Корпус модуля вычислительного устройства

Полезная модель относится к области вычислительных устройств.Заявленный корпус модуля вычислительного устройства содержит боковые грани, нижнюю и верхнюю, а также внутреннюю полость, при этом внутренняя полость образована посредством взаимного сцепления модулей 1-3, имеющих скругленные по внешней стороне углы и соединенных между собой с помощью расположенных на соприкасающихся внутренних поверхностях разъемов - интерфейсов, таким образом, что модули по боковым поверхностям прилегают друг к другу заподлицо, образуя единый блок, при этом модуль выполнен с возможностью автонастройки, а на внешней его стороне обеспечена возможность расположения USB разъемов, элементов управления и органов отображения информации.Технический результат заключается в обеспечении точности позиционирования и установки модулей, а также в обеспечении повышенной электрической безопасности путем исключения доступа пользователя к контактам групп электропитания и информационным контактам, как плотным прилеганием модулей ...

ПАНЕЛЬ РЕЛЕ УПРАВЛЕНИЯ ДЛЯ ЖЕЛЕЗНОДОРОЖНОГО ВАГОНА

Funktionskomponentenoberteil für ein Komponentenaufbausystem

Die vorliegende Erfindung betrifft ein Funktionskomponentenoberteil (500) zum Aufsetzen auf ein Funktionskomponentenunterteil (401) einer Funktionskomponente (400), mit einer ersten Schnittstelle zum elektrischen Verbinden des Funktionskomponentenunterteils (401) der Funktionskomponente (400); und einer zweiten Schnittstelle zum elektrischen Verbinden eines Gehäuseoberteils (403) der Funktionskomponente (400).

MOUNTING PIN FOR FIXING AN ELECTRONIC COMPONENT ONTO A PRINTED-CIRCUIT BOARD, AND SUPPORT MEANS UTILIZING SUCH A PIN

Electronic device including substrate accommodating structure and detection apparatus including substrate accommodating structure

PARALLEL POWER CONNECTIONS FOR AN INTEGRATED CIRCUIT COMPONENT

SYSTEM FOR BLOOD SUGAR REGULATION

HERMETICALLY SEALED HIGH FREQUENCY FRONT END

The invention relates to a hermetically sealed RF front end (for example a transmitting/receiving module) of a multilayered structure comprising electronic components (3, 4), wherein the multilayered structure contains a number of substrates (1, 2) which are stacked one above the other and carry the components (3, 4), wherein grooves (7) are formed in the substrates (1, 2), and between the substrates (1, 2) there are sealing elements (5, 8), which engage in the grooves (7), and the substrates (1, 2) are soldered to one another.

POWER INVERTER DOCKING SYSTEM FOR PHOTOVOLTAIC MODULES

An electronics module docking system includes docking member removably coupled to a photovoltaic module. The docking system includes a first connector port electrically coupled to one or more photovoltaic cells of the photovoltaic module. The photovoltaic module is selectively coupleable to the docking member. The docking system includes a housing to enclose an electronics module. The housing may include second connector port that is selectively engageable to the power electronics module. The power electronics module and the photovoltaic cells are electrically coupled to one another upon selective engagement of the connector ports. The inverter housing is receivable by and removably coupleable to the docking member allowing the inverter housing to be removably coupleable to the photovoltaic module.

PROCESS FOR RESTORING A PLUG-IN UNIT FOR ELECTRONIC MAPS, AND CABINET SO RESTORED

La présente invention porte sur un procédé de réhabilitation d'une armoire (100A) pour tiroirs (7) pour cartes électroniques, caractérisé en ce qu'il comporte les étapes consistant à: - créer un tiroir électronique débrochable (13) ayant une connectique de raccordement (14) sur sa face arrière, - adapter sur l'armoire à réhabiliter (100A) un support mécanique intermédiaire (9) supportant un ensemble de connecteurs flottants (10) de fond de tiroir électronique débrochable (13), - créer une zone libre Z entre lesdits supports arrières (3) des connecteurs (4) de fond d'armoire (100A) et lesdits supports intermédiaires (9), adapter entre lesdits supports arrière (3) et lesdits supports intermédiaires (9) un câblage (11).

Schwingkreisanordnung mit Induktivitäten und in steckbaren Elementen angeordneten Kapazitäten

Dreidimensional aufgebaute Schaltungsanordnung

Elektrische Schaltungsgruppe mit einem Rahmenteil und wenigstens einem Isolierblock

Elektrische Geräte tragende Halterung

STECKTAFEL FUER ELEKTRONISCHE STEUER- UND REGELANLAGEN.

Ensemble comprenant plusieurs unités de circuit électrique enfichées dans un bâti de connexion de ces unités

HOUSING PLUG-IN FOR THE REPLACEABLE ADMISSION OF AN INTEGRATED CIRCUIT COMPONENT.

Contact socket for detachable connection of IC to PCB

The contact socket has an array of contact pins mounted in a grid of bores, the pins projecting from the bores on the side facing the PCB to which they are surface mounted. The free end of each bore is intended for guiding the dome shaped terminal contacts on IC. Between the end of a contact pin and a terminal contact there is a space bridged by a spring to establish electrical contact. The IC is attached to the socket by screw retainers around the periphery and no axially acting frictional forces have to be overcome for establishing contact. The holding down device can also be formed as a rectangular pressure spring with a fastening screw at each corner. The spring force can be adjusted depending on how far the fastening screws are tightened.

Socket for electric parts

A socket for electric parts which is dawn sized. The socket of the present invention comprises a socket body to accommodate an electric part, plural contact pins disposed to a peripheral edge of the socket body, a latch rotatably located on the socket body so as to positioned above the contact pins, which presses an upper part of the electric part when the latch is closed and is in a state the IC socket can be accommodated and taken out when the latch is opened, an operating member which is vertically movably disposed in the socket body and comprises an operating portion for closing constituted so as to press upward an operation portion to be operated for closing formed to both side end portion of the latch and rotate the latch in an closing direction when the operating member moves upward.

CHASSIS FOR SUPPORTING REMOVABEL CIRCUIT COMPONENTS OF TEMPORARY ELECTRIC OR ELECTRONIC CIRCUITS

System of safety bolts combined with a lock

Clamp

According to the invention, there is provided a clamping test contacting setup, suitable for clamping a component so that the component is held in a fixed position while being processed, the clamp comprising, a first finger which is pivotally mounted at a first pivot point and the second finger which is pivotally mounted at a second pivot point, so that the first finger and a second finger can each pivot towards a central plane; wherein the first finger and a second finger each comprise a surface suitable for cooperating with a component to be clamped, wherein the first finger and a second finger each comprise a stop means which is suitable for cooperating with a component to be clamped to restrict movement of the component with respect to the respective finger, so that applying a force to the component will cause the first and second fingers to clamp the component. There is further provided a processing station which comprises such a clamp and a corresponding method of clamping a component ...

HIGH FREQUENCY INDUCTOR FILTER APPARATUS AND METHOD OF USE THEREOF

The invention comprises a high frequency inductor filter apparatus coupled with an inverter yielding high frequency harmonics and/or non-sixty Hertz output. For example, an inductor/converter apparatus is provided using a silicon carbide transistor that outputs power having a carrier frequency, modulated by a fundamental frequency, and a set of harmonic frequencies. A filter, comprising an inductor having a distributed gap core material and optional magnet wires, receives power output from the inverter/converter and processes the power by passing the fundamental frequency while reducing amplitude of the harmonic frequencies.

Chip socket assembly and chip file assembly for semiconductor chips

A chip socket assembly provides for the mechanical and electrical coupling of edge-mountable chips to a bus of a circuit board with relative ease. An edge-mountable chip may be placed in a slot defined by a base. A clip may be attached to the base to retain the chip in the base. Alternatively, the base and the package of the chip may be configured such that the chip mates with the base in retaining the chip in the base. With the chip socket assembly, users may add, remove, or replace single chips and therefore expand the functionality of a system with the granularity of a single chip in a relatively easy manner. A chip file assembly may also be used to provide for the mechanical and electrical coupling of a plurality of edge-mountable chips to a bus of a circuit board with relative ease. Assemblies for securing horizontal chip packages are also described.

Electrical connector assembly

An electrical connector assembly comprises an insulative housing ( 11 ), a plurality terminals received in the housing ( 11 ), a locating frame ( 12 ) mounted on an upper surface of the housing ( 11 ), a plurality of locating pins ( 15 ) for connecting the locating frame ( 12 ) and the housing ( 11 ) to the printed circuit board ( 14 ). The housing ( 11 ) defines a plurality of receiving holes ( 111 ), which defines a plurality of spaced deformable retaining portions ( 112 ) separately on the inner wall thereof, and each deformable retaining portion ( 112 ) defines two slant surfaces ( 113 ) on two sides thereof.

Reverse mount apparatus for a rack-mounted systems

An apparatus for reverse mounting an electronic device in a server housing is provided. The apparatus includes a first bracket, a second bracket, and a coupling. The first bracket couples to the device body and extends outward from the device body toward a front rail of the server housing. The first bracket includes a first end configured to releasably couple to front rail of the server housing. The second bracket includes a protrusion that extends outward from the device body in an opposite direction relative to the first bracket. The coupling includes a first portion that couples to a rear rail of the server housing and a second portion defining a channel that receives the protrusion of the second bracket.

Connector alignment assembly

A connector alignment assembly comprises a support member having a surface from which an array of male connector pins extend outwardly, each male connector pin having a base region proximate the surface of the support member and a tip region proximate the end of each male connector pin. Guide posts extend from the surface in the direction of the array of male connector pins and compression mechanisms, one associated with each of the guide posts. The compression mechanisms are adapted to transition from the uncompressed position to a compressed position. An alignment plate has guide holes which engage with the guide posts to position the alignment plate in a spaced relationship from the surface of the support member. The alignment plate has an array of male connector pin holes which engage with the array of male connector pins.

Cable Assembly Management Elements and Fixture

A fixture for temporarily mounting connectors of a plurality of cable assemblies is provided for use while replacing an electronic component having a plurality of receptacles. Each cable assembly has a connector disposed in one of the receptacles. The fixture includes a body, an array of cavities disposed on the body, and an array of body indicia. Each cavity receives one of the connectors therein and each body indicia is disposed adjacent one of the cavities, with each body indicia being unique relative to other body indicia. A plurality of the pluggable identifier elements are provided with each pluggable identifier element being pluggable into one of the cavities and including an element indicia. Each element indicia corresponds to one of the body indicia and is unique relative to other element indicia. A kit of pluggable identifier elements and a method of replacing an electronic component is also provided. 1. A fixture for temporarily mounting connectors of a plurality of cable assemblies while replacing an electronic component having a plurality of receptacles , each cable assembly having a connector disposed in one of the receptacles , the fixture comprising:a body;an array of cavities disposed on the body, each cavity being configured to receive one of the connectors of the plurality of cable assemblies therein;an array of body indicia, each body indicia being disposed adjacent one of the cavities, each body indicia being unique relative to other body indicia; anda plurality of the pluggable identifier elements, each pluggable identifier element being pluggable into one of the cavities and including an element indicia, each element indicia corresponding to one of the body indicia, each element indicia being unique relative to other element indicia.2. The fixture of claim 1 , wherein the body indicia and the element indicia include a plurality of colors.3. The fixture of claim 1 , wherein the body indicia and the element indicia include a plurality of ...

SOCKELKONTAKT

IC socket for semiconductors

Published without abstract.

Module holder

The module holder, particularly for use with smaller-scale equipment that is installed e.g. on a desk, comprises a first foot 4 for supporting one side of a module and a second foot 6 for supporting another side of a module, between which at least one slot 8 is configured to be detachably assembled. There are preferably a number of slots, one for each module to be supported by the module holder, and an engaging elements 14,18 may be formed between the first foot and the slot, between the adjacent slots and between the slot and the second foot which acts to detachably fix each component. Each slot has a width and length sufficient to cover one side of a module and is provided with a guide protrusion 10, configured to guide a module as it is mounted thereon, and support portions 12 that protrudes upwardly from the ends of the slot to support the front and rear sides of the module.

Game machine

A game machine, particularly an arcade game machine, has a modular construction including provision for electrically detaching the player control(s) unit from the processing control device contained within the main body of the machine to allow replacement or exchange of the player controls, eg for different types of game, (Fig 5, not shown) and wherein the processing control device accommodates replaceable game software memories to allow a service engineer to readily exchange both the game and the operational controls. The processing control device may be contained in a casing 45 such that the display controller, a game memory and a central control unit are each configured as circuit modules in cartridge form with connectors 39a,, b, c in recesses 41a, b, c establishing electrical contact with similar connectors in cartridges 64a, b, c (Fig 3, not shown); lateral finger recesses 47a, b, c assist in easy removal of the cartridges.

Integrated socket and cable connector

According to one embodiment of the present invention, an integrated socket is disclosed. The socket includes a socket grid to receive one or more pins from a component, a frame coupled to the socket grid to provide structural support, and a cable receptacle integrated into the socket to receive a cable.

Socket for electrical part

FLEXIBLE CONNECTION PORT FUER AN ELECTRICAL LINK WITH A MULTIPLICITY OF CONTACTS.

Housing for attachment and to the electrical connection of high frequency amplifiers and their power packs with community antenna systems

ADAPTABLE TERMINAL ASSEMBLY FOR MULTI-CONTACT ELECTRICAL CONNECTOR

LANCED HOLD-DOWNS

INTEGRATED CIRCUIT INTERFACE AND METHOD OF MAKING THE SAME

One example includes a device (100) that is comprised of a plurality of printed circuit boards (200), a plurality of vias (110), and a plurality of castellations (130). The plurality of printed circuit boards (200) are laminated together, at least some of the plurality of printed circuit boards (200) including a dielectric panel (210) and a plurality of conductor pads (220). The plurality of vias (110), through the plurality of conductor pads (220), include a conductive material to respectively electrically couple the plurality of conductor pads (220) with each other. The plurality of castellations (130), on at least one side of the plurality of printed circuit boards (200), to electrically couple each of a plurality of contact pins of an integrated circuit socket with respective contact pads of the plurality of conductor pads (220).

VARIABLE SPEED MODULE

ELECTRICAL PACK WITH POWER CONTROL MODULES AND SEPARATE.

Electronics unit of component

Electrical connector assembly

An electrical connector assembly includes a frame, an insulating housing received in the frame, a plurality of contacts received in the insulating housing, a metal cover and an axostyle installed on the frame and an adsorption cover. The edge of the insulating housing has a plurality of step portion; the edge frame of the metal cover has a plurality of snap. The adsorption cover has a plurality of hook corresponding to the step portion and the snap. The adsorption cover fastener to the insulating housing and the metal cover by the hook. The present invention is simple and cost savings.

Game machine

A control device is located inside a game machine cabinet placed on a floor surface. The control device includes a display controller for controlling the game machine display, a memory for holding basic operations control software, and a central control unit for controlling the display controller while executing the basic operations control software, in response to operations input from the operation unit. A casing of the control device has a connector for connecting the operation unit and the display. Electrical circuits operating as the display controller, the memory, and the central control unit are provided in the form of a plurality of modules. The control device casing has a concave in its top surface. At the bottom of this concave, there is a connector half. At least one of the modules is fitted into the concave. The module has, in its bottom, a connector half that is detachable with respect to the connector half. A finger recess is formed in a lateral surface wall of the concave ...

MODULAR UNIT FOR MAKING PLUG-IN ELECTRICAL CONNECTIONS

Modular Device For Open-Loop Control or Closed-Loop Control Of A Technical Installation

A device for open-loop control or closed-loop control of a technical installation has a first backplane module, a second backplane module and a third backplane module which are configured to be positioned side by side on a mounting rail in a longitudinal direction. The first backplane module has a first main body and a first contact part. The second backplane module has a second main body and a second contact part. The third backplane module has a third main body and a third contact part. The main bodies each have an upper side comprising insertion openings which are configured to receive electrical contacts of separate electronic modules. The contact parts form a bus line in the longitudinal direction such that plugged-in electronic modules can be electrically coupled to one another by means of the contact parts. The second main body further has a receptacle, in which the second contact part is arranged in one of at least two defined variants. In a first variant, the second contact part ...

MOBILE MEMORY MODULE FOR ELECTRICAL TRANSFER SWITCH

Systems and methods for providing a mobile memory module in an automatic transfer switch (ATS) allow the memory module to be easily removed from a controller of the ATS. The mobile memory module is a discrete, nonvolatile memory module that stores operational settings for the ATS and can be mounted and removed via a removable fastener. When thus mounted, the mobile memory module is connected to a signal path that allows data communication with a microprocessor on the controller. The microprocessor can retrieve operational settings from the mobile memory module as needed and store updated or new operational settings on the mobile memory module as required. In some embodiments, the mobile memory module has a protective outer housing that is hardened to withstand catastrophic transfer switch failure while still retaining all operational settings stored on the module.

Multipoint contact conduction cooling of a removable device

Example implementations relate to a host device and a method for thermal management of a removable device, such as a pluggable electronic transceiver comprising a plurality of spring fingers that provide multipoint contact conduction cooling of the removable device. The host device includes a host circuit board having a connector, and a thermal management unit having a cooling component and the plurality of spring fingers. The cooling component is coupled to a portion of the host circuit board and includes a partially protruded portion. Each of the plurality of spring fingers includes a first end coupled to the partially protruded portion, and a second end having a dry contact surface to establish a direct thermal interface with a peripheral surface of the removable device to allow waste-heat to transfer from the removable device to the cooling component through each spring finger.

COMMUNICATION SYSTEMS HAVING PLUGGABLE OPTICAL MODULES

An apparatus includes a housing capable of being mounted in a rack, and a vertically oriented switch card. The vertically oriented switch card includes one or more vertically oriented application-specific integrated circuits (ASIC) mounted on the vertically oriented switch card. The switch card includes a two-dimensional arrangement of plug ports; each plug port is configured to receive a pluggable optical module. The switch card also includes a two-dimensional arrangement of channel intakes, each channel intake is positioned adjacent to at least one of the plug ports of the two dimensional arrangements of plug ports, each channel intake receives air and directs the received air towards an interior of the housing capable of being mounted in a rack.

SYSTEM ZUR BLUTZUCKERBESTIMMUNG

ECL counter module with a decimal digital display for counting fast pulse events in decades, and counter cascade assembled therefrom

The invention relates to an ECL pulse counter module which can count pulses in decades by means of an emitter-coupled logic circuit, display them as decimal digits and output an extended carry pulse after in each case ten pulses. The counter module in each case contains components for a counting decade in a box-shaped housing and one display element each for a digit on its front face. On its two vertical sides, it carries a coaxial plug-in system which enables a number of such counter modules to be simply plugged together to form an ECL counter cascade due to the fact that the reset line (R) and the supply voltages (VEE, VCC) are carried through the housing and the associated sockets on the left-hand housing side are connected to corresponding plugs at exactly the same location on the right-hand housing side and a socket for the pulse input (E) on the right-hand housing side is opposite to a plug for the carry output (Ü) at exactly the same location on the left-hand housing side. The counter ...

Erweitertes Gehäusesubstrat und Verfahren zum Koppeln eines Substrates eines IC- Gehäuses mit einem Sockel

Vorrichtung, umfassend:ein IC-Gehäuse (110, 410, 510), das eine Vielzahl von leitfähigen Bereichen und ein Substrat (112, 412, 512) mit einer ersten (116, 416, 516) und zweiten Stirnfläche (118, 418) sowie einer ersten Seite (411), einer zweiten Seite (413), einer dritten Seite (415), einer vierten Seite (417) und einer Kerbe (419) aufweist, undeinen Sockel (120, 420, 520), der eine Grundfläche aufweist, die kleiner als jede der Stirnflächen (118, 418, 116, 416, 516) des Substrats (112, 412, 512) ist, und eine erste Wand (421, 521) in Kontakt mit der ersten Seite (411), eine zweite Wand (422) in Kontakt mit der zweiten Seite (413), eine dritte Wand (423) in Kontakt mit der dritten Seite (415) und eine vierte Wand (424, 524) aufweist, die eine Öffnung (425, 525) definiert, wobei die Öffnung (425, 525) zwischen der ersten Seite (411) des Substrats (112, 412, 512) und der vierten Seite (417) des Substrats (112, 412, 512) angeordnet ist, und wobei der Sockel (120, 420, 520) ferner ein mit der ...

Socket having movable location board guiding and clamping contacts

A socket for an electrical part, such as an IC socket, to be mounted on a printed circuit board, P, is provided with a socket body 14, and a plurality of contact pins 15 are mounted to the socket body 14 so as to electrically connect the electrical part and the PCB. The contact pin 15 includes a base portion 15e, an elastic piece 15b extending upward from the base portion 15e, a lead portion 15a extending downward from the base portion 15e, and a contact portion formed to a tip end of the elastic piece 15b. The contact tail portion 15a is inserted into an insertion hole P1 formed to the PCB, P. The contact pins 15 are inserted into the socket body 14 of the IC socket from the lower side thereof so that the base portion 15e of each contact pin is fitted to a base portion fitting hole portion 14f, and the base portion 15e of the contact is pressed by a locating board 19 disposed to the lower side of the socket body 14. At a first, separated, position the locating board aligns and guides each ...

A variable speed drive module

A variable speed drive module comprising a power supply input 3 (fig 1) to be connected to a source of power. The module comprises a switching arrangement 4 which is controllable to modulate power input via the power supply input and to output variable frequency drive signals to a motor output 5 (fig 1). The module comprises a first control connector 7 (fig 1) which is coupled to the switching arrangement 4 and is configured to connect removably to a second control connector 8 provided on a control arrangement 9, to receive control signals from the control arrangement. The switching arrangement 4 is incapable of outputting variable frequency drive signals to the motor output 5 if the control connectors are disconnected from one another, thus disabling the device. The variable speed drive module may further comprise a control arrangement comprising a second control connector and an attachment arrangement to allow it to releasably attached. The control module may comprise a processor, a communications ...

Media control console

A variable speed drive module

Improvements in means for mounting electrical amplifiers

... 1,069,614. Circuit assemblies. H. KOLBE and H. KOHLER. March 17, 1965 [April 25, 1964], No. 11342/65. Heading H1R. At least two socket units 2, 3 are mounted on a board to receive and hold mechanically plugs 5 on amplifiers 4, the socket units also providing connections for the input and output connections of the amplifiers. Current is supplied over conductors 8, which may be in printedcircuit form, and pick-ups 9.

ELECTRICAL ASSEMBLIES

... 1413409 Transformers SIEMENS AG 3 Dec 1973 [22 Dec 1972] 55954/73 Heading HIT [Also in Division H2] To carry an electrical component 1, for example the ferrite core of a transductor, a thermoplastic base-plate 2 with contact pins 3 also bears lugs 6 which hold the component 1 mechanically. The lugs 6 may be pre-bent, heated and pressed into plate 2 to secure the component 1 on cooling, the plate 2 together with contact-pins 3 having been previously formed. Alternatively the lugs, not bent, may be set in place when the plate 2 is formed, and subsequently bent over component 1 to secure it. More than one component may be secured on the plate.

PLACING A CAMERA MODULE IN PORTABLE EQUIPMENT

MECHANISM FOR THE CODING OF PLUG-IN CIRCUIT BOARDS AS WELL AS MECHANISM FOR THE CONNECTION OF EXTERNAL LINES WITH A SUCH CODER

COMBED CONTACT FOR A LAND RASTER FIELD ROW (LGA) VERGE FOR IMPROVED CURRENT SUPPLY

Integrated circuit interface and method of making the same

One example includes a device (100) that is comprised of a plurality of printed circuit boards (200), a plurality of vias (110), and a plurality of castellations (130). The plurality of printed circuit boards (200) are laminated together, at least some of the plurality of printed circuit boards (200) including a dielectric panel (210) and a plurality of conductor pads (220). The plurality of vias (110), through the plurality of conductor pads (220), include a conductive material to respectively electrically couple the plurality of conductor pads (220) with each other. The plurality of castellations (130), on at least one side of the plurality of printed circuit boards (200), to electrically couple each of a plurality of contact pins of an integrated circuit socket with respective contact pads of the plurality of conductor pads (220).

CONNECTOR COMPRISING AT LEAST ONE CONTACT HAVING A RESILIENTLY DEFORMABLE ARM

TEST JACK FOR MOUNTING ON PRINTED CIRCUIT BOARDS

CATHODE RAY TUBE DISPLAY TERMINAL HAVING AN ENCLOSURE FOR PROTECTION OF A LOGIC BOARD

A cathode ray tube display terminal includes a printed circuit logic board permanently mounted in a molded plastic enclosure assembly during "on the shelf" storage and shipment of the enclosure as a spare part and during normal operation of the CRT display terminal. The enclosure assembly includes a too portion and a lower portion which snap together. The printer circuit logic board is assembled between the upper and lower portions of the enclosure which are secured by a single screw. A snap-out section allows replacement of a read only memory on the logic board.

LOW HEIGHT CHIP CARRIER SOCKET

The present invention sets forth a low height socket for an integrated chip carrier of the "Tape Pak" type. The unique contact is arranged in the shape of a tuning fork. The chip carrier having flexible leads projecting outwardly from its sides is placed in the lower body of the socket with the leads resting on top of their respective tuning fork contacts. The cover, having locking members projecting downwardly and in alignment with the tuning fork contacts, is forced into engagement with the lower body so that the locking members deflect the leads downwardly, bending them about the contacting portion of the tuning fork shaped contacts. The two arms of each tuning fork then has the locking member and a respective lead wedged therebetween. 14678 CA ...

CONTACT ARRANGEMENT FOR DETACHABLY ATTACHING AN ELECTRIC COMPONENT, ESPECIALLY AN INTEGRATED CIRCUIT TO A PRINTED CIRCUIT BOARD

The contact arrangement is a connector block for detachably fastening an electrical component, particularly in integrated circuit having a plurality of terminal contacts disposed in a ball grid array (BGA), in a column grid array (CGA), in a land grid array (LGA) or of the flip-chip type to a printed circuit board. In a support part, a number of contact pins are disposed in a grid in bores. The contact pins project from the bore on the sides facing the printed circuit board and are surface-mounted together with contact areas of the printed circuit board. A free end region of each bore is intended for guiding the substantially dome-shaped terminal contacts. Between the end of a contact pin and a terminal contact there is a space bridged for establishing an electrical connection with a contact element, for example an axially compressible coil spring. By means of several holding-down elements disposed peripherally to the integrated circuit, the integrated circuit is pressed down upon the support ...

CHASSIS FOR SUPPORTING REMOVABEL CIRCUIT COMPONENTS OF TEMPORARY ELECTRIC OR ELECTRONIC CIRCUITS

Lightning arrester for modular assembly and associated modular element

Device allowing to carry out simply and quickly various assemblies for receiving sets of radio telephony or telegraphy

배선 기판

... 본 발명의 배선 기판은 전원용의 반도체 소자 접속 패드에 비아 도체를 통해서 접속되어서 세그먼트 영역의 하방에 배치된 전원용의 랜드 패턴이, 세그먼트 영역에 있어서의 탑재부의 외주변측을 제외하는 외주부에 대응한 위치에 띠 형상으로 늘어서 있는 부분을 가짐과 아울러, 이 띠 형상으로 늘어서 있는 부분과 그 하방에 배치된 전원 플레인이 비아 도체를 통해서 접속되어 있다.

LAND GRID ARRAY SOCKET ASSEMBLY

A land grid array socket assembly comprises a plurality of cells, with each cell comprising an insulative body having a top surface, and contact conductor that has a first portion that extends from a board contact point up to and beyond the top surface to a contact bend, and a second portion that extends from the contact bend to terminate below the top surface and within the insulative body.

FIELD REPLACEABLE POWER SUPPLY CARTRIDGE

A field replaceable power supply cartridge is provided for coupling with a socket. The cartridge has a latch mechanism that can be actuated by the user to couple the cartridge to the socket, such that latches of the cartridge releasably engage recessed portions in the socket. The cartridge has a key feature that corresponds to a key feature on the socket, allowing the cartridge to be coupled to the socket in only one orientation, thereby preventing the incorrect electrical connection between the cartridge and the socket. The cartridge can have a multi-pin electrical connector for coupling to a corresponding connector on the socket. The socket can be a relatively short socket, where the electrical wires are bottom fed, or can be a relatively tall socket, where the electrical wires are side fed via one or more openings in the body of the socket. 1. (canceled)2. A power supply system , comprising:a power supply cartridge including a cartridge body having a plurality of sides, a one of the sides of the cartridge body having an electrical connector, a key feature being defined on the one of the sides of the cartridge body, the key feature having a protruding portion including four side walls, a first one of the side walls of the protruding portion of the key feature having a first length being different than a second length of a second one of the side walls of the protruding portion of the key feature;a socket including a socket body being coupleable to an electrical wire and having a plurality of sides, a one of the sides of the socket body having another electrical connector adapted for being releasably coupled with the electrical connector of the cartridge body, another key feature being defined on the one of the sides of the socket body, the another key feature having a recessed portion including four side walls, a first one of the side walls of the recessed portion of the another key feature having a first length being different than a second length of a second one ...

Adapter apparatus with socket contacts held in openings by holding structures

An adapter apparatus and method of forming the adapter apparatus includes providing a substrate with a plurality of layers. The layers include at least one socket contact holding layer that includes a plurality of holding structures positioned between a plurality of other layers. A plurality of socket contacts (e.g., each including an end connection portion and first and second deflectable element coupled thereto) are held in corresponding openings defined through the substrate at least in part by the plurality of holding structures.

Electronic device capable of installing different modules and case module thereof

A case module that is capable of installing a first electronic module and a second electronic module, includes a cage and a restraining component. The first electronic module can move relative to the cage to a first installation position along a first direction. The second electronic module can move relative to the cage to a second installation position along a second direction perpendicular to the first direction. When the first electronic module moves relative to the cage toward the first installation position along the first direction, the restraining component is driven to move relative to the cage toward a restraining position along the first direction. The second electronic module can be stopped by the restraining component when the restraining component is located at the restraining position.

ADAPTER FOR AIRCRAFT WIRELESS MODULE

A circuit card assembly is described. The circuit card assembly adapts a host circuit card assembly of a host device with an expansion card. By such adaption, the host device may communicate with an access point of an avionics network. The circuit card assembly includes an interface for receiving power from the host circuit card assembly. The circuit card assembly then continuously and selectively provides power to a second interface based on the availability of aircraft power. The second interface receives the expansion card. The circuit card assembly also includes one or more coaxial RF connectors for receiving modulated signals from the expansion card. The circuit card assembly also includes an antenna which transmits radio waves based on the modulated signals.

STECKBARE ELEKTRONISCHE BAUEINHEIT.

VERFAHREN ZUR HERSTELLUNG ELEKTRISCHER BAUELEMENTE

Hermetisches dichtes Hochfrequenz-Frontend

Die Erfindung betrifft ein hermetisch dichtes HF-Frontend (z.B. Sende-/Empfangsmodul) in Mehrlagenstruktur umfassend elektronische Bauelemente (3, 4), wobei die Mehrlagenstruktur mehrere übereinander gestapelte, die Bauelemente (3, 4) tragende Substrate (1, 2) enthält, wobei in den Substraten (1, 2) Nuten (7) ausgeführt sind und zwischen den Substraten (1, 2) Dichtelemente (5, 8) vorhanden sind, welche in die Nuten (7) eingreifen und dass die Substrate (1, 2) miteinander verlötet sind.

A variable speed drive module

Electrical contact element

... 1,030,067. Two-part couplings. AMP Inc. July 15, 1964 [July 17, 1963], No. 47212/65. Divided out of 1,030,066. Addition to 927,484. Heading H2E. A female contact element comprises a sheetmetal channel 70 having side walls which are each bowed inwardly at two points 80 above cut-away portions 741 of the walls to make a good resilient contact with a blade inserted longitudinally along the channel, as described in the parent Specification, the element also having an eyelet 82 which can be deformed to hold the element in an insulating body. A series of these contact elements are mounted on modular nuts 54 (Fig. 1, not shown), a number of which can be plugged into a frame carrying blade type contact devices mounted on the underside of printed circuit boards, and having tags which extend through the boards and are clinched to the printed strips. The modular assembly is fully described in Specification 1,030,066.

Substrate accommodating structure, electronic device including substrate accommodating structure and detection apparatus including substrate

Modular socket of integrated circuit

Three-dimensional electrical circuit systems and modular units therefor

... 866,528. Circuit assemblies. AMP Inc. Dec. 23, 1959 [Dec. 29, 1958], No. 43661/59. Class 37. A circuit assembly is composed of a plurality of modular units, each of which is made of electricallyinsulating material and contains at least one electrical circuit component with its leads connected to conductive strips on the outside of the unit and extending in a direction such that in planes perpendicular thereto the unit is of uniform cross-section. Fig. 1 shows a unit of square cross-section and comprising a plurality of plates 25 each supporting one or more components which are connected to recessed terminal areas at the edges of the plate by printed wiring, Fig. 2 (not shown). The plates are assembled by being held in a jig, resilient conductive strips 33, Fig. 3, thereafter being inserted in the recessed terminal areas and in corresponding recesses in the end-plates 31, 32. The strips 33 carry a coating of solder on their lower edges; assembly is completed by the application of heat to ...

A variable speed drive module

Improvements in or relating to the mounting of electrical equipment

... 627,770. Two-part couplings. AUTOMATIC TELEPHONE & ELECTRIC CO., Ltd., and WOODLAND, C. R. March 21, 1947, No. 7770. [Class 38 (i)] [Also in Groups XXXVII and XXXIX] Telephone subscribers' meters are jacked in to rack mounting plates and are recured by gravity-locking means. The mounting plate 10 carries horizontal sockets such as 11, each having a hole 18 which slopes downwardly to the rear of the sockets and is provided with a shoulder 19. Springs 12, 13 united to form wiring tags 14 are secured to the socket and make contact with the coil tags 22 of the meter 20. A guide post 23 is screwed on to the core extension piece 29 of the meter electromagnet, and is of reduced diameter towards its end to allow the meter to pivot slightly with respect to the socket. The mushroom head 26 of the guide post engages with the shoulder 19, thus preventing withdrawal of the meter unless prior lifting thereof takes place. The invention is stated to be applicable also to telephone traffic meters and relays ...

BASE AND ELEMENT WITH A CONNECTING RAIL IN HEAVY CURRENT AND GROUND CONDUCTORS FOR THE INCREASE OF THE CURRENT LOAD-CARRYING CAPACITY, WHICH MAKES A HIGHER IC CURRENT SUPPLY POSSIBLE

APPARATUS FOR USE IN COOLING

Electrical pack with separate control and power modules

The electrical package (1) comprises power components grouped together according to power modules (4) and control components grouped together according to a control module (3) which is separate from the power modules (4).

Arrangement of electronic components

ELECTRIC DEVICE OF CONNECTION

CARTRIDGE REMOVABLE COMMUNICATION EQUIPMENT, EQUIPMENT, ASSEMBLY AND SYSTEM

CONNECTOR INCLUDING/UNDERSTANDING AT LEAST A CONTACT PRESENTING AN ARM ELASTICALLY DEFORMABLE

DISPOSITIF DE CONNEXION ELECTRIQUE

Dispositif de connexion électrique pour appareils électriques devant être montés conjointement à un endroit prédéterminé d'un panneau tel que le tableau de bord d'un véhicule à moteur. Le dispositif utilise une plaque 30 de câblage imprimé commune à tous les appareils, cette plaque portant, alignées sur les faces opposées d'une ouverture 38, des bornes imprimées 36 sur lesquelles sont fixées les parties de base 54 de bornes 40 d'un élément de connexion mâle 68 qui vient s'engager avec un élément de connexion femelle complémentaire 22a de l'ensemble d'appareils électriques.

Dual force single point actuation integrated load mechanism for securing a computer processor to a socket

A dual force single point actuation integrated load mechanism for securing a computer processor to a socket, the dual force single point actuation integrated load mechanism including a base mounted around the socket; and a load plate rotatably coupled to the base and secured to the base when an activate lever and a hinge lever are secured above the load plate.

Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies

Enhanced microfabricated spring contact structures and associated methods, e.g. such as for electrical contactors and interposers, comprise improvements to spring structures that extend from the substrate surface, and/or improvements to structures on or within the support substrate. Improved spring structures and processes comprise embodiments having selectively formed and etched, coated and/or plated regions, which are optionally further processed through planarization and/or annealment. Enhanced solder connections and associated processes provide a gap between substrates for componentry, and or improved manufacturing techniques using distributed spacers. Enhanced probe card assembly structures and processes provide improved planarization adjustment and thermal stability.

System and method for multi-application socket

A processor module socket accommodates processor modules of different sizes with adapters that align smaller-sized modules so that module pins align with desired contact points. The largest supported processor module engages with the socket in a conventional manner without the use of an adapter. Smaller processor modules engage within an adapter that in turn engages in the socket in a manner similar to the largest supported processor module. The contact points of the socket support different sized processor modules by keying logical functions based upon the type of processor module installed in the socket.

Socket and device having the socket

A socket for providing an electric connection between a package and an electronic circuit board, the socket includes a package mounting area in which the package is mounted and an isotropic elastic body provided on the package mounting area and having a continuous shape along four side walls of the package so as to press the four side walls of the package.

Socket assembly with pick up cap

A socket assembly comprises an insulating housing receiving a plurality of contacts, a pick up cap assembled on the insulating housing and a loading plate covering the insulating housing and the pick up cap. The pick up cap is pivotally assembled to one of the sidewalls of the insulative housing at an end thereof and has an operating portion at an opposite end thereof. The loading plate is provided with a latching piece to latch with the operating portion of the pick up cap, so that the loading plate can bring the pick up cap to open.

Metalized pad to electrical contact interface

A surface mount electrical interconnect to provide an interface between a PCB and contacts on an integrated circuit device. The electrical interconnect includes a substrate with a plurality of recesses arranged along a first surface to correspond to the contacts on the integrated circuit device. Contact members are located in a plurality of the recess. The contact members include contact tips adapted to electrically couple with the contacts on the integrated circuit device. An electrical interface including at least one circuit trace electrically couples the contact member to metalized pads located along a second surface of the substrate at a location offset from a corresponding contact member. A solder ball is attached to a plurality of the metalized pads.

Terminal assembly with regions of differing solderability

An intercoupling component is provided which permits reliable, non-permanent electrical connection between a first substrate and a second substrate. The intercoupling component includes a socket terminal having a first end, and a second end opposed to the first end. An axial hole extends inward from the second end, and an electrically conductive core member is disposed within the axial hole. The core member is formed of a different material than the socket terminal body, and is sized and shaped to obstruct the hole. In addition, the first end of the socket terminal is configured to receive a pin terminal, and the second end of the socket terminal is configured to be received within a hole in a printed circuit board.

Electronic device with card interface

When initializing a card-shaped device inserted in a card interface, operation mode acquiring means incorporated in an electronic device acquires operation mode information, stored in a register file incorporated in the card-shaped device, by a predetermined procedure using a predetermined pin. Operation mode setting means incorporated in the electronic device executes signal assignment on a plurality of data pins peculiar to an operation mode indicated by the acquired operation mode information, thereby switching a data transfer width, and allowing the card-shaped device to operate in the operation mode.

High Availability Device Level Ring Backplane

A modular, high-availability network for an industrial control system employs a plurality of base modules having backplane and using network ring topology. Base modules may include I/O base modules for communicating with industrial processes or machines, an adapter base module for communicating with a programmable logic controller (PLC) and/or a bus expansion base module for providing additional I/O base modules. Base modules may be arranged side-by-side, having a backplane in a bank. Another embodiment may include having plurality of banks. The network ring topology used by the base modules is normally opened by a ring supervisor at the ring supervisor location. Upon failure of the network, the ring supervisor reconnects the ring to provide an alternative transmission path around the failure point.

Socket connector having constraining plate forming final contacting point of contact terminal

A socket connector includes a socket body, a cover located above the socket body, and a plurality of contacts. Each contact has a base portion retained in the socket body and a slanting resilient arm extending through the cover with a contacting end extending beyond an upper surface of the cover.

AUTOMOTIVE ALTERNATOR RECTIFYING APPARATUS

An automotive alternator rectifying apparatus includes a circuit board that connects a positive-side rectifying element mounted to the positive-side heatsink and a negative-side rectifying element mounted to the negative-side heatsink to configure a bridge circuit. The circuit board includes a tubular lead guiding portion that includes a lead insertion aperture; and a terminal that is disposed so as to extend outward in an aperture direction of the lead insertion aperture from an exit edge portion of the lead insertion aperture, and to which is connected a lead that is subject to connection that is inserted through an entrance of the lead insertion aperture and that extends outward from an exit, and the lead insertion aperture is formed such that cross-sectional area thereof becomes gradually smaller from the entrance toward the exit. 1. An automotive alternator rectifying apparatus that rectifies an alternating-current electromotive force that is generated in an automotive alternator stator into direct current , said rectifying apparatus comprising:a positive-side heatsink to which a positive-side rectifying element is mounted;a negative-side heatsink that is disposed so as to be separated from said positive-side heatsink, and to which a negative-side rectifying element is mounted; anda circuit board that is disposed so as to be stacked with said positive-side heatsink and said negative-side heatsink, and that connects said positive-side rectifying element and said negative-side rectifying element to configure a bridge circuit,wherein: a tubular lead guiding portion that comprises a lead insertion aperture; and', 'a terminal that is disposed so as to extend outward in an aperture direction of said lead insertion aperture from an exit edge portion of said lead insertion aperture, and to which is connected a lead that is subject to connection that is inserted through an entrance of said lead insertion aperture and that extends outward from an exit; and, 'said circuit ...

SOCKET FOR ELECTRIC PARTS

A socket for electric parts which is dawn sized. The socket of the present invention comprises a socket body to accommodate an electric part, plural contact pins disposed to a peripheral edge of the socket body, a latch rotatably located on the socket body so as to positioned above the contact pins, which presses an upper part of the electric part when the latch is closed and is in a state the electric part can be accommodated and taken out when the latch is opened, an operating member which is vertically movably disposed in the socket body and comprises an operating portion for opening constituted so as to press down an operation portion to be operated for opening formed to a central portion in a width direction of the latch and rotate the latch in an opening direction when the operating member moves downward. 1. A socket for electric parts comprising:a socket body which has a rectangle shape and has an accommodation surface to accommodate an electric parts having a lower surface to which terminals are provided;plural contact pins of horseshoe-shapes, which are disposed in parallel and at predetermined intervals to a peripheral edge of the socket body, and each of which has an elastic piece to contact with the terminals of the electric part,a latch rotatably disposed on the socket body so as to positioned above the contact pins, which presses an upper part of peripheral portion of the electric part when the latch is closed and is in a state the electric part is able to be accommodated onto and taken out from the accommodation surface when the latch is opened, andan operating member which is vertically movably disposed in the socket body, and comprises an operating portion for opening constituted so as to press down an operation portion to be operated for opening formed to a central portion in a width direction of the latch and rotate the latch in an opening direction when the operating member moves downward.2. The socket for electric parts according to claim 1 , ...

SOCKET FOR ELECTRIC PARTS

A socket for electric parts which is dawn sized. The socket of the present invention comprises a socket body to accommodate an electric part, plural contact pins disposed to a peripheral edge of the socket body, a latch rotatably located on the socket body so as to positioned above the contact pins, which presses an upper part of the electric part when the latch is closed and is in a state the IC socket can be accommodated and taken out when the latch is opened, an operating member which is vertically movably disposed in the socket body and comprises an operating portion for closing constituted so as to press upward an operation portion to be operated for dosing formed to both side end portion of the latch and rotate the latch in an closing direction when the operating member moves upward. 1. A socket for electric parts comprising:a socket body which has a rectangle shape and has an accommodation surface to accommodate an electric parts having a lower surface to which terminals are provided,plural contact pins of horseshoe-shapes, which are disposed in parallel and at predetermined intervals to a peripheral edge of the socket body, and each of which has an elastic piece to contact with the terminals of the electric part,a latch rotatably disposed on the socket body so as to positioned above the contact pins, which presses an upper part of peripheral portion of the electric part when the latch is closed and is in a state the electric part is able to be accommodated onto and taken out from the accommodation surface when the latch is opened, andan operating member which is vertically movably disposed in the socket body, and comprises an operating portion for closing formed at both sides of an arrangement range of the plural contact pins, constituted so as to press upward an operation portion to be operated for closing formed to both side end portion of the latch, and rotate the latch in an closing direction when the operating member moves upward.2. The socket for ...

Solar panel junction box capable of integrating with a variety of accessory modules, and method of use

A junction box is affixed to, and electrically coupled with, a solar panel. The junction box is configured to releaseably engage and disengage accessory modules, thereby allowing accessory modules to be replaced or exchanged easily. Accessory modules are electrically coupled with other accessory modules in the solar panel string. The furthest downstream accessory module is connected to a wire harness, which is connected to a central combiner box.

LAND GRID ARRAY SOCKET ASSEMBLY

A land grid array socket assembly comprises a plurality of cells, with each cell comprising an insulative body having a top surface, and contact conductor that has a first portion that extends from a board contact point up to and beyond the top surface to a contact bend, and a second portion that extends from the contact bend to terminate below the top surface and within the insulative body. 1. A land grid array socket assembly , comprising:a plurality of cells, each cell comprising an insulative body having a top surface, and contact conductor that has a first portion that extends from a board contact point up to and beyond the top surface to a contact bend, and a second portion that extends from the contact bend to terminate below the top surface and within the insulative body.2. The land grid array socket assembly of wherein the insulative body of each cell includes a base portion and a cap portion.3. The land grid array socket assembly of wherein a retainment edge exists beneath the top surface claim 1 , and the second portion terminates under the retainment edge.4. The land grid array socket assembly of wherein a solder ball is provided on the board contact point.5. The land grid array socket assembly of wherein the insulative body includes slots claim 4 , and the contact conductor includes edges that engage the slots.6. A board assembly comprising:a board having board pads; anda land grid array socket assembly comprising a plurality of cells each cell comprising an insulative body having a top surface, and contact conductor that has a first portion that extends from a board contact point in electrical contact with a board pad up to and beyond the top surface to a contact bend, and a second portion that extends from the contact bend to terminate below the top surface and within the insulative body.7. The board assembly of wherein the insulative body of each cell includes a base portion and a cap portion.8. The board assembly of wherein a retainment edge exists ...

ELECTRICAL CONNECTOR WITH DUAL ARM CONTACT

A contact includes a base portion having an upper end and a lower end opposite to the upper end, a first spring arm extending obliquely and upwardly from the upper end of the base portion, and a second spring arm extending obliquely and upwardly from the lower end of the base portion and towards the first spring arm, wherein the second spring arm locates under the first spring arm, a supporting portion is defined on a distal end of the second spring arm and slides along the first spring arm to support the first spring arm when the first spring arm is pressed down by an electronic component. 1. A contact for electrically connecting an electronic component comprising:a base portion comprising an upper end, a lower end opposite to the upper end, and two sides opposite to each other;a first spring arm extending obliquely and upwardly from the upper end of the base portion, the first spring arm comprising a contacting portion for contacting the electronic component; anda second spring arm extending obliquely and upwardly from the lower end of the base portion and towards the first spring arm, a supporting portion defined on a distal end of the second spring arm far from the lower end of the base portion; whereinthe second spring arm locates under the first spring arm, and the supporting portion is capable of sliding along the first spring arm to support the first spring arm when the contacting portion is pressed down by the electronic component.2. The contact as claimed in claim 1 , wherein the first spring arm comprises an arc-shaped section protruding towards the second spring arm claim 1 , the supporting portion of the second spring arm contacting the arc-shaped section when the first spring arm is not pressed down.3. The contact as claimed in claim 2 , wherein the first spring arm comprises a linear section extending obliquely and upwardly from the arc-shaped section claim 2 , the supporting portion of the second spring arm slides from the arc-shaped section to the ...

BURN-IN SOCKET

A burn-in socket for an IC package includes a base loaded with several terminals, a sliding plate, an actuator and a pair of locking elements. The sliding plate is assembled on the base and defines an upper surface. The actuator is mounted on the base and defines a receiving opening facing the upper surface. The locking elements is assembled on the actuator under a condition that the locking elements rotate inwards to press against the IC package and outwards to release the IC package when the actuator is push downwards in a vertical direction. Each locking element includes a rotating element and a pressing element. The rotating elements rotate in relative to the actuator and the pressing element rotates in relative to the rotating element. The pressing element defines a sliding slot and the rotating element defines a sliding post slidably receiving in the sliding slot. 1. A burn-in socket for an IC package , comprising:a base loaded with a plurality of terminals;a sliding plate assembled on the base and defining an upper surface;an actuator mounted on the base and defining a receiving opening facing the upper surface;a pair of locking elements assembled on the actuator under a condition that the locking elements rotate inwards to press against the IC package and outwards to release the IC package when the actuator is push downwards in a vertical direction;wherein each of the locking elements comprises a rotating element and pressing element, the pressing element is actuated to press against the IC package in response to rotation of the rotating element in relative to the actuator, the pressing element defines a sliding slot and the rotating element defines a sliding post slidably receiving in the sliding slot.2. The burn-in socket as claimed in claim 1 , wherein the pressing element defines a bottom surface confronting with the IC package.3. The burn-in socket as claimed in claim 1 , wherein the pressing element defines a fork end at a distal end thereof claim 1 , ...

POWER INVERTER DOCKING SYSTEM FOR PHOTOVOLTAIC MODULES

An electronics module docking system includes docking member removably coupled to a photovoltaic module. The docking system includes a first connector port electrically coupled to one or more photovoltaic cells of the photovoltaic module. The photovoltaic module is selectively coupleable to the docking member. The docking system includes a housing to enclose an electronics module. The housing may include second connector port that is selectively engageable to the power electronics module. The power electronics module and the photovoltaic cells are electrically coupled to one another upon selective engagement of the connector ports. The inverter housing is receivable by and removably coupleable to the docking member allowing the inverter housing to be removably coupleable to the photovoltaic module. 1. A power inverter docking system for a photovoltaic module , the coupling system comprising:a first connector port configured to be electrically coupled to at least one photovoltaic cell of the photovoltaic module;a docking member configured to be removably coupled to the photovoltaic module, wherein the docking member is configured to be removably coupled to the first connector port; andan inverter housing configured to be removably coupled to the photovoltaic module and configured to at least partially enclose a power inverter, the inverter housing including a second connector port electrically coupled to the power inverter, wherein the second connector port is configured to be selectively engageable to the first connector port and to be removably coupled to the photovoltaic module.2. The power inverter docking system of claim 1 , wherein the first connector port includes a plurality of sockets claim 1 , wherein each of the plurality of sockets is configured to be electrically coupled to the at least one photovoltaic cell of the photovoltaic module.3. The power inverter docking system of claim 2 , wherein the second connector port includes a plurality of connector ...

SUPPORT DEVICE AND SYSTEM

A support device with a connector configured to be selectively connectable to a first sized portable device and a second sized portable device, a first support surface configured to support the first sized portable device, and a second support surface configured to support the second sized portable device and having a second inclination relative to a horizontal surface different than a first inclination of the first support surface. 1. A support device comprising:a connector configured to be selectively connectable to a plurality of portable devices of varying sizes;a first support surface of a first size configured to support first sized portable devices of said plurality of portable devices;the first support surface having a first inclination relative to a horizontal surface;a second support surface of a second size different from said first size, and configured to support second sized portable devices of said plurality of portable devices;the second support surface having a second inclination relative to the horizontal surface; andthe first inclination is different from the second inclination.2. The support device according to claim 1 , wherein the second support surface has a shorter length in a longitudinal direction than the first support surface.3. The support device according to claim 1 , wherein the connector is provided at a boundary between the first and second support surfaces.4. The support device according to claim 1 , further comprising claim 1 ,a guide portion configured to guide the second sized portable devices to the second support surface and to restrain the first sized portable devices from being supported by the second support surface.5. The support device according to claim 1 , wherein the second support surface includes a first region and a second region that sandwich the first support surface.6. A system comprising:a support device including a connector configured to be coupled to a first portable device including a first side and a second ...

ELECTRONIC DEVICE

An electronic device includes: a housing including an opening; a connector configured to be exposed from the opening and to allow a connection member to be coupled thereto; and a cable configured to cover at least a portion of a gap between the connector and the opening and to be electrically coupled to the connector. 1. An electronic device comprising:a housing including an opening;a connector configured to be exposed from the opening and to allow a connection member to be coupled thereto; anda cable configured to cover at least a portion of a gap between the connector and the opening and to be electrically coupled to the connector.2. The electronic device according to claim 1 , further comprising claim 1 ,a printed board in the housing and electrically coupled to the connector and the cable.3. The electronic device according to claim 2 , wherein a distance from a connection portion provided on the printed board and coupled to the cable to the gap is shorter than a length of the connection member in a direction in which the connection member is coupled to the connector.4. The electronic device according to claim 3 , wherein the cable projects from the connection portion in parallel to the printed board.5. The electronic device according to claim 1 , whereinthe connector includes a connection opening through which the connection member is connectable thereto, andthe gap is located on a near side of the connection opening in a direction in which the connection member is coupled to the connector.6. The electronic device according to claim 1 , wherein the cable includes at least one of a single cable claim 1 , a plurality of cables claim 1 , a flat cable claim 1 , and a flexible or flat cable.7. The electronic device according to claim 1 , wherein the cable includes at least one of a single cable claim 1 , a plurality of cables claim 1 , a flat cable claim 1 , and a flexible or flat cable.8. The electronic device according to further comprising claim 1 , another ...

SOCKET FOR ELECTRIC PARTS

An IC socket includes a socket body, a contact pin that contacts a terminal of an IC package, and a latch that presses the IC package from an upper side thereof. An elastic piece of the contact pin is extended along substantially horizontal direction. The latch is formed with a can portion. When the latch is rotated in an opening direction thereof, the elastic piece is pressed by the cam portion so as to be elastically deformed downward so that the contact portion is displaced to be separated downward from a contacting position to the terminal of the IC package. When the latch is rotated in a closing direction thereof, a pressing force of the cam portion applied to the elastic piece is released so as to displace the cam portion upward by the elastic force of the elastic piece to thereby contact the terminal of the IC package. 1. A socket for electric parts comprising:a socket body that accommodates an electric parts having a lower surface to which a terminal is provided;a contact pin provided for the socket body and formed with an elastic piece comprising a contact portion to contact the terminal of the electric parts; anda latch provided for the socket body to be rotatable about a rotation shaft and configured to press the electric parts accommodated in the socket body from an upper side thereof,wherein the elastic piece of the contact pin is extended substantially along a horizontal direction, the latch is formed with a pressing portion, and when the latch is rotated in an opening direction thereof, the elastic piece is pressed downward by the pressing portion so as to be elastically deformed downward so that the contact portion is displaced downward so as to be separated downward from a contacting position to the terminal of the electric parts, and when the latch is rotated in a closing direction thereof, the electric parts is pressed from an upper side to thereby release a pressing force of the pressing portion applied to the elastic piece so as to displace the ...

Power Supply System

A power supply system is disclosed which comprises a printed circuit board ( 10 ) having on one side of the substrate thereof a live track ( 58 ), a neutral track ( 54 ) and a switched live track ( 52 ). A switch ( 30 ) when closed connects the live track to the switched-live track ( 52 ). The tracks ( 52, 58 ) connect live input terminal ( 12 ) to a live output terminal ( 20 ) and a neutral input terminal ( 16 ) to a neutral output terminal ( 18 ). A second switched-live track connected to the track ( 58 ) is provided on the opposite side of the substrate.

SPRING LOADED LID

A method and apparatus for loading IC's into a socket lid is disclosed. The IC is first loaded into a lid. Once the IC has been loaded into the lid, the lid is rotated into a closed position on the frame. The lid is then locked in place on the frame by rotating at least one locking lever into a closed lacked position, where the locking lever forces the lid down against the socket contacts against a spring. 1. An apparatus , comprising:a frame to be attached to a primary surface of a PC board;a first locking lever mounted in the frame and configured to be rotated between an open position and a closed position wherein the first locking lever is mounted on one side of the frame;a lid, the lid having a hinge pin on one side of the lid;the frame having a pivot channel formed near the first locking lever wherein the hinge pin couples to the pivot channel and allows the lid to pivot between an open position and a closed position, the pivot channel having a length d between a top end and a bottom end of the pivot channel;at least one spring, the at least one spring acting to force the hinge pin towards the top end of the pivot channel;wherein the hinge pin is forced down towards the bottom end of the pivot channel when the lid is in the closed position and the first locking lever is moved from its open position into its closed position.2. The apparatus of claim 1 , wherein the hinge pin removably snaps into the pivot channel.3. The apparatus of claim 1 , wherein the lid further comprises:a spring loaded section, the spring loaded section having the hinge pin attached on a first side;a detachable section, the detachable section removably snapping into a second side of the spring loaded section, wherein the second side is opposite the hinge pin.4. The apparatus of claim 1 , wherein the lid further comprises:a first side channel and a second side channel, the second side channel opposite the first side channel, wherein the two side channels are parallel;an independent ...

Method And Apparatus For Virtualizing Hardware Dongle Over A Wireless Connection

In a computer system configured to handle I/O signals received by the computer system from input devices and/or output signals output by the computer system, a virtual attachment module includes logic for selecting such that program code for coupling can alter the operating system's selection of I/O devices used for particular I/O device operations, coupling to a wireless I/O device at least for determining whether the wireless I/O device is available, and causing redirection of I/O signals destined to a default I/O device to be to the wireless I/O device, if the program code for coupling determines that the wireless I/O device is available. A virtual connection module could be used to intercept system messages indicating a wireless device is present and connected, determine whether the wireless device is present and/or connected, and determine which intercepted messages to forward, drop, delay or reformulate.

Interconnect device

An interconnect device includes a contact assembly having a carrier holding an array of conductors. Each of the conductors have opposite first and second ends configured to engage corresponding first and second electrical components. The conductors define conductive paths between the first and second ends to electrically interconnect the first and second electrical components. The interconnect device includes a frame defining a receiving space configured to receive the first electrical component therein. The frame includes corner frames having metal spring fingers configured to engage different side edges of the first electrical component to locate the first electrical component in the receiving space. The spring fingers are deflectable and are configured to be spring biased against corresponding side edges of the first electrical component.

SURFACE MOUNT DEVICE

A surface mount device in which a pin adapter that is integrally formed with a plurality of pins connects a base board and a main board is provided to enable an automatic mounting, to enable a reflow soldering, to increase the flexibility of design, and to satisfy requirements of customers. In the surface mount device, a pin adapter that is formed integrally with a plurality of pins is placed on a base board , the base board and the main board are connected by inserting the tips of the pins into the corresponding locations of the main board , the leg portions of the pin adapter are folded toward inside, and opening sections are formed at the leg portions. 1. A surface mount device , comprising:a main board on which electronic components are mounted;a base board; anda pin adapter, having a plurality of pins, and the pin adapter is fixed on the base board;wherein tips of the pins that are narrower than the other portions of the pins are inserted into holes disposed in the main board; andthe main board and the base board are connected with each other.2. A surface mount device , comprising:a main board on which electronic components are mounted;a base board; anda pin adapter, formed by integrating a plurality of metallic pins stood in a vertical direction and the pin adapter is placed on the base board;wherein tips of the pins are inserted into holes disposed at corresponding positions of the main board to connect the main board and the base board; anda cover is placed to cover the main board and the pin adapter.3. The surface mount device according to claim 1 , whereinin the pin adapter, leg portions of the pins which is at a side not being connected to the main board are folded toward inside on the pin adapter, andopening sections are formed at the leg portions of the pins.4. The surface mount device according to claim 1 , whereinposition-determining pins are formed on a bottom face of the pin adapter;concave portions are formed at positions corresponding to the ...

Connection terminal structure, interposer, and socket

A connection terminal structure includes a substrate having one surface and including a pad formed on the one surface, a bonding part constituted by a solder, and a connection terminal having first and second ends and including a fixing part formed on the first end and a connection part formed on the second end. The fixing part includes a first surface that is bonded to the pad by way of the bonding part. The connection terminal includes a pad facing surface that faces the pad and includes the first surface. The connection terminal includes at least one groove that is formed in the pad facing surface. The at least one groove extends from the first surface to the connection part. A portion of the solder that constitutes the bonding part fills in the at least one groove.

Multi-chip socket

Embodiments provide a multi-chip socket including multiple cavities. The multiple cavities include support surfaces. The support surfaces may be disposed at different heights relative to a reference plane. The different heights may be determined in response to a height of a first component to be disposed in the first cavity and a height of a second component to be disposed in a second cavity.

ELECTRICAL CONNECTOR AND CARRIER THEREOF FOR ASSEMBLING IC PACKAGE

An electrical connector () for electrically connecting an IC package () with a substrate and includes an insulative housing () with a plurality of contacts () received therein, a load plate () pivotally covered the insulative housing (), a carrier () assembled to the load plate () for holding the IC package () and a lock member () for positioning the load plate () in a closed position, the carrier () comprises a holding member () and a sliding member () assembled to the holding member (), the holding member () and the sliding member () both comprises a position portion () fastened with the load plate (), and the sliding member () slides along the holding member () to make the position portion () of the sliding member () fastened with the load plate (). 1. An electrical connector for electrically connecting an IC package with a substrate , comprising:an insulative housing;a plurality of contacts received in the insulative housing;a load plate pivotally covered the insulative housing;a carrier assembled to the load plate for holding the IC package; anda lock member positioned the load plate in a closed position; whereinthe carrier comprises a holding member and a sliding member assembled to the holding member; whereinthe holding member and the sliding member both comprises a position portion, the sliding member slides along the holding member to make the two position portions fastened with the load plate.2. The electrical connector as claimed in claim 1 , wherein the load plate includes an opening claim 1 , the sliding member slides along the holding member to make the distance of the two position portions short so that the two position portions can locate in the opening and then the sliding member slides along the holding member to make the two position portions lock with the load plate.3. The electrical connector as claimed in claim 2 , wherein the holding member further comprises orientate portion located in the opening.4. The electrical connector as claimed in ...

MODULAR ELECTRONIC HEADER ASSEMBLY AND METHODS OF MANUFACTURE

A device for electrically interconnecting and packaging electronic components. In one embodiment, a modular non-conducting base member having one or more component recesses and a plurality of lead channels formed therein is provided. At least one electronic component is disposed within the recess, and the wire leads of the component routed through the lead channels to a conductive lead terminal. A plurality of lead terminals, adapted to cooperate with the non-conducting base member, are received therein, and adapted to place the device in signal communication with an external printed circuit board. The modular non-conducting base members are assembled or stacked to form a unitary modular assembly. Methods for fabricating the device are also disclosed. 130-. (canceled)31. A modular electronic apparatus for mounting onto an external substrate , comprising:a printed circuit board comprising a first layer comprised of a plurality of surface mountable conductive interfaces; a non-conductive base member having an electronic component receiving cavity formed therein;', 'a plurality of surface-mountable signal conducting elements disposed at least partially within said non-conductive base member on a bottom surface thereof; and, 'a plurality of substantially identical modular headers, each of said modular headers comprisinga cover at least partially enclosing said plurality of modular headers; anda plurality of electronic components at least partially disposed within said electronic component receiving cavities of said modular headers, at least one of said plurality of electronic components comprising a wire having two ends, said ends of said wire being wire wrapped around respective ones of at least a portion of said surface-mountable signal conducting elements;wherein at least a portion of said plurality of surface-mountable signal conducting elements are soldered to said first layer comprised of a plurality of surface mountable conductive interfaces of said multi-layer ...

Electrical connector assembly having shielding device for emi thereof

An electrical connector assembly for electrically connecting a central processing unit (CPU) to a printed circuit board (PCB), includes an electrical connector and a shield device. The electrical connector includes an insulative housing, a number of contacts received in the insulative housing, and a load plate mounted upon the insulative housing. The shield device includes an upper section providing a loading force to the load plate, and side sections located on four sides of the electrical connector.

ELECTRICAL CONNECTOR WITH CAP FOR COVERING PARTIAL RECEIVING HOLES

An electrical connector includes an insulating housing having a bottom wall defining an upper surface, a lower surface opposite to the upper surface and a number of receiving holes running through the upper and lower surfaces; a number of contacts received in the receiving holes wherein the number of the contacts is less than the number of the receiving holes, partial receiving holes are vacant; and a cap assembled on the upper surface of the bottom wall and covering the vacant receiving holes to form a non-conductive portion. 1. An electrical connector for electrically connecting an IC package with a printed circuit board comprising:an insulating housing comprising a bottom wall having an upper surface and a lower surface opposite to each other and a plurality of receiving holes running through the upper and lower surfaces;a plurality of contacts received in the receiving holes, wherein the number of the contacts is less than the number of the receiving holes, partial receiving holes are vacant; andat least one cap assembled on the upper surface of the bottom wall and covering at least one of the vacant receiving holes to form a non-conductive portion.2. The electrical connector as claimed in claim 1 , wherein the cap comprises a base portion covering on the receiving holes and a retention portion retaining in the insulating housing.3. The electrical connector as claimed in claim 2 , wherein the retention portion extends downwardly from the base portion and engages with the receiving holes.4. The electrical connector as claimed in claim 2 , wherein the cap comprises a position post extending upwardly from the base portion.5. The electrical connector as claimed in claim 4 , wherein the insulating housing comprises a side wall extending upwardly from the bottom wall claim 4 , the position post abuts an inner surface of the side wall.6. The electrical connector as claimed in claim 5 , wherein the insulating housing comprises a retention hole claim 5 , the retention ...

LED DISPLAY SCREEN CASE

An LED display screen case includes a module, a HUB plate, a case frame, a power supply and a receiving card. One side of the HUB plate is connected with the module by a plug A and an interface A in a plugging mode. The other side of the HUB plate is connected with the receiving card by a plug B and an interface B in the plugging mode. A through hole is formed at a position corresponding to the plug B on the case frame. The plug B passes through the through hole. The receiving card and the HUB plate are connected by the plug B and the interface B in the plugging mode and fixed to the two sides of the case frame. This kind of connection type reduces the space inside the case for accommodating devices, and also ensures the good radiating effect of the case. 21. The display screen case according to Claim , the plug/unplug connection of plug A and interface A is the plug/unplug connection of the pin header and the female header or that of the wall base and the female header.31. The display screen case according to Claim , the plug/unplug connection of plug B and interface B is the plug/unplug connection of the female header and the wall base or that of the pin header and the female header.41. The display screen case according to Claim , the power supply is set on the same side as the receiving card is and a power supply holder for fixing the power supply to the screen case frame is provided inside the LED display screen case.5. The display screen case according to claim 4 , the holes are provided on the power supply holder claim 4 , screw holes are provided at the locations on the screen case frame corresponding to the holes claim 4 , and screws are used to fix the power supply by being inserted through the holes and screw holes of the power supply holder.6. The display screen case according to claim 4 , the power supply holder is set with an extending part oriented to the screen case frame wherein clasps are provided on the extending part. Additionally claim 4 , a card ...

ELECTRONIC DEVICE

An electronic device includes a housing having an open portion at a part of a surface thereof, a door portion having at the open portion, a first face and a second face to be selectively exposed by rotation thereof, and a cradle having a connector and provided on the first face. The cradle is rotatable between a first attitude and a second attitude around a rotation axis line perpendicularly intersecting the first face. 1. An electronic device comprising:a housing having an open portion at a part of a surface thereof;a door portion having a first face and a second face to be selectively exposed at the open portion by rotation thereof around a predetermined rotation axis line; anda cradle having a connector and provided on the first face.2. The electronic device according to claim 1 , wherein the cradle is configured to be rotatable between a first attitude and a second attitude around a cradle rotation axis line perpendicularly intersecting the first face.3. The electronic device according to claim 2 , wherein the first face is flush or protrudes relative to a face surrounding the open portion.4. The electronic device according to claim 2 , wherein the first attitude is an attitude in which the whole cradle is received within the first face claim 2 , and the second attitude is an attitude in which a part of the cradle extends beyond the first face.5. The electronic device according to claim 1 , wherein the first face and the second face are set as two cut faces which are obtained by cutting a right circular cylinder around the predetermined rotation axis line by a flat face parallel to the predetermined rotation axis line and which do not intersect with each other.6. The electronic device according to claim 1 , wherein the first face and the second face are the same in width in a direction perpendicularly intersecting the predetermined rotation axis line.7. The electronic device according to claim 1 , wherein the door portion has a lateral cross section formed into ...

Direct plug element having improved contacting

A direct plug element for contacting an electrical contact includes: a two-piece flexible direct contact having a first, separate spring element, and a second, separate spring element, the first spring element and the second spring element being situated one behind the other in a contact direction, and a first spring force of the first spring element and a second spring force of the second spring element is directed in essentially the same direction, and the second spring element includes a contact region.

Integrated circuit retention mechanism with retractable cover

A computer processor retention device comprises a load frame, a load plate, and a pair of retractable cover members. The load frame may be secured to a circuit board around a processor mounting site. The load plate is pivotally coupled to the load frame and is pivotable between being open for receiving a processor at the processor mounting site and closed in engagement with a periphery of the received processor. The load plate has a window that is open to the processor mounting site when the load plate is closed. The retractable cover members span the window and are alternately movable along a track toward one another to cover the processor mounting site and away from one another to expose the processor mounting site.

DIP SOCKET

Disclosed herein is a dip socket, including: a first pin connecting part and a second pin connecting part provided by forming a plurality of connecting members connected with a plurality of pins of a dip module in a line, respectively; and a width controlling means provided between the first pin connecting part and the second pin connecting part and configured to control a width between the first pin connecting part and the second pin connecting part. 1. A dip socket , comprising:a first pin connecting part and a second pin connecting part provided by forming a plurality of connecting members connected with a plurality of pins of a dip module in a line, respectively; anda width controlling means provided between the first pin connecting part and the second pin connecting part and configured to control a width between the first pin connecting part and the second connecting part.2. The dip socket as set forth in claim 1 , wherein the width controlling means includes:a guide frame provided at the side of the first pin connecting part; anda slide frame provided at the side of the second pin connecting part so as to face the guide frame and be coupled with the guide frame,the slide frame being slid along the guide frame to control the width between the first pin connecting part and the second pin connecting part.3. The dip socket as set forth in claim 2 , wherein the width controlling means further includes a fixing member fixing the guide frame and the slide frame to each other.4. The dip socket as set forth in claim 3 , wherein the guide frame has a screw hole penetrating through the inside and the outside claim 3 , andthe fixing member is formed of a screw,the screw being coupled with the screw hole to fix the slide frame.5. The dip socket as set forth in claim 1 , wherein the first pin connecting part and the second pin connecting part include distance controlling means controlling a distance between the plurality of connecting members so as to correspond to a ...

NETWORKED COMMUNICATIONS SYSTEM AND SEGMENT ADDRESSABLE COMMUNICATIONS ASSEMBLY BOX, CABLE AND CONTROLLER

A communication systems providing a fault-tolerant communications path for narrow and broad band communication comprising one or more self-powered satellite units each providing signal information to at least one command console through a segmented cable assembly system in operable communication with a central station that receives signal information from the at least one command console and relays signal information back to the command console wirelessly and via the segmented cable assembly system. 1. A communication systems providing a fault-tolerant communications path for narrow and broad band communication comprising:one or more self-powered satellite units each providing signal information to at least one command console through a segmented cable assembly system;a central station that receives signal information from the at least one command console and relays signal information back to the command console wirelessly and via the segmented cable assembly system.2. The communication system of claim 1 , wherein the segmented cable assembly system is powered by a controller outfitted with a transceiver and an external high gain antenna.3. The communication system of claim 1 , wherein the segmented cable assembly system includes a repeater.4. The communications system of claim 1 , wherein the cable assembly includes a UWB radio and antenna.5. A cable assembly comprisingone or more fixed length cable segments, each segment linked to a junction box having a repeater system to extend a signal communications range significantly further than 3000 feet.6. The cable assembly of claim 5 , wherein the each segment includes a metal casing and core bundle wrapped with an aerogel material.7. The cable assembly of claim 5 , wherein each segment includes a stress release system claim 5 , each segment configured for 2600 pounds of longitudinal force.8. The cable assembly of claim 5 , wherein each segment will re-broadcast a signal selected from the group consisting of UWB claim 5 ...

Electrical connector assembly with jumper element assembled thereon

An electrical connector assembly includes an insulating housing, a jumper element assembled in the insulating housing and a bracket located at the outside of the insulating housing. The insulating housing includes a pocket defining an opening. The bracket includes a retention portion extending into the pocket for retaining the jumper element into the pocket and a latch beside the opening of the pocket. The jumper element includes a protrusion engaging with the latch. The jumper element is assembled into the pocket in a vertical direction and can be pulled out through the opening in the horizontal direction with the latch sliding along the protrusion and finally disengaging the protrusion.

ELECTRONIC COMPONENT DEVICE, METHOD OF MOUNTING ELECTRONIC COMPONENT DEVICE ON CIRCUIT BOARD, AND MOUNTING STRUCTURE OF ELECTRONIC COMPONENT DEVICE ON CIRCUIT BOARD

An electronic component device includes a mount substrate including an outer electrode on one principal surface and a mount electrode on another principal surface, at least one substrate component including a terminal electrode on one principal surface, and that is mounted on the mount substrate by joining the terminal electrode to the mount electrode, and a sealing resin layer that is provided on the mount substrate on which the at least one substrate component is mounted. The sealing resin layer includes a region with a large thickness, and a top surface including an inclination. 1. An electronic component device comprising:a mount substrate including an outer electrode on one principal surface and a mount electrode on another principal surface;at least one substrate component including a terminal electrode on one principal surface, and that is mounted on the mount substrate by the terminal electrode being joined to the mount electrode; anda sealing resin layer that is provided on the mount substrate on which the at least one substrate component is mounted; whereinthe sealing resin layer includes an increased thickness region, and a top surface including an inclination.2. The electronic component device according to claim 1 , wherein when viewed in a planar direction:the mount substrate includes a region with a reduced formation density of the outer electrode; andthe region of the sealing resin layer with the increased thickness and the region of the mount substrate with the reduced formation density of the outer electrode overlap each other.3. The electronic component device according to claim 1 , whereina plurality of the outer electrodes are provided;the outer electrodes include a signal outer electrode and a ground outer electrode; andwhen viewed in a planar direction:the mount substrate includes a region with an increased formation density of the ground outer electrode; andthe increased thickness region of the sealing resin layer and the region of the mount ...

UNIVERSAL REPLACEABLE FAN UNIT FOR DATACENTERS

A universal replaceable fan unit and method of reversing an airflow direction of a universal replaceable fan unit is provided. The universal replaceable fan unit includes a fan assembly designed to create an airflow from an intake end to an output end. The universal replaceable fan unit also includes a fan mounting that receives and secures the fan assembly in an operable position. The fan mounting includes a frame member and a securing member. The fan mounting is designed to allow the fan assembly to be moved between a first position defining a first airflow direction and a second position defining a second airflow direction. The first airflow direction is opposite the second airflow direction. The universal replaceable fan unit further includes an electrical connector removably attached to the fan assembly. The electrical connector allows electricity to be provided to the fan assembly for operation. 1. A universal replaceable fan unit for cooling , the universal replaceable fan unit comprising:a fan assembly comprising an intake end and an output end, wherein the fan assembly is configured to create an airflow from the intake end to the output end; a frame member; and', 'a securing member,', 'wherein the fan mounting is configured to allow the fan assembly to be moved with respect to the fan mounting between a first position defining a first airflow direction and a second position defining a second airflow direction, wherein the first airflow direction is opposite the second airflow direction; and, 'a fan mounting configured to receive and secure the fan assembly in an operable position, the fan mounting comprisingan electrical connector removably attached to the fan assembly, wherein the electrical connector is configured to allow electricity to be provided to the fan assembly for operation.2. The universal replaceable fan unit of claim 1 , wherein the frame member defines a first edge and a second edge; andthe securing member comprises a first clipping mechanism ...

Electrical connector assembly having hybrid conductive polymer contacts

An electrical connector assembly includes a carrier having an upper surface and a lower surface. The carrier includes a plurality of contact openings therethrough. The electrical connector assembly includes contacts coupled to the carrier and passing through the corresponding contact openings. Each contact has a conductive polymer column extending between an upper mating interface and a lower mating interface. The conductive polymer column includes an inner core manufactured from a first material and an outer shell manufactured from a second material. The second material has a higher electrical conductivity than the first material. The first material has a lower compression set than the second material.

SERVER CABINET AND SERVER SYSTEM

A server cabinet includes a left side wall panel, a right side wall panel, a rear side wall panel and at least one mounting plate. Each of the mounting plates is connected to the left side wall panel and the right side wall panel, and is configured to mount an external server node. A position limiting mechanism is provided on the rear side wall panel, and is configured to limit a relative position between the mounting plate and the external server node mounted on this mounting plate. 1. A server cabinet , comprising:a left side wall panel, a right side wall panel, a rear side wall panel and at least one mounting plate, wherein,each of the at least one mounting plate is connected to both the left side wall panel and the right side wall panel, and is configured to mount an external server node, anda position limiting mechanism is provided on the rear side wall panel, and is configured to limit a relative position between the mounting plate and the external server node mounted on the mounting plate.2. The server cabinet according to claim 1 , wherein claim 1 ,the position limiting mechanism comprises at least one set of position limiting holes provided at a designated position in the rear side wall panel, andeach set of the position limiting holes are configured to engage with guide pins on the external server node, to limit a distance from the external server node to the left side wall panel and a distance from the external server node to the right side wall panel, respectively.3. The server cabinet according to claim 2 , wherein claim 2 ,each set of the position limiting holes comprise a first position limiting hole and a second position limiting hole, wherein,a connection line connecting a center of the first position limiting hole and a center of the second position limiting hole is perpendicular to a horizontal plane, and a distance from the first position limiting hole to the horizontal plane is greater than a distance from the second position limiting hole to ...

Carrier

A carrier includes a base on which a circuit board is mounted, a loading device mounted on the base, a first pressing device mounted on the base, and a second pressing device mounted on the base. The loading device is configured to load an electronic device on the base. The first pressing device is configured to press a first lead end protruding from the electronic device on the circuit board to electrically contact the circuit board. The second pressing device is configured to press a second lead end of the electronic device on the base. 1. A carrier , comprising:a base on which a circuit board is mounted;a loading device mounted on the base and configured to load an electronic device on the base;a first pressing device mounted on the base and configured to press a first lead end protruding from the electronic device on the circuit board to electrically contact the circuit board; anda second pressing device mounted on the base and configured to press a second lead end of the electronic device on the base.2. The carrier of claim 1 , wherein the base has a positioning post and the loading device has a center hole in which the positioning post is received.3. The carrier of claim 2 , further comprising a carrier pressing block holding the loading device on the base.4. The carrier of claim 3 , wherein the carrier pressing block is rotatably installed on a top surface of the positioning post and rotates between a press position and a release position.5. The carrier of claim 4 , wherein claim 4 , in the press position claim 4 , the carrier pressing block presses the loading device to hold the loading device on the base claim 4 , and in the release position claim 4 , the carrier pressing block is separated from the loading device to allow the loading device to be detached from the base.6. The carrier of claim 2 , wherein the loading device has an upper flange portion claim 2 , a lower flange portion claim 2 , and a neck portion between the upper flange portion and the ...

ELECTRICAL CONNECTOR ASSEMBLY AND METHOD OF ASSEMBLING THE SAME

An electrical connector assembly includes an insulating housing having a number of housing segments, a number of contacts received in the housing segments, a number of caps covering on the housing segments respectively and a number of clips assembled on the caps. Each of the caps includes a retaining mechanism defining an arm for operating by a user and a latch engaging the housing segment. Each of the clips is assembled on the arms of at least two caps so as to operate two caps together. 1. An electrical connector assembly for electrically connecting an IC package with a printed circuit board comprising:an insulating housing comprising a plurality of housing segments arranged side by side in a horizontal plane;a plurality of contacts received in the housing segments for contacting the IC package;a plurality of caps covering on the housing segments respectively and correspondingly, each of the caps comprising a retaining mechanism for retaining the cap on the housing segment, the retaining mechanism comprising at least a latch engaging the housing segment and an arm for being grabbed; anda clip assembled on the caps, the clip comprising a combining portion assembled on the arms of at least two caps for combining said two caps together and an operation portion for being operated by a user to remove said two caps together.2. The electrical connector assembly as claimed in claim 1 , wherein the combining portion comprises a gripping portion extending in a longitudinal direction defining a slot and a pair of hook portions at two sides of the gripping portion in the longitudinal direction.3. The electrical connector assembly as claimed in claim 2 , wherein each of the caps comprises two retaining mechanisms at two opposite ends of the cap claim 2 , the retaining mechanisms on the same ends of the caps are in the same line in the longitudinal direction.4. The electrical connector assembly as claimed in claim 2 , wherein the length of the combining portion is at least ...

Shielded sockets for microprocessors and fabrication thereof by overmolding and plating

Shielded sockets for microprocessors and fabrication of shielded sockets by overmolding and plating techniques are described. In an example, a socket for a packaged semiconductor device includes a plastic housing having walls surrounding a cavity. A plurality of contact strips is disposed in the cavity and supported by one or more of the walls of the plastic housing. Each of the plurality of contact strips includes a plurality of contacts. Each of the plurality of contacts includes a vertical region overmolded with plastic, a contact portion, and a J-lead portion. The plastic is coated with a metal layer.

GLASS PANEL WITH INTEGRATED ELECTRONIC DEVICE

The invention relates to a panel comprising (i) at least a first () outer and a second () inner glass sheet combined together by a means () of maintaining the two glass sheets at a certain distance between the two glass sheets (), (ii) an electronic device provided between the at least a first and a second glass sheet, (iii) an inner cable () to connect electrically the electronic device. According to the invention, the inner glass comprises an opening arranged in the area of at least one of its extremity to allow the inner cable () to pass through the said opening (). 1. A panel comprising:a. at least a first outer and a second inner glass sheet combined together by a means of maintaining the two glass sheets at a certain distance between the two glass sheets,b. an electronic device provided between the at least a first and a second glass sheet,c. an inner cable to connect electrically the electronic devicewherein the inner glass sheet comprises an opening arranged in an area of at least one of its extremities to allow the inner cable to pass through the opening.2. The panel according to claim 1 , the opening is arranged in the an area of a corner of the inner glass sheet and preferably in the lower part of the inner glass sheet.3. The panel according to claim 1 , wherein the opening is a cut-out and a shape of the cut-out is selected from the group consisting of triangular claim 1 , C-shape U-shape and circular.4. The panel according to wherein the panel is placed on a facade of a building.5. The panel according to claim 4 , wherein the cut-out is filled with an insertion piece having a shape of said opening.6. The panel according to claim 1 , wherein the panel is an insulated glazing panel and wherein the at least first and second glass sheets are separated by a spacer disposed between the at least first and second glass sheets that extends along a periphery of the glass sheets.7. The panel according to claims 6 , wherein the spacer has a rectangular shape or ...

SHIELDED ELECTRONIC COMPONENT PACKAGE

An electronic component package includes a substrate and an electronic component mounted to the substrate, the electronic component including a bond pad. A first antenna terminal is electrically connected to the bond pad, the first antenna terminal being electrically connected to a second antenna terminal of the substrate. A package body encloses the electronic component, the package body having a principal surface. An antenna is formed on the principal surface by applying an electrically conductive coating. An embedded interconnect extends through the package body between the substrate and the principal surface and electrically connects the second antenna terminal to the antenna. Applying an electrically conductive coating to form the antenna is relatively simple thus minimizing the overall package manufacturing cost. Further, the antenna is relatively thin thus minimizing the overall package size. 120-. (canceled)21. An electronic component package comprising:an electronic component having a component top side, a component bottom side, a component first lateral side, a second component second lateral side;{'claim-text': ['a substrate upper side coupled to the die bottom side;', 'a substrate lower side;', 'a substrate near side;', 'a substrate far side;', 'a substrate first lateral side; and', 'a substrate second lateral side;'], '#text': 'a substrate comprising:'}{'claim-text': ['a conductive wall extending lengthwise from the substrate near side to the substrate far side, and extending vertically from the substrate upper side;', 'a sidewall covering at least a portion of the substrate first lateral side and extending vertically beyond the substrate upper side; and', 'a shield lid extending from the conductive wall to the sidewall;'], '#text': 'a shielding structure defining a shielded compartment, the electronic component disposed within the shielded compartment, wherein the shielding structure comprises:'}a molding material within the shielded compartment, the ...

CONNECTORS FOR INTEGRATED CIRCUIT PACKAGES

Apparatuses, systems and methods associated with connector design for mating with integrated circuit packages are disclosed herein. In embodiments, a connector for mating with an integrated circuit (IC) package may include a housing with a recess to receive a portion of the IC package and a contact coupled to the housing and that extends into the recess. The contact may include a main body that extends from the housing into the recess and a curved portion that extends from an end of the main body, wherein the curved portion loops back and contacts the main body. Other embodiments may be described and/or claimed. 1. A connector for mating with an integrated circuit (IC) package , comprising:a housing with a recess to receive a portion of the IC package; anda contact coupled to the housing and that extends into the recess, wherein the contact includes:a main body that extends from the housing into the recess; anda curved portion that extends from an end of the main body, wherein the curved portion loops back and contacts the main body.2. The connector of claim 1 , wherein an end of the curved portion contacts the main body claim 1 , wherein the end of the curved portion is located opposite from where the curved portion extends from the main body.3. The connector of claim 2 , wherein the end of the curved portion is affixed to the main body via solder or electrically-conductive epoxy.4. The connector of claim 1 , wherein the main body extends along a side of the recess claim 1 , and wherein the curved portion loops back away from the side of the recess.5. The connector of claim 1 , wherein the curved portion is to contact a pad of the IC package when the connector is mated with the IC package.6. The connector of claim 1 , wherein the curved portion extends from the end of the main body at an angle to the main body.7. The connector of claim 1 , wherein the curved portion extends from the end of the main body along a same plane as the main body.8. A computer device claim ...

MIXER PITCH ARRANGEMENT FOR CPU SOCKET

A CPU socket has an insulative housing equipped with two groups of contacts of different pitches from each other wherein either each group of contacts are arranged with the corresponding contacting arms extending in opposite directions to counterbalance the imposed/reaction forces itself or the two group of contacts are arranged with the corresponding contacting arms extending in opposite direction to somewhat counterbalance the imposed/reaction force during receiving a CPU therein, and or in a mixed manner, i.e., one group of contact with the corresponding contacting arms in the same direction while the other of contacts with the corresponding contacting arms extending in both opposite directions to achieve the total reaction forces in a substantial balanced manner. 1. A CPU (Central Processing Unit) socket for coupling with a CPU , comprising:an insulative housing;a plurality of passageways formed in the housing and arranged in matrix;a plurality of contacts disposed in the corresponding passageways, respectively; andsaid contacts being categorized with a first group contacts having a first pitch, and a second group contacts having a second pitch different from the first pitch.2. The CPU socket as claimed in claim 1 , wherein the first group contacts are located in a center region of the housing while the second group contacts are located in a peripheral region of the housing surround the center region.3. The CPU socket as claimed in claim 2 , wherein the first group contacts are arranged with two parts claim 2 , having corresponding deflectable contacting arms extending in opposite directions claim 2 , respectively claim 2 , for counterbalancing reaction forces.4. The CPU socket as claimed in claim 3 , wherein the second group contacts are arranged with two parts claim 3 , having the corresponding deflectable contacting arms extending in opposite direction claim 3 , respectively claim 3 , for counterbalancing reaction forces.5. The CPU socket as claimed in claim ...

SEMICONDUCTOR ASSEMBLY

An example semiconductor assembly can include a hingeably-coupled component that receives a semiconductor board. In some examples, the component can be hingeably rotated to an open position to receive the semiconductor board. In some examples, the component can be hingeably detached from the assembly to receive the semiconductor board. 1. A semiconductor assembly , comprising:a carrier, to receive a semiconductor board, wherein a plurality of optical transceivers are coupled to a surface of the semiconductor board;a socket component hingeably coupled to the carrier and coupled to a system board; andthe system board.2. The semiconductor assembly of claim 1 , wherein each of the plurality of optical transceivers coupled to the semiconductor board is encased within an optical connector to manually mate a plurality of optical cables to each corresponding optical connector.3. The semiconductor assembly of claim 1 , wherein each of a plurality of hinges coupled to the carrier includes a vertical slot to allow the carrier to move vertically on the vertical slots.4. The semiconductor assembly of claim 1 , wherein the semiconductor board includes:a semiconductor chip coupled to a first surface of the semiconductor board;a first plurality of electrical connectors coupled to a second surface of the semiconductor board, wherein a second plurality of electrical connectors coupled to the system board mates with each of the corresponding first plurality of electrical connectors to electrically connect the semiconductor board to the system board.5. The semiconductor assembly of claim 4 , wherein the assembly includes a locking system to lock the carrier to the socket component when the semiconductor board is mated with the system board.6. A semiconductor assembly claim 4 , comprising:a socket component hingeably coupled to a system board and to receive a semiconductor board; a semiconductor chip is coupled to the first surface; and', 'a plurality of optical transceivers coupled to ...

LIQUID COOLANT BASED THERMAL ENERGY MANAGEMENT FOR CONTAINERS RECEIVING PLUGGABLE CIRCUIT MODULES

Embodiments include apparatuses, methods, and systems for managing thermal energy of a computing device. An apparatus may include a heat pipe physically and thermally attached to a container by a retainer. The container may include a plurality of slots to removably receive various plurality of pluggable circuit modules during a lifetime of the container. The heat pipe may facilitate a liquid coolant flow to remove thermal energy from a plurality of pluggable circuit modules removably received into the plurality of slots of the container. The retainer may have a tensile strength sufficient to withstand repeated receiving and removal of the various plurality of pluggable circuit modules during the lifetime of the container, without degrading the thermal attachment of the heat pipe to the container below a design performance threshold. Other embodiments may also be described and claimed. 1. An apparatus for managing thermal energy of a computing device , comprising:a heat pipe to facilitate a liquid coolant flow to remove thermal energy from a plurality of pluggable circuit modules removably received into a plurality of slots of a container, wherein the container having the plurality of slots removably receives various plurality of pluggable circuit modules during a lifetime of the container; anda retainer to physically and thermally attach the heat pipe to the container, the retainer having a tensile strength sufficient to withstand repeated receiving and removal of the various plurality of pluggable circuit modules during the lifetime of the container, without degrading the thermal attachment of the heat pipe to the container below a design performance threshold.2. The apparatus of claim 1 , wherein the plurality of pluggable circuit modules include a small form-factor pluggable (SFP) module claim 1 , a compact small form-factor pluggable (CSFP) module claim 1 , a quad small form-factor pluggable (QSFP) module claim 1 , or a quad small form-factor pluggable (QSFP)-DD ...

Socket connector for a power connector system

A socket connector includes a housing having a top, a bottom, a first side wall and a second side wall forming cavities that receive power sockets. The housing includes pin access openings through the bottom that receive power pins mated to the power sockets. Each power socket includes a cable socket receiving a power cable and a pin socket that receives the power pin. The power socket electrically connects the power cable and the power pin. The socket connector includes latches each having a latch release and a latch arm operably coupled to the latch release. The latch arm extends along the corresponding pin access opening and includes a latching surface aligned with the pin access opening configured to engage the power pin to retain the power pin in the housing. The release button is actuated to release the latch arm from the power pin and allow removal of the power pin from the housing.

ELECTRICAL CONNECTOR WITH CARRIER AND COVER

An electrical connector includes an insulative housing and a plurality of contacts retained in the housing, a carrier associated with an electronic package therein to be loaded into the housing, a load plate pivotally mounted by one end of the housing for downwardly abutting against the electronic package for assuring mechanical and electrical connection between the electronic package and the contacts, and a dust cover detachably attached to the carrier during shipping while being removed from the carrier when the electronic package is loaded unto the housing and downwardly pressed by the load plate in a later time. 1. An electrical connector comprising:an insulative housing forming a receiving cavity for receiving an electronic package, and defining opposite ends in a front-to-back direction;a plurality of contacts retained in the housing;a carrier configured to be adapted to retain said electronic package therein and pivotally located by one of said opposite ends of the housing;a dust cover detachably attached to the carrier with a covering plate to cover the receiving cavity when said dust cover is in a horizontal position; anda load plate pivotally located by the other of said opposite ends of the housing;whereinsaid load plate downwardly presses the carrier when both said load plate and said carrier in the horizontal positions.2. The electrical connector as claimed in claim 1 , wherein said load plate further downwardly presses the dust cover.3. The electrical connector as claimed in claim 1 , wherein said carrier is detachably engaged with the housing.4. The electrical connector as claimed in claim 1 , wherein the load plate is pivotally mounted to a rotatable lever mounted around said other end and downwardly pressed by another rotatable lever mounted around said one end.5. The electrical connector as claimed in claim 1 , wherein said carrier is detachably attached to a pivotal seat around said end.6. The electrical connector as claimed in claim 1 , wherein ...

ELECTRONIC COMPONENT

An electronic component capable of downsizing and narrowing of a mounting space. The electronic component includes: a laminated body made up of a plurality of laminated insulator layers and having an upper surface and a bottom surface; a plurality of inner conductors disposed in the laminated body; and a plurality of terminal electrodes electrically connected to the plurality of inner conductors and exposed from the laminated body. The electronic component has a plurality of recesses formed on a bottom surface of the laminated body. The plurality of terminal electrodes includes first conductive parts formed on wall surfaces of the plurality of recesses. 1. An electronic component comprising:a laminated body made up of a plurality of laminated insulator layers and having an upper surface and a bottom surface, the laminated body having a plurality of recesses formed on a bottom surface thereof;a plurality of inner conductors disposed in the laminated body; anda plurality of terminal electrodes electrically connected to the plurality of inner conductors and exposed from the laminated body, the plurality of terminal electrodes including first conductive parts formed on wall surfaces of the plurality of recesses.2. The electronic component according to claim 1 , wherein the laminated body has a rectangular parallelepiped shape claim 1 , and wherein the plurality of recesses include recesses formed at four corners of the bottom surface of the laminated body.3. The electronic component according to claim 2 , wherein the plurality of recesses includes a recess formed at the center of the bottom surface of the laminated body.4. The electronic component according to claim 2 , wherein the recesses formed at the four corners are cutout recesses.5. The electronic component according claim 1 , wherein the plurality of terminal electrodes further includes second conductive parts extending around openings of the plurality of recesses and electrically connecting to the first ...

ELECTRIC CONNECTION BOX

An electric connection box includes a base having a relay mounting portion on which a relay is configured to be mounted. The base has a component mounting portion on which a component is configured to be mounted at a lower position of the relay mounted on the relay mounting portion. The component mounting portion is disposed so that at least a part of the component mounting portion overlaps with an area of the base in which the relay is mounted in a plan view. 1. An electric connection box comprising:a base having a relay mounting portion on which a relay is configured to be mounted,wherein the base has a component mounting portion on which a component is configured to be mounted at a lower position of the relay mounted on the relay mounting portion, andwherein the component mounting portion is disposed so that at least a part of the component mounting portion overlaps with an area of the base in which the relay is mounted in a plan view.2. The electric connection box according to claim 1 ,wherein the component is a joined portion in which end portions of a plurality of electric wires are collectively joined, andwherein the component is configured to be accommodated in the component mounting portion.3. The electric connection box according to claim 2 ,wherein the plurality of electric wires are collectively connected to a joint terminal, andwherein the joint terminal is configured to be accommodated in the component mounting portion.4. The electric connection box according to claim 1 ,wherein a diode is accommodated in and mounted to the component mounting portion. This application claims priority from Japanese Patent Application No. 2019-153847 filed on Aug. 26, 2019, the entire contents of which are incorporated herein by reference.The present invention relates to an electric connection box.An electric connection box such as a junction box or a fuse box mounted on a vehicle such as an automobile includes a base on which electronic components such as a relay and a ...

Socket

A surface-mountable socket has a wiping function. A socket 100 of the present technology can be surface-mounted to a board 210. The socket 100 includes a plurality of contacts 110, and each contact 110 includes a contact portion 112 that can contact a terminal of a semiconductor device, a locking portion 116 connected to the contact portion 112, and a board-side contact portion 118 that extends from the locking portion 116 and can contact a conductive region formed on a board surface. The socket 100 further includes a stopper member 120 that holds the locking portion 116 of the plurality of contacts 110 and a guide member 180 that is disposed so as to oppose the stopper member 120, and the guide member 180 is formed with a plurality of through holes 184 that houses a board-side contact 118 protruding from the stopper member.

Electrical power supply systems including non-freestanding accessories and methods for using same

An electrical power supply system includes a freestanding primary electrical unit, a non-freestanding accessory unit, and an accessory unit support system. The primary electrical unit includes a freestanding cabinet containing a primary electrical component. The accessory unit includes a non-freestanding accessory cabinet containing an accessory electrical component. The accessory unit support system is configured to couple the accessory cabinet to the primary cabinet such that the accessory unit is thereby structurally supported by the primary electrical unit. The accessory cabinet can be selectively decoupled from the primary cabinet and alternatively structurally supported using the accessory support system.

CONTACT PIN AND POWER MODULE PACKAGE HAVING THE SAME

Disclosed herein is a contact pin including: a deformation part elastically deformed; connection parts coupled to both ends of the deformation part; and contact parts coupled to the connection parts coupled to both ends of the deformation part, respectively, and having one end coupled to the connection part and the other end. 1. A contact pin comprising:a deformation part elastically deformed;connection parts coupled to both ends of the deformation part; andcontact parts coupled to the connection parts coupled to both ends of the deformation part, respectively, and having one end coupled to the connection part and the other end.2. The contact pin as set forth in claim 1 , wherein the deformation part is configured of at least one plate spring.3. The contact pin as set forth in claim 1 , wherein the deformation part is configured of two plate springs facing each other claim 1 , and each of the two plate springs is bent outwardly.4. The contact pin as set forth in claim 1 , wherein the other end of the contact part is formed with at least one protrusion forming a point-contact.5. The contact pin as set forth in claim 1 , wherein the contact part is made of any one of carbon steel claim 1 , stainless steel claim 1 , aluminum claim 1 , zinc claim 1 , and magnesium.6. A power module package having a contact pin claim 1 , the power module package comprising:a first substrate mounted with first semiconductor chips;a second substrate mounted with second semiconductor chips; anda contact pin including a deformation part elastically deformed, connection parts coupled to both ends of the deformation part, and contact parts coupled to the connection parts coupled to both ends of the deformation part, respectively, and having one end coupled to the connection part and the other end,wherein the contact pin is disposed between the first and second substrates to electrically connect the first and second substrates to each other while vertically supporting the first and substrates.7 ...

HIGH-POWER ELECTRONIC MODULE AND METHOD FOR MAKING SUCH A MODULE

A power electronic module including at least one pair of power electronic components, each pair including a first and a second component, each component including a first face, configured to be supported on a support and a second face configured to be electrically connected to an electrical circuit with a smaller thermal contact area than the contact area between the first face and the support, and a first and a second support. The first component in each pair is supported by the first support and is connected to a second electrical circuit of the second support and the second component in each pair is supported on the second support and is connected to a first electrical circuit of the first support. 110-. (canceled)11. A power electronic module comprising:a plurality of power electronic components, each power electronic component comprising a first face, configured to be supported on a support in electrical contact with an electrical circuit of the support, and a second face configured to be electrically connected to another electrical circuit with a smaller thermal contact area than the contact area between the first face and the support,a first and a second support arranged approximately parallel to each other and that comprise a first and a second electrical circuit respectively,at least some of the power electronic components are arranged in pairs each comprising a first and a second approximately identical power electronic component,the two power electronic components in a pair have a redundant arrangement, the first power electronic component in the pair being supported by its first face on the first support and connected by its second face to the second electrical circuit, the second power electronic component being supported by its first face on the second support and connected by its second face to the first electrical circuit so as to operate in parallel with the first power electronic component in the pair.12. The power electronic module according to ...

CIRCUIT BOARD MODULE AND METHOD OF ASSEMBLING CIRCUIT BOARD MODULE

To provide a circuit board module capable of effectively performing input and output to and from more than two communication ICs by using only one female connector having multiple terminals, the multiple terminals include at least one first terminal connected to a first circuit pattern on a first side of the sensor circuit board and at least one second terminal connected to a second circuit pattern on a second side thereof. The at least one first terminal includes an overlapping portion at its tip to be laid on the first side and is connected to the first circuit pattern thereon. The at least one second terminal includes a penetrating portion at its tip to penetrate the sensor circuit board and is connected to the second circuit pattern on the second side 1. A circuit board module , comprising:{'b': 60', '61', '62', '63, 'a connector () having at least one first terminal, at least one second terminal, and a ground terminal (, , ), and'}{'b': 90', '93', '94', '90', '90', '90, 'i': a', 'b', 'a, 'claim-text': [{'b': '90', 'i': 'a', 'the circuit board holding the connector on the first side () thereof,'}, {'b': 90', '83', '84', '90', '90', '95, 'i': a', 'b, 'the circuit board () including at least two circuit patterns ( and ) on at least one of the first side () and the second side () thereof to connect the at least two communication ICs () with the connector, respectively,'}], 'a circuit board () to hold at least two communication ICs ( and ) on at least one of a first side () and a second side () opposite to the first side () of the circuit board,'}{'b': '50', 'wherein the at least one first terminal includes an overlapping portion () at its tip, the overlapping portion disposed on the first side of the circuit board to be connected to one of the at least two circuit patterns on the first side,'}{'b': '52', 'wherein the at least one second terminal includes a penetrating portion () at its tip, the penetrating portion penetrating the circuit board to be connected to ...

Power conversion device and electric railroad vehicle equipped with power conversion device

A power conversion device achieves size reduction and reliability by reducing the number of components of the system. The power conversion device has a semiconductor module of a half-bridge configuration in which two semiconductor elements are arranged in series. The semiconductor module has a cuboidal shape and has, along a longitudinal direction thereof, a positive pole terminal, a negative pole terminal, and terminals for inputting or outputting alternating current or for forming a single phase of the power conversion device. In the vertical direction corresponding to a widthwise direction of the cuboid, a plurality of the semiconductor modules are arranged vertically, forming a plurality of phases of the power conversion device. The semiconductor modules of the plurality of phases are installed in contact with a cooling unit, and one or more capacitors are disposed so as to face the cooling unit across the semiconductor modules of the plurality of phases.

CONNECTOR DEVICE FOR A PRINTED CIRCUIT BOARD OF A CONTROL DEVICE FOR A VEHICLE TRANSMISSION, CONTROL SYSTEM FOR A VEHICLE TRANSMISSION AND METHOD FOR ASSEMBLING A CONTROL SYSTEM FOR A VEHICLE TRANSMISSION

A proposal is made for a plug device () for a circuit board of a control unit for a vehicle transmission. At the same time, the circuit board has at least one contact hole. The plug device () has a housing () and at least one contact device arranged in the housing () for a cable () of a peripheral module fed into the housing () and at least one contact plug () that is electrically connected with the contact device and that protrudes at least partially from the housing () for producing an electrical and mechanical connection with the contact hole of the circuit board. 1. A plug device for a circuit board of a control unit for a vehicle transmission , wherein the circuit board comprises at least one contact hole , the plug device comprising:a housing;at least one contact device arranged in the housing for a cable of a peripheral module fed into the housing; andat least one contact plug which is electrically connected to the at least one contact device and protrudes at least partially from the housing, the at least one contact plug configured to provide an electrical and mechanical connection to the at least one contact hole of the circuit board.2. The plug device according to claim 1 , further comprising a chip protection element wherein the chip protection element is attached on at least one of the circuit board and the housing of the plug device claim 1 , the chip protection element configured to cover an end portion of the at least one contact plug that is at least partially protruding from the housing.3. The plug device according to claim 2 , further comprising an insulating agent claim 2 , wherein the insulating agent is arranged in the chip protection element claim 2 , the insulating agent configured to provide electric insulation of the end portion of the at least one contact plug that is at least partially protruding from the housing.4. The plug device according claim 2 , further comprising a chip protection sealing component claim 2 , wherein the chip ...

MULTIPOINT CONTACT CONDUCTION COOLING OF A REMOVABLE DEVICE

Example implementations relate to a host device and a method for thermal management of a removable device, such as a pluggable electronic transceiver comprising a plurality of spring fingers that provide multipoint contact conduction cooling of the removable device. The host device includes a host circuit board having a connector, and a thermal management unit having a cooling component and the plurality of spring fingers. The cooling component is coupled to a portion of the host circuit board and includes a partially protruded portion. Each of the plurality of spring fingers includes a first end coupled to the partially protruded portion, and a second end having a dry contact surface to establish a direct thermal interface with a peripheral surface of the removable device to allow waste-heat to transfer from the removable device to the cooling component through each spring finger. 1. A host device comprising:a host circuit board having a connector; and{'claim-text': ['a cooling component coupled to a portion of the host circuit board, comprising a partially protruded portion; and', 'a plurality of spring fingers spaced apart from each other, wherein each of the plurality of spring fingers comprises a first end coupled to the partially protruded portion, and a second end having a dry contact surface to establish a direct thermal interface with a peripheral surface of a removable device to allow a waste-heat to transfer from the removable device to the cooling component through each spring finger.'], '#text': 'a thermal management unit comprising:'}2. The host device of claim 1 , wherein the plurality of spring fingers comprises at least one of a rotated “J” shaped geometry claim 1 , a spatula shaped geometry claim 1 , a loopback shaped geometry claim 1 , an angled spoon shaped geometry claim 1 , a cantilever shaped geometry claim 1 , a mirrored “S” shaped geometry claim 1 , or a twin rotated “J” shaped geometry.3. The host device of claim 1 , wherein the plurality ...

Additional function device of external power supply module

An additional function device of an external power supply module includes a converter and a connecting line. With an input port configured at the converter in the additional function device, detachable assembly and connection to a power core unit can be achieved, and a plurality of power core units can be further assembled and connected to achieve a composite or redundant power output. Thus, the additional function device of an external power supply module is provided with diversified matching capabilities, enabling the additional function device of the external power supply module to be effectively utilized and reducing resource waste.

Circuit card locating features for pluggable module

A pluggable module includes an outer housing having a cavity between an upper wall and a lower wall. A circuit card is received in the cavity having a card edge configured to be received in a card slot of a communication connector. A circuit card holder engages the circuit card and holds the circuit card in the cavity of the outer housing. The circuit card holder includes a locating fin at a top of the circuit card holder. The locating fin has a sacrificial upper edge configured to engage the outer housing to locate the circuit card holder and the circuit card in the cavity. The sacrificial upper edge is deformed when engaging the outer housing to press the circuit card holder and the circuit card in a downward biasing direction.

COMBINED WIRING BOARD AND METHOD FOR MANUFACTURING COMBINED WIRING BOARD

A method for manufacturing a combined wiring board includes preparing multiple wiring boards, preparing a metal frame having opening portions which accommodate the boards, respectively, positioning the boards in the opening portions of the frame, respectively, and forming multiple crimped portions in the frame by plastic deformation such that the sidewalls of the boards bond to sidewalls of the opening portions in the frame. The preparing of the boards includes forming the sidewalls of the boards such that when the boards are positioned in the opening portions of the frame, the sidewalls of the boards form wide-space portions and narrow-space portions with respect to the sidewalls of the opening portions in the frame, and the forming of the crimped portions includes generating the deformation such that the sidewalls of the opening portions in the frame abut the narrow-space portions of the boards before the wide-space portions of the boards. 1. A method for manufacturing a combined wiring board , comprising:preparing a plurality of wiring boards;preparing a metal frame having a plurality of opening portions configured to accommodate the plurality of wiring boards, respectively;positioning the wiring boards in the opening portions of the metal frame, respectively; andforming a plurality of crimped portions in the metal frame by plastic deformation such that the sidewalls of the wiring boards bond to sidewalls of the opening portions in the metal frame,wherein the preparing of the wiring boards includes forming the sidewalls of the wiring boards such that when the wiring boards are positioned in the opening portions of the metal frame, the sidewalls of the wiring boards form wide-space portions and narrow-space portions with respect to the sidewalls of the opening portions in the metal frame, and the forming of the crimped portions includes generating the plastic deformation such that the sidewalls of the opening portions in the metal frame abut the narrow-space ...

Robot Cleaner and Robot Cleaner System Including the Same

Modules with various functions may be mounted on a robot cleaner, such that the robot cleaner can perform various additional functions other than cleaning while moving. The robot cleaner cleans a floor surface while moving on the floor surface. At the robot cleaner, a module mounting unit on which at least one module capable of performing a function other than cleaning is able to be mounted is disposed.

MEDIA CONTROL CONSOLE

A media control console is described which comprises a lectern type housing, one or more media electronics modules mounted within the lectern type housing, and an umbilical cable carrying electrical power to the media electronics modules and/or control signals to and/or from the media electronics modules. The umbilical cable is durably attachable or permanently attached to the media control console and a fixed electrical installation external to the console. 1. A mobile media control console , comprising:a lectern type housing;one or more media electronics modules mounted within the lectern type housing; andan umbilical cable carrying electrical power to the media electronics modules and/or control signals to and/or from the media electronics modules, the umbilical cable being durably attachable or permanently attached to the media control console and a fixed electrical installation external to the console.2. The mobile media control console according to claim 1 , wherein the fixed electrical installation is a ceiling claim 1 , wall or floor installation to which the umbilical cable is durably or permanently attached at one end.3. The mobile media control console according to claim 1 , further comprising an electrical socket to which an umbilical cable carrying electrical power to the media control console and/or control signals to and/or from the media control console can be attached claim 1 , the electrical socket comprising a security cover which can be locked or otherwise secured over one end of the umbilical cable when the umbilical cable is engaged with the electric socket claim 1 , in which state the security cover inhibits removal of the umbilical cable from the media control console.4. The mobile media control console according to claim 1 , wherein the umbilical cable is at least one of durable claim 1 , toughened claim 1 , armored or reinforced.5. The mobile media control console according to claim 1 , wherein the one or more media electronics modules ...

FASTENING DEVICE FOR EXPANSION CARD

A fastening device for an expansion card includes a first rack, a second rack opposite to the first rack, and a fastener. The first rack defines a first opening. A supporting plate extends from the first rack toward the second rack. A position tab extends up from the supporting plate. The fastener engages with the first rack and comprises a resilient arm. The supporting plate supports a bottom surface of a first end of the expansion card. The position tab is received in a mounting hole defined in the first end of the expansion card. The resilient arm is deformed and extends through the first opening, and is blocked by the first rack and abuts a top surface of the first end of the expansion card. A second end of the expansion card is fastened to the second rack. 1. A fastening device for an expansion card , comprising:a first rack defining a first opening, a supporting plate extending from the first rack in a substantially perpendicular manner, a position tab extending up from the supporting plate;a second rack opposite to the first rack, the supporting plate located between the first rack and the second rack; anda fastener engaging with the first rack and comprising a resilient arm;wherein, in mounting the expansion card, the supporting plate supports a bottom surface of a first end of the expansion card, the position tab is received in a mounting hole defined in the first end of the expansion card, the resilient arm is deformed and extends through the first opening, and is blocked by the first rack and abuts a top surface of the first end of the expansion card, a second end of the expansion card is fastened to the second rack.2. The fastening device of claim 1 , wherein the first rack defines a second opening located below the first opening claim 1 , the fastener further comprises a base body connected to a bottom of the resilient arm claim 1 , an L-shaped hook extends from the base body and is moveable through the second opening claim 1 , when the resilient arm ...

System and Method for Industrial Control Using a High Availability Backplane

Base modules are provided over a backplane network for high availability control of industrial processes or machines. The base modules may include, for example, an I/O base module, which may control the industrial processes or machines and which may releasably receive an I/O function card, an adapter base module, which may communicate with an industrial controller over a separate control network, and a bus expansion base module, which may provide coupling to another bank of base modules. The base modules may be arranged side-by-side via electrical and mechanical connections. Logic of the I/O base module may detect the presence or absence of the I/O function card to allow coupling or bypassing of the I/O function card with respect to the backplane network. 1. An industrial automation module for an industrial control system comprising:an enclosure providing left and right flanking sides; andreleasable electrical connectors supported on the left and right flanking sides exposed to connect adjacent industrial automation modules on the left and right sides,wherein the releasable electrical connectors are configured to provide Ethernet data to a switching node.2. The module of claim 1 , wherein the releasable electrical connectors are configured to provide full duplex Ethernet data.3. The module of claim 1 , further comprising a switching node embedded in the module.4. The module of claim 1 , further comprising a bus slot configured to releasably receive a function card having a switching node.5. The module of claim 4 , further comprising logic configured to bypass the bus slot when a function card is absent.6. The module of claim 1 , wherein the releasable electrical connectors are further configured to provide power to adjacent modules on the left and right sides.7. The module of claim 1 , further comprising releasable mechanical connectors for holding the module to adjacent modules on the left and right sides.8. The module of claim 1 , wherein the releasable electrical ...

Packages with Si-Substrate-Free Interposer and Method Forming Same

A method includes forming a plurality of dielectric layers, forming a plurality of redistribution lines in the plurality of dielectric layers, etching the plurality of dielectric layers to form an opening, filling the opening to form a through-dielectric via penetrating through the plurality of dielectric layers, forming a dielectric layer over the through-dielectric via and the plurality of dielectric layers, forming a plurality of bond pads in the dielectric layer, bonding a device die to the dielectric layer and a first portion of the plurality of bond pads through hybrid bonding, and bonding a die stack to through-silicon vias in the device die. 1. A package comprising:a plurality of dielectric layers;an electrical path extending into some of the plurality of dielectric layers, wherein the electrical path comprises a plurality of damascene structures, each extending into one of the plurality of dielectric layers, and the plurality of damascene structures are interconnected;a through-dielectric via penetrating through the plurality of dielectric layers, wherein the through-dielectric via comprises a homogeneous material continuously extending through the plurality of dielectric layers; anda device die over the plurality of dielectric layers, wherein the device die is electrically coupled to both of the through-dielectric via and the electrical path.2. The package of claim 1 , wherein the plurality of damascene structures comprise dual damascene structures.3. The package of further comprising:a dielectric layer over the plurality of dielectric layers; anda bond pad in the dielectric layer, wherein the bond pad is in contact with the through-dielectric via, and the device die is physically bonded to the bond pad and the dielectric layer.4. The package of further comprising a die stack bonded to a through-silicon via in the device die.5. The package of claim 4 , wherein the die stack is bonded to the device die through hybrid bonding.6. The package of claim 1 , ...

ELECTRICAL CONNECTOR BETWEEN CPU AND PCB

An electrical connector for connection between the CPU and the PCB includes an insulative housing, an insulative plate below the housing and a plurality of contacts retained to the housing and the plate. The housing forms a receiving cavity for receiving the CPU, and the plate forms a mounting face confronting the PCB. Each contact includes an upper part and a lower part discrete and independent from each other. The upper part includes an upward resilient arm extending into the receiving cavity for mechanically and electrically connecting to the CPU, and a bottom connecting section. The lower part includes a downward resilient arm extending toward the PCB for mechanically and electrically connecting to the PCB, and a top connecting section. The bottom connecting section and the top connecting section are mechanically and electrically connected to each other. 1. An electrical connector comprising:an insulative housing for receiving an electronic package;an insulative plate discrete from and located below the insulative housing in a vertical direction for mounting to a printed circuit board; anda plurality of conductive contacts retained to both the insulative housing and the insulative plate, each contact including:an upper part retained to the insulative housing and including a downwardly deflectable upper resilient arm for mating the electronic package, and a bottom connecting section below the upper resilient arm; anda lower part retained to the insulative plate and including an upwardly deflectable lower resilient arm for mounting to the printed circuit board, and a top connecting section above the lower resilient arm; whereinthe bottom connecting section and the top connecting section are secured to each other.2. The electrical connector as claimed in claim 1 , wherein the bottom connecting section and the top connecting section are soldered with each other via a solder mass.3. The electrical connector as claimed in claim 1 , wherein the upper resilient arm and ...

Press-Fit Internal Cable

A press-fit cable is described herein. The press-fit cable includes a plurality of cable wires and a plurality of pins. The plurality of pins is coupled with the plurality of cable wires. Additionally, the plurality of pins is to directly mate to a circuit board without a receptacle.

POWER INVERTER DOCKING SYSTEM FOR PHOTOVOLTAIC MODULES

An electronics module docking system includes docking member removably coupled to a photovoltaic module. The docking system includes a first connector port electrically coupled to one or more photovoltaic cells of the photovoltaic module. The photovoltaic module is selectively coupleable to the docking member. The docking system includes a housing to enclose an electronics module. The housing may include second connector port that is selectively engageable to the power electronics module. The power electronics module and the photovoltaic cells are electrically coupled to one another upon selective engagement of the connector ports. The inverter housing is receivable by and removably coupleable to the docking member allowing the inverter housing to be removably coupleable to the photovoltaic module. 1. A power inverter docking system for a photovoltaic module , the coupling system comprising:a first connector port configured to be electrically coupled to at least one photovoltaic cell of the photovoltaic module;a docking member configured to be removably coupled to the photovoltaic module, wherein the docking member is configured to be removably coupled to the first connector port; andan inverter housing configured to be removably coupled to the photovoltaic module and configured to at least partially enclose a power inverter, the inverter housing including a second connector port electrically coupled to the power inverter, wherein the second connector port is configured to be selectively engageable to the first connector port and to be removably coupled to the photovoltaic module.2. The power inverter docking system of claim 1 , wherein the first connector port includes a plurality of sockets claim 1 , wherein each of the plurality of sockets is configured to be electrically coupled to the at least one photovoltaic cell of the photovoltaic module.3. The power inverter docking system of claim 2 , wherein the second connector port includes a plurality of connector ...

RECHARGEABLE BATTERY

One embodiment of the invention is directed to a rechargeable battery pack configured to provide power to a device that also accepts at least one standard non-rechargeable battery. The rechargeable battery pack comprises a housing for housing at least one battery cell and recharging circuitry. The at least one battery cell and the recharging circuitry is be housed substantially within the housing. The recharging circuitry is coupled with the at least one battery cell. The recharging circuitry is configured to charge the at least one battery cell when the battery pack is inserted into the device that also accepts at least one non-rechargeable battery. The rechargeable battery back further comprises a protection circuit coupled with the recharging circuitry. 1. A rechargeable battery pack configured to provide power to a device that also accepts at least one standard non-rechargeable battery , the rechargeable battery pack comprising:a housing for housing at least one battery cell and recharging circuitry;the at least one battery cell and the recharging circuitry housed substantially within the housing;the recharging circuitry coupled with the at least one battery cell;the recharging circuitry configured to charge the at least one battery cell when the battery pack is inserted into the device that also accepts at least one non-rechargeable battery; anda protection circuit coupled with the recharging circuitry.2. The rechargeable battery pack of wherein the rechargeable battery pack is a master battery pack and the recharging circuitry is further configured to charge at least one battery cell of a separate slave battery pack.3. The rechargeable battery pack of wherein the protection circuit comprises at least one temperature sensor to detect the temperature of the at least one battery cell.4. The rechargeable battery pack of wherein the protection circuit is configured to detect when the at least one battery cell is fully charged.5. The rechargeable battery pack of ...

PHOTOVOLTAIC SYSTEM WITH IMPROVED DC CONNECTIONS AND METHOD OF MAKING SAME

A micro-inverter assembly includes a housing having an opening formed in a bottom surface thereof, and a direct current (DC)-to-alternating current (AC) micro-inverter disposed within the housing at a position adjacent to the opening. The micro-inverter assembly further includes a micro-inverter DC connector electrically coupled to the DC-to-AC micro-inverter and positioned within the opening of the housing, the micro-inverter DC connector having a plurality of exposed electrical contacts. 1. A micro-inverter assembly comprising:a housing having an opening formed in a bottom surface thereof;a direct current (DC)-to-alternating current (AC) micro-inverter disposed within the housing at a position adjacent to the opening; anda micro-inverter DC connector electrically coupled to the DC-to-AC micro-inverter and positioned within the opening of the housing, the micro-inverter DC connector comprising a plurality of exposed electrical contacts.2. The micro-inverter assembly of further comprising a micro-inverter AC wiring harness electrically coupled to the DC-to-AC micro-inverter and extending through the housing claim 1 , the micro-inverter AC wiring harness comprising a pair of AC lead wires claim 1 , a neutral lead wire claim 1 , and a ground lead wire.3. The micro-inverter assembly of wherein the plurality of exposed electrical contacts comprise spring contacts.4. The micro-inverter assembly of wherein the micro-inverter DC connector comprises a circular housing having one of alignment tabs and alignment slots formed therein.5. The micro-inverter assembly of wherein the plurality of exposed electrical contacts comprise one of pin connections and slot connections.6. The micro-inverter assembly of wherein the DC-to-AC micro-inverter and the micro-inverter DC connector are coupled absent a wired connection therebetween.7. The micro-inverter assembly of further comprising a gasket positioned within the micro-inverter DC connector.8. The micro-inverter assembly of further ...

Apparatus for making contact with a direction-dependent electrical and/or electronic component, and corresponding component arrangement

A device is described for contacting a direction-dependent electrical and/or electronic component that includes a predetermined first number of functions to be contacted, having a basic body and having a predetermined first number of first contact elements that are respectively assigned, according to a predetermined connection assignment, to a function to be contacted, and are situated on the basic body with a predetermined positioning, as well as an associated component system having such a contacting device. The positioning of the first contact elements on the basic body is made rotationally symmetrical about an angle of 90°, so that when there is a rotation of the direction-dependent electrical and/or electronic component by 90°, no different component-based functions lie against one another.

TEST SOCKET ASSEMBLY AND RELATED METHODS

A socket assembly including a housing that has one or more spring probes therein. The socket assembly further includes a leadframe assembly that has one or more cantilever members, and the leadframe assembly has microwave structures and a flexible ground plane. The socket assembly further includes an elastomeric spacer adjacent the leadframe assembly, the elastomeric spacer having one or more holes receiving the spring probes therethrough. 1. A test socket assembly comprising:a housing;a leadframe assembly having impedance controlled microwave structures and a flexible signal and ground plane, the leadframe assembly disposed within the housing; anda spacer adjacent the leadframe assembly and supporting the leadframe assembly.2. The test socket assembly as recited in claim 1 , wherein the spacer is resilient to the ground and microwave structures.3. The test socket assembly as recited in claim 1 , further comprising an outer metal housing having one or more mounting connectors claim 1 , where the lead frame assembly is disposed within the outer metal housing.4. The test socket assembly as recited in claim 1 , further comprising an outer a plastic housing claim 1 , the lead frame assembly is disposed within the plastic housing and having surface-mount connectors are positioned directly on the leadframe assembly.5. The test socket assembly as recited in claim 1 , wherein the leadframe assembly has signal lines claim 1 , and the signal lines are in a coplanar waveguide transmission line structure.6. The test socket assembly as recited in claim 1 , wherein the leadframe assembly has signal lines with split signals claim 1 , and the split signals shift phase to a prescribed amount at a prescribed frequency.7. The test socket assembly as recited in claim 1 , wherein the leadframe assembly has signal lines with split signals claim 1 , and the split signals shift phase of 180 degrees.8. The test socket assembly as recited in claim 6 , wherein a resultant output of the split ...

Chip carrier configured for delamination-free encapsulation and stable sintering

A chip carrier for carrying an electronic chip, wherein the chip carrier comprises a mounting section configured for mounting an electronic chip by sintering, and an encapsulation section configured for being encapsulated by an encapsulant. 1. A chip carrier for carrying an electronic chip , wherein the chip carrier comprises:a mounting section configured for mounting an electronic chip by sintering;an encapsulation section configured for being encapsulated by an encapsulant.2. The chip carrier according to claim 1 , wherein the encapsulation section is roughened.3. The chip carrier according to claim 1 , wherein the mounting section comprises a metal finish claim 1 , in particular a noble metal finish claim 1 , more particularly one of the group consisting of gold claim 1 , silver claim 1 , platinum claim 1 , and palladium.4. The chip carrier according to claim 1 , wherein the mounting section is substantially free of contaminants that promote electrochemical migration claim 1 , in particular is substantially free of at least one contaminant of the group consisting of sulphur and halogenides.5. The chip carrier according to claim 1 , wherein the mounting section is substantially free of surface oxide claim 1 , in particular metal oxide.6. The chip carrier according to claim 1 , wherein the encapsulation section has microstructures where a relation between a projected surface area and a flattened surface area is larger than 1.1 claim 1 , in particular is larger than 1.5.7. The chip carrier according to claim 1 , comprising an electrically conductive structure forming at least part of the encapsulation section and being partially covered by a sintering agent constituting the mounting section.8. The chip carrier according to claim 7 , comprising an electrically insulating structure claim 7 , in particular an electrically insulating and thermally conductive structure claim 7 , on which the electrically conductive structure is formed.9. The chip carrier according to ...

SIDE CLAMPING BGA SOCKET

Disclosed is a socket apparatus for ball grid array (BGA) balls, including a base member of electrically insulative material, a plurality of electrical contact members disposed in row and column configuration attached to the electrically insulative material, a plate member extending in a row direction, and a plurality of extension members connected to the plate member and configured to press BGA balls of a mounted BGA into the plurality of electrical contact members when the plate member is pulled in a first direction. 1. A socket apparatus for ball grid array (BGA) balls , comprising:a base member of electrically insulative material;a plurality of electrical contact members disposed in row and column configuration attached to the electrically insulative material;a plate member extending in a row direction; anda plurality of extension members connected to the plate member and configured to press BGA balls of a mounted BGA into the plurality of electrical contact members when the plate member is pulled in a first direction.2. The socket apparatus of claim 1 , wherein the plurality of electrical contact members correspond to a terminal ball configuration of a BGA to be mated with the socket apparatus.3. The socket apparatus of claim 1 , wherein the plurality of extension members are arranged in parallel.4. The socket apparatus of claim 1 , wherein the plurality electrical contact members alternate in a row direction with the plurality of extension members.5. The socket apparatus of claim 1 , wherein the electrical contact members are arc shaped.6. The socket apparatus of claim 1 , wherein the plurality of extension members include a plurality of nodules on each extension member claim 1 , the nodules making contact with BGA balls of a BGA when the plate member is pulled in the first direction.7. The socket apparatus of claim 6 , wherein the plurality of nodules are insulative.8. The socket apparatus of claim 6 , wherein the nodules are wedge shaped having a wide end ...

CONNECTOR INCLUDING SIGNAL PINS SHIELDED BY BURIED GROUND VIAS

A connector for electrically connecting to conductive structures formed on a semiconductor device includes a core including an isolation layer and signal vias and ground vias formed in the isolation layer; a first ground plane formed on a surface of the core and electrically connected to the ground vias; a first set of contact elements formed on a first surface of the core and electrically connected to the signal vias to form signal pins; a second set of contact elements formed on the first surface and electrically connected to a subset of the ground vias to form ground pins. The remaining ground vias without contact elements form buried ground vias. The first and second sets of contact elements are arranged on the first surface of the core to surround each signal pin by at least one adjacent ground pin and one or more adjacent buried ground vias. 1. A connector for electrically connecting to conductive structures formed on an electronic component , comprising:a core comprising an isolation layer and a plurality of signal vias and a plurality of ground vias formed in the isolation layer;a first ground plane formed on or in the core of the core and electrically connected to the plurality of ground vias;a first set of contact elements formed on a first surface of the core and electrically connected to the signal vias to form a first set of signal pins, each signal via and each contact element in the first set being electrically isolated from the first ground plane; anda second set of contact elements formed on the first surface of the core and electrically connected to a subset of the plurality of ground vias to form a second set of ground pins, remaining ground vias without contact elements connected thereto forming a set of buried ground vias,wherein the first and second sets of contact elements are arranged on the first surface of the core to surround each signal pin by at least one adjacent ground pin and one or more adjacent buried ground vias.2. The connector of ...

ELECTRONIC ASSEMBLY INCLUDING A COMPRESSION ASSEMBLY FOR CABLE CONNECTOR MODULES

An electronic assembly includes an electronic package having an integrated circuit component and interposer assemblies with compressible interposer contacts electrically connected thereto. Cable connector modules are coupled to the interposer assemblies. A cover assembly is coupled to the upper surface of the electronic package over the cable connector modules. The cover assembly includes bridge assemblies having plates in a plate stack that are independently movable. A load plate engages upper edges of the plates of the bridge assemblies and press against the plates to drive the bridge assemblies into the cable connector modules using compression hardware. The cable connector modules compress the interposer contacts of the interposer assemblies when the load plate presses the plates of the bridge assemblies into the cable connector modules. 1. An electronic assembly comprising:an electronic package including a package substrate having an upper surface and a lower surface, the electronic package including an integrated circuit component electrically connected to the package substrate, the electronic package includes lower package contacts electrically connected to the integrated circuit component and configured to be electrically connected to a host circuit board, the electronic package includes upper package contacts electrically connected to the integrated circuit component;interposer assemblies electrically connected to the electronic package, each interposer assembly including an array of interposer contacts, the interposer contacts being compressible, each interposer contact having an upper mating interface and a lower mating interface, the lower mating interfaces of the interposer contacts are mated with the corresponding upper package contacts, the interposer assemblies defining separable interfaces with the electronic package;cable connector modules coupled to the interposer assemblies, each cable connector module including a cable connector housing holding ...

Insertable Power Unit with Mounting Contacts for Plugging into a Mother Board

In one implementation, an insertable power unit for plugging into a mother board includes a power module situated on a substrate, and a mounting contact on an extended side of the substrate away from the power module. The mounting contact is electrically coupled to the power module by electrical routing in the substrate. The mounting contact is configured to provide electrical connection between the power module and the mother board. 1. An insertable power unit for plugging into a mother board , said insertable power unit comprising:a power module situated on a substrate;said substrate having a mounting contact on an extended side of said substrate away from said power module;said mounting contact being electrically coupled to said power module by an electrical routing in said substrate;said mounting contact configured to provide electrical connection between said power module and said mother board.2. The insertable power unit of claim 1 , wherein said substrate comprises a printed circuit board (PCB) configured as a daughter board.3. The insertable power unit of claim 1 , wherein said extended side of said substrate is on an end of said substrate for end-mounting on said mother board.4. The insertable power unit of claim 1 , wherein said extended side of said substrate is on an edge of said substrate for edge-mounting on said mother board.5. The insertable power unit of claim 1 , wherein said substrate further comprises at least one through-substrate via.6. The insertable power unit of claim 1 , wherein said power module comprises a voltage converter including at least one silicon power transistor.7. The insertable power unit of claim 1 , wherein said power module comprises a voltage converter including at least one III-Nitride power transistor.8. The insertable power unit of claim 1 , wherein said power module comprises a buck converter.9. An insertable power unit for plugging into a mother board claim 1 , said insertable power unit comprising:a power module ...

Power Unit with Conductive Slats

In one implementation, a power unit for plugging into a mother board includes a power module situated on a substrate. The substrate is situated on conductive slats, each having an extended end away from the power module. Each of the conductive slats provides a mounting contact of the power unit. Each mounting contact is electrically coupled to the power module by electrical routing in the substrate. The mounting contacts are configured to provide electrical connection between the power module and the mother board. 1. A power unit for plugging into a mother board , said power unit comprising:a power module situated on a substrate;said substrate being situated on a plurality of conductive slats each having an extended end away from said power module;each said extended end of said plurality of conductive slats being a mounting contact;each said mounting contact being electrically coupled to said power module by an electrical routing in said substrate;each said mounting contact configured to provide electrical connection between said power module and said mother board.2. The power unit of claim 1 , wherein said substrate comprises a printed circuit board (PCB) configured as a daughter board.3. The power unit of claim 1 , wherein said substrate comprises a molded interconnect system (MIS).4. The power unit of claim 1 , wherein each said mounting contact is at an end of said substrate for end-mounting on said mother board.5. The power unit of claim 1 , wherein each said mounting contact is at an edge of said substrate for edge-mounting on said mother board.6. The power unit of claim 1 , wherein said plurality of conductive slats are part of a lead frame.7. The power unit of claim 1 , wherein said power module comprises a voltage converter including at least one silicon power transistor.8. The power unit of claim 1 , wherein said power module comprises a voltage converter including at least one III-Nitride power transistor.9. The power unit of claim 1 , wherein said power ...

Interface card fixing device and main board module

An interface card fixing device adapted to fix an interface card to a main board is provided. The interface card fixing device includes a base, a fixing portion, an engaging portion and a connecting portion. The base includes a first surface and a second surface opposite to each other and a protrusion protruding from the first surface. The base has a through hole passing through the first surface, the second surface and the protrusion so that the protrusion forms a hollow cylinder. The fixing portion extends from the second surface of the base and includes a breach communicating with the through hole. The engaging portion is adapted to pass through the through hole and the breach, and fix to the base. The connecting portion is connected to the base and the engaging portion. A main board module having the interface card fixing device is further provided.

Electrical connector with latches to automatic lock electronic package

An electrical connector includes an electrical connector used for locking an electronic package, comprises an insulative base having a plurality of contacts. A cover is mounted upon the base. An active device is mounted between the base and the cover for driving the cover moving horizontally along the base in an open position and a closed position. The cover and the base respectively have a first latch and a second latch disposed in a direction moving by the cover for locking the electronic package.

Module for a computer interface

The present invention provides a module for a computer interface including a transducer wherein the transducer receives a measurement value and makes this measurement value available for monitoring an individual's health by means of the computer interface, for example, for monitoring an individual's blood glucose level, wherein the measurement value is obtained by means of a sensor.

Hardened optical platform with pluggable optics

A module in a hardened optical platform includes one or more Printed Circuit Boards (PCB) and associated components; at least one cage configured to receive a pluggable optical module, wherein the at least one cage is on a PCB of the one or more PCBs; and a housing enclosing the one or more PCBs, wherein the housing covers the one or more PCBs, the associated components, and the at least one cage with the pluggable optical module, with respect to airflow, wherein a thermally conductive conduit is formed between the pluggable optical module once inserted and the housing, enabling the pluggable optical module to operate in the housing which is sealed with respect to airflow. 1. A module in a hardened optical platform comprising:one or more Printed Circuit Boards (PCB) and associated components;at least one cage configured to receive a pluggable optical module, wherein the at least one cage on a PCB of the one or more PCBs; anda housing enclosing the one or more PCBs, wherein the housing covers the one or more PCBs, the associated components, and the at least one cage with the pluggable optical module, with respect to airflow,wherein a thermally conductive conduit is formed between the pluggable optical module once inserted and the housing, enabling the pluggable optical module to operate in the housing which is sealed with respect to airflow.2. The module in a hardened optical platform of claim 1 , wherein the thermally conductive conduit is a heat sink which is configured to make uniform thermal contact with the pluggable optical module once inserted and the heat sink extends to the housing.3. The module in a hardened optical platform of claim 1 , wherein the thermally conductive conduit is formed by copper or aluminum which is routed from the cage to the housing.4. The module in a hardened optical platform of claim 3 , wherein heat moves along the thermally conductive conduit to the housing and from the housing to a thermal contact surface on an enclosure of the ...

Pressing member and electrical connector assembly

A pressing member is used for downwardly pressing on a chip module. The pressing member has a main body and a central opening going through the main body. The main body has an upper surface and a lower surface opposite to the upper surface. The central opening is provided for a part portion of the chip module going through. The pressing member has a pressing portion protrudes upwardly from the upper surface and provided for an external device pressing downwardly on to make the main body press downwardly on the chip module so as to prevent the chip module from warping.

CLIP AND ELECTRICAL CONNECTOR ASSEMBLY

A clip is used for carrying a chip module to assemble to an electrical connector along a vertical direction. The clip includes a retaining mechanism retaining the chip module and a central opening provided for a part portion of the chip module going through. The clip has an anti-mismating member. When the clip is assembled to the electrical connector by itself disposed in a right-to-left direction perpendicular to the vertical direction or reversely relative to a front-to-back direction perpendicular to the vertical direction, the anti-mismating member stops the clip to be assembled to the electrical connector. 1. A clip used for carrying a chip module to assemble to an electrical connector along a vertical direction , comprising:a retaining mechanism provided for retaining the chip module; anda central opening provided for a part portion of the chip module going through;wherein the clip has an anti-mismating member used for preventing the clip from being assembled to the electrical connector in a wrong way.2. The electrical connector as claimed in claim 1 , wherein the clip has a front face and a first protruding portion extending forwardly beyond the front face claim 1 , and the first protruding portion is functioned as the anti-mismating member.3. The electrical connector as claimed in claim 1 , wherein the clip has a rear face and a second protruding portion extending rearwardly beyond the rear face claim 1 , and the second protruding portion is functioned as the anti-mismating member.4. The electrical connector as claimed in claim 2 , wherein the clip has a rear face and a second protruding portion extending rearwardly beyond the rear face claim 2 , and the second protruding portion is functioned as the anti-mismating member.5. The electrical connector as claimed in claim 1 , wherein the clip has a main body defining the central opening claim 1 , and a pair of grabbing portions extending downwardly from the main body and disposed at two opposite sides of the ...

Socket

A socket includes a flat-plate-shaped housing, a plurality of contacts supported by the flat-plate-shaped housing, a frame attached to the flat-plate-shaped housing and extending along the flat-plate-shaped housing, a plurality of first solder balls disposed on a lower surface of the flat-plate-shaped housing and facing a circuit board, and a plurality of second solder balls disposed on the lower surface of the flat-plate-shaped housing. The frame defines, in an in-plane direction of the flat-plate-shaped housing, a position of an electronic component having a lower surface including a plurality of pads configured to contact the contacts upon the electronic component being mounted. The first solder balls electrically connect to each of the contacts and electrically connect to the circuit board. The second solder balls are not electrically connected to the contacts. 1. A socket , comprising:a flat-plate-shaped housing;a plurality of contacts supported by the flat-plate-shaped housing;a frame attached to the flat-plate-shaped housing and extending along the flat-plate-shaped housing, the frame defining, in an in-plane direction of the flat-plate-shaped housing, a position of an electronic component having a lower surface including a plurality of pads configured to contact the contacts upon the electronic component being mounted;a plurality of first solder balls disposed on a lower surface of the flat-plate-shaped housing and facing a circuit board, the first solder balls electrically connect to each of the contacts and electrically connect to the circuit board; anda plurality of second solder balls disposed on the lower surface of the flat-plate-shaped housing, the second solder balls are not electrically connected to the contacts.2. The socket of claim 1 , wherein the second solder balls are positioned closer to an edge of the flat-plate-shaped housing than the first solder balls.3. A socket claim 1 , comprising:a flat-plate-shaped housing;a plurality of contacts ...

Pin count socket having reduced pin count and pattern transformation

An interposer and method of providing spatial and arrangement transformation are described. An electronic system has an electronic package, a motherboard and an interposer between the package and the motherboard. The interposer has signal and ground contacts on opposing surfaces that are respectively connected. The contacts opposing the package has a higher signal to ground contact ratio than the contacts opposing the motherboard, as well as different arrangements. Ground shielding vias in the interposer, which are connected to a ground plane, electrically isolate the signals through the interposer. The package may be mounted on a shielded socket such that signal and ground pins are mounted respectively in signal and ground socket mountings, ground shielding vias are between the signal socket mountings, and the ground socket mountings contain plated socket housings.

POWER INVERTER DOCKING SYSTEM FOR PHOTOVOLTAIC MODULES

An electronics module docking system includes docking member removably coupled to a photovoltaic module. The docking system includes a first connector port electrically coupled to one or more photovoltaic cells of the photovoltaic module. The photovoltaic module is selectively coupleable to the docking member. The docking system includes a housing to enclose an electronics module. The housing may include second connector port that is selectively engageable to the power electronics module. The power electronics module and the photovoltaic cells are electrically coupled to one another upon selective engagement of the connector ports. The inverter housing is receivable by and removably coupleable to the docking member allowing the inverter housing to be removably coupleable to the photovoltaic module. 1. A power inverter docking system for a photovoltaic module , the coupling system comprising:a first connector port configured to be electrically coupled to at least one photovoltaic cell of the photovoltaic module;a docking member configured to be removably coupled to the photovoltaic module, wherein the docking member is configured to be removably coupled to the first connector port; andan inverter housing configured to be removably coupled to the photovoltaic module and configured to at least partially enclose a power inverter, the inverter housing including a second connector port electrically coupled to the power inverter, wherein the second connector port is configured to be selectively engageable to the first connector port and to be removably coupled to the photovoltaic module.2. The power inverter docking system of claim 1 , wherein the first connector port includes a plurality of sockets claim 1 , wherein each of the plurality of sockets is configured to be electrically coupled to the at least one photovoltaic cell of the photovoltaic module.3. The power inverter docking system of claim 2 , wherein the second connector port includes a plurality of connector ...

POWER ADAPTING BOX AND FAN MODULE

A power adapting box and a fan module are provided. The power adapting box includes a box body, a plurality of first power adapters, an expansion socket and a plurality of second power adapters. The first power adapters are disposed in the box body. The expansion socket is detachably disposed in the box body. The second power adapters are disposed in the expansion socket. 1. A power adapting box comprising:a box body;a plurality of first power adapters disposed in the box body;an expansion socket detachably disposed in the box body; anda plurality of second power adapters disposed in the expansion socket.2. The power adapting box of claim 1 , wherein the box body has a plurality of positioning holes claim 1 , the expansion socket has a plurality of positioning pillars claim 1 , and each of the positioning pillars is inserted into one of the positioning holes when the expansion socket is disposed in the box body.3. The power adapting box of claim 1 , wherein the box body has a plurality of first engaging hooks and the first engaging hooks are engaged with the expansion socket when the expansion socket is disposed in the box body.4. The power adapting box of claim 3 , wherein the box body has a plurality of second engaging hooks claim 3 , each of the first power adapters has a first connecting wire claim 3 , and the second engaging hook clamps and fixes the first connecting wire.5. The power adapting box of claim 4 , wherein at least one of the second engaging hooks is located between the first engaging hook and a side wall of the box body.6. The power adapting box of claim 1 , wherein the expansion socket has a plurality of restraining portions claim 1 , each of the second power adapters has a second connecting wire claim 1 , and the restraining portion restrains the second connecting wire in the expansion socket.7. The power adapting box of claim 1 , wherein each of the first power adapters has a first connecting wire claim 1 , each of the second power adapters has ...

ETHERNET CONNECTOR WITH ELECTROMAGNETIC FILTERING

There is described a modular connector receptacle comprising a shield and a modular connector assembly. The shield comprises an electrically-conductive material, and comprises a lumen defining an inner surface which comprises a thread. The modular connector assembly comprises peripheral winglets which engage with the thread of the inner surface of the lumen for screwably housing the modular connector assembly inside the shield. The peripheral winglets are electrically conductive, thus providing a ground. Low-pass filters are provided on a PCB in the modular connector assembly, and the PCB comprising the low-pass filters can have a PCB shield enclosing the PCB and electrically connected to the peripheral winglets for grounding to the shield. 1. A modular connector receptacle for installation on a device having an electromagnetic radiation protective casing , the modular connector receptacle comprising:a shield comprising an attachment member for mounting the modular connector receptacle to the device, the shield further comprising an electrically-conductive material, the shield comprising a lumen defining an inner surface which comprises a securing member; anda modular connector assembly which engages with the securing member of the inner surface of the lumen for housing the modular connector assembly substantially inside the shield.2. The modular connector receptacle of claim 1 , wherein the modular connector assembly further comprises peripheral winglets which are electrically conductive and which engage with the securing member.3. The modular connector receptacle of claim 1 , wherein the securing member comprises a thread on the inner surface of the lumen claim 1 , the thread being used for screwably housing the modular connector assembly substantially inside the shield.4. The modular connector receptacle of claim 3 , wherein the modular connector assembly further comprises peripheral winglets which are electrically conductive and which engage with the thread of ...

SELECTIVE GROUND FLOOD AROUND REDUCED LAND PAD ON PACKAGE BASE LAYER TO ENABLE HIGH SPEED LAND GRID ARRAY (LGA) SOCKET

Embodiments include a transmission line-land grid array (TL-LGA) socket assembly, a TL-LGA socket, and a package substrate. The TL-LGA socket assembly includes a TL-LGA socket having an interconnect in a housing body, the interconnect includes a vertical portion and a horizontal portion. The housing body has a top surface and a bottom surface, where the top surface is a conductive layer. The TL-LGA socket assembly also includes a package substrate having a base layer having a signal pad and a ground strip. The base layer is above the conductive layer of the housing body of the TL-LGA socket. The ground strip is above the horizontal portion of the interconnect and adjacent to the signal pad. The horizontal portion is coupled to the signal pad on the base layer. The package substrate may have a pad with a reduced pad area. 1. A socket assembly , comprising:a socket having an interconnect in a housing body, the interconnect includes a vertical portion and a horizontal portion, wherein the housing body has a top surface and a bottom surface that is opposite from the top surface, wherein the top surface is a conductive layer; anda package having a base layer, the base layer includes a signal pad and a ground strip, wherein the base layer is above the conductive layer of the housing body of the socket, wherein the ground strip is vertically over the horizontal portion of the interconnect of the socket, and wherein the horizontal portion is coupled to the signal pad on the base layer.2. The socket assembly of claim 1 , wherein a width of the ground strip is greater than a width of the horizontal portion claim 1 , and wherein the ground strip is adjacent to the signal pad.3. The socket assembly of claim 1 , further comprising a gap between the ground strip and the signal pad.4. The socket assembly of claim 1 , wherein the ground strip is coupled to a ground pad on the base layer.5. The socket assembly of claim 1 , wherein the ground strip has a rectangular shape claim 1 , ...

BACK PLATE ASSEMBLY AND ELECTRONIC DEVICE

A back plate assembly includes a base plate formed with a groove having a bottom wall and a pair of side walls opposite to each other in a first horizontal direction, and an arch plate assembled into the groove and having a pair of opposite ends in the first horizontal direction. A pair of end surfaces of the ends of the arch plate abut against the side walls and a part of a middle portion of the arch plate between the ends is not in contact with the bottom wall of the groove. 1. A back plate assembly , comprising:a base plate formed with a groove having a bottom wall and a pair of side walls opposite to each other in a first horizontal direction; andan arch plate assembled into the groove and having a pair of opposite ends in the first horizontal direction, a pair of end surfaces of the ends of the arch plate abut against the side walls and a part of a middle portion of the arch plate between the ends is not in contact with the bottom wall of the groove.2. The back plate assembly of claim 1 , wherein the ends of the arch plate abutting the side walls transfer a vertical loading force applied on the arch plate into a horizontal tension applied on the base plate.3. The back plate assembly of claim 1 , wherein the back plate assembly supports an electronic component mounted and pressed on the arch plate.4. The back plate assembly of claim 1 , wherein claim 1 , in an initial state of the arch plate in which no external force is applied thereon claim 1 , a distance between the end surfaces of the ends of the arch plate is equal to claim 1 , slightly smaller than claim 1 , or slightly greater than a distance between the side walls of the groove.5. The back plate assembly of claim 1 , wherein a size of the arch plate in a second horizontal direction perpendicular to the first horizontal direction is equal to the size of the groove in the second horizontal direction.6. The back plate assembly of claim 1 , wherein the groove runs throughout the base plate in a second ...