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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Поддерживает ввод нескольких поисковых фраз (по одной на строку). При поиске обеспечивает поддержку морфологии русского и английского языка
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Применить Всего найдено 1953. Отображено 100.
23-02-2012 дата публикации

Extruded server case

Номер: US20120044633A1
Автор: Chad Daniel Attlesey
Принадлежит: HARDCORE COMPUTER Inc

A liquid submersion cooled computer that includes a seamless, extruded main body used to form a liquid-tight case holding a cooling liquid that submerges components of the computer. By forming the main body as a seamless extrusion, the number of possible leakage paths from the resulting liquid-tight case is reduced. No seams are provided on the main body, and there are no openings through the walls of the main body, so liquid cannot leakage through the main body. Any leakage paths are limited to joints between the main body and end walls which are sealingly attached to the main body to form the liquid-tight case.

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Номер записи: 1
29-03-2012 дата публикации

Server case with optical input/output and/or wireless power supply

Номер: US20120075796A1
Автор: Chad Daniel Attlesey
Принадлежит: HARDCORE COMPUTER Inc

A liquid submersion-cooled computer that is configured to reduce physical structures passing through walls of the computer liquid-tight computer case, which eliminates the amount of sealing needed around those physical structures and reduces the number of possible fluid leakage paths from the interior of the computer that contains a cooling liquid submerging at least some of the computer components. The computer includes a mechanism to pass input/output signals into and from the computer without any physical structure extending through any of the plurality of walls. The computer also has a mechanism for wirelessly transferring power into the interior space of the computer case, and a switch that controls power in the computer without having any physical structure extending through any of the plurality of walls.

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Номер записи: 2
14-06-2012 дата публикации

Cooling system for a server

Номер: US20120147553A1
Автор: André Sloth Eriksen
Принадлежит: Asetek AS

Embodiments of the disclosure may include a system for cooling a computer server including a plurality of server modules. The system may include a first cooling system configured to remove heat from the plurality of server modules, the first cooling system including a first plurality of conduits for circulating a first cooling medium through the first cooling system, a second cooling system configured to remove heat from the first cooling system, the second cooling system including a second plurality of conduits for circulating a second cooling medium through the second cooling system, and a manifold configured to couple the first cooling system and the second cooling system, wherein the first plurality of conduits is removably connected to the manifold.

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Номер записи: 3
08-11-2012 дата публикации

Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic component

Номер: US20120279686A1
Автор: Bejoy J. Kochuparambil, David P. GRAYBILL, Madhusudan K. Iyengar, Mark E. STEINKE, Roger R. Schmidt, Timothy J. Chainer, Vinod Kamath
Принадлежит: International Business Machines Corp

Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.

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Номер записи: 4
24-01-2013 дата публикации

Two-phase, water-based immersion-cooling apparatus with passive deionization

Номер: US20130021752A1
Автор: Levi A. Campbell, Madhusudan K. Iyengar, Michael J. Ellsworth, Jr., Milnes P. DAVID, Prabjit Singh, Richard C. Chu, Robert E. Simons
Принадлежит: International Business Machines Corp

Cooling apparatuses, cooled electronic modules and methods of fabrication are provided for fluid immersion-cooling of an electronic component(s). The cooled electronic module includes a substrate supporting the electronic component(s), and the cooling apparatus couples to the substrate, and includes a housing at least partially surrounding and forming a compartment about the electronic component(s). Additionally, the cooling apparatus includes a fluid and a deionization structure disposed within the compartment. The electronic component is at least partially immersed within the fluid, and the fluid is a water-based fluid. The deionization structure includes deionizing material, which ensures deionization of the fluid within the compartment. The deionization structure facilitates boiling heat transfer from the electronic component(s) to a condenser structure disposed in the compartment. Transferred heat is subsequently conducted to, for example, a liquid-cooled cold plate or an air-cooled heat sink coupled to the housing for cooling the condenser structure.

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Номер записи: 5
31-01-2013 дата публикации

Heat sink structure with a vapor-permeable membrane for two-phase cooling

Номер: US20130027878A1
Автор: Levi A. Campbell, Madhusudan K. Iyengar, Michael J. Ellsworth, Jr., Milnes P. DAVID, Richard C. Chu, Robert E. Simons
Принадлежит: International Business Machines Corp

A heat sink, and cooled electronic structure and cooled electronics apparatus utilizing the heat sink are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels coupled to facilitate the flow of coolant through the coolant-carrying channel(s). The heat sink further includes a membrane associated with the coolant-carrying channel(s). The membrane includes at least one vapor-permeable region, which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s), and at least one orifice coupled to inject coolant onto at least one surface of the coolant-carrying channel(s) intermediate opposite ends of the channel(s).

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Номер записи: 6
04-04-2013 дата публикации

Liquid submersion cooled data storage or memory system

Номер: US20130081791A1
Автор: Chad D. Attlesey, Laurent A. Regimbal, Lyle R. TUFTY
Принадлежит: Liquidcool Solutions Inc

A liquid submersion cooling system that is suitable for cooling a number of electronic devices in parallel using a plurality of cases connected to a rack system. The system cools heat-generating components in server computers and other devices that use electronic, heat-generating components and are connected in parallel systems. The system includes a housing having an interior space, a dielectric cooling liquid in the interior space, a heat-generating electronic component disposed within the space and submerged in the dielectric cooling liquid. The rack system contains a manifold system to engage and allow liquid transfer for multiple cases and IO connectors to engage electrically with multiple cases/electronic devices. The rack system can be connected to a pump system for pumping the liquid into and out of the rack, to and from external heat exchangers, heat pumps, or other thermal dissipation/recovery devices.

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Номер записи: 7
13-06-2013 дата публикации

Liquid Cooled Planer

Номер: US20130147503A1
Автор: Derek I. Schmidt, James S. Womble, Mark E. STEINKE, Vinod Kamath
Принадлежит: International Business Machines Corp

A liquid cooled planer including: one or more computing components mounted on the planer, wherein at least one or more of the computing components is liquid cooled; one or more conductive cooling components mounted on the planer; and one or more convective cooling components mounted on the planer, wherein the convective cooling components are removable from the planer without removing the conductive cooling components from the planer.

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Номер записи: 8
21-11-2013 дата публикации

Server assembly

Номер: US20130308267A1
Автор: Chih-Wei Kan, Wen-Jen Wu
Принадлежит: Hon Hai Precision Industry Co Ltd

A rack includes a first pole, a second pole, a third pole, a fourth pole, four beams connected between the first to fourth poles, a number of first connection poles connected between the first pole and the second pole, and a number of second connection poles connected between the third pole and the fourth pole. The first to fourth poles, the beams, the first connection pole, and the second connection pole are all tubular and communicate with each other internally. A pump is arranged in a middle of each beam. Each first connection pole has a substantially same height with one of the second connection poles for sandwiching, together with the second connection pole, a liquid cooling server module which is operable to communicate with the rack internally to circulate cooling liquid.

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Номер записи: 9
20-02-2014 дата публикации

Heat sink structure with a vapor-permeable membrane for two-phase cooling

Номер: US20140048242A1
Автор: Levi A. Campbell, Madhusudan K. Iyengar, Michael J. Ellsworth, Jr., Milnes P. DAVID, Richard C. Chu, Robert E. Simons
Принадлежит: International Business Machines Corp

A heat sink, and cooled electronic structure and cooled electronics apparatus utilizing the heat sink are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels coupled to facilitate the flow of coolant through the coolant-carrying channel(s). The heat sink further includes a membrane associated with the coolant-carrying channel(s). The membrane includes at least one vapor-permeable region, which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s), and at least one orifice coupled to inject coolant onto at least one surface of the coolant-carrying channel(s) intermediate opposite ends of the channel(s).

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Номер записи: 10
27-03-2014 дата публикации

Method and apparatus to manage coolant pressure and flow for an array of liquid submerged electronic devices

Номер: US20140085821A1
Автор: Laurent Regimbal, Lyle R. TUFTY, Sean ARCHER, Steve Shafer
Принадлежит: Liquidcool Solutions Inc

A fluid delivery system configuration is described for use with an array of liquid submersion cooled electronic devices disposed in a rack, such as an array of liquid submerged servers. The fluid delivery system allows for the pumping system to generate pressure and flow of the cooling system fluid at slightly higher levels than is necessary for the worst case device/position within the array and to provide for uniformity of delivery pressure and coolant flow to each and every device within the array.

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Номер записи: 11
10-04-2014 дата публикации

Heat sink structure with a vapor-permeable membrane for two-phase cooling

Номер: US20140096386A1
Автор: Levi A. Campbell, Madhusudan K. Iyengar, Michael J. Ellsworth, Jr., Milnes P. DAVID, Richard C. Chu, Robert E. Simons
Принадлежит: International Business Machines Corp

A heat sink, and cooled electronic structure and cooled electronics apparatus utilizing the heat sink are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels coupled to facilitate the flow of coolant through the coolant-carrying channel(s). The heat sink further includes a membrane associated with the coolant-carrying channel(s). The membrane includes at least one vapor-permeable region, which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s), and at least one orifice coupled to inject coolant onto at least one surface of the coolant-carrying channel(s) intermediate opposite ends of the channel(s).

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Номер записи: 12
14-01-2016 дата публикации

LIQUID SUBMERGED, HORIZONTAL COMPUTER SERVER RACK AND SYSTEMS AND METHOD OF COOLING SUCH A SERVER RACK

Номер: US20160014932A1
Автор: Best Christiaan Scott, Garnett Mark
Принадлежит:

A system for cooling a plurality of servers containing heat generating electronic components, the system including a tank having a fluid inlet and a fluid outlet and a dielectric liquid. The dielectric liquid enters the tank via the fluid inlet at a first temperature equal to or greater than 90 degrees F. and exits the tank via the fluid outlet at a second greater than the first temperature. 1. A system for cooling a plurality of servers containing heat generating electronic components , the system comprising:a tank comprising a fluid inlet and a fluid outlet; anda dielectric liquid,wherein the dielectric liquid enters the tank via the fluid inlet at a first temperature equal to or greater than 90 degrees F. and exits the tank via the fluid outlet at a second greater than the first temperature.2. The system of claim 1 , wherein the first temperature is a temperature in the range of 90 degrees F. to 130 degrees F.3. The system of claim 1 , wherein the first temperature is equal to or greater than 110 degrees F.4. The system of claim 3 , wherein the first temperature is a temperature in the range of 100 degrees F. to 110 degrees F.5. The system of claim 1 , wherein the plurality of servers are independently operable.6. The system of claim 1 , wherein the tank comprises an open or openable top sized to receive at least one row comprising a plurality of rack-mountable servers claim 1 , each of the plurality of rack-mountable servers in the at least one row comprising a motherboard and heat producing components mounted to the motherboard.7. The system of claim 6 , further comprising one or more mounting members positioned within the interior volume and configured to mountably receive the plurality of rack-mountable servers within the interior volume claim 6 , wherein the mounting members are configured to hold at least two of the plurality of rack-mountable servers in the at least one row in a horizontally stacked relationship with one another claim 6 , with the rack- ...

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Номер записи: 13
14-01-2021 дата публикации

High density, high availability compute system

Номер: US20210014105A1
Автор: Phillip N. Hughes, Robert J Lipp
Принадлежит: Individual

A new physical computer architecture that combines elements in a virtuous cycle to eliminate performance killing inefficiencies in compute systems and need never be physically repaired during its lifetime is described. The system comprises a three dimensional rectangular cube structure with integrated liquid cooling and a multi-dimensional direct network laced through it. The network comprises a distributed, dynamically adaptive, multiply-fault-tolerant routing protocol that can logically replace failed components.

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Номер записи: 14
19-01-2017 дата публикации

LIQUID COOLANT SUPPLY

Номер: US20170017277A1
Автор: Anthony Sarah, BASH Cullen E, Cader Tahir, Escobar-Vargas Sergio, Franz John, Kumari Niru, Tavallaei Siamak
Принадлежит:

Apparatuses associated with liquid coolant supply are disclosed. One example apparatus is a computing cartridge which includes a first electronic device and a liquid-cooled cold plate. The computing cartridge also includes a first thermal couple between the first electronic device and the cold plate. The computing cartridge also includes an inlet fluid connector. The inlet fluid connector may supply a liquid coolant to the cold plate The computing cartridge also includes an outlet fluid connector. The outlet fluid connector may facilitate return of the coolant from the cold plate. 1. A computing cartridge , comprising:a first electronic device;a liquid-cooled cold plate;a first thermal couple between the first electronic device and the cold plate;an inlet fluid connector to facilitate supply of a liquid coolant to the cold plate; andan outlet fluid connector to facilitate return of the liquid coolant from the cold plate.2. The computing cartridge of claim 1 , comprising:a second electronic device; anda second thermal couple between the second electronic device and the cold plate.3. The computing cartridge of claim 1 , comprising an air cooled electronic device.4. The computing cartridge of claim 1 , where the inlet fluid connector is a hot-plug capable blind mate connector claim 1 , and where the outlet fluid connector is a hot-plug capable blind mate connector.5. The computing cartridge of claim 1 , where the liquid coolant flows through fluid channels within the cold plate claim 1 , and where the channels connect the inlet fluid connector and the outlet fluid connector.6. The computing cartridge of claim 1 , where the first electronic device is a member of a set of electronic devices on the computing cartridge claim 1 , and where the set of electronic devices optimize performance of a specific application.7. The computing cartridge of claim 1 , where the computing cartridge is a top-loading computing cartridge.8. A chassis claim 1 , comprising: a supply fluid ...

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Номер записи: 15
18-01-2018 дата публикации

INTEGRATED LIQUID COOLING OF A SERVER SYSTEM

Номер: US20180018000A1
Автор: Cader Tahir, Franz John P., Moore David A.
Принадлежит:

Example implementations relate to an integrated liquid cooling of a server system. For example, a method for integrated liquid cooling of a server system can include creating a liquid cooling component that includes creating a three dimensional (3D) design based on a server system, where the 3D design includes customized angle geometry. Further, the method for integrated liquid cooling of a server system can include forming the liquid cooling component based on the 3D design, where the liquid cooling component includes a plurality of liquid flow passages for delivering cooling resources to the server system, and delivering the cooling resources to the server system via the liquid cooling component. 1. A method for integrated liquid cooling of a server system , comprising: creating a three dimensional (3D) design based on a server system, wherein the 3D design includes customized angle geometry; and', 'forming the liquid cooling component based on the 3D design, wherein the liquid cooling component includes a plurality of liquid flow passages for delivering cooling resources to the server system; and, 'creating a liquid cooling component, includingdelivering the cooling resources to the server system via the liquid cooling component.2. The method of claim 1 , wherein the liquid cooling component is formed using a monolithic process.3. The method of claim 1 , wherein forming the liquid cooling component includes combining a flexible material and a rigid material as a single assembly.4. The method of claim 1 , wherein forming the liquid cooling component includes using a single material to define the plurality of liquid flow passages and a body of the liquid cooling component.5. The method of claim 1 , wherein forming the liquid cooling component includes forming mounting flanges to secure a liquid flow passage among the plurality of liquid flow passages to a site on the server system.6. The method of claim 1 , further including providing structural support for the ...

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Номер записи: 16
21-01-2021 дата публикации

Systems and methods for liquid-volume measurement in immersion-cooled devices

Номер: US20210018356A1
Автор: Cory D. Basden, John H. Bean, Jr.
Принадлежит: Schneider Electric IT Corp

A level sensing module for use with a liquid immersion cooling system having a device chassis housing an electronic device, the level sensing module comprising a fluid level sensor, and a controller coupled to the fluid level sensor and configured to receive a signal from the fluid level sensor indicative of a height of dielectric fluid in the device chassis, receive a signal from a pump controller indicative of a volume of dielectric fluid provided to the device chassis, and generate a map of dielectric fluid volume within the device chassis based on the signal from the fluid level sensor and the signal from the pump controller.

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Номер записи: 17
03-02-2022 дата публикации

LIQUID COOLING DISTRIBUTION IN A MODULAR ELECTRONIC SYSTEM

Номер: US20220039291A1
Автор: Chopra Rakesh, Dogruoz M. Baris, Goergen Joel Richard, Lam Mandy Hin
Принадлежит:

A network communications device includes a chassis, a plurality of modules removably inserted into a plurality of slots in the chassis. A coolant is delivered to a first group of the plurality of modules with a first flow control valve in a first cooling loop and the coolant is delivered to a second group of the plurality of modules with a second flow control valve in a second cooling loop. The network communication device further includes a plurality of sensors for monitoring a temperature in the first cooling loop and the second cooling loop and a control system for controlling delivery of the coolant to the first group and the second group, where the control system controls transmitting a signal to one of the first flow control valve and the second flow control valve to modify a flow of the coolant. 1. A method comprising:receiving a coolant at a coolant distribution system in a chassis of a network communications device;delivering the coolant to a plurality of modules inserted into the chassis, wherein the coolant is delivered to a first group of the plurality of modules with a first flow control valve in a first cooling loop and the coolant is delivered to a second group of the plurality of modules with a second flow control valve in a second cooling loop;monitoring a temperature in the first cooling loop and the second cooling loop; andtransmitting a signal to one of the first flow control valve and the second flow control valve to modify a flow of the coolant.2. The method of claim 1 , wherein delivering the coolant comprises:modulating one of the first flow control valve and the second flow control valve based on receiving a command to change the flow at the first flow control valve or the second flow control valve before moving the first flow control valve or the second flow control valve to a commanded position.3. The method of claim 2 , further comprising:modulating the first flow control valve or the second flow control valve after moving a respective ...

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Номер записи: 18
25-01-2018 дата публикации

FLUID MANIFOLD

Номер: US20180027702A1
Автор: Cader Tahir, Franz John P.
Принадлежит:

An example fluid manifold is provided herein. The fluid manifold includes a first set of perimeter walls, a second set of perimeter walls, a first aperture, and a second aperture. The first set of perimeter walls to form a supply channel. The second set of perimeter walls to form a return channel. The second set of perimeter walls are adjacent to the first set of perimeter walls. The first aperture formed in the first set of perimeter walls is to transport fluid between a fluid component and the supply channel. The second aperture formed in the second set of perimeter walls is to transport fluid between the fluid component and the return channel. The first aperture and the second aperture are positioned adjacent to an electronic module. 1. A system to regulate a temperature of an electronic module , the system comprising:a server tray to receive the electronic module; a supply channel to transport a liquid to a supply aperture positioned along the supply channel, the supply aperture connected to a fluid component to provide the liquid thereto, and', 'a return channel to transport a liquid from a return aperture positioned along the return channel, the return aperture connected to the fluid component to receive the liquid therefrom., 'a fluid manifold to connect to the server tray, the fluid manifold including2. The system of claim 1 , wherein the supply aperture and the return aperture each align with the fluid component.3. The system of claim 1 , wherein the fluid component is attached to the electronic module.4. The system of claim 1 , wherein the supply aperture and the return aperture are positioned on the server tray adjacent to the electronic module.5. The system of claim 1 , further comprising a supply valve and a return valve.6. An apparatus to regulate a temperature of an electronic module claim 1 , the apparatus comprising: a supply channel with a supply aperture formed therein to connect to a fluid component in the electronic module and provide fluid ...

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Номер записи: 19
10-02-2022 дата публикации

Server

Номер: US20220046827A1
Автор: YANG Bin
Принадлежит: Beijing Silicon Based Voyage Technology Co., Ltd.

The disclosure provides a server including a housing in the shape of a frame structure, a plurality of Hash boards disposed side by side in the housing along a first direction, and a cooling module configured to cool at least the plurality of Hash boards; each of the plurality of Hash boards are disposed perpendicularly to the first direction, and each Hash board includes a board body provided with a Hash chip; the cooling module includes at least one first cooling plate disposed on the board body, a water-cooling plate disposed on a side surface of the board body, and at least one heat pipe disposed on the board body; one end of the at least one heat pipe is disposed on the at least one first cooling plate, and the other end is disposed on the water-cooling plate. 1. A server , comprising:a housing in the shape of a frame structure;a plurality of Hash boards, the plurality of Hash boards being disposed side by side in the housing along a first direction; each of the plurality of Hash boards being disposed perpendicularly to the first direction, and each Hash board comprising a board body; the board body being provided with a Hash chip; anda cooling module configured to cool at least the plurality of Hash boards; at least one first cooling plate disposed on the board body;', 'a water-cooling plate disposed on a side surface of the board body; and', 'at least one heat pipe disposed on the board body; one end of the at least one heat pipe being disposed on the at least one first cooling plate, and the other end being disposed on the water-cooling plate., 'the cooling module comprising2. The server of claim 1 , wherein the Hash board comprises a buck circuit module disposed on the board body and separated from the Hash chip in a second direction; the second direction is parallel to an extension direction of the Hash board claim 1 , and the first cooling plate is disposed on the buck circuit module.3. The server of claim 2 , wherein a plurality of first cooling plates ...

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Номер записи: 20
04-02-2021 дата публикации

SWIVEL-CAPABLE, LOW-PRESSURE-DROP HOSE BARB FITTINGS

Номер: US20210033226A1
Автор: Cader Tahir, Franz John
Принадлежит:

Hose barb fittings and apparatuses described herein provide increased fluid-flow rates for cooling loops used for thermal control in computer system. A hose barb fitting comprises a fluid-flow passage that extends through the hose barb fitting from a first opening to a second opening. The ratio of the cross-sectional area of the fluid-flow passage to the cross-sectional area of the hose barb fitting is between 0.4 and 0.7, inclusive. When the hose barb fitting is fully seated within a housing structure, a specialized gasket acts as both a radial seal and a face seal. Also, a flange extending from the housing structure engages with a flange extending from the hose barb fitting to prevent the hose barb fitting from being unseated. 1. An apparatus comprising: a first opening at a first end of the hose barb fitting,', 'a second opening at a second end of the hose barb fitting,', 'a fluid-flow passage that extends through the hose barb fitting from the first opening to the second opening, wherein a ratio of a cross-sectional area of the fluid-flow passage to a cross-sectional area of the hose barb fitting is between 0.4 and 0.7, inclusive,', 'a first flange proximal to the first end of the hose barb fitting, wherein the first flange extends outward from an outer surface of the hose barb fitting, and', 'a recess on the outer surface of the hose barb fitting extending along a cross-sectional outer perimeter of the hose barb fitting, wherein a ratio of a length of the recess in a fluid-flow direction for the first opening to a cross-sectional width of the fluid-flow passage is between 0.5 and 0.9, inclusive;, 'a hose barb fitting comprising a socket, wherein the first end of the hose barb fitting rests inside the socket when the hose barb fitting is fully seated within the housing structure, and', 'a second flange that engages with the first flange to prevent the first end of the hose barb fitting from exiting the socket when the hose barb fitting is fully seated within the ...

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Номер записи: 21
01-02-2018 дата публикации

Computer Cooling System And Method of Use

Номер: US20180035569A1
Автор: Harrington Steve
Принадлежит:

A reliable, leak-tolerant liquid cooling system with a backup air-cooling system for computers is provided. The system may use a vacuum pump and a liquid pump and/or an air compressor in combination to provide negative fluid pressure so that liquid does not leak out of the system near electrical components. Alternatively, the system can use a single vacuum pump and a valve assembly to circulate coolant. The system distributes flow and pressure with a series of pressure regulating valves so that an array of computers can be serviced by a single cooling system. A connector system is provided to automatically evacuate the liquid from the heat exchangers before they are disconnected. Leah detection and mitigation structures are also disclosed. Various turbulators are also provided, as well as a system and method for optimizing the heat transfer characteristics of a heat exchanger to minimize total energy requirements. 1. A system for cooling an electrical device , the system comprising: a coolant-containing heat exchanger thermally coupled to the electrical device;', an outlet port that allows coolant to travel from the reservoir to the heat exchanger; and', 'an inlet port that allows coolant to travel from the heat exchanger to the reservoir;, 'a coolant-containing reservoir in fluid communication with the heat exchanger, the reservoir comprising, 'a check valve in fluid communication with the heat exchanger and the reservoir, the check valve having a structure that allows a leak across the valve when the valve is in the closed position;', 'a venturi constriction in fluid communication with the heat exchanger and the reservoir;, 'a coolant circuit comprisinga pump in fluid communication with the reservoir, the pump constructed to propel coolant from the reservoir to the heat exchanger and back to the reservoir; anda vacuum in fluid communication with the reservoir, the vacuum maintaining the coolant circuit under negative pressure relative to ambient pressure.2. The ...

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Номер записи: 22
31-01-2019 дата публикации

A DESIGN OF LIQUID COOLING FOR ELECTRONIC RACKS WITH LIQUID COOLED IT COMPONENTS IN DATA CENTERS

Номер: US20190037730A1
Автор: CUI Yan, Gao Tianyi, Luo Zhiming, TAN Xianguang, TANG Hu, ZHOU Tianyu
Принадлежит:

A data center liquid cooling coolant distribution system design for multiple liquid cooled racks which are arranged in multiple rows. These rows of electronic racks are positioned spaced apart from each other to form an aisle. The data center system further includes a CDU to provide cooling liquid to the electronic racks to remove heat generated from the IT components of the electronic racks. The CDU includes a set of liquid supply and return lines coupled to room manifolds arranged within the aisle. The room manifolds are coupled to rack manifolds of each electronic rack. The rack manifolds of an electronic rack are adapted to receive a cooling liquid from the CDU via the room manifolds and to exchange the heat generated from the IT components of the electronic rack. 1. A data center system , comprising:a first row of electronic racks;a second row of electronic racks positioned spaced apart from the first row of electronic racks, forming an aisle between the first row and the second row of electronic racks; anda coolant distribution unit (CDU) having a first set of a liquid supply line and a liquid return line coupled to a set of room manifolds arranged within the aisle, wherein the room manifolds are coupled to a set of rack manifolds of each of the electronic racks of the first row and the second row, wherein the rack manifolds of each of the electronic racks are adapted to receive a cooling liquid from the CDU via the set of room manifolds, to exchange heat generated from one or more information technology (IT) components of the electronic racks using the cooling liquid, and to return a warmer liquid carrying the exchanged heat back to the CDU.2. The data center system of claim 1 , wherein each of the electronic racks of the first row includes a first cooling fan to generate a first air flow that flows from a far side of the electronic rack claim 1 , through an air space of the IT components claim 1 , to a near side of the electronic rack claim 1 , and into the ...

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Номер записи: 23
31-01-2019 дата публикации

CHASSIS COOLING RESOURCE

Номер: US20190037731A1
Автор: Cader Tahir, Franz John P., Slaby Matthew Richard
Принадлежит:

Example implementations relate to a chassis cooling resource. In some examples, a chassis cooling resource includes a controller, comprising instructions to detect a failure corresponding to a first cooling system of a first chassis coupled to a server rack, and alter settings of a second cooling system of a second chassis coupled the server rack to provide additional cooling resources to the first cooling system in response to the detected failure. 1. A server rack device , comprising:a first pump coupled to a first server chassis and a liquid cooling system of the first server chassis;a second pump coupled to a second server chassis and a liquid cooling system of the second server chassis; andan input manifold to provide cooling resources to the first pump at the first server chassis and to provide cooling resources to the second pump at the second server chassis.2. The server rack device of claim 1 , wherein the input manifold provides liquid from a heat exchanger.3. The server rack device of claim 1 , comprising an output manifold to receive cooling resources from the liquid cooling system of the first server chassis and cooling resources from the liquid cooling system of the second server chassis.4. The server rack device of claim 1 , wherein the first pump is electrically coupled to a first power supply that provides electrical power to the first server chassis and the second pump is electrically coupled to a second power supply that provides electrical power to the second server chassis.5. The server rack device of claim 4 , wherein the first pump and the second pump are electrically coupled to an auxiliary power supply.6. The server rack device of claim 1 , wherein the first pump provides cooling resources to the liquid cooling system of the second server chassis when the first chassis is deactivated.7. A system claim 1 , comprising:a server rack to receive a plurality of server chassis;a first pump coupled to a first server chassis from the plurality of ...

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Номер записи: 24
07-02-2019 дата публикации

SYSTEM TO REDUCE COOLANT USE IN AN ARRAY OF CIRCUIT BOARDS

Номер: US20190045661A1
Автор: Broderick Joseph Andrew, CEVALLOS JUAN G., FANEUF BARRETT M., FREY EMERY E., McAfee Eric D., Sanchez Jaime A.
Принадлежит:

Embodiments described herein may include apparatuses, systems and/or processes to encapsulate a circuit board to be cooled with a liquid coolant, that includes a first part dimensioned to receive the circuit board coupled with one or more heat sinks; a second part dimensioned to mate with the first part, and with a portion of a side of the circuit board around the one or more heat sinks to create a volume surrounding the circuit board, with a portion of the one or more heat sinks are outside the volume and is to be exposed to the liquid coolant, and a sealer to seal areas where the second part mates with the first part and the portion of the side of the circuit board, to prevent the liquid coolant from entering the volume. Other embodiments may be described and/or claimed. 1. An apparatus to encapsulate a circuit board to be cooled with a liquid coolant , comprising:a first part dimensioned to receive the circuit board coupled with one or more heat sinks;a second part dimensioned to mate with the first part, and with a portion of a side of the circuit board around the one or more heat sinks to create a volume surrounding the circuit board, wherein a portion of the one or more heat sinks are outside the volume and is to be exposed to the liquid coolant; anda sealer to seal areas where the second part mates with the first part and the portion of the side of the circuit board, to prevent the liquid coolant from entering the volume.2. The apparatus of claim 1 , wherein the first part and the second part include a rigid material to cause the first part and the second part to substantially retain its shape when submerged in the liquid coolant.3. The apparatus of claim 1 , wherein the first part and the second part claim 1 , when mated together claim 1 , substantially form a rectangular prism.4. The apparatus of claim 1 , wherein the first part and the second part are dimensioned to include a channel formed in the second part from a first side of the second part to a ...

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Номер записи: 25
16-02-2017 дата публикации

Gravity assisted cooling systems for data centers

Номер: US20170049005A1
Автор: Anson Yen Chen, John Gary Waclawsky, Kenneth Kyung Choi
Принадлежит: Individual

Systems and methods are disclosed for cooling a computing facility housed in a structure surrounded by or nearby water. An inlet may and an outlet may be defined in a hull of a structure and a fluid path may extend between the inlet and outlet. The fluid path is configured to cool the computers of the computing facility as water from a body of water passes through the fluid path. The fluid path may include one or both of inlet and outlet siphons to draw water down into a basin positioned below the waterline. The fluid path between inlet and outlet may be closed and flow from inlet to outlet may be partially or completely driven by convection. Fluid flow may also be driven by gravity by placing an end of an outlet tube below the water line, such as adjacent a dam or other barrier bounding the body of water.

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Номер записи: 26
03-03-2022 дата публикации

Intelligent threshold leak remediaton of datacenter cooling systems

Номер: US20220071049A1
Автор: Ali Heydari, Harold Miyamura, Mike Sabotta
Принадлежит: Nvidia Corp

A remediation system for threshold leaks in a datacenter liquid cooling system is disclosed. The system includes a fluid controller and a power controller that are adapted to receive input from a learning subsystem that can determine that a threshold leak has occurred even though a computing component is functioning normally, so that a change in power state to reduce reliance on the coolant and so that a change of flow of the coolant may be effected.

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Номер записи: 27
03-03-2022 дата публикации

REDUNDANT LIQUID DISTRIBUTION UNITS FOR DATACENTER RACKS

Номер: US20220071063A1
Автор: Heydari Ali
Принадлежит:

A datacenter liquid cooling system is disclosed. At least two liquid distribution units (LDUs) are enabled to concurrently serve coolant to at least one server tray in a first configuration, and the at least two LDUs are enabled for replacement of a first one of the at least two LDUs in a second configuration, in which a second one of the at least two LDUs is enabled to serve the coolant to the at least one server tray.

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Номер записи: 28
22-02-2018 дата публикации

Liquid Cooling System with Extended Microchannel and Method Therefor

Номер: US20180054924A1
Автор: North Travis C., Zill Jay M.
Принадлежит:

A heat exchanger includes a flat tube microchannel. A major surface of the microchannel has a first width at a first and a second opposite end portion to couple each end portion to a corresponding fluid distribution header. A middle portion of the microchannel between the first and second end portions has a second width that is greater than the first width. Fins are attached to the middle portion of the first major surface of the flat tube microchannel. 1. A heat exchanger comprising:a flat tube microchannel, wherein a major surface of the microchannel has a first width at first and second opposite end portions to couple each end portion to a corresponding fluid distribution header, and wherein the major surface of the microchannel has a middle portion between the first and the second end portions having a second width that is greater than the first width; andat least one fin attached to the middle portion of the first major surface of the flat tube microchannel.2. The heat exchanger of claim 1 , wherein the flat tube microchannel comprises a single continuous material.3. The heat exchanger of claim 1 , wherein the width of the middle portion of the flat tube microchannel is enlarged from the first width to the second width using water pressure.4. The heat exchanger of claim 1 , wherein:the middle portion of the flat tube microchannel includes a first flat tube microchannel having the second width; andeach end portion comprises a flat tube expansion joint sealed to the opposite ends of the first flat tube microchannel, wherein a first end of each expansion joint has the first width, and a second end of each expansion joint has a width to enable attaching the second end to a corresponding end of the first flat tube microchannel.5. The heat exchanger of claim 1 , wherein the first and the second end portion and the middle portion of the flat tube microchannel are symmetrical across the first major surface about a center line extending from a middle of the first end ...

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Номер записи: 29
05-03-2015 дата публикации

Information processing apparatus

Номер: US20150059388A1
Автор: Akira Shimasaki, Keita Hirai, Keitaro KUROSAKI, Misao Umematsu, Yukihiro Hirano
Принадлежит: Fujitsu Ltd

An apparatus includes a cooling device that cools, by using refrigerant, heating components mounted over a circuit board and has different use-temperature conditions, wherein the circuit board is provided with a first area in which a first group of heating components having an operating condition of generating heat less than a given-heat quantity and operating in a temperature range lower than a first temperature is arranged, a second area in which a second group of heating components having an operating condition of generating heat equal not less than the given-heat quantity and operating in a temperature range between the first temperature and a second temperature exceeding the first temperature is arranged, and a third area in which a third group of heating components having an operating condition of generating heat equal to or less than the given-heat quantity and operating in a temperature range exceeding the second temperature is arranged.

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Номер записи: 30
05-03-2015 дата публикации

SERVER

Номер: US20150062803A1
Автор: HUANG KUO-CHIN, LIN Mao-Ching
Принадлежит:

A server includes a motherboard and a heat dissipation module. The motherboard includes a heat source. The heat dissipation module includes a cooling plate, a liquid cooling heat exchanger, a circulation line and several fans. The cooling plate is thermally contacted with the heat source. The liquid cooling heat exchanger is located on one side of the motherboard. The liquid cooling heat exchanger is connected with the cooling plate via the circulation line for forming a circulation circuit. The plurality of fans are located next to the liquid cooling heat exchanger. 1. A server , comprising:a motherboard having a heat source; and a cooling plate thermally contacted with the heat source;', 'a liquid cooling heat exchanger located on one side of the motherboard;', 'a circulation line, wherein the liquid cooling heat exchanger is connected with the cooling plate via the circulation line for forming a circulation circuit; and', 'a plurality of fans located next to the liquid cooling heat exchanger., 'a heat dissipation module, comprising2. The server according to claim 1 , wherein the heat source is a central processing unit.3. The server according to claim 1 , wherein the plurality of fans are located between the liquid cooling heat exchanger and the cooling plate.4. The server according to claim 3 , wherein the plurality of fans are arranged side by side.5. The server according to claim 1 , wherein each of the plurality of fans has a fan inlet facing toward the liquid cooling heat exchanger.6. The server according to claim 1 , wherein each of the plurality of fans has a fan outlet and at least one of the fan outlets faces toward the heat source.7. The server according to claim 1 , wherein the heat dissipation module further comprises a water pump which is located in the circulation circuit.8. The server according to claim 7 , wherein the liquid cooling heat exchanger includes a liquid outlet and the cooling plate includes an entry port claim 7 , wherein the liquid ...

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Номер записи: 31
10-03-2022 дата публикации

SYSTEM AND METHOD FOR MANAGING AIRFLOW IN A DATA CETER

Номер: US20220078945A1
Автор: Gao Tianyi
Принадлежит:

Described herein is an airflow management system and method. The system includes a top layer and a bottom layer, and each of the layers has a dedicated air flow management and hardware system that are operated independently. The top layer is a drop ceiling air plenum, and can store fan coils arranged in a hot aisle containment fashion or a cold hair containment fashion. The top layer receives fresh air from its own air source, and exhausts hot air through its own exhaust. The bottom layer can include server racks arranged in a hot aisle containment fashion or a cold aisle containment fashion. One or more servers in the bottom layer can include an air cooling component and a liquid cooling component, and receive cooling liquid from the top layer and receives cooling air from its own air source. 1. An airflow management system for cooling a data center , comprising:a first layer that includes a plurality of fan coils; anda second layer under the first layer, and connected to the first layer through a plurality of liquid loops and liquid connectors, the second layer including a plurality of electronic racks arranged in a plurality of rows, each electronic rack including one or more servers,wherein at least one server in the second layer includes a liquid cooling component and an air cooling component, andwherein the liquid cooling component receives cooling liquid from one of the plurality of fan coils through one of the plurality of liquid loops and one of the plurality of liquid connectors, and the air cooling component receives cooling air from an air source specific to the second layer.2. The airflow management system of claim 1 , wherein each of the one or more servers is placed on one of the electronic racks claim 1 , the electronic rack further including a liquid distribution unit that receives the cooling liquid from one of the plurality of fan coils and distributes the received cooling liquid to the liquid cooling component in the server.3. The airflow ...

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Номер записи: 32
03-03-2016 дата публикации

BLIND DOCKING APPARATUS TO ENABLE LIQUID COOLING IN COMPUTE NODES

Номер: US20160066480A1
Автор: Eckberg Eric A., Kerrigan Brian M., Lindsay Robert M., Miller Michael S., Schmidt Derek I., Womble James S.
Принадлежит:

An apparatus includes a rigid structure having first and second collars, a quick connect connector having first and second shoulders, and a spring biasing the connector toward an extended position with the first shoulder against the first collar and the second shoulder against the second collar. The first collar and the first shoulder form an inwardly and rearwardly angled contact surface there between, and the second collar and the second shoulder form an inwardly and rearwardly angled contact surface there between. The connector is centered in the first and second collars unless acted upon by a force overcoming the spring and pushing the connector to a retracted position with the first and second shoulders out of contact with the first and second collars. When retracted, the connector may adjust its position longitudinally, vertically, laterally or angularly to facilitate coupling with a mating fixed quick connect connector. 1. An apparatus comprising:a chassis including a fluid supply conduit, a fluid return conduit, a first quick connect connector that is fluidically coupled to the fluid supply conduit, a second quick connect connector that is fluidically coupled to the fluid return conduit, and a bay configured to receive a compute node, wherein the first and second quick connect connectors are secured in a fixed position at the back of the bay and oriented in a forward direction into the bay;a compute node having a rearward end securing a first compliant connector assembly and a second compliant connector assembly, wherein the first compliant connector assembly includes a third quick connect connector oriented in a rearward direction so that installing the compute node within the bay provides nominal alignment of the third quick connect connector with the first quick connect connector, and wherein the second compliant connector assembly includes a fourth quick connect connector oriented in a rearward direction so that installing the compute node within the bay ...

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Номер записи: 33
01-03-2018 дата публикации

LIQUID IMMERSION BATH AND LIQUID IMMERSION COOLING APPARATUS

Номер: US20180063991A1
Автор: HIRAI Keita, KOSUGI NAOFUMI, SO Tsuyoshi
Принадлежит: FUJITSU LIMITED

A liquid immersion bath includes: a liquid immersion bath main body in which liquid coolant and an electronic device to be immersed in the coolant are placed; a coolant inlet and a coolant outlet provided to the liquid immersion bath main body; a coolant discharge port which floats on a liquid surface of the liquid coolant in the liquid immersion bath main body; and a hose which couples the coolant outlet and the coolant discharge port and bends in accordance with a movement of the coolant discharge port due to variation in a height of the liquid surface. 1. A liquid immersion bath comprising:a liquid immersion bath main body in which liquid coolant and an electronic device to be immersed in the coolant are placed;a coolant inlet and a coolant outlet provided to the liquid immersion bath main body;a coolant discharge port which floats on a liquid surface of the liquid coolant in the liquid immersion bath main body; anda hose which couples the coolant outlet and the coolant discharge port and bends in accordance with a movement of the coolant discharge port due to variation in a height of the liquid surface.2. The liquid immersion bath according to claim 1 , wherein the coolant discharge port includes:a float which floats on the liquid surface of the liquid coolant; anda suction port part disposed under the float and corresponding to a suction port to suction the liquid coolant in the liquid immersion bath main body.3. The liquid immersion bath according to claim 1 , whereinthe hose is a bellows hose.4. The liquid immersion bath according to claim 1 , whereinthe hose is capable of extending and contracting.5. The liquid immersion bath according to claim 1 , whereina plurality of coolant discharge ports are provided as the coolant discharge port and a plurality of hoses are provided as the hose.6. The liquid immersion bath according to claim 1 , whereinthe coolant inlet is disposed at a lower portion of the liquid immersion bath main body, and the coolant outlet is ...

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Номер записи: 34
09-03-2017 дата публикации

PROVISIONING COOLING ELEMENTS FOR CHILLERLESS DATA CENTERS

Номер: US20170071078A1
Автор: CHAINER Timothy J., PARIDA Pritish R.
Принадлежит:

Systems and methods for cooling include one or more computing structure, an inter-structure liquid cooling system that includes valves configured to selectively provide liquid coolant to the one or more computing structures; a heat rejection system that includes one or more heat rejection units configured to cool liquid coolant; and one or more liquid-to-liquid heat exchangers that include valves configured to selectively transfer heat from liquid coolant in the inter-structure liquid cooling system to liquid coolant in the heat rejection system. Each computing structure further includes one or more liquid-cooled servers; and an intra-structure liquid cooling system that has valves configured to selectively provide liquid coolant to the one or more liquid-cooled servers; 1. A method for providing multi-level distributed cooling to a data center , comprising:providing a flow of liquid coolant to one or more racks including operating servers in the data center;monitoring a liquid coolant temperature before the coolant has entered into one or more racks;monitoring ambient temperature information;adjusting cooling of the data center in accordance with the ambient temperature information, wherein cooling of the data center is adjusted by decreasing cooling of the liquid coolant if the coolant temperature falls below a first coolant threshold temperature by disengaging one or more liquid-to-liquid heat exchangers; andturning on additional servers if the coolant temperature is below the first coolant threshold and all liquid-to-liquid heat exchangers have been disengaged.2. The method of claim 1 , wherein monitoring includes monitoring the coolant temperature after the coolant has exited one or more racks.3. The method of claim 1 , wherein adjusting cooling of the liquid coolant in accordance with the ambient temperature information includes decreasing cooling by shutting off the flow of coolant through one or more liquid-to-liquid heat exchangers to increase the coolant ...

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Номер записи: 35
09-03-2017 дата публикации

ULTRASOUND ASSISTED IMMERSION COOLING

Номер: US20170071079A1
Автор: JARRETT BRIAN S., Krishnan Shankar, Stamey Richard C., Von Allmen Geoffrey G.
Принадлежит:

Apparatuses, methods and storage media associated with cooling one or more heat-generating components of an electronic device are disclosed herein. In embodiments, an electronic device may include a tank that may include a dielectric fluid and one or more heat-generating components. The electronic device may further include one or more transducers coupled with the tank. The transducers may be configured to generate an ultrasonic wave that controls movement of the dielectric fluid at a location within the tank. Other embodiments may be described and/or claimed. 1. One or more non-transitory computer-readable media comprising instructions to cause an electronic device , upon execution of the instructions by one or more processors of the electronic device , to:identify a heat condition associated with a heat-generating component immersed in a dielectric fluid in a tank; andfacilitate generation, by one or more transducers, of an ultrasound wave to cause controlled movement of the dielectric fluid at a location in a vicinity of the heat-generating component.2. The one or more non-transitory computer-readable media of claim 1 , wherein the apparatus is a blade server claim 1 , a chassis that includes a plurality of blade servers claim 1 , or a rack that includes a plurality of chassis with respective pluralities of blade servers.3. The one or more non-transitory computer-readable media of claim 1 , wherein to facilitate generation comprises to facilitate generation of an ultrasound wave with a frequency between 20 kilohertz and 30 Megahertz.4. The one or more non-transitory computer-readable media of claim 1 , wherein to identify a heat condition comprises to identify a heat condition claim 1 , a power condition claim 1 , or a workload condition.5. A method comprising:identifying, by logic of an apparatus, a heat condition associated with a heat-generating component immersed in a dielectric fluid in a tank; andfacilitating, by the logic, generation by one or more ...

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Номер записи: 36
11-03-2021 дата публикации

Liquid Cooling System For An Electronic Card With A Cold Plate And Heat Sinks Connected To The Cold Plate By Flexible Connections

Номер: US20210076539A1
Автор: RAETH Marc
Принадлежит: BULL SAS

A liquid cooling system for a circuit board made up of a cold plate and heat sinks connected to the cold plate by flexible connections. 1. A system comprising: a substrate; and', 'a plurality of electronic components secured to said substrate that comprise low-level and mid-level electronic components and a high-level electronic component;, 'a circuit board comprising a cold plate having external dimensions approximately equal to external dimensions of said such that said substrate covers said substrate entirely and said low-level and mid-level electronic components, said cold plate being made of a heat conducting material and comprising a primary cooling circuit comprising main ducts within which a heat transfer fluid flows, said heat transfer fluid being fed into said cold plate via an inlet connector and said heat transfer fluid being discharged from said cold plate via an outlet connector;', 'a heat sink comprising a main heat exchange zone that is able to bear against said high-level electronic component;', a cooling block made of heat conducting material comprising a lower part forming said main heat exchange zone, said intermediate part known as the distribution part, and said upper part connected to said cold plate;', 'wherein one part of said inlet duct is connected to said upper part of said cooling block via said inlet connector and one part of said outlet duct is connected to said upper of said cooling block said outlet connector, and a second part of said inlet duct is connected to a flexible secondary duct of the secondary circuit via a first angled connector and a second part of said outlet duct is connected to said flexible secondary duct via a second angled connector, such that said cooling block is supplied with said heat transfer fluid flowing in said cold plate, said first angled connector and said second angled connector being able to allow said inlet duct and said outlet duct to rotate with respect to said flexible secondary duct to which they ...

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Номер записи: 37
18-03-2021 дата публикации

COOLING CHASSIS DESIGN FOR SERVER LIQUID COOLING OF ELECTRONIC RACKS OF A DATA CENTER

Номер: US20210084793A1
Автор: Gao Tianyi
Принадлежит:

An electronic rack includes a number of server chassis arranged in a stack. Each server chassis includes one or more servers and each server includes one or more processors. The electronic rack further includes a number of cooling chassis corresponding to the server chassis. Each cooling chassis is configured to provide liquid cooling to the processors of the server chassis. The cooling chassis includes a cooling module having one or more cooling devices arranged and positioned vertical aligned with the processors of the corresponding server chassis to extract the heat generated from the processors. The cooling chassis further includes a cooling unit coupled to the cooling modules to form a cooling loop to circulate the cooling liquid between the cooling devices and the cooling unit to cool the cooling liquid carrying the heat extracted from the cooling devices. A natural convection cooling loop is assembled and adapted on the cooling chassis. 1. An electronic rack of a data center , comprising:a plurality of server chassis arranged in a stack, each server chassis including one or more servers and each server having one or more processors; and a cooling module having one or more cooling devices, wherein each of the one or more cooling devices is vertically aligned with, and in contact with, a corresponding one of the one or more processors, and', 'a cooling unit coupled to the cooling module to form a cooling loop to circulate cooling liquid between the one or more cooling devices and the cooling unit to cool the cooling liquid carrying heat extracted from the one or more cooling devices., 'a plurality of cooling chassis, each cooling chassis corresponding to one of the server chassis, wherein each of the cooling chassis is configured to provide liquid cooling to the one or more processors of a corresponding server chassis, wherein each cooling chassis comprises2. The electronic rack of claim 1 , wherein each cooling chassis is positioned on top of the corresponding ...

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Номер записи: 38
22-03-2018 дата публикации

Composite heat sink structures

Номер: US20180082926A1
Автор: Dustin W. Demetriou, Levi A. Campbell, Michael J. Ellsworth, Jr., Milnes P. DAVID, Robert E. Simons, Roger R. Schmidt
Принадлежит: International Business Machines Corp

Composite heat sink structures and methods of fabrication are provided, with the composite heat sink structures including: a thermally conductive base having a main heat transfer surface to couple to, for instance, at least one electronic component to be cooled; a compressible, continuous sealing member; and a sealing member retainer compressing the compressible, continuous sealing member against the thermally conductive base; and an in situ molded member. The in situ molded member is molded over and affixed to the thermally conductive base, and is molded over and secures in place the sealing member retainer. A coolant-carrying compartment resides between the thermally conductive base and the in situ molded member, and a coolant inlet and outlet are provided in fluid communication with the coolant-carrying compartment to facilitate liquid coolant flow through the compartment.

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Номер записи: 39
22-03-2018 дата публикации

SERVER MEMORY COOLING APPARATUS

Номер: US20180084672A1
Автор: Berk Todd, Eriksen Andre S.
Принадлежит: Asetek Danmark A/S

A system to aid in cooling an in-line memory module may include a heat spreader including a channel to accommodate the in-line memory module, thermal interface material, and a liquid-cooler block including a heat-conducting cold plate and an internal liquid channel filled with circulating cooling liquid. Also disclosed are systems employing tubes to convey cooling fluid. 1. A thermal management apparatus for cooling one or more in-line memory modules , comprising:a manifold including a plurality of parallel cooling tubes each having a first end and a second end, wherein each of the cooling tubes is made of a heat-conducting material,wherein each of the plurality of cooling tubes is configured to contain a cooling liquid, andwherein the plurality of cooling tubes are spaced apart from one another so as to receive at least one in-line memory module between adjacent cooling tubes;a first chamber fluidly coupled to the first ends of the plurality of cooling tubes so that each of the first ends terminates at the first chamber;a second chamber fluidly coupled to the second ends of the plurality of cooling tubes so that each of the second ends terminates at the second chamber;a first connector fluidly coupled to the first chamber for fluidly attaching the first chamber to a cooling circuit, wherein the first connector and the first chamber are configured to flow the cooling liquid from the first connector, through the first chamber, to the plurality of cooling tubes; anda second connector fluidly coupled to the second chamber for fluidly attaching the second chamber to the cooling circuit, wherein the second connector and the second chamber are configured to flow the cooling liquid from the plurality of cooling tubes through the second chamber to the second connector.2. The thermal management apparatus of claim 1 , wherein at least one of the plurality of cooling tubes has a thermal adhesive on an outer surface for contacting the at least one in-line memory module.3. The ...

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Номер записи: 40
12-03-2020 дата публикации

Memory system and storage system

Номер: US20200084914A1
Автор: Daigo TANUMA, Kengo Kumagai
Принадлежит: Toshiba Memory Corp

A memory system includes a substrate extending in a first direction and including first and second portions that are arranged along a line in the first direction, terminals disposed on the first portion, electronic components mounted on the second portion and including a nonvolatile memory and a controller configured to control the nonvolatile memory, and an encapsulating member that encapsulates the second portion and the electronic components.

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Номер записи: 41
25-03-2021 дата публикации

COOLING DEVICES FOR EDGE COMPUTING AND HETEROGENEOUS COMPUTING ELECTRONICS HARDWARE

Номер: US20210092878A1
Автор: Gao Tianyi
Принадлежит:

In one embodiment, a cooling device for providing liquid cooling to a processor or a computing hardware/system includes a first cooling plate having a first liquid distribution channel integrated therein. The first cooling plate is to be positioned on a top surface of a processor to extract heat from the top surface of the processor using cooling liquid flowing through the first liquid distribution channel. The cooling device further includes a second cooling plate having a second liquid distribution channel integrated therein. The second cooling plate is to be positioned at a bottom surface of the processor to extract heat from the bottom surface of the processor using cooling liquid flowing through the second liquid distribution channel. The cooling device further includes a mounting mechanism to mount the first and second cooling plates onto top and bottom of the processor to sandwich the process in between with good thermal contact. 1. A cooling device for providing liquid cooling to a processor , the cooling device comprising:a first cooling plate having a first liquid distribution channel embedded therein, the first cooling plate to be positioned on a top surface of the processor, wherein the first cooling plate is to extract heat from the top surface of the processor using cooling liquid flowing in the first liquid distribution channel;a second cooling plate having a second liquid distribution channel embedded therein, the second cooling plate to be positioned at a bottom surface of the processor, wherein the second cooling plate is to extract heat from the bottom surface of the processor using cooling liquid flowing in the second liquid distribution channel; anda mounting mechanism to mount the first cooling plate onto the top surface of the processor and the second cooling plate onto the bottom surface of the processor to sandwich the processor in between by a mounting pole, wherein the mounting mechanism includes one or more teeth on a tip of the mounting ...

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Номер записи: 42
25-03-2021 дата публикации

COLD PLATE WITH METAL TUBE CONNECTION AND FLEXIBLE METAL TUBE

Номер: US20210092879A1
Автор: Chen Chao-Jung, HUANG Yu-Nien, LEE Kuo-Wei, LI Tsung-Ta
Принадлежит:

A cold plate assembly for cooling heat-generating electrical component on a circuit board is disclosed. The cold plate assembly includes a cold plate with a bottom contact surface to thermally contact the heat-generating electrical component. The cold plate has an inlet coupler on an opposite top surface to receive coolant; an internal conduit to circulate the received coolant; and an outlet coupler on the opposite top surface to return the coolant. A flexible metal inlet tube is fluidly connected to the inlet coupler to supply coolant. A flexible metal outlet tube is fluidly connected to the outlet coupler to return coolant. 1. A cooling system comprising:an inlet manifold for delivering coolant at a first temperature;an outlet manifold for receiving coolant at a second temperature that is higher than the first temperature;a first fluidic circuit between the inlet manifold and the outlet manifold, the first fluidic circuit comprising a first cold plate couplable to a first heat-generating electrical component; a flexible metal inlet tube couplable to the first cold plate and the inlet manifold; and a flexible metal outlet tube couplable to the first cold plate and the outlet manifold.2. The cooling system of claim 1 , further comprising a second fluidic circuit between the inlet manifold and the outlet manifold; the second fluidic circuit comprising a second cold plate couplable to a second heat-generating electrical component; another flexible metal inlet tube couplable to the second cold plate and the inlet manifold; and another flexible metal outlet tube couplable to the second cold plate and the outlet manifold such that the second cold plate can move independently of the first cold plate.3. The cooling system of claim 1 , wherein the first fluidic circuit comprises an additional cold plate.4. The cooling system of claim 1 , wherein the first fluidic circuit includes a rigid metal tube having one end connected to the first cold plate and an opposite end ...

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Номер записи: 43
29-03-2018 дата публикации

RACK INFORMATION HANDLING SYSTEM HAVING MODULAR LIQUID DISTRIBUTION (MLD) CONDUITS

Номер: US20180092254A1
Автор: Bailey Edmond I., CURLEE JAMES D., Embleton Steven, HELBERG CHRISTOPHER M., North Travis C., SHELNUTT AUSTIN MICHAEL
Принадлежит:

A direct-interface liquid-cooled (DL) Rack Information Handling System (RIHS) includes liquid cooled (LC) nodes each comprising a chassis received in a respective chassis-receiving bay of a rack and containing heat-generating functional components. Each LC node is configured with a system of conduits to receive direct injection of cooling liquid to regulate the ambient temperature of the node and provide cooling to the functional components inside the node by removing heat generated by the heat-generating functional components. A cooling subsystem has a liquid rail formed by more than one node-to-node, Modular Liquid Distribution (MLD) conduits, each including first and second terminal connections attached on opposite ends of a central conduit that can be rack-unit dimensioned. The MLD conduits seal to and enable fluid transfer between a port of a selected LC node and a port of an adjacent LC node. 1. A Rack Information Handling System (RIHS) comprising:a rack having chassis-receiving bays;more than one liquid cooled (LC) node each comprising a chassis received in a respective chassis-receiving bay of the rack and containing heat-generating functional components, each LC node configured with a system of conduits to receive direct injection of cooling liquid to regulate the ambient temperature of the node and provide cooling to the functional components inside the node by removing heat generated by the heat-generating functional components; anda cooling subsystem having a liquid rail formed by more than one node-to-node, Modular Liquid Distribution (MLD) conduit between LC nodes provisioned in the rack and comprising first and second terminal fluid connections attached on opposite ends of a central conduit to seal to and enable fluid transfer between a port of a selected LC node and a port of another adjacent node.2. The RIHS of claim 1 , wherein the MLD conduits are provided in rack-unit dimensions to selectively support LC nodes of selected rack-unit vertical ...

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Номер записи: 44
21-03-2019 дата публикации

Mechanism with folded wrapping to seal components immersed in coolant

Номер: US20190090344A1
Автор: Annie Chen, Barrett M. Faneuf, Devdatta P. Kulkarni, Jessica Gulbrand, Joseph Andrew Broderick, Kristin L. Weldon
Принадлежит: Intel Corp

Embodiments described herein may include apparatuses, systems and/or processes to provide a mechanism with a folded wrapping to mate with a circuit board and a heatsink to enclose and seal a volume between the circuit board and the heatsink. The mechanism with the folded wrapping may be dimensioned to enclose and seal the volume with the volume having a size to accommodate one or more processors to be disposed within the volume, electrically coupled to the circuit board and thermally coupled to the heatsink. On enclosing and sealing the volume, the mechanism with the folded wrapping may keep coolant from reaching the one or more processors when the circuit board, the mechanism, and the heatsink are immersed in the coolant. Other embodiments may be described and/or claimed.

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Номер записи: 45
23-04-2015 дата публикации

Coolant-cooled heat sink configured for accelerating coolant flow

Номер: US20150107801A1
Автор: Levi A. Campbell, Madhusudan K. Iyengar, Michael J. Ellsworth, Jr., Milnes P. DAVID, Richard C. Chu, Robert E. Simons, Roger R. Schmidt
Принадлежит: International Business Machines Corp

Cooling apparatuses, cooled electronic modules, and methods of fabrication are provided which facilitate heat transfer from one or more electronic components to a coolant. The cooling apparatus includes a coolant-cooled heat sink with a thermally conductive structure having a coolant-carrying compartment including a varying cross-sectional coolant flow area through which coolant flows in a direction substantially parallel to a main heat transfer surface of the structure coupled to the electronic component(s). The coolant-cooled heat sink includes a coolant inlet and a coolant outlet in fluid communication with the coolant-carrying compartment, and the coolant flow area of the coolant-carrying compartment decreases, at least in part, in a direction of coolant flow through the coolant-carrying compartment. The decreasing coolant flow area facilitates an increasing effective heat transfer coefficient between the main heat transfer surface and the coolant by, at least in part, accelerating the coolant flow within the coolant-carrying compartment.

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Номер записи: 46
28-03-2019 дата публикации

MEMORY DEVICE WITH MEMORY MODULES LOCATED WITHIN LIQUID COOLANT CHAMBER

Номер: US20190098798A1
Автор: Franz John, MICHNA Vincent W.
Принадлежит:

An example memory device includes a printed circuit board, a case, a bus, and memory modules. The case includes a number of walls, and at least some of the walls and the printed circuit board together form a liquid coolant chamber that is liquid-tight (excluding any hose connectors). The bus includes memory sockets connected to the printed circuit board and located within the liquid coolant chamber, and the memory modules are installed in the memory sockets and within the liquid coolant chamber. The bus also includes a connector to connect to a memory bus of a main printed circuit board of a computing device, the connector being external to the liquid coolant chamber. 1. A memory device comprising:a printed circuit board,a case comprising a number of walls, wherein at least some of the walls and the printed circuit board together form a liquid coolant chamber that is liquid-tight excluding any hose connectors; memory sockets connected to the printed circuit board and located within the liquid coolant chamber, and', 'a connector to connect to a memory bus of a main printed circuit board of a computing device, wherein the connector is external to the liquid coolant chamber; and', 'memory modules installed in the memory sockets, the memory modules being within the liquid coolant chamber., 'a bus that includes2. The memory device of claim 1 , further comprising: liquid coolant within the liquid coolant chamber; and', 'a number of hose connectors to connect the liquid coolant chamber to a liquid cooling system of the computing device., 'at least one of3. The memory device of claim 2 , further comprising:a heat conduit that is connected to a given wall of the case, extends outward from the case, and is to connect to a cold plate of a liquid cooling system of the computing device,wherein the memory device includes liquid coolant within the liquid coolant chamber and does not include any of the hose connectors.4. The memory device of claim 1 ,wherein the connector is ...

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Номер записи: 47
12-05-2022 дата публикации

Symmetrical cold plate design

Номер: US20220151099A1
Автор: Tianyi Gao
Принадлежит: Baidu USA LLC

Embodiments are disclosed of a cold plate including substantially identical first and second frames. The first frame includes a first frame body with a first recess, a first mating surface surrounding the first recess, and a first plurality of heat transfer fins in the first recess. The second frame includes a second frame body with a second recess, a second mating surface surrounding the second recess, and a second plurality of heat transfer fins in the second recess. The second mating surface is in sealing contact with the first mating surface, so that the first and second recesses form a fluid chamber. The first and second pluralities of heat transfer fins form a plurality of fin channels in the fluid chamber. Advanced sealing structures can be formed between the first and second mating surfaces. A first fluid port and a second fluid port are fluidly coupled via fluid channels to the plurality of fin channels.

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Номер записи: 48
12-05-2022 дата публикации

IMMERSION COOLING SYSTEM AND SERVER SYSTEM HAVING THE SAME

Номер: US20220151111A1
Автор: HSIAO WEI-HSIANG, LAI YING-TSO
Принадлежит:

An immersion cooling system includes a receiving member, a heat dissipation channel, and a heat sink. The receiving member is filled with coolant. The receiving member is connected to an end of the heat sink, and heat-generating entities such as one or more servers are positioned in a cavity of the receiving member. The heat dissipation channel is connected to the cavity and is connected to the heat sink. The heat dissipation channel communicates with the cavity and allows circulation of the coolant in the channel, the heat sink cooling down the coolant flowing into heat dissipation channel from the cavity. The immersion cooling system is compact, occupies very little space, and is easily installed, maintained, and moved. A server system having the immersion cooling system is also disclosed. 1. An immersion cooling system , comprising:a heat sink, comprising a heat dissipation channel; anda receiving member connected to an end of the heat sink, the receiving member defining a cavity, the cavity is configured to receive a coolant,wherein the heat dissipation channel communicates with the cavity and forms a circulation channel with the cavity, the heat sink is configured to cool down the coolant flows into heat dissipation channel from the cavity.2. The immersion cooling system of claim 1 , wherein the receiving member is made of a transparent material.3. The immersion cooling system of claim 1 , wherein the heat dissipation channel comprises a liquid inlet tube claim 1 , a liquid outlet tube claim 1 , and a heat dissipation return portion claim 1 , the liquid inlet tube and the liquid outlet tube are positioned in the cavity claim 1 , the heat dissipation return portion is positioned in the heat sink claim 1 , the liquid inlet tube communicates with an end of the heat dissipation return portion claim 1 , and the liquid outlet tube communicates with another end of the heat dissipation return portion.4. The immersion cooling system of claim 3 , wherein immersion ...

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Номер записи: 49
12-05-2022 дата публикации

COOLING MODULE AND COOLING MODULE RACK

Номер: US20220151112A1
Автор: Edmunds Neil, Longhurst Nathan
Принадлежит:

A cooling module and/or a computing system comprising cooling modules are provided. The computing system may comprise: a server rack for holding computing units at different heights; at least two cooling modules for mounting in the server rack, comprising a first housing enclosing a first computing unit. The two cooling modules may house different types of information technology equipment, but have the same height. The cooling module may containing an electronic device and liquid coolant. It may have one or more of: a sidewall with a reinforcement adaptation; an lower and/or upper wall with a central portion that is close to the opposite wall an internal surface further from its outer surface than in another portion of the internal volume; a separable lid with an overlapping ridge; and a thermally conductive component passing through a sidewall. 1. A computing system , comprising:a server rack configured to hold a plurality of computing units at different levels in a height dimension;a first cooling module configured to be mounted in the server rack, comprising a first housing enclosing a first computing unit, the first housing having a first size in the height dimension; anda second cooling module configured to be mounted in the server rack, comprising a second housing enclosing a second computing unit that is a different type of information technology equipment than that of the first computing unit, the second housing having a second size in the height dimension; andwherein the first and second sizes are the same.2. The computing system of claim 1 , wherein the size of the first and second housings in all dimensions are the same.3. The computing system of claim 1 , wherein each of the computing units held in the server rack is housed in a respective cooling module claim 1 , each of the cooling modules having the same size in the height dimension or one of two different sizes in the height dimension.4. The computing system of claim 1 , wherein the each of the first ...

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Номер записи: 50
26-03-2020 дата публикации

COOLING ELECTRONIC DEVICES IN A DATA CENTER

Номер: US20200100396A1
Автор: Iyengar Madhusudan Krishnan, Padilla Jorge
Принадлежит:

This disclosure describes a cooling system, for example, for rack mounted electronic devices (e.g., servers, processors, memory, networking devices or otherwise) in a data center. In various disclosed implementations, the cooling system may be or include a liquid cold plate assembly that is part of or integrated with a server tray package. In some implementations, the liquid cold plate assembly includes a base portion and a top portion that, in combination, form a cooling liquid flow path through which a cooling liquid is circulated and a thermal interface between one or more heat generating devices and the cooling liquid. 1. A server tray package , comprising:a motherboard assembly that comprises a plurality of data center electronic devices, the plurality of data center electronic devices comprising at least one heat generating processor device; a base portion mounted to the motherboard assembly, the base portion and motherboard assembly defining a volume that at least partially encloses the plurality of data center electronic devices; and', 'a top portion mounted to the base portion and comprising a heat transfer member that comprises an inlet port and an outlet port that are in fluid communication with a cooling liquid flow path defined through the heat transfer member; and, 'a liquid cold plate assembly that comprisesa vapor chamber positioned between the base portion and the top portion, the vapor chamber comprising a housing that fluidly encloses a heat transfer fluid in thermal contact with the motherboard assembly and the liquid cold plate assembly, the heat transfer fluid comprising a vapor phase fluid in conductive thermal contact with the top portion of the liquid cold plate assembly and a liquid phase fluid in conductive thermal contact with the base portion of the liquid cold plate assembly.2. The server tray package of claim 1 , further comprising:a first thermal interface material positioned between a bottom surface of the top portion and the vapor ...

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Номер записи: 51
02-06-2022 дата публикации

Liquid cooled cold plate for multiple semiconductor chip packages

Номер: US20220173015A1
Автор: Carl D. Williams, Jack D. MUMBO, Prabhakar SUBRAHMANYAM, Steven C. Miller
Принадлежит: Intel Corp

An apparatus is described. The apparatus includes a cold plate. The cold plate includes an input port to receive cooled fluid. The cold plate includes an ingress manifold to feed the cooled fluid to different regions, where, each of the different regions are to be located above its own respective semiconductor chip package. The cold plate includes an egress manifold to collect warmed fluid from the different regions. The cold plate includes an output port to emit the warmed fluid from the cold plate.

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Номер записи: 52
21-04-2016 дата публикации

MULTIFUNCTION COOLANT MANIFOLD STRUCTURES

Номер: US20160113149A1
Автор: JR. Francis R., KRUG, ZOODSMA Randy J.
Принадлежит:

A cooling system is provided which includes, for instance, a coolant supply manifold, a multifunction coolant manifold structure, and multiple cooling structures. The multifunction coolant manifold structure includes a coolant-commoning manifold and an auxiliary coolant reservoir above and in fluid communication with the coolant-commoning manifold. The multiple cooling structures are coupled in parallel fluid communication between the coolant supply and coolant-commoning manifolds to receive coolant from the supply, and exhaust coolant to the coolant-commoning manifold. The coolant-commoning manifold is sized to slow therein a flow rate of coolant exhausting from the multiple cooling structures to allow gas within the exhausting coolant to escape the coolant within the coolant-commoning manifold. The escaping gas rises to the auxiliary coolant reservoir and is replaced within the coolant-commoning manifold by coolant from the auxiliary coolant reservoir. 1. A cooling system comprising:a coolant supply manifold; a coolant-commoning manifold; and', 'an auxiliary coolant reservoir disposed above and in fluid communication with the coolant-commoning manifold; and, 'a multifunction coolant manifold structure, includingmultiple cooling structures coupled in parallel fluid communication between the coolant supply manifold and the coolant-commoning manifold to receive coolant from the coolant supply manifold, and exhaust coolant to the coolant-commoning manifold; andwherein the coolant-commoning manifold is sized to slow therein a flow rate of coolant exhausting from the multiple cooling structures to allow gas within the exhausting coolant to escape the coolant within the coolant-commoning manifold, the escaping gas rising from the coolant-commoning manifold to the auxiliary coolant reservoir, and being replaced within the coolant-commoning manifold by coolant from the auxiliary coolant reservoir.2. The cooling system of claim 1 , wherein the multifunction coolant manifold ...

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Номер записи: 53
21-04-2016 дата публикации

MULTIFUNCTION COOLANT MANIFOLD STRUCTURES

Номер: US20160113150A1
Автор: JR. Francis R., KRUG, ZOODSMA Randy J.
Принадлежит:

A cooling system is provided which includes, for instance, a coolant supply manifold, a multifunction coolant manifold structure, and multiple cooling structures. The multifunction coolant manifold structure includes a coolant-commoning manifold and an auxiliary coolant reservoir above and in fluid communication with the coolant-commoning manifold. The multiple cooling structures are coupled in parallel fluid communication between the coolant supply and coolant-commoning manifolds to receive coolant from the supply, and exhaust coolant to the coolant-commoning manifold. The coolant-commoning manifold is sized to slow therein a flow rate of coolant exhausting from the multiple cooling structures to allow gas within the exhausting coolant to escape the coolant within the coolant-commoning manifold. The escaping gas rises to the auxiliary coolant reservoir and is replaced within the coolant-commoning manifold by coolant from the auxiliary coolant reservoir. 1. A method comprising: providing a coolant supply manifold;', a coolant-commoning manifold;', 'an auxiliary coolant reservoir disposed above and in fluid communication with the coolant-commoning manifold; and, 'providing a multifunction coolant manifold structure, including, 'providing multiple cooling structures coupled in parallel fluid communication between the coolant supply manifold and the coolant-commoning manifold to receive coolant from the coolant supply manifold, and exhaust coolant to the coolant-commoning manifold; and', 'wherein the coolant-commoning manifold is sized to slow therein a flow rate of coolant exhausting from the multiple cooling structures to allow gas within the exhausting coolant to escape the coolant within the coolant-commoning manifold, the escaping gas within the coolant-commoning manifold rising to the auxiliary coolant reservoir, and being replaced within the coolant-commoning manifold by coolant from the auxiliary coolant reservoir., 'providing a cooling system, the providing of ...

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Номер записи: 54
02-06-2022 дата публикации

Intelligent and redundant liquid-cooled cooling loop for datacenter cooling systems

Номер: US20220174847A1
Автор: Ali Heydari
Принадлежит: Nvidia Corp

Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, an alternate cooling loop with its own fluid source and a liquid-to-liquid heat exchanger is used to provide cooling for the at least one computing component alternatively from a secondary cooling loop that is associated with a primary cooling loop and a chilling facility.

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Номер записи: 55
02-04-2020 дата публикации

Cpu cooling system with direct spray cooling

Номер: US20200105645A1
Автор: Laurent MYDLARSKI, Michael Hinton
Принадлежит: Hypertechnologie Ciara Inc

There is described a spray chamber for cooling a computer processor on a circuit board. The spray chamber comprises: a wall assembly for sealable mounting on an exposed cooling surface of the computer processor defining an enclosure having a top opening and a bottom opening which opens on the top surface of the computer processor; and a lid for covering the top opening of the wall assembly in a sealable manner, the lid having a nozzle which sprays coolant that impinges on the exposed cooling surface of the computer processor.

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Номер записи: 56
02-04-2020 дата публикации

Liquid submersion cooled electronic systems and devices

Номер: US20200107470A1
Автор: David Roe, Lyle Rick Tufty, Sean Michael ARCHER, Steve Shafer
Принадлежит: Liquidcool Solutions Inc

Liquid submersion cooling devices and systems are described that use a cooling liquid, for example a dielectric cooling liquid, to submersion cool individual electronic devices or an array of electronic devices. In one embodiment, the electronic device includes a non-pressurized device housing defining an interior space where pressure in the interior space equals or is only slightly different than pressure outside the non-pressurized device housing.

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Номер записи: 57
28-04-2016 дата публикации

SERVER WITH COOLING LINE ASSEMBLY

Номер: US20160120071A1
Автор: Buchanan Robert A., Lindeman Brett A., Shedd Timothy A.
Принадлежит:

A server can include a cooling line assembly to provide fluid cooling of one or more server components. The server can include a chassis, a circuit board positioned within the chassis, and a processor electrically connected to the circuit board. The cooling line assembly can include a heat sink module on a surface to be cooled that is in thermal communication with the processor. The heat sink module can include an inlet port fluidly connected to an inlet chamber, a plurality of orifices fluidly connecting the inlet chamber to an outlet chamber, and an outlet port fluidly connected to the outlet chamber. The orifices can deliver jet streams of coolant into the first outlet chamber and against the surface to be cooled when pressurized coolant is provided to the inlet chamber of the heat sink module. 1. A server with a cooling line assembly , the server comprising:a chassis;a circuit board positioned within the chassis;a first processor electrically connected to the circuit board, the first processor comprising a first substrate and a first integrated heat spreader attached to the first substrate;a first layer of thermal interface material on an outer surface of the first integrated heat spreader; and a first heat sink module sealed against a surface to be cooled of a first thermally conductive base member, the first thermally conductive base member comprising a second side opposite the first surface to be cooled, the second side of the first thermally conductive base member being adjacent to the first layer of thermal interface material on the first integrated heat spreader, the first heat sink module comprising: a first inlet port fluidly connected to a first inlet chamber; a first plurality of orifices fluidly connecting the first inlet chamber to a first outlet chamber; and a first outlet port fluidly connected to the first outlet chamber, the first plurality of orifices configured to deliver a first plurality of jet streams of coolant into the first outlet chamber ...

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Номер записи: 58
26-04-2018 дата публикации

ELECTRONIC DEVICE

Номер: US20180116075A1
Автор: Fukunaga Naomi
Принадлежит: FUJITSU LIMITED

An electronic device inserted into and removed from a slot that has a connection port, the electronic device includes a coupled part coupled to the connection port, and a corrugated metal pipe that has one end coupled to the coupled part and the other end fixed to a body of the electronic device, wherein the pipe has a first straight line part that extends along a direction of the insertion and removal and a second straight line part that extends along a direction orthogonal to a longitudinal direction of the first straight line part. 1. An electronic device inserted into and removed from a slot that has a connection port , the electronic device comprising:a coupled part coupled to the connection port; anda corrugated metal pipe that has one end coupled to the coupled part and the other end fixed to a body of the electronic device,wherein the pipe has a first straight line part that extends along a direction of the insertion and removal and a second straight line part that extends along a direction orthogonal to a longitudinal direction of the first straight line part.2. The electronic device according to claim 1 ,wherein the connection port is a water supply and discharge port of a refrigerant,the coupled part is a coupler header that has a coupler that is able to be coupled to the water supply and discharge port, andthe pipe is a water-cooled pipe that has one end coupled to the coupler header and the other end fixed to a heat generation component of the body.3. The electronic device according to claim 1 ,wherein the connection port is an electric connector,the coupled part is a terminal of a cable that is able to be coupled to the electric connector, andthe pipe is a pipe for cable that has one end coupled to the terminal and the other end fixed to a substrate of the body.4. The electronic device according to claim 1 ,wherein the pipe has an L-shaped part formed by the first straight line part and the second straight line part.5. The electronic device according ...

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Номер записи: 59
05-05-2016 дата публикации

HOT-SWAPPABLE SERVER WITH COOLING LINE ASSEMBLY

Номер: US20160128238A1
Автор: Lindeman Brett A., Meives Mark S., Shedd Timothy A.
Принадлежит:

A hot-swappable server can be adapted to blindly mate to a manifold assembly of a cooling system. The server can include a chassis with a circuit board positioned within the chassis and a first processor electrically connected to the circuit board. The server can include a cooling line assembly with an inlet fitting, an outlet fitting, and a heat sink module fluidly connected between the inlet and outlet fittings. The first heat sink module can be in thermal communication with the first processor. The inlet and outlet fittings can be mounted to the chassis proximate a rear side of the chassis. The inlet and outlet fittings can be blind-mate fittings. Coolant flowing through the cooling line assembly can flow in through the inlet fitting, through the first heat sink module where it absorbs heat from the first processor, and out through the outlet fitting. 1. A hot-swappable server adapted to blindly mate to a manifold assembly of a cooling system , the server comprising:a chassis;a circuit board positioned within the chassis;a first processor electrically connected to the circuit board; and an inlet fitting mounted to the chassis proximate a rear side of the chassis, the inlet fitting being a blind-mate fitting;', 'an outlet fitting mounted to the chassis proximate the rear side of the chassis, the outlet fitting being a blind-mate fitting, a centerline of the outlet fitting being substantially parallel with a centerline of the inlet fitting; and', 'a first heat sink module in thermal communication with the first processor, the first heat sink module comprising an inlet port fluidly connected to the inlet fitting and an outlet port fluidly connected to the outlet fitting, wherein when coolant is provided to the cooling line assembly, the coolant flows in through the inlet fitting, through the first heat sink module where the coolant absorbs heat from the first processor, and out of the cooling line assembly through the outlet fitting., 'a cooling line assembly ...

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Номер записи: 60
04-05-2017 дата публикации

NODE BLIND MATE LIQUID COOLING

Номер: US20170127575A1
Автор: Dean Steven J., Lunsman Harvey, Ramseier Roger, Stacy Russell
Принадлежит:

The present disclosure is directed to a configurable extension space for a computer server or node blade that has the ability to expand data storage or other functionality to a computer system while minimizing any disruption to computers in a data center when the functionality of a computer server or a node blade is extended. Apparatus consistent with the present disclosure may include multiple electronic assemblies where a first assembly resides deep within an enclosure to which an expansion module may be attached in an accessible expansion space. Such apparatus may also include liquid cooling. 1. A system for providing a leak resistant blind mating liquid interconnection , the system comprising:a computer rack; a node blade that includes two or more liquid couplings, wherein:', 'the two or more liquid couplings are compatible with the at least two liquid couplings, and', 'at least two leak resistant connections are formed between the liquid manifold and the node blade when the two or more liquid couplings and the at least two liquid couplings are connected., 'a liquid manifold that includes at least two liquid couplings'}2. The system of claim 1 , further comprising locking clips that automatically lock the node blade into the computer rack when the node blade is installed into the computer rack.3. The system of claim 2 , wherein:the at least two liquid couplings and the two or more liquid couplings are non-locking liquid couplings, andthe locking clips provide a force that holds the at least two liquid couplings and the two or more liquid couplings together when the node blade is locked into the computer rack.4. The system of claim 3 , wherein:the force that holds the at least two liquid couplings and the two or more liquid couplings together is released when the node blade is unlocked from the computer rack, andthe node blade is unlocked from the computer rack by the locking clips.5. The system of claim 1 , wherein a first coupling of the at least two liquid ...

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Номер записи: 61
25-04-2019 дата публикации

Liquid submersion cooled electronic systems

Номер: US20190124790A1
Автор: Rick Tufty, Steve Shafer
Принадлежит: Liquidcool Solutions Inc

An enclosure for an electronic system that is configured to act as a heat exchanger to remove heat from a cooling liquid that is circulated through the electronic system for cooling the electronic components thereof which are submerged in the cooling liquid in direct contact therewith. The enclosure uses an arrangement of a combination of external fins on one or more walls and fluid passages formed in one or more of the walls through which the cooling liquid is circulated for cooling. The fluid passages and the external fins are preferably formed on the same wall. The fins and the fluid passages can be formed on any number of walls of the enclosure.

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Номер записи: 62
10-05-2018 дата публикации

Radiator and server cooling system including the same

Номер: US20180132386A1
Автор: Hung-Ju Chen, Kai-Yang Tung
Принадлежит: Inventec Corp, Inventec Pudong Technology Corp

A radiator includes a first conducting pipe, a second conducting pipe, a plurality of radiating pipes, and a plurality of fins. The second conducting pipe is opposite to the first conducting pipe. The radiating pipes are parallel to each other and are in fluid communication with the first conducting pipe and the second conducting pipe. One of the radiating pipes has a vertical projection on an adjacent one of the radiating pipes. The vertical projection partially overlaps on the adjacent one of the radiating pipes. The fins are connected between adjacent two of the radiating pipes.

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Номер записи: 63
10-05-2018 дата публикации

RACK MOUNT-TYPE INFORMATION PROCESSING APPARATUS AND RACK MOUNT-TYPE INFORMATION PROCESSING SYSTEM

Номер: US20180132387A1
Автор: Aizawa Osamu, Aoki Nobumitsu, HIRAI Keita, KOSUGI NAOFUMI, Nakagawa Koji, SO Tsuyoshi, UZUKA Yoshinori
Принадлежит: FUJITSU LIMITED

A rack mount-type information processing apparatus includes: a plurality of slots, into each of which an electronic device is inserted, a liquid-cooled element provided in a cooling target included in the electronic device, a liquid to cool the cooling target being circulated in the liquid-cooled element; a manifold pipe extending in a direction where the slots are arranged; and a plurality of connection pipes configured to interconnect the liquid-cooled element and the manifold pipe, and coupled in parallel to the manifold pipe at a portion of the manifold pipe which corresponds to at least one slot among the plurality of slots. 1. A rack mount-type information processing apparatus comprising:a plurality of slots, into each of which an electronic device is inserted,a liquid-cooled element provided in a cooling target included in the electronic device, a liquid to cool the cooling target being circulated in the liquid-cooled element;a manifold pipe extending in a direction where the slots are arranged; anda plurality of connection pipes configured to interconnect the liquid-cooled element and the manifold pipe, and coupled in parallel to the manifold pipe at a portion of the manifold pipe which corresponds to at least one slot among the plurality of slots.2. The apparatus according to claim 1 , wherein the liquid-cooled element is connected to a first connection pipe that supplies a coolant to the liquid-cooled element claim 1 , and a second connection pipe that discharges the coolant from the liquid-cooled element claim 1 , among the plurality of connection pipes.3. The apparatus according to claim 1 , wherein the liquid-cooled element are provided as a plurality of liquid-cooled elements in the cooling target claim 1 , andthe plurality of connection pipes are connected to the liquid-cooled elements, respectively.4. The apparatus according to claim 1 , wherein the liquid-cooled element are provided as a plurality of liquid-cooled elements in the cooling target ...

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Номер записи: 64
08-09-2022 дата публикации

SYSTEMS AND METHODS FOR LIQUID-VOLUME MEASUREMENT IN IMMERSION-COOLED DEVICES

Номер: US20220283014A1
Автор: Basden Cory D., Bean, JR. John H.
Принадлежит:

A level sensing module for use with a liquid immersion cooling system having a device chassis housing an electronic device, the level sensing module comprising a fluid level sensor, and a controller coupled to the fluid level sensor and configured to receive a signal from the fluid level sensor indicative of a height of dielectric fluid in the device chassis, receive a signal from a pump controller indicative of a volume of dielectric fluid provided to the device chassis, and generate a map of dielectric fluid volume within the device chassis based on the signal from the fluid level sensor and the signal from the pump controller. 1. A liquid level sensing system for an immersion cooling system having a device chassis , the liquid level sensing system comprising:a fluid pump having at least one volumetric flow rate and configured to provide dielectric fluid to the device chassis;a fluid level sensor configured to sense a height of dielectric fluid in the device chassis; and provide a signal to the fluid pump, the signal instructing the fluid pump to provide dielectric fluid at the at least one volumetric flow rate to the device chassis;', 'receive, at one or more time intervals, one or more height signals indicative of the height of the dielectric fluid in the device chassis from the fluid level sensor; and', 'generate a map of the dielectric fluid in the device chassis based on the one or more time intervals, the one or more height signals, and the volumetric flow rate., 'at least one controller configured to2. The liquid level sensing system of claim 1 , wherein the controller is further configured to use a temperature of the dielectric fluid to determine a mass of the dielectric fluid in the device chassis.3. The liquid level sensing system of further comprising a mounting bracket.4. The liquid level sensing system of claim 3 , wherein the fluid level sensor includes a strain gauge having a mechanical float claim 3 , the strain gauge being coupled to the mounting ...

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Номер записи: 65
18-05-2017 дата публикации

Liquid-cooling heat dissipation server

Номер: US20170142867A1
Автор: SONG Xiaojun, XU Yongtian
Принадлежит:

Provided is a liquid-cooling heat dissipation server, and the server includes a cabinet (), at least one board () that is arranged in the cabinet (), and a liquid separation channel and a liquid collection channel that are arranged at two sides of the cabinet () oppositely, wherein a liquid inlet of each board () is intercommunicated with the liquid separation channel through a first plug-type quick connector () and a liquid outlet of each board () is intercommunicated with the liquid collection channel through a second plug-type quick connector (). 1. A liquid-cooling heat dissipation server , comprising a cabinet , at least one board that is arranged in the cabinet , and a liquid separation channel and a liquid collection channel that are arranged at two sides of the cabinet oppositely , wherein a liquid inlet of each board is intercommunicated with the liquid separation channel through a first plug-type quick connector , a first end of each first plug-type quick connector is intercommunicated and fixed with the liquid separation channel while a second end of each first plug-type quick connector is docked and fixed with the liquid inlet of a corresponding board; anda liquid outlet of each board is intercommunicated with the liquid collection channel through a second plug-type quick connector, a first end of each second plug-type quick connector is intercommunicated and fixed with the liquid collection channel while a second end of each second plug-type quick connector is docked and fixed with the liquid outlet of a corresponding board.2. The liquid-cooling heat dissipation server according to claim 1 , wherein the cabinet comprises a first side plate in which the liquid separation channel is arranged and a second side plate in which the liquid collection channel is arranged that are oppositely arranged.3. The liquid-cooling heat dissipation server according to claim 2 , wherein the first end of each first plug-type quick connector is fixed on an end face of the ...

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Номер записи: 66
08-09-2022 дата публикации

HEAT EXCHANGE ASSEMBLY FOR AN ELECTRICAL DEVICE

Номер: US20220287206A1
Автор: Sharf Alex Michael
Принадлежит:

A heat exchange assembly includes a component heat exchanger that has a component thermal interface configured to thermally interface with an electrical component of an electrical device. The heat exchange assembly includes a device heat exchanger having a separable thermal interface configured to extend to an exterior of a device housing of the electrical device to interface with an external heat exchanger. The device heat exchanger is configured to transfer heat to the external heat exchanger across the separable thermal interface. The heat exchange assembly includes a thermal conduit between the component heat exchanger and the device heat exchanger. 1. A heat exchange assembly comprising:a component heat exchanger having a component thermal interface configured to thermally interface with an electrical component of an electrical device;a device heat exchanger having a separable thermal interface configured to extend to an exterior of a device housing of the electrical device to interface with an external heat exchanger, the device heat exchanger configured to transfer heat to the external heat exchanger across the separable thermal interface, the separable thermal interface being a dry interface with the external heat exchanger; anda thermal conduit between the component heat exchanger and the device heat exchanger.2. The heat exchange assembly of claim 1 , wherein the thermal conduit includes a liquid pipe circulating heat between the component heat exchanger and the device heat exchanger claim 1 , the liquid pipe being spaced apart from the separable thermal interface to form the dry interface between the separable thermal interface and the external heat exchanger.3. The heat exchange assembly of claim 2 , wherein the liquid pipe forms a closed liquid loop through the heat exchange assembly between the component heat exchanger and the device heat exchanger.4. The heat exchange assembly of claim 1 , wherein the component heat exchanger is separate and discrete ...

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Номер записи: 67
09-05-2019 дата публикации

Redundant heat sink module

Номер: US20190141861A1
Автор: Brett A. LINDEMAN, Timothy A. Shedd
Принадлежит: eBullient LLC

A redundant heat sink module can include a first independent coolant pathway and a second independent coolant pathway. The first independent coolant pathway can include a first inlet chamber, a first outlet chamber, and a first plurality of orifices extending from the first inlet chamber to the first outlet chamber and providing a first plurality of impinging jet streams of coolant against a first region of a surface to be cooled when pressurized coolant is provided to the first inlet chamber. The second independent coolant pathway can include a second inlet chamber, a second outlet chamber, and a second plurality of orifices extending from the second inlet chamber to the second outlet chamber and providing a second plurality of impinging jet streams of coolant against a second region of the surface to be cooled when pressurized coolant is provided to the second inlet chamber.

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Номер записи: 68
09-05-2019 дата публикации

LIQUID COOLED RACK INFORMATION HANDLING SYSTEM HAVING STORAGE DRIVE CARRIER FOR LEAK CONTAINMENT AND VIBRATION MITIGATION

Номер: US20190141862A1
Автор: Curlee James Don, HELBERG CHRISTOPHER M., HUANG Chin-An, North Travis C., SHELNUTT AUSTIN MICHAEL
Принадлежит:

A method of assembling a direct-contact, liquid-cooled (DL) Rack Information Handling System (RIHS) includes inserting a leak containment barrier in a node enclosure provisioned with heat-generating functional components. The method also includes attaching a system of conduits supplying cooling liquid through the node enclosure and including a supply conduit extending from a node inlet coupling and a return conduit terminating in a node outlet coupling. A trough of the leak containment barrier underlays a portion of the system of conduits of an LC node and forms a drain path to a drain port of the node enclosure. The method further includes mounting the LC node insertably received in one node-receiving slot having a rear section configured for blind mating of the node inlet and outlet ports to a node-receiving liquid inlet port and a node-receiving liquid outlet port positioned to be inwardly facing to the couplings of the LC node. 1. A method of assembling a direct-contact , liquid-cooled (DL) Rack Information Handling System (RIHS) , the method comprising:inserting a leak containment barrier in a node enclosure;provisioning the node enclosure with heat-generating functional components; andattaching a system of conduits supplying cooling liquid through the node enclosure and including a supply conduit extending from a node inlet coupling and a return conduit terminating in a node outlet coupling, wherein a trough of the leak containment barrier underlays a portion of the system of conduits of an LC node and forms a drain path to a drain port of the node enclosure; andmounting the LC node insertably received in one node-receiving slot of a rack having one or more node-receiving slots, each slot having a front opening for node insertion and a rear section opposed to the front access configured for blind mating of the node inlet and outlet ports to a node-receiving liquid inlet port and a node-receiving liquid outlet port located at the rear section of one node- ...

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Номер записи: 69
21-08-2014 дата публикации

Electronic board provided with a liquid cooling system

Номер: US20140233175A1
Автор: Fabien Demange, Luc Dallaserra, Pascal Guilbault
Принадлежит: Bull SA

An electronic board includes a support on which first electronic components are installed, the first electronic components having a height of less than a first threshold height h 1; a cold plate that extends parallel to the support, the distance between the cold plate and the support being equal to the first threshold height h 1, the cold plate including a base plate in which at least one channel is formed through which a coolant can circulate, the base plate being fixed to a complementary plate closing the channel, the cold plate covers all first electronic components, the first electronic components being connected to the cold plate through deformable pads made of a heat conducting material.

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Номер записи: 70
15-09-2022 дата публикации

Optical liquid coolant leak detector

Номер: US20220291072A1
Автор: Michael Stumpf, Sandor Farkas
Принадлежит: Credit Suisse AG Cayman Islands Branch

An information handling system includes a liquid cooling system and a coolant leak detector. The liquid cooling system circulates chilled coolant liquid to a component of the information handling system. The coolant liquid includes a fluorescent dye that emits light at a particular wavelength when the fluorescent dye is illuminated. The coolant leak detector system includes a light source, and a detector configured to detect light at the first wavelength. When the liquid cooling system develops a leak, the light source illuminates the first fluorescent dye in the leaked coolant liquid, the detector detects the light at the first wavelength, and the coolant leak detector provides an indication that the liquid cooling system has developed a leak in response to detecting the light at the first wavelength.

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Номер записи: 71
16-05-2019 дата публикации

Cooling system for a server

Номер: US20190150322A1
Автор: André Sloth Eriksen
Принадлежит: Asetek AS

Embodiments of the disclosure may include a system for cooling a computer server including a plurality of server modules. The system may include a first cooling system configured to remove heat from the plurality of server modules, the first cooling system including a first plurality of conduits for circulating a first cooling medium through the first cooling system, a second cooling system configured to remove heat from the first cooling system, the second cooling system including a second plurality of conduits for circulating a second cooling medium through the second cooling system, and a manifold configured to couple the first cooling system and the second cooling system, wherein the first plurality of conduits is removably connected to the manifold.

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Номер записи: 72
07-05-2020 дата публикации

Rack information handling system having modular liquid distribution (mld) conduits

Номер: US20200146188A1
Автор: Austin Michael Shelnutt, Christopher M. Helberg, Edmond I. Bailey, James D. Curlee, Steven Embleton, Travis C. North
Принадлежит: Dell Products LP

A liquid cooled information handling system (LC_IHS) incudes a first liquid cooled node coupled to a first chassis. The LC_IHS further includes a supply conduit in fluid communication with the first chassis to cool a first liquid cooled node. The supply conduit includes a plurality of fluid paths configured such that when a first fluid path of the plurality of fluid paths is interrupted, cooling of the first liquid cooled node continues.

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Номер записи: 73
23-05-2019 дата публикации

Composite heat sink structures

Номер: US20190157186A1
Автор: Dustin W. Demetriou, Levi A. Campbell, Michael J. Ellsworth, Jr., Milnes P. DAVID, Robert E. Simons, Roger R. Schmidt
Принадлежит: International Business Machines Corp

Composite heat sink structures and methods of fabrication are provided, with the composite heat sink structures including: a thermally conductive base having a main heat transfer surface to couple to, for instance, at least one electronic component to be cooled; a compressible, continuous sealing member; and a sealing member retainer compressing the compressible, continuous sealing member against the thermally conductive base; and an in situ molded member. The in situ molded member is molded over and affixed to the thermally conductive base, and is molded over and secures in place the sealing member retainer. A coolant-carrying compartment resides between the thermally conductive base and the in situ molded member, and a coolant inlet and outlet are provided in fluid communication with the coolant-carrying compartment to facilitate liquid coolant flow through the compartment.

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Номер записи: 74
08-06-2017 дата публикации

Server rack, server, as well as assembly having a server rack and a server

Номер: US20170164504A1
Автор: Blume Johannes
Принадлежит: FUJITSU LIMITED

A server rack having a width, a height and depth of specified dimensions is provided. The server rack has a front side, a rear side and a reception region in the inside for receiving a plurality of servers. The depth (T) of the server rack is dimensioned such that in addition to the reception region additional regions are provided both toward the front side and the rear side so that cabling of a plurality of servers received in the server rack can be received in the additional regions both on the front side and the rear side. 1. A server rack , having a width , height and depth of specified dimensions , the server rack comprising:a front side, a rear side and a reception region in the inside for receiving a plurality of servers, whereinthe depth of the server rack is dimensioned such that in addition to the reception region, regions are provided both toward the front side and toward the rear side so that cabling of a plurality of servers received in the server rack can be received in the additional regions both on the front side and on the rear side.2. The server rack according to claim 1 , wherein the additional regions each extend over the entire front side or the entire rear side claim 1 , respectively.3. The server rack according to claim 1 , wherein a power supply manifold for connecting a plurality of servers received in the server rack to the power supply is set up in each of the additional regions at the front side and at the rear side.4. The server rack according to claim 1 , wherein a coolant manifold for connecting a plurality of servers received in the server for establishing one or multiple coolant circuits is set up in each of the additional regions at the front side and at the rear side.5. The server rack according to claim 1 , wherein the reception region in the interior of the server rack is accessible both from the front side and from the rear side.6. A server for being received and operated in a server rack claim 1 , comprising a housing with a ...

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Номер записи: 75
22-09-2022 дата публикации

COMPATIBLE CO-DESIGN FOR SERVER AND RACK LIQUID INTERFACE

Номер: US20220304191A1
Автор: Gao Tianyi
Принадлежит:

Disclosed are designs to facilitate blind-mating of fluid connectors on servers and on racks that house the servers. The design includes two plates. A first plate has a connector channel to guide the connectors of the server through the first plate and spring structures to apply a force to push the connectors of the server toward the center of the connector channel. A second plate has positioning holes around its perimeter for mounting the connectors of the server using the force of the spring structures. The first plate is rotatable around a rotation axis to align the connectors of the server with the connectors of the rack. The second plate may have an elastic layer that is compressed to change a width of the second plate by inserting the second plate to the rack to automatically align the connectors of the server and of the rack in the horizontal direction. 1. An apparatus of a server , comprising: a connector channel configured to guide two fluid connectors through the first component at two opposite positions along the connector channel; and', 'a pair of springing structures each situated at one of two opposite ends of the connector channel, the pair of springing structures being configured to apply an inward force on the two fluid connectors toward each other; and, 'a first component includinga second component having a plurality of positioning holes located around a perimeter of the second component,the first component being rotatable around a rotation axis with respect to the second component, when the first component and the second component are assembled to allow the two fluid connector to be mounted into two of the positioning holes on opposite edges of the second component by the inward force applied by the pair of springing structures.2. The apparatus of claim 1 , wherein the first component is rotatable around the rotation axis to change a relative distance between the two fluid connectors in a horizontal direction and a vertical direction.3. The ...

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Номер записи: 76
22-09-2022 дата публикации

Cooling system providing cooling to an infrastructure having a plurality of heat-generating units

Номер: US20220304194A1
Автор: Ali CHEHADE, Hadrien Bauduin
Принадлежит: OVH SAS

A system provides cooling to an infrastructure having heat-generating units. Internal cooling units are thermally connected to the heat-generating units. An external cooling unit dissipates thermal energy of a heat-transfer fluid circulating in the internal cooling units. A cooling circuit connects the internal and external cooling units. A pump maintains a flow of the heat-transfer fluid for transferring thermal energy from the heat generating units to the external cooling unit. A reservoir thermally connected to the cooling circuit contains a phase change material (PCM) changing between solid and liquid states according to a temperature of the heat-transfer fluid. Thermal energy is transferred between the cooling circuit and the PCM depending on whether a temperature of the heat-transfer fluid is above or below a phase-change temperature value of the PCM. A supplemental cooling device thermally connected to the reservoir dissipates heat from the reservoir to the atmosphere.

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Номер записи: 77
18-06-2015 дата публикации

LIQUID-COOLING APPARATUS WITH INTEGRATED COOLANT FILTER

Номер: US20150173251A1
Автор: CAMPBELL Levi A., CHU Richard C., DAVID Milnes P., ELLSWORTH, IYENGAR Madhusudan K., JR. Michael J., SCHMIDT Roger R., SIMONS Robert E.
Принадлежит: INTERNATIONAL BUSINESS MACHINES CORPORATION

Cooling apparatuses, cooled electronic modules, and methods of fabrication are provided which facilitate heat transfer from an electronic component(s). The cooling apparatus includes a liquid-cooled heat sink with a thermally conductive structure having a coolant-carrying compartment including a region of reduced cross-sectional coolant flow area. The heat sink includes a coolant inlet and outlet in fluid communication with the compartment, and the region of reduced cross-sectional coolant flow area provides an increased effective heat transfer coefficient between a main heat transfer surface of the conductive structure and the coolant. The cooling apparatus further includes a coolant loop coupled to the coolant inlet and outlet to facilitate flow of coolant through the coolant-carrying compartment, and a coolant filter positioned to filter contaminants from the coolant passing through the heat sink. The coolant filter has a larger cross-sectional coolant flow area than the region of reduced cross-sectional coolant flow area. 1. A cooling apparatus comprising: a thermally conductive structure with a coolant-carrying compartment comprising, at least in part, a region of reduced cross-sectional coolant flow area through which coolant flows;', 'a coolant inlet and a coolant outlet associated with the thermally conductive structure and in fluid communication with the coolant-carrying compartment of the thermally conductive structure to facilitate coolant flow therethrough;', 'wherein the region of reduced cross-sectional coolant flow area of the coolant-carrying compartment provides an increased effective heat transfer coefficient between a main heat transfer surface of the thermally conductive structure and the coolant within the coolant-carrying compartment;, 'a liquid-cooled heat sink configured to cool at least one electronic component, the liquid-cooled heat sink comprisinga coolant loop coupled to the coolant inlet and the coolant outlet of the liquid-cooled heat ...

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Номер записи: 78
24-06-2021 дата публикации

FLUID COOLING SYSTEM FOR AN ENCLOSED ELECTRONIC PACKAGE

Номер: US20210195804A1
Автор: Gao Tianyi
Принадлежит:

A fluid cooling system for an electronics package having a chassis is disclosed. The system includes an electronics package housed within a chassis, one or more mounting structures attached to the chassis, and a fluid cooling module interfaced with one or more electronics of the electronics package, the fluid cooling module housed within the chassis and mounted to the one or more mounting structures, where circulation of a fluid of the fluid cooling module cools the one or more electronics. A chassis fluid distribution manifold is used to connect with the chassis fluid inlet and outlet and to distribute fluid within the chassis. 1. A fluid cooling system , comprising:an electronics package mounted on a motherboard housed within a chassis;a first mounting structure attached to a first side panel of the chassis, including a first vertical mounting slot;a second mounting structure attached to a second side panel of the chassis, including a second vertical mounting slot; anda fluid cooling module across on top of the electronics package, wherein the fluid cooling module is mounted on the first and second mounting structures by inserted a first end and a second end of the fluid cooling module into the first and second vertical mounting slots,wherein the fluid cooling module is to provide fluid cooling to a cold plate attached to a top surface of the electronics package.2. The system of claim 1 , wherein the chassis forms a fully enclosed environment for the electronics package such that no external air is exchanged with air internal to the enclosed environment.3. The system of claim 1 , wherein the fluid cooling module includes:a mounting rail attached to a mounting frame, the mounting frame attached to the first and second mounting structures of the chassis;a fluid loop formed on the mounting rail; andone or more cooling devices coupled to the fluid loop, wherein the one or more cooling devices are secured to the electronics of the electronics package through the ...

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Номер записи: 79
30-05-2019 дата публикации

Liquid cooled chassis

Номер: US20190166724A1
Автор: David L. Moss, William K. Coxe
Принадлежит: Dell Products LP

An information handling system (IHS) includes a node enclosure containing one or more heat-generating functional components. A cold plate is attached to an inner surface of the node enclosure. The cold plate presents a conduction surface to a selected at least one of the one or more heat-generating functional components. A spring is positioned between the inner surface of the node enclosure and the cold plate. The spring positions the conduction surface into conductive proximity with the selected at least one of the one or more heat-generating functional components.

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Номер записи: 80
23-06-2016 дата публикации

LEAK DETECTION IN LIQUID COOLED COMPUTING SYSTEMS

Номер: US20160178475A1
Автор: Krishnan Shankar, Rider Scott M., Smoak Wilson E.
Принадлежит:

The present disclosure describes embodiments of a computing system having a circuit for detecting a leak of a liquid in the cooling system and associated techniques and configurations. In some embodiments, the computing system includes a server board having a cooling system, and the circuit, wherein the circuit includes a first conducting element disposed on a substrate and coupled to a first voltage and a second conducting element disposed on the substrate and coupled to a second voltage. The first and second conducting elements are proximately disposed near each other, and the proximate positions are selected such that voltage across the conducting elements changes when a liquid is in simultaneous contact with the two conducting elements. In some embodiments, a detection circuit is coupled to the two electrodes to detect when the liquid is in simultaneous contact with the two conducting elements. Other embodiments may be disclosed and/or claimed. 1. A rack system for computing , comprising: a first conducting element disposed on a substrate that is coupled to a first voltage; and', 'a second conducting element disposed on the substrate and coupled to a second voltage,', 'wherein the first and second conducting elements are proximately disposed near each other, and the proximate positions are selected such that voltage across the conducting elements changes when a liquid is in simultaneous contact with the two conducting elements., 'a plurality of server boards, wherein at least one of the server boards has a cooling system and a circuit for detecting a leak of a liquid in a cooling system, the circuit comprising2. The rack system of claim 1 , wherein the liquid is a conductive liquid claim 1 , the two conducting elements are interdigitated electrodes claim 1 , a resistor is coupled between the first conducting element and the first voltage claim 1 , and the voltage across the conducting elements moves toward zero when a liquid is in simultaneous contact with the ...

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Номер записи: 81
21-05-2020 дата публикации

LIQUID COOLING DISTRIBUTION IN A MODULAR ELECTRONIC SYSTEM

Номер: US20200163251A1
Автор: Chopra Rakesh, Dogruoz M. Baris, Goergen Joel Richard, Lam Mandy Hin
Принадлежит: CISCO TECHNOLOGY, INC.

In one embodiment, a network communications device includes a chassis, a plurality of modules removably inserted into a plurality of slots in the chassis, at least a portion of the modules each comprising a connector for receiving coolant for cooling components on the module, a controller for controlling coolant distribution to the modules, and a leak detection system for identifying a leak of the coolant and transmitting an indication of the leak to the controller. 1. An apparatus comprising:a chassis comprising a plurality of slots for receiving a plurality of modules, a first group of the modules received in a first orientation and a second group of the modules received in a second orientation orthogonal to said first orientation; anda coolant distribution module inserted into one of said plurality of slots in said first orientation for distributing coolant to at least one of the modules in said second group of the modules, the coolant distribution module comprising a first connector for receiving the coolant and a second connector for mating with the module receiving the coolant.2. The apparatus of further comprising a leak detection system for indicating a leak of the coolant.3. The apparatus of wherein the leak detection system comprises a pressure sensor for detecting a change in pressure in a coolant loop.4. The apparatus of wherein the leak detection system comprises a velocity sensor for detecting a change in speed of the coolant in a coolant loop.5. The apparatus of wherein the leak detection system comprises a camera for use in identifying the leak.6. The apparatus of wherein the leak detection system comprises a tray for collecting the coolant from the leak claim 2 , the tray comprising a material configured to change color upon contact with the coolant.7. The apparatus of wherein the leak detection system comprises a weight sensor for use in identifying collection of leaked coolant.8. The apparatus of further comprising a controller for receiving an ...

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Номер записи: 82
01-07-2021 дата публикации

COMPOSITE LIQUID COOLING DEVICE

Номер: US20210204450A1
Автор: Gao Tianyi
Принадлежит:

In one embodiment, an electronic cooling device includes an inlet port to receive cooling liquid from an external cooling liquid source. The cooling device further includes a base cooling unit having a first liquid distribution channel therein. The base cooling unit includes a cooling plate that forms a lower surface to be positioned on a top surface of one or more electronic devices to extract heat from the devices through the cooling plate using at least a portion of the cooling liquid from the external cooling liquid source. The cooling device further includes an upper cooling unit having a second liquid distribution channel to extract heat from air contacting the upper cooling unit using at least a portion of the cooling liquid received from the external cooling liquid source. The cooling device further includes an outlet port to return the cooling liquid to the external cooling liquid source. Internal fluid channel structural design can be used and customized for different applications and use cases. 1. An electronics cooling device , comprising:an inlet port to receive a cooling liquid from an external cooling liquid source;a base cooling unit, comprising a cooling plate forming a lower surface to be positioned on a top surface of an electronic device, the base cooling unit having a first liquid distribution channel embedded therein to extract heat from the electronic device through the cooling plate using at least a portion of the cooling liquid received from the external cooling liquid source;an upper cooling unit coupled to the base cooling unit having a second liquid distribution channel to extract heat from air contacting the upper cooling unit using at least a portion of the cooling liquid received from the external cooling liquid source;an outlet port to return the cooling liquid from the base cooling unit and the upper cooling unit to the external cooling liquid source; anda fan for moving the air flow through the upper cooling unit.2. The electronics ...

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Номер записи: 83
22-06-2017 дата публикации

Liquid cooled rack information handling system having storage drive carrier for leak containment and vibration mitigation

Номер: US20170181321A1
Автор: Austin Michael Shelnutt, Chin-An Huang, Christopher M. Helberg, James Don Curlee, Travis C. North
Принадлежит: Dell Products LP

A direct-contact liquid-cooled (DL) Rack Information Handling System (RIHS) includes liquid cooled (LC) nodes having a chassis received in a respective chassis-receiving bay of the rack and containing heat-generating functional components. The LC node configured with a system of conduits to receive direct contact of cooling liquid to regulate the ambient temperature of the node and provide cooling to the functional components inside the node by removing heat generated by the heat-generating functional components. The chassis has a leak containment barrier configured with a trough that underlays a portion of the system of conduits of the LC node and that forms a drain path to a drain port of the chassis. In one or more embodiments, the storage drive carrier has vibration absorbing material that mitigates vibrations of a storage drive placed in the storage drive carrier.

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Номер записи: 84
22-06-2017 дата публикации

RACK INFORMATION HANDLING SYSTEM HAVING MODULAR LIQUID DISTRIBUTION (MLD) CONDUITS

Номер: US20170181323A1
Автор: Bailey Edmond I., CURLEE JAMES D., Embleton Steven, HELBERG CHRISTOPHER M., North Travis C., SHELNUTT AUSTIN MICHAEL
Принадлежит: Dell Products, L.P.

A direct-interface liquid-cooled (DL) Rack Information Handling System (RIHS) includes liquid cooled (LC) nodes each comprising a chassis received in a respective chassis-receiving bay of a rack and containing heat-generating functional components. Each LC node is configured with a system of conduits to receive direct injection of cooling liquid to regulate the ambient temperature of the node and provide cooling to the functional components inside the node by removing heat generated by the heat-generating functional components. A cooling subsystem has a liquid rail formed by more than one node-to-node, Modular Liquid Distribution (MLD) conduits, each including first and second terminal connections attached on opposite ends of a central conduit that can be rack-unit dimensioned. The MLD conduits seal to and enable fluid transfer between a port of a selected LC node and a port of an adjacent LC node. 1. A Rack Information Handling System (RIHS) comprising:a rack having chassis-receiving bays;more than one liquid cooled (LC) node each comprising a chassis received in a respective chassis-receiving bay of the rack and containing heat-generating functional components, each LC node configured with a system of conduits to receive direct injection of cooling liquid to regulate the ambient temperature of the node and provide cooling to the functional components inside the node by removing heat generated by the heat-generating functional components; anda cooling subsystem having a liquid rail formed by more than one node-to-node, Modular Liquid Distribution (MLD) conduit between LC nodes provisioned in the rack and comprising first and second terminal fluid connections attached on opposite ends of a central conduit to seal to and enable fluid transfer between a port of a selected LC node and a port of another adjacent node.2. The RIHS of claim 1 , wherein the MLD conduits are provided in rack-unit dimensions to selectively support LC nodes of selected rack-unit vertical ...

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Номер записи: 85
05-07-2018 дата публикации

HEAT-DISSIPATING SYSTEM AND METHOD OF WHOLE CABINET SERVER SYSTEM

Номер: US20180192552A1
Автор: Chen Guofeng, TAN Xianguang, ZHANG Jiajun
Принадлежит: BEIJING BAIDU NETCOM SCIENCE AND TECHNOLOGY CO., LTD.

The present disclosure provides a heat-dissipating system and method of a whole cabinet server system. The system comprises: a whole cabinet server system, a water-cooling plate, a water-cooling coil pipe and a fan; the water-cooling plate is disposed on each designated heat-generating element in each server of the whole cabinet server system; the water-cooling plate is configured to use low-temperature water therein to take away heat generated by the designated heat-generating element; the fan is configured to produce low-temperature air stream which flows through the whole cabinet server system and the water-cooling coil pipe in turn; the water-cooling coil pipe is configured to cool air stream that have absorbed the heat of the whole cabinet server system as low-temperature air stream. The solutions of the present disclosure can be applied to improve the heat-dissipating efficiency and reduce the costs of implementation. 1. A heat-dissipating system of a whole cabinet server system , wherein the system comprises:a whole cabinet server system, a water-cooling plate, a water-cooling coil pipe and a fan;the water-cooling plate is disposed on a designated heat-generating element in each server of the whole cabinet server system;the water-cooling plate is configured to use low-temperature water therein to take away heat generated by the designated heat-generating element;the fan is configured to produce low-temperature air stream which flows through the whole cabinet server system and the water-cooling coil pipe in turn;the water-cooling coil pipe is configured to cool air stream that have absorbed the heat of the whole cabinet server system as low-temperature air stream.2. The heat-dissipating system according to claim 1 , whereinthe designated heat-generating element comprises a Central Processing Unit CPU and Graphics Processing Unit GPU;the low-temperature water comprises cooling water and chilled water.3. The heat-dissipating system according to claim 1 , ...

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Номер записи: 86
23-07-2015 дата публикации

METHOD AND APPARATUS FOR CHIP COOLING

Номер: US20150208555A1
Автор: Flotta Matteo, Martin Yves C., Romankiw Lubomyr T., van Kessel Theodore G.
Принадлежит:

In one embodiment, the invention is a method and apparatus for chip cooling. One embodiment of an apparatus for cooling a heat-generating device includes an inlet for receiving a fluid, a manifold comprising a plurality of apertures formed therein for decreasing the pressure of the fluid from a first pressure by adiabatic expansion for impinging the fluid on the heat-generating device once the pressure of the fluid is decreased from the first pressure. 1. An apparatus for cooling a heat generating device , the apparatus comprising:a liquid coolant;an inlet for receiving the liquid coolant;a manifold coupled to the inlet, the manifold having a plurality of apertures formed therein for impinging the liquid coolant on the heat-generating device;an outlet coupled to the manifold for removing a flow of the liquid coolant from the heat-generating device, wherein the outlet is directed towards at least one additional heat generating device; anda duct enclosing the liquid coolant, the inlet, the manifold, and the outlet, wherein the duct includes an opening that introduces a flow of air into the liquid coolant as the liquid coolant exits from the outlet, wherein the flow of air is unforced and originates from an environment that is external to the apparatus.2. The apparatus of claim 1 , wherein the manifold further comprises a plurality of grooves forming a corresponding plurality of channels between facing surfaces of the manifold and the heat generating device.3. The apparatus of claim 2 , wherein the plurality of channels is arranged to duct the liquid coolant to a periphery of the heat generating device.4. The apparatus of claim 1 , further comprising:a valve adapted for coupling to a supply of the liquid coolant and for controlling a provision of the liquid coolant from the supply to the manifold; anda voltage sensor for monitoring a temperature of the heat generating device, the voltage sensor being configured to control the valve such that an amount of the liquid ...

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Номер записи: 87
14-07-2016 дата публикации

Heat exchanger, cooling unit, and electronic device

Номер: US20160205809A1
Автор: Jie Wei, Masumi Suzuki, Michimasa Aoki
Принадлежит: Fujitsu Ltd

A heat exchanger includes: a plurality of first heat radiation members, each of the plurality of first heat radiation members including a first refrigerant flow path through which a refrigerant flows; a plurality of second heat radiation members, each of the plurality of second heat radiation members including a second refrigerant flow path through which the refrigerant flows; and a fin attached between the plurality of second heat radiation members, wherein an interval between the plurality of first heat radiation members is smaller than an interval between the plurality of second heat radiation members.

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Номер записи: 88
18-06-2020 дата публикации

Liquid transfer module and liquid cooling system thereof

Номер: US20200196483A1
Автор: Wen-Ji Lan
Принадлежит: Asia Vital Components Co Ltd

A liquid transfer module is applied to a liquid cooling system. The liquid transfer module includes a first flow guide body and a second flow guide body removably connected with a liquid reservoir tank and a pump unit. The first and second flow guide bodies are formed with multiple internal flow passages. Some of the flow passages communicate with each other via a check valve and some other flow passages communicate with each other via an opening. The liquid transfer module serves to transfer and guide a working liquid to flow through the liquid reservoir tank and the pump unit.

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Номер записи: 89
18-06-2020 дата публикации

HEAT DISSIPATION APPARATUS AND SERVER USING THE SAME

Номер: US20200196489A1
Автор: Chang Chih-Hung, Chang Li-Wen, CHANG YAO-TING, FU YEN-CHUN, MAO Tze-Chern, WEI CHAO-KE
Принадлежит:

A heat dissipation apparatus for a plurality of heat-generating electrical devices in a server dissipates heat of the heat-generating electrical devices by using heat-absorbing liquid. The apparatus includes a container, an inlet pipe, and an outlet pipe. The container contains a non-conductive coolant liquid and the plurality of heat-generating electrical devices are entirely submerged in the coolant liquid. 13-. (canceled)4. A server , comprising:a plurality of heat-generating electrical devices; and a container containing coolant liquid and the plurality of heat-generating electrical devices, wherein the plurality of heat-generating electrical devices is submerged by the coolant liquid;', 'an inlet pipe connecting to the container, wherein the coolant liquid enters the container through the inlet pipe; and', 'an outlet pipe connecting to the container, wherein the coolant liquid flows out from the container through the outlet pipe;, 'a heat dissipation apparatus comprisingwherein the heat-generating electrical device comprises a housing, a surface of the housing defines a plurality of meshes, the plurality of the meshes increases the contact area between the coolant liquid and the housing of the heat-generating electrical device;wherein the server comprises a motherboard, and the motherboard is installed inside of the container and submerged by the coolant liquid; and wherein the motherboard comprises a plurality of slots, and each heat-generating electrical device is correspondingly matched with each slot of the motherboard; wherein the heat-generating electrical device further comprises a printed circuit board (PCB), and the printed circuit board is fixedly connected to the inside of the housing;wherein the heat-generating electrical device comprises a plurality of gold fingers, and the heat-generating electrical device is inserted into the slot of the motherboard through the plurality of gold fingers; wherein the heat-generating electrical device comprises a ...

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Номер записи: 90
26-07-2018 дата публикации

PROVISIONING COOLING ELEMENTS FOR CHILLERLESS DATA CENTERS

Номер: US20180213685A1
Автор: CHAINER Timothy J., PARIDA Pritish R.
Принадлежит:

Systems and methods for cooling include one or more computing structures, a heat rejection system configured to cool coolant, and one or more heat exchangers configured to selectively transfer heat from coolant in the intra-structure cooling system to coolant in the heat rejection system. Each computing structure includes one or more cooled servers and an intra-structure cooling system configured to selectively provide coolant to the one or more cooled servers. A controller is configured to adjust cooling of the coolant in accordance with ambient temperature information, to decrease cooling of the coolant if the coolant temperature falls below a first coolant threshold temperature by disengaging one or more heat exchangers, and to turn on additional servers if the coolant temperature is below the first cool and threshold and all heat exchangers have been disengaged. 1. A system for cooling , comprising: one or more cooled servers; and', 'an intra-structure cooling system configured to selectively provide coolant to the one or more cooled servers;, 'one or more computing structures, each structure comprisingone or more heat rejection units configured to cool coolant;one or more heat exchangers configured to selectively transfer heat from the coolant in the intra-structure cooling system to coolant in the heat rejection system; anda controller configured to adjust cooling of the coolant in accordance with ambient temperature information, to decrease cooling of the coolant if the coolant temperature falls below a first coolant threshold temperature by disengaging one or more heat exchangers, and to turn on additional servers if the coolant temperature is below the first cool and threshold and all heat exchangers have been disengaged.2. The system of claim 1 , wherein the controller is further configured to engage and disengage valves in the intra-structure cooling system and the liquid-to-liquid heat exchangers according to cooling needs.3. The system of claim 2 , ...

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Номер записи: 91
16-10-2014 дата публикации

Separable and integrated heat sinks facilitating cooling multi-compnent electronic assembly

Номер: US20140307389A1
Автор: Amilcar R. Arvelo, Eric J. McKeever, Levi A. Campbell, Michael J. Ellsworth, Jr.
Принадлежит: International Business Machines Corp

Cooling apparatuses and methods of fabrication thereof are provided which facilitate cooling a multi-component assembly, such as a hub module assembly. The cooling apparatus includes a first liquid-cooled heat sink configured to facilitate removal of heat generated by one or more first electronic components of the multi-component assembly, and a second liquid-cooled heat sink configured to facilitate removal of heat generated by one or more second electronic components of the multi-component assembly. The first liquid-cooled heat sink is separably coupled to the multi-component assembly, and the second liquid-cooled heat sink is fixedly secured to the multi-component assembly. Fluid couplers fluidically couple the first and second liquid-cooled heat sinks to facilitate liquid coolant flow through the fixedly-secured, second liquid-cooled heat sink from the separably-coupled, first liquid-cooled heat sink.

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Номер записи: 92
11-07-2019 дата публикации

WATER-COOLING RADIATOR STRUCTURE

Номер: US20190215987A1
Автор: Lan Wen-Ji
Принадлежит:

A water-cooling radiator structure includes a water-cooling radiator unit, which includes a water-receiving plate internally defining a water chamber for a working fluid to flow therethrough. The water-receiving plate has an upper surface and a lower surface, from where heat carried by the working fluid flowing through the water chamber is dissipated into ambient air. 1. A water-cooling radiator structure , comprising:a water-cooling radiator unit including a water-receiving plate internally defining a water chamber for a working fluid to flow therethrough; and the water-receiving plate having an upper surface and a lower surface, from where heat carried by the working fluid flowing through the water chamber is dissipated into ambient air.2. The water-cooling radiator structure as claimed in claim 1 , wherein the water chamber is selected from the group consisting of a hollow water chamber and a water chamber internally provided with a flow passage claim 1 , and is communicable with a water inlet and a water outlet of the water-receiving plate; and the water inlet and the water outlet being fluid-communicable with a water block unit externally connected thereto.3. The water-cooling radiator structure as claimed in claim 2 , wherein the water chamber is internally provided with a pump for driving the working fluid to flow through the water chamber.4. The water-cooling radiator structure as claimed in claim 1 , wherein the upper surface of the water-receiving plate has a first radiating fin assembly connected thereto.5. The water-cooling radiator structure as claimed in claim 4 , wherein the water-receiving plate is formed of a top plate member and a bottom plate member; an outer side of the top plate member forming the upper surface of the water-receiving plate claim 4 , and an outer side of the bottom plate member forming the lower surface of the water-receiving plate.6. The water-cooling radiator structure as claimed in claim 4 , wherein the lower surface of the ...

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Номер записи: 93
02-07-2020 дата публикации

FLEXIBLE COLD PLATE WITH FLUID DISTRIBUTION MECHANISM

Номер: US20200214172A1
Автор: Chen Chao-Jung, CHEN CHING-YU, HUANG Yu-Nien, LEE Kuo-Wei
Принадлежит:

A cold plate base is provided. The cold plate includes a fluid intake region located at a distal end of the cold plate, and a fluid outtake region located at a proximal end of the cold plate that is opposite the distal end. The cold plate also includes a fin region positioned between the fluid intake region and the fluid outtake region. The fin region extends from a base surface of the cold plate base. The cold plate also includes a plurality of protrusions at the fluid intake region. Each of the plurality of protrusions radiates from the fluid intake region to create flow paths across the fin region. 1. A cold plate base comprising:a fluid intake region located at a distal end of the cold plate, and a fluid outtake region located at a proximal end of the cold plate that is opposite the distal end;a fin region positioned between the fluid intake region and the fluid outtake region, wherein the fin region extends from a base surface of the cold plate base;a plurality of protrusions at the fluid intake region, wherein each of the plurality of protrusions radiates from the fluid intake region to create flow paths across the fin region.2. The cold plate base of claim 1 ,wherein the plurality of protrusions has a central axis, and each of the plurality of protrusions is symmetrical about the central axis.3. The cold plate base of claim 2 , wherein the fin region comprises a plurality of wall regions claim 2 , each wall region separated by a fin region gap.4. The cold plate of claim 3 , wherein the flow paths are evenly spaced about the plurality of wall regions.5. The cold plate base of claim 1 , wherein the base surface of the cold plate base beneath the fin region has a thickness of up to 2 millimeters.6. The cold plate base of claim 1 , wherein the base surface of the cold plate base beneath the fin region comprises a conductive flexible material.7. A cooling apparatus comprising:a radiator; and a fluid intake region located at a distal end of the cold plate, and a ...

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Номер записи: 94
09-08-2018 дата публикации

WATER COOLING SYSTEM OF SINGLE BOARD MODULE LEVEL

Номер: US20180228058A1
Автор: JIANG Wenbing, Li Jianfeng
Принадлежит:

A water cooling system of single board module level comprises: a device subrack (), provided with a backplate (); multiple single board modules (), located on one side of the backplate (); multiple single board water-cooling modules (), mounted on the corresponding board modules () and having liquid for cooling a heating element of the single board modules (); multiple sealing plug-connection units () mounted on the backplate () and connected to the single board water-cooling modules (); and multiple water pump modules () connected to the multiple single board water-cooling modules () by means of the multiple sealing plug-connection units (), wherein the water pump modules () are located on the other side of the backplate (). The water cooling system of single board module level has a simple structure, saves space, and has a high device maintenance efficiency. 1. A water cooling system of single board module level , comprising:a device subrack having a backplate;a plurality of single board modules located on one side of the backplate;a single board water cooling module installed on each of the single board modules, each single board water cooling module having liquid that cools a heating element of the single board module;a plurality pairs of sealing plug-connection units installed on the backplate, each pair of sealing plug-connection units being connected with the single board water cooling module on a corresponding single board module;a plurality of water pump modules located on the other side of the backplate, one each of the water pump modules being connected with a corresponding single board water cooling module via a corresponding pair of sealing plug-connection units,wherein each sealing plug-connection unit in each pair of sealing plug-connection units comprises two parts which are plug-connected, wherein a first part of the two parts is installed on a corresponding single board module and is connected with the single board water cooling module on the ...

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Номер записи: 95
09-08-2018 дата публикации

ELECTRONIC APPARATUS AND COOLING CONTROL APPARATUS AND COOLING CONTROL METHOD FOR THE SAME

Номер: US20180228059A1
Автор: Matsuo Akira, SUZUKI Hitoshi
Принадлежит: FUJITSU LIMITED

A cooling control apparatus for an electronic apparatus in which a plurality of electronic units to be cooled are housed, the cooling control apparatus includes a pump controller that controls a pump based on a detection value of a parameter indicating a flow rate of liquid refrigerant in one passage, among a plurality of passages, in a state in which the refrigerant for cooling the plurality of electronic units are discharged from the pump and is supplied to the plurality of passages via a supply manifold. 1. A cooling control apparatus for an electronic apparatus in which a plurality of electronic units to be cooled are housed , the cooling control apparatus comprising:a pump controller that controls a pump based on a detection value of a parameter indicating a flow rate of liquid refrigerant in one passage, among a plurality of passages, in a state in which the refrigerant for cooling the plurality of electronic units are discharged from the pump and is supplied to the plurality of passages via a supply manifold.2. The cooling control apparatus according to claim 1 ,wherein the pump controller controls the pump so that the flow rate of the refrigerant in the one passage is equal to a predetermined flow rate.3. The cooling control apparatus according to claim 2 ,wherein the plurality of passages are formed so that the flow rate of the refrigerant in the one passage and the flow rate of the refrigerant in a passage other than the one passage have a predetermined ratio, andwherein the predetermined ratio correlates with relationship in power consumption between the plurality of electronic units.4. The cooling control apparatus according to claim 3 ,wherein at least part of the plurality of passages includes a flow rate regulating valve, the cooling control apparatus further comprising:a valve controller that controls the flow rate regulating valve to vary the predetermined ratio.5. The cooling control apparatus according to claim 1 ,wherein the pump controller ...

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Номер записи: 96
18-07-2019 дата публикации

COOLANT REPLENISHMENT DEVICE, COOLING CIRCULATION SYSTEM, AND ELECTRONIC DEVICE

Номер: US20190223322A1
Автор: CHOU Chih-Sheng, WU Jen-Hao
Принадлежит: WISTRON CORP.

The disclosure is related to a coolant replenishment device, a cooling circulation system and an electronic device. The electronic device includes a heat source, a circulation pipe, a pump, a heat exchanger and a coolant replenishment device. The circulation pipe has a circulation channel configured to accommodate a first coolant. The pump is disposed on the circulation pipe. The heat exchanger disposed on the circulation pipe. The coolant replenishment device includes a liquid storage tank, a push plate and a driving member. The liquid storage tank has an accommodating space configured to accommodate a second coolant. The push plate is movable toward or away from the liquid outlet. The driving member is disposed in the liquid storage tank and constantly apply a force on the push plate to push the second coolant from the accommodating place into the circulation channel through the liquid outlet. 1. A coolant replenishment device , comprising:a liquid storage tank having an accommodating space and a liquid outlet, the liquid outlet connected to the accommodating space, and the accommodating space configured to accommodating a coolant for replenishment;a push plate movably located in the accommodating space and movable in a direction toward or away from the liquid outlet; anda driving member disposed in the liquid storage tank and constantly applying a force on the push plate in the direction toward the liquid outlet so as to force the push plate to move toward the liquid outlet to push the coolant out of the accommodating space.2. The coolant replenishment device according to the claim 1 , further comprising a valve which is pivotably located in the accommodating space and has a closed position and an opened position claim 1 , wherein when the valve is in the closed position claim 1 , the valve closes the liquid outlet claim 1 , and when the valve is in the opened position claim 1 , the valve opens the liquid outlet.3. The coolant replenishment device according to ...

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Номер записи: 97
25-07-2019 дата публикации

LIQUID COOLANT SUPPLY

Номер: US20190227606A1
Автор: Anthony Sarah, Bash Cullen E., Cader Tahir, Escobar-Vargas Sergio, Franz John, Kumari Niru, Tavallaei Siamak
Принадлежит:

Apparatuses associated with liquid coolant supply are disclosed. One example apparatus is a computing cartridge which includes a first electronic device and a liquid-cooled cold plate. The computing cartridge also includes a first thermal couple between the first electronic device and the cold plate. The computing cartridge also includes an inlet fluid connector. The inlet fluid connector may supply a liquid coolant to the cold plate. The computing cartridge also includes an outlet fluid connector. The outlet fluid connector may facilitate return of the coolant from the cold plate. 115.-. (canceled)16. A computing system comprising: a plurality of slots, each to receive a cartridge and including hot-plug fluid connectors that are to blind mate with corresponding hot-plug fluid connectors of the cartridge and thereby enable liquid coolant to flow through the cartridge;', 'a movable mounting to connect the chassis to a rack and allow the chassis to move between a retracted position and an extended position to enable access to the plurality of slots; and', 'an extendable liquid supply line that supplies the liquid coolant from a source to the hot-plug fluid connectors of the plurality of slots and is configured to extend and retract as the chassis moves between the extended and retracted positions., 'a chassis comprising17. The computing system of claim 16 , wherein each of the plurality of slots is arranged to receive a top-loading cartridge.18. The computing system of claim 17 , wherein the top-loading is a direction of the chassis opposite of a backplane of the chassis.19. The computing system of claim 16 , wherein the hot-plug fluid connectors of each of the plurality of slots includes a supply fluid connector to supply liquid coolant to an inlet connector of the cartridge.20. The computing system of claim 16 , wherein the hot-plug fluid connectors of each of the plurality of slots includes return fluid connector to receive liquid coolant from an outlet connector ...

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Номер записи: 98
01-08-2019 дата публикации

Pre-treating polymer tubing or hose with a hydrophobic coating to reduce depletion of corrosion inhibitor

Номер: US20190232335A1
Автор: Daniel J. Buvid, Eric J. Campbell, Joseph Kuczynski, Tyler Jandt
Принадлежит: International Business Machines Corp

An inside surface of a hose for use with liquid-cooled cooling plate assemblies and other applications that contain copper (Cu) components is pre-treated with a hydrophobic coating to reduce depletion of a copper corrosion inhibitor (e.g., benzotriazole (BTA)) dissolved in a liquid coolant (e.g., deionized water) that flows through the hose. Exemplary hydrophobic coatings include, but are not limited to, polydialkylsiloxanes such as polydimethylsiloxanes. In one embodiment, a multilayer hose is immersed in a solution containing hydrophobizing siloxane monomers dissolved in a solvent. The coated multilayer hose is then dried to evaporate the solvent. As the solvent evaporates, the siloxane monomers bind together to form the hydrophobic coating. In some embodiments, one or more hoses each provided with a hydrophobic coating interconnect liquid-coolant cooling system components (e.g., cold plates, headers, manifolds, pumps, reservoirs, and heat exchangers) of a cooling apparatus that removes heat from one or more electronic components.

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Номер записи: 99
01-08-2019 дата публикации

PRE-TREATING POLYMER TUBING OR HOSE WITH A HYDROPHOBIC COATING TO REDUCE DEPLETION OF CORROSION INHIBITOR

Номер: US20190232336A1
Автор: Buvid Daniel J., Campbell Eric J., JANDT Tyler, Kuczynski Joseph
Принадлежит:

An inside surface of a hose for use with liquid-cooled cooling plate assemblies and other applications that contain copper (Cu) components is pre-treated with a hydrophobic coating to reduce depletion of a copper corrosion inhibitor (e.g., benzotriazole (BTA)) dissolved in a liquid coolant (e.g., deionized water) that flows through the hose. Exemplary hydrophobic coatings include, but are not limited to, polydialkylsiloxanes such as polydimethylsiloxanes. In one embodiment, a multilayer hose is immersed in a solution containing hydrophobizing siloxane monomers dissolved in a solvent. The coated multilayer hose is then dried to evaporate the solvent. As the solvent evaporates, the siloxane monomers bind together to form the hydrophobic coating. In some embodiments, one or more hoses each provided with a hydrophobic coating interconnect liquid-coolant cooling system components (e.g., cold plates, headers, manifolds, pumps, reservoirs, and heat exchangers) of a cooling apparatus that removes heat from one or more electronic components. 1. A method of fabricating a hydrophobic material coated hose for interconnecting components of a liquid-coolant cooling system having a corrosion inhibitor dissolved in a liquid coolant , comprising the steps of:providing a hose;immersing the hose in a hydrophobic coating solution containing a hydrophobizing siloxane monomer or a fluoropolymer dissolved in a solvent to coat the hose with the solution;drying the hose coated with the solution to evaporate the solvent and form a hydrophobic coating on an inside surface of the hose, wherein the hydrophobic coating reduces depletion of the corrosion inhibitor dissolved in the liquid coolant.2. The method as recited in claim 1 , wherein the hydrophobic coating solution includes a polydialkylsiloxane as the hydrophobizing siloxane monomer.3. The method as recited in claim 2 , wherein the polydialkylsiloxane is a hydroxyl-terminated polydimethylsiloxane (PDMS).4. The method as recited in claim ...

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Номер записи: 100