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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Применить Всего найдено 5. Отображено 5.
11-07-2023 дата публикации

Chamber of chemical vapor deposition equipment

Номер: CN116411256A
Автор: ZHANG HAILONG, JIANG YONG, CONG HAI, XU AUSTIN
Принадлежит:

The invention discloses a chamber of a chemical vapor deposition device. The chamber comprises a tray arranged in the chamber and used for carrying a substrate, an upper chamber cover arranged above the tray, a lower chamber cover arranged below the tray and an intermediate base ring serving as a connecting part between the upper chamber cover and the lower chamber cover. The middle base ring comprises a first flange, a second flange and an annular part which are oppositely arranged in the longitudinal direction, the upper cavity cover is away from the tray and hunches up in the transverse direction and the longitudinal direction, and the length of the upper cavity cover in the longitudinal direction is larger than that of the upper cavity cover in the transverse direction. The device has the advantages that the device is convenient to mount and dismount, the mounting and maintenance cost is reduced, a large amount of disordered turbulent flow generated when airflow flows into an arched ...

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Номер записи: 1
13-04-2021 дата публикации

Buckling pipe expander

Номер: CN212945049U
Автор: ZHONG SHENG, ZHAO HANYU, CONG HAI, 仲声, 赵晗瑜, 丛海
Принадлежит: LONGKOU TONGDA OIL PIPE CO LTD, LONGKOU TONGDA OIL PIPE CO., LTD., 龙口市通达油管有限公司

The utility model relates to a withholding pipe expander, which belongs to the technical field of withholding pipe expanders and comprises a circular withholding cover plate fixedly mounted on a fixed table, a plurality of withholding inserts which are detachably connected and a plurality of movably connected pipe expanding inserts are sequentially arranged in the withholding cover plate, and movably connected mandrels are arranged in the pipe expanding inserts. The lower end of the mandrel is provided with a cylinder or motor. The pipe expanding machine is buckled and pressed to replace a traditional stamping mode, the pipe expanding work of the pipeline can be directly and automatically achieved, the working efficiency is high, the practicability and the adaptability are good, the radian of the bent pipeline can be treated, and operation is easy, fast and convenient; the pipe expanding work can be performed on pipelines with different pipe diameters through the replacement of the detachably ...

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Номер записи: 2
11-07-2023 дата публикации

Chemical vapor deposition device and method thereof

Номер: CN116411265A
Автор: YIN ZHIYAO, ZHANG HAILONG, PANG YUNLING, CONG HAI
Принадлежит:

The invention discloses a chemical vapor deposition device and method, and the device comprises a reaction chamber which is provided with a gas inlet opening and a gas outlet opening, and is internally provided with a tray for bearing a substrate; the outer shell is arranged on the outer side of the reaction chamber, and a containing space is formed between the inner wall of the outer shell and the outer wall of the reaction chamber; the plurality of radiation heat sources are arranged in the accommodating space and are used for heating the substrate through the outer wall of the reaction chamber; and the air pressure adjusting device is used for independently adjusting and controlling the air pressure in the accommodating space and the reaction chamber. The device has the advantages that the air pressure of the accommodating space of the device is smaller than the atmospheric pressure, so that the pressure bearing pressure of the cavity wall of the reaction chamber is reduced, the heat ...

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Номер записи: 3
02-05-2023 дата публикации

Temperature calibration and control method of chemical vapor deposition device

Номер: CN116046214A
Автор: YAN TAO, CHEN ENYI, CONG HAI
Принадлежит:

The invention discloses a temperature calibration and control method of a chemical vapor deposition device. The device comprises a wafer bearing table, a first temperature sensor for measuring the temperature of the wafer bearing table, and a heater for heating the device, the calibration method comprises the following steps: placing a simulated wafer provided with a standard contact type temperature sensor on a wafer bearing table; starting a heater to raise the temperature of the device; recording the change of the reading of the standard contact type temperature sensor along with time as a standard temperature change value; recording the change of the reading of the first temperature sensor along with time as a temperature change value of the wafer bearing table; and correspondingly correcting the temperature change value of the wafer bearing table into a standard temperature change value according to time. The wafer temperature measurement device has the advantages that the temperature ...

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Номер записи: 4
07-07-2023 дата публикации

Thin film processing device

Номер: CN116397214A
Автор: PANG YUNLING, YIN ZHIYAO, JIANG YONG, CONG HAI
Принадлежит:

The invention discloses a thin film processing device. The thin film processing device comprises an air inlet partition plate and an air outlet partition plate, wherein the air inlet partition plate and the air outlet partition plate divide a lengthwise reaction chamber into a reaction space and a wafer conveying space; an air inlet area is arranged above the air inlet partition plate, an exhaust area is arranged above the exhaust partition plate, and a wafer processing area between the air inlet area and the exhaust area is used for accommodating a substrate for bearing a wafer so as to carry out a thin film deposition process; the base can descend to the wafer conveying space from the wafer processing area, so that the wafer on the base can be conveyed to the outer space of the reaction chamber by the mechanical arm; the air inlet flange assembly comprises a plurality of air inlet nozzles; and the gas flow guide assembly comprises flow guide pipelines, the flow guide pipelines are arranged ...

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Номер записи: 5