , wherein the temperature of the electroless plating is 77-90° C.5. The method of claim 4 , wherein the silver paste composition consisting essentially of claim 4 , based on weight percent claim 4 , 75-90% silver powder of different sizes and shapes claim 4 , optionally 0.5-4% high refractory glasses and the balance organic medium.6. The method of claim 5 , wherein the glass is a alumino-borosilicate glass as “network formers” with Zn claim 5 , Ba claim 5 , Mg claim 5 , Sr claim 5 , Sn claim 5 , Ti. Na ions are as “net-work modifying cations”.7. The method of claim 6 , wherein the glass comprises 20.2% SiO; 2.8% AlO; 20.4 BO; 10.1 ZnO; 19.0% BaO; 3.1% MgO; 3.3% NaO; 13.7% SrO; 5.5% TiO; and 1.9% SnO. This is a continuation application which claims priority under 35 U.S.C. 120 to U.S. application Ser. No. 12/ ...

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Номер записи: 69
21-04-2016 дата публикации

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

Номер: US20160113111A1
Автор: Fan Jui-Yun, Huang Howard, Lu Hui-Lin, Wu Zheng-Wei
Принадлежит:

A circuit board includes a circuit board plate, a conductive ring, a solder mask and at least one insulating pad. The circuit board plate includes a surface and a conductive through hole passing through the surface and the circuit board plate, wherein the conductive through hole have a conductive layer disposed on a wall thereof. The conductive ring on the surface surrounds an opening of the conductive through hole on the surface and electrically connects to the conductive layer. The solder mask is disposed on the surface. The conductive ring is exposed outside of the solder mask. The insulating pad has a thickness. The first surface of the insulating pad is adapted to contact the solder mask or the surface and sited at periphery of the conductive ring. The second surface of the insulating pad is adapted for spacing a distance between a solder coating tool and the solder mask. 1. A circuit board , comprising:a circuit board plate comprising a surface and a conductive through hole passing through the surface and the circuit board plate, wherein the conductive through hole have a conductive layer disposed on a wall thereof;a conductive ring disposed on the surface, wherein the conductive ring surrounds an opening of the conductive through hole located on the surface and electrically connects to the conductive layer;a solder mask disposed on the surface, wherein the conductive ring is exposed outside of the solder mask; andat least one insulating pad comprising a first surface and a second surface opposite to each other and having a thickness, wherein the first surface is adapted to contact the solder mask or the surface of the circuit board plate and sited at periphery of the conductive ring, the second surface is adapted to contact a solder coating tool when the solder coating tool is covered on the circuit board thereby spacing a distance between the solder coating tool and the solder mask, wherein the at least one insulating pad is a closed ring, the conductive ...

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Номер записи: 70
30-04-2015 дата публикации

THERMAL MANAGEMENT CIRCUIT MATERIALS, METHOD OF MANUFACTURE THEREOF, AND ARTICLES FORMED THEREFROM

Номер: US20150118391A1
Автор: Kilhenny Brett W.
Принадлежит:

A thermal management circuit material comprises a thermally conductive metallic core substrate, metal oxide dielectric layers on both sides of the metallic core substrate, electrically conductive metal layers on the metal oxide metal oxide dielectric layers, and at least one through-hole via filled with an electrically conductive metal-containing core element connecting at least a portion of each of the electrically conductive metal layers, wherein the containing walls of the through-hole via are covered by a metal oxide dielectric layer connecting at least a portion of the metal oxide dielectric layers on opposite sides of the metallic core substrate. Also disclosed are methods of making such circuit materials, comprising forming metal oxide dielectric layers by oxidative conversion of a surface portion of the metallic core substrate. Articles having a heat-generating electronic device such as an HBLED mounted in the circuit material are also disclosed. 1. A thermal management circuit material , capable of use for mounting an electronic device , comprising:a thermally conductive metallic core substrate;a first metal oxide dielectric layer on a first side of the metallic core substrate;a second metal oxide dielectric substrate layer on a second side of the thermally conductive metallic core substrate, which second side is opposite from the first side of the metallic core substrate;a first electrically conductive metal layer on the first oxide metal oxide dielectric layer;a second electrically conductive metal layer on the second metal oxide dielectric layer;at least one through-hole via filled with an electrically conductive metal forming a metal-containing core element that electrically connects at least a portion of each of the first and second electrically conductive metal layers, wherein the walls defining the through-hole via have an intermediate metal oxide dielectric layer transversely joining the first metal oxide dielectric layer and the second metal oxide ...

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Номер записи: 71
11-04-2019 дата публикации

Component Carrier Having a Three Dimensionally Printed Wiring Structure

Номер: US20190110367A1
Автор: Gavagnin Marco, Leitgeb Markus, Lutschounig Ferdinand, Silvano de Sousa Jonathan
Принадлежит:

A component carrier and a method for manufacturing a component carrier is described wherein the component carrier includes a carrier body with a plurality of electrically conductive layer structures and/or electrically insulating layer structures and a wiring structure on and/or in the layer structures where the wiring structure is at least partially formed as a three-dimensionally printed structure. 1. A component carrier , wherein the component carrier comprises:a carrier body comprising at least one of a plurality of electrically conductive layer structures and electrically insulating layer structures; anda wiring structure on and/or in the layer structures and being at least partially formed as a three-dimensionally printed structure.2. The component carrier according to claim 1 , further comprising:a component mounted on and/or embedded in the carrier body.3. The component carrier according to claim 2 , wherein the wiring structure is configured to form an electronic and/or thermal connection with the electronic component.4. The component carrier according to claim 1 , wherein the wiring structure comprises at least one protrusion for forming an electrical and/or thermal contact claim 1 , wherein the wiring structure is at least partially surrounded by an encapsulation claim 1 , wherein the protrusion extends through the encapsulation for forming an electrical contact.5. The component carrier according to claim 1 , comprising at least one of the following features:wherein a cross section of the wiring structure perpendicular to a current propagation direction has a shape of at least one of the group comprising a rectangular shape, a fractal shape, a circular shape, an oval shape and an trapezoid shape,wherein the wiring structure formed extends along a stacking direction of the plurality of layer structures,wherein the wiring structure extends perpendicular with respect to a stacking direction of the plurality of layer structures.6. The component carrier ...

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Номер записи: 72
26-04-2018 дата публикации

PRINTING OF MULTI-LAYER CIRCUITS

Номер: US20180114703A1
Автор: DAREN Steve, KARNI Yiftah
Принадлежит:

A sheet-fed system designed to print multilayer PCBs is introduced. The system consists of four main blocks; a drilling station, a patterning station, a stacking/bonding station, and a sintering zone. The substrate PCB is shuttled between these various stations, to have vias drilled, to be attached to stacks of previously-processed layers, to be covered with conductive paths by means of the aforementioned ink, and to have the ink sintered under a controlled temperature and atmosphere. Patterning is accomplished by means of a novel two-step method involving both high-temperature conductive elements, low-temperature conductive elements, and flux. Two such compositions are successively applied and individually sintered to form a single conductive path; the second application serves to fill the porosities of the first layer. By this method, a highly-conductive trace is obtained without requiring high temperatures, which in turn allows use of common substrates including polymers. 110-. (canceled)11. A method for deposition and patterning of highly conductive ink on insulating PCB materials comprises the steps of:a. providing a single PCB insulating layer at a predetermined position;b. drilling a set of holes of predetermined positions and diameters in said PCB insulating layer; depositing a first ink composition composed of a mixture of a high melting point metallic powder, a low melting point metallic powder, and a flux paste, and', 'sintering said first ink composition;, 'c. forming a first trace layer onto said PCB insulating layer; wherein said forming the first trace layer comprises the steps of'} depositing a second ink composition, composed of a mixture of a low melting point metallic powder and a flux, and', 'sintering said second ink composition;, 'd. forming a second trace layer onto said first trace layer; wherein said forming the second trace layer comprises the steps of'}e. repeating steps a-d on each single PCB insulating layer.12. The method of further ...

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Номер записи: 73
27-04-2017 дата публикации

PRINTED WIRING BOARD AND METHOD FOR PRODUCING PRINTED WIRING BOARD

Номер: US20170118837A1
Автор: KIYA Satoshi, MIURA Kousuke, UEHARA Sumito
Принадлежит:

An object of the present invention is to provide a printed wiring board in which conductive layers formed on two surfaces of a base layer that contains a fluororesin as a main component are reliably connected to each other through a via-hole. A printed wiring board according to an embodiment of the present invention includes a base layer containing a fluororesin as a main component, a first conductive layer stacked on one surface of the base layer, a second conductive layer stacked on the other surface of the base layer, and a via-hole that is formed along a connection hole penetrating the base layer and at least one of the first conductive layer and the second conductive layer in a thickness direction and that electrically connects the first conductive layer and the second conductive layer to each other. At least a part of an inner circumferential surface of the base layer in the connection hole has a pre-treated surface having a content ratio of oxygen atoms or nitrogen atoms of 0.2 atomic percent or more. 1. A printed wiring board comprising:a base layer containing a fluororesin as a main component; a first conductive layer stacked on one surface of the base layer; a second conductive layer stacked on the other surface of the base layer; anda via-hole that is formed along a connection hole penetrating the base layer and at least one of the first conductive layer and the second conductive layer in a thickness direction and that electrically connects the first conductive layer and the second conductive layer to each other,wherein at least a part of an inner circumferential surface of the base layer in the connection hole has a pre-treated surface having a content ratio of oxygen atoms or nitrogen atoms of 0.2 atomic percent or more.2. The printed wiring board according to claim 1 , further comprising a modified layer having a hydrophilic organic functional group in at least a region of the inner circumferential surface of the base layer in the connection hole claim ...

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Номер записи: 74
09-06-2022 дата публикации

METHOD OF MANUFACTURING PRINTED WIRING BOARD

Номер: US20220183158A1
Автор: HOSOKAWA Makoto, IIDA Hiroto, MIZOGUCHI Misato, SHIMIZU Yoshinori, TAKANASHI Akitoshi
Принадлежит: Mitsui Mining & Smelting Co., Ltd.

There is provided a method for manufacturing a printed wiring board that effectively suppresses pattern failure and is also excellent in fine circuit forming properties. This method includes: providing an insulating substrate including a roughened surface; performing electroless plating on the roughened surface of the insulating substrate to form an electroless plating layer less than 1.0 μm thick having a surface having an arithmetic mean waviness Wa of 0.10 μm or more and 0.25 μm or less and a valley portion void volume Vvv of 0.010 μm/μmor more and 0.028 μm/μmor less; laminating a photoresist on the surface of the electroless plating layer; performing exposure and development to form a resist pattern; applying electroplating to the electroless plating layer; stripping the resist pattern; and etching away an unnecessary portion of the electroless plating layer to form a wiring pattern. 1. A method for manufacturing a printed wiring board , comprising:(a) providing an insulating substrate comprising a roughened surface;{'sup': 3', '2', '3', '2, '(b) performing electroless plating on the roughened surface of the insulating substrate to form an electroless plating layer less than 1.0 μm thick having a surface having an arithmetic mean waviness Wa of 0.10 μm or more and 0.25 μm or less as measured in accordance with JIS B0601-2001 and a valley portion void volume Vvv of 0.010 μm/μmor more and 0.028 μm/μmor less as measured in accordance with ISO 25178;'}(c) laminating a photoresist on the surface of the electroless plating layer;(d) performing exposure and development on the photoresist to form a resist pattern;(e) applying electroplating to the electroless plating layer via the resist pattern;(f) stripping the resist pattern; and(g) etching away an unnecessary portion of the electroless plating layer exposed by stripping of the resist pattern, to form a wiring pattern.2. The method according to claim 1 , wherein the (a) comprises:{'b': '1', 'sup': 3', '2', '3', '2, ...

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Номер записи: 75
18-04-2019 дата публикации

FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

Номер: US20190116674A1
Автор: HU XIAN-QIN, LI CHENG-JIA
Принадлежит:

A method for manufacturing a flexible printed circuit board includes having a base layer, and creating a pattern line and at least one conductive pole. The base layer defines at least one communication hole penetrating through the base layer. The pattern line includes two conductive circuit layers formed on opposite surfaces of the base layer. The at least one conductive pole is formed in the at least one communication hole and electrically connects the two conductive circuit layers. A diameter of each conductive pole is less than a diameter of a communication hole. 1. A method for making a flexible printed circuit board comprising:providing a substrate, the substrate comprising a base layer and a first copper foil layer and a second copper foil layer both formed on opposite surfaces of the base layer;defining at least one connecting hole in the substrate, each connecting hole penetrating the first copper foil layer and the base layer;forming a conductive pattern layer on the substrate through plating with copper, the conductive pattern layer comprising a conductive pole filled in the connecting hole and a pattern line formed on a surface of the first copper foil layer away from the base layer and a surface of the second copper foil layer away from the base layer, the conductive poles electrically connecting the first copper foil layer and a second copper foil layer, a diameter of the conductive pole is smaller than a diameter of the connecting hole; andperforming a etching treatment on the substrate to remove regions where the first copper foil layer and a second copper foil layer are not covered with the conductive pattern layer to make the first copper foil layer and the second copper foil layer are respectively formed into a first conductive pattern layer and a second conductive pattern layer.2. The method of claim 1 , wherein the step of forming the conductive pattern layer comprises:pressing a first photosensitive film and a second photosensitive film on the ...

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Номер записи: 76
09-04-2020 дата публикации

FLEXIBLE PRINTED CIRCUIT BOARD

Номер: US20200113064A1
Автор: HU XIAN-QIN, LI CHENG-JIA
Принадлежит:

A flexible printed circuit board includes a base layer and a pattern line. At least one communication hole penetrating opposite surfaces of the base layer. The pattern line includes two conductive circuit layers formed on the opposite surfaces of the base layer. At least one conductive pole are formed in the at least one communication hole and electrically connects the two conductive circuit layers. A gap being is formed between the conductive pole and the base layer. 1. A flexible printed circuit board comprising:a base layer defining at least one communication hole penetrating opposite surfaces of the base layer;a pattern line comprising two conductive circuit layers formed on the opposite surfaces of the base layer; andat least one conductive pole formed in the at least one communication hole and electrically connecting the two conductive circuit layers, a gap being formed between the conductive pole and the base layer.2. The flexible printed circuit board of claim 1 , further comprising:an outer pattern line;a adhesive layer covering a side of the pattern line and the base layer on the same side that is not covered by the pattern line, the adhesive layer defining at least one through hole penetrating the adhesive layer to expose the pattern line;wherein the outer pattern line comprises an outer conductive layer formed on a surface of the adhesive layer away from the base layer, and the conductive post formed in the through hole and electrically connected to the outer conductive layer to the pattern line, a diameter of the conductive post is less than a diameter of the through hole.3. The flexible printed circuit board of claim 1 , further comprising:an outer pattern line;two adhesive layers, each adhesive layer covering one side of the pattern line and the base layer on the same side that is not covered by the pattern line, at least one adhesive layers defining at least one through hole penetrating the adhesive layer to expose the pattern line;wherein the outer ...

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Номер записи: 77
14-05-2015 дата публикации

CIRCUIT SUBSTRATE AND METHOD FOR MAKING THE SAME

Номер: US20150129288A1
Автор: CHEN Mei-Chun, CHOU Yu-Jen, LIAO Pen-Yi, TANG Fu-Pin, Wu Tsung-Han
Принадлежит: TAIWAN GREEN POINT ENTERPRISES CO., LTD.

A circuit substrate includes: a substrate; an insulating coating layered structure formed on the substrate, having top and bottom surfaces, and formed with a patterned recess that is indented inwardly from the top surface, that is disposed above the bottom surface, and that is defined by a recess-defining wall, the recess-defining wall having a bottom wall portion and a surrounding wall portion that extends upwardly from a periphery of the bottom wall portion; and a patterned metallic layered structure including an electroless plating metal layer formed on the bottom wall portion of the recess-defining wall. 1. A circuit substrate comprising:a substrate;an insulating coating layered structure formed on said substrate, having top and bottom surfaces, and formed with a patterned recess that is indented inwardly from said top surface, that is disposed above said bottom surface, and that is defined by a recess-defining wall, said recess-defining wall having a bottom wall portion and a surrounding wall portion that extends upwardly from a periphery of said bottom wall portion; anda patterned metallic layered structure including an electroless plating metal layer formed on said bottom wall portion of said recess-defining wall.2. The circuit substrate of claim 1 , wherein said bottom wall portion is roughened by laser or plasma ablation so as to enhance the bonding between said electroless plating metal layer and said bottom wall portion.3. The circuit substrate of claim 1 , wherein said electroless plating metal layer is disposed within said patterned recess and is spaced apart from said surrounding wall portion of said recess-defining wall by a spacing.4. The circuit substrate of claim 1 , wherein said electroless plating metal layer contains an active metal selected from the group consisting of palladium claim 1 , rhodium claim 1 , platinum claim 1 , iridium claim 1 , osmium claim 1 , gold claim 1 , nickel claim 1 , iron claim 1 , and combinations thereof.5. The circuit ...

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Номер записи: 78
25-04-2019 дата публикации

PRINTED WIRING BOARD

Номер: US20190124768A1
Автор: Adachi Takema, Makino Toshihide, Noguchi Hidetoshi
Принадлежит: IBIDEN CO., LTD.

A printed wiring board includes a core substrate and first and second build-up layers. The substrate includes a core layer, through-hole conductors formed in through holes such that each through hole has first opening tapering from first toward second surface of the core layer, and second opening tapering from second toward first surface of the core layer, and first and second through-hole lands directly connected to the through-hole conductors. Each build-up layer includes an insulating layer, via conductors, via lands, an outermost insulating layer, an outermost conductor layer, and outermost via conductors. Each of the through-hole lands, via lands and outermost conductor layers includes a metal foil, a seed layer and an electrolytic plating film. The foils have mat surfaces such that the mat surfaces of the via lands has ten-point average roughness smaller than ten-point average roughness of the mat surfaces of the through-hole lands and outermost conductor layers. 1. A printed wiring board , comprising:a core substrate;a first build-up layer formed on a first surface side of the core substrate; anda second build-up layer formed on a second surface side of the core substrate on an opposite side with respect to the first surface side,{'b': 1', '1', '2', '1', '2', '2', '1', '2', '1', '2, 'wherein the core substrate includes a core layer having a plurality of through holes, a plurality of through-hole conductors formed in the plurality of through holes respectively such that each of the through holes has a first opening tapering from a first surface of the core layer toward a second surface of the core layer on an opposite side with respect to the first surface, and a second opening tapering from the second surface of the core layer toward the first surface of the core layer, a plurality of first through-hole lands formed on the first surface of the core layer such that the first through-hole lands are directly connected to the through-hole conductors respectively, ...

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Номер записи: 79
16-04-2020 дата публикации

Circuit board, circuit module, method of manufacturing circuit board, and method of manufacturing circuit module

Номер: US20200120806A1
Автор: Takafumi Kusuyama
Принадлежит: Murata Manufacturing Co Ltd

A circuit board includes a board body, a first electrode, and a second electrode. The board body contains a resin material. The first electrode is disposed on a first main surface of the board body and includes a first electrode base and a first coating film that covers at least a part of an outer surface of the first electrode base. The second electrode is disposed on the first main surface of the board body and includes a pillar-shaped structure that includes a second electrode base, a first plating film that is disposed on the second electrode base, and a first plating structure having a first end directly connected to the first plating film, and a second coating film that covers at least a part of an outer surface of the pillar-shaped structure.

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Номер записи: 80
16-04-2020 дата публикации

Additive manufactured 3d electronic substrate

Номер: US20200120813A1
Автор: Lweness Mazari, Man To, Mark Kostinovsky, Steven O. Dunford, Suriyakan Kleitz
Принадлежит: Schlumberger Technology Corp

A method of forming electronic substrates and assemblies is provided. The method includes depositing a material. The material is deposited as a powder or slurry. The method includes sintering the material, and retrieving an article, including a solid electronic substrate. Also provided are electronic substrates formed by additive manufacturing, and methods of deploying the same.

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Номер записи: 81
10-05-2018 дата публикации

ELECTRONIC COMPONENT PACKAGE FOR ELECTROMAGNETIC INTERFERENCE SHIELDING AND METHOD FOR MANUFACTURING THE SAME

Номер: US20180132390A1
Автор: Hwang Jeong Woo, Jeong Se Young, JOO Ki Su, Lee Ju Young, YOON Jin Ho
Принадлежит:

Provided is an electronic component package for electromagnetic interference shielding. The electronic component package for electromagnetic interference shielding according to an embodiment of the present invention comprises a substrate where electronic components are mounted, a molding member formed on the substrate and the electronic components, a magnetic layer formed on the molding member, and a conductive layer formed on the magnetic layer. Electromagnetic waves generated from the electronic components embeded in the molding member are absorbed in the magnetic layer to thus prevent or reduce harmful influence on other electronic components mounted in adjacent places. In addition, harmful electromagnetic waves generated from the outside may be shielded due to the conductive layer formed on the magnetic layer, thereby protecting electronic components embeded in the molding member from being influenced by the electromagnetic waves. 1. An electronic component package for electromagnetic interference shielding comprising:a substrate where electronic components are mounted;a molding member formed on the substrate and the electronic components;a magnetic layer formed on the molding member;a conductive layer formed on the magnetic layer; anda ground electrode formed at a side of the substrate and configured to be embedded in the substrate, the ground electrode having a surface exposed at a side of the substrate, wherein the conductive layer contacts the ground electrode,wherein the conductive layer comprises a second binder resin and conductive particles and the conductive particles include at least one selected from the group consisting of silver, copper, aluminum and an aluminum alloy, and a carbon-based material, andwherein the second binder resin has a molecular weight of 1,500 to 15,000 to make a contact between the ground electrode and the conductive layer during forming the conductive layer with a spraying process.2. The electronic component package of claim 1 ...

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Номер записи: 82
11-05-2017 дата публикации

Multilayer additive printed circuit

Номер: US20170135215A1
Автор: Bashir I. Morshed
Принадлежит: UNIVERSITY OF MEMPHIS RESEARCH FOUNDATION

A multilayer printed circuit as well as printed passive and active electronic components using additive printing technology is provided. The fabrication process includes a substrate and a first conductive layer that is printed with conductive ink on the substrate. An insulation layer that has uniform thickness is printed on the first conductive layer and the substrate, less via cavities, test point cavities, and a surface mount component contact point and mounting cavities. The insulation layer is replaceable with resistive layer or semi-conductive layer to fabricate electronic components. The vias are printed with conductive ink inside of the via cavities. Additionally, a second conductive layer is printed on the vias and over the insulation layer. The insulation, resistive, or semi-conducting layer, the vias, and the conductive layers are repeatedly printed in sequence to thus form the multilayer printed circuit.

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Номер записи: 83
07-08-2014 дата публикации

CONDUCTIVE FILM, MANUFACTURING METHOD THEREOF, AND TOUCH SCREEN INCLUDING THE CONDUCTING FILM

Номер: US20140218637A1
Автор: Cui Zheng, GAO YULONG, Sun Chao
Принадлежит: NANCHANG O-FILM TECH. CO., LTD.

A conductive film includes a substrate, a first conductive layer, a matrix layer, and a second conductive layer. The substrate includes a first surface and an oppositely arranged second surface. The first conductive layer is embedded in the substrate. The matrix layer is set on the first surface of the substrate. The matrix layer is formed by solidified jelly coating. The second conductive layer embedded in the matrix layer. The second conductive layer is insulated from the first conductive layer. Due to the capacitor formed between the first conductive layer and the second conductive layer, it just needs to attach the conductive film to a glass panel when the conductive film is adopted to manufacture a touch screen, without bonding two pieces of conductive films. In addition, the matrix layer, formed by solidifying the jelly painted on the substrate, is with a much smaller thickness than the substrate. Therefore, the touch screen using the conductive film has a smaller thickness. In addition, a method of manufacturing the conductive film and a touch screen including the conductive film are also provided by the present disclosure. 1. A conductive film , comprising:a substrate comprising a first surface and a second surface opposite to the first surface;a first conductive layer embedded in the substrate, a thickness of the first conductive layer being smaller than that of the substrate;a matrix layer disposed on a first surface of the substrate, the matrix layer being made of a solidified jelly coating, a thickness of the matrix layer being smaller than the thickness of the substrate; anda second conductive layer embedded in the matrix layer, a thickness of the second conductive layer being smaller than that of the matrix layer, the second conductive layer being insulated from the first conductive layer.2. The conductive film of claim 1 , wherein first grooves are defined in the first surface claim 1 , second grooves are defined in a side of the matrix layer away ...

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Номер записи: 84
01-09-2022 дата публикации

GLASS CORE MULTILAYER WIRING BOARD AND METHOD OF PRODUCING THE SAME

Номер: US20220279651A1
Автор: Maniwa Susumu, SAWADAISHI Masashi
Принадлежит: TOPPAN INC.

A glass core multilayer wiring board includes a glass substrate, a through electrode, a first layer structure, and a second layer structure. A through hole has a diameter decreasing from a first surface toward a second surface. The through electrode is along a side wall of the through hole. The first layer structure is on the first surface and the second layer structure is on the second surface. The second layer structure closes an opening in the second surface defining a bottom section. The through electrode has: a first layer on part of the side wall and on part or all of the bottom section of the through hole closing the opening of the through hole, a second layer covering the first layer, the side wall of the through hole exposed, and the bottom section, and a third layer is located on the second layer. 1. A glass core multilayer wiring board , comprising:a glass substrate including a first surface, a second surface facing away from the first surface, and a through hole having a diameter which decreases from the first surface toward the second surface;a through electrode located along a side wall of the through hole; anda first layer structure formed on the first surface of the glass substrate and a second layer structure formed on the second surface of the glass substrate, whereinthe second layer structure is formed to close an opening of the through hole in the second surface to define a bottom section of the through hole, and wherein a first layer of the three layers being located on part of the side wall of the through hole closer to the first surface and on part or all of the bottom section of the through hole in the second surface closing the opening of the through hole in the second surface,', 'a second layer of the three layers being located to cover the first layer, the side wall of the through hole exposed from the first layer, and the bottom section of the through hole in the second surface, and', 'a third layer of the three layers being located on ...

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Номер записи: 85
23-04-2020 дата публикации

METHOD FOR MANUFACTURING MULTI-LAYER CIRCUIT BOARD CAPABLE OF BEING APPLIED WITH ELECTRICAL TESTING

Номер: US20200128662A1
Автор: Chang Chin-Hsi, CHANG SHUO-HSUN, Liu Chin-Kuan, Lu Yu-Te, Wang Chao-Lung
Принадлежит:

A manufacturing method for a multi-layer circuit board capable of being applied with electrical testing is provided. According to the multi-layer circuit board manufactured by the method, the multi-layer circuit structure is disposed on the delivery loading plate through the bottom-layer circuit structure, the delivery loading plate exposes the conductive corrosion-barrier layer, and the top-layer circuit of the multi-layer circuit structure is electrically connected to the conductive corrosion-barrier layer through the bottom-layer circuit and the electrical connection layer. Therefore, before the multi-layer circuit board is delivered to the assembly company or before the multi-layer circuit board is packaged with chips, an electrical testing can be applied to the multi-layer circuit board to check if the multi-layer circuit board can be operated normally or not. 1. A manufacturing method for a multi-layer circuit board capable of being applied with electrical testing , the method comprising:providing a first loading plate, wherein the first loading plate comprises a substrate, a conductive layer, and a metal interface layer, the conductive layer and the metal interface layer are sequentially overlapping on the substrate, a bottom surface of the metal interface layer is detachably connected to the conductive layer, and the metal interface layer is conductive;forming a second loading plate overlapping on the metal interface layer by electroplating the first loading plate, wherein the second loading plate has a first surface and a second surface opposite to the first surface, the second surface is connected to a top surface of the metal interface layer;forming a corrosion-blocking layer on the first surface of the second loading plate by electroplating the second loading plate, wherein the corrosion-blocking layer is conductive;forming a multi-layer circuit structure on the corrosion-blocking layer, wherein the multi-layer circuit structure comprises a top-layer ...

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Номер записи: 86
03-06-2021 дата публикации

Backplane and method for producing same

Номер: US20210168962A1
Автор: Joachim Seidl
Принадлежит: SIEMENS AG

A backplane is for electrically connecting electrical components and a method is for producing a backplane. The backplane includes a base board, conducting tracks arranged on and/or in the base board, and at least one actuator unit arranged on or in the base board.

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Номер записи: 87
17-05-2018 дата публикации

MANUFACTURING METHOD OF CIRCUIT BOARD

Номер: US20180139854A1
Автор: Chen Yu-Ming, Wu Yi-Der
Принадлежит: WINBOND ELECTRONICS CORP.

A manufacturing method of a circuit board includes: performing a first printing process to form a first insulating layer having a first circuit depressed pattern; performing a second printing process to form a first circuit layer in the first circuit depressed pattern; checking whether a real position of the first circuit layer is diverged from a predetermined position; determining whether the shift level of the position of the first circuit layer is more than a predetermined level; performing the first printing process to form the second insulating layer, wherein when the shift level is more than the predetermined level and the thickness of a second insulating layer to be formed on the first insulating layer is not greater than a tolerance thickness, the second insulating layer has a hole at least partially overlapping the real position; and performing the second printing process to form a conductive plug in the hole. 1. A manufacturing method of a circuit board , comprising:performing a first printing process to form a first insulating layer having a first circuit depressed pattern;performing a second printing process to form a first circuit layer in the first circuit depressed pattern;checking whether a real position of the first circuit layer is diverged from a predetermined position of the first circuit layer, and when the real position of the first circuit layer is diverged from the predetermined position of the first circuit layer, determining whether a shift level of the real position diverged from the predetermined position is more than a predetermined level;performing the first printing process to form a second insulating layer on the first insulating layer, wherein when the shift level is more than the predetermined level, and a thickness of a second insulating layer to be formed on the first insulating layer is not greater than a tolerance thickness, the second insulating layer has a hole at least partially overlapping the real position; andperforming ...

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Номер записи: 88
09-05-2019 дата публикации

Component Carrier With Two Component Carrier Portions and a Component Being Embedded in a Blind Opening of One of the Component Carrier Portions

Номер: US20190141836A1
Автор: Gavagnin Marco, Kasper Alexander, Leitgeb Markus, Schulz Gernot
Принадлежит:

A component carrier with a) a first component carrier portion having a blind opening; b) a component arranged in the blind opening; and c) a second component carrier portion at least partially filling the blind opening. At least one of the first component carrier portion and the second component carrier portion includes a flexible component carrier material, and the first component carrier portion and the second component carrier portion form a stack of a plurality of electrically insulating layer structures and/or electrically conductive layer structures. It is further described a method for manufacturing such a component carrier. 1. A component carrier , comprising:a first component carrier portion having a blind opening;a component arranged in the blind opening; anda second component carrier portion at least partially filling the blind opening;wherein at least one of the first component carrier portion and the second component carrier portion comprises a flexible component carrier material, and the first component carrier portion and the second component carrier portion form a stack of a plurality of electrically insulating layer structures and/or electrically conductive layer structures.2. The component carrier of claim 1 , wherein the first component carrier portion comprises a lower electrically conductive layer structure.3. The component carrier as set forth in claim 1 , wherein the second component carrier portion comprises a gap filling material covering a sidewall of the blind opening claim 1 , wherein the gap filling material is arranged between the sidewall and the component.4. The component carrier as set forth in claim 1 , wherein the second component carrier portion comprises a base layer covering a bottom of the blind opening claim 1 , wherein the component is mounted on the base layer.5. The component carrier as set forth in claim 4 , wherein the base layer comprises at least one contact opening for connecting the component from the bottom.6. The ...

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Номер записи: 89
30-04-2020 дата публикации

METHOD OF MANUFACTURING CIRCUIT BOARD

Номер: US20200137894A1
Автор: GAO LIN-JIE, HO MING-JAAN, HSU HSIAO-TING, SHEN FU-YUN
Принадлежит:

A method for manufacturing a circuit board comprises steps of providing a single-sided board comprising a first insulating base, a copper layer, and at least one first conductive structure; providing a laminated board comprising a metal layer, a third insulating base, a metal shielding layer, and a second insulating base; forming a wiring layer by the metal layer comprising at least one signal wire and at least one connecting pad; defining at least one second through hole each passing through the second insulating base, the metal shielding layer, and the third insulating base; forming a second conductive structure in each second through hole; providing a double-sided board comprising a wiring layer, a fourth insulating base, a first copper foil; and at least one third conductive structure; pressing the single-sided board, at least one middle structure, and the double-sided board in that sequence to form the circuit board. 1. A method for manufacturing a circuit board comprising:providing a single-sided board comprising a first insulating base, a copper layer covering a surface of the first insulating base, at least one first through hole each passing through the first insulating base to expose the copper layer, and at least one first conductive structure each infilled in one of the at least one first through hole; providing a laminated board comprising a metal layer, a third insulating base, a metal shielding layer, and a second insulating base arranged in that sequence;', 'forming a wiring layer by the metal layer, the wiring layer comprising at least one signal wire and at least one connecting pad;', 'defining at least one second through hole each passing through the second insulating base, the metal shielding layer, and the third insulating base to expose one of the at least one connecting pad; and', 'forming a second conductive structure infilled in each of the at least one second through hole;, 'forming at least one middle structure, each of the middle ...

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Номер записи: 90
10-06-2021 дата публикации

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

Номер: US20210176866A1
Автор: AWAZU Masashi, Kojima Keisuke
Принадлежит: IBIDEN CO., LTD.

A printed wiring board includes a resin insulating layer, via conductors formed in the resin insulating layer, metal posts formed on the via conductors, respectively, and a solder resist layer formed on the resin insulating layer such that the metal posts have lower portions embedded in the solder resist layer and upper portions exposed from the solder resist layer, respectively. The metal posts are formed such that each of the metal posts has a top portion having a diameter in a range of 0.8 to 0.9 times a diameter of a respective one of the lower portions of the metal posts. 1. A printed wiring board , comprising:a resin insulating layer;a plurality of via conductors formed in the resin insulating layer;a plurality of metal posts formed on the plurality of via conductors, respectively; anda solder resist layer formed on the resin insulating layer such that the plurality of metal posts has a plurality of lower portions embedded in the solder resist layer and a plurality of upper portions exposed from the solder resist layer,wherein the plurality of metal posts is formed such that each of the metal posts has a top portion having a diameter in a range of 0.8 to 0.9 times a diameter of a respective one of the lower portions of the metal posts.2. The printed wiring board according to claim 1 , further comprising:a surface treatment layer formed on an exposed portion of each of the metal posts exposed from the solder resist layer.3. The printed wiring board according to claim 2 , wherein the surface treatment layer comprises a Ni/Pd/Au layer.4. The printed wiring board according to claim 2 , wherein the surface treatment layer is formed on each of the metal posts such that a height of a surface of the surface treatment layer on a respective one of the metal posts is in a range of 4 μm to 11 μm relative to the solder resist layer.5. The printed wiring board according to claim 1 , wherein the plurality of metal posts is formed such that each of the lower portions of the ...

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Номер записи: 91
04-06-2015 дата публикации

Printed circuit board and manufacturing method thereof

Номер: US20150156891A1
Автор: Joo Hwan JUNG, Ki Jung SUNG, Myung Sam Kang, Seung Yeop KOOK, Young Kwan Lee
Принадлежит: Samsung Electro Mechanics Co Ltd

Disclosed herein are a printed circuit board and a manufacturing method thereof capable of improving poor inter-layer conduction by increasing inter-layer insulating property and rigidity. The manufacturing method of a printed circuit board includes: laminating a copper foil layer on upper and lower surfaces of an insulating layer; coating an insulating material on a surface of the copper foil layer; forming a circuit layer by etching the copper foil layer; laminating an insulator on the copper foil layer so as to enclose the insulating material and the circuit layer; forming a via in the insulator so as to be communicated with the circuit layer; and forming a circuit pattern on the insulator.

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Номер записи: 92
04-06-2015 дата публикации

PRODUCING METHOD OF SUSPENSION BOARD WITH CIRCUIT

Номер: US20150156892A1
Автор: KANAGAWA Hitoki, TANABE Hiroyuki
Принадлежит: NITTO DENKO CORPORATION

A method for producing a suspension board with circuit includes the steps of () removing a first electroless plating layer corresponding to a first terminal and/or a second electroless plating layer corresponding to a second terminal by etching, () removing a metal supporting board in contact with the lower surface of a first conductive layer filling the inside of a first opening portion, and () providing an electrolytic plating layer on the surface of the first terminal with the first electroless plating layer removed and/or the surface of the second terminal with the second electroless plating layer removed and the lower surface of the first conductive layer exposed from the inside of the first opening portion by electrolytic plating supplying electricity from the metal supporting board. 1. A method for producing a suspension board with circuit comprising the steps of:(1) providing a first insulating layer on a metal supporting board so as to provide a first opening portion and a second opening portion penetrating in a thickness direction of the first insulating layer,(2) providing a first conductive layer including a first terminal on the first insulating layer so as to fill the inside of the first opening portion,(3) providing a first electroless plating layer on the surface of the first conductive layer by electroless plating,(4) providing a second insulating layer on the first insulating layer so as to provide a third opening portion penetrating in the thickness direction of the second insulating layer and exposing the first electroless plating layer and also forming the third opening portion so as to expose a part of the first electroless plating layer provided on the surface of the first conductive layer,(5) providing a second conductive layer including a second terminal on the second insulating layer so as to fill the inside of the third opening portion or on the second insulating layer and the first insulating layer so as to fill the second opening portion ...

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Номер записи: 93
02-06-2016 дата публикации

STRETCHABLE PRINTED ELECTRONIC SHEETS TO ELECTRICALLY CONNECT UNEVEN TWO DIMENSIONAL AND THREE DIMENSIONAL SURFACES

Номер: US20160157363A1
Автор: Kurwa Murad, Liu Weifeng, Mohammed Anwar
Принадлежит: Flextronics AP, LLC

A method and apparatus for forming a conductor on an uneven two-dimensional (2-D) or three-dimensional (3-D) surface is described. An amount of conductive material needed to form a conductor between two points on a surface of an object is determined. The determined amount of conductive material is deposited on a substrate. The substrate with the deposited conductive material is applied to the object to form a conductor between the two points on the surface of the object. The conductive material and substrate may be stretchable. The conductive material may be deposited by an inkjet printer or an embedded 3-D printer. The substrate with the deposited conductive material may be applied to the object by laminating the substrate with the deposited conductive material to the object. 1. A method for forming a conductor on an uneven two-dimensional (2-D) or three-dimensional (3-D) surface , the method comprising:determining an amount of conductive material to form a conductor between two points on a surface of an object;depositing the determined amount of conductive material on a substrate; andapplying the substrate with the deposited conductive material to the object to form a conductor between the two points on the surface of the object.2. The method of claim 1 , wherein the conductive material is a stretchable conductive material.3. The method of claim 1 , wherein the substrate is a stretchable substrate.4. The method of claim 1 , wherein the conductive material is deposited on the substrate by an inkjet printer that prints conductive material onto the surface of the substrate.5. The method of claim 1 , wherein the conductive material is deposited on the substrate by an embedded three-dimensional (3-D) printer that deposits conductive material into a reservoir within the substrate.6. The method of claim 1 , wherein the conductive material is deposited in a horseshoe pattern on the substrate.7. The method of claim 1 , wherein the substrate with the deposited conductive ...

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Номер записи: 94
01-06-2017 дата публикации

RIGID-FLEX CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

Номер: US20170156205A1
Автор: Huang Chiu-Pei, Hung Pei-Hao, Lee Yuan-Chih, Liu Yi-Chun
Принадлежит: UNIFLEX Technology Inc.

A rigid-flex circuit board includes a flexible circuit board, a plurality of patterned photo-imageable substrates and a plurality of patterned circuit layers. The flexible circuit board includes a plurality of exposed regions, a top surface and a bottom surface opposite to the top surface. The exposed regions are respectively located at the top surface and the bottom surface. The patterned photo-imageable substrates are disposed on the top surface and the bottom surface respectively. Each patterned photo-imageable substrate includes an opening exposing the corresponding exposed region. Each patterned photo-imageable substrate includes photo-sensitive material. The patterned circuit layers are disposed on the patterned photo-imageable substrates respectively and expose the exposed regions. A manufacturing method of the rigid-flex circuit board is also provided. 1. A rigid-flex circuit board , comprising:a flexible circuit board comprising a plurality of exposed regions, a top surface and a bottom surface opposite to the top surface, wherein the exposed regions are respectively located at the top surface and the bottom surface;a plurality of patterned photo-imageable substrates disposed on the top surface and the bottom surface of the flexible circuit board respectively, wherein each of the patterned photo-imageable substrates comprises an opening, the openings expose the exposed regions respectively, and material of each of the patterned photo-imageable substrates comprises photo-sensitive material; anda plurality of patterned circuit layers disposed on the patterned photo-imageable substrates respectively and exposed the exposed regions.2. The rigid-flex circuit board as claimed in claim 1 , wherein the flexible circuit board comprises a flexible substrate and a patterned metal layer claim 1 , and the patterned metal layer is disposed on two opposite surfaces of the flexible substrate.3. The rigid-flex circuit board as claimed in claim 2 , wherein the flexible ...

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Номер записи: 95
07-06-2018 дата публикации

A Circuit Board and Component Fabrication Apparatus

Номер: US20180154573A1
Автор: Miles Anthony
Принадлежит: DST Innovations Limited

A circuit board and component fabrication apparatus comprises a print head configured to deposit one or more materials on a substrate so as to print electronic circuit boards and/or components. 1. A circuit board and component fabrication apparatus , comprising:a print head configured to deposit one or more materials on a substrate so as to print electronic circuit boards and/or components.2. The apparatus of claim 1 , wherein the print head comprises:an X, Y drive system for driving the print head relative to the substrate; anda dispenser for dispensing the one or more materials.3. The apparatus of claim 2 , wherein the dispenser comprises at least:a pressure cylinder;a pressure control unit and drive;a pressure extension arm; anda pressure extension arm stop and empty sensor.4. The apparatus of claim 1 , wherein the print head further comprises a curing energy source to cure the material deposited on the substrate.5. The apparatus of claim 4 , wherein the print head comprises at least one additional curing energy source.6. The apparatus of claim 4 , wherein the at least one energy source comprises one or more of an infra-red claim 4 , ultra violet or other frequency light emitting diode claim 4 , a directed heating element claim 4 , a radio frequency sonic directed frequency or a high energy broad spectrum curing system.7. The apparatus of claim 1 , wherein the print head comprises at least one material dispensing nozzle.8. The apparatus of claim 7 , wherein the print head further comprises at least one additional material dispensing nozzle.9. The apparatus of claim 8 , wherein the material dispensing nozzles are each positioned so as to dispense material at or near the same location claim 8 , so as to allow materials from different ones of the material dispensing nozzles to be combined at a point of dispensing.10. The apparatus of claim 7 , wherein the height of at least one of the material dispensing nozzles is adjustable.11. The apparatus of claim 7 , wherein ...

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Номер записи: 96
11-06-2015 дата публикации

COATING DEVICE AND COATING METHOD

Номер: US20150163926A1
Автор: Huang Tang-Chieh
Принадлежит: Microcosm Technology Co., Ltd.

The disclosure provides a coating device and a coating method. The coating device is used for coating viscous ink on a substrate to form a film. The substrate includes two opposite mounting surfaces. The coating device comprising: an accommodating mechanism, a coating mechanism and a forming mechanism. The coating mechanism includes two coating units. Each coating unit includes a rotatable filling roller for filling with pressure the viscous ink in the hole on the corresponding mounting surface to form an initial layer. The forming mechanism is used for scraping the initial layer covering on the mounting surfaces to form the film. The method of coating and then adjusting the thickness of the film may improve the quality of the products. By using the above disclosure, the production line can be simplified to lower the device costs, and the manufacturing time can be reduced to improve the manufacturing efficiency. 1. A coating device for coating viscous ink on a substrate to form a film , the substrate conveyed along a plummet direction , the substrate comprising two opposite mounting surfaces and a plurality of holes , the mounting surfaces being opposite and uneven , the holes separately formed on the mounting surfaces , the coating device comprising:an accommodating mechanism, for accommodating the viscous ink and comprising a channel for providing the substrate to pass through;a coating mechanism, disposed above the accommodating mechanism, and for coating the viscous ink on the substrate passing through the channel, the coating mechanism comprising two coating units, the two coating units separately disposed on two opposite sides of the substrate, wherein the coating units separately transfer the viscous ink in the accommodating mechanism onto the mounting surfaces, each coating unit comprises a rotatable filling roller for filling with pressure the viscous ink in the hole on the corresponding mounting surface to form an initial layer; anda forming mechanism, ...

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Номер записи: 97
28-08-2014 дата публикации

METHOD OF MANUFACTURING A RESISTIVE TOUCH SENSOR CIRCUIT BY FLEXOGRAPHIC PRINTING

Номер: US20140242294A1
Автор: Derichs Kevin J., Killion Reed, Petcavich Robert J., Ramakrishnan Ed S., Van Ostrand Daniel K.
Принадлежит: UNIPIXEL DISPLAYS, INC.

Method of manufacturing a resistive touch sensor circuit using a roll to roll process to print microscopic patterns on a single side of at least one flexible dielectric substrate using a plurality of flexo-masters to print the microscopic patterns which are then plated to form conductive microscopic patterns. 1. A method for manufacturing a resistive touch sensor circuit comprising: printing, by a flexographic printing process using a first master plate and a first ink, a first pattern on a first side of the first substrate;', 'curing the substrate;', 'depositing, by an electroless plating process, a first conductive material on the first side of the first substrate;', 'printing, by the flexographic printing process using a second master plate and a second ink, a first plurality of spacer microstructures; and', 'subsequently curing the substrate;, 'creating a first circuit component, wherein creating the first circuit component comprises printing, by the flexographic printing process using a third master plate and a third ink, a second pattern on a first side of the second substrate;', 'curing the substrate;', 'depositing, by the electroless plating process, a second conductive material on the first side of the second substrate;', 'printing, by the flexographic printing process using a fourth master plate and a fourth ink, a second plurality of spacer microstructures; and', 'subsequently curing the substrate., 'creating a second circuit component comprising2. The method of claim 1 , further comprising applying a first layer of an adhesive on the first substrate around the first pattern.3. The method of claim 2 , wherein a layer thickness of the adhesive is at least 500 nanometers.4. The method of claim 1 , wherein the first ink and the second ink are different.5. The method of claim 1 , further comprising assembling the first and the second components claim 1 , wherein assembling the circuit further comprises aligning the first and the second substrates claim 1 , ...

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Номер записи: 98
09-06-2016 дата публикации

METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD AND FLEXIBLE PRINTED CIRCUIT BOARD MANUFACTURED THEREBY

Номер: US20160165721A1
Автор: Jang Hyun-Soo, Kim Jae-Sic, KIM Yong-Il, Kwon O-Chung, Yu Jeong-Sang
Принадлежит:

A method for manufacturing a flexible printed circuit board includes preliminarily thermally deforming s substrate through heating, forming a circuit pattern with a conductive paste on the preliminarily thermally deformed substrate, and firing the circuit pattern. A flexible printed circuit board includes a substrate, and a circuit pattern formed by firing a conductive paste on a first surface of the substrate. The substrate is preliminarily thermally deformed and, thus, a shrinkage variation thereof before and after firing the conductive paste is zero. Dimensional stability when firing the circuit pattern printed with the conductive paste can be ensured, deterioration of adhesion between the circuit pattern and the substrate attributable to film deformation upon firing can be prevented, and stable adhesion of the circuit pattern can be maintained even after firing. 1. A method for manufacturing a flexible printed circuit board , comprising:preliminarily thermally deforming a substrate through heating;forming a circuit pattern with a conductive paste on the preliminarily thermally deformed substrate; andfiring the circuit pattern.2. The method of claim 1 , wherein the substrate is a polyimide (PI) film or a PET film.3. The method of claim 1 , wherein the conductive paste is a silver paste comprising a silver powder claim 1 , a polymer resin claim 1 , and a solvent.4. The method of claim 1 , wherein firing the circuit pattern is performed at 200 to 450° C.5. The method of claim 1 , wherein preliminarily thermally deforming is performed by heating the substrate to a temperature higher than or equal to a temperature at which the circuit pattern is fired.6. The method of claim 1 , further comprising baking the preliminarily thermally deformed substrate through heating to remove water therefrom after preliminarily thermally deforming the substrate through heating and before forming the circuit pattern.7. The method of claim 1 , further comprising forming a protective ...

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Номер записи: 99
07-06-2018 дата публикации

Surface Treated Copper Foil, Copper Foil With Carrier, Laminate, Method for Manufacturing Printed Wiring Board, and Method for Manufacturing Electronic Device

Номер: US20180160546A1
Автор: Arai Hideta, Fukuchi Ryo, Miki Atsushi, Ori Yuki
Принадлежит:

Disclosed is a surface treated copper foil in which the dropping of the roughening particles from the roughening treatment layer provided on the surface of the copper foil is favorably suppressed. 1. A surface treated copper foil , comprisinga copper foil, anda roughening treatment layer on at least one surface of the copper foil, whereina height of roughening particles of the roughening treatment layer is 5 to 1000 nm from the surface of the copper foil,a color difference ΔE*ab according to JIS Z 8730 of a surface of a side of the roughening treatment layer is 65 or less, anda glossiness of a TD of the surface of the side of the roughening treatment layer is 70% or less.2. The surface treated copper foil according to claim 1 , wherein the height of the roughening particles of the roughening treatment layer is 20 nm or more from the surface of the copper foil.3. The surface treated copper foil according to claim 1 , wherein the height of the roughening particles of the roughening treatment layer is 150 nm or more from the surface of the copper foil.4. The surface treated copper foil according to claim 1 , wherein the height of the roughening particles of the roughening treatment layer is 650 nm or less from the surface of the copper foil.5. The surface treated copper foil according to claim 1 , wherein the height of the roughening particles of the roughening treatment layer is 150 nm or less from the surface of the copper foil.6. The surface treated copper foil according to claim 1 , wherein a thickness of the roughening particles of the roughening treatment layer is 5 to 500 nm.7. The surface treated copper foil according to claim 1 , wherein the thickness of the roughening particles of the roughening treatment layer is 10 nm or more.8. The surface treated copper foil according to claim 1 , wherein the thickness of the roughening particles of the roughening treatment layer is 250 nm or less.9. The surface treated copper foil according to claim 1 , wherein the ...

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Номер записи: 100